<?xml version="1.0" encoding="utf-8"?>
<tw-patent-applications total-count="2679">
  <tw-patent-application no="1" publication-number="202616953">
    <tif-files tif-type="multi-tif">
      <tif file="113122231.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113122231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可促進抗生物污染沾黏並預防病毒污染之超排斥性雙重入拓樸（ＤＲＴ）表面</chinese-title>
        <english-title>SUPERREPELLENT DOUBLY REENTRANT TOPOLOGY (DRT) SURFACE FOR PROMOTING ANTIBIOFOULING AND PREVENTION OF VIRUS CONTAMINATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A01N25/34</main-classification>
        <further-classification edition="200601120260202B">A01N59/20</further-classification>
        <further-classification edition="200601120260202B">A01P1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北榮民總醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI VETERANS GENERAL HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊逸萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱士華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">雙重入拓樸（doubly reentrant topology，DRT）是一種獨特的結構。本發明首先驗證了一種包含一超疏水表面的抗生物污染沾黏人造表面的優異性能；其上有多個微結構，且具有位於相應基底結構頂部的雙重入拓撲（DRT），其展現出顯著的抗生物污染沾黏作用，可防止病毒污染。此外，本發明本身具有優異的抗生物污染沾黏能力，這可能為消除病原體在減輕COVID-19大流行中的應用帶來啟示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Doubly reentrant topology (DRT) is a unique structure. The present invention first validated the outstanding performance of an anti-biofouling artificial surface comprising a superhydrophobic surface; thereon a plurality of microstructures and having a doubly re-entrant topology (DRT) situated atop respective base structures which demonstrates a striking anti-biofouling effect that can prevent viral contamination. Furthermore, the present invention per se features excellent anti-biofouling ability, which may shed light on the applications of pathogen elimination in alleviating the COVID-19 pandemic.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2" publication-number="202618420">
    <tif-files tif-type="multi-tif">
      <tif file="113139053.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">G02F1/1335</main-classification>
        <further-classification edition="200601120241028B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡傳枝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHUAN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許美琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MEI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，包含：一反射式面板，包含：一第一膽固醇液晶，用以反射一第一顏色光；以及一第一濾光層，設置於該第一膽固醇液晶下，其中該第一濾光層包含一第一開口；以及一光學感測元件，設置於該反射式面板下；其中，於一俯視方向上，該光學感測元件與該第一濾光層的該第一開口重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided, which comprises: a reflective panel comprising: a first cholesterol liquid crystal for reflecting a first color light; and a first filter layer disposed under the first cholesterol liquid crystal, wherein the first filter layer comprises a first opening; and an optical sensing element disposed under the reflective panel; wherein on a top view direction, the optical sensing element overlaps the first opening of the first filter layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一面板</p>
        <p type="p">14:第一膽固醇液晶</p>
        <p type="p">2:第二面板</p>
        <p type="p">24:第二膽固醇液晶</p>
        <p type="p">3:第三面板</p>
        <p type="p">34:第三膽固醇液晶</p>
        <p type="p">4:導光板</p>
        <p type="p">4s1:出光面</p>
        <p type="p">41:微結構</p>
        <p type="p">5:光源</p>
        <p type="p">BL:光吸收層</p>
        <p type="p">CF1:第一濾光層</p>
        <p type="p">CF2:第二濾光層</p>
        <p type="p">H1、H1’:第一開口</p>
        <p type="p">H2、H2’:第二開口</p>
        <p type="p">H3、H3’:第三開口</p>
        <p type="p">R1:光學感測元件區</p>
        <p type="p">RP:反射式面板</p>
        <p type="p">S、S1、S2:光學感測元件</p>
        <p type="p">W1、W2、W3、W4、W1’、W2’、W3’、W4’:寬度</p>
        <p type="p">X、Y:方向</p>
        <p type="p">Z:俯視方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="3" publication-number="202618821">
    <tif-files tif-type="multi-tif">
      <tif file="113139062.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容器素子結構、電容器組件封裝結構以及電子裝置</chinese-title>
        <english-title>CAPACITOR ELEMENT STRUCTURE, CAPACITOR ASSEMBLY PACKAGE STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120241104B">H01G11/80</main-classification>
        <further-classification edition="201301120241104B">H01G11/58</further-classification>
        <further-classification edition="201301120241104B">H01G11/64</further-classification>
        <further-classification edition="201301120241104B">H01G11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APAQ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭敦仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DUEN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電容器素子結構、電容器組件封裝結構以及電子裝置。電容器組件封裝結構包括一電容器組件、一絕緣封裝體以及一電極組件。電容器組件包括依序堆疊設置且彼此電性連接的多個電容器素子結構。絕緣封裝體被配置以用於包覆多個電容器素子結構。電極組件包括一第一電極結構以及一第二電極結構。第一電極結構被配置以與絕緣封裝體相互配合且電性連接於電容器素子結構的正極部。第二電極結構被配置以與絕緣封裝體相互配合且電性連接於電容器素子結構的負極部。每一個電容器素子結構至少包括有一氧化層，氧化層具有呈現不規則凹陷變化且不規則排列的多個微凹陷空間，且每一個微凹陷空間內部分填充有一電解液物質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a capacitor element structure, a capacitor assembly package structure and an electronic device. The capacitor assembly package structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor element structures that are stacked in sequence and electrically connected to each other. The insulating package body is configured to enclose the plurality of capacitor element structures. The electrode assembly includes a first electrode structure and a second electrode structure. The first electrode structure is configured to cooperate with the insulating package body and to be electrically connected to a positive electrode portion of the capacitor element structure. The second electrode structure is configured to cooperate with the insulating package body and to be electrically connected to a negative electrode portion of the capacitor element structure. Each capacitor element structure includes at least an oxide layer. The oxide layer has a plurality of micro-depression spaces that are irregularly varied and arranged irregularly, and each micro-depression space is partially filled with an electrolyte substance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:金屬箔片</p>
        <p type="p">1000:氧化層</p>
        <p type="p">1000R:微凹陷空間</p>
        <p type="p">L:電解液物質</p>
        <p type="p">102:導電高分子層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="4" publication-number="202619593">
    <tif-files tif-type="multi-tif">
      <tif file="113139063.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光元件</chinese-title>
        <english-title>LIGHT EMITTING ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/83</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡振偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, JAN-WAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光元件，其包含透光層、第一發光單元、第二發光單元、吸光層以及共電極。第一發光單元位於透光層上且包含第一發光層及第一電極。第一發光層位於透光層及第一電極之間。第一電極具有遠離透光層的最上表面。第二發光單元位於透光層上。吸光層位於第一發光單元及第二發光單元之間，且具有第一下表面及第一上表面，第一下表面較第一上表面靠近透光層。共電極位於透光層上且電性連接第一發光單元及第二發光單元。其中，在垂直最上表面的方向上，第一下表面位於透光層與第一發光層之間，第一上表面位於第一下表面與最上表面之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting element includes a light-transmitting layer, a first light-emitting unit, a second light-emitting unit, a light-absorbing layer, and a common electrode. The first light-emitting unit is located on the light-transmitting layer and includes a first light-emitting layer and a first electrode. The first light-emitting layer is located between the light-transmitting layer and the first electrode. The first electrode has a top surface away from the light-transmitting layer. The second light-emitting unit is located on the light-transmitting layer. The light-absorbing layer is located between the first light-emitting unit and the second light-emitting unit. The light-absorbing layer has a first lower surface and a first upper surface, wherein the first lower surface is closer to the light-transmitting layer than the first upper surface. The common electrode is located on the light-transmitting layer and is electrically connected to the first light-emitting unit and the second light-emitting unit. Along a direction perpendicular to the top surface, the first lower surface is located between the light-transmitting layer and the first light-emitting layer, and the first upper surface is located between the first surface and the top surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發光元件</p>
        <p type="p">11:透光層</p>
        <p type="p">110:透光層本體</p>
        <p type="p">12:發光單元組</p>
        <p type="p">120:第一發光單元</p>
        <p type="p">121:第一發光層</p>
        <p type="p">122:第一電極</p>
        <p type="p">123:第二發光單元</p>
        <p type="p">124:第二發光層</p>
        <p type="p">125:第二電極</p>
        <p type="p">14:吸光層</p>
        <p type="p">141:第一吸光層</p>
        <p type="p">B-B’:剖面線</p>
        <p type="p">H1:第一厚度</p>
        <p type="p">P0:表面</p>
        <p type="p">P1:第一下表面</p>
        <p type="p">P2:第一上表面</p>
        <p type="p">P3:第三表面(最上表面)</p>
        <p type="p">P4:第四表面(最上表面)</p>
        <p type="p">S1:第一區域</p>
        <p type="p">S6:第六區域</p>
        <p type="p">S7:第七區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="5" publication-number="202619511">
    <tif-files tif-type="multi-tif">
      <tif file="113139064.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙極性接面電晶體</chinese-title>
        <english-title>BIPOLAR JUNCTION TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250109B">H10D10/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙極性接面電晶體，包含一射極區、一基極區、一集極區以及一隔離結構。基極區相鄰設置於射極區的一第一側邊，集極區相鄰設置於射極區的一第二側邊，隔離結構設置於射極區與基極區之間以及射極區與集極區之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bipolar junction transistor includes an emitter region, a base region, a collector region and an isolation structure. The base region is disposed adjacent to a first side of the emitter region. The collector region is disposed adjacent to a second side of the emitter region. The isolation structure is disposed between the emitter region and each of the base region and the collector region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙極性接面電晶體</p>
        <p type="p">12:射極區</p>
        <p type="p">14,16:基極區</p>
        <p type="p">18:集極區</p>
        <p type="p">22:隔離結構</p>
        <p type="p">121,122,123,124:側邊</p>
        <p type="p">141,142,143,144:側邊</p>
        <p type="p">161,162,163,164:側邊</p>
        <p type="p">181,182,183,184:側邊</p>
        <p type="p">A,A',B,B':方向</p>
        <p type="p">D1,D2:水平方向</p>
        <p type="p">D3:垂直方向</p>
        <p type="p">L1,L2,L3,L4,L5,L6,L7,L8:長度</p>
        <p type="p">SD1,SD2,SD3:最短距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="6" publication-number="202617334">
    <tif-files tif-type="multi-tif">
      <tif file="113139079.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體幕保護裝置</chinese-title>
        <english-title>FLUID CURTAIN PROTECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B23Q11/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德川機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DETRON MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張健順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEN SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種流體幕保護裝置，該流體幕保護裝置定義一軸心，該軸心具有一第一端及相對該第一端的一第二端，該流體幕保護裝置包含一定子部及一轉子部，該轉子部沿著該軸心可旋轉的組設於該定子部，且於彼此對向之該定子部的一定子周壁與該轉子部的一轉子周壁之間成型一流體路徑，該流體路徑包含一螺旋溝槽及一環狀溝槽，該螺旋溝槽螺旋狀連接該環狀溝槽，該流體路徑可供導入一流體，讓該流體沿該螺旋溝槽流動後進入該環狀溝槽，再從該環狀溝槽經由該定子周壁與該轉子周壁之間流出而生成一流體幕。藉此，有效阻絕外部異物滲入間隙，避免內部元件之間發生磨損。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fluid curtain protection device. The fluid curtain protection device defines an axis. The axis has a first end and a second end opposite to the first end. The fluid curtain protection device comprises a stator part and a rotor part. The rotor part is rotatably disposed on the stator part along the axis, and a fluid path is formed between a stator peripheral wall of the stator part and a rotor peripheral wall of the rotor part that are opposite to each other. The fluid path comprises a spiral groove and an annular groove, and the spiral groove is spirally connected to the annular groove. Thereby, effectively blocking foreign matter from entering a gap and avoiding wear between components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:流體幕保護裝置</p>
        <p type="p">10A:軸心</p>
        <p type="p">10A1:第一端</p>
        <p type="p">10A2:第二端</p>
        <p type="p">20:定子部</p>
        <p type="p">40:轉子部</p>
        <p type="p">60:流體路徑</p>
        <p type="p">61:螺旋溝槽</p>
        <p type="p">62:環狀溝槽</p>
        <p type="p">70:進氣路徑</p>
        <p type="p">71A:進氣接頭</p>
        <p type="p">72:進氣出口</p>
        <p type="p">G:流體幕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="7" publication-number="202619474">
    <tif-files tif-type="multi-tif">
      <tif file="113139087.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241101B">H10B12/00</main-classification>
        <further-classification edition="202301120241101B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, SHIN HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體裝置及其形成方法。所述半導體裝置包括字元線結構、位元線結構、電容器接觸件以及電容器陣列。字元線結構設置在基底中。位元線結構設置在基底上。電容器接觸件設置在基底上且鄰近位元線結構。電容器陣列設置在電容器接觸件上且包括多個電容器組。各電容器組包括第一電容結構以及排列成環繞第一電容結構的多個第二電容結構，其中第一電容結構包括環繞第一電容結構的下電極的環形支撐結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and a method for forming the semiconductor device are provided. The semiconductor device includes word line structures disposed in a substrate, bit line structures disposed on the substrate, capacitor contacts disposed on the substrate and adjacent to the bit line structures, and a capacitor array disposed on the capacitor contacts and including capacitor sets. Each of the capacitor sets includes a first capacitor structure and second capacitor structures arranged to surround the first capacitor, wherein the first capacitor structure includes an annular support structure surrounding a lower electrode of the first capacitor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">124:下電極</p>
        <p type="p">COP:電容器開口</p>
        <p type="p">CS1:第一電容結構</p>
        <p type="p">CS2:第二電容結構</p>
        <p type="p">D1、D2、D3:方向</p>
        <p type="p">NL1:蝕刻停止層</p>
        <p type="p">NL41:第三支撐層</p>
        <p type="p">SS1:環形支撐結構</p>
        <p type="p">SS2:弧形支撐結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="8" publication-number="202619426">
    <tif-files tif-type="multi-tif">
      <tif file="113139088.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241210B">H05K3/00</main-classification>
        <further-classification edition="200601120241210B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣興電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, GUAN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳瑞北</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, RUEY-BEEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUN-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電路板結構包括基板、第一同軸導通孔、第二同軸導通孔以及多個接地通孔。基板具有第一表面及相對於第一表面的第二表面。第一同軸導通孔和第二同軸導通孔設置於基板中，其中第一同軸導通孔的阻抗和第二同軸導通孔的阻抗分別小於50歐姆。多個接地通孔圍繞第一同軸導通孔及第二同軸導通孔設置。第一同軸導通孔和第二同軸導通孔被配置為傳輸頻率在50 GHz至68 GHz的範圍內的訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure includes a substrate, a first coaxial conductive via, a second coaxial conductive via and ground vias. The substrate has a first surface and a second surface opposite to the first surface. The first coaxial conductive via and the second coaxial conductive via are disposed in the substrate. An impedance of the first coaxial conductive via and an impedance of the second coaxial conductive via are less than 50 ohm respectively. The ground vias surround the first coaxial conductive via and the second coaxial conductive via. The first coaxial conductive via and the second coaxial conductive via are configured to transfer a signal with a frequency in a range between 50 GHz and 68 GHz.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電路板結構</p>
        <p type="p">136:第二絕緣層</p>
        <p type="p">154:第二導通孔</p>
        <p type="p">160a:第一頂部線路層</p>
        <p type="p">160a1:接墊部分</p>
        <p type="p">160a2:第一線路部分</p>
        <p type="p">160a3:第二線路部分</p>
        <p type="p">162a:第二頂部線路層</p>
        <p type="p">164a:第三頂部線路層</p>
        <p type="p">A-A’:線</p>
        <p type="p">C1,C2:圓</p>
        <p type="p">CV1:第一同軸導通孔</p>
        <p type="p">CV2:第二同軸導通孔</p>
        <p type="p">D3:距離</p>
        <p type="p">GV,GV1,GV2,GV’:接地通孔</p>
        <p type="p">L:長度</p>
        <p type="p">R1,R2:半徑</p>
        <p type="p">W1,W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="9" publication-number="202618766">
    <tif-files tif-type="multi-tif">
      <tif file="113139091.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及記憶體操作方法</chinese-title>
        <english-title>MEMORY DEVICE AND MEMORY OPERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">G11C7/06</main-classification>
        <further-classification edition="200601120250107B">G11C7/12</further-classification>
        <further-classification edition="200601120250107B">G11C8/10</further-classification>
        <further-classification edition="200601120250107B">G11C11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體操作方法，包含：透過處理電路，取得向量矩陣運算的複數個運算資料，其中處理電路耦接於記憶體陣列，記憶體陣列包含複數個記憶區塊；計算該些記憶區塊中用以儲存該些運算資料所需的區塊數量；根據區塊數量，分配該些記憶區塊中的M個記憶區塊；以及將該些運算資料提供至M個記憶區塊，以使記憶體陣列根據該些運算資料及M個記憶區塊中設定的複數個權重值輸出輸出電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory operation method, including: obtaining a plurality of operation data of a vector-matrix multiplication by a processing circuit, wherein the processing circuit is coupled to a memory array, and the memory array includes a plurality of memory blocks; calculating a block number in the plurality of memory blocks required to store the plurality of operation data; allocating M memory blocks in the plurality of memory blocks according to the block number; and providing the plurality of operation data to the M memory blocks, so that the memory array outputs an output current according to the plurality of operation data and a plurality of weight values set in the M memory blocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301-S306:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="10" publication-number="202618551">
    <tif-files tif-type="multi-tif">
      <tif file="113139094.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資源分配方法及系統</chinese-title>
        <english-title>RESOURCE ALLOCATION METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F9/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技鋼科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃添壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TIEN-SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王紹宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHAO YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資源分配方法及系統。資源分配方法包括：根據輸入指令所包含的指定工作的類型從多筆候選資源需求中判斷目標資源需求，於當前可用硬體資源不滿足目標資源需求且既存工作的優先等級低於指定工作時，根據既存工作的已佔用硬體資源與當前可用硬體資源取得可用總硬體資源，將可用總硬體資源中滿足目標資源需求的目標資源分配給指定工作，以及當可用總硬體資源的剩餘硬體資源不滿足既存工作的資源需求時，從剩餘硬體資源中分別分配第一資源給第一既存工作及高於第一資源的第二資源給優先等級高於第一既存工作的第二既存工作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure proposes a resource allocation method and system. The resource allocation method includes: determining a target resource requirement from candidate resource requirements according to a type of a designated job included in an input command, obtaining total available hardware resource according to occupied hardware resource of existing jobs and current available hardware resource when the current available hardware resource does not satisfy the target resource requirement and priorities of the existing jobs are lower than a priority of the designated job, allocating target resource satisfying the target resource requirement from the total available hardware resource to the designated job, and allocating first resource to a first existing job and second resource to a second existing job, respectively, when remaining resource of the total available hardware resource does not satisfy resource requirements of the existing jobs, wherein the first resource is lower than the second resource, and a priority of the first existing job is lower than a priority of the second existing job.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S103,S105,S107:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="11" publication-number="202618073">
    <tif-files tif-type="multi-tif">
      <tif file="113139098.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於具有不同內徑工件之電化學反應輔具</chinese-title>
        <english-title>ELECTROCHEMICAL REACTION ACCESSORY APPLICABLE TO WORKPIECES WITH DIFFERENT INTERNAL DIAMETERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">C25D11/02</main-classification>
        <further-classification edition="200601120250512B">C25D21/10</further-classification>
        <further-classification edition="200601120250512B">C25D5/08</further-classification>
        <further-classification edition="200601120250512B">B23H3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢翔航空工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AEROSPACE INDUSTRIAL DEVELOPMENT CORPORTAION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁揮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEN-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鼎智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳連賀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIEN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王靖驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧奕丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, I-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種應用於具有不同內徑工件之電化學反應輔具，供以置放於一工件內，而應用於具有不同內徑工件之電化學反應輔具，包括：銜接之螺旋管及直線管，螺旋管及直線管供以輸送電解液；螺旋管為螺旋狀之管體，螺旋管具有複數第一穿孔，第一穿孔供以讓電解液噴出，螺旋管具有外徑； 直線管，具有複數第二穿孔，第二穿孔供以讓電解液噴出，直線管具有管徑，直線管之管徑小於螺旋管之外徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrochemical reaction accessory applicable to workpieces with different internal diameters, which is placed in a workpiece and includes a spiral tube and a straight tube connected to the spiral tube, the spiral tube and the straight tube are used to deliver electrolyte, the spiral tube is spiral-shaped and is defined with a plurality of first through holes to let the electrolyte ejected, the spiral tube has an outer diameter, the straight tube is defined with a plurality of second through holes to let the electrolyte ejected, the straight pipe has a diameter that is smaller than the outer diameter of the spiral pipe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:頂端</p>
        <p type="p">13:第一穿孔</p>
        <p type="p">14:內空間</p>
        <p type="p">15:底端出口</p>
        <p type="p">16:橫向管</p>
        <p type="p">20:直線管</p>
        <p type="p">21:第二穿孔</p>
        <p type="p">22:環壁</p>
        <p type="p">40:工件</p>
        <p type="p">41:第一容槽</p>
        <p type="p">411:第一內壁</p>
        <p type="p">42:第二容槽</p>
        <p type="p">421:第二內壁</p>
        <p type="p">D1:上方向</p>
        <p type="p">D2:下方向</p>
        <p type="p">D3:內方向</p>
        <p type="p">D4:外方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="12" publication-number="202617340">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量測裝置及使用量測裝置的工具機誤差校正方法</chinese-title>
        <english-title>MEASURING DEVICE AND ERROR CALIBRATION METHOD FOR MACHINE TOOL USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">B23Q15/12</main-classification>
        <further-classification edition="200601120250123B">B23Q15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張信常</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鳴吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIH-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種量測裝置，其中量測裝置包含殼體、活動件、校正球以及感測開關。活動件可活動地設置於殼體上。校正球設置於活動件的一端並凸出於殼體之外。感測開關設置於殼體中並用以感測活動件相對殼體的活動；此外，一種使用量測裝置的工具機誤差校正方法亦被揭露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A measuring device, which the measuring device includes a casing, a movable component, a calibration ball and a sensor switch. The movable component is movably disposed on the casing. The calibration ball is disposed on an end of the movable component and extends out of the casing. The sensor switch is mounted inside the casing and configured to sense the movement of the movable component. Additionally, an error calibration method for machine tools using the measuring device is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:誤差校正系統</p>
        <p type="p">100:量測裝置</p>
        <p type="p">110:殼體</p>
        <p type="p">111:內部空間</p>
        <p type="p">112:開口</p>
        <p type="p">120:活動件</p>
        <p type="p">130:校正球</p>
        <p type="p">140:磁鐵</p>
        <p type="p">150:感測開關</p>
        <p type="p">160:訊號輸出埠</p>
        <p type="p">170:發光元件</p>
        <p type="p">200:計算單元</p>
        <p type="p">300:控制器</p>
        <p type="p">20:工具機</p>
        <p type="p">21:第一旋轉件</p>
        <p type="p">22:主軸</p>
        <p type="p">220:鼻端</p>
        <p type="p">23:旋轉刀盤</p>
        <p type="p">24:第二旋轉件</p>
        <p type="p">30:LRT感測頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="13" publication-number="202617123">
    <tif-files tif-type="multi-tif">
      <tif file="113139115.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣泡水療系統</chinese-title>
        <english-title>AIR BUBBLE MASSAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">A61H23/04</main-classification>
        <further-classification edition="200601120250102B">A61H33/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳采瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSAI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳采瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSAI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許郁莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">氣泡水療系統，包括：墊套、氣體通道件，管件組及控制閥件，墊套的底層與頂層構成容置空間，且為具有網格的網布；氣體通道件具有閥件連接端、氣體通道及氣體通孔，氣體通道的一端與閥件連接端連接，另一端與氣體通孔連接；管件組與氣體通道件連接且設於墊套的容置空間，管件組具有軟管，軟管的管壁有出氣孔；及控制閥件有調控件，控制閥件的一端與閥件連接端連接，另一端由氣體輸送管件與空氣供應設備連接，調控件控制空氣進入軟管，由管壁的出氣孔產生第一氣泡，頂層的網格將第一氣泡切割成第二氣泡，第一氣泡的尺寸大於第二氣泡的尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An air bubble massage system includes a mat, a gas channel piece, a pipe fitting set, and a control valve, a bottom layer and a top layer of the mat are connected to form an accommodation space, and the top and bottom layers are mesh fabrics with grids respectively; the gas channel piece has a valve connecting end, a gas channel and a gas through hole, one end of the gas channel is connected to the valve connecting end, and other end is connected to the gas through hole; a pipe fitting set is connected to the gas channel piece and is arranged in the accommodation space of the mat, the pipe fitting set has a plurality of flexible tube, and the pipe wall of each flexible pipe is provided with air outlet, and the air outlet hole is arranged under the top layer of the mat; and the control valve has a regulator, one end of the control valve is connected to the valve connecting end, another end pf the control valve is connected to air supply through the gas delivery pipe. The regulator controls the air delivered by the air supply to enter the flexible tube and gas through holes, and generates the first bubble through the air outlet hole of the wall of the flexible tube, and the first bubble is cut into a second bubble through the grid of the top layer of the mat, wherein the size of the first bubble is larger than the size of the second bubble.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:墊套</p>
        <p type="p">10T:頂層</p>
        <p type="p">10B:底層</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:氣體通道件</p>
        <p type="p">13:開口</p>
        <p type="p">14:氣體通道</p>
        <p type="p">15:閥件連接端</p>
        <p type="p">16:控制閥件</p>
        <p type="p">17:吸盤</p>
        <p type="p">18:氣體通孔</p>
        <p type="p">20:管件組</p>
        <p type="p">21:出氣孔</p>
        <p type="p">22:空氣供應設備</p>
        <p type="p">24:氣體輸送管件</p>
        <p type="p">102A、102B、102C、102D:網布</p>
        <p type="p">142:內側氣體通道</p>
        <p type="p">144:中間氣體通道</p>
        <p type="p">146:外側氣體通道</p>
        <p type="p">162:調控件</p>
        <p type="p">182:內側氣體通孔</p>
        <p type="p">184:中間氣體通孔</p>
        <p type="p">186:外側氣體通孔</p>
        <p type="p">202:內側軟管</p>
        <p type="p">204:中間軟管</p>
        <p type="p">206:外側軟管</p>
        <p type="p">222:空氣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="14" publication-number="202619300">
    <tif-files tif-type="multi-tif">
      <tif file="113139116.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139116</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數位類比轉換系統以及數位類比轉換方法</chinese-title>
        <english-title>DIGITAL TO ANALOG CONVERSION SYSTEM AND DIGITAL TO ANALOG CONVERSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">H03M1/66</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂奎穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUEI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃亮維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鈺婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數位類比轉換系統，包含：一儲存裝置，用以儲存一第一控制碼轉換表；一控制碼轉換電路，用以根據該第一控制碼轉換表將一第一N位元控制碼轉換成一第一Y位元控制碼，Y大於或等於N；一DAC，用以接收該第一Y位元控制碼而輸出複數個DAC輸出電壓其中之一第一DAC輸出電壓，該些DAC輸出電壓的數目小於或等於        &lt;img align="absmiddle" height="27px" width="23px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；以及一控制電路，對應該DAC的一狀態的變化而產生一第二控制碼轉換表，並將該儲存裝置中的該第一控制碼轉換表更新為該第二控制碼轉換表。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital-to-analog conversion system comprises: a storage device for storing a first control code conversion table; a control code conversion circuit for converting a first N-bit control code according to the first control code conversion table into a first Y-bit control code, Y is greater than or equal to N; a DAC for receiving the first Y-bit control code to output a first DAC output voltage of a plurality of DAC output voltages, wherein a number the DAC output voltages is less than or equal to        &lt;img align="absmiddle" height="27px" width="23px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;; and a control circuit, corresponding to a change in a state of the DAC, generates a second control code conversion table, and updates the first control code conversion table in the storage device to the second control code conversion table.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">800:數位類比轉換系統</p>
        <p type="p">801:儲存裝置</p>
        <p type="p">803:控制電路</p>
        <p type="p">805:監控電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="15" publication-number="202618223">
    <tif-files tif-type="multi-tif">
      <tif file="113139123.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>指引方法及指引裝置</chinese-title>
        <english-title>GUIDANCE METHOD AND GUIDANCE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01C21/34</main-classification>
        <further-classification edition="201201120241104B">B60W40/072</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓卿安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝筑媗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, ZHU-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種指引方法及指引裝置。取得影像及速度，其中影像對應於在載具的行進方向的視野，且速度為載具的移動速度。辨識影像中的道路區塊，其中道路區塊為對應於道路的影像區塊。依據速度將道路區塊對應的車道曲率轉換成曲率因數，其中車道曲率對應於道路區塊的彎曲程度。依據曲率因數產生指引圖形。呈現指引圖形。藉此，可提供直覺的指示，並提升駕駛安全。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A guidance method and guidance device. The image and speed are obtained, where the image corresponds to the field of view in the direction of travel of the vehicle, and the speed is the moving speed of the vehicle. Road block is identified in the image, where the road block is an image block corresponding to road. The lane curvature corresponding to the road block is converted into a curvature factor according to the speed, where the lane curvature corresponds to the curvature of the road block. Guidance graphic is generated based on curvature factors. Guidance graphic is presented. Therefore, intuitive instruction is provided, and driving safety is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">172:指引圖形</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="16" publication-number="202617343">
    <tif-files tif-type="multi-tif">
      <tif file="113139128.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電鑄金屬網版研磨裝置及其研磨方法</chinese-title>
        <english-title>ELECTROFORMED METAL STENCIL GRINDING DEVICE AND GRINDING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B24B7/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國巨股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGEO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾望修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WANG-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏旺淨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, WANG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WENG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電鑄金屬網版研磨裝置，包含：一固定平台，用以放置一網版且與網版之一非研磨區下表面接觸；一升降平台，用以放置網版且與網版之一研磨區下表面接觸；一研磨機固定架，用以固定使研磨機之一研磨面接觸網版之一研磨區上表面；以及一移動架，與研磨機固定架連接，使研磨機固定架隨著移動架以任意方向移動以對研磨區上表面進行研磨處理；並且當研磨處理完成，升降平台下降而與研磨區下表面分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electroformed metal stencil grinding device, including a fixed platform, used for placing a stencil and contacting to a lower surface of non-grinding area of the stencil; a lifting platform, used for placing the stencil and contacting to a lower surface of grinding area of the stencil; a grinder holder, used to holding a grinder to contact to an upper surface of grinding area of the stencil with a grinding surface of the grinder; and a mobile stand, connecting to the grinder holder, and used for enabling the grinder holder to move following to the mobile stand in any direction to perform a grinding process on the upper surface of grinding area, when the grinding process completes, the lifting platform descends and separates from the lower surface of grinding area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電鑄金屬網版研磨裝置</p>
        <p type="p">110:固定平台</p>
        <p type="p">111:網版固定單元</p>
        <p type="p">120:研磨機固定架</p>
        <p type="p">130:移動架</p>
        <p type="p">140:研磨機</p>
        <p type="p">M1~M4:支架</p>
        <p type="p">S:網版</p>
        <p type="p">SG:研磨區</p>
        <p type="p">SN:非研磨區</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="17" publication-number="202618702">
    <tif-files tif-type="multi-tif">
      <tif file="113139135.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>負曲率結構之特徵辨識系統及其方法</chinese-title>
        <english-title>SUBSTRATE INSPECTION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241030B">G06V10/40</main-classification>
        <further-classification edition="202201120241030B">G06V10/70</further-classification>
        <further-classification edition="200601120241030B">H01L21/66</further-classification>
        <further-classification edition="200601120241030B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>由田新技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTECHZONE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒嘉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岳龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUEH-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹語晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, YU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於負曲率結構之之特徵辨識系統，包括載台、側光源裝置、影像擷取裝置以及影像辨識裝置。載台用於設置工件。側光源裝置於工件的正面或背面的任一方向側，提供側光至工件，藉以凸顯工件上的負曲率結構的影像特徵。影像擷取裝置位於載台上方拍攝工件，以獲得工件影像。影像識別裝置接收工件影像，以識別工件影像中的負曲率結構的影像特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a substrate inspection system, which comprises a platform, a side lighting device, an image capturing device, and an image inspection device. The platform is used for placing the substrate. The side lighting device is positioned on either the front or back side of the substrate, providing side light to the substrate to highlight the image features of a negative curvature structure on the substrate. The image capturing device is located above the platform to capture images of the substrate. The image inspection device receives the substrate images to detect the image features of the negative curvature structure in the substrate images.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:辨識系統</p>
        <p type="p">10:載台</p>
        <p type="p">20:側光源裝置</p>
        <p type="p">30:影像擷取裝置</p>
        <p type="p">40:影像辨識裝置</p>
        <p type="p">41:影像處理模組</p>
        <p type="p">42:影像分析模組</p>
        <p type="p">W:工件</p>
        <p type="p">RD:負曲率結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="18" publication-number="202618718">
    <tif-files tif-type="multi-tif">
      <tif file="113139141.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139141</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>火災預警裝置及火災預警方法</chinese-title>
        <english-title>FIRE EARLY WARNING DEVICE AND FIRE EARLY WARNING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G08B17/06</main-classification>
        <further-classification edition="200601120250203B">G08B17/00</further-classification>
        <further-classification edition="200601120250203B">G01K3/00</further-classification>
        <further-classification edition="200601220250203B">A62C3/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱映國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAR IN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃棋良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種火災預警裝置，包含有一殼體，設置於一停泊位置，該停泊位置用來停泊一交通工具；一感測模組，設置於該殼體之中，用來感測該交通工具相對於該停泊位置之一停泊狀況；一溫度偵測模組，設置於該殼體之中，用來偵測溫度，以產生一偵測結果；以及一處理模組，設置於該殼體之中並耦接於該感測模組及該溫度偵測模組，用來於該停泊狀況顯示該交通工具停等於該停泊位置上，控制該溫度偵測模組偵測該交通工具的底部溫度，並於該偵測結果顯示該交通工具的底部溫度超過一閾值時，產生一提示信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fire warning device includes a housing, installed at a parking position where a vehicle is parked; a sensing module, set up within the housing, configured to detect the parking status of the vehicle relative to the parking position; a temperature detection module, set up within the housing, configured to detect temperature and generate a detection result; a processing module, set up within the housing and coupled to both the sensing module and the temperature detection module, configured to control the temperature detection module to detect the temperature at a bottom of the vehicle when the parking status indicates that the vehicle is parked in the parking position, and generate an indication signal when the detection result shows that the temperature at the bottom of the vehicle exceeds a threshold value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:災害監控系統</p>
        <p type="p">10:火災預警裝置</p>
        <p type="p">12:中央控制系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="19" publication-number="202617573">
    <tif-files tif-type="multi-tif">
      <tif file="113139149.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉入式吊籃的載板移動整合結構與系統</chinese-title>
        <english-title>INTEGRATED STRUCTURE AND SYSTEM FOR CARRIER BOARD MOVEMENTS OF IMMERSED HANGING BASKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B66C1/12</main-classification>
        <further-classification edition="200601120241204B">C25D17/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億鴻工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROCESS ADVANCE TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種沉入式吊籃的載板移動整合結構包括電鍍槽本體、沉入式振動架台、第一限位件、第二限位件、基板移載掛籃、第一振動器與第二振動器。電鍍槽本體在加工期間內具有一電鍍液。沉入式振動架台為內凹式外形且其兩端分別延伸出該電鍍槽本體之外部。基板移載掛籃具有第一掛耳與第二掛耳，其中透過該第一限位件與該第二限位件來使該基板移載掛籃穩定安置。第一振動器，其設置於該沉入式振動架台之一端。第二振動器，其設置於該沉入式振動架台之另一端，其中第一振動器及第二振動器用以使該沉入式振動架台產生振動，進而使液體內的氣泡逸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated structure for carrier board movements of an immersed hanging basket includes a plating tank body, an immersed vibration stand, a first limiter, a second limiter, substrate-transfer hanging basket, a first vibrator and a second vibrator. The plating tank body contains an electroplating liquid during processing. The immersed vibration stand is in a concave shape with two ends extending out of the plating tank body. The substrate-transfer hanging basket includes a first lug and a second lug, and the first limiter and the second limiter are used to stably place the substrate-transfer hanging basket. The first vibrator is installed at an end of the immersed vibration stand, the second vibration is installed at another end of the immersed vibration stand, and the first vibrator and the second vibrator are used to produce vibrations by the immersed vibration stand, so as to let the air bubbles in the liquid escape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:沉入式吊籃的載板移動整合結構</p>
        <p type="p">100S:沉入式吊籃的載板移動整合系統</p>
        <p type="p">110:電鍍槽本體</p>
        <p type="p">120:沉入式振動架台</p>
        <p type="p">130:第一限位件</p>
        <p type="p">140:第二限位件</p>
        <p type="p">150:基板移載掛籃</p>
        <p type="p">152:第一掛耳</p>
        <p type="p">154:第二掛耳</p>
        <p type="p">160:第一振動器</p>
        <p type="p">170:第二振動器</p>
        <p type="p">200:天車運送裝置(OHT)</p>
        <p type="p">210:第一伸縮掛勾</p>
        <p type="p">220:第二伸縮掛勾</p>
        <p type="p">300:軌道</p>
        <p type="p">BD:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="20" publication-number="202617007">
    <tif-files tif-type="multi-tif">
      <tif file="113139152.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>夾子結構</chinese-title>
        <english-title>CLIP STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">A47G29/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬毓實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧旻毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種夾子結構，包括第一夾頭、第二夾頭、彈性復位件及一對施力部，第一夾頭一端形成第一夾持部，另一端具有朝垂直向下延伸之一對肋部；第二夾頭對應第一夾頭，一端形成第二夾持部，第二夾頭上設有一滑槽；一對施力部，水平設置於第一夾頭及第二夾頭兩側，施力部內側有一對擋片，對擋片對應滑槽可於滑槽中位移，擋片上方呈斜面並對應且抵觸肋部；其中，當肋部受到該斜面連動，使第一夾頭相對於第二夾頭做垂直方向位移，；本案由於施力部之施力方向與夾頭張開方向為不同方向，便於使用者施力及進行夾持，具備便利性及操作容易之優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a clip structure, which includes a first clip head, a second clip head, an elastic reset component, and a pair of force application parts. One end of the first clip head forms a first clamping part, while the other end has a pair of ribs extending vertically downward. The second clip head corresponds to the first clip head, with one end forming a second clamping part, and a sliding slot is provided on the second clip head. The pair of force application parts are horizontally arranged on both sides of the first and second clip heads, with a pair of stoppers on the inner side of the force application parts. The stoppers correspond to the sliding slot and can move within the slot, and the upper part of the stopper is sloped, corresponding to and in contact with the ribs. When the ribs are acted upon by the slope, the first clip head moves vertically relative to the second clip head. The force application direction of the force application parts differs from the opening direction of the clip heads, which facilitates ease of use for the user and enhances convenience and ease of operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:夾子結構</p>
        <p type="p">10:第一夾頭</p>
        <p type="p">12:第一夾持部</p>
        <p type="p">14:肋部</p>
        <p type="p">16:第一凹槽</p>
        <p type="p">20:第二夾頭</p>
        <p type="p">22:第二夾持部</p>
        <p type="p">24:滑槽</p>
        <p type="p">30:彈性復位</p>
        <p type="p">40:施力部</p>
        <p type="p">42:擋片</p>
        <p type="p">44:斜面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="21" publication-number="202619271">
    <tif-files tif-type="multi-tif">
      <tif file="113139155.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能板智慧清潔及生產方法與系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241101B">H02S40/10</main-classification>
        <further-classification edition="202001120241101B">G16Y10/35</further-classification>
        <further-classification edition="202001120241101B">G16Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣智能機器人科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯信賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, SHIN-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴彥竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YEN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種太陽能板智慧清潔及生產方法與系統，其主要是透過在太陽能板及設於太陽能板上的太陽能板清潔機器人上設置感測器，以偵測太陽能板及太陽能板清潔機器人的清潔、環境與運行狀況，並提供物聯網系統傳輸至大數據(Big Data)系統及AI(人工智能)系統，以分析收集到的資料，自動確定清潔任務的優先順序和最佳執行時間，並有效預測潛在故障並觸發維護流程，減少維護所需的停機時間，同時透過大數據系統對歷史清潔資料和太陽能板的產電量進行分析，識別清潔效率和太陽能板性能之間的關係，持續優化清潔策略，並且提供定制化的運營和維護報告，以利維運人員做出基於資料的決策。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:太陽能板</p>
        <p type="p">2:太陽能板清潔機器人</p>
        <p type="p">3:感測器</p>
        <p type="p">4:物聯網系統</p>
        <p type="p">5:大數據系統</p>
        <p type="p">6:AI系統</p>
        <p type="p">7:通訊裝置</p>
        <p type="p">8:自動化機器人生產系統</p>
        <p type="p">10:清潔組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="22" publication-number="202618126">
    <tif-files tif-type="multi-tif">
      <tif file="113139156.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>潮汐發電的管路控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F03B13/26</main-classification>
        <further-classification edition="200601120241204B">F03B15/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銘耀精機有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳致宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種潮汐發電的管路控制系統，以漲退潮時間設定或感測方式，當海水漲潮到達預定水位，且汙泥感測器無偵測到過量汙泥時，第一、二動力閥打開，第三、四動力閥關閉，海水由第一進水口流向第一出水口，利用漲潮時的水位差推動一水輪發電機運轉；另當海水漲潮到達預定水位時，第一、二動力閥關閉，第三、四動力閥打開，使蓄水池的池水經由第二管路進入第一管路，再由第三管路流出，據以利用退潮時的水位差推動水輪發電機運轉。據此，當海水漲潮或退潮到預定水位時，發電管路才會打開，據以讓水流變大，達到發電效率穩定及變高；且一個蓄水池僅需一部水輪發電機，就可於漲潮或退潮，都會單一流向，使水流順向進入發電管路，以達降低建造成本；再者，當海水漲潮時水流夾帶過量汙泥時，進水口不會打開，確保汙泥不會對蓄水池造成影響。是以，本發明解決了先前潮汐發電的問題點，具有可供產業利用性及實質經濟效益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:水輪發電機</p>
        <p type="p">20:蓄水池</p>
        <p type="p">21:海岸</p>
        <p type="p">22:海洋</p>
        <p type="p">30:第一管路</p>
        <p type="p">31:第一進水口</p>
        <p type="p">32:第一出水口</p>
        <p type="p">40:第二管路</p>
        <p type="p">41:第二進水口</p>
        <p type="p">42:注水口</p>
        <p type="p">50:第三管路</p>
        <p type="p">51:第二出水口</p>
        <p type="p">52:引水口</p>
        <p type="p">60:控制器</p>
        <p type="p">61:第一動力閥</p>
        <p type="p">62:第二動力閥</p>
        <p type="p">63:第三動力閥</p>
        <p type="p">64:第四動力閥</p>
        <p type="p">65:時間設定器</p>
        <p type="p">66:汙泥感測器</p>
        <p type="p">67:第一水位感測器</p>
        <p type="p">68:第二水位感測器</p>
        <p type="p">(W):水流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="23" publication-number="202617752">
    <tif-files tif-type="multi-tif">
      <tif file="113139160.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療癌症之小分子蛋白</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">C07K14/435</main-classification>
        <further-classification edition="200601120241106B">A61K38/16</further-classification>
        <further-classification edition="200601120241106B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪慧芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝如怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種小分子蛋白及其用於治療或/及預防癌症之用途，其中，該小分子蛋白係為AZ蛋白之變體，具有降解細胞內鳥胺酸去羧酶之活性，而藉由投予一有效量之小分子蛋白至一個體，係能有效地抑制體內鳥胺酸去羧酶之活性，並降低細胞內多胺表現，以達到治療癌症或減緩癌症惡化之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="24" publication-number="202617218">
    <tif-files tif-type="multi-tif">
      <tif file="113139163.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
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          <doc-number>202617218</doc-number>
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        <document-id>
          <doc-number>113139163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吊環連接鎖定齒的防墜器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">A62B1/14</main-classification>
        <further-classification edition="200601120250122B">F16G11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>振鋒企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKE INDUSTRIAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>洪暐傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嘉賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>翁子倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種吊環連接鎖定齒的防墜器，係於外殼的頂部與底部設有吊環口與繩出口，於吊環口穿置吊環組件的吊環，於吊環底端結合吊環座，吊環座嵌設於外殼頂部且連接一鎖定齒，於該外殼內固定一主軸及環套於主軸而可旋轉的轉轂，於轉轂與主軸之間連接一渦捲彈簧，於轉轂結合多圈地纏繞於轉轂的繩體，繩體由吊環口穿出外殼，於轉轂一側的裝設部結合一制動組件，制動組件配置為可與該鎖定齒嚙合；藉由於吊環組件設有鎖定齒供制動組件嚙合，於主軸無需設置對轉轂煞車的棘輪，可縮減防墜器體積且精簡的結構有利於降低生產製造的成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:吊環連接鎖定齒的防墜器</p>
        <p type="p">10:外殼</p>
        <p type="p">10A:半殼體</p>
        <p type="p">12:側壁</p>
        <p type="p">14:周壁</p>
        <p type="p">16:吊環口</p>
        <p type="p">161:吊環凹口</p>
        <p type="p">162:定位凸緣</p>
        <p type="p">18:繩出口</p>
        <p type="p">181:穿繩凹口</p>
        <p type="p">182:導引環</p>
        <p type="p">20:吊環組件</p>
        <p type="p">22:吊環座</p>
        <p type="p">221:頂板</p>
        <p type="p">222:圍板</p>
        <p type="p">24:鎖定齒</p>
        <p type="p">261:桿部</p>
        <p type="p">2611:定位溝</p>
        <p type="p">262:環部</p>
        <p type="p">2621:凸耳</p>
        <p type="p">30:防墜器本體</p>
        <p type="p">31:繩體</p>
        <p type="p">32:支架</p>
        <p type="p">321:盤體</p>
        <p type="p">322:貫穿孔</p>
        <p type="p">33:制動組件</p>
        <p type="p">33A:棘爪塊</p>
        <p type="p">341:端部</p>
        <p type="p">342:螺孔</p>
        <p type="p">35:固定螺絲</p>
        <p type="p">351:頭部</p>
        <p type="p">36:轉轂</p>
        <p type="p">363:裝設面</p>
        <p type="p">37:裝設部</p>
        <p type="p">37A:固定盤</p>
        <p type="p">S:裝設空間</p>
      </representative-img>
    </description>
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  <tw-patent-application no="25" publication-number="202618271">
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          <doc-number>202618271</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139164</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑑定再生塑料之方法</chinese-title>
        <english-title>IDENTIFICATION OF RECYCLED PLASTICS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">G01N30/72</main-classification>
        <further-classification edition="200601120241101B">G01N30/86</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>台灣檢驗科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SGS TAIWAN LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王孆慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林厚余</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HOU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
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              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種鑑定再生塑料之方法，其定量方法係取包含一已知組成分之一標準品及一待測物至一熱裂解氣相層析質譜儀(Py-GC-MS)進行再生塑料之檢測，先建立該標準品對應之一再生塑料回收比例迴歸方程式，並將包含該已知組成分之該待測物對應之一待測物總離子層析圖之一訊號強度值代入，經一線性迴歸運算，判斷該待測物之該組成分之一再生塑料之含量；且，本發明之定性方法，係於取得該待測物總離子層析圖的同時，可藉由該待測物總離子層析圖於一待測物分子量滯留時間之一指標化合物之波峰，來判斷該待測物是否含有對應該指標化合物之再生塑料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10-S50:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="26" publication-number="202617219">
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      <isuno>9</isuno>
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          <doc-number>202617219</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防墜器的可拆式把手裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A62B35/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>振鋒企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKE INDUSTRIAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪暐傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嘉賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁子倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防墜器的可拆式把手裝置，包括一外殼與一把手，外殼的內部具有可供防墜器本體設置的裝設空間，還包括二個可拆卸地對接的半殼體，二個半殼體具有二個併攏的把手座，各把手座形成一固定桿與一把手凹口，二個固定桿的端部合靠在一起，二個把手凹口合併形成一把手穿口；把手具有相連的握柄與連結桿，連結桿具有一連結部，連結部穿過把手穿口且具有一貫穿孔，二個固定桿插入貫穿孔的兩側而使兩者合靠的端部位於貫穿孔內；使把手可拆卸地結合於外殼供使用者提握，還可依使用的需求更換具有不同握柄設計的把手，或者不於外殼設置所述的把手。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:防墜器的可拆式把手裝置</p>
        <p type="p">10:外殼</p>
        <p type="p">20:把手</p>
        <p type="p">30:防墜器本體</p>
      </representative-img>
    </description>
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        <document-id>
          <doc-number>113139167</doc-number>
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      <invention-title>
        <chinese-title>聲音辨識模型建立方法及聲音辨識方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G10L15/16</main-classification>
        <further-classification edition="201301120250203B">G10L25/30</further-classification>
        <further-classification edition="201901120250203B">G06F16/68</further-classification>
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              <chinese-name name-type="organization">
                <last-name>綠捷能智控股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HI-POWER SOLUTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉懿真</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種聲音辨識模型建立方法，由一電腦裝置來實施，該電腦裝置儲存有多筆音訊資料，及多個音訊類型標註，該方法包含：(A)將該等音訊資料轉換成多幀分別對應該等音訊資料的音訊二維影像；(B)將該等音訊二維影像進行影像處理，以獲得多幀分別對應該等音訊二維影像的音訊二值化影像；(C)根據該等音訊二維影像及該等音訊二值化影像，利用一第一機器學習演算法，建立一用以根據二維影像產生二值化影像之影像處理模型；及(D)根據該等音訊二值化影像及該等音訊類型標註，利用一第二機器學習演算法，建立一用以辨識二值化影像之音訊類型的聲音辨識模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21~25:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="28" publication-number="202618409">
    <tif-files tif-type="multi-tif">
      <tif file="113139168.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139168</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防護型矯正眼鏡及其鏡片</chinese-title>
        <english-title>PROTECTIVE PRESCRIPTION GLASSES AND LENSES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G02C7/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>得森科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OURAD SAFETY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃品璁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PIN TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種防護型矯正眼鏡及其鏡片，該鏡片的外表面沿著一橫向及一縱向的曲率半徑均介於47mm至73mm之間，又該鏡片的該外表面於該橫向上的第一外周長係介於70mm至105mm之間，該鏡片上形成有相鄰的一光學區及一非光學區，該光學區係對應一配戴者的眼睛部位，又該光學區於該橫向上的第二外周長係介於48mm至70mm之間，該非光學區沿著該橫向於該配戴者的眼睛部位延伸形成有一防護部，該防護部係對應該配戴者眼睛部位之外眼角位置。該防護型矯正眼鏡係結合有上述鏡片，藉以能保護眼睛避免受傷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鏡片</p>
        <p type="p">11:外表面</p>
        <p type="p">12:光學區</p>
        <p type="p">13:非光學區</p>
        <p type="p">14:防護部</p>
        <p type="p">X:橫向</p>
        <p type="p">Y:縱向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="29" publication-number="202618735">
    <tif-files tif-type="multi-tif">
      <tif file="113139169.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜態顯示系統及其顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G09G3/20</main-classification>
        <further-classification edition="200601120250203B">G09G5/00</further-classification>
        <further-classification edition="200601120250203B">G06F3/147</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綠創新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韋綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜態顯示系統及其顯示裝置，其中靜態顯示系統包括後台系統、顯示裝置及紅外線發射器。顯示裝置包括顯示模組、控制系統及紅外線接收器。控制系統定時偵測後台系統是否具有待更新顯示資料。若有則控制系統將待更新顯示資料傳送至顯示模組，並顯示待更新顯示資料；若無則控制系統暫停供電給顯示模組後進入深度睡眠模式。在深度睡眠模式下顯示裝置不耗電，且紅外線接收器接收紅外線發射器發出的紅外光並轉換為電能，並為電池組充電後供電給控制系統。本發明無須佈設電源線或更換電池，可減少人力與施工成本，並適用各種環境不受安裝限制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:靜態顯示系統</p>
        <p type="p">10’:顯示裝置</p>
        <p type="p">110:顯示模組</p>
        <p type="p">130:控制系統</p>
        <p type="p">132:通訊模組</p>
        <p type="p">140:紅外線接收器</p>
        <p type="p">150:充電模組</p>
        <p type="p">160:電池組</p>
        <p type="p">170:轉換器</p>
        <p type="p">20:後台系統</p>
        <p type="p">30:紅外線發射器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="30" publication-number="202617174">
    <tif-files tif-type="multi-tif">
      <tif file="113139172.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生物性組成物及其用於製備促進毛髮生長藥物之用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61K38/30</main-classification>
        <further-classification edition="201501120241101B">A61K35/28</further-classification>
        <further-classification edition="200601120241101B">A61P17/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>訊聯細胞智藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席　宇廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEBER, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連文瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭庭葦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種生物性組成物，包含類胰島素生長因子-1、臍帶間質幹細胞外泌體和一藥學上可接受之載劑；其中，所述類胰島素生長因子-1之濃度為10 ng/ml至1000 ng/ml，以及所述臍帶間質幹細胞外泌體之濃度為1×10        &lt;sup&gt;8&lt;/sup&gt;顆/毫升至1×10        &lt;sup&gt;11&lt;/sup&gt;顆/毫升。本發明另提供一種生物性組成物用於製備促進毛髮生長藥物之用途。本發明併用類胰島素生長因子-1和臍帶間質幹細胞外泌體具有促進毛髮生長之協同功效。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="31" publication-number="202618664">
    <tif-files tif-type="multi-tif">
      <tif file="113139178.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139178</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加熱爐工件產速預測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241104B">G06Q50/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王朝華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種加熱爐工件產速預測方法，適用於具有入口及出口之加熱爐，及進入所述加熱爐加熱之數個工件，且包含以下步驟：(a)工件溫度計算模組計算每一工件之工件溫度；(b)溫差計算模組計算每一工件之溫差等於每一工件之目標溫度減去每一工件之工件溫度；(c)加熱時間計算模組接收每一工件之所述溫差，並將所述溫差最大之工件定義為瓶頸工件，且計算所述瓶頸工件達到所述目標溫度所需加熱時間；及(d)產速計算模組計算產速等於所述瓶頸工件之所需加熱時間除以將以第一順位離開所述出口的第一工件至所述瓶頸工件為止的工件數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S31~S35:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="32" publication-number="202617628">
    <tif-files tif-type="multi-tif">
      <tif file="113139179.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139179</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>增強劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241021B">C04B24/40</main-classification>
        <further-classification edition="200601120241021B">C04B24/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪嘉圻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪嘉圻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種增強劑包含聚合物固體組分及矽化合物組分。該聚合物固體組分包括三醋酸纖維素固體。該矽化合物組分包括有機矽化合物及無機矽化合物中至少一者。該有機矽化合物選自於烷氧基矽烷及聚矽氧烷所組成的群組中至少一者。該無機矽化合物選自於結晶型二氧化矽、非結晶型二氧化矽及矽酸鹽所組成的群組中至少一者。本發明增強劑能使製備出的石膏製品有高的抗壓強度，且本發明增強劑不會讓該石膏製品的防潮性不佳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="33" publication-number="202617627">
    <tif-files tif-type="multi-tif">
      <tif file="113139180.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>石膏製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241023B">C04B24/02</main-classification>
        <further-classification edition="200601120241023B">C04B24/04</further-classification>
        <further-classification edition="200601120241023B">C04B24/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪嘉圻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪嘉圻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種石膏製品包含一石膏本體。該石膏本體由一石膏漿所形成。該石膏漿包括水、石膏粉、防潮劑及增強劑。該增強劑具有聚合物固體組分。該聚合物固體組分具有三醋酸纖維素固體、聚酯固體及碘化聚乙烯醇固體。該碘化聚乙烯醇固體由聚乙烯醇固體及碘源所形成。使用該增強劑與該防潮劑所製備出的本發明石膏製品除了具有高的抗壓強度且還具有良好的防潮性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="34" publication-number="202619617">
    <tif-files tif-type="multi-tif">
      <tif file="113139181.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有輔助振動之狹縫填膠設備</chinese-title>
        <english-title>GAP FILLING DEVICE WITH AUXILIARY VIBRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250418B">H10N30/20</main-classification>
        <further-classification edition="200601120250418B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃玉龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂育廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYU, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAN, CHIA MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彧甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁子洹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, TZU-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仲淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUANG CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有輔助振動之狹縫填膠設備包括：一點膠機，包括一注射器，用以將一填充膠只沿著一組合件之一縫隙空間的周圍涂佈；以及一振動源，設置於該注射器涂佈該填充膠的位置附近，並利用一輔助振動方式使涂佈於該縫隙空間周圍的該填充膠移動至該縫隙空間內，以填充整個該縫隙空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gap filling device with auxiliary vibration, including: a glue dispensing machine, including an injector, used to dispense a filling glue only along the periphery of a gap space of an assembly; and a vibration source, arranged near the position where the injector dispenses the filling glue, and uses an auxiliary vibration mode to move the filling glue dispensed around the gap space into the gap space to fill the entire gap space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="35" publication-number="202619618">
    <tif-files tif-type="multi-tif">
      <tif file="113139182.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有輔助振動之狹縫填膠方法</chinese-title>
        <english-title>GAP FILLING METHOD WITH AUXILIARY VIBRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250418B">H10N30/20</main-classification>
        <further-classification edition="200601120250418B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃玉龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂育廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYU, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAN, CHIA MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彧甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁子洹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, TZU-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仲淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUANG CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有輔助振動之狹縫填膠方法，包括下列步驟：一組合件提供步驟，提供一組合件，其包括一縫隙空間；一填充膠點膠步驟，將一填充膠只沿著該縫隙空間的周圍涂佈；以及一填充膠振動步驟，利用一輔助振動方式使涂佈於該縫隙空間周圍的該填充膠移動至該縫隙空間內，以填充整個該縫隙空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gap filling method with auxiliary vibration, including the following steps: an assembly providing step, providing an assembly including a gap space; a filling glue dispensing step, dispensing a filling glue only along the periphery of the gap space; and a filling glue vibration step, using an auxiliary vibration mode to move the filling glue dispensed around the gap space into the gap space to fill the entire gap space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="36" publication-number="202618723">
    <tif-files tif-type="multi-tif">
      <tif file="113139188.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧物聯網交通警示貓眼系統</chinese-title>
        <english-title>AIOT TRAFFIC WARNING CAT-EYE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241126B">G08G1/097</main-classification>
        <further-classification edition="200601120241126B">G08G1/01</further-classification>
        <further-classification edition="200601120241126B">G08B5/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城市學校財團法人臺北城市科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI CITY UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪泰宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TAI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王士倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾得軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, DE-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳元皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUAN-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊立暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘祈勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧物聯網交通警示貓眼系統，包含沿著道路設置的複數個貓眼裝置，貓眼裝置包括：攝影機構，對道路進行攝影而獲得道路狀況攝影畫面；檢測機構，對道路的環境變化及行駛車輛的動態進行檢測而獲得道路狀況檢測結果；處理機構，對道路狀況攝影畫面及道路狀況檢測結果進行道路狀況分析處理而獲得道路狀況分析結果；通訊機構，進行道路狀況攝影畫面、道路狀況檢測結果及道路狀況分析結果的資料收發；以及導引指示機構，設置有導引指示燈，根據道路狀況分析結果，導引指示燈顯示正常指示燈號、留意指示燈號或警告指示燈號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An AIoT traffic warning cat-eye system includes multiple cat-eye devices disposed along the road. The cat-eye device includes: a camera, which takes a plurality of photographs of the road to obtain a plurality of road condition images; a detector, which detects the road environment changes and the dynamics of driving vehicles to obtain a plurality of road condition detecting results; a processor, which analyzes the road condition images and the road condition detecting results to obtain a plurality of road condition analysis results; a communicator, which receives and sends the road condition images, the road condition detecting results and the road condition analysis results; and an indicator, which is provided with a guidance indicating light displaying a normal indicating sign, a watchful indicating sign or a warning indicating sign according to the road condition analysis results.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:貓眼裝置</p>
        <p type="p">80:載重測量模組</p>
        <p type="p">L:標線</p>
        <p type="p">R:道路</p>
        <p type="p">V:車輛</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="37" publication-number="202618516">
    <tif-files tif-type="multi-tif">
      <tif file="113139189.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源配置方法</chinese-title>
        <english-title>METHOD OF POWER CONFIGURATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250107B">G06F1/3203</main-classification>
        <further-classification edition="200601120250107B">G06F1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅啟榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源配置方法，適用於配置多個供電單元，利用一基板管理控制器來執行以下步驟：判定是否儲存有一優先電源配置方案；當判定出儲存有該優先電源配置方案時，以該優先電源配置方案配置該等供電單元；根據該等供電單元的總數、該等供電單元每一者的最大功率及一系統配置列表，獲得一最大功率電源配置方案及一最佳功率電源配置方案；將該最大功率電源配置方案及該最佳功率電源配置方案傳送至一用戶端裝置；及接收由該用戶端裝置傳送的一用戶回應，並根據該用戶回應更新該優先電源配置方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of power configuration is used to configure multiple power supply units, and a baseboard management controller is configured to perform the steps of: determining whether a priority power supply configuration scheme is stored; configuring the the power supply units with the priority power supply configuration scheme when it is determined that the priority power supply configuration scheme is stored; obtaining a maximum power supply configuration scheme and an optimal power supply configuration scheme based on the total number of the power supply units, the maximum power of each of the power supply units and a system configuration list; transmitting the maximum power supply configuration scheme and the optimal power supply configuration scheme to a client device; and updating the priority power configuration plan according to a user response sent by the client device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S215:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="38" publication-number="202618424">
    <tif-files tif-type="multi-tif">
      <tif file="113139193.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有支撐結構的電泳式顯示器</chinese-title>
        <english-title>ELECTROPHORESIS DISPLAY WITH SUPPORTING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241030B">G02F1/167</main-classification>
        <further-classification edition="201901120241030B">G02F1/16753</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>速博思股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUPERC-TOUCH COPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祥宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIAUG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金上</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, SHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林丙村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PING TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷家正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, CHIA CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昆宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有支撐結構的電泳式顯示器，包含：一控制基板、一相對基板，一電泳顯示材料層設置在該控制基板與該相對基板之間、一畫素電極層，包含多個畫素電極，兩該畫素電極之間有一畫素間隙；多個支撐結構，該些支撐結構具有支撐結構間隙。該支撐結構間隙具有至少一種尺寸，且該些支撐結構之間填充該電泳顯示材料層之膠體溶液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrophoresis display with support structure includes a control substrate, an opposite substrate, an electrophoresis material layer arranged between the two substrates, a pixel electrode layer including a plurality of pixel electrodes and a pixel gap present between two adjacent pixel electrodes, a plurality supporting structures with structural gap therebetween and the structural gap having at least one size. A colloidal solution is at least filled between the supporting structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電泳式顯示器</p>
        <p type="p">10:控制基板</p>
        <p type="p">12:相對基板</p>
        <p type="p">13:光學膠</p>
        <p type="p">14:共同電極層</p>
        <p type="p">20:電泳層</p>
        <p type="p">30:驅動電路層</p>
        <p type="p">PEL:畫素電極層</p>
        <p type="p">CF:彩色濾光層</p>
        <p type="p">26:帶電荷顏色粒子</p>
        <p type="p">26W:帶電荷白色粒子</p>
        <p type="p">26B:帶電荷黑色粒子</p>
        <p type="p">50:微隔間結構</p>
        <p type="p">52:支撐結構</p>
        <p type="p">54:槽室</p>
        <p type="p">10A:第一表面</p>
        <p type="p">10B:第二表面</p>
        <p type="p">12A:第三表面</p>
        <p type="p">12B:第四表面</p>
        <p type="p">H:平均高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="39" publication-number="202618829">
    <tif-files tif-type="multi-tif">
      <tif file="113139194.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合型觸控鍵盤裝置及其觸控電極模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">H01H13/702</main-classification>
        <further-classification edition="200601120241218B">H01H13/705</further-classification>
        <further-classification edition="200601120241218B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幸芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周恒生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周敬禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種整合型觸控鍵盤裝置，其包含有觸控電極模組。觸控電極模組包含有第一薄膜、第二薄膜、複數第一電極單元及複數第二電極單元。第一電極單元設於第一薄膜，第二電極單元設於第二薄膜。第一電極單元平行於第一方向直線延伸，第二電極單元平行於第二方向直線延伸。如此一來，配置有觸控電極模組的整合型觸控鍵盤裝置即可提供觸控功能及鍵盤的輸入功能，藉此無須另外配置觸控面板，藉此縮小配置整合型觸控鍵盤裝置的電子裝置的整體體積，使得電子裝置能更便於攜帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:整合型觸控鍵盤</p>
        <p type="p">10:觸控電極模組</p>
        <p type="p">110:第一電極單元</p>
        <p type="p">1101:第一電極</p>
        <p type="p">H1:第一寬度</p>
        <p type="p">120:第二電極單元</p>
        <p type="p">H2:第二寬度</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">40:處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="40" publication-number="202619274">
    <tif-files tif-type="multi-tif">
      <tif file="113139195.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低成本、高線性度之混合式差動放大器及其方法</chinese-title>
        <english-title>HYBRID DIFFERENTIAL AMPLIFIER WITH LOW COST AND HIGH LINEARITY AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">H03F1/32</main-classification>
        <further-classification edition="200601120250106B">H03F3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫紹茗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭鳴均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, MING-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許麗美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混合式差動放大器，根據差動輸入訊號產生差動輸出訊號，以驅動負載，該混合式差動放大器包含：第一放大器，配置為電感切換式轉換器，用以根據該差動輸入訊號的第一輸入訊號進行脈寬調變(PWM)轉換以切換電感器而產生該差動輸出訊號的第一輸出訊號；以及第二放大器，用以根據該差動輸入訊號的第二輸入訊號而產生該差動輸出訊號的第二輸出訊號；其中該第二放大器配置為相異於該電感切換式轉換器的另一類別的放大器；其中該第二放大器更根據該差動輸出訊號之回授產生該第二輸出訊號，藉此該差動輸出訊號線性相關於該差動輸入訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hybrid differential amplifier that generates a differential output signal based on a differential input signal to drive a load, includes: a first amplifier configured as an inductive switching converter to perform pulse-width modulation (PWM) conversion based on a first input signal of the differential input signal to switch an inductor and generate a first output signal of the differential output signal; and a second amplifier configured to generate a second output signal of the differential output signal based on a second input signal of the differential input signal. The second amplifier is configured as a different type of amplifier distinct from the inductive switching converter. The second amplifier further generates the second output signal based on feedback from the differential output signal, thereby ensuring that the differential output signal is linearly correlated with the differential input signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:混合式差動放大器</p>
        <p type="p">201,202:放大器</p>
        <p type="p">L:電感器</p>
        <p type="p">Vid:差動輸入訊號</p>
        <p type="p">Vin,Vip:輸入訊號</p>
        <p type="p">Vod:差動輸出訊號</p>
        <p type="p">Von,Vop:輸出訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="41" publication-number="202617361">
    <tif-files tif-type="multi-tif">
      <tif file="113139200.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具精密轉動功能的手工具</chinese-title>
        <english-title>HAND TOOL WITH PRECISION ROTATING FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B25B13/46</main-classification>
        <further-classification edition="200601120241230B">B25B15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義成工廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIH CHENG FACTORY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林健國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係一種具精密轉動功能的手工具。握把包含工作端 。棘齒環包含環部及頸部，環部的內壁面設置有棘齒，頸部穿置在工作端。環柱安置在環部中，環柱設置有穿孔，環柱的外緣面設置有缺槽、容槽及切換槽，環柱在切換槽一側形成第一擋壁、並在另一側形成第二擋壁。旋鈕包含旋蓋及切換桿，旋蓋設置有複數凹槽並套合在棘齒環外，切換桿凸伸在切換槽中，並在旋蓋的轉動下抵掣第一擋壁或第二擋壁。卡掣組包含定位彈片及彈性卡掣單元，定位彈片設置在缺槽並定位在凹槽中，彈性卡掣單元設置在容槽並受到棘齒的擋掣或壓掣。工具軸穿設旋蓋、穿孔及棘齒環，並固定在握把中。藉此提供透過轉動旋鈕來進行精密的轉動，增加使用上的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hand tool with a precision rotating function. The handle includes a working end. The ratchet ring includes a ring part and a neck part. The ring part includes ratchet teeth on the inner wall thereof, and the neck part is inserted in the working end. The column is placed in the ring part, and a perforation is disposed on the column. A notch, a receiving groove, and a switching groove are disposed on the outer edge of the column. The column includes a first stop on one side of the switching groove and a second stop on the other side of the switching groove. The knob includes a rotating cover and a switching lever. Multiple recesses are disposed on the rotating cover. The rotating cover is adapted to sheath the ratchet ring. The switching lever extends to the switching groove and engages with either the first stop or the second stop under the rotation of the rotating cover. The locking assembly includes a positioning spring and an elastic locking unit. The positioning spring is disposed in the notch and positioned in the recess. The elastic locking unit is disposed in the receiving groove and is engaged or pressed by the ratchet teeth. The tool shaft passes through the rotating cover, the perforation, the ratchet ring, and is fixed in the handle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:握把</p>
        <p type="p">211:棘齒</p>
        <p type="p">22:頸部</p>
        <p type="p">30:環柱</p>
        <p type="p">31:缺槽</p>
        <p type="p">32:容槽</p>
        <p type="p">33:切換槽</p>
        <p type="p">34:第一擋壁</p>
        <p type="p">35:第二擋壁</p>
        <p type="p">41:旋蓋</p>
        <p type="p">410:凹槽</p>
        <p type="p">411:第一凹槽</p>
        <p type="p">412:中間凹槽</p>
        <p type="p">413:第二凹槽</p>
        <p type="p">42:切換桿</p>
        <p type="p">43:卡掣塊</p>
        <p type="p">50:卡掣組</p>
        <p type="p">51:定位彈片</p>
        <p type="p">511:凸弧</p>
        <p type="p">52:彈性卡掣單元</p>
        <p type="p">521:卡掣片</p>
        <p type="p">5211:擋掣面</p>
        <p type="p">5212:壓掣面</p>
        <p type="p">522:彈簧</p>
        <p type="p">60:工具軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="42" publication-number="202619372">
    <tif-files tif-type="multi-tif">
      <tif file="113139201.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音訊播放方法、音訊播放系統及發射音箱</chinese-title>
        <english-title>AUDIO PLAYBACK METHOD, AUDIO PLAYBACK SYSTEM, AND TRANSMITTING SPEAKER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H04R5/04</main-classification>
        <further-classification edition="200601120250107B">G06F13/10</further-classification>
        <further-classification edition="200601120250107B">G06F13/14</further-classification>
        <further-classification edition="200601120250107B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁紫瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音訊播放方法包含以下步驟: (a)由無線通訊晶片依序執行多個信標發送，其中這些信標發送用以分別發送多個相應時戳；(b)響應於這些信標發送，由系統單晶片擷取分別對應這些信標發送的多個相應系統時間；以及(c)根據這些相應時戳及這些相應系統時間，產生與這些信標發送一對一對應的多個相應時間差。步驟(b)包含: 當執行這些信標發送的每一者時，由無線通訊晶片分別將輸入輸出訊號與當下所發送的相應時戳經由輸入輸出介面及通訊介面傳送至系統單晶片，以觸發系統中斷；以及響應於中斷訊號，由系統單晶片擷取當下系統時間作為對應當下信標發送的相應系統時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio playback method includes following steps of: (a) successively executing multiple beacon transmissions by a wireless communication chip, in which the beacon transmissions are configured to transmit multiple corresponding timestamps, respectively; (b) capturing, by a system on chip, multiple corresponding system time points which correspond to the beacon transmissions, respectively, in response to the beacon transmissions; and (c) generating multiple corresponding time differences which correspond to the beacon transmissions one by one, according to the corresponding timestamps and the corresponding system time points. The step (b) includes: sending, by the wireless communication chip, an input/output signal and a corresponding timestamp currently-transmitted to the system on chip through an input-output interface and a communication interface, respectively, when executing each of the beacon transmissions, to trigger a system interrupting; and capturing, by the system on chip, a current system time point as a corresponding system time point which corresponds to a current beacon transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">320:步驟</p>
        <p type="p">321~322:次步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="43" publication-number="202617132">
    <tif-files tif-type="multi-tif">
      <tif file="113139202.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139202</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低溶解度化合物的緩釋劑型及其緩釋劑型的製備方法</chinese-title>
        <english-title>SUSTAINED RELEASE DOSAGE FORMS FOR LOW SOLUBILITY COMPOUNDS AND METHODS FOR PREPARING OF THESE SUSTAINED RELEASE DOSAGE FORMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">A61K9/22</main-classification>
        <further-classification edition="200601120250401B">A61K47/38</further-classification>
        <further-classification edition="200601120250401B">A61K47/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德國商依莫維亞製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMOVIAR PHARMACON GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬蒂亞斯　約瑟夫謝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATHIAS, JOSEF SCHEER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種固體口服藥物，其採用新穎、明確的方法來增強在水性介質中溶解度低的活性藥物成分（active pharmaceutical ingredient, API）的溶解度，並且將這些增強的API用於製備修飾及持續釋放的藥物製劑的新方法中，由於這些API的溶解度低，因此通常不適合緩釋製劑。本發明適用於小分子API（分子量＜1000），只要是根據本發明中描述的方法，其溶解度都可以透過形成例如環糊精複合體來增強，無論使用哪種環糊精或其衍生物。屬於此類的小分子API可以在多種適應症中找到。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a solid oral pharmaceutical with a novel, well defined method to enhance solubility of active pharmaceutical ingredients (API) with low solubility in aqueous media and use those enhanced API in a new approach of preparing modified and sustained release pharmaceutical formulation for API which are regularly not suitable for sustained release formulations because of their low solubility. This invention is applicable for small molecule API (molecular weight ＜ 1000) for which the solubility can be enhanced by formation of a e.g., Cyclodextrin complex regardless which cyclodextrin or derivate thereof is employed according to the method described in this invention. Small molecule API falling in this category can be found in a wide range of indications.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="44" publication-number="202618002">
    <tif-files tif-type="multi-tif">
      <tif file="113139203.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產酯粒細菌之菌體崩裂方法</chinese-title>
        <english-title>BACTERIAL BODY DISINTEGRATION METHOD OF ESTER-PRODUCING BACTERIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250501B">C12P7/625</main-classification>
        <further-classification edition="200601120250501B">C12N1/20</further-classification>
        <further-classification edition="200601320250501B">C12R1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種產酯粒細菌之菌體崩裂方法，透過一脈衝高電壓電場，可直接造成含水率70～90%的菌液樣品的菌體崩裂作用，因脈衝高電壓作用特性，使原本緻密的細胞壁及細胞膜被電穿孔，透過監測蛋白質含量的測定，可發現菌體中的蛋白質釋出量提升；於酸及鹼性條件下，本方法均可提高蛋白質量釋出，但在鹼性條件助益較佳，其可提高後續萃取PHAs的效益。本發明可統合於廠務系統，減少桶槽設計及廠址空間成本，透過工廠化的管線配置及電場域設置，批次或連續性的有效崩解提高程序效率，大幅減少工時及化學品的消耗，對微生物的崩解分離具放大設計經濟性及產業應用價值，可有效減少PHAs生產成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of cell disintegration of ester-producing bacteria, through a pulse high voltage electric field, can directly cause the bacterial body disintegration of bacterial liquid samples with a moisture content of 70~90%, due to the characteristics of pulse high voltage, the originally dense cell wall and cell membrane are electroporated, through the determination of monitoring protein content, it can be found that the protein release in the bacteria is increased; This method can improve the quality release of protein under both acidic and alkaline conditions, but it is better under alkaline conditions, which can improve the efficiency of subsequent extraction of PHAs. The present invention can be integrated into the factory system, reduce the cost of barrel tank design and site space, improve the process efficiency through the factory-based pipeline configuration and electric field setting, the effective disintegration of batches or continuous, greatly reduce the consumption of man-hours and chemicals, and have amplified design economy and industrial application value for the disintegration and separation of microorganisms, and can effectively reduce the production cost of PHAs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">s1~s2:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="45" publication-number="202616948">
    <tif-files tif-type="multi-tif">
      <tif file="113139204.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139204</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用施放高頻率聲音之飼養環境提高雞蛋產量與品質之方法</chinese-title>
        <english-title>METHOD OF IMPROVING EGG PRODUCTION AND QUALITY BY USING A HIGH-FREQUENCY SOUND ENVIRONMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A01K39/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宜臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李滋泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TZU-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種提高雞蛋產量及品質之方法，特徵在於將蛋雞飼養於施放高頻率範圍聲音的環境，以提高蛋雞的雞蛋產量、提升雞蛋品質以及促進蛋雞腸道腸道菌相健康。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for improving egg production and quality, characterized by keeping laying hens in an environment applying a high frequency sound to increase egg production and quality, and promote the health of the intestinal flora of laying hens.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="46" publication-number="202616960">
    <tif-files tif-type="multi-tif">
      <tif file="113139206.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>家禽致暈檢測系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A22B3/00</main-classification>
        <further-classification edition="200601120241231B">A22B3/06</further-classification>
        <further-classification edition="200601120241231B">A22B5/08</further-classification>
        <further-classification edition="200601120241231B">A22B7/00</further-classification>
        <further-classification edition="202201120241231B">G06V40/10</further-classification>
        <further-classification edition="202201120241231B">G06V40/60</further-classification>
        <further-classification edition="202401120241231B">G06Q50/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林浩庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種家禽致暈檢測系統，係與一家禽屠宰平台搭配使用，其中該家禽致暈檢測系統至少包含：一第一攝像裝置、一第二攝像裝置、一網路傳送裝置及一電腦運算裝置。該家禽致暈檢測系統係利用視覺裝置能在第一時間內即判斷出致暈後的家禽是否還存在知覺的辨識系統，並且利用一YOLOv4深度學習模型來提昇辨別被致暈後的家禽是否已失去知覺狀態的識別度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:家禽致暈檢測系統</p>
        <p type="p">2:家禽屠宰平台</p>
        <p type="p">11:第一攝影裝置</p>
        <p type="p">12:第二攝影裝置</p>
        <p type="p">13:網路傳送裝置</p>
        <p type="p">14:電腦運算裝置</p>
        <p type="p">141:第一影像增強程序</p>
        <p type="p">142:第二影像增強程序</p>
        <p type="p">143:第三影像增強程序</p>
        <p type="p">144:YOLOv4深度學習模型</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;i&lt;/i&gt;1&lt;/sub&gt;:第一影像訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;i&lt;/i&gt;2&lt;/sub&gt;:第二影像訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;if&lt;/i&gt;1&lt;/sub&gt;:第一影像增強訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;if&lt;/i&gt;2&lt;/sub&gt;:第二影像增強訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;is&lt;/i&gt;1&lt;/sub&gt;:第三影像增強訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;is&lt;/i&gt;2&lt;/sub&gt;:第四影像增強訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;it&lt;/i&gt;1&lt;/sub&gt;:第五影像增強訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;it&lt;/i&gt;2&lt;/sub&gt;:第六影像增強訊號</p>
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;j&lt;/i&gt;
        &lt;/sub&gt;:預測結果訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="47" publication-number="202619286">
    <tif-files tif-type="multi-tif">
      <tif file="113139207.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>石英諧振器</chinese-title>
        <english-title>QUARTZ RESONATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">H03H9/215</main-classification>
        <further-classification edition="200601120250106B">H03H9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣晶技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TXC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭秉濬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, BING-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種石英諧振器，包括一殼體、一接墊、一振子晶體及一熱敏電阻。殼體包括一第一殼體及一第二殼體。接墊設置於第二殼體的一外表面。振子晶體包括兩厚部、以及兩端分別連接兩厚部的一薄部。兩厚部夾設於第一殼體及第二殼體之間。第一殼體的一內表面與振子晶體的薄部間形成一密閉的第一空間，第二殼體的一內表面與振子晶體的薄部間形成一密閉的第二空間。熱敏電阻設置於第一空間或第二空間之內且電性連接於接墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quartz resonator including a casing, a pad, an oscillator crystal and a thermistor is provided. The casing includes a first casing and a second casing. The pad is disposed on an outer surface of the second casing. The oscillator crystal includes two thick parts and a thin part whose two ends are respectively connected to the two thick parts. The two thick parts are sandwiched between the first casing and the second casing. An inner surface of the first casing and the thin part of the oscillator crystal form a sealed first space, and an inner surface of the second casing and the thin part of the oscillator crystal form a sealed second space. The thermistor is disposed in the first space or the second space and is electrically connected to the pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P1:第一空間</p>
        <p type="p">P2:第二空間</p>
        <p type="p">100:石英諧振器</p>
        <p type="p">110:殼體</p>
        <p type="p">111:第一殼體</p>
        <p type="p">112:第二殼體</p>
        <p type="p">113、114:內表面</p>
        <p type="p">115:外表面</p>
        <p type="p">117:內平面</p>
        <p type="p">120:接墊</p>
        <p type="p">130:振子晶體</p>
        <p type="p">131:凹槽</p>
        <p type="p">132:厚部</p>
        <p type="p">133:薄部</p>
        <p type="p">140:熱敏電阻</p>
        <p type="p">150:線路結構</p>
        <p type="p">151、152:端</p>
        <p type="p">153:中間段</p>
        <p type="p">160:封裝環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="48" publication-number="202619560">
    <tif-files tif-type="multi-tif">
      <tif file="113139208.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D84/80</main-classification>
        <further-classification edition="202501120250102B">H10D30/60</further-classification>
        <further-classification edition="202501120250102B">H10D84/03</further-classification>
        <further-classification edition="200601120250102B">H01L21/027</further-classification>
        <further-classification edition="200601120250102B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體裝置及其形成方法。所述半導體裝置包括基底、邏輯元件以及記憶體元件。基底包括邏輯區和胞元區，其中基底在邏輯區的第一頂面高於基底在胞元區的第二頂面。邏輯元件設置在邏輯區中且包括設置在第一頂面上的第一閘極結構。記憶體元件設置在胞元區中且包括設置在第二頂面上的第二閘極結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and a method for forming the semiconductor device are provided. The semiconductor device includes a substrate including a logic region and a cell region, a logic element disponed in the logic region, and a memory element disposed in the cell region. A first top surface of the substrate in the logic region is higher than a second top surface of the substrate in the cell area. The logic element includes a first gate structure disposed on the first top surface. The memory element includes a second gate structure disposed on the second top surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">100:基底</p>
        <p type="p">114:電荷儲存結構</p>
        <p type="p">114a:穿隧介電層</p>
        <p type="p">114b:電荷捕捉層</p>
        <p type="p">114c:阻擋介電層</p>
        <p type="p">122:閘極介電層</p>
        <p type="p">132:高介電常數層</p>
        <p type="p">152:蝕刻停止層</p>
        <p type="p">162:介電層</p>
        <p type="p">D1:邏輯元件</p>
        <p type="p">D2:記憶體元件</p>
        <p type="p">MG:閘極電極</p>
        <p type="p">MGS1:第一閘極結構</p>
        <p type="p">MGS2:第二閘極結構</p>
        <p type="p">R1:邏輯區</p>
        <p type="p">R2:胞元區</p>
        <p type="p">SW11:第一間隙壁</p>
        <p type="p">SW22:第二間隙壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="49" publication-number="202619373">
    <tif-files tif-type="multi-tif">
      <tif file="113139212.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音訊播放方法、音訊播放系統及發射音箱</chinese-title>
        <english-title>AUDIO PLAYBACK METHOD, AUDIO PLAYBACK SYSTEM, AND TRANSMITTING SPEAKER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H04R5/04</main-classification>
        <further-classification edition="200601120250107B">G06F13/10</further-classification>
        <further-classification edition="200601120250107B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁紫瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音訊播放方法包含:由系統單晶片依序發送多個時戳擷取指令以分別命令無線通訊晶片擷取多個時戳；響應於這些時戳擷取指令，由系統單晶片擷取多個相應系統時間；以及根據這些相應時戳及這些相應系統時間，產生與這些時戳擷取指令一對一對應的多個相應時間差。當無線通訊晶片接收這些時戳擷取指令的每一者時，由無線通訊晶片分別將輸入輸出訊號及當下所擷取的相應時戳傳送至系統單晶片，系統單晶片接收到輸入輸出訊號時觸發系統中斷；以及響應於中斷訊號，由系統單晶片擷取當下系統時間作為對應當下時戳擷取指令的相應系統時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio playback method includes following steps of: (a) successively transmitting multiple timestamp capturing instructions by a system on chip, to command a wireless communication chip to capture multiple timestamps, respectively; (b) capturing, by the system on chip, multiple corresponding system time points, in response to the timestamp capturing instructions; and (c) generating multiple corresponding time differences which correspond to the timestamp capturing instructions one by one, according to the corresponding timestamps and the corresponding system time points. The step (b) includes: sending, by the wireless communication chip, an input/output signal and a corresponding timestamp currently-captured to the system on chip through an input-output interface and a communication interface, respectively, when the wireless communication chip receives each of the timestamp capturing instructions; and capturing, by the system on chip, a current system time point as a corresponding system time point which corresponds to a current timestamp capturing instruction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">321~322:次步驟</p>
        <p type="p">320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="50" publication-number="202619275">
    <tif-files tif-type="multi-tif">
      <tif file="113139215.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻抗調整電路及放大器電路</chinese-title>
        <english-title>IMPEDANCE ADJUSTMENT CIRCUIT AND AMPLIFIER CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H03F1/56</main-classification>
        <further-classification edition="200601120250107B">H03F3/189</further-classification>
        <further-classification edition="200601120250107B">H03H11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭丁元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種阻抗調整電路及放大器電路。阻抗調整電路包括輸入端、輸出端以及阻抗調整子電路。阻抗調整子電路包括金氧半電晶體-電容(MOSCAP)以及開關電路。金氧半電晶體-電容的第一端耦接輸入端。金氧半電晶體-電容的控制端接收控制信號。開關電路的控制端接收開關控制信號。金氧半電晶體-電容的基極端耦接輸出端。透過改變開關控制信號以改變阻抗調整子電路的電容值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An impedance adjustment circuit and an amplifier circuit are provided. The impedance adjustment circuit includes an input terminal, an output terminal and an impedance adjustment sub-circuit. The impedance adjustment sub-circuit includes a metal oxide semi-transistor-capacitor (MOSCAP) and a switching circuit. The first terminal of the MOSCAP is coupled to the input terminal. The control terminal of the MOSCAP receives a control signal. The control terminal of the switch circuit receives a switch control signal. A base terminal of the MOSCAP is coupled to the output terminal. The capacitance value of the impedance adjustment subcircuit is changed by changing the switch control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110A:阻抗調整電路</p>
        <p type="p">110-1a:阻抗調整子電路</p>
        <p type="p">120:開關電路</p>
        <p type="p">210:控制電路</p>
        <p type="p">INP:輸入端</p>
        <p type="p">OUTP:輸出端</p>
        <p type="p">MOScap:金氧半導體-電容</p>
        <p type="p">Vgctl:控制信號</p>
        <p type="p">BN:金氧半導體-電容的基極端</p>
        <p type="p">Ssw:開關控制信號</p>
        <p type="p">Vref:參考電壓</p>
        <p type="p">N1:金氧半導體-電容的第一端</p>
        <p type="p">N2:金氧半導體-電容的第二端</p>
        <p type="p">GN:金氧半導體-電容的控制端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="51" publication-number="202617311">
    <tif-files tif-type="multi-tif">
      <tif file="113139216.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139216</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工設備的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250102B">B23K26/062</main-classification>
        <further-classification edition="201401120250102B">B23K26/08</further-classification>
        <further-classification edition="201401120250102B">B23K26/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈦昇科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詳竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種雷射加工設備的控制方法，該雷射加工設備包含一雷射光源裝置、用以承載一待加工件的一載台及一控制裝置，該方法將待加工件劃分為複數個作業區塊，使各該作業區塊與該雷射光束的一掃描範圍的大小相等；該控制裝置控制該載台沿著一第一軸向或一第二軸向持續地等速移動，使該載台帶動該待加工件相對於該雷射光源裝置移動；在該載台的移動過程中，該控制裝置持續接收光學尺所測得之載台移動量，以獲得該待加工件的一即時座標T(x1        &lt;sub&gt;t&lt;/sub&gt;,y1        &lt;sub&gt;t&lt;/sub&gt;)；根據預設之一目標座標R(x        &lt;sub&gt;t&lt;/sub&gt;,y        &lt;sub&gt;t&lt;/sub&gt;)及該待加工件的該即時座標T(x1        &lt;sub&gt;t&lt;/sub&gt;,y1        &lt;sub&gt;t&lt;/sub&gt;)，控制裝置根據公式R(x        &lt;sub&gt;t&lt;/sub&gt;,y        &lt;sub&gt;t&lt;/sub&gt;)=T(x1        &lt;sub&gt;t&lt;/sub&gt;,y1        &lt;sub&gt;t&lt;/sub&gt;)+G(x2        &lt;sub&gt;t&lt;/sub&gt;,y2        &lt;sub&gt;t&lt;/sub&gt;)持續計算一雷射指向座標G(x2        &lt;sub&gt;t&lt;/sub&gt;,y2        &lt;sub&gt;t&lt;/sub&gt;)，控制該雷射光束在該加工件上的落點位置。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="52" publication-number="202617317">
    <tif-files tif-type="multi-tif">
      <tif file="113139233.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於切割複合材料的切割裝置</chinese-title>
        <english-title>CUTTING DEVICE FOR CUTTING COMPOSITE MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241230B">B23K26/38</main-classification>
        <further-classification edition="201401120241230B">B23K26/062</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於切割複合材料的切割裝置，其包括承載模組及雷射產生模組。承載模組用於承載複合材料。雷射產生模組用於提供雷射光束，雷射產生模組包括用以提供雷射光源的雷射投射器以及位於雷射光源的投射路徑上的雷射路徑調整器。雷射光束的投射路徑通過雷射路徑調整器的調整或者複合材料通過承載模組的移動，以使得雷射光束投射在複合材料上所形成的切割區域被平行偏移。該雷射光源的脈衝寬度在飛秒量級（10        &lt;sup&gt;-15&lt;/sup&gt;秒），該雷射光源的脈衝寬度小於500 fs，該雷射光源的脈衝重複頻率大於1 MHz。藉此，本發明之用於切割複合材料的切割裝置可對複合材料進行切割。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cutting device for cutting composite materials is provided, including a carrying module and a laser generation module. The carrying module is used to carry composite materials. The laser generation module is used to provide a laser beam. The laser generation module includes a laser projector for providing a laser light source and a laser path adjuster located on the projection path of the laser light source. The projection path of the laser beam is adjusted by the laser path adjuster or the composite material is moved by the carrying module, so that the cutting area formed by the laser beam projected on the composite material is offset in parallel. The pulse width of the laser light source is in the femtosecond level (10-15 seconds), the pulse width of the laser light source is less than 500 fs, and the pulse repetition frequency of the laser light source is greater than 1 MHz. By means of the present disclosure, the cutting device for cutting composite materials can cut composite materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:切割裝置</p>
        <p type="p">1:承載模組</p>
        <p type="p">2:雷射產生模組</p>
        <p type="p">20:雷射投射器</p>
        <p type="p">21:雷射路徑調整器</p>
        <p type="p">B:複合材料</p>
        <p type="p">B1:氧化層</p>
        <p type="p">B2:氮化層</p>
        <p type="p">B3:碳化層</p>
        <p type="p">B4:基材</p>
        <p type="p">A:切割區域</p>
        <p type="p">L1:雷射光束</p>
        <p type="p">L0:雷射光源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="53" publication-number="202618959">
    <tif-files tif-type="multi-tif">
      <tif file="113139237.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片接合設備以及晶片接合方法</chinese-title>
        <english-title>WAFER BONDING EQUIPMENT AND WAFER BONDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241023B">H01L21/67</main-classification>
        <further-classification edition="200601120241023B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種晶片接合設備以及晶片接合方法。晶片接合設備包括一承載模組、一轉移模組、一限位模組、一接合模組、一控制模組以及一監控模組。承載模組被配置以用於承載一基板。轉移模組被配置以用於運送多個晶片元件。當轉移模組位於承載模組與限位模組之間時，控制模組驅使承載模組進行一接合動作、或者限位模組被驅使而進行一壓合動作，以使轉移模組的多個晶片元件接觸基板。控制模組驅使接合模組投射多個光束到基板上的多個黏接體，且控制模組驅使限位模組偵測自身的受力。監控模組用以監控該多個晶片元件的接合狀態，該監控模組利用不同延遲時間的監控用雷射對該多個晶片元件的形態參數進行探測，以即時監控該多個晶片元件的該接合狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer bonding equipment and a wafer bonding method are provided. The wafer bonding equipment includes a carrying module, a transfer module, a limiting module, a bonding module and a control module. The carrying module is configured to carry a substrate. The transfer module is configured to transport a plurality of wafer components. When the transfer module is located between the carrying module and the limiting module, the control module drives the carrying module to perform a bonding action, or the limiting module is driven to perform a pressing action, so as to make the plurality of wafer components of the transfer module to contact the substrate. The control module drives the bonding module to project a plurality of light beams to a plurality of bonding bodies on the substrate, and the control module drives the limiting module to detect its own force; and a monitoring module, configured to monitor the cutting status of the workpiece.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載模組</p>
        <p type="p">2:轉移模組</p>
        <p type="p">3:限位模組</p>
        <p type="p">30:載板元件</p>
        <p type="p">31:第一感測元件</p>
        <p type="p">E:晶片元件</p>
        <p type="p">P:基板</p>
        <p type="p">P1:黏接體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="54" publication-number="202618686">
    <tif-files tif-type="multi-tif">
      <tif file="113139243.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139243</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理方法及其視訊處理器</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND VIDEO PROCESSOR THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250109B">G06T3/40</main-classification>
        <further-classification edition="201701120250109B">G06T7/20</further-classification>
        <further-classification edition="200601120250109B">G06T1/00</further-classification>
        <further-classification edition="200601120250109B">G09G5/391</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃議弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊佳修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-SHIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭志嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIH-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像處理方法，用於一視訊處理器，包括在第一及第二時點分別接收到第一及第二輸入幀，以及產生一插補幀。當一第三時點未接收到任何輸入幀，插補幀是根據第一及第二輸入幀，利用外插來產生。當第三時點接收到一第三輸入幀且第一與第二時點之間的第一時間差實質上等於第二與第三時點之間的第二時間差，插補幀是根據第二及第三輸入幀，利用內插來產生。當第三時點接收到第三輸入幀且第一時間差實質上小於第二時間差，插補幀是根據第二及第三輸入幀，利用外插來產生。透過動態切換於外插與內插之間可提高影像播放的流暢度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing method for a video processor includes receiving a first input frame a first time point, receiving a second input frame a second time point, and creating a mend frame. When no input frame is received at a third time point, the mend frame is generated by extrapolation according to the first input frame and the second input frame. When a third input frame is received at a third time point and a first time difference between the first time point and second time point is substantially equal to a second time difference between the second time point and third time point, the mend frame is generated by interpolation according to the second input frame and the third input frame. When the third input frame is received at the third time point and the first time difference is substantially less than the second time difference, the mend frame is generated by extrapolation according to the second input frame and the third input frame. The video playback smoothness can be improved by dynamically switching between extrapolation and interpolation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="55" publication-number="202618254">
    <tif-files tif-type="multi-tif">
      <tif file="113139246.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射缺陷檢測系統</chinese-title>
        <english-title>LASER DEFECT DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241126B">G01N21/88</main-classification>
        <further-classification edition="200601120241126B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雷射缺陷檢測系統包括控制裝置、基座、雷射檢測裝置、光感測裝置及光學影像裝置。基座支撐待測物件。雷射檢測裝置包括雷射源及雷射幫浦，雷射檢測裝置以連續線掃描的方式朝向待測物件的檢測部位發射雷射光束。光感測裝置包括光感測模組及移載模組，移載模組連接光感測模組，移載模組用以使光感測模組於三維空間中移動，光感測模組用以接收雷射光束經待測物件的檢測部位反射的反射光，或是接收雷射光束穿過待測物件的檢測部位的穿透光，並輸出光訊號。光學影像裝置接收光訊號，依據光訊號產生光學圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laser defect detection system includes a control device, a base, a laser detection device, a light sensing device and an optical imaging device. The base supports the object to be tested. The laser detection device emits a laser beam toward the detection part of the object to be tested in a continuous line scan manner. The light sensing device includes a light sensing module and a transfer module. The transfer module is connected to the light sensing module. The transfer module is used to move the light sensing module in a three-dimensional space. The light sensing module is used for receiving a reflected light reflected by the detection part of the object to be tested, or receiving a penetrated light by the detection part of the object to be tested. The optical imaging device receives optical signals and generates optical images based on the optical signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z1:雷射缺陷檢測系統</p>
        <p type="p">2:控制裝置</p>
        <p type="p">4:基座</p>
        <p type="p">6:雷射檢測裝置</p>
        <p type="p">61:雷射光源</p>
        <p type="p">62:雷射幫浦</p>
        <p type="p">8:光感測裝置</p>
        <p type="p">81:光感測模組</p>
        <p type="p">82:移載模組</p>
        <p type="p">10:光學影像裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="56" publication-number="202619356">
    <tif-files tif-type="multi-tif">
      <tif file="113139247.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139247</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理方法與影像感測器</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND IMAGE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250108B">H04N25/58</main-classification>
        <further-classification edition="202301120250108B">H04N25/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃明燈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MING-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡勝富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像處理方法，包括於一影像感測器之一感測區域使用複數不同的曝光時間執行曝光以產生具多重曝光時間之影像資料，其中感測區域沿著一垂直方向被劃分為複數子區域，並且相鄰的兩個子區域對應於不同的曝光時間；根據具多重曝光時間之影像資料計算複數平均亮度，其中各平均亮度對應於不同的曝光時間的其中一者；以及根據平均亮度決定一最佳曝光時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing method includes performing exposure in a sensing region of an image sensor by using multiple different exposure time to generate image data of multiple exposure time, wherein the sensing region is divided into multiple sub-regions along a vertical direction and two adjacent sub-regions correspond to different exposure time; calculating multiple average luminance according to the image data of multiple exposure time, wherein each average luminance corresponds to one of the multiple different exposure time; and determining an optimum exposure time according to the multiple average luminance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S102,S104,S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="57" publication-number="202619306">
    <tif-files tif-type="multi-tif">
      <tif file="113139249.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線系統、天線偵測方法以及天線裝置</chinese-title>
        <english-title>ANTENNA SYSTEM, ANTENNA DETECTION METHOD AND ANTENNA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250109B">H04B7/02</main-classification>
        <further-classification edition="201501120250109B">H04B17/00</further-classification>
        <further-classification edition="200601120250109B">H01Q1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳英斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YIN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供天線系統、天線偵測方法以及天線裝置，而天線系統包含多個天線對、多個發射端開關、多個接收端開關、以及無線接收電路。各天線對包含發射端天線以及接收端天線，多個發射端開關分別耦接多個發射端天線，而多個接收端開關分別耦接多個接收端天線。無線接收電路耦接於多個接收端開關。多個發射端開關以及多個接收端開關依序地被切換，且耦接於同一天線對的發射端開關與接收端開關被同步地切換。無線接收電路經配置依序接收多個無線訊號且多個無線訊號包含有場域的多個區域的多個空間資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna system, an antenna detection method and an antenna device are provided, and the antenna system includes multiple antenna pairs, multiple transmitter switches, multiple receiver switches, and a wireless receiving circuit. Each of the antenna pairs includes a transmitter antenna and a receiver antenna, the transmitter switches are respectively coupled to the transmitter antennas, and the receiver switches are respectively coupled to the receiver antennas. The wireless receiving circuit is coupled to the receiver switches. The transmitter switches and multiple receiver switches are switched sequentially, and the transmitter switch and the receiver switch coupled to the same antenna pair are synchronously switched. The wireless receiving circuit is configured to receive multiple wireless signals in sequence, wherein the wireless signals respectively include a plurality of spatial information of multiple areas of the field.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一天線對</p>
        <p type="p">101:第一發射端天線</p>
        <p type="p">102:第一接收端天線</p>
        <p type="p">11:第一發射端開關</p>
        <p type="p">12:第一接收端開關</p>
        <p type="p">20:第二天線對</p>
        <p type="p">201:第二發射端天線</p>
        <p type="p">202:第二接收端天線</p>
        <p type="p">21:第二發射端開關</p>
        <p type="p">22:第二接收端開關</p>
        <p type="p">30:第三天線對</p>
        <p type="p">301:第三發射端天線</p>
        <p type="p">302:第三接收端天線</p>
        <p type="p">31:第三發射端開關</p>
        <p type="p">32:第三接收端開關</p>
        <p type="p">4:無線發射電路</p>
        <p type="p">5:無線接收電路</p>
        <p type="p">6:控制電路</p>
        <p type="p">M1:第一電路基板</p>
        <p type="p">M2:第二電路基板</p>
        <p type="p">M3:第三電路基板</p>
        <p type="p">M4:第四電路基板</p>
        <p type="p">M5:第五電路基板</p>
        <p type="p">M6:第六電路基板</p>
        <p type="p">M7:第七電路基板</p>
        <p type="p">M8:第八電路基板</p>
        <p type="p">V:車輛</p>
        <p type="p">H:主機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="58" publication-number="202618710">
    <tif-files tif-type="multi-tif">
      <tif file="113139253.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生成臉部圖像的方法及裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR GENERATING FACIAL IMAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250107B">G06V40/16</main-classification>
        <further-classification edition="202201120250107B">G06V10/82</further-classification>
        <further-classification edition="202301120250107B">G06N3/094</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳禎賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱國忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, KUO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種生成臉部圖像的方法，包括：藉由一生成式對抗網路中的一生成器生成一人臉圖像；藉由上述生成式對抗網路中的一鑑別器判斷上述人臉圖像是否為一真實人臉圖像；當上述鑑別器判斷上述人臉圖像為上述真實人臉圖像時，藉由至少一相似度判斷模型推論上述人臉圖像的一相似度分數；以及當上述相似度分數超過一門檻值時，判斷上述人臉圖像為上述真實人臉圖像並輸出上述人臉圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for generating facial images is provided. The method includes: generating, by a generator of a generative adversarial network (GAN), a facial image; and determining, by a discriminator of the GAN, whether the facial image is a real facial image; inferring, by at least one similarity determination model, a similarity score of the facial image when the discriminator determines that the facial image is the real face image; and determining that the facial image is the real face image and outputting the facial image when the similarity score exceeds a threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:方法</p>
        <p type="p">S705,S710,S715,S720,S725,S730,S735:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="59" publication-number="202618587">
    <tif-files tif-type="multi-tif">
      <tif file="113139268.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銀行分行特約商店管理系統及其方法</chinese-title>
        <english-title>BANK BRANCH MERCHANT MANAGEMENT SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">G06F17/40</main-classification>
        <further-classification edition="202301120250107B">G06Q40/02</further-classification>
        <further-classification edition="202301120250107B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣土地銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAND BANK OF TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種銀行分行特約商店管理系統，包括：通訊模組、特約商店篩選模組及通報彙整模組。上述通訊模組用以接收及傳輸資訊。上述特約商店篩選模組用以辨識行銷活動資訊之一關鍵字，並根據關鍵字制定的一篩選條件，再透過根據篩選條件自內部資料庫搜尋符合的特約商店，產生一特約商店清單。上述通報彙整模組用以依據特約商店清單，產生多個分行邀請通知，並透過通訊模組傳輸至對應的分行裝置，以及接收通訊模組傳輸的多個分行裝置的同意邀請名單，並彙整生成一參與特約商店清單。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bank branch merchant management system, includes a communication module, a merchant filtering module, and a notification aggregation module. The communication module is used to receive and transmit information. The merchant filtering module is used to identify a keyword related to marketing activity information and to establish filtering criteria based on the keyword. It then searches the internal database for qualified merchants according to the filtering criteria, generating a list of qualified merchants. The notification aggregation module generates multiple branch invitation notifications based on the list of qualified merchants and transmits them to the corresponding branch devices via the communication module. It also receives the list of accepted invitations from multiple branch devices transmitted by the communication module and aggregates them to generate a list of participating merchants.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:銀行分行特約商店管理系統</p>
        <p type="p">110:通訊模組</p>
        <p type="p">120:特約商店篩選模組</p>
        <p type="p">130:通報彙整模組</p>
        <p type="p">140:地圖貼標模組</p>
        <p type="p">150:分析模組</p>
        <p type="p">160:查詢模組</p>
        <p type="p">170:特約商店資料庫</p>
        <p type="p">175:行員裝置</p>
        <p type="p">180:帳戶系統</p>
        <p type="p">185:內部資料庫</p>
        <p type="p">190:外部資料庫</p>
        <p type="p">195:分行裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="60" publication-number="202619277">
    <tif-files tif-type="multi-tif">
      <tif file="113139272.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內建電容增倍器的運算放大器</chinese-title>
        <english-title>OPERATIONAL AMPLIFIER WITH BUILT-IN CAPACITOR MULTIPLIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H03F3/181</main-classification>
        <further-classification edition="200601120250107B">H03F1/56</further-classification>
        <further-classification edition="200601120250107B">G05F3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉權駐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUAN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種內建電容增倍器的運算放大器，其中該運算放大器包含一輸入電晶體、一電流鏡電路以及一電容器。該輸入電晶體依據一輸入訊號產生一輸入電流，以及該電流鏡電路依據該電流鏡電路的一電流輸入端子接收的與該輸入電流對應的一電流鏡輸入電流在該電流鏡電路的一電流輸出端子產生一電流鏡輸出電流，其中該電流輸出端子耦接至該運算放大器的一放大器輸出端子。另外，該電容器的第一端子耦接至該放大器輸出端子，以及該電容器的第二端子耦接至該電流輸入端子，使得該電容器在該放大器輸出端子的等效電容值透過該電流鏡電路被增倍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operational amplifier with a built-in capacitor multiplier is provided, where the operational amplifier includes an input transistor, a current mirror circuit and a capacitor. The input transistor generates an input current according to an input signal, and the current mirror circuit generates a current mirror output current on a current output terminal of the current mirror circuit according to a current mirror input current corresponding to the input current received by a current input terminal of the current mirror circuit, where the current output terminal is coupled to an amplifier output terminal of the operational amplifier. In addition, a first terminal of the capacitor is coupled to the amplifier output terminal, and a second terminal of the capacitor is coupled to the current input terminal, making an equivalent capacitance of the capacitor seen on the amplifier output terminal be multiplied by the current mirror circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:運算放大器</p>
        <p type="p">100:電流鏡電路</p>
        <p type="p">VDD,VSS:參考電壓</p>
        <p type="p">MN0~MN2:N型電晶體</p>
        <p type="p">MP1~MP2:P型電晶體</p>
        <p type="p">CA:電容器</p>
        <p type="p">VG0,VIP,VIN,VBP,VOUT:節點</p>
        <p type="p">IN1,IP2:電流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="61" publication-number="202618295">
    <tif-files tif-type="multi-tif">
      <tif file="113139275.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於自動測試系統的彈簧針跨接裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">G01R1/067</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利亙通國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏廣炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於自動測試系統的彈簧針跨接裝置，其係在一銜接件的一端設有一螺旋彈簧套環，另一端設有一彈簧針搭接端子，該螺旋彈簧套環與該彈簧針搭接端子皆具有導電能力，而且該螺旋彈簧套環與該彈簧針搭接端子之間形成電連接，因此只要將此彈簧針跨接裝置跨接於一彈簧針介面的二彈簧針之間，即可使該等彈簧針之間形成電連接，由於此彈簧針跨接裝置非常容易實現輕量化與小型化，構造簡單又易於使用，而且使用過程不易損傷脆弱的該等彈簧針，因此可以既方便又快速且安全的進行該等彈簧針之間的跨接，有利於加速進行自動測試系統的靈活調試與應用。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:彈簧針跨接裝置</p>
        <p type="p">11:銜接件</p>
        <p type="p">12:螺旋彈簧套環</p>
        <p type="p">13:彈簧針搭接端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="62" publication-number="202618122">
    <tif-files tif-type="multi-tif">
      <tif file="113139280.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139280</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可手動操作之門機裝置</chinese-title>
        <english-title>DOOR OPERATOR CAPABLE OF MANUAL OPERATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">E06B9/78</main-classification>
        <further-classification edition="201501120241204B">E05F15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝仲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝仲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可手動操作之門機裝置，包括一出力單元、一驅動單元、一變速單元、一煞車單元及一手拉鍊單元，其中該驅動單元係設置於該變速單元及該煞車單元之間，該出力單元係設置在該驅動單元、該變速單元及該煞車單元之一第一側，而該手拉鍊單元係設置在該驅動單元、該變速單元及該煞車單元的相對於該第一側之第二側，其中於一手動操作模式時，該煞車單元提供該驅動單元一煞車力，該手拉鍊單元係配置以產生一轉動慣性，該轉動慣性透過該煞車單元、該驅動單元與該變速單元被轉移至該出力單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A door operator capable of manual operations includes an output unit, a driving unit, a gear unit, a brake unit, and a pulling-chain unit. The driving unit is disposed between the gear unit and the brake unit. The output unit is disposed on a first side of the driving unit, the gear unit, and the brake unit. The pulling-chain is disposed on a second side opposite to the first side of the driving unit, the gear unit, and the brake unit. During a manual operation mode, the brake unit is configured to provide braking forces on the driving unit and the pulling-chain unit generates rotational inertia and the rotational inertia is transferred to the output unit via the brake unit, the driving unit and the gear unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:門機裝置</p>
        <p type="p">10:出力軸</p>
        <p type="p">12:齒輪</p>
        <p type="p">14:鏈輪</p>
        <p type="p">16:鏈輪</p>
        <p type="p">40:鏈條</p>
        <p type="p">50:電磁鐵軸</p>
        <p type="p">64:齒輪</p>
        <p type="p">68:電磁鐵固定座</p>
        <p type="p">70:機架</p>
        <p type="p">72:轉軸</p>
        <p type="p">74:轉軸</p>
        <p type="p">76:齒輪</p>
        <p type="p">78:轉盤</p>
        <p type="p">84:手拉鍊</p>
        <p type="p">90:齒輪</p>
        <p type="p">100:感測裝置</p>
        <p type="p">A:出力單元</p>
        <p type="p">B:驅動單元</p>
        <p type="p">C:變速單元</p>
        <p type="p">D:煞車單元</p>
        <p type="p">E:手拉鍊單元</p>
        <p type="p">F:轉動檢知單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="63" publication-number="202617220">
    <tif-files tif-type="multi-tif">
      <tif file="113139282.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動車停車位防火系統及其滅火方法</chinese-title>
        <english-title>FIRE EXTINGUISHING SYSTEM FOR ELECTRIC VEHICLE PARKING SPACES AND FIRE-FIGHTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">A62C3/00</main-classification>
        <further-classification edition="200601120241105B">A62C2/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井藤實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E-FUJI COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動車停車位防火系統，其包括：停車平台有兩長邊和兩短邊、收納本體設置於停車平台之其中一短邊並且用以收納摺疊的防火布、第一手臂裝置設置於該停車平台之其中一長邊並且該第一手臂裝置與該防火布之一部分相連、第二手臂裝置設置於該停車平台之另一長邊並且該第二手臂裝置與該防火布之另一部分相連，以及感應模組設置在該電動車附近。其中，感應模組感測到電動車起火時，產生感應訊號至第一或第二手臂裝置，並且驅動第一和第二手臂裝置於停車平台之兩長邊牽引防火布從收納本體伸出並展開以覆蓋該電動車整體且阻絕外部空氣進入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fire extinguishing system for electric vehicle parking spaces includes: a parking space with two long sides and two short sides, a storage unit installed on one of the short sides of the parking space, which used to store a folded fire-resistant cloth, a first arm device installed on one of the long sides of the parking platform, connected to one part of the fire-resistant cloth, a second arm device installed on the other long side of the parking platform, connected to another part of the fire-resistant cloth, and a sensing module installed on the parking space. When the sensing module detects a fire in the electric vehicle, it generates a sensing signal to the first or second arm device. This drives the first and second arm devices to pull the fire-resistant cloth out from the storage unit along the two long sides of the parking platform, unfolding it to cover the entire electric vehicle and prevent external air from entering.</p>
      </isu-abst>
      <representative-img>
        <p type="p">211:電動車</p>
        <p type="p">3:停車位防火系統</p>
        <p type="p">31:收納本體</p>
        <p type="p">311:上蓋</p>
        <p type="p">3111:前蓋</p>
        <p type="p">3113:後蓋</p>
        <p type="p">33:第一手臂裝置</p>
        <p type="p">331:第一上蓋</p>
        <p type="p">333:第一本體</p>
        <p type="p">35:第二手臂裝置</p>
        <p type="p">351:第二上蓋</p>
        <p type="p">353:第二本體</p>
        <p type="p">41:停車平台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="64" publication-number="202618703">
    <tif-files tif-type="multi-tif">
      <tif file="113139285.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自然語言影像搜尋方法及其影像搜尋系統</chinese-title>
        <english-title>NATURAL LANGUAGE IMAGE SEARCHING METHOD AND IMAGE SEARCHING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250109B">G06V10/70</main-classification>
        <further-classification edition="202001120250109B">G06F40/20</further-classification>
        <further-classification edition="201901120250109B">G06F16/73</further-classification>
        <further-classification edition="200601120250109B">G06T1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶睿通訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIVOTEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳仁智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自然語言影像搜尋方法，應用於包含有一影像分析單元、一資料管理單元及一指令輸入單元之一影像搜尋系統。該自然語言影像搜尋方法包含有該影像分析單元之一影像特徵向量編碼器接收一偵測影像並產生一影像特徵向量，該影像分析單元發送該偵測影像、該影像特徵向量、和關聯於該偵測影像之一時間戳記到該資料管理單元，該指令輸入單元之一文字編碼器依照一查詢語句產生一文本特徵向量並發送到該資料管理單元，以及該資料管理單元依照比對結果判斷使用自然語言於該指令輸入單元生成的該查詢語句是否符合該偵測影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A natural language image searching method is applied to an image searching system including an image analysis device, a data management device and an instruction input device. The natural language image searching method includes an image feature vector encoder of the image analysis device receiving a detection image and generating an image feature vector, the image analysis device transmitting the detection image, the image feature vector, and a time stamp associated with the detection image to the data management device, a text encoder of the instruction input device generating and transmitting a text feature vector to the data management device according to a query statement, and the data management device determining whether the query statement generated by the instruction input device via natural language conforms to the detection image according to a comparison result between the text feature vector and the image feature vector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:影像搜尋系統</p>
        <p type="p">12:資料管理單元</p>
        <p type="p">14:影像分析單元</p>
        <p type="p">16:指令輸入單元</p>
        <p type="p">18:影像特徵向量編碼器</p>
        <p type="p">20:影像分析器</p>
        <p type="p">22:文字編碼器</p>
        <p type="p">24:時間段解碼器</p>
        <p type="p">26:輸入介面</p>
        <p type="p">28:運算處理器</p>
        <p type="p">30:儲存器</p>
        <p type="p">32:資料解碼器</p>
        <p type="p">Id:偵測影像</p>
        <p type="p">Ts:時間戳記和/或相關資訊</p>
        <p type="p">Qs:查詢語句</p>
        <p type="p">Vif:影像特徵向量</p>
        <p type="p">Vt:文本特徵向量</p>
        <p type="p">Cf:計算機格式訊息</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="65" publication-number="202618654">
    <tif-files tif-type="multi-tif">
      <tif file="113139290.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>證券投資部位預測系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250107B">G06Q40/04</main-classification>
        <further-classification edition="202301120250107B">G06Q40/02</further-classification>
        <further-classification edition="201201120250107B">G06Q10/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>第一商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIRST COMMERCIAL BANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝信誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種證券投資部位預測系統及其方法，該證券投資部位預測系統包含一資料伺服器及一電連接於該資料伺服器的推算伺服器。該資料伺服器儲存一對應於一客戶的股利入帳資訊，該股利入帳資訊包含一股票識別資料、一入帳金額及一入帳日期。該推算伺服器接收來自該資料伺服器的該股利入帳資訊；該推算伺服器根據該股票識別資料及該入帳日期搜尋出一現金股利，並根據該股票識別資料搜尋出一股價；該推算伺服器根據該入帳金額及該現金股利計算出一股票持有量，再根據該股票持有量及該股價計算出一投資金額。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:證券投資部位預測系統</p>
        <p type="p">1:資料伺服器</p>
        <p type="p">2:推算伺服器</p>
        <p type="p">3:資產配置伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="66" publication-number="202618789">
    <tif-files tif-type="multi-tif">
      <tif file="113139291.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139291</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快閃記憶體裝置的讀取方法及其讀取命令格式</chinese-title>
        <english-title>READ METHOD AND READ COMMAND FORMAT FOR FLSH MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">G11C16/26</main-classification>
        <further-classification edition="200601120250108B">G11C16/10</further-classification>
        <further-classification edition="200601120250108B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳漢松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAN-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉榤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快閃記憶體裝置的讀取方法及讀取命令格式。讀取方法包括：基於讀取命令中的特別碼，判斷要讀取的區塊是否為開放區塊。開放區塊具有已寫入區域與未寫入區域。在判斷該區塊不是開放區塊時，且讀取該區塊之選擇字元線時，對區塊中的非選擇字元線施加第一讀取通過偏壓組。在判斷該區塊是開放區塊時，且讀取該區塊之選擇字元線時，對已寫入區域中的非選擇字元線施加第二讀取通過偏壓組，並且未寫入區域中的非選擇字元線施加第三讀取通過偏壓組。本發明適用3D NAND快閃記憶體，並且具備高容量與高性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A read method and read command format for a flash memory device are provided. The read method includes: determining whether a block to be read is an open block based on a special code in a read command, wherein the open block has a written area and an unwritten area; when it determines the block is not the open block, during reading a selected word line, unselected word lines are applied with a first read pass bias set; when it determines the block is the open block, during reading the selected word line, unselected word lines in the written area are applied with a second read pass bias set and unselected word lines in the non-written area are applied with a third read pass bias set. The invention is suitable for three-dimensional NAND flash memory, and is provided with high capacity and high performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S102、S104、S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="67" publication-number="202618507">
    <tif-files tif-type="multi-tif">
      <tif file="113139292.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">G06F1/16</main-classification>
        <further-classification edition="200601120241030B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹建峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHIEN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒明政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, MING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括裝置主體、觸控板以及連動機構。裝置主體具有第一連接部。觸控板可動設置於裝置主體而適於升降於第一位置與第二位置之間。連動機構連接於觸控板且具有第二連接部。當觸控板沿第一方向從第一位置被下壓至第二位置時，觸控板藉由連動機構帶動第二連接部沿第二方向卡固於第一連接部。連動機構包括至少一第一滑動件及第二滑動件，至少一第一滑動件耦接於觸控板，第二滑動件耦接於至少一第一滑動件且連接於第二連接部，觸控板適於帶動至少一第一滑動件沿第三方向移動，至少一第一滑動件適於帶動第二滑動件沿第二方向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a device main body, a touch pad and a linkage mechanism. The device main body has a first connecting part. The touch pad is movably disposed on the device main body and is adapted to elevate between a first position and a second position. The linkage mechanism is connected to the touch pad and has a second connecting part. When the touch pad is pushed downwardly from the first position to the second position along a first direction, the touch pad drives the second connecting part to fix to the first connecting part along a second direction by the linkage mechanism. The linkage mechanism includes at least one first sliding component and a second sliding component. The at least one first sliding component is coupled to the touch pad. The second sliding component is coupled to the at least one first sliding component and connected to the second connecting part. The touch pad is adapted to drive the at least one first sliding component to move along a third direction. The at least one first sliding component is adapted to drive the second sliding component to move along a second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:裝置主體</p>
        <p type="p">111:第一連接部</p>
        <p type="p">113:鍵盤模組</p>
        <p type="p">120:觸控板</p>
        <p type="p">R1:第一區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="68" publication-number="202618831">
    <tif-files tif-type="multi-tif">
      <tif file="113139293.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵盤配件</chinese-title>
        <english-title>KEYBOARD ACCESSORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H01H13/705</main-classification>
        <further-classification edition="200601120250107B">H01H13/70</further-classification>
        <further-classification edition="200601120250107B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾學威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSUEH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊惠婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, HUEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鍵盤配件，包括收納座、第一按鍵、底座及多個第二按鍵。收納座具有第一安裝部、相對於第一安裝部的第二安裝部及位於第一安裝部與第二安裝部之間的多個第三安裝部。第一按鍵可拆地卡接於第一安裝部。底座可拆地套接於第二安裝部。多個第二按鍵可拆地卡接於多個第三安裝部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A keyboard accessory including a storage base, a first key, a base, and a plurality of second keys is provided. The storage base has a first mounting part, a second mounting part opposite to the first mounting part, and a plurality of third mounting parts located between the first mounting part and the second mounting part. The first key is detachably engaged with the first mounting part. The base is detachably sleeved on the second mounting part. The second keys are detachably engaged with the third mounting parts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鍵盤配件</p>
        <p type="p">110:收納座</p>
        <p type="p">111:第一安裝部</p>
        <p type="p">111a、113a:凹槽</p>
        <p type="p">113:第三安裝部</p>
        <p type="p">113a:凹槽</p>
        <p type="p">120:第一按鍵</p>
        <p type="p">130:底座</p>
        <p type="p">140:第二按鍵</p>
        <p type="p">1B-1B、1C-1C:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="69" publication-number="202618778">
    <tif-files tif-type="multi-tif">
      <tif file="113139297.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寫入電路</chinese-title>
        <english-title>WRITING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">G11C11/4197</main-classification>
        <further-classification edition="200601120250109B">G11C7/22</further-classification>
        <further-classification edition="202301120250109B">H10B63/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭仲皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴成孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHENG-HSIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">寫入電路包括寫入電壓產生器、參考電壓提供器以及比較電路。寫入電壓產生器提供寫入電壓至電阻式記憶胞陣列的各電阻式記憶胞以執行寫入操作。參考電壓提供器在寫入操作中，根據參考元件的電阻值以產生並提供參考電壓。比較電路藉由比較參考電壓與目標值來產生比較結果。其中，寫入電壓產生器根據比較結果來調整寫入電壓的維持時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A writing circuit includes a writing voltage generator, a reference voltage provider and a comparison circuit. The writing voltage generator generates a writing voltage for performing a writing operation on each resistive memory cell among a resistive memory cell array. The reference voltage provider, during the writing operation, generates and provides a reference voltage according to a resistance of a reference device. The comparing circuit generates a comparison result by comparing the reference voltage with a target value. The writing voltage generator adjusts a maintenance time of the writing voltage according to the comparison result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:寫入電路</p>
        <p type="p">101:電阻式記憶胞陣列</p>
        <p type="p">110:寫入電壓產生器</p>
        <p type="p">120:參考電壓提供器</p>
        <p type="p">130:比較電路</p>
        <p type="p">BL:位元線</p>
        <p type="p">CR:比較結果</p>
        <p type="p">MC1~MC6:電阻式記憶胞</p>
        <p type="p">SL:源極線</p>
        <p type="p">TGV1、TGV2:目標值</p>
        <p type="p">VREF:參考電壓</p>
        <p type="p">VW:寫入電壓</p>
        <p type="p">WL1~WL6:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="70" publication-number="202619055">
    <tif-files tif-type="multi-tif">
      <tif file="113139312.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝裝置及其封裝基板</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE DEVICE AND PACKAGE SUBSTRATE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241025B">H01L23/28</main-classification>
        <further-classification edition="200601120241025B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創意電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL UNICHIP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳耀祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAO-TSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊昇帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉啟樓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHI-LOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳仲璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝基板包含防焊層、複合層、接地層、及訊號層。防焊層上設置有多個電源接點、多個接地接點、多個第一訊號接點及多個第二訊號接點。複合層上設置有多個電源平面與多個第一訊號繞線。多個電源平面對應耦接多個電源接點。多個第一訊號繞線對應耦接多個第一訊號接點。接地層上設置有接地線路。接地線路耦接多個接地接點。訊號層上設置有多個第二訊號繞線。多個第二訊號繞線對應耦接多個第二訊號接點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package substrate includes a solder mask layer, a composite layer, a ground layer, and a signal layer. Multiple power contacts are arranged on the solder mask layer, multiple ground contacts, multiple first signal contacts, and multiple second signal contacts. Multiple power planes and multiple first signal routings are arranged on the composite layer. The multiple power planes are correspondingly coupled with the multiple power contacts. The multiple first signal routings are correspondingly coupled with the multiple signal contacts. The ground line is arranged on the ground line. The ground line is coupled with the multiple ground contacts. The multiple signal routings are arranged on the signal layer. The multiple signal routings are correspondingly coupled with the multiple signal contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:封裝基板</p>
        <p type="p">BG1~BG4:接點</p>
        <p type="p">BP1~BP4:接點</p>
        <p type="p">BR1~BR2:接點</p>
        <p type="p">BT1~BT2:接點</p>
        <p type="p">cyc1~cyc4:去耦迴路</p>
        <p type="p">EDG:邊緣</p>
        <p type="p">L1:防焊層</p>
        <p type="p">L2:複合層</p>
        <p type="p">L3:接地層</p>
        <p type="p">L4:訊號層</p>
        <p type="p">RT1、RT2:訊號繞線</p>
        <p type="p">PP1~PP4:電源平面</p>
        <p type="p">VD1~VD4:電源電壓</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="71" publication-number="202617395">
    <tif-files tif-type="multi-tif">
      <tif file="113139319.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種鋼筒上蓋與外殼間銲道切割裝置</chinese-title>
        <english-title>A MACHINE FOR CUTTING WELDS BETWEEN THE UPPER COVER AND THE OUTER SHELL OF A CANISTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B26D3/10</main-classification>
        <further-classification edition="200601120241204B">B26D5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李琨瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林友仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張添昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TEIN-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋼筒上蓋與外殼間銲道切割裝置，係包括一銲道切割裝置支架、二滑軌、二連接板、一自動進刀組件、一懸臂、二刀座、一氣壓缸組件、一自動添加切削液設備、及二刀具所構成。藉此，本創作採用雙刀座設計，可快速進行水平方向調整並附有刻度參考，使調整刀口切削位置更加快速，搭配氣壓缸對活動銷的上下動作控制，可自動控制進刀，並能在銲道上方自動進行切削劑的均勻添加，提高切削效率，既可有效減少現場操作人員接近密封鋼筒之時間與降低輻射吸收劑量率，並節省現場技術人力成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A steel canister upper cover and shell between the channel cutting machine, which is composed of a channel cutting device support, two slide rails, two connecting plates, an automatic feed assembly, a cantilever arm, two tool holders, a pneumatic cylinder assembly, an automatic cutting fluid addition equipment, and two cutting tools. With this, this creation adopts a double tool-holder design, which can quickly adjust the horizontal direction and is accompanied by a scale reference, so that the cutting position of the knife edge can be adjusted more quickly, and the upper and lower action control of the movable pin by the pneumatic cylinder can automatically control the feed, and can automatically add the cutting agent above the channel to improve the cutting efficiency, which can effectively reduce the time for the on-site operator to approach the sealed steel cylinder and reduce the radiation absorption dose rate, and save the on-site technical labor cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鋼筒上蓋與外殼間銲道切割裝置</p>
        <p type="p">11:銲道切割裝置支架</p>
        <p type="p">111:固定座</p>
        <p type="p">12、13:滑軌</p>
        <p type="p">121、131:滑軌底座</p>
        <p type="p">122、132:滾動層</p>
        <p type="p">14:連接板</p>
        <p type="p">15:自動進刀固定組件</p>
        <p type="p">151:自動進刀基座</p>
        <p type="p">152:自動進刀手臂</p>
        <p type="p">16:懸臂</p>
        <p type="p">17:刀座</p>
        <p type="p">171:滑台</p>
        <p type="p">172:刀具支架</p>
        <p type="p">173:滑座</p>
        <p type="p">18:氣壓缸組件</p>
        <p type="p">181:氣壓缸基座</p>
        <p type="p">182:氣壓缸</p>
        <p type="p">183:氣壓缸連接台</p>
        <p type="p">184:活動銷</p>
        <p type="p">19:自動添加切削劑設備</p>
        <p type="p">191:切削劑槽座</p>
        <p type="p">192:切削劑槽</p>
        <p type="p">193:噴嘴</p>
        <p type="p">194:調節閥</p>
        <p type="p">20:刀具</p>
        <p type="p">201:棘輪</p>
        <p type="p">202:進刀螺桿</p>
        <p type="p">203:鉋刀</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="72" publication-number="202617362">
    <tif-files tif-type="multi-tif">
      <tif file="113139320.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棘輪工具之換向制動構造</chinese-title>
        <english-title>REVERSING BRAKE STRUCTURE FOR A RATCHET TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B25B13/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林琮淂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林琮淂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳居亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種棘輪工具之換向制動構造，該棘輪工具具有一工作件，該工作件用於套接一受動工具，該工作件的側向外周形成數個第一凸齒，該換向制動構造，包括一制動塊、一控制件、一抵掣件及一彈簧，其中該制動塊位於該工作件與該控制件之間，該制動塊具有一第一側及一第二側，該第一側與該工作件相鄰，該控制件形成一容室，該抵掣件及該彈簧分別設於該容室，該抵掣件軸向的一端形成一彎弧狀的抵掣面抵掣該第二側，該彈簧抵持該抵掣件及該控制件，該第二側及該抵掣面沿著一第一方向延伸並形成直線接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a reversing brake structure for a ratchet tool, the ratchet tool comprising a working member, the working member being configured to engage a driven tool. The working member comprises a plurality of first protruding teeth formed on its lateral outer periphery. The reversing brake structure comprises a brake block, a control member, an abutment member, and a spring. The brake block is positioned between the working member and the control member, the brake block comprising a first side and a second side, wherein the first side is adjacent to the working member. The control member comprises a receiving chamber, and the abutment member and the spring are respectively disposed within the receiving chamber. An end of the abutment member along its axial direction forms an arcuate abutment surface that abuts against the second side. The spring biases the abutment member and the control member, with the second side and the abutment surface extending along a first direction and forming a linear contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工作件</p>
        <p type="p">12:第一凸齒</p>
        <p type="p">20:制動塊</p>
        <p type="p">30:控制件</p>
        <p type="p">40:抵掣件</p>
        <p type="p">X:第二方向</p>
        <p type="p">Y:第一方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="73" publication-number="202617459">
    <tif-files tif-type="multi-tif">
      <tif file="113139335.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拉瓦爾噴射器與高效製作氫氣汽車節能結合裝置</chinese-title>
        <english-title>LAVAL INJECTOR AND EFFICIENT PRODUCTION OF HYDROGEN VEHICLE ENERGY-SAVING COMBINATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">B60K15/10</main-classification>
        <further-classification edition="200601120250423B">C25B1/02</further-classification>
        <further-classification edition="200601120250423B">B60K15/06</further-classification>
        <further-classification edition="200601120250423B">F02M27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦達能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINDA ENERGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古煥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, HUANN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古騏豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, CHI-HOW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明以拉瓦爾噴射器技術與高效製氫結合裝置，通過空氣取水器將水體收集儲存再以高效電解解離器將水體分解為氫氣和氧氣並予以儲存，並利用氫燃料電池產店能或氫氣注入原燃料內燃機來驅動汽車，並利用噴出之氣體結合拉瓦爾噴射器優化空氣動力學，提升汽車效率與節能效果。該系統採用回收汽車尾氣水體技術，實現節能與減少污染，並運用渦流管進行車廂空調的高效溫度控制，提供汽車節能和環保的整體解決方案故所述裝置計有：一空氣取水器、一水體儲存器、一高效電解器、一氫氣儲存槽、一氫燃料電池、一氧氣儲存槽、一氫氧內燃、一拉瓦爾效益噴射管、一速度控制系統、一汽車尾氣水體回收器、一渦流管、一空調機、一車廂空調出氣口裝置所組成。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">110:空氣取水器</p>
        <p type="p">120:水體儲存器</p>
        <p type="p">130:高效電解器</p>
        <p type="p">140:氫氣儲存槽</p>
        <p type="p">150:氫燃料電池</p>
        <p type="p">160:氧氣儲存槽</p>
        <p type="p">170:氫氧內燃器</p>
        <p type="p">180:拉瓦爾效益噴射管</p>
        <p type="p">190:速度控制系統</p>
        <p type="p">200:汽車尾氣水體回收器</p>
        <p type="p">210:渦流管</p>
        <p type="p">220:空調機</p>
        <p type="p">230:車廂空調出氣口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="74" publication-number="202619219">
    <tif-files tif-type="multi-tif">
      <tif file="113139339.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性合金在以磁鐵加熱水體解離產氫氧發電結合裝置</chinese-title>
        <english-title>MAGNETIC ALLOY IN A HYDROGEN AND OXYGEN GENERATION DEVICE FOR POWER GENERATION BY HEATING WATER USING MAGNETS.</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">H02J7/00</main-classification>
        <further-classification edition="200601120250703B">H02N11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦達能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINDA ENERGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古煥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, HUANN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古騏豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, CHI-HOW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明磁性合金在以磁鐵加熱水體解離產氫氧發電結合裝置，其包括：一氫氧分離反應器由一磁性合金儲存槽產生水體解離磁動能，以一備用水體儲存槽之水體輸送至用磁鐵感應加熱之一水體加熱儲存槽以一磁鐵感應加熱器加熱至300~600℃存入一蒸氣增壓儲存槽之蒸氣與磁性合金儲存槽之磁性合金傳送至一氫氧分離反應器產生氫氣與氧氣；一氫燃料電池組合裝置由產出之氫氧氣以一氫氫氧氣體分離器作氫氧氣分離其中氫氣輸速至一氫氣純化儲存槽純化後儲存而氧氣輸送至一氧氣純化儲存槽純化後儲存在將氫氣氧氣分別送至氫燃料電池兩側之化學反應產生電力裝置組成；一電力整合儲存器由氫燃料電池組合產生之電力作交直流、電壓高低之整合運用與儲能之裝至所祖成。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">110.:磁性合金儲存槽</p>
        <p type="p">120.:備用水體儲存槽</p>
        <p type="p">130.:水體加熱儲存槽</p>
        <p type="p">140.:蒸氣增壓儲存槽</p>
        <p type="p">150.:磁鐵感應加熱器</p>
        <p type="p">160.:氫氧分離反應器</p>
        <p type="p">210.:氫氧氣體分離器</p>
        <p type="p">220.:氫氣純化儲存槽</p>
        <p type="p">230.:氧氣純化儲存槽</p>
        <p type="p">240.:氫燃料電池組合</p>
        <p type="p">300.:電力整合儲儲器</p>
        <p type="p">310.:市電並聯結合器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="75" publication-number="202618250">
    <tif-files tif-type="multi-tif">
      <tif file="113139342.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139342</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體檢測系統</chinese-title>
        <english-title>FLUID DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01N21/65</main-classification>
        <further-classification edition="200601120241104B">G01N21/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎宇泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅郁翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YU HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種流體檢測系統及方法。流體檢測方法包含以處理器執行：拉曼量測裝置取得對應於量測時間的拉曼光譜，從太赫茲量測裝置取得對應於量測時間的太赫茲光譜，移除拉曼光譜中的背景光譜以產生校正拉曼光譜，以及利用檢測模型基於校正拉曼光譜太赫茲光譜取得待測流體的待測物類型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure proposes a fluid detection system and method. The fluid detection method, performed by a processor, includes: obtaining a Raman spectrum corresponding to measuring time, obtaining a Terahertz spectrum corresponding to the measuring time, removing a background spectrum from the Raman spectrum to generate a corrected Raman spectrum, using a detection model based on the corrected Raman spectrum and the Terahertz spectrum to obtain a subject type of the to-be-detected fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S111,S113,S115,S117:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="76" publication-number="202618593">
    <tif-files tif-type="multi-tif">
      <tif file="113139344.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防火牆規則的風險審核與規則建立之系統及其方法</chinese-title>
        <english-title>RISK REVIEW AND RULE CREATION OF FIREWALL RULE SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250109B">G06F21/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彰化商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG HWA COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱冠雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, KUAN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防火牆規則的風險審核與規則建立之系統及其方法，申請者裝置提供防火牆規則申請資訊至防火牆管理伺服器，防火牆規則申請資訊中的申請類型為一般類型時直接對防火牆規則申請資訊進行風險審核，當防火牆規則申請資訊被審核為安全規則時直接建立相關的防火牆規則，當防火牆規則申請資訊被審核為高風險規則時提供防火牆規則風險資訊至申請者裝置，若申請者裝置將修改申請類型的防火牆規則申請資訊再次提供至防火牆管理伺服器，防火牆管理伺服器提供基於防火牆規則申請資訊生成的主管審核資訊至主管審核裝置進行審核，當主管審核資訊的結果回應為核准回應，防火牆管理伺服器再建立與防火牆規則申請資訊相關的防火牆規則，藉此可以達成提供便捷審核與建立防火牆規則的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A risk review and rule creation of firewall rule system and a method thereof are provided. Firewall rule application information is provided to firewall management server from applicant device. Firewall rule application information is risk review directly when application type of firewall rule application information is general type. Firewall rules are created directly when firewall rule application information is reviewed as security rule. Firewall rule risk information is provided to applicant device when firewall rule application information is reviewed as high risk rule. Supervisor review information which is generated based on firewall rule application information is provided to supervisor review device from firewall management server when modify application type of firewall rule application information is provided to firewall management server from applicant device again. Firewall rules related to firewall rule application information are created by firewall management server when result response of supervisor review information is approval response. Therefore, the efficiency of providing review and creation of firewall rule conveniently may be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:申請者裝置</p>
        <p type="p">20:主管審核裝置</p>
        <p type="p">30:防火牆管理伺服器</p>
        <p type="p">31:風險審核模組</p>
        <p type="p">32:風險資訊生成模組</p>
        <p type="p">33:審核資訊生成模組</p>
        <p type="p">34:防火牆規則建立模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="77" publication-number="202619486">
    <tif-files tif-type="multi-tif">
      <tif file="113139345.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非揮發性記憶體結構及其製造方法</chinese-title>
        <english-title>NVM MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250108B">H10B41/30</main-classification>
        <further-classification edition="202301120250108B">H10B43/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIH-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡博安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, BO-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車行遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHE, SHYNG-YEUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種非揮發性記憶體結構，包括具有凹陷部的基底、元件隔離結構、井區、浮動閘極、選擇閘極、以及閘極介電層。元件隔離結構定義出基底內相鄰的主動區與耦合區，且凹陷部位於耦合區內。井區形成於基底的耦合區中。選擇閘極設置於基底上並橫跨主動區。浮動閘極包括主體部、水平延伸部與垂直延伸部。主體部位於選擇閘極的一側並橫跨主動區。水平延伸部設置於耦合區上，且垂直延伸部設置於凹陷部內並與水平延伸部相接。閘極介電層介於浮動閘極與基底之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-volatile memory (NVM) structure includes a substrate with a recess portion, a device isolation structure, a well region, a floating gate, a select gate, and a gate dielectric layer. The device isolation structure defines adjacent active region and coupling region in the substrate, and the recess portion is disposed in the coupling region. The select gate is disposed on the substrate and across over the active region. The floating gate includes a main part, a horizontal extension part and a vertical extension part. The main part is disposed at one side of the selection gate and across over the active region. The horizontal extension part is disposed over the coupling region, and the vertical extension part is disposed in the recess portion and connected with the horizontal extension part. The gate dielectric layer is between the floating gate and the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">102:元件隔離結構</p>
        <p type="p">104:閘極介電層</p>
        <p type="p">106:襯層</p>
        <p type="p">108:間隙壁</p>
        <p type="p">AA:主動區</p>
        <p type="p">CP:耦合區</p>
        <p type="p">d1、d2:深度</p>
        <p type="p">FG:浮動閘極</p>
        <p type="p">HE:水平延伸部</p>
        <p type="p">MP:主體部</p>
        <p type="p">R1:凹陷部</p>
        <p type="p">VE:垂直延伸部</p>
        <p type="p">W1、W2:井區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="78" publication-number="202617442">
    <tif-files tif-type="multi-tif">
      <tif file="113139355.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴墨晶片結構</chinese-title>
        <english-title>INKJET CHIP STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B41J2/07</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖文雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種噴墨晶片結構，包含噴墨晶片以及噴孔片。噴孔片設置於噴墨晶片上。噴墨晶片具有數個供墨孔、數個第一控制接點、數個第二控制接點以及數個墨滴產生器。其中，供墨孔提供墨水，而第一、二控制接點則設置於噴墨晶片上，分別接收來自外部的噴墨控制訊號和電源訊號，而第二控制接點的面積為第一控制接點的兩倍以上(包含兩倍)。此外，墨滴產生器對應能多種顏色種類，每一種的顏色所對應的墨滴產生器數量大於等於600個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inkjet chip structure is disclosed and includes an inkjet chip and a nozzle plate. The nozzle plate is disposed on the inkjet chip. The inkjet chip includes plural ink supply holes, plural first control pads, plural second control pads and plural ink droplet generators. The ink supply holes provide ink. The first control pads and the second control pads are disposed on the inkjet chip and receive inkjet control signals and power signals from external sources, respectively. The area of each of the second control pads is equal to or more than twice of the area of each of the first control pads. The ink droplet generators can be corresponded to multiple color types, and the number of ink droplet generators corresponding to each color is greater than or equal to 600.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:噴墨晶片結構</p>
        <p type="p">20:噴墨晶片</p>
        <p type="p">22:墨滴產生器</p>
        <p type="p">23:供墨孔</p>
        <p type="p">24a:第一控制接點</p>
        <p type="p">24b:第二控制接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="79" publication-number="202619056">
    <tif-files tif-type="multi-tif">
      <tif file="113139361.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種扇出型晶圓級封裝單元及其所堆疊組成的封裝</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241025B">H01L23/28</main-classification>
        <further-classification edition="200601120241025B">H01L23/525</further-classification>
        <further-classification edition="200601120241025B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華東科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTON ADVANCED ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于鴻祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HONG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古瑞庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, RUEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扇出型晶圓級封裝單元及其所堆疊組成的封裝，該扇出型晶圓級封裝單元包含載板、至少一裸晶、第一介電層、至少一第二導電柱、第二介電層、多條第一導接線路、第三介電層及多個金屬保護層；其中各該第一導接線路是利用先將金屬膏填注於凹槽中之後再研磨成型導接線路的技術，以在各該裸晶的該第二面上製作成型，以解決現有的扇出型封裝技術在製作各導接線路時易產生較高製造成本且不利於環保的問題；其中該扇出型晶圓級封裝單元的第一面上的各第二銲墊與該扇出型晶圓級封裝單元的第二面上的各第一銲墊的布局是相同的，而能量產化製造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扇出型晶圓級封裝單元</p>
        <p type="p">10:載板</p>
        <p type="p">11:第一面</p>
        <p type="p">13:第一導電柱</p>
        <p type="p">14:第二銲墊</p>
        <p type="p">20:裸晶</p>
        <p type="p">21:第一面</p>
        <p type="p">23:晶墊</p>
        <p type="p">30:第一介電層</p>
        <p type="p">40:第二導電柱</p>
        <p type="p">50:第二介電層</p>
        <p type="p">60:第一導接線路</p>
        <p type="p">61:第一銲墊</p>
        <p type="p">70:第三介電層</p>
        <p type="p">80:金屬保護層</p>
        <p type="p">90:第四介電層</p>
        <p type="p">100:第二導接線路</p>
        <p type="p">110:錫球</p>
        <p type="p">120:晶片黏結薄膜</p>
        <p type="p">3:電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="80" publication-number="202617521">
    <tif-files tif-type="multi-tif">
      <tif file="113139362.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可自動展開之機翼總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B64C3/54</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中正大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊翰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊品宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之機翼總成包含一第一機翼單元、一第二機翼單元，以及一慣性開關，第一機翼單元具有一第一機翼和一連接第一機翼之第一旋轉基座，第二機翼單元具有一第二機翼和一連接第二機翼且樞設於第一旋轉基座之第二旋轉基座，慣性開關被配置成用來控制第一旋轉基座和第二旋轉基座是否能相對旋轉。藉此，當機翼總成沿一第一方向加速移動時，慣性開關從一鎖定位置沿一相反於第一方向之第二方向作動至一解鎖位置，使得第一旋轉基座和第二旋轉基座能相對旋轉，進而使得第一機翼和第二機翼能在一彈性件的作用下達到自動展開的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:第一機翼單元</p>
        <p type="p">30:第一機翼</p>
        <p type="p">40:第一旋轉基座</p>
        <p type="p">41:第一頂盤</p>
        <p type="p">42:軸套</p>
        <p type="p">422:下凹槽</p>
        <p type="p">44:第一盤部</p>
        <p type="p">S1:螺絲</p>
        <p type="p">46:頂蓋</p>
        <p type="p">464:上凹槽</p>
        <p type="p">50:第二機翼單元</p>
        <p type="p">60:第二機翼</p>
        <p type="p">70:第二旋轉基座</p>
        <p type="p">75:樞軸</p>
        <p type="p">754:嵌槽</p>
        <p type="p">S3:沉頭螺絲</p>
        <p type="p">76:間隔環</p>
        <p type="p">80:彈性件</p>
        <p type="p">81:蓄力部</p>
        <p type="p">82:第一端部</p>
        <p type="p">83:第二端部</p>
        <p type="p">90:慣性開關</p>
        <p type="p">91:束環</p>
        <p type="p">S4:螺絲</p>
        <p type="p">92:簧片</p>
        <p type="p">S5:螺絲</p>
        <p type="p">93:銷件</p>
        <p type="p">932:螺紋端</p>
        <p type="p">934:插入端</p>
        <p type="p">N:螺帽</p>
        <p type="p">94:第一磁性件</p>
        <p type="p">95:第二磁性件</p>
        <p type="p">96:支撐板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="81" publication-number="202617401">
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          <doc-number>202617401</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高效物理發泡成型設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">B29C44/34</main-classification>
        <further-classification edition="200601120241104B">B29C44/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中天精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C.T.M. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡莉榆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高效物理發泡成型設備，包含一機台單元、一包括一模座組合與一氣密件的模座單元、一模座驅動單元、一鎖模單元、一加熱單元、一熱傳導單元、一真空閥單元、一供氣單元，及一排氣回收單元。該模座組合具有一形成有一工作腔室的固定模座，及一活動模座，該活動模座具有一密封軸心部。該供氣單元包括至少一進氣壓力閥，及至少一預熱儲氣筒。該排氣回收單元包括至少一排氣壓力閥，及至少一排氣回收筒。當該活動模座在一開模位置時，該活動模座不封閉該工作腔室，當該活動模座在一閉模位置時，該密封軸心部進入該工作腔室內，並與該氣密件接觸，該活動模座封閉該工作腔室，該加熱單元用於對該工作腔室進行全周加熱，，該進氣壓力閥選擇性地連通該筒體與該工作腔室，該排氣壓力閥選擇性地連通該排氣回收筒與該工作腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成型設備</p>
        <p type="p">10:機台單元</p>
        <p type="p">11:上板</p>
        <p type="p">12:側腳板</p>
        <p type="p">13:下框架</p>
        <p type="p">14:導桿</p>
        <p type="p">20:模座單元</p>
        <p type="p">21:模座組合</p>
        <p type="p">22:氣密件</p>
        <p type="p">23:真空閥座</p>
        <p type="p">25:補壓閥座</p>
        <p type="p">26:固定模座</p>
        <p type="p">261:模座頂壁</p>
        <p type="p">262:模座周壁</p>
        <p type="p">263:模座底環壁</p>
        <p type="p">264:上環形凸緣部</p>
        <p type="p">266:工作腔室</p>
        <p type="p">267:氣密件安裝槽</p>
        <p type="p">27:活動模座</p>
        <p type="p">271:活動底板</p>
        <p type="p">272:活動模座體</p>
        <p type="p">273:密封軸心部</p>
        <p type="p">274:下環形凸緣部</p>
        <p type="p">30:模座驅動單元</p>
        <p type="p">31:模座驅動壓缸</p>
        <p type="p">311:驅動活塞桿</p>
        <p type="p">40:鎖模單元</p>
        <p type="p">41:鎖模扣具</p>
        <p type="p">411:扣合凹槽</p>
        <p type="p">42:鎖模壓缸</p>
        <p type="p">50:加熱單元</p>
        <p type="p">51:上熱板</p>
        <p type="p">511:上穿孔</p>
        <p type="p">52:上電熱管</p>
        <p type="p">53:下熱板</p>
        <p type="p">531:下穿孔</p>
        <p type="p">54:下電熱管</p>
        <p type="p">60:熱傳導單元</p>
        <p type="p">61:上導熱鰭片件</p>
        <p type="p">611:上導熱鰭片</p>
        <p type="p">62:下導熱鰭片件</p>
        <p type="p">621:下導熱鰭片</p>
        <p type="p">63:側導熱鰭片件</p>
        <p type="p">631:側導熱鰭片</p>
        <p type="p">70:真空閥單元</p>
        <p type="p">71:開關閥</p>
        <p type="p">72:真空閥</p>
        <p type="p">80:供氣單元</p>
        <p type="p">82Ⅱ:預熱儲氣筒</p>
        <p type="p">84:筒體</p>
        <p type="p">85:加熱模組</p>
        <p type="p">851:電熱圈</p>
        <p type="p">86:供氣壓力閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="82" publication-number="202617402">
    <tif-files tif-type="multi-tif">
      <tif file="113139366.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高效物理發泡製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241111B">B29C44/34</main-classification>
        <further-classification edition="200601120241111B">B29C44/38</further-classification>
        <further-classification edition="200601120241111B">B29C44/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中天精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C.T.M. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡莉榆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高效物理發泡製造方法，包含以下步驟：（A）預熱至少一胚料。（B）將該胚料置入一工作腔室內，並氣密地封閉該工作腔室。（C）將該工作腔室抽真空。（D）將預壓後與預熱後的至少一超臨界流體輸入至該工作腔室內，並使該工作腔室達到一工作壓力。（E）對該工作腔室進行全周加熱，使該工作腔室達到一工作溫度。（F）讓該工作腔室排氣減壓，使該胚料發泡成型為一成品，並回收從該工作腔室排放出的超臨界流體。（G）打開該工作腔室，取出該成品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210:步驟</p>
        <p type="p">220:步驟</p>
        <p type="p">230:步驟</p>
        <p type="p">240:步驟</p>
        <p type="p">250:步驟</p>
        <p type="p">260:步驟</p>
        <p type="p">270:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="83" publication-number="202618162">
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      <tif file="113139367.zip" no="1">
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      <volno>24</volno>
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      <publication-reference>
        <document-id>
          <doc-number>202618162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速接頭</chinese-title>
        <english-title>QUICK CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">F16L37/22</main-classification>
        <further-classification edition="200601120241226B">F16L37/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翊懋有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSSOMOOR TRADING CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白桂森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, KUEI-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種快速接頭，包括：一管狀本體，該管狀本體的管壁界定出一通道，該通道定義一延伸方向，該管狀本體設有至少一第一穿孔及至少一第二穿孔，該至少一第一穿孔及該至少一第二穿孔於該延伸方向上呈高低錯位配置；一閥組，可釋放地封阻於該通道中；一內擋件，可活動地容設於該通道中；至少一第一卡件，可徑向位移地容設於該至少一第一穿孔中；至少一第二卡件，可徑向位移地容設於該至少一第二穿孔中；一滑套，可活動地套設於該管狀本體且可移動至一第一位置或一第二位置，包括一第一徑向凸緣、一第二徑向凸緣、及一位於該第一徑向凸緣與該第二徑向凸緣之間的閃避槽；一彈頂組件，設於該管狀本體與該滑套之間，供彈頂該至少一第一卡件；其中，當該滑套位於該第一位置時，該內擋件於該管狀本體的管壁內側徑向阻擋該至少一第一卡件，該彈頂組件於該管狀本體的管壁外側徑向阻擋該至少一第一卡件，且該至少一第二卡件與該閃避槽徑向相對；其中，當該滑套位於該第二位置且該內擋件於該管狀本體的管壁內側未徑向阻擋該至少一第一卡件時，該第二徑向凸緣於該管狀本體的管壁外側徑向阻擋該至少一第二卡件使得該至少一第二卡件凸入該通道中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quick connector is provided, including: a tubular body, a tubular wall of the tubular body defining a channel, the channel defining an extension direction, the tubular body including at least one first through hole and at least one second through hole which are arranged in a high-low arrangement in the extending direction; a valve assembly, configured to releasably block the channel; an inner blocking member, movably received in the channel; at least one first detent member, received in the at least one first through hole and radially displaceable; at least one second detent member, received in the at least one second through hole and radially displaceable; a slidable sleeve, movably sleeved on the tubular body and movable to a first position or a second position, including a first radial flange, a second radial flange, and an escape space between the first radial flange and the second radial flange; an elastic urging assembly, disposed between the tubular body and the slidable sleeve, configured to urge the at least one first detent member; wherein when the slidable sleeve is located in the first position, the inner blocking member radially blocks the at least one first detent member inside the tubular wall of the tubular body, the elastic urging assembly radially blocks the at least one first detent member outside of the tubular wall of the tubular body, and the at least one second detent member corresponds radially to the escape space; wherein when the slidable sleeve is in the second position and the inner blocking member does not radially block the at least one first detent member inside the tubular wall of the tubular body, the second radial flange radially blocks the at least one second detent member outside the tubular wall of the tubular body so that the at least one second detent member protrudes within the channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:快速接頭</p>
        <p type="p">10:管狀本體</p>
        <p type="p">60:滑套</p>
        <p type="p">100:管插頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="84" publication-number="202617453">
    <tif-files tif-type="multi-tif">
      <tif file="113139368.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輪胎氣嘴</chinese-title>
        <english-title>TIRE VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">B60C29/00</main-classification>
        <further-classification edition="200601120241125B">B60C23/04</further-classification>
        <further-classification edition="200601120241125B">F16K15/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿米瑟工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE LEGION ENGINEERING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫　韋恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOORE, WAYNE-IAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種輪胎氣嘴，包括：一管件，包括一內部通道、一擋肩及一頸縮部，該擋肩及該頸縮部徑向延伸於該內部通道中；及一閥組，可回復地擠壓通過該頸縮部且可被軸向抵擋於該頸縮部而容設於該內部通道且被侷限於該擋肩及該頸縮部之間，可作動以阻斷或不阻斷該內部通道，其中該閥組包括一閥芯，該閥芯包括一軸孔及至少一連通該軸孔之側孔，該至少一側孔與該內部通道連通。藉此，該閥組可簡易且快速地裝設至該管件中，且有效地止擋限制於該管件中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tire valve is provided, wherein the tire valve includes: a tubular member including an internal channel, a shoulder and a necked portion, the shoulder and the necked portion projecting radially inward in the internal channel; and a valve assembly resiliently squeezed through the necked portion and axially blocked by the necked portion to be disposed in the internal channel and restricted between the shoulder and the necked portion, and being operable to block or unblock the internal channel, wherein the valve assembly includes a valve pin, the valve pin includes an axial hole and at least one lateral hole in communication with the axial hole, and the at least one lateral hole is in communication with the internal channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輪胎氣嘴</p>
        <p type="p">10:管件</p>
        <p type="p">11:內部通道</p>
        <p type="p">12:套接段</p>
        <p type="p">13:外螺紋段</p>
        <p type="p">131:螺牙</p>
        <p type="p">14:卡槽</p>
        <p type="p">141:凹穴</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="85" publication-number="202617476">
    <tif-files tif-type="multi-tif">
      <tif file="113139369.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安全帶扣座</chinese-title>
        <english-title>SAFETY BELT BUCKLE ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">B60R21/02</main-classification>
        <further-classification edition="200601120250501B">B60R22/195</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台瑞賽車精品有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN RACING PRODUCTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種安全帶扣座，其包括：一本體、一連結件、一繞帶柱及一鎖定件。該連結件設於該本體供可釋放地連結一扣件。該繞帶柱定位於該本體供一帶體繞接；該鎖定件可活動於一鎖定位置與一釋放位置地設於該本體；其中，當該鎖定件位於該鎖定位置時，該鎖定件與該繞帶柱共同夾掣住該帶體，當該鎖定件位於該釋放位置時，該鎖定件與該繞帶柱未夾掣住該帶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A safety belt buckle assembly is provided, including a main body, a connection member, a belt-wrapping post, and a locking member. The connecting member is disposed on the main body for releasably connecting to a buckle. The belt-wrapping post is positioned on the main body for wrapping a strap. The locking member is movably disposed on the main body between a locking position and a releasing position. When the locking member is in the locking position, it cooperates with the belt-wrapping post to clamp the strap. When the locking member is in the releasing position, it does not clamp the strap with the belt-wrapping post</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">15:側部</p>
        <p type="p">16:定位部</p>
        <p type="p">2:連結件</p>
        <p type="p">3:繞帶柱</p>
        <p type="p">41:鎖定件</p>
        <p type="p">51:定位基部</p>
        <p type="p">52:第一定位單元</p>
        <p type="p">53:第二定位單元</p>
        <p type="p">83:上安全帶扣片</p>
        <p type="p">84:下安全帶扣片</p>
        <p type="p">9:擺動方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="86" publication-number="202618451">
    <tif-files tif-type="multi-tif">
      <tif file="113139370.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學增幅型正型感光性樹脂組成物、附有鑄模的複合基板的製造方法及電鍍成形體的製造方法</chinese-title>
        <english-title>CHEMICALLY-AMPLIFIED TYPE POSITIVE PHOTO SENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE WITH CASTING MOLD, AND METHOD FOR MANUFACTURING PLATING MOLDED ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241021B">G03F7/039</main-classification>
        <further-classification edition="200601120241021B">G03F7/004</further-classification>
        <further-classification edition="200601120241021B">C07D249/18</further-classification>
        <further-classification edition="200601120241021B">G03F7/20</further-classification>
        <further-classification edition="200601120241021B">H01L21/027</further-classification>
        <further-classification edition="200601120241021B">C25D5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇美實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIMEI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何國淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, GUO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃偉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉騏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施俊安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種化學增幅型正型感光性樹脂組成物，包含酸解離性樹脂(A)、光酸產生劑(C)、溶劑(D)及苯並三唑化合物(E)。該苯並三唑化合物(E)包括具有胺基及羧基的苯並三唑化合物(E1)。本發明還提供一種附有鑄模的複合基板的製造方法及一種電鍍成形體的製造方法。以該化學增幅型正型感光性樹脂組成物所形成的光阻圖案層具有好的矩形性且顯影底殘少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a chemically-amplified type positive photo sensitive resin composition comprises an acid-dissociable resin (A), a photoacid generator (C), a solvent (D) and a benzotriazole compound (E). Said benzotriazole compound (E) includes a benzotriazole compound (E1) which has amino group and carboxyl group. Said invention also provides a method for manufacturing composite substrate with casting mold and a method for manufacturing plating molded article. A photoresist pattern layer formed by said chemically-amplified type positive photo sensitive resin composition has good rectangularity and less photoresist residue after development.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="87" publication-number="202618665">
    <tif-files tif-type="multi-tif">
      <tif file="113139372.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供一建議運作溫度給一異構反應器的裝置、方法及電腦程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241231B">G06Q50/04</main-classification>
        <further-classification edition="200601120241231B">C07C5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣化學纖維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA CHEMICALS &amp; FIBRE CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤明隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈺丰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提供建議運作溫度給異構反應器的裝置、方法及電腦程式產品。裝置執行：(a)將多個預設評估溫度分別與進料資訊輸入異構產物預測模組以得多個產物資訊，進料資訊包含進料乙苯占比、進料對二甲苯占比及進料二甲苯占比，各產物資訊包含產物乙苯占比、產物對二甲苯占比及產物二甲苯占比，(b)針對各預設評估溫度，以進料乙苯占比及產物乙苯占比計算乙苯轉化率，以進料對二甲苯占比及產物對二甲苯占比計算對二甲苯轉化率，以進料二甲苯占比及產物二甲苯占比計算二甲苯回收率，(c)根據乙苯轉化率、對二甲苯轉化率及二甲苯回收率決定建議運作溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S501、S503、S505:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="88" publication-number="202618120">
    <tif-files tif-type="multi-tif">
      <tif file="113139374.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調光羅馬簾</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">E06B9/24</main-classification>
        <further-classification edition="200601120241219B">E06B9/42</further-classification>
        <further-classification edition="200601120241219B">E06B9/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>進東窗飾有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孝誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種調光羅馬簾，其包括：一上軌，其內部設有一第一捲繩器以及一第二捲繩器，所述第一捲繩器係控制一第一繩體，所述第二捲繩器係控制一第二繩體，且所述第一、第二捲繩器係分別經由一第一拉繩器以及一第二拉繩器操作控制；一中軌，可升降活動地設置於該上軌下方；一下軌，可升降活動地設置於該中軌下方；一上調光簾體，係組設於該上軌以及該中軌間，並連結該第一繩體；一下調光簾體，係組設於該中軌以及該下軌間，並連結該第二繩體；據此，本發明之調光羅馬簾具有兩段之操作控制效果，大幅提升羅馬簾的實用性，從而增進消費者的選購意願者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:上軌</p>
        <p type="p">11:第一捲繩器</p>
        <p type="p">12:第二捲繩器</p>
        <p type="p">13:第一繩體</p>
        <p type="p">14:第二繩體</p>
        <p type="p">15:第一拉繩器</p>
        <p type="p">16:第二拉繩器</p>
        <p type="p">20:中軌</p>
        <p type="p">21:連結槽</p>
        <p type="p">30:下軌</p>
        <p type="p">40:上調光簾體</p>
        <p type="p">41:上水平軌</p>
        <p type="p">42:第一扣環</p>
        <p type="p">43:第二扣環</p>
        <p type="p">50:下調光簾體</p>
        <p type="p">51:下水平軌</p>
        <p type="p">52:第三扣環</p>
      </representative-img>
    </description>
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      <invention-title>
        <chinese-title>無拉繩調光羅馬簾</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250110B">E06B9/322</main-classification>
        <further-classification edition="200601120250110B">E06B9/42</further-classification>
        <further-classification edition="200601120250110B">E06B9/56</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>進東窗飾有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孝誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種無拉繩調光羅馬簾，其包括：一上軌，其內部設有一第一彈性捲繩器以及一第二彈性捲繩器，該第一彈性捲繩器係捲收一第一繩體，該第一繩體更連接一第一簾繩，該第二彈性捲繩器係捲收一第二繩體，該第二繩體更連接一第二簾繩，該第一、第二簾繩兩端係迂迴穿設於第一、第二滑輪件間；一中軌，設置於該上軌下方；一下軌，設置於該中軌下方；一上調光簾體，係組設於該上軌以及該中軌間，並連結該第一簾繩；一下調光簾體，係組設於該中軌以及該下軌間，並連結該第二簾繩；據此，本發明之調光羅馬簾具有兩段之操作控制效果，大幅提升羅馬簾的實用性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:上軌</p>
        <p type="p">151:第一簾繩</p>
        <p type="p">161:第二簾繩</p>
        <p type="p">20:中軌</p>
        <p type="p">21:連結槽</p>
        <p type="p">22:連結孔</p>
        <p type="p">23:穿設孔</p>
        <p type="p">30:下軌</p>
        <p type="p">34:蓋板</p>
        <p type="p">35:制動片</p>
        <p type="p">36:接桿座</p>
        <p type="p">37:頂桿</p>
        <p type="p">40:上調光簾體</p>
        <p type="p">41:上水平軌</p>
        <p type="p">42:第一扣環</p>
        <p type="p">43:第二扣環</p>
        <p type="p">50:下調光簾體</p>
        <p type="p">51:下水平軌</p>
        <p type="p">52:第三扣環</p>
      </representative-img>
    </description>
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  <tw-patent-application no="90" publication-number="202617512">
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          <doc-number>113139376</doc-number>
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      <invention-title>
        <chinese-title>機車的構造</chinese-title>
        <english-title></english-title>
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        <main-classification edition="201001120241219B">B62M6/10</main-classification>
        <further-classification edition="201001120241219B">B62M6/20</further-classification>
        <further-classification edition="200601120241219B">F02B77/08</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭岳霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡瑞桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種機車的構造，機車包括有內燃引擎的動力單元，該動力單元係被連接於車架單元；該動力單元至少包含有汽缸部及該汽缸部一端上的曲軸箱，該汽缸部包含有汽缸本體與連接於該汽缸本體上的汽缸頭；該汽缸頭連接有進氣元件，該進氣元件藉由第一鎖固元件鎖固於該汽缸頭上，該進氣元件設有出氣口連接埠，該出氣口連接埠設有爆震感知器安裝座，該爆震感知器安裝座以第二鎖固元件鎖設有爆震感知器；藉此達到便利該爆震感知器的安裝及減少組裝工程，並可提升該爆震感知器偵測爆震的準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">412:汽缸頭</p>
        <p type="p">4125:進氣閥組</p>
        <p type="p">4126:排氣閥組</p>
        <p type="p">418:進氣口連接埠</p>
        <p type="p">4181:第一鎖固孔</p>
        <p type="p">4182:第二鎖固孔</p>
        <p type="p">418a:延設面</p>
        <p type="p">419:進氣元件</p>
        <p type="p">4191:出氣口連接埠</p>
        <p type="p">4192:第一安裝孔</p>
        <p type="p">4193:第二安裝孔</p>
        <p type="p">4194:燃油噴嘴安裝座</p>
        <p type="p">419a:爆震感知器安裝座</p>
        <p type="p">7:爆震感知器</p>
        <p type="p">A:間隔件</p>
        <p type="p">A1:延設部</p>
        <p type="p">A2:第一穿孔</p>
        <p type="p">A3:第二穿孔</p>
        <p type="p">S:第一鎖固元件</p>
        <p type="p">S1:第二鎖固元件</p>
        <p type="p">J:燃油噴嘴</p>
      </representative-img>
    </description>
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      <invention-title>
        <chinese-title>輕量化之棘輪扳手結構</chinese-title>
        <english-title></english-title>
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      <classification-ipc>
        <main-classification edition="200601120250110B">B25B13/46</main-classification>
        <further-classification edition="200601120250110B">B25B23/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工豐企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG FONG ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>胡哲儀</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種輕量化之棘輪扳手結構，包括：一扳手本體、一棘輪件、一棘動座以及一切控件，該扳手本體係以輕質材料製成，可大幅降低該棘輪扳手之重量，且該棘輪件組入該扳手本體之一容置槽時，主要係設有一平面段接觸該容置槽內壁並形成轉動，不僅可大幅提升該棘輪件轉動的順暢度，同時防止該齒牙段接觸摩擦該容置槽內壁，避免該容置槽因棘輪件受力而遭受破壞，該棘動座係設置於該扳手本體之一棘動槽內，且該棘動座係供容設一棘齒塊與該棘輪件齒合連結，據此防止該棘齒塊直接摩擦、頂靠該棘動槽內壁，避免該棘動槽受損變形，增進棘輪扳手的耐用性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:扳手本體</p>
        <p type="p">11:頭部</p>
        <p type="p">111:容置槽</p>
        <p type="p">112:控制槽</p>
        <p type="p">113:棘動槽</p>
        <p type="p">114:限位開口</p>
        <p type="p">12:柄部</p>
        <p type="p">20:棘輪件</p>
        <p type="p">21:平面段</p>
        <p type="p">22:齒牙段</p>
        <p type="p">23:結合柱</p>
        <p type="p">231:環槽</p>
        <p type="p">232:C形扣</p>
        <p type="p">24:制動柱</p>
        <p type="p">241:彈扣珠體</p>
        <p type="p">25:內凹孔</p>
        <p type="p">30:棘動座</p>
        <p type="p">31:底壁</p>
        <p type="p">311:凹弧部</p>
        <p type="p">32:限位邊</p>
        <p type="p">33:滑槽</p>
        <p type="p">34:上開口</p>
        <p type="p">35:下開口</p>
        <p type="p">36:棘齒塊</p>
        <p type="p">361:棘齒</p>
        <p type="p">362:凹底部</p>
        <p type="p">363:抵頂部</p>
        <p type="p">40:切控件</p>
        <p type="p">41:穿槽</p>
        <p type="p">42:彈性件</p>
        <p type="p">43:頂柱</p>
        <p type="p">44:撥動桿</p>
      </representative-img>
    </description>
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      <invention-title>
        <chinese-title>數位圖像轉換數字圖像的方法及其系統</chinese-title>
        <english-title></english-title>
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        <main-classification edition="201701120250107B">G06T7/90</main-classification>
        <further-classification edition="202201120250107B">G06V30/18</further-classification>
        <further-classification edition="201701120250107B">G06T7/60</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮羿澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮羿澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種數位圖像轉換數字圖像的方法及其系統，其中，該方法係獲取一數位圖像，並對該數位圖像之顏色進行一色彩分類分群程序，並取得該數位圖像之輪廓，據以將該數位圖像之顏色區分為不同色彩之色塊；以該數位圖像之輪廓為範圍，於該些色塊之相應位置上分別賦予編號，並使相同色彩的色塊被賦予相同的編號，從而獲得一數字圖像；其中，該編號為數字、字母或其任意組合。據此，本發明透過色彩分群和分塊編號，能夠有效減少資料數量，簡化了影像處理的複雜度，並改善傳統影像的儲存效率和傳輸效能，特別適合需要簡化處理和快速重現的應用場合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">P1:資料擷取轉換程序</p>
        <p type="p">P2:色彩分類分群程序</p>
        <p type="p">P3:填回原色點程序</p>
        <p type="p">P4:灰階處理程序</p>
        <p type="p">P5:輪廓提取程序</p>
        <p type="p">P6:圖層整合程序</p>
        <p type="p">P7:CMYK塗色程序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="93" publication-number="202618214">
    <tif-files tif-type="multi-tif">
      <tif file="113139386.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測量手工具之工具臂的組裝長度的測量系統及其測量方法</chinese-title>
        <english-title>MEASURING SYSTEM FOR MEASURING ASSEMBLING LENGTH OF CLAMPING ARM OF HAND TOOL AND MEASURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01B11/02</main-classification>
        <further-classification edition="200601120241204B">G01C11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王科翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KO-SHYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, KAI-SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴崇禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, CHUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於分類手工具的工具臂的組裝長度的系統及其方法。方法包括根據3D點雲及二維影像，取得分別對應於工具臂的末端部及樞接部的末端邊緣3D特徵、樞接部本體3D特徵及樞接部邊緣3D特徵；根據3D點雲、二維影像、樞接部本體3D特徵及樞接部邊緣3D特徵計算長度測量向量；根據長度測量向量，取得對應末端邊緣3D特徵的末端切平面及對應樞接部邊緣3D特徵的樞接切平面；以及計算末端切平面及樞接切平面的距離，以取得工具臂的組裝長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for measuring assembling length of clamping arm of hand tool are provided by the present disclosure. The method comprises: obtaining a tip region and a base region for respectively obtaining a tip portion edge 3D feature, a pivot portion body 3D feature and a pivot portion edge 3D feature respectively corresponding to a tip portion and a pivot portion of the hand tool, according to a 3D point cloud and a 2D image; calculating a length measuring vector according to the 3D point cloud, the 2D image, the pivot portion body 3D feature and the pivot portion edge 3D feature; obtaining a tip tangent plane corresponding to the tip portion edge 3D feature, and a pivot tangent plane corresponding to the pivot portion edge 3D feature; and calculating the distance of the tip tangent plane and the pivot tangent plane, to obtain the assembling length of the clamping arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:系統</p>
        <p type="p">210:治具盤</p>
        <p type="p">220:3D視覺相機</p>
        <p type="p">230:運算裝置</p>
        <p type="p">231:處理器</p>
        <p type="p">240-1~240-n:指示燈</p>
        <p type="p">250:顯示單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="94" publication-number="202619057">
    <tif-files tif-type="multi-tif">
      <tif file="113139388.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139388</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板結構</chinese-title>
        <english-title>SUBSTRATE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241025B">H01L23/28</main-classification>
        <further-classification edition="200601120241025B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝志毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIEH YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUI-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芳瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范植文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHIH WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HSIU FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板結構，包括基板本體以及複數絕緣區塊。該基板本體具有一線路層，並定義有一置晶區。該複數絕緣區塊設於該置晶區內之該基板本體上，並覆蓋部分該線路層，以降低外露線路層的比率，進而改善脫層問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate structure comprises a substrate body and a plurality of insulating blocks. The substrate body has a circuit layer and defines a chip placement area. The insulating blocks are disposed on the substrate body within the chip placement area and cover part of the circuit layer to reduce the ratio of exposed circuit layer and thereby improve the delamination problem.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板結構</p>
        <p type="p">20:基板本體</p>
        <p type="p">200:表面</p>
        <p type="p">201:線路層</p>
        <p type="p">201a:電性接觸墊</p>
        <p type="p">201b:導電跡線</p>
        <p type="p">21:絕緣區塊</p>
        <p type="p">22:絕緣保護層</p>
        <p type="p">220:開口</p>
        <p type="p">D:置晶區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="95" publication-number="202618219">
    <tif-files tif-type="multi-tif">
      <tif file="113139393.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高深寬比微結構之複合散射光學量測系統</chinese-title>
        <english-title>HYBRID SCATTEROMETRY OPTICAL SYSTEM FOR MEASURING MICRO STRUCTURES HAVING HIGH ASPECT RATIO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01B11/22</main-classification>
        <further-classification edition="200601120241231B">G01B11/24</further-classification>
        <further-classification edition="200601120241231B">G02B27/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅子英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, ZIH-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林礽俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高深寬比微結構之複合散射光學量測系統，包括有光源模組、第一物鏡、背焦調整模組、空間濾波模組、第一影像擷取裝置、光譜儀以及訊號處理裝置。光源模組用以產生一偏極態偵測光。第一物鏡用以接收偏極態偵測光，並將偏極態偵測光投射至具有高深寬比的待測物，並反射形成偏極態物光通過第一物鏡。背焦調整模組設置於第一物鏡的一側，用以將偏極態物光聚焦於第一物鏡背側外的背聚焦點上。空間濾波模組對由該背聚焦點發出的該偏極態物光分光成第一偏極態物光與第二偏極態物光，並對第二偏極態物光進行濾波以形成偏極態濾波光。第一影像擷取裝置接收第一偏極態物光以形成瞳面背焦散射影像。光譜儀接收偏極態濾波光，以得到對應偏極態濾波光的光譜資訊。訊號處理裝置根據該瞳面背焦散射影像得到關於待測物的第一物理特徵以及根據光譜資訊得到關於待測物的第二物理特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a hybrid scatterometry optical system for measuring micro structures having high aspect ratio comprising an optical module, a first objective lens, a back focal modulating module, a spatial filtering module, a first image acquiring device, a spectrometer, and a signal processor. The optical module is utilized to generate a polarization light. The first objective lens receives the polarization light and projects the polarization light onto a sample having high aspect ratio thereby forming a polarized object light passing through the first objective lens and is focused on a back focal point of the first objective lens by the back focal modulating module. The polarized object light is divided into a first polarized object light and a second polarized object light by the spatial filtering module wherein the first polarized object light received by the first image acquiring device thereby forming a back focal image, and the second polarized object light is filtered and is received by the spectrometer thereby generating a spectrum information. The signal processor obtains a first physical characteristic according to the back focal image and a second physical characteristic according to the spectrum information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:高深寬比微結構光學量測系統</p>
        <p type="p">20:光源模組</p>
        <p type="p">200:發光元件</p>
        <p type="p">201:準直元件</p>
        <p type="p">202:反光鏡組</p>
        <p type="p">202a:反光鏡</p>
        <p type="p">202b:反光鏡</p>
        <p type="p">203:光束尺寸調整模組</p>
        <p type="p">203a:孔徑欄</p>
        <p type="p">203b:擴束元件</p>
        <p type="p">203c:孔徑欄</p>
        <p type="p">21:第一物鏡</p>
        <p type="p">22:背焦調整模組</p>
        <p type="p">220、221:透鏡</p>
        <p type="p">23:空間濾波模組</p>
        <p type="p">230:空間濾波元件</p>
        <p type="p">231:透鏡組</p>
        <p type="p">232:第二分光元件</p>
        <p type="p">233:第二透鏡組</p>
        <p type="p">234:解偏器</p>
        <p type="p">24:第一影像擷取裝置</p>
        <p type="p">25:光譜儀</p>
        <p type="p">26:訊號處理裝置</p>
        <p type="p">27:分光元件</p>
        <p type="p">90:偏極態偵測光</p>
        <p type="p">91:偏極態物光</p>
        <p type="p">92:第一偏極態物光</p>
        <p type="p">93:偏極態濾波光</p>
        <p type="p">S:待測物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="96" publication-number="202618156">
    <tif-files tif-type="multi-tif">
      <tif file="113139394.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用法式氣嘴之接頭</chinese-title>
        <english-title>VALVE CONNECTOR SUITABLE FOR PRESTA VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F16K24/06</main-classification>
        <further-classification edition="200601120241204B">B60C29/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集優企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CO-LUCK ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳樹木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明適用法式氣嘴之接頭包括有一個外殼及一個夾緊裝置，外殼沿一個虛擬貫軸設置有一個滑槽，夾緊裝置設置於滑槽內，夾緊裝置包括有一個推座及至少一個卡固件，推座沿虛擬貫軸軸向設置有一個氣嘴插孔，推座設置有至少一個容置槽，卡固件能夠沿虛擬的一個基準線移動地設置於容置槽內，基準線與虛擬貫軸之間形成一個斜角，斜角小於90度，夾緊裝置在夾緊位置時，卡固件靠近虛擬貫軸，夾緊裝置在釋放位置時，卡固件遠離虛擬貫軸，接頭透過上述結構使操作方便且夾持效果良好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A valve connector suitable for a Presta valve comprises a housing and a clamping device. The housing is provided with a sliding slot along a reference longitudinal axis. The clamping device is positioned within the sliding slot and includes a pushing seat and at least one engaging member. The pushing seat is provided with a valve insertion hole along an axial direction of the reference longitudinal axis. The pushing seat further has at least one accommodating slot, in which the engaging member is movably arranged along a reference line. The reference line forms an oblique angle with the reference longitudinal axis, and the angle is less than 90 degrees. When the clamping device is in a clamping position, the engaging member is close to the reference longitudinal axis. When the clamping device is in a release position, the engaging member is farther from the reference longitudinal axis. This structure makes the operation convenient and provides a good clamping effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接頭</p>
        <p type="p">20:外殼</p>
        <p type="p">22:第一端</p>
        <p type="p">23:第二端</p>
        <p type="p">30:夾緊裝置</p>
        <p type="p">36:後蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="97" publication-number="202617592">
    <tif-files tif-type="multi-tif">
      <tif file="113139402.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具高強度導電碳之磷酸錳鐵鋰複合正極顆粒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C01B25/45</main-classification>
        <further-classification edition="200601120241220B">H01M4/36</further-classification>
        <further-classification edition="201001120241220B">H01M4/58</further-classification>
        <further-classification edition="200601120241220B">H01M4/62</further-classification>
        <further-classification edition="201001120241220B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具高強度導電碳之磷酸錳鐵鋰複合正極顆粒，該複合正極顆粒之結構包含：一LMFP(磷酸錳鐵鋰)顆粒，一導電層包覆在該LMFP顆粒外表面整體形成該複合正極顆粒；該導電層包含多個碳集塊及多個鋰離子導體顆粒用於增進導電性；其中該導電層中的碳集塊係由碳水化合物或是水溶性纖維或是胺基酸聚合物脫水形成的多個碳集塊；其中該多個鋰離子導體顆粒分布在該導電層的內部或靠近該導電層的外部或者靠近該LMFP顆粒外表面處；其中該鋰離子導體顆粒係指具鋰離子傳導能力之氧化物或磷酸鹽類或具石榴石或鈣鈦礦結構之氧化物。其中該導電層內尚包含：多個導電碳，該導電碳係選自石墨、石墨烯、奈米尺寸之非結晶碳、或是長度不長於1微米之奈米碳管中至少一項。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:鋰離子導體顆粒</p>
        <p type="p">121:LMFP顆粒</p>
        <p type="p">122:導電層</p>
        <p type="p">123:碳集塊</p>
        <p type="p">124:導電碳</p>
        <p type="p">200:複合正極顆粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="98" publication-number="202619138">
    <tif-files tif-type="multi-tif">
      <tif file="113139403.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磷酸錳鐵鋰複合正極顆粒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250613B">H01M10/0525</main-classification>
        <further-classification edition="201001120250613B">H01M10/0562</further-classification>
        <further-classification edition="201001120250613B">H01M4/133</further-classification>
        <further-classification edition="200601120250613B">H01M4/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磷酸錳鐵鋰複合正極顆粒，係使用在一類固態或固態電池的一正極中；該複合正極顆粒之結構包含：一LMFP(磷酸錳鐵鋰)顆粒，一導電層包覆在該LMFP顆粒外表面，整體形成該複合正極顆粒；該導電層包含多個碳集塊及多個鋰離子導體顆粒用於增進導電性；其中該導電層中的碳集塊係由碳水化合物脫水形成的多個碳集塊、或是由水溶性纖維脫水所形成含有多個碳骨架與部分官能基之碳集塊、或是由胺基酸聚合物脫水形成含有摻雜元素之直鏈或帶支鏈之多個碳骨架所形成的碳集塊；其中該多個鋰離子導體顆粒分布在該導電層的內部或靠近該導電層的外部或者靠近該LMFP顆粒外表面處；其中該鋰離子導體顆粒係指具鋰離子傳導能力之氧化物或磷酸鹽類或具石榴石或鈣鈦礦結構之氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:鋰離子導體顆粒</p>
        <p type="p">121:LMFP顆粒</p>
        <p type="p">122:導電層</p>
        <p type="p">123:碳集塊</p>
        <p type="p">200:複合正極顆粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="99" publication-number="202617593">
    <tif-files tif-type="multi-tif">
      <tif file="113139404.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139404</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造磷酸錳鐵鋰複合正極顆粒的製程</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">C01B25/45</main-classification>
        <further-classification edition="201001120241105B">H01M4/58</further-classification>
        <further-classification edition="201001120241105B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製造磷酸錳鐵鋰複合正極顆粒的製程，係使用在一類固態或固態電池的一正極中；該製程包含下列步驟：取多個鋰離子導體顆粒、多個LMFP顆粒、碳源、分散劑，將上述材料同時置入一球磨機中進行混合以形成混合物漿料；該碳源係為在還原氣氛下可形成導電碳之有機化合物；然後將該混合物漿料進行自然或真空乾燥，以得到混合物粉末：接者將該混合物粉末置入一燒結爐中進行無氧燒結以得到該複合正極顆粒；其中在無氧環境下，該混合物粉末中的該碳源會脫水，剩下碳元素及其他燒結後的殘餘物及該多個鋰離子導體顆粒整體形成一導電層包覆在該LMFP顆粒的外表面，因此形成該複合正極顆粒；該鋰離子導體顆粒在各該LMFP顆粒上的分布可能為連續分佈或是形成島狀顆粒。在該鋰離子導體顆粒外表面尚可包覆一硼酸鹽層。該碳源尚包含石墨、石墨烯、奈米尺寸之非結晶碳、或是長度不長於1微米之奈米碳管中至少一項。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="100" publication-number="202619453">
    <tif-files tif-type="multi-tif">
      <tif file="113139405.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱裝置</chinese-title>
        <english-title>HEAT DISSIPATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">H05K7/20</main-classification>
        <further-classification edition="200601120241028B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李格通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GE-TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李格通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GE-TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露為一種散熱裝置，其設置於一基座，散熱裝置包括一第一風扇及一鼓風組件。第一風扇可轉動地設置於基座，第一風扇具有一轉動部及複數第一葉片，複數第一葉片環設於轉動部；鼓風組件設置於第一風扇，鼓風組件具有一第一支架及複數第一鼓風葉片，第一支架設置於複數第一葉片，複數第一鼓風葉片沿轉動部的軸向排列於第一支架。藉此，於第一風扇與鼓風組件的配合之下，本揭露可以引導不同方向的氣流，進一步地增加風流流量，藉以達到對CPU有效散熱之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation device, which is arranged on a base, and the heat dissipation device comprises a first fan and a blower assembly. the first fan may be rotatably arranged at the base, the first fan has a rotating part and a plural first blade, and the plural first blade ring is arranged at the rotating part; The blower assembly is arranged at the first fan, the blower assembly has a first support and a plural first blower blade, the first support is arranged at the plural first blade, and the plural first blower blades are arranged in the first support along the axial direction of the rotating part. Thus, with the cooperation of the first fan and the blower assembly, this disclosure can direct the airflow in different directions, further increasing the airflow flow, so as to achieve the purpose of effective heat dissipation to the CPU.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱裝置</p>
        <p type="p">1:基座</p>
        <p type="p">10:第一風扇</p>
        <p type="p">11:轉動部</p>
        <p type="p">12:第一葉片</p>
        <p type="p">121:外側邊緣</p>
        <p type="p">20:鼓風組件</p>
        <p type="p">21:第一支架</p>
        <p type="p">211:內側</p>
        <p type="p">22:第一鼓風葉片</p>
        <p type="p">221:第一內弧面</p>
        <p type="p">L:軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="101" publication-number="202618827">
    <tif-files tif-type="multi-tif">
      <tif file="113139406.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139406</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>開關裝置及其開關單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H01H13/52</main-classification>
        <further-classification edition="200601120241104B">H01H13/26</further-classification>
        <further-classification edition="200601120241104B">H01H13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維加科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUSTPLUS CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林中玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種開關裝置，包含控制單元及開關單元。該開關單元包含安裝座及開關面板。該安裝座可供該控制單元之觸發鍵朝前外露，並包括位在該觸發鍵兩側的第一結合結構與第一限位結構。該開關面板包括突出結構、第二結合結構，及能與該第一限位結構相互限位的第二限位結構。該開關面板可被按壓而以相結合之該第一結合結構與該第二結合結構為支點樞擺，並自初始位置變化至觸發位置，而帶動該突出結構位移以接觸該觸發鍵。透過上述設計，本發明不需藉由組裝彈片，就能使該開關面板自動回復至該初始位置，能夠提升組裝與拆卸的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:控制單元</p>
        <p type="p">31:殼體</p>
        <p type="p">32:電路板</p>
        <p type="p">321:觸發鍵</p>
        <p type="p">34:本體部</p>
        <p type="p">342:卡孔</p>
        <p type="p">35:框體部</p>
        <p type="p">4:開關單元</p>
        <p type="p">5:安裝座</p>
        <p type="p">51:座體</p>
        <p type="p">52:勾卡件</p>
        <p type="p">53:貫孔</p>
        <p type="p">54:第一結合結構</p>
        <p type="p">55:第一限位結構</p>
        <p type="p">56:圍框件</p>
        <p type="p">57:定位件</p>
        <p type="p">58:頂推部</p>
        <p type="p">581:凸段</p>
        <p type="p">59:定位部</p>
        <p type="p">591:延伸段</p>
        <p type="p">592:箍段</p>
        <p type="p">593:弧凸塊</p>
        <p type="p">6:開關面板</p>
        <p type="p">612:按壓部</p>
        <p type="p">613:定位部位</p>
        <p type="p">614:擺動部位</p>
        <p type="p">62:第二結合結構</p>
        <p type="p">621:卡合部</p>
        <p type="p">622:扣部</p>
        <p type="p">63:第二限位結構</p>
        <p type="p">631:靠抵部</p>
        <p type="p">632:卡勾部</p>
        <p type="p">64:肋條結構</p>
        <p type="p">641:第一肋條</p>
        <p type="p">642:第二肋條</p>
        <p type="p">65:突出結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="102" publication-number="202617280">
    <tif-files tif-type="multi-tif">
      <tif file="113139412.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單晶圓處理設備及其控制方法</chinese-title>
        <english-title>SINGLE WAFER PROCESSING EQUIPMENT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241126B">B08B3/02</main-classification>
        <further-classification edition="200601120241126B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘塑科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAND PROCESS TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃立佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-TSO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張修凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIU-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許明哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種單晶圓處理設備及其控制方法。單晶圓處理設備包括晶圓保持部、二流體噴嘴、壓力校正裝置以及移動裝置。該晶圓保持部配置用於承載晶圓。該二流體噴嘴配置用於向該晶圓提供由氣體和製程液體組成的混合流體。該壓力校正裝置配置用於量測由該二流體噴嘴提供之該混合流體之壓力值。該移動裝置與該二流體噴嘴連接，配置用於控制該二流體噴嘴在該壓力校正裝置與該晶圓保持部之間的位置進行移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a single wafer processing equipment and a control method thereof. The single wafer processing equipment includes a wafer supporting portion, a two-fluid nozzle, a pressure sensor, and a moving device. The wafer supporting portion is configured to support a wafer. The two-fluid nozzle is configured to provide a mixed fluid composed of gas and process liquid to the wafer. The pressure sensor is configured to measure a pressure value of the mixed fluid provided by the two-fluid nozzle. The moving device is connected to the two-fluid nozzle and is configured to control a position of the two-fluid nozzle to move between the pressure sensor and the wafer supporting part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:單晶圓處理設備</p>
        <p type="p">12:壓力校正裝置</p>
        <p type="p">13:二流體噴嘴</p>
        <p type="p">14:移動裝置</p>
        <p type="p">141:旋轉升降柱</p>
        <p type="p">142:長臂</p>
        <p type="p">2:晶圓</p>
        <p type="p">P1:校正位置</p>
        <p type="p">A、B:點</p>
        <p type="p">O:中心點</p>
        <p type="p">R:路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="103" publication-number="202616951">
    <tif-files tif-type="multi-tif">
      <tif file="113139414.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能生物監控驅逐裝置</chinese-title>
        <english-title>INTELLIGENT BIOLOGICAL MONITORING AND EXPULSION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241031B">A01M29/00</main-classification>
        <further-classification edition="201101120241031B">A01M29/10</further-classification>
        <further-classification edition="201101120241031B">A01M29/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種智能生物監控驅逐裝置，其包含立架、太陽能充電板、攝影機、控制器以及驅逐裝置。立架包含第一層架及第二層架，太陽能充電板是設置於第一層架上，攝影機是穿設於第一層架中，攝影機包含環景鏡頭以拍攝天空影像或地面影像。控制器設置於第二層架，控制器儲存天空影像或地面影像，執行運算程式以辨識影像中的生物物種，並對應生物物種產生驅逐指令。驅逐裝置連接於控制器，接收驅逐指令以執行驅離手段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent biological monitoring and expulsion device is disclosed. The device includes a standing frame, a solar charging panel, a camera, a controller and an expulsion device. The standing frame includes a first level frame and a second level frame. The solar charging panel is disposed on the first level frame. The camera is disposed in the first level frame. The camera includes a panoramic lens to capture sky images or ground images. The controller is disposed on the second level frame. The controller stores sky images or ground images, executes calculation programs to identify biological species in the images, and generates expulsion instructions corresponding to the biological species. The expulsion device is connected to the controller and receives expulsion instructions to execute expulsion means.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:智能生物監控驅逐裝置</p>
        <p type="p">11:立架</p>
        <p type="p">12:支撐桿</p>
        <p type="p">13:第一層架</p>
        <p type="p">14:第二層架</p>
        <p type="p">15:轉動件</p>
        <p type="p">16:立柱</p>
        <p type="p">21:太陽能充電板</p>
        <p type="p">22:攝影機</p>
        <p type="p">23:控制器</p>
        <p type="p">30:驅逐裝置</p>
        <p type="p">31:喇叭</p>
        <p type="p">32:超音波發射器</p>
        <p type="p">33:光線發射器</p>
        <p type="p">34:子彈發射器</p>
        <p type="p">34B:可分解式子彈</p>
        <p type="p">35:無人機</p>
        <p type="p">36:氣味釋放器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="104" publication-number="202617335">
    <tif-files tif-type="multi-tif">
      <tif file="113139416.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伸縮護蓋組裝固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B23Q11/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>添鼎興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王州勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種伸縮護蓋組裝固定裝置，包含有一支架、一端蓋組，及一伸縮護蓋主體，該端蓋組固定於該支架上，並且包含有一蓋體與一固定座，該蓋體具有兩耳片，該固定座具有一支撐板，該支撐板靠貼於該支架，並且通過至少一蓋緊固件固定於該支架，該伸縮護蓋主體包含兩固定側板，該兩固定側板分別靠於該蓋體的兩耳片，各固定側板通過至少一側緊固件固定於對應的耳片，而能簡化組裝步驟，提升組裝的便利性，並且能有效地防止切削液滲入伸縮護蓋主體內部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伸縮護蓋組裝固定裝置</p>
        <p type="p">10:支架</p>
        <p type="p">11:支臂</p>
        <p type="p">20:端蓋組</p>
        <p type="p">21:蓋體</p>
        <p type="p">211:蓋片</p>
        <p type="p">213:耳片</p>
        <p type="p">23:固定座</p>
        <p type="p">231:支撐板</p>
        <p type="p">233:立板</p>
        <p type="p">234:側立加強板</p>
        <p type="p">235:側底加強板</p>
        <p type="p">236:端底加強板</p>
        <p type="p">25:蓋緊固件</p>
        <p type="p">30:伸縮護蓋主體</p>
        <p type="p">31:固定蓋板</p>
        <p type="p">311:固定頂板</p>
        <p type="p">312:側緊固件</p>
        <p type="p">313:固定側板</p>
        <p type="p">33:移動蓋板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="105" publication-number="202618501">
    <tif-files tif-type="multi-tif">
      <tif file="113139417.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩壓電路</chinese-title>
        <english-title>REGULATOR CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">G05F1/565</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉權駐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUAN CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張益韶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種穩壓電路，包含慢迴路電路及快迴路電路。慢迴路電路，包含第一電晶體及放大器，第一電晶體耦接在輸出端及第一節點之間，用以調整輸出端的第一電壓。第一電壓作為經穩壓的電源電壓。快迴路電路包含多個功率電路，並聯耦接於輸出端及第一節點之間，這些功率電路中的每一者包含功率電晶體，耦接在供應電壓及輸出端之間，其中功率電路根據第一節點的第二電壓調整功率電晶體的導通性以調整輸出端的第一電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A regulator circuit includes a slow loop circuit and a fast loop circuit. The slow loop circuit includes an amplifier and a first transistor coupled between an output terminal and a first node. The first transistor adjusts a first voltage of the output terminal. The first voltage is configured as a regulated power source voltage. The fast loop includes multiple power circuits coupled in parallel between the output terminal and the first node. Each of the power circuits includes a power transistor coupled between a supply voltage and the output terminal. The power circuit adjust a conductivity of the power transistor according to a second voltage of the first node to adjust the first voltage of the output terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電路</p>
        <p type="p">100:慢迴路電路</p>
        <p type="p">101:電晶體</p>
        <p type="p">200:快迴路電路</p>
        <p type="p">210:功率電路</p>
        <p type="p">211:電晶體</p>
        <p type="p">212:電晶體</p>
        <p type="p">213:電晶體</p>
        <p type="p">300:固定電流電路</p>
        <p type="p">301:電晶體</p>
        <p type="p">400:低通濾波偏壓電路</p>
        <p type="p">C0:電容器</p>
        <p type="p">C1:電容器</p>
        <p type="p">CL:負載電容器</p>
        <p type="p">EA:放大器</p>
        <p type="p">N1:節點</p>
        <p type="p">N2:節點</p>
        <p type="p">OUT:輸出端</p>
        <p type="p">R0:電阻器</p>
        <p type="p">R1:電阻器</p>
        <p type="p">RL:負載電阻器</p>
        <p type="p">VBN:電壓</p>
        <p type="p">VBP:電壓</p>
        <p type="p">VDD:電壓</p>
        <p type="p">VREF:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="106" publication-number="202617247">
    <tif-files tif-type="multi-tif">
      <tif file="113139418.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高效節能吸附式乾燥裝置</chinese-title>
        <english-title>HIGH-EFFICIENCY AND ENERGY-SAVING ADSORPTION DRYING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B01D53/047</main-classification>
        <further-classification edition="200601120241204B">F26B21/00</further-classification>
        <further-classification edition="200601120241204B">F26B25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓憲和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, HSIEN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李恒毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃財富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSAIR-FUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊昇府</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高效節能吸附式乾燥裝置，係包括一乾燥場域、一機殼、一吸附乾燥除濕轉輪元件、一熱交換器、一加熱器、一智慧聯網（Artificial Intelligence of Things, AIoT）模組以及一行動裝置所構成。藉此，可改善既有乾燥程序耗電的問題，並進一步降低能耗及兼顧品質，符合乾燥設備成本低與耗電小之應用需求，達到降低生產成本，降低再生溫度或熱能整合提高節能效益之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high-efficiency and energy-saving adsorption drying device comprises a drying field, a casing, an adsorption drying and dehumidification runner assembly, a heat exchanger, a heater, and an intelligent networking (Artificial Intelligence of Things, AIoT module and a mobile device. In this way, the problem of power consumption of the existing drying process can be improved, and the energy consumption and quality can be further reduced, which meets the application requirements of low cost and low power consumption of drying equipment, and achieves the effect of reducing production costs, reducing regeneration temperature or heat energy integration to improve energy-saving benefits.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:乾燥場域</p>
        <p type="p">2:機殼</p>
        <p type="p">21:進風口</p>
        <p type="p">22:第一出風口</p>
        <p type="p">23:第二出風口</p>
        <p type="p">24:抽風機</p>
        <p type="p">26:乾燥風機</p>
        <p type="p">3:吸附乾燥除濕轉輪元件</p>
        <p type="p">4:熱交換器</p>
        <p type="p">41:熱交換進風口</p>
        <p type="p">42:熱交換出風口</p>
        <p type="p">5:加熱器</p>
        <p type="p">6:智慧聯網模組</p>
        <p type="p">61:連續監控單元</p>
        <p type="p">62:通訊單元</p>
        <p type="p">63:雲端智慧平台</p>
        <p type="p">64:顯示螢幕</p>
        <p type="p">7:行動裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="107" publication-number="202618211">
    <tif-files tif-type="multi-tif">
      <tif file="113139424.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量測關鍵尺寸的光學量測系統與方法</chinese-title>
        <english-title>OPTICAL MEASURING SYSTEM AND METHOD FOR MEASURING CRITICAL DIMENSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250110B">G01B9/00</main-classification>
        <further-classification edition="201801120250110B">G01N23/20</further-classification>
        <further-classification edition="201801120250110B">G01N23/20008</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊福生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林礽俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種量測關鍵尺寸的光學量測系統與方法，該系統包括光源模組、背焦面投影模組、空間濾波元件以及光譜與角度掃描模組。光源模組用以提供寬頻光。背焦面投影模組導引該寬頻光投射至一待測物表面並反射形成繞射及散射測物光聚焦於一背焦平面，該背焦面投影模組，將聚焦於該背焦平面的繞射及散射測物光投影聚焦至一投影面上。空間濾波元件設置於投影面上，聚焦的繞射及散射測物光通過空間濾波元件。光譜與角度掃描模組用以接收通過空間濾波元件的繞射及散射測物光，以產生具有來自樣品反射之散射及繞射角度資訊以及波長資訊的背焦影像。利用該背焦影像可以求得待測物的關鍵尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an optical system and method for measuring critical dimension, in which the system comprises an optical module, back focal plane projection module, spatial filter, and spectrum and angular scanning module. The optical module provides a broadband light. The back focal plane projection module receives the broadband light and projects the broadband light onto surface of an object whereby a diffraction and scattering light is reflected from the surface of the object. The back focal plane projection module projects the focused diffraction light from the back focal plane to a projection plane. The spatial filter is arranged on the projection plane and the focused diffraction light passes through the spatial filter. The spectrum and angular scanning module receive the diffraction light passing through the spatial filter for generating a back focal image having a scattering and diffracting angular information with respect to reflection light of the object and a spectrum information. The back focal image can be utilized to determine the critical dimension of the sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:光學量測系統</p>
        <p type="p">20:包括光源模組</p>
        <p type="p">200:有光源</p>
        <p type="p">201:透鏡組</p>
        <p type="p">201a、201c:準直鏡組</p>
        <p type="p">201b:聚光鏡組</p>
        <p type="p">201d:孔徑光闌</p>
        <p type="p">201e:視場光闌</p>
        <p type="p">201f:貝特朗鏡組</p>
        <p type="p">21:背焦面投影模組</p>
        <p type="p">210:物鏡</p>
        <p type="p">211:貝特朗鏡組</p>
        <p type="p">212:遠心鏡組</p>
        <p type="p">22:空間濾波元件</p>
        <p type="p">23:光譜與角度掃描模組</p>
        <p type="p">24a、24b:分光元件</p>
        <p type="p">230:遠心準直鏡</p>
        <p type="p">231:光柵</p>
        <p type="p">232:聚焦透鏡</p>
        <p type="p">233:影像感測器</p>
        <p type="p">90:寬頻光</p>
        <p type="p">91:繞射及散射測物光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="108" publication-number="202619270">
    <tif-files tif-type="multi-tif">
      <tif file="113139425.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能板及其接地連接結構</chinese-title>
        <english-title>SOLAR PANEL AND ITS GROUNDED CONNECTION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241204B">H02S20/10</main-classification>
        <further-classification edition="201801120241204B">F24S25/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元融科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN-RON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種太陽能板及其接地連接結構，其包含：一片體，其係呈具導電性之剛性材料設置，該片體系呈片狀設置，藉以於一端形成一端面，並於該端面處形成有至少一抵接區域；且該片體貫穿設置有至少一定位孔；該片體係用以透過所述抵接區域壓抵於至少一太陽能板或配置所述太陽能板之框架之側緣上端處；藉此，本發明透過片體呈導電性之剛性材料設置，如：導電複合材料，藉可將所述太陽能板間予以進行接地之電性連接，藉可於其一太陽能板直接或透過框架之配置而接地時，即可令所有之太陽能板接地，以符合用戶用電設備裝置規則之規範，使其具有於用電時之安全性；且本發明無須針對每一太陽能板進行接地配置，使可提升太陽能板於架設、組裝及接地時之便利性者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The prevent invention provides a solar panel and its grounded connection structure, including a sheet which is made of a conductive rigid material. The sheet is arranged in a sheet-like form to create an end surface at one end, with at least one contact area formed on the end surface. Also, the sheet is set with at least one locating hole and used to press against the upper side edge of at least one solar panel or the frame where the solar panel is mounted, through the contact area. By using a sheet made of conductive rigid material, such as conductive composite material, this invention enables electrical grounded connections between the solar panels. When one solar panel is grounded directly or through the frame, all the solar panels will be grounded, complying with electrical equipment installation regulations and ensuring safety during power use. Additionally, this invention dispenses with the need for grounding configuration for each individual solar panel so as to increase the convenience of installing, assembling, and grounding solar panels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:片體</p>
        <p type="p">11:端面</p>
        <p type="p">12:抵接區域</p>
        <p type="p">121:齒部</p>
        <p type="p">13:定位孔</p>
        <p type="p">14:抵接壁</p>
        <p type="p">141:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="109" publication-number="202619355">
    <tif-files tif-type="multi-tif">
      <tif file="113139427.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影片剪輯系統及影片剪輯方法</chinese-title>
        <english-title>VIDEO EDITING SYSTEM AND VIDEO EDITING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">H04N23/90</main-classification>
        <further-classification edition="202201120250203B">G06V20/40</further-classification>
        <further-classification edition="201701120250203B">G06T7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人資訊工業策進會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮明達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUAN, MING-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIAO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RONG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周世俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影片剪輯系統，包含第一攝影機、多個第二攝影機及處理裝置。第一攝影機用以擷取運動場地的第一影片。第二攝影機用以擷取運動場地的複數個第二影片，其中該些第二攝影機具有不同的設置位置。處理裝置用以使第一攝影機及該些第二攝影機的時間同步，並執行以下運作：自第一攝影機取得第一影片，且自該些第二攝影機取得該些第二影片；辨識第一影片中的球體；分析球體的運動軌跡，以建立剪輯時間點；根據運動軌跡，找出對應於運動軌跡的第二攝影機及第二影片；以及根據剪輯時間點，剪輯該些第二影片中的至少一者以產生剪輯影片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A video editing system includes a first camera, multiple second cameras and a processing device. The first camera is configured to capture a first video of a sports field. The second cameras are configured to capture multiple second videos of the sports field, wherein the second cameras have different arrangement positions. The processing device is configured to synchronize the time of the first camera and the second cameras and perform the following operations: obtaining the first video and obtaining the second videos; identifying a ball in the first video; analyzing a movement trajectory of the ball to establish an editing time stamp; find at least one of the second cameras and at least one of the second videos corresponding to the movement trajectory; and editing the at least one second video according to the editing time stamp to generate an edited video.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301-S308:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="110" publication-number="202617228">
    <tif-files tif-type="multi-tif">
      <tif file="113139428.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>羽球智能訓練評量系統、方法與儲存媒體</chinese-title>
        <english-title>BADMINTON INTELLIGENT TRANING EVALUTION SYSTEM, METHOD AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A63B24/00</main-classification>
        <further-classification edition="200601120241031B">A63B69/00</further-classification>
        <further-classification edition="200601120241031B">A63B69/40</further-classification>
        <further-classification edition="201601120241031B">A63B67/18</further-classification>
        <further-classification edition="201701120241031B">G06T7/20</further-classification>
        <further-classification edition="200601120241031B">G09B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JEEN-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江維鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種羽球智能訓練評量系統、方法與儲存媒體。羽球智能訓練評量系統包括一羽球拍、一發球裝置、二第一影像擷取裝置以及一運算裝置。當一或多個程式指令被運算裝置的一或多個處理單元執行時，該一或多個處理單元進行：取得並分析運動員於羽球場地的第一側場地的影像，以即時取得運動員的一空檔區域；依據空檔區域控制發球裝置發出一羽球掉落在空檔區域內；以及取得羽球被運動員回擊過程且掉落在羽球場地的第二側場地之落點位置的影像，並判斷落點位置是否出界。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a badminton intelligent training evaluation system, method and storage medium. The badminton intelligent training evaluation system includes a badminton racket, a serving device, two first image capturing devices and a computing device. When one or more program instructions are executed by one or more processing units of the computing device, the one or more processing units: obtain and analyze images of a player on the first side of the badminton court to obtain vacancy region of the player instantly; control the serving device to send a badminton to fall in the vacancy region according to the vacancy region; and obtain an image of the landing point of the badminton when it is hit back by the player and falls on the second side of the badminton court, and determine whether the landing point is out of bounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P1~P4:處理程序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="111" publication-number="202618112">
    <tif-files tif-type="multi-tif">
      <tif file="113139429.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防爆水箱裝置</chinese-title>
        <english-title>EXPLOSION-PROOF WATER TANK DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">E04H12/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖國勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, KUO HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泊瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防爆水箱裝置，包括：基座、電路控制單元、水箱本體及防爆護罩；其中，該電路控制單元及水箱本體設置在該基座，設置於該水箱本體內部的抽水馬達連接電線管路及出水管路並且延伸出水箱本體，其中該電線管路連接至該電路控制單元，該出水管路連接至該基座的出水口；該防爆護罩與該基座相互組合以共同將該電路控制單元、該水箱本體、該電線管路及該出水管路完全包圍；據此，可以避免在嚴禁煙火的高度危險性環境中使用時因電路控制單元在操作過程中可能產生的火花外洩而產生爆炸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An explosion-proof water tank device is provided, comprising: a base, a circuit control unit, a water tank body, and an explosion-proof shield; wherein the circuit control unit and the water tank body are installed on the base. A water pump installed inside the water tank body is connected to an electrical conduit and a water outlet pipe, both extending outside the water tank body. The electrical conduit is connected to the circuit control unit, and the water outlet pipe is connected to the water outlet of the base. The explosion-proof shield is combined with the base to completely enclose the circuit control unit, the water tank body, the electrical conduit, and the water outlet pipe. Accordingly, this can prevent explosions caused by sparks that may be generated during the operation of the circuit control unit when used in highly hazardous environments where open flames are strictly prohibited.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基座</p>
        <p type="p">101:底座</p>
        <p type="p">103:垂直板</p>
        <p type="p">105:側板</p>
        <p type="p">107:出水口</p>
        <p type="p">109:螺孔</p>
        <p type="p">20:電路控制單元</p>
        <p type="p">30:水箱本體</p>
        <p type="p">401A:第一電線管路</p>
        <p type="p">401B:第二電線管路</p>
        <p type="p">403:出水管路</p>
        <p type="p">50:防爆護罩</p>
        <p type="p">501:頂壁</p>
        <p type="p">503:垂直壁</p>
        <p type="p">505:側壁</p>
        <p type="p">507:洞孔</p>
        <p type="p">601:浮標電線管路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="112" publication-number="202618175">
    <tif-files tif-type="multi-tif">
      <tif file="113139430.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光模組</chinese-title>
        <english-title>LIGHT EMITTING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250110B">F21V33/00</main-classification>
        <further-classification edition="200601120250110B">F21V13/00</further-classification>
        <further-classification edition="200601120250110B">F21V8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱振豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光模組包含基座、導光片、電路板、發光單元及膜片。基座包含基板及第一擋牆。第一擋牆設置在基板的側邊。導光片設置於基板上並包含出光區及均光區。出光區鄰近第一擋牆。電路板的至少一部分設置於均光區上。發光單元設置於電路板面向導光片的表面上。該發光單元所發出的光線進入該均光區並從該出光區出射。膜片設置於導光片及電路板上。膜片具有第一區與第二區。第一區的透光度大於第二區的透光度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting module includes a base, a light guide sheet, a circuit board, a light emitting unit, and a film. The base comprises a base plate and a first dam. The first dam is disposed on a side of the base plate. The light guide sheet is disposed on the base plate and includes a light exit region and a light mixing region. The light exit region is adjacent to the first dam. At least a part of the circuit board is disposed on the light mixing region. The light emitting unit is disposed on a surface of the circuit board facing the light guide sheet. A light emitted by the light emitting unit enters the light mixing region and exits from the light exit region. The film is disposed on the light guide sheet and the circuit board. The film has a first zone and a second zone. A light transmittance of the first zone is greater than a light transmittance of the second zone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基座</p>
        <p type="p">110:基板</p>
        <p type="p">115:第一擋牆</p>
        <p type="p">12:導光片</p>
        <p type="p">121:出光區</p>
        <p type="p">122:均光區</p>
        <p type="p">13:電路板</p>
        <p type="p">14:發光單元</p>
        <p type="p">15:膜片</p>
        <p type="p">151:第一區</p>
        <p type="p">152:第二區</p>
        <p type="p">16:遮光件</p>
        <p type="p">17:殼體</p>
        <p type="p">C:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="113" publication-number="202619058">
    <tif-files tif-type="multi-tif">
      <tif file="113139431.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241023B">H01L23/28</main-classification>
        <further-classification edition="200601120241023B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭天豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡居諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝結構包含基板、影像感測晶片、金屬線、蓋體、第一封膠層及焊球陣列。影像感測晶片位於基板之上表面上。金屬線之二端分別電性連接影像感測晶片及基板之上表面的上接觸點。蓋體之下表面連接蓋體之第一蓋體側面，且蓋體之下表面與第一蓋體側面之間具有大於90度的第一蓋體夾角。第一封膠層側向包封基板、金屬線、影像感測晶片及蓋體，並暴露出影像感測晶片之上表面的一部分，且第一封膠層、蓋體之下表面與暴露出的影像感測晶片之上表面的該部分之間定義一氣室。焊球陣列包含焊球，各焊球個別地電性連接基板之下表面的下接觸點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor packaging structure includes a substrate, an image sensor chip, multiple metal wires, a cover, a first molding layer, and a ball grid array. The image sensor chip is on an upper surface of the substrate. Two ends of the metal wire are respectively electrically connected to the image sensor chip and one or more upper contacts of the upper surface of the substrate. A lower surface of the cover is connected to a first cover side, and between a lower surface of the cover and the first cover side is a first cover angle greater than 90 degrees. The first molding layer is configured to laterally package the substrate, the metal wires, the image sensor chip, and the cover to expose a portion of an upper surface of the image sensor chip. A chamber is defined by the first molding layer, the lower surface of the cover, and the exposed portion of the upper surface of the image sensor chip. The ball grid array includes multiple solder balls, and each of the solder balls is individually electrically connected to one or more lower contacts of the lower surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:半導體封裝結構</p>
        <p type="p">20:基板</p>
        <p type="p">200:(基板之)上表面</p>
        <p type="p">201:上接觸點</p>
        <p type="p">202:走線</p>
        <p type="p">203:下接觸點</p>
        <p type="p">204:(基板之)下表面</p>
        <p type="p">21:焊球陣列</p>
        <p type="p">210:焊球</p>
        <p type="p">22:影像感測晶片</p>
        <p type="p">23:蓋體</p>
        <p type="p">230:(蓋體之)下表面</p>
        <p type="p">231:第一蓋體側面</p>
        <p type="p">232:第二蓋體側面</p>
        <p type="p">25:氣室</p>
        <p type="p">26:金屬線</p>
        <p type="p">27:第一封膠層</p>
        <p type="p">270:(第一封膠層之)上表面</p>
        <p type="p">271:第一封膠側面</p>
        <p type="p">28:第二封膠層</p>
        <p type="p">280:(第二封膠層之)上表面</p>
        <p type="p">281:第二封膠側面</p>
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;,θ&lt;sub&gt;1&lt;/sub&gt;’:第一蓋體夾角</p>
        <p type="p">X:座標之X軸</p>
        <p type="p">Y:座標之Y軸</p>
        <p type="p">Z:座標之Z軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="114" publication-number="202617265">
    <tif-files tif-type="multi-tif">
      <tif file="113139432.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硫化奈米零價鐵的製備方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SULFIDE NANOZEROVALENT IRON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241023B">B01J20/30</main-classification>
        <further-classification edition="202301120241023B">C02F1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淡江大學學校財團法人淡江大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMKANG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奇旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種硫化奈米零價鐵的製備方法。硫化奈米零價鐵的製備方法包含準備步驟、電解步驟、收集步驟、以及硫化步驟。準備步驟是準備電解槽，充滿含鐵電解質溶液，其中含鐵電解質溶液濃度為15mM至90mM。電解步驟是在無氧氣氛下對電解槽通入電流以進行電解反應，其中電流的電流強度為0.5至5安培，而使電解槽的陰極表面的鐵離子還原成奈米零價鐵，並回到含鐵電解質溶液中。硫化步驟是含奈米零價鐵的溶液，在無氧氣氛下，將其表面硫化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of sulfide nanoscale zero-valent iron (nZVI) includes a preparation step, an electrolysis step, a collection step, and a sulfidation step. The preparation step is to prepare an electrolytic tank and to fill it with an iron-containing electrolyte solution, where the concentration of the iron-containing electrolyte solution is 15mM to 90mM. The electrolysis step is to pass electric current into the electrolytic tank to perform the electrolysis reaction in an oxygen-free atmosphere, in which the current intensity is 0.5 to 5 amps, and the iron ions on a surface of a cathode in the electrolytic tank are reduced to nZVI, and fall back into the iron-containing electrolyte solution. The sulfidation step is to sulfide the surface of the collected nZVI in the iron-containing electrolyte solution in an oxygen-free atmosphere.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:硫化奈米零價鐵的製備方法</p>
        <p type="p">S10:準備步驟</p>
        <p type="p">S20:電解步驟</p>
        <p type="p">S30:硫化步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="115" publication-number="202619201">
    <tif-files tif-type="multi-tif">
      <tif file="113139442.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有屏蔽結構的板對板連接器</chinese-title>
        <english-title>BOARD TO BOARD CONNECTOR WITH A SHIELDING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241223B">H01R13/6581</main-classification>
        <further-classification edition="200601120241223B">H01R13/22</further-classification>
        <further-classification edition="201101120241223B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉英志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王則閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭名偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有屏蔽結構的板對板連接器，其包括第一電路板、第一連接件、緩衝導電體、第二電路板、第二連接件以及屏蔽罩。第一連接件設置於第一電路板。緩衝導電體設置於第一電路板上，並圍繞第一連接件。第二電路板垂直於第一電路板，第二電路板的        &lt;b&gt;一&lt;/b&gt;側邊具有第一金屬層。第二連接件設置於第二電路板，並沿一對接方向對接於第一連接件。屏蔽罩設置於第二電路板上，並包圍第二連接件。當第二連接件沿對接方向對接於第一連接件時，第二電路板的側邊抵接於緩衝導電體，使第一金屬層電性連接於緩衝導電體，且屏蔽罩包圍第一連接件。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A board-to-board connector with a shielding structure includes a first circuit board, a first connector, a buffering conductor, a second circuit board, a second connector, and a shielding cover. The first connector is disposed on the first circuit board. The buffering conductor is disposed on and the first circuit board and surrounds the first connector. The second circuit board is perpendicular to the first circuit board, and a side of the second circuit board has a first metal layer. The second connector is disposed on the second circuit board and is mated with the first connector along a mating direction. The shielding cover is disposed on the second circuit board and surrounds the second connector. When the second connector is docked with the first connector along the mating direction, the side of the second circuit board is in contact with the buffering conductor, such that the first metal layer is electrically connected to the buffering conductor, and the shielding cover surrounds the first connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M1:第一板端連接器</p>
        <p type="p">1:第一電路板</p>
        <p type="p">2:第一連接件</p>
        <p type="p">3:緩衝導電體</p>
        <p type="p">3U:上表面</p>
        <p type="p">4:第二電路板</p>
        <p type="p">6:屏蔽罩</p>
        <p type="p">61:凸伸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="116" publication-number="202618608">
    <tif-files tif-type="multi-tif">
      <tif file="113139445.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>幻覺檢測系統、幻覺檢測方法及電子裝置</chinese-title>
        <english-title>HALLUCINATION DETECTION SYSTEM, HALLUCINATION DETECTION METHOD, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241104B">G06F40/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人資訊工業策進會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊又權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳棅易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PING-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種幻覺檢測系統、幻覺檢測方法及電子裝置。電子裝置包含幻覺檢測系統。幻覺檢測系統包含儲存器及處理器。處理器能執行幻覺檢測方法。幻覺檢測方法包含：轉換步驟、真偽檢測步驟及結果輸出步驟。轉換步驟是依據輸出文本產生多筆輸出字詞網路。真偽檢測步驟是利用已預先訓練的圖嵌入模型，產生多筆真偽資訊。各筆真偽資訊是代表其中一筆輸出字詞網路經圖嵌入模型判斷後為真實或虛假。結果輸出步驟是依據多筆真偽資訊，產生幻覺檢測結果資訊。圖嵌入模型是利用單一知識領域中的多筆正向字詞網路及多筆反向字詞網路進行訓練。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a hallucination detection system, a hallucination detection method, and an electronic device. The electronic device comprises the hallucination detection system. The hallucination detection system includes a storage unit and a processor. The processor is configured to execute the hallucination detection method. The hallucination detection method comprises a conversion step, a veracity detection step, and a result output step. In the conversion step, multiple output word net are generated based on an output text. In the veracity detection step, multiple veracity information are generated using a pre-trained graph embedding model. Each veracity information represents whether one of the output word net is determined to be true or false by the pre-trained graph embedding model. In the result output step, hallucination detection result information is generated based on the multiple veracity information. The graph embedding model is trained using multiple positive word net and multiple negative word net from a single knowledge domain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11:轉換步驟</p>
        <p type="p">S12:真偽檢測步驟</p>
        <p type="p">S13:結果輸出步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="117" publication-number="202617353">
    <tif-files tif-type="multi-tif">
      <tif file="113139447.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙夾虎鉗自動復歸結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">B25B1/24</main-classification>
        <further-classification edition="200601120241104B">B25B1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙夾虎鉗自動復歸結構，其於虎鉗本體上設浮動式動力裝置，包括長螺桿前段套設不同旋向短螺桿，短螺桿前端設環凹槽卡扣一止推片，兩螺絲件得穿貫止推片二穿孔、一軸承套二通孔而鎖固至一油壓蓋之兩螺孔，使短螺桿仍可轉動的限位至油壓蓋，長、短螺桿分別螺設驅動一夾座組，長螺桿前端穿貫一壓缸後以一拉桿固定；主要於油壓蓋處設定位導引結構，導引油壓蓋浮動狀態，於氣壓蓋設復歸結構包括一復歸片為兩復位桿及螺帽限位，拉桿定位溝設C型扣並可抵觸復歸片，據此無需使用彈簧，氣壓推動復位可拉動拉桿迫動復歸片穩定動作復位者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">20:虎鉗本體</p>
        <p type="p">21:前夾座組</p>
        <p type="p">212:前夾座</p>
        <p type="p">22:後夾座組</p>
        <p type="p">222:後夾座</p>
        <p type="p">23:固定塊</p>
        <p type="p">32:拉桿</p>
        <p type="p">50:壓缸</p>
        <p type="p">52:油壓蓋</p>
        <p type="p">53:氣壓蓋</p>
        <p type="p">60:定位導引結構</p>
        <p type="p">61:螺絲</p>
        <p type="p">62:墊片</p>
        <p type="p">63:定位桿</p>
        <p type="p">70:復歸結構</p>
        <p type="p">71:復歸片</p>
        <p type="p">72:C型扣</p>
        <p type="p">73:復位桿</p>
        <p type="p">74:螺帽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="118" publication-number="202618244">
    <tif-files tif-type="multi-tif">
      <tif file="113139448.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬可鍛性評估方法及金屬表面裂紋提示構件</chinese-title>
        <english-title>METAL FORGEABILITY EVALUATION METHOD AND METAL SURFACE CRACK PROMPTING COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01N19/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾啟銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許曉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種金屬可鍛性評估方法，包含：將一金屬表面裂紋提示構件所包含之一金屬線材之一第一端及一第二端接合於一金屬圓柱試件之一圓形截面；將金屬圓柱試件橫置於一成形設備之一成形平板模具上，使金屬表面裂紋提示構件朝向不被成形平板模具壓縮之任一側；以成形平板模具壓縮金屬圓柱試件，並記錄金屬圓柱試件之塑流應力曲線；以及當金屬表面裂紋提示構件斷裂即停止壓縮，並根據塑流應力曲線判斷金屬圓柱試件之可鍛性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metal forgeability evaluation method includes: connecting a first endpoint and a second endpoint of a metal wire with a metal surface crack prompting component to a circular cross section of a metal cylinder specimen; laying the metal cylinder specimen horizontally on a flat forming mold of a forming equipment, and the metal surface crack prompting component is placed toward any side that is not compressed by the flat forming mold; compressing the metal cylinder specimen by the flat forming mold and recording the flow stress curve of the metal cylinder specimen; stopping compression immediately as the metal surface crack prompting component is broken, and determining forgeability of the metal cylinder specimen according to the flow stress curve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:金屬表面裂紋提示構件</p>
        <p type="p">210:線材</p>
        <p type="p">210a,210b:端點</p>
        <p type="p">300:金屬圓柱試件</p>
        <p type="p">310:柱</p>
        <p type="p">320a,320b:圓形截面</p>
        <p type="p">D:構件距離</p>
        <p type="p">H1,H2:高度</p>
        <p type="p">L:線材長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="119" publication-number="202617233">
    <tif-files tif-type="multi-tif">
      <tif file="113139450.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>詩集牌組及其遊戲方法</chinese-title>
        <english-title>POETRY ANTHOLOGY CARD SET AND GAMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A63F1/02</main-classification>
        <further-classification edition="200601120241230B">A63F1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓秋麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CHIU LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓秋麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CHIU LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種詩集牌組，包含複數牌，牌由M×N張組成，M首詩，一首詩N句，各牌具有一文字區，文字區設有一配對詩句，配對詩句為一首詩N句的其中一句，以配對詩句湊成一首詩N句的每一詩句。藉以達到文學素養的培養以及兼具寓教於樂的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A poetry anthology card set comprising a plurality of cards arranged in an M×N format, wherein M represents a distinct number of poems, and each poem consists of N lines. Each card features a text area containing a selected line from one of the N lines of a corresponding poem, thereby enabling players to construct a complete poem by pairing each line with its corresponding line on the card. The objective is to cultivate literary literacy while simultaneously providing an educational and entertaining experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:詩集牌組</p>
        <p type="p">20:牌</p>
        <p type="p">21:文字區</p>
        <p type="p">21A:配對詩句</p>
        <p type="p">21B:提示詩句</p>
        <p type="p">22:符號區</p>
        <p type="p">22A:花色</p>
        <p type="p">22B:數字</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="120" publication-number="202617365">
    <tif-files tif-type="multi-tif">
      <tif file="113139452.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭力扳手鎖定環定位結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25B23/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大軍產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIG JIUN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱昱辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扭力扳手鎖定環定位結構，包含彼此沿軸心穿套的一中空桿體和一扭力調整握把，以及套接於扭力調整握把外部且可於鎖定位置和解鎖位置切換的一鎖定環。該鎖定環的內部環設第一定位槽和第二定位槽，該扭力調整握把設一定位組合件，該定位組合件包括圓筒、壓縮彈簧和定位珠；當鎖定環位於解鎖位置時，定位珠限位於第一定位槽；當鎖定環位於鎖定位置時，定位珠限位於第二定位槽；據上述構造，該鎖定環能有效鎖定扭力調整握把，提高扭力扳手的使用安全性與扭力準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:卡制段</p>
        <p type="p">111:外壁</p>
        <p type="p">21:定位段</p>
        <p type="p">30:鎖定環</p>
        <p type="p">51:卡制槽</p>
        <p type="p">53:第一球珠</p>
        <p type="p">54:第二球珠</p>
        <p type="p">55:退讓槽</p>
        <p type="p">56:推制部</p>
        <p type="p">57:斜面</p>
        <p type="p">61:定位組合件</p>
        <p type="p">62:第一定位槽</p>
        <p type="p">63:第二定位槽</p>
        <p type="p">P2:鎖定位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="121" publication-number="202619250">
    <tif-files tif-type="multi-tif">
      <tif file="113139454.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於下橋感測數據調變電壓的電源轉換器</chinese-title>
        <english-title>POWER CONVERTER OF MODULATING VOLTAGE BASED ON LOW-SIDE SENSED DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H02M3/156</main-classification>
        <further-classification edition="200601120250122B">H02M1/08</further-classification>
        <further-classification edition="200601120250122B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種基於下橋感測數據調變電壓的電源轉換器。本發明的電源轉換器包含上橋開關、下橋開關、反饋電路、電流感測調變電路、比較電路、控制電路以及驅動電路。反饋電路依據電感的第二端的電壓以輸出一反饋訊號。電流感測調變電路感測從電源轉換器的輸出端依序流經電感以及下橋開關的電流，據以調變反饋訊號或是調變一斜波電壓(或占空比)。比較電路將反饋訊號的電壓與斜波電壓進行比較以輸出比較訊號。控制電路依據第一比較訊號以輸出控制訊號。驅動電路依據控制訊號，驅動上橋開關以及下橋開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power converter of modulating a voltage based on low-side sensed data is provided. The power converter includes a high-side switch, a low-side switch, a feedback circuit, a current sense modulating circuit, a comparing circuit, a control circuit and a driver circuit. The feedback circuit outputs a feedback signal according to a voltage of a second terminal of an inductor. The current sense modulating circuit senses a current that flows from an output terminal of the power converter sequentially through the inductor and the low-side switch, and modulates the feedback signal or a ramp voltage (or a duty cycle) according to the sensed current. The comparing circuit compares a voltage of the feedback signal with the ramp voltage to output a comparing signal. The control circuit outputs a control signal according to the comparing signal. The driver circuit drives the high-side and the low-side switch according to the control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">HS:上橋開關</p>
        <p type="p">LS:下橋開關</p>
        <p type="p">LX:節點</p>
        <p type="p">L:電感</p>
        <p type="p">Cout:輸出電容</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">IL:負電流</p>
        <p type="p">CUS:電流感測調變電路</p>
        <p type="p">DVT:分壓電路</p>
        <p type="p">Rd1:第一分壓電阻</p>
        <p type="p">Rd2:第二分壓電阻</p>
        <p type="p">VFB:反饋電壓</p>
        <p type="p">FK:反饋電路</p>
        <p type="p">ERR:誤差放大器</p>
        <p type="p">VREF:第一參考電壓</p>
        <p type="p">EAO1:反饋訊號</p>
        <p type="p">REA:受電元件</p>
        <p type="p">NM1:調變節點</p>
        <p type="p">CM:比較電路</p>
        <p type="p">CMP1:第一比較器</p>
        <p type="p">RAMP1:斜波電壓</p>
        <p type="p">CTR:控制電路</p>
        <p type="p">DRV:驅動電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="122" publication-number="202617101">
    <tif-files tif-type="multi-tif">
      <tif file="113139455.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動植釘系統</chinese-title>
        <english-title>AUTOMATIC SCREW IMPLANTATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241031B">A61B34/10</main-classification>
        <further-classification edition="200601120241031B">A61B17/90</further-classification>
        <further-classification edition="200601120241031B">A61B17/56</further-classification>
        <further-classification edition="201601120241031B">A61B34/30</further-classification>
        <further-classification edition="201601120241031B">A61B90/00</further-classification>
        <further-classification edition="201801120241031B">G16H30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>炳碩生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POINT ROBOTICS MEDTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳詩元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石耘碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, YUN-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田永皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, YONG-HOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種自動植釘系統的操作方法。操作方法包括以下步驟:操作植釘裝置移動至一手術切口的上方位置;操作植釘裝置沿一軸向移動而進入手術切口內，使導針的針尖碰觸到一預定手術部位; 通過馬達元件驅動導針前進並同時以一第一轉速及一第一扭力進行轉動，使導針鑽入預定手術部位而形成一導孔;通過馬達元件驅動動力傳導組件，控制中空椎弓釘以一第二轉速及一第二扭力鎖入導孔，其中第二轉速小於第一轉速，第二扭力大於第一扭力;以及解除動力傳導組件與中空椎弓釘的連接，並操作植釘裝置退出至手術切口外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for operating automatic screw implantation system includes the following steps: operating a nail implantation device to move to an upper position of a surgical incision; operating the nail implantation device to move along an axial direction and enter the surgical incision, so that a tip of a guide needle touches a predetermined surgical site; providing a motor to drive the guide needle forward and simultaneously rotates at a first rotational speed and a first torque, so that the guide needle drills into the predetermined surgical site to form a pilot hole; providing the motor to drive a power transmission component to control a hollow pedicle screw to lock into the pilot hole at a second rotation speed and a second torque, the second rotation speed is smaller than the first rotation speed, and the second torque is greater than the first torque; disconnecting the power transmission component from the hollow pedicle screw, and operating the screw implantation device to withdraw from the surgical incision.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:自動植釘系統</p>
        <p type="p">1:植釘裝置</p>
        <p type="p">2:機器裝置</p>
        <p type="p">3:處理裝置</p>
        <p type="p">4:手術導航模組</p>
        <p type="p">41:導航標記元件</p>
        <p type="p">42:光學追蹤器</p>
        <p type="p">5:顯示裝置</p>
        <p type="p">B:患者</p>
        <p type="p">S:手術切口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="123" publication-number="202618541">
    <tif-files tif-type="multi-tif">
      <tif file="113139458.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種跨平台函式庫的建立方法及使用其該方法之電子裝置</chinese-title>
        <english-title>A METHOD FOR DEVELOPING CROSS-PLATFORM LIBRARIES AND AN ELECTRONIC DEVICE USING SAID METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G06F8/54</main-classification>
        <further-classification edition="201801120250203B">G06F8/30</further-classification>
        <further-classification edition="201801120250203B">G06F9/445</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威強電工業電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IEI INTEGRATION CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭元誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王良丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種跨平台函式庫的建立方法適用於符合一判斷條件之電子裝置之系統開發，該方法包含下列步驟:a)依據該電子裝置之硬體規格選擇可搭載之複數個作業系統並產生對應之設備節點檔案及建立該判斷條件；b)依所述各作業系統及所述設備節點檔案彙整出一函式庫需求，該函式庫需求具有至少一通用函式庫及對應各別作業系統之特定函式庫；c)對所述之特定函式庫以原生碼(native code)方式建立對應之原生函式庫；d) 以條件編譯指令處理所述各原生函式庫中具有之特定程式碼；e)編譯所述各原生函式庫及所述至少一通用函式庫以產生一跨平台函式庫，俾於以該跨平台函式庫達到該電子裝置之跨作業系統及跨版本的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for establishing a cross-platform library applicable to system development for electronic devices meeting a specific criterion, comprising the following steps:        &lt;br/&gt;a) Selecting multiple operating system that can be loaded based on predetermined electronic device system hardware specifications, generating corresponding device node files, and establishing the specific criterion; b) Compiling a library requirement based on the aforementioned operating systems and device node information, where the library requirement includes at least one common library and specific library corresponding to each individual operating system; c) Establish a corresponding native library for each operating system associated with the aforementioned specific libraries by using native code; d) Process the specific code present in each native library by using conditional compilation instructions; e) Compile the various native libraries and at least one common library to produce a cross-platform library, in order to achieve cross-operating system and cross-version functionality for the electronic device using this cross-platform library.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟a):依據該電子裝置之硬體規格選擇可搭載之複數個作業系統並產生對應之設備節點檔案及建立該判斷條件</p>
        <p type="p">步驟b):依所述各作業系統及所述設備節點檔案彙整出一函式庫需求，該函式庫需求具有至少一通用函式庫及對應各別作業系統之特定函式庫</p>
        <p type="p">步驟c):對所述之特定函式庫以原生碼方式建立對應之原生函式庫</p>
        <p type="p">步驟d):以條件編譯指令處理所述各原生函式庫中具有之特定程式碼</p>
        <p type="p">步驟e):編譯所述各原生函式庫及所述至少一通用函式庫以產生一跨平台函式庫，俾於以該跨平台函式庫達到該電子裝置之跨作業系統及跨版本的功能</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="124" publication-number="202619448">
    <tif-files tif-type="multi-tif">
      <tif file="113139460.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>傳動機構、轉接模組及資料處理裝置</chinese-title>
        <english-title>TRANSMISSION MECHANISM, ADAPTER MODULE AND DATA PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">H05K7/14</main-classification>
        <further-classification edition="200601120241030B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯穎科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIWYNN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉秉昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, PING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡來旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, LAI-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種傳動機構，包括一第一滑桿、一第二滑桿、一橫桿以及至少一電源夾。第二滑桿平行第一滑桿。橫桿的一端連接第一滑桿，且橫桿的另一端連接第二滑桿。至少一電源夾固定於橫桿。傳動機構可應用於轉接模組及資料處理裝置，以使電子元件與機櫃的拆裝更快速且更方便。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transmission mechanism includes a first sliding rod, a second sliding rod, a transverse rod and at least one power clip. The second sliding rod is parallel to the first sliding rod. An end of the transverse rod is connected to the first sliding rod, and another end of the transverse rod is connected to the second sliding rod. The at least one power clip is fixed to the transverse rod. The transmission mechanism may be applied to an adapter module and a data processing device to make the disassembly and assembly of an electronic component and a rack faster and more convenient.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:傳動機構</p>
        <p type="p">31:第一滑桿</p>
        <p type="p">32:第二滑桿</p>
        <p type="p">33:橫桿</p>
        <p type="p">34:電源夾</p>
        <p type="p">35:分離器</p>
        <p type="p">36:殼體</p>
        <p type="p">37:支架</p>
        <p type="p">38:導引銷</p>
        <p type="p">352:蓋體</p>
        <p type="p">360:卡槽</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="125" publication-number="202617484">
    <tif-files tif-type="multi-tif">
      <tif file="113139471.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139471</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>駕駛監控系統和駕駛監控方法</chinese-title>
        <english-title>DRIVER MONITORING SYSTEM AND DRIVER MONITORING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241204B">B60W40/09</main-classification>
        <further-classification edition="201201120241204B">B60W30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈三聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SAN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晉輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種駕駛監控系統和駕駛監控方法。駕駛監控方法包含：通過雷達偵測駕駛的第一心搏訊號；從第一心搏訊號提取心跳間隔訊號；根據心跳間隔訊號產生心率變異資料，其中心率變異資料包含低頻功率以及高頻功率；根據心率變異資料判斷駕駛是否疲勞；以及響應於判斷駕駛疲勞，輸出告警訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driver monitoring system and a driver monitoring method are provided. The driver monitoring method includes: detecting first heartbeat signal of a driver through a radar; extracting beat-to-beat interval signal from the heartbeat signal; generating heart rate variability data according to the beat-to-beat interval signal, wherein the heart rate variability data includes a low frequency power and a high frequency power; determining whether the driver is fatigued according to the heart rate variability data; and outputting an alarm message in response to determining the driver being fatigued.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501,S502,S503,S504,S505:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="126" publication-number="202618492">
    <tif-files tif-type="multi-tif">
      <tif file="113139473.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能巡檢系統及智能巡檢方法</chinese-title>
        <english-title>INTELLIGENT INSPECTION SYSTEM AND INTELLIGENT INSPECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241231B">G05D1/46</main-classification>
        <further-classification edition="201401120241231B">H02S50/10</further-classification>
        <further-classification edition="202401320241231B">G05D109/20</further-classification>
        <further-classification edition="202401320241231B">G05D105/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊坤格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUNKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韋承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳素瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SU-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖國凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, KUO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇琳貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LINKUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種智能巡檢系統及智能巡檢方法。智能巡檢系統包括異常檢測子系統以及無人飛行器。異常檢測子系統自多個感測器接收多筆即時感測資料，並基於多筆即時感測資料與多筆歷史效能資料產生預測結果。響應於預測結果為異常，異常檢測子系統將預測結果輸出至無人飛行器。無人飛行器基於預測結果產生最佳路徑結果，並基於最佳路徑結果收集即時影像資料。無人飛行器根據即時影像資料產生巡檢結果，並將巡檢結果輸出至異常檢測子系統。異常檢測子系統根據巡檢結果產生預維護通知，並輸出預維護通知。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent inspection system and an intelligent inspection method are provided. The intelligent inspection system includes an anomaly detection subsystem and an unmanned aircraft. The anomaly detection subsystem receives a plurality of real-time sensing data from a plurality of sensors and generates a prediction result based on the plurality of real-time sensing data and a plurality of historical performance data. In response to the prediction result being abnormal, the anomaly detection subsystem outputs the prediction result to the unmanned aircraft. The unmanned aircraft generates an optimal route result based on the prediction result, and collects a real-time image based on the optimal route result. The unmanned aircraft generates an inspection result according to the real-time image and outputs the inspection result to the anomaly detection subsystem. The anomaly detection subsystem generates a preventive maintenance notice according to the inspection result and outputs the preventive maintenance notice.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智能巡檢系統</p>
        <p type="p">110:異常檢測子系統</p>
        <p type="p">120:無人飛行器</p>
        <p type="p">200-1、200-2、200-3、200-N:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="127" publication-number="202618212">
    <tif-files tif-type="multi-tif">
      <tif file="113139474.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多通道光學干涉顯微系統</chinese-title>
        <english-title>MULTI-CHANNEL OPTICAL INTERFERENCE MICROSCOPIC SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241128B">G01B9/02</main-classification>
        <further-classification edition="200601120241128B">G02B21/00</further-classification>
        <further-classification edition="200601120241128B">G02B6/10</further-classification>
        <further-classification edition="200601120241128B">G02B6/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李哲睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JHE-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴崇禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, CHUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, KAI-SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種多通道光學干涉顯微系統，包括至少一照明光源、陣列式物鏡組、多個波導以及多個感測器。陣列式物鏡組包括以陣列形式排列的多個物鏡。該些波導分別對應該些物鏡。該些感測器分別對應該些波導。該些感測器至少包括第一感測器以及第二感測器。該些波導中的至少兩個波導分別朝第一方向以及第二方向傳遞待測光，且第一方向與第二方向不同。朝第一方向傳遞的待測光進入第一感測器，且朝第二方向傳遞的待測光進入第二感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-channel optical interference microscopic system including at least one illumination light source, an objective lens array set, multiple waveguides and multiple sensors is provided. The objective lens array set includes multiple objective lenses arranged in an array. The waveguides respectively correspond to the objective lenses. The sensors correspond to the waveguides, respectively. The sensors include at least a first sensor and a second sensor. At least two of the waveguides respectively transmit light to be measured in a first direction and a second direction, and the first direction and the second direction are different. The light to be measured transmitted in the first direction enters the first sensor, and the light to be measured transmitted in the second direction enters the second sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多通道光學干涉顯微系統</p>
        <p type="p">10:波導模組</p>
        <p type="p">20:陣列式物鏡組</p>
        <p type="p">30:光源模組</p>
        <p type="p">50:基板</p>
        <p type="p">60:聚焦透鏡元件</p>
        <p type="p">70:準直透鏡元件</p>
        <p type="p">101:波導</p>
        <p type="p">201:物鏡</p>
        <p type="p">301:照明光源</p>
        <p type="p">401:感測器</p>
        <p type="p">BS:分光鏡</p>
        <p type="p">L0:照明光</p>
        <p type="p">L02:第二部分照明光</p>
        <p type="p">L1:待測光</p>
        <p type="p">SA:待測物</p>
        <p type="p">S1、S2:光學面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="128" publication-number="202618542">
    <tif-files tif-type="multi-tif">
      <tif file="113139477.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化空中下載測試系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G06F8/65</main-classification>
        <further-classification edition="200601220250203B">G07C5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳駿科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃玉成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林智鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛虎峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, HU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種自動化空中下載測試系統，包括：測試管理平台，包括主機及軟體模組、人機交互介面、數據庫以及腳本執行模組；測試設備，包括電源模組、車用網路交互模組及車用協議連接端口；以及客戶端待測設備，包括主控機台以及連接端口，客戶端待測設備為車輛模擬台架或實體車輛；其中，測試管理平台電性連接至客戶端待測設備，測試設備電性連接至測試管理平台及客戶端待測設備，車用網路交互模組電性連接至連接端口，其中，數據庫中儲存腳本，腳本關聯於自動化空中下載測試流程，測試管理平台依據腳本的內容於客戶端待測設備上進行測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:測試管理平台</p>
        <p type="p">20:測試設備</p>
        <p type="p">30:客戶端待測設備</p>
        <p type="p">101:主機及軟體模組</p>
        <p type="p">103:人機交互介面</p>
        <p type="p">105:數據庫</p>
        <p type="p">107:腳本執行模組</p>
        <p type="p">201:電源模組</p>
        <p type="p">203:車用網路交互模組</p>
        <p type="p">205:車用協議連接端口</p>
        <p type="p">301:主控機台</p>
        <p type="p">303:連接端口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="129" publication-number="202618916">
    <tif-files tif-type="multi-tif">
      <tif file="113139480.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139480</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射改質並藉金屬玻璃微粒子轟擊之乾式蝕刻法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">H01L21/306</main-classification>
        <further-classification edition="201401120241128B">B23K26/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>態金材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雷射改質並藉金屬玻璃微粒子轟擊之乾式蝕刻法，係先以雷射對基板進行選擇性改質弱化後，再以金屬玻璃微粒子在改質區進行轟擊，俾在基板上鑽孔或形成結構之乾式蝕刻法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">11:雷射改質區</p>
        <p type="p">12:凹孔</p>
        <p type="p">3:金屬玻璃微粒子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="130" publication-number="202617284">
    <tif-files tif-type="multi-tif">
      <tif file="113139484.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工件油汙之碳氫清洗裝置及其使用方法</chinese-title>
        <english-title>HYDROCARBON CLEANING DEVICE OF WORKPIECE OIL AND ITS USE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241022B">B08B3/10</main-classification>
        <further-classification edition="202401120241022B">B08B1/52</further-classification>
        <further-classification edition="202401120241022B">B08B1/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎佳億科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TINGJIAYI TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鼎驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種工件油汙之碳氫清洗裝置及其使用方法，其主要係藉由將碳氫溶劑導入容置空間內，直到碳氫溶劑之液位達到預定高度，並啟動循環泵攪動容置空間內之碳氫溶劑，使碳氫溶劑充分的與工件外表面的油汙接觸，使油汙更快速的溶解於碳氫溶劑，且由於引入之碳氫溶劑為90°C，進而可讓工件表面溫度提升至90°C，並藉由開啟排氣閥及真空泵，使容置空間內的壓力達到2000pa，讓容置空間內達到氣化條件，使殘留於工件表面的碳氫溶劑轉化為氣態，乾燥工件表面，進而達成快速、高效且便捷的去除油汙之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hydrocarbon cleaning device of workpiece oil and its use method, which introduces a hydrocarbon solvent into a receiving space until the level of the hydrocarbon solvent reaches the predetermined height, and starts the circulation pump to stir the hydrocarbon solvent in the receiving space, so that the hydrocarbon solvent fully contacts with oil on an outer surface of a workpiece, the oil dissolves in the hydrocarbon solvent more quickly, since the introduced hydrocarbon solvent is about 90 degrees, the surface temperature of the workpiece can be increased to 90 degrees, and by opening an exhaust valve and a vacuum pump, the pressure in the receiving space is reached to about 2000pa, which lets the receiving space to achieve gasification conditions, making the residual hydrocarbon solvent on the surface of the workpiece converted into a gaseous state to dry the surface of the workpiece, and then achieve a rapid, efficient and convenient effect of oil removal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:清洗槽</p>
        <p type="p">11:容置空間</p>
        <p type="p">20:新液槽</p>
        <p type="p">21:第一管道</p>
        <p type="p">22:第一閥門</p>
        <p type="p">23:出氣管</p>
        <p type="p">24:油霧過濾器</p>
        <p type="p">30:廢液槽</p>
        <p type="p">31:第二管道</p>
        <p type="p">32:第二閥門</p>
        <p type="p">40:熱交換系統</p>
        <p type="p">41:冷卻水塔</p>
        <p type="p">42:水泵</p>
        <p type="p">43:冷卻水迴路</p>
        <p type="p">44:熱交換器</p>
        <p type="p">50:回收管</p>
        <p type="p">50A:第一管段</p>
        <p type="p">50B:第二管段</p>
        <p type="p">51:回收閥</p>
        <p type="p">60:排氣管</p>
        <p type="p">60A:前管段</p>
        <p type="p">60B:後管段</p>
        <p type="p">61:排氣出口</p>
        <p type="p">62:排氣閥</p>
        <p type="p">70:循環管</p>
        <p type="p">71:循環泵</p>
        <p type="p">80:加熱單元</p>
        <p type="p">81:熱油槽</p>
        <p type="p">82:熱油管</p>
        <p type="p">83:油泵</p>
        <p type="p">90:液位器</p>
        <p type="p">A:進氣管</p>
        <p type="p">A1:進氣閥</p>
        <p type="p">B:共通管段</p>
        <p type="p">P:真空泵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="131" publication-number="202618896">
    <tif-files tif-type="multi-tif">
      <tif file="113139499.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H01L21/28</main-classification>
        <further-classification edition="200601120250102B">H01L21/71</further-classification>
        <further-classification edition="202501120250102B">H10D64/20</further-classification>
        <further-classification edition="202501120250102B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鳳筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, FENG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫家禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHIA-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先提供一基底包含一平面元件區以及一非平面元件區，然後形成複數個鰭狀結構於非平面元件區，形成第一淺溝隔離環繞平面元件區之基底，形成第二淺溝隔離環繞該等鰭狀結構，形成複數個第一閘極結構於平面元件區之基底上，形成複數個第二閘極結構於該等鰭狀結構上，形成第一電阻於第一淺溝隔離上，再形成第二電阻於第二淺溝隔離上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for fabricating a semiconductor device includes the steps of first providing a substrate having a planar region and a non-planar region, forming fin-shaped structures on the non-planar region, forming a first shallow trench isolation (STI) around the substrate on the planar region, forming a second shallow trench isolation (STI) around the fin-shaped structures, forming first gate structures on the substrate of the planar region, forming second gate structures on the fin-shaped structures, forming a first resistor on the first STI, and forming a second resistor on the second STI.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基底</p>
        <p type="p">14:平面元件區</p>
        <p type="p">16:非平面元件區</p>
        <p type="p">22:淺溝隔離</p>
        <p type="p">24:淺溝隔離</p>
        <p type="p">32:閘極結構</p>
        <p type="p">34:閘極結構</p>
        <p type="p">56:電阻</p>
        <p type="p">58:電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="132" publication-number="202618616">
    <tif-files tif-type="multi-tif">
      <tif file="113139507.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多輪檢索增強生成之檢索資料系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR SEARCHING DATA USING MULTI-TURN RAG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06N5/02</main-classification>
        <further-classification edition="202501120250203B">G06F16/332</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南山人壽保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN SHAN LIFE INSURANCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡其杭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHI-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游程盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳乃詩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NAI-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫悉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHI-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種多輪檢索增強生成之檢索資料系統。該系統包含一伺服器及一知識資料庫。該伺服器係建構為：根據一第一提示檢索該知識資料庫提取一包含複數個第一相關知識片段之第一搜尋結果；追溯該複數個相關知識片段所屬之複數個知識檔案，其中該複數個知識檔案儲存於該知識資料庫中；找回及加入該複數個知識檔案於該第一搜尋結果中複數個被濾除的其他相關知識片段分別至對應該複數個第一相關知識片段中，以產生分別對應於該複數個知識檔案之複數個完整相關知識片段；分別加入該複數個完整相關知識片段至該第一提示以產生複數個第二提示；分別輸入該複數個第二提示至大型語言模型以輸出一生成相關知識集。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for searching data using multi-turn RAG (Retrieval Augmented Generation; RAG) is provided. The system comprises a server and a knowledge database. The sever is configured to: extract a first searching result comprising a plurality of first related knowledge segments from by searching the knowledge database according to a first prompt; tracing back to knowledge files of which the plurality of first related knowledge segments are parts, wherein the knowledge files are stored in the knowledge database; regaining and adding other related knowledge segments filtered during conducting the first searching result respectively into the corresponding plurality of first related knowledge segments to correspondingly generate entire related knowledge segments for the knowledge files; respectively adding the entire related knowledge segments into the first prompt to have a plurality of second prompts; and respectively inputting the plurality of second prompts into an LLM (Large Language Model, LLM) to output a generated related knowledge set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31:知識資料庫</p>
        <p type="p">32:第一搜尋結果</p>
        <p type="p">33:第二提示集</p>
        <p type="p">34:生成相關知識集</p>
        <p type="p">35:第三提示</p>
        <p type="p">36:第二搜尋結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="133" publication-number="202618763">
    <tif-files tif-type="multi-tif">
      <tif file="113139509.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>病理性嗓音嚴重程度預測系統</chinese-title>
        <english-title>SYSTEM FOR PREDICTION OF PATHOLOGICAL VOICE SEVERITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250203B">G10L25/66</main-classification>
        <further-classification edition="200601120250203B">A61B5/00</further-classification>
        <further-classification edition="201301120250203B">G10L25/30</further-classification>
        <further-classification edition="201801120250203B">G16H50/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚醫療財團法人嘉義長庚紀念醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG MEMORIAL HOSPITAL, CHIAYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭富仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAW, FU-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁勝富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, SHENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳盈震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YING-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種病理性嗓音嚴重程度預測系統包含一語音資料收集裝置、一初步篩選裝置、一基準真相產生裝置、一儲存裝置與一人工智慧型預測裝置。語音資料收集裝置用以收集複數個原始採樣語音資料。初步篩選裝置用以將原始採樣語音資料分配成複數個初步預測語音資料、複數個學習用語音資料與複數個待預測語音資料。基準真相產生裝置用以產生複數個基準真相。人工智慧型預測裝置係在一學習階段利用學習用語音資料之基準真相與複數個學習用特徵參數產生出一預測模型，並在一預測階段利用預測模型與複數個待預測特徵參數預測出每一待預測語音資料之一預測嚴重程度指標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for Prediction of Pathological Voice Severity includes a voice data collection device, a preliminary screening device, a ground truth generation device, a storage device, and an artificial intelligence prediction device. The voice data collection device is utilized to collect multiple raw sample voice data. The preliminary screening device is utilized to allocate the raw sample voice data into multiple preliminary prediction voice data, multiple learning voice data, and multiple predicted voice data. The ground truth generation device is used to generate multiple ground truths. In a learning phase, the artificial intelligence prediction device generates a prediction model by using the ground truths of the learning voice data and multiple learning feature parameters; and in a prediction phase, the artificial intelligence prediction device further predicts an abnormality severity indicator for each predicted voice data according to the prediction model and multiple prediction feature parameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:預測系統</p>
        <p type="p">1:語音資料收集裝置</p>
        <p type="p">2:初步篩選裝置</p>
        <p type="p">21:初篩特徵擷取模組</p>
        <p type="p">22:初篩模組</p>
        <p type="p">23:初判模組</p>
        <p type="p">3:基準真相產生裝置</p>
        <p type="p">4:儲存裝置</p>
        <p type="p">5:人工智慧型預測裝置</p>
        <p type="p">51:特徵擷取模組</p>
        <p type="p">52:監督式學習模組</p>
        <p type="p">53:預測模組</p>
        <p type="p">6:顯示裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="134" publication-number="202619303">
    <tif-files tif-type="multi-tif">
      <tif file="113139518.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139518</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可適性等化器電路及其操作方法</chinese-title>
        <english-title>ADAPTIVE EQUALIZER CIRCUIT AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H04B3/04</main-classification>
        <further-classification edition="200601120250107B">H04B1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祥碩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMEDIA TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何杰睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIEH-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林有銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可適性等化器電路及其操作方法。所述可適性等化器電路包括放大器電路以及可適性電路。放大器電路耦接可適性電路。放大器電路接收輸入訊號。放大器電路基於輸入訊號提供補償訊號至可適性電路。可適性電路基於補償訊號提供補償設定值以及回授訊號至放大器電路。放大器電路的低頻響應與高頻增益分別基於回授訊號與補償設定值被調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adaptive equalizer circuit and operation method thereof are provided. The adaptive equalizer circuit includes an amplifier circuit and an adaptive circuit. The amplifier circuit is coupled to the adaptive circuit. The amplifier circuit receives an input signal. The amplifier circuit provides a compensation signal to the adaptive circuit based on the input signal. The adaptive circuit provides a compensation setting value and a feedback signal to the amplifier circuit based on the compensation signal. A low-frequency response and a high-frequency gain of the amplifier circuit are adjusted based on the compensation setting value and the feedback signal respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:可適性等化器電路</p>
        <p type="p">210:放大器電路</p>
        <p type="p">220:可適性電路</p>
        <p type="p">B1:緩衝器</p>
        <p type="p">C1、C4:電容</p>
        <p type="p">CMP:比較器</p>
        <p type="p">CT:計數器</p>
        <p type="p">Ein:輸入端</p>
        <p type="p">Eout:輸出端</p>
        <p type="p">EQ1、EQ2、EQ3、EQ4、EQ5:放大器</p>
        <p type="p">HF:高通濾波器</p>
        <p type="p">LF:低通濾波器</p>
        <p type="p">R:比較結果</p>
        <p type="p">R1、R4:電阻</p>
        <p type="p">RF1、RF2:整流器</p>
        <p type="p">S0、S1、Sc、Sf、Sh、Shi、Sin、Sl、Sli、Sout:訊號</p>
        <p type="p">Vc:補償設定值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="135" publication-number="202617008">
    <tif-files tif-type="multi-tif">
      <tif file="113139521.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙塔結構及其拼接方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241023B">A47G33/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桐萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桐萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種紙塔結構，其包含有複數個紙圈層以及至少一結構柱。複數個紙圈層相互堆疊成塔狀外形，每一個紙圈層具有複數個互向緊靠之紙捲本體及一圍繞紙圈層之緊固件，於複數個紙捲本體之間形成有複數個縫隙。結構柱穿設於複數個紙圈層之複數個縫隙中，並被複數個紙捲本體互相迫緊固定。藉此，本發明紙塔結構透過結構柱去連接每個紙圈層，讓人員可以快速組裝且方便搬運。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:紙塔結構</p>
        <p type="p">20:紙圈層</p>
        <p type="p">21:紙捲本體</p>
        <p type="p">22:緊固件</p>
        <p type="p">30:結構柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="136" publication-number="202619046">
    <tif-files tif-type="multi-tif">
      <tif file="113139525.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241127B">H01L23/06</main-classification>
        <further-classification edition="200601120241127B">H05K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米豊米科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MLMTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板結構，包括玻璃基板、多個導電通孔、第一導電層、第一絕緣層、第二導電層、和多個被動元件。玻璃基板包括至少一硬板。導電通孔設置於硬板中。第一導電層設置於玻璃基板頂面上，且包括第一導電線路和第一導電圖案，其中第一導電線路的電連接導電通孔，並且第一導電圖案電連接第一導電線路。第一絕緣層設置於玻璃基板頂面上且覆蓋第一導電層。第二導電層設置於第一絕緣層上且包括多個第二導電圖案。被動元件設置在玻璃基板內或玻璃基板的頂面上，包括第一導電圖案和第二導電圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure includes a glass substrate, multiple conductive vias, a first conductive layer, a first insulating layer, a second conductive layer, and multiple passive devices. The glass substrate includes at least one rigid board. Multiple conductive vias are disposed within the rigid board. The first conductive layer is disposed above the top surface of the glass substrate and includes multiple first conductive traces and multiple first conductive patterns. At least one of the first conductive traces is electrically connected to at least one of the conductive vias, and at least one of the first conductive patterns is electrically connected to at least one of the first conductive traces. The first insulating layer is disposed above the top surface of the glass substrate, and covers the first conductive layer. The second conductive layer is disposed above the first insulating layer and includes multiple second conductive patterns. The passive devices are disposed within the glass substrate or above its top surface, and include the first conductive patterns and the second conductive patterns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電路板結構</p>
        <p type="p">110:玻璃基板</p>
        <p type="p">112:頂面</p>
        <p type="p">114:底面</p>
        <p type="p">116、316、326:導電通孔</p>
        <p type="p">120:第一硬板</p>
        <p type="p">140:第一可彎板</p>
        <p type="p">146:蝕刻部</p>
        <p type="p">160:第二硬板</p>
        <p type="p">210:第一導電層</p>
        <p type="p">212:第一導電線路</p>
        <p type="p">214:第一導電圖案</p>
        <p type="p">220:第二導電層</p>
        <p type="p">222:第二導電線路</p>
        <p type="p">224:第二導電圖案</p>
        <p type="p">230:第三導電層</p>
        <p type="p">232:第三導電線路</p>
        <p type="p">234:第三導電圖案</p>
        <p type="p">240:第四導電層</p>
        <p type="p">242:第四導電線路</p>
        <p type="p">244:第四導電圖案</p>
        <p type="p">310:第一絕緣層</p>
        <p type="p">320:第二絕緣層</p>
        <p type="p">500:電子元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="137" publication-number="202618950">
    <tif-files tif-type="multi-tif">
      <tif file="113139532.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139532</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路元件檢查方法、積體電路元件檢查裝置及積體電路元件製造設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H01L21/66</main-classification>
        <further-classification edition="200601120241104B">H01L21/677</further-classification>
        <further-classification edition="200601120241104B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬潤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL RING TECH CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江孟桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, MENG-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關一種積體電路元件檢查方法、積體電路元件檢查裝置及積體電路元件製造設備，該積體電路元件檢查方法會使積體電路元件製造設備以載盤載置積體電路元件，並於對該積體電路元件執行壓合製程後，對該積體電路元件執行檢查製程。於檢查製程，會使該積體電路元件製造設備將載盤輸送至檢查區，並以位於檢查區上方與下方的第一取像機構與第二取像機構分別對該積體電路元件的上蓋與基板進行取像。藉此在壓合製程後能夠對該積體電路元件進行上蓋與基板的取像檢查，可即時發現該積體電路元件壓合後的瑕疵以進行高品質的製造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:積體電路元件製造設備</p>
        <p type="p">3:積體電路元件壓合裝置</p>
        <p type="p">30:傳送流道</p>
        <p type="p">4:積體電路元件檢查裝置</p>
        <p type="p">41:機台</p>
        <p type="p">410:移動區間</p>
        <p type="p">42:承載單元</p>
        <p type="p">43:承載本體</p>
        <p type="p">431:貫通區間</p>
        <p type="p">44:擋止組件</p>
        <p type="p">45:第一取像單元</p>
        <p type="p">451:第一移動機構</p>
        <p type="p">452:第一取像機構</p>
        <p type="p">46:第二取像單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="138" publication-number="202619465">
    <tif-files tif-type="multi-tif">
      <tif file="113139533.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>傳送裝置、傳送方法及作業設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K13/04</main-classification>
        <further-classification edition="200601120241204B">H05K13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬潤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL RING TECH CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種傳送裝置、傳送方法及作業設備。該作業設備在作業裝置的一側設有該傳送裝置。該傳送裝置設有機台，及設於機台的置放單元與傳送單元。該置放單元可供料盒置放。該傳送單元之傳送座可被驅動而相對機台在第一狀態與第二狀態之間旋轉。當該傳送座位在第一狀態時，會以其一端對應該料盒的盒口，而可用以和料盒進行料件的輸送。當該傳送座位在第二狀態時，會以其另一端對應該作業裝置的作業流道，而可用以和作業流道進行料件的輸送。透過該傳送座可在第一狀態和第二狀態之間旋轉變化的結構設計，有利於產線的空間配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:作業設備</p>
        <p type="p">200:傳送裝置</p>
        <p type="p">3:機台</p>
        <p type="p">4:置放單元</p>
        <p type="p">40:空間</p>
        <p type="p">41:第一置放機構</p>
        <p type="p">42:第二置放機構</p>
        <p type="p">5:傳送單元</p>
        <p type="p">51:傳送軌道</p>
        <p type="p">52:軌座</p>
        <p type="p">54:傳送座</p>
        <p type="p">6:檢查單元</p>
        <p type="p">61:移動機構</p>
        <p type="p">62:檢查機構</p>
        <p type="p">7:作業裝置</p>
        <p type="p">70:作業流道</p>
        <p type="p">71:作業機構</p>
        <p type="p">81:料盒</p>
        <p type="p">82:料件</p>
        <p type="p">901:第一方向</p>
        <p type="p">902:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="139" publication-number="202619175">
    <tif-files tif-type="multi-tif">
      <tif file="113139536.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源連接器</chinese-title>
        <english-title>POWER CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241126B">H01R13/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源連接器，包括絕緣本體、兩電源端子及兩加固板，所述絕緣本體設有向前貫穿的對接槽，兩所述電源端子分別位於所述對接槽的兩側；每一所述電源端子包括基板部及自所述基板部向前延伸的複數彈性臂，所述彈性臂具有突伸入所述對接槽的弧形接觸部，所述基板部固定於所述絕緣本體而將所述電源端子固定，其中，所述基板部設有與所述接觸部位於同側的內表面及相對的外表面，所述加固板固定於所述基板部的內表面與絕緣本體之間，所述基板部沖壓出至少一抵持片，所述抵持片向後傾斜延伸而抵持於所述絕緣本體。本發明之加固板，更有效的將電源端子固定於絕緣本體內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power connector includes an insulating housing, two power terminals in the housing and two retaining boards. The insulating housing defines a mating slot opening forwards and the power terminals are located at opposite sides of the mating slot. Each power terminal includes a base portion retained in the housing and plural elastic arms with arc contacting portions extending to the mating slot. The retaining board is attached at an inner side of the base portion, and has slant tabs extending rearwards. The slanting tabs are buckled at the insulating housing to avoid the power terminals from rearward movement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電源端子</p>
        <p type="p">23:內端子片</p>
        <p type="p">231:內接觸部</p>
        <p type="p">24:外端子片</p>
        <p type="p">241:外接觸部</p>
        <p type="p">40:加固板</p>
        <p type="p">41:抵持片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="140" publication-number="202618337">
    <tif-files tif-type="multi-tif">
      <tif file="113139543.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超穎透鏡</chinese-title>
        <english-title>METALENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">G02B3/02</main-classification>
        <further-classification edition="200601120241223B">G02B3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科穎達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAROSETTA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王智明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許維綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宸逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種超穎透鏡，包括基板、多個第一穿透率調整結構以及多個第二穿透率調整結構。基板具有第一區塊與第二區塊，第二區塊圍繞第一區塊。多個第一穿透率調整結構設置於第一區塊，多個第二穿透率調整結構設置於第二區塊。第一區塊與多個第一穿透率調整結構形成超穎透鏡的第一穿透部，第二區塊與多個第二穿透率調整結構形成超穎透鏡的第二穿透部，第一穿透部的穿透率小於第二穿透部的穿透率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metalens including a substrate, multiple first transmittance adjustment structures and multiple second transmittance adjustment structures is provided. The substrate has a first block and a second block, and the second block surrounds the first block. The first transmittance adjustment structures are disposed in the first block, and the second transmittance adjustment structures are disposed in the second block. The first block and the first transmittance adjustment structures form a first transmittance portion of the metalens, and the second block and the second transmittance adjustment structures form a second transmittance portion of the metalens. The transmittance of the first transmittance portion is smaller than the transmittance of the second transmittance portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:超穎透鏡</p>
        <p type="p">101:基板</p>
        <p type="p">A1:第一區塊</p>
        <p type="p">A2:第二區塊</p>
        <p type="p">B:方框</p>
        <p type="p">C:中心</p>
        <p type="p">T1:第一穿透部</p>
        <p type="p">T2:第二穿透部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="141" publication-number="202617480">
    <tif-files tif-type="multi-tif">
      <tif file="113139544.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於用戶資訊之車輛速度控制方法及系統</chinese-title>
        <english-title>VEHICLE SPEED CONTROL METHODS AND SYSTEMS BASED ON USER INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B60W10/04</main-classification>
        <further-classification edition="201201120241204B">B60W50/12</further-classification>
        <further-classification edition="200601120241204B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯志達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, ZHI-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯一安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於用戶資訊之車輛速度控制方法及系統。首先，利用一電子裝置接收相應一用戶之一用戶資訊。接著，對於用戶資訊執行一驗證作業，以取得一驗證結果，並依據驗證結果決定相應一電動車輛之一特定車輛速度。其中，相應電動車輛騎乘時之一車輛速度被設定不高於此特定車輛速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Vehicle speed control methods and systems are provided. First, an electronic device is used to receive user information corresponding to a user. Then, a validation operation is performed on the user information to obtain a validation result, and a specific vehicle speed corresponding to an electric vehicle is determined based on the validation result, wherein a vehicle speed when riding the electric vehicle is set not to be higher than the specific vehicle speed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310、S320、S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="142" publication-number="202619251">
    <tif-files tif-type="multi-tif">
      <tif file="113139547.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙向全橋-半橋混合式CLLC諧振轉換器</chinese-title>
        <english-title>HYBRID BIDIRECTIONAL FULL-BRIDGE HALF-BRIDGE CLLC RESONANT CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H02M3/156</main-classification>
        <further-classification edition="200601120250122B">H02M7/217</further-classification>
        <further-classification edition="200601120250122B">H02M1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　清日中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, THANH NHAT TRUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種雙向全橋-半橋混合式CLLC諧振轉換器，其包含高壓側橋式整流組、直流電網埠端、低壓側橋式整流組、儲釋能埠端、變壓器、雙向開關模組、電感模組以及電容模組。高壓側橋式整流組及第一雙向開關連接於直流電網埠端，低壓側橋式整流組及第二雙向開關連接於儲釋能埠端。當負載為輕載至中載時，雙向開關模組開啟且部分功率開關關閉以形成半橋式配置，當負載為中載至重載時，雙向開關模組關閉以形成全橋式配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hybrid bidirectional full-bridge half-bridge CLLC resonant converter is disclosed. The hybrid bidirectional full-bridge half-bridge CLLC resonant converter includes a high-voltage side bridge rectifier set, a DC power grid port, a low-voltage side bridge rectifier set, an energy storage and release port, a transformer, a bidirectional switch module, an inductor module and a capacitor module. The high-voltage side bridge rectifier set and the first bidirectional switch are connected to the DC power grid port, and the low-voltage side bridge rectifier set and the second bidirectional switch are connected to the energy storage and release port. When the load is from light to medium load, the bidirectional switch module is turned on and some power switches are turned off to form a half-bridge configuration. When the load is from medium to heavy load, the bidirectional switch module is turned off to form a full-bridge configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:雙向全橋-半橋混合式CLLC諧振轉換器</p>
        <p type="p">11:高壓側橋式整流組</p>
        <p type="p">12:低壓側橋式整流組</p>
        <p type="p">13:變壓器</p>
        <p type="p">13A:第一線圈</p>
        <p type="p">13B:第二線圈</p>
        <p type="p">BF:雙向開關模組</p>
        <p type="p">BF&lt;sub&gt;1&lt;/sub&gt;:第一雙向開關</p>
        <p type="p">BF&lt;sub&gt;2&lt;/sub&gt;:第二雙向開關</p>
        <p type="p">C:電容模組</p>
        <p type="p">C&lt;sub&gt;Bat&lt;/sub&gt;:低壓側輸出電容</p>
        <p type="p">C&lt;sub&gt;DC&lt;/sub&gt;:高壓側輸出電容</p>
        <p type="p">C&lt;sub&gt;oss1&lt;/sub&gt;:第一寄生電容</p>
        <p type="p">C&lt;sub&gt;oss2&lt;/sub&gt;:第二寄生電容</p>
        <p type="p">C&lt;sub&gt;oss3&lt;/sub&gt;:第三寄生電容</p>
        <p type="p">C&lt;sub&gt;oss4&lt;/sub&gt;:第四寄生電容</p>
        <p type="p">C&lt;sub&gt;oss5&lt;/sub&gt;:第五寄生電容</p>
        <p type="p">C&lt;sub&gt;oss6&lt;/sub&gt;:第六寄生電容</p>
        <p type="p">C&lt;sub&gt;oss7&lt;/sub&gt;:第七寄生電容</p>
        <p type="p">C&lt;sub&gt;oss8&lt;/sub&gt;:第八寄生電容</p>
        <p type="p">C&lt;sub&gt;oss9&lt;/sub&gt;:第九寄生電容</p>
        <p type="p">C&lt;sub&gt;oss10&lt;/sub&gt;:第十寄生電容</p>
        <p type="p">C&lt;sub&gt;oss11&lt;/sub&gt;:第十一寄生電容</p>
        <p type="p">C&lt;sub&gt;oss12&lt;/sub&gt;:第十二寄生電容</p>
        <p type="p">C&lt;sub&gt;r1&lt;/sub&gt;:第一電容</p>
        <p type="p">C&lt;sub&gt;r2&lt;/sub&gt;:第二電容</p>
        <p type="p">C&lt;sub&gt;r11&lt;/sub&gt;:第三電容</p>
        <p type="p">C&lt;sub&gt;r12&lt;/sub&gt;:第四電容</p>
        <p type="p">C&lt;sub&gt;r21&lt;/sub&gt;:第五電容</p>
        <p type="p">C&lt;sub&gt;r22&lt;/sub&gt;:第六電容</p>
        <p type="p">D&lt;sub&gt;B1&lt;/sub&gt;:第一本質二極體</p>
        <p type="p">D&lt;sub&gt;B2&lt;/sub&gt;:第二本質二極體</p>
        <p type="p">D&lt;sub&gt;B3&lt;/sub&gt;:第三本質二極體</p>
        <p type="p">D&lt;sub&gt;B4&lt;/sub&gt;:第四本質二極體</p>
        <p type="p">D&lt;sub&gt;B5&lt;/sub&gt;:第五本質二極體</p>
        <p type="p">D&lt;sub&gt;B6&lt;/sub&gt;:第六本質二極體</p>
        <p type="p">D&lt;sub&gt;B7&lt;/sub&gt;:第七本質二極體</p>
        <p type="p">D&lt;sub&gt;B8&lt;/sub&gt;:第八本質二極體</p>
        <p type="p">D&lt;sub&gt;B9&lt;/sub&gt;:第九本質二極體</p>
        <p type="p">D&lt;sub&gt;B10&lt;/sub&gt;:第十本質二極體</p>
        <p type="p">D&lt;sub&gt;B11&lt;/sub&gt;:第十一本質二極體</p>
        <p type="p">D&lt;sub&gt;B12&lt;/sub&gt;:第十二本質二極體</p>
        <p type="p">i&lt;sub&gt;Lm&lt;/sub&gt;:激磁電感電流</p>
        <p type="p">i&lt;sub&gt;Lr1&lt;/sub&gt;:第一電感電流</p>
        <p type="p">i&lt;sub&gt;Lr2&lt;/sub&gt;:第二電感電流</p>
        <p type="p">L:電感模組</p>
        <p type="p">L&lt;sub&gt;r1&lt;/sub&gt;:第一電感</p>
        <p type="p">L&lt;sub&gt;r2&lt;/sub&gt;:第二電感</p>
        <p type="p">L&lt;sub&gt;m&lt;/sub&gt;:激磁電感</p>
        <p type="p">n1:第一節點</p>
        <p type="p">n2:第二節點</p>
        <p type="p">n3:第三節點</p>
        <p type="p">n4:第四節點</p>
        <p type="p">n5:第五節點</p>
        <p type="p">n6:第六節點</p>
        <p type="p">n7:第七節點</p>
        <p type="p">n8:第八節點</p>
        <p type="p">n9:第九節點</p>
        <p type="p">n10:第十節點</p>
        <p type="p">Q&lt;sub&gt;1&lt;/sub&gt;:第一功率開關</p>
        <p type="p">Q&lt;sub&gt;2&lt;/sub&gt;:第二功率開關</p>
        <p type="p">Q&lt;sub&gt;3&lt;/sub&gt;:第三功率開關</p>
        <p type="p">Q&lt;sub&gt;4&lt;/sub&gt;:第四功率開關</p>
        <p type="p">Q&lt;sub&gt;5&lt;/sub&gt;:第五功率開關</p>
        <p type="p">Q&lt;sub&gt;6&lt;/sub&gt;:第六功率開關</p>
        <p type="p">Q&lt;sub&gt;7&lt;/sub&gt;:第七功率開關</p>
        <p type="p">Q&lt;sub&gt;8&lt;/sub&gt;:第八功率開關</p>
        <p type="p">Q&lt;sub&gt;9&lt;/sub&gt;:第九開關</p>
        <p type="p">Q&lt;sub&gt;10&lt;/sub&gt;:第十開關</p>
        <p type="p">Q&lt;sub&gt;11&lt;/sub&gt;:第十一開關</p>
        <p type="p">Q&lt;sub&gt;12&lt;/sub&gt;:第十二開關</p>
        <p type="p">V&lt;sub&gt;Battery&lt;/sub&gt;:儲釋能埠端</p>
        <p type="p">V&lt;sub&gt;DC_Grid&lt;/sub&gt;:直流電網埠端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="143" publication-number="202617103">
    <tif-files tif-type="multi-tif">
      <tif file="113139553.zip" no="1">
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      <volno>24</volno>
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        <document-id>
          <doc-number>202617103</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動手套穿戴機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241031B">A61B42/00</main-classification>
        <further-classification edition="201601120241031B">A61B42/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚學校財團法人長庚科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓晶彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉杏元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許定洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, DING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋沛璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, PEI-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張唯芯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIAO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳書緹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHU-TI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭皓紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動手套穿戴機具有第一、二框架、門板、限位塊、夾片、伸縮件與設於頂壁上的感應器。第一框架的前壁設有前開口，且其底壁、前壁、後壁、頂壁與第一壁定義出連通前開口的空間及側開口，後壁於近頂壁處朝下延伸有供設置伸縮件的滑軌。第二框架具位在底壁上的基壁、封閉側開口的第二壁及間隔地自基壁朝上延伸的桿件。桿件具朝上依序設置且截頭朝下的截頭錐狀段。限位塊設在第一壁。門板具面向第一壁並設有滑槽的側牆及連接的側牆的前牆。限位塊於滑槽內使門板能封閉或暴露前開口。夾片具限位在截頭錐狀段的固定側及朝後壁延伸的夾設側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:第一框架</p>
        <p type="p">20:空間</p>
        <p type="p">220:前開口</p>
        <p type="p">230:滑軌</p>
        <p type="p">3:第二框架</p>
        <p type="p">34:桿件</p>
        <p type="p">4:門板單元</p>
        <p type="p">41:門板</p>
        <p type="p">5:夾片</p>
        <p type="p">6:伸縮件</p>
        <p type="p">7:感應器</p>
        <p type="p">9:醫用無菌手套</p>
        <p type="p">90:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="144" publication-number="202619059">
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          <doc-number>202619059</doc-number>
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      </publication-reference>
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        <document-id>
          <doc-number>113139554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其製法與電子封裝模組</chinese-title>
        <english-title>ELECTRONIC PACKAGE, ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">H01L23/28</main-classification>
        <further-classification edition="200601120241216B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉帥麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHUAI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王愉博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件，包括：第一線路結構，具有第一表面、第二表面及第一線路層；電子元件組，含有第一電子元件及第二電子元件，第一電子元件以其第一非作用面接置於第一表面，第二電子元件以其第二非作用面偏置於第一作用面；封裝層，係包覆電子元件組；第二線路結構，設於第一封裝面並分別與第一線路層、第一作用面及第二作用面電性連接；以及光電元件，係設於第二線路結構上。藉由本發明之實施，可大幅縮小作為光學引擎之電子封裝件的面積，以增加共同封裝光學電子模組中容納之光學引擎數，進而提昇該電子模組的資訊傳輸量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package including a first circuit structure having opposite first and second surfaces and a first circuit layer; an electronic component set including a first electronic component and a second electronic component, wherein the first electronic component is disposed on the first surface through its first inactive surface, the second electronic component is disposed on part of the first active surface through its second inactive surface; an encapsulating layer encapsulating the electronic component set; By the implementation of the present invention, the overall height of the electronic package can be reduced and its heat dissipation efficiency can also be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載結構</p>
        <p type="p">1a:承載面</p>
        <p type="p">2’:電子封裝件</p>
        <p type="p">20:第一線路結構</p>
        <p type="p">21:第一線路層</p>
        <p type="p">22:貫通導電件</p>
        <p type="p">23:導電連接件</p>
        <p type="p">31:第一電子元件</p>
        <p type="p">31c:第一導電件</p>
        <p type="p">32:第二電子元件</p>
        <p type="p">32c:第二導電件</p>
        <p type="p">33:第三電子元件</p>
        <p type="p">33c:第三導電件</p>
        <p type="p">40:封裝層</p>
        <p type="p">50:第二線路結構</p>
        <p type="p">51:第二線路層</p>
        <p type="p">60:光電元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="145" publication-number="202617307">
    <tif-files tif-type="multi-tif">
      <tif file="113139555.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>烙鐵頭的拆卸工具</chinese-title>
        <english-title>DISASSEMBLY TOOL FOR SOLDERING IRON TIPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">B23K3/02</main-classification>
        <further-classification edition="200601120250214B">B23K3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>固浩企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOODHOUSE ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡榮發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JUNG-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種烙鐵頭的拆卸工具， 具有一本體，該本體具有一握持部及一第一連接部形成於該握持部的一端，其中該第一連接部的直徑小於該握持部的直徑，使該第一連接部能套接在烙鐵頭上，而該握持部便於使用者抓握並進行旋轉操作；操作時，該第一工具頭套接於一烙鐵工具的烙鐵頭後，由使用者握住握持部旋轉該本體，即可輕鬆拆卸高溫的烙鐵頭，改善因使用鉗子而過度施力造成烙鐵頭損壞的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A disassembly tool for soldering iron tips comprises a main body, which includes a gripping portion and a first connecting portion formed at one end of the gripping portion. The diameter of the first connecting portion is smaller than that of the gripping portion, allowing it to fit onto the soldering iron tip. The gripping portion is designed for easy handling and enables the user to rotate the tool with ease. During operation, the first tool head is connected to the soldering iron tip, and the user grips the gripping portion to rotate the main body, enabling the easy removal of the high-temperature soldering tip. This tool improves the disassembly process by preventing damage to the soldering tip, which can occur due to excessive force when using pliers. It ensures safer and more efficient removal of soldering tips, particularly in high-temperature environments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:握持部</p>
        <p type="p">15:第一連接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="146" publication-number="202617294">
    <tif-files tif-type="multi-tif">
      <tif file="113139560.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用廢氣循環之高效燃燒的回收再利用系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241104B">B09B3/40</main-classification>
        <further-classification edition="200601120241104B">C10J3/00</further-classification>
        <further-classification edition="201701120241104B">C01B32/05</further-classification>
        <further-classification edition="200601120241104B">F23G5/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土星永續股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴佳郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用廢氣循環之高效燃燒的回收再利用系統，包括碳化裝置、第一收集管路、第一偵測控制單元、導風裝置、加熱單元及淨化裝置，碳化裝置內有一待燃燒之生物質產生一生質燃氣，第一偵測控制單元偵測生質燃氣之一可燃氣體含量比例並控制其流動方向，導風裝置用以將可燃氣體傳送至該碳化裝置內，加熱單元之一含氧及壓力感測模組控制導入的可燃氣體比例並將其再次燃燒及利用，剩餘之不可燃氣體進入該淨化裝置進行淨化程序，其中，該第一出氣口之口徑大於該第一收集管路之一第一進氣口之口徑，以使生質燃氣形成流體的連續方程式及白努利定律。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:碳化系統</p>
        <p type="p">10:碳化裝置</p>
        <p type="p">100:第一出氣口</p>
        <p type="p">1001:第一口徑</p>
        <p type="p">11:第一收集管路</p>
        <p type="p">110:第一進氣口</p>
        <p type="p">1101:第二口徑</p>
        <p type="p">12:第一偵測控制單元</p>
        <p type="p">14:加熱單元</p>
        <p type="p">140:含氧及壓力感測模組</p>
        <p type="p">17:淨化裝置</p>
        <p type="p">19:導風裝置</p>
        <p type="p">3:生質燃氣</p>
        <p type="p">4:可燃氣體</p>
        <p type="p">40:不可燃氣體</p>
        <p type="p">5:生物質</p>
        <p type="p">6:生物碳</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="147" publication-number="202617009">
    <tif-files tif-type="multi-tif">
      <tif file="113139566.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燈柱及其電線內藏的廟簷飾座</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">A47G33/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文玄企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張煥鄉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種燈柱及其電線內藏的廟簷飾座，該電線內藏的廟簷飾座包含一支撐台、一廟簷單元，及一燈具單元。該支撐台適用於設置在該燈柱本體。該廟簷單元沿一頂底方向設置在該支撐台的頂側，且包括一第一屋簷，及多個飾板。該第一屋簷具有多個在一圓周方向上角度彼此錯開的坡面部。該等飾板分別能卸離地安裝在該等坡面部。每一該飾板與相對應的該坡面部配合界定出一容室。該燈具單元安裝在該廟簷單元。該燈具單元包括多個在該圓周方向上角度彼此錯開的吊筒燈具，及多條由該等吊筒燈具延伸出的電線。每一該電線穿入該第一屋簷的其中一該容室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:支撐台</p>
        <p type="p">210:管通道</p>
        <p type="p">211:基板</p>
        <p type="p">212:支撐柱</p>
        <p type="p">3:廟簷單元</p>
        <p type="p">301:第一屋簷</p>
        <p type="p">302:飾板</p>
        <p type="p">303:第二屋簷</p>
        <p type="p">304:內遮罩</p>
        <p type="p">31:坡面部</p>
        <p type="p">314:通孔</p>
        <p type="p">33:斜脊部</p>
        <p type="p">341:瓦飾結構</p>
        <p type="p">351:瓦飾部</p>
        <p type="p">352:屋脊部</p>
        <p type="p">41:頂燈</p>
        <p type="p">42:吊筒燈具</p>
        <p type="p">43:電線</p>
        <p type="p">Z:頂底方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="148" publication-number="202617010">
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      <tif file="113139567.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>祈福燈柱及其組裝盤</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">A47G33/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文玄企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張煥鄉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種祈福燈柱及其組裝盤，包含一轉動桿、數組裝盤、數祈福燈及數電路板。每一該組裝盤包括一盤本體、一內組裝單元及一外組裝單元。該盤本體具有一用來套接於該轉動桿的軸孔。藉由每一該組裝盤的該內組裝單元與該外組裝單元分別鄰近於該軸孔與周緣，在該等組裝盤上下疊置並以該等內組裝單元與該等外組裝單元組接時能提高結構強度。此外，在與其他元件組裝前，該等組裝盤能先分成數組且每一組的該等組裝盤互相組接，便於運輸至目的地進行後續組裝，還具有便於組裝的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:組裝盤</p>
        <p type="p">3:盤本體</p>
        <p type="p">31:內圍壁</p>
        <p type="p">313:加固壁部</p>
        <p type="p">314:定位孔</p>
        <p type="p">315:上抵接端</p>
        <p type="p">32:外圍壁</p>
        <p type="p">33:中間圍壁</p>
        <p type="p">34:連接壁</p>
        <p type="p">341:壁板部</p>
        <p type="p">342:加固柱部</p>
        <p type="p">343:定位凸部</p>
        <p type="p">35:限位壁</p>
        <p type="p">36:組接件組</p>
        <p type="p">361:扣接部</p>
        <p type="p">362:限位凸部</p>
        <p type="p">363:間隔槽</p>
        <p type="p">37:軸孔</p>
        <p type="p">4:內組裝單元</p>
        <p type="p">41:第一組裝件</p>
        <p type="p">5:外組裝單元</p>
        <p type="p">51:第三組裝件</p>
        <p type="p">6:祈福燈</p>
        <p type="p">61:燈座</p>
        <p type="p">611:勾部</p>
        <p type="p">7:電路板</p>
        <p type="p">71:穿孔</p>
        <p type="p">72:限位槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="149" publication-number="202617053">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139569</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用於內視鏡探測管之距離保持器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">A61B1/01</main-classification>
        <further-classification edition="200601120241030B">A61B1/012</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>醫電鼎眾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡欣昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用於內視鏡探測管之距離保持器，包含有：一中心套管，供一內視鏡之探測管穿過而套接且固定於該內視鏡之探測管，該中心套管具有一周面；以及一外圍件，可自由轉動地套設於該中心套管，且可在受外力作用時相對於該中心套管之該周面自由旋轉，該外圍件具有沿該內視鏡之探測管的徑向向外延伸預定距離而形成的至少一擴張部；其中，該至少一擴張部係用以抵接於外界之地面或待觀測物之表面，使該內視鏡之探測管與地面或待觀測物之表面之間保持預定距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:距離保持器</p>
        <p type="p">11:中心套管</p>
        <p type="p">12:周面</p>
        <p type="p">14:束環</p>
        <p type="p">21:外圍件</p>
        <p type="p">22:擴張部</p>
        <p type="p">24:軸承</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="150" publication-number="202617226">
    <tif-files tif-type="multi-tif">
      <tif file="113139575.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橢圓機構造</chinese-title>
        <english-title>ELLIPTICAL MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241229B">A63B22/04</main-classification>
        <further-classification edition="200601120241229B">A63B23/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>敦洋科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREAT FITNESS INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種橢圓機構造，包含固定單元，該固定單元有第一樞接部、第二樞接部及第三樞接部；二踏板單元，分別設置於該固定單元的相對二側，踏板單元樞接於第一樞接部；二連桿單元，分別設置於該固定單元的相對二側並連接該二踏板單元設置，連桿單元樞接於第二樞接部及第三樞接部；阻力單元，設置於固定單元並連接第三樞接部，二踏板單元分別經由對應的連桿單元而連接於阻力單元；驅動踏板單元，使位於固定單元二側的踏板件恰沿一封閉路徑移動；當二踏板件移動而沿水平方向位於封閉路徑之中心的相對側時，二踏板件的踏板面恰朝封閉路徑之中心的位置傾斜一角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:固定單元</p>
        <p type="p">2:踏板單元</p>
        <p type="p">3:連桿單元</p>
        <p type="p">4:阻力單元</p>
        <p type="p">5:第一樞接部</p>
        <p type="p">6:第二樞接部</p>
        <p type="p">7:第三樞接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="151" publication-number="202616943">
    <tif-files tif-type="multi-tif">
      <tif file="113139577.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139577</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬網室的組合構造</chinese-title>
        <english-title>COMBINATION STRUCTURE OF METALLIC NET HOUSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A01G9/14</main-classification>
        <further-classification edition="200601120241231B">A01G9/22</further-classification>
        <further-classification edition="200601120241231B">A01G13/10</further-classification>
        <further-classification edition="200601120241231B">A01M1/24</further-classification>
        <further-classification edition="200601120241231B">E06B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣泰金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUANG TAI METAL INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周鼎茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, TING MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳承恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林翊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林春成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種金屬網室的組合構造，包含一地基單元設有螺旋基樁及地基樑，該螺旋基樁沿著垂向旋入地面，該等地基樑的兩端分別沿著橫向或縱向固接於該螺旋基樁；一壁面單元包含有複數立柱、下金屬網板、中金屬網板及上金屬網板，分別沿著垂向由下往上的固定於二相鄰的立柱之間，該下金屬網板的網目大於該中金屬網板及該上金屬網板，該下金屬網板的線徑係大於該中金屬網板及該上金屬網板；至少一力霸橫樑可拆的固定於該壁面單元；一屋頂單元可拆的固定於該壁面單元頂端。可供快速拆裝回收再利用，並且適合任意移動搬遷金屬網室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:地基單元</p>
        <p type="p">11:螺旋基樁</p>
        <p type="p">2:壁面單元</p>
        <p type="p">21:立柱</p>
        <p type="p">22:下金屬網板</p>
        <p type="p">23:中金屬網板</p>
        <p type="p">24:上金屬網板</p>
        <p type="p">3:力霸橫樑</p>
        <p type="p">4:屋頂單元</p>
        <p type="p">41:上樑架</p>
        <p type="p">42:下屋頂板</p>
        <p type="p">43:透氣金屬網板</p>
        <p type="p">44:上屋頂板</p>
        <p type="p">X:橫向</p>
        <p type="p">Y:縱向</p>
        <p type="p">Z:垂向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="152" publication-number="202618832">
    <tif-files tif-type="multi-tif">
      <tif file="113139582.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非接觸式按鈕及按鈕</chinese-title>
        <english-title>CONTACTLESS BUTTON AND BUTTON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">H01H13/705</main-classification>
        <further-classification edition="200601120250109B">H01H13/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達運精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, YAN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種非接觸式按鈕，包括：基板、框體以及感測模組。框體設置在基板上，框體於遠離基板的一側具有開口。感測模組適於形成感測區域，感測模組具有覆蓋開口的感測部，感測部具有多個層體，層體包括：支撐板、膜片以及導電層。膜片完全覆蓋於支撐板遠離基板的一側。導電層位於膜片及支撐板之間並完全覆蓋該膜片，導電層電連接基板並適於形成感測區域。亦提供一種具有非接觸式開關的功能的按鈕。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A contactless button, includes a substrate, a frame and a sensing module. The frame is arranged on the substrate, and the frame has an opening on a side away from the substrate. The sensing module is adapted for forming a sensing area and has a sensing part covers the opening. The sensing part has multiple layers including a support plate, a sheet and a conductive layer. The support plate covers the opening. The sheet completely covers the side of the support plate away from the substrate. The conductive layer is located between the sheet and the support plate and completely covers the sheet. The conductive layer is electrically connected to the substrate and adapts for forming the sensing area. A button having a contactless switch function is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:按鈕</p>
        <p type="p">2:基板</p>
        <p type="p">21:發光單元</p>
        <p type="p">22:接口</p>
        <p type="p">3:框體</p>
        <p type="p">31:開口</p>
        <p type="p">301:缺口</p>
        <p type="p">4:接觸開關</p>
        <p type="p">5:感測模組</p>
        <p type="p">51:感測部</p>
        <p type="p">52:外凸緣</p>
        <p type="p">53:段差部</p>
        <p type="p">54:固定部</p>
        <p type="p">55:連接部</p>
        <p type="p">56:光學成像組件</p>
        <p type="p">6:中框</p>
        <p type="p">61:彈臂</p>
        <p type="p">D:方向</p>
        <p type="p">A-A:剖線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="153" publication-number="202618637">
    <tif-files tif-type="multi-tif">
      <tif file="113139585.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139585</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>AI影像辨識POS系統及其方法</chinese-title>
        <english-title>AN AI-BASED IMAGE RECOGNITION POS SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241025B">G06Q20/20</main-classification>
        <further-classification edition="201201120241025B">G06Q20/18</further-classification>
        <further-classification edition="202201120241025B">G06V10/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創駿興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRONJUN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張元郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁為閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, WEI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種AI影像辨識POS系統及其方法，包含：一商品資料庫、一異位相片集、一POS系統、一影像擷取模組、一穩態判斷模組及一AI影像辨識系統，其中，該商品資料庫包含數商品資訊及數商品圖片；該異位相片集包含數不同擺放方式的相片，各該不同擺放方式的相片各自對應各該商品資訊；該POS系統包含一即時影像顯示畫面、一主要商品顯示畫面及數候選商品顯示畫面；該影像擷取模組，可擷取一連續影像並顯示於該即時影像顯示畫面；該穩態判斷模組，依該連續影像判斷物品在一穩定狀態下以該影像擷取模組擷取一待辨識影像；由該AI影像辨識系統辨識該待辨識影像在該異位相片集中數高相似商品資訊，各該高相似商品資訊相似度由高至低排列，顯示於該主要商品顯示畫面及各該候選商品顯示畫面，藉此，無須條碼及RFID等輔助識別物，直接動態影像辨識後，由AI快速找商品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An AI-based image recognition POS system and method, comprising: a product database, an image set with different poses, a POS system, an image capture module, a steady-state determination module, and an AI image recognition system. The product database contains information and images for multiple products. The image set with different poses includes photos of the products arranged in various ways, with each arrangement corresponding to the product information. The POS system includes a real-time image display screen, a main product display screen, and several candidate product display screens. The image capture module can capture continuous images and display them on the real-time image display screen. The steady-state determination module determines whether the object is in a stable state based on the continuous images and captures an image for recognition using the image capture module. The AI image recognition system identifies the recognition image within the image set with different poses and ranks the product information based on similarity, from highest to lowest. This information is displayed on the main product display screen and the candidate product display screens. Thus, without the need for barcodes or RFID tags, the AI system can quickly identify the product directly through dynamic image recognition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(10):商品資料庫</p>
        <p type="p">(20):異位相片集</p>
        <p type="p">(30):POS系統</p>
        <p type="p">(31):即時影像顯示畫面</p>
        <p type="p">(32):主要商品顯示畫面</p>
        <p type="p">(33):候選商品顯示畫面</p>
        <p type="p">(34):強制拍照按鈕</p>
        <p type="p">(40):影像擷取模組</p>
        <p type="p">(50):穩態判斷模組</p>
        <p type="p">(60):AI影像辨識系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="154" publication-number="202617629">
    <tif-files tif-type="multi-tif">
      <tif file="113139588.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>釔鐵鐵氧體組成物及其製備方法及用途</chinese-title>
        <english-title>YTTRIUM IRON FERRITE COMPOSITION AND METHOD OF PREPARING THE SAME AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241022B">C04B35/01</main-classification>
        <further-classification edition="200601120241022B">C04B35/622</further-classification>
        <further-classification edition="200601120241022B">H01F1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐泓璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HUNG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪永熊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YUNG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種釔鐵鐵氧體組成物。釔鐵鐵氧體組成物包含以該釔鐵鐵氧體組成物的總重量為100 wt%計，35至75 wt%的氧化鐵、10至50 wt%的氧化釔、0.1至5 wt%的氧化鋁以及0.1至60 wt%的氧化釓。本發明還公開了一種製備釔鐵鐵氧體組成物的方法，包含步驟：將氧化鐵、氧化釔、氧化鋁與氧化釓進行濕式混合、鍛燒、濕式研磨以及燒結。本發明還公開了一種將釔鐵鐵氧體組成物於製備大功率微波產生器的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An yttrium iron ferrite composition is disclosed by the present disclosure. The yttrium iron ferrite composition comprises, based on a total weight of the yttrium iron ferrite composition being 100 wt%, 35 to 75 wt% of iron oxide, 10 to 50 wt% of yttrium oxide, 0.1 to 5 wt% of aluminium oxide, and 0.1 to 60 wt% of gadolinium oxide. A method of preparing the yttrium iron ferrite composition is further disclosed by the present disclosure. The method comprises steps of wet-mixing, calcining, wet-grinding, and sintering iron oxide, yttrium oxide, aluminum oxide, and gadolinium oxide. A use of the yttrium iron ferrite composition in manufacturing a component of high-power microwave generator is further disclosed by the present disclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10至S40:本發明的釔鐵鐵氧體組成物的製備方法的步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="155" publication-number="202617206">
    <tif-files tif-type="multi-tif">
      <tif file="113139589.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139589</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>口咽罩</chinese-title>
        <english-title>MOUTH-PHARYNGEAL MASK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">A61M16/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昌辰鑫生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRANSIN BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林傑茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEH-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃芓瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王上元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHANG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種口咽罩，用於醫療程序中有效氣道隔離及防護，該口咽罩具有雙層結構，包括由防水不織布(30g~50g)製成的第一層以及由高纖維絨噴布製成的第二層。這些層透過超音波融合技術粘合，形成無縫且耐用的組裝，增強了結構完整性並提升耐用度。該口咽罩包括一個由毛根線覆蓋柔軟布料製成的柔性及具可塑性的掛耳機構，能舒適地固定於使用者的口部，防止移動及不適感。此外，第一層及第二層具有呈平行排列的橫向多邊褶皺，允許口咽罩自由擴展和收縮塑型，以適應各種口部大小和形狀，確保穩固的密封與防止溢流側漏。此口咽罩可確保安全的氣道，從而提高了患者的舒適度和安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mouth-pharyngeal mask designed for effective airway isolation and protection during medical procedures, the mask features a dual-layer structure, including a first layer made of waterproof non-woven fabric (30g~50g) and a second layer made of high-fiber fleece melt-blown fabric. These layers are bonded using ultrasonic welding technology, forming a seamless and durable assembly that enhances structural integrity and improves durability. The mask includes a flexible and moldable hook mechanism comprising pipe cleaners covered with soft fabric, which comfortably secures the mask around the user's mouth, preventing movement and discomfort. Additionally, the first and second layers feature transverse polygonal pleats arranged in parallel, allowing the mask to freely expand and contract to conform to various mouth sizes and shapes, ensuring a secure seal and preventing overflow side leaks. This mouth-pharyngeal mask ensures safe airway management in dental treatments and intensive care unit medical applications, thereby improving patient comfort and safety.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:口咽罩</p>
        <p type="p">105:框架</p>
        <p type="p">110:雙層結構</p>
        <p type="p">112:第一層</p>
        <p type="p">120:掛耳機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="156" publication-number="202618280">
    <tif-files tif-type="multi-tif">
      <tif file="113139591.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>泡沫處理藥劑性能評鑑裝置及其方法</chinese-title>
        <english-title>PERFORMANCE EVALUATION DEVICE AND METHOD FOR FOAM-TREATED AGENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250627B">G01N35/02</main-classification>
        <further-classification edition="200601120250627B">G01N35/10</further-classification>
        <further-classification edition="200601120250627B">G01N1/14</further-classification>
        <further-classification edition="200601120250627B">G01N1/36</further-classification>
        <further-classification edition="200601120250627B">G06F17/10</further-classification>
        <further-classification edition="200601120250627B">B01D19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順化</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可自動逐批次投藥的泡沫處理藥劑性能評鑑的裝置及其方法，該裝置包含：緩衝裝置；測試裝置，與該緩衝裝置相連通；進氣流體供應裝置，與該測試裝置相連通；測試藥劑儲存裝置，與該緩衝裝置相連通；及測試流體，於該測試裝置及該緩衝裝置之間循環流通，其中該測試藥劑儲存裝置配置用以輸送一測試藥劑於該緩衝裝置的該測試流體中，並將加入該測試藥劑的測試流體輸送到該測試裝置中，及將進氣流體供應裝置中的一進氣流體輸送至該測試裝置中，以進行該測試藥劑的性能評估。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device and a method for evaluating the performance of foam-treated agents that can be automatically administered in a batch are provided. The device includes a buffering device; a testing device connected to the buffer device; an intake fluid supply device connected to the testing device; a test agent storage device connected to the buffer device; and a test fluid circulating between the testing device and the buffer device, wherein the test agent storage device is configured to deliver a test agent into the test fluid of the buffer device, the test fluid added with the test agent is delivered to the test device, and an intake fluid from the intake fluid supply device is delivered to the test device to perform the performance evaluation of the test agent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:泡沫處理藥劑性能評鑑裝置</p>
        <p type="p">11:緩衝裝置</p>
        <p type="p">12:測試裝置</p>
        <p type="p">13:進氣流體供應裝置</p>
        <p type="p">14:測試藥劑儲存裝置</p>
        <p type="p">15:第一控溫裝置</p>
        <p type="p">16:回收裝置</p>
        <p type="p">17:第二控溫裝置</p>
        <p type="p">F1:測試流體</p>
        <p type="p">F2:進氣流體</p>
        <p type="p">A1:測試藥劑</p>
        <p type="p">E1:逸散流體</p>
        <p type="p">R1:回收的測試流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="157" publication-number="202618636">
    <tif-files tif-type="multi-tif">
      <tif file="113139594.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618636</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於確定儲區現況的檢測方法</chinese-title>
        <english-title>DETECTION METHOD FOR DETERMINING CURRENT STATUS OF STORAGE AREA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250512B">G06Q10/087</main-classification>
        <further-classification edition="202201120250512B">G06V20/52</further-classification>
        <further-classification edition="202201120250512B">G06V10/764</further-classification>
        <further-classification edition="200601120250512B">G08B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石俊超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUN-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於確定儲區現況的檢測方法，該方法包括一影像擷取步驟、一影像辨識步驟、一背景濾除步驟及一確認步驟。針對鋼捲之儲區，控制光學儀器前往特定走道拍攝用於儲存多個鋼捲的儲區的影像，再利用處理器辨識影像及確認影像是否異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection method for determining the current status of a storage area is provided. The detection method comprises an image capture step, an image recognition step, a background filtering step, and a determine step. For the storage area of steel coils, the optical instrument is controlled to go to a specific aisle to take an image of the storage area used to store steel coils, and then a processor is used to identify the image and determine whether the image is abnormal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201:備置步驟</p>
        <p type="p">S202:影像擷取步驟</p>
        <p type="p">S203:影像辨識步驟</p>
        <p type="p">S204:走道定位步驟</p>
        <p type="p">S205:背景濾除步驟</p>
        <p type="p">S206:確認步驟</p>
        <p type="p">S207:通報步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="158" publication-number="202618557">
    <tif-files tif-type="multi-tif">
      <tif file="113139598.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139598</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型電腦及其效能之智慧調整方法</chinese-title>
        <english-title>NOTEBOOK COMPUTER AND INTELLIGENT ADJUSTMENT METHOD FOR PERFORMANCE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F11/30</main-classification>
        <further-classification edition="200601120250203B">G06F11/34</further-classification>
        <further-classification edition="201901120250203B">G06F1/324</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱建珽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種筆記型電腦及其效能之智慧調整方法。筆記型電腦之效能的智慧調整方法包括以下步驟。獲得筆記型電腦執行之一第一應用程式。獲得筆記型電腦執行之一第二應用程式。獲得數個硬體運作資訊。輸入第一應用程式、第二應用程式及硬體運作資訊至一推論模型，以獲得一中央處理器之數個中央處理器參數設定值及一圖形處理器之數個圖形處理器參數設定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A notebook computer and an intelligent adjustment method for performance thereof are provided. The intelligent adjustment method for the performance of the notebook computer includes the following steps. A first application executed on the notebook computer is obtained. A second application executed on the notebook computer is obtained. A plurality of the hardware operation information are obtained. The first application, the second application and the hardware operation information are inputted into an inference model to obtain a plurality of the CPU parameter setting values of a CPU and a plurality of GPU parameter settings values of a GPU.</p>
      </isu-abst>
      <representative-img>
        <p type="p">160:推論模型</p>
        <p type="p">AP1:第一應用程式</p>
        <p type="p">AP2:第二應用程式</p>
        <p type="p">HW:硬體運作資訊</p>
        <p type="p">OP1:中央處理器使用率</p>
        <p type="p">OP2:圖形處理器使用率</p>
        <p type="p">OP3:記憶體使用率</p>
        <p type="p">OP4:風扇噪音值</p>
        <p type="p">OP5:震動量</p>
        <p type="p">OP6:中央處理器溫度</p>
        <p type="p">OP7:圖形處理器溫度</p>
        <p type="p">PM1:中央處理器參數設定值</p>
        <p type="p">PM11:升頻持續時間</p>
        <p type="p">PM12:電流上限</p>
        <p type="p">PM13:核心電壓偏移</p>
        <p type="p">PM2:圖形處理器參數設定值</p>
        <p type="p">PM21:工作時鐘頻率</p>
        <p type="p">PM22:視訊隨機存取記憶體時鐘</p>
        <p type="p">PM23:顯示卡整體功耗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="159" publication-number="202618483">
    <tif-files tif-type="multi-tif">
      <tif file="113139599.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於即時顯示鋼鐵生產同步參數與影像之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR REAL-TIME DISPLAY OF SYNCHRONIZED PARAMETERS AND IMAGES IN STEEL PRODUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G05B23/00</main-classification>
        <further-classification edition="201201120241104B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪逸群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, I-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙賜川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, TZU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀兆騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHAO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何書安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, SIRIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於即時顯示鋼鐵生產同步參數與影像之系統及方法，該系統包括一資料捕捉單元、一數位場景單元及一資料傳輸單元，該資料捕捉單元包含多個感測器，該數位場景單元用於顯示對應一實體產線的一數位產線。透過該數位場景單元顯示反映實體產線的數位產線，能夠即時獲得生產參數，進而提高生產效率和產品品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for the real-time display of synchronized parameters and images in steel production. The system comprises a data capture unit, a digital scene unit, and a data transmission unit. The data capture unit includes numerous sensors, while the digital scene unit is designed to display a digital production line corresponding to a physical production line. By displaying the digital production line that reflects the operational status of the physical production line through the digital scene unit, real-time production parameters can be obtained, thereby enhancing production efficiency and improving product quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:資料捕捉單元</p>
        <p type="p">21:感測器</p>
        <p type="p">3:數位場景單元</p>
        <p type="p">4:資料傳輸單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="160" publication-number="202618520">
    <tif-files tif-type="multi-tif">
      <tif file="113139600.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139600</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型電腦及其鍵盤燈效的控制方法</chinese-title>
        <english-title>NOTEBOOK COMPUTER AND METHOD FOR CONTROLLING KEYBOARD LIGHTING EFFECTS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">G06F3/02</main-classification>
        <further-classification edition="200601120250109B">H01H13/83</further-classification>
        <further-classification edition="200601120250109B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種筆記型電腦及其鍵盤燈效的控制方法。筆記型電腦之鍵盤燈效的控制方法包括以下步驟。擷取一顯示單元之一螢幕畫面。獲得螢幕畫面之一第一方向像素數量與一第二方向像素數量。獲得一鍵盤下方之數個按鍵光源之一第一方向燈源數量與一第二方向燈源數量。按照第一方向燈源數量與第二方向燈源數量切割螢幕畫面，以獲得數個區塊。於各個區塊取得一代表色，以獲得一燈效矩陣圖檔。按照燈效矩陣圖檔，控制這些按鍵光源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A notebook computer and a method for controlling keyboard lighting effects thereof are provided. The method for controlling the keyboard lighting effects of the notebook computer includes the following steps. A screen frame of a display unit is captured. A number of pixels in a first direction and a number of pixels in a second direction of the screen image are obtained. A number of light sources in the first direction and a number of light sources in the second direction of a plurality of key light sources below the keyboard are obtained. The screen frame is divided according to the number of light sources in the first direction and the number of light sources in the second direction to obtain a plurality of blocks. A representative color of each of the blocks is obtained to obtain a lighting effect matrix. The key light sources are controlled according to the lighting effect matrix.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S151,S152,S153,S160,S170,S180,S190:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="161" publication-number="202618558">
    <tif-files tif-type="multi-tif">
      <tif file="113139602.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139602</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型電腦及其故障預測方法</chinese-title>
        <english-title>LAPTOP AND BREAKDOWN PREDICTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250110B">G06F11/30</main-classification>
        <further-classification edition="200601120250110B">G06F11/28</further-classification>
        <further-classification edition="202301120250110B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種筆記型電腦及其故障預測方法。筆記型電腦之故障預測方法包括以下步驟。獲得筆記型電腦之數個第一偵測數值。獲得筆記型電腦之數個第二偵測數值。輸入第一偵測數值至一監督式預測模型。輸入第二偵測數值至一非監督式預測模型。透過監督式預測模型及非監督式預測模型，獲得筆記型電腦之一故障預測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laptop and a breakdown prediction method thereof are provided. The breakdown prediction method for the laptop includes the following steps. A plurality of first detection values of the laptop are obtained. A plurality of second detection values ​​of the laptop are obtained. The first detection values are inputted to a supervised prediction model. The second detection values are inputted to an unsupervised prediction model. A notebook breakdown prediction result is obtained through the supervised prediction model and the unsupervised prediction model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="162" publication-number="202618532">
    <tif-files tif-type="multi-tif">
      <tif file="113139603.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彈出視窗之智能回應方法及應用其之電子裝置</chinese-title>
        <english-title>SMART RESPONSE METHOD FOR POP-UP WINDOW AND ELECTRONIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250110B">G06F3/048</main-classification>
        <further-classification edition="202201120250110B">G06V40/20</further-classification>
        <further-classification edition="202201120250110B">G06V40/16</further-classification>
        <further-classification edition="201401120250110B">A63F13/21</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚勝雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, SHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹淩帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, LING-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種彈出視窗之智能回應方法及應用其之電子裝置。彈出視窗之智能回應方法包括以下步驟。監視一畫面是否出現一彈出視窗。若畫面出現彈出視窗，則擷取彈出視窗。辨識出一第一控制按鈕及一第二控制按鈕。以一影像擷取單元擷取一使用者之一頭部影像。辨識出使用者之一第一頭部動作或一第二頭部動作。以一收音單元擷取使用者之一聲音訊號。辨識使用者之一第一語音回饋或一第二語音回饋。生成第一控制按鈕之一第一點擊指令或第二控制按鈕之一第二點擊指令。執行第一點擊指令或第二點擊指令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart response method for a pop-up window and an electronic device using the same are provided. The smart response method for the pop-up window includes the following steps. Whether the pop-up window has appeared on the screen is monitored. If the pop-up window has appeared, the pop-up window is captured. A first control button and a second control button are identified. An image capturing unit captures a head image of a user. A first head movement or a second head movement of the user is identified. A sound receiving unit captures a voice signal of the user. A first click command for a first control button or a second click command for a second control button is generated. The first click command or the second click command is executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150,S160,S170,S180,S190:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="163" publication-number="202617493">
    <tif-files tif-type="multi-tif">
      <tif file="113139611.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎖樁</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241127B">B62H3/02</main-classification>
        <further-classification edition="200601120241127B">B62H5/04</further-classification>
        <further-classification edition="200601120241127B">G08B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章　杰克　戈登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JACK GORDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章　杰克　戈登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JACK GORDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊敏玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種鎖樁，包括：安裝基體；定位臂，設於安裝基體上，用於對兩輪車輛的車把手進行承托；鎖臂，可上下擺動地設於安裝基體上，具有與定位臂共同夾緊車把手的夾緊狀態，以將車把手限制於定位臂上，還具有與定位臂形成進出口的張開狀態，進出口用於供車把手進出鎖臂和定位臂之間；以及鎖止裝置，設於安裝基體上，具有對鎖臂進行鎖止的鎖止狀態，以將鎖臂限制於夾緊狀態下，鎖止裝置還具有對鎖臂進行解鎖的解鎖狀態。其能夠適配於夾緊不同形狀、結構的車把手，從而使鎖樁能夠相容不同的兩輪車輛，適用範圍更廣，更利於推廣應用。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:安裝基體</p>
        <p type="p">11:安裝架</p>
        <p type="p">12:安裝箱</p>
        <p type="p">3:鎖臂</p>
        <p type="p">30:托板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="164" publication-number="202617411">
    <tif-files tif-type="multi-tif">
      <tif file="113139613.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓印方法及壓印裝置</chinese-title>
        <english-title>IMPRINT METHOD AND IMPRINT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">B29C59/02</main-classification>
        <further-classification edition="200601120241223B">B29C37/00</further-classification>
        <further-classification edition="200601120241223B">B29C35/02</further-classification>
        <further-classification edition="201101120241223B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭漢檥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HAN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂引棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YIN TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHI JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁瑞優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, RUEI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧芳萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, FANG WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">壓印方法包括設置膠層於基板的表面；施壓於模具，以轉印模具的圖案至膠層；在施壓於模具時，藉由振動裝置，振動基板，以移除膠層中的氣泡；在振動基板之後，固化膠層；以及從膠層移除該模具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imprint method includes disposing a glue layer on a surface of a substrate; applying press to a mold to transfer a pattern of the mold to the glue layer; when applying the press to the mold, vibrating the substrate to remove bubbles in the glue layer by a vibration device; and after vibrating the substrate, curing the glue layer; and removing the mold from the glue layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓印裝置</p>
        <p type="p">110:載台</p>
        <p type="p">110A、120A、900A:表面</p>
        <p type="p">120:振動裝置</p>
        <p type="p">130:施壓裝置</p>
        <p type="p">140:固化裝置</p>
        <p type="p">700:模具</p>
        <p type="p">720:微結構</p>
        <p type="p">800:膠層</p>
        <p type="p">900:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="165" publication-number="202617397">
    <tif-files tif-type="multi-tif">
      <tif file="113139617.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混拌裝置</chinese-title>
        <english-title>MIXING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">B28C5/24</main-classification>
        <further-classification edition="200601120241125B">B28C7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇仁維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, REN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林堃傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SSU YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭珮琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, PEI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連培榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, PEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱振璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林烈全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混拌裝置，包括一混拌槽、一蓋體、多個噴嘴及一驅動組件。蓋體覆蓋於混拌槽，包括至少一穿槽。至少一穿槽連通於混拌槽。這些噴嘴可活動地設置於蓋體，這些噴嘴穿過至少一穿槽而伸入混拌槽內。驅動組件設置於蓋體外，且連接這些噴嘴，以驅動這些噴嘴沿著至少一穿槽活動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mixing device includes a mixing tank, a cover, nozzles and a driving assembly. The cover covers the mixing tank and includes at least one through groove. The at least one through groove is communicated with the mixing tank. These nozzles are movably disposed at the cover, and the nozzles pass through at least one through groove and extend into the mixing tank. The driving assembly is disposed outside the cover and connected to the nozzles to drive the nozzles to move along at least one through groove.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:混拌裝置</p>
        <p type="p">110:混拌槽</p>
        <p type="p">120:蓋體</p>
        <p type="p">130:噴嘴</p>
        <p type="p">140:驅動組件</p>
        <p type="p">150:流體儲存槽</p>
        <p type="p">160:氣固態混合物產生器</p>
        <p type="p">170:流量閥</p>
        <p type="p">180:電控組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="166" publication-number="202618677">
    <tif-files tif-type="multi-tif">
      <tif file="113139618.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消防檢查系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241127B">G06Q50/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昕禹運動競技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施明華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田國健</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種消防檢查系統，具有一遠端管理平台，遠端管理平台具有一儲存單元，儲存單元儲存有檢修場所資訊、消防設備基本資訊、檢修紀錄、檢修教學資訊，檢修場所資訊包括有檢修場所之位置資訊及檢修場所平面設置圖，，而經授權之檢查人員可透過一手持行動裝置連線登入遠端管理平台，以讀取儲存單元中相對應之消防設備基本資訊、檢修紀錄或檢修教學資訊，供檢查人員可將其檢查結果紀錄於相對應之檢修紀錄中，且可將檢修或測試過程拍照或錄影上傳，消防檢查系統委託人可以即時知道該場所消防設備情況有照片影像及所需修復費用，並同時可與消防機關或救災單元連線以達到資訊共享之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:遠端管理平台</p>
        <p type="p">12:使用者管理單元</p>
        <p type="p">13:檢修場所排定單元</p>
        <p type="p">14:儲存單元</p>
        <p type="p">15:匯整單元</p>
        <p type="p">16:分析單元</p>
        <p type="p">21:手持行動裝置</p>
        <p type="p">22:掃描單元</p>
        <p type="p">23:顯示螢幕</p>
        <p type="p">31:消防主管機關</p>
        <p type="p">41:救災單位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="167" publication-number="202618170">
    <tif-files tif-type="multi-tif">
      <tif file="113139619.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黃油機的黃油細化裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F16N5/02</main-classification>
        <further-classification edition="200601120241204B">F16N3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金舟機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING CHO MACHINERY INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪福添</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種黃油機的黃油細化裝置，係提供噴塗細化的黃油於大型機件的外表面，其主要係在其所設一機身的前端接設有一出油管及位於其前端的一細化管噴頭，而該機身的末端則接設有一氣壓源；另設一分流開關，係裝設於該機身上並將該氣壓源一分為二，其中一氣壓係流入於該機身推動所設一活塞腔室加壓擠出黃油，而另一氣壓則經一軟管流入於該其中該細化管噴頭內，藉由孔徑縮小加速氣流流動，並透過推動該活塞腔室加壓及氣流加速細化黃油之雙重作用下，使黃油機可以流暢及均勻的噴出細化的黃油。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:黃油細化裝置</p>
        <p type="p">1:黃油機</p>
        <p type="p">10:機身</p>
        <p type="p">101:前端</p>
        <p type="p">11:黃油儲放區</p>
        <p type="p">12:出油管</p>
        <p type="p">124:延伸桿</p>
        <p type="p">13:活塞腔室</p>
        <p type="p">14:壓桿</p>
        <p type="p">15:氣壓流道</p>
        <p type="p">151:氣壓入口</p>
        <p type="p">2:細化管噴頭</p>
        <p type="p">22:氣體通道</p>
        <p type="p">3:分流開關</p>
        <p type="p">31:分流組件</p>
        <p type="p">32:軟管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="168" publication-number="202618313">
    <tif-files tif-type="multi-tif">
      <tif file="113139620.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>印刷電路板電容模型校正方法及相關設備</chinese-title>
        <english-title>PRINTED CIRCUIT BOARD CAPACITOR MODEL CORRECTION METHOD AND RELATED EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01R31/28</main-classification>
        <further-classification edition="200601120250512B">G01R31/304</further-classification>
        <further-classification edition="200601120250512B">G01R31/312</further-classification>
        <further-classification edition="200601120250512B">H05K1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鴻富錦精密工業（武漢）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧豐華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, FENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周厚原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HOU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒子昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, ZI-ANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種印刷電路板電容模型校正方法及相關設備。印刷電路板電容模型校正方法包括：獲取第一電容的真實測試結果，真實測試結果基於預設的電容測量設備對第一電容測試得到；獲取第一電容的模擬測試結果，模擬測試結果基於預先建立的電容模型對第一電容進行模擬測試得到；真實測試結果與模擬測試結果均至少包括回波損耗和/或插入損耗；基於第一電容的真實測試結果和模擬測試結果調整電容模型的參數。本申請藉由電容模型和電容實物交叉驗證，可以提高電容模型的準確性，進而可以提高使用電容模型獲取的各類資料的準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A printed circuit board capacitor model correction method and related equipment. The printed circuit board capacitor model correction method comprises: obtaining real test results of a first capacitor. The real test result is obtained based on the test of the first capacitor by a preset capacitor measuring equipment. Obtaining simulation test results of the first capacitor. The simulation test results are obtained based on a pre-established capacitor model. Both real test results and simulated test results include at least return loss and/or insertion loss. Adjusting parameters of the capacitor model based on the real test results and simulated test results. By using the capacitor model through the cross-verification of the capacitor model and the physical capacitor, the accuracy of the capacitor model can be improved, and the accuracy of all kinds of data obtained by using the capacitor model can also be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="169" publication-number="202617285">
    <tif-files tif-type="multi-tif">
      <tif file="113139622.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可變風向之風槍</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B08B5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>政相工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴政偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊富凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供可變風向之風槍，其包括一身部、一通道、一入流流道、一活動部、一第一引導部及一第二引導部，其中，該通道係貫設於該身部上，並於該身部的兩端側形成有一第一通口及一第二通口；該入流流道係設於該身部上，並與該通道連通；該活動部係可活動地設於該身部上，且位於該通道內，而可於一第一位置及一第二位置間位移作動；該第一引導部係設於該活動部上；該第二引導部係與該第一引導部相隔開來地設於設於該活動部上。藉此，當該活動部位於該第一位置上時，係使該第一引導部鄰近於該入流流道與該通道相連通的端口，用以供一外部流體沿著該入流流道進入該通道時受該第一引導部所導引而朝該第一通口的方向流動；當該活動部位於該第二位置上時，係使該第二引導部鄰近於該入流流道與該通道相連通的端口，使的該外部流體沿著該入流流道進入該通道時受該第二引導部所導引而朝該第二通口的方向流動。為此，本發明係能夠改變氣流流動的方向，從而實現吹氣或吸氣的使用效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:長形握柄</p>
        <p type="p">12:第二管體</p>
        <p type="p">20:通道</p>
        <p type="p">21:第一通口</p>
        <p type="p">30:入流流道</p>
        <p type="p">31:出氣道</p>
        <p type="p">32:進氣道</p>
        <p type="p">33:連接氣道</p>
        <p type="p">41:第一管體</p>
        <p type="p">411:第一區段</p>
        <p type="p">412:第二區段</p>
        <p type="p">413:第三區段</p>
        <p type="p">42:環凸部</p>
        <p type="p">51:第一環凹槽</p>
        <p type="p">52:第一導氣孔</p>
        <p type="p">61:第二環凹槽</p>
        <p type="p">62:第二導氣孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="170" publication-number="202617475">
    <tif-files tif-type="multi-tif">
      <tif file="113139625.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減速機構及剎車穩定裝置</chinese-title>
        <english-title>DECELERATION MECHANISM AND BRAKING STABILIZING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B60R13/00</main-classification>
        <further-classification edition="200601120241204B">B62D37/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣子昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣子昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種減速機構，包括支撐架體、尾翼及氣壓缸等。該支撐架體具有固定部及活動支架，其中該固定部固定於交通工具上，且該活動支架樞接於該固定部；該尾翼裝設在該活動支架上，並具工作位置；以及該氣壓缸裝設在該固定部上，且與該活動支架連接，俾當該氣壓缸被致動時，使該尾翼位於該工作位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A deceleration mechanism is provided. The deceleration mechanism includes a supporting framework, an empennage and a pneumatic cylinder. The supporting framework has a fixed support and a movable support, wherein the fixed support is fixed on a transportation, and the movable support is pivotally connected to the fixed support. The empennage is mounted on the movable support, and has a working position. The pneumatic cylinder is mounted on the fixed support, and connected with the movable support, wherein when the pneumatic cylinder is actuated, the empennage is moved to the working position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:尾翼機構</p>
        <p type="p">211:第一固定孔</p>
        <p type="p">212:第二固定孔</p>
        <p type="p">22:氣壓缸</p>
        <p type="p">23:尾翼支架</p>
        <p type="p">24:尾翼</p>
        <p type="p">241:後端部</p>
        <p type="p">251:第一氣體入口</p>
        <p type="p">252:第二氣體入口</p>
        <p type="p">26:穩定位置</p>
        <p type="p">271:第一固定部</p>
        <p type="p">272:第二固定部</p>
        <p type="p">273:第三固定部</p>
        <p type="p">281:第一彎折部</p>
        <p type="p">282:第二彎折部</p>
        <p type="p">291:第一活動支架</p>
        <p type="p">292:第二活動支架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="171" publication-number="202617085">
    <tif-files tif-type="multi-tif">
      <tif file="113139640.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穿戴式電子裝置以及生物週期協調系統</chinese-title>
        <english-title>WEARABLE ELECTRONIC DEVICES AND BIOLOGICAL CYCLE COORDINATION SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241030B">A61B5/24</main-classification>
        <further-classification edition="200601120241030B">G06F1/16</further-classification>
        <further-classification edition="200601120241030B">G06F3/01</further-classification>
        <further-classification edition="201801120241030B">G16H50/30</further-classification>
        <further-classification edition="201801120241030B">G16H30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔向東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, XIANG-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祚彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TZUOH-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錦峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔向東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, XIANG-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祚彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TZUOH-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錦峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種穿戴式電子裝置以及生物週期協調系統。穿戴式電子裝置包括一顯示主體、一第一穿戴件以及一第二穿戴件。顯示主體包括一控制電路。第一穿戴件包括一第一共振電路。第一共振電路連接控制電路。第二穿戴件包括一第二共振電路。第一穿戴件以及所述第二穿戴件設置在顯示主體的相對兩側。控制電路根據一多維生物週期分析表，分別在多個時間區間提供對應的一時間區間共振資訊至顯示主體。控制電路還提供時間區間共振資訊至第一共振電路或是第二共振電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wine purifying device and a manufacturing method of the wine purifying device are provided. The wine purifying device includes a first material body and a second material body. The second material body and the first material body together form the wine purifying device. The surface of the pure wine device includes a plurality of concave structures. The wine purifying device is a one-piece structure.        &lt;br/&gt;A wearable electronic device and a biological cycle coordination system are provided. The wearable electronic device includes a display body, a first wearable part and a second wearable part. The display body includes a control circuit. The first wearing piece includes a first resonance circuit. The first resonance circuit is connected to the control circuit. The second wearing piece includes a second resonance circuit. The first wearing part and the second wearing part are arranged on opposite sides of the display body. The control circuit provides corresponding time interval resonance information to the display body in multiple time intervals based on a multi-dimensional biological cycle analysis table. The control circuit also provides time interval resonance information to the first resonance circuit or the second resonance circuit.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">SYS1:穿戴式電子裝置</p>
        <p type="p">1:顯示主體</p>
        <p type="p">3:第一穿戴件</p>
        <p type="p">4:第二穿戴件</p>
        <p type="p">P1:播放裝置</p>
        <p type="p">S1:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="172" publication-number="202618252">
    <tif-files tif-type="multi-tif">
      <tif file="113139646.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>煅燒品質檢測系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR CALCINATION QUALITY DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01N21/85</main-classification>
        <further-classification edition="200601120241204B">G01N25/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧恩石</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, EN-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪士卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, SHIH-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雲南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">煅燒品質檢測系統具有輸送裝置、可見光攝影裝置、熱成像裝置、檢測裝置和控制裝置。輸送裝置具有輸送帶。輸送裝置用於根據預定速度驅動輸送帶傳輸石灰樣本。可見光攝影裝置用於根據預定速度拍攝石灰樣本之可見光影像。熱成像裝置用於根據預定速度拍攝石灰樣本之熱影像。檢測裝置，用於根據可見光影像及熱影像辨識石灰樣本之煅燒狀態。控制裝置用於設定輸送裝置、可見光裝置和熱成像裝置，並根據煅燒狀態輸出警示訊息。煅燒品質檢測方法藉由煅燒品質檢測系統之各元件實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for calcination quality detection has a transport device, a visible light imaging device, a thermal imaging device, a detection device and a control device. The transport device has a conveyer belt. The transport device is used to drive the conveyer belt to transport a lime sample according to a predetermined speed. The visible light imaging device is used to acquire visible light image of the lime sample according to the predetermined speed. The thermal imaging device is used to acquire thermal image of the lime sample according to the predetermined speed. The detection device is used to determine calcination condition of the lime sample according to the visible light image and the thermal image. The control device is used to configure settings of the transport device, the visible light imaging device and the thermal imaging device, and output a notice message according to the calcination condition. A method for calcination quality detection is realized by elements of the system for calcination quality detection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:煅燒品質檢測系統</p>
        <p type="p">100:輸送裝置</p>
        <p type="p">200:可見光攝影裝置</p>
        <p type="p">300:熱成像裝置</p>
        <p type="p">400:照明裝置</p>
        <p type="p">500:檢測裝置</p>
        <p type="p">600:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="173" publication-number="202618524">
    <tif-files tif-type="multi-tif">
      <tif file="113139653.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置、電子系統及其操作方法</chinese-title>
        <english-title>ELECTRONIC DEVICE, ELECTRONIC SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250110B">G06F3/038</main-classification>
        <further-classification edition="200601120250110B">G06F3/03</further-classification>
        <further-classification edition="200601120250110B">G06F13/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技宸股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGAIPC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張誌勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置、電子系統及其操作方法。電子裝置包括處理器以及控制器。控制器耦接處理器。控制器接收來自輸入裝置的輸入信號。控制器基於查找表，根據輸入信號執行第一控制操作，或者，基於查找表，將輸入信號傳輸至處理器，以使處理器根據輸入信號執行第二控制操作。如此，電子裝置能夠提高控制操作的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device, an electronic system and an operating method thereof are provided. The electronic device includes a processor and a controller. The controller is coupled to the processor. The controller receives an input signal from an input device. The controller, based on a lookup table, performs a first controlling operation according to the input signal, alternatively, based on the lookup table, transfers the input signal to the processor, such that the processor performs a second controlling operation according to the input signal. Thereby, the electronic device is capable of increasing an efficiency of the controlling operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子系統</p>
        <p type="p">100:電子裝置</p>
        <p type="p">110:控制器</p>
        <p type="p">120:處理器</p>
        <p type="p">200:輸入裝置</p>
        <p type="p">LUT:查找表</p>
        <p type="p">S1:輸入信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="174" publication-number="202619336">
    <tif-files tif-type="multi-tif">
      <tif file="113139654.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運算處理裝置、影像裝置及頭戴式系統</chinese-title>
        <english-title>ARITHMETIC PROCESSING DEVICE, IMAGING DEVICES AND HEAD MOUNTED SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">H04N7/14</main-classification>
        <further-classification edition="200601120241220B">G06F3/147</further-classification>
        <further-classification edition="200601120241220B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊淼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JYUN-MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種運算處理裝置、影像裝置及頭戴式系統。運算處理裝置包括第一電路板、處理器以及第一調變電路。第一電路板具有第一傳輸介面。處理器安裝在第一電路板上，經配置以評估經由第一傳輸介面進行傳輸的傳輸信號的傳輸品質。第一調變電路安裝在第一電路板上且耦接於處理器與第一傳輸介面之間。處理器根據所評估的傳輸信號的傳輸品質，傳送第一控制信號至第一調變電路，以切換第一調變電路對傳輸信號所進行的調變方式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An arithmetic processing device, an imaging devices and a head mounted system are provided. The arithmetic processing device includes a first circuit board, a processor and a first modulation circuit. The first circuit board has a first transmission interface. The processor is installed on the first circuit board and configured to evaluate transmission quality of a transmission signal transmitted through the first transmission interface. The first modulation circuit is installed on the first circuit board and coupled between the processor and the first transmission interface. The processor sends a first control signal to the first modulation circuit according to the evaluated transmission quality of the transmission signal to switch a modulation mode of the transmission signal performed by the first modulation circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:運算處理裝置</p>
        <p type="p">110:第一電路板</p>
        <p type="p">112:第一傳輸介面</p>
        <p type="p">120:處理器</p>
        <p type="p">130:第一調變電路</p>
        <p type="p">Sc1:第一控制信號</p>
        <p type="p">St:傳輸信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="175" publication-number="202619439">
    <tif-files tif-type="multi-tif">
      <tif file="113139656.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">H05K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡偉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, WEI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王承全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊昌明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括一殼體、設置於前述殼體內之一電路單元以及一ㄇ字形之緩衝元件。前述緩衝元件設置於前述殼體內並且具有一凹槽，其中前述電路單元嵌入前述凹槽內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided, including a housing, a circuit unit disposed in the housing, and a U-shaped buffer member. The buffer member is disposed in the housing and has a recess, wherein the circuit unit is embedded in the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">10:上蓋</p>
        <p type="p">20:殼體</p>
        <p type="p">21:凸肋</p>
        <p type="p">22:外緣</p>
        <p type="p">31:緩衝元件</p>
        <p type="p">311:通孔</p>
        <p type="p">312:凹槽</p>
        <p type="p">32:緩衝元件</p>
        <p type="p">321:通孔</p>
        <p type="p">322:凹槽</p>
        <p type="p">C1:凸出部</p>
        <p type="p">C2:凸出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="176" publication-number="202617966">
    <tif-files tif-type="multi-tif">
      <tif file="113139660.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純酒裝置以及純酒裝置製作方法</chinese-title>
        <english-title>WINE PURIFYING DEVICE AND METHOD FOR MANUFACTURING WINE PURIFYING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">C12H1/07</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔向東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, XIANG-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祚彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TZUOH-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錦峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔向東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, XIANG-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祚彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TZUOH-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錦峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種純酒裝置以及純酒裝置製作方法。純酒裝置包括一第一材料主體以及一第二材料主體。第二材料主體以及第一材料主體共同形成純酒裝置。純酒裝置的表面包括複數個凹陷結構。純酒裝置是一塊狀結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wine purifying device and a manufacturing method of the wine purifying device are provided. The wine purifying device includes a first material body and a second material body. The second material body and the first material body together form the wine purifying device. The surface of the pure wine device includes a plurality of concave structures. The wine purifying device is a one-piece structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">SYS1:純酒裝置</p>
        <p type="p">B1:塊狀結構</p>
        <p type="p">B11:凹陷結構</p>
        <p type="p">1:第一材料主體</p>
        <p type="p">2:第二材料主體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="177" publication-number="202619446">
    <tif-files tif-type="multi-tif">
      <tif file="113139671.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用樞轉式卡扣固定硬碟背板之硬碟架組件</chinese-title>
        <english-title>A HARD DRIVE RACK ASSEMBLY UTILIZING A PIVOTING LATCH TO SECURE A HARD DRIVE BACKPLANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241224B">H05K7/12</main-classification>
        <further-classification edition="200601120241224B">G06F1/16</further-classification>
        <further-classification edition="200601120241224B">G11B33/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俞帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用樞轉式卡扣固定硬碟背板之硬碟架組件包含一硬碟架、一硬碟背板與一樞轉式卡扣。硬碟架設有至少一限位結構。硬碟背板用以在組裝於硬碟架時與硬碟架共同圍構出用以容置至少一硬碟之一硬碟容置空間。樞轉式卡扣包含一樞接部與一卡扣部。樞接部樞接於硬碟架。卡扣部自樞接部延伸出，用以受操作地沿一操作路徑在一鎖定位置與一解鎖位置之間移動。當卡扣部位於鎖定位置時，卡扣部卡扣於硬碟背板，藉以與限位結構共同對硬碟背板加以限位固定；當卡扣部位於解除鎖定位置時，解除卡扣於硬碟背板，藉以允許將硬碟背板自硬碟架拆除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hard drive rack assembly utilizing a pivoting latch to secure a hard drive backplane comprises a hard drive rack, a hard drive backplane, and a pivoting latch. The hard drive rack is equipped with at least one positioning structure. The hard drive backplane, when assembled onto the hard drive rack, forms together with the hard drive rack an enclosure space for accommodating at least one hard drive. The pivoting latch includes a pivot section and a latching section. The pivot section is pivotally connected to the hard drive rack. The latching section extends from the pivot section and is operable to move along an operation path between a locked position and an unlocked position. When the latching section is in the locked position, it latches onto the hard drive backplane, thereby working together with the positioning structure to secure and position the hard drive backplane; when the latching section is in the unlocked position, it disengages from the hard drive backplane, allowing the hard drive backplane to be removed from the hard drive. rack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:硬碟架組件</p>
        <p type="p">1:硬碟架</p>
        <p type="p">11:第一板體</p>
        <p type="p">111a,111b:限位柱</p>
        <p type="p">12:第二板體</p>
        <p type="p">121a,121b:限位壁</p>
        <p type="p">13a,13b:側板</p>
        <p type="p">131a,131b:限位掛勾</p>
        <p type="p">2:硬碟背板</p>
        <p type="p">3:樞轉式卡扣</p>
        <p type="p">31:樞接部</p>
        <p type="p">32:卡扣部</p>
        <p type="p">321:卡扣凸台</p>
        <p type="p">33:抵靠部</p>
        <p type="p">AH:限位孔</p>
        <p type="p">AG:限位槽</p>
        <p type="p">HDH:散熱孔</p>
        <p type="p">AS:硬碟容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="178" publication-number="202617202">
    <tif-files tif-type="multi-tif">
      <tif file="113139678.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139678</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提高零件和過程變化時的功能穩健性的阻尼器溢出室</chinese-title>
        <english-title>DAMPER OVERFILL CHAMBER TO INCREASE FUNCTIONAL ROBUSTNESS REGARDING VARIANCE IN PARTS AND PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61M5/31</main-classification>
        <further-classification edition="200601120241101B">A61M5/20</further-classification>
        <further-classification edition="200601120241101B">A61M5/315</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布蘭貝曲　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLAMBECH, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥連德　馬帝斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELANDER, MATIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬肯　努德　海立克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINKEN, KNUD HELLEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩瑪克　馬丁　尼森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENEMARK, MARTIN NISSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於藥物遞送裝置的阻尼器機構，包括框架構件、可操作地聯接至該藥物遞送裝置的驅動組件的阻尼器構件、形成於該框架構件的至少一部分與該阻尼器構件之間的阻尼器流體室、以及設置在該阻尼器流體室內的阻尼器流體。框架構件和阻尼器構件相對於彼此旋轉，並且阻尼器流體在框架構件和阻尼器構件中的至少一者上施加反向力。阻尼器流體室包括主區段和溢出區段。溢出區段接收來自主區段的過量的阻尼器流體，以減小阻尼器流體室中的填充液位的變化對施加在框架構件和阻尼器構件中的至少一者上的反向力的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A damper mechanism for a drug delivery device comprising a frame member, a damper member operably coupled to a drive assembly of the drug delivery device, a damper fluid chamber formed between at least a portion of the frame member and the damper member, and a damper fluid disposed within the damper fluid chamber. The frame member and the damper member rotate relative to each other, and the damper fluid exerts an opposing force on at least one of the frame member and the damper member. The damper fluid chamber includes a main section and an overfill section. The overfill section receives excess damper fluid from the main section to reduce an effect a variation in fill level in the damper fluid chamber has on the opposing force exerted on at least one of the frame member or the damper member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:藥物遞送裝置/自動注射器</p>
        <p type="p">102:殼體</p>
        <p type="p">102a:近端</p>
        <p type="p">102b:遠端</p>
        <p type="p">110:針頭組件</p>
        <p type="p">112:注射筒</p>
        <p type="p">113:藥劑</p>
        <p type="p">114:針頭或套管</p>
        <p type="p">120:驅動組件</p>
        <p type="p">122:螺母</p>
        <p type="p">122a:螺紋開口</p>
        <p type="p">124:觸發環</p>
        <p type="p">126:柱塞杆引導件</p>
        <p type="p">126a:開口</p>
        <p type="p">127:杆部</p>
        <p type="p">128:基部</p>
        <p type="p">130:柱塞杆組件</p>
        <p type="p">131:柱塞杆</p>
        <p type="p">131a:螺紋部分</p>
        <p type="p">132:墊片</p>
        <p type="p">133:柱塞</p>
        <p type="p">133a:頂面</p>
        <p type="p">136:驅動機構</p>
        <p type="p">136a:內部部分</p>
        <p type="p">140:阻尼器機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="179" publication-number="202618119">
    <tif-files tif-type="multi-tif">
      <tif file="113139683.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種操作窗結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">E06B5/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商無錫艾方芯動自動化設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作窗結構，於機台上設有複數側壁，複數側壁於機台上合圍出封閉的測試室，側壁設有窗口，本發明於側壁內壁設有操作窗，操作窗包括窗框、導電膠片及彈性件，窗框圍繞圍窗口設置於側壁內壁，複數導電膠片併排佈滿窗框，導電膠片一端固定於窗框，另一端經由彈性件固定於窗框另一相對邊，機台內還設有一靜電消除器，靜電消除器經電線與導電膠片電性連接，藉此導電膠片能緊貼操作者手部，讓在手伸入時周圍空隙降至最少，減少乾燥空氣或冷空氣流出機會且能同步消除人體靜電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:側壁</p>
        <p type="p">20:操作窗</p>
        <p type="p">21:窗框</p>
        <p type="p">22:導電膠片</p>
        <p type="p">23:彈性件</p>
        <p type="p">24:金屬壓條</p>
        <p type="p">25:螺絲</p>
        <p type="p">26:連接片</p>
        <p type="p">30:靜電消除器</p>
        <p type="p">31:電線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="180" publication-number="202618672">
    <tif-files tif-type="multi-tif">
      <tif file="113139693.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數位雙生元宇宙智慧建築管理系統</chinese-title>
        <english-title>DIGITAL TWIN UNIVERSE SMART BUILDING MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241126B">G06Q50/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃煜勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃煜勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數位雙生元宇宙智慧建築管理系統，包括一建築場域、至少一個智能載具及一電腦，該建築場域內設置有數個實體載具，該電腦建置有一虛擬建築場域、一人工智能控制模組一人工智能文字語音模組，其中該虛擬建築場域具有與該建築場域同座標、同規格之3D虛擬實境場域，且該虛擬建築場域設有一作為該實體載具之虛擬分身的角色物件，該人工智能控制模組用以供一管理者綁定該之實體載具及角色物件，該智能載具可透過該人工智能文字語音模組而與該實體載具及角色物件連接，使該管理者透過對話式的文字或聲音，使該實體載具與角色物件同步執行該管理者發出之指令或任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital twin universe smart building management system includes a building field, at least one intelligent vehicle and a computer. The building field is equipped with several physical vehicles. The computer is equipped with a virtual building field and an artificial intelligence. The control module is an artificial intelligence text and voice module, in which the virtual building field has a 3D virtual reality field with the same coordinates and specifications as the building field, and the virtual building field is equipped with a vehicle as the physical vehicle The virtual clone's character object, the artificial intelligence control module is used for a manager to bind the physical vehicle and the character object, and the intelligent vehicle can communicate with the physical vehicle through the artificial intelligence text and voice module The connection with the character object allows the manager to synchronize the physical vehicle and the character object to execute the instructions or tasks issued by the manager through conversational text or voice.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:建築場域</p>
        <p type="p">11:實體載具</p>
        <p type="p">2:智能載具</p>
        <p type="p">311:虛擬建築場域</p>
        <p type="p">3111:角色物件</p>
        <p type="p">312:人工智能控制模組</p>
        <p type="p">313:人工智能文字語音模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="181" publication-number="202619606">
    <tif-files tif-type="multi-tif">
      <tif file="113139706.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139706</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有串聯和多結設計實現　50%　效率的混合鈣鈦礦-柔性光伏太陽能電池</chinese-title>
        <english-title>HYBRID PEROVSKITE FLEXIBLE PHOTOVOLTAIC SOLAR CELL WITH TANDEM / MULTI-JUNCTION DESIGN ACHIEVING 50% EFFICIENCY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250217B">H10K30/50</main-classification>
        <further-classification edition="202301120250217B">H10K30/80</further-classification>
        <further-classification edition="202301120250217B">H10K39/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞元科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLLARCHIP TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾棨斐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHI-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">對高效、輕量化、靈活的太陽能解決方案的需求推動了光伏（PV）領域的廣泛研究和開發。傳統的矽基太陽能電池雖然效率很高，但面臨著諸如剛性、高製造成本以及在某些光波長下效率低等限制。為此，有機光伏（OPV）和鈣鈦礦太陽能電池因其靈活性、低成本材料以及微調其光學性能的能力而成為有前途的替代品。然而，這些技術在效率和長期穩定性方面都存在著固有的挑戰。        &lt;br/&gt;混合鈣鈦礦-柔性光伏太陽能電池是一種創新概念，結合了有機光伏材料和鈣鈦礦的最佳特性。透過採用串聯/多結設計，該電池架構能夠捕捉更廣泛的陽光光譜，並以前所未有的效率將其轉換為電能。量子點、等離子體奈米粒子、光子晶體、散熱器和熱電材料等先進材料的結合進一步增強了其性能，將理論轉換效率推向50%。本發明旨在徹底改變太陽能收集，特別是在靈活性、輕量結構和高功率輸出至關重要的應用中。潛在的應用範圍從穿戴式技術和便攜式能源解決方案到光伏建築一體化 (BIPV) 和汽車電源。        &lt;br/&gt;該創新強調實現50% 的效率，這是對當前光伏技術的重大飛躍，目前的光伏技術通常表現出低得多的效率（例如，傳統矽電池在理想條件下的最高效率約為26-28%）。這種混合型太陽能電池的串聯配置允許跨多個吸收層有效利用不同波長的光，解決了光伏系統實現超高效率的最大障礙之一。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The need for efficient, lightweight, and flexible solar energy solutions drives extensive research and development in the photovoltaic (PV) field. Traditional silicon-based solar cells, while highly efficient, face limitations such as rigidity, high manufacturing costs, and low efficiency at certain wavelengths of light. To this end, organic photovoltaics (OPV) and perovskite solar cells are promising alternatives due to their flexibility, low-cost materials, and the ability to fine-tune their optical properties. However, these technologies have inherent challenges in terms of efficiency and long-term stability.        &lt;br/&gt;Hybrid perovskite-OPV flexible solar cells are an innovative concept that combines the best properties of organic photovoltaic materials and perovskites. By using a series/multi-junction design, the cell architecture is able to capture a wider spectrum of sunlight and convert it into electricity with unprecedented efficiency. The combination of advanced materials such as quantum dots, plasmonic nanoparticles, photonic crystals, heat sinks and thermoelectric materials further enhances its performance, pushing the theoretical conversion efficiency to 50%.        &lt;br/&gt;The invention aims to revolutionize solar energy collection, especially in applications where flexibility, lightweight construction and high power output are crucial. Potential applications range from wearable technology and portable energy solutions to building-integrated photovoltaics (BIPV) and automotive power supplies.        &lt;br/&gt;&lt;br/&gt;The innovation emphasizes achieving 50% efficiency, which is a major leap forward from current photovoltaic technology, which typically exhibits much lower efficiencies (e.g., traditional silicon cells have a maximum efficiency of around 26-28% under ideal conditions ). This tandem configuration of hybrid solar cells allows efficient utilization of different wavelengths of light across multiple absorber layers, solving one of the biggest obstacles to achieving ultra-high efficiency in photovoltaic systems.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:透明導電氧化物層</p>
        <p type="p">2:鈣鈦礦吸收層</p>
        <p type="p">3:隧道接面層</p>
        <p type="p">4:硅吸收層</p>
        <p type="p">5:電子傳輸層</p>
        <p type="p">6:空穴傳輸層</p>
        <p type="p">7:熱擴散層</p>
        <p type="p">8:熱電材料</p>
        <p type="p">9:底電極</p>
        <p type="p">10:基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="182" publication-number="202617195">
    <tif-files tif-type="multi-tif">
      <tif file="113139710.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>尿管連接泵裝置</chinese-title>
        <english-title>URINARY CATHETER INFUSION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61M1/00</main-classification>
        <further-classification edition="200601120241101B">A61M3/02</further-classification>
        <further-classification edition="200601120241101B">A61M39/10</further-classification>
        <further-classification edition="200601120241101B">A61M39/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國防醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL DEFENSE MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林以函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳靜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHING-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華彤文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, TUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康豑云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHIH-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘玉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王蔚芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂旻瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MIN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種尿管連接泵裝置，包括有一連接泵導管、一開關閥與一單向瓣膜。其中，連接泵導管為一複數管路連通的中空管，分別具有一尿管連接管、一藥物灌注管與一尿袋連接管，各管路相互連通，作為膀胱化療灌藥、尿液培養檢體收取及膀胱沖洗之用。尿管連接端設於尿管連接管的開口，並連接一尿管；藥物灌注端設於藥物灌注管的開口；尿袋連接端設於尿袋連接管的開口，尿袋連接端與一尿袋連接；開關閥係設於尿袋連接管的管體內；單向瓣膜係設於尿袋連接管的管體內遠離尿袋連接端。藉由本發明的尿管連接泵裝置能有效減少感染風險，節省反覆操作時間，同時提升醫、護理人員灌藥、沖洗的操作便利性及安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a urinary catheter infusion device, comprises a connecting pump catheter, a switch valve and a one-way valve, wherein the connecting pump catheter is a mutely connecting hollow tube, which has a urine catheter connecting tube, a drug perfusion tube and a urine bag connecting tube respectively, and the pipelines of those mentioned tube are interconnected with each other, used for chemotherapy irrigation of bladder and collecting urine routine and bladder irrigation. A urine catheter connection end is located at the opening of the urine catheter connecting tube and is connected to a urine catheter; a drug perfusion end is located at the opening of the drug perfusion tube; a urine bag connection end is located at the opening of the urine bag connecting tube, and a urine bag is connected to the urine bag connection end. The switch valve is located inside the body of the urine bag connecting tube; the one-way valve is located inside the body of the urine bag connecting tube away from the urine bag connection end. In accordance with the urinary catheter infusion device of the present invention can, reduce the risk of infection, save operating time, and improve the operational convenience and safety of nursing staff when irrigation and filling medicine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:尿管連接泵裝置</p>
        <p type="p">11:連接泵導管</p>
        <p type="p">111:尿管連接管</p>
        <p type="p">112:藥物灌注管</p>
        <p type="p">113:尿袋連接管</p>
        <p type="p">114:尿管連接端</p>
        <p type="p">115:藥物灌注端</p>
        <p type="p">116:尿袋連接端</p>
        <p type="p">117:防脫落裝置</p>
        <p type="p">12:開關閥</p>
        <p type="p">14:灌注帽</p>
        <p type="p">15:針筒轉接元件</p>
        <p type="p">16:螺旋卡榫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="183" publication-number="202619317">
    <tif-files tif-type="multi-tif">
      <tif file="113139712.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧驅動的網路安全系統</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE-POWERED CYBERSECURITY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L9/40</main-classification>
        <further-classification edition="201301120250203B">G06F21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳東豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TUNG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PO-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種人工智慧驅動的網路安全系統，設計用來即時偵測、分析及緩解廣泛的網路威脅。該網路安全系統包括一個資料接收模組，負責彙整多樣化的資料類型，包括來自各種來源的影像、文字內容及URL。AI分析模組運用影像識別、光學字元辨識及語義分析來處理接收到的資料，並識別潛在的威脅，如網路釣魚攻擊、詐騙及惡意內容的傳播。一連結分析模組通過動態的白名單及黑名單評估URL的安全性，並對未知連結進行基於AI的評估。音訊介面將威脅偵測擴展至基於音訊的通訊，整合語音轉文字及文字轉語音功能，使系統能夠分析電話通話中可能存在的詐騙或惡意意圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An artificial intelligence-powered cybersecurity system is disclosed, designed to detect, analyze, and mitigate a wide range of online threats in real-time. The system comprises a data ingestion module that aggregates diverse data types, including images, textual content, and URLs from various sources. An AI engine utilizes image recognition, optical character recognition, and semantic analysis to process the ingested data and identify potential threats such as phishing attacks, scams, and harmful content dissemination. A link analysis module assesses the safety of URLs through dynamic whitelists and blacklists, employing AI-based evaluations for unknown links. A communication interface extends threat detection to audio-based communications by integrating speech-to-text and text-to-speech functionalities, enabling analysis of phone calls for fraudulent or malicious intent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路安全系統</p>
        <p type="p">110:資料接收模組</p>
        <p type="p">120:AI分析模組</p>
        <p type="p">122:影像識別元件</p>
        <p type="p">124:光學字元辨識元件</p>
        <p type="p">126:語義分析元件</p>
        <p type="p">130:連結分析模組</p>
        <p type="p">132:白名單</p>
        <p type="p">134:黑名單</p>
        <p type="p">140:使用者介面模組</p>
        <p type="p">142:狀態儀表板</p>
        <p type="p">144:報告工具</p>
        <p type="p">145:家庭監控模組</p>
        <p type="p">160:音訊介面</p>
        <p type="p">10:大語言模型</p>
        <p type="p">20:政府當局伺服器</p>
        <p type="p">30:威脅情報資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="184" publication-number="202618169">
    <tif-files tif-type="multi-tif">
      <tif file="113139715.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支撐裝置及顯示設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">F16M11/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商冠捷投資有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, UEI-UEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國朕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUO-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種支撐裝置及顯示設備，該支撐裝置包含一承載機構、一前支撐腳，及一後支撐腳。該前支撐腳能轉動地連接於該承載機構。該後支撐腳能轉動地連接於該承載機構，該前支撐腳及該後支撐腳能相對於該承載機構旋轉以無段地調整該承載機構的高度，該前支撐腳及該後支撐腳能固定於該承載機構以支撐該承載機構。藉此，使用者能通過該支撐裝置方便且快速地進行顯示器的高度調整。通過對該顯示器的高度調整，使得使用者能利用該顯示器下方的空間來放置條形音箱或電視盒等外接裝置，能避免外接裝置遮蔽到該顯示器的螢幕進而影響到使用者的觀看。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">102:支撐裝置</p>
        <p type="p">1:承載機構</p>
        <p type="p">11:左承載架</p>
        <p type="p">122:導引槽</p>
        <p type="p">14:右承載架</p>
        <p type="p">151:右頂壁</p>
        <p type="p">16:鎖定組件</p>
        <p type="p">162:前螺絲</p>
        <p type="p">164:後螺絲</p>
        <p type="p">2:前支撐腳</p>
        <p type="p">3:後支撐腳</p>
        <p type="p">FA:前水平軸線</p>
        <p type="p">RA:後水平軸線</p>
        <p type="p">X:前後方向</p>
        <p type="p">Y:左右方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="185" publication-number="202619289">
    <tif-files tif-type="multi-tif">
      <tif file="113139716.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脈波寬度調變訊號產生方法及電路</chinese-title>
        <english-title>PULSE WIDTH MODULATION SIGNAL GENERATION METHOD AND CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H03K7/08</main-classification>
        <further-classification edition="200601120250122B">H03K5/26</further-classification>
        <further-classification edition="200601120250122B">H03K5/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷智吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, CHIH-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭崇廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHONG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種脈波寬度調變訊號產生方法，由控制器將一工作週期換算成一預設值及一延遲值，且由計數器進行計數並將一計數值輸入比較器，比較器輸出位於第一準位的第一數位訊號至查表器，直到判斷該計數值達到該預設值時，輸出位於第二準位的第一數位訊號至查表器，查表器判斷第一數位訊號由第一準位變成第二準位時，根據該延遲值將第一數位訊號轉換成兩個第二數位訊號，且根據該延遲值計算一延遲數，輸出雙倍資料率暫存器根據該兩個第二數位訊號產生相較於該第一數位訊號不延遲或延遲半個時脈週期的第三數位訊號，輸出延遲電路根據該延遲數將第三數位訊號延遲預設時間以產生並輸出具有該工作週期的脈波寬度調變訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pulse width modulation signal generation method includes converting by a controller a duty cycle into a predetermined value and a delay value, counting by a counter and inputting a counting value to a comparator, the comparator outputting a first digital signal at a first level to a lookup table until the counting value reaches the predetermined value and outputting the first digital signal at a second level to the lookup table, when the lookup table determines the first digital signal changes from the first level to the second level, the lookup table converts the first digital signal into two second digital signals according to the delay value, and calculates a delay number according to the delay value, wherein an output double data rate register generates a third digital signal that is not delayed or delayed by half a clock cycle compared to the first digital signal based on the two second digital signals, and an output delay circuit delays the third digital signal according to the delay number by a predetermined time, to generate and output a pulse width modulation signal having the duty cycle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S6:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="186" publication-number="202618173">
    <tif-files tif-type="multi-tif">
      <tif file="113139717.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車燈</chinese-title>
        <english-title>VEHICLE LAMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241204B">F21S45/47</main-classification>
        <further-classification edition="200601120241204B">B60Q1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>敏翔股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIN HSIANG CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴上貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, SHANG-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾盈方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昆燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUN-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張以彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種車燈，係用以設置於一車體上，該車體前後方向為一第一方向。該車燈包括一外殼、一電路板、一光學元件及一前罩。該外殼具一後壁及一位於該後壁前方與該後壁連結之環壁，該環壁與該後壁間具一容室，該容室前方具一開口，又該環壁具一內表面，該內表面朝向該容室凸設一承載座，該承載座朝向該容室方向具一組裝面，又該環壁對應該組裝面具有一組裝口。又該電路板具至少一發光體及至少一第一組裝孔，該電路板設於該組裝面上。又該光學元件設於該容室內，並用以導引該發光體所發射之光線。又該前罩與該外殼接合，並實質封閉該開口；其中，該第一組裝孔之垂直投影係實質位於該組裝口之內。藉此本發明可具較佳散熱及組裝便利穩定功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a vehicle lamp designed to be installed on a vehicle body, where the front and rear directions of the vehicle body is a first direction. The vehicle lamp comprises a housing, a circuit board, an optical element, and a front cover. The housing comprises a rear wall and a surrounding wall connected to the front of the rear wall, with a chamber formed between the surrounding wall and the rear wall. The chamber has an opening at the front, and the surrounding wall has an inner surface. A supporting seat protrudes from the inner surface towards the chamber, with a mounting surface facing the chamber, and the surrounding wall comprises a mounting port corresponding to the mounting surface. The circuit board comprises at least one light-emitting element and at least one first mounting hole, and is installed on the mounting surface. The optical element is placed inside the chamber to guide the light emitted by the light-emitting element, and the front cover is connected to the housing, effectively sealing the opening. The vertical projection of the first mounting hole is substantially located within the mounting port, providing improved heat dissipation, as well as convenient and stable assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車燈</p>
        <p type="p">1:外殼</p>
        <p type="p">11:後壁</p>
        <p type="p">12:環壁</p>
        <p type="p">121:內表面</p>
        <p type="p">122:外表面</p>
        <p type="p">13:容室</p>
        <p type="p">131:開口</p>
        <p type="p">14:承載座</p>
        <p type="p">141:組裝面</p>
        <p type="p">142:第二組裝孔</p>
        <p type="p">15:組裝口</p>
        <p type="p">151:第一缺口</p>
        <p type="p">16:散熱鰭片</p>
        <p type="p">17:第一承置槽</p>
        <p type="p">18:第二承置槽</p>
        <p type="p">2:電路板</p>
        <p type="p">21:發光體</p>
        <p type="p">22:第一組裝孔</p>
        <p type="p">23:組裝元件</p>
        <p type="p">3:光學元件</p>
        <p type="p">31:第一側壁</p>
        <p type="p">32:第二側壁</p>
        <p type="p">33:第二缺口</p>
        <p type="p">4:前罩</p>
        <p type="p">41:外框</p>
        <p type="p">42:透光鏡片</p>
        <p type="p">43:遮蔽部</p>
        <p type="p">44:環片部</p>
        <p type="p">D:第一方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="187" publication-number="202619285">
    <tif-files tif-type="multi-tif">
      <tif file="113139718.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聲波裝置及其製造方法</chinese-title>
        <english-title>ACOUSTIC WAVE DEVICE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H03H9/13</main-classification>
        <further-classification edition="200601120241104B">H03H3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃浩閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAO-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聲波裝置的製造方法，包括提供第一基板，第一基板包括第一主體板、第一邊框、及依序堆疊的第一電極、壓電層、及第二電極，及減薄第一基板使第一電極從第一基板的第一表面露出。第一邊框設置在第一主體板中，且設置在第一電極周圍。製造方法另包括提供第二基板，第二基板包括第二主體板及凹部，凹部從第二基板的第二表面凹陷，及將第一基板的第一表面與第二基板的第二表面接合在一起，使得在垂直方向上，凹部、第一電極、壓電層、及第二電極至少部分重疊以形成重疊區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of fabricating an acoustic device includes providing a first substrate including a first bulkplate and a first frame. The first substrate further includes a first electrode, a piezoelectric layer, and a second electrode sequentially stacked. The first frame is disposed in the first bulkplate and further disposed around the first electrode. The method further includes thinning the first substrate such that the first electrode is exposed from a first surface of the first substrate. The method further includes providing a second substrate including a second bulkplate and a recess, the recess sunken from a second surface of the second substrate. The method further includes bonding the first surface of the first substrate and the second surface of the second substrate such that the recess, the first electrode, the piezoelectric layer, and the second electrode at least partially overlap along a vertical direction, so as to form an overlapping area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:聲波裝置</p>
        <p type="p">11:第一基板</p>
        <p type="p">12:第二基板</p>
        <p type="p">11BP,12BP:主體板</p>
        <p type="p">12R:凹部</p>
        <p type="p">11S,12S:表面</p>
        <p type="p">11F:邊框</p>
        <p type="p">112:第一電極</p>
        <p type="p">113:壓電層</p>
        <p type="p">114:第二電極</p>
        <p type="p">115:接觸部</p>
        <p type="p">116:鈍化層</p>
        <p type="p">X,Y,Z:方向</p>
        <p type="p">OS:重疊區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="188" publication-number="202617128">
    <tif-files tif-type="multi-tif">
      <tif file="113139721.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱形牙套形成用之光固化樹脂組合物、及利用該光固化樹脂組合物製備隱形牙套的方法、以及經由該方法所製造而得的隱形牙套</chinese-title>
        <english-title>PHOTOCURABLE RESIN COMPOSITION FOR FORMING INVISIBLE BRACES, MANUFACTURING METHOD FOR FORMING INVISIBLE BRACES USING THE SAME, AND INVISIBLE BRACES PRODUCED BY THE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241101B">A61K6/887</main-classification>
        <further-classification edition="202001120241101B">A61K6/62</further-classification>
        <further-classification edition="200601120241101B">A61C7/08</further-classification>
        <further-classification edition="200601120241101B">A61C7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台科三維科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TECH 3D CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝秉臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, BING JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種隱形牙套形成用之光固化樹脂組合物，及形成隱形牙套的方法，該光固化樹脂組合物包括有以下成分：一基質樹脂，包括以該光固化樹脂組合物之總重量計為0.1~99.9重量%的一丙烯酸酯寡聚物、及以該光固化樹脂組合物之總重量計為0.1~99.9重量%的一丙烯酸酯單體；以及一光引發劑，以該光固化樹脂組合物之總重量計為0.1~10重量%；其中其可被光固化的光照波長範圍為在355~420nm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a photocurable resin composition for forming invisible braces comprising: a matrix resin, and a photoinitiator. The matrix resin includes 0.1 to 99.9 weight% of an acrylate oligomer and 0.1 to 99.9 weight% of an acrylate monomer, with respect to the total weight of the photocurable resin composition. The amount of the photoinitiator is from 0.1 to 10 weight% with respect to the total weight of the photocurable resin composition. The photocurable resin composition can be cured by exposure to a light source with a wavelength ranging from 355 nm to 420 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="189" publication-number="202618134">
    <tif-files tif-type="multi-tif">
      <tif file="113139724.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離心式風扇</chinese-title>
        <english-title>CENTRIFUGAL FAN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">F04D29/30</main-classification>
        <further-classification edition="200601120241223B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林星晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱英哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, ING-JER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種離心式風扇，包含一上蓋、一下蓋、一扇框以及一扇葉模組。上蓋具有一上入風口，上入風口具有一上入風口半徑。扇框位於上蓋與下蓋間，扇框、上蓋以及下蓋形成一空間。扇葉模組設於空間內，且包含一輪轂、一連接環、複數內圈葉片以及複數外圈葉片。連接環環繞輪轂且在輪轂周圍形成一內圈區域以及一外圈區域。複數內圈葉片連接於輪轂與連接環，且環型排列於內圈區域。複數外圈葉片連接於連接環，且環型排列於外圈區域。其中，連接環具有一內側半徑以及一外側半徑，外側半徑大於上入風口半徑。其中，相鄰二外圈葉片之形狀不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal fan comprising an upper cover, a lower cover, a frame and a fan module is provided. The upper cover has an upper air inlet with an upper air inlet radius. The frame, the upper cover and the lower cover form a space. The fan module is disposed in the space and comprises a hub, a ring structure, a plurality of inner fan blades, and a plurality of outer fan blades. The ring structure forms an inner region and an outer region around the hub. The inner fan blades are connected to the hub and the ring structure and circularly arranged in the inner region. The outer fan blades are connected to the ring structure and circularly arranged in the outer region. The ring structure has an outer radius which is greater than the upper air inlet radius. Neighboring outer fan blades are of different shapes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:上蓋</p>
        <p type="p">122:上入風口</p>
        <p type="p">140:下蓋</p>
        <p type="p">142:下入風口</p>
        <p type="p">160:扇框</p>
        <p type="p">180:扇葉模組</p>
        <p type="p">182:輪轂</p>
        <p type="p">184:連接環</p>
        <p type="p">186:內圈葉片</p>
        <p type="p">188:外圈葉片</p>
        <p type="p">A1:內圈區域</p>
        <p type="p">A2:外圈區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="190" publication-number="202618836">
    <tif-files tif-type="multi-tif">
      <tif file="113139726.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵盤之動態燈效的顯示方法及應用其之電子裝置</chinese-title>
        <english-title>METHOD FOR DISPLAYING DYNAMIC LIGHTING ON KEYBOARD AND ELECTRONIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H01H13/84</main-classification>
        <further-classification edition="200601120250122B">H01H13/70</further-classification>
        <further-classification edition="200601120250122B">G06F3/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳良其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鍵盤之動態燈效的顯示方法及應用其之電子裝置。鍵盤之動態燈效的顯示方法包括以下步驟。獲得鍵盤之數個發光單元之一發光點分布圖。以基準列及基準欄為基準，劃分出一矩陣分割圖。將矩陣分割圖之數個區塊與這些發光單元進行一對一對應，以使矩陣分割圖轉換為一發光點區塊圖。發光點區塊圖包括有對應於這些發光單元之數個有發光點區塊及未對應於這些發光單元之數個無發光點區塊。接收至少一顯示圖樣。將顯示圖樣映射於發光點區塊圖，以獲得至少一點亮控制圖。依據點亮控制圖，點亮部分之發光單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for displaying dynamic lighting on a keyboard and an electronic device using the same are provided. The method for displaying the dynamic lighting on the keyboard includes the following steps. A lighting point distribution map of a plurality of light-emitting units of the keyboard is obtained. Based on a reference row and a reference column, the lighting point distribution map is divided to obtain a matrix partition map. A one-to-one correspondence is performed between a plurality of blocks of the matrix partition map and the light-emitting units, so that the matrix partition map is converted into a light-emitting block map. The light-emitting block map includes a plurality of light-emitting point blocks corresponding to the light-emitting units and a plurality of non-light-emitting point blocks that do not correspond to the light-emitting units. At least one display pattern is received. The display pattern is mapped to the light-emitting block map to obtain at least one lighting control map. According to the lighting control map, some of the light-emitting units are lighted up.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150,S160,S170,S180:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="191" publication-number="202617356">
    <tif-files tif-type="multi-tif">
      <tif file="113139729.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扳手</chinese-title>
        <english-title>WRENCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">B25B13/00</main-classification>
        <further-classification edition="200601120241030B">B25B23/14</further-classification>
        <further-classification edition="200601120241030B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特典工具股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAM TOOLS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江水來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, SHUI-LAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種扳手，包括：一本體；一驅動頭，其可繞一樞轉軸線擺動地連接於該本體；及一控制機構，包括一控制件及一定位組件，該控制件可於一鎖定位置及一釋放位置之間移動地設於該本體，該定位組件包括可相對移動之一鎖定件及一定位單元，該鎖定件及該控制件其中一者設有該定位單元、另一者包括一第一定位部及一第二定位部；其中，當該控制件位於該鎖定位置時，該定位單元彈抵入該第一定位部，以該鎖定件朝向該驅動頭使該驅動頭無法轉動；當該控制件位於該釋放位置時，該定位單元彈抵入該第二定位部，使該驅動頭能自由轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wrench is provided, including: a main body; a driving head, connected with the main body and pivoted about a pivot axis; and a control mechanism, including a control member and a positioning assembly, the control member movably disposed on the main body and moved between a locking position and a releasing position, the positioning assembly including a locking member and a positioning unit which are movable relative to each other, one of the locking member and the control member having the positioning unit, the other of the locking member and the control member including a first positioning portion and a second positioning portion; wherein when the control member is in the locking position, the positioning unit elastically engages the first positioning portion, causing the locking member to move toward the driving head to prevent it from rotating; when the control member is in the releasing position, the positioning unit elastically engages the second positioning portion, allowing the driving head to rotate freely.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扳手</p>
        <p type="p">10:本體</p>
        <p type="p">20:驅動頭</p>
        <p type="p">21:頸部</p>
        <p type="p">30:控制機構</p>
        <p type="p">50:軸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="192" publication-number="202617292">
    <tif-files tif-type="multi-tif">
      <tif file="113139730.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139730</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>焚化爐底渣的處理分選方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250106B">B09B3/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川連國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁三裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種焚化爐底渣的處理分選方法，是以一前處理單元分選出尺寸大於20毫米的鐵金屬件，並將該焚化爐底渣破碎至小於19毫米。接著以一篩分單元將該焚化爐底渣區分為一大粒徑料、一中粒徑料，及一小粒徑料，再以三個分選單元分別從該大粒徑料、該中粒徑料，及該小粒徑料分選出鐵金屬及非鐵金屬。後續以一光選單元自該大粒徑料中分選出玻璃料件，即可將經過該金屬分選步驟及該光選步驟後所剩的多個大再生料粒、多個中再生料粒，及多個小再生料粒，分別儲存於三個儲料倉。另外，本發明亦提供用以執行所述焚化爐底渣的處理分選方法的系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:前處理步驟</p>
        <p type="p">12:篩分步驟</p>
        <p type="p">13:金屬分選步驟</p>
        <p type="p">14:光選步驟</p>
        <p type="p">15:儲存步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="193" publication-number="202617446">
    <tif-files tif-type="multi-tif">
      <tif file="113139738.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於模內轉印製程之轉印方法</chinese-title>
        <english-title>TRANSFERING METHOD FOR IN-MOLD ROLLING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B41M3/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王金明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊玉純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊國林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GUO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛二保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, ER-BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種轉印方法，此轉印方法包含以下步驟。首先，提供一塑膠薄膜。隨後，準備一轉印油墨以及一印刷滾輪，印刷滾輪之表面具有一立體圖案。隨後，利用印刷滾輪以及轉印油墨在塑膠薄膜上形成一油墨圖案，而形成一轉印薄膜。接下來，將轉印薄膜放置並定位於一模具內。然後，於模具內填入一結構材料，以形成一結構件，並使油墨圖案由塑膠薄膜轉移至結構件之一表面。最後，對油墨圖案施以一固化處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transferring method for in-mold rolling (IMR) process is provided. The transferring method comprises the following steps. Firstly, a plastic film is provided. Then, transferring ink and a printing roller with a 3D pattern formed on a surface thereof are provided. Thereafter, the printing roller is used to form an ink pattern on the plastic film by using the transferring ink so as to form an ink transfer film. Then, the ink transfer film is placed and positioned in a mold. Thereafter, a structure material is filled in the mold to form a structure component and have the ink pattern transferred from the plastic film to a surface of the structure component. Finally, a solidification treatment is executed for the ink pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150,S160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="194" publication-number="202617109">
    <tif-files tif-type="multi-tif">
      <tif file="113139747.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139747</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於關節韌帶的震動元件</chinese-title>
        <english-title>VIBRATION ELEMENT FOR JOINT LIGAMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">A61F7/00</main-classification>
        <further-classification edition="200601120241030B">A61N1/02</further-classification>
        <further-classification edition="200601120241030B">A61N1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立體育大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN SPORT UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIAO-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宜誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種韌帶震動元件，其包含一貼附單元、一震動單元、一控制單元以及一電力單元。該貼附單元為具有柔韌與彈性之膜片狀結構，且該貼附單元包含一彈性體。該震動單元至少部分埋設於該貼附單元中，且該震動單元產生至少一個以上震動頻率之震動，其中，該震動頻率介於 150 Hz 至 300 Hz。該控制單元與該震動單元訊號相連並調控該震動單元之一開關狀態、該震動頻率以及一震動組合。該電力單元與該震動單元電性連接並提供該震動單元一電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ligament vibration element including an attachment unit, a vibration unit, a control unit, and a power unit. The attachment unit is a flexible and elastic membrane-like structure, and the attachment unit includes an elastic body. The vibration unit is at least partially embedded in the attachment unit, and the vibration unit generates vibrations at least one vibration frequency, and the vibration frequency ranges from 150 Hz to 300 Hz. The control unit is connected to the vibration unit to control the switch state of the vibration unit, the vibration frequency, and a vibration combination. The power unit is electrically connected to the vibration unit to provide power to the vibration unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:韌帶震動元件</p>
        <p type="p">11:貼附單元</p>
        <p type="p">12:震動單元</p>
        <p type="p">13:控制單元</p>
        <p type="p">14:電力單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="195" publication-number="202618282">
    <tif-files tif-type="multi-tif">
      <tif file="113139748.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種應用於測試座的IC分離裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">G01R1/02</main-classification>
        <further-classification edition="200601120241101B">G01R1/04</further-classification>
        <further-classification edition="202001120241101B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商無錫艾方芯動自動化設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾佳芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱創先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於測試座的IC分離裝置及方法，包括：晶片測試座、測試載盤座以及用於驅使晶片測試座與測試載盤座開合的驅動機構，驅動機構與晶片測試座之間還設置有分離機構，分離機構用於驅使晶片測試座偏離驅動機構的驅動方向。IC測試結束後，驅動機構驅使晶片測試座相對於測試載盤座先打開一小段距離，此距離需滿足IC的一部分仍處於測試載盤座的測試孔內；然後利用分離機構驅動晶片測試座偏離驅動機構的驅動方向，使得IC與測試孔內壁相碰，藉此促使IC與彈簧探針分離，提升IC分離成功率，進而提高檢測效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶片測試座</p>
        <p type="p">12:夾持塊</p>
        <p type="p">2:測試載盤座</p>
        <p type="p">3:驅動機構</p>
        <p type="p">31:驅動座</p>
        <p type="p">A:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="196" publication-number="202618580">
    <tif-files tif-type="multi-tif">
      <tif file="113139750.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>永續資料整合與搜尋系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/90</main-classification>
        <further-classification edition="201901120250203B">G06F16/953</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國泰證券投資信託股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫文慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉欣諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林生華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種永續資料整合與搜尋系統，包含有一處理裝置、一永續資料庫裝置及一搜尋伺服器；該處理裝置包含有一人工智能分析模組，該人工智能分析模組根據複數永續關鍵字辨識複數初篩資料中符合該複數永續關鍵字的資訊，以產生複數永續資料；該永續資料庫裝置連接該處理裝置，並儲存該複數永續資料；該搜尋伺服器連接該永續資料庫裝置並接收該複數永續資料，該搜尋伺服器包含有一永續搜尋平台，該永續搜尋平台接收包含至少一關鍵字的一搜尋請求，並根據與該至少一關鍵字相符的各該永續資料整合產生一搜尋結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:永續資料整合與搜尋系統</p>
        <p type="p">10:處理裝置</p>
        <p type="p">11:爬蟲模組</p>
        <p type="p">12:資料提取模組</p>
        <p type="p">13:人工智能分析模組</p>
        <p type="p">14:資料清理模組</p>
        <p type="p">20:永續資料庫裝置</p>
        <p type="p">30:推播裝置</p>
        <p type="p">40:搜尋伺服器</p>
        <p type="p">41:永續搜尋平台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="197" publication-number="202617698">
    <tif-files tif-type="multi-tif">
      <tif file="113139754.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617698</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外泌體之用途、包含有外泌體之複合體、示蹤劑及其製備方法</chinese-title>
        <english-title>USE OF EXOSOMES, COMPLEX COMPRISING EXOSOMES, TRACER, AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C07D257/02</main-classification>
        <further-classification edition="200601120250501B">A61K47/22</further-classification>
        <further-classification edition="200601120250501B">A61K47/16</further-classification>
        <further-classification edition="200601120250501B">A61K51/04</further-classification>
        <further-classification edition="200601120250501B">A61P25/00</further-classification>
        <further-classification edition="200601120250501B">A61P35/00</further-classification>
        <further-classification edition="200601320250501B">A61K103/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王美惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MEI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹振勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何宗澧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于鴻文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此揭示一種外泌體之用途、包含有外泌體之複合體、示蹤劑及其製備方法和用途。所述複合體包含有外泌體、雙功能性螯合劑與外泌體耦接，以及放射線核種為鎵-67或鎵-68嵌合於所述雙功能性螯合劑上。在一較佳的實施方式中，雙功能性螯合劑包含有1,4,7,10-四氮雜環十二烷-1,4,7,10-四乙酸(1,4,7,10-tetraazacyclododecane-1,4,7,10-tetraacetic acid，DOTA)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are use of exosomes, complex comprising exosomes, tracer, preparation method, and use thereof. The complex has exosomes, a bifunctional chelating agent coupled to exosomes, and a radionuclide Ga-67 or Ga-68 on the bifunctional chelating agent. In one preferred embodiment, the bifunctional chelating agent comprising 1,4,7,10-tetraazacyclododecane-1,4,7,10-tetraacetic acid (DOTA).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="198" publication-number="202618377">
    <tif-files tif-type="multi-tif">
      <tif file="113139758.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139758</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統透鏡組、取像裝置及電子裝置</chinese-title>
        <english-title>OPTICAL SYSTEM LENS ASSEMBLY, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">G02B11/32</main-classification>
        <further-classification edition="200601120241223B">G02B3/00</further-classification>
        <further-classification edition="202101120241223B">G02B7/02</further-classification>
        <further-classification edition="202101120241223B">G03B17/28</further-classification>
        <further-classification edition="202101120241223B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大根光學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN INDUSTRIAL OPTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旭昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHIU SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學系統透鏡組，包含六片透鏡。六片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡與第六透鏡。六片透鏡分別具有朝向物側方向的物側表面與朝向像側方向的像側表面。第一透鏡具有負屈折力。第二透鏡物側表面於近光軸處為凹面。第三透鏡具有正屈折力。第四透鏡具有正屈折力。第五透鏡物側表面於近光軸處為凹面。第六透鏡具有負屈折力。當滿足特定條件時，光學系統透鏡組能同時滿足大視角、高成像品質、微型化和影像辨識的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical system lens assembly includes six lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. Each of the six lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The first lens element has negative refractive power. The object-side surface of the second lens element is concave in a paraxial region thereof. The third lens element has positive refractive power. The fourth lens element has positive refractive power. The object-side surface of the fifth lens element is concave in a paraxial region thereof. The sixth lens element has negative refractive power. When specific conditions are satisfied, the requirements of large field of view, high image quality, compactness, and image recognition can be met by the optical system lens assembly, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">S1:光闌</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="199" publication-number="202617560">
    <tif-files tif-type="multi-tif">
      <tif file="113139765.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自走式基板上下料系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B65G47/90</main-classification>
        <further-classification edition="200601120241204B">B65G49/06</further-classification>
        <further-classification edition="200601120241204B">B25J15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達航科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OFUNA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YAO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自走式基板上下料系統，適用於載送多個基板，且包含一料盒及一第一自走車。該料盒包括一料架及多個料框。該等料框適用於裝入該等基板。該第一自走車被電力驅動且用來載送該料盒並對該等料框取放該等基板。該第一自走車包括一車體單元、一輸送單元及一機器人手臂。該輸送單元包括一用來將該料盒移入或移出該車體單元的輸送帶組，及一用來取用其中一該料框的拉放裝置。該拉放裝置具有至少一對間隔設置的伸縮缸組。該機器人手臂用來取放被該拉放裝置取用的該料框的該基板。該機器人手臂包括兩個電動夾爪。每一該電動夾爪具有多個手爪。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:料盒</p>
        <p type="p">12:料框</p>
        <p type="p">200:第一自走車</p>
        <p type="p">300:第二自走車</p>
        <p type="p">31:車體單元</p>
        <p type="p">32:送料帶組</p>
        <p type="p">4:車體單元</p>
        <p type="p">41:基座</p>
        <p type="p">42:行走裝置</p>
        <p type="p">51:輸送帶組</p>
        <p type="p">52:載送裝置</p>
        <p type="p">53:拉放裝置</p>
        <p type="p">532:伸縮缸組</p>
        <p type="p">533:伸縮缸</p>
        <p type="p">6:機器人手臂</p>
        <p type="p">61:手臂本體</p>
        <p type="p">7:回轉警示燈</p>
        <p type="p">Z:上下方向</p>
        <p type="p">Y:前後方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="200" publication-number="202617070">
    <tif-files tif-type="multi-tif">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139775</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多音軌聽力檢測系統及多人同步聽力檢測方法</chinese-title>
        <english-title>HEARING DETECTING SYSTEM BASED ON MULTI-TRACK AUDIO AND SYNCHRONOUS HEARING DETECTING METHOD FOR MULTI-PERSON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">A61B5/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堂權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TANG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堂權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TANG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種多音軌聽力檢測系統，包含一操作端電子裝置、一處理器、一記憶體以及一用戶端電子裝置。操作端電子裝置包含一操作模組。處理器訊號連接操作端電子裝置。記憶體訊號連接操作端電子裝置與處理器且包含複數個測試音訊檔案，且各個測試音訊檔案為一多音軌音訊。用戶端電子裝置訊號連接操作端電子裝置、處理器與記憶體且包含一音訊播放裝置，且音訊播放裝置用以播放測試音訊檔案。藉此，使受試者可在放鬆的狀態下聆聽測試音訊檔案並得到對應的測試結果，以提供醫生作為聽力診斷的依據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a hearing detecting system based on multi-track audio including an operating terminal electronic device, a processor, a memory and a user terminal electronic device. The operating terminal electronic device includes an operating module. The processor is signally connected to the operating terminal electronic device. The memory is signally connected to the operating terminal electronic device and the processor and includes a plurality of testing audio files, and each of the testing audio files is a multi-track audio. The user terminal electronic device is signally connected to the operating terminal electronic device, the processor and the memory and includes an audio playback device, and the audio playback device is for playing the testing audio files. Therefore, the subject can listen to the test audio file in a relaxed state so as to obtain a test result correspondingly to serve as a reference for hearing diagnosis by doctors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多音軌聽力檢測系統</p>
        <p type="p">110:操作端電子裝置</p>
        <p type="p">111:操作模組</p>
        <p type="p">120:處理器</p>
        <p type="p">130:記憶體</p>
        <p type="p">140:用戶端電子裝置</p>
        <p type="p">141:音訊播放裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="201" publication-number="202617842">
    <tif-files tif-type="multi-tif">
      <tif file="113139779.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139779</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護膜之結構及其製程</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250613B">C08J5/18</main-classification>
        <further-classification edition="200601120250613B">C08J7/12</further-classification>
        <further-classification edition="200601120250613B">C08J5/04</further-classification>
        <further-classification edition="200601120250613B">C08L23/06</further-classification>
        <further-classification edition="200601120250613B">C08L23/12</further-classification>
        <further-classification edition="200601120250613B">C08L75/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嵐藝企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANEE ART ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林興利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧富敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種保護膜之結構及其製程，結構包括有一由聚合物彈性材料構成之第一透氣層、一由不織布構成且設於第一透氣層上方之緩衝層、複數形成於第一透氣層上之微透氣孔、及一設於第一透氣層與緩衝層之間的黏著層，並包含有複數貼合部、及複數交錯排列以將各貼合部隔離而與各微透氣孔連通之透氣通道，且各貼合部之總面積為黏著層之40%-60%，或進一步利用黏著層將第二透氣層結合於緩衝層上方。藉此，將保護膜鋪設於地面時，可利用緩衝層進行隔離與防護，避免施工時沾染髒污或碰撞受損，第一、第二透氣層直接以黏著層固定，減少固定工序、防止粉塵鑽入內層，且利用透氣通道讓底層的溼氣可從微透氣孔排出，而實現快乾透氣。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:第一透氣層</p>
        <p type="p">11:微透氣孔</p>
        <p type="p">2:緩衝層</p>
        <p type="p">3:黏著層</p>
        <p type="p">31:貼合部</p>
        <p type="p">32:透氣通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="202" publication-number="202618719">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618719</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧型跌倒求助裝置及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">G08B21/02</main-classification>
        <further-classification edition="200601120250109B">G08B21/18</further-classification>
        <further-classification edition="201301120250109B">G10L25/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穩態光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENTAI TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧型跌倒求助裝置，具有：一語音求助辨識單元，具有多個不同語言偵測模組以偵測一語音求助信號，並在測得該語音求助信號後產生一觸發信號，其中，該語音求助信號包含n次求救呼喊內容，n為大於1之整數；一處理單元，與該語音求助辨識單元耦接，用以依該觸發信號執行一救援通知操作；以及一雙向通信介面，與該處理單元耦接，用以直接與一外部電子裝置或另一所述智慧型跌倒求助裝置通信，或藉由一局部網路與一外部電子裝置或另一所述智慧型跌倒求助裝置通信，從而傳送一救援通知至該外部電子裝置或另一所述智慧型跌倒求助裝置，或自該外部電子裝置或另一所述智慧型跌倒求助裝置接收一所述救援通知。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智慧型跌倒求助裝置</p>
        <p type="p">110:語音求助辨識單元</p>
        <p type="p">120:處理單元</p>
        <p type="p">130:雙向通信介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="203" publication-number="202618730">
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      <isuno>9</isuno>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具電力補充及共享之軌道模型車聯結機構</chinese-title>
        <english-title>RAIL MODEL VEHICLE COUPLING MECHANISM WITH POWER SUPPLEMENTATION AND SHARING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G09B9/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺東專科學校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAITUNG JUNIOR COLLEGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡政龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種具電力補充及共享之軌道模型車聯結機構，於一軌道結構上移動，其包含至少一車體單元、一致動單元，及一監控單元，該車體單元與該軌道結構連接，並包括一車輛主體、一動力輪模組、一車頭連接結構，及一車尾連接結構，該車頭連接結構用於可分離地連接另一車體單元的車尾連接結構，該致動單元包括一致動模組，及一電源模組，該電源模組設置於該車輛主體上，該致動模組驅動該動力輪模組轉動，以使該車體單元在該軌道結構上移動，該監控單元包括一監控模組，該監控模組對該電源模組的供電狀況進行偵測及控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rail model car coupling mechanism with power supplementation and sharing, which moves on a rail structure. It includes at least one vehicle body unit, an actuation unit, and a monitoring unit. The vehicle body unit is connected to the track structure and includes a vehicle body, a power wheel module, a front connection structure, and a rear connection structure. The front connection structure is used to detachably connect the rear connection structure of another car body unit. The actuation unit includes an actuation module and a power module. The power module is installed on the vehicle body. The actuation module drives the power wheel module to rotate, so that the vehicle body unit moves on the track structure. The monitoring unit includes a monitoring module. The monitoring module detects and controls the power supply status of the power module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:車體單元</p>
        <p type="p">31:車輛主體</p>
        <p type="p">32:動力輪模組</p>
        <p type="p">34:車尾連接結構</p>
        <p type="p">35:延伸結構</p>
        <p type="p">36:車輪固定結構</p>
        <p type="p">37:致動固定結構</p>
        <p type="p">4:致動單元</p>
        <p type="p">41:致動模組</p>
        <p type="p">42:電源模組</p>
        <p type="p">5:監控單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="204" publication-number="202618649">
    <tif-files tif-type="multi-tif">
      <tif file="113139793.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動轉換目標帳戶之帳務資料以提供對帳之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR AUTOMATICALLY CONVERTING ACCOUNTING DATA OF TARGET ACCOUNT TO PROVIDE RECONCILIATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250122B">G06Q40/02</main-classification>
        <further-classification edition="201201120250122B">G06Q40/04</further-classification>
        <further-classification edition="201201120250122B">G06Q20/10</further-classification>
        <further-classification edition="201201120250122B">G06Q20/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彰化商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG HWA COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動轉換目標帳戶之帳務資料以提供對帳之裝置及方法，其透過依據目標帳戶之帳務資料使用目標帳戶預定之文字資料格式產生目標資料，並將目標資料傳送至目標伺服器以使目標進行對帳或銷帳作業之技術手段，可以方便即時的傳送交易明細，並達成在約定時間提供對帳或銷帳資料的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for automatically converting accounting data of a target account to provide reconciliation and a method thereof are provided. By using a text data format corresponding to a target account to generate target data based on accounting data of the target account, and sending the target data to a target server so that the target server can perform reconciliation or write-off operations, the device and the method can conveniently transmit transaction details in real time, and can achieve the effect of providing reconciliation or write-off data at agreed time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟320:載入目標帳戶之交易條件</p>
        <p type="p">步驟330:判斷交易條件是否被滿足</p>
        <p type="p">步驟340:取得目標帳戶之帳務資料及預定資料格式</p>
        <p type="p">步驟350:依據帳務資料使用預定資料格式產生目標資料</p>
        <p type="p">步驟370:傳送目標資料至目標伺服器，藉以提供目標伺服器進行對帳或銷帳作業</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="205" publication-number="202617901">
    <tif-files tif-type="multi-tif">
      <tif file="113139794.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617901</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高固含量的水性白色色漿</chinese-title>
        <english-title>HIGH SOLID CONTENT AQUEOUS WHITE COLOR PASTE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C09D17/00</main-classification>
        <further-classification edition="201401120241205B">C09D11/03</further-classification>
        <further-classification edition="201401120241205B">C09D11/037</further-classification>
        <further-classification edition="201401120241205B">C09D11/107</further-classification>
        <further-classification edition="200601120241205B">D06P1/44</further-classification>
        <further-classification edition="200601120241205B">D06P1/52</further-classification>
        <further-classification edition="200601120241205B">D06P1/673</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣永光化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉大銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳威奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳小山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIAO-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高固含量的水性白色色漿，包括：二氧化鈦粉末；陰離子聚電解質；電性調整劑；酸鹼調整劑；以及水；其中，以水性白色色漿的總重量為基準，二氧化鈦粉末的含量為65至80 重量百分比，且二氧化鈦粉末與陰離子聚電解質的重量比介於130至180之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high solid content aqueous white color paste is provided, which comprises: TiO        &lt;sub&gt;2&lt;/sub&gt;powders; an anionic polyelectrolyte; an electrical regulators; an acid-base regulator; and water. Herein, based on a total weight of the aqueous white color paste, the content of the TiO        &lt;sub&gt;2&lt;/sub&gt;powders is 65 to 80 wt%, and a weight ratio of the TiO        &lt;sub&gt;2&lt;/sub&gt;powders to the anionic polyelectrolyte ranges from 130 to 180.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="206" publication-number="202617897">
    <tif-files tif-type="multi-tif">
      <tif file="113139795.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種包含蛋殼粉體作為添加劑之水性塗料組成物及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241028B">C09D7/61</main-classification>
        <further-classification edition="200601120241028B">C09D5/33</further-classification>
        <further-classification edition="200601120241028B">B32B15/04</further-classification>
        <further-classification edition="201901120241028B">B32B7/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種包含蛋殼粉體作為添加劑之水性塗料組成物及其製備方法，以及關於由該等水性塗料組成物形成之隔熱塗層，以及關於經該等隔熱塗層塗覆之基板。本發明具體係產製一種白色微米級蛋殼粉體，並按特定比例將該蛋殼粉體與塗料均勻混合，藉此該蛋殼粉體可實現優良的隔熱性並成為環境負荷低的生物性再生資源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="207" publication-number="202618960">
    <tif-files tif-type="multi-tif">
      <tif file="113139798.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利於移除及填補導電元件之作業裝置及其使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">H01L21/67</main-classification>
        <further-classification edition="201401120241223B">B23K26/21</further-classification>
        <further-classification edition="201401120241223B">B23K26/36</further-classification>
        <further-classification edition="201401120241223B">B23K26/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特朗科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝恩哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種利於移除及填補導電元件之作業裝置，係用以將一基板之待拆元件移除並填補一替代元件，該作業裝置包括：一主體及設置於該主體之承載模組、解焊模組與焊接模組，而作業人員可藉由本發明之利於移除及填補導電元件之作業裝置的使用方法，透過該利於移除及填補導電元件之作業裝置將該基板上的該待拆元件移除，而填補上該替代元件，藉此讓作業人員能以有效率的方式改裝記憶體模組，進而提升產能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:利於移除及填補導電元件之作業裝置</p>
        <p type="p">11:主體</p>
        <p type="p">11a:第一面</p>
        <p type="p">11b:第二面</p>
        <p type="p">111:框架</p>
        <p type="p">12:承載模組</p>
        <p type="p">13:解焊模組</p>
        <p type="p">15:除錫模組</p>
        <p type="p">161:進氣單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="208" publication-number="202616959">
    <tif-files tif-type="multi-tif">
      <tif file="113139803.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於烘焙食品的頂飾組合物、含有該頂飾組合物之烘焙食品以及該烘焙食品的製造方法</chinese-title>
        <english-title>TOPPING COMPOSITION FOR BAKERY PRODUCT, BAKERY PRODUCT CONTAINING THE SAME AND METHOD FOR PRODUCING THE BAKERY PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">A21D15/08</main-classification>
        <further-classification edition="200601120250102B">A21D8/00</further-classification>
        <further-classification edition="201701120250102B">A21D13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>統一企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏霈妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭冠玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉爾順</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於烘焙食品的頂飾組合物，包括：麵粉、第一原料以及第二原料。所述麵粉的含量為90重量份至110重量份，所述第一原料的含量為3.5重量份至4.5重量份，所述第二原料的含量為35重量份至65重量份，其中，該第一原料包括乾酪素鈉，該第二原料為調味品與水的混合物。在本發明第一原料與第二原料的比例搭配下，可使得本發明的頂飾組合物具有適中的流動性，適於應用在工廠生產線，以製得頂飾塗佈均勻且外觀良好不龜裂、不沾黏外袋的烘焙食品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="209" publication-number="202618140">
    <tif-files tif-type="multi-tif">
      <tif file="113139806.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑽尾螺絲</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">F16B25/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙穎慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙穎慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鑽尾螺絲，包含一螺頭、一連接該螺頭的螺桿，及一連接該螺桿的鑽尾。該螺桿包括一連接該螺頭的桿身部，及一凸設於該桿身部外周面螺旋延伸的螺紋部。該鑽尾由該桿身部遠離該螺頭地軸向延伸並逐漸收合。而該螺紋部可以延伸或不延伸至該鑽尾，該鑽尾界定出二排屑溝。每一排屑溝沿該螺桿的軸向貫通。而該螺桿開設出複數沿該桿身部軸向延伸同時橫跨該螺紋部與該鑽尾且深入該桿身部與部分鑽尾的割溝槽。透過該等排屑溝分別連通該等割溝槽，可進一步提升該鑽尾螺絲在鑽攻時的排屑效果，達到螺絲輕易鎖入厚鋼板或厚木質工件的能力，並降低所需扭力，達到省力省電進而環保之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:螺頭</p>
        <p type="p">3:螺桿</p>
        <p type="p">31:桿身部</p>
        <p type="p">32:螺紋部</p>
        <p type="p">33:割溝槽</p>
        <p type="p">331:上割點</p>
        <p type="p">4:鑽尾</p>
        <p type="p">41:排屑溝</p>
        <p type="p">42:側端刃</p>
        <p type="p">43:切削斜刃</p>
        <p type="p">A:鑽尖</p>
        <p type="p">B:延伸線</p>
        <p type="p">D:底面</p>
        <p type="p">E:曲面</p>
        <p type="p">F:尖端面</p>
        <p type="p">G:斜面</p>
        <p type="p">L:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="210" publication-number="202617184">
    <tif-files tif-type="multi-tif">
      <tif file="113139807.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合凝膠</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K47/36</main-classification>
        <further-classification edition="200601120250501B">A61K36/18</further-classification>
        <further-classification edition="201701120250501B">A61K8/9783</further-classification>
        <further-classification edition="200601120250501B">A61P17/02</further-classification>
        <further-classification edition="200601120250501B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>君異藥物載體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇皇家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種混合凝膠，包含阿拉伯膠、明膠、海藻酸鈉和水，其中以所述混合凝膠之總重為基準，所述阿拉伯膠為0.02重量百分比至4.2重量百分比，所述明膠為0.02重量百分比至6重量百分比，所述海藻酸鈉為0.01重量百分比至2重量百分比，以及餘量為水，且所述明膠之來源包含魚類及/或貝類。本發明的混合凝膠可以長時間阻隔空氣髒污粉塵、有害物質或過敏原，而有利於預防、舒緩或治療皮膚問題之功效，確保皮膚自癒力得到更大的發揮。本發明另提供一種所述混合凝膠的製藥用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="211" publication-number="202619328">
    <tif-files tif-type="multi-tif">
      <tif file="113139810.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具模擬熱力圖之行動網路效能管理系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>MOBILE NETWORK PERFORMANCE MANAGEMENT SYSTEM WITH HEAT MAP SIMULATION, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241231B">H04L43/0888</main-classification>
        <further-classification edition="202201120241231B">H04L41/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇立鼎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LI-DING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李兆寅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHAO-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱繽瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PIN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志盟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種具模擬熱力圖之行動網路效能管理系統及其方法，係將管理區域劃分成可彈性調控大小之虛擬網格，並將各種特徵參數視覺化以同時進行各種智慧維運用途，可改善一般行動網路維運系統對於同時進行效能管理與災害應變處理能力不足之缺乏與困境，實施運作上，可藉由蒐集行動網路軟硬體相關特徵資訊，經分析以產生網格效能評估指標數值，再據之進行綜整管理與進階應用。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a mobile network performance management system with heat map simulation and a method thereof. The management area is divided into virtual grids with flexibly adjustable sizes, and various characteristic parameters are visualized to simultaneously perform various intelligent operations. It can improve the lack and dilemma of general mobile network maintenance and operation systems in terms of simultaneous performance management and disaster response capabilities. In terms of implementation, the characteristics information of mobile network software and hardware can be collected and analyzed to generate grid performance evaluation index values, and then conduct comprehensive management and advanced applications based on them. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具模擬熱力圖之行動網路效能管理系統</p>
        <p type="p">10:行網效能特徵參數蒐集裝置</p>
        <p type="p">20:網格效能計算及模擬裝置</p>
        <p type="p">30:熱力圖呈現與應用裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="212" publication-number="202618592">
    <tif-files tif-type="multi-tif">
      <tif file="113139812.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139812</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>簽署認證授權系統、方法及電腦可讀媒介</chinese-title>
        <english-title>SIGNATURE CERTIFICATION AUTHORIZATION SYSTEM, METHOD AND COMPUTER READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250502B">G06F21/30</main-classification>
        <further-classification edition="201301120250502B">G06F21/31</further-classification>
        <further-classification edition="202201120250502B">H04L9/40</further-classification>
        <further-classification edition="202201120250502B">H04L67/50</further-classification>
        <further-classification edition="200601120250502B">H04L9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛仲佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, ZHONG YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉秋宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, CHIOU-TZUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳秋玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIU YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種簽署認證授權系統、方法及電腦可讀媒介，係由簽署網頁服務模組接收用戶端之簽署請求，以由行為分析模組依據簽署請求從用戶行為日誌中擷取出用戶端先前之複數用戶行為資料而分析出用戶端之複數行為指標，俾由行為評分模組依據複數行為指標計算出用戶端之行為分數。再者，由JSON網路令牌管控模組將用戶端之行為分數嵌入JSON網路令牌之酬載中，以於認證或驗證時，由JSON網路令牌管控模組認證或驗證JSON網路令牌之有效性，再依據用戶端之行為分數提供不同權限區分之處理方式，俾有效率地管控用戶端之權限。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a signature certification authorization system, method and computer readable medium. A signature web service module receives a signature request from a user terminal, a behavior analysis module retrieves the user terminal's previous user behavior data from a user behavior log based on the signature request to further analyze the user terminal's multiple behavior indicators, and then a behavior scoring module calculates the user terminal's behavior score based on the multiple behavior indicators. Furthermore, a JSON Web Token control module embeds the user terminal's behavior score into a payload of a JSON Web Token. During authentication or verification, the JSON Web Token control module authenticates or verifies validity of the JSON Web Token, and then provides a processing method for distinguishing different permissions based on the user terminal's behavior score, so as to efficiently control the user terminal's permission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:簽署認證授權系統</p>
        <p type="p">10:簽署網頁服務模組</p>
        <p type="p">11:簽署請求</p>
        <p type="p">20:用戶管理模組</p>
        <p type="p">21:用戶行為日誌</p>
        <p type="p">30:行為分析模組</p>
        <p type="p">31:用戶行為資料</p>
        <p type="p">32:行為指標</p>
        <p type="p">40:行為評分模組</p>
        <p type="p">41:行為分數</p>
        <p type="p">42:優先權</p>
        <p type="p">43:預測模型</p>
        <p type="p">50:JSON網路令牌管控模組</p>
        <p type="p">51:JSON網路令牌</p>
        <p type="p">52:標頭</p>
        <p type="p">53:酬載</p>
        <p type="p">54:簽名</p>
        <p type="p">60:簽署服務介接應用程式介面</p>
        <p type="p">61:應用程式介面</p>
        <p type="p">A:用戶端</p>
        <p type="p">B:身份資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="213" publication-number="202617293">
    <tif-files tif-type="multi-tif">
      <tif file="113139821.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用堆肥再生包裝材料之方法</chinese-title>
        <english-title>METHOD FOR REGENERATING PACKAGING MATERIALS USING COMPOST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241216B">B09B3/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍華科技大學 桃園市龜山區萬壽路一段300 號</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許春耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種使用堆肥再生包裝材料之方法，其步驟包含：(1.)藉由收集桶收集落葉、堆肥及碎紙；(2.)藉由攪碎設備將收集之落葉、堆肥及碎紙進行攪碎以形成漿料；(3.)將漿料藉由擠壓設備進行擠壓；(4.)將漿料藉由濾水設備進行濾乾水份；(5.)將經濾乾之漿料藉由烘烤設備進行烘烤與殺菌以形成再生紙片；(6.)將經烘烤與殺菌之再生紙片加入除味原料；(7.)將加入除味原料之再生紙片藉由擠壓裝置進行擠壓成型；以及(8.)將經擠壓成型之再生紙片形成緩衝包材；藉此，本發明係將落葉、堆肥、碎紙及咖啡渣作為緩衝包材之主要原料，製程簡易且價格低廉，且未生成化學廢料，藉由減少堆肥使用量，並促進堆肥再循環利用，實現循環經濟，此外，咖啡渣具有天然除濕、去除異味及驅逐蚊蟲等效能，亦可用於染色再生紙片，增強材料之多功能性，該緩衝包材具有適當之結合強度，能夠適度吸收震動，從而取代以木漿與廢紙為原料之瓦楞紙包材，達致減少木漿使用量並降低環境污染之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for regenerating packaging materials using compost. The method includes collecting fallen leaves, compost, and shredded paper using a collection bin. The collected materials are then shredded using a shredding device to form the slurry. Next, the slurry is pressed using a pressing device, and excess moisture is removed using a dewatering device. The dewatered slurry is subsequently baked and sterilized in a drying equipment to form regenerated paper sheets. Deodorizing materials are then added to the baked and sterilized paper sheets. The regenerated paper sheets containing deodorizing materials are pressed into shape using an extrusion device, forming the cushioning packaging materials. Through this, the present invention utilizes fallen leaves, compost, shredded paper, and coffee grounds as the main raw materials for cushioning packaging. The process is simple and low-cost, generating no chemical waste as well. By reducing the amount of compost usage and promoting its recycling, it achieves a circular economy. On top of that, coffee grounds possess natural properties for moisture absorption, odor removal, and repelling insects, and can also be used to dye the regenerated paper sheets, enhancing the multifunctionality of the materials. The cushioning packaging exhibits adequate bonding strength and can absorb vibrations appropriately, thereby replacing corrugated packaging made from wood pulp and waste paper, leading to a reduction in wood pulp usage and a decrease in environmental pollution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S001~S008:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="214" publication-number="202617072">
    <tif-files tif-type="multi-tif">
      <tif file="113139822.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生理訊號感測裝置及其啟動方法</chinese-title>
        <english-title>PHYSIOLOGICAL SIGNAL SENSING DEVICE AND ACTIVATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241023B">A61B5/145</main-classification>
        <further-classification edition="200601120241023B">H04M3/487</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華廣生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONIME CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃椿木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳界行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEH-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透過手持裝置啟動生理訊號感測裝置的方法，生理訊號感測裝置用於部分植入皮下以量測生物流體中之分析物之生理訊號，且包括發射器及感測器。發射器包括電源單元、開關單元、磁場感應接收單元及處理單元。該方法包括：建立手持裝置與發射器之感應磁場，使磁場感應接收單元產生感應訊號；在第一工作週期中，感應訊號導通開關單元，使電源單元連接至處理單元，以啟動處理單元；處理單元提供啟動訊號以導通開關單元；開關單元藉由啟動訊號處於自保持狀態；以及在第二工作週期中，電源單元藉由處於自保持狀態之開關單元連接至處理單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for activating a physiological signal sensing device through a handheld device, wherein the physiological signal sensing device is partially implanted subcutaneously to measure a physiological signal of an analyte in biological fluids. The physiological signal sensing device includes a transmitter and a sensor. The transmitter includes a power unit, a switch unit, a magnetic field sensing and receiving unit, and a processing unit. The method includes: establishing an inductive magnetic field between the handheld device and the transmitter, causing the magnetic field sensing and receiving unit to generate an inductive signal; in the first operating cycle, the inductive signal turns on the switch unit, connecting the power unit to the processing unit to activate the processing unit; providing an activation signal from the processing unit to turn on the switch unit; keeping the switch unit in a self-maintaining state due to the activation signal; and in the second operating cycle, connecting the power unit to the processing unit through the switch unit remaining in the self-maintaining state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:手持裝置</p>
        <p type="p">101:第一電感元件</p>
        <p type="p">21:發射器</p>
        <p type="p">22:感測器</p>
        <p type="p">24:磁場感應接收單元</p>
        <p type="p">241:第二電感元件</p>
        <p type="p">242:匹配元件</p>
        <p type="p">243:NFC晶片</p>
        <p type="p">25:開關單元</p>
        <p type="p">26:電源單元</p>
        <p type="p">27:處理單元</p>
        <p type="p">271:類比數位轉換器</p>
        <p type="p">272:微控制器</p>
        <p type="p">28:天線單元</p>
        <p type="p">29:二極體</p>
        <p type="p">CS1:第一控制端</p>
        <p type="p">CS2:第二控制端</p>
        <p type="p">S1:開關</p>
        <p type="p">OUT_1:輸出端</p>
        <p type="p">VDD:電源端</p>
        <p type="p">Power_EN:供電端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="215" publication-number="202619190">
    <tif-files tif-type="multi-tif">
      <tif file="113139824.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>第一電連接器、第二電連接器及電連接器組合</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">H01R13/631</main-classification>
        <further-classification edition="200601120241118B">H01R13/64</further-classification>
        <further-classification edition="200601120241118B">H01R13/52</further-classification>
        <further-classification edition="200601120241118B">H01R13/502</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡忠翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯順茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, SHUEN-MAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳詩弦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種第一電連接器、第二電連接器及電連接器組合。該電連接器組合包含一電路板、該第二電連接器及該第一電連接器。該第二電連接器包括數個導電端子及一第二絕緣座。該第二絕緣座包括一環繞在該等導電端子外圍並界定一第二對接腔的第一間隔牆，及一與該第一間隔牆配合界定出一收容腔的第二間隔牆。該第一電連接器包括一對接電路板、一第一絕緣座、一第一防水環及數條線纜。該對接電路板插入該第二對接腔。該第一絕緣座包括一插入該收容腔的第一防水牆。該第一防水牆界定一供該第一間隔牆進入的第一對接腔。該第一防水環設置於該第一防水牆的外周面且緊抵於該第二間隔牆的內周面。藉由上述設計可達到優良的防水效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路板</p>
        <p type="p">13:螺帽</p>
        <p type="p">2:第二電連接器</p>
        <p type="p">21:導電端子</p>
        <p type="p">22:第二絕緣座</p>
        <p type="p">222:第一間隔牆</p>
        <p type="p">223:第二間隔牆</p>
        <p type="p">224:第二對接腔</p>
        <p type="p">225:收容腔</p>
        <p type="p">23:屏蔽罩</p>
        <p type="p">3:第一電連接器</p>
        <p type="p">31:對接電路板</p>
        <p type="p">311:對接導電墊</p>
        <p type="p">32:第一絕緣座</p>
        <p type="p">321:第一防水牆</p>
        <p type="p">322:第二防水牆</p>
        <p type="p">324:鎖固部</p>
        <p type="p">325:第一對接腔</p>
        <p type="p">326:防水腔</p>
        <p type="p">33:第一防水環</p>
        <p type="p">34:第二防水環</p>
        <p type="p">35:線纜</p>
        <p type="p">36:螺絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="216" publication-number="202619527">
    <tif-files tif-type="multi-tif">
      <tif file="113139826.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D62/60</further-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
        <further-classification edition="200601120250102B">H01L21/265</further-classification>
        <further-classification edition="200601120250102B">H01L21/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>如　是</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIDDIQUI, IRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件包括磊晶層、電流擴散層、閘極結構、井區、重摻雜區以及源極電極。磊晶層具有第一導電型。電流擴散層位於磊晶層中且具有第一導電型。閘極結構與井區位於磊晶層中且位於電流擴散層上方。井區接觸於閘極結構的側壁。井區具有不同於第一導電型的第二導電型。重摻雜區位於磊晶層中且具有第二導電型。重摻雜區接觸於閘極結構的另一側壁。重摻雜區的底面深度大於閘極結構的底面深度。源極電極位於磊晶層上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes an epitaxial layer, a current spreading layer, a gate structure, a well, a heavily doped region, and a source electrode. The epitaxial layer has a first conductive type. The current spreading layer is in the epitaxial layer and has the first conductive type. The gate structure and the well are in the epitaxial layer and above the current spreading layer. The well is in contact with a side wall of the gate structure. The well has a second conductive type that is different from the first conductive type. The heavily doped region is in the epitaxial layer and has the second conductive type. The heavily doped region is in contact with another side wall of the gate structure. A depth of a bottom surface of the heavily doped region is greater than a depth of a bottom surface of the gate structure. The source electrode is above the epitaxial layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體元件</p>
        <p type="p">101:基材</p>
        <p type="p">110:磊晶層</p>
        <p type="p">120:電流擴散層</p>
        <p type="p">130:井區</p>
        <p type="p">132-1,132-2,162,164:部位</p>
        <p type="p">140:輕摻雜區</p>
        <p type="p">150,160:重摻雜區</p>
        <p type="p">170:閘極結構</p>
        <p type="p">172:閘極氧化層</p>
        <p type="p">174:閘極電極</p>
        <p type="p">176:介電層</p>
        <p type="p">180:源極電極</p>
        <p type="p">190:汲極電極</p>
        <p type="p">D1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="217" publication-number="202617553">
    <tif-files tif-type="multi-tif">
      <tif file="113139828.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螺絲工件油屑處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">B65G15/22</main-classification>
        <further-classification edition="200601120250422B">B01D45/12</further-classification>
        <further-classification edition="200601120250422B">B01D43/00</further-classification>
        <further-classification edition="200601120250422B">B07B1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逢霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳科宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逢霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳科宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧信智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種螺絲工件油屑處理系統，包括一輸送帶，該輸送帶末端銜接並連通一脫油機，該脫油機設一導引盤，該導引盤與一篩分機形成銜接與連通。藉由該輸送帶對於該螺絲工件形成引導並藉由機械化輸送至該脫油機，該脫油機可以為一種利用離心動力設備將該螺絲工件所附著之油料甩動脫除，然後將該螺絲工件藉由引導盤導至該篩分機，藉由該篩分機進一步透過振動之物理慣性將附著之金屬屑料振動脫除，使得螺絲工件能夠徹底脫油及脫除金屬屑料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(1):輸送帶</p>
        <p type="p">(11):控制單元</p>
        <p type="p">(111):繼電器</p>
        <p type="p">(2):脫油機</p>
        <p type="p">(21):導引盤</p>
        <p type="p">(22):漏斗</p>
        <p type="p">(3):篩分機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="218" publication-number="202617332">
    <tif-files tif-type="multi-tif">
      <tif file="113139831.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可降低顫振的主軸結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B23Q5/04</main-classification>
        <further-classification edition="200601120241204B">B23B19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌志國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種可降低顫振的主軸結構，包括一加工主軸及一主軸座。該主軸座包括一主軸缸及一活塞環，其中主軸缸具有連通之一軸孔及一缸室，提供加工主軸穿伸，且缸室更提供一流體容置。而該活塞環套組設於加工主軸外周側，並可活動的容置於缸室中，將缸室區隔成一第一壓力區與一第二壓力區。藉由上述構件組成，利用流體其體積彈性係數的特性，當加工主軸作動過程中產生振動時，同動活塞環位移改變第一、二壓力區大小時，同步使流體之體積彈性係數產生變化，發揮對震動特有的衰減特性，有效的降低加工主軸顫振現象。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:加工主軸</p>
        <p type="p">20:主軸座</p>
        <p type="p">21:主軸缸</p>
        <p type="p">40:蓄壓機構</p>
        <p type="p">41:本體</p>
        <p type="p">44:傳動桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="219" publication-number="202617333">
    <tif-files tif-type="multi-tif">
      <tif file="113139832.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單一驅動源具驅動多軸獨立進給結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">B23Q5/04</main-classification>
        <further-classification edition="200601120250123B">B23B19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌志國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種單一驅動源具驅動多軸獨立進給結構，用以提供複數加工主軸組設與調節，包括一機架、一螺桿機構、複數主軸座、複數蓄壓機構、及複數離合機構。該機架，具預設輪廓。該螺桿機構，組設於機架提供一動力。各活塞主軸座，間隔組接於機架，提供各加工主軸組設。各蓄壓機構，對應各活塞主軸座組接且連通。各離合機構，對應各蓄壓機構組設於機架並選擇性離合匹配之蓄壓機構及螺桿機構。藉由上述構件組成，離合機構選擇性離合螺桿機構與蓄壓機構，牽引加壓機構輸出流體至活塞主軸座，驅動活塞主軸座軸向運動，並同動組接其上之加工主軸，達成個別調節各加工主軸於預設軸向之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:機架</p>
        <p type="p">20:螺桿機構</p>
        <p type="p">30:主軸座</p>
        <p type="p">40:蓄壓機構</p>
        <p type="p">90:加工主軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="220" publication-number="202619411">
    <tif-files tif-type="multi-tif">
      <tif file="113139834.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其晶片保護貼</chinese-title>
        <english-title>ELECTRONIC DEVICE AND CHIP PROTECTION STICKER THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H05K1/02</main-classification>
        <further-classification edition="200601120241104B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包含電路板及晶片保護貼。電路板具有板表面，板表面上具有晶片及電子元件。晶片保護貼包括基層、彈性層及保護層。基層具有第一表面、第二表面及第一開口部。彈性層堆疊設置於第一表面上。彈性層包括第一結合面、外表面及第二開口部。第一結合面結合於第一表面。保護層堆疊設置於第二表面上。保護層包括第二結合面、貼附面及第三開口部。第二結合面結合於第二表面。第一開口部、第二開口部及第三開口部相互重疊以形成晶片容置空間。晶片保護貼之貼附面貼附於板表面，且貼附面覆蓋於電子元件，晶片位於晶片容置空間中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a circuit board and a chip protection sticker. The circuit board has a board surface, that has a chip and an electronic member. The chip protection sticker includes a base layer, an elastic layer, and a protecting layer. The base layer has a first surface, a second surface, and a first opening part. The elastic layer is stacked on the first surface, and includes a first combining surface, an external surface, and a second opening part. The first combining surface is combined to the first surface. The protecting layer includes a second combining surface, a sticking surface, and a third opening part. The second combining surface sticks to the second surface. The first opening part, the second opening part, and the third opening part are overlapping with each other to form a chip accommodation space. When the sticking surface of the chip protection sticker sticks to the board surface, the sticking surface is covered on the electronic member, and the chip is located in the chip accommodation space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">102:電路板</p>
        <p type="p">104:晶片保護貼</p>
        <p type="p">106:板表面</p>
        <p type="p">108:晶片</p>
        <p type="p">112:基層</p>
        <p type="p">114:彈性層</p>
        <p type="p">116:保護層</p>
        <p type="p">150:凸耳</p>
        <p type="p">152:第一邊緣</p>
        <p type="p">154:第二邊緣</p>
        <p type="p">A:剖面線</p>
        <p type="p">S1:晶片容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="221" publication-number="202618655">
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        <document-id>
          <doc-number>113139836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳價值產生及流通平台以及碳價值產生及流通方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250203B">G06Q40/04</main-classification>
        <further-classification edition="202401120250203B">G06Q50/06</further-classification>
        <further-classification edition="202201120250203B">H04L9/40</further-classification>
        <further-classification edition="201201120250203B">G06Q20/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海洋福星生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何偉寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾柏錕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種碳價值產生及流通平台，包括碳捕捉裝置及伺服計算裝置。碳捕捉裝置係設置於一環境中，該碳捕捉裝置係作用於該環境中所含的溫室氣體並取得該溫室氣體之二氧化碳質量當量之降低值，並將一反映該二氧化碳質量當量之降低值之減碳資料傳送至伺服計算裝置。伺服計算裝置連接區塊鏈網路。減碳資料透過伺服計算裝置及區塊鏈網路儲存於區塊鏈資料庫並產生儲存於區塊鏈資料庫的虛擬資產，用戶可透過本發明之碳價值產生及流通平台查詢及交易該虛擬資產。本發明亦提出一種碳價值產生及流通方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:碳價值產生及流通平台</p>
        <p type="p">1:碳捕捉裝置</p>
        <p type="p">2:伺服計算裝置</p>
        <p type="p">M:商家計算裝置</p>
        <p type="p">C:用戶計算裝置</p>
        <p type="p">R:商家</p>
        <p type="p">U、S:用戶</p>
        <p type="p">N:網路</p>
        <p type="p">BN:區塊鏈網路</p>
        <p type="p">ND:參加節點</p>
        <p type="p">BC:區塊鏈資料庫</p>
        <p type="p">Bn:區塊</p>
        <p type="p">AF1:第一氣流</p>
        <p type="p">AF2:第二氣流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="222" publication-number="202619272">
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        <document-id>
          <doc-number>113139838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光伏太陽能電池電控調光膜</chinese-title>
        <english-title>PHOTOVOLTAIC SOLAR CELL ELECTRONICALLY CONTROLLED DIMMING FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241204B">H02S40/20</main-classification>
        <further-classification edition="200601120241204B">G02F1/13</further-classification>
        <further-classification edition="200601120241204B">B32B17/06</further-classification>
        <further-classification edition="201901120241204B">B32B7/023</further-classification>
        <further-classification edition="200601120241204B">E06B3/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞元科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLLARCHIP TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾棨斐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHI-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光伏太陽能電池電控調光膜是一種創新的雙重功能產品，結合了太陽能發電與電子控制的調光功能。它採用了高效的鈣鈦礦+氧化鋅透明導電氧化物（TCO）層，在確保70-75%的透明度下，實現了17-22%的能量轉換效率。這種技術在不阻擋大量光線的情況下捕獲太陽能，使其適用於需要高透明度的應用，如窗戶或玻璃幕牆。透過整合主動調光層（由聚合物分散液晶或液晶製成），該膜可以動態調節光線透射率。當通電時，膜從不透明轉換為透明，允許使用者控制室內照明和熱能。此功能顯著降低了空調（HVAC系統）在強烈陽光下的能耗。該技術的擴展功能包括：        &lt;br/&gt;&lt;b&gt;透明度和效率：&lt;/b&gt;鈣鈦礦+氧化鋅混合TCO層確保了高光線透射率和高效的太陽能捕獲。膜的透明度通常在70-75%之間，使其在應用於建築物立面或車輛窗戶時保持清晰美觀的外觀。同時，其能量轉換效率（17-22%之間）提供了一種可靠且可持續的再生能源來源，即使在需要高水平自然光的區域也是如此。        &lt;br/&gt;&lt;br/&gt;&lt;b&gt;透過調光控制光線：&lt;/b&gt;電子控制的調光機制允許膜對環境條件做出動態響應。當陽光過強時，液晶調光層散射光線，減少眩光和室內熱量。在通電狀態下，膜增強了可見性，同時仍能產生太陽能。這種靈活性提供了環境控制，而不犧牲能源效率。        &lt;b&gt;減少冷卻負載：&lt;/b&gt;該技術最重要的應用之一是其能夠減少HVAC能耗。調光功能有助於阻擋過多的陽光，減少室內熱量積聚。因此，所需的空調較少，這可以顯著節省能源費用並減少碳足跡。        &lt;b&gt;在不同行業的應用&lt;/b&gt;&lt;br/&gt;1.        &lt;b&gt;建築和建築：&lt;/b&gt;在現代建築，特別是高層玻璃結構中，平衡光線、熱能和能源效率是一項重大挑戰。透過在窗戶和立面上安裝太陽能電控調光膜，建築師可以創造出節能的建築，既能發電，又能提供對光線和熱量的動態控制。膜的透明度確保使用者保持清晰的視野，而調光功能則防止室內過熱。        &lt;br/&gt;2.        &lt;b&gt;汽車工業：&lt;/b&gt;汽車，尤其是電動汽車，可以透過將本膜整合到天窗和窗戶中而受益。它不僅可以減少車內的眩光和熱量，還可以產生太陽能來為輔助系統供電，延長電池壽命並提高車輛的整體能源效率。        &lt;br/&gt;3.        &lt;b&gt;商業和工業環境：&lt;/b&gt;在大型商業空間，如購物中心、機場和辦公大樓，該膜可以應用於天窗和大窗戶。這可以在白天減少對人工照明的需求，同時有助於建築物的能源供應。同樣，它可以透過在高峰陽光時調暗來減少冷卻成本。        &lt;br/&gt;&lt;b&gt;技術亮點&lt;/b&gt;&lt;br/&gt;&lt;b&gt;混合鈣鈦礦&lt;/b&gt;&lt;b&gt;+&lt;/b&gt;&lt;b&gt;氧化鋅太陽能層：&lt;/b&gt;這種混合材料在轉換太陽能的同時保持透明度，這是光伏技術中一個具有挑戰性的平衡。氧化鋅作為透明導電氧化物（TCO）的加入，提高了膜的整體導電性和透明度，確保太陽能電池可以在不影響可見性的情況下有效地運作。        &lt;br/&gt;&lt;br/&gt;&lt;b&gt;動態調光層：&lt;/b&gt;PDLC/LC層對電輸入做出即時響應，按需改變膜的透明度。這允許使用者控制進入空間的光量，提高舒適度並在高峰日光時減少能源消耗。        &lt;br/&gt;&lt;br/&gt;&lt;b&gt;長期耐用性：&lt;/b&gt;該膜經過設計，能夠承受長時間暴露於陽光和波動的環境條件下，使其適用於長期使用。這些材料經過設計，確保調光和發電功能在整個產品生命週期內保持有效。        &lt;b&gt;對最終使用者的益處&lt;/b&gt;&lt;br/&gt;1.        &lt;b&gt;節能：&lt;/b&gt;透過結合發電和調光，該膜提供了雙重的能源儲蓄。它不僅透過產生太陽能來減少電費，而且還可以透過控制來自陽光的熱量來最小化空調的需求。        &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;美觀和功能靈活性：&lt;/b&gt;膜的高透明度意味著它可以整合到各種玻璃應用中，而不改變建築物或車輛的美觀。動態調光功能確保使用者可以控制他們的環境，提高舒適性和可見性。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Photovoltaic solar cell electronically controlled dimming film is an innovative dual-function product that combines solar power generation with electronically controlled dimming functions. It uses a highly efficient perovskite + zinc oxide transparent conductive oxide (TCO) layer to achieve an energy conversion efficiency of 17-22% while ensuring 70-75% transparency. This technology captures solar energy without blocking a lot of light, making it suitable for applications that require high transparency, such as windows or glass curtain walls.        &lt;br/&gt;By integrating an active light-modulating layer (made of polymer-dispersed liquid crystals, or liquid crystals), the film can dynamically adjust light transmittance. When electricity is applied, the membrane switches from opaque to transparent, allowing users to control interior lighting and heat. This feature significantly reduces air conditioning (HVAC system) energy consumption in strong sunlight.        &lt;br/&gt;Expanded capabilities of this technology include:        &lt;br/&gt;• Transparency and efficiency: The perovskite + zinc oxide hybrid TCO layer ensures high light transmittance and efficient solar energy capture. The film's transparency is typically between 70-75%, allowing it to maintain a clear and beautiful appearance when applied to building facades or vehicle windows. At the same time, its energy conversion efficiency (between 17-22%) provides a reliable and sustainable source of renewable energy, even in areas that require high levels of natural light.        &lt;br/&gt;&lt;br/&gt;• Controlling light through dimming: Electronically controlled dimming mechanisms allow the film to respond dynamically to environmental conditions. When the sunlight is too strong, the liquid crystal dimming layer scatters light to reduce glare and indoor heat. In an energized state, the membrane enhances visibility while still generating solar energy. This flexibility provides environmental control without sacrificing energy efficiency.        &lt;br/&gt;• Reduced cooling loads: One of the most important applications of this technology is its ability to reduce HVAC energy consumption. The dimming feature helps block excess sunlight and reduce indoor heat build-up. As a result, less air conditioning is required, which can result in significant savings on energy bills and a reduced carbon footprint.        &lt;br/&gt;Applications in different industries        &lt;br/&gt;1. Architecture and Architecture: Balancing light, heat and energy efficiency is a major challenge in modern buildings, especially high-rise glass structures. By installing solar electronically controlled dimming films on windows and facades, architects can create energy-efficient buildings that both generate electricity and provide dynamic control of light and heat. The transparency of the film ensures users maintain a clear view, while the dimming function prevents indoor overheating.        &lt;br/&gt;2. Automotive industry: Automobiles, especially electric vehicles, can benefit from integrating this film into skylights and windows. Not only does it reduce glare and heat inside the vehicle, it also generates solar energy to power assistance systems, extending battery life and improving the vehicle's overall energy efficiency.        &lt;br/&gt;3. Commercial and industrial environments: In large commercial spaces such as shopping malls, airports and office buildings, the film can be applied to skylights and large windows. This reduces the need for artificial lighting during the day while contributing to the building's energy supply. Likewise, it can reduce cooling costs by dimming during peak sunlight hours.        &lt;br/&gt;Technical Highlights        &lt;br/&gt;• Hybrid perovskite + zinc oxide solar layer: This hybrid material converts solar energy while maintaining transparency, a challenging balance in photovoltaic technology. The addition of zinc oxide as a transparent conductive oxide (TCO) increases the overall conductivity and transparency of the film, ensuring that the solar cells can operate effectively without affecting visibility.        &lt;br/&gt;• Dynamic dimming layer: The PDLC/LC layer responds instantly to electrical input, changing the transparency of the film on demand. This allows users to control the amount of light entering the space, improving comfort and reducing energy consumption during peak daylight hours.        &lt;br/&gt;• Long-term durability: The membrane is designed to withstand prolonged exposure to sunlight and fluctuating environmental conditions, making it suitable for long-term use. These materials are designed to ensure that the dimming and power generation functions remain effective throughout the product life cycle.        &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;Benefits to end users        &lt;br/&gt;1. Energy Saving: By combining power generation and dimming, the film provides dual energy savings. Not only does it reduce electricity bills by generating solar energy, but it also minimizes the need for air conditioning by controlling heat from sunlight.        &lt;br/&gt;2. Aesthetics and functional flexibility: The film’s high transparency means it can be integrated into a variety of glazing applications without changing the aesthetics of the building or vehicle. Dynamic dimming ensures users can control their environment, improving comfort and visibility.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:以抗反射塗層(ARC)的外部保護層(PET或玻璃)</p>
        <p type="p">2:鈣鈦礦+ZnO(混合TCO層)(具有光子晶體的ZnO，用於發電和光吸收)</p>
        <p type="p">3:第一透明導電層(ITO或AZO)</p>
        <p type="p">4:主動式調光層(PDLC或液晶層)</p>
        <p type="p">5:第二透明導電層(ITO或AZO)</p>
        <p type="p">6:含有矽電容器的底部電極(陰極)</p>
        <p type="p">7:內保護層(PET或玻璃)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="223" publication-number="202619325">
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      <invention-title>
        <chinese-title>網路拓撲設備的自動定位系統及其方法</chinese-title>
        <english-title>AUTOMATIC POSITIONING SYSTEM OF NETWORK TOPOLOGY DEVICES AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L41/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪健哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIEN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓清波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHING-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王長智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種網路拓撲設備的自動定位系統及其方法，方法包括依據網路位階或用途將網路分成多個子網路，以建立與設定網路組態；依據各子網路中各設備的設備類型及設備用途建立與設定設備組態，並且依據各設備所屬網路將各設備與網路組態關聯；依據各電路所銜接的兩端的設備類型的組合，建立與設定電路組態，並且將各電路與設備組態關聯後，獲取並儲存經關聯後的電路組態；依據設定的各拓樸情境建立與設定各拓樸情境組態，並且依據電路組態將各電路與各拓樸情境關聯後，獲取並儲存經關聯後的各拓樸情境組態；以及生成網路情境拓樸圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic positioning system of network topology devices and method thereof are provided, the method includes dividing network into a plurality of subnetworks according to network level or usage to create and set network configuration; establishing and setting device configuration according to device type and device usage of each device in each subnetwork, and associating each device with the network configuration according to the network to which each device belongs; establishing and setting circuit configuration according to combination of device types at both ends connected to each circuit, and associating each circuit with the device configuration, obtaining and storing the associated circuit configuration; establishing and setting each topology situation configuration according to each set topology situation, and associating each circuit with each topology situation according to the circuit configuration, obtaining and storing the associated topology situation configuration; and generating a network situation topology map.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301、S302、S303、S304、S305:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="224" publication-number="202619488">
    <tif-files tif-type="multi-tif">
      <tif file="113139840.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241023B">H10B43/23</main-classification>
        <further-classification edition="202301120241023B">H10B43/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昊名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, HAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宗彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZUNG-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許皓棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAO-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種記憶體裝置，其包括基底、多個電荷儲存層以及多個控制閘極層。基底包括多個鰭結構，其中多個鰭結構在第一方向上彼此間隔開來且在與第一方向交叉的第二方向上延伸。多個電荷儲存層分別設置在各鰭結構在第一方向上的相對兩側壁上。多個控制閘極層分別設置在多個電荷儲存層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a memory device including a substrate, a plurality of charge storage layers and a plurality of control gate layers. The substrate includes a plurality of fin structures spaced apart from each other in a first direction and extending in a second direction crossing the first direction. The plurality of charge storage layers are respectively disposed on the opposite sidewalls, in the first direction, of each fin structure. The plurality of control gate layers are disposed on the plurality of charge storage layers, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">110:介電層</p>
        <p type="p">120:電荷儲存層</p>
        <p type="p">130:控制閘極層</p>
        <p type="p">140:介電圖案</p>
        <p type="p">150:汲極圖案</p>
        <p type="p">160:導電接觸件</p>
        <p type="p">CH:通道圖案</p>
        <p type="p">CSL:源極圖案</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="225" publication-number="202618328">
    <tif-files tif-type="multi-tif">
      <tif file="113139846.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬鍍層檢測裝置和金屬鍍層檢測方法</chinese-title>
        <english-title>METAL CLADDING LAYER EXAMINING DEVICE AND EXAMINING METHOD OF METAL CLADDING LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250512B">G01S17/04</main-classification>
        <further-classification edition="200601120250512B">G01N22/00</further-classification>
        <further-classification edition="200601120250512B">H01Q13/02</further-classification>
        <further-classification edition="200601120250512B">C23C14/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造（浙江）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE ITECH(ZHEJIANG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃襄臨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIANGLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種金屬鍍層檢測裝置和金屬鍍層檢測方法，將發射天線和接收天線與訊號分析模組通訊連接。由此，一方面，將發射天線和接收天線配置為喇叭天線，從而提高了電磁波的指向性以及特定方向上的增益。另一方面，將兩個喇叭天線的中心軸線設置於同一平面內，且兩個喇叭天線的兩個大徑口相互靠近相同的角度，當待測區域放置在兩個大徑口之間且預定頻率的入射電磁波輻射至待測區域時，可滿足電磁波的反射條件。訊號分析模組通過解析反射電磁波的訊號强度，便於判斷出待測區域是否布設了金屬鍍層。提高了檢測的準確度，避免直接與金屬鍍層接觸，導致其劃傷的情況出現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the present invention disclose a metal cladding layer examining device and an examining method of a metal cladding layer, wherein an emitter antenna is communicatively connected to a receiver antenna and a signal analysis module. On one hand, the emitter antenna and the receiver antenna are loudspeaker antennas, thereby improving the direction of an electromagnetic wave and the gain on a particular direction; on the other hand, the central axial lines of the two loudspeaker antennas are disposed on the same plane, the two bell mouths of the two loudspeaker antennas approach each other at the same angle. When a region to examine is positioned between the two bell mouths and an incident electromagnetic wave with a preset frequency radiates on the region to examine, the reflection conditions of the electromagnetic wave may be met. The signal analysis module determines whether the region to examine has a metal cladding layer by analyzing the signal strength of a reflected electromagnetic wave. The foregoing configurations improve the accuracy of examining and avoid contacting the metal cladding layer directly which would results in scratching the metal cladding layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:發射天線</p>
        <p type="p">2:接收天線</p>
        <p type="p">3:訊號分析模組</p>
        <p type="p">4:安裝架</p>
        <p type="p">5:同軸線</p>
        <p type="p">A:工件</p>
        <p type="p">A1:待測區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="226" publication-number="202618320">
    <tif-files tif-type="multi-tif">
      <tif file="113139849.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139849</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雜訊限制電壓之檢測方法</chinese-title>
        <english-title>METHOD FOR DETECTING VOLTAGE WITH NOISE LIMITATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250110B">G01R31/304</main-classification>
        <further-classification edition="200601120250110B">G01R19/165</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑澤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SISSCA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪光夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUANG-SHIAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種雜訊限制電壓之檢測方法，其應用於一檢測電路檢測一印刷電路板，本發明之雜訊限制電壓之檢測方法藉由利用該檢測電路之二探針元件耦接該印刷電路板之線路，依據一雜訊限制參數提供一測試電源至該印刷電路板之線路上，而產生對應之一測試訊號。如此即可利用該雜訊限制參數客製化檢測該印刷電路板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method for detecting voltage with noise limitation, which is applied for a detection circuit detecting a print circuit board (PCB). The method for detecting voltage with noise limitation according to the present invention, firstly using two probes of the detection circuit coupling to a circuit on the PCB, and then providing a test power to the circuit of the PCB according to a noise limitation parameter. A corresponded test signal is generated. Thus, the customized characteristic of the detection circuit for detecting the PCB may be provide by using the noise limitation parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10-S30:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="227" publication-number="202617599">
    <tif-files tif-type="multi-tif">
      <tif file="113139853.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617599</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳化鈮-還原氧化石墨烯氣凝膠複合材料製成之電化學感測器及其應用</chinese-title>
        <english-title>ELECTROCHEMICAL SENSOR PREPARED FROM NIOBIUM CARBIDE-REDUCED GRAPHENE OXIDE AEROGEL COMPOSITE MATERIAL AND ITS UTILIZATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250402B">C01B32/198</main-classification>
        <further-classification edition="201701120250402B">C01B32/90</further-classification>
        <further-classification edition="200601120250402B">B01J13/00</further-classification>
        <further-classification edition="200601120250402B">G01N27/30</further-classification>
        <further-classification edition="200601120250402B">G01N33/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華國媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWA, KUO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種複合材料NC/rGO-A，其包含碳化鈮（NC）及還原氧化石墨烯氣凝膠（rGO-A），設計用以修飾在網版印刷碳電極（SPCE）上。亦提供一種具有極佳導電性之NC/rGO-A-修飾SPCE（NC/rGO-A/SPCE）。此修飾電極對於檢測污水樣品中之有機污染物高度有效，並確保高的重複性、再現性及穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a composite material NC/rGO-A, comprising niobium carbide (NC) and reduced graphene oxide aerogel (rGO-A), designed for modification onto a screen-printed carbon electrode (SPCE). Also provided is an NC/rGO-A-modified SPCE (NC/rGO-A/SPCE) with excellent electrical conductivity. This modified electrode is highly effective for detection of organic pollutants in a contaminated water sample, ensuring high repeatability, reproducibility, and stability.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="228" publication-number="202618673">
    <tif-files tif-type="multi-tif">
      <tif file="113139854.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能教學系統及其實施方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241028B">G06Q50/20</main-classification>
        <further-classification edition="201901120241028B">G06F16/31</further-classification>
        <further-classification edition="200601120241028B">G09B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬里遊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種智能教學系統及其實施方法，其主要由一學生端資訊裝置，分別與一伺服器、一教學平台完成資訊連結後，於一直播教學模組中輸入一問題指令，使一第一模型可對其分析後生成一初步回答結果，再輸入至一第二模型進行檢索增強，以取得一檢索結果，同時將兩者結果融合，以生成一最優回答結果，藉此優化模型回答的準確率；較佳地，本發明更能以一弱點分析模組分析學生成績、學習歷程後，生成一優劣分析結果，再以一個性化學習模組生成一學習建議報告，以強化針對性學習、及學習效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:智能教學系統</p>
        <p type="p">11:伺服器</p>
        <p type="p">12:教學平台</p>
        <p type="p">111:-央處理模組</p>
        <p type="p">121:直播教學模組</p>
        <p type="p">112:對抗式訓練模組</p>
        <p type="p">122:學習評估模組</p>
        <p type="p">1121:出題機器人</p>
        <p type="p">1122:解題機器人</p>
        <p type="p">113:自然語言處理模組</p>
        <p type="p">1131:第一模型</p>
        <p type="p">1132:第二模型</p>
        <p type="p">114:弱點分析模組</p>
        <p type="p">115:個性化學習模組</p>
        <p type="p">116:知識資料庫</p>
        <p type="p">117:題型資料庫</p>
        <p type="p">118:學生訊息資料庫</p>
        <p type="p">13:教師端資訊裝置</p>
        <p type="p">14:學生端資訊裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="229" publication-number="202619382">
    <tif-files tif-type="multi-tif">
      <tif file="113139855.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139855</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多頻段客戶端的網路漫遊方法、電子裝置及儲存媒體</chinese-title>
        <english-title>NETWORK ROAMING METHOD FOR MULTI-BAND TERMINALS, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250203B">H04W36/08</main-classification>
        <further-classification edition="200901120250203B">H04W36/14</further-classification>
        <further-classification edition="200901120250203B">H04W36/24</further-classification>
        <further-classification edition="200901120250203B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李添祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TIAN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多頻段客戶端的網路漫遊方法、電子裝置及儲存媒體。一多頻段客戶連線至一第一多頻段基地台，當該第一多頻段基地台判斷與該多頻段客戶端之間的訊號強度之一變動程度符合一重新掃描閥值時，該第一多頻段基地台與一第二多頻段基地台相互傳送該多頻段客戶端的訊號強度資訊。當該第一多頻段基地台判斷該多頻段客戶端與一第二多頻段基地台之間有至少一個頻段發生訊號切換操作，該第一多頻段基地台與該第二多頻段基地台互相傳送該多頻段客戶端的連線資訊，其中，該多頻段客戶端之至少一個頻段連線到該第二多頻段基地台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network roaming method for multi-band terminals and an electronic device and a storage medium using the method are disclosed. A multi-band client connects to a first multi-band AP. When the first multi-band AP determines that a variation degree of a signal strength between the first multi-band AP and the multi-band client meets a rescanning threshold, the first multi-band AP and a second multi-band base station transmit to each other signal strength information of the multi-band client. When the first multi-band AP determines that a signal switching operation occurs in at least one frequency band between the multi-band client and a second multi-band AP, the first multi-band AP and the second multi-band AP transmit connection information of the multi-band client to each other that at least one frequency band of the multi-band client is connected to the second multi-band AP.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S113:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="230" publication-number="202618571">
    <tif-files tif-type="multi-tif">
      <tif file="113139861.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊介面電路及其通訊方法</chinese-title>
        <english-title>COMMUNICATION INTERFACE CIRCUIT AND COMMUNICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">G06F13/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇映華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊介面電路。主端計數電路的每一計數子電路記錄執行完成對應主端裝置先前的請求指令所需的主端計數時間。從端計數電路的每一者記錄執行完成對應從端裝置先前的回應指令所需的從端計數時間。第一確定電路在確定來源主端計數電路存在處於空閒狀態的計數子電路時產生第一確定結果。第二確定電路在確定來源主端計數電路每一處於非空閒狀態的計數子電路記錄的主端計數時間與目標從端計數電路記錄的從端計數時間之間的絕對差值不小於突發時長時產生第二確定結果。控制電路根據第一以及第二確定結果將當下請求指令發送至仲裁電路進行仲裁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication interface circuit is provided. Each of counting sub-circuits of a master counting circuit documents a master counting time required to finish executing a previous requesting command of a corresponding master device. Each of slave counting circuits documents a slave counting time required to finish executing a previous responding command of a corresponding slave device. A first confirming circuit generates a first confirming result after confirming that a source master counting circuit has a counting sub-circuit that is at an available state. A second confirming circuit generates a second confirming result after confirming that an absolute difference between a master counting time documented by each of the counting sub-circuits of the source master counting circuit that is at an unavailable state and a slave counting time documented by a target slave counting circuit is not smaller than a burst length. A control circuit delivers a current requesting command to an arbitration circuit to perform arbitration according to the first confirming result and the second confirming result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130:通訊介面電路</p>
        <p type="p">200A~200D:主端計數電路</p>
        <p type="p">210A~210D:從端計數電路</p>
        <p type="p">220:控制電路</p>
        <p type="p">230:第一確定電路</p>
        <p type="p">240:第二確定電路</p>
        <p type="p">250:仲裁電路</p>
        <p type="p">260:計數值更新電路</p>
        <p type="p">270A~270D:計數子電路</p>
        <p type="p">AR:回饋信號</p>
        <p type="p">BUL:突發時長</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">CMD:當下請求指令</p>
        <p type="p">MA~MD:主端計數時間</p>
        <p type="p">SA~SD:從端計數時間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="231" publication-number="202618325">
    <tif-files tif-type="multi-tif">
      <tif file="113139862.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電流檢測裝置</chinese-title>
        <english-title>CURRENT DETECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250501B">G01R31/52</main-classification>
        <further-classification edition="200601120250501B">G01R19/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李偉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳琪文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種電流檢測裝置，用於檢測伺服器、電源單元或機架母線的介面是否漏電，電流檢測裝置包括：第一介面、第二介面、連接片組及電流檢測器，第一介面不同於第二介面，用於連接不同的伺服器、電源單元或機架母線的介面；連接片組連接於第一介面與第二介面之間，用於傳導第一介面或第二介面的電流；電流檢測器設置於第一介面與第二介面之間，連接片組穿過電流檢測器，電流檢測器用於檢測連接片組傳導的電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A current detection device configured to detect whether there is a current leaking in a server, a power shelf, or a rack busbar. The current detection device includes a first connector, a second connector, a connecting group, and a current detector. The first connector is different from the second connector, the first connector and the second connector are configured to connect to different connectors of the server, the power shelf, or the rack busbar. The connecting group is connected between the first connector and the second connector, the connecting group is configured to conduct current from the first connector and the second connector. The current detector is arranged between the first connector and the second connector, the connecting group passes through the current detector, the current detector is configured to detect the current conducted on the connecting group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電流檢測裝置</p>
        <p type="p">10:第一介面</p>
        <p type="p">20:第二介面</p>
        <p type="p">30:連接片組</p>
        <p type="p">32:正極連接片</p>
        <p type="p">34:負極連接片</p>
        <p type="p">40:電流檢測器</p>
        <p type="p">50:殼體</p>
        <p type="p">52:容置空間</p>
        <p type="p">60:散熱器</p>
        <p type="p">72:第一訊號接頭</p>
        <p type="p">74:第二訊號接頭</p>
        <p type="p">76:第一電源接頭</p>
        <p type="p">78:第二電源接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="232" publication-number="202617210">
    <tif-files tif-type="multi-tif">
      <tif file="113139864.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生電刺激處方的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR GENERATING ELECTRICAL STIMULATION PRESCRIPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250110B">A61N1/36</main-classification>
        <further-classification edition="201801120250110B">G16H20/30</further-classification>
        <further-classification edition="201801120250110B">G16H80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高登智慧科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDEN SMART HOME TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉方正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林川峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊東戍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TUNG-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電刺激處方產生方法及系統，包括：藉由生成式人工智慧模組取得針對目標患者所設計的專屬電刺激處方及目標患者執行專屬電刺激處方的反饋資訊；藉由生成式人工智慧模組基於反饋資訊及自處方資料庫的複數個電刺激處方中所找出的至少一個參考電刺激處方來調整專屬電刺激處方，並產生新專屬電刺激處方；藉由處方編輯模組於醫師操作端呈現新專屬電刺激處方以供確認及/或編輯；以及藉由處方編輯模組接收醫師操作端針對新專屬電刺激處方的確認資訊，並提供新專屬電刺激處方供目標患者執行電刺激治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a method and a system for generating an electrical stimulation prescription, including: obtaining, by a generative artificial intelligence module, an exclusive electrical stimulation prescription designed for a target patient and the target patient’s feedback for executing the exclusive electrical stimulation prescription; adjusting, by the generative artificial intelligence module, the exclusive electrical stimulation prescription based on the feedback and at least one reference electrical stimulation prescription retrieved from a plurality of electrical stimulation prescriptions in a prescription database, so as to generate a new exclusive electrical stimulation prescription; displaying, by a prescription editing module, the new exclusive electrical stimulation prescription on a doctor’s operating terminal for confirmation and/or editing; and by the prescription editing module, receiving confirmation information of the new exclusive electrical stimulation prescription from the doctor’s operating terminal and providing the new exclusive electrical stimulation prescription to the target patient for performing electrical stimulation treatment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電刺激處方產生系統</p>
        <p type="p">10:處方資料庫</p>
        <p type="p">20:生成式人工智慧模組</p>
        <p type="p">30:處方編輯模組</p>
        <p type="p">A:醫師操作端</p>
        <p type="p">B:患者操作端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="233" publication-number="202619334">
    <tif-files tif-type="multi-tif">
      <tif file="113139865.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機密文件傳送系統及其方法</chinese-title>
        <english-title>CONFIDENTIAL DOCUMENT TRANSMISSION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04N1/44</main-classification>
        <further-classification edition="200601120250203B">H04N1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東友科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECO IMAGE SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種機密文件傳送系統及其方法，方法包括步驟：(a)掃描者通過事務機輸入收件者電子郵件信箱；(b)掃描者通過事務機掃描文件，並將文件傳送至雲端空間位址；(c)事務機基於雲端空間位址產生位址QR-CODE，並將位址QR-CODE傳送至收件者電子郵件信箱；(d) 事務機基於掃描的文件產生密碼QR-CODE，並輸出密碼QR-CODE； (e)掃描者將密碼QR-CODE傳送至收件者電子郵件信箱；以及(f)收件者電子郵件信箱的收件者根據位址QR-CODE登入至雲端空間位址，並根據密碼QR-CODE取用文件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A confidential document transmission system and a method thereof are disclosed. The method includes the steps of: (a) the scanner inputting a recipient's email mailbox through the transaction machine; (b) the scanner scanning a document through the transaction machine and transmitting the document to a cloud space address; (c) the transaction machine generating an address QR-CODE based on the cloud space address, and sending the address QR-CODE to the recipient's email mailbox; (d) the transaction machine generating a password QR-CODE based on the document scanned, and outputting the password QR-CODE; (e) the scanner sending the password QR-CODE to the recipient’s email mailbox; and (f) a recipient of the recipient's email mailbox logging in to the cloud space address according to the address QR-CODE, and accessing the document according to the password QR-CODE.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機密文件傳送系統</p>
        <p type="p">11:掃描器</p>
        <p type="p">12:QR-CODE產生器</p>
        <p type="p">13:機密文件掃描功能按盤</p>
        <p type="p">2:雲端儲存空間</p>
        <p type="p">20:雲端空間位址</p>
        <p type="p">3:事務機</p>
        <p type="p">8:掃描者</p>
        <p type="p">9:收件者</p>
        <p type="p">QR&lt;sub&gt;AD&lt;/sub&gt;:位址QR-CODE</p>
        <p type="p">QR&lt;sub&gt;PW&lt;/sub&gt;:密碼QR-CODE</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="234" publication-number="202619385">
    <tif-files tif-type="multi-tif">
      <tif file="113139868.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於無線存取技術選擇的方法、用戶設備和基地台</chinese-title>
        <english-title>METHOD, USER EQUIPMENT, BASE STATION FOR RADIO ACCESS TECHNOLOGY SELECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250203B">H04W48/08</main-classification>
        <further-classification edition="200901120250203B">H04W88/08</further-classification>
        <further-classification edition="200901120250203B">H04W60/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王詩婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范育維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YU WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於無線存取技術選擇的方法、用戶設備和基地台。方法包含：接收對應於基地台的系統資訊區塊，其中系統資訊區塊包含指示符；以及根據指示符用第一無線存取技術與第二無線存取技術的其中之一存取網路，其中第二無線存取技術與第一無線存取技術相異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, a user equipment, and a base station for radio access technology selection are provided. The method includes: receiving a system information block corresponding to a base station, wherein the system information block includes an indicator; accessing a network by one of a first radio access technology and a second radio access technology according to the indicator, wherein the second radio access technology is different from the first radio access technology.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1201,S1202:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="235" publication-number="202619454">
    <tif-files tif-type="multi-tif">
      <tif file="113139870.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139870</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伺服器機櫃</chinese-title>
        <english-title>SERVER CABINET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H05K7/20</main-classification>
        <further-classification edition="200601120250102B">H05K7/14</further-classification>
        <further-classification edition="200601120250102B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技鋼科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聶　瀚明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALBANDIAN ABHAR, HAMID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種伺服器機櫃，適於連接一液冷系統。伺服器機櫃包括一櫃體、一熱交換器、至少兩個伺服器架、兩個隔板、一第一風扇組件以及一第二風扇組件。櫃體具有一內部空間，其中內部空間為密閉空間。熱交換器設置在內部空間，並具有相對的一第一端與一第二端。至少兩個伺服器架分別設置在熱交換器的相對兩側，並具有個多個熱源。兩個隔板分別設置在至少兩個伺服器架的其中一個與熱交換器之間。第一風扇組件設置在第一端，並產生一氣流，其中氣流往至少兩個伺服器架的方向流動。第二風扇組件設置在第二端，其中氣流藉由第二風扇組件流入熱交換器內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A server cabinet is suitable for connecting to a liquid cooling system. The server cabinet includes a cabinet body, a heat exchanger, at least two sever racks, two insulated dividers, a first fan assembly and a second fan assembly. The cabinet body includes an inner space, wherein the inner space is a closed space. The heat exchanger is disposed in the inner space which includes a first end and a second end opposites to each other. The at least two server racks are respectively disposed on opposite sides of the heat exchanger and have multiple heat sources. The two insulated dividers are respectively disposed between one of the at least two server racks and the heat exchanger. The first fan assembly is disposed at the first end and generates an air flow, wherein the air flow flows in the direction of the at least two server racks. The second fan assembly is disposed at the second end, and the air flow flows into the heat exchanger through the second fan assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伺服器機櫃</p>
        <p type="p">110:櫃體</p>
        <p type="p">111:內部空間</p>
        <p type="p">120:熱交換器</p>
        <p type="p">120a:第一端</p>
        <p type="p">120b:第二端</p>
        <p type="p">121:熱交換管</p>
        <p type="p">122:冷卻管組</p>
        <p type="p">130:伺服器架</p>
        <p type="p">131:伺服器</p>
        <p type="p">140:隔板</p>
        <p type="p">150:第一風扇組件</p>
        <p type="p">160:第二風扇組件</p>
        <p type="p">200:液冷系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="236" publication-number="202618572">
    <tif-files tif-type="multi-tif">
      <tif file="113139877.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可攜式電子裝置及其傳輸控制方法</chinese-title>
        <english-title>PORTABLE ELECTRONIC DEVICE AND TRANSMISSION CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F13/38</main-classification>
        <further-classification edition="200601120250203B">G06F1/26</further-classification>
        <further-classification edition="202301120250203B">H04N23/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神基科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MING-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種可攜式電子裝置及其傳輸控制方法。可攜式電子裝置包括傳輸介面、電源管理電路、切換電路及控制電路。電源管理電路偵測傳輸介面連接的外部裝置為供電裝置或受電裝置。控制電路根據電源管理電路的偵測結果控制切換電路。當控制電路控制切換電路選擇第一傳輸通道與傳輸介面導通時，控制電路透過第一傳輸通道輸出裝置識別訊號以辨識傳輸介面連接的外部裝置。當外部裝置可被裝置識別訊號成功識別時，控制電路透過第一傳輸通道接收外部裝置的影像訊號。當外部裝置無法被裝置識別訊號識別時，控制電路控制切換電路選擇第二傳輸通道與傳輸介面導通，控制電路透過第二傳輸通道與外部裝置進行訊號傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A portable electronic device and a transmission control method are provided. The portable electronic device includes a transmission interface, a power management circuit, a switching circuit, and a control circuit. The power management circuit detects an external device connected to the transmission interface. The control circuit controls the switching circuit according to the detection results of the power management circuit. When the control circuit controls the switching circuit to select a first transmission channel and conducts with the transmission interface, the control circuit transmits a recognition signal through the first transmission channel to identify the external device. When the external device can be successfully identified by the recognition signal, the control circuit receives an image signal of the external device through the first transmission channel. When the external device cannot be identified by the recognition signal, the control circuit controls the switching circuit to select a second transmission channel to be connected with the transmission interface, and the control circuit transmits a signal with the external device through the second transmission channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可攜式電子裝置</p>
        <p type="p">10:控制電路</p>
        <p type="p">101:第一傳輸介面</p>
        <p type="p">102:第二傳輸介面</p>
        <p type="p">12:切換電路</p>
        <p type="p">14:電源管理電路</p>
        <p type="p">16:傳輸介面</p>
        <p type="p">18:數位影像接收晶片</p>
        <p type="p">C1:第一傳輸通道</p>
        <p type="p">C2:第二傳輸通道</p>
        <p type="p">21:第一傳輸路徑</p>
        <p type="p">22:第二傳輸路徑</p>
        <p type="p">23:第三傳輸路徑</p>
        <p type="p">24:第四傳輸路徑</p>
        <p type="p">CC:溝通接腳</p>
        <p type="p">P1:電源傳輸匯流排</p>
        <p type="p">3:外部裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="237" publication-number="202617697">
    <tif-files tif-type="multi-tif">
      <tif file="113139882.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、絕緣膜、印刷電路板與半導體裝置</chinese-title>
        <english-title>RESIN COMPOSITION, INSULATING FILM, PRINTED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">C07D251/24</main-classification>
        <further-classification edition="200601120241101B">C08J5/18</further-classification>
        <further-classification edition="200601120241101B">H05K1/03</further-classification>
        <further-classification edition="200601120241101B">C08L25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶化科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAFERCHEM TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王品勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PIN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳燈桂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TENG-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭亦傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林岳霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUEH-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱振雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHEN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種樹脂組成物，包含一樹脂以及一三嗪化合物。三嗪化合物具有如式(I)所示的一結構，式(I)中各符號如說明書中所定義者。藉此，可以提升樹脂組成物的金屬附著力並降低其介電損耗係數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to the present disclosure, a resin composition includes a resin and a triazine compound. The triazine compound has a structure represented by formula (I), of which each symbol is defined in the specification. Therefore, the adhesion between the resin composition and metal can be improved and the dielectric loss coefficient thereof can be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="238" publication-number="202617656">
    <tif-files tif-type="multi-tif">
      <tif file="113139883.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無規共聚物</chinese-title>
        <english-title>RANDOM COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">C07C49/84</main-classification>
        <further-classification edition="200601120241104B">C08F2/50</further-classification>
        <further-classification edition="200601120241104B">C08F220/06</further-classification>
        <further-classification edition="200601120241104B">C08F220/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德淵企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEX YEAR INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭玉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張義正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">無規共聚物係由親水性單體、軟鏈段單體、硬鏈段單體、與光起始劑共聚而成。親水性單體與軟鏈段單體的莫耳比為100:1300至100:1700，親水性單體與硬鏈段單體的莫耳比為100:400至100:700，且親水性單體與光起始劑的莫耳比為100:3至100:12。光起始劑的化學結構為        &lt;img align="absmiddle" height="120px" width="231px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A random copolymer is formed by copolymerizing a hydrophilic monomer, a soft segment monomer, a hard segment monomer, and a photoinitiator. The hydrophilic monomer and the a soft segment monomer have a molar ratio of 100:1300 to 100:1700, the hydrophilic monomer and the hard segment monomer have a molar ratio of 100:400 to 100:700, and the hydrophilic monomer and the photoinitiator have a molar ratio of 100:3 to 100:12, The photoinitiator has a chemical structure of        &lt;img align="absmiddle" height="124px" width="231px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="239" publication-number="202617802">
    <tif-files tif-type="multi-tif">
      <tif file="113139887.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光起始劑與無規共聚物</chinese-title>
        <english-title>PHOTOINITIATOR AND RANDOM COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241025B">C08F220/10</main-classification>
        <further-classification edition="200601120241025B">C07D335/16</further-classification>
        <further-classification edition="200601120241025B">C08F2/48</further-classification>
        <further-classification edition="200601120241025B">C09J133/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德淵企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEX YEAR INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭玉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張義正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">無規共聚物係由親水性單體、軟鏈段單體、硬鏈段單體、與光起始劑共聚而成。親水性單體與軟鏈段單體的莫耳比為100:1300至100:1600，親水性單體與硬鏈段單體的莫耳比為100:400至100:700，且親水性單體與光起始劑的莫耳比為100:3至100:12。光起始劑的化學結構為        &lt;img align="absmiddle" height="87px" width="225px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A random copolymer is formed by copolymerizing a hydrophilic monomer, a soft segment monomer, a hard segment monomer, and a photoinitiator. The hydrophilic monomer and the a soft segment monomer have a molar ratio of 100:1300 to 100:1600, the hydrophilic monomer and the hard segment monomer have a molar ratio of 100:400 to 100:700, and the hydrophilic monomer and the photoinitiator have a molar ratio of 100:3 to 100:12, The photoinitiator has a chemical structure of        &lt;img align="absmiddle" height="90px" width="231px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="240" publication-number="202617358">
    <tif-files tif-type="multi-tif">
      <tif file="113139902.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手工具套合部結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25B13/02</main-classification>
        <further-classification edition="200601120241204B">B25B13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穩陞工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖嘉冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種手工具套合部結構，其係包括：一本體係設有一套合部，該套合部係包括有三個第一驅動部、三個第二驅動部及六個容置部，三個該第一驅動部及三個該第二驅動部呈間隔環狀排列，每一該容置部係設於該第一驅動部及該第二驅動部之間；每一該第一驅動部包括一第一面、一第二面及一第一交線；該第一驅動部係設有一第一凹槽及一第二凹槽；每一該第二驅動部係設有一第三面；以二維方式，該套合部設有一第一圓心、一第一圓及一第一六邊形，每一該第一面係與該第一圓呈相切狀，每一該第一面係與該第一六邊形之每一邊面相重合。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:套合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="241" publication-number="202617364">
    <tif-files tif-type="multi-tif">
      <tif file="113139903.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扳手結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241225B">B25B13/46</main-classification>
        <further-classification edition="200601120241225B">B25B23/16</further-classification>
        <further-classification edition="200601120241225B">B29C45/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穩陞工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖嘉冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種扳手結構，其係包括：一本體設有一驅動部、一握把部、一第一面、一第二面及一容置槽；一握把件容設於該容置槽內，該握把件為射出成型後再組設於該容置槽處；該握把件內部設有一第一槽及一第二槽，該握把件組設於該容置槽後，該第一槽與該第二槽隱於該容置槽內，亦即由該扳手結構外觀無法看到該第一槽與該第二槽；該第一槽及該第二槽為射出成型時具可脫模結構，該第一槽及該第二槽使該握把件具有較少材料，該握把件成型後，該第一槽及該第二槽會使該握把件具有更短之冷卻時間，該握把件之縮水狀態即可大幅降低。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:驅動部</p>
        <p type="p">12:握把部</p>
        <p type="p">121:第一面</p>
        <p type="p">122:第二面</p>
        <p type="p">13:容置槽</p>
        <p type="p">14:柄部</p>
        <p type="p">20:握把件</p>
        <p type="p">21:第三面</p>
        <p type="p">22:第四面</p>
        <p type="p">23:第一槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="242" publication-number="202619570">
    <tif-files tif-type="multi-tif">
      <tif file="113139904.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619570</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D86/00</main-classification>
        <further-classification edition="202501120250102B">H10D84/03</further-classification>
        <further-classification edition="200601120250102B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DA-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施易安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馥郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, FU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡濱祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, BIN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包含SOI基板，其具有基底板、位於基底板上的埋入氧化物層以及位於埋入氧化物層上的元件層；電路元件，配置於元件層上且被SOI基板中的溝槽隔離區圍繞；蝕刻停止層，設置於電路元件周圍；第一介電層，設置於蝕刻停止層上；以及埋入電源軌，嵌入在第一介電層、蝕刻停止層、溝槽隔離區和埋入氧化物層中。埋入電源軌透過埋入氧化物層和溝槽隔離區的溝槽填充氧化物與元件層隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes an SOI substrate having a base substrate, a buried oxide layer on the base substrate, and a device layer on the buried oxide layer; a circuit element disposed on the device layer and surrounded by a trench isolation region in the SOI substrate; an etch stop layer disposed around the circuit element; a first dielectric layer disposed on the etch stop layer; and a buried power rail embedded in the first dielectric layer, the etch stop layer, the trench isolation region, and the buried oxide layer. The buried power rail is isolated from the device layer through the buried oxide layer and trench fill oxide in the trench isolation region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:矽覆絕緣基板</p>
        <p type="p">110:主動區域</p>
        <p type="p">111:基底板</p>
        <p type="p">112:埋入氧化物層</p>
        <p type="p">113:元件層</p>
        <p type="p">120:溝槽填充氧化物</p>
        <p type="p">210:閘極氧化層</p>
        <p type="p">220:高介電常數(high-k)材料層</p>
        <p type="p">230:阻障層</p>
        <p type="p">242:功函數金屬</p>
        <p type="p">244:體金屬層屬</p>
        <p type="p">260:硬遮罩層</p>
        <p type="p">280:蝕刻停止層</p>
        <p type="p">310:介電層</p>
        <p type="p">320:介電層</p>
        <p type="p">400:導電層</p>
        <p type="p">420:氧化物襯墊層</p>
        <p type="p">BPR:埋入電源軌</p>
        <p type="p">D:電路元件</p>
        <p type="p">DP:虛設閘極結構</p>
        <p type="p">DPR:虛設多晶矽軌</p>
        <p type="p">DR:摻雜區</p>
        <p type="p">IT:溝槽隔離區</p>
        <p type="p">LI:區域內連線</p>
        <p type="p">MG:金屬閘極</p>
        <p type="p">PT:溝槽</p>
        <p type="p">T:溝槽</p>
        <p type="p">TG:閘極溝槽</p>
        <p type="p">TSV:穿板通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="243" publication-number="202617357">
    <tif-files tif-type="multi-tif">
      <tif file="113139906.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139906</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扳手結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241113B">B25B13/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余廷和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余廷和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種扳手結構，其係包括：一本體係設有一第一樞部、一容蓋槽及一第一套合部，該第一套合部係連通該容蓋槽；一蓋體組設於該容蓋槽處；一第一工具件係為一具有正逆轉旋動之棘輪結構或單向旋動之棘輪結構，或各有棘輪功效或無棘輪功效之結構之各驅動頭，該第一工具件一端係設有一第二樞部以與該第一樞部相樞設，該第一工具件另端係設有一第二套合部；一結合件穿設於該第一樞部與該第二樞部內，使該第一工具件樞設於該本體上；一第二工具件為一具四角頭之方桿工具，該第二工具件另端設有一第三套合部以套設於該第一套合部處。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:第一樞部</p>
        <p type="p">111:第一樞槽</p>
        <p type="p">112:樞孔</p>
        <p type="p">12:容蓋槽</p>
        <p type="p">121:第一凹槽</p>
        <p type="p">122:第二凹槽</p>
        <p type="p">13:第一套合部</p>
        <p type="p">131:第一套合槽</p>
        <p type="p">132:第二套合槽</p>
        <p type="p">20:蓋體</p>
        <p type="p">21:第一塊體</p>
        <p type="p">22:第二塊體</p>
        <p type="p">30:磁性體</p>
        <p type="p">40:第一工具件</p>
        <p type="p">41:第二樞部</p>
        <p type="p">42:第二套合部</p>
        <p type="p">50:結合件</p>
        <p type="p">60:第二工具件</p>
        <p type="p">61:第三套合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="244" publication-number="202619455">
    <tif-files tif-type="multi-tif">
      <tif file="113139912.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋁均溫板裝置</chinese-title>
        <english-title>ALUMINUM VAPOR CHAMBER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">H05K7/20</main-classification>
        <further-classification edition="200601120241223B">F28F3/02</further-classification>
        <further-classification edition="200601120241223B">F28D15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王訓忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, SHWIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋁均溫板裝置，包括第一板體、第二板體、多個側壁及多個支撐條。第二板體位於第一板體上方。這些側壁連接於第一板體與第二板體，而與第一板體與第二板體共同圍繞出內部空間。這些支撐條沿著第一方向並排地設置於內部空間，沿著第二方向延伸，且連接第一板體與第二板體，以將內部空間區分成多個通道，這些支撐條的每一者包括多個第一孔洞，以使這些通道連通。第一板體包括位於這些通道內且沿著第二方向延伸的多條第一溝槽，第二板體包括位於這些通道內且沿著第二方向延伸的多條第二溝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aluminum vapor chamber device includes a first plate body, a second plate body, side walls and support bars. The second plate body is located above the first plate body. The side walls are connected to the first plate body and the second plate body, and an internal space is surrounded by the first plate body, the second plate body and the side walls. The support bars are arranged side by side in the internal space along a first direction, extend along a second direction, and connect the first plate body and the second plate body to divide the internal space into channels. Each of the support bars include first holes to communicate with the channels. The first plate body includes first grooves located in the channels and extending along the second direction. The second plate body includes second grooves located in the channels and extending along the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">S:內部空間</p>
        <p type="p">S1:通道</p>
        <p type="p">X1、X2:距離</p>
        <p type="p">10:熱源</p>
        <p type="p">100:鋁均溫板裝置</p>
        <p type="p">130:側壁</p>
        <p type="p">131:第一側壁</p>
        <p type="p">132:第二側壁</p>
        <p type="p">133:第三側壁</p>
        <p type="p">134:真空注液孔</p>
        <p type="p">135:封閉管</p>
        <p type="p">136:第二孔洞</p>
        <p type="p">137:內填件</p>
        <p type="p">138:第四側壁</p>
        <p type="p">140:支撐條</p>
        <p type="p">142:第一孔洞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="245" publication-number="202618640">
    <tif-files tif-type="multi-tif">
      <tif file="113139915.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>汽車事故折損鑑價系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241127B">G06Q30/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種汽車事故折損鑑價系統及其方法，該汽車事故折損鑑價系統，包含申請裝置、事故報告與資料蒐集裝置、資料庫、車輛初步折損報價裝置與鑑價報告撰寫裝置；其中，事故報告與資料蒐集裝置訊號連接申請裝置；資料庫訊號連接事故報告與資料蒐集裝置；車輛初步折損報價裝置訊號連接事故報告與資料蒐集裝置；鑑價報告撰寫裝置訊號連接車輛初步折損報價裝置。本發明係透過多個裝置之間的配合，以得到受損車輛鑑價方面的公正性與準確性，藉以避免人為的鑑價疏失；並且亦可提供相關線上鑑價，以及相關的後續協助，以讓使用者獲得最佳的鑑定報告與後續協助。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:申請裝置</p>
        <p type="p">11:事故報告與資料蒐集裝置</p>
        <p type="p">110:事故維修單索取單元</p>
        <p type="p">111:事故現場照片蒐集單元</p>
        <p type="p">112:車輛基本資料蒐集單元</p>
        <p type="p">113:已鑑價單元</p>
        <p type="p">114:維修照確認單元</p>
        <p type="p">115:原廠維修估價單確認單元</p>
        <p type="p">12:資料庫</p>
        <p type="p">13:車輛初步折損報價裝置</p>
        <p type="p">130:車價調查單元</p>
        <p type="p">131:折損率初估計算單元</p>
        <p type="p">14:鑑價報告撰寫裝置</p>
        <p type="p">140:資料整理單元</p>
        <p type="p">141:報告撰寫單元</p>
        <p type="p">142:審核單元</p>
        <p type="p">15:報告交付裝置</p>
        <p type="p">150:報告提交單元</p>
        <p type="p">151:解釋說明單元</p>
        <p type="p">152:引薦線上律師單元</p>
        <p type="p">16:後續跟進裝置</p>
        <p type="p">160:最後求償金額詢問單元</p>
        <p type="p">161:是否給予案例分享單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="246" publication-number="202617497">
    <tif-files tif-type="multi-tif">
      <tif file="113139919.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>依據量測體重進行是否補水之自行車系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241204B">B62J50/22</main-classification>
        <further-classification edition="202001120241204B">B62J45/416</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種依據量測體重進行是否補水之自行車系統，包含一自行車、一下壓組件、一荷重組件與一控制組件。該自行車上設置有一固定桿，該固定桿內設置一活動桿，該活動桿上端設置一乘坐部。該下壓組件係設置在該活動桿上，其具有一下壓件。該荷重組件係設置在該固定桿上，其具有一應變器，該應變器係對應設置在該下壓件下方的位置。該控制組件則係設置於該自行車上。當騎乘者坐於該乘坐部，使該下壓件隨該活動桿下壓於該應變器上，使該應變器產生一訊號，該控制組件則可將該訊號轉換為體重值並在一螢幕顯示，藉由該體重值的變化，可做為判斷是否進行補水之依據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自行車系統</p>
        <p type="p">20:自行車</p>
        <p type="p">21:車架本體</p>
        <p type="p">22:車把</p>
        <p type="p">23:固定桿</p>
        <p type="p">24:活動桿</p>
        <p type="p">25:乘坐部</p>
        <p type="p">30:下壓組件</p>
        <p type="p">40:荷重組件</p>
        <p type="p">50:控制組件</p>
        <p type="p">501:外殼</p>
        <p type="p">54:按鍵組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="247" publication-number="202618781">
    <tif-files tif-type="multi-tif">
      <tif file="113139920.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體內位元運算電路以及記憶體內位元運算方法</chinese-title>
        <english-title>IN MEMORY BITWISE OPERATION CIRCUIT AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">G11C16/06</main-classification>
        <further-classification edition="200601120250122B">G11C11/54</further-classification>
        <further-classification edition="200601120250122B">G11C7/16</further-classification>
        <further-classification edition="202301120250122B">G06N3/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體內位元運算電路與方法。電路包括：記憶體陣列，具有多個頁資料，各頁資料具有多個串；頁緩衝器，儲存多個串，並從多個串選擇一部分串作為多個運算元；總量計數器，接收多個運算元與運算子旗標，並且基於運算子旗標，將各運算元中位置相應的位元進行位元1的計數，以產生與運算子的位元運算結果；及位元運算處理單元，接收並暫存位元運算結果，並且在接收最終結果旗標時，輸出最終位元運算結果。在運算子為最後運算子時，將位元運算結果作為最終位元運算結果。本發明適於3D NAND快閃記憶體，其具備有高容量與高性能之特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An in-memory bitwise operation circuit and method thereof are provided. The circuit includes a memory array, storing page data each having strings; a page buffer, storing the strings and selecting a portion of the strings as operands; pop-count counter, receiving the operands and an operator flag, counting numbers of bit 1 at corresponding bit positions of the operands, and generating a bitwise operation result corresponding to the operator; bitwise operation processing unit, receiving and temporally storing the bitwise operation result, and outputting a final bitwise operation result when receiving a final result flag. In case that the operator is a last operator, the bitwise operation result is output as the final bitwise operation result. The circuit and method are suitable for 3D NAND flash memory that has high capacity and high performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶內位元運算電路</p>
        <p type="p">102:記憶體陣列</p>
        <p type="p">104:I/O單元</p>
        <p type="p">106A:感測放大器</p>
        <p type="p">106B:頁緩衝器</p>
        <p type="p">108:列解碼器</p>
        <p type="p">110:控制邏輯/狀態機器/電壓產生器</p>
        <p type="p">112:錯誤位元檢測器(總量計數器)</p>
        <p type="p">114:快取記憶體</p>
        <p type="p">120:邏輯操作模式單元</p>
        <p type="p">122:運算元過濾產生器</p>
        <p type="p">124:外部運算元選擇器</p>
        <p type="p">130:位元運算處理單元</p>
        <p type="p">OUT:位元運算輸出</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="248" publication-number="202617006">
    <tif-files tif-type="multi-tif">
      <tif file="113139930.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活動式層架結構</chinese-title>
        <english-title>MOVABLE SHELF STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A47F3/06</main-classification>
        <further-classification edition="201701120250501B">A47B88/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久盛商品陳列架股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEOU SHENG MERCHANDISE FRAME CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種活動式層架結構，包含有：一層架；二支撐架，設於該層架之相對二側；該二支撐架具有二向內延伸之延伸部；一強化件，設於該二支撐架下方，兩端分別連接於該二支撐架之該二延伸部；以及一扳動件，以可活動的方式設於該層架並可受驅動而於一第一位置與一第二位置間移動；當該扳動件移動至該第一位置時，該扳動件至少一部分與該強化件相互干涉，使該層架無法朝遠離該二支撐架之方向移動；當該扳動件移動至該第二位置時，該扳動件脫離該強化件，使該層架可相對該二支撐架移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A movable shelf structure, comprising: A shelf; Two support frames, positioned on opposite sides of the shelf; The two support frames have two extension parts extending inward; A reinforcement member positioned below the two support frames, with both ends respectively connected to the two extension parts of the support frames; And an actuating element, movably positioned on the shelf and driven to move between a first position and a second position; When the actuating element moves to the first position, at least a portion of the actuating element interferes with the reinforcement member, preventing the shelf from moving in a direction away from the two support frames; when the actuating element moves to the second position, the actuating element disengages from the reinforcement member, allowing the shelf to move relative to the two support frames.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:層架</p>
        <p type="p">20:支撐架</p>
        <p type="p">30:強化件</p>
        <p type="p">40:扳動件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="249" publication-number="202618172">
    <tif-files tif-type="multi-tif">
      <tif file="113139942.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧城市路燈控制系統及其路燈控制箱與路燈</chinese-title>
        <english-title>SMART CITY STREETLIGHT CONTROL SYSTEM AND ITS STREETLIGHT CONTROL CABINET AND STREETLIGHTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">F21S13/10</main-classification>
        <further-classification edition="200601120241129B">H02J13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江若滐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JO-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江若滐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JO-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧城市路燈控制系統及其路燈控制箱與路燈，所述路燈控制箱可安裝各種網路設備，並可為各種網路設備提供網路管理、電力管理以及邊緣運算，以滿足智慧城市的建設需求。所提供的路燈控制箱可設置電池模組，以為各種網路設備以及電力迴路提供電力，以符合智慧城市的用電需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart city streetlight control system and its streetlight control cabinet and streetlights are disclosed. The streetlight control cabinet is capable of accommodating various network devices and offering network management, power management, and edge computing capabilities for these devices, thereby meeting the requirements of smart city infrastructure development. The provided streetlight control cabinet can incorporate battery modules to supply power to various network devices and power loops, aligning with the power demands of a smart city.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:路燈控制箱</p>
        <p type="p">11:控制箱本體</p>
        <p type="p">111:箱本體租賃空間</p>
        <p type="p">12:電池模組</p>
        <p type="p">13:電力管理模組</p>
        <p type="p">14:邊緣運算處理模組</p>
        <p type="p">15:網路管理模組</p>
        <p type="p">161:電力交易模組</p>
        <p type="p">162:網路交易模組</p>
        <p type="p">163:箱本體空間租賃模組</p>
        <p type="p">164:箱本體空間管理模組</p>
        <p type="p">1641:箱本體空間溫度調節模組</p>
        <p type="p">1642:箱本體空間濕度調節模組</p>
        <p type="p">165:箱本體光束電力傳輸模組</p>
        <p type="p">1651:箱本體網路設備定位模組</p>
        <p type="p">166:碳權管理模組</p>
        <p type="p">1661:碳權交易模組</p>
        <p type="p">2:管理機房</p>
        <p type="p">3:網路設備</p>
        <p type="p">4:路燈</p>
        <p type="p">41:路燈本體</p>
        <p type="p">411:路燈租賃空間</p>
        <p type="p">42:路燈空間租賃模組</p>
        <p type="p">43:路燈空間管理模組</p>
        <p type="p">431:路燈空間溫度調節模組</p>
        <p type="p">432:路燈空間濕度調節模組</p>
        <p type="p">44:路燈光束電力傳輸模組</p>
        <p type="p">441:路燈網路設備定位模組</p>
        <p type="p">L1:電力迴路</p>
        <p type="p">L2:網路迴路</p>
        <p type="p">S1:邊緣端</p>
        <p type="p">S2:管理端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="250" publication-number="202617190">
    <tif-files tif-type="multi-tif">
      <tif file="113139944.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>診斷非酒精性脂肪肝病之複合物及其用途和造影劑</chinese-title>
        <english-title>COMPLEX FOR DIAGNOSING NON-ALCOHOLIC STEATOHEPATITIS, USE, AND CONTRAST AGENT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61K51/04</main-classification>
        <further-classification edition="201701120241101B">A61K47/54</further-classification>
        <further-classification edition="200601120241101B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于鴻文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王美惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MEI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何宗澧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昆諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹振勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李婉綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WAN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此揭示一種用於診斷非酒精性脂肪肝病之複合物、所述複合物之用途、及包含所述複合物之造影劑。所述用於診斷非酒精性脂肪肝病之複合物具有一六聚乳醣、一金屬螯合劑與六聚乳糖耦接，和一放射線核種標誌於金屬螯合劑上，所述複合物能夠結合至去唾液酸糖蛋白受體上，具有潛力開發成為放射醫學診斷劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are complex for diagnosing non-alcoholic steatohepatitis, use and contrast agent thereof. The complex for diagnosing non-alcoholic steatohepatitis has a hexa-lactoside, a metal chelator coupled to the hexa-lactoside, and a radionuclide labeled on the metal chelator. Moreover, the complex is capable of binding to asialoglycoprotein receptor, so that the complex have potential for use as nuclear imaging agent for diagnosis.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="251" publication-number="202619163">
    <tif-files tif-type="multi-tif">
      <tif file="113139945.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊裝置和通訊方法</chinese-title>
        <english-title>COMMUNICATION DEVICE AND COMMUNICATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H01Q15/00</main-classification>
        <further-classification edition="200601120250203B">H01Q1/38</further-classification>
        <further-classification edition="200601120250203B">H01Q1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊熠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, TA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊裝置，包括一非導電載體和一金屬共振結構，其中金屬共振結構係設置於非導電載體上。金屬共振結構包括：具有相對較大尺寸之複數個第一金屬單元、具有相對中等尺寸之複數個第二金屬單元，以及具有相對較小尺寸之複數個第三金屬單元，其中前述之第二金屬單元係設置於前述之第一金屬單元和前述之第三金屬單元之間。當通訊裝置接收到一射頻信號時，金屬共振結構即可根據射頻信號來產生一反射信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication device includes a nonconductive carrier and a metal resonant structure. The metal resonant structure is disposed on the nonconductive carrier. The metal resonant structure includes a plurality of first metal units with relatively large sizes, a plurality of second metal units with relatively median sizes, and a plurality of third metal units with relatively small sizes. The second metal units are disposed between the first metal units and the third metal units. When the communication device receives an RF (Radio Frequency) signal, the metal resonant structure generates a reflected signal according to the RF signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通訊裝置</p>
        <p type="p">110:非導電載體</p>
        <p type="p">120:金屬共振結構</p>
        <p type="p">131,132,133,134,135,136:第一金屬單元</p>
        <p type="p">141,142,143:第二金屬單元</p>
        <p type="p">151,152,153:第三金屬單元</p>
        <p type="p">DS:間距</p>
        <p type="p">L1,L2,L3:長度</p>
        <p type="p">SF:射頻信號</p>
        <p type="p">SR:反射信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="252" publication-number="202617227">
    <tif-files tif-type="multi-tif">
      <tif file="113139947.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於霹靂舞旋轉訓練的訓練裝置</chinese-title>
        <english-title>TRAINING APPARATUS FOR ROTATIONAL TRAINING IN BREAKDANCING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">A63B23/04</main-classification>
        <further-classification edition="200601120241129B">A63B71/12</further-classification>
        <further-classification edition="200601120241129B">A63B69/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯玠甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHIEH-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯玠甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHIEH-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設計來協助霹靂舞者練習高階旋轉動作的可調整訓練裝置。該訓練裝置包括一個穩固的基座，基座配備多個同心排列的吸盤，以確保訓練裝置在各種表面上使用時的穩定性。從該基座垂直延伸的是一個可伸縮調整的支撐組件，允許進行高度和旋轉半徑的調整，以適應不同尺寸的舞者和特定的訓練需求。安裝於支撐組件頂部的是一個自轉平台，該自轉平台包括一個特殊設計的旋轉環機構，外部被環形罩覆蓋，僅露出面向中心的旋轉環一側，以促進順暢且連續的旋轉。該主要平台整合了一個安全的繫帶系統，為舞者的軀幹提供結構支撐，同時允許四肢自由運動。此外，該訓練裝置的下支撐構件還配備全向輪，能夠在不影響穩定性的情況下輕鬆重新定位裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adjustable training apparatus designed to assist breakdancers in practicing advanced rotational maneuvers is provided. The apparatus includes a stable base equipped with multiple concentric suction cups to ensure stability when used on various surfaces. Extending vertically from the base is a telescopically adjustable support assembly, allowing for height and rotational radius adjustments to accommodate dancers of different sizes and specific training requirements. Mounted atop the support assembly is a primary rotational platform, which features a specially designed rotatable ring mechanism covered by an annular cover, exposing only the side of the rotatable ring facing the center to facilitate smooth and continuous rotation. The primary platform integrates a secure harness system that provides structural support to the dancer’s torso while allowing free movement of the limbs. Additionally, the lower support member of the apparatus is equipped with omni-directional wheels, enabling easy repositioning without compromising stability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訓練裝置</p>
        <p type="p">110:基座</p>
        <p type="p">116:軸承接頭</p>
        <p type="p">120:支撐組件</p>
        <p type="p">122:下支撐框架</p>
        <p type="p">124:全向輪</p>
        <p type="p">126:上支撐構件</p>
        <p type="p">128:第一伸縮管機構</p>
        <p type="p">1282:第一鎖銷</p>
        <p type="p">130:第二伸縮管機構</p>
        <p type="p">140:自轉平台</p>
        <p type="p">150:繫帶系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="253" publication-number="202618508">
    <tif-files tif-type="multi-tif">
      <tif file="113139950.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250219B">G06F1/16</main-classification>
        <further-classification edition="200601120250219B">G06F3/023</further-classification>
        <further-classification edition="200601120250219B">H05K7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝華豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUA-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫惠平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HUI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫峻宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕延洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUEH, YEN-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉繼遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括機體、鎖定結構及鍵盤。鎖定結構可滑動地設置於機體，且具有解鎖槽與連通於解鎖槽的鎖定槽。鍵盤可拆地安裝於機體，其中鍵盤設有插入機體的定位件，且定位件插入解鎖槽或鎖定槽。當鎖定結構相對於定位件滑動並使定位件從解鎖槽移至鎖定槽時，鎖定結構將鍵盤鎖定於機體。當鎖定結構相對於定位件滑動並使定位件從鎖定槽移至解鎖槽時，鎖定結構對鍵盤的鎖定限制被解除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a body, a locking structure, and a keyboard is provided. The locking structure is slidably disposed on the body and has an unlocking slot and a locking slot communicating with the unlocking slot. The keyboard is detachably mounted on the body, wherein the keyboard is provided with a positioning member inserting into the body and the positioning member is inserted into either the unlocking slot or the locking slot. When the locking structure slides relative to the positioning member, moving the positioning member from the unlocking slot to the locking slot, the locking structure locks the keyboard to the body. When the locking structure slides relative to the positioning member, moving the positioning member from the locking slot to the unlocking slot, the locking restriction of the keyboard by the locking structure is released.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:機體</p>
        <p type="p">101:頂部</p>
        <p type="p">102:底部</p>
        <p type="p">1021:內表面</p>
        <p type="p">1022:底表面</p>
        <p type="p">1023:滑槽</p>
        <p type="p">103:內部空間</p>
        <p type="p">104:凹槽</p>
        <p type="p">110:鎖定限位柱</p>
        <p type="p">120:解鎖限位柱</p>
        <p type="p">200:鎖定結構</p>
        <p type="p">201:解鎖槽</p>
        <p type="p">2011:解鎖開口</p>
        <p type="p">202:鎖定槽</p>
        <p type="p">2021:鎖定開口</p>
        <p type="p">210:外部控制件</p>
        <p type="p">211:卡勾</p>
        <p type="p">220:內部鎖定件</p>
        <p type="p">221:鎖定卡合部</p>
        <p type="p">222:解鎖卡合部</p>
        <p type="p">223:卡槽</p>
        <p type="p">300:鍵盤</p>
        <p type="p">301:鍵盤面</p>
        <p type="p">302:底面</p>
        <p type="p">310:定位件</p>
        <p type="p">311:定位頭部</p>
        <p type="p">320:螺絲柱</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="254" publication-number="202618993">
    <tif-files tif-type="multi-tif">
      <tif file="113139951.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬運裝置</chinese-title>
        <english-title>HANDLING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250219B">H01L21/677</main-classification>
        <further-classification edition="200601120250219B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊盛華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊世君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱政勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHENG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種搬運裝置，包括主體、多個距離感測單元、多個受力感測單元、攝像單元以及控制單元。主體具有相對的頂側殼體、底側殼體以及位於頂側殼體與底側殼體之間的容置空間，容置空間用以容納待運送元件。多個距離感測單元用以測量多個距離感測單元與待運送元件的距離以獲得距離資訊。多個受力感測單元用以測量主體的受力以獲得受力資訊。攝像單元用以擷取外界影像以獲得影像資訊。控制單元電性連接於多個距離感測單元、多個受力感測單元以及攝像單元。控制單元依據距離資訊以及受力資訊產生狀態信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handling device including a main body, a plurality of distance sensing units, a plurality of force sensing units, a camera unit and a control unit is provided. The main body has an opposite top side shell, a bottom side shell and an accommodation space located between the top side shell and the bottom side shell. The accommodation space is adapted to accommodate a component to be transported. The plurality of distance sensing units are adapted to measure the distance between the plurality of distance sensing units and the component to be transported to obtain distance information. The plurality of force sensing units are adapted to measure the force of the main body to obtain force information. The camera unit is adapted to capture external images to obtain image information. The control unit is electrically connected to the plurality of distance sensing units, the plurality of force sensing units and the camera unit. The control unit generates status signals based on the distance information and the force information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:待運送元件</p>
        <p type="p">100:搬運裝置</p>
        <p type="p">110:主體</p>
        <p type="p">112:頂側殼體</p>
        <p type="p">114:底側殼體</p>
        <p type="p">116:隔層結構</p>
        <p type="p">120:距離感測單元</p>
        <p type="p">130:受力感測單元</p>
        <p type="p">140:攝像單元</p>
        <p type="p">E:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="255" publication-number="202619220">
    <tif-files tif-type="multi-tif">
      <tif file="113139953.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池結構、通訊組件與電池結構的製造方法</chinese-title>
        <english-title>BATTERY STRUCTURE, COMMUNICATION ASSEMBLY, AND METHOD OF MANUFACTURING BATTERY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02J7/00</main-classification>
        <further-classification edition="200601120241204B">H02J13/00</further-classification>
        <further-classification edition="201501120241204B">H04B1/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>速碼波科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMART APPROACH CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴猷龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YOU LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田文中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池結構，包含一電池單體、一通訊組件以及一包覆層。電池單體具有相對的一正極端子以及一負極端子。通訊組件包含一間隔環以及一射頻標籤。間隔環設置於電池單體具有正極端子之一側，且間隔環具有至少一容置空間。射頻標籤包含一訊號發射元件以及至少一晶片。訊號發射元件呈環形並設置於間隔環遠離電池單體的一側。所述至少一晶片設置於訊號發射元件靠近間隔環之一側且位於所述至少一容置空間內。包覆層包覆於電池單體與通訊組件並暴露正極端子、負極端子的至少部分與訊號發射元件的至少部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery structure includes a cell body, a communication assembly, and a cover layer. The cell body has a positive terminal and a negative terminal that are opposite to each other. The communication assembly includes a spacing ring and a radio frequency tag. The spacing ring is disposed on a side of the cell body where the positive terminal is located, and the spacing ring has at least one accommodation space. The radio frequency tag includes a signal-emitting element and at least one chip. The signal-emitting element is in a ring shape and is disposed on a side of the spacing ring away from the cell body. The at least one chip is disposed on a side of the signal-emitting element close to the spacing ring and is located in the at least one accommodation space. The cover layer covers the cell body and the communication assembly and exposes the positive terminal, at least part of the negative terminal and at least part of the signal-emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池結構</p>
        <p type="p">11:電池單體</p>
        <p type="p">110:縱向方向</p>
        <p type="p">111:正極端子</p>
        <p type="p">112:負極端子</p>
        <p type="p">12:通訊組件</p>
        <p type="p">13:包覆層</p>
        <p type="p">AA:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="256" publication-number="202617373">
    <tif-files tif-type="multi-tif">
      <tif file="113139956.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有組合式磁吸結構之可擴充式工具置放座</chinese-title>
        <english-title>EXPANDABLE TOOL HOLDER WITH COMBINED MAGNETIC SUCTION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">B25H3/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳居亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種具有組合式磁吸結構之可擴充式工具置放座，其特點主要包括：一座體，包括工具置放限位部及二擴充側；二組裝定位槽形成於二擴充側，各組裝定位槽包括嵌入空間、承靠內壁、插入口、縱向擋片及橫向擋片，縱向擋片及橫向擋片之間延伸方向相互交錯且彼此具一間距；一硬式磁吸配件組，包括分別組合於二組裝定位槽之二磁吸作用件，各磁吸作用件包括有第一端及第二端，各磁吸作用件以第一端由插入口斜向插入嵌入空間，並構成第二端被橫向擋片所抵靠，且外抵靠面局部區域被縱向擋片所抵靠限位的組合定位狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an expandable tool holder with combined magnetic suction structure, which is characterized by: a base body, including a tool holder limit part and two expansion sides; the two assembly positioning grooves are formed on the two expansion sides. Each assembly positioning groove includes an embedded space, a bearing inner wall, an insertion port, a longitudinal barrier cuff and a transverse barrier cuff. The extension directions between the longitudinal barrier cuff and the transverse barrier cuff are staggered and have a space between each other. A hard type magnetic suction fitting group includes two magnetic suction parts which are respectively combined in two assembly positioning slots. Each magnetic suction part includes a first end and a second end. Each magnetic suction part is obliquely inserted into the embedded space from the insertion port at the first end, forming a combined positioning state in which the second end is abutted by a transverse barrier cuff, and a partial area of the outer abutting surface is abutted by the longitudinal barrier cuff.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:座體</p>
        <p type="p">11:工具置放限位部</p>
        <p type="p">12:擴充側</p>
        <p type="p">20:組裝定位槽</p>
        <p type="p">22:承靠內壁</p>
        <p type="p">23:插入口</p>
        <p type="p">25:橫向擋片</p>
        <p type="p">251:橫向限位壁</p>
        <p type="p">30:硬式磁吸配件組</p>
        <p type="p">31A、31B:磁吸作用件</p>
        <p type="p">311:第一端</p>
        <p type="p">312:第二端</p>
        <p type="p">313:內抵靠面</p>
        <p type="p">314:外抵靠面</p>
        <p type="p">315:倒角部位</p>
        <p type="p">註：本圖中的6非元件符號，係表示6-6剖面狀態呈現於圖6。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="257" publication-number="202618882">
    <tif-files tif-type="multi-tif">
      <tif file="113139957.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖案化方法</chinese-title>
        <english-title>PATTERNING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H01L21/027</main-classification>
        <further-classification edition="200601120241101B">G03F7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡易霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種圖案化方法，包括以下步驟。提供第一模板。第一模板包括至少一個第一主圖案、多個第一虛擬圖案與多個第二主圖案。多個第一虛擬圖案位於至少一個第一主圖案旁。至少一個第一主圖案的密度小於多個第二主圖案的密度。在第一基板上提供第一壓印材料。使用第一模板對第一壓印材料進行壓印，而形成第一壓印層。使用第一壓印層作為罩幕，對第一基板進行蝕刻，而形成第二模板。在材料層上提供第二壓印材料。使用第二模板對第二壓印材料進行壓印，而形成第二壓印層。使用第二壓印層作為罩幕，對材料層進行蝕刻，而形成圖案化材料層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A patterning method including the following steps is provided. A first template is provided. The first template includes at least one first main pattern, first dummy patterns, and second main patterns. The first dummy patterns are located aside the at least one first main pattern. A density of the at least one first main pattern is less than a density of the second main patterns. A first imprint material is provided on a first substrate. The first imprint material is imprinted by using the first template to form a first imprint layer. The first substrate is etched by using the first imprint layer as a mask to form a second template. A second imprint material is provided on a material layer. The second imprint material is imprinted by using the second template to form a second imprint layer. The material layer is etched by using the second imprint layer as a mask to form a patterned material layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:模板</p>
        <p type="p">104:基板</p>
        <p type="p">106a:壓印層</p>
        <p type="p">DP2,DP21:虛擬圖案</p>
        <p type="p">IP1:壓印圖案</p>
        <p type="p">MP3,MP4,MP41:主圖案</p>
        <p type="p">R3,R4:區域</p>
        <p type="p">RLT1:殘餘層厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="258" publication-number="202618690">
    <tif-files tif-type="multi-tif">
      <tif file="113139958.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鏡頭檢測方法及電子裝置</chinese-title>
        <english-title>LENS DETECTION METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241104B">G06T7/00</main-classification>
        <further-classification edition="202201120241104B">G06V20/60</further-classification>
        <further-classification edition="202201120241104B">G06V40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳哲豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHE-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIA-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示實施例提供一種鏡頭檢測方法及電子裝置。所述方法包括：取得由鏡頭拍攝的複數個影像幀，並對影像幀執行物件追蹤操作；以及反應於判定在影像幀中的至少一第一影像幀中追蹤到目標物件，且目標物件在影像幀中的至少一第二影像幀中失去追蹤，依據於至少一拍攝時間拍攝的至少一第二影像幀的關聯性判定鏡頭的遮蔽狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed embodiments provide a lens detection method and an electronic device. The method includes: obtaining a plurality of image frames captured by a lens and performing an object tracking operation on the plurality of image frames; in response to determining that a target object is tracked in at least one first image frame among the plurality of image frames and lost tracking in at least one second image frame among the plurality of image frames, determining an occlusion status of the lens based on a relevance of the at least one second image frame captured at at least one capturing time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210,S220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="259" publication-number="202619229">
    <tif-files tif-type="multi-tif">
      <tif file="113139960.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異物位置偵測裝置及其偵測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250212B">H02J50/60</main-classification>
        <further-classification edition="201601120250212B">H02J50/90</further-classification>
        <further-classification edition="201601120250212B">H02J50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何昆哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, KUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何治翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種異物位置偵測裝置及其偵測方法，異物位置偵測裝置包括依序耦接之訊號感測電路、處理器與顯示器。訊號感測電路感測輸入直流電壓、輸入直流電流、輸出直流電壓與輸出直流電流。處理器存有一對照表，對照表具有多個能量轉換效率及其分別對應之不同位置。處理器根據輸入直流電壓與輸入直流電流計算輸入功率，根據輸出直流電壓與輸出直流電流計算輸出功率，且將輸出功率除以輸入功率，以得到充電效率。在充電效率等於能量轉換效率時，處理器輸出充電效率對應之位置。顯示器標示充電效率對應之位置，且以此作為異物所在位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:異物位置偵測裝置</p>
        <p type="p">10:訊號感測電路</p>
        <p type="p">100:輸入感測電路</p>
        <p type="p">101:輸出感測電路</p>
        <p type="p">11:處理器</p>
        <p type="p">110:功率計算器</p>
        <p type="p">111:位置偵測器</p>
        <p type="p">12:顯示器</p>
        <p type="p">13:訊號控制器</p>
        <p type="p">2:無線充電裝置</p>
        <p type="p">VIN:輸入直流電壓</p>
        <p type="p">IIN:輸入直流電流</p>
        <p type="p">VO:輸出直流電壓</p>
        <p type="p">IO:輸出直流電流</p>
        <p type="p">P:位置</p>
        <p type="p">E:充電效率</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="260" publication-number="202618691">
    <tif-files tif-type="multi-tif">
      <tif file="113139961.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139961</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭皮狀況分類系統與頭皮狀況分類方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR CLASSIFYING SCALP CONDITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250203B">G06T7/00</main-classification>
        <further-classification edition="201801120250203B">G16H30/40</further-classification>
        <further-classification edition="201901120250203B">G06F16/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美科實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACROHI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾昕燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHONG, SIN-YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏至賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIA, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種使用頭皮狀況分類系統與頭皮狀況分類方法，旨在解決影像變異性及傳統資料增強技術的限制問題。頭皮狀況分類系統包含一個影像前處理模組，其在保留所有原始影像特徵的同時生成增強影像，確保不移除任何潛在症狀。編碼器從增強影像中提取特徵，這些特徵隨後通過基於原型的增強模組進行增強，該模組結合了對應於預定義頭皮狀況的特徵。系統進一步包含一個正向分類器和一個負向分類器，分別被配置為處理增強後的特徵並輸出第一組和第二組預測。損失計算模組使用真實標籤計算監督損失，並在預測結果之間計算反向一致性損失。為在測試時的推論過程調整系統，自適應更新模組最小化一種感知銳度且可靠的熵損失，確保在多樣的成像設備和環境中保持穩定的分類性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and a method for classifying scalp conditions, aimed at addressing the challenges posed by image variability and the limitations of traditional data augmentation techniques. The system for classifying scalp conditions includes an image preprocessing module, which generates augmented images while retaining all original image features, ensuring that no potential symptoms are removed. An encoder extracts features from the augmented images, which are subsequently augmented by a prototype-based augmentation module incorporating features corresponding to predefined scalp conditions. The system further includes a positive classifier and a negative classifier, configured to process the augmented features and output first and second sets of predictions, respectively. A loss computation module calculates a supervised loss using ground truth labels and computes a reverse consistency loss between the prediction results. To adjust the system during the inference process at test time, the adaptive update module minimizes a sharpness-aware and reliable entropy loss, ensuring stable classification performance across various imaging instruments and environments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頭皮狀況分類系統</p>
        <p type="p">105:成像設備</p>
        <p type="p">110:影像前處理模組</p>
        <p type="p">120:編碼器</p>
        <p type="p">130:基於原型的增強模組</p>
        <p type="p">132:記憶體庫</p>
        <p type="p">134:原型匹配層</p>
        <p type="p">136:溫度縮放的Softmax函數</p>
        <p type="p">140:分類模組</p>
        <p type="p">142:正向分類器</p>
        <p type="p">142a:第一組預測</p>
        <p type="p">144:負向分類器</p>
        <p type="p">144a:第二組預測</p>
        <p type="p">150:損失計算模組</p>
        <p type="p">160:自適應更新模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="261" publication-number="202619141">
    <tif-files tif-type="multi-tif">
      <tif file="113139962.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充放電系統以及充放電方法</chinese-title>
        <english-title>CHARGING AND DISCHARGING SYSTEM AND CHARGING AND DISCHARGING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250121B">H01M10/44</main-classification>
        <further-classification edition="200601120250121B">H01M10/46</further-classification>
        <further-classification edition="200601120250121B">H01M10/48</further-classification>
        <further-classification edition="200601120250121B">H02J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威盛電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊良臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LIANG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎奕緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種充放電系統以及充放電方法。充放電系統包括電池模組偵測電路、充放電控制器以及微控制器。電池模組偵測電路接收電池模組的偵測信號，並且根據偵測信號產生電池類型判斷信號以及深度放電偵測信號。微控制器控制充放電控制器來對電池模組進行充電操作或放電操作。當微控制器根據電池類型判斷信號判斷電池模組為第一電池類型時，微控制器根據深度放電偵測信號來控制充放電控制器來進行深度放電保護功能。當微控制器根據電池類型判斷信號判斷電池模組為第二電池類型時，微控制器控制充放電控制器來停止深度放電保護功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charging and discharging system and a charging and discharging method are provided. The charging and discharging system includes a battery module detection circuit, a charging and discharging controller and a microcontroller. The battery module detection circuit receives a detection signal of the battery module and generates a battery type judgment signal and a deep discharge detection signal based on the detection signal. The microcontroller controls the charge and discharge controller to perform charging or discharging operations on the battery module. When the microcontroller determines that the battery module is a first battery type based on the battery type determination signal, the microcontroller controls the charge and discharge controller to perform a deep discharge protection function based on the deep discharge detection signal. When the microcontroller determines that the battery module is a second battery type according to the battery type determination signal, the microcontroller controls the charge and discharge controller to stop the deep discharge protection function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:充放電系統</p>
        <p type="p">110:微控制器</p>
        <p type="p">120:電池模組偵測電路</p>
        <p type="p">130:充電控制器</p>
        <p type="p">200:電池模組</p>
        <p type="p">S_CHG_ON:控制信號</p>
        <p type="p">S_CHG_OFF:充電完成信號</p>
        <p type="p">S_DET_MCU:電池類型判斷信號</p>
        <p type="p">S_DET:偵測信號</p>
        <p type="p">V_DDTH:深度放電偵測信號</p>
        <p type="p">V_OUT:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="262" publication-number="202618027">
    <tif-files tif-type="multi-tif">
      <tif file="113139963.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗氧化金屬管件及其製造方法</chinese-title>
        <english-title>ANTI-OXIDIZED METAL PIPE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">C23C16/04</main-classification>
        <further-classification edition="200601120241104B">C23C16/44</further-classification>
        <further-classification edition="200601120241104B">F16L58/08</further-classification>
        <further-classification edition="200601120241104B">F16L9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昌鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, CHANG-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秉敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PING TUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHENG-XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抗氧化金屬管件及其製造方法。抗氧化金屬管件包括中空金屬管件以及抗氧化薄膜。中空金屬管件的內徑為1.0 mm至200 mm。抗氧化薄膜係毯覆在中空金屬管件的內側表面上。抗氧化金屬管件在高氧化環境下具有良好的抗氧化性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-oxidized metal pipe and a method of fabricating the same are provided. The anti-oxidized metal pipe includes a hollow metal pipe and an anti-oxidized thin film. The hollow metal pipe has an inner diameter in a range of 1.0 mm to 200 mm. An inner surface of the hollow metal pipe is blanketly covered by the anti-oxidized thin film. The anti-oxidized metal pipe has great resistance to oxidation in a highly-oxidizing environment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S31、S32、S33、S34、S35:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="263" publication-number="202618705">
    <tif-files tif-type="multi-tif">
      <tif file="113139964.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139964</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像分析方法及其監控設備</chinese-title>
        <english-title>IMAGE ANALYSIS METHOD AND SURVEILLANCE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">G06V20/52</main-classification>
        <further-classification edition="202201120250203B">G06V20/58</further-classification>
        <further-classification edition="201701120250203B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶睿通訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIVOTEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉誠傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像分析方法，應用於一監控設備。該影像分析方法包含有該監控設備之一運算處理器一監控影像內劃設一第一物件標記框，該運算處理器使用一第一物件門檻在該監控影像內得到一候選邊界框的相關資料，該運算處理器計算該第一物件標記框與該候選邊界框之一交集參數，以及該運算處理器根據該交集參數決定該第一物件決定門檻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image analysis method is applied to a surveillance apparatus and includes an operation processor of the surveillance apparatus setting a first object marking frame within a surveillance image, the operation processor acquiring data of a candidate boundary frame within the surveillance image via a first object threshold, the operation processor computing an intersection parameter of the first object marking frame and the candidate boundary frame, and the operation processor deciding a first object decided threshold in accordance with the intersection parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S102、S104、S106、S108、S110、S112、S114、S116、S118:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="264" publication-number="202616984">
    <tif-files tif-type="multi-tif">
      <tif file="113139968.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能櫃系統</chinese-title>
        <english-title>INTELLIGENT CABINET SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A47B81/00</main-classification>
        <further-classification edition="200601120241204B">A47B97/00</further-classification>
        <further-classification edition="200601120241204B">E05B17/22</further-classification>
        <further-classification edition="200601120241204B">E05B65/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉駿達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇信誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能櫃系統包含一櫃體、複數個活動件、一控制裝置、一控制單元、一電子模組以及一通訊裝置。這些活動件安排至該櫃體，且這些活動件可相對該櫃體在一收合位置與一開啟位置之間活動；該控制裝置安排至該櫃體；該控制單元電性連接至該控制裝置；該電子模組電性連接至該控制單元，且該電子模組包含一驅動裝置用以驅動一驅動件；該通訊裝置用以發出一預定訊號，且該控制裝置接收該預定訊號，使該控制單元依據該預定訊號控制該驅動件從一第一預定狀態活動至一第二預定狀態，用以允許這些活動件的其中之一離開該收合位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent cabinet system includes a cabinet, a plurality of movable members, a control device, a control unit, an electronic module and a communication device. These movable members are arranged at the cabinet and are movable between a retracted position and an open position relative to the cabinet. The control device is arranged at the cabinet. The control unit is electrically connected with the control device. The electronic module is electrically connected with the control unit and includes a driving device for driving a drive part. The communication device is configured to transmit a predetermined signal and the control device receives the predetermined signal such that the control unit controls the drive part to move from a first predetermined state to a second predetermined state according to the predetermined signal for allowing one of the movable members to leave the retracted position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:智能櫃系統</p>
        <p type="p">22:櫃體</p>
        <p type="p">24a:第一抽屜</p>
        <p type="p">24b:第二抽屜</p>
        <p type="p">24c:第三抽屜</p>
        <p type="p">24d:第四抽屜</p>
        <p type="p">24f:第六抽屜</p>
        <p type="p">32:控制裝置</p>
        <p type="p">40a:第一控制單元</p>
        <p type="p">40b:第二控制單元</p>
        <p type="p">42:通訊裝置</p>
        <p type="p">43:螢幕</p>
        <p type="p">44:無線設備</p>
        <p type="p">46:閘道器</p>
        <p type="p">48:雲端伺服器</p>
        <p type="p">50:第一儲存單元</p>
        <p type="p">52:第二儲存單元</p>
        <p type="p">54:第三儲存單元</p>
        <p type="p">56:第四儲存單元</p>
        <p type="p">62:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="265" publication-number="202616993">
    <tif-files tif-type="multi-tif">
      <tif file="113139969.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能櫃系統</chinese-title>
        <english-title>INTELLIGENT CABINET SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241224B">A47B96/00</main-classification>
        <further-classification edition="201701120241224B">A47B88/457</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉駿達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇信誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能櫃系統包含一櫃體、複數個活動件、一控制裝置、一控制單元、一電子模組、一電源模組以及一通訊裝置。這些活動件安排至該櫃體，且這些活動件可相對該櫃體在一收合位置與一開啟位置之間活動；該控制裝置安排至該櫃體；該控制單元電性連接至該控制裝置；該電子模組電性連接至該控制單元，且該電子模組包含一驅動裝置用以驅動一驅動件；該電源模組用以供電至該控制裝置；該通訊裝置用以發出一預定訊號，且該控制裝置接收該預定訊號，使該控制單元依據該預定訊號控制該驅動件從一第一預定狀態活動至一第二預定狀態，用以允許這些活動件的其中之一離開該收合位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent cabinet system includes a cabinet, a plurality of movable members, a control device, a control unit, an electronic module, a power module and a communication device. These movable members are arranged at the cabinet and are movable between a retracted position and an open position relative to the cabinet. The control device is arranged at the cabinet. The control unit is electrically connected with the control device. The electronic module is electrically connected with the control unit and includes a driving device for driving a drive part. The power module is configured to provide power to the control device. The communication device is configured to transmit a predetermined signal and the control device receives the predetermined signal such that the control unit controls the drive part to move from a first predetermined state to a second predetermined state according to the predetermined signal for allowing one of the movable members to leave the retracted position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:智能櫃系統</p>
        <p type="p">22:櫃體</p>
        <p type="p">24a:第一抽屜</p>
        <p type="p">24d:第四抽屜</p>
        <p type="p">24g:第七抽屜</p>
        <p type="p">32:控制裝置</p>
        <p type="p">40a:第一控制單元</p>
        <p type="p">40b:第二控制單元</p>
        <p type="p">50:第一儲存單元</p>
        <p type="p">58:電子線材</p>
        <p type="p">60:電源模組</p>
        <p type="p">62:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="266" publication-number="202619509">
    <tif-files tif-type="multi-tif">
      <tif file="113139970.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139970</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D1/66</main-classification>
        <further-classification edition="202501120250102B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種半導體裝置，包含：一基板；一井區，位於所述基板中；一頂摻雜區，位於所述井區中；一第一層間介電層，位於所述井區上；至少一接觸通孔，位於所述第一層間介電層中；一第一下金屬層，位於所述第一層間介電層中；一第二層間介電層，位於所述第一層間介電層上；至少一導孔，位於所述第二層間介電層中；以及一第一上金屬層，位於所述第二層間介電層上，其中：所述第二層間介電層的一第二厚度不大於所述第一層間介電層的一第一厚度，以及所述第一下金屬層透過所述至少一導孔中的一第一導孔電性連接所述第一上金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor device. The semiconductor device comprises a substrate; a well region located in the substrate; a top doping region located in the well region; a first interlayer dielectric (ILD) layer located on the well region; at least one contact located in the first ILD layer; a first lower metal layer located in the first ILD layer; a second ILD layer located on the first ILD layer; at least one via located in the second ILD layer; and a first upper metal layer located on the second ILD layer, wherein: a second thickness of the second ILD layer is not greater than a first thickness of the first ILD layer, and the first lower metal layer is electrically connected to the first upper metal layer through a first via of the at least one via.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">100:基板</p>
        <p type="p">110:井區</p>
        <p type="p">112:頂摻雜區</p>
        <p type="p">114:源極區</p>
        <p type="p">116:汲極區</p>
        <p type="p">120:第一層間介電層</p>
        <p type="p">122:第一下金屬層</p>
        <p type="p">124:第二下金屬層</p>
        <p type="p">126:第三下金屬層</p>
        <p type="p">1284:第二接觸通孔</p>
        <p type="p">1286:第三接觸通孔</p>
        <p type="p">130:第二層間介電層</p>
        <p type="p">1322:第一導孔</p>
        <p type="p">1324:第二導孔</p>
        <p type="p">1326:第三導孔</p>
        <p type="p">142:第一上金屬層</p>
        <p type="p">144:第二上金屬層</p>
        <p type="p">146:第三上金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="267" publication-number="202616996">
    <tif-files tif-type="multi-tif">
      <tif file="113139973.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>座椅扶手</chinese-title>
        <english-title>SEAT ARMREST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A47C1/03</main-classification>
        <further-classification edition="200601120241204B">A47C7/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程源塑膠有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATEC PLASTIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提出一種座椅扶手，包括：座椅支架，具有固定座，該固定座向上延伸座管；第一管件，設於該座管內部且兩側表面分別具有定位槽段，該定位槽段由縱向位移槽孔及連通該縱向位移槽孔之複數橫向位移槽孔所組成，各橫向位移槽孔具有傾斜段；第二管件，設於該第一管件內部且頂部具有安裝槽，該安裝槽具有容置孔，該第二管件鄰靠底部設有第一穿孔；調整桿，設於該第二管件內部並具有桿體及連接於該桿體上方之按壓部，該桿體鄰靠底端具有與該第二管件之第一穿孔相對應之第二穿孔，該按壓部穿出於該容置；定位塊，活動組設於該桿體之第二穿孔且兩側分別凸設二定位部；蓋板，蓋設於該第二管件之安裝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention proposes a seat armrest, which includes: a seat bracket with a fixed seat extending upward from the seat tube; a first pipe member located inside the seat tube and having positioning groove sections on both sides of the surface. The slot section is composed of a longitudinal displacement slot and a plurality of transverse displacement slots connected to the longitudinal displacement slot. Each transverse displacement slot has an inclined section; the second pipe fitting is provided inside the first pipe fitting and has a mounting slot at the top. The installation groove has a receiving hole, and the second pipe fitting is provided with a first through hole adjacent to the bottom; the adjusting rod is provided inside the second pipe fitting and has a rod body and a pressing portion connected to the top of the rod body, and the rod body has a a second through hole corresponding to the first through hole of the second pipe member, the pressing part passing through the accommodation; a positioning block movably assembled on the second through hole of the rod body and two positioning parts protruding from both sides; a cover The plate covers the installation slot of the second pipe fitting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:座椅支架</p>
        <p type="p">10:固定座</p>
        <p type="p">11:座管</p>
        <p type="p">2:第一管件</p>
        <p type="p">20:定位槽段</p>
        <p type="p">23:第二卡固部</p>
        <p type="p">3:第二管件</p>
        <p type="p">30:安裝槽</p>
        <p type="p">32:第一樞接部</p>
        <p type="p">33:第一穿孔</p>
        <p type="p">34:止滑件</p>
        <p type="p">35:第二固定孔</p>
        <p type="p">4:調整桿</p>
        <p type="p">41:按壓部</p>
        <p type="p">410:卡掣部</p>
        <p type="p">411:彈簧</p>
        <p type="p">43:第二樞接部</p>
        <p type="p">5:定位塊</p>
        <p type="p">50:定位部</p>
        <p type="p">6:蓋板</p>
        <p type="p">60:第一固定孔</p>
        <p type="p">61:卡掣孔</p>
        <p type="p">62:第三樞接部</p>
        <p type="p">7:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="268" publication-number="202616994">
    <tif-files tif-type="multi-tif">
      <tif file="113139978.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能櫃系統</chinese-title>
        <english-title>INTELLIGENT CABINET SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241224B">A47B96/00</main-classification>
        <further-classification edition="201701120241224B">A47B88/457</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉駿達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇信誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能櫃系統包含一櫃體、複數個活動件、一控制裝置、一控制單元、一電子模組、一電源模組、一感測器以及一通訊裝置。這些活動件安排至該櫃體，且這些活動件可相對該櫃體在一收合位置與一開啟位置之間活動；該控制裝置安排至該櫃體；該控制單元電性連接至該控制裝置；該電子模組電性連接至該控制單元，且該電子模組包含一驅動裝置用以驅動一驅動件；該感測器安排在該櫃體；該通訊裝置用以發出一預定訊號，且該控制裝置接收該預定訊號，使該控制單元依據該預定訊號控制該驅動件從一第一預定狀態活動至一第二預定狀態，用以允許這些活動件的其中之一離開該收合位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent cabinet system includes a cabinet, a plurality of movable members, a control device, a control unit, an electronic module, a power module, a sensor and a communication device. These movable members are arranged at the cabinet and are movable between a retracted position and an open position relative to the cabinet. The control device is arranged at the cabinet. The control unit is electrically connected with the control device. The electronic module is electrically connected with the control unit and includes a driving device for driving a drive part. The sensor is arranged at the cabinet. The communication device is configured to transmit a predetermined signal and the control device receives the predetermined signal such that the control unit controls the drive part to move from a first predetermined state to a second predetermined state according to the predetermined signal for allowing one of the movable members to leave the retracted position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:智能櫃系統</p>
        <p type="p">22:櫃體</p>
        <p type="p">24a:第一抽屜</p>
        <p type="p">24b:第二抽屜</p>
        <p type="p">24c:第三抽屜</p>
        <p type="p">24d:第四抽屜</p>
        <p type="p">24f:第六抽屜</p>
        <p type="p">32:控制裝置</p>
        <p type="p">40a:第一控制單元</p>
        <p type="p">40b:第二控制單元</p>
        <p type="p">42:通訊裝置</p>
        <p type="p">43:螢幕</p>
        <p type="p">44:無線設備</p>
        <p type="p">46:閘道器</p>
        <p type="p">48:雲端伺服器</p>
        <p type="p">50:第一儲存單元</p>
        <p type="p">52:第二儲存單元</p>
        <p type="p">54:第三儲存單元</p>
        <p type="p">56:第四儲存單元</p>
        <p type="p">62:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="269" publication-number="202618332">
    <tif-files tif-type="multi-tif">
      <tif file="113139979.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139979</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學測距裝置</chinese-title>
        <english-title>OPTICAL DISTANCE MEASURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241225B">G01S17/931</main-classification>
        <further-classification edition="200601120241225B">G01S17/08</further-classification>
        <further-classification edition="200601120241225B">G01S7/481</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宸美（廈門）光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TPK ADVANCED SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃檠裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭建麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIEN LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學測距裝置，裝設於行駛於路面的車輛的頂部，光學測距裝置包括陣列式光源。陣列式光源具有垂直於路面的方向上的視場，並且包括複數個光源，該等光源包括複數個測近光源和複數個測遠光源。視場包括第一區視場及第二區視場，第一區視場為光學測距裝置的基準光軸朝路面旋轉大於或等於        &lt;img align="absmiddle" height="27px" width="33px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;的夾角範圍，第一區視場僅由陣列式光源中的該等光源的該等測近光源所提供。藉此，本發明能夠防止鬼影並可提高自動駕駛車輛的舒適度和安全性。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical distance measuring device is installed on a top of a vehicle running on a road. The optical distance measuring device includes an array light source. The array light source has a field of view in a direction perpendicular to the road surface, and includes a plurality of light sources which includes a plurality of near-measuring light sources and a plurality of far-measuring light sources. The field of view includes the first field of view and the second field of view, the first field of view is an angle range in which a reference optical axis of the optical distance measuring device rotates toward the road surface greater than or equal to 6.5 degrees, and the first field of view is provided only by the near-measuring light sources of the light sources in the array light source. Such that, the present invention can prevent ghosting and improve the comfort and safety of autonomous vehicles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學測距裝置</p>
        <p type="p">3:車輛</p>
        <p type="p">4:路面</p>
        <p type="p">90:視場</p>
        <p type="p">91:第一區視場</p>
        <p type="p">92:第二區視場</p>
        <p type="p">θ:夾角</p>
        <p type="p">L:基準光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="270" publication-number="202616985">
    <tif-files tif-type="multi-tif">
      <tif file="113139980.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能櫃系統的尋物方法與物品資訊建立方法</chinese-title>
        <english-title>OBJECT SEARCHING AND INFORMATION ESTABLISHING METHODS OF INTELLIGENT CABINET SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241224B">A47B81/00</main-classification>
        <further-classification edition="200601120241224B">A47B96/00</further-classification>
        <further-classification edition="201701120241224B">A47B88/457</further-classification>
        <further-classification edition="202301120241224B">G06F18/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉駿達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇信誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能櫃系統的尋物方法，該智能櫃系統包含一櫃體、複數個活動件、一控制裝置、一控制單元、一電子模組以及一通訊裝置。這些活動件安排至該櫃體，且這些活動件可相對該櫃體在一收合位置與一開啟位置之間活動；該控制裝置安排至該櫃體；該電子模組包含一驅動裝置用以驅動一驅動件；該通訊裝置可依據與物品相關的識別特徵或語音訊息發出一預定訊號，且該控制裝置接收該預定訊號，使該控制單元依據該預定訊號控制該驅動件從一第一預定狀態活動至一第二預定狀態，用以允許這些活動件的其中之一離開該收合位置。本發明亦提供一種智能櫃系統的物品資訊建立方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object searching method for an intelligent cabinet system including a cabinet, a plurality of movable members, a control device, a control unit, an electronic module and a communication device. These movable members are arranged at the cabinet and are movable between a retracted position and an open position relative to the cabinet. The control device is arranged at the cabinet. The electronic module includes a driving device for driving a drive part. The communication device is configured to transmit a predetermined signal according to an identifying feature or a voice message relating to an object and the control device receives the predetermined signal such that the control unit controls the drive part to move from a first predetermined state to a second predetermined state according to the predetermined signal for allowing one of the movable members to leave the retracted position. The present invention also provides an object information establishing method of the smart cabinet system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S16:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="271" publication-number="202618145">
    <tif-files tif-type="multi-tif">
      <tif file="113139984.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電磁煞車裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">F16D65/28</main-classification>
        <further-classification edition="200601120241030B">F16D65/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣三嵩工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作包括有線圈座、結合蓋板、電樞、制動彈性件及來令。線圈座包括有座體，以及設於座體內的線圈體；結合蓋板能相對線圈座旋轉且包括有板體；電樞設於線圈座與板體之間，電樞能朝向線圈座與板體活動；各個制動彈性件包括有位置相對的兩端，各制動彈性件的兩端分別抵靠線圈座及電樞；來令固結於電樞且能隨著電樞朝向線圈座與板體活動、與板體接觸。本創作將電樞和來令直接相結合、支撐來令，省去了電樞座的製作與安裝，能夠解決現有電磁煞車製作過程繁複的問題，提供一種結構精簡而能提升組裝效率的電磁煞車裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:線圈座</p>
        <p type="p">11:座體</p>
        <p type="p">12:線圈體</p>
        <p type="p">13:容孔</p>
        <p type="p">14:導引件</p>
        <p type="p">20:結合蓋板</p>
        <p type="p">21:板體</p>
        <p type="p">22:中心軸</p>
        <p type="p">30:電樞</p>
        <p type="p">40:制動彈性件</p>
        <p type="p">50:來令</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="272" publication-number="202617312">
    <tif-files tif-type="multi-tif">
      <tif file="113139985.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射方向調整組件及雷射加工設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241204B">B23K26/062</main-classification>
        <further-classification edition="201401120241204B">B23K26/064</further-classification>
        <further-classification edition="201401120241204B">B23K26/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈦昇科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詳竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作雷射方向調整組件應用於一雷射加工設備，並包含一預調整鏡組、一第一軸鏡組及一第二軸鏡組，雷射光束被發射至該雷射方向調整組件，並先透過該預調整鏡組的預調整反射鏡反射偏折後再入射該第一軸鏡組的第一軸反射鏡，接著再被反射偏折入射該第二軸鏡組的第二軸反射鏡，藉由該預調整鏡組修正該雷射光束的兩側的光線路徑的角度差異，當該雷射光束從該第二軸反射鏡射出後，該雷射光束的兩側的光線路徑的角度差異會縮小，因此該雷射光束能以較小的傾斜角度被發射至一待加工件，提升雷射加工設備的加工品質及精度，且特別適用於貝索光束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雷射方向調整組件</p>
        <p type="p">10:預調整鏡組</p>
        <p type="p">20:第一軸鏡組</p>
        <p type="p">30:第二軸鏡組</p>
        <p type="p">2:雷射發射器</p>
        <p type="p">3:聚焦鏡組</p>
        <p type="p">4:運動平台</p>
        <p type="p">5:待加工件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="273" publication-number="202617561">
    <tif-files tif-type="multi-tif">
      <tif file="113139986.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸嘴</chinese-title>
        <english-title>NOZZLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B65G47/91</main-classification>
        <further-classification edition="200601120241204B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹義企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YINYI RUBBER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHENG-ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種吸嘴，其用以連接一真空裝置，且具有一吸附件以及一連接件。吸附件具有至少一穿孔以及至少一凹槽組。各穿孔貫穿吸附件。至少一凹槽組均勻分布於吸附件的一表面，且各凹槽組具有一接合槽以及至少一槽體。接合槽及槽體的開口皆位於吸附件的該表面上，且槽體位於接合槽的周圍。連接件連接吸附件以及真空裝置，且具有一通孔以及至少一凸塊。通孔貫穿連接件並連通各穿孔以及真空裝置。各凸塊能卡合於其中一接合槽。當凸塊與接合槽相接合時，接合槽所產生的形變能被槽體限縮，使吸嘴能貼合於晶圓的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nozzle is configured to connect a vacuum device, and has an adsorption component and a connection component. The adsorption component has at least one perforate and at least one groove set. Each perforate penetrates through the adsorption component. The groove set is evenly distributed on a surface of the adsorption component, and each groove set has a jointing groove and at least one groove body. The openings of the jointing groove and the groove body are located on the surface of the adsorption component, and the groove body is located around the jointing groove. The connection component connects the adsorption component and the vacuum device, and has a through-hole and at least one block. The through-hole penetrates through the connection component and communicates with each perforate and the vacuum device. Each block can engage with one of jointing grooves. When the block is engaged with the jointing groove, the deformation produced by the jointing groove can be limited by the groove body, so that the nozzle can fit the surface of the wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吸附件</p>
        <p type="p">11:第一面</p>
        <p type="p">151:接合槽</p>
        <p type="p">152:槽體</p>
        <p type="p">20:連接件</p>
        <p type="p">21:通孔</p>
        <p type="p">22:凸塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="274" publication-number="202616986">
    <tif-files tif-type="multi-tif">
      <tif file="113139992.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可活動式滑軌固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241104B">A47B88/423</main-classification>
        <further-classification edition="200601120241104B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富世達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSITEK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇家弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王浩評</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAO-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可活動式滑軌固定裝置，適用於將一滑軌固定於一機櫃的一前安裝片，該滑軌供一機箱固定地設置，該機箱具有一勾件，該滑軌固定裝置包含一前托架模組及一前支撐軌。前托架模組包括一適用於連接該前安裝片的前托架及一樞設於該前托架的前鎖定件。該前鎖定件可卡扣於該前安裝片並具有一遠離該前安裝片延伸並可卡勾於該勾件的定位卡勾。前支撐軌可活動地連接該前托架並供該滑軌固定地設置，該前支撐軌可帶動該滑軌及該機箱相對於該前托架移動，使該勾件卡勾於該定位卡勾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:滑軌固定裝置</p>
        <p type="p">20:後安裝片</p>
        <p type="p">30:前安裝片</p>
        <p type="p">301:前安裝孔</p>
        <p type="p">2:後支撐軌</p>
        <p type="p">3:後托架模組</p>
        <p type="p">4:前支撐軌</p>
        <p type="p">41:擋止面</p>
        <p type="p">43:第二端</p>
        <p type="p">44:支撐卡勾</p>
        <p type="p">5:前托架模組</p>
        <p type="p">51:前托架</p>
        <p type="p">515:第二前卡勾</p>
        <p type="p">52:前鎖定件</p>
        <p type="p">524:定位卡勾</p>
        <p type="p">6:前連接彈性件</p>
        <p type="p">9:機箱</p>
        <p type="p">91:勾件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="275" publication-number="202619475">
    <tif-files tif-type="multi-tif">
      <tif file="113139993.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241101B">H10B12/00</main-classification>
        <further-classification edition="200601120241101B">H01L23/532</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓筌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇遠豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李書銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包括基底、埋入式字元線結構與介電阻障層。埋入式字元線結構位於基底中。埋入式字元線結構包括埋入式字元線。埋入式字元線位於基底中。介電阻障層位於埋入式字元線結構上方的基底中。位於基底中的介電阻障層的寬度大於埋入式字元線結構的寬度。在介電阻障層中具有鄰近於基底的多個氣隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure including a substrate, a buried word line structure, and a dielectric barrier layer is provided. The buried word line structure is located in the substrate. The buried word line structure includes a buried word line. The buried word line is located in the substrate. The dielectric barrier layer is located in the substrate above the buried word line structure. The width of the dielectric barrier layer located in the substrate is greater than the width of the buried word line structure. There are air gaps in the dielectric barrier layer adjacent to the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基底</p>
        <p type="p">102:罩幕層</p>
        <p type="p">104:埋入式字元線結構</p>
        <p type="p">106:埋入式字元線</p>
        <p type="p">108:閘介電層</p>
        <p type="p">110,114:導電層</p>
        <p type="p">112:阻障層</p>
        <p type="p">116a:頂蓋層</p>
        <p type="p">118,122a,124:介電層</p>
        <p type="p">126:介電阻障層</p>
        <p type="p">AR1:氣隙</p>
        <p type="p">OP1,OP2:開口</p>
        <p type="p">W1~W4:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="276" publication-number="202619588">
    <tif-files tif-type="multi-tif">
      <tif file="113139994.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電二極體及其製造方法</chinese-title>
        <english-title>PHOTODIODE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F71/00</main-classification>
        <further-classification edition="202501120250102B">H10F77/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉禹欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光電二極體及其製造方法，其中光電二極體之製造方法包含以下步驟：提供一晶圓，其具有複數光電二極體結構；貼附一保護膜至晶圓上；切割保護膜及晶圓，使保護膜及晶圓上形成複數切割道以分離各光電二極體結構；塗佈一遮光溶液於保護膜上，使遮光溶液覆蓋各切割道；以及固化遮光溶液，以形成一遮光側壁完整覆蓋各光電二極體結構之側壁，以阻擋任何光線穿透側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photodiode and a manufacturing method thereof are provided. The manufacturing method of the photodiode comprises the following steps: providing a wafer with a plurality of photodiode structures, attaching a protective film to the wafer, cutting the protective film and the wafer to form a plurality of cutting lanes on the protective film and the wafer to separate each photodiode structure, coating a light-shielding solution on the protective film so that the light-shielding solution covers each cutting lane, and curing the light-shielding solution so that a light-shielding sidewall are formed to completely cover the sidewall of each photodiode structure to block any light from penetrating the sidewall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:保護膜</p>
        <p type="p">20:環氧樹脂</p>
        <p type="p">100:光電二極體結構</p>
        <p type="p">110:第一導電型基板</p>
        <p type="p">120:本徵區</p>
        <p type="p">130:第二導電型半導體層</p>
        <p type="p">140:濾波層</p>
        <p type="p">150:電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="277" publication-number="202617308">
    <tif-files tif-type="multi-tif">
      <tif file="113139996.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銲接保護裝置</chinese-title>
        <english-title>WELDING PROTECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">B23K9/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡志維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡士凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, SHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種銲接保護裝置，包括外罩、內罩及背板。外罩包括抽氣孔。內罩設於外罩之內，內罩用以通入保護氣體。集塵部形成於外罩與內罩之間，集塵部連通抽氣孔。內罩提供銲道低氧環境，且遮蔽外界氣體干擾，外罩提供無外露集塵空間，可同時提升銲接品質並進行環境控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A welding protection device is provided. The welding protection device includes an outer cover, and inner cover, and a back plate. The outer cover includes an exhaust port. The inner cover is positioned inside the outer cover and is used to introduce protective gas. A dust collection unit is disposed between the outer cover and the inner cover and is connected to the exhaust port. The inner cover provides a low-oxygen environment for the welding area and shields against external gas interference, while the outer cover offers a dust-free space, thereby enhancing welding quality and facilitating environmental control.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:銲接元件</p>
        <p type="p">62:銲接頭</p>
        <p type="p">70:能量源</p>
        <p type="p">100:銲接保護裝置</p>
        <p type="p">110:外罩</p>
        <p type="p">112:壁面</p>
        <p type="p">120:內罩</p>
        <p type="p">122:通道</p>
        <p type="p">130:背板</p>
        <p type="p">140:吸塵元件</p>
        <p type="p">142:排煙管道</p>
        <p type="p">150:供氣單元</p>
        <p type="p">160:架體元件</p>
        <p type="p">164,166:組裝支架</p>
        <p type="p">168:銲接元件支架</p>
        <p type="p">DC:集塵部</p>
        <p type="p">LA:能量</p>
        <p type="p">PA:銲接方向</p>
        <p type="p">SA:導氣部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="278" publication-number="202617523">
    <tif-files tif-type="multi-tif">
      <tif file="113140000.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具均勻噴灑機能的無人機及其連接套件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B64D1/18</main-classification>
        <further-classification edition="202301120241230B">B64C39/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊富凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊富凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉元琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種具均勻噴灑機能的無人機及其連接套件，係至少包含：一無人機本體、至少一箱體、至少一連接桿、至少一連接套件與多個噴灑單元，該箱體設於該無人機本體的底座上並盛放噴灑用的農藥或肥料，各連接桿的一端固設於該無人機本體的腳架上，該連接桿的另端相對延伸於該無人機本體任兩相鄰的螺旋槳之間，各連接套件固設於各連接桿的另端，該等噴灑單元分別設於該兩相鄰的螺旋槳下方以及各連接套件的下方，各噴灑單元與該箱體管路連接以噴灑該農藥或肥料，達到具有均勻噴灑機能之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:無人機本體</p>
        <p type="p">11:底座</p>
        <p type="p">12:腳架</p>
        <p type="p">13:螺旋槳</p>
        <p type="p">20:箱體</p>
        <p type="p">30:連接桿</p>
        <p type="p">40:連接套件</p>
        <p type="p">41:盒體</p>
        <p type="p">411:夾頭</p>
        <p type="p">50:噴灑單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="279" publication-number="202618728">
    <tif-files tif-type="multi-tif">
      <tif file="113140001.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虛實疊合的多人指導方法及其系統</chinese-title>
        <english-title>VIRTUAL AND REAL SUPERIMPOSED MULTI-PERSON GUIDANCE METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G09B9/00</main-classification>
        <further-classification edition="200601120241231B">G09B5/04</further-classification>
        <further-classification edition="200601120241231B">G06T17/00</further-classification>
        <further-classification edition="201101120241231B">G06T19/20</further-classification>
        <further-classification edition="200601120241231B">G01S13/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鍏晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳碩彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種虛實疊合的多人指導方法，包含一掃描一待檢修空間並建立一點雲地圖的建構步驟、一在一行動載具載入該點雲地圖的載入步驟、一定位步驟、一確定步驟，及一指示步驟。該定位步驟是透過該行動載具之參考影像，以特徵影像分析運算判斷該行動載具在該點雲地圖所代表之一點雲空間的一定位座標。該確定步驟是使該後台電子裝置得知該行動載具在該待檢修空間的位置。該指示步驟是以該後台電子裝置將一虛擬之指定物件的座標資訊傳送至該行動載具，使得該行動載具確定該指定物件一實際顯示畫面的相對位置，藉此將該指定物件顯示於該實際顯示畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-person guidance method for virtual and real superimposition includes a constructing step of constructing a space to be inspected and establishing a point cloud map, a loading step of loading a point cloud map on a mobile vehicle, a positioning step, a determining step, and an indicating step. The positioning step is to use reference images of the mobile device to determine positioning coordinates of the space cloud represented by the mobile device in a feature image analysis calculation. The determining step is to enable the background electronic device to obtain the position of the mobile device in the space under test. The indicating step is transmitting, by the background electronic device, coordinate information of a virtual designated object to the mobile device, such that the mobile device determines a relative position of the designated object on an actual display screen, thereby displaying the designated object on the actual display screen.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:建構步驟</p>
        <p type="p">12:載入步驟</p>
        <p type="p">13:定位步驟</p>
        <p type="p">14:確定步驟</p>
        <p type="p">15:指示步驟</p>
        <p type="p">16:確保步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="280" publication-number="202618189">
    <tif-files tif-type="multi-tif">
      <tif file="113140002.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空調箱檢測系統及其運作方法</chinese-title>
        <english-title>AIR HANDLING UNIT DETECTION SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241204B">F24F11/63</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昌民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭仲興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, ZHONG XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉欣宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種空調箱檢測系統及其運作方法，所述運作方法包括下列步驟：運算裝置取得設定目標值，設定目標值的值域包括多個區間。環境感測器收集空調箱的運作環境的實際目標值。運算裝置依據實際目標值對應的多個區間中的一者及轉換函數計算控制目標值，依據控制目標值設定空調箱的可調整元件。元件感測器收集空調箱運作時的實際控制值。運算裝置依據設定目標值與實際目標值的差、控制目標值與實際控制值的差產生二維殘差分析圖的資料點。當資料點位於警示範圍內時，運算裝置發出警示訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An air handling unit (AHU) detection system and its operating method are provided. The operating method includes the following steps: the computing device obtains a set target value, and a range of the set target value includes a plurality of intervals. The environmental sensor collects an actual target value of an operating environment of an air handling unit (AHU). The computing device calculates a control target value according to one of the plurality of intervals corresponding to the actual target value and a conversion function, and sets an adjustable component of the AHU according to the control target value. A component sensor collects an actual control value during the operation of the AHU. The computing device generates data points for a two-dimensional residual analysis chart according to a difference between the set target value and the actual target value, as well as a difference between the control target value and the actual control value. When a data point falls within the warning range, the computing device issues a warning message.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="281" publication-number="202619199">
    <tif-files tif-type="multi-tif">
      <tif file="113140004.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>插座型連接器及連接器總成</chinese-title>
        <english-title>RECEPTACLE CONNECTOR AND CONNECTOR ASSEMBLY HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">H01R13/652</main-classification>
        <further-classification edition="201101120250106B">H01R13/658</further-classification>
        <further-classification edition="200601120250106B">H01R13/629</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾昌興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>P-TWO INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林賢昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張君瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種插座型連接器及含該插座型連接器之連接器總成。插座型連接器設置於一基板上，用以配對一插頭型連接器，插頭型連接器具有複數同軸線。插座型連接器包含一殼體組件、複數接觸件及一滑動上蓋。其中，殼體組件具有一滑軌部，複數接觸件由殼體組件之一尾端保持，各接觸件具有一終端部延伸於殼體組件之該尾端之外。滑動上蓋設置於滑軌部中，可沿滑軌部水平滑動。當插頭型連接器插入插座型連接器後，插頭型連接器推動滑動上蓋使其沿滑軌部水平滑動以包覆該等終端部，並形成一電磁屏蔽效應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A receptacle connector and a connector assembly having the same are provided. The receptacle connector is disposed on a substrate and used to mate with a plug connector. The plug connector has a plurality of coaxial cables. The receptacle connector comprises a housing assembly, a plurality of contacts and a sliding cover. The housing assembly has a sliding track portion. The contacts are held by a rear end of the housing assembly, and each contact has a terminal portion extending beyond the rear end of the housing assembly. The sliding cover is disposed in the slide track portion and is configured to slide horizontally along the slide track portion. When the plug connector is inserted into the receptacle connector, the plug connector pushes the sliding cover to slide horizontally along the slide track portion so the covering portion is configured to cover the terminal portions to form an electromagnetic shielding effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:插座型連接器</p>
        <p type="p">301:殼體組件</p>
        <p type="p">310:絕緣殼體</p>
        <p type="p">312:滑軌部</p>
        <p type="p">314:扣件</p>
        <p type="p">320:插座頂殼</p>
        <p type="p">322:延伸端面</p>
        <p type="p">324:止退件</p>
        <p type="p">330:插座底殼</p>
        <p type="p">342:終端部</p>
        <p type="p">350:旋轉桿</p>
        <p type="p">360:滑動上蓋</p>
        <p type="p">362:前緣部</p>
        <p type="p">364:覆蓋部</p>
        <p type="p">366:延伸臂</p>
        <p type="p">368:翼部</p>
        <p type="p">369:導引槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="282" publication-number="202619402">
    <tif-files tif-type="multi-tif">
      <tif file="113140009.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>LED驅動電路、LED驅動方法、LED顯示器及電子裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241223B">H05B45/30</main-classification>
        <further-classification edition="201601120241223B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王千</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張漢儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉計平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種LED驅動電路，用以驅動一LED燈珠陣列，具有：一主控單元，用以產生一顯示資料信號；一列驅動電路，用以依該顯示資料信號同步產生多個輸出通道電流及一行掃描控制信號；以及一行掃描控制電路，用以依該列驅動電路所提供之該行掃描控制信號之驅動對該LED燈珠陣列進行一逐行啟用操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟a:利用該主控單元產生一顯示資料信號</p>
        <p type="p">步驟b:驅使該列驅動電路依該顯示資料信號同步產生多個輸出通道電流及一行掃描控制信號</p>
        <p type="p">步驟c:驅使該行掃描控制電路依該列驅動電路所提供之該行掃描控制信號之驅動對該LED燈珠陣列進行一逐行啟用操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="283" publication-number="202617216">
    <tif-files tif-type="multi-tif">
      <tif file="113140019.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保健裝置及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">A61N5/00</main-classification>
        <further-classification edition="200601120241030B">A61N5/01</further-classification>
        <further-classification edition="200601120241030B">A61N5/06</further-classification>
        <further-classification edition="200601120241030B">A61H39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李洲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN OASIS TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾錦松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIN-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾旭暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HSU-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾獻慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HSIEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種保健裝置，用以對脊椎或肚臍傳送低頻波，以增加內皮前驅細胞(EPC)的數量及減少循環內皮細胞(CEC)的數量，可以減少心血管相關不良事件風險的發生。保健裝置包含箱體及設置於箱體中的電源、速度控制器、轉動機構、連桿機構、敲擊器以及錐形臺。電源與速度控制器電性連接，以輸出電力至速度控制器。速度控制器與轉動機構電性連接，並以一預定速度控制轉動機構轉動。轉動機構透過連桿機構與敲擊器連接，以驅動敲擊器敲擊錐形臺之一平面，且敲擊器產生一預定頻率之一低頻波。本發明還提供保健裝置可應用於對脊椎或肚臍傳送低頻波之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:保健裝置</p>
        <p type="p">21:箱體</p>
        <p type="p">211:金屬背板</p>
        <p type="p">22:電源</p>
        <p type="p">23:速度控制器</p>
        <p type="p">24:轉動機構</p>
        <p type="p">241:馬達</p>
        <p type="p">242:凸輪</p>
        <p type="p">25:連桿機構</p>
        <p type="p">251:連桿</p>
        <p type="p">26:敲擊器</p>
        <p type="p">261:柱體</p>
        <p type="p">262:錐體</p>
        <p type="p">263:振動件</p>
        <p type="p">27:錐形臺</p>
        <p type="p">271:錐形臺平面</p>
        <p type="p">W:低頻波</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="284" publication-number="202618755">
    <tif-files tif-type="multi-tif">
      <tif file="113140028.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示系統、顯示方法以及訓練系統</chinese-title>
        <english-title>DISPLAY SYSTEM, DISPLAY METHOD, AND TRAINING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G09G3/36</main-classification>
        <further-classification edition="202201120241104B">G06V10/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳汧柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CIAN-ROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊昇儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示系統、顯示方法以及訓練系統，顯示方法包含：由分類模組接收影像，並且基於影像獲得影像的場景分類；以及由過驅動模組基於場景分類，選擇至少一過驅動查找表以發出過驅動訊號（overdrive signal）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display system, a display method, and training system are presented. The display method comprising: receiving an image by a classification module and obtaining at least one scene classification of the image based on the image; and selecting at least one overdrive lookup table by an overdrive module based on the at least one scene classification to send an overdrive signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示系統</p>
        <p type="p">101:分類模組</p>
        <p type="p">102:過驅動模組</p>
        <p type="p">103:影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="285" publication-number="202618418">
    <tif-files tif-type="multi-tif">
      <tif file="113140029.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250121B">G02F1/1333</main-classification>
        <further-classification edition="200601120250121B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向庭萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIANG, TING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張佑聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳博斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括外框、背光模組及顯示面板。背光模組設於外框內，背光模組具有背光組件及背框，背光組件設於背框上，背框及外框間具有間隙。顯示面板經由第一膠體黏貼於外框，並位於背光模組相對側。第二膠體沿著外框貼附於背框與顯示面板，且遮蔽間隙，第二膠體的一端貼附於背框，第二膠體的另一端貼附於顯示面板，第二膠體具有切槽，切槽使位於切槽處之間隙外露並與外部相連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display includes an outer frame, a backlight module and a display panel. The backlight module is arranged in the outer frame. The backlight module has a backlight component and a back frame. The backlight component is arranged on the back frame, and there is a gap between the back frame and the outer frame. The display panel is attached to the outer frame through the first tape and is located on the opposite side of the backlight module. The second tape is attached to the back frame and the display panel along the outer frame and covers the gap. One end of the second tape is attached to the back frame. The other end of the second tape is attached to the display panel. The second tape has a cut groove, and the cut groove exposes the gap at the cut groove and communicates with the outside.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:外框</p>
        <p type="p">111:支撐部</p>
        <p type="p">130:背光模組</p>
        <p type="p">131:背框組件</p>
        <p type="p">132:背框</p>
        <p type="p">150:顯示面板</p>
        <p type="p">170:第一膠體</p>
        <p type="p">190:第二膠體</p>
        <p type="p">C:氣流通道</p>
        <p type="p">S:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="286" publication-number="202618525">
    <tif-files tif-type="multi-tif">
      <tif file="113140031.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控板裝置</chinese-title>
        <english-title>TOUCHPAD DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, PO-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖韋齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控板裝置包括基板、觸控面板及觸發件。基板具有頂面。觸控面板設置於基板的頂面上方且位於一高度位置，觸控面板具有面向頂面之底面，底面上具有開關，開關具有受壓部。觸發件設置於開關與基板之間，觸發件固定於頂面且包括抵壓片與彈性緩衝層。其中，觸控面板可由高度位置朝基板移動至觸發位置，觸控面板位於觸發位置時，抵壓片直接抵壓受壓部而觸發開關，且彈性緩衝層受到開關抵壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touchpad device includes a substrate, a touch panel and a trigger element. The substrate has a top surface. The touch panel is disposed above the top surface of the substrate and is located at a height position. The touch panel has a bottom surface facing the top surface and a switch on the bottom surface. The switch has a pressure-receiving portion. The trigger element is disposed between the switch and the substrate. The trigger element is fixed on the top surface and includes a pressing sheet and an elastic buffer layer. The touch panel can move from the height position toward the substrate to a triggering position. When the touch panel is at the triggering position, the pressing sheet directly presses the pressure-receiving portion to trigger the switch, and the elastic buffer layer is pressed by the switch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:觸控板裝置</p>
        <p type="p">10:基板</p>
        <p type="p">11:頂面</p>
        <p type="p">15:間隔件</p>
        <p type="p">20:觸控面板</p>
        <p type="p">23:底面</p>
        <p type="p">231:第一側</p>
        <p type="p">232:第二側</p>
        <p type="p">25:開關</p>
        <p type="p">265:受壓部</p>
        <p type="p">30:觸發件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="287" publication-number="202618627">
    <tif-files tif-type="multi-tif">
      <tif file="113140032.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能維運管理平台的運作方法</chinese-title>
        <english-title>OPERATION METHOD FOR SOLAR ENERGY MAINTENANCE AND MANAGEMENT PLATFORM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q10/06</main-classification>
        <further-classification edition="201401120250203B">H02S50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>微電能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRO ELECTRICITY CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷翊慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, YI-ZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-AO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林筵捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-HIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之發明揭露一種太陽能維運管理平台的運作方法，包含下列步驟：一第一步驟，建立一異常判斷模型，並根據複數個太陽能模組之數量與空間配置參數以及複數個逆變器之間的差異進行正規化步驟，判斷異常設備；一第二步驟，根據即時氣象資料建立一虛擬日照計；一第三步驟，根據正規化之該異常判斷模型與該虛擬日照計所得之異常及發電損失，太陽能維運管理平台自動生成一派工清單；以及一第四步驟，利用混合整數線性規劃（MILP）建立一派工模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operation method for a solar energy maintenance and management platform, including the following steps. In a first step, an abnormality judgment model is established, and a normalization step is performed based on the number of solar modules, space configuration parameters, and the difference between multiple inverters, thereby determining abnormal equipment. In a second step, a virtual insolation meter is established based on real-time meteorological data. In a third step, the solar maintenance and operation management platform automatically generates a dispatch list based on the normalized anomaly judgment model, the abnormality obtained by the virtual insolation meter, and power generation loss. Furthermore, in a fourth step, a dispatch model is established using mixed integer linear programming (MILP).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="288" publication-number="202619252">
    <tif-files tif-type="multi-tif">
      <tif file="113140035.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換器及其控制方法</chinese-title>
        <english-title>POWER CONVERTER AND METHOD OF CONTROLLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H02M3/156</main-classification>
        <further-classification edition="200601120250122B">H02M1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林陳琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源轉換器包括變壓器、諧振電路、第一開關與第二開關、輸入偵測電路、輸出偵測電路以及控制器。第一開關與第二開關共接於節點，且節點耦接諧振電路，獲得相應電源轉換器的輸出電壓的第一輸出電壓資訊。輸入偵測電路耦接第一開關，獲得相應電源轉換器的輸入電壓的輸入電壓資訊。輸出偵測電路獲得相應輸出電壓的第二輸出電壓資訊。控制器接收第一輸出電壓資訊、第二輸出電壓資訊以及輸入電壓資訊，且根據第一輸出電壓資訊、第二輸出電壓資訊以及輸入電壓資訊控制第一開關與第二開關的導通或關斷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power converter includes a transformer, a resonant circuit, a first switch, a second switch, an input detection circuit, an output detection circuit, and a controller. The first switch and the second switch are jointly connected at a node, and the node is coupled to the resonant circuit to acquire a first output voltage information corresponding to an output voltage of the power converter. The input detection circuit is coupled to the first switch to acquire an input voltage information according to an input voltage of the power converter. The output detection circuit acquires a second output voltage information corresponding to the output voltage. The controller receives the first output voltage information, the second output voltage information, and the input voltage information to turn on or turn off the first switch and the second switch according to the first output voltage information, the second output voltage information, and the input voltage information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:變壓器</p>
        <p type="p">20:諧振電路</p>
        <p type="p">30:輸入偵測電路</p>
        <p type="p">40:輸出偵測電路</p>
        <p type="p">100:控制器</p>
        <p type="p">Q&lt;sub&gt;H&lt;/sub&gt;:第一開關</p>
        <p type="p">Q&lt;sub&gt;L&lt;/sub&gt;:第二開關</p>
        <p type="p">Np:初級側繞組</p>
        <p type="p">Ns:次級側繞組</p>
        <p type="p">Na:輔助繞組</p>
        <p type="p">Cr:諧振電容</p>
        <p type="p">Lm:激磁電感</p>
        <p type="p">Lr:漏感</p>
        <p type="p">N&lt;sub&gt;HB&lt;/sub&gt;:節點</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vo:輸出電壓</p>
        <p type="p">V&lt;sub&gt;GND&lt;/sub&gt;:接地電壓</p>
        <p type="p">V&lt;sub&gt;S&lt;/sub&gt;:輸入電壓資訊</p>
        <p type="p">V&lt;sub&gt;HB&lt;/sub&gt;:第一輸出電壓資訊</p>
        <p type="p">V&lt;sub&gt;ZCD&lt;/sub&gt;:第二輸出電壓資訊</p>
        <p type="p">Va:輔助電壓</p>
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;:第一電阻</p>
        <p type="p">R&lt;sub&gt;2&lt;/sub&gt;:第二電阻</p>
        <p type="p">R&lt;sub&gt;3&lt;/sub&gt;:第三電阻</p>
        <p type="p">R&lt;sub&gt;4&lt;/sub&gt;:第四電阻</p>
        <p type="p">S&lt;sub&gt;QH&lt;/sub&gt;:第一開關控制信號</p>
        <p type="p">S&lt;sub&gt;QL&lt;/sub&gt;:第二開關控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="289" publication-number="202618177">
    <tif-files tif-type="multi-tif">
      <tif file="113140036.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無煙囪焚燒系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F23G5/44</main-classification>
        <further-classification edition="200601120241230B">F23G7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李季砡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李季砡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無煙囪焚燒系統，其包括一第一室體、一第二室體及兩者之間的排煙連接管，第一室體內有至少一焚燒槽以焚燒待燃物並將燃燒廢氣經由排煙連接管排放至第二室體，第二室體有噴水管及複數懸吊吸附板將有害粒子捕捉成為汙泥並沉積於第二室體之斜底最低處再抽出，汙泥可再經高溫焚燒分解有害物質，第一室體可有進氣口、投放口、排煙口及推擠單元來進行焚燒過程，並可有動力犁翻攪待燃物確保完全燃燒；依據不同的待燃物第一室體可分隔成複數焚燒槽，各焚燒槽之間可用間隔柱隔開確保空氣對流，第一室體之頂端可加上水槽吸收焚燒熱量產生蒸氣經由蒸氣錐形管通往發電機，水槽有朝下延伸懸吊水箱增加吸熱效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一室體</p>
        <p type="p">12:投放口</p>
        <p type="p">31:蒸氣錐形管</p>
        <p type="p">4:第二室體</p>
        <p type="p">44:噴水管</p>
        <p type="p">5:排煙連接管</p>
        <p type="p">61:推桿</p>
        <p type="p">81:出灰口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="290" publication-number="202618628">
    <tif-files tif-type="multi-tif">
      <tif file="113140038.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堰塞壩危險程度量化分級評估方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241223B">G06Q10/06</main-classification>
        <further-classification edition="202401120241223B">G06Q50/26</further-classification>
        <further-classification edition="200601120241223B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昆廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種堰塞壩危險程度量化分級評估方法，包含：執行無因次化的一第一至一第M危險評估指標的評估流程，以產生對應於該堰塞壩的該第一至該第M危險評估指標值；接收對應於一第一至一第N堰塞壩的一第一至一第N組堰塞壩物理參數值，並將其全體分別輸入至該第一至該第M評估流程，得到對應該第一堰塞壩的一第一至一第M危險評估指標值乃至對應該第N堰塞壩的一第一至一第M危險評估指標值；對該第一至該第N堰塞壩的該第一危險評估指標值進行一分級運算，以得到針對該第一危險評估指標值的一第一危險評估指標量化分級，其係可套用於一堰塞壩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:堰塞壩壩體剖面</p>
        <p type="p">20:河道</p>
        <p type="p">A:壩體頂部</p>
        <p type="p">B:壩體上游底部端點</p>
        <p type="p">C:壩體頂部A在壩體底部&lt;img align="absmiddle" height="19px" width="26px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"/&gt;的投影</p>
        <p type="p">D:壩體下游底部端點</p>
        <p type="p">E:通過壩體頂部A的水平線與壩體底部&lt;img align="absmiddle" height="18px" width="28px" file="d10002.TIF" alt="其他非圖式ed10002.png" img-content="character" orientation="portrait" inline="no" giffile="ed10002.png"/&gt;延伸的上游河道的交點</p>
        <p type="p">
        &lt;i&gt;H&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;Dmin&lt;/i&gt;
        &lt;/sub&gt;:崩塌最小堆積高度</p>
        <p type="p">
        &lt;i&gt;H&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;Wmax&lt;/i&gt;
        &lt;/sub&gt;:壩體最大蓄水深度</p>
        <p type="p">
        &lt;i&gt;W&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;d&lt;/i&gt;
        &lt;/sub&gt;:壩體下游底部寬度</p>
        <p type="p">
        &lt;i&gt;W&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;u&lt;/i&gt;
        &lt;/sub&gt;:壩體上游底部寬度</p>
        <p type="p">
        &lt;i&gt;W&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;D&lt;/i&gt;
        &lt;/sub&gt;:壩體底部寬度</p>
        <p type="p">Φ&lt;sub&gt;&lt;i&gt;d&lt;/i&gt;&lt;/sub&gt;:壩體下游面坡度</p>
        <p type="p">Φ&lt;sub&gt;&lt;i&gt;u&lt;/i&gt;&lt;/sub&gt;:壩體上游面坡度</p>
        <p type="p">θ&lt;sub&gt;&lt;i&gt;r&lt;/i&gt;&lt;/sub&gt;:河道坡度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="291" publication-number="202618259">
    <tif-files tif-type="multi-tif">
      <tif file="113140039.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140039</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>捲帶式電子零件檢查系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241024B">G01N21/956</main-classification>
        <further-classification edition="202201120241024B">G06V10/70</further-classification>
        <further-classification edition="200601120241024B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣銓科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范萬淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種捲帶式電子零件檢查系統，包含一檢測裝置及一電腦，該檢測裝置包含一相機及與該相機電性連接的一雷射感測器，該相機透過該雷射感測器觸發拍攝，以產生分別包含有一電子零件的複數影像畫面，該電腦電性連接該相機以接收該複數影像畫面，該電腦判斷各該影像畫面中的電子零件的一相似度與一相似度閾值之關係，並將相似度異常的該電子零件的編號儲存至一相似度異常清單，使從業人員能根據該相似度異常清單挑選出異常的電子零件，本發明無須透過人力檢查各該電子零件的外觀，可避免人為誤判的可能性並減少整體檢查所需的時間及人力成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:檢測裝置</p>
        <p type="p">11:雷射感測器</p>
        <p type="p">12:相機</p>
        <p type="p">13:微控制器</p>
        <p type="p">14:馬達</p>
        <p type="p">15:馬達驅動器</p>
        <p type="p">20:電腦</p>
        <p type="p">30:顯示器</p>
        <p type="p">D1:數量資訊</p>
        <p type="p">D2:檢查報告</p>
        <p type="p">I:影像畫面</p>
        <p type="p">S1:觸發訊號</p>
        <p type="p">S2:控制訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="292" publication-number="202619165">
    <tif-files tif-type="multi-tif">
      <tif file="113140040.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及其第一電連接器構件與第二電連接器構件</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND ITS FIRST CONNECTOR COMPONENT AND SECOND CONNECTOR COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">H01R9/03</main-classification>
        <further-classification edition="200601120241030B">H01R13/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐虞企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARNG YU ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞唐虞電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN TARNG YU ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃睦容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，該電連接器係由多個電連接器構件組接而構成，所述多個電連接器構件的形體或尺寸可客製化設計，因此，在電連接器設計完成後，仍然可以藉由調整組接的多個電連接器構件，而達成客製化調整電連接器的形體或尺寸，以使電連接器的形體或尺寸可靈活適應電子設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector, which is composed of multiple connector components that can be assembled together. The shape or size of these components can be customized. Thus, even after the design of the electrical connector is completed, the shape or size of the connector can still be custom-adjusted by modifying the assembly of the components, allowing the connector to flexibly adapt to the electronic device's requirements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電連接器</p>
        <p type="p">11:第一電連接器構件</p>
        <p type="p">12:第二電連接器構件</p>
        <p type="p">120:第二電連接器構件膠芯</p>
        <p type="p">2:第一搭接構件</p>
        <p type="p">3:第二搭接構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="293" publication-number="202619179">
    <tif-files tif-type="multi-tif">
      <tif file="113140041.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及其母端電連接器構件與公端電連接器構件</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND ITS FEMALE CONNECTOR COMPONENT AND MALE CONNECTOR COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">H01R13/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐虞企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARNG YU ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞唐虞電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN TARNG YU ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃睦容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，該電連接器係由多個電連接器構件組接而構成，所述多個電連接器構件的形體或尺寸可客製化設計，因此，在電連接器設計完成後，仍然可以藉由調整組接的多個電連接器構件，而達成客製化調整電連接器的形體或尺寸，以使電連接器的形體或尺寸可靈活適應電子設備的使用，而滿足電子設備的特殊需求及發展。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector, wherein the connector is assembled from multiple connector components. The shape or size of these connector components can be customized. Therefore, even after the electrical connector design is completed, customization of the connector’s shape or size can still be achieved by adjusting the assembly of the components. This allows the shape or size of the electrical connector to flexibly adapt to the usage of electronic devices, thereby meeting the special requirements and development needs of the electronic equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電連接器</p>
        <p type="p">110:母端絕緣膠芯</p>
        <p type="p">3:公端搭接構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="294" publication-number="202618609">
    <tif-files tif-type="multi-tif">
      <tif file="113140042.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建築及土地相關行業適用法規之智能應答系統</chinese-title>
        <english-title>INTELLIGENT RESPONSE SYSTEM FOR REGULATIONS APPLICABLE TO ARCHITECTURE AND LAND-RELATED INDUSTRIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241223B">G06F40/40</main-classification>
        <further-classification edition="200601120241223B">G06F17/16</further-classification>
        <further-classification edition="201201120241223B">G06Q50/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝亦廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝亦廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯明憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種建築及土地相關行業適用法規之智能應答系統，其係運作於一計算機上，且包含有一資料處理模組、一文字處理模組、一向量資料庫，以及一文字互動模組；其中該資料處理模組用以接收一初始文本，並將其處理成一文本資料；該文字處理模組與該資料處理模組資訊相連，用以接收該文本資料，並將其中所包含的複數文字整理為複數向量資料；該向量資料庫與該文字處理模組資訊相連，用以接收並儲存該些向量資料；該文字互動模組與該向量資料庫資訊相連，且可接受一自然語言提問，並根據該自然語言提問搜尋該向量資料庫，據以生成一自然語言答覆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent response system for regulations applicable to the construction and land-related industries, which operates on a computer and includes a data processing module, a text processing module, a vector database, and a text interaction module. The data processing module is adapted to receive raw text and process it into text data. The text processing module, connected to the data processing module, is adapted to receive the text data and organize multiple words contained within it into multiple vector data. The vector database, connected to the text processing module, is adapted to receive and store the vector data. The text interaction module, connected to the vector database, is adapted to accept a natural language query and search the vector database accordingly, thereby generating a natural language response.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智能應答系統</p>
        <p type="p">10:資料處理模組</p>
        <p type="p">12:光學辨識模組</p>
        <p type="p">14:語句文字資料庫</p>
        <p type="p">20:文字處理模組</p>
        <p type="p">30:向量資料庫</p>
        <p type="p">40:文字互動模組</p>
        <p type="p">50:使用者回饋模組</p>
        <p type="p">C:計算機</p>
        <p type="p">R:初始文本</p>
        <p type="p">R1:政府法規文本</p>
        <p type="p">R2:專家經驗文本</p>
        <p type="p">D:文本資料</p>
        <p type="p">W:文字</p>
        <p type="p">V:向量資料</p>
        <p type="p">Q:自然語言提問</p>
        <p type="p">A:自然語言答覆</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="295" publication-number="202617604">
    <tif-files tif-type="multi-tif">
      <tif file="113140049.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硫酸銨熱裂解反應系統及其方法</chinese-title>
        <english-title>AMMONIUM SULFATE THERMAL CRACKING REACTION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241025B">C01C1/02</main-classification>
        <further-classification edition="200601120241025B">C01C1/246</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金兆鎔科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN JOIN RONE TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳春翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳一天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昶均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHANG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊必愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, PI-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾堯宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何宗運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, ZONG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種硫酸銨熱裂解反應系統及其方法。系統包含第一裂解反應單元、第二裂解反應單元、氨氣收集單元。第一裂解反應單元用以接收硫酸銨固料及金屬載氧體，以產生混合物料，並以150°C至350°C的起始熱裂解溫度進行熱裂解，以產生裂解反應產物及包含氨氣的第一裂解氣體。金屬載氧體為過渡金屬氧化物，且裂解反應產物為硫酸鹽。第二裂解反應單元用以接收裂解反應產物，並以350°C至700°C的高溫熱裂解溫度對裂解反應產物進行熱裂解，以將過渡金屬氧化物還原。氨氣收集單元用以接收第一裂解氣體，從而形成經純化的氨氣氣體產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ammonium sulfate thermal cracking reaction system and method thereof are disclosed. The system comprises a first cracking reaction unit, a second cracking reaction unit, and an ammonia collection unit. The first cracking reaction unit is configured to receive ammonium sulfate solid material and a metal oxygen carrier to produce a mixed material. The first cracking reaction unit performs thermal cracking at an initial thermal cracking temperature of 150°C to 350°C, generating a cracking reaction product and a first cracking gas containing ammonia. The metal oxygen carrier is a transition metal oxide, and the cracking reaction product is a sulfate. The second cracking reaction unit is configured to receive the cracking reaction product and performs thermal cracking at a high thermal cracking temperature of 350°C to 700°C to reduce the transition metal oxide from the cracking reaction product. The ammonia collection unit is configured to receive the first cracking gas, thereby forming a purified ammonia gas product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">E:硫酸銨熱裂解反應系統</p>
        <p type="p">1:第一裂解反應單元</p>
        <p type="p">11M:預熱區段</p>
        <p type="p">11A:第一熱裂解區段</p>
        <p type="p">Tc1:第一熱裂解溫度</p>
        <p type="p">11B:第二熱裂解區段</p>
        <p type="p">Tc2:第二熱裂解溫度</p>
        <p type="p">2:第二裂解反應單元</p>
        <p type="p">Tc3:第三熱裂解溫度</p>
        <p type="p">Tc4:第四熱裂解溫度</p>
        <p type="p">3:氨氣收集單元</p>
        <p type="p">D:推料方向</p>
        <p type="p">F1:硫酸銨固料</p>
        <p type="p">F2:金屬載氧體</p>
        <p type="p">F3:鹼性吸收劑</p>
        <p type="p">Fm:混合物料</p>
        <p type="p">Fp:裂解反應產物</p>
        <p type="p">Fr:金屬載氧體迴流</p>
        <p type="p">H1:第一加熱源</p>
        <p type="p">H2:第二加熱源</p>
        <p type="p">Hr:反應餘熱迴流</p>
        <p type="p">G1:第一裂解氣體</p>
        <p type="p">G2:第二裂解氣體</p>
        <p type="p">Ps:石膏固體產物</p>
        <p type="p">Pg:氨氣氣體產物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="296" publication-number="202618310">
    <tif-files tif-type="multi-tif">
      <tif file="113140055.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以測試人機介面的方法及人機介面測試裝置</chinese-title>
        <english-title>METHOD FOR TESTING HUMAN MACHINE INTERFACE AND HUMAN MACHINE INTERFACE TEST APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250122B">G01R31/01</main-classification>
        <further-classification edition="202201120250122B">G06V20/60</further-classification>
        <further-classification edition="202201120250122B">G06V10/10</further-classification>
        <further-classification edition="200601120250122B">B25J19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳殿河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TIEN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韋勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林仁德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, REN-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種用以測試HMI的方法。該方法包括拍攝HMI的顯示器所顯示的頁面的影像，以取得第一影像集；對第一影像集中的影像進行預處理以產生第二影像集；使用第二影像集訓練第一影像辨識模型；使用第一影像辨識模型產生第二影像辨識模型；拍攝待測HMI的顯示器所顯示的頁面的影像，以取得一系列的測試影像；以及使用第二影像辨識模型比較每一測試影像與所對應的正確影像，以判斷待測HMI是否正常運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a method for testing HMI. The method includes capturing images of the pages displayed on a display of the HMIs to obtain a first image set; pre-processing the images in the first image set to generate a second image set; training a first image identification model using the second image set; generating a second image identification model using the first image identification model; capturing images of the pages displayed on a display of a test HMI to obtain a series of test images; and comparing each of the test images with a corresponding correct image using the second image identification model to determine whether the test HMI function normally.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:方法</p>
        <p type="p">S21~S26:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="297" publication-number="202617474">
    <tif-files tif-type="multi-tif">
      <tif file="113140058.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140058</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車燈控制方法和設備</chinese-title>
        <english-title>BEAM CONTROL METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">B60Q1/076</main-classification>
        <further-classification edition="200601120241226B">B60Q1/08</further-classification>
        <further-classification edition="201801120241226B">F21S41/60</further-classification>
        <further-classification edition="201801320241226B">F21W102/10</further-classification>
        <further-classification edition="201801320241226B">F21W107/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳力維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秀美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慧珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井民全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JING, MING-CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種車燈控制方法。車燈控制方法適用配置在車輛中的車燈控制設備。車燈控制方法可包括以下步驟：藉由車燈控制設備取得一影像；藉由車燈控制設備之先進駕駛輔助系統 ，根據上述影像，判斷是否在車輛前偵測到至少一行人；當在車輛前偵測到至少一行人時，藉由車燈控制設備之一車燈控制裝置 ，從先進駕駛輔助系統取得行人之行人資訊和車輛之車速資訊，並根據行人資訊和車速資訊，判斷是否啟動禮讓模式；以及當車燈控制裝置啟動禮讓模式時，藉由車燈控制裝置，根據行人資訊，控制車燈控制設備之一車燈裝置之顯示態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A beam control method is provided in the invention. The beam control method. The beam control method may be applied to a beam control apparatus configured in a car. The bean control method may comprise the following steps. The beam control apparatus may obtain an image. The Advanced Driver Assistance Systems (ADAS) of the beam control apparatus may determine whether there is any pedestrian in the front of the car according to the image. When there is at least one pedestrian in the front of the car, the beam control device of the beam control apparatus may obtain the pedestrian information and the speed information of the car from the ADAS, and determine whether to enable a polite mode according to the pedestrian information and the speed information. When the beam control device enables the polite mode, the beam control device may control the display pattern of the beam device according to the pedestrian information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:流程圖</p>
        <p type="p">S910~S940:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="298" publication-number="202618107">
    <tif-files tif-type="multi-tif">
      <tif file="113140062.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>格子板結構、樓地板結構及樓地板之施工方法</chinese-title>
        <english-title>WAFFLE SLAB STRUCTURE, FLOOR SLAB AND METHOD FOR CONSTRUCTING FLOOR SLAB</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241225B">E04B5/43</main-classification>
        <further-classification edition="200601120241225B">E04C2/42</further-classification>
        <further-classification edition="200601120241225B">E04G15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潤弘精密工程事業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUENTEX ENGINEERING &amp; CONSTRUCTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹衍樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹昌盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHANG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳秀琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於格子板結構、樓地板結構及樓地板之施工方法。該格子板結構包含複數個格子板及至少一梁。該複數個格子板沿著一縱軸方向排列，並以串連方式連接，且該複數個格子板之各者包含複數個孔洞於其中。該至少一梁之每一者包含一上側及相對於該上側之一下側，該上側設置於與該梁相鄰之兩個格子板之間，並與該相鄰之兩個格子板一體成形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The subject disclosure relates to a waffle slab structure, floor slab and method for constructing a floor slab. The waffle slab structure comprises a plurality of waffle slabs and at least one beam. The plurality of waffle slabs are connected in series along a longitudinal axis. Each of the plurality of waffle slabs comprises a plurality of through holes therein. Each of the at least one beam comprises an upper side and a bottom side opposite to the upper side. The upper side of the beam is arranged between two adjacent waffle slabs and is integrated with the two adjacent waffle slabs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:格子板結構</p>
        <p type="p">11:格子板</p>
        <p type="p">111:孔洞</p>
        <p type="p">112:橫向鋼筋</p>
        <p type="p">12:梁</p>
        <p type="p">121:上側</p>
        <p type="p">13:鋼筋籠</p>
        <p type="p">14:縱向鋼筋</p>
        <p type="p">19:缺口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="299" publication-number="202617097">
    <tif-files tif-type="multi-tif">
      <tif file="113140090.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>骨釘固定桿與其操控結構</chinese-title>
        <english-title>BONE SCREW FIXING ROD MANIPULATION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">A61B17/58</main-classification>
        <further-classification edition="200601120241125B">A61B17/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚品醫療器材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANPIN MEDTAK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾峰毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUANG, FON-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊昌蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHANG CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣岳夆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YUEH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉柏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>管哲雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, CHE-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒純忻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種骨釘固定桿與其操控結構，其包括骨釘固定桿、固定件、移動件以及握持部；所述固定件具有相對的第一前端及第一末端，所述第一前端設置有凹槽用以容置並固定所述骨釘固定桿，所述移動件具有相對的第二前端及第二末端，所述第二前端設置有缺口，用以限位並移動所述骨釘固定桿，所述第二末端設置有第一螺紋，所述握持部具有容置空間以及旋轉部，所述容置空間用以容納所述固定件的所述第一末端以及所述移動件的所述第二末端，且其側壁設置有與所述第一螺紋嵌合的第二螺紋，所述旋轉部與所述第二末端接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bone screw fixing rod manipulation structure is provided, which includes a bone screw fixing rod, a fixing member, a moving member and a gripping part. The fixing member has a first front end and a first distal end opposite to each other, the first front end is provided with a groove for accommodating and fixing the bone screw fixing rod, and the first distal end is provided with a first thread. The moving member has a second front end and a second distal end opposite to each other, the second front end is provided with a notch for accommodating and moving the bone screw fixing rod, and the second distal end is provided with a second thread engaged with the first thread. The gripping part has an accommodating space and a rotating member, the accommodating space is used for accommodating the first distal end of the fixing member and the second distal end of the moving member, and the rotating member is connected with the second distal end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:骨釘固定桿與其操控結構</p>
        <p type="p">2:骨釘固定桿</p>
        <p type="p">3:固定件</p>
        <p type="p">4:移動件</p>
        <p type="p">5:握持部</p>
        <p type="p">6:第一前端</p>
        <p type="p">7:第一末端</p>
        <p type="p">9:第二前端</p>
        <p type="p">10:第二末端</p>
        <p type="p">12:第一螺紋</p>
        <p type="p">13:容置空間</p>
        <p type="p">14:旋轉部</p>
        <p type="p">15:第二螺紋</p>
        <p type="p">16:線型溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="300" publication-number="202618692">
    <tif-files tif-type="multi-tif">
      <tif file="113140093.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>根據魚類胚胎影像分析魚類胚胎吸收鈣離子的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM OF ANALYZING FISH EMBRYO FOR ABSORBING CALCIUM IONS BASED ON FISH EMBRYO IMAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241125B">G06T7/00</main-classification>
        <further-classification edition="202301120241125B">G06N3/08</further-classification>
        <further-classification edition="200601120241125B">G01N21/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林豊益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪君琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG, JIUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高悅慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YUEH-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種根據魚類胚胎影像分析魚類胚胎吸收鈣離子的方法，首先準備M組待測魚類胚胎，各組待測魚類胚胎包含N個經過相對應的一待測液體處理一預設時數的魚類胚胎，再由顯微攝影裝置逐一拍攝各組待測魚類胚胎的N個魚類胚胎的頭部，而產生與M組待測魚類胚胎對應的M組影像資料，各組影像資料包含N個魚類胚胎頭部影像，並由電腦裝置分析各組影像資料包含的N個魚類胚胎頭部影像，以辨識各該魚類胚胎頭部的耳石囊面積、前耳石面積及後耳石面積，並據此計算得到與M組待測魚類胚胎對應的M個平均耳石比值，該M個平均耳石比值反應M組待測魚類胚胎吸收鈣離子的能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of analyzing fish embryo for absorbing calcium ions based on fish embryo images, which includes first preparing M groups of fish embryos to be tested, each group of fish embryos to be tested includes N fish embryos that have been treated with a corresponding liquid to be tested for a preset number of hours, and then the heads of N fish embryos of each group of fish embryos to be tested are photographed one by one by a microphotography device to generate M groups of image data corresponding to the M groups of fish embryos to be tested. Each group of image data includes N fish embryo head images, and a computer device analyzes the N fish embryo head images included in each group of image data to identify the otolith sac area, anterior otolith area, and posterior otolith area of ​​each fish embryo head, and calculates accordingly M average otolith ratios corresponding to the M groups of fish embryos to be tested. The M average otolith ratios reflect the ability of the M groups of fish embryos to be tested to absorb calcium ions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="301" publication-number="202619167">
    <tif-files tif-type="multi-tif">
      <tif file="113140094.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241204B">H01R12/71</main-classification>
        <further-classification edition="200601120241204B">H01R13/502</further-classification>
        <further-classification edition="200601120241204B">H01R13/506</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器組件，包含二連接器模組以及一維持件。每一連接器模組包括一殼體單元，該等連接器模組上下設置，每一連接器模組的殼體單元包括多個沿一方向排列的插接通道。該維持件設置於該兩連接器模組的殼體單元之間，並且位於兩連接器模組的殼體單元沿該方向的兩側之間，所述維持件包括二個分別抵接該等殼體單元的限位部，防止位在上方的連接器模組的殼體單元翹曲變形，換言之，藉由維持件的設置，可維持該等殼體單元的正確尺寸，防止應用所造成的變形風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1、1’:殼體單元</p>
        <p type="p">10a:散熱通道</p>
        <p type="p">114:第一底壁</p>
        <p type="p">115:第一槽縫</p>
        <p type="p">116a:第二頂壁</p>
        <p type="p">117:第二槽縫</p>
        <p type="p">13:壁部</p>
        <p type="p">131:孔洞</p>
        <p type="p">2、2’:液冷板</p>
        <p type="p">3:維持件</p>
        <p type="p">32、33:限位部</p>
        <p type="p">321、331:彈性抵接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="302" publication-number="202618811">
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      <tif file="113140096.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路保護裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H01C7/02</main-classification>
        <further-classification edition="200601120250122B">H01C7/10</further-classification>
        <further-classification edition="200601120250122B">H01C1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富致科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUZETEC TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳繼聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JACK JIH-SANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江長鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHANG HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路保護裝置包含一PTC元件、一絕緣單元及一裝置電極單元。該PTC元件包括一PTC層、一第一PTC電極及一第二PTC電極。該PTC層具有一上表面、一下表面及兩個相反的側壁，該兩個側壁互連於該上表面及該下表面。該第一PTC電極形成在該PTC層的上表面上；該第二PTC電極形成在該PTC層的下表面上。該絕緣單元設置於該PTC元件上。該裝置電極單元形成在該絕緣單元上，並包括一第一裝置電極及一第二裝置電極。該第一裝置電極電連接於該第一PTC電極且與該兩個側壁的其中一者間隔設置；該第二裝置電極電連接於該第二PTC電極。本發明電路保護裝置的穩定性及耐久性優異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:PTC元件</p>
        <p type="p">21:PTC層</p>
        <p type="p">211:側壁</p>
        <p type="p">22:第一PTC電極</p>
        <p type="p">23:第二PTC電極</p>
        <p type="p">31:第一導電構件</p>
        <p type="p">32:第二導電構件</p>
        <p type="p">41:第一絕緣層</p>
        <p type="p">411:第一本體部</p>
        <p type="p">412:第一延伸部</p>
        <p type="p">42:第二絕緣層</p>
        <p type="p">421:第二本體部</p>
        <p type="p">422:第二延伸部</p>
        <p type="p">51:第一裝置電極</p>
        <p type="p">52:第二裝置電極</p>
        <p type="p">B1:第一面向外表面</p>
        <p type="p">B2:第二面向外表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="303" publication-number="202617874">
    <tif-files tif-type="multi-tif">
      <tif file="113140104.zip" no="1">
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      <volno>24</volno>
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          <doc-number>202617874</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具重塑性的阻燃樹脂組成物及其製備方法</chinese-title>
        <english-title>RESHAPEABLE FLAME RETARDANT RESIN COMPOSITION AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08L63/00</main-classification>
        <further-classification edition="200601120241220B">C08K5/092</further-classification>
        <further-classification edition="200601120241220B">C08K5/17</further-classification>
        <further-classification edition="200601120241220B">C08K5/5313</further-classification>
        <further-classification edition="200601120241220B">C08J3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周上智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳錦文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱芮靚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, RUEI-JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種具重塑性的阻燃樹脂組成物，其包括環氧樹脂、阻燃劑、線性二羧酸及催化劑。環氧樹脂包括雙酚A二縮水甘油醚。阻燃劑包括二羧酸結構鏈段及如式(1)所示的結構鏈段。線性二羧酸如式(2)所示。催化劑包括二正丁胺。環氧樹脂的莫耳數與阻燃劑及線性二羧酸的總莫耳數的比為1:0.9~1:1.1。        &lt;br/&gt;&lt;img align="absmiddle" height="202px" width="279px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。        &lt;br/&gt;&lt;img align="absmiddle" height="98px" width="279px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中n為4至10的整數。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a reshapeable flame retardant resin composition, which includes an epoxy resin, a flame retardant, a linear dicarboxylic acid, and a catalyst. The epoxy resin includes bisphenol A diglycidyl ether. The flame retardant includes a dicarboxylic acid structural segment and a structural segment shown in formula (1). The linear dicarboxylic acid is represented by formula (2). The catalyst includes di-n-butylamine. A ratio of a molar number of the epoxy resin to a total molar number of the flame retardant and linear dicarboxylic acid is 1:0.9~1:1.1.        &lt;br/&gt;&lt;img align="absmiddle" height="200px" width="298px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.        &lt;br/&gt;&lt;img align="absmiddle" height="93px" width="304px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, in which n is an integer from 4 to 10.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="304" publication-number="202619352">
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      <volno>24</volno>
      <isuno>9</isuno>
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        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝影機模組</chinese-title>
        <english-title>CAMERA MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241030B">H04N23/53</main-classification>
        <further-classification edition="202301120241030B">H04N23/51</further-classification>
        <further-classification edition="202301120241030B">H04N23/698</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊偉澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEI-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡惠澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HUI-TZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝影機模組，包括一外殼、一基座、多個滑勾、多個彈性件、一攝影機以及一纜線。基座設置在外殼內，並具有多個滑槽。這些滑勾分別可滑動地設置在這些滑槽內。這些彈性件分別設置在這些滑槽內並抵靠這些滑勾。攝影機具有一鏡頭模組與一旋轉柱，其中旋轉柱由鏡頭模組往基座的方向延伸並固定於基座。纜線連接攝影機並依序勾在這些滑勾上。當攝影機沿著一第一方向旋轉時，纜線隨著攝影機移動並帶動這些滑勾沿著這些滑槽滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module includes a housing, a base, a plurality of slider parts, a plurality of elastic members, a camera and a cable. The base is disposed in the housing and includes a plurality of grooves. The plurality of the slider parts are slidably disposed in the plurality of grooves respectively. The plurality of elastic members are disposed in the plurality of grooves respectively and against the plurality of slider parts. The camera includes a lens module and a rotating column, wherein the rotating column extends from the lens module toward the direction of the base and is fixed on the base. The cable is connected to the camera and hooked onto the plurality of slider parts in sequence. When the camera rotates along a first direction, the cable moves with the camera and drives the plurality of slider parts to slide along the plurality of grooves.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:攝影機模組</p>
        <p type="p">110:外殼</p>
        <p type="p">120:基座</p>
        <p type="p">120a:頂部</p>
        <p type="p">120b:底部</p>
        <p type="p">121:滑槽</p>
        <p type="p">122:卡勾</p>
        <p type="p">122a:卡勾部</p>
        <p type="p">123:開口</p>
        <p type="p">130:滑勾</p>
        <p type="p">131:滑勾部</p>
        <p type="p">140:彈性件</p>
        <p type="p">150:攝影機</p>
        <p type="p">151:鏡頭模組</p>
        <p type="p">152:旋轉柱</p>
        <p type="p">160:纜線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="305" publication-number="202619539">
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          <doc-number>202619539</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件以及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D62/10</main-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BO SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何智光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, ZHI GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體元件以及其形成方法，此半導體元件包括：高阻值阻抗層，在垂直方向介於閘極與第一金屬結構之間，其中第一金屬結構包括至少一個等電位第一金屬與至少一個非等電位第一金屬，其中等電位第一金屬與高阻值阻抗層等電位、非等電位第一金屬與高阻值阻抗層不等電位，且非等電位第一金屬與高阻值阻抗層在垂直方向不重疊，以及最小距離，介於高阻值阻抗層的邊緣與非等電位第一金屬的邊緣的水平方向之間，最小距離大於隨機缺陷的尺寸，其中水平方向與垂直方向相互垂直。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and a method of forming the same are provided. The semiconductor device includes: a high resistance impedance layer resistor between a gate and a first metal structure in a vertical direction, wherein the first metal structure comprises at least one equipotential first metal and at least one non-equipotential first metal, wherein the equipotential first metal and the high resistance impedance layer have the same potential, the non-equipotential first metal and high resistance impedance layer have not the same potential, and the non-equipotential first metal and the high resistance impedance layer do not overlap in the vertical direction, and a minimum distance, between an edge of the high resistance impedance layer and an edge of the non-equipotential first metal in a horizontal direction perpendicular to the vertical direction, is larger than a size of a random defect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">105:閘極氧化層</p>
        <p type="p">110:閘極</p>
        <p type="p">120:間隙壁</p>
        <p type="p">122:第一間隙壁</p>
        <p type="p">124:第二間隙壁</p>
        <p type="p">130:第一介電層</p>
        <p type="p">140:第二介電層</p>
        <p type="p">150:高阻值阻抗層</p>
        <p type="p">160:蓋層</p>
        <p type="p">170:第三介電層</p>
        <p type="p">180:第一蝕刻停止層</p>
        <p type="p">190:第四介電層</p>
        <p type="p">A:半導體元件</p>
        <p type="p">d:最小距離</p>
        <p type="p">DX:水平方向</p>
        <p type="p">DY:垂直方向</p>
        <p type="p">E1、E2:邊緣</p>
        <p type="p">EC、NC:接觸插塞</p>
        <p type="p">EM1:等電位第一金屬</p>
        <p type="p">M1:第一金屬結構</p>
        <p type="p">NM1:非等電位第一金屬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="306" publication-number="202617251">
    <tif-files tif-type="multi-tif">
      <tif file="113140108.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140108</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於去除氧化亞氮的觸媒及去除氧化亞氮的方法</chinese-title>
        <english-title>CATALYST FOR REMOVING NITROUS OXIDE AND METHOD OF REMOVING NITROUS OXIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B01D53/56</main-classification>
        <further-classification edition="200601120241105B">B01D53/86</further-classification>
        <further-classification edition="200601120241105B">B01J23/06</further-classification>
        <further-classification edition="200601120241105B">B01J21/10</further-classification>
        <further-classification edition="200601120241105B">B01J23/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張顓麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林弘萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭瑞翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JUI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李壽南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHOU-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉思廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SSU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於去除氧化亞氮的觸媒及去除氧化亞氮的方法，其中所述觸媒包括金屬氧化物粉末以及鐵銅化合物。鐵銅化合物附著於金屬氧化物粉末表面。金屬氧化物粉末包括氧化鋅、氧化鎂、氧化鋁、或上述之組合。鐵銅化合物中的鐵與金屬氧化物粉末中的金屬之莫耳比為1：1.3~4.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A catalyst for removing nitrous oxide and a method of removing nitrous oxide are provided. The catalyst includes metal oxide powders and an iron-copper binary compound. The Fe-Cu compound is attached to the surface of the metal oxide powders, wherein the metal oxide powders includes zinc oxide, magnesium oxide, aluminum oxide, or a combination thereof. The molar ratio of iron in the Fe-Cu compound to the metal in the metal oxide powders is 1 : 1.3-4.0.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="307" publication-number="202618820">
    <tif-files tif-type="multi-tif">
      <tif file="113140110.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140110</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>陣列式積層陶瓷電容</chinese-title>
        <english-title>ARRAY TYPE MULTI-LAYER CERAMIC CAPACITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">H01G4/30</main-classification>
        <further-classification edition="200601120241226B">H01G4/12</further-classification>
        <further-classification edition="200601120241226B">H01G4/005</further-classification>
        <further-classification edition="200601120241226B">H01G4/228</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國巨股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGEO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉炘彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫惠怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, HUI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種陣列式積層陶瓷電容，包含積層磚及數個端電極對。積層磚包含陶瓷體及數個內電極組。陶瓷體具有上、下表面及相對之第一與第二端面。各內電極組包含數個第一與第二內電極彼此交替。第一與第二內電極分別自第一與第二端面延伸。第一與第二內電極均包含相接之第一及第二部分。第一部分包含依序連接之第一至第四側面。第一至第三側面分別在上表面、第一或第二端面、與下表面露出。第二部分未露出。端電極對對應設於內電極組上。各端電極對包含第一與第二端電極。第一與第二端電極分別延伸覆蓋第一與第二內電極之第一部分之第一至第三側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An array type multi-layer ceramic capacitor includes a multi-layer brick and plural terminal electrode pairs. The multi-layer brick includes a ceramic body and plural internal electrode groups. The ceramic body has an upper surface and a lower surface, and a first end surface and a second end surface that are opposite to each other. Each of the internal electrode groups includes plural first second internal electrodes and second internal electrodes alternating with each other. The first internal electrodes and the second internal electrodes respectively extend from the first end surface and the second end surface. Each of the first internal electrodes and the second internal electrodes includes a first portion and a second portion connected to each other. The first portion includes first to fourth side surfaces connected in sequence. The first to third side surfaces are respectively exposed on the upper surface, the first or second end surface, and the lower surface. The second portion is not exposed. The terminal electrode pairs are correspondingly disposed on the internal electrode groups. Each of the terminal electrode pairs includes a first second terminal electrode and a second terminal electrode. The first terminal electrode and the second terminal electrode respectively extend to cover the first side surface to the third side surface of the first portions of the first second internal electrode and the second internal electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:陣列式積層陶瓷電容</p>
        <p type="p">200:積層磚</p>
        <p type="p">210:陶瓷體</p>
        <p type="p">211:上表面</p>
        <p type="p">213:第一端面</p>
        <p type="p">215:第一側面</p>
        <p type="p">300:端電極對</p>
        <p type="p">302:第一端電極</p>
        <p type="p">304:第二端電極</p>
        <p type="p">310:端電極對</p>
        <p type="p">312:第一端電極</p>
        <p type="p">314:第二端電極</p>
        <p type="p">320:端電極對</p>
        <p type="p">322:第一端電極</p>
        <p type="p">324:第二端電極</p>
        <p type="p">330:端電極對</p>
        <p type="p">332:第一端電極</p>
        <p type="p">334:第二端電極</p>
        <p type="p">CA1:電容單元</p>
        <p type="p">CA2:電容單元</p>
        <p type="p">CA3:電容單元</p>
        <p type="p">CA4:電容單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="308" publication-number="202617454">
    <tif-files tif-type="multi-tif">
      <tif file="113140113.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用多種氣嘴之接頭</chinese-title>
        <english-title>VALVE CONNECTOR SUITABLE FOR VARIOUS VALVES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">B60C29/06</main-classification>
        <further-classification edition="200601120241028B">F16K15/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集優企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CO-LUCK ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳樹木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明適用多種氣嘴之接頭包括有一個外殼及一個夾緊裝置，外殼沿一個虛擬貫軸設置有一個滑槽，夾緊裝置設置於滑槽內，夾緊裝置包括有一個推座、一個法式卡固件及一個美式卡固件，推座沿虛擬貫軸軸向設置有一個法式插孔及一個美式插孔，推座設置有一個法式容置槽及一個美式容置槽，法式卡固件能夠移動地設置於法式容置槽內，美式卡固件能夠移動地設置於美式容置槽內，夾緊裝置在法式位置時，法式卡固件靠近虛擬貫軸，美式卡固件遠離虛擬貫軸，夾緊裝置在美式位置時，美式卡固件靠近虛擬貫軸，法式卡固件遠離虛擬貫軸，接頭透過上述結構使操作方便且夾持效果良好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A valve connector of the present invention, suitable for various valves, comprises a housing and a clamping device. The housing is provided with a sliding slot along an reference pivoting axis. The clamping device is positioned within the sliding slot and includes a pushing base, a French type fastening member, and an American type fastening member. The pushing base is axially arranged along the reference pivoting axis with a French type socket and an American type socket. The pushing base also has a French type accommodating slot and an American type accommodating slot. The French type fastening member is movably positioned within the French type accommodating slot, while the American type fastening member is movably positioned within the American type accommodating slot. When the clamping device is in the French type position, the French type fastening member is close to the reference pivoting axis, and the American type fastening member is distant from the reference pivoting axis. When the clamping device is in the American type position, the American type fastening member is close to the reference pivoting axis, and the French type fastening member is distant from the reference pivoting axis. This structure allows the connector to operate conveniently and achieve excellent clamping performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接頭</p>
        <p type="p">20:外殼</p>
        <p type="p">22:第一端</p>
        <p type="p">23:第二端</p>
        <p type="p">30:夾緊裝置</p>
        <p type="p">313:美式插孔</p>
        <p type="p">317:美式套管</p>
        <p type="p">35:美式擋環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="309" publication-number="202617455">
    <tif-files tif-type="multi-tif">
      <tif file="113140115.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用多種氣嘴之接頭</chinese-title>
        <english-title>VALVE CONNECTOR SUITABLE FOR VARIOUS VALVES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">B60C29/06</main-classification>
        <further-classification edition="200601120241028B">F16K15/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集優企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CO-LUCK ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳樹木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明適用多種氣嘴之接頭包括有一外殼及一夾緊裝置，外殼沿虛擬的一貫軸設置有一滑槽，夾緊裝置設置於滑槽內，夾緊裝置包括有一推座及至少一夾爪，推座沿貫軸軸向設置有一氣嘴插孔，推座設置有至少一容置槽，至少一夾爪設置於至少一容置槽內，夾爪包括有一樞部座及一夾臂，樞部座設置有一第一樞部，夾臂樞設於樞部座，夾臂設置有一夾持部，夾緊裝置在夾緊位置時，夾持部及第一樞部靠近貫軸，夾緊裝置在釋放位置時，夾持部及第一樞部遠離貫軸，接頭透過上述結構使操作方便且夾持效果良好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A valve connector of the present invention, suitable for various valves, comprises a housing and a clamping device. The housing is provided with a sliding slot along a reference central axis, and the clamping device is positioned within the sliding slot. The clamping device includes a pushing base and at least one clamping jaw. The pushing base is axially arranged along the central axis with a valve socket. The pushing base is provided with at least one accommodating slot, and at least one clamping jaw is positioned within at least one accommodating slot. Each clamping jaw includes a pivoting seat and a clamping arm. The pivoting seat is provided with a first pivot, and the clamping arm is pivotally connected to the pivoting seat. The clamping arm is provided with a clamping portion. When the clamping device is in the clamping position, the clamping portion and the first pivot are close to the central axis. When the clamping device is in the release position, the clamping portion and the first pivot are distant from the central axis. This structure allows for convenient operation and excellent clamping performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接頭</p>
        <p type="p">20:外殼</p>
        <p type="p">22:第一端</p>
        <p type="p">23:第二端</p>
        <p type="p">30:夾緊裝置</p>
        <p type="p">31:推座</p>
        <p type="p">311:氣嘴插孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="310" publication-number="202617232">
    <tif-files tif-type="multi-tif">
      <tif file="113140125.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於運動護具之緩衝結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">A63B71/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施奕宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施奕宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種用於運動護具之緩衝結構，包含一第一片件、一第二片件、至少一彈性件以及一軟性包覆件。其中，第一片件具有一第一輪廓；第二片件具有一第二輪廓；至少一彈性件夾在第一片件與第二片件之間並固設於第一片件與第二片件；軟性包覆件至少部分地包覆第一片件、第二片件及至少一彈性件。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:第一片件</p>
        <p type="p">113:第一開孔</p>
        <p type="p">12:第二片件</p>
        <p type="p">123:第二開孔</p>
        <p type="p">13:彈性件</p>
        <p type="p">131:彈簧</p>
        <p type="p">P1:第一輪廓</p>
        <p type="p">P2:第二輪廓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="311" publication-number="202619029">
    <tif-files tif-type="multi-tif">
      <tif file="113140126.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">H01L21/768</main-classification>
        <further-classification edition="200601120241226B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯朝鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, CHAU-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡湘綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HSIANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昕融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括介電層、金屬導線以及複數個插塞結構。介電層設置在基底上，金屬導線則設置在介電層內。插塞結構相互分隔地設置在介電層內，位在金屬導線上並直接接觸金屬導線。插塞結構沿著相互垂直的第一方向和第二方向排列成至少2×2的陣列，其中，插塞結構的總面積相對於金屬導線的面積的比例至少大於0.13。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a dielectric layer, a metal layer, and a plurality of via structures. The dielectric layer is disposed on a substrate, and the metal line is disposed within the dielectric layer. The via structures are separately disposed within the dielectric layer, on the metal line and physically contacting the metal line. The via structures are arranged in a first direction and a second direction being perpendicular to the first direction, at least into a 2×2 array, wherein a ratio between a total area of the via structures and an area of the metal line is greater than 0.13.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:半導體裝置</p>
        <p type="p">100:基底</p>
        <p type="p">110:介電層</p>
        <p type="p">120:金屬導線</p>
        <p type="p">132:阻障層</p>
        <p type="p">134:金屬層</p>
        <p type="p">230:插塞結構</p>
        <p type="p">230t:凹陷頂面</p>
        <p type="p">D1:第一方向</p>
        <p type="p">L1、L2:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="312" publication-number="202617949">
    <tif-files tif-type="multi-tif">
      <tif file="113140135.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造合成氣及利用其發電之系統</chinese-title>
        <english-title>SYSTEM FOR PRODUCING SYNGAS AND UTILIZING IT FOR POWER GENERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">C10J3/16</main-classification>
        <further-classification edition="200601120241204B">C01B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翔耀綠能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張紋菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡坤旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種製造合成氣及利用其發電之系統，將生質燃料與有限量之氧氣反應製造合成氣，藉所產生之生質炭進一步純化合成氣並回收利用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system for producing syngas and utilizing it for power generation. Biomass fuel reacts with a limited amount of oxygen to produce syngas, and the resulting biochar can be further used to purify the syngas and be recycled for reuse.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:製造合成氣之系統</p>
        <p type="p">100:氣化裝置</p>
        <p type="p">110:氣化爐</p>
        <p type="p">120:氣體轉送機構</p>
        <p type="p">130:固體分離機構</p>
        <p type="p">200:純化裝置</p>
        <p type="p">210:過濾機構</p>
        <p type="p">220:進氣機構</p>
        <p type="p">230:出氣機構</p>
        <p type="p">240:回收機構</p>
        <p type="p">300:進料裝置</p>
        <p type="p">310:進料機構</p>
        <p type="p">320:混料機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="313" publication-number="202617747">
    <tif-files tif-type="multi-tif">
      <tif file="113140136.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種癌症處理及診斷用之胜肽組合物</chinese-title>
        <english-title>A PEPTIDE COMPOSITION FOR CANCER APPROACH AND DIAGNOSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">C07K7/08</main-classification>
        <further-classification edition="200601120250303B">A61K51/08</further-classification>
        <further-classification edition="200601120250303B">A61P35/00</further-classification>
        <further-classification edition="200601120250303B">G01N33/574</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林旻穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MIN YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳駿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂志得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEU, JYH DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡坤旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種仿內源性切絲蛋白-1的胜肽序列，其包括穿膜胺基酸序列，用以促進細胞胜肽藥物的吸收。當切絲蛋白胜肽藥物進入細胞後，其可影響細胞遷移及侵襲能力。此外，該胜肽序列可與螯合劑綴合用於癌症診斷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure reveals a peptide sequence mimicking endogenous cofilin-1, incorporating transmembrane amino acid sequences to enhance cellular uptake of the peptide drug. When cofilin peptide drugs are introduced into cancer cells, they affect cancer cell migration and invasion abilities. Furthermore, the peptide sequence can be conjugated with a chelator for cancer diagnosis.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="314" publication-number="202619222">
    <tif-files tif-type="multi-tif">
      <tif file="113140138.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140138</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電器電子裝置及其製造方法</chinese-title>
        <english-title>CHARGER ELECTRONIC DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241030B">H02J7/02</main-classification>
        <further-classification edition="200601120241030B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BO-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸義仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電子裝置包括電子元件、第一殼及第二殼。第一殼位於電子元件與第二殼之間，且第一殼及電子元件位於第二殼內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes an electronic component, a first shell and a second shell. The first shell is located between the electronic component and the second shell, and the first shell and the electronic component are located in the second shell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子模組</p>
        <p type="p">100:電子裝置</p>
        <p type="p">111A:第一電極</p>
        <p type="p">111B:第二電極</p>
        <p type="p">111:連接器</p>
        <p type="p">111C:第一連接線</p>
        <p type="p">111D:第二連接線</p>
        <p type="p">112:蓋板</p>
        <p type="p">120:電子元件</p>
        <p type="p">130:封裝材</p>
        <p type="p">140:第一殼</p>
        <p type="p">140e:端面</p>
        <p type="p">141:第一殼體</p>
        <p type="p">141a:第一貫孔</p>
        <p type="p">141r:缺口</p>
        <p type="p">142:第一結合部</p>
        <p type="p">140r:隔離部</p>
        <p type="p">150:第二殼</p>
        <p type="p">150a:第二開口</p>
        <p type="p">150b:槽底面</p>
        <p type="p">150e:端面</p>
        <p type="p">150p:容置槽</p>
        <p type="p">150r:凹槽</p>
        <p type="p">151:第二殼體</p>
        <p type="p">151a:第二貫孔</p>
        <p type="p">151s:表面</p>
        <p type="p">152:第二結合部</p>
        <p type="p">160:導熱層</p>
        <p type="p">160a:鏤空部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="315" publication-number="202619456">
    <tif-files tif-type="multi-tif">
      <tif file="113140143.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及散熱模組</chinese-title>
        <english-title>ELECTRONIC DEVICE AND HEAT DISSIPATION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241114B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯穎科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIWYNN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋俊逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張威慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一散熱模組以及一電路板。散熱模組包含一背板以及一第一散熱結構。背板具有一容置槽。第一散熱結構嵌設於容置槽中。電路板之一第一側裝設有複數個第一電子元件。電路板以第一側朝向散熱模組設置於背板上，使得複數個第一電子元件接觸第一散熱結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a heat dissipation module and a circuit board. The heat dissipation module includes a back plate and a first heat dissipation structure. The back plate has an accommodation recess. The first heat dissipation structure is embedded in the accommodation recess. A first side of the circuit board is equipped with a plurality of first electronic components. The circuit board is disposed on the back plate with the first side facing the heat dissipation module, such that the plurality of electronic components are in contact with the first heat dissipation structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">10:散熱模組</p>
        <p type="p">12:電路板</p>
        <p type="p">100:背板</p>
        <p type="p">102:第一散熱結構</p>
        <p type="p">120:第一電子元件</p>
        <p type="p">122:第二電子元件</p>
        <p type="p">1000:容置槽</p>
        <p type="p">D:深度</p>
        <p type="p">H:高度</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="316" publication-number="202618411">
    <tif-files tif-type="multi-tif">
      <tif file="113140144.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140144</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱形眼鏡鏡片之治具結構</chinese-title>
        <english-title>JIG STRUCTURE FOR CONTACT LENSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">G02C7/04</main-classification>
        <further-classification edition="200601120241226B">G02C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藝高國際光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭如良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JU LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種隱形眼鏡鏡片之治具結構，係主要包含一第一治具及一第二治具，當進行隱形眼鏡其鏡片的凸面改質時，係使第一治具其第一吸嘴所設弧凸狀端頭與鏡片之凹面對應吸附，此時鏡片周緣係可抵靠於端頭周側之止擋面定位，於此，即可防止鏡片其凸面於電漿加工時，鏡片受噴擊力道作用發生偏移情形，另當進行隱形眼鏡其鏡片的凹面改質時，係將鏡片置於第二治具其第二吸嘴所設弧凹狀容穴中，以藉由容穴處產生吸力將鏡片其凸面穩固吸附，而防止鏡片其凹面於電漿加工時，鏡片受噴擊力道所致發生偏移情況，據此，俾有效提高於隱形眼鏡之鏡片上成型溝槽的品質與良率效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a jig structure for contact lenses, primarily comprising a first jig and a second jig. When modifying a convex surface of the contact lens, an arc-shaped convex tip of a first nozzle on the first jig is used to correspondingly suction a concave surface of the lens. At this time, periphery of the lens can rest against a stop surface on a side of the tip for positioning, preventing the convex surface of the lens from shifting due to the impact force during plasma processing. On the other hand, when modifying a concave surface of the contact lens, the lens is placed in an arc-shaped concave cavity of a second nozzle on the second jig, where suction is generated by the cavity to firmly hold the convex surface of the lens. This prevents the concave surface of the lens from shifting due to the impact force during plasma processing. Accordingly, this design effectively improves the quality and yield of grooves formed on the surface of the contact lenses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一治具</p>
        <p type="p">11:第一固定座</p>
        <p type="p">112:第一通孔</p>
        <p type="p">12:第一組立座</p>
        <p type="p">13:第一吸嘴</p>
        <p type="p">132:第一接合部</p>
        <p type="p">133:端頭</p>
        <p type="p">134:第一氣孔</p>
        <p type="p">135:止擋面</p>
        <p type="p">3:管路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="317" publication-number="202617370">
    <tif-files tif-type="multi-tif">
      <tif file="113140146.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭力扳手方塊件承載座結構改良</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25B23/16</main-classification>
        <further-classification edition="200601120241204B">B25B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扭力扳手方塊件承載座結構改良，包括一桿體、一方塊件、一承載座及一彈簧，依序設於扳手的一管體內；該桿體和該承載座的相對端各設一凹部，該方塊件設於兩個該凹部之間；更包括一定位組件，設於該承載座和該彈簧之間；該組件包括一定位軸及一法蘭；基於該法蘭，該定位軸被區分為一第一段部和一第二段部；該第一段部穿入並緊配於該載座的一中心軸孔，該第二段部穿入該彈簧的內徑，該承載座的底面和該彈簧的端部夾制限位該法蘭。透過上述的結構安排，該承載座及該彈簧的位置被精確固定，有效提升扭力傳遞效率並增加結構穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:扳手頭</p>
        <p type="p">11:桿體</p>
        <p type="p">111:凹部</p>
        <p type="p">12:承載座</p>
        <p type="p">121:凹部</p>
        <p type="p">13:方塊件</p>
        <p type="p">14:定位組件</p>
        <p type="p">141:定位軸</p>
        <p type="p">142:法蘭</p>
        <p type="p">143:第一段部</p>
        <p type="p">144:第二段部</p>
        <p type="p">15:彈簧</p>
        <p type="p">16:管體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="318" publication-number="202618412">
    <tif-files tif-type="multi-tif">
      <tif file="113140148.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具切換隱私模式的窗戶系統</chinese-title>
        <english-title>WINDOW SYSTEM WITH SWITCHABLE PRIVACY MODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">G02F1/01</main-classification>
        <further-classification edition="200601120241226B">G02F1/13</further-classification>
        <further-classification edition="200601120241226B">E06B9/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>絢麗光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRILLIANT OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭端毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, DUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具切換隱私模式的窗戶系統，用以解決習知的隱私保護問題。係包含：一可調控面板，用以切換至一散射態或一透光態；及一透鏡，設於該可調控面板的一第一側，其中，在一單向霧化模式，在該第一側看見一模糊影像，在相對該第一側之一第二側看見一清晰影像；在一雙向透明模式，在該第一側及該第二側皆看見清晰影像。藉此可以達到良好的隱私保護與視覺控制效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A window system with switchable privacy mode includes an adjustable panel and a lens. The adjustable panel can switch to a scattering state and a light-transmitting state. The len is located on a first side of the adjustable panel. In a one-way fog mode, a blurry image is seen from the first side, and a clear image is seen from a second side opposite to the first side. In the two-way transparency mode, clear images are seen from both the first side and the second side. This provides the effect of achieving excellent privacy protection and visual control.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可調控面板</p>
        <p type="p">11:基板</p>
        <p type="p">12:液晶層</p>
        <p type="p">2:透鏡</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
        <p type="p">d:間隔距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="319" publication-number="202617271">
    <tif-files tif-type="multi-tif">
      <tif file="113140152.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>木棧板破碎機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B02C18/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昶城有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張茂坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種木棧板破碎機，包含一車體單元、一驅動單元、一入料單元，及一碎料單元。該入料單元包括一勾料機構，及一位於該勾料機構上方的整平機構。該整平機構具有一軸桿、一樞接該軸桿的壓板、二沿左右方向彼此相間隔且前後兩端分別樞接該壓板及該車體單元的活動連桿，及二由該軸桿向下延伸並連接該車體單元的彈簧。該碎料單元包括一樞設於該車體單元並沿該前後方向接續該入料單元的切削刀具。該壓板可在該等彈簧的牽引下，向下壓抵並整平送入的木棧板，從而迫使木棧板在高度空間上極度集中，據此讓該切削刀具的切削範圍保持固定，提高切削效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:車體單元</p>
        <p type="p">121:側架板</p>
        <p type="p">123:上蓋板</p>
        <p type="p">124:滑槽</p>
        <p type="p">126:內部空間</p>
        <p type="p">3:入料單元</p>
        <p type="p">31:入料架</p>
        <p type="p">32:勾料機構</p>
        <p type="p">321:開槽</p>
        <p type="p">322:導板</p>
        <p type="p">323:刀輥</p>
        <p type="p">324:轉軸</p>
        <p type="p">325:入料刀片</p>
        <p type="p">33:整平機構</p>
        <p type="p">331:軸桿</p>
        <p type="p">332:壓板</p>
        <p type="p">333:活動連桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="320" publication-number="202618731">
    <tif-files tif-type="multi-tif">
      <tif file="113140153.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆高機模擬系統</chinese-title>
        <english-title>SIMULATING SYSTEM FOR FORK-LIFT TRUCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">G09B9/04</main-classification>
        <further-classification edition="200601120241101B">G09B9/05</further-classification>
        <further-classification edition="200601120241101B">B66F9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞動部職業安全衛生署</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, MINISTRY OF LABOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家科學及技術委員會南部科學園區管理局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUTHERN TAIWAN SCIENCE PARK BUREAU, MINISTRY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖翊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳震宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種堆高機模擬系統，用以解決習知堆高機的駕駛訓練缺乏對應的模擬系統的問題。係包含：控制模組分別與影像顯示模組及操作模組耦接，並根據駕駛者對操作模組的操作，對應控制影像顯示模組中所顯示的影像；控制模組具有情境資料庫與操作評比模組；情境資料庫具有預設的駕駛情境，以供駕駛者選擇；操作評比模組根據影像顯示模組所顯示的當前的駕駛情境的影像，且同時根據駕駛者對操作模組的當前操作，判斷堆高機的當前的模擬狀態是否符合對應的預設標準。本發明可以達成模擬駕駛堆高機及提升駕駛者學習效率等功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A simulating system for fork-lift truck is adapted for solving the problem that the conventional training on driving fork-lift truck lacks corresponding simulating systems. The present simulating system includes the following features. A control module respectively coupled with an image displaying module and an operation module. The control module controls an image displayed in the displaying module according to an operation to the operating module made by a driver. According to a current image of a driving scene displayed by the image displaying module, and according to a current operation to the operating module made by the driver, an operation evaluation module determines whether a current simulation status meets a corresponding preset standard. The present invention can achieve the simulation of driving the fork-lift truck, and improve the learning efficiency for the driver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:座艙體</p>
        <p type="p">11:操作區</p>
        <p type="p">12:乘坐區</p>
        <p type="p">2:影像顯示模組</p>
        <p type="p">21:顯示裝置</p>
        <p type="p">3:操作模組</p>
        <p type="p">3a:啟動單元</p>
        <p type="p">3b:轉彎方向操作單元</p>
        <p type="p">3c:方向燈操作單元</p>
        <p type="p">3d:駐車煞車控制單元</p>
        <p type="p">3e:前後檔位控制單元</p>
        <p type="p">3f:速度檔位控制單元</p>
        <p type="p">3g:油門控制單元</p>
        <p type="p">3h:離合器控制單元</p>
        <p type="p">3i:行車煞車控制單元</p>
        <p type="p">3j:貨叉升降控制單元</p>
        <p type="p">3k:貨叉傾斜控制單元</p>
        <p type="p">4:控制模組</p>
        <p type="p">41:情境資料庫</p>
        <p type="p">42:操作評比模組</p>
        <p type="p">5:運動模擬裝置</p>
        <p type="p">6:監視模組</p>
        <p type="p">61:影像擷取單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="321" publication-number="202617449">
    <tif-files tif-type="multi-tif">
      <tif file="113140155.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防蛇咬輪圈</chinese-title>
        <english-title>ANTI-PINCH FLAT WHEEL RIM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">B60B1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>煌傑金屬複合材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG-CHIEH METAL COMPOSITE MATERIAL TECH. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王清汗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昉昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種防蛇咬輪圈，包括：第一緩衝墊、第二緩衝墊，以及分別位在輪圈的截斷面之中心線的兩側對稱位置的第一輪緣部和第二輪緣部；第一緩衝墊和第二緩衝墊是一種環形構件且具有彈性能在變形後自動回復，第一緩衝墊和第二緩衝墊分別配置於第一輪緣部和第二輪緣部；第一緩衝墊介於第一輪緣部和外胎的外側胎壁之間，第二緩衝墊介於第二輪緣部和外胎的外側胎壁之間；在外胎受到外力而朝向第一輪緣部或是第二輪緣部擠壓時，第一緩衝墊和第二緩衝墊可以提供外胎緩衝的效果，防止外胎直接觸及第一輪緣部或第二輪緣部，進而避免發生蛇咬胎的情形。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">R1:防蛇咬輪圈</p>
        <p type="p">T:外胎</p>
        <p type="p">U:內胎</p>
        <p type="p">10:第一輪緣部</p>
        <p type="p">11:第一內緣</p>
        <p type="p">12:第一外緣</p>
        <p type="p">13:第一凹槽</p>
        <p type="p">20:第二輪緣部</p>
        <p type="p">21:第二內緣</p>
        <p type="p">22:第二外緣</p>
        <p type="p">23:第二凹槽</p>
        <p type="p">31:第一緩衝墊</p>
        <p type="p">32:第二緩衝墊</p>
        <p type="p">41:第一輪圈側壁</p>
        <p type="p">42:第二輪圈側壁</p>
        <p type="p">50:輻條組裝壁</p>
        <p type="p">51:第一貫穿孔</p>
        <p type="p">60:隔艙壁</p>
        <p type="p">61:第二貫穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="322" publication-number="202618306">
    <tif-files tif-type="multi-tif">
      <tif file="113140156.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像擷取裝置的功耗測量方法及系統</chinese-title>
        <english-title>SYSTEM AND METHOD FOR MEASURING POWER CONSUMPTION OF IMAGE CAPTURING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01R11/00</main-classification>
        <further-classification edition="202301120241104B">H04N25/70</further-classification>
        <further-classification edition="202301120241104B">H04N23/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA NETWORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>敖世芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AO, SHIH-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仁宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊代強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像擷取裝置的功耗測量方法及系統，其在信號遮蔽箱中安裝無線信號存取裝置及信號衰減裝置以在不改變無線信號存取裝置位置不動及輸出功率的狀態下藉由改變信號衰減裝置的信號衰減能力來模擬移動無線信號存取裝置，使用發光裝置控制測試空間的亮暗程度以藉由改變發光裝置是否發光來模擬影像擷取裝置分別於日夜進行拍攝的光線狀態，以及使用發熱裝置的發熱部作為測試空間中的紅外線產生源以藉由改變發熱部的位置來觸發影像擷取裝置偵測物體移動的功能，並藉由量測影像擷取裝置在上述操作中發生的能量消耗狀態以測量其功耗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for measuring power consumption of image capturing apparatus is provided, wherein a wireless signal access device and a signal attenuation apparatus are installed in a signal shielding box to simulate movement of the wireless signal access device by varying the signal attenuation capability of the signal attenuation apparatus while remaining the location of and the wireless signal strength output by the wireless signal access device, a light emitting device is used for simulating day and night for the image capturing apparatus, a movement detecting operation of the image capturing apparatus to detect movement of an object is triggered by changing a position of a heating element of a heating device, and energy usage of the image capturing apparatus during the operations performed above is measured to determining the power consumption of the image capturing apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:功耗測量系統</p>
        <p type="p">160:網路</p>
        <p type="p">200:影像擷取裝置</p>
        <p type="p">203:電力元件</p>
        <p type="p">205:感測範圍</p>
        <p type="p">210:電力監控裝置</p>
        <p type="p">220:控制裝置</p>
        <p type="p">230:信號遮蔽箱</p>
        <p type="p">232:無線信號存取裝置</p>
        <p type="p">234:信號衰減裝置</p>
        <p type="p">236:外部天線</p>
        <p type="p">240:發光裝置</p>
        <p type="p">250:溫度偵測裝置</p>
        <p type="p">260:發熱裝置</p>
        <p type="p">260a:發熱部</p>
        <p type="p">260b:非發熱部</p>
        <p type="p">270:基座</p>
        <p type="p">AD1:調節信號</p>
        <p type="p">AD2:亮度切換信號</p>
        <p type="p">AD3:發熱控制信號</p>
        <p type="p">CA:電力資訊</p>
        <p type="p">S1:指令</p>
        <p type="p">T1:發熱部溫度</p>
        <p type="p">T2:環境溫度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="323" publication-number="202617422">
    <tif-files tif-type="multi-tif">
      <tif file="113140157.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衝壓裝備和相關方法、電腦程式產品和電腦可讀存儲介質</chinese-title>
        <english-title>A PRESS APPARATUS AND A RELATED METHOD, COMPUTER PROGRAM PRODUCT AND COMPUTER READABLE STORAGE MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250213B">B30B15/34</main-classification>
        <further-classification edition="200601120250213B">B30B15/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商奎恩特斯科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUINTUS TECHNOLOGIES AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡哲　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARJER, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波斯特倫　佩爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURSTROM, PER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種衝壓裝備（100），該衝壓裝備包括具有內部空間（5）和至少一個壓力介質引導路徑（6）的壓力容器（1），該壓力介質引導路徑具有與內部空間（5）流體連通的入口（7）和出口（8）並在該入口和該出口之間延伸。衝壓裝備（100）包括冷卻單元（20），該冷卻單元設置在入口的下游，並且被配置為冷卻在至少一個壓力介質引導路徑（6）中引導的壓力介質。至少一個（14）壓力介質流產生器設置在冷卻單元（20）的下游，並且被配置為接收已經由冷卻單元（20）冷卻的壓力介質流，使得壓力介質的溫度不超過第一選擇溫度；並且在至少一個壓力介質引導路徑（6）中產生朝向出口（8）的壓力介質流。還公開了一種相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A press apparatus (100) is disclosed, comprising a pressure vessel (1) having an internal space (5) and at least one pressure medium guiding path (6) having and extending between an inlet (7) and an outlet (8) in fluid communication with the internal space (5). The press apparatus (100) comprises a cooling unit (20) arranged downstream the inlet and configured to cool pressure medium being guided in the at least one pressure medium guiding path (6). At least one (14) pressure medium flow generator is arranged downstream the cooling unit (20) and configured to receive the flow of the pressure medium having been cooled by the cooling unit (20) such that the temperature of the pressure medium does not exceed a first selected temperature and generate a flow of the pressure medium in the at least one pressure medium guiding path (6) towards the outlet (8). A related method is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓力容器</p>
        <p type="p">5:內部空間</p>
        <p type="p">6:壓力介質引導路徑</p>
        <p type="p">7:入口</p>
        <p type="p">8:出口</p>
        <p type="p">14:壓力介質流產生器</p>
        <p type="p">20:冷卻單元</p>
        <p type="p">21:加熱單元</p>
        <p type="p">22:控制閥</p>
        <p type="p">23:止回閥組件</p>
        <p type="p">24:壓力增強器</p>
        <p type="p">25:泵</p>
        <p type="p">28:止回閥</p>
        <p type="p">100:衝壓裝備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="324" publication-number="202617421">
    <tif-files tif-type="multi-tif">
      <tif file="113140158.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衝壓裝備</chinese-title>
        <english-title>A PRESS APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">B30B11/00</main-classification>
        <further-classification edition="200601120250422B">B30B15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商奎恩特斯科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUINTUS TECHNOLOGIES AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡哲　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARJER, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波斯特倫　佩爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURSTROM, PER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種衝壓裝備（100），該衝壓裝備包括具有內部空間（5）以及第一端（3）和第二端（4）的壓力容器（1）。加載室（2）在內部空間（5）內至少部分地設置在第一端（3）和第二端（4）之間，並且被設置成使得允許壓力介質流通過加載室（2）。至少一個壓力介質流動路徑（6）具有與內部空間（5）流體連通的入口（7）和出口（8）並在該入口和該出口之間延伸，並且被配置為將壓力介質從入口（7）引導到出口（8）。至少一個壓力介質流產生器（14）被配置為在內部空間（5）內生成穿過第二端（3）和第一端（4）之間的加載室（2）的壓力介質流，並且進一步生成流入入口（7）、通過至少一個壓力介質流動路徑（6）並流出出口（8）的壓力介質流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A press apparatus (100) is disclosed, comprising a pressure vessel (1) having an internal space (5) and a first end (3) and a second end (4). A load compartment (2) is arranged within the internal space (5) at least in part between the first end (3) and the second end (4) and arranged so that a flow of pressure medium through the load compartment (2) is permitted. At least one pressure medium flow path (6) has and extends between an inlet (7) and an outlet (8) in fluid communication with the internal space (5), and is configured to guide pressure medium from the inlet (7) to the outlet (8). At least one pressure medium flow generator (14) is configured to generate a flow of pressure medium within the internal space (5) going through the load compartment (2) between the second end (3) and the first end (4), and further to generate a flow of the pressure medium into the inlet (7), through the at least one pressure medium flow path (6), and out of the outlet (8).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓力容器</p>
        <p type="p">2:加載室</p>
        <p type="p">3:第一端</p>
        <p type="p">4:第二端</p>
        <p type="p">5:內部空間</p>
        <p type="p">6:壓力介質引導路徑</p>
        <p type="p">7:入口</p>
        <p type="p">8:出口</p>
        <p type="p">9、13:壓力介質流分佈調節器</p>
        <p type="p">10:衝壓裝備</p>
        <p type="p">11、12:端封閉件</p>
        <p type="p">100:衝壓裝備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="325" publication-number="202618165">
    <tif-files tif-type="multi-tif">
      <tif file="113140159.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140159</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以輸送氣體之多層絕熱管路</chinese-title>
        <english-title>MULTI-LAYER HEAT INSULATED PIPELINE FOR CONVEYING GAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F16L59/14</main-classification>
        <further-classification edition="200601120241204B">F16L59/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷瑀彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, YU-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷瑀彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, YU-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以輸送第一氣體之多層絕熱管路包含內管路以及外管路。第一氣體係於內管路內沿抽氣方向輸送。內管路具有複數個通孔。內管路係設置於外管路內。外管路包含進氣管。第二氣體係先加熱或降溫後再從進氣管注入外管路內。第二氣體相對於第一氣體係非反應性。第一氣體之第一壓力係小於第二氣體之第二壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-layer heat insulated pipeline, for conveying a first gas, includes an inner pipeline and an external pipeline. The first gas is conveyed along with in a pumping direction. The inner pipeline has a plurality of orifices. The inner pipeline is disposed within the external pipeline. The external pipeline includes an intake tube. A second gas is firstly heated or cooled and then injected into the interlayer between the external pipeline and the inner pipeline from the intake tube. The second gas is inactive with respect to the first gas. A first pressure of the first gas is less than a second pressure of the second gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多層絕熱管路</p>
        <p type="p">10:內管路</p>
        <p type="p">102:通孔</p>
        <p type="p">12:外管路</p>
        <p type="p">120:外周圍</p>
        <p type="p">122:進氣管</p>
        <p type="p">14:絕熱層</p>
        <p type="p">140:內周圍</p>
        <p type="p">16:加熱元件</p>
        <p type="p">18:隔熱支撐構件</p>
        <p type="p">g1:第一氣體</p>
        <p type="p">g2:第二氣體</p>
        <p type="p">vd:抽氣方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="326" publication-number="202618693">
    <tif-files tif-type="multi-tif">
      <tif file="113140161.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>青春痘專家系統、青春痘專家方法及電腦程式產品</chinese-title>
        <english-title>ACNE EXPERT SYSTEM, ACNE EXPERT METHOD, AND COMPUTER PROGRAM PRODUCT IMPLEMENTING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250203B">G06T7/00</main-classification>
        <further-classification edition="201801120250203B">G16H30/40</further-classification>
        <further-classification edition="201801120250203B">G16H50/20</further-classification>
        <further-classification edition="202201120250203B">H04L51/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳妤蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾孟栩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MONG-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫家誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, JIA CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳妤蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾孟栩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MONG-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫家誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, JIA CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種青春痘專家系統、青春痘專家方法及電腦程式產品，包括嚴重程度檢測模組利用影像分類模型對青春痘影像進行青春痘總數量檢測以輸出青春痘嚴重程度，位置類型檢測模組利用物件偵測模型對青春痘影像進行青春痘位置和類型檢測以輸出各青春痘類型及各類型數量，油性檢測模組利用明度對吸油面紙影像進行油性檢測以輸出吸油面積占比及對應的油性程度，檢測結果趨勢模組據以產生趨勢圖，更利用專家回覆模型回覆問題，並且利用聊天機器人接收影像和問題及提供資訊。本發明讓使用者能自我檢測及追蹤青春痘狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An acne expert system, an acne expert method and a computer program product implementing the same are provided. A severity detection module detects a total number of acne on an acne image by using an image classification model to output a severity of acne. A location and type detection module detects a location and a type of acne on the acne image by using an object detection model to output each type of acne and a number of each type of acne. An oil detection module analyzes an oil absorption of an oil-absorbing tissue image by using the value to output an oil absorption area ratio and a corresponding skin type. A detection result trend module generates a trend graph accordingly. The present disclosure further uses an expert response model to answer questions and uses a chatbot to receive images or questions, and provide information, allowing users to self-detect and track acne conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:青春痘專家系統</p>
        <p type="p">21:嚴重程度檢測模組</p>
        <p type="p">22:位置類型檢測模組</p>
        <p type="p">23:油性檢測模組</p>
        <p type="p">24:專家回覆模組</p>
        <p type="p">25:檢測結果趨勢模組</p>
        <p type="p">26:記錄模組</p>
        <p type="p">27:聊天機器人模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="327" publication-number="202618204">
    <tif-files tif-type="multi-tif">
      <tif file="113140168.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140168</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱元件組合結構</chinese-title>
        <english-title>HEAT SINK ASSEMBLY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">F28F3/02</main-classification>
        <further-classification edition="200601120250224B">F28D15/04</further-classification>
        <further-classification edition="200601120250224B">H01L23/36</further-classification>
        <further-classification edition="200601120250224B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳興奇宏科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA VITAL COMPONENTS (CHINA) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GUO-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱元件組合結構，係包含：一基座、複數散熱鰭片；該基座具有一結合面及一受熱面，該結合面具有複數溝槽；該等散熱鰭片係具有一本體及一結合部，該本體與結合部間設有一段差區段，令本體與結合部呈錯位狀態，使該等散熱鰭片與該基座結合時，透過散熱鰭片段差區段之設計，可改善散熱鰭片於安裝時彼此間相互干涉之缺點者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">11:第一側</p>
        <p type="p">12:第二側</p>
        <p type="p">2:散熱鰭片</p>
        <p type="p">21:第一薄片體</p>
        <p type="p">211:第一凹槽</p>
        <p type="p">22:第二薄片體</p>
        <p type="p">221:第二凹槽</p>
        <p type="p">23:氣密腔室</p>
        <p type="p">24:結合端</p>
        <p type="p">25:對插區段</p>
        <p type="p">26:毛細結構層</p>
        <p type="p">27:工作液體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="328" publication-number="202617485">
    <tif-files tif-type="multi-tif">
      <tif file="113140179.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140179</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>駕駛接管偵測方法及其系統</chinese-title>
        <english-title>DRIVING TAKEOVER DETECTING METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241104B">B60W40/09</main-classification>
        <further-classification edition="202201120241104B">G06V40/16</further-classification>
        <further-classification edition="202201120241104B">G06V40/10</further-classification>
        <further-classification edition="201201120241104B">B60W50/12</further-classification>
        <further-classification edition="202001120241104B">B60W50/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人車輛研究測試中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUTOMOTIVE RESEARCH &amp; TESTING CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏佑倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, YOU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇一峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YI FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種駕駛接管偵測方法，用於判定位於一車輛內一駕駛座上的一駕駛員於一自駕模式中是否滿足一駕駛接管條件，駕駛接管偵測方法包含一影像擷取步驟、一臉部特徵偵測步驟、一信心度判定步驟、一駕駛員可用性偵測步驟及一駕駛接管判定步驟。信心度判定步驟包含依據臉部偵測結果透過一信心度判定模組判定一綜合信心度是否大於或等於一信心度閥值。駕駛員可用性偵測步驟包含當綜合信心度大於或等於信心度閥值時，透過一可用性判定模組判定駕駛員是否滿足一可用性條件。藉此，以適用於多變複雜的環境及場景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driving takeover detecting method is for determining whether a driver located on a driver's seat in a vehicle meets a driving takeover condition in a self-driving mode. The driving takeover detecting method includes an image capturing step, a face feature detecting step, a confidence level determining step, a driver availability detecting step and a driving takeover determining step. The confidence level determining step includes determining whether a comprehensive confidence level is greater than or equal to a threshold confidence value by a confidence level determining module based on a face detecting result. The driver availability detecting step includes determining whether the driver meets an availability condition by an availability determining module when the comprehensive confidence level is greater than or equal to the threshold confidence value. Therefore, it can be applied to changing and complex environments and scenes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:駕駛接管偵測方法</p>
        <p type="p">110:車身信號擷取步驟</p>
        <p type="p">112:駕駛員存在偵測步驟</p>
        <p type="p">120:影像擷取步驟</p>
        <p type="p">122:人臉辨識步驟</p>
        <p type="p">124:本地訓練步驟</p>
        <p type="p">126:人員參數組新增步驟</p>
        <p type="p">128:人員資料庫更新步驟</p>
        <p type="p">130:臉部特徵偵測步驟</p>
        <p type="p">136:姿態特徵偵測步驟</p>
        <p type="p">140:信心度判定步驟</p>
        <p type="p">142:信心度調整步驟</p>
        <p type="p">144:失效通知步驟</p>
        <p type="p">146:影像上傳雲端步驟</p>
        <p type="p">148:雲端訓練步驟</p>
        <p type="p">152:人員參數組更新步驟</p>
        <p type="p">154:人員參數組下載步驟</p>
        <p type="p">160:駕駛員可用性偵測步驟</p>
        <p type="p">170:駕駛接管判定步驟</p>
        <p type="p">172:警示步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="329" publication-number="202619396">
    <tif-files tif-type="multi-tif">
      <tif file="113140180.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊裝置及控制實體層封包接收方法</chinese-title>
        <english-title>WIRELESS COMMUNICATION DEVICE AND METHOD OF CONTROLLING RECEPTION OF PHYSICAL LAYER PACKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">H04W72/232</main-classification>
        <further-classification edition="200601120250203B">H04L5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳學儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHIUE-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪佳君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通訊裝置，包含媒體存取控制電路、射頻電路和基頻電路。媒體存取控制電路用以同時加入或創建分別在第一頻道和第二頻道工作的網路。射頻電路用以依據媒體存取控制電路的控制而切換至第一頻道。基頻電路用以在第一頻道上停留第一符元期間以進行前導碼偵測。若基頻電路在第一符元期間偵測到實體層封包之前導碼，則其在第一頻道再停留第二符元期間，以繼續接收前導碼，並計算分別在第一符元期間和第二符元期間收到的資料之間的相關性，且據以決定是否繼續停留在第一頻道以繼續接收實體層封包。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication device includes a media access control (MAC) circuit, a radio frequency (RF) circuit, and a baseband circuit. The MAC circuit is configured to simultaneously join or create networks that work on a first channel and a second channel, respectively. The RF circuit is configured to switch to the first channel according to a control of the MAC circuit. The baseband circuit is configured to stay on the first channel for a first symbol period to perform a preamble detection. If detecting a preamble of a physical (PHY) layer packet during the first symbol period, the baseband circuit further stays on the first channel for a second symbol period to continue receiving the preamble, and then calculate the relevance between the data received respectively during the first and second symbol periods, and determines whether to stay on the first channel to continue receiving the PHY layer packet accordingly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:控制實體層封包接收方法</p>
        <p type="p">S402,S404,S406,S408,S410,S412,S414:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="330" publication-number="202618272">
    <tif-files tif-type="multi-tif">
      <tif file="113140181.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有氣體交換系統的電子鼻及其機器人</chinese-title>
        <english-title>ELECTRONIC NOSE WITH GAS EXCHANGE SYSTEM AND ROBOT EQUIPPED WITH ELECTRONIC NOSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">G01N33/00</main-classification>
        <further-classification edition="200601120241030B">G01N30/88</further-classification>
        <further-classification edition="200601120241030B">G01D21/02</further-classification>
        <further-classification edition="200601120241030B">G01N1/22</further-classification>
        <further-classification edition="202401120241030B">G05D1/20</further-classification>
        <further-classification edition="200601120241030B">G01N27/04</further-classification>
        <further-classification edition="200601120241030B">G08C17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾諾斯生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AINOS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖家男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIA-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡群賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庭鵑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡群榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有氣體交換系統的電子鼻，包括一進氣單元、一偵測單元、一抽氣單元及一處理單元，該進氣單元包括一第一及一第二進氣通道，該偵測單元包括一腔室及一偵測模組，該偵測模組包括一氣體偵測元件及一或多個環境偵測元件，該抽氣單元連接至該腔室，該處理單元連接至該偵測模組，該電子鼻被配置為允許一外界氣體從該第一進氣通道經一過濾器而進入該腔室，持續直到該偵測單元得到的一偵測訊號及該環境偵測元件得到的環境參數達一平衡狀態，接著允許該外界氣體從該第二進氣通道進入該腔室，根據該偵測訊號得到一關聯於該外界氣體的判斷資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic nose with a gas exchange system comprises a gas intake unit, a detection unit, an evacuation unit, and a processing unit. The gas intake unit includes a first and a second channel. The detection unit comprises a chamber and a detection module. The detection module includes a gas sensor element and one or more environmental sensors. The evacuation unit is connected to the chamber, and the processing unit is connected to the detection module. The electronic nose is configured to allow external gas to enter the chamber through the first channel via a filter, continuing until a detection signal obtained by the gas sensor element and environmental parameters obtained by the environmental sensors reach an equilibrium state. Then, the external gas is allowed to enter the chamber through the second channel without filtering. Subsequently, a determination result related to the external gas is obtained based on the detection signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電子鼻</p>
        <p type="p">21:進氣單元</p>
        <p type="p">210:第一進氣通道</p>
        <p type="p">211:第二進氣通道</p>
        <p type="p">212:過濾器</p>
        <p type="p">213、214:閥體</p>
        <p type="p">22:偵測單元</p>
        <p type="p">220:腔室</p>
        <p type="p">221:氣體偵測元件</p>
        <p type="p">222:環境偵測元件</p>
        <p type="p">23:抽氣單元</p>
        <p type="p">24:處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="331" publication-number="202618273">
    <tif-files tif-type="multi-tif">
      <tif file="113140182.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能快速偵測的電子鼻及其機器人</chinese-title>
        <english-title>ELECTRONIC NOSE FOR RAPID DETECTION AND ROBOT EQUIPPED WITH ELECTRONIC NOSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">G01N33/00</main-classification>
        <further-classification edition="200601120241030B">G01N30/88</further-classification>
        <further-classification edition="200601120241030B">G01N1/22</further-classification>
        <further-classification edition="200601120241030B">G01D21/02</further-classification>
        <further-classification edition="202401120241030B">G05D1/20</further-classification>
        <further-classification edition="200601120241030B">G01N27/04</further-classification>
        <further-classification edition="200601120241030B">G08C17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾諾斯生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AINOS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖家男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIA-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡群賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庭鵑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡群榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種能快速偵測的電子鼻，包括一進氣單元、一偵測單元、一抽氣單元及一處理單元。該進氣單元包括、一第一及一第二進氣通道。該電子鼻被配置為每隔一待機時間週期，允許一外界氣體從該第二進氣通道進入該腔室內，進氣的時間持續一偵測時間週期，重複直到一偵測訊號符合一特定條件，當符合該特定條件，允許該外界氣體從該第一進氣通道經過該過濾器而進入該腔室內，持續直到該偵測訊號及該環境參數達到一平衡狀態後關閉該第一進氣通道，然後，允許該外界氣體從該第二進氣通道進入該腔室內，根據該偵測訊號得到一關聯於該外界氣體的判斷資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic nose for rapid detection comprises a gas intake unit, a detection unit, an evacuation unit, and a processing unit. The gas intake unit includes a first and a second channel. The electronic nose is configured to allow external gas to enter the chamber through the second channel periodically at a time interval and intake of the external gas lasts for a detection time period. The periodical intakes are repeated until a detection signal satisfies a presence criterion. Once the criterion is satisfied, the external gas is allowed to enter the chamber through the first channel via a filter continuing until a detection signal obtained by the gas sensor element and environmental parameters obtained by the environmental sensors reach an equilibrium state. Then, the external gas is allowed to enter the chamber through the second channel without filtering. Subsequently, a determination result related to the external gas is obtained based on the detection signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電子鼻</p>
        <p type="p">21:進氣單元</p>
        <p type="p">210:第一進氣通道</p>
        <p type="p">211:第二進氣通道</p>
        <p type="p">212:過濾器</p>
        <p type="p">213、214:閥體</p>
        <p type="p">22:偵測單元</p>
        <p type="p">220:腔室</p>
        <p type="p">221:氣體偵測元件</p>
        <p type="p">222:環境偵測元件</p>
        <p type="p">23:抽氣單元</p>
        <p type="p">24:處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="332" publication-number="202618009">
    <tif-files tif-type="multi-tif">
      <tif file="113140188.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑄鐵件的尺寸穩定化方法</chinese-title>
        <english-title>METHOD FOR STABILIZING SIZE OF CAST IRON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">C21D1/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱松茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SUNG-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鑄鐵件的尺寸穩定化方法，包括：將多個震動器設置在一鑄鐵件上，這些震動器隔開於彼此，且這些震動器的震動方向相同；以及進行一消除殘留應力程序，消除殘留應力程序包括控制這些震動器同時作動，以使這些震動器對鑄鐵件傳遞同向震波，其中這些震動器的同向震波在鑄鐵件上疊加，以消除鑄鐵件上的殘留應力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for stabilizing size of cast iron. Multiple vibrators are disposed on a cast iron. The multiple vibrators are separated from each other and a vibrating direction of the multiple vibrators are the same. The cast iron is subjected to a procedure for diminishing residual stress. The procedure for diminishing residual stress includes controlling the multiple vibrators vibrate at the same time to let the multiple vibrators transfer waves to the cast iron in the same direction, wherein the waves in the same direction from the multiple vibrators are overlayed to diminish the residual stress of the cast iron.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="333" publication-number="202619528">
    <tif-files tif-type="multi-tif">
      <tif file="113140190.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電晶體結構及其製造方法</chinese-title>
        <english-title>TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
        <further-classification edition="202501120250102B">H10D62/80</further-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏浩評</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, HAO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭晉佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電晶體結構及其製造方法。所述電晶體結構包括閘介電層、閘極、間隙壁結構、第一摻雜區、第二摻雜區、第三摻雜區以及金屬矽化物層。所述閘介電層設置於基底上。所述閘極設置於所述閘介電層上。所述間隙壁結構位於所述閘介電層上，且設置於所述閘極的側壁上。所述第一摻雜區設置於所述閘極的兩側的所述基底中。所述第二摻雜區設置於所述第一摻雜區中。所述第三摻雜區設置於所述第二摻雜區中。所述金屬矽化物層設置於所述第三摻雜區的表面處。在所述電晶體結構的通道方向上，所述第一摻雜區延伸至所述閘極的下方以與所述閘極部分交疊，所述第二摻雜區延伸至所述間隙壁結構的下方以與所述間隙壁結構部分交疊，且所述金屬矽化物層不延伸至所述閘極的下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a transistor structure and a manufacturing method thereof. The transistor structure includes a gate dielectric layer, a gate, a spacer structure, a first doped region, a second doped region, a third doped region and a metal silicide layer. The gate dielectric layer is disposed on a substrate. The gate is disposed on the gate dielectric layer. The spacer structure is located on the gate dielectric layer and disposed on the sidewall of the gate. The first doped region is disposed in the substrate on two sides of the gate. The second doped region is disposed in the first doped region. The third doped region is disposed in the second doped region. The metal silicide layer is disposed at the surface of the third doped region. In the channel direction of the transistor structure, the first doped region extends below the gate to partially overlap with the gate, the second doped region extends below the spacer structure to partially overlap with the spacer structure, and the metal silicide layer does not extend below the gate electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電晶體結構</p>
        <p type="p">100:基底</p>
        <p type="p">110:金屬矽化物層</p>
        <p type="p">CH:通道區</p>
        <p type="p">DR1:第一摻雜區</p>
        <p type="p">DR2:第二摻雜區</p>
        <p type="p">DR3:第三摻雜區</p>
        <p type="p">G:閘極</p>
        <p type="p">GI:閘介電層</p>
        <p type="p">P1:第一部分</p>
        <p type="p">R1:凹陷</p>
        <p type="p">SP:間隙壁結構</p>
        <p type="p">SP1:第一間隙壁</p>
        <p type="p">SP2:第二間隙壁</p>
        <p type="p">SP3:第三間隙壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="334" publication-number="202619476">
    <tif-files tif-type="multi-tif">
      <tif file="113140192.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241225B">H10B12/00</main-classification>
        <further-classification edition="200601120241225B">H01L21/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳侑廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤碩廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SHUO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱玄通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, HSUAN-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構及其製造方法。所述半導體結構包括基底、第一隔離結構、第二隔離結構、字元線、墊層、覆蓋層以及虛設圖案。所述基底具有記憶元件區與周邊區。所述第一隔離結構設置於所述記憶元件區中的所述基底中，以界定出主動區。所述第二隔離結構設置於所述周邊區中的所述基底中。所述字元線設置於所述主動區中的所述基底中。所述墊層設置於所述記憶元件區中的所述基底上。所述覆蓋層設置於所述墊層上，且向下延伸至所述字元線的頂面。所述虛設圖案設置於所述第二隔離結構中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Providing are a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate, a first isolation structure, a second isolation structure, a word line, a pad layer, a cover layer and a dummy pattern. The substrate has a memory device region and a peripheral region. The first isolation structure is disposed in the substrate in the memory device region to define an active area. The second isolation structure is disposed in the substrate in the peripheral region. The word line is disposed in the substrate in the active area. The pad layer is disposed on the substrate in the memory device region. The cover layer is disposed on the pad layer and extends downward to the top surface of the word line. The dummy pattern is disposed in the second isolation structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基底</p>
        <p type="p">102M,102P:隔離結構</p>
        <p type="p">106:字元線溝槽</p>
        <p type="p">108,110:導電層</p>
        <p type="p">114.120:覆蓋材料層</p>
        <p type="p">116:覆蓋層</p>
        <p type="p">118:虛設圖案</p>
        <p type="p">124:墊層</p>
        <p type="p">AA:主動區</p>
        <p type="p">MR:記憶元件區</p>
        <p type="p">PR:周邊區</p>
        <p type="p">TR:圖案溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="335" publication-number="202617740">
    <tif-files tif-type="multi-tif">
      <tif file="113140193.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不含保護基之間三正丁基錫苯甲胍的製造方法</chinese-title>
        <english-title>METHOD OF MAKING MSNBG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">C07F7/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種不含保護基之間三正丁基錫苯甲胍的製造方法，包含下列步驟：將3-碘苯胺鹽酸鹽、氰胺及鹼性物質予以混合而進行加成反應，藉此生成間碘苯甲胍半硫酸鹽碳酸氫鹽化合物；以及以二(三苯基膦)二氯化鈀作為催化劑，將該間碘苯甲胍半硫酸鹽碳酸氫鹽化合物與六正丁基二錫予以混合而進行取代反應，藉此獲得該不含保護基之間三正丁基錫苯甲胍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of making MSnBG comprises the following steps: mixing m-iodobenzylamine hydrochloride, cyanamide and alkali substances for an addition reaction, thereby generating m-iodobenzylguanidine bicarbonate; and using bis(triphenylphosphine)dichloropalladium as a catalyst and mixing the m-iodobenzylguanidine bicarbonate with hexa-n-butyltin for a replacement reaction, thereby obtaining the MSnBG.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="336" publication-number="202619419">
    <tif-files tif-type="multi-tif">
      <tif file="113140196.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合分隔板及其用於覆銅板壓合製程之用途</chinese-title>
        <english-title>COMPOSITE PARTITION BOARD AND ITS USE FOR COPPER CLAD LAMINATE PRESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K1/03</main-classification>
        <further-classification edition="200601120241204B">B32B15/08</further-classification>
        <further-classification edition="200601120241204B">B32B15/20</further-classification>
        <further-classification edition="200601120241204B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特豪科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEHAO TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林杰鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEH HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於覆銅板壓合製程之複合分隔板，包含一軟層夾於兩硬層中，其中所述軟層之材料包含碳纖維和耐熱樹脂，以及所述硬層之材料包含不銹鋼。本發明另提供一種所述複合分隔板用於覆銅板壓合製程之用途。本發明之複合分隔板用於覆銅板壓合製程，可提升覆銅板壓合後之各層貼附性、有效導熱和減輕複合分隔板之重量，而可克服覆銅板薄型化之技術門檻和節能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a composite partition board for copper clad laminate (CCL) pressing, which comprises a soft layer sandwiched between two hard layers. A material of the soft layer comprises carbon fibers and a heat-resistant resin, and a material of the hard layer comprises stainless steel. Provided is also a use of the composite partition board for CCL pressing. In CCL pressing, the composite partition board can improve the adhesion between all layers of CCL after pressing, improve heat conductivity for CCL pressing, and reduce the total weight of the composite partition board so as to achieve the goal for supper thin CCL and save energy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合分隔板</p>
        <p type="p">10:軟層</p>
        <p type="p">11:硬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="337" publication-number="202618833">
    <tif-files tif-type="multi-tif">
      <tif file="113140201.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按鍵結構</chinese-title>
        <english-title>KEY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">H01H13/705</main-classification>
        <further-classification edition="200601120241226B">H01H13/7065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁欣進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, SHIN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡駿蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾律銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, LYU-CYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啟桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖和信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種按鍵結構，其包括一鍵帽、一底板以及一連接組件。底板包括一本體、一第一卡勾及一第二卡勾。第一卡勾包括一第一延伸部、一第一抵接部及一第一直立部。第一延伸部與第一直立部的一端分別連接於本體，另一端分別往鍵帽的方向延伸並連接至第一抵接部。第二卡勾包括一第二延伸部、一第二抵接部及一第二直立部。第二延伸部與第二直立部的一端分別連接於本體，另一端往鍵帽的方向延伸並連接至第二抵接部。連接組件用以連接鍵帽、及底板的第一卡勾及第二卡勾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A key structure includes a keycap, a base plate, and a connecting assembly. The base plate includes a body, a first hook, and a second hook. The first hook includes a first extending portion, a first propped portion, and a first upright portion. The first extending portion and the first upright portion of the first hook are respectively connected to the body at one end, and are respectively extended towards the keycap and connected to the first propped portion at the other end. The second hook includes a second extending portion, a second propped portion, and a second upright portion. The second extending portion and the second upright portion of the second hook are respectively connected to the body at one end, and the other end is extended towards the keycap and connected to the second propped portion. The connecting assembly is configured to connect the keycap, and the first hook and the second hook of the base plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:按鍵結構</p>
        <p type="p">10:底板</p>
        <p type="p">12:第一卡勾</p>
        <p type="p">13:第二卡勾</p>
        <p type="p">14:第一限位件</p>
        <p type="p">15:第二限位件</p>
        <p type="p">16:第三限位件</p>
        <p type="p">20:連接組件</p>
        <p type="p">21:外框架</p>
        <p type="p">210:第一樞軸組</p>
        <p type="p">213:第一連接桿</p>
        <p type="p">215:第一定位孔</p>
        <p type="p">22:內框架</p>
        <p type="p">220:第二樞軸組</p>
        <p type="p">223:第二連接桿</p>
        <p type="p">224:第二定位孔</p>
        <p type="p">30:鍵帽</p>
        <p type="p">31:連接孔</p>
        <p type="p">32:滑槽</p>
        <p type="p">40:電路板</p>
        <p type="p">41:開口</p>
        <p type="p">A-A:線</p>
        <p type="p">B-B:線</p>
        <p type="p">D1:第一組裝方向</p>
        <p type="p">D2:第二組裝方向</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="338" publication-number="202618256">
    <tif-files tif-type="multi-tif">
      <tif file="113140204.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140204</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>比色法評估膠體污染物傳輸的方法</chinese-title>
        <english-title>METHOD FOR EVALUATING CONTAMINANT MIGRATION OF COLLOID BY USING COLORIMETRY ANALYSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">G01N21/94</main-classification>
        <further-classification edition="200601120241205B">G01N27/00</further-classification>
        <further-classification edition="200601120241205B">G01N33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施宇鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡翠玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSA, TSUEY-LINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此揭示一種以比色法評估膠體污染物傳輸的方法，所述方法包含以下步驟：(a)將待測樣本加入至實驗裝置；(b)施加電場並使用帶負離子的緩衝液，使待測樣品中的至少一污染物於實驗裝置中進行傳輸試驗；(c)拍攝污染物於該實驗裝置中傳輸之影像；以及 (d)以比色法評估該污染物之傳輸，隨著電場施加時間之色階強度變化作圖，經分析後產生一成像區域污染物的橫向濃度分布圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a method for evaluating contaminant using a colorimetric migration of colloid by using colorimetry analysis. The method comprising the following steps: (a) adding the sample to be tested into an experimental device comprising a porous material; (b) applying an electric field and using an anionic buffer solution, allowing at least one contaminant in the sample to undergo a migration test within the porous material experimental device; (c) capturing images of the contaminant's migration within the porous material experimental device; and (d) evaluating the migration of the contaminant using colorimetry by plotting the intensity change of the color scale over time during the application of the electric field, and generating a lateral concentration distribution map of the elements in the imaging area after analysis.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="339" publication-number="202619329">
    <tif-files tif-type="multi-tif">
      <tif file="113140206.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>強健式的伺服器分派方法與系統</chinese-title>
        <english-title>ROBUST SERVER DISPATCH METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250502B">H04L47/125</main-classification>
        <further-classification edition="202201120250502B">H04L43/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種強健式的伺服器分派方法與系統，用於在包含索引伺服器、多個客戶裝置和多個私有伺服器的網路環境中操作。本發明的方法與系統主要包含：在索引伺服器中儲存多個私有伺服器的資料，包含公司碼和私有伺服器IP位址；客戶裝置向索引伺服器傳送包含公司碼、個人碼和密碼的連線請求；索引伺服器根據公司碼查詢並獲取對應的私有伺服器IP位址；索引伺服器將連線請求轉發至相應的私有伺服器；私有伺服器驗證連線請求的有效性；當驗證通過後，允許客戶裝置連線至私有伺服器。本發明的方法與系統通過分散處理負載，有效地克服了單一伺服器架構的局限性，並且提高了系統的整體性能和穩定性，還能更好地滿足不同公司的個別需求，同時保障資料安全和隱私。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:索引伺服器</p>
        <p type="p">120:客戶裝置</p>
        <p type="p">130:私有伺服器</p>
        <p type="p">140:網路</p>
        <p type="p">S01-S07:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="340" publication-number="202619333">
    <tif-files tif-type="multi-tif">
      <tif file="113140210.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140210</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具智能篩選功能之列印系統及列印方法</chinese-title>
        <english-title>PRINTING SYSTEM HAVING INTELLIGENT FILTERING FUNCTION AND PRINTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H04N1/387</main-classification>
        <further-classification edition="200601120241204B">H04N1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東友科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECO IMAGE SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱奕安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種具智能篩選功能之列印系統，包含列印裝置及分析模組。列印裝置包含處理器、掃描單元及操控單元。掃描單元及操控單元與處理器連接。掃描單元對原稿執行掃描作業，以取得第一副本。操控單元產生內容篩選設定訊號，並傳送至處理器。分析模組接收第一副本以及內容篩選設定訊號，且包含辨識模組及內容篩選模組。辨識模組對第一副本執行辨識作業，並產生辨識結果。內容篩選模組架構於依據內容篩選設定訊號及辨識結果對第一副本執行內容篩選作業，以產生第二副本。列印裝置接收第二副本，並以第二副本執行影像輸出作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A printing system having intelligent filtering function is disclosed and includes a printing device and an analysis module. The printing device includes a processor, a scanning unit and an operating unit. The scanning unit and the operating unit are in connection with the processor. The scanning unit is configured to conduct a scan operation to an original document, so as to generate a first copy. The operating unit generates a content filtering signal, and transmits the content filtering signal to the processor. The analysis module receives the first copy and the content filtering signal, and includes an identification module and a content filtering module. The identification module conducts an identifying operation to the first copy, and generates an identifying result. The content filtering module configured to conduct a content filtering operation to the first copy according the content filtering signal and the identifying result, so as to generate a second copy. The printing device receives the second copy and conduct an output operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:列印裝置</p>
        <p type="p">10:處理器</p>
        <p type="p">11:掃描單元</p>
        <p type="p">12:操控單元</p>
        <p type="p">121:輸入介面</p>
        <p type="p">13:列印單元</p>
        <p type="p">2:分析模組</p>
        <p type="p">21:辨識模組</p>
        <p type="p">22:內容篩選模組</p>
        <p type="p">23:資料儲存單元</p>
        <p type="p">24:編排模組</p>
        <p type="p">3:雲端裝置</p>
        <p type="p">4:通訊網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="341" publication-number="202619248">
    <tif-files tif-type="multi-tif">
      <tif file="113140211.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高功率返馳式電源系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120250122B">H02M1/44</main-classification>
        <further-classification edition="200601120250122B">H02M3/156</further-classification>
        <further-classification edition="200601120250122B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太生能源科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹原科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周冠傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐勝源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宇喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳森統</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高功率返馳式電源系統，係至少包含一返馳式電源單元、一返馳諧振電源單元及一啟動控制單元，該返馳式電源單元係具有一主變壓器及一第一開關元件，而該返馳諧振電源單元係至少具有一諧振變壓器、一吸收電路模組及一開關模組，該吸收電路模組係具有一諧振電容元件，而該開關模組係具有一第二開關元件，其中該第一開關元件關閉時，係會產生一高電壓尖峰能量，該高電壓尖峰能量係對該諧振電容元件進行充電，並於該諧振電容元件放電之後，該第二開關元件係進行關閉，而該諧振變壓器係將該第二電源能量釋放給該輸出電路模組；</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高功率返馳式電源系統</p>
        <p type="p">11:電源濾波器</p>
        <p type="p">12:返馳式電源單元</p>
        <p type="p">13:返馳諧振電源單元</p>
        <p type="p">14:啟動控制單元</p>
        <p type="p">15:輔助供電單元</p>
        <p type="p">2:輸入電源端</p>
        <p type="p">3:負載端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="342" publication-number="202619299">
    <tif-files tif-type="multi-tif">
      <tif file="113140212.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類比數位轉換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H03M1/46</main-classification>
        <further-classification edition="200601120241101B">H03M1/12</further-classification>
        <further-classification edition="200601120241101B">H03M1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太生能源科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡一帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宇喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>司家駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種類比數位轉換裝置，係至少包含一分壓電路、一至少一個第一前端電路、一至少一個第二前端電路、一至少兩個逐次逼近類比數位轉換器及一數位加法合成器，該分壓電路用以將一輸入電壓分壓為一粗調分壓值及一微調分壓值，該第一前端電路及該第二前端電路用以分別輸出一粗調輸出電壓及一微調輸出電壓，其中該微調輸出電壓之數值係等於該輸入電壓之數值，且再透過不同的逐次逼近類比數位轉換器輸出不同的數位訊號，最後再將不同的數位訊號透過該數位加法合成器進行合成為一數位輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:分壓電路</p>
        <p type="p">2:第一前端電路</p>
        <p type="p">21:緩衝器</p>
        <p type="p">3:第二前端電路</p>
        <p type="p">31:放大器</p>
        <p type="p">32:可調增益控制器</p>
        <p type="p">41:第一濾波器</p>
        <p type="p">42:第二濾波器</p>
        <p type="p">51:第一逐次逼近類比數位轉換器</p>
        <p type="p">52:第二逐次逼近類比數位轉換器</p>
        <p type="p">6:數位加法合成器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="343" publication-number="202619297">
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      <tif file="113140213.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數位類比轉換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H03M1/12</main-classification>
        <further-classification edition="200601120241101B">G05B19/042</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太生能源科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡一帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宇喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>司家駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數位類比轉換裝置，係至少包含一控制器、一至少一個第一前端電路、一至少一個第二前端電路、一加法放大電路，其中該第一前端電路係用以調整有一衰減增益值，該控制器係依據該衰減增益值設定有一衰減比例，並依據該衰減比例輸出有一第一類比電壓信號及一第二類比電壓信號，該第一前端電路與該第二前端電路分別接收該第一類比電壓信號該第二類比電壓信號，並輸出一微調輸出電壓及一粗調輸出電壓，而該加法放大電路則依據該微調輸出電壓及該粗調輸出電壓輸出有一類比輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:控制器</p>
        <p type="p">2:第一前端電路</p>
        <p type="p">3:第二前端電路</p>
        <p type="p">4:加法放大電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="344" publication-number="202617439">
    <tif-files tif-type="multi-tif">
      <tif file="113140214.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具透氣排濕效果之長效性保健機能絨皮及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">B32B37/06</main-classification>
        <further-classification edition="200601120241104B">B32B23/08</further-classification>
        <further-classification edition="200601120241104B">A61N5/08</further-classification>
        <further-classification edition="200601120241104B">D06N3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碩璟企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白丞堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具透氣排濕效果之長效性保健機能絨皮，包含有一高彈性聚合層，其包含一高彈性TPU片體的上層與下層分別設置一相連接的TPU熱熔膠薄膜所構成，並且該高彈性聚合層具有多個貫穿的孔洞；二柔絨布，該等柔絨布分別設置在該高彈性聚合層的頂面與底面，並透過表面熱融的TPU，使其緊密結合、形成一具有彈性的機能絨皮半成品；且柔絨布表面透過塗佈處理，讓柔絨布表面具有遠紅外線材料與石墨烯材料共構；再經以裁切工具定位裁切，製成一具透氣、排濕效果，且可耐水洗、重覆使用之單片型保健機能絨皮；使該機能絨皮敷貼於皮膚表面時，即可透過柔絨布表面的遠紅外線與石墨烯能量元素的激活作用，達到促進血液循環與筋肉活絡的身體保健功效者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:高彈性TPU片體</p>
        <p type="p">21、22:TPU熱熔膠薄膜</p>
        <p type="p">30:高彈性聚合層</p>
        <p type="p">31:孔洞</p>
        <p type="p">41、42:柔絨布</p>
        <p type="p">S:短絨毛</p>
        <p type="p">50:具有彈性的機能絨皮半成品</p>
        <p type="p">60:具透氣排濕效果之長效性保健機能絨皮</p>
        <p type="p">A、B:壓輥機</p>
        <p type="p">A1:輥壓輪</p>
        <p type="p">A2:沖塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="345" publication-number="202619331">
    <tif-files tif-type="multi-tif">
      <tif file="113140218.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測詐騙源頭的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR FRAUD SOURCE DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L61/4511</main-classification>
        <further-classification edition="202201120250203B">H04L61/45</further-classification>
        <further-classification edition="202201120250203B">H04L9/40</further-classification>
        <further-classification edition="202101120250203B">H04W12/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡政嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JENG-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種偵測詐騙源頭的系統，包含封包分析裝置、第一資料庫、第二資料庫及即時運算裝置。封包分析裝置包含第一處理器。第一處理器分析多個網域名稱系統資料及多個通用封包無線服務隧道協議資料，以分別產生多個第一分析資料以及多個第二分析資料。即時運算裝置包含第二處理器。第二處理器根據第一及第二分析資料，產生第一網域的生成時間及失效時間，以及第一門號存取第一網域的多個時間。第二處理器根據第一網域的生成時間及失效時間，以及第一門號存取第一網域的這些時間，判斷第一門號是否為詐騙門號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for fraud source detection is provided. The system includes a packet analysis device, a first database, a second database and a real-time computing device. The packet analysis device includes a first processor. The first processor analyzes domain name system data and general packet radio service tunnelling protocol data to generate first and second analysis data. The real-time computing device includes a second processor. The second processor generates a generation time and an expire time of a first domain name and times of a first phone number accessing the first domain name according to the first and second analysis data. The second processor determines whether the first phone number is a fraud number according to the generation time, the expire time and the times of the first phone number accessing the first domain name.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:封包分析裝置</p>
        <p type="p">101:處理器</p>
        <p type="p">102:記憶體</p>
        <p type="p">200:即時運算裝置</p>
        <p type="p">201:處理器</p>
        <p type="p">202:記憶體</p>
        <p type="p">300:資料庫</p>
        <p type="p">400:資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="346" publication-number="202618657">
    <tif-files tif-type="multi-tif">
      <tif file="113140219.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用人工智慧模型之理專輔助系統與方法</chinese-title>
        <english-title>FINANCIAL SPECIALIST ASSIST SYSTEM AND METHOD USING AN ARTIFICIAL INTELLIGENCE MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241101B">G06Q40/06</main-classification>
        <further-classification edition="202301120241101B">G06Q30/06</further-classification>
        <further-classification edition="202301120241101B">G06Q30/02</further-classification>
        <further-classification edition="200601120241101B">G06N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉智淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用人工智慧模型之理專輔助系統與方法。此使用人工智慧模型之理專輔助系統包含伺服器。伺服器包含記憶體和處理器，以進行上述使用人工智慧模型之理專輔助方法。使用人工智慧模型之理專輔助方法包含：根據複數個歷史客戶的複數筆歷史投資資料、複數筆歷史投資目標資料、複數筆歷史財務狀況資料以及複數筆歷史風險承受能力資料來建立一客戶屬性模型；接收目前客戶之一投資目標資料以及一財務狀況資料；以及根據投資目標資料以及財務狀況資料來計算出目前客戶之一客戶風險承受能力以及相應之一建議投資組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A financial specialist assist system and a financial specialist assist method using an artificial intelligence model are provided. The specialist assist system includes a server including a memory and a processor to perform the financial specialist assist method using an artificial intelligence model. The financial specialist assist method using an artificial intelligence model includes: building a model of customer properties in accordance with historic investment data, historic investment goals data, historic financial situation data and historic risk tolerance data of plural historic customers; receiving investment goals data and financial situation data of a current customer; calculating a risk tolerance and a corresponding suggested investment portfolio of the current customer by using the model of customer properties in accordance with the investment goals data and financial situation data of the current customer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:使用人工智慧模型之理專輔助系統</p>
        <p type="p">110:伺服器</p>
        <p type="p">120:移動式電腦裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="347" publication-number="202619433">
    <tif-files tif-type="multi-tif">
      <tif file="113140220.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件及其製作方法</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND MANUFACTURE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">H05K3/46</main-classification>
        <further-classification edition="200601120241128B">H05K3/30</further-classification>
        <further-classification edition="200601120241128B">H05K1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅志杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種電路板組件及其製作方法。本申請通過在基板的凹槽內安裝第一電子器件，在凹槽的側壁上設置導電體與導電膏，並在第一電子器件和第二電子器件上分別設置第一連接部和第二連接部，通過導電體、導電膏、第一連接部和第二連接部之間的連接，便能夠實現第一電子器件、第二電子器件、基板這三者之間的互連，因此能夠省略基板上用於連接電子器件的線路，從而能夠減小基板尺寸、減少空間內部佈線、節約成本，還能提高信號傳送速率和性能，並能增強基板與電子器件之間連接的可靠性和穩定性，減少基板的空間干涉問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a circuit board assembly and a manufacture method thereof. The present application achieves interconnection among a first electronic component, a second electronic component, and a substrate by installing the first electronic component within a groove on the substrate, arranging conductors and conductive paste on the sidewalls of the groove, and providing a first connecting part and a second connecting part respectively on the first electronic component and the second electronic component. Connections among the conductors, the conductive paste, the first connecting part, and the second connecting part enable the omission of wiring on the substrate used for connecting electronic components. Consequently, it is possible to reduce the size of the substrate, minimize internal wiring space, save costs, enhance signal transmission speed and performance, and improve the reliability and stability of the connections between the substrate and the electronic components. Furthermore, it mitigates the issue of spatial interference with the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">10:基板</p>
        <p type="p">11:第一線路板</p>
        <p type="p">12，16，181，191:介電層</p>
        <p type="p">13，17，182，192:線路層</p>
        <p type="p">14:導電孔</p>
        <p type="p">15:第二線路板</p>
        <p type="p">18:第三線路板</p>
        <p type="p">19:第四線路板</p>
        <p type="p">171:焊盤</p>
        <p type="p">204:凹槽</p>
        <p type="p">30:導電體</p>
        <p type="p">40:防焊層</p>
        <p type="p">50:膠層</p>
        <p type="p">60:錫球</p>
        <p type="p">70:第一電子器件</p>
        <p type="p">71:第一連接部</p>
        <p type="p">711:第一分部</p>
        <p type="p">712:第二分部</p>
        <p type="p">72:引腳</p>
        <p type="p">73:灌封膠</p>
        <p type="p">732:第二部分</p>
        <p type="p">80:導電膏</p>
        <p type="p">90:第二電子器件</p>
        <p type="p">91:第二連接部</p>
        <p type="p">92:注塑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="348" publication-number="202617444">
    <tif-files tif-type="multi-tif">
      <tif file="113140221.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>印表機紙張管理系統</chinese-title>
        <english-title>PRINTER PAPER MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B41J29/393</main-classification>
        <further-classification edition="200601120241204B">B41J3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東友科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECO IMAGE SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種印表機紙張管理系統包括列印裝置、驅動控制模組、影像擷取模組以及影像處理模組。列印裝置組配於列印位置進行列印作業。驅動控制模組連接列印裝置，組配將紙張由紙匣傳送至列印位置並供列印裝置對紙張進行列印作業，並允許翻轉紙張。影像擷取模組設置於紙匣和列印位置之間，組配於驅動控制模組將紙張由紙匣傳送至列印位置前擷取該紙張的影像。影像處理模組連接影像擷取模組和驅動控制模組，接收紙張的影像並進行預處理，並提取影像特徵傳送至驅動控制模組，其中驅動控制模組基於影像特徵判定是否以紙張進行列印作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A printer paper management system is disclosed and includes a printing device, a driving-and-controlling module, an image-capturing module and an image-processing module. The printing device is configured in a printing position to perform a printing operation. The driving-and-controlling module is connected to the printing device, and configured to transport a paper from the paper cassette to the printing position for the printing device printing on the paper, and allows the paper to be turned over. The image-capturing module is arranged between the paper cassette and the printing position, and configured to capture an image of the paper before the paper is transferred from the paper cassette to the printing position. The image-processing module is connected to the image-capturing module and the driving-and-controlling module, receives and processes the image of the paper to extract image features, which is transmitted to the driving-and-control module. The driving-and-controlling module determines whether to use the paper based on the image features for a printing job of the printing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:印表機紙張管理系統</p>
        <p type="p">10:列印裝置</p>
        <p type="p">20:驅動控制模組</p>
        <p type="p">30:影像擷取模組</p>
        <p type="p">40:影像處理模組</p>
        <p type="p">7:出紙匣</p>
        <p type="p">8、8’:紙張</p>
        <p type="p">9:紙匣</p>
        <p type="p">L1:攝像位置</p>
        <p type="p">L2:列印位置</p>
        <p type="p">P1:第一傳送路徑</p>
        <p type="p">P2:第二傳送路徑</p>
        <p type="p">P3:第三傳送路徑</p>
        <p type="p">T1:第一轉折點</p>
        <p type="p">T2:第二轉折點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="349" publication-number="202617354">
    <tif-files tif-type="multi-tif">
      <tif file="113140229.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>夾鉗裝置</chinese-title>
        <english-title>CLAMP DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">B25B5/16</main-classification>
        <further-classification edition="200601120241226B">B25B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明溪工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MING HSI INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張進銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種夾鉗裝置，其包括：一座體及一鉗口模組。該座體包含有一基部及複數夾持單元，該複數夾持單元呈直線配置地設於該基部，各該夾持單元包含有二夾持件，該二夾持件可相對移動於一第一狀態及一第二狀態地設於該基部，各該夾持件包含有一夾掣部；該鉗口模組組接於一該夾持單元，該至少一鉗口模組包含有二壓模塊，各該壓模塊包含有一第一連結部及一第二連結部；其中，當該二夾持件夾持該二壓模塊時，該二夾持件之夾掣部與該二壓模塊之第一連結部相結合，該二夾持件位於該第一狀態，當該二夾持件未夾持該二壓模塊時，該二夾持件位於該第二狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a clamp device, which includes: a base body and a jaw module. The base body comprises a base and a plurality of clamping units. The plurality of clamping units are arranged in a straight line on the base, with each clamping unit including two clamping parts. The two clamping parts can move relative to each other between a first state and a second state on the base. Each clamping part includes a clamping portion. The jaw module is connected to one of the clamping units, and the at least one jaw module includes two pressing modules. Each pressing module includes a first connecting part and a second connecting part. When the two clamping parts clamp the two pressing modules, the clamping portions of the two clamping parts engage with the first connecting parts of the two pressing modules, and the two clamping parts are in the first state. When the two clamping parts do not clamp the two pressing modules, the two clamping parts are in the second state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:座體</p>
        <p type="p">11:基部</p>
        <p type="p">15:金屬塊</p>
        <p type="p">2:夾持單元</p>
        <p type="p">3:鉗體</p>
        <p type="p">31:握持部</p>
        <p type="p">311:卡槽</p>
        <p type="p">33:工作頭</p>
        <p type="p">6:懸掛件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="350" publication-number="202617012">
    <tif-files tif-type="multi-tif">
      <tif file="113140233.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合式鈦金屬鍋具及其製造方法</chinese-title>
        <english-title>COMPOSITE TITANIUM METAL COOKWARE AND THE MANUFACTURE METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">A47J27/00</main-classification>
        <further-classification edition="200601120241104B">A47J36/02</further-classification>
        <further-classification edition="200601120241104B">B32B15/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽鈦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIMAS TITAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝涵淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HAN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝涵婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HAN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種複合式鈦金屬鍋具，其包括：一多層鍋具本體，多層鍋具本體包含位於多層鍋具本體的內側面的一鈦金屬層，和位於多層鍋具本體的外側面的一不鏽鋼層，和位於鈦金屬層和不鏽鋼層之間的鋁合金夾層結構；其中，鈦金屬層和不鏽鋼層是透過原子擴散接合手段結合於鋁合金夾層結構的兩側面。本發明同時還公開一種複合式鈦金屬鍋具的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Present invention discloses a composite titanium metal cookware, includs: a multi-layer cookware body. The multi-layer cookware body includes a titanium metal layer located on the inner side of the multi-layer cookware body; a stainless steel layer on the outer side, and an aluminum alloy sandwich structure located between the titanium metal layer and the stainless steel layer; wherein the titanium metal layer and the stainless steel layer are combined on both sides of the aluminum alloy sandwich structure through atomic diffusion bonding means. The invention also discloses a method for manufacturing a composite titanium metal cookware.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合式鈦金屬鍋具</p>
        <p type="p">10:多層鍋具本體</p>
        <p type="p">101:內側面</p>
        <p type="p">102:外側面</p>
        <p type="p">11:凹穴狀空間</p>
        <p type="p">12:握把</p>
        <p type="p">13:提把</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="351" publication-number="202617286">
    <tif-files tif-type="multi-tif">
      <tif file="113140237.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>等離子表面處理機及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B08B7/00</main-classification>
        <further-classification edition="200601120241204B">B08B11/00</further-classification>
        <further-classification edition="200601220241204B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創發製造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡偉強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳烊朱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是提供一種等離子表面處理機及其製造方法，主要係藉由一機體、一滑座、一固定組件及一等離子槍所相對構成；藉此，本發明等離子表面處理機利用等離子體的等離子體射流以物理轟擊兼具化學反應的清理，以去除待處理物件表面的有機污染物、氧化層，能令待處理物件表面達到更全面、更高效的清潔和表面改質效果，且通過高壓水流或超聲波清洗，可進一步去除等離子處理後殘留的污染物和反應產物，並可搭配水洗機使用效果更佳，以達到更深層次的清潔效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">A:作業通道</p>
        <p type="p">B:待處理物件</p>
        <p type="p">11:傳動馬達</p>
        <p type="p">17:腳架</p>
        <p type="p">18:腳輪</p>
        <p type="p">30:等離子槍</p>
        <p type="p">32:旋轉馬達</p>
        <p type="p">33:槍頭</p>
        <p type="p">40:透明罩</p>
        <p type="p">41:導引槽孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="352" publication-number="202618085">
    <tif-files tif-type="multi-tif">
      <tif file="113140239.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改良玻璃纖維布</chinese-title>
        <english-title>MODIFIED FIBERGLASS CLOTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241030B">D03D15/267</main-classification>
        <further-classification edition="200601120241030B">C03C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林榮郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林紋瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯有明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YEOU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種改良玻璃纖維布。所述改良玻璃纖維布包含多條經紗及與多條所述經紗交織的多條緯紗。多條所述經紗具有介於63 條/吋至74 條/吋之間的經紗密度及介於0.033毫米至0.098毫米之間的經紗間隙。多條所述緯紗具有介於48 條/吋至77條/吋的緯紗密度及介於0.012毫米至0.098毫米之間的緯紗間隙。所述玻璃纖維布的基重是介於45 g/m        &lt;sup&gt;2&lt;/sup&gt;至108 g/m        &lt;sup&gt;2&lt;/sup&gt;之間。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modified fiberglass cloth is provided. The modified fiberglass cloth includes a plurality of warps and a plurality of yarns weaved with the warps. The warps have a warp density of between 63 strip/inch and 74 strip/inch and a warp gap of between 0.033 mm and 0.098 mm. The yarns have a yarn density of between 48 strip/inch and 77 strip/inch and a yarn gap between 0.012 mm and 0.098 mm. A basis weight of the modified fiberglass cloth is between 45 g/m        &lt;sup&gt;2&lt;/sup&gt;and 108 g/m        &lt;sup&gt;2&lt;/sup&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:改良玻璃纖維布</p>
        <p type="p">1:經紗</p>
        <p type="p">2:緯紗</p>
        <p type="p">G1:經紗間隙</p>
        <p type="p">G2:緯紗間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="353" publication-number="202617589">
    <tif-files tif-type="multi-tif">
      <tif file="113140240.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製備具高流動性之球形氮化鋁粉體的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">C01B21/072</main-classification>
        <further-classification edition="200601120241106B">C04B35/581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家中山科學研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮建龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUAN, JIAN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施政宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種製備具高流動性之球形氮化鋁粉體的方法，步驟包括：(A)提供一氮化鋁粉體、一燒結助劑、一分散劑與一溶劑，將其按照一第一固定重量比例進行第一次濕式球磨混合；(B)提供一黏結劑與一有機醇類添加劑，將其按照一第二固定重量比例放入上述步驟(A)之混合物中進行第二次濕式球磨混合，形成一混合漿料；(C)將該混合漿料進行液滴霧化；(D)將該霧化後之混合漿料進行乾燥，得到乾燥之球形氮化鋁顆粒；(E)收集該乾燥之球形氮化鋁顆粒，得到平均粒徑分佈D&lt;sub&gt;50&lt;/sub&gt;為60~90μm、鬆裝密度為0.8~1.1g/cm&lt;sup&gt;3&lt;/sup&gt;、安息角為30°以下的高流動性球形氮化鋁粉體。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S101-S105:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="354" publication-number="202619589">
    <tif-files tif-type="multi-tif">
      <tif file="113140255.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測器封裝結構、及感測模組與其製造方法</chinese-title>
        <english-title>SENSOR PACKAGE STRUCTURE, SENSING MODULE, AND MANUFACTURING METHOD OF SENSING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F77/50</main-classification>
        <further-classification edition="202501120250102B">H10F77/40</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何協哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XIE-ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李新春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SIN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高聖峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHENG FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉泯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種感測器封裝結構、及感測模組與其製造方法。所述感測模組包含一感測晶片及一蓋體。所述感測晶片的頂面包含有一感測區域及位於所述感測區域外側的一承載區域。所述蓋體包含一透光片與一不透明黏著層。所述透光片的內表面包含一透光區域及圍繞於所述透光區域外側的一加工區域。所述不透明黏著層呈環狀且黏固於所述加工區域。所述不透明黏著層能供一雷射光束穿過。所述蓋體以所述不透明黏著層黏固於所述承載區域，以使所述蓋體與所述感測晶片共同包圍形成一封閉空間，所述透光片的所述透光區域面向所述感測晶片的所述感測區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a sensor package structure, a sensing module, and a manufacturing method of a sensing module. The sensing module includes a sensor chip and a cap. A top surface of the sensor chip includes a sensing region and a carrying region that is arranged outside of the sensing region. The cap includes a light-permeable sheet and an opaque adhesive layer. An inner surface of the light-permeable sheet includes a light-permeable region and a processing region that surrounds the light-permeable region. The opaque adhesive layer has an annular shape and is adhered to the processing region. The opaque adhesive layer is provided for allowing a laser beam to pass therethrough. The cap is adhered to the carrying region through the opaque adhesive layer, such that the cap and the sensor chip jointly define an enclosed space, and the light-permeable region of the light-permeable sheet faces toward the sensing region of the sensor chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測器封裝結構</p>
        <p type="p">1:基板</p>
        <p type="p">11:第一板面</p>
        <p type="p">111:固晶區</p>
        <p type="p">112:接合墊</p>
        <p type="p">12:第二板面</p>
        <p type="p">2:感測晶片</p>
        <p type="p">21:頂面</p>
        <p type="p">211:感測區域</p>
        <p type="p">212:承載區域</p>
        <p type="p">213:連接墊</p>
        <p type="p">22:底面</p>
        <p type="p">3:金屬線</p>
        <p type="p">4:蓋體</p>
        <p type="p">41:透光片</p>
        <p type="p">411:內表面</p>
        <p type="p">4111:透光區域</p>
        <p type="p">4112:加工區域</p>
        <p type="p">412:外表面</p>
        <p type="p">413:側表面</p>
        <p type="p">42:不透明黏著層</p>
        <p type="p">5:封裝體</p>
        <p type="p">6:焊接球</p>
        <p type="p">M:感測模組</p>
        <p type="p">E:封閉空間</p>
        <p type="p">S:最短間隔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="355" publication-number="202617563">
    <tif-files tif-type="multi-tif">
      <tif file="113140260.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓傳送帶移轉及單軌道運輸系統及方法</chinese-title>
        <english-title>AUTOMATICAL MATERIAL HANDING MONOTACK AND LOADPORT TRANSFER SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">B65G49/07</main-classification>
        <further-classification edition="200601120241129B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾迪森投顧有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDSN HOLDING LLC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧羽辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, YU CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭朋深</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種晶圓傳送帶移轉系統及單軌道運輸系統及方法，主要系統包括有支撐架、抓取機構、單軌車體、單軌旋轉盤、軌道及單軌平行移轉裝置所組成，其係為單軌運輸結構結合抓取運輸結構形成的方法，其方法為該裝載晶圓盒在運輸軌道結構體上運行至移載區的抓取機構下方，以便晶圓盒進行抓取作業，其方法為經過抓取機構抓取晶圓盒的兩側的耳翼，並經過內側升降機構的舉高晶圓盒，在移轉區由內側移轉至外側，經由外側升降機構降下該晶圓盒至單軌車體上，再將晶圓盒運輸至直立式晶圓盒倉儲設備及二次傳送設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is a wafer conveyor transfer system and a monorail transportation system and method. The main system includes a support frame, a grabbing mechanism, a monorail car body, a monorail rotating disk, a track and a monorail parallel transfer device. It is a method of forming a monorail transport structure combined with a grabbing transport structure. The method is to run the loaded wafer box on the transport track structure to below the grabbing mechanism in the transfer area so that the wafer box can be grabbed. The method is In order to grab the ear wings on both sides of the wafer box through the grabbing mechanism, lift the wafer box through the inner lifting mechanism, transfer it from the inside to the outside in the transfer area, and lower the wafer box through the outer lifting mechanism to On the monorail car body, the wafer box is transported to the vertical wafer box storage equipment and secondary transfer equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1&lt;i&gt;"&lt;/i&gt;:移轉區</p>
        <p type="p">1:抓取機構</p>
        <p type="p">14,14&lt;i&gt;'&lt;/i&gt;:連接桿</p>
        <p type="p">2:晶圓盒</p>
        <p type="p">3:運輸軌道結構體</p>
        <p type="p">4:支撐架</p>
        <p type="p">41:傳送桿</p>
        <p type="p">5:單軌車體</p>
        <p type="p">531:凹型嵌入空間</p>
        <p type="p">7:軌道</p>
        <p type="p">M:移動線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="356" publication-number="202618388">
    <tif-files tif-type="multi-tif">
      <tif file="113140262.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
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          <doc-number>202618388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有一維擴瞳投影鏡頭之延展實境系統</chinese-title>
        <english-title>EXTENDED REALITY SYSTEM WITH ONE-DIMENSIONAL PUPIL EXPANSION PROJECTION LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">G02B13/18</main-classification>
        <further-classification edition="200601120241129B">G02B11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫文信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, WEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐英舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIU, YING-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淮智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUAI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫慶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHING-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇威佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WEI-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林世穆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有一維擴瞳投影鏡頭之延展實境系統及其投影鏡頭結構，其中延展實境系統包括：導光元件，具有第一光耦合部、第二光耦合部、入光部；第一體積全像元件，光耦合於第一光耦合部；第二體積全像元件，光耦合於第二光耦合部；以及一維擴瞳之矩形投影鏡頭，光投射至入光部；其中第一體積全像元件及/或第二體積全像元件，設有一維轉成二維之光柵。藉由本發明之實施，可以使延展實境系統 減少系統複雜及體積，又可擴大視角及提高光轉換效率…等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an extended reality system with one-dimensional pupil expansion projection lens and a projection lens structure thereof. The extended reality system comprises: a light guide element having a first light coupling part, a second light coupling part, and a light incident part; a first volumetric holographic element optically coupled to the first light coupling part; a second volumetric holographic element optically coupled to the second light coupling part; and a one-dimensional pupil expanded lens projecting light to the light incident part; wherein the first volume holographic element and/or the second volume holographic element are configured to convert one dimension into two dimensions of grating. Through the implementation of the present invention, the extended reality system can reduce system complexity and volume, expand the viewing angle, improve light conversion efficiency, etc.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具有一維擴瞳投影鏡頭之延展實境系統</p>
        <p type="p">10:導光元件</p>
        <p type="p">111:第一光耦合部</p>
        <p type="p">112:第二光耦合部</p>
        <p type="p">113:入光部</p>
        <p type="p">114:出光部</p>
        <p type="p">21:第一體積全像元件</p>
        <p type="p">22:第二體積全像元件</p>
        <p type="p">30:一維擴瞳之矩形投影鏡頭</p>
        <p type="p">40:顯示器</p>
        <p type="p">50:人眼或其他取像裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="357" publication-number="202618785">
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      <tif file="113140263.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲存裝置及存取方法</chinese-title>
        <english-title>STORAGE DEVICE AND ACCESS METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G11C16/10</main-classification>
        <further-classification edition="200601120241104B">G06F11/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐伯元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富定恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, DING-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種儲存裝置，包括一記憶陣列、一冗餘陣列、一暫存電路以及一存取電路。記憶陣列具有複數主要記憶胞。冗餘陣列具有複數冗餘記憶胞。暫存電路用以儲存一異常記憶胞的資訊。存取電路根據一存取指令，存取記憶陣列或冗餘陣列。當暫存電路儲存異常記憶胞的資訊時，存取電路判斷存取指令是否指向異常記憶胞。當存取指令指向異常記憶胞時，存取電路存取冗餘陣列。當存取指令未指向異常記憶胞時，存取電路存取記憶陣列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A storage device including a memory array, a redundant array, a register circuit and an access circuit is provided. The memory array includes a plurality of main cells. The redundant array includes a plurality of redundant cells. The register circuit is configured to store information of an abnormal cell. The access circuit accesses the memory array or the redundant array according to an access command. When the register circuit stores the information of the abnormal cell, the access circuit determines whether the access command points to the abnormal cell. When the access command points to the abnormal cell, the access circuit accesses the redundant array. When the access command does not point to the abnormal cell, the access circuit accesses the memory array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:儲存裝置</p>
        <p type="p">110:記憶陣列</p>
        <p type="p">120A:冗餘陣列</p>
        <p type="p">130A:存取電路</p>
        <p type="p">131A:暫存電路</p>
        <p type="p">C00~Cnm:主要記憶胞</p>
        <p type="p">C0R~CnR:冗餘記憶胞</p>
        <p type="p">CMA:存取指令</p>
        <p type="p">ADD1:資訊</p>
        <p type="p">EN1:交換資訊</p>
        <p type="p">WL0~WLn:字元線</p>
        <p type="p">BLR:冗餘位元線</p>
        <p type="p">BL0~BLm:主要位元線</p>
        <p type="p">IN:資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="358" publication-number="202618828">
    <tif-files tif-type="multi-tif">
      <tif file="113140264.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>疊加型觸控鍵盤裝置及其觸控電極模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H01H13/70</main-classification>
        <further-classification edition="200601120250122B">G06F3/041</further-classification>
        <further-classification edition="200601120250122B">G06F3/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幸芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周敬禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周恒生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種疊加型觸控鍵盤裝置，其包含有第一薄膜、導電單元、觸控感應單元及鍵帽。導電單元形成於第一薄膜的第一下表面。觸控感應單元間隔設置於第一薄膜下方。鍵帽設置於觸控電極模組的該第一薄膜的第一上表面上，且鍵帽與導電單元係一對一對應，導電單元係分別對應鍵帽的中心位置設置。如此一來，配置有觸控電極模組的疊加型觸控鍵盤裝置即可提供觸控功能及鍵盤的輸入功能，藉此無須另外配置觸控面板，藉此縮小配置疊加型觸控鍵盤裝置的電子裝置的整體體積，使得電子裝置能更便於攜帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:感應強化單元</p>
        <p type="p">111:第一薄膜</p>
        <p type="p">1111:第一上表面</p>
        <p type="p">1112:第一下表面</p>
        <p type="p">113:間隙塊</p>
        <p type="p">12:觸控感應單元</p>
        <p type="p">121:第一電極</p>
        <p type="p">122:第二電極</p>
        <p type="p">13:導電單元</p>
        <p type="p">20:鍵帽</p>
        <p type="p">21:抵頂塊</p>
        <p type="p">30:剪刀腳支撐架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="359" publication-number="202618581">
    <tif-files tif-type="multi-tif">
      <tif file="113140265.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊分級系統及資訊分級方法</chinese-title>
        <english-title>INFORMATION CLASSIFICATION SYSTEM AND INFORMATION CLASSIFICATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/90</main-classification>
        <further-classification edition="201901120250203B">G06F16/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李珮妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳叙蓓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHU-BEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, JIA-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">資訊分級系統包括資訊蒐集模組、資訊分類模組以及判斷模組。資訊蒐集模組用以蒐集網路資訊。資訊分類模組耦接於資訊蒐集模組。資訊分類模組包括分類模型，且資訊分類模組依據分類模型，將網路資訊分類為第一類別資訊或第二類別資訊。判斷模組耦接於資訊分類模組，用以依據第一類別資訊的時間資訊，將第一類別資訊進行分級。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An information classification system includes an information collection module, an information classification module, and a determination module. The information collection module is configured to collect network information. The information classification module is coupled to the information collection module. The information classification module includes a classification model. The information classification module classifies the network information into first type information or second type information according to the classification model. The determination module is coupled to the information classification module and configured to classify the first type information according to time information of the first type information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資訊分級系統</p>
        <p type="p">10:資訊蒐集模組</p>
        <p type="p">11:資訊分類模組</p>
        <p type="p">11a:分類模型</p>
        <p type="p">13:判斷模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="360" publication-number="202617843">
    <tif-files tif-type="multi-tif">
      <tif file="113140267.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>色轉換薄膜陣列與其製法</chinese-title>
        <english-title>COLOR CONVERSION FILM ARRAY AND PRODUCING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">C08J5/18</main-classification>
        <further-classification edition="202501120250704B">H10H20/81</further-classification>
        <further-classification edition="202501120250704B">H10H20/851</further-classification>
        <further-classification edition="202501120250704B">H10H29/30</further-classification>
        <further-classification edition="200601120250704B">G03F7/20</further-classification>
        <further-classification edition="200601120250704B">C09K11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林清富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING FUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭彥加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YEN CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種色轉換薄膜陣列包含第一和第二色轉換子膜陣列，其中每個色轉換子膜包含光阻以及有機螢光材料，或者再包含無機氧化物奈米微粒。有機螢光材料皆為碳氫氧化合物，對環境友善。第一和第二色轉換子膜陣列的製造僅需要曝光和顯影，且製程溫度皆低於120℃，可以避免高溫導致色轉換材料的顏色衰退。所製作色轉換薄膜陣列的像素密度超過5000PPI。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A color conversion film array includes a first color conversion sub-film array and a second color conversion sub-film array, wherein each color conversion sub-film includes a photoresist and an organic fluorescent material, and may further includes inorganic oxide nanoparticles. The organic fluorescent materials are all hydrocarbons that are friendly to the environment. The manufacture of the first and second color conversion sub-film arrays merely requires exposure and development, and the process temperature is lower than 120° C, which can avoid degradation of the organic fluorescent material. The pixel density of the manufactured color conversion film array exceeds 5000PPI.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">12:第一色轉換子膜陣列</p>
        <p type="p">13:保護層</p>
        <p type="p">15:第二色轉換子膜陣列</p>
        <p type="p">18:遮擋層</p>
        <p type="p">30:底層</p>
        <p type="p">31:圖案化第一光阻層</p>
        <p type="p">32:微結構陣列</p>
        <p type="p">33a:第一凹槽</p>
        <p type="p">33b:第二凹槽</p>
        <p type="p">34:圖案化第二光阻層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="361" publication-number="202619582">
    <tif-files tif-type="multi-tif">
      <tif file="113140270.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虛擬基板、其製造方法及利用其構成的光電裝置</chinese-title>
        <english-title>VIRTUAL SUBSTRATE, ITS MANUFACTURING METHOD AND OPTOELECTRONIC DEVICE COMPOSED OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F39/12</main-classification>
        <further-classification edition="202501120250102B">H10F77/123</further-classification>
        <further-classification edition="202501120250102B">H10F77/124</further-classification>
        <further-classification edition="202501120250102B">H10D99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡雨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種虛擬基板，包括第一化合物半導體基板及其上的第一化合物半導體同質磊晶層；第二化合物半導體薄膜，其中第一及第二化合物半導體均為III-V族或II-VI族的化合物半導體，且二者的晶格常數差異係不小於1%；以及聚合量子點緩衝層，位於第一化合物半導體同質磊晶層及第二化合物半導體薄膜之間，其中聚合量子點緩衝層含有III-V族或II-VI族的化合物半導體材料所形成的量子點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A virtual substrate, including a first compound semiconductor substrate and a first compound semiconductor homoepitaxial layer thereon; a second compound semiconductor film, wherein both the first and second compound semiconductors are group III-V or group II-VI compound semiconductors, and the difference in lattice constant between the two is not less than 1%; and a polymeric quantum dot buffer layer is located between the first compound semiconductor homoepitaxial layer and the second compound semiconductor film, wherein the polymeric quantum dot buffer layer contains quantum dots formed from compound semiconductor materials of group III-V or group II-VI.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一化合物半導體基板</p>
        <p type="p">2:第一化合物半導體同質磊晶層</p>
        <p type="p">3:聚合量子點緩衝層</p>
        <p type="p">4:第二化合物半導體薄膜</p>
        <p type="p">10:虛擬基板</p>
        <p type="p">20:光電元件結構</p>
        <p type="p">100:光電裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="362" publication-number="202619245">
    <tif-files tif-type="multi-tif">
      <tif file="113140273.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體積體電路元件</chinese-title>
        <english-title>SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120241104B">H02M1/32</main-classification>
        <further-classification edition="200601120241104B">H02H9/04</further-classification>
        <further-classification edition="200601120241104B">H05F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂智勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳祖儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的較佳實施例關於一種半導體積體電路元件，用以保護自舉電路中的電壓準位轉換電路。該保護電路包括一個自舉電容偏壓端、一個開關切換端和一個內部電路，這些元件共同工作以實現靜電放電保護。當正常操作時，開關控制電路控制開關電路使其導通，確保電壓準位轉換電路正常工作。然而，當靜電放電發生時，開關控制電路會根據靜電信號關閉開關電路的導通狀態，從而阻止靜電流經過電壓準位轉換電路，避免其損毀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The preferred embodiment of the present invention describes a semiconductor integrated circuit device to safeguard the level shifter circuit within a bootstrap circuit. This protection circuit includes a bootstrap capacitor bias terminal, a switch control terminal, and an internal circuit, which work together to provide static discharge protection. During normal operation, the switch control circuit ensures that the switch circuit is conductive, allowing the level shifter circuit to function correctly. However, when a static discharge occurs, the switch control circuit detects this and interrupts the conductive state of the switch circuit, preventing the static discharge from flowing through the voltage level conversion circuit and thus avoiding damage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">HVA:高壓操作區</p>
        <p type="p">LVA:低壓操作區</p>
        <p type="p">LVS:電壓準位轉換電路</p>
        <p type="p">VB:自舉電容偏壓端</p>
        <p type="p">SW:開關切換端</p>
        <p type="p">303:內部電路</p>
        <p type="p">304:箝位電路</p>
        <p type="p">M1:電晶體</p>
        <p type="p">R1:電阻</p>
        <p type="p">GND:共接電壓端</p>
        <p type="p">301:開關控制電路</p>
        <p type="p">302:開關電路</p>
        <p type="p">SW:開關切換端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="363" publication-number="202617059">
    <tif-files tif-type="multi-tif">
      <tif file="113140274.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸覺及痛覺敏感程度測試器械模組</chinese-title>
        <english-title>MECHANICAL SENSITIVITY TESTING APPARATUS MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241202B">A61B5/00</main-classification>
        <further-classification edition="200601120241202B">G01L1/00</further-classification>
        <further-classification edition="200601120241202B">G01L1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昊東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAO-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘俐伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, LI-LING HOPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳孝觀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIAO-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王署君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUU-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許郁莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸覺及痛覺敏感程度測試器械模組，包括：安裝基座、探針及推頂件。安裝基座具有殼體及位於殼體內的腔室 ，且腔室具有朝向第一方向開設的安裝開口；探針則可卸除地安裝於安裝基座之上，並收納於安裝開口中；推頂件設置於殼體之上且頂靠於探針的基部，並延第二方向提供側向力以將探針固定於安裝開口中，且側向力之施力方向垂直或大致垂直於第一方向。其中，當探針觸壓人體皮膚之壓力大於側向力的固定能力時，探針脫離推頂件並延第一方向退縮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a mechanical sensitivity testing apparatus module, which includes: a mounting base, a pricking probe, and an pushing element. The mounting base has a housing and a chamber located within the housing, with the chamber having a mounting opening oriented in a first direction. The pricking probe is removably installed on the mounting base and housed within the mounting opening. The pushing element is arranged on the housing and abuts the base of the pricking probe, providing lateral force in a second direction to fix the pricking probe in the mounting opening. The direction of the lateral force is perpendicular or substantially perpendicular to the first direction. When the pressure exerted by the pricking probe on the human skin exceeds the fixing capacity of the lateral force, the pricking probe disengages from the pushing element and retracts in the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">F1:觸壓之壓力</p>
        <p type="p">SF:側向力</p>
        <p type="p">SK:人體皮膚</p>
        <p type="p">M1:第一標示記號</p>
        <p type="p">M2:第二標示記號</p>
        <p type="p">1:觸覺及痛覺敏感程度測試器械模組</p>
        <p type="p">10:安裝基</p>
        <p type="p">11:殼體</p>
        <p type="p">111:調節孔</p>
        <p type="p">12:腔室</p>
        <p type="p">121:安裝開口</p>
        <p type="p">20:推頂件</p>
        <p type="p">21:推頂元件</p>
        <p type="p">22:彈性元件</p>
        <p type="p">23:調節元件</p>
        <p type="p">231:螺紋結構</p>
        <p type="p">30:探針</p>
        <p type="p">31:針頭部</p>
        <p type="p">32:基部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="364" publication-number="202618732">
    <tif-files tif-type="multi-tif">
      <tif file="113140288.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紫微斗數卡牌教具及其使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">G09B19/00</main-classification>
        <further-classification edition="200601120241226B">A47G33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡靜彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡靜彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明紫微斗數卡牌教具，其包括：複數紫微斗數卡牌，其一面上係分別具有一星曜圖像，藉此令一學習者透過各該星曜圖像而達成引導聯想與記憶各該星曜圖像之特性與涵義；複數諮詢卡，其係印刷或書寫一事件描述，藉此提供一提問者由各該諮詢卡中選擇至少一該諮詢卡；以及一承載單元，其包括有一牌陣區，各該紫微斗數卡牌經過洗牌後放置於該牌陣區中，再由各該紫微斗數卡牌中抽取至少一該紫微斗數卡牌，並由該學習者依據所抽取的該紫微斗數卡牌上的星曜圖像解讀該事件描述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:紫微卡</p>
        <p type="p">1011:上紫微圖像</p>
        <p type="p">1012:下紫微圖像</p>
        <p type="p">A:星曜圖像</p>
        <p type="p">B:中天星符號</p>
        <p type="p">E:星曜名稱</p>
        <p type="p">F:星曜亮度符號</p>
        <p type="p">F1:廟符號</p>
        <p type="p">F2:旺符號</p>
        <p type="p">F3:平符號</p>
        <p type="p">G:五行符號</p>
        <p type="p">G5:土符號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="365" publication-number="202617185">
    <tif-files tif-type="multi-tif">
      <tif file="113140296.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>明膠與二氧化矽橋接材料及其形成的方法</chinese-title>
        <english-title>GELATIN AND SILICA HYBRID MATERIAL AND THE FORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241202B">A61K47/42</main-classification>
        <further-classification edition="201701120241202B">A61K47/51</further-classification>
        <further-classification edition="200601120241202B">A61L27/44</further-classification>
        <further-classification edition="200601120241202B">A61L27/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, REN-JEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宇謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李沁芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃孝惇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種明膠與二氧化矽橋接材料及其形成的方法，包含以下的步驟，首先分別準備明膠水溶液加入3-環氧丙氧丙基三甲氧基矽烷(3-glycidoxypropyltrimethoxysilane, GPTMS)進行修飾；進行水解四乙氧基矽烷；隨後，混合抗生素於前述經修飾後的明膠水溶液；混和經水解後的四乙氧基矽烷與含抗生素之修飾明膠水溶液合成明膠與二氧化矽橋接材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is a gelatin and silica hybrid material and the formation method thereof. The invention comprises the following steps: preparing a gelatin aqueous solution and add 3-glycidoxypropyltrimethoxysilane (GPTMS) for modification, hydrolyzing tetraethoxysilane, then, mixing antibiotics in the modified gelatin aqueous solution,mixing the hydrolyzed tetraethoxysilane and the modified gelatin aqueous solution containing antibiotics in order to synthesize a gelatin-silica bridging material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:步驟</p>
        <p type="p">12:步驟</p>
        <p type="p">14:步驟</p>
        <p type="p">1401:步驟</p>
        <p type="p">1402:步驟</p>
        <p type="p">1403:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="366" publication-number="202619144">
    <tif-files tif-type="multi-tif">
      <tif file="113140314.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋰離子電池新型回收技術</chinese-title>
        <english-title>NEW RECYCLING TECHNOLOGY FOR LITHIUM-ION BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H01M10/54</main-classification>
        <further-classification edition="202201120241029B">B09B3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種鋰離子電池新型回收技術，藉由將鋰電池之極片先放於鹽水中後，再進行冷熱水浸泡且同時於熱水中進行超音波處理，便可剝離出完整集電板(係金屬鋁箔或金屬銅箔) ，而此回收方法除了可以減少習知鋰電池回收所產生的汙染外，也減少了回收後的集電板於鋰電池中再次利用的成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a new recycling technology for lithium-ion batteries. By first placing the pole pieces of the lithium battery in salt water, then immersing it in hot and cold water and performing ultrasonic treatment in the hot water at the same time, the complete collector plate can be peeled off. In addition to reducing the pollution caused by conventional lithium battery recycling, this recycling method also reduces the cost of reusing the recycled collector plates in lithium batteries.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3:步驟流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="367" publication-number="202619391">
    <tif-files tif-type="multi-tif">
      <tif file="113140323.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時間同步系統</chinese-title>
        <english-title>TIME SYNCHRONIZATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120241223B">H04W56/00</main-classification>
        <further-classification edition="200601120241223B">G06F1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立創智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINCTRONIX LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林猷舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種適用於無線基地台與主機系統之間的高精度時間同步系統，該系統有效解決傳統GPS技術在信號微弱或不可用環境下的限制，尤其適用於室內或都市環境中。時間同步系統包含有網路監聽模組、精確時間協議模組以及普通時鐘模組。網路監聽模組係用以補獲無線基地台所發送之時間同步訊號，並根據時間同步信號進行頻率同步處理以及時間同步處理後分別產生每秒脈衝訊號以及時間信息。精確時間協議模組係連接於網路監聽模組，並用以接收並轉換每秒脈衝訊號以及時間信息後以發送時間封包。普通時鐘模組係連接於精確時間協議模組，並用以接收時間封包以產生PCIe帶內訊號，並將PCIe帶內訊號傳輸至主機系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A time synchronization system is applied between a wireless base station and a host system, which effectively overcomes the limitations of traditional GPS technology in environments where the signal is weak or unavailable, particularly suitable for indoor or urban environments. The time synchronization system includes a network listening module, a Precision Time Protocol (PTP) module, and an ordinary clock module. The network listening module is configured to capture a time synchronization signal sent by the wireless base station and perform frequency synchronization and time synchronization to respectively generate a Pulse Per Second (PPS) signal and Time of Day (ToD) information based on the time synchronization signal. The PTP module is connected to the network listening module and is configured to receive and convert the PPS signal and ToD information, then send a time packet. The ordinary clock module is connected to the PTP module and is used to receive the time packet to generate a PCIe in-band signal, which is transmitted to the host system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:時間同步系統</p>
        <p type="p">10:網路監聽模組</p>
        <p type="p">20:精確時間協議模組</p>
        <p type="p">30:普通時鐘模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="368" publication-number="202619228">
    <tif-files tif-type="multi-tif">
      <tif file="113140324.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非接觸式供電軌道系統</chinese-title>
        <english-title>NON-CONTACT POWER SUPPLY TRACK SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241104B">H02J50/12</main-classification>
        <further-classification edition="200601120241104B">B60L5/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳永駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUNG CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張介朧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHANG, CHIEH LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種非接觸式供電軌道系統，包含一發射組與一接收組，發射組與接收組間隔設置。發射組具有一電源、連接電源的一換流器、連接換流器的一發射補償電路及連接發射補償電路的一發射線圈。接收組具有一接收線圈、連接接收線圈的一接收補償電容、連接接收線圈與接收補償電容的一整流電路、連接整流電路的一填谷濾波電路及連接填谷濾波電路的一負載。非接觸式供電軌道系統採用填谷濾波電路與整流電路配合，藉此改善波形變形，用以提升傳輸效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-contact power supply track system comprises a transmitting assembly and a receiving assembly, and the transmitting assembly and the receiving assembly are spaced apart. The transmitting assembly has a power source, a converter connected to the power source, a transmitting compensation circuit connected to the converter, and a transmitting coil connected to the transmitting compensation circuit. The receiving assembly has a receiving coil, a receiving compensation capacitor connected to the receiving coil, a rectifier circuit connected to the receiving coil and the receiving compensation capacitor, a valley-filling filter circuit connected to the rectifier circuit, and a load connected to the valley-filling filter circuit. The non-contact power supply track system uses the valley-filling filter circuit in conjunction with the rectifier circuit to improve waveform deformation and improve transmitting efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:非接觸式供電軌道系統</p>
        <p type="p">30:發射組</p>
        <p type="p">31:電源</p>
        <p type="p">32:換流器</p>
        <p type="p">33:發射補償電路</p>
        <p type="p">331:發射補償電容</p>
        <p type="p">332:發射補償電感</p>
        <p type="p">34:發射線圈</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;i&lt;/i&gt;
        &lt;/sub&gt;:第一輸入電壓</p>
        <p type="p">
        &lt;i&gt;I&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;i&lt;/i&gt;
        &lt;/sub&gt;:第一輸入電流</p>
        <p type="p">40:接收組</p>
        <p type="p">41:接收線圈</p>
        <p type="p">42:接收補償電容</p>
        <p type="p">43:整流電路</p>
        <p type="p">431:第一整流串聯組</p>
        <p type="p">432:第二整流串聯組</p>
        <p type="p">43D:整流二極體</p>
        <p type="p">43D1:第一整流二極體</p>
        <p type="p">43D2:第二整流二極體</p>
        <p type="p">43D3:第三整流二極體</p>
        <p type="p">43D4:第四整流二極體</p>
        <p type="p">44:填谷濾波電路</p>
        <p type="p">441:第一填谷串聯組</p>
        <p type="p">442:第二填谷串聯組</p>
        <p type="p">44C:填谷電容</p>
        <p type="p">44C1:第一填谷電容</p>
        <p type="p">44C2:第二填谷電容</p>
        <p type="p">44D:填谷二極體</p>
        <p type="p">44D1:第一填谷二極體</p>
        <p type="p">44D2:第二填谷二極體</p>
        <p type="p">44D3:第三填谷二極體</p>
        <p type="p">45:負載</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;s&lt;/i&gt;
        &lt;/sub&gt;:第二輸入電壓</p>
        <p type="p">
        &lt;i&gt;i&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;s&lt;/i&gt;
        &lt;/sub&gt;:第二輸入電流</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;o&lt;/i&gt;
        &lt;/sub&gt;:第一輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="369" publication-number="202617126">
    <tif-files tif-type="multi-tif">
      <tif file="113140330.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改良式取藥機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241101B">A61J1/03</main-classification>
        <further-classification edition="200601120241101B">B65G1/04</further-classification>
        <further-classification edition="200601120241101B">B65G1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝榮華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, LUNG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝榮華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, LUNG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種改良式取藥機構，設置於供複數藥品儲放之一倉儲機內部，該改良式取藥機構包括：一容置盒，其係傾斜設於倉儲機中，該容置盒內部具有收納空間、底板及擋板，而於容置盒之擋板與底板接合處各形成有呈縱向連通之第一孔及第二孔，且於第一孔與第二孔之間形成有供藥品傾斜向下滑落之出藥口；一循環撥取模組，其設於該倉儲機中且鄰近於該容置盒之該擋板處，循環撥取模組包括有受預設動力單元所驅動且呈垂直排列之二傳動輪，於二傳動輪之間設有可傳遞動力之一輸送帶，於輸送帶上裝設有朝外側伸出之至少一撥桿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:容置盒</p>
        <p type="p">10:收納空間</p>
        <p type="p">11:底板</p>
        <p type="p">12:擋板</p>
        <p type="p">13:側板</p>
        <p type="p">14:擠壓件</p>
        <p type="p">2:循環撥取模組</p>
        <p type="p">21:傳動輪</p>
        <p type="p">22:輸送帶</p>
        <p type="p">23:撥桿</p>
        <p type="p">231:止滑套</p>
        <p type="p">3:藥品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="370" publication-number="202618207">
    <tif-files tif-type="multi-tif">
      <tif file="113140337.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140337</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種散熱結構</chinese-title>
        <english-title>HEAT DISSIPATION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">F28F11/00</main-classification>
        <further-classification edition="200601120241226B">F28D15/04</further-classification>
        <further-classification edition="200601120241226B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永彰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERBRITE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚子佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, TZU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀羣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚子佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, TZU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀羣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHANG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周文淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱結構，一個以上外殼構造，該外殼構造之一內表面定義一腔體，該腔體包含一兩相散熱材料以及至少一部分的一真空環境，該內表面之至少局部或是全部包含一阻水膜，該阻水膜具備優異的防水性能，有效阻擋該水分或該水氣的滲透，提高該腔體中該真空環境的穩定性，並且增強該散熱結構的整體效能，以使該散熱結構增加一兩相流動均勻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation structure comprising one or more housing configurations, wherein an inner surface of at least one of the housing configurations defines a cavity. This cavity contains a two-phase heat transfer material and at least a portion of a vacuum environment. The inner surface, at least partially or entirely, is coated with a water-repellent film that possesses excellent waterproofing properties, effectively preventing the penetration of moisture or water vapor. This enhances the stability of the vacuum environment within the cavity and improves the overall performance of the heat dissipation structure, thereby facilitating a more uniform two-phase flow.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:散熱結構</p>
        <p type="p">11:外殼構造</p>
        <p type="p">111:內表面</p>
        <p type="p">112:腔體</p>
        <p type="p">12:阻水膜</p>
        <p type="p">13:導引結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="371" publication-number="202618205">
    <tif-files tif-type="multi-tif">
      <tif file="113140339.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鰭片式冷凝裝置及兩相浸沒式冷卻系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">F28F3/02</main-classification>
        <further-classification edition="200601120241226B">F28D15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>超淨精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULTRA CLEAN PRECISION TECHNOLOGIES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兩相浸沒式冷卻系統，包含一冷卻槽、數個電子裝置，及一鰭片式冷凝裝置。該等電子裝置設置於該冷卻槽內並浸沒於一工作流體。該鰭片式冷凝裝置安裝於該冷卻槽，並包含一頂板，及複數位於該冷卻槽的一冷凝空間中的鰭片冷凝模組。該頂板包括一主板體，及一設置於該主板體並供一熱交換流體流通的冷卻通道。每一鰭片冷凝模組包括一支架，及數個安裝於該支架的鰭片。該冷卻通道中的熱交換流體能將該等鰭片冷凝模組傳遞給該主板體的熱能帶走，從而降低該等鰭片冷凝模組的溫度，有助於提升該等鰭片冷凝模組對氣態的該工作流體的冷凝效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">2:冷卻槽</p>
        <p type="p">21:冷凝空間</p>
        <p type="p">3:頂板</p>
        <p type="p">31:主板體</p>
        <p type="p">32:冷卻通道</p>
        <p type="p">33:上蓋板體</p>
        <p type="p">4:鰭片冷凝模組</p>
        <p type="p">41:支架</p>
        <p type="p">411:固定板</p>
        <p type="p">42:鰭片</p>
        <p type="p">422:冷凝片部</p>
        <p type="p">F1:工作流體</p>
        <p type="p">F2:熱交換流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="372" publication-number="202618198">
    <tif-files tif-type="multi-tif">
      <tif file="113140340.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140340</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兩相浸沒式冷卻系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">F28D15/02</main-classification>
        <further-classification edition="200601120241227B">F28F9/26</further-classification>
        <further-classification edition="200601120241227B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>超淨精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULTRA CLEAN PRECISION TECHNOLOGIES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兩相浸沒式冷卻系統，適用於冷卻數個電子裝置，並包含一冷卻槽、一第一冷凝單元、一第二冷凝單元，及一管路單元。該冷卻槽用於容納一第一流體，該等電子裝置可存取地設置於該冷卻槽內並浸沒於該第一流體。該第一冷凝單元設置於該冷卻槽，並位在呈液態的該第一流體上方。該第二冷凝單元配置為獨立於該冷卻槽。藉由該第一冷凝單元及該第二冷凝單元先後對蒸發成氣態的該第一流體進行冷凝作用，使該第一流體由氣態轉換成液態而與該冷卻槽內呈液態的該第一流體混合而降低其溫度，如此可提高整體裝置的冷卻效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">2:冷卻槽</p>
        <p type="p">21:框體</p>
        <p type="p">22:側板</p>
        <p type="p">23:側冷卻通道</p>
        <p type="p">24:側蓋板</p>
        <p type="p">25:氣體流出口</p>
        <p type="p">27:第一冷凝空間</p>
        <p type="p">3:第一冷凝單元</p>
        <p type="p">31:頂板</p>
        <p type="p">32:鰭片冷凝模組</p>
        <p type="p">34:上蓋板</p>
        <p type="p">4:第二冷凝單元</p>
        <p type="p">41:主箱體</p>
        <p type="p">411:第二冷凝空間</p>
        <p type="p">42:主冷凝管</p>
        <p type="p">43:氣體流入口</p>
        <p type="p">45:容積擴充裝置</p>
        <p type="p">451:固定架</p>
        <p type="p">452:伸縮囊</p>
        <p type="p">5:管路單元</p>
        <p type="p">51:氣體輸送管</p>
        <p type="p">52:液體回流管</p>
        <p type="p">54:氣體隔離閥</p>
        <p type="p">55:液體隔離閥</p>
        <p type="p">56:風扇</p>
        <p type="p">F1:第一流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="373" publication-number="202618515">
    <tif-files tif-type="multi-tif">
      <tif file="113140343.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源供應器與保護方法</chinese-title>
        <english-title>POWER SUPPLIES AND PROTECTION METHODS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G06F1/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>偉詮電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELTREND SEMICONDUCTOR INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳全興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUAN-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種電源供應器，用以供電給一負載，具有一高壓側電流感測單元、一低壓側電流感測單元、以及一控制電路。該高壓側電流感測單元連接至該負載的一高壓電源端，感測該電源供應器輸出給該負載的一第一輸出電流，以產生一高端感測訊號。該低壓側電流感測單元，連接至該負載的一低壓電源端，感測該負載輸出給該電源供應器的一第二輸出電流，以產生一低端感測訊號。該高壓側電流感測單元與該低壓側電流感測單元其中之一包含有一電源開關。該控制電路接收該高端感測訊號與該低端感測訊號，用以將該高端與該低端感測訊號分別轉換為一高端感測值與一低端感測值。於該高端感測值與該低端感測值其中之一超過於一過電流保護值時，該控制電路控制該電源開關，以限制該第一輸出電流與該第二輸出電流其中之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of the invention provides a power supply for supplying power to a load, comprising a high-side current sensing unit, a low-side current sensing unit, and a control circuit. Connected to a high-voltage power terminal of the load, the high-side current sensing unit senses a first output current supplied by the power supply to the load, generating a high-side sensing signal. Connected to a low-voltage power terminal of the load, the low-side current sensing unit senses a second output current output from the load back to the power supply, generating a low-side sensing signal. One of the high-side and low-side current sensing units includes a power switch. The control circuit receives the high-side sensing signal and the low-side sensing signal and converts them into a high-side sensing value and a low-side sensing value, respectively. If either the high-side sensing value or the low-side sensing value exceeds an overcurrent protection threshold, the control circuit controls the power switch to limit either the first output current or the second output current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">102:負載</p>
        <p type="p">104:高壓側電流偵測單元</p>
        <p type="p">106:低壓側電流偵測單元</p>
        <p type="p">108:電源控制電路</p>
        <p type="p">GATE:閘端</p>
        <p type="p">GND:低壓電源端</p>
        <p type="p">I&lt;sub&gt;OB&lt;/sub&gt;、I&lt;sub&gt;OF&lt;/sub&gt;:輸出電流</p>
        <p type="p">VBUS:高壓電源端</p>
        <p type="p">V&lt;sub&gt;O&lt;/sub&gt;:輸出電壓</p>
        <p type="p">V&lt;sub&gt;SH&lt;/sub&gt;:高端感測訊號</p>
        <p type="p">V&lt;sub&gt;SL&lt;/sub&gt;:低端感測訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="374" publication-number="202617498">
    <tif-files tif-type="multi-tif">
      <tif file="113140348.zip" no="1">
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      <volno>24</volno>
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      <publication-reference>
        <document-id>
          <doc-number>202617498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機車油門控制結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">B62K11/14</main-classification>
        <further-classification edition="200601120241226B">B62K23/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐崇瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐崇瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種機車油門控制結構，主要包含有一容置模組、一旋動模組、一感測模組以及一握把模組，該容置模組容置該旋動模組、該感測模組與該握把模組之一端，該旋動模組包含有一本體、一彈性單元、一磁性單元、一旋轉單元與一蓋板，該本體沿其徑向分別朝外側形成一第一容室，朝內側形成一限位導槽，該旋轉單元設有一第二容槽容置該磁性單元與一連動導引元件組設該握把模組，並於該第二容槽外周側設有一導引側壁，且該彈性單元一端抵止限位於該本體，其另一端抵止限位於該旋轉單元，藉此，該握把模組控制該旋轉單元轉動時，該磁性單元與該導引側壁沿該感測模組一側相對移動，達到穩定控制機車油門，與省油及組裝方便之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:容置模組</p>
        <p type="p">11:基座單元</p>
        <p type="p">111:第一限位元件</p>
        <p type="p">112:第二限位元件</p>
        <p type="p">113:第三限位元件</p>
        <p type="p">115:導引通道</p>
        <p type="p">12:蓋體單元</p>
        <p type="p">13:第一容置空間</p>
        <p type="p">20:旋動模組</p>
        <p type="p">21:本體</p>
        <p type="p">211:第一導引元件</p>
        <p type="p">214:限位導槽</p>
        <p type="p">22:彈性單元</p>
        <p type="p">23:磁性單元</p>
        <p type="p">242:連動導引元件</p>
        <p type="p">243:限位貫孔</p>
        <p type="p">244:導引側壁</p>
        <p type="p">25:蓋板</p>
        <p type="p">30:感測模組</p>
        <p type="p">40:握把模組</p>
        <p type="p">41:握把單元</p>
        <p type="p">42:卡制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="375" publication-number="202619440">
    <tif-files tif-type="multi-tif">
      <tif file="113140353.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機體承載裝置</chinese-title>
        <english-title>BODY SUPPORT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H05K5/02</main-classification>
        <further-classification edition="200601120241104B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏正自動科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATEN INTERNATIONAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李振源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種機體承載裝置，用於承載機體，其包括底座機構與把手機構。底座機構設置於機體的底部。把手機構包括兩個把手組件。兩個把手組件分別設置於底座機構的兩側。每個把手組件包括把手件與鎖定件。把手件可移動地設置於底座機構，並可於使用位置和收納位置間移動。當把手件從收納位置移動至使用位置，把手件自機體的內側向外移動伸出至機體的外側。鎖定件可移動地設置於底座機構，並可於鎖定位置和釋鎖位置間移動。當鎖定件位於鎖定位置時，鎖定件可用於卡合把手件，以限制把手件位移，使把手件固定於收納位置。當鎖定件從鎖定位置移動至釋鎖位置時，鎖定件移離把手件，使把手件可從收納位置移動至使用位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a body support device. The body support device is used for supporting a body. It comprises a base mechanism and handle mechanisms. The base mechanism is positioned at the bottom of the body. The handle mechanisms include two handle components, each mounted on opposite sides of the base mechanism. Each handle component includes a handle member and a locking member. The handle member is movably mounted on the base mechanism and can move between a use position and a storage position. When the handle member is moved from the storage position to the use position, it extends outward from the inside to the outside of the body. The locking member is also movably mounted on the base mechanism and can move between a locked position and an unlocked position. When the locking member is in the locked position, it engages with the handle member to restrict its movement, thereby fixing the handle member in the storage position. When the locking member moves from the locked position to the unlocked position, it disengages from the handle member, allowing the handle member to move from the storage position to the use position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機體承載裝置</p>
        <p type="p">11:機體</p>
        <p type="p">12:底座機構</p>
        <p type="p">121:定位組件</p>
        <p type="p">122:底座組件</p>
        <p type="p">13:把手機構</p>
        <p type="p">131:把手組件</p>
        <p type="p">132:把手件</p>
        <p type="p">133:鎖定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="376" publication-number="202617323">
    <tif-files tif-type="multi-tif">
      <tif file="113140357.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無焊料之異質接面焊接方法</chinese-title>
        <english-title>SOLDERLESS HETEROJUNCTION WELDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B23K31/02</main-classification>
        <further-classification edition="201401120241204B">B23K26/21</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁健芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, CHIEN-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳崇文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　承峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHING-FUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種無焊料之異質接面焊接方法，其係包含至少下列步驟：提供第一工件以及第二工件；控制單元控制第一光源以第一功率發射第一雷射光線投射至焊接點使第一工件與第二工件焊接成焊接件；控制單元控制第二光源以第二功率發射第二雷射光線並投射至第二工件之加熱區，加熱區係對應於該焊接點；以解決習知作為電池外殼以及電極之不鏽鋼與作為匯流排電極材料之銅或鋁於焊接時，因材料之物理性質之差異，以致於焊接時造成高溫鐵水噴濺形成氣孔，進而降低了焊接處的強度之問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solderless heterojunction welding method includes the steps of: providing a first workpiece and a second workpiece; the control unit controls the first light source to emit the first laser light with the first power and project it to the welding point to weld the first workpiece and the second workpiece into a welding piece; the control unit controls the second light source to emit the second laser light with the second power and project it to the heating zone of the second workpiece, the heating zone corresponds to the welding point; the present invention is used to address the issue that when the stainless steel of the battery casing or electrode and the copper or aluminum used as the bus electrode material are welded, due to the differences in the physical properties of these materials, high-temperature molten iron splashes during welding, forming pores and subsequently reducing the strength of the welded place.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S30:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="377" publication-number="202618813">
    <tif-files tif-type="multi-tif">
      <tif file="113140362.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電阻器及其製造方法</chinese-title>
        <english-title>RESISTOR AND THE MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">H01C17/00</main-classification>
        <further-classification edition="200601120241226B">H01C1/14</further-classification>
        <further-classification edition="200601120241226B">H01C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環懋科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANIFOLD TECHNOLOGY LIMITED COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭景聯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHING LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種電阻器及其製造方法，其主要係令電阻器之電阻體兩端凹設有容置槽，於容置槽內設有電極材料與電阻體電性連接；藉此，以能大幅減少電極材料凸出於電阻體表面之體積，相對即能降低所製作完成之電阻器整體所佔據的空間，有效令電子電路小型化，而在其整體施行使用上更增實用功率、特性者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a resistor and the manufacturing method thereof, which consists of a capacitance groove recessed at both ends of the resistor body, and electrode materials electrically connected to the resistor body in the capacitance groove; thereby, the volume of electrode materials protruding from the surface of the resistor body can be greatly reduced, which can relatively reduce the space occupied by the completed resistor, effectively miniaturize the electronic circuit, and increase practical power and characteristics of the resistor in its overall implementation and use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:加工容置槽</p>
        <p type="p">B:成形電極</p>
        <p type="p">C:切粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="378" publication-number="202618104">
    <tif-files tif-type="multi-tif">
      <tif file="113140364.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140364</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>實心輕量塊體、嵌入式中空樓板鋼筋結構與建築嵌入式中空樓板鋼筋結構的方法</chinese-title>
        <english-title>A SOLID LIGHT-WEIGHT BLOCK, AN EMBEDDED HOLLOW FLOOR STEEL STRUCTURE AND A METHOD OF BUILDING THE EMBEDDED HOLLOW FLOOR STEEL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">E04B1/04</main-classification>
        <further-classification edition="200601120241204B">E04B5/08</further-classification>
        <further-classification edition="200601120241204B">E04C2/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>速得博產物有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUPRO INTERNATIONAL ASSETS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹德威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, TE WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹岳翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YUEH HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為解決實心保利龍係與鋼筋直接接觸時造成該鋼筋握裹力不足之技術問題，本發明提供實心輕量塊體，其包括本體，前述本體具有前凸部、後凸部、左凹槽以及右凸部，且其於底部設有貫穿的容置部，並於其頂部設有握裹凹槽。本發明另提供一種使用前述實心輕量塊體之嵌入式中空樓板鋼筋結構，藉以降低整體營建成本以及增加整體樓板之結構強度，並維持周圍鋼筋之握裹力。本發明另提供一種建築嵌入式中空樓板鋼筋結構的方法</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In order to solve the technical problem of insufficient holding force of the steel bar caused by the direct contact between the Styrofoam and the steel bar, the present invention provides a solid light-weight block, which includes a body. The body has a front convex part, a rear convex part, a left groove and a right convex part, and a penetrating receiving par provided at the bottom of the body, and a flat part is provided at the top of the body. The present invention also provides an embedded hollow floor steel structure using the solid light-weight block, thereby reducing the overall construction cost and increasing the structural strength of the overall floor while maintaining the holding force of the surrounding steel bars. The present invention also provides a method of building an embedded hollow floor steel structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">2:上鋼筋層</p>
        <p type="p">3:壓筋</p>
        <p type="p">4:下鋼筋層</p>
        <p type="p">5:連接鋼筋件</p>
        <p type="p">6:底板</p>
        <p type="p">21:縱走肋筋</p>
        <p type="p">22:橫走肋筋</p>
        <p type="p">41:橫走底肋筋</p>
        <p type="p">42:縱走座筋</p>
        <p type="p">51:弧形鋼條</p>
        <p type="p">511:轉折部</p>
        <p type="p">Y:相交處</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="379" publication-number="202617230">
    <tif-files tif-type="multi-tif">
      <tif file="113140365.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兼具坡度自動調節機構的騎行台車架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">A63B69/16</main-classification>
        <further-classification edition="200601120241227B">A63B22/00</further-classification>
        <further-classification edition="200601120241227B">A63B24/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林麗裡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林麗裡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種兼具坡度自動調節機構的騎行台車架，其將一模擬坡度升降調整裝置與訓練用的主車架結合在一起，無需再安裝另一個獨立的爬升訓練裝置，並且這個結合坡度升降調整裝置的主車架，能與各個依據標準搭配尺寸的智慧騎行台相結合，以形成一個完整的訓練裝置，供騎乘者使用。再者，本發明兼具回應虛擬騎行軟體的坡度指令，並能夠依具指令自動調節與地平面夾角的智慧騎行台專用訓練車架。此外，本發明的坡度升降調整裝置是與主車架前端設在同一軸線上，因此與先前技術在二軸線上位移的感受不同，其具有較接近實際騎乘自行車在上、下坡時的真實情境感受。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:中空套管</p>
        <p type="p">22:固定螺絲</p>
        <p type="p">30:坡度升降調整裝置</p>
        <p type="p">31:外殼底座</p>
        <p type="p">311:開口</p>
        <p type="p">312:圓弧面</p>
        <p type="p">313:軸座</p>
        <p type="p">32:伸縮滑管</p>
        <p type="p">33:調整螺桿</p>
        <p type="p">34:螺帽</p>
        <p type="p">341:螺孔</p>
        <p type="p">342:凸緣體</p>
        <p type="p">35:驅動馬達</p>
        <p type="p">351:轉軸</p>
        <p type="p">352:編碼器</p>
        <p type="p">353:減速齒輪組</p>
        <p type="p">36:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="380" publication-number="202617225">
    <tif-files tif-type="multi-tif">
      <tif file="113140366.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻力系統的扭力感測器裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">A63B21/22</main-classification>
        <further-classification edition="200601120250106B">A63B22/06</further-classification>
        <further-classification edition="200601120250106B">G01L3/00</further-classification>
        <further-classification edition="200601120250106B">G01L5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林麗裡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林麗裡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種阻力系統的扭力感測器裝置，其包含在一阻力系統的支撐架上，在一飛輪軸心與一線圈磁阻機構的一直線上，設有一扭力傳感器，藉由其上的電阻應變片(Strain gauge)會依據應變塊變形量大小，而產生不同的電阻值變化，並以其電阻值變化來作為磁力的檢測裝置，且將所得到的磁力資料作為補償及修正輸出電流之用，依此「閉環系統」，具有改善阻力系統控制阻力大小的精度，使阻力控制能更加精準，達到高階的設備需求的功效。再者，本發明將扭力感測器與產生阻力（張力）的線圈磁阻機構，架構在同一個阻力系統的機構內，具有使整體結構更簡化的效益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:支撐架</p>
        <p type="p">20L:左板體</p>
        <p type="p">20R:右板體</p>
        <p type="p">21:軸孔</p>
        <p type="p">24:定位桿</p>
        <p type="p">30:飛輪</p>
        <p type="p">31:軸心</p>
        <p type="p">32:軸承</p>
        <p type="p">33:第一螺帽</p>
        <p type="p">34:第一螺絲</p>
        <p type="p">35:皮帶輪</p>
        <p type="p">36:第二螺帽</p>
        <p type="p">37:第二螺絲</p>
        <p type="p">40:線圈磁阻機構</p>
        <p type="p">41:鐵心</p>
        <p type="p">42:線圈</p>
        <p type="p">50:軸承座</p>
        <p type="p">60:扭力傳感器</p>
        <p type="p">65:第三螺絲</p>
        <p type="p">70:阻力系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="381" publication-number="202619386">
    <tif-files tif-type="multi-tif">
      <tif file="113140367.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於毫米波的無線通訊系統之通訊方法</chinese-title>
        <english-title>COMMUNICATION METHOD OF WIRELESS COMMUNICATION SYSTEM BASED ON MILLIMETER WAVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250203B">H04W48/08</main-classification>
        <further-classification edition="200901120250203B">H04W60/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA NETWORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭倚朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YI-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊佳穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林銘鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於毫米波的無線通訊系統之通訊方法，由一儲存有一區域表的通訊系統執行，該區域表包括多筆分別對應多個通訊區域的區域資訊，每一區域資訊指示出該通訊區域是否具有可接取的終端裝置，包含以下步驟：(A)對於各該通訊區域，根據該區域表判斷是否具有可接取的終端裝置，當判斷出不具有任何終端裝置，判定該通訊區域為一非活動通訊區域，當判斷出具有可接取的終端裝置時，判定該通訊區域為一活動通訊區域；(B)對於被判定為非活動通訊區域之通訊區域，進行一區域掃描任務；及(C)對於被判定為活動通訊區域之通訊區域，進行一資料傳輸任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication method of a wireless communication system based on millimeter waves is executed by a communication system that stores an area table. The area table includes a plurality of zone information corresponding to multiple communication zones. Each zone information indicates whether the communication zone is having an accessible terminal device includes the following steps: (A) For each communication zone, determine whether there is an accessible terminal device in the communication zone according to the zone table. When it is determined that there is no terminal device in the communication, the communication zone is determined to be an inactive communication zone, when it is determined that there is an accessible terminal device in the communication, the communication zone is determined to be an active communication zone; (B) For the communication zone determined to be the inactive communication zone, an zone scanning task is performed; and ( C) or the communication zone determined to be the active communication zone, a data transmission task is performed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21~25:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="382" publication-number="202618286">
    <tif-files tif-type="multi-tif">
      <tif file="113140373.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預燒測試系統及其預燒測試模組</chinese-title>
        <english-title>BURN-IN TESTING SYSTEM AND BURN-IN TESTING MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01R1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>京元電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING YUAN ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍展佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張祐嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹勳亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSUNG LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種預燒測試模組包含一主框架、一連接卡組件、一驅動板以及一預燒板或一系統板。連接卡組件位於該主框架上。驅動板電連接至該連接卡組件的一側。預燒板電連接至該連接卡組件的另一側，其中該主框架包含一第一對平行滑軌與該預燒板滑動連接，該第一對平行滑軌垂直於該連接卡組件之一長軸方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A burn-in test module includes a main frame, a connection card assembly, a driver board and a burn-in board. The connection card assembly is located on this main frame. The driver board is electrically connected to one side of the connector card assembly. The burn-in is electrically connected to the other side of the connection card assembly, wherein the main frame includes a first pair of parallel slide rails that are slidingly connected with the burn-in or system board. The first pair of parallel slide rails is perpendicular to a lengthwise direction of the connection card assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:預燒測試模組</p>
        <p type="p">201:主框架</p>
        <p type="p">202a:桿</p>
        <p type="p">202b:桿</p>
        <p type="p">203a:滑軌</p>
        <p type="p">203b:滑軌</p>
        <p type="p">210:連接卡組件</p>
        <p type="p">220:預燒板</p>
        <p type="p">222:框體</p>
        <p type="p">224:電路板</p>
        <p type="p">226:待測積體電路裝置</p>
        <p type="p">230:驅動板</p>
        <p type="p">231:框體</p>
        <p type="p">232:活動式拖鍊</p>
        <p type="p">234:電路板</p>
        <p type="p">235:拖鍊承板</p>
        <p type="p">D2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="383" publication-number="202617355">
    <tif-files tif-type="multi-tif">
      <tif file="113140382.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按鍵組裝治具及對位的方法</chinese-title>
        <english-title>FIXTURE FOR ASSEMBLING BUTTON AND POSITIONING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25B11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡曜有</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YAU-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種按鍵組裝治具及對位的方法。按鍵組裝治具包括底座以及頂塊。底座包括第一座體、多個彈片以及第一磁鐵。第一座體具有開口，彈片沿著開口的圓周方向設置在開口的內壁，而第一磁鐵設置在開口的一側。頂塊包括第二座體以及自第二座體凸起的凸部，凸部適於進入開口並干涉彈片，以撐開彈片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fixture for assembling button and a positioning method are provided. The fixture for assembling button includes a base and a block. The base includes a first body, multiple metal strips and a first magnet. The first body has an opening and the multiple metal strips are arranged around a circumference of the opening and disposed on an inner wall of the opening. The first magnet is arranged by one side of the opening. The block includes a second body and a protrusion protruding from the second body. The protrusion is adapted to enter the opening and interfere with the metal strips to spread open the metal strips.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:按鍵組裝治具</p>
        <p type="p">11:底座</p>
        <p type="p">111:第一座體</p>
        <p type="p">111a:頂面</p>
        <p type="p">111b:底面</p>
        <p type="p">1112:開口</p>
        <p type="p">1114:承靠部</p>
        <p type="p">1115:限位柱</p>
        <p type="p">113:彈片</p>
        <p type="p">114:第一磁鐵</p>
        <p type="p">12:頂塊</p>
        <p type="p">C:中心點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="384" publication-number="202617398">
    <tif-files tif-type="multi-tif">
      <tif file="113140383.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混拌裝置</chinese-title>
        <english-title>MIXING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B28C5/24</main-classification>
        <further-classification edition="200601120241204B">B28C7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林堃傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何瑋玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, WEI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭珮琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, PEI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SSU YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇仁維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, REN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連培榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, PEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱振璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林烈全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混拌裝置，包括一流體儲存槽、一氣固態混合物產生器、一混合物管路、一混拌槽、一氣體回收槽及一廢水槽。流體儲存槽用以儲存流體。氣固態混合物產生器連通至流體儲存槽，用以使流體儲存槽內的流體相變化為氣態與固態的混合物。混合物管路連通於氣固態混合物產生器，用以輸送混合物。混拌槽連通至混合物管路，混合物適於透過混合物管路輸送至混拌槽。氣體回收槽連通於混合物管路，用以回收混合物中未通入混拌槽的氣體。廢水槽連通於氣體回收槽與混拌槽之間，氣體回收槽所回收的氣體適於被導入廢水槽，與廢水反應，再流至混拌槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mixing device includes a fluid storage tank, a gas-solid mixture generator, a mixture pipeline, a mixing tank, a gas recovery tank and a waste water tank. The fluid storage tank is configured to store fluid. The gas-solid mixture generator is communicated with the fluid storage tank, and is configured to change phase of the fluid in the fluid storage tank into a mixture of gas and solid. The mixture pipeline is communicated with the gas-solid mixture generator for delivering the mixture. The mixing tank is communicated with the mixture pipeline, and the mixture is adapted for being transported to the mixing tank through the mixture pipeline. The gas recovery tank is communicated with the mixture pipeline and is configured to recover gas in the mixture that is not delivered into the mixing tank. The waste water tank is communicated between the gas recovery tank and the mixing tank. The gas which is recovered by the gas recovery tank is adapted for introducing into the waste water tank, reacting with waste water and then flowing to the mixing tank.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:重力方向</p>
        <p type="p">100:混拌裝置</p>
        <p type="p">110:流體儲存槽</p>
        <p type="p">120:氣固態混合物產生器</p>
        <p type="p">125:混合物管路</p>
        <p type="p">130:混拌槽</p>
        <p type="p">140:氣體回收槽</p>
        <p type="p">142:氣體回收管路</p>
        <p type="p">144:濾網</p>
        <p type="p">146:第一泵</p>
        <p type="p">148:閥</p>
        <p type="p">150:廢水槽</p>
        <p type="p">152:第二泵</p>
        <p type="p">154:第一閥</p>
        <p type="p">160:電磁閥</p>
        <p type="p">162:流量閥</p>
        <p type="p">170:再導入管路</p>
        <p type="p">172:第二閥</p>
        <p type="p">174:第四泵</p>
        <p type="p">180:廢水回收管路</p>
        <p type="p">182:第三泵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="385" publication-number="202618003">
    <tif-files tif-type="multi-tif">
      <tif file="113140388.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140388</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膠原蛋白肽生產方法</chinese-title>
        <english-title>COLLAGEN PEPTIDE PRODUCTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C12P21/06</main-classification>
        <further-classification edition="200601120250501B">A61K38/39</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麗兒媄生技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LILLMAY BIOTECH COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余奕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種膠原蛋白肽生產方法，包含下列步驟：前處理程序，透過水洗方式，用以清洗未處理原料表面髒汙，並依據未處理原料性質執行泡酸程序或泡鹼程序後，再次洗淨，以產生前處理後原料；水解程序，透過熱水對前處理後原料進行水解破壁處理程序，用以將前處理後原料分子化，形成水解後原料；酶解程序，將水解後原料加入複合酶進行酶解後，進行排水濃縮，並產生酶解後原料；以及後處理程序，用以取得酶解後原料後進行高溫殺菌，並乾燥處理，使酶解後原料成為膠原蛋白肽成品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A collagen peptide production method includes the following steps: a pre-treatment process, which is used to clean the surface dirt of untreated raw materials through water washing, and performs an acid soaking process or an alkali soaking process according to the properties of the untreated raw materials, and then washes again , to produce pre-treated raw materials; the hydrolysis process is to hydrolyze the pre-treated raw materials through hot water to break the wall, which is used to molecularize the pre-treated raw materials to form hydrolyzed raw materials; the enzymatic hydrolysis process is to convert the hydrolyzed raw materials into After drainage and concentration, compound enzymes are added to perform enzymatic hydrolysis and produce enzymatically hydrolyzed raw materials; and a post-processing procedure is used to obtain the enzymatically hydrolyzed raw materials and then perform high-temperature sterilization and drying to turn the enzymatically hydrolyzed raw materials into finished collagen peptides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S140:步驟流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="386" publication-number="202616999">
    <tif-files tif-type="multi-tif">
      <tif file="113140396.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140396</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合式床架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">A47C19/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東庚企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG KENG ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅秋香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林松柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種床架，包括：二根長桿、多個聯結件、一個底座（或一個升降座）與多個固定座。各該聯結件分別裝在各該長桿上，該聯結件包括：一個內管。各該固定座裝在該底座（或該升降座）上，該固定座包括：一個橫管，其牢固該固定座的一邊，該橫管虛擬的一條中心軸，垂直該長桿的一個長度，限制該內管由外向內進入該橫管，使該長桿結合該底座（或該升降座）的一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:長桿</p>
        <p type="p">12:內側</p>
        <p type="p">13:固定片</p>
        <p type="p">14:聯結件</p>
        <p type="p">15:內管</p>
        <p type="p">16:外管</p>
        <p type="p">17:橫管</p>
        <p type="p">18:凸部</p>
        <p type="p">19:凹部</p>
        <p type="p">20:固定座</p>
        <p type="p">21:圓孔</p>
        <p type="p">22:定位孔</p>
        <p type="p">23:緊固件</p>
        <p type="p">24:底座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="387" publication-number="202616965">
    <tif-files tif-type="multi-tif">
      <tif file="113140402.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>即食珍珠粉圓之製造方法及其結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241101B">A23L19/10</main-classification>
        <further-classification edition="201601120241101B">A23L29/212</further-classification>
        <further-classification edition="201601120241101B">A23L29/30</further-classification>
        <further-classification edition="201601120241101B">A23P10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三叔公食品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳美姚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳行一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種即食珍珠粉圓之製造方法及其結構，主要係將糯米粉、修飾澱粉、水及麥芽糖等材料，與砂糖、黑糖、抹茶或草莓、芒果、鳳梨等水果添加料添加料予以混合，蒸熟以構成黏稠狀之基材，經由成型裝置擠壓為適當圓徑之圓條狀的胚料，再將圓條狀胚料切割為適當大小之段狀胚料，以及將段狀胚料搓揉成型為圓球狀之珍珠粉圓半成品，並於切割及搓揉過程中對珍珠粉圓半成品予以裹粉，以防止相互黏著，從而完成不同口味之珍珠粉圓。使珍珠粉圓的製作更為快捷且可供立即食用，以方便製作為各種珍珠粉圓飲品，且利於冷凍保存。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:固態狀本體</p>
        <p type="p">A:珍珠粉圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="388" publication-number="202618757">
    <tif-files tif-type="multi-tif">
      <tif file="113140404.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140404</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>子像素定位方法及顯示器校正系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">G09G5/22</main-classification>
        <further-classification edition="200601120241226B">G09G5/32</further-classification>
        <further-classification edition="200601120241226B">H04N1/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮繼雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鑫輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種子像素定位方法，係由包括一電子裝置與一影像採集裝置的一顯示器校正系統執行，且包括以下步驟：對一顯示面板所包含的複數個子像素執行一位置-序號轉換處理以及一序號編碼處理，從而產生對應該複數個子像素的複數個子像素序號以及複數個編碼；分L次驅動該顯示面板顯示L幀圖像，並對應地自該顯示面板擷取L張採集圖像；對該L張採集圖像執行一黑白顏色分析處理以獲得複數個檢出編碼；以及對該複數個檢出編碼執行一序號解碼處理，從而獲得對應該複數個子像素的複數個檢出子像素序號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:對一顯示面板所包含的複數個子像素執行一位置-序號轉換處理以及一序號編碼處理，從而產生對應該複數個子像素的複數個子像素序號以及對應該複數個子像素序號的複數個編碼</p>
        <p type="p">S2:對應各所述編碼的一編碼長度為L，分L次驅動該顯示面板顯示L幀圖像，並對應地自該顯示面板擷取L張採集圖像</p>
        <p type="p">S3:對該L張採集圖像執行一黑白顏色分析處理以獲得複數個檢出編碼像</p>
        <p type="p">S4:對該複數個檢出編碼執行一序號解碼處理，從而獲得對應該複數個子像素的複數個檢出子像素序號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="389" publication-number="202618750">
    <tif-files tif-type="multi-tif">
      <tif file="113140405.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>峰值亮度補償模塊、顯示驅動晶片和資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241101B">G09G3/3208</main-classification>
        <further-classification edition="201601120241101B">G09G3/3225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京歐錸德微電子技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLED IC MICROELECTRONICS (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雪岭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚仲齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫明真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種峰值亮度補償模塊，用以整合在一顯示驅動晶片之中，且被配置以執行以下功能：(1)在HBM模式下啟用PLC功能時，若APL值為預定的最大值，將系統DBV值調升至對應一第一Lv值的一第一DBV值；(2)在該PLC功能啟用時，若APL值為預定的最小值，將系統DBV值調升至對應一第二Lv值的一第二DBV值；以及(3)在該PLC功能啟用時，若APL值介於最小值與最大值之間，對APL值、最大值、第一DBV值、最小值、與第二DBV值執行線性插值運算以決定對應一第三Lv值的一第三DBV值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:峰值亮度補償模塊</p>
        <p type="p">21:轉換單元</p>
        <p type="p">22:平均圖像準位計算單元</p>
        <p type="p">23:計算單元</p>
        <p type="p">24:伽瑪映射單元</p>
        <p type="p">121:儲存單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="390" publication-number="202619288">
    <tif-files tif-type="multi-tif">
      <tif file="113140406.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140406</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態電平移位電路、電子晶片和資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H03K5/003</main-classification>
        <further-classification edition="202001120250122B">H03K19/1778</further-classification>
        <further-classification edition="200601120250122B">H03K19/0185</further-classification>
        <further-classification edition="200601120250122B">G05F3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉雲鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種動態電平移位電路，其應用於一電子晶片之中，且包括：一信號輸入單元、一轉換單元以及一啟動模塊，其中，該信號輸入單元用以將一輸入信號處理為一第一輸入信號與一第二輸入信號，且該轉換單元被配置耦接於一工作電壓與一接地端之間。特別地，本發明以一使能信號控制該信號輸入單元和該啟動模塊。在該使能信號具一電壓準位的情況下，該信號輸入單元輸出所述第一輸入信號和所述第二輸入信號，且該啟動模塊啟動該轉換單元以將該第一輸入信號和該第二輸入信號電平移位處理為一輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:動態電平移位電路</p>
        <p type="p">11:信號輸入單元</p>
        <p type="p">12:轉換單元</p>
        <p type="p">121:第一P型MOSFET元件</p>
        <p type="p">123:第二P型MOSFET元件</p>
        <p type="p">122:第一N型MOSFET元件</p>
        <p type="p">124:第二N型MOSFET元件</p>
        <p type="p">13:啟動模塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="391" publication-number="202617229">
    <tif-files tif-type="multi-tif">
      <tif file="113140408.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617229</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140408</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>游泳訓練裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A63B69/12</main-classification>
        <further-classification edition="200601120241031B">A63B24/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃賢哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭正元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種游泳訓練裝置，係包括一控制單元、一個人身分（Identity, ID）記錄模組、一水下光學配速燈、一數據分析單元、以及一顯示單元所構成。藉此，本發明所提游泳訓練裝置的重要關鍵技術之一為全水密機構，所有輔助設備必須放置於水下提供泳者（含游泳選手）資訊。透過水下光學配速燈提供泳者在中長距訓練中最有效的指引，從游速的控制與調節能進一步促成泳者在體能上的直效訓練與建立泳者自覺體能強弱區間，提供泳者穩定的配置游泳速度，可使心率與泳姿保持在適當的速度，並減少疲勞與降低整體時間，使疲勞與能耗最佳化，以獲得進步與追求最佳成績。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:游泳訓練裝置</p>
        <p type="p">1:控制單元</p>
        <p type="p">11:配速模式設定介面</p>
        <p type="p">12:訓練規劃介面</p>
        <p type="p">2:個人身分記錄模組</p>
        <p type="p">21:泳者檔案</p>
        <p type="p">3:水下光學配速燈</p>
        <p type="p">31:光源</p>
        <p type="p">4:數據分析單元</p>
        <p type="p">5:顯示單元</p>
        <p type="p">6:電腦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="392" publication-number="202617238">
    <tif-files tif-type="multi-tif">
      <tif file="113140411.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動建立虛物與實物間關聯之方法及系統</chinese-title>
        <english-title>A METHOD AND SYSTEM FOR AUTOMATICALLY ESTABLISHING AN ASSOCIATION BETWEEN A VIRTUAL OBJECT AND A REAL OBJECT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250203B">A63F13/65</main-classification>
        <further-classification edition="201401120250203B">A63F13/60</further-classification>
        <further-classification edition="201401120250203B">A63F13/21</further-classification>
        <further-classification edition="201101120250203B">G06T19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺中科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAICHUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王健亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JEN YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何蕾安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, LEI AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾芳敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, FANG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾宗偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, TSUNG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種自動建立虛物與實物間關聯之方法及系統，係先建立一虛實關聯表單，該虛實關聯表單中將現實中的現實玩家、現實乘坐位置與電競遊戲中的虛物角色、虛物角色相片相互關聯起來；在電競遊戲進行過程中，透過影像辨識技術對顯示之遊戲影像進行辨識，得到目前出現在遊戲影像中的至少一虛物角色，再經所述虛實關聯表單的關聯關係對應找到現實中操作該虛物角色的現實玩家及其現實乘坐位置，接著觸發對應該現實乘坐位置之座椅上的提示設備，由該提示設備產生提示資訊；如此一來，導播便能根據外顯的提示資訊快速將鏡頭移轉到該座椅上的現實玩家拍攝並轉播其臉部表情，或是令現實玩家在進行電競遊戲過程中進一步體驗身歷其境之感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method and system for automatically establishing an association between a virtual object and a real object, which first establishes a virtual-reality association form, which associates a real player and a real ride position in reality with a virtual character and a virtual character photo in an eSports game, and then, in the course of an eSports game, the image recognition technology recognizes the displayed game image, obtains at least one virtual character currently appearing in the game image, and then locates the real player who operates the virtual character and his/her real riding position through the correlation relationship in the virtual-reality association form, and then triggers a prompting device on the seat corresponding to the real riding position, and the prompting device generates a prompting message; in this manner, the director can quickly move the camera to the real player on the seat to take a picture of his/her facial expression or to broadcast the facial expression of his/her face in the game based on the outwardly visible prompting message, which enables the camera to quickly turn to the real player in the seat based on the cueing information to capture and broadcast his/her facial expression, or to make the real player experience the immersive feeling during the eSports gaming process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:影像擷取單元</p>
        <p type="p">2:虛實關聯表單建立單元</p>
        <p type="p">3:影像辨識單元</p>
        <p type="p">4:控制單元</p>
        <p type="p">5:提示設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="393" publication-number="202618618">
    <tif-files tif-type="multi-tif">
      <tif file="113140412.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>取得目標函式中的鬆弛變數的運算方法</chinese-title>
        <english-title>COMPUTING METHOD FOR OBTAINING SLACK VARIABLES IN AN OBJECTIVE FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">G06N10/00</main-classification>
        <further-classification edition="202201120250203B">G06N10/60</further-classification>
        <further-classification edition="201901120250203B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種取得目標函式中的鬆弛變數的運算方法，應用於一量子計算設備，本案透過增強式學習的方式得到一第一函式，透過第一函式找出問題的目標函式在QUBO形式中的鬆弛變數，以最佳化該QUBO形式的目標函式，以供量子退火機或數位退火機使用。因此，可以大大減少了目標函式中的變數數量，直接降低問題的複雜度，進而使退火機有能力處理更複雜的問題，且更有效率且準確地找到一個高品質的解，使目標函式達到最優值的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computing method for obtaining slack variables in an objective function is applied to a quantum computing device. Through the use of the reinforcement learning method, a first function is obtained. Through the first function, the slack variables of the problem’s objective function in the QUBO form are found. Consequently, the objective function in the QUBO form is optimized to be use for quantum annealers or digital annealers. Since the number of variables in the objective function is significantly reduced, the complexity of the problem is directly reduced. Furthermore, the annealer has the capability to handle more complex problems and find a high-quality solution more efficiently and accurately. Consequently, the purpose of obtaining the optimal value of the objective function can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S10:本案之取得目標函式中的鬆弛變數的流程步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="394" publication-number="202619449">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伺服器及其導引裝置</chinese-title>
        <english-title>SERVER AND GUIDING DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">H05K7/14</main-classification>
        <further-classification edition="200601120241030B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種伺服器包含伺服器機殼及導引裝置。伺服器機殼包含插入部。導引裝置包含座體及解鎖件。座體包含導軌及懸臂。座體固定於伺服器機殼且導軌相鄰於插入部。懸臂具有固定部，固定部具有閂鎖位置及退出位置，閂鎖位置較退出位置更接近插入部。解鎖件包含解鎖件本體、連接部、抵頂部及操作部。連接部、抵頂部及操作部連接於解鎖件本體。解鎖件以連接部活動地設置於座體而具有初始位置及解鎖位置。致動操作部而將解鎖件選擇性地位於初始位置或解鎖位置。解鎖件位於解鎖位置時，抵頂部使固定部位於退出位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A server includes a server housing and a guiding device. The server housing includes an accommodation portion. The guiding device includes a base and an unlocking member. The base includes a guiding track and a cantilever. The base is fixed on the server housing and the guiding track is adjacent to the accommodation portion. The cantilever has a fixed portion. The fixed portion has a latching position and a withdrawn position. The latching position is closer to the accommodation portion than the withdrawn position. The unlocking member includes a main body, and a connecting portion, a contact portion, and an operating portion connected to the main body. The unlocking member is movably arranged on the main body through the connecting portion to has an initial position and an unlocking position. the operating portion is activated to selectively position the unlocking member in the initial position, the unlocking position or the return position. The contact portion makes the fixed portion be at ejected position when the unlocking member is at the unlocking position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伺服器</p>
        <p type="p">101:主板</p>
        <p type="p">102:伺服器機殼</p>
        <p type="p">103:組裝面</p>
        <p type="p">104:導引裝置</p>
        <p type="p">105:插拔模組</p>
        <p type="p">106:插入部</p>
        <p type="p">108:座體</p>
        <p type="p">4:剖面線</p>
        <p type="p">A1:插入軸</p>
        <p type="p">A2:導引軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="395" publication-number="202619225">
    <tif-files tif-type="multi-tif">
      <tif file="113140416.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池模組之大電流自動輪充平衡補電保養儀</chinese-title>
        <english-title>BATTERY BALANCING INSTRUMENT FOR BATTERY MODULE USING LARGE CURRENT TO CHARGE CELLS IN TURN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">H02J7/14</main-classification>
        <further-classification edition="200601120241227B">H01M10/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETEK OPTO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐明焜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱顯明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HSIEN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池模組之大電流自動輪充平衡補電保養儀，用以為一電池模組之複數個串聯相接的電芯進行充電，包含有：一繼電器控制模組，具有複數個繼電器分別電性連接於該電池模組之該等電芯；一充電機，電性連接於該繼電器控制模組，用以將電流經該繼電器控制模組逐一輸入該電池模組之每一該電芯進行充電；以及一電池管理系統，用以偵測該電池模組之每一該電芯之一電壓訊號，並根據該等電壓訊號控制該等繼電器之通電狀態；其中，當該電池模組至少一該電芯電壓低於一飽和電壓值時，則該電池管理系統控制對應於電壓不足之其中一該電芯之二該繼電器切換為該通電狀態，而其餘該繼電器切換為未通電狀態，使該充電機輸出之電流僅能經該二繼電器充入該電芯，待該電芯之電壓達到該飽和電壓值後則控制該二繼電器切換為未通電狀態以停止對該電芯繼續充電；該電池管理系統逐一針對電壓不足之每一該電芯執行相同動作，直到每一該電芯之電壓都達到該飽和電壓值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery balancing instrument for battery module using large current to charge cells in turn, used for charging a plurality of battery cells connected in series in a battery module, comprising:        &lt;br/&gt;&lt;br/&gt;A relay control module with a plurality of relays electrically connected to the battery cells of the battery module; A charger electrically connected to the relay control module, used to input current through the relay control module into each battery cell of the battery module for charging; And a battery management system (BMS), used to detect the voltage signal of each battery cell in the battery module and control the electrical states of the relays based on the detected voltage signals. When the voltage of at least one battery cell in the battery module is lower than a saturation voltage level, the battery management system controls the corresponding two relays associated with the under-voltage cell to switch to the powered state, while the other relays are switched to the unpowered state. This allows the current output from the charger to flow only through these two relays to charge the battery cell. Once the voltage of the battery cell reaches the saturation voltage level, the two relays are switched to the unpowered state to stop further charging of the battery cell. The battery management system performs the same action for each under-voltage cell, one by one, until the voltage of all the battery cells reaches the saturation voltage level.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:大電流自動輪充平衡補電保養儀</p>
        <p type="p">2:電池模組</p>
        <p type="p">3:電芯</p>
        <p type="p">4:電壓偵測單元</p>
        <p type="p">5:溫度偵測單元</p>
        <p type="p">6:充電插座</p>
        <p type="p">10:繼電器控制模組</p>
        <p type="p">11:繼電器</p>
        <p type="p">12:充電插頭</p>
        <p type="p">20:充電機</p>
        <p type="p">30:電池管理系統</p>
        <p type="p">31:接收單元</p>
        <p type="p">32:判斷單元</p>
        <p type="p">33:繼電器控制單元</p>
        <p type="p">34:充電機控制單元</p>
        <p type="p">40:人機介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="396" publication-number="202619152">
    <tif-files tif-type="multi-tif">
      <tif file="113140417.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可用大電流對電芯輪流充電的電池模組</chinese-title>
        <english-title>BATTERY MODULE FOR USING HIGH CURRENT TO CHARGE CELLS IN TURN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241030B">H01M50/507</main-classification>
        <further-classification edition="202101120241030B">H01M50/46</further-classification>
        <further-classification edition="200601120241030B">H01M10/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETEK OPTO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐明焜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱顯明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HSIEN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可用大電流對電芯輪流充電的電池模組，係包含N個電芯電性串聯成一組合，其中N為大於等於2的正整數；一充電線接設在該電芯組合一側的正電極，另一充電線接設在該電芯組合另一側的負電極，N-1條充電線分別連接在該電芯組合中相鄰二該電芯的正電極與負電極間，且各該充電線連接一充電插座；該充電插座電性連接一繼電器模組，並通過該繼電器模組中的該繼電器呈現通路及斷路的形態，使得該外部電力通過該繼電器模組及一該電芯二側的二該充電線，對該電芯中進行充電。此外並在該電芯完成充電後，再通過改變部分該繼電器的通路及斷路，使該外部電力對不同的該電芯逐一地進行大電流充電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery module capable of alternately charging cells with high current comprises N cells electrically connected in series to form a combination, where N is a positive integer greater than or equal to 2. One charging wire is connected to the positive electrode on one side of the cell combination, and another charging wire is connected to the negative electrode on the other side of the cell combination. Additionally, N-1 charging wires are respectively connected between the positive and negative electrodes of two adjacent cells within the cell combination, and each of these charging wires is connected to a charging socket. The charging sockets are electrically connected to a relay module. By controlling the conductive and open states of the relays within the relay module, external power passes through the relay module and the two charging wires on both sides of a specific cell to charge that cell. After the cell completes charging, by altering the conductive and open states of certain relays, the external power sequentially charges different cells individually with high current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池模組</p>
        <p type="p">101~108:電芯</p>
        <p type="p">145:充電插座</p>
        <p type="p">145a~145i:電接點</p>
        <p type="p">200:充電插頭</p>
        <p type="p">200a~200i:插銷</p>
        <p type="p">301~309:充電線</p>
        <p type="p">310:繼電器模組</p>
        <p type="p">320:外部電力</p>
        <p type="p">330、340:訊號線</p>
        <p type="p">400:電池管理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="397" publication-number="202619153">
    <tif-files tif-type="multi-tif">
      <tif file="113140418.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>採用大電流對電芯輪充的補電保養系統及充電方法</chinese-title>
        <english-title>A BATTERY SUPPLEMENTARY MAINTENANCE SYSTEM AND CHARGING METHOD OF USING HIGH CURRENT TO CHARGE CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241030B">H01M50/507</main-classification>
        <further-classification edition="202101120241030B">H01M50/46</further-classification>
        <further-classification edition="200601120241030B">H01M10/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETEK OPTO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐明焜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱顯明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HSIEN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種採用大電流對電芯輪充的補電保養系統及充電方法，係包含N個電芯組成串聯形式，且N+1條具有大線徑的充電線連接在兩兩相接的電極上。一充電插座連接各該充電線且連接一充電插頭，分別包含N個繼電器的電流輸入控制組件及電流輸出控制組件組成一繼電器控制模組電性連接該充電插頭，該繼電器控制模組電線連接一電池管理系統及一充電機。如此通過電流輸入控制組件及電流輸出控制組件的繼電器通路及斷路形態，得使該充電機輸出的大電流通過一該電芯二側的二條充電線，以對該電芯中進行充電。並在該電芯完成充電後，再通過改變部分該繼電器的通路及斷路，使該外部電力對不同的該電芯逐一地進行大電流充電/補電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A maintenance system and charging method that uses high current to charge cells in rotation. The system comprises N cells connected in series, and N+1 charging wires with large diameters connected to every pair of adjacent electrodes. A charging socket connects each of the charging wires and is connected to a charging plug. A relay control module, which includes current input control components and current output control components each containing N relays, is electrically connected to the charging plug. The relay control module wires connect to a battery management system and a charger. In this way, through the conductive and open states of the relays in the current input control components and current output control components, the high current output from the charger passes through two charging wires on both sides of a specific cell to charge that cell. After the cell completes charging, by changing the conductive and open states of certain relays, the external power sequentially charges different cells individually with high current for charging/maintenance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池模組</p>
        <p type="p">101~108:電芯</p>
        <p type="p">145:充電插座</p>
        <p type="p">145a~145i:電接點</p>
        <p type="p">200:充電插頭</p>
        <p type="p">200a~200i:插梢</p>
        <p type="p">300:充電設備</p>
        <p type="p">301~309:充電線</p>
        <p type="p">310:繼電器控制模組</p>
        <p type="p">311:電流輸入控制組件</p>
        <p type="p">312:電流輸出控制組件</p>
        <p type="p">320:充電機</p>
        <p type="p">330、340:訊號線</p>
        <p type="p">400:電池管理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="398" publication-number="202617234">
    <tif-files tif-type="multi-tif">
      <tif file="113140424.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可插拔搖桿模組安裝的校正方法及其校正系統</chinese-title>
        <english-title>CALIBRATION METHOD OF INSTALLATION OF PUGGABLE JOYSTICK MODULE AND CALIBRATION SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250122B">A63F13/22</main-classification>
        <further-classification edition="201401120250122B">A63F13/24</further-classification>
        <further-classification edition="201301120250122B">G06F3/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓凱翊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KAI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張惠吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種可插拔搖桿模組安裝的校正方法，應用於遊戲控制器，其包含連接介面、類比數位轉換器以及控制器，類比數位轉換器電性連接連接介面，控制器電性連接類比數位轉換器，前述校正方法包含以下步驟：當連接介面電性連接可插拔搖桿模組時，類比數位轉換器將可插拔搖桿模組的電位器的類比電壓轉換為數值，於開機狀態，控制器判斷類比數位轉換器的數值是否落在預設範圍；若類比數位轉換器的數值落在預設範圍，控制器對類比數位轉換器的數值進行濾波演算處理後輸出搖桿資料；以及控制器偵測搖桿資料的抖動狀態以做為關機狀態的依據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a calibration method of an installation of a pluggable joystick module, applied to a game controller that includes a connection interface, an analog-to-digital converter and a controller. The analog-to-digital converter is electrically connected to the connection interface, and the controller is electrically connected to the analog-to-digital converter. The aforesaid calibration method includes steps as follows. When A connection interface is electrically connected to a pluggable joystick module, the analog-to-digital converter converts the analog voltage of the potentiometer of the pluggable joystick module is a numerical value. In the power-on state, a controller is used to determine whether the numerical value of the analog-to-digital converter falls within a preset range,; if the numerical value of the analog-to-digital converter falls within the preset range, the controller performs a filtering operation on the numerical value of the analog-to-digital converter to output the joystick data; the controller detects the jitter status of the joystick data as a basis of a shutdown state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:校正方法</p>
        <p type="p">S601~S608:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="399" publication-number="202619155">
    <tif-files tif-type="multi-tif">
      <tif file="113140426.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線定位裝置和天線測試系統</chinese-title>
        <english-title>ANTENNA LOCATION DEVICE AND ANTENNA TEST SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H01Q1/12</main-classification>
        <further-classification edition="200601120250203B">H01Q3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造（浙江）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE ITECH(ZHEJIANG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃襄臨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIANGLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種天線定位裝置和天線測試系統，將軸套與轉軸轉動連接，並利用天線安裝臂安裝待測天線，使得操作人員可以通過轉動安裝架，進而調節待測天線的設置角度。由此，一方面，將第一磁性件設置於軸套，並將第二磁性件設置於轉軸，當天線安裝臂轉動至測試位置時，第一磁性件可以剛好與第二磁性件相互吸引，以對固定架和安裝架的相對位置進行精準定位。另一方面，當天線安裝臂與測試位置錯開時，第一磁性件也與第二磁性件錯開設置。操作人員在轉動天線安裝臂時，可以感受到磁吸力的變化。從而，通過磁吸力的大小，判斷出當前待測天線是否處於測試位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes an antenna location device and an antenna test system. A bushing and a rotating shaft are in rotary connection. And an antenna to be tested is mounted on an antenna mounting arm so that an operator can adjust an angle of the antenna to be tested by rotating a mounting frame. On one hand, a first magnetic element is disposed on the bushing, and a second magnetic element is disposed on the rotating shaft. The first magnetic element attracts the second magnetic element when the antenna mounting arm rotates to a testing position, thereby accurately locating a relative position of a fixing frame and the mounting frame. On another hand, the first magnetic element is staggered from the second magnetic element when the antenna mounting arm is staggered from the test position. As a result, the operator can feel changes in magnetic attraction when turning the antenna mounting arm.. Therefore, based on the magnitude of the magnetic attraction, it can be determined whether the antenna under test is in the test position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:固定架</p>
        <p type="p">3:安裝架</p>
        <p type="p">7:限位件</p>
        <p type="p">A:待測天線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="400" publication-number="202617372">
    <tif-files tif-type="multi-tif">
      <tif file="113140430.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具盒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25H3/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭偉成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭霆健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭芮欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭偉成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭霆健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭芮欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種工具盒，包含有：一底座，係由吹氣成型所一體製造而成，底座具有一底座本體、二樞接座及一扣片，底座本體之頂面上具有多數工具容置槽及一嵌接槽，二樞接座係一體連接於底座本體之一側邊上，二樞接座上各別有一樞接槽，扣片係一體連接於底座本體之另一側邊上；一盒蓋，係由真空成型所一體製造而成，為全區域皆呈透明，盒蓋具有一盒蓋本體、一樞接柱及一扣槽，樞接柱係一體連接於該盒蓋本體之一側邊上，樞接柱之二端係分別插入於各樞接槽中，盒蓋可受外力作用於一掀開位置至一蓋合位置間進行往復之開合，樞接柱之頂面上具有一補強部，補強部係呈連續之凹凸造型，扣槽係形成於盒蓋本體之另一側邊上；當盒蓋位於蓋合位置時，扣片係可扣接於扣槽中，並由盒蓋本體之底緣插入於嵌接槽內；藉以達到使用上較為便利、實用性佳、製造程序少、製造成本低、市場競爭力佳、強度較佳、不容易凹陷變形及能增加使用𪤳命等功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工具盒</p>
        <p type="p">10:底座</p>
        <p type="p">11:底座本體</p>
        <p type="p">111:工具容置槽</p>
        <p type="p">112:嵌接槽</p>
        <p type="p">12:樞接座</p>
        <p type="p">121:樞接槽</p>
        <p type="p">13:扣片</p>
        <p type="p">20:盒蓋</p>
        <p type="p">21:盒蓋本體</p>
        <p type="p">22:樞接柱</p>
        <p type="p">221:補強部</p>
        <p type="p">23:扣槽</p>
        <p type="p">24:平面加強部</p>
        <p type="p">241:井字形凹槽</p>
        <p type="p">25:弧面加強部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="401" publication-number="202618575">
    <tif-files tif-type="multi-tif">
      <tif file="113140438.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140438</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檔案管理系統與檔案管理方法</chinese-title>
        <english-title>FILE MANAGEMENT SYSTEM AND FILE MANAGEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250122B">G06F16/10</main-classification>
        <further-classification edition="201901120250122B">G06F16/25</further-classification>
        <further-classification edition="202001120250122B">G06F40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>未來巢科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUTURENEST TECH. CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡孟嬋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, MENG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊代強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檔案管理系統與檔案管理方法，應用於一第一用戶以及一人工智慧模型之間，其中該檔案管理系統包含：一資料庫；以及一檔案接收與處理模組，信號連結至該人工智慧模型、該資料庫以及一第一用戶，用以接收該第一用戶給出之一第一檔案，然後將該第一檔案送入該人工智慧模型進行一摘要處理而得到一第一摘要檔案，將該第一摘要檔案進行一儲存前預處理而得到一第一分類結果參數集合與一第一新名稱檔案，並根據該第一分類結果檔案來對該資料庫進行一資料夾內容更新，再將該第一新名稱檔案存入已完成資料夾內容更新之該資料庫中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A file management system and file management method applied between a first user and an artificial intelligence model, wherein the file management system comprises: a database; and a file receiving and processing module, signal-connected to the artificial intelligence model, the database, and the first user, configured to receive a first file provided by the first user, then send the first file to the artificial intelligence model for summary processing to obtain a first summarized file, perform a pre-storage processing on the first summarized file to obtain a first classification result parameter set and a first renamed file, and update the contents of a folder in the database based on the first classification result file, and store the first renamed file into the database with the updated folder contents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:檔案管理系統</p>
        <p type="p">101:人工智慧模型</p>
        <p type="p">102:資料庫</p>
        <p type="p">103:檔案接收與處理模組</p>
        <p type="p">11:第一用戶</p>
        <p type="p">12:第二用戶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="402" publication-number="202617057">
    <tif-files tif-type="multi-tif">
      <tif file="113140440.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140440</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理方法、電子設備及存儲介質</chinese-title>
        <english-title>METHOD FOR PROCESSING IMAGES, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A61B3/12</main-classification>
        <further-classification edition="202201120241204B">G06V40/14</further-classification>
        <further-classification edition="202201120241204B">G06V40/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靜廣軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHING, KUANG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種影像處理方法、電子設備及存儲介質，所述方法包括：對眼底圖像進行灰階處理，得到灰階圖像，所述眼底圖像中的視網膜包括視盤；基於所述灰階圖像確定對應的亮度值與圖元點之間的關係，確定所述視盤的目標位置；根據所述目標位置確定所述眼底圖像的第一分類結果，所述第一分類結果包括左眼圖像和右眼圖像。上述方法能夠減少眼底圖像的分類成本以及提高分類精度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for processing images, an electronic device, and a storage medium. The method includes: performing a grayscale processing on a fundus image and obtaining a grayscale image, which includes a retina with an optic disc; based on the grayscale image, determining a relationship between corresponding brightness values and pixel points, and determining a target location of the optic disc; determining a first classification result of the fundus image according to the target location, the first classification result including a left eye image and a right eye image. The method can effectively reduce classification cost of fundus images, and improve classification accuracy .</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S103:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="403" publication-number="202617111">
    <tif-files tif-type="multi-tif">
      <tif file="113140444.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140444</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>傷口敷料</chinese-title>
        <english-title>WOUND DRESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241128B">A61F13/02</main-classification>
        <further-classification edition="200601120241128B">A61L26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺中科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAICHUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PEI JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俐均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種傷口敷料，包含：一第一敷料層，具有複數個吸收結構，該複數個吸收結構，用以接觸並吸收液體；一第二敷料層，設置在該第一敷料層上，該第一敷料層以及該第二敷料層間形成有一容置空間，該第二敷料層具有一面向該容置空間的一內表面以及相對於該內表面設置的一外表面；以及複數個微米級氣泡，容置於該容置空間中，且該複數個微米級氣泡可透過該些吸收結構間的間隙釋放，且該複數個微米級氣泡由包含麥盧卡蜂蜜的溶液形成；其中，該第二敷料層的該外表面上具有一注入孔，該注入孔可供自該第二敷料層外注入該複數個微米級氣泡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wound dressing, including: a first dressing layer having a plurality of absorbent structures, the plurality of absorbent structures are configured for contacting and absorbing liquid; a second dressing layer disposed on top of the first dressing layer, an accommodating space being formed between the first dressing layer and the second dressing layer, the second dressing layer having an inner surface facing the accommodating space and an outer surface disposed relative to the inner surface; and a plurality of micron-sized bubbles accommodated in the accommodating space, and the plurality of micron-sized bubbles being able to be released through gaps among the plurality of absorbing structures, and the plurality of micron-sized bubbles are formed by a solution including Manuka honey. The outer surface of the second dressing layer has an injection hole, and the injection hole can be used to inject the plurality of micron-sized bubbles from outside the second dressing layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:傷口敷料</p>
        <p type="p">11:第一敷料層</p>
        <p type="p">111:吸收結構</p>
        <p type="p">111I:間隙</p>
        <p type="p">12:第二敷料層</p>
        <p type="p">121:注入孔</p>
        <p type="p">A:吸收結構陣列</p>
        <p type="p">N:注射器</p>
        <p type="p">S:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="404" publication-number="202617413">
    <tif-files tif-type="multi-tif">
      <tif file="113140445.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳纖維複合物及其製造方法</chinese-title>
        <english-title>CARBON FIBER COMPOSITE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">B29C70/10</main-classification>
        <further-classification edition="200601120241101B">C08J5/04</further-classification>
        <further-classification edition="200601120241101B">D01F9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺中科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAICHUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PEI JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俐均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種碳纖維複合物及其製造方法，其中，該製造方法包含：將一第一材料加入一熔融裝置，透過該熔融裝置形成一熔融材料；將該熔融材料通過該熔融裝置的至少一注塑孔並注塑至一擠壓模具，並提供一碳纖維材料至該擠壓模具，使該碳纖維材料以及該熔融材料同時通過該擠壓模具以擠壓拉伸成形，形成一共擠出碳纖維材料；將該共擠出碳纖維材料通過一冷卻裝置進行冷卻；將經冷卻的該共擠出碳纖維材料進行裁切；將經裁切的該共擠出碳纖維材料通過一編織裝置進行編織，以形成一碳纖維面料；以及將該碳纖維面料塑形以形成一碳纖維複合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carbon fiber composite and a method for manufacturing the same, wherein the manufacturing method includes: adding a first material to a melting device, forming a molten material through the melting device; passing the molten material through at least one injecting hole of the melting device and injecting the molten material to an extruding mold and providing a carbon fiber material to the extruding mold, so that the carbon fiber material and the molten material are extruded and stretched through the extruding mold at the same time to form a co-extruded carbon fiber material; cooling the co-extruded carbon fiber material through a cooling device; cutting the cooled co-extruded carbon fiber material; weaving the cut co-extruded carbon fiber material through a weaving device to form a carbon fiber fabric; and shaping the carbon fiber fabric to form a carbon fiber composite.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:熔融裝置</p>
        <p type="p">20:擠壓模具</p>
        <p type="p">30:冷卻裝置</p>
        <p type="p">40:裁切裝置</p>
        <p type="p">50:編織裝置</p>
        <p type="p">M1:第一材料</p>
        <p type="p">M2:碳纖維材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="405" publication-number="202617388">
    <tif-files tif-type="multi-tif">
      <tif file="113140452.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機械手臂無刀尖點工具中心的校正方法</chinese-title>
        <english-title>A CALIBRATION METHOD FOR ROBOTIC ARM TOOL CENTER POINT WITHOUT A TOOL APEX</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25J13/08</main-classification>
        <further-classification edition="200601120241204B">B25J19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃成凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種創新的機械手臂無刀尖點工具中心校正方法，成功解決了現有技術依賴實體刀尖點辨識的侷限；所述方法主要透過整合2D視覺感測器與輪廓感測器，成功開發出一套能自動校正機械手臂無刀尖點工具中心的技術。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an innovative calibration method for robotic arm tool center point without a tool apex. The said calibration method successfully addresses the limitations of the conventional technologies that rely on physical tool tip recognition. The method integrates 2D vision sensors and contour sensors, successfully developing a technology capable of automatically calibrating the tool center point coordinates for tools without a defined tool apex.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="406" publication-number="202618521">
    <tif-files tif-type="multi-tif">
      <tif file="113140453.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>便攜式模擬反饋系統及其模組</chinese-title>
        <english-title>PORTABLE SIMULATION FEEDBACK SYSTEM AND MODLUE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120241204B">G06F3/0346</main-classification>
        <further-classification edition="200601120241204B">G01C19/08</further-classification>
        <further-classification edition="200601120241204B">G09B23/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴金輪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張玉梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-TSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種便攜式模擬反饋系統及其模組，便攜式模擬反饋系統包含一虛擬實境裝置與一便攜式模組。虛擬實境裝置包含一顯示單元與一處理單元。處理單元執行一虛擬實境程式而提供一影像資料至顯示單元。便攜式模組包含一本體、設置於本體內的一感測單元、一控制單元及電性耦接於控制單元的一慣性單元。感測單元感測本體的姿態，產生一感測訊號，以使處理單元得知便攜式模組的座標位置。處理單元執行虛擬實境程式得知至少一阻力產生座標位置，當便攜式模組的座標位置等於阻力產生座標位置時，處理單元能驅使慣性單元進行一慣性運動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a portable simulation feedback system and module thereof. The portable simulation feedback system includes a virtual reality device and a portable module. The virtual reality device includes a display unit and a processing unit. The processing unit is operated to execute a virtual reality program and provides an image data to the display unit. The portable module includes a body, a sensing unit that arranged in the body, a control unit, and an inertial unit that is electrically coupled to the control unit. The sensing unit is operated to sense a posture of the body and generates a sensing signal, such that the processing unit obtains a coordinate position of the portable module. The processing unit is operated to execute a virtual reality program to obtain a resistance generation coordinate position. When the coordinate position of the portable module is equal to the resistance generation coordinate position, the processing unit can drive the inertial unit to perform an inertial motion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:便攜式模擬反饋系統</p>
        <p type="p">1:虛擬實境裝置</p>
        <p type="p">11:顯示單元</p>
        <p type="p">12:處理單元</p>
        <p type="p">13:通訊單元</p>
        <p type="p">2:便攜式模組</p>
        <p type="p">22:感測單元</p>
        <p type="p">23:控制單元</p>
        <p type="p">24:慣性單元</p>
        <p type="p">25:傳輸單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="407" publication-number="202618613">
    <tif-files tif-type="multi-tif">
      <tif file="113140454.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於即時神經網路運算架構的參數選取方法及參數選取系統</chinese-title>
        <english-title>PARAMETER SELECTION METHOD AND PARAMETER SELECTION SYSTEM FOR REAL-TIME NEURAL NETWORK COMPUTING ARCHITECTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250122B">G06N3/0495</main-classification>
        <further-classification edition="202301120250122B">G06N3/04</further-classification>
        <further-classification edition="200601120250122B">G06N3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種用於即時神經網路運算架構的參數選取方法及參數選取系統。參數選取方法包括：取得用於目標即時神經網路運算架構的取用策略組合，其中，取用策略組合包括多個取用策略。每一取用策略定義有資料取用電路存取記憶體時使用的多個取用參數。參數選取方法還包括通過配置多個資料取用電路依據每一取用策略存取記憶體，同時配置多個運算通道針對每一取用策略執行卷積運算程序，以取得執行卷積運算程序所使用的優化取用策略。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A parameter selection method and a parameter selection system for real-time neural network computing architecture are provided. The parameter selection method include: obtaining a fetch strategy combination for a target real-time neural network computing architecture. The access strategy combination includes a plurality of access strategies. Each access strategy defines a plurality of access parameters used by data access circuits when accessing a memory. The parameter selection method also include: configuring the data access circuits to access the memory according to each of the access strategies, and configuring a plurality of computing tiles to execute a convolution operation process for each of the access strategies to obtain an optimized access strategy used to execute the convolution operation process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S20,S21:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="408" publication-number="202619238">
    <tif-files tif-type="multi-tif">
      <tif file="113140459.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用雙耦合電感的多輸出電源轉換器</chinese-title>
        <english-title>MULTI-OUTPUT POWER CONVERTER HAVING DUAL COUPLED INDUCTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H02M1/08</main-classification>
        <further-classification edition="200601120250122B">H02M7/217</further-classification>
        <further-classification edition="200601120250122B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄔宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳權廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的使用雙耦合電感的多輸出電源轉換器。在本發明電源轉換器中，第一耦合電感包含第一激磁電感以及第一次級側電感，第二耦合電感包含第二激磁電感以及第二次級側電感。第一次級側電感的第二端以及第二次級側電感的第二端作為本發明電源轉換器的兩輸出端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-output power converter having dual coupled inductors is provided. In the multi-output power converter, a first coupled inductor includes a first magnetizing inductor and a first secondary inductor and a second coupled inductor includes a second magnetizing inductor and a second secondary inductor. A second terminal of the first secondary inductor and a second terminal of the second secondary inductor are respectively used as two terminals of the multi-output power converter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VIN:輸入電源</p>
        <p type="p">Q1:第一開關</p>
        <p type="p">Q2:第二開關</p>
        <p type="p">Q3:第三開關</p>
        <p type="p">Q4:第四開關</p>
        <p type="p">L1:第一耦合電感</p>
        <p type="p">Lm1:第一激磁電感</p>
        <p type="p">Ls1:第一次級側電感</p>
        <p type="p">L2:第二耦合電感</p>
        <p type="p">Lm2:第二激磁電感</p>
        <p type="p">Ls2:第二次級側電感</p>
        <p type="p">np1、np2:初級側</p>
        <p type="p">ns1、ns2:次級側</p>
        <p type="p">CTR:控制電路</p>
        <p type="p">Cc:箝位電容</p>
        <p type="p">Lr1:上側漏電感</p>
        <p type="p">Lr2:下側漏電感</p>
        <p type="p">Cb:輸入電容</p>
        <p type="p">Dd1、Dd2、Dd3、Dd4:寄生二極體</p>
        <p type="p">Cp1、Cp2、Cp3、Cp4:寄生電容</p>
        <p type="p">Co1:上側輸出電容</p>
        <p type="p">Co2:下側輸出電容</p>
        <p type="p">VOUT1、VOUT2:輸出電壓</p>
        <p type="p">Vc、VLm1、VLm2、VLr1、VLr2、Vb、Vds1、Vds2、Vds3、Vds4:電壓</p>
        <p type="p">RL1、RL2:負載</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="409" publication-number="202619239">
    <tif-files tif-type="multi-tif">
      <tif file="113140464.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單電感多輸出的電源轉換器</chinese-title>
        <english-title>MULTI-OUTPUT POWER CONVERTER HAVING SINGLE INDUCTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H02M1/08</main-classification>
        <further-classification edition="200601120250122B">H02M3/156</further-classification>
        <further-classification edition="200601120250122B">H02M3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奕欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YIH-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳權廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種單電感多輸出的電源轉換器。本發明的電源轉換器包含上橋開關、下橋開關、多個輸出開關以及控制電路。上橋開關的第一端耦接輸入電壓。下橋開關的第一端連接上橋開關的第二端。下橋開關的第二端接地。下橋開關的第一端與上橋開關的第二端之間的節點連接電感的第一端。各輸出開關的第一端連接電感的第二端。多個輸出開關分別的多個第二端作為電源轉換器的多個輸出端。控制電路連接各開關元件的控制端。控制電路控制多個輸出開關的多個導通時間，以控制電源轉換器的多個輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-output power converter having a single inductor is provided. The multi-output power converter includes a high-side switch, a low-side switch, a plurality of output switches and a control circuit. A first terminal of the high-side switch is coupled to an input voltage. A first terminal of the low-side switch is connected to a second switch of the high-side switch. A second terminal of the low-side switch is grounded. A node between the first terminal of the low-side switch and the second switch of the high-side switch is connected to a first terminal of an inductor. A first terminal of each of the output switches is connected to a second terminal of the inductor. The control circuit controls on-times of the output switches for controlling a plurality of output voltages of the multi-output power converter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VIN1:輸入電壓</p>
        <p type="p">Min1:第一上橋開關</p>
        <p type="p">M1:第一下橋開關</p>
        <p type="p">L:電感</p>
        <p type="p">Mout1~Moutn:輸出開關</p>
        <p type="p">VOUT1~VOUTn:輸出電壓</p>
        <p type="p">CTR:控制電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="410" publication-number="202619514">
    <tif-files tif-type="multi-tif">
      <tif file="113140469.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/00</main-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
        <further-classification edition="200601120250102B">H01L21/20</further-classification>
        <further-classification edition="200601120250102B">H01L21/76</further-classification>
        <further-classification edition="200601120250102B">H01L21/265</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZOU, CHEN-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴云凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構包含基板、隔離區、圖案化半導體層、圖案化鍵合層以及磊晶層。隔離區埋入於基板中，隔離區的頂面和基板的頂面在同一平面上。圖案化半導體層設置於隔離區的正上方，圖案化鍵合層設置於隔離區和圖案化半導體層之間。磊晶層設置於基板上，覆蓋圖案化半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate, an isolation region, a patterned semiconductor layer, a patterned bonding layer and an epitaxial layer. The isolation region is buried in the substrate, and the top surface of the isolation region and the top surface of the substrate are on the same plane. The patterned semiconductor layer is disposed directly above the isolation region. The patterned bonding layer is disposed between the isolation region and the patterned semiconductor layer. The epitaxial layer is disposed on the substrate and covers the patterned semiconductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">101:基板</p>
        <p type="p">103:隔離區</p>
        <p type="p">105:圖案化鍵合層</p>
        <p type="p">107:圖案化半導體層</p>
        <p type="p">109:磊晶層</p>
        <p type="p">109-1:第一部分</p>
        <p type="p">109-2:第二部分</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">T3:第三厚度</p>
        <p type="p">△H1:第一高度差</p>
        <p type="p">△H2:第二高度差</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="411" publication-number="202618168">
    <tif-files tif-type="multi-tif">
      <tif file="113140495.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140495</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螢幕支架及其螢幕設備</chinese-title>
        <english-title>MONITOR STAND AND MONITOR APPARATUS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">F16M11/06</main-classification>
        <further-classification edition="200601120241130B">G02F1/133</further-classification>
        <further-classification edition="200601120241130B">G09F9/35</further-classification>
        <further-classification edition="200601120241130B">G06F3/14</further-classification>
        <further-classification edition="200601120241130B">H05K7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明基電通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENQ CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭孟揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, MENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹仁翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, JEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種螢幕支架適用於連接顯示螢幕且包含支撐柱、後懸臂、前懸臂以及限位槽結構。後懸臂樞接於支撐柱且具有第一樞接端部。前懸臂樞接於顯示螢幕且具有第二樞接端部。限位槽結構設置於第一樞接端部或第二樞接端部，前懸臂與顯示螢幕之第一樞接點和後懸臂與支撐柱之第三樞接點之間的連線不通過後懸臂與前懸臂之第二樞接點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A monitor stand is suitable for connecting to a display monitor and includes a support column, a rear cantilever, a front cantilever, and a limiting slot structure. The rear cantilever is pivoted to the support column and has a first pivot end portion. The front cantilever is pivoted to the display monitor and has a second pivot end portion. The limiting slot structure is disposed on the first pivot end portion or the second pivot end portion. A connection line between a first pivot point of the front cantilever and the display monitor and a third pivot point of the rear cantilever and the support column does not pass through a second pivot point of the rear cantilever and the front cantilever.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:螢幕設備</p>
        <p type="p">12:顯示螢幕</p>
        <p type="p">14:螢幕支架</p>
        <p type="p">18:後懸臂</p>
        <p type="p">20:前懸臂</p>
        <p type="p">22:限位槽結構</p>
        <p type="p">26:凸柱</p>
        <p type="p">28:插銷件</p>
        <p type="p">P1:第一樞接點</p>
        <p type="p">P2:第二樞接點</p>
        <p type="p">P3:第三樞接點</p>
        <p type="p">F:垂直力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="412" publication-number="202618006">
    <tif-files tif-type="multi-tif">
      <tif file="113140499.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於評估病毒感染之一懷孕個體之妊娠風險的方法</chinese-title>
        <english-title>METHOD FOR EVALUATING PREGNANCY RISK OF A PREGNANT INDIVIDUAL INFECTED WITH A VIRUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250501B">C12Q1/6876</main-classification>
        <further-classification edition="201801120250501B">C12Q1/6888</further-classification>
        <further-classification edition="200601120250501B">C12Q1/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭兆珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHAO-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈靜茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHING-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, SHU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, BO-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭美秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MEI-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JUN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於評估病毒感染之一懷孕個體之妊娠風險的方法。該方法包含以下步驟：(a)取得病毒感染之該懷孕個體的一生物樣本；(b)檢測該生物樣本中至少一微小核醣核酸的表現量，其中該至少一微小核醣核酸係選自由hsa-miR-20a-5p、hsa-miR-20b-5p及hsa-miR-25-3p所組成之群組；以及(c)比對步驟(b)中各該至少一微小核醣核酸的表現量與一對照組之對應相同微小核醣核酸的表現量，其中當病毒感染之該懷孕個體之該至少一微小核醣核酸的表現量高於該對照組的表現量時，則評估該懷孕個體存在有妊娠風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for evaluating pregnancy risk of a pregnant individual infected with a virus. The method comprises the following steps: (a) obtaining a plurality of biological samples from the virus-infected pregnant individual; (b) detecting the expression levels of at least one microRNA in the biological samples, wherein the at least one microRNA is selected from the group consisting of hsa-miR-20a-5p, hsa-miR-20b-5p, and hsa-miR-25-3p; and (c) comparing the expression levels of the at least one microRNA in step (b) with the corresponding expression levels of the same microRNA in a control group, wherein when the expression level of the at least one microRNA in the virus-infected pregnant individual is higher than that of the control group, the pregnancy risk is evaluated for the pregnant individual.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="413" publication-number="202619596">
    <tif-files tif-type="multi-tif">
      <tif file="113140510.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構</chinese-title>
        <english-title>PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/85</main-classification>
        <further-classification edition="202501120250102B">H10H20/851</further-classification>
        <further-classification edition="202501120250102B">H10H20/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修邑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIOU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供封裝結構。封裝結構包括介電結構、重佈線結構、複數個發光元件、色轉換層及金屬擋牆。重佈線結構設置於介電結構中。複數個發光元件設置於介電結構上，且電性連接重佈線結構。色轉換層設置於複數個發光元件上。金屬擋牆設置於介電結構上，且圍繞色轉換層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure is provided. The package structure includes a dielectric structure, a redistribution structure, a plurality of light-emitting elements, a color conversion layer, and a metal wall. The redistribution structure is disposed in the dielectric structure. The plurality of light-emitting elements is disposed on the dielectric structure and is electrically connected to the redistribution structure. The color conversion layer is disposed on the plurality of light-emitting elements. The metal wall is disposed on the dielectric structure and surrounds the color conversion layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:封裝結構</p>
        <p type="p">20:發光元件</p>
        <p type="p">22,52:接墊</p>
        <p type="p">30:第一介電層</p>
        <p type="p">32:第一重佈線層</p>
        <p type="p">34:第二介電層</p>
        <p type="p">36:第二重佈線層</p>
        <p type="p">38:第三介電層</p>
        <p type="p">40:柱狀結構</p>
        <p type="p">40a:導電柱</p>
        <p type="p">40b:散熱柱</p>
        <p type="p">50:封裝層</p>
        <p type="p">70:金屬擋牆</p>
        <p type="p">72:反射層</p>
        <p type="p">80:色轉換層</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">DS:介電結構</p>
        <p type="p">R1:第一區域</p>
        <p type="p">R2:第二區域</p>
        <p type="p">RDLS:重佈線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="414" publication-number="202618739">
    <tif-files tif-type="multi-tif">
      <tif file="113140511.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>閘極驅動電路</chinese-title>
        <english-title>GATE DRIVING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G09G3/30</main-classification>
        <further-classification edition="200601120241230B">G09G3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>睿生光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOCARE OPTOELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳進吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種閘極驅動電路。閘極驅動電路包括輸出電晶體、第一放電電晶體以及第二放電電晶體。輸出電晶體的第一端接收操作時脈。輸出電晶體的控制端電性連接於控制節點。輸出電晶體經由輸出電晶體的第二端輸出第n級閘極驅動信號。第一放電電晶體在第一時間區間對位於控制節點的電壓值進行放電。第二放電電晶體在第二時間區間對位於控制節點的電壓值進行放電。第二時間區間不同於第一時間區間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gate driving circuit is provided. The gate driving circuit includes an output transistor, a first discharge transistor and a second discharge transistor. A first terminal of the output transistor receives an operating clock. A control terminal of the output transistor is electrically connected to a control node. The output transistor outputs the n-th stage gate driving signal through a second terminal of the output transistor. The first discharge transistor discharges a voltage value located at the control node in a first time interval. The second discharge transistor discharges the voltage value located at the control node in a second time interval. The second time interval is different from the first time interval.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:上拉電路</p>
        <p type="p">CK1:操作時脈</p>
        <p type="p">CKP1:放電控制時脈</p>
        <p type="p">GD(n):第n級閘極驅動信號</p>
        <p type="p">GD(n+a):第(n+a)級閘極驅動信號</p>
        <p type="p">GU(n):閘極驅動電路</p>
        <p type="p">P(n):控制節點</p>
        <p type="p">TD1:第一放電電晶體</p>
        <p type="p">TD2:第二放電電晶體</p>
        <p type="p">TO:輸出電晶體</p>
        <p type="p">VSSG:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="415" publication-number="202617514">
    <tif-files tif-type="multi-tif">
      <tif file="113140512.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動輔助自行車之動力總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241230B">B62M6/55</main-classification>
        <further-classification edition="201001120241230B">B62M6/40</further-classification>
        <further-classification edition="201001120241230B">B62M6/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>士林電機廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜宗佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘偉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇騰鋐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動輔助自行車之動力總成，係將馬達、減速齒輪組與驅動器整合為一體；該總成係包括有一側蓋、一驅動器、一電機驅動殼體、一電機定子、一電機轉子、一曲柄軸、一減速齒輪組以及減速齒殼體；驅動器安裝在電機驅動殼體的左側，由側蓋包覆與固定；電機驅動殼體右側容置電機定子、電機轉子；而電機轉子係驅動減速齒輪組之中空輸入軸心，減速齒輪組的另側，則有減速齒殼體包覆使形成一體，並有曲柄軸穿置於動力總成各機件中，曲柄軸處於在總成之軸向中心位置；當電機與人力騎行有速度差時，電機介入動力輔助為其目的之本發明電動輔助自行車之動力總成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:動力總成</p>
        <p type="p">21:電機驅動殼體</p>
        <p type="p">22:減速齒殼體</p>
        <p type="p">27:曲柄軸</p>
        <p type="p">28:側蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="416" publication-number="202619561">
    <tif-files tif-type="multi-tif">
      <tif file="113140517.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140517</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D84/80</main-classification>
        <further-classification edition="202501120250102B">H10D84/03</further-classification>
        <further-classification edition="200601120250102B">H01L21/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高培勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, PEI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游峻偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王韶韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件，包含一摻雜區、第一閘極以及一絕緣結構。摻雜區設置於基底中。第一閘極沿著一第一方向延伸設置於摻雜區上。絕緣結構沿著一第二方向設置於第一閘極的一側，其中絕緣結構包含一第一弧形側面直接接觸第一閘極，第一弧形側面具有一傾斜角，且傾斜角小於45度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a doped region, a first gate and an insulating structure. The doped region is disposed in a substrate. The first gate is disposed on the doped region and extends along a first direction. The insulating structure is disposed at a side of the first gate along a second direction, wherein the insulating structure includes a first curve side surface directly contacting the first gate, and the first curve side surface has an inclined angle less than 45 degrees.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體元件</p>
        <p type="p">10:基底</p>
        <p type="p">11:元件區域</p>
        <p type="p">16:絕緣結構</p>
        <p type="p">22:絕緣層</p>
        <p type="p">23:側壁子</p>
        <p type="p">24:摻雜區</p>
        <p type="p">36:第一子層</p>
        <p type="p">38:第二子層</p>
        <p type="p">40,42:閘極絕緣層</p>
        <p type="p">44:閘極導電層</p>
        <p type="p">46,48,50:閘極</p>
        <p type="p">52:側壁子</p>
        <p type="p">54:摻雜區</p>
        <p type="p">56:介電層</p>
        <p type="p">58:通道區</p>
        <p type="p">122:閘極絕緣層</p>
        <p type="p">124:電荷儲存層</p>
        <p type="p">126:阻擋絕緣層</p>
        <p type="p">343:弧形側面</p>
        <p type="p">503:外側面</p>
        <p type="p">A,A',B,B':方向</p>
        <p type="p">D1,D2:水平方向</p>
        <p type="p">D3:垂直方向</p>
        <p type="p">ML1,ML2,ML3,ML4,ML5:遮罩層</p>
        <p type="p">X:部位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="417" publication-number="202617499">
    <tif-files tif-type="multi-tif">
      <tif file="113140520.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動自行車之車架單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">B62K19/10</main-classification>
        <further-classification edition="200601120241227B">B62K19/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太宇科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡紹榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳常俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種電動自行車之車架單元，包含車架管及電池支架，車架管由兩殼件相對合且結合形成，且車架管上開設有操作開口，電池支架設於車架管內，且包含電池座及延伸板，電池座的位置對應操作開口設置，且電池座的相對兩側分別結合於車架管的內壁，延伸板自電池座朝向遠離操作開口的方向延伸而與車架管的內壁相接。透過增設電池支架，能有效提高車架單元的結構強度，在開設操作開口的前提下，仍能符合相關規範、確保安全性，同時能穩定支撐電池、將車架管的內部分割為相間隔的空間以供配線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼件</p>
        <p type="p">11:車架管部</p>
        <p type="p">12:馬達座部</p>
        <p type="p">20:電池支架</p>
        <p type="p">21:電池座</p>
        <p type="p">90:車架單元</p>
        <p type="p">91:車架管</p>
        <p type="p">911:操作開口</p>
        <p type="p">92:馬達座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="418" publication-number="202618105">
    <tif-files tif-type="multi-tif">
      <tif file="113140524.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結構補強裝置</chinese-title>
        <english-title>STRUCTURAL STRENGTHENING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">E04B1/58</main-classification>
        <further-classification edition="200601120241227B">E04C3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昭勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, EASHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連柏正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAN, PO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, ZHEN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇潾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種連結構架中相鄰柱體之結構補強裝置。其作用係藉由裝置中之結構件、夾持組件、以及柱體之接合處之彎矩傳遞設計提高構架之側向強度及穩定性。本裝置主要以至少一結構件以及至少二組夾持組件連結構架中之相鄰柱體、並以緩衝材料填充包覆構材與柱體間之空間以分散應力。上述夾持組件係由一組可拆卸之包覆元件對接而成，其功能在提供結構件與柱體間之剪力與彎矩傳遞；而緩衝材料則可降低柱體在應力傳遞過程中所受之應力。藉由本裝置中之結構件於構架側向變形中所產生之抵抗力矩，將可提升構架在側向力作用下之強度及穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is a structural strengthening device for connecting adjacent columns in a frame. Its function is to enhance the lateral strength and stability of the frame through the design of moment transmission at the joints of the structural members, clamping components, and columns. This device primarily connects adjacent columns in the frame by using at least one structural member and at least two sets of clamping components, and by filling the space between the structural members and the columns with cushioning material to distribute stress. The above-mentioned clamping components consist of a set of detachable cladding elements, which function to transmit shear forces and moments between the structural members and the columns. The cushioning material reduces the stress experienced by the columns during the process of stress transmission. The moment resistance generated by the structural members during lateral deformation of the frame enhances the strength and stability of the frame under lateral forces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:結構補強裝置</p>
        <p type="p">10:第一夾持組件</p>
        <p type="p">12:第一套件</p>
        <p type="p">122:第一外翼板</p>
        <p type="p">14:第一緩衝件</p>
        <p type="p">16:第二套件</p>
        <p type="p">162:第二外翼板</p>
        <p type="p">18:第二緩衝件</p>
        <p type="p">20:第一結構件</p>
        <p type="p">22:第二結構件</p>
        <p type="p">30:第二夾持組件</p>
        <p type="p">32:第三套件</p>
        <p type="p">322:第三外翼板</p>
        <p type="p">34:第三緩衝件</p>
        <p type="p">36:第四套件</p>
        <p type="p">362:第四外翼板</p>
        <p type="p">38:第四緩衝件</p>
        <p type="p">C1:第一柱體</p>
        <p type="p">C2:第二柱體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="419" publication-number="202617011">
    <tif-files tif-type="multi-tif">
      <tif file="113140531.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140531</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>窗簾上樑夾持固定結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A47H13/04</main-classification>
        <further-classification edition="200601120241101B">A47H1/142</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶豐富實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHING FENG HOME FASHIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁文穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, WEN YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許盛瀛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHENG YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粘武忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEN, WU CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣明助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, MING CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施韋名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉光德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種窗簾上樑夾持固定結構，包含有：一固定片，該固定片的一端設有一黏附單元，透過該黏附單元將該固定片黏固於一垂直面，該固定片設有引導凸點與卡勾；一固定掛勾，具有第一連接部與第二連接部；該第一連接部有對應前述引導凸點與卡勾的連接槽孔，藉由該卡勾扣合於該連接槽孔使該固定掛勾結合於該固定片；另外將窗簾之上樑組合於該固定掛勾，該固定掛勾之上扣合部結合於窗簾之上樑之上凹槽，該固定掛勾之下扣合部頂扺於該上樑的下端，即可將窗簾固定於該固定掛勾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:固定片</p>
        <p type="p">11:黏附單元</p>
        <p type="p">12:引導凸點</p>
        <p type="p">13:卡勾</p>
        <p type="p">20:固定掛勾</p>
        <p type="p">21:第一連接部</p>
        <p type="p">211:連接槽孔</p>
        <p type="p">212:下扣合部</p>
        <p type="p">22:第二連接部</p>
        <p type="p">221:上扣合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="420" publication-number="202619441">
    <tif-files tif-type="multi-tif">
      <tif file="113140537.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140537</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固持裝置及電子設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K5/02</main-classification>
        <further-classification edition="200601120241204B">F16B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商冠捷投資有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾繁榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, FAN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張詠然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固持裝置及電子設備，該固持裝置包含一定位柱、一彈簧組件，及一固持墊圈。該彈簧組件套設於該定位柱。該固持墊圈可滑動地套設於該定位柱並抵接於該彈簧組件一端，該固持墊圈設置成能沿著該定位柱朝該彈簧組件滑動以壓縮該彈簧組件。該固持裝置藉由該彈簧組件的壓縮變形來吸收震動並起到緩衝及減震的效果。藉此，能降低該固持裝置的製造成本，能使該固持裝置整體結構簡單且體積小型化，還能提升該固持裝置的組件維修或更換的操作便利性。此外，能大幅縮短一電子裝置組裝於該固持裝置的工時並能提升生產效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子設備</p>
        <p type="p">1:背板</p>
        <p type="p">2:電子裝置</p>
        <p type="p">21:卡扣片</p>
        <p type="p">3:固持裝置</p>
        <p type="p">31:定位柱</p>
        <p type="p">311:連接柱體</p>
        <p type="p">312:導引柱體</p>
        <p type="p">313:環形定位溝槽</p>
        <p type="p">32:彈簧組件</p>
        <p type="p">321:壓縮彈簧</p>
        <p type="p">322:抵接墊圈</p>
        <p type="p">33:固持墊圈</p>
        <p type="p">331:環形固持槽</p>
        <p type="p">X:前後方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="421" publication-number="202618656">
    <tif-files tif-type="multi-tif">
      <tif file="113140538.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於預測股市之電子裝置及其強化學習模型訓練方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS FOR STOCK MARKET PREDICTION AND METHOD FOR TRAINING REINFORCEMENT LEARNING MODEL THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241031B">G06Q40/04</main-classification>
        <further-classification edition="202301120241031B">G06N3/092</further-classification>
        <further-classification edition="202001120241031B">G06F30/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優式資本股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UC CAPITAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪鼎杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於預測股市之電子裝置及其強化學習模型訓練方法被揭露於此。該強化學習模型訓練方法包含：透過一圖注意力網路計算出財務報告資料中複數公司的一關係矩陣與一平均夏普值；將該平均夏普值、該關係矩陣與該財務報告資料應用至一強化學習模型，以使該強化學習模型產生一投資清單；透過一時序卷積自編碼器，將股市交易資料壓縮為交易特徵資料；以及將該交易特徵資料以及該投資清單應用至另一強化學習模型，以使該另一強化學習模型產生一股市預測報告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic apparatus for stock market prediction and a method for training a reinforcement learning model thereof are disclosed herein. The method includes: calculating an average Sharpe ratio and a relationship matrix of a plurality of companies in financial report data through a Graph Attention Network; applying the Sharpe ratio, the relationship matrix and the financial report data to a reinforcement learning model to generate an investment list; compressing stock market trading data into trading feature data through a Temporal Convolutional Autoencoder; and applying the trading feature data and the investment list to another reinforcement learning model to generate a stock market prediction report.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">11:儲存器</p>
        <p type="p">13:處理器</p>
        <p type="p">14:輸入/輸出介面</p>
        <p type="p">15:聯網裝置</p>
        <p type="p">17:互聯網</p>
        <p type="p">21:第一強化學習模型</p>
        <p type="p">23:第二強化學習模型</p>
        <p type="p">111:財務報告資料</p>
        <p type="p">113:股市交易資料</p>
        <p type="p">R1:股市預測報告</p>
        <p type="p">U1:使用者裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="422" publication-number="202619597">
    <tif-files tif-type="multi-tif">
      <tif file="113140539.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/85</main-classification>
        <further-classification edition="202501120250102B">H10H20/852</further-classification>
        <further-classification edition="202501120250102B">H10H20/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玟擇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖士福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚怡安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, I-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括相對於第一基板設置的第二基板、設置於第一基板與第二基板之間的第一發光單元，第一發光單元的第一表面具有第一微結構且第一表面遠離第一基板、以及設置於第二基板與第一發光單元的第一表面之間的黏著層。黏著層與第一微結構之間具有第一間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a second substrate disposed relative to a first substrate, a first light-emitting unit disposed between the first substrate and the second substrate, a first microstructure on the first surface of the first light-emitting unit and the first surface away from the first substrate, and an adhesive layer disposed between the second substrate and the first surface of the first light-emitting unit. There is a first gap between the adhesive layer and the first microstructure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電子裝置</p>
        <p type="p">110:第一基板</p>
        <p type="p">120:電路層</p>
        <p type="p">130:第一發光單元</p>
        <p type="p">131:第一微結構</p>
        <p type="p">131A:第一凸起結構</p>
        <p type="p">131B:第一凹入結構</p>
        <p type="p">130T:第一表面</p>
        <p type="p">138:固定膠</p>
        <p type="p">139:像素界定層</p>
        <p type="p">140:第二發光單元</p>
        <p type="p">140T:第二表面</p>
        <p type="p">141:第二微結構</p>
        <p type="p">145:第三發光單元</p>
        <p type="p">145T:第三表面</p>
        <p type="p">146:第三微結構</p>
        <p type="p">150:黏著層</p>
        <p type="p">151:第一間隙</p>
        <p type="p">152:下表面</p>
        <p type="p">153:第二間隙</p>
        <p type="p">154:第三間隙</p>
        <p type="p">180:第二基板</p>
        <p type="p">185:出光表面</p>
        <p type="p">P1:第一像素區</p>
        <p type="p">P2:第二像素區</p>
        <p type="p">P3:第三像素區</p>
        <p type="p">T:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="423" publication-number="202618307">
    <tif-files tif-type="multi-tif">
      <tif file="113140540.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於估算輸入至諧振電路中諧振槽的輸入功率的電子裝置和方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD FOR ESTIMATING INPUT POWER INTO RESONANT TANK IN RESONANT CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01R21/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃明熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MING-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡志丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳意岷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置用以計算輸入至諧振電路中諧振槽的輸入功率，包括帶通濾波器、相位檢測電路、峰值檢測電路，以及處理器。帶通濾波器接收輸入至諧振槽的諧振電流，且對諧振電流進行濾波，產生第一基頻電流。相位檢測電路計算第一基頻電流和諧振槽電壓之間的相位差。峰值檢測電路依據第一基頻電流產生基頻電流峰值。處理器對諧振槽電壓執行快速傅立葉轉換，獲得諧振槽基頻電壓。處理器依據諧振槽基頻電壓、基頻電流峰值，以及相位差，計算輸入功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device used to calculate input power input to a resonant tank in a resonant circuit, includes a bandpass filter, a phase detection circuit, a peak detection circuit, and a processor. The bandpass filter receives a resonant current input to the resonant tank, and filters the resonant current to generate a first fundamental frequency current. The phase detection circuit calculates a phase difference between the first fundamental frequency current and a resonance tank voltage. The peak detection circuit generates a fundamental frequency current peak value based on the first fundamental frequency current. The processor performs a fast Fourier transform on the resonant tank voltage to obtain a resonant tank fundamental frequency voltage. The processor calculates the input power based on the resonant tank fundamental frequency voltage, the fundamental frequency current peak value, and the phase difference.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">102:諧振電路</p>
        <p type="p">104:功率控制區塊電路</p>
        <p type="p">106:閘極驅動電路</p>
        <p type="p">108:帶通濾波器</p>
        <p type="p">110:相位檢測電路</p>
        <p type="p">112:峰值檢測電路</p>
        <p type="p">114:處理器</p>
        <p type="p">116:減法器</p>
        <p type="p">118:功率調節器</p>
        <p type="p">120:脈波頻率調變電路</p>
        <p type="p">
        &lt;i&gt;i&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;rp&lt;/i&gt;
        &lt;/sub&gt;:諧振電流</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;rp&lt;/i&gt;
        &lt;/sub&gt;:諧振槽電壓</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;rp&lt;/i&gt;1&lt;/sub&gt;:諧振槽基頻電壓</p>
        <p type="p">
        &lt;i&gt;i&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;in&lt;/i&gt;
        &lt;/sub&gt;:輸入電流</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;in&lt;/i&gt;
        &lt;/sub&gt;:輸入電壓</p>
        <p type="p">
        &lt;i&gt;i&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;rp,BPF&lt;/i&gt;
        &lt;/sub&gt;:第一基頻電流</p>
        <p type="p">
        &lt;i&gt;I&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;rp,PDC&lt;/i&gt;
        &lt;/sub&gt;:基頻電流峰值</p>
        <p type="p">
        &lt;i&gt;θ&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;v&lt;/i&gt;1-&lt;i&gt;i&lt;/i&gt;1&lt;/sub&gt;:相位差</p>
        <p type="p">
        &lt;i&gt;P&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;r&lt;/i&gt;
        &lt;/sub&gt;:輸入功率</p>
        <p type="p">
        &lt;img align="absmiddle" height="25px" width="21px" file="d10011.TIF" alt="其他非圖式ed10011.png" img-content="character" orientation="portrait" inline="no" giffile="ed10011.png"&gt;
        &lt;/img&gt;:參考輸入功率</p>
        <p type="p">
        &lt;i&gt;G&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;h&lt;/i&gt;
        &lt;/sub&gt;,&lt;i&gt;G&lt;/i&gt;&lt;sub&gt;&lt;i&gt;l&lt;/i&gt;&lt;/sub&gt;:脈波訊號</p>
        <p type="p">
        &lt;i&gt;G&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;oh&lt;/i&gt;
        &lt;/sub&gt;,&lt;i&gt;G&lt;/i&gt;&lt;sub&gt;&lt;i&gt;ol&lt;/i&gt;&lt;/sub&gt;:驅動訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;ac&lt;/i&gt;
        &lt;/sub&gt;:交流電源</p>
        <p type="p">
        &lt;i&gt;D&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;,&lt;i&gt;D&lt;/i&gt;&lt;sub&gt;2&lt;/sub&gt;,&lt;i&gt;D&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;,&lt;i&gt;D&lt;/i&gt;&lt;sub&gt;4&lt;/sub&gt;:二極體</p>
        <p type="p">
        &lt;i&gt;C&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;in&lt;/i&gt;
        &lt;/sub&gt;,&lt;i&gt;C&lt;/i&gt;&lt;sub&gt;&lt;i&gt;rp&lt;/i&gt;&lt;/sub&gt;:電容</p>
        <p type="p">
        &lt;i&gt;L&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;rp&lt;/i&gt;
        &lt;/sub&gt;:電感</p>
        <p type="p">
        &lt;i&gt;Q&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;h&lt;/i&gt;
        &lt;/sub&gt;,&lt;i&gt;Q&lt;/i&gt;&lt;sub&gt;&lt;i&gt;l&lt;/i&gt;&lt;/sub&gt;:電晶體</p>
        <p type="p">
        &lt;i&gt;R&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;eq&lt;/i&gt;
        &lt;/sub&gt;:負載電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="424" publication-number="202617099">
    <tif-files tif-type="multi-tif">
      <tif file="113140546.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適應性推導兩個未知變換矩陣的超音波針導航系統</chinese-title>
        <english-title>ULTRASOUND NEEDLE NAVIGATION SYSTEMS WITH ADAPTIVE DERIVATION FOR TWO UNKNOWN TRANSFORMATION MATRICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A61B18/12</main-classification>
        <further-classification edition="201601120241204B">A61B90/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學醫學院附設醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　裕舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊瀚博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於超音波系統的針導航系統，包括追蹤站、設置於超音波換能器尾部的換能器追蹤器、設置於穿刺針尾部的針追蹤器、針影偵測模組及處理單元。針影偵測模組從偵測到的超音波影像序列中取得量測的針幹座標系的動態序列。處理單元以一系統性方法產生估計的換能器追蹤器與顯影面轉換矩陣、估計的針尖與針追蹤器轉換矩陣，進而產生估計的針幹座標系的動態序列後，透過回測估計的針幹座標系的動態序列與量測的針幹座標系的動態序列的之間的估計誤差損失，而可迭代更新估計的換能器追蹤器與顯影面轉換矩陣及估計的針尖與針追蹤器轉換矩陣，用以逐代降低估計損失，以取得決策的換能器追蹤器與顯影面轉換矩陣及決策的針尖與針追蹤器轉換矩陣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultrasound needle navigation system is provided. The system includes a tracking station, a transducer tracker disposed on the tail of an ultrasound transducer, a needle tracker disposed on the tail of a puncture needle, a needle detection module, and a processing unit. The needle detection module acquires a dynamic series of measured needle shaft coordinate systems from detected ultrasound image sequences of an ultrasound machine. The processing unit uses a systematic method to generate estimated transformation matrices between the transducer tracker and the scanning plane, and estimated transformation matrices between the needle tip and the needle tracker, thereby generating multiple dynamic series of estimated needle shaft coordinate systems. To minimize the estimation loss between the dynamic series of estimated and measured needle shaft coordinate systems, the system iteratively updates the estimated transformation matrices to approach the final transformation matrix between the transducer tracker and the scanning plane, and the final transformation matrix between the needle tip and the needle tracker.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1~A13:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="425" publication-number="202617018">
    <tif-files tif-type="multi-tif">
      <tif file="113140557.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可快速更換發熱源之直立電動無煙烤爐</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A47J37/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃璽儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃璽儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田國健</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可快速更換發熱源之直立電動無煙烤爐，具有一直立式箱體，並於直立式箱體上設有一電動傳動機構，直立式箱體之內部正中央可依實際需求更換不同種類的發熱源，而電動傳動機構用以帶動燒烤食材可圍繞著發熱源進行同步公轉與自轉，使食材燒烤均勻，且當食材在直立式箱體內部空間燒烤時，並未接觸發熱源，燒烤時流下油汁也不會接觸發熱源，而會向下滴落於一盛水滴油盤形成無煙碳烤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:直立式箱體</p>
        <p type="p">111:接電插座</p>
        <p type="p">112:計時器控制開關</p>
        <p type="p">113:溫度控制開關</p>
        <p type="p">114:電源線插頭</p>
        <p type="p">12:容置空間</p>
        <p type="p">13:門板</p>
        <p type="p">134:旋鈕式關門器</p>
        <p type="p">165:金屬質把手</p>
        <p type="p">174:進風口</p>
        <p type="p">175:透明窗口</p>
        <p type="p">18:蝶型螺絲</p>
        <p type="p">21:電動傳動機構</p>
        <p type="p">22:組設座</p>
        <p type="p">224:蓋體</p>
        <p type="p">233:溫度錶</p>
        <p type="p">29:外遮罩</p>
        <p type="p">291:提把</p>
        <p type="p">31:盛水滴油盤</p>
        <p type="p">32:拉把</p>
        <p type="p">41:電熱型加熱管組</p>
        <p type="p">411:電熱管</p>
        <p type="p">412:底座</p>
        <p type="p">413:接電端</p>
        <p type="p">42:木炭爐桶架</p>
        <p type="p">421:桶身</p>
        <p type="p">422:腳架</p>
        <p type="p">423:圓形上蓋</p>
        <p type="p">424:U形勾</p>
        <p type="p">43:瓦斯燃燒爐組</p>
        <p type="p">431:上圓形蓋板</p>
        <p type="p">432:下環片</p>
        <p type="p">433:直立桿</p>
        <p type="p">44:側導流板架</p>
        <p type="p">45:燃燒爐</p>
        <p type="p">451:爐頭</p>
        <p type="p">452:圓形固定板</p>
        <p type="p">453:腳架</p>
        <p type="p">454:承接口</p>
        <p type="p">455:鋼絲軟管</p>
        <p type="p">456:瓦斯罐轉接頭</p>
        <p type="p">71:藍芽喇叭</p>
        <p type="p">72:置杯架</p>
        <p type="p">73:計時器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="426" publication-number="202617510">
    <tif-files tif-type="multi-tif">
      <tif file="113140569.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140569</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車踏板</chinese-title>
        <english-title>BICYCLE PEDAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">B62M3/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台萬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARWI TAIWAN INDUSTRIAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錫輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白政忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, CHENG CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建平</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種自行車踏板，其包括：一踏板主體、一軸組件及一誤差補償組件。該踏板主體包含有一安裝孔，該安裝孔定義有一軸向與一徑向；該軸組件包含有一心軸、至少一軸承與一鎖固件，該心軸沿該軸向穿設於該安裝孔，該至少一軸承套接於該心軸且於該徑向抵靠於該安裝孔之孔壁，該鎖固件螺接於該心軸；該誤差補償組件套設於該心軸，該誤差補償組件包含有一第一墊體、一第二墊體與一彈性體，該第一墊體包含有一板部及一凸垣部，該凸垣部橫向地凸伸於該板部，該板部被夾掣定位於該鎖固件與該心軸之間，該第二墊體設於該凸垣部與該軸組件之間，該彈性體設於該板部與該第二墊體之間；其中，於該軸向上，當該彈性體未被壓縮前，該彈性體係高於該凸垣部，以令該凸垣部與該第二墊體之間形成有一補償間距；其中，於該徑向上，該第二墊體之壁厚係大於二分之一該板部之壁厚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a bicycle pedal, which includes: a pedal body, an axle assembly, and an error compensation assembly. The pedal body includes a mounting hole, which defines an axial direction and a radial direction; the axle assembly includes a spindle, at least one bearing, and a locking component. The spindle is axially inserted into the mounting hole, with the at least one bearing sleeved on the spindle and radially resting against the wall of the mounting hole, while the locking component is threaded onto the spindle . The error compensation assembly is sleeved on the spindle and includes a first spacer, a second spacer, and an elastic member. The first spacer includes a plate section and a protruding rim, with the protruding rim extending laterally from the plate section. section is clamped and positioned between the locking component and the spindle. The second spacer is positioned between the protruding rim and the axle assembly, and the elastic member is positioned between the plate section and the second spacer. In the axial direction, before the elastic member is compressed, it extends higher than the protruding rim, creating a compensation gap between the protruding rim and the second spacer. In the radial direction, the wall thickness of the second spacer is greater than half of the wall thickness of the plate section.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:座體</p>
        <p type="p">21:心軸</p>
        <p type="p">211:非圓形段</p>
        <p type="p">22:軸承</p>
        <p type="p">23:鎖固件</p>
        <p type="p">3:誤差補償組件</p>
        <p type="p">31:第一墊體</p>
        <p type="p">32:第二墊體</p>
        <p type="p">321:非圓形孔</p>
        <p type="p">33:彈性體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="427" publication-number="202617240">
    <tif-files tif-type="multi-tif">
      <tif file="113140571.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗邊劑回收系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B01D3/00</main-classification>
        <further-classification edition="200601120241230B">B01D3/06</further-classification>
        <further-classification edition="200601120241230B">B01D3/14</further-classification>
        <further-classification edition="200601120241230B">B01D5/00</further-classification>
        <further-classification edition="200601120241230B">B01D1/00</further-classification>
        <further-classification edition="200601120241230B">B01D15/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人中技社</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>暉鼎資源管理股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊顯整</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HSIEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芮嘉瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUI, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀茂樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIH, MAW-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林呈叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李豪業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAO-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾堯宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳君一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥縈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁欣慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, HSIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種洗邊劑回收系統及方法，該方法包括：重沸物去除步驟，對含有PGME及PGMEA的廢洗邊劑進行攪拌蒸發，得到除重沸物回收液；初階離子去除步驟，去除該除重沸物回收液中主要的離子，產生初階除離子回收液；低沸物去除步驟，去除初階除離子回收液中包括水分的低沸物，得到除低沸物回收液；分餾步驟，對除低沸物回收液進行蒸餾去除含有PGMEA的混合物，得到含有PGME的分餾回收液；精餾步驟，對分餾回收液進行蒸餾去除有機雜質，得到精餾回收液；閃沸步驟，對精餾回收液進行閃沸去除金屬離子，得到閃沸回收液；過濾步驟，對閃沸回收液過濾去除奈米尺寸以上的微粒，產生過濾回收液；進階離子去除步驟，去除過濾回收液中剩餘的離子，以產生電子級再生PGME。本發明的系統及方法能夠製造出純度達99.99 wt%以上的電子級再生PGME。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:重沸物去除步驟</p>
        <p type="p">S2:初階離子去除步驟</p>
        <p type="p">S3:低沸物去除步驟</p>
        <p type="p">S4:分餾步驟</p>
        <p type="p">S5:精餾步驟</p>
        <p type="p">S6:閃沸步驟</p>
        <p type="p">S7:微米過濾步驟</p>
        <p type="p">S8:奈米過濾步驟</p>
        <p type="p">S9:進階離子去除步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="428" publication-number="202618722">
    <tif-files tif-type="multi-tif">
      <tif file="113140572.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有方向指示之指揮棒裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">G08G1/09</main-classification>
        <further-classification edition="200601120241129B">G01P15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂安生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, AN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂安生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, AN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙元寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係包括一指揮棒結構、一電源供應部、一發光元件、一三維加速度感測器及一處理單元。當指揮棒結構被來回揮動時，三維加速度感測器取得一第一方向原始加速度。處理單元具有一加速度狀態旗標，處理單元係將第一方向原始加速度依序處理成一第一方向加速度及一第一方向速度。當第一方向速度由正轉負或由負轉正時，被定義為一零交越狀態。當加速度狀態旗標由0變1或0變-1，處理單元控制發光元件發亮並持續發亮，直到發生零交越狀態且加速度狀態旗標相對地不為1或不為-1時，則停止發亮。本案兼具可明確看出指示的方向提高安全性，及可直接應用於現有產品相當方便等優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:指揮棒結構</p>
        <p type="p">11:握柄</p>
        <p type="p">12:延伸棒體</p>
        <p type="p">91:使用者</p>
        <p type="p">S1:去程</p>
        <p type="p">S2:回程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="429" publication-number="202617379">
    <tif-files tif-type="multi-tif">
      <tif file="113140579.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140579</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>撓性關節模組</chinese-title>
        <english-title>FLEXIBLE JOINT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25J9/22</main-classification>
        <further-classification edition="200601120241204B">B25J17/02</further-classification>
        <further-classification edition="200601120241204B">B25J13/06</further-classification>
        <further-classification edition="200601120241204B">H02K7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUAN-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊瑞龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JUI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘文敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍兆杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, CHAO-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃竣鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種撓性關節模組包括驅動器、凸輪軸、第一編碼器、馬達與減速機。彈性機構形成於凸輪軸上，彈性機構為一體成型且呈螺旋狀。馬達電性連接驅動器，且連接凸輪軸與第一編碼器。減速機與馬達連接且配置以放大馬達的扭矩。減速機具有第二編碼器。當凸輪軸轉動時，第一編碼器與第二編碼器配置以偵測彈性機構產生的形變位置資訊並將該形變位置資訊回傳到驅動器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flexible joint module includes a driver, a camshaft, a first encoder, a motor, and a reducer. A flexible mechanism is formed on the camshaft. The flexible mechanism is integrally formed as a single piece, and is spiral shaped. The motor is electrically connected to the driver, and connects the camshaft and the first encoder. The reducer is connected to the motor, and is configured to amplify the torque of the motor. The reducer has a second encoder. When the input shaft rotates, the first encoder and the second encoder are configured to detect deformation position information and send the deformation position information back to the driver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:撓性關節模組</p>
        <p type="p">110:驅動器</p>
        <p type="p">120:馬達</p>
        <p type="p">121:引線軸</p>
        <p type="p">123:凸部</p>
        <p type="p">124:第一編碼器</p>
        <p type="p">125:凸輪軸</p>
        <p type="p">126:轉子</p>
        <p type="p">128:定子</p>
        <p type="p">130:減速機</p>
        <p type="p">132:彈性機構</p>
        <p type="p">134:第二編碼器</p>
        <p type="p">140:波發生器</p>
        <p type="p">150:第三編碼器</p>
        <p type="p">160:阻磁環</p>
        <p type="p">171:剎車模組</p>
        <p type="p">172:支撐軸承</p>
        <p type="p">173:止推軸承</p>
        <p type="p">174:減速機後蓋</p>
        <p type="p">176:輸出法蘭</p>
        <p type="p">182:剛輪</p>
        <p type="p">184:柔輪</p>
        <p type="p">F:扭力輸出流線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="430" publication-number="202618610">
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      <tif file="113140585.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140585</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用卷積神經網路模型產生高解析度圖像的方法、優化系統及使用卷積神經網路模型的人機介面</chinese-title>
        <english-title>METHOD OF USING CONVOLUTION NEURAL NETWORK MODEL TO GENERATE HIGH RESOLUTION IMAGE, OPTIMIZING SYSTEM, AND HMI USING THE CONVOLUTION NEURAL NETWORK MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">G06N3/02</main-classification>
        <further-classification edition="200601120250205B">G06T1/40</further-classification>
        <further-classification edition="202001120250205B">G06F30/27</further-classification>
        <further-classification edition="200601120250205B">G06N3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用卷積神經網路模型的方法，包括：由標準卷積層接收特徵圖像；由複數剪枝卷積層接收標準卷積層的第一輸出並產生第二輸出；由多層路徑殘差連接區塊分別使用不同大小的卷積核對輸入進行剪枝處理並產生多個殘差輸出，並且結合所述輸入以及多個殘差輸出做為複數剪枝卷積層之一的輸入，其中多層路徑殘差連接區塊連接在複數剪枝卷積層之間；由上採樣處理層對複數剪枝卷積層的第二輸出進行上採樣處理以產生第三輸出；及，由第一殘差連接層對第三輸出與特徵圖像進行殘差處理以產生高解析度圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of using a CNN model is disclosed and includes following steps: receiving a feature image by a standard-convolutional layer; receiving a first output from the standard-convolutional layer to generate a second output by multiple pruning-convolutional layers; respectively using different sizes of kernels to perform a pruning process to an input and generating multiple residual outputs, and adding the input with the multiple residual outputs to generate an input for one of the multiple pruning-convolutional layers by a multi-path residual connection block that is connected between the multiple pruning-convolutional layers; up-sampling the second output from the multiple pruning-convolutional layers to generate a third output by an up-sampling layer; and, residualizing the third output with the feature image to generate a high resolution image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S91~S94、S921~S925:使用步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="431" publication-number="202617137">
    <tif-files tif-type="multi-tif">
      <tif file="113140591.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼用組成物、隱形眼鏡產品及眼用產品</chinese-title>
        <english-title>OPHTHALMIC COMPOSITION, CONTACT LENS PRODUCT AND OPHTHALMIC PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K31/185</main-classification>
        <further-classification edition="200601120250501B">C07C233/04</further-classification>
        <further-classification edition="200601120250501B">A61K31/726</further-classification>
        <further-classification edition="200601120250501B">A61P27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星歐光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN MEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施攸怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪于傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YU-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種眼用組成物，包含至少一護眼成份以及至少一保濕劑。至少一護眼成份包含一牛磺酸。至少一保濕劑包含一硫酸軟骨素或其鹽類。藉此，透過在本揭示內容的眼用組成物同時添加多種益眼成份，使益眼成份對眼睛的修復及保護產生加成效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an ophthalmic composition including at least one eye-protecting ingredient and at least one moisturizing agent. The at least one eye-protecting ingredient includes a taurine. The at least one moisturizing agent includes a chondroitin sulfate or a salt thereof. Therefore, by adding a variety of eye-benefiting ingredients to the ophthalmic composition of the present disclosure at the same time, the eye-benefiting ingredients have the additive effects on the repair and protection of the eyes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="432" publication-number="202617050">
    <tif-files tif-type="multi-tif">
      <tif file="113140593.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>餐具洗淨系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241229B">A47L15/18</main-classification>
        <further-classification edition="200601120241229B">A47L15/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣城餐飲有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭以忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種餐具洗淨系統，包含一工作箱、一安裝於該工作箱的沖洗單元，及一用以控制該沖洗單元之運作的控制單元。該工作箱包括一界定一清洗空間的箱體，及一可開啟地蓋設於該箱體而封閉該清洗空間的蓋體。該沖洗單元包括一連通於水源的高壓泵浦，及二連接該高壓泵浦，且分別設置於該箱體之底部及該蓋體之內側而朝向該清洗空間的運作模組。每一該運作模組具有一適用於導入用水的入水管、一連通該入水管且沿一縱軸線伸置於該清洗空間的軸管、一沿徑方向延伸並能以該縱軸線為轉軸而轉動的橫管，及多個安裝於該橫管且用以朝向該清洗空間出水的噴頭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工作箱</p>
        <p type="p">10:箱體</p>
        <p type="p">11:蓋體</p>
        <p type="p">2:沖洗單元</p>
        <p type="p">21:高壓泵浦</p>
        <p type="p">221:入水管</p>
        <p type="p">23:加熱模組</p>
        <p type="p">3:劑料導入單元</p>
        <p type="p">31:劑料桶</p>
        <p type="p">310:儲存空間</p>
        <p type="p">4:控制單元</p>
        <p type="p">41:操作介面</p>
        <p type="p">42:控管模組</p>
        <p type="p">S:水源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="433" publication-number="202618257">
    <tif-files tif-type="multi-tif">
      <tif file="113140594.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>採用無人機之風機葉片的巡檢方法及其系統</chinese-title>
        <english-title>AN INSPECTION METHOD FOR BLADES OF A WIND TURBINE USING A DRONE AND A SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01N21/95</main-classification>
        <further-classification edition="202301120241204B">B64U10/14</further-classification>
        <further-classification edition="202301320241204B">B64U101/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鍏晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭順元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳碩彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種採用無人機之風機葉片的巡檢方法，適用於對一待檢風機執行巡檢，該待檢風機包括一基樁及一轉動模組，該轉動模組具有一軸心件，及至少三自該軸心件等角向外延伸的葉片。所述採用無人機之風機葉片的巡檢方法包含一使該待檢風機停止運轉的停機步驟、一使該無人機環繞該待檢風機之一基樁而拍攝建構一初始模型的建模步驟、一該統整步驟是將該初始模型與一地圖模組整合為一個三維路徑模組的統整步驟、一依照該三維路徑模組規劃該無人機之一飛行路徑的規劃步驟，及一使該無人機依照該飛行路徑自動飛行並巡檢該待檢風機的執行步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection method for s blades of a wind turbine adopting a drone is adapted to perform inspection on a fan to be inspected. The wind turbine to be inspected includes a pile and a rotation module having an axis, and at least three blades extending outwardly at equal angles from the axis.The inspection method for blades of a wind turbine using a drone comprises a shutdown step of stopping operation of the wind turbine to be inspected, a modeling step of modeling an initial model by photographing the drone around a pile of the wind turbine to be inspected, an integration step of integrating the initial model and a map module into a three - dimensional path module, a planning step of planning a flight path of the drone according to the three - dimensional path module, and an operating step of automatically flying and inspecting the wind turbine to be inspected by the drone according to the flight path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:停機步驟</p>
        <p type="p">12:建模步驟</p>
        <p type="p">13:統整步驟</p>
        <p type="p">14:規劃步驟</p>
        <p type="p">15:執行步驟</p>
        <p type="p">151:巡查子步驟</p>
        <p type="p">152:回報子步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="434" publication-number="202617369">
    <tif-files tif-type="multi-tif">
      <tif file="113140595.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭力扳手裝置</chinese-title>
        <english-title>TORQUE WRENCH APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">B25B23/142</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瞬豐實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATATAKITOYO TOOL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳逸民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扭力扳手裝置，包含一扭力扳手本體、一扭力扳手頭部、一微控制器及一扭力提示選擇電路。該扭力提示選擇電路被配置為傳送一扭力提示選擇訊號至該微控制器；該微控制器被配置為接收該扭力提示選擇訊號以提供一扭力提示下限數值及一扭力提示上限數值；該扭力提示上限數值係大於該扭力提示下限數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A torque wrench apparatus includes a torque wrench body, a torque wrench head, a microcontroller, and a torque reminder selection circuit. The torque reminder selection circuit is configured to transmit a torque reminder selection signal to the microcontroller. The microcontroller is configured to receive the torque reminder selection signal to provide a torque reminder lower limit value and a torque reminder upper limit value. The torque reminder upper limit value is greater than the torque reminder lower limit value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:扭力扳手裝置</p>
        <p type="p">102:扭力扳手本體</p>
        <p type="p">104:扭力扳手頭部</p>
        <p type="p">106:微控制器</p>
        <p type="p">108:扭力提示選擇電路</p>
        <p type="p">L0:扭力提示下限數值</p>
        <p type="p">S0:扭力提示選擇訊號</p>
        <p type="p">U0:扭力提示上限數值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="435" publication-number="202619540">
    <tif-files tif-type="multi-tif">
      <tif file="113140599.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高電子遷移率電晶體之半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE OF HIGH ELECTRON MOBILITY TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D62/10</main-classification>
        <further-classification edition="202501120250102B">H10D62/80</further-classification>
        <further-classification edition="202501120250102B">H10D48/00</further-classification>
        <further-classification edition="202501120250102B">H10D30/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商海珀電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIPER SEMICONDUCTOR INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林伯融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啟桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖和信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於高電子遷移率電晶體之半導體結構，包括基板、成核層、超晶格層、第一漸變層、第二漸變層、耐壓層、通道層、及阻障層。成核層位於基板上，超晶格層位於成核層上，其中超晶格層由高鋁層和低鋁層交替組成，且交替組成重複排列複數次。超晶格層平均鋁成分為70%至90%。第一漸變層位於該晶格層上，其中第一漸變層平均鋁成分為40%至70%。第二漸變層位於第一漸變層上，其中第二漸變層平均鋁成分為30%至40%。耐壓層位於第二漸變層上，通道層位於耐壓層上，阻障層位於通道層上，其中成核層至阻障層的厚度範圍為700nm至3000nm之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate, a nucleation layer, a super lattice layer, a first grading layer, a second grading layer, a voltage-resistant layer, a channel layer, and a barrier layer. The nucleation layer locates between the substrate and the super lattice layer. The super lattice layer is alternately composed of a high aluminum layer and a low aluminum layer. The average aluminum composition of the super lattice layer is 70% to 90%. The first grading layer locates on the lattice layer. The average aluminum composition of the first grading layer is 40% to 70%. The second grading layer locates between the first grading layer and the voltage-resistant layer. The average aluminum composition of the second grading layer is 30% to 40%. The channel layer locates between the voltage sustaining layer and the barrier layer. The thickness between the nucleation layer and the barrier layer ranges from 700nm to 3000nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體結構</p>
        <p type="p">10:基板</p>
        <p type="p">20:成核層</p>
        <p type="p">30:超晶格層</p>
        <p type="p">31:高鋁層</p>
        <p type="p">32:低鋁層</p>
        <p type="p">41:第一漸變層</p>
        <p type="p">42:第二漸變層</p>
        <p type="p">50:耐壓層</p>
        <p type="p">60:通道層</p>
        <p type="p">70:阻障層</p>
        <p type="p">H、h1、h2、h3:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="436" publication-number="202619496">
    <tif-files tif-type="multi-tif">
      <tif file="113140601.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140601</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電阻式記憶體結構及其製作方法</chinese-title>
        <english-title>RESISTIVE MEMORY STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241104B">H10B63/00</main-classification>
        <further-classification edition="202301120241104B">H10N70/00</further-classification>
        <further-classification edition="202301120241104B">H10N70/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭友勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　昱位</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　圓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施　健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電阻式記憶體結構，包含：基底；記憶體堆疊結構，設置於該基底上，其中，該記憶體堆疊結構包含底電極層、設置於該底電極層上的切換層、設置於該切換層上的頂電極層，以及設置於該記憶體堆疊結構側壁上的氧化保護層；間隙壁，位於該記憶體堆疊結構周圍，其中，該間隙壁覆蓋該氧化保護層；以及介電緩衝層，設置於該間隙壁上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resistive memory structure includes a substrate and a memory stack structure disposed on the substrate. The memory stack structure includes a bottom electrode layer, a switching layer disposed on the bottom electrode layer, a top electrode layer disposed on the switching layer, and an oxidized protection layer disposed on a sidewall of the memory stack structure. A spacer is located around the memory stack structure. The spacer covers the oxidized protection layer. A dielectric buffer layer is disposed on the spacer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電阻式記憶體結構</p>
        <p type="p">100:基底</p>
        <p type="p">110:金屬層間介電(IMD)層</p>
        <p type="p">120:上蓋層</p>
        <p type="p">130:矽氧層</p>
        <p type="p">140:金屬間介電(IMD)層</p>
        <p type="p">210:下金屬導線層</p>
        <p type="p">220:短通孔</p>
        <p type="p">310:底電極層</p>
        <p type="p">320:切換層</p>
        <p type="p">321:TaO&lt;sub&gt;x&lt;/sub&gt;層</p>
        <p type="p">322:Ta&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;層</p>
        <p type="p">330:銥金屬層</p>
        <p type="p">340:頂電極層</p>
        <p type="p">340a:上表面</p>
        <p type="p">340s:TaNO&lt;sub&gt;x&lt;/sub&gt;層</p>
        <p type="p">340t:TaN層</p>
        <p type="p">410:介電緩衝層</p>
        <p type="p">BL:阻障層</p>
        <p type="p">CL:銅層</p>
        <p type="p">MS:記憶體堆疊結構</p>
        <p type="p">MV:導電通孔</p>
        <p type="p">PL:氧化保護層</p>
        <p type="p">SP:間隙壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="437" publication-number="202617450">
    <tif-files tif-type="multi-tif">
      <tif file="113140605.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車花轂傳動結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B60B27/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬紳股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOSEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳青樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車花轂傳動結構，其包括：一花轂本體，該花轂本體一端係形成一開放之容置空間，該容置空間中心係軸向穿出一中心軸，且該容置空間係裝設一連動環，該連動環之一端表面設一連動環齒；一齒盤座，係與該花轂本體組合作動，該齒盤座一端凹設一契合空間，該契合空間係軸向組設一驅動環，該驅動環之一端係往內凹設一組合槽，該組合槽係緊密組設一以輕質材料製成之第一吸震環，又該擋壁外端表面設一驅動環齒與該連動環之連動環齒離合作動；據此，該第一吸震環係用以減緩該驅動環的震動，從而提升該驅動環之穩定性，另透過該第一吸震環之輕質材料達到輕量化目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:花轂本體</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:中心軸</p>
        <p type="p">13:連動環</p>
        <p type="p">133:連動環齒</p>
        <p type="p">135:穿設孔</p>
        <p type="p">137:工具凸頭</p>
        <p type="p">14:第二吸震環</p>
        <p type="p">20:齒盤座</p>
        <p type="p">21:契合空間</p>
        <p type="p">211:契合環齒</p>
        <p type="p">22:驅動環</p>
        <p type="p">221:契接環齒</p>
        <p type="p">223:穿孔</p>
        <p type="p">225:驅動環齒</p>
        <p type="p">23:第一吸震環</p>
        <p type="p">24:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="438" publication-number="202617451">
    <tif-files tif-type="multi-tif">
      <tif file="113140606.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胎壓偵測器系統中自動判斷合適定位訊號強度之方法</chinese-title>
        <english-title>A METHOD FOR AUTOMATICALLY DETERMINING THE STRENGTH OF AN APPROPRIATE POSITIONING SIGNAL IN A TIRE PRESSURE DETECTOR SYSTEM.</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B60C23/04</main-classification>
        <further-classification edition="200601120241204B">G01L17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>系統電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYSGRATION LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種胎壓偵測器系統中自動判斷合適定位訊號強度之方法，其包括有以下步驟：訊號接收器依據安裝於車體位置設定前後輪判定條件；車體起步時訊號接收器接收各胎壓偵測器多個角度位置的訊號強度回饋，訊號接收器依據前述各胎壓偵測器多個角度位置的訊號強度回饋固定各胎壓偵測器的訊號強度讀取最佳角度位置，以此達到改善以往利用胎壓偵測器回傳信號的強度來判斷胎壓偵測器方位的定位方式時，存在於特定情況時前後輪位置會產生誤判的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for automatically determining the strength of an appropriate positioning signal in a tire pressure detector system. The following steps are included: the signal receiver sets front and rear wheel determining conditions according to the position of the vehicle body; the signal receiver receives the signal strength feedback at a plurality of angular positions of each tire pressure detector, and the signal receiver feeds back the signal strength of each tire pressure detector to read the optimal angular position according to the signal intensity of the plurality of angular positions of each tire pressure detector, so as to solve the problem of misjudgment when the position of the tire pressure detector is determined by using the strength of the return signal of the tire pressure detector in the prior art.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:訊號接收器</p>
        <p type="p">2:胎壓偵測器</p>
        <p type="p">100:車體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="439" publication-number="202618109">
    <tif-files tif-type="multi-tif">
      <tif file="113140607.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140607</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>門窗角壁面防裂組件結構之改良(一)</chinese-title>
        <english-title>IMPROVED ANTI-CRACK COMPONENT STRUCTURE FOR CORNER WALLS OF DOORS AND WINDOWS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">E04C5/03</main-classification>
        <further-classification edition="200601120241118B">E06B1/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林權萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林權萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種門窗角壁面防裂組件結構之改良，係主要使數間隔設置之防裂元件以固定桿穿設固接，且於該防裂元件其缺口至少一側處連接有一與該防裂元件其缺口形狀相對應之阻力片，藉此阻力片設置即可增加與門、窗框角隅處之牆壁結構體的握裹面積及結合穩固性，以提高門、窗框角隅之牆壁結構體受力最前端處的抗裂強度，另地震等所產生應力傳遞至阻力片時，係可受到阻力片的阻擋，以改變應力傳導方向及產生對外力作用的對抗性，而使外力對應力端的作用減緩並分散，據此，俾達到提高門、窗框角隅處之牆壁結構體其受力最前端處的應力對抗性能與抗裂性能，進而有效保護門、窗框角隅之牆壁結構體其受力最前端表層於地震或其他因素受力發生時不致發生龜裂或微龜裂等效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an improved anti-crack component structure for corner walls of doors and windows. It primarily involves multiple anti-crack elements spaced apart and fixedly connected by a fastening rod. Additionally, at least one side of a notch in the anti-crack element is connected to a resistance plate that corresponds in shape to the notch. The installation of the resistance plate increases the wrapping area and bonding stability with the wall structure at the corner of the door or window frame, enhancing the crack resistance strength at the most stressed point of the wall structure in the corner of the door or window frame. Furthermore, when stress caused by events such as earthquakes is transferred to the resistance plate, it is blocked by the resistance plate, which alters the direction of stress transmission and generates resistance to the external force. This helps to slow down and disperse the effect of external forces on the stressed area. Consequently, the design improves the stress resistance and crack resistance at the most stressed point of the wall structure in the corners of door or window frames, effectively protecting the surface layer at the most stressed point from cracking or micro-cracking under the influence of earthquakes or other forces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防裂元件</p>
        <p type="p">11:第一片部</p>
        <p type="p">111:端部邊緣</p>
        <p type="p">12:第二片部</p>
        <p type="p">121:端部邊緣</p>
        <p type="p">13:缺口</p>
        <p type="p">14:固定孔</p>
        <p type="p">15:鏤空孔</p>
        <p type="p">16:作業區間</p>
        <p type="p">161:縱向邊線</p>
        <p type="p">162:橫向邊線</p>
        <p type="p">17:定位孔</p>
        <p type="p">2:固定桿</p>
        <p type="p">3:定位桿</p>
        <p type="p">31:尖銳端</p>
        <p type="p">32:止擋端</p>
        <p type="p">4:阻力片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="440" publication-number="202618321">
    <tif-files tif-type="multi-tif">
      <tif file="113140608.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140608</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片</chinese-title>
        <english-title>CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01R31/3177</main-classification>
        <further-classification edition="200601120241204B">H03K19/0175</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉博偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏志杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHIH CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片包含配置引腳、內部上拉電阻、內部下拉電阻、邏輯偵測電路以及配置檢測電路。配置引腳經由外部電阻電性連接參考電壓端。配置檢測電路用以將邏輯偵測電路(邏輯偵測電路可以是數位邏輯緩充器，比較器或其他可用於偵測邏輯位準的電路)的輸入端連接至配置引腳，且更用以進行下列步驟。將內部上拉電阻以及內部下拉電阻與配置引腳斷連，以使邏輯偵測電路輸出第零檢測邏輯值。將內部上拉電阻以及內部下拉電阻依序連接配置引腳，以使邏輯偵測電路輸出複數個檢測邏輯值。根據第零檢測邏輯值以及該複數個檢測邏輯值決定配置向量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip includes a configuration pin, an inner pull-up resistor, an inner pull-down resistor, a logic-level detection circuit (a logic-level detection circuit can be a digital logic buffer, comparator, or other circuits which detect logic levels) and a configuration detection circuit. The configuration pin is electrically connected to a reference voltage terminal through an external resistor. The configuration detection circuit is configured to connect an input terminal of the logic-level detection circuit to the configuration pin, and is further configured to perform the following steps. Disconnect the inner pull-up resistor and the inner pull-down resistor from the configuration pin to output a 0-th detection logic value by the logic-level detection circuit. Sequentially connect the inner pull-up resistor and the inner pull-down resistor to the configuration pin to output a plurality of detection logic values by the logic-level detection circuit. A configuration vector is determined according to the 0-th detection logic value and the detection logic values.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:配置檢測系統</p>
        <p type="p">102:配置引腳</p>
        <p type="p">110:晶片</p>
        <p type="p">120:配置檢測電路</p>
        <p type="p">122:邏輯電路</p>
        <p type="p">124:輸出驅動器</p>
        <p type="p">126:邏輯偵測電路</p>
        <p type="p">R0,R1:電阻</p>
        <p type="p">Rext0,Rext1:外部電阻</p>
        <p type="p">S0,S1,S2,S3:開關</p>
        <p type="p">V&lt;sub&gt;LL&lt;/sub&gt;:檢測邏輯值</p>
        <p type="p">ADJ_R0,ADJ_R1:控制訊號</p>
        <p type="p">EN_R0,EN_R1,EN_OD,EN_LB:控制訊號</p>
        <p type="p">VDD&lt;sub&gt;int1&lt;/sub&gt;,VDD&lt;sub&gt;ext1&lt;/sub&gt;,VDD&lt;sub&gt;int0&lt;/sub&gt;,VDD&lt;sub&gt;ext0&lt;/sub&gt;:參考電壓端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="441" publication-number="202619212">
    <tif-files tif-type="multi-tif">
      <tif file="113140609.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電控盤之防爆結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">H02B1/015</main-classification>
        <further-classification edition="200601120241128B">H02B1/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台映電業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIE IN ELECTRICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施忠映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電控盤之防爆結構，其包含有一防爆電控盤，防爆電控盤設有一控溫裝置與一出風部，其中，控溫裝置設有一溫度感知器以檢測防爆電控盤的溫度，當溫度感知器偵測溫度升高時啟動控溫裝置幫助降溫，控溫裝置內設有一冷卻器，冷卻器設有一渦流產生室，渦流產生室與一進氣閥連接，進氣閥以溫度感知器控制輸送壓縮空氣進入渦流產生室沿其內側表面產生渦流，渦流透過離心力作用形成冷風與熱風，冷風透過一冷風出口經逆止閥進入防爆電控盤內幫助降溫，熱風透過冷卻器之一熱風出口排出，防爆箱內的空氣可經一逆止閥由出風部排出。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):防爆電控盤</p>
        <p type="p">(11):防爆箱</p>
        <p type="p">(111A):第一逆止閥</p>
        <p type="p">(111B):第二逆止閥</p>
        <p type="p">(12):電控盤本體</p>
        <p type="p">(20):控溫裝置</p>
        <p type="p">(201):溫度感知器</p>
        <p type="p">(23):入氣管</p>
        <p type="p">(30):出風部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="442" publication-number="202619327">
    <tif-files tif-type="multi-tif">
      <tif file="113140610.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測未關機狀態的系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DETECTING UN-SHUTDOWN STATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L43/08</main-classification>
        <further-classification edition="201901120250203B">G06F1/3209</further-classification>
        <further-classification edition="200601120250203B">H04L12/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳賜賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李珮綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PEI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種偵測未關機狀態的系統，包括電子裝置、網路設備、伺服器。網路設備用以取得對應未關機之電子裝置的位址資料。伺服器根據對應網路設備的權限資料取得位址資料，以及根據位址資料送出指令以偵測電子裝置並取得回應結果。其中當回應結果指示電子裝置未關機時，透過伺服器根據位址資料傳送處理指令至對應的電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for detecting un-shutdown states, including electrical devices, a network equipment, and a server. The network equipment is configured to get address data of the electrical devices corresponding to the un-shutdown states. The server gets the address data based on authority data of the corresponding network equipment, and sends commands based on the address data to detect the electrical devices and gets responses. When the responses indicate that the electrical devices are not shut down, processing commands are sent via the server to the corresponding electrical devices based on the address data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:偵測未關機狀態的系統</p>
        <p type="p">1011:電子裝置</p>
        <p type="p">101H:電子裝置</p>
        <p type="p">101K:電子裝置</p>
        <p type="p">101N:電子裝置</p>
        <p type="p">102:網路設備</p>
        <p type="p">103:伺服器</p>
        <p type="p">1031:資料庫</p>
        <p type="p">1032:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="443" publication-number="202618674">
    <tif-files tif-type="multi-tif">
      <tif file="113140611.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>教學系統及其操作方法</chinese-title>
        <english-title>LEARNING SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241129B">G06Q50/20</main-classification>
        <further-classification edition="200601120241129B">G09B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓良紳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOH, LEONG SENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊雅如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YA-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭靖淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范秉逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, BING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種教學系統的操作方法，包括：藉由語言模型產生教學大綱；對教學大綱輸入反饋信號，並依據反饋信號選擇教學大綱；依據教學大綱產生影片資料以及網站資料；藉由語言模型對影片資料及網站資料產生評分結果；以及依據評分結果產生教學內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating method of a learning system, comprising: generating a learning outline by a language module; inputting a feedback signal to the learning outline, and selecting a learning outline based on the feedback signal; generating a video data and a website data based on the leaning outline; generating a scoring result to the video data and the website data by the language module; and generating a learning content based on the scoring result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:流程圖</p>
        <p type="p">201~210:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="444" publication-number="202618116">
    <tif-files tif-type="multi-tif">
      <tif file="113140614.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140614</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>門窗角壁面防裂組件結構之改良(二)</chinese-title>
        <english-title>IMPROVED ANTI-CRACK COMPONENT STRUCTURE FOR CORNER WALLS OF DOORS AND WINDOWS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">E06B1/62</main-classification>
        <further-classification edition="200601120241118B">E04C5/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林權萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林權萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種門窗角壁面防裂組件結構之改良，係主要使數間隔設置之防裂元件以固定桿穿設固接，又使一加固單元之二加固片分別設於固定桿二端，且使二加固片間之抗震片跨設於數防裂元件之缺口處，另於該防裂元件形成其缺口的二側邊分別成型有一卡槽，以與抗震片二側端緣所設卡勾對應卡掣結合，藉此，以達到將抗震片與防裂元件簡便組裝效果，另利用該加固單元的設置係可增加與門、窗框角隅之牆壁結構體的握裹面積及應力對抗性能與抗裂強度，進而達到有效防止門、窗框角隅處之牆壁結構體及其表面粉刷層發生微龜裂等效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an improved anti-crack component structure for corner walls of doors and windows. It primarily involves multiple anti-crack elements spaced apart and fixedly connected by a fastening rod. Additionally, two reinforcement plates of a reinforcing unit are respectively installed at both ends of the fastening rod, with a shock-resistant plate arranged between two reinforcement plates and spanning across a notch of the multiple anti-crack elements. Each of the two sides forming the notch in the anti-crack element is respectively molded with a slot, corresponding to hooks on the two side edges of the shock-resistant plate to securely engage. This design achieves a simple assembly of the shock-resistant plate with the anti-crack elements. Moreover, the reinforcing unit increases the wrapping area and stress resistance, enhancing the crack resistance strength of the wall structure at the corners of the door or window frames. As a result, it effectively prevents micro-cracking in the wall structure and the surface plaster layer at the corners of door and window frames.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防裂元件</p>
        <p type="p">11:第一片部</p>
        <p type="p">111:端部邊緣</p>
        <p type="p">112:第一側邊</p>
        <p type="p">113:第一卡槽</p>
        <p type="p">12:第二片部</p>
        <p type="p">121:端部邊緣</p>
        <p type="p">122:第二側邊</p>
        <p type="p">123:第二卡槽</p>
        <p type="p">13:第一缺口</p>
        <p type="p">14:第一固定孔</p>
        <p type="p">15:鏤空孔</p>
        <p type="p">16:作業區間</p>
        <p type="p">161:縱向邊線</p>
        <p type="p">162:橫向邊線</p>
        <p type="p">17:第二固定孔</p>
        <p type="p">18:定位孔</p>
        <p type="p">2:固定桿</p>
        <p type="p">21:第一固定桿</p>
        <p type="p">22:第二固定桿</p>
        <p type="p">3:定位桿</p>
        <p type="p">31:尖銳端</p>
        <p type="p">32:止擋端</p>
        <p type="p">4:加固單元</p>
        <p type="p">41:加固片</p>
        <p type="p">411:穿孔</p>
        <p type="p">412:第一透孔</p>
        <p type="p">413:崁縫加固部</p>
        <p type="p">42:抗震片</p>
        <p type="p">421:第二透孔</p>
        <p type="p">422:第一卡勾</p>
        <p type="p">423:第二卡勾</p>
        <p type="p">424:凸條</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="445" publication-number="202619097">
    <tif-files tif-type="multi-tif">
      <tif file="113140616.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子結構及其製法</chinese-title>
        <english-title>ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">H01L23/488</main-classification>
        <further-classification edition="200601120241129B">H01L23/28</further-classification>
        <further-classification edition="200601120241129B">H01L21/60</further-classification>
        <further-classification edition="200601120241129B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宣人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSUAN JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子結構及其製法，主要在電子主體之第一側及第二側上分別形成有複數第一導電凸塊及複數第二導電凸塊，並於設有複數第一導電凸塊之第一側上形成強化層，且令各該第一導電凸塊之高度大於該強化層之厚度，使各該第一導電凸塊突出外露於該強化層，以藉由該強化層減少電子結構翹曲問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic structure and manufacturing method thereof, which mainly form a plurality of first conductive bumps and a plurality of second conductive bumps on a first side and a second side of an electronic body respectively, and a reinforcement layer is formed on the first side with a plurality of first conductive bumps, wherein the height of each first conductive bump is greater than the thickness of the reinforcement layer, so that each first conductive bump protrudes and is exposed to the reinforcement layer, so as to reduce warpage issues of the electronic structure through the reinforcement layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子結構</p>
        <p type="p">20:電子主體</p>
        <p type="p">20a:第一側</p>
        <p type="p">20b:第二側</p>
        <p type="p">21:第一導電凸塊</p>
        <p type="p">22:第二導電凸塊</p>
        <p type="p">23:強化層</p>
        <p type="p">27:第三承載件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="446" publication-number="202619069">
    <tif-files tif-type="multi-tif">
      <tif file="113140617.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及電子結構</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">H01L23/29</main-classification>
        <further-classification edition="200601120241129B">H01L23/367</further-classification>
        <further-classification edition="200601120241129B">H01L23/373</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岱霏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DAI FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李權舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUAN-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧汶瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, WEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪良易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LIANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及電子結構，其中，該電子封裝件包括有承載件、設於該承載件上之電子元件、透過導熱介面材接置於該電子元件上之散熱件、設於電子元件上並與該導熱介面材相連接之晶背金屬層以及設於導熱介面材與晶背金屬層間之奈米線陣列金屬層，以利用該奈米線陣列金屬層之粗糙表面限制導熱介面材相對晶背金屬層位移，避免導熱介面材因偏移造成散熱件與電子元件結合性不佳，而影響電子封裝件的散熱效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package and electronic structure, wherein the electronic package includes a carrier structure, an electronic component provided on the carrier structure, a heat dissipation structure connected to the electronic component through a thermal interface material, a back side metallization disposed on the electronic component and connected to the thermal interface material, and a nano wire array metal disposed between the back side metallization and the thermal interface material. The invention use the rough surface of the nano wire array metal to limit the displacement of the thermal interface material relative to the back side metallization, thereby preventing the heat dissipation structure from being poorly integrated with the electronic component due to deviation of the thermal interface material, thus affecting the heat dissipation efficiency of the electronic package.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子封裝件</p>
        <p type="p">21:承載件</p>
        <p type="p">22:電子元件</p>
        <p type="p">22a:作用面</p>
        <p type="p">22b:非作用面</p>
        <p type="p">220:導電凸塊</p>
        <p type="p">23:散熱件</p>
        <p type="p">231:頂片</p>
        <p type="p">232:支撐腳</p>
        <p type="p">24:導熱介面材</p>
        <p type="p">25:晶背金屬層</p>
        <p type="p">26:奈米線陣列金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="447" publication-number="202619071">
    <tif-files tif-type="multi-tif">
      <tif file="113140618.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其製法</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250219B">H01L23/31</main-classification>
        <further-classification edition="200601120250219B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁家圃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHIA-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡琨昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯仲禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其製法，主要在一承載結構上接置一承載板，以於該承載板上設置第一光電裝置，同時在該承載結構上形成有凹槽，以於該凹槽中設置第二光電裝置，藉由增設光電裝置之數量，以提昇每秒資訊傳輸量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package and manufacturing method thereof, wherein a carrier plate is connected to a carrier structure to set a first optoelectronic device on the carrier plate. At the same time, a groove is formed on the carrier structure to set a second optoelectronic device to increase the amount of information transmission per second by increasing the number of optoelectronic devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子封裝件</p>
        <p type="p">20:承載結構</p>
        <p type="p">200:凹槽</p>
        <p type="p">21:承載板</p>
        <p type="p">22:電子元件</p>
        <p type="p">23:第一光電裝置</p>
        <p type="p">24:第二光電裝置</p>
        <p type="p">240:封裝結構</p>
        <p type="p">241:半導體元件</p>
        <p type="p">242:光元件</p>
        <p type="p">26:光纖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="448" publication-number="202618648">
    <tif-files tif-type="multi-tif">
      <tif file="113140624.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140624</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防洗錢監控系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241130B">G06Q40/00</main-classification>
        <further-classification edition="201201120241130B">G06Q40/04</further-classification>
        <further-classification edition="202301120241130B">G06Q10/0635</further-classification>
        <further-classification edition="201301120241130B">G06F21/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國信託商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CTBC BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江恭賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱冠燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, KUAN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏伯宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, BO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白永傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝思宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠微</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何盈蒨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃婧寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林旻憶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳儀庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李晨渝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防洗錢監控系統及其方法。該防洗錢監控系統能與一外部資料庫伺服器及一終端電腦裝置通訊，並包含一通訊單元、一處理單元及一儲存單元。該處理單元判定一當前時間達一預定時間點，根據該動態帳戶資料的交易記錄產生一當前防洗錢資料，該當前防洗錢資料包括至少一當前防洗錢表徵，該處理單元判斷至少一防洗錢表徵與該至少一當前防洗錢表徵相符時，根據一基本資料透過該通訊單元自該外部資料庫伺服器取得一對應於該客戶的外部客戶資訊，根據該基本資料及該外部客戶資訊產生一監控報告儲存於該儲存單元及傳送至該終端電腦裝置一結案通知。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:防洗錢監控系統</p>
        <p type="p">1:通訊單元</p>
        <p type="p">2:處理單元</p>
        <p type="p">3:儲存單元</p>
        <p type="p">4:外部資料庫伺服器</p>
        <p type="p">5:終端電腦裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="449" publication-number="202618283">
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      <tif file="113140627.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618283</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種載台切換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">G01R1/02</main-classification>
        <further-classification edition="200601120241128B">G01R31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商無錫艾方芯動自動化設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林裕升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱創先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種載台切換裝置，於機台內的平台上設有以隔板所區隔出的測試室及準備室，載台切換裝置設置於兩室相鄰區域，包括隧道殼體、軌道組、第一載台、移動機構、門件、第二載台及升降機構，隧道殼體設置於平台上且內部空間經第一開口與測試室連通，經第二開口與準備室連通，軌道組設置於平台上且位於隧道殼體及測試室的空間內，第一載台與第二載台設置於軌道組上，門件設置於第二載台上且受升降機構驅動上升而將第二開口封閉，另欲切換時，門件先降下，再由移動機構帶動設置於軌道組上的第一載台推開第二載台使其位於第二開口下方，藉此達到位置切換及減少乾燥空氣流出的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:平台</p>
        <p type="p">14:隔板</p>
        <p type="p">20:載台切換裝置</p>
        <p type="p">21:隧道殼體</p>
        <p type="p">211:第一開口</p>
        <p type="p">212:第二開口</p>
        <p type="p">22:軌道組</p>
        <p type="p">221:導軌</p>
        <p type="p">23:第一載台</p>
        <p type="p">231:連接件</p>
        <p type="p">24:移動機構</p>
        <p type="p">25:門件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="450" publication-number="202619235">
    <tif-files tif-type="multi-tif">
      <tif file="113140628.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達之防振裝置與防振墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02K5/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新典自動化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORM PACIFIC AUTOMATION CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋詠程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏景元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達之防振裝置，用以將該馬達定位於一基座上，其中，該馬達包含一主體與二凸耳，該二凸耳連接於該主體的一外周面，該防振裝置包含二防振墊，各該防振墊由彈性材料製成且具有一固定部及一緩衝部，該固定部包含一固定孔供安裝於該基座，該緩衝部設置於該固定部的一側，該緩衝部具有一貼合面及一凹槽，該貼合面供與該馬達之該主體的該外周面接觸，該凹槽自該貼合面凹入形成且供該馬達的各該凸耳插設。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:防振裝置</p>
        <p type="p">10,10A:防振墊</p>
        <p type="p">M:馬達</p>
        <p type="p">M11:外周面</p>
        <p type="p">B:基座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="451" publication-number="202618545">
    <tif-files tif-type="multi-tif">
      <tif file="113140631.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置控制方法與電子裝置</chinese-title>
        <english-title>DEVICE CONTROL METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G06F9/22</main-classification>
        <further-classification edition="201801120241230B">G06F9/44</further-classification>
        <further-classification edition="200601120241230B">G06F3/14</further-classification>
        <further-classification edition="200601120241230B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚勝雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, SHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置控制方法與電子裝置。所述方法包括：運行應用程式；取得對應於應用程式的媒體特徵資訊，其中媒體特徵資訊包括對應於應用程式的影像特徵資訊與聲音特徵資訊的至少其中之一；透過電子裝置的通訊電路取得通知訊息；以及在運行應用程式的期間，根據媒體特徵資訊與通知訊息呈現提示訊息，其中提示訊息帶有對應於通知訊息的訊息內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device control method and an electronic device are disclosed. The method includes: obtaining media feature information corresponding to an application, wherein the media feature information includes at least one of image feature information and voice feature information corresponding to the application; obtaining, through a communication circuit of the electronic device, a notification message; during a period when the application is executed, presenting a prompt message according to the media feature information and the notification message, wherein the prompt message carries message content corresponding to the notification message.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501~S504:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="452" publication-number="202619466">
    <tif-files tif-type="multi-tif">
      <tif file="113140632.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>定位模組</chinese-title>
        <english-title>POSITIONING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K13/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達運精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕縢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YITENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種定位模組，適用於運輸裝置，運輸裝置適於運輸板材，定位模組包含多個定位結構，每一個定位結構包含支撐部、襯套、導柱、彈簧、樞軸及導輪。支撐部包含相對的頂端及底端。襯套連接於支撐部的頂端，襯套具有連通的第一開口及第二開口。導柱可作動地穿設過第一開口及第二開口，且至少部分導柱突出於第一開口，突出的部分導柱上形成有第一擋止部。彈簧套設於突出的部分導柱，且介於襯套及第一擋止部之間。樞軸連接突出的部分導柱，且位於第一擋止部遠離彈簧的一側。導輪套設於樞軸且位於支撐部的一側。定位模組可適用於使任何形狀的板材在運輸裝置上不偏移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A positioning module suitable for transportation devices for transporting panels includes positioning structures. Each positioning structure includes a support part, a bushing, a guide pillar, a spring, a pivot and a guide wheel. The support part includes opposite top end and bottom end. The bushing is connected to the top end of the support part, and the bushing has a first opening and a second opening that communicate with each other. The guide pillar is movably passed through the first opening and the second opening, and at least part of the guide pillar protrudes from the first opening, and a first stopper is formed on the protruding part of the guide pillar. The spring is sleeved on the protruding part of the guide pillar and is between the bushing and the first stopper. The pivot is connected to the protruding part of the guide pillar and is located on the side of the first stopper away from the spring. The guide wheel is sleeved on the pivot and is located on one side of the support part. The positioning module can be used to prevent panels of any shape from deflecting on the transport device</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:定位模組</p>
        <p type="p">1:定位結構</p>
        <p type="p">36:定位台</p>
        <p type="p">62:運輸支架</p>
        <p type="p">64:運輸滾輪</p>
        <p type="p">641:旋轉軸</p>
        <p type="p">642:輪盤</p>
        <p type="p">60:運輸裝置</p>
        <p type="p">70:滾壓機</p>
        <p type="p">80:板材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="453" publication-number="202618437">
    <tif-files tif-type="multi-tif">
      <tif file="113140633.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光學鄰近修正的圖案與光罩圖案的設計方法</chinese-title>
        <english-title>PATTERN FOR OPTICAL PROXIMITY CORRECTION AND DESIGNING METHOD OF PHOTOMASK PATTERN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250203B">G03F1/36</main-classification>
        <further-classification edition="201201120250203B">G03F1/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢奎羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, KUEI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥永慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAI, YUNG CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於光學鄰近修正的圖案與光罩圖案的設計方法。所述用於光學鄰近修正的圖案包括第一部分與第二部分。所述第一部分具有矩形輪廓。所述第二部分具有十字形輪廓，且設置於所述第一部分中。所述第一部分與所述第二部分互為反相的，且所述第二部分位於所述第一部分的中央處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a pattern for an optical proximity correction and a designing method of a photomask pattern. The pattern for an optical proximity correction includes a first portion and a second portion. The first portion has a rectangular profile. The second portion has a cross-shaped profile and is disposed in the first portion. The first portion and the second portion have reverse tone, and the second portion is located at the center of the first portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100、102、104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="454" publication-number="202618786">
    <tif-files tif-type="multi-tif">
      <tif file="113140634.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>初始抹除電壓的設定方法</chinese-title>
        <english-title>METHOD OF SETTING INITIAL ERASE VOLTAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G11C16/14</main-classification>
        <further-classification edition="200601120250203B">G11C16/34</further-classification>
        <further-classification edition="200601120250203B">G11C16/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種初始抹除電壓的設定方法包括：對第一目標記憶體單元進行預程式化操作；設定抹除電壓並且使用抹除電壓對第一目標記憶體單元進行抹除操作；使用多個驗證電壓對第一目標記憶體單元進行抹除驗證操作；以及根據抹除驗證結果，決定是否將抹除電壓設定為初始抹除電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of setting an initial erase voltage, comprising: performing a pre-programming operation on a first target memory units; setting an erase voltage and performing an erase operation on the first target memory units using the erase voltage; performing an erase verification operation on the first target memory units using a plurality of verification voltages; and determining whether to set the erase voltage as the initial erase voltage based on an erase verification result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S400、S410、S420、S430:方法步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="455" publication-number="202618314">
    <tif-files tif-type="multi-tif">
      <tif file="113140640.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單晶圓級電路測試系統及其測試方法</chinese-title>
        <english-title>SINGLE WAFER-LEVEL CIRCUIT TESTING SYSTEM AND TESTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">G01R31/28</main-classification>
        <further-classification edition="200601120241128B">G01R1/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華精測科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志吰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JHIH HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐琨傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范揚政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YANG ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單晶圓級電路測試系統，包含：載台，設置有待測物放置區；軸控平台，設置在載台下方，被配置為帶動載台移動；高度調整構件，被配置為在軸控平台的移動範圍上方提供具有可變高度的構件安置部；上光感測器，設置在高度調整構件上，被配置為由上而下取像；下光感測器，被配置為受軸控平台控制移動，由下而上取像；以及吸盤組，設置在構件安置部上，被配置為吸附待測物，當構件安置部帶動吸盤組下移，待測物由上而下接觸探針卡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A single wafer level circuit testing system includes: a carrier stage provided with an object placement area; an axis control platform provided below the carrier platform and is configured to drive the carrier platform to move; a height adjustment member configured to provide a member placement portion with a variable height over a range of movement of the axis control platform; an upper light sensor provided on the height adjustment component and configured to capture images from top to bottom; a lower light sensor configured to move under the control of the axis control platform and capture images from bottom to top; and a suction cup group provided on the member placement portion and configured to adsorb the object to be measured. The object to be tested contacts the probe card from top to bottom when the member placement portion drives the suction cup group to move downward.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單晶圓級電路測試系統</p>
        <p type="p">10:載台</p>
        <p type="p">11:待測物放置區</p>
        <p type="p">20:軸控平台</p>
        <p type="p">30:高度調整構件</p>
        <p type="p">31:構件安置部</p>
        <p type="p">40:上光感測器</p>
        <p type="p">50:下光感測器</p>
        <p type="p">60:吸盤組</p>
        <p type="p">P:探針卡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="456" publication-number="202618903">
    <tif-files tif-type="multi-tif">
      <tif file="113140642.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140642</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>迴流式清潔裝置及其控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">H01L21/304</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>微勁精密有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施國彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張范青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種迴流式清潔裝置及其控制方法，該迴流式清潔裝置包含一進出料單元、一載台單元、一清洗單元、一換向台單元及一乾燥單元。該載台單元沿一輸送方向與該進出料單元呈並排設置。該清洗單元沿該輸送方向與該載台單元呈並排設置。該換向台單元沿該輸送方向與該清洗單元呈並排設置。該乾燥單元沿該輸送方向位於該載台單元與該換向台單元之間，且沿該間隔方向與該清洗單元呈並排設置。藉由設置該載台單元、該清洗單元、該換向台單元與該乾燥單元，得以令一載盤迴流至該進出料單元內的一載匣，從而在實現自動化清潔之前提下，提高該進出料單元內回收該載盤的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:抬升導軌</p>
        <p type="p">12:抬升座</p>
        <p type="p">13:推抵模組</p>
        <p type="p">21:承載導軌</p>
        <p type="p">22:前承載座</p>
        <p type="p">23:後承載座</p>
        <p type="p">31:藥劑沖洗模組</p>
        <p type="p">311:第一沖洗殼體</p>
        <p type="p">312:第一沖洗空間</p>
        <p type="p">313:第一輸送帶</p>
        <p type="p">314:第一沖洗噴嘴</p>
        <p type="p">315:第一感測器</p>
        <p type="p">32:去離子水洗模組</p>
        <p type="p">321:第二沖洗殼體</p>
        <p type="p">322:第二沖洗空間</p>
        <p type="p">323:第二輸送帶</p>
        <p type="p">324:第二沖洗噴嘴</p>
        <p type="p">325:第二感測器</p>
        <p type="p">41:換向導軌</p>
        <p type="p">42:換向座</p>
        <p type="p">51:風乾模組</p>
        <p type="p">511:風乾殼體</p>
        <p type="p">512:風乾空間</p>
        <p type="p">513:風乾輸送帶</p>
        <p type="p">514:風乾噴嘴</p>
        <p type="p">515:第三感測器</p>
        <p type="p">91:載匣</p>
        <p type="p">92:載盤</p>
        <p type="p">D2:輸送方向</p>
        <p type="p">D3:間隔方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="457" publication-number="202618625">
    <tif-files tif-type="multi-tif">
      <tif file="113140643.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140643</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產品成本預測方法</chinese-title>
        <english-title>PRODUCT COST ESTIMATING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q10/04</main-classification>
        <further-classification edition="201201120250203B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立政治大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENGCHI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>町洋企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DINKLE ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUH, HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種產品成本預測方法。所述產品成本預測方法包括：輸入歷史製造資料至成本管理模組以獲得統計成本資料;基於生產需求，自統計成本資料中取出多個區段資料，並將所述多個區段資料輸入至成本預測模組，其中成本預測模組包括參數優化模型以及預估模型；透過參數優化模型基於所述多個區段資料來求出估計參數組；以及透過預估模型，基於估計參數組以及生產需求來計算預估成本資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A product cost estimating method is provided. The product cost estimating method includes: inputting historical manufacturing data into a cost management module to obtain statistical cost data; based on a production demand, extracting a plurality of segment data from the statistical cost data and input the plurality of segment data into a cost estimating module, wherein the cost estimating module includes a parameter optimization model and a prediction model; obtaining an estimated parameter set through the parameter optimization model based on the plurality of segment data; and calculating estimated cost data based on the estimated parameter set and the production demand through the prediction model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S205~S220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="458" publication-number="202618555">
    <tif-files tif-type="multi-tif">
      <tif file="113140644.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨平台安全組態管理系統及安全組態還原方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G06F11/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>誠雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREATING CLOUD TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>項嵩仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIANG, SUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝延昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, YEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳竣煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董　璟和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, KENG-WO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車延箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHE, YAN-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪藝珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳郁豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明跨平台安全組態管理系統及安全組態還原方法，透過一安全組態管理伺服器，將安全組態及代理程式派送至用戶端設備。在更新用戶端設備的安全組態之前，代理程式會先備份現有的安全組態，生成包含時間戳記的自定義備份檔，儲存於用戶端設備及安全組態管理伺服器。若需還原至過去某一特定時間點的安全組態時，管理者只需通過伺服器向用戶端設備發出安全組態還原指令，並指定歷史目標時間。系統將自動比對各備份檔的時間戳記，找到最接近目標時間的備份，並據此將用戶端設備設定恢復至該時間點的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:安全組態管理伺服器</p>
        <p type="p">20:安全組態伺服系統</p>
        <p type="p">30:用戶端設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="459" publication-number="202618626">
    <tif-files tif-type="multi-tif">
      <tif file="113140646.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618626</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>場域區域內的路徑規劃的電子裝置與其處理方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND THE METHOD FOR PATH PLANNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q10/047</main-classification>
        <further-classification edition="200601120250401B">G01C21/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞旭電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASKEY COMPUTER CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商亞旭電子科技（江蘇）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASKEY TECHNOLOGY (JIANGSU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖韋齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種場域區域內的路徑規劃的電子裝置與其處理方法，根據電子裝置的位置資訊對多個受訪設施的路徑規劃，路徑規劃方法包括電子裝置載入場域圖資資訊，場域圖資資訊包括受訪設施，每一受訪設施各自具有吞吐資訊；電子裝置接收選擇要求，選出至少兩受訪設施而受選的受訪設施為興趣點，電子裝置根據選擇要求設定每一興趣點的加權權重，獲得興趣點的加權權重集合；電子裝置接收興趣點的即時排隊人數，電子裝置根據興趣點的即時排隊人數與吞吐資訊產生排隊推估時間；電子裝置根據當前位置資訊、加權權重集合與排隊推估時間產生即時動態規劃路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and the method for path planning within an area is provide. The path planning method comprises loading field map data by the electronic device, where the field map data includes surveyed facilities, each with its own throughput information; the electronic device receives selection requests, selects at least two surveyed facilities, and the selected surveyed facilities are considered points of interest. The electronic device sets a weight for each point of interest based on the selection requests, resulting in a set of weights for the points of interest; the electronic device receives the queue numbers at the points of interest and generates queue estimation times based on the queue numbers of each point of interest and the throughput information; the electronic device generates a dynamic path plan based on the current position information, the set of weights, and the queue estimation times.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理系統</p>
        <p type="p">110:伺服器</p>
        <p type="p">120:電子裝置</p>
        <p type="p">121:通訊單元</p>
        <p type="p">122:儲存單元</p>
        <p type="p">123:顯示單元</p>
        <p type="p">124:處理單元</p>
        <p type="p">131:作業系統</p>
        <p type="p">132:路徑規劃程式</p>
        <p type="p">133:場域圖資資訊</p>
        <p type="p">211:吞吐資訊</p>
        <p type="p">212:即時排隊人數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="460" publication-number="202619351">
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      <tif file="113140647.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619351</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140647</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示器及顯示器控制板</chinese-title>
        <english-title>DISPLAYER AND DISPLAYER CONTROL BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241231B">H04N21/454</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃毅瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宛柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WAN-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾愛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, AI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡雅慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, YA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張奇珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZUO-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹鈞傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭才浚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TSAI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芳雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FANG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示器包含訊號接收埠、縮放控制晶片以及輸出介面。訊號接收埠用以接收媒體資訊。縮放控制晶片，包含偵測模組以及遮蔽模組。偵測模組用以執行識別模型，以判斷媒體資訊是否包含管制資訊。遮蔽模組用以遮蔽媒體資訊所包含之管制資訊，以產生過濾媒體資訊。輸出介面播放過濾媒體資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A displayer includes a signal receiving port, a scaler chip, and an output interface. The signal receiving port is configured to receive a piece of media information. The scaler chip includes a detection module and a masking module. The detection module is configured to execute a recognition model to determine whether the piece of media information contains a piece of restricted information. The masking module is configured to mask the piece of restricted information in the piece of media information to generate a piece of filtered media information. The output interface is configured to play the piece of filtered media information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主機</p>
        <p type="p">20:顯示器</p>
        <p type="p">30:縮放控制晶片</p>
        <p type="p">31:偵測模組</p>
        <p type="p">32:遮蔽模組</p>
        <p type="p">40:訊號接收埠</p>
        <p type="p">50:輸出介面</p>
        <p type="p">60:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="461" publication-number="202618699">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618699</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140648</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>渲染方法與渲染裝置</chinese-title>
        <english-title>RENDERING METHOD AND RENDERING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06T11/00</main-classification>
        <further-classification edition="201101120250203B">G06T15/00</further-classification>
        <further-classification edition="201301120250203B">G06F3/0354</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊世睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何昌明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種渲染方法被揭示。此渲染方法包含以下步驟：接收圖檔；解譯圖檔以產生多個幾何單元，並依據多個幾何單元產生多個頂點以及多個物件資料；由一圖形處理器依據該些頂點產生包含複數個幾何圖形的複數個圖層的一畫面，並執行一滑鼠座標與該些頂點之間的一滑鼠碰撞偵測；依據該滑鼠碰撞偵測的一結果判定滑鼠座標碰觸多個頂點中的至少一者，並依據多個頂點中的至少一者及與多個頂點中的至少該者相對應的多個物件資料中的至少一者，判定對應線段；以及依據對應線段於畫面上顯示提示顯示效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rendering method is disclosed. This rendering method includes the following operations: receiving an image file; interpreting the image file to generate several geometric units, and generating several vertices and several object data according to several geometric units; by a graphics processor, generating a picture including several layers of several geometric figures according to the several vertices, and performing a mouse collision detection between a mouse coordinate and the several vertices; determining that the mouse coordinate touches at least one of the several vertices according to a result of the mouse collision detection, and determining a corresponding line segment according to at least one of the several vertices and at least one of several object data corresponding to the at least one of the several vertices; and displaying a prompt display effect on the picture according to the corresponding line segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:渲染方法</p>
        <p type="p">S210,S220,S230,S240,S250,S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="462" publication-number="202617306">
    <tif-files tif-type="multi-tif">
      <tif file="113140650.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感應加熱裝置及黏晶方法</chinese-title>
        <english-title>INDUCTION HEATING DEVICE AND DIE BONDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B23K1/002</main-classification>
        <further-classification edition="200601120241231B">B23K3/04</further-classification>
        <further-classification edition="200601120241231B">H01L21/60</further-classification>
        <further-classification edition="200601120241231B">H01L21/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯雨設計製造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED RESEARCH DESIGN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜嘉秦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIA-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感應加熱裝置，用以解決習知熱壓黏晶技術容易損壞元件及製程效率低的問題。係包含：一工作平台，具有數個吸附孔及一真空模組，該數個吸附孔分布於該工作平台之一承載面上，該真空模組連通該數個吸附孔，一基板被吸附固定於承載面上；一電磁線圈，位於該工作平台內，該電磁線圈位於該承載面下方；及一交流電源，電性連接該電磁線圈，該交流電源提供該電磁線圈可調整頻率之一交流電流，該電磁線圈產生快速變化的磁場。本發明另揭示一種利用感應加熱裝置的黏晶方法。藉此可以達成提高生產效率的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An induction heating device is provided to solve the problems of easy damage to components and low process efficiency of the conventional thermal compression die bonding technology. The induction heating device includes a processing platform, an electromagnetic coil located in the processing platform, and an AC power supply electrically connected to the electromagnetic coil. The processing platform includes a plurality of absorption holes distributed on a bearing surface of the processing platform, and a vacuum module connected to the plurality of absorption holes. A substrate is absorbed and fixed on the bearing surface. The electromagnetic coil is located under the bearing surface. The AC power supply provides an AC current with an adjustable frequency to the electromagnetic coil to produce a rapidly changing magnetic field. The invention further discloses a die bonding method of using the induction heating device. The induction heating device provides the effect of improving production efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工作平台</p>
        <p type="p">1a:承載面</p>
        <p type="p">11:吸附孔</p>
        <p type="p">12:真空模組</p>
        <p type="p">2:電磁線圈</p>
        <p type="p">3:交流電源</p>
        <p type="p">S:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="463" publication-number="202619169">
    <tif-files tif-type="multi-tif">
      <tif file="113140652.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合型連接器</chinese-title>
        <english-title>HYBRID CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250620B">H01R12/72</main-classification>
        <further-classification edition="200601120250620B">H01R13/24</further-classification>
        <further-classification edition="200601120250620B">H01R13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾昌興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>P-TWO INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林賢昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃巧雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIAU-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種混合型連接器，包括絕緣殼體以及由該絕緣殼體保持的複數個電源接觸件及複數個信號接觸件。該複數個電源接觸件包含至少一個接地電源接觸件及複數個非接地電源接觸件，該至少一個接地電源接觸件係配置在該複數個非接地電源接觸件與該複數個信號接觸件之間。該至少一個接地電源接觸件與相鄰的信號接觸件之間的間距係設定成7.1毫米以上，且該至少一個接地電源接觸件與相鄰的非接地電源接觸件之間在間距係設定成7.1毫米以上。藉此，可防止由信號接觸件傳輸的信號受施加在電源接觸件的電流或電壓影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hybrid connector is provided, which includes an insulating housing and a plurality of power contacts and a plurality of signal contacts held by the insulating housing. The plurality of power contacts include at least one ground power contact and a plurality of non-grounded power contacts, and the at least one grounded power contact is disposed between the plurality of non-grounded power contacts and the plurality of signal contacts. The interval between the at least one grounded power contact and an adjacent signal contact is set to be 7.1 mm or more, and the interval between the at least one grounded power contact and an adjacent non-grounded power contact is set to be 7.1 mm or more. Thereby, the signal transmitted by the signal contacts can be prevented from being affected by the current or voltage applied to the power contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:混合式連接器</p>
        <p type="p">11:絕緣殼體</p>
        <p type="p">12:電源接觸件</p>
        <p type="p">13:信號接觸件</p>
        <p type="p">14:壓件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="464" publication-number="202618724">
    <tif-files tif-type="multi-tif">
      <tif file="113140657.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交通事故現場分析系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250206B">G08G1/123</main-classification>
        <further-classification edition="202201120250206B">G06V20/52</further-classification>
        <further-classification edition="202201120250206B">G06V10/20</further-classification>
        <further-classification edition="202001120250206B">G06F40/30</further-classification>
        <further-classification edition="201301120250206B">G10L25/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢甲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃暐翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇妤蘋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種交通事故現場分析系統，包含一攝影單元、一輸入單元、一使用者介面及與該攝影單元、該輸入單元、該使用者介面電性連接的一運算單元，該攝影單元拍攝一事故的現場影像以輸出一現場畫面，該輸入單元用以傳輸一筆錄資訊，該運算單元對該現場畫面進行圖像分割以產生至少一肇事車輛資訊及一道路資訊，對該筆錄資訊進行斷詞以產生複數關鍵詞資訊，且該運算單元執行一生成式人工智慧模型的程式資料，以根據該至少一肇事車輛資訊、該道路資訊及該複數關鍵詞資訊產生包含一事發動畫的一初步分析報告，再透過該使用者介面顯示該初步分析報告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:攝影單元</p>
        <p type="p">20:輸入單元</p>
        <p type="p">30:運算單元</p>
        <p type="p">40:使用者介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="465" publication-number="202617222">
    <tif-files tif-type="multi-tif">
      <tif file="113140660.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模擬舉重復健裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">A63B21/008</main-classification>
        <further-classification edition="200601120241105B">A63B21/072</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏煥榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏煥榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白丞堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模擬舉重復健裝置，包含有一支撐架模組與一槓鈴模組所構成，該支撐架模組具有兩根直立設置的支撐單元，前述的槓鈴模組是安裝在二該支撐單元之間，其特徵在於，槓鈴模組包含有一定位桿、一液壓缸、二組限位桿與一抓舉桿所構成，液壓缸安裝在定位桿上，另一端則與該抓舉桿活動連接，限位桿安裝在抓舉桿上，並限制該抓舉桿垂直移動，據此，透過調整液壓缸的阻尼大小，就能讓抓舉桿產生不同的阻力大小，方便使用者進行舉重健身訓練，且具有高安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支撐架模組</p>
        <p type="p">11:支撐單元</p>
        <p type="p">12:容置區</p>
        <p type="p">13:開口</p>
        <p type="p">20:槓鈴模組</p>
        <p type="p">21:定位桿</p>
        <p type="p">211:限位孔</p>
        <p type="p">22:抓舉桿</p>
        <p type="p">23:限位桿</p>
        <p type="p">24:液壓缸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="466" publication-number="202619159">
    <tif-files tif-type="multi-tif">
      <tif file="113140661.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多頻天線</chinese-title>
        <english-title>MULTI-FREQUENCY ANTENNA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H01Q1/36</main-classification>
        <further-classification edition="201701120250203B">H04B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YI-JAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案關於一種多頻天線，包含介質基板、接地系統部及輻射元件。接地系統部設置於介質基板。輻射元件設置於介質基板，且包含饋入部、第一輻射部、第二輻射部、第三輻射部及第四輻射部。饋入部架構於饋入訊號。第一輻射部連接於饋入部之第一側邊，且架構於產生第一頻段及第二頻段之無線訊號收發。第二輻射部連接於饋入部之第一側邊，且架構於產生第三頻段之無線訊號收發。第二槽縫形成於第一輻射部及第二輻射部之間。第三輻射部連接於饋入部之第三側邊，且架構於產生第四頻段前端之無線訊號收發。第四輻射部連接於饋入部的第三側邊，且架構於產生第五頻段之無線訊號收發。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-frequency antenna is disclosed and includes a substrate, a grounding system portion and a radiating element. The grounding system portion is disposed on the substrate. The radiating element is disposed on the grounding system portion, and includes a feed-in portion, a first radiating portion, a second radiating portion, a third radiating portion and a fourth radiating portion. The feed-in portion is configured to import signal. The first radiating portion is in connection with a first side of the feed-in portion, and configured to receive wireless signal of a first frequency band and a second frequency band. The second radiating portion is in connection with the first side of the feed-in portion, and configured to receive wireless signal of a third frequency band. A second gap is formed between the first radiating portion and the second radiating portion. The third radiating portion is in connection with a third side of the feed-in portion, and configured to receive wireless signal of a front end of a fourth frequency band. The fourth radiating portion is in connection with the third side of the feed-in portion, and configured to receive wireless signal of a fifth frequency band.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:多頻天線</p>
        <p type="p">1:介質基板</p>
        <p type="p">2:接地系統部</p>
        <p type="p">20:中空部</p>
        <p type="p">25:第一延伸部</p>
        <p type="p">25a:第一延伸部側邊</p>
        <p type="p">3:輻射元件</p>
        <p type="p">30:饋入部</p>
        <p type="p">30a:第一側邊</p>
        <p type="p">30b:第二側邊</p>
        <p type="p">30c:第三側邊</p>
        <p type="p">30d:第四側邊</p>
        <p type="p">30e:第五側邊</p>
        <p type="p">31:第一輻射部</p>
        <p type="p">311:第一段部</p>
        <p type="p">312:第二段部</p>
        <p type="p">313:第三段部</p>
        <p type="p">32:第二輻射部</p>
        <p type="p">33:第三輻射部</p>
        <p type="p">34:第四輻射部</p>
        <p type="p">34a:第四輻射部頂邊</p>
        <p type="p">34b:第四輻射部底邊</p>
        <p type="p">35:第五輻射部</p>
        <p type="p">351:第六段部</p>
        <p type="p">352:第七段部</p>
        <p type="p">36:第六輻射部</p>
        <p type="p">361:第八段部</p>
        <p type="p">362:第九段部</p>
        <p type="p">S1:第一槽縫</p>
        <p type="p">S2:第二槽縫</p>
        <p type="p">S3:第三槽縫</p>
        <p type="p">S4:第四槽縫</p>
        <p type="p">S5:第五槽縫</p>
        <p type="p">S6:第六槽縫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="467" publication-number="202618678">
    <tif-files tif-type="multi-tif">
      <tif file="113140664.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車隊風險評估系統及用於車隊風險評估的電腦實施方法</chinese-title>
        <english-title>A SYSTEM FOR ESTIMATING RISK OF FLEETS AND A COMPUTER IMPLEMENTATION METHOD USED FOR ESTIMATING RISK OF FLEETS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06Q50/40</main-classification>
        <further-classification edition="202301120250203B">G06Q10/0635</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國泰世紀產物保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CATHAY CENTURY INSURANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃忠涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊偉志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李思嫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SSU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王沛榆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李郁芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許淇媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林庭羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹祐驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃詩媃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-ROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈沛錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, PEI-CI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾耘昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, YUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MING-SSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容是關於一種車隊風險評估系統及用於車隊風險評估的電腦實施方法。車隊風險評估系統的處理器存取安全勘驗模組，以執行：通過安全勘驗模組，獲取對應車隊的多個類別分數，並根據類別分數獲取安全量化分數；以及根據安全量化分數，產生風險評估結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a system for estimating risk of fleets and a computer implementation method used for estimating risk of fleets. The processor of the system for estimating risk of fleet accesses a safety inspection module and a behavioral risk diagnosis module to execute: via the safety inspection module, obtaining a plurality of category scores corresponding to the fleet, and obtaining a safety quantification score according to the category scores; and generating a risk estimation result according to the safety quantification score.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:使用者裝置</p>
        <p type="p">100:車隊風險評估系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:儲存裝置</p>
        <p type="p">122:安全勘驗模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="468" publication-number="202618679">
    <tif-files tif-type="multi-tif">
      <tif file="113140665.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車隊安全管理系統及用於車隊安全管理的電腦實施方法</chinese-title>
        <english-title>A SYSTEM FOR SAFETY MANAGEMENT OF FLEETS AND A COMPUTER IMPLEMENTATION METHOD USED FOR SAFETY MANAGEMENT OF FLEETS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06Q50/40</main-classification>
        <further-classification edition="202301120250203B">G06Q10/0635</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國泰世紀產物保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CATHAY CENTURY INSURANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃忠涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊偉志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李思嫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SSU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王沛榆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃一正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, I-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何偉豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李維婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾紹恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, SHAO-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭右竺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YU-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-SHUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容是關於一種車隊安全管理系統及用於車隊安全管理的電腦實施方法。車隊安全管理系統的處理器存取車隊安全評鑑模組、車隊安全指標模組、駕駛安全指標模組、駕駛行為評鑑模組或駕駛總覽模組，且所述處理器用以執行以下步驟：透過車隊安全評鑑模組呈現車隊安全評鑑區塊於顯示裝置上，且車隊安全評鑑區塊用以顯示以下所組成之資訊：車隊安全指標分數、區間/大盤分數比較、車隊危險因子排名和管轄車隊排行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein relates to a system for safety management of fleets and a computer implement method used for safety management of fleets. The processor of the system accesses a fleet safety evaluation module, a fleet safety index module, a driver safety index module, a driver behavior evaluation module, or a driver overview module. The processor is configured to execute the following steps: presenting a fleet safety evaluation area on a display device through the fleet safety evaluation module, wherein the fleet safety evaluation area is used to display the following information: fleet safety index score, period/benchmark score comparison, fleet risk factor ranking, and managed fleet ranking.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車隊安全管理系統</p>
        <p type="p">110:處理器</p>
        <p type="p">115:顯示裝置</p>
        <p type="p">120:儲存裝置</p>
        <p type="p">132:車隊安全評鑑模組</p>
        <p type="p">134:車隊安全指標模組</p>
        <p type="p">136:駕駛安全指標模組</p>
        <p type="p">138:駕駛行為評鑑模組</p>
        <p type="p">140:駕駛總覽模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="469" publication-number="202618668">
    <tif-files tif-type="multi-tif">
      <tif file="113140672.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水質的監測方法與系統</chinese-title>
        <english-title>SEDIMENT CONCENTRATION MONITORING METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241231B">G06Q50/06</main-classification>
        <further-classification edition="202301120241231B">G06Q10/04</further-classification>
        <further-classification edition="200601120241231B">G06Q90/00</further-classification>
        <further-classification edition="202301120241231B">G06F18/00</further-classification>
        <further-classification edition="200601120241231B">G01N33/18</further-classification>
        <further-classification edition="200601120241231B">E03B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢甲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG CHIA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃振家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張喬茗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇昱嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水質的監測方法與系統，採用空間分離協議與機器學習技術來進行空間區塊分離並分類，然後結合集成架構來評估其性能，其摘要步驟為：首先將每張原始影像劃分為多個影像區塊，然後透過機器學習預測前者的值並對其進行平均或加權，以獲得每張原始影像的最終估計值；本發明可以有效容忍懸浮固體不均的問題，並縮減系統的運算量，以達到即時運算，同時，不同的空間區塊分離方式與權重設計，也能應用至不同的泥沙濃度，以顯示本發明對於不同含砂量的適應性良好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to a sediment concentration monitoring method and system, utilizing spatial separation protocols and machine learning techniques to conduct spatial block separation and classification, then combining with an integrated architecture to evaluate its performance. The summary steps are as follows: first, each original image from the sample is divided into multiple image blocks, then the values of the former are predicted through machine learning and averaged or weighted to obtain the final estimated value for each original image. This invention can effectively tolerate the issue of uneven suspended solids and reduce the system's computational load to achieve real-time processing. Meanwhile, different spatial block separation methods and weight designs can be applied to different sediment concentrations, demonstrating the high adaptability of the present invention to varying sand content levels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="470" publication-number="202618477">
    <tif-files tif-type="multi-tif">
      <tif file="113140673.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>優化工具機切削負載的系統與其方法</chinese-title>
        <english-title>THE SYSTEM AND METHOD FOR OPTIMIZING THE CUTTING LOAD OF A MACHINE TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G05B19/408</main-classification>
        <further-classification edition="200601120241204B">G05B19/4097</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭達仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TA-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪正祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜冠威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, KUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種優化工具機切削負載的系統，利用擷取該加工程式與加工程式碼比對加工進給率與主軸電流的方式來調控優化工具機的加工效能，以提升製程效率，達到優化切削負載，節省加工時間，同時省下可觀的加工電費，減少排碳量等優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system for optimizing the cutting load of a machine tool. It utilizes a method of capturing the machining program and comparing it with the G-code to adjust and optimize the performance of the machine tool. This approach enhances process efficiency, achieves optimized cutting loads, reduces machining time, and results in significant savings on energy costs, while also minimizing carbon emissions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工具機切削負載的系統</p>
        <p type="p">10:工具機</p>
        <p type="p">11:控制器</p>
        <p type="p">12:加工主軸</p>
        <p type="p">13:加工單元</p>
        <p type="p">20:主軸數值擷取單元</p>
        <p type="p">21:擷取模組</p>
        <p type="p">30:儲存單元</p>
        <p type="p">40:加工程式優化單元</p>
        <p type="p">41:加工功率計算模組</p>
        <p type="p">42:加工數值比對模組</p>
        <p type="p">43:加工進給率規劃模組</p>
        <p type="p">44:加工程式生成模組</p>
        <p type="p">50:資訊單元</p>
        <p type="p">51:加工資訊</p>
        <p type="p">52:工件資訊</p>
        <p type="p">53:主軸特徵資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="471" publication-number="202618706">
    <tif-files tif-type="multi-tif">
      <tif file="113140677.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618706</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>邊緣運算攝影機結合多模態大型語言模型之自動提款機監控系統與方法</chinese-title>
        <english-title>A METHOD AND SYSTEM OF EDGE COMPUTING CAMERA AND MULTI-MODAL LARGE LANGUAGE MODEL FOR ATM MONITORING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">G06V20/52</main-classification>
        <further-classification edition="202201120250203B">G06V10/10</further-classification>
        <further-classification edition="202301120250203B">G06Q40/02</further-classification>
        <further-classification edition="200601120250203B">G07F19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉山商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E. SUN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鉦育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋名傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, MING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZUNG SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, KAI SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡弘林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HUNG LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉晉昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種邊緣運算攝影機結合多模態大型語言模型之自動提款機監控系統與方法。邊緣運算攝影機結合多模態大型語言模型之自動提款機監控包括一影像擷取裝置、一邊緣計算控制電路、一儲存電路以及一伺服器。當影像擷取裝置擷取的第一區域影像資訊符合多個區域判斷規則的其中之一時，邊緣計算控制電路標記第一區域影像資訊的一第一標記區域之後，且傳送標記後的第一區域影像資訊至伺服器。伺服器根據標記後的第一區域影像資訊進行一包括文字、影像、錄影、音頻或是動作的分析程序，並提供對應的一區域分析資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system of edge computing camera and multi-modal large language model for atm monitoring is provided. The system of edge computing camera and multi-modal large language model for atm monitoring includes an image capture device, an edge computing control circuit, a storage circuit and a server. When the first area image information captured by the image capture device meets one of a plurality of area determination rules, the edge computing control circuit marks a first marked area on the first area image, and transmits the marked first area image to the server. The server performs an analysis program including text, image, video, audio or action based on the marked first area image information, and provides corresponding area analysis information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">SYS1:邊緣運算攝影機結合多模態大型語言模型之自動提款機監控</p>
        <p type="p">A1:第一區域</p>
        <p type="p">1:影像擷取裝置</p>
        <p type="p">2:邊緣計算控制電路</p>
        <p type="p">3:儲存電路</p>
        <p type="p">U1:使用者</p>
        <p type="p">S1:伺服器</p>
        <p type="p">ACM:區域分析資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="472" publication-number="202618604">
    <tif-files tif-type="multi-tif">
      <tif file="113140680.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140680</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於三維晶片的保護二極體電路的佈局與結構</chinese-title>
        <english-title>LAYOUT AND STRUCTURE OF PROTECTION DIODE CIRCUIT FOR 3D IC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241106B">G06F30/392</main-classification>
        <further-classification edition="200601120241106B">H01L23/60</further-classification>
        <further-classification edition="202001320241106B">G06F113/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何進偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG, CHEE HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡綜穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　驥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　國海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUOHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種用於三維晶片的保護二極體電路，包含一覆矽絕緣體基板、一後段金屬互連結構位於該覆矽絕緣體基板上、一底接觸件連接該覆矽絕緣體基板的矽基底與該後段金屬互連結構的第一部分、一第一保護二極體，具有第一閘極連接到該第一部分、第一P型摻雜區連接到該第一部分、以及第一N型摻雜區連接到該覆矽絕緣體基板的第二部分、一第二保護二極體，具有第二閘極連接到該第二部分、第二P型摻雜區連接到該第二部分、以及第二N型摻雜區連接到該後段金屬互連結構的一第三部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A protection diode circuit for 3D IC is provided in the present invention, including a SOI substrate, a BEOL metal interconnect on the SOI substrate, a bottom contact connecting a silicon base of the SOI substrate and a part of the BEOL metal interconnect, a first protection diode with a first gate connecting the first part, a first P-type doped region connecting the first part and a first N-type doped region connecting a second part of the SOI substrate, a second protection diode with a second gate connecting the second part, a second P-type doped region connecting the second part, and a second N-type doped region connecting a third part of the BEOL metal interconnect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BC1:接觸件</p>
        <p type="p">BC2:接觸件</p>
        <p type="p">BC3:接觸件</p>
        <p type="p">D1:N型摻雜區</p>
        <p type="p">D2:N型摻雜區</p>
        <p type="p">DF:擴散區</p>
        <p type="p">d1:第一方向</p>
        <p type="p">d2:第二方向</p>
        <p type="p">G1:閘極</p>
        <p type="p">G2:閘極</p>
        <p type="p">M1:第一金屬層</p>
        <p type="p">NW:N型井(區域)</p>
        <p type="p">P1:第一部分</p>
        <p type="p">P2:第二部分</p>
        <p type="p">P3:第三部分</p>
        <p type="p">PD1:保護二極體</p>
        <p type="p">PD2:保護二極體</p>
        <p type="p">S1:P型摻雜區</p>
        <p type="p">S2:P型摻雜區</p>
        <p type="p">TBV1:底接觸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="473" publication-number="202617322">
    <tif-files tif-type="multi-tif">
      <tif file="113140682.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板加工裝置及基板加工方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241230B">B23K26/70</main-classification>
        <further-classification edition="201401120241230B">B23K26/04</further-classification>
        <further-classification edition="201401120241230B">B23K26/382</further-classification>
        <further-classification edition="200601120241230B">H01L23/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種基板加工裝置及基板加工方法。基板加工裝置包括固持模組以及加工模組。固持模組包括多個護板元件、多個黏著物以及多個夾持元件。多個護板元件被配置成用於夾持待加工基板，待加工基板具有預加工位置。多個黏著物設置於多個護板元件，多個黏著物被配置成用於黏固待加工基板。多個夾持元件被配置成用於夾持多個護板元件與待加工基板。加工模組對應於其中一護板元件，加工模組被配置成用於產生聚焦後雷射光束且朝預加工位置投射。藉此，本發明之基板加工裝置及基板加工方法可提升加工品質以及孔洞結構的良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing device and a substrate processing method are provided. The substrate processing device includes a holding module and a processing module. The holding module includes a plurality of guard plate components, a plurality of adhesives and a plurality of clamping components. The plurality of guard plate components are configured to hold a substrate to be processed, and the substrate to be processed has a pre-processing position. The plurality of adhesives are provided on the plurality of guard plate components, and the plurality of adhesives are configured to adhere to the substrate to be processed. The plurality of clamping components are configured to clamp the plurality of guard plate components and the substrate to be processed. The processing module corresponds to one of the plurality of guard plate components, and the processing module is configured to generate a focused laser beam and project the focused laser beam toward the pre-processing position. By means of the present disclosure, the substrate processing device and the substrate processing method can improve the processing quality and the yield of the hole structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:基板加工裝置</p>
        <p type="p">1:固持模組</p>
        <p type="p">10:護板元件</p>
        <p type="p">11:黏著物</p>
        <p type="p">12:夾持元件</p>
        <p type="p">2:加工模組</p>
        <p type="p">4:影像擷取模組</p>
        <p type="p">7:清潔模組</p>
        <p type="p">70:氣體源</p>
        <p type="p">71:氣體噴嘴</p>
        <p type="p">72:清潔物質</p>
        <p type="p">B:待加工基板</p>
        <p type="p">B1:預加工位置</p>
        <p type="p">L3:聚焦後雷射光束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="474" publication-number="202618147">
    <tif-files tif-type="multi-tif">
      <tif file="113140683.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧波減速機</chinese-title>
        <english-title>HARMONIC REDUCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F16H1/32</main-classification>
        <further-classification edition="200601120241204B">F16C19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盟英科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAIN DRIVE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝昆儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KUN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭鈺嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-SSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏有泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YOU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉玟秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEN-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種諧波減速機。諧波減速機包含凸輪軸、柔性軸承、柔輪、剛輪、第一與第二內環件、外環件、兩個軸向滾子軸承、徑向滾子軸承、兩個滾珠軸承、及第一與第二外蓋。柔性軸承機械連接於凸輪軸上。柔輪連接於柔性軸承的外緣上。剛輪嚙合於柔輪的外緣上。第一內環件設置於剛輪的一側。第二內環件設置於第一內環件的一側。第一與第二內環件各包含一本體及連接本體的一延伸牆。外環件安裝於第一與第二內環件的外緣上。外環件的一部份位於第一與第二內環件的延伸牆之間，以形成容置兩個軸向滾子軸承的兩個徑向空間與容置徑向滾子軸承的一個軸向空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A harmonic reducer is provided. The harmonic reducer includes a camshaft, a flexible bearing, a flexspline, a rigid spline, first and second inner ring components, an outer ring component, two first roller bearings, a second roller bearing, two ball bearings, and first and second outer covers. The flexible bearing is mechanically connected to the camshaft. The flexspline is connected to the outer edge of the flexible bearing. The rigid spline meshes with the outer edge of the flexspline. The first inner ring component is positioned on one side of the rigid spline. The second inner ring component is positioned on one side of the first inner ring component. Both the first and second inner ring components each include a main body and an extending wall connected to the main body. The outer ring component is installed on the outer edges of the first and second inner ring components. Part of the outer ring component is located between the extending walls of the first and second inner ring components, forming two radial spaces to accommodate the two first roller bearings and an axial space to accommodate the second roller bearing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:諧波減速機</p>
        <p type="p">1:凸輪軸</p>
        <p type="p">11:軸體</p>
        <p type="p">12:外凸部</p>
        <p type="p">2:柔性軸承</p>
        <p type="p">3:柔輪</p>
        <p type="p">31:軸向部</p>
        <p type="p">32:徑向部</p>
        <p type="p">4:剛輪</p>
        <p type="p">5:第一內環件</p>
        <p type="p">6:第二內環件</p>
        <p type="p">7:外環件</p>
        <p type="p">71:第一子環件</p>
        <p type="p">72:第二子環件</p>
        <p type="p">73:第三子環件</p>
        <p type="p">8A:軸向滾子軸承</p>
        <p type="p">8B:徑向滾子軸承</p>
        <p type="p">9:滾珠軸承</p>
        <p type="p">10A:第一外蓋</p>
        <p type="p">10B:第二外蓋</p>
        <p type="p">11A:第一旋轉軸封</p>
        <p type="p">11B:第二旋轉軸封</p>
        <p type="p">11C:第三旋轉軸封</p>
        <p type="p">D1:軸向方向</p>
        <p type="p">D2:徑向方向</p>
        <p type="p">M:儲液空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="475" publication-number="202617554">
    <tif-files tif-type="multi-tif">
      <tif file="113140687.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鏈條軌道裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B65G21/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏諱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏諱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種鏈條軌道裝置，其係設置於一鏈條輸送裝置的架體上且設有至少一支撐條及數個夾設組，該至少一支撐條係設置於該架體的頂面，該數個夾設組係間隔設置於該架體的頂面且與該至少一支撐條相貼靠，各該夾設組設有至少兩夾設塊，該至少兩夾設塊分別位於該至少一支撐條的兩側邊，進而將該至少一支撐條夾設定位於該架體的頂面，在不需焊接的情況下，經由各該夾設組的夾設與該限位組的限位的方式，即可方便且快速地將該至少一支撐條設置於該架體上，藉以提供一種能方便組裝、快速更換且能減少使用成本及時間的鏈條軌道裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支撐條</p>
        <p type="p">20:夾設組</p>
        <p type="p">21:夾設塊</p>
        <p type="p">51:架體</p>
        <p type="p">54:驅動桿</p>
        <p type="p">56:鏈條</p>
        <p type="p">561:鏈片</p>
        <p type="p">562:滾子</p>
        <p type="p">57:驅動齒輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="476" publication-number="202618092">
    <tif-files tif-type="multi-tif">
      <tif file="113140688.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以真空將經皮吸收物質與纖維品結合之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">D06M13/535</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯紹緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯紹緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種以真空將經皮吸收物質與纖維品結合之方法，包含：提供一可經皮吸收物質；提供一纖維品；以及提供一真空裝置。真空裝置用以形成一真空環境，且可經皮吸收物質及纖維品被容置於真空環境內以進行一真空結合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可經皮吸收物質</p>
        <p type="p">200:纖維品</p>
        <p type="p">300:真空裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="477" publication-number="202619090">
    <tif-files tif-type="multi-tif">
      <tif file="113140689.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構以及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01L23/48</main-classification>
        <further-classification edition="200601120241231B">H01L21/60</further-classification>
        <further-classification edition="200601120241231B">H01L21/762</further-classification>
        <further-classification edition="200601120241231B">H01L21/764</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊晉嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DA-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馥郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, FU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡濱祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, BIN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包括半導體基底、複數個墊結構、複數個介電結構、第二介電層以及空隙。半導體基底包括第一介電層，墊結構與介電結構設置在第一介電層上，且各介電結構設置在複數個墊結構中的一個的側壁上。各介電結構的上表面在垂直方向上低於各墊結構的上表面，且第一介電層包括凹陷在水平方向上位於相鄰的兩個介電結構之間。第二介電層覆蓋墊結構、介電結構以及第一介電層。空隙位於第二介電層中，空隙的至少一部分在水平方向上被夾設在相鄰的兩個墊結構之間，且空隙在垂直方向上位於凹陷的正上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a semiconductor substrate, pad structures, dielectric structures, a second dielectric layer, and a void. The semiconductor substrate includes a first dielectric layer, the pad structures and the dielectric structure are disposed on the first dielectric layer, and each dielectric structure is disposed on a sidewall of one of the pad structures. A top surface of each dielectric structure is lower than a top surface of each pad structure in a vertical direction. The first dielectric layer includes a recess located between two adjacent dielectric structures in a horizontal direction. The second dielectric layer covers the pad structures, the dielectric structures, and the first dielectric layer. The void is located in the second dielectric layer. At least a part of the void is sandwiched between two adjacent pad structures in the horizontal direction, and the void is located directly above the recess in the vertical direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:基底</p>
        <p type="p">24:介電層</p>
        <p type="p">26:阻障層</p>
        <p type="p">28:導電材料</p>
        <p type="p">30:介電層</p>
        <p type="p">32:第一介電層</p>
        <p type="p">34:阻障層</p>
        <p type="p">36:導電材料</p>
        <p type="p">42:阻障層</p>
        <p type="p">44:導電層</p>
        <p type="p">46:阻障層</p>
        <p type="p">50:介電結構</p>
        <p type="p">52:第二介電層</p>
        <p type="p">52M:介電材料</p>
        <p type="p">54:阻障層</p>
        <p type="p">56:導電材料</p>
        <p type="p">58:連接結構</p>
        <p type="p">100:半導體結構</p>
        <p type="p">BP:底端</p>
        <p type="p">BS:底表面</p>
        <p type="p">BS1:底表面</p>
        <p type="p">BS2:底表面</p>
        <p type="p">CP:中心點</p>
        <p type="p">CS:互連結構</p>
        <p type="p">D1:垂直方向</p>
        <p type="p">D2:水平方向</p>
        <p type="p">G2:第二間隔</p>
        <p type="p">ML:導線</p>
        <p type="p">P1:下部</p>
        <p type="p">P2:上部</p>
        <p type="p">PD:墊結構</p>
        <p type="p">RC1:凹陷</p>
        <p type="p">TK1:厚度</p>
        <p type="p">TK2:厚度</p>
        <p type="p">TK3:厚度</p>
        <p type="p">TK4:厚度</p>
        <p type="p">TP:頂端</p>
        <p type="p">TS1:上表面</p>
        <p type="p">TS2:上表面</p>
        <p type="p">TS4:上表面</p>
        <p type="p">TS5:上表面</p>
        <p type="p">TS6:上表面</p>
        <p type="p">VD1:空隙</p>
        <p type="p">VS:通孔導體</p>
        <p type="p">W:半導體基底</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="478" publication-number="202617341">
    <tif-files tif-type="multi-tif">
      <tif file="113140690.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組化多片式離合分割角度機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B23Q16/02</main-classification>
        <further-classification edition="200601120241204B">B23Q5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安禾精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHG PRECISION INDUSTRY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何元瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銀澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模組化多片式離合分割角度機構，包含有一第一定位齒盤、一活動齒盤及一第二定位齒盤，該第一定位齒盤、該活動齒盤及該第二定位齒盤係呈同軸設置，該第一定位齒盤朝向活動齒盤之一側面形成有一第一齒部，該活動齒盤朝向第一定位齒盤的一側面形成有一第一旋轉齒部，該第一齒部與該第一旋轉齒部的齒數相同且可相互嚙合，該第二定位齒盤朝向活動齒盤之一側面形成有一第二齒部，該活動齒盤朝向第二定位齒盤的一側面形成有一第二旋轉齒部，該第二齒部與該第二旋轉齒部的齒數相同且可相互嚙合，該第一齒部與該第二齒部的齒數不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:旋轉底座</p>
        <p type="p">20:連接底座</p>
        <p type="p">22:旋轉刀頭</p>
        <p type="p">30:第一定位齒盤</p>
        <p type="p">32:活動齒盤</p>
        <p type="p">34:第二定位齒盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="479" publication-number="202619368">
    <tif-files tif-type="multi-tif">
      <tif file="113140691.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>揚聲器控制系統</chinese-title>
        <english-title>SPEAKER CONTROL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04R3/12</main-classification>
        <further-classification edition="200601120250203B">H04R5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾聯碩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡柏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種揚聲器控制系統，其包含第一揚聲器、第二揚聲器以及音訊傳送裝置。第一揚聲器包含第一喇叭及第一控制器，第一控制器包含第一音訊接收器、第一線路輸入埠及第一線路輸出埠。第二揚聲器包含第二喇叭及第二控制器，第二控制器包含第二音訊接收器、第二線路輸入埠及第二線路輸出埠。第二線路輸入埠耦接於第一線路輸出埠，通過數位生活網路聯盟協議使第一揚聲器及第二揚聲器形成網路拓撲架構。音訊傳送裝置傳送音訊至第一音訊接收器或第二音訊接收器，通過網路拓撲架構於第一喇叭或第二喇叭播放音訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A speaker control system is disclosed. The speaker control system includes a first speaker device, a second speaker device and an audio transmission device. The first speaker device includes a first speaker and a first controller. The first controller includes a first audio receiver, a first line in port and a first line out port. The second speaker device includes a second speaker and a second controller. The second controller includes a second audio receiver, a second line in port and a second line out port. The second line in port is coupled to the first line out port, and the first speaker and the second speaker form a network topology through the Digital Living Network Alliance protocol. The audio transmission device transmits audio to the first audio receiver or the second audio receiver. The audio is played on the first speaker or the second speaker through the network topology.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:揚聲器控制系統</p>
        <p type="p">11:第一揚聲器</p>
        <p type="p">12:第二揚聲器</p>
        <p type="p">13:音訊傳送裝置</p>
        <p type="p">111:第一喇叭</p>
        <p type="p">112:第一控制器</p>
        <p type="p">113:第一音訊接收器</p>
        <p type="p">114:第一線路輸入埠</p>
        <p type="p">115:第一線路輸出埠</p>
        <p type="p">116:第一電路板</p>
        <p type="p">121:第二喇叭</p>
        <p type="p">122:第二控制器</p>
        <p type="p">123:第二音訊接收器</p>
        <p type="p">124:第二線路輸入埠</p>
        <p type="p">125:第二線路輸出埠</p>
        <p type="p">126:第二電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="480" publication-number="202618647">
    <tif-files tif-type="multi-tif">
      <tif file="113140713.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>推薦搜尋字詞顯示方法及其裝置</chinese-title>
        <english-title>METHOD FOR DISPALYING RECOMMENDED QUERY WORD AND APPARATUS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250401B">G06Q30/02</further-classification>
        <further-classification edition="201901120250401B">G06F16/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權希正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HEE JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴賢珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係有關於一種推薦搜尋字詞顯示方法及其裝置。        &lt;br/&gt;根據本發明一實施例，提供一種推薦搜尋字詞顯示方法，其包括如下步驟：啟動搜尋框；在該搜尋框的第一區域，顯示使用計算裝置的使用者之前輸入的第一搜尋字詞生成的第一推薦搜尋字詞；回應於該使用者的動作，在該第一區域附加顯示第二推薦搜尋字詞。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for displaying a recommended query word and a device therefor. According to an exemplary embodiment of the present disclosure, provided may be a method for displaying a recommended query word including: activating a search box, displaying a first recommended query word generated using a first query word previously entered by a user of a computing device in a first area of the search box, and additionally displaying a second recommended query word in the first area in response to an operation of the user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310、311、:顯示推薦搜尋字詞的區域</p>
        <p type="p">341:顯示第二推薦搜尋字詞的部分</p>
        <p type="p">21:使用者的動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="481" publication-number="202619298">
    <tif-files tif-type="multi-tif">
      <tif file="113140720.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>差動式斜率類比至數位轉換裝置及方法</chinese-title>
        <english-title>DIFFERENTIAL SLOPE ANALOG-TO-DIGITAL CONVERSION APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H03M1/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃詩雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種差動式斜坡類比至數位轉換裝置。第一電容以及第二電容在取樣時間中根據一對類比輸入訊號進行取樣。斜坡電壓產生電路在第一饋入時間中對第一電容根據第一正斜率進行正斜率電壓饋入及對第二電容根據第一負斜率進行負斜率電壓饋入，且在第二饋入時間中對第二電容根據第二正斜率進行正斜率電壓饋入以及對第一電容根據第二負斜率進行負斜率電壓饋入，其中第一及第二饋入時間依序與取樣時間交錯進行。比較電路在第一及第二饋入時間中接收來自第一及第二電容的第一及第二電壓進行比較，以產生比較結果。計數電路根據比較結果計數以產生數位輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A differential slope analog-to-digital conversion apparatus is provided. A first capacitor and a second capacitor perform sampling according to a pair of analog input signals in a sampling time. A slope voltage generation circuit performs a positive slope voltage feeding on the first capacitor according to a first positive slope and performs a negative slope voltage feeding on the second capacitor according to a first negative slope in a first feeding time, and the positive slope voltage feeding on the second capacitor according to a second positive slope and performs the negative slope voltage feeding on the first capacitor according to a second negative slope in a second feeding time, in which the first feeding time and the second feeding time proceed with the sampling time in turn in an interlaced manner. A comparison circuit receives a first voltage and a second voltage from the first capacitor and the second capacitor in the first feeding time and the second feeding time to perform comparison to generate a comparison result. A counting circuit performs counting according to the comparison result to generate a digital output signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:差動式斜坡類比至數位轉換裝置</p>
        <p type="p">110:斜坡電壓產生電路</p>
        <p type="p">120:比較電路</p>
        <p type="p">130:計數電路</p>
        <p type="p">140A:第一輸入開關</p>
        <p type="p">140B:第二輸入開關</p>
        <p type="p">140C:第三輸入開關</p>
        <p type="p">140D:第四輸入開關</p>
        <p type="p">150A:第一饋入開關</p>
        <p type="p">150B:第二饋入開關</p>
        <p type="p">155A:第一汲取開關</p>
        <p type="p">155B:第二汲取開關</p>
        <p type="p">160A:第一連接開關</p>
        <p type="p">160B:第二連接開關</p>
        <p type="p">170A:第一比較開關</p>
        <p type="p">170B:第二比較開關</p>
        <p type="p">180A:第一電流饋入電路</p>
        <p type="p">180B:第二電流饋入電路</p>
        <p type="p">190A:第一電流汲取電路</p>
        <p type="p">190B:第二電流汲取電路</p>
        <p type="p">AN1、AN2:類比輸入訊號</p>
        <p type="p">C1:第一電容</p>
        <p type="p">C2:第二電容</p>
        <p type="p">COUT:比較結果</p>
        <p type="p">DOUT:數位輸出訊號</p>
        <p type="p">FS1:第一饋入訊號</p>
        <p type="p">FS2:第二饋入訊號</p>
        <p type="p">RES:重置訊號</p>
        <p type="p">T1:第一連接點</p>
        <p type="p">T2:第二連接點</p>
        <p type="p">VS1:第一電壓</p>
        <p type="p">VS2:第二電壓</p>
        <p type="p">VT1:第一連接電壓</p>
        <p type="p">VT2:第二連接電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="482" publication-number="202619598">
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      <tif file="113140728.zip" no="1">
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          <doc-number>202619598</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構</chinese-title>
        <english-title>PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/85</main-classification>
        <further-classification edition="202501120250102B">H10H20/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修邑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIOU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁建欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIAN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供封裝結構。封裝結構包括介電層、重佈線層、複數個發光元件、光劣化防止層及覆蓋層。重佈線層設置於介電層上。複數個發光元件設置於重佈線層上，且電性連接重佈線層。光劣化防止層設置於介電層上，且圍繞複數個發光元件。覆蓋層設置於複數個發光元件及光劣化防止層上。其中，光劣化防止層的面積佔覆蓋層的面積的至少50%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure is provided. The package structure includes a dielectric layer, a redistribution layer, a plurality of light-emitting elements, a photodegradation prevention layer, and a cover layer. The redistribution layer is disposed on the dielectric layer. The plurality of light-emitting elements is disposed on the redistribution layer and is electrically connected to the redistribution layer. The photodegradation prevention layer is disposed on the dielectric layer and surrounds the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the photodegradation prevention layer. Wherein, an area of the photodegradation prevention layer accounts for at least 50% of an area of the cover layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:封裝結構</p>
        <p type="p">10:發光元件</p>
        <p type="p">10B:藍光發光元件</p>
        <p type="p">10G:綠光發光元件</p>
        <p type="p">10R:紅光發光元件</p>
        <p type="p">20:覆蓋層</p>
        <p type="p">20E1,20E2,20E3,20E4,30E1,30E2,30E3,30E4:邊緣</p>
        <p type="p">30:光劣化防止層</p>
        <p type="p">44:重佈線層</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">Ia-Ia’,Ib-Ib’:線段</p>
        <p type="p">s1,s1’,s2,s2’:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="483" publication-number="202619026">
    <tif-files tif-type="multi-tif">
      <tif file="113140729.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01L21/762</main-classification>
        <further-classification edition="200601120241230B">H01L21/764</further-classification>
        <further-classification edition="200601120241230B">H01L21/60</further-classification>
        <further-classification edition="200601120241230B">H01L23/535</further-classification>
        <further-classification edition="200601120241230B">H01L23/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　曉飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XIAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　志飈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZHIBIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　劍飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, JIANFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先形成一金屬間介電層於一基底之邏輯區以及電容區上，然後形成第一金屬內連線於邏輯區以及第二金屬內連線於電容區的金屬間介電層內，去除第二金屬內連線旁之金屬間介電層，再形成一高介電常數介電層於第一金屬內連線上並延伸至第二金屬內連線旁，其中高介電常數介電層環繞一氣孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for fabricating a semiconductor device includes the steps of first forming an inter-metal dielectric (IMD) layer on the logic region and the capacitor region of a substrate, forming a first metal interconnection in the IMD layer of the logic region and a second metal interconnection in the IMD layer of the capacitor region, removing the IMD layer adjacent to the second metal interconnection, and then forming a high-k dielectric layer on the first metal interconnection and extending to the second metal interconnection. Preferably, the high-k dielectric layer encloses an air gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基底</p>
        <p type="p">14:邏輯區</p>
        <p type="p">16:電容區</p>
        <p type="p">18:金屬間介電層</p>
        <p type="p">20:金屬內連線</p>
        <p type="p">24:高介電常數介電層</p>
        <p type="p">26:氣孔</p>
        <p type="p">28:停止層</p>
        <p type="p">38:金屬間介電層</p>
        <p type="p">40:金屬內連線</p>
        <p type="p">44:高介電常數介電層</p>
        <p type="p">46:氣孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="484" publication-number="202618509">
    <tif-files tif-type="multi-tif">
      <tif file="113140733.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140733</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>退出組件、固定架與電子裝置</chinese-title>
        <english-title>REMOVAL ASSEMBLY, FIXING FRAME AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G06F1/16</main-classification>
        <further-classification edition="200601120241230B">H05K7/12</further-classification>
        <further-classification edition="200601120241230B">H05K7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林韋帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種退出組件，用以將一導引件內沿一安裝方向滑動地置入的一介面卡退出導引件。退出組件包含一滑移件、一升降件以及一推移件。滑移件用以可沿安裝方向與反向之一退出方向移動地設置於導引件。升降件可沿相異於安裝方向與退出方向的一升降方向移動地設置於滑移件。推移件可沿安裝方向與退出方向移動地設置於滑移件。推移件選擇性地沿退出方向移動，以在升降方向上將升降件抬升至介面卡的一凹槽內，並在退出方向上推動滑移件。被推動的滑移件透過升降件在退出方向上推動介面卡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A removal assembly is configured to remove an interface card that is slidably placed into a guiding element along a mounting direction. The removal assembly includes a sliding element, a lifted element and a lifting element. The sliding element is configured to be movably disposed on the guiding element along the mounting direction and a removal direction opposite to the mounting direction. The lifted element is movably disposed on the sliding element along a lifting direction different from the mounting direction and the removal direction. The lifting element is movably disposed on the sliding element along the mounting direction and the removal direction. The lifting element selectively moves along the removal direction to lift the lifted element into a recess of the interface card in the lifting direction and to push the sliding element in the removal direction. The sliding element that is pushed by the lifting element pushes the interface card in the removal direction through the lifted element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">11:主機板</p>
        <p type="p">12:連接器</p>
        <p type="p">13:固定架</p>
        <p type="p">100:導引件</p>
        <p type="p">200:退出組件</p>
        <p type="p">300:觸發組件</p>
        <p type="p">14:介面卡</p>
        <p type="p">D1:安裝方向</p>
        <p type="p">D2:第一方向</p>
        <p type="p">D3:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="485" publication-number="202618741">
    <tif-files tif-type="multi-tif">
      <tif file="113140734.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140734</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>像素電路與像素電路的驅動方法</chinese-title>
        <english-title>PIXEL CIRCUIT AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241230B">G09G3/32</main-classification>
        <further-classification edition="200601120241230B">G09G5/10</further-classification>
        <further-classification edition="202001120241230B">H05B45/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉彥緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林煒力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種像素電路與其驅動方法。像素電路包括電容器、重置電路、寫入電路、驅動電路以及發光二極體。電容器耦接至一節點。重置電路受控於重置訊號，用以依據參考電壓重置節點上的電壓。寫入電路受控於寫入訊號，用以將灰階電壓寫入至電容器。驅動電路受控於驅動訊號，用以依據節點的電壓產生驅動電流以驅動發光二極體。重置訊號的致能期間部分地重疊於寫入訊號的致能期間，使灰階電壓寫入至電容器的同時參考電壓施加於節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a pixel circuit and its driving method. The pixel circuit includes a capacitor, a reset circuit, a writing circuit, a driving circuit, and a light-emitting diode (LED). The capacitor is coupled to a node. The reset circuit is controlled by a reset signal and configured to reset the voltage at the node based on a reference voltage. The writing circuit is controlled by a writing signal and is configured to write a gray-level voltage into the capacitor. The driving circuit is controlled by a driving signal and is configured to generate a driving current to drive the LED based on the voltage of the node. The enabling period of the reset signal partially overlaps with the enabling period of the writing signal, allowing the reference voltage to be applied to the node while the gray-level voltage is written to the capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310,320,330,341,342:致能期間</p>
        <p type="p">351:第一期間</p>
        <p type="p">352:第二期間</p>
        <p type="p">EM:驅動訊號</p>
        <p type="p">RS:重置訊號</p>
        <p type="p">WR:寫入訊號</p>
        <p type="p">Vsig:灰階電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="486" publication-number="202619370">
    <tif-files tif-type="multi-tif">
      <tif file="113140736.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140736</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含揚聲器之多媒體裝置之控制方法</chinese-title>
        <english-title>CONTROL METHOD OF MULTIMEDIA DEVICE INCLUDING SPEAKERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">H04R5/02</main-classification>
        <further-classification edition="200601120250205B">H04R5/04</further-classification>
        <further-classification edition="200601120250205B">H04R3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾聯碩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡柏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種包含揚聲器之多媒體裝置之控制方法，其包含以下步驟：設置第一揚聲器及第二揚聲器，第一揚聲器包含第一喇叭及第一控制器，第二揚聲器包含第二喇叭及第二控制器；將第二線路輸入埠耦接於第一線路輸出埠，通過數位生活網路聯盟協議使第一揚聲器及第二揚聲器形成網路拓撲架構；通過音訊傳送裝置傳送音訊至第一音訊接收器或第二音訊接收器；通過網路拓撲架構選擇第一揚聲器或第二揚聲器，於第一喇叭或第二喇叭播放音訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method of multimedia device including speakers is disclosed. The control method includes the following steps: Disposing a first speaker device and a second speaker device. The first speaker device includes a first speaker and a first controller. The second speaker device includes a second speaker and a second controller. Coupling the second line in port to the first line out port, and the first speaker and the second speaker forming a network topology through the Digital Living Network Alliance protocol. Transmitting audio to the first audio receiver or the second audio receiver by an audio transmission device. Selectin the first speaker device or the second speaker device through the network topology and playing the audio on the first speaker or the second speaker.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01~S04:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="487" publication-number="202619369">
    <tif-files tif-type="multi-tif">
      <tif file="113140737.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140737</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廣播系統</chinese-title>
        <english-title>BROADCASTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04R3/12</main-classification>
        <further-classification edition="200601120250203B">H04R27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾聯碩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡柏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種廣播系統，其應用於一場域。廣播系統包含多個嵌入式播放裝置及控制裝置。多個嵌入式播放裝置設置於場域中的多個區域並播放音訊。控制裝置電性連接至多個嵌入式播放裝置。嵌入式播放裝置具有音訊接收模組、第一通訊介面及第二通訊介面。音訊接收模組及第一通訊介面配置以接收音訊。第二通訊介面配置以輸出音訊。控制裝置配置以傳送音訊至其中一嵌入式播放裝置，以使多個嵌入式播放裝置播放音訊。其中，通訊介面對應於DLNA協議，以使多個嵌入式播放裝置形成Networktopology架構，且區域中的多個嵌入式播放裝置形成一群組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a broadcasting system, which is applied in a field. The broadcasting system includes a plurality of embedded players and a control device. The embedded players are installed in a plurality of areas of the field and play audio. The control device is electrically connected to the embedded players. The embedded player has an audio receiving module, a first communication interface and a second communication interface. The audio receiving module and the first communication interface are configured to receive audio. The second communication interface is configured to output audio. The control device is configured to send audio to one of the embedded players, so that all of embedded players play audio. The communication interface corresponds to the DLNA protocol, so that the embedded players form the Networktopology architecture, and the embedded players in the area form a group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S:廣播系統</p>
        <p type="p">1:嵌入式播放裝置</p>
        <p type="p">4:控制裝置</p>
        <p type="p">41:第一音訊</p>
        <p type="p">5:外部電子裝置</p>
        <p type="p">51:第二音訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="488" publication-number="202618144">
    <tif-files tif-type="multi-tif">
      <tif file="113140741.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具除塵裝置之線性滑軌</chinese-title>
        <english-title>LINEAR RAIL WITH DUST REMOVAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241115B">F16C29/06</main-classification>
        <further-classification edition="200601120241115B">F16C29/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銀泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRECISION MOTION INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀穎旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YING MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係一種具除塵裝置之線性滑軌，包括滑軌、滑塊、端蓋及除塵裝置。滑塊可移動地設置在滑軌上。端蓋結合在滑塊的一端面。除塵裝置包括結合在滑塊的一側的刮刷片及設置在刮刷片中的振盪元件；據此達到對線性滑軌提供除塵作用，進而維持線性滑軌的正常運行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A linear rail with a dust removal device including a guide rail, a slider, an end cap, and a dust removal device. The slider is movably disposed on the guide rail. The end cap is integrated on one end of the slider. The dust removal device includes a scraping blade combined on one side of the slider and an oscillating element disposed in the scraping blade; thus, the purpose to remove dust and maintain the normal operation of the linear rail are achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:線性滑軌</p>
        <p type="p">10:滑軌</p>
        <p type="p">20:滑塊</p>
        <p type="p">30:端蓋</p>
        <p type="p">40:除塵裝置</p>
        <p type="p">400:安裝空間</p>
        <p type="p">41:刮刷片</p>
        <p type="p">42:振盪元件</p>
        <p type="p">43:定位片</p>
        <p type="p">44:吸震片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="489" publication-number="202618378">
    <tif-files tif-type="multi-tif">
      <tif file="113140751.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝影光學系統、取像裝置及電子裝置</chinese-title>
        <english-title>PHOTOGRAPHING OPTICAL SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G02B11/32</main-classification>
        <further-classification edition="200601120241230B">G02B3/00</further-classification>
        <further-classification edition="202101120241230B">G02B7/02</further-classification>
        <further-classification edition="202101120241230B">G03B17/12</further-classification>
        <further-classification edition="202101120241230B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯郁淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖冠智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, GUAN-JR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝影光學系統，包含六片透鏡。六片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡與第六透鏡。六片透鏡分別具有朝向物側方向的物側表面與朝向像側方向的像側表面。第一透鏡具有正屈折力。第二透鏡具有負屈折力。第三透鏡具有正屈折力。第四透鏡具有正屈折力，且第四透鏡物側表面於近光軸處為凹面。第五透鏡具有負屈折力，且第五透鏡物側表面於近光軸處為凸面。第六透鏡像側表面具有至少一反曲點。當滿足特定條件時，攝影光學系統能同時滿足微型化、廣視角和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photographing optical system includes six lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. Each of the six lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has positive refractive power. The fourth lens element has positive refractive power, and the object-side surface of the fourth lens element is concave in a paraxial region thereof. The fifth lens element has negative refractive power, and the object-side surface of the fifth lens element is convex in a paraxial region thereof. The image-side surface of the sixth lens element has at least one inflection point. When specific conditions are satisfied, the requirements of compact size, wide field of view and high image quality can be met by the photographing optical system, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">S1,S2:光闌</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="490" publication-number="202618602">
    <tif-files tif-type="multi-tif">
      <tif file="113140753.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板佈線方法、裝置、電子設備及可讀存儲介質</chinese-title>
        <english-title>CIRCUIT BOARD ROUTING METHOD, DEVICE, ELECTRONIC APPARATUS AND READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241204B">G06F30/33</main-classification>
        <further-classification edition="202001120241204B">G06F30/398</further-classification>
        <further-classification edition="202001320241204B">G06F115/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鴻富錦精密工業（武漢）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒子昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, ZI-ANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種電路板佈線方法、裝置、電子設備及可讀存儲介質。電路板佈線方法包括：獲取電路板上之設計缺陷；根據預設之評分規則獲得設計缺陷之評估分數；根據評估分數確定設計缺陷之修改方案，並根據修改方案對設計缺陷進行修改。本申請能夠基於評估分數確定複數設計缺陷之修改難易程度，還能夠根據評估分數確定設計缺陷之修改方案，確保每個設計缺陷均能得到最合適之修改方案，提高了修改之成功率與效率，從而提升了電路板設計之總體品質。本申請可適應不同複雜度之電路板設計，具有較好之通用性與擴展性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a circuit board routing method, a device, an electronic apparatus and a readable storage medium. The circuit board routing method includes: obtaining design defects on a circuit board; obtaining an evaluation score for the design defects according to a predetermined scoring rule; determining a modification scheme for the design defects based on the evaluation score; and modifying the design defects according to the modification scheme. The application can determine a difficulty for modifying one or more design defects based on the evaluation score, and determine the modification scheme for design defects based on the evaluation score, thereby ensuring that each design defect can be provided the most suitable modification plan, improving a success rate and an efficiency of modification, and enhancing the overall quality of the circuit board design. The application adapts to different complexity levels of the circuit board design and has good generality and extensibility.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S12:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="491" publication-number="202618203">
    <tif-files tif-type="multi-tif">
      <tif file="113140764.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱模組及伺服器</chinese-title>
        <english-title>HEAT DISSIPATION MODULE AND SERVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241108B">F28F1/16</main-classification>
        <further-classification edition="200601120241108B">F28F13/08</further-classification>
        <further-classification edition="200601120241108B">F04D25/08</further-classification>
        <further-classification edition="200601120241108B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹承學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAN, CHENG-SHIUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江志文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃奕穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, I-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜青亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHING-YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱模組，包括管路及第一風扇。管路包括加速區、高速區、導入區及增流區。加速區包括第一端面、第二端面及第一斜面，第一斜面的一側鄰近第一端面，另一側鄰近第二端面。第一斜面到管路中心軸的距離由鄰近第一端面的一側往鄰近第二端面的另一側遞減。高速區連接於第二端面。導入區包括第三端面、第四端面及第二斜面。第三端面連接於高速區，第二斜面的一側鄰近第三端面，另一側鄰近第四端面。第二斜面到管路中心軸的距離由鄰近第三端的一側面往鄰近第四端面的另一側遞增。增流區連接於第四端面。此外，一種伺服器亦被提及。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation module including a pipeline and a first fan is provided. The pipeline includes an acceleration zone, a high-speed zone, an introduction zone and an increased zone. The acceleration zone includes a first end surface, a second end surface and a first slope. One side of the first slope is adjacent to the first end surface and the other side is adjacent to the second end surface. A distance of the first slope to a pipeline central axis decreases from one side adjacent to the first end surface to the other side adjacent to the second end surface. The high-speed zone is connected to the second end surface. The introduction zone includes a third end surface, a fourth end surface and a second slope. The third end surface is connected to the high-speed zone. One side of the second slope is adjacent to the third end surface and the other side is adjacent to the fourth end surface. A distance of the second slope to the pipeline central axis increases from one side adjacent to the third end surface to the other side adjacent to the fourth end surface. The increased zone is connected to the fourth end surface. In addition, a server is also mentioned.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C1:氣流</p>
        <p type="p">C2:輔助氣流</p>
        <p type="p">E1:第一端面</p>
        <p type="p">E2:第二端面</p>
        <p type="p">E3:第三端面</p>
        <p type="p">E4:第四端面</p>
        <p type="p">E5:第五端面</p>
        <p type="p">E6:第六端面</p>
        <p type="p">E7:第七端面</p>
        <p type="p">E8:第八端面</p>
        <p type="p">L1、L2、L3、L4:長度</p>
        <p type="p">L5:管路中心軸</p>
        <p type="p">P1、P2:空間</p>
        <p type="p">S1:第一斜面</p>
        <p type="p">S2:第二斜面</p>
        <p type="p">20:散熱模組</p>
        <p type="p">110:殼體</p>
        <p type="p">111:第一面</p>
        <p type="p">112:第二面</p>
        <p type="p">120:熱源</p>
        <p type="p">210:管路</p>
        <p type="p">211:加速區</p>
        <p type="p">212:高速區</p>
        <p type="p">213:導入區</p>
        <p type="p">214:增流區</p>
        <p type="p">215:管路開孔</p>
        <p type="p">220:第一風扇</p>
        <p type="p">230:第二風扇</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="492" publication-number="202618936">
    <tif-files tif-type="multi-tif">
      <tif file="113140765.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成半導體裝置的方法</chinese-title>
        <english-title>METHOD FOR FORMING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">H01L21/50</main-classification>
        <further-classification edition="200601120241106B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪培榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, PEI-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂俊麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種形成半導體元件的方法，其包括以下步驟。提供第一晶圓。第一晶圓包括第一基底以及形成於第一基底上的第一內連線層。提供第二晶圓。第二晶圓包括第二基底以及形成於第二基底上的第二內連線層。將第二晶圓堆疊至第一晶圓上。對第二晶圓的第二基底進行薄化製程。執行邊緣修整製程，以沿著第二晶圓的周邊移除第二內連線層及第二基底的一部分，其中邊緣修整製程使得第一晶圓具有凹陷表面。於凹陷表面上形成環繞經薄化及經邊緣修整的第二晶圓的側壁的保護層，以形成晶圓堆疊結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for forming a semiconductor device. A first wafer including a first substrate and a first interconnection layer formed on the first substrate is provided. A second wafer including a second substrate and a second interconnection layer formed on the second substrate is provided. The second wafer is stacked on the first wafer. A thinning process is performed on the second substrate of the second wafer. An edge trimming process is performed to remove portions of the second interconnection layer and the second substrate along a perimeter of the second wafer, wherein the edge trimming process results in the first wafer having a recessed surface. A protective layer, surrounding a sidewall of the thinned and edge-trimmed second wafer, is formed on the recessed surface to form a wafer stack structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:晶圓堆疊結構</p>
        <p type="p">100a:第一基底</p>
        <p type="p">200a:第二基底</p>
        <p type="p">110a:第一內連線層</p>
        <p type="p">210a:第二內連線層</p>
        <p type="p">1000a:保護層/第一保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="493" publication-number="202616947">
    <tif-files tif-type="multi-tif">
      <tif file="113140768.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合式寵物複合機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A01K29/00</main-classification>
        <further-classification edition="200601120241230B">A01K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣松下電器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昭穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王忠義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組合式寵物複合機，包含至少一複合裝置，及一主體裝置。該複合裝置包括一具有一第一連接埠的複合座，及一安裝在該複合座的照護單元。該主體裝置包括一具有一主連接埠的主體座、一安裝在該主體座的電控單元，及至少一安裝在該主體座的照護單元。該主連接埠電連接於該第一連接埠且外形配合該第一連接埠。該電控單元用於輸出一電控信號，使對應的照護單元根據該電控信號執行一指令集。該指令集被配置為用於釋放物料、使水流動、獲取影像、或獲取一相關於寵物的感測數據。藉此，只需管理該主體裝置就可以控制所有的照護單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合裝置</p>
        <p type="p">11:複合座</p>
        <p type="p">111:第一連接埠</p>
        <p type="p">12:照護單元</p>
        <p type="p">2:主體裝置</p>
        <p type="p">21:主體座</p>
        <p type="p">211:主連接埠</p>
        <p type="p">23:照護單元</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="494" publication-number="202617270">
    <tif-files tif-type="multi-tif">
      <tif file="113140769.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓力產生裝置及包含該壓力產生裝置的檢測系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">B01L3/00</main-classification>
        <further-classification edition="200601120250203B">G01N33/50</further-classification>
        <further-classification edition="200601120250203B">A61B17/435</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英緹生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTI TAIWAN, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝易樵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, I-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雍翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓力產生裝置，包含一槽體、一可變形膜、一驅動裝置及一連接單元。該槽體具有一腔室，並包括均與該腔室流體連通的一開口及一連通口。該可變形膜設置為密封該開口。該驅動裝置具有一驅動軸，該驅動軸的一端朝向該可變形膜。該連接單元配置為耦接該驅動軸及該可變形膜，使該可變形膜受該驅動軸之驅動而在一平坦狀態及一變形狀態之間變換。一種檢測系統，包含該壓力產生裝置，用於一待測樣品的品質檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓力產生裝置</p>
        <p type="p">10:槽體</p>
        <p type="p">11:主殼件</p>
        <p type="p">111:封閉端</p>
        <p type="p">112:連接端</p>
        <p type="p">12:側殼件</p>
        <p type="p">121:側殼本體</p>
        <p type="p">122:遠端</p>
        <p type="p">142:連接桿</p>
        <p type="p">20:可變形膜</p>
        <p type="p">30:驅動裝置</p>
        <p type="p">31:馬達本體</p>
        <p type="p">32:驅動軸</p>
        <p type="p">313:法蘭部</p>
        <p type="p">40:連接單元</p>
        <p type="p">80:光感測器</p>
        <p type="p">81:電路板</p>
        <p type="p">90:標誌件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="495" publication-number="202618684">
    <tif-files tif-type="multi-tif">
      <tif file="113140770.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>揮拳動作分析方法及其系統</chinese-title>
        <english-title>BOXING MOTION ANALYSIS METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250418B">G06T3/067</main-classification>
        <further-classification edition="202201120250418B">G06V10/764</further-classification>
        <further-classification edition="201301120250418B">G01P15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昀儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許鎧博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李禹承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種揮拳動作分析系統包含一慣性感測器、一通訊裝置、及一電腦設備，並執行一揮拳動作分析方法，其包含：藉由該慣性感測器設置於該使用者的一手腕位置，以偵測該使用者的揮拳動作，而產生多個加速度值；藉由該電腦設備對該等加速度值作訊號裁切，以獲得對應每一次揮拳動作的該等加速度值且再對該等加速度值作動態校正；及藉由該電腦設備對每一該揮拳動作的該等加速度值作四元數的計算，而獲得多個旋轉後加速度值，並再對該等旋轉後加速度值作一次積分與二次積分，以獲得多個速度值及多個位置，而能夠獲得對應每一該揮拳動作的一軌跡圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A boxing motion analysis system includes an IMU, a communicating device, and a computer device and implements a boxing motion analysis method. The boxing motion analysis method includes: the IMU disposed on a wrist position of the user to detect the user's fist movement and generate multiple acceleration values; performing signal clipping on the acceleration values to obtain the acceleration values​corresponding to each punch movement and then dynamically correcting the acceleration values by the computer device; and performing quaternion calculation on the acceleration values​ of each fist movement to obtain a plurality of post-rotation acceleration values, and then performing primary integration and secondary integration on the post-rotation acceleration values to obtain multiple speed values, multiple positions, and a trajectory map corresponding to each punching action by the computer device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S7:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="496" publication-number="202618497">
    <tif-files tif-type="multi-tif">
      <tif file="113140771.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣流路徑控制裝置</chinese-title>
        <english-title>AIRFLOW PATH CONTROL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G05D7/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF NUCLEAR ENERGY RESEARCH, ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭子晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TZU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仲毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊麒永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHI-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種氣流路徑控制裝置，其包含二個三通管件、二集風箱及複數個電動閥。二個三通管件的一端分別連接至出氣連接端及入氣連接端。三通管件的另兩端分別連接二個集風箱。二集風箱分別連接至一輸送管路的兩端。電動閥係設置於三通管件與集風箱之間。氣流路徑控制裝置藉由控制不同的電動閥的啟閉狀態來導引出氣體在同一管路中有不同的輸送方向，以精準地將物件來回輸送，有助於提升生產效率和產品質量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an airflow path control device, which comprises two three-way pipes, two collecting boxes, and a plurality of electric valves. One end of each of the two three-way pipes is connected to an outlet connection and an inlet connection, respectively. The other two ends of the three-way pipe are connected to the two collecting boxes. The two collecting boxes are connected to both ends of a conveying pipeline. Each of the electric valves is installed between the three-way pipes and the collecting boxes. The airflow path control device guides the airflow in different conveying directions within the same pipeline by controlling the on/off states of the electric valves, thereby accurately transporting an object back and forth, which contributes to enhancing production efficiency and product quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:氣流路徑控制裝置</p>
        <p type="p">20:第一三通管件</p>
        <p type="p">21:第一管路端</p>
        <p type="p">22:第二管路端</p>
        <p type="p">23:第三管路端</p>
        <p type="p">30:第二三通管件</p>
        <p type="p">31:第四管路端</p>
        <p type="p">32:第五管路端</p>
        <p type="p">33:第六管路端</p>
        <p type="p">40:第一集風箱</p>
        <p type="p">41:第一風箱端</p>
        <p type="p">42:第二風箱端</p>
        <p type="p">43:第三風箱端</p>
        <p type="p">50:第二集風箱</p>
        <p type="p">51:第四風箱端</p>
        <p type="p">52:第五風箱端</p>
        <p type="p">53:第六風箱端</p>
        <p type="p">61:第一電動閥</p>
        <p type="p">62:第二電動閥</p>
        <p type="p">63:第三電動閥</p>
        <p type="p">64:第四電動閥</p>
        <p type="p">70:輸送管路</p>
        <p type="p">71:第一端</p>
        <p type="p">72:第二端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="497" publication-number="202619529">
    <tif-files tif-type="multi-tif">
      <tif file="113140772.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
        <further-classification edition="200601120250102B">H01L21/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秉宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PING-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旻樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡濱祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, BIN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包含：基底，其上具有低壓元件區及高壓元件區；複數個鰭式場效電晶體，設置於該低壓元件區內；至少一高壓電晶體，設置於該高壓元件區內；以及溝槽隔離結構，設置於該低壓元件區和該高壓元件區之間的該基底中，其中，該溝槽隔離結構包含溝槽填充層以及位於該溝槽填充層和該基底之間的保護調節層，其中，該保護調節層包含一非晶矽層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate having a low-voltage device region and a high-voltage device region thereon; a plurality of finFETs disposed in the low-voltage device region; at least one high-voltage transistor disposed in the high-voltage device region; and a trench isolation structure disposed in the substrate between the low-voltage device region and the high-voltage device region. The trench isolation structure includes a trench-fill layer and a protective condition layer between the trench-fill layer and the substrate. The protective condition layer includes an amorphous silicon layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基底</p>
        <p type="p">102:絕緣層</p>
        <p type="p">102a:頂面</p>
        <p type="p">121:低介電常數側壁子</p>
        <p type="p">122:低介電常數側壁子</p>
        <p type="p">200:溝槽隔離結構</p>
        <p type="p">201:非晶矽層</p>
        <p type="p">202:Si&lt;sub&gt;x&lt;/sub&gt;O&lt;sub&gt;y&lt;/sub&gt;層</p>
        <p type="p">203:溝槽填充層</p>
        <p type="p">221:側壁子</p>
        <p type="p">222:側壁子</p>
        <p type="p">250:介電層</p>
        <p type="p">PCL:保護調節層</p>
        <p type="p">F:鰭結構</p>
        <p type="p">GHM、GLM:金屬閘極</p>
        <p type="p">GLH:高壓閘極氧化層</p>
        <p type="p">GLL:低壓閘極氧化層</p>
        <p type="p">LR:低壓元件區</p>
        <p type="p">LVW:低壓離子井</p>
        <p type="p">HR:低壓元件區</p>
        <p type="p">HVW:高壓離子井</p>
        <p type="p">TL:鰭式場效電晶體</p>
        <p type="p">TH:高壓電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="498" publication-number="202618421">
    <tif-files tif-type="multi-tif">
      <tif file="113140773.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G02F1/1335</main-classification>
        <further-classification edition="200601120241230B">G02F1/13357</further-classification>
        <further-classification edition="200601120241230B">G02B5/12</further-classification>
        <further-classification edition="200601120241230B">G02B13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周廷翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, TING HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉邦炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PANG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱琮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示裝置，包括背光模組、光調制模組以及攝像模組。光調制模組用於調制來自背光模組的光。攝像模組包括鏡頭組件。背光模組位於攝像模組以及光調制模組之間，且背光模組包括第一反射件。第一反射件對應鏡頭組件設置。第一反射件在可見光波段的反射率落在35%至95%的範圍內，在紅外波段的穿透率大於0%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a backlight module, a light modulation module and a camera module is provided. The light modulation module is used to modulate light from the backlight module. The camera module includes a lens assembly. The backlight module is disposed between the camera module and the light modulation module, and includes a first reflective element. The first reflective element is arranged in accordance with the arrangement of the lens assembly. A reflectance of the first reflective element for the visible band ranges from 35% to 95%, and a transmittance of the first reflective element for the infrared band is larger than 0%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">100:背光模組</p>
        <p type="p">100H:開口</p>
        <p type="p">101:光調制模組</p>
        <p type="p">102:增亮膜</p>
        <p type="p">103:擴散片</p>
        <p type="p">104:稜鏡片</p>
        <p type="p">105:擴散板</p>
        <p type="p">106:第二反射件</p>
        <p type="p">107:第一反射件</p>
        <p type="p">108:電路基板</p>
        <p type="p">109:發光元件</p>
        <p type="p">110:背板</p>
        <p type="p">111:攝像模組</p>
        <p type="p">LA:鏡頭組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="499" publication-number="202618650">
    <tif-files tif-type="multi-tif">
      <tif file="113140774.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧換摺系統與方法</chinese-title>
        <english-title>SMART PASSBOOK EXCHANGE SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q40/02</main-classification>
        <further-classification edition="202301120250203B">G06Q40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張麗玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明透過智慧換摺系統與方法，可使得客戶在銀行非營業時間時進行換摺。即使存摺的磁條毀損，智慧換摺系統還可以透過二維碼或者字元辨識的方式取得存摺對應的帳戶資訊以繼續進行補摺以及換摺。除此之外，透過智慧換摺系統，客戶不需要在存摺當前頁面登打滿資訊後手動翻頁以繼續補登，智慧換摺系統可自動將存摺翻至下一頁並繼續補登。如此一來可大幅度節省客戶補摺的時間以及增加客戶換摺的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Through the smart passbook exchange system and method of the present invention, customers can make exchanges of passbook during non-business hours of the bank. Even if the magnetic stripe of the passbook is damaged, the smart exchange system can still obtain the account information corresponding to the passbook through QR code or character recognition to continue to make compensation and exchange of passbook. In addition, through the smart passbook exchange system, customers do not need to manually turn the page after the current page of the passbook is filled with information to continue filling in. The smart passbook exchange system can automatically turn the passbook to the next page and continue to fill in the information. This can greatly save customers’ time in making compensation of passbook and increase the convenience of customers’ passbook exchanges.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智慧換摺系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="500" publication-number="202618148">
    <tif-files tif-type="multi-tif">
      <tif file="113140778.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行星滾柱螺桿</chinese-title>
        <english-title>PLANETARY ROLLER SCREW</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">F16H25/22</main-classification>
        <further-classification edition="200601120250207B">F16H25/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詮豐精密工具股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUAN HONG PRECISION TOOL MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳叁貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SAN-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種行星滾柱螺桿，用以解決習知行星滾柱螺桿在精密運動控制時構造強度不足問題。係包含：一主螺桿具有一外螺紋；一螺母具有一內螺紋；及一行星組具有數個滾柱，且各該滾柱的外周具有一滾柱外螺紋；該外螺紋的螺距、該內螺紋的螺距及該滾柱外螺紋的螺距是相等的；該主螺桿的該外螺紋的螺旋方向與該螺母的該內螺紋的螺旋方向為反向；以該主螺桿、該螺母及該行星組中之一者為一主動件；在轉動該主動件時，該行星組對該螺母的線性移動的方向，與該主螺桿對該行星組的線性移動的方向是相反的。本發明可以達成精密運動控制的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A planetary roller screw is adapted for solving the problem that when the conventional planetary roller screw is designed for precise motion control, the structural strength of the conventional planetary roller screw is not enough. The invented planetary roller screw includes a main threaded rod having an external thread, an internal threaded element having an internal thread, and a planetary assembly having multiple rollers. The outer periphery of each roller has a roller thread. The screw pitch of the external thread, the screw pitch of the internal thread and the screw pitch of the roller thread are the same. The helix direction of the external thread of the main threaded rod is opposite to the helix direction of the internal thread of the internal threaded element. In the situation that one of the main threaded rod, the internal threaded element and the planetary assembly is configured to be a driving element, when the driving element is rotated, the direction of the linear displacement of the planetary assembly to the internal threaded element is opposite to the direction of the linear displacement of the main threaded rod to the planetary assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主螺桿</p>
        <p type="p">11:外螺紋</p>
        <p type="p">11a:螺紋部頂端</p>
        <p type="p">11b:螺紋部底端</p>
        <p type="p">12:連接部</p>
        <p type="p">2:螺母</p>
        <p type="p">2a:螺母頂端</p>
        <p type="p">2b:螺母底端</p>
        <p type="p">20:通孔</p>
        <p type="p">21:內螺紋</p>
        <p type="p">3:行星組</p>
        <p type="p">31:滾柱</p>
        <p type="p">31a:滾柱頂端</p>
        <p type="p">31b:滾柱底端</p>
        <p type="p">311:環紋部</p>
        <p type="p">312:凸出部</p>
        <p type="p">32:環架部</p>
        <p type="p">320:容置部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="501" publication-number="202617940">
    <tif-files tif-type="multi-tif">
      <tif file="113140787.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140787</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶配向劑、液晶配向膜及液晶顯示元件</chinese-title>
        <english-title>LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">C09K19/56</main-classification>
        <further-classification edition="200601120241118B">C09K19/38</further-classification>
        <further-classification edition="200601120241118B">C08J5/18</further-classification>
        <further-classification edition="200601120241118B">C08L79/08</further-classification>
        <further-classification edition="200601120241118B">C08L83/04</further-classification>
        <further-classification edition="200601120241118B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇美實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI MEI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱信融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, SHINRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡東賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係有關一種信賴性佳、液晶接觸角低的液晶配向劑、液晶配向膜及液晶顯示元件。該液晶配向劑包含：聚合物(A)，包含第一聚合物(A1)，該第一聚合物(A1)由第一混合物反應而製得，該第一混合物包含四羧酸二酐組份(a1)及二胺組份(a2)，其中該第一聚合物(A1)是選自聚醯胺酸聚合物、聚醯亞胺聚合物、聚醯亞胺系嵌段共聚合物或上述聚合物的組合；聚矽氧烷(B)，由含異氰酸酯基的聚矽氧烷(b1)與化合物(b2)反應所製得，且該含異氰酸酯基的聚矽氧烷(b1)係由一第三混合物經聚縮合而得；及溶劑(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a liquid crystal alignment agent having good reliability and low pretilt angle, a liquid crystal alignment film and a liquid crystal display element. The liquid crystal alignment agent includes a polymer (A), a polysiloxane (B) and a solvent (C). The polymer (A) includes a first polymer (A1) formed by reacting a first mixture including a tetracarboxylic acid dianhydride component (a1) and a diamine component (a2), and the first polymer (A1) is selected from a polyamide acid polymer, a polyimide polymer, a polyimide-based block copolymer or a combination thereof. The polysiloxane (B) is formed by reacting a polysiloxane (b1) containing an isocyanate group with a compound (b2), and the polysiloxane (b1) containing the isocyanate group is formed by polycondensation of a third mixture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="502" publication-number="202618484">
    <tif-files tif-type="multi-tif">
      <tif file="113140789.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置測試方法與電子裝置測試系統</chinese-title>
        <english-title>ELECTRONIC DEVICE TESTING METHOD AND ELECTRONIC DEVICE TESTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">G05B23/02</main-classification>
        <further-classification edition="202201120250217B">G06V10/10</further-classification>
        <further-classification edition="202201120250217B">G06V10/20</further-classification>
        <further-classification edition="202201120250217B">G06V30/19</further-classification>
        <further-classification edition="202201120250217B">G06V10/764</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商華科全球股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUS GLOBAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種電子裝置測試方法與電子裝置測試系統。所述方法包括下列步驟。透過一攝像裝置拍攝一受測電子裝置所顯示的顯示影像。透過分析受測電子裝置的顯示影像，決定一自動化控制指令。發送自動化控制指令至受測電子裝置或一外部執行裝置，以控制受測電子裝置執行相對於自動化控制指令的目標操作。於受測電子裝置執行目標操作的期間，執行受測電子裝置的裝置測試程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device testing method and an electronic device testing system are provided. The method includes the following steps. A display image displayed by an electronic device under test is captured through a camera device. By analyzing the display image of the electronic device under test, an automatic control command is determined. The automation control instruction is sent to the electronic device under test or an external execution device to control the electronic device under test to perform a target operation relative to the automation control instruction. While the electronic device under test performs the target operation, a device testing procedure of the electronic device under test is executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="503" publication-number="202618531">
    <tif-files tif-type="multi-tif">
      <tif file="113140790.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容式觸控顯示裝置及其喚醒方法</chinese-title>
        <english-title>CAPACITIVE TOUCH DISPLAY DEVICE AND WAKE-UP METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241202B">G06F3/044</main-classification>
        <further-classification edition="201901120241202B">G06F1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奕力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILI TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電容式觸控顯示裝置及其喚醒方法。控制觸控顯示面板調整用於感測第一觸控工具的觸控感測掃描頻率或第二觸控工具的下行信號的頻率，而使觸控顯示面板在包括觸控感測掃描頻率的預設頻率範圍內能夠感測到第一觸控工具與第二觸控工具的觸控操作。於觸控感測期間控制觸控面板同時感測第一觸控工具與第二觸控工具的觸控操作。反應於觸控感測期間觸控顯示面板感測到觸控操作，喚醒電容式觸控顯示裝置進入正常模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitive touch display device and a wake-up method thereof are provided. A touch display panel is controlled to adjust a touch sensing scanning frequency for sensing a first touch tool or a frequency of a downlink signal of a second touch tool, so that the touch display panel is able to detect touch operations of the first touch tool and the second touch tool within a preset frequency range including the touch sensing scanning frequency. During a touch sensing period, the touch panel is controlled to simultaneously sense the touch operations of the first touch tool and the second touch tool. In response to a touch operation is sensed by the touch display panel during the touch sensing period, the capacitive touch display device is waked up and enters a normal mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電容式觸控顯示裝置</p>
        <p type="p">102:控制電路</p>
        <p type="p">104:觸控顯示面板</p>
        <p type="p">T1:第一觸控工具</p>
        <p type="p">T2:第二觸控工具</p>
        <p type="p">SU:上行信號</p>
        <p type="p">SD:下行信號</p>
        <p type="p">TD:觸控感測</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="504" publication-number="202618230">
    <tif-files tif-type="multi-tif">
      <tif file="113140804.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140804</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>力感測裝置、柔性夾爪與使用力感測裝置測量與分辨外力的方式</chinese-title>
        <english-title>FORCE SENSING DEVICE, FLEXIBLE CLAMPING JAW AND METHOD OF MEASURING AND DISTINGUISHING EXTERNAL FORCE BY FORCE SENSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241204B">G01L5/162</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, JENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪維松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　志向</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALAWA, EDMUN IRO KAVALO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種力感測裝置包含壓電感測器。壓電感測器包含螺旋感測層、導線、導電膠與外部保護層。螺旋感測層為柔性導體材料，配置用以測量複數個種類的外力的大小所造成的複數個電壓信號。導線電性連接螺旋感測層。導電膠連接導線的一部分與螺旋感測層的一部分。外部保護層包覆螺旋感測層，其中外部保護層為柔性絕緣材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A force sensing device includes a piezoelectric sensor including a spiral sensing layer, a conductive wire, a conductive adhesive, and an outer protective layer. The spiral sensing layer is a flexible conductive material, and is configured to measure a plurality voltage signals caused by a plurality kinds of external forces. A portion of the conductive wire is electrically connected to the spiral sensing layer. The conductive adhesive connects a portion of the spiral sensing layer and a portion of the conductive wire. The outer protective layer wraps the spiral sensing layer, and the outer protective layer is a flexible insulating material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓電感測器</p>
        <p type="p">110:螺旋感測層</p>
        <p type="p">120:導線</p>
        <p type="p">130:導電膠</p>
        <p type="p">140:外部保護層</p>
        <p type="p">150:絕緣棒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="505" publication-number="202618309">
    <tif-files tif-type="multi-tif">
      <tif file="113140806.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>被動元件量測系統</chinese-title>
        <english-title>MEASUREMENT SYSTEM OF PASSIVE COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250408B">G01R27/26</main-classification>
        <further-classification edition="200601120250408B">G01R27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國巨股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGEO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔旻彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, MIN CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇逸民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種被動元件量測系統，包含入料漏斗、送料軌道、收料平台、取放頭模組、切換器及計算裝置。入料漏斗用以盛裝待測的被動元件。送料軌道用以將被動元件輸送至待取位置。收料平台用以收集測試完成之被動元件。取放頭模組包含用以從待取位置吸取被動元件並放置於量測區的第一區吸嘴及用以從量測區吸取被動元件並放置於收料平台的第二區吸嘴。切換器用以切換量測儀器以量測置於量測區之被動元件。計算裝置用以控制取放頭模組吸取並放置被動元件，並控制切換器切換量測儀器以量測被動元件，以得到電性量測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A measurement system of passive component includes a feeding funnel, a feeding track, a collecting platform, a pick-and-place head module, a switcher, and a computing device. The feeding funnel is utilized to contain passive components to be tested. The feeding track is utilized to transport the passive components to a waiting position. The collecting platform is utilized to collect the passive components after testing. The pick-and-place head module includes a first-area nozzle for picking up the passive components from the waiting position and placing them on a measurement area, and a second-area nozzle for picking up the passive components from the measurement area and placing them on the collecting platform. The switcher is utilized to switch measuring instruments to measure the passive components placed on the measurement area. The computing device is utilized to control the pick-and-place head module to pick up and place the passive components, and control the switcher to switch the measuring instruments to measure the passive components to obtain electrical measurement results.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:被動元件量測系統</p>
        <p type="p">104:入料漏斗</p>
        <p type="p">106:送料軌道</p>
        <p type="p">112:計算裝置</p>
        <p type="p">114:電容值允差規格與損失角量測儀器</p>
        <p type="p">116:絕緣阻抗量測儀器</p>
        <p type="p">118:耐壓量測儀器</p>
        <p type="p">120:切換器</p>
        <p type="p">124:卷軸</p>
        <p type="p">126:傳動馬達</p>
        <p type="p">128:收料平台</p>
        <p type="p">134:取放頭模組</p>
        <p type="p">B:工作桌</p>
        <p type="p">M:量測區</p>
        <p type="p">P:被動元件</p>
        <p type="p">R2:收料平台行程軌道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="506" publication-number="202618149">
    <tif-files tif-type="multi-tif">
      <tif file="113140807.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具除塵裝置之滾珠螺桿</chinese-title>
        <english-title>BALL SCREW WITH DUST REMOVAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241115B">F16H25/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銀泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRECISION MOTION INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀穎旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YING-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係一種具除塵裝置之滾珠螺桿，包括螺桿、螺帽及除塵裝置。螺帽螺合在螺桿上。除塵裝置設置在螺帽上，包括環座及振盪元件。環座結合在螺帽的一側。振盪元件設置在環座中。據此達到對滾珠螺桿進行除塵的目的，從而維持滾珠螺桿的正常運行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ball screw with a dust removal device is disclosed. The ball screw includes a screw, a nut, and a dust removal device. The nut is threaded onto the screw. The dust removal device includes a ring seat and an oscillating element. The ring seat is combined on one side of the nut. The oscillating element is placed in the ring seat. Thus, a dust removal device for the ball screw is installed to maintain the operation of the ball screw.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:滾珠螺桿</p>
        <p type="p">2:滾珠</p>
        <p type="p">10:螺桿</p>
        <p type="p">20:螺帽</p>
        <p type="p">23:螺旋溝槽</p>
        <p type="p">30:除塵裝置</p>
        <p type="p">300:安裝空間</p>
        <p type="p">31:環座</p>
        <p type="p">32:振盪元件</p>
        <p type="p">33:環體</p>
        <p type="p">331:環溝</p>
        <p type="p">34:罩蓋</p>
        <p type="p">35:吸震片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="507" publication-number="202617462">
    <tif-files tif-type="multi-tif">
      <tif file="113140810.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池交換之電池選擇方法及其電池能源站</chinese-title>
        <english-title>BATTERY SELECTION METHODS FOR BATTERY EXCHANGE AND BATTERY ENERGY STATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241128B">B60L53/62</main-classification>
        <further-classification edition="201901120241128B">B60L53/68</further-classification>
        <further-classification edition="200601120241128B">H02J7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉育睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池交換之電池選擇方法，適用於用以收納且對複數電池進行充電之一電池能源站。首先，接收一電池交換要求。接著，取得相應電池能源站中每一電池之一荷電狀態，並依據每一電池之荷電狀態，將電池進行排序，以成為複數候選電池。相應於該電池交換要求，執行一第一選定作業。在第一選定作業中，當存在具有次高荷電狀態之複數第一候選電池時，選擇並提供第一候選電池。當第一候選電池不存在時，若相應最高荷電狀態之一第二候選電池及次高荷電狀態之一第三候選電池之荷電狀態的差小於或等於一第一既定臨限值或比率時，選擇並提供第二候選電池及第三候選電池。當前述荷電狀態的差並未小於或等於第一既定臨限值或比率時，將第二候選電池排除於候選電池之外，並重新執行第一選定作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Battery selection methods for battery exchange are provided, which are suitable for a battery energy station used for storing and charging a plurality of batteries. First, a battery exchange request is received. Then, the state of charge (SOC) of each battery in the battery energy station is obtained, and the batteries are sorted according to the SOC of each battery to become a plurality of candidate batteries. In response to the battery exchange request, a first selected operation is performed. In the first selection operation, when a plurality of first candidate batteries having the next highest SOC exist, the first candidate batteries are selected and provided. When the first candidate batteries do not exist, and the difference in SOC between a second candidate battery with the highest SOC and a third candidate battery with the second highest SOC is less than or equal to a first predetermined threshold value or ratio, the second candidate battery and the third candidate battery are selected and provided. When the difference in SOC is not less than or equal to the first predetermined threshold value or ratio, the second candidate battery is excluded from the candidate batteries, and the first selection operation is re-executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420、S430、S440、S450:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="508" publication-number="202617328">
    <tif-files tif-type="multi-tif">
      <tif file="113140816.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工機用刀套及用於製作一刀套本體的注塑模具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B23Q3/00</main-classification>
        <further-classification edition="200601120241204B">B29C45/73</further-classification>
        <further-classification edition="200601320241204B">B29L31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖杰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANJET INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慶三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種加工機使用之刀套係包含一刀套本體、一鎖刀裝置及一定位塊。其中該刀套本體具有一套接孔供一刀把之一錐柄插入；該鎖刀裝置用以對插入該套接孔之該錐柄提供一徑向力；該定位塊具有一定位部凸露於該套接孔中，該定位部嵌入該刀把之該定位槽中，使得該刀把無法相對該刀套本體轉動。此外，一注塑模具可以用來製作前述的刀套本體，該注塑模具能夠通過調整部分組件的位置，來生產出多款的刀套本體，且不同款的刀套本體具備的定位結構位於不同方位上，如此可以大幅降低使用多付模具的成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:刀套</p>
        <p type="p">10:刀套本體</p>
        <p type="p">12b:徑向孔</p>
        <p type="p">14:套接孔</p>
        <p type="p">14a:內凸部</p>
        <p type="p">200:刀把</p>
        <p type="p">201:錐柄</p>
        <p type="p">201a:端面</p>
        <p type="p">201b:外周面</p>
        <p type="p">201c:外凸部</p>
        <p type="p">202:軸孔</p>
        <p type="p">203:環形槽</p>
        <p type="p">204:定位槽</p>
        <p type="p">L:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="509" publication-number="202618115">
    <tif-files tif-type="multi-tif">
      <tif file="113140820.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140820</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>櫥櫃鉸鏈</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">E05D7/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡雨霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡雨霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種櫥櫃鉸鏈，用於櫥櫃門的一櫥櫃鉸鏈，該櫥櫃鉸鏈包含一固定座，包含一座體及二穿設孔；一第一樞接部，包含穿設該二穿設孔的一軸桿部、套設該軸桿部一端的一凸輪、相對套設該軸桿部一端的二軸套及上下供該二軸套、中間供該凸輪穿套的一彈簧；一第二樞接部，包含穿設該軸桿部上且相對於該第一樞接部樞轉的套接部；以及一限位元件，固設於該座體並相對該凸輪一端上，該限位元件包含一供該凸輪位移的軌道部及一相對該軌道部且供該凸輪一端定位的擋止部；俾當開啟櫥櫃門並鬆手後藉該擋止部即定位，並藉一位於該擋止部和該固定座間的緩衝距離，使櫥櫃門被開啟過大時具緩衝空間而免於該櫥櫃鉸鏈鬆脫或毀損，其使用壽命長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:櫥櫃鉸鏈</p>
        <p type="p">4:固定座</p>
        <p type="p">41:座體</p>
        <p type="p">411:容室</p>
        <p type="p">412:封閉端</p>
        <p type="p">413:開口端</p>
        <p type="p">42:穿設孔</p>
        <p type="p">43:蓋體</p>
        <p type="p">44:凸翼</p>
        <p type="p">441:固定孔</p>
        <p type="p">5:第一樞接部</p>
        <p type="p">51:軸桿部</p>
        <p type="p">511:第一軸</p>
        <p type="p">512:第二軸</p>
        <p type="p">513:抵靠體</p>
        <p type="p">52:凸輪</p>
        <p type="p">521:第一端</p>
        <p type="p">522:第二端</p>
        <p type="p">523:方形孔</p>
        <p type="p">524:凸粒</p>
        <p type="p">525:圓孔</p>
        <p type="p">53:軸套</p>
        <p type="p">531:凸套部</p>
        <p type="p">5311:方形軸孔</p>
        <p type="p">5312:凸出端</p>
        <p type="p">532:頭部</p>
        <p type="p">5321:穿孔</p>
        <p type="p">5322:外螺接</p>
        <p type="p">54:彈簧</p>
        <p type="p">541:鏤空中段</p>
        <p type="p">542、543:兩端</p>
        <p type="p">6:第二樞接部</p>
        <p type="p">61:套接部</p>
        <p type="p">611:方形孔</p>
        <p type="p">62:固定部</p>
        <p type="p">7:限位元件</p>
        <p type="p">71:軌道部</p>
        <p type="p">72:擋止部</p>
        <p type="p">731:定位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="510" publication-number="202618535">
    <tif-files tif-type="multi-tif">
      <tif file="113140823.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視知覺測試系統</chinese-title>
        <english-title>VISUAL PERCEPTION TESTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241204B">G06F3/0484</main-classification>
        <further-classification edition="202201120241204B">G06V40/18</further-classification>
        <further-classification edition="200601120241204B">G09B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森思股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSE INNOVATION CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林玠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種視知覺測試系統，係具有一眼動偵測設備及一使用者設備，該使用者設備用以啟動一應用程式單元，該使用者設備係與該眼動偵測設備進行連接，並透過該眼動偵測設備輸入一視覺操作指令給該應用程式單元，以進行運作該應用程式單元，該應用程式單元係能夠進行視覺辨識訓練、視覺空間訓練、記憶訓練、主題背景訓練及遮蔽形變辨識訓練。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a visual perception testing system. The system contains an eye movement detection device and a user device. The user device is used to launch an application unit. The user device is connected to the eye movement detection device and inputs a visual operation command to the application unit through the eye movement detection device to operate the application unit. The application unit performs visual recognition training, visual spatial training, memory training, theme background training, and occlusion deformation recognition training.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:眼動偵測設備</p>
        <p type="p">2:使用者設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="511" publication-number="202616944">
    <tif-files tif-type="multi-tif">
      <tif file="113140825.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>台灣胡椒的無性繁殖方法</chinese-title>
        <english-title>METHOD OF ASEXUAL PROPAGATION FOR PIPER UMBELLATUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">A01H4/00</main-classification>
        <further-classification edition="201801120250303B">A01H6/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE &amp; TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳羽婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石珮萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, PEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種台灣胡椒的無性繁殖方法，用以解決藉由種子播種繁殖的台灣胡椒的繁殖耗時過長及種苗的品質不穩等的問題。該台灣胡椒的無性繁殖方法包含：提供一台灣胡椒葉片；誘導該台灣胡椒葉片生成一癒傷組織；誘導該癒傷組織生成一芽體；及誘導該芽體生根。藉此可以達成縮短台灣胡椒種苗的繁殖期及保存優良的母本性狀等功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of asexual propagation for        &lt;i&gt;Piper umbellatum&lt;/i&gt;is used to solve the problem that by sexual propagation, it takes a long time to form seedlings, and the quality of the plants generated from the seedlings is also unstable. The method of asexual propagation for        &lt;i&gt;Piper umbellatum&lt;/i&gt;comprises: providing a leaf sample; inducing the leaf sample to generate a callus; inducing the callus to germinate a bud; and inducing the bud to form a root. Accordingly, the breeding period of seedlings and be shortened, and the parental traits can be preserved.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:營養器官提供步驟</p>
        <p type="p">S2:癒傷組織生成步驟</p>
        <p type="p">S3:芽體生成步驟</p>
        <p type="p">S4:芽體生根步驟</p>
        <p type="p">S5:馴化步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="512" publication-number="202617139">
    <tif-files tif-type="multi-tif">
      <tif file="113140827.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140827</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種新穎化合物及其用於促進毛髮生長或抑制發炎相關病症的用途</chinese-title>
        <english-title>NOVEL COMPOUNDS AND THE USE FOR PROMOTING HAIR GROWTH OR INHIBITING INFLAMMATORY DISORDERS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K31/35</main-classification>
        <further-classification edition="200601120250501B">A61K31/045</further-classification>
        <further-classification edition="200601120250501B">A61P1/16</further-classification>
        <further-classification edition="200601120250501B">A61P29/00</further-classification>
        <further-classification edition="200601120250501B">A61P35/00</further-classification>
        <further-classification edition="200601120250501B">A61P17/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚學校財團法人長庚科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雄醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聰龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, TSONG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張訓碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSUN-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏嘉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慈芃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TZU-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊淨茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHING-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎化合物及其用於促進毛髮生長或抑制發炎相關病症的用途，該化合物具有一通式(I)或一通式(II)或一通式(III)之結構，且該化合物或其醫藥上可接受之鹽可用於製備促進毛髮生長或抑制發炎相關病症之醫藥組合物，該發炎相關病症包括急性呼吸窘迫症候群(acute respiratory distress syndrome；ARDS)或急性肝損傷(acute liver injury；ALI)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Novel compounds and the use for promoting hair growth or inhibiting inflammatory disorders thereof are provided, the compound have a structure of a formula (I) or a formula (II) or a formula (III), and the compounds or their pharmaceutically acceptable salts thereof can be used for the manufacture of pharmaceutical composition for promoting hair growth or inhibiting inflammatory disorders, the inflammatory disorders including acute respiratory distress syndrome or acute liver injury.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="513" publication-number="202619072">
    <tif-files tif-type="multi-tif">
      <tif file="113140835.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其製法</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">H01L23/31</main-classification>
        <further-classification edition="200601120241218B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鼎濠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宣人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSUAN JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪維伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴曉萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, HSIAO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其製法，主要在複數電子元件之間的切割道上設置應力緩衝件，接著形成包覆該複數電子元件及該應力緩衝件之包覆層，之後移除該應力緩衝件，以及沿該切割道進行切割以分離各該電子元件，藉由減少包覆層之用量，避免發生翹曲問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package and manufacturing method thereof, which include placing a stress buffer on cutting lanes between a plurality of electronic components, then forming a coating layer covering the plurality of electronic components and the stress buffer, and then removing the stress buffer, and cutting along the cutting lane to separate the electronic components, thereby avoiding the problem of excessive warping by reducing the amount of coating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:電子封裝件</p>
        <p type="p">20:電子元件</p>
        <p type="p">200:切割道</p>
        <p type="p">21:第一導電凸塊</p>
        <p type="p">22:第二導電凸塊</p>
        <p type="p">23:承載件</p>
        <p type="p">24:包覆層</p>
        <p type="p">26:應力緩衝件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="514" publication-number="202619060">
    <tif-files tif-type="multi-tif">
      <tif file="113140837.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140837</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其基板結構與製法</chinese-title>
        <english-title>ELECTRONIC PACKAGE, SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H01L23/28</main-classification>
        <further-classification edition="200601120241204B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施惟馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寧栩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, NING-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂奕涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HSIU FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其基板結構與製法，主要在具有複數銲墊之基板本體上形成第一絕緣保護層及第二絕緣保護層，其中，該第一絕緣保護層設有複數開孔，以令各該銲墊對應外露於各該開孔，該第二絕緣保護層設有第一開口及複數第二開口，該第一開口係對應該基板本體之置晶區位置，該複數第二開口係對應該複數銲墊位置，以供電子元件透過膠黏層接置於該置晶區上，並透過複數銲線電性連接至該複數銲墊，得以利用第一絕緣保護層及第二絕緣保護層之先後設置產生高低差效果限制膠黏層流動，防止其溢散至銲墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package and its substrate structure and manufacturing method mainly form a first insulating protective layer and a second insulating protective layer on a substrate body having a plurality of pads, wherein the first insulating protective layer is provided with a plurality of holes to expose each pad, the second insulating protective layer is provided with a first opening and a plurality of second openings. The first opening corresponds to the position of the die placement area of the substrate body, and the plurality of second openings are correspond to the positions of the plurality of pads, allowing electronic components to be connected to the die placement area through the adhesive layer and electrically connected to the plurality of pads through a plurality of wires, thereby utilizing the first insulating protective layer and the second insulating protective layer sequentially placed creates a height difference effect that restricts the flow of the adhesive layer and prevents it from overflowing to the pads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板結構</p>
        <p type="p">20:基板本體</p>
        <p type="p">200a:銲墊</p>
        <p type="p">201:表面</p>
        <p type="p">21:第一絕緣保護層</p>
        <p type="p">210:開孔</p>
        <p type="p">22:第二絕緣保護層</p>
        <p type="p">221:第一開口</p>
        <p type="p">222:第二開口</p>
        <p type="p">D:置晶區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="515" publication-number="202618118">
    <tif-files tif-type="multi-tif">
      <tif file="113140839.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140839</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>任一側皆可推或拉開啟的組合門及其門樘組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">E06B3/36</main-classification>
        <further-classification edition="200601120241230B">E05F1/10</further-classification>
        <further-classification edition="200601120241230B">E06B1/52</further-classification>
        <further-classification edition="200601120241230B">E06B3/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>官興華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>官興華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐滄明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種任一側皆可推或拉開啟的組合門及其門樘組件，門樘組件的大框及中框結合特殊的雙向關門器及鉸鏈，可用以組合一門扇，形成二框一扇的三合一架構，實質上又是一框二扇的獨特門樘結構的組合門，並運用新穎鎖控的配置，以造就靈活的開向，特別是利用雙向關門器分管兩個單向開啟的門扇功能，門樘任意雙向拉門或推門開啟及關門，以達成最具彈性的任意方向拉門或推門即走，逃生及關門防火的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">23:大框止檔</p>
        <p type="p">25:第一橫樑</p>
        <p type="p">251:第一滑槽</p>
        <p type="p">3:中框</p>
        <p type="p">30:中框止檔</p>
        <p type="p">32:第一鎖具</p>
        <p type="p">33:中框護板</p>
        <p type="p">34:第一把手</p>
        <p type="p">36:第一活動舌片</p>
        <p type="p">39:輔助鎖具</p>
        <p type="p">390:把手</p>
        <p type="p">391:活動舌片</p>
        <p type="p">4:第一鉸鏈</p>
        <p type="p">5:門扇</p>
        <p type="p">52:第二鎖具</p>
        <p type="p">53:第二滑槽</p>
        <p type="p">54:第二把手</p>
        <p type="p">56:第四把手</p>
        <p type="p">57:第三把手</p>
        <p type="p">71:本體</p>
        <p type="p">73:第一滑臂</p>
        <p type="p">S1:第一方向</p>
        <p type="p">S2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="516" publication-number="202617511">
    <tif-files tif-type="multi-tif">
      <tif file="113140840.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>踏板旋轉力強化裝置</chinese-title>
        <english-title>PEDAL ROTATION FORCE STRENGTHENING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">B62M3/08</main-classification>
        <further-classification edition="200601120250107B">B62M3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＧＥＯ設計股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEO SEKKEI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津久井隆夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKUI, TAKAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明低成本地提供一種用於高效地傳遞腿力的踏板旋轉力強化裝置。在踏板軸安裝小齒輪，在踏板的前端設置軸從而軸裝以後方打開的方式賦能的可動踏板，預先在該可動踏板的下部前方吊設以經由第一軸與小齒輪嚙合的方式賦能的齒條齒輪，由此蹬踏時的可動踏板的開閉動作產生在齒條齒輪與小齒輪之間構成的棘齒機構帶來的棘齒作用，在齒條齒輪與小齒輪嚙合的過程中，前方的踏板的軸旋轉被鎖定從而踏板的力點從軸心向前端移動，由此能夠強化旋轉力。如果將該踏板旋轉力強化裝置用於自行車，則只要更換踏板就能夠實現輕快的強力行進。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a pedal rotation force strengthening device for efficiently transmitting leg power at a low cost. A pinion gear is attached to the pedal shaft, a movable foot plate is attached to the front end of the pedal with an axle that is biased to open at the rear, and a rack gear is suspended from the front of the lower part of the movable foot plate via a first axle that is biased to mesh with the pinion gear. When pedaling, the opening and closing movement of the movable foot plate creates a ratchet action by the ratchet mechanism formed between the rack gear and the pinion gear, and while the rack gear and the pinion gear are engaged, the axial rotation of the pedal in the forward direction is locked, and the point of force on the pedal moves from the axis to the front end, strengthening the rotation force. By using this on a bicycle, you can ride lightly and powerfully just by changing the pedals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:踏板主體</p>
        <p type="p">1h:嚙合開口部</p>
        <p type="p">2:踏板軸</p>
        <p type="p">2a:踏板安裝螺紋部</p>
        <p type="p">3:小齒輪</p>
        <p type="p">4:可動踏板</p>
        <p type="p">4c:防滑孔</p>
        <p type="p">5:踏板軸(第一軸)</p>
        <p type="p">5b:擋圈</p>
        <p type="p">6:踏板彈簧</p>
        <p type="p">7:齒條齒輪</p>
        <p type="p">7a:臂部</p>
        <p type="p">9:齒條軸(第二軸)</p>
        <p type="p">9b:擋圈</p>
        <p type="p">10:齒條彈簧</p>
        <p type="p">11:止擋件</p>
        <p type="p">12:配重</p>
        <p type="p">14:固定螺釘</p>
        <p type="p">15:反射器位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="517" publication-number="202618726">
    <tif-files tif-type="multi-tif">
      <tif file="113140841.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>情緒感知訓練裝置及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G09B5/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為涉及一種情緒感知訓練裝置及其方法，藉由第一使用者依據數個表述導引件上的至少一表述圖文部進行語句敘述上的正確排列以產生一事件狀態資訊，並第一使用者取一實境裝置及一包含有至少一震動元件、至少一發熱元件、至少一充氣元件、至少一致冷元件、一揚聲元件及一控制模組的體感刺激裝置，並依據事件狀態資訊操縱一操控介面，因操控介面內設有數個資訊對應事件狀態資訊之體感選項單元，使第一使用者操縱體感選項單元後，實境裝置與體感刺激裝置得以根據體感選項單元做相對應之作動，此時再給第二使用者觀看事件狀態資訊的正確敘述語法且進行配戴，使第二使用者可產生體感及視覺感的情緒感知感受。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:語句載體</p>
        <p type="p">2:體感刺激裝置</p>
        <p type="p">21:震動元件</p>
        <p type="p">22:發熱元件</p>
        <p type="p">23:充氣元件</p>
        <p type="p">24:致冷元件</p>
        <p type="p">25:揚聲元件</p>
        <p type="p">26:控制模組</p>
        <p type="p">3:實境裝置</p>
        <p type="p">4:操控裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="518" publication-number="202618111">
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      <tif file="113140843.zip" no="1">
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          <doc-number>202618111</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合屋之結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">E04H1/02</main-classification>
        <further-classification edition="200601120241230B">E04B1/343</further-classification>
        <further-classification edition="200601120241230B">E04B1/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉子豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種組合屋之結構，結構包括有一包含有複數樑構件、複數柱構件、至少一樓板件、及至少一牆板件之組合屋主體、及複數設於各樑構件與各柱構件之間的組接結構，並包含有一第一支撐件、複數樑固定部、複數樑結合部、至少一樓板固定部、一第二支撐件、複數柱固定部、複數柱結合部、複數牆板支撐空間、及至少一樓板支撐空間。組接結構除了以柱結合部與柱構件結合、以樑固定部與樑構件結合外，乃由各牆板支撐空間、各柱固定部、第二支撐件及柱構件共同夾持各牆板件，及由樓板支撐空間、各樑固定部、樓板固定部及第二支撐件圍繞夾持各樓板件，藉此，不但具有施工簡單快速的特性，組合屋主體與組接結構的交錯拼接，也使交疊處不易倒閉散落、使用時間更為長久。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">5:組接結構</p>
        <p type="p">51:第一支撐件</p>
        <p type="p">511:樓板固定部</p>
        <p type="p">52:樑固定部</p>
        <p type="p">521:樑結合部</p>
        <p type="p">53:第二支撐件</p>
        <p type="p">54:柱固定部</p>
        <p type="p">541:柱結合部</p>
        <p type="p">542:牆板支撐空間</p>
        <p type="p">55:樓板支撐空間</p>
        <p type="p">56:側支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="519" publication-number="202617024">
    <tif-files tif-type="multi-tif">
      <tif file="113140844.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>飛行清掃裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A47L11/24</main-classification>
        <further-classification edition="200601120241204B">A47L11/38</further-classification>
        <further-classification edition="200601120241204B">A47L11/40</further-classification>
        <further-classification edition="202401120241204B">G05D1/467</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃靖傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種飛行清掃裝置，結構包括有一包含有複數驅動裝置及複數移動輪之機構載體、一包含有至少一飄浮動力裝置及至少一航向調整裝置之飛行系統、一包含有複數集塵刷及一吸塵裝置之清潔系統、一控制系統、及一包含有至少一高度感測器及至少一障礙感測器之感測系統。藉上述結構，除了可透過控制系統整合驅動裝置、感測系統及清潔系統，使機構載體進行地面的自動化清潔外，更可依據高度感測器的感測控制飄浮動力裝置的飛行高度、及依據障礙感測系統的感測控制航向調整裝置的橫移方位，使機構載體可利用飛行系統飛到高處的平面後，進行較精細的清潔。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:機構載體</p>
        <p type="p">11:驅動裝置</p>
        <p type="p">12:移動輪</p>
        <p type="p">2:飛行系統</p>
        <p type="p">21:飄浮動力裝置</p>
        <p type="p">22:航向調整裝置</p>
        <p type="p">3:清潔系統</p>
        <p type="p">31:集塵刷</p>
        <p type="p">32:吸塵裝置</p>
        <p type="p">321:風機</p>
        <p type="p">322:集塵盒</p>
        <p type="p">4:控制系統</p>
        <p type="p">5:感測系統</p>
        <p type="p">51:高度感測器</p>
        <p type="p">52:障礙感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="520" publication-number="202617416">
    <tif-files tif-type="multi-tif">
      <tif file="113140845.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140845</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類塑膠之仿真木料結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">B29D7/01</main-classification>
        <further-classification edition="200601120241205B">C08L25/06</further-classification>
        <further-classification edition="200601120241205B">C08L33/08</further-classification>
        <further-classification edition="200601120241205B">C08L47/00</further-classification>
        <further-classification edition="200601120241205B">C08L101/00</further-classification>
        <further-classification edition="200601120241205B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚為有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JYU WEI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江東霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭成銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種類塑膠之仿真木料結構，其包括重量百分比10%-50%之彈性體、及重量百分比為50%-90%之合成有機高分子聚合物，其中該合成有機高分子聚合物係填充於該彈性體內，且該彈性體係包含重量百分比50%-60%之聚苯乙烯、重量百分比5%-30%之聚異戊二烯、及重量百分比10%-35%之聚丙烯酸酯。藉此，以聚苯乙烯為主的彈性體材料填充入合成有機高分子聚合物的製備方式，產出一種不含木質成分或天然纖維的高仿真木料，不但可將絕大多數的廢料回收再利用，具有高度環保效益，且因彈性體之作用使木料的纖維與硬度皆得到高度仿真，而可依傳統木材加工方式操作，實用性高。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:彈性體</p>
        <p type="p">11:聚苯乙烯</p>
        <p type="p">12:聚異戊二烯</p>
        <p type="p">13:聚丙烯酸酯</p>
        <p type="p">2:合成有機高分子聚合物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="521" publication-number="202618135">
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      <tif file="113140852.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抽水泵的接頭</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F04D29/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周庭和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周庭和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抽水泵的接頭，該接頭包含一本體，該本體包含一固定盤，利用該固定盤固定於一抽水泵，該固定盤一側延伸一容置管部，該容置管部近該固定盤端內部設置一內螺紋，該容置管部近末端內設置一環凸擋；至少一第一軸承，伸入於該本體內並抵靠於該環凸擋上；一轉動軸，包含一抵擋凸部、一第一軸部及一穿過該第一軸承並抵靠於該抵擋凸部一端的第二軸部；至少一第二軸承，套設於該第一軸部並抵靠於該抵擋凸部的另一端；一固定部，包含一鎖固頭部及一螺接管部；以及複數止漏墊體，分別置入該固定部內並藉該螺接管部的一外螺紋相對該內螺紋旋入時，以讓該些止漏墊體可順著該第一軸部被推入於該固定部內，並藉該螺接管部抵固於該第二軸承。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:接頭</p>
        <p type="p">51:本體</p>
        <p type="p">511:固定盤</p>
        <p type="p">512:容置管部</p>
        <p type="p">513:內螺紋</p>
        <p type="p">515:外螺紋</p>
        <p type="p">52:第一軸承</p>
        <p type="p">53:轉動軸</p>
        <p type="p">530:抵擋凸部</p>
        <p type="p">531:第一軸部</p>
        <p type="p">532:第二軸部</p>
        <p type="p">533:第一外螺部</p>
        <p type="p">534:第二外螺部</p>
        <p type="p">535:固定螺帽</p>
        <p type="p">5351:六角夾制平面</p>
        <p type="p">54:第二軸承</p>
        <p type="p">55:固定部</p>
        <p type="p">551:鎖固頭部</p>
        <p type="p">5512:軸孔</p>
        <p type="p">552:螺接管部</p>
        <p type="p">553:內部空間</p>
        <p type="p">554:外螺紋</p>
        <p type="p">56:止漏墊體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="522" publication-number="202618599">
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          <doc-number>202618599</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具資訊安全防護及人工智慧之資訊處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250203B">G06F21/72</main-classification>
        <further-classification edition="201301120250203B">G06F21/71</further-classification>
        <further-classification edition="201301120250203B">G06F21/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翔立光科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELGENS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種具資訊安全防護及人工智慧之資訊處理系統，包含一底板、一CPU模組、一GPU模組、 一FPGA，該底板資訊連接一中介韌體模組及一API，該CPU模組與該GPU模組可活動狀資訊連接該底板，該FPGA資訊連接該底板、該CPU模組、該GPU模組，且包含一人工智慧模組、一切換模組，該切換模組可選擇該CPU模組或者該GPU模組與該顯示器進行資訊傳輸。可活動狀連接之CPU模組可輕易更換並使系統輕易升級，不需變更系統之結構，節省開發時間、成本及驗證成本；藉FPGA與 CPU 模組、GPU模組一起協同解析處理資料，可快速獲得正確數據資料，避免發生資料誤判情形；藉FPGA 對資料進行人工智慧處理，有效降低 CPU模組的運算負載且 FPGA可作為 CPU模組 跟GPU模組的橋接晶片；藉設置數個資訊安全模組，並以數個加密資料組合產生一密鑰，達到資訊安全防護之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:底板</p>
        <p type="p">11:第二資訊安全模組</p>
        <p type="p">12:傳輸介面</p>
        <p type="p">20:CPU模組</p>
        <p type="p">21:第一資訊安全模組</p>
        <p type="p">30:GPU模組</p>
        <p type="p">40:FPGA</p>
        <p type="p">41:人工智慧模組</p>
        <p type="p">42:切換模組</p>
        <p type="p">43:第三資訊安全模組</p>
        <p type="p">50:中介韌體模組</p>
        <p type="p">60:API</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="523" publication-number="202617438">
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      <tif file="113140857.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617438</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140857</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貼合裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B32B37/00</main-classification>
        <further-classification edition="200601120241230B">B32B39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陽程科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑩書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方志斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, CHIH-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳漢濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAN-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾怡瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種貼合裝置，係於貼合單元之上貼合機構，其軌柱組裝之基座為活動組裝有第一轉向部及第二轉向部，並由第一控制裝置分別驅動迴轉與偏擺等，其另側設有具上貼合部之對接座板相對於下貼合機構之銜接座板的下貼合部，則於銜接座板下方活動組裝第三轉向部、第四轉向部，可由第二控制裝置分別驅動迴轉與偏擺等，且位於貼合單元二側設置校對單元之橫向檢測設備的影像擷取裝置，而縱向檢測設備之二相對式準直裝置則設置於其中一影像擷取裝置側邊、可供移動機構驅動二準直裝置往復位移，達到將欲貼合的二物件可快速對位、準確貼合之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:貼合單元</p>
        <p type="p">11:上貼合機構</p>
        <p type="p">111:軌柱</p>
        <p type="p">112:基座</p>
        <p type="p">113:第一轉向部</p>
        <p type="p">1131:軸管</p>
        <p type="p">1132:第一轉向座板</p>
        <p type="p">114:第二轉向部</p>
        <p type="p">1141:轉軸</p>
        <p type="p">1142:第二轉向座板</p>
        <p type="p">115:第一控制裝置</p>
        <p type="p">1151:第一驅動部</p>
        <p type="p">117:對接座板</p>
        <p type="p">118:限位件</p>
        <p type="p">12:下貼合機構</p>
        <p type="p">121:銜接座板</p>
        <p type="p">122:第三轉向部</p>
        <p type="p">1221:第三轉向座板</p>
        <p type="p">123:第四轉向部</p>
        <p type="p">1231:第四轉向座板</p>
        <p type="p">124:第二控制裝置</p>
        <p type="p">1243:第六驅動部</p>
        <p type="p">125:下貼合部</p>
        <p type="p">2:校對單元</p>
        <p type="p">21:橫向檢測設備</p>
        <p type="p">211:第一影像擷取裝置</p>
        <p type="p">212:第二影像擷取裝置</p>
        <p type="p">22:縱向檢測設備</p>
        <p type="p">221:準直裝置</p>
        <p type="p">222:移動機構</p>
        <p type="p">2221:驅動基座</p>
        <p type="p">2222:驅動軸桿</p>
        <p type="p">2223:輔助軸桿</p>
        <p type="p">2224:滑移件</p>
        <p type="p">2225:滑座板</p>
        <p type="p">2226:軸套</p>
      </representative-img>
    </description>
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  <tw-patent-application no="524" publication-number="202618899">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體構件臨時固定分離裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01L21/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陽程科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊政峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種半導體構件臨時固定分離裝置及方法，半導體構件之臨時固定係為半導體製程中一重要環節，為解決臨時固定於載體之半導體構件後續分離之繁複過程，本發明提供一種半導體構件臨時固定分離裝置及方法，藉由光源模組所發射出之光源照射在光學調控層上，間接使有固定半導體構件效用之保護層改質，並令保護層與光學調控層之間失去連接效用，以達成簡化光學調控層及保護層處理之步驟，使分離製程得節省作業時間及成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體構件臨時固定分離裝置</p>
        <p type="p">11:臨時載體</p>
        <p type="p">12:光學調控層</p>
        <p type="p">13:保護層</p>
        <p type="p">14:光源模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="525" publication-number="202618171">
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      <volno>24</volno>
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        <document-id>
          <doc-number>113140869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耗氣量管制裝置</chinese-title>
        <english-title>AIR CONSUMPTION CONTROL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">F17C13/02</main-classification>
        <further-classification edition="200601120250327B">G08B21/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅凱耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, KAI-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯翔譯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, HSIANG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅凱耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, KAI-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯翔譯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, HSIANG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種耗氣量管制裝置，其用以監測消防人員所攜帶的空氣瓶的氣體含量，本揭露包含相互耦接的開關模組、時間模組、氣量模組、燈號模組及控制模組。開關模組用以控制本揭露的開關狀態；時間模組用以顯示耗氣時間值；氣量模組係對應所述空氣瓶預設氣體含量初始值，並計算顯示當前氣體含量值；控制模組具有控制單元及警示單元，控制單元預設有第一氣量閾值及第二氣量閾值，第二氣量閾值低於第一氣量閾值，控制單元係根據當前氣體含量值與第一氣量閾值和第二氣量閾值關係，對應控制燈號模組的燈號顯示狀況以及警示單元的作動狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An air consumption control device, which is used to monitor the air content of an air bottle carried by firefighters. This disclosure includes a switch module, a time module, an air volume module, a light indicator module, and a control module, all interconnected. The switch module is used to control the on/off state of the device; the time module displays the air consumption time value; the air volume module corresponds to the preset initial air content of the air bottle and calculates and displays the current air content value. The control module includes a control unit and an alert unit, where the control unit is preset with a first air volume threshold and a second air volume threshold, the second threshold being lower than the first. Based on the relationship between the current air content value and the first and second thresholds, the control unit controls the status of the light indicator module's display and the activation of the alert unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:耗氣量管制裝置</p>
        <p type="p">10:開關模組</p>
        <p type="p">20:時間模組</p>
        <p type="p">30:氣量模組</p>
        <p type="p">40:燈號模組</p>
        <p type="p">41:第一燈號單元</p>
        <p type="p">42:第二燈號單元</p>
        <p type="p">43:第三燈號單元</p>
        <p type="p">50:控制模組</p>
        <p type="p">51:控制單元</p>
        <p type="p">52:警示單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="526" publication-number="202617947">
    <tif-files tif-type="multi-tif">
      <tif file="113140870.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140870</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用用於分離烴之替代汽提介質的整合式配置</chinese-title>
        <english-title>INTEGRATED CONFIGURATION UTILIZING AN ALTERNATE STRIPPING MEDIUM FOR HYDROCARBON SEPARATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C10G65/12</main-classification>
        <further-classification edition="200601120260128B">C01B3/34</further-classification>
        <further-classification edition="200601120260128B">C10G7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商魯瑪斯科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆客吉　猶傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHERJEE, UJJAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊斯　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONES, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑托斯　佩德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTOS, PEDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法，其包括加熱一氫氣製造單元原料，產生一加熱的氫氣製造單元原料。該方法包括以加熱的氫氣製造單元原料汽提一寬沸程烴混合物，產生一塔頂餾分流，將該塔頂餾分流分離以回收一未冷凝流，及將該未冷凝流饋至一氫氣製造單元。一種方法，其包括將一烴製造單元原料饋至一汽提單元，回收一塔頂餾分流，將該塔頂餾分流饋至一分離單元，分離該氫氣製造單元原料與輕沸烴，將該分離的氫氣製造單元原料流的一部分饋至一氫氣製造單元，產生一氫氣流，將該氫氣流的一第一部分與該塔底餾分流饋至一第一加氫加工單元，及將該氫氣流的一第二部分、該第一流出物及該回收的中沸烴饋至一第二加氫加工單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process including heating a hydrogen manufacturing unit feedstock producing a heated hydrogen manufacturing unit feedstock. The process includes stripping a wide boiling range hydrocarbon mixture with heated hydrogen manufacturing unit feedstock producing an overheads stream, separating the overheads stream to recover a non-condensed stream, and feeding the non-condensed stream to a hydrogen manufacturing unit. A process including feeding a hydrocarbon manufacturing unit feedstock to a stripping unit, recovering an overhead stream, feeding the overhead stream to a separation unit separating the hydrogen manufacturing unit feedstock from light boiling hydrocarbons, feeding a portion of the separated hydrogen manufacturing unit feedstock stream to a hydrogen manufacturing unit producing a hydrogen stream, feeding a first portion of the hydrogen stream and the bottoms stream to a first hydroprocessing unit, and feeding a second portion of the hydrogen stream, the first effluent, and the recovered medium boiling hydrocarbons to a second hydroprocessing unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:汽提系統</p>
        <p type="p">3:汽提介質，烴汽提介質入口管線</p>
        <p type="p">5:烴混合物，烴混合物入口管線</p>
        <p type="p">7:再循環烴汽提介質管線，再循環管線，流線</p>
        <p type="p">9:塔頂餾分，流線，塔頂餾分流輸送管線</p>
        <p type="p">11:塔底餾分出口管線，塔底餾分流進料管線，出口管線，高沸餾分，流線，管線</p>
        <p type="p">13:塔頂餾分出口管線，回收的氫氣製造單元原料進料管線，輕沸烴進料管線，流線，管線</p>
        <p type="p">15:流線，分離的烴進料管線，進料管線，出口管線，中沸餾分，管線</p>
        <p type="p">102:汽提塔，汽提單元</p>
        <p type="p">104:分離器，分離單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="527" publication-number="202618276">
    <tif-files tif-type="multi-tif">
      <tif file="113140874.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微觀燃燒反應之檢測設備</chinese-title>
        <english-title>AN INSPECTION DEVICE CAPABLE OF OBSERVING A COMBUSTION REACTION IN A MICROSCOPIC OBSERVATION MANNER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01N33/22</main-classification>
        <further-classification edition="200601120250512B">G01N25/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍芳嫺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, FANG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-BANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明微觀燃燒反應之檢測設備，其包含有一內部形成有一檢測空間且供樣品設置之反應爐，一設於該檢測空間周圍之加熱器，一供應該檢測空間所需氣體之供氣裝置，一設於該檢測空間內之感測裝置，以及一與該感測裝置連接之運算單元；其中，該樣品可為小體積的液滴或固態燃料/材料為主，藉由該加熱器可快速地針對該樣品予以加熱進行燃燒/反應，此時依據該樣品需要的氣體環境利用該供氣裝置提供相應的氣體組成，以呈現出該樣品實際真實的反應/燃燒表現，最後利用該感測裝置針對該樣品於燃燒/反應過程之溫度檢測及影像擷取、重量變化等資訊進行觀測以供後續分析，故該檢測設備之檢測作業可立即進行且適用於微小體積之樣品，亦能快速得知檢測效果及降低檢測成本，有利於後續能源化/資源化之特性評估。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to an inspection device capable of observing a combustion reaction in a microscopic observation manner. The inspection device includes a reactor whose interior forms an inspection space adapted to accommodate a specimen, a heater disposed around the inspection space, a gas supplier adapted to introduce requisite gas into the inspection space, a detecting device disposed in the inspection space, and a computing unit connected to the detecting device. Wherein, the specimen can be droplets or a solid fuel/material having a small dimension. The specimen is quickly heated by the heater, which causes a combustion/reaction. The gas supplier provides corresponding gas compositions according to a gaseous environment required by the specimen, thereby presenting an actual reaction/combustion performance of the specimen. The detecting device is adapted to detect the temperature, capture images, and observe changes in the information such as weight during the combustion/reaction of the specimen for further analysis. Accordingly, an inspecting operation of the inspection device can be immediately conducted and applied to the specimen has a very small size. The effect of the inspecting operation can be quickly obtained, and costs of the inspecting operation can be reduced. These features facilitate the evaluation of the characteristics of the energy regeneration and the recycling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:檢測設備</p>
        <p type="p">31:反應爐</p>
        <p type="p">311:檢測空間</p>
        <p type="p">313:置物件</p>
        <p type="p">32:加熱器</p>
        <p type="p">33:供氣裝置</p>
        <p type="p">331:增溫器</p>
        <p type="p">332:供氣源</p>
        <p type="p">34:感測裝置</p>
        <p type="p">341:熱電偶</p>
        <p type="p">342:紅外線感測器</p>
        <p type="p">343:影像擷取器</p>
        <p type="p">345:電子磅秤</p>
        <p type="p">35:運算單元</p>
        <p type="p">4:樣品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="528" publication-number="202618800">
    <tif-files tif-type="multi-tif">
      <tif file="113140876.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於心理調適的韌力分析方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G16H20/70</main-classification>
        <further-classification edition="200601120250203B">A61B5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>心進化有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅期</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種基於心理調適的韌力分析方法，方法包括：S1：接收使用者透過終端裝置的輸入，輸入包括至少一事件，事件可包括對應問題、阻礙或困擾的其中之一或組合的複數個描述段落，其中，事件的每個描述段落可包括由語音、文字或繪圖的至少其中之一或組合構建；S2：利用語音、文字和/或影像處理技術，對使用者的輸入進行解析，以判斷事件中的至少一非理性信念；S3：利用語音、文字和/或影像處理技術，對使用者的輸入進行解析，以識別事件中的該使用者的當前的一情緒狀態與內在需要；S4：透過一多維度的思維模式來分析針對該事件的各種面向；以及S5：透過一設定條件和一預期結果，以制定一行動方案，其中，該行動方案對應該至少一非理性信念、該當前的情緒狀態與內在需要和/或該事件的各種面向的其中之一或組合。在本發明的另一方面，亦涉及一種基於心理調適的韌力分析系統。本發明的優點在於有效幫助使用者識別並應對生活和工作中的心理壓力和挑戰。系統透過分析使用者的非理性信念、當前情緒狀態與內在需要以及事件的各個面向，提供個性化的應對策略，從而顯著提升使用者的心理調適能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="529" publication-number="202619412">
    <tif-files tif-type="multi-tif">
      <tif file="113140877.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND FABRICATING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K1/02</main-classification>
        <further-classification edition="200601120241230B">H05K7/20</further-classification>
        <further-classification edition="200601120241230B">H05K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種電路板組件及其製造方法。電路板組件包含第一外層線路層、第二外層線路層、內層線路層、電子元件，和絕緣導熱材料。電子元件設置在內層線路層內，並位於第一外層線路層與第二外層線路層之間。散熱件設置在內層線路層內，並位於第一外層線路層與第二外層線路層之間。散熱件覆蓋電子元件，並包含多個波浪面。多個波浪面圍繞電子元件。每一個波浪面具有多個波谷槽。絕緣導熱材料包覆電子元件和散熱件。絕緣導熱材料接觸電子元件與散熱件，並填滿多個波谷槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board assembly and a fabricating method of the same are provided. The circuit board assembly includes a first outer wiring layer, a second outer wiring layer, an inner wiring layer, an electronic component, a thermal dissipation element, and an insulating and thermally conductive material. The electronic component is disposed in the inner wiring layer and is located between the first outer wiring layer and the second outer wiring layer. The thermal dissipation element is disposed in the inner wiring layer and is located between the first outer wiring layer and the second outer wiring layer. The thermal dissipation element covers the electronic component and includes multiple wavy surfaces. The wavy surfaces surround the electronic component. Each wavy surface includes multiple troughs. The insulating and thermally conductive material covers the electronic component and the thermal dissipation element. The insulating and thermally conductive material touches the electronic component and the thermal dissipation element, and fills the troughs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">111,112:外層線路層</p>
        <p type="p">111a,112a:接地區</p>
        <p type="p">113~116:內層線路層</p>
        <p type="p">117:接墊</p>
        <p type="p">121~125:絕緣層</p>
        <p type="p">130,414,423:膠層</p>
        <p type="p">141,142:導電結構</p>
        <p type="p">151,152:散熱層</p>
        <p type="p">151a,152a:鍍層</p>
        <p type="p">161,162:保護層</p>
        <p type="p">200:電子元件</p>
        <p type="p">300:導熱塊</p>
        <p type="p">400:散熱件</p>
        <p type="p">410:側面散熱板</p>
        <p type="p">411:散熱片</p>
        <p type="p">412,413,422:波浪結構</p>
        <p type="p">412a,413a,422a:波浪面</p>
        <p type="p">415,424:導熱膠</p>
        <p type="p">420:表面散熱板</p>
        <p type="p">421:金屬塊</p>
        <p type="p">500:屏蔽結構</p>
        <p type="p">510,520:部件</p>
        <p type="p">530:焊料</p>
        <p type="p">600:絕緣導熱材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="530" publication-number="202618550">
    <tif-files tif-type="multi-tif">
      <tif file="113140887.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與虛擬助理的操作方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND OPERATION METHOD OF VIRTUAL ASSISTANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G06F9/451</main-classification>
        <further-classification edition="201801120250203B">G06F9/44</further-classification>
        <further-classification edition="201801120250203B">G06F9/30</further-classification>
        <further-classification edition="200601120250203B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇凱農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, KAI-NUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐瑞慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHYU, RUEY-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置與虛擬助理的操作方法。所述方法適用於包括輸入裝置的電子裝置，並包括下列步驟。透過輸入裝置經由一虛擬助理接收一用戶請求指令。根據用戶請求指令判斷多個功能模組是否可執行用戶請求指令的任務。響應於多個功能模組無法執行任務，根據用戶請求指令產生用以執行任務的一應用程式碼與包括應用程式碼的容器映像。根據容器映像於一容器中執行應用程式碼，以透過應用程式碼執行用戶請求指令的任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic apparatus and an operation method of virtual assistant are provided. The method is adapted to the electronic apparatus including an input device and includes the following steps. A user request command is received via an input device through a virtual assistant. Based on the user request command, whether functional modules are able to execute a task of the user request command is determined. In response to the functional modules not able to execute the task, application code is generated according to the user request command and a container image that includes the application code. The application code is executed in a container based on the container image, to perform the task of the user request command through the application code.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="531" publication-number="202618578">
    <tif-files tif-type="multi-tif">
      <tif file="113140888.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與文章摘要生成方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND ARTICLE ABSTRACT GENERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/30</main-classification>
        <further-classification edition="202001120250203B">G06F40/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖世傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張津豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱士銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHIH-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奕男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案為一種電子裝置與文章摘要生成方法。此方法適用於一電子裝置並包括下列步驟。獲取原始長文本。根據字數限制，將原始長文本切分為多個第一文本片段。根據字數限制，將多個第一文本片段合併為多個第一文本分塊。各個第一文本分塊包括多個第一文本片段其中至少一者。將多個第一文本分塊分別輸入至一大型語言模型，以獲取多個第一文本分塊分別對應的多個第一初步摘要文本。基於多個第一初步摘要文本產生原始長文本的最終摘要文本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and an article abstract generation method are provided. The method is adapted to the electronic device and includes the following steps. An original long text is obtained. The original long text is split into a plurality of first text segments according to a length limit. The first text segments are combined into a plurality of first text chunks. Each first text chunk includes at least one of the first text segments. The first text chunks are respectively input into a large language model to obtain a plurality of first preliminary summary texts respectively corresponding to the first text chunks. A final summary text of the original long text is generated based on the first preliminary summary texts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S250:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="532" publication-number="202619296">
    <tif-files tif-type="multi-tif">
      <tif file="113140889.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎖定偵測裝置與方法</chinese-title>
        <english-title>LOCK DETECTION DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H03L7/087</main-classification>
        <further-classification edition="200601120241204B">H03L7/095</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王艶婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅仁鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, REN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹欽棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHIN-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">鎖定偵測裝置包括第一取樣電路、第二取樣電路以及裁決電路。一個相同時脈訊號觸發第一取樣電路與第二取樣電路，以分別去取樣鎖相迴路的鑒相器的不同輸出端所輸出的不同鑒相結果，其中所述相同時脈訊號相關於鑒相器所接收的參考時脈與回授時脈其中一者。裁決電路基於第一取樣電路的第一取樣結果與第二取樣電路的第二取樣結果去裁決鎖相迴路是否為鎖定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The lock detection device includes a first sampling circuit, a second sampling circuit and a determination circuit. A same clock signal triggers the first sampling circuit and the second sampling circuit to respectively sample different phase detection results output by different output terminals of a phase detector of a phase locked loop (PLL), wherein the same clock signal is related to one of a reference clock and a feedback clock received by the phase detector. The determination circuit determines whether the PLL is locked based on a first sampling result of the first sampling circuit and a second sampling result of the second sampling circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:鎖定偵測裝置</p>
        <p type="p">111、112:取樣電路</p>
        <p type="p">113:裁決電路</p>
        <p type="p">120:鎖相迴路</p>
        <p type="p">121:鑒相器</p>
        <p type="p">122:電荷泵</p>
        <p type="p">123:低通濾波器</p>
        <p type="p">124:壓控振盪器</p>
        <p type="p">125:除頻器</p>
        <p type="p">130:系統電路</p>
        <p type="p">CK_FB:回授時脈</p>
        <p type="p">CK_OUT:輸出時脈</p>
        <p type="p">CK_REF:參考時脈</p>
        <p type="p">CK1:相同時脈訊號</p>
        <p type="p">DN1:降頻訊號</p>
        <p type="p">DN1_DZ、UP1_DZ:取樣結果</p>
        <p type="p">FREQ_LOCK:裁決結果</p>
        <p type="p">UP1:升頻訊號</p>
        <p type="p">VC11、VC12:控制電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="533" publication-number="202617894">
    <tif-files tif-type="multi-tif">
      <tif file="113140890.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>酸性染料組合物、使用其之染色方法及染色物</chinese-title>
        <english-title>ACID DYE COMPOSITION, DYEING METHOD USING THE SAME AND DYED OBJECT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C09B67/22</main-classification>
        <further-classification edition="200601120241205B">D06P1/39</further-classification>
        <further-classification edition="200601120241205B">D06P3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰鋒染化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIENTAL GIANT DYES &amp; CHEMICAL IND. CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱灯松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TENG-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種酸性染料組合物、使用其之染色方法及染色物。所述酸性染料組合物包括C. I. 酸性藍113、C. I.酸性橙116和C. I.酸性紅299。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an acid dye composition, a dyeing method using the dye composition, and a dyed object thereof. The acid dye composition includes C. I. acid blue 113, C. I. acid orange 116, and C. I. acid red 299.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="534" publication-number="202618585">
    <tif-files tif-type="multi-tif">
      <tif file="113140891.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於建立無障礙網站的裝置</chinese-title>
        <english-title>DEVICE FOR CREATING ACCESSIBLE WEBSITE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/958</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張湘芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於建立無障礙網站的裝置。用於建立無障礙網站的裝置包括輸入輸出裝置、收發器以及處理器。處理器通過輸入輸出裝置來接收欲建立網站資訊以及欲建立無障礙網站級別；處理器利用欲建立網站資訊來建立對應於欲建立無障礙網站級別的無障礙網站；處理器通過收發器來傳送對應於無障礙網站的無障礙網站檢測請求至無障礙檢測機關裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An device for creating an accessible website is provided. The device for creating the accessible website includes an input and output device, a transceiver, and a processor. The processor receives to-be-created-website-information and a to-be-created-accessible-website-level through the input and output device; the processor uses the to-be-created-website-information to create the accessible website corresponding to the to-be-created-accessible-website-level; the processor transmits an accessible website certification request corresponding to the accessible website to an accessibility certification body device through the transceiver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用於建立無障礙網站的裝置</p>
        <p type="p">110:輸入輸出裝置</p>
        <p type="p">120:收發器</p>
        <p type="p">130:處理器</p>
        <p type="p">140:儲存媒體</p>
        <p type="p">200:無障礙檢測機關裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="535" publication-number="202617243">
    <tif-files tif-type="multi-tif">
      <tif file="113140892.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消泡反應器以及消除反應中生成泡沫的方法</chinese-title>
        <english-title>DEFOAMING REACTOR AND METHOD FOR ELIMINATING FOAM GENERATED DURING REACTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">B01D19/02</main-classification>
        <further-classification edition="202201120250123B">B01F27/051</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張義國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐勇演</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YONG-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JHIH-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳藝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝賢德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIEN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種消泡反應器以及消除反應中生成泡沫的方法。消泡反應器包含腔體以及物料攪拌裝置。腔體具有腔體側壁，腔體側壁圍成相互連通之上內部空間及下內部空間。物料攪拌裝置設置於下內部空間。其中，含液體反應物在下內部空間中進行反應，上內部空間之體積為下內部空間之體積的兩倍以上。消除反應中生成泡沫的方法包含提供如前述之消泡反應器以及使含液體反應物在下內部空間中進行反應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a defoaming reactor and a method for eliminating foam generated during the reaction. The defoaming reactor includes a chamber and a material stirring device. The chamber has a chamber side wall, wherein the chamber side wall encloses an upper internal space and a lower internal space that are interconnected. The material stirring device is arranged in the lower inner space. The liquid-including reactants react in the lower internal space, and the volume of the upper internal space is more than twice the volume of the lower internal space. The method of eliminating foam generated during the reaction includes providing a defoaming reactor as described above and making liquid-including reactants to react in the lower inner space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腔體</p>
        <p type="p">101:上內部空間</p>
        <p type="p">102:下內部空間</p>
        <p type="p">110:腔體側壁</p>
        <p type="p">200:物料攪拌裝置</p>
        <p type="p">220:消泡攪拌裝置</p>
        <p type="p">300:上加熱裝置</p>
        <p type="p">400:控溫裝置</p>
        <p type="p">510:泡沫偵測裝置</p>
        <p type="p">520:噴灑裝置</p>
        <p type="p">600:消泡加熱裝置</p>
        <p type="p">900:消泡反應器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="536" publication-number="202616941">
    <tif-files tif-type="multi-tif">
      <tif file="113140893.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140893</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>農耕機排泥機構</chinese-title>
        <english-title>AGRICULTURAL MACHINE MUD DISCHARGE MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A01B33/16</main-classification>
        <further-classification edition="200601120241230B">B60S1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>升億開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENG YI R&amp;D CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李爵冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JUEGUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李爵冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JUEGUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁三郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, SABURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林見軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種農耕機排泥機構，特別是為解決農耕機耕地後車輪所積卡之泥土排除而設計的輔助裝置，其主要是於農耕機底部的車架前、後預定位置處分別置設有至少一組或一組以上之油壓伸縮缸，該等油壓伸縮缸的油壓管路乃得與農耕機既有的油壓系統整合配置，或者可作獨立之油壓管路系統配置，透過油壓管路的控制而得促使該等油壓伸縮缸產生昇降作動，藉該等油壓伸縮缸的突伸而得將農耕機向上頂昇，使其輪體呈懸空狀態，佐以輪體的旋動空轉所形成的離心力作用而得將所積卡的泥土甩脫排除，避免泥土轉移積留於路面而影響其他車輛的行車安全，以符合相關法規而免於受罰，有效解決現有農耕機在耕地後所面臨的積土清理難題者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a mud discharge mechanism for an agricultural machine, especially an auxiliary device designed to remove soil accumulated on the rear wheels of the agricultural machine. It is mainly located at predetermined positions at the front and rear of the frame at the bottom of the agricultural machine. At least one or more groups of hydraulic telescopic cylinders are provided. The hydraulic pipelines of these hydraulic telescopic cylinders must be integrated with the existing hydraulic system of the agricultural machine, or they can be used as independent hydraulic pipelines. The system configuration, through the control of the hydraulic pipeline, causes the hydraulic telescopic cylinders to produce a lifting action. The agricultural machine is lifted upward by the protrusion of the hydraulic telescopic cylinders, so that its wheel body is suspended in the air. state, with the centrifugal force formed by the rotation and idling of the wheel body, the accumulated soil can be thrown away and removed, so as to prevent the soil from transferring and accumulating on the road surface and affecting the driving safety of other vehicles, so as to comply with relevant regulations and avoid penalties. , which effectively solves the problem of soil clearing faced by existing agricultural machinery after plowing the land.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(10):農耕機</p>
        <p type="p">(11)(12):輪體</p>
        <p type="p">(20):油壓伸縮缸</p>
        <p type="p">(40):油壓管路系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="537" publication-number="202617117">
    <tif-files tif-type="multi-tif">
      <tif file="113140896.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140896</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>復健輔助系統</chinese-title>
        <english-title>REHABILITATION ASSISTANCE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241224B">A61H1/00</main-classification>
        <further-classification edition="202101120241224B">A61B5/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許煜亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張興政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭景元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嬿竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-ZHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇科銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, KE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種復健輔助系統，包含復健裝置、感測網路、感測裝置及互動式介面。復健裝置穿戴於操作者之患側手，配置以帶動患側手進行手肘關節復健動作、掌指關節復健動作及手腕關節復健動作。感測網路包含用以量測第一慣性感測訊號的第一慣性感測模組。感測裝置包含用以量測第二慣性感測訊號的第二慣性感測模組、用以量測操作者之生理訊號的生理訊號感測器。第一慣性感測模組及第二慣性感測模組更用以量測第三慣性感測訊號。互動式介面包含用以儲存慣性感測訊號及生理訊號的記憶體及用以接收並依據操作者之控制指令發送復健指令至復健裝置的處理器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rehabilitation assistance system includes a rehabilitation device, a sensing network, a sensing device and an interactive interface. The rehabilitation device is worn on an affected hand of a patient and is configured to drive the affected hand to perform elbow joint rehabilitation movements, metacarpophalangeal joint rehabilitation movements, and wrist joint rehabilitation movements. The sensing network includes a first inertial sensing module configured to measure a first inertial sensing signal. The sensing device includes a second inertial sensing module configured to measure a second inertial sensing signal, a physiological signal sensor configured to measure a physiological signal of the patient. The first inertial sensing module and the second inertial sensing module are further configured to measure a third inertial sensing signal. The interactive interface includes a memory for storing these inertial sensing signals and the physiological signal, and a processor configured to receive and send a rehabilitation instruction to the rehabilitation device according to a control instruction of the patient.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:復健輔助系統</p>
        <p type="p">110:復健裝置</p>
        <p type="p">120:感測網路</p>
        <p type="p">130:感測裝置</p>
        <p type="p">140:互動式介面</p>
        <p type="p">142:記憶體</p>
        <p type="p">144:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="538" publication-number="202618518">
    <tif-files tif-type="multi-tif">
      <tif file="113140898.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140898</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虛擬校史館導覽系統及其操作方法</chinese-title>
        <english-title>VIRTUAL SCHOOL HISTORY MUSEUM NAVIGATION SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">G06F3/01</main-classification>
        <further-classification edition="202201120241130B">G06F3/0484</further-classification>
        <further-classification edition="202201120241130B">G06F3/04815</further-classification>
        <further-classification edition="202201120241130B">G06F3/04845</further-classification>
        <further-classification edition="200601120241130B">G06F3/14</further-classification>
        <further-classification edition="202301120241130B">G06F18/00</further-classification>
        <further-classification edition="201301120241130B">G06F21/60</further-classification>
        <further-classification edition="201301120241130B">G06F21/62</further-classification>
        <further-classification edition="202401120241130B">G06Q50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致理學校財團法人致理科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIHLEE UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉品如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PIN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周裔蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, I-JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種虛擬校史館導覽系統包括電子導覽裝置以及元宇宙校史館平台。參訪者藉由電子導覽裝置進入元宇宙校史館平台中。元宇宙校史館平台包括身分分析模組、虛擬校史館模組、校園模型展示模組以及即時通訊模組。身分分析模組根據參訪者輸入的資料判斷參訪者的身分。虛擬校史館模組根據校史館圖檔產生虛擬校史館環境，並將其傳送至電子導覽裝置。校園模型展示模組根據校園模型圖檔產生校園模型物件，並將其加入虛擬校史館環境中以供參訪者進行觀看。即時通訊模組接收參訪者觀看虛擬校史館環境時提出的即時訊息，並根據即時訊息回傳回覆訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:虛擬校史館導覽系統</p>
        <p type="p">110:電子導覽裝置</p>
        <p type="p">120:元宇宙校史館平台</p>
        <p type="p">122:身分分析模組</p>
        <p type="p">124:虛擬校史館模組</p>
        <p type="p">126:校園模型展示模組</p>
        <p type="p">128:即時通訊模組</p>
        <p type="p">130:意見反饋更新模組</p>
        <p type="p">200:參訪者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="539" publication-number="202618227">
    <tif-files tif-type="multi-tif">
      <tif file="113140899.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境因子感測裝置與其在追蹤化妝品使用安全之應用</chinese-title>
        <english-title>ENVIRONMENTAL FACTOR SENSING DEVICE AND THE USE OF THE SAME IN TRACKING THE SAFETY OF COSMETICS USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01J1/42</main-classification>
        <further-classification edition="200601120241204B">G01J1/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美好健康科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOD HEALTH TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹馥妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, FELICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種環境因子感測裝置及化妝品品質管理方法。環境因子感測裝置包含裝置本體以及變色物件。變色物件以在裝置本體之外側可見之方式設置於裝置本體，變色物件在環境因子參數符合預設條件時，發生變色。化妝品品質管理方法包含提供上述的環境因子感測裝置，其中設置有化妝品；觀測環境因子感測裝置；當觀測到變色物件發生變色，判斷化妝品之品質發生變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An environmental factor sensing device and a cosmetic quality management method are disclosed. The environmental factor sensing device includes a device body and a color-changing object. The color-changing object is arranged on the device body in such a manner that it is visible from the outside of the device body. The color-changing object changes color when the environmental factor parameters meet a preset condition. The cosmetic quality management method includes providing the above-mentioned environmental factor sensing device, in which cosmetics are disposed; observing the environmental factor sensing packaging; and determining the quality of the cosmetics has changed when a color change of the color-changing object is observed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置本體</p>
        <p type="p">200:變色物件</p>
        <p type="p">900:環境因子感測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="540" publication-number="202618751">
    <tif-files tif-type="multi-tif">
      <tif file="113140900.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數據編碼模塊、時序控制晶片、顯示裝置及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241202B">G09G3/3208</main-classification>
        <further-classification edition="201601120241202B">G09G3/3225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商集創北方（珠海）科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (ZHUHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種數據編碼模塊，用以整合在一時序控制晶片，且被配置在該時序控制晶片與至少一個顯示驅動晶片進行點對點傳輸時對一顯示數據進行編碼。和習知的8b/9b編碼方法相比，本發明之數據編碼模塊所採用的編碼方式能夠有效降低傳輸數據的overhead(額外負擔)，降低了所需傳輸的數據量。因此，進行點對點傳輸時，該時序控制晶片可以降低數據傳輸速率，減輕了晶片運算負擔。此外，在整合本發明之數據編碼模塊的情況下，原設計之時序控制晶片與顯示驅動晶片可以支援更高解析度及/或幀率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">11:顯示面板</p>
        <p type="p">12:顯示驅動晶片</p>
        <p type="p">10:時序控制晶片</p>
        <p type="p">13:可撓性基板</p>
        <p type="p">14:主基板</p>
        <p type="p">2:數據編碼模塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="541" publication-number="202619191">
    <tif-files tif-type="multi-tif">
      <tif file="113140905.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器和連接器組件</chinese-title>
        <english-title>CONNECTOR AND CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250225B">H01R13/639</main-classification>
        <further-classification edition="200601120250225B">H01R13/502</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宣城立訊精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUANCHENG LUXSHARE PRECISION INDUSTRY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白毅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, YIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEIHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供了一種連接器和連接器組件，該連接器包括連接器主體和旋鈕，連接器主體上設有安裝孔和兩個鎖桿，兩個鎖桿在連接器與配合連接器對接時擺動至扣合位置以扣合配合連接器上的兩個鎖扣，鎖桿在擺動至解扣位置時與對應的鎖扣分離，旋鈕旋轉設置於安裝孔內並且具有鎖緊部，鎖緊部位於兩個鎖扣之間，旋鈕被配置為在鎖定位置與解鎖位置之間轉動，旋鈕控制鎖緊部可轉動地抵頂至少一個鎖桿。由此，連接器透過旋鈕同步鎖緊兩個鎖桿，既有助於在連接器對接時提高連接的可靠性，又可以在連接器未對接時鎖住鎖桿以防止連接器對接錯誤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a connector and a connector assembly. The connector comprises a connector body and a knob. A mounting hole and two locking levers are disposed on the connector body. When the connector is mated with a mating connector, the two locking levers are swung into an engagement position to engage two locking elements on the mating connector. When the locking levers are swung into a disengagement position, the locking levers are disengaged from the corresponding locking elements. The knob is rotatably disposed in the mounting hole and provided with a locking portion. The locking portion is located between the two locking elements. The knob is configured to rotate between the engagement position and the disengagement position. The knob controls the locking portion to rotatably abut at least one locking lever. The connector synchronously locks the two locking levers through the knob, which is favorable for improving the reliability of the connection when the connector is mated, but also locks the locking levers when the connector is not mated to prevent incorrect mating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器主體</p>
        <p type="p">12:鎖桿</p>
        <p type="p">13:對接槽</p>
        <p type="p">131:擴展槽</p>
        <p type="p">2:旋鈕</p>
        <p type="p">A:連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="542" publication-number="202618729">
    <tif-files tif-type="multi-tif">
      <tif file="113140906.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140906</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模型車輛之動力試驗裝置</chinese-title>
        <english-title>MODEL VEHICLE POWER TEST DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250113B">G09B9/00</main-classification>
        <further-classification edition="200601120250113B">G01M3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺東專科學校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAITUNG JUNIOR COLLEGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡政龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧家湄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIA MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模型車輛之動力試驗裝置，適用測試一模型車輛的動力，其包含一定位單元、一阻力單元，及一記錄單元，該定位單元包括一固定座體，及一支撐體，該固定座體用以固定該模型車輛，該阻力單元包括一恆定阻力提供模組，及一度量尺規，該恆定阻力提供模組上具有一樞轉軸心，及一量測基準點，該度量尺規的起始點對應該量測基準點，並且該度量尺規往該恆定阻力提供模組樞轉軸心進行度量標示，該記錄單元包括一記錄表，及一負載位置記錄欄位，該負載位置記錄欄位用於記錄該度量尺規上的度量標示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power test device for a model vehicle, suitable for testing the power of a model vehicle. It includes a positioning unit, a resistance unit, and a recording unit. The positioning unit includes a fixed base body and a supporting body. The fixed base body is used to fix the model vehicle. The resistance unit includes a constant resistance providing module and a measuring scale. The constant resistance provides a pivot axis and a measurement reference point on the module. The starting point of the measuring ruler corresponds to the measurement datum point. And the measuring ruler is used to measure and mark the pivot axis of the constant resistance providing module. The recording unit includes a recording table and a resistance position recording field. The resistance position record field is used to record the metric markings on the metric ruler.</p>
      </isu-abst>
      <representative-img>
        <p type="p">211:輪體組件</p>
        <p type="p">3:定位單元</p>
        <p type="p">31:固定座體</p>
        <p type="p">32:支撐體</p>
        <p type="p">34:致動固定座</p>
        <p type="p">4:阻力單元</p>
        <p type="p">41:恆定阻力提供模組</p>
        <p type="p">411:樞轉軸心</p>
        <p type="p">412:量測基準點</p>
        <p type="p">42:度量尺規</p>
        <p type="p">43:水平偵測模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="543" publication-number="202619579">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電二極體及其製造方法</chinese-title>
        <english-title>PHOTODIODE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F30/223</main-classification>
        <further-classification edition="202501120250102B">H10F77/14</further-classification>
        <further-classification edition="202501120250102B">H10F77/12</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林駿杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭元焜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YUAN-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾寶儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, PAO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光電二極體及其製造方法，其中光電二極體包含一第一導電型半導體層、一本徵層、一第二導電型半導體層及一上緣角。其中，本徵層設置於第一導電型半導體層上，第二導電型半導體層設置於本徵層之一中央區域上並裸露出環繞中央區域外之本徵層之一外圍區域。上緣角設置於本徵層之外圍區域之一邊緣，使經上緣角進入本徵層之一第一外部光線與一水平線間之一第一夾角相較未經上緣角進入本徵層之一第二外部光線與水平線間之一第二夾角為大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photodiode and a manufacturing method thereof are provided. The photodiode comprises a first conductive type semiconductor layer, an intrinsic layer, a second conductive type semiconductor layer and an upper edge bevel. The intrinsic layer is disposed on the first conductive type semiconductor layer, and the second conductive type semiconductor layer is disposed on a central region of the intrinsic layer and exposes a peripheral region of the intrinsic layer surrounding the central region. The upper edge bevel is disposed at an edge of the peripheral region of the intrinsic layer so that a first angle between a horizontal line and a first external light entering the intrinsic layer through the upper edge bevel is larger than a second angle between the horizontal line and a second external light entering the intrinsic layer without passing through the upper edge bevel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光電二極體</p>
        <p type="p">110:第一導電型半導體層</p>
        <p type="p">120:本徵層</p>
        <p type="p">130:第二導電型半導體層</p>
        <p type="p">140:保護層</p>
        <p type="p">150:上緣角</p>
        <p type="p">160:上部電極</p>
        <p type="p">170:下部電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="544" publication-number="202619580">
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          <doc-number>202619580</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140909</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電二極體及其製造方法</chinese-title>
        <english-title>PHOTODIODE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F30/223</main-classification>
        <further-classification edition="202501120250102B">H10F77/12</further-classification>
        <further-classification edition="202501120250102B">H10F77/14</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林駿杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光電二極體及其製造方法，其中光電二極體包含一第一導電型半導體層、一本徵層、一第二導電型半導體層及一金屬矽化物層（Silicide）。其中，本徵層設置於第一導電型半導體層上，用以接收一特定波長的一光線後對應地產生一光電流。第二導電型半導體層設置於本徵層之一中央區域上並裸露出環繞中央區域外之本徵層之一外圍區域。金屬矽化物層設置於本徵層之外圍區域之一邊緣，以減少穿過該邊緣而進入本徵層之部分光線被本徵層接收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photodiode and a manufacturing method thereof are provided. The photodiode comprises a first conductive type semiconductor layer, an intrinsic layer, a second conductive type semiconductor layer, and a silicide layer. The intrinsic layer is disposed on the first conductive type semiconductor layer and designed to generate a photocurrent in response to receiving a light of a specific wavelength. The second conductive type semiconductor layer is disposed on a central region of the intrinsic layer for exposing an outer peripheral region of the intrinsic layer surrounding the central region. The silicide layer is disposed at an edge of the outer peripheral region of the intrinsic layer to reduce a portion of the light that passes through the edge and enters the intrinsic layer for thereby preventing it from being absorbed by the intrinsic layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光電二極體</p>
        <p type="p">110:第一導電型半導體層</p>
        <p type="p">120:本徵層</p>
        <p type="p">130:第二導電型半導體層</p>
        <p type="p">140:保護層</p>
        <p type="p">150:金屬矽化物層</p>
        <p type="p">160:上部電極</p>
        <p type="p">170:下部電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="545" publication-number="202619581">
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      <volno>24</volno>
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          <doc-number>202619581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電二極體及其製造方法</chinese-title>
        <english-title>PHOTODIODE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F30/223</main-classification>
        <further-classification edition="202501120250102B">H10F77/12</further-classification>
        <further-classification edition="202501120250102B">H10F77/14</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林駿杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍紹儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, SHAO-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光電二極體及其製造方法，其中光電二極體包含一第一導電型半導體層、一本徵層及一第二導電型半導體層。其中，本徵層設置於第一導電型半導體層上，用以接收一特定波長的一光線後對應地產生一光電流。第二導電型半導體層設置於本徵層之一中央區域上並裸露出環繞中央區域外之本徵層之一外圍區域。其中，本徵層之一電阻率係4000至6300 歐姆-公分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photodiode and a manufacturing method thereof are provided. The photodiode comprises a first conductive type semiconductor layer, an intrinsic layer and a second conductive type semiconductor layer. The intrinsic layer is disposed on the first conductive type semiconductor layer and designed to generate a photocurrent in response to receiving a light of a specific wavelength. The second conductive type semiconductor layer is disposed on a central region of the intrinsic layer for exposing an outer peripheral region of the intrinsic layer surrounding the central region. The resistivity of the intrinsic layers ranges from 4000 to 6300 Ω-cm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光電二極體</p>
        <p type="p">110:第一導電型半導體層</p>
        <p type="p">120:本徵層</p>
        <p type="p">130:第二導電型半導體層</p>
        <p type="p">140:保護層</p>
        <p type="p">150:上部電極</p>
        <p type="p">160:下部電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="546" publication-number="202617486">
    <tif-files tif-type="multi-tif">
      <tif file="113140911.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>駕駛人監控裝置及方法</chinese-title>
        <english-title>DRIVER MONITORING APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241204B">B60W40/09</main-classification>
        <further-classification edition="200601120241204B">B60W50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈三聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SAN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種駕駛人監控裝置及方法。該裝置朝一駕駛人發出一光線。該裝置接收由該駕駛人反射的該光線以產生一反射光資訊。該裝置基於該反射光資訊，計算該駕駛人的一即時深度資訊。該裝置比對該即時深度資訊以及一標準深度資訊以計算一深度差異。該裝置基於該深度差異，決定是否執行一警示運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driver monitoring apparatus and method are provided. The apparatus emits light toward a driver. The apparatus receives the light reflected by the driver to generate a reflected light data. The apparatus calculates a real-time depth data of the driver based on the reflected light data. The apparatus compares the real-time depth data and a standard depth data to calculate a depth difference. The apparatus determines whether to execute a warning operation based on the depth difference.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:駕駛人監控裝置</p>
        <p type="p">12:處理器</p>
        <p type="p">14:發光元件</p>
        <p type="p">16:光感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="547" publication-number="202618713">
    <tif-files tif-type="multi-tif">
      <tif file="113140912.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活體檢測裝置及方法</chinese-title>
        <english-title>LIVENESS DETECTION APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250418B">G06V40/40</main-classification>
        <further-classification edition="202201120250418B">G06V40/18</further-classification>
        <further-classification edition="202201120250418B">G06V20/59</further-classification>
        <further-classification edition="202201120250418B">G06V10/40</further-classification>
        <further-classification edition="200601120250418B">G08B21/06</further-classification>
        <further-classification edition="200601120250418B">B60W30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種活體檢測裝置及方法。該裝置擷取一駕駛人的一即時影像；基於一第一時間區間的該即時影像，計算該駕駛人的一睜眼持續時間。響應於該睜眼持續時間超過一第一時間閾值，該裝置執行一第一驗證運作以提示該駕駛人完成一活體檢測作業。響應於執行該第一驗證運作，該裝置基於一第二時間區間的該即時影像，繼續計算該睜眼持續時間。響應於該睜眼持續時間超過一第二時間閾值，該裝置執行一第二驗證運作以提示該駕駛人完成該活體檢測作業，其中該第二時間閾值大於該第一時間閾值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liveness detection apparatus and method are provided. The apparatus captures a live image of a driver. The apparatus calculates an eyes open duration of the driver based on the live image within a first time interval. In response to the eyes open duration exceeding a first duration threshold, the apparatus executes a first confirmation operation to notify the driver to complete a liveness detection operation. In response to executing the first confirmation operation, the apparatus continues to calculates the eyes open duration based on the live image within a second time interval. In response to the eyes open duration exceeding a second duration threshold, the apparatus executes a second confirmation operation to notify the driver to complete the liveness detection operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:活體檢測裝置</p>
        <p type="p">12:處理器</p>
        <p type="p">14:相機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="548" publication-number="202618676">
    <tif-files tif-type="multi-tif">
      <tif file="113140914.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>心理調適系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241220B">G06Q50/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>心進化有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅期</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種心理調適系統， 包含至少一個伺服器，設置以與至少一個終端裝置進行通訊，該伺服器包括：一輸入輸出模組，設置以接收該至少一個終端裝置的輸入數據，該輸入數據為可以基於語言、文字、繪圖的至少其中之一或組合的事件；一分析模組，與該輸入輸出模組耦接，設置以根據所接收的輸入數據分析該使用者的非理性信念、當前情緒及內在需要、情緒頻率的至少其中之一或組合；以及一顯示模組，與該輸入輸出模組和該分析模組耦接，設置以根據所分析的分析結果傳輸至該至少一個終端裝置。藉由本發明的心理調適系統能夠幫助使用者探索、理解和管理其情緒及內在需要，透過分析模組識別非理性信念，對使用者的當前情緒及需要進行分析，進而制定針對性的行動方案，有效提升個體的心理調適能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:伺服器</p>
        <p type="p">121:輸入輸出模組</p>
        <p type="p">122:分析模組</p>
        <p type="p">1221:非理性信念識別單元</p>
        <p type="p">1222:非理性信念提醒單元</p>
        <p type="p">1223:情緒需要對應單元</p>
        <p type="p">123:顯示模組</p>
        <p type="p">1231:視覺化單元</p>
        <p type="p">124:紀錄模組</p>
        <p type="p">125:情緒數據庫</p>
        <p type="p">126:需要數據庫</p>
        <p type="p">127:非理性信念數據庫</p>
        <p type="p">20:終端裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="549" publication-number="202618475">
    <tif-files tif-type="multi-tif">
      <tif file="113140919.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於生成式AI開發一種設備精度輔助調校系統及其方法</chinese-title>
        <english-title>DEVELOPMENT OF A SYSTEM AND METHOD FOR PRECISION-ASSISTED CALIBRATION BASED ON GENERATIVE AI</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G05B19/18</main-classification>
        <further-classification edition="200601120250203B">G05B19/404</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覺文郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JYWE, WEN-YUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝東賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張信哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIN-ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為解決工具機調機技術無法有效傳達誤差種類與關鍵特徵的問題，本發明提供一種基於生成式AI的設備精度輔助調校系統及其方法，該系統包括CNC五軸工具機，配有平台、主軸和控制器，以控制平台和主軸運作；LRT檢測裝置負責檢測運行中的位置與元件誤差，並由誤差量測軟體輸出K1、K2靜態圖表與檢測數據；生成式AI模型基於大型語言模型進行調整，用於CNC五軸工具機調校，自動分析數據和圖表，判斷偏心或偏擺誤差，並計算補償參數，透過無線網路傳至控制器進行智能補償。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To address the issue where traditional machine tool calibration technology cannot effectively convey the types and key characteristics of errors, this invention provides a precision-assisted calibration system and method based on generative AI. The system includes a CNC five-axis machine tool, equipped with a platform, spindle, and controller to manage the operation of the platform and spindle. An LRT detection device is responsible for detecting positional and component errors during operation, with error measurement software outputting K1, K2 static graphs and detection data. A generative AI model, adjusted based on a large language model, is used for CNC five-axis machine tool calibration, automatically analyzing the data and graphs to determine eccentricity or runout errors, and calculating compensation parameters, which are transmitted via wireless network to the controller for intelligent compensation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基於生成式AI開發一種設備精度輔助調校系統</p>
        <p type="p">2:CNC五軸工具機</p>
        <p type="p">21:刀把</p>
        <p type="p">22:主軸</p>
        <p type="p">23:控制器</p>
        <p type="p">24:平台</p>
        <p type="p">3:LRT檢測裝置</p>
        <p type="p">31:感測模組</p>
        <p type="p">32:誤差量測軟體</p>
        <p type="p">33:球透鏡模組</p>
        <p type="p">4:生成式AI模型</p>
        <p type="p">41:介面</p>
        <p type="p">42:編碼器模組</p>
        <p type="p">43:分辨器模組</p>
        <p type="p">44:迴歸模型模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="550" publication-number="202618685">
    <tif-files tif-type="multi-tif">
      <tif file="113140920.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數位放大鏡影像顯示設備及其方法</chinese-title>
        <english-title>DIGITAL MAGNIFIER IMAGE DISPLAY APPARATUS AND METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241204B">G06T3/14</main-classification>
        <further-classification edition="201701120241204B">G06T7/70</further-classification>
        <further-classification edition="201301120241204B">G06F3/048</further-classification>
        <further-classification edition="200601120241204B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弼偉國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEWELLTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧君毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUNYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一些實施例提供一種數位放大鏡影像顯示設備，包括數位放大鏡及處理器。處理器包括影像數據匯入模組、影像校正模組及校正影像輸出模組。影像數據匯入模組匯入來自攝影裝置的即時影像、陀螺儀的即時影像座標及對應於即時影像的歷史影像數據資料的其中一者。影像校正模組產生重合影像。校正影像輸出模組將重合影像輸出至顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments of this disclosure provide a digital magnifier image display apparatus, including a digital magnifier and a processor. The processor includes an image data import module, an image correction module and a correction image output module. The image data import module imports a real-time image from a camera device, a real-time image coordinate of a gyroscope, and one of historical image data corresponding to the real-time image. The image correction module produces an overlapping image. The corrected image output module outputs the coincided image to a display device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:數位放大鏡影像顯示設備</p>
        <p type="p">100:數位放大鏡</p>
        <p type="p">120:攝影裝置</p>
        <p type="p">130:顯示裝置</p>
        <p type="p">140:陀螺儀</p>
        <p type="p">402:處理器</p>
        <p type="p">404:影像資料庫</p>
        <p type="p">410:姿勢預測模組</p>
        <p type="p">420:影像數據匯入模組</p>
        <p type="p">430:影像校正模組</p>
        <p type="p">440:校正影像輸出模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="551" publication-number="202617118">
    <tif-files tif-type="multi-tif">
      <tif file="113140921.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>夾式手指輔具</chinese-title>
        <english-title>CLIP-STYLE FINGER ASSISTIVE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A61H1/02</main-classification>
        <further-classification edition="200601120241204B">A63B23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王暉閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUEI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳岳巽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUE-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種夾式手指輔具包含一夾扣件及一限位件。夾扣件之一側凹設有一容置槽，且夾扣件用以夾扣於至少一手指上，使得手指能夠容納於容置槽內，容置槽之長軸方向平行夾扣件之長軸方向。限位件活動地連接夾扣件，且可移除地覆蓋容置槽，用以止擋並限位夾扣件內之手指。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A clip-style finger assistive device provided includes a clip fastener and a position limitation portion. The clip fastener is recessed with a received groove at one side thereof. The clip fastener is used to clip onto at least one finger so that the finger can be received within the received groove. A long axis direction of the received groove is parallel to a long axis direction of the clip fastener. The limitation portion is movably connected to the clip fastener and removably covering the receiving groove to stop and limit the fingers received within the clip fastener.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:夾式手指輔具</p>
        <p type="p">100:夾扣件</p>
        <p type="p">200:夾扣本體</p>
        <p type="p">201:溝槽</p>
        <p type="p">202:固定板</p>
        <p type="p">220:外弧側</p>
        <p type="p">240:第二肋條</p>
        <p type="p">241:第二狹孔</p>
        <p type="p">300:活動片體</p>
        <p type="p">320:外弧側</p>
        <p type="p">340:第一肋條</p>
        <p type="p">341:第一狹孔</p>
        <p type="p">400:容置槽</p>
        <p type="p">530:保護墊</p>
        <p type="p">600:限位件</p>
        <p type="p">601:軟質束帶</p>
        <p type="p">610:帶體</p>
        <p type="p">611:端部</p>
        <p type="p">612:另一端部</p>
        <p type="p">620:第一連結部</p>
        <p type="p">730:連接桿</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="552" publication-number="202617658">
    <tif-files tif-type="multi-tif">
      <tif file="113140923.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內嵌奈米金屬的有機金屬骨架材料之製備方法、鋰離子電池的負極材料及無負極鋰離子電池</chinese-title>
        <english-title>PREPARATION METHOD OF ORGANIC METAL SKELETON MATERIAL EMBEDDED WITH NANOMETALLIC MATERIAL, LITHIUM BATTERY NEGATIVE ELECTRODE MATERIAL AND ANODE-FREE LITHIUM BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C07C51/41</main-classification>
        <further-classification edition="200601120241205B">C07C63/307</further-classification>
        <further-classification edition="200601120241205B">C07C63/333</further-classification>
        <further-classification edition="200601120241205B">C07D233/56</further-classification>
        <further-classification edition="201001120241205B">H01M4/134</further-classification>
        <further-classification edition="200601120241205B">H01M4/36</further-classification>
        <further-classification edition="200601120241205B">H01M4/38</further-classification>
        <further-classification edition="200601120241205B">H01M4/62</further-classification>
        <further-classification edition="201001120241205B">H01M10/0525</further-classification>
        <further-classification edition="201101120241205B">B82Y30/00</further-classification>
        <further-classification edition="201101120241205B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯量科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLIDEDGE SOLUTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王品涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋兆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曾隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王誠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仍奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JENG-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種內嵌奈米金屬的有機金屬骨架材料之製備方法。所述內嵌奈米金屬的有機金屬骨架材料製備方法包括以下步驟：提供金屬鹽和有機配體混合的前驅混合溶液；提供調節溶液，將所述調節溶液與所述前驅混合溶液混合並進行反應，所述調節溶液使所述前驅混合溶液的PH值为3-7，反應形成有機金屬骨架材料；將有機金屬骨架材料分散於疏水性溶劑中，再添加金屬鹽溶液，吸附之後乾燥，在氣體環境下進行金屬還原反應，形成內嵌奈米金屬的有機金屬骨架材料。另外，本發明還提供一種鋰離子電池的負極材料及無負極鋰離子電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for preparing an organic metal skeleton material embedded with nanometallic material. The preparation method of the organic metal framework material embedded with nanometallic material includes the following steps: providing a precursor mixed with a metal salt and an organic ligand; Provide an adjusting liquid, mix the adjusting liquid and the precursor liquid mixed solution and make them react with each other to form an organic metal framework material, the adjusting liquid solution makes a pH value of the mixed precursor solution range from 3 to 7; the organic metal framework material is dispersed in a hydrophobic solvent, then a metal salt solution is added, adsorbed and then dried, and a metal reduction reaction is performed in a gas environment to form the negative electrode. In addition, the present invention also provides lithium battery negative electrode material and a anode-free lithium battery.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="553" publication-number="202619290">
    <tif-files tif-type="multi-tif">
      <tif file="113140924.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超越元件耐壓條件的開關電路</chinese-title>
        <english-title>SWITCH CIRCUIT EXCEEDING COMPONENT BREAKDOWN VOLTAGE CONDITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H03K17/08</main-classification>
        <further-classification edition="202001120250203B">H03K19/1778</further-classification>
        <further-classification edition="200601120250203B">H03K19/0185</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱立程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, LI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種超越元件耐壓條件的開關電路，包括一偏壓電路、至少一第一電晶體、複數第二電晶體及一第三電晶體。偏壓電路包括彼此串聯的複數偏壓元件並耦接至一電壓源，以經由此些偏壓元件形成複數壓降節點。此些第二電晶體彼此串聯並耦接至電壓源，且一對一耦接此些壓降節點。此些第二電晶體中的任二相鄰者之間設置有第一電晶體。第三電晶體與此些第二電晶體串聯而形成一開關路徑。其中，當第三電晶體接收一控制訊號而導通時，此些第一電晶體關斷且此些第二電晶體導通，使得開關路徑導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A switch circuit exceeding component breakdown voltage condition includes a bias circuit, at least one first transistor, a plurality of second transistors, and a third transistor. The bias circuit comprises a plurality of bias components connected in series to each other and coupled to a voltage source to form a plurality of voltage-drop nodes via the bias components. The second transistors are connected in series with each other and coupled to the voltage source, and are one-to-one coupled to the voltage-drop nodes. There is one of the at least one first transistor disposed between any two adjacent second transistors. The third transistor is connected in series with the second transistors to form a switching path. When the third transistor receives a control signal and turns on, the at least one first transistor turns off, and the second transistors turn on, thereby allowing the switching path to conduct.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:超越元件耐壓條件的開關電路</p>
        <p type="p">BC:偏壓電路</p>
        <p type="p">D1~D6:二極體</p>
        <p type="p">N:第三電晶體</p>
        <p type="p">Nd,Nd1~Nd3:第二電晶體</p>
        <p type="p">P,P1,P2:第一電晶體</p>
        <p type="p">R1~R3:電阻</p>
        <p type="p">R4:接地電阻</p>
        <p type="p">Rd:下拉電阻</p>
        <p type="p">Rt:開關路徑</p>
        <p type="p">Se:控制訊號</p>
        <p type="p">VA,VB,VC:壓降節點</p>
        <p type="p">Vdd:電壓源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="554" publication-number="202618414">
    <tif-files tif-type="multi-tif">
      <tif file="113140925.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明顯示器及其控制方法</chinese-title>
        <english-title>TRANSPARENT DISPLAY AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G02F1/13</main-classification>
        <further-classification edition="200601120241230B">G02F1/133</further-classification>
        <further-classification edition="200601120241230B">G02F1/1343</further-classification>
        <further-classification edition="200601120241230B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達擎股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO DISPLAY PLUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴明宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透明顯示器包含多個畫素。各畫素包含至少一子畫素。各子畫素包含電極組、高分子分散液晶(PDLC)層、發光件、發光控制電路、判斷電路及透光驅動電路。電極組包含第一電極及第二電極，其間具有控制電壓。PDLC層位於第一電極與第二電極之間，以根據控制電壓而處於散射態或穿透態。發光件位於PDLC層中，接收偏壓而根據偏壓處於發光狀態或不發光狀態。發光控制電路電性連接於發光件並輸出偏壓至發光件。判斷電路電性連接於發光控制電路並根據偏壓輸出驅動訊號。透光驅動電路電性連接於判斷電路與電極組並根據驅動訊號產生控制電壓至電極組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transparent display includes multiple pixels. Each pixel includes at least one subpixel. Each subpixel includes an electrode set, a polymer-dispersed liquid crystal (PDLC) layer, a light-emitting element, a light emission control circuit, a determination circuit, and a transparency driving circuit. The electrode set includes a first electrode and a second electrode, between which a control voltage exists. The PDLC layer is located between the first electrode and the second electrode to be in a scatter state or a transmission state. The light-emitting element is located in the PDLC layer and receives a bias to be in an emission state or a non-emission state in accordance with the bias. The light emission control circuit is electrically connected to the light-emitting element and outputs the bias to the light-emitting element. The determination circuit is electrically connected to the light emission control circuit and outputs a driving signal in accordance with the bias. The transparency driving circuit is electrically connected to the determination circuit and the electrode set and generates the control voltage to the electrode set in accordance with the driving signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:透明顯示器</p>
        <p type="p">110:第一透光層</p>
        <p type="p">120:第二透光層</p>
        <p type="p">200:畫素</p>
        <p type="p">300:子畫素</p>
        <p type="p">310:PDLC層</p>
        <p type="p">320:電極組</p>
        <p type="p">321:第一電極</p>
        <p type="p">322:第二電極</p>
        <p type="p">330:發光件</p>
        <p type="p">340:控制電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="555" publication-number="202618638">
    <tif-files tif-type="multi-tif">
      <tif file="113140926.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行動支付方法與系統</chinese-title>
        <english-title>MOBILE PAYMENT METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250203B">G06Q20/22</main-classification>
        <further-classification edition="201201120250203B">G06Q20/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澧達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEADOT INNOVATION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鏗又</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種行動支付方法，包括：由商家端提供支付觸發資訊；由消費端依據支付觸發資訊與代位收款端建立通訊連接；代位收款端依據支付觸發資訊提供行動支付介面給消費端，行動支付介面包含複數個行動支付連結；以及當消費端選取該些行動支付連結其中之一時，代位收款端與消費端之間以所選取的行動支付連結所對應的行動支付工具完成行動支付動作。另外，本發明公開一種應用上述行動支付方法的行動支付系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a mobile payment method, which includes steps of: a business end providing payment trigger information; a consumer end establishing a communication connection with a subrogation service end based on the payment trigger information; the subrogation service end providing a mobile payment interface to the consumer end based on the payment trigger information, wherein the mobile payment interface contains multiple mobile payment links; and when the consumer end selects one of the mobile payment links, a mobile payment action is completed between the subrogation service end and the consumer end using a mobile payment tool corresponding to the selected mobile payment link. The invention also discloses a mobile payment system applying the mobile payment method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:行動支付方法</p>
        <p type="p">A01~A02,S01~S06:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="556" publication-number="202618717">
    <tif-files tif-type="multi-tif">
      <tif file="113140928.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>主動消毒提款機</chinese-title>
        <english-title>ACTIVE STERILIZING AUTOMATED TELLER MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G07F19/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘銘村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種主動消毒提款機包括外殼、顯示裝置、投影裝置以及消毒裝置。顯示裝置設置於外殼上。投影裝置設置於顯示裝置上方，且耦接於顯示裝置，其中投影裝置用以投影光學鍵盤至外殼上的平台上。消毒裝置設置於外殼上，用以消毒平台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An active sterilizing automated teller machine includes a shell, a display device, a projection device and a sterilization device. The display device is disposed on the shell. The projection device is disposed above the display device and connected to the display device, in which the projection device is configured to project an optical keyboard onto a platform of the shell. The sterilization device is disposed on the shell and configured to sterilize the platform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主動消毒提款機</p>
        <p type="p">110:外殼</p>
        <p type="p">111:垂直部分</p>
        <p type="p">112:平台</p>
        <p type="p">120:顯示裝置</p>
        <p type="p">130:投影裝置</p>
        <p type="p">131:光學鍵盤</p>
        <p type="p">140:消毒裝置</p>
        <p type="p">150:讀取裝置</p>
        <p type="p">D1:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="557" publication-number="202617089">
    <tif-files tif-type="multi-tif">
      <tif file="113140931.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料擴增方法、訓練方法、電子設備和電腦儲存介質</chinese-title>
        <english-title>DATA AMPLIFICATION METHOD, TRAINING METHOD, ELECTRONIC DEVICE, AND COMPUTER STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241231B">A61B5/346</main-classification>
        <further-classification edition="202101120241231B">A61B5/352</further-classification>
        <further-classification edition="202101120241231B">A61B5/353</further-classification>
        <further-classification edition="202101120241231B">A61B5/355</further-classification>
        <further-classification edition="201901120241231B">G06N20/00</further-classification>
        <further-classification edition="200601120241231B">G06F17/18</further-classification>
        <further-classification edition="202101120241231B">A61B5/308</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃升泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　振鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUOK, CHAN-PANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種資料擴增方法、訓練方法、電子設備和電腦儲存介質。資料擴增方法包括：獲取心電特徵資料；選取目標異常資料中任意一個資料作為第一異常資料；選取目標異常資料中另外一個資料作為第二異常資料；計算第一異常資料和第二異常資料之間的差值，以及差值和隨機擴展係數的乘積；將乘積與第一異常資料的總和作為異常擴展資料及將異常擴展資料加入目標異常資料。本申請能夠擴充心電圖資料的資料量，使得正常資料和異常資料的資料量保持平衡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a data amplification method, a training method, an electronic device and a computer storage medium. The data amplification method includes obtaining electrocardiogram characteristic data; selecting any data in a target abnormal data as a first abnormal data and another data in the target abnormal data selected as a second abnormal data; calculating a difference between the first abnormal data and the second abnormal data, and a product of the difference and a random expansion coefficient; taking a sum of the product and the first anomaly data as an abnormal expansion data; adding the abnormal expansion data to the target abnormal data. This application can expand the amount of electrocardiogram characteristic data, so that the amount of normal data and abnormal data can maintain a balance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101、102、103、104、105:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="558" publication-number="202619330">
    <tif-files tif-type="multi-tif">
      <tif file="113140933.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140933</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有動態封包傳送排序機制的網路通訊裝置及方法</chinese-title>
        <english-title>NETWORK COMMUNICATION APPARATUS AND METHOD HAVING A DYNAMIC PACKET TRANSMISSION SORTING MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L47/50</main-classification>
        <further-classification edition="202201120250203B">H04L47/56</further-classification>
        <further-classification edition="202201120250203B">H04L47/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庭宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有動態封包傳送排序機制的網路通訊裝置。封包分類電路將每一低延遲封包設置為所選低延遲封包，以儲存於對應的所選低延遲佇列電路。傳送排序電路對所選低延遲封包計算停佇時間參數來與其他低延遲封包進行排序來更新排序清單，其中停佇時間參數為所選低延遲封包儲存在所選低延遲佇列電路的總停佇時間超過對應所選低延遲佇列電路設置的動態服務時間門檻值的比例。通訊電路根據排序清單依序傳送低延遲封包。動態調整電路計算所選低延遲封包的封包總傳送時間相對目標延遲門檻值的差距，以根據差距動態調整動態服務時間門檻值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network communication apparatus having a dynamic packet transmission sorting mechanism is provided. A packet categorization circuit sets each of low-latency packets as a selected low-latency packet to be stored in a corresponding selected low-latency queue circuit. A transmission sorting circuit calculates a queue time parameter of the selected low-latency packet to be sorted with the other low-latency packets to update a sorting list, wherein the queue time parameter is a ratio of a total queue time that the selected low-latency packet stored in the selected low-latency queue circuit that exceeds a dynamic service time threshold value configured by the corresponding selected low-latency queue circuit. A communication circuit transmits the low-latency packets according to the sorting list. A dynamic adjusting circuit calculates a difference of a total packet transmission time of the selected low-latency packet from a target delay threshold value to dynamically adjust the dynamic service time threshold value according to the difference.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:網路通訊裝置</p>
        <p type="p">200A~200B:低延遲佇列電路</p>
        <p type="p">210A~210B:非低延遲佇列電路</p>
        <p type="p">220:封包分類電路</p>
        <p type="p">230:傳送排序電路</p>
        <p type="p">240:通訊電路</p>
        <p type="p">250:動態調整電路</p>
        <p type="p">DD:差距</p>
        <p type="p">DST:動態服務時間門檻值</p>
        <p type="p">PK:待傳送封包</p>
        <p type="p">PKL:低延遲封包</p>
        <p type="p">PKL1~PKL3:低延遲封包</p>
        <p type="p">PKN:非低延遲封包</p>
        <p type="p">PKN1~PKN4:非低延遲封包</p>
        <p type="p">PTT:封包總傳送時間</p>
        <p type="p">QTP:停佇時間參數</p>
        <p type="p">QTT:總停佇時間</p>
        <p type="p">TDT:目標延遲門檻值</p>
        <p type="p">TSL:排序清單</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="559" publication-number="202618241">
    <tif-files tif-type="multi-tif">
      <tif file="113140934.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>護欄強度測試裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">G01N3/02</main-classification>
        <further-classification edition="200601120250324B">G01N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根基營造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEDGE CONSTRUCTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾治國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIH KAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃照峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種護欄強度測試裝置，用以測試工地現場的護欄強度是否符合法規標準，其主要係由一第一桿體、一第二桿體、以及一基座組構而成，第一桿體一端與基座形成一樞設連接，另一端則藉由一測力計與一固定裝置組設於待測護欄之上欄杆，第一桿體於鄰近基座上方處與第二桿體形成樞接，並藉由一連接裝置限制其與第二桿體間展開的角度，測試人員僅需站立於第二桿體之施力部，便可利用自身的體重測試護欄的強度是否符合法規規範值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:護欄強度測試裝置</p>
        <p type="p">11:第一桿體</p>
        <p type="p">12:基座</p>
        <p type="p">113:第一樞設件</p>
        <p type="p">114:延伸片</p>
        <p type="p">15:連接裝置</p>
        <p type="p">13:第二桿體</p>
        <p type="p">132:第二樞設件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="560" publication-number="202619291">
    <tif-files tif-type="multi-tif">
      <tif file="113140935.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多工器與其漏電流控制方法</chinese-title>
        <english-title>MULTIPLEXER AND LEAKAGE CURRENT CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H03K17/693</main-classification>
        <further-classification edition="200601120241204B">H03K3/011</further-classification>
        <further-classification edition="200601120241204B">H04J3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于子立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, ZI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳准</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃承啟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多工器包含第一與第二選擇電路以及漏電流控制電路。第一選擇電路根據第一選擇訊號選擇性導通，以傳輸一第一輸入訊號到一輸出節點以產生輸出電壓。第二選擇電路包含第一與第二開關。該第一開關根據第二選擇訊號選擇性導通，且該第二開關根據第一與第二控制訊號導通，以在第一開關導通時傳輸第二輸入訊號至該輸出節點。漏電流控制電路在該第一選擇電路導通時比較該輸出電壓與複數個參考電壓以產生複數個偵測訊號，並根據該複數個偵測訊號與該第二選擇訊號選擇性地調整該第一控制訊號或該第二控制訊號的位準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multiplexer includes first and selection circuits and a leakage current control circuit. The first selection circuit is selectively turned on according to a first selection signal to transmit a first input signal to generate an output voltage. The second selection circuit includes first and second switches. The first switch is selectively turned on according to a second selection signal, and the second switch is turned on according to the first and second control signals, to transmit a second input signal to the output node when the first switch is turned on. The leakage current control circuit compares the output voltage with reference voltages when the first selection circuit is turned on, to generate detection signals, and selectively adjusts the level of the first control signal or the second control signal according to the detection signals and the second selection signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多工器</p>
        <p type="p">110,120:選擇電路</p>
        <p type="p">130:漏電流控制電路</p>
        <p type="p">IN1,IN2:輸入訊號</p>
        <p type="p">NO:輸出節點</p>
        <p type="p">SEL1,SEL2:選擇訊號</p>
        <p type="p">VH,VL:參考電壓</p>
        <p type="p">VO:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="561" publication-number="202619337">
    <tif-files tif-type="multi-tif">
      <tif file="113140936.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影圖像校正系統與投影圖像校正方法</chinese-title>
        <english-title>PROJECTION IMAGE CORRECTION SYSTEM AND PROJECTION IMAGE CORRECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04N9/31</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐陽俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU YANG, JUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈劍楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, JIAN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭貴鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUEI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡政宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">投影圖像校正系統包含狀態控制電路以及資料輸出電路。狀態控制電路在對應於插值運算中的讀取請求未發送過給第一記憶體時發出該讀取請求給第一記憶體以獲得第一像素資訊，儲存第一像素資訊至第二記憶體，並計數讀取請求發送給第一記憶體的次數以產生第一計數值。資料輸出電路根據寫入完成訊號計數以產生第二計數值，並在第二計數值相同於第一計數值時自第二記憶體獲得插值運算要用的多個第二像素資訊給插值裝置，以執行插值運算。寫入完成訊號指示第一像素資訊已儲存至第二記憶體，且多個第二像素資訊包含第一像素資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projection image correction system includes a status control circuit and a data output circuit. The status control circuit issues a read request to the first memory to obtain first pixel information when the read request corresponding to the interpolation operation has not yet been sent to the first memory, stores the first pixel information to a second memory, and counts the number of read requests sent to the first memory to generate a first count value. The data output circuit counts based on a write completion signal to generate a second count value, and obtains multiple second pixel information used for the interpolation operation from the second memory for the interpolation device to perform the interpolation operation when the second count value is equal to the first count value. The write completion signal indicates that the first pixel information has been stored in the second memory, and the multiple second pixel information includes the first pixel information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:投影圖像校正系統</p>
        <p type="p">101:投影梯形校正裝置</p>
        <p type="p">102:插值裝置</p>
        <p type="p">103:記憶體</p>
        <p type="p">110:地址解碼電路</p>
        <p type="p">120:記憶體</p>
        <p type="p">122,124,126,128:記憶體庫</p>
        <p type="p">130:確認電路</p>
        <p type="p">140:資料排序電路</p>
        <p type="p">150:先入先出電路</p>
        <p type="p">160:狀態控制電路</p>
        <p type="p">170:資料輸出電路</p>
        <p type="p">180:資料寫入電路</p>
        <p type="p">add_req:地址請求訊號</p>
        <p type="p">AddXX:地址訊號</p>
        <p type="p">CT1:計數值</p>
        <p type="p">DIN:原始圖像資料</p>
        <p type="p">Req:至少一讀取請求</p>
        <p type="p">SC:至少一寫入完成訊號</p>
        <p type="p">TT:目標標籤值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="562" publication-number="202619413">
    <tif-files tif-type="multi-tif">
      <tif file="113140937.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD AND METHOD FOR FABRICATION OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K1/02</main-classification>
        <further-classification edition="200601120241230B">H05K7/20</further-classification>
        <further-classification edition="200601120241230B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子(秦皇島)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電路板及其製造方法，此電路板包含線路基板及設置於線路基板上方的散熱部。散熱部包含第一記憶金屬、第二記憶金屬及散熱層，互相間隔的第一記憶金屬及第二記憶金屬連接線路基板，並且位於散熱層及線路基板之間。線路基板用於輸入電能至散熱部，以使第一記憶金屬處於第一溫度而第二記憶金屬處於第二溫度。當記憶金屬的變形溫度介於第一溫度及第二溫度之間時，第一記憶金屬伸長並接觸散熱層，而第二記憶金屬與散熱層之間完全分隔。當第一溫度及第二溫度高於或等於變形溫度時，第一記憶金屬及第二記憶金屬伸長並接觸散熱層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board and a method for fabricating the circuit board are provided. The circuit board includes a wire board and a heat dissipation part on the wire board. The heat dissipation part includes a first shape memory alloy (SMA), a second SMA and a heat dissipation layer. The first SMA and the second SMA spaced from each other are connected to the wire board and are located between the heat dissipation layer and the wire board. The wire board is used to input the electricity into the heat dissipation part, so that the first SMA is at a first temperature, while the second SMA is at a second temperature. When a transition temperature of the first SMA and the second SMA is between the first temperature and the second temperature, the first SMA stretches to touch the heat dissipation layer, but the second SMA is spaced from the heat dissipation layer completely. When the first temperature and the second temperature are higher than or equal to the transition temperature, the first SMA and the second SMA stretch to touch the heat dissipation layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板</p>
        <p type="p">110:線路基板</p>
        <p type="p">110f,110s:表面</p>
        <p type="p">112:凹槽</p>
        <p type="p">112b:底面</p>
        <p type="p">112w:側壁</p>
        <p type="p">116:導電盲孔</p>
        <p type="p">120:散熱部</p>
        <p type="p">121:第一記憶金屬</p>
        <p type="p">121t,122t:頂表面</p>
        <p type="p">122:第二記憶金屬</p>
        <p type="p">123:第三記憶金屬</p>
        <p type="p">124:散熱層</p>
        <p type="p">124c:線路層</p>
        <p type="p">124m:金屬層</p>
        <p type="p">124f:絕緣導熱膜</p>
        <p type="p">125:第一電阻層</p>
        <p type="p">126:第二電阻層</p>
        <p type="p">127:第三電阻層</p>
        <p type="p">150:絕緣材料</p>
        <p type="p">170,170’:覆蓋層</p>
        <p type="p">SL:種子層</p>
        <p type="p">A1:中心軸</p>
        <p type="p">CL1,CL2:導電層</p>
        <p type="p">s1,s2:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="563" publication-number="202618229">
    <tif-files tif-type="multi-tif">
      <tif file="113140938.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓力感測器及其製造方法</chinese-title>
        <english-title>PRESSURE SENSOR AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01L1/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐筱婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIAO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIAWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何明展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, MING-JAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓力感測器及其製造方法。壓力感測器包括感測軟板。感測軟板包括介電層、兩層線路層與壓電感測塊。介電層具有第一表面與相對於第一表面的第二表面。兩層線路層分別設置在介電層的第一表面與第二表面。壓電感測塊設置在介電層中，並電性連接兩個線路層。上述壓力感測器因使用感測軟板，可適應欲測試樣品的不同曲面弧度，有助於改善量測一致性與準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer apiece. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be adapted to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓力感測器</p>
        <p type="p">110:感測軟板</p>
        <p type="p">114:覆蓋層</p>
        <p type="p">115:介電層</p>
        <p type="p">117:第一表面</p>
        <p type="p">119:第二表面</p>
        <p type="p">120:線路層</p>
        <p type="p">125:走線</p>
        <p type="p">130:壓電感測塊</p>
        <p type="p">135:孔洞</p>
        <p type="p">140:黏著層</p>
        <p type="p">150:支撐基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="564" publication-number="202616989">
    <tif-files tif-type="multi-tif">
      <tif file="113140941.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用於一家具的觸控式防傾倒裝置</chinese-title>
        <english-title>TOUCH-SENSITIVE ANTI-TIP DEVICE SUITABLE FOR FURNITURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241204B">A47B88/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳴周科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIEZO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王韋勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊詔任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, SHAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱因</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳肇庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉元平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯明憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於一家具的觸控式防傾倒裝置，該觸控式防傾倒裝置包含一鎖扣件、一電致動鎖具、一控制單元和一觸發模組。該鎖扣件安裝於該至少一抽屜且可隨該至少一抽屜移動。該電致動鎖具安裝於該家具本體，該電致動鎖具用以於該至少一抽屜移動至該收合位置時呈一鎖扣狀態，以鎖扣該鎖扣件。該控制單元耦接於該電致動鎖具，該觸發模組耦接於該控制單元。當該電致動鎖具呈該鎖扣狀態以鎖扣該鎖扣件且該觸發模組未被觸發時，該控制單元控制該電致動鎖具維持該鎖扣狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch-sensitive anti-tip device suitable for furniture, including a latch component, an electrically actuated lock, a control unit, and a trigger module. The latch component is installed on at least one drawer, including the ability to move with the drawer. The electrically actuated lock is installed on the furniture body, including a design that engages in a locked state when the drawer moves to a closed position, securing the latch component. The control unit is linked to the electrically actuated lock, including control over its operation, while the trigger module is linked to the control unit. When the electrically actuated lock is in the locked state and the trigger module is not activated, the control unit ensures that the lock remains in the locked state, preventing the drawer from tipping over.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:觸控式防傾倒裝置</p>
        <p type="p">200:家具</p>
        <p type="p">100:家具本體</p>
        <p type="p">101:抽屜</p>
        <p type="p">1:鎖扣件</p>
        <p type="p">11:扣合部</p>
        <p type="p">2:電致動鎖具</p>
        <p type="p">21:電磁閥模組</p>
        <p type="p">211:外殼</p>
        <p type="p">212:電磁組件</p>
        <p type="p">213:卡閂件</p>
        <p type="p">214:彈性件</p>
        <p type="p">22:電磁組件</p>
        <p type="p">23:卡閂件</p>
        <p type="p">24:彈性件</p>
        <p type="p">3:控制單元</p>
        <p type="p">4:觸發模組</p>
        <p type="p">41:觸發元件</p>
        <p type="p">5:致動開關</p>
        <p type="p">CP:收合位置</p>
        <p type="p">AS:容置空間</p>
        <p type="p">LP:卡閂位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="565" publication-number="202618582">
    <tif-files tif-type="multi-tif">
      <tif file="113140947.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>教育整合系統及其使用方法</chinese-title>
        <english-title>EDUCATION INTEGRATION SYSTEM AND METHOD FOR USING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250107B">G06F16/9038</main-classification>
        <further-classification edition="202301120250107B">G06N3/08</further-classification>
        <further-classification edition="200601120250107B">G08B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學醫學院附設醫院新竹臺大分院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY HOSPITAL HSIN-CHU BRANCH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚慶鼎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, CHING-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃美鑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MEI-LUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃詩婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SZU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃思云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SSU-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種教育整合系統，包括通訊模組、資訊儲存模組、資訊處理模組及資訊管控模組。上述通訊模組用以接收及傳輸資訊。上述資訊儲存模組用以儲存病患資訊及疾病衛教資訊。上述資訊處理模組使用一生成式人工智慧模型或一自然語言模型根據上述使用者要求資訊或上述使用者語音資訊進行分析，並生成與上述使用者要求資訊或上述使用者語音資訊的相應的一回應資訊或一語音回應資訊。上述資訊管控模組用以根據一內容控管條件以過濾上述回應資訊或上述語音回應資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A education integration system includes a communication module, an information storage module, an information processing module, and an information control module. The communication module is configured to receive and transmit information. The information storage module is configured to store patient information and disease education information. The information processing module utilizes a generative artificial intelligence model or a natural language model to analyze the user request information or the user voice information, and generates a corresponding response information or voice response information related to the user request information or the user voice information. The information control module is configured to filter the response information or the voice response information based on a content control condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:教育整合系統</p>
        <p type="p">110:通訊模組</p>
        <p type="p">120:資訊儲存模組</p>
        <p type="p">130:資訊處理模組</p>
        <p type="p">150:資訊管控模組</p>
        <p type="p">160:醫院主機</p>
        <p type="p">170:使用者通訊裝置</p>
        <p type="p">180:外部資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="566" publication-number="202618764">
    <tif-files tif-type="multi-tif">
      <tif file="113140950.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G11C5/14</main-classification>
        <further-classification edition="200601120241204B">G11C19/28</further-classification>
        <further-classification edition="201901120241204B">G06F1/32</further-classification>
        <further-classification edition="200601120241204B">G11C7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍永吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, YUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，具有二個獨立的第一電源域和第二電源域，設置於前述電源域中的電路各自有對應的時脈訊號。第一和第二電源各自具有第一儲存單元和第二儲存單元。當半導體裝置進入省電模式時，將第一儲存單元的參數維持在第二儲存單元，再將第一電源域斷電。在省電模式下透過第二時脈號驅動第二電源域中各電路的時序，可避免時脈源跨越不同電源域的問題。因此，第二電源域可使用處理速度低於第一儲存單元的第二儲存單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a semiconductor device having two independent power domains including a first power domain and a second power domain. Different clock signals are applied to the circuits which are provided in the first and second power domains respectively. The first and second power domains have a first storage unit and a second storage unit, respectively. When the semiconductor device enters a power saving mode, the parameter of the first storage unit are maintained in the second storage unit, and then the first power domain is turned off. In the power saving mode, the timing of each device in the second power domain is driven by the second clock signal, so as to solve the problem of clock domain crossing between different power domains. Therefore, the second power domain may use a second storage unit with a lower processing speed than the first storage unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:半導體裝置</p>
        <p type="p">41:第一電路區塊</p>
        <p type="p">42:第二電路區塊</p>
        <p type="p">VDD0:第一電源域</p>
        <p type="p">VDD1:第二電源域</p>
        <p type="p">410:處理器(CPU)</p>
        <p type="p">411:暫存控制器</p>
        <p type="p">411a:讀寫控制器</p>
        <p type="p">411b:儲存單元(DFF_0)</p>
        <p type="p">420:隔離單元</p>
        <p type="p">421:及閘</p>
        <p type="p">422:儲存單元(DFF_1)</p>
        <p type="p">423:或閘</p>
        <p type="p">424:計時器</p>
        <p type="p">B1~B3:緩衝裝置</p>
        <p type="p">CPU_CLK:CPU時脈訊號</p>
        <p type="p">RET_CLK:維持時脈訊號</p>
        <p type="p">timer_en:儲存單元(DFF_0)的輸出訊號</p>
        <p type="p">timer_en_ret:對應於儲存單元(DFF_1)的輸出訊號</p>
        <p type="p">iso_n:隔離訊號</p>
        <p type="p">save_en:儲存致能訊號</p>
        <p type="p">hold_ret_rstn:重置訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="567" publication-number="202617407">
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      <volno>24</volno>
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      <publication-reference>
        <document-id>
          <doc-number>202617407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Ｔ型塑膠押出模自動化均厚調整模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250922B">B29C48/07</main-classification>
        <further-classification edition="201901120250922B">B29C48/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳育鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳育志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳育鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳育志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種T型塑膠押出模自動化均厚調整模組，包括一T型塑膠押出模、一自動調整裝置，以及一可程式控制器(PLC)，T型塑膠押出模具有複數個可對應調整模唇射出口厚薄之調整螺桿，以及於調整螺桿一側設有一固定螺桿，自動調整裝置可滑動地位移對應於各調整螺桿及固定螺桿上方，包括一呈水平軸向移動之第一傳動模組、一控制垂直縱向行程之第二傳動模組，以及一可旋轉調整螺桿角度之驅動模組，藉由自動調整裝置之第一傳動模組、第二傳動模組、驅動模組與一可程式控制器(PLC)電性連結使形成一控制迴路，當啟動電源時，操作可程式控制器(PLC)設定自動調整裝置以固定螺桿為預設初始原點取得歸零數值參數，利用自動調整裝置之第二傳動模組將偵測搜尋訊號回傳可程式控制器(PLC)進行數值運算，令自動調整裝置之驅動模組對各調整螺桿自動進行歸零校正，並取得每一調整螺桿現在位置之數值，再依預設模式參數選項設定成品厚度，令T型塑膠押出模入料進行成品押出行程，並可再藉由配合一外部測厚儀裝置連線即時監控產品厚度，當偵測成品超出預設參數範圍，即自動啟動自動調整裝置位移至對應之調整螺桿坐標位置即時調整模唇間隙，俾達得一均厚成品產出。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:T型塑膠押出模自動化均厚調整模組</p>
        <p type="p">200:T型塑膠押出模</p>
        <p type="p">300:自動調整裝置</p>
        <p type="p">400:可程式控制器(PLC)</p>
        <p type="p">500:均厚成品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="568" publication-number="202619287">
    <tif-files tif-type="multi-tif">
      <tif file="113140959.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內部電壓產生裝置及其產生方法</chinese-title>
        <english-title>INTERNAL VOLTAGE GENERATING DEVICE AND GENERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">H03K4/48</main-classification>
        <further-classification edition="200601120250204B">H03K5/22</further-classification>
        <further-classification edition="200601120250204B">H02M3/04</further-classification>
        <further-classification edition="200601120250204B">G05F3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種內部電壓產生裝置及其產生方法被提出。內部電壓產生裝置包括控制電路以及電壓產生電路。控制電路包括驅動強度控制電路。驅動強度控制電路被配置以根據內部電壓與參考電壓的比較結果產生多個驅動強度控制信號。電壓產生電路包括電荷泵啟用控制電路及多個電荷泵。電荷泵啟用控制電路耦接至驅動強度控制電路，電荷泵啟用控制電路被配置以產生多個啟動信號，並根據驅動強度控制信號更新啟動信號。電荷泵根據啟動信號決定電荷泵的啟用數量，而經由電荷泵的被啟用者來產生泵升電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An internal voltage generating device and its generating method are proposed. The internal voltage generating device includes a control circuit and a voltage generation circuit. The control circuit includes a drive strength control circuit. The drive strength control circuit is configured to generate multiple drive strength control signals based on the comparison result between the internal voltage and a reference voltage. The voltage generation circuit includes a charge pump enable control circuit and multiple charge pumps. The charge pump enable control circuit is coupled to the drive strength control circuit, and is configured to generate multiple enable signals and update the enable signals based on the drive strength control signals. The charge pumps determine the number of charge pumps to be enabled based on the enable signals, and generate pump-up voltage through the enabled charge pumps.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:內部電壓產生裝置</p>
        <p type="p">210:控制電路</p>
        <p type="p">2110:驅動強度控制電路</p>
        <p type="p">220:電壓產生電路</p>
        <p type="p">230:電荷泵啟用控制電路</p>
        <p type="p">221~22N:電荷泵</p>
        <p type="p">A1~AN:啟動信號</p>
        <p type="p">CP1~CPN:驅動強度控制信號</p>
        <p type="p">VPPD:內部電壓</p>
        <p type="p">VPDCHG:泵升電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="569" publication-number="202619249">
    <tif-files tif-type="multi-tif">
      <tif file="113140977.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有高轉換比的單級非隔離式降壓轉換器</chinese-title>
        <english-title>SINGLE-STAGE NON-ISOLATED BUCK CONVERTER WITH HIGH CONVERSION RATIO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">H02M3/04</main-classification>
        <further-classification edition="200601120250205B">H02M1/08</further-classification>
        <further-classification edition="200601120250205B">G05F1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱煌仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HUANG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　庭福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, DINH PHUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　英勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, ANH DUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有高轉換比的單級非隔離式降壓轉換器，包括輸入電容、輸出電容、主要電感、第一開關電路、多個第二開關電路、第三開關電路以及開關控制電路。第一開關電路包括第一高側開關、第一箝位電容及第一低側開關。至少一第二開關電路各包括第二高側開關、第二箝位電容、第一附加電感及第二低側開關。第三開關電路包括第三高側開關、第三低側開關及第二附加電感。開關控制電路經配置以控制第一高側開關、第一低側開關、該等第二高側開關及該等第二低側開關在多個工作模式下導通及關斷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a single-stage non-isolated buck converter with high conversion ratio, and the single-stage non-isolated buck converter includes an input capacitor, an output capacitor, a main inductor, a first switch circuit, a plurality of second switch circuits, a third switch circuit and a switch control circuit. The first switch circuit includes a first high-side switch, a first clamping capacitor and a first low-side switch. A plurality of second switch circuits each includes a second high-side switch, a second clamping capacitor, a first additional inductor and a second low-side switch. The switch control circuit is configured to control the first high-side switch, the first low-side switch, the second high-side switches and the second low-side switches to be turned on and off in a plurality of operating modes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單級非隔離式降壓轉換器</p>
        <p type="p">Cin:輸入電容</p>
        <p type="p">Cout:輸出電容</p>
        <p type="p">L1:主要電感</p>
        <p type="p">L2、L3、L4:附加電感</p>
        <p type="p">10:第一開關電路</p>
        <p type="p">12-1、12-2:第二開關電路</p>
        <p type="p">16:開關控制電路</p>
        <p type="p">Nc:共用節點</p>
        <p type="p">R:負載</p>
        <p type="p">C1、C2、C3:箝位電容</p>
        <p type="p">S1H、S2H、S3H、S4H:高側開關</p>
        <p type="p">S1L、S2L、S3L、S4L:低側開關</p>
        <p type="p">Vin:輸入電源</p>
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="570" publication-number="202618284">
    <tif-files tif-type="multi-tif">
      <tif file="113140981.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工件檢測設備及面板檢測方法</chinese-title>
        <english-title>WORKPIECE INSPECTION APPARATUS AND METHODS OF PANEL INSPECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">G01R1/02</main-classification>
        <further-classification edition="200601120241128B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日月光半導體製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓少嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SHAO-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種檢測設備及一種面板檢測方法。該檢測設備包括：一檢測平台；一夾取裝置，其設置於該檢測平台上並可水平滑動，該夾取裝置經組態以將一面板沿一第一方向夾取至該檢測平台上；及一推回件，其與該夾取裝置一同設置於該檢測平台上，該推回件經組態以限制該面板相對於該夾取裝置在該第一方向上之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection apparatus and a method of panel inspection are provided. The inspection apparatus includes an inspection platform; a clamping device arranged on the inspection platform and can slide horizontally, the clamping device configured to clamp a panel onto the inspection platform along a first direction; and a push-back component arranged on the inspection platform alongside the clamping device. The push-back component configured to restrict a position of the panel relative to the clamping device in the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工件檢測設備</p>
        <p type="p">10:檢測平台</p>
        <p type="p">11:基座殼體</p>
        <p type="p">21:軌道</p>
        <p type="p">21a:致動裝置</p>
        <p type="p">21b:基座</p>
        <p type="p">22:軌道</p>
        <p type="p">22a:致動裝置</p>
        <p type="p">22b:基座</p>
        <p type="p">30:夾取裝置</p>
        <p type="p">30t:滑軌</p>
        <p type="p">51:擋塊</p>
        <p type="p">52:擋塊</p>
        <p type="p">61:第一感測模組</p>
        <p type="p">62:第一感測模組</p>
        <p type="p">80:工件</p>
        <p type="p">90:料盒</p>
        <p type="p">95:升降裝置</p>
        <p type="p">101:承載台</p>
        <p type="p">102:支柱</p>
        <p type="p">111:操作按鈕</p>
        <p type="p">113:輪子</p>
        <p type="p">115:支撐腳</p>
        <p type="p">951:平台</p>
        <p type="p">952:支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="571" publication-number="202619599">
    <tif-files tif-type="multi-tif">
      <tif file="113140982.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619599</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構</chinese-title>
        <english-title>PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/85</main-classification>
        <further-classification edition="202501120250102B">H10H20/855</further-classification>
        <further-classification edition="202501120250102B">H10H20/857</further-classification>
        <further-classification edition="202501120250102B">H10H29/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修邑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIOU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅錦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供封裝結構。封裝結構包括第一介電層、重佈線結構、複數個發光元件、積體電路元件及覆蓋層。第一介電層具有一頂表面與一側表面。重佈線結構設置於第一介電層中。複數個發光元件設置於第一介電層上。積體電路元件設置於第一介電層上，且相鄰複數個發光元件。覆蓋層設置在複數個發光元件及積體電路元件上，圍繞複數個發光元件及積體電路元件，且直接接觸第一介電層的頂表面及側表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure is provided. The package structure includes a first dielectric layer, a redistribution structure, a plurality of light-emitting elements, an integrated circuit element, and a cover layer. The first dielectric layer has a top surface and a side surface. The redistribution structure is disposed in the first dielectric layer. The plurality of light-emitting elements is disposed on the first dielectric layer. The integrated circuit element is disposed on the first dielectric layer and is adjacent to the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the integrated circuit element, surrounds the plurality of light-emitting elements and integrated circuit elements, and is in directly contact with the top surface and the side surface of the first dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:封裝結構</p>
        <p type="p">20:發光元件</p>
        <p type="p">20B:藍光發光元件</p>
        <p type="p">20BS,22BS,30BS,32BS,40BS:底表面</p>
        <p type="p">20G:綠光發光元件</p>
        <p type="p">20R:紅光發光元件</p>
        <p type="p">20SS,22SS,30SS,60SS,62SS:側表面</p>
        <p type="p">20TS,30TS,60TS:頂表面</p>
        <p type="p">22,22B,22G,22R,32,72:接墊</p>
        <p type="p">30:積體電路元件</p>
        <p type="p">40:覆蓋層</p>
        <p type="p">40P:突出部分</p>
        <p type="p">60:第一介電層</p>
        <p type="p">60P:頸狀部分</p>
        <p type="p">61:第一開口</p>
        <p type="p">62:重佈線結構</p>
        <p type="p">64:第二介電層</p>
        <p type="p">65:第二開口</p>
        <p type="p">66:金屬柱</p>
        <p type="p">70:封裝層</p>
        <p type="p">A1:第一區域</p>
        <p type="p">A2:第二區域</p>
        <p type="p">D3:第三方向</p>
        <p type="p">E1:側邊緣</p>
        <p type="p">E2:底邊緣</p>
        <p type="p">P1,P2:頂點</p>
        <p type="p">t20:第一厚度</p>
        <p type="p">t30:第二厚度</p>
        <p type="p">w40,w60:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="572" publication-number="202619467">
    <tif-files tif-type="multi-tif">
      <tif file="113140995.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>取料裝置</chinese-title>
        <english-title>PICK-UP DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K13/04</main-classification>
        <further-classification edition="200601120241204B">B65G47/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李枘諳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, RUI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞宏儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HORNG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種取料裝置，適於取出放置在一料架上的一料盤，取料裝置包括一驅動機構以及一取料模組。取料模組包括一取料件、一桿件以及一彈性件。取料件連接於驅動機構，且具有一接收開口與連通於接收開口的一接收空間。桿件包括彼此相反的一連接端及一自由端，其中桿件位於接收空間的一側，連接端連接取料件，自由端自接收開口突出。彈性件連接於桿件，且彈性件的一部分對應於自由端，其中驅動機構適於驅動取料件，使彈性件隨取料件同步移動以抵靠料盤，藉由彈性件施力於料盤，使料盤向取料件移動而脫離料架，以經由取料件的接收開口移入接收空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pick-up device is adapted to pick up a material tray which is disposed on a material rack. The pick-up device includes a driving mechanism and a pick-up module. The pick-up module includes a pick-up member, a rod member and an elastic member. The pick-up member is connected to the driving mechanism and has a receiving opening and a receiving space which is interconnected to the receiving opening. The rod member includes a connecting end and a free end which are opposite to each other, wherein the rod member is located at a side of the receiving space, the connecting end is connected to the pick-up member, and the free end is protruded from the receiving opening. The elastic member is connected to the rod member and a part of the elastic member corresponds to the free end, wherein the driving mechanism is adapted to drive the pick-up member to make the elastic member move correspondingly with the pick-up member to abut against the material tray. The elastic member forces the material tray to make the material tray move to the pick-up member and separate from the material rack, such that the material tray goes through the receiving opening of the pick-up member and moves into the receiving space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:料架</p>
        <p type="p">20、21:料盤</p>
        <p type="p">100:取料裝置</p>
        <p type="p">110:驅動機構</p>
        <p type="p">120:取料模組</p>
        <p type="p">121:取料件</p>
        <p type="p">123:桿件</p>
        <p type="p">125:彈性件</p>
        <p type="p">130:定位件</p>
        <p type="p">1215:主體</p>
        <p type="p">1217:緩衝件</p>
        <p type="p">1219:側板</p>
        <p type="p">1219a:側緣</p>
        <p type="p">1232:側面</p>
        <p type="p">1233:第一面</p>
        <p type="p">1251:第一端</p>
        <p type="p">1253:抵料部</p>
        <p type="p">1255:推料部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="573" publication-number="202619214">
    <tif-files tif-type="multi-tif">
      <tif file="113140996.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶有可調節刀片的電纜剝線手工具</chinese-title>
        <english-title>CABLE STRIPPING HAND TOOL WITH ADJUSTABLE BLADE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02G1/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加捷實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JETOOL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志榔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種帶有可調節刀片的電纜剝線工具，包括第一手柄、第二手柄與可調節刀片組件。第一手柄樞接第二手柄，可調節刀片組件設置於第一手柄。可調節刀片組件包括調節柱、切換輪與刀片。調節柱沿一軸穿設於第一手柄，調節柱具有異型柱體。切換輪套設於調節柱，切換輪具有異型孔以適配異型柱體，切換輪驅動調節柱沿該軸相對於第一手柄旋轉並在兩位置之間切換。刀片設置於調節柱，刀片隨第一手柄與第二手柄的相對樞轉而移近或遠離第二手柄，且刀片隨著調節柱在兩位置之間切換而呈橫向或縱向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cable stripping hand tool with adjustable blade including a first handle, a second handle, and an adjustable blade assembly disposed on the first handle is provided. The adjustable blade assembly includes am adjusting column, a switching wheel, and a blade disposed on the adjusting column. The adjusting column disposed and penetrating to the first handle along an axis has a special-shaped column body. The switching wheel is sheathed onto the adjusting column, the switching wheel has a special-shaped hole adapting to the special-shaped column body, and the switching wheel drives the adjusting column to pivot together about the axis relative to the first handle, such that the switching wheel and the adjusting column are switched between two positions. The blade moves to be vertical or horizontal as the switching wheel and the adjusting column switching between the two positions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:剝線手工具</p>
        <p type="p">110:第一手柄</p>
        <p type="p">120:第二手柄</p>
        <p type="p">130:可調節刀片組件</p>
        <p type="p">150:樞軸</p>
        <p type="p">160:承座</p>
        <p type="p">AX、CX:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="574" publication-number="202617630">
    <tif-files tif-type="multi-tif">
      <tif file="113141001.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於海水電解產氫之雙效電催化電極及包含其之電解催化反應系統</chinese-title>
        <english-title>HIGH ENTROPY BIFUNCTIONAL ELECTROCATALYST ELECTRODES FOR HYDROGEN PRODUCTION BY ELECTROLYSIS OF SEAWATER AND ELECTROLYSIS CATALYTIC REACTION SYSTEM COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C04B35/01</main-classification>
        <further-classification edition="200601120241205B">B01J23/889</further-classification>
        <further-classification edition="202101120241205B">C25B11/04</further-classification>
        <further-classification edition="202101120241205B">C25B11/052</further-classification>
        <further-classification edition="202101120241205B">C25B11/077</further-classification>
        <further-classification edition="202101120241205B">C25B1/04</further-classification>
        <further-classification edition="200601120241205B">C01B3/04</further-classification>
        <further-classification edition="201101120241205B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪緯璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱奕嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, I-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於海水電解產氫之雙效電催化電極，包括：一基板；以及一鍍層，設置於基板上，其中鍍層包括一高熵陶瓷奈米材料，且高熵陶瓷奈米材料為(Co        &lt;sub&gt;x&lt;/sub&gt;Cr        &lt;sub&gt;x&lt;/sub&gt;Fe        &lt;sub&gt;x&lt;/sub&gt;Ni        &lt;sub&gt;x&lt;/sub&gt;Mn        &lt;sub&gt;x&lt;/sub&gt;Cu        &lt;sub&gt;x&lt;/sub&gt;)O，x在0.8至1.2的範圍內。此外，本發明還關於一種包含前述雙效電催化電極之電解催化反應系統。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a bifunctional electrocatalyst electrode for hydrogen production by electrolysis, including a substrate and a coating layer. The coating layer is disposed on the substrate, and the coating layer includes a high entropy ceramic nanomaterial. The high entropy ceramic nanomaterial is (Co        &lt;sub&gt;x&lt;/sub&gt;Cr        &lt;sub&gt;x&lt;/sub&gt;Fe        &lt;sub&gt;x&lt;/sub&gt;Ni        &lt;sub&gt;x&lt;/sub&gt;Mn        &lt;sub&gt;x&lt;/sub&gt;Cu        &lt;sub&gt;x&lt;/sub&gt;)O, and x is ranged from 0.8-1.2. Moreover, the present invention also relates to an electrolysis catalytic reaction system comprising the aforementioned bifunctional electrocatalyst electrode.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:前驅物溶液</p>
        <p type="p">3:膠狀薄膜</p>
        <p type="p">4:鍍層</p>
        <p type="p">5:超聲波震盪器</p>
        <p type="p">6:紫外線臭氧清洗機</p>
        <p type="p">7:滴管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="575" publication-number="202617246">
    <tif-files tif-type="multi-tif">
      <tif file="113141012.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濾材結構及其應用之水洗過濾裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B01D46/30</main-classification>
        <further-classification edition="202201120241204B">B01D46/79</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪匡聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, KUANG SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅鎬德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, HAO DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIA-SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施姵彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, PEI TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏鈺佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種濾材結構及其應用之水洗過濾裝置，其中濾材結構以三個多孔件互相連接，其中之一多孔件以一夾角連接其餘二多孔件，以此濾材結構增加接觸面積，而應用該濾材結構之水洗過濾裝置包含一第一捕捉裝置以及一第二捕捉裝置，該第一捕捉裝置連通該第二捕捉裝置，該第一、二捕捉裝置個別包含二過濾模組，且該第一、二捕捉裝置個別包含之二過濾模組之內側個別設置過濾層以及上下噴灑模組，其中該過濾層係包含複數個該濾材結構，以此過濾裝置提升碳過濾/捕捉之效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:濾材結構</p>
        <p type="p">10:第一多孔件</p>
        <p type="p">12:第一穿孔</p>
        <p type="p">20:第二多孔件</p>
        <p type="p">22:第二穿孔</p>
        <p type="p">30:第三多孔件</p>
        <p type="p">32:第三穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="576" publication-number="202619601">
    <tif-files tif-type="multi-tif">
      <tif file="113141016.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H29/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙益聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHAO, YI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許意悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括驅動線路基板、發光元件、第一封裝層及第二封裝層。發光元件設置於驅動線路基板上，且與驅動線路基板電性連接。第一封裝層設置於驅動線路基板上，且具有多個反射微粒。第一封裝層包括第一部及第二部。第一部設置於驅動線路基板上，且由發光元件向外延展。第二部設置於第一部上且覆蓋發光元件的側壁。第二部的反射微粒的密度大於第一部的反射微粒的密度。第二封裝層設置於第一封裝層上且能吸光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a driving circuit substrate, a light emitting element, a first encapsulation layer and a second encapsulation layer. The light-emitting element is disposed on the driving circuit substrate and is electrically connected to the driving circuit substrate. The first encapsulation layer is disposed on the driving circuit substrate and has reflective particles. The first encapsulation layer includes a first portion and a second portion. The first portion is disposed on the driving circuit substrate and extends outward from the light-emitting element. The second portion is disposed on the first portion and covers a side wall of the light emitting element. A density of the reflective particles in the second portion is greater than a density of the reflective particles in the first portion. The second encapsulation layer is disposed on the first encapsulation layer and can absorb light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">110:驅動線路基板</p>
        <p type="p">112:接墊</p>
        <p type="p">120:發光元件</p>
        <p type="p">120a:頂面</p>
        <p type="p">120s:側壁</p>
        <p type="p">122:發光層</p>
        <p type="p">130:第一封裝層</p>
        <p type="p">130a、140a:表面</p>
        <p type="p">132:第一部</p>
        <p type="p">134:第二部</p>
        <p type="p">134a:斜面</p>
        <p type="p">140:第二封裝層</p>
        <p type="p">150:透光封裝層</p>
        <p type="p">D1、D2:距離</p>
        <p type="p">G112:接墊組</p>
        <p type="p">T132、T140、T150:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="577" publication-number="202619073">
    <tif-files tif-type="multi-tif">
      <tif file="113141017.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構</chinese-title>
        <english-title>PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01L23/31</main-classification>
        <further-classification edition="200601120250102B">H01L23/538</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創鑫智慧股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUCHIPS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怜潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LING CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連弘倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAN, HUNG LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佳峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝結構，包括一基底、多個記憶體晶片以及至少一橋接晶片。記憶體晶片分散配置於基底中。至少一橋接晶片配置於基底上，其中記憶體晶片透過至少一橋接晶片彼此電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure includes a substrate, a plurality of memory chips and at least one bridge chip. The memory chips are dispersed in the substrate. The at least one bridge chip is disposed on the substrate, wherein the memory chips are electrically connected to the other through the at least one bridge chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:封裝結構</p>
        <p type="p">110:基底</p>
        <p type="p">111:第一側</p>
        <p type="p">112:核心層</p>
        <p type="p">113:第二側</p>
        <p type="p">114:導電連接層</p>
        <p type="p">114a:導電層</p>
        <p type="p">114b:導電盲孔</p>
        <p type="p">114c:連接接墊</p>
        <p type="p">115:導電穿孔</p>
        <p type="p">116:線路結構層</p>
        <p type="p">116a:線路層</p>
        <p type="p">116b:導電盲孔</p>
        <p type="p">116c:連接接墊</p>
        <p type="p">122:第一記憶體晶片</p>
        <p type="p">124:第二記憶體晶片</p>
        <p type="p">132:橋接晶片</p>
        <p type="p">133:背面</p>
        <p type="p">140:封裝膠體</p>
        <p type="p">150:焊球</p>
        <p type="p">160:連接件</p>
        <p type="p">180:載體</p>
        <p type="p">182、184:連接接墊</p>
        <p type="p">190:焊球</p>
        <p type="p">D:方向</p>
        <p type="p">S1:上表面</p>
        <p type="p">S2:下表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="578" publication-number="202617366">
    <tif-files tif-type="multi-tif">
      <tif file="113141019.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>桿型工具</chinese-title>
        <english-title>ROD-TYPE TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25B23/00</main-classification>
        <further-classification edition="200601120241204B">B25F1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林琮淂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林琮淂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳居亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種桿型工具，包括一主桿及一抵持元件，其中該主桿沿軸向形成一工作桿段及一插接桿段，其中該工作桿段形成一掣動部，該掣動部構成該主桿軸向的一端，該插接桿段構成該主桿軸向的另一端，該插接桿段的徑向外周主要由六個外表面構成，該抵持元件設於該插接桿段，該抵持元件的一部分嵌入該插接桿段，該抵持元件的其他部分通過選定的兩個彼此相鄰的該外表面凸出該插接桿段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a rod-type tool, comprising a main rod and an abutment element. The main rod comprises, along its axial direction, a working rod section and a plug-in rod section. The working rod section comprises a driving portion, the driving portion being formed at one axial end of the main rod, and the plug-in rod section being formed at the other axial end of the main rod. The plug-in rod section comprises a radial outer periphery primarily consisting of six outer surfaces. The abutment element is disposed on the plug-in rod section, with a portion of the abutment element being embedded within the plug-in rod section. Another portion of the abutment element protrudes from the plug-in rod section through two selected adjacent outer surfaces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主桿</p>
        <p type="p">11:工作桿段</p>
        <p type="p">12:插接桿段</p>
        <p type="p">13:掣動部</p>
        <p type="p">14:外表面</p>
        <p type="p">18:頸部段</p>
        <p type="p">20:抵持元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="579" publication-number="202617209">
    <tif-files tif-type="multi-tif">
      <tif file="113141026.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿產生裝置</chinese-title>
        <english-title>PLASMA GENERATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">A61N1/02</main-classification>
        <further-classification edition="200601120250207B">A61N1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉辰浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃泰融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TAI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿產生裝置，包括一控制件、多個驅動件、多個升壓轉換件及一電漿產生件。這些驅動件電性連接於控制件。這些升壓轉換件分別一一對應地電性連接於這些驅動件。電漿產生件包括多個電極及至少一介電件。這些電極設置於介電件，這些升壓轉換件分別一一對應地電性連接於這些電極。控制件控制這些驅動件的至少一個在多個時段中驅動對應的升壓轉換件，以驅動對應的電極。在相鄰的兩時段中被驅動的電極至少部分相異，以產生一波浪式電漿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plasma generating device including a controller, a plurality of driving components, a plurality of boost converting components and a plasma generating component is provided. The driving components are electrically connected to the controller. The boost converting components are electrically connected to the driving components in one-to-one correspondence. The plasma generating component includes a plurality of electrodes and at least one dielectric component. The electrodes are disposed on the dielectric component, and the boost converting components are electrically connected to the electrodes in one-to-one correspondence. The controller controls at least one of the driving components to drive the boost converting component in a plurality of periods to drive the electrode. The electrode driven in two adjacent periods is at least partially different to generate a wave-like plasma.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿產生裝置</p>
        <p type="p">110:控制件</p>
        <p type="p">120a、120b、120c、120d:驅動件</p>
        <p type="p">130:升壓轉換件</p>
        <p type="p">140:電漿產生件</p>
        <p type="p">141a、141b、141c、141d:電極</p>
        <p type="p">142:介電件</p>
        <p type="p">143:黏著層</p>
        <p type="p">150:電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="580" publication-number="202617525">
    <tif-files tif-type="multi-tif">
      <tif file="113141029.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動計量系統</chinese-title>
        <english-title>AUTOMATIC MEASUREMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">B65B1/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中信金學校財團法人中信科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡若鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JO-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴天琮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動計量系統，用以在物料之作業過程中，同步對物料進行自動計量步驟。自動計量系統包含步進轉盤、物料暫存槽、緩衝料斗、測重裝置及出料料斗。步進轉盤係轉動，使得物料暫存槽分別由入料位置、秤重位置以及出料位置中之一者依序轉動另一者。緩衝料斗設於入料位置，用以收集物料，再將物料排放至物料暫存槽。測重裝置設於測重裝置，用以對位在秤重位置之物料暫存槽及物料進行自動計量步驟。出料料斗設於出料位置，其中物料暫存槽係於轉動至出料位置時，將物料暫存槽中之物料排放至出料料斗中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic measurement system for performing automatic measurement steps on materials during the operation process is disclosed. The automatic measurement system includes a stepper turntable, a material temporary storage tank, a buffer hopper, a weighing device, and a discharge hopper. The stepper turntable rotates, causing the material temporary storage tank to sequentially move from one of the feeding position, weighing position, and discharging position to another. The buffer hopper is located at the feeding position to collect materials and then discharge them into the material temporary storage tank. The weighing device is located at the weighing position to perform an automatic weighing step on the material temporary storage tank and the materials within it. The discharge hopper is located at the discharging position, where the material temporary storage tank discharges the materials into the discharge hopper when it rotates to the discharging position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:步進轉盤</p>
        <p type="p">20:物料暫存槽</p>
        <p type="p">30:緩衝料斗</p>
        <p type="p">40:測重裝置</p>
        <p type="p">50:出料料斗</p>
        <p type="p">60:處理器</p>
        <p type="p">100:物料</p>
        <p type="p">200:物料供應源</p>
        <p type="p">210:爬升機料斗</p>
        <p type="p">230:輸送帶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="581" publication-number="202617245">
    <tif-files tif-type="multi-tif">
      <tif file="113141030.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧除塵系統</chinese-title>
        <english-title>SMART DUST COLLECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">B01D46/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中信金學校財團法人中信科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡若鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JO-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴天琮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧除塵系統包含至少一輸送處理台、主吸力供應源、複數個集塵元件、複數個感測元件以及控制元件。輸送處理台具有複數個區域，用以對物料進行處理程序。主吸力供應源係經由抽風管提供主吸力。複數個集塵元件包含複數個集塵罩、複數個歧管及複數個閥門，且藉由主吸力於歧管之吸氣口形成副吸力，其中集塵罩之位置係對應於輸送處理台之區域，用以對物料進行除塵步驟。複數個感測元件用以即時偵測輸送處理台之區域上之粉塵數量。控制元件依據粉塵數量之數值排序，對應地各自控制集塵元件之運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart dust collection system comprises at least one conveyance processing table, a main suction supply source, multiple dust collection components, multiple sensing elements, and control components. The conveyance processing table has multiple zones for processing materials. The main suction supply source provides the main suction via an exhaust pipe. The multiple dust collection components include multiple dust hoods, multiple manifolds, and multiple valves, forming secondary suction at the manifold's inlet via the main suction. The positions of the dust hoods correspond to the zones of the conveyance processing table for performing a dust removal step on the materials. The multiple sensing elements detect the amount of dust in real time on the zones of the conveyance processing table. The control components sort according to the dust amount values and respectively control the operation of the dust collection components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:輸送處理台</p>
        <p type="p">20:主吸力供應源</p>
        <p type="p">22:抽風管</p>
        <p type="p">30:集塵元件</p>
        <p type="p">32:集塵罩</p>
        <p type="p">34:歧管</p>
        <p type="p">35:吸氣口</p>
        <p type="p">36:閥門</p>
        <p type="p">40:感測元件</p>
        <p type="p">50:控制元件</p>
        <p type="p">100:物料</p>
        <p type="p">A~D:區域</p>
        <p type="p">F:主吸力</p>
        <p type="p">F:副吸力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="582" publication-number="202619232">
    <tif-files tif-type="multi-tif">
      <tif file="113141031.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組化髮夾線繞組及定子結構</chinese-title>
        <english-title>MODULAR HAIRPIN WINDING ASSEMBLY AND STATOR CORE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02K1/12</main-classification>
        <further-classification edition="200601120241204B">H02K3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富田電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUTA ELECTRIC &amp; MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張金鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱智盟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIH-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張辰輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模組化髮夾線繞組，包含四種髮夾線以及二扁線導線，該模組化髮夾線繞組形成至少一個相繞組的相單元，該相單元僅沿著於定子鐵芯一部分圓周佈設，每一個相單元可視為一個模組化的結構，有助於簡化佈線設計，以及裝配難度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular hairpin winding assembly is provided and comprises four types of hairpin windings and two rectangular wires. The modular hairpin winding forms a phase unit of at least one phase windings, with each phase unit being arranged along only a portion circumference of a stator core. Each phase unit is designed as a modular structure, facilitating simplified wiring design and reducing assembly complexity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:相單元</p>
        <p type="p">U1、U2、U3:髮夾線</p>
        <p type="p">I1、I2:導線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="583" publication-number="202619434">
    <tif-files tif-type="multi-tif">
      <tif file="113141036.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H05K3/46</main-classification>
        <further-classification edition="200601120250102B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭凌宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, LINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板組件，包含電路板、第一電子部件、多條連接線、膠層、增層結構、多個通孔、多個導電柱及第二電子部件。電路板包含多個焊盤。第一電子部件設置於電路板上並包含多個接墊。多條連接線分別連接多個接墊及多個焊盤，以使多個接墊分別電連接多個焊盤。膠層覆蓋第一電子部件及多條連接線，增層結構覆蓋膠層。多個通孔延伸穿過增層結構及膠層以分別暴露多個接墊。多個導電柱分別設置於多個通孔中以分別電連接多個接墊。第二電子部件設置於增層結構上，且電連接多個導電柱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board assembly includes a circuit board, a first electronic component, multiple connecting wirings, a sealing layer, a build-up structure, multiple through holes, multiple conductive pillars and a second electronic component. The circuit board includes multiple solder pads. The first electronic component is disposed on the circuit board and includes multiple connecting pads. The connecting wirings are connected to the connecting pads and the soldering pads, respectively, so that the connecting pads are electrically connected to the soldering pads, respectively. The sealing layer covers the first electronic component and the connecting wirings, and the build-up structure covers the sealing layer. The through holes extend through the build-up structure and the sealing layer to expose the connecting pads, respectively. The conductive pillars are disposed in the through holes to electrically connect the connecting pads, respectively. The second electronic component is disposed on the build-up structure and is electrically connected to the conductive pillars.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電路板組件</p>
        <p type="p">100:電路板</p>
        <p type="p">102:第一焊盤</p>
        <p type="p">110:第一電子部件</p>
        <p type="p">112:接墊</p>
        <p type="p">120:連接線</p>
        <p type="p">130:膠層</p>
        <p type="p">140:增層結構</p>
        <p type="p">150:導電柱</p>
        <p type="p">160:第二電子部件</p>
        <p type="p">170:第二焊盤</p>
        <p type="p">A:區域</p>
        <p type="p">T:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="584" publication-number="202619491">
    <tif-files tif-type="multi-tif">
      <tif file="113141037.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141037</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁阻式隨機存取記憶體及其製作方法</chinese-title>
        <english-title>MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241104B">H10B61/00</main-classification>
        <further-classification edition="202301120241104B">H10N50/01</further-classification>
        <further-classification edition="202301120241104B">H10N50/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慧琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, I-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, RAI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁宸毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, CHEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許博凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種製作磁阻式隨機存取記憶體(Magnetoresistive Random Access Memory, MRAM)元件的方法，其主要先提供一基底包含MRAM區域以及邏輯區域，然後形成一第一金屬間介電層於基底上，形成一金屬氮化物層於第一金屬間介電層上，利用一第一圖案化遮罩去除邏輯區域之金屬氮化物層，利用一第二圖案化遮罩去除MRAM區域之金屬氮化物層，利用一第三圖案化遮罩去除MRAM區域以及邏輯區域之第一金屬間介電層，於MRAM區域形成第一金屬內連線以及於邏輯區域形成第二金屬內連線，再形成一磁性穿隧接面(magnetic tunneling junction, MTJ)於第一金屬內連線上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for fabricating a magnetoresistive random access memory (MRAM) device includes the steps of providing a substrate having a MRAM region and a logic region, forming a first inter-metal dielectric (IMD) layer on the substrate, forming a metal nitride layer on the first IMD layer, using a first patterned mask to remove the metal nitride layer on the logic region, using a second patterned mask to remove the metal nitride layer on the MRAM region, using a third patterned mask to remove the first IMD layer on the MRAM region and the logic region, forming a first metal interconnection on the MRAM region and a second metal interconnection on the logic region, and forming a magnetic tunneling junction (MTJ) on the first metal interconnection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基底</p>
        <p type="p">14:MRAM區域</p>
        <p type="p">16:邏輯區域</p>
        <p type="p">18:層間介電層</p>
        <p type="p">20:金屬內連線結構</p>
        <p type="p">22:金屬內連線結構</p>
        <p type="p">24:金屬間介電層</p>
        <p type="p">26:金屬內連線</p>
        <p type="p">28:停止層</p>
        <p type="p">30:金屬間介電層</p>
        <p type="p">32:金屬內連線</p>
        <p type="p">34:阻障層</p>
        <p type="p">36:金屬層</p>
        <p type="p">42:下電極</p>
        <p type="p">44:固定層</p>
        <p type="p">46:阻障層</p>
        <p type="p">48:自由層</p>
        <p type="p">50:上電極</p>
        <p type="p">52:MTJ</p>
        <p type="p">56:側壁子</p>
        <p type="p">58:金屬間介電層</p>
        <p type="p">60:阻障層</p>
        <p type="p">62:金屬層</p>
        <p type="p">64:金屬內連線</p>
        <p type="p">66:停止層</p>
        <p type="p">72:停止層</p>
        <p type="p">74:停止層</p>
        <p type="p">76:金屬間介電層</p>
        <p type="p">104:阻障層</p>
        <p type="p">106:金屬層</p>
        <p type="p">108:金屬內連線</p>
        <p type="p">110:接觸洞導體</p>
        <p type="p">112:接觸洞導體</p>
        <p type="p">114:溝渠導體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="585" publication-number="202619233">
    <tif-files tif-type="multi-tif">
      <tif file="113141039.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141039</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扁線繞組定子結構</chinese-title>
        <english-title>STATOR STRUCTURE WITH RECTANGULAR WIRE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H02K1/16</main-classification>
        <further-classification edition="200601120250203B">H02K3/04</further-classification>
        <further-classification edition="202501120250203B">H02K15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富田電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUTA ELECTRIC &amp; MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張金鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱智盟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIH-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳智正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHI-ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張辰輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扁線繞組定子結構包含定子鐵芯、扁線繞組、絕緣片。定子鐵芯包含環狀的一軛部、複數個齒部沿著該軛部的周向排列，相鄰的一對該齒部之間形成沿著一徑向延伸的一槽體，該對的該齒部的一端部具有一靴部沿著周向延伸、並形成該槽體的一槽開口。扁線繞組為線狀導體，具有一延伸段定位於該槽體。絕緣片安裝於槽體且用於包覆排列的延伸段。該槽體具有成對的一內擋塊且該內擋塊的突出方向垂直於該徑向，延伸段被限制在該內擋塊與該槽體的槽底之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stator structure for rectangular wire is provided and includes a stator core, rectangular wire windings, and insulation sheets. The stator core comprises an annular yoke portion and multiple teeth arranged circumferentially along the yoke portion. A pair of adjacent teeth is formed a slot therebetween and the slot is extending alone a radial direction. The end of each pair of tooth has a shoe portion extending circumferentially, forming a slot opening of the slot. The rectangular wire windings have a linear conductor with an extension section positioned in the slot. The insulation sheet is placed inside the slot to wrap around the extension sections. The slot has a pair of inner blocks being protruded in a direction perpendicular to the radial direction. The extension section is confined between the inner blocks and a slot bottom of the slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">121t:尖端</p>
        <p type="p">13:平坦部分</p>
        <p type="p">14t:尖端</p>
        <p type="p">14p1:第一點</p>
        <p type="p">14p2:第二點</p>
        <p type="p">14s1,14s2:斜面</p>
        <p type="p">151:槽開口</p>
        <p type="p">51p3:第三點</p>
        <p type="p">G1:開口寬度</p>
        <p type="p">G2:間隔距離</p>
        <p type="p">L3,L4:長度</p>
        <p type="p">It:絕緣紙厚度</p>
        <p type="p">Sw:槽寬度</p>
        <p type="p">Bd:凸出距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="586" publication-number="202618142">
    <tif-files tif-type="multi-tif">
      <tif file="113141041.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>掛鉤組合件及包含所述掛鉤組合件的掛物裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">F16B45/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昌辰鑫生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRANSIN BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林傑茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEH-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃芓瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳易哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI-JHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種掛鉤組合件，其包含：第一組合元件、第二組合元件、第一掛物元件和第二掛物元件。第一組合元件具有第一頭端凸出部和第一尾端連接部，第一頭端凸出部具有第一前半卡槽，並且第一尾端連接部具有第一後半卡槽。第二組合元件具有第二頭端凸出部和第二尾端連接部，第二頭端凸出部具有第二前半卡槽，並且第二尾端連接部具有第二後半卡槽。第一掛物元件具有第一掛合部，第一掛合部可拆卸地連接於第一組合元件的第一前半卡槽和第二組合元件的第二後半卡槽。第二掛物元件具有第二掛合部，第二掛合部可拆卸地連接於第二組合元件的第二前半卡槽和第一組合元件的第一後半卡槽。藉此，前述之掛鉤組合件能夠被用於可拆卸地連接於各種裝置，以使所連接的裝置具備掛物功能，並且能夠解決使用者在操作過程中容易被夾傷及掛物穩定性不佳的問題。此外，包含前述之掛鉤組合件的掛物裝置亦被提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">400:掛鉤組合件</p>
        <p type="p">410:第一組合元件</p>
        <p type="p">420:第二組合元件</p>
        <p type="p">430:第一掛物元件</p>
        <p type="p">440:第二掛物元件</p>
        <p type="p">450:附加掛物元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="587" publication-number="202617501">
    <tif-files tif-type="multi-tif">
      <tif file="113141042.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車立管結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">B62K21/12</main-classification>
        <further-classification edition="200601120241130B">B62K21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昌慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昌慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡昇寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是提供一種自行車立管結構，主要係藉由各該控制線能隱藏在該立管組件內部，使該車把手透過該車頭組件、龍頭豎桿及該立管組件相對車架的前叉立管軸轉時，因控制線皆隱藏在立管組件及該龍頭豎桿內部，故能使車把手的轉向角度增加；及藉由該立管組件、該龍頭豎桿及該車頭組件可為鋁合金材質或複合式碳纖維材質製成，以使該立管組件、該龍頭豎桿及該車頭組件呈輕量化，以達到車把手在轉動方向控制時可大幅提高其車頭控制方向的靈巧性者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:車把手</p>
        <p type="p">B:車架</p>
        <p type="p">C:控制線</p>
        <p type="p">D:前叉立管</p>
        <p type="p">10:立管組件</p>
        <p type="p">11:樞組件</p>
        <p type="p">12:組合端</p>
        <p type="p">13:樞軸</p>
        <p type="p">14:軸組件</p>
        <p type="p">15:第一引孔</p>
        <p type="p">16:線路槽</p>
        <p type="p">17:出線端</p>
        <p type="p">18:第三引孔</p>
        <p type="p">20:龍頭豎桿</p>
        <p type="p">21:藏線槽</p>
        <p type="p">30:車頭組件</p>
        <p type="p">31:固定端</p>
        <p type="p">32:樞轉軸</p>
        <p type="p">33:活動扣具</p>
        <p type="p">34:活動組部</p>
        <p type="p">35:固定組部</p>
        <p type="p">36:組合件</p>
        <p type="p">37:內環空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="588" publication-number="202618419">
    <tif-files tif-type="multi-tif">
      <tif file="113141045.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">G02F1/1333</main-classification>
        <further-classification edition="200601120241128B">G02F1/13357</further-classification>
        <further-classification edition="200601120241128B">G02F1/1343</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴鍇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括背光模組、顯示面板及控光面板。顯示面板設置於背光模組上。控光面板包括第一基底、第二基底、液晶層、第一透明電極、第二透明電極、框形遮光圖案、框膠及框形透明支撐物。第一透明電極及第二透明電極於結構上彼此分離且設置於第一基底上。框形遮光圖案設置於第二基底之面向第一基底的表面上。框膠設置於框形遮光圖案與第一基底之間且圍繞液晶層。框形遮光圖案與框膠在垂直方向上至少部分地重疊。框形透明支撐物設置於框形遮光圖案與框膠之間。框形透明支撐物覆蓋框形遮光圖案之朝向液晶層的內側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a backlight module, a display panel and a light control panel. The display panel is disposed on the backlight module. The light control panel includes a first base, a second base, a liquid crystal layer, a first transparent electrode, a second transparent electrode, a frame-shaped light shielding pattern, a sealant and a frame-shaped transparent supporter. The first transparent electrode and the second transparent electrode are structurally separated from each other and disposed on the first base. The frame-shaped light-shielding pattern is disposed on a surface of the second base facing the first base. The sealant is disposed between the frame-shaped light-shielding pattern and the first base and surrounds the liquid crystal layer. The frame-shaped light-shielding pattern and the sealant at least partially overlap in a vertical direction. The frame-shaped transparent supporter is disposed between the frame-shaped light-shielding pattern and the sealant. The frame-shaped transparent supporter covers an inner side wall of the frame-shaped light-shielding pattern facing the liquid crystal layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控光面板</p>
        <p type="p">10a:工作區</p>
        <p type="p">10b:周邊區</p>
        <p type="p">100:第一基板</p>
        <p type="p">112:第一基底</p>
        <p type="p">114:導線</p>
        <p type="p">116:絕緣層</p>
        <p type="p">118a:第一透明電極</p>
        <p type="p">118b:第二透明電極</p>
        <p type="p">200:第二基板</p>
        <p type="p">212:第二基底</p>
        <p type="p">212a:表面</p>
        <p type="p">214:框形遮光圖案</p>
        <p type="p">214s1:內側壁</p>
        <p type="p">214s2:外側壁</p>
        <p type="p">214t:表面</p>
        <p type="p">216a:主要透明支撐物</p>
        <p type="p">216b:輔助透明支撐物</p>
        <p type="p">216c:框形透明支撐物</p>
        <p type="p">300:液晶層</p>
        <p type="p">400:框膠</p>
        <p type="p">T216a、T216b、T216c、T400:厚度</p>
        <p type="p">z:垂直方向</p>
        <p type="p">W400:膠寬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="589" publication-number="202618158">
    <tif-files tif-type="multi-tif">
      <tif file="113141047.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體流量控制開關</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F16K31/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋云惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳谷舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋云惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳谷舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明液體流量控制開關，其包括：一容器，其頂部具有一第一透孔及一鄰近該第一透孔的第二透孔，該第一透孔周緣環設有一第一結合部，該容器內具有一與該第一結合部及該第二透孔連通的容置空間，該容置空間提供裝設一液體；以及一蓋體，其包括有一底座及一按壓蓋，該底座與該第一結合部結合，該底座具有一與該第二透孔對應的排液管，該按壓蓋的底面設有一進入該第一結合部內的柱體，該柱體與該第一透孔之間具有一第一預定距離，該按壓蓋與該底座彈性結合，該按壓蓋受該底座彈性推擠，使該按壓蓋與該底座之間具有一按壓行程距離，藉由按壓該按壓蓋，使空氣由該按壓蓋與該底座之間進入該按壓蓋內，同時該柱體於該第一結合部內朝該容置空間的方向移動，該空氣經過該第一透孔進入該容置空間，以令該液體及該空氣經由該第二透孔及該排液管排出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:容器</p>
        <p type="p">12:第二透孔</p>
        <p type="p">13:第一結合部</p>
        <p type="p">131:外螺紋</p>
        <p type="p">15:定位件</p>
        <p type="p">16:閥門片</p>
        <p type="p">161:安裝孔</p>
        <p type="p">17:限位件</p>
        <p type="p">20:蓋體</p>
        <p type="p">21:底座</p>
        <p type="p">211:第一結合孔</p>
        <p type="p">213:止擋部</p>
        <p type="p">214:環型槽</p>
        <p type="p">215:外壁</p>
        <p type="p">216:限位槽</p>
        <p type="p">217:扣件</p>
        <p type="p">22:按壓蓋</p>
        <p type="p">223:凹陷部</p>
        <p type="p">23:O型環</p>
        <p type="p">24:彈性元件</p>
        <p type="p">A:排液管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="590" publication-number="202618311">
    <tif-files tif-type="multi-tif">
      <tif file="113141050.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以測試鍵盤之測試裝置</chinese-title>
        <english-title>TESTING APPARATUS FOR TESTING KEYBOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250203B">G01R31/01</main-classification>
        <further-classification edition="200601120250203B">G06F3/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡才榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TSAI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江正偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測試裝置用以測試鍵盤，且包含致動器、限制構件、配重元件、控制器、第一導線以及一第二導線。限制構件係可致動地連接至致動器。配重元件具有預定重量。配重元件的主體係置於限制構件的容納空間內且以主體的底部置於限制構件的底部上。配重元件的延伸桿自主體的底部向下延伸且穿過限制構件的底部上的貫孔。控制器控制致動器致動限制構件以及配重元件至位於鍵盤之一個按鍵上方的預定位置。控制器進而控制致動器致動限制構件以及配重元件向下移動直至第一導線的第一端點、第二導線的第二端點接觸主體的頂部形成電路短路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A testing apparatus, for testing a keyboard, includes an actuator, a restraining member, a counterweight device, a controller, a first conductive wire, and a second conductive wire. The restraining member is actuatably connected to the actuator. The counterweight device has a predetermined weight. A main body of the counterweight device is placed within an accommodating space, and the bottom of the main body is placed on the bottom of the restraining member. An extension bar of the counterweight device extends downward from the bottom of the main body and passes through a through-hole formed on the bottom of the restraining member. The controller controls the actuator to actuate the restraining member and the counterweight device to move to a predetermined position above a keyswitch of the keyboard. The controller further controls the actuator to actuate the restraining member and the counterweight device to move downward until the first end of the first conductive wire and the second end of the second conductive wire contact the top of the main body to form a short circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:測試裝置</p>
        <p type="p">10:致動器</p>
        <p type="p">102:致動軸</p>
        <p type="p">1020:第二末端</p>
        <p type="p">11:限制構件</p>
        <p type="p">110:第一頂部</p>
        <p type="p">112:第一底部</p>
        <p type="p">114:容納空間</p>
        <p type="p">116:貫孔</p>
        <p type="p">12:配重元件</p>
        <p type="p">120:主體</p>
        <p type="p">1200:第二頂部</p>
        <p type="p">1202:第二底部</p>
        <p type="p">122:延伸桿</p>
        <p type="p">1220:第一末端</p>
        <p type="p">13:控制器</p>
        <p type="p">14:第一導線</p>
        <p type="p">140:第一端點</p>
        <p type="p">15:第二導線</p>
        <p type="p">150:第二端點</p>
        <p type="p">2:按鍵</p>
        <p type="p">20:鍵帽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="591" publication-number="202618834">
    <tif-files tif-type="multi-tif">
      <tif file="113141051.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141051</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對鍵盤蓋均勻地供應潤滑油之裝置</chinese-title>
        <english-title>APPARATUS FOR UNIFORMLY SUPPLYING LUBRICANT FOR KEYBOARD COVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H01H13/705</main-classification>
        <further-classification edition="200601120241204B">G06F1/16</further-classification>
        <further-classification edition="200601120241204B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡才榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TSAI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江正偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董佳翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, CHIA-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種針對鍵盤蓋均勻地供應潤滑油之裝置，包含可壓縮腔室、連通該可壓縮腔室的底部之複數個出油管路、控油閥、連通控油閥之主管路、連通主管路之M個一級子管路、        &lt;img align="absmiddle" height="26px" width="46px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;個二級子管路、        &lt;img align="absmiddle" height="22px" width="76px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;個三級子管路以及        &lt;img align="absmiddle" height="35px" width="104px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;個歧管路，其中M、I、K以及N皆係大於1的整數。每一個一級子管路對應I個二級子管路且連通其對應的二級子管路。每一個二級子管路對應K個三級子管路且連通其對應的三級子管路。每一個三級子管路對應N個歧管路且連通其對應的歧管路。每一個歧管路以各自的入油口連通可壓縮腔室的頂部。每一個入油口至主管路的末端之各自的距離皆等距。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus, for uniformly supplying a lubrication for a keyboard cover, includes a compressible chamber, a plurality of outlet pipes communicating with a bottom of the compressible chamber, a control valve, a main pipe communicating with the control valve, M primary sub-pipes communicating with the main pipe,         &lt;img align="absmiddle" height="26px" width="46px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; secondary sub-pipes,         &lt;img align="absmiddle" height="22px" width="76px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;tertiary sub-pipes, and         &lt;img align="absmiddle" height="35px" width="104px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; manifolds, where M, I, K and N are integers greater than 1. Each primary sub-pipe corresponds to I secondary sub-pipes, and communicates with the corresponding secondary sub-pipes. Each secondary sub-pipe corresponds to K tertiary sub-pipes, and communicates with the corresponding tertiary sub-pipes. Each tertiary sub-pipe corresponds to N manifolds, and communicates with the corresponding manifolds. Each manifold with a respective inlet port communicates with a top of the compressible chamber. Each inlet port is equidistant from a distal end of the main pipe.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:裝置</p>
        <p type="p">30:可壓縮腔室</p>
        <p type="p">302:頂部</p>
        <p type="p">304:底部</p>
        <p type="p">31:出油管路</p>
        <p type="p">32:控油閥</p>
        <p type="p">33:主管路</p>
        <p type="p">332:第一末端</p>
        <p type="p">34:一級子管路</p>
        <p type="p">342:第二末端</p>
        <p type="p">35:二級子管路</p>
        <p type="p">352:第三末端</p>
        <p type="p">36:三級子管路</p>
        <p type="p">362:第四末端</p>
        <p type="p">37:歧管路</p>
        <p type="p">372:入油口</p>
        <p type="p">38:供油管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="592" publication-number="202618235">
    <tif-files tif-type="multi-tif">
      <tif file="113141052.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以測試觸控板的震動功能之測試裝置</chinese-title>
        <english-title>TESTING APPARATUS FOR TESTING VIBRATION OF TOUCH PAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01M7/02</main-classification>
        <further-classification edition="200601120241231B">G01M7/08</further-classification>
        <further-classification edition="200601120241231B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董佳翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, CHIA-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張信齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測試裝置用以測試觸控板之震動功能，包含活動托架、配重承載座、負荷感測元件、固定架、加速度感測元件以及導電彈性體。配重承載座係可上下滑動地固定於活動托架上。至少一配重元件係置於承載座內。負荷感測元件係固定於配重承載座之底部上。固定架係固定於負荷感測元件之末端上。加速度感測元件係固定於固定架上。導電彈性體係接合於加速度感測元件之下表面上。活動托架移動至相對觸控板之測試位置之上且進一步向下移動使測試裝置以導電彈性體敲擊觸控板。負荷感測元件用以感測碰觸負荷。加速度感測元件用以感測震動訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A testing apparatus, for testing a vibration of a touch pad, includes a movable bracket, a counterweight carrier, a load sensing device, a mounting shelf, an acceleration sensing device, and a conductive elastomer. The counterweight carrier is fixed to the movable bracket by sliding upwardly and downwardly. At least one counterweight device is placed in the carrier. The load sensing device is fixed on the bottom of the counterweight carrier. The mounting shelf is fixed on the end of the load sensing device. The acceleration sensing device is fixed on the mounting shelf. The conductive elastomer is bonded to the slower surface of the acceleration sensing device. The movable bracket is moved to above a test position relative to the touch pad, and further downward so that the testing apparatus strikes the touch pad with the conductive elastomer. The load sensing device is used to sense the contact load. The acceleration sensing device is used to sense the vibration signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:測試裝置</p>
        <p type="p">10:活動托架</p>
        <p type="p">102:線性滑軌</p>
        <p type="p">11:配重承載座</p>
        <p type="p">112:底部</p>
        <p type="p">12:負荷感測元件</p>
        <p type="p">122:末端</p>
        <p type="p">13:固定架</p>
        <p type="p">14:加速度感測元件</p>
        <p type="p">15:導電彈性體</p>
        <p type="p">19:配重元件</p>
        <p type="p">2:觸控板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="593" publication-number="202618534">
    <tif-files tif-type="multi-tif">
      <tif file="113141054.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分割視窗顯示方法及其電子裝置</chinese-title>
        <english-title>MULTI-WINDOW DISPLAYING METHOD AND ELECTRONIC DEVICE THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">G06F3/0481</main-classification>
        <further-classification edition="202201120250203B">G06F3/0488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張涵柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAN-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卜馨儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, HSIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王喻柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-ROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種分割視窗顯示方法，適用於一電子裝置。首先，設定一分割視窗圖示於一設定視窗，此分割視窗圖示至少對應於一第一應用程式以及一第二應用程式。隨後，因應對應於分割視窗圖示之一第一操作，產生一分割視窗介面。分割視窗介面包含一第一視窗、一第二視窗以及一分隔區，第一應用程式執行於第一視窗，第二應用程式執行於第二視窗，分隔區位於第一視窗與第二視窗之間。隨後，因應對應於第二視窗之邊框區域之一第二操作，產生一浮動視窗介面。浮動視窗介面包含一主視窗以及一浮動視窗。本案並提供執行此分割視窗顯示方法之電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-window displaying method for an electronic device is provided. Firstly, a multi-window icon is set in a setting window, wherein the multi-window icon corresponds to at least a first application and a second application. Then, in responsive to a first operation for the multi-window icon, a multi-window interface is generated which comprises a first window, a second window, and a separation region, wherein the first application is executed through the first window and the second application is executed through the second window. Then, in responsive to a second operation corresponded to a frame area of the second window, a floating window interface is generated which comprises a main window and a floating window. An electronic device for executing the multi-window displaying method is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S120,S140,S160,S180,S190:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="594" publication-number="202619061">
    <tif-files tif-type="multi-tif">
      <tif file="113141056.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆疊結構</chinese-title>
        <english-title>STACK STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250314B">H01L23/28</main-classification>
        <further-classification edition="200601120250314B">H01L23/48</further-classification>
        <further-classification edition="202301120250314B">H10B10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACECORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸彥麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">堆疊結構包括基板、第一記憶體層、邏輯晶片以及共封裝光學元件。第一記憶體層設置於基板之上。邏輯晶片設置於第一記憶體層上，並與第一記憶體層電性連接。共封裝光學元件設置於第一記憶體層上，並與第一記憶體層電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stack structure includes a substrate, a first memory layer, a logic die, and a co-packaged optics. The first memory layer is disposed over the substrate. The logic die is disposed on and electrically connected to the first memory layer. The co-packaged optics is disposed on and electrically connected to the first memory layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:堆疊結構</p>
        <p type="p">100:基板</p>
        <p type="p">110:第一記憶體層</p>
        <p type="p">110a:第一記憶體晶片/記憶體晶片</p>
        <p type="p">112:半導體基底</p>
        <p type="p">114,144:穿基底通孔</p>
        <p type="p">120:共封裝光學元件</p>
        <p type="p">130:邏輯晶片</p>
        <p type="p">140:中介層</p>
        <p type="p">142:基底</p>
        <p type="p">150,152,154,156:導電連接件</p>
        <p type="p">x,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="595" publication-number="202619186">
    <tif-files tif-type="multi-tif">
      <tif file="113141058.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141058</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H01R13/621</main-classification>
        <further-classification edition="200601120250107B">H01R13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何宜澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, YI-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接裝置，包含一匯流排組件、多個第一連接器、一導電板，及多個第二連接器。該匯流排組件包括相互絕緣的一第一匯流排、一第二匯流排。該等第一連接器分別設置於該第一匯流排的一第一安裝面與該第二匯流排一第二安裝面而位在不同高度。每一該第一連接器具有一第一防旋轉結構。該等第二連接器用於設置於該導電板，並且與該等第一連接器沿該對接方向可浮動地對接。每一第二連接器具有一第二防旋轉結構。該等第二連接器的第二防旋轉結構分別用於與該等第一連接器的第一防旋轉結構配合，限制彼此相對轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:匯流排組件</p>
        <p type="p">11:第一匯流排</p>
        <p type="p">111:第一安裝面</p>
        <p type="p">12:第二匯流排</p>
        <p type="p">121:第二安裝面</p>
        <p type="p">13:絕緣層</p>
        <p type="p">14:電源電極</p>
        <p type="p">2:第一連接器</p>
        <p type="p">3:第二連接器</p>
        <p type="p">4:導電板</p>
        <p type="p">41:板體</p>
        <p type="p">411:安裝面</p>
        <p type="p">42:插座</p>
        <p type="p">5:螺栓</p>
        <p type="p">A:排列方向</p>
        <p type="p">D:對接方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="596" publication-number="202617104">
    <tif-files tif-type="multi-tif">
      <tif file="113141059.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手術資訊偵測方法及其設備</chinese-title>
        <english-title>DETECTION METHOD AND APPARATUS FOR SURGERY INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241231B">A61B50/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳憲儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昀宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG,YUN CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃炳峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種手術資訊偵測設備，用於執行一手術資訊偵測方法，並包含一感測晶片，及一穿戴讀取裝置。穿戴讀取裝置讀取環境雜訊和感測晶片以分別產生一環境感測訊號和一張力感測訊號，並將張力感測訊號減去環境感測訊號後產生數個張力差值。穿戴讀取裝置選取張力差值中數值最大者所對應的掃描頻率為一共振頻率，並藉由共振頻率推算出一縫線張力值，藉由改善讀取裝置對於環境雜訊高度敏感的問題，使讀取裝置所偵測的數值的可信度大幅增加。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surgical information detection device is utilized for executing a surgical information detection method, and includes a sensor chip and a wearable readout device. The wearable readout device detects environment noise and the sensor chip to generate an environment sensing signal and a tension sensing signal, respectively, and subtracts the environment sensing signal from the tension sensing signal to generate tension differences. The wearable readout device selects the scanning frequency corresponding to the largest one of the tension differences as a resonant frequency, and a suture tension value is derived by the resonant frequency. By improving the issue that the readout device is highly sensitive to environmental noise, the reliability of the value detected by the wearable readout device is greatly increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:手術資訊偵測設備</p>
        <p type="p">5:感測晶片</p>
        <p type="p">1:穿戴讀取裝置</p>
        <p type="p">2:控制模組</p>
        <p type="p">21:處理單元</p>
        <p type="p">22:訊號校正單元</p>
        <p type="p">3:讀取模組</p>
        <p type="p">31:訊號發射單元</p>
        <p type="p">32:感測單元</p>
        <p type="p">33:訊號比對單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="597" publication-number="202618617">
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          <doc-number>202618617</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧問答系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06N5/04</main-classification>
        <further-classification edition="202301120250203B">G06N5/02</further-classification>
        <further-classification edition="201901120250203B">G06N20/00</further-classification>
        <further-classification edition="202001120250203B">G06F40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新光人壽保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖晨旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱昌傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳惠君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雅帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖珮如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇昱覡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施廷緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張海山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧問答系統包含一應用程式介面伺服器，及與該應用程式介面伺服器電連接的一通訊伺服器和一人工智慧伺服器。該人工智慧伺服器將一問題文本輸入一文本向量化模型以獲得一數字文本。該應用程式介面伺服器根據該數字文本其中包含的一向量化的關鍵字對一條款文本知識庫進行搜尋以獲得一近似條款文本。該人工智慧伺服器將一包含該問題文本、該近似條款文本和與該近似條款文本對應的一提示詞的問答文本輸入該近似條款文本所指示的一第一模型或一第二模型以生成一回答訊息，並經由該應用程式介面伺服器將該回答訊息傳送至該通訊伺服器的一問答介面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S28:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="598" publication-number="202617969">
    <tif-files tif-type="multi-tif">
      <tif file="113141063.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有固碳能力的細菌</chinese-title>
        <english-title>BACTERIUM ABLE TO FIX CARBON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C12N1/20</main-classification>
        <further-classification edition="202001120250501B">A01N63/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE &amp; TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳羽婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂姿霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, ZI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有固碳能力的細菌，用以將空氣及/或土壤中的二氧化碳轉化為有機化合物，以提升土壤碳匯。該細菌為        &lt;i&gt;Rhodopseudomonas rhenobacensis&lt;/i&gt;，且寄存於中華民國食品工業發展研究所，其寄存編號為BCRC 911224；或者，該細菌為        &lt;i&gt;Rhodopseudomonas oryzae&lt;/i&gt;，且寄存於中華民國食品工業發展研究所，其寄存編號為BCRC 911225。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bacterium able to fix carbon is used to convert carbon dioxide (CO        &lt;sub&gt;2&lt;/sub&gt;) in air and/or soil to organic compounds, further improving the carbon sequestration in soils. The bacterium is        &lt;i&gt;Rhodopseudomonas rhenobacensis&lt;/i&gt;which is deposited at Bioresource Collection and Research Center of Taiwan with a deposit number BCRC 911224. Alternatively, the bacterium is        &lt;i&gt;Rhodopseudomonas oryzae&lt;/i&gt;which is deposited at Bioresource Collection and Research Center of Taiwan with a deposit number BCRC 911225.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="599" publication-number="202617194">
    <tif-files tif-type="multi-tif">
      <tif file="113141070.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工骨材及其製備方法</chinese-title>
        <english-title>ARTIFICAIL BONE AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250605B">A61L27/22</main-classification>
        <further-classification edition="200601120250605B">A61L27/32</further-classification>
        <further-classification edition="200601120250605B">A61L27/54</further-classification>
        <further-classification edition="201201120250605B">D04H1/728</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫瑞昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JUI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宜潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉滿海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MAN-HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方志翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種人工骨材由骨材材料組成，骨材材料包含天然高分子、無機鹽及葛根，其中天然高分子選自明膠、膠原蛋白、玻尿酸、海藻酸鹽、殼聚醣及其衍生物之至少其中一種；無機鹽選自羥基磷灰石(HAp)、磷酸三鈣(TCP)、磷酸二鈣(DCP)、二水磷酸二鈣(DCPD)、磷酸四鈣(TTCP)及其衍生物之至少其中一種。本發明也提供了人工骨材的製備方法，包含將天然高分子、無機鹽及葛根混合均勻，並透過靜電紡絲製程及乾燥，形成人工骨材。人工骨材具有促進幹細胞分化和骨再生的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An artificial bone is composed of an artificial bone material. The artificial bone material includes natural polymer, inorganic salt and Pueraria lobata. The natural polymer is selected from at least one of gelatin, collagen, hyaluronic acid, alginate, chitosan and their derivatives. The inorganic salt is selected from at least one of hydroxyapatite (HAp), tricalcium phosphate (TCP), dicalcium phosphate (DCP), dicalcium phosphate dihydrate (DCPD), tetracalcium phosphate (TTCP) and their derivatives. The present invention also provides a method for preparing artificial bone, including that mixing natural polymer, inorganic salt and Pueraria lobata evenly, and performing an electrospinning process and drying to form artificial bone. Artificial bone has the function of promoting stem cell differentiation and bone regeneration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:配置骨材溶液步驟</p>
        <p type="p">S12:靜電紡絲步驟</p>
        <p type="p">S14:乾燥步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="600" publication-number="202618086">
    <tif-files tif-type="multi-tif">
      <tif file="113141071.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有垂直特性的柔性電絕緣織物</chinese-title>
        <english-title>FLEXIBLE ELECTRICALLY INSULATING FABRIC WITH VERTICAL CHARACTERISTICS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241204B">D03D15/50</main-classification>
        <further-classification edition="202101120241204B">D03D15/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲強毅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG QIANG YI TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高自強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, TZU CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高郁勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YU SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種具有垂直特性的柔性電絕緣織物，其主要係令織物包括一堅硬、液體無法穿透［liquid-impermeable］之硬表面層，以及一具有垂直突起部及垂直凹陷部特徵之一多孔泡棉主體層及一多孔纖維主體層，使得透過垂直突起部及垂直凹陷部特徵，於織物表面橫向形成一較長電氣路徑；藉此，以降低織物表面電導［electrical conductance］，相較於織物表面長度，藉由創造立體高度垂直突起特徵［vertically raised features］和深度垂直凹陷特徵［depressed features］，以增加電流路徑長度，同時降低經由表面傳導路徑［conduction paths］所造成觸電致死之風險，而在其整體施行使用上更增實用功效特性者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a flexible electrically insulating fabric with vertical characteristics, which mainly makes the fabric include a hard surface layer that is hard and liquid-impermeable, and a porous foam main body layer and a porous fiber main body layer having vertical protrusion and vertical depression features, so that a longer electrical path is formed horizontally on the surface of the fabric by the vertical protrusion and vertical depression features; thereby, in order to reduce the electrical conductance on the surface of the fabric, compared to the length of the surface of the fabric, by creating three-dimensional height vertically raised features and depth vertical depressed features to increase the length of the electrical current path, and at the same time, reduce the risk of electrocution caused by the surface conduction paths, and in the overall implementation of the use of the characteristics of the more practical efficacy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:織物</p>
        <p type="p">11:硬表面層</p>
        <p type="p">12:垂直突起部</p>
        <p type="p">13:垂直凹陷部</p>
        <p type="p">14:多孔泡棉主體層</p>
        <p type="p">15:多孔纖維主體層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="601" publication-number="202618629">
    <tif-files tif-type="multi-tif">
      <tif file="113141077.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>企業永續行為評估方法及運算裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q10/06</main-classification>
        <further-classification edition="202301120250203B">G06Q10/10</further-classification>
        <further-classification edition="202301120250203B">G06Q10/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台新新光金融控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TS FINANCIAL HOLDING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維熊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳帝佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣明哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周仕鎧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林沂臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐陽昱弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宣溶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種企業永續行為評估方法，經由一運算裝置來實施，該運算裝置經由一通訊網路連接一伺服端，該伺服端有一大型語言模型。對於至少一第一議題因子之每一者，該運算裝置傳送第一議題因子及一待分析內容的分析請求至該伺服端，以使該伺服端利用該大型語言模型得到至少一與該議題因子相關的議題指數。該運算裝置傳送一第二議題因子及多個待分析新聞的新聞分析請求至該伺服端，以使該伺服端利用該大型語言模型得到一與該第二議題因子相關的新聞指數。該運算裝置根據待分析企業的企業永續指數、至少一議題指數及新聞指數獲得永續綜合評分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1~9:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="602" publication-number="202618095">
    <tif-files tif-type="multi-tif">
      <tif file="113141078.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>覆工板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">E01C9/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUN-KUAN, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種覆工板，包含一花紋型鋼結構及數個預力鋼絞線。該花紋型鋼結構包括數個左右並排的花紋型鋼。每一該花紋型鋼前後長向延伸，並具有兩個上下間隔的花紋型鋼翼板，及一上下延伸連接於該等花紋型鋼翼板間的花紋型鋼腹板。該等預力鋼絞線左右延伸穿設於該等花紋型鋼腹板，以將該等花紋型鋼定位在一起，使該等花紋型鋼相配合構成該花紋型鋼結構。本發明藉由該等預力鋼絞線來將該等花紋型鋼定位在一起，使該等花紋型鋼相配合構成該花紋型鋼結構以構成該覆工板，可省去將該等花紋型鋼焊接在一起的作業，故本發明覆工板具有生產成本較低的特點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:花紋型鋼結構</p>
        <p type="p">11:花紋型鋼</p>
        <p type="p">110:通孔</p>
        <p type="p">111:花紋型鋼翼板</p>
        <p type="p">112:花紋型鋼腹板</p>
        <p type="p">113:側邊</p>
        <p type="p">114:外表面</p>
        <p type="p">2:預力鋼絞線</p>
        <p type="p">21:預力鋼絞線主體</p>
        <p type="p">211:端部</p>
        <p type="p">22:錨定單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="603" publication-number="202617300">
    <tif-files tif-type="multi-tif">
      <tif file="113141079.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合式鍛造裝置及應用其之金屬積層設備</chinese-title>
        <english-title>COMPOUND FORGING DEVICE AND METAL LAMINATION EQUIPMENT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">B21J13/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勝傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SU-JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭欽奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">複合式鍛造裝置包括連接件、加熱模組及鍛造模組。加熱模組連接於連接件且包括加熱器。鍛造模組連接於連接件且包括鍛造器。加熱器與鍛造器相對配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite forging device includes a connecting element, a heating module and a forging module. The heating module is connected to the connector and includes a heater. The forging module is connected to the connector and includes a forger. The heater and the forger are disposed opposite each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10’:金屬積層設備</p>
        <p type="p">100’:複合式鍛造裝置</p>
        <p type="p">105’:連接件</p>
        <p type="p">110’:加熱模組</p>
        <p type="p">111’:加熱器</p>
        <p type="p">120’:鍛造模組</p>
        <p type="p">121’:鍛造器</p>
        <p type="p">200’:驅動裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="604" publication-number="202619447">
    <tif-files tif-type="multi-tif">
      <tif file="113141080.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141080</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>托盤組件</chinese-title>
        <english-title>TRAY ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H05K7/12</main-classification>
        <further-classification edition="200601120241231B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俞帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種托盤組件包含一托盤、一硬碟背板與至少一卡扣件。托盤設有至少一限位結構與至少一卡扣結構。硬碟背板用以在組裝於托盤時與托盤共同圍構出用以容置至少一硬碟之一至少一硬碟容置空間。卡扣件包含一固定部與一卡扣部。固定部對應於卡扣結構而固接於硬碟背板。卡扣部可撓性連結於固定部，並且在一卡扣位置與一解扣位置之間移動。當卡扣部位於卡扣位置時，卡扣於卡扣結構，藉以與限位結構共同對硬碟背板加以限位固定。當卡扣部位於解扣位置時，解除卡扣於卡扣結構，藉以允許將硬碟背板自托盤拆除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tray assembly includes a tray, a hard drive backplane, and at least one latch component. The tray has at least one limiting structure and at least one latching structure. When assembled on the tray, the hard drive backplane, together with the tray, forms at least one hard drive accommodation space for housing at least one hard drive. The latch component includes a fixed part and a latching part. The fixed part corresponds to the latching structure and is firmly attached to the hard drive backplane. The latching part is flexibly connected to the fixed part and moves between a latched position and an unlatched position. When the latching part is in the latched position, it engages with the latching structure, thereby working with the limiting structure to secure and position the hard drive backplane. When the latching part is in the unlatched position, it disengages from the latching structure, thus allowing the hard drive backplane to be removed from the tray.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:硬碟背板</p>
        <p type="p">21:限位孔</p>
        <p type="p">22:限位凹口</p>
        <p type="p">23:電連接器</p>
        <p type="p">24:定位孔</p>
        <p type="p">3a:卡扣件</p>
        <p type="p">31a:固定部</p>
        <p type="p">311a:定位柱</p>
        <p type="p">32a:卡扣部</p>
        <p type="p">321a:卡扣凸台</p>
        <p type="p">33a:按壓部</p>
        <p type="p">GS:導引斜面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="605" publication-number="202619450">
    <tif-files tif-type="multi-tif">
      <tif file="113141081.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙面組裝式硬碟支架</chinese-title>
        <english-title>DUAL-SIDE HARD DRIVE CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H05K7/14</main-classification>
        <further-classification edition="200601120250203B">H05K7/12</further-classification>
        <further-classification edition="200601120250203B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俞帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙面組裝式硬碟支架，用以組裝固定一第一硬碟與一第二硬碟，並且包含一承載板、二第一側支架、複數個第一限位結構、二第二側支架、複數個第二限位結構與一卡扣件。第一側支架彼此相對且可撓性連結於承載板。第一限位結構設於第一側支架，用以在第一側支架撓性彎曲以供第一硬碟組裝後，藉由伴隨第一側支架撓性恢復以對第一硬碟加以限位固定。第二側支架彼此相對且連結於承載板。第二限位結構分別設於第二側支架或承載板。卡扣件可撓性連結於承載板，用以在第二硬碟組裝後，卡扣於第二硬碟，藉以與第二板體以及第二限位結構共同對第二硬碟加以限位固定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Dual-Sided hard drive carrier, used to assemble and secure a first hard drive and a second hard drive, includes a carrier plate, two first side brackets, multiple first limiting structures, two second side brackets, multiple second limiting structures, and a latching component. The first side brackets are positioned opposite each other and are flexibly connected to the carrier plate. The first limiting structures are set on the first side brackets, used to limit and secure the first hard drive by flexibly recovering along with the first side brackets after the first side brackets are flexibly bent to allow assembly of the first hard drive. The second side brackets are positioned opposite each other and connected to the carrier plate. The second limiting structures are set on either the second side brackets or the carrier plate. The latching component is flexibly connected to the carrier plate, used to latch onto the second hard drive after it is assembled, thereby working together with the second plate body and the second limiting structures to limit and secure the second hard drive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雙面組裝式硬碟支架</p>
        <p type="p">200:第一硬碟</p>
        <p type="p">300:第二硬碟</p>
        <p type="p">1:承載板</p>
        <p type="p">11:第一組裝面</p>
        <p type="p">2a,2b:第一側支架</p>
        <p type="p">HH:掛孔</p>
        <p type="p">3a~3c:第一限位壁</p>
        <p type="p">7:導電泡棉</p>
        <p type="p">8a,8b:橡膠墊</p>
        <p type="p">9:束線結構</p>
        <p type="p">AS1:第一組裝空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="606" publication-number="202618513">
    <tif-files tif-type="multi-tif">
      <tif file="113141082.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有防竄風設計之伺服器及其伺服器層間隔板</chinese-title>
        <english-title>SERVER WITH AN ANTI-WIND CHANNELING DESIGN AND INTER-LAYER SERVER PARTITION PLATE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G06F1/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鮮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俞帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有防竄風設計之伺服器，包含一伺服器機殼以及一伺服器層間隔板。伺服器機殼包含一底板、二側板及一分隔層。二側板係連結於底板之兩側。分隔層係固接於二側板而圍構出一第一層空間與一第二層空間，且分隔層開設有一層間通道。伺服器層間隔板包含一隔板本體以及至少一毛刷件。隔板本體包含一遮擋部、二組接部以及一滑軌部。遮擋部開設有至少一連通口。二組接部係分別連結於遮擋部之二端邊，用以組接於二側板，使遮擋部遮蔽住層間通道。滑軌部係連結於遮擋部之一側邊。毛刷件是可移動地插設於滑軌部，用以遮擋連通口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A server with an anti-wind channeling design includes a server chassis and an inter-layer server partition plate. The server chassis includes a base plate, two side plates, and a partition layer. The two side plates are connected to both sides of the base plate. The partition layer is fixedly attached to the two side plates, forming a first layer space and a second layer space, and has an inter-layer passage. The inter-layer server partition plate includes a partition body and at least one brush component. The partition body includes a blocking section, two connecting sections, and a sliding rail section. The blocking section has at least one communication opening. The two connecting sections are connected to both ends of the blocking section for attachment to the two side plates, thereby allowing the blocking section to cover the inter-layer passage. The sliding rail section is attached to one side of the blocking section, and the brush component is movably inserted into the sliding rail section to block the communication opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具有防竄風設計之伺服器</p>
        <p type="p">1:伺服器機殼</p>
        <p type="p">12,13:側板</p>
        <p type="p">132:第一卡接結構</p>
        <p type="p">2:伺服器層間隔板</p>
        <p type="p">211:遮擋部</p>
        <p type="p">2132:第二卡接結構</p>
        <p type="p">2115,2116:連通口</p>
        <p type="p">22,23:毛刷件</p>
        <p type="p">TC:傳輸纜線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="607" publication-number="202618961">
    <tif-files tif-type="multi-tif">
      <tif file="113141083.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於清潔環形金屬框的清潔設備</chinese-title>
        <english-title>CLEANING EQUIPMENT FOR ANNULAR METAL FRAMES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H01L21/67</main-classification>
        <further-classification edition="202401120241204B">B08B1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旭東機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUZ TUNG MACHINERY INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹君瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊函諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔設備包括用以支持一環形金屬框的一支持裝置、用以驅動該環形金屬框轉動的一驅動裝置、及一第一清潔裝置。其中，該第一清潔裝置用以清潔轉動中的該環形金屬框。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaning equipment comprises a supporting device for supporting an annular metal frame, a driving device for driving the annular metal frame to rotate, and a first cleaning device, wherein the first cleaning device is for cleaning the annular metal frame in rotation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔設備</p>
        <p type="p">1:支持裝置</p>
        <p type="p">11:平台</p>
        <p type="p">12:驅動部</p>
        <p type="p">13:支撐惰輪</p>
        <p type="p">2:驅動裝置</p>
        <p type="p">21:帶動輪</p>
        <p type="p">22:馬達</p>
        <p type="p">3:第一清潔裝置</p>
        <p type="p">31:清潔部</p>
        <p type="p">311:清潔墊</p>
        <p type="p">312:基座</p>
        <p type="p">313:承塊</p>
        <p type="p">315:夾持件</p>
        <p type="p">316:伸縮缸</p>
        <p type="p">32:清潔液供給部</p>
        <p type="p">33:清潔墊安裝部</p>
        <p type="p">331:料槽</p>
        <p type="p">332:取料頭</p>
        <p type="p">334:第一驅動機構</p>
        <p type="p">335:推件</p>
        <p type="p">336:第二驅動機構</p>
        <p type="p">9:環形金屬框</p>
        <p type="p">91:第一環形表面</p>
        <p type="p">92:第二環形表面</p>
        <p type="p">93:內環緣</p>
        <p type="p">94:外環緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="608" publication-number="202617342">
    <tif-files tif-type="multi-tif">
      <tif file="113141084.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波主軸研磨加工設備</chinese-title>
        <english-title>ULTRASONIC SPINDLE GRINDING AND PROCESSING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B24B1/04</main-classification>
        <further-classification edition="201201120241204B">B24B37/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇泉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, QUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇泉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, QUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種超音波主軸研磨加工設備，主要包括：砂輪軸桿、壓電組、輪盤組、砂輪件、鎖固件、超音波導電線及驅動組件，其中壓電組由複數壓電片並聯組成且穿設於砂輪軸桿上的連接桿，輪盤組中的第一輪盤及第二輪盤相連接後穿設於連接桿，其中第一輪盤上的對接軸界定有傾斜面，第二輪盤上的對接部內側壁面界定的錐形面與傾斜面呈角度互補，而超音波導電線連接超音波產生器並將超音波傳送至壓電組以產生高頻振動，再透過傾斜面及錐形面的角度互補而形成足以涵蓋到摩擦表面範圍的徑向高頻振動，同時搭配驅動組件連接對接桿並對砂輪軸桿產生旋轉動力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is an ultrasonic spindle grinding and processing equipment, which mainly includes: grinding wheel shaft, piezoelectric group, wheel disc group, grinding wheel parts, locking parts, ultrasonic conductive wires and driving components. The piezoelectric group is composed of a plurality of piezoelectric sheets. A connecting rod formed in parallel and passed through the grinding wheel shaft. The first wheel disk and the second wheel disk in the wheel disk group are connected and then passed through the connecting rod. The docking axis on the first wheel disk defines an inclined surface., the tapered surface defined by the inner wall of the docking part on the second wheel disk is angularly complementary to the inclined surface, and the ultrasonic conductive wire is connected to the ultrasonic generator and transmits the ultrasonic wave to the piezoelectric group to generate high-frequency vibration, and then through The angles of the inclined surface and the tapered surface are complementary to form a radial high-frequency vibration that is sufficient to cover the friction surface range. At the same time, a driving component is used to connect the docking rod and generate rotational power for the grinding wheel shaft.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:研磨組件</p>
        <p type="p">20:砂輪軸桿</p>
        <p type="p">200:軸環</p>
        <p type="p">2000:徑向鎖孔</p>
        <p type="p">202:連接桿</p>
        <p type="p">204:對接桿</p>
        <p type="p">21:壓電組</p>
        <p type="p">220:第一輪盤</p>
        <p type="p">222:第二輪盤</p>
        <p type="p">23:砂輪件</p>
        <p type="p">24:鎖固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="609" publication-number="202617278">
    <tif-files tif-type="multi-tif">
      <tif file="113141085.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環形金屬框的清潔方法與清潔設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR CLEANING AN ANNULAR METAL FRAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241119B">B08B1/20</main-classification>
        <further-classification edition="200601120241119B">B08B11/00</further-classification>
        <further-classification edition="200601120241119B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旭東機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUZ TUNG MACHINERY INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹君瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊函諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種環形金屬框的清潔方法，包括：令該環形金屬框的一環形表面與一清潔墊接觸；將清潔液施加到該環形金屬框的一環形表面或該清潔墊；及令該環形金屬框與該清潔墊進行相對運動，以使該環形金屬框的該環形表面受到該清潔墊的擦拭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for cleaning an annular metal frame, comprising: bringing an annular surface of the annular metal frame into contact with a cleaning pad; applying a cleaning solution to the annular surface of the annular metal frame or the cleaning pad; and relatively moving the annular metal frame and the cleaning pad so that the annular surface of the annular metal frame is wiped by the cleaning pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔設備</p>
        <p type="p">9:環形金屬框</p>
        <p type="p">1:支持裝置</p>
        <p type="p">11:平台</p>
        <p type="p">12:驅動部</p>
        <p type="p">13:支撐惰輪</p>
        <p type="p">2:驅動裝置</p>
        <p type="p">21:帶動輪</p>
        <p type="p">22:馬達</p>
        <p type="p">3:清潔裝置</p>
        <p type="p">31:清潔部</p>
        <p type="p">311:清潔墊</p>
        <p type="p">312:基座</p>
        <p type="p">315:夾持件</p>
        <p type="p">316:伸縮缸</p>
        <p type="p">32:供給裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="610" publication-number="202617236">
    <tif-files tif-type="multi-tif">
      <tif file="113141086.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>幼童互助遊戲學習系統及其方法</chinese-title>
        <english-title>MUTUAL AID GAME LEARNING SYSTEM FOR YOUNG CHILDREN AND ITS METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241130B">A63F13/52</main-classification>
        <further-classification edition="201401120241130B">A63F13/58</further-classification>
        <further-classification edition="201401120241130B">A63F13/55</further-classification>
        <further-classification edition="201401120241130B">A63F13/79</further-classification>
        <further-classification edition="202201120241130B">G06V20/20</further-classification>
        <further-classification edition="202201120241130B">G06V20/64</further-classification>
        <further-classification edition="201301120241130B">G06F21/32</further-classification>
        <further-classification edition="201201120241130B">G06Q50/20</further-classification>
        <further-classification edition="200601120241130B">G09B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅書姍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, SHU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬上閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, SHANG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳聖峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHENG-FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王采蕎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TSAI-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊克雙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KE-SHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種幼童互助遊戲學習系統及其方法，包含：遊戲模組、影像辨識模組以及數據統計模組；遊戲模組包含遊戲引擎、介面單元、互動單元以及反饋單元；影像辨識模組，包含影像收集單元、影像追蹤單元以及影像分析單元；數據統計模組，包含數據處理單元以及數據分析單元；其中數據統計模組分別與影像辨識模組以及遊戲模組連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a mutual aid game learning system for young children and its method, comprising a game module, an image recognition module and a data statistics module. The game module includes a game engine, an interface unit, an interaction unit and a feedback unit. The image recognition module, including an image collection unit, an image tracking unit and an image analysis unit. The data statistics module includes a data processing unit and a data analysis unit. The data statistics module is connected to the image recognition module and the game module respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:遊戲模組</p>
        <p type="p">11:遊戲引擎</p>
        <p type="p">12:介面單元</p>
        <p type="p">13:互動單元</p>
        <p type="p">14:反饋單元</p>
        <p type="p">2:數據統計模組</p>
        <p type="p">21:數據處理單元</p>
        <p type="p">22:數據分析單元</p>
        <p type="p">3:影像辨識模組</p>
        <p type="p">31:影像收集單元</p>
        <p type="p">32:影像追蹤單元</p>
        <p type="p">33:影像分析單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="611" publication-number="202617094">
    <tif-files tif-type="multi-tif">
      <tif file="113141087.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管件支撐裝置</chinese-title>
        <english-title>PIPE SUPPORT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A61B17/00</main-classification>
        <further-classification edition="201601120241230B">A61B50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳顥言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAO-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王安平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, AN-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昱顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">管件支撐裝置包括管件、可脹縮件、氣體提供模組及氣壓感測器。可脹縮件配置在管件之外。氣體提供模組連接可脹縮件，且用以輸送氣體給可脹縮件或洩放可脹縮件內之氣體。氣壓感測器連通於可脹縮件，且用以感測可脹縮件內之氣體的氣壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pipe support device includes a pipe, an expandable and contractible element, a gas supply module and a gas pressure sensor. The expandable and contractible element is disposed outside the pipe. The gas supply module is connected to the expandable and contractible element and is configured to deliver a gas to the expandable and contractible element or to release the gas in the expandable and contractible element. The air pressure sensor is connected to the expandable and contractible element and is configured to sense a pressure of the gas in the expandable and contractible element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:管件支撐裝置</p>
        <p type="p">100A:管件支撐模組</p>
        <p type="p">105:工具</p>
        <p type="p">105s1:第一側面</p>
        <p type="p">105s2:第二側面</p>
        <p type="p">1051:穿刺尖端</p>
        <p type="p">1051s:斜面</p>
        <p type="p">110A:第一可脹縮件</p>
        <p type="p">11As:第一連接面</p>
        <p type="p">110B:第二可脹縮件</p>
        <p type="p">110Bs:第二連接面</p>
        <p type="p">115A:第一脹縮件輸氣管</p>
        <p type="p">115B:第二脹縮件輸氣管</p>
        <p type="p">120:控制器</p>
        <p type="p">130:第一氣體提供模組</p>
        <p type="p">131:第一氣壓源</p>
        <p type="p">132A:第一脹縮件控制閥</p>
        <p type="p">132B:第二脹縮件控制閥</p>
        <p type="p">150:管件</p>
        <p type="p">150a:中空通道</p>
        <p type="p">150s1:第一外壁面</p>
        <p type="p">150s2:第二外壁面</p>
        <p type="p">151:管體</p>
        <p type="p">160:端蓋</p>
        <p type="p">200A:工具姿態控制模組</p>
        <p type="p">210A:第一氣囊</p>
        <p type="p">210B:第二氣囊</p>
        <p type="p">215A:第一氣囊輸氣管</p>
        <p type="p">215B:第二氣囊輸氣管</p>
        <p type="p">230:第二氣體提供模組</p>
        <p type="p">231:第二氣壓源</p>
        <p type="p">232A:第一氣囊控制閥</p>
        <p type="p">232B:第二氣囊控制閥</p>
        <p type="p">d:位置</p>
        <p type="p">G1:第一氣體</p>
        <p type="p">G1&lt;sub&gt;A&lt;/sub&gt;,G2&lt;sub&gt;A&lt;/sub&gt;:第一道氣體</p>
        <p type="p">G1&lt;sub&gt;B&lt;/sub&gt;,G2&lt;sub&gt;B&lt;/sub&gt;:第二道氣體</p>
        <p type="p">G2:第二氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="612" publication-number="202618351">
    <tif-files tif-type="multi-tif">
      <tif file="113141088.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其製法</chinese-title>
        <english-title>ELECTRONIC PACKAGING AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">G02B6/12</main-classification>
        <further-classification edition="200601120241218B">G02B6/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯仲禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃博弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BO HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡琨昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其製法，該電子封裝件包括：一承載結構，定義有一連接區及一外接區，並於該外接區設有一凹槽；一光纖單元，設於該凹槽中；一第一磁性元件，設於該連接區；以及一第二磁性元件，設於該光纖單元，並與該第一磁性元件相互磁吸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic packaging and a manufacturing method thereof, the electronic packaging comprises: a carrying structure defining a connection area and an external joint area and having a recess located in the external joint area; an optical fiber unit provided in the recess; a first magnetic element provided in the connection area of the carrying structure; and a second magnetic element provided on the optical fiber unit and magnetically connected with the first magnetic element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子封裝件</p>
        <p type="p">20:承載結構</p>
        <p type="p">201:凹槽</p>
        <p type="p">21:波導單元</p>
        <p type="p">22:第一磁性元件</p>
        <p type="p">23,24:電子元件</p>
        <p type="p">231:耦合件</p>
        <p type="p">25:導電凸塊</p>
        <p type="p">26:包覆層</p>
        <p type="p">27:導電元件</p>
        <p type="p">3:光纖單元</p>
        <p type="p">30:光纖</p>
        <p type="p">4:第二磁性元件</p>
        <p type="p">A:置晶區</p>
        <p type="p">B:連接區</p>
        <p type="p">C:外接區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="613" publication-number="202617321">
    <tif-files tif-type="multi-tif">
      <tif file="113141090.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射剝離方法及雷射剝離設備</chinese-title>
        <english-title>LASER LIFT OFF METHOD AND LASER LIFT OFF DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241204B">B23K26/57</main-classification>
        <further-classification edition="201401120241204B">B23K26/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷傑科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>K-JET LASER TEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪文慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEN CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雷射剝離方法，適於使組合件的目標件與基板分離，雷射剝離方法包括：於組合件劃分中心區域以及多個環狀區域，環狀區域圍繞中心區域。於環狀區域內規劃多條第一加工軌跡，並於中心區域規劃多條第二加工軌跡。第一加工軌跡沿著預定方向延伸。以雷射光束由外側向內側依序對環狀區域沿著第一加工軌跡進行加工，一部分的第一加工軌跡由環狀區域的其中之一延伸到另一環狀區域上，之後再以雷射光束對中心區域沿著第二加工軌跡進行加工。亦提供一種雷射剝離設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laser lift off method is adapted to separate an epitaxial layer of a wafer from a substrate of the wafer. The laser lift off method includes the following steps. A central area and A plurality of annular areas are defined on the wafer, wherein the annular areas surround the central area. A plurality of first processing tracks is planned in the annular area, and a plurality of second processing tracks is planned in the central area, wherein the first processing tracks are extended along a setting direction. The annular areas are processed by a laser beam along the first processing tracks from an outer ring of the annular areas to an inner ring of the annular areas. A part of the first processing tracks extended from one of the annular areas to the other annular areas. The central area is processed by the laser beam along the second processing tracks. A laser lift off device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="614" publication-number="202618742">
    <tif-files tif-type="multi-tif">
      <tif file="113141091.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241113B">G09G3/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銘耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅睿騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JUI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">顯示面板包括：一畫素電路列，該些畫素電路列的複數個畫素電路分成複數個畫素電路組；複數條直流整體信號線；以及複數條分離式直流整體功率信號線，該些分離式直流整體功率信號線乃是獨立信號線，其中，該些直流整體信號線耦接至該些畫素電路與該些分離式直流整體功率信號線，以及該些直流整體信號線在該些畫素電路組之間係斷開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel includes: a pixel circuit row, a plurality of pixel circuits of the pixel circuit row divided into a plurality of pixel circuit groups; a plurality of DC global signal lines; and a plurality of separated DC global power signal lines, where the separated DC global power signal lines are independent signal lines. The DC global signal lines are coupled to the pixel circuits and the separated DC global power signal lines, and the DC global signal lines are disconnected between the pixel circuit groups.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:顯示面板</p>
        <p type="p">P:畫素電路</p>
        <p type="p">310:資料信號線</p>
        <p type="p">320:閘極驅動信號線</p>
        <p type="p">330:直流整體信號線</p>
        <p type="p">340、340_1~340_N:分離式直流整體功率信號線</p>
        <p type="p">P_1~P_N:畫素電路組</p>
        <p type="p">360:斷開</p>
        <p type="p">SN1(n):掃描信號</p>
        <p type="p">EM(n):發光信號</p>
        <p type="p">Vref1:參考電壓</p>
        <p type="p">AT:陣列測試信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="615" publication-number="202619081">
    <tif-files tif-type="multi-tif">
      <tif file="113141094.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H01L23/34</main-classification>
        <further-classification edition="200601120241104B">H01L23/528</further-classification>
        <further-classification edition="200601120241104B">H01L23/532</further-classification>
        <further-classification edition="200601120241104B">H01L23/535</further-classification>
        <further-classification edition="200601120241104B">H01L21/56</further-classification>
        <further-classification edition="200601120241104B">H01L21/60</further-classification>
        <further-classification edition="202301120241104B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江俊松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUNG-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾奕銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, I-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施易安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包括一基板、一導電柱、一電容結構以及多個虛設柱狀結構。導電柱設置於基板中。電容結構設置於基板中，與導電柱彼此分開。虛設柱狀結構隨機分布於導電柱與電容結構之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate, a conductive pillar, a capacitor and dummy pillars. The conductive pillar is disposed in the substrate. The capacitor is disposed in the substrate, and is separated from the conductive pillar. The dummy pillars are randomly distributed between the conductive pillar and the capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">112:導電柱</p>
        <p type="p">112h:第一開口</p>
        <p type="p">114:第一導電部</p>
        <p type="p">122:虛設柱狀結構</p>
        <p type="p">122h:第二開口</p>
        <p type="p">124:第二導電部</p>
        <p type="p">134:第三導電部</p>
        <p type="p">136:電容結構</p>
        <p type="p">136h:第一溝槽</p>
        <p type="p">144:第四導電部</p>
        <p type="p">146:虛設溝槽結構</p>
        <p type="p">146h:第二溝槽</p>
        <p type="p">1121:第一內襯</p>
        <p type="p">1122:中心部分</p>
        <p type="p">1221:第二內襯</p>
        <p type="p">1223:氣隙</p>
        <p type="p">CL:中心軸線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">D112,D122,D136,D146:深度</p>
        <p type="p">KZ:區域</p>
        <p type="p">PD:導電結構</p>
        <p type="p">W122,W136,W146,W1122:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="616" publication-number="202617482">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛換道決策系統及方法</chinese-title>
        <english-title>DECISION SYSTEM AND METHOD FOR CHANGING LANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241130B">B60W30/095</main-classification>
        <further-classification edition="201201120241130B">B60W40/06</further-classification>
        <further-classification edition="201201120241130B">B60W30/18</further-classification>
        <further-classification edition="200601120241130B">B60W50/00</further-classification>
        <further-classification edition="202301120241130B">G06Q10/04</further-classification>
        <further-classification edition="200601120241130B">G08G1/01</further-classification>
        <further-classification edition="200601120241130B">G08G1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人車輛研究測試中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUTOMOTIVE RESEARCH &amp; TESTING CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, PO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許琮明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TSUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種車輛換道決策系統，包含本車車身、感測裝置以及控制裝置。決策模組基於換道類型及換道是否可行以決定決策類別。決策執行規劃模組訊號連接決策模組，以依據決策類別進行決策執行規劃。可行判斷模組判定換道可行，且換道類型判定模組判定為提前換道旗標，決策類別為提前換道決策，決策執行規劃包含常態換道路徑；當可行判斷模組判定換道可行，且換道類型判定模組判定為應換道旗標，決策類別為應換道決策，決策執行規劃包含積極換道路徑。藉此，可決定決策類別，進行常態換道或積極換道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a decision system for changing lane including a host vehicle body, a detecting device and a controlling device. A decision module decides a decision type based on a lane changing type and whether a lane changing is feasible. A decision exerting module is signally connected to the decision module and provides a decision exerting plane. If a feasibility confirming module judges that the lane changing is feasible and the lane changing type deciding module decides an early lane changing flag, the decision type is an early lane changing decision flag, and the decision exerting plane includes a normal lane changing path. If the feasibility confirming module judges that the lane changing is feasible and the lane changing type deciding module decides a necessary lane changing flag, the decision type is a necessary lane changing decision flag, and the decision exerting plane includes a positive lane changing path. Therefore, the decision type is decided to conduct a normal lane changing plane or a positive lane changing plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車輛換道決策系統</p>
        <p type="p">110:本車車身</p>
        <p type="p">120:感測裝置</p>
        <p type="p">121:攝影機</p>
        <p type="p">122:雷達</p>
        <p type="p">123:定位元件</p>
        <p type="p">124:陀螺儀</p>
        <p type="p">130:控制裝置</p>
        <p type="p">131:交通流量感知模組</p>
        <p type="p">132:時間判定模組</p>
        <p type="p">133:可行判斷模組</p>
        <p type="p">134:決策模組</p>
        <p type="p">135:決策執行規劃模組</p>
        <p type="p">136:換道類型判定模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="617" publication-number="202617785">
    <tif-files tif-type="multi-tif">
      <tif file="113141096.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連續取得多種分子量玻尿酸的方法</chinese-title>
        <english-title>METHOD OF CONTINUOUSLY OBTAINING HYALURONIC ACIDS WITH MULTIPLE MOLECULAR WEIGHTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C08B37/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶齡富錦生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANION &amp; BF BIOTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏溥陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, PU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮川卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGAWA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容中的一些實施方式中提供一種連續取得多種分子量玻尿酸的方法，包含：提供玻尿酸粉末，其中玻尿酸粉末中的玻尿酸的起始重均分子量為1.5×10        &lt;sup&gt;6&lt;/sup&gt;道爾頓至3×10        &lt;sup&gt;6&lt;/sup&gt;道爾頓；以及放置玻尿酸粉末於不低於80°C且不高於130°C的環境，並於放置後30分鐘至18小時之間，多次分別自環境中取出部分玻尿酸粉末。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of continuously obtaining hyaluronic acids with multiple molecular weights is provided in some embodiments of the present disclosure, including: providing hyaluronic acid powder, in which an initial weight average molecular weight of hyaluronic acid in the hyaluronic acid powder is 1.5×10        &lt;sup&gt;6&lt;/sup&gt;Daltons to 3×10        &lt;sup&gt;6&lt;/sup&gt;Daltons; and placing the hyaluronic acid powder in an environment not lower than 80°C and not higher than 130°C and obtaining a portion of hyaluronic acid powder multiple times within 30 min to 18 hr after placing the hyaluronic acid powder.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">S110、S120、S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="618" publication-number="202619237">
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        <document-id>
          <doc-number>113141098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>閉迴磁路震動馬達</chinese-title>
        <english-title>A VIBRATION MOTOR WITH A CLOSED-LOOP MAGNETIC CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02K33/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台睿精工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPRAY MEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉錦松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIN-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡孝名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HSIAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張騏麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之閉迴磁路震動馬達，具有一馬達本體，包括：定子部固定座、動子部以及懸吊裝置。該定子部固定座包含：線圈組、定子軛鐵以及軟性電路板，其中，該線圈組連接定子部固定座；該定子軛鐵連接定子部固定座，並設置於線圈組的一側。該動子部，設置於相對於定子軛鐵的線圈組之另一側，並包含：動子載座以及磁石，其中，該動子載座藉由懸吊裝置連接定子部固定座；該磁石連接動子載座，並且可以為複數，該等磁石在同一個方向上排列，相鄰的該等磁石磁極相反；該動子軛鐵設置於動子載座中遠離線圈組的一側。該定子軛鐵數量對應磁石數量，該定子軛鐵中的定子軛鐵在對應的磁石中的磁石面上均形成定子軛鐵投影面，並且該定子軛鐵投影面的面積小於對應的磁石面的面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention　is a vibration motor with a closed-loop magnetic circuit having a motor body. The motor body comprises of a stator fixed seat, a moving part and a suspension device. The stator fixed seat includes a coil group, a stator yoke, and a flexible printed circuit. The coil group is connected to the stator fixed seat. The stator yoke is connected to the stator fixed seat and is disposed on one side of the coil group. The moving part is arranged on the opposite side of the coil group from the stator yoke, and includes a moving frame and a mover yoke. The moving frame is connected to the stator fixed seat through the suspension device. The magnet is connected to the moving frame and contains multiple magnets arranged in the one direction, with adjacent magnets having opposite magnetic poles. The mover yoke is arranged on the side of the moving frame away from the coil group. The number of stator yoke corresponds to the number of magnet, and each stator yokes forms stator yoke projection surfaces on the magnet surfaces in the corresponding magnet group. The area of ​​the stator yoke projection surface is smaller than the area of ​​the corresponding magnet surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:定子部固定座</p>
        <p type="p">11:線圈組</p>
        <p type="p">12:定子軛鐵</p>
        <p type="p">120:定子軛鐵投影面</p>
        <p type="p">13:軟性電路板</p>
        <p type="p">2:動子部</p>
        <p type="p">21:動子載座</p>
        <p type="p">22:磁石</p>
        <p type="p">23:動子軛鐵</p>
        <p type="p">3:懸吊裝置</p>
        <p type="p">31:彈性支撐元件</p>
        <p type="p">32:固定元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="619" publication-number="202617275">
    <tif-files tif-type="multi-tif">
      <tif file="113141099.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於塑膠製品的辨識分選方法及辨識分選系統</chinese-title>
        <english-title>RECOGNITION AND CLASSIFICATION METHOD FOR PLASTIC PRODUCTS AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250219B">B07C5/34</main-classification>
        <further-classification edition="202301120250219B">G06F18/10</further-classification>
        <further-classification edition="202301120250219B">G06F18/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>捷寶全球股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPER INTERNATIONAL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡維哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡維哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林伯勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明用於塑膠製品的辨識分選方法，包含以下步驟：將一待分選物件的初始影像資料進行影像處理，得到一影像尺寸不高於512×512像素的預處理影像資料，該預處理影像資料顯示有一位於中央位置的待辨識物件；對該預處理影像資料進行影像辨識，以判定該待辨識物件是否標示有一代碼圖案；當判定該待辨識物件標示有該代碼圖案，將該代碼圖案與一儲存有多筆代碼資料的資料庫進行比對，以得到一與該待分選物件的種類相關的分選辨識結果。此外，本案來提供一用以執行該辨識分選方法的辨識系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A recognition and classification method for plastic products includes: performing image processing on an initial image data showing an object to be classified to obtain a pre-processed image data with the size no higher than 512×512 pixels, and the pre-processed image data shows an object to be recognized in the center; performing the image recognition on the preprocessed image data to determine whether the object to be recognized is marked with a code pattern; when it is determined that the object to be recognized is marked with the code pattern, comparing the code pattern with multiple pieces of code data stored in a database to obtain a result related to the type of the object to be classified. Besides, this invention also provides a system for executing the recognition and classification method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S9:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="620" publication-number="202618097">
    <tif-files tif-type="multi-tif">
      <tif file="113141101.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可量測重量之馬桶套件及其馬桶裝置</chinese-title>
        <english-title>TOILET KIT CAPABLE OF MEASURING WEIGHT AND TOILET DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">E03D9/00</main-classification>
        <further-classification edition="200601120241129B">A47K13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可量測重量之馬桶套件及其馬桶裝置，馬桶套件包括一馬桶坐墊、以及至少一重量感測元件，其中馬桶坐墊用以設於馬桶裝置之沖水座上，而該重量感測元件設於馬桶坐墊下方，且重量感測元件包含一載體、以及設於載體內的一感測單元，且載體具有由側向延伸而出的至少一固定端，重量感測元件即係以該固定端而被固定設置於馬桶坐墊下方。藉此可供人體於馬桶裝置如廁時，同時對人體進行體重的量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A toilet kit capable of measuring weight and a toilet device thereof are provided. The toilet kit includes a toilet seat and at least one weight sensing member. The toilet seat is arranged on a flush seat of the toilet device. The weight sensing member is arranged below the toilet seat and includes a carrier and a sensor unit arranged in the carrier. The carrier has at least one fixing end extended from lateral. The weight sensing member is fixed below the toilet seat by the fixing end. The toilet kit is therefore measuring a weight of user when the user is using the toilet device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:馬桶套件</p>
        <p type="p">10:馬桶坐墊</p>
        <p type="p">11:重量感測元件</p>
        <p type="p">12:馬桶蓋</p>
        <p type="p">13:清洗單元</p>
        <p type="p">130:引管</p>
        <p type="p">131:噴頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="621" publication-number="202617020">
    <tif-files tif-type="multi-tif">
      <tif file="113141103.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>便器上的異常檢測裝置以及方法</chinese-title>
        <english-title>ANOMALY DETECTION DEVICE IN A COMMODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">A47K13/24</main-classification>
        <further-classification edition="200601120241130B">A61B5/00</further-classification>
        <further-classification edition="200601120241130B">G01N1/02</further-classification>
        <further-classification edition="200601120241130B">G01N33/50</further-classification>
        <further-classification edition="200601120241130B">E03D9/00</further-classification>
        <further-classification edition="200601120241130B">E03D11/00</further-classification>
        <further-classification edition="200601120241130B">E03D11/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種便器上的異常檢測裝置，適用於便器，包括多個排泄物檢測電路、記憶體以及處理器。處理器經配置以：針對各排泄物相關資料，選擇具有相同的排泄物資料類型的所有歷史排泄物資料；根據各排泄物相關資料以及具有相同的泄物資料類型的所有歷史排泄物資料判斷是否發生排泄異常；以及當已發生排泄異常時，產生警報訊號以傳送至使用者所持有的使用者裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anomaly detection device in a commode for the commode is disclosed, which includes multiple excreta detection circuits, a memory, and a processor. The processor is configured for: for each of multiple excreta-related data, selecting all historical excreta data having the same excreta data type; determining whether excreta abnormality has occurred based on each excreta-related data and all historical excreta data having the same excreta data type; and when the excreta abnormality has occurred, generating an alarm signal for transmission to a user device held by a user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:便器上的異常檢測裝置</p>
        <p type="p">111~11m:排泄物檢測電路</p>
        <p type="p">121~12n:生理資料檢測電路</p>
        <p type="p">130:處理器</p>
        <p type="p">140:記憶體</p>
        <p type="p">150:傳輸電路</p>
        <p type="p">160:接觸感測器</p>
        <p type="p">170:接近感測電路</p>
        <p type="p">UE1:使用者裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="622" publication-number="202617060">
    <tif-files tif-type="multi-tif">
      <tif file="113141104.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>健康監測裝置以及方法</chinese-title>
        <english-title>MONITORING DEVICE AND METHOD FOR HEALTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241202B">A61B5/00</main-classification>
        <further-classification edition="200601120241202B">G01N33/483</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種健康監測裝置，其包括多個敏感電路、攝影電路、記憶體以及處理器。處理器經配置以：當判斷檢測到的重量不同於初始重量時，計算檢測到的重量與初始重量之間的排泄物重量；控制攝影電路拍攝便池以產生影像，並對從影像辨識出排泄物類型；將檢測到排泄物重量以及排泄物類型儲存於記憶體中，或將檢測到的電器訊號儲存於記憶體中；當判斷接收結束訊號時，根據記憶體儲存的所有排泄物重量、與各排泄物重量對應的排泄物類型以及多個歷史排泄物重量或根據記憶體儲存的所有電器訊號以及多個歷史氣味資訊進行趨勢分析以判斷是否發生排泄物異常或氣味異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An monitoring device for health is disclosed, which includes multiple sensitive circuits, a photographic circuit, a memory, and a processor. The processor is configured for: when determining that a weight being detected is different from an initial weight, calculating an excreta weight between the detected weight and the initial weight; controlling the photography circuit to capture a bowl to generate an image, and identifying an excreta type from the image; storing the excreta weight and the excreta type being detected in the memory, or storing a electrical signal being detected; when determining that an end signal is received, performing trend analysis to determine if a excreta abnormality or odor abnormality has occurred based on all excreta weights, the excreta types corresponding to each excreta weight, and multiple historical excreta weights stored in the memory or based on all electrical signals and multiple historical odor information stored in the memory.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:健康監測裝置</p>
        <p type="p">1101~110n:敏感電路</p>
        <p type="p">120:攝影電路</p>
        <p type="p">130:處理器</p>
        <p type="p">140:記憶體</p>
        <p type="p">150:傳輸電路</p>
        <p type="p">160:接近感測電路</p>
        <p type="p">170:輸入電路</p>
        <p type="p">180:接觸感測器</p>
        <p type="p">UE1:使用者裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="623" publication-number="202617021">
    <tif-files tif-type="multi-tif">
      <tif file="113141105.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對排泄物的檢測系統以及方法</chinese-title>
        <english-title>DETECTION SYSTEM AND METHOD FOR EXCREMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">A47K13/24</main-classification>
        <further-classification edition="200601120241130B">A61B5/00</further-classification>
        <further-classification edition="200601120241130B">G01N1/02</further-classification>
        <further-classification edition="200601120241130B">G01N33/50</further-classification>
        <further-classification edition="200601120241130B">E03D9/00</further-classification>
        <further-classification edition="200601120241130B">E03D11/00</further-classification>
        <further-classification edition="200601120241130B">E03D11/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種針對排泄物的檢測系統，包括攝影機、輸入電路、傳輸電路、處理器以及伺服器。攝影機用以拍攝便器內的試片之顯示部。輸入電路在接收輸入資訊時產生啟動訊號。傳輸電路用以傳送影像。處理器控制攝影機拍攝試片之顯示部以產生試片影像，並藉由傳輸電路傳送試片影像。伺服器從傳輸電路接收試片影像，並對試片影像進行影像辨識以產生檢測結果，其中檢測結果指示出在排泄物碰觸到試片之檢測部且進行反應後所顯示之生理相關資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection system for excrement includes a camera, an input circuit, a transmission circuit, a processor, and a server. The camera is used to photograph a display part of a test piece in a toilet. The input circuit is used to generate a trigger signal when receiving input information. The transmission circuit is used to transmit an image. The processor controls the camera to photograph the display part of the test piece to generate a test piece image, and transmits the test piece image through the transmission circuit. The server receives the test piece image from the transmission circuit, and performs image recognition on the test piece image to generate test result, where the test result indicates the physiological correlation shown by the test piece after a test part of the test piece touches and reacts with user’s excrement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:針對排泄物的檢測系統</p>
        <p type="p">110:攝影機</p>
        <p type="p">120:輸入電路</p>
        <p type="p">130:處理器</p>
        <p type="p">140:傳輸電路</p>
        <p type="p">150:伺服器</p>
        <p type="p">151:資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="624" publication-number="202617403">
    <tif-files tif-type="multi-tif">
      <tif file="113141106.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141106</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特徵編碼搭配機器學習之預測成品多品質方法及生產設備</chinese-title>
        <english-title>A METHOD FOR PREDICTING MULTIPLE QUALITIES OF FINISHED PRODUCTS USING FEATURE ENCODING WITH MACHINE LEARNING AND PRODUCTION EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">B29C45/00</main-classification>
        <further-classification edition="201901120250203B">G06N20/00</further-classification>
        <further-classification edition="202301120250203B">G06Q10/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯坤呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種特徵編碼搭配機器學習之預測成品多品質方法，適用於在一生產設備中監控其製造流程，並包含一實驗步驟、一資料前處理步驟、一特徵學習步驟，及一模型校正步驟，於該實驗步驟中，該生產設備以至少一製程條件生產一成品並取得一偵測數據流，於該資料前處理步驟中，一自動編碼器對該偵測數據流進行編碼以取得一特徵碼數據流，該偵測數據流可計算出品質指數，於該特徵學習步驟，一預測模組對該特徵碼數據流及品質指數進行學習，於該模型校正步驟，對該預測模組進行成品品質的學習，以提升該預測模組預測的準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for predicting multiple qualities of finished products using feature encoding with machine learning, applicable for monitoring the manufacturing process in a production equipment. The method includes an experimental step, a data preprocessing step, a feature learning step, and a model calibration step. In experimental step, the production equipment produces a finished product under at least one process condition and obtains a detection data stream. In data preprocessing step, an autoencoder encodes the detection data stream to obtain a feature code data stream, from which a quality index can be calculated. In feature learning step, a prediction module learns from the feature code data stream and the quality index. In model calibration step, the prediction module is trained to learn the quality of the finished product to enhance the accuracy of the predictions made by the prediction module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">901:實驗步驟</p>
        <p type="p">902:資料前處理步驟</p>
        <p type="p">903:特徵學習步驟</p>
        <p type="p">904:模型校正步驟</p>
        <p type="p">905:預測步驟</p>
        <p type="p">906:驗證步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="625" publication-number="202618098">
    <tif-files tif-type="multi-tif">
      <tif file="113141113.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可檢視人體臀部及大腿皮膚狀況之馬桶套件及馬桶裝置、及其檢視方法</chinese-title>
        <english-title>TOILET KIT CAPABLE OF CHECKING SKIN CONDITION OF HUMAN BUTTOCKS AND THIGHS, TOILET DEVICE AND CHECKING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">E03D9/00</main-classification>
        <further-classification edition="201801120241129B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可檢視人體臀部及大腿皮膚狀況之馬桶套件及馬桶裝置、及其檢視方法，馬桶套件包括一馬桶坐墊、以及一影像掃描單元，影像掃描單元設於馬桶坐墊下方，並包含一驅動器、受驅動器驅動的一載體、以及設於載體上的一攝像頭，且驅動器用以驅動載體於馬桶坐墊下方作一橫向位移，並以攝像頭朝向上方作影像擷取。藉此可供人體於馬桶裝置如廁時，同時檢視人體的臀部至大腿皮膚，進而能夠瞭解健康相關方面的狀況、或是隨時進行記錄與追蹤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A toilet kit capable of checking skin condition of human buttocks and thighs, a toilet device, and a checking method thereof are provided. The toilet kit includes a toilet seat and an image scanning unit. The image scanning unit is arranged below the toilet seat and includes a driver, a carrier driven by the driver, and a camera arranged on the carrier. The driver drives the carrier to move transversely below the toilet seat, and the camera captures images upward. The toilet kit is therefore checking a skin condition of buttocks and thighs of user when the user is using the toilet device, so as to learn health-related status or record and track at any time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:馬桶套件</p>
        <p type="p">10:馬桶坐墊</p>
        <p type="p">11:影像掃描單元</p>
        <p type="p">110a:傳動桿</p>
        <p type="p">12:馬桶蓋</p>
        <p type="p">13:清洗單元</p>
        <p type="p">130:引管</p>
        <p type="p">131:噴頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="626" publication-number="202618740">
    <tif-files tif-type="multi-tif">
      <tif file="113141115.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及適用於顯示面板的驅動電路</chinese-title>
        <english-title>DISPLAY PANEL AND A DRIVING CIRCUIT ADAPTABLE THERETO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">G09G3/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟端光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRILIT OPTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳炳昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BIING SENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嘉玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於顯示面板的驅動電路，包含驅動電晶體，連接於第一電源電壓和發光二極體之間；及二電容器，可控地連接至驅動電晶體和提供影像信號的相應資料線。二電容器的其中之一作為驅動電容器，可控地以目前影像信號驅動驅動電晶體，另一電容器作為預載電容器，可控地預載後續影像信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driving circuit adaptable to a display panel includes a driving transistor connected between a first supply voltage and a light-emitting diode (LED); and two capacitors controllably connected to the driving transistor and a corresponding data line that provides an image signal. One of the two capacitors is used as a driving capacitor to controllably drive the driving transistor with a present image signal, while another of the two capacitors is used as a pre-loading capacitor for controllably pre-loading a succeeding image signal therein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:像素單元</p>
        <p type="p">111:驅動電路</p>
        <p type="p">112:發光二極體</p>
        <p type="p">VDD:第一電源電壓</p>
        <p type="p">VSS:第二電源電壓</p>
        <p type="p">REF:參考點</p>
        <p type="p">M:驅動電晶體</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">C1:第一電容器</p>
        <p type="p">C2:第二電容器</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">A:第一控制信號</p>
        <p type="p">B:第二控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="627" publication-number="202618707">
    <tif-files tif-type="multi-tif">
      <tif file="113141116.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141116</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安防攝影機系統及方法</chinese-title>
        <english-title>SECURITY CAMERA SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">G06V20/52</main-classification>
        <further-classification edition="200601120250203B">G08B13/00</further-classification>
        <further-classification edition="200601120250203B">H04N7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大鵬科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLIMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種安防攝影機系統，包含安防攝影機，於安裝期間擷取場景的場景影像；場景分析器，於安裝期間根據場景影像以辨識場景當中的元件，因而產生複數識別元件；及風險分析器，於安裝期間分別評估識別元件的入侵風險程度，因而決定至少一識別元件作為入侵區域，其風險程度高於預設臨界值。於安裝之後的一般安防操作期間，安防攝影機產生擷取影像，且場景分析器僅監控入侵區域以偵測入侵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A security camera system includes a security camera that captures a scene image of a scene during an installation; a scene analyzer that identifies elements within the scene according to the scene image during the installation, thereby resulting in identified elements; and a risk analyzer that assesses risk levels of intrusion for the identified elements respectively during the installation, thereby determining at least one identified element with risk level higher than a predetermined threshold as an intrusion region. The security camera generates a captured image in a general security operation after the installation, and the scene analyzer then monitors only the intrusion region for detecting intrusion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:安防攝影機系統</p>
        <p type="p">11:安防攝影機</p>
        <p type="p">12:場景分析器</p>
        <p type="p">13:風險分析器</p>
        <p type="p">14:影像增強器</p>
        <p type="p">15:監控人員</p>
        <p type="p">16:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="628" publication-number="202618837">
    <tif-files tif-type="multi-tif">
      <tif file="113141119.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141119</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電磁繼電器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H01H50/14</main-classification>
        <further-classification edition="200601120241204B">H01H50/16</further-classification>
        <further-classification edition="200601120241204B">H01H50/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松川精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳頌仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種電磁繼電器，包含殼體；電磁鐵，設於殼體內；可動銜鐵，設於殼體內且位於電磁鐵一側；可動接點組件，設於殼體內且與可動銜鐵連接設置並具有第一及第二接點板，第一接點板具有第一及第二可動接點，第二接點板具有第三及第四可動接點；固定接點組件，部分設於殼體內，部分設於殼體外，固定接點組件具有彼此不相互接觸之第一至第四端子板，第一至第四端子板位於殼體內之部分具有第一至第四固定接點；其中，第一與第二端子板於殼體外部分對應第一接點板設置，第三與第四端子板於殼體外部分對應第二接點板設置；殼體內之第一固定接點對應第一可動接點設置，第四固定接點對應第四可動接點設置，且第三固定接點對應第二可動接點設置，第二固定接點對應第三可動接點設置，而形成第二與該第三端子板於殼體內呈交錯設置；可動接點組件於電磁鐵之電磁作用而受可動銜鐵帶動使第一至第四可動接點分別與對應之第一至第四固定接點為接觸或不接觸狀態。據此，可形成並聯電流通路以利於耐受大電流應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼體</p>
        <p type="p">2:電磁鐵</p>
        <p type="p">3:可動銜鐵</p>
        <p type="p">4:可動接點組件</p>
        <p type="p">41:第一接點板</p>
        <p type="p">411:第一可動接點</p>
        <p type="p">412:第二可動接點</p>
        <p type="p">42:第二接點板</p>
        <p type="p">421:第三可動接點</p>
        <p type="p">422:第四可動接點</p>
        <p type="p">5:固定接點組件</p>
        <p type="p">51:第一端子板</p>
        <p type="p">511:第一固定接點</p>
        <p type="p">52:第二端子板</p>
        <p type="p">521:第二固定接點</p>
        <p type="p">53:第三端子板</p>
        <p type="p">531:第三固定接點</p>
        <p type="p">54:第四端子板</p>
        <p type="p">541:第四固定接點</p>
        <p type="p">6:第一絕緣件</p>
        <p type="p">60:第一容置槽</p>
        <p type="p">7:第二絕緣件</p>
        <p type="p">70:第二容置槽</p>
        <p type="p">74:限位件</p>
        <p type="p">9:電磁繼電器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="629" publication-number="202616995">
    <tif-files tif-type="multi-tif">
      <tif file="113141120.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矯正椅</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">A47C1/00</main-classification>
        <further-classification edition="200601120250305B">A47C7/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高繼徽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅子勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈佳誼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑀庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種矯正椅，包含坐墊、二前拉伸彈簧、一後拉伸彈簧、懸吊組件、上、下半部椅撐。上半部椅撐具有供坐墊設置於上之乘坐部，並由該處向下延伸而具有被懸吊部，被懸吊部前端為向前彎折；下半部椅撐具有供靠抵於地面之撐抵部，並由撐抵部前端向上延伸具有懸吊部，懸吊部端末為向後彎折。前拉伸彈簧互不跨接且一端分別固定於乘坐部前端緣的兩側端部，另一端分別固定於撐抵部前端緣的兩側端；後拉伸彈簧一端固定於乘坐部後端緣中間位置，另一端固定於撐抵部後端緣中間位置；懸吊組件一端固定於懸吊部端末位置，另一端固定於被懸吊部端末位置。透過懸吊組件使下半部椅撐提供上半部椅撐向上之懸吊立係與前拉伸彈簧和後拉伸彈簧之拉伸力為相反施力狀態而形成平衡。據此，即可於乘坐時提供矯正使用者乘坐過程中維持正確坐姿之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:矯正椅</p>
        <p type="p">10:坐墊</p>
        <p type="p">11:前拉伸彈簧</p>
        <p type="p">12:後拉伸彈簧</p>
        <p type="p">13:懸吊組件</p>
        <p type="p">14:上半部椅撐</p>
        <p type="p">141:乘坐部</p>
        <p type="p">142:被懸吊部</p>
        <p type="p">15:下半部椅撐</p>
        <p type="p">151:撐抵部</p>
        <p type="p">152:懸吊部</p>
        <p type="p">16:椅背</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="630" publication-number="202617022">
    <tif-files tif-type="multi-tif">
      <tif file="113141121.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>如廁用糞便檢測器及具有該糞便檢測器之馬桶裝置</chinese-title>
        <english-title>EXCREMENT DETECTOR FOR USE IN TOILET AND TOILET DEVICE HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241122B">A47K13/24</main-classification>
        <further-classification edition="200601120241122B">E03D9/00</further-classification>
        <further-classification edition="200601120241122B">A61B5/00</further-classification>
        <further-classification edition="200601120241122B">G01N33/48</further-classification>
        <further-classification edition="200601120241122B">G01N1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種如廁用糞便檢測器及具有該糞便檢測器之馬桶裝置，該馬桶裝置包括一試片台、一移動盤、以及一沖水座，試片台具有一試片槽並用以供至少一試片置入，移動盤包含一驅動器、以及受驅動器作動的一盤體，而沖水座內具有一便池；其中，盤體受驅動器作動而往返於試片台的上方處與便池的上方處。以便人體於該馬桶裝置上排糞時，可直接進行糞便的採集，從而減少沾染糞便的機會，以更方便採集糞便作檢驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An excrement detector for use in toilet and a toilet device having the same are provided. The toilet device includes a test-piece table, a moving platform, and a flush seat. The test-piece table has a test-piece groove to accommodate at least one test piece. The moving platform includes a driver and a platform driven by the driver. The flush seat has a urinal therein. The platform moves back and forth between a top of the test-piece table and a top of the urinal. The excrement may be collected directly when the user is using the toilet, so as to reduce the chance of contaminating the excrement and conveniently collect the excrement to inspect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:試片台</p>
        <p type="p">100a:試片</p>
        <p type="p">11:移動盤</p>
        <p type="p">110:驅動器</p>
        <p type="p">111:盤體</p>
        <p type="p">111a:引流結構</p>
        <p type="p">112:位移桿</p>
        <p type="p">12:影像截取單元</p>
        <p type="p">120:攝影鏡頭</p>
        <p type="p">13:糞便</p>
        <p type="p">14:反應劑</p>
        <p type="p">2:馬桶裝置</p>
        <p type="p">20:沖水座</p>
        <p type="p">201:沖水部</p>
        <p type="p">21:馬桶坐墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="631" publication-number="202618277">
    <tif-files tif-type="multi-tif">
      <tif file="113141122.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動尿液檢測器及具有該自動尿液檢測器之馬桶裝置、及適用該自動尿液檢測器之試劑管</chinese-title>
        <english-title>AUTOMATIC URINE DETECTOR, TOILET DEVICE HAVING THE SAME, AND REAGENT TUBE SUITABLE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G01N33/493</main-classification>
        <further-classification edition="200601120241230B">E03D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動尿液檢測器及具有該自動尿液檢測器之馬桶裝置、及適用該自動尿液檢測器之試劑管，該自動尿液檢測器用以裝設於所述馬桶裝置內，包括一轉輪套件、一刺破組、以及一承接盤；其中，轉輪套件包含一轉輪座、以及樞套於轉輪座上的一轉輪，轉輪受一轉輪驅動器帶動而使轉輪於轉輪座上作旋轉，且轉輪上設有複數試劑槽並用以供所述試劑管安裝，試劑槽圍繞轉輪而分佈於轉輪的圓周面上；刺破組相對位於任一試劑槽上並具有刀刃，以受一切刀驅動器帶動而使刀刃朝向試劑槽移動；承接盤具有一引導流道並延伸至轉輪套件一側外，以對應至任一試劑槽上並引導尿液流入試劑管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic urine detector, a toilet device having the same, and a reagent tube suitable thereof are provided. The automatic urine detector is arranged in the toilet device and includes a wheel kit, a puncture set, and a carrying plate. The wheel kit includes a wheel seat and a wheel pivoting on the wheel seat. The wheel is driven by a wheel driver to rotate on the wheel seat. A plurality of test-piece grooves is arranged on a circumferential surface of the wheel for installing a plurality of reagent tubes. The puncture set is located on one of the test-piece grooves and has a blade. The puncture set is driven by a knife driver to move toward the test-piece grooves. The carrying plate has a drainage structure extended outside a side of the wheel kit and corresponding to one of the test-piece grooves to guide the urine therein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:自動尿液檢測器</p>
        <p type="p">100:轉輪座</p>
        <p type="p">101:轉輪</p>
        <p type="p">102:試劑槽</p>
        <p type="p">103:影像截取單元</p>
        <p type="p">11:刺破組</p>
        <p type="p">110:刀刃</p>
        <p type="p">120:引導流道</p>
        <p type="p">13:支架</p>
        <p type="p">130:立板</p>
        <p type="p">131:轉輪驅動器</p>
        <p type="p">132:切刀驅動器</p>
        <p type="p">14:試劑管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="632" publication-number="202618099">
    <tif-files tif-type="multi-tif">
      <tif file="113141123.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>如廁用尿液檢測器及具有該尿液檢測器之馬桶裝置</chinese-title>
        <english-title>URINE DETECTOR FOR USE IN TOILET AND TOILET DEVICE HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241202B">E03D9/00</main-classification>
        <further-classification edition="200601120241202B">A47K13/24</further-classification>
        <further-classification edition="200601120241202B">A61B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種如廁用尿液檢測器及具有該尿液檢測器之馬桶裝置，該馬桶裝置包括一試片台、一固定座、以及一沖水座，試片台具有一試片槽並用以供至少一試片置入，且試片台上設有一裸空區並連通試片槽，俾供尿液通過裸空區而進入試片槽內，而沖水座內具有一便池，並於相對便池周圍的上方處具有一沖水部；其中，固定座係將試片台由沖水部朝向便池內作配置。以便於人體於該馬桶裝置上排尿時，可直接進行尿液的採集，從而減少沾染尿液的機會，以更方便採集尿液作檢驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A urine detector for use in toilet and a toilet device having the same are provided. The toilet device includes a test-piece table, a fixing seat, and a flush seat. The test-piece table has a test-piece groove to accommodate at least one test piece, and a bare area communicated to the test-piece groove is arranged on the test-piece table. The urine may enter the test-piece groove through the bare area. The flush seat has a urinal therein and a flush portion above a periphery of the urinal. The fixing seat arranges the test-piece table from the flush portion toward the urinal. The urine may be collected directly when the user is using the toilet, so as to reduce the chance of contaminating the urine and conveniently collect the urine to inspect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:尿液檢測器</p>
        <p type="p">10:試片台</p>
        <p type="p">100:試片槽</p>
        <p type="p">100a:試片</p>
        <p type="p">101:端蓋</p>
        <p type="p">11:固定座</p>
        <p type="p">12:影像截取單元</p>
        <p type="p">120:攝影鏡頭</p>
        <p type="p">13:尿斗</p>
        <p type="p">14:通訊單元</p>
        <p type="p">20:沖水座</p>
        <p type="p">201:沖水部</p>
        <p type="p">21:馬桶坐墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="633" publication-number="202618100">
    <tif-files tif-type="multi-tif">
      <tif file="113141124.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具檢驗酸鹼值之檢測器及其馬桶裝置</chinese-title>
        <english-title>DETECTOR FOR INSPECTING PH VALUE AND TOILET DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">E03D9/00</main-classification>
        <further-classification edition="200601120250106B">G01N33/493</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具檢驗酸鹼值之檢測器及其馬桶裝置，用以裝設於一便器內，包括一承接盤、以及一酸鹼值檢測器；承接盤用以設於便器內，且承接盤上設有一支架；酸鹼值檢測器架設於支架上並朝向承接盤；藉此，俾以酸鹼值檢測器對排放至便器內的尿液於承接盤上進行感測，以更方便採集尿液作酸鹼值（PH值）的檢測反應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detector for inspecting pH value and a toilet device thereof are provided. The detector is used for installation in a toilet and includes a carrying plate and a pH value sensor. The carry plate is arranged in the toilet and provides a bracket thereon. The pH value sensor is arranged on the bracket and faces to the carrying plate. The pH value sensor inspects a urine discharged into the toilet on the carrying plate, so as to conveniently collect the urine for doing a detection reaction of the acid-base value (pH value).</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:沖水部</p>
        <p type="p">11:馬桶坐墊</p>
        <p type="p">2:檢測器</p>
        <p type="p">20:承接盤</p>
        <p type="p">201:第二支架</p>
        <p type="p">21:酸鹼值檢測器</p>
        <p type="p">210:感測端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="634" publication-number="202617516">
    <tif-files tif-type="multi-tif">
      <tif file="113141125.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具前饋自適應控制之自動變速方法及系統</chinese-title>
        <english-title>AUTOMATIC TRANSMISSION METHOD WITH FEEDFORWARD ADAPTIVE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241204B">B62M9/123</main-classification>
        <further-classification edition="201001120241204B">B62M9/133</further-classification>
        <further-classification edition="201001120241204B">B62M6/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人自行車暨健康科技工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYCLING &amp; HEALTH TECH INDUSTRY R&amp;D CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖忠義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳淳和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳濟行</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種具前饋自適應控制之自動變速方法，其係於騎乘變速資料庫建立騎乘路徑圖資檔案，且依據騎乘路徑的坡度、爬坡長度及彎度而分割為複數區段，各區段設定有變速檔位資訊及定位資訊。於資訊裝置建立騎乘變速控制模組。變速設定界面包含前餽控制介面用以於顯示幕顯示騎乘路徑產生界面，供輸入起點至目的地的指令，使顯示幕顯示相同或類似騎乘路徑圖資資訊的目錄，騎乘變速控制模組則依序讀取所選定之騎乘路徑圖資檔案之各區段的該變速檔位資訊及各定位資訊。定位模組取得即時定位資訊，以識別自行車所處位置，以依序於各區段透過訊號傳輸模組傳輸變速檔位資訊，主控制器接收變速檔位資訊以作為驅動電子變速器檔位變速的依據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an automatic transmission method with feedforward adaptive control. It establishes riding path map files in a riding shifting database and divides it into several sections based on the slope, climbing length and curvature of the riding path. Each section is set with transmission gear information and positioning information. Build a riding speed control module in the information device. A speed setting interface includes a feedforward control interface for displaying riding path generation interface to be input commands for the start point to the destination, and displaying a directory with the same or similar riding route map information, and the riding speed control module sequentially reads the transmission gear information and positioning information of each section of the selected riding path map file. A positioning module obtains real-time positioning information to identify the location of a bicycle and transmits the transmission gear information through signal transmission module in each section in sequence. The main controller receives the transmission gear information to drive the electronic transmission gear shift.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:雲端伺服器</p>
        <p type="p">11:騎乘變速資料庫</p>
        <p type="p">20:自行車</p>
        <p type="p">21:電子變速器</p>
        <p type="p">30:資訊裝置</p>
        <p type="p">40:訊號傳輸模組</p>
        <p type="p">50:主控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="635" publication-number="202617500">
    <tif-files tif-type="multi-tif">
      <tif file="113141127.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141127</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車座管總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">B62K19/36</main-classification>
        <further-classification edition="200601120250102B">B62J1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久鼎金屬實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮彬杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃翔鈴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種自行車座管總成，其包含有一外管、一內管、一升降組件以及一控制組件。內管可移動地設置於外管內。升降組件，組設於內管，其具有一閥體與一閥件，閥件用以控制閥體之開閉。控制組件，組設於外管，控制組件具有一纜索、一安裝座、一拉柄與一推柄，安裝座之內側具有二相對之內壁，於二內壁分別設置一斜向之定向槽，拉柄透過一旋轉軸樞設於安裝座，且拉柄之一端連接於纜索之一端，另一端則抵接推柄，推柄之二定位部分別設置於安裝座之定向槽。藉此，推柄沿著定向槽產生上下之滑移動作，透過推抵升降組件之閥件去控制閥體的開閉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自行車座管總成</p>
        <p type="p">20:外管</p>
        <p type="p">30:內管</p>
        <p type="p">31:坐墊固定座</p>
        <p type="p">40:升降組件</p>
        <p type="p">41:閥體</p>
        <p type="p">42:閥件</p>
        <p type="p">50:控制組件</p>
        <p type="p">51:纜索</p>
        <p type="p">511:髻部</p>
        <p type="p">52:安裝座</p>
        <p type="p">53:拉柄</p>
        <p type="p">531:勾部</p>
        <p type="p">532:穿槽</p>
        <p type="p">533:凹槽</p>
        <p type="p">54:推柄</p>
        <p type="p">541:凸塊</p>
        <p type="p">542:定位部</p>
        <p type="p">55:旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="636" publication-number="202617091">
    <tif-files tif-type="multi-tif">
      <tif file="113141128.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>X光拍攝輔助系統及其方法</chinese-title>
        <english-title>X-RAY SHOOTING AUXILIARY SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241128B">A61B6/50</main-classification>
        <further-classification edition="201801120241128B">G01N23/046</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝凱生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KAI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TSUNG-TER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許玉龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種X光拍攝輔助系統，包含一呼吸感測裝置以及一處理裝置。呼吸感測裝置用以取得一受試者之一呼吸訊號，呼吸訊號包含複數呼吸週期波形。處理裝置包含一控制器及一傳輸模組。控制器用以擷取並分析此些呼吸週期波形以取得一最大吸氣預測值，並產生一X光拍攝觸發指令。傳輸模組用以將X光拍攝觸發指令傳送至X光裝置，而對受試者進行X光拍攝。藉此，能夠自動觸發X光裝置進行拍攝，並呈現受試者最佳的X光影像品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An X-ray shooting auxiliary system is proposed. The X-ray shooting auxiliary system includes a respiratory measuring device and a processing device. The respiratory measuring device is configured to obtain a respiratory signal of a subject, and the respiratory signal includes a plurality of respiratory cycle waveforms. The processing device includes a controller and a transmitting module. The controller is configured to capture and analyze these respiratory cycle waveforms to obtain a maximum inspiratory prediction value, and generate an X-ray shooting trigger instruction. The transmitting module is configured to transmit the X-ray shooting trigger instruction to an X-ray device to perform X-ray shooting on the subject. Thus, the X-ray shooting auxiliary system of the present disclosure can automatically trigger the X-ray device to take an X-ray image and present the best X-ray image quality of the subject.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:X光拍攝輔助系統</p>
        <p type="p">110:呼吸感測裝置</p>
        <p type="p">111:束帶</p>
        <p type="p">112:壓力感測器</p>
        <p type="p">120:處理裝置</p>
        <p type="p">121:控制器</p>
        <p type="p">122:傳輸模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="637" publication-number="202618101">
    <tif-files tif-type="multi-tif">
      <tif file="113141131.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動糞便檢測器及具有該自動糞便檢測器之馬桶裝置、及適用該自動糞便檢測器之反應盒</chinese-title>
        <english-title>AUTOMATIC EXCREMENT DETECTOR, TOILET DEVICE HAVING THE SAME, AND REACTION BOX SUITABLE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">E03D9/00</main-classification>
        <further-classification edition="200601120241130B">E03D11/00</further-classification>
        <further-classification edition="200601120241130B">E03D11/13</further-classification>
        <further-classification edition="200601120241130B">A47K13/24</further-classification>
        <further-classification edition="200601120241130B">A61B5/00</further-classification>
        <further-classification edition="200601120241130B">G01N1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動糞便檢測器及具有該自動糞便檢測器之馬桶裝置、及適用該自動糞便檢測器之反應盒，該自動糞便檢測器用以裝設於所述馬桶內，包括一收容座、一承接盤與一反應盒；收容座具有一收容空間；承接盤樞設於收容空間上並用以承接人體糞便；反應盒以可拆卸方式組設於收容座一側，反應盒包含一模組座與一切刀組，且模組座上端具有一凹槽，並於凹槽內設有一反應劑包，而模組座下端則具有一試片槽，試片槽內則設有一試片材料；其中，收容座與模組座之間係跨設有一引流結構，且於該引流結構具有一承載端與一滴落端，承載端相對位於凹槽下方處，而滴落端則延伸至收容座的收容空間，且收容座相對於收容空間下方處還設有一回流結構，回流結構具有一集液端並延伸至試片槽上方處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic excrement detector, a toilet device having the same, and a reaction box suitable thereof are provided. The automatic excrement detector is arranged in a toilet and includes an accommodating seat, a carrying plate, and a reaction box. The accommodating seat has an accommodating space. The carrying plate pivots above the accommodating space and is used to carry the excrement. The reaction box is detachably connected to a side of the accommodating seat and includes a module seat and a knife set. The module seat has a mortise thereon, a reagent package arranged in the mortise, a test-piece groove below thereof, and a test material arranged in the test-piece groove. A drainage structure is arranged between the accommodating seat and the module seat and has a carrying end located below the mortise and a drop end extended to the accommodating space. A reflow structure is arranged below the accommodating space and has a collecting end extended above the test-piece groove.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:自動糞便檢測器</p>
        <p type="p">21:承接盤</p>
        <p type="p">210:驅動器</p>
        <p type="p">211:糞便</p>
        <p type="p">22:引流結構</p>
        <p type="p">220:承載端</p>
        <p type="p">221:滴落端</p>
        <p type="p">23:回流結構</p>
        <p type="p">230:集液端</p>
        <p type="p">3:反應盒</p>
        <p type="p">30:模組座</p>
        <p type="p">300:凹槽</p>
        <p type="p">300a:反應劑包</p>
        <p type="p">300b:可通過結構</p>
        <p type="p">301:試片槽</p>
        <p type="p">301a:試片材料</p>
        <p type="p">31:切刀組</p>
        <p type="p">310:切刀</p>
        <p type="p">310a:刀口</p>
        <p type="p">311:推動桿</p>
        <p type="p">32:支架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="638" publication-number="202618247">
    <tif-files tif-type="multi-tif">
      <tif file="113141132.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固碳菌篩選方法</chinese-title>
        <english-title>METHOD FOR SCREENING CARBON-FIXING BACTERIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G01N21/64</main-classification>
        <further-classification edition="200601120250501B">C12N1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE &amp; TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳羽婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂姿霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, ZI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固碳菌篩選方法，用以解決習知固碳菌篩選方法較為耗時的問題。該固碳菌篩選方法包含：提供數個固碳菌候選菌株；以葉綠素螢光測定儀測得各該數個固碳菌候選菌株的電子傳遞速率；及以各該數個固碳菌候選菌株的電子傳遞速率中具有最高數值之固碳菌候選菌株，作為該數個固碳菌候選菌株中固碳能力最佳者。藉此可以達成快速篩選固碳菌之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for screening carbon-fixing bacterium is used to solve the time-consuming problem of the conventional method. The method comprises: providing a plurality of candidate strains of carbon-fixing bacteria; measuring electron transfer rate of each of the plurality of candidate strains of carbon-fixing bacteria by means of a chlorophyll fluorimeter; and selecting a candidate strain of carbon-fixing bacteria with the highest electron transfer rate as the candidate strain of carbon-fixing bacteria with the best carbon fixation ability among the plurality of candidate strains of carbon-fixing bacteria.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:候選菌株提供步驟</p>
        <p type="p">S2:電子傳遞速率測定步驟</p>
        <p type="p">S3:比較步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="639" publication-number="202618658">
    <tif-files tif-type="multi-tif">
      <tif file="113141133.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>專利審查評估系統</chinese-title>
        <english-title>PATENT EXAMINATION EVALUATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250102B">G06Q50/00</main-classification>
        <further-classification edition="201901120250102B">G06F16/30</further-classification>
        <further-classification edition="201901120250102B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣土地銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAND BANK OF TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種專利審查評估系統，其由通訊模組、斷詞模組、關鍵詞擷取模組、關鍵詞庫及機器學習模組構成。通訊模組接收來自使用者裝置的新專利提案的新提案資料與新提案人資料，其中該新提案資料包含技術領域以及專利揭露書等。斷詞模組對專利揭露書進行斷詞處理，並由關鍵詞擷取模組自專利揭露書提取新關鍵詞。關鍵詞庫儲存歷史專利揭露書的歷史關鍵詞。機器學習模組根據新提案資料與歷史提案資料，利用專利審查評估模型分析新關鍵詞與歷史關鍵詞的匹配程度，以及新提案人資料，從而預測新專利提案的專利獲准機率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A patent examination evaluation system is provided. The system comprises a communication module, a word segmentation module, a keyword extraction module, a keyword database, and a machine learning module.        &lt;br/&gt;The communication module receives new proposal data and proposer information from a user device, where the proposal data includes a technical field and a patent disclosure. The word segmentation module performs word segmentation on the patent disclosure, and the keyword extraction module extracts multiple new keywords from the patent disclosure. The keyword database stores historical keywords from past patent disclosures. The machine learning module analyzes the correlation between the new and historical keywords using a patent examination evaluation model, based on the new proposal data and historical proposal data, and the proposer information to predict the approval probability of the new patent proposal.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:專利審查評估系統</p>
        <p type="p">102:通訊模組</p>
        <p type="p">104:斷詞模組</p>
        <p type="p">106:關鍵詞擷取模組</p>
        <p type="p">107:關鍵詞庫</p>
        <p type="p">108:機器學習模組</p>
        <p type="p">109:評比模組</p>
        <p type="p">110:使用者裝置</p>
        <p type="p">120:人事資料庫</p>
        <p type="p">130:專利提案資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="640" publication-number="202618653">
    <tif-files tif-type="multi-tif">
      <tif file="113141138.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141138</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>婉拒客戶資料分析系統及其方法</chinese-title>
        <english-title>DECLINED CUSTOMER DATA ANALYSIS SYSTEM AND METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q40/03</main-classification>
        <further-classification edition="202301120250203B">G06Q40/02</further-classification>
        <further-classification edition="201901120250203B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張湘芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種婉拒客戶資料分析系統，包括輸入輸出裝置及處理器。處理器包括婉拒資料匯入模組及婉拒資料訓練模組。婉拒資料匯入模組自歷史婉拒資料庫中匯入歷史婉拒資料。婉拒資料訓練模組透過歷史婉拒資料及人工智慧技術來訓練並產生婉拒客戶評估模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of this disclosure provide a declined customer data analysis system, including an input/output device and a processor. The processor includes a declined data import module and a declined data training module. The declined data import module imports a plurality of historical declined data from a historical declined database. The declined data training module uses the historical decline data and an artificial intelligence technology to train and generate a declined customer evaluation model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:婉拒客戶資料分析系統</p>
        <p type="p">102:輸入輸出裝置</p>
        <p type="p">104:處理器</p>
        <p type="p">110:歷史婉拒資料庫</p>
        <p type="p">120:金融帳務資料庫</p>
        <p type="p">130:婉拒資料匯入模組</p>
        <p type="p">140:婉拒資料清理模組</p>
        <p type="p">150:婉拒資料訓練模組</p>
        <p type="p">152:婉拒特徵提取模組</p>
        <p type="p">154:婉拒特徵分析模組</p>
        <p type="p">156:婉拒模型驗證模組</p>
        <p type="p">158:婉拒客戶評估模型</p>
        <p type="p">160:評估報告產生模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="641" publication-number="202618338">
    <tif-files tif-type="multi-tif">
      <tif file="113141139.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體透鏡、透鏡裝置及液體透鏡的製造方法</chinese-title>
        <english-title>LIQUID LENS, LENTICULAR DEVICE AND METHOD OF MANUFACTURING THE LIQUID LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">G02B3/12</main-classification>
        <further-classification edition="200601120241129B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子(秦皇島)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液體透鏡、透鏡裝置及液體透鏡的製造方法。液體透鏡包括兩個透明線路板、環形線路結構、透光液體和幫浦。兩個透明線路板彼此相對而設置，其中兩個透明線路板每一者具有內表面與相對內表面的外表面，而內表面位於兩個透明線路板的外表面之間。環形線路結構連接並圍繞兩個透明線路板，其中兩個透明線路板的內表面之間形成容置空間。透光液體具有大於1的折射率，並填滿容置空間，其中透光液體在容置空間內的壓力用於使兩個透明線路板形變，以使外表面形成曲面。連接件連接多個液體透鏡成透鏡裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid lens, a lenticular device and a method of manufacturing of the liquid lens are provided. The liquid lens includes two transparent circuit boards, a circular circuit structure, a light-transmitting liquid and a pump. The two transparent circuit boards are disposed opposite each other, wherein each of them has an inner surface and an outer surface opposite the inner surface, and the inner surface is disposed between the outer surfaces of the two transparent circuit boards. The circular circuit structure is connecting and surrounding two transparent circuit boards, wherein between the inner surfaces form a holding space. The light-transmitting liquid has a refractive index greater than 1 and fills the holding space, where the pressure of the light-transmitting liquid in the holding space is used to deform the two transparent circuit boards and to let the outer surfaces form curved surfaces. A connection connects multiple liquid lenses to form the lenticular device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:液體透鏡</p>
        <p type="p">110:透明線路板</p>
        <p type="p">111:介電層</p>
        <p type="p">112:內表面</p>
        <p type="p">114:外表面</p>
        <p type="p">116:線路層</p>
        <p type="p">120:環形線路結構</p>
        <p type="p">125:注入口</p>
        <p type="p">130:容置空間</p>
        <p type="p">140:透光液體</p>
        <p type="p">150:幫浦</p>
        <p type="p">160:連接件</p>
        <p type="p">441、442:絕緣層</p>
        <p type="p">443:覆蓋層</p>
        <p type="p">A-A”:剖面線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="642" publication-number="202617188">
    <tif-files tif-type="multi-tif">
      <tif file="113141143.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於核酸之奈米材料與其薄膜及其製備方法與用途</chinese-title>
        <english-title>NUCLEIC AICD-BASED NANOMATERIAL AND FILM THEREOF AND MANUFACTURING METHOD AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241212B">A61K47/69</main-classification>
        <further-classification edition="201701120241212B">A61K47/56</further-classification>
        <further-classification edition="201101120241212B">B82Y5/00</further-classification>
        <further-classification edition="200601120241212B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺東大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAITUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺東市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宇楓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-FON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾方諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, FANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基於核酸之奈米材料之製備方法，藉由將核酸上之經氧化的醛基與含有一級胺之帶有苯環的生化分子藉由乳化作用，或將核酸上之帶有一級胺之含氮鹼基與含有醛基之帶有苯環的化學物質藉由乳化作用，或將核酸上之經氧化的醛基與含有一級胺之帶有苯環的生化分子混合，透過共溶劑使醛基與一級胺之間透過希夫反應進行交聯，以得到具有苯環及脂肪鏈之疏水性基團的基於核酸之奈米材料。此外，基於核酸之奈米材料進一步與聚乙烯醇進行酯化反應，以製得基於核酸之奈米材料之薄膜。基於核酸之奈米材料及其薄膜用於抗菌及作為藥物載體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nucleic acid-based nanomaterial and film thereof and a manufacturing method and use thereof are provided. The manufacturing method is performed by emulsifying an oxidized aldehyde group of the nucleic acid with a primary amine on a benzene ring of biochemical molecule, or emulsifying a primary amine on a nitrogen-containing base of a nucleic acid with an aldehyde group on a benzene ring of the chemical substance, or mixing an oxidized aldehyde group of the nucleic acid, a biochemical molecule with a benzene ring containing a primary amine and a co-solvent to allow the aldehyde group and the primary amine to be cross-linked through a Schiff reaction. In addition, the nucleic acid-based nanomaterial and polyvinyl alcohol are further subjected to an esterification reaction to prepare the nucleic acid-based nanomaterial film. The nucleic acid-based nanomaterial and the film thereof are used in antimicrobial application and as a drug carrier.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="643" publication-number="202618630">
    <tif-files tif-type="multi-tif">
      <tif file="113141147.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>會議資料整合平台及會議資料整合方法</chinese-title>
        <english-title>CONFERENCE DATA INTEGRATION PLATFORM AND CONFERENCE DATA INTEGRATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241216B">G06Q10/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭伊婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種會議資料整合平台包含資料庫、管理伺服器以及整合伺服器。管理伺服器用以管理複數個組職單位伺服器各者之操作權限。整合伺服器分別耦接於資料庫及管理伺服器。會議資料整合平台執行以下運作：由整合伺服器提供使用者介面給複數個組職單位伺服器；由複數個組職單位伺服器各者基於操作權限，以透過使用者介面編輯複數個歷史會議紀錄各者；以及由整合伺服器基於編輯後的複數個歷史會議紀錄，產生會議資料檔；以及由整合伺服器傳輸會議資料檔至資料庫，以進行儲存。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A conference data integration platform includes a database, a management server and an integration server. The management server is configured to manage operating permissions of each of servers of multiple organizational units. The integration server is coupled to the database and the management server respectively. The meeting data integration platform performs the following operations: the integration server provides a user interface to servers of multiple organizational units. Each of servers of multiple organizational units edits a plurality of historical meeting records through the user interface according to the operating permissions. The integration server generates meeting data files according to the edited historical meeting records. The integration server transmits the meeting data files to the database for storage</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:會議資料整合平台</p>
        <p type="p">110:資料庫</p>
        <p type="p">120:整合伺服器</p>
        <p type="p">130:管理伺服器</p>
        <p type="p">140,150:組職單位伺服器</p>
        <p type="p">121,131,141,151:記憶體</p>
        <p type="p">122,132,142,152:處理器</p>
        <p type="p">700:公文系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="644" publication-number="202618675">
    <tif-files tif-type="multi-tif">
      <tif file="113141148.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數理手寫答案卷之解題能力評估方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR ASSESSING ANSWERING ABILITY FROM A HANDWRITTEN ANSWER SHEET ABOUT MATHEMATICS AND PHYSICS TEST QUESTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241202B">G06Q50/20</main-classification>
        <further-classification edition="202201120241202B">G06V30/10</further-classification>
        <further-classification edition="202201120241202B">G06V10/82</further-classification>
        <further-classification edition="202201120241202B">G06V30/262</further-classification>
        <further-classification edition="200601120241202B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元數能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAMATH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳策勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERN, TSEH-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱貿靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MAO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種數理手寫答案卷之解題能力評估方法及系統，係主要於取得學員的數理手寫答案卷中，辨識各題目作答內容的多條第一運算式及其相對作答時間順序與第一答案，配合預先儲存對應題目的多種詳解，且各種詳解包含多條第二運算式及其作答順序與至少一第二答案；因此，當所辨識出多條第一運算式及其時間順序匹配其中一種詳解過程的多條第二運算式及其作答順序，則給予一該題目的答題邏輯評分，又當辨識出該題目的第一答案實質符合該至少一第二答案，給予該題目的答案評分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method and system for assessing answering ability from a handwritten answer sheet about mathematics and physics test questions. The method has steps of: obtaining a student's a handwritten answer sheet about mathematics and physics test questions; identifying multiple first operational expressions of each question's answer content, a chronological order thereof and a first answer; previously storing multiple detailed explanations of the mathematics and physics test questions, wherein each detailed explanation has multiple second operational expressions, a chronological order thereof and a second answer; and scoring this test question if the first operational expressions of one test question and the chronological order thereof matches the second operational expressions of the same test question and the chronological order thereof of one of detailed explanations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:答案資料庫</p>
        <p type="p">20:手寫答案讀取介面單元</p>
        <p type="p">30:電腦設備</p>
        <p type="p">40:網路伺服器</p>
        <p type="p">41:大型語言模組</p>
        <p type="p">50:數理手寫答案卷</p>
        <p type="p">51:實體紙本答案卷</p>
        <p type="p">52:電子答案卷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="645" publication-number="202618651">
    <tif-files tif-type="multi-tif">
      <tif file="113141149.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>週期轉帳到期提醒暨續期約定管理系統及其方法</chinese-title>
        <english-title>PERIODIC TRANSFER EXPIRATION REMINDER AND RENEWAL AGREEMENT MANAGEMENT SYSTEM AND METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q40/02</main-classification>
        <further-classification edition="201201120250203B">G06Q40/06</further-classification>
        <further-classification edition="201301120250203B">G06F21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭怡婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHENG, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種週期轉帳到期提醒暨續期約定管理系統，包括輸入輸出裝置及處理器。處理器包括約定資料訂閱模組、約定資料紀錄模組、約定資料匯入模組及週期轉帳提醒模組。約定資料訂閱模組提供給用戶透過輸入輸出裝置申請週期轉帳通知服務。約定資料紀錄模組產生用戶訂閱紀錄。約定資料匯入模組匯入用戶的用戶訂閱紀錄。當用戶訂閱紀錄達到提醒期間時，週期轉帳提醒模組發出系統提醒訊息並傳輸至輸入輸出裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of this disclosure provide a periodic transfer expiration reminder and renewal agreement management system, including an input/output device and a processor. The processor includes an agreement data subscription module, an agreement data recording module, an agreement data import module and a periodic transfer reminder module. The agreement data subscription module provides an user with applying for a periodic transfer notification service through the input/output device. The agreement data recording module generates an user subscription record. The agreement data import module imports the user subscription record of the user. When the user subscription record reaches a reminder period, the periodic transfer reminder module sends a system reminder message and transmits the system reminder message to the input/output device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:週期轉帳到期提醒暨續期約定管理系統</p>
        <p type="p">102:輸入輸出裝置</p>
        <p type="p">104:處理器</p>
        <p type="p">110:金融帳務系統</p>
        <p type="p">112:金融帳務資料庫</p>
        <p type="p">120:金融身分認證系統</p>
        <p type="p">122:金融認證開通模組</p>
        <p type="p">124:密鑰創建模組</p>
        <p type="p">130:網路銀行登入模組</p>
        <p type="p">140:約定資料綁定模組</p>
        <p type="p">150:約定資料訂閱模組</p>
        <p type="p">160:約定資料紀錄模組</p>
        <p type="p">170:約定資料匯入模組</p>
        <p type="p">180:週期轉帳提醒模組</p>
        <p type="p">190:週期轉帳續約模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="646" publication-number="202617584">
    <tif-files tif-type="multi-tif">
      <tif file="113141150.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617584</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>致動裝置</chinese-title>
        <english-title>ACTUATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">B81B7/02</main-classification>
        <further-classification edition="200601120250102B">B81B5/00</further-classification>
        <further-classification edition="200601120250102B">G02B26/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中光電智能感測股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC MEMS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林弘育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種致動裝置，包括微面鏡以及兩個翼狀致動器。微面鏡可沿著軸線擺動。兩個翼狀致動器圍繞微面鏡，且與微面鏡分離設置；每一個翼狀致動器包括彼此分離設置的兩個致動單元、支撐部以及扭轉部，兩個致動單元分別設置於軸線的兩側，且兩個致動單元之間具有間隔。至少一部分的支撐部設置於間隔，並連接兩個致動單元。至少一部分的扭轉部設置於間隔，並連接支撐部以及微面鏡。四個致動單元分別接收驅動訊號以帶動微面鏡擺動。透過前述配置，提供純扭矩給微面鏡，且避免非線性響應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an actuating device including a micromirror and two wing-shaped actuators. The micromirror may swing along an axial line. The two wing-shaped actuators surround the micromirror, and the two wing-shaped actuators and the micromirror are separate; each of the two wing-shaped actuators includes two actuating units separate from each other, a supporting part and a torsional part, the two actuating units are respectively disposed on two sides of the axial line, and there is an interval between the two actuating units. At least one part of the supporting part is disposed on the interval and connects to the two actuating units. At least one part of the torsional part is disposed on the interval and connects to the supporting part and the micromirror. The four actuating units respectively receives driving signals to drive the micromirror to swing. By the aforementioned configuration, pure torsion is provided for the micromirror, and a non-linear effect is avoided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:致動裝置</p>
        <p type="p">10:微面鏡</p>
        <p type="p">20A,20B:翼狀致動器</p>
        <p type="p">21A:第一致動單元</p>
        <p type="p">22A:第二致動單元</p>
        <p type="p">21B:第三致動單元</p>
        <p type="p">22B:第四致動單元</p>
        <p type="p">30A,30B:支撐部</p>
        <p type="p">40A,40B:扭轉部</p>
        <p type="p">ax1:軸線</p>
        <p type="p">F1:框體</p>
        <p type="p">I1,I2,I3,I4:間隔</p>
        <p type="p">O1:開口</p>
        <p type="p">S1:第一側邊</p>
        <p type="p">S2:第二側邊</p>
        <p type="p">S3:第三側邊</p>
        <p type="p">S4:第四側邊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="647" publication-number="202617102">
    <tif-files tif-type="multi-tif">
      <tif file="113141152.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>骨科手術之骨釘的目視量測工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241130B">A61B34/20</main-classification>
        <further-classification edition="200601120241130B">A61B17/88</further-classification>
        <further-classification edition="200601120241130B">A61B17/92</further-classification>
        <further-classification edition="201601120241130B">A61B90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山醫學大學附設醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG SHAN MEDICAL UNIVERSITY HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聖傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙元寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係包括一頂板、一底板、複數支撐桿及二骨板固定組件。頂板具有一骨釘貫穿孔、一深度探針貫穿孔及二骨板固定孔。複數支撐桿樞設於頂板與底板之間，使頂板與底板互呈平行，透過設於其中之一支撐桿上之一角度調整固定部，使頂板與底板間之相對距離可調並可固定。二骨板固定組件穿過二骨板固定孔以及骨板上之孔洞，將骨板固定於頂板。骨釘貫穿孔與深度探針貫穿孔分別供一骨釘及一深度探針，穿過並從頂板下方延伸出，而可目視觀測骨釘之一骨釘長度，及深度探針之一探針長度。兼具可折平或立起便於收納或使用，及可目視量測骨釘長度是否為所須長度減少誤差等優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:頂板</p>
        <p type="p">10A:上表面</p>
        <p type="p">10B:下表面</p>
        <p type="p">11:骨釘貫穿孔</p>
        <p type="p">12:深度探針貫穿孔</p>
        <p type="p">13:骨板固定孔</p>
        <p type="p">14:第一樞接部</p>
        <p type="p">15:固定量尺部</p>
        <p type="p">20:底板</p>
        <p type="p">21:角度調整固定部</p>
        <p type="p">22:第二樞接部</p>
        <p type="p">30:支撐桿</p>
        <p type="p">40:骨板固定組件</p>
        <p type="p">41:第一固定件</p>
        <p type="p">42:第二固定件</p>
        <p type="p">91:骨板</p>
        <p type="p">911:孔洞</p>
        <p type="p">92:骨釘</p>
        <p type="p">93:深度探針</p>
        <p type="p">M1:滑槽</p>
        <p type="p">M3:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="648" publication-number="202619442">
    <tif-files tif-type="multi-tif">
      <tif file="113141153.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>掀蓋式電子裝置機殼</chinese-title>
        <english-title>CLAMSHELL ELECTRONIC DEVICE CASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">H05K5/02</main-classification>
        <further-classification edition="200601120250305B">H05K5/03</further-classification>
        <further-classification edition="200601120250305B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳彥勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YEN HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡郁惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱昱維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YU WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖晏梓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YEN TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚宏達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, HONG DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭健宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIENHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂俊逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUNYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁迪翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, TI SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程希哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSI CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李維國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種掀蓋式電子裝置機殼，包括蓋體、主機殼體以及托板。主機殼體與蓋體樞接，並且包括第一部分與第二部分。第一部分與第二部分相互匹配且可分離地相互連接。托板位於主機殼體內。其中，第一部分對第二部分的連接狀態響應於托板與第一部分之間的相對位移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A clamshell electronic device case includes a cover body, a host casing and a supporting plate. The host casing is pivotally connected to the cover body and includes a first part and a second part. The first part and a second part are matched and detachably connected to each other. The supporting plate is located inside the host casing. The connection state of the first part to the second part is in response to the relative displacement of the supporting plate and the first part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:掀蓋式電子裝置機殼</p>
        <p type="p">11:蓋體</p>
        <p type="p">13:主機殼體</p>
        <p type="p">13A:第一部分</p>
        <p type="p">13B:第二部分</p>
        <p type="p">15:托板</p>
        <p type="p">16:散熱模組</p>
        <p type="p">19:鍵盤模組</p>
        <p type="p">191:鍵帽</p>
        <p type="p">23A:主殼體</p>
        <p type="p">23B:後蓋</p>
        <p type="p">23C:伸縮段</p>
        <p type="p">231:上蓋</p>
        <p type="p">233:下蓋</p>
        <p type="p">A11:鍵盤區</p>
        <p type="p">Ds:移動方向</p>
        <p type="p">F11:正外表面</p>
        <p type="p">S11,S21:連接側邊</p>
        <p type="p">S13:自由側邊</p>
        <p type="p">V11:氣孔</p>
        <p type="p">αr:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="649" publication-number="202619424">
    <tif-files tif-type="multi-tif">
      <tif file="113141154.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板連接結構和計算設備</chinese-title>
        <english-title>CIRCUIT BOARD CONNECTION STRUCTURE AND COMPUTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250221B">H05K1/14</main-classification>
        <further-classification edition="200601120250221B">H05K7/10</further-classification>
        <further-classification edition="201101120250221B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種電路板連接結構，包括主電路板、主晶片和第一子電路板。主電路板包括相對的上表面和下表面，上表面和下表面上分別設置有插槽。主晶片和第一子電路板分別設置在上表面和下表面上。第一表面設置有連接器，第二表面設置有連接器插頭，連接器插頭設置在插槽中，以使第一子電路板可插拔地設置在主電路板上。本申請還提供一種包括上述電路板連接結構的計算設備。藉由將主晶片和連接器設置在主電路板的相對兩側，有效縮短了主晶片和連接器之間信號傳遞路徑，縮短光路或電路、減少訊號延遲和損耗，從而提高資料傳輸速度和可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a circuit board connection structure, including a main circuit board, a main chip, and a first sub circuit board. The main circuit board includes an upper surface and a lower surface opposite to each other, with slots defined in each surface. The main chip and the first sub-circuit board are arranged on the upper and lower surfaces, respectively. The first surface is provided with a connector, and the second surface is provided with a connector plug, which is set in a slot to enable the first sub-circuit board to be insertable and unpluggable on the main circuit board. The present application also provides a computing device including the circuit board connection structure. By placing the main chip and the connector on opposite sides of the main circuit board, signal transmission path between the main chip and connector is effectively shortened, which shortens optical path or circuit, reduce signal delay and loss, and thus improve data transmission speed and reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計算設備</p>
        <p type="p">10:主電路板</p>
        <p type="p">30:主晶片</p>
        <p type="p">50:連接器</p>
        <p type="p">11:上表面</p>
        <p type="p">12:下表面</p>
        <p type="p">13:插槽</p>
        <p type="p">51:第一子電路板</p>
        <p type="p">511:第一表面</p>
        <p type="p">512:第二表面</p>
        <p type="p">513:連接器插頭</p>
        <p type="p">31:第二子電路板</p>
        <p type="p">20:殼體</p>
        <p type="p">23:前蓋</p>
        <p type="p">21:框體</p>
        <p type="p">211:底蓋</p>
        <p type="p">213:側板</p>
        <p type="p">40:輸入/輸出埠</p>
        <p type="p">60:線纜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="650" publication-number="202617086">
    <tif-files tif-type="multi-tif">
      <tif file="113141155.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數據分析方法、裝置、電子設備及存儲介質</chinese-title>
        <english-title>DATA ANALYSIS METHOD, EQUIPMENT, ELECTRONIC DEVICE, AND STORAGE MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250203B">A61B5/24</main-classification>
        <further-classification edition="202101120250203B">A61B5/346</further-classification>
        <further-classification edition="202101120250203B">A61B5/349</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　振鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUOK, CHAN-PANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳霆軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種數據分析方法、裝置、電子設備及存儲介質，數據分析方法包括：確定待檢測信號中的第一特徵波形，根據第一特徵波形確定檢測窗口；根據檢測窗口確定待檢測信號中的待識別數據；基於待識別數據確定樣本數據；輸入樣本數據至預先訓練的識別模型，得到第二特徵波形的起始點和終止點；其中，識別模型用於識別待識別數據中的多種第二特徵波形；根據待檢測信號中每兩個信號點之間的斜率對所述第二特徵波形的起始點和終止點進行更新，得到更新後的起始點和終止點。本申請能夠提升特徵波形分析的準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a data analysis method, equipment, an electronic device, and a storage media. The method includes identifying a first characteristic waveform in a signal to be detected, determining a detection window based on the first characteristic waveform; determining data to be identified in the signal to be detected according to the detection window; determining sample data based on the data to be identified; inputting the sample data into a pre-trained recognition model, obtaining a start point and an end point of a second characteristic waveform, the recognition model being used to identify a plurality of types of the second characteristic waveforms in the data to be identified; updating the start point and the end point of the second characteristic waveform based on a slope between each two signal points in the signal to be detected, obtaining an updated start point and an updated end point. The present application can increase the accuracy of characteristic waveform analysis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S20~S22:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="651" publication-number="202617016">
    <tif-files tif-type="multi-tif">
      <tif file="113141156.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水循環鍋蓋及其使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A47J36/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳苙榞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳苙榞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟欣達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水循環鍋蓋及其使用方法，主要包括︰一蓋體、一手柄及一底板，其中：一蓋體，用於盛裝水；一手柄，該手柄對稱地設置在蓋體兩側；一底板，該底板密閉連接在該蓋體的底部；其特徵在於，通過蒸氣與該水循環鍋蓋接觸後冷凝成水，並形成水滴落回一鍋內的水循環過程，以減少該鍋內蒸氣的外洩，並提供水循環鍋蓋的使用方法進行以下步驟 : S1 將該蓋體設置於該鍋內上側；S2 將透過一冷水注入孔，該冷水注入孔設置在該蓋體的一側，用於注入冷水；S3 將透過一排水孔，該排水孔設置在該蓋體的另一側，用於排出多餘的水；S4 將通過蒸氣與該水循環鍋蓋接觸後冷凝成水，並形成水滴落回一鍋內的水循環過程，以減少該鍋內蒸氣的外洩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:水循環鍋蓋</p>
        <p type="p">10:蓋體</p>
        <p type="p">20:手柄</p>
        <p type="p">30:冷水注入孔</p>
        <p type="p">40:排水孔</p>
        <p type="p">53:底板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="652" publication-number="202617261">
    <tif-files tif-type="multi-tif">
      <tif file="113141163.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造異丁酸的設備及異丁酸的製造方法</chinese-title>
        <english-title>APPARATUS FOR PRODUCING ISOBUTANOIC ACID AND METHOD FOR PRODUCING ISOBUTANOIC ACID</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">B01J19/00</main-classification>
        <further-classification edition="200601120241129B">B01J19/18</further-classification>
        <further-classification edition="200601120241129B">C07C51/235</further-classification>
        <further-classification edition="200601120241129B">C07C53/124</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仲裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奕成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁梓桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, TZU-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種用於製造異丁酸的設備及異丁酸的製造方法。用於製造異丁酸的設備包括反應槽、進氣管、出氣管以及攪拌器。進氣管與反應槽連接，用以將工作氣體引入所述反應槽中。出氣管與反應槽連接，用以將反應後氣體引導出所述反應槽。攪拌器設置於所述反應槽中，並包括中空軸及複數個葉片。中空軸具有相對設置的第一端及第二端，第一端設置有抽氣孔並露出於反應槽的液面上，第二端設置有一排氣孔並浸沒於液面中。出氣管相對於反應槽的另一端與冷凝器連接，以將反應氣體冷凝得到異丁醛及尾氣，異丁醛可透過泵浦輸送回反應槽繼續反應，以增加轉化率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an apparatus for producing isobutanoic acid and method for producing isobutanoic acid. The apparatus for producing isobutanoic acid includes reaction tanks, air inlet pipes, air outlet pipes and stirrers. The air inlet pipe is connected to the reaction tank to introduce working gas into the reaction tank. The gas outlet pipe is connected to the reaction tank and used to guide the reacted gas out of the reaction tank. The stirrer is arranged in the reaction tank and includes a hollow shaft and a plurality of blades. The hollow shaft has a first end and a second end arranged oppositely. The first end is provided with an exhaust hole and is exposed on the liquid surface of the reaction tank. The second end is provided with an exhaust hole and is immersed in the liquid surface. The outlet pipe is connected to the condenser at the other end of the reaction tank to condense the reaction gas to obtain isobutyraldehyde and tail gas, and the isobutyraldehyde can be pumped back to the reaction tank to continue the reaction to increase conversion rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用於製造異丁酸的設備</p>
        <p type="p">10:反應槽</p>
        <p type="p">11:反應液</p>
        <p type="p">12:工作氣體</p>
        <p type="p">20:進氣管</p>
        <p type="p">21:第一控制閥</p>
        <p type="p">30:出氣管</p>
        <p type="p">31:第二控制閥</p>
        <p type="p">32:冷凝器</p>
        <p type="p">321:第一管</p>
        <p type="p">322:第二管</p>
        <p type="p">33:濃度感測器</p>
        <p type="p">34:壓力計</p>
        <p type="p">40:攪拌器</p>
        <p type="p">41:中空軸</p>
        <p type="p">42:葉片</p>
        <p type="p">43:第一端</p>
        <p type="p">431:抽氣孔</p>
        <p type="p">44:第二端</p>
        <p type="p">441:排氣孔</p>
        <p type="p">50:異丁醛入料管</p>
        <p type="p">51:第三控制閥</p>
        <p type="p">52:第四控制閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="653" publication-number="202619587">
    <tif-files tif-type="multi-tif">
      <tif file="113141164.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141164</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無空腔型感測封裝結構及其製造方法</chinese-title>
        <english-title>SENSOR PACKAGE STRUCTURE WITHOUT CAVITY THEREIN AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F55/00</main-classification>
        <further-classification edition="202501120250102B">H10F77/50</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
        <further-classification edition="200601120250102B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯怡伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, I-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬克宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, KE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉泯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種無空腔型感測封裝結構及其製造方法。所述無空腔型感測封裝結構包含一基板、設置於所述基板的一感測模組、及形成於所述感測模組的一不透光封裝體。所述感測模組包含安裝於所述基板的一感測晶片、黏接於所述感測晶片的一第一透明接著層、及黏固於所述第一透明接著層的一第一玻璃。所述感測晶片電性耦接於所述基板，所述第一透明接著層覆蓋所述感測晶片的感測區域。所述感測模組埋置於所述不透光封裝體之內，而所述第一玻璃的至少部分外表面裸露於所述不透光封裝體之外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a sensor package structure without cavity therein and a manufacturing method thereof. The sensor package structure includes a substrate, a sensing module disposed on the substrate, and an opaque encapsulant that is formed on the sensing module. The sensing module includes a sensor chip mounted on the substrate, a first transparent adhesive layer adhered onto the sensor chip, and a first glass that is adhered to the first transparent adhesive layer. The sensor chip is electrically coupled to the substrate, and the first transparent adhesive layer covers a sensing region of the sensor chip. The sensing module is embedded in the opaque encapsulant, and an outer surface of the first glass is at least partially exposed from the opaque encapsulant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無空腔型感測封裝結構</p>
        <p type="p">1:基板</p>
        <p type="p">11:上板面</p>
        <p type="p">111:第一固晶區</p>
        <p type="p">112:第二固晶區</p>
        <p type="p">113:第一接合墊</p>
        <p type="p">114:第二接合墊</p>
        <p type="p">12:下板面</p>
        <p type="p">2:感測模組</p>
        <p type="p">21:感測晶片</p>
        <p type="p">211:感測區域</p>
        <p type="p">212:第一連接墊</p>
        <p type="p">22:第一透明接著層</p>
        <p type="p">23:第一玻璃</p>
        <p type="p">231:外表面</p>
        <p type="p">232:內表面</p>
        <p type="p">24:第一金屬線</p>
        <p type="p">3:發光模組</p>
        <p type="p">31:發光晶片</p>
        <p type="p">311:發光面</p>
        <p type="p">312:第二連接墊</p>
        <p type="p">32:第二透明接著層</p>
        <p type="p">33:第二玻璃</p>
        <p type="p">331:外表面</p>
        <p type="p">34:第二金屬線</p>
        <p type="p">4:不透光封裝體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="654" publication-number="202619517">
    <tif-files tif-type="multi-tif">
      <tif file="113141166.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置的製造方法</chinese-title>
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/01</main-classification>
        <further-classification edition="200601120250102B">H01L21/56</further-classification>
        <further-classification edition="200601120250102B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種半導體裝置的製造方法，包含：提供基板，其中所述基板包含井區，以及所述井區包含頂摻雜區；在所述井區上沉積第一層間介電層；在所述第一層間介電層中形成至少一接觸通孔；在所述第一層間介電層中形成第一下金屬層；在所述第一層間介電層上沉積第二層間介電層；在所述第二層間介電層中形成至少一導孔；以及在所述第二層間介電層上形成第一上金屬層，其中：所述第二層間介電層的第二厚度不大於所述第一層間介電層的第一厚度，所述第一下金屬層透過所述至少一導孔中的第一導孔電性連接所述第一上金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of manufacturing a semiconductor device, comprising: providing a substrate, wherein the substrate comprises a well region, and the well region comprises a top doping region; depositing a first interlayer dielectric (ILD) layer on the well region; forming at least one contact in the first ILD layer; forming a first lower metal layer in the first ILD layer; depositing a second ILD layer on the first ILD layer; forming at least one via in the second ILD layer; and forming a first upper metal layer on the second ILD layer, wherein: a second thickness of the second ILD layer is not greater than a first thickness of the first ILD layer, the first lower metal layer is electrically connected to the first upper metal layer through a first via of the at least one via.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S302、S304、S306、S308、S310、S312、S314、S316、S318:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="655" publication-number="202618519">
    <tif-files tif-type="multi-tif">
      <tif file="113141168.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141168</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>延展實境裝置及其控制方法</chinese-title>
        <english-title>EXTENDED REALITY DEVICE AND CONTROL METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F3/01</main-classification>
        <further-classification edition="201101120250203B">G06T19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉元鎧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YUAN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫芃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種延展實境裝置，包含一手勢偵測模組、一眼球追蹤模組以及一處理單元。其中，處理單元，電性耦接於手勢偵測模組以及眼球追蹤模組，並用以因應一第一操作，呈現一快捷視窗，此快捷視窗具有複數選項；因應一第二操作，在複數選項中進行選擇；以及因應一第三操作，執行選擇之選項所對應之功能。其中，第一操作、第二操作以及第三操作中之至少其中之二為手勢操作。本案並提供此延展實境裝置之控制方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless network channel switching method adapted to a terminal device is provided. The terminal device is used to communicated with a router, which provides a connecting environment with a plurality of connecting channels. The wireless network channel switching method comprises the following steps. Firstly, a plurality of wireless network parameters of the connecting environment within a predetermined period of time is collected to access long-term wireless network parameter data of the connecting environment, wherein the wireless network parameters at least comprise channel utilization, station count, and channel bandwidth. Then, a current connecting channel for the terminal device in the connecting environment is accessed. Then, channel switching information is generated based on the long-term wireless network parameter data and the current connecting channel. A terminal device applicable to the wireless network channel switching method is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S220,S240,S260,S280:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="656" publication-number="202619451">
    <tif-files tif-type="multi-tif">
      <tif file="113141169.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇框架</chinese-title>
        <english-title>FAN FRAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">H05K7/18</main-classification>
        <further-classification edition="200601120241118B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾博恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, BOHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俞帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇框架包含一框架本體以及複數個防回風組件。框架本體包含一底板以及一頂板，底板具有複數個底部組接結構。每個防回風組件包含一擋板設置支架、一擋板止擋支架、一擋板本體以及一扭簧。擋板設置支架與擋板止擋支架分別固接於底部組接結構與頂板，且擋板設置支架與擋板止擋支架係沿一組裝方向依序排列。擋板本體是可轉動地設置於擋板設置支架鄰近於擋板止擋支架之一側。扭簧設置於擋板本體與擋板設置支架之樞接處，用以將擋板本體彈性推抵至一擋風位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan frame includes a frame body and a plurality of anti backward air flow assemblies. The frame body includes a base plate and a top plate, where the base plate has a plurality of bottom connection structures. Each anti backward air flow assembly includes of a baffle mounting bracket, a baffle stopper bracket, a baffle body, and a torsion spring. The baffle mounting bracket and the baffle stopper bracket are fixedly connected to the bottom connection structure and the top plate, respectively, and are sequentially arranged along an assembly direction. The baffle body is rotatably positioned on the baffle mounting bracket adjacent to one side of the baffle stopper bracket. The torsion spring is disposed on a pivot point between the baffle body and the baffle mounting bracket, elastically urging the baffle body to a air flow blocking position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:底板</p>
        <p type="p">113:底部組接結構</p>
        <p type="p">12,13:側板</p>
        <p type="p">2,2a,2b,2c:防回風擋板組件</p>
        <p type="p">21a:擋板設置支架</p>
        <p type="p">211a:頂部組接結構</p>
        <p type="p">22a:擋板止擋支架</p>
        <p type="p">221a:頂部組接結構</p>
        <p type="p">222a:避讓凹槽</p>
        <p type="p">23a:擋板本體</p>
        <p type="p">24a:扭簧</p>
        <p type="p">200:伺服器機殼</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="657" publication-number="202618187">
    <tif-files tif-type="multi-tif">
      <tif file="113141171.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過濾器模組及其組裝方法</chinese-title>
        <english-title>FILTER MODULE AND ASSEMBLY METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F24F13/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺祥企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE SIANG ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪勝輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, SHENG HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種過濾器模組，其包括：一殼體，包括一第一側板及相對第一側板之一第二側板；複數個定位件，設置於第一側板之一內表面及第二側板之一內表面上，定位件分別包括二個傾斜段，二個傾斜段分別沿一第一參考表面與一第二參考表面延伸，第一參考表面與第二參考表面相交於一交點，交點係相鄰於第一側板之一上側緣或第二側板之一上側緣；複數個過濾器單元，可分離地設置於殼體內，其中過濾器單元之每一者係抵靠定位件之傾斜段；以及一固定組件，可分離地接合至殼體並抵靠過濾器單元，以固定過濾器單元於殼體內。本揭露亦提供上述過濾器模組之組裝方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The instant disclosure provides a filter module, which includes a housing comprising a first side plate and a second side plate opposite the first side plate; a plurality of positioning members disposed on an inner surface of the first side plate and an inner surface of the second side plate, wherein the positioning members respectively include two inclined sections, extending along a first reference plane and a second reference plane, the first reference plane and the second reference plane intersect at an intersection point, the intersection point is adjacent to an upper edge of the first side plate or an upper edge of the second side plate; a plurality of filter units detachably disposed within the housing, wherein each of the filter units abuts against the inclined sections of the positioning members; and a fixing component detachably engaged to the housing and directly abutting the filter units to secure the filter units within the housing. The instant disclosure also provides a method for assembling the aforementioned filter module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:過濾器模組</p>
        <p type="p">5:固定組件</p>
        <p type="p">10:殼體</p>
        <p type="p">11:第一側板</p>
        <p type="p">110:內表面</p>
        <p type="p">12:第二側板</p>
        <p type="p">120:內表面</p>
        <p type="p">13:第三側板</p>
        <p type="p">14:第四側板</p>
        <p type="p">18:上方開口</p>
        <p type="p">19:下方開口</p>
        <p type="p">20:定位件</p>
        <p type="p">30:過濾器單元</p>
        <p type="p">40:上側止擋件</p>
        <p type="p">41:頂壁</p>
        <p type="p">42:傾斜側壁</p>
        <p type="p">43:傾斜側壁</p>
        <p type="p">50:壓合件</p>
        <p type="p">51:第一區段</p>
        <p type="p">52:第二區段</p>
        <p type="p">53:鎖合結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="658" publication-number="202619268">
    <tif-files tif-type="multi-tif">
      <tif file="113141176.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141176</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有過電流保護機制的馬達驅動器</chinese-title>
        <english-title>MOTOR DRIVER HAVING OVERCURRENT PROTECTION MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02P27/06</main-classification>
        <further-classification edition="200601120241204B">H02H7/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昆民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢世海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, SHIH-HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有過電流保護機制的馬達驅動器。馬達驅動器包含輸出級電路以及馬達驅動電路。輸出級電路包含多個上橋開關、多個下橋開關以及馬達驅動電路。當馬達驅動電路依據任一下橋開關的第二端的參數判定輸出級電路發生過電流事件時，馬達驅動電路關閉所有多個上橋開關。當馬達驅動電路判定輸出級電路在關閉所有多個上橋開關之後仍發生過電流事件時，馬達驅動電路關閉所有多個上橋開關的同時，也關閉所有多個下橋開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motor driver having an overcurrent protection mechanism is provided. The motor driver includes an output stage circuit and a motor driving circuit. The output stage circuit includes a plurality of high-side switches and a plurality of low-side switches. When the motor driver determines that an overcurrent event occurs in the output stage circuit according to a parameter of any one of the plurality of low-side switches, the motor driver turns off all of the plurality of high-side switches. When all of the plurality of high-side switches are turned off and the overcurrent event still occurs in the output stage circuit, the motor driver turns off all of the plurality of low-side switches and continually turns off the high-side switches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">POS:轉子位置偵測電路</p>
        <p type="p">MDV:馬達驅動電路</p>
        <p type="p">CTR:控制電路</p>
        <p type="p">DRV:驅動電路</p>
        <p type="p">OTG:輸出級電路</p>
        <p type="p">MT:馬達</p>
        <p type="p">OUT1:第一端</p>
        <p type="p">OUT2:第二端</p>
        <p type="p">OUT3:第三端</p>
        <p type="p">SEN:感測電路</p>
        <p type="p">Rs:感測電阻</p>
        <p type="p">Vs:電壓</p>
        <p type="p">CMP:比較器</p>
        <p type="p">Vref:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="659" publication-number="202617844">
    <tif-files tif-type="multi-tif">
      <tif file="113141177.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141177</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製程用切割膠帶、其組成物、及其製造方法</chinese-title>
        <english-title>CUTTING TAPE FOR SEMICONDUCTOR PROCESS, COMPOSITION THEREOF, AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">C08J5/18</main-classification>
        <further-classification edition="200601120250203B">B29D7/01</further-classification>
        <further-classification edition="201801120250203B">C09J7/30</further-classification>
        <further-classification edition="201801120250203B">C09J7/24</further-classification>
        <further-classification edition="201801120250203B">C09J7/40</further-classification>
        <further-classification edition="200601120250203B">C09J123/06</further-classification>
        <further-classification edition="200601120250203B">C09J123/12</further-classification>
        <further-classification edition="200601120250203B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹俊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴振和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHEN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種半導體製程用切割膠帶、其組成物、及其製造方法。方法包含：實施混合步驟：將切割膠帶的組成物，通過混合機進行混合，以形成樹脂混合物；切割膠帶的組成物包含聚乙烯樹脂、聚丙烯樹脂、抗靜電添加劑；實施造粒步驟：將樹脂混合物經過雙螺桿押出機進行造粒，以製備塑料粒子；實施流延製膜步驟：將塑料粒子置入單螺桿押出機並通過流延法（Casting），製備一基材薄膜；實施膠層塗佈步驟：提供離型膜且於離型膜上形成膠層；及實施貼合步驟：將基材薄膜與膠層貼合，形成切割膠帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a cutting tape for semiconductor processing, a composition thereof, and a method for producing the same. The method includes: a mixing step, where the cutting tape composition, including polyethylene resin, polypropylene resin, and an antistatic additive, is mixed using a mixer to form a resin mixture; a pelletizing step, where the resin mixture is pelletized using a twin-screw extruder to prepare plastic particles; a cast film forming step, where the plastic particles are processed in a single-screw extruder and formed into a base film using a casting process; an adhesive layer coating step, where a release film is provided, and an adhesive layer is applied onto the release film; and a lamination step, where the base film is laminated with the adhesive-coated release film to produce the cutting tape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟S110</p>
        <p type="p">S120:步驟S120</p>
        <p type="p">S130:步驟S130</p>
        <p type="p">S140:步驟S140</p>
        <p type="p">S150:步驟S150</p>
        <p type="p">S160:步驟S160</p>
        <p type="p">S170:步驟S170</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="660" publication-number="202617463">
    <tif-files tif-type="multi-tif">
      <tif file="113141180.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動汽車充換電站</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">B60L53/80</main-classification>
        <further-classification edition="201901120250203B">B60L53/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馳航科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯忠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯國貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電動汽車充換電站，其係設置於車輛行駛的交叉路口，包含一可供電動汽車停置充電之充電區域及一可自動換電池之換電區域，其中充電區域則提供需充電之電動汽車於充電車位與充電設備連結進行充電，另一換電區域具有電池櫃儲存電動汽車電池，當電動汽車進入換電區域時，可以由控制單元控制台車將須充電之電池卸下，交由電池傳輸器將電池轉移至電池櫃，再由電池櫃藉由電池傳輸器將充滿電之電池轉移至台車交給換電池之電動汽車，另外可利用換電站可利用之空間設置服務區域提供駕駛休息及購物或洗手間等服務，整體具有多功能且簡捷方便。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:充換電站</p>
        <p type="p">20:充電區域</p>
        <p type="p">30:換電區域</p>
        <p type="p">40:服務區域</p>
        <p type="p">50:道路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="661" publication-number="202617237">
    <tif-files tif-type="multi-tif">
      <tif file="113141186.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人體感知訓練系統及其方法</chinese-title>
        <english-title>BODY PERCEPTION TRAINING SYSTEM AND ITS TRAINING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241130B">A63F13/52</main-classification>
        <further-classification edition="201401120241130B">A63F13/21</further-classification>
        <further-classification edition="202401120241130B">G06Q50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴金輪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張玉梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林霆鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林旻佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MIN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王信鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許林恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, LIN-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊家鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種人體感知訓練系統及其方法。人體感知訓練系統包含訓練情境資料庫、雜訊調整單元、穿戴套件、計算單元、及控制單元。訓練情境資料庫包含具有多個雜訊的場景節點，場景節點具有目標物件及對應目標物件的觸發範圍。穿戴套件包含虛擬實境模組及具有操作座標的模擬操作件，虛擬實境模組載入場景節點以對使用者產生虛擬場景。計算單元自目標物件出現時開始計算操作座標重疊至觸發範圍的反應速率，當反應速率介於預定速率區間時，控制單元控制雜訊調整單元增加場景節點的多個雜訊的總數量並命令虛擬實境模組重新啟動場景節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a body perception training system and its training method. The body perception training system includes a training situation database, a noise adjustment unit, a wearable package, a calculating unit, and a control unit. The training situation database includes a scene node having a plurality of noises. The scene node has a target object, and a trigger range corresponding to the target object. The wearable package includes a virtual reality module and a simulation operating component having operating coordinate. The virtual reality module loads the scene node to generate a virtual scene. The calculating unit calculates a reaction rate from when the target object appears until the operating coordinate overlap with the trigger range. When the reaction rate is within a predetermined rate interval, the control unit controls the noise adjustment unit to increase a total quantity of the noises of the scene node, and the control unit commands the virtual reality module to restart the scene node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:人體感知訓練系統</p>
        <p type="p">1:訓練情境資料庫</p>
        <p type="p">11:場景節點</p>
        <p type="p">2:雜訊調整單元</p>
        <p type="p">3:穿戴套件</p>
        <p type="p">31:虛擬實境模組</p>
        <p type="p">32:模擬操作件</p>
        <p type="p">33:姿態感測模組</p>
        <p type="p">4:計算單元</p>
        <p type="p">5:控制單元</p>
        <p type="p">N:雜訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="662" publication-number="202619548">
    <tif-files tif-type="multi-tif">
      <tif file="113141187.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鰭式場效電晶體及其製作方法</chinese-title>
        <english-title>FINFET STRUCTURE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D64/00</main-classification>
        <further-classification edition="202501120250102B">H10D64/20</further-classification>
        <further-classification edition="202501120250102B">H10D64/60</further-classification>
        <further-classification edition="202501120250102B">H10D48/00</further-classification>
        <further-classification edition="202501120250102B">H01L21/28</further-classification>
        <further-classification edition="200601120250102B">H01L21/283</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅歆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭竣文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHUN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭晉佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜銘祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, MING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊詠方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUNG-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鰭式場效電晶體結構包含一半導體基底，一鰭狀結構凸出於半導體基底，一閘極橫跨鰭狀結構，一源極區和一汲極區分別設置在閘極之兩側的鰭狀結構上，源極區包含一第一磊晶層和一第三磊晶層分別埋入於鰭狀結構中，一第一非磊晶區定義為第一磊晶層和第三磊晶層之間的鰭狀結構，汲極區包含一第二磊晶層和一第四磊晶層分別埋入於鰭狀結構中，一第二非磊晶區定義為第二磊晶層和第四磊晶層之間的鰭狀結構，一第一接觸插塞設置在第三磊晶層上以及一第二接觸插塞設置在第四磊晶層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An finFet structure includes a semiconductor substrate. A fin structure protrudes from the semiconductor substrate. A gate crosses the fin structure. A source region and a drain region are respectively disposed on the fin structure at two sides of the gate. The source region includes a first epitaxial layer and a third epitaxial layer respectively embedded in the fin structure. A first non-epitaxial region is defined as the fin structure between the first epitaxial layer and the third epitaxial layer. The drain region includes a second epitaxial layer and a fourth epitaxial layer respectively embedded in the fin structure. A second non-epitaxial region is defined as the fin structure between the second epitaxial layer and the fourth epitaxial layer. A first contact plug is disposed on the third epitaxial layer and a second contact plug is disposed on the fourth epitaxial layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體基底</p>
        <p type="p">12:鰭狀結構</p>
        <p type="p">14a:第一摻雜井</p>
        <p type="p">14b:第二摻雜井</p>
        <p type="p">16a:第一磊晶層</p>
        <p type="p">16b:第二磊晶層</p>
        <p type="p">16c:第三磊晶層</p>
        <p type="p">16d:第四磊晶層</p>
        <p type="p">18a:第一非磊晶區</p>
        <p type="p">18b:第二非磊晶區</p>
        <p type="p">20a:第一接觸插塞</p>
        <p type="p">20b:第二接觸插塞</p>
        <p type="p">22a:第一金屬矽化物</p>
        <p type="p">22b:第二金屬矽化物</p>
        <p type="p">24a:源極摻雜區</p>
        <p type="p">24b:汲極摻雜區</p>
        <p type="p">200:鰭式場效電晶體</p>
        <p type="p">D:汲極區</p>
        <p type="p">DG1:第一虛置閘極</p>
        <p type="p">DG2:第二虛置閘極</p>
        <p type="p">L1:第一距離</p>
        <p type="p">L2:第二距離</p>
        <p type="p">G:閘極</p>
        <p type="p">S:源極區</p>
        <p type="p">SP:側壁子</p>
        <p type="p">X:水平方向</p>
        <p type="p">Y:垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="663" publication-number="202619443">
    <tif-files tif-type="multi-tif">
      <tif file="113141195.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>把手模組及機架系統</chinese-title>
        <english-title>HANDLE MODULE AND RACK SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241210B">H05K5/02</main-classification>
        <further-classification edition="200601120241210B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯穎科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIWYNN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李尚謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHANG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾云婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種把手模組，用於設置於一電子裝置的一殼體。把手模組包含一把手以及一省力組件，把手以可旋轉的方式設置於殼體，省力組件包含一第一省力件以及一第二省力件，第一省力件設置於把手，第二省力件對應第一省力件設置於殼體，其中第一省力件與第二省力件之間具有一吸引力，當把手由一開啟位置移動至一關閉位置的過程中，所述吸引力變大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handle module configured to be disposed on a housing of an electronic device. The handle module includes a handle and a labor-saving assembly. The handle is rotatably disposed on the housing. The labor-saving assembly includes a first labor-saving component and a second labor-saving component. The first labor-saving component is disposed on the handle, and the second labor-saving component is disposed on the housing and corresponds to the first labor-saving component. There is an attractive force between the first labor-saving component and the second labor-saving component. When the handle is moved from an open position to a close position, the attractive force becomes larger.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機架系統</p>
        <p type="p">100:把手模組</p>
        <p type="p">110:把手</p>
        <p type="p">111:卡勾部</p>
        <p type="p">120:板件</p>
        <p type="p">131:第一省力件</p>
        <p type="p">132:第二省力件</p>
        <p type="p">133:載件</p>
        <p type="p">134:固定軸</p>
        <p type="p">136:鎖固件</p>
        <p type="p">200:電子裝置</p>
        <p type="p">210:殼體</p>
        <p type="p">220:本機</p>
        <p type="p">230:散熱裝置</p>
        <p type="p">231:第一液冷接頭</p>
        <p type="p">240:卡掣件</p>
        <p type="p">241:卡掣部</p>
        <p type="p">242:解掣按鈕</p>
        <p type="p">243:固定座</p>
        <p type="p">300:機架</p>
        <p type="p">310:第二液冷接頭</p>
        <p type="p">A:部分</p>
        <p type="p">A1:夾角</p>
        <p type="p">AF1,AF2:吸引力</p>
        <p type="p">DL1,DL2:虛線</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="664" publication-number="202619145">
    <tif-files tif-type="multi-tif">
      <tif file="113141199.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋰電池廢電解液的處理方法及水泥基材料的施工方法</chinese-title>
        <english-title>METHOD FOR TREATING WASTE ELECTROLYTE OF LITHIUM BATTERIES AND CONSTRUCTION METHOD FOR CEMENT-BASED MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241107B">H01M10/54</main-classification>
        <further-classification edition="200601120241107B">C04B22/10</further-classification>
        <further-classification edition="202201120241107B">B09B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綠碳永續科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN CARBON FOREVER TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾堯宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周士本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SHIH-PEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅敬忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種鋰電池廢電解液的處理方法及水泥基材料的施工方法。方法包括提供一碳酸酯類化合物，選自由：碳酸乙烯酯（EC）、碳酸丙烯酯（PC）、碳酸二乙酯（DEC）、碳酸二甲酯（DMC）、以及碳酸甲乙酯（EMC），所組成的材料群組的至少其中之一；以及將碳酸酯類化合物混合至一水泥基材料中。其中，所述碳酸酯類化合物在水泥基材料中作用為早強劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for treating waste electrolyte of lithium batteries and a construction method for cement-based materials are provided. The method includes providing a carbonate compound selected from the group consisting of ethylene carbonate (EC), propylene carbonate (PC), diethyl carbonate (DEC), dimethyl carbonate (DMC), and ethyl methyl carbonate (EMC); and mixing the carbonate compound into a cement-based material. The carbonate compound acts as an early strength agent in the cement-based material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟S110</p>
        <p type="p">S120:步驟S120</p>
        <p type="p">S130:步驟S130</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="665" publication-number="202619266">
    <tif-files tif-type="multi-tif">
      <tif file="113141200.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有占空比動態調變機制的馬達驅動電路</chinese-title>
        <english-title>MOTOR DRIVER CIRCUIT HAVING DYNAMIC DUTY CYCLE MODULATION MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">H02P7/06</main-classification>
        <further-classification edition="201601120250217B">H02P23/28</further-classification>
        <further-classification edition="201601120250217B">H02K11/33</further-classification>
        <further-classification edition="201601120250217B">H02K11/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昆民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有占空比動態調變機制的馬達驅動電路。本發明的馬達驅動電路包含磁場變化感測電路、控制電路、驅動電路以及輸出級電路。磁場變化感測電路感測馬達的轉子旋轉時的磁性強弱變化所產生的多個電壓，以輸出一換相訊號。控制電路依據換相訊號以設定多個控制占空比，依據各控制占空比以輸出一控制占空比訊號。驅動電路依據控制占空比訊號以輸出驅動訊號。輸出級電路依據驅動訊號運作以輸出多個輸出級訊號至馬達。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motor driver circuit having a dynamic duty cycle modulation mechanism is provided. The motor driver circuit includes a magnetic field change sensing circuit, a control circuit, a driver circuit and an output stage circuit. The magnetic field change sensing circuit senses a plurality of voltages that are generated with a change in a magnetic field caused by a motor whose a rotor is rotating to output a commutation signal. The control circuit sets a plurality of control duty cycles according to the commutation signal. The control circuit outputs a control duty cycle signal according to each of the control duty cycles. The driver circuit outputs a driving signal according to the control duty cycle signal. The output stage circuit operates to output a plurality of output stage signals to the motor according to the driving signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">HSE:磁場變化感測電路</p>
        <p type="p">PHS:換相訊號</p>
        <p type="p">CTR:控制電路</p>
        <p type="p">DYOUT:控制占空比輸出訊號</p>
        <p type="p">DRV:驅動電路</p>
        <p type="p">OTG:輸出級電路</p>
        <p type="p">MT:馬達</p>
        <p type="p">OUT1:第一端</p>
        <p type="p">OUT2:第二端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="666" publication-number="202618166">
    <tif-files tif-type="multi-tif">
      <tif file="113141203.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螢幕位置調整方法及其裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR SCREEN POSITION ADJUSTMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">F16M11/04</main-classification>
        <further-classification edition="200601120250102B">H04N5/655</further-classification>
        <further-classification edition="200601120250102B">G06F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正修學校財團法人正修科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG SHIU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李迦恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳穎哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-JHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宇驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳睿軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種螢幕位置調整方法及其裝置，其調整方法包含：提供一螢幕位置調整裝置，以架設且調整螢幕與視覺器官相對位置；以邊緣運算裝置定時觸發視覺器官以進行一物件偵測演算法；物件偵測演算法啟動並控制螢幕位置調整裝置一角度偵測演算法和一高度偵測演算法；及邊緣運算裝置以分散式運算進行平行處理螢幕位置調整裝置中的數演算法之計算，以進一步判斷是否滿足各自的門檻值，若已滿足則不調整螢幕的位置，若不滿足則進行數值調整至滿足各自門檻值。藉此，本創作可應用邊緣運算裝置偵測視覺器官觀看螢幕情形，即時針對視覺器官自動調整螢幕至標準位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for screen position adjustment are provided. The adjustment method comprises: providing a screen position adjustment apparatus to mount and adjust the relative position between the screen and the visual organ; periodically triggering the visual organ using an edge computing device to perform an object detection algorithm; activating the object detection algorithm to control an angle detection algorithm and a height detection algorithm of the screen position adjustment apparatus; and performing parallel processing of a plurality of algorithms in the screen position adjustment apparatus using distributed computing by the edge computing device to further determine whether respective thresholds are satisfied. If satisfied, the screen position is not adjusted; otherwise, a numerical adjustment is performed to satisfy the respective thresholds. Thereby, the present invention can utilize an edge computing device to detect the viewing situation of the visual organ on the screen and automatically adjust the screen to a standard position for the visual organ in real time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S11、S21、S31、S32、S41、S42):步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="667" publication-number="202618327">
    <tif-files tif-type="multi-tif">
      <tif file="113141207.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測速警示設備之收發射器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">G01S13/52</main-classification>
        <further-classification edition="200601120241128B">G08B21/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翼允禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江承昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翼允禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江承昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李榮唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種測速警示設備之收發射器，其主要包含信號接收模組、處理器及藍芽收發送模組。該信號接收模組至少包括雷達信號接收單元、雷射信號接收單元，該雷達信號接收單元及雷射信號接收單元可以捕捉雷達儀及雷射儀所發出的信號，並將該信號傳輸至處理器進行運算處理；當處理器接收信號接收模組之信號後加以運算處理後，則通過藍芽收發送模組以無線傳輸方式將該處理信號送出，由匹配的行動裝置接收該信號，藉由行動裝置對駕駛人進行提醒警告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:信號接收模組</p>
        <p type="p">11:雷達信號接收單元</p>
        <p type="p">12:雷射信號接收單元</p>
        <p type="p">13:第三接收單元</p>
        <p type="p">20:處理器</p>
        <p type="p">21:電源濾波模組</p>
        <p type="p">30:藍芽收發送模組</p>
        <p type="p">31:電源單元</p>
        <p type="p">32:串行外設介面</p>
        <p type="p">33:微處理</p>
        <p type="p">34:藍芽收發射天線</p>
        <p type="p">40:行動裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="668" publication-number="202619115">
    <tif-files tif-type="multi-tif">
      <tif file="113141210.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141210</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件堆疊結構</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STACK STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">H01L23/535</main-classification>
        <further-classification edition="200601120241128B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張守仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHOU-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂俊麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛永年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOH, YUNG NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件堆疊結構，包括堆疊排列的多個第一半導體元件結構。每個第一半導體元件結構包括基底、多個半導體元件、重佈線層、第一基底穿孔與多個第二基底穿孔。基底包括正面與背面。多個半導體元件位在基底的正面上。重佈線層位在基底的背面上。第一基底穿孔貫穿基底。第一基底穿孔電性連接於重佈線層。多個第二基底穿孔貫穿基底。每個第二基底穿孔位在對應的半導體元件的正下方。每個第二基底穿孔電性連接於對應的半導體元件與重佈線層。第一基底穿孔的尺寸大於每個第二基底穿孔的尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device stack structure including first semiconductor device structures arranged in a stack is provided. Each of the first semiconductor device structures includes a substrate, semiconductor devices, a redistribution layer (RDL), a first through-substrate via (TSV), and second TSVs. The substrate includes a front side and a back side. The semiconductor devices are located on the front side of the substrate. The RDL is located on the back side of the substrate. The first TSV passes through the substrate. The first TSV is electrically connected to the RDL. The second TSVs pass through the substrate. Each of the second TSVs is located directly below the corresponding semiconductor device. Each of the second TSVs is electrically connected to the corresponding semiconductor device and the RDL. The size of the first TSV is greater than the size of each of the second TSVs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:半導體元件堆疊結構</p>
        <p type="p">100,100A,100B,122:半導體元件結構</p>
        <p type="p">102,124:基底</p>
        <p type="p">104,126:半導體元件</p>
        <p type="p">106:重佈線層</p>
        <p type="p">108,110:基底穿孔</p>
        <p type="p">112,114,128:介電結構</p>
        <p type="p">116,130:內連線結構</p>
        <p type="p">118,120,132:接墊</p>
        <p type="p">H1,H2:整體高度</p>
        <p type="p">S1,S3:正面</p>
        <p type="p">S2,S4:背面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="669" publication-number="202618416">
    <tif-files tif-type="multi-tif">
      <tif file="113141214.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">G02F1/133</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商冠捷投資有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕婉婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUEH, WAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斳倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光模組，包含一底板，及多個設置於該底板表面的發光單元，每一該發光單元具有一第一發光件，及兩個與該第一發光件發出不同色光的第二發光件。該第一發光件及該等第二發光件分別為四邊形，該兩個第二發光件排列於該第一發光件的相對兩側邊，任一該第二發光件平行第一方向的一第三邊長與該第一發光件平行第一方向的一第一邊長的比值介於0.35至0.55，且每一該發光單元的該等第二發光件的面積總和不大於該第一發光件的面積。藉由該第一發光件及該第二發光件的邊長比值設計，達到解決光源色亂的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">25:發光單元</p>
        <p type="p">251:基板</p>
        <p type="p">252:第一發光件</p>
        <p type="p">252a:第一邊長</p>
        <p type="p">252b:第二邊長</p>
        <p type="p">253:第二發光件</p>
        <p type="p">253a:第三邊長</p>
        <p type="p">253b:第四邊長</p>
        <p type="p">254:反射件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="670" publication-number="202619577">
    <tif-files tif-type="multi-tif">
      <tif file="113141215.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少回歸反射並增加頻寬的波導光電探測器</chinese-title>
        <english-title>WAVEGUIDE PHOTODETECTORS FOR REDUCING RETRO-REFLECTION AND INCREASING BANDWIDTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250418B">H10F30/22</main-classification>
        <further-classification edition="202501120250418B">H10F77/40</further-classification>
        <further-classification edition="202501120250418B">H10F77/10</further-classification>
        <further-classification edition="200601120250418B">G02B6/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商拉諾沃斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANOVUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫瑞　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURRAY, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希奇　萊恩莫瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HICKEY, RYAN MURRAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克特　道格拉斯ＪＳ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECKETT, DOUGLAS J. S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬特塞隆　艾德加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANTE-CERON, EDGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈麥斯　普羅法克麗絲汀娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOMES, PROVA CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡利米　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIMI, MOHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希蘭　哈特夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAN, HATEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種用於減少回歸反射並增加頻寬的波導光電探測器。該波導光電探測器包括一波導光電二極體，包含：一主波導；與該主波導整合的一吸收波導，該吸收波導及該主波導中的一或多者具有一光軸；沿著該吸收波導的一第一側的一n摻雜半導體區域；沿著該吸收波導的一第二側的一p摻雜半導體區域，該第二側與該第一側相對；及該吸收波導處的一輸入面，該輸入面與該光軸形成一銳角，及該輸入面的一內部朝向該p摻雜半導體區域成角度，使得輸入至該輸入面的光朝向該p摻雜半導體區域折射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waveguide photodetector for reducing retro-reflection and increasing bandwidth is provided. The waveguide photodetector includes a waveguide photodiode comprising: a main waveguide; an absorbing waveguide integrated with the main waveguide, one or more of the absorbing waveguide and the main waveguide having an optical axis; an n- doped semiconductor region along a first side of the absorbing waveguide; a p-doped semiconductor region along a second side of the absorbing waveguide, the second side opposite the first side; and an input facet at the absorbing waveguide, the input facet forming an acute angle with the optical axis, and an interior of the input facet angled towards the p-doped semiconductor region, such that light input to the input facet is refracted towards the p-doped semiconductor region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">602:波導光電二極體</p>
        <p type="p">604:主波導</p>
        <p type="p">606:吸收波導</p>
        <p type="p">608:輸入面</p>
        <p type="p">612:入射光</p>
        <p type="p">614:折射光</p>
        <p type="p">622:光軸</p>
        <p type="p">625:n摻雜半導體區域</p>
        <p type="p">627:第一側</p>
        <p type="p">629:p摻雜半導體區域</p>
        <p type="p">631:第二側</p>
        <p type="p">633:銳角</p>
        <p type="p">635:內側</p>
        <p type="p">ψ:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="671" publication-number="202618614">
    <tif-files tif-type="multi-tif">
      <tif file="113141219.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於二值神經網路之記憶體裝置及記憶體內計算方法</chinese-title>
        <english-title>MEMORY DEVICE AND IN-MEMORY COMPUTING METHOD FOR BINARIZED NEURAL NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250204B">G06N3/063</main-classification>
        <further-classification edition="200601120250204B">G11C11/54</further-classification>
        <further-classification edition="200601120250204B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置及記憶體內計算方法。記憶體裝置例如為三維NAND型快閃記憶體，提供高性能及高容量的儲存媒介。在記憶體裝置中，輸入解析器提供初始位址資訊及初始層激活值資料。讀出資料感測及比較器從記憶體陣列讀取與初始位址資訊對應的初始資料，且使初始層激活值資料分別與初始資料中的多個權重資料進行逐位元比對，以產生多個第一比較資料。錯誤位元偵測器分析第一比較資料，據以產生多個第一分析資料。運算電路使用激活函數將每個第一分析資料與對應的第二分析資料進行運算，以提供中間層激活值資料至輸入解析器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and an in-memory computing method are provided. The memory device is, for example, a 3D NAND flash memory and provides a storage media with high-performance and high-capacity. In the memory device, an input parser provides initial address information and initial layer activation data. A readout data sensor and comparator reads initial data corresponding to the initial address information from a memory array, and compares the initial layer activation data with a plurality of weight data in the initial data bit by bit respectively to generate a plurality of first comparative data. An error bit detector analyzes the first comparative data to generate a plurality of first analysis data. An operation circuit uses an activation function to operate each first analysis data and a corresponding second analysis data to provide intermediate layer activation data to the input parser.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">110:輸入解析器</p>
        <p type="p">112:輸入輸出端</p>
        <p type="p">120:記憶體陣列</p>
        <p type="p">122:位址解碼器</p>
        <p type="p">130:快取區塊</p>
        <p type="p">140:讀出資料感測及比較器</p>
        <p type="p">150:錯誤位元偵測器</p>
        <p type="p">160:運算電路</p>
        <p type="p">Dactf:初始層激活值資料</p>
        <p type="p">Dacts:中間層激活值資料</p>
        <p type="p">Das1_1~Das1_4:第一分析資料</p>
        <p type="p">Das2_1~Das2_4:第二分析資料</p>
        <p type="p">Dcp1_1~Dcp1_4:第一比較資料</p>
        <p type="p">Dcp2_1~Dcp2_4:第二比較資料</p>
        <p type="p">Dfst:初始資料</p>
        <p type="p">Din:輸入資料</p>
        <p type="p">Dout:輸出資料</p>
        <p type="p">Dsec:中間資料</p>
        <p type="p">Indf:初始位址資訊</p>
        <p type="p">Inds:中間位址資訊</p>
        <p type="p">Popcount_type:組態旗標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="672" publication-number="202617315">
    <tif-files tif-type="multi-tif">
      <tif file="113141224.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合材料雷射加工結構及其加工方法</chinese-title>
        <english-title>COMPOSITE MATERIAL LASER PROCESSING STRUCTURE AND ITS PROCESSING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241206B">B23K26/14</main-classification>
        <further-classification edition="201401120241206B">B23K26/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳興國際科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIA HSING INTERNATIONAL TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘錫富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種複合材料雷射加工結構，其用以對一複合材料進行加工，本申請包含一雷射加工頭及一罩體。雷射加工頭用以發射出雷射光；罩體具有相對設置的輸入件及一輸出件，輸入件具有雷射安裝部及流體輸入部，流體輸入部連接輸入裝置以輸入低溫加工流體，輸出件的雷射通道用以引導雷射光輸出至輸出孔，輸出件的輸出通道用以引導低溫加工流體輸出至輸出孔，其中，雷射光與低溫加工流體係從輸出孔輸出，且與複合材料的加工面交會於加工交叉點，以對複合材料的加工面進行分割加工。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite material laser processing structure, which is used to process a composite material. This application includes a laser processing head and a casing. The laser processing head is used to emit laser light; the casing has an input component and an output component positioned opposite each other. The input component has a laser installation section and a fluid input section, with the fluid input section connected to an input device to supply low-temperature processing fluid. The laser channel of the output component is used to guide the laser light to the output hole, and the output channel of the output component is used to guide the low-temperature processing fluid to the output hole. The laser light and the low-temperature processing fluid are emitted from the output hole and intersect at the processing intersection point on the processing surface of the composite material, thereby performing cutting processing on the surface of the composite material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合材料</p>
        <p type="p">1a:加工面</p>
        <p type="p">10:雷射加工頭</p>
        <p type="p">20:罩體</p>
        <p type="p">21:輸入件</p>
        <p type="p">211:雷射安裝部</p>
        <p type="p">212:流體輸入部</p>
        <p type="p">22:輸出件</p>
        <p type="p">221:輸出孔</p>
        <p type="p">222:雷射通道</p>
        <p type="p">223:輸出通道</p>
        <p type="p">X1:雷射輸出方向</p>
        <p type="p">X2:流體輸出方向</p>
        <p type="p">P:加工交叉點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="673" publication-number="202619457">
    <tif-files tif-type="multi-tif">
      <tif file="113141228.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水冷散熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H05K7/20</main-classification>
        <further-classification edition="200601120250102B">G06F1/20</further-classification>
        <further-classification edition="200601120250102B">F28F9/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA NETWORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐玉柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温明毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水冷散熱器，包含一外殼、一浮動散熱片及一限位結構，外殼內部形成一腔體，腔體內具有一主流道，外殼於表面凹設一淺槽，淺槽內具有一結合口，結合口與主流道相通，外殼表面設有一限位結構結合部；浮動散熱片包括一基板、分別連接於該基板的一抵接片及複數鰭片，基板位於淺槽且與淺槽內壁夾合一密封環；該些鰭片穿過結合口並伸入主流道；限位結構結合於限位結構結合部且扣住基板的周緣，將基板限制於淺槽，藉此使浮動散熱片受壓時會壓縮密封環，當壓力釋放時又能被密封環推回原位，可適應接觸不同高度的待散熱物而達到較佳的散熱效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外殼</p>
        <p type="p">12:淺槽</p>
        <p type="p">121:結合口</p>
        <p type="p">13:限位結構結合部</p>
        <p type="p">131:螺孔</p>
        <p type="p">14:第一側開口</p>
        <p type="p">171:入水口</p>
        <p type="p">172:出水口</p>
        <p type="p">20:浮動散熱片</p>
        <p type="p">21:基板</p>
        <p type="p">211:凹槽</p>
        <p type="p">212:凹口</p>
        <p type="p">22:抵接片</p>
        <p type="p">23:鰭片</p>
        <p type="p">24:密封環</p>
        <p type="p">30:限位結構</p>
        <p type="p">31:螺栓</p>
        <p type="p">311:頭部</p>
        <p type="p">312:身部</p>
        <p type="p">40:第一側蓋</p>
        <p type="p">60:入水接頭</p>
        <p type="p">70:出水接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="674" publication-number="202617336">
    <tif-files tif-type="multi-tif">
      <tif file="113141231.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防漏偵測系統及包含該防漏偵測系統的工具機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B23Q11/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發得科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FACTORY AUTOMATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭嘉宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIA-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防漏偵測系統及包含該防漏偵測系統的工具機。該防漏偵測系統包含一第一測漏單元及一第二測漏單元。該第一測漏單元用以設置在一切削液單元之下側，並包括一第一集液管組件、一第一儲液槽，及一第一漏液感測器。該第二測漏單元用以設置在該轉軸單元之下側，並包括一第二集液管組件、一第二儲液槽，及一第二漏液感測器。藉由該防漏偵測系統之該第一測漏單元與該第二測漏單元的設置，不僅能監控切削液的正常滲漏情況，還能偵測到在該轉軸單元側不正常的滲漏，而能即時檢修或更換零件，大幅提高偵測的靈敏度，並能確保工具機的順暢運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具機</p>
        <p type="p">2:切削單元</p>
        <p type="p">21:切削頭</p>
        <p type="p">3:機殼</p>
        <p type="p">601:出液口</p>
        <p type="p">612:第一儲液槽</p>
        <p type="p">614:出液管</p>
        <p type="p">615:流量調節器</p>
        <p type="p">622:第二儲液槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="675" publication-number="202618594">
    <tif-files tif-type="multi-tif">
      <tif file="113141242.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>惡意軟體掃描執行效能優化方法</chinese-title>
        <english-title>METHOD FOR OPTIMIZING THE EXECUTION PERFORMANCE OF MALWARE SCANNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250208B">G06F21/56</main-classification>
        <further-classification edition="202501120250208B">G06F11/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威聯通科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QNAP SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐世杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種惡意軟體掃描執行效能優化方法，包含：下載惡意軟體資料庫、對惡意軟體資料庫中一些需要被拆分的特徵碼檔案各自執行拆分指令，以特徵碼行數為單位，將需要被拆分的特徵碼檔案各自拆分為複數個子檔案、短期儲存單元分次載入子檔案以及未被拆分的特徵碼檔案執行惡意軟體掃描。其中，需要被拆分的特徵碼檔案用於惡意軟體掃描所佔用之記憶體容量大於N1；子檔案用於惡意軟體掃描所佔用之記憶體容量不大於N2，N1、N2皆為記憶體容量閾值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for optimizing the execution performance of malware scanning, comprising: downloading a malware database, executing split commands on some signature files in the malware database that need to be split, splitting the signature files that need to be split into multiple sub-files based on the number of lines of signature, loading the sub-files and the signature files haven’t been split into a short-term storage unit in batches to perform malware scanning. Among them, the runtime memory footprint taken by malware scanning with the signature files that need to be split is greater than N1; the runtime memory footprint taken by malware scanning with the sub-files is not greater than N2, where N1 and N2 are both runtime memory footprint thresholds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:惡意軟體資料庫</p>
        <p type="p">100a~100f:特徵碼檔案</p>
        <p type="p">100a-1~100a-5、100b-1~100b-4、100c-1~100c-2:子檔案</p>
        <p type="p">200:短期儲存單元</p>
        <p type="p">300:長期儲存單元</p>
        <p type="p">400:被掃描的文件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="676" publication-number="202618357">
    <tif-files tif-type="multi-tif">
      <tif file="113141243.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141243</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少回歸反射並增加頻寬的波導光電探測器</chinese-title>
        <english-title>WAVEGUIDE PHOTODETECTORS FOR REDUCING RETRO-REFLECTION AND INCREASING BANDWIDTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G02B6/122</main-classification>
        <further-classification edition="200601120250401B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商拉諾沃斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANOVUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希奇　萊恩莫瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HICKEY, RYAN MURRAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫瑞　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURRAY, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克特　道格拉斯ＪＳ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECKETT, DOUGLAS J. S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈麥斯　普羅法克麗絲汀娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOMES, PROVA CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬特塞隆　艾德加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANTE-CERON, EDGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡利米　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIMI, MOHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希蘭　哈特夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAN, HATEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種用於減少回歸反射並增加頻寬的波導光電探測器。該波導光電探測器包含：一波導光電二極體，具有：一主波導、與該主波導整合的一吸收波導、及位於該吸收波導處的一輸入面；及一輸入波導，用於將光透射至該波導光電二極體，該輸入波導與該輸入面之間的一輸入角包含一銳界面角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waveguide photodetector for reducing retro-reflection and increasing bandwidth is provided. The waveguide photodetector comprises: a waveguide photodiode having: a main waveguide, an absorbing waveguide integrated with the main waveguide, and an input facet at the absorbing waveguide; and an input waveguide for transmitting light to the waveguide photodiode, an input angle between the input waveguide and the input facet comprising an acute interface angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:波導光電探測器</p>
        <p type="p">102:波導光電二極體</p>
        <p type="p">104:主波導</p>
        <p type="p">106:吸收波導</p>
        <p type="p">108:輸入面</p>
        <p type="p">110:輸入波導</p>
        <p type="p">112:光</p>
        <p type="p">114:透射光</p>
        <p type="p">116:反射光</p>
        <p type="p">118:輸出波導</p>
        <p type="p">120:光收集器</p>
        <p type="p">122:光軸</p>
        <p type="p">124:光軸</p>
        <p type="p">126:光軸</p>
        <p type="p">128:銳輸入界面角</p>
        <p type="p">130:法線</p>
        <p type="p">132:輸出角</p>
        <p type="p">A-A’:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="677" publication-number="202617410">
    <tif-files tif-type="multi-tif">
      <tif file="113141246.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吹瓶機模具作動機構</chinese-title>
        <english-title>MOLD ACTUATING MECHANISM FOR BLOW MOLDING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">B29C49/56</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銓寶工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUMPOWER MACHINERY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝樹林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, SHU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝龍昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, LONG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIAN-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴柏丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, PO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭勝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吹瓶機模具作動機構，包含有一圓盤凸輪；一圓柱凸輪能與該圓盤凸輪同時轉動；一導引滑塊，受該圓柱凸輪帶動而產生水平位移；一升降滑塊，受該圓盤凸輪帶動而產生垂直位移；至少一傳動桿組具有相樞接的一第一活動桿與一第二活動桿；以及一從動桿，以其兩端樞接於該升降滑塊與該第二活動桿。本發明能夠降低磨耗，具備較佳的運動特性與控制能力，進而延長設備的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mold actuating mechanism for a blow molding machine, comprising a disc cam; a cylindrical cam capable of rotating simultaneously with the disc cam; a guiding slider driven by the cylindrical cam to produce horizontal displacement; a vertical slider driven by the disc cam to produce vertical displacement; at least one transmission rod set having a first and a second movable rod pivotally connected to each other; and a follower rod pivotally connected at both ends to the vertical slider and the second movable rod. This invention reduces wear, provides better motion characteristics and control capabilities, thereby extending the equipment's service life.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:導引滑塊</p>
        <p type="p">3:第一活動桿</p>
        <p type="p">4:第二活動桿</p>
        <p type="p">5:從動桿</p>
        <p type="p">6:升降滑塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="678" publication-number="202618394">
    <tif-files tif-type="multi-tif">
      <tif file="113141252.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外掛式充電模組以及近眼顯示裝置</chinese-title>
        <english-title>EXTERNAL CHARGING MODULE AND NEAR EYE DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">G02B27/01</main-classification>
        <further-classification edition="200601120250210B">H02J15/00</further-classification>
        <further-classification edition="202501120250210B">H10F19/00</further-classification>
        <further-classification edition="200601120250210B">G02F1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACECORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫伯彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, BO-JHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種外掛式充電模組，可分離式配置於穿戴式顯示模組。外掛式充電模組具有光軸。外掛式充電模組包括透光發電元件、調光元件以及連接元件。透光發電元件用以接收光能以產生電能。調光元件配置於透光發電元件。調光元件用以調整透光度。連接元件電性連接於透光發電元件。當外掛式充電模組配置於穿戴式顯示模組時，連接元件連接於穿戴式顯示模組的鏡框以使透光發電元件對穿戴式顯示模組的電能元件進行充電。此外，一種近眼顯示裝置亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An external charging module that can be detachably configured in a wearable display module is provided. The external charging module includes a light-transmitting power generation element, a dimming element and a connecting element. The light-transmitting power generation element is adapted to receive light energy to generate electrical energy. The dimming element is arranged on the light-transmitting power generation element. The dimming element is adapted to adjust light transmittance. The connecting element is electrically connected to the light-transmitting power generation element. When the external charging module is configured on the wearable display module, the connecting element is connected to a frame of the wearable display module so that the light-transmitting power generation element charges an electrical energy element of the wearable display module. In addition, a near-eye display device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:近眼顯示裝置</p>
        <p type="p">100:外掛式充電模組</p>
        <p type="p">110:透光發電元件</p>
        <p type="p">120:調光元件</p>
        <p type="p">140:外掛式框體</p>
        <p type="p">200:穿戴式顯示模組</p>
        <p type="p">210:穿戴式框體</p>
        <p type="p">230:成像元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="679" publication-number="202617120">
    <tif-files tif-type="multi-tif">
      <tif file="113141255.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶體式按摩椅之按摩接觸面強度調整結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A61H15/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫東和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫東和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種帶體式按摩椅之按摩接觸面強度調整結構，其包含有一按摩椅座與一按摩機，按摩椅座具有一椅框，椅框前側左右各設有一第一捲帶，椅框後側設有一轉軸，轉軸左右各設有一第二捲帶且可以一馬達轉動，按摩機設有一第一轉軸與一第二轉軸，第一轉軸左右各設有一第一捲輪，第一捲帶捲於第一捲輪上，第二轉軸左右各設有一第二捲輪，第二捲帶捲於第二捲輪上，同步轉動第一、第二轉軸捲收第一、第二捲帶移動按摩機，透過轉動轉軸可令第二捲帶另一端捲纏於轉軸上調整第二捲帶中間段的長度而調整按摩機被拉掣的張力，從而調整按摩的強度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):按摩椅座</p>
        <p type="p">(11):椅框</p>
        <p type="p">(111):左椅框</p>
        <p type="p">(112):右椅框</p>
        <p type="p">(113):連接框</p>
        <p type="p">(114):轉軸</p>
        <p type="p">(1141):轉桿</p>
        <p type="p">(115):連接罩</p>
        <p type="p">(12):第一捲帶</p>
        <p type="p">(13):第二捲帶</p>
        <p type="p">(14):第一馬達</p>
        <p type="p">(20):按摩機</p>
        <p type="p">(21):第一轉軸</p>
        <p type="p">(211):第一捲輪</p>
        <p type="p">(212):第一齒輪</p>
        <p type="p">(22):第二轉軸</p>
        <p type="p">(221):第二捲輪</p>
        <p type="p">(222):第二齒輪</p>
        <p type="p">(24):傳動齒輪</p>
        <p type="p">(25):按摩件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="680" publication-number="202617121">
    <tif-files tif-type="multi-tif">
      <tif file="113141257.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按摩椅之按摩接觸面強度調整結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">A61H23/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海榮泰健康科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫東和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種按摩椅之按摩接觸面強度調整結構，其包含有一按摩椅座與一按摩機，按摩椅座具有一椅框，椅框前側左右各設有一第一捲繩，椅框後側設有一轉軸，轉軸左右各設有一第二捲繩且可以一馬達轉動，按摩機設有一第一轉軸與一第二轉軸，第一轉軸左右各設有一第一捲輪，第一捲繩捲於第一捲輪之一第一螺紋上，第二轉軸左右各設有一第二捲輪，第二捲繩捲於第二捲輪之一第二螺紋上，同步轉動第一、第二轉軸捲收第一、第二捲繩移動按摩機，透過轉動轉軸可令第二捲繩另一端捲纏於轉軸上調整第二捲繩中間段的長度調整張力從而調整按摩的強度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):按摩椅座</p>
        <p type="p">(11):椅框</p>
        <p type="p">(111):左椅框</p>
        <p type="p">(112):右椅框</p>
        <p type="p">(113):連接框</p>
        <p type="p">(114):轉軸</p>
        <p type="p">(1141):轉桿</p>
        <p type="p">(115):連接罩</p>
        <p type="p">(12):第一捲繩</p>
        <p type="p">(13):第二捲繩</p>
        <p type="p">(14):第一馬達</p>
        <p type="p">(20):按摩機</p>
        <p type="p">(21):第一轉軸</p>
        <p type="p">(211):第一捲輪</p>
        <p type="p">(212):第一齒輪</p>
        <p type="p">(22):第二轉軸</p>
        <p type="p">(221):第二捲輪</p>
        <p type="p">(222):第二齒輪</p>
        <p type="p">(24):傳動齒輪</p>
        <p type="p">(25):按摩件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="681" publication-number="202617513">
    <tif-files tif-type="multi-tif">
      <tif file="113141258.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動輔助腳踏車與其自動關機方法</chinese-title>
        <english-title>ELECTRIC ASSIST BICYCLE AND AUTOMATIC SHUTDOWN METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250102B">B62M6/45</main-classification>
        <further-classification edition="201001120250102B">B62M6/50</further-classification>
        <further-classification edition="200601120250102B">H02J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳尚輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHANG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動輔助腳踏車與其自動關機方法。自動關機方法適用於包括電池模組的電動輔助腳踏車，並包括下列步驟。利用電池模組的一電流感測元件偵測電池模組的一充放電狀態。根據電池模組的充放電狀態致能或禁能一自動關機機制。當自動關機機制致能，根據電池模組的充放電狀態決定是否控制電動輔助腳踏車進入關機狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric assist bicycle and an automatic shutdown method thereof are provided. The method is adapted to the electric assist bicycle including a battery module. A current sensing element of the battery module is used to detect a charging and discharging state of the battery module. An automatic shutdown mechanism is enabled or disabled according to the charge and discharge state of the battery module. When the automatic shutdown mechanism is enabled, whether to control the electric assist bicycle to enter a shutdown state is determined based on the charge and discharge status of the battery module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="682" publication-number="202617224">
    <tif-files tif-type="multi-tif">
      <tif file="113141259.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可供調整重量的舉重訓練裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A63B21/075</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬山健康科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON HEALTH TECH. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宏茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇冠銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種舉重訓練裝置，包含一置放座、二配重組及一操作總成；前述二配重組能分別置放在前述置放座的長度二端，各包含沿長度方向排置的複數主配重件，以及排置在該等主配重件內側的至少一副配重件；前述操作總成能置放在前述置放座上，具有一介在前述二配重組之間的握桿，以及連結在前述握桿二端的支持部；使用者可撥轉設在前述支持部上的調整撥盤，以帶動各側邊的一進退件沿長度方向位移，使其穿入或抽出前述主配重件的穿孔，以及帶動各側邊的一轉動件轉動，使其局部擺入或擺出前述副配重件的卡抵部下方，藉此調整舉起前述操作總成時的配重。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:置放座</p>
        <p type="p">111:容置槽</p>
        <p type="p">114:凸墩</p>
        <p type="p">115:解鎖片</p>
        <p type="p">131:第一主配重件</p>
        <p type="p">132:第二主配重件</p>
        <p type="p">133:第三主配重件</p>
        <p type="p">134:第四主配重件</p>
        <p type="p">135:鳩尾槽</p>
        <p type="p">136:鳩尾塊</p>
        <p type="p">138:穿孔</p>
        <p type="p">141:第一副配重件</p>
        <p type="p">142:第二副配重件</p>
        <p type="p">143:凹缺</p>
        <p type="p">144:卡抵部</p>
        <p type="p">15:操作總成</p>
        <p type="p">16:芯管</p>
        <p type="p">17:握桿</p>
        <p type="p">18:殼座</p>
        <p type="p">183:開口</p>
        <p type="p">185:鳩尾塊</p>
        <p type="p">19:調整撥盤</p>
        <p type="p">21:轉動件</p>
        <p type="p">213:內側凸塊</p>
        <p type="p">22:進退件</p>
        <p type="p">222:段位凹窩</p>
        <p type="p">223:鎖定孔</p>
        <p type="p">25:鋼珠</p>
        <p type="p">26:壓縮彈簧</p>
        <p type="p">281:插銷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="683" publication-number="202618240">
    <tif-files tif-type="multi-tif">
      <tif file="113141263.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶材加熱測溫裝置</chinese-title>
        <english-title>TARGET HEATING AND TEMPERATURE MEASURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01N1/44</main-classification>
        <further-classification edition="200601120241204B">G01N1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF NUCLEAR ENERGY RESEARCH, ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭子晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TZU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仲毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種靶材加熱測溫裝置，包含真空腔室、密封件、加熱組件、測溫組件以及定位件。密封件設置於真空腔室的第一開口，加熱組件及測溫組件穿設於密封件。加熱組件包含加熱滑桿、推板以及加熱板，加熱滑桿的一端連接於加熱接觸氣缸，推板連接於加熱滑桿的另一端，推板的表面設置隔熱棒，加熱板連接於隔熱棒。測溫組件包含測溫滑桿以及測溫座，測溫滑桿的一端連接於測溫接觸氣缸，測溫座連接於測溫滑桿的另一端，測溫座設置測溫棒。定位件設置於真空腔室的第二開口，定位件設置定位槽以放置待測靶材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A target heating and temperature measuring device is disclosed, which includes a vacuum chamber, a sealing member, a heating component, a temperature measuring component and a positioning member. The sealing member is disposed at the first opening of the vacuum chamber, and the heating component and the temperature measuring component are disposed through the sealing member. The heating component includes a heating slide rod, a push plate and a heating plate. One end of the heating slide rod is connected to a heating contact cylinder and the push plate is connected to the other end of the heating slide rod. A heat insulation rod is disposed on the surface of the push plate and the heating plate is connected to the heat insulation rod. The temperature measuring component includes a temperature measuring slide rod and a temperature measuring base. One end of the temperature measuring slide rod is connected to a temperature measuring contact cylinder and the temperature measuring base is connected to the other end of the temperature measuring slide rod. The temperature measuring base includes a temperature measuring rod. The positioning member is disposed at the second opening of the vacuum chamber, and the positioning member includes a positioning groove for placing a target material to be measured.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:靶材加熱測溫裝置</p>
        <p type="p">11:真空腔室</p>
        <p type="p">12:密封件</p>
        <p type="p">13:加熱測溫組</p>
        <p type="p">14:定位件</p>
        <p type="p">111:第一開口</p>
        <p type="p">112:第二開口</p>
        <p type="p">113:第三開口</p>
        <p type="p">114:抽氣口</p>
        <p type="p">132:推板</p>
        <p type="p">133:加熱板</p>
        <p type="p">134:測溫滑桿</p>
        <p type="p">135:測溫座</p>
        <p type="p">136:加熱接觸氣缸</p>
        <p type="p">139:加熱棒</p>
        <p type="p">141:測溫接觸氣缸</p>
        <p type="p">148:定位槽</p>
        <p type="p">149:待測靶材</p>
        <p type="p">150:觀測視窗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="684" publication-number="202618787">
    <tif-files tif-type="multi-tif">
      <tif file="113141266.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低電源寫入抹除式非揮發性記憶體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G11C16/14</main-classification>
        <further-classification edition="200601120250203B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億而得微電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳其沛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范雅婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種低電源寫入抹除式非揮發性記憶體，包含共源線、字元線、位元線、記憶體陣列、第一電子開關、第二電子開關、解碼裝置、第一儲存電容器、第二儲存電容器與升壓電路。每一記憶體陣列耦接一條共源線、一條字元線與四條位元線。解碼裝置耦接共源線、字元線與位元線，並耦合高電壓、中電壓、低電壓與接地電壓。第一儲存電容器之一端耦合參考電壓，另一端透過第一電子開關耦接解碼裝置。第二儲存電容器之一端耦合參考電壓，另一端透過第二電子開關耦接解碼裝置。升壓電路耦接第一儲存電容器。升壓電路可對第一儲存電容器充電，以完成程式化動作或抹除動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:低電源寫入抹除式非揮發性記憶體</p>
        <p type="p">10:記憶體陣列</p>
        <p type="p">100:第一記憶晶胞</p>
        <p type="p">101:第二記憶晶胞</p>
        <p type="p">102:第三記憶晶胞</p>
        <p type="p">103:第四記憶晶胞</p>
        <p type="p">11:解碼裝置</p>
        <p type="p">110:第一解碼器</p>
        <p type="p">111:第二解碼器</p>
        <p type="p">112:第三解碼器</p>
        <p type="p">12:第一儲存電容器</p>
        <p type="p">13:第二儲存電容器</p>
        <p type="p">14:升壓電路</p>
        <p type="p">SW1:第一電子開關</p>
        <p type="p">SW2:第二電子開關</p>
        <p type="p">SL:共源線</p>
        <p type="p">SL1:第一共源線</p>
        <p type="p">WL:字元線</p>
        <p type="p">WL1:第一字元線</p>
        <p type="p">BL:位元線</p>
        <p type="p">BL1:第一位元線</p>
        <p type="p">BL2:第二位元線</p>
        <p type="p">BL3:第三位元線</p>
        <p type="p">BL4:第四位元線</p>
        <p type="p">HV:高電壓</p>
        <p type="p">MV:中電壓</p>
        <p type="p">LV:低電壓</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VDD:供應電壓</p>
        <p type="p">T1:第一N型金氧半場效電晶體</p>
        <p type="p">T2:第二N型金氧半場效電晶體</p>
        <p type="p">T3:第三N型金氧半場效電晶體</p>
        <p type="p">T4:第四N型金氧半場效電晶體</p>
        <p type="p">C1:第一電容器</p>
        <p type="p">C2:第二電容器</p>
        <p type="p">C3:第三電容器</p>
        <p type="p">C4:第四電容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="685" publication-number="202618680">
    <tif-files tif-type="multi-tif">
      <tif file="113141270.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於包裝商品時確定緩衝材之方法、裝置及記錄媒體</chinese-title>
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR DETERMINING CUSHION MATERIAL WHEN PACKING PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250520B">G06Q50/40</main-classification>
        <further-classification edition="202301120250520B">G06Q30/06</further-classification>
        <further-classification edition="202401120250520B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙汝斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣艷陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納得卡尼　耶什萬特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADKARNI, YESHWANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴華鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HWAJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成津</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, AHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成濟賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, JEHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申慶俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, KYEONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴佑正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WOOJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用以確定於包裝商品時合適之緩衝材之技術。本發明之一態樣之藉由電子裝置而實行之確定用於包裝商品之緩衝材的方法可包括如下步驟：獲得複數個緩衝材之資訊；產生包括上述複數個緩衝材中之至少一部分之複數個緩衝材組；對包括有目標商品之一個以上之商品類別各者映射上述複數個緩衝材組中之一者；確定上述複數個緩衝材組中要用於上述目標商品之包裝作業之目標緩衝材組；及產生包括上述目標緩衝材組中包括之一個以上之緩衝材之資訊的頁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1410,1420,1430,1440,1450,1460,1470:商品卡</p>
        <p type="p">1412:商品圖像</p>
        <p type="p">1414:第1層</p>
        <p type="p">1416:第2層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="686" publication-number="202618195">
    <tif-files tif-type="multi-tif">
      <tif file="113141278.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱能源再重複使用散熱保暖裝置</chinese-title>
        <english-title>THERMAL ENERGY REUSE IN HEATING AND WARMING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">F27D17/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳忠進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳忠進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱能源再重複使用散熱保暖裝置，包括：一個或數個熱能源產生器以產生不同熱源後再提供重複院熱保暖使用之來源；一固定或活動柵欄式散熱裝置，該裝置利用數節導熱(煙)組合而成可置於如引擎室、車床(地板)、床鋪等地方提供保暖所需；一種食物烘烤爐可直接連接熱能源產生器，可供烘烤食物使用，經使用後再將熱能傳送至下一個保暖裝置重複使用，此最少能源消耗之熱能重複使用方式，在寒冷或極寒環境度下之活動更增舒適及安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thermal energy reuse in heating and warming apparatus is provided, the apparatus includes; a heater is generated the source of thermal energy; a fence shaped warming and heating apparatus to warm car engine and car floor of a recreational vehicle or a camper body in a sleeping bag during extreme cold weather; a baking oven to roast food with reused thermal energy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:熱能源產生器</p>
        <p type="p">20:食物烘烤爐</p>
        <p type="p">30:柵欄式散熱裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="687" publication-number="202617359">
    <tif-files tif-type="multi-tif">
      <tif file="113141294.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑牙套筒結構改良</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25B13/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘瑋工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林清地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑牙套筒結構改良，尤特指套筒的一端設有一驅動部，該驅動部設有一驅動孔，作為與拆裝工具接合之用，該套筒相對於該驅動部的另一端設有一工作部，該工作部設有一工作孔，作為與螺絲或螺帽接合之用，該工作孔設有複數個呈對稱配置的接合面，由俯視觀之，複數個該接合面以該工作孔的中心處為圓心設有一偏轉角度，由側視觀之，該接合面的上部相對於水平面設有呈垂直配置的垂直部，該接合面的下部相對於水平面設有呈鈍角配置的漸縮部，當螺絲或螺帽因為磨損而變小時，利用該漸縮部保持正常的接合狀態，俾能有效避免滑牙的情形發生，為其特徵者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:套筒</p>
        <p type="p">11:驅動部</p>
        <p type="p">12:驅動孔</p>
        <p type="p">13:工作部</p>
        <p type="p">14:工作孔</p>
        <p type="p">141:接合面</p>
        <p type="p">142:垂直部</p>
        <p type="p">143:漸縮部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="688" publication-number="202618232">
    <tif-files tif-type="multi-tif">
      <tif file="113141297.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兼具密封防滲之輪胎偵測器結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01L17/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅輪實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種兼具密封防滲之輪胎偵測器結構，包括一氣嘴、一殼體、及至少一電子封蓋。該氣嘴，兩端具有一管部及一定位部，進一步貫穿氣嘴形成有一氣道、及一設於氣道一末端之O形環。該殼體，包括對合之一殼本部及一殼蓋部，其中殼本部貫穿形成有一套接孔，提供管部穿伸並與定位部形成卡阻。該電子封蓋，係與殼蓋部組接並配置於殼本部，提供一電子裝置容置。藉由上述構件之組成，方便胎壓檢測之電子裝置，可妥適的設置於輪胎中。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:氣嘴</p>
        <p type="p">120:管部</p>
        <p type="p">200:殼體</p>
        <p type="p">210:殼本部</p>
        <p type="p">216:側窗</p>
        <p type="p">220:殼蓋部</p>
        <p type="p">221:翼片</p>
        <p type="p">222:主氣孔</p>
        <p type="p">223:副氣孔</p>
        <p type="p">224:嵌接凹部</p>
        <p type="p">230:防水透氣膜</p>
        <p type="p">300:電子封蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="689" publication-number="202617405">
    <tif-files tif-type="multi-tif">
      <tif file="113141298.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙射射出成型系統</chinese-title>
        <english-title>DUAL-INJECTION MOLDING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">B29C45/76</main-classification>
        <further-classification edition="200601120250106B">B29C45/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天崗精機科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN KANG CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鳳梧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, FONG-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明雙射射出成型系統，其主要在於每一射出裝置與進料裝置間設有一料量控制裝置，該射出裝置具有一設有射出口之射出管，及一設於該射出管內之針閥單元，該料量控制裝置具有一控制單元與一止擋單元，且該針閥單元與該止擋單元分別受該控制單元控制，待該進料裝置之螺桿將物料與超臨界流體混合成一混合物後，藉由該控制單元連動該止擋單元與該針閥單元，以控制該進料裝置與該射出管間的連通狀態，及控制該射出口的封擋程度，從而控制該混合物的進料量與射出量，藉以避免出料不均而產生充填不完全之缺失，及有效提升後續成型品質與良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual-injection molding system mainly includes a control device disposed between a feeding device and each injection device. Each injection device has an injection tube, an outlet gate, and a needle valve unit disposed in the injection tube. Each control device has a control unit and a stop unit. The stop unit and the needle valve unit are controlled by the control unit. The feeding device is adapted to obtain a mixture by mixing a base material with a supercritical fluid material in a feeding tube. The stop unit is actuated to regulate a communicating state between the feeding device and each injection tube, and the needle valve unit is actuated to adjust an open area at each outlet gate, thereby controlling a feeding quantity and an injection quantity of the mixture, preventing the unequal injection of the mixture, and increasing the injection forming quality and the yield rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:雙射射出成型系統</p>
        <p type="p">31:進料裝置</p>
        <p type="p">32:射出裝置</p>
        <p type="p">33:夾模裝置</p>
        <p type="p">34:料量控制裝置</p>
        <p type="p">311:料斗</p>
        <p type="p">312:進料管</p>
        <p type="p">313:供給單元</p>
        <p type="p">314:螺桿</p>
        <p type="p">315:進料通道</p>
        <p type="p">321:射出管</p>
        <p type="p">322:進料口</p>
        <p type="p">324:針閥單元</p>
        <p type="p">331:上模</p>
        <p type="p">341:控制單元</p>
        <p type="p">342:止擋單元</p>
        <p type="p">343:計量單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="690" publication-number="202618830">
    <tif-files tif-type="multi-tif">
      <tif file="113141300.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜鍵盤的按鍵裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01H13/704</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>精元電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNREX TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KYAN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀毓嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種薄膜鍵盤的按鍵裝置，包含一下蓋、一支撐板、一彈片、一薄膜電路片、一彈性體、一上蓋，及一鍵帽。該下蓋包括一下基板，及一下凸罩。該支撐板與該下凸罩共同界定出一音效加強空間。該彈片位於該音效加強空間中。該鍵帽抵於該彈性體，並包括一帽蓋、一連接該帽蓋的柱塞，及二自該柱塞向下延伸的支腳。該等支腳伸入該音效加強空間內，且其中一該支腳抵於該彈片。當按壓該鍵帽時，其中一該支腳抵推該彈片使該彈片變形並蓄積一彈性力，當鬆開該鍵帽時，該彈性體推抵該鍵帽向上位移，該彈片釋放該彈性力並撞擊其中一該支腳而發出聲音。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:下蓋</p>
        <p type="p">11:下基板</p>
        <p type="p">12:下凸罩</p>
        <p type="p">2:支撐板</p>
        <p type="p">21:音效空間</p>
        <p type="p">32:變形部</p>
        <p type="p">321:延伸段</p>
        <p type="p">322:第一接觸段</p>
        <p type="p">323:第一彎折段</p>
        <p type="p">324:第二接觸段</p>
        <p type="p">325:第二彎折段</p>
        <p type="p">4:薄膜電路片</p>
        <p type="p">5:彈性體</p>
        <p type="p">6:橡膠片</p>
        <p type="p">7:上蓋</p>
        <p type="p">71:上基板</p>
        <p type="p">72:上圍繞壁</p>
        <p type="p">73:容納空間</p>
        <p type="p">8:鍵帽</p>
        <p type="p">81:帽蓋</p>
        <p type="p">82:柱塞</p>
        <p type="p">821:側圍壁</p>
        <p type="p">822:抵接壁</p>
        <p type="p">83:支腳</p>
        <p type="p">831:推靠部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="691" publication-number="202618188">
    <tif-files tif-type="multi-tif">
      <tif file="113141307.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧能源管理系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>INTELLIGENT AIR CONDITIONING CONTROL SYSTEM, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">F24F11/46</main-classification>
        <further-classification edition="201801120250203B">F24F11/30</further-classification>
        <further-classification edition="200601120250203B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池定源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIH, TING YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡林陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, LIN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張秦耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董名峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, MING FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛清益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, CHING YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種智慧能源管理系統及其方法，透過感測溫控區域外部的流體狀態，以計算出該外部流體之外部流體焓值，再與預先設定之焓值標準值進行比較，俾依據焓值判定結果以調整冷卻元件之控制參數，因此，本發明能依據溫控區域之溫溼度要求，提供空調設備製冷以及依該外部流體焓值之高低進行引入控制，故能減少空調設備之運轉而達到節能目的。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an intelligent air conditioning control system and a method thereof. By sensing the fluid state outside a temperature control area, an external fluid enthalpy value of an external fluid is calculated, and then compared with a preset enthalpy standard value to adjust the control parameters of cooling elements based on the determination result of enthalpy value. Based on the temperature and humidity requirements of the temperature control area, the present invention can provide refrigeration for air conditioning equipment and introduction control based on the enthalpy value of the external fluid, so it can reduce the operation of the air conditioning equipment and achieve energy saving purposes. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:智慧能源管理系統</p>
        <p type="p">11:環境監測模組</p>
        <p type="p">12:焓值計算模組</p>
        <p type="p">13:比對模組</p>
        <p type="p">14:調控模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="692" publication-number="202618805">
    <tif-files tif-type="multi-tif">
      <tif file="113141321.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141321</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>疾病共病預測模型建構之方法</chinese-title>
        <english-title>METHOD FOR CONSTRUCTING DISEASE COMORBIDITY PREDICTION MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250102B">G16H50/50</main-classification>
        <further-classification edition="201801120250102B">G16H50/70</further-classification>
        <further-classification edition="200601120250102B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯新國際醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDSEED INTERNATIONAL HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇立仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭景鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, JING-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳立青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康曉妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HSIAO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐沺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳清平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-PYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種疾病共病預測模型建構之方法，包含接收一樣本資料，對該樣本資料進行篩選及分析，利用調和中心度、中介中心度找出重要核心疾病與橋樑疾病，以建立一共病預測模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for constructing a disease comorbidity prediction model, which includes receiving a sample data, screening and analyzing the sample data, and using harmonic centrality and betweenness centrality to find important core diseases and bridge diseases to establish a comorbidity prediction model.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="693" publication-number="202618806">
    <tif-files tif-type="multi-tif">
      <tif file="113141322.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>疾病預測模型之建構方法</chinese-title>
        <english-title>METHOD FOR CONSTRUCTING DISEASE PREDICTION MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241204B">G16H50/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯新國際醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDSEED INTERNATIONAL HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇立仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭景鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, JING-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳立青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康曉妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HSIAO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐沺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳清平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-PYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種疾病預測模型的建構方法。首先，對患有目標疾病的病人進行全基因組關聯性研究，篩選出相關的SNP位點。接著，隨機篩選兩個SNP位點作為初始目標組合，並訓練第一機器學習模型以進行疾病預測，驗證其準確率。隨後，將剩餘的SNP位點逐一加入初始組合中，生成多個新組合，並訓練和驗證相應的疾病預測模型。在這些新組合中，選擇預測準確率最高的組合作為新的目標組合。重複此過程，直到所有SNP位點都被納入，最終確定最佳的SNP目標組合，用於疾病預測模型的最終訓練和預測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for constructing a disease prediction model is provided. First, a genome-wide association study (GWAS) is conducted on patients with the target disease to identify relevant SNP loci. Next, two SNP loci are randomly selected as the initial target combination, and the first machine learning model is trained for disease prediction, with its accuracy verified. Subsequently, the remaining SNP loci are sequentially added to the initial combination to generate multiple new combinations, and the corresponding disease prediction models are trained and validated. Among these new combinations, the one with the highest prediction accuracy is selected as the new target combination. This process is repeated until all SNP loci are included, ultimately determining the optimal SNP target combination for the final training and prediction of the disease prediction model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105-170:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="694" publication-number="202617452">
    <tif-files tif-type="multi-tif">
      <tif file="113141323.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線胎壓偵測器之車輪定位系統</chinese-title>
        <english-title>WIRELESS TIRE PRESSURE DETECTOR WHEEL ALIGNMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B60C23/04</main-classification>
        <further-classification edition="201201120241204B">B60W40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>系統電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYSGRATION LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴紀丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHI CHIENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線胎壓偵測器之車輪定位系統，包括：感測單元，與複數車輪相關聯配置，感測單元用以感測各車輪之齒輪數並提供獨一識別之車輪身分資料；控制單元，電性連接感測單元；第一儲存單元、第二儲存單元及關聯儲存單元，分別電性連接控制單元；其中，控制單元將第二儲存單元所儲存之數值與第一儲存單元所儲存之數值相互查照，並將查照的結果依序儲存至關聯儲存單元進行比對，以獲得各車輪所對應之車輪身份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wheel positioning system with a wireless tire pressure detector, including: a sensing unit, configured in association with a plurality of wheels, the sensing unit is used to sense the number of gears of each wheel and provide uniquely identified wheel identity data; a control unit , electrically connected to the sensing unit; the first storage unit, the second storage unit and the associated storage unit are respectively electrically connected to the control unit; wherein, the control unit compares the value stored in the second storage unit with the value stored in the first storage unit. The values ​​are checked with each other, and the results of the checks are sequentially stored in the associated storage unit for comparison to obtain the wheel identity data corresponding to the wheel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:控制單元</p>
        <p type="p">4:第一儲存單元</p>
        <p type="p">40:齒輪數區</p>
        <p type="p">5:第二儲存單元</p>
        <p type="p">50:感測時間區</p>
        <p type="p">51:車輪身分區</p>
        <p type="p">52:時間接收推移區</p>
        <p type="p">6:關聯儲存單元</p>
        <p type="p">60:比對車輪身分區</p>
        <p type="p">61:比對左前車輪關聯齒數區</p>
        <p type="p">62:比對右前車輪關聯齒數區</p>
        <p type="p">63:比對左後車輪關聯齒數區</p>
        <p type="p">64:比對右後車輪關聯齒數區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="695" publication-number="202619435">
    <tif-files tif-type="multi-tif">
      <tif file="113141328.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H05K3/46</main-classification>
        <further-classification edition="200601120250102B">H05K3/40</further-classification>
        <further-classification edition="200601120250102B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪佳慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板包含第一電路基板、第二電路基板、設置於第一電路基板與第二電路基板之間的環形中介板以及導體元件。第一電路基板的第一環形溝槽具有第一內部延伸溝槽。第一電路基板的第一導電層設置於第一內部延伸溝槽的底表面與側壁。第二電路基板的第二環形溝槽具有第二內部延伸溝槽。第二電路基板的第二導電層設置於第二內部延伸溝槽的底表面與側壁。環形中介板位於第一環形溝槽與第二環形溝槽內。導體元件設置於第一內部延伸溝槽以及第二內部延伸溝槽中，並電性連第一導電層與第二導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board includes a first circuit base board, a second circuit base board, an annular interposer disposed between the first circuit base board and the second circuit base board, and a conductor element. A first annular groove of the first circuit base board has a first internal extension groove. A first conductive layer of the first circuit base board is disposed on a bottom surface and a sidewall of the first internal extension groove. The second annular groove of the second circuit base board has a second internal extension groove. A second conductive layer of the second circuit base board is disposed on a bottom surface and a sidewall of the second internal extension groove. The annular interposer is located in the first annular groove and the second annular groove. The conductor element is disposed in the first internal extension groove and the second internal extension groove and electrically connects the first conductive layer and the second conductive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電路板</p>
        <p type="p">100:環形中介板</p>
        <p type="p">200:導體元件</p>
        <p type="p">400:外部電子元件</p>
        <p type="p">500:第一電路基板</p>
        <p type="p">510:第一導電層</p>
        <p type="p">520:磁鐵</p>
        <p type="p">530:屏蔽材料</p>
        <p type="p">600:第二電路基板</p>
        <p type="p">610:第二導電層</p>
        <p type="p">620:磁吸體</p>
        <p type="p">IR1:第一內部區域</p>
        <p type="p">IR2:第二內部區域</p>
        <p type="p">ER1:第一外部區域</p>
        <p type="p">ER2:第二外部區域</p>
        <p type="p">S3:內表面</p>
        <p type="p">S4:外表面</p>
        <p type="p">TS:頂表面</p>
        <p type="p">BS3:底表面</p>
        <p type="p">CA:空腔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="696" publication-number="202618807">
    <tif-files tif-type="multi-tif">
      <tif file="113141329.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於病原體基因分析的人工智能平台系統及其方法</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE PLATFORM SYSTEM FOR PATHOGEN GENE ANALYSIS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241202B">G16H50/80</main-classification>
        <further-classification edition="201801120241202B">G16H50/00</further-classification>
        <further-classification edition="201901120241202B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國防醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL DEFENSE MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>商弘昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANG, HUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林泰瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TAI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡明志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, MING-JR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾欣怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭成立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERNG, CHERNG-LIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王怡惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於病原體基因分析的人工智能平台系統，包括通訊模組、機器學習模組及特徵分析模組。通訊模組用以接收及傳輸資訊。機器學習模組用以接收歷史定量聚合酶鏈反應資訊、基因序列資訊及PCR反應資訊，並使用一監督式機器學習模型分析PCR反應資訊，以得到一基因擴增預測結果。特徵分析模組用以對PCR反應資訊的六大類型特徵進行一影響力分析，以分析出每個特徵對上述基因擴增預測結果的各別影響力，再依據一篩選條件選擇多個特徵，再將多個特徵回饋至機器學習模組，再次分析PCR反應資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An artificial intelligence platform system for pathogen gene analysis includes a communication module, a machine learning module, and a feature analysis module. The communication module is configured to receive and transmit information. The machine learning module is configured to receive historical quantitative polymerase chain reaction information, gene sequence information, and PCR reaction information, and to analyze the PCR reaction information using a supervised machine learning model to obtain a gene amplification prediction result. The feature analysis module is configured to conduct an impact analysis of six major types of features from the PCR reaction information to determine the individual influence of each feature on the gene amplification prediction result. Based on a selection criterion, multiple features are selected, which are then fed back to the machine learning module for further analysis of the PCR reaction information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用於病原體基因分析的人工智能平台系統</p>
        <p type="p">110:通訊模組</p>
        <p type="p">120:機器學習模組</p>
        <p type="p">130:特徵分析模組</p>
        <p type="p">140:基因擴增資料庫</p>
        <p type="p">150:模型驗證模組</p>
        <p type="p">160:使用者介面</p>
        <p type="p">170:外部資料庫</p>
        <p type="p">180:主機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="697" publication-number="202617487">
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      <tif file="113141332.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遠端診斷電動汽車的動力系統故障的方法</chinese-title>
        <english-title>METHODS FOR REMOTELY DIAGNOSING FAULTS IN POWERTRAIN OF ELECTRIC VEHICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">B60W50/04</main-classification>
        <further-classification edition="202001120241128B">G16Y20/20</further-classification>
        <further-classification edition="202001120241128B">G16Y40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海科絡達雲軟體技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAROTA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章鑫傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XINJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於遠端診斷電動汽車的動力系統故障的方法。該方法可以包括：採集電動汽車的動力系統的即時資料；將即時資料傳輸至雲平臺；利用隨機森林模型對即時資料進行特徵重要程度排序；採用類比退火演算法優化隨機森林模型的超參數；將優化後的隨機森林模型部署在雲平臺上，用於進行即時故障分類和診斷；利用雲平臺提供電動汽車的動力系統的即時故障警報和診斷報告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a method for remotely diagnosing faults in a powertrain of an electric vehicle. The method can comprise collecting real-time data from the powertrain of the electric vehicle; transmitting the real-time data to a cloud platform; ranking a feature importance on the real-time data using a random forest model; optimizing hyperparameters of the random forest model using a simulated annealing algorithm; deploying the optimized random forest model on the cloud platform for real-time fault classification and diagnosis; and using the cloud platform to provide real-time fault alerts and diagnostic reports for the powertrain of the electric vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:從車載感測器採集電動汽車的動力系統的即時資料</p>
        <p type="p">S102:所採集的電動汽車的動力系統的即時資料傳輸到雲平臺</p>
        <p type="p">S103:利用機器學習演算法對即時資料進行特徵重要程度排序</p>
        <p type="p">S104:優化所述隨機森林模型的超參數。</p>
        <p type="p">S105:將優化後的隨機森林模型部署到雲平臺上，用於進行即時故障分類和診斷</p>
        <p type="p">S106:提供電動汽車的動力系統的即時故障警報和診斷報告</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="698" publication-number="202618215">
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      <tif file="113141333.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618215</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>立體掃描裝置及其掃描建模方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01B11/03</main-classification>
        <further-classification edition="200601120241204B">G06T17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭瑞鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種立體掃描裝置及其掃描建模方法，該立體掃描裝置包含一可受操作而啟閉的外殼、一測距模組、一掃描平台、一控制模組，及一電源模組。該測距模組包括一可拆離地設置於該外殼上的支架，及複數設置於該支架上的光學測距儀。本發明可將該測距模組、該掃描平台、該控制模組，及該電源模組收整於該外殼中，從而可如手提箱般收整該立體掃描裝置，具高可攜性及高機動性。本發明還可依待測物體大小而選擇將該待測物體置放於該掃描平台上，或將該測距模組拆離該外殼，並透過繞行的方式對該待測物體掃描，甚至可透過多台立體掃描裝置進行掃描，具有高泛用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:外殼</p>
        <p type="p">11:箱體</p>
        <p type="p">111:容置空間</p>
        <p type="p">12:收折接頭</p>
        <p type="p">2:測距模組</p>
        <p type="p">21:支架</p>
        <p type="p">211:立柱</p>
        <p type="p">212:展臂</p>
        <p type="p">22:光學測距儀</p>
        <p type="p">3:掃描平台</p>
        <p type="p">31:調整架</p>
        <p type="p">32:步進馬達</p>
        <p type="p">33:承放台座</p>
        <p type="p">4:控制模組</p>
        <p type="p">5:電源模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="699" publication-number="202618117">
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      <tif file="113141335.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可旋轉開啟之平面門窗結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">E06B3/32</main-classification>
        <further-classification edition="200601120241204B">E06B3/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟鈺智能全球有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可旋轉開啟之平面門窗結構，其包括一固定門窗框以及裝設在該固定門窗框中的一第一內門窗框與一第二內門窗框，該第一內門窗框與該固定門窗框相互樞接，該第二內門窗框能沿該固定門窗框上所設的一軌道移動，該軌道包含一直線段以及朝同一側彎曲延伸的二彎曲段。該第二內門窗框能移動至與該第一內門窗框左右直線排列而呈關閉狀態，也能移動至與該第一內門窗框前後相疊而遮蔽該固定門窗框的一半，且該第一內門窗框和該第二內門窗框也能同時向外旋轉開啟，使該固定門窗框能將近完全敞開，以提供最佳視野以及良好的通風效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一內門窗框</p>
        <p type="p">11:內縱框條</p>
        <p type="p">20:第二內門窗框</p>
        <p type="p">21:移動導桿</p>
        <p type="p">22:滑輪</p>
        <p type="p">30:固定門窗框</p>
        <p type="p">31:外橫框條</p>
        <p type="p">32:軌道</p>
        <p type="p">321:直線段</p>
        <p type="p">322:彎曲段</p>
        <p type="p">33:限位片</p>
        <p type="p">331:限位凹口</p>
      </representative-img>
    </description>
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  <tw-patent-application no="700" publication-number="202618123">
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      <tif file="113141336.zip" no="1">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除垢裝置</chinese-title>
        <english-title>DESCALING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">E21B21/14</main-classification>
        <further-classification edition="200601120241204B">E21B37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楠輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NAN-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖彥喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YEN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李充椉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種除垢裝置，包括電磁閥、蓄壓段、上封塞段、衝擊釋放段及下封塞段。電磁閥用以切換壓力流體之流動方向。蓄壓段連接於電磁閥，蓄壓段用以將加壓後之壓力流體於蓄壓段之內而得到加壓流體。上封塞段連接於蓄壓段。衝擊釋放段連接於上封塞段，其中衝擊釋放段包括複數個釋放孔，加壓流體由蓄壓段經由上封塞段而被傳輸至衝擊釋放段，加壓流體擠壓衝擊釋放段內水體產生噴流。下封塞段連接於衝擊釋放段，上封塞段與下封塞段之間構成封隔區段，封隔區段能限制噴流朝衝擊釋放段的這些釋放孔釋放出後，並於封隔區段內對管體之壁面作用而不溢散至封隔區段外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A descaling device is provided. The device includes an electromagnetic valve, a pressure storage section, an upper packer section, an impact release section, and a lower packer section. The electromagnetic valve is used to switch a flow direction of pressure fluid. The pressure storage section is connected to the electromagnetic valve and contains the pressure fluid, resulting in pressurized fluid within the storage section. The upper packer section is connected to the pressure storage section. The impact release section is connected to the upper packer section, where the impact release section includes multiple release openings. The Pressurized fluid is transmitted from the pressure storage section through the upper packer section to the impact release section, causing the pressurized fluid to compress the water in the impact release section and generate jets. The lower packer section is connected to the impact release section, creating an isolation zone between the upper packer sections and the lower packer sections, which restricts the jets from escaping through the release openings of the impact release section, and then act on the wall of the pipe within the isolation zone without overflowing outside the isolation zone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:除垢裝置</p>
        <p type="p">110:電磁閥</p>
        <p type="p">120:蓄壓段</p>
        <p type="p">122:蓄壓殼體</p>
        <p type="p">130:上封塞段</p>
        <p type="p">132:上封塞部</p>
        <p type="p">134:上固定座</p>
        <p type="p">140:衝擊釋放段</p>
        <p type="p">142:管體</p>
        <p type="p">144:止擋部</p>
        <p type="p">150:下封塞段</p>
        <p type="p">152:下封塞部</p>
        <p type="p">154:下固定座</p>
        <p type="p">AR:封隔區段</p>
        <p type="p">HA:釋放孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="701" publication-number="202619091">
    <tif-files tif-type="multi-tif">
      <tif file="113141338.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶粒之接合墊及具有該晶粒的電子裝置</chinese-title>
        <english-title>BONDING PADS FOR DIES AND ELECTRONIC DEVICES HAVING THE DIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01L23/48</main-classification>
        <further-classification edition="200601120250102B">H01L23/488</further-classification>
        <further-classification edition="200601120250102B">H01L23/538</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旋乃仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUAN, NAI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種晶粒之接合墊及具有該晶粒的電子裝置。電子裝置包含一載板、一第一晶粒及一第二晶粒。第一晶粒設置於該載板上，並且包含一第一接合墊及一第二接合墊。第二晶粒設置於該載板上，並且包含一第三接合墊及一第四接合墊。該第一接合墊透過一第一接合線直接連接該第三接合墊，且該第二接合墊透過一第二接合線直接連接該第四接合墊。該第一接合墊具有一內凹空間，且該第二接合墊設置於該內凹空間中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a bonding pad for a die and an electronic device having the die. The electronic device includes a carrier, a first die, and a second die. The first die is disposed on the carrier and includes a first bonding pad and a second bonding pad. The second die is disposed on the carrier and includes a third bonding pad and a fourth bonding pad. The first bonding pad is directly connected to the third bonding pad through a first bonding wire, and the second bonding pad is directly connected to the fourth bonding pad through a second bonding wire. The first bonding pad has a recessed space, and the second bonding pad is disposed in the recessed space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電子裝置</p>
        <p type="p">205:載板</p>
        <p type="p">210,220:晶粒</p>
        <p type="p">212,214,222,224:接合墊</p>
        <p type="p">201,202,203:接合線</p>
        <p type="p">A-A':橫截面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="702" publication-number="202618652">
    <tif-files tif-type="multi-tif">
      <tif file="113141339.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銀行客戶整合帳戶查詢系統</chinese-title>
        <english-title>INTEGRATED ACCOUNT INQUIRY SYSTEM FOR BANK CUSTOMERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q40/02</main-classification>
        <further-classification edition="200601120250203B">G06F17/40</further-classification>
        <further-classification edition="201301120250203B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永豐商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANK SINOPAC COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊文淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEN YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂姿鈴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TZU LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傳銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUAN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范姜峻浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN JIANG, JUN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, KUO JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈珮騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, PEI CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周恩卉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, EN HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳致賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JHIH SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種銀行客戶整合帳戶查詢系統，包括：網路銀行伺服器；智慧收支帳本伺服器，通訊地連接上述網路銀行伺服器；系統資料庫，通訊地連接上述智慧收支帳本伺服器，儲存帳戶資料；以及使用者終端，通訊地連接上述網路銀行伺服器；其中上述使用者終端，經由上述網路銀行伺服器訪問智慧收支帳本伺服器，用於查詢儲存於系統資料庫的帳戶資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention disclosed an integrated account inquiry system for bank customers, which includes an online banking server, a smart income and expenditure account server communicatively connected to the online banking server, a system database communicatively connected to the smart income and expenditure account server to store account information, and a user terminal communicatively connected to the online banking server. The user terminal can access the smart income and expenditure server through the online banking server for querying the account information stored in the system database.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:銀行客戶整合帳戶查詢系統</p>
        <p type="p">201:行動銀行網路伺服器</p>
        <p type="p">202:銀行客戶</p>
        <p type="p">202a:使用者終端</p>
        <p type="p">203:大戶網路伺服器</p>
        <p type="p">205:智慧收支帳本網路伺服器</p>
        <p type="p">207:智慧收支帳本中台API伺服器</p>
        <p type="p">211:使用者介面</p>
        <p type="p">221:核心下傳介面資料庫</p>
        <p type="p">223:網路銀行交易資料庫</p>
        <p type="p">225:核心資料彙整系統</p>
        <p type="p">227:信用卡資料倉儲</p>
        <p type="p">229:系統資料庫</p>
        <p type="p">231:ETL伺服器</p>
        <p type="p">233:預發佈伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="703" publication-number="202618476">
    <tif-files tif-type="multi-tif">
      <tif file="113141345.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具機空間精度資料收集與補償之AI數據優化應用方法</chinese-title>
        <english-title>AI DATA OPTIMIZATION APPLICATION METHOD FOR COLLECTING AND COMPENSATING SPATIAL ACCURACY DATA OF MACHINE TOOLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">G05B19/401</main-classification>
        <further-classification edition="200601120250106B">G05B19/404</further-classification>
        <further-classification edition="201901120250106B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覺文郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JYWE, WEN-YUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝東賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張祐維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾政中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, JHENG-JHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　亮傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIDYANATA, WINSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為解決在工機具補償方，而需要對許多機台的機構進行連續分析，耗費大量時間和資源的問題，本發明提供一種工具機空間精度資料收集與補償之AI數據優化應用方法，步驟一、安裝與校準；步驟二、確定數據收集點；步驟三、玻璃球透鏡校準與坐標記錄；步驟四、測量與誤差測試；步驟五、多次誤差項目測試、步驟六、移動該玻璃球透鏡至新位置、步驟七、重複測量、步驟八、數據處理與縮放、步驟九、訓練機器學習模型、步驟十、合併模型、步驟十一、最佳化誤差補償、步驟十二、進行誤差補償。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To address the issue of requiring continuous analysis of the mechanisms of many machines for tool compensation, which consumes a significant amount of time and resources, the present invention provides an AI data optimization application method for collecting and compensating spatial precision data of machine tools. The steps are as follows: Installation and calibration; Determining data collection points; Calibration of the glass ball lens and coordinate recording; Measurement and error testing; Multiple error item testing; Moving the glass ball lens to a new position; Repeating measurements; Data processing and scaling; Training the machine learning model; Merging models; Optimizing error compensation; Performing error compensation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="704" publication-number="202618733">
    <tif-files tif-type="multi-tif">
      <tif file="113141348.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以人工智慧外語學習自身訓練系統及其方法</chinese-title>
        <english-title>FOREIGN LANGUAGE LEARNING SELF-TRAINING SYSTEM AND METHOD THEREOF USING ARTIFICIAL INTELLIGENCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G09B19/06</main-classification>
        <further-classification edition="201301120241204B">G10L13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡韋德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以人工智慧外語學習自身訓練方法包含：由一用戶學習者選擇指定至少一語音模型；提供至少一用戶自聲基礎語音資料，且該用戶自聲基礎語音資料由該用戶學習者進行錄製；經由該語音模型利用該用戶自聲基礎語音資料以一人工智慧語音處理模組模擬產生至少一已模擬用戶自聲外語資料；及利用該已模擬用戶自聲外語資料對應結合一預定外語學習資料，以產生至少一模擬用戶自聲練習外語資料，且該用戶學習者反覆將該模擬用戶自聲練習外語資料用於一外語練習作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A foreign language learning self-training method for includes: a trainee user selecting at least one voice model; providing at least one fundamental self-voice data of trainee user which is recorded by the trainee user; processing the fundamental self-voice data of trainee user by an AI voice processing model via the voice model to generate at least one simulated foreign language self-voice data of trainee user; combining the simulated foreign language self-voice data of trainee user with a predetermined foreign language learning data to generate at least one simulated foreign language self-training voice data of trainee user which can be repeatedly used in a foreign language learning operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:用戶自聲基礎語音資料</p>
        <p type="p">2:計算機單元</p>
        <p type="p">21:語音模型</p>
        <p type="p">22:人工智慧語音處理模組</p>
        <p type="p">3:已模擬用戶自聲外語資料</p>
        <p type="p">4:預定外語學習資料</p>
        <p type="p">40:模擬用戶自聲練習外語資料</p>
        <p type="p">41:外語聽力練習資料</p>
        <p type="p">42:模擬對話練習資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="705" publication-number="202618087">
    <tif-files tif-type="multi-tif">
      <tif file="113141349.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紡絲裝置</chinese-title>
        <english-title>SPINNING DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">D04H3/16</main-classification>
        <further-classification edition="200601120241125B">D01D13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐錦祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宜璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-SHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, TA-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種紡絲裝置，其包括入料口、螺桿擠壓組件、紡絲箱體、拆卸式溫控組件、承接板件以及收捲組件。螺桿擠壓組件連接入料口。紡絲箱體連接螺桿擠壓組件。拆卸式溫控組件設置於紡絲箱體下方，其中紡絲箱體的長度與拆卸式溫控組件的長度的比為1：1~2.5。承接板件固定於紡絲箱體的一端，且承接板件位於紡絲箱體與拆卸式溫控組件之間。收捲組件耦接拆卸式溫控組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a spinning device, which includes a feed inlet, a screw extrusion component, a spinning box, a detachable temperature control component, a receiving plate component, and a winding component. The screw extrusion component is connected to the feed inlet. The spinning box is connected to the screw extrusion component. The detachable temperature control component is disposed below the spinning box, and a ratio of a length of the spinning box to a length of the detachable temperature control component is 1:1~2.5. The receiving plate component is fixed on one end of the spinning box, and the screw extrusion component is between the spinning box and the detachable temperature control component. The winding component is coupled to the detachable temperature control component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:紡絲裝置</p>
        <p type="p">110:入料口</p>
        <p type="p">120:螺桿擠壓組件</p>
        <p type="p">130:紡絲箱體</p>
        <p type="p">132:紡口組件</p>
        <p type="p">140:拆卸式溫控組件</p>
        <p type="p">150:承接板件</p>
        <p type="p">160:收捲組件</p>
        <p type="p">170:傳動組件</p>
        <p type="p">180:計量泵</p>
        <p type="p">190:羅拉</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="706" publication-number="202617431">
    <tif-files tif-type="multi-tif">
      <tif file="113141350.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻燃抗彎曲複合基板的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD FOR FLAME-RETARDANT AND BENDING-RESISTANT COMPOSITE SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">B32B27/02</main-classification>
        <further-classification edition="201901120241104B">B32B7/02</further-classification>
        <further-classification edition="200601120241104B">C09K21/14</further-classification>
        <further-classification edition="200601120241104B">D02G1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳述亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪滉進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, HUANG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈健生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, JIAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種阻燃抗彎曲複合基板的製造方法包括：開鬆混合複數根碳纖維與複數根阻燃聚碳酸酯纖維，其中阻燃聚碳酸酯纖維的伸長率為81%至105%，且阻燃聚碳酸酯纖維的捲縮數為6峰頂/25毫米至7峰頂/25毫米；梳理混合後的碳纖維及阻燃聚碳酸酯纖維，使碳纖維及阻燃聚碳酸酯纖維產生排列取向；舖展梳理後的碳纖維及阻燃聚碳酸酯纖維，使碳纖維及阻燃聚碳酸酯纖維堆疊為纖維網；以及壓合纖維網，使纖維網成型為阻燃抗彎曲複合基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for a flame-retardant and bending-resistant composite substrate includes the following steps: loosening and mixing multiple carbon fibers with multiple flame-retardant polycarbonate fibers, in which an elongation of the flame-retardant polycarbonate fibers is 81% to 105%, and a crimp number of the flame-retardant polycarbonate fibers is 6 crimps/25mm to 7 crimps/25mm; carding the mixed carbon fibers and flame-retardant polycarbonate fibers to align them in an oriented arrangement; spreading the carded carbon fibers and flame-retardant polycarbonate fibers to form a stacked fiber web; and pressing the fiber web to mold it into the flame-retardant and bending-resistant composite substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S40:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="707" publication-number="202617166">
    <tif-files tif-type="multi-tif">
      <tif file="113141354.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網格紋導電石墨烯鈦鍺貼布</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A61K33/44</main-classification>
        <further-classification edition="201901120241106B">A61K33/24</further-classification>
        <further-classification edition="200601120241106B">A61K36/48</further-classification>
        <further-classification edition="200601120241106B">A61K36/53</further-classification>
        <further-classification edition="200601120241106B">A61K36/9068</further-classification>
        <further-classification edition="200601120241106B">A61K36/534</further-classification>
        <further-classification edition="200601120241106B">A61P29/00</further-classification>
        <further-classification edition="202401120241106B">A61F13/02</further-classification>
        <further-classification edition="200601120241106B">A61N5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大濟製藥廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳峻偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳行一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種網格紋導電石墨烯鈦鍺貼布，主要係包括一表層，其係為彈性基布，表面設有由石墨烯粉、鈦粉、鍺粉等構成之石墨烯鈦鍺網格紋；一中層，係設置於該表層之下表面的下方，其係由能量粉、闊葉大豆(一條根)萃取液、精油及添加物等混合物所構成之膏體；一底層，係設置於該中層之下表面的下方，其係為離形紙。藉由石墨烯鈦鍺網格紋與膏體之組構作用，聚集能量及光速，達到最完整之量子疊加及磁場共振，使增強之遠紅外線具有導電性與導熱性，藉由人體的溫度與人體產生共振，讓人體可快速由內而外感受到了熱量，透過能量傳導，重點深入痠痛部位，舒緩筋骨疲勞，達到如實質針灸後之舒緩功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:表層</p>
        <p type="p">2:中層</p>
        <p type="p">3:底層</p>
        <p type="p">4:石墨烯鈦鍺網格紋</p>
        <p type="p">A:網格紋導電石墨烯鈦鍺貼布</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="708" publication-number="202617134">
    <tif-files tif-type="multi-tif">
      <tif file="113141355.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過減少筋膜粘連來緩解肌肉緊張的外用組合物及其塗抹裝置</chinese-title>
        <english-title>TOPICAL COMPOSITION AND APPLICATION DEVICE FOR ALLEVIATING MUSCLE TENSION BY REDUCING FASCIA ADHESIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K31/07</main-classification>
        <further-classification edition="200601120250501B">A61K31/355</further-classification>
        <further-classification edition="200601120250501B">A61K31/375</further-classification>
        <further-classification edition="200601120250501B">A61K31/4415</further-classification>
        <further-classification edition="200601120250501B">A61K31/51</further-classification>
        <further-classification edition="200601120250501B">A61K31/525</further-classification>
        <further-classification edition="200601120250501B">A61K31/714</further-classification>
        <further-classification edition="200601120250501B">A61K8/67</further-classification>
        <further-classification edition="200601120250501B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>得健科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEJIAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃奕銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恩睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, EN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種外用組合物及其塗抹裝置，該外用組合物旨在通過直接針對筋膜粘連來緩解肌肉緊張並提升運動表現。該外用組合物包括平衡的必需維生素混合物，包括維生素A、維生素B群、維生素C及維生素E，這些維生素以實質上等比例的重量比存在，優選為1:1:1:1。這些維生素被加入到適合外用的載體中，如水、乙醇、油類或矽基材料。該外用組合物可能還包括滲透增強劑、抗氧化劑、潤膚劑、防腐劑及乳化劑，以提升吸收和穩定性。當塗抹並按摩於皮膚時，該外用組合物促進維生素進入筋膜組織，促進筋膜粘連的分解，減少肌肉緊繃，並改善肌肉收縮效率及柔韌性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A topical composition and its application device are provided. The topical composition is formulated to alleviate muscle tension and enhance athletic performance by directly addressing fascia adhesions. The topical composition comprises a balanced mixture of essential vitamins—including Vitamin A, Vitamin B Complex, Vitamin C, and Vitamin E—present in substantially equal proportions by weight, preferably in a 1:1:1:1 ratio. These vitamins are incorporated into a pharmaceutically acceptable carrier suitable for topical administration, such as water, ethanol, oils, or silicone-based materials. The composition may further include skin penetration enhancers, antioxidants, emollients, preservatives, and emulsifiers to enhance absorption and stability. When applied and massaged into the skin, the composition facilitates the absorption of vitamins into fascia tissues, promoting the breakdown of fascia adhesions, reducing muscle tightness, and improving muscle contraction efficiency and flexibility.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="709" publication-number="202619360">
    <tif-files tif-type="multi-tif">
      <tif file="113141357.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電盒和耳機套件</chinese-title>
        <english-title>CHARGING CASE AND EARBUDS ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">H04R1/02</main-classification>
        <further-classification edition="200601120250108B">H04R5/033</further-classification>
        <further-classification edition="202501120250108B">H05K5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉水松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHUISONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種充電盒和耳機套件，充電盒包括上蓋、導向件、下殼、轉動軸以及轉動件。上蓋包括蓋體以及設置於蓋體內的第一內襯。導向件固定設置於第一內襯上。轉動軸固定設置於下殼上。轉動件的下端轉動設置於轉動軸上，轉動件的上端通過導向槽與導向件滑動連接。轉動件處於上蓋的第一位置時朝向下殼的中心傾斜，轉動件處於上蓋的第二位置時朝向下殼的外側傾斜，上蓋的第一位置朝向上蓋的第二位置方向為充電盒的開蓋方向。由此，充電盒通過轉動件的轉動抬升上蓋，使得上蓋開關時能夠避開耳機，從而達到順滑開關的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the present invention provide a charging case and a earbuds assembly, and the charging case includes an upper lid, a direction component, a lower lid, a rotation axis and a rotation component. The upper lid includes a covering body and a first lining disposed inside the covering body. The direction component is fixedly disposed on the first lining. The rotation axis is fixedly disposed on the lower lid. The lower end of the rotation component is rotatably disposed on the rotation axis, and the upper end of the rotation component is slidably connected to the direction component by a directional groove. The rotation component is inclined to the center of the lower lid when being on the first position of the lower lid, and the rotation component is inclined to the outer side of the lower lid when being on the second position of the lower lid, and the direction from the first position of the lower lid to the second position of the lower lid is the opening direction of the charging case. Hereby, the charging case lift the upper lid by the rotation of the rotation component so that the upper lid can avoid earbuds when being open or closed, thereby achieving smooth opening and closing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:蓋體</p>
        <p type="p">12:上內襯</p>
        <p type="p">2:導向件</p>
        <p type="p">21:導向槽</p>
        <p type="p">31:安裝槽</p>
        <p type="p">33:殼體</p>
        <p type="p">34:下內襯</p>
        <p type="p">4:轉動軸</p>
        <p type="p">5:轉動件</p>
        <p type="p">6:扭轉彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="710" publication-number="202619305">
    <tif-files tif-type="multi-tif">
      <tif file="113141358.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>近場通訊測試裝置和系統</chinese-title>
        <english-title>NEAR FIELD COMMUNICATION TEST DEVICE AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">H04B5/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造（浙江）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE ITECH(ZHEJIANG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃襄臨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIANGLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種近場通訊測試裝置和系統，通過設置對待測物進行第一功能模式的測試時，第一功能測試電路和第一線圈電連接，對待測物進行第二功能模式的測試時，第二功能測試電路至少與第二線圈電連接，第一線圈在設定平面內的正投影與第二線圈在設定平面內的正投影至少部分重合，使得在同一測試工站即可實現對待測物進行第一功能模式和第二功能模式的測試。本發明可以減少搭設測試工站的總時間，進而減少測試時間，降低人力成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a near field communication test device and system. A first functional test circuit and a first coil are electrically connected when an object under test is tested in a first functional mode. A second functional test circuit and a second coil are electrically connected when the object under test is tested a second functional mode. An orthographic projection of the first coil in a set plane and an orthographic projection of the second coil in the set plane are at least partially coincided. Therefore, the test of the first functional mode and the second functional mode of the object under test can be carried out at the same testing station. The purpose of reducing the total time for setting up a test station to reducing test time and labor costs is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一線圈</p>
        <p type="p">120:第二線圈</p>
        <p type="p">130:測試電路板</p>
        <p type="p">131:第一功能測試電路</p>
        <p type="p">132:第二功能測試電路</p>
        <p type="p">133:轉換模組</p>
        <p type="p">1331:第一轉換開關</p>
        <p type="p">1332:第二轉換開關</p>
        <p type="p">A1:第一公共端</p>
        <p type="p">A2:第二公共端</p>
        <p type="p">B1:第一選擇端</p>
        <p type="p">B2:第二選擇端</p>
        <p type="p">B3:第三選擇端</p>
        <p type="p">B4:第四選擇端</p>
        <p type="p">C1:焊點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="711" publication-number="202617105">
    <tif-files tif-type="multi-tif">
      <tif file="113141362.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>牙套</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">A61C7/00</main-classification>
        <further-classification edition="200601120241130B">A61C7/08</further-classification>
        <further-classification edition="200601120241130B">A61C7/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李守原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李守原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種牙套，其包含一本體，本體形成一容置空間及與容置空間連通的一開口，容置空間用以容納複數牙齒，本體具有一內層部及一外層部，內層部與外層部為內外相互結合的雙層結構，內層部為不透明材質，外層部為透明材質；至少一撥片，其設置於本體且鄰近於開口，撥片朝向外側延伸並傾斜；當本體套設於牙齒時，利用內層部的自然色澤及外層部的透明材質，使得本體表面可產生如同實際牙齒之外觀結構，且當使用者欲拆下時，僅需伸出手指伸入口中並朝向套設方向的反向推動撥片，即可快速的使本發明脫離牙齒，因此同時可提升結構剛性及使用上的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:開口</p>
        <p type="p">12:內層部</p>
        <p type="p">13:外層部</p>
        <p type="p">14:前端部</p>
        <p type="p">15:中端部</p>
        <p type="p">16:後端部</p>
        <p type="p">17:前通口</p>
        <p type="p">18:後通口</p>
        <p type="p">20:撥片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="712" publication-number="202617244">
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          <doc-number>202617244</doc-number>
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        <document-id>
          <doc-number>113141363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可變式流量放大器</chinese-title>
        <english-title>VARIABLE FLOW AMPLIFIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B01D29/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皇象國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG XIANG INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李盈賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YING-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可變式流量放大器，包括：至少一連結件呈十字管狀相通形成有三連結管與一對接管，該連結管處形成有複數個第一勾槽，且該對接管處形成有複數個第一倒勾，至少一過濾件呈直管狀的相通形成有一公接管與一母接管，且該過濾件於中段處開設有複數個過濾孔，該公接管形成有複數個第二倒勾，且該母接管形成有複數個第二勾槽，又該第一倒勾與該第二倒勾用於連接該第一勾槽或該第二勾槽，藉此讓多個該連結件與多個該過濾件能配合使用場所或過濾設備的不同，自行組裝調整適用圓桶狀、方桶狀或不規則的水池形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A variable flow amplifier, comprising: at least one connecting component with a cross-shaped structure that forms three connecting tubes and a pair of coupling tubes. The connecting tubes include multiple first hooking grooves, while the coupling tubes feature multiple first barbs. At least one filtering component in a straight tubular shape forms a male connector and a female connector, with multiple filtering holes in the midsection of the filter component. The male connector has multiple second barbs, and the female connector includes multiple second hooking grooves. The first and second barbs are designed to connect with either the first or second hooking grooves, allowing multiple connecting components and filtering components to be assembled and adjusted to fit different usage environments or filtration equipment, making it suitable for round, square, or irregularly shaped pools.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連結件</p>
        <p type="p">11:連結管</p>
        <p type="p">111:第一勾槽</p>
        <p type="p">12:對接管</p>
        <p type="p">121:第一倒勾</p>
        <p type="p">122:閃避缺口</p>
        <p type="p">20:過濾件</p>
        <p type="p">21:公接管</p>
        <p type="p">211:第二倒勾</p>
        <p type="p">212:第一凹槽</p>
        <p type="p">22:母接管</p>
        <p type="p">221:第二勾槽</p>
        <p type="p">222:軸向凸條</p>
        <p type="p">23:過濾孔</p>
        <p type="p">24:補強條</p>
        <p type="p">25:補強環</p>
        <p type="p">30:蓋體</p>
        <p type="p">31:第三倒勾</p>
        <p type="p">32:環部</p>
        <p type="p">321:第二凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="713" publication-number="202618663">
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      <tif file="113141366.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618663</doc-number>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>113141366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧化肥料調配系統與方法</chinese-title>
        <english-title>SMART FERTILIZER DISTRIBUTION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241220B">G06Q50/02</main-classification>
        <further-classification edition="202201120241220B">G06V10/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德大生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE-DA B&amp;C PRO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉中庸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧化肥料調配系統與方法於此揭露。所述系統包括資料庫、輸入模組、人工智能判斷模組及調配決策模組。資料庫儲存具有多個登記證的多個肥料的資料，且每一個肥料具有至少一營養素。輸入模組接收植物且具有對應植物的至少一植物特徵的影像。人工智能判斷模組判斷至少一植物特徵是否異常，且響應於至少一植物特徵被判斷異常時，判斷植物所缺乏的至少一營養素以產生判斷結果資料。調配決策模組根據判斷結果資料決定肥料調配方式，其中以肥料調配方式調配而成的調配肥料被用於施加給植物，以改善至少一植物特徵的該至少一者的異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智慧化肥料調配系統</p>
        <p type="p">110:處理裝置</p>
        <p type="p">111:人工智能判斷模組</p>
        <p type="p">112:調配決策模組</p>
        <p type="p">120:儲存裝置</p>
        <p type="p">121:資料庫</p>
        <p type="p">130:輸入模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="714" publication-number="202618725">
    <tif-files tif-type="multi-tif">
      <tif file="113141367.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618725</doc-number>
        </document-id>
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        <document-id>
          <doc-number>113141367</doc-number>
        </document-id>
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      <invention-title>
        <chinese-title>教育訓練系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR EDUCATION AND TRAINING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">G09B5/02</main-classification>
        <further-classification edition="201201120241220B">G06Q50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉智淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種教育訓練系統，包含使用者介面、記憶體及處理器。使用者介面配置以提供行員進行教育訓練操作。記憶體配置以儲存至少一法規文稿。處理器耦接使用者介面及記憶體，配置以利用大型語言模型處理此些法規文稿以生成至少一法規文本，並依據此些法規文本生成至少一教育訓練影片及至少一教育訓練題目，其中，處理器更配置以將此些教育訓練影片及此些教育訓練題目顯示於使用者介面，提供行員進行教育訓練操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for education and training includes a user interface, a memory, and a processor. The user interface is configured to provide a user with education and training operations. The memory is configured to store at least one regulatory document. The processor is coupled to the user interface and the memory, configured to utilize a large language model to process the at least one regulatory document to generate at least one regulatory text, and generate at least one education and training videos and at least one education and training question based on the at least one regulatory text, in which the processor is further configured to display the at least one educational training video and the at least one educational training question on the user interface to provide the user with the education and training operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:教育訓練系統</p>
        <p type="p">120:使用者介面</p>
        <p type="p">140:記憶體</p>
        <p type="p">160:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="715" publication-number="202619322">
    <tif-files tif-type="multi-tif">
      <tif file="113141368.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202619322</doc-number>
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        <document-id>
          <doc-number>113141368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多輸入多輸出正交分頻多工通訊系統與其通道追蹤控制方法</chinese-title>
        <english-title>MULTI-INPUT MULTI-OUTPUT ORTHOGONAL FREQUENCY DIVISION MULTIPLEXING COMMUNICATION SYSTEM AND CHANNEL TRACKING CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">H04L27/26</main-classification>
        <further-classification edition="201301120250217B">H04B10/548</further-classification>
        <further-classification edition="201501120250217B">H04B17/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">通道追蹤控制方法包含下列操作：在封包的前置符碼期間，根據封包的前置符碼決定雜訊功率，其中該前置符碼經由複數個子載波傳輸；根據一通道偵測電路的一雜訊衰減因子決定對應於該複數個子載波中的子載波的一截斷標準值；根據該截斷標準值以及該雜訊功率決定該子載波的的訊號雜訊比；以及根據該訊號雜訊比與一目標訊號雜訊比控制一通道追蹤電路在該封包的有效資料期間內停止追蹤該子載波的通道響應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A channel tracking control method includes the following operations: during a preamble period of a packet, determining noise power according to a preamble symbol of the packet, in which the preamble symbol is transmitted by subcarriers; determining a clipping level value corresponding to a first subcarrier of the subcarriers according to a noise attenuation factor of a channel detection circuit; determining a signal-to-noise ratio of the first subcarrier according to the clipping level value and the noise power; and controlling the channel detection circuit to stop tracking a channel response of the first subcarrier during a payload period of the packet according to the signal-to-noise ratio and a target signal-to-noise ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:通道追蹤控制方法</p>
        <p type="p">S410,S420,S430,S440:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="716" publication-number="202619429">
    <tif-files tif-type="multi-tif">
      <tif file="113141370.zip" no="1">
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          <doc-number>202619429</doc-number>
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        <document-id>
          <doc-number>113141370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件及製作方法、相機模組及封裝方法、電子設備</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND MANUFACTURE METHOD, CAMERA MODULE AND PACKAGING METHOD, ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H05K3/32</main-classification>
        <further-classification edition="200601120250107B">H05K1/18</further-classification>
        <further-classification edition="200601120250107B">H01L23/28</further-classification>
        <further-classification edition="202101120250107B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉建良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JYUN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種電路板組件製作方法，包括如下步驟：在印刷電路板上開設通孔，所述印刷電路板具有相互間隔且相對設置的第一表面和第二表面，所述通孔貫穿所述第一表面和所述第二表面；將感測器放置於所述通孔內，所述感測器與所述通孔的內壁間隔設置，所述感測器高度低於所述第一表面，高於或等於所述第二表面；以及將所述感測器固定於所述印刷電路板，並建立所述感測器與所述印刷電路板的電連接。本申請還提供一種包括該電路板組件的相機模組封裝方法、根據該製作方法製成的電路板組件、相機模組、以及包括該相機模組的電子設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a circuit board assembly manufacturing method including the following steps: opening a through-hole on a printed circuit board; placing a sensor to the through hole; connecting the sensor to the printed circuit board. The printed circuit board includes a first surface and a second surface spaced apart from each other. The through-hole penetrates the first surface and the second surface. A distance is between the sensor and an inner wall of the through hole. A sensor height is lower than the first surface and higher than or equal to the second surface. The sensor is fixed on the printed circuit board, and an electrical connection between the sensor and the printed circuit board is established. The present disclosure also provides a camera module packaging method including the circuit board assembly, a circuit board assembly made according to the manufacturing method, a camera module, and an electronic device including the camera module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:印刷電路板</p>
        <p type="p">110:通孔</p>
        <p type="p">110a:內壁</p>
        <p type="p">111:凹槽</p>
        <p type="p">111a:底壁</p>
        <p type="p">112:第二引腳</p>
        <p type="p">12:感測器</p>
        <p type="p">121:第一引腳</p>
        <p type="p">20:濾波片</p>
        <p type="p">30:鏡頭組</p>
        <p type="p">40:粘接劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="717" publication-number="202619292">
    <tif-files tif-type="multi-tif">
      <tif file="113141371.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141371</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多種操作模式的驅動器</chinese-title>
        <english-title>DRIVER HAVING MULTIPLE OPERATING MODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H03K19/0175</main-classification>
        <further-classification edition="200601120241204B">H03H7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐振洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, ZHEN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何澤偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, ZE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">驅動器包含電流模式驅動電路以及電壓模式驅動電路。電流模式驅動電路在一電流模式或一混合模式下啟動，以根據一第一資料訊號產生一第一訊號至一輸出墊。電壓模式驅動電路在一電壓模式或該混合模式下啟動以根據該第一資料訊號產生一第二訊號至該輸出墊，並在該電流模式、該電壓模式或該混合模式下提供一匹配電阻至該輸出墊。該輸出墊分別在該電流模式、該電壓模式與該混合模式下輸出該第一訊號、該第二訊號與該第一訊號與該第二訊號的一組合，且該第一訊號的擺幅低於該第二訊號的擺幅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driver includes a current-mode driving circuit and a voltage-mode driving circuit. The current-mode driving circuit is activated in a current mode or a hybrid mode to generate a first signal to an output pad according to a first data signal. The voltage-mode driving circuit is activated in a voltage mode or the hybrid mode to generate a second signal to the output pad according to the first data signal, and provides a matching resistor to the output pad in the current mode, the voltage mode, or the hybrid mode. The output pad outputs the first signal, the second signal, and a combination of the first signal and the second signal in the current mode, the voltage mode, and the hybrid mode, respectively, and a swing of the first signal is lower than a swing of the second signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:驅動器</p>
        <p type="p">110:電流模式驅動電路</p>
        <p type="p">120:電壓模式驅動電路</p>
        <p type="p">DN,DP:資料訊號</p>
        <p type="p">P1,P2:輸出墊</p>
        <p type="p">S1N,S2N,S1P,S2P:訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="718" publication-number="202619430">
    <tif-files tif-type="multi-tif">
      <tif file="113141372.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件的製作方法和電路板組件</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND METHOD MANUFACTURING FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">H05K3/36</main-classification>
        <further-classification edition="200601120241216B">H05K3/30</further-classification>
        <further-classification edition="200601120241216B">H05K3/28</further-classification>
        <further-classification edition="200601120241216B">H05K3/40</further-classification>
        <further-classification edition="200601120241216B">H05K1/14</further-classification>
        <further-classification edition="200601120241216B">H05K1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QING DING PRECISION ELECTRONICS (HUAIAN) CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雪霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XUE-XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳波稼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BO-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電路板組件的製作方法包括：在第一電路板上電連接第一電子元件；在第二電路板上電連接第二電子元件和第三電子元件；在第一電子元件的表面覆蓋第一保護膜，在第一保護膜的表面覆蓋遮罩膜，遮罩膜與第一電路板電連接，得到第一組件；在第二電子元件和第三電子元件的表面覆蓋第二保護膜，得到第二組件；以第一電路板和第二電路板朝外的方式壓合並烘烤第一組件和第二組件。本申請還提供一種電路板組件，本申請製作的電路板組件，電路板組件的整體高度較小，且無需額外設置用於遮罩的結構，有利於進一步減小電路板的整體高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a circuit board assembly includes the following steps: electrically connecting a first electronic element on a first circuit board; electrically connecting a second electronic component and a third electronic component on a second circuit board; covering a surface of the first electronic component with a first protective film. Covering a surface of the first protective film with a shielding film, electrically connecting the shielding film to the first circuit board, and obtaining a first assembly. Covering surfaces of the second electronic component and the third electronic component with a second protective film to obtain a second assembly. Pressing and baking the first electronic component and the second electronic component with the first circuit board and second circuit board facing outward. The present disclosure further provides a circuit board assembly. The circuit board assembly made by the present disclosure has a small overall height and does not require additional structures for shielding, which is beneficial for further reducing the overall height of the circuit board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">10:第一組件</p>
        <p type="p">11:第一電路板</p>
        <p type="p">112:第一焊墊</p>
        <p type="p">114:第一凹槽</p>
        <p type="p">13:第一電子元件</p>
        <p type="p">15:第一保護膜</p>
        <p type="p">17:遮罩膜</p>
        <p type="p">18:凸伸部</p>
        <p type="p">20:第二組件</p>
        <p type="p">21:第二電路板</p>
        <p type="p">212:第二焊墊</p>
        <p type="p">214:第二凹槽</p>
        <p type="p">23:第二電子元件</p>
        <p type="p">24:第三電子元件</p>
        <p type="p">25:第二保護膜</p>
        <p type="p">27:導電柱</p>
        <p type="p">28:收容槽</p>
        <p type="p">30:連接墊</p>
        <p type="p">L1:第一方向</p>
        <p type="p">L2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="719" publication-number="202619428">
    <tif-files tif-type="multi-tif">
      <tif file="113141374.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件及其製作方法</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREFORE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H05K3/22</main-classification>
        <further-classification edition="200601120250102B">H05K3/46</further-classification>
        <further-classification edition="200601120250102B">H05K1/02</further-classification>
        <further-classification edition="200601120250102B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板組件製作方法，包括步驟:提供一待彎折電路板，待彎折電路板劃分有第一區及連接第一區的第二區和第三區，第二區間設有電子元件以及多個第一連接墊，電子元件設於間隔設置的多個第一連接墊之間，第三區設有第一導通體和多個第二導通體，第一導通體設於多個間隔設置的多個第二導通體之間。彎折第一區，使得第二區對應第三區，第一導通體電性連接電子元件，多個第二導通體一一連接多個第一連接墊。於第二區和第三區之間設置填充體，獲得電路板組件。另，本發明還提供一種電路板組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a circuit board assembly includes the steps of: providing a to-be-bent circuit board, wherein the to-be-bent circuit board is divided into a first area, a second area and a third area connected with the first area; the second area is provided with an electronic component and a plurality of first connection pads, the electronic component is arranged between the plurality of first connection pads which are arranged at intervals; the third area is provided with a first conductor and a plurality of second conductors, and the first conductor is arranged between the plurality of second conductors which are arranged at intervals. Bending the first area to make the second area correspond to the third area, electrically connecting the first conductor to the electronic component, and connecting the plurality of second conductors to the plurality of first connection pads one by one. A filling body is arranged between the second area and the third area to obtain a circuit board assembly. In addition, the invention also provides a circuit board assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">60:填充體</p>
        <p type="p">51:電磁遮罩結構</p>
        <p type="p">301:第二電連接體</p>
        <p type="p">30:第一導通體</p>
        <p type="p">103:第三區</p>
        <p type="p">143:第三連接墊</p>
        <p type="p">142:第二連接墊</p>
        <p type="p">50:彎折電路板</p>
        <p type="p">101:第一區</p>
        <p type="p">141:第一連接墊</p>
        <p type="p">102:第二區</p>
        <p type="p">232:導通體</p>
        <p type="p">144:第一電連接體</p>
        <p type="p">33:第二導通體</p>
        <p type="p">20:電子元件</p>
        <p type="p">342:導熱膠</p>
        <p type="p">14:第一線路層</p>
        <p type="p">13:絕緣層</p>
        <p type="p">11:覆蓋層</p>
        <p type="p">12:第二線路層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="720" publication-number="202619221">
    <tif-files tif-type="multi-tif">
      <tif file="113141381.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池桶及充電站</chinese-title>
        <english-title>BATTERY BARREL AND CHARGING STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">H02J7/00</main-classification>
        <further-classification edition="200601120241223B">H01M10/42</further-classification>
        <further-classification edition="200601120241223B">H01M10/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商睿能創意公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOGORO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐振欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佑榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾志踴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池桶包含桶體以及滾輪模組。桶體包含至少一側壁環繞形成插入口。側壁具有缺口連通插入口，並遠離插入口延伸。滾輪模組銜接於缺口，並配置以沿著缺口的內緣滑動而由插入口離開缺口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery barrel includes a barrel body and a roller module. The barrel body includes at least one side wall surrounding to form an insertion opening. The side wall has a notch communicating with the insertion opening and extending away from the insertion opening. The roller module is engaged with the notch and configured to slide along an inner edge of the notch and leave the notch through the insertion opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電池桶</p>
        <p type="p">210:桶體</p>
        <p type="p">211:側壁</p>
        <p type="p">211a:缺口</p>
        <p type="p">211a1:第一邊緣</p>
        <p type="p">211a2:第二邊緣</p>
        <p type="p">212:凸緣</p>
        <p type="p">220:滾輪模組</p>
        <p type="p">221:安裝板</p>
        <p type="p">222:滾輪單元</p>
        <p type="p">230:電池連接座</p>
        <p type="p">H1:進氣口</p>
        <p type="p">H2:出氣口</p>
        <p type="p">O:插入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="721" publication-number="202617054">
    <tif-files tif-type="multi-tif">
      <tif file="113141382.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內視鏡影像的生成系統以及生成方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR GENERATING ENDOSCOPIC IMAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">A61B1/04</main-classification>
        <further-classification edition="200601120241130B">A61B1/045</further-classification>
        <further-classification edition="200601120241130B">A61B1/05</further-classification>
        <further-classification edition="200601120241130B">A61B5/06</further-classification>
        <further-classification edition="200601120241130B">A61B17/94</further-classification>
        <further-classification edition="201601120241130B">A61B34/00</further-classification>
        <further-classification edition="201801120241130B">G16H30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>炳碩生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POINT ROBOTICS MEDTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁浚瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, JIUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳詩元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹訢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種內視鏡影像的生成系統以及生成方法。生成系統包括套筒鏡組件、機器裝置以及處理裝置。套筒鏡組件用於搭配一手術器械。套筒鏡組件包括複數個影像擷取元件。機器裝置用於移動套筒鏡組件至一手術部位，複數個影像擷取元件分別擷取複數個不同視角的複數個當前影像。該些當前影像的其中之一是由第一影像部分以及第二影像部分構成。第一影像部分為局部手術器械之影像，第二影像部分為手術部位中未被局部手術器械遮蔽的部分之影像，而些當前影像的其中至少一者包含第三影像部分，第三影像部分與第一影像部分對應的手術部位之區域或位置為相同。處理裝置經配置以第三影像部分取代第一影像部分，並獲得一處理後影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for generating endoscopic image are provided. The generation system includes a dilatorscope assembly, a machine device, and a processing device. The dilatorscope assembly is used with a surgical instrument. The dilatorscope assembly includes a plurality of image capturing elements. The machine device is used to move the dilatorscope assembly to a surgical site, and the plurality of image capturing elements capture a plurality of current images from a plurality of different angles. One of the current images is composed of a first image part and a second image part. The first image part is an image of a part of the surgical instrument, the second image part is an image of a part of the surgical site that is not obscured by the part of the surgical instrument, and at least one of the current images includes a third image part, and the third image part and the first image part correspond to a same area or position of the surgical site. The processing device is configured to replace the first image part with a third image part and obtain a processed image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:套筒鏡組件</p>
        <p type="p">2:機器裝置</p>
        <p type="p">3:處理裝置</p>
        <p type="p">4:導航標記元件</p>
        <p type="p">5:追蹤器</p>
        <p type="p">6:顯示裝置</p>
        <p type="p">U:手術器械</p>
        <p type="p">T:手術部位</p>
        <p type="p">B:病患</p>
        <p type="p">P:手術台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="722" publication-number="202619211">
    <tif-files tif-type="multi-tif">
      <tif file="113141384.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具光柵結構的垂直腔面射型雷射器</chinese-title>
        <english-title>VERTICAL CAVITY SURFACE-EMITTING LASER WITH GRATING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01S5/183</main-classification>
        <further-classification edition="202501120250102B">H10H20/856</further-classification>
        <further-classification edition="202501120250102B">H10H20/841</further-classification>
        <further-classification edition="200601120250102B">G02B27/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華立捷科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HLJ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, PO-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭偉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHENG, WEI-WUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具光柵結構的垂直腔面射型雷射器，其包括：電路基板、發光複合層以及光柵結構。發光複合層位於電路基板上，發光複合層包括第一布拉格反射鏡、發光層及第二布拉格反射鏡。光柵結構位於第一布拉格反射鏡上，光柵結構包括接觸層及保護層。接觸層包括本體及多個凸部，多個凸部位於本體上，相鄰的二個凸部之間形成凹槽。保護層位於接觸層上，覆蓋每一凸部及每一凹槽，對應於每一凸部及每一凹槽的結構，保護層具有一呈現高低起伏的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vertical cavity surface-emitting laser with a grating structure includes: a circuit substrate, a luminescent composite layer and a grating structure. The luminescent composite layer is located on the circuit substrate. The luminescent composite layer includes a first Bragg reflector, an luminescent layer and a second Bragg reflector. The grating structure is located on the first Bragg reflector, and the grating structure includes a contact layer and a protective layer. The contact layer includes a body and a plurality of convex portions. The convex portions are located on the body, and a groove is formed between two adjacent convex portions. The protective layer is located on the contact layer, covering each convex portion and each groove. Corresponding to the structure of each convex portion and each groove, the protective layer has an undulating surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:具光柵結構的垂直腔面射型雷射器</p>
        <p type="p">1:電路基板</p>
        <p type="p">2:發光複合層</p>
        <p type="p">21:第一布拉格反射鏡</p>
        <p type="p">22:發光層</p>
        <p type="p">23:第二布拉格反射鏡</p>
        <p type="p">3:接觸層</p>
        <p type="p">31:光柵結構</p>
        <p type="p">311:本體</p>
        <p type="p">312:凸部</p>
        <p type="p">313:凹槽</p>
        <p type="p">32:保護層</p>
        <p type="p">5:保護層</p>
        <p type="p">D3:垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="723" publication-number="202619244">
    <tif-files tif-type="multi-tif">
      <tif file="113141385.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高輸出穩定度之電源供應器</chinese-title>
        <english-title>POWER SUPPLY DEVICE WITH HIGH OUTPUT STABILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H02M1/14</main-classification>
        <further-classification edition="200601120250203B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹子增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, TZU-TSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高輸出穩定度之電源供應器，包括：一橋式整流器、一第一電感器、一功率切換器、一第一輸出級電路、一分壓電路、一切換電路、一變壓器、一諧振電容器、一可調阻抗電路、一第二輸出級電路，以及一延遲控制電路，其中可調阻抗電路和延遲控制電路能提供一緩啟動機制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply device with high output stability includes a bridge rectifier, a first inductor, a power switch element, a first output stage circuit, a voltage divider circuit, a switch circuit, a transformer, a resonant capacitor, a tunable impedance circuit, a second output stage circuit, and a delay control circuit. A soft start mechanism is provided by the tunable impedance circuit and the delay control circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">110:橋式整流器</p>
        <p type="p">120:功率切換器</p>
        <p type="p">130:第一輸出級電路</p>
        <p type="p">140:分壓電路</p>
        <p type="p">150:切換電路</p>
        <p type="p">160:變壓器</p>
        <p type="p">161:主線圈</p>
        <p type="p">162:第一副線圈</p>
        <p type="p">163:第二副線圈</p>
        <p type="p">170:可調阻抗電路</p>
        <p type="p">180:第二輸出級電路</p>
        <p type="p">190:延遲控制電路</p>
        <p type="p">CR:諧振電容器</p>
        <p type="p">L1:第一電感器</p>
        <p type="p">LM:激磁電感器</p>
        <p type="p">LR:漏電感器</p>
        <p type="p">VC:控制電位</p>
        <p type="p">VD:分壓電位</p>
        <p type="p">VE:中間電位</p>
        <p type="p">VG1:第一驅動電位</p>
        <p type="p">VG2:第二驅動電位</p>
        <p type="p">VG3:第三驅動電位</p>
        <p type="p">VIN1:第一輸入電位</p>
        <p type="p">VIN2:第二輸入電位</p>
        <p type="p">VOUT:輸出電位</p>
        <p type="p">VR:整流電位</p>
        <p type="p">VSS:接地電位</p>
        <p type="p">VW:切換電位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="724" publication-number="202618659">
    <tif-files tif-type="multi-tif">
      <tif file="113141396.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618659</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141396</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳關稅計算方法與服務系統</chinese-title>
        <english-title>METHOD FOR COMPUTING CARBON TARIFF AND SERVICE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241202B">G06Q50/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商希達數位有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEDARS DIGITAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳富明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張懋言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MAO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種碳關稅計算方法與服務系統，所述運行碳關稅計算的服務系統通過運算電路執行碳關稅計算方法，其中，自企業資料庫取得企業營運銷售數據，以取得企業出口產品的數量、碳足跡，以及產品碳排放量。接著引入企業出口產品的進口地的碳關稅法規，包括取得進口地的碳權價格與課徵項目，同時引入進口地的免稅額度，並可取得企業已繳交稅額。如此，即可根據產品的數量、產品碳排放量、碳權價格、免稅額度以及已繳交稅額計算碳關稅，並建立企業出口產品至該進口地的申報碳關稅的報表。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for computing carbon tariff and a service system are provided. The service system operates the method for computing carbon tariff by a computing circuit. The service system obtains enterprise operational sales data from an enterprise database so as to acquire a quantity of exported products, carbon footprint, and carbon emissions of the products. Next, a carbon tariff regulation of an importing place for the exported products is introduced, in which a carbon credit price and taxation items can be obtained. A tax exemption for the importing place can also be introduced. The tax already paid by the enterprise is submitted. Thus, the carbon tariff is calculated according to the quantity of exported products, the carbon emissions of the products, the carbon credit price, the tax exemption and the paid tax, and a report for declaring the carbon tariff for the exported products of the enterprise is established.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:網路</p>
        <p type="p">100:服務系統</p>
        <p type="p">101:運算電路</p>
        <p type="p">103:記憶模組</p>
        <p type="p">105:通訊模組</p>
        <p type="p">107:企業營運銷售數據庫</p>
        <p type="p">171:企業營運銷售數據</p>
        <p type="p">173:碳關稅法規</p>
        <p type="p">175:產品碳足跡課徵項目</p>
        <p type="p">177:碳權價格</p>
        <p type="p">179:各出口國已繳交費用</p>
        <p type="p">111:企業資料庫一</p>
        <p type="p">112:企業資料庫二</p>
        <p type="p">115:碳關稅及法規資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="725" publication-number="202619185">
    <tif-files tif-type="multi-tif">
      <tif file="113141400.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卡緣連接器的改造方法</chinese-title>
        <english-title>METHOD TO MODIFY A CARD EDGE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241108B">H01R13/56</main-classification>
        <further-classification edition="201101120241108B">H01R13/646</further-classification>
        <further-classification edition="201101120241108B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李士修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ERIC S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JEH WEIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁文傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, WEN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昶諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊世超</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種卡緣連接器的改造方法，其步驟包括：提供一卡緣連接器，其每一端子具有一凸出的殘段，該殘段具有一面積尺寸；以及縮減該殘段的該面積尺寸使其小於一常規面積，以降低該卡緣連接器的反射損耗、插入損耗及串擾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method to modify a card edge connector, the steps of which include: providing a card edge connector, each terminal of which exhibits a protruding stub, the stub features an area size; and decreasing the area size of the stub to be smaller than a conventional area size to reduce the return loss, insertion loss, and crosstalk of the card edge connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:市售的M.2 PCIe連接器</p>
        <p type="p">110:外殼</p>
        <p type="p">120:端子</p>
        <p type="p">122:殘段</p>
        <p type="p">121:固定端</p>
        <p type="p">123:接觸端</p>
        <p type="p">220、320、420:(改造後的)端子</p>
        <p type="p">222、322、422:(改造後的)殘段</p>
        <p type="p">L:(殘段的)長</p>
        <p type="p">W:(殘段的)寬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="726" publication-number="202618782">
    <tif-files tif-type="multi-tif">
      <tif file="113141401.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置的操作方法及其記憶體裝置</chinese-title>
        <english-title>OPERATION METHOD FOR MEMORY DEVICE AND MEMORY DEVICE THEREFORE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">G11C16/06</main-classification>
        <further-classification edition="200601120250204B">G11C16/10</further-classification>
        <further-classification edition="200601120250204B">G11C16/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周佑亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YOU-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置的操作方法及其記憶體裝置。記憶體裝置可為具備高容量及高性能的立體NAND快閃記憶體。操作方法包括：基於第i個潛在狀態而對多個記憶胞進行程式化操作。基於第i個潛在狀態的程式化操作包括：在程式化脈衝階段中，施加對應第i個潛在狀態的程式化脈衝至對應於第i個潛在狀態的多個第一記憶胞；以及，在程式化脈衝階段之後的驗證階段中，對於第(i-1)個潛在狀態的多個第二記憶胞進行第一感測操作以驗證多個第二記憶胞的臨界電壓分布情形，且對於多個第一記憶胞進行第二感測操作以實施第i個潛在狀態的程式化驗證操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operation method for a memory device and a memory device therefore are provided. The memory device may be a 3D NAND flash memory with high capacity and high performance. The operation method comprises: performing a programming operation to the plurality of the memory cells based on an i-th potential state. The programming operation to the plurality of the memory cells based on an i-th potential state comprises: in a program pulse phase, applying a program pulse corresponding to the i-th potential state to a plurality of first memory cells corresponding to the i-th potential state; and, in a verification phase after the program pulse phase, performing a first sensing operation to a plurality of second memory cells in the (i-1)-th potential state to verify a situation of threshold voltage distributions of the plurality of the second memory cells, and performing a second sensing operation to the plurality of the first memory cells to implement a program verification operation of the i-th potential state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S300~S360:記憶體裝置的操作方法的各步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="727" publication-number="202619161">
    <tif-files tif-type="multi-tif">
      <tif file="113141413.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高增益毫米波天線結構及其毫米波天線模組</chinese-title>
        <english-title>HIGH-GAIN MILLIMETER WAVE ANTENNA STRUCTURE AND MILLIMETER WAVE ANTENNA MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">H01Q3/44</main-classification>
        <further-classification edition="200601120250204B">H01Q15/14</further-classification>
        <further-classification edition="200601120250204B">H01Q1/36</further-classification>
        <further-classification edition="200601120250204B">H01Q21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPAQ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭大福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TA- FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高增益毫米波天線結構及其毫米波天線模組。高增益毫米波天線結構包括第一反射板、第二反射板以及毫米波天線模組。第一反射板具有第一凹陷區域以及第一聚焦區域。第二反射板具有第二凹陷區域以及第二聚焦區域。毫米波天線模組設置在第一反射板以及第二反射板之間。當毫米波天線模組被配置以選擇性提供一原始毫米波訊號時，毫米波天線模組所提供的原始毫米波訊號依序通過第一反射板以及第二反射板的反射，以形成朝向同一預定方向傳送的一工作毫米波訊號。藉此，透過毫米波天線模組、第一反射板以及第二反射板的相互配合所提供的一工作毫米波訊號的一工作天線增益可以大於毫米波天線模組所提供的一原始毫米波訊號的一原始天線增益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a high-gain millimeter wave antenna structure and a millimeter wave antenna module thereof. The high-gain millimeter wave antenna structure includes a first reflective plate, a second reflective plate and a millimeter wave antenna module. The first reflective plate has a first recessed area and a first focusing area. The second reflective plate has a second recessed area and a second focusing area. The millimeter wave antenna module is disposed between the first reflective plate and the second reflective plate. When the millimeter wave antenna module is configured to selectively provide an original millimeter-wave signal, the original millimeter-wave signal provided by the millimeter wave antenna module is sequentially reflected by the first reflective plate and the second reflective plate to form an operating millimeter wave signal transmitted in the same predetermined direction. Thereby, an operating antenna gain of the operating millimeter wave signal provided through the cooperation of the millimeter wave antenna module, the first reflector and the second reflector can be greater than an original antenna gain of the original millimeter wave signal provided by the millimeter wave antenna module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M:高增益毫米波天線結構</p>
        <p type="p">1:第一反射板</p>
        <p type="p">100:第一凹陷區域</p>
        <p type="p">1001:凸出尖端</p>
        <p type="p">1002:第一訊號反射面</p>
        <p type="p">2:第二反射板</p>
        <p type="p">200:第二凹陷區域</p>
        <p type="p">2001:貫穿開口</p>
        <p type="p">2002:第二訊號反射面</p>
        <p type="p">3:毫米波天線模組</p>
        <p type="p">31:天線陣列模組</p>
        <p type="p">300:微帶貼片天線單元</p>
        <p type="p">4:天線支架結構</p>
        <p type="p">5:同軸電纜線</p>
        <p type="p">D1:第一直徑</p>
        <p type="p">D2:第二直徑</p>
        <p type="p">D3:開口直徑</p>
        <p type="p">H1:第一高度</p>
        <p type="p">H2:第二高度</p>
        <p type="p">W:最大寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="728" publication-number="202619154">
    <tif-files tif-type="multi-tif">
      <tif file="113141418.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高頻懸空共平面波導傳輸線及包括其之雙頻天線</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H01P3/12</main-classification>
        <further-classification edition="200601120241204B">H01P1/00</further-classification>
        <further-classification edition="201501120241204B">H01Q5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周錫增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種高頻懸空共平面波導傳輸線，包括：接地線、至少一墊片以及訊號線，接地線包括開口槽；墊片設置於開口槽內；訊號線經由墊片支撐而懸空於開口槽；接地線及訊號線朝向開口槽之開口的表面共平面。另揭露包括上述高頻懸空共平面波導傳輸線之雙頻天線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高頻懸空共平面波導傳輸線</p>
        <p type="p">11:接地線</p>
        <p type="p">12:墊片</p>
        <p type="p">13:訊號線</p>
        <p type="p">111:開口槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="729" publication-number="202618110">
    <tif-files tif-type="multi-tif">
      <tif file="113141419.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141419</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於支撐柱結構的裝置</chinese-title>
        <english-title>DEVICE FOR SUPPORTING PILLAR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">E04G25/02</main-classification>
        <further-classification edition="200601120250108B">E04C3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潤弘精密工程事業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUENTEX ENGINEERING &amp; CONSTRUCTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹衍樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JHIH-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露揭露了一種用於支撐一柱結構的裝置。該裝置包括：一具有撓性之圍束裝置，其大致呈一長條狀，且經構形以圍束該柱結構的周緣，該具有撓性之圍束裝置包含一第一端以及相對於該第一端之一第二端；複數個連接裝置，其每一者經構形以適於耦合一支撐桿，該複數個連接裝置沿該具有撓性之圍束裝置的長度方向，間隔設置於該具有撓性之圍束裝置上；一第一固定座，其設置於該具有撓性之圍束裝置之該第一端上；一第二固定座，其設置於該具有撓性之圍束裝置之該第二端上；以及一第一緊固件，其連接該第一固定座以及該第二固定座，且該第一緊固件經構形可調整該第一固定座以及該第二固定座之間的距離，以調整該具有撓性之圍束裝置圍束該柱結構的鬆緊程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The subject application discloses a device for supporting a pillar structure. The device comprises, a flexible encircling device being generally in a strip shape and configured to encircle a periphery of the pillar structure, the flexible encircling device including a first end and a second end opposite to the first end; a plurality of connecting devices, each of the connecting devices being configured to be adapted to couple a support rod, the plurality of connecting devices being arranged at intervals along the length direction of the flexible encircling device; a first fixing seat arranged on the first end of the flexible encircling device; a second fixing seat arranged on the second end of the flexible encircling device; and a first fastener connecting the first fixing seat and the second fixing seat, and the first fastener being configured to adjust a distance between the first fixing seat and the second fixing seat for adjusting the tightness of the flexible encircling device encircling the pillar structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:支撐桿</p>
        <p type="p">100:柱結構</p>
        <p type="p">102:鋼梁接頭</p>
        <p type="p">104:柱本體</p>
        <p type="p">200:支撐裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="730" publication-number="202618167">
    <tif-files tif-type="multi-tif">
      <tif file="113141423.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141423</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動支架及其螢幕設備</chinese-title>
        <english-title>ELECTRIC STAND AND MONITOR APPARATUS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">F16M11/04</main-classification>
        <further-classification edition="200601120250106B">F16M11/42</further-classification>
        <further-classification edition="200601120250106B">G01L1/00</further-classification>
        <further-classification edition="200601120250106B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明基電通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENQ CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游琳源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, LIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛賀聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, HO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃劉義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭孟揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, MENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹仁翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, JEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動支架用於支撐顯示螢幕且包含支架結構、應變偵測單元及設置於支架結構內以驅動支架結構或顯示螢幕之驅動模組。支架結構包含支撐柱、樞接於支撐柱的後懸臂和樞接後懸臂及顯示螢幕的前懸臂。應變偵測單元電連接驅動模組且設置在位於支撐柱內的第一偵測位置、位於後懸臂與支撐柱之樞接處的第二偵測位置、位於後懸臂與前懸臂之樞接處的第三偵測位置，及位於前懸臂與顯示螢幕之樞接處的第四偵測位置之至少其中之一。應變偵測單元偵測施予支架結構或顯示螢幕的應力變化，並據以控制驅動模組驅動支架結構或顯示螢幕並使顯示螢幕作動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric stand includes a stand structure, a driving module disposed in the stand structure to drive the stand structure or a display monitor, and a strain sensor. The stand structure includes a support column, a rear cantilever pivoted to the support column, and a front cantilever pivoted to the rear cantilever and the display monitor. The strain sensor is coupled to the driving module and disposed on at least one of a position in the support column, a pivot position of the rear cantilever and the support column, a pivot position of the rear cantilever and the front cantilever, and a pivot position of the front cantilever and the display monitor. The strain sensor detects a strain variation exerted upon the stand structure or the display monitor and accordingly controls the driving module to drive the stand structure or the display monitor for activating the display monitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:馬達</p>
        <p type="p">2:變速箱</p>
        <p type="p">3:螺桿</p>
        <p type="p">10:螢幕設備</p>
        <p type="p">11:支撐桌面</p>
        <p type="p">12:顯示螢幕</p>
        <p type="p">14:電動支架</p>
        <p type="p">16:支架結構</p>
        <p type="p">18:驅動模組</p>
        <p type="p">20:應變偵測單元</p>
        <p type="p">22:支撐柱</p>
        <p type="p">24:後懸臂</p>
        <p type="p">26:前懸臂</p>
        <p type="p">P1:第一偵測位置</p>
        <p type="p">F&lt;sub&gt;down&lt;/sub&gt;:下壓力</p>
        <p type="p">F&lt;sub&gt;down1&lt;/sub&gt;:下壓分力</p>
        <p type="p">F&lt;sub&gt;up&lt;/sub&gt;:上抬力</p>
        <p type="p">F&lt;sub&gt;up1&lt;/sub&gt;:上抬分力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="731" publication-number="202618711">
    <tif-files tif-type="multi-tif">
      <tif file="113141431.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於人體姿態辨識的風險評估方法及系統</chinese-title>
        <english-title>RISK ASSESSMENT METHOD AND SYSTEM BASED ON HUMAN POSE RECOGNITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">G06V40/20</main-classification>
        <further-classification edition="202201120250203B">G06V10/70</further-classification>
        <further-classification edition="200601120250203B">G08B21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>建豐健康科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPICON CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林凱馳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KAI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於人體姿態辨識的風險評估方法，包含以一運算裝置執行：取得受測者的一動態影像，其中所述動態影像包含多個影像片段；偵測所述動態影像中的多個特徵關節點以取得多個關節點座標；追蹤並分析所述多個關節點座標於所述動態影像的所述多個影像片段中的移動軌跡以取得一動作檢測資訊；以及根據所述動作檢測資訊取得一風險評估資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A risk assessment method based on human body pose recognition, include executing with a computing device: obtaining a dynamic image of a subject, wherein the dynamic image includes a plurality of motion image segments; detecting a plurality of feature joint points in the dynamic image to obtain a plurality of joint point coordinates; tracking and analyzing motion trajectories of the plurality of joint point coordinates in the plurality of motion image segments of the dynamic image to obtain motion detection information; and obtaining risk assessment information based on the motion detection information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S3,S5,S7:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="732" publication-number="202619187">
    <tif-files tif-type="multi-tif">
      <tif file="113141432.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置、電纜模組及機殼模組</chinese-title>
        <english-title>ELECTRONIC DEVICE, CABLE MODULE AND CASING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">H01R13/629</main-classification>
        <further-classification edition="201101120250108B">H01R12/71</further-classification>
        <further-classification edition="200601120250108B">H01R13/502</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳振揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHEN YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊紹暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHAO HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝國榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KUO JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括一機殼、一電路板組件、一電纜組件及一導引機構，電路板組件設置於機殼且包括一電路板及一第一電連接器，第一電連接器設置於電路板上，電纜組件包括一殼體、一第二電連接器及一電纜，第二電連接器及電纜設置於殼體，電纜連接第二電連接器，導引機構導引第二電連接器電連接第一電連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a circuit board assembly, a cable assembly and a guide mechanism. The circuit board assembly is disposed in the casing and comprises a circuit board and a first connector, and the first connector is disposed on the circuit board. The cable assembly comprises a housing, a second connector and a cable. The second connector and the cable are disposed in the housing, and the cable is connected to the second connector. The guide mechanism guides the second connector to electrically connect with the first connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">11:機殼</p>
        <p type="p">111:外殼</p>
        <p type="p">112:承載架</p>
        <p type="p">113:止擋件</p>
        <p type="p">1131:通孔</p>
        <p type="p">20:電路板組件</p>
        <p type="p">21:電路板</p>
        <p type="p">22:第一電連接器</p>
        <p type="p">23:罩體</p>
        <p type="p">30:電纜模組</p>
        <p type="p">31:電纜組件</p>
        <p type="p">50:導引機構</p>
        <p type="p">40:風扇模組</p>
        <p type="p">C:組裝通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="733" publication-number="202617809">
    <tif-files tif-type="multi-tif">
      <tif file="113141433.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物及其製品</chinese-title>
        <english-title>RESIN COMPOSITION AND ARTICLE MADE THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C08F230/02</main-classification>
        <further-classification edition="200601120241205B">C08L43/02</further-classification>
        <further-classification edition="200601120241205B">C08L101/02</further-classification>
        <further-classification edition="200601120241205B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台光電子材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝鎮宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組合物，其包含：含乙烯基樹脂以及含磷共聚物，所述含磷共聚物由具有式（1）所示結構之單體以及具有式（2）所示結構之單體聚合而成。再者，本發明還提供一種由前述樹脂組合物製成的製品，其包含半固化片、樹脂膜、積層板或印刷電路板。        &lt;br/&gt;&lt;img align="absmiddle" height="488px" width="652px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a resin composition, comprising a vinyl-group containing resin and a phosphorus-containing copolymer, wherein the phosphorus-containing copolymer is polymerized from a monomer having a structure represented by formula (1) and a monomer having a structure represented by formula (2). Further, the present disclosure also provides an article made therefrom, comprising a prepreg, a resin film, a laminate, or a printed circuit board.        &lt;br/&gt;&lt;img align="absmiddle" height="503px" width="671px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="734" publication-number="202619525">
    <tif-files tif-type="multi-tif">
      <tif file="113141437.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141437</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高電子遷移率氮化鎵電晶體</chinese-title>
        <english-title>HIGH ELECTRON MOBILITY GALLIUM NITRIDE TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250203B">H10D30/47</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, EDWARD YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種高電子遷移率氮化鎵電晶體，包括基板、複合介電層、阻障層以及氮化鎵層。複合介電層設置於基板上，其中複合介電層包括經氟摻雜的氧化鉿材料。阻障層設置於基板與複合介電層之間。氮化鎵層設置於基板與阻障層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a high electron mobility gallium nitride transistor, including a substrate, a composite dielectric layer, a barrier layer and a gallium nitride layer. The composite dielectric layer is disposed on the substrate and includes a fluorine-doped hafnium oxide material. The barrier layer is disposed between the substrate and the composite dielectric layer. The gallium nitride layer is disposed between the substrate and the barrier layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:複合介電層</p>
        <p type="p">25:凹槽</p>
        <p type="p">3:阻障層</p>
        <p type="p">4:氮化鎵層</p>
        <p type="p">5:鈍化層</p>
        <p type="p">51:第一鈍化層</p>
        <p type="p">52:第二鈍化層</p>
        <p type="p">61:汲極</p>
        <p type="p">62:源極</p>
        <p type="p">63:閘極</p>
        <p type="p">100:高電子遷移率氮化鎵電晶體</p>
        <p type="p">L&lt;sub&gt;g1&lt;/sub&gt;:閘極線寬</p>
        <p type="p">L&lt;sub&gt;g2&lt;/sub&gt;:閘極T型場板距離</p>
        <p type="p">L&lt;sub&gt;gd&lt;/sub&gt;:閘極汲極距離</p>
        <p type="p">L&lt;sub&gt;gs&lt;/sub&gt;:閘極源極距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="735" publication-number="202619074">
    <tif-files tif-type="multi-tif">
      <tif file="113141438.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141438</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆疊基板結構及其製造方法</chinese-title>
        <english-title>STACKED SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H01L23/31</main-classification>
        <further-classification edition="200601120241204B">H01L23/498</further-classification>
        <further-classification edition="200601120241204B">H05K3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱韋嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEI-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張香鈜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIANG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳仕先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供堆疊基板結構及其製造方法。堆疊基板結構包括第一結構及第二結構。第一結構具有第一接合表面。第一結構包括第一線路結構。第一線路結構包括多個第一導電層以及第一膨脹調變層。多個第一導電層在垂直方向上堆疊。第一膨脹調變層設置於相鄰的多個第一導電層之間，其中第一膨脹調變層的熱膨脹係數大於多個第一導電層的熱膨脹係數。第二結構具有第二接合表面，其中第二結構的第二接合表面與第一結構的所一接合表面面對面設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stacked substrate structure and a manufacturing method thereof are provided. The stacked substrate structure includes a first structure and a second structure. The first structure has a first bonding surface. The first structure includes a first circuit structure. The first circuit structure includes a plurality of first conductive layers and a first expansion modulation layer. The plurality of first conductive layers is stacked in a vertical direction. The first expansion modulation layer is disposed between the adjacent first conductive layers. A coefficient of thermal expantion of the first expansion modulation layer is larger than a coefficient of thermal expantion of the plurality of first conductive layers. The second structure has a second bonding surface. The second bonding surface of the second structure is disposed face to face with the first bonding surface of the first structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:堆疊基板結構</p>
        <p type="p">100:第一結構</p>
        <p type="p">100a:第一接合表面</p>
        <p type="p">105:接合層</p>
        <p type="p">110:第一線路結構</p>
        <p type="p">112:第一導電層</p>
        <p type="p">112a:線路層/第一接合墊層</p>
        <p type="p">112b:線路層</p>
        <p type="p">112c:線路層</p>
        <p type="p">114:第一導通孔</p>
        <p type="p">114a,114b:導通孔</p>
        <p type="p">116:第一絕緣結構</p>
        <p type="p">1161:第一表面</p>
        <p type="p">1162:第二表面</p>
        <p type="p">120:第一膨脹調變層</p>
        <p type="p">130:第一晶片</p>
        <p type="p">132:積體光路晶片</p>
        <p type="p">135:光纖</p>
        <p type="p">140:第一導電柱</p>
        <p type="p">142:波導管</p>
        <p type="p">145:波導層</p>
        <p type="p">150:第一模封體</p>
        <p type="p">160:電容器</p>
        <p type="p">170:電感器</p>
        <p type="p">180:頂部導電層</p>
        <p type="p">182:散熱片</p>
        <p type="p">190:導電連接件</p>
        <p type="p">200:第二結構</p>
        <p type="p">200a:第二接合表面</p>
        <p type="p">210:第二線路結構</p>
        <p type="p">210’:第三線路結構</p>
        <p type="p">212:第二導電層</p>
        <p type="p">212’:第三導電層</p>
        <p type="p">212a:線路層/第二接合墊層</p>
        <p type="p">212b:線路層</p>
        <p type="p">212c:線路層</p>
        <p type="p">214:第二導通孔</p>
        <p type="p">214’:第三導通孔</p>
        <p type="p">214a,214b:導通孔</p>
        <p type="p">216:第二絕緣結構</p>
        <p type="p">216’:第三絕緣結構</p>
        <p type="p">220:第二膨脹調變層</p>
        <p type="p">230:第二晶片</p>
        <p type="p">240:第二導電柱</p>
        <p type="p">250:第二模封體</p>
        <p type="p">290:導電端子</p>
        <p type="p">R1,R2,R3:區域</p>
        <p type="p">x,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="736" publication-number="202617061">
    <tif-files tif-type="multi-tif">
      <tif file="113141439.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141439</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生理特徵測定設備</chinese-title>
        <english-title>PHYSIOLOGICAL CHARACTERISTIC MEASUREMENT EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">A61B5/00</main-classification>
        <further-classification edition="202101120241130B">A61B5/05</further-classification>
        <further-classification edition="202101120241130B">A61B5/24</further-classification>
        <further-classification edition="202101120241130B">A61B5/315</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣州立景創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種生理特徵測定設備，適於配置於眼睛前方。生理特徵測定設備包括光源模組、感測模組以及處理單元。光源模組被配置以朝眼睛提供入射線偏光，入射線偏光具有第一線偏振。當入射線偏光入射眼睛，感測模組用於感測來自眼睛的待測光。處理單元連接感測模組。處理單元用於提供一光強度比值，光強度比值為待測光的第一線偏光的光強度以及待測光的第二線偏光的光強度的比值，其中第一線偏光具有第二線偏振，第二線偏光具有第一線偏振，第二線偏振垂直第一線偏振。處理單元根據光強度比值的反正切函數提供生理特徵測定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A physiological characteristic measurement equipment suitable for being worn in front of eyes is provided. The physiological characteristic measurement equipment includes a light source module, a sensing module and a processing unit. The light source module is configured to provide incident linear polarization light to the eyes, wherein the incident linear polarization light has a first linear polarization. The sensing module is used to sense light to be measured coming from the eyes while the incident linear polarization light is incident to the eyes. The processing unit is connected to sensing module. The processing unit is used to provide a light intensity ratio. The light intensity ratio is a ratio of a light intensity for a first linear polarization light of the light to be measured to a light intensity for a second linear polarization light of the light to be measured, wherein the first linear polarization light has a second linear polarization and the second linear polarization light has the first linear polarization. The second linear polarization is perpendicular to the first linear polarization. The processing unit provides a physiological characteristic measurement value according to an arctangent function of the light intensity ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:生理特徵測定設備</p>
        <p type="p">10:人眼</p>
        <p type="p">11:水晶體</p>
        <p type="p">100:感測模組</p>
        <p type="p">101、102:感測裝置</p>
        <p type="p">103、104、202:線偏振片</p>
        <p type="p">105:分光鏡</p>
        <p type="p">200:光源模組</p>
        <p type="p">201:光源</p>
        <p type="p">300:處理單元</p>
        <p type="p">400:攝像裝置</p>
        <p type="p">C1:光軸</p>
        <p type="p">L0:光線</p>
        <p type="p">L1:入射線偏光</p>
        <p type="p">L2、L21、L22:待測光</p>
        <p type="p">L23、L24:線偏光</p>
        <p type="p">P1、P2、P3:線偏振</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="737" publication-number="202619602">
    <tif-files tif-type="multi-tif">
      <tif file="113141441.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其製造方法</chinese-title>
        <english-title>DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H29/10</main-classification>
        <further-classification edition="200601120250102B">H01L25/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余瑞斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JUI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭冠麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭世彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHIH-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括驅動線路基板、多個發光元件組、平坦層及第一遮光層。驅動線路基板具有多個畫素驅動結構。每一畫素驅動結構包括多個子畫素驅動結構。每一子畫素驅動結構包括一子畫素驅動電路、至少一主要接墊及至少一修補用接墊。平坦層設置於驅動線路基板上。第一遮光層設置於平坦層上。多個畫素驅動結構包括一正常畫素驅動結構。多個發光元件組包括一正常發光元件組。第一遮光層包括第一實體部及第一開口。第一實體部遮蔽正常畫素驅動結構的至少一修補用接墊。第一開口位於正常發光元件組的第一發光元件的上方。此外，上述顯示裝置的製造方法也被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a driving circuit substrate, light-emitting element groups, a planarization layer and a first light-shielding layer. The driving circuit substrate has pixel driving structures. Each of the pixel driving structures includes sub-pixel driving structures. Each of the sub-pixel driving structures includes a sub-pixel driving circuit, at least one main pad and at least one repair pad. The planarization layer is disposed on the driving circuit substrate. The first light-shielding layer is disposed on the planarization layer. The pixel driving structures includes a normal pixel driving structure. The light-emitting element groups include a normal light-emitting element group. The first light-shielding layer includes a first solid portion and a first opening. The first solid portion covers the at least one repair pad of the normal pixel driving structure. The first opening is located above a first light-emitting element of the normal light-emitting element group. In addition, a method for manufacturing the display apparatus is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">100:驅動線路基板</p>
        <p type="p">110:基底</p>
        <p type="p">110a:第一區</p>
        <p type="p">110b:第二區</p>
        <p type="p">120:線路結構</p>
        <p type="p">200、200’、200R、200G、200G’、200B:發光元件</p>
        <p type="p">300:平坦層</p>
        <p type="p">400:第一遮光層</p>
        <p type="p">400a、400c:開口</p>
        <p type="p">400b:加工開孔</p>
        <p type="p">500:第二遮光層</p>
        <p type="p">502:遮光圖案</p>
        <p type="p">G200、G200’:發光元件組</p>
        <p type="p">PX:畫素驅動結構</p>
        <p type="p">PX1:第一畫素驅動結構</p>
        <p type="p">PX2:第二畫素驅動結構</p>
        <p type="p">SPX、SPX1、SPX2、SPX3:子畫素驅動結構</p>
        <p type="p">I-I’、II-II’、III-III’、IV-IV’:剖線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="738" publication-number="202619603">
    <tif-files tif-type="multi-tif">
      <tif file="113141442.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250210B">H10H29/10</main-classification>
        <further-classification edition="202501120250210B">H10H29/37</further-classification>
        <further-classification edition="202501120250210B">H10H29/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仁鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭有斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家毫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JIA HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田堃正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括第一基板、第一發光元件、阻擋層、第一遮光層、第二遮光層及第一介質層。第一發光元件包括發光層，第一發光元件設置在第一基板上，第一基板包括凹槽區，第一發光元件設置在凹槽區內，阻擋層環繞第一發光元件，阻擋層具有頂面，頂面與第一基板的第一表面之間沿第三方向的距離大於發光層與第一基板的第一表面之間的距離，第一遮光層包括第一開口，設置於第一基板上且環繞第一發光元件，第二遮光層設置於第一遮光層上，具有第二開口，第一介質層，具有第一折射率，設置於第一遮光層與第二遮光層之間且位於第一發光元件上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a first substrate, first light-emitting unit, a barrier layer, first light-shielding layer, second light-shielding layer and first dielectric layer. First light-emitting unit includes light-emitting layer. First light-emitting unit is disposed on first substrate. First substrate includes groove area. First light-emitting unit is disposed in groove area. Barrier layer surrounds first light-emitting unit. Barrier layer has top surface. Distance between top surface and first surface of first substrate along third direction is greater than distance between light-emitting layer of first light-emitting unit and first surface of first substrate. First light-shielding layer includes first opening, and is disposed on first substrate and surrounds first light-emitting unit. Second light-shielding layer is disposed on first light-shielding layer and has second opening. First dielectric layer has first refractive index and is disposed between first light-shielding layer and second light-shielding layer and on first lighting unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:顯示裝置</p>
        <p type="p">110:第一基板</p>
        <p type="p">120、130、140、160:絕緣層</p>
        <p type="p">141、143:電極</p>
        <p type="p">145:第一發光元件</p>
        <p type="p">150:平坦層</p>
        <p type="p">A1:第一介質層</p>
        <p type="p">BM1:第一遮光層</p>
        <p type="p">BM2:第二遮光層</p>
        <p type="p">CA:凹槽區</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">E1:第一側</p>
        <p type="p">E2:第二側</p>
        <p type="p">LE:發光層</p>
        <p type="p">L1、L3、L5、L7:長度</p>
        <p type="p">O1:第一開口</p>
        <p type="p">O2:第二開口</p>
        <p type="p">S1:第一表面</p>
        <p type="p">TR:第二介質層</p>
        <p type="p">WB:阻擋層</p>
        <p type="p">WBT、145T:頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="739" publication-number="202618505">
    <tif-files tif-type="multi-tif">
      <tif file="113141443.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141443</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自舉式控制電路以及電壓轉換裝置</chinese-title>
        <english-title>BOOTSTRAP CONTROL CIRCUIT AND VOLTAGE CONVERTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">G05F3/08</main-classification>
        <further-classification edition="200601120250204B">H02M3/04</further-classification>
        <further-classification edition="200601120250204B">H03K4/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TZU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙祐磁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, YU-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃琮瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自舉式控制電路以及電壓轉換裝置被提出。自舉式控制電路包括電流鏡、二極體串、開關、控制電壓產生器以及第一電晶體。電流鏡基於輸入電壓，鏡射偏置電流以產生鏡射電流。二極體串耦接在電流鏡與參考電壓端間。開關具有第一端耦接至二極體串，開關的控制端接收第一控制電壓，開關的第二端提供第二控制電壓。第一電晶體基於輸入電壓，根據第二控制電壓以產生輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bootstrap control circuit and a voltage converting device are provided. The bootstrap control circuit includes a current mirror, a diode string, a switch, a control voltage generator and a first transistor. The current mirror, based on an input voltage, mirrors a bias current to generate a mirror current. The diode string is coupled between the current mirror and a reference voltage end. The switch has a first end coupled to the diode string, a control end of the switch receives a first control voltage, a second end of the switch provides a second control voltage. The first transistor, based on the input voltage, generates an output voltage according to the second control voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自舉式控制電路</p>
        <p type="p">110:電流鏡</p>
        <p type="p">111:偏置電流源</p>
        <p type="p">120:二極體串</p>
        <p type="p">130:控制電壓產生器</p>
        <p type="p">CG、CB:電容</p>
        <p type="p">DBT:二極體</p>
        <p type="p">GND:參考接地電壓</p>
        <p type="p">IB1:偏置電流</p>
        <p type="p">IBT:電流源</p>
        <p type="p">IM1:鏡射電流</p>
        <p type="p">LX:參考電壓端</p>
        <p type="p">MDNBT:電晶體</p>
        <p type="p">MP1、MP2、MN1~MN3、MSW:電晶體</p>
        <p type="p">NGSW、NG:控制電壓</p>
        <p type="p">SW1:開關</p>
        <p type="p">VBT:輸出電壓</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VLX:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="740" publication-number="202619082">
    <tif-files tif-type="multi-tif">
      <tif file="113141447.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有矽穿孔的半導體結構及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR WITH TSV AND FABRICATING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">H01L23/34</main-classification>
        <further-classification edition="200601120241106B">H01L23/373</further-classification>
        <further-classification edition="200601120241106B">H01L23/532</further-classification>
        <further-classification edition="200601120241106B">H01L23/535</further-classification>
        <further-classification edition="200601120241106B">H01L21/56</further-classification>
        <further-classification edition="200601120241106B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊晉嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DA-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馥郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, FU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡濱祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, BIN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鉅富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHU-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林川嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有矽穿孔的半導體結構包含一半導體基底，一矽穿孔穿透半導體基底，矽穿孔包含一金屬層、一緩衝層和一絶緣層，金屬層的一末端凸出於半導體基底的一背面，一凹槽設置在末端之一側以及一複合結構填滿凹槽，其中複合結構包含一熱傳導層和一第一介電層，熱傳導層接觸金屬層的末端的側壁、緩衝層、絶緣層和半導體基底，第一介電層設置在熱傳導層上，並且第一介電層的上表面和金屬層的末端切齊，熱傳導層包含氮化鋁、氧化鋁或鑽石。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure with a silicon through via (TSV) includes a semiconductor substrate. A TSV penetrates the semiconductor substrate. The TSV includes a metal layer, a barrier layer and an isolation layer. An end of the metal layer protrudes from a back side of the semiconductor substrate. A recess is disposed at one side of the end of the metal layer. A composite structure fills the recess. The composite structure includes a thermal conductive layer and a first dielectric layer. The thermal conductive layer contacts the side wall of the end of the metal layer and contacts the barrier layer, the isolation layer and the semiconductor substrate. A first dielectric layer is disposed on the thermal conductive layer. A top surface of the first dielectric layer is aligned with the end of the metal layer. The thermal conductive layer includes aluminum nitride, aluminum oxide or diamond.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體基底</p>
        <p type="p">10a:正面</p>
        <p type="p">10b:背面</p>
        <p type="p">12:矽穿孔</p>
        <p type="p">12a:絶緣層</p>
        <p type="p">12b:緩衝層</p>
        <p type="p">12c:金屬層</p>
        <p type="p">14:溝渠</p>
        <p type="p">16a:介電層</p>
        <p type="p">16b:介電層</p>
        <p type="p">18a:導電線</p>
        <p type="p">18b:導電線</p>
        <p type="p">20:末端</p>
        <p type="p">22:凹槽</p>
        <p type="p">24:熱傳導層</p>
        <p type="p">26:第一介電層</p>
        <p type="p">28:複合結構</p>
        <p type="p">100:具有矽穿孔的半導體結構</p>
        <p type="p">110:半導體基底</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="741" publication-number="202618666">
    <tif-files tif-type="multi-tif">
      <tif file="113141448.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於機器學習之鋼板回火參數調控方法及電腦程式產品</chinese-title>
        <english-title>METHOD FOR CONTROLLING STEEL PLATE TEMPERING PARAMETERS BASED ON MACHINE LEARNING AND COMPUTER PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241204B">G06Q50/04</main-classification>
        <further-classification edition="201901120241204B">G06N20/20</further-classification>
        <further-classification edition="200601120241204B">C21D1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宛霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李永裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊詠宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁紀平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何旻璟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, MIN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於機器學習之鋼板回火參數調控方法，包含：讀取歷史回火數據集；根據歷史回火數據集訓練並建立對應於機性種類之回火機性預測模型；以回火機性預測模型預測預設回火參數下之第一回火前後機性差值，以計算出第一回火後機性預測值；判斷第一回火後機性預測值是否超出機性種類之規範機性，若是則以回火機性預測模型分別預測並計算出多個候選回火參數下之第二回火後機性預測值，再基於機性種類之機性目標以一機性目標函式計算多個候選回火參數對應之目標分數，並根據目標分數從多個候選回火參數中決定一回火參數最佳值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for controlling steel plate tempering parameters based on machine learning includes: reading a history tempering data set; training and establishing a tempering mechanical property predict model corresponding to a mechanical property type according to the history tempering data set; predicting a first difference in mechanical property before and after tempering under a default tempering parameter by the tempering mechanical property predict model, to calculate a first predicted mechanical property after tempering; determining whether the first predicted mechanical property after tempering is higher than a specified mechanical property corresponding to the mechanical property type, if so then predicting and calculating a second predicted mechanical property after tempering under multiple candidate tempering parameters by the tempering mechanical property predict model, and calculating a target score corresponding to the multiple candidate tempering parameters based on a mechanical property target of the mechanical property type with a mechanical property target formula, to determine an optimal tempering parameter from the multiple candidate tempering parameters according to the target score.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150,S160,S170:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="742" publication-number="202618576">
    <tif-files tif-type="multi-tif">
      <tif file="113141449.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料轉換系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/20</main-classification>
        <further-classification edition="201901120250203B">G06F16/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>資慧科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林映如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳毓婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料轉換系統，用以提取一原始資料傳輸至一轉換處理單元，該轉換處理單元能透過一轉換對映描述檔(Mapping profile)將一原始資料轉譯為一標準格式資料，其中透過蒐集原始資料之格式描述與資料範例，再搭配標準格式之說明文件及其規格檔與轉換對映描述檔之規格檔，利用一語言模型演算法來生成該轉換對映描述檔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一伺服器</p>
        <p type="p">12:資料來源模組</p>
        <p type="p">13:轉換處理單元</p>
        <p type="p">21:第二伺服器</p>
        <p type="p">22:使用者管理模組</p>
        <p type="p">31:第三伺服器</p>
        <p type="p">32:語言模型</p>
        <p type="p">33:轉換對映描述檔</p>
        <p type="p">41:第四伺服器</p>
        <p type="p">42:資料庫</p>
        <p type="p">43:通訊模組</p>
        <p type="p">44:權限授權管理模組</p>
        <p type="p">51:原始資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="743" publication-number="202617458">
    <tif-files tif-type="multi-tif">
      <tif file="113141450.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車用防水裝置</chinese-title>
        <english-title>CAR WATERPROOFING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B60J11/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎基先進材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DINGZING ADVANCED MATERIALS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林庚賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車用防水裝置，包含一封閉單元，及一支撐單元，該封閉單元包括一防水罩，及一設置於該防水罩的開口部，該支撐單元包括一與該防水罩連接的氣柱，該氣柱可於一充氣狀態，及一洩氣狀態，當該氣柱於該充氣狀態時，該氣柱支撐該防水罩並使該防水罩的內部空間從該開口部對外顯露，當該氣柱於該洩氣狀態時，該防水罩塌陷並使該開口部封閉，以使該防水罩的內部空間無法從該開口部對外顯露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle waterproof device includes a closed unit and a supporting unit. The closed unit includes a waterproof cover and an opening provided in the waterproof cover. The support unit includes an air column connected to the waterproof cover. The air column can be in an inflated state and a deflated state. When the air column is in the inflated state, the air column supports the waterproof cover and exposes the internal space of the waterproof cover to the outside from the opening. When the air column is in the deflated state, the waterproof cover collapses and seals the opening, so that the internal space of the waterproof cover cannot be exposed to the outside through the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:封閉單元</p>
        <p type="p">31:防水罩</p>
        <p type="p">311:底部罩體</p>
        <p type="p">312:側部罩體</p>
        <p type="p">313:頂部罩體</p>
        <p type="p">314:罩體封閉端</p>
        <p type="p">32:開口部</p>
        <p type="p">33:罩體抽氣模組</p>
        <p type="p">34:封口結構</p>
        <p type="p">4:支撐單元</p>
        <p type="p">41:氣柱</p>
        <p type="p">411:開口支撐部</p>
        <p type="p">412:罩體支撐部</p>
        <p type="p">42:柱體充氣模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="744" publication-number="202617098">
    <tif-files tif-type="multi-tif">
      <tif file="113141464.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波驅動系統及訊號產生方法</chinese-title>
        <english-title>AN ULTRASONIC DRIVING SYSTEM AND SIGNAL GENERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">A61B18/00</main-classification>
        <further-classification edition="200601120250123B">A61N7/00</further-classification>
        <further-classification edition="200601120250123B">B06B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉浩澧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAO-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳均懋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種超音波驅動系統，包含訊號產生模組、驅動電路模組，及超音波換能裝置。驅動電路模組根據包含單週期波形參數值及脈衝串數量值的脈衝串參數組，連續輸出單週期波形，並停止輸出單週期波形一預設靜止長度，且重複執行連續輸出單週期波形的動作與停止輸出單週期波形的動作，使得執行連續輸出單週期波形的動作與停止輸出單週期波形的動作的總次數相等於脈衝串數量值，而形成多個脈衝串訊號的每一筆。脈衝串訊號藉由驅動電路模組線性地放大，並藉由超音波換能裝置轉換為多個超音波束，並由超音波束形成多種波形組合之功能，滿足更廣泛的超音波治療應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultrasonic driving system includes a signal generating module, a driving circuit module, and a ultrasonic transducing device. The driving circuit module continuously outputs a single - period waveform according to a pulse train parameter module including a single - period waveform parameter value and a pulse train number value, and continuously outputs the single - period waveform by a predetermined stationary length, and repeatedly performs the operation of continuously outputting the single - period waveform and stopping the operation of outputting the single - period waveform, such that a total number of movements of continuously outputting the single - period waveform and a total number of movements of stopping the outputting the single - period waveform are equal to a pulse train number value, to form each of a plurality of pulse train signals. The pulse train signal is linearly amplified by a driving circuit module, and is converted into multiple ultrasonic beams by a ultrasonic transducing device, and is formed by the ultrasonic beams with functions of multiple focusing depths and locations, satisfying a wider ultrasound therapy application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:使用端裝置</p>
        <p type="p">2:訊號產生模組</p>
        <p type="p">21:處理器</p>
        <p type="p">22:數位類比轉換器</p>
        <p type="p">3:驅動電路模組</p>
        <p type="p">30:訊號放大電路</p>
        <p type="p">31:非反相放大器</p>
        <p type="p">32:電壓放大級</p>
        <p type="p">321:偏壓電路</p>
        <p type="p">322:共基極放大器</p>
        <p type="p">323:共射極放大器</p>
        <p type="p">33:耦合電路</p>
        <p type="p">34:電流放大級</p>
        <p type="p">341:第一共集極放大器</p>
        <p type="p">342:第二共集極放大器</p>
        <p type="p">4:阻抗匹配電路</p>
        <p type="p">5:超音波換能裝置</p>
        <p type="p">51:超音波輸出面</p>
        <p type="p">52:溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="745" publication-number="202619452">
    <tif-files tif-type="multi-tif">
      <tif file="113141466.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伸縮式滑軌固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">H05K7/18</main-classification>
        <further-classification edition="201701120250106B">A47B88/49</further-classification>
        <further-classification edition="201701120250106B">A47B88/403</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富世達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSITEK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種伸縮式滑軌固定裝置，適用於將一滑軌單元定位於一機櫃。該伸縮式滑軌固定裝置包含一後支撐單元、一前支撐單元及一強化結構。該後支撐單元適用於安裝於該機櫃的後側，並包括一第一貫孔組。該第一貫孔組具有多個在一前後方向上排列的第一貫孔。該前支撐單元適用於安裝於該機櫃的前側與該滑軌單元。該前支撐單元能夠前後移動地設置於該後支撐單元，使該伸縮式滑軌固定裝置在該前後方向上的長度能夠對應該機櫃的尺寸調整。該強化結構設置於該後支撐單元且沿該前後方向延伸，並在一上下方向上對準該第一貫孔組，藉此，能讓該後支撐單元在該第一貫孔組不被遮擋的情況下其結構強化，而不易變形，進而達到耐用性提升的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伸縮式滑軌固定裝置</p>
        <p type="p">1:後支撐單元</p>
        <p type="p">11:第一貫孔組</p>
        <p type="p">111:第一貫孔</p>
        <p type="p">12:後托架</p>
        <p type="p">13:後支撐軌</p>
        <p type="p">14:彈性件</p>
        <p type="p">2:前支撐單元</p>
        <p type="p">22:前支撐軌</p>
        <p type="p">225:第二貫孔組</p>
        <p type="p">226:第二貫孔</p>
        <p type="p">3:強化結構</p>
        <p type="p">X:前後方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="746" publication-number="202619240">
    <tif-files tif-type="multi-tif">
      <tif file="113141467.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源供應器及其運作方法</chinese-title>
        <english-title>POWER SUPPLY UNIT AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H02M1/08</main-classification>
        <further-classification edition="200601120250203B">H02M3/156</further-classification>
        <further-classification edition="202001120250203B">H05B45/30</further-classification>
        <further-classification edition="200601120250203B">G06F1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周清和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHING-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧永泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YUNG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈哲宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一電源供應器，包含電源轉換電路、輸出控制電路、電流檢測電路、第一回授電路、耦合電路和電源轉換控制電路。電源轉換電路接收輸入電壓。第一回授電路接收第一檢測電壓信號和第一檢測電流信號以對應地產生第一控制信號。耦合電路依據第一控制信號產生電源轉換控制信號。電源轉換控制電路依據電源轉換控制信號產生轉換信號。當輸出控制電路的控制端耦接至第一控制電壓，輸出控制電路設置第一控制信號，以對應地產生第一輸出電壓。當控制端耦接至第二控制電壓，輸出控制電路設置第一控制信號，以對應地產生第二輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply includes a power conversion circuit, an output control circuit, a current detection circuit, a first feedback circuit, a coupling circuit and a power conversion control circuit. The power conversion circuit receives an input voltage. The first feedback circuit receives the first detection voltage signal and the first detection current signal to correspondingly generate a first control signal. The coupling circuit generates a power conversion control signal based on the first control signal. The power conversion control circuit generates a conversion signal based on the power conversion control signal. When a control terminal of the output control circuit is coupled to a first control voltage, the output control circuit sets the first control signal to correspondingly generate a first output voltage. When the control terminal is coupled to a second control voltage, the output control circuit sets the first control signal to correspondingly generate a second output voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">102:電源轉換電路</p>
        <p type="p">102a:第一輸入端</p>
        <p type="p">102b:第二輸入端</p>
        <p type="p">102c:第一輸出端</p>
        <p type="p">102d:第二輸出端</p>
        <p type="p">104:電流檢測電路</p>
        <p type="p">108:輸出控制電路</p>
        <p type="p">110:第一回授電路</p>
        <p type="p">111:耦合電路</p>
        <p type="p">112:電源轉換控制電路</p>
        <p type="p">114:功率因數修正電路</p>
        <p type="p">114a:第一交流輸入端</p>
        <p type="p">114b:第二交流輸入端</p>
        <p type="p">114c:第一功因修正輸出端</p>
        <p type="p">114d:第二功因修正輸出端</p>
        <p type="p">200:發光二極體</p>
        <p type="p">CW:控制端</p>
        <p type="p">LED(+):陽極</p>
        <p type="p">LED(-):陰極</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">V1a:第一檢測電壓信號</p>
        <p type="p">V1b:第一檢測電流信號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Iout:輸出電流</p>
        <p type="p">I/P:原始電壓</p>
        <p type="p">CS:電源轉換控制信號</p>
        <p type="p">CS1:第一控制信號</p>
        <p type="p">Sc:轉換信號</p>
        <p type="p">C1:第一電容</p>
        <p type="p">C2:第二電容</p>
        <p type="p">Ra:第一跨壓電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="747" publication-number="202619414">
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      <tif file="113141470.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619414</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">H05K1/02</main-classification>
        <further-classification edition="200601120250107B">H05K3/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞電路板股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PRINTED CIRCUIT BOARD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板結構及其製造方法。電路板結構包括基板、導孔、以及第一光敏化介電層。基板具有通孔。導孔設置於基板的通孔中且包括導孔金屬層。第一光敏化介電層設置於該基板與該導孔之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a via, and a first photo-imageable dielectric layer. The substrate has a through hole. The via is disposed in the through hole of the substrate and includes a via metal layer. The first photo-imageable dielectric layer is disposed between the substrate and the via.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:光敏化介電層</p>
        <p type="p">1041:第一光敏化介電層</p>
        <p type="p">1042:第二光敏化介電層</p>
        <p type="p">106:通孔</p>
        <p type="p">108:導孔金屬層</p>
        <p type="p">110:線路層</p>
        <p type="p">1101:正面線路層</p>
        <p type="p">1102:背面線路層</p>
        <p type="p">1101-1、1102-1:第一線路部分</p>
        <p type="p">1101-2、1102-2:第二線路部分</p>
        <p type="p">112:(塞孔)介電層</p>
        <p type="p">114:導盲孔</p>
        <p type="p">1141:正面導盲孔</p>
        <p type="p">1142:背面導盲孔</p>
        <p type="p">116:焊墊層</p>
        <p type="p">1161:正面焊墊層</p>
        <p type="p">1162:背面焊墊層</p>
        <p type="p">118:綠漆層</p>
        <p type="p">1181:正面綠漆層</p>
        <p type="p">1182:背面綠漆層</p>
        <p type="p">122:導孔</p>
        <p type="p">FS:基板正面</p>
        <p type="p">BS:基板背面</p>
        <p type="p">X:X方向</p>
        <p type="p">Y:Y方向</p>
        <p type="p">Z:Z方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="748" publication-number="202617368">
    <tif-files tif-type="multi-tif">
      <tif file="113141477.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性轉接頭結構</chinese-title>
        <english-title>MAGNETIC CONNECTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">B25B23/12</main-classification>
        <further-classification edition="200601120250108B">B25B13/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>六宏工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU HUNG INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅世輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SHIH-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種磁性轉接頭結構，包括：本體，具有銜接之接頭部及靠抵        &lt;br/&gt;部，接頭部之其中一端銜接靠抵部，本體另具有插設槽，插設槽貫穿靠抵部並伸入接頭部內，靠抵部另具有至少二容納孔，容納孔位於插設槽周圍；複數磁性單元，設置於容納孔內，磁性單元之數量與容納孔之數量相同，磁性單元供以提供磁力，藉此，可讓接頭部呈薄殼狀，大幅縮小接頭部之厚度，讓本體套設於扳手後可運用在較狹窄的空間。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic connector structure includes a body having a connecting portion and an abutting portion, one end of the connecting portion is connected to the abutting portion, the body is defined with an insertion slot passing through the abutting portion and into the connecting portion, the abutting portion is defined with at least two receiving holes that located around the insertion slot, and a plurality of magnetic units disposed in the receiving holes and used to provide magnetic force, the number of the magnetic units is the same as that of the receiving holes, thereby, the connecting portion can be a thin shell shape, greatly reducing the thickness of the connecting portion, so that the wrench can be used in a narrow space after the body is mounted on the wrench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:接頭部</p>
        <p type="p">111:通孔</p>
        <p type="p">12:靠抵部</p>
        <p type="p">12A:外周面</p>
        <p type="p">121:容納孔</p>
        <p type="p">13:插設槽</p>
        <p type="p">20:磁性單元</p>
        <p type="p">21:磁鐵</p>
        <p type="p">22:套環</p>
        <p type="p">X:軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="749" publication-number="202618595">
    <tif-files tif-type="multi-tif">
      <tif file="113141489.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618595</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧驅動的動態逆向驗證網路安全系統及網路安全方法</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE-DRIVEN CYBERSECURITY SYSTEM AND CYBERSECURITY METHOD WITH DYNAMIC REVERSE AUTHENTICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250303B">G06F21/57</main-classification>
        <further-classification edition="201301120250303B">G06F21/50</further-classification>
        <further-classification edition="202201120250303B">H04L9/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳東豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TUNG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PO-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種網路安全系統，主動偵測並緩解企業網路環境中的網路威脅。該網路安全系統整合了AI驅動的行為分析，以監控和建模正常的網路活動，從而識別可能表明潛在安全漏洞的異常模式。網路安全系統執行逆向驗證演算法，以通過結合偽裝的時間戳、隨機十六進制數字以及從ASCII隨機字串表動態衍生的搜尋字串，生成一個獨特的32字節驗證字串。這一機制通過防止預測和重放攻擊，增強了安全性，從而確保了強健的驗證。當偵測到異常活動或驗證失敗時，網路安全系統啟動分層防禦回應，包括封包過濾、IP封鎖、執行自訂的威脅中和腳本，以及整合內容傳遞網路以對抗分散式拒絕服務攻擊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An advanced network security system that proactively detects and mitigates network threats within enterprise network environments is provided. This network security system integrates AI-driven behavioral analysis to monitor and model normal network activities, thereby identifying anomalous patterns that may indicate potential security vulnerabilities. The network security system implements a Reverse Authentication Algorithm to generate a unique 32-byte authentication string by combining disguised timestamps, random hexadecimal numbers, and search strings dynamically derived from an ASCII random string table. This mechanism enhances security by preventing prediction and replay attacks, thereby ensuring robust authentication. Upon detecting abnormal activities or failed authentications, the network security system initiates a layered defense response, including packet filtering, IP blocking, executing custom threat-neutralizing scripts, and integrating with content delivery networks (CDNs) to counteract Distributed Denial-of-Service (DDoS) attacks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路安全系統</p>
        <p type="p">110:資料收集模組</p>
        <p type="p">120:AI分析引擎</p>
        <p type="p">130:驗證模組</p>
        <p type="p">132:逆向驗證演算法</p>
        <p type="p">140:防禦回應模組</p>
        <p type="p">160:加密資料庫</p>
        <p type="p">20:CDN邊緣伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="750" publication-number="202618526">
    <tif-files tif-type="multi-tif">
      <tif file="113141498.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋鈕及其感測電路</chinese-title>
        <english-title>KNOB AND RELATED SENSING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">G06F3/041</main-classification>
        <further-classification edition="201301120241128B">G06F3/0362</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡吳傳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種旋鈕，設置於一觸控面板，觸控面板包括一第一觸控感測單元、一第二觸控感測單元及一第三觸控感測單元。旋鈕包含有一底部表面及一第一連接部。底部表面包括一感測電極，對準第一觸控感測單元；一第一共同電極，對準第二觸控感測單元，接收來自第二觸控感測單元的第一參考電壓；以及一第二共同電極，對準第三觸控感測單元，接收來自第三觸控感測單元的第二參考電壓。當旋鈕旋轉時，第一連接部用以控制感測電極與第一共同電極以及第二共同電極是否導通。觸控面板的一觸控感測電路根據第一觸控感測單元的訊號變化量判斷旋鈕的旋轉方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A knob is disposed on a touch panel including a first touch sensor, a second touch sensor and a third touch sensor. The knob includes a bottom surface and a first connector. The bottom surface includes a sensing electrode aligned with the first touch sensor, a first common electrode aligned with the second touch sensor and receiving a first reference voltage from the second touch sensor, and a second common electrode aligned with the third touch sensor and receiving a second reference voltage from the third touch sensor. The first connector controls the sensing electrode to be connected to the first common electrode and the second common electrode or not. A touch sensing circuit of the touch panel determines a turning direction of the knob according to a signal variation of the first touch sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:旋鈕</p>
        <p type="p">RX:感測電極</p>
        <p type="p">COM1,COM2:共同電極</p>
        <p type="p">300:觸控面板</p>
        <p type="p">S1~S3:觸控感測單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="751" publication-number="202619578">
    <tif-files tif-type="multi-tif">
      <tif file="113141499.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單光子偵測器</chinese-title>
        <english-title>SINGLE-PHOTON DETECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250210B">H10F30/22</main-classification>
        <further-classification edition="202501120250210B">H10F77/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元智大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN ZE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫朝陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JAU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恭如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, GONG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種單光子偵測器，其包含一基板，該基板埋設一深n型層，該基板之一上方設置一高電壓p型層以及一高電壓n型層，一深p型層設置於該深n型層以及該高電壓p型層之間，並該高電壓n型層環設於該深p型層之一外側，一吸收層設置於該高電壓p型層之上表面，其中，該深p型層之具有一第一面積，該高電壓n型層內側之該高電壓p型層具有一第二面積，該第一面積小於等於該第二面積之50%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is a single-photon detector, which includes a substrate with a deep n-type layer embedded in it, a high-voltage p-type layer and a high-voltage n-type layer and a deep p-type layer disposed above the substrate. is disposed between the deep n-type layer and the high-voltage p-type layer, and the high-voltage n-type layer is ringed on one side of the deep p-type layer, and an absorption layer is disposed on the upper surface of the high-voltage p-type layer , wherein the deep p-type layer has a first area, and the high-voltage p-type layer inside the high-voltage n-type layer has a second area, and the first area is less than or equal to 50% of the second area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單光子偵測器</p>
        <p type="p">10:基板</p>
        <p type="p">20:深n型層</p>
        <p type="p">30:高電壓p型層</p>
        <p type="p">31:低電壓p型層</p>
        <p type="p">40:高電壓n型層</p>
        <p type="p">41:低電壓n型層</p>
        <p type="p">50:深p型層</p>
        <p type="p">60:吸收層</p>
        <p type="p">A:第二電極</p>
        <p type="p">C:第一電極</p>
        <p type="p">L:入射光子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="752" publication-number="202619269">
    <tif-files tif-type="multi-tif">
      <tif file="113141507.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能板載具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241104B">H02S20/00</main-classification>
        <further-classification edition="201401120241104B">H02S20/30</further-classification>
        <further-classification edition="201401120241104B">H02S30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅瀚綠能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林岱弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇俊騫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴義芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳妤婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林東森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種太陽能板載具包含具有車架的一車體、固定於該車架的頂部的一支架、連結於一開合裝置、固定於該支架的一第一太陽能板，及一第二太陽能板，該開合裝置包含一撓性傳動裝置及一驅動裝置，該撓性傳動裝置包含一第一傳動輪、一第二傳動輪、繞於該第一傳動輪及第二傳動輪的一撓性件，以及固定於該撓性件的一第一驅動塊，該驅動裝置能驅動該撓性件相對位移，帶動該第一驅動塊移動，該第二太陽能板與該第一驅動塊連結，而能隨著該第一驅動塊移動，而能相對該第一太陽能板伸出，增加受到日照的總面積及發電量，並且能與該第一太陽能板重疊收合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:車體</p>
        <p type="p">11:車架</p>
        <p type="p">111:頂板</p>
        <p type="p">13:輪體</p>
        <p type="p">15:支架</p>
        <p type="p">151:架體</p>
        <p type="p">20:開合裝置</p>
        <p type="p">21:撓性傳動裝置</p>
        <p type="p">211:第一傳動輪</p>
        <p type="p">215:第一驅動塊</p>
        <p type="p">217:第二驅動塊</p>
        <p type="p">25:驅動裝置</p>
        <p type="p">31:第一太陽能板</p>
        <p type="p">32:第二太陽能板</p>
        <p type="p">33:第三太陽能板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="753" publication-number="202616997">
    <tif-files tif-type="multi-tif">
      <tif file="113141514.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調整型椅</chinese-title>
        <english-title>ADJUSTABLE CHAIR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241130B">A47C3/20</main-classification>
        <further-classification edition="200601120241130B">A47C7/36</further-classification>
        <further-classification edition="200601120241130B">A47C1/022</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國睦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERITS HEALTH PRODUCTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭舜遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種調整型椅包含椅座、椅背框架、椅背靠板以及二扶手結構。椅背框架樞接於椅座且包含二側板。椅背靠板可動地設置於該椅背框架。二扶手結構分別樞接於二側板，各扶手結構包含固定板、銷件、穩定套件及扶手支架。固定板固定於側板且包含樞孔。銷件穿設於樞孔。穩定套件套於銷件。扶手支架與銷件鎖接。椅背框架轉動第一角度，連動扶手結構轉動第二角度，扶手結構的第二角度小於第一角度。藉此，可提升使用的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adjustable chair includes a seat, a back frame, a backrest and two armrest structures. The back frame is pivotally connected to the seat and includes two side panels. The backrest is pivotally connected to the back frame. The two armrest structures are respectively pivotally connected to the two side panels. Each of the two armrest structures includes a fixed plate, a pin, a stabilizing element and an armrest bracket. The fixed plate is fixed at one of the two side panels and includes a pivot hole. The pin passes through the pivot hole. The stabilizing element is disposed at the pin. The armrest bracket is locked to the pin. The back frame rotates a first angle to allow the armrest structure to rotate a second angle. The second angle of the armrest structure is smaller than the first angle. Therefore, a using convenience is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:調整型椅</p>
        <p type="p">110:椅座</p>
        <p type="p">120:椅背框架</p>
        <p type="p">121:側板</p>
        <p type="p">130:椅背靠板</p>
        <p type="p">140:扶手結構</p>
        <p type="p">150:驅動元件</p>
        <p type="p">160:驅動桿</p>
        <p type="p">170:連動桿</p>
        <p type="p">180:頭靠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="754" publication-number="202618631">
    <tif-files tif-type="multi-tif">
      <tif file="113141539.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>驗證賣方商品與買方購買物品相符的驗貨系統與驗貨方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR VERIFYING SELLER'S GOODS AGAINST BUYER’S PURCHASED ITEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250205B">G06Q10/08</main-classification>
        <further-classification edition="202301120250205B">G06Q10/30</further-classification>
        <further-classification edition="202301120250205B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡睿宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JUI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡睿宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JUI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡璞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種驗貨系統與驗貨方法，用於在指定交付地點（如便利商店或物流中心）驗證賣方的商品是否與買方購買的物品相符。該驗貨系統包括、一個用於獲取與商品相關的識別資訊的物品資訊檢索裝置，以及一個用於記錄開箱過程的物品監控裝置。所錄資料可以安全儲存在雲端或所在地的儲存系統中。買方可將商品與原始訂單進行驗證，如有差異，則可啟動退貨流程，包括生成包裹追蹤號碼並通知賣方。所錄影像對買方與賣方皆可瀏覽，提供可靠的證據以解決爭議。該系統通過提供第三方驗證及驗證過程的安全存檔，增強了電子商務交易中的透明度與信任度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and method for verifying whether a seller's goods match a buyer’s purchased items at a designated delivery location, such as a convenience store or distribution center. The system includes an item information retrieval device for obtaining identification information associated with the goods, and an item monitoring device for recording the unboxing process. The recorded data is securely stored in a cloud-based storage system. The buyer can verify the goods against the original purchase order, and in case of a discrepancy, a return process is initiated, including generating a package tracking number and notifying the seller. The recorded footage is accessible to both the buyer and seller, providing reliable evidence for resolving disputes. The system enhances transparency and trust in e-commerce transactions by offering third-party verification and secure archival of the verification process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:驗貨系統</p>
        <p type="p">105:平台</p>
        <p type="p">105a:感測器</p>
        <p type="p">105b:重量感測器</p>
        <p type="p">110:物品資訊檢索裝置</p>
        <p type="p">120:物品監控裝置</p>
        <p type="p">130:雲端儲存系統</p>
        <p type="p">140:處理單元</p>
        <p type="p">145:資料庫</p>
        <p type="p">1452:購買物品清單</p>
        <p type="p">150:比較模組</p>
        <p type="p">160:使用者介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="755" publication-number="202617295">
    <tif-files tif-type="multi-tif">
      <tif file="113141543.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種農業剩餘資材製成石墨化粉體碳材的方法</chinese-title>
        <english-title>A METHOD FOR MAKING GRAPHITIZED POWDER CARBON MATERIAL FROM AGRICULTURE RESIDUAL MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241204B">B09B3/50</main-classification>
        <further-classification edition="202201120241204B">B09B3/70</further-classification>
        <further-classification edition="202201320241204B">B09B101/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碳美林科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBON FREE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁敏航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MIN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茹媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種農業剩餘資材製成石墨化粉體碳材的方法，包括下列步驟：步驟(1)，將一農業剩餘資材粉碎至10mm以下後均勻加入一微波吸收材料；步驟(2)，將該農業剩餘資材在一第一少氧條件下，以微波加熱至600-800℃之間停留10-30分鐘，收集該農業剩餘資材所生成之一固態物質；步驟(3)，將該固態物質進行一清洗與乾燥處理後，以得到一焦炭化碳材；以及步驟(4)，將該焦炭化碳材進一步粉碎到1mm以下，在一第二少氧條件下以微波加熱至1300-1600℃之間停留10-20分鐘，以得到一石墨化粉體碳材。該製程方法操作簡單方便，且快速節能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a method for making graphitized powder carbon material from agriculture residual materials, which includes the following steps: step of (1), crushing an organic waste to less than 10 mm and then evenly adding a microwave absorbing material; step (1) 2), microwave-heating the organic waste under a first low-oxygen condition to 600-800℃ for 10-30 minutes, and collecting a solid substance generated by the organic waste; step (3), cleaning, pulverizing and drying the solid material to obtain a coked carbon material; and step (4), microwave-heating the coked carbon material to 1200-1500℃ under a second low-oxygen condition for 10-30 minutes to obtain a graphitized powder carbon material. The proposed method is simple and convenient to operate, fast and energy-saving.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="756" publication-number="202617296">
    <tif-files tif-type="multi-tif">
      <tif file="113141544.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種將木質廢料製成活性碳的方法</chinese-title>
        <english-title>A METHOD FOR MAKING ACTIVATED CARBON FROM WOOD WASTE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250106B">B09B3/50</main-classification>
        <further-classification edition="202201120250106B">B09B3/70</further-classification>
        <further-classification edition="202201120250106B">B09B3/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碳美林科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBON FREE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁敏航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MIN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茹媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種將木質廢料製成活性碳的方法，其包括下列步驟：步驟(1)，粉碎一木質廢料成一粉碎木質廢料，該粉碎木質廢料顆粒尺寸在至10mm以下至1mm；步驟(2)，分散添加一混合活化劑到該粉碎木質廢料；步驟(3)，將該粉碎木質廢料進行一第一階段微波加熱處理以形成一類活性碳材料；以及步驟(4)，將該粉碎木質廢料進行一第二階段微波加熱處理以形成一活性碳材料。本發明提出分散添加一混合活化劑到粉碎木質廢料，用一次性兩階段式微波加熱處理將粉碎木質廢料直接炭化且活化成高品質的活性碳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a method for for making activated carbon from wood waste, which includes the following steps: step (1), crushing a wood waste into a pulverized wood waste, the particle size of the pulverized wood waste is below 10 mm to 1 mm; step (2) ), disperse and add a mixed activator to the pulverized wood waste; step (3), perform the pulverized wood waste a first-stage microwave heating treatment to form a semi-activated carbon material; and step (4), perform the pulverized wood waste a second stage microwave heating treatment to form a activated carbon material. The present invention proposes the dispersed addition of a mixed activator to the pulverized wood waste, and then using of a one-time two-stage microwave heating treatment to make the pulverized wood waste be directly carbonized and activated into high-quality activated carbon.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="757" publication-number="202617625">
    <tif-files tif-type="multi-tif">
      <tif file="113141545.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種整合負碳材料的建築材料與其製造方法</chinese-title>
        <english-title>A BUILDING MATERIAL WITH CARBON-NEGATIVE MATERIALS AND THE METHOD MANUFACTURING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C04B18/04</main-classification>
        <further-classification edition="200601120241205B">C04B18/24</further-classification>
        <further-classification edition="200601120241205B">C04B20/02</further-classification>
        <further-classification edition="202201120241205B">B09B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碳美林科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBON FREE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁敏航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MIN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茹媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧博維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊佳哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIA-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種整合負碳材料的建築材料，包含：一負碳材料，與一建築主材料混合形成；其中，該負碳材料係來自一農業廢棄物經過一微波裂解製程所生成的一固態物質。該建築主材料係包含沙石、玻璃、水泥、塗料、磁磚、塑膠、木材、竹材、紙類等材料。本發明更提供一種整合負碳材料的建築材料之製程方法。藉由本發明的一種整合負碳材料的建築材料與其製造方法，該整合負碳材料的建築材料具有大量的微米級孔隙，可吸附空氣中水氣與異味氣體分子，提升建築室內外環境品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a building material with carbon-negative materials, comprising: a carbon negative material mixed with a main building material; wherein, the carbon-negative material is a solid substance generated by a microwave pyrolysis process of agricultural waste. The main building material is selected from one of Sand, glass, cement, paint, tile, plastic, wood, bamboo, and paper. The present invention further provides a manufacturing method of the building material. With the building material and its manufacturing method of the present invention, the building material has a large number of micron-scale pores, which can absorb water vapor and odor gas molecules in the air to improve the indoor and outdoor environmental quality of buildings.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="758" publication-number="202617600">
    <tif-files tif-type="multi-tif">
      <tif file="113141546.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種有機廢棄物製成多孔性碳材的方法</chinese-title>
        <english-title>A METHOD FOR MAKING POROUS CARBON MATERIALS FROM ORGANIC WASTE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241113B">C01B32/324</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碳美林科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBON FREE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁敏航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MIN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茹媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧博維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊佳哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIA-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種有機廢棄物製成多孔性碳材的方法，多孔性碳材的比表面積在500至1500平方公尺/克之間，包括下列步驟：步驟(1)，將一有機廢棄物進行粉碎至10mm以下後均勻加入一微波吸收材料；步驟(2)，將該有機廢棄物在一第一少氧條件下以微波加熱至400-600℃之間停留10-30分鐘；步驟(3)，收集該有機廢棄物在步驟(2)後所生成之一液態物質，在該液態物質中均勻加入一酸性混合材料以反應一段時間；步驟(4)，將該液態物質，在一第二少氧條件下以微波加熱至600-1200℃之間停留10-30分鐘；以及步驟(5)，收集該液態物質在步驟(4)後所生成之一固態物質，將該固態物質進行清洗與乾燥後以得到多孔性碳材。該製程方法操作簡單方便，且快速節能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a method for making porous carbon material from organic waste, the specific surface area of the porous carbon material is between 500 and 1500 square meters/gram, including the following steps: step of (1), crushing an organic waste to less than 10mm and then evenly adding a microwave absorbing material; step (2), microwave heating the organic waste under a first low-oxygen condition to 400-600℃ for 10-30 minutes; step (3), collecting a liquid substance generated by the organic waste after step (2) and evenly adding an acidic mixed material to the liquid substance to react for a period of time; step (4), microwave heating the liquid material under a second low-oxygen condition to 600-1200℃ for 10-30 minutes; and step (5), collecting the solid material generated by the liquid material after step (4), and then washing and drying the solid material to obtain a porous carbon material. The proposed method is simple and convenient to operate, fast and energy-saving.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="759" publication-number="202618108">
    <tif-files tif-type="multi-tif">
      <tif file="113141547.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種負碳建築磚塊與其製造方法</chinese-title>
        <english-title>A CARBON-NEGATIVE BUILDING BRICK AND THE METHOD MANUFACTURING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">E04C2/34</main-classification>
        <further-classification edition="200601120241230B">E04C1/39</further-classification>
        <further-classification edition="200601120241230B">B28B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碳美林科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBON FREE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁敏航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MIN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茹媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種負碳建築磚塊，包含：一負碳材料，一建築主材料與一固化材料混合形成；其中，該負碳材料係來自一農業廢棄物經過一微波裂解製程所生成的一固態物質，該固化材料係選自樹酯、水性膠、瀝青、黏土與其混合物之一，該建築主材料係包含沙石、玻璃、水泥、塗料、磁磚、塑膠、木材、竹材、紙類等材料。本發明更提供一種負碳建築磚塊之製程方法。該負碳建築磚塊具有大量的微米級孔隙，可吸附空氣中水氣與異味氣體分子，提升建築室內外環境品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">T The invention provides a carbon-negative building brick, which includes: mixing together of a carbon-negative material, a building main material and a curing material; wherein, the negative-carbon material is a solid matter generated from an agricultural waste through a microwave pyrolysis process, the curing material is selected from one of resin, asphalt, and clay, and the main building materials include sand, glass, cement, paint, tiles, plastic, wood, bamboo, paper and other materials. The invention further provides a method for manufacturing carbon-negative building bricks. The carbon-negative building bricks have a large number of micron-level pores, which can absorb water vapor and odor gas molecules in the air, improving the indoor and outdoor environmental quality of the building.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="760" publication-number="202617367">
    <tif-files tif-type="multi-tif">
      <tif file="113141550.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭力墊片</chinese-title>
        <english-title>TORQUE WASHER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">B25B23/00</main-classification>
        <further-classification edition="200601120250108B">F16B43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁健原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, JIANN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊國正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁健原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, JIANN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊國正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明扭力墊片係具有二周緣面，並包括有複數間隔凸設在其一周緣面上之凸出部，一相反於每一該凸出部方向且位於另一周緣面上凹設形成有一容置孔，同時該容置孔內部容置有黏膠；是以，利用該等凸出部可承受一定壓力設定，以便當該扭力墊片使用時，該等凸出部受到螺絲或螺帽等外部壓力產生型態改變，進而可擠壓該黏膠溢出該容置孔，故當該黏膠溢出該容置孔時，使用者可即時判斷該螺絲或螺帽作用力已達到所設定的扭矩值標準，亦無需額外準備扭力板手以確認扭矩值，故大幅提升鎖合效率，並且該黏膠溢出後可形成一保護層，以防止水氣滲入鎖合物內而致使該螺絲產生鏽蝕，更達延長該螺絲之使用壽命等功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A torque washer includes two circumferential surfaces and includes a plurality of spaced-apart protrusions protruding from one circumferential surface. A cavity is recessedly formed in the other one circumferential surface and located in opposing relationship to each protrusion. A viscous member is accommodated in each cavity. Accordingly, the protrusions can bear pressure to a certain extent and have a change in the shape under the external pressure applied by a screw or a nut when the torque washer is in use, with the result that the viscous member can be extruded and forced out through the cavity. When the viscous member is forced out, a user can determine that the force applied by the screw or the nut reaches a predetermined torque value and can determine instantly without using torque wrenches which serve to monitor the torque value. Thus, a screwing efficiency is greatly increased. When the viscous member is forced out, a protective layer is formed to prevent water vapor from permeating into a workpiece and prevent the screw from rusting because of the permeation of the water vapor, thereby prolonging the service life of the screw.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:扭力墊片</p>
        <p type="p">51:周緣面</p>
        <p type="p">52:通孔</p>
        <p type="p">53:凸出部</p>
        <p type="p">54:容置孔</p>
        <p type="p">A:黏膠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="761" publication-number="202618835">
    <tif-files tif-type="multi-tif">
      <tif file="113141555.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備防鬼鍵功能的薄膜總成單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">H01H13/78</main-classification>
        <further-classification edition="200601120241128B">H01H13/785</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>精元電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNREX TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳星光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSING-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具備防鬼鍵功能的薄膜總成單元，包含一下薄膜、一感應電路模組及一上薄膜。該感應電路模組包括一連接於該下薄膜頂側的下線路部、複數設置於該下線路部頂側且相互間隔設置的柔性碳墨片體，及一設置於該等柔性碳墨片體頂側的上線路部，該下線路部與該上線路部藉由該等柔性碳墨片體相互間隔，且該等柔性碳墨片體皆為壓力感測電阻。該上薄膜設置於該下薄膜與該感應電路模組頂側，並與該下薄膜相互結合。藉由將該下線路部、該等柔性碳墨片體與該上線路部集成在該下薄膜，而能夠免去中隔層與異方性導電膠等材料的成本，具備降低整體成本的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:感應電路模組</p>
        <p type="p">31:下線路部</p>
        <p type="p">311:感應線</p>
        <p type="p">32:柔性碳墨片體</p>
        <p type="p">321:片體底面</p>
        <p type="p">322:片體頂面</p>
        <p type="p">323:片體圍繞面</p>
        <p type="p">33:上線路部</p>
        <p type="p">331:驅動線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="762" publication-number="202616970">
    <tif-files tif-type="multi-tif">
      <tif file="113141556.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彈性支撐結構</chinese-title>
        <english-title>FLEXIBLE SUPPORTING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">A43B13/14</main-classification>
        <further-classification edition="202201120250108B">A43B13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滙歐科技開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭清松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAW, CHING-SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種彈性支撐結構，包含一發泡體以及一支撐結構，該發泡體包含至少一簍空結構及/或凹槽，該支撐結構環狀地凹曲形成一開口，該支撐結構內界定一包覆空間，將該支撐結構設置該發泡體內，使該包覆空間包覆該簍空結構或是該凹槽，增加該發泡體的使用壽命，並且維持良好的彈性以及支撐性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flexible supporting structure has a foam body and an support structure. The foam body has at least one lattice structure and/or groove. The support structure is annularly curved to form an opening, defining a covering space within the support structure. The support structure is placed within the foam body, such that the covering space encloses the lattice structure or groove, thereby extending the foam body life and maintaining good elasticity and support.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:發泡體</p>
        <p type="p">111:簍空結構</p>
        <p type="p">12:支撐結構</p>
        <p type="p">121:開口</p>
        <p type="p">122:包覆空間</p>
        <p type="p">123:外展部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="763" publication-number="202619576">
    <tif-files tif-type="multi-tif">
      <tif file="113141557.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多功能感測元件及其製法</chinese-title>
        <english-title>MULTIFUNCTION SENSING DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250512B">H10F30/10</main-classification>
        <further-classification edition="200601120250512B">C23C14/08</further-classification>
        <further-classification edition="200601120250512B">C23C14/34</further-classification>
        <further-classification edition="201101120250512B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立聯合大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNITED UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊勝州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUNG, SHENG-JOUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱彥霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉承竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHERNG-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明多功能感測元件包含一基板，及設置於該基板上的一電極組和一感測結構。該感測結構設置於該電極組上，具有一由氧化鋅構成的感測層及一披覆於該感測層的增強層。該感測層的氧化鋅成奈米片狀結構，且平均寬度為30 nm，該增強層由鈀金屬奈米粒子構成。本案利用該感測結構的材料組合與結構，使該多功能感測元件具有良好的感測靈敏度的同時，進一步提升回復性、響應性和穩定性。此外，本發明還提供該多功能感測元件的製法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multifunction sensing device includes a substrate, an electrode group and a sensing structure disposed on the substrate. The sensing structure disposed on the electrode group and has a sensing layer composed of zinc oxide and an enhancenment layer covering the sensing layer. The zinc oxide in the sensing layer ng the sensing layer. The zinc oxide in the sensing layer has a nanosheet structure with an average width of 30 nm, and the enhancement layer is composed of palladium nanoparticles. The sensing structure in this invention improves the sensitivity of the multifunction sensing device while further improving responsivity, reversibility and stability. Besides, the invention also provides a manufacturing method of the multifunction sensing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:電極組</p>
        <p type="p">211:電極部</p>
        <p type="p">30:感測結構</p>
        <p type="p">31:感測層</p>
        <p type="p">32:增強層</p>
        <p type="p">40:氧化鋅晶種層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="764" publication-number="202618727">
    <tif-files tif-type="multi-tif">
      <tif file="113141563.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化答案相符性評估系統及自動化答案相符性評估方法</chinese-title>
        <english-title>AUTOMATED ANSWER MATCHING EVALUATION SYSTEM AND AUTOMATED ANSWER MATCHING EVALUATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">G09B7/02</main-classification>
        <further-classification edition="202001120250204B">G06F40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉山商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E.SUN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇時頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOO, SHIH-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化答案相符性評估系統，包含一儲存單元及一電連接於該儲存單元的處理單元。對於對應於多個開放式題目的多個待分析答案及多個標準答案，該處理單元將各該待分析答案及對應的該標準答案輸入一用於分析該待分析答案及該標準答案的相符程度的大型語言模型以產生對應於該待分析答案的一相符性分析結果。該處理單元根據該等相符性分析結果計算一評分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automated answer matching evaluation system includes a storage unit and a processing unit electrically connected to the storage unit. With respect to multiple to-be-analyzed answers and multiple standard answers corresponding to multiple open questions, the processing unit inputs each of the to-be-analyzed answers and the corresponding standard answer into a large language model for analyzing a matching degree of the to-be-analyzed answer and the standard answer to generate a matching analysis result corresponding to the to-be-analyzed answer. The processing unit calculates a score based on the matching analysis results.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自動化答案相符性評估系統</p>
        <p type="p">1:儲存單元</p>
        <p type="p">2:處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="765" publication-number="202619314">
    <tif-files tif-type="multi-tif">
      <tif file="113141576.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>實體層延遲估計方法</chinese-title>
        <english-title>METHOD FOR ESTIMATING PHY DELAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">H04L1/24</main-classification>
        <further-classification edition="202201120250108B">H04L69/323</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞信電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIX ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董明達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, MING TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘永吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YUNG CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝瑞峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, JUI FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施例的估計待測裝置實體層延遲(phy delay)的方法，包括下列步驟：取得一測試裝置的至少一第一實體層延遲；以一電纜連接該測試裝置與一待測裝置(device under test)；取得該電纜的一電纜延遲；使該測試裝置與該待測裝置同步；取得該測試裝置的至少一測試媒體存取控制層時間戳記；取得該待測裝置的至少一待測媒體存取控制層時間戳記；以及依據該至少一測試媒體存取控制層時間戳記、該至少一待測媒體存取控制層時間戳記、該至少一第一實體層延遲與該電纜延遲，計算該待測裝置的至少一待測實體層延遲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for estimating the phy delay of a device under test (DUT) includes the following steps: obtaining at least one first phy delay of a testing device; by a cable, connecting the testing device to a DUT; obtaining a cable delay of the cable; making the testing device and the DUT timing synchronous; obtaining at least one testing MAC time stamp of the testing device; obtaining at least one MAC time stamp of the DUT; and calculating at least one phy delay of the DUT based on the at least one testing MAC time stamp, the at least one MAC time stamp of the DUT, the at least first phy delay, and the cable delay</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:實體層延遲估測系統</p>
        <p type="p">110:測試裝置</p>
        <p type="p">120:待測裝置</p>
        <p type="p">130:控制裝置</p>
        <p type="p">140:電纜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="766" publication-number="202617273">
    <tif-files tif-type="multi-tif">
      <tif file="113141577.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141577</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體更換裝置</chinese-title>
        <english-title>FLUID REPLACEMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B05C11/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立晏企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIH YANN INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖伯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種流體更換裝置，其包括：一儲存單元、一輸氣單元及一排油單元。該儲存單元包含有一容器與一活塞，該活塞可移動地容設於該容器，該活塞將該容器之內部區分成不相連通之一第一空間與一第二空間，該第一空間供儲放流體；該輸氣單元可選擇性地連通該第二空間以驅使該活塞位移而壓縮該第一空間；該排油單元連通該第一空間以供承接引導流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a fluid replacement device, which includes a storage unit, an air supply unit, and an oil discharge unit. The storage unit comprises a container and a piston, with the piston movably accommodated within the container. The piston divides the interior of the container into a first space and a second space, which are not interconnected. The first space is used for storing fluid. The air supply unit selectively communicates with the second space to drive the piston to move and compress the first space. The oil discharge unit is connected to the first space to guide the fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:儲存單元</p>
        <p type="p">17:提把組件</p>
        <p type="p">7:座體</p>
        <p type="p">71:佇立件</p>
        <p type="p">72:層板</p>
        <p type="p">73:滾輪</p>
        <p type="p">74:上層空間</p>
        <p type="p">75:下層空間</p>
        <p type="p">8:置物櫃</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="767" publication-number="202617272">
    <tif-files tif-type="multi-tif">
      <tif file="113141586.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141586</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鈣鈦礦太陽能電池的製造方法</chinese-title>
        <english-title>MANUFACTURE METHOD OF PEROVSKITE SOLAR CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">B05C5/02</main-classification>
        <further-classification edition="200601120250102B">B05C11/06</further-classification>
        <further-classification edition="200601120250102B">B05C11/08</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崇翌科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRO CLEAN TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫立峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, LI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-SSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鈣鈦礦太陽能電池的製造方法，包括提供待噴塗物以及使用噴塗機噴塗藥液，以於待噴塗物上形成功能層。噴塗機內的噴頭包括具有吐出口且用以輸出藥液的本體、設置於本體上且用以控制輸出藥液的壓力參數值的多個第一控制元件以及設置於本體上且用以控制輸出藥液的吐用量參數值的第二控制元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a perovskite solar cell includes providing an object to be sprayed and using a spraying machine to spray a chemical liquid to form a functional layer on the object to be sprayed. A nozzle in the spraying machine includes a body with an outlet and used to output the chemical liquid, a plurality of first control elements arranged on the body and used to control a pressure parameter value of the output chemical liquid, and a second control element arranged on the body and used to control a parameter value of the dispensing amount of the chemical liquid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="768" publication-number="202618478">
    <tif-files tif-type="multi-tif">
      <tif file="113141587.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製圖軟體轉換為彎管機加工軟體的轉換方法</chinese-title>
        <english-title>CONVERSION METHOD FOR CONVERTING DRAWING SOFTWARE INTO PIPE BENDING MACHINE OPERATING SOFTWARE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G05B19/4093</main-classification>
        <further-classification edition="200601120241204B">G05B19/4099</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穎漢科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YING HAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡炳昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, PING-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種製圖軟體轉換為彎管機加工軟體的轉換方法，其包括以下步驟：將製圖軟體檔案輸入轉換裝置，製圖軟體檔案包含對應加工管件的管件設計圖；辨識管件設計圖中的管件端面，分析管件端面的管件直徑、管件厚度、管件長度及管件方向；辨識管件設計圖中加工管件的表面邊界，由表面邊界構成特徵曲線，並判定特徵曲線當中的複數個曲線類型，依據複數個曲線類型分別界定特徵曲線的複數個中心點；將特徵曲線的複數個中心點連結，轉換成加工軟體程序中的加工參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A conversion method for converting drawing software into pipe bending machine operating software. The conversion method includes the following steps: inputting the drawing software file into a conversion device. The drawing software file includes the pipe design drawing corresponding to the processed pipe; identifying end surfaces of the processed pipe in the pipe design drawing, analyzing pipe diameter, pipe thickness, pipe length and pipe direction from the end surfaces of the pipe; identifying surface boundary of the processed pipe in the pipe design drawing, forming a characteristic curve from the surface boundary, and determining curve types in the characteristic curve. The center points of the characteristic curve are defined respectively according to the curve types; connecting the center points of the characteristic curve, and converting the characteristic curve into operating parameters in the operating software program.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="769" publication-number="202618591">
    <tif-files tif-type="multi-tif">
      <tif file="113141588.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板的自適應維修方法</chinese-title>
        <english-title>ADAPTIVE REPAIR METHOD OF DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250418B">G06F18/24</main-classification>
        <further-classification edition="202201120250418B">G06V10/764</further-classification>
        <further-classification edition="202301120250418B">G06N3/092</further-classification>
        <further-classification edition="202201120250418B">G06V10/26</further-classification>
        <further-classification edition="202201120250418B">G06V10/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾世恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHONG, SHIH EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖至欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭安廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, AN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江彥霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YEN LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林仕杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晨晏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡川隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHUAN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板的自適應維修方法，包括對顯示面板進行多張面板檢測影像的擷取、利用瑕疵檢測模型對這些面板檢測影像進行篩選以取得瑕疵影像，並對瑕疵影像中的瑕疵進行分類、取得顯示面板的元件模板，並且將瑕疵影像與元件模板進行匹配以確認顯示面板上靠近瑕疵的至少一元件、依據瑕疵的種類與至少一元件的種類選擇維修方式、依據瑕疵的維修方式，利用路徑預測模型生成維修方式的維修路徑以及依據維修路徑與維修方式，利用維修設備對顯示面板進行維修。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adaptive repair method of a display panel is provided. The adaptive repair method includes capturing a plurality of panel inspection images of the display panel, screening the plurality of panel inspection images to obtain a defect image by using a defect detection model, classifying a defect in the defect image, obtaining a component template of the display panel, matching the defect image with the component template to confirm at least one component close to the defect on the display panel, selecting a repair method based on the type of the defect and the type of the at least one component, using a path prediction model to generate a repair path of the repair method, and using repair equipment to repair the display panel based on the repair path and the repair method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="770" publication-number="202618324">
    <tif-files tif-type="multi-tif">
      <tif file="113141589.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141589</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體篩選方法</chinese-title>
        <english-title>SCREENING METHOD FOR LIGHT EMITTING DIODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250102B">G01R31/44</main-classification>
        <further-classification edition="200601120250102B">H01L21/66</further-classification>
        <further-classification edition="202501120250102B">H10H20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岳霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUEH-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發光二極體篩選方法，包含以下步驟：提供一晶圓，該晶圓上具有複數發光二極體結構；晶圓級靜電放電測試該晶圓上之各該發光二極體結構；晶圓級崩潰電壓測試該晶圓上之各該發光二極體結構；晶圓級光電特性測試該晶圓上之各該發光二極體結構；劈裂該晶圓上之各該發光二極體結構，以形成複數發光二極體晶粒；及排除該等發光二極體晶粒中具異常之部分發光二極體晶粒，其中該異常包含靜電放電測試異常、崩潰電壓測試異常、光電特性測試異常及外觀異常其中之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A screening method for light-emitting diodes is provided. The screening method includes the following steps: providing a wafer with a plurality of light-emitting diode structures, performing a wafer-level electrostatic discharge testing for each light-emitting diode structure on the wafer, performing a wafer-level breakdown voltage testing for each light-emitting diode structure on the wafer, performing a wafer-level photoelectric characteristics testing for each light-emitting diode structure on the wafer, dicing each light-emitting diode structure on the wafer to form a plurality of light-emitting diode dies, and excluding the light-emitting diode dies with abnormalities thereamong, where the abnormalities include one of electrostatic discharge testing abnormalities and breakdown voltage testing abnormalities, photoelectric characteristic testing abnormalities and appearance abnormalities.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01:步驟</p>
        <p type="p">S02:步驟</p>
        <p type="p">S03:步驟</p>
        <p type="p">S04:步驟</p>
        <p type="p">S05:步驟</p>
        <p type="p">S06:步驟</p>
        <p type="p">S07:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="771" publication-number="202619549">
    <tif-files tif-type="multi-tif">
      <tif file="113141600.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141600</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D64/00</main-classification>
        <further-classification edition="202501120250102B">H10D64/20</further-classification>
        <further-classification edition="202501120250102B">H10D64/60</further-classification>
        <further-classification edition="202501120250102B">H10D48/00</further-classification>
        <further-classification edition="202501120250102B">H10D30/47</further-classification>
        <further-classification edition="202501120250102B">H01L21/28</further-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝廷恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TING-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連羿韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡信錩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭韋志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件，包括基底、半導體通道層、半導體阻障層、源極電極、閘極電極和汲極堆疊層。汲極堆疊層包括第一汲極層，包括第一本體部和第一延伸部，且第一延伸部的底面高於第一本體部的頂面。第二汲極層，設置於第一汲極層上，且包括第二本體部和第二延伸部，其中在第一方向上，第二汲極層的長度大於第一汲極層的長度，且第二延伸部的頂面高於第二本體部的頂面。第三汲極層，設置於第二汲極層上，且包括第三本體部和第三延伸部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a semiconductor channel layer, a semiconductor barrier layer, a source electrode, a gate electrode, and a drain stacking layer. The drain stacking layer includes a first drain layer which includes a first body portion and a first extension portion, a second drain layer which includes a second body portion and a second extension portion, and a third drain layer which includes a third body portion and a third extension portion. A length of the second drain layer is greater than a length of the first drain layer in a first direction. A bottom surface of the first extension portion is higher than a top surface of the first body portion, and a top surface of the second extension portion is higher than a top surface of the second body portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:緩衝層</p>
        <p type="p">103:半導體通道層</p>
        <p type="p">104:半導體阻障層</p>
        <p type="p">105:半導體蓋層</p>
        <p type="p">140:汲極開口</p>
        <p type="p">150:底部介電層</p>
        <p type="p">151:第一層間介電層</p>
        <p type="p">152:第二層間介電層</p>
        <p type="p">152P:抬昇區</p>
        <p type="p">153:第三層間介電層</p>
        <p type="p">154:第四層間介電層</p>
        <p type="p">154B:底面</p>
        <p type="p">154T:頂面</p>
        <p type="p">400:汲極堆疊層</p>
        <p type="p">410:第一汲極層</p>
        <p type="p">411:第一本體部</p>
        <p type="p">411T、421T:頂面</p>
        <p type="p">412:第一延伸部</p>
        <p type="p">412B、422B:底面</p>
        <p type="p">412E、422E、432E:末端邊緣</p>
        <p type="p">420:第二汲極層</p>
        <p type="p">421:第二本體部</p>
        <p type="p">422:第二延伸部</p>
        <p type="p">422P:抬昇區</p>
        <p type="p">430:第三汲極層</p>
        <p type="p">431:第三本體部</p>
        <p type="p">432:第三延伸部</p>
        <p type="p">F2:長度</p>
        <p type="p">L2、L3:長度</p>
        <p type="p">T1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="772" publication-number="202619444">
    <tif-files tif-type="multi-tif">
      <tif file="113141604.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141604</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外掛支架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K5/02</main-classification>
        <further-classification edition="200601120241204B">H05K7/14</further-classification>
        <further-classification edition="200601120241204B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富世達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSITEK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鍇鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KAI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種外掛支架，適用於裝設在一伺服器機櫃，該外掛支架是包含一第一桿件、一第二桿件、一第三桿件，以及一連接單元。該第一桿件沿一高度方向延伸。該第二桿件及該第三桿件分別設於該第一桿件在該高度方向上的兩端，該第二桿件能沿該高度方向相對該第一桿件在一延伸位置及一收合位置之間滑動；該第三桿件能相對該第一桿件在一展開位置及一摺疊位置之間樞轉。該連接單元設於該第一桿件、該第二桿件及該第三桿件且用以與該伺服器機櫃連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外掛支架</p>
        <p type="p">1:第一桿件</p>
        <p type="p">11:第一主壁</p>
        <p type="p">12:第一側壁</p>
        <p type="p">121:外推壁部</p>
        <p type="p">13:第一固定部</p>
        <p type="p">14:第二固定部</p>
        <p type="p">15:第一定位部</p>
        <p type="p">2:第二桿件</p>
        <p type="p">21:第二主壁</p>
        <p type="p">22:第二側壁</p>
        <p type="p">23:限位壁</p>
        <p type="p">24:第三固定部</p>
        <p type="p">25:第二定位部</p>
        <p type="p">3:第三桿件</p>
        <p type="p">31:第三主壁</p>
        <p type="p">32:第三側壁</p>
        <p type="p">33:第四固定部</p>
        <p type="p">4:連接單元</p>
        <p type="p">41:固定鈑金件</p>
        <p type="p">42:定位孔</p>
        <p type="p">5:螺鎖組件</p>
        <p type="p">6:樞接件</p>
        <p type="p">D1:高度方向</p>
        <p type="p">D2:深度方向</p>
        <p type="p">D3:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="773" publication-number="202617299">
    <tif-files tif-type="multi-tif">
      <tif file="113141607.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141607</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無廢料華司低碳成型加工設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B21D22/02</main-classification>
        <further-classification edition="200601120241204B">B21D43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　巴虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSAKOV, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>RU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　巴虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSAKOV, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無廢料華司低碳成型加工設備，包含一主體單元、一動力單元、一調速單元、一進料單元，及一成型單元。該動力單元包括一馬達、一可被該馬達帶動的傳動機構，及一可被該傳動機構連動的滑座。該調速單元包括一固定座、二樞設於該固定座上的擺臂，及一樞接該等擺臂的傳動軸。該成型單元包括一樞接該滑座且連接該傳動軸的鍛座，及一固定於該設置座上的模座。該鍛座具有一末端為圓錐狀的鍛造件，及一供該鍛造件設置的模體。該鍛造件與該模體相配合界定出一呈環狀的模穴。該鍛造件可對料件進行鍛壓，從而一次性地鍛造出符合該模穴外型的華司。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:主體單元</p>
        <p type="p">21:基座</p>
        <p type="p">3:動力單元</p>
        <p type="p">31:馬達</p>
        <p type="p">32:傳動機構</p>
        <p type="p">321:皮帶輪組</p>
        <p type="p">322:齒輪組</p>
        <p type="p">323:偏心軸</p>
        <p type="p">33:滑座</p>
        <p type="p">4:調速單元</p>
        <p type="p">41:固定座</p>
        <p type="p">42:擺臂</p>
        <p type="p">421:上滑槽</p>
        <p type="p">422:下滑槽</p>
        <p type="p">43:傳動軸</p>
        <p type="p">5:進料單元</p>
        <p type="p">51:設置座</p>
        <p type="p">52:夾線機構</p>
        <p type="p">6:成型單元</p>
        <p type="p">7:矯直單元</p>
        <p type="p">71:立架</p>
        <p type="p">72:基板</p>
        <p type="p">73:壓輪</p>
        <p type="p">A:送料方向</p>
        <p type="p">C:料件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="774" publication-number="202618667">
    <tif-files tif-type="multi-tif">
      <tif file="113141613.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一氧化碳產品氣的產量與品質的預測方法與鋼化聯產先導工場</chinese-title>
        <english-title>METHOD FOR PREDICTING PRODUCTION AND QUALITY OF PRODUCT GAS OF CARBON MONOXIDE AND TEMPERING CO-PRODUCTION FACTORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250512B">G06Q50/04</main-classification>
        <further-classification edition="202301120250512B">G06N3/08</further-classification>
        <further-classification edition="201701120250512B">C01B32/40</further-classification>
        <further-classification edition="200601120250512B">C10K1/32</further-classification>
        <further-classification edition="200601120250512B">C10K1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈞程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳丁碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李銘偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一氧化碳(CO)產品氣的產量與品質的預測方法包括：取得鋼化聯產先導工場的多組歷史數據；根據該多組歷史數據中的多個累積進氣量、多個壓縮機壓力、多個吸附時間、多個尾氣CO濃度與多個CO產品氣產量來訓練機器學習模型，藉此預測CO產品氣的產量；及根據該多組歷史數據中的多個進氣CO濃度、多個噴淋塔出口溫度、多個累積進氣量、多個壓縮機壓力、多個水解加熱器出口溫度、多個吸附時間、多個吸附操作壓力、多個尾氣CO        &lt;sub&gt;2&lt;/sub&gt;濃度、多個尾氣CO濃度與多個CO產品氣產量來訓練品質分類模型，藉此預測CO產品氣的濃度品質是否合格。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for predicting production and quality of product gas of CO includes: obtaining plural sets of historical data of a tempering co-production factory; training a machine learning model according to plural accumulated air intake volumes, plural compressor pressures, plural adsorption times, plural CO exhaust gas concentrations and plural CO product gas production volumes included in the sets of historical data, thereby predicting production of CO product gas; and training a quality classification model according to plural inlet CO concentrations, plural spray tower outlet temperatures, plural accumulated air intake volumes, plural compressor pressures, plural hydrolysis heater outlet temperatures, plural adsorption times, plural adsorption operating pressures, plural CO        &lt;sub&gt;2&lt;/sub&gt;exhaust gas concentrations, plural CO exhaust gas concentrations and plural productions of CO product gas included in the sets of historical data, thereby predicting whether the concentration quality of the CO product gas is qualified.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="775" publication-number="202617461">
    <tif-files tif-type="multi-tif">
      <tif file="113141617.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動車充電站之充電管理方法及系統</chinese-title>
        <english-title>CHARGING MANAGEMENT METHODS AND SYSTEMS FOR ELECTRIC VEHICLE CHARGING STATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250107B">B60L53/60</main-classification>
        <further-classification edition="201901120250107B">B60L53/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拓連科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOODOE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周凡凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, FAN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡育庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊怡凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂　銘晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUW, MIN-JIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動車充電站之充電管理方法及系統，適用於包括複數電動車充電站之一充電場域與透過一第一網路連接至每一電動車充電站之一伺服器。首先，伺服器執行一能源管理方案以對於充電場域中之電動車充電站執行一負載管理作業，其中能源管理方案記錄一配電邏輯，用以控制電動車充電站中之每一者所相應之一充電作業。當負載管理作業執行時，伺服器取得電動車充電站中之一第一特定電動車充電站之一第一裝置資料，並依據相應第一特定電動車充電站之第一裝置資料決定第一特定電動車充電站相應負載管理作業的一第一參考值，其中第一參考值係可變動的。伺服器透過網路持續接收相應第一特定電動車充電站之一第一充電作業之一第一充電資料並依據第一充電資料與第一參考值判斷是否發生一特定事件。當特定事件發生時，伺服器停止對第一特定電動車充電站執行負載管理作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Charging management methods and systems for electric vehicle charging stations for use in a charging field that includes multiple electric vehicle charging stations and a server connected to each electric vehicle charging station via a network are provided. First, the server executes an energy management scheme to perform load management operations on the electric vehicle charging stations in the charging field, wherein the energy management scheme records a distribution logic to control the charging operation of each electric vehicle charging station. When the load management operation is being performed, the server obtains first device data from a first specific electric vehicle charging station and determines a first reference value for the load management operation of the first specific electric vehicle charging station based on the first device data, wherein the first reference value is adjustable. The server continuously receives first charging data corresponding to a first charging operation from the first specific electric vehicle charging station via the network and determines whether a specific event has occurred based on the first charging data and the first reference value. If the specific event occurs, the server stops performing the load management operation on the first specific electric vehicle charging station.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420、S430、S440:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="776" publication-number="202618129">
    <tif-files tif-type="multi-tif">
      <tif file="113141618.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扳桿式氣嘴接頭</chinese-title>
        <english-title>LEVER TYPE VALVE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">F04B33/00</main-classification>
        <further-classification edition="200601120250107B">F04B39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集優企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CO-LUCK ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳樹木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扳桿式氣嘴接頭，包括本體、連接裝置、抵頂件以及扳桿。本體具有氣通道。連接裝置設置於本體並適於連接氣嘴。抵頂件可移動地穿設於連接裝置並具有適於抵頂氣嘴的前端及相反於前端的後端。該抵頂件設置有連通氣通道的洩氣道及設置於後端的塞件，塞件被配置為能夠開放或封閉洩氣道，從而選擇性地使洩氣道連通外界。扳桿選擇性地於釋放位置或鎖定位置抵接塞件。當扳桿位於釋放位置，塞件開放洩氣道，使洩氣道連通外界；當扳桿位於鎖定位置，塞件封閉洩氣道，使洩氣道不連通外界。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A valve connector comprises a body, a connecting device, an abutting member, and a lever. The body is provided with an air passage. The connecting device is positioned on the body and is adapted to connect to an air valve. The abutting member is movably arranged in the connecting device and has an abutting end adapted to push against the air valve and an opposite abutted end. The abutting member is provided with an air channel connecting to the air passage and a plug located at the abutted end. The plug is configured to open or close the air channel, thereby selectively allowing the air channel to communicate with the external environment. The lever selectively abuts against the plug in either a release position or a locked position. When the lever is in the release position, the plug opens the air channel, allowing the air channel to communicate with the external environment; when the lever is in the locked position, the plug closes the air channel, preventing the air channel from communicating with the external environment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:氣通道</p>
        <p type="p">12:穿孔</p>
        <p type="p">20:連接裝置</p>
        <p type="p">21:第一連接件</p>
        <p type="p">211:連接端</p>
        <p type="p">212:操作端</p>
        <p type="p">213:第一通孔</p>
        <p type="p">214:操作部</p>
        <p type="p">215:樞槽</p>
        <p type="p">216:樞接件</p>
        <p type="p">22:第二連接件</p>
        <p type="p">221:遠端</p>
        <p type="p">222:近端</p>
        <p type="p">223:第二通孔</p>
        <p type="p">224:內螺紋部</p>
        <p type="p">225:氣密件</p>
        <p type="p">30:抵頂件</p>
        <p type="p">31:前端</p>
        <p type="p">32:後端</p>
        <p type="p">33:洩氣道</p>
        <p type="p">332:第二洩氣口</p>
        <p type="p">34:塞件</p>
        <p type="p">341:氣密塞</p>
        <p type="p">342:身部</p>
        <p type="p">343:頭部</p>
        <p type="p">35:容槽</p>
        <p type="p">36:氣密環</p>
        <p type="p">40:扳桿</p>
        <p type="p">41:樞接部</p>
        <p type="p">411:第一抵接面</p>
        <p type="p">412:第二抵接面</p>
        <p type="p">42:扳動部</p>
        <p type="p">50:彈性件</p>
        <p type="p">V:氣嘴</p>
        <p type="p">VC:芯桿</p>
        <p type="p">VT:外螺紋部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="777" publication-number="202618522">
    <tif-files tif-type="multi-tif">
      <tif file="113141619.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外加式按鈕感測設備及方法</chinese-title>
        <english-title>EXTERNAL BUTTON SENSING DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120241128B">G06F3/0346</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈宜郡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YI-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡承維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種按鈕感測之設備，其包括：至少一個感測器，設置於相對於按鈕之第一位置，且與按鈕所在之平面間具有傾斜角度；系統模組，電連接該至少一個感測器，以接收該至少一個感測器之感測資訊，並根據感測資訊發送控制訊號；以及控制器，用以接收控制訊號，並根據控制訊號觸發該按鈕。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A button sensing device including: at least one sensor, which is arranged at a first position relative to a button and has an angle of inclination with the plane where the button is located; a system module electrically connected to the at least one sensor to receive sensing information from the at least one sensor and send a control signal based on the sensing information; and a controller to receive the control signal and trigger the button based on the control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">101:按鈕</p>
        <p type="p">103:感測器</p>
        <p type="p">109:手指</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="778" publication-number="202618510">
    <tif-files tif-type="multi-tif">
      <tif file="113141620.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G06F1/16</main-classification>
        <further-classification edition="200601120241231B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王東宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DONG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫峻宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李安正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, AN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括背蓋、顯示面板以及前框結構。顯示面板定位於背蓋上，且具有朝向背蓋的背面與相對於背面的顯示面。前框結構包括第一前框和第二前框。第一前框卡合於背蓋，並覆蓋及接觸顯示面的邊緣的一部分。第二前框滑動扣接於背蓋，並覆蓋及接觸顯示面的邊緣的另一部分。顯示面板被第一前框與第二前框固定於背蓋上，且第一前框與第二前框之間存在接縫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a back cover, a display panel, and a frame structure is provided. The display panel is positioned on the back cover and has a rear surface facing the back cover and a display surface opposite to the rear surface. The frame structure includes a first frame and a second frame. The first frame is engaged with the back cover and covers and contacts a portion of an edge of the display surface. The second frame is slidably snapped with the back cover and covers and contacts another portion of the edge of the display surface. The display panel is secured on the back cover by the first frame and the second frame, and a seam existing between the first frame and the second frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:背蓋</p>
        <p type="p">120:顯示面板</p>
        <p type="p">122:顯示面</p>
        <p type="p">130:前框結構</p>
        <p type="p">1301:顯示開口</p>
        <p type="p">1302:接縫</p>
        <p type="p">131:第一前框</p>
        <p type="p">1312:第一外觀面</p>
        <p type="p">132:第二前框</p>
        <p type="p">132a:第一邊框</p>
        <p type="p">132b:第二邊框</p>
        <p type="p">1322:第二外觀面</p>
        <p type="p">3C-3C、3D-3D:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="779" publication-number="202619218">
    <tif-files tif-type="multi-tif">
      <tif file="113141621.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲能管理系統及儲能管理方法</chinese-title>
        <english-title>ENERGY STORAGE MANAGEMENT SYSTEM AND ENERGY STORAGE MANAGEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H02J3/28</main-classification>
        <further-classification edition="202401120250203B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊坤格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUNKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱家瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家璽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIA-XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃偉鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖國凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, KUO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種儲能管理系統及儲能管理方法。儲能管理方法包括：通過容量分析模組取得當前儲能容量，並根據當前儲能容量及系統參數計算第一容量與第二容量；通過充電排程模組將歷史資料庫中的多筆歷史電價資料輸入預測模型，以取得預測電價資料；通過充電排程模組根據預測電價資料、第一容量及系統參數排程充電流程，並執行充電流程，其中充電流程包括於第一時段中，基於第一功率執行充電操作；通過放電排程模組將歷史資料庫中的多筆歷史負載資料輸入預測模型，以取得預測負載資料；以及通過放電排程模組根據預測負載資料、第二容量及系統參數排程放電流程，並執行放電流程，其中放電流程包括於第二時段中，基於第二功率執行放電操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An energy storage management system and an energy storage management method are provided. The energy storage management method includes: obtaining a current storage capacity and calculating a first capacity and a second capacity based on the current storage capacity and a system parameter through a capacity analysis module; inputting a plurality of historical electricity price data in a historical database into a prediction model to obtain a predicted electricity price data through a charge scheduling module; scheduling a charging process according to the predicted electricity price data, the first capacity and the system parameter and performing the charging process, wherein the charging process includes performing a charge operation based on a first power in a first period; inputting a plurality of historical load data in the historical database into the prediction model to obtain a predicted load data through a discharge scheduling module; and scheduling a discharging process according to the predicted load data, the second capacity and the system parameter and performing the discharging process, wherein the discharging process includes performing a discharge operation based on a second power in a second period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:儲能管理系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:儲存媒體</p>
        <p type="p">121:容量分析模組</p>
        <p type="p">122:充電排程模組</p>
        <p type="p">123:放電排程模組</p>
        <p type="p">124:輔助放電模組</p>
        <p type="p">125:預測模型</p>
        <p type="p">126:歷史資料庫</p>
        <p type="p">130:收發器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="780" publication-number="202617942">
    <tif-files tif-type="multi-tif">
      <tif file="113141623.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廢塑料熱裂解油品回收連續送料系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">C10G1/10</main-classification>
        <further-classification edition="200601120250107B">F23G7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種廢塑料熱裂解油品回收連續送料系統，係一熱裂解爐的裂解室設一入料口；一連續送料系統從該入料口送進廢塑料，包括：一控制器、一入料推高機、一暫存倉及一投料機；該暫存倉的入口設一入倉管控閥，出口設一出倉管控閥；該投料機的第二送料管，在一銜接口與一投料口之間分段成預熱段及催熟段，該預熱段與催熟段各自包覆第一、二絕緣披覆層旋繞第一、二高頻導線和第一、二變頻器相接，該控制器送控制訊號給第一、二變頻器輸出高頻電壓給該第一、二高頻導線，令該預熱段與該催熟段的管壁渦流發熱；整體提高廢塑料加熱裂解工作效率，且還達成熱氣、油煙不外洩或外漏的效益。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:連續送料系統</p>
        <p type="p">2:加熱裂解系統</p>
        <p type="p">5:氮氣</p>
        <p type="p">20:熱裂解爐</p>
        <p type="p">21:裂解室</p>
        <p type="p">210:排煙口</p>
        <p type="p">211:排渣口</p>
        <p type="p">212:入料口</p>
        <p type="p">22:加熱裝置</p>
        <p type="p">23:重組份捕捉分離器</p>
        <p type="p">24:排渣裝置</p>
        <p type="p">25:氮氣製造機</p>
        <p type="p">40:入料推高機</p>
        <p type="p">400:低端</p>
        <p type="p">401:高端</p>
        <p type="p">41:第一送料管</p>
        <p type="p">410:給料口</p>
        <p type="p">411:溢料口</p>
        <p type="p">42:第一螺旋送料器</p>
        <p type="p">43:第一導料管</p>
        <p type="p">44:第一馬達</p>
        <p type="p">50:暫存倉</p>
        <p type="p">51:物料暫存空間</p>
        <p type="p">52:入倉管控閥</p>
        <p type="p">53:出倉管控閥</p>
        <p type="p">54:第二導料管</p>
        <p type="p">55A、55B:入氣接口</p>
        <p type="p">60:投料機</p>
        <p type="p">600:銜接端</p>
        <p type="p">601:投料端</p>
        <p type="p">61:第二送料管</p>
        <p type="p">61A:預熱段</p>
        <p type="p">61B:催熟段</p>
        <p type="p">610:銜接口</p>
        <p type="p">611:投料口</p>
        <p type="p">62:第二螺旋送料器</p>
        <p type="p">63:第三導料管</p>
        <p type="p">64:第二馬達</p>
        <p type="p">65:排料分岐管</p>
        <p type="p">65A:延伸管</p>
        <p type="p">66:排料管制閥</p>
        <p type="p">67:貯料筒</p>
        <p type="p">68:出料管制閥</p>
        <p type="p">69:第一排料加熱裝置</p>
        <p type="p">80:給料機</p>
        <p type="p">81:給料管</p>
        <p type="p">82:螺旋給料器</p>
        <p type="p">83:給料斗</p>
        <p type="p">84:給料馬達</p>
        <p type="p">90:排料機</p>
        <p type="p">91:排料管</p>
        <p type="p">92:第二排料加熱裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="781" publication-number="202618180">
    <tif-files tif-type="multi-tif">
      <tif file="113141626.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廢塑料熱裂解油品回收冰水制冷裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241119B">F23G7/12</main-classification>
        <further-classification edition="200601120241119B">F23G5/027</further-classification>
        <further-classification edition="200601120241119B">F23G5/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種廢塑料熱裂解油品回收冰水制冷裝置，係以一吸收式冰水機與一工業用冰水機共同維持一冰水槽內冰水在一低溫；該吸收式冰水機，包括：蒸發器，用於該冰水槽冰水進出一冰水管時降溫；一吸收器，用於對該蒸發器送入吸收液吸收蒸發的冷媒成為吸收冷媒溶液回流；一加熱器，係在一加熱室內設一加熱管從一燃氣發電機排出的廢熱作為熱源對接入該加熱室的該吸收冷媒溶液加熱；一發生器，用於供加熱後的該吸收冷媒溶液冷媒蒸發排至一蒸氣冷凝器，形成冷媒液給該蒸發器，留下的吸收液接往該吸收器；整體冰水制冷裝置，可以增進燃氣能源回收利用的經濟效益，且還增進油品回收系統裂解油料冷卻工作的品質穩定性或安定性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:熱裂解系統</p>
        <p type="p">2:油品回收系統</p>
        <p type="p">11A:裂解油煙</p>
        <p type="p">12:油煙冷凝油料</p>
        <p type="p">12A:一階輕油料氣</p>
        <p type="p">13:一階輕油料</p>
        <p type="p">13A:二階輕油料氣</p>
        <p type="p">20:冰水制冷裝置</p>
        <p type="p">210:第一循環降溫水路</p>
        <p type="p">211:第二循環降溫水路</p>
        <p type="p">21:冰水槽</p>
        <p type="p">22:第一循環輸水泵</p>
        <p type="p">23:吸收式冰水機</p>
        <p type="p">24:工業用冰水機</p>
        <p type="p">30:第一冷凝器</p>
        <p type="p">300A、300B:供水輸送水路</p>
        <p type="p">31:供水輸送泵</p>
        <p type="p">32:第一裂解油桶</p>
        <p type="p">32A:熱媒油鍋爐</p>
        <p type="p">33:第一油水分離器</p>
        <p type="p">34:柴油桶</p>
        <p type="p">34A:汽油桶</p>
        <p type="p">35:貯水槽</p>
        <p type="p">36:第二冷凝器</p>
        <p type="p">37:供水輸送泵</p>
        <p type="p">38:第二裂解油桶</p>
        <p type="p">38A:液封桶</p>
        <p type="p">39:第二油水分離器</p>
        <p type="p">40:柴油</p>
        <p type="p">40A:含水柴油</p>
        <p type="p">41:汽油</p>
        <p type="p">41A:含水汽油</p>
        <p type="p">42:燃氣</p>
        <p type="p">43:廢熱</p>
        <p type="p">44:廢氣</p>
        <p type="p">50:燃氣貯存桶</p>
        <p type="p">51:燃氣輸送機</p>
        <p type="p">52:燃氣發電機</p>
        <p type="p">70:控制器</p>
        <p type="p">71:溫度檢知器</p>
        <p type="p">80:輸氣泵</p>
        <p type="p">90:洗滌塔</p>
        <p type="p">91:去污吸附器</p>
        <p type="p">92:煙囪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="782" publication-number="202617943">
    <tif-files tif-type="multi-tif">
      <tif file="113141627.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廢塑料熱裂解油品回收燃氣發電系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">C10G1/10</main-classification>
        <further-classification edition="200601120241204B">F02C3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種廢塑料熱裂解油品回收燃氣發電系統，包括：一燃氣貯存桶，用於貯存燃氣；一燃氣輸送機，用於輸送燃氣；一燃氣發電機，係從該燃氣輸送機接收到燃氣發電，所產生廢熱接往一吸收式冰水機；一電源分配器，係電性連接該燃氣發電機的電力輸出端；一儲電組，係在一電力輸入端設一充電器與該電源分配器電性相接；一逆變器，用於將儲電組的直流電放電轉換成交流電，作為該電源分配器的一電力來源端；一電源供應器，係電性連接該電源分配器的一電力輸出端；藉由整體系統，能使燃氣能源充分利用，且還使該燃氣發電機能長時維持在穩定功率輸出狀態發電，增進能源轉換效率。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">38A:液封桶</p>
        <p type="p">42:燃氣</p>
        <p type="p">50:燃氣貯存桶</p>
        <p type="p">51:燃氣輸送機</p>
        <p type="p">52:燃氣發電機</p>
        <p type="p">520:發動機</p>
        <p type="p">521:發電機</p>
        <p type="p">522:排氣管</p>
        <p type="p">53:電源分配器</p>
        <p type="p">54:儲電組</p>
        <p type="p">55:充電器</p>
        <p type="p">56:充放電控制器</p>
        <p type="p">57:第一蓄電池組</p>
        <p type="p">58:第二蓄電池組</p>
        <p type="p">59:第三蓄電池組</p>
        <p type="p">60:逆變器</p>
        <p type="p">61:電源供應器</p>
        <p type="p">62:限流器</p>
        <p type="p">63:外部電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="783" publication-number="202618429">
    <tif-files tif-type="multi-tif">
      <tif file="113141628.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吹氣裝置及影像擷取模組</chinese-title>
        <english-title>AIR BLOWING DEVICE AND IMAGE CAPTURE MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250102B">G03B17/56</main-classification>
        <further-classification edition="202101120250102B">G03B17/12</further-classification>
        <further-classification edition="200601120250102B">B08B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關啟福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, CHI FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吹氣裝置，包括一腔體、一活塞、至少一彈性件及一旋轉件。腔體具有一出氣口。活塞可動地配置於腔體且具有一活塞頭，活塞頭與出氣口之間形成一氣體容納空間。彈性件鄰接於活塞。旋轉件耦接於活塞。旋轉件適於旋轉而帶動活塞抵抗彈性件的彈性力相對於腔體移動，以使活塞頭遠離出氣口。旋轉件適於繼續旋轉而釋放活塞，使活塞頭藉由彈性件的彈性力而往出氣口移動，以帶動氣體容納空間內的氣體通過出氣口輸出。此外，一種包含此吹氣裝置的影像擷取模組亦被提及。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An air blowing device includes a chamber, a piston, at least one elastic component and a rotating component. The chamber has an air outlet. The piston is movably disposed on the chamber and has a piston head. An air containing space is formed between the piston head and the air outlet. The elastic component is adjacent to the piston. The rotating component is coupled to the piston. The rotating component is adapted to rotate to drive the piston to move relatively to the chamber against an elastic force of the elastic component, so as to move the piston head away from the air outlet. The rotating component is adapted to continue rotating to release the piston, such that the piston head moves toward the air outlet through the elastic force of the elastic component, so as to drive an air in the air containing space to be output through the air outlet. In addition, an image capturing module including the air blowing device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">70:固定結構</p>
        <p type="p">100:吹氣裝置</p>
        <p type="p">110:腔體</p>
        <p type="p">110a:出氣口</p>
        <p type="p">110b:開口</p>
        <p type="p">120:活塞</p>
        <p type="p">120a:凹洞</p>
        <p type="p">122:活塞頭</p>
        <p type="p">124:活塞桿</p>
        <p type="p">124a、124b:端部</p>
        <p type="p">130:彈性件</p>
        <p type="p">140:旋轉件</p>
        <p type="p">142:有齒區段</p>
        <p type="p">144:無齒區段</p>
        <p type="p">150:致動單元</p>
        <p type="p">160:密封環</p>
        <p type="p">A1:旋轉軸向</p>
        <p type="p">D1:移動方向</p>
        <p type="p">S:氣體容納空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="784" publication-number="202618867">
    <tif-files tif-type="multi-tif">
      <tif file="113141629.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141629</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成半導體裝置的方法</chinese-title>
        <english-title>METHOD FOR FORMING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">H01L21/02</main-classification>
        <further-classification edition="200601120241106B">H01L21/208</further-classification>
        <further-classification edition="200601120241106B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭佳憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIA-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江燁瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YEH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏明正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, MING CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種形成半導體裝置的方法，其包括以下步驟。將半導體基底放置於處理槽中。於處理槽中注入處理液至處理槽的第一水平高度處，使得半導體基底完全浸泡在處理液中。半導體基底以靜置在處理液中的方式進行氧化處理，以於半導體基底上形成氧化層。在氧化處理期間，處理液的溫度維持在約65℃至約85℃，且氧化處理的時間在約50分鐘至約100分鐘。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for forming a semiconductor device, which includes following steps. A semiconductor substrate is placed into a processing tank. A processing solution is injected into the processing tank to a first level height of the processing tank, such that the semiconductor substrate is immersed in the processing solution completely. The semiconductor substrate is subjected to an oxidation treatment in a manner of standing in the processing solution so as to form an oxide layer on the semiconductor substrate. During the oxidation treatment, the temperature of the processing solution is maintained at about 65°C to about 85°C, and the time for the oxidation treatment is from about 50 minutes to about 100 minutes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="785" publication-number="202617944">
    <tif-files tif-type="multi-tif">
      <tif file="113141630.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廢塑料渦流加熱裂解系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">C10G1/10</main-classification>
        <further-classification edition="200601120241230B">C10G7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭明霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種廢塑料渦流加熱裂解系統，包括一控制器，從一電源供應器得到工作電力；一送料機由該控制器控制，將廢塑料往一高端輸送；一熱裂解爐的金屬爐體內部具有一裂解室，身部爐壁表面由內而外包覆一絕緣披覆層及纏繞一高頻導線，且該裂解室上方設一入料口接入該廢塑料及一排煙口；一變頻器電性連接該高頻導線兩端，接收該控制器指令，用於將該電源供應器接入的工頻交流電壓，整流轉換成高頻交流電壓輸出給該高頻導線與該爐壁磁力切割產生渦流加熱，使廢塑料被加熱形成油煙，從該排煙口排出送往油品回收系統；藉由整個系統加速裂解室達到廢塑料熱裂解溫度，且解裂室非熱媒加熱，不存在廢氣排放所造成的空污問題。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">2:渦流加熱裂解系統</p>
        <p type="p">12:溫度檢知器</p>
        <p type="p">20:送料機</p>
        <p type="p">22:高端</p>
        <p type="p">23:落料口</p>
        <p type="p">30:熱裂解爐</p>
        <p type="p">300:爐壁</p>
        <p type="p">31:裂解室</p>
        <p type="p">310:入料口</p>
        <p type="p">311:排煙口</p>
        <p type="p">312:排渣口</p>
        <p type="p">33:高頻導線</p>
        <p type="p">50:攪拌機</p>
        <p type="p">51:攪拌馬達</p>
        <p type="p">52:減速機</p>
        <p type="p">53:攪拌器</p>
        <p type="p">60:重組份捕捉分離器</p>
        <p type="p">70:排渣裝置</p>
        <p type="p">71:排渣閥</p>
        <p type="p">72:排渣機</p>
        <p type="p">73:殘渣蒐集桶</p>
        <p type="p">80:入料管控裝置</p>
        <p type="p">81:入料桶</p>
        <p type="p">82:第一入料管控閥</p>
        <p type="p">83:第二入料管控閥</p>
        <p type="p">90:氮氣製造機</p>
        <p type="p">91:氮氣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="786" publication-number="202619226">
    <tif-files tif-type="multi-tif">
      <tif file="113141632.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲能與供電的控制方法</chinese-title>
        <english-title>CONTROL METHOD OF ENERGY STORAGE AND POWER SUPPLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H02J15/00</main-classification>
        <further-classification edition="200601120250303B">H02J3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰全儲能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI CHUAN ENERGY STORAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳全雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂萬傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WAN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種儲能與供電的控制方法，包含：設置至少一功率調節器、至少一儲能電池組及一能源管理單元；當一可供給電量不小於一尖峰用電量，且在一供電尖峰時段時，該能源管理單元中斷一市電的供電，並使所述儲能電池組供電至一負載；當該可供給電量小於該尖峰用電量，且在一供電離峰時段時，該能源管理單元中斷所述儲能電池組的供電，並使該市電對所述儲能電池充電、供電至該負載。藉此，在確保負載正常運作的前提下，更有效地利用供電離峰時段的市電、減少供電尖峰時段的市電使用量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:功率調節器</p>
        <p type="p">20:儲能電池組</p>
        <p type="p">201:儲能電池</p>
        <p type="p">30:饋線</p>
        <p type="p">40:負載</p>
        <p type="p">50:市電</p>
        <p type="p">60:電流感測器</p>
        <p type="p">70:能源管理單元</p>
        <p type="p">80:綠電模組</p>
        <p type="p">801:太陽能板</p>
        <p type="p">802:光電變流器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="787" publication-number="202618422">
    <tif-files tif-type="multi-tif">
      <tif file="113141638.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241126B">G02F1/1335</main-classification>
        <further-classification edition="200601120241126B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱敏軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MIN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭瑋銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊朝閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAO-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括依序層疊配置的背光模組、半波片、視角調變層以及顯示面板。顯示面板包括依序層疊配置的第一偏光片、像素層以及第二偏光片。第一偏光片位於視角調變層以及像素層之間。背光模組包括稜鏡片，稜鏡片包括沿著第一方向排列的多個稜鏡結構。半波片具有慢軸，慢軸平行第二方向，第一方向與第二方向不平行且不垂直。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a backlight module, a half wave plate, a view angle modulation layer and a display panel stacked in sequence is provided. The display panel includes a first polarizer, a pixel layer and a second polarizer stacked in sequence. The first polarizer is disposed between the view angle modulation layer and the pixel layer. The backlight module includes a prism sheet, which includes a plurality of prism structures arranged along a first direction. The half wave plate has a slow axis, wherein the slow axis is parallel to a second direction. The first direction is not parallel to and perpendicular to the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">100:半波片</p>
        <p type="p">200:背光模組</p>
        <p type="p">201:稜鏡片</p>
        <p type="p">201P:稜鏡結構</p>
        <p type="p">202:面光源</p>
        <p type="p">300:視角調變層</p>
        <p type="p">400:顯示面板</p>
        <p type="p">410:像素層</p>
        <p type="p">440:偏光片</p>
        <p type="p">450:偏光片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="788" publication-number="202617626">
    <tif-files tif-type="multi-tif">
      <tif file="113141639.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617626</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141639</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗液化材料、回填材料、以及抗液化施工方法</chinese-title>
        <english-title>ANTI-LIQUEFACTION MATERIAL, BACKFILL MATERIAL, AND ANTI-LIQUEFACTION CONSTRUCTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241204B">C04B18/167</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>興磊資源回收股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XINGLEI RESOURCE RECYCLING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴聰銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, TSUNG MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍隆寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, LUNG KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴聰銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, TSUNG MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍隆寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, LUNG KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種用於基底填充或基底改良之抗液化材料、包含其之回填材料、以及使用其填充基底空隙或待填充空間之抗液化施工方法。所述抗液化材料包含由紅磚經碎解而製成之紅磚粒料成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an anti-liquefaction material for use in foundation filling or foundation improvement, a backfill material containing the same, and an anti-liquefaction construction method for filling foundation voids or spaces to be filled using the same. The anti-liquefaction material includes red brick aggregate components made by crushing red brick.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P1:紅磚粒料</p>
        <p type="p">P2:混凝土粒料</p>
        <p type="p">P3:石英粒料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="789" publication-number="202617231">
    <tif-files tif-type="multi-tif">
      <tif file="113141646.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧高爾夫球訓練系統</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE GOLF TRAINING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241202B">A63B69/36</main-classification>
        <further-classification edition="200601120241202B">G06N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐瑋勵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種人工智慧高爾夫球訓練系統，係於使用者使用高爾夫球桿對高爾夫球進行揮桿動作時，由揮桿動作計算模組重建出使用者之揮桿動作之骨骼模型與肌肉模型，以由揮桿動作分析模組利用骨骼模型與肌肉模型分析出使用者之骨骼參數與肌肉參數。再者，由人工智慧之優良高爾夫選手動作資料庫利用骨骼參數與肌肉參數以人工智慧技術比對出使用者與優良高爾夫選手兩者之揮桿動作之差異數值，再由揮桿動作修正模組依據使用者與優良高爾夫選手兩者之揮桿動作之差異數值產生使用者之關節角度修正與動作力量修正之建議，俾按照此關節角度修正與動作力量修正之建議進一步修正或訓練使用者之揮桿動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses an artificial intelligence golf training system. When a user uses a golf club to swing a golf ball, a swing action calculation module reconstructs a skeletal model and a muscle model of the user's swing action, and then a swing action analysis module uses the skeletal model and the muscle model to analyze the user's skeletal parameters and muscle parameters. Furthermore, an Artificial Intelligence's excellent golf player action database uses the skeletal parameters and the muscle parameters to use artificial intelligence technology to compare difference numerical between the swing action of the user and the excellent golf player, and the a swing action correction module generates suggestion for the user's joint angle correction and action strength correction based on the difference numerical between the swing action of the user and the excellent golf player, so as to further correct or train the user's swing action according to the suggestion for the joint angle correction and the action strength correction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:人工智慧高爾夫球訓練系統</p>
        <p type="p">10:揮桿動作擷取模組</p>
        <p type="p">11:慣性感測器</p>
        <p type="p">20:揮桿動作感測模組</p>
        <p type="p">21:肢段位置感測單元</p>
        <p type="p">22:關節角度感測單元</p>
        <p type="p">30:揮桿動作轉換模組</p>
        <p type="p">31:加速度轉換單元</p>
        <p type="p">32:旋轉單位轉換單元</p>
        <p type="p">33:關節角度轉換單元</p>
        <p type="p">40:人體參數輸入模組</p>
        <p type="p">41:人體參數生理資料</p>
        <p type="p">50:揮桿動作計算模組</p>
        <p type="p">51:骨骼模型重建單元</p>
        <p type="p">52:肌肉模型重建單元</p>
        <p type="p">60:揮桿動作分析模組</p>
        <p type="p">61:骨骼參數分析單元</p>
        <p type="p">62:肌肉參數分析單元</p>
        <p type="p">70:優良高爾夫選手動作資料庫</p>
        <p type="p">80:揮桿動作修正模組</p>
        <p type="p">81:關節角度修正單元</p>
        <p type="p">82:動作力量修正單元</p>
        <p type="p">90:揮桿參數選擇介面</p>
        <p type="p">100:高爾夫模擬器</p>
        <p type="p">101:模擬器球體數據</p>
        <p type="p">110:即時呈現介面</p>
        <p type="p">A:使用者</p>
        <p type="p">B:高爾夫球桿</p>
        <p type="p">C:高爾夫球</p>
        <p type="p">ANN:人工神經網路</p>
        <p type="p">CNN:卷積神經網路</p>
        <p type="p">GAN:生成式對抗網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="790" publication-number="202618689">
    <tif-files tif-type="multi-tif">
      <tif file="113141648.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141648</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於物件追蹤之影像前處理系統、方法及其電腦程式產品</chinese-title>
        <english-title>IMAGE PREPROCESSING SYSTEM AND METHOD FOR OBJECT TRACKING AND COMPUTER PROGRAM PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06T5/70</main-classification>
        <further-classification edition="202201120250203B">G06V10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪祥軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, HSIANG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秉達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PING-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓彥汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHUO, YAN-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於物件追蹤之影像前處理系統、方法及其電腦程式產品。該方法包括將初始影像的各個像素乘以倍數，接著計算灰度累積分布函數再進行灰度值映射而產生影像增強影像，將初始影像平滑處理後從初始影像中減去以產生差分影像，再進行映射而產生邊緣特徵增強影像，最後根據邊緣特徵增強影像中所偵測出之物件標記框的面積判斷其為目標物件或雜訊，而產生物件辨識及雜訊過濾影像。另對時間序列之多張物件已辨識影像幀進行物件追蹤匹配，以根據成功匹配次數判斷物件為有效移動物件或雜訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image preprocessing system and method for object tracking and computer program product thereof are provided. Each pixel of an initial image is multiplied by a factor, then a cumulative distribution function of gray level is calculated, and then a gray level mapping is performed to produce an enhanced image. Then, a smoothed image created by smoothing the initial image is subtracted from the initial image to produce a differential image, and then a mapping is performed on the differential image to produce an edge feature enhanced image. Finally, based on an area of a bounding box of an object detected from the edge feature enhanced image, the object is determined to be either a target object or noise, so as to produce an object recognized and noise filtered image. In addition, an object tracking and matching is performed on a plurality of object-recognized image frames in a time series to determine the object to be either a valid moving object or noise based on a number of successful matches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S16:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="791" publication-number="202619223">
    <tif-files tif-type="multi-tif">
      <tif file="113141655.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池管理系統、其控制方法與應用其之電動輔助自行車</chinese-title>
        <english-title>BATTERY MANAGEMENT SYSTEM, CONTROL METHOD THEREOF AND ELECTRIC ASSIST BICYCLE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250203B">H02J7/02</main-classification>
        <further-classification edition="200601120250203B">G06F13/38</further-classification>
        <further-classification edition="201001120250203B">B62M6/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIUNN-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池管理系統、其控制方法與應用其之電動輔助自行車。電池管理系統包括一主動式前級元件、一直流電壓轉換電路、一切換電路及一微處理器。主動式前級元件連接於一共用接腳。切換電路連接於直流電壓轉換電路及共用接腳之間。微處理器連接於主動式前級元件及切換電路。若共用接腳被設定為用以接收一電源按鍵訊號，則微處理器控制切換電路斷開，以使共用接腳與主動式前級元件之間形成一電源開關控制路徑。若共用接腳被設定為用以輸出一直流電源，則微處理器控制切換電路導通，以使共用接腳與直流電壓轉換電路之間形成一直流電源輸出路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery management system, a control method thereof and an electric assist bicycle using the same are provided. The battery management system includes an active front-end component, a DC voltage conversion circuit, a switching circuit and a microprocessor. The active front-end component is connected to a common pin. The switching circuit is connected between the DC voltage conversion circuit and the common pin. The microprocessor is connected to the active front-end component and the switching circuit. If the common pin is set to receive a power button signal, the microprocessor controls the switching circuit to be disconnected so that a power switch control path is formed between the common pin and the active front-end component. If the common pin is set to output a DC power supply, the microprocessor controls the switching circuit to be turned on, so that a DC power supply output path is formed between the common pin and the DC voltage conversion circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池管理系統</p>
        <p type="p">110:主動式前級元件</p>
        <p type="p">120:直流電壓轉換電路</p>
        <p type="p">130:切換電路</p>
        <p type="p">131:雙向阻斷開關電路</p>
        <p type="p">1311:第一P型電晶體</p>
        <p type="p">1312:第二P型電晶體</p>
        <p type="p">132:N型電晶體</p>
        <p type="p">140:微處理器</p>
        <p type="p">150:二極體電路</p>
        <p type="p">151,152,153:二極體</p>
        <p type="p">160:CANbus收發器</p>
        <p type="p">500:電源按鍵</p>
        <p type="p">800:電池</p>
        <p type="p">1000:電動輔助自行車</p>
        <p type="p">CM1:第一控制訊號</p>
        <p type="p">P1:電源開關控制路徑</p>
        <p type="p">P3,P4:控制器區域網路路</p>
        <p type="p">P+,P-:電池電源輸出路徑</p>
        <p type="p">PIN+,PIN-:電池輸出電源接腳</p>
        <p type="p">PIN1:偵測接腳</p>
        <p type="p">PIN2:共用接腳</p>
        <p type="p">PIN3,PIN4:控制器區域網路接腳</p>
        <p type="p">PIN5:功能接腳</p>
        <p type="p">S1:電源按鍵訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="792" publication-number="202618762">
    <tif-files tif-type="multi-tif">
      <tif file="113141662.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以人工智慧產生儀式影音系統及其方法</chinese-title>
        <english-title>ARTIFICIAL-INTELLIGENT-GENERATED AUDIOVISUAL SYSTEM AND METHOD THEREOF FOR CEREMONIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250203B">G10L25/00</main-classification>
        <further-classification edition="200601120250203B">G10L13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡韋德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程正嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHENG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以人工智慧產生儀式影音方法包含：提供至少一人物語音資料及至少一人物臉部影像資料，且該人物語音資料及人物臉部影像資料同屬於同一人物；利用該人物語音資料以一人工智慧語音處理模組模擬產生至少一已擬真語音資料；利用該人物臉部影像資料以一人工智慧影像處理模組模擬產生至少一已擬真臉部動態影像資料；將該已擬真語音資料對應結合於該已擬真臉部動態影像資料，以產生該擬真動態影音資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An AI-generated audiovisual method includes: providing at least one set of personal voice data and at least one set of personal image data which belongs to the same person; processing the personal voice data with an AI voice-processing module to generate at least one set of simulated voice data; processing the personal image data with an AI image-processing module to generate at least one set of simulated image data; and correspondingly combing the at least one set of simulated voice data with the at least one set of simulated image data to generate at least one set of simulated dynamic audiovisual data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:人物語音資料</p>
        <p type="p">12:人物臉部影像資料</p>
        <p type="p">2:計算機單元</p>
        <p type="p">21:人工智慧語音處理模組</p>
        <p type="p">22:人工智慧影像處理模組</p>
        <p type="p">3:擬真動態影音資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="793" publication-number="202617266">
    <tif-files tif-type="multi-tif">
      <tif file="113141670.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新式MCM-41觸媒的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">B01J29/04</main-classification>
        <further-classification edition="200601120241129B">B01J37/00</further-classification>
        <further-classification edition="200601120241129B">B01J37/04</further-classification>
        <further-classification edition="200601120241129B">B01J37/06</further-classification>
        <further-classification edition="200601120241129B">B01J37/08</further-classification>
        <further-classification edition="202401120241129B">B01J35/60</further-classification>
        <further-classification edition="200601120241129B">C01B39/04</further-classification>
        <further-classification edition="200601120241129B">C07C41/03</further-classification>
        <further-classification edition="200601120241129B">C07C43/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝一化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINY CHEMICAL INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉哲綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHE-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇昭勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫啓發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHI-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種新式MCM-41觸媒的製備方法，包含將TEOS、CTAB、金屬化合物、磺酸化三丙二醇甲醚、氫氧化鈉及水混合，獲得包含微胞模板的原料溶液，以TEOS的用量為1莫耳計，金屬氧化物的用量為0.03至0.1莫耳，以CTAB的用量為1莫耳計，磺酸化三丙二醇甲醚的用量為0.1至0.3莫耳；調整原料溶液的pH值以使金屬氫氧化物析出，獲得膠體溶液；加熱膠體溶液以使TEOS水解，且使水解後的TEOS與金屬氫氧化物進行自組裝並包覆微胞模板而形成觸媒前驅物；對觸媒前驅物進行水洗、烘乾及鍛燒，獲得新式MCM-41觸媒。以本發明之方法製得的新式MCM-41觸媒能夠進一步提升二級醇產物的產率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="794" publication-number="202618743">
    <tif-files tif-type="multi-tif">
      <tif file="113141671.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>LED燈珠之相機座標還原方法及LED燈珠定位系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250108B">G09G3/32</main-classification>
        <further-classification edition="200601120250108B">G09G5/10</further-classification>
        <further-classification edition="200601120250108B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮繼雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鑫輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種LED燈珠之相機座標還原方法，用以於一LED顯示面板中存在至少一個LED燈珠被替換更新之後執行，且包括以下步驟：對顯示一圖像的該LED顯示面板執行一LED燈珠定位操作以獲得L個相機座標對應該N個LED燈珠之中的L個；其中，L為至少為4的正整數；以及基於L個所述相機座標以及該N個原相機座標，利用一單應射影變換將N個所述原相機座標映射為N個所述相機座標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:對顯示一圖像的該LED顯示面板執行一LED燈珠定位操作以獲得L個相機座標對應該N個LED燈珠之中的L個</p>
        <p type="p">S2:基於L個所述相機座標以及該N個原相機座標，利用一單應射影變換將N個所述原相機座標映射為N個所述相機座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="795" publication-number="202619293">
    <tif-files tif-type="multi-tif">
      <tif file="113141672.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三態輸入端口電路、電子晶片及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">H03K19/0944</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬英杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種三態輸入端口電路，係應用於一電子晶片之中，且包括：耦接該電子晶片的一信號輸入端的一輸入單元、一第一電流鏡、一第二電流鏡、一偏置電壓產生單元、一第一電流穩定元件、以及一第二電流穩定元件，其中，該偏置電壓產生單元被配置以產生一第一偏置電壓與一第二偏置電壓分別傳送至該第一電流穩定元件與該第二電流穩定元件。工作時，該第一電流鏡產生一第一電流，且該第一電流穩定元件受到所述第一偏置電壓的偏置以穩定該第一電流。同時，該第二電流鏡產生一第二電流，且該第二電流穩定元件受到所述第二偏置電壓的偏置以穩定該第二電流。如此方式，隨著工作電壓的提高，經由該輸入單元傳送至後級電路的電流亦可以被穩定抑制，保證了後級電路正常工作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:三態輸入端口電路</p>
        <p type="p">11:輸入單元</p>
        <p type="p">12:第一主動負載</p>
        <p type="p">13:第二主動負載</p>
        <p type="p">14:偏置電壓產生單元</p>
        <p type="p">15:第一電流穩定元件</p>
        <p type="p">16:第二電流穩定元件</p>
        <p type="p">N0:共接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="796" publication-number="202617404">
    <tif-files tif-type="multi-tif">
      <tif file="113141676.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射出成形設備</chinese-title>
        <english-title>INJECTION FORMING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">B29C45/03</main-classification>
        <further-classification edition="200601120250108B">B29C45/27</further-classification>
        <further-classification edition="200601120250108B">B29C45/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秋慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種射出成形設備包含一第一模塊、一第二模塊、一網孔製作模仁、一加熱模組及一冷凝模組。第二模塊可移除地閉合第一模塊與網孔製作模仁，用以共同區隔出成型腔室。網孔製作模仁包含一鑲塊本體、一流道結構與一凸柱分布結構。鑲塊本體可移除地鑲嵌於第一模塊上，流道結構形成於鑲塊本體內。凸柱分布結構位於鑲塊本體之一面。加熱模組位於網孔製作模仁內，用以加熱鑲塊本體。冷凝模組連接流道結構，用以將冷凝流體注入流道結構而冷卻鑲塊本體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The injection molding mold includes a first module, a second module, a mesh making mold core, a heating module and a cooling module. The second module is removably shut on the first module and the mesh making mold core to jointly form a plastic filling chamber therebetween. The mesh making mold core includes an insert body, a channel structure and a column-distribution structure. The insert body is removably mounted on the first module, and the flow channel structure is formed in the insert body. The column-distribution structure is located on one side of the insert body. The heating module is located in the mesh making mold core and used to heat the insert body. The cooling module is connected to the flow channel structure to inject cooling fluid into the flow channel structure for cooling the insert body down.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:射出成形設備</p>
        <p type="p">100:射出成形模具</p>
        <p type="p">110:第一模塊</p>
        <p type="p">111:底座</p>
        <p type="p">112:下模</p>
        <p type="p">113:凹陷槽</p>
        <p type="p">120:第二模塊</p>
        <p type="p">121:蓋體</p>
        <p type="p">122:上模</p>
        <p type="p">200:網孔製作模仁</p>
        <p type="p">210:鑲塊本體</p>
        <p type="p">250:第一凸柱分布結構</p>
        <p type="p">400:加熱板</p>
        <p type="p">510:支撐塊</p>
        <p type="p">600:加熱模組</p>
        <p type="p">630:電源裝置</p>
        <p type="p">700:冷凝模組</p>
        <p type="p">820:頂出模組</p>
        <p type="p">X,Y,Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="797" publication-number="202616983">
    <tif-files tif-type="multi-tif">
      <tif file="113141677.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輪胎邊桌結構</chinese-title>
        <english-title>TIRE SIDE TABLE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">A47B37/00</main-classification>
        <further-classification edition="200601120250107B">A47B1/08</further-classification>
        <further-classification edition="200601120250107B">A47B3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖州企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA SAINT JOSE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種輪胎邊桌結構，為堅固材質所形成，其可移除地跨設於汽車輪胎做為桌面使用，輪胎邊桌結構包括有：桌面邊框；固定桿；可替換附設單元；伸縮桿；以及至少一立架。藉由本發明之實施，輪胎邊桌結構可以簡單設置及操作；可以穩固地跨設於汽車輪胎上並站立於輪胎旁做為桌面使用；調整伸縮桿的長度可使輪胎邊桌結構立即適用於各種不同的車款、各種不同尺寸或不同胎面寬度之輪胎；藉由可替換附設單元之更換，具有多種不同結構特性而可達到多功能運用之功效；具有可設置桌腳之可替換附設單元，可以單獨使用為一小桌；於桌面邊框內設置不同的可替換附設單元，更可達到多功能應用之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a tire side table structure that includes a table frame; two side rods; an exchangeable attachment unit; two extendable rods; and a frame stand. With the implementation of the present invention, the tire side table structure has the special benefit of being easy to install and operate; being able to set firmly on a tire and stand by the wheel as a tire side table; with the extendable rods each slides or fixes individually in the side rods, the tire side table structure applies better on tires of different sizes in different car types; At least one stand can be implemented on the exchangeable attachment unit to make the exchangeable attachment unit a small sand alone table; with further changing the adoption of different exchangeable attachment units, various convenient applications beside an easy table can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:輪胎邊桌結構</p>
        <p type="p">10:桌面邊框</p>
        <p type="p">11:中央區域</p>
        <p type="p">12:對邊</p>
        <p type="p">20:固定桿</p>
        <p type="p">21:端部</p>
        <p type="p">22:另一端端部</p>
        <p type="p">30:可替換附設單元</p>
        <p type="p">40:伸縮桿</p>
        <p type="p">50:立架</p>
        <p type="p">60:關節</p>
        <p type="p">700:輪胎</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="798" publication-number="202618139">
    <tif-files tif-type="multi-tif">
      <tif file="113141684.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調式清潔除塵機械式無桿缸</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F15B15/14</main-classification>
        <further-classification edition="200601120241204B">F15B15/20</further-classification>
        <further-classification edition="200601120241204B">B08B5/00</further-classification>
        <further-classification edition="200601120241204B">B08B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣氣立股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游平政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游博勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭寓丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連阿長</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種可調式清潔除塵機械式無桿缸，其包含有：一無桿缸本體具有一滑軌，該滑軌能供滑塊套接密封膠條設置，該無桿缸本體內部的本體通道更設有桿型作動閥，且該無桿缸本體兩側配設有第一端蓋、及第二端蓋，該滑塊於兩側各自設置有第一排氣通路和第一噴氣嘴、以及第二排氣通路和第二噴氣嘴，該桿型作動閥內設有第一活塞導引環和第二活塞導引環、以及第一導氣管和第二導氣管；當氣體自第一端蓋通過第一導氣管，接續經第一活塞導引環至滑塊的第一排氣通路配合第一噴氣嘴排出氣體；當氣體自第二端蓋通過第二導氣管，接續經第二活塞導引環至該滑塊的第二排氣通路配合第二噴氣嘴排出該氣體型呈強勁氣流，使無桿缸本體於往復運作時，能同步且有效的清除內、外部的灰塵；此外，為了更精確地控制清潔效果，本發明還設置了節流調節件，可以根據不同的工作環境和清潔需求，調節氣體的流量大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(10):無桿缸本體</p>
        <p type="p">(11):本體通道</p>
        <p type="p">(20):滑軌</p>
        <p type="p">(30):滑塊</p>
        <p type="p">(303):第一噴氣嘴</p>
        <p type="p">(304):第二噴氣嘴</p>
        <p type="p">(305):節流調節件</p>
        <p type="p">(31):密封膠條</p>
        <p type="p">(40):桿型作動閥</p>
        <p type="p">(401):第一活塞導引環</p>
        <p type="p">(402):第二活塞導引環</p>
        <p type="p">(50):第一端蓋</p>
        <p type="p">(51):第二端蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="799" publication-number="202618178">
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      <isuno>9</isuno>
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          <doc-number>202618178</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>排氣口減碳排與分解有害物系統設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F23G5/44</main-classification>
        <further-classification edition="200601120241204B">F23J15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫朝堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>金門縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫朝堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種排氣口減碳排與分解有害物系統設備，包含一管單元、一導流罩、一第一風扇單元、一冷卻單元、一臭氧產生器、一負離子產生器及一第一發電單元。該導流罩固定於該管單元的一頂部，該第一風扇單元固定於該管單元，該冷卻單元、該臭氧產生器、該負離子產生器與該第一發電單元固定於該管單元，該第一發電單元可將該第一風扇單元的旋轉動能轉換成電能，且該第一發電單元提供該冷卻單元、該臭氧產生器與該負離子產生器運作所需的電能。利用整體的配置，不但可達到減碳排目的，且可分解有害物，達到淨化空氣的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:管單元</p>
        <p type="p">11:排氣孔</p>
        <p type="p">111:排氣口</p>
        <p type="p">12:管壁</p>
        <p type="p">121:頂部</p>
        <p type="p">122:底部</p>
        <p type="p">123:內壁面</p>
        <p type="p">124:外壁面</p>
        <p type="p">20:導流罩</p>
        <p type="p">21:導流空間</p>
        <p type="p">211:導氣口</p>
        <p type="p">22:罩壁</p>
        <p type="p">221:導流面</p>
        <p type="p">222:底端部</p>
        <p type="p">23:支撐柱</p>
        <p type="p">30:固定環件</p>
        <p type="p">31:內孔</p>
        <p type="p">311:引入口</p>
        <p type="p">312:排出口</p>
        <p type="p">32:環壁</p>
        <p type="p">321:內環面</p>
        <p type="p">322:外環面</p>
        <p type="p">40:第一風扇單元</p>
        <p type="p">41:第一軸承</p>
        <p type="p">42:第一風扇件</p>
        <p type="p">50:第二風扇單元</p>
        <p type="p">51:第二軸承</p>
        <p type="p">52:第二風扇件</p>
        <p type="p">60:冷卻單元</p>
        <p type="p">61:冷卻水管</p>
        <p type="p">70:臭氧產生器</p>
        <p type="p">80:負離子產生器</p>
        <p type="p">90:第一發電單元</p>
        <p type="p">91:第一定子</p>
        <p type="p">92:第一轉子</p>
        <p type="p">100:第二發電單元</p>
        <p type="p">101:第二定子</p>
        <p type="p">102:第二轉子</p>
        <p type="p">L:軸線</p>
      </representative-img>
    </description>
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  <tw-patent-application no="800" publication-number="202617068">
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        <document-id>
          <doc-number>113141686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>下肢穿戴裝置</chinese-title>
        <english-title>LOWER LIMBS WEARABLE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241202B">A61B5/11</main-classification>
        <further-classification edition="200601120241202B">A61N1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐建發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHIEN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林于傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳薇安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈乾龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種下肢穿戴裝置，包含彈性織物套筒。彈性織物套筒由彈性紗以及導電紗所編織而成，彈性織物套筒包含膝部定位標記、下前側定位標記，與上前側定位標記。膝部定位標記設置在彈性織物套筒的中段的外表面，下前側定位標記設置在彈性織物套筒的下段的外表面，上前側定位標記設置在彈性織物套筒的上段的外表面。彈性織物套筒更包含設置於彈性織物套筒的內表面的織物電極、織物接點以及織物排線，其中織物排線分別連接織物電極與織物接點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lower limbs wearable device includes a flexible textile sleeve. The flexible textile sleeve is weaved by elastic yarns and conductive yarns. The flexible textile sleeve includes knee alignment mark, a lower-front alignment mark, and an upper-front alignment mark. The knee alignment mark is disposed at an outer surface of a middle section of the flexible textile sleeve. The lower-front alignment mark is disposed at an outer surface of a lower section of the flexible textile sleeve. The upper-front alignment mark is disposed at an outer surface of an upper section of the flexible textile sleeve. The flexible textile sleeve further includes a plurality of textile electrodes, textile contacts, and textile channels. The textile channels connect the textile electrodes to the textile contacts, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:下肢穿戴裝置</p>
        <p type="p">100:彈性織物套筒</p>
        <p type="p">110:膝部定位標記</p>
        <p type="p">112:髕骨上緣定位線</p>
        <p type="p">114:髕骨下緣定位線</p>
        <p type="p">120:下前側定位標記</p>
        <p type="p">122:脛骨定位線</p>
        <p type="p">130:上前側定位標記</p>
        <p type="p">132:弧形定位線</p>
        <p type="p">C0:中心</p>
        <p type="p">C1:中點</p>
        <p type="p">L1:對稱軸</p>
        <p type="p">S1:上段</p>
        <p type="p">S2:中段</p>
        <p type="p">S3:下段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="801" publication-number="202618596">
    <tif-files tif-type="multi-tif">
      <tif file="113141687.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模糊測試方法</chinese-title>
        <english-title>A FUZZING TEST METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250203B">G06F21/57</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋哲寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHE-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭旭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, HSU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模糊測試方法包含：攔截執行應用程式的使用者裝置以及物聯網設備之間傳輸的多個請求，將多個請求做為多個種子，並將多個種子儲存在種子池中；透過動態掛勾操作取得使用者裝置以及物聯網設備所使用的密碼模組；建立關鍵字詞典，關鍵字詞典具有多個關鍵字；對種子池中的多個種子進行叢集化操作；從種子池中提取第一種子，依據多個關鍵字以及對第一種子的多個詞元的對應一者進行突變操作，取得第二種子；將第二種子傳輸至物聯網設備；以及分析物聯網設備的回應，判斷物聯網設備是否觸發崩潰警報。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fuzzing test method includes: intercepting a plurality of requests transmitted between an user device operating an application and an IoT device, using the requests as a plurality of seeds and storing the seeds in a seed pool; obtaining a cipher module used by the user device and the IoT device through a dynamic hook operation; creating a keyword dictionary, wherein the keyword dictionary has a plurality of keywords; performing a clustering operation on the seeds in the seed pool; choosing a first seed from the seed pool, and performing a mutation operation on a corresponding one of a plurality of tokens of the first seed according to the keywords and the cipher module to obtain a second seed; transmitting the second seed to the IoT device; and analyzing a response of the IoT device to determine whether the IoT device triggers a crash alarm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:模糊測試方法</p>
        <p type="p">S210、S220、S230、S240、S250、S260、S270、S280:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="802" publication-number="202616998">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一體成形之航空座椅椅腳的製造方法及其結構以及航空座椅</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">A47C7/50</main-classification>
        <further-classification edition="200601120251030B">B64D11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩摩亞商順譽世界企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUREWIN WORLDWIDE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>WS</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧鳯昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, FENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃忠立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪進山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JIN-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種一體成形之航空座椅椅腳的製造方法，其係取複數個碳纖維預浸布，並依序執行一摺紗程序、一裁切程序、一積層程序、一預形程序及一熱固化程序，待成品冷卻後再拆除模具，即可獲得一航空座椅椅腳。藉此製造方法製成之航空座椅椅腳在結構上沒有接合處，為一體成形且呈中空結構之設計，相較於需要以多個元件組裝的結構，本發明具有結構強度高及輕量化之優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S6:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="803" publication-number="202618279">
    <tif-files tif-type="multi-tif">
      <tif file="113141689.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於表面增強拉曼散射的免疫檢測方法</chinese-title>
        <english-title>METHOD FOR DETECTING IMMUNITY BASED ON SURFACE-ENHANCED RAMAN SCATTERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">G01N33/53</main-classification>
        <further-classification edition="200601120241125B">G01N33/543</further-classification>
        <further-classification edition="200601120241125B">G01N21/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNGHSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳坤麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晉緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳力宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基於表面增強拉曼散射的免疫檢測方法，包含下述步驟。提供一生物晶片，生物晶片包含一基材及複數個第一免疫分子。提供一待測物，其係將待測物施用於基材的表面。提供複數個奈米粒子，奈米粒子中的每一者包含一核及複數個第二免疫分子。進行一反應步驟，其係將奈米粒子施用於基材的表面並反應一反應時間。進行一檢測步驟，其係提供一磁場於生物晶片，並以一拉曼光譜儀對生物晶片進行檢測。進行一數據分析步驟，以得一免疫檢測結果。藉此，有利於增加生物晶片的數據準確性以及免疫檢測的靈敏度，並具有相關領域的應用潛力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for detecting immunity based on surface-enhanced Raman scattering including the following steps. A biochip is provided. The biochip includes a substrate and a plurality of first immune particles. A testing sample is provided, wherein the testing sample is applied to a surface of the substrate. A plurality of nanoparticles are provided, wherein each of the plurality of nanoparticles includes a core and a plurality of second immune particles. A reaction step is performed, wherein the plurality of nanoparticles are applied to the surface of the substrate and reacted for a reacting time. A testing step is performed, wherein a magnetic field is provided to the biochip, and then a Raman spectrometer is used to detect the biochip. A data analysis step is performed so as to obtain an immunoassay result. Therefore, it is favorable for increasing the data accuracy of the biochip and the sensitivity of immune detection, and it has application potentials in relevant fields.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於表面增強拉曼散射的免疫檢測方法</p>
        <p type="p">110,120,130,140,150,160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="804" publication-number="202619010">
    <tif-files tif-type="multi-tif">
      <tif file="113141691.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓框治具和晶圓表面檢測方法</chinese-title>
        <english-title>WAFER FRAME KIT AND WAFER SURFACE DETECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">H01L21/683</main-classification>
        <further-classification edition="200601120241128B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘塑科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAND PROCESS TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZONG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種晶圓框治具和晶圓表面檢測方法。晶圓框治具用於承載和固定晶圓，包括剛性框架和柔性片。該剛性框架包括外框部和中央部。該外框部環繞該中央部。該外框部為實體結構，以及該中央部為鏤空結構。該柔性片與該剛性框架連接並且覆蓋住該剛性框架之該中央部。該柔性片包括晶圓接觸面。該晶圓接觸面用於與晶圓直接接觸並且不具有黏性。該晶圓放置在該剛性框架之該中央部的區域內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a wafer frame kit and a wafer surface detection method. The wafer frame kit is used to carry and fix a wafer, and includes a rigid frame and a flexible sheet. The rigid frame includes an outer frame portion and a central portion. The outer frame portion surrounds the central portion. The outer frame portion is a solid structure, and the central portion is a hollow structure. The flexible sheet is connected to the rigid frame and covers the central portion of the rigid frame. The flexible sheet includes a wafer contact surface. The wafer contact surface is configured to be in direct contact with the wafer and is non-adhesive. The wafer is arranged in an area of ​​the central portion of the rigid frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓框治具</p>
        <p type="p">11:剛性框架</p>
        <p type="p">12:柔性片</p>
        <p type="p">121:晶圓接觸面</p>
        <p type="p">123:凸台</p>
        <p type="p">124:第一開孔</p>
        <p type="p">125:第二開孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="805" publication-number="202617615">
    <tif-files tif-type="multi-tif">
      <tif file="113141693.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除酚製劑及其製備方法與處理含酚廢水之方法</chinese-title>
        <english-title>PHENOL DEGRADING AGENT AND MANUFACTURING METHOD THEREOF AND METHOD FOR TREATING PHENOL-CONTAINING WASTEWATER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250501B">C02F3/34</main-classification>
        <further-classification edition="200601120250501B">C12N1/20</further-classification>
        <further-classification edition="200601120250501B">C12N9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉婉如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭竹逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHU-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種除酚製劑及其製備方法與處理含酚廢水之方法，除酚製劑之製備方法包括步驟：將含有苯酚、對甲酚及二甲酚之無機鹽培養液加入培養槽中；將酚降解菌劑加入培養槽中，於室溫下進行培養；每日將含有苯酚、對甲酚及二甲酚之無機鹽培養液添加於培養槽中，其中無機鹽培養液之日添加量與原培養液之體積比為1：1；以及重複步驟3，於連續培養4天後，得到最終培養液；將最終培養液通過超濾膜進行濃縮，以得到除酚製劑。所製得之除酚製劑包括胞外酵素，於室溫下，將除酚製劑加入含酚廢水中，可降解含酚廢水中的酚類物質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A phenol degrading agent and manufacturing method thereof and a method for treating phenol-containing wastewater are provided. The manufacturing method of phenol degrading agent includes steps of: adding an inorganic salt culture solution containing phenol, p-cresol, and xylenol into a culture tank; adding a phenol-degrading bacteria agent to the culture tank, and culturing at room temperature; adding the inorganic salt culture solution containing phenol, p-cresol, and xylenol to the culture tank every day, wherein a volume ration of the daily addition amount of the inorganic salt culture solution to the original culture solution in the culture tank is 1:1; and repeating step 3 and obtaining a final culture solution after 4 days of continuous cultivation; and concentrating the final culture solution through an ultrafiltration membrane to obtain the phenol degrading agent. The prepared phenol degrading agent includes extracellular enzymes. Adding the phenol degrading agent to the phenol-containing wastewater at room temperature can degrade the phenolic substances in the phenol-containing wastewater.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="806" publication-number="202617175">
    <tif-files tif-type="multi-tif">
      <tif file="113141700.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生物性組成物用於製備皮膚照護產品之用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K38/30</main-classification>
        <further-classification edition="201501120250501B">A61K35/51</further-classification>
        <further-classification edition="200601120250501B">A61K38/39</further-classification>
        <further-classification edition="200601120250501B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>訊聯細胞智藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席　宇廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEBER, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連文瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊于萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種生物性組成物用於製備皮膚照護產品之用途，所述生物性組成物包含類胰島素生長因子-1、臍帶間質幹細胞外泌體和一載劑；其中，所述類胰島素生長因子-1之濃度為10 ng/ml至1000 ng/ml，以及所述臍帶間質幹細胞外泌體之濃度為1×10        &lt;sup&gt;8&lt;/sup&gt;顆/毫升至1×10        &lt;sup&gt;11&lt;/sup&gt;顆/毫升。本發明併用類胰島素生長因子-1和臍帶間質幹細胞外泌體具有促進皮膚補充新細胞和促進膠原蛋白生成之協同功效。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="807" publication-number="202617528">
    <tif-files tif-type="multi-tif">
      <tif file="113141701.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>集裝袋的袋頸吸膜裝置及袋頸收束封口工序</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241127B">B65B31/02</main-classification>
        <further-classification edition="200601120241127B">B65B51/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻寶興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張守綜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種集裝袋的袋頸吸膜裝置及袋頸收束封口工序，該裝置安裝於一入料筒，包含一個約束環、數個吸附件。吸附件可透過真空抽吸力吸附集裝袋的一袋頸內層，使其與一袋頸外層分離，將該袋頸內層吸附固定於該入料筒外部；接著依序進行拉下該袋頸外層、通過該袋頸內層導入物料、封口該袋頸內層、將該袋頸外層拉上包覆該袋頸內層、以及封口該袋頸外層等袋頸收束封口工序，完成物料充填包裝以及封口防潮。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:袋頸吸膜裝置</p>
        <p type="p">11:約束環</p>
        <p type="p">111:外部面</p>
        <p type="p">112:內部面</p>
        <p type="p">12:吸附件</p>
        <p type="p">13:頂端</p>
        <p type="p">14:前部面</p>
        <p type="p">15:吸附槽</p>
        <p type="p">16:真空吸孔</p>
        <p type="p">17:限位件</p>
        <p type="p">18:真空接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="808" publication-number="202617529">
    <tif-files tif-type="multi-tif">
      <tif file="113141703.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防潮集裝袋的雙重收束封口工序</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">B65B31/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻寶興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張守綜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防潮集裝袋的雙重收束封口工序，包括：將一集裝袋的袋頸套於一入料筒外部，並利用真空吸附將袋頸內層吸附固定於入料筒上，真空吸附亦導致袋頸內層和袋頸外層分離；接著，通過袋頸內層向袋本體充填物料，充填完成後使用第一束口件將袋頸內層收束封口；接著，停止真空吸附，然後將袋頸外層往上拉，包覆住袋頸內層，並使用第二束口件將袋頸內層和袋頸外層共同收束封口，形成高效、可靠、防止物料受潮的雙重封口效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:真空吸膜裝置</p>
        <p type="p">11:入料筒</p>
        <p type="p">20:防潮集裝袋</p>
        <p type="p">21:袋本體</p>
        <p type="p">22:管狀袋頸</p>
        <p type="p">23:袋口</p>
        <p type="p">24:吊環</p>
        <p type="p">25:頸片</p>
        <p type="p">31:袋頸箍扣裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="809" publication-number="202618669">
    <tif-files tif-type="multi-tif">
      <tif file="113141704.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工業加熱爐之輻射管的輻射熱能模型建立方法及該輻射管診斷方法與系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241204B">G06Q50/06</main-classification>
        <further-classification edition="200601120241204B">F23D14/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉世詁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安乃駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明在工業加熱爐內部的輻射管表面設置複數溫度感測器，根據量測之溫度數據推算該輻射管之輻射熱能，以推算之輻射熱能及工業加熱爐相關感測器量測數據，進行多元線性迴歸建模分析而選定一輻射熱能模型所需之解釋變數。再利用電腦輔助工程(Computer Aided Engineering, CAE)建立之一輻射熱能電腦輔助工程模型，模擬出輻射管在性能產生變化、發射率改變的情形之輸出數據，根據該輻射熱能電腦輔助工程模型之輸入／輸出數據計算出該輻射熱能模型之模型參數。利用該輻射熱能模型，可蒐集工業加熱爐的實際工作數據，從而診斷該工業加熱爐內部之一輻射管的輻射效率衰減狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="810" publication-number="202618185">
    <tif-files tif-type="multi-tif">
      <tif file="113141707.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>杯式清淨機</chinese-title>
        <english-title>CUP-TYPE PURIFIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250107B">F24F3/16</main-classification>
        <further-classification edition="202101120250107B">F24F8/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碧波庭國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIBOTING INTERNATIONAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉柏樟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PO CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁立彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, LI PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉柏樟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PO CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係一種杯式清淨機，包括杯體、淨化裝置、第一風扇及第二風扇，杯體具有容置空間、進氣口、上排風口及側排風口，上排風口位於杯體的頂部，進氣口及側排風口位於杯體的側邊，進氣口位於上排風口及側排風口之間，進氣口經由容置空間連通上排風口與側排風口，淨化裝置設於容置空間內，第一風扇與第二風扇設於容置空間內且分別位於進氣口的上下兩側，當第一風扇與第二風扇運轉時，空氣自進氣口進入容置空間內並經由淨化裝置淨化後，再由上排風口及側排風口排出至杯體外；藉此，可使清淨機放置於杯架內並起到雙向排風的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cup-type purifier having a cup body, a purifying device, a first fan, and a second fan is provided. The cup body has an accommodating space, an upper outlet located on a top thereon, and an inlet and a side outlet located on a side thereof. The inlet is communicated to the upper outlet and the side outlet through the accommodating space. The purifying device is arranged in the accommodating space. The first fan and the second fan are arranged in the accommodating space and respectively located above and below the inlet. When the first fan and the second fan operate, an air enters the accommodating space through the inlet and purified by the purifying device, and then the air exhausts outside of the cup body from the upper outlet and the side outlet. The cup-type purifier is therefore arranging in a cup holder and achieving two-way exhaust effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:杯體</p>
        <p type="p">102:進氣口</p>
        <p type="p">103:上排風口</p>
        <p type="p">104:側排風口</p>
        <p type="p">11:上殼體</p>
        <p type="p">12:中層框架</p>
        <p type="p">1211:安裝槽</p>
        <p type="p">13:下殼體</p>
        <p type="p">20:淨化裝置</p>
        <p type="p">21:紫外光殺菌模組</p>
        <p type="p">22:負離子產生器</p>
        <p type="p">221:發射排針</p>
        <p type="p">30:過濾模組</p>
        <p type="p">31:安裝框架</p>
        <p type="p">311:通槽</p>
        <p type="p">312:穿槽</p>
        <p type="p">32:過濾件</p>
        <p type="p">91:第一風扇</p>
        <p type="p">92:第二風扇</p>
        <p type="p">D1:安裝方向</p>
        <p type="p">D2:插入方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="811" publication-number="202617062">
    <tif-files tif-type="multi-tif">
      <tif file="113141708.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141708</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組織狀態量測裝置</chinese-title>
        <english-title>TISSUE STATE MEASUREMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">A61B5/00</main-classification>
        <further-classification edition="202101120241125B">A61B5/05</further-classification>
        <further-classification edition="200601120241125B">G01N27/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王廷瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">組織狀態量測裝置包含電極組以及耦接至電極組的控制模組。電極組經配置以朝向介電區域輸出第一感測電場，並與介電區域形成電容迴路。控制模組包括驅動單元以及處理單元。驅動單元經配置以輸出驅動訊號至電極組以輸出第一感測電場。處理單元經配置以量測電容迴路的迴路電容值。其中響應於待測組織位於介電區域內，電容迴路的迴路電容值為第一量測電容值。其中響應於第一量測電容值相較於基線電容值之差異量大於異常閾值，處理單元判定待測組織具有異常狀態位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The tissue state measurement device includes an electrode set and a control module coupled to the electrode set. The electrode set is configured to output a first sensing electric field towards a dielectric region and form a capacitive circuit with the dielectric region. The control module includes a driving unit and a processing unit. The driving unit is configured to output a driving signal to the electrode set to output the first sensing electric field. The processing unit is configured to measure a capacitance value of the capacitive circuit. In response to a test tissue being located within the dielectric region, the capacitance value of the capacitive circuit is measured as a first measured capacitance value. In response to a difference between the first measured capacitance value and a baseline capacitance value is greater than an abnormal threshold, the processing unit determines that the tested tissue has an abnormal state part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:組織狀態量測裝置</p>
        <p type="p">110:電極組</p>
        <p type="p">120:控制模組</p>
        <p type="p">121:驅動單元</p>
        <p type="p">122:處理單元</p>
        <p type="p">AS:驅動訊號</p>
        <p type="p">C0:迴路電容值</p>
        <p type="p">DA:介電區域</p>
        <p type="p">ES1:第一感測電場</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="812" publication-number="202617522">
    <tif-files tif-type="multi-tif">
      <tif file="113141709.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機臂固定模組及無人機</chinese-title>
        <english-title>DRONE ARM FIXATION MODULE AND DRONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241204B">B64C39/02</main-classification>
        <further-classification edition="200601120241204B">B64C27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖建榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, JIAN RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙益祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, YI HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭仁杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JEN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機臂固定模組及無人機。所述機臂固定模組包含殼體、機臂以及鎖定組件。機臂沿第一方向延伸，機臂之第一端部樞接於殼體，第一連接部設置於第一端部。鎖定組件設置於殼體內，鎖定組件包含卡固件，適於沿第二方向移動，且第二連接部設置於卡固件朝向機臂之表面，第二連接部適於可分離地固定第一連接部，該第一方向與該第二方向之方向不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drone arm fixation module and a drone are provided. The drone arm fixation module includes a housing, an arm, and a locking component. The arm extends in a first direction, with its first end portion pivotally connected to the housing. A first coupling portion is deployed on the first end portion. The locking component is deployed within the housing and includes a fastening piece that is configured to move in a second direction. The fastening piece includes a second coupling portion on a surface facing the arm, and the second coupling portion is configured to detachably secure the first coupling portion. The first direction is different from the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">211:條狀滑槽</p>
        <p type="p">213:第一鎖孔部</p>
        <p type="p">214:第二鎖孔部</p>
        <p type="p">222:第一端部</p>
        <p type="p">2221a:第一連接部</p>
        <p type="p">2222a:第三連接部</p>
        <p type="p">23a:鎖定組件</p>
        <p type="p">231:導軌</p>
        <p type="p">232:卡固件</p>
        <p type="p">2321:表面</p>
        <p type="p">2321a:第二連接部</p>
        <p type="p">233a:按壓鎖</p>
        <p type="p">2331:連接桿</p>
        <p type="p">2332:凸塊</p>
        <p type="p">2333:按鈕</p>
        <p type="p">2334:中介板</p>
        <p type="p">2335:第一彈簧</p>
        <p type="p">234:第二彈簧</p>
        <p type="p">236:末端板</p>
        <p type="p">X1a:第一方向</p>
        <p type="p">X2a:第二方向</p>
        <p type="p">X3a:第三方向</p>
        <p type="p">X4:第四方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="813" publication-number="202618701">
    <tif-files tif-type="multi-tif">
      <tif file="113141712.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618701</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維場景建置方法及三維場景建置裝置</chinese-title>
        <english-title>THREE-DIMENSIONAL SCENE CONSTRUCTION METHOD AND THREE-DIMENSIONAL SCENE CONSTRUCTION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">G06T17/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭承展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHENG CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李崇睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHONG RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴亞男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, YANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種三維場景建置方法及三維場景建置裝置。辨識平面配置影像中的一或多個目標物件，其中平面配置影像對應於具有目標物件的輪廓的平面圖。依據目標物件在平面配置影像中的位置及形狀在三維空間中加入對應的一或多個三維物件。藉此，可改善模型建置的效率及精確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional scene construction method and a three-dimensional scene construction apparatus are provided. One or more target objects are identified in a plan configuration image, wherein the plan configuration image corresponds to a plan view having an outline of the target object. Corresponding one or more three-dimensional objects are added in the three-dimensional space according to the position and shape of the target object in the plane configuration image. Therefore, the efficiency and accuracy of model construction could be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="814" publication-number="202617536">
    <tif-files tif-type="multi-tif">
      <tif file="113141714.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密封元件包裝結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B65D53/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉特立有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種密封元件包裝結構，包括一下殼體及一上殼體，下殼體係由一第一板材一體成型製得，第一板材之周緣向下彎折延伸構成一下環壁，再橫向朝外延伸形成一下凸緣，第一板材於下環壁所圈圍的區域內下凹形成一下環狀槽，下環狀槽之側壁與下環壁相連結的區域定義爲下緩衝區，下環槽所圈圍的區域定義爲下支撐區，下支撐區內成型至少一支撐部，上殼體具有與下殼體相同的輪廓並可套疊於下殼體上，其上環槽與下環槽之間形成一容納密封元件的容置空間，其上支撐部與下支撐部相互貼合，增加上、下殼體之間的密合度，加強包裝結構強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:下殼體</p>
        <p type="p">1:第一板材</p>
        <p type="p">11:下環壁</p>
        <p type="p">111:卡槽</p>
        <p type="p">12:下凸緣</p>
        <p type="p">121:下缺口</p>
        <p type="p">13:下環槽</p>
        <p type="p">131:槽底面</p>
        <p type="p">132:置放階面</p>
        <p type="p">133、231:側壁</p>
        <p type="p">14:下緩衝區</p>
        <p type="p">15:下支撐區</p>
        <p type="p">151:下支撐部</p>
        <p type="p">152:下中心支撐部</p>
        <p type="p">153:下輔助支撐部</p>
        <p type="p">16:取物槽</p>
        <p type="p">200:上殼體</p>
        <p type="p">21:上環壁</p>
        <p type="p">211:卡凸</p>
        <p type="p">22:上凸緣</p>
        <p type="p">221:上缺口</p>
        <p type="p">23:上環槽</p>
        <p type="p">24:上緩衝區</p>
        <p type="p">25:上支撐區</p>
        <p type="p">251:上支撐部</p>
        <p type="p">252:上中心支撐部</p>
        <p type="p">253:上輔助支撐部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="815" publication-number="202618514">
    <tif-files tif-type="multi-tif">
      <tif file="113141715.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置及負載控制的方法</chinese-title>
        <english-title>CONTROL DEVICE AND METHOD FOR LOAD CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G06F1/26</main-classification>
        <further-classification edition="200601120250901B">G06F1/20</further-classification>
        <further-classification edition="200601120250901B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盟創科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITRASTAR TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鐘賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜正昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡品毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PING-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制裝置及負載控制的方法。控制裝置包括第一及第二整流元件、第一電壓供應器及第一線性電壓供應器。第一及第二整流元件耦接負載的接收端。第一電壓供應器提供第一電壓至第一整流元件。第一線性電壓供應器包括第一溫度感測器及第一線性控制器。第一線性電壓供應器透過第一線性控制器，根據透過第一溫度感測器反應於第一熱源溫度的感測結果而提供第一線性電壓至第二整流元件。控制裝置至少根據第一電壓的電壓值以及第一線性電壓的電壓值，導通第一整流元件及第二整流元件的其中之一，以提供輸出電壓至負載的接收端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control device and a method for load control are provided. The control device includes first and second rectifier elements, a first voltage supplier and a first linear voltage supplier. The first and second rectifier elements are coupled to a receiving end of the load. The first voltage supplier provides a first voltage to the first rectifier element. The first linear voltage supplier includes a first temperature sensor and a first linear controller. The first linear voltage supplier provides the first linear voltage to the second rectifier element through the first linear controller according to a sensing result of the first temperature sensor reacting to a temperature of a first heat source. The control device turns on one of the first rectifier element and the second rectifier element, at least according to a voltage value of the first voltage and a voltage value of the first linear voltage, to provide an output voltage to a receiving end of the load.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制裝置</p>
        <p type="p">105:風扇</p>
        <p type="p">110:第一整流元件</p>
        <p type="p">120:第二整流元件</p>
        <p type="p">130:第一電壓供應器</p>
        <p type="p">132:第一線性穩壓器</p>
        <p type="p">134:分壓電路</p>
        <p type="p">140:第一線性電壓供應器</p>
        <p type="p">142:第一溫度感測器</p>
        <p type="p">145:第一線性控制器</p>
        <p type="p">150:負載控制器</p>
        <p type="p">195:熱源</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">VL1:第一線性電壓</p>
        <p type="p">EN1、EN2:致能信號</p>
        <p type="p">DV:分壓電壓</p>
        <p type="p">D1、D2:二極體</p>
        <p type="p">R1、R2:電阻</p>
        <p type="p">RT1:熱敏電阻</p>
        <p type="p">R3:參考電阻</p>
        <p type="p">VIN:輸入端</p>
        <p type="p">VOUT:輸出端</p>
        <p type="p">ADJ1、ADJ2:回授端</p>
        <p type="p">EN:致能端</p>
        <p type="p">RN:負載的接收端</p>
        <p type="p">TDS1:感測結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="816" publication-number="202618154">
    <tif-files tif-type="multi-tif">
      <tif file="113141717.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具含氟彈性密封體之氣密構件及其製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">F16J15/10</main-classification>
        <further-classification edition="200601120250512B">C08L27/12</further-classification>
        <further-classification edition="200601120250512B">B29C43/22</further-classification>
        <further-classification edition="200601120250512B">B29C43/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉特立有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具含氟彈性密封體之氣密構件，具有一氣密構件及一含氟彈性密封體，氣密構件之主體沿軸向之任一端具有一基面，含氟彈性密封體透過熱壓成型結合於基面上。本發明還提供一製作方法，藉由一主體模具固定氣密構件，再將含氟彈性預壓料置於基面上或一成型模具之模合面上，藉由模合面上的成型模穴施壓於含氟彈性預壓料，再經成型模具加溫形成一含氟彈性密封體結合於基面上，使氣密構件結合含氟彈性密封體形成一體結構，易拆卸組裝且密封效果佳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣密構件</p>
        <p type="p">1:主體、陶瓷噴氣嘴</p>
        <p type="p">11:上段部</p>
        <p type="p">12:下段部</p>
        <p type="p">13:基面</p>
        <p type="p">131:外輪廓</p>
        <p type="p">14:中心孔</p>
        <p type="p">2:含氟彈性密封體</p>
        <p type="p">Z:軸向</p>
        <p type="p">D1、D2:間距</p>
        <p type="p">H1、H2:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="817" publication-number="202617555">
    <tif-files tif-type="multi-tif">
      <tif file="113141720.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動更換載具設備及產品轉移方法</chinese-title>
        <english-title>Automatic Carrier Replacement Device and Product Transfer Method</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250924B">B65G37/02</main-classification>
        <further-classification edition="200601120250924B">B65G47/91</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立芯精密智造（昆山）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BI, XIANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李永光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YONGGUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張賢祝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIANZHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘小波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, XIAOBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何良宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LIANGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及自動生產技術領域，具體公開了一種自動更換載具設備及產品轉移方法，該自動更換載具設備中，機械臂能從第一流水線上的第一載具獲取產品並將其放置於第二流水線上的第二載具上；供應機構中的限位組件用於限制料框相對供應底座固定，料框包括具有承載槽的支撐架體和可移動設於支撐架體的鎖止件，承載槽用於盛放第二載具，鎖止件能在第二載具移出承載槽的路徑上以限制第二載具移出承載槽，解鎖組件的解鎖部能抵接鎖止件以使其解除對第二載具的限制；供料流線設於傳動組件和第二流水線之間，用於將第二載具傳遞至第二流水線；轉移機構用於將料框中的第二載具轉移至供料流線。上述設置能提高產品從第一載具轉移至第二載具的成功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of automatic production technology, and specifically discloses an automatic carrier replacement device and a product transfer method, in which a robot arm can obtain a product from a first carrier on a first assembly line and place it on a second carrier on a second assembly line; a limit assembly in a supply mechanism is used to limit the material frame to be fixed relative to a supply base, the material frame includes a support frame with a bearing groove and a locking member movably arranged on the support frame, the bearing groove is used to hold a second carrier, the locking member can be on the path of the second carrier moving out of the bearing groove to limit the second carrier from moving out of the bearing groove, and the unlocking part of the unlocking assembly can abut the locking member to release the restriction on the second carrier; the feeding streamline is arranged between the transmission assembly and the second assembly line, and is used to transfer the second carrier to the second assembly line; the transfer mechanism is used to transfer the second carrier in the material frame to the feeding streamline. The above arrangement can improve the success rate of transferring products from the first carrier to the second carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:產品</p>
        <p type="p">2100:第一載具</p>
        <p type="p">2200:第二載具</p>
        <p type="p">100:機架</p>
        <p type="p">210:第一流水線</p>
        <p type="p">220:第二流水線</p>
        <p type="p">300:機械臂</p>
        <p type="p">400:供應機構</p>
        <p type="p">450:料框</p>
        <p type="p">500:供料流線</p>
        <p type="p">600:轉移機構</p>
        <p type="p">710:送料組件</p>
        <p type="p">720:收料組件</p>
        <p type="p">810:第一回收組件</p>
        <p type="p">811:第一回收流線</p>
        <p type="p">820:第二回收組件</p>
        <p type="p">821:第二回收流線</p>
        <p type="p">822:吸取組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="818" publication-number="202619202">
    <tif-files tif-type="multi-tif">
      <tif file="113141721.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及其製造方法</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250108B">H01R13/6581</main-classification>
        <further-classification edition="200601120250108B">H01R13/502</further-classification>
        <further-classification edition="200601120250108B">H01R43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密組件（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION ACCESSORY (SUZHOU) LTD,.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括屏蔽組件、第一端子模組、第二端子模組以及成型塊。前述屏蔽組件包括端板以及隔板。前述端板包括框體部。前述隔板包括垂直於前述框體部的中隔片。前述成型塊至少部分成型於前述屏蔽組件、前述第一端子模組以及前述第二端子模組上。前述框體部嵌入在前述成型塊中，且前述端板位於前述框體部的外側。如此設置，本發明的電連接器在具備屏蔽功能的同時，也改善了其結構強度。本發明還揭示了一種前述電連接器的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a shielding assembly, a first terminal module, a second terminal module, and a molding block. The shielding assembly includes an end plate and a spacing plate. The end plate includes a frame portion. The spacing plate includes a middle spacing piece perpendicular to the frame portion. The molding block is at least partially molded on the shielding assembly, the first terminal module and the second terminal module. The frame portion is embedded in the molding block, and the end plate is disposed on an outside of the frame portion. The electrical connector of the present invention has a shielding function while improving its structural strength. The present invention also discloses a method of manufacturing the electrical connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:框體部</p>
        <p type="p">121:中隔片</p>
        <p type="p">131:第一抵接部</p>
        <p type="p">132:第一延伸部</p>
        <p type="p">141:第二抵接部</p>
        <p type="p">142:第二延伸部</p>
        <p type="p">2111:第一接觸部</p>
        <p type="p">2112:第一安裝尾部</p>
        <p type="p">2211:第二接觸部</p>
        <p type="p">2212:第二安裝尾部</p>
        <p type="p">3a:第一成型塊</p>
        <p type="p">3b:第二成型塊</p>
        <p type="p">3c:第三成型塊</p>
        <p type="p">30:收容空間</p>
        <p type="p">311:第一表面</p>
        <p type="p">312:第二表面</p>
        <p type="p">321:第三表面</p>
        <p type="p">322:第四表面</p>
        <p type="p">34:端壁</p>
        <p type="p">5:膠水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="819" publication-number="202619371">
    <tif-files tif-type="multi-tif">
      <tif file="113141722.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴式耳機</chinese-title>
        <english-title>HEADPHONES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04R5/02</main-classification>
        <further-classification edition="200601120250303B">H04R5/033</further-classification>
        <further-classification edition="200601120250303B">H04R1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱書敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, SHUMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種頭戴式耳機，包括頭帶殼體及耳機主體，所述頭帶殼體設有伸出口，所述頭戴式耳機還包括滑動支架、調節件和阻尼壓緊組件，滑動支架設置於所述頭帶殼體內，且所述滑動支架設有第一通孔；調節件可活動地穿設於所述第一通孔，且所述調節件由所述伸出口伸出並連接於所述耳機主體；所述阻尼壓緊組件連接於所述調節件，並用於將所述調節件壓緊固定於所述滑動支架。本發明提供的頭戴式耳機能夠實現無級調節，具有較高的調節精度，提升佩戴舒適性，保證了音質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a pair of headphones with a headband housing and a headphone body. The headband housing is provided with an extension opening. The pair of headphones includes a sliding bracket, an adjustment member and a damping compression assembly. The sliding bracket is arranged in the headband housing, and the sliding bracket is provided with a first through hole. The adjustment member is movably inserted through the first through hole. The adjustment member extends from the extension opening and is connected to the headphone body. The damping compression assembly is connected to the adjustment member for pressing and fixing the adjustment member to the sliding bracket. By realizing stepless adjustment, the pair of headphones provided by the present disclosure has higher adjustment accuracy. Therefore, wearing comfort is improved and sound quality is guaranteed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:上殼體</p>
        <p type="p">120:下殼體</p>
        <p type="p">200:滑動支架</p>
        <p type="p">300:調節件</p>
        <p type="p">400:阻尼壓緊組件</p>
        <p type="p">600:支撐片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="820" publication-number="202619192">
    <tif-files tif-type="multi-tif">
      <tif file="113141724.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250225B">H01R13/639</main-classification>
        <further-classification edition="200601120250225B">H01R13/40</further-classification>
        <further-classification edition="200601120250225B">H01R13/02</further-classification>
        <further-classification edition="200601120250225B">H01R13/502</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴中元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, ZHONGYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫正國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, ZHENGGUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錦琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JINQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括絕緣本體、複數第一導電端子、複數第二導電端子以及旋轉蓋板。前述絕緣本體設有配置為收容電連接體的對接插槽。前述第一導電端子包括第一接觸彈臂，前述第一接觸彈臂設有第一接觸部。前述第二導電端子包括第二接觸彈臂，前述第二接觸彈臂設有第二接觸部。前述旋轉蓋板能夠相對於前述絕緣本體在打開位置和閉合位置之間轉動。當前述旋轉蓋板從前述打開位置旋轉到前述閉合位置的過程中，前述旋轉蓋板抵接前述第一接觸彈臂和前述第二接觸彈臂，使得前述第一接觸部和前述第二接觸部均與前述電連接體緊密接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes an insulating body, a plurality of first conductive terminals, a plurality of second conductive terminals and a rotating cover. The insulating body includes a mating slot configured to receive an electrical connecting member. The first conductive terminal includes a first contact spring arm, and the first contact spring arm is provided with a first contact portion. The second conductive terminal includes a second contact spring arm, and the second contact spring arm is provided with a second contact portion. The rotating cover is rotatable relative to the insulating body between an open position and a closed position. When the rotating cover rotates from the open position to the closed position, the rotating cover abuts against the first contact elastic arms and the second contact elastic arms, so that both the first contact portions and the second contact portions are in close contact with the electrical connecting member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:第一導電端子</p>
        <p type="p">212:第一接觸彈臂</p>
        <p type="p">2122:第一抵接斜面</p>
        <p type="p">213:第一抵接彈臂</p>
        <p type="p">2131:第一抵接平面</p>
        <p type="p">3:旋轉蓋板</p>
        <p type="p">31:第一凸輪</p>
        <p type="p">313:第二平面</p>
        <p type="p">314:第二斜面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="821" publication-number="202617325">
    <tif-files tif-type="multi-tif">
      <tif file="113141726.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工件組裝設備</chinese-title>
        <english-title>WORKPIECE ASSEMBLY EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">B23P19/04</main-classification>
        <further-classification edition="200601120250311B">B23P19/10</further-classification>
        <further-classification edition="200601120250311B">B25J18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立芯精密智造（昆山）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BI, XIANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬千明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAO, QIANMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張賢祝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIANZHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘小波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, XIAOBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳紅豔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HONGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及自動化組裝技術領域，具體公開了一種工件組裝設備，該工件組裝設備中，對接組件設置於機架，對接底座設於機架，且能盛放第一工件和第二工件；對接機構設於對接底座，其對接部能靠近或遠離第一工件，並能在靠近第一工件時抵推第二工件以使其與第一工件插接配合並形成組裝件；導向機構設於對接底座，導向機構的導向件具有導向通道，導向通道用於導向對接機構的對接部以及導向第二工件靠近第一工件；承載機構用於承載第一工件，並能承載組裝件；機械臂的輸出端用於吸附第一工件，並在機械臂的驅動作用下在承載機構和對接底座之間往復移動。上述設置降低了工作人員的勞動強度；避免錯位而產生損傷；避免誤報廢而產生的浪費問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of automated assembly technology, and specifically discloses a workpiece assembly device, in which a docking assembly is arranged on a frame, a docking base is arranged on the frame, and can hold a first workpiece and a second workpiece; a docking mechanism is arranged on the docking base, and its docking portion can approach or move away from the first workpiece, and can push the second workpiece when approaching the first workpiece so that it can be plugged and matched with the first workpiece to form an assembly; a guide mechanism is arranged on the docking base, and the guide member of the guide mechanism has a guide channel, and the guide channel is used to guide the docking portion of the docking mechanism and guide the second workpiece to approach the first workpiece; a bearing mechanism is used to carry the first workpiece and can carry the assembly; the output end of the robot arm is used to adsorb the first workpiece, and reciprocates between the bearing mechanism and the docking base under the driving action of the robot arm. The above-mentioned arrangement reduces the labor intensity of the staff; avoids damage caused by misalignment; and avoids waste caused by wrong scrapping.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2000:測試板</p>
        <p type="p">210:對接底座</p>
        <p type="p">220:對接機構</p>
        <p type="p">230:導向機構</p>
        <p type="p">240:物料框</p>
        <p type="p">241:物料頂升驅動件</p>
        <p type="p">251:轉移驅動件</p>
        <p type="p">252:轉移升降件</p>
        <p type="p">253:轉移吸附件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="822" publication-number="202619146">
    <tif-files tif-type="multi-tif">
      <tif file="113141728.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池模組拆解系統</chinese-title>
        <english-title>BATTERY MODULE DISMANTLING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01M10/54</main-classification>
        <further-classification edition="200601120241230B">H01M6/52</further-classification>
        <further-classification edition="202201320241230B">B09B101/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>競零再生科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEYOND ZERO RECYCLING TECHNOLOGY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何麗貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HER, LI-JANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHI-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種電池模組拆解系統，包含：第一導軌，於XY平面上沿X軸方向延伸設置；平台，可滑動地設置於第一導軌上，以可選擇地沿X軸方向往復移動；第二導軌，設置於平台相對於第一導軌之一側，並沿Y軸方向延伸設置；載物台，設置於第二導軌上，以可選擇地沿Y軸方向往復移動，其中：載物台與平台間係界定有第一容置空間；載物台上形成有第一穿孔，與第一容置空間相連通；以及載物台可選擇地供電池模組設置，其中電池模組中包含電芯；以及下壓桿，與載物台相對應地設置，以可選擇地沿Z軸方向往復移動，並使電芯與電池模組分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a battery module dismantling system, comprising: a first guide rail, arranged along a X-axis of a X-Y plane; a working platform, slidably arranged on the first guide rail and optionally moved along the X-axis; a second guide rail, arranged on a side of the working platform that is relative to first guide rail, and arranged along a Y-axis of the X-Y plane; an object platform, arranged on the second guide rail and optionally moved along the Y-axis; wherein a first storage space is defined between the object platform and the working platform; a first perforation is formed on the object platform and is connected to the first storage space; and the object platform optionally arranged with a battery module, wherein the battery module comprises a battery cell; and a pressing lever, correspondingly arranged with object platform and optionally moved along a Z-axis, and is used for separating the battery cell from the battery module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電池模組拆解系統</p>
        <p type="p">2:第一導軌</p>
        <p type="p">3:XY平面</p>
        <p type="p">4:平台</p>
        <p type="p">5:第二導軌</p>
        <p type="p">6:載物台</p>
        <p type="p">7:第一容置空間</p>
        <p type="p">8:第一穿孔</p>
        <p type="p">9:電池模組</p>
        <p type="p">10:電芯</p>
        <p type="p">11:下壓桿</p>
        <p type="p">14:第二穿孔</p>
        <p type="p">27:第一定位孔</p>
        <p type="p">30:升降載台</p>
        <p type="p">31:第三定位孔</p>
        <p type="p">32:手壓桿</p>
        <p type="p">33:基板</p>
        <p type="p">34:架體結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="823" publication-number="202617142">
    <tif-files tif-type="multi-tif">
      <tif file="113141731.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>GSNOR（S-nitroso-glutathione　reductase）抑制劑用於治療或/及預防肥胖症及骨質疏鬆症之用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K31/41</main-classification>
        <further-classification edition="200601120250501B">A61K31/40</further-classification>
        <further-classification edition="200601120250501B">A61K31/185</further-classification>
        <further-classification edition="200601120250501B">A61K31/16</further-classification>
        <further-classification edition="200601120250501B">A61P3/04</further-classification>
        <further-classification edition="200601120250501B">A61P19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種GSNOR（S-nitroso-glutathione reductase）抑制劑用於治療或/及預防肥胖症及骨質疏鬆症之用途，意即藉由投予一有效量之GSNOR抑制劑或含有該GSNOR抑制劑之組合物至一個體，係能夠有效地達到治療或/及預防與脂肪失衡或骨質流失相關之疾病，如肥胖症、骨質疏鬆症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="824" publication-number="202618312">
    <tif-files tif-type="multi-tif">
      <tif file="113141735.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備疊料防止功能的積體電路測試機台及積體電路測試系統</chinese-title>
        <english-title>INTEGRATED CIRCUIT TESTER AND TESTING SYSTEM EQUIPPED WITH ANTI-STACKING PREVENTION FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250205B">G01R31/26</main-classification>
        <further-classification edition="202001120250205B">G01R31/01</further-classification>
        <further-classification edition="200601120250205B">G01R1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TZU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PING-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾裕峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具備疊料防止功能的積體電路測試機台及測試系統，積體電路測試機台包含測試頭及主機。積體電路測試機台用於與分類機協同工作。測試頭用於供分類機置放受測物，以及供分類機取回受測物。主機用於藉由測試頭對受測物執行測試程序，並提供第一指令使該分類機運作於更換階段。更換階段使分類機先執行取回程序再執行置放程序以更換為另一受測物。其中，主機用於在更換階段內藉由測試頭執行殘留測試程序，並於受測物殘留於測試頭上時，產生使分類機停止運作的第二指令。藉此，無需增加測試時間也能解決分類機異常所導致的疊料問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An Integrated Circuit Tester and Testing System with Anti-Stacking Prevention Function. The integrated circuit tester comprises a test head and a main unit. The integrated circuit tester is designed to work in conjunction with a handler. The test head is used for placing the device under test (DUT) by the handler, as well as for retrieving the DUT by the handler. The main unit is responsible for performing a testing procedure on the DUT via the test head and issuing a first command to operate the handler in a replacement phase. During the replacement phase, the handler first executes a retrieval procedure followed by a placement procedure to replace the DUT with another. The main unit is further configured to execute a residual testing procedure via the test head during the replacement phase and generate a second command to stop the handler if the DUT remains on the test head. This mechanism addresses the stacking issue caused by handler malfunctions without increasing testing time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路測試機台</p>
        <p type="p">110:主機</p>
        <p type="p">120:測試頭</p>
        <p type="p">200:分類機</p>
        <p type="p">210:取放裝置</p>
        <p type="p">C1(EOT):第一指令</p>
        <p type="p">C2(STOP):第二指令</p>
        <p type="p">C3(SOT):第三指令</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="825" publication-number="202619318">
    <tif-files tif-type="multi-tif">
      <tif file="113141736.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141736</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支援乙太網路供電功能的系統、裝置及其電力分配方法</chinese-title>
        <english-title>SYSTEM AND DEVICE WITH POWER OVER ETHERNET FUNCTIONALITY AND POWER DISTRIBUTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">H04L12/10</main-classification>
        <further-classification edition="200601120250204B">H04L12/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康聯訊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONNECTION TECHNOLOGY SYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昱程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡弘熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種支援乙太網路供電功能的系統、裝置及其電力分配方法。所述裝置具有多個乙太網路連接埠，並且所述裝置包括電源產生模組以及PoE控制模組。電源產生模組用以產生裝置運作所需的工作電源，其中電源產生模組經控制選擇從所述多個乙太網路連接埠其中之一所接收到的第一電源訊號作為產生工作電源的供電來源。PoE控制模組電性連接電源產生模組，用以控制電源產生模組的供電來源的切換，以使電源產生模組在第一供電週期內依序以所述多個乙太網路連接埠的至少其中多者所提供之第一電源訊號作為供電來源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and device with PoE functionality and a power supply control method thereof are provided. The device has a plurality of Ethernet ports and includes a power generation module and a PoE control module. The power generation module is configured to generate an operating power for the device, where the power generation module is controlled to select a first power signal received from one of the Ethernet ports as a power source for generating the operating power. The PoE control module is electrically connected to the power generation module and configured to control the switching of the power source for the power generation module, so that during a first power supply cycle, the power generation module sequentially uses the first power signal provided by at least some of the Ethernet ports as the power source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:PoE系統</p>
        <p type="p">30_1~30_n:終端設備</p>
        <p type="p">300:支援PoE功能的裝置</p>
        <p type="p">320:訊號處理模組</p>
        <p type="p">330:PoE控制模組</p>
        <p type="p">331:電源檢測單元</p>
        <p type="p">332:切換單元</p>
        <p type="p">340:主控制器</p>
        <p type="p">350:電源產生模組</p>
        <p type="p">NTK:網路</p>
        <p type="p">Pdc1~Pdcn:直流電源/電源訊號</p>
        <p type="p">Pe:電源埠</p>
        <p type="p">PS1、PS2:供電來源</p>
        <p type="p">PSG:外部電源/綠能電源</p>
        <p type="p">Pope:工作電源</p>
        <p type="p">Rp_1~Rp_n:乙太網路連接埠</p>
        <p type="p">S310~S350:支援反向PoE功能的裝置的電力分配方法的步驟</p>
        <p type="p">Spd1~Spdn:電訊號</p>
        <p type="p">Spdt:電源檢測訊號</p>
        <p type="p">TPI:終端供電資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="826" publication-number="202618712">
    <tif-files tif-type="multi-tif">
      <tif file="113141740.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>姿態檢測方法、裝置及可讀存儲介質</chinese-title>
        <english-title>POSTURE DETECTION METHOD, DEVICE AND READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V40/20</main-classification>
        <further-classification edition="202201120250401B">G06V10/10</further-classification>
        <further-classification edition="200601120250401B">G08B21/04</further-classification>
        <further-classification edition="200601120250401B">G08B21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施正遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓柏全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, PO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種姿態檢測方法，用於檢測人體姿態，包括：獲取目標場景的第一紅外熱成像圖像；提取第一紅外熱成像圖像中對應人體的第一畫素點形成第一人體圖像區域；獲取目標場景的第二紅外熱成像圖像；提取第二紅外熱成像圖像中對應人體的第二畫素點形成第二人體圖像區域；在第一人體圖像區域與第二人體圖像區域的重疊度低於預設重疊度時，獲取第二人體圖像區域的最小外接橢圓對應的最小外接矩形的長寬比，以及最小外接橢圓的長軸與預設垂直方向的夾角，根據長寬比及夾角判定人體姿態。本申請還提供一種姿態檢測裝置及一種可讀存儲介質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a posture detection method for detecting human posture. The posture detection method includes obtaining a first infrared thermal image of a target scene; extracting first pixels corresponding to human body from the first infrared thermal image to form a first human body image region; obtaining a second infrared thermal image of the target scene; extracting second pixels corresponding to human body from the second infrared thermal image to form a second human body image region; and when an overlap degree between the first human body image region and the second human body image region is lower than a preset overlap degree, obtaining an aspect ratio of a minimum external rectangle corresponding to a minimum external ellipse of the second human body image region and an angle between a long axis of the minimum external ellipse and a preset vertical direction, and determining the human posture according to the aspect ratio and the angle. The disclosure also provides a posture detection device and a readable storage medium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="827" publication-number="202618744">
    <tif-files tif-type="multi-tif">
      <tif file="113141741.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示控制電路及顯示裝置</chinese-title>
        <english-title>DISPLAY CONTROL CIRCUIT AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241202B">G09G3/32</main-classification>
        <further-classification edition="200601120241202B">G09G3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商榮諭科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPHETEK SOLUTION (CHENGDU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榮諭科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPHETEK SOLUTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡英宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNAG, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李璟林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHING-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示控制電路及顯示裝置，顯示控制電路包括發光組件、溫度檢測裝置和控制電路。溫度檢測裝置用於檢測發光組件的工作溫度。控制電路與發光組件及溫度檢測裝置分別電連接，用於輸出驅動信號，驅動信號用於控制發光組件發光；控制電路還用於根據工作溫度調整驅動信號；在工作溫度大於預設溫度的情形下，驅動信號的電流與工作溫度成正相關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display control circuit includes a light emitting module, a temperature detecting device, and a control circuit. The temperature detecting device is configured to detect an operating temperature of the light emitting module. The control circuit is electrically connected with the light emitting module and the temperature detecting device, the control circuit is configured to output driving signals, and the driving signals are configured to drive the light emitting module to emit light; The control circuit is also configured to adjust the drive signals according to the operating temperature; When the operating temperature is greater than a preset temperature, a current of the driving signals is positively correlated with the operating temperature. A display device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示控制電路</p>
        <p type="p">110:發光組件</p>
        <p type="p">120:溫度檢測裝置</p>
        <p type="p">130:控制電路</p>
        <p type="p">140:驅動電路</p>
        <p type="p">150:濾波電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="828" publication-number="202618370">
    <tif-files tif-type="multi-tif">
      <tif file="113141742.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141742</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可變焦鏡頭的組裝方法</chinese-title>
        <english-title>INSTALLATION METHOD OF A ZOOM LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241204B">G02B7/09</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今國光學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINKO OPTICAL CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晉傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN-CHIEH, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可變焦鏡頭的組裝方法，包括：提供一鏡筒，其具有一物側端、一像側端、一筒身及一對電路接腳，像側端具有一組裝孔，筒身具有一對電路槽及一對分別與該對電路槽相匹配的徑向孔，該對電路接腳分別設於相匹配的電路槽及徑向孔；依序將一前鏡群、一可變焦透鏡套件及一後鏡群由組裝孔裝入鏡筒，前鏡群包括至少一前鏡群透鏡，後鏡群包括至少一後鏡群透鏡，可變焦透鏡套件包括一間隔環、一可變形透鏡及一對透鏡套件接腳；將前鏡群、可變焦透鏡套件及後鏡群分別與鏡筒固定；通過導電膠將該對透鏡套件接腳分別與該對電路接腳形成電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An installation method of a zoom lens includes: providing a lens barrel, which has an object side end, an image side end, a barrel body and a pair of circuit pins, the image side end has an assembly hole, and the barrel body has a pair of circuit slots and a pair of radial holes that match the pair of circuit slots, respectively; sequentially installing a front lens group, a variable focus lens set and a rear lens group into the lens barrel through the assembly hole, the front lens group includes at least one front lens, the real lens group has at least one rear lens, the variable focus lens set includes a spacer ring, a deformable lens and a pair of lens set pins; fixing the front lens group, the variable focus lens set and the rear lens group to the lens barrel, respectively; electrically connecting the pair of lens set pins to the pair of circuit pins through conductive glue.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鏡筒</p>
        <p type="p">11:物側端</p>
        <p type="p">111:入光孔</p>
        <p type="p">12:像側端</p>
        <p type="p">121:組裝孔</p>
        <p type="p">13:筒身</p>
        <p type="p">131:電路槽</p>
        <p type="p">132:徑向孔</p>
        <p type="p">133:透鏡套件容置槽</p>
        <p type="p">14:電路接腳</p>
        <p type="p">141:空心錐體</p>
        <p type="p">142:點膠孔</p>
        <p type="p">20:前鏡群</p>
        <p type="p">21:前鏡群透鏡</p>
        <p type="p">211:承靠面</p>
        <p type="p">30:可變焦透鏡套件</p>
        <p type="p">31:間隔環</p>
        <p type="p">32:可變形透鏡</p>
        <p type="p">33:透鏡套件接腳</p>
        <p type="p">40:後鏡群</p>
        <p type="p">41:後鏡群透鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="829" publication-number="202618192">
    <tif-files tif-type="multi-tif">
      <tif file="113141769.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷量分配單元以及冷量控制櫃</chinese-title>
        <english-title>COOLING DISTRIBUTION UNIT AND COOLING CONTROL CABINET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">F25B49/02</main-classification>
        <further-classification edition="200601120250325B">F25D31/00</further-classification>
        <further-classification edition="200601120250325B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊熱傳科技（惠州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE THERMAL TECHNOLOGIES (HUIZHOU) CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種冷量分配單元，包括第一泵、第二泵、泵入口管路、泵出口管路、熱交換器以及第一回流管路。前述泵入口管路包括第一入口端止回閥、第一泵入口管、第二入口端止回閥以及第二泵入口管。前述泵出口管路包括第一出口端止回閥、第一泵出口管、第二出口端止回閥以及第二泵出口管。前述第一泵出口管和/或前述第二泵出口管與熱交換器入口相連。前述第一回流管路與熱交換器出口相連。相較於習知技術，本發明能夠在系統運轉時實現對零件進行維護。本發明還揭示了一種具有前述冷量分配單元的冷量控制櫃。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling distribution unit includes a first pump, a second pump, a pump inlet pipeline, a pump outlet pipeline, a heat exchanger and a first return pipeline. The pump inlet pipeline includes a first inlet check valve, a first pump inlet pipe, a second inlet check valve and a second pump inlet pipe. The pump outlet pipeline includes a first outlet check valve, a first pump outlet pipe, a second outlet check valve and a second pump outlet pipe. The first pump outlet pipe and/or the second pump outlet pipe are connected to a heat exchanger inlet. The first return pipeline is connected to a heat exchanger outlet. Compared with the existing technology, the present invention can realize maintenance of components while the system is running. The present invention also discloses a cooling control cabinet having the cooling distribution unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一泵</p>
        <p type="p">12:第二泵</p>
        <p type="p">25:主入口管</p>
        <p type="p">261:第一入口主管路感測器</p>
        <p type="p">27:第一旁通管</p>
        <p type="p">271:第一調節閥</p>
        <p type="p">281:第一手動蝶閥</p>
        <p type="p">282:第二手動蝶閥</p>
        <p type="p">283:第一篩檢程式</p>
        <p type="p">31:第一出口端止回閥</p>
        <p type="p">37:主出口管</p>
        <p type="p">38:第二金屬波紋管</p>
        <p type="p">4:熱交換器</p>
        <p type="p">41:第一熱交換器入口</p>
        <p type="p">43:第二熱交換器入口</p>
        <p type="p">44:第二熱交換器出口</p>
        <p type="p">51:第一回流管路</p>
        <p type="p">5134:第二回流管路感測器</p>
        <p type="p">5141:第二調節閥</p>
        <p type="p">5142:壓力調節裝置</p>
        <p type="p">52:第二回流管路</p>
        <p type="p">521:第三回流管路感測器</p>
        <p type="p">523:第二調控閥</p>
        <p type="p">7:出口管路</p>
        <p type="p">71:第一調控閥</p>
        <p type="p">73:三通電動閥</p>
        <p type="p">74:第二流量裝置</p>
        <p type="p">8:第二旁通管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="830" publication-number="202618543">
    <tif-files tif-type="multi-tif">
      <tif file="113141771.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＩＡＭ政策生成方法及其系統</chinese-title>
        <english-title>IDENTITY AND ACCESS MANAGEMENT POLICY GENERATION METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F9/06</main-classification>
        <further-classification edition="200601120250203B">G06F9/46</further-classification>
        <further-classification edition="202201120250203B">H04L41/08</further-classification>
        <further-classification edition="202201120250203B">H04L41/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴正一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOUNG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鐘萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴智秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JI SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的實施例的身份和訪問管理（IAM，identity and access management）政策生成方法，其由計算裝置執行，可包括：接收與政策相關的多個結構要素的輸入的步驟；基於所接收的上述輸入，顯示包括與上述多個結構要素對應的鍵-值（key-value）對的結構的步驟；將生成的上述結構輸入到第一模型中，以預測與上述結構對應的目標政策在執行時的風險度的步驟；當預測的上述風險度達到預設的閾值以上時，接收關於上述目標政策生成與否的決策的步驟；以及當預測的上述風險度低於上述閾值時，生成上述目標政策的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An identify and access management (IAM) policy generation method is performed by a computing device, and may include receiving an input for a plurality of components related to a policy, displaying a structure including key-value pairs corresponding to the plurality of components based on the received input, predicting a risk degree when a target policy corresponding to the structure is executed by inputting the generated structure to a first model, receiving a determination on whether or not the target policy is generatable when the predicted risk degree is higher than or equal to a preset threshold value, and generating the target policy when the predicted risk degree is lower than the threshold value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300、S400、S500:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="831" publication-number="202619326">
    <tif-files tif-type="multi-tif">
      <tif file="113141819.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141819</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雲服務請求處理方法和系統</chinese-title>
        <english-title>CLOUD SERVICE REQUEST PROCESSING METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L41/50</main-classification>
        <further-classification edition="200601120250203B">G06F9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴正一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOUNG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鐘萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴智秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JI SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明實施例的雲服務請求處理方法由計算裝置執行，包括如下步驟：接收與雲服務的資源相關的多個請求；將所述多個請求分配給預先創建的多個線程；使用與所述多個線程相關的信號量（semaphore）處理分配給所述多個線程中每一個的請求，同時處理分配給所述多個線程中與所述信號量的值對應的數量的線程的請求；及與所述多個請求的接收非同步地，根據所述處理結果輸出與所述多個請求中每一個對應的回應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cloud service request processing method is performed by a computing device, and may include receiving a plurality of requests related to a resource of a cloud service, assigning the plurality of requests to a plurality of threads that have been already generated, respectively, processing the requests assigned to each of the plurality of threads using a semaphore associated with the plurality of threads, the requests assigned to a number of threads corresponding to a value of the semaphore among the plurality of threads being simultaneously processed, and outputting a response corresponding to each of the plurality of requests according to a processing result, asynchronously with receiving the plurality of requests.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300、S400:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="832" publication-number="202617391">
    <tif-files tif-type="multi-tif">
      <tif file="113141907.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具同軸減速機構的直接驅動裝置</chinese-title>
        <english-title>DIRECT DRIVEN DEVICE WITH COAXIAL SPEED REDUCTION MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B25J17/02</main-classification>
        <further-classification edition="200601120241204B">F16H1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏國學校財團法人宏國德霖科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNGKUO DELIN UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡有藤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUO-TERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡有藤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUO-TERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉履新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LU-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾畇睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具速度縮減的直接驅動裝置，主要是將減速機構與直驅馬達的內外轉子合併設計，用以縮小驅動裝置體積並獲取大的扭矩輸出；該設計包括至少一擺線輪、一偏心凸輪、一內齒環及多根傳動銷，透過驅動馬達出力旋轉軸連接偏心凸輪帶動擺線輪產生行星運動，利用擺線輪與內齒環的齒數差產生旋轉位移，經由傳動銷連接輸出軸實現減速功能；將驅動馬達與減速機構合併成一體的設計，使驅動減速裝置具結構緊湊、減速比大與高扭矩輸出特性，可達成較佳的空間配置應用與降低製造成本，有利於機械手臂關節軸與結構空間受限機械的實施應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A direct driven device with speed reduction, which is mainly designed by combining the speed-reduced mechanism with the motor for reducing the structural volume and obtaining large torque output. The device is designed to include at least one cycloidal wheel, an eccentric cam, an internal gear ring, and the transmitted pins. The cycloidal wheel is driven by an eccentric cam connecting to the rotating shaft of the driven motor for generating large speed reduction. The motion of the cycloidal wheel is transmitted to the output shaft through the transmission pins fixed on the transmitted disk. The direct driven device possesses the properties, large speed reduction and high torque output, including small volume and a better assembly application in the compact spaces so that the manufacturing cost can be decreased due to the compact structural design. The high torque output and large reduction ratios are beneficial for applying the direct driven device to the shaft joints of the robot arms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:旋轉軸</p>
        <p type="p">12:轉子總成</p>
        <p type="p">13:定子總成</p>
        <p type="p">14:右軸承</p>
        <p type="p">21:偏心凸輪</p>
        <p type="p">22:擺線輪</p>
        <p type="p">221:外齒</p>
        <p type="p">223:環形孔A</p>
        <p type="p">23:內齒環</p>
        <p type="p">231:內齒</p>
        <p type="p">232:螺絲孔A</p>
        <p type="p">31:傳動盤</p>
        <p type="p">311:傳動銷</p>
        <p type="p">32:輸出軸</p>
        <p type="p">321:圓形孔C</p>
        <p type="p">33:左軸承</p>
        <p type="p">34:止推軸承</p>
        <p type="p">4:外殼座</p>
        <p type="p">41:容室</p>
        <p type="p">43:沉頭孔</p>
        <p type="p">44:環形孔D</p>
        <p type="p">5:托軸板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="833" publication-number="202616990">
    <tif-files tif-type="multi-tif">
      <tif file="113141921.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有把手之滑軌總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241204B">A47B88/90</main-classification>
        <further-classification edition="200601120241204B">A47B95/02</further-classification>
        <further-classification edition="200601220241204B">H05K7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張富田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有把手之滑軌總成，包含：一第一軌；一把手，該把手設在該第一軌之一第一面，且該把手具有一作動部；以及一扣片，該扣片設在該第一軌之一第二面，且該扣片具有一扣部及一反向該扣部之結合部，該結合部連接該作動部，當該作動部在第一狀態而帶動該扣片朝向第一位置，令該扣部為鎖定狀態，或該作動部在第二狀態而帶動該扣片朝向第二位置，令該扣部為解鎖狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:第一軌</p>
        <p type="p">11A:開口</p>
        <p type="p">13:第二面</p>
        <p type="p">14:固定部</p>
        <p type="p">15:第一橫向牆</p>
        <p type="p">16:第二橫向牆</p>
        <p type="p">17:第二樞接孔</p>
        <p type="p">20:把手</p>
        <p type="p">21:作動部</p>
        <p type="p">211:凹槽</p>
        <p type="p">212:第二孔</p>
        <p type="p">22:操作部</p>
        <p type="p">30:扣片</p>
        <p type="p">31:扣部</p>
        <p type="p">311:第一扣面</p>
        <p type="p">312:第一抵面</p>
        <p type="p">32:結合部</p>
        <p type="p">321:固定片</p>
        <p type="p">322:第一孔</p>
        <p type="p">33:抵靠部</p>
        <p type="p">34:第一樞接孔</p>
        <p type="p">40:配件</p>
        <p type="p">50:樞接件</p>
        <p type="p">60:彈性件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="834" publication-number="202616991">
    <tif-files tif-type="multi-tif">
      <tif file="113141922.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>把手及其滑軌總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241204B">A47B88/90</main-classification>
        <further-classification edition="200601120241204B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張富田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種把手及其滑軌總成，包含：一本體；一扣件，該扣件之前部位在該本體內，且該扣件之前端設有一鎖定特徵，該鎖定特徵位於該本體外；以及一切換件，該切換件活動連接該本體與該扣件，當該切換件在第一狀態而帶動該扣件朝向第一位置，則該鎖定特徵隨著該扣件而在該本體進行伸出動作，或該切換件在第二狀態而帶動該扣件朝向第二位置，則該鎖定特徵隨著該扣件而在該本體進行內縮動作。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:把手</p>
        <p type="p">11:本體</p>
        <p type="p">111:導引孔</p>
        <p type="p">112:抵靠部</p>
        <p type="p">113:支撐部</p>
        <p type="p">114:第一連接部</p>
        <p type="p">115:第二連接部</p>
        <p type="p">12:扣件</p>
        <p type="p">121:鎖定特徵</p>
        <p type="p">122:導引口</p>
        <p type="p">123:開口</p>
        <p type="p">124:容置空間</p>
        <p type="p">13:切換件</p>
        <p type="p">131:導引部</p>
        <p type="p">132:旋轉部</p>
        <p type="p">133:操作部</p>
        <p type="p">20:補強件</p>
        <p type="p">21:第一結合部</p>
        <p type="p">30:蓋體</p>
        <p type="p">31:第二結合部</p>
        <p type="p">40:彈性件</p>
        <p type="p">A:鎖定片</p>
        <p type="p">A1:導引斜面</p>
        <p type="p">C1:第一連接孔</p>
        <p type="p">C2:第二連接孔</p>
        <p type="p">D1:第一位置</p>
        <p type="p">F:導引面</p>
        <p type="p">S1:第一狀態</p>
        <p type="p">P1:第一端</p>
        <p type="p">P2:第二端</p>
        <p type="p">G:軸心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="835" publication-number="202618133">
    <tif-files tif-type="multi-tif">
      <tif file="113141986.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇</chinese-title>
        <english-title>FAN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250815B">F04D29/18</main-classification>
        <further-classification edition="200601120250815B">F04D29/00</further-classification>
        <further-classification edition="201501120250815B">F21V23/00</further-classification>
        <further-classification edition="200601120250815B">F21V33/00</further-classification>
        <further-classification edition="200601120250815B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻準精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JING-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONG-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇，包括定子組件、轉子組件及燈效組件。轉子組件與定子組件配合，並能夠相對轉子組件轉動。燈效組件包括發射器、接收器及第一發光件。其中，發射器設置於定子組件，接收器設置於轉子組件，且發射器與接收器對應設置，以使發射器能夠向接收器供電。接收器電連接於第一發光件，用以對第一發光件供電。上述風扇具有動態之燈光效果，裝飾效果較好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan that includes a stator assembly, a rotor assembly, and a lighting effect assembly. The rotor assembly is fitted with the stator assembly and can be rotated relative to the rotor assembly. The lighting effect assembly includes a transmitter, a receiver and a first light emitting element. The transmitter is arranged in the stator assembly, the receiver is arranged in the rotor assembly, and the transmitter is arranged correspondingly with the receiver, so that the transmitter can supply power to the receiver. The receiver is electrically connected to the first light emitting element to supply power to the first light emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:扇框</p>
        <p type="p">101:底板</p>
        <p type="p">102:軸套</p>
        <p type="p">11:定子</p>
        <p type="p">111:定子鐵芯</p>
        <p type="p">116:定子線圈</p>
        <p type="p">12:軸承</p>
        <p type="p">200:轉子組件</p>
        <p type="p">20:扇葉</p>
        <p type="p">21:輪轂</p>
        <p type="p">211:第一凸出部</p>
        <p type="p">212:環槽</p>
        <p type="p">22:轉子磁體</p>
        <p type="p">221:軸芯</p>
        <p type="p">222:第一凹槽</p>
        <p type="p">231:發射器</p>
        <p type="p">232:接收器</p>
        <p type="p">233:第一發光件</p>
        <p type="p">234:第二發光件</p>
        <p type="p">B:容納空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="836" publication-number="202616988">
    <tif-files tif-type="multi-tif">
      <tif file="113142033.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑軌總成</chinese-title>
        <english-title>SLIDE RAIL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241226B">A47B88/473</main-classification>
        <further-classification edition="200601120241226B">H05K7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌總成包含一第一軌、一第二軌、一彈性件以及一操作件。該第一軌包含一預定特徵；該彈性件安排至該第二軌；該操作件可相對該第二軌在一第一操作位置與一第二操作位置之間活動；當該操作件處於該第一操作位置時，該操作件與該彈性件相抵，使該第二軌相對該第一軌往一預定方向位移的過程中，該彈性件未能與該預定特徵相互阻擋，用以允許該第二軌直接越過該預定特徵；當該操作件處於該第二操作位置時，該操作件與該彈性件不再相抵，該彈性件能夠與該預定特徵相互阻擋，用以將該第二軌擋止在一工作位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A slide rail assembly includes a first rail, a second rail, a resilient member and an operating member. The first rail includes a predetermined feature. The resilient member is arranged at the second rail. The operating member is movable between a first operating position and a second operating position with respect to the second rail. When being at the first operating position, the operating member is abutted with the resilient member such that when the second rail is displaced relative to the first rail in a predetermined direction, the resilient member is not able to block with the predetermined feature for allowing the second rail to pass the predetermined feature directly. When being at the second operating position, the operating member is not abutted with the resilient member such that the resilient member is able to block with the predetermined feature for blocking the second rail at a working position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:滑軌總成</p>
        <p type="p">22:第一軌</p>
        <p type="p">22a,24a,26a:第一端</p>
        <p type="p">22b,24b,26b:第二端</p>
        <p type="p">24:第二軌</p>
        <p type="p">26:第三軌</p>
        <p type="p">60:延伸件</p>
        <p type="p">74:復歸彈性件</p>
        <p type="p">76:按鈕</p>
        <p type="p">80:第一殼體</p>
        <p type="p">82:第二殼體</p>
        <p type="p">96:輔助孔</p>
        <p type="p">L1:第一側</p>
        <p type="p">L2:第二側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="837" publication-number="202618533">
    <tif-files tif-type="multi-tif">
      <tif file="113142048.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用戶介面錯誤顯示方法及其系統</chinese-title>
        <english-title>METHOD FOR DISPLAYING USER INTERFACE ERRORS AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250213B">G06F3/048</main-classification>
        <further-classification edition="200601120250213B">G06F11/30</further-classification>
        <further-classification edition="202501120250213B">G06F11/36</further-classification>
        <further-classification edition="202401120250213B">G06Q10/08</further-classification>
        <further-classification edition="202301120250213B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張如然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JOO RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞盛具</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SUNG GU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅友哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YOO CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪成慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SYUNG GYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係有關於UI錯誤顯示方法及其裝置。具體而言，係有關於監測用戶終端以檢測用戶終端上的用戶介面（UI，User Interface）錯誤並顯示與錯誤相關的資訊的方法及其裝置。根據本揭露的一實施例，提供一種UI錯誤顯示方法，包括：向用戶終端的應用程式發送用於執行第一更新的第一資料的步驟，利用上述應用程式中顯示的第一微件的樹結構，檢測上述第一微件的錯誤的步驟，過濾上述錯誤是否與第一資料相關的步驟，在管理員終端上顯示與上述過濾的錯誤相關的資訊的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for displaying user interface (UI) errors and an apparatus thereof. Specifically, the present disclosure relates to a method for detecting user interface (UI) errors in a user terminal by monitoring the user terminal and displaying information related to the errors, and an apparatus thereof. According to an exemplary embodiment of the present disclosure, provided is a method for displaying user interface (UI) errors, the method including transmitting first data for performing a first update to an application of a user terminal; detecting an error for a first widget by using a tree structure of the first widget displayed in the application; filtering whether the error is related to the first data; and displaying information related to the filtered error on an administrator terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S210、S220、S300、S400、S500、S600、S700:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="838" publication-number="202619350">
    <tif-files tif-type="multi-tif">
      <tif file="113142103.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以管理屬於賬戶之設定檔之裝置、方法及記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR MANAGING PROFILE IN ACCOUNT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250401B">H04N21/25</main-classification>
        <further-classification edition="201101120250401B">H04N21/254</further-classification>
        <further-classification edition="201101120250401B">H04N21/258</further-classification>
        <further-classification edition="201101120250401B">H04N21/654</further-classification>
        <further-classification edition="201101120250401B">H04N21/6547</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂彩蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, CHAERYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置之處理器能夠以如下方式構成：產生屬於平台服務之一賬戶之設定檔，將請求設定可藉由上述設定檔視聽上述平台服務之內容之視聽限制時間之第1請求傳輸至與上述設定檔對應之第1用戶終端，隨著獲得與上述第1請求對應之第1響應，基於上述第1響應而設定對上述設定檔之上述視聽限制時間，於上述設定檔之累積視聽時間達到上述視聽限制時間之情形時，中斷藉由上述設定檔利用上述平台服務之內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="839" publication-number="202619047">
    <tif-files tif-type="multi-tif">
      <tif file="113142190.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合的邏輯元件和記憶體元件的半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INTEGRATING LOGIC ELEMENT AND MEMORY ELEMENET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250219B">H01L23/13</main-classification>
        <further-classification edition="202301120250219B">H10B43/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林君明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林君明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種整合邏輯元件和記憶體元件的半導體結構。半導體結構包括基板、邏輯元件及記憶體元件。基板具有第一區及與第一區橫向相鄰的第二區。邏輯元件設置於基板的第一區，且記憶體元件設置於基板的第二區。邏輯元件包括多個電晶體。記憶體元件包括上電極、下電極及設置於上電極和下電極之間的介電層。下電極包括第一金屬層及第一磷銅合金層，且第一磷銅合金層沿第一金屬層的輪廓延伸以包圍第一金屬層。上電極包括第二金屬層及第二磷銅合金層，且第二磷銅合金層沿第二金屬層的輪廓延伸以包圍第二金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor structure integrating a logic element and a memory element. The semiconductor structure includes a substrate, the logic element, and the memory element. The substrate has a first region and a second region laterally adjacent to the first region. The logic element is disposed in the first region of the substrate, and the memory element is disposed in the second region of the substrate. The logic element includes a plurality of transistors. The memory element includes an upper electrode, lower electrode, and a dielectric layer disposed between the upper electrode and the lower electrode. The lower electrode includes a first metal layer and a first copper-phosphorous alloy layer, and the first copper-phosphorous alloy layer extends along a contour of the first metal layer so as to surround the first metal layer. The upper electrode includes a second metal layer and a second copper-phosphorous alloy layer, and the second copper-phosphorous alloy layer extends along a contour of the second metal layer so as to surround the second metal layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">110:基板</p>
        <p type="p">110A:第一區</p>
        <p type="p">110B:第二區</p>
        <p type="p">112:晶圓層</p>
        <p type="p">114:磊晶層</p>
        <p type="p">120:邏輯元件</p>
        <p type="p">123:通道</p>
        <p type="p">124:閘極結構</p>
        <p type="p">130:記憶體元件</p>
        <p type="p">132:下電極</p>
        <p type="p">133:上電極</p>
        <p type="p">138:淺溝槽隔離結構</p>
        <p type="p">121A,121B:N型高摻雜區</p>
        <p type="p">122A,122B:N型低摻雜區</p>
        <p type="p">134,135:介電層</p>
        <p type="p">125A,125B,125C:導電插塞</p>
        <p type="p">1241:高介電常數層</p>
        <p type="p">1242:多晶矽層</p>
        <p type="p">1251:阻障層</p>
        <p type="p">1252:磷銅合金層</p>
        <p type="p">1253:電極金屬層</p>
        <p type="p">1321,1331:金屬層</p>
        <p type="p">1321A,1331A:突出部</p>
        <p type="p">1322,1332:磷銅合金層</p>
        <p type="p">1323,1333:阻障層</p>
        <p type="p">B:區域</p>
        <p type="p">NW1:N型井</p>
        <p type="p">PW1:P型井</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="840" publication-number="202617928">
    <tif-files tif-type="multi-tif">
      <tif file="113142196.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種彈性材料及其製備方法和揚聲器、電子設備</chinese-title>
        <english-title>A ELASTIC MATERIAL AND PREPARATION METHOD THEREOF, SPEAKER AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C09K5/14</main-classification>
        <further-classification edition="200601120250501B">G10K11/162</further-classification>
        <further-classification edition="200601120250501B">G10K11/165</further-classification>
        <further-classification edition="200601120250501B">H04R1/02</further-classification>
        <further-classification edition="200601120250501B">H04R1/28</further-classification>
        <further-classification edition="200601120250501B">H04R9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商美特科技（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERRY ELECTRONICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬華明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, HUAMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅明亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MINGYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程國威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, GUOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種彈性材料及其製備方法和揚聲器、電子設備。所述彈性材料包括承載基材，以及設置於所述承載基材孔隙內部的奈米材料和分子篩；所述彈性材料中所述承載基材的含量為97~99wt%；所述奈米材料和分子篩的質量比為1:0.9~1.1。本發明所述彈性材料具有較大的比表面積，能夠有效吸收噪音，將聲能耗散，提高其減振降噪的功效；並且透過奈米材料和分子篩的負載，提高了電子設備的屏蔽性和訊號輸出品質，解決了電子設備散熱不及時而導致的降低使用壽命的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is an elastic material and preparation method thereof, speaker and electronic device. The elastic material comprises a carrier substrate, a nanomaterial and a molecular sieve disposed in the pores of the carrier substrate. The content of the carrier substrate of the elastic material is 97~99wt%. The mass ratio of the nanomaterial and the molecular sieve is 1:0.9~1.1. The elastic material has large specific surface area to effectively absorb noise, dissipate sound energy and improve the effect of vibration and noise reduction. By disposing the nanomaterial and the molecular sieve, the shielding properties and the signal output quality of the electronic device is improved. The problem of reduced service life in electronic device caused by delayed heat dissipation is solved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="841" publication-number="202617092">
    <tif-files tif-type="multi-tif">
      <tif file="113142273.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>估計血流動力能量參數的方法與系統及電腦可讀介質</chinese-title>
        <english-title>METHOD AND SYSTEM FOR ESTIMATING ENERGETIC HEMODYNAMIC PARAMETERS AND COMPUTER READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">A61B8/00</main-classification>
        <further-classification edition="200601120250203B">A61B8/06</further-classification>
        <further-classification edition="200601120250203B">A61B8/04</further-classification>
        <further-classification edition="200601120250203B">A61B8/08</further-classification>
        <further-classification edition="200601120250203B">A61B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭浩民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HAO-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王雋之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIUN-JR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭耿璽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, GENG-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊紹源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, SHAO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種估計血流動力能量參數的方法，包含超音波裝置從對象取得血管直徑及血流波形，取得該對象的一血流速度，處理器提供該對象的一體積流率、一脈波傳播速率（PWV）及一血壓波形，及處理器根據該血管直徑、該血流波形、該血流速度、該體積流率、該脈波傳播速率（PWV）及該血壓波形取得該血流動力能量參數。該超音波裝置具有一超音波探頭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for estimating energetic hemodynamic parameters includes an ultrasound device obtaining a vascular diameter and a blood flow waveform from a subject, obtaining a blood flow velocity of the subject, a processor providing a volumetric flow rate, a pulse wave velocity (PWV), and a blood pressure waveform of the subject, and the processor obtaining the energetic hemodynamic parameters according to the vascular diameter, the blood flow waveform, the blood flow velocity, the volumetric flow rate, the pulse wave velocity (PWV), and the blood pressure waveform. The ultrasound device includes an ultrasound probe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101-S102、S201-S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="842" publication-number="202618527">
    <tif-files tif-type="multi-tif">
      <tif file="113142458.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控驅動裝置及其操作方法</chinese-title>
        <english-title>TOUCH DRIVING DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250213B">G06F3/041</main-classification>
        <further-classification edition="201301120250213B">G06F3/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉奕德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, I-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古智崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種觸控驅動裝置及其操作方法。觸控驅動裝置使用發送矩陣去驅動觸控板的多條發送電極。觸控驅動裝置包括第一驅動電路以及第二驅動電路。在同一個期間，第一驅動電路使用發送矩陣的第一發送子矩陣去驅動這些發送電極中的第一發送電極群，以及第二驅動電路使用發送矩陣的第二發送子矩陣去驅動這些發送電極中的第二發送電極群。觸控驅動裝置從觸控板的多條接收電極讀取發送矩陣所對應的感測結果矩陣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a touch driving device and an operating method thereof. The touch driving device uses a transmitting matrix to drive multiple transmitting electrodes of a touch panel. The touch driving device includes a first driving circuit and a second driving circuit. During a same period, the first driving circuit uses a first transmitting sub-matrix of the transmitting matrix to drive a first transmitting electrode group of the transmitting electrodes, and the second driving circuit uses a second transmitting sub-matrix of the transmitting matrix to drive a second transmitting electrode group of the transmitting electrodes. The touch driving device reads a sensing result matrix corresponding to the transmitting matrix from multiple receiving electrodes of the touch panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="843" publication-number="202619259">
    <tif-files tif-type="multi-tif">
      <tif file="113142510.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換電路之控制方法及其控制器</chinese-title>
        <english-title>CONTROL METHOD AND CONTROLLER FOR POWER SUPPLY CONVERSION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">H02M3/335</main-classification>
        <further-classification edition="200601120250526B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商光寶電子（廣州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON ELECTRONICS (GUANGZHOU) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉會峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種電源轉換電路控制方法及其控制器。根據一誤差值而計算出一第一頻率。根據該第一頻率與一間歇模式設定頻率，控制一脈衝寬度調變模組產生一開關信號。根據該第一頻率是否高於該間歇模式設定頻率，產生一周期計數值。根據該周期計數值與一既定周期數，確定是否傳送一指令信號至該脈衝寬度調變模組，該脈衝寬度調變模組接收該指令信號後發出一個周期的該開關信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application discloses a control method and a controller for a power supply conversion circuit. A first frequency is calculated based on an error value. Using the first frequency and a burst mode setting frequency, a pulse width modulation (PWM) module generates a switch signal. Depending on whether the first frequency is higher than the burst mode setting frequency, a cycle count value is generated. Based on the cycle count value and a predetermined number of cycles, it is determined whether to send a command signal to the PWM module, and after receiving the command signal, the PWM module generates a cycle of the switch signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:控制器</p>
        <p type="p">110:電源開關</p>
        <p type="p">210:誤差類比數位轉換器</p>
        <p type="p">220:開關頻率計算模組</p>
        <p type="p">230:間歇模式控制模組</p>
        <p type="p">240:開關周期計數模組</p>
        <p type="p">250:脈衝寬度調變模組</p>
        <p type="p">260:開關周期計數調整模組</p>
        <p type="p">f1:第一頻率</p>
        <p type="p">S1:指令信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="844" publication-number="202618221">
    <tif-files tif-type="multi-tif">
      <tif file="113142657.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於掃描繞射之疊加散射測量</chinese-title>
        <english-title>SCANNING DIFFRACTION-BASED OVERLAY SCATTEROMETRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">G01B11/27</main-classification>
        <further-classification edition="200601120260124B">G02B5/18</further-classification>
        <further-classification edition="200601120260124B">G02B26/10</further-classification>
        <further-classification edition="200601120260124B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃夫曼　亞隆　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLFMAN, ALON ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>居徳　伊泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GDOR, ITAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加隆　伊芙塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALON, IFTACH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科普里維卡　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOPRIVICA, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法琪妮　優娜塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAKNIN, YONATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朗維司基　維拉得摩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVINSKI, VLADIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維斯　雅妮維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISS, YANIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路巴希福斯基　尤法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUBASHEVSKY, YUVAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼葛瑞　戴瑞亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGRI, DARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉納渥克　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHINOVKER, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種疊加計量系統，其包含通信地耦合至一第一光偵測器及一第二光偵測器之一控制器。該控制器可經組態以在掃描一疊加目標時自該第一及第二光偵測器接收一或多個信號。該疊加目標可包含複數個測量單元，其中各測量單元包含一光柵疊光柵結構，該光柵疊光柵結構包含一重疊區域中之位於一樣本之一第一層上之一第一層光柵特徵及位於該樣本之一第二層上之一第二層光柵特徵。該第一層光柵特徵及該第二層光柵特徵可具有一共同節距。該控制器可經進一步組態以判定用於該複數個測量單元之各測量單元之該第一光偵測器與該第二光偵測器之間的一或多個差動信號且基於該判定之一或多個差動信號來判定一疊加測量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An overlay metrology system includes a controller communicatively coupled to a first photodetector and a second photodetector. The controller may be configured to receive one or more signals from the first and second photodetector as an overlay target is scanned. The overlay target may include a plurality of measurement cells, where each measurement cell includes a grating-over-grating structure including a first-layer grating feature on a first layer of a sample and a second-layer grating feature on a second layer of the sample in an overlapping region. The first-layer grating feature and the second-layer grating feature may have a common pitch. The controller may be further configured to determine one or more differential signals between the first photodetector and the second photodetector for each measurement cell of the plurality of measurement cells and determine an overlay measurement based on the determined one or more differential signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502:步驟</p>
        <p type="p">504:步驟</p>
        <p type="p">506:步驟</p>
        <p type="p">508:步驟</p>
        <p type="p">510:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="845" publication-number="202618579">
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      <tif file="113142662.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相關搜尋字詞顯示方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR RELATED SEARCH TERMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250203B">G06F16/33</main-classification>
        <further-classification edition="201901120250203B">G06F16/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李大洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴賢珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露一實施例的相關搜尋字詞顯示方法透過計算裝置執行，包括如下步驟：識別在第一搜尋字詞的搜尋結果頁面或透過該搜尋結果頁面可連接的頁面中執行的使用者的行為是否滿足相關搜尋字詞顯示條件；和如果識別為滿足相關搜尋字詞顯示條件，則顯示與該第一搜尋字詞不同的第二搜尋字詞，該相關搜尋字詞顯示條件是根據該使用者的行為預先設置的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment of the present disclosure, a related search term display method is executed by a computing device and includes the following steps: identifying whether user behavior performed on a search result page for a first search term, or on a page accessible through the search result page, satisfies a related search term display condition; and, if identified as satisfying the related search term display condition, displaying a second search term different from the first search term, wherein the related search term display condition is preset based on the user behavior.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1110、S1120、S1130、S1140:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="846" publication-number="202618644">
    <tif-files tif-type="multi-tif">
      <tif file="113142668.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管理用戶資料之電子裝置、方法及記錄媒體</chinese-title>
        <english-title>ELECTRONIC APPARATUS, METHOD AND RECORDING MEDIUM FOR MANAGING USER DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250502B">G06Q30/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托恩布拉德　艾瑞克　阿克塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOERNBLAD, ERIK AXEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴景妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYUNGYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；且上述電子裝置能夠以如下方式構成，即，於藉由上述處理器而執行上述命令時，上述一個以上之處理器如下：自終端獲得對用戶資料之存取請求，上述存取請求包括API請求；確認上述存取請求中包括之識別資訊；基於上述存取請求中包括之識別資訊，選擇性地存取第1儲存庫或第2儲存庫中之任一儲存庫來提取上述用戶資料；將提取之上述用戶資料傳輸至上述終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S410:步驟</p>
        <p type="p">S420:步驟</p>
        <p type="p">S430:步驟</p>
        <p type="p">S440:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="847" publication-number="202618660">
    <tif-files tif-type="multi-tif">
      <tif file="113142747.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142747</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供體育資訊之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM FOR PROVIDING SPORT INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250502B">G06Q50/00</main-classification>
        <further-classification edition="202301120250502B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂彩蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, CHAERYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之方法可包括如下步驟，即，一個以上之處理器如下：基於體育服務平台中之用戶之第1日誌資訊或其他用戶之第2日誌資訊中之至少一者，確定顯示於頁面中之下拉式選單之激活狀態下顯示之項目目錄、及項目目錄中之於下拉式選單之禁用狀態下顯示之第1項目；確定於頁面中與第1項目結合顯示之語句；確定與第1項目及語句對應之第1視訊；及向終端傳輸頁面資訊，該頁面資訊係用於在用戶之終端上顯示頁面且包括項目目錄、第1項目、語句或第1視訊中之至少一者之資訊者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:伺服器</p>
        <p type="p">120:用戶終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="848" publication-number="202619311">
    <tif-files tif-type="multi-tif">
      <tif file="113142754.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基於有線電纜資料服務介面規範之乙太被動光纖網路系統的配置方法、文件轉化伺服器及多戶單元</chinese-title>
        <english-title>CONFIGURATION METHOD FOR DOCSIS PROVISIONING OF EPON, FILE CONVERSION SERVER AND MULTI-DWELLING UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260114B">H04B10/25</main-classification>
        <further-classification edition="202201120260114B">H04L41/08</further-classification>
        <further-classification edition="202201120260114B">H04L67/565</further-classification>
        <further-classification edition="200601120260114B">H04L12/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲琦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITRON TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李楚鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種文件轉化伺服器包含一通訊單元、一儲存單元及一處理單元。該處理單元根據一待配置住戶識別資訊獲得至少一筆待配置使用者識別資訊，並傳送一配置文件請求至一配置文件伺服器，以獲得至少一待配置文件，並將該至少一待配置文件轉化為一整合配置文件並經由傳送至一調製解調模組，以使該調製解調模組將該整合配置文件進行格式轉換以獲得轉換後整合配置文件並傳送至一待配置多戶單元，進而使該待配置多戶單元根據該轉換後整合配置文件中對應於該至少一待配置文件的至少一待配置部分對該待配置多戶單元下所歸屬的至少一用戶終端進行配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A file conversion server includes a communication unit, a storage unit and a processing unit. The processing unit obtains at least one user identification information to be configured based on a dwelling identification information to be configured, and sends a configuration file request to a configuration file server to obtain at least one file to be configured and, converts the at least one to be configured file into an integrated configuration file and transmits to a modem module, so that the modem module converts the format of the integrated configuration file to a converted integrated configuration file and transmits to a multi-dwelling unit to be configured, thereby the multi-dwelling unit to be configured configuring at least one user terminal belonging to the multi-dwelling unit to be configured based on at least one to-be-configured part corresponding to the at least one file to be configured in the converted integrated configuration file.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配置文件伺服器</p>
        <p type="p">2:文件轉化伺服器</p>
        <p type="p">21:通訊單元</p>
        <p type="p">22:儲存單元</p>
        <p type="p">23:處理單元</p>
        <p type="p">3:光線路終端</p>
        <p type="p">31:調製解調模組</p>
        <p type="p">4:多戶單元</p>
        <p type="p">41:通訊模組</p>
        <p type="p">42:處理模組</p>
        <p type="p">5:用戶終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="849" publication-number="202619458">
    <tif-files tif-type="multi-tif">
      <tif file="113142824.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水箱及冷卻系統</chinese-title>
        <english-title>WATER TANK AND COOLING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹金翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宗麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TSUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁昱嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白家南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, CHIA-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種水箱及冷卻系統，水箱包括箱體與調節件，箱體包括平衡腔、儲液腔、第一入口、第一出口、第二入口及第二出口，平衡腔與儲液腔相互分隔，第一入口與第一出口均連通平衡腔，第二入口與第二出口均連通儲液腔，系統儲液罐中之冷卻液能藉由第一入口進入平衡腔，儲液腔藉由第二入口接收並存儲已冷卻之冷卻液。調節件設於箱體並連通平衡腔與箱體之外界。具有上述水箱之冷卻系統能藉由調節件調節平衡腔中之壓力，使平衡腔、系統儲液罐及箱體外界之間之壓力保持平衡，箱體不會受熱膨脹或者受冷收縮，水箱之可靠性較高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a water tank and cooling system, the water tank comprising a box body and a regulating element, the box body comprising a balance chamber, a liquid storage chamber, a first inlet, a first outlet, a second inlet, and a second outlet, the balance chamber and the liquid storage chamber are separated from each other, the first inlet and the first outlet are both connected to the balance chamber, and the second inlet and the second outlet are both connected to the liquid storage chamber. The cooling liquid in the system storage tank can enter the balance chamber through the first inlet, and the liquid storage chamber receives and stores the cooled cooling liquid through the second inlet. The adjusting component is located in the box and connects the balance chamber with the outside of the box. The cooling system with the above-mentioned water tank can adjust the pressure in the balance chamber through regulating components, so that the pressure between the balance chamber, system storage tank, and the outside of the box is balanced. The box will not expand or contract due to heat, and the reliability of the water tank is high.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:吸嘴</p>
        <p type="p">11:基座</p>
        <p type="p">12:內環</p>
        <p type="p">13:內環</p>
        <p type="p">14:內環</p>
        <p type="p">20:吸頭</p>
        <p type="p">210:配合部</p>
        <p type="p">220:吸附部</p>
        <p type="p">230:彈性件</p>
        <p type="p">240:彈性件</p>
        <p type="p">250:彈性件</p>
        <p type="p">300:物料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="850" publication-number="202618661">
    <tif-files tif-type="multi-tif">
      <tif file="113142863.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618661</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供體育資訊之方法、裝置及記錄媒體</chinese-title>
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR PROVIDING SPORT INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250709B">G06Q50/00</main-classification>
        <further-classification edition="200601120250709B">G06F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂彩蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, CHAERYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之方法可包括如下步驟，即，一個以上之處理器如下：接收用戶對體育服務平台之第1頁面之連接請求；根據連接請求而獲得比賽資訊；基於比賽資訊來產生第1頁面資訊，該第1頁面資訊係用於將表示比賽資訊之第1頁面顯示於用戶之終端上；及向終端傳輸第1頁面資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:伺服器</p>
        <p type="p">120:用戶終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="851" publication-number="202618583">
    <tif-files tif-type="multi-tif">
      <tif file="113142864.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>商品篩選條件的曝光方法、商品資訊提供系統及用戶終端</chinese-title>
        <english-title>METHOD FOR EXPOSURING PRODUCT FILTERING CONDITIONS, SYSTEM FOR PROVIDING PRODUCT INFORMATION, AND USER TERMINAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250210B">G06F16/953</main-classification>
        <further-classification edition="200601120250210B">G06F17/40</further-classification>
        <further-classification edition="202301120250210B">G06Q30/02</further-classification>
        <further-classification edition="202401120250210B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權希正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HEE JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴賢珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種商品篩選條件的曝光方法。根據本揭露的一實施例的商品篩選條件的曝光方法，可包括：接收來自用戶終端的查詢關鍵字（query keyword）的步驟，生成用於構建包括與上述查詢關鍵字對應的商品資訊的搜索結果頁面（SRP，Search Results Page）的資料的步驟，以及將用於構建上述SRP的資料發送至上述用戶終端的步驟。其中，上述SRP的至少一部分可以是篩選條件選擇區域，上述篩選條件選擇區域可包括與上述查詢關鍵字對應的商品的第一屬性中包括的多個屬性類型各自對應的篩選按鍵的第一屬性篩選區域，在上述篩選按鍵中，第一按鍵所顯示的區域的基準距離以內可顯示已定義的示能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a method for exposing product filtering conditions. The method may include receiving a query keyword from a user terminal, generating data for constituting a search results page (SRP) including information on a product corresponding to the query keyword, and transmitting the data for constituting the SRP to the user terminal. Here, at least a portion of the SRP may be a filtering condition selection area, the filtering condition selection area may include a first attribute filter area including filter buttons corresponding to each of a plurality of attribute types included in a first attribute of the product corresponding to the query keyword, and a predefined affordance may be displayed within a reference distance of an area where a first button of the filter buttons is displayed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">61:第一屬性篩選區域</p>
        <p type="p">62:第二屬性篩選區域</p>
        <p type="p">62-1:長袖篩選按鍵</p>
        <p type="p">63:第三屬性篩選區域</p>
        <p type="p">63-2:黑色篩選按鍵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="852" publication-number="202618825">
    <tif-files tif-type="multi-tif">
      <tif file="113143031.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光按鍵</chinese-title>
        <english-title>ILLUMINATED KEY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01H13/14</main-classification>
        <further-classification edition="200601120241231B">H01H13/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊創樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHUANG, CHUANG-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾智慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, ZHI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡磊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LEI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光按鍵，包括整合結構、按鍵底板及按鍵結構。整合結構包括薄膜層、背光元件及間隔層。薄膜層的下表面上設有彼此分離的第一導電圖案及第二導電圖案。背光元件設置在薄膜層下方。背光元件的上表面上設有對應第一導電圖案及第二導電圖案的導電墊，第一導電圖案、第二導電圖案及導電墊構成按鍵開關，背光元件為導光板或燈板。間隔層設置在薄膜層與背光元件之間。按鍵底板設置在整合結構上方，並具有開口。按鍵結構設置在按鍵底板上方，並具有彈性件設置在按鍵底板的開口內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An illuminated key includes an integrated structure, a base plate and a key structure. The integrated structure includes a membrane layer, a backlight component and a spacer layer. A lower surface of the membrane layer is provided with a first conductive pattern and a second conductive pattern that are separated from each other. The backlight component is disposed beneath the membrane layer. An upper surface of the backlight component is provided with a conductive pad corresponding to the first conductive pattern and the second conductive pattern, and the first conductive pattern, the second conductive pattern and the conductive pad constitute a key switch, and the backlight component is a light guide plate or a light board. The spacer layer is disposed between the membrane layer and the backlight component. The base plate is disposed over the integrated structure and has an opening. The key structure is disposed over the base plate and has an elastic member disposed in the opening of the base plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:整合結構</p>
        <p type="p">111:薄膜層</p>
        <p type="p">112:背光元件</p>
        <p type="p">1121:導電墊</p>
        <p type="p">113:間隔層</p>
        <p type="p">114:光反射層</p>
        <p type="p">120:按鍵底板</p>
        <p type="p">120a:開口</p>
        <p type="p">130:按鍵結構</p>
        <p type="p">131:彈性件</p>
        <p type="p">132:鍵帽</p>
        <p type="p">133:剪刀式連接元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="853" publication-number="202618577">
    <tif-files tif-type="multi-tif">
      <tif file="113143125.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於搜索關鍵字的ＳＫＵ聚類方法和裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR SKU CLUSTERING BASED ON SEARCH KEYWORDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蒙森　內森　席尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMONSON, NATHAN SYDNEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昌達　德利普庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDAR, DELEEEPKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一實施例的SKU聚類方法由計算裝置執行，包括如下步驟：設置對多個關鍵字進行分類的多個簇的數量；將多個關鍵字相關資訊和所述多個簇的數量輸入到第一模型，以將所述多個關鍵字中的每一個映射到所述多個簇中的一個；識別與第一SKU所屬類別及所述第一SKU所屬類別對應的關鍵字；根據與第一SKU所屬類別對應的關鍵字，將第一SKU映射到所述多個簇中的一個；及根據映射結果預測所述第一SKU的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment of the present invention, a SKU clustering method performed by a computing device comprises the following steps: setting the number of multiple clusters for classifying multiple keywords; inputting information related to the multiple keywords and the number of clusters into a first model to map each of the multiple keywords to one of the clusters; identifying the category to which the first SKU belongs and the keywords corresponding to the category of the first SKU; mapping the first SKU to one of the clusters based on the keywords corresponding to the category of the first SKU; and predicting the demand for the first SKU based on the mapping result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1010、S1020、S1030、S1040、S1050:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="854" publication-number="202618632">
    <tif-files tif-type="multi-tif">
      <tif file="113143292.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>篩選器顯示方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR DISPLAYING FILTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06Q10/08</main-classification>
        <further-classification edition="202301120250203B">G06Q30/06</further-classification>
        <further-classification edition="201301120250203B">G06F3/048</further-classification>
        <further-classification edition="200601120250203B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權希正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HEE JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴賢珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李大洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示與商品搜尋相關的篩選器的方法。根據一些實施例的篩選器顯示方法透過計算裝置執行，可以包括如下步驟：接收與商品搜尋相關的查詢；獲取每個類別的篩選器列表，該每個類別的篩選器列表用於篩選基於該查詢搜尋到的商品列表；顯示基於每個類別的優先順序排列的多個類別；和在該多個類別中，顯示選擇的特定類別所包括的至少一個篩選器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for displaying a filter related to product search. A method for displaying a filter performed by a computing device according to some exemplary embodiments may include: receiving a query related to product search; obtaining a list of filters for each category used to filter a list of products searched based on the query; displaying a plurality of categories sorted based on a priority of each category; and displaying at least one filter included in a selected specific category among the plurality of categories.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:使用者終端</p>
        <p type="p">220:服務伺服器</p>
        <p type="p">230:儲存器</p>
        <p type="p">S810、S820、S830、S840:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="855" publication-number="202618584">
    <tif-files tif-type="multi-tif">
      <tif file="113143315.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>站點地圖生成方法及其系統</chinese-title>
        <english-title>SITEMAP GENERATION METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250109B">G06F16/953</main-classification>
        <further-classification edition="201901120250109B">G06F16/955</further-classification>
        <further-classification edition="201301120250109B">G06F21/64</further-classification>
        <further-classification edition="202301120250109B">G06Q30/0601</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YAOZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張來梁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LAILIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的實施例的站點地圖生成方法由計算裝置執行，包括如下步驟：生成第一文檔，該第一文檔包含所生成的與目標服務相關的第一多個URL（uniform resource locator）；將所述第一文檔上傳至第一檔夾；驗證所述第一文檔中包含的所述第一多個URL的有效性；生成第二文檔，該第二文檔包含所述第一多個URL的有效性驗證結果、被判斷為有效的第二多個URL；及將所述第二文檔上傳至第二檔夾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sitemap generation method according to an exemplary embodiment of the present disclosure is performed by a computing device and may include: generating a first document including a first plurality of uniform resource locators (URLs) generated in relation to a target service; uploading the first document to a first folder; verifying validity of the first plurality of URLs included in the first document; generating a second document including a second plurality of URLs determined to be valid as a result of verifying the validity of the first plurality of URLs; and uploading the second document to a second folder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300、S400、S500:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="856" publication-number="202618641">
    <tif-files tif-type="multi-tif">
      <tif file="113143384.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618641</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於購買排名的商品顯示方法及系統</chinese-title>
        <english-title>PURCHASE RANKING BASED PRODUCT DISPLAY METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250213B">G06Q30/02</main-classification>
        <further-classification edition="202301120250213B">G06Q30/06</further-classification>
        <further-classification edition="200601120250213B">G06F17/40</further-classification>
        <further-classification edition="201301120250213B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權希正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HEE JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴賢珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露一實施例的基於購買排名的商品顯示方法由計算裝置執行，可以包括如下步驟：渲染用於顯示與使用者輸入的搜尋字詞對應的多個商品的搜尋結果頁面；回應於使用者對於該搜尋結果頁面上的第一區域的選擇，根據購買排名對該搜尋結果頁面顯示的多個商品進行排列；反映該排列的結果，根據購買排名在該搜尋結果頁面上顯示該多個商品；和顯示根據該購買排名顯示的多個商品各自的購買排名。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A purchase ranking based product display method according to an exemplary embodiment of the present disclosure is performed by a computing device and may include: rendering a search results page for displaying a plurality of products corresponding to a search term entered by a user; sorting the plurality of products displayed on the search results page according to purchase rankings in response to a selection of a user for a first area on the search results page; displaying the plurality of products according to the purchase rankings on the search results page by reflecting the sorting results; and displaying a purchase ranking of each of the plurality of products displayed according to the purchase rankings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110、S120、S130、S140:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="857" publication-number="202618623">
    <tif-files tif-type="multi-tif">
      <tif file="113143682.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>實驗設備管控方法、伺服器及儲存介質</chinese-title>
        <english-title>METHOD FOR MANAGING EXPERIMENTAL EQUIPMENT, SERVER, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250602B">G06Q10/00</main-classification>
        <further-classification edition="202201120250602B">H04L67/125</further-classification>
        <further-classification edition="202201120250602B">H04L67/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏聚波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, JU-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及設備管控技術領域，提供一種實驗設備管控方法、伺服器及儲存介質。實驗設備管控方法包括：載入實驗設備的配置資訊；根據實驗設備的配置資訊，與實驗設備建立通訊連接；採集實驗設備的第一資訊；獲取實驗樣品的第二資訊，其中實驗樣品對應實驗設備；將第一資訊與第二資訊關聯，獲得關聯資訊；及根據關聯資訊執行預設操作。本發明能夠對實驗設備和實驗資訊進行有效管控。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to a field of equipment management and control technology, and provides a method for managing experimental equipment, a server, and a storage medium. The method for managing experimental equipment includes: loading configuration information of the experimental equipment; establishing a communication connection with the experimental equipment according to the configuration information of the experimental equipment; collecting first information of the experimental equipment; obtaining second information of experimental samples, where the experimental samples correspond to the experimental equipment; associating the first information with the second information to obtain associated information; and performing a predetermined operation based on the associated information. The invention can effectively manage experimental equipment and experimental information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201~206:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="858" publication-number="202618528">
    <tif-files tif-type="multi-tif">
      <tif file="113143765.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控控制裝置、觸控系統及震動控制方法</chinese-title>
        <english-title>TOUCH CONTROL DEVICE, TOUCH SYSTEM AND VIBRATION CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250212B">G06F3/041</main-classification>
        <further-classification edition="201301120250212B">G06F3/0354</further-classification>
        <further-classification edition="201301120250212B">G06F3/0487</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯志陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, CHIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控控制裝置，應用於具有觸控面板之觸控裝置。觸控控制裝置包括一觸控控制電路，耦接於該觸控面板，用以根據來自主動筆之筆尖部之筆尖信號判斷出筆尖部的座標位置以及根據來自主動筆之筆環部之筆環信號判斷出主動筆之筆環部的座標位置；以及一處理電路，耦接於觸控控制電路，用以根據筆尖部的座標位置及筆環部的座標位置判斷出使用情境並產生對應於所判斷出使用情境之震動強度設定資訊，其中震動強度設定資訊經提供至主動筆以執行震動操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch control device, applied in a touch device with a touch panel, comprising a touch control circuit, coupled to the touch panel, and configured to determine a coordinate position of a tip section of an active stylus pen according to a tip signal from the tip section and a coordinate position of the ring section of the active stylus pen according to the ring signal from the ring section; and a processing circuit, coupled to the touch control circuit and configured to determine a usage scenario according to the coordinate position of the tip section and the coordinate position of the ring section and generate vibration strength setting information corresponding to the determined usage scenario, wherein the vibration strength setting information is provided to the active stylus pen for performing vibration operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S300,S302,S304,S306:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="859" publication-number="202617882">
    <tif-files tif-type="multi-tif">
      <tif file="113143932.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143932</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物及其製品</chinese-title>
        <english-title>RESIN COMPOSITION AND ARTICLE MADE THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">C08L71/12</main-classification>
        <further-classification edition="202501120250102B">C08L23/26</further-classification>
        <further-classification edition="200601120250102B">C08L25/02</further-classification>
        <further-classification edition="200601120250102B">C08J5/18</further-classification>
        <further-classification edition="200601120250102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商台光電子材料（昆山）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉迪雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈一凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組合物，包括：成分(A)：100重量份的含不飽和碳碳雙鍵的聚苯醚樹脂；成分(B)：1重量份至20重量份的未氫化的馬來酸酐改性第一聚烯烴；以及成分(C)：5重量份至100重量份的苯并環丁烯改性第二聚烯烴。此外，本發明還提供一種由上述樹脂組合物製成的製品，其包括：半固化片、樹脂膜、積層板或印刷電路板，且其在BC拉力穩定性、錫球推力、玻布與樹脂界面縫隙、漂錫爆板率的一個或多個方面得到改善。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a resin composition comprising: component (A): 100 parts by weight of polyphenylene ether resin containing unsaturated carbon-carbon double bonds; component (B): 1 to 20 parts by weight of unhydrogenated maleic anhydride-modified first polyolefin; and component (C): 5 to 100 parts by weight of benzocyclobutene-modified second polyolefin. Besides, the present disclosure also provides an article made from the resin composition. The article comprises a prepreg, a resin film, a laminate or a printed circuit board that has improvements in one or more properties including stability of peeling strength of bonding sheet and core, solder ball shear, bonding gap and solder floating delamination rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="860" publication-number="202618529">
    <tif-files tif-type="multi-tif">
      <tif file="113144009.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有按鍵之觸控鍵盤</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250319B">G06F3/041</main-classification>
        <further-classification edition="200601120250319B">H01H13/705</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秀育企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鉊鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉于任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之觸控鍵盤包含一支撐板、複數彈性體、複數鍵帽，以及一電容式觸控板。彈性體以凸出於支撐板之頂面的方式設於支撐板，鍵帽設於彈性體之頂端，架橋設於支撐板與鍵帽之間，電容式觸控板設於支撐板之底面，用以感應一導電物（例如手指）靠近鍵帽時的所在位置及移動軌跡。藉此，本發明之觸控鍵盤將電容式觸控板設於支撐板的下方，可以減少甚至省略電容式觸控板的破孔需求，以減少觸控死角而達到增加觸控準確性的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:支撐板</p>
        <p type="p">21:頂面</p>
        <p type="p">22:底面</p>
        <p type="p">30:彈性體</p>
        <p type="p">40:鍵帽</p>
        <p type="p">50:架橋</p>
        <p type="p">60:電容式觸控板</p>
        <p type="p">62:頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="861" publication-number="202618308">
    <tif-files tif-type="multi-tif">
      <tif file="113144331.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>目標電子行業膠帶材料的確定方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR DETERMINING TARGET ELECTRONIC INDUSTRY TAPE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G01R23/00</main-classification>
        <further-classification edition="200601120250502B">G01N22/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造（浙江）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE ITECH(ZHEJIANG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈智杭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, ZHIHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供目標電子行業膠帶材料的確定方法及系統。該方法透過處理模組對初始基波訊號進行處理，獲得目標基波訊號；將針點移動至電子行業膠帶材料的目標測量位置，控制針點與該電子行業膠帶材料相抵的壓力為目標測量壓力；其中，該處理模組的輸出端與針點的第一端連接，該針點的第二端與電子行業膠帶材料相抵；在目標測量位置和目標測量壓力的情況下，透過該針點傳輸該目標基波訊號，以獲取多個電子行業膠帶材料對應的諧波值；根據諧波值之間的比較結果確定目標電子行業膠帶材料，快速、準確選擇出對射頻性能更優的目標電子行業膠帶材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method and a system for determining target electronic industry tape material. The method includes processing an initial fundamental wave signal through a processing module to obtain a target fundamental wave signal; moving a probe to a target measurement position of an electronic industry tape material, and controlling the pressure between the probe and the electronic industry tape material to be a target measurement pressure; wherein the output of the processing module is connected to a first end of the probe, a second end of the probe is abutted against the electronic industry tape material. Under the condition of the target measurement position and the target measurement pressure, transmitting the target fundamental wave signal through the probe to obtain the corresponding harmonic values of a plurality of electronic industry tape materials; determining the target electronic industry tape material according to the comparison results between the harmonic values. The target electronic industry tape material with better radio frequency performance is quickly and accurately selected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
        <p type="p">S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="862" publication-number="202617248">
    <tif-files tif-type="multi-tif">
      <tif file="113144925.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用電漿之催化劑處理裝置及利用該裝置之廢氣處理系統</chinese-title>
        <english-title>CATALYST PROCESSING APPARATUS OF USING PLASMA AND EXHAUST GAS PROCESSING SYSTEM OF USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">B01D53/32</main-classification>
        <further-classification edition="200601120250108B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商因努彼亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOPIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洪駉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONG KYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種加熱廢氣且利用催化劑分解全氟化合物之催化劑處理裝置及利用該裝置之廢氣處理系統。即使廢氣經過預處理濕式處理裝置，氧氣亦會變得稀少，由於氧氣不足，在後端進行的集塵操作無法順利進行。廢氣荷電部供應空氣或氧氣以使廢氣中的微細粒子荷電。據此，全氟化合物的分解操作可順利進行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:預處理濕式處理裝置</p>
        <p type="p">200:催化劑處理裝置</p>
        <p type="p">300:後處理濕式處理裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="863" publication-number="202617414">
    <tif-files tif-type="multi-tif">
      <tif file="113144958.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>殼體製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD FOR HOUSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">B29C70/28</main-classification>
        <further-classification edition="200601120250102B">B29C70/54</further-classification>
        <further-classification edition="200601120250102B">B29C70/06</further-classification>
        <further-classification edition="200601120250102B">B21D22/00</further-classification>
        <further-classification edition="202501120250102B">H05K5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒軍輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, JUN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊玉純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊國林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GUO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛二保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, ER-BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種殼體製造方法。此殼體製造方法包含以下步驟。首先，提供一植物碳纖維板材。隨後，對植物碳纖維板材施以沖壓製程，以形成一碳纖維殼體。然後，利用一模內注塑製程，在碳纖維殼體上形成一裝飾面。植物碳纖維板材之製造步驟如下。首先提供一植物原料。隨後對植物原料施以第一次低溫碳化處理而形成一植物碳化原料。然後添加一樹脂材料而形成一植物碳化混合材料。接下來，對植物碳化混合材料施以第二次低溫碳化處理而產生一植物碳纖維原料。然後，對植物碳纖維原料擠壓抽絲並予以塑形而形成植物碳纖維板材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for a housing is provided. The manufacturing method comprises the following steps. Firstly, a botanical carbon fiber sheet is provided. Then, the botanical carbon fiber sheet is punched to form a carbon fiber housing. Then, an in-mold plastic injection process is applied to the carbon fiber housing to form a decoration surface thereon. The manufacturing process of the botanical carbon fiber plate comprises the following steps. Firstly, a botanical raw material is provided. Then, a first low temperature carbonization treatment is applied to the botanical raw material to produce a botanical carbonized material. Then, a resin material is added to form a botanical carbonization mixed material. Next, a second low-temperature carbonization treatment is performed on the botanical carbonized mixed material to produce a botanical carbon fiber raw material. Then, the botanical carbon fiber raw material is extruded, spun, and shaped to form the botanical carbon fiber sheet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S120,S140,S160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="864" publication-number="202618671">
    <tif-files tif-type="multi-tif">
      <tif file="113145008.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145008</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理訂單資訊之裝置、方法及記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PROCESSING ORDER INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250624B">G06Q50/12</main-classification>
        <further-classification edition="201201120250624B">G06Q50/10</further-classification>
        <further-classification edition="202301120250624B">G06Q30/06</further-classification>
        <further-classification edition="201201120250624B">G06Q10/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　基英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KEE YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昌榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, CHANG YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　約書亞　佑錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JOSHUA WOOSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉迪蒂奧　索尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADHITYO, SONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONG YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一實施例，可提出一種處理訂單資訊之裝置。本發明之裝置可以如下方式構成：將目標賣場之賣場資訊傳輸至訪問上述目標賣場之用戶之用戶終端；自上述用戶終端接收上述至少一個物品中之至少一個目標物品之訂單資訊，該至少一個目標物品係於上述目標賣場內之與上述用戶終端對應之目標桌台訂購者；識別用以支付上述至少一個目標物品之結算金額之目標結算服務；基於上述訂單資訊及上述目標結算服務，產生上述至少一個目標物品之訂購完成資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:用戶終端</p>
        <p type="p">120:電子裝置</p>
        <p type="p">130:賣場終端</p>
        <p type="p">140:結算服務器</p>
        <p type="p">150:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="865" publication-number="202619320">
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      <tif file="113145231.zip" no="1">
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      <volno>24</volno>
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          <doc-number>202619320</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有頻偏追蹤機制的通訊裝置及方法</chinese-title>
        <english-title>COMMUNICATION APPARATUS AND METHOD HAVING FREQUENCY TRACKING MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04L25/03</main-classification>
        <further-classification edition="200601120250401B">H04L25/02</further-classification>
        <further-classification edition="200601120250401B">H04L27/26</further-classification>
        <further-classification edition="200601120250401B">H04B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鳳翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FENG-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有頻偏追蹤機制的通訊裝置。相位補償電路接收封包的資料部分的當下符號區段並根據頻偏量進行相位補償以產生相位補償符號區段。符號處理電路根據擾碼資訊對相位補償符號區段進行解擾及等化，進一步根據等化結果計算產生與先前符號區段間的相位差及資料時間差，進而由殘餘頻偏估計電路進行比值計算產生瞬時頻偏估計值。頻偏平滑計算電路根據與資料時間差呈正相關的函數對資料時間差計算產生修正係數，以與瞬時頻偏估計值與平滑係數相乘產生平滑頻偏估計值，再與先前頻偏估計值疊加產生當下頻偏估計值更新頻偏量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication apparatus having a frequency tracking mechanism is provided. A phase compensation circuit performs phase compensation on a current symbol section of a data part of a packet according to a frequency offset to generate a phase compensated symbol section. A symbol processing circuit descrambles and equalizes the phase compensated symbol section according to descrambling information to generate a phase difference and a data time difference from a previous symbol section accordingly such that a residue frequency offset estimation circuit calculates a ratio therebetween to generate an instant frequency offset estimation value. A frequency offset smoothing calculation circuit performs calculation according to a function having a positive correlation with the data time difference to generate a modification coefficient to be multiplied by the instant frequency offset estimation value and a smoothing coefficient to generate a smoothed frequency offset estimation value and adds a previous frequency offset estimation value by the smoothed frequency offset estimation value to generate a current frequency offset estimation value to update the frequency offset.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通訊裝置</p>
        <p type="p">110:前處理電路</p>
        <p type="p">120:相位補償電路</p>
        <p type="p">130:符號處理電路</p>
        <p type="p">140:殘餘頻偏估計電路</p>
        <p type="p">150:頻偏平滑計算電路</p>
        <p type="p">△F:頻偏量</p>
        <p type="p">△FE:瞬時頻偏估計值</p>
        <p type="p">△FI:初始值</p>
        <p type="p">△FS:平滑頻偏估計值</p>
        <p type="p">△P:相位差</p>
        <p type="p">△T:資料時間差</p>
        <p type="p">DAT:資料部分</p>
        <p type="p">ICI:初始通道資訊</p>
        <p type="p">PK:封包</p>
        <p type="p">SCI:擾碼資訊</p>
        <p type="p">SYP:相位補償符號區段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="866" publication-number="202618681">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理包裝資訊之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM FOR PROCESSING PACKAGING INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250520B">G06Q50/40</main-classification>
        <further-classification edition="202301120250520B">G06Q30/0601</further-classification>
        <further-classification edition="202401120250520B">G06Q10/08</further-classification>
        <further-classification edition="200601120250520B">G06F3/14</further-classification>
        <further-classification edition="200601120250520B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙汝斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣艷陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴華鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HWAJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之處理包裝資訊之方法可包括如下步驟：獲得屬於預先確定之商品類別之至少一個訂購商品之包裝資訊；及於顯示器上輸出至少一個訂購商品之包裝資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:電子裝置</p>
        <p type="p">120:網路</p>
        <p type="p">130:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="867" publication-number="202618682">
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      <tif file="113145266.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生包裝資訊之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM FOR GENERATING PACKAGING INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250520B">G06Q50/40</main-classification>
        <further-classification edition="202301120250520B">G06Q30/0601</further-classification>
        <further-classification edition="202401120250520B">G06Q10/08</further-classification>
        <further-classification edition="200601120250520B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙汝斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣艷陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴華鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HWAJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之產生包裝資訊之方法可包括如下步驟：獲得屬於預先確定之商品類別之複數個訂購商品之訂購資訊；確定用以包裝複數個訂購商品之至少一個第1類型包裝材之總個數；確定用以包裝複數個訂購商品之至少一個第2類型包裝材之總個數；及基於至少一個第1類型包裝材之總個數與至少一個第2類型包裝材之總個數之比較結果，於第1類型包裝材及第2類型包裝材中確定複數個訂購商品之推薦包裝材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:電子裝置</p>
        <p type="p">120:裝置</p>
        <p type="p">130:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="868" publication-number="202618633">
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        <document-id>
          <doc-number>113145270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生包裝資訊之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM FOR GENERATING PACKAGING INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250624B">G06Q10/08</main-classification>
        <further-classification edition="202301120250624B">G06Q30/0601</further-classification>
        <further-classification edition="202401120250624B">G06Q50/40</further-classification>
        <further-classification edition="200601220250624B">B65B59/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王海挺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAITING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣艷陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴華鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HWAJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐相元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SANG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　伊萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIM, ELAINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭智秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GWAK, JISU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一實施例之產生包裝資訊之方法可包括如下步驟：本發明一實施例之方法可包括如下步驟：獲得複數個商品之訂單資訊；於上述複數個商品中識別屬於高級包裝組之至少兩個以上之商品，上述高級包裝組對應於高級箱子組，至少一個高級箱子屬於上述高級箱子組；及基於上述至少兩個以上之商品各者之尺寸，於上述至少一個高級箱子中確定用以一同包裝上述至少兩個以上之商品之推薦高級箱子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:電子裝置</p>
        <p type="p">120:第1裝置</p>
        <p type="p">130:第2裝置</p>
        <p type="p">140:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="869" publication-number="202619361">
    <tif-files tif-type="multi-tif">
      <tif file="113145392.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145392</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳機盒和耳機套件</chinese-title>
        <english-title>HEADPHONE CASES AND HEADPHONE KITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H04R1/02</main-classification>
        <further-classification edition="200601120250102B">H04R1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉水松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHUISONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種耳機盒和耳機套件，該耳機盒包括上蓋組件和下殼組件。其中，上蓋組件由第一位置朝向第二位置延伸形成有滑槽和弧形槽，弧形槽在第一位置和第二位置處靠近滑槽，弧形槽的中心遠離滑槽的中心；下殼組件具有第一滑動件、第二滑動件和復位件，第一滑動件位於滑槽內，第二滑動件位於弧形槽內，復位件分別連接第一滑動件和第二滑動件，復位件在第一位置或第二位置處處於放鬆狀；上蓋組件相對下殼組件滑動時，第一滑動件沿滑槽滑動，同時第二滑動件沿弧形槽滑動。由此，耳機盒通過設置復位件實現了利用阻尼力平衡推力，從而可以保證開關順暢並提升滑動時的手感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses an earphone box and an earphone kits. The earphone box includes an upper cover assembly and a lower shell assembly. Wherein, the upper cover assembly extends from the first position toward the second position to form a chute and an arc-shaped groove, the arc-shaped groove is close to the chute at the first position and the second position, and the center of the arc-shaped groove is away from the center of the chute; The lower shell assembly has a first sliding part, a second sliding part and a reset part. The first sliding part is located in the chute, the second sliding part is located in the arc groove, and the reset part is connected to the first sliding part and the second sliding part respectively. The reset member is in a relaxed state at the first position or the second position; when the upper cover assembly slides relative to the lower shell assembly, the first sliding member slides along the slide groove, and at the same time, the second sliding member slides along the arcuate groove. As a result, the earphone box realizes the use of damping force to balance the thrust force by setting the reset piece, thereby ensuring smooth switching and improving the feel when sliding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:滑槽</p>
        <p type="p">12:弧形槽</p>
        <p type="p">13:第二磁鐵</p>
        <p type="p">14:第三磁鐵</p>
        <p type="p">21:第一滑動件</p>
        <p type="p">22:第二滑動件</p>
        <p type="p">23:復位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="870" publication-number="202618645">
    <tif-files tif-type="multi-tif">
      <tif file="113145461.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理包裝資訊之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM FOR PROCESSING PACKAGING INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250502B">G06Q30/06</main-classification>
        <further-classification edition="202401120250502B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王海挺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAITING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣艷陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴華鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HWAJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐相元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SANG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　伊萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIM, ELAINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭智秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GWAK, JISU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一實施例之產生包裝資訊之方法可包括如下步驟：獲得屬於高級包裝組之至少兩個以上之商品之包裝資訊；及將包裝資訊輸出至顯示器上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:電子裝置</p>
        <p type="p">120:伺服器</p>
        <p type="p">130:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="871" publication-number="202619503">
    <tif-files tif-type="multi-tif">
      <tif file="113145706.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145706</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250210B">H10B99/00</main-classification>
        <further-classification edition="202301120250210B">H10B12/00</further-classification>
        <further-classification edition="200601120250210B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭榮賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JUNG TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構的製造方法，其包括以下步驟。於基底上形成目標層。於所述目標層上形成硬罩幕層。移除部分所述硬罩幕層，以於所述硬罩幕層中形成凹槽。於所述硬罩幕層的頂面上形成多個第一圖案以及同時於所述凹槽中形成多個第二圖案，其中所述多個第一圖案的圖案密度小於所述多個第二圖案的圖案密度。使用所述多個第一圖案與所述多個第二圖案作為罩幕，將所述硬罩幕層與所述目標層圖案化，以於目標層中形成對應於所述多個第一圖案的多個第一目標圖案以及對應於所述多個第二圖案的多個第二目標圖案。移除所述多個第一圖案、所述多個第二圖案以及所述硬罩幕層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor structure is provided. The method includes the following steps. A target layer and a hard mask layer are sequentially formed on a substrate. A part of the hard mask layer is removed to form a recess. A plurality of first patterns are formed on a top surface of the hard mask layer and a plurality of second patterns are formed in the recess simultaneously. A pattern density of the plurality of first patterns is smaller than that of the plurality of second patterns. The hard mask layer and the target layer are patterned using the first patterns and the second patterns as a mask to form a plurality of first target patterns corresponding to the plurality of first patterns and a plurality of second target patterns corresponding to the plurality of second patterns in the target layer. The first and second patterns and the hard mask layer are removed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">102:目標層</p>
        <p type="p">104:硬罩幕層</p>
        <p type="p">108:第二光阻層</p>
        <p type="p">R:凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="872" publication-number="202619217">
    <tif-files tif-type="multi-tif">
      <tif file="113145707.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體元件及其形成方法</chinese-title>
        <english-title>INTEGRATED DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250508B">H02H9/04</main-classification>
        <further-classification edition="200601120250508B">H01L23/60</further-classification>
        <further-classification edition="202501120250508B">H10D89/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃麟淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勝福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些實施例涉及積體元件，包括：電阻電容結構，在高壓線和低壓線之間串聯耦合，電阻電容結構具有電性耦合到電阻器和電容器的第一節點；電晶體，包括耦合到高壓線的第一源極/汲極端子、耦合到低壓線的第二源極/汲極端子以及閘極端子；以及二極體，耦合在閘極端子和高壓線或低壓線之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments relate to an integrated device, including: a resistor and capacitor structure coupled in series between a high voltage wire and a low voltage wire, the resistor and capacitor structure having a first node electrically coupled to a resistor and a capacitor; a transistor comprising a first source/drain terminal coupled to the high voltage wire, a second source/drain terminal coupled to the low voltage wire, and a gate terminal; and a diode coupled between the gate terminal and either the high voltage wire or the low voltage wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:電路圖</p>
        <p type="p">102:功率鉗位器</p>
        <p type="p">104:高壓線</p>
        <p type="p">106:低壓線</p>
        <p type="p">108:電容器</p>
        <p type="p">109:電阻器</p>
        <p type="p">110:第一節點</p>
        <p type="p">111:電阻電容結構</p>
        <p type="p">112:電晶體</p>
        <p type="p">114:第一源極/汲極端子</p>
        <p type="p">116:第二源極/汲極端子</p>
        <p type="p">118:閘極端子</p>
        <p type="p">120:二極體</p>
        <p type="p">122:陰極</p>
        <p type="p">124:陽極</p>
        <p type="p">126:對應電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="873" publication-number="202618193">
    <tif-files tif-type="multi-tif">
      <tif file="113145733.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145733</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種製冷控制方法和淨水機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F25D21/04</main-classification>
        <further-classification edition="200601120241230B">A47J31/44</further-classification>
        <further-classification edition="200601120241230B">A47J31/46</further-classification>
        <further-classification edition="200601120241230B">F25D19/00</further-classification>
        <further-classification edition="200601120241230B">F25D31/00</further-classification>
        <further-classification edition="200601120241230B">F25D29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商溢泰（南京）環保科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溢泰實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商博西華電器（江蘇）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟孟濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林笑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊學藺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁建雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫麗英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明通過一製冷控制單元判斷一冷罐內的一第一檢測水溫在連續的一第一預設時間內，是否均大於等於一第一預設溫度，如是則啟動一壓縮機，進入製冷運行；在製冷過程中，該製冷控制單元即時確定該冷罐內的一第二檢測水溫；並判斷該第二檢測水溫在連續的一第二預設時間內，是否均小於等於一第二預設溫度，如是則關閉該壓縮機，停止製冷運行；該第一檢測水溫、該第二檢測水溫由該製冷控制單元對該冷罐內設置的多個溫度感測器傳送的檢測溫度值進行綜合評判確定。本發明能夠有效防止該冷罐在製冷過程中產生結冰現象，加快製冷速度、節省能源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:淨水機</p>
        <p type="p">2:製冷單元</p>
        <p type="p">10:製冷控制單元</p>
        <p type="p">11:壓縮機</p>
        <p type="p">12:循環泵</p>
        <p type="p">13:風扇</p>
        <p type="p">14:第一溫度感測器</p>
        <p type="p">15:第二溫度感測器</p>
        <p type="p">16:水位感測器</p>
        <p type="p">17:補水電磁閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="874" publication-number="202617872">
    <tif-files tif-type="multi-tif">
      <tif file="113145835.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣樹脂組合物及其製品</chinese-title>
        <english-title>INSULATING RESIN COMPOSITION AND ARTICLES MADE THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08L61/00</main-classification>
        <further-classification edition="200601120241220B">C08L65/00</further-classification>
        <further-classification edition="200601120241220B">C08L71/12</further-classification>
        <further-classification edition="200601120241220B">C08K5/50</further-classification>
        <further-classification edition="200601120241220B">H01B3/18</further-classification>
        <further-classification edition="200601120241220B">H01B3/30</further-classification>
        <further-classification edition="200601120241220B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商台光電子材料（昆山）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛文濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, WENTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅兆鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, ZHAOPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛軼強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, YIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種絕緣樹脂組合物，該絕緣樹脂組合物包含：成分(A)：100重量份含不飽和碳碳雙鍵的聚苯醚樹脂和/或馬來醯亞胺樹脂，以及成分(B)：10~65重量份式(1)所示的含磷單體，在式(1)中，R        &lt;sub&gt;11&lt;/sub&gt;為C2~C4烯基取代的苯基，R        &lt;sub&gt;12&lt;/sub&gt;和R        &lt;sub&gt;13&lt;/sub&gt;各自獨立地為C1~C4烷基、C2~C4烯基、苯基、C1~C4烷基取代的苯基、C2~C4烯基取代的苯基、聯苯基或萘基。此外，本發明還公開了一種由上述絕緣樹脂組合物製成的製品，包括半固化片、樹脂膜、覆金屬箔層壓板或印刷電路板。該製品在板內流膠量、板邊條紋、阻燃性、剝離強度、介電損耗、Z軸熱膨脹率等至少一個特性上得到改善。        &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="213px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure discloses an insulating resin composition, comprising: component (A): 100 parts by weight of unsaturated carbon-carbon double bonds-containing polyphenylene ether resin and/or maleimide resin, and component (B): 10 to 65 parts by weight of the phosphorus-containing monomer represented by formula (1). In formula (1), R        &lt;sub&gt;11&lt;/sub&gt;is a C2 to C4 alkenyl-substituted phenyl group, and R        &lt;sub&gt;12&lt;/sub&gt;and R        &lt;sub&gt;13&lt;/sub&gt;are each independently a C1 to C4 alkyl, a C2 to C4 alkenyl, a phenyl, a C1 to C4 alkyl-substituted phenyl, a C2 to C4 alkenyl-substituted phenyl, a biphenyl or a naphthyl. In addition, the present disclosure also discloses an article made from the insulating resin composition, including a prepreg, a resin film, a metal foil-clad laminate or a printed circuit board. The article has improvements in at least one properties including inner resin flow, edge stripe, flame retardancy, peeling strength, dissipation factor, and Z-axis percent of thermal expansion.        &lt;br/&gt;&lt;img align="absmiddle" height="140px" width="285px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="875" publication-number="202617745">
    <tif-files tif-type="multi-tif">
      <tif file="113145919.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含磷化合物、其製備方法、樹脂組合物及其製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">C07F9/06</main-classification>
        <further-classification edition="200601120241226B">C09K21/12</further-classification>
        <further-classification edition="200601120241226B">C08L79/08</further-classification>
        <further-classification edition="200601120241226B">C08K5/52</further-classification>
        <further-classification edition="200601120241226B">H05K1/03</further-classification>
        <further-classification edition="200601120241226B">B32B15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中山台光電子材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡志龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張賀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭紅霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有式（I）所示結構的含磷化合物、其製備方法、樹脂組合物及其製品。在式（I）中，n為0或1，Ar基團代表二價芳香烴族基團。前述含磷化合物可以用於樹脂組合物中，用以改善製品的特性，包括提升玻璃轉化溫度、降低Z軸熱膨脹率、改善T288耐熱性、改善阻燃劑遷移、改善阻燃劑脫落及/或改善交聯間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="876" publication-number="202618561">
    <tif-files tif-type="multi-tif">
      <tif file="113145924.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶裝置、快閃記憶體控制器及其控制方法</chinese-title>
        <english-title>MEMORY DEVICE, FLASH MEMORY CONTROLLER AND ASSOCIATED CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250425B">G06F12/0866</main-classification>
        <further-classification edition="200601120250425B">G06F13/38</further-classification>
        <further-classification edition="200601120250425B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種快閃記憶體控制器的控制方法，其中該快閃記憶體控制器耦接於一主裝置及一快閃記憶體模組，且該快閃記憶體控制器用來自該主裝置接收一命令以存取該快閃記憶體模組；以及該控制方法包含有：設定用來與該主裝置進行通訊的一第一頻寬；根據該快閃記憶體模組的一配置資訊以決定一參考資料速率；根據該參考資料速率以判斷該第一頻寬是否遠超過一所需頻寬；以及若是判斷該第一頻寬遠超過該所需頻寬，設定低於該第一頻寬的一第二頻寬，以用來與該主裝置進行通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a control method of a flash memory controller. The flash memory controller is coupled between a host device and a flash memory module, and the flash memory controller is configured to receive a command from the host device to access the flash memory module; and the control method comprises: setting a first bandwidth for communicating with the host device; determining a reference data rate according to configuration information of the flash memory module; determining if the first bandwidth far exceeds a required bandwidth according to the reference data rate; and if it is determined that the first bandwidth far exceeds the required bandwidth, setting a second bandwidth lower than the first bandwidth, for communicating with the host device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500~510:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="877" publication-number="202619098">
    <tif-files tif-type="multi-tif">
      <tif file="113145933.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145933</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">H01L23/488</main-classification>
        <further-classification edition="200601120241219B">H01L23/535</further-classification>
        <further-classification edition="200601120241219B">H01L23/31</further-classification>
        <further-classification edition="200601120241219B">H01L21/60</further-classification>
        <further-classification edition="200601120241219B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊吳德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤俊煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝結構包含基板、半導體晶粒及封裝體。基板包含本體層、破口部、跨接部、電源焊球、接地焊球、電源走線部及接地走線部。破口部貫穿本體層，跨接部自本體層延伸橫跨破口部，電源焊球安裝至本體層上，接地焊球安裝至本體層上，電源走線部內嵌於本體層及跨接部內。接地走線部內嵌於本體層及跨接部內。半導體晶粒安裝至基板上，具有伸入破口部內的電源導接墊及接地導接墊。封裝體將本體層及半導體晶粒一同封裝。電源導接墊藉由穿過破口部的電源鍵合線電連接電源走線部，接地導接墊藉由穿過破口部的接地鍵合線電連接接地走線部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package structure includes a substrate, a semiconductor die and an encapsulated body enclosing the substrate and the semiconductor die together. The substrate includes a main layer, a breach portion penetrated through the main layer, a spanning portion extending across the breach portion from the main layer, power solder balls mounted on the main layer, ground solder balls mounted on the main layer, a power wiring embedded inside the spanning portion and the main layer, and a ground wiring embedded inside the spanning portion and the main layer. The semiconductor die is mounted on the substrate, and provided with a power contact pad and a ground contact pad extended into the breach portion, respectively. The power contact pad is electrically connected to the power wiring via the breach portion, and the ground contact pad electrically connected to the ground wiring via the breach portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體封裝結構</p>
        <p type="p">100:基板</p>
        <p type="p">101:正面</p>
        <p type="p">110:本體層</p>
        <p type="p">150:細長溝槽</p>
        <p type="p">210:電源焊球</p>
        <p type="p">220:接地焊球</p>
        <p type="p">230:訊號焊球</p>
        <p type="p">310:電源走線部</p>
        <p type="p">312:第二電源指狀接點</p>
        <p type="p">322:第二接地指狀接點</p>
        <p type="p">330:訊號走線部</p>
        <p type="p">332:第二訊號指狀接點</p>
        <p type="p">333:訊號跡線</p>
        <p type="p">400:半導體晶粒</p>
        <p type="p">410:電源導接墊</p>
        <p type="p">420:接地導接墊</p>
        <p type="p">421:接地鍵合線</p>
        <p type="p">430:訊號導接墊</p>
        <p type="p">431:訊號鍵合線</p>
        <p type="p">441:電源鍵合線</p>
        <p type="p">AA,BB,CC:線段</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="878" publication-number="202618562">
    <tif-files tif-type="multi-tif">
      <tif file="113145935.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快閃記憶體控制器與快閃記憶體控制器的編解碼方法</chinese-title>
        <english-title>FLASH MEMORY CONTROLLER AND CODING METHOD OF FLASH MEMORY CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250425B">G06F12/0866</main-classification>
        <further-classification edition="200601120250425B">G06F11/07</further-classification>
        <further-classification edition="200601120250425B">G06F13/38</further-classification>
        <further-classification edition="200601120250425B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧惇益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, DUEN-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭軒豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快閃記憶體控制器的編解碼方法，包括：根據一編解碼矩陣來對一資料單元進行一局部編碼操作以及對多個資料單元進行一全域編碼操作以產生並寫入一錯誤更正碼資料至該頁單元，該資料單元要被寫入該快閃記憶體裝置的一頁單元之一部分，而該多個資料單元要被寫入至該頁單元；根據該編解碼矩陣所對應的該錯誤更正碼資料來對從該頁單元之該部分所讀取出的該資料單元進行一局部解碼操作以及對從該頁單元所讀取出的該多個資料單元進行一全域解碼操作以取得該頁單元之正確資料；以及動態地決定該編解碼矩陣以動態地選擇一編解碼模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coding method of a flash memory controller includes: performing a local encoding operation upon a data unit and performing a global encoding operation upon multiple data units according to a coding matrix to generate and write error correction code data into the page unit, the data unit to be written into a portion of the page unit of the flash memory device and the multiple data units to be written into the page unit; performing a local decoding operation upon the data unit read from the portion of the page unit and performing a global decoding operation upon the multiple data units read from the page unit according to the error correction code data corresponding to the coding matrix to obtain correct data of the page unit; and dynamically determining the coding matrix to dynamically select a coding mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:快閃記憶體控制器</p>
        <p type="p">101:主機裝置</p>
        <p type="p">102:快閃記憶體裝置</p>
        <p type="p">105DE:解碼器電路</p>
        <p type="p">105EN:編碼器電路</p>
        <p type="p">110:處理電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="879" publication-number="202617088">
    <tif-files tif-type="multi-tif">
      <tif file="113146190.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虛擬心臟缺血成像系統和方法</chinese-title>
        <english-title>VIRTUAL CARDIAC ISCHEMIA IMAGING SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241212B">A61B5/318</main-classification>
        <further-classification edition="200601120241212B">A61B8/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林則余</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林澂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅孟宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, MEN-TZUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種虛擬心臟缺血成像系統，包含定位裝置、探針感測器、引線電極感測器、分析裝置及顯示裝置。透過此虛擬心臟缺血成像系統，將引線電極精確貼附於有需要的對象軀幹體表，精確模擬對象心臟的缺血狀況，不需要利用核子醫學檢查來估計心臟的形狀。透過上述虛擬心臟缺血成像系統的元件，實現了一種虛擬心臟缺血成像的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for virtual cardiac ischemia imaging includes a positioning device, a probe sensor device, a lead electrode sensor device, an analysis device, and a display device. Through the system for virtual cardiac ischemia imaging, lead electrodes is precisely attached on body surface of torso of a subject in need thereof, ischemic condition of heart of the subject is precisely simulated and does not require utilization of nuclear medicine examination to estimate shape of the heart of the subject. A method for virtual cardiac ischemia imaging is realized through the components of the system for virtual cardiac ischemia imaging.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統</p>
        <p type="p">100:定位裝置</p>
        <p type="p">200:引線電極感測器</p>
        <p type="p">300:探針感測器</p>
        <p type="p">400:資料庫</p>
        <p type="p">500:分析裝置</p>
        <p type="p">600:顯示裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="880" publication-number="202618758">
    <tif-files tif-type="multi-tif">
      <tif file="113146296.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種拉弦樂器</chinese-title>
        <english-title>A BOWED-STRING INSTRUMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G10D3/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商香港中樂團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG KONG CHINESE ORCHESTRA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　仕春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種拉弦樂器，其包括空心的第一箱體、設置在所述第一箱體上的振動弦承載桿，以及振動弦，所述第一箱體的第一端部設有第一開口，所述第一開口由膜片封閉，其特徵在於，所述拉弦樂器包括設置在第一箱體上的空心的第二箱體，所述第二箱體包括面板、背板和連接所述面板和所述背板的側框，所述側框沿著所述面板和所述背板的邊緣延伸並與所述面板和所述背板一起包封所述第二箱體的內部容積。根據本申請的拉弦樂器音量大、音色美、反應靈敏、易於掌握。在高音區音量足，按弦的指感靈敏，反應快速直接。在低音區音質濃郁，豐厚而寬廣。在中音區音色圓潤柔美，具備古色古香的特殊韻味，還具備沉浸式的甜美感覺。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一箱體</p>
        <p type="p">2:第二箱體</p>
        <p type="p">3:縱向傳導件</p>
        <p type="p">7:膜片</p>
        <p type="p">10:振動弦</p>
        <p type="p">13:指板</p>
        <p type="p">14:振動弦承載件</p>
        <p type="p">15:凹口</p>
        <p type="p">16:頭部</p>
        <p type="p">17:振動弦調節裝置</p>
        <p type="p">102:第一端部</p>
        <p type="p">103:第二端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="881" publication-number="202618826">
    <tif-files tif-type="multi-tif">
      <tif file="113146419.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146419</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行動裝置保護殼之按鈕及具有該按鈕之行動裝置保護殼組</chinese-title>
        <english-title>BUTTON FOR MOBILE DEVICE PROTECTIVE CASE AND MOBILE DEVICE PROTECTIVE CASE SET HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01H13/14</main-classification>
        <further-classification edition="200601120251001B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛進化科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVOLUTIVE LABS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇聖哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, SHENG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林釗玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施凱偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, KAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許哲瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之按鈕包含有一塑膠本體和多個導電體，該等導電體結合於塑膠本體並沿著塑膠本體之長度方向呈間隔排列，其中，各導電體由一塑膠材料和一導電材料混合而成，使各導電體表現出良好的導電性能。藉此，本發明之按鈕被手指觸碰時利用塑膠本體和該等導電體所形成的電位差，即可實現感應及按壓的目的。另外，本發明更提供具有前述按鈕之一行動裝置保護殼組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A button of the present invention includes a plastic body and multiple conductive plastics integrated with the plastic body and arranged at equal intervals along the length direction of the plastic body. Each conductive plastic is made by mixing multiple plastic pellets with a conductive material, allowing the conductive plastics to exhibit excellent electrical conductivity. Therefore, when the button of the present invention is touched by a finger, the potential difference formed between the plastic body and the conductive plastics enables the sensing and pressing functions. Additionally, the present invention further includes a mobile device protective case set that has the aforesaid button.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18a:按鈕</p>
        <p type="p">20:塑膠本體</p>
        <p type="p">22:外表面</p>
        <p type="p">23:結合槽</p>
        <p type="p">30:導電體</p>
        <p type="p">32:外端面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="882" publication-number="202618225">
    <tif-files tif-type="multi-tif">
      <tif file="113146456.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>試驗箱之溫濕度檢測系統及試驗箱</chinese-title>
        <english-title>TEMPERATURE AND HUMIDITY DETECTION SYSTEMS FOR TEST CHAMBERS AND TEST CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">G01D21/02</main-classification>
        <further-classification edition="200601120250217B">G01D11/00</further-classification>
        <further-classification edition="200601120250217B">G01D18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王棟梁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DONG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種試驗箱之溫濕度檢測系統及試驗箱，溫濕度檢測系統包括：位置檢測裝置用以獲取試驗品放置於柵盤上之平面樣品位置資訊；距離檢測裝置用以獲取試驗品位於箱體內高度資訊；溫濕度檢測裝置包括連接箱體之第一移動機構，第一移動機構用以接收移動指令後控制溫濕度檢測裝置移動至試驗品上方預設高度；控制器用以接收平面樣品位置資訊及高度資訊，根據平面樣品位置資訊生成溫濕度檢測指令，根據高度資訊輸出移動指令；溫濕度檢測裝置用以接收到溫濕度檢測指令後，檢測對應平面位置之溫濕度資訊，並將溫濕度資訊傳輸至控制器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A temperature and humidity detection systems for test chambers and test chambers. temperature and humidity detection systems for test chambers includes: position detection device, distance detection device, temperature and humidity detection device, and controller. position detection device for obtaining information about the position of a planar sample of a test article placed on a grid plate. distance detection device for obtaining information about the height of the test article inside the chamber. The temperature and humidity detection device includes a first moving mechanism connected to a box, the first moving mechanism is used to control the temperature and humidity detection device to move to a preset height above the test article after receiving a moving instruction. the controller is used to receive planar sample position information and height information, generate and output temperature and humidity detection commands according to the planar sample position information, and output movement commands according to the height information. the temperature and humidity detection device is used to detect the temperature and humidity information of the corresponding planar position after receiving the temperature and humidity detection instruction, and transmit the temperature and humidity information to the controller.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:溫濕度檢測系統</p>
        <p type="p">110:位置檢測裝置</p>
        <p type="p">120:距離檢測裝置</p>
        <p type="p">130:溫濕度檢測裝置</p>
        <p type="p">140:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="883" publication-number="202617250">
    <tif-files tif-type="multi-tif">
      <tif file="113146572.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗滌裝置</chinese-title>
        <english-title>SCRUBBING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">B01D53/38</main-classification>
        <further-classification edition="200601120241226B">B01D53/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吴承桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SEUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吴承桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SEUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申健浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, GUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及洗滌裝置，可有效洗滌多種産業領域産生的氣體所包含的雜質。洗滌裝置包括：洗滌腔室，形成有洗滌空間，用于對從程序腔室排出的氣體所包含的雜質進行洗滌；氣體注入配管，一端與洗滌腔室相連接，另一端與程序腔室相連接，向洗滌腔室內部注入氣體；氣體排出配管，與洗滌腔室相連接，向洗滌腔室外部排出氣體；第一洗滌板，設置在洗滌腔室內；多個第一洗滌孔，貫通形成在第一洗滌板；溶液供給噴嘴，向第一洗滌板的上表面供給洗滌溶液；第一壓力計，用于測定經過氣體注入配管的氣體的第一壓力；以及第一壓力調節部，設置在氣體注入配管與洗滌腔室的邊界或氣體注入配管內部，用于調節第一壓力的强度，隨著氣體上升穿過多個第一洗滌孔，在第一洗滌板的上表面上形成氣泡，在氣泡與洗滌溶液相接觸的部分中，雜質溶解在洗滌溶液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A scrubbing apparatus comprising a scrubbing chamber defining a scrubbing space for scrubbing impurities contained in a gas discharged from a process chamber, a gas injection pipe having one end connected to the scrubbing chamber and the other end connected to the process chamber, wherein the gas is injected into the scrubbing chamber, a gas discharge pipe connected to the scrubbing chamber and discharged from the gas outside the scrubbing chamber, a first scrubbing plate disposed in the scrubbing chamber, a plurality of first scrubbing holes penetrating the first scrubbing plate, a solution supply nozzle for supplying a scrubbing solution to an upper surface of the first scrubbing plate, a first pressure gauge for measuring a first pressure of the gas passing through the gas injection pipe, and a first pressure controller installed at a boundary between the gas injection pipe and the scrubbing chamber or inside the gas injection pipe for controlling the intensity of the first pressure, wherein the gas upwardly passes through the plurality of first scrubbing holes to form bubbles on the upper surface of the first scrubbing plate, and wherein the impurities are dissolved in the scrubbing solution at a part where the bubble and the scrubbing solution are in contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:氣體注入配管</p>
        <p type="p">11d:氣體注入配管的寬度</p>
        <p type="p">20:洗滌裝置</p>
        <p type="p">23:氣體排出配管</p>
        <p type="p">23d:氣體排出配管的寬度</p>
        <p type="p">25:氣體注入口</p>
        <p type="p">26:氣體排出口</p>
        <p type="p">210:洗滌腔室</p>
        <p type="p">210SW1:第一內側壁</p>
        <p type="p">210SW2:第二內側壁</p>
        <p type="p">215:洗滌空間</p>
        <p type="p">215a:第一子空間</p>
        <p type="p">215b:第二子空間</p>
        <p type="p">220:隔板</p>
        <p type="p">221:噴灑噴嘴</p>
        <p type="p">225:第一洗滌溶液</p>
        <p type="p">227:第二洗滌溶液</p>
        <p type="p">230:第一洗滌板</p>
        <p type="p">230H:第一洗滌孔</p>
        <p type="p">235:第一洗滌壁</p>
        <p type="p">240:第二洗滌板</p>
        <p type="p">240H:第二洗滌孔</p>
        <p type="p">245:第二洗滌壁</p>
        <p type="p">250:第三洗滌板</p>
        <p type="p">250H:第三洗滌孔</p>
        <p type="p">255:第三洗滌壁</p>
        <p type="p">260:除霧器</p>
        <p type="p">270:洗滌溶液儲存罐</p>
        <p type="p">275:已溶解有雜質的洗滌溶液</p>
        <p type="p">281:第一壓力計</p>
        <p type="p">283:第二壓力計</p>
        <p type="p">285:第三壓力計</p>
        <p type="p">287:第四壓力計</p>
        <p type="p">291:第一壓力調節部</p>
        <p type="p">291c:第一連接配管</p>
        <p type="p">291d:第一壓力調節部的寬度</p>
        <p type="p">293:第二壓力調節部</p>
        <p type="p">293d:第二壓力調節部的寬度</p>
        <p type="p">295:連接閥</p>
        <p type="p">P:P區域</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="884" publication-number="202618544">
    <tif-files tif-type="multi-tif">
      <tif file="113146579.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146579</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用協同方法、電子設備及儲存介質</chinese-title>
        <english-title>APPLICATION COORDINATION METHOD, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F9/06</main-classification>
        <further-classification edition="201801120250602B">G06F9/44</further-classification>
        <further-classification edition="202301120250602B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張玉勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YU-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種應用協同方法、電子設備及儲存介質。所述方法包括：響應用戶請求，識別所述用戶請求中的用戶意圖；確定所述用戶意圖對應的智能體，透過所述智能體，確定所述用戶請求對應的應用程式中的目標介面及所述目標介面的介面資訊；根據用戶身份資訊及所述介面資訊生成對所述目標介面的調用請求；基於所述調用請求，透過介面管理平台叫用所述目標介面，獲得所述用戶請求對應的請求結果。利用上述方法，能夠實現對用戶請求的自動響應，從而能夠準確及快速地獲取用戶請求對應的請求結果，進而能夠提高用戶體驗及業務效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides an application coordination method, an electronic device and a storage medium. The application coordination method includes: in response to a user request, identifying a user intent according to the user request, determining an agent corresponding to the user intent, and determining a target interface of an application program corresponding to the user request, and determining interface information of the target interface, by using the agent; generating an invoking request for the target interface according to user identity information and the interface information; obtaining a request result corresponding to the user request by invoking the target interface through an interface management platform based on the invoking request. The method can provide automatic responses to user requests, thereby acquiring accurate and rapid results, and further improving user experience and business efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="885" publication-number="202618634">
    <tif-files tif-type="multi-tif">
      <tif file="113146720.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618634</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理資訊以揀選物品之裝置及其方法</chinese-title>
        <english-title>APPARATUS FOR PROCESSING INFORMATION FOR PICKING OF ITEMS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250909B">G06Q10/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南基斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, KI DO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙哥馬利　威利　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTGOMERY, WILLIE III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛特雷　姆魯根德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTRE, MRUGENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾巴特　拉胡爾　烏米什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNOBAT, RAHUL UMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡多納　奧爾蒂斯　何塞　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDONA ORTIZ, JOSE DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙阿　奇拉格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, CHIRAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>提古　阿密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIKOO, AMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　萬加佩利　桑托什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR VANGAPELLI, SANTHOSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加　薩米特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHA, SUMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維迪亞納坦　薩蒂亞納拉延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAIDYANATHAN, SATHYANARAYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比斯瓦斯　普拉萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISWAS, PRALAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南德元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, DUK WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙潤智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YOON JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示了一種於電子裝置中處理資訊之方法，其包括如下步驟：獲得對第1類型之物品之揀選請求；於屬於物流儲存倉之複數個地點中確認上述第1類型之物品所屬之一個以上之地點；判斷上述一個以上之地點中滿足設定之條件之第1地點；及將屬於上述第1地點之上述第1類型之物品指定為揀選目標物品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210:動作</p>
        <p type="p">220:動作</p>
        <p type="p">230:動作</p>
        <p type="p">240:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="886" publication-number="202619310">
    <tif-files tif-type="multi-tif">
      <tif file="113146779.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146779</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寬頻枝幹耦合器及無線通訊裝置</chinese-title>
        <english-title>BROADBAND BRANCH COUPLER AND WIRELESS COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H04B7/15</main-classification>
        <further-classification edition="200601120250602B">H04B7/185</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林書篁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種寬頻枝幹耦合器及無線通訊裝置，包括主體部、第一埠、第二埠、第三埠和第四埠，第一埠和第四埠與第二埠和第三埠對稱地連接於主體部的兩側；第一埠用於輸入訊號；第二埠用於輸出訊號，第二埠的輸出訊號與第一埠的輸入訊號具有第一相位差；第三埠用於輸出訊號，第三埠的輸出訊號與第一埠的輸入訊號具有第二相位差；第二埠的輸出訊號與第三埠的輸出訊號具有第三相位差；第一相位差小於第二相位差，第一相位差等於第三相位差；第四埠與第一埠具有預設隔離度，第一埠及第四埠均不輸出訊號，可覆蓋多個低軌道衛星的頻段及具較高的傳輸效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A broadband branch coupler and a wireless communication device are provided, including a main portion, a first port, a second port, a third port, and a fourth port. The first and fourth ports and the second and third ports are symmetrically connected to both sides of the main body. The first port is configured to input signal, the second port is configured to output signal, there is a first phase difference between the output signal of the second port and the input signal of the first port. The third port is configured to output signal, there is a second phase difference between the output signal of the third port and the input signal of the first port. There is a third phase difference between the output signal of the second port and the output signal of the third port. The first phase difference is less than the second phase difference, the first phase difference is equal to the third phase difference. There is a predetermined isolation between the fourth port and the first port, both the fourth port and the first port do not output signal. The broadband branch coupler can cover the frequency bands of multiple low-orbit satellites and have high transmission efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:寬頻枝幹耦合器</p>
        <p type="p">10:主體部</p>
        <p type="p">20:第一埠</p>
        <p type="p">30:第二埠</p>
        <p type="p">40:第三埠</p>
        <p type="p">50:第四埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="887" publication-number="202618530">
    <tif-files tif-type="multi-tif">
      <tif file="113147064.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控面板及其控制方法</chinese-title>
        <english-title>TOUCH PANEL AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林仲則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-CHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, JYUN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉雲翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YUN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁達庚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, TA-KENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">觸控面板和其控制方法。控制方法應用於觸控面板以接收來自主動筆的控制。控制方法包括使用解調頻率解調從主動筆接收的書寫訊號；判斷解調的書寫訊號是否異常；以及響應於判斷解調的書寫訊號異常，調整解調頻率以增加解調的書寫訊號的能量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch panel and a control method thereof. The control method is applied to a touch panel to receive controls from an active stylus. The control method comprises using a demodulation frequency to demodulate a writing signal received from the active stylus; determining whether a demodulated writing signal is abnormal or not; and in response to determining the demodulated writing signal to be abnormal, adjusting the demodulation frequency to increase an energy of the demodulated writing signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子系統</p>
        <p type="p">10:觸控面板</p>
        <p type="p">11:主動筆</p>
        <p type="p">100:接收器</p>
        <p type="p">101:處理器</p>
        <p type="p">DWS:解調書寫訊號</p>
        <p type="p">HW1、HW2:筆跡</p>
        <p type="p">f1:第一頻率</p>
        <p type="p">WS:書寫訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="888" publication-number="202618635">
    <tif-files tif-type="multi-tif">
      <tif file="113147172.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其配送手續費驗證方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND VERIFYING DELIVERY FEE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250623B">G06Q10/08</main-classification>
        <further-classification edition="201201120250623B">G06Q20/12</further-classification>
        <further-classification edition="201201120250623B">G06Q20/14</further-classification>
        <further-classification edition="202301120250623B">G06Q30/02</further-classification>
        <further-classification edition="202301120250623B">G06Q30/0601</further-classification>
        <further-classification edition="202401120250623B">G06Q50/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種與配送服務相關之電子裝置之配送手續費驗證方法。配送手續費驗證方法可包括如下步驟：確認第1配送供給量及上述第1配送供給量之第1測試資訊；確認第1配送需求量及上述第1配送需求量之第2測試資訊；基於設定之演算法，確認與上述第1配送供給量及上述第1配送需求量對應之演算法預估配送手續費；基於上述第1測試資訊及上述第2測試資訊來確認上述配送服務中應用之服務預估配送手續費；及基於上述演算法預估配送手續費及上述服務預估配送手續費，將報告資訊提供至用戶終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">120:用戶終端</p>
        <p type="p">S200,S210,S220,S230,S240,S250,S260,S270,S280,S290:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="889" publication-number="202618155">
    <tif-files tif-type="multi-tif">
      <tif file="113147292.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>截止閥之閥體流道改良</chinese-title>
        <english-title>IMPROVED VALVE FLOW CHANNEL OF CUT-OFF VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">F16K1/12</main-classification>
        <further-classification edition="200601120250325B">F16K27/02</further-classification>
        <further-classification edition="200601120250325B">F16K1/36</further-classification>
        <further-classification edition="200601120250325B">F16K1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和正豐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUENO TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡煥然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HUAN JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪煥喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, HUAN CIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種符合ESG要求之低揚程損失係數ξ之截止閥之閥體流道改良，以2吋內徑d&lt;sub&gt;0&lt;/sub&gt;=52.5mm且內徑比&lt;img align="absmiddle" height="39px" width="64px" file="d10058.TIF" alt="其他非圖式ed10058.png" img-content="character" orientation="portrait" inline="no" giffile="ed10058.png"/&gt;為例，本創新在追求閥體流道之揚程損失係數1.7&lt;img align="absmiddle" height="16px" width="14px" file="d10053.TIF" alt="其他非圖式ed10053.png" img-content="character" orientation="portrait" inline="no" giffile="ed10053.png"/&gt;ξ&lt;img align="absmiddle" height="15px" width="15px" file="d10054.TIF" alt="其他非圖式ed10054.png" img-content="character" orientation="portrait" inline="no" giffile="ed10054.png"/&gt;3.0，100&lt;img align="absmiddle" height="14px" width="13px" file="d10055.TIF" alt="其他非圖式ed10055.png" img-content="character" orientation="portrait" inline="no" giffile="ed10055.png"/&gt;C&lt;sub&gt;v&lt;/sub&gt;&lt;img align="absmiddle" height="15px" width="13px" file="d10056.TIF" alt="其他非圖式ed10056.png" img-content="character" orientation="portrait" inline="no" giffile="ed10056.png"/&gt;73.5，這樣的數值遠優於相同口徑之一般習知的截止閥ξ&lt;img align="absmiddle" height="15px" width="13px" file="d10057.TIF" alt="其他非圖式ed10057.png" img-content="character" orientation="portrait" inline="no" giffile="ed10057.png"/&gt;3.4。該閥體流道包含有一閥室、一環形槽、一入口流道、一閥入口、一閥座、一出口流道等、一閥出口。該閥入口與該閥出口分別裝設於該閥體的二側且水平配置，有水平基準的一管軸線XL&lt;sub&gt;2&lt;/sub&gt;穿過該閥出口之中點與該閥入口之中心點；該閥室內裝設有一閥塞、該閥座與該環形槽，該閥塞與該閥座做垂直耦合開閉；該閥座具一中心孔、一密封面，該中心孔高度為LH&lt;sub&gt;1&lt;/sub&gt;，其中心點P&lt;sub&gt;1&lt;/sub&gt;，該密封面的高度為LH&lt;sub&gt;3&lt;/sub&gt;可以提供高可靠度的密閉功能；該入口流道包含有該閥入口、一入口中心線S&lt;sub&gt;1&lt;/sub&gt;，由水平流入做轉角A轉向上由該閥座之該中心孔流出，轉角A的角度為2θ&lt;sub&gt;1&lt;/sub&gt;；該出口流道包含有該閥出口、一內出口、一出口中心線S&lt;sub&gt;2&lt;/sub&gt;由該閥室內徑斜下流出，該內出口有遠端點E&lt;sub&gt;3&lt;/sub&gt;與近端點E&lt;sub&gt;4&lt;/sub&gt;。該閥塞打開時，該閥塞底部與該閥座形成一徑向流道，高度為B&lt;sub&gt;1&lt;/sub&gt;，流體由該中心孔流出做轉角B並進入該徑向流道做輻射流動成擴散C，含噴流S&lt;sub&gt;121&lt;/sub&gt;與緩流S&lt;sub&gt;122&lt;/sub&gt;，並做轉角D進入該內出口後在該出口流道內混合並做轉角E由該閥出口流出。</p>
        <p type="p">其專利特徵為：</p>
        <p type="p">該入口中心線具有彎曲圓弧的平順流線，轉角A的角度為2θ&lt;sub&gt;1&lt;/sub&gt;，55°&lt;img align="absmiddle" height="15px" width="13px" file="d10059.TIF" alt="其他非圖式ed10059.png" img-content="character" orientation="portrait" inline="no" giffile="ed10059.png"/&gt;2θ&lt;sub&gt;1&lt;/sub&gt;&lt;img align="absmiddle" height="15px" width="15px" file="d10060.TIF" alt="其他非圖式ed10060.png" img-content="character" orientation="portrait" inline="no" giffile="ed10060.png"/&gt;105°；該環形槽裝設在該閥座外圍其底部具有一斜面，其斜角β；該出口流道其該出口中心線S&lt;sub&gt;2&lt;/sub&gt;為斜下具有平順流線，該內出口裝設於該閥室內徑，出口流道上緣線S&lt;sub&gt;2a&lt;/sub&gt;的轉角E的角度為2θ&lt;sub&gt;21&lt;/sub&gt;，30°&lt;img align="absmiddle" height="15px" width="15px" file="d10061.TIF" alt="其他非圖式ed10061.png" img-content="character" orientation="portrait" inline="no" giffile="ed10061.png"/&gt;2θ&lt;sub&gt;21&lt;/sub&gt;&lt;img align="absmiddle" height="15px" width="15px" file="d10062.TIF" alt="其他非圖式ed10062.png" img-content="character" orientation="portrait" inline="no" giffile="ed10062.png"/&gt;90°，近端點E&lt;sub&gt;4&lt;/sub&gt;與該斜面底部相通且近端點E&lt;sub&gt;4&lt;/sub&gt;的高度LH&lt;sub&gt;5&lt;/sub&gt;，-0.4&lt;img align="absmiddle" height="15px" width="15px" file="d10063.TIF" alt="其他非圖式ed10063.png" img-content="character" orientation="portrait" inline="no" giffile="ed10063.png"/&gt;LH&lt;sub&gt;5&lt;/sub&gt;/d&lt;sub&gt;0&lt;/sub&gt;&lt;img align="absmiddle" height="16px" width="14px" file="d10064.TIF" alt="其他非圖式ed10064.png" img-content="character" orientation="portrait" inline="no" giffile="ed10064.png"/&gt;0.4；噴流S&lt;sub&gt;121&lt;/sub&gt;與緩流S&lt;sub&gt;122&lt;/sub&gt;經擴散C做轉角D後能進入該出口流道並產生分流，在該閥室與該內出口都沒有流動干涉產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an improved valve flow channel in a cut-off valve with a low head loss coefficient ξ that meets ESG requirement. For example, in a valve flow channel having an inner diameter d&lt;sub&gt;0&lt;/sub&gt; = 52.5mm and an inner diameter ratio &lt;img align="absmiddle" height="37px" width="38px" file="d10070.TIF" alt="其他非圖式ed10070.png" img-content="character" orientation="portrait" inline="no" giffile="ed10070.png"/&gt;2.0, the head loss coefficient of the present invention satisfies 1.7 &lt;img align="absmiddle" height="16px" width="13px" file="d10065.TIF" alt="其他非圖式ed10065.png" img-content="character" orientation="portrait" inline="no" giffile="ed10065.png"/&gt; ξ &lt;img align="absmiddle" height="15px" width="13px" file="d10066.TIF" alt="其他非圖式ed10066.png" img-content="character" orientation="portrait" inline="no" giffile="ed10066.png"/&gt; 3.0 and 100 &lt;img align="absmiddle" height="16px" width="15px" file="d10067.TIF" alt="其他非圖式ed10067.png" img-content="character" orientation="portrait" inline="no" giffile="ed10067.png"/&gt; C&lt;sub&gt;v&lt;/sub&gt;&lt;img align="absmiddle" height="17px" width="16px" file="d10068.TIF" alt="其他非圖式ed10068.png" img-content="character" orientation="portrait" inline="no" giffile="ed10068.png"/&gt; 73.5. This performance is superior to that of a conventional cut-off valve, in which the head loss coefficient ξ &lt;img align="absmiddle" height="15px" width="13px" file="d10069.TIF" alt="其他非圖式ed10069.png" img-content="character" orientation="portrait" inline="no" giffile="ed10069.png"/&gt; 3.4. The valve flow channel includes a valve chamber, an annular groove, an inlet flow channel, a valve entrance, a valve base, an outlet flow channel, and a valve exit. The valve entrance and the valve exit are, respectively, disposed on two sides of the valve body and are horizontally arranged. A pipe axis XL&lt;sub&gt;2&lt;/sub&gt;, with a horizontal reference, passes through a center point of the valve exit and a center point of the valve entrance. A valve plug, the valve base, and the annular groove are disposed in the valve chamber, with the valve plug and the valve base vertically coupled to allow opening and closing. The valve base includes a central hole and a sealing surface. The central hole has a height LH&lt;sub&gt;1&lt;/sub&gt; and a central point P&lt;sub&gt;1&lt;/sub&gt;. The sealing surface has a height LH&lt;sub&gt;3&lt;/sub&gt;, which provides a highly reliable sealing effect. The inlet flow channel includes the valve entrance and an entrance central line S&lt;sub&gt;1&lt;/sub&gt;, allowing a flow to flow therein horizontally and then turn upward at an angle A to exit through the central hole of the valve base. The angle A is 2θ&lt;sub&gt;1&lt;/sub&gt;. The outlet flow channel includes the valve exit, an internal outlet, and an exit central line S&lt;sub&gt;2&lt;/sub&gt;, allowing the flow to flow out from the valve chamber in a downward slant. The internal outlet has a distal end point E&lt;sub&gt;3&lt;/sub&gt; and a proximal end point E&lt;sub&gt;4&lt;/sub&gt;. When the valve plug is opened, the bottom of the valve plug and the valve base form a radial flow channel with a height B&lt;sub&gt;1&lt;/sub&gt;, allowing the flow to flow out from the central hole and tun at an angle B to enter the radial flow channel, thus flowing radially to form a diffusive flow C, which include a jet flow S&lt;sub&gt;121&lt;/sub&gt; and a slow flow S&lt;sub&gt;122&lt;/sub&gt;. The flow, after that, turns at an angle D to enter the internal outlet, mixed in the outlet flow channel, and then turns at an angle E to flow out through the valve exit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:閥室</p>
        <p type="p">51:閥座</p>
        <p type="p">510:密封面</p>
        <p type="p">511:密封環</p>
        <p type="p">53:環形槽</p>
        <p type="p">531:斜面</p>
        <p type="p">54:閥塞</p>
        <p type="p">542:內凹面</p>
        <p type="p">6:入口流道</p>
        <p type="p">63:中心孔</p>
        <p type="p">7:徑向流道</p>
        <p type="p">8:出口流道</p>
        <p type="p">82:內出口</p>
        <p type="p">S:流線</p>
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;:入口中心線</p>
        <p type="p">S&lt;sub&gt;1a&lt;/sub&gt;:入口流道上緣線</p>
        <p type="p">S&lt;sub&gt;1b&lt;/sub&gt;:入口流道下緣線</p>
        <p type="p">S&lt;sub&gt;12&lt;/sub&gt;:徑向中心線</p>
        <p type="p">S&lt;sub&gt;121&lt;/sub&gt;:噴流</p>
        <p type="p">S&lt;sub&gt;122&lt;/sub&gt;:緩流</p>
        <p type="p">S&lt;sub&gt;2&lt;/sub&gt;:出口中心線</p>
        <p type="p">S&lt;sub&gt;2a&lt;/sub&gt;:出口流道上緣線</p>
        <p type="p">S&lt;sub&gt;2b&lt;/sub&gt;:出口流道下緣線</p>
        <p type="p">A:轉角A</p>
        <p type="p">B:轉角B</p>
        <p type="p">C:擴散C</p>
        <p type="p">D:轉角D</p>
        <p type="p">D1:噴流S&lt;sub&gt;121&lt;/sub&gt;在轉角D的轉角D1</p>
        <p type="p">D2:緩流S&lt;sub&gt;122&lt;/sub&gt;在轉角D的轉角D2</p>
        <p type="p">E:轉角E</p>
        <p type="p">d&lt;sub&gt;3&lt;/sub&gt;:閥室內徑</p>
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:閥座外徑</p>
        <p type="p">d&lt;sub&gt;0&lt;/sub&gt;:閥入口直徑/閥出口直徑/中心孔直徑</p>
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;:中心孔的中心點</p>
        <p type="p">P&lt;sub&gt;2&lt;/sub&gt;:閥入口的中心點</p>
        <p type="p">P&lt;sub&gt;3&lt;/sub&gt;:內出口的中心點</p>
        <p type="p">P&lt;sub&gt;4&lt;/sub&gt;:閥出口的中心點</p>
        <p type="p">XL&lt;sub&gt;2&lt;/sub&gt;:管軸線</p>
        <p type="p">E&lt;sub&gt;3&lt;/sub&gt;:內出口的遠端點</p>
        <p type="p">E&lt;sub&gt;4&lt;/sub&gt;:內出口的近端點</p>
        <p type="p">E&lt;sub&gt;5&lt;/sub&gt;:閥出口的遠端點</p>
        <p type="p">E&lt;sub&gt;6&lt;/sub&gt;:閥出口的近端點</p>
        <p type="p">E&lt;sub&gt;7&lt;/sub&gt;:閥入口的遠端點</p>
        <p type="p">E&lt;sub&gt;8&lt;/sub&gt;:閥入口的近端點</p>
        <p type="p">LH&lt;sub&gt;1&lt;/sub&gt;:中心點P&lt;sub&gt;1&lt;/sub&gt;的高度</p>
        <p type="p">LH&lt;sub&gt;2&lt;/sub&gt;:中心點P&lt;sub&gt;3&lt;/sub&gt;的高度</p>
        <p type="p">LH&lt;sub&gt;3&lt;/sub&gt;:密封面的高度</p>
        <p type="p">LH&lt;sub&gt;4&lt;/sub&gt;:遠端點E&lt;sub&gt;3&lt;/sub&gt;的高度</p>
        <p type="p">LH&lt;sub&gt;5&lt;/sub&gt;:近端點E&lt;sub&gt;4&lt;/sub&gt;的高度</p>
        <p type="p">LH&lt;sub&gt;6&lt;/sub&gt;:徑向流道的高度</p>
        <p type="p">H&lt;sub&gt;1&lt;/sub&gt;:遠端點E&lt;sub&gt;3&lt;/sub&gt;相對於密封面的高度差</p>
        <p type="p">LL&lt;sub&gt;2&lt;/sub&gt;:中心點P&lt;sub&gt;3&lt;/sub&gt;與中心點P&lt;sub&gt;4&lt;/sub&gt;的水平距離</p>
        <p type="p">LL&lt;sub&gt;21&lt;/sub&gt;:出口中心線S&lt;sub&gt;2&lt;/sub&gt;之圓弧曲線的水平距離</p>
        <p type="p">B&lt;sub&gt;1&lt;/sub&gt;:閥開度</p>
        <p type="p">B&lt;sub&gt;2&lt;/sub&gt;:環形空間</p>
        <p type="p">B&lt;sub&gt;3&lt;/sub&gt;:徑向間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="890" publication-number="202619142">
    <tif-files tif-type="multi-tif">
      <tif file="113147343.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池放電均衡品質之直觀量化方法及採用其之電池管理系統</chinese-title>
        <english-title>METHOD FOR INTUITIVE QUANTIFICATION OF BATTERY DISCHARGE BALANCING QUALITY AND BATTERY MANAGEMENT SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">H01M10/44</main-classification>
        <further-classification edition="200601120250327B">H01M10/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碩天科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYBER POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泓輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HUNG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳大鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TA-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡鴻鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池放電均衡品質之直觀量化方法及一種採用其之電池管理系統。所述方法適用於至少一電池串。該方法包括下列步驟：計算一電池放電平衡指標(B_DQ)；以及判斷電池串的數量是否為1；當電池串的數量不為1時，計算一電池串放電平衡指標(S_DQ)，而當電池串的數量為1時，賦予該電池串放電平衡指標(S_DQ)的值為100%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for intuitive quantification of battery discharge balancing quality and a battery management system using the same are provided. The method comprises the following steps: calculating a battery discharge balancing index (B_DQ); and determining whether the number of battery strings is equal to 1; if not, calculating a string discharge balancing index (S_DQ); if so, assigning a value of 100% to the string discharge balancing index (S_DQ).</p>
      </isu-abst>
      <representative-img>
        <p type="p">S202~S208:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="891" publication-number="202618417">
    <tif-files tif-type="multi-tif">
      <tif file="113147701.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板、背光模組以及顯示裝置</chinese-title>
        <english-title>PRINTED CIRCUIT BOARD, BACKLIGHT MODULE AND DIPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">G02F1/133</main-classification>
        <further-classification edition="200601120250106B">G02F1/13357</further-classification>
        <further-classification edition="200601120250106B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞儀光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADIANT OPTO-ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾智賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉修宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, HSIU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶員</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊素英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SU-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，具有一顯示面板位於一光學膜片組以及一背光模組的上方，該背光模組設有一電路板，該電路板設有複數個金屬單元以及至少一電子元件，其中該些金屬單元以一對一設置於該電路板的複數個凹部，該些凹部間格排列在該電路板的周邊，使該些金屬單元包圍該至少一電子元件，且該些金屬單元彼此電性連接形成至少一接地路徑，其中該至少一電子元件為發光元件。本發明使該發光元件能夠更靠近該電路板的邊緣減少邊框區域的暗帶，同時也具有防止雜訊干擾的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device comprises a diplay panel positioned above an optical film set and a backlight module. The backlight module is equipped with a printed circuit board that had multiple metal units and at least one electronic component. The metal units are individually placed in multiple recessed portions of the printed circuit board, which are arreanged at intercals around the periphery of the printed circuit board. The metal units surround the at least one electronic component and are electrically connected to each other, forming at least one grounding path. The at least one electronic component is a light-emitting element. This invention allows the light-emitting element to be placed closer to the edge of the circuit board, reducing the dark band in the border area, while also providing the function of preventing noise interference.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板</p>
        <p type="p">10:金屬單元</p>
        <p type="p">11:壁面</p>
        <p type="p">12:端部</p>
        <p type="p">20:油墨層</p>
        <p type="p">30:金屬層</p>
        <p type="p">40:絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="892" publication-number="202619469">
    <tif-files tif-type="multi-tif">
      <tif file="113147809.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250619B">H10B10/00</main-classification>
        <further-classification edition="202501120250619B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡志軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭遠清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YUAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏劭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹詠翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塗嘉譽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構與方法。方法包括形成多個奈米結構於基板上；沉積介電層以包覆奈米結構；形成遮罩層於介電層上；回蝕刻遮罩層，使遮罩層的上表面齊平或低於奈米結構的最頂部奈米結構的上表面；進行處理以減少奈米結構的最頂部奈米結構的厚度；在進行處理之後，選擇性移除遮罩層；以及形成閘極於介電層上，以包覆奈米結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor structures and methods are provided. An exemplary method according to the present disclosure includes forming a plurality of nanostructures over a substrate, depositing a dielectric layer to wrap around the plurality of nanostructures, forming a mask layer over the dielectric layer, etching back the mask layer such that a top surface of the mask layer is coplanar with or lower than a top surface of a topmost nanostructure of the plurality of nanostructures, performing a treatment to reduce a thickness of the topmost nanostructure of the plurality of nanostructures, after the performing of the treatment, selectively removing the mask layer, and forming a gate electrode over the dielectric layer to wrap around the plurality of nanostructures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:結構</p>
        <p type="p">200A:第一裝置區</p>
        <p type="p">200B:第二裝置區</p>
        <p type="p">208A,208A1,208A2,208A3,208A4,208B,208B1',208B2,208B3,208B4:通道組件</p>
        <p type="p">240a,240b:界面層</p>
        <p type="p">242:高介電常數的介電層</p>
        <p type="p">244:硬遮罩層</p>
        <p type="p">246:保護層</p>
        <p type="p">250:電漿處理製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="893" publication-number="202617289">
    <tif-files tif-type="multi-tif">
      <tif file="113148043.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包裝盒清洗機</chinese-title>
        <english-title>PACKAGING BOX WASHING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250630B">B08B9/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金英俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申崇舍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SEUNG SUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金順碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOON SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之包裝盒清洗機可包括：投入部，其設置為使保冷包裝盒以展平之狀態投入，該保冷包裝盒係設置為可轉換成展開模式或盒子模式者；清洗部，其設置為一面沿第1方向移送所投入之上述保冷包裝盒，一面進行清洗；及排出部，其設置為排出經清洗之上述保冷包裝盒；且上述清洗部包括設置有擦拭上述保冷包裝盒之表面之清洗面之至少一個清洗毛巾，上述清洗毛巾設置為以垂直於上述清洗面之軸為中心來旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:包裝盒清洗機</p>
        <p type="p">10:投入部</p>
        <p type="p">20:清洗部</p>
        <p type="p">20a:清洗區域</p>
        <p type="p">20b:驅動區域</p>
        <p type="p">24:罩蓋部</p>
        <p type="p">25,26:門</p>
        <p type="p">27:壓力計</p>
        <p type="p">30:排出部</p>
        <p type="p">40:條碼讀取器</p>
        <p type="p">50:感測部</p>
        <p type="p">60:操作部</p>
        <p type="p">70:緊急停止按鈕</p>
        <p type="p">81:排水管道</p>
        <p type="p">90:廢水箱</p>
        <p type="p">400:清洗水箱</p>
        <p type="p">430:注入口</p>
        <p type="p">A:移動路徑</p>
        <p type="p">P:保冷包裝盒</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="894" publication-number="202618362">
    <tif-files tif-type="multi-tif">
      <tif file="113148521.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體光子裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PHOTONICS DEVICES AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">G02B6/136</main-classification>
        <further-classification edition="200601120250422B">G02B6/132</further-classification>
        <further-classification edition="200601120250422B">G02B6/13</further-classification>
        <further-classification edition="200601120250422B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEN-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUI, FELIX YINGKIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體光子裝置的波導結構（例如，介電邊緣耦合器波導、金屬邊緣耦合器波導）透過使用高溫處理技術來形成並進行處理，以在形成該半導體光子裝置的多個半導體光子組件之前實現波導結構的低氫濃度。所述多個半導體光子組件容易受到高溫處理而損壞，例如金屬矽化物層和/或半導體類的光偵測器吸收區域。波導結構的高溫處理可以作為半導體光子裝置的其他結構的高溫處理操作的一部分來執行，例如半導體光子裝置的電晶體結構的源極/汲極區域的退火操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waveguide structure (e.g., a dielectric edge coupler waveguide, a metal edge coupler waveguide) of a semiconductor photonics device is formed and processed using high-temperature processing techniques to achieve a low hydrogen concentration for the waveguide structure prior to formation of semiconductor photonics components of the semiconductor photonics device that are susceptible to damage from high-temperature processing such as metal silicide layers and/or semiconductor-based photodetector absorption regions. The high-temperature processing of the waveguide structure may be performed as part of a high-temperature processing operation for other structures of the semiconductor photonics device, such as an annealing operation for source/drain regions of transistor structures of the semiconductor photonics device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8900:製程</p>
        <p type="p">910、920、930、940、950、960、970:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="895" publication-number="202618942">
    <tif-files tif-type="multi-tif">
      <tif file="113148561.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成半導體封裝的方法</chinese-title>
        <english-title>METHODS OF FORMING SEMICONDUCTOR PACKAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250509B">H01L21/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴世恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, SHIH-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪展羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳斐筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪文瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一個或多個介電插入物形成於穿基板互連結構中，以防止、最小化和/或以其他方式減少在穿基板互連結構平坦化期間發生在穿基板互連結構頂部面的凹陷量。介電插入物由具有比穿基板互連結構金屬材料硬度更大的硬度的介電材料形成。更大的硬度使介電插入物能夠在穿基板互連結構平坦化期間抵抗材料移除，這使得能夠在穿基板互連結構頂部面達成高均勻性的材料移除速率。在穿基板互連結構平坦化期間減少的凹陷量減少了從穿基板互連結構側壁與基板層之間的一個或多個襯層移除襯層材料的可能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One or more dielectric inserts are formed in a through-substrate interconnect structure to prevent, minimize, and/or otherwise reduce the amount of dishing that occurs in the top surface of the through-substrate interconnect structure during planarization of the through-substrate interconnect structure. The dielectric insert(s) are formed of a dielectric material having a hardness that is greater than the hardness of the metal material of the through-substrate interconnect structure. The greater hardness enables the dielectric insert(s) to resist material removal during planarization of the through-substrate interconnect structure, which enables a high uniformity in the material removal rates across the top surface of the through-substrate interconnect structure to be achieved. The reduced amount of dishing during planarization of the through-substrate interconnect structure reduces the likelihood of removal of liner material from one or more liners between the sidewalls of the through-substrate interconnect structure and the substrate layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">102、104:半導體晶粒</p>
        <p type="p">106:接合介面</p>
        <p type="p">108、112:裝置層</p>
        <p type="p">110、114、132:互連層</p>
        <p type="p">116、118:積體電路裝置</p>
        <p type="p">122、128、136:導電結構</p>
        <p type="p">124、130:接合墊</p>
        <p type="p">126、134、120:介電層</p>
        <p type="p">128、136:導電結構</p>
        <p type="p">138:連接結構</p>
        <p type="p">140:穿基板互連結構</p>
        <p type="p">142、144:襯層</p>
        <p type="p">146:介電插入物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="896" publication-number="202618605">
    <tif-files tif-type="multi-tif">
      <tif file="113148563.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造半導體裝置的系統</chinese-title>
        <english-title>SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250508B">G06F30/392</main-classification>
        <further-classification edition="200601120250508B">H01L21/67</further-classification>
        <further-classification edition="202501120250508B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芳懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FANGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐紘誌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, HUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統（用於製造半導體裝置）包括表示半導體裝置的未驗證主體佈局圖，系統被配置為產生以下內容：特徵提取模組，配置為提取至少部分包含未驗證主體佈局圖的主體特徵；以及設計規則（DR）執行模組，包括設計規則檢查（DRC）模組和佈局圖修改器（LDM）模組，DRC模組被配置為檢查主體特徵是否符合設定中對應的設計規則，並識別哪些設計規則被違反以及對應的違反DR的主體特徵，LDM模組被配置為嘗試通過修改違反DR的主體特徵來減少DR違規，從而產生經驗證主體佈局圖；DRC模組基於第一神經網路；以及LDM模組基於第二神經網路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system (for manufacturing a semiconductor device) includes an unvalidated subject layout diagram representing the semiconductor device, the system being configured to generate the following including: a feature extractor module configured to extract subject features that at least partially comprise the unvalidated subject layout diagram; and a design rule (DR) enforcement module including a DR checker (DRC) module and layout diagram modifier (LDM) module, the DRC module being configured to check the subject features for compliance with corresponding design rules in a set thereof and to identify which of the design rules are being violated and corresponding DR-violating subject features, and the LDM module being configured to attempt reducing the DR violations by modifying the DR-violating subject features resulting in a validated subject layout diagram; the DRC module being based on a first neural network; and the LDM module being based on a second neural network.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:系統</p>
        <p type="p">102A:DRE模組</p>
        <p type="p">103:未驗證主體佈局圖</p>
        <p type="p">104(1):特徵提取模組</p>
        <p type="p">106:DRC模組</p>
        <p type="p">110(1):輸入層</p>
        <p type="p">112(1):深度神經網路</p>
        <p type="p">114(1):輸出層</p>
        <p type="p">116:閥門</p>
        <p type="p">118(1)、118(2)、118(3):Conv2D層</p>
        <p type="p">120(1)、120(2)、120(3):匯集層</p>
        <p type="p">122(1)、122(2):FC層</p>
        <p type="p">124:捨棄層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="897" publication-number="202618433">
    <tif-files tif-type="multi-tif">
      <tif file="113148564.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>罩幕、製造罩幕的方法以及製造半導體裝置的方法</chinese-title>
        <english-title>MASKS, METHODS OF MANUFACTURING MASKS, AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250801B">G03F1/24</main-classification>
        <further-classification edition="201201120250801B">G03F1/48</further-classification>
        <further-classification edition="201201120250801B">G03F1/58</further-classification>
        <further-classification edition="201201120250801B">G03F1/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊世豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建荺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">罩幕包括反射多層堆疊、在反射多層堆疊之上的蓋層、在蓋層之上的吸收層，以及以下的至少一者：在反射多層堆疊與蓋層之間的緩衝層，和在蓋層與吸收層之間的保護層。製造罩幕的方法包括形成反射多層堆疊、在反射多層堆疊之上形成蓋層、在蓋層之上形成吸收層，以及形成以下的至少之一者：在形成蓋層之前在反射多層堆疊之上形成緩衝層，和在形成吸收層之前在蓋層之上形成保護層。製造半導體裝置的方法包括將輻射引導到罩幕，並將來自罩幕的圖案化光反射到配置在基底上的光阻層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mask includes a reflective multilayered stack, a capping layer over the reflective multilayered stack, an absorber layer over the capping layer, and at least one of: a buffer layer between the reflective multilayered stack and the capping layer, and a protection layer between the capping layer and the absorber layer. A method of manufacturing a mask includes forming a reflective multilayered stack, forming a capping layer over the reflective multilayered stack, forming an absorber layer over the capping layer, and forming at least one of the following: a buffer layer over the reflective multilayered stack before forming the capping layer, and a protection layer over the capping layer before forming the absorber layer. A method of manufacturing a semiconductor device includes directing radiation to a mask and reflecting patterned light from the mask and onto a photoresist layer disposed on a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:罩幕基底</p>
        <p type="p">15:導電背側塗覆層</p>
        <p type="p">17:鉬層</p>
        <p type="p">19:矽層</p>
        <p type="p">20:反射多層堆疊/多層堆疊</p>
        <p type="p">23:緩衝層</p>
        <p type="p">25:蓋層</p>
        <p type="p">27:保護層</p>
        <p type="p">30:吸收層</p>
        <p type="p">35:抗反射層</p>
        <p type="p">50:電路圖案</p>
        <p type="p">70:黑界區域</p>
        <p type="p">205c:罩幕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="898" publication-number="202619376">
    <tif-files tif-type="multi-tif">
      <tif file="113148684.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>室內網路通訊設備定位方法及系統</chinese-title>
        <english-title>INDOOR NETWORK COMMUNICATION EQUIPMENT POSITIONING METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">H04W4/02</main-classification>
        <further-classification edition="200901120250203B">H04W64/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英華達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC APPLIANCES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李哲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭智軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的室內網路通訊設備定位方法用以定位設置於一室內區域的至少一設備端。室內網路通訊設備定位方法包含以下步驟：透過衛星定位取得一移動終端的一初始位置；根據慣性導航以及初始位置取得移動終端於室內區域的複數個錨點位置；移動終端於該等錨點位置量測並取得與至少一設備端之間的複數個量測距離，其中每一錨點位置對應一量測距離；以及根據一定位演算法分析該等錨點位置以及該等量測距離以計算出至少一設備端於室內區域的一設置位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An indoor network communication equipment positioning method is configured for positioning at least one equipment end disposed in an indoor area. The method includes the following steps of: obtaining an initial position of a mobile terminal through the satellite positioning; obtaining a plurality of anchor positions of the mobile terminal in the indoor area according to the initial position and the inertial navigation; the mobile terminal measures and obtains a plurality of measuring distances with the equipment end at the anchor positions, wherein each of the anchor positions is corresponding to a measuring distance; and analyzing the anchor positions and the measuring distances by a positioning algorithm to compute a configuration position of the equipment end in the indoor area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="899" publication-number="202618646">
    <tif-files tif-type="multi-tif">
      <tif file="113148728.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生商品之詳細資訊之方法及其電子裝置</chinese-title>
        <english-title>METHOD OF GENERATING DETAIL INFORMATION ON ITEM AND ELECTRONIC APPARATUS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>
        <further-classification edition="202301120250801B">G06Q30/02</further-classification>
        <further-classification edition="201901120250801B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例，可提供一種方法，其係由電子裝置產生商品之資訊者，且包括如下步驟：藉由用戶終端上顯示之介面獲得第1商品之第1詳細資訊；將第1詳細資訊輸入至已基於自至少一個資料庫獲得之與第1商品相關之第2詳細資訊進行了機器學習之人工智慧模型；人工智慧模型輸出與第1商品相關之第3詳細資訊；及向用戶終端提供第3詳細資訊。根據另一實施例，可提供一種實行方法之電子裝置。根據又一實施例，可提供一種記錄有用以實行方法之電腦程式之電腦可讀記錄媒體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="900" publication-number="202618943">
    <tif-files tif-type="multi-tif">
      <tif file="113148864.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250415B">H01L21/60</main-classification>
        <further-classification edition="200601120250415B">H01L21/76</further-classification>
        <further-classification edition="200601120250415B">H01L21/768</further-classification>
        <further-classification edition="200601120250415B">H01L23/525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃凱平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KAI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王紹芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONG, SIAUUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈尚賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SHANG-HSIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程冠倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUAN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括與主動區相交的閘極線，以及在主動區以及閘極線之間形成並被配置為作為反熔絲結構而發揮功能的閘極介電層。製造半導體裝置的方法包括形成主動區以及與主動區相交的多個閘極，以及在主動區以及閘極之間形成被配置為作為反熔絲結構而發揮功能的閘極介電材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes gate lines intersecting an active region, and a gate dielectric layer formed between the active region and the gate lines and that is configured to function as anti-fuse structure. A method of manufacturing a semiconductor device includes forming an active region and a plurality of gates intersecting the active region, and forming a gate dielectric material configured to function as an anti-fuse structure between the active region and the gates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">WL&lt;sub&gt;n&lt;/sub&gt;、WL&lt;sub&gt;n+1&lt;/sub&gt;:字元線</p>
        <p type="p">SL&lt;sub&gt;n&lt;/sub&gt;、SL&lt;sub&gt;n+1&lt;/sub&gt;:選擇線</p>
        <p type="p">BL&lt;sub&gt;m&lt;/sub&gt;:位元線</p>
        <p type="p">68:裝置</p>
        <p type="p">70:共用主動區</p>
        <p type="p">74、76、78、80:閘極線</p>
        <p type="p">86:CPODE/隔離結構</p>
        <p type="p">92、94:擴散線</p>
        <p type="p">104:基板</p>
        <p type="p">106:隔離區</p>
        <p type="p">108:半導體層</p>
        <p type="p">110:面積</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="901" publication-number="202618889">
    <tif-files tif-type="multi-tif">
      <tif file="113148949.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">H01L21/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONIK IPS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金相旼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹智燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, JEE CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李燦雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHAN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹元俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, WON JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明一態樣的基板處理方法，利用基板處理裝置，所述基板處理裝置包括：製程腔室，在內部形成有反應空間；氣體噴射部，為了向所述反應空間供應製程氣體而設置在所述製程腔室；以及基板支撐部，為了支撐基板，與所述氣體噴射部相向地設置在所述製程腔室。所述基板處理方法包括以下步驟：在所述製程腔室的內部形成處理層；在形成有所述處理層的所述製程腔室內所述基板支撐部上放置基板；在放置於所述基板支撐部上的所述基板上形成薄膜；其中，所述處理層至少包含鉬化合物，所述薄膜至少包含鉬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無        &lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">S20:步驟</p>
        <p type="p">S40:步驟</p>
        <p type="p">S50:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="902" publication-number="202619253">
    <tif-files tif-type="multi-tif">
      <tif file="113149061.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片頻率控制線路、BUCK電源及晶片頻率控制方法</chinese-title>
        <english-title>CIRCUIT FOR CONTROLLING CHIP FREQUENCY, BUCK POWER SUPPLY, AND METHOD FOR CONTROLLING CHIP FREQUENCY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">H02M3/156</main-classification>
        <further-classification edition="200601120250328B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商上海新進芯微電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BCD SHANGHAI MICRO-ELECTRONICS COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竇森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOU, SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請揭露了一種晶片頻率控制線路、BUCK電源及晶片頻率控制方法，其應用於電力電子技術領域。降頻控制單元之輸入端接入BUCK電源之輸出電壓回饋信號，降頻控制單元之輸出端與時脈振盪器之控制端連接，用於根據輸出電壓回饋信號調節時脈振盪器輸出之時脈信號之頻率。輸出電壓回饋信號之大小與時脈信號之頻率呈負相關。時脈振盪器將時脈信號輸出至開關電晶體控制單元，開關電晶體控制單元根據時脈信號驅動電壓控制開關電晶體導通。由於此線路係直接改變晶片時脈振盪器之時脈信號頻率，電壓控制開關電晶體開通處及關斷處對應之FB電壓相對固定，不同週期之佔空比差異小，最後得到的電感電流脈衝幅度呈均勻分佈，從而達成頻率之線性平滑調節。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a circuit for controlling a chip frequency, a BUCK power supply, and a method for controlling a chip frequency, applied in the technical field of power electronics. An input terminal of a frequency reduction control unit receives an output voltage feedback signal of the BUCK power supply. An output terminal of the frequency reduction control unit is connected to a control terminal of a clock oscillator, and is configured to regulate a frequency of a clock signal outputted by the clock oscillator based on the output voltage feedback signal. A magnitude of the output voltage feedback signal is negatively correlated with the frequency of the clock signal. The clock oscillator outputs the clock signal to a control unit for a switching transistor. The control unit for the switching transistor turns on a voltage-controlled switching transistor based on the clock signal. With the above circuit, the frequency of the clock signal of the chip clock oscillator is directly changed, an FB voltage corresponding to an on position and an off position of the voltage-controlled switching transistor is relatively constant, and a duty cycle has little difference in different cycles, so that a pulse amplitude of an inductor current is uniformly distributed, thereby achieving a linear and smooth regulation of the frequency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CLK:時脈信號/時脈頻率/信號</p>
        <p type="p">COMP1:回饋電壓比較器</p>
        <p type="p">COMP2:電感電流峰值比較器</p>
        <p type="p">DFF:D正反器</p>
        <p type="p">Driver:經驅動電路/驅動電路</p>
        <p type="p">EA1:運算放大器/第一運算放大器</p>
        <p type="p">FB:回饋信號/輸出電壓回饋信號/電壓/輸出回饋電壓/回饋電壓</p>
        <p type="p">OSC:時脈振盪器/內建時脈振盪器/晶片內部時脈振盪器</p>
        <p type="p">Q0:MOS電晶體/晶片內部MOS電晶體/電壓控制開關電晶體</p>
        <p type="p">R&lt;sub&gt;CS&lt;/sub&gt;:電阻</p>
        <p type="p">V&lt;sub&gt;LIMIT&lt;/sub&gt;:電壓/臨限電壓</p>
        <p type="p">V&lt;sub&gt;REF1&lt;/sub&gt;:第一基準電壓</p>
        <p type="p">V&lt;sub&gt;REF2&lt;/sub&gt;:第二基準電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="903" publication-number="202618588">
    <tif-files tif-type="multi-tif">
      <tif file="113149065.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理資訊之裝置及其方法</chinese-title>
        <english-title>APPARATUS FOR PROCESSING INFORMATION AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250908B">G06F17/40</main-classification>
        <further-classification edition="201901120250908B">G06F16/9535</further-classification>
        <further-classification edition="202301120250908B">G06Q30/02</further-classification>
        <further-classification edition="201201120250908B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示一種於電子裝置中處理資訊之方法，其包括如下步驟：確認成為測試對象之代碼資訊；獲得與代碼資訊相關聯之一個以上之關鍵字；及確認顧客活動是否滿足與測試及一個以上之關鍵字相關聯之條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電子裝置</p>
        <p type="p">120:顧客之裝置</p>
        <p type="p">130:作業人員之裝置</p>
        <p type="p">201:動作</p>
        <p type="p">202:動作</p>
        <p type="p">203:動作</p>
        <p type="p">204:動作</p>
        <p type="p">205:動作</p>
        <p type="p">206:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="904" publication-number="202618639">
    <tif-files tif-type="multi-tif">
      <tif file="113149294.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618639</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管理結算之電子裝置之動作方法及支持其之電子裝置</chinese-title>
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR MANAGING PAYMENT AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250602B">G06Q30/01</main-classification>
        <further-classification edition="202301120250602B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尚范</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金平錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, PYOG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雄珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, WOONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李江濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIANGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙俊峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JUNFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本文所揭示之實施例，結算管理方法係藉由電子裝置而實行者，其可包括如下步驟：基於設定之條件而確認已加入會員資格之用戶中之結算目標用戶清單；針對上述結算目標用戶清單而進行與上述會員資格相關之結算；及獲得與上述結算目標用戶清單對應之結算處理資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伺服器設備</p>
        <p type="p">200:用戶設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="905" publication-number="202619092">
    <tif-files tif-type="multi-tif">
      <tif file="113149358.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路、積體裝置及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT, INTEGRATED DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250424B">H01L23/48</main-classification>
        <further-classification edition="200601120250424B">H01L23/50</further-classification>
        <further-classification edition="200601120250424B">H01L23/535</further-classification>
        <further-classification edition="200601120250424B">H01L21/60</further-classification>
        <further-classification edition="200601120250424B">H01L21/768</further-classification>
        <further-classification edition="200601120250424B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金書正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, SHU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭光茗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEI, KONG-BENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些實施例涉及積體裝置，包括：基底，包括頂表面；半導體裝置，在基底上；內連線結構，覆蓋基底並耦合到半導體裝置；第一導電墊，耦合到內連線結構，其中第一導電墊具有第一上表面，位於高於基底頂表面第一高度處，以及第二上表面，位於高於基底頂表面第二高度處，其中第一高度大於第二高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments relate to an integrated device, including: a substrate comprising a top surface; a semiconductor device on the substrate; an interconnect structure overlying the substrate and coupled to the semiconductor device; a first conductive pad coupled to the interconnect structure, wherein the first conductive pad has a first upper surface at a first height above the top surface of the substrate, and a second upper surface a second height above the top surface of the substrate, wherein the first height is greater than the second height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:剖視圖</p>
        <p type="p">102:基底</p>
        <p type="p">102a:頂表面</p>
        <p type="p">104:半導體裝置</p>
        <p type="p">106:內連線結構</p>
        <p type="p">108:線層</p>
        <p type="p">110:通孔層</p>
        <p type="p">110a:通孔</p>
        <p type="p">112:接觸件</p>
        <p type="p">114:層間介電層</p>
        <p type="p">116:導電墊</p>
        <p type="p">118:第一上表面</p>
        <p type="p">119:第一高度</p>
        <p type="p">120:第二上表面</p>
        <p type="p">121:第二高度</p>
        <p type="p">122:第三上表面</p>
        <p type="p">123:第三高度</p>
        <p type="p">124:溝槽</p>
        <p type="p">126:突出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="906" publication-number="202617277">
    <tif-files tif-type="multi-tif">
      <tif file="113149479.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體加工工具、其清潔元件及清潔半導體加工工具之方法</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING TOOL, CLEANING MEMBER THEREOF, AND METHOD FOR CLEANING SEMICONDUCTOR PROCESSING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250926B">B08B1/10</main-classification>
        <further-classification edition="200601120250926B">B08B11/00</further-classification>
        <further-classification edition="200601120250926B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張浩銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一些實施例提供一種用於控制半導體製程環境之方法。該方法包含將一清潔元件安置於一半導體加工工具之一加工室中。該方法亦包含在該加工室中形成一真空。此外，該方法包含藉由該清潔元件自該加工室中之殘餘物中消除至少一種化合物。該清潔元件經組態以促進與該加工室中之該等殘餘物之物理吸附、催化或化學反應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for controlling the semiconductor process environment is provided. The method includes placing a cleaning member in a processing chamber of a semiconductor processing tool. The method also includes creating a vacuum in the processing chamber. Furthermore, the method includes eliminating at least one compound from the residues in the processing chamber by the cleaning member. The cleaning member is configured to facilitate physical adsorption, catalysis, or chemical reactions with the residues in the processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體加工工具</p>
        <p type="p">11:裝載端口</p>
        <p type="p">12:晶圓載體</p>
        <p type="p">13:界面</p>
        <p type="p">14:機械臂</p>
        <p type="p">15:裝載鎖定裝置/裝載鎖定模組</p>
        <p type="p">16:加工室/室</p>
        <p type="p">20:半導體晶圓</p>
        <p type="p">33:廢物通道</p>
        <p type="p">41:清潔元件</p>
        <p type="p">42:清潔元件</p>
        <p type="p">43:清潔元件</p>
        <p type="p">44:清潔元件</p>
        <p type="p">131:高效率微粒空氣過濾器</p>
        <p type="p">151:第一門</p>
        <p type="p">152:第二門</p>
        <p type="p">161:晶圓卡盤</p>
        <p type="p">162:輻射源</p>
        <p type="p">311:第一泵</p>
        <p type="p">312:導管</p>
        <p type="p">321:第二泵</p>
        <p type="p">322:導管</p>
        <p type="p">323:入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="907" publication-number="202619215">
    <tif-files tif-type="multi-tif">
      <tif file="113149494.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伺服器計算系統</chinese-title>
        <english-title>SERVER COMPUTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H02G3/04</main-classification>
        <further-classification edition="200601120250102B">H02G3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSORNG, YAW-TZORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭承堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳唐順利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TANG-SHUN-LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林錦煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一計算系統包含一結構支撐物，該結構支撐物被配置為容納一條或多條電纜。該計算系統進一步包含一纏繞管，該纏繞管被配置為纏繞一條或多條電纜中的相應電纜。該纏繞管包含一螺旋體，該螺旋體以一帶狀材料的形式圍繞著一縱軸佈置。該螺旋體具有內表面與外表面。內表面形成一纏繞空間以容納一條或多條電纜的相應電纜。一安裝片從外表面向外延伸。該安裝片將纏繞管連接到結構支撐物上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computing system includes a structural support configured to receive one or more cables. The computing system further includes a wrapping tube configured for wrapping around a respective cable of the one or more cables. The wrapping tube includes a spiral body in the form of a strip of material that is disposed around a longitudinal axis. The spiral body has an interior surface and an exterior surface. The interior surface forms a wrapping space for receiving the respective cable of the one or more cables. A mounting tab extends outwardly from the exterior surface. The mounting tab attaches the wrapping tube to the structural support.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:結構支撐物</p>
        <p type="p">30:安裝點</p>
        <p type="p">40:槽</p>
        <p type="p">60:伺服器機架</p>
        <p type="p">300:計算系統</p>
        <p type="p">310:纏繞管</p>
        <p type="p">320:螺旋體</p>
        <p type="p">330:縱軸</p>
        <p type="p">340:內表面</p>
        <p type="p">345:纏繞空間</p>
        <p type="p">350:外表面</p>
        <p type="p">360:線圈</p>
        <p type="p">365:介入空間</p>
        <p type="p">370:安裝片</p>
        <p type="p">A:圓圈區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="908" publication-number="202619571">
    <tif-files tif-type="multi-tif">
      <tif file="113149505.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶粒堆疊結構及其形成方法</chinese-title>
        <english-title>DIE STACK STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250805B">H10D88/00</main-classification>
        <further-classification edition="200601120250805B">H01L23/28</further-classification>
        <further-classification edition="200601120250805B">H01L23/34</further-classification>
        <further-classification edition="200601120250805B">H01L21/52</further-classification>
        <further-classification edition="200601120250805B">H01L21/302</further-classification>
        <further-classification edition="200601120250805B">H01L21/76</further-classification>
        <further-classification edition="200601120250805B">H01L21/768</further-classification>
        <further-classification edition="200601120250805B">H01L23/522</further-classification>
        <further-classification edition="200601120250805B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴杰隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種晶粒堆疊結構，包括垂直堆疊在基部半導體晶粒之上的非延伸半導體晶粒、延伸半導體晶粒及延伸頂部半導體晶粒。相較於非延伸半導體晶粒，延伸半導體晶粒和延伸頂部半導體晶粒各自具有從其一側水平向外延伸的延伸部分。密封劑層形成在基部半導體晶粒之上，並密封非延伸半導體晶粒、延伸半導體晶粒和延伸頂部半導體晶粒的側壁。導熱特徵形成在延伸半導體晶粒的延伸部分中和延伸頂部半導體晶粒的延伸部分中。導熱結構嵌入密封劑層中、在延伸半導體晶粒和延伸頂部半導體晶粒之間垂直延伸並且接觸導熱特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A die stack structure is provided. The die stack structure includes a non-extended semiconductor die, an extended semiconductor die, and an extended top semiconductor die are stacked vertically over a base semiconductor die. The extended semiconductor die and the extended top semiconductor die each have an extension portion extending horizontally outward from one side thereof as compared to the non-extended semiconductor die. An encapsulant layer is formed over the base semiconductor die and encapsulates the sidewalls of the non-extended semiconductor die, the extended semiconductor die, and the extended top semiconductor die. Thermally conductive features are formed in the extension portion of the extended semiconductor die and in the extension portion of extended top semiconductor die. A thermally conductive structure is embedded in the encapsulant layer, extending vertically between the extended semiconductor die and the extended top semiconductor die, and contacting the thermally conductive features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">16A:金屬柱凸塊</p>
        <p type="p">21:(最底部)半導體晶粒/基部半導體晶粒</p>
        <p type="p">21A:接觸墊</p>
        <p type="p">22A,22B,22C,22D,22E,22F,22G:半導體晶粒</p>
        <p type="p">22H:(最頂部)半導體晶粒/頂部半導體晶粒</p>
        <p type="p">23:延伸部分</p>
        <p type="p">24:密封劑層</p>
        <p type="p">25:導熱結構</p>
        <p type="p">26:導電接合結構</p>
        <p type="p">27:導熱特徵</p>
        <p type="p">28:導電特徵</p>
        <p type="p">29A:金屬柱凸塊</p>
        <p type="p">200:晶粒堆疊</p>
        <p type="p">D1,D2,D3,D4:橫截面尺寸</p>
        <p type="p">E1:延伸寬度</p>
        <p type="p">G1:間隙尺寸</p>
        <p type="p">P1,P2:節距</p>
        <p type="p">A-A:線</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="909" publication-number="202618358">
    <tif-files tif-type="multi-tif">
      <tif file="113149551.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149551</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶粒、半導體結構及其製造方法</chinese-title>
        <english-title>DIE, SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250509B">G02B6/13</main-classification>
        <further-classification edition="200601120250509B">G02B6/124</further-classification>
        <further-classification edition="200601120250509B">G02B6/122</further-classification>
        <further-classification edition="200601120250509B">G02B6/24</further-classification>
        <further-classification edition="200601120250509B">G02B6/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭豐維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, FENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構包括半導體層。半導體結構包括配置在半導體層上的光柵耦合器。光柵耦合器包括多個光柵線。每個光柵線沿著符合橢圓段的曲線延伸，其中橢圓由半徑R1和小於半徑R1的半徑R2定義。半導體結構更包括配置在半導體層上的波導。波導沿橫向方向鄰近光柵耦合器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a semiconductor layer. The semiconductor structure includes grating coupler disposed on the semiconductor layer. The grating coupler includes a plurality of grating lines. Each of the grating lines extends along a curve that conforms to a segment of an ellipse, where the ellipse is defined by a radius R1 and a radius R2 less than the radius R1. The semiconductor structure further includes a waveguide disposed on the semiconductor layer. The waveguide is adjacent to the grating coupler along a lateral direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:光子晶粒</p>
        <p type="p">202、212:半導體基底</p>
        <p type="p">204:介電層</p>
        <p type="p">206:半導體層/裝置層/光子裝置層</p>
        <p type="p">224:光柵耦合器</p>
        <p type="p">226:錐形結構/漸縮區</p>
        <p type="p">228:波導</p>
        <p type="p">230a、230b、230c、230d、230e、230f、230g、230h:光柵線</p>
        <p type="p">232a、232b、232c、232d、232e、232f、232g、232h:橢圓/橢圓形狀</p>
        <p type="p">234:同心圖案</p>
        <p type="p">236:中心</p>
        <p type="p">410:光點</p>
        <p type="p">R1、R2:半徑</p>
        <p type="p">X、Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="910" publication-number="202619506">
    <tif-files tif-type="multi-tif">
      <tif file="113149567.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250401B">H10D1/60</main-classification>
        <further-classification edition="202501120250401B">H10D1/68</further-classification>
        <further-classification edition="200601120250401B">H01L23/522</further-classification>
        <further-classification edition="200601120250401B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昇暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SHEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明璁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-TSONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種溝槽電容器結構在半導體裝置中形成，具有在溝槽電容器結構俯視圖中包括電容器結構多個內連線溝槽段的深溝槽結構。內連線溝槽段沿著側壁為溝槽電容器結構的電極層和絕緣層提供更大的表面積，從而增加溝槽電容器結構的電容。內連線溝槽段可包含在溝槽電容器結構的周界內，以實現溝槽電容器結構的緊湊的側向佔用面積。此外和/或可替代地，溝槽電容器結構的垂直尺寸（因此，溝槽電容器結構的電容）可透過將溝槽電容器結構的深溝槽結構完全延伸至半導體裝置的接合結構與半導體裝置的下方裝置層之間而增加。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A trench capacitor structure is formed in a semiconductor device to have a deep trench structure that includes a plurality of interconnected trench segments in a top view of the trench capacitor structure. The interconnected trench segments provide a greater amount of surface area along the sidewalls for the electrode layers and insulator layer of the trench capacitor structure, thereby increasing the capacitance of the trench capacitor structure. The interconnected trench segments may be included within a perimeter of the trench capacitor structure so that a compact lateral footprint for the trench capacitor structure may be achieved. Additionally and/or alternatively, the vertical size of the trench capacitor structure (and thus, the capacitance of the trench capacitor structure) may be increased by extending the deep trench structure of the trench capacitor structure fully between bonding structures of the semiconductor device and an underlying device layer of the semiconductor device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:示例實施例</p>
        <p type="p">102:半導體裝置</p>
        <p type="p">104:裝置層</p>
        <p type="p">106:內連線層</p>
        <p type="p">108:接合層</p>
        <p type="p">110:基板層</p>
        <p type="p">112:積體電路裝置</p>
        <p type="p">114、148、152:介電層</p>
        <p type="p">116、124、128、132、136:層間介電層</p>
        <p type="p">118、122、126、130、134、146、150:蝕刻停止層</p>
        <p type="p">120:導電結構</p>
        <p type="p">138、142:頂部通孔</p>
        <p type="p">140、144:頂部金屬層</p>
        <p type="p">154:接合通孔</p>
        <p type="p">156:接合墊</p>
        <p type="p">158:接合介電層</p>
        <p type="p">160:電容器結構</p>
        <p type="p">162:底部電極層</p>
        <p type="p">164:絕緣層</p>
        <p type="p">166:頂部電極層</p>
        <p type="p">168:介電填充物</p>
        <p type="p">170、172:蓋層</p>
        <p type="p">174、176:側壁間隙壁</p>
        <p type="p">178:深溝槽結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="911" publication-number="202618352">
    <tif-files tif-type="multi-tif">
      <tif file="113149677.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250523B">G02B6/12</main-classification>
        <further-classification edition="200601120250523B">G02B6/13</further-classification>
        <further-classification edition="200601120250523B">G02B6/34</further-classification>
        <further-classification edition="200601120250523B">H01L23/535</further-classification>
        <further-classification edition="200601120250523B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳家新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構包括光子晶粒和導電連接件。此光子晶粒包括：具有第一側和第二側的絕緣層；至少一光學構件，設置在絕緣層的第一側上；通孔，貫穿絕緣層並位於至少一光學構件旁邊，且具有與絕緣層直接接觸的金屬；以及內連線結構，設置在絕緣層的第一側上方並電連接到通孔。導電連接件設置在絕緣層的第二側上並電連接到通孔。通孔的臨界尺寸位於內連線結構的臨界尺寸與導電連接件的臨界尺寸之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a photonic die and a conductive connector. The photonic die includes: an insulating layer having a first side and a second side; at least one optical element disposed on the first side of the insulating layer; a through via penetrating through the insulating layer and aside the at least one optical element, and having a metal is in direct contact with the insulating layer; and an interconnect structure disposed over the first side of the insulating layer and electrically connected to the through via. The conductive connector is disposed on the second side of the insulating layer and electrically connected to the through via. A critical dimension of the through via is between a critical dimension of the interconnect structure and a critical dimension of the conductive connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S2302、S2304、S2306、S2307、S2308、S2309、S2310:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="912" publication-number="202618962">
    <tif-files tif-type="multi-tif">
      <tif file="113149679.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液態化學品供應系統及其操作方法</chinese-title>
        <english-title>LIQUID CHEMICAL SUPPLY SYSTEM AND OPERATING METHODS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250613B">H01L21/67</main-classification>
        <further-classification edition="200601120250613B">F17D3/01</further-classification>
        <further-classification edition="200601120250613B">F17D1/00</further-classification>
        <further-classification edition="200601120250613B">G01N1/10</further-classification>
        <further-classification edition="200601120250613B">G01N1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江芳彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, FANG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUAN CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾易龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭鈺原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉威毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊豐安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FENG-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭傑銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種方法。此方法包括：將液態化學品儲存在儲存槽中；從儲存槽向半導體處理工具供應液態化學品；經由液體選擇裝置從與儲存槽流體連通的第一設備獲得液態化學品的第一樣品；由液體粒子計數器(LPC)測量第一樣品中的第一粒子水平；在獲得第一樣品之後，經由液體選擇裝置從與儲存槽流體連通的第二設備獲得液態化學品的第二樣品，第二設備與第一設備不同；以及由LPC測量第二樣品中的第二粒子水平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is provided. The method includes: storing a liquid chemical in a storage tank; supplying the liquid chemical from the storage tank to a semiconductor processing tool; obtaining a first sample of the liquid chemical from a first apparatus in fluid communication with the storage tank via a liquid selection apparatus; measuring a first level of particles in the first sample by a liquid particle counter (LPC); after obtaining the first sample, obtaining a second sample of the liquid chemical from a second apparatus in fluid communication with the storage tank via the liquid selection apparatus, the second apparatus being different than the first apparatus; and measuring a second level of particles in the second sample by the LPC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:卡車</p>
        <p type="p">121:液態化學品</p>
        <p type="p">130:供應系統</p>
        <p type="p">131:進料組件</p>
        <p type="p">131G,134P,135G,136P:泵</p>
        <p type="p">132:第一儲存槽</p>
        <p type="p">133:第二儲存槽</p>
        <p type="p">134:提取組件</p>
        <p type="p">135:供給裝置</p>
        <p type="p">136:回饋組件</p>
        <p type="p">137,162:分流閥箱</p>
        <p type="p">138:半導體處理工具</p>
        <p type="p">160:粒子監測系統</p>
        <p type="p">164:緩衝槽</p>
        <p type="p">170:液體粒子計數器</p>
        <p type="p">1311,1312,1313,1314,1341,1342,1351,1352,1362:運輸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="913" publication-number="202619062">
    <tif-files tif-type="multi-tif">
      <tif file="113149785.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構及其形成方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250721B">H01L23/28</main-classification>
        <further-classification edition="200601120250721B">H01L23/34</further-classification>
        <further-classification edition="200601120250721B">H01L23/535</further-classification>
        <further-classification edition="200601120250721B">H01L21/56</further-classification>
        <further-classification edition="200601120250721B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳邦莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BANG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王健彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種封裝結構及其形成方法。封裝結構包括形成在基板之上的第一晶粒、以及圍繞第一晶粒的第一封裝層。封裝結構包括形成在第一晶粒和第一封裝層之上的蓋結構、以及形成在第一晶粒和蓋結構之間的第一熱界面材料(TIM)。第一熱界面材料包括液態金屬。封裝結構包括形成在第一封裝層和蓋結構之間的第二熱界面材料，且第二熱界面材料的頂表面高於第一熱界面材料的頂表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure and method for forming the same are provided. The package structure includes a first die formed over a substrate, and a first package layer surrounding the first die. The package structure includes a lid structure formed over the first die and first package layer and a first thermal interface material (TIM) formed between the first die and the lid structure. The first thermal interface material includes liquid metal. The package structure includes a second TIM formed between the first package layer and the lid structure, and a top surface of the second TIM is higher than a top surface of the first TIM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">12:奈米結構</p>
        <p type="p">14:內間隔物層</p>
        <p type="p">16:源極/汲極結構</p>
        <p type="p">18:閘極結構</p>
        <p type="p">100a:封裝結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:介電層</p>
        <p type="p">106,126:導電層</p>
        <p type="p">110:內連線結構</p>
        <p type="p">120:半導體晶粒</p>
        <p type="p">124,144:導電墊</p>
        <p type="p">128,146,164,176:導電連接件</p>
        <p type="p">130:堆疊晶粒</p>
        <p type="p">134:基板通孔</p>
        <p type="p">136:接合結構</p>
        <p type="p">138,148:底部填充層</p>
        <p type="p">140:模塑化合物</p>
        <p type="p">150:第一封裝層</p>
        <p type="p">152:第二封裝層</p>
        <p type="p">154:第一熱界面材料</p>
        <p type="p">158:第二熱界面材料</p>
        <p type="p">170:封裝基板、中介層</p>
        <p type="p">172a:主體部分</p>
        <p type="p">172b:腿部分</p>
        <p type="p">172c:延伸部分</p>
        <p type="p">174:黏著劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="914" publication-number="202618994">
    <tif-files tif-type="multi-tif">
      <tif file="113149815.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓傳送設備、製程裝置及晶圓傳送方法</chinese-title>
        <english-title>WAFER TRANSFER TOOL, PROCESSING APPARATUS AND METHOD OF MOVING WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250926B">H01L21/677</main-classification>
        <further-classification edition="200601120250926B">H01L21/683</further-classification>
        <further-classification edition="200601120250926B">B25J9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀元興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YUAN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林生元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶圓傳送設備具有安裝端部分；以及葉片，連接至安裝端部分且自安裝端部分延伸。葉片具有底表面以及具有支撐機構的頂表面。支撐機構具有中心點且包括具有以內緣定義的階面的階梯。階面位於葉片的厚度方向上的不同階層處且定位於頂表面與底表面之間。在各階層處具有一或多個階面，且至少數個內緣具有環形或部分環形中的至少一種形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer transfer tool has a mounting end portion and a blade connected to and extending from the mounting end portion. The blade has a bottom exterior and a top exterior having a support configuration. The support configuration has a center point and steps having treads with inner edges. The treads are located in different levels in a direction of a thickness of the blade between the top exterior and the bottom exterior, wherein there are one or more of the treads at each level and wherein at least some of the inner edges have at least one of circular shapes or partially circular shapes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:晶圓傳送設備</p>
        <p type="p">62:安裝端部分</p>
        <p type="p">64:葉片</p>
        <p type="p">66:自由端部分</p>
        <p type="p">71:最頂平面</p>
        <p type="p">72:最底平面</p>
        <p type="p">79:孔洞</p>
        <p type="p">84:第一內緣</p>
        <p type="p">88:第二內緣</p>
        <p type="p">94、95:第三內緣</p>
        <p type="p">100、102:第四內緣</p>
        <p type="p">110:第一階梯</p>
        <p type="p">112:第二階梯</p>
        <p type="p">114、116:第三階梯</p>
        <p type="p">118、120:第四階梯</p>
        <p type="p">H0、H1、H2、H3、H4:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="915" publication-number="202618287">
    <tif-files tif-type="multi-tif">
      <tif file="113149856.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試系統</chinese-title>
        <english-title>TEST SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">G01R1/04</main-classification>
        <further-classification edition="202001120250107B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮家驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUAN, CHIA-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾淑容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, SHU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游輝昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李芳州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FANG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祖秉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSU, PING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">測試半導體封裝結構的測試系統與方法包括改善的插座殼體板設計，以改善測試可信度與準確性。插座殼體板的上表面包括不平坦的形狀，比如具有不同垂直高度的多個不同區域的階狀設置。插座殼體板的上表面的不平坦形狀，可模擬測試的半導體封裝結構的翹曲特性，以改善半導體封裝結構與測試系統的接觸針之間的接觸。這可改善測試的準確性，並減少「錯誤否定」測試發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Test systems and methods testing semiconductor package structures including an improved socket housing plate design that provides improved testing reliability and accuracy. The upper surface of the socket housing plate includes a non-planar shape, such as a stepped configuration including a plurality of different regions having different vertical elevations. The non-planar shape of the upper surface of the socket housing plate may mimic the warpage characteristics of the semiconductor package structures being tested, which may enable improved contact between the semiconductor package structure and the contact pins of the test system. This may improve the accuracy of the testing and reduce the occurrence of “false reject” tests.</p>
      </isu-abst>
      <representative-img>
        <p type="p">hd2:第二水平方向</p>
        <p type="p">100:多晶片模組封裝</p>
        <p type="p">101:封裝基板</p>
        <p type="p">102,205:上表面</p>
        <p type="p">103a,103b:晶粒</p>
        <p type="p">104,226:下表面</p>
        <p type="p">106:間隙</p>
        <p type="p">109:密封材料</p>
        <p type="p">111:接合墊</p>
        <p type="p">200:測試系統</p>
        <p type="p">201:插座基底</p>
        <p type="p">202:測試頭</p>
        <p type="p">203:控制器</p>
        <p type="p">204:插座殼體</p>
        <p type="p">205a:第一區</p>
        <p type="p">205b:第二區</p>
        <p type="p">205c:第三區</p>
        <p type="p">205d:第四區</p>
        <p type="p">206:插座</p>
        <p type="p">207:側壁</p>
        <p type="p">213:接觸針</p>
        <p type="p">214:機械停止器</p>
        <p type="p">215:安裝板</p>
        <p type="p">216:插座殼體板</p>
        <p type="p">217:開口</p>
        <p type="p">220:接觸板</p>
        <p type="p">221:晶圓座</p>
        <p type="p">223:晶粒推出器</p>
        <p type="p">224:上側部分</p>
        <p type="p">225:下側部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="916" publication-number="202618938">
    <tif-files tif-type="multi-tif">
      <tif file="113149878.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共同封裝光學裝置和製造方法</chinese-title>
        <english-title>COPACKAGED OPTICAL DEVICES AND METHODS OF MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250516B">H01L21/56</main-classification>
        <further-classification edition="200601120250516B">H01L21/768</further-classification>
        <further-classification edition="200601120250516B">H01L23/28</further-classification>
        <further-classification edition="200601120250516B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊鈞智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHUN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭榮偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡憲斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HSIEN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯上勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, SHANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括將至少一個重佈線中介層基板接合到封裝基板上，將封裝元件和記憶體元件接合到重佈線中介層基板的上表面；以及將光子晶片接合到重佈線中介層基板的上表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method that includes bonding at least one of a redistribution layer interposer substrate onto a package substrate, bonding packaging components and memory components to an upper surface of the redistribution layer interposer substrate; and bonding a photonics chip to the upper surface of the redistribution layer interposer substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">98:絕緣層</p>
        <p type="p">99:金屬線/內連線、絕緣體穿孔</p>
        <p type="p">100:基板上晶圓上晶片</p>
        <p type="p">109:局部矽內連線層</p>
        <p type="p">110:重佈線中介層基板</p>
        <p type="p">111:局部矽內連線晶片</p>
        <p type="p">112:前側重佈線層</p>
        <p type="p">113:背側重佈線層</p>
        <p type="p">120:頂部晶粒元件</p>
        <p type="p">123:焊料凸塊</p>
        <p type="p">125:封裝元件</p>
        <p type="p">130:記憶體元件</p>
        <p type="p">131:焊料接合</p>
        <p type="p">135:光子晶片</p>
        <p type="p">137:基板</p>
        <p type="p">140:環狀結構</p>
        <p type="p">145:表面安裝裝置晶片</p>
        <p type="p">150:接合</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="917" publication-number="202619063">
    <tif-files tif-type="multi-tif">
      <tif file="113150152.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCRTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250721B">H01L23/28</main-classification>
        <further-classification edition="200601120250721B">H01L23/34</further-classification>
        <further-classification edition="200601120250721B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴杰隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體封裝結構，包括基板、重分佈結構、以及半導體晶粒。重分佈結構設置在基板上方，包括介電層、導電特徵、以及熱傳特徵。導電特徵形成於介電層中。熱傳特徵形成於介電層中，並與導電特徵電性絕緣。半導體晶粒設置在重分佈結構上方，並與導電特徵電性連接，從俯視視角觀察，半導體晶粒與熱傳特徵部分地重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a redistribution structure disposed over the substrate, and a semiconductor die disposed over the redistribution structure. The redistribution structure includes a dielectric layer, a conductive feature formed in the dielectric layer, and a heat transfer feature formed in the dielectric layer and being electrically isolated from the conductive feature. The semiconductor die is electrically connected to the conductive feature. The semiconductor die partially overlaps the heat transfer feature from a top view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:重分佈結構</p>
        <p type="p">16:介電層</p>
        <p type="p">18,28,33,34,35,44,52,56,60:導電特徵</p>
        <p type="p">19:導孔</p>
        <p type="p">20,42,50,54:熱傳特徵</p>
        <p type="p">22,23,24,25:熱傳層</p>
        <p type="p">26:密封環</p>
        <p type="p">30,32:半導體晶粒</p>
        <p type="p">30A:底表面</p>
        <p type="p">36,58:底部填充材料</p>
        <p type="p">40:模封材料</p>
        <p type="p">45:封裝體</p>
        <p type="p">46:基板</p>
        <p type="p">48:介電層</p>
        <p type="p">70,72:熱點</p>
        <p type="p">100:半導體封裝結構</p>
        <p type="p">H1:第一距離</p>
        <p type="p">H2:第二距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="918" publication-number="202619600">
    <tif-files tif-type="multi-tif">
      <tif file="113150326.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250203B">H10H29/01</main-classification>
        <further-classification edition="202501120250203B">H10H20/855</further-classification>
        <further-classification edition="200601120250203B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玟擇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖士福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚怡安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, I-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括一基板、一發光單元、一微透鏡以及一吸光層。所述發光單元設置在所述基板上且用於發射一光線。所述微透鏡對應於所述發光單元設置且用於集中所述光線。所述吸光層定義出位於所述發光單元與所述微透鏡之間的一光通道，所述光通道用於將所述光線導引到所述微透鏡。所述光通道的長度大於或等於所述發光單元與所述微透鏡之間的距離的60%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a substrate, a light emitting unit, a microlens and a light absorbing layer. The light emitting unit is disposed on the substrate and used to emit a light. The microlens is disposed corresponding to the light emitting unit and used to concentrate the light. The light absorbing layer defines a light channel located between the light emitting unit and the microlens, wherein the light channel is used to guide the light to the microlens. A length of the light channel is greater than or equal to 60% of a distance between the light emitting unit and the microlens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1,B1,P1:點</p>
        <p type="p">AB:吸光層</p>
        <p type="p">AL:空氣層</p>
        <p type="p">AR,AR1,AR2,AR3:抗反射層</p>
        <p type="p">C1,C2:柱狀部分</p>
        <p type="p">DD:顯示裝置</p>
        <p type="p">ED:電子裝置</p>
        <p type="p">H1,H2,Ha:高度</p>
        <p type="p">L1:光線</p>
        <p type="p">LH:光通道</p>
        <p type="p">LS:遮光層</p>
        <p type="p">LU,LU1,LU2,LU3:發光單元</p>
        <p type="p">M1:第一材料層</p>
        <p type="p">ML:微透鏡</p>
        <p type="p">MM:材料層</p>
        <p type="p">N1:長度</p>
        <p type="p">N2:距離</p>
        <p type="p">OP1,OP2:開口</p>
        <p type="p">PO1:部分</p>
        <p type="p">R1:區域</p>
        <p type="p">S1:表面</p>
        <p type="p">S2,S3,SA:上表面</p>
        <p type="p">SB1:第一基板</p>
        <p type="p">SB2:第二基板</p>
        <p type="p">SS:側面</p>
        <p type="p">UF:底部填充層</p>
        <p type="p">W1,W2,W3,W4,W5,W6:寬度</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="919" publication-number="202619118">
    <tif-files tif-type="multi-tif">
      <tif file="113150355.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝件及其形成方法</chinese-title>
        <english-title>PACKAGE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">H01L23/538</main-classification>
        <further-classification edition="200601120250502B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘冠忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, KUAN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何健暘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JIAN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗徽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TZUNG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宏瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HUNG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種封裝件及其製造方法。該封裝件包括一半導體晶粒、絕緣包封體以及重佈線結構。重佈線路結構包括介電層和嵌入介電層中的堆疊的通孔結構。堆疊的通孔結構包括第一通孔插塞、包括多個第一摻質的第一擴散層、第二通孔插塞和包括多個第二摻質的第二擴散層。第一通孔插塞包括分散在第一通孔插塞的第一金屬材料內的多個第一摻質，並且第二通孔插塞包括分散在第二通孔插塞的第二金屬材料內的多個第二摻質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package and a manufacturing method for the package are provided. The package includes a semiconductor die, an insulating encapsulant and a redistribution structure. The redistribution structure comprises a dielectric layer and a stacked via structure embedded in the dielectric layer. The stacked via structure comprises a first via plug, a first diffusion layer including first dopants, a second via plug, and a second diffusion layer including second dopants. The first via plug includes the first dopants dispersed within a first metal material of the first via plug, and the second via plug includes the second dopants dispersed within a second metal material of the second via plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">810、820:半導體晶粒</p>
        <p type="p">850:模製結構</p>
        <p type="p">830:模製化合物</p>
        <p type="p">860:重佈線路結構</p>
        <p type="p">861、863、865、867、869:介電層</p>
        <p type="p">862、864、866、868:金屬化圖案</p>
        <p type="p">8621、8641、8661、8681:晶種層</p>
        <p type="p">8622、8642、8662、8682:擴散層</p>
        <p type="p">8623、8643、8663、8683:摻質</p>
        <p type="p">862V、864V、866V、868V:通孔插塞</p>
        <p type="p">866L、868L:路由跡線</p>
        <p type="p">SV1、SV2:堆疊結構</p>
        <p type="p">880:凸塊連接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="920" publication-number="202618944">
    <tif-files tif-type="multi-tif">
      <tif file="113150370.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造半導體裝置之方法</chinese-title>
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250103B">H01L21/60</main-classification>
        <further-classification edition="200601120250103B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林惠婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾登　安蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EITAN, AMRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫于雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱致遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一些實施例提供製造半導體裝置以及所產生的接合結構之方法。方法之一些實施例包括將一電漿噴嘴相對於一基板傾斜一角度。方法包括利用電漿噴嘴將一氧化氣體施加至至少一個基板側銅凸塊之一第一側，從而在基板側銅凸塊之第一側形成氧化銅側壁。方法包括利用基板側銅凸塊將一半導體晶片接合至基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of fabricating semiconductor devices and resulting bonded structures. An embodiment method includes tilting a plasma nozzle to an angle with respect to a substrate. The method includes applying, with the plasma nozzle, an oxidation gas onto a first side of at least one substrate-side copper bump on the substrate, forming an oxidized copper sidewall on the first side of the substrate-side copper bump. The method includes bonding a semiconductor chip to the substrate using the substrate-side copper bump.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:方法</p>
        <p type="p">802:步驟</p>
        <p type="p">804:步驟</p>
        <p type="p">806:步驟</p>
        <p type="p">808:步驟</p>
        <p type="p">810:步驟</p>
        <p type="p">812:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="921" publication-number="202618329">
    <tif-files tif-type="multi-tif">
      <tif file="113150437.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150437</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學相位陣列晶片及其感測方法</chinese-title>
        <english-title>OPTICAL PHASED ARRAY CHIP AND SENSING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01S17/08</main-classification>
        <further-classification edition="200601120250401B">G01S7/481</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恩宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, EN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張登翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張合</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　冬冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DONG DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀　潔生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEE, JACK SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學相位陣列晶片包括：發光單元，產生出射光訊號；分光單元，與發光單元連接，傳送出射光訊號至光學天線單元，接收漫反射光訊號並傳送至光感測單元；光學天線單元，與分光單元連接，發射出射光訊號，並接收漫反射光訊號，且傳送漫反射光訊號至分光單元；光感測單元，與分光單元連接，接收漫反射光訊號並傳送至處理單元；及處理單元，與光感測單元連接，接收經光感測單元轉換之電流訊號形式之漫反射光訊號，並產生感測資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical phase array chip includes: a light emitting unit, configured to produce an emitted light signal; a beam splitting unit, connected to the light emitting unit, and configured to transmit the emitted light signal to an optical antenna unit and receive and transmit a diffuse reflection light signal to a light sensing unit; the optical antenna unit, connected to the beam splitting unit, configured to transmit the emitted light signal, and configured to receive and transmit the diffuse reflection light signal to the beam splitting unit; the light sensing unit, connected to the beam splitting unit, and configured to receive and transmit the diffuse reflection light signal to a processing unit; and the processing unit, connected to the light sensing unit, and configured to receive the diffuse reflection light signal in a current signal manner converted by the light sensing unit and generate a sensing information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:發光單元</p>
        <p type="p">12:分光單元</p>
        <p type="p">13:光學天線單元</p>
        <p type="p">14:光感測單元</p>
        <p type="p">15:處理單元</p>
        <p type="p">O:待測物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="922" publication-number="202619415">
    <tif-files tif-type="multi-tif">
      <tif file="113150494.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算裝置及計算系統</chinese-title>
        <english-title>COMPUTING DEVICE AND COMPUTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H05K1/02</main-classification>
        <further-classification edition="200601120250203B">H05K9/00</further-classification>
        <further-classification edition="200601120250203B">G06F1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敬仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一計算裝置包含具有接地層與電源層的印刷電路板(PCB)。接地層具有在第一接地邊緣與第二接地邊緣之間延伸的長度L1。電源層具有在第一電源邊緣與第二電源邊緣之間延伸的長度L2。接地層平行於電源層，且接地層與電源層之間分隔出一距離H。計算裝置還包含與PCB整合的散熱器。散熱器平行且耦合到電源層。散熱器具有在第一散熱邊緣與第二散熱邊緣之間延伸的長度L3。散熱器的長度L3大於接地層的長度L1或電源層的長度L2中的至少一個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computing device includes a printed circuit board (PCB) having a ground plane and a power plane. The ground plane has a length L1 that extends between a first ground edge and a second ground edge. The power plane has a length L2 that extends between a first power edge and a second power edge. The ground plane is parallel to and separated from the power plane by a distance H. The computing device further includes a heat sink integrated with the PCB. The heat sink is parallel to and coupled to the power plane. The heat sink has a length L3 that extends between a first sink edge and a second sink edge. The length L3 of the heat sink is greater than at least one of the length L1 of the ground plane or the length L2 of the power plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:計算系統</p>
        <p type="p">310:機架</p>
        <p type="p">330:散熱器</p>
        <p type="p">332:散熱邊緣</p>
        <p type="p">334:散熱邊緣</p>
        <p type="p">340:鰭</p>
        <p type="p">350:PCB</p>
        <p type="p">360:接地層</p>
        <p type="p">362:接地邊緣</p>
        <p type="p">364:接地邊緣</p>
        <p type="p">370:電源層</p>
        <p type="p">372:電源邊緣</p>
        <p type="p">374:電源邊緣</p>
        <p type="p">380:發熱組件</p>
        <p type="p">382:發熱組件</p>
        <p type="p">H,10H,20H,100H:距離</p>
        <p type="p">L1,L2,L3:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="923" publication-number="202619575">
    <tif-files tif-type="multi-tif">
      <tif file="113150535.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多個放電路徑之暫態電壓抑制器</chinese-title>
        <english-title>TRANSIENT VOLTAGE SUPPRESSOR STRUCTURE HAVING MULTIPLE DISCHARGING PATHS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250501B">H10D89/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶焱科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAZING MICROELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃菘志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉致廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIH-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種暫態電壓抑制器，包括具有第一導電型態的半導體基底與摻雜井型區、具有第二導電型態的磊晶層、及形成於摻雜井型區中具有第二導電型態的第一、第二重摻雜區與第一導電型態的第三重摻雜區。第一重摻雜區係電性耦接於第二導電型態的第四重摻雜區，具有第一導電型態的第四重摻雜區與第五重摻雜區係共同設置於磊晶層中。磊晶層中更設置有第二導電型態的第六重摻雜區，同時，該第三、第六重摻雜區係電性耦接。第二、第五重摻雜區係各自電性耦接於接地端與輸入輸出接點。當操作於正湧浪操作模式時，暫態電壓抑制器係可產生有複數條放電路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transient voltage suppressor is provided, including a semiconductor substrate and a doped well of first conductivity type, an epitaxial layer of second conductivity type, first and second heavily doped regions of second conductivity type, and a third heavily doped region of first conductivity type in the doped well. The first heavily doped region is connected to a fourth heavily doped region of second conductivity type, and the fourth heavily doped region and a fifth heavily doped region of first conductivity type are disposed in the epitaxial layer. A sixth heavily doped region of second conductivity type is disposed in the epitaxial layer and connected in common with the third heavily doped region in the doped well. The fifth and second heavily doped regions are connected to I/O and ground, respectively. When applying a positive surged mode, the disclosed transient voltage suppressor is characterized by providing multiple discharging paths.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具有多個放電路徑之暫態電壓抑制器</p>
        <p type="p">100:半導體基底</p>
        <p type="p">102:磊晶層</p>
        <p type="p">104:摻雜井型區</p>
        <p type="p">106:隔離溝槽</p>
        <p type="p">21:第一重摻雜區</p>
        <p type="p">22:第二重摻雜區</p>
        <p type="p">23:第三重摻雜區</p>
        <p type="p">24:第四重摻雜區</p>
        <p type="p">25:第五重摻雜區</p>
        <p type="p">26:第六重摻雜區</p>
        <p type="p">P1:第一節點</p>
        <p type="p">P2:第二節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="924" publication-number="202618288">
    <tif-files tif-type="multi-tif">
      <tif file="113150568.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探測待測裝置的設備</chinese-title>
        <english-title>APPARATUS FOR PROBING DEVICE-UNDER-TEST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G01R1/04</main-classification>
        <further-classification edition="200601120250303B">G01R1/073</further-classification>
        <further-classification edition="200601120250303B">G01R1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫傳翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHUAN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚書安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANG, SHU AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯凱驛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, KAI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林源澧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例的用於探測待測裝置的設備包括夾具、電路薄膜、探針接觸點、電路板、第一和第二高頻訊號線及遮蔽結構。夾具配置在待測裝置上。電路薄膜附著於夾具。探針接觸點配置在電路薄膜上並朝向待測裝置延伸。電路板電性耦合到電路薄膜。第二高頻訊號線與第一高頻訊號線側向間隔，第一和第二高頻訊號線包含在電路薄膜或電路板中的至少一個中。遮蔽結構插入第一和第二高頻訊號線之間，遮蔽結構包括第一與第二遮蔽圖案。第一遮蔽圖案配置在第一高頻訊號線的鄰近處。第二遮蔽圖案配置在第二高頻訊號線的鄰近處並與第一遮蔽圖案側向間隔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film attached to the fixture, probe contacts disposed on the circuitry film and extending toward the DUT, a circuit board electrically coupled to the circuitry film, a first high frequency signal line and a second high frequency signal line laterally spaced apart from the first high frequency signal line. The first and second high frequency signal lines are included in at least one of the circuitry film or the circuit board. A shielding structure is interposed between the first and second high frequency signal lines and includes a first shielding pattern close to the first high frequency signal line and a second shielding pattern close to the second high frequency signal line and laterally spaced apart from the first shielding pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">122、1221、1222、1223、1224:介電層</p>
        <p type="p">124、1241、1242、1243:電路層</p>
        <p type="p">D1、D2:方向</p>
        <p type="p">D11、D12、D13、D21、D22:隔離件</p>
        <p type="p">G1、G2、BG1、BG2:層</p>
        <p type="p">GV1、GV2:通孔</p>
        <p type="p">LD1:側向距離</p>
        <p type="p">RF1、RF2:射頻訊號線</p>
        <p type="p">SD1:遮蔽結構</p>
        <p type="p">SP1、SP2:遮蔽圖案</p>
        <p type="p">W1、W2、WD13、WD21、WD22:橫向尺寸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="925" publication-number="202618603">
    <tif-files tif-type="multi-tif">
      <tif file="113150605.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>重分佈層的電源網路設計方法、裝置、電子設備和介質</chinese-title>
        <english-title>METHOD AND APPARATUE FOR DESIGNING POWER NETWORK OF REDISTRIBUTION LAYER, ELECTRONIC EQUIPMENT AND MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250602B">G06F30/39</main-classification>
        <further-classification edition="200601120250602B">H01L23/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京有竹居網路技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING YOUZHUJU NETWORK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸旻熠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高鴻飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, HONGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李繼峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種重分佈層的電源網路設計方法、裝置、電子設備和介質，該方法包括：根據目標金屬層的多條第一電源線的排布圖案，獲得重分佈層的第一潛在過孔設置位置；根據重分佈層中觸點的位置以及第一潛在過孔設置位置，獲得重分佈層的第一電源網路圖案，該第一電源網路圖案盡可能多地與第一潛在過孔設置位置交疊；根據第一電源網路圖案與第一潛在過孔設置位置的交疊位置，以及根據重分佈層的網路設計規則，去除第一潛在過孔設置位置中不符合要求的位置，獲得重分佈層的對應於多條第一電源線的第一目標過孔設置位置。該方法可以自我調整地獲得針對頂層電源網路的重分佈層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and an apparatus for designing power network of redistribution layer, an electronic device, and a medium are provided, the method includes: obtaining a first potential via setting position of the redistribution layer based on a layout pattern of a plurality of first power lines of a target metal layer; obtaining a first power network pattern of the redistribution layer based on a position of a contact point in the redistribution layer and the first potential via setting position, the first power network pattern overlaps as much as possible with the first potential via setting position; based on the overlapping position of the first power network pattern and the first potential via setting position, and according to a network design rule of the redistribution layer, remove non-compliant positions in the first potential via setting position, and obtain a first target via setting position corresponding to the plurality of first power lines in the redistribution layer. This method can adaptively obtain a redistribution layer for the top-level power network.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S103:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="926" publication-number="202619546">
    <tif-files tif-type="multi-tif">
      <tif file="113150768.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250502B">H10D62/17</main-classification>
        <further-classification edition="202501120250502B">H10D62/40</further-classification>
        <further-classification edition="202501120250502B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴煜淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅勁逢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李富生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張心曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIN-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例提供一種半導體元件，例如，包括：通道區，在第一方向上與磊晶結構連接；閘極結構，設置在通道區上方，並具有沿基本垂直於第一方向的第二方向延伸的縱軸；接觸件，設置在磊晶結構上方，且具有在第二方向上的側壁，其中側壁與接觸件的頂表面之間的第一角度大於90度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure is a semiconductor device that, for example, includes: a channel region connecting to an epitaxial structure in a first direction; a gate structure disposed over the channel region and having a longitudinal axis extending in a second direction substantially perpendicular to the first direction; and a contact disposed over the epitaxial structure, the contact including a sidewall in the second direction, wherein a first angle between the sidewall and a top surface of the contact is greater than 90 degrees.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:基板</p>
        <p type="p">120:淺溝槽隔離區/STI區</p>
        <p type="p">136a,136b:間隔層</p>
        <p type="p">158N:n型磊晶結構</p>
        <p type="p">158P:p型磊晶結構</p>
        <p type="p">160:接觸蝕刻停止層/CESL</p>
        <p type="p">162:層間介電層/ILD層</p>
        <p type="p">180:介電層</p>
        <p type="p">184:源極/汲極接觸件</p>
        <p type="p">300:半導體元件</p>
        <p type="p">388:隔離區</p>
        <p type="p">388a:介電襯墊</p>
        <p type="p">388b:填充介電質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="927" publication-number="202618589">
    <tif-files tif-type="multi-tif">
      <tif file="113150990.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供評論資訊之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>
        <english-title>OPERATING METHOD OF ELECTRONIC APPARATUS FOR PROVIDING REVIEW INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250908B">G06F17/40</main-classification>
        <further-classification edition="201901120250908B">G06F16/9535</further-classification>
        <further-classification edition="202301120250908B">G06Q30/02</further-classification>
        <further-classification edition="201201120250908B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐開誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, KAICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐郡明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JUNMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置提供用戶評論之方法，其包括如下步驟：確認與物品相關之用戶評論資訊；基於用戶評論資訊而產生至少一個第1標籤；確定至少一個第1標籤中之與用戶評論資訊對應之第2標籤；及提供包括第2標籤之用戶評論。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S270:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="928" publication-number="202617564">
    <tif-files tif-type="multi-tif">
      <tif file="113151033.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617564</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>懸掛式搬運裝置及其檢測方法</chinese-title>
        <english-title>OVERHEAD HOIST TRANSPORT DEVICE AND DETECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">B65G49/07</main-classification>
        <further-classification edition="200601120250203B">B65G43/00</further-classification>
        <further-classification edition="200601120250203B">B65G43/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊政勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENG-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種懸掛式搬運裝置之檢測方法包括獲得車體在軌道的位置資訊與對應於位置資訊的震動資訊。基於位置資訊與震動資訊產生震動峰值資料。對震動峰值資料執行分析操作，以產生分析結果。判定分析結果是否指示在軌道的臨界間隙位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection method of an overhead hoist transport device includes obtaining a position information of a car at a rail and a vibration information corresponding to the position information. A vibration peak data is generated based on the position information and the vibration information. An analyzing operation is performed on the vibration peak data to generate an analyzed result. Whether the analyzed result indicates a critical gap position at the rail is determined.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:檢測方法</p>
        <p type="p">S310,S320,S330,S340,S350,S360:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="929" publication-number="202619087">
    <tif-files tif-type="multi-tif">
      <tif file="113151182.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構及其形成方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H01L23/373</main-classification>
        <further-classification edition="200601120250801B">H01L23/29</further-classification>
        <further-classification edition="200601120250801B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱祈翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, CHI-SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, CHANG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡瑀修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-SHIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">封裝結構包含封裝基板、半導體模組、複合熱界面材料(TIM)層、封裝蓋基板、以及反應性界面層，其中半導體模組位於封裝基板上，複合熱界面材料層包含在聚合物基質中的液態金屬、且位於半導體模組上，封裝蓋位於複合熱界面材料層上、且附接至封裝基板，反應性界面層在半導體模組或封裝蓋中的至少一者上與複合熱界面材料層接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure includes a package substrate, a semiconductor module on the package substrate, a composite thermal interface material (TIM) layer including liquid metal in a polymer matrix on the semiconductor module, a package lid on the composite TIM layer and attached to the package substrate, and a reactive interface layer in contact with the composite TIM layer on at least one of the semiconductor module or the package lid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:中介物</p>
        <p type="p">12:聚合物層</p>
        <p type="p">12a:重佈層</p>
        <p type="p">13:上鈍化層</p>
        <p type="p">13a:上接合墊</p>
        <p type="p">14:下鈍化層</p>
        <p type="p">14a:下接合墊</p>
        <p type="p">100:封裝結構</p>
        <p type="p">110:封裝基板</p>
        <p type="p">110a:封裝基板上鈍化層</p>
        <p type="p">110b:封裝基板下鈍化層</p>
        <p type="p">112:核心</p>
        <p type="p">112a:導通孔</p>
        <p type="p">114:封裝基板上介電層</p>
        <p type="p">114a:封裝基板上接合墊</p>
        <p type="p">114b:金屬互連結構</p>
        <p type="p">116:封裝基板下介電層</p>
        <p type="p">116a:封裝基板下接合墊</p>
        <p type="p">116b:金屬互連結構</p>
        <p type="p">119:封裝底部填充層</p>
        <p type="p">120:半導體模組</p>
        <p type="p">121:C4凸塊</p>
        <p type="p">127:上模塑層</p>
        <p type="p">130:封裝蓋</p>
        <p type="p">130a:封裝蓋腳部分</p>
        <p type="p">130p:封裝蓋板部分</p>
        <p type="p">130s:封裝蓋段差部分</p>
        <p type="p">135:底表面</p>
        <p type="p">140:半導體晶粒</p>
        <p type="p">140a:半導體晶粒上表面</p>
        <p type="p">141:第一半導體晶粒</p>
        <p type="p">142:第二半導體晶粒</p>
        <p type="p">145:晶粒接合膜</p>
        <p type="p">145a:晶粒接合墊</p>
        <p type="p">150:反應性界面層</p>
        <p type="p">151:第一反應性界面層</p>
        <p type="p">152:第二反應性界面層</p>
        <p type="p">160:黏著層</p>
        <p type="p">170:複合熱界面材料(TIM)層</p>
        <p type="p">180:球柵陣列</p>
        <p type="p">181:焊球</p>
        <p type="p">190:表面組裝元件</p>
        <p type="p">200:密封劑</p>
        <p type="p">B,C,D:區域</p>
        <p type="p">W130s:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="930" publication-number="202619188">
    <tif-files tif-type="multi-tif">
      <tif file="113151261.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及電子設備的配件</chinese-title>
        <english-title>CONNECTOR AND ACCESSORIES FOR ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250425B">H01R13/629</main-classification>
        <further-classification edition="201101120250425B">H01R13/6581</further-classification>
        <further-classification edition="201101120250425B">H01R13/6591</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種連接器及電子設備的配件，連接器包括殼結構、端子組件、屏蔽結構和絕緣結構，絕緣結構設置於殼結構內，端子組件的至少部分結構以及屏蔽結構的至少部分結構分別埋設於絕緣結構內；其中，連接器具有第一端；屏蔽結構包括中間屏蔽件，中間屏蔽件包括中間屏蔽體以及包覆體，包覆體位於第一端，包覆體與中間屏蔽體固定連接；中間屏蔽體埋設在絕緣結構內，包覆體被設置為包覆絕緣結構周側壁的至少部分區域，且包覆體與絕緣結構的連接處平齊。中間屏蔽件中的包覆體能夠對頭部進行保護，結構強度高，在受到插拔力時能夠更好地分散應力，避免了局部應力集中導致的損壞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a connector and accessories for electronic equipment. The connector comprises a shell structure, a terminal assembly, a shielding structure and an insulating structure. The insulating structure is disposed in the shell structure. At least part of structure of the terminal assembly and at least part of structure of the shielding structure are respectively embedded in the insulating structure. The connector has a first end. The shielding structure comprises an intermediate shielding part, the intermediate shielding part comprises an intermediate shielding body and a covering body, the covering body is located at the first end, and the covering body and the intermediate shielding body are fixedly connected. The intermediate shielding body is embedded in the insulating structure, the covering body is arranged to cover at least part of peripheral side wall of the insulating structure, and joint between the covering body and the insulating structure is flush. The covering body in the intermediate shielding part can protect head with high structural strength, which can better disperse stress when subjected to insertion and extraction forces, so as to avoid damage caused by concentrated local stress.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">131:中間屏蔽件</p>
        <p type="p">1311:中間屏蔽體</p>
        <p type="p">1312:包覆體</p>
        <p type="p">1313:限位部</p>
        <p type="p">13121:第一包覆主體</p>
        <p type="p">13122:第一包覆支體</p>
        <p type="p">13131:限位凸體</p>
        <p type="p">13132:第一限位孔</p>
        <p type="p">13133:第一避讓通孔</p>
        <p type="p">13134:中間屏蔽連接部</p>
        <p type="p">131221:安裝體</p>
        <p type="p">131222:第三通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="931" publication-number="202619301">
    <tif-files tif-type="multi-tif">
      <tif file="113151270.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻調節結構</chinese-title>
        <english-title>RADIO FREQUENCY ADJUSTMENT STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H04B1/03</main-classification>
        <further-classification edition="200601120250512B">F16B39/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZHOU LUXSHARE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳克宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋振國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, ZHENGUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫興華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XINGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡豔姣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, YANJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種射頻調節結構，其包括：調螺和蓋板。前述調螺包括帽蓋部和位於前述帽蓋部中軸處的調螺桿部，前述調螺桿部定義了豎直方向，前述帽蓋部設有在前述豎直方向上螺旋環繞的內螺紋。前述蓋板包括基板部和自前述基板部向上凸伸的柱體部，前述蓋板具有在前述豎直方向上自上而下貫穿前述柱體部和前述基板部的貫通孔，前述柱體部設有在前述豎直方向上螺旋環繞的外螺紋。前述調螺桿部穿設於前述貫通孔且能夠依靠前述內螺紋與前述外螺紋之間的配合來調節其相對於前述蓋板的安裝深度。本發明避免了碎屑落入蓋板的下方，改善互調，優化了調頻效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A radio frequency adjustment structure includes a screw adjustment element and a cover plate. The screw adjustment includes a cap portion and a adjusting screw rod portion positioned at the central axis of the cap portion. The adjusting screw rod portion defines a vertical direction. The cap portion has internal threads spirally surrounding in the vertical direction. The cover plate includes a base portion and a cylinder portion that convexes upwards from the base portion. The cover plate has a through hole that penetrates through the cylinder portion and the base portion from top to bottom in the vertical direction. The cylinder portion has external threads spirally surrounding in the vertical direction. The adjusting screw rod portion is penetrated through the through hole, and the adjusting screw rod portion can rely on the cooperation between the internal threads and the external threads to adjust its installation depth relative to the cover plate. The present disclosure avoids debris falling below the cover plate, improves intermodulation, and optimizes the frequency modulation effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:環形空間</p>
        <p type="p">11:調螺桿部</p>
        <p type="p">111:內表面</p>
        <p type="p">112:外表面</p>
        <p type="p">12:帽蓋部</p>
        <p type="p">120:內螺紋</p>
        <p type="p">121:帽檐部</p>
        <p type="p">1211:內壁面</p>
        <p type="p">1212:外壁面</p>
        <p type="p">122:基部</p>
        <p type="p">220:外螺紋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="932" publication-number="202619183">
    <tif-files tif-type="multi-tif">
      <tif file="113151275.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及電子設備的配件</chinese-title>
        <english-title>CONNECTOR AND ACCESSORIES FOR ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250425B">H01R13/502</main-classification>
        <further-classification edition="200601120250425B">H01R13/52</further-classification>
        <further-classification edition="201101120250425B">H01R13/6591</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種連接器及電子設備的配件，連接器包括殼結構、端子組件、屏蔽結構和絕緣結構，端子組件的至少部分結構以及屏蔽結構的至少部分結構分別埋設於絕緣結構內；殼結構包括第一殼體和第二殼體，第一殼體套設在絕緣結構上，第一殼體設置有第一通孔，第二殼體嵌設在第一通孔內，並與第一殼體固定連接；第二殼體設置第二通孔，以暴露端子組件的部分結構。分體式殼結構的設計，提高了連接器的組裝效率和靈活性。第一殼體套設在絕緣結構上，起到了初步的保護和固定作用，第二殼體嵌設在第二通孔內，第二殼體具有第二通孔，形成半包狀態，與電路板連接時，可以實現封閉，對灰塵和濕氣等形成初步攔截，提升連接器的整體性能和安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a connector and accessories for electronic equipment. The connector comprises a shell structure, a terminal assembly, a shielding structure and an insulation structure. At least part of structure of the terminal assembly and at least part of structure of the shielding structure are respectively embedded in the insulation structure. The shell structure comprises a first shell body and a second shell body. The first shell body is sleeved on the insulation structure. The first shell body is disposed with a first through hole. The second shell body is embedded in the first through hole and connected with the first shell body fixedly. The second shell body is disposed with a second through hole to expose part of structure of the terminal assembly. The separated design of the shell structure improves the assembly efficiency and flexibility of the connector. The first shell body is sleeved on the insulation structure for preliminary protection and fixation. The second shell body is embedded in the second through hole. The second shell has a second through hole to form a half-packed state to be sealed to for preliminary interception of dust and moisture and to improve overall performance and safety of the connector when being in contact with circuit board.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器</p>
        <p type="p">11:殼結構</p>
        <p type="p">12:端子組件</p>
        <p type="p">13:屏蔽結構</p>
        <p type="p">14:絕緣結構</p>
        <p type="p">17:防水層</p>
        <p type="p">18:密封層</p>
        <p type="p">111:第一通孔</p>
        <p type="p">112:第一殼體</p>
        <p type="p">113:第二殼體</p>
        <p type="p">114:第二通孔</p>
        <p type="p">121:第一訊號端子組</p>
        <p type="p">122:第二訊號端子組</p>
        <p type="p">131:中間屏蔽件</p>
        <p type="p">132:外屏蔽件</p>
        <p type="p">141:第一絕緣件</p>
        <p type="p">142:第二絕緣件</p>
        <p type="p">143:第三絕緣件</p>
        <p type="p">1121:第一部分</p>
        <p type="p">1122:第二部分</p>
        <p type="p">1123:第三部分</p>
        <p type="p">1124:連接耳</p>
        <p type="p">11221:第二凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="933" publication-number="202619203">
    <tif-files tif-type="multi-tif">
      <tif file="113151277.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及電子設備的配件</chinese-title>
        <english-title>CONNECTOR AND ACCESSORIES FOR ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250425B">H01R13/6581</main-classification>
        <further-classification edition="201101120250425B">H01R13/6591</further-classification>
        <further-classification edition="200601120250425B">H01R13/502</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種連接器及電子設備的配件，連接器包括殼結構、端子組件、屏蔽結構和絕緣結構，絕緣結構設置於殼結構內，端子組件的至少部分結構以及屏蔽結構的至少部分結構分別埋設於絕緣結構內；屏蔽結構包括兩個外屏蔽件；外屏蔽件包括外屏蔽體以及沿連接器的第一方向對稱設置的兩個外屏蔽安裝部，外屏蔽安裝部與外屏蔽體固定連接，外屏蔽安裝部與絕緣結構限位連接；兩個外屏蔽體的外屏蔽安裝部沿連接器的第一方向錯開設置。採用了分體式的雙外屏蔽件設計，通過精密的佈局和連接方式，增強訊號傳輸穩定性和抗干擾能力，有效提升整體性能。且外屏蔽安裝部沿連接器的第一方向錯開設置，不會增大連接器的整體尺寸，適用於範圍更加廣泛的場景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a connector and accessories for electronic equipment. The connector comprises a shell structure, a terminal assembly, a shielding structure and an insulation structure. The insulation structure is disposed in the shell structure. At least part of structure of the terminal assembly and at least part of structure of the shielding structure are respectively embedded in the insulation structure. The shielding structure comprises two external shielding parts. The external shielding part comprises an external shielding body and two external shielding mounting portions symmetrically disposed along a first direction of the connector, the external shielding mounting portion is fixedly connected to the external shielding body, the external shielding mounting portion is limitedly connected to the insulation structure. the external shielding mounting portion of the two external shielding are staggered along the first direction of the connector. Design of separated two external shielding part is used to enhance signal transmission stability and anti-interference capabilities and effectively improve overall performance by precise layout and connection. Moreover, the external shielding mounting portion is staggered along the first direction of the connector and is suitable for more scenarios without increasing the overall size of the connector.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器</p>
        <p type="p">11:殼結構</p>
        <p type="p">12:端子組件</p>
        <p type="p">13:屏蔽結構</p>
        <p type="p">14:絕緣結構</p>
        <p type="p">17:防水層</p>
        <p type="p">18:密封層</p>
        <p type="p">111:第一通孔</p>
        <p type="p">112:第一殼體</p>
        <p type="p">113:第二殼體</p>
        <p type="p">114:第二通孔</p>
        <p type="p">121:第一訊號端子組</p>
        <p type="p">122:第二訊號端子組</p>
        <p type="p">131:中間屏蔽件</p>
        <p type="p">132:外屏蔽件</p>
        <p type="p">141:第一絕緣件</p>
        <p type="p">142:第二絕緣件</p>
        <p type="p">143:第三絕緣件</p>
        <p type="p">1121:第一部分</p>
        <p type="p">1122:第二部分</p>
        <p type="p">1123:第三部分</p>
        <p type="p">1124:連接耳</p>
        <p type="p">11221:第二凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="934" publication-number="202619170">
    <tif-files tif-type="multi-tif">
      <tif file="113151279.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及電子設備的配件</chinese-title>
        <english-title>CONNECTOR AND ACCESSORIES FOR ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250124B">H01R12/72</main-classification>
        <further-classification edition="200601120250124B">H01R13/40</further-classification>
        <further-classification edition="201101120250124B">H01R13/6581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種連接器及電子設備的配件，連接器包括殼結構、端子組件、屏蔽結構和絕緣結構，端子組件的至少部分結構以及屏蔽結構的至少部分結構分別埋設於絕緣結構內；殼結構包括第一殼體和第二殼體，第一殼體套設在絕緣結構上，第一殼體設置有第一通孔，第二殼體嵌設在第一通孔內，並與第一殼體固定連接；第二殼體設置第二通孔，以暴露端子組件的部分結構。分體式殼結構的設計，提高了連接器的組裝效率和靈活性。第一殼體套設在絕緣結構上，起到了初步的保護和固定作用，第二殼體嵌設在第二通孔內，第二殼體具有第二通孔，形成半包狀態，與電路板連接時，可以實現封閉，對灰塵和濕氣等形成初步攔截，提升連接器的整體性能和安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a connector and accessories for electronic equipment. The connector comprises a terminal assembly, a shielding structure and an insulation structure. At least part of structure of the terminal assembly and at least part of structure of the shielding structure are respectively embedded in the insulation structure. The shell structure is disposed outside of the insulation structure. The shell structure located at A second end is disposed with a first through hole. A colloid is injected into the shell structure through the first through hole, so that the colloid flows from the second end to a first end to a target position, and the colloid solidifies to form a waterproof layer. The colloid is injected into the shell structure through the first through hole, which can fill the gap between the insulation structure and the shell structure. The shell structure and the insulation structure are pre-assembled before glue is injected, which can intercept the colloid and prevent the colloid from randomly flowing, and a waterproof layer solidified can improve connection and waterproof, and help resist the erosion of external environment.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">17:防水層</p>
        <p type="p">143:第一絕緣件</p>
        <p type="p">144:絕緣連接柱</p>
        <p type="p">1431:第一絕緣體</p>
        <p type="p">1432:第二絕緣體</p>
        <p type="p">1433:第三絕緣體</p>
        <p type="p">1434:容膠空間</p>
        <p type="p">14311:排氣通道</p>
        <p type="p">14312:灌膠通道</p>
        <p type="p">14313:擋膠部</p>
        <p type="p">14314:避讓凹槽</p>
        <p type="p">14315:定位柱</p>
        <p type="p">14321:溢膠通道</p>
        <p type="p">14331:攔截部</p>
        <p type="p">143211:第一通道</p>
        <p type="p">143212:第二通道</p>
        <p type="p">143311:第一攔截體</p>
        <p type="p">143312:第二攔截體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="935" publication-number="202619108">
    <tif-files tif-type="multi-tif">
      <tif file="113151294.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及形成半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250922B">H01L23/522</main-classification>
        <further-classification edition="200601120250922B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁磐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JEN-PAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐曉秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIAO-CHIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容涉及半導體裝置的互連結構和形成此互連結構的方法。互連結構包括第一金屬線、在第一金屬線上的第二金屬線、以及電性耦合第一和第二金屬線的導電導孔。導電導孔包括側向地和垂直地延伸到第一金屬線內的突起，以減小介於導電導孔和第一金屬線之間的接觸電阻。該方法包括形成第一金屬線和在第一金屬線上的介電層，在介電層中形成開口以暴露第一金屬線，以及在開口中側向地凹陷化第一金屬線。該方法還包括在開口中沉積導電材料以形成導電導孔和第二金屬線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is directed to an interconnect structure of a semiconductor device and a method of forming the interconnect structure. The interconnect structure includes a first metal line, a second metal line on the first metal line, and a conductive via electrically coupling the first and second metal lines. The conductive via includes a protrusion laterally and vertically extending into the first metal line to reduce a contact resistance between the conductive via and the first metal line. The method includes forming the first metal line and a dielectric layer on the first metal line, forming an opening in the dielectric layer to expose the first metal line, and laterally recessing the first metal line in the opening. The method further includes depositing a conductive material in the opening to form the conductive via and the second metal line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:結構</p>
        <p type="p">222:介電層</p>
        <p type="p">224:介電層</p>
        <p type="p">230:蝕刻停止層</p>
        <p type="p">242:金屬線</p>
        <p type="p">244:金屬線</p>
        <p type="p">250:導電導孔</p>
        <p type="p">252:第一部分</p>
        <p type="p">252a:點(線)</p>
        <p type="p">252b:點(線)</p>
        <p type="p">252d:下表面</p>
        <p type="p">252u:上表面</p>
        <p type="p">254:第二部分</p>
        <p type="p">254s:側表面</p>
        <p type="p">260:阻障層</p>
        <p type="p">300:結構</p>
        <p type="p">A-A’:線</p>
        <p type="p">d:垂直厚度</p>
        <p type="p">d1:厚度</p>
        <p type="p">w1:寬度</p>
        <p type="p">w2:寬度</p>
        <p type="p">w3:側向延伸(長度)</p>
        <p type="p">w4:側向延伸(長度)</p>
        <p type="p">x:軸</p>
        <p type="p">y:軸</p>
        <p type="p">z:軸</p>
        <p type="p">α:角度</p>
        <p type="p">β:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="936" publication-number="202617287">
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      <tif file="113151421.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包裝盒清洗裝置</chinese-title>
        <english-title>PACKAGING BOX WASHING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250728B">B08B9/08</main-classification>
        <further-classification edition="202401120250728B">B08B1/14</further-classification>
        <further-classification edition="202401120250728B">B08B1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金英俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申崇舍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SEUNG SUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金順碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOON SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之包裝盒清洗裝置係用以對設置為可轉換成展開模式或盒子模式之保冷包裝盒進行清洗者，其可包括：至少一個清洗驅動部；及第1支持框架，其固定上述至少一個清洗驅動部；且上述清洗驅動部可包括：清洗毛巾，其設置為可擦拭上述保冷包裝盒之表面；清洗馬達，其設置為以垂直於上述清洗毛巾之軸為旋轉軸而使上述清洗毛巾旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">22:軸承部</p>
        <p type="p">101:清洗驅動部</p>
        <p type="p">110:上部清洗裝置</p>
        <p type="p">130:清洗毛巾</p>
        <p type="p">150:第1支持框架</p>
        <p type="p">151:框架軸</p>
        <p type="p">160:第2支持框架</p>
        <p type="p">340:清洗馬達</p>
        <p type="p">I-I':剖面線</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="937" publication-number="202618662">
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      <tif file="113151433.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微服務合併系統以及微服務合併方法</chinese-title>
        <english-title>MICROSERVICE MERGING SYSTEM AND MICROSERVICE MERGING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06Q50/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鼎捷數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIGIWIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎新數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATA SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諶豹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種微服務合併系統以及微服務合併方法。微服務合併系統包括儲存裝置以及處理器。處理器耦接儲存裝置，並且用以執行請求預處理模組、模組加載模組、以及服務調用模組。請求預處理模組對服務請求進行請求預處理，以獲得對應服務請求的請求數據。模組加載模組解析請求數據，以獲得對應請求數據的模組資訊，並且模組加載模組判斷模組資訊是否已載入至儲存裝置。響應於模組資訊未載入至儲存裝置，模組加載模組根據模組資訊載入模組以及服務資訊。服務調用模組根據服務資訊調用對應的微服務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microservice merging system and microservice merging method. The microservices merging system includes storage devices and processors. The processor is coupled to the storage device and is used to execute a request preprocessing module, a module loading module, and a service calling module. The request preprocessing module performs request preprocessing on service requests to obtain request data corresponding to the service requests. The module loading module parses the request data to obtain module information corresponding to the request data, and the module loading module determines whether the module information has been loaded into the storage device. In response to the module information not being loaded into the storage device, the module loading module loads module and service information based on the module information. The service calling module calls a corresponding microservice based on the service information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220、S230、S240、S250:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="938" publication-number="202617288">
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      <tif file="113151463.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包裝盒清洗機警報系統</chinese-title>
        <english-title>PACKAGING BOX WASHING MACHINE ALARM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250721B">B08B9/08</main-classification>
        <further-classification edition="200601120250721B">B08B13/00</further-classification>
        <further-classification edition="200601120250721B">G08B21/18</further-classification>
        <further-classification edition="200601120250721B">B65D81/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金英俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申崇舍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SEUNG SUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金順碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOON SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，可提供一種包裝盒清洗機警報系統，其包括：包裝盒清洗機，其以如下方式配置，即，將保冷包裝盒以鋪平狀態投入，於移送之同時清洗所投入之上述保冷包裝盒，該保冷包裝盒係以可轉換為展開模式或盒狀模式之方式配置者；操作部，其以如下方式配置，即，判斷上述包裝盒清洗機是否發生預設之警報情況；及警報裝置，其以如下方式配置，即，與上述操作部連接以於上述警報情況下發出警報。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:包裝盒清洗機</p>
        <p type="p">10:投入部</p>
        <p type="p">20:清洗部</p>
        <p type="p">20a:清洗區域</p>
        <p type="p">20b:驅動區域</p>
        <p type="p">24:罩蓋部</p>
        <p type="p">25,26:門部</p>
        <p type="p">27:壓力計</p>
        <p type="p">30:排出部</p>
        <p type="p">40:條碼讀取器</p>
        <p type="p">50:感測部</p>
        <p type="p">60:操作部</p>
        <p type="p">61:警報裝置</p>
        <p type="p">70:緊急停止按鈕</p>
        <p type="p">81:排水管</p>
        <p type="p">90:廢水箱</p>
        <p type="p">400:清洗水箱</p>
        <p type="p">430:注入口</p>
        <p type="p">A:移動路徑</p>
        <p type="p">P:保冷包裝盒</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="939" publication-number="202617269">
    <tif-files tif-type="multi-tif">
      <tif file="113151580.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種催化劑組合物及其製備和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">B01J29/80</main-classification>
        <further-classification edition="200601120250602B">B01J37/00</further-classification>
        <further-classification edition="200601120250602B">B01J37/04</further-classification>
        <further-classification edition="200601120250602B">C07C2/66</further-classification>
        <further-classification edition="200601120250602B">C07C15/073</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王達鋭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DARUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一棪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊為民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫洪敏</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SUN, HONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>沈震浩</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SHEN, ZHENHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>宦明耀</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HUAN, MINGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>劉威</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>何俊琳</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HE, JUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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                <last-name>陳展俊</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明公開了一種催化劑組合物及其製備方法和用於芳烴與烯烴烷基化的應用。所述催化劑組合物包含：（a）第一催化劑，所述第一催化劑為分子篩催化劑，靜態水初始接觸角θ1為10-15°，靜態水吸附量為220-280 mg/g；（b）第二催化劑，所述第二催化劑為分子篩催化劑，靜態水初始接觸角θ2為140-165°，靜態水吸附量為130-170 mg/g。所述催化劑組合物用於芳烴與烯烴烷基化製備烷基芳烴的反應時具有較高的活性、選擇性、穩定性以及耐雜質性能。</p>
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        <p type="p">
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          <doc-number>113151581</doc-number>
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        <chinese-title>一種MWW型分子篩催化劑及其製備和用途</chinese-title>
        <english-title></english-title>
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        <main-classification edition="200601120260105B">B01J29/70</main-classification>
        <further-classification edition="200601120260105B">C01B39/04</further-classification>
        <further-classification edition="200601120260105B">C07C2/66</further-classification>
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                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>王達鋭</last-name>
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                <last-name>WANG, DARUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>王一棪</last-name>
                <first-name></first-name>
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                <last-name>WANG, YIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>楊為民</last-name>
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                <last-name>YANG, WEIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>孫洪敏</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SUN, HONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>沈震浩</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SHEN, ZHENHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>宦明耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAN, MINGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>劉威</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>何俊琳</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HE, JUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明公開了一種MWW型分子篩催化劑及其製備方法和應用。所述催化劑可為無黏結劑分子篩催化劑，分子篩位於層內十元環孔道中T1、T3、T4、T5和T8共5個T位點的鋁佔T1、T2、T3、T4、T5、T6、T7和T8共8個T位點的鋁的≤45%，以及T2位點的鋁佔T1、T2、T3、T4、T5、T6、T7和T8共8個T位點的鋁的≥23%。所述催化劑用於芳烴與烯烴烷基化製備烷基芳烴的反應時能夠有效地抑制副反應，具有較高的活性和選擇性，同時適用於較低的芳烴與烯烴的莫耳比例進料條件。</p>
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          <doc-number>113151584</doc-number>
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      <invention-title>
        <chinese-title>負極及金屬電池</chinese-title>
        <english-title>NEGATIVE ELECTRODE AND METAL BATTERY</english-title>
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        <main-classification edition="201001120250613B">H01M4/134</main-classification>
        <further-classification edition="200601120250613B">H01M4/40</further-classification>
        <further-classification edition="201001120250613B">H01M10/052</further-classification>
        <further-classification edition="201001120250613B">H01M10/056</further-classification>
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              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>吳偉新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>顏吟赬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, YIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>王依仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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                <last-name>謝登存</last-name>
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              <english-name name-type="organization">
                <last-name>SHIEH, DENG-TSWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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                <last-name>卓俊傑</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
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              <address>臺北市</address>
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        <p type="p">一種負極及金屬電池。所述負極包括基材以及保護層。保護層配置於基材之上，且包含非晶質無機化合物層以及多個晶型氧化鋰顆粒。多個晶型氧化鋰顆粒分散於非晶質無機化合物層中。</p>
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        <p type="p">A negative electrode and a metal battery are provided. The negative electrode includes a substrate and a protective layer. The protective layer is disposed over the substrate, and includes an amorphous inorganic compound layer and crystalline lithium oxide particles. The crystalline lithium oxide particles are dispersed in the amorphous inorganic compound layer.</p>
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        <p type="p">100:負極</p>
        <p type="p">110:基材</p>
        <p type="p">110a、132a:上表面</p>
        <p type="p">110b、132b:下表面</p>
        <p type="p">130:保護層</p>
        <p type="p">132:非晶質無機化合物層</p>
        <p type="p">134:晶型氧化鋰顆粒</p>
        <p type="p">136:有機化合物層</p>
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        <chinese-title>快閃記憶體控制器和快閃記憶體控制器的分組密碼方法</chinese-title>
        <english-title>FLASH MEMORY CONTROLLER AND BLOCK CIPHER METHOD OF FLASH MEMORY CONTROLLER</english-title>
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      <classification-ipc>
        <main-classification edition="200601120250528B">G06F12/14</main-classification>
        <further-classification edition="201301120250528B">G06F21/70</further-classification>
        <further-classification edition="201601120250528B">G06F12/0866</further-classification>
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                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
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                <last-name>王文瓏</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>WANG, WEN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>李紘賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
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              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
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              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
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              <address>新北市</address>
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        <p type="p">一種快閃記憶體控制器的分組密碼方法包括：根據第二密鑰對種子值進行加密以產生加密後種子值；根據模式選擇訊號將加密後的種子值與        &lt;img align="absmiddle" height="31px" width="20px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;相乘以產生第j相乘結果；將第j相乘結果與第j個位置的明文區塊進行第一互斥或運算以產生第一互斥或結果；根據第一密鑰對第一互斥或結果進行加密以產生加密後互斥或結果；以及，將第j相乘結果與加密後互斥或結果進行第二互斥或運算以產生第二互斥或結果作為第j密文區塊，其中乘法步驟是由微控制器產生的模式選擇訊號或記錄在第0明文區塊中的模式選擇訊號所決定的。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A block cipher method of a flash memory controller includes: encrypting a seed value to generate an encrypted seed value according to a second key; multiplying the encrypted seed value with        &lt;img align="absmiddle" height="31px" width="20px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;according to a mode selection signal to generate a j-th multiplication result; performing a first XOR operation upon the j-th multiplication result and a j-th plaintext block to generate a first XOR result; encrypting the first XOR result to generate an encrypted XOR result according to a first key; and, performing a second XOR operation upon the j-th multiplication result and the encrypted XOR result to generate a second XOR result as a j-th ciphertext block; the multiplying step is determined by either the mode selection signal generated from a microcontroller or recorded in a 0-th plaintext block.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:快閃記憶體控制器</p>
        <p type="p">101:主機裝置</p>
        <p type="p">102:快閃記憶體裝置</p>
        <p type="p">105D:解密電路</p>
        <p type="p">105E:加密電路</p>
        <p type="p">110:微控制器</p>
        <p type="p">115A:第一加密電路</p>
        <p type="p">115B:第二加密電路</p>
        <p type="p">115C:第三加密電路</p>
        <p type="p">115D:第四加密電路</p>
        <p type="p">120A:第五加密電路</p>
        <p type="p">120B:第六加密電路</p>
        <p type="p">120C:第一解密電路</p>
        <p type="p">120D:第二解密電路</p>
        <p type="p">125A,125B:多工器</p>
        <p type="p">130A:第一互斥或電路</p>
        <p type="p">130B:第三互斥或電路</p>
        <p type="p">135A:第二互斥或電路</p>
        <p type="p">135B:第四互斥或電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="943" publication-number="202618963">
    <tif-files tif-type="multi-tif">
      <tif file="114100015.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片接合設備以及晶片接合方法</chinese-title>
        <english-title>WAFER BONDING EQUIPMENT AND WAFER BONDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250528B">H01L21/67</main-classification>
        <further-classification edition="200601120250528B">H01L21/60</further-classification>
        <further-classification edition="201401120250528B">B23K26/20</further-classification>
        <further-classification edition="201401120250528B">B23K26/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種晶片接合設備以及晶片接合方法。晶片接合設備包括一承載模組、一轉移模組、一限位模組、一接合模組、一控制模組以及一監控模組。承載模組被配置以用於承載一基板。轉移模組被配置以用於運送多個晶片元件。當轉移模組位於承載模組與限位模組之間時，控制模組驅使承載模組進行一接合動作、或者限位模組被驅使而進行一壓合動作，以使轉移模組的多個晶片元件接觸基板。控制模組驅使接合模組投射多個光束到基板上的多個黏接體，且控制模組驅使限位模組偵測自身的受力。監控模組用以監控該多個晶片元件的接合狀態，該監控模組利用不同延遲時間的監控用雷射對該多個晶片元件的形態參數進行探測，以即時監控該多個晶片元件的該接合狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer bonding equipment and a wafer bonding method are provided. The wafer bonding equipment includes a carrying module, a transfer module, a limiting module, a bonding module and a control module. The carrying module is configured to carry a substrate. The transfer module is configured to transport a plurality of wafer components. When the transfer module is located between the carrying module and the limiting module, the control module drives the carrying module to perform a bonding action, or the limiting module is driven to perform a pressing action, so as to make the plurality of wafer components of the transfer module to contact the substrate. The control module drives the bonding module to project a plurality of light beams to a plurality of bonding bodies on the substrate, and the control module drives the limiting module to detect its own force; and a monitoring module, configured to monitor the cutting status of the workpiece.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載模組</p>
        <p type="p">2:轉移模組</p>
        <p type="p">3:限位模組</p>
        <p type="p">30:載板元件</p>
        <p type="p">31:第一感測元件</p>
        <p type="p">E:晶片元件</p>
        <p type="p">P:基板</p>
        <p type="p">P1:黏接體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="944" publication-number="202618964">
    <tif-files tif-type="multi-tif">
      <tif file="114100021.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片接合設備以及晶片接合方法</chinese-title>
        <english-title>WAFER BONDING EQUIPMENT AND WAFER BONDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">H01L21/67</main-classification>
        <further-classification edition="200601120250123B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種晶片接合設備以及晶片接合方法。晶片接合設備包括一承載模組、一轉移模組、一限位模組、一接合模組、一控制模組以及一監控模組。承載模組被配置以用於承載一基板。轉移模組被配置以用於運送多個晶片元件。當轉移模組位於承載模組與限位模組之間時，控制模組驅使承載模組進行一接合動作、或者限位模組被驅使而進行一壓合動作，以使轉移模組的多個晶片元件接觸基板。控制模組驅使接合模組投射多個光束到基板上的多個黏接體，且控制模組驅使限位模組偵測自身的受力。監控模組用以監控該多個晶片元件的接合狀態，該監控模組利用不同延遲時間的監控用雷射對該多個晶片元件的形態參數進行探測，以即時監控該多個晶片元件的該接合狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer bonding equipment and a wafer bonding method are provided. The wafer bonding equipment includes a carrying module, a transfer module, a limiting module, a bonding module and a control module. The carrying module is configured to carry a substrate. The transfer module is configured to transport a plurality of wafer components. When the transfer module is located between the carrying module and the limiting module, the control module drives the carrying module to perform a bonding action, or the limiting module is driven to perform a pressing action, so as to make the plurality of wafer components of the transfer module to contact the substrate. The control module drives the bonding module to project a plurality of light beams to a plurality of bonding bodies on the substrate, and the control module drives the limiting module to detect its own force; and a monitoring module, configured to monitor the cutting status of the workpiece.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載模組</p>
        <p type="p">2:轉移模組</p>
        <p type="p">3:限位模組</p>
        <p type="p">30:載板元件</p>
        <p type="p">31:第一感測元件</p>
        <p type="p">E:晶片元件</p>
        <p type="p">P:基板</p>
        <p type="p">P1:黏接體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="945" publication-number="202619507">
    <tif-files tif-type="multi-tif">
      <tif file="114100096.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與記憶體裝置與其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND MEMORY DEVICES AND METHODS OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250429B">H10D1/60</main-classification>
        <further-classification edition="202501120250429B">H10D84/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一半導體裝置包含第一電晶體，該第一電晶體設置在一基板的第一側，且該第一電晶體包含一對第一源極/汲極特徵。半導體裝置包含第一互連結構，第一互連結構設置在基板相對第一側的第二側。半導體裝置包含第一記憶體元件，該第一記憶體元件設置在第二側，而該第一記憶體元件包含第一電容器。第一記憶體元件透過第一互連結構電耦合到第一源極/汲極特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first transistor disposed on a first side of a substrate, the first transistor including a pair of first source/drain features. The semiconductor device includes first interconnect structures disposed on a second side of the substrate opposite to the first side. The semiconductor device includes a first memory element disposed on the second side, where the first memory element includes a first capacitor. The first memory element is electrically coupled to one of the first source/drain features through the first interconnect structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:前側電晶體/FSTs</p>
        <p type="p">15:前側互連結構/FSLs</p>
        <p type="p">20:後側互連結構/BSLs</p>
        <p type="p">40:後側記憶體元件/BSM</p>
        <p type="p">42:IMD層</p>
        <p type="p">80:前側記憶體元件/FSM</p>
        <p type="p">82,83:IMD層</p>
        <p type="p">100H:裝置</p>
        <p type="p">102:基板</p>
        <p type="p">102B:後側</p>
        <p type="p">102F:前側</p>
        <p type="p">108:隔離結構</p>
        <p type="p">117:層間介電層/ILD層</p>
        <p type="p">120,122,124,126,128,130,140,144,148,152:IMD層</p>
        <p type="p">198:介電結構</p>
        <p type="p">BM0,BM1,BMX,BMX-1:金屬線</p>
        <p type="p">D:汲極特徵</p>
        <p type="p">L2:尺寸</p>
        <p type="p">M0,M1,MX:金屬線</p>
        <p type="p">MC:記憶單元</p>
        <p type="p">S:源極特徵</p>
        <p type="p">y,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="946" publication-number="202619011">
    <tif-files tif-type="multi-tif">
      <tif file="114100190.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卡盤</chinese-title>
        <english-title>CHUCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250613B">H01L21/683</main-classification>
        <further-classification edition="200601120250613B">H01L21/66</further-classification>
        <further-classification edition="200601120250613B">F28D1/06</further-classification>
        <further-classification edition="201801120250613B">F16L53/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商優悅微系統有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUETTE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, CHOON LEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HO YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　萬萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, BAN BAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種卡盤。卡盤包括支撐盤、支撐軸以及熱隔離件。所述所述支撐盤用於放置測試晶圓。所述支撐軸設置於所述支撐盤下方，以用於支撐所述支撐盤。所述熱隔離件設置在所述支撐盤與所述支撐軸之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a chuck. The chuck includes a support plate, a support shaft and a thermal isolation piece. The support plate is used to place test wafers. The support shaft is provided below the support plate for supporting the support plate. The thermal isolation member is provided between the support plate and the support shaft.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:卡盤</p>
        <p type="p">101:支撐盤</p>
        <p type="p">102:支撐軸</p>
        <p type="p">103:熱隔離件</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="947" publication-number="202618590">
    <tif-files tif-type="multi-tif">
      <tif file="114100227.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其資訊提供方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND PROVIDING INFORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">G06F17/40</main-classification>
        <further-classification edition="201301120250701B">G06F3/048</further-classification>
        <further-classification edition="202301120250701B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　基勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, KIYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾范</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONG BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴海妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全浩相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HO SANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電子裝置之資訊提供方法。資訊提供方法可包括如下步驟：自用戶之第1終端獲得對第1頁面之第1請求；基於複數個測試之資訊，確認與上述第1請求對應之第1測試；基於上述第1請求，確認構成上述第1頁面之一個以上之第1資料及與上述第1測試對應之一個以上的第2資料；及將基於上述一個以上之第1資料及上述一個以上之第2資料而構成之上述第1頁面的資訊提供至上述第1終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">120:用戶終端</p>
        <p type="p">140:管理者終端</p>
        <p type="p">S200:步驟</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S260:步驟</p>
        <p type="p">S270:步驟</p>
        <p type="p">S280:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="948" publication-number="202619445">
    <tif-files tif-type="multi-tif">
      <tif file="114100556.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算系統、電腦機箱、以及準備密封電腦系統的方法</chinese-title>
        <english-title>COMPUTING SYSTEM, COMPUTER CHASSIS, AND METHOD FOR PREPARING A SEALED COMPUTER SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250303B">H05K5/10</main-classification>
        <further-classification edition="200601120250303B">H05K7/20</further-classification>
        <further-classification edition="200601120250303B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逸傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳岳璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUEH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王得權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TE-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種無風扇、密封的電腦機箱，用於熱的環境。機箱可包括一機箱主體，具有一內壁以及一外壁。外壁可包括一或多個外部散熱元件，例如鰭片。機箱可包括一分隔壁，從內壁垂直地延伸。一熱電冷卻器的一熱側熱耦接至分隔壁的一端上的內壁。一印刷電路板(printed circuit board, PCB)可固定至機箱，使得分隔壁接觸印刷電路板(例如，經由一密封層)以將機箱的內部分成一第一封閉空間以及一第二封閉空間。第一封閉空間可包括熱電冷卻器以及一或多個熱敏部件，而第二封閉空間可包括一或多個耐熱部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fanless, sealed computer chassis for use in hot environments is disclosed. The chassis can include a chassis body having an outer wall and an inner wall. The outer wall can include external heat-dissipating features, such as fins. The chassis can include a dividing wall extending perpendicularly from the inner wall. A hot side of a thermoelectric cooler can be thermally coupled to the inner wall on one side of the dividing wall. A printed circuit board (PCB) can be secured to the chassis such that the dividing wall contacts the PCB (e.g., via a sealing layer) to divide the chassis' interior into a first enclosed space and a second enclosed space. The first enclosed space can include the thermoelectric cooler and one or more heat-susceptible components, while the second enclosed space can include one or more heat-tolerant components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:密封電腦系統</p>
        <p type="p">202:機箱</p>
        <p type="p">204:散熱鰭片</p>
        <p type="p">206:黏著層</p>
        <p type="p">208:熱電冷卻器</p>
        <p type="p">210:分隔壁</p>
        <p type="p">212:耐熱部件</p>
        <p type="p">214:印刷電路板</p>
        <p type="p">216:熱耦接材料</p>
        <p type="p">218:密封層</p>
        <p type="p">220:熱敏部件</p>
        <p type="p">222:第一封閉空間</p>
        <p type="p">224:第二封閉空間</p>
        <p type="p">228:溫度感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="949" publication-number="202619261">
    <tif-files tif-type="multi-tif">
      <tif file="114100589.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100589</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切換電感器、共振電路、及ＲＦ電源</chinese-title>
        <english-title>SWITCHED INDUCTOR, RESONANT CIRCUIT, AND RF POWER SUPPLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260128B">H02M7/48</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京三製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOSAN ELECTRIC MFG. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃瑞克　切札里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOREK, CEZARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>末永豊昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUENAGA, TOYOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的切換電感器具備變壓器與開關部的切換電感器，其中，開關部具備藉由變壓器之2次側線圈的兩端部間的斷續，切換1次側線圈之電感器的電感量的半導體開關部、控制半導體開關部之開關元件的開關動作的開關控制部、對半導體開關部的開關元件施加偏壓電壓的偏壓部，藉由偏壓電壓的施加，減低開關元件的輸出電容，提高切換電感器的自共振頻率，提升電感器的頻率特性並提升高頻區域的電感器的作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A switched inductor of the present invention includes a transformer and a switch unit. The switch unit includes a semiconductor switch unit that switches an inductance of an inductor of a primary coil by intermittently turning on and off between both ends of a secondary coil of the transformer, a switch controller that controls open and closing of a switching element in the semiconductor switch unit, and a bias unit that applies a bias voltage to the switching element of the semiconductor switch unit. The bias voltage is applied so that an output capacity of the switching element is decreased and thus a self-resonant frequency of the switched inductor is increased, thereby improving frequency characteristics of the inductor and enhancing the operation of the switched inductor in a high-frequency range.&lt;b/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:切換電感器</p>
        <p type="p">2:變壓器</p>
        <p type="p">2-1:1次側線圈</p>
        <p type="p">2-2:2次側線圈</p>
        <p type="p">3:開關部</p>
        <p type="p">3a:半導體開關部</p>
        <p type="p">3b:開關控制部</p>
        <p type="p">3c:偏壓部</p>
        <p type="p">3-1:端部</p>
        <p type="p">3-2:端部</p>
        <p type="p">L1:電感器</p>
        <p type="p">L2:電感器</p>
        <p type="p">SI-1:端部</p>
        <p type="p">SI-2:端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="950" publication-number="202619207">
    <tif-files tif-type="multi-tif">
      <tif file="114100642.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100642</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>端子連接器和電驅動總成</chinese-title>
        <english-title>TERMINAL CONNECTOR AND ELECTRIC DRIVE ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250120B">H01R24/20</main-classification>
        <further-classification edition="200601120250120B">H01R33/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商昆山聯滔電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANTO ELECTRONIC LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊冬昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, DONGCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊彥磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種端子連接器和電驅動總成，將端子排和導磁件設於安裝部，端子排具有用於傳輸三相電的多個連接端子，連接端子的第一連接端和第二連接端從安裝部伸出，以分別與電機控制器和驅動電機電連接。連接端子穿過導磁件的第一耦合空間，使連接端子產生的感應磁場耦合至導磁件。第二耦合空間設於安裝部外側，當端子連接器與電機控制器連接時，以便將感應元件設於第二耦合空間內側。實現對連接端子上電流的監測，節省電路板上設置電流感測器的布置空間。端子排直接與功率組件電連接，避免在兩者之間設置電流感測器，縮短導電通路長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a terminal connector and an electric drive assembly. A terminal array and a magnetic conductive element are disposed on a mounting portion. The terminal array is provided with a plurality of connection terminals for transmitting three-phase electrical power. A first connection end and a second connection end of the connection terminal extend from the mounting portion to be electrically connected to a motor controller and a driving motor respectively. The connection terminal passes through a first coupling space of the magnetic conductive element. so that an induced magnetic field generated by the connection terminal is coupled to the magnetic conductive element. a second coupling space is provided outside the mounting portion. When the terminal connector is connected to the motor controller, a sensing component is disposed inside the second coupling space. The monitoring of the current at the connection terminal is achieved. The layout space of the current sensor on the circuit board is saved. The terminal array is electrically connected to a power assembly directly to avoid disposing the current sensor between the terminal array and the power assembly. The length of the conductive path is shortened.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:安裝部</p>
        <p type="p">21:連接端子</p>
        <p type="p">211:第一連接端</p>
        <p type="p">212:第二連接端</p>
        <p type="p">3:導磁件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="951" publication-number="202618395">
    <tif-files tif-type="multi-tif">
      <tif file="114100769.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微顯示器的前光源微型ＬＥＤ</chinese-title>
        <english-title>FRONT LIGHT MICROLED FOR MICRODISPLAYS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G02B27/01</main-classification>
        <further-classification edition="200601120260128B">G02B27/18</further-classification>
        <further-classification edition="200601120260128B">G02B27/10</further-classification>
        <further-classification edition="200601120260128B">G02F1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於開發具有低功耗的高性能全彩微顯示器。具體而言，揭示光調變在微顯示器、偏振分光器、透明結構、及波導中的使用。使用光調變影像改善輸出影像解析度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the development of a high-performing full-color microdisplay with low power consumption. In particular, the use of light modulation in microdisplays, polarizing beamsplitter, transparent structures and waveguides is disclosed. The light modulation image is used to improve the output image resolution.&lt;b/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學結構</p>
        <p type="p">102:光調變微顯示器；ML</p>
        <p type="p">104:微型LED微顯示器；LM；LM微顯示器</p>
        <p type="p">106:偏振分光器(PBS)</p>
        <p type="p">108:影像</p>
        <p type="p">110:影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="952" publication-number="202619477">
    <tif-files tif-type="multi-tif">
      <tif file="114100822.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章思堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SZU-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造半導體結構的方法，包含沉積第一介電層於基板上；沉積第二介電層於第一介電層上；形成電容器於第一介電層與第二介電層中；沉積第一絕緣層於第二介電層與電容器上；形成字元線結構於第一絕緣層上；沉積第二絕緣層於字元線結構上；形成通道洞於第二絕緣層、字元線結構與第一絕緣層中，其中通道洞包含具有喇叭形開口的第一區間以及在第一區間下的第二區間；形成垂直通道於通道洞的第二區間中；以及形成著陸墊於通道洞的第一區間中。一種半導體結構亦在此揭露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of fabricating a semiconductor structure includes depositing a first dielectric layer on a substrate; depositing a second dielectric layer on the first dielectric layer; forming a capacitor in the first dielectric layer and the second dielectric layer; depositing a first insulating layer on the second dielectric layer and the capacitor; forming a word line structure on the first insulating layer; depositing a second insulating layer on the word line structure; forming a channel hole in the second insulating layer, the word line structure, and the first insulating layer, wherein the channel hole includes a first section with a trumpet shape opening and a second section below the first section; forming a vertical channel in the second section of the channel hole; and forming a landing pad in the first section of the channel hole. A semiconductor structure is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">110:基板</p>
        <p type="p">112:導體層</p>
        <p type="p">120:第一介電層</p>
        <p type="p">122:底部電容板</p>
        <p type="p">130:第二介電層</p>
        <p type="p">132:氧化物層</p>
        <p type="p">134:頂部電容板</p>
        <p type="p">135:第一部份</p>
        <p type="p">136:插塞</p>
        <p type="p">137:第二部分</p>
        <p type="p">140:第一絕緣層</p>
        <p type="p">150:字元線觸點</p>
        <p type="p">152:第一導電層</p>
        <p type="p">154:第二導電層</p>
        <p type="p">160:第二絕緣層</p>
        <p type="p">180:通道洞</p>
        <p type="p">182:第一區間</p>
        <p type="p">184:第二區間</p>
        <p type="p">190:閘極介電層</p>
        <p type="p">200:垂直通道</p>
        <p type="p">210:導體層</p>
        <p type="p">220:著陸墊</p>
        <p type="p">220T:頂表面</p>
        <p type="p">220B:底表面</p>
        <p type="p">230:位元線</p>
        <p type="p">CP:電容器</p>
        <p type="p">R:凹陷</p>
        <p type="p">S28:步驟</p>
        <p type="p">W5,W6,W7,W8:寬度</p>
        <p type="p">WL:字元線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="953" publication-number="202619404">
    <tif-files tif-type="multi-tif">
      <tif file="114100835.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影裝置及其控制方法</chinese-title>
        <english-title>PROJECTION DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250902B">H05B45/305</main-classification>
        <further-classification edition="202001120250902B">H05B45/20</further-classification>
        <further-classification edition="200601120250902B">G03B21/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中強光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊建鎰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昀世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUN-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種投影裝置，包括光源模組、光源驅動電路以及控制電路。光源模組包括至少一光源。光源驅動電路耦接光源模組。光源驅動電路用以根據致能信號控制光源模組的至少一光源的狀態為開啟。控制電路耦接光源驅動電路。控制電路用以提供致能信號至光源驅動電路。控制電路用以根據第一影像信號的幀率控制在一個幀期間內產生致能信號的次數。在一個幀期間內，光源模組的各至少一光源接收致能信號的次數與第一影像信號的幀率的乘積大於或等於參考值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projection device including a light source module, a light source driving circuit, and a control circuit is provided. The light source module includes at least light source. The light source driving circuit is coupled to the light source module. The light source driving circuit is configured to control a state of the at least light source of the light source module to be turned on according to an enable signal. The control circuit is coupled to the light source driving circuit. The control circuit is configured to provide the enable signal to the light source driving circuit. The control circuit is configured to control times that the enable signal is generated during a frame period according to a frame rate of the first image signal. The product of times that each of the at least one light source of the light source module receives the enable signal and the frame rate of the first image signal during the frame period is greater than or equal to a reference value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:投影裝置</p>
        <p type="p">110:光源模組</p>
        <p type="p">110B、110G、110R:光源</p>
        <p type="p">120:光源驅動電路</p>
        <p type="p">121:第一驅動電路</p>
        <p type="p">122:第二驅動電路</p>
        <p type="p">123:第三驅動電路</p>
        <p type="p">130:控制電路</p>
        <p type="p">B_En:第三致能信號</p>
        <p type="p">D_IN1:第一影像信號</p>
        <p type="p">EN:致能信號</p>
        <p type="p">G_En:第二致能信號</p>
        <p type="p">PWM:調變信號</p>
        <p type="p">R_En:第一致能信號</p>
        <p type="p">S1:光閥控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="954" publication-number="202618199">
    <tif-files tif-type="multi-tif">
      <tif file="114101911.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱組件</chinese-title>
        <english-title>HEAT DISSIPATION ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">F28D15/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文鏵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖建順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAW, JANE-SUNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉陽光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YANG-GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱組件用以熱接觸於一熱源並包含一第一腔體、至少三連通腔體、至少二第一散熱鰭片組以及一第二腔體。第一腔體具有一熱接觸面及一第一腔室，熱接觸面用以熱接觸於熱源。至少三連通腔體各自具有連通於第一腔室的至少一連通流道。至少二第一散熱鰭片組分別設置於連通腔體之間。第二腔體具有一第二腔室。第二腔室至少透過其中一個連通腔體的至少一連通流道連通於第一腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation assembly configured to be in thermal contact with a heat source and includes a first chamber, at least three connecting chambers, at least two first heat sink and a second chamber. The first chamber has a thermal contact surface and a first space and the thermal contact surface is configured to be in contact with the heat source. The at least three connecting chambers each have at least one connecting channel connected to the first space. The at least two heat sink are respectively disposed between the connecting chambers. The second chamber has a second space. The second space is connected to the first chamber at least by the at least one connecting channel of one connecting chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:散熱組件</p>
        <p type="p">100:第一腔體</p>
        <p type="p">130:底蓋板</p>
        <p type="p">131:熱接觸面</p>
        <p type="p">200:連通腔體</p>
        <p type="p">300:第一散熱鰭片組</p>
        <p type="p">400:擋風板</p>
        <p type="p">500:第二腔體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="955" publication-number="202618773">
    <tif-files tif-type="multi-tif">
      <tif file="114102027.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體實體層介面、記憶裝置及其方法</chinese-title>
        <english-title>MEMORY PHYSICAL LAYER INTERFACE, MEMORY APPARATUS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G11C11/4063</main-classification>
        <further-classification edition="200601120250602B">G06F13/38</further-classification>
        <further-classification edition="201601120250602B">G06F12/08</further-classification>
        <further-classification edition="200601120250602B">H04B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智原科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARADAY TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩勃拉曼尼亞　西瓦拉馬克里什南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANIAN, SIVARAMAKRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝克　侯賽因瓦利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAIK, HUSSAINVALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫漢塔　桑迪普　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOHANTA, SANDEEP KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞卡　皮迪　西瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKHAR, PYDI SIVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷迪　埃斯瓦爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDI, ESWAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇雷什　巴西姆塞蒂　蘇布拉曼亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURESH, BASIMSETTI SUBRAHMANYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶裝置包括記憶體裝置、記憶體控制器和記憶體實體層介面。記憶體實體層介面包括多分接頭決策回饋等化（DFE）接收器和分接頭重置電路。分接頭重置電路根據讀取脈衝之間的間隙間隔產生脈衝訊號和重置訊號，以在讀取脈衝之間的間隙間隔重置多分接頭DFE接收器的DFE分接頭。響應於確定出讀取脈衝之間的間隙間隔為第一預定間隔，分接頭重置電路使用脈衝訊號重置所述多分接頭DFE接收器的DFE分接頭。響應於確定出讀取脈衝之間的間隙間隔為第二預定間隔，分接頭重置電路使用重置訊號重置多分接頭DFE接收器的DFE分接頭。第二預定間隔大於第一預定間隔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory apparatus includes a memory device, a memory controller and a memory physical layer interface. The memory physical layer interface comprises a multi-tap decision feedback equalization (DFE) receiver and a tap reset circuit. The tap reset circuit generates a pulse signal and a reset signal in accordance with a gap interval between read bursts to reset a DFE taps of the multi-tap DFE receiver during the gap interval between the read bursts. The tap reset circuit resets the plurality of DFE taps using the pulse signal in response to determining that the gap interval between read bursts is a first predetermined interval. The tap reset circuit resets the plurality of DFE taps of the multi-tap DFE receiver using the reset signal in response to determining that the gap interval between read bursts is a second predetermined interval. The second predetermined interval is greater than the first predetermined interval.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:記憶體裝置</p>
        <p type="p">120:記憶體實體層介面</p>
        <p type="p">121:多分接頭DFE接收器</p>
        <p type="p">122:閘控時脈產生電路</p>
        <p type="p">123:分接頭重置電路</p>
        <p type="p">130:記憶體控制器</p>
        <p type="p">dfi_rddata_en:讀取啟用訊號</p>
        <p type="p">DQ:資料訊號</p>
        <p type="p">DQS:資料選通訊號</p>
        <p type="p">IE:內部啟用訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="956" publication-number="202619425">
    <tif-files tif-type="multi-tif">
      <tif file="114102178.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102178</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251027B">H05K1/14</main-classification>
        <further-classification edition="200601120251027B">H01L23/50</further-classification>
        <further-classification edition="200601120251027B">H01L23/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旋乃仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUAN, NAI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊文呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包含基板、電路層、介電層、走線層、金屬緩衝層及金屬打線墊。電路層設置於基板的上表面。介電層設置於電路層的上表面。走線層設置於電路層的上表面且位於介電層中。金屬緩衝層設置於走線層的上表面且位於介電層中。金屬打線墊設置於金屬緩衝層的上表面。本案更提供一種半導體結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a circuit layer, a dielectric layer, a trace layer, a metal buffer layer, and a metal wire-bonding pad. The circuit layer is disposed on the upper surface of the substrate. The dielectric layer is disposed on the upper surface of the circuit layer. The trace layer is disposed on the upper surface of the circuit layer and located within the dielectric layer. The metal buffer layer is disposed on the upper surface of the trace layer and located within the dielectric layer. The metal wire-bonding pad is disposed on the upper surface of the metal buffer layer. A semiconductor structure is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:基板</p>
        <p type="p">11:電路層</p>
        <p type="p">12:介電層</p>
        <p type="p">13:走線層</p>
        <p type="p">14:金屬緩衝層</p>
        <p type="p">15:金屬打線墊</p>
        <p type="p">16:鈍化層</p>
        <p type="p">131:垂直走線</p>
        <p type="p">132,1321,1322:水平走線</p>
        <p type="p">161:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="957" publication-number="202618965">
    <tif-files tif-type="multi-tif">
      <tif file="114102299.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102299</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安裝有基板加熱部的基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE TREATMENT APPARATUS HAVING SUBSTRATE HEATER AND SUBSTRATE TREATMENT METHOD USING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251017B">H01L21/67</main-classification>
        <further-classification edition="200601120251017B">H05B33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商迪佰世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEVICE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李澤燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAEK YOUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及安裝有基板加熱部的基板處理裝置。所述安裝有基板加熱部的基板處理裝置包括：基板保持單元、處理液供給單元、基板加熱部以及隔斷板。基板保持單元用於保持及旋轉基板；處理液供給單元向保持在所述基板保持單元的基板的上表面或下表面供給處理液；基板加熱部設置在所述基板的下部，安裝有多個發光二極體，用於對所述基板進行加熱；隔斷板設置在所述基板保持單元中且位於所述基板加熱部的上側，能夠透射朝向所述基板的光，並防止處理液流入到所述基板加熱部。相對於所述基板的中心，所述基板加熱部的圓周方向一部分由多個發光二極體的集成度沿著半徑方向存在不同的發光二極體不均勻分布部構成，所述圓周方向剩餘部分由多個發光二極體均勻分布的發光二極體均勻分布部構成。由此，當處理基板時，應對在完成之前工序之後發生的半徑方向的厚度偏差來沿著半徑方向不同地控制基板的加熱溫度，沿著所述半徑方向的基板的處理量可以相對存在差異，從而可以防止因尺寸不良所引起的收率降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a substrate treatment apparatus having a substrate heater. The substrate treatment apparatus having a substrate heater comprises: a substrate holding unit, a treatment liquid supply unit, a substrate heater, and a partition plate. The substrate holding unit is used to hold and rotate a substrate; the treatment liquid supply unit supplies a treatment liquid to an upper surface or a lower surface of the substrate held by the substrate holding unit; the substrate heater is arranged at the lower part of the substrate, and a plurality of light emitting diodes are installed on the substrate heater to heat the substrate; the partition plate is provided in the substrate holding unit and is located on an upper side of the substrate heater, and can transmit light toward the substrate and prevent the treatment liquid from flowing into the substrate heater. Relative to the center of the substrate, a portion of the substrate heater in the circumferential direction is composed of a plurality of light emitting diodes with different integration degrees along the radial direction and unevenly distributed, and the remaining portion in the circumferential direction is composed of a light-emitting diode uniformly distributed part, in which a plurality of light-emitting diodes are uniformly distributed. Therefore, when processing a substrate, the thickness deviation in the radial direction generated after the previous process is completed is handled by controlling the heating temperature of the substrate differently along the radial direction so that the processing amount along the radial direction is different, thereby preventing the yield is reduced due to dimensional defects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:基板加熱部</p>
        <p type="p">310:發光二極體</p>
        <p type="p">320:發光二極體不均勻分布部</p>
        <p type="p">321、322、323、324:差等加熱通道部</p>
        <p type="p">330:發光二極體均勻分布部</p>
        <p type="p">380:加熱單元</p>
        <p type="p">A、B、C、D:半徑方向區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="958" publication-number="202619180">
    <tif-files tif-type="multi-tif">
      <tif file="114102587.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源連接器、電源端子組件及連接器組合</chinese-title>
        <english-title>POWER CONNECTOR, POWER TERMINAL ASSEMBLY AND CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">H01R13/40</main-classification>
        <further-classification edition="200601120250418B">H01R13/514</further-classification>
        <further-classification edition="201101120250418B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商歐品電子（昆山）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUPIIN ELECTRONIC (KUNSHAN) CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種電源連接器、電源端子組件及連接器組合。電源端子組件包括第一電源端子、與第一電源端子合併的第二電源端子、設置於第一電源端子上的至少一個夾持結構、以及設置於第二電源端子上的至少一個插入結構。夾持結構包括相對設置的兩個夾持梁。插入結構包括對折形成的第一直梁和第二直梁。在對接時，第一電源端子和第二電源端子不會分離。因此，本發明電源端子組件結構穩定，具備安全的對接功能，能為本發明電源連接器和連接器組合提供穩定的電流傳導能力，提高使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power connector, a power terminal assembly and a connector assembly are disclosed in this application. The power terminal assembly includes a first power terminal, a second power terminal combined with the first power terminal, at least one clamping structure disposed on the first power terminal, and at least one insertion structure disposed on the second power terminal. The clamping structure includes two opposite clamping beams. The insertion structure includes a first straight beam and a second straight beam formed by folding. When mating, the first terminal and the second terminal can not separate. Therefore, power terminal assembly of the application has a stable and safe engaging structure to provide stable current conduction capability for the power connector and the connector assembly of the present application and improve service life.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電源端子組件(第一類型電源端子組件)</p>
        <p type="p">21:第一電源端子</p>
        <p type="p">210:第一主體</p>
        <p type="p">2101:第一對接側</p>
        <p type="p">211:夾持結構</p>
        <p type="p">212:夾持梁</p>
        <p type="p">217:第一連接結構</p>
        <p type="p">22:第二電源端子</p>
        <p type="p">220:第二主體</p>
        <p type="p">2201:第二對接側</p>
        <p type="p">221:插入結構</p>
        <p type="p">222:第一直梁</p>
        <p type="p">223:第二直梁</p>
        <p type="p">224:對折段</p>
        <p type="p">225:第二連接結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="959" publication-number="202619257">
    <tif-files tif-type="multi-tif">
      <tif file="114102652.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多相LLC諧振轉換器</chinese-title>
        <english-title>MULTI-PHASE LLC RESONANT CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02M3/325</main-classification>
        <further-classification edition="200601120250602B">H02M7/217</further-classification>
        <further-classification edition="200601120250602B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIOU, BO RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多相LLC諧振轉換器，包括諧振腔、開關電路及整流電路。諧振腔包括諧振電路及變壓器。諧振電路包括多個諧振電感，且諧振電感以三角形接法連接。開關電路配置在變壓器的一次側，且具有半橋結構。整流電路配置在變壓器的二次側，且具有全橋結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-phase LLC resonant converter including a resonant cavity, a switch circuit and a rectifier circuit is provided. The resonant cavity includes a resonant circuit and a transformer. The resonant circuit includes a plurality of resonant inductors, and the resonant inductors are connected in a triangular connection. The switch circuit is disposed at the primary side of the transformer and has a half-bridge structure. The rectifier circuit is disposed at the secondary side of the transformer and has a full-bridge structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多相LLC諧振轉換器</p>
        <p type="p">110:開關電路</p>
        <p type="p">120:諧振腔</p>
        <p type="p">122:諧振電路</p>
        <p type="p">124:變壓器</p>
        <p type="p">130:整流電路</p>
        <p type="p">Cr:諧振電容</p>
        <p type="p">Lr:諧振電感</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="960" publication-number="202618363">
    <tif-files tif-type="multi-tif">
      <tif file="114102727.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合式光柵耦合器及使用其的光學系統</chinese-title>
        <english-title>INTEGRATED GRATING COUPLER AND OPTICAL SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251017B">G02B6/34</main-classification>
        <further-classification edition="200601120251017B">G02B6/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>采鈺科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISERA TECHNOLOGIES COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾國方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, KUO-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝馨儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, PO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古士良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, SHIH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種整合式光柵耦合器。整合式光柵耦合器包含基板及反射器，反射器設置於基板之上。整合式光柵耦合器也包含金屬光柵結構，金屬光柵結構設置於反射器的上方。整合式光柵耦合器更包含波導，波導設置於金屬光柵結構的上方，其中波導包含主光柵結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated grating coupler is provided. The integrated grating coupler includes a substrate and a reflector disposed on the substrate. The integrated grating coupler also includes a metal grating structure disposed over the reflector. The integrated grating coupler further includes a waveguide disposed over the metal grating structure, wherein the waveguide includes a main grating structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學系統</p>
        <p type="p">100:整合式光柵耦合器</p>
        <p type="p">10:基板</p>
        <p type="p">20:反射器</p>
        <p type="p">21:高折射率膜</p>
        <p type="p">23:低折射率膜</p>
        <p type="p">30:金屬光柵結構</p>
        <p type="p">30R,40R:凹部</p>
        <p type="p">30R1,40R1:第一凹部</p>
        <p type="p">40:波導</p>
        <p type="p">40G:主光柵結構</p>
        <p type="p">40N:法線方向</p>
        <p type="p">51:第一包覆層</p>
        <p type="p">53:第二包覆層</p>
        <p type="p">70:光源</p>
        <p type="p">70A:光軸</p>
        <p type="p">70E:發光面</p>
        <p type="p">A1,A2,C2,D4,D5,D6:最短距離</p>
        <p type="p">A3:夾角</p>
        <p type="p">B1:寬度</p>
        <p type="p">B2:最大厚度</p>
        <p type="p">B3:深度</p>
        <p type="p">B4,C1,C3,E1,E2,E3,F1:厚度</p>
        <p type="p">D1:寬度</p>
        <p type="p">D2:最大厚度</p>
        <p type="p">D3:深度</p>
        <p type="p">D70:直徑</p>
        <p type="p">X,Z:坐標軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="961" publication-number="202618868">
    <tif-files tif-type="multi-tif">
      <tif file="114102778.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低溫磊晶生長的紫外線（ＵＶ）處理腔室</chinese-title>
        <english-title>ULTRAVIOLET (UV) TREATMENT CHAMBER FOR LOW TEMPERATURE EPITAXIAL GROWTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/02</main-classification>
        <further-classification edition="200601120260128B">C23C16/02</further-classification>
        <further-classification edition="200601120260128B">C23C16/52</further-classification>
        <further-classification edition="200601120260128B">C30B25/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷斯堤格　艾巴斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RASTEGAR, ABBAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於用於處理腔室中的氣體活化的發光電漿，以及相關設備及方法。在一或多個實施例中，一種處理系統包括移送腔室。至少一個膜形成腔室耦合到移送腔室。氧化物移除腔室耦合到移送腔室。紫外線(UV)處理腔室耦合到移送腔室。UV處理腔室包括基板支撐件及UV能量源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to photo-emitting plasma for gas activation in processing chambers, and related apparatus and methods. In one or more embodiments, a processing system includes a transfer chamber. At least one film formation chamber is coupled to the transfer chamber. An oxide removal chamber is coupled to the transfer chamber. An ultraviolet (UV) treatment chamber is coupled to the transfer chamber. The UV treatment chamber includes a substrate support and an UV energy source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">300:UV處理腔室</p>
        <p type="p">305:內部體積</p>
        <p type="p">310:腔室主體</p>
        <p type="p">311:底部</p>
        <p type="p">314:蓋組件</p>
        <p type="p">320:能量源</p>
        <p type="p">330:氣體分配板</p>
        <p type="p">340:加熱源</p>
        <p type="p">350:氣體源</p>
        <p type="p">360:基板支撐組件</p>
        <p type="p">370:泵</p>
        <p type="p">500:電漿燈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="962" publication-number="202618818">
    <tif-files tif-type="multi-tif">
      <tif file="114102786.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>陶瓷核心電感組件</chinese-title>
        <english-title>CERAMIC-CORE INDUCTOR COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251029B">H01F17/03</main-classification>
        <further-classification edition="200601120251029B">H01F27/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商樓氏英國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNOWLES (UK) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里奇　喬治　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KERRIDGE, GEORGE W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以利斯　馬修　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLIS, MATTHEW J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以利斯　亞倫　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLIS, AARON J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬利　彼得　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARLEY, PETER M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇斯坦提諾　史蒂芬妮　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSTANTINO, STEPHEN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種陶瓷核心電感組件包含一線圈，該線圈安置於具有8或更小之一介電常數之一陶瓷核心之一部分周圍且電連接至安置於對應支座上之導電襯墊，其中該陶瓷核心電感組件具有歸因於一較高品質因數及一較高自諧振頻率之經改良效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ceramic-core inductor component includes a wire coil disposed about a portion of a ceramic-core having a dielectric constant of 8 or less and electrically connected to conductive pads disposed on corresponding standoffs, wherein the ceramic-core inductor component has improved performance attributable to a higher quality factor and a higher self-resonant frequency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:陶瓷核心電感組件</p>
        <p type="p">110:陶瓷核心</p>
        <p type="p">114:第一凸緣</p>
        <p type="p">116:第二凸緣</p>
        <p type="p">120:導電線圈</p>
        <p type="p">130:第一端子</p>
        <p type="p">132:第二端子</p>
        <p type="p">136:非導電把手</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="963" publication-number="202619260">
    <tif-files tif-type="multi-tif">
      <tif file="114102847.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多相位轉換電路及多相位轉換器</chinese-title>
        <english-title>MULTIPLE PHASES CONVERTING CIRCUIT AND MULTIPLE PHASES CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02M3/335</main-classification>
        <further-classification edition="200601120250602B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIOU, BO-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一方面為一種多相位轉換電路，包括一次側開關電路。一次側開關電路包括多個電晶體互補對。多個電晶體互補對以並聯耦接。多相位轉換電路同樣包括諧振槽，耦接至一次側開關電路及包括多個電容、多個諧振電感及多個變壓器。多相位轉換電路同樣包括二次側開關電路耦接於諧振槽，二次側開關電路為全橋(full bridge)架構。一次側開關電路的多個電晶體互補對之各者包括互補的第一電晶體及第二電晶體。第一電晶體及第二電晶體以串聯耦接。多個電晶體互補對之各者的第一電晶體與第二電晶體之間具有節點。節點耦接至諧振槽的多個諧振電感的其中對應一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aspect of the present disclosure features a multiple phases converting circuit, including a primary side switch circuit. The primary side switch circuit includes multiple transistor complementary pairs. The multiple transistor complementary pairs are parallel-connected. The multiple phases converting circuit also includes resonant slot coupled to the primary side switch circuit and including multiple capacitors, multiple resonant inductors and multiple transformers. The multiple phases converting circuit also includes a secondary side switch circuit. The secondary side switch circuit is formed by a full bridge structure. Each transistor complementary pair includes a first transistor and a second transistor. The first transistor and the second transistor are serial-connected. Each transistor complementary pair includes a node between the first transistor and the second transistor. The node is coupled to respective one of the resonant inductors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:多相位轉換電路</p>
        <p type="p">100:一次側開關電路</p>
        <p type="p">200:二次側開關電路</p>
        <p type="p">300:諧振槽</p>
        <p type="p">C&lt;sub&gt;out&lt;/sub&gt;:輸出電容</p>
        <p type="p">C&lt;sub&gt;r1_Pri&lt;/sub&gt;~C&lt;sub&gt;r3_Pri&lt;/sub&gt;:一次側諧振電容</p>
        <p type="p">C&lt;sub&gt;r1_Sec&lt;/sub&gt;~C&lt;sub&gt;r3_Sec&lt;/sub&gt;:二次側諧振電容</p>
        <p type="p">I&lt;sub&gt;P1&lt;/sub&gt;:第一相電流</p>
        <p type="p">I&lt;sub&gt;P2&lt;/sub&gt;:第二相電流</p>
        <p type="p">I&lt;sub&gt;P3&lt;/sub&gt;:第三相電流</p>
        <p type="p">I&lt;sub&gt;Pri&lt;/sub&gt;:一次側電流</p>
        <p type="p">I&lt;sub&gt;Lm&lt;/sub&gt;:一次側電感電流</p>
        <p type="p">I&lt;sub&gt;Sec&lt;/sub&gt;:二次側電流</p>
        <p type="p">L&lt;sub&gt;r1&lt;/sub&gt;~L&lt;sub&gt;r3&lt;/sub&gt;:一次側諧振電感</p>
        <p type="p">n&lt;sub&gt;1&lt;/sub&gt;,n&lt;sub&gt;2&lt;/sub&gt;,n&lt;sub&gt;3&lt;/sub&gt;:節點</p>
        <p type="p">Q&lt;sub&gt;A_P1&lt;/sub&gt;~Q&lt;sub&gt;A_P3&lt;/sub&gt;:第一電晶體</p>
        <p type="p">Q&lt;sub&gt;B_P1&lt;/sub&gt;~Q&lt;sub&gt;B_P3&lt;/sub&gt;:第二電晶體</p>
        <p type="p">Q&lt;sub&gt;C_P1&lt;/sub&gt;~Q&lt;sub&gt;F_P3&lt;/sub&gt;:電晶體</p>
        <p type="p">R&lt;sub&gt;out&lt;/sub&gt;:輸出電阻</p>
        <p type="p">T&lt;sub&gt;r1&lt;/sub&gt;~T&lt;sub&gt;r3&lt;/sub&gt;:變壓器</p>
        <p type="p">V&lt;sub&gt;BUS&lt;/sub&gt;:輸入電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="964" publication-number="202619193">
    <tif-files tif-type="multi-tif">
      <tif file="114102865.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源連接器、電源端子組件及連接器組合</chinese-title>
        <english-title>POWER CONNECTOR, POWER TERMINAL ASSEMBLY AND CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">H01R13/639</main-classification>
        <further-classification edition="200601120250210B">H01R13/22</further-classification>
        <further-classification edition="200601120250210B">H01R13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商歐品電子（昆山）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUPIIN ELECTRONIC (KUNSHAN) CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種電源連接器、電源端子組件及連接器組合。電源連接器包括絕緣基座和至少一個電源端子組件。電源端子組件包括合併在一起的第一電源端子和第二電源端子。第一電源端子包括至少一個第一彎曲型斜梁和至少一個對折型直梁，第二電源端子包括至少一個第二彎曲型斜梁。第一彎曲型斜梁和第二彎曲型斜梁共同構成一對夾持梁，而對折型直梁構成一個插入梁，從而能夠提供安全的對接功能、能提供穩定的電流傳導能力、提高使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power connector, a power terminal assembly and a connector assembly are disclosed in this application. The power connector includes an insulation base and at least one power terminal assembly. The power terminal assembly includes a first power terminal and a second power terminal combined together. The first power terminal includes at least one first bent inclined beam and at least one folded straight beam. The second power terminal includes at least one second bent inclined beam. The first and second bent inclined beams construct a pair of clamping beams, and the folded straight beam constructs one insertion beam, thereby providing safe engagement function and stable current conduction capability and improving service life of the power terminal assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電源端子組件(第一類型電源端子組件)</p>
        <p type="p">21:第一電源端子</p>
        <p type="p">210:第一主體</p>
        <p type="p">2101:第一對接側</p>
        <p type="p">2102:第一固定側</p>
        <p type="p">2103:第一安裝側</p>
        <p type="p">2104:第一尾端側</p>
        <p type="p">211:第一彎曲型斜梁</p>
        <p type="p">2110:第一擴張部</p>
        <p type="p">2111:第一接觸部</p>
        <p type="p">2112:第一導引部</p>
        <p type="p">212:對折型直梁</p>
        <p type="p">2120:第一直部</p>
        <p type="p">2121:第二直部</p>
        <p type="p">2123:對折部</p>
        <p type="p">213:針腳</p>
        <p type="p">214:肩部</p>
        <p type="p">215:凸起</p>
        <p type="p">22:第二電源端子</p>
        <p type="p">220:第二主體</p>
        <p type="p">2201:第二對接側</p>
        <p type="p">2202:第二固定側</p>
        <p type="p">2203:第二安裝側</p>
        <p type="p">2204:第二尾端側</p>
        <p type="p">221:第二彎曲型斜梁</p>
        <p type="p">2210:第二擴張部</p>
        <p type="p">2211:第二接觸部</p>
        <p type="p">2212:第二導引部</p>
        <p type="p">222:凹口</p>
        <p type="p">2220:側邊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="965" publication-number="202618136">
    <tif-files tif-type="multi-tif">
      <tif file="114102904.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇及電子設備</chinese-title>
        <english-title>FAN AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250914B">F04D29/66</main-classification>
        <further-classification edition="200601120250914B">F04D29/40</further-classification>
        <further-classification edition="200601120250914B">F04D29/38</further-classification>
        <further-classification edition="200601120250914B">F04D29/063</further-classification>
        <further-classification edition="200601120250914B">F04D29/04</further-classification>
        <further-classification edition="200601120250914B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻準精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JING-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONG-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇，包括殼體、葉輪和軸承。殼體包括底板和軸套，軸套限定內部空間。葉輪包括輪轂、軸桿和止推片。軸承設於內部空間。軸承配合於軸套。軸承具有第一端面、第二端面、內周面和外周面。風扇限定有第一至第四油路、第一軸向動壓油路、第二軸向動壓油路和徑向動壓油路。第一至第四油路依次連通形成液體回路，第一軸向動壓油路、第二軸向動壓油路和徑向動壓油路產生軸向動壓和徑向動壓，使葉輪保持懸浮。上述風扇之葉輪完全懸浮，減小了風扇之摩擦，改善了聲音品質，提升了風扇壽命。本發明一併提供一種包含該風扇之電子設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan comprises a shell, an impeller and a bearing. The shell comprises a bottom plate and a shaft sleeve, which defines the internal space. The impeller comprises a hub, a shaft rod and a thrust plate. The Bearing located in the internal space. The bearing is fitted to the shaft sleeve. The bearing has a first end face, a second end face, an Inner peripheral surface and an peripheral surface. The fan defines the first to the fourth oil circuit, the first axial dynamic pressure oil circuit, the second axial dynamic pressure oil circuit and the radial dynamic pressure oil circuit. The first to the fourth oil circuit is connected successively to form a liquid circuit, and the first axial dynamic pressure oil circuit, the second axial dynamic pressure oil circuit and the radial dynamic pressure oil circuit generate axial dynamic pressure and radial dynamic pressure to keep the impeller suspended. The impeller of the fan is completely suspended, reducing the friction of the fan, improving the sound quality, and extending the life of the fan. An electronic device comprising the fan is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:底板</p>
        <p type="p">102:軸套</p>
        <p type="p">1021:內部空間</p>
        <p type="p">1022:限位凸台</p>
        <p type="p">11:葉輪</p>
        <p type="p">111:輪轂</p>
        <p type="p">1111:止推部</p>
        <p type="p">1112:第一凸環</p>
        <p type="p">112:軸桿</p>
        <p type="p">1121:第一端</p>
        <p type="p">1122:第二端</p>
        <p type="p">113:止推片</p>
        <p type="p">12:軸承</p>
        <p type="p">127:第一環槽</p>
        <p type="p">13:液體回路</p>
        <p type="p">131:第一油路</p>
        <p type="p">132:第二油路</p>
        <p type="p">133:第三油路</p>
        <p type="p">134:第四油路</p>
        <p type="p">14:密封層</p>
        <p type="p">15:儲油空間</p>
        <p type="p">16:外連通通道</p>
        <p type="p">17:連通間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="966" publication-number="202619535">
    <tif-files tif-type="multi-tif">
      <tif file="114103131.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括背側接觸插塞之半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT PLUG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/67</main-classification>
        <further-classification edition="202501120260123B">H10D62/60</further-classification>
        <further-classification edition="202501120260123B">H10D62/13</further-classification>
        <further-classification edition="200601120260123B">H01L23/528</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭承根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SEUNGGEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洞院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧昶佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOH, CHANGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴範璡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BEOMJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種半導體裝置，其包括：一第一源極/汲極區及一第二源極/汲極區，其在一第一通道結構上；一第三源極/汲極區及一第四源極/汲極區，其在一第二通道結構上；一第一背側接觸插塞，其使該第二源極/汲極區自該第二源極/汲極區之一下表面凹入一第一深度；以及一第二背側接觸插塞，其使該第四源極/汲極區自該第四源極/汲極區之一下表面凹入小於該第一深度之一第二深度，其中該第二源極/汲極區包含在與該第一背側接觸插塞之一界面上的一第一雜質區，該第一雜質區包含一第一雜質，並且該第四源極/汲極區包含在與該第二背側接觸插塞之一界面上的另一第一雜質區，該另一第一雜質區包含一第二雜質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: a first source/drain region and a second source/drain region on a first channel structure; a third source/drain region and a fourth source/drain region on a second channel structure; a first backside contact plug recessing the second source/drain region by a first depth from a lower surface of the second source/drain region; and a second backside contact plug recessing the fourth source/drain region by a second depth, smaller than the first depth, from a lower surface of the fourth source/drain region, wherein the second source/drain region comprises a first impurity region comprising a first impurity on an interface with the first backside contact plug, and the fourth source/drain region comprises another first impurity region comprising a second impurity on an interface with the second backside contact plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基體絕緣層</p>
        <p type="p">130:占位層</p>
        <p type="p">140:通道結構</p>
        <p type="p">141:第一通道層，通道層</p>
        <p type="p">142:第二通道層，通道層</p>
        <p type="p">143:第三通道層，通道層</p>
        <p type="p">150A:第一源極/汲極區</p>
        <p type="p">150B:第二源極/汲極區</p>
        <p type="p">150C:第三源極/汲極區</p>
        <p type="p">150D:第四源極/汲極區</p>
        <p type="p">152:第一磊晶層</p>
        <p type="p">154:第二磊晶層</p>
        <p type="p">160:閘極結構</p>
        <p type="p">162:閘極隔片</p>
        <p type="p">164:閘極隔片層</p>
        <p type="p">165:閘極電極</p>
        <p type="p">166:閘極罩蓋層</p>
        <p type="p">170:前部接觸插塞</p>
        <p type="p">172:第一金屬半導體化合物層</p>
        <p type="p">174:第一傳導層</p>
        <p type="p">176:上部接點</p>
        <p type="p">178:上部互連線</p>
        <p type="p">180A:第一背側接觸插塞</p>
        <p type="p">180B:第二背側接觸插塞</p>
        <p type="p">182:第二金屬半導體化合物層</p>
        <p type="p">184:第二傳導層</p>
        <p type="p">188:背側電力結構</p>
        <p type="p">192:第一層間絕緣層</p>
        <p type="p">194:第二層間絕緣層</p>
        <p type="p">196:第三層間絕緣層</p>
        <p type="p">A,B:部分</p>
        <p type="p">D1:第一深度</p>
        <p type="p">D2:第二深度</p>
        <p type="p">I-I',II-II':線</p>
        <p type="p">R1:第一區</p>
        <p type="p">R2:第二區</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="967" publication-number="202618888">
    <tif-files tif-type="multi-tif">
      <tif file="114103614.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103614</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的製造方法</chinese-title>
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01L21/033</main-classification>
        <further-classification edition="202501120250303B">H01L21/28</further-classification>
        <further-classification edition="202501120250303B">H10D1/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊英政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仲麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構的製造方法包括以下步驟。接收基板，其中埋入式電容器的頂部電極從基板暴露出。形成氧化層於基板上。形成圖案化犧牲層於氧化層上並暴露氧化層的一部分。形成金屬層覆蓋氧化層的所述部分。形成圖案化介電層於金屬層上。形成間隔物於圖案化介電層的側壁上。使用間隔物和圖案化介電層作為遮罩，圖案化金屬層，以形成間隙。使用填料填充間隙。移除圖案化犧牲層，以暴露埋入式電容器的頂部電極。形成閘極結構於埋入式電容器的頂部電極上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor structure includes the following steps. A substrate is received with a top electrode of an embedded capacitor exposed from the substrate. An oxide layer is formed on the substrate. A patterned sacrificial layer is formed on the oxide layer and a portion of the oxide layer is exposed. A metal layer is formed to cover the portion of the oxide layer. A patterned dielectric layer is formed on the metal layer. A spacer is formed on a sidewall of the patterned dielectric layer. The metal layer is patterned by using the spacer and the patterned dielectric layer as a mask to form a gap. The gap is filled with a filler. The patterned sacrificial layer is removed to expose the top electrode of the embedded capacitor. A gate structure is formed on the top electrode of the embedded capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">180:閘極結構</p>
        <p type="p">182:閘極介電層</p>
        <p type="p">184:閘電極</p>
        <p type="p">200:著陸墊</p>
        <p type="p">212:圖案化第一導電材料</p>
        <p type="p">222:圖案化第二導電材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="968" publication-number="202618315">
    <tif-files tif-type="multi-tif">
      <tif file="114103792.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高頻元件測試裝置及其測試方法</chinese-title>
        <english-title>HIGH-FREQUENCY COMPONENT TEST DEVICE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G01R31/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李思翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SIH-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅芃翌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI, PENG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高頻元件測試裝置，包括測試鍵以及一測試模組。測試鍵包括對稱排列的一第一前級鍵及一第一後級鍵，其具有一致的電氣長度及特性阻抗。測試模組用以量測該第一前級鍵與該第一後級鍵直通連接的S參數及加入一待測物於該第一前級鍵與該第一後級鍵之間的一受測結構的S參數，該測試模組以頻域計算並將S參數轉換成ABCD參數矩陣，再以矩陣開根運算及反矩陣運算得到一去嵌入的待測物的ABCD參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high-frequency component test device includes a test key and a test module. The test key include a first front-level key and a first back-level key arranged symmetrically, and the first front-level key and the first back-level key have the same electrical length and characteristic impedance. The test module is used to measure S parameter of the first front-level key and the first back-level key connected directly and S parameter of a tested structure where a device under test (DUT) is added between the first front-level key and the first back-level key. The test module calculates in the frequency domain and converts the S parameter into an ABCD parameter matrix, and then uses a matrix root-opening operation and an inverse matrix operation to obtain ABCD parameter of a de-embedded DUT.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:高頻元件測試裝置</p>
        <p type="p">105:測試鍵</p>
        <p type="p">110:第一前級鍵</p>
        <p type="p">120:第一後級鍵</p>
        <p type="p">112:第一傳輸線</p>
        <p type="p">122:第二傳輸線</p>
        <p type="p">130:測試模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="969" publication-number="202619478">
    <tif-files tif-type="multi-tif">
      <tif file="114104044.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250411B">H10B12/00</main-classification>
        <further-classification edition="200601120250411B">H01L21/027</further-classification>
        <further-classification edition="200601120250411B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZIH-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構的製造方法包括以下步驟。接收基板，其中基板具有功能區域和圍繞功能區域的虛擬區域。於同一製程步驟中在功能區域上形成功能圖案並在虛擬區域上形成虛擬圖案，其中功能圖案與虛擬圖案之間的最近距離為15奈米至50奈米。移除虛擬圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a semiconductor structure includes the following steps. A substrate is received, in which the substrate has a functional area and a dummy area surrounding the functional area. A functional pattern is formed on the functional area and a dummy pattern is formed on the dummy area in a same process step. A closet distance between the dummy pattern and the functional pattern is from 15 nm to about 50 nm. The dummy pattern is removed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CD:最近距離</p>
        <p type="p">DA:虛擬區域</p>
        <p type="p">DP:虛擬圖案</p>
        <p type="p">FA:功能區域</p>
        <p type="p">FP:功能圖案</p>
        <p type="p">R:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="970" publication-number="202619075">
    <tif-files tif-type="multi-tif">
      <tif file="114104059.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製作方法與封裝結構</chinese-title>
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L23/31</main-classification>
        <further-classification edition="200601120260126B">H01L21/56</further-classification>
        <further-classification edition="200601120260126B">H01L23/00</further-classification>
        <further-classification edition="200601120260126B">H01L23/373</further-classification>
        <further-classification edition="202301120260126B">H01L25/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TE-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖文祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林廷翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括第一半導體元件、第二半導體元件、封裝層以及電路層。第二半導體元件鄰近第一半導體元件。封裝層具有第一側，且封裝層圍繞第一半導體元件與第二半導體元件。電路層設置於封裝層的第一側。封裝層具有第一厚度，第一半導體元件具有第二厚度。第一厚度大於第二厚度。第一厚度與第二厚度的差值大於第一厚度的一半且小於第二厚度的三倍。以俯視觀之，封裝層具有第一面積，第一半導體元件具有第二面積，第二半導體元件具有第三面積，且第二面積與第三面積的總和大於第一面積的一半。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a first semiconductor element, a second semiconductor element, an encapsulation layer, and a circuit layer. The second semiconductor element is adjacent to the first semiconductor element. The encapsulation layer has a first side and surrounds the first semiconductor element and the second semiconductor element. The circuit layer is disposed on the first side of the encapsulation layer. The encapsulation layer has a first thickness, and the first semiconductor element has a second thickness. The first thickness is greater than the second thickness. The difference between the first thickness and the second thickness is greater than half of the first thickness and less than three times the second thickness. In a top view, the encapsulation layer has a first area, the first semiconductor element has a second area, and the second semiconductor element has a third area, wherein the sum of the second area and the third area is greater than half of the first area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:承載基板</p>
        <p type="p">20:黏合層</p>
        <p type="p">100:封裝結構</p>
        <p type="p">110:第一半導體組件</p>
        <p type="p">111:背面</p>
        <p type="p">113:主動面</p>
        <p type="p">120:第二半導體元件</p>
        <p type="p">121:背面</p>
        <p type="p">122:半導體單元</p>
        <p type="p">123:主動面</p>
        <p type="p">124:導電墊</p>
        <p type="p">126:絕緣層</p>
        <p type="p">130:封裝層</p>
        <p type="p">131:第一側</p>
        <p type="p">133:第二側</p>
        <p type="p">S1:側面</p>
        <p type="p">S2:側表面</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">T3:第三厚度</p>
        <p type="p">T4:第四厚度</p>
        <p type="p">T5:第五厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="971" publication-number="202618083">
    <tif-files tif-type="multi-tif">
      <tif file="114104289.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纖維強化熱塑性塑膠用複合機紡紗</chinese-title>
        <english-title>CONJUGATED SPUN YARN FOR FIBER-REINFORCED THERMOPLASTIC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250731B">D02G1/16</main-classification>
        <further-classification edition="200601120250731B">D02G3/04</further-classification>
        <further-classification edition="200601120250731B">D02G3/16</further-classification>
        <further-classification edition="200601120250731B">D02G3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡纖維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO TEXTILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神谷岳兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYA, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田聖子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, SEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豐田健吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYODA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種纖維強化熱塑性塑膠用複合機紡紗，其係於FRP製造時，可得到充分抑制連續強化纖維的配向之紊亂的成形體，甚至，當製造成形體時，經熔融的熱塑性樹脂較容易滲透至構成芯部的連續強化纖維的單纖維彼此之間，成形性良好，所得之成形體的強度高。一種纖維強化熱塑性塑膠用複合機紡紗，其特徵為在由至少包含連續強化纖維(a1)的芯部(A)與包含熱塑性短纖維的鞘部(B)所形成的實質上無撚的纖維束上，捲附有包含熱塑性短纖維的機紡紗(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to provide a conjugated spun yarn for fiber-reinforced thermoplastic wherein, when FRP is produced, it is possible to obtain a molded article comprising continuous reinforced fibers with sufficiently suppressed disturbance of orientation, and wherein, when a molded article is produced thereform, melted thermoplastic resin easily penetrates into a gap between respective fibers of continuous reinforced fibers constituting a core part, moldability is good, and strength of the obtained molded article is high. According to the present invention, there is provided a conjugated spun yarn for fiber-reinforced thermoplastic wherein spun yarns (C) constituted from thermoplastic staples are wound around a bundle having substantially no twist, wherein the bundle is made of a core part (A) comprising at least continuous reinforced fibers (a1) and a sheath part (B) constituted from thermoplastic staples.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合機紡紗</p>
        <p type="p">2:連續強化纖維</p>
        <p type="p">3:熱塑性短纖維</p>
        <p type="p">4:芯鞘纖維束</p>
        <p type="p">5:機紡紗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="972" publication-number="202619362">
    <tif-files tif-type="multi-tif">
      <tif file="114104402.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳機充電盒和耳機套件</chinese-title>
        <english-title>EARPHONE CHARGING BOX AND EARPHONE KIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04R1/02</main-classification>
        <further-classification edition="200601120250303B">H04R1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張郭懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種耳機充電盒和耳機套件，該耳機充電盒包括下殼、上蓋、轉動件以及滑動件。下殼上設有耳機槽以容納耳機，上蓋的底部設有滑槽，轉動件轉動設置在下殼上，滑動件固定設置在轉動件的頂部並且部分位於滑槽內以使上蓋通過滑動件和轉動件與下殼連接。當上蓋由關閉位置移動至打開位置時，滑動件由滑槽的第一端移動至第二端，同時轉動件由第一位置轉動至第二位置以使上蓋偏轉；當上蓋由打開位置移動至關閉位置時，滑動件由滑槽的第二端移動至第一端，同時轉動件由第二位置轉動至第一位置以使上蓋偏轉。由此，上蓋可以採用轉動與滑動組合的方式打開或關閉，從而可以方便地取放耳機，同時有助於合理分配耳機充電盒的內部空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an earphone charging box and an earphone kit. The earphone charging box includes a lower shell, an upper cover, a rotating member and a sliding member. An earphone slot is provided on the lower shell to accommodate the earphone. A slide groove is provided at the bottom of the upper cover. The rotating member is rotatably arranged on the lower shell. The sliding member is fixedly arranged on the top of the rotating member, and is partially located in the slide groove so that the upper cover is connected to the lower shell through the sliding member and the rotating member. When the upper cover moves from the closed position to the open position, the sliding member moves from the first end of the slide groove to the second end, and the rotating member rotates from the first position to the second position to deflect the upper cover; when the upper cover moves from the open position to the closed position, the sliding member moves from the second end of the slide groove to the first end, and the rotating member rotates from the second position to the first position to deflect the upper cover. As a result, the upper cover can be opened or closed by a combination of rotation and sliding, so that the earphone can be easily taken and placed, and it helps to reasonably allocate the internal space of the earphone charging box.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:下殼</p>
        <p type="p">2:上蓋</p>
        <p type="p">B:耳機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="973" publication-number="202618441">
    <tif-files tif-type="multi-tif">
      <tif file="114104482.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104482</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於成像場壓縮驅動光子效率及成像波前改進之場鏡</chinese-title>
        <english-title>FIELD MIRRORS FOR IMAGING FIELD COMPRESSION DRIVEN PHOTON EFFICIENCY AND IMAGING WAVEFRONT IMPROVEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260202B">G03F1/84</main-classification>
        <further-classification edition="200601120260202B">G01N21/33</further-classification>
        <further-classification edition="200601120260202B">G01N21/88</further-classification>
        <further-classification edition="200601120260202B">G01N21/95</further-classification>
        <further-classification edition="200601120260202B">G01N21/956</further-classification>
        <further-classification edition="201201120260202B">G03F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森瑟　亞隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSENTHAL, ALON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可使用掠入射鏡將經收集光分裂成場以避免照明用於讀出電子器件之主動區域之間之間隙。該等掠入射鏡可藉由在積分方向上分裂成像場以容許該等讀出電子器件在該場外部而減少該方向上之經損失場空間。可分裂該等場，因此存在用於讀出電路之空間但在該等讀出電路上無相關聯光。接著可減小照明之大小及/或增加感測器之數目及/或大小以改進光子收集效率。更佳光子收集效率可減少散粒雜訊及/或改進工具產能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Collected light may be split into fields using grazing incidence mirrors to avoid illuminating gaps between the active areas for readout electronics. The grazing incidence mirrors may reduce lost field space in the integrating direction by splitting the imaging field in that direction to allow the readout electronics to be outside of the field. The fields may be split so there is space for readout circuits but no associated light on the readout circuits. The size of the illumination may then be decreased and/or the number and/or size of sensors increased to improve the photon collection efficiency. The better photon collection efficiency may reduce shot noise and/or improves tool throughput.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢測系統</p>
        <p type="p">101:照明</p>
        <p type="p">102:源子系統</p>
        <p type="p">103:樣本</p>
        <p type="p">104:照明光學器件</p>
        <p type="p">105:照明路徑</p>
        <p type="p">106:成像光學器件</p>
        <p type="p">107:成像路徑</p>
        <p type="p">108:掠入射鏡</p>
        <p type="p">109:經收集光</p>
        <p type="p">110:偵測器</p>
        <p type="p">111a:反射場</p>
        <p type="p">111b:未反射場</p>
        <p type="p">112:載物台</p>
        <p type="p">113:影像</p>
        <p type="p">114:控制器</p>
        <p type="p">116:時間延遲積分感測器</p>
        <p type="p">118:主動區域</p>
        <p type="p">120:讀出電路</p>
        <p type="p">122:電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="974" publication-number="202618852">
    <tif-files tif-type="multi-tif">
      <tif file="114104629.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104629</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以於離子植入減緩振動的設備與方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR MITIGATING VIBRATION IN ION IMPLANTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">H01J37/317</main-classification>
        <further-classification edition="200601120250423B">H01J37/20</further-classification>
        <further-classification edition="200601120250423B">H01L21/265</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯隆吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, LUNG-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所提供的是一種設備。該設備包括一碟片，其組配來在一離子植入程序期間旋轉；該設備包括耦接至該碟片且組配來支撐一或多個半導體晶圓的一晶圓支撐總成。該碟片之旋轉致使該一或多個半導體晶圓沿著一路徑迴旋。該設備包括一離子植入器，其組配來沿著該路徑將一離子束發射至一波束位置。該設備包括一振動校準裝置，其包括耦接至該碟片的一校準基座及耦接至該校準基座的一第一校準單元。該振動校準裝置係組配來將該第一校準單元自一第一位置移動至一第二位置，以減少與該設備相關聯的一振動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus is provided. The apparatus includes a disk configured to rotate during an ion implantation process. The apparatus includes a wafer support assembly coupled to the disk and configured to support one or more semiconductor wafers. The rotation of the disk causes the one or more semiconductor wafers to revolve along a path. The apparatus includes an ion implanter configured to emit an ion beam to a beam position along the path. The apparatus includes a vibration calibration device including a calibration base coupled to the disk and a first calibration unit coupled to the calibration base. The vibration calibration device is configured to move the first calibration unit from a first position to a second position to reduce a vibration associated with the apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">102:臂部</p>
        <p type="p">103:碟片</p>
        <p type="p">104:振動量測裝置</p>
        <p type="p">104a:第一振動量測裝置</p>
        <p type="p">104b:第二振動量測裝置</p>
        <p type="p">105:校準基座</p>
        <p type="p">106:校準單元</p>
        <p type="p">106a:第一校準單元</p>
        <p type="p">106b:第二校準單元</p>
        <p type="p">108,108a,108b,108c,108d,108e,108f,108g,108h,108i,108j,108k,108l:半導體晶圓</p>
        <p type="p">110:晶圓支撐總成</p>
        <p type="p">112:離子植入器</p>
        <p type="p">114:離子束</p>
        <p type="p">116:波束位置</p>
        <p type="p">121:第一旋轉軸線</p>
        <p type="p">123:旋轉方向</p>
        <p type="p">140:路徑</p>
        <p type="p">150:振動校準裝置</p>
        <p type="p">180a,180b:部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="975" publication-number="202617283">
    <tif-files tif-type="multi-tif">
      <tif file="114104903.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清洗裝置及相關方法</chinese-title>
        <english-title>CLEANING APPARATUS AND RELATED METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">B08B3/04</main-classification>
        <further-classification edition="200601120250217B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹宜彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, I-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHING LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種設備。該設備包括一晶圓支撐總成，其組配來將一半導體晶圓支撐在一清洗位置。該設備包括一晶圓清洗總成，其組配來在該半導體晶圓位於該清洗位置時對該半導體晶圓施加包括氫之一流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus is provided. The apparatus includes a wafer support assembly configured to support a semiconductor wafer in a cleaning position. The apparatus includes a wafer cleaning assembly configured to apply a fluid including hydrogen to the semiconductor wafer while the semiconductor wafer is in the cleaning position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清洗設備</p>
        <p type="p">102:半導體晶圓</p>
        <p type="p">104:第一刷具</p>
        <p type="p">106:第一輥</p>
        <p type="p">108:第二刷具</p>
        <p type="p">110:第二輥</p>
        <p type="p">116,118,121,124,126:旋轉方向</p>
        <p type="p">120:晶圓清洗總成</p>
        <p type="p">132:第一旋轉軸線</p>
        <p type="p">133:第二旋轉軸線</p>
        <p type="p">152,154:管道</p>
        <p type="p">153:第一輥入口</p>
        <p type="p">155:第二輥入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="976" publication-number="202618790">
    <tif-files tif-type="multi-tif">
      <tif file="114104952.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104952</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及其操作方法</chinese-title>
        <english-title>MEMORY DEVICE AND OPERATION METHOD THEROF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G11C16/26</main-classification>
        <further-classification edition="200601120250901B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峨源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, E-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宜山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YIH-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置及其操作方法被提出。記憶體裝置例如為三維反及式快閃記憶體，且提供高性能以及高容量的儲存媒介。記憶體裝置包括多個頁緩衝器以及多個第一開關。頁緩衝器相互串聯耦接。第一開關分別對應頁緩衝器，其中各第一開關耦接至對應的頁緩衝器的感測端。各第一開關接收參考電壓，在資料感測期間後，提供源電流至對應的頁緩衝器的感測端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and an operation method are provided. The memory device may be a 3D NAND flash memory circuit, and provides a high-capacity storage medium with favorable performance. The memory device includes a plurality of page buffers and a plurality of first switches. The page buffers are coupled in series. The first switches respectively correspond to the page buffers, wherein each of the first switches is coupled to a sensing end of corresponding page buffer. Each of the first switches receives a reference voltage and provides a source current to the sensing end of corresponding page buffer after a data sensing period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:記憶體裝置</p>
        <p type="p">210:位元線偏壓及感測電路</p>
        <p type="p">220、221、SW10:開關</p>
        <p type="p">230:閂鎖電路群組</p>
        <p type="p">BL0、BL1:位元線</p>
        <p type="p">IS1、IS2:源電流</p>
        <p type="p">PB0、PB1:頁緩衝器</p>
        <p type="p">SEN0、SEN1:感測端</p>
        <p type="p">VDDI:電源電壓</p>
        <p type="p">VPW:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="977" publication-number="202617572">
    <tif-files tif-type="multi-tif">
      <tif file="114105243.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105243</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>捲繞軸中心的細絲捲繞裝置</chinese-title>
        <english-title>FILAMENT WINDING DEVICE IN CENTER OF WINDING SHAFT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">B65H54/02</main-classification>
        <further-classification edition="200601120250325B">B65H59/06</further-classification>
        <further-classification edition="200601120250325B">B29C70/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商盛日股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNGIL CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請關於一種在從第二單元向第一單元供應細絲且藉由第三單元的分線器供應的結構的基礎上，尤其關於一種不僅可以藉由擴展纏繞範圍而提升細絲纏繞的強度，還可以防止細絲下垂並在維持一定程度的張力的同時流暢地供應細絲的捲繞軸中心的細絲捲繞裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a filament winding device which is based on a structure in which filaments are supplied from a second unit to a first unit through a wire divider of a third unit, and in particular to a filament winding device in the center of the winding shaft which can not only enhance the strength of filament winding by expanding the winding range but also prevent filament sagging and smoothly supply filaments while maintaining a certain degree of tension.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一單元</p>
        <p type="p">101:第一支撐柱</p>
        <p type="p">102:第二支撐柱</p>
        <p type="p">110:第一旋轉軸</p>
        <p type="p">120:第二旋轉軸</p>
        <p type="p">130:第一繞線導向夾具</p>
        <p type="p">140:第二繞線導向夾具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="978" publication-number="202618775">
    <tif-files tif-type="multi-tif">
      <tif file="114105324.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體電路、電壓提供電路及其操作方法</chinese-title>
        <english-title>MEMORY CIRCUITS, VOLTAGE PROVISION CIRCUITS AND METHODS FOR OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G11C11/4074</main-classification>
        <further-classification edition="200601120251001B">G11C7/14</further-classification>
        <further-classification edition="200601120251001B">G11C5/14</further-classification>
        <further-classification edition="200601120251001B">G11C17/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊憶欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, I-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張盟昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示文件提供一種記憶體電路，包含記憶體陣列及電壓提供電路。記憶體陣列包含多個記憶體單元。電壓提供電路用以為多個記憶體單元中的一或多者提供操作電壓，該操作電壓自第一電壓域移位至第二電壓域。電壓提供電路包含電壓偵測器，且電壓偵測器用以接收處於第一電壓域中的第一供應電壓，由處於第二電壓域中的第二供應電壓供電，且提供第一控制訊號。第一控制訊號用以判定操作電壓等於處於第一邏輯狀態的第二供應電壓或是等於處於第二邏輯狀態的第二供應電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit includes a memory array comprising a plurality of memory cells; and a voltage provision circuit configured to provide an operation voltage for one or more of the plurality of memory cells, the operation voltage being shifted from a first voltage domain to a second voltage domain. The voltage provision circuit comprises a voltage detector. The voltage detector is configured to receive a first supply voltage in the first voltage domain, powered by a second supply voltage in the second voltage domain, and provide a first control signal. The first control signal is configured to determine whether the operation voltage is equal to the second supply voltage at a first logic state or the second supply voltage at a second logic state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體電路</p>
        <p type="p">102:記憶體陣列</p>
        <p type="p">103:記憶體單元/電熔絲單元</p>
        <p type="p">104:列解碼器</p>
        <p type="p">106:行解碼器</p>
        <p type="p">108:輸入/輸出(I/O)電路</p>
        <p type="p">110:邏輯控制電路</p>
        <p type="p">C&lt;sub&gt;1&lt;/sub&gt;~C&lt;sub&gt;N&lt;/sub&gt;:行</p>
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;~R&lt;sub&gt;M&lt;/sub&gt;:列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="979" publication-number="202619116">
    <tif-files tif-type="multi-tif">
      <tif file="114105813.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105813</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝影機系統、半導體裝置及其製造方法</chinese-title>
        <english-title>CAMERA SYSTEMS, SEMICONDUCTOR DEVICES AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">H01L23/535</main-classification>
        <further-classification edition="200601120250902B">H01L23/525</further-classification>
        <further-classification edition="200601120250902B">H01L23/498</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余科京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KE-JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置可包括基板，此基板包含複數個第一接觸墊設置在第一表面上，及複數個第二接觸墊設置在第二表面上。基板包含複數個互連結構在第一表面與第二表面之間延伸。一種裝置可包括互連結構的軸向延伸的第一部分，具有第一輪廓的側壁。一種裝置可包括互連結構的軸向延伸的第二部分，具有第二輪廓的側壁，且第二輪廓比第一輪廓淺。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device may include a substrate comprising a plurality of first contact pads disposed on a first surface, and a plurality of second contact pads disposed on a second surface, the substrate comprising a plurality of interconnect structures extending between the first surface and the second surface. A device may include a first portion of an axial extension of the plurality of interconnect structures having sidewalls of a first profile. A device may include a second portion of the axial extension of the plurality of interconnect structures having sidewalls of a second profile, shallower than the first profile.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102:第一基板</p>
        <p type="p">104:第二基板</p>
        <p type="p">106:第三基板</p>
        <p type="p">108、110、112、114:表面</p>
        <p type="p">116:影像感測器</p>
        <p type="p">118:影像訊號處理器</p>
        <p type="p">120:互連結構</p>
        <p type="p">122、124:接觸墊</p>
        <p type="p">126:通孔結構</p>
        <p type="p">128:閘極結構</p>
        <p type="p">130:源極/汲極</p>
        <p type="p">132:阱區</p>
        <p type="p">140:跡線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="980" publication-number="202618745">
    <tif-files tif-type="multi-tif">
      <tif file="114105904.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>像素電路與像素電路的驅動方法</chinese-title>
        <english-title>PIXEL CIRCUIT AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250226B">G09G3/32</main-classification>
        <further-classification edition="200601120250226B">G09G5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董哲維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玫憶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭豫杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱郁勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恩池</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, EN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊銘宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>支柏瑀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIH, BO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張舒晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種像素電路與其驅動電路。此像素電路包括以下元件。驅動電路包含第一電晶體，在驅動訊號的致能期間第一電晶體根據一節點的電壓產生驅動電流，發光二極體的亮度隨著此驅動電流而改變。第一控制電路用以在第一期間重置電容器的電壓並將多個參考電壓分別施加於第一電晶體的兩端。第二控制電路耦接至電容器，用以在第二期間將灰階電壓寫入至電容器。上述的第一期間與第二期間之間的間隔大於第一期間的時間長度或是第二期間的時間長度的兩倍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a pixel circuit and its driving circuit. The pixel circuit includes the following components. The driving circuit contains a first transistor, which generates a driving current based on the voltage at a node during the enable period of a driving signal, and the brightness of a light-emitting diode (LED) varies with this driving current. A first control circuit is configured to reset the voltage of a capacitor during a first period and apply multiple reference voltages to two ends of the first transistor. A second control circuit is coupled to the capacitor and is configured to write a gray-level voltage into the capacitor during a second period. The interval between the first period and the second period is greater than twice the duration of either the first period or the second period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VC:控制訊號</p>
        <p type="p">RS:重置訊號</p>
        <p type="p">CS:補償訊號</p>
        <p type="p">WS:寫入訊號</p>
        <p type="p">201:第一期間</p>
        <p type="p">202:第二期間</p>
        <p type="p">210,220,230,240:致能期間</p>
        <p type="p">250:間隔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="981" publication-number="202619280">
    <tif-files tif-type="multi-tif">
      <tif file="114105950.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>功率放大器的保護電路和射頻功放模組</chinese-title>
        <english-title>PROTECTION CIRCUIT OF POWER AMPLIFIER AND RADIO FREQUENCY POWER AMPLIFIER MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F3/20</main-classification>
        <further-classification edition="200601120250303B">H03F1/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZHOU LUXSHARE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉鳳林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FENGLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊效坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XIAOKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王克誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KECHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種功率放大器的保護電路和射頻功放模組。該保護電路包括限流模組，限流模組檢測功率放大器的當前電流值，根據當前電流值與預設電流限值之間的差異，生成第一控制信號；第一控制信號調節電源向功率放大器的供電電流使能控制模組與限流模組連接，使能控制模組根據第一控制信號生成使能控制信號；電源變換模組，與使能控制模組連接，電源變換模組根據使能控制信號，調節輸出的電壓信號；第一放大電路，與電源變換模組連接，第一放大電路由電壓信號供電，並生成驅動信號，驅動信號調節功率放大器的輸出功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a protection circuit for a power amplifier and a radio frequency (RF) power amplification module. The protection circuit comprises a current-limiting module, which detects the current value of the power amplifier and generates a first control signal based on the difference between the current value and a preset current limit. The first control signal adjusts the supply current from the power source to the power amplifier. An enable control module is connected to the current-limiting module and generates an enable control signal based on the first control signal. A power conversion module, connected to the enable control module, adjusts the output voltage signal according to the enable control signal. A first amplification circuit, connected to the power conversion module, is powered by the voltage signal and generates a drive signal, which regulates the output power of the power amplifier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:保護電路</p>
        <p type="p">20:電源</p>
        <p type="p">30:功率放大器</p>
        <p type="p">101:限流模組</p>
        <p type="p">102:使能控制模組</p>
        <p type="p">103:電源變換模組</p>
        <p type="p">104:第一放大電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="982" publication-number="202618176">
    <tif-files tif-type="multi-tif">
      <tif file="114106084.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍋爐的控制裝置、鍋爐系統及鍋爐的控制方法</chinese-title>
        <english-title>BOILER CONTROL DEVICE, BOILER SYSTEM, AND BOILER CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">F22G5/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＩＨＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IHI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井麻有</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">鍋爐的控制器係具有：供給指令部，係將控制燃料供給部的動作之第一供給指令及第二供給指令予以輸出；及噴灑指令部，係將控制再熱器噴灑器的動作之第一噴灑指令及第二噴灑指令予以輸出。供給指令部及噴灑指令部係執行：將第一供給指令及第一噴灑指令予以輸出的第一動作，該第一供給指令係使微粉煤供給至爐膛並且不使氨供給至爐膛，該第一噴灑指令係使水不從再熱器噴灑器進行噴灑；及將第二供給指令及第二噴灑指令予以輸出的第二動作，該第二供給指令係使微粉煤供給至爐膛並且也使氨供給至爐膛，該第二噴灑指令係使水從再熱器噴灑器進行噴灑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A controller of boiler has a supply command unit that outputs a first supply command and a second supply command for controlling the motion of a fuel supply unit, and a spray command unit that outputs a first spray command and a second spray command for controlling the motion of a reheater sprayer. The supply command unit and the spray command unit execute a first motion for outputting the first supply command that renders pulverized coal to be supplied to a furnace and does not render ammonia to be supplied to the furnace, and the first spray command that does not render water to be spread from the reheater sprayer; and a second motion for outputting the second supply command that render pulverized coal to be supplied to the furnace and also renders ammonia to be supplied to the furnace, and the second spray command that renders water to be spread from the reheater spray.</p>
      </isu-abst>
      <representative-img>
        <p type="p">9:控制器</p>
        <p type="p">31:燃料供給部</p>
        <p type="p">61:再熱器氣體節風門</p>
        <p type="p">91:處理器</p>
        <p type="p">92:記憶體</p>
        <p type="p">93:輸入埠</p>
        <p type="p">94:輸出埠</p>
        <p type="p">203:輸入裝置</p>
        <p type="p">311:微粉煤供給部</p>
        <p type="p">312:氨供給部</p>
        <p type="p">511:再熱器噴灑器</p>
        <p type="p">521:溫度感測器</p>
        <p type="p">911:供給指令部</p>
        <p type="p">912:氣體節風門指令部</p>
        <p type="p">913:噴灑指令部</p>
        <p type="p">C61:控制信號</p>
        <p type="p">C311,C312:供給信號</p>
        <p type="p">C511:噴灑器信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="983" publication-number="202617787">
    <tif-files tif-type="multi-tif">
      <tif file="114106301.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>凝膠表面聚合</chinese-title>
        <english-title>GEL SURFACE POLYMERIZATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C08F2/38</main-classification>
        <further-classification edition="200601120260130B">C08F4/00</further-classification>
        <further-classification edition="200601120260130B">C08F4/10</further-classification>
        <further-classification edition="200601120260130B">C08F292/00</further-classification>
        <further-classification edition="200601120260130B">C08L5/00</further-classification>
        <further-classification edition="200601120260130B">C08L5/04</further-classification>
        <further-classification edition="200601120260130B">C08J5/18</further-classification>
        <further-classification edition="200601120260130B">C08J7/16</further-classification>
        <further-classification edition="200601120260130B">B05D1/00</further-classification>
        <further-classification edition="200601120260130B">B05D1/02</further-classification>
        <further-classification edition="200601120260130B">B05D1/36</further-classification>
        <further-classification edition="200601120260130B">G03F7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商易爾德工程系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼古拉森　雅各　帕格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKOLAJSEN, JAKOB PAGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格加德　阿斯格　霍爾姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGERGAARD, ASGER HOLM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨德瓦特　瑪麗安　卡埃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNDEWADT, MARIANNE KAAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於在基板上形成表面聚合物。特定言之，在基板上形成表面聚合物可藉由將形成凝膠之反應組成物施加於該基板上來實現，其中所形成之凝膠包含用於傳播表面聚合物之組分，其中由於該反應組成物中存在之特定組分而在該基板上形成該凝膠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the formation of surface polymers on substrates. Specifically, the formation of surface polymers on a substrate may be accomplished by applying a reaction composition forming a gel on the substrate, wherein the formed gel comprises components for propagating surface polymers, wherein the gel forms on the substrate due to specific components present in the reaction composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:在基板上形成用於自基板上之接枝位形成表面聚合物的凝膠的設備</p>
        <p type="p">101:用於將第一及第二單獨液體自個別噴嘴噴灑沉積至基板上之系統</p>
        <p type="p">103:用於自基板沖洗掉凝膠之系統</p>
        <p type="p">110:包括膠凝物質之第一單獨液體的儲料槽</p>
        <p type="p">111:第一單獨液體噴塗系統管道</p>
        <p type="p">112:第一單獨液體噴嘴</p>
        <p type="p">113:第一單獨液體噴灑霧狀物</p>
        <p type="p">114:第一單獨液體混合裝置</p>
        <p type="p">115:第一單獨液體管線過濾器</p>
        <p type="p">120:包括交聯劑之第二單獨液體的儲料槽</p>
        <p type="p">121:第二單獨液體噴塗系統管道</p>
        <p type="p">122:第二單獨液體噴嘴</p>
        <p type="p">123:第二單獨液體噴灑霧狀物</p>
        <p type="p">124:第二單獨液體混合裝置</p>
        <p type="p">125:第二單獨液體管線過濾器</p>
        <p type="p">130:沖洗溶液之儲料槽</p>
        <p type="p">131:沖洗系統管道</p>
        <p type="p">132:沖洗系統噴嘴</p>
        <p type="p">133:沖洗溶液噴霧</p>
        <p type="p">140:聚合起始劑改質之基板</p>
        <p type="p">141:凝膠</p>
        <p type="p">142:表面聚合物</p>
        <p type="p">150:基板之輸送裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="984" publication-number="202619536">
    <tif-files tif-type="multi-tif">
      <tif file="114106367.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/67</main-classification>
        <further-classification edition="202501120260123B">H10D30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅相喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, SANGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭珉燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GWAK, MINCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車承珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHA, SEUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敬雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYOUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置可包括基板絕緣層、延伸在下部絕緣圖案上的半導體圖案、堆疊在半導體圖案上的多個通道層、環繞多個通道層的閘極結構、在半導體圖案上且與閘極結構相對側面的源極/汲極區域、包括連接至源極/汲極區域的接觸區域的背側接觸結構、以及與半導體圖案接觸的中間絕緣圖案。背側接觸結構可包括金屬-半導體化合物層、第一絕緣襯層、第二絕緣襯層、以及導電層。背側接觸結構可穿過基板絕緣層和半導體圖案。導電層可在背側接觸結構的第一垂直區域與第二垂直區域之間具有階梯部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device may include a substrate insulating layer, a semiconductor pattern extending on the lower insulating pattern, a plurality of channel layers stacked on the semiconductor pattern, a gate structure surrounding the plurality of channel layers, a source/drain region on the semiconductor pattern and opposite sides of the gate structure, a backside contact structure including a contact region connected to the source/drain region, and an intermediate insulating pattern in contact with the semiconductor pattern. The backside contact structure may include a metal-semiconductor compound layer, a first insulating liner layer, a second insulating liner layer, and a conductive layer. The backside contact structure may pass through each of the substrate insulating layer, and the semiconductor pattern. The conductive layer may have a step portion between a first vertical region and a second vertical region of the backside contact structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:半導體裝置</p>
        <p type="p">106:半導體圖案</p>
        <p type="p">130:通道層</p>
        <p type="p">141:閘極間隔層</p>
        <p type="p">142:閘極介電層</p>
        <p type="p">145:閘極電極</p>
        <p type="p">147:閘極覆蓋層</p>
        <p type="p">150:源極/汲極區域</p>
        <p type="p">151:第一磊晶層</p>
        <p type="p">152:第二磊晶層</p>
        <p type="p">160:中間絕緣圖案</p>
        <p type="p">170:內部間隔層</p>
        <p type="p">171:層間絕緣層</p>
        <p type="p">180:背側接觸結構</p>
        <p type="p">182:絕緣襯層</p>
        <p type="p">182a:第一絕緣襯層</p>
        <p type="p">182b:第二絕緣襯層</p>
        <p type="p">184:金屬-半導體化合物層</p>
        <p type="p">186:導電層</p>
        <p type="p">190:基板絕緣層</p>
        <p type="p">194:下部絕緣圖案</p>
        <p type="p">CR:接觸區域</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">I、I':線</p>
        <p type="p">IP:絕緣分離圖案</p>
        <p type="p">VR1:第一垂直區域</p>
        <p type="p">VR2:第二垂直區域</p>
        <p type="p">w1:第一寬度</p>
        <p type="p">w2:第二寬度</p>
        <p type="p">w3:第三寬度</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="985" publication-number="202619102">
    <tif-files tif-type="multi-tif">
      <tif file="114106401.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有連接件的IC封裝結構及其製造方法</chinese-title>
        <english-title>IC PACKAGE STRUCTURE WITH CONNECTIONS AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">H01L23/49</main-classification>
        <further-classification edition="200601120250328B">H01L23/495</further-classification>
        <further-classification edition="200601120250328B">H01L21/768</further-classification>
        <further-classification edition="201701120250328B">H01L21/77</further-classification>
        <further-classification edition="200601120250328B">H05K3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊玉林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種具有連接件的IC封裝結構，包括一晶粒接合至一導線架、多個連接件接合至該導線架、一模封件形成在該導線架上、一金屬層形成在該模封件上且電性連接至該些連接件、以及一電子元件安裝在該金屬層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An IC package structure with connections is provided in the present disclosure, including a die bonded to a leadframe, a plurality of connections bonded to the leadframe, a molding compound formed on the leadframe, a metal layer formed on the molding compound and electrically connecting with the connections, and an electronic component mounted on the metal layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:IC封裝結構</p>
        <p type="p">100:導線架</p>
        <p type="p">100a:晶粒墊</p>
        <p type="p">100b:內引線</p>
        <p type="p">102:晶粒</p>
        <p type="p">104:接線</p>
        <p type="p">106:模封件</p>
        <p type="p">108:連接件</p>
        <p type="p">110:金屬層</p>
        <p type="p">112:溝槽</p>
        <p type="p">114:元件</p>
        <p type="p">116:引線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="986" publication-number="202617314">
    <tif-files tif-type="multi-tif">
      <tif file="114106436.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106436</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工裝置以及對於加工裝置之光束傳送系統的設置方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">B23K26/10</main-classification>
        <further-classification edition="201401120251001B">B23K26/042</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鷗爾熙製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船山昌彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAYAMA, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水修一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, SHUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鷲山裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WASHIYAMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是在包括有除振裝置的加工裝置中，可適當地調整光束傳送系統的光傳遞路徑中之光軸。其解決手段為一種雷射加工裝置100，包括在光源10與被設於裝置本體20的照明光學單元30之間傳送雷射光束的光束傳送系統12。光束傳送系統12係，包括光軸調整用的第二調整鏡16。第二調整鏡16之沿著鉛直方向的位置係，為在支撐裝置本體20的支撐體80之除振裝置90的上端面90U或其附近。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光源裝置</p>
        <p type="p">12:光束傳送系統</p>
        <p type="p">12A:光源側光束傳送部</p>
        <p type="p">12B:本體側光束傳送部</p>
        <p type="p">12C:管</p>
        <p type="p">20:裝置本體</p>
        <p type="p">21:平台支撐部</p>
        <p type="p">21B:支撐面</p>
        <p type="p">21T:接觸面</p>
        <p type="p">25:基台</p>
        <p type="p">30:照明光學單元</p>
        <p type="p">40:掃描機構</p>
        <p type="p">50:投影光學系統</p>
        <p type="p">60:遮罩平台</p>
        <p type="p">70:加工平台</p>
        <p type="p">80:支撐體</p>
        <p type="p">90:除振裝置</p>
        <p type="p">100:雷射加工裝置</p>
        <p type="p">90U:上端面</p>
        <p type="p">G:地面</p>
        <p type="p">L:雷射光束</p>
        <p type="p">M:遮罩</p>
        <p type="p">N:支撐面</p>
        <p type="p">U:支點面</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="987" publication-number="202617346">
    <tif-files tif-type="multi-tif">
      <tif file="114106455.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>潤濕一拋光墊的配置及方法</chinese-title>
        <english-title>ARRANGEMENT AND METHOD FOR MOISTENING A POLISHING PAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260128B">B24B37/20</main-classification>
        <further-classification edition="201201120260128B">B24B37/34</further-classification>
        <further-classification edition="200601120260128B">B24B49/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商ＡＲＡＴＡ科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARATA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩爾托拉　塔圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PELTOLA, TATU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩爾托拉　阿托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PELTOLA, ARTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於潤濕拋光墊(125)的配置及方法。該配置包含：量測裝置(101)，用於確定該拋光墊(125)的表面上兩個點之間的電阻；以及分配裝置(102)，用於基於確定的電阻，在該拋光墊(125)的該表面上分配拋光懸浮液。本發明亦係關於一種用於拋光試樣(126)的系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an arrangement and a method for moistening a polishing pad (125). The arrangement comprises a measuring device (101) for determining an electrical resistance between two points on a surface of the polishing pad (125), and a dispensing device (102) for dispensing a polishing suspension, based on the determined electrical resistance, on the surface of the polishing pad (125). The invention also relates to a system for polishing a specimen (126).</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:量測裝置</p>
        <p type="p">102:分配裝置</p>
        <p type="p">103:電路</p>
        <p type="p">104:電氣接觸元件</p>
        <p type="p">105:電氣接觸元件</p>
        <p type="p">106:接觸表面</p>
        <p type="p">107:電容器</p>
        <p type="p">108:DC電壓源</p>
        <p type="p">109:量測單元</p>
        <p type="p">110:處理單元</p>
        <p type="p">111:有線連接</p>
        <p type="p">112:容器</p>
        <p type="p">113:噴嘴</p>
        <p type="p">114:軟管</p>
        <p type="p">115:閥</p>
        <p type="p">116:控制單元</p>
        <p type="p">117:有線連接</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="988" publication-number="202618708">
    <tif-files tif-type="multi-tif">
      <tif file="114106567.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>３６０度即時影像串流及環境分析系統及方法</chinese-title>
        <english-title>360-DEGREE REAL-TIME VIDEO STREAMING AND ENVIRONMENTAL ANALYSIS SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250529B">G06V20/52</main-classification>
        <further-classification edition="200601120250529B">G08B21/02</further-classification>
        <further-classification edition="201101120250529B">H04N21/234</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商賽爾迪克股份有限公司 韓國釜山廣域市江西區艾可德爾塔智慧路39號, 1棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERDIC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金會埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HOI-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁致瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, CHI SEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴贊洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, CHAN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金仁善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, IN SEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜辰奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JIN KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫鉉用</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, HYEON YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種360度即時影像串流及環境分析系統及方法。  該系統包括：360度攝影機，用以獲得工作現場的360度影像；環境感測器模組，用以即時量測環境資料，該環境資料包括工作環境的氣體濃度、溫度、濕度及壓力資料中的至少一者；嵌入式模組，用以處理由該360度攝影機獲得的該工作現場的該360度影像；及資料分析單元，用以分析由該嵌入式模組處理的該360度影像且分析該環境資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a 360-degree real-time video streaming and environmental analysis system and method. The system includes a 360-degree camera configured to obtain a 360-degree video of a work site, an environmental sensor module configured to measure environmental data including at least one of gas concentration, temperature, humidity, and pressure data of a work environment in real time, an embedded module configured to process the 360-degree video of the work site that is obtained by the 360-degree camera, and a data analysis unit configured to analyze the 360-degree video processed by the embedded module and the environmental data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:360度串流傳輸裝置</p>
        <p type="p">1100:360度攝影機</p>
        <p type="p">1200:環境感測器模組</p>
        <p type="p">1300:嵌入式模組</p>
        <p type="p">1400:資料分析單元</p>
        <p type="p">1410:人工智慧計算模組</p>
        <p type="p">1420:感測器分析模組</p>
        <p type="p">1500:加密模組</p>
        <p type="p">1600:觸控顯示器</p>
        <p type="p">1700:警報模組</p>
        <p type="p">2000:網路</p>
        <p type="p">2100:安全模組</p>
        <p type="p">2200:網頁伺服器</p>
        <p type="p">2300:客戶終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="989" publication-number="202619178">
    <tif-files tif-type="multi-tif">
      <tif file="114106573.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶接頭的撓性高功率射頻線</chinese-title>
        <english-title>FLEXIBLE HIGH-POWER RF LINE WITH JOINTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01R13/18</main-classification>
        <further-classification edition="200601120260128B">H01R13/20</further-classification>
        <further-classification edition="201101120260128B">H01R24/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商斯必能公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPINNER GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭汀傑　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDINGER, JOSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於高功率同軸射頻線的可傾斜射頻接頭，包含：第一外導體，其中心具有第一內導體；第二外導體，其中心具有第二內導體。第一內導體包含接頭插座，該接頭插座機械地耦合到第二內導體的接頭球並形成插座-球連接。第一內導體還包含具有球面弓形形狀的中心接觸表面，該中心接觸表面與第二內導體的中心接觸彈簧接觸。任一個外導體均具有外導體接觸彈簧，此外導體接觸彈簧與位於另一個外導體處的外導體接觸表面接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tiltable RF joint for high power coaxial RF lines comprises a first outer conduc-tor with a first inner conductor centered therein, a second outer conductor with a second inner conductor centered therein. The first inner conductor comprising a joint socket being mechanically coupled to a joint ball of the second inner con-ductor and forming a socket-ball connection. The first inner conductor further comprising a center contact surface having the shape of a spherical segment, the center contact surface being in contact with a center contact spring of the se-cond inner conductor. Any one of the outer conductors has an outer conductor con-tact spring which is in contact with an outer conductor contact surface at the other outer conductor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一接頭組件</p>
        <p type="p">101:可傾斜射頻接頭</p>
        <p type="p">104:線性運動方向</p>
        <p type="p">105:旋轉方向</p>
        <p type="p">106:與圖面正交的傾斜方向</p>
        <p type="p">107:圖面中的傾斜方向</p>
        <p type="p">108:球形接頭中心</p>
        <p type="p">109:第一接頭中心軸</p>
        <p type="p">110:第一外導體</p>
        <p type="p">120:第二外導體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="990" publication-number="202618224">
    <tif-files tif-type="multi-tif">
      <tif file="114106588.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼器裝置</chinese-title>
        <english-title>ENCODER APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01D5/347</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商多摩川精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAGAWA SEIKI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常盤大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKIWA, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俞佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">旋轉盤120的狹縫130包括排列成同心圓且配置在不同徑向位置，並具有不同個數的第一組狹縫130a和第二組狹縫130b，皆排列成圓環狀，第一組狹縫130a每周數量N1個，第二組狹縫130b每周數量N2 ，N1不等於N2。圓形的第二組狹縫130b，單一組編碼器偵測單元140具有接收來自第一組狹縫130a的透射光的第一光接收單元142a和接收來自第二組狹縫130b的透射光的第二光接收單元142b。編碼器處理單元150將第一光接收單元142a的受光信號轉換成第一電角度信號θe1後，計算出第一機械角度數據P1，並將第二光接收單元142b的受光信號轉換成第二角度信號θe2後，計算出第二機械角度數據P2，並根據光學排列資訊減去該第一機器角度數據P1所含的第一絕對值精度誤差Δ1，以計算得到旋轉角度θ。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旋轉體</p>
        <p type="p">100:編碼器裝置</p>
        <p type="p">110:旋轉軸</p>
        <p type="p">120:旋轉盤</p>
        <p type="p">130:狹縫</p>
        <p type="p">130a:第一組狹縫</p>
        <p type="p">130b:第二組狹縫</p>
        <p type="p">140:編碼器偵測單元</p>
        <p type="p">141:發光單元</p>
        <p type="p">142:光接收單元</p>
        <p type="p">142a:第一光接收單元</p>
        <p type="p">142b:第二光接收單元</p>
        <p type="p">150:編碼器處理單元</p>
        <p type="p">151:電角度數據轉換單元</p>
        <p type="p">151a:第一電角度數據轉換單元</p>
        <p type="p">151b:第二電角度數據轉換單元</p>
        <p type="p">152:機械角度數據計算單元</p>
        <p type="p">152a:第一機械角度數據計算單元</p>
        <p type="p">152b:第二機械角度數據計算單元</p>
        <p type="p">153:誤差計算單元</p>
        <p type="p">154:校正單元</p>
        <p type="p">155:輸出單元</p>
        <p type="p">θe1:第一電角度信號</p>
        <p type="p">θe2:第二電角度信號</p>
        <p type="p">P1:第一機械角度數據</p>
        <p type="p">P2:第二機械角度數據</p>
        <p type="p">△1:第一絕對值精度誤差</p>
        <p type="p">△2:第二絕對值精度誤差</p>
        <p type="p">θ:旋轉角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="991" publication-number="202618289">
    <tif-files tif-type="multi-tif">
      <tif file="114106714.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電源完整性及熱管理之具有傳導平面及組件之測試互連件</chinese-title>
        <english-title>TEST INTERCONNECT WITH CONDUCTIVE PLANES AND COMPONENTS FOR POWER INTEGRITY AND THERMAL MANAGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G01R1/04</main-classification>
        <further-classification edition="200601120260126B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾賽股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESSAI, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈士丁斯　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASTINGS, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗尼崔瓦拉　奎德喬赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURNITUREWALA, QUAID JOHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐韋勒　羅夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUWEILER, ROLF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞雷爾　于爾根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERRER, JUERGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭　卓洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述數種測試互連件系統及方法。在一實施例中，一測試互連件包括容納一或多個可壓縮探針之至少一部分的一殼體結構。該測試互連件也包括相對於一載板固持該一或多個可壓縮探針的一板體；與一電路板，其具有提供用於一受測裝置之一供應電壓之一傳導路徑的一或多個傳導平面。該電路板位在該殼體結構的一側上，相對於受測裝置，其與載板側相反。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Test interconnect systems and methods are described. In one example, a test interconnect includes a housing structure that houses at least a portion of one or more compressible probes. The test interconnect also includes a plate that retains the one or more compressible probes relative to a load board, and a circuit board with one or more conductive planes that provide a conductive path for a supply voltage for a device under test. The circuit board is positioned on a side of the housing structure relative to a device under test that is opposite the load board side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:示範測試系統</p>
        <p type="p">103:測試互連件總成</p>
        <p type="p">106:DUT</p>
        <p type="p">109:載板</p>
        <p type="p">203:主要殼體結構</p>
        <p type="p">206:覆蓋板</p>
        <p type="p">209:電路板</p>
        <p type="p">212:加強板</p>
        <p type="p">215a,215b,215c:可壓縮探針</p>
        <p type="p">216:可壓縮測量探針</p>
        <p type="p">218:供應電壓接觸</p>
        <p type="p">221:訊號接觸</p>
        <p type="p">224:接地接觸</p>
        <p type="p">227:供應電壓接觸</p>
        <p type="p">230:訊號接觸</p>
        <p type="p">233:接地接觸</p>
        <p type="p">236:供應電壓測量接觸</p>
        <p type="p">242:接地層</p>
        <p type="p">245:供應電壓層</p>
        <p type="p">248:電容器</p>
        <p type="p">251a,251b,251c:中空貫孔</p>
        <p type="p">254:貫孔</p>
        <p type="p">257:供應電壓測量接觸</p>
        <p type="p">261a,261b:探針間隔件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="992" publication-number="202618511">
    <tif-files tif-type="multi-tif">
      <tif file="114106988.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算系統</chinese-title>
        <english-title>COMPUTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250806B">G06F1/16</main-classification>
        <further-classification edition="202501120250806B">H05K5/10</further-classification>
        <further-classification edition="200601120250806B">H05K7/14</further-classification>
        <further-classification edition="200601120250806B">H05K13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSORNG, YAW-TZORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉振嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, JEN-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹作均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, ZUO-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種計算系統包含具有殼體的計算裝置。蓋體裝設於殼體且可相對於殼體於開啟位置以及關閉位置之間移動。當蓋體於開啟位置時，硬體模組例如風扇模組可移除地插入殼體。當蓋體於關閉位置時，硬體模組被封閉於殼體內。滑鎖裝設於硬體模組。當蓋體從開啟位置移動至關閉位置並對滑鎖施加力時，滑鎖可從解鎖位置移動至鎖定位置。當蓋體從殼體移除時，滑鎖自動地解鎖硬體模組，以便將硬體模組從殼體移除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computing system comprises a computing device having a housing. A cover is mounted to the housing and movable relative to the housing between an open position and a closed position. A hardware module such as a fan moule is removably inserted into the housing when the cover is in the open position. When the cover is in the closed position, the hardware module is enclosed within the housing. A slide lock is mounted on the hardware module. The slide lock is movable from an unlocked position to a locked position when the cover moves from the open position to the closed position and exerts a force on the slide lock. When the cover is removed from the housing, the slide lock automatically unlocks the hardware module so that the hardware module can be removed from the housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計算系統</p>
        <p type="p">121:硬體模組</p>
        <p type="p">131,132:滑鎖</p>
        <p type="p">151:計算裝置</p>
        <p type="p">161:蓋體</p>
        <p type="p">252:殼體</p>
        <p type="p">253:空腔</p>
        <p type="p">254:第一牆體</p>
        <p type="p">255:第二牆體</p>
        <p type="p">256:收納凹槽</p>
        <p type="p">262:開啟位置</p>
        <p type="p">267:後緣</p>
        <p type="p">268:內表面</p>
        <p type="p">271:突出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="993" publication-number="202618290">
    <tif-files tif-type="multi-tif">
      <tif file="114107021.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試插座</chinese-title>
        <english-title>TEST SOCKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01R1/04</main-classification>
        <further-classification edition="200601120250401B">G01R1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商惠康有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HICON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHEE, SEUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的示例性實施例揭露一種測試插座，其包括：插座本體，具備彈性絕緣體；以及彈簧觸點，插入至形成在該插座本體上的孔，具有按壓方向上的彈性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An exemplary embodiment of the present invention discloses a test socket including a socket body including an elastic insulator and a spring contact that is inserted into a hole formed in the socket body and has elastic force in a pressing direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:基板</p>
        <p type="p">17:LGA端子</p>
        <p type="p">20:觸點</p>
        <p type="p">51:第一表面</p>
        <p type="p">52:彈性絕緣體</p>
        <p type="p">53:第二表面</p>
        <p type="p">54:框架</p>
        <p type="p">h&lt;sub&gt;1&lt;/sub&gt;、h&lt;sub&gt;2&lt;/sub&gt;、h&lt;sub&gt;3&lt;/sub&gt;:孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="994" publication-number="202617304">
    <tif-files tif-type="multi-tif">
      <tif file="114107131.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卡盤裝置、工具機及夾持方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">B23B31/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉徑科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIZIN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>町田昌弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHIDA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>町田善弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHIDA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種卡盤裝置、工具機及夾持方法。該卡盤裝置最初藉由一伺服馬達，使一拖桿進退使一夾持機構夾持一工件，接著，一轉矩調整盤形彈簧伸縮以調整相對於該工件的轉矩。當該伺服馬達依照一轉矩資料所指示的預定量旋轉時，該伺服馬達會停止而一離合器機構關閉。使該夾持機構夾持該工件的轉矩仍維持良好，不需要隨時加壓仍可將該夾持機構的轉矩維持在適當的數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:卡盤裝置</p>
        <p type="p">110:夾持機構</p>
        <p type="p">120,412,414:軸承</p>
        <p type="p">122:支撐殼體</p>
        <p type="p">124:擋塊</p>
        <p type="p">200:拖桿</p>
        <p type="p">210,220:鍵槽</p>
        <p type="p">300:外殼</p>
        <p type="p">310:空間</p>
        <p type="p">320:鍵支撐部</p>
        <p type="p">400:轉矩設定機構</p>
        <p type="p">410:轉矩設定套件</p>
        <p type="p">416,418:鍵</p>
        <p type="p">42:轉矩調整單元</p>
        <p type="p">420:轉矩調整盤形彈簧</p>
        <p type="p">430,432:彈簧壓制部</p>
        <p type="p">440,442:卡止部</p>
        <p type="p">45:拖桿進退單元</p>
        <p type="p">450:進退螺紋部</p>
        <p type="p">452,454:螺紋</p>
        <p type="p">50:旋轉驅動單元</p>
        <p type="p">500:控制面板</p>
        <p type="p">502:記憶體</p>
        <p type="p">504:轉矩資料</p>
        <p type="p">510:伺服馬達</p>
        <p type="p">520:傳達齒輪部</p>
        <p type="p">530:離合器機構</p>
        <p type="p">RW:虛線</p>
        <p type="p">X:主軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="995" publication-number="202619307">
    <tif-files tif-type="multi-tif">
      <tif file="114107300.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線訊號裝置及無線訊號偵測方法</chinese-title>
        <english-title>WIRELESS SIGNAL APPARATUS AND WIRELESS SIGNAL DETECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250401B">H04B7/04</main-classification>
        <further-classification edition="200601120250401B">H01Q1/32</further-classification>
        <further-classification edition="200601120250401B">H01Q21/06</further-classification>
        <further-classification edition="200601120250401B">G01S13/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳則朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSE-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線訊號裝置及無線訊號偵測方法。無線訊號裝置包括天線裝置。天線裝置包括排列於第一平面的發射天線陣列與接收天線陣列。天線裝置形成窄波束天線輻射場型，窄波束天線輻射場型形成扁平化偵測區域，扁平化偵測區域形成大致垂直於第一平面的第二平面。無線訊號裝置用以偵測扁平化偵測區域內的外部物件的空間資訊，其中空間資訊僅包括第二平面上的二維的空間資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless signal apparatus and a wireless signal detection are provided. The wireless signal apparatus comprises an antenna apparatus. The antenna apparatus comprises a transmitting antenna array and a receiving antenna array arranged in a first plane. The antenna apparatus forms a narrow-beamwidth antenna radiation pattern, the narrow-beamwidth antenna radiation pattern forms a flattened detection area, and the flattened detection area forms a second plane substantially perpendicular to the first plane. The wireless signal apparatus is used to detect spatial information of an external object within the flattened detection area, and the spatial information comprises only two-dimension spatial information in the second plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線訊號裝置</p>
        <p type="p">102:天線裝置</p>
        <p type="p">602:發射電路</p>
        <p type="p">604:接收電路</p>
        <p type="p">606:處理電路</p>
        <p type="p">608:移相器</p>
        <p type="p">610:頻率合成器</p>
        <p type="p">TG1、TG2:發射天線組</p>
        <p type="p">RG1、RG2:接收天線組</p>
        <p type="p">PA1、PA2:功率放大器</p>
        <p type="p">LNA1、LNA2:低雜訊放大器</p>
        <p type="p">MX:混波器</p>
        <p type="p">F:濾波器</p>
        <p type="p">ADC:類比至數位轉換器</p>
        <p type="p">PT1、PT2:發射天線埠</p>
        <p type="p">PR1、PR2:接收天線埠</p>
        <p type="p">ST:載波訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="996" publication-number="202617055">
    <tif-files tif-type="multi-tif">
      <tif file="114107547.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測元件及其影像和光源同步的方法、內視鏡裝置</chinese-title>
        <english-title>IMAGE SENSOR DEVICE AND METHOD FOR IMAGE AND LIGHT SOURCE SYNCHRONIZATION THEREOF,ENDOSCOPIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61B1/07</main-classification>
        <further-classification edition="200601120260123B">A61B1/005</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>互貴興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUKUI BIOTECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅士哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, SHIH-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱怡銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種影像感測元件，適於耦接一影像處理器及一光源裝置，用以發出至少二種光源，包含：一影像感測器，用以感測一待測部位在該光源裝置照射下所產生的反射光，並將該反射光所相對應的光訊號轉換為影像訊號後傳送至該影像處理器；及一時序控制模組，使用一同步訊號來同步控制該光源裝置及該影像感測器，並根據該影像感測器於每一幀中所需的不同光源，來同步控制該光源裝置進行該些光源之間的切換及啟動，而使該影像感測器對應不同光源產生不同之影像訊號。本發明還提供一種方法及內視鏡裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an image sensor device, which is suitable for coupling with an image processor and a light source device which used to emit at least two kinds of light sources. The image sensor device includes an image sensor and a timing control module. The image sensor is used to sense the reflected light generated by a part to be measured when illuminated by the light source device, and convert the light signal corresponding to the reflected light into an image signal and then transmit it to the image processor. The timing control module uses a synchronization signal to synchronously control the light source device and the image sensor. According to the different light sources required by the image sensor in each frame, the light source device is synchronously controlled to switch and activate between the light sources, so that the image sensor generates different image signals corresponding to different light sources. The invention also provides a method and an endoscope device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:影像感測器</p>
        <p type="p">2:時序控制模組</p>
        <p type="p">10:影像感測元件</p>
        <p type="p">L:光源裝置</p>
        <p type="p">L1:第一發光元件</p>
        <p type="p">L2:第二發光元件</p>
        <p type="p">L3:第三發光元件</p>
        <p type="p">L4:第四發光元件</p>
        <p type="p">L5:第五發光元件</p>
        <p type="p">P:影像處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="997" publication-number="202619064">
    <tif-files tif-type="multi-tif">
      <tif file="114107695.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107695</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含基板周邊區域上槽的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING SLOT ON PERIPHERAL REGION OF SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250424B">H01L23/28</main-classification>
        <further-classification edition="200601120250424B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊吳德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體裝置及製造半導體裝置的方法。該半導體裝置包括一基板、一電子元件和一封裝材料。該基板具有一下表面和與該下表面相對的一上表面。該電子元件配置在該基板的該上表面上。該封裝材料配置在該基板的該上表面上。該封裝材料包括在該基板的一中央區域穿透該基板的一第一部分和在該基板的一周邊區域穿透該基板的一第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, an electronic component, and an encapsulant. The substrate has a lower surface and an upper surface opposite to the lower surface. The electronic component is disposed on the upper surface of the substrate. The encapsulant is disposed on the upper surface of the substrate. The encapsulant includes a first portion penetrating the substrate at a central region of the substrate and a second portion penetrating the substrate at a peripheral region of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:半導體裝置</p>
        <p type="p">10:基板</p>
        <p type="p">10s1:表面</p>
        <p type="p">10s2:表面</p>
        <p type="p">20:開口</p>
        <p type="p">22:開口</p>
        <p type="p">30:電子元件</p>
        <p type="p">30s1:表面</p>
        <p type="p">30s2:表面</p>
        <p type="p">32:焊墊</p>
        <p type="p">34:焊墊</p>
        <p type="p">40:焊墊</p>
        <p type="p">42:焊墊</p>
        <p type="p">50:導電線</p>
        <p type="p">52:導電線</p>
        <p type="p">60:封裝材料</p>
        <p type="p">60p1:部分</p>
        <p type="p">60p2:部分</p>
        <p type="p">70:電性連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="998" publication-number="202619479">
    <tif-files tif-type="multi-tif">
      <tif file="114107697.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107697</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有突出接觸件的半導體元件及其製備方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE WITH PROTRUDING CONTACT AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250424B">H10B12/00</main-classification>
        <further-classification edition="200601120250424B">H01L21/764</further-classification>
        <further-classification edition="200601120250424B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種具有一突出接觸件的半導體元件及其製備方法。該半導體元件包括一基底；在該基底上的一位元線結構；在該位元線結構旁的一電容器接觸結構；以及覆蓋該電容器接觸結構的一上表面的一部分和該電容器接觸結構的一側壁的一上部的一著陸墊層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a semiconductor device with a protruding contact and a method of fabricating the semiconductor device. The semiconductor device includes a substrate, a bit line structure on the substrate, a capacitor contact structure next to the bit line structure, and a landing pad layer covering a portion of a top surface of the capacitor contact structure and an upper portion of a sidewall of the capacitor contact structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:半導體元件</p>
        <p type="p">101:基底</p>
        <p type="p">103:隔離層</p>
        <p type="p">105:主動區(矽層)</p>
        <p type="p">107-1:源極區</p>
        <p type="p">107-3:汲極區</p>
        <p type="p">301:位元線結構</p>
        <p type="p">303:位元線下導電層</p>
        <p type="p">305:位元線中間導電層</p>
        <p type="p">307:位元線上導電層</p>
        <p type="p">309:位元線罩蓋層</p>
        <p type="p">309TS:上表面</p>
        <p type="p">311:位元線接觸件</p>
        <p type="p">311BS:下表面</p>
        <p type="p">313:位元線間隙子</p>
        <p type="p">313BS:下表面</p>
        <p type="p">313TS:上表面</p>
        <p type="p">401:電容器接觸結構</p>
        <p type="p">403:電容器接觸下導電層</p>
        <p type="p">403BS:下表面</p>
        <p type="p">405:電容器接觸中間導電層</p>
        <p type="p">407:電容器接觸上導電層</p>
        <p type="p">407SW:側壁</p>
        <p type="p">407TS:上表面</p>
        <p type="p">501:著陸墊層</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="999" publication-number="202619483">
    <tif-files tif-type="multi-tif">
      <tif file="114107772.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲存裝置及其形成方法</chinese-title>
        <english-title>MEMORY DEVICES AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250617B">H10B20/00</main-classification>
        <further-classification edition="202301120250617B">H10B20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖婉君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WAN-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李慧文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳蓉萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種儲存裝置包括多個儲存單元，所述多個儲存單元中的每一個配置為儲存資料位元；第一互連結構可操作地配置為位元線並耦合到多個儲存單元中的每一個；第二互連結構可操作地配置為承載供給電壓並耦合到多個儲存單元中的每一個。當多個記憶體單元中的第一記憶體單元包括第一通道結構，且第一通道結構的第一端和第二端分別連接到第一外延結構和第二外延結構時，由第一記憶體單元儲存的資料位元呈現第一邏輯狀態，以及其中第一外延結構被介電結構覆蓋，且第二外延結構被第一接觸結構覆蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a plurality of memory cells, each of the plurality of memory cells configured to store a data bit; a first interconnect structure operatively configured as a bit line and coupled to each of the plurality of memory cells; and a second interconnect structure operatively configured to carry a supply voltage and coupled to each of the plurality of memory cells. The data bit stored by a first one of the plurality of memory cells presents a first logic state when the first memory cell includes a first channel structure, with a first end and a second end of the first channel structure connected to a first epitaxial structure and a second epitaxial structure, respectively, and wherein the first epitaxial structure is overlaid by a dielectric structure and the second epitaxial structure is overlaid by a first contact structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210A:外延結構</p>
        <p type="p">210B:外延結構</p>
        <p type="p">210C:外延結構</p>
        <p type="p">210D:外延結構</p>
        <p type="p">210E:外延結構</p>
        <p type="p">210F:外延結構</p>
        <p type="p">210G:外延結構</p>
        <p type="p">210H:外延結構</p>
        <p type="p">220:閘極結構</p>
        <p type="p">221:閘極結構</p>
        <p type="p">222:閘極結構</p>
        <p type="p">223:閘極結構</p>
        <p type="p">224:閘極結構</p>
        <p type="p">225:閘極結構</p>
        <p type="p">281:通孔結構</p>
        <p type="p">282:通孔結構</p>
        <p type="p">283:通孔結構</p>
        <p type="p">284:通孔結構</p>
        <p type="p">285:通孔結構</p>
        <p type="p">286:通孔結構</p>
        <p type="p">287:通孔結構</p>
        <p type="p">288:通孔結構</p>
        <p type="p">289:通孔結構</p>
        <p type="p">250:接觸結構/MD</p>
        <p type="p">252:接觸結構/MD</p>
        <p type="p">253:接觸結構/MD</p>
        <p type="p">254:接觸結構/MD</p>
        <p type="p">430:ROM單元</p>
        <p type="p">440:ROM單元</p>
        <p type="p">550:介電結構</p>
        <p type="p">BL:位元線</p>
        <p type="p">VSS:接地電壓</p>
        <p type="p">WL0:字元線</p>
        <p type="p">WL1:字元線</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1000" publication-number="202618285">
    <tif-files tif-type="multi-tif">
      <tif file="114107794.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於夾持高度彎曲半導體晶圓之方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR CHUCKING HIGHLY BOWED SEMICONDUCTOR WAFERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">G01R1/02</main-classification>
        <further-classification edition="200601120260119B">H01L21/68</further-classification>
        <further-classification edition="200601120260119B">H01L21/683</further-classification>
        <further-classification edition="202001120260119B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭德　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHARAND, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文呈現用於將一高度彎曲薄基板(諸如半導體晶圓)真空安裝至一扁平夾頭上之方法及系統。包含一高流量真空端口連接器之一真空貯槽總成位於一晶圓定位系統附近。一晶圓定位系統包含具有一相配的高流量真空端口連接器之一晶圓夾頭總成。在一對接(docked)位置中，該高流量真空端口連接器及該相配的高流量真空端口連接器流體耦合，且打開一流量控制閥以夾緊一高度彎曲晶圓。該真空貯槽與該真空端口連接器之間的任何真空導管長度短且直徑大以最小化摩擦損失。以此方式，增加的真空流量能夠補償較大洩漏且產生足夠負壓以成功地夾緊一高度彎曲晶圓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for vacuum mounting a highly bowed, thin substrate, such as a semiconductor wafer, onto a flat chuck are presented herein. A vacuum reservoir assembly including a high flow vacuum port connector is located in close proximity to a wafer positioning system. A wafer positioning system includes a wafer chuck assembly having a complementary high flow vacuum port connector. In a docked position, the high flow vacuum port connector and the complementary high flow vacuum port connector are fluidically coupled, and a flow control valve is opened to clamp a highly bowed wafer. Any vacuum conduit between the vacuum reservoir and the vacuum port connector is short in length and large in diameter to minimize frictional losses. In this manner, increased vacuum flow is able to compensate for large leaks and generate enough negative pressure to successfully clamp a highly bowed wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:量測系統</p>
        <p type="p">101:機器框架</p>
        <p type="p">102:真空源</p>
        <p type="p">103:氣體流</p>
        <p type="p">110:晶圓定位系統</p>
        <p type="p">111A:基礎參考結構</p>
        <p type="p">111B:基礎參考結構</p>
        <p type="p">112:X框架</p>
        <p type="p">114:Y框架</p>
        <p type="p">115:動態纜線</p>
        <p type="p">116:動態纜線</p>
        <p type="p">117:俯仰/傾斜/Z載物台</p>
        <p type="p">117A至117C:線性致動器</p>
        <p type="p">118:旋轉軸承馬達總成</p>
        <p type="p">119:晶圓</p>
        <p type="p">120:晶圓夾頭</p>
        <p type="p">121:高流量真空端口連接器</p>
        <p type="p">122:真空饋通</p>
        <p type="p">123:負加壓空氣</p>
        <p type="p">130:真空貯槽總成</p>
        <p type="p">131:真空貯槽</p>
        <p type="p">132:高流量真空端口連接器</p>
        <p type="p">133:真空導管</p>
        <p type="p">134:流量控制閥</p>
        <p type="p">135:控制信號</p>
        <p type="p">140:接合方向</p>
        <p type="p">160:半導體量測系統</p>
        <p type="p">161:照明源</p>
        <p type="p">162:收集光學器件</p>
        <p type="p">163:法線入射光束</p>
        <p type="p">164:物鏡</p>
        <p type="p">165:偵測器</p>
        <p type="p">166:輸出信號</p>
        <p type="p">167:計算系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1001" publication-number="202618236">
    <tif-files tif-type="multi-tif">
      <tif file="114108366.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光連結器連接判定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01M11/00</main-classification>
        <further-classification edition="201301120260123B">H04B10/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛德萬測試股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANTEST CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原英生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]判定光連結器的連接的好壞。&lt;br/&gt;[解決手段]光連結器連接判定裝置具備：1.5μmLD14，將連接確認用雷射光導入到入光纖F1a；連接確認用雷射光取出部17，從取出光纖F1d取出連接確認用雷射光；連接判定部18，基於藉由連接確認用雷射光取出部17取出的連接確認用雷射光，判定第一光連結器12以及第二光連結器22的連接的好壞；第一連接確認用雷射光賦予部19a-c，從中間光纖F1b接收連接確認用雷射光，給予另一個中間光纖F1c；及第二連接確認用雷射光賦予部24a、24b、24c(26a、26b、26c)，從一個第二光纖F2a(F2c)接收連接確認用雷射光，給予另一個第二光纖F2b(F2d)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:第一光連結器</p>
        <p type="p">12E:端面</p>
        <p type="p">14:1.5μmLD(連接確認用雷射光源)</p>
        <p type="p">15:連接確認用雷射光導入部</p>
        <p type="p">16:1.5μmPD(連接確認用雷射光檢測器)</p>
        <p type="p">17:連接確認用雷射光取出部</p>
        <p type="p">18:連接判定部</p>
        <p type="p">19a:第一波長分割多工耦合器</p>
        <p type="p">19b:另一個第一波長分割多工耦合器</p>
        <p type="p">19c:光纖</p>
        <p type="p">22:第二光連結器</p>
        <p type="p">22E:端面</p>
        <p type="p">23:探針卡</p>
        <p type="p">24a:第二波長分割多工耦合器</p>
        <p type="p">24b:另一個第二波長分割多工耦合器</p>
        <p type="p">24c:光纖</p>
        <p type="p">26a:第二波長分割多工耦合器</p>
        <p type="p">26b:另一個第二波長分割多工耦合器</p>
        <p type="p">26c:光纖</p>
        <p type="p">100:半導體試驗裝置</p>
        <p type="p">200:光探針</p>
        <p type="p">300:DUT</p>
        <p type="p">F1a:第一光纖、導入光纖</p>
        <p type="p">F1b:第一光纖、中間光纖</p>
        <p type="p">F1c:第一光纖、中間光纖</p>
        <p type="p">F1d:第一光纖、取出光纖</p>
        <p type="p">F2a,F2b,F2c,F2d:第二光纖</p>
        <p type="p">F11,F12,F13,F14:藉由第一光連結器12保持的部分</p>
        <p type="p">F21,F22,F23,F24:藉由第二光連結器22保持的部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1002" publication-number="202619485">
    <tif-files tif-type="multi-tif">
      <tif file="114108374.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及其形成方法</chinese-title>
        <english-title>MEMORY DEVICES AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251023B">H10B20/20</main-classification>
        <further-classification edition="200601120251023B">H01L21/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體裝置包括在基板中形成的井並沿著第一橫向方向延伸，其中井具有第一導電類型。記憶體裝置包括設置在井上方的磊晶結構，其中磊晶結構具有相對於第一導電類型的第二導電類型。記憶體裝置包括設置在井上方的共用磊晶結構，其中共用磊晶結構具有第一導電類型且接觸井。磊晶結構的第一群組中的每一個接觸井，且磊晶結構的第二群組中的每一個具有底表面，底表面透過對應的介電層與井分開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a well formed in a substrate and extending along a first lateral direction, wherein the well has a first conductive type. The memory device includes a plurality of epitaxial structures disposed over the well, wherein the plurality of epitaxial structures have a second conductive type opposite to the first conductive type. The memory device includes a common epitaxial structure disposed over the well, wherein the common epitaxial structure has the first conductive type and is in contact the well. A first group of the plurality of epitaxial structures are each in contact with the well, and a second group of the plurality of epitaxial structures each have a bottom surface separated from the well with a corresponding dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">305:井/p井</p>
        <p type="p">310:介電層</p>
        <p type="p">314:閘極結構</p>
        <p type="p">316:閘極結構</p>
        <p type="p">318:閘極結構</p>
        <p type="p">320:閘極結構</p>
        <p type="p">322:閘極結構</p>
        <p type="p">324:閘極結構</p>
        <p type="p">326:閘極結構</p>
        <p type="p">328A:磊晶結構</p>
        <p type="p">328B:磊晶結構</p>
        <p type="p">328C:磊晶結構</p>
        <p type="p">328D:磊晶結構</p>
        <p type="p">328E:磊晶結構</p>
        <p type="p">328F:磊晶結構</p>
        <p type="p">330A:源極/汲極接觸件結構</p>
        <p type="p">330B:源極/汲極接觸件結構</p>
        <p type="p">330C:源極/汲極接觸件結構</p>
        <p type="p">330D:源極/汲極接觸件結構</p>
        <p type="p">330E:源極/汲極接觸件結構</p>
        <p type="p">330F:源極/汲極接觸件結構</p>
        <p type="p">333:通孔結構</p>
        <p type="p">339:通孔結構</p>
        <p type="p">410:ROM單元</p>
        <p type="p">420:ROM單元</p>
        <p type="p">430:ROM單元</p>
        <p type="p">440:ROM單元</p>
        <p type="p">450:ROM單元</p>
        <p type="p">BL:位元線</p>
        <p type="p">VSS:接地電壓/供應電壓</p>
        <p type="p">WL0:字元線</p>
        <p type="p">WL1:字元線</p>
        <p type="p">WL2:字元線</p>
        <p type="p">WL3:字元線</p>
        <p type="p">WL4:字元線</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1003" publication-number="202619484">
    <tif-files tif-type="multi-tif">
      <tif file="114108387.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250617B">H10B20/00</main-classification>
        <further-classification edition="202301120250617B">H10B20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雅惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許鈴芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, LING-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括具有主動區域及井區的基板以及在井區上的位元單元。位元單元包括在第一方向上延伸跨越主動區域的及在第二方向上間隔開的第一閘極結構與第二閘極結構、在第一閘極結構的第一側處的第一導電結構、在第一閘極結構的第二側與第二閘極結構的第一側之間的第二導電結構，及在第二閘極結構的第二側處的第三導電結構。半導體裝置包括與井區垂直地重疊的第四導電結構、連接至第一導電結構及第三導電結構的第一導體、連接至第四導電結構的第二導體，及連接至第一及第二閘極結構的第三導體。第二及第四導電結構電連接至井區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate including an active area and a well region, a bitcell including a first gate structure and a second gate structure extending in a first direction across the active area and spaced apart in a second direction; a first conductive structure at a first side of the first gate structure; a second conductive structure between a second side of the first gate structure and a first side of the second gate structure; and a third conductive structure at a second side of the second gate structure; a fourth conductive structure vertically overlapping the well region; a first conductor connected to the first conductive structure and the third conductive structure; a second conductor connected to the fourth conductive structure; and a third conductor connected to the first and second gate structures. The second and fourth conductive structures are electrically connected to the well region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">112:介電材料</p>
        <p type="p">122a:第一閘極結構</p>
        <p type="p">122b:第二閘極結構</p>
        <p type="p">126a:第一導電結構</p>
        <p type="p">126b:第二導電結構</p>
        <p type="p">126c:第三導電結構</p>
        <p type="p">126d:第四導電結構</p>
        <p type="p">138:第三導體</p>
        <p type="p">140a:第一閘極通孔</p>
        <p type="p">140b:第二閘極通孔</p>
        <p type="p">142:絕緣結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1004" publication-number="202618248">
    <tif-files tif-type="multi-tif">
      <tif file="114108628.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用明亮發射探頭以增強偵測可見度之光學方法</chinese-title>
        <english-title>OPTICAL METHOD TO ENHANCE DETECTION VISIBILITY USING BRIGHT EMISSIVE PROBE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">G01N21/64</main-classification>
        <further-classification edition="200601120260122B">G01N21/88</further-classification>
        <further-classification edition="200601120260122B">G01N21/95</further-classification>
        <further-classification edition="200601120260122B">G01N21/956</further-classification>
        <further-classification edition="200601120260122B">G01J3/443</further-classification>
        <further-classification edition="200601120260122B">C09K11/02</further-classification>
        <further-classification edition="200601120260122B">C09K11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈加德桑　普拉迪普庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAGADESAN, PRADEEPKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　葛雷斯　秀玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GRACE HSIU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種經圖案化樣本。經圖案化晶圓可包含：一第一基板材料；及一光致發光材料，其經組態以結合至該第一基板材料以增強一關注特徵。該光致發光材料可包含：一光致發光化合物，其包括一螢光團；及一分子間封端劑，其經組態以阻礙因與另一螢光團之分子間相互作用引起之該螢光團之淬滅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A patterned sample is disclosed. The patterned wafer may include a first substrate material and a photoluminescent material configured to bind to the first substrate material to enhance a feature of interest. The photoluminescent material may include a photoluminescent compound comprising a fluorophore and an intermolecular blocking agent configured to hinder quenching of the fluorophore caused by intermolecular interaction with another fluorophore.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢測系統</p>
        <p type="p">102:照明源</p>
        <p type="p">104:照明光束</p>
        <p type="p">106:基板</p>
        <p type="p">108:載物台總成</p>
        <p type="p">110:光學元件</p>
        <p type="p">112:偵測器</p>
        <p type="p">114:集光光學器件</p>
        <p type="p">120:光致發光發射</p>
        <p type="p">122:光學元件</p>
        <p type="p">130:控制器</p>
        <p type="p">132:處理器</p>
        <p type="p">134:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1005" publication-number="202618573">
    <tif-files tif-type="multi-tif">
      <tif file="114108720.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶卡、系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G06F13/38</main-classification>
        <further-classification edition="200601120251103B">G06F13/14</further-classification>
        <further-classification edition="201601120251103B">G06F12/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺西正臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERANISHI, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本典哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, NORIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種記憶卡，具備新的調諧架構。  &lt;br/&gt;　　依據實施方式，記憶卡具備非揮發性記憶體與控制器。控制器可與主機連接，控制非揮發性記憶體。控制器構成為，將第1指令定義為用以調諧主機從控制器收訊資料的取樣時機，並將第1值定義為主機送訊出用於調諧的調諧模式資料，當控制器收訊到第1指令，且該第1值被設定為第1指令的第1引數時，則從主機收訊調諧模式資料；將第2值定義為記憶卡送訊出調諧模式資料，當控制器收訊到第1指令，且該第2值被設定為第1指令的第1引數時，則將調諧模式資料送訊至主機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1006" publication-number="202619309">
    <tif-files tif-type="multi-tif">
      <tif file="114108730.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108730</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>緊湊型波束成形接收器前端</chinese-title>
        <english-title>COMPACT BEAMFORMING RECEIVER FRONT END</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H04B7/08</main-classification>
        <further-classification edition="200601120260123B">H01Q3/28</further-classification>
        <further-classification edition="200601120260123B">H01Q3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格芯（美國）集成電路科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALFOUNDRIES US INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝拉歐爾　阿卜杜勒拉蒂夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLAOUAR, ABDELLATIF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉薩伯拉馬尼彥　亞若</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIYAN, ARUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽義德　沙菲拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYED, SHAFIULLAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係用於接收器的波束成形前端(BFFE)在不需要對複數個接收信號中的每一個執行相移的情況下執行波束成形。該BFFE包括分別將該接收信號放大第一增益值的第一可變增益放大器(VGA)以及將該接收信號放大第二增益值的第二VGA。將該第一VGA的輸出組合成第一組合信號，且將該第二VGA的輸出組合成第二組合信號。接著，使用該第一及第二組合信號產生輸出信號，該輸出信號對應於將該接收信號相移與該相應第一及第二增益值相對應的量並接著加總該相移的結果。該輸出信號可通過將該第一組合信號與同相本地振盪器信號混頻以及將該第二組合信號與正交本地振盪器信號混頻來產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A beamforming front end (BFFE) for a receiver performs beamforming without needing to perform phase-shifting on each of a plurality of received signals. The BFFE comprises first variable gain amplifiers (VGAs) that respectively amplify the received signals by first gain values and second VGAs that respectively amplify the received signals by second gain values. Outputs of the first VGAs are combined into a first combined signal, and outputs of the second VGAs are combined into a second combined signal. The first and second combined signals are then used to produce an output signal corresponding to phase-shifting the received signals by amounts corresponding to the respective first and second gain values and then summing the results of the phase shifting. The output signal may be produced by mixing the first combined signal with an in-phase local oscillator signal and mixing the second combined signal with a quadrature local oscillator signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:BFFE</p>
        <p type="p">202-1至202-n:天線鏈</p>
        <p type="p">204-1至204-n:RF LNA</p>
        <p type="p">206I-1至206I-n:I信號可變增益放大器、I信號VGA</p>
        <p type="p">206Q-1至206Q-n:Q信號VGA</p>
        <p type="p">208:組合器</p>
        <p type="p">208I:I電流組合器</p>
        <p type="p">208PQ:PQ電流組合器</p>
        <p type="p">210:IF轉換器</p>
        <p type="p">212:本地振盪器</p>
        <p type="p">214:正交發生器</p>
        <p type="p">216I:I混頻器</p>
        <p type="p">216Q:Q混頻器</p>
        <p type="p">218:IF組合器</p>
        <p type="p">CI:組合I信號</p>
        <p type="p">CPQ:組合PQ信號</p>
        <p type="p">DCI:降頻轉換組合I信號、降頻轉換I信號</p>
        <p type="p">DCQ:降頻轉換組合Q信號、降頻轉換Q信號</p>
        <p type="p">I1至In:I信號</p>
        <p type="p">IFout:中頻信號、IF信號</p>
        <p type="p">IG1至IGn:I增益(IG)值</p>
        <p type="p">LO:本地振盪器輸出</p>
        <p type="p">LO_I:同相(I)本地振盪器信號、I本地振盪器信號、本地振盪器I信號</p>
        <p type="p">LO_Q:正交(Q)本地振盪器信號、Q本地振盪器信號、本地振盪器Q信號</p>
        <p type="p">PQ1至PQn:正交信號、PQ信號</p>
        <p type="p">QG1至QGn:Q增益(QG)值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1007" publication-number="202617268">
    <tif-files tif-type="multi-tif">
      <tif file="114108745.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種Beta分子篩催化劑及其製備和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">B01J29/70</main-classification>
        <further-classification edition="202401120250402B">B01J35/45</further-classification>
        <further-classification edition="202401120250402B">B01J35/50</further-classification>
        <further-classification edition="202401120250402B">B01J35/61</further-classification>
        <further-classification edition="202401120250402B">B01J35/63</further-classification>
        <further-classification edition="200601120250402B">B01J37/00</further-classification>
        <further-classification edition="200601120250402B">B01J37/02</further-classification>
        <further-classification edition="200601120250402B">B01J37/04</further-classification>
        <further-classification edition="200601120250402B">B01J37/08</further-classification>
        <further-classification edition="200601120250402B">B01J37/30</further-classification>
        <further-classification edition="200601120250402B">C07C2/66</further-classification>
        <further-classification edition="200601120250402B">C07C15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王達鋭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DARUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一棪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊為民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫洪敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈震浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, ZHENHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宦明耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAN, MINGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何俊琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種Beta分子篩催化劑及其製備方法和應用。所述催化劑包括連接有雙矽基團的Beta分子篩，所述催化劑的靜態水初始接觸角為140-165°，靜態水吸附量為130-170 mg/g。所述催化劑用於芳烴與烯烴烷基化製備烷基芳烴的反應時，不但具有良好的活性和烷基芳烴選擇性，而且還具有良好的抗水、抗鹼性雜質性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1008" publication-number="202619134">
    <tif-files tif-type="multi-tif">
      <tif file="114108867.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃料電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01M4/86</main-classification>
        <further-classification edition="201601120260202B">H01M8/12</further-classification>
        <further-classification edition="201601120260202B">H01M8/1226</further-classification>
        <further-classification edition="201601120260202B">H01M8/2428</further-classification>
        <further-classification edition="201601120260202B">H01M8/2432</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上保友人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UWABO, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹子佳孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAGO, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田&amp;#55395;&amp;#56979;誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, RYUUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三瀬信行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISE, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本有俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, ARITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係在基板上分割燃料電池單元而構成分割單元之情形時，藉由排除對發電輸出產生負面影響的分割單元，提供高輸出且高可靠性的燃料電池堆。        &lt;br/&gt;本發明之解決手段係本發明的燃料電池具備多孔質基板，第1電極層，固體電解質層，第2電極層，前述第1電極層或前述第2電極層中至少一者係藉由分割而形成分割單元，前述分割單元中之至少一部分具有使電極層相對於集電體絕緣的絕緣緩衝部。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:燃料電池單元</p>
        <p type="p">7:導電體膜</p>
        <p type="p">11:缺陷</p>
        <p type="p">12:空隙</p>
        <p type="p">300:燃料電池堆</p>
        <p type="p">301:導電性基板</p>
        <p type="p">302:基板接著層</p>
        <p type="p">303:基板密封層</p>
        <p type="p">304:單元下部集電體</p>
        <p type="p">305:單元上部集電體</p>
        <p type="p">306:單元部燃料流路</p>
        <p type="p">307:單元部空氣流路</p>
        <p type="p">308:單元部墊片</p>
        <p type="p">309:單元部分離器</p>
        <p type="p">310:下部墊片</p>
        <p type="p">311:上部墊片</p>
        <p type="p">312:下部分離器</p>
        <p type="p">313:上部分離器</p>
        <p type="p">314:底面夾具</p>
        <p type="p">315:頂面夾具</p>
        <p type="p">316:支柱</p>
        <p type="p">317:緊固夾具</p>
        <p type="p">318:燃料流路</p>
        <p type="p">320:燃料口</p>
        <p type="p">322:單位堆</p>
        <p type="p">323:下部夾具</p>
        <p type="p">324:上部夾具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1009" publication-number="202619099">
    <tif-files tif-type="multi-tif">
      <tif file="114108976.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有聚合物焊墊的半導體元件及其製備方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250424B">H01L23/488</main-classification>
        <further-classification edition="200601120250424B">H01L23/532</further-classification>
        <further-classification edition="200601120250424B">H01L23/538</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇國輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, KUO-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體元件及其製備方法。該半導體元件包括一第一基底，包括一正面和與該正面平行的一背面；一接合介電質，設置在該第一基底的該正面上；一重分佈層，設置在該接合介電質和該第一基底的該正面之間；一第一介電層，設置在該第一基底的該正面和該重分佈層之間；一罩蓋層，設置在該重分佈層和該接合介電質之間；一第一導電墊，設置在該罩蓋層和該接合介電質之間；一第二介電層，設置在該罩蓋層和該接合介電質之間，其中該第二介電層的一表面與該第一導電墊的一表面呈共面；以及一導電特徵，設置在該接合介電質和該第一導電墊中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the same. The semiconductor device includes a first substrate comprising a front side and a back side parallel to the front side; a bonding dielectric positioned on the front side of the first substrate; a redistribution layer positioned between the bonding dielectric and the front side of the first substrate; a first dielectric layer positioned between the front side of the first substrate and the redistribution layer; a capping layer positioned between the redistribution layer and the bonding dielectric; a first conductive pad positioned between the capping layer and the bonding dielectric; a second dielectric layer positioned between the capping layer and the bonding dielectric, wherein a surface of the second dielectric layer is coplanar with a surface of the first conductive pad; and a conductive feature positioned in the bonding dielectric and the first conductive pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:第一半導體晶片</p>
        <p type="p">100:第一基底</p>
        <p type="p">100B:背面</p>
        <p type="p">100F:正面</p>
        <p type="p">102:第二鈍化層</p>
        <p type="p">102b:介電層</p>
        <p type="p">102c:導電墊</p>
        <p type="p">102T:上表面</p>
        <p type="p">103:接合介電質</p>
        <p type="p">103B:背面</p>
        <p type="p">162:介電層</p>
        <p type="p">174:重分佈層(RDL)</p>
        <p type="p">1742:水平段</p>
        <p type="p">1744:垂直段</p>
        <p type="p">184:罩蓋層</p>
        <p type="p">201:互連結構</p>
        <p type="p">202:導電墊</p>
        <p type="p">202E:暴露表面</p>
        <p type="p">203:貫穿基底通孔(TSV)</p>
        <p type="p">203A:第一部分</p>
        <p type="p">203B:第二部分</p>
        <p type="p">203SD:晶種層</p>
        <p type="p">203SDT:上表面</p>
        <p type="p">203SW:側壁</p>
        <p type="p">203T:上表面</p>
        <p type="p">204:阻障層</p>
        <p type="p">204T:上表面</p>
        <p type="p">205:聚合物焊墊</p>
        <p type="p">205FP:第一部分</p>
        <p type="p">205SP:第二部分</p>
        <p type="p">205T:上表面</p>
        <p type="p">206:隔離焊墊</p>
        <p type="p">206S:側壁部</p>
        <p type="p">206TS:上表面</p>
        <p type="p">210:導電特徵</p>
        <p type="p">AL:黏著層</p>
        <p type="p">ALT:上表面</p>
        <p type="p">BND1:第一接合表面</p>
        <p type="p">TK1:厚度</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
        <p type="p">W3:寬度</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1010" publication-number="202619096">
    <tif-files tif-type="multi-tif">
      <tif file="114108977.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">H01L23/485</main-classification>
        <further-classification edition="200601120250422B">H01L23/525</further-classification>
        <further-classification edition="200601120250422B">H01L23/532</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方偉權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, WEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置、組裝結構和製造方法。電子裝置包括一基座部分、一電路結構、一絕緣結構、一第一導電層、一貫孔結構、一第一外層和一第二外層。該電路結構配置在該基座部分的一第一表面上。該絕緣結構配置在該電路結構上。該第一導電層配置在該絕緣結構上。該貫孔結構延伸穿過該絕緣結構，並電性連接該第一導電層和該電路結構。該第一外層配置在該第一導電層上。該第二外層配置在該第一外層上。該第二外層包括一氧化物材料以改善該第二外層的一最外表面的一共平面性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device, an assembly structure and a manufacturing method are provided. The electronic device includes a base portion, a circuit structure, an insulation structure, a first conductive layer, a via structure, a first outer layer and a second outer layer. The circuit structure is disposed on a first surface of the base portion. The insulation structure is disposed on the circuit structure. The first conductive layer is disposed on the insulation structure. The via structure extends through the insulation structure, and electrically connects the first conductive layer and the circuit structure. The first outer layer is disposed on the first conductive layer. The second outer layer is disposed on the first outer layer. The second outer layer includes an oxide material so as to improve a coplanarity of an outermost surface of the second outer layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:方法</p>
        <p type="p">S901:步驟</p>
        <p type="p">S902:步驟</p>
        <p type="p">S903:步驟</p>
        <p type="p">S904:步驟</p>
        <p type="p">S905:步驟</p>
        <p type="p">S906:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1011" publication-number="202618064">
    <tif-files tif-type="multi-tif">
      <tif file="114109040.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理液、半導體基板的處理方法，及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C23F1/26</main-classification>
        <further-classification edition="200601120260122B">C23F1/38</further-classification>
        <further-classification edition="200601120260122B">C09K13/08</further-classification>
        <further-classification edition="200601120260122B">H01L21/308</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須賀英太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGA, EITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種包含鉭原子之金屬之蝕刻處理速度優異之處理液、使用其之半導體基板的處理方法，及半導體裝置的製造方法。  &lt;br/&gt;　　[解決手段]提供一種包含氧化劑、氟系化合物、鹼金屬化合物及/或鹼土類金屬化合物，以及水之處理液、使用其之半導體基板的處理方法，及半導體裝置的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1012" publication-number="202618600">
    <tif-files tif-type="multi-tif">
      <tif file="114109041.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置的功能模擬的方法及使用該方法的功能模擬系統</chinese-title>
        <english-title>METHOD OF FUNCTION SIMULATION FOR ELECTRONIC DEVICE AND FUNCTIONAL SIMULATION SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250904B">G06F30/20</main-classification>
        <further-classification edition="202001120250904B">G06F30/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林東璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DONG CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭方俞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, FANG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電子裝置的功能模擬的方法和使用所述方法的功能模擬系統。方法包含：獲取電子裝置的電腦輔助設計檔案，其中電腦輔助設計檔案包含三維物件；將三維物件的第一面分割為多個第一網格；根據多個第一網格將三維物件識別為功能性元件；以及輸出功能性元件的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of function simulation for electronic devices and a functional simulation system using the same method are provided. The method includes: obtaining a computer aided design file of the electronic device, wherein the computer aided design file includes a three-dimensional object; segmenting a first face of the three-dimensional object into a plurality of first meshes; identifying the three-dimensional object as a functional component according to the plurality of first meshes; and outputting information of the functional component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S701,S702,S703,S704:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1013" publication-number="202617711">
    <tif-files tif-type="multi-tif">
      <tif file="114109241.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＢＣＲ－ＡＢＬ酪胺酸激酶抑制劑之調配物</chinese-title>
        <english-title>FORMULATIONS OF BCR-ABL TYROSINE KINASE INHIBITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C07D471/04</main-classification>
        <further-classification edition="200601120251201B">A61K31/506</further-classification>
        <further-classification edition="200601120251201B">A61K9/20</further-classification>
        <further-classification edition="200601120251201B">A61P35/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安立文股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENLIVEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考特　伊恩　萊斯利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOTT, IAN LESLIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛洛斯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROSS, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林斯　海倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLINS, HELEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案概言之係關於(1&lt;i&gt;S&lt;/i&gt;,2&lt;i&gt;S&lt;/i&gt;)-&lt;i&gt;N&lt;/i&gt;-(2-(4,6-雙(甲氧基-&lt;i&gt;d&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;)嘧啶-5-基)-1-甲基-1&lt;i&gt;H&lt;/i&gt;-吡咯并[2,3-&lt;i&gt;c&lt;/i&gt;]吡啶-5-基)-2-氟環丙烷-1-甲醯胺(化合物1)之結晶形式、其組合物及使用前述任一者之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to crystalline forms of (1&lt;i&gt;S,&lt;/i&gt;2&lt;i&gt;S&lt;/i&gt;)-&lt;i&gt;N&lt;/i&gt;-(2-(4,6-bis(methoxy-d3)pyrimidin-5-yl)-1-methyl-1&lt;i&gt;H&lt;/i&gt;-pyrrolo[2,3-c]pyridin-5-yl)-2-fluorocyclopropane-1-carboxamide (Compound 1), compositions thereof, and methods of using any of the foregoing.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1014" publication-number="202618798">
    <tif-files tif-type="multi-tif">
      <tif file="114109245.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體系統、記憶體裝置及其操作方法</chinese-title>
        <english-title>MEMORY SYSTEM, MEMORY DEVICE AND OPERATING METHOD OF CONTROLLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250805B">G11C29/54</main-classification>
        <further-classification edition="200601120250805B">G11C29/04</further-classification>
        <further-classification edition="200601120250805B">G11C7/10</further-classification>
        <further-classification edition="200601120250805B">G11C7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊朝凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHAO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許育豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐浩文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張銘宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴妍蒨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宏仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了記憶體系統、裝置及其操作方法。在一個態樣，一種系統包含一第一記憶體裝置。該第一記憶體裝置包含一第一記憶體元件、一第一輸入埠及耦接於該第一記憶體元件與該第一輸入埠之間的一第一內部掃描鏈。該系統包含一第二記憶體裝置。該第二記憶體裝置包含一第二記憶體元件、一第二輸入埠及耦接於該第二記憶體元件與該第二輸入埠之間的一第二內部掃描鏈。該系統包含用以經由該第一內部掃描鏈傳播一第一測試向量且經由該第二內部掃描鏈傳播一第二測試向量的一控制電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Memory systems, devices, and a method of operating the same are disclosed. In one aspect, a system includes a first memory device. The first memory device includes a first memory element, a first input port, and a first internal scan chain coupled between the first memory element and the first input port. The system includes a second memory device. The second memory device includes a second memory element, a second input port, and a second internal scan chain coupled between the second memory element and the second input port. The system includes a control circuit configured to propagate a first test vector through the first internal scan chain and a second test vector through the second internal scan chain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502、504、506、508:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1015" publication-number="202618746">
    <tif-files tif-type="multi-tif">
      <tif file="114109249.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示驅動器的控制方法</chinese-title>
        <english-title>CONTROL METHOD OF DISPLAY DRIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250319B">G09G3/32</main-classification>
        <further-classification edition="202001120250319B">H05B45/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊旋聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HSUAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯景文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱育仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅啓銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示驅動器的控制方法包含以下運作：輸出一第一控制訊號至一第一開關，其中第一開關耦接至一顯示面板的一第一子像素；輸出一第二控制訊號至一第二開關，其中第二開關耦接至顯示面板的一第二子像素；以及依據一資料輸出致能訊號輸出顯示面板的一驅動電壓。資料輸出致能訊號具有複數脈衝，且該些脈衝中的一第一脈衝與該些脈衝中的一第二脈衝之間的一第一時間區間短於該些脈衝中的第二脈衝與該些脈衝中的一第三脈衝之間的一第二時間區間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method of a display driver includes following operations: outputting a first control signal to a first switch coupled to a first sub-pixel of a display panel; outputting a second control signal to a second switch coupled to a second sub-pixel of the display panel; and outputting a driving voltage of display data according to a data output enable signal. The data output enable signal has a plurality of pulses, and a first time interval between a first pulse of the plurality of pulses and a second pulse of the plurality of pulses is shorter than a second time interval between the second pulse of the plurality of pulses and a third pulse of the plurality of pulses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:顯示驅動器</p>
        <p type="p">111:源極驅動器</p>
        <p type="p">112:閘極驅動器</p>
        <p type="p">120:多工電路</p>
        <p type="p">130:顯示面板</p>
        <p type="p">SP:子像素</p>
        <p type="p">V_DOUT:驅動電壓</p>
        <p type="p">G(N):閘極線訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1016" publication-number="202618396">
    <tif-files tif-type="multi-tif">
      <tif file="114109276.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧眼鏡與智慧眼鏡的製作方法</chinese-title>
        <english-title>SMART GLASSES AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02B27/01</main-classification>
        <further-classification edition="200601120260123B">G02C11/00</further-classification>
        <further-classification edition="200601120260123B">H04R1/08</further-classification>
        <further-classification edition="200601120260123B">H04R1/02</further-classification>
        <further-classification edition="200601120260123B">H04R1/04</further-classification>
        <further-classification edition="200601120260123B">H04R1/10</further-classification>
        <further-classification edition="200601120260123B">H04R1/32</further-classification>
        <further-classification edition="202301120260123B">H04N23/57</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張誌銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, JHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHUN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧眼鏡與智慧眼鏡的製作方法。智慧眼鏡包括一鏡框、一主機板以及一指向性麥克風模組。鏡框包括一本體與兩個鏡腳。本體具有一第一開孔。主機板設置於其中一個鏡腳內。指向性麥克風模組埋設於本體內且與本體彼此緊密結合。指向性麥克風模組電連接主機板且具有一第一收音孔。第一收音孔連通第一開孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart glasses and a manufacturing method thereof are provided. The smart glasses include a frame, a motherboard and a directional microphone module. The frame includes a body and two temples. The body has a first opening. The motherboard is installed in one of the temples. The directional microphone module is embedded in the body and is closely integrated with the body. The directional microphone module is electrically connected to the motherboard and has a first sound receiving hole. The first sound receiving hole is communicated with the first opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112A:第一開孔</p>
        <p type="p">112B:第一件</p>
        <p type="p">112C:第二件</p>
        <p type="p">112D:第二開孔</p>
        <p type="p">130:指向性麥克風模組</p>
        <p type="p">140:鏡頭</p>
        <p type="p">180:鏡片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1017" publication-number="202617349">
    <tif-files tif-type="multi-tif">
      <tif file="114109524.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磨邊機及磨邊機的研磨校正方法</chinese-title>
        <english-title>EDGE GRINDING MACHINE AND GRINDING ADJUSTING METHOD OF EDGE GRINDING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250630B">B24B49/04</main-classification>
        <further-classification edition="200601120250630B">B24B49/12</further-classification>
        <further-classification edition="200601120250630B">B24B9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡全益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LING, CHIH-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林祺峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正鍇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磨邊機的研磨校正方法，其中磨邊機包括托載片材的研磨載台、砂輪及影像感測模組。研磨校正方法包括：藉由影像感測模組擷取感測影像，並偵測感測影像中的片材部及砂輪部；計算片材部的第一值並計算砂輪部的第二值；根據第一值及第二值計算調整值；以及使用調整值來校正砂輪的高度或研磨載台的高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A grinding adjusting method of an edge grinding machine, wherein the edge grinding machine includes a grinding carrier placing a sheet material, a grinding wheel, and an image sensing module. The grinding adjusting method includes capturing a sensing image by the image sensing module and detecting a sheet-material part and a grinding-wheel part of the sensing image; computing a first value of the sheet-material part and a second value of the grinding-wheel part; computing an adjusting value according to the first value and the second value; and adjusting a height of the grinding wheel or a height of the grinding carrier by using the adjusting value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1018" publication-number="202617526">
    <tif-files tif-type="multi-tif">
      <tif file="114109533.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>捆束裝置以及捆束系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B65B13/28</main-classification>
        <further-classification edition="200601120260131B">E04G21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美克司股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笠原章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASAHARA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田口洋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODAGUCHI, YOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新藤茂輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDO, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">捆束裝置(100)係，包括藉由線材捆束複數個鋼筋的鋼筋捆束機(100)，收容兩個捲軸(20)的捲軸收容部(200)，以及將線材從捲軸(20)拉出、在鋼筋捆束機(1)與捲軸(20)之間的線材形成鬆弛的鬆弛形成部(2)。鋼筋捆束機(1)與已被收容於捲軸收容部(200)的複數個捲軸(20)的相對位移係被限制，鋼筋捆束機(1)與捲軸收容部(200)與鬆弛形成部(2)係被構成為可一體移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鋼筋捆束機(捆束機)</p>
        <p type="p">2:鬆弛形成部</p>
        <p type="p">5:捲曲形成部</p>
        <p type="p">10:本體部</p>
        <p type="p">10L:虛擬直線</p>
        <p type="p">20:捲軸</p>
        <p type="p">20(1):第一捲軸</p>
        <p type="p">21:第一鬆弛形成部(鬆弛形成機構部)</p>
        <p type="p">21a:第一鬆弛形成輥(線材拉出構件)</p>
        <p type="p">21b:導引板</p>
        <p type="p">21c,21d:導引構件</p>
        <p type="p">21g:軸</p>
        <p type="p">21i:第一導引部</p>
        <p type="p">22:第二鬆弛形成部(鬆弛形成機構部)</p>
        <p type="p">22a:第二鬆弛形成輥(線材拉出構件)</p>
        <p type="p">22b:導引板</p>
        <p type="p">22c,22d:導引構件</p>
        <p type="p">22g:軸</p>
        <p type="p">22i:第二導引部</p>
        <p type="p">23:第一導引部(第一路徑變更部)</p>
        <p type="p">24:第二導引部(第二路徑變更部)</p>
        <p type="p">25:驅動部</p>
        <p type="p">25a,25b:滑輪</p>
        <p type="p">25c:皮帶</p>
        <p type="p">25d:馬達</p>
        <p type="p">25e:第一連結部</p>
        <p type="p">25f:第二連結部</p>
        <p type="p">26:導引部(線材支撐部)</p>
        <p type="p">40:插入口</p>
        <p type="p">50:捲曲導引件</p>
        <p type="p">51:誘導導引件</p>
        <p type="p">100:捆束裝置</p>
        <p type="p">101:捆束機支撐部</p>
        <p type="p">102:收容部支撐部</p>
        <p type="p">103:鬆弛形成部支撐部</p>
        <p type="p">104:支撐部</p>
        <p type="p">105:安裝部</p>
        <p type="p">200:捲軸收容部</p>
        <p type="p">300:機器臂(移動體)</p>
        <p type="p">W:線材</p>
        <p type="p">WL:進給路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1019" publication-number="202619213">
    <tif-files tif-type="multi-tif">
      <tif file="114109672.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體絕緣開閉裝置</chinese-title>
        <english-title>GAS-INSULATED SWITCHGEAR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">H02B13/035</main-classification>
        <further-classification edition="200601120250402B">H01H33/66</further-classification>
        <further-classification edition="200601120250402B">H02B13/045</further-classification>
        <further-classification edition="200601120250402B">H01H33/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森隆広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永敏宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河西克紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANISHI, KATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西園寺嶺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAIONJI, REI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種經小型化的氣體絕緣開閉裝置(50)。氣體絕緣開閉裝置(50)具備有：容器(20)，係充填有絕緣氣體；真空遮斷器(13)，係收容於容器(20)，具有固定電極(30)及可動電極(31)；第一構件(4)，係以圍繞用來使可動電極(31)可動的可動部(33, 34, 6)之方式配置；以及第二構件(3)，係以圍繞可動部(33, 34, 6)之方式與第一構件(4)連結而配置，第二構件(3)在作為與第一構件(4) 接合的接合部(29)之凹部(17)的內側側面形成有第一螺紋部(14a)，第一構件(4)在往凹部(17)側突出而形成的凸形狀(18)的外周側面形成有第二螺紋部(14b)，第一構件(4)與第二構件(3)藉由第一螺紋部(14a)與第二螺紋部(14b)相螺合而相固接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a miniaturized gas-insulated switchgear (50). The gas-insulated switchgear (50) includes a container (20) filled with insulating gas; a vacuum circuit breaker (13) housed in the container (20) and having a fixed electrode (30) and a movable electrode (31); a first member (4) arranged to surround a movable part (33, 34, 6) for moving the movable electrode (31); and a second member (3) connected to the first member (4) so as to surround the movable part (33, 34, 6). The second member (3) has a first threaded portion (14a) formed on an inner side surface of a recess (17) which serves as a joint (29) with the first member (4), and the first member (4) has a second threaded portion (14b) formed on an outer peripheral side surface of a convex shape (18) formed to protrude toward the recess (17) side. The first member (4) and the second member (3) are fastened together by screwing together the first threaded portion (14a) and the second threaded portion (14b).</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:低壓力氣體隔間</p>
        <p type="p">3:間隔壁部件</p>
        <p type="p">4:間隔壁部件</p>
        <p type="p">5:礙子</p>
        <p type="p">6:可動軸</p>
        <p type="p">7:氣體密封溝槽</p>
        <p type="p">8:氣體密封溝槽</p>
        <p type="p">9:氣體密封溝槽</p>
        <p type="p">10:固接部</p>
        <p type="p">11:固接部</p>
        <p type="p">12:固接部</p>
        <p type="p">13:真空斷路器</p>
        <p type="p">14a:第一螺紋部</p>
        <p type="p">14b:第二螺紋部</p>
        <p type="p">15:波紋管</p>
        <p type="p">16:通電接觸部</p>
        <p type="p">21:壓力容器凸緣</p>
        <p type="p">23:低壓力氣體隔間凸緣</p>
        <p type="p">25:主迴路導體</p>
        <p type="p">26:主迴路導體</p>
        <p type="p">27:礙子</p>
        <p type="p">28:固定側導體</p>
        <p type="p">29:接合部</p>
        <p type="p">30:固定電極</p>
        <p type="p">31:可動電極</p>
        <p type="p">32:固定軸</p>
        <p type="p">33:可動側導體</p>
        <p type="p">34:可動側導體</p>
        <p type="p">35a:連接部件</p>
        <p type="p">35b:插銷</p>
        <p type="p">36:軸桿</p>
        <p type="p">40:真空區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1020" publication-number="202619093">
    <tif-files tif-type="multi-tif">
      <tif file="114109768.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構、半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES, SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H01L23/48</main-classification>
        <further-classification edition="200601120250801B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王茂南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MAO-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊芷欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳於貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-BEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施養鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YANG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王良瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昀昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在基板的第一側上形成第一互連結構。第一互連結構包括複數個第一互連層，嵌入在一第一介電結構中。第一互連層的一者包括落置墊，落置墊具有網狀結構。在基板的第二側上形成第二互連結構，第二側相對第一側。第二互連結構包括複數個第二互連層，嵌入在第二介電結構中。形成凹槽，凹槽延伸穿過第二介電結構和基板，且部分地穿過第一介電結構。凹槽暴露落置墊的至少一部分。藉由一或多種導電材料填充凹槽形成基板通孔(TSV)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first interconnect structure is formed over a first side of a substrate. The first interconnect structure includes a plurality of first interconnect layers embedded in a first dielectric structure. One of the first interconnect layers includes a landing pad that has a mesh structure. A second interconnect structure is formed over a second side of the substrate opposite the first side. The second interconnect structure includes a plurality of second interconnect layers embedded in a second dielectric structure. A recess is formed that extends through the second dielectric structure and the substrate and partially through the first dielectric structure. The recess exposes at least a portion of the landing pad. A through-substrate-via (TSV) is formed by filling the recess with one or more conductive materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">250:落置墊</p>
        <p type="p">400:TSV</p>
        <p type="p">250A:導電段</p>
        <p type="p">250B:導電段</p>
        <p type="p">250C:導電段</p>
        <p type="p">250D:導電段</p>
        <p type="p">250E:導電段</p>
        <p type="p">A-A’:線</p>
        <p type="p">M&lt;sub&gt;y&lt;/sub&gt;:互連層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1021" publication-number="202619106">
    <tif-files tif-type="multi-tif">
      <tif file="114109771.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其通訊方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND COMMUNICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L23/50</main-classification>
        <further-classification edition="200601120260128B">H04L1/24</further-classification>
        <further-classification edition="200601120260128B">H04L7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李胜高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHENGGAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於一或多個實施例中，半導體裝置包含處理電路及N個訊號路徑，相應於N個通訊通道。處理電路被配置為取得通道缺陷資訊，通道缺陷資訊指出N個通訊通道中之L個有缺陷之通道或N-L個有功能之通道；採用相應於具有M個橫列之N個資料單元之flit協定格式，與具有M+R個橫列之N-L個資料單元之flit重組格式之間之映射關係的重映射配置；以及取得flit協定格式中的目標flit，並基於flit重組格式，透過N-L個有功能之通道傳輸目標flit的資料單元；或基於flit重組格式，透過N-L個有功能之通道接收目標flit的資料單元，並取得flit協定格式中的目標flit。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one or more aspects, a semiconductor device includes a processing circuitry and N signal paths corresponding to N communication lanes provided. The processing circuitry is configured to obtain lane defect information indicating L defective lanes or (N-L) functional lanes among the N communication lanes; apply a remapping configuration corresponding to a mapping relationship between a flow control unit (flit) protocol format having M rows of N data units and a flit reassemble format having (M+R) rows of (N−L) data units; and obtain a target flit in the flit protocol format and transmit data units of the target flit through (N−L) functional lanes based on the flit reassemble format, or receive the data units of the target flit through the (N−L) functional lanes based on the flit reassemble format and obtain the target flit in the flit protocol format.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:通訊方法</p>
        <p type="p">810,820,832,834:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1022" publication-number="202617916">
    <tif-files tif-type="multi-tif">
      <tif file="114109773.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理劑、成膜基材之製造方法及成膜基材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C09K3/00</main-classification>
        <further-classification edition="200601120260130B">C23C26/00</further-classification>
        <further-classification edition="200601120260130B">B05D1/26</further-classification>
        <further-classification edition="200601120260130B">B05D3/10</further-classification>
        <further-classification edition="200601120260130B">B05D5/00</further-classification>
        <further-classification edition="200601120260130B">B05D7/00</further-classification>
        <further-classification edition="200601120260130B">B32B3/30</further-classification>
        <further-classification edition="200601120260130B">B32B15/08</further-classification>
        <further-classification edition="200601120260130B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＭＥＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEC COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大串亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGUSHI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種在將樹脂組成物之膜形成於基材表面上的情況，可使樹脂組成物與金屬表面及樹脂表面兩者之面的塗布性一同地充分提升的表面處理劑、成膜基材之製造方法及成膜基材。&lt;br/&gt;  本發明為一種用以處理包含金屬表面及樹脂表面的基材表面之表面處理劑等，係包含選自由烷基之碳數為19至24之烷基胺、烯基之碳數為18至22之烯基胺及其鹽所構成之群組之至少1種的胺化合物0.001質量%以上且1.2質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1023" publication-number="202619552">
    <tif-files tif-type="multi-tif">
      <tif file="114109813.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109813</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250923B">H10D64/27</main-classification>
        <further-classification edition="202501120250923B">H10D62/17</further-classification>
        <further-classification edition="202501120250923B">H10D62/13</further-classification>
        <further-classification edition="202501120250923B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹易叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHAN, YI-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王緯婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, KUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱熙甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, SHI-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構與其製造方法。半導體結構包括多個第一奈米結構沿著第一方向形成於基板上，以及多個第二奈米結構與第一奈米結構相鄰。半導體結構包括第一閘極結構沿著第二方向形成於第一奈米結構上，且第一閘極結構包括第一閘極介電層。半導體結構包括第二閘極結構形成於第二奈米結構上。半導體結構包括介電牆結構沿著第一方向位於第一閘極結構與第二閘極結構之間。介電牆結構具有頂部與底部，且底部比頂部寬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a plurality of first nanostructures formed over a substrate along a first direction, and a plurality of second nanostructures formed adjacent to the first nanostructures. The semiconductor structure includes a first gate structure formed on the first nanostructures along a second direction, and the first gate structure includes a first gate dielectric layer. The semiconductor structure includes a second gate structure formed on the second nanostructures. The semiconductor structure includes a dielectric wall structure between the first gate structure and the second gate structure along the first direction. The dielectric wall structure has a top portion and a bottom portion, and the bottom portion is wider than the top portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">B-B’:剖線</p>
        <p type="p">D1:第一距離</p>
        <p type="p">D2:第二距離</p>
        <p type="p">H1:第一高度</p>
        <p type="p">W3:第三寬度</p>
        <p type="p">W4:第四寬度</p>
        <p type="p">14:襯墊層</p>
        <p type="p">18:介電牆結構</p>
        <p type="p">100a:半導體結構</p>
        <p type="p">102:基板</p>
        <p type="p">104a:第一鰭狀結構</p>
        <p type="p">104b:第二鰭狀結構</p>
        <p type="p">105:基底鰭狀結構</p>
        <p type="p">108’:奈米結構</p>
        <p type="p">116:隔離結構</p>
        <p type="p">117:遮罩層</p>
        <p type="p">120:虛置閘極介電層</p>
        <p type="p">142a:第一閘極結構</p>
        <p type="p">142b:第二閘極結構</p>
        <p type="p">144:界面層</p>
        <p type="p">146:閘極介電層</p>
        <p type="p">148:閘極層</p>
        <p type="p">150:蝕刻停止層</p>
        <p type="p">152:介電層</p>
        <p type="p">168:閘極接點結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1024" publication-number="202618777">
    <tif-files tif-type="multi-tif">
      <tif file="114109938.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及其操作方法</chinese-title>
        <english-title>DEVICE AND OPERATION METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G11C11/417</main-classification>
        <further-classification edition="200601120251103B">G11C7/06</further-classification>
        <further-classification edition="200601120251103B">G11C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳佑海人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, YUMITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藪内誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABUUCHI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置，包含一記憶體陣列、多個感測放大器、多個追蹤電路及一追蹤電路啟動器。記憶體陣列包含儲存資料的多個位元單元、各自連接至對應列中的多個位元單元的多個字線及各自連接至對應行中的多個位元單元的多個位元線對。多個感測放大器各自響應於感測放大器啟用訊號而放大對應位元線對之間的電壓差。電壓差代表位元單元中儲存的位元。多個追蹤電路連接至多個感測放大器中的每一者。多個追蹤電路模仿記憶體陣列的行為且在啟動時產生感測放大器啟用訊號。追蹤電路啟動器根據預定義啟動協定來啟動多個追蹤電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a memory array, a plurality of sense amplifiers, a plurality of tracking circuits, and a tracking circuit activator. The memory array includes a plurality of bit cells that store data therein, a plurality of word lines each connected to the bit cells in a respective row, and a plurality of bit line pairs each connected to the bit cells in a respective column. Each sense amplifier amplifies a voltage difference between a respective bit line pair in response to a sense amplifier enable signal. The voltage difference represents a bit stored in a bit cell. The tracking circuits are connected to each of the sense amplifiers. Each tracking circuit mimics a behavior of the memory array and generates the sense amplifier enable signal when activated. The tracking circuit activator activates the tracking circuits according to a predefined activation protocol.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">110:記憶體陣列</p>
        <p type="p">120:字線驅動器</p>
        <p type="p">130:局部輸入/輸出(I/O)電路</p>
        <p type="p">140:局部控制電路</p>
        <p type="p">150:全域I/O電路</p>
        <p type="p">160:全域控制電路</p>
        <p type="p">170:追蹤電路</p>
        <p type="p">180:追蹤電路啟動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1025" publication-number="202617239">
    <tif-files tif-type="multi-tif">
      <tif file="114110071.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光玩具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">A63H33/22</main-classification>
        <further-classification edition="200601120251130B">A63H3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商多美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMY COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山﨑順子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, JUNKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤秋男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光玩具，具備複數個發光體、形成有複數個孔的模板、覆蓋前述模板之外表面的蓋體，前述複數個發光體，構成可個別地發光控制，來自已經發光之前述發光體的光，通過前述發光體所對應的前述孔照射於前述蓋體，在該蓋體的外表面形成可從外部目視的光圖案，在前述模板的內表面，一體地豎立設有隔牆，將對應於任意一個前述發光體的孔、與對應於其它前述發光體的孔之間予以劃分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:模板</p>
        <p type="p">16c:孔</p>
        <p type="p">18:蓋體</p>
        <p type="p">18a:突起</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1026" publication-number="202619030">
    <tif-files tif-type="multi-tif">
      <tif file="114110203.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">H01L21/768</main-classification>
        <further-classification edition="200601120250910B">H01L23/535</further-classification>
        <further-classification edition="202301120250910B">H10B12/00</further-classification>
        <further-classification edition="202301120250910B">H10B53/00</further-classification>
        <further-classification edition="202301120250910B">H10B61/00</further-classification>
        <further-classification edition="202301120250910B">H10B63/00</further-classification>
        <further-classification edition="202501120250910B">H10D30/60</further-classification>
        <further-classification edition="202501120250910B">H10D88/00</further-classification>
        <further-classification edition="200601120250910B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，其包括設置在基板之第一側上的第一電晶體。半導體裝置包括設置在第一側上的第一電晶體上方的第一互連結構。半導體裝置包括設置在基板的與第一側相對的第二側上的記憶體元件，其中記憶體元件包括至少一個電容器。半導體裝置包括延伸穿過基板並將記憶體元件電耦接至第一互連結構的通孔結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first transistor disposed on a first side of a substrate. The semiconductor device includes first interconnect structures disposed over the first transistor on the first side. The semiconductor device includes a memory element disposed on a second side of the substrate opposite to the first side, where the memory element includes at least a capacitor. The semiconductor device includes a via structure extending through the substrate and electrically coupling the memory element to the first interconnect structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:前側電晶體/FST</p>
        <p type="p">15:前側互連結構/FSL</p>
        <p type="p">20:後側互連結構/BSL</p>
        <p type="p">40:後側記憶體元件/BSM</p>
        <p type="p">42:IMD層</p>
        <p type="p">60:後側電晶體/BST</p>
        <p type="p">61:IMD層</p>
        <p type="p">100A:半導體裝置/裝置</p>
        <p type="p">102:基板</p>
        <p type="p">102B:後側</p>
        <p type="p">102F:前側</p>
        <p type="p">108:隔離結構</p>
        <p type="p">117:ILD層</p>
        <p type="p">140:IMD層</p>
        <p type="p">144:IMD層</p>
        <p type="p">120:IMD層</p>
        <p type="p">122:IMD層</p>
        <p type="p">140:IMD層</p>
        <p type="p">148:IMD層</p>
        <p type="p">152:IMD層</p>
        <p type="p">190:TSV</p>
        <p type="p">192:導電填充層</p>
        <p type="p">194:阻障層</p>
        <p type="p">BM0、BM1、BMX、BMX-1:金屬線</p>
        <p type="p">BSMC1:後側記憶體單元</p>
        <p type="p">BV0:通孔</p>
        <p type="p">BV1:通孔</p>
        <p type="p">BVX:通孔</p>
        <p type="p">M0:金屬線/導電特徵</p>
        <p type="p">M1:金屬線/導電特徵</p>
        <p type="p">S:源極</p>
        <p type="p">D:汲極</p>
        <p type="p">V0:通孔/導電特徵</p>
        <p type="p">V1:通孔/導電特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1027" publication-number="202618443">
    <tif-files tif-type="multi-tif">
      <tif file="114110412.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶有遮光膜的基板的製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING SUBSTRATE WITH LIGHT-SHIELDING FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G03F7/00</main-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/027</further-classification>
        <further-classification edition="200601120260202B">G03F7/032</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/09</further-classification>
        <further-classification edition="200601120260202B">G03F7/105</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="201501120260202B">G02B1/11</further-classification>
        <further-classification edition="201501120260202B">G02B1/111</further-classification>
        <further-classification edition="200601120260202B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大嶋寛之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOSHIMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種帶有遮光膜的基板的製造方法，其中，遮光膜的透明基板側的面以及其相反側的面這兩個面的反射率得到抑制。一種帶有遮光膜的基板的製造方法，包括：在透明基板上形成防反射層用樹脂組成物層的步驟；在其上形成含有遮光成分（D）、光聚合起始劑（E）及鹼可溶性樹脂（B）的遮光層用樹脂組成物層的步驟；以及對這些層一併實施曝光處理及顯影處理，並實施加熱硬化處理，從而形成包含防反射層及遮光層的遮光膜的步驟，防反射層用樹脂組成物層具備（1）～（3）。        &lt;br/&gt;（1）含有折射率為1.2～1.8、平均粒徑為10 nm以上且未滿125 nm的無機填料（A）以及鹼可溶性樹脂（B），且（A）在固體成分中的含量為10質量%～80質量%。        &lt;br/&gt;（2）平均厚度為0.01 μm～0.4 μm。        &lt;br/&gt;（3）將平均厚度設為1.2 μm的所述防反射層用樹脂組成物層在PGMEA中浸漬5秒鐘時的殘膜率為10%～90%。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1028" publication-number="202618624">
    <tif-files tif-type="multi-tif">
      <tif file="114110594.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種用於產生數位格式的法律條文之方法、裝置、電腦可讀取媒體、及電腦程式產品</chinese-title>
        <english-title>A METHOD, DEVICE, COMPUTER READABLE MEDIA, AND COMPUTER PROGRAM PRODUCT FOR GENERATING ARTICLES OF LAWS IN DIGITAL FORMATS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250602B">G06Q10/00</main-classification>
        <further-classification edition="201201120250602B">G06Q50/18</further-classification>
        <further-classification edition="202001120250602B">G06F40/30</further-classification>
        <further-classification edition="202001120250602B">G06F40/166</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂嘉雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIAHSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂嘉雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIAHSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">將法律的條文單體拆解成項款目單體，對項款目單體進行條項間處理及/或項內處理，以針對項款目單體分別產生項款目外觀控制子和語意輔助子，以改善讀者閱讀法律的體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Article bodies of laws would be divided into Paragraph-Subsection-Item (PSI) bodies, which would be intra Article-Paragraph (AP) processed and/or inter AP processed for generating PSI appearance codes and semanteme assistance codes such that experiences for reading laws are improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:資料獲取</p>
        <p type="p">104:資料拆解</p>
        <p type="p">106:資料處理</p>
        <p type="p">108:資料整併</p>
        <p type="p">110:資料寫入</p>
        <p type="p">1061:條項間處理</p>
        <p type="p">1063:條項內處理</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1029" publication-number="202618380">
    <tif-files tif-type="multi-tif">
      <tif file="114110601.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110601</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250731B">G02B11/34</main-classification>
        <further-classification edition="200601120250731B">G02B9/64</further-classification>
        <further-classification edition="202101120250731B">G02B7/02</further-classification>
        <further-classification edition="200601120250731B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統，包括具有折射力的第一透鏡、具有正的折射力的第二透鏡、具有負的折射力的第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡和第八透鏡，從物體側依序設置。第一透鏡與第二透鏡黏合在一起，其中光學成像系統滿足條件表達式0≤|f1/v1-f2/v2|＜3，其中f1是第一透鏡的焦距，v1是第一透鏡的阿貝數，f2是第二透鏡的焦距，且v2是第二透鏡的阿貝數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens having refractive power, a second lens having positive refractive power, a third lens having negative refractive power, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens, sequentially disposed from an object side. The first lens and the second lens are bonded together, wherein 0 ≤ |f1/v1-f2/v2| ＜ 3 is satisfied, where f1 is a focal length of the first lens, v1 is an Abbe number of the first lens, f2 is a focal length of the second lens, and v2 is an Abbe number of the second lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">F:濾光片</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1030" publication-number="202619353">
    <tif-files tif-type="multi-tif">
      <tif file="114110620.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機系統及其影像處理方法</chinese-title>
        <english-title>CAMERA SYSTEM AND IMAGE PROCESSING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250502B">H04N23/60</main-classification>
        <further-classification edition="202301120250502B">H04N23/71</further-classification>
        <further-classification edition="202301120250502B">H04N23/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊偉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEI CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種相機系統，包含相機及使用者裝置。相機包含影像感測器及影像前處理器。影像感測器產生原始影像，且影像前處理器主要包含色調映射電路、去馬賽克電路及色彩空間轉換電路。色調映射電路轉換原始影像之每個像素對應的原始灰階值為目標灰階值。當原始灰階值小於或等於黑階值時，目標灰階值為零。去馬賽克電路轉換具有目標灰階值的原始影像為RGB資料格式。色彩空間轉換電路轉換RGB資料格式為YUV資料格式。使用者裝置包含影像後處理器，用於對自相機接收的壓縮影像進行後處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera system includes a camera and a user’s device. The camera includes an image sensor and an image pre-processor. The image sensor generates a raw image, and the image pre-processor consists essentially of a tone mapping circuit, a demosaic circuit, and a color space conversion circuit. The tone mapping circuit converts a raw gray level value corresponding to each pixel in the raw image into a target gray level value. The target gray level value is zero when the raw gray level value is less than or equal to a black level value. The demosaic circuit converts the raw image with the target gray level value into a format of RGB data, and the color space conversion circuit converts the format of RGB data into a format of YUV data. The user’s device includes an image post-processor to perform post-processes on a compressed image received from the camera.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:相機系統</p>
        <p type="p">100a:相機</p>
        <p type="p">100b:雲端伺服器</p>
        <p type="p">100c:使用者裝置</p>
        <p type="p">110:影像感測器</p>
        <p type="p">111:像素</p>
        <p type="p">120:影像前處理器</p>
        <p type="p">121:色調映射電路</p>
        <p type="p">122:去馬賽克電路</p>
        <p type="p">123:色彩空間轉換電路</p>
        <p type="p">124:自動曝光電路</p>
        <p type="p">130:編碼器</p>
        <p type="p">140:記憶體</p>
        <p type="p">150:通訊模組</p>
        <p type="p">ES:曝光控制訊號</p>
        <p type="p">GS:增益控制訊號</p>
        <p type="p">I&lt;sub&gt;1&lt;/sub&gt;:第一影像</p>
        <p type="p">I&lt;sub&gt;raw&lt;/sub&gt;:原始影像</p>
        <p type="p">I&lt;sub&gt;t&lt;/sub&gt;:具有目標灰階值G&lt;sub&gt;t&lt;/sub&gt;的原始影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1031" publication-number="202617013">
    <tif-files tif-type="multi-tif">
      <tif file="114110700.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>米飯處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">A47J27/00</main-classification>
        <further-classification edition="200601120251130B">A47J43/00</further-classification>
        <further-classification edition="200601120251130B">A47J47/00</further-classification>
        <further-classification edition="201601120251130B">A23L7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鈴茂器工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木美奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MINAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種米飯處理裝置，係一邊將米飯沿著搬送路徑搬送一邊生成米飯糰塊，並且具備：投料部，係具有與前述搬送路徑連通之投料口；搬送部，係將投料到前述投料口之前述米飯沿著前述搬送路徑搬送；以及分割成形部，係將前述搬送部所搬送的前述米飯分割並進行成形，藉此生成前述米飯糰塊；前述搬送部係具有：滾筒，係設置成上下兩段，並且藉由旋轉動作搬送前述米飯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體部</p>
        <p type="p">11:側表面部</p>
        <p type="p">12:後表面部</p>
        <p type="p">16:電源切換部</p>
        <p type="p">17:操作部</p>
        <p type="p">18:控制部</p>
        <p type="p">20:收容部</p>
        <p type="p">30:投料部</p>
        <p type="p">31:導入部</p>
        <p type="p">31b:第二導入部</p>
        <p type="p">32:貯留部</p>
        <p type="p">40:隔壁部</p>
        <p type="p">50:搬送部</p>
        <p type="p">51:滾筒</p>
        <p type="p">51a:第一滾筒</p>
        <p type="p">51b:第二滾筒</p>
        <p type="p">70:分割成形部</p>
        <p type="p">71:可動部</p>
        <p type="p">80:滑動台</p>
        <p type="p">100:米飯處理裝置</p>
        <p type="p">X:左右方向</p>
        <p type="p">X1:右方</p>
        <p type="p">X2:左方</p>
        <p type="p">Y:前後方向</p>
        <p type="p">Y1:前方</p>
        <p type="p">Y2:後方</p>
        <p type="p">Z:上下方向</p>
        <p type="p">Z1:上方</p>
        <p type="p">Z2:下方</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1032" publication-number="202616962">
    <tif-files tif-type="multi-tif">
      <tif file="114110741.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>米飯處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251201B">A23L7/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鈴茂器工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木美奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MINAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中沢和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">米飯處理裝置係一邊搬送米飯一邊生成米飯糰塊，並且具備：收容部，係具有用以收容前述米飯之收容空間；投料部，係形成於前述收容部的前方，並且使前述米飯朝向下方落下；搬送部，係設置於前述投料部的前述下方，並且具有將已從前述投料部落下之前述米飯更進一步地朝向前述下方搬送之複數個滾筒；以及隔壁部，係設置於前述收容部與前述投料部之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體部</p>
        <p type="p">11:側表面部</p>
        <p type="p">12:後表面部</p>
        <p type="p">18:控制部</p>
        <p type="p">20:收容部</p>
        <p type="p">30:投料部</p>
        <p type="p">31b:第二導入部</p>
        <p type="p">32:貯留部</p>
        <p type="p">40:隔壁部</p>
        <p type="p">50:搬送部</p>
        <p type="p">60:蓋構件</p>
        <p type="p">61:第一蓋構件</p>
        <p type="p">70:分割成形部</p>
        <p type="p">71:可動部</p>
        <p type="p">80:滑動台</p>
        <p type="p">90:加熱部</p>
        <p type="p">91:收容加熱面</p>
        <p type="p">92:搬送加熱面</p>
        <p type="p">100:米飯處理裝置</p>
        <p type="p">X:左右方向</p>
        <p type="p">X1:右方</p>
        <p type="p">X2:左方</p>
        <p type="p">Y:前後方向</p>
        <p type="p">Y1:前方</p>
        <p type="p">Y2:後方</p>
        <p type="p">Z:上下方向</p>
        <p type="p">Z1:上方</p>
        <p type="p">Z2:下方</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1033" publication-number="202619504">
    <tif-files tif-type="multi-tif">
      <tif file="114110756.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110756</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有厚度不均勻的氣隙保護結構之半導體元件及其製備方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING AIR GAP PROTECTION STRUCTURE WITH UNEVEN THICKNESS AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">H10B99/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體元件及其製備方法。該半導體元件包括一基板、一位元線、一導電層、一著陸墊、以及一氣隙保護結構。該基板包括複數個襯墊，設置於該基板中一溝槽的側表面上。該位元線設置於該基板上。該隔離間隔物設置於該位元線的一側壁上。該隔離間隔物包括一氣隙。該導電層設置於該基板之上且靠近該隔離間隔物。該著陸墊設置於該位元線之上。該氣隙保護結構覆蓋該著陸墊和該氣隙。該氣隙保護結構包括位於該著陸墊的一頂表面上方的一較高部分和位於該較高部分下方的一較低部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and a method for manufacturing the same are provided. The semiconductor device comprises a substrate, a bit line, an isolation spacer, a conductive layer, a landing pad, and an air gap protection structure. The substrate comprises a plurality of liners disposed on side surfaces of a trench in the substrate. The bit line is disposed on the substrate. The isolation spacer is disposed on a sidewall of the bit line. The isolation spacer includes an air gap. The conductive layer is disposed over the substrate and next to the isolation spacer. The landing pad is disposed over the bit line. The air gap protection structure covers the landing pad and the air gap. The air gap protection structure comprises an upper portion above a top surface of the landing pad and a lower portion below the upper portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體元件</p>
        <p type="p">110:基板</p>
        <p type="p">112:隔離結構</p>
        <p type="p">114:介電層</p>
        <p type="p">116:位元線接觸</p>
        <p type="p">118:位元線堆疊</p>
        <p type="p">120:位元線</p>
        <p type="p">120s1:側壁</p>
        <p type="p">120s2:側壁</p>
        <p type="p">122:介電層</p>
        <p type="p">130-1:隔離間隔物</p>
        <p type="p">130-2:隔離間隔物</p>
        <p type="p">130s1:側壁</p>
        <p type="p">130s2:側壁</p>
        <p type="p">132-1:介電層</p>
        <p type="p">132-2:介電層</p>
        <p type="p">134-1:氣隙</p>
        <p type="p">134-2:氣隙</p>
        <p type="p">136-1:介電層</p>
        <p type="p">136s1:側壁</p>
        <p type="p">136-2:介電層</p>
        <p type="p">136s2:側壁</p>
        <p type="p">140:電容器接觸</p>
        <p type="p">140TS:頂表面</p>
        <p type="p">142:堆疊導電結構</p>
        <p type="p">144:襯墊</p>
        <p type="p">146:著陸墊</p>
        <p type="p">146s1:表面</p>
        <p type="p">146s2:表面</p>
        <p type="p">148:氣隙保護結構</p>
        <p type="p">148s1:表面</p>
        <p type="p">148s2:表面</p>
        <p type="p">148p1:較低部分</p>
        <p type="p">148p2:較高部分</p>
        <p type="p">R:區域</p>
        <p type="p">H1:孔</p>
        <p type="p">L1:寬度</p>
        <p type="p">L2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1034" publication-number="202619550">
    <tif-files tif-type="multi-tif">
      <tif file="114110959.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高壓靜電放電裝置</chinese-title>
        <english-title>HIGH-VOLTAGE ELECTROSTATIC DISCHARGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D64/00</main-classification>
        <further-classification edition="202501120260123B">H10D8/00</further-classification>
        <further-classification edition="202501120260123B">H10D8/01</further-classification>
        <further-classification edition="202501120260123B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商格芯（新加坡）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALFOUNDRIES SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案涉及一種半導體結構，更具體地，涉及一種高壓靜電放電裝置及其製造方法。所述結構包括：一半導體材料包括一射極區、一基區和一集電極區；一熱生長隔離區設置於該半導體材料上，其延伸覆蓋該基區和該集電極區的接面；所述熱生長隔離區上的第一場板，該第一場板電連接到該射極區；以及熱生長隔離區上的第二場板，該第二場板電連接到該集電極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to semiconductor structures and, more particularly, to high-voltage electrostatic discharge devices and methods of manufacture. The structure includes: a semiconductor material comprising an emitter region, a base region, and a collector region; a thermally grown insulator region on the semiconductor material which extends over a junction of the base region and the collector region; a first field plate on the thermally grown insulator region, the first field plate being electrically connected to the emitter region; and a second field plate on the thermally grown insulator region, the second field plate being electrically connected to the collector region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:高壓靜電放電(HV-ESD)裝置</p>
        <p type="p">12:場板</p>
        <p type="p">12a:場板</p>
        <p type="p">14:射極區</p>
        <p type="p">15:基區</p>
        <p type="p">16:集電極區/熱生長氧化物</p>
        <p type="p">18:熱生長氧化物</p>
        <p type="p">20:n型摻雜區/漂移區/N井</p>
        <p type="p">22:n型摻雜區/N漂移區/N井</p>
        <p type="p">24:半導體基板</p>
        <p type="p">26:埋入式隔離結構/埋入式P+半導體層/p型摻雜區</p>
        <p type="p">28:半導體材料</p>
        <p type="p">30:p型摻雜區/深p型摻雜區</p>
        <p type="p">32:p型摻雜區/p井</p>
        <p type="p">34:p型摻雜區/P+接點</p>
        <p type="p">36:p型摻雜區/P+接點</p>
        <p type="p">38:佈線結構</p>
        <p type="p">40:佈線結構</p>
        <p type="p">42:淺溝槽隔離結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1035" publication-number="202618150">
    <tif-files tif-type="multi-tif">
      <tif file="114111051.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111051</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行星滾柱螺桿</chinese-title>
        <english-title>PLANETARY ROLLER SCREW</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250607B">F16H25/22</main-classification>
        <further-classification edition="200601120250607B">F16H25/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詮豐精密工具股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUAN HONG PRECISION TOOL MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳叁貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SAN-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種行星滾柱螺桿，用以解決習知行星滾柱螺桿構造強度不足的問題。係包含：主螺桿具有第一外螺紋，螺母具有一內螺紋，及行星組具有數個滾柱，且各滾柱具有第二外螺紋；第一外螺紋與內螺紋的螺旋方向相反，內螺紋與第二外螺紋的螺旋方向相同；基於被動件之間的節圓直徑的比值與螺旋線數的比值相同，螺母的螺旋線數不等於主螺桿的螺旋線數加上二個滾柱的螺旋線數；當轉動主動件時，主動件對各被動件在軸向方向產生相對位移，且被動件之間在軸向方向未產生相對位移。本發明可以維持運動精度並提升構造強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A planetary roller screw is adapted for solving the insufficient structural strength in conventional planetary roller screw. The invention includes a main screw with a first external thread, a nut with an internal thread, and a planetary assembly with multiple rollers, each having a second external thread. The helical direction of the first external thread is opposite to that of the internal thread, while the internal thread and the second external thread have the same helical direction. Based on the equality between the pitch circle diameter ratio and the thread-starts count ratio among the passive components, and based on that the thread-starts count of the nut is not equal to the thread-starts count of the main screw plus twice the thread-starts count of the roller, when the driving component rotates, a relative displacement occurs between the driving component and each of the passive components in the axial direction, and no relative displacement occurs between the passive components in the axial direction. This invention achieves the effect on maintaining motion accuracy and concurrently enhancing structural strength.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主螺桿</p>
        <p type="p">11:第一外螺紋</p>
        <p type="p">11a:螺紋部頂端</p>
        <p type="p">11b:螺紋部底端</p>
        <p type="p">12:連接部</p>
        <p type="p">2:螺母</p>
        <p type="p">2a:螺母頂端</p>
        <p type="p">2b:螺母底端</p>
        <p type="p">20:通孔</p>
        <p type="p">21:內螺紋</p>
        <p type="p">3:行星組</p>
        <p type="p">31:滾柱</p>
        <p type="p">31a:滾柱頂端</p>
        <p type="p">31b:滾柱底端</p>
        <p type="p">311:第二外螺紋</p>
        <p type="p">312:凸出部</p>
        <p type="p">32:環架部</p>
        <p type="p">320:容置部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1036" publication-number="202617258">
    <tif-files tif-type="multi-tif">
      <tif file="114111095.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多組分混合氣體配製裝置及其使用方法</chinese-title>
        <english-title>MULTI-COMPONENT GAS MIXTURE FORMULATION APPARATUS AND METHOD FOR USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260202B">B01F23/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中船（邯鄲）派瑞特種氣體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA SHIP (HANDAN) PAI RUI SPECIAL GAS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙丙倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BINGQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝豪馳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, HAOCHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岳立平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUE, LIPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田偉雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, WEIXIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花瑩曦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, YINGXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種多組分混合氣體配製裝置，包括管道連接的抽真空管路、進氣管路、配氣管路、循環管路和充裝管路，所述抽真空管路包括第一真空管路和第二真空管路，所述進氣管路包括進氣總管線，所述進氣總管線上設置有依次連接的進氣分管線、配氣進氣總閥；所述配氣管路由第一並聯管路和第二並聯管路組成，所述循環管路包括依次連接的返回氣路管一、返回閥和返回氣路管二；所述充裝管路包括出氣總管線，所述出氣總管線上設置有依次連接的配氣出氣總閥、膜壓機、充裝閥和充裝容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a multi-component gas mixture formulation apparatus, including a vacuum pipeline, a gas inlet pipeline, a gas formulation pipeline, a circulation pipeline and a charging pipeline that are connected through pipes. The vacuum pipeline includes a first vacuum pipeline and a second vacuum pipeline, and the gas inlet pipeline includes a main gas inlet pipeline. A gas inlet branch pipeline and a main gas formulation inlet valve are provided on the main gas inlet pipeline and are connected in sequence. The gas formulation pipeline consists of a first parallel pipeline and a second parallel pipeline, and the circulation pipeline includes a first gas return pipeline, a return valve and a second gas return pipeline that are connected in sequence. The charging pipeline includes a main gas outlet pipeline. A main gas formulation outlet valve, a diaphragm compressor, a charging valve and a charging container are provided on the main gas outlet pipeline and are connected in sequence.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一真空管路</p>
        <p type="p">102:第二真空管路</p>
        <p type="p">103:第一閥門</p>
        <p type="p">104:第二閥門</p>
        <p type="p">201:進氣總管線</p>
        <p type="p">202:進氣分管線</p>
        <p type="p">2021:進氣分管線一</p>
        <p type="p">2022:進氣閥一</p>
        <p type="p">2023:進氣分管線二</p>
        <p type="p">2024:進氣閥二</p>
        <p type="p">203:第一壓力表</p>
        <p type="p">204:配氣進氣總閥</p>
        <p type="p">205:第一分析管路</p>
        <p type="p">2051:分析閥一</p>
        <p type="p">301:第一並聯管路</p>
        <p type="p">3011:儲罐</p>
        <p type="p">3012:第二壓力表</p>
        <p type="p">302:第二並聯管路</p>
        <p type="p">3021:配氣進氣分閥</p>
        <p type="p">3022:定值罐</p>
        <p type="p">3023:配氣出氣分閥</p>
        <p type="p">3024:稱量設備</p>
        <p type="p">3025:第三壓力表</p>
        <p type="p">401:返回氣路管一</p>
        <p type="p">402:返回閥</p>
        <p type="p">403:返回氣路管二</p>
        <p type="p">501:出氣總管線</p>
        <p type="p">502:配氣出氣總閥</p>
        <p type="p">503:膜壓機</p>
        <p type="p">504:充裝閥</p>
        <p type="p">505:充裝容器</p>
        <p type="p">506:第二分析管路</p>
        <p type="p">5061:分析閥二</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1037" publication-number="202616980">
    <tif-files tif-type="multi-tif">
      <tif file="114111244.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於容納和分配化妝品物質的系統和多用途分配系統</chinese-title>
        <english-title>SYSTEM AND MULTI-USE DISPENSING SYSTEM FOR CONTAINING AND DISPENSING COSMETIC SUBSTANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250529B">A45D34/00</main-classification>
        <further-classification edition="200601120250529B">B65D47/06</further-classification>
        <further-classification edition="202501120250529B">B65D83/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＬＣ管理有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELC MANAGEMENT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕楚箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUE, CHUZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳贇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於容納和分配化妝品物質的系統可以包括：容器，所述容器具有限定腔體的第一端和第二端，在所述容器的第一端具有噴口，位於所述噴口中的分配裝置以及安瓿。分配裝置可適於選擇性地通過所述分配裝置中的開口傾倒所述化妝品物質，並可拆卸地接收所述安瓿的噴嘴。至少一個槽可以形成在所述分配裝置的內壁中，將開口連接到所述分配裝置的流動腔體，限定用於從所述容器的所述腔體分配所述化妝品物質的流體通道。在從所述容器中引入化妝品物質之前，第二化妝品物質可以存在於所述安瓿的樣本容積中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for containing and dispensing a cosmetic substance may include a container with a first end and a second end defining a cavity, with an orifice at the first end of the container, a dispensing device situated in the orifice, and an ampoule. The dispensing device may be adapted to selectively pour a cosmetic substance through an opening in the dispensing device and to removably receive a nipple of the ampoule. At least one slot may be formed in an inner wall of the dispensing device, connecting an opening to a flow cavity of the dispensing device, defining a fluid pathway for the cosmetic substance to be dispensed from the cavity of the container. A second cosmetic substance may be present in a sample volume of the ampoule prior to the introduction of cosmetic substance from the container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:化妝品分配系統</p>
        <p type="p">101:容器</p>
        <p type="p">102:第一端</p>
        <p type="p">104:腔體</p>
        <p type="p">105:噴口</p>
        <p type="p">106:化妝品物質</p>
        <p type="p">110:分配裝置</p>
        <p type="p">114:開口</p>
        <p type="p">115:蓋耦合機構</p>
        <p type="p">119:槽</p>
        <p type="p">120:流體通道</p>
        <p type="p">122:汲取管耦合機構</p>
        <p type="p">123:管</p>
        <p type="p">125:汲取管</p>
        <p type="p">140:螺紋部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1038" publication-number="202616981">
    <tif-files tif-type="multi-tif">
      <tif file="114111245.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於分配化妝品物質的多用途分配裝置以及用於容納和分配化妝品物質的系統和多用途分配系統</chinese-title>
        <english-title>MULTI-USE DISPENSING DEVICE FOR DISPENSING COSMETIC SUBSTANCE, AND SYSTEM AND MULTI-USE DISPENSING SYSTEM FOR CONTAINING AND DISPENSING COSMETIC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250530B">A45D34/00</main-classification>
        <further-classification edition="200601120250530B">A45D33/02</further-classification>
        <further-classification edition="200601120250530B">A45D33/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＬＣ管理有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELC MANAGEMENT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕楚箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUE, CHUZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳贇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於容納和分配化妝品物質的系統可以包括容器，該容器具有限定腔體的第一端和第二端，在容器的第一端具有噴口。分配裝置可以覆蓋噴口的至少一部分。分配裝置可適於選擇性地通過分配裝置中的開口傾倒化妝品物質，並可拆卸地將分配機構容納在開口內，該分配機構引導化妝品物質流過開口。至少一個槽可以形成在分配裝置的內壁中，將開口連接到分配裝置的流動腔體，限定用於從容器的腔體分配化妝品物質的流體通道。分配機構可以包括噴嘴並接合分配裝置的一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for containing and dispensing a cosmetic substance may include a container with a first end and a second end defining a cavity, with an orifice at the first end of the container. A dispensing device may cover at least a portion of the orifice. The dispensing device may be adapted to selectively pour a cosmetic substance through an opening in the dispensing device and to removably receive a dispensing mechanism within the opening that induces flow of the cosmetic substance through the opening. At least one slot may be formed in an inner wall of the dispensing device, connecting an opening to a flow cavity of the dispensing device, defining a fluid pathway for the cosmetic substance to be dispensed from the cavity of the container. A dispensing mechanism may include a nozzle and engage a portion of the dispensing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:容器</p>
        <p type="p">102:第一端</p>
        <p type="p">104:腔體</p>
        <p type="p">105:噴口</p>
        <p type="p">106:化妝品物質</p>
        <p type="p">110:分配裝置</p>
        <p type="p">114:開口</p>
        <p type="p">115:蓋耦合機構</p>
        <p type="p">119:槽</p>
        <p type="p">120:流體通道</p>
        <p type="p">122:汲取管耦合機構</p>
        <p type="p">123:管</p>
        <p type="p">125:汲取管</p>
        <p type="p">140:螺紋部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1039" publication-number="202618274">
    <tif-files tif-type="multi-tif">
      <tif file="114111275.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表徵流體組合物的流變學性能的方法</chinese-title>
        <english-title>METHOD FOR CHARACTERIZING RHEOLOGICAL PROPERTIES OF FLUID COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">G01N33/00</main-classification>
        <further-classification edition="200601120250704B">G01N1/28</further-classification>
        <further-classification edition="200601120250704B">G01N11/00</further-classification>
        <further-classification edition="200601120250704B">G06F17/10</further-classification>
        <further-classification edition="200601120250704B">G06T11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＬＣ管理有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELC MANAGEMENT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉立輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, LIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫岳魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YUEKUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佳平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裘雯梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, WENMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及流變學技術領域，具體公開了一種表徵流體組合物的流變學性能的方法，該方法包括：在預定的剪切條件下對所述流體組合物進行預處理，所述剪切條件包括M維可控變數，所述M為大於等於2的整數；對於剪切後的流體組合物，在預定測試條件下進行流變測試以獲取流變指標資料；獲取至少四個流變指標資料形成的M維資料矩陣來表徵所述流體組合物的流變學性能；其中，每個流變指標資料對應一個剪切條件，所述M維資料矩陣中的一維N個資料對應N個不同的剪切條件，所述N個不同剪切條件由其中一維可控變數的N個不同變數值和其他維度可控變數各自的一個變數值組合形成。該技術方案可以表徵該流體組合物中的微小差異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to the field of rheological technology and specifically discloses a method for characterizing rheological properties of a fluid composition. The method includes: preconditioning the fluid composition under predetermined shear conditions, the shear conditions including M-dimensional controllable variables, where M is an integer greater than or equal to 2; performing a rheological test on the sheared fluid composition under predetermined testing conditions to obtain characteristic rheological parameters; obtaining an M-dimensional data matrix formed by at least four pieces of characteristic rheological parameters to characterize rheological properties of the fluid composition; wherein each piece of the characteristic rheological parameters corresponds to one shear condition, one dimension of N pieces of data in the M-dimensional data matrix correspond to N different shear conditions, and the N different shear conditions are formed by combining N different variable values of a controllable variable in one of the dimensions with respective one variable value of each of controllable variables in other dimensions. This technical solution can characterize small differences in the fluid composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S102,S103:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1040" publication-number="202619119">
    <tif-files tif-type="multi-tif">
      <tif file="114111553.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250428B">H01L23/538</main-classification>
        <further-classification edition="200601120250428B">H01L23/48</further-classification>
        <further-classification edition="200601120250428B">H01L23/64</further-classification>
        <further-classification edition="200601120250428B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CXMT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林廉恭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIEN-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TZUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王春陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUNYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開實施例涉及半導體領域，提供了一種半導體結構及其製備方法，包括： 襯底，包括器件層、埋入式電源軌及矽通孔，矽通孔通過埋入式電源軌與器件層連接；電源網路層，設置於襯底上，電源網路層包括至少一層第一電源陣列和至少一層第二電源陣列，第一電源陣列通過矽通孔與埋入式電源軌連接；電容結構，設置於第一電源陣列和第二電源陣列之間，並通過電容結構的下電極和上電極分別與第一電源陣列和第二電源陣列連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:襯底</p>
        <p type="p">102:矽通孔</p>
        <p type="p">103:器件層</p>
        <p type="p">104:電源網路層</p>
        <p type="p">1041:第一電源陣列</p>
        <p type="p">1042:第二電源陣列</p>
        <p type="p">105:隔離層</p>
        <p type="p">106:絕緣層</p>
        <p type="p">1061:第一阻隔層</p>
        <p type="p">1062:第一絕緣層</p>
        <p type="p">1063:第二阻隔層</p>
        <p type="p">1064:第二絕緣層</p>
        <p type="p">108:電容結構</p>
        <p type="p">1081:下電極</p>
        <p type="p">1082:介電層</p>
        <p type="p">1083:阻擋層</p>
        <p type="p">1084:上電極</p>
        <p type="p">BPR:埋入式電源軌</p>
        <p type="p">CT:接觸插塞</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">SL:訊號互連層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1041" publication-number="202619294">
    <tif-files tif-type="multi-tif">
      <tif file="114111599.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路、半導體裝置的單元區域以及製造單元區域的方法</chinese-title>
        <english-title>CIRCUIT, CELL REGION OF SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING CELL REGION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H03K19/0948</main-classification>
        <further-classification edition="202501120250801B">H10D84/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　行超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, XING CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JOHNNY CHIAHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈺琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子葦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡永溱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, YUNG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　向東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIANGDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電路包括：第一及第二反相器，被配置成對應接收第一及第二針腳訊號，並產生第一及第二針腳訊號的反轉，第一及第二針腳訊號對應為電路的第一及第二輸入訊號；以及三態反相子電路，包括第一及第二資料電晶體以及睡眠電晶體，第一及第二資料電晶體的各自的控制端子耦接到具有第二針腳訊號的反轉的第一節點，睡眠電晶體的控制端子耦接到具有第一針腳訊號的反轉的第二節點，且第一及第二資料電晶體以及睡眠電晶體串聯地耦接在具有第一參考電壓的第三節點與具有非參考電壓（NRV）訊號的第四節點之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit includes: first and second inverters configured correspondingly to receive first and second pin-signals and to generate inversions of first and second pin-signals, the first and second pin-signals correspondingly being first and second input signals of the circuit; and a three-state inverting sub-circuit including first and second data transistors and a sleep transistor, a control terminal of each of the first and second data transistors being coupled to a first node having the inversion of the second pin-signal, a control terminal of the sleep transistor being coupled to a second node having the inversion the first pin-signal, and the first and second data transistors and the sleep transistor being coupled in series between a third node having a first reference voltage and a fourth node having a non-reference-voltage (NRV) signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">101:巨集區域</p>
        <p type="p">102:單元區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1042" publication-number="202617827">
    <tif-files tif-type="multi-tif">
      <tif file="114111833.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含不飽和基之聚合性樹脂、含不飽和基之聚合性樹脂之製造方法、感光性樹脂組成物、樹脂硬化膜、積層體、積層體之製造方法及積層體之處理方法</chinese-title>
        <english-title>UNSATURATED GROUP-CONTAINING POLYMERIZABLE RESIN, METHOD FOR PRODUCING UNSATURATED GROUP-CONTAINING POLYMERIZABLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PROCESSING LAYERED PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08G63/52</main-classification>
        <further-classification edition="200601120260126B">C08G63/676</further-classification>
        <further-classification edition="200601120260126B">C08G63/78</further-classification>
        <further-classification edition="200601120260126B">C08G65/26</further-classification>
        <further-classification edition="200601120260126B">G03F7/004</further-classification>
        <further-classification edition="200601120260126B">G03F7/022</further-classification>
        <further-classification edition="200601120260126B">G03F7/023</further-classification>
        <further-classification edition="200601120260126B">G03F7/20</further-classification>
        <further-classification edition="200601120260126B">B32B33/00</further-classification>
        <further-classification edition="200601120260126B">B32B7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渋谷佳佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUYA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供可適合利用於感光性樹脂組成物之材料的含不飽和基之聚合性樹脂，其可利用作為正型光阻，圖案形成性優異，可在不實施漂白步驟下形成具有高接著強度之硬化膜，於該硬化膜照射雷射時之剝離性優異。        &lt;br/&gt;本發明之解決手段為一種含不飽和基之聚合性樹脂，係含有下述通式(1)所示化合物。        &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="681px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(1)中，Ar各自獨立地為特定芳香族烴基，R        &lt;sub&gt;1&lt;/sub&gt;各自獨立地為碳數2以上4以下之伸烷基，l各自獨立地為0以上3以下之數，G各自獨立地為特定基等，W各自獨立地為特定基等，L為特定基，X各自獨立地為特定基等，Y為特定之4價羧酸殘基，n表示自然數。]      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to provide an unsaturated group-containing polymerizable resin that can be used as a positive resin, has excellent patterning properties, can form a cured film with great adhesive strength without performing a bleaching process, and can provide excellent peelability when the cured film is irradiated with a laser. The unsaturated group-containing polymerizable resin is suitable to be used as a material for a photosensitive resin composition.        &lt;br/&gt;Provided as a solution in the present invention is an unsaturated group-containing polymerizable resin containing a compound represented by the following general formula (1):        &lt;br/&gt;&lt;img align="absmiddle" height="175px" width="671px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[In formula (1), Ar is independently a specific aromatic hydrocarbon group; R        &lt;sub&gt;1&lt;/sub&gt;is independently an alkylene group having 2 to 4 carbon atoms; l is independently a number from 0 to 3; G is independently a specific group or the like; W is independently a specific group or the like; L is a specific group; X is independently a specific group or the like; Y is a specific tetravalent carboxylic acid residue; and n is a natural number.]      </p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1043" publication-number="202618768">
    <tif-files tif-type="multi-tif">
      <tif file="114111861.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶片及半導體封裝結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G11C7/10</main-classification>
        <further-classification edition="200601120250502B">G11C8/06</further-classification>
        <further-classification edition="200601120250502B">H01L23/525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CXMT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范天奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, TIANQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了半導體晶片及半導體封裝結構，涉及半導體技術領域。該半導體晶片包括：地址焊盤，地址焊盤沿垂直於半導體晶片的中軸線方向上分佈，且地址焊盤以半導體晶片的中軸線為中心線鏡像對稱；數據焊盤，數據焊盤沿垂直於半導體晶片的中軸線方向上分佈，且數據焊盤以半導體晶片的中軸線為中心線鏡像對稱；其中，互為鏡像對稱的地址焊盤之間還包括第一翻轉電路，第一翻轉電路被配置為可實現互為鏡像對稱的地址焊盤的訊號互換，互為鏡像對稱的數據焊盤之間還包括第二翻轉電路，第二翻轉電路被配置為可實現互為鏡像對稱的數據焊盤的訊號互換。根據本公開實施例，能夠提高半導體晶片的訊號品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體晶片</p>
        <p type="p">101:中軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1044" publication-number="202616979">
    <tif-files tif-type="multi-tif">
      <tif file="114111867.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於容納和分配化妝品物質的系統和使用方法</chinese-title>
        <english-title>SYSTEM AND METHOD OF USE FOR CONTAINING AND DISPENSING COSMETIC SUBSTANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250530B">A45D33/00</main-classification>
        <further-classification edition="200601120250530B">A45D33/02</further-classification>
        <further-classification edition="200601120250530B">A45D33/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＬＣ管理有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELC MANAGEMENT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕楚箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUE, CHUZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳贇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種用於容納和分配化妝品物質的系統，其特徵在於，所述系統包括：容器，其具有第一端和第二端，並限定適於接收化妝品物質的腔體，所述容器的第一端形成噴口；和分配裝置，其設置在所述容器的所述第一端或其附近，並適於覆蓋所述噴口的至少一部分；和安瓿，其被指定為自帶有負壓環境，其在使用時不需要通過按壓、變形、抽拉等其他人工方式來獲得負壓環境。本發明還公開了一種用於容納和分配化妝品物質的系統的使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a system for containing and dispensing a cosmetic substance. The system includes: a container having a first end and a second end, and defining a cavity adapted to receive the cosmetic substance, the first end of the container forming an orifice; and a dispensing device disposed at or near the first end of the container and adapted to cover at least a portion of the orifice; and an ampoule designated to have a built-in negative pressure environment, without requiring other manual methods such as pressing, deforming, pulling, etc. to obtain a negative pressure environment during use. The present invention further discloses a method of use for the system for containing and dispensing the cosmetic substance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:化妝品分配系統</p>
        <p type="p">101:容器</p>
        <p type="p">102:第一端</p>
        <p type="p">104:腔體</p>
        <p type="p">105:噴口</p>
        <p type="p">106:化妝品物質</p>
        <p type="p">110:分配裝置</p>
        <p type="p">114:開口</p>
        <p type="p">115:蓋耦合機構</p>
        <p type="p">119:槽</p>
        <p type="p">120:流體通道</p>
        <p type="p">122:汲取管耦合機構</p>
        <p type="p">123:管</p>
        <p type="p">125:汲取管</p>
        <p type="p">140:螺紋部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1045" publication-number="202619562">
    <tif-files tif-type="multi-tif">
      <tif file="114111912.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D84/83</main-classification>
        <further-classification edition="202501120251103B">H10D62/17</further-classification>
        <further-classification edition="202501120251103B">H10D64/01</further-classification>
        <further-classification edition="202501120251103B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王緯婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹易叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHAN, YI-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, KUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構及其製造方法，半導體結構包含基底；第一通道層及第二通道層。半導體結構更包含隔離結構，位於基底上方；及第一閘極結構，位於第一通道層及隔離結構上方。半導體結構更包含第二閘極結構，位於第二通道層及隔離結構上方；以及隔離部件，橫向夾設於第一閘極結構與第二閘極結構之間，且延伸於隔離結構上方。此外，隔離部件具有頂部寬度及比頂部寬度更大的底部寬度，且隔離部件與第一閘極結構之間的界面包含彎曲輪廓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor structures and method for fabricating the same are provided. The semiconductor structure includes a substrate and a first channel layer and a second channel layer. The semiconductor structure further includes an isolation structure over the substrate and a first gate structure over the first channel layer and the isolation structure. The semiconductor structure further includes a second gate structure over the second channel layer and the isolation structure and an isolation feature laterally sandwiched between the first gate structure and the second gate structure and extending over the isolation structure. In addition, the isolation feature has a top width and a bottom width that is greater than the top width, and an interface between the isolation feature and the first gate structure includes a curved profile.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一區</p>
        <p type="p">100:半導體結構</p>
        <p type="p">102:基底</p>
        <p type="p">104B:基座結構</p>
        <p type="p">108-1’,108-2’:通道層</p>
        <p type="p">108-1’T,108-2’T:最頂部通道層</p>
        <p type="p">108-1’M,108-2’M:中間通道層</p>
        <p type="p">108-1’B,108-2’B:最底部通道層</p>
        <p type="p">116:隔離結構</p>
        <p type="p">120:蓋層</p>
        <p type="p">122,202:介電層</p>
        <p type="p">123:延伸部</p>
        <p type="p">176-1”:隔離部件</p>
        <p type="p">178-1”:殼層</p>
        <p type="p">180-1”:核心材料</p>
        <p type="p">190,190-1,190-2:閘極結構</p>
        <p type="p">192:界面層</p>
        <p type="p">194:閘極介電層</p>
        <p type="p">196:閘極電極層</p>
        <p type="p">200:蝕刻停止層</p>
        <p type="p">204:接點</p>
        <p type="p">R:區域</p>
        <p type="p">D&lt;sub&gt;5&lt;/sub&gt;:距離</p>
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;,W&lt;sub&gt;2&lt;/sub&gt;:井區</p>
        <p type="p">W&lt;sub&gt;4&lt;/sub&gt;,W&lt;sub&gt;5&lt;/sub&gt;:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1046" publication-number="202619401">
    <tif-files tif-type="multi-tif">
      <tif file="114111921.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池式感應加熱器</chinese-title>
        <english-title>BATTERY INDUCTION WARMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05B6/04</main-classification>
        <further-classification edition="200601120260123B">H05B6/06</further-classification>
        <further-classification edition="200601120260123B">H05B6/12</further-classification>
        <further-classification edition="200601120260123B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安捷科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEF TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅漢清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, HAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉論善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LUN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電池式感應加熱器。電池式感應加熱器包含一殼體、一加熱模組、至少一個電池、及一控制模組。殼體具有一容置空間、及空間連通容置空間的一上開口及一安裝孔。加熱模組設置於殼體上。上開口被加熱模組覆蓋。至少一個電池穿經安裝孔可分離地設置於殼體內。至少一個電池位於容置空間內，且部分的至少一個電池通過安裝孔裸露至殼體的外側。控制模組設置於容置空間內，並能通過至少一個電池提供的電力控制加熱模組進行加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery induction warmer includes a housing body, a heating module, at least one battery, and a control module. The housing body has an accommodation space, and a top opening and a mounting hole that are in spatial communication with the accommodation space. The heating module is disposed on the housing body. The top opening is covered by the heating module. The at least one battery is detachably disposed in the housing body by passing through the mounting hole. The at least one battery is located in the accommodation space, and a portion of the at least one battery is exposed from an outer side of the housing body by the mounting hole. The control module is disposed in the accommodation space, and is configured to control the heating module to perform heating via power from the at least one battery.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池式感應加熱器</p>
        <p type="p">1:殼體</p>
        <p type="p">11:底板</p>
        <p type="p">12:側板</p>
        <p type="p">13:擋牆</p>
        <p type="p">14:通風區域</p>
        <p type="p">2:加熱模組</p>
        <p type="p">3:電池</p>
        <p type="p">31:凹槽</p>
        <p type="p">4:控制模組</p>
        <p type="p">5:限制結構</p>
        <p type="p">6:散熱片</p>
        <p type="p">7:風扇</p>
        <p type="p">A11:容置空間</p>
        <p type="p">A12:上開口</p>
        <p type="p">A13:安裝孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1047" publication-number="202617907">
    <tif-files tif-type="multi-tif">
      <tif file="114112334.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於改善經沉積之聚合物膜與基板之黏著力之表面聚合物</chinese-title>
        <english-title>SURFACE POLYMERS FOR IMPROVED ADHESION TO SUBSTRATES OF DEPOSITED POLYMER FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09J5/02</main-classification>
        <further-classification edition="200601120260202B">B32B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商易爾德工程系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利勒索魯普　米　布洛姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LILLETHORUP, MIE BLOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔斯費爾特　米克爾　斯科克耶爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONGSFELT, MIKKEL SKORKJAER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　炳成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAK, BYUNG SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格加德　阿斯格　霍爾姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGERGAARD, ASGER HOLM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼古拉森　雅各　帕格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKOLAJSEN, JAKOB PAGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於聚合物與裝飾有表面聚合物之基板之黏著力，及形成該黏著力之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to the adhesion of polymers to substrates decorated with surface polymers, and methods for forming the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130:基板</p>
        <p type="p">140:附著至基板之表面聚合物</p>
        <p type="p">170:透過表面聚合物黏附至基板之聚合物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1048" publication-number="202618008">
    <tif-files tif-type="multi-tif">
      <tif file="114112405.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製鐵廠的作業方法及製鐵廠</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250821B">C21B5/00</main-classification>
        <further-classification edition="200601120250821B">C21B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川二彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, TSUGUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[解決手段]一種製鐵廠的作業方法，其特徵在於：讓從製鐵廠的外部導入之外部乙烯、在製鐵廠的內部生成之自生成乙烯、在製鐵廠產生之副產品氣體、與利用製鐵廠的副產品氣體所發電之電力在製鐵廠內循環，並將以可再生能源或核能發電廠發電之電力供給至製鐵廠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高爐</p>
        <p type="p">2:預備還原爐</p>
        <p type="p">3:焦碳爐</p>
        <p type="p">4:轉爐</p>
        <p type="p">5:二氧化碳分離設備</p>
        <p type="p">6:鋼材加熱爐</p>
        <p type="p">7:發電設備</p>
        <p type="p">8:氫製造設備</p>
        <p type="p">9:乙烯合成設備</p>
        <p type="p">10:乙烯貯藏槽</p>
        <p type="p">11:外部乙烯製造設備</p>
        <p type="p">100:製鐵廠</p>
        <p type="p">A,B,C,D,E,F,G,H,I,J,K,L,M,N,O,P,Q,R,S,T,V:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1049" publication-number="202619031">
    <tif-files tif-type="multi-tif">
      <tif file="114112408.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112408</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置結構及其形成方法</chinese-title>
        <english-title>DEVICE STRUCTURE AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">H01L21/768</main-classification>
        <further-classification edition="200601120250902B">H01L21/60</further-classification>
        <further-classification edition="200601120250902B">H01L23/528</further-classification>
        <further-classification edition="200601120250902B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張任遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置結構可藉由以下步驟製造：在基板上方形成嵌入介電材料層中的金屬互連結構；在最頂部介電材料層上方形成主動金屬連接結構、主虛設金屬結構及微型虛設金屬結構，該最頂部介電材料層選自該些介電材料層，其中該些微型虛設金屬結構的高度小於該些主動金屬連接結構及該些主虛設金屬結構的高度；以及在該些主動金屬連接結構、該些主虛設金屬結構及該些微型虛設金屬結構上方形成焊墊，其中該些主動金屬連接結構及該些主虛設金屬結構藉由該些焊墊接觸，且該些微型虛設金屬結構不與任何焊墊接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device structure may be manufactured by forming metal interconnect structures embedded in dielectric material layers over a substrate; forming active metal connection structures, primary dummy metal structures, and miniature dummy metal structures over a topmost dielectric material layer selected from the dielectric material layers, wherein the miniature dummy metal structures have a lesser height than the active metal connection structures and the primary dummy metal structures; and forming bonding pads over the active metal connection structures, the primary dummy metal structures, and the miniature dummy metal structures, wherein the active metal connection structures and the primary dummy metal structures are contacted by the bonding pads, and the miniature dummy metal structures are not contacted by any of the bonding pads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">33T:最頂部介電材料層</p>
        <p type="p">330:介電材料層</p>
        <p type="p">340:金屬互連結構</p>
        <p type="p">362:主動金屬連接結構</p>
        <p type="p">362B:第一類型金屬種晶層</p>
        <p type="p">362M:第一類型電鍍材料部分</p>
        <p type="p">364:主虛設金屬結構</p>
        <p type="p">364B:第二類型金屬種晶層</p>
        <p type="p">364M:第二類型電鍍材料部分</p>
        <p type="p">366:微型虛設金屬結構</p>
        <p type="p">366B:第三類型金屬種晶層</p>
        <p type="p">366M:第三類型電鍍材料部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1050" publication-number="202617808">
    <tif-files tif-type="multi-tif">
      <tif file="114112571.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於馬來酸酐之聚合物、具有親水塗層的鏡片、用於鏡片的處理劑、以及用於鏡片的組成物</chinese-title>
        <english-title>MALEIC ANHYDRIDE-BASED POLYMER, LENS WITH HYDROPHILIC LAYER, PROCESSING AGENT FOR LENS, AND COMPOSITION FOR LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F220/28</main-classification>
        <further-classification edition="200601120260202B">C08F220/30</further-classification>
        <further-classification edition="200601120260202B">C08F222/06</further-classification>
        <further-classification edition="200601120260202B">C08F232/04</further-classification>
        <further-classification edition="200601120260202B">C08F8/32</further-classification>
        <further-classification edition="200601120260202B">C08L33/02</further-classification>
        <further-classification edition="200601120260202B">C08L33/14</further-classification>
        <further-classification edition="200601120260202B">C08L35/00</further-classification>
        <further-classification edition="200601120260202B">G02B1/04</further-classification>
        <further-classification edition="201501120260202B">G02B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>視陽光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISCO VISION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江慶學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHING-HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡浩倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HAO LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供基於馬來酸酐之聚合物、具有親水塗層的鏡片、用於鏡片的處理劑、以及用於鏡片的組成物。基於馬來酸酐之聚合物包含一個以上的由下式I所表示的第一重複單元、一個以上的由下式II所表示的第二重複單元、以及一個以上的由下式III所表示的第三重複單元。式II中的R        &lt;sub&gt;a&lt;/sub&gt;為H或C        &lt;sub&gt;1&lt;/sub&gt;-C        &lt;sub&gt;3&lt;/sub&gt;烷基，R        &lt;sub&gt;b&lt;/sub&gt;為H或C        &lt;sub&gt;1&lt;/sub&gt;-C        &lt;sub&gt;3&lt;/sub&gt;烷基或第一重複單元或第二重複單元或第三重複單元。        &lt;br/&gt;&lt;img align="absmiddle" height="368px" width="127px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="157px" width="153px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A maleic anhydride-based polymer, a lens with a hydrophilic layer, a processing agent for lens, and a composition for lens are provided. The maleic anhydride-based polymer includes one or more first repeating unit represented by the following formula I, one or more second repeating unit represented by the following formula II, and one or more third repeating unit represented by the following formula (III). In the formula II, R        &lt;sub&gt;a&lt;/sub&gt;is H or C        &lt;sub&gt;1&lt;/sub&gt;-C        &lt;sub&gt;3&lt;/sub&gt;alkyl group, and R        &lt;sub&gt;b&lt;/sub&gt;is H or C        &lt;sub&gt;1&lt;/sub&gt;-C        &lt;sub&gt;3&lt;/sub&gt;alkyl group or the first repeating unit or the second repeating unit or the third repeating unit.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鏡片本體</p>
        <p type="p">11:前表面</p>
        <p type="p">12:後表面</p>
        <p type="p">13:邊緣</p>
        <p type="p">20:親水塗層</p>
        <p type="p">20S1:第一側</p>
        <p type="p">20S2:第二側</p>
        <p type="p">100:鏡片</p>
        <p type="p">D1:法線方向</p>
        <p type="p">S:外表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1051" publication-number="202619316">
    <tif-files tif-type="multi-tif">
      <tif file="114112687.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於分時雙工無線收發器的可編程電感</chinese-title>
        <english-title>PROGRAMMABLE INDUCTOR FOR TIME DIVISION DUPLEXING RADIO TRANSCEIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">H04L5/22</main-classification>
        <further-classification edition="201501120250902B">H04B1/40</further-classification>
        <further-classification edition="200601120250902B">H03H7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　嘉亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">分時雙工無線收發器包括：一功率放大器，用以處理第一訊號並根據發射器致能訊號在第一節點輸出第二訊號；一低雜訊放大器，用以處理在第二節點的第三訊號並根據接收器致能訊號輸出第四訊號；一開關，用以根據發射器致能訊號將第二節點接地；連接至第一節點的一天線；以及一可編程電感，其包括：插入在第一節點與第二節點之間的一第一電感、插入在第二節點與第三節點之間並與第一電感強耦合的一第二電感，以及一個插入在第三節點與地之間的可編程電容，其電容值取決於該發射器致能訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A TDD (time-division duplexing) radio transceiver includes: a PA (power amplifier) that processes a first signal and delivers a second signal at a first node in accordance with a transmitter-enabling signal; an LNA (low-noise amplifier) that processes a third signal at a second node and delivers a fourth signal in accordance with a receiver-enabling signal; a first switch configured to shunt the second node to ground in accordance with the transmitter-enabling signal; an antenna attached to the first node; and a programmable inductor featuring a first inductor inserted between the first node and the second node, a second inductor that is inserted between the second node and a third node and strongly coupled to the first inductor, and a programmable capacitor used to shunt the third node to ground in accordance with the transmitter enabling signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:無線收發器</p>
        <p type="p">210:功率放大器</p>
        <p type="p">220:低雜訊放大器</p>
        <p type="p">230:天線</p>
        <p type="p">240R:提示框</p>
        <p type="p">240T:提示框</p>
        <p type="p">L1:第一電感</p>
        <p type="p">L1R:串聯電感</p>
        <p type="p">L1T:並聯電感</p>
        <p type="p">L2:第二電感</p>
        <p type="p">ND1:第一節點</p>
        <p type="p">ND2:第二節點</p>
        <p type="p">ND3:第三節點</p>
        <p type="p">PC1:可編程電容</p>
        <p type="p">PL1:可編程電感</p>
        <p type="p">PLC1:可編程LC網路</p>
        <p type="p">RXEN:接收器致能訊號</p>
        <p type="p">S1:第一開關</p>
        <p type="p">TXEN:發射器致能訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;:第一訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;2&lt;/sub&gt;:第二訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;3&lt;/sub&gt;:第三訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;4&lt;/sub&gt;:第四訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1052" publication-number="202618506">
    <tif-files tif-type="multi-tif">
      <tif file="114112774.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其輸入信號的取樣方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND SAMPLING METHOD FOR INPUT SIGNAL THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G06F1/04</main-classification>
        <further-classification edition="200601120250901B">G06F1/10</further-classification>
        <further-classification edition="201401120250901B">H03K5/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TSUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅敬銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">裝置包括第一時脈信號產生器、第二時脈信號產生器、輸入信號產生電路和輸入信號取樣電路。第一時脈信號產生器產生第一時脈信號。第二時脈信號產生器產生相對於第一時脈信號延遲的第二時脈信號。輸入信號產生電路包括電壓信號產生器和功能電路。電壓信號產生器產生電壓信號。功能電路接收電壓信號並執行一個或多個電路功能。輸入信號取樣電路在第二時脈信號的上升或下降邊緣取樣電壓信號的值並提供取樣值作為輸出信號，從而基於輸出信號分析電壓信號的一個或多個特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a first clock signal generator, a second clock signal generator, an input signal generating circuit, and an input signal sampling circuit. The first clock signal generator generates a first clock signal. The second clock signal generator generates a second clock signal delayed relative to the first clock signal. The input signal generating circuit includes a voltage signal generator and a functional circuit. The voltage signal generator generates a voltage signal. The functional circuit receives the voltage signal and performs one or more circuit functions. The input signal sampling circuit samples values of the voltage signal at rising or falling edges of the second clock signal and to provide the sampled values as an output signal, whereby one or more characteristics of the voltage signal are analyzed based on the output signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">110:時脈信號產生電路</p>
        <p type="p">120:輸入信號取樣器</p>
        <p type="p">130、140:信號產生器</p>
        <p type="p">150:輸入信號產生電路</p>
        <p type="p">160:輸入信號取樣電路</p>
        <p type="p">CLK&lt;sub&gt;SAMP&lt;/sub&gt;:時脈信號</p>
        <p type="p">CLK&lt;sub&gt;TRIG&lt;/sub&gt;:時脈信號</p>
        <p type="p">V&lt;sub&gt;SENSE&lt;/sub&gt;:信號</p>
        <p type="p">V&lt;sub&gt;SUB&lt;/sub&gt;:輸出信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1053" publication-number="202617048">
    <tif-files tif-type="multi-tif">
      <tif file="114112806.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除塵裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A47L13/50</main-classification>
        <further-classification edition="200601120260123B">A47L9/02</further-classification>
        <further-classification edition="200601120260123B">A47L7/00</further-classification>
        <further-classification edition="200601120260123B">B08B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下電器產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂清股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUSKIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原祐兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, YUUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真鍋仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANABE, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野町哲治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMACHI, TETSUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子利之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉢呂有平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HACHIRO, YUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之除塵裝置具備有：貯塵部，用以貯留塵埃；插入筒，構成為可通過向上開口的插入口而從上側插入拖把；回收導管，使貯塵部與插入筒連通；及吸引源，藉由從貯塵部吸引空氣，使用以從插入筒內之拖把吸引塵埃的吸引力，通過貯塵部及回收導管而作用於插入筒內的拖把。回收導管具有沿著地板面延伸設置的延伸設置區間，並且在延伸設置區間形成有吸塵口，前述吸塵口開口成可容許地板面上的塵埃流入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:除塵裝置</p>
        <p type="p">110:殼體</p>
        <p type="p">111:後壁</p>
        <p type="p">112:缺口</p>
        <p type="p">120:插入筒</p>
        <p type="p">121:插入口</p>
        <p type="p">131:操作部</p>
        <p type="p">160:刮取部</p>
        <p type="p">170:開閉部</p>
        <p type="p">171:蓋構件</p>
        <p type="p">173:檢測部</p>
        <p type="p">174:接觸片</p>
        <p type="p">175:接觸片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1054" publication-number="202617581">
    <tif-files tif-type="multi-tif">
      <tif file="114112951.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微機電系統感測器及微機電系統感測方法</chinese-title>
        <english-title>A MICROELECTROMECHANICAL SYSTEMS SENSOR AND METHOD OF MICROELECTROMECHANICAL SYSTEMS SENSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B81B3/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國亞德諾半導體公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANALOG DEVICES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張江龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIANGLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維拉　高拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOHRA, GAURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈科淼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, KEMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示了用於MEMS裝置的完全對稱的感測結構。在某些實施例中，MEMS感測器包括在第一方向上移動的驗證質量。驗證質量包括與驗證質量一起移動的可移動指狀物。MEMS感測器進一步包括相對於可移動指狀物固定的固定指狀物，並且固定指狀物及可移動指狀物用於偵測驗證質量的移動。例如，可移動指狀物及固定指狀物可以相互交叉以形成梳狀指狀物組，用於感測由驗證質量相對於基板的移動所引起的電容值變化。固定指狀物的佈局至少在第一方向上係完全對稱的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Fully symmetric sensing structures for MEMS devices are disclosed herein. In certain embodiments, a MEMS sensor includes a proof mass that moves in a first direction. The proof mass includes moveable fingers that move with the proof mass. The MEMS sensor further includes fixed fingers that are fixed with respect to the moveable fingers, and the fixed fingers and moveable fingers serve to detect movement of the proof mass. For example, the moveable fingers and the fixed fingers can be interdigitated to form a comb finger set for sensing changes in capacitance arising from movement of the proof mass relative to a substrate. A layout of the fixed fingers is fully symmetric in at least the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">37:第一方向電容感測結構</p>
        <p type="p">41:可移動指狀物</p>
        <p type="p">43:第一組固定指狀物</p>
        <p type="p">44:第二組固定指狀物</p>
        <p type="p">45:第一組指狀物錨點</p>
        <p type="p">46:第二組指狀物錨點</p>
        <p type="p">47:y軸</p>
        <p type="p">48:x軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1055" publication-number="202617675">
    <tif-files tif-type="multi-tif">
      <tif file="114113022.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113022</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C211/62</main-classification>
        <further-classification edition="200601120260202B">C07C219/06</further-classification>
        <further-classification edition="200601120260202B">C07C53/08</further-classification>
        <further-classification edition="200601120260202B">C07C53/21</further-classification>
        <further-classification edition="200601120260202B">C07C57/145</further-classification>
        <further-classification edition="200601120260202B">C07C59/115</further-classification>
        <further-classification edition="200601120260202B">C07C59/245</further-classification>
        <further-classification edition="200601120260202B">C07C61/04</further-classification>
        <further-classification edition="200601120260202B">C07C61/09</further-classification>
        <further-classification edition="200601120260202B">C07C61/13</further-classification>
        <further-classification edition="200601120260202B">C07C62/24</further-classification>
        <further-classification edition="200601120260202B">C07C69/36</further-classification>
        <further-classification edition="200601120260202B">C07C69/63</further-classification>
        <further-classification edition="200601120260202B">C07C69/753</further-classification>
        <further-classification edition="200601120260202B">C07C211/63</further-classification>
        <further-classification edition="200601120260202B">C07D265/30</further-classification>
        <further-classification edition="200601120260202B">C07D307/93</further-classification>
        <further-classification edition="200601120260202B">C07D493/08</further-classification>
        <further-classification edition="200601120260202B">C08F212/08</further-classification>
        <further-classification edition="200601120260202B">C08F212/12</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08F220/06</further-classification>
        <further-classification edition="200601120260202B">C08F220/18</further-classification>
        <further-classification edition="200601120260202B">C08F220/28</further-classification>
        <further-classification edition="200601120260202B">C08F220/30</further-classification>
        <further-classification edition="200601120260202B">C08F220/32</further-classification>
        <further-classification edition="200601120260202B">C08F232/08</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
        <further-classification edition="200601120260202B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大城卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIRO, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中義一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湊裕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINATO, YUUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲見甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAMI, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種感放射線性組成物、圖案形成方法、以及化合物，所述感放射線性組成物能夠形成可以充分的水準發揮感度、CDU、圖案圓形性、圖案矩形性、曝光寬容度及焦點深度的抗蝕劑膜。一種感放射線性組成物，含有：包含具有酚性羥基的結構單元（I）的聚合物（A）、下述式（1）所表示的化合物（C）、交聯劑（Q）及溶劑（E）。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="149px" width="312px" file="ed10062.JPG" alt="ed10062.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（1）中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1～40的一價有機基（其中，將包含芳香族烴的基除外）；R&lt;sup&gt;21&lt;/sup&gt;及R&lt;sup&gt;22&lt;/sup&gt;分別獨立地為碳數1～40的一價有機基；R&lt;sup&gt;23&lt;/sup&gt;及R&lt;sup&gt;24&lt;/sup&gt;分別獨立地為碳數1～40的一價有機基，或者為R&lt;sup&gt;23&lt;/sup&gt;及R&lt;sup&gt;24&lt;/sup&gt;相互結合並與該些所鍵結的氮原子一起構成的環員數3～10的環結構）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1056" publication-number="202617049">
    <tif-files tif-type="multi-tif">
      <tif file="114113032.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除塵裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A47L13/50</main-classification>
        <further-classification edition="200601120260123B">B08B5/04</further-classification>
        <further-classification edition="200601120260123B">A47L7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下電器產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂清股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUSKIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原祐兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, YUUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真鍋仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANABE, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貞廣政紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADAHIRO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子利之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉢呂有平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HACHIRO, YUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的除塵裝置具備有：插入筒，構成為可以從上側插入拖把；貯塵部，用於貯存塵埃；回收導管，使貯塵部與插入筒連通；及吸引源，使得用於從插入筒內的拖把吸引塵埃的吸引力，通過貯塵部及回收導管作用於插入筒內的拖把。在插入筒的周壁形成有流出口，前述流出口容許已從插入筒內的拖把脫離的塵埃往回收導管流出。在貯塵部中形成為流入口相向於流出口，前述流入口是供從插入筒內的拖把脫離的塵埃流入，並且具有比流出口更大的開口面積。回收導管是從流出口往流入口筆直地延伸設置，並且在流入口側具有比流出口側更大的流路剖面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:除塵裝置</p>
        <p type="p">110:殼體</p>
        <p type="p">120:插入筒</p>
        <p type="p">121:插入口</p>
        <p type="p">123:流出口</p>
        <p type="p">125:內壁面</p>
        <p type="p">126:內壁面</p>
        <p type="p">130:吸引源</p>
        <p type="p">140:貯塵部</p>
        <p type="p">141:過濾器</p>
        <p type="p">142:流入口</p>
        <p type="p">150:回收導管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1057" publication-number="202617090">
    <tif-files tif-type="multi-tif">
      <tif file="114113201.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>下肢穿戴裝置</chinese-title>
        <english-title>LOWER LIMBS WEARABLE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120251230B">A61B5/389</main-classification>
        <further-classification edition="200601120251230B">A61B5/00</further-classification>
        <further-classification edition="200601120251230B">A61N1/18</further-classification>
        <further-classification edition="200601120251230B">A61F13/06</further-classification>
        <further-classification edition="200601120251230B">A61B5/11</further-classification>
        <further-classification edition="200601120251230B">A61N1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐建發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHIEN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林于傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳薇安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈乾龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種下肢穿戴裝置，包含彈性織物套筒。彈性織物套筒由彈性紗以及導電紗所編織而成，彈性織物套筒包含膝部定位標記、下前側定位標記，與上前側定位標記。膝部定位標記設置在彈性織物套筒的中段的外表面，下前側定位標記設置在彈性織物套筒的下段的外表面，上前側定位標記設置在彈性織物套筒的上段的外表面。彈性織物套筒更包含設置於彈性織物套筒的內表面的織物電極。彈性織物套筒更包含設置在彈性織物套筒的中段的網眼結構，網眼結構相對於膝部定位標記配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lower limbs wearable device includes a flexible textile sleeve. The flexible textile sleeve is weaved by elastic yarns and conductive yarns. The flexible textile sleeve includes knee alignment mark, a lower-front alignment mark, and an upper-front alignment mark. The knee alignment mark is disposed at an outer surface of a middle section of the flexible textile sleeve. The lower-front alignment mark is disposed at an outer surface of a lower section of the flexible textile sleeve. The upper-front alignment mark is disposed at an outer surface of an upper section of the flexible textile sleeve. The flexible textile sleeve further includes a plurality of textile electrodes disposed at an inner surface of the flexible textile sleeve. The flexible textile sleeve includes a mesh structure disposed at the middle section of the flexible textile sleeve and being opposite to the knee alignment mark.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:下肢穿戴裝置</p>
        <p type="p">100:彈性織物套筒</p>
        <p type="p">110:膝部定位標記</p>
        <p type="p">112:髕骨上緣定位線</p>
        <p type="p">114:髕骨下緣定位線</p>
        <p type="p">120:下前側定位標記</p>
        <p type="p">122:脛骨定位線</p>
        <p type="p">130:上前側定位標記</p>
        <p type="p">132:弧形定位線</p>
        <p type="p">C0:中心</p>
        <p type="p">C1:中點</p>
        <p type="p">L1:對稱軸</p>
        <p type="p">S1:上段</p>
        <p type="p">S2:中段</p>
        <p type="p">S3:下段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1058" publication-number="202619363">
    <tif-files tif-type="multi-tif">
      <tif file="114113242.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴式耳機用阻尼機構</chinese-title>
        <english-title>DAMPLING STRUCTURE FOR HEADPHONES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">H04R1/02</main-classification>
        <further-classification edition="200601120250501B">H04R1/16</further-classification>
        <further-classification edition="200601120250501B">H04R5/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陽威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及耳機技術領域，具體公開了一種頭戴式耳機用阻尼機構，該頭戴式耳機用阻尼機構包括外殼、滑動臂、滑動件和阻尼件，其中，外殼的至少局部呈弧形；滑動臂呈弧形，且固定於外殼內，滑動臂具有長條狀的第一阻尼部；滑動件與外殼滑動連接；阻尼件與滑動件連接，且能與滑動件同步移動，且阻尼件具有能與第一阻尼部壓接配合的第二阻尼部，在滑動件相對外殼往復移動過程中，第二阻尼部和第一阻尼部之間產生摩擦力。上述設置有利於縮小阻尼機構的尺寸，降低了出現噪音的可能性，保證阻尼手感的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a technical field of earphones. The present disclosure provides a damping structure for headphones. The damping structure for headphones comprises a housing, a slider arm, a slider component and a damper, wherein a least a part of the housing is curved. The slider arm is curved and fixed within the housing, and the slider arm has a first damping part in the form of a long strip. The slider component is slidably connected to the housing. The damper is connected to the slider component and moves synchronously with the slider component. The damping component has a second damping part can be press fitted with the first damping part. A frictional force is generated between the first damping part and the second damping part during reciprocating movement of the slider component relative to the housing. The aforementioned arrangement may reduce the size of the damping structure, minimizes a possibility of noise, and ensure a stability of the damping feel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外殼</p>
        <p type="p">120:插接槽</p>
        <p type="p">132:緊固件</p>
        <p type="p">200:滑動臂</p>
        <p type="p">210:滑動本體</p>
        <p type="p">211:第一阻尼部</p>
        <p type="p">220:止擋件</p>
        <p type="p">221:第二限位部</p>
        <p type="p">300:滑動件</p>
        <p type="p">310:滑動外接部</p>
        <p type="p">320:滑動配合部</p>
        <p type="p">400:阻尼件</p>
        <p type="p">430:緩衝塊</p>
        <p type="p">500:導向組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1059" publication-number="202619553">
    <tif-files tif-type="multi-tif">
      <tif file="114113258.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250624B">H10D64/27</main-classification>
        <further-classification edition="202501120250624B">H10D62/17</further-classification>
        <further-classification edition="202501120250624B">H10D30/62</further-classification>
        <further-classification edition="202501120250624B">H10D64/01</further-classification>
        <further-classification edition="202501120250624B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許清白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHING-PAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宗育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例係關於一種半導體結構。該半導體結構包含放置於一基板上方之通道部件、環繞該等通道部件之一閘極結構、相鄰於該閘極結構之內間隔件及鄰接該等通道部件之一源極/汲極構件。該等內間隔件之一者包含一中間介電部分及覆蓋該中間介電部分之表面之一屏蔽介電部分。該屏蔽介電部分之介電常數大於該中間介電部分之介電常數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes channel members disposed above a substrate, a gate structure wrapping around the channel members, inner spacers adjacent to the gate structure, and a source/drain feature abutting the channel members. One of the inner spacers includes a middle dielectric portion and a shield dielectric portion that covers surfaces of the middle dielectric portion. The dielectric constant of the shield dielectric portion is greater than the dielectric constant of the middle dielectric portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:區塊</p>
        <p type="p">104:區塊</p>
        <p type="p">106:區塊</p>
        <p type="p">108:區塊</p>
        <p type="p">110:區塊</p>
        <p type="p">112:區塊</p>
        <p type="p">114:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1060" publication-number="202618397">
    <tif-files tif-type="multi-tif">
      <tif file="114113450.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴式裝置及頭帶模組</chinese-title>
        <english-title>HEAD MOUNTED DEVICE AND HEADBAND MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251126B">G02B27/01</main-classification>
        <further-classification edition="200601120251126B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐冠吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, KUAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘于勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頭戴式裝置及頭帶模組。頭帶模組包括殼體、帶體、旋轉件、制動件、復位件以及驅動件。帶體的兩個調整段至少部分重疊並可動地設置於殼體內。旋轉件在旋轉軸線上可旋轉地設置於殼體並耦接兩個調整段。制動件設置於殼體且可沿著旋轉軸線平移。旋轉件與制動件契合時，僅允許旋轉件沿著旋轉軸線的單一方向的旋轉。復位件設置於殼體與制動件之間並提供彈性恢復力，以維持旋轉件與制動件之間的契合。驅動件與主機穿過殼體而互相連接。驅動件用以帶動制動件朝遠離旋轉件的方向移動，以解除旋轉件與制動件之間的契合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head mounted device and a headband module. The headband module comprises a housing, a band body, a rotating component, a braking component, a restoring component and a driving component. The two adjustment sections of the band body at least partially overlap and are movably disposed in the housing. The rotating component is rotatably arranged on the housing on a rotating axis and is coupled to the two adjusting sections. The braking component is disposed on the housing and can move along the rotation axis. When the rotating component is engaged with the braking component, the rotating component is only allowed to rotate in a single direction along the rotation axis. The restoring component is arranged between the housing and the braking component and provides elastic restoring force to maintain the engagement between the rotating component and the braking component. The driving component and the host are connected to each other through the housing. The driving component is used for driving the braking component to move in a direction away from the rotating component so as to release the engagement between the rotating component and the braking component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:頭帶模組</p>
        <p type="p">110:殼體</p>
        <p type="p">112:前件</p>
        <p type="p">114:中件</p>
        <p type="p">116:後件</p>
        <p type="p">116A:限位軸</p>
        <p type="p">120:帶體</p>
        <p type="p">122:第一調整段</p>
        <p type="p">124:第二調整段</p>
        <p type="p">130:旋轉件</p>
        <p type="p">132:耦接部</p>
        <p type="p">134:第一面棘輪部</p>
        <p type="p">140:制動件</p>
        <p type="p">142:桿</p>
        <p type="p">144:第二面棘輪部</p>
        <p type="p">150:復位件</p>
        <p type="p">160A:驅動件</p>
        <p type="p">162:槽</p>
        <p type="p">G1:第一齒條</p>
        <p type="p">G2:第二齒條</p>
        <p type="p">A10:旋轉軸線</p>
        <p type="p">R10:第一棘齒</p>
        <p type="p">R11:第一傾斜面</p>
        <p type="p">R12:第一止擋面</p>
        <p type="p">R20:第二棘齒</p>
        <p type="p">R21:第二傾斜面</p>
        <p type="p">R22:第二止擋面</p>
        <p type="p">D12:第一時針方向</p>
        <p type="p">D14:第二時針方向</p>
        <p type="p">170A:第一彈性件</p>
        <p type="p">170B:第二彈性件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1061" publication-number="202619499">
    <tif-files tif-type="multi-tif">
      <tif file="114113525.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有實現運算邏輯而無記憶體電網限制的基底晶粒的高頻寬三維堆疊記憶體</chinese-title>
        <english-title>HIGH-BANDWIDTH THREE-DIMENSIONAL STACKED MEMORY WITH A BASE DIE ENABLING COMPUTE LOGIC WITHOUT MEMORY POWER GRID RESTRICTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H10B80/00</main-classification>
        <further-classification edition="200601120260123B">H01L25/00</further-classification>
        <further-classification edition="202301120260123B">H01L25/065</further-classification>
        <further-classification edition="202301120260123B">H01L25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達羅格魯　默斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　中澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宇泰格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜拉帕帝　吉里德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALLAPATI, GIRIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲丹巴瑞　派瑞安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種三維(3D)堆疊記憶體封裝。該3D堆疊記憶體封裝包括一基底晶粒。該3D堆疊記憶體封裝亦包括記憶體晶粒，該等記憶體晶粒堆疊在該基底晶粒上。該3D堆疊記憶體封裝進一步包括一封裝基材，該封裝基材支撐該基底晶粒。該3D堆疊記憶體封裝亦包括一電力分配網路(PDN)晶粒，該PDN晶粒在堆疊在該基底晶粒上的該等記憶體晶粒上。該3D堆疊記憶體封裝進一步包括一組打線接合，該組打線接合耦接在該封裝基材與該PDN晶粒之間以對該等記憶體晶粒供電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional (3D) stacked memory package is described. The 3D stacked memory package includes a base die. The 3D stacked memory package also includes memory dies stacked on the base die. The 3D stacked memory package further includes a package substrate supporting the base die. The 3D stacked memory package also includes a power distribution network (PDN) die on the memory dies stacked on the base die. The 3D stacked memory package further includes a set of wire-bonds coupled between the package substrate and the PDN die to power the memory dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:高頻寬3D堆疊記憶體封裝</p>
        <p type="p">202:封裝基材/中介層</p>
        <p type="p">204:導熱(TC)晶粒填充材料</p>
        <p type="p">210:基底晶粒</p>
        <p type="p">212:邏輯/信號TSV</p>
        <p type="p">220:實體層(PHY)</p>
        <p type="p">222:熱運算邏輯</p>
        <p type="p">230:記憶體晶粒</p>
        <p type="p">240:冷卻蓋</p>
        <p type="p">242:熱介面材料(TIM)</p>
        <p type="p">250:電力分配網路(PDN)晶粒</p>
        <p type="p">252:饋通TSV</p>
        <p type="p">254:主動層</p>
        <p type="p">256:微凸塊</p>
        <p type="p">260:電網</p>
        <p type="p">262:接合墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1062" publication-number="202618568">
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      <tif file="114113714.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於並行測試之交錯掃描架構</chinese-title>
        <english-title>INTERLEAVED SCAN ARCHITECTURE FOR CONCURRENT TESTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G06F13/20</main-classification>
        <further-classification edition="200601120260123B">G06F1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈拉蘇特拉姆　馬希達爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JALASUTRAM, MAHEEDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里塞蒂　拉瑪　西里沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARISETTI, RAMA SIREESHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維帕蒂　瓦蘇巴布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVIPATI, VASUBABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德什潘德　阿爾哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHPANDE, AALHAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本檔案描述了用於積體電路(IC)晶片之並發測試之交錯掃描架構之設備及技術。在各個態樣中，IC或系統單晶片可包括交錯掃描電路系統、獨立電力軌上之IP區塊或功能區塊、區塊選擇邏輯及掃描輸出組合器。交錯掃描電路系統可以第一時脈速率接收包括一組測試輸入/輸出(I/O)之測試傳訊，且基於經接收之測試傳訊，以第二時脈速率產生多組測試I/O以分佈至區塊中之各別區塊。在一些態樣中，第二時脈速率低於第一時脈速率，此使得能夠在測試期間放鬆定時約束且避免使用昂貴的測試特有定時緩衝器。因而，所描述的態樣可藉由避免對測試特有定時或功率電路系統之需要來減少晶片測試時間且降低矽複雜性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This document describes apparatuses and techniques for an interleaved scan architecture for concurrent testing of integrated circuit (IC) chips. In various aspects, an IC or system-on-chip may include interleaved scan circuitry, IP blocks or functional blocks on independent power rails, block selection logic, and a scan out combiner. The interleaved scan circuitry can receive test signaling that includes a set of test input/outputs (I/Os) at a first clock rate and generate, based on the received test signaling, multiple sets of test I/Os at a second clock rate for distribution to respective ones of the blocks. In some aspects, the second clock rate is lower than the first clock rate, which enables relaxing of timing constraints during testing and avoids usage of costly testspecific timing buffers. As such, the described aspects can reduce chip test time and reduce silicon complexity by avoiding the need for test-specific timing or power circuitry.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106-1:IP區塊</p>
        <p type="p">106-2:IP區塊</p>
        <p type="p">106-3:IP區塊</p>
        <p type="p">106-4:IP區塊</p>
        <p type="p">106-5:IP區塊</p>
        <p type="p">106-6:IP區塊</p>
        <p type="p">106-7:IP區塊</p>
        <p type="p">106-8:IP區塊</p>
        <p type="p">108-1:電力軌</p>
        <p type="p">108-2:電力軌</p>
        <p type="p">108-3:電力軌</p>
        <p type="p">108-4:電力軌</p>
        <p type="p">110:交錯掃描電路系統</p>
        <p type="p">112:區塊選擇邏輯</p>
        <p type="p">114:掃描輸出組合器</p>
        <p type="p">116:墊區塊</p>
        <p type="p">118:掃描I/O介面</p>
        <p type="p">120:掃描時脈介面</p>
        <p type="p">302:雙倍資料速率時脈</p>
        <p type="p">306:掃描輸入分佈器</p>
        <p type="p">308:單一資料速率時脈</p>
        <p type="p">310:測試I/O</p>
        <p type="p">310-1:測試I/O</p>
        <p type="p">310-2:測試I/O</p>
        <p type="p">310-3:測試I/O</p>
        <p type="p">310-4:測試I/O</p>
        <p type="p">400:組態</p>
        <p type="p">402:掃描網路</p>
        <p type="p">402-1:掃描網路</p>
        <p type="p">402-2:掃描網路</p>
        <p type="p">402-3:掃描網路</p>
        <p type="p">402-4:掃描網路</p>
        <p type="p">404:閘控邏輯</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1063" publication-number="202618688">
    <tif-files tif-type="multi-tif">
      <tif file="114113866.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113866</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於影像處理之方法與相關聯非暫態電腦可讀儲存媒體，及電子裝置</chinese-title>
        <english-title>METHOD WITH IMAGE PROCESSING AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM ASSOCIATED THEREWITH, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G06T5/20</main-classification>
        <further-classification edition="200601120250801B">G06T5/50</further-classification>
        <further-classification edition="201701120250801B">G06T7/90</further-classification>
        <further-classification edition="202301120250801B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金必洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, PILSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺榮鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YOUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金靜燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNGSUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉垈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BYEONG DAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑞勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SER HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炯旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYONG EUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李薰成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HOONSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔承源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SEUNGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鍾聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JONGSEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於影像處理之處理器實施方法，其包括：獲取一原始影像；基於一像素查找表(LUT)獲得對應於一目標像素之一像素權重；基於一梯度LUT判定該目標像素之一方向性權重；及藉由基於該方向性權重及方向性影像分量判定該目標像素之一輸出值來產生一目標影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processor-implemented method with image processing includes acquiring a raw image, obtaining a pixel weight corresponding to a target pixel based on a pixel look-up table (LUT), determining a directional image component of the target pixel based on the raw image and the pixel weight, determining a directional weight of the target pixel based on a gradient LUT, and generating a target image by determining an output value of the target pixel based on the directional weight and the directional image component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像系統</p>
        <p type="p">101:光</p>
        <p type="p">105:透鏡</p>
        <p type="p">110:濾色器陣列</p>
        <p type="p">115:影像感測器</p>
        <p type="p">120:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1064" publication-number="202619559">
    <tif-files tif-type="multi-tif">
      <tif file="114113885.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113885</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250801B">H10D84/67</main-classification>
        <further-classification edition="202501120250801B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧運楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, YUN CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛森鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYUE, SEN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種半導體裝置及其形成方法。半導體裝置可包括：第一奈米結構；圍繞第一奈米結構的第一閘極結構；位於第一奈米結構及第一閘極結構上的第一內部間隔物；位於第一奈米結構及第一內部間隔物上的第一源極/汲極區；位於第一奈米結構下方的第二奈米結構；圍繞第二奈米結構的第二閘極結構；位於第二奈米結構及第二閘極結構上的第二內部間隔物；以及位於第二奈米結構及第二內部間隔物上的第二源極/汲極區。第一內部間隔物可具有擁有第一寬度的第一外側壁。第二內部間隔物可具有擁有小於第一寬度的第二寬度的第二外側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and the method of forming the same are provided. The semiconductor device may include a first nanostructure, a first gate structure wrapping around the first nanostructure, a first inner spacer on the first nanostructure and the first gate structure, a first source/drain region on the first nanostructure and the first inner spacer, a second nanostructure underneath the first nanostructure, a second gate structure wrapping around the second nanostructure, a second inner spacer on the second nanostructure and the second gate structure, and a second source/drain region on the second nanostructure and the second inner spacer. The first inner spacer may have a first outer sidewall with a first width. The second inner spacer may have a second outer sidewall with a second width smaller than the first width.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">20’:半導體鰭片</p>
        <p type="p">26L:下部半導體奈米結構</p>
        <p type="p">26U:上部半導體奈米結構</p>
        <p type="p">44:閘極間隔物</p>
        <p type="p">54L:下部內部間隔物</p>
        <p type="p">54U:上部內部間隔物</p>
        <p type="p">56:介電隔離層</p>
        <p type="p">62L:下部磊晶源極/汲極區</p>
        <p type="p">62U:上部磊晶源極/汲極區</p>
        <p type="p">68:第一ILD</p>
        <p type="p">70:第二CESL</p>
        <p type="p">72:第二ILD</p>
        <p type="p">78:閘極介電質</p>
        <p type="p">80L:下部閘極電極</p>
        <p type="p">80U:上部閘極電極</p>
        <p type="p">90:閘極結構</p>
        <p type="p">90L:下部閘極結構</p>
        <p type="p">90U:上部閘極結構</p>
        <p type="p">92:閘極遮罩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1065" publication-number="202619568">
    <tif-files tif-type="multi-tif">
      <tif file="114113930.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250624B">H10D84/85</main-classification>
        <further-classification edition="202501120250624B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喻鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUH, PERNG-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供使用互補式場效電晶體的半導體裝置。半導體裝置包括第一互補式場效電晶體(CFET)對。該第一CFET對包括第一n型電晶體，該第一n型電晶體具有與差分對的第一輸入耦合的第一閘電極。該第一CFET對包括第一p型電晶體，該第一p型電晶體具有與該差分對的該第一輸入耦合的第二閘電極。該半導體裝置包括第二CFET對。該第二CFET對包括第二n型電晶體，該第二n型電晶體具有與該差分對的第二輸入耦合的第三閘電極。該第二CFET對包括第二p型電晶體，該第二p型電晶體具有與該差分對的該第一輸入耦合的第四閘電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices using complementary field effect transistors are provided. A semiconductor device includes a first complementary field effect transistor (CFET) pair. The first CFET pair includes a first n-type transistor having a first gate electrode coupled with a first input of a differential pair. The first CFET pair includes a first p-type transistor having a second gate electrode coupled with the first input of the differential pair. The semiconductor device includes second CFET pair. The second CFET pair includes a second n-type transistor having a third gate electrode coupled with a second input of the differential pair. The second CFET pair includes a second p-type transistor having a fourth gate electrode coupled with the first input of the differential pair.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電路</p>
        <p type="p">202:第一CFET</p>
        <p type="p">204、210:n型電晶體</p>
        <p type="p">206:p型電晶體</p>
        <p type="p">208、212:第二CFET</p>
        <p type="p">214:第一電流源</p>
        <p type="p">216:第二電流源</p>
        <p type="p">218、226:第一電晶體</p>
        <p type="p">220、228:第二電晶體</p>
        <p type="p">222、230:第三電晶體</p>
        <p type="p">224、232:第四電晶體</p>
        <p type="p">233:非反相輸入</p>
        <p type="p">234:電源電壓</p>
        <p type="p">235:反相輸入</p>
        <p type="p">236:第二電源電壓</p>
        <p type="p">238:第一電源電壓</p>
        <p type="p">240:第一偏置電流</p>
        <p type="p">242:第二偏置電流</p>
        <p type="p">243:第一節點</p>
        <p type="p">245:第二節點</p>
        <p type="p">247:第三節點</p>
        <p type="p">249:第四節點</p>
        <p type="p">250:輸出</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1066" publication-number="202619490">
    <tif-files tif-type="multi-tif">
      <tif file="114113964.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113964</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">H10B53/00</main-classification>
        <further-classification edition="202301120260202B">H10B53/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮入秀和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAIRI, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松木充弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKI, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沼田至優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUMATA, SHIYUU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種佔有面積得到減少的記憶體裝置。提供一種可準確讀出資料的記憶體裝置。提供一種易於製造的記憶體裝置。該記憶體裝置中，多個第一電晶體具有位於絕緣層的第一開口部內的部分，多個第二電晶體具有位於絕緣層的第二開口部內的部分，多個第一電容器的板線與多個第二電容器的板線分開設置，多個第一電容器和多個第二電容器包含可具有鐵電性的材料，多個第一電晶體之一的源極和汲極中的一方與多個第一電容器之一連接，另一方與位元線連接，多個第二電晶體之一的源極和汲極中的一方與多個第二電容器之一連接，另一方與位元線連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:絕緣層</p>
        <p type="p">15:記憶單元</p>
        <p type="p">20:電晶體</p>
        <p type="p">21:半導體層</p>
        <p type="p">22:絕緣層</p>
        <p type="p">23:導電層</p>
        <p type="p">24:導電層</p>
        <p type="p">25a:導電層</p>
        <p type="p">25a1:導電層</p>
        <p type="p">25a2:導電層</p>
        <p type="p">25b:導電層</p>
        <p type="p">25b1:導電層</p>
        <p type="p">25b2:導電層</p>
        <p type="p">30:電容器</p>
        <p type="p">43:絕緣層</p>
        <p type="p">44:絕緣層</p>
        <p type="p">45:絕緣層</p>
        <p type="p">46:絕緣層</p>
        <p type="p">46b:導電層</p>
        <p type="p">47:絕緣層</p>
        <p type="p">48:絕緣層</p>
        <p type="p">51:導電層</p>
        <p type="p">52:絕緣層</p>
        <p type="p">53:導電層</p>
        <p type="p">88a:導電層</p>
        <p type="p">88b:導電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1067" publication-number="202617585">
    <tif-files tif-type="multi-tif">
      <tif file="114113966.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113966</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氨分解系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C01B3/04</main-classification>
        <further-classification edition="200601120260202B">F01K25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桜井幹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, MIKIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志村良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMURA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺谷悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERATANI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠田誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINODA, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤村寿明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAMURA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之氨分解系統包含：第一分解部，其將氨熱分解成氮與氫；蒸氣供給部，其產生蒸氣，並作為熱源供給至第一分解部；回收管線，其回收通過第一分解部之後之蒸氣；渦輪機，其被由回收管線回收之蒸氣驅動；及發電部，其藉由被渦輪機驅動，而產生電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氨分解系統</p>
        <p type="p">10:第一分解部</p>
        <p type="p">11:氨供給管線</p>
        <p type="p">12:產生氣體回收管線</p>
        <p type="p">20:蒸氣供給部</p>
        <p type="p">21:蒸氣供給部本體</p>
        <p type="p">22:蒸氣供給管線</p>
        <p type="p">23:蒸氣回收管線</p>
        <p type="p">30:渦輪機</p>
        <p type="p">31:回流管線</p>
        <p type="p">32:冷凝器</p>
        <p type="p">33:供水泵</p>
        <p type="p">40:發電部</p>
        <p type="p">50:輔助設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1068" publication-number="202618413">
    <tif-files tif-type="multi-tif">
      <tif file="114114005.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片上電吸收調變器</chinese-title>
        <english-title>ON-CHIP ELECTRO-ABSORPTION MODULATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02F1/015</main-classification>
        <further-classification edition="200601120260123B">G02F1/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商無蓋燈光電公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPENLIGHT PHOTONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯切爾巴　克日斯托夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SZCZERBA, KRZYSZTOF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松庫利　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONKOLY, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古佐恩　羅伯特　斯維歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUZZON, ROBERT SILVIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光子積體電路(PIC)包含具有一第一電極及一第二電極之一整合晶片上電吸收調變器(EAM)，該第一電極及第二電極包含一陽極及一陰極。該PIC包含電耦合至該第一電極用於將終止(termination)及偏壓提供至該EAM之至少一第一偏壓網路。該第一偏壓網路包含形成於該PIC上之至少一第一電感器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photonic integrated circuit (PIC) includes an integrated on-chip electro-absorption modulator (EAM) having a first electrode and a second electrode, the first electrode and second electrode including an anode and a cathode. The PIC includes at least a first biasing network electrically coupled to the first electrode for providing termination and biasing to the EAM. The first biasing network includes at least a first inductor formed on the PIC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:電吸收調變器(EAM)</p>
        <p type="p">104:第一偏壓網路</p>
        <p type="p">106:第一電阻器</p>
        <p type="p">108:第一電感器</p>
        <p type="p">110:第一電極</p>
        <p type="p">112:調變器接面</p>
        <p type="p">114:第二電極</p>
        <p type="p">116:第二偏壓網路</p>
        <p type="p">118:第二電感器</p>
        <p type="p">120:第二電阻器</p>
        <p type="p">122:金屬化</p>
        <p type="p">124:第一端子</p>
        <p type="p">126:第二端子</p>
        <p type="p">128:第三端子</p>
        <p type="p">130:第四端子</p>
        <p type="p">132:導通體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1069" publication-number="202617933">
    <tif-files tif-type="multi-tif">
      <tif file="114114023.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114023</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理薄膜的方法及製造記憶體裝置的方法</chinese-title>
        <english-title>METHOD OF TREATING THIN FILMS AND METHOD OF MANUFACTURING MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K13/00</main-classification>
        <further-classification edition="200601120260202B">C23F1/12</further-classification>
        <further-classification edition="200601120260202B">H01L21/02</further-classification>
        <further-classification edition="200601120260202B">H01L21/311</further-classification>
        <further-classification edition="200601120260202B">H01L21/3213</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＥＧＴＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGTM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹圭鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KYU HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金哈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HA NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭玹姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, HYUN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金明鎰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MYEONG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭主煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JU HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹賢植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYEON SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金才玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白善永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAIK, SUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種處理薄膜的方法，該方法包含：將一修飾劑供應至放置一基板之一腔體內部，以將該修飾劑吸附於形成在該基板上的一薄膜上；吹淨該腔體內部；將一蝕刻活化劑供應至該腔體內部，以與所吸附的該修飾劑反應並處理該薄膜；以及吹淨該腔體內部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of treating thin films, the method comprising supplying a modifier to the inside of a chamber where a substrate is placed to adsorb the modifier onto a thin film formed on the substrate; purging the inside of the chamber; supplying an etching activator to the inside of the chamber to react with the adsorbed modifier and treat the thin film; and purging the inside of the chamber.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1070" publication-number="202617859">
    <tif-files tif-type="multi-tif">
      <tif file="114114231.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性組成物、層合構造體、硬化物及電子零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08K5/16</main-classification>
        <further-classification edition="200601120260202B">C08K5/315</further-classification>
        <further-classification edition="200601120260202B">C08K5/3492</further-classification>
        <further-classification edition="200601120260202B">C08K5/5313</further-classification>
        <further-classification edition="200601120260202B">C08L101/08</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/027</further-classification>
        <further-classification edition="200601120260202B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今本賢治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAMOTO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮部英和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYABE, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤斉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種具有優異之解析性及耐熱性的感光性組成物。  &lt;br/&gt;　　作為本發明的解決手段，為一種感光性組成物，其係包含(A)含有羧酸之樹脂與(B)光聚合起始劑與(C)感光性單體與(D)著色劑的感光性組成物，其特徵為前述(A)含有羧酸之樹脂包含：選自(A1)將酚化合物作為出發原料之含有羧酸之感光性樹脂、(A2)具有胺基甲酸酯骨架之含有羧酸之感光性樹脂、(A3)含有羧酸之共聚感光性樹脂，及(A4)將環氧化合物作為出發原料之含有羧酸之感光性樹脂中之至少1種的樹脂，前述(D)著色劑包含下述式(1)表示之喹酞酮化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="196px" width="461px" file="ed10099.JPG" alt="ed10099.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1071" publication-number="202618517">
    <tif-files tif-type="multi-tif">
      <tif file="114114274.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體電路及其操作方法</chinese-title>
        <english-title>MEMORY CIRCUIT AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250910B">G06F1/3203</main-classification>
        <further-classification edition="201901120250910B">G06F1/3225</further-classification>
        <further-classification edition="200601120250910B">G11C8/12</further-classification>
        <further-classification edition="200601120250910B">G11C8/18</further-classification>
        <further-classification edition="200601120250910B">G11C8/10</further-classification>
        <further-classification edition="200601120250910B">G11C8/08</further-classification>
        <further-classification edition="200601120250910B">G11C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊竜太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小嶋英充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, HIDEMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體電路包含一記憶體陣列，該記憶體陣列包含複數個記憶體單元，其中該記憶體陣列的一第一部分在一當前週期期間經存取，且該記憶體陣列的一第二部分將在一下一個週期期間經存取。該記憶體電路包含用以提供指示該第二部分的一位址的一下一個位址訊號的一解碼器及可操作地耦接至該記憶體陣列及該解碼器的一記憶體控制器。該解碼器用以基於該下一個位址訊號來在該當前週期期間啟動該第二部分，且基於該下一個位址訊號來使得該記憶體陣列的一第三部分在一功率管理模式下操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory circuit includes a memory array including a plurality of memory cells, wherein a first portion of the memory array is accessed during a present cycle, and a second portion of the memory array is to be accessed during a next cycle. The memory circuit includes a decoder configured to provide a next address signal indicating an address of the second portion, and a memory controller operatively coupled to the memory array and the decoder. The decoder is configured to activate, based on the next address signal, the second portion during the present cycle, and cause, based on the next address signal, a third portion of the memory array to operate in a power management mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路</p>
        <p type="p">105:記憶體控制器</p>
        <p type="p">110,110A,110B:記憶體組</p>
        <p type="p">110M,Bank[0],Bank[1]:記憶體組</p>
        <p type="p">120:記憶體陣列</p>
        <p type="p">120A,120B~120M:子陣列</p>
        <p type="p">122、122A、122B~122M:WLDV</p>
        <p type="p">130:解碼器</p>
        <p type="p">140:IO介面</p>
        <p type="p">ADR:位址訊號</p>
        <p type="p">BL:位元線</p>
        <p type="p">D:輸入端</p>
        <p type="p">DEC[0],DEC[1]~DEC[M-1]:解碼訊號</p>
        <p type="p">FCW:FCW訊號</p>
        <p type="p">PM[0],PM[1]~PM[M-1]:PM控制線</p>
        <p type="p">Q:輸出</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1072" publication-number="202617352">
    <tif-files tif-type="multi-tif">
      <tif file="114114324.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拋光滾刷</chinese-title>
        <english-title>POLISHING ROLLER BRUSH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">B24D13/08</main-classification>
        <further-classification edition="200601120260124B">H05K3/26</further-classification>
        <further-classification edition="200601120260124B">B24B29/02</further-classification>
        <further-classification edition="200601120260124B">B24B41/047</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山原通宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHARA, MICHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冨原良平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIHARA, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤坂直彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKASAKA, NAOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平山裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAYAMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem] </p>
        <p type="p">The present disclosure provides a polishing roller brush that simultaneously satisfies both efficiency and quality of polishing operations. </p>
        <p type="p">[Solution to Problem] </p>
        <p type="p">One aspect of this disclosure relates to a polishing roller brush, wherein the polishing roller brush includes a core having a central rotation axis and configured to be attachable to a rotary polishing instrument, and a polishing roll mounted on the core and restrained at least in a circumferential direction of the central rotation axis with respect to the core, wherein the polishing roll includes a plurality of polishing disks stacked in parallel in an axial direction along the central rotation axis of the core, each of the polishing disks having a flat donut shape including a central hole and an outer peripheral surface for polishing a surface of a polishing target object, and being disposed with an inclination of an angle of 1 degree or more and less than 15 degrees with respect to a plane orthogonal to the central rotation axis of the core.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:拋光滾刷</p>
        <p type="p">4:外周表面</p>
        <p type="p">11:拋光輥</p>
        <p type="p">14:外周表面</p>
        <p type="p">16:中心孔</p>
        <p type="p">17:端部</p>
        <p type="p">21:拋光盤堆疊</p>
        <p type="p">24:外周表面</p>
        <p type="p">25:內周表面</p>
        <p type="p">26:中心孔</p>
        <p type="p">27:端部</p>
        <p type="p">31:拋光盤</p>
        <p type="p">31a:拋光盤</p>
        <p type="p">41:芯部</p>
        <p type="p">44:外周表面</p>
        <p type="p">46:中心孔</p>
        <p type="p">51:端板</p>
        <p type="p">Ax:中心旋轉軸線</p>
        <p type="p">A-A’:平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1073" publication-number="202618174">
    <tif-files tif-type="multi-tif">
      <tif file="114114423.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114423</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遮光裝置</chinese-title>
        <english-title>SHADING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250715B">F21V1/00</main-classification>
        <further-classification edition="200601120250715B">F21V17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商昆山聯滔電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANTO ELECTRONIC LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許淑雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宗驥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種遮光裝置，包括承載結構、蓋合結構和卡鈎。承載結構用於容置導光柱，蓋合結構與承載結構透過柔性結構連接，並與承載結構蓋合形成通光孔，使導光柱能夠從通光孔中伸出。蓋合結構與承載結構的蓋合利用卡鈎鎖止。透過蓋合結構與承載結構對導光柱的限位及遮擋，以及卡鈎與柔性結構配合實現遮光裝置的開合及鎖止，使得遮光裝置能夠適應多種安裝場景及需求，且不需要多種零件配合，安裝簡便、適用場景廣泛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a shading device comprising a bearing structure, a cover structure, and a hook. The bearing structure is used to accommodate a light guide rod. The cover structure is connected to the bearing structure via a flexible structure and forms a through hole with the bearing structure, allowing the light guide rod to protrude from the through hole. The cover structure is locked to the bearing structure by the hook. The light guide rod is constrained and shielded by the cover structure and bearing structure. In conjunction with the flexible structure, the hook enables the shading device to be opened, closed, and locked. Thus, the shading device can be adapted to various installation scenarios and requirements without requiring numerous components, providing easy installation and broad applicability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:遮光裝置</p>
        <p type="p">11:蓋合結構</p>
        <p type="p">111:頂板</p>
        <p type="p">112:遮擋緣</p>
        <p type="p">113:卡槽</p>
        <p type="p">12:承載結構</p>
        <p type="p">13:柔性結構</p>
        <p type="p">131:通光孔</p>
        <p type="p">14:卡鈎</p>
        <p type="p">15:側擋結構</p>
        <p type="p">16:定位部</p>
        <p type="p">161:定位槽</p>
        <p type="p">171:第一固定部</p>
        <p type="p">172:第二固定部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1074" publication-number="202619107">
    <tif-files tif-type="multi-tif">
      <tif file="114114459.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由橋接件和混合凸塊的訊號轉接技術</chinese-title>
        <english-title>SIGNAL TRANSFER WITH A BRIDGE AND HYBRID BUMPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/50</main-classification>
        <further-classification edition="200601120260123B">H01L23/488</further-classification>
        <further-classification edition="200601120260123B">H01L23/28</further-classification>
        <further-classification edition="202001120260123B">G06F30/392</further-classification>
        <further-classification edition="202001120260123B">G06F30/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾特拉公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALTERA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪希卡　瑪赫許　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMASHIKAR, MAHESH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪西斯瓦里　亞圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHESHWARI, ATUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡笙　梅德　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSSAIN, MD ALTAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉馬爾普　安基瑞迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALAMALPU, ANKIREDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科魯魯　克里希納　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLLURU, KRISHNA BHARATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容之系統或方法可提供一多晶片封裝，該多晶片封裝具有各自包括混合凸塊之二個或更多個積體電路裝置。該等混合凸塊可包括不同大小的凸塊以促進不同類型之通訊。舉例而言，該等混合凸塊可包括具有細間距之一第一凸塊以用於晶粒間通訊及/或具有一大間距之一第二凸塊以用於封裝外通訊。該多晶片封裝可包括一橋接件以促進該積體電路裝置與該等混合凸塊及該多晶片封裝內之其他組件之間的訊號轉接。另外或替代地，該多晶片封裝可包括一互連件以促進二個積體電路裝置之間的訊號轉接。該互連件可包括細間距凸塊，該等細間距凸塊可由一插入件轉換為該橋接件的一間距大小。因而，該互連件可促進晶粒間通訊及/或封裝外通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems or methods of the present disclosure may provide a multi-chip package with two or more integrated circuit devices that each include hybrid bumps. The hybrid bumps may include bumps of different sizes to facilitate different types of communication. For example, the hybrid bumps may include a first bump with fine pitch for die-to-die communication and/or a second bump with a large pitch for off-package communication. The multi-chip package may include a bridge to facilitate signal transfer between the integrated circuit device with the hybrid bumps and other components within the multi-chip package. Additionally or alternatively, the multi-chip package may include an interconnect to facilitate signal transfer between two integrated circuit devices. The interconnect may include fine pitch bumps, which may be translated by an interposer to a pitch size of the bridge. As such, the interconnect may facilitate die-to-die communication and/or off-package communication.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12A:第一積體電路裝置</p>
        <p type="p">12B:第二積體電路裝置</p>
        <p type="p">12C:第三積體電路裝置</p>
        <p type="p">12D:第四積體電路裝置</p>
        <p type="p">12E:第五積體電路裝置</p>
        <p type="p">100:多晶片封裝</p>
        <p type="p">102:基體</p>
        <p type="p">104:焊球</p>
        <p type="p">105:重佈層</p>
        <p type="p">106:混合凸塊</p>
        <p type="p">106A:第一凸塊</p>
        <p type="p">106C:第三凸塊</p>
        <p type="p">106D:第四混合凸塊</p>
        <p type="p">107:凸塊</p>
        <p type="p">107A:第一凸塊</p>
        <p type="p">108:橋接件</p>
        <p type="p">109A,120A:第一表面</p>
        <p type="p">109B,120B:第二表面</p>
        <p type="p">110:銅柱</p>
        <p type="p">110A:第一銅柱</p>
        <p type="p">112:插入件</p>
        <p type="p">116:混合接合互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1075" publication-number="202619480">
    <tif-files tif-type="multi-tif">
      <tif file="114114644.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶體封裝</chinese-title>
        <english-title>SEMICONDUCTOR MEMORY PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250703B">H10B12/00</main-classification>
        <further-classification edition="200601120250703B">H01L25/10</further-classification>
        <further-classification edition="200601120250703B">H01L23/538</further-classification>
        <further-classification edition="200601120250703B">H01L23/528</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑌眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YEONJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔楨煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴建熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KEONHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭海旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, HAEWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體記憶體封裝，包括：緩衝半導體晶粒，包括被配置為與記憶體控制器執行通訊的介面電路；多個核心半導體晶粒，在垂直方向上堆疊於緩衝半導體晶粒上，其中多個核心半導體晶粒中的核心半導體晶粒包括半導體記憶體裝置；以及異質半導體晶粒，與緩衝半導體晶粒及多個核心半導體晶粒堆疊，其中異質半導體晶粒包括：包括多個電源電容器的電容器陣列；以及連接多個電源電容器的電極的電極導體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor memory package including: a buffer semiconductor die including an interface circuit configured to perform communication with a memory controller; a plurality of core semiconductor dies stacked in a vertical direction on the buffer semiconductor die, wherein a core semiconductor die of the plurality of core semiconductor dies includes a semiconductor memory device; and a heterogeneous semiconductor die stacked with the buffer semiconductor die and the plurality of core semiconductor dies, wherein the heterogeneous semiconductor die includes: a capacitor array including a plurality of power capacitors; and an electrode conductor connecting electrodes of the plurality of power capacitors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:半導體記憶體封裝</p>
        <p type="p">BMP:導電凸塊</p>
        <p type="p">BSD:緩衝半導體晶粒/半導體晶粒</p>
        <p type="p">CPA:電容器陣列</p>
        <p type="p">CSD1:核心半導體晶粒/第一核心半導體晶粒/半導體晶粒</p>
        <p type="p">CSD2:核心半導體晶粒/第二核心半導體晶粒/半導體晶粒</p>
        <p type="p">CSD3:核心半導體晶粒/第三核心半導體晶粒/半導體晶粒</p>
        <p type="p">CSD4:核心半導體晶粒/第四核心半導體晶粒/半導體晶粒</p>
        <p type="p">D1:第一水平方向/第一方向</p>
        <p type="p">D2:第二水平方向/第二方向</p>
        <p type="p">D3:第三方向/垂直方向</p>
        <p type="p">HSD:異質半導體晶粒/半導體晶粒</p>
        <p type="p">IFC:介面電路</p>
        <p type="p">MDV1、MDV2、MDV3、MDV4:半導體記憶體裝置</p>
        <p type="p">PTH1:電源垂直導電路徑</p>
        <p type="p">PTH2:接地垂直導電路徑/垂直導電路徑</p>
        <p type="p">RSN:密封材料</p>
        <p type="p">VDD:電源供應電壓/電壓</p>
        <p type="p">VSS:接地電壓/電壓</p>
        <p type="p">WEL1:電極導體/電源電極導體</p>
        <p type="p">WEL2:電極導體/接地電極導體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1076" publication-number="202617426">
    <tif-files tif-type="multi-tif">
      <tif file="114114657.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉印膜、具有導體圖案之積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">B32B15/08</main-classification>
        <further-classification edition="200601120260129B">B32B27/08</further-classification>
        <further-classification edition="200601120260129B">B32B27/18</further-classification>
        <further-classification edition="200601120260129B">B32B27/22</further-classification>
        <further-classification edition="200601120260129B">B32B27/30</further-classification>
        <further-classification edition="200601120260129B">B32B27/36</further-classification>
        <further-classification edition="200601120260129B">B32B33/00</further-classification>
        <further-classification edition="201901120260129B">B32B7/06</further-classification>
        <further-classification edition="200601120260129B">B32B37/24</further-classification>
        <further-classification edition="200601120260129B">G03F7/00</further-classification>
        <further-classification edition="200601120260129B">G03F7/004</further-classification>
        <further-classification edition="200601120260129B">G03F7/11</further-classification>
        <further-classification edition="200601120260129B">G03F7/20</further-classification>
        <further-classification edition="200601120260129B">H05K3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼塚悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONITSUKA, HISASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種能夠形成解析度優異之圖案，並且抑制顯影速度下降之轉印膜。一種轉印膜，其依序具有臨時支撐體、熱塑性樹脂層、中間層及感光性組成物層，其中，上述熱塑性樹脂層包含鹼溶性的熱塑性樹脂、具有聚合性基之塑化劑、聚合抑制劑及光褪色性化合物，在上述熱塑性樹脂層中，上述光褪色性化合物的含量與上述聚合抑制劑的含量之質量比為400以下，在從上述熱塑性樹脂層側對從上述轉印膜剝離上述臨時支撐體而獲得之積層體照射包含波長365nm的光之紫外光，以使波長365nm下的照射量達到1000mJ/cm&lt;sup&gt;2&lt;/sup&gt;之情況下，當將上述照射前的上述積層體在波長365nm下的透射率設為T0、將上述照射後的上述積層體在波長365nm下的透射率設為T1000時，上述轉印膜滿足式（1）的關係。&lt;br/&gt;式（1）   T1000/T0≥4。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1077" publication-number="202618490">
    <tif-files tif-type="multi-tif">
      <tif file="114114752.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自主移動機器人及其室內定位方法</chinese-title>
        <english-title>AUTONOMOUS MOBILE ROBOT AND INDOOR LOCALIZATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250430B">G05D1/242</main-classification>
        <further-classification edition="202401320250430B">G05D109/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商台達電子國際(新加坡)私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普塔　安庫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, ANKUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪慈憶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, TZU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種自主移動機器人，包含機器人本體、距離感測器，以及處理電路。距離感測器安裝於機器人本體，並被配置為獲取封閉室內空間的當前空間資料。處理電路耦接至距離感測器，並被配置為透過對當前空間資料執行特徵萃取，從當前空間資料中識別多個當前錨點，以及基於當前錨點，透過執行多點定位，判定封閉室內空間內之機器人本體的當前位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An autonomous mobile robot is provided, which includes a robot body, a distance sensor, and a processing circuitry. The distance sensor is mounted on the robot body, and configured to capture current spatial data of an enclosed indoor space. The processing circuitry is coupled to the distance sensor, and configured to identify multiple current anchor nodes from the current spatial data through feature extraction, and determine the current location of the robot body within the enclosed indoor space through multilateration based on the current anchor nodes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AMR:自主移動機器人</p>
        <p type="p">DS:距離感測器</p>
        <p type="p">PCC:處理電路</p>
        <p type="p">RB:機器人本體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1078" publication-number="202618368">
    <tif-files tif-type="multi-tif">
      <tif file="114114788.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像鏡頭、相機模組與電子裝置</chinese-title>
        <english-title>IMAGING LENS, CAMERA MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120251118B">G02B7/02</main-classification>
        <further-classification edition="202101120251118B">G03B17/12</further-classification>
        <further-classification edition="202101120251118B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大根光學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN INDUSTRIAL OPTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃炫欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSUAN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昱辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像鏡頭，包含一透鏡、一鏡筒、一臂部、一支撐元件以及一維持元件。透鏡具有一光軸。鏡筒容納透鏡。臂部設置於鏡筒遠離光軸的一側。臂部沿遠離光軸的方向延伸。支撐元件具有一第一接觸面。第一接觸面在平行於光軸的方向上與臂部重疊且接觸。維持元件固定於支撐元件。維持元件具有一第二接觸面。第二接觸面在平行於光軸的方向上與臂部重疊且接觸。第二接觸面相對第一接觸面。臂部設置於支撐元件與維持元件之間。支撐元件與維持元件為相異的材質。第一接觸面與第二接觸面環繞光軸。第一接觸面與第二接觸面在平行於光軸的方向上不重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging lens includes a lens element, a lens barrel, an arm, a holder and a retainer. The lens element has an optical axis. The lens barrel accommodates the lens element. The arm is disposed on a side of the lens barrel away from the optical axis. The arm extends along a direction away from the optical axis. The holder has a first contacting surface overlapping and contacting with the arm in a direction parallel to the optical axis. The retainer is fixed on the holder. The retainer has a second contacting surface overlapping and contacting with the arm in a direction parallel to the optical axis. The first contacting surface and the second contacting surface are located on opposite sides. The arm is disposed between the holder and the retainer. The holder and the retainer are made of different materials. The first contacting surface and the second contacting surface surround the optical axis and are not overlapped with each other in a direction parallel to the optical axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:相機模組</p>
        <p type="p">10:成像鏡頭</p>
        <p type="p">11:透鏡</p>
        <p type="p">111:光軸</p>
        <p type="p">12:鏡筒</p>
        <p type="p">13:臂部</p>
        <p type="p">14:支撐元件</p>
        <p type="p">141:第一接觸面</p>
        <p type="p">15:維持元件</p>
        <p type="p">151:第二接觸面</p>
        <p type="p">15a:固定部</p>
        <p type="p">1a:感光元件組</p>
        <p type="p">CR:載板</p>
        <p type="p">IS:電子感光元件</p>
        <p type="p">AA、BB:區域</p>
        <p type="p">AD:膠體</p>
        <p type="p">D-1tocenter:第一接觸面靠近第二接觸面的一側與光軸之間的距離</p>
        <p type="p">D-2tocenter:第二接觸面靠近第一接觸面的一側與光軸之間的距離</p>
        <p type="p">D-armtotop:臂部與鏡筒的物側端之間的距離</p>
        <p type="p">D-armtodown:臂部與鏡筒的像側端之間的距離</p>
        <p type="p">L-2tomount:第二接觸面與固定部之間在平行於光軸的方向上的距離</p>
        <p type="p">T-barrel:鏡筒在平行於光軸的方向上的厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1079" publication-number="202616987">
    <tif-files tif-type="multi-tif">
      <tif file="114114972.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能櫃系統的尋物方法與物品資訊建立方法</chinese-title>
        <english-title>OBJECT SEARCHING AND INFORMATION ESTABLISHING METHODS OF INTELLIGENT CABINET SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120251104B">A47B88/457</main-classification>
        <further-classification edition="200601120251104B">A47B81/00</further-classification>
        <further-classification edition="200601120251104B">A47B96/00</further-classification>
        <further-classification edition="202301120251104B">G06F18/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉駿達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇信誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能櫃系統的尋物方法，該智能櫃系統包含一櫃體、複數個活動件、一控制裝置、一控制單元、一電子模組以及一通訊裝置。這些活動件安排至該櫃體，且這些活動件可相對該櫃體在一收合位置與一開啟位置之間活動；該控制裝置安排至該櫃體；該電子模組包含一驅動裝置用以驅動一驅動件；該通訊裝置可依據與物品相關的識別特徵或語音訊息發出一預定訊號，且該控制裝置接收該預定訊號，使該控制單元依據該預定訊號控制該驅動件從一第一預定狀態活動至一第二預定狀態，用以允許這些活動件的其中之一離開該收合位置。本發明亦提供一種智能櫃系統的物品資訊建立方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object searching method for an intelligent cabinet system including a cabinet, a plurality of movable members, a control device, a control unit, an electronic module and a communication device. These movable members are arranged at the cabinet and are movable between a retracted position and an open position relative to the cabinet. The control device is arranged at the cabinet. The electronic module includes a driving device for driving a drive part. The communication device is configured to transmit a predetermined signal according to an identifying feature or a voice message relating to an object and the control device receives the predetermined signal such that the control unit controls the drive part to move from a first predetermined state to a second predetermined state according to the predetermined signal for allowing one of the movable members to leave the retracted position. The present invention also provides an object information establishing method of the smart cabinet system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S16:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1080" publication-number="202618566">
    <tif-files tif-type="multi-tif">
      <tif file="114115061.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置、記憶體系統以及記憶體系統的操作方法</chinese-title>
        <english-title>MEMORY DEVICE, MEMORY SYSTEM, AND OPERATING METHOD OF MEMORY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">G06F13/16</main-classification>
        <further-classification edition="200601120250703B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WON JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南晧進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, HO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇鎭麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SO, JIN IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具有降低功耗的記憶體控制器的記憶體元件。記憶體元件包括第一揮發性記憶體，包括第一邏輯記憶體元件和CXL記憶體控制器，該CXL記憶體控制器控制第一揮發性記憶體的操作，並透過包括CXL交換器的CXL介面從主機接收對第一揮發性記憶體的請求。CXL記憶體控制器包括粗粒度全域計數器，用以計數接收到的請求數量並儲存計數值，全域熱度監控器，用以根據計數值的各個，確定各個記憶體單元是熱單元還是冷單元，熱度追蹤控制器，用以生成第一位元圖，以及第一熱度追蹤器，用以根據第一位元圖，確定儲存在第一邏輯記憶體元件中包含的多個區段中各個區段中的資料是否為熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a memory device including a memory controller with reduced power consumption. The memory device includes a first volatile memory including a first logical memory device and a CXL memory controller that controls operations of the first volatile memory and receive requests for the first volatile memory from a host through a CXL interface including a CXL switch. The CXL memory controller includes a coarse-grained global counter configured to count a number of requests received store a count value, a global hotness monitor configured to determine, based on respective ones of the count values, whether each memory unit is a hot unit or a cold unit, a hotness tracker controller configured to generate a first bitmap and a first hotness tracker configured to determine, based on the first bitmap, whether data stored in each of the plurality of segments included in the first logical memory device is hot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體系統</p>
        <p type="p">101:主機</p>
        <p type="p">101b:中央處理器(CPU)</p>
        <p type="p">101c:記憶體管理器</p>
        <p type="p">101d:元件驅動程式</p>
        <p type="p">102a:揮發性記憶體</p>
        <p type="p">102b:揮發性記憶體</p>
        <p type="p">103:CXL交換器</p>
        <p type="p">110:CXL記憶體元件</p>
        <p type="p">111:CXL記憶體控制器</p>
        <p type="p">112:揮發性記憶體</p>
        <p type="p">120:粒度全域計數器</p>
        <p type="p">121:全域熱度監控器</p>
        <p type="p">130:熱度追蹤控制器</p>
        <p type="p">131:取樣模組</p>
        <p type="p">132:過濾模組</p>
        <p type="p">133:電源管理模組</p>
        <p type="p">134:點陣圖產生器</p>
        <p type="p">140:熱度追蹤器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1081" publication-number="202618216">
    <tif-files tif-type="multi-tif">
      <tif file="114115119.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115119</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計量測量用帚式攝影機及旋轉台</chinese-title>
        <english-title>BROOM CAMERA AND ROTATIONAL STAGE FOR METROLOGY MEASUREMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G01B11/06</main-classification>
        <further-classification edition="201401120260121B">G01N21/3563</further-classification>
        <further-classification edition="200601120260121B">G01N21/95</further-classification>
        <further-classification edition="200601120260121B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬萊耶夫　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALEEV, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>密卓維克　安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITROVIC, ANDREJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測量薄膜厚度、重疊、及晶圓對晶圓接合重疊的方法，包括：提供基板在配置為旋轉用之處理台上；以寬頻照明光束照明基板；經由高光譜帚式攝影機取得基板之第一線性區域的第一組反射率光譜；經由處理台藉由一旋轉角度逐漸旋轉基板；在每一逐漸旋轉後，經由高光譜帚式攝影機取得基板之線性區域的一組反射率光譜；以及根據藉由高光譜帚式攝影機所取得之複數組反射率光譜來決定基板的厚度分佈，其中每一組反射率光譜包括光之複數波長的個別強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of measuring thin-film thickness, overlay, and wafer-to-wafer bonding overlay, including providing a substrate on a handling stage configured for rotation; illuminating the substrate with a broadband illumination beam; obtaining a first set of reflectivity spectra of a first linear region of the substrate via a hyperspectral broom camera; incrementally rotating the substrate by an angle of rotation via the handling stage; obtaining a set of reflectivity spectra of a linear region of the substrate via the hyperspectral broom camera after each incremental rotation; and determining a thickness distribution of the substrate based on sets of reflectivity spectra obtained by the hyperspectral broom camera, wherein each set of reflectivity spectra includes individual intensities of a plurality of wavelengths of light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樣品</p>
        <p type="p">2:樣品處理台</p>
        <p type="p">3:輸入光</p>
        <p type="p">4:區段</p>
        <p type="p">5:光學偵測器</p>
        <p type="p">X:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1082" publication-number="202618234">
    <tif-files tif-type="multi-tif">
      <tif file="114115164.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115164</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用檢測氣體進行快速密封洩漏測試之方法</chinese-title>
        <english-title>METHOD OF RAPID SEAL LEAK TEST USING DETECTION GAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01M3/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克修　保羅Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCHUGH, PAUL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種於洩漏檢測腔室中檢測氣體洩漏的方法，方法包括：將壓板下降至密封組件的第一側，使壓板與密封組件的第一側形成密封，將晶圓固定於密封組件中，藉由設置於壓板中的閥件將檢測氣體填充至腔體中，以及檢測所述檢測氣體是否存在於洩漏檢測腔室之外。此外，亦提供一種於真空預濕(VPW)腔室中檢測氣體洩漏的方法，方法包括：對密封組件之第一側的第一空間回填檢測氣體，以及檢測所述檢測氣體是否存在於密封組件的第二側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of detecting a gas leak in a leak detection chamber, the method including lowering a pressure plate onto a first side of a seal assembly, sealing the pressure plate to the first side of the seal assembly, retaining a wafer in the seal assembly, filling the cavity with a detection gas through a valve in the pressure plate, and detecting whether the detection gas is present outside of the leak detection chamber. Further, a method of detecting a gas leak in a vacuum pre-wet (VPW) chamber, the method including backfilling a first volume with a detection gas on a first side of the seal assembly; and detecting whether the detection gas is present on a second side of the seal assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:密封組件</p>
        <p type="p">105:彈性體密封件</p>
        <p type="p">115:頂部區段</p>
        <p type="p">120:底部區段</p>
        <p type="p">200:洩漏檢測腔室</p>
        <p type="p">205:壓板</p>
        <p type="p">210:壓板密封件</p>
        <p type="p">215:閥件</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1083" publication-number="202618024">
    <tif-files tif-type="multi-tif">
      <tif file="114115290.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>採用金屬順序溶滲合成製程填充基板上之凹陷特徵的方法</chinese-title>
        <english-title>METHODS OF FILLING A RECESSED FEATURE ON A SUBSTRATE EMPLOYING METAL SEQUENTIAL INFILTRATION SYNTHESIS PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">C23C16/02</main-classification>
        <further-classification edition="200601120260120B">C23C16/04</further-classification>
        <further-classification edition="200601120260120B">C23C16/08</further-classification>
        <further-classification edition="200601120260120B">C23C16/56</further-classification>
        <further-classification edition="200601120260120B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡赫爾　克日什托夫　卡米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KACHEL, KRZYSZTOF KAMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露採用金屬順序溶滲合成製程填充基板上之凹陷特徵的方法。所揭露之方法包括在一凹陷特徵內形成一有機層，以及將金屬物種引入至該有機層中以使得形成一金屬晶種層。隨後可自該金屬晶種層形成一塊狀金屬層以填充該凹陷特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for filling a recessed feature on a substrate employing metal sequential infiltration synthesis processes are disclosed. The disclosed methods include forming an organic layer within a recessed feature and introducing metal species into the organic layer to allow the formation of a metal seed layer. A bulk metal layer can subsequently be formed from the metal seed layer to fill the recessed feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製程</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:子步驟</p>
        <p type="p">108:子步驟</p>
        <p type="p">110:步驟</p>
        <p type="p">114:步驟</p>
        <p type="p">116:子步驟</p>
        <p type="p">118:子步驟</p>
        <p type="p">120:SIS循環迴路</p>
        <p type="p">122:步驟</p>
        <p type="p">124:步驟</p>
        <p type="p">126:子步驟</p>
        <p type="p">128:子步驟</p>
        <p type="p">130:沉積循環迴路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1084" publication-number="202619156">
    <tif-files tif-type="multi-tif">
      <tif file="114115312.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙層天線結構及光學相位陣列晶片</chinese-title>
        <english-title>DOUBLE-LAYER ANTENNA AND OPTICAL PHASED ARRAY CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H01Q1/12</main-classification>
        <further-classification edition="200601120250602B">H01Q1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恩宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, EN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張登翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張合</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　冬冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DONG DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀　潔生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEE, JACK SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙層天線結構，用於光學相位陣列晶片，其包括：基底；底部保護層，設置基底之上；導光層，設置底部保護層之上；光柵層，設置於導光層之上，並具有複數柵體，柵體以間距沿著導光層的第一軸週期排列，各柵體沿導光層的第二軸設置；及頂部保護層，設置於導光層及柵體之上；其中，光柵層的折射率與導光層的折射率不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A double-layer antenna, used for an optical phased array chip, the double-layer antenna includes: a substrate; a bottom protective layer, disposed above the substrate; a light guiding layer, disposed above the bottom protective layer; a grating layer, disposed above the light guiding layer, and including a plurality of grating bodies; the grating bodies arranged periodically with a spacing along a first axis of the light guiding layer; each of the grating bodies disposed along a second axis of the light guiding layer; and a top protective layer, disposed above the light guiding layer and the grating bodies. A refractive index of the grating layer and a refractive index of the light guiding layer are different.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:雙層天線結構</p>
        <p type="p">110:基底</p>
        <p type="p">111:導光層</p>
        <p type="p">112:光柵層</p>
        <p type="p">113B:底部保護層</p>
        <p type="p">113T:頂部保護層</p>
        <p type="p">1121:柵體</p>
        <p type="p">1F:表面</p>
        <p type="p">1H:高度</p>
        <p type="p">2F:表面</p>
        <p type="p">2G:間距</p>
        <p type="p">2H:高度</p>
        <p type="p">2W:寬度</p>
        <p type="p">SA1:第一軸</p>
        <p type="p">SA2:第二軸</p>
        <p type="p">SA3:第三軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1085" publication-number="202619109">
    <tif-files tif-type="multi-tif">
      <tif file="114115313.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250714B">H01L23/522</main-classification>
        <further-classification edition="202501120250714B">H10D1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文苓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余立中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, LI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝怡姍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉子霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TZU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈香谷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HSIANG-KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳殿豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, DIAN-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些實施例中，提供一種半導體裝置，包括：設置在基板上方的互連結構，其中互連結構包括設置在介電層中的導電特徵；設置在互連結構上方的第一鈍化層；設置在蝕刻停止層上方的第二鈍化層；從第二鈍化層的上表面延伸到第二鈍化層中的多個孔和多個溝槽，其中溝槽在平面圖中與蝕刻停止層重疊；設置在第二鈍化層上方並延伸到孔中的第一電容器結構，包括第一導電層、第一絕緣層和第二導電層；以及設置在第二鈍化層上方並延伸到溝槽中的第二電容器結構，包括第三導電層、第二絕緣層和第四導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a semiconductor device is provided. The semiconductor device includes an interconnect structure disposed over a substrate, wherein the interconnect structure includes a conductive feature disposed in a dielectric layer; a first passivation layer disposed over the interconnect structure; a second passivation layer disposed over the etch stop layer; a plurality of holes and a plurality of trenches extending from an upper surface of the second passivation layer into the second passivation layer, wherein the trenches overlap the etch stop layer in a plan view; a first capacitor structure including a first conductive layer, a first insulating layer, and a second conductive layer disposed over the second passivation layer and extending into the holes; and a second capacitor structure including a third conductive layer, a second insulating layer, and a fourth conductive layer disposed over the second passivation layer and extending into the trenches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">200:裝置層</p>
        <p type="p">202:介電層</p>
        <p type="p">204:導電特徵</p>
        <p type="p">250:互連結構</p>
        <p type="p">300:鈍化結構</p>
        <p type="p">310:第一鈍化結構</p>
        <p type="p">312:第一蝕刻停止層</p>
        <p type="p">314:第一鈍化層</p>
        <p type="p">316:第二蝕刻停止層</p>
        <p type="p">318:第二鈍化層</p>
        <p type="p">320:電容器結構</p>
        <p type="p">320A:孔型電容器</p>
        <p type="p">320B:溝槽型電容器</p>
        <p type="p">320C:混合型電容器</p>
        <p type="p">320D:虛設MIM結構</p>
        <p type="p">322:第一導電層</p>
        <p type="p">324:絕緣層</p>
        <p type="p">326:第二導電層</p>
        <p type="p">328A:孔</p>
        <p type="p">328B:溝槽</p>
        <p type="p">329A:孔區域</p>
        <p type="p">329B:溝槽區域</p>
        <p type="p">332:填充層</p>
        <p type="p">350:第二鈍化結構</p>
        <p type="p">352:第三鈍化層</p>
        <p type="p">354:第四鈍化層</p>
        <p type="p">356:介電層</p>
        <p type="p">358:接合層</p>
        <p type="p">360:接合結構</p>
        <p type="p">370:導電穿孔</p>
        <p type="p">372:主導電材料</p>
        <p type="p">374:阻擋層</p>
        <p type="p">376:晶種層</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:深度</p>
        <p type="p">D&lt;sub&gt;2&lt;/sub&gt;:深度</p>
        <p type="p">G&lt;sub&gt;1&lt;/sub&gt;:間隙</p>
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;:厚度</p>
        <p type="p">T&lt;sub&gt;2&lt;/sub&gt;:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1086" publication-number="202619518">
    <tif-files tif-type="multi-tif">
      <tif file="114115314.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251118B">H10D30/01</main-classification>
        <further-classification edition="202501120251118B">H10D30/62</further-classification>
        <further-classification edition="202501120251118B">H10D64/20</further-classification>
        <further-classification edition="200601120251118B">B82B3/00</further-classification>
        <further-classification edition="201101120251118B">B82Y10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諶俊元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳思謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SZU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇煥傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HUAN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在形成源極/汲極接點之後形成其中的凹陷之前，形成金屬矽化物層於半導體裝置的電晶體(如奈米結構電晶體及/或另一種電晶體)的源極/汲極區上。此方式定義的源極/汲極區表面上的金屬矽化物層的覆蓋率，可獨立於源極/汲極接點(由源極/汲極接點形成其中的凹陷定義)的覆蓋率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metal silicide layer is formed on a source/drain region of a transistor (e.g., a nanostructure transistor and/or another type of transistor) of a semiconductor device prior to formation of a recess in which a source/drain contact is to be formed. This enables the coverage of the metal silicide layer on the surface of the source/drain region to be defined independently of the coverage of the source/drain contact (which is defined by the recess in which the source/drain contact is formed).</p>
      </isu-abst>
      <representative-img>
        <p type="p">B-B:剖面</p>
        <p type="p">D1,D2,D3,D4:尺寸</p>
        <p type="p">105:半導體裝置</p>
        <p type="p">160:鰭狀部分</p>
        <p type="p">220:間隔物層</p>
        <p type="p">315:奈米結構通道</p>
        <p type="p">410:內側間隔物</p>
        <p type="p">510:源極/汲極區</p>
        <p type="p">705:主動區隔離結構</p>
        <p type="p">710:介電襯墊</p>
        <p type="p">805:閘極結構</p>
        <p type="p">810:閘極介電層</p>
        <p type="p">815:閘極</p>
        <p type="p">1000:實施方式</p>
        <p type="p">1020:金屬矽化物層</p>
        <p type="p">1025:金屬蓋層</p>
        <p type="p">1030:介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1087" publication-number="202619147">
    <tif-files tif-type="multi-tif">
      <tif file="114115323.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池包</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260123B">H01M50/204</main-classification>
        <further-classification edition="202101120260123B">H01M50/262</further-classification>
        <further-classification edition="202101120260123B">H01M50/536</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河野宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">簡單且容易地將引線板配置於電池座的正確位置，而將引線板與端部電極確實且穩定地電連接。電池包具備：電池單元1，具備端部電極2；電池座10，將電池單元1配置於固定位置；及引線板20，配置於電池座10的固定位置，且連接於端部電極2而成，電池座10是將端面座部11與底面座部12做成一體構造，引線板20是將整體形狀做成L字狀之金屬板，具備端面引線部23與底面引線部24，前述電池包具備將引線板20與電池座10配置於固定位置之第1卡止構造30與第2卡止構造40，第1卡止構造30是使端面引線部23在Y軸方向上移動自如，且阻止Z軸方向的位置偏移，第2卡止構造40是使底面引線部24在Z軸方向上移動自如，且阻止Y軸方向的位置偏移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電池單元</p>
        <p type="p">6:外裝罩殼</p>
        <p type="p">6A:蓋罩殼</p>
        <p type="p">6B:底罩殼</p>
        <p type="p">10:電池座</p>
        <p type="p">20:引線板</p>
        <p type="p">21:第1引線板</p>
        <p type="p">23:端面引線部</p>
        <p type="p">24:底面引線部</p>
        <p type="p">30:第1卡止構造</p>
        <p type="p">31:第1卡止部</p>
        <p type="p">100:電池包</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1088" publication-number="202617052">
    <tif-files tif-type="multi-tif">
      <tif file="114115354.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>供給裝置及供給方法</chinese-title>
        <english-title>SUPPLY APPARATUS AND SUPPLY PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">A61B1/00</main-classification>
        <further-classification edition="200601120260129B">A61B1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商創意特科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRYTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹﨑博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEZAKI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">控制部(72)係進行洗淨液供給部(14)及氣體供給部(16)的控制，而進行洗淨用流體供給動作，該洗淨用流體供給動作係使藉由洗淨液供給部(14)將洗淨液供給至供給管(64)並使洗淨液滯留於供給管(64)的中途部位之後，藉由氣體供給部(16)將氣體供給至供給管(64)從而將洗淨液及氣體的混合體作為洗淨用流體供給至罩蓋(22)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control unit (72) controls a cleaning liquid supply unit (14) and a gas supply unit (16) to perform a cleaning liquid supply operation in which a cleaning liquid is supplied to a supply pipe (64) by the cleaning liquid supply unit (14) to cause the cleaning liquid to accumulate in the middle of the supply pipe (64), and then a gas is supplied to the supply pipe (64) by the gas supply unit (16) to supply a mixture of the cleaning liquid and the gas as a liquid for cleaning to a cover 22.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">12:供給裝置</p>
        <p type="p">14:洗淨液供給部</p>
        <p type="p">16:氣體供給部</p>
        <p type="p">20:硬性內視鏡</p>
        <p type="p">22:罩蓋</p>
        <p type="p">30:洗淨用流體供給單元</p>
        <p type="p">32:第一路徑(路徑)</p>
        <p type="p">34:第二路徑(路徑)</p>
        <p type="p">35:連接部位</p>
        <p type="p">36:第三路徑(路徑)</p>
        <p type="p">38:第四路徑(路徑)</p>
        <p type="p">39:連接部位</p>
        <p type="p">40:第五路徑(路徑)</p>
        <p type="p">42:第一逆止閥</p>
        <p type="p">44:第二逆止閥</p>
        <p type="p">46:第一截止機構(截止機構)</p>
        <p type="p">48:第二截止機構(截止機構)</p>
        <p type="p">50:第三截止機構(截止機構)</p>
        <p type="p">60:洗淨液供給源</p>
        <p type="p">61:洗淨液供給管</p>
        <p type="p">62:氣體供給源</p>
        <p type="p">63:氣體供給管</p>
        <p type="p">64:第一供給管(供給管)</p>
        <p type="p">66:第二供給管(供給管)</p>
        <p type="p">70:控制單元</p>
        <p type="p">72:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1089" publication-number="202617420">
    <tif-files tif-type="multi-tif">
      <tif file="114115379.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提供材料帶，特別是繩帶之設備</chinese-title>
        <english-title>DEVICE FOR PROVIDING A MATERIAL BAND, IN PARTICULAR A CORD BAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250723B">B29D30/00</main-classification>
        <further-classification edition="200601120250723B">B65H16/00</further-classification>
        <further-classification edition="200601120250723B">B29D30/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商費舍爾輪胎技術德國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISCHER TIRETECH GERMANY GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　弗蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　曼努爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMITT, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提供材料帶，特別是繩帶的設備，包括：</p>
        <p type="p">- 一解繞設備，用於解繞一材料帶，包括兩個保持器，每個保持器用於容納一材料帶卷，其中兩個保持器在非操作位置和操作位置之間移動，其中在非操作位置容納有一卷，在操作位置該卷被解繞；</p>
        <p type="p">- 一運輸設備，在該解繞設備的下游，用於運輸已解繞的材料帶；</p>
        <p type="p">- 一設備，用於接入已解繞的材料帶的尾端至待解繞的材料帶的首端；</p>
        <p type="p">- 一位置檢測設備，具有一感測設備，用於檢測感測器資訊，該感測器資訊描述了保持器中材料帶的位置，其中根據該位置資訊待解繞的材料帶的位置可相對於已解繞的材料帶對齊；其特徵在於，所述感測設備能夠在保持器從所述非操作位置移動到所述操作位置期間檢測感測器資訊，並且所述控制裝置被配置為確定所述位置資訊並基於所述位置資訊控制致動器以橫向於運輸設備的運輸方向移動各自的保持器，使得，在移動至操作位置的末端，各自的保持器被定位為使得待解繞的材料帶的末端與已解繞的材料帶的末端對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Device for providing a material band, in particular a cord band, comprising: </p>
        <p type="p">- an unwinding device for unwinding a material band, comprising two holders for receiving a respective roll of the material band, wherein both holders are movable from a non-working position, in which a roll is received, and a working position, in which the roll is unwound, </p>
        <p type="p">- a transport device, downstream of the unwinding device, for the unwound material strip, </p>
        <p type="p">- a device for connecting a rear end of the unwound material band to a front end of the material band to be unwound, </p>
        <p type="p">- a position detection device comprising a sensor device for detecting sensor information which describes the position of the strip material in the holders, and a control device for detecting position information on the basis of the sensor information, wherein the position of the strip material to be unwound relative to the unwound strip material can be aligned as a function of the position information, wherein the sensor information can be detected by means of the sensor device during the movement of the holders from the non-working position into the working position and the control device is designed to determine the position information and to control actuating means for moving the respective holder transversely to the transport direction of the transport device as a function of the position information in such a way that the respective holder is positioned at the end of the movement into the working position in such a way that the end of the material band to be unwound is aligned with the end of the unwound material band.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備</p>
        <p type="p">3a:第一卷、卷</p>
        <p type="p">3c:另一卷、卷</p>
        <p type="p">4a:材料帶</p>
        <p type="p">4b:材料帶</p>
        <p type="p">4c:材料帶</p>
        <p type="p">5:下游運輸設備、運輸設備</p>
        <p type="p">12:控制設備、控制單元</p>
        <p type="p">13:連接設備、連接裝置、設備</p>
        <p type="p">15a:縱向邊緣</p>
        <p type="p">15b:縱向邊緣</p>
        <p type="p">15c:縱向邊緣</p>
        <p type="p">16a:縱向邊緣</p>
        <p type="p">16b:縱向邊緣</p>
        <p type="p">16c:縱向邊緣</p>
        <p type="p">17a:中心</p>
        <p type="p">17b:中心</p>
        <p type="p">17c:中心</p>
        <p type="p">18:第一保持器、保持器、第一接收器</p>
        <p type="p">19:尾端、末端</p>
        <p type="p">20:第二保持器、保持器、第二接收器</p>
        <p type="p">21:公共支撑框架、運送框架、公共運送框架</p>
        <p type="p">22:致動器、位置資訊控制致動器、致動元件</p>
        <p type="p">23:感測器、第一感測器</p>
        <p type="p">24:感測器、第二感測器</p>
        <p type="p">25:檢測區域</p>
        <p type="p">26:檢測區域</p>
        <p type="p">27:首段、末端、首端</p>
        <p type="p">28:第三感測器</p>
        <p type="p">P1:雙箭頭、箭頭</p>
        <p type="p">T:運輸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1090" publication-number="202617799">
    <tif-files tif-type="multi-tif">
      <tif file="114115403.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂粒子、金屬被覆粒子及樹脂材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08F212/36</main-classification>
        <further-classification edition="200601120260126B">C08F220/20</further-classification>
        <further-classification edition="200601120260126B">C09K9/02</further-classification>
        <further-classification edition="200601120260126B">C08L101/00</further-classification>
        <further-classification edition="200601120260126B">H01B1/00</further-classification>
        <further-classification edition="200601120260126B">H01B5/16</further-classification>
        <further-classification edition="200601120260126B">H01R11/01</further-classification>
        <further-classification edition="200601120260126B">H05K3/32</further-classification>
        <further-classification edition="200601120260126B">H05K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯川豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKAWA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高曝露於高溫環境下時之連接構造體之間隙控制性之樹脂粒子。  &lt;br/&gt;本發明之樹脂粒子係包含聚合性成分之聚合物之樹脂粒子，上述聚合性成分包含二乙烯苯、及具有4個以上之(甲基)丙烯醯基之(甲基)丙烯酸酯化合物，將上述樹脂粒子於200℃下壓縮20%時之壓縮彈性模數為1000 N/mm&lt;sup&gt;2&lt;/sup&gt;以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1091" publication-number="202619111">
    <tif-files tif-type="multi-tif">
      <tif file="114115457.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路、裝置以及製造積體電路的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT, DEVICE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">H01L23/525</main-classification>
        <further-classification edition="200601120250703B">H01L23/528</further-classification>
        <further-classification edition="200601120250703B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敬餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JIANN-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體電路包括具有前側和與前側相對的背側的基板。基板包括前側上至少一主動區。電路位於基板前側，且前側金屬化層配置在電路上方。背側金屬化層配置在基板背側下方，且第一電源取用位於電路第一側。第一電源取用配置為從背側金屬化層傳遞一個或多個電壓到前側金屬化層，背側金屬化層電氣耦合到至少一主動區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit includes a substrate having a front side and a back side that is opposite the front side. The substrate includes at least one active region on the front side. A circuit is situated on the front side of the substrate and a front side metallization layer is disposed over the circuit. A back side metallization layer is disposed under the back side of the substrate and a first power pickup is situated on a first side of the circuit. The first power pickup is configured to deliver one or more voltages from the back side metallization layer, that is electrically coupled to the at least one active region, to the front side metallization layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:裝置</p>
        <p type="p">42:電路</p>
        <p type="p">44:電源取用胞元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1092" publication-number="202617941">
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        <document-id>
          <doc-number>114115478</doc-number>
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      <invention-title>
        <chinese-title>電池被覆用油灰、及電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C09K21/02</main-classification>
        <further-classification edition="200601120260126B">C09K21/12</further-classification>
        <further-classification edition="200601120260126B">C09K21/14</further-classification>
        <further-classification edition="201401120260126B">H01M10/658</further-classification>
        <further-classification edition="202101120260126B">H01M50/202</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高津知道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATSU, TOMOMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對隨著電池單元之溫度急遽上升等引起之著火能夠在短時間內滅火，且黏著性、作業性、及對被保護體之追隨性優異的電池被覆用油灰。  &lt;br/&gt;根據本發明，提供一種電池被覆用油灰，其係相對於100質量份之液狀有機化合物，包含10～400質量份之自由基產生劑者，且將包含上述電池被覆用油灰之3 g球狀試片用JIS H4000(A1050P)所規定之2片鋁板夾住並壓縮至厚度5 mm，1分鐘後以300 mm/分鐘之剝離速度進行垂直剝離，剝離時之峰值強度為0.5 N以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:構件</p>
        <p type="p">3:電池單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1093" publication-number="202618696">
    <tif-files tif-type="multi-tif">
      <tif file="114115496.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於內容感知的視訊語義分割管道的使用者裝置、系統及方法</chinese-title>
        <english-title>UE, SYSTEM AND METHOD FOR A VIDEO SEMANTIC SEGMENTATION PIPELINE FOR CONTENT-AWARE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260123B">G06T7/12</main-classification>
        <further-classification edition="202401120260123B">G06T3/18</further-classification>
        <further-classification edition="200601120260123B">G06T5/20</further-classification>
        <further-classification edition="201701120260123B">G06T7/20</further-classification>
        <further-classification edition="202201120260123B">G06V10/771</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦達利　拉瑪　邁蒂利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VADALI, RAMA MYTHILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆達薩爾　布爾漢　艾哈邁德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUDASSAR, BURHAN AHMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇雷什　普里特維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURESH, PRITHVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粟海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希夫香卡　納加拉賈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIVASHANKAR, NAGARAJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍鲁日　奥列格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHORUZHIY, OLEG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦爾　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAWAR, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊爾　哈米　莫斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL-KHAMY, MOSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珉英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁根熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GEUN-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東壎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於內容感知的視訊語義分割管道的使用者裝置、系統和方法。UE的處理器中的語義分割網路基於視訊串流的第一幀產生第一特徵圖。第一特徵圖包括用於產生第一幀的第一分割和信賴度圖資訊。處理器基於第一特徵圖產生視訊串流的第二幀的第二特徵圖。第二特徵圖包括用於產生第二幀的第二分割和信賴度圖的第二資訊。處理器基於第二資訊產生第二分割和信賴度圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A UE, system and method for a video semantic segmentation pipeline for content-aware are provided. A semantic segmentation network in a processor of the UE generates a first feature map based on a first frame the video stream. The first feature map includes first information for generating a first segmentation and confidence map for the first frame. The processor generates a second feature map for a second frame of the video stream based on the first feature map. The second feature map includes second information for generating a second segmentation and confidence map for the second frame. The processor generates the second segmentation and confidence map based on the second information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:輸入影像</p>
        <p type="p">204:視訊語義分割管道</p>
        <p type="p">206:分割圖</p>
        <p type="p">208:信賴度圖</p>
        <p type="p">210:影像訊號處理器</p>
        <p type="p">212:內容感知配置模組</p>
        <p type="p">214:去雜訊模組</p>
        <p type="p">216:色彩增強模組</p>
        <p type="p">218:銳化模組</p>
        <p type="p">220:增強輸出影像</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1094" publication-number="202618607">
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          <doc-number>202618607</doc-number>
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        <document-id>
          <doc-number>114115549</doc-number>
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      <invention-title>
        <chinese-title>路由互連結構中之跡線的處理裝置及方法以及非暫時性電腦可讀媒體</chinese-title>
        <english-title>PROCESSING DEVICE AND METHOD OF ROUTING TRACES OF AN INTERCONNECT STRUCTURE, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250801B">G06F30/394</main-classification>
        <further-classification edition="202001120250801B">G06F30/39</further-classification>
        <further-classification edition="200601120250801B">H01L23/535</further-classification>
        <further-classification edition="200601120250801B">H01L23/538</further-classification>
        <further-classification edition="202001320250801B">G06F115/12</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宏任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林欣穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳皇宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李雲漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種路由互連結構中之跡線的實施例方法包括導出互連結構之第一區域中的第一複數個路由節點之第一容量資訊，並基於第一容量資訊產生連接第一複數個路由節點的第一複數個經預測跡線。路由互連結構中之跡線的方法包括導出互連結構之第二區域中的第二複數個路由節點之第二容量資訊，並基於第二容量資訊產生連接第二複數個路由節點的第二複數個經預測跡線。路由互連結構中之跡線的方法進一步包括基於第一複數個經預測跡線及第二複數個經預測跡線產生連接第一複數個路由節點與第二複數個路由節點的複數個跡線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment method of routing traces of an interconnect structure includes deriving first capacity information of a first plurality of routing nodes in a first area of the interconnect structure and generating a first plurality of predicted traces connecting the first plurality of routing nodes based on the first capacity information. The method of routing traces of the interconnect structure includes deriving second capacity information of a second plurality of routing nodes in a second area of the interconnect structure, and generating a second plurality of predicted traces connecting the second plurality of routing nodes based on the second capacity information. The method of routing traces of the interconnect structure further includes generating a plurality of traces connecting the first plurality of routing nodes and the second plurality of routing nodes based on the first plurality of predicted traces and the second plurality of predicted traces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:製程流程</p>
        <p type="p">510~540:階段</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1095" publication-number="202618945">
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      <isuno>9</isuno>
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        <document-id>
          <doc-number>114115638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路晶片與其製作方法與封裝結構</chinese-title>
        <english-title>INTEGRATED CIRCUIT CHIP AND METHOD OF FABRICATING THE SAME AND PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">H01L21/60</main-classification>
        <further-classification edition="200601120251023B">H01L23/52</further-classification>
        <further-classification edition="200601120251023B">H01L23/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊芷欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王良瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構包括穿矽通孔以自背側電源軌輸送電源至前側裝置，以及饋穿通孔以輸送訊號於背側內連線結構與前側內連線結構之間。穿矽通孔可減少半導體結構中的電阻電容延遲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes Through Silicon Vias (TSVs) for delivering power from a backside power rail to a front side device layer and Feed Through Vias (FTVs) for delivering signals between a backside interconnect structures and a front side interconnect structure. The TSV provides reduces RC delays in the semiconductor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:第一積體電路晶片</p>
        <p type="p">100b:第二積體電路晶片</p>
        <p type="p">104:裝置層</p>
        <p type="p">106:前側內連線結構</p>
        <p type="p">108:背側內連線結構</p>
        <p type="p">110:饋穿通孔導體</p>
        <p type="p">112:穿矽通孔導體</p>
        <p type="p">300:封裝結構</p>
        <p type="p">301:承載晶圓</p>
        <p type="p">302,308:重布線層</p>
        <p type="p">304:接合膜</p>
        <p type="p">306:接合墊結構</p>
        <p type="p">310:外部連接物</p>
        <p type="p">312:電源輸送路徑</p>
        <p type="p">314:訊號路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1096" publication-number="202619492">
    <tif-files tif-type="multi-tif">
      <tif file="114115673.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619492</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可程式化電阻記憶體元件之崩潰減輕</chinese-title>
        <english-title>BREAKDOWN MITIGATION FOR PROGRAMMABLE RESISTANCE MEMORY ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">H10B61/00</main-classification>
        <further-classification edition="200601120251201B">G11C11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商晟碟科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDISK TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞達托　馬利歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUDATO, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波茲達各　卡德里耶德尼茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOZDAG, KADRIYE DENIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩恩斯　朱安Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAENZ, JUAN P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡薩梅汀　迪米特里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOUSSAMEDDINE, DIMITRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">用於降低一可程式化電阻記憶體單元中之一臨限切換選擇器的臨限電壓的技術。記憶體系統在控制電路系統以跨該可程式化電阻記憶體單元施加一電壓以降低該可程式化電阻記憶體單元中之一臨限切換選擇器的一臨限電壓時，將一第一控制信號施加至該電路系統以建立與該可程式化電阻記憶體單元、一字線、及一位元線串聯的電晶體之一第一電阻。該記憶體系統將一第二控制信號施加至該電路系統以建立與該可程式化電阻記憶體單元、該字線、及該位元線串聯的該電路系統之一第二電阻，以讀取該經選擇可程式化電阻記憶體。該第二電阻低於該第一電阻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Technology for lowering the threshold voltage of a threshold switching selector in a programmable resistance memory cell. The memory system applies a first control signal to circuitry to establish a first resistance of transistors in series with the programmable resistance memory cell, a word line and a bit line when controlling the circuitry to apply a voltage across the programmable resistance memory cell to lower a threshold voltage of a threshold switching selector in the programmable resistance memory cell. The memory system applies a second control signal to the circuitry to establish a second resistance of the circuitry in series with the programmable resistance memory cell, the word line and the bit line to read the selected programmable resistance memory. The second resistance is lower than the first resistance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體系統</p>
        <p type="p">102:記憶體控制器</p>
        <p type="p">104:記憶體；儲存器</p>
        <p type="p">120:主機</p>
        <p type="p">122:主機處理器</p>
        <p type="p">124:主機記憶體</p>
        <p type="p">126:介面</p>
        <p type="p">128:匯流排</p>
        <p type="p">140:局域記憶體</p>
        <p type="p">152:主機介面</p>
        <p type="p">154:晶片上網路</p>
        <p type="p">156:處理器</p>
        <p type="p">158:ECC引擎</p>
        <p type="p">160:記憶體介面</p>
        <p type="p">164:局域記憶體控制器</p>
        <p type="p">172:再新邏輯</p>
        <p type="p">174:損耗等級</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1097" publication-number="202619554">
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          <doc-number>202619554</doc-number>
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        <document-id>
          <doc-number>114115855</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成電晶體及矽化物區域之方法</chinese-title>
        <english-title>A METHOD OF FORMING TRANSISTORS AND SILICIDE REGIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250905B">H10D84/01</main-classification>
        <further-classification edition="200601120250905B">H01L21/302</further-classification>
        <further-classification edition="200601120250905B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宇婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿蓓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王菘豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王歆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李沛樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, OLIVIA PEI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱家宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　煒業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOH, WEI-YIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃浩欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括形成源極/汲極區域、在源極/汲極區域上方形成接觸蝕刻終止層、在接觸蝕刻終止層上方形成層間介電，以及執行蝕刻製程以在層間介電及接觸蝕刻終止層中形成接觸開口。源極/汲極區域暴露於接觸開口。執行矽化物形成製程以在源極/汲極區域的表面上形成矽化物區域。執行蝕刻製程以移除沉積於介電區域上的金屬，其中在第一矽化物形成製程期間暴露介電區域。在接觸開口中形成接觸插塞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a source/drain region, forming a contact etch stop layer over the source/drain region, forming an inter-layer dielectric over the contact etch stop layer, and performing an etching process to form a contact opening in the inter-layer dielectric and the contact etch stop layer. The source/drain region is exposed to the contact opening. A silicide formation process is performed to form a silicide region on a surface of the source/drain region. An etching process is performed to remove a metal that is deposited on dielectric regions, wherein the dielectric regions are exposed during the first silicide formation process. A contact plug is formed in the contact opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:晶圓</p>
        <p type="p">10:CFET</p>
        <p type="p">10L:下部奈米結構FET</p>
        <p type="p">10U:上部奈米結構FET</p>
        <p type="p">26:通道區域/半導體奈米結構</p>
        <p type="p">26’L:下部半導體奈米結構</p>
        <p type="p">26’M:虛設半導體層</p>
        <p type="p">26’U:上部半導體奈米結構</p>
        <p type="p">44:閘極間隔物</p>
        <p type="p">54:內部間隔物</p>
        <p type="p">56:介電隔離層</p>
        <p type="p">62:源極/汲極區域</p>
        <p type="p">62L:下部源極/汲極區域</p>
        <p type="p">62U:上部源極/汲極區域</p>
        <p type="p">66:第一CESL</p>
        <p type="p">68:第一ILD</p>
        <p type="p">70:第二CESL</p>
        <p type="p">78:閘極介電</p>
        <p type="p">80:閘極電極</p>
        <p type="p">80L:下部閘極電極</p>
        <p type="p">80U:上部閘極電極</p>
        <p type="p">90:閘極堆疊</p>
        <p type="p">90L:下部閘極堆疊</p>
        <p type="p">90U:上部閘極堆疊</p>
        <p type="p">118:蝕刻終止層</p>
        <p type="p">120、164:介電層</p>
        <p type="p">124:介電襯墊</p>
        <p type="p">126P:矽化物區域</p>
        <p type="p">130N、130N1、130N2:矽化物區域</p>
        <p type="p">140、140A、140B:接觸插塞</p>
        <p type="p">156:介電基板</p>
        <p type="p">158:矽化物區域</p>
        <p type="p">160:接觸插塞</p>
        <p type="p">162:背側重分佈線</p>
        <p type="p">182A、182B:金屬區域/金屬島</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1098" publication-number="202619555">
    <tif-files tif-type="multi-tif">
      <tif file="114115945.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250905B">H10D84/01</main-classification>
        <further-classification edition="202501120250905B">H10D84/82</further-classification>
        <further-classification edition="200601120250905B">H01L21/20</further-classification>
        <further-classification edition="200601120250905B">H01L21/324</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿蓓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宇婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊孟熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MENG-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李沛樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, OLIVIA PEI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡寬侃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, KUAN-KAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王菘豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林斌彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PINYEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括：圖案化穿過第一介電層的第一開口以曝露第一源極/汲極區；在第一源極/汲極區上形成第一矽化物區；沿第一開口的表面沈積複數個第一多環芳烴；執行退火製程以將這些第一多環芳烴轉變為第一石墨烯層；以及用第一金屬材料填充第一開口的剩餘部分。在另一實施例中，方法進一步包括：形成穿過第一介電層、第二源極/汲極區及第三介電層的第二開口以曝露第三源極/汲極區，其中在俯視圖中，第二源極/汲極區與第三源極/汲極區重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes patterning a first opening through a first dielectric layer to expose a first source/drain region; forming a first silicide region on the first source/drain region; depositing a first plurality of polycyclic aromatic hydrocarbons along surfaces of the first opening; performing an annealing process to convert the first plurality of polycyclic aromatic hydrocarbons into a first graphene layer; and filling a remainder of the first opening with a first metal material. In another embodiment, the method further includes forming a second opening through the first dielectric layer, a second source/drain region, and a third dielectric layer to expose a third source/drain region, wherein in a top-down view the second source/drain region overlaps the third source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板、半導體基板</p>
        <p type="p">20':半導體條、條、半導體鰭片、鰭片</p>
        <p type="p">32:淺溝槽隔離(STI)區、隔離區</p>
        <p type="p">45:鰭片間隔物</p>
        <p type="p">62L:下源極/汲極區、下磊晶源極/汲極區</p>
        <p type="p">62U:上源極/汲極區、上磊晶源極/汲極區、磊晶源極/汲極區</p>
        <p type="p">66:第一接觸蝕刻終止層(CESL)、CESL</p>
        <p type="p">68:第一ILD</p>
        <p type="p">70:CESL、第二CESL</p>
        <p type="p">72:ILD、第二ILD</p>
        <p type="p">82:源極/汲極接觸開口</p>
        <p type="p">82L:下源極/汲極接觸開口</p>
        <p type="p">82U:上源極/汲極接觸開口</p>
        <p type="p">84:金屬半導體合金區</p>
        <p type="p">84L:下金屬半導體合金區</p>
        <p type="p">84U:上金屬半導體合金區</p>
        <p type="p">86:接觸襯墊前驅物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1099" publication-number="202617130">
    <tif-files tif-type="multi-tif">
      <tif file="114115954.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水性化妝料</chinese-title>
        <english-title>AQUEOUS COSMETIC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K8/67</main-classification>
        <further-classification edition="200601120260202B">A61K8/49</further-classification>
        <further-classification edition="200601120260202B">A61K8/73</further-classification>
        <further-classification edition="200601120260202B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芳珂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANCL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益川直子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUKAWA, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種新穎的水性化妝料，其儘管包含生育酚磷酸鹽，但滲透感優異，不乾澀、黏膩，使用感優異。作為解決手段，係提供含有下述(A)至(C)成分之水性化妝料。  &lt;br/&gt;(A)生育酚磷酸鹽  &lt;br/&gt;(B)丙胺醯基麩醯胺酸及／或羥基脯胺酸  &lt;br/&gt;(C)小核菌膠</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a new aqueous cosmetic that contains tocopheryl phosphate, yet having excellent penetration and feeling of use without any squeaky or sticky feelings. As a solution, provided is an aqueous cosmetic that contains the following components (A) to (C): &lt;br/&gt;(A) tocopheryl phosphate &lt;br/&gt;(B) alanyl glutamine and/or hydroxyproline &lt;br/&gt;(C) sclerotium gum</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1100" publication-number="202619556">
    <tif-files tif-type="multi-tif">
      <tif file="114115978.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260128B">H10D84/01</main-classification>
        <further-classification edition="202501120260128B">H10D84/85</further-classification>
        <further-classification edition="202501120260128B">H10D30/62</further-classification>
        <further-classification edition="202501120260128B">H10D64/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商台積電亞利桑那公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSMC ARIZONA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　作宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭琮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, TSUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李維元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王智麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括：分別在第一半導體區及第二半導體區上方形成第一閘極介電質及第二閘極介電質；形成第一功函數層，第一功函數層包含分別在第一閘極介電質及第二閘極介電質上方的第一部分及第二部分；圖案化第一功函數層以移除第一功函數層的第二部分；及形成第二功函數層，第二功函數層包含分別在第一閘極介電質及第二閘極介電質上方的第一部分及第二部分。方法進一步包括：執行一蝕刻製程以蝕刻第二功函數層及第一功函數層之第一部分的一部分以形成一開口；及在第二功函數層上方沈積一導電層。導電層填充至開口中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a first gate dielectric and a second gate dielectric over a first semiconductor region and a second semiconductor region, respective, forming a first work-function layer comprising a first portion and a second portion over the first gate dielectric and the second gate dielectric, respectively, patterning the first work-function layer to remove the second portion of the first work-function layer, and forming a second work-function layer comprising a first portion and a second portion over the first gate dielectric and the second gate dielectric, respectively. The method further includes performing an etching process to etch the second work-function layer and a part of the first portion of the first work-function layer to form an opening, and depositing a conductive layer over the second work-function layer. The conductive layer is filled into the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">21N:井區</p>
        <p type="p">21P:井區</p>
        <p type="p">22:隔離區</p>
        <p type="p">24’N:突出鰭片</p>
        <p type="p">24’P:突出鰭片</p>
        <p type="p">24’:突出鰭片</p>
        <p type="p">24N:半導體條帶</p>
        <p type="p">24P:半導體條帶</p>
        <p type="p">24:半導體條帶</p>
        <p type="p">52A:介面層</p>
        <p type="p">52B:高k介電層</p>
        <p type="p">52:閘極介電質</p>
        <p type="p">54:功函數層</p>
        <p type="p">54N:N型功函數層</p>
        <p type="p">54P:p型功函數(PWF)層</p>
        <p type="p">68:黏著層</p>
        <p type="p">70:填充金屬層</p>
        <p type="p">72N:閘極電極</p>
        <p type="p">72P:閘極電極</p>
        <p type="p">72:閘極電極</p>
        <p type="p">74N:堆疊</p>
        <p type="p">74P:閘極堆疊</p>
        <p type="p">74:閘極電極堆疊</p>
        <p type="p">76N:N型電晶體</p>
        <p type="p">76P:p型電晶體</p>
        <p type="p">78:切割金屬邊界(CMB)區</p>
        <p type="p">100N:裝置區</p>
        <p type="p">100P:裝置區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1101" publication-number="202618966">
    <tif-files tif-type="multi-tif">
      <tif file="114115998.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115998</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理設備及處理方法</chinese-title>
        <english-title>PROCESSING APPARATUS AND PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01L21/67</main-classification>
        <further-classification edition="200601120251201B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜梃竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, TING-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉勇村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUNG-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭光偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種設備。該設備包括：一晶圓支撐結構；在該晶圓支撐結構上方的一腔室，該腔室界定上覆於該晶圓支撐結構之一排放開口；及在該晶圓支撐結構與該排放開口之間的一氣流控制結構。該氣流控制結構包括：一第一區域，其界定具有一第一大小之一第一開口；一第三區域，其界定各自具有一第三大小之複數個第三開口，該第一區域比該第三區域更接近該氣流控制結構之一中心；及一第二區域，其在該第一區域與該第三區域之間，該第二區域界定各自具有一第二大小之複數個第二開口，該第二大小超過該第三大小，該第一大小超過該第二大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus is provided. The apparatus includes: a wafer support structure; a chamber over the wafer support structure, the chamber defining an exhaust opening that overlies the wafer support structure; and a gas flow control structure between the wafer support structure and the exhaust opening. The gas flow control structure includes: a first region defining a first opening having a first size; a third region defining a plurality of third openings each having a third size, the first region being more proximal a center of the gas flow control structure than the third region; and a second region between the first region and the third region, the second region defining a plurality of second openings each having a second size, the second size exceeding the third size, the first size exceeding the second size.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備，熱處理設備</p>
        <p type="p">110:晶圓支撐台</p>
        <p type="p">110a:主表面，表面，安裝表面</p>
        <p type="p">120:晶圓抬升總成</p>
        <p type="p">122:支撐接腳</p>
        <p type="p">124:驅動器</p>
        <p type="p">130:腔室</p>
        <p type="p">132:上壁</p>
        <p type="p">134:側壁</p>
        <p type="p">136:安裝環，保護環</p>
        <p type="p">138:下側壁</p>
        <p type="p">140:氣體導流器，氣流控制結構</p>
        <p type="p">140a:下側表面</p>
        <p type="p">141:導流板</p>
        <p type="p">142:中心孔洞，孔洞</p>
        <p type="p">144:中間或中央孔洞，孔洞</p>
        <p type="p">146:周緣孔洞，孔洞</p>
        <p type="p">150:半導體晶圓，晶圓</p>
        <p type="p">150a:經塗佈表面，表面，晶圓表面，上表面</p>
        <p type="p">160:空間</p>
        <p type="p">170:排放開口</p>
        <p type="p">172:泵</p>
        <p type="p">180:氣體供應開口</p>
        <p type="p">190:控制器</p>
        <p type="p">D1:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1102" publication-number="202617537">
    <tif-files tif-type="multi-tif">
      <tif file="114116017.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彈性紙板緩衝墊</chinese-title>
        <english-title>RESILIENT CARDBOARD CUSHION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250804B">B65D81/02</main-classification>
        <further-classification edition="200601120250804B">B65D85/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商捷比達有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YFY JUPITER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅之伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHIH-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種彈性紙板緩衝墊包含有一頂部支撐板、一折疊紙板彈簧、一底部支撐板以及一滑動支撐腳。折疊紙板彈簧連接於頂部支撐板的第一側邊，底部支撐板連接於折疊紙板彈簧，滑動支撐腳連接於頂部支撐板的第二側邊，且滑動支撐腳配置成與底部支撐板滑動接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resilient cardboard cushion includes a top supporting board, a folded cardboard spring, a bottom supporting board, and a slidable supporting foot. The folded cardboard spring is connected to a first side of the top supporting board, the bottom supporting board is connected to the folded cardboard spring, and the slidable supporting foot is connected to a second side of the top supporting board and is configured to be slidably engaged with the bottom supporting board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:彈性紙板緩衝墊</p>
        <p type="p">110:頂部支撐板</p>
        <p type="p">111:圓形開口</p>
        <p type="p">112:第一側邊</p>
        <p type="p">114:第二側邊</p>
        <p type="p">116:第三側邊</p>
        <p type="p">118:第四側邊</p>
        <p type="p">120:折疊紙板彈簧</p>
        <p type="p">122:第一折疊板</p>
        <p type="p">124:第二折疊板</p>
        <p type="p">130:底部支撐板</p>
        <p type="p">132:U形開口</p>
        <p type="p">140:滑動支撐腳</p>
        <p type="p">150:滑動凸出底板</p>
        <p type="p">160:缺口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1103" publication-number="202619112">
    <tif-files tif-type="multi-tif">
      <tif file="114116063.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250714B">H01L23/528</main-classification>
        <further-classification edition="200601120250714B">H01L21/768</further-classification>
        <further-classification edition="200601120250714B">H01L21/762</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施養鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YANG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊芷欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王茂南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MAO-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昀昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體結構，包括基板、介電結構、環形結構、以及導孔結構。介電結構包括多個介電層，介電層包括設置在基板的前側上的多個前側介電層以及設置在基板的背側上的多個背側介電層。環形結構設置在基板和介電結構中。導孔結構的長度方向沿垂直方向延伸，且位於環形結構包圍的區域內。環形結構包括設置在介電結構的介電層中的多個金屬特徵。在俯視視角中，環形結構具有環形圖案，且金屬特徵的一者橫向延伸超出環形圖案的外側壁，以連接到二極體或導電通孔。導電通孔連接到第一參考電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate, a dielectric structure including a plurality of dielectric layers, a ring structure disposed in the substrate and the dielectric structure, and a via structure extending lengthwise along a vertical direction and in a region surrounded by the ring structure. The plurality of dielectric layers include a plurality of frontside dielectric layers disposed on a front side of the substrate and a plurality of backside dielectric layers disposed on a back side of the substrate. The ring structure includes metal features disposed in the plurality of dielectric layers of the dielectric structure. In a top view, the ring structure has a ring pattern, and one of the metal features extends laterally beyond outer sidewalls of the ring pattern to be connected to a diode or a conductive via. The conductive via is connected to a first reference voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:結構</p>
        <p type="p">202:基板</p>
        <p type="p">206:源極/汲極特徵</p>
        <p type="p">214:層間介電層</p>
        <p type="p">218:前側介電結構</p>
        <p type="p">220:前側導電結構</p>
        <p type="p">222:金屬線</p>
        <p type="p">224:導孔</p>
        <p type="p">226:延伸金屬線</p>
        <p type="p">226’:延伸部</p>
        <p type="p">228:放電結構</p>
        <p type="p">229:額外介電層</p>
        <p type="p">230:頂部金屬線</p>
        <p type="p">232:背側介電層</p>
        <p type="p">234:背側接點</p>
        <p type="p">236:裝置層結構</p>
        <p type="p">238:背側介電結構</p>
        <p type="p">240:背側導電結構</p>
        <p type="p">250:背側金屬線</p>
        <p type="p">252:背側導孔</p>
        <p type="p">254:護環結構</p>
        <p type="p">256:基板穿孔</p>
        <p type="p">261:底部金屬線</p>
        <p type="p">262:背側介電層</p>
        <p type="p">264:背側介電結構</p>
        <p type="p">BM0,BM1,BM2,BM3,BM4,BV0,BV1,BV2,BV3,M0,M1,M2,M3,M4,M5,M6,M7,M8,M9,M10,M11,M12,M13,M14,M15,V0,V1,V2,V3,V4,V5,V6,V7,V8,V9,V10,V11,V12,V13,V14:階</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1104" publication-number="202618843">
    <tif-files tif-type="multi-tif">
      <tif file="114116074.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於阻滯能量分析儀感測器的校準套件</chinese-title>
        <english-title>CALIBRATION KIT FOR RETARDING ENERGY ANALYZER SENSORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01J37/147</main-classification>
        <further-classification edition="200601120260122B">H01J37/32</further-classification>
        <further-classification edition="200601120260122B">G01J3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴亞蒂　阿米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYATI, AMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾米希　安科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLMICH, ANKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史拉曼　思凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHRAMM, SVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾姆斯　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALMS, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈迪森　林賽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARDISON, LINDSAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏梅許　蘇哈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMESH, SUHAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所描述的某些實施例與用於校準裝置感測器的方法有關，該方法包含將參考感測器插入校準系統，其中該校準系統。在實施例中，該校準系統包含光源和光子偵測器。在實施例中，該方法進一步包含量測從光源透過參考感測器傳送至光子偵測器的光的量的參考傳輸值，並將裝置感測器插入校準系統。在實施例中，該方法進一步包含量測從光源透過裝置感測器傳送至光子偵測器的光的量的傳輸值，並計算裝置感測器的縮放因子。在實施例中，該縮放因子將裝置感測器的傳輸值與參考感測器的參考傳輸值進行等化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments described herein relate to a method of calibrating a device sensor that includes inserting a reference sensor into a calibration system, where the calibration system. In an embodiment, the calibration system includes a light source, and a photonic detector. In an embodiment, the method further includes measuring a reference transmission value of an amount of light from the light source that is transmitted through the reference sensor towards the photonic detector, and inserting the device sensor into the calibration system. In an embodiment, the method further includes measuring a transmission value of the amount of light from the light source that is transmitted through the device sensor towards the photonic detector, and calculating a scaling factor for the device sensor. In an embodiment, the scaling factor equalizes the transmission value of the device sensor to the reference transmission value of the reference sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">670:製程</p>
        <p type="p">671:操作</p>
        <p type="p">672:操作</p>
        <p type="p">673:操作</p>
        <p type="p">674:操作</p>
        <p type="p">675:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1105" publication-number="202618802">
    <tif-files tif-type="multi-tif">
      <tif file="114116105.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動作改善提案裝置、動作改善提案方法、動作改善提案管理程式、及動作改善提案系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260123B">G16H50/20</main-classification>
        <further-classification edition="201801120260123B">G16H40/63</further-classification>
        <further-classification edition="200601120260123B">A61B5/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植田智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤元喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDO, MOTOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋翔平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山宮慎一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMIYA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本松達朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOMATSU, TATSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之動作改善提案裝置具備：動作相關資訊獲取部，其獲取使用者進行預定動作期間之動作相關資訊；選定部，其選定用於改善上述預定動作之身體健康照護提案；及通知控制部，其將選定之上述身體健康照護提案通知給預定通知目標；且上述選定部使用獲取之上述動作相關資訊來選定上述身體健康照護提案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:提案選定裝置</p>
        <p type="p">201:動作資訊獲取部</p>
        <p type="p">202:第1判別部</p>
        <p type="p">203:第2判別部</p>
        <p type="p">204:第1評估部</p>
        <p type="p">205:第2評估部</p>
        <p type="p">206:選定部</p>
        <p type="p">207:通知控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1106" publication-number="202618869">
    <tif-files tif-type="multi-tif">
      <tif file="114116158.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結構體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01L21/02</main-classification>
        <further-classification edition="200601120260202B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茅場靖剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAYABA, YASUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四釜拓生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIKAMA, TAKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡太航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村佳保里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, KAHORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">結構體的製造方法包括：準備具有基板、第一有機材料層、以及第二有機材料層的中間結構體的步驟，所述基板具有在表面露出的電極，所述第一有機材料層在所述基板上以覆蓋所述電極的方式配置，且包含第一有機材料，所述第二有機材料層在所述基板上以不覆蓋所述電極的方式配置，且包含第二有機材料；以及使所述中間結構體的表面與第一溶媒接觸，溶解除去在該表面露出的所述第一有機材料層，使所述電極露出的步驟。所述第一有機材料層相對於所述第一溶媒的溶解度大於所述第二有機材料相對於所述第一溶媒的溶解度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基板</p>
        <p type="p">11a:半導體基板</p>
        <p type="p">11b:器件層</p>
        <p type="p">11c:絕緣層</p>
        <p type="p">11d:電極</p>
        <p type="p">13A:包含組成物的硬化物的第二有機材料層/組成物的硬化物層/第二有機材料層</p>
        <p type="p">15:金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1107" publication-number="202619497">
    <tif-files tif-type="multi-tif">
      <tif file="114116186.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相變材料裝置及用於形成其之方法</chinese-title>
        <english-title>PHASE CHANGE MATERIAL DEVICE AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">H10B63/10</main-classification>
        <further-classification edition="200601120250801B">B24B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昶智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝智仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可藉由下列來提供一種相變記憶體裝置：形成一底部電極、一介電材料層及延伸穿過該介電材料層之一通孔開口，以使得該底部電極之一頂部表面段暴露於該通孔開口底下；在該通孔開口之一周邊區中形成一管狀介電間隔件；在該介電材料層及該管狀介電間隔件上方沉積包括一加熱器襯裡層、包含一相變材料之一相變材料層及一頂部電極材料層的一連續層體堆疊；以及使該連續層體堆疊圖案化成包括一加熱器襯裡、一相變材料部分及一頂部電極的一層體堆疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A phase change memory device may be provided by forming a bottom electrode, a dielectric material layer, and a via opening extending through the dielectric material layer such that a top surface segment of the bottom electrode is exposed underneath the via opening; forming a tubular dielectric spacer in a peripheral region of the via opening; depositing a continuous layer stack including a heater liner layer, a phase change material layer comprising a phase change material, and a top electrode material layer over the dielectric material layer and the tubular dielectric spacer; and patterning the continuous layer stack into a layer stack including a heater liner, a phase change material portion, and a top electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:基體</p>
        <p type="p">9:半導體材料層</p>
        <p type="p">38:底部電極</p>
        <p type="p">41:通孔開口</p>
        <p type="p">42:管狀介電間隔件</p>
        <p type="p">50:相變記憶體胞元，相變記憶體裝置</p>
        <p type="p">52:加熱器襯裡，加熱器元件</p>
        <p type="p">54:相變材料部分</p>
        <p type="p">56:頂部電極</p>
        <p type="p">58:側壁襯裡</p>
        <p type="p">62:金屬互連結構，頂部接觸通孔結構</p>
        <p type="p">100:記憶體陣列區</p>
        <p type="p">300:周邊區</p>
        <p type="p">601:第一介電材料層，接觸層級介電材料層，介電材料層，互連層級介電材料層</p>
        <p type="p">610:第一互連層級介電材料層，介電材料層，互連層級介電材料層</p>
        <p type="p">612:裝置接觸通孔結構，金屬互連結構</p>
        <p type="p">618:第一金屬線路結構，金屬互連結構</p>
        <p type="p">620:第二互連層級介電材料層，介電材料層，互連層級介電材料層</p>
        <p type="p">622:第一金屬通孔結構，金屬互連結構</p>
        <p type="p">628:第二金屬線路結構，金屬線路結構，金屬互連結構</p>
        <p type="p">630:第三互連層級介電材料層，介電材料層，互連層級介電材料層</p>
        <p type="p">632:第二金屬通孔結構，金屬互連結構</p>
        <p type="p">638:第三金屬線路結構，金屬線路結構，金屬互連結構</p>
        <p type="p">640:第四互連層級介電材料層，介電材料層</p>
        <p type="p">641:下部第四互連層級介電材料層，介電材料層，互連層級介電材料層</p>
        <p type="p">642:金屬互連結構，第三金屬通孔結構</p>
        <p type="p">643:囊封介電層</p>
        <p type="p">648:金屬互連結構，第四金屬線路結構</p>
        <p type="p">700:半導體裝置</p>
        <p type="p">701:程式化電晶體，場效電晶體</p>
        <p type="p">702:周邊電晶體，場效電晶體</p>
        <p type="p">720:淺溝槽隔離結構</p>
        <p type="p">S:垂直延伸接縫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1108" publication-number="202619498">
    <tif-files tif-type="multi-tif">
      <tif file="114116187.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用側壁襯裡之相變材料裝置及用於形成其之方法</chinese-title>
        <english-title>PHASE CHANGE MATERIAL DEVICE USING A SIDEWALL LINER AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251204B">H10B63/10</main-classification>
        <further-classification edition="202501120251204B">H10D62/40</further-classification>
        <further-classification edition="202501120251204B">H10D62/80</further-classification>
        <further-classification edition="202501120251204B">H10D64/20</further-classification>
        <further-classification edition="202501120251204B">H10D88/00</further-classification>
        <further-classification edition="200601120251204B">H01L21/31</further-classification>
        <further-classification edition="200601120251204B">H01L21/762</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昶智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁裕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泓儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUNG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可藉由下列來提供一裝置結構：在一介電材料層內形成一底電極及一加熱器元件；沉積及圖案化一連續層體堆疊，其包括一底襯裡層、包括一相變材料之一相變材料層以及一頂電極材料層；以及藉由沉積及圖案化一側壁襯裡材料來形成至少一側壁襯裡。至少一側壁襯裡係形成於該連續層體堆疊之一圖案化部分的至少一側壁上。該至少一側壁襯裡包括所具有之一電導率高於該相變材料之一非晶相之一電導率的一材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device structure may be provided by forming a bottom electrode and a heater element within a dielectric material layer; depositing and patterning a continuous layer stack including a bottom liner layer, a phase change material layer including a phase change material, and a top electrode material layer; and forming at least one sidewall liner by depositing and patterning a sidewall liner material. At least one sidewall liner is formed on at least one sidewall of a patterned portion of the continuous layer stack. The at least one sidewall liner includes a material having an electrical conductivity that is higher than an electrical conductivity of an amorphous phase of the phase change material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:基體</p>
        <p type="p">9:半導體材料層</p>
        <p type="p">42:底電極</p>
        <p type="p">48:加熱器元件</p>
        <p type="p">50:相變記憶體胞元</p>
        <p type="p">52:底襯裡</p>
        <p type="p">54:相變材料部分</p>
        <p type="p">56:頂電極</p>
        <p type="p">58:側壁襯裡</p>
        <p type="p">62:頂接觸通孔結構</p>
        <p type="p">100:記憶體陣列區</p>
        <p type="p">300:周邊區</p>
        <p type="p">601:接點層級介電材料層，第一介電材料層</p>
        <p type="p">610:第一互連層級介電材料層</p>
        <p type="p">612:裝置接觸通孔結構</p>
        <p type="p">618:第一金屬線路結構</p>
        <p type="p">620:第二互連層級介電材料層</p>
        <p type="p">622:第一金屬通孔結構</p>
        <p type="p">628:第二金屬線路結構</p>
        <p type="p">630:第三互連層級介電材料層</p>
        <p type="p">632:第二金屬通孔結構</p>
        <p type="p">638:第三金屬線路結構</p>
        <p type="p">640:第四互連層級介電材料層</p>
        <p type="p">641:下第四互連層級介電材料層</p>
        <p type="p">643:囊封介電層</p>
        <p type="p">648:第四金屬線路結構</p>
        <p type="p">700:半導體裝置</p>
        <p type="p">701:規劃電晶體</p>
        <p type="p">702:周邊電晶體</p>
        <p type="p">720:淺溝槽隔離結構</p>
        <p type="p">6421:下周邊通孔結構</p>
        <p type="p">6422:上周邊通孔結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1109" publication-number="202618967">
    <tif-files tif-type="multi-tif">
      <tif file="114116235.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116235</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用PWM至類比轉換器及比例閥的基板處理腔室板件之溫度控制</chinese-title>
        <english-title>TEMPERATURE CONTROL OF SUBSTRATE PROCESSING CHAMBER PLATES USING PWM TO ANALOG CONVERTERS AND PROPORTIONAL VALVES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">H01L21/67</main-classification>
        <further-classification edition="200601120260124B">G05D23/19</further-classification>
        <further-classification edition="200601120260124B">G05B11/28</further-classification>
        <further-classification edition="200601120260124B">G05D7/06</further-classification>
        <further-classification edition="200601120260124B">F16K31/02</further-classification>
        <further-classification edition="200601120260124B">H01L21/205</further-classification>
        <further-classification edition="200601120260124B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里達蘇　拉賈　納倫德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARIDASU, RAJA NARENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森納帕斯　森納帕斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENAPATH, SENAPATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦拉巴尼尼　基蘭　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALLABHANENI, KIRAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理腔室的板件的溫度控制系統，包括：用於調整冷卻劑通過板件的冷卻通道的流動的比例閥；用於產生脈衝寬度調製PWM訊號的控制器，該PWM訊號具有工作週期；以及基於工作週期將PWM訊號轉換為類比訊號並將該類比訊號供應至比例閥以調整比例閥打開百分比的PWM至類比轉換器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A temperature control system for a plate of a substrate processing chamber includes: a proportional valve configured to adjust flow of coolant through a cooling channel of the plate; a controller configured to generate a pulse width modulation PWM signal, the PWM signal having a duty cycle; and a PWM to analog converter configured to, based on the duty cycle, convert the PWM signal to a analog signal and supply the analog signal to the proportional valve to adjust an opening percentage of the proportional valve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700~712:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1110" publication-number="202617953">
    <tif-files tif-type="multi-tif">
      <tif file="114116308.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造電子裝置之水溶液、製造光阻圖案之方法及裝置之製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE MANUFACTURING AQUEOUS SOLUTION, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR MANUFACTURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C11D1/12</main-classification>
        <further-classification edition="200601120260127B">C11D3/20</further-classification>
        <further-classification edition="200601120260127B">C11D3/43</further-classification>
        <further-classification edition="200601120260127B">C11D17/00</further-classification>
        <further-classification edition="200601120260127B">G03F7/40</further-classification>
        <further-classification edition="200601120260127B">G03F7/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商默克專利有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, ZHI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳田浩志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGITA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本和磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種製造電子裝置之水溶液，其可抑制缺陷。一種製造電子裝置之水溶液，包含溶劑(S)，其中該溶劑(S)包含水(S-1)及溶劑(S-2)，該水(S-1)的含量為51至99.999質量%，且該溶劑(S-2)由以下式(S-2-a)表示：&lt;br/&gt;  烷基-Z   式(S-2-a)&lt;br/&gt;  其中烷基為C&lt;sub&gt;1-12&lt;/sub&gt;烷基，且Z為-OH、-SH或-NH&lt;sub&gt;2&lt;/sub&gt;。該製造電子裝置之水溶液為一種高效能材料，其可用於奈米技術製程的半導體裝置製造步驟，例如製造控制形成於基板上的液晶、量子點或OLED顯示器之半導體裝置步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device manufacturing aqueous solution that can suppress defects is provided. An electronic device manufacturing aqueous solution comprises a solvent (S), wherein the solvent (S) comprises water (S-1) and a solvent (S-2), the content of water (S-1) is 51 to 99.999 mass%, and the solvent (S-2) is represented by Formula (S-2-a) below:&lt;br/&gt; Alkyl-Z Formula (S-2-a)&lt;br/&gt; wherein Alkyl is C&lt;sub&gt;1-12&lt;/sub&gt; alkyl, and Z is -OH, -SH, or -NH&lt;sub&gt;2&lt;/sub&gt;. The electronic device manufacturing aqueous solution is a high-performance material that can be used in a semiconductor device manufacturing step of a nanotechnology process, for example, a step of manufacturing a semiconductor device that controls liquid crystals, quantum dots, or OLED displays formed on a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1111" publication-number="202619585">
    <tif-files tif-type="multi-tif">
      <tif file="114116314.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器及影像感測器的製造方法</chinese-title>
        <english-title>IMAGE SENSOR AND METHOD OF MANUFACTURING IMAGE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250703B">H10F39/18</main-classification>
        <further-classification edition="202501120250703B">H10F30/22</further-classification>
        <further-classification edition="202501120250703B">H10F71/00</further-classification>
        <further-classification edition="202501120250703B">H10F77/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像感測器包括半導體基板、光電轉換區、半導體突出部分、浮置擴散區和傳輸閘極。光電轉換區形成在半導體基板中，光電轉換區根據入射光而產生電荷。半導體突出部分從半導體基板突出並向上延伸到光電轉換區的上方。浮置擴散區設在半導體突出部分的遠端側且傳輸閘極形成為圍繞半導體突出部分。影像感測器利用傳輸閘極控制半導體突出部分的電場，以控制電荷從光電轉換區到浮置擴散區的傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image sensor includes a semiconductor substrate, a photoelectric conversion region, a semiconductor projecting section, a floating diffusion region, and a transfer gate. The photoelectric conversion region is formed in the semiconductor substrate, the photoelectric conversion region generating electric charges according to incident light. The semiconductor projecting section projects from the semiconductor substrate and extends upward above the photoelectric conversion region. The floating diffusion is provided on a distal end side of the semiconductor projecting section, and the transfer gate is formed to surround the semiconductor projecting section. The image sensor controls, with the transfer gate, an electric field to the semiconductor projecting section to control transfer of the electric charges from the photoelectric conversion region to the floating diffusion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體基板</p>
        <p type="p">10FS:基板表面</p>
        <p type="p">12:井隔離</p>
        <p type="p">14:光電二極體</p>
        <p type="p">16:半導體區</p>
        <p type="p">16SR:基板區</p>
        <p type="p">18:半導體突出部分</p>
        <p type="p">18S:側面</p>
        <p type="p">20:浮置擴散區</p>
        <p type="p">20a:重度摻雜區</p>
        <p type="p">20b:輕度摻雜區</p>
        <p type="p">22:絕緣膜</p>
        <p type="p">24:傳輸閘極</p>
        <p type="p">26:垂直傳輸閘極</p>
        <p type="p">100:畫素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1112" publication-number="202617116">
    <tif-files tif-type="multi-tif">
      <tif file="114116327.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有受力偵測機制的線性致動裝置</chinese-title>
        <english-title>LINEAR ACTUATOR WITH FORCE DETECTING MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">A61G7/002</main-classification>
        <further-classification edition="200601120260115B">G01L1/12</further-classification>
        <further-classification edition="202301120260115B">H10N52/00</further-classification>
        <further-classification edition="200601120260115B">G08B21/02</further-classification>
        <further-classification edition="200601120260115B">H02K7/06</further-classification>
        <further-classification edition="200601120260115B">F16H25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>第一傳動科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIMOTION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林煜暢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請係關於一種具有受力偵測機制的線性致動裝置，包括殼座、傳動機構、彈性體及霍爾感測組件，殼座包括固定部件；傳動機構連接殼座且其包括受力部件；彈性體設置在固定部件和受力部件間；霍爾感測組件設置在固定部件和受力部件間；其中傳動機構的受力發生變化時，受力部件和固定部件將產生相對位移，透過位移而讓霍爾感測組件產生輸出訊號。藉此，可降低產品因遭受撞擊而損壞，且能夠隨時得知病人處於在床狀態還是離床狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A linear actuator with force detecting mechanism includes a shell seat, a transmission mechanism, an elastomer and a Hall sensing component. The shell seat includes a fixed part. The transmission mechanism is connected to the shell seat and includes a stressed part. The elastomer is arranged between the fixed part and the stressed part. The Hall sensing component is arranged between the fixed part and the stressed part. Wherein a force of the transmission mechanism changes, the stressed part and the fixed part will produce relative displacement, and the Hall sensing component will generate an output signal through the displacement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼座</p>
        <p type="p">11:固定部件</p>
        <p type="p">20:傳動機構</p>
        <p type="p">21:受力部件</p>
        <p type="p">213:伸縮管</p>
        <p type="p">22:蝸輪</p>
        <p type="p">24:離合輪</p>
        <p type="p">50:驅動機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1113" publication-number="202618747">
    <tif-files tif-type="multi-tif">
      <tif file="114116348.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及其驅動方法</chinese-title>
        <english-title>DISPLAY PANEL AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250516B">G09G3/32</main-classification>
        <further-classification edition="200601120250516B">G09G3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張乃仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, NAI-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種顯示面板及其驅動方法。於一第一子畫框中，一第二發光信號控制一第二開關群為導通且一第一發光信號控制一第一開關群為關閉，以使得複數個發光元件與該第二開關群形成一第一發光路徑；以及於一第二子畫框中，該第二發光信號控制該第二開關群為關閉且該第一發光信號控制該第一開關群為導通，以使得該些發光元件與該第一開關群形成一第二發光路徑。該第一開關群與該第二開關群分別受控於該第一發光信號與該第二發光信號。該第一開關群與該第二開關群耦接至該些發光元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a display panel and a driving method thereof. In a first sub-frame, a second emission signal controls a second switch group to be turned on, while a first emission signal controls a first switch group to be turned off, so that multiple light-emitting elements and the second switch group form a first emission path. In a second sub-frame, the second emission signal controls the second switch group to be turned off, while the first emission signal controls the first switch group to be turned on, so that the light-emitting elements and the first switch group form a second emission path. The first switch group and the second switch group are respectively controlled by the first emission signal and the second emission signal, and the first switch group and the second switch group are coupled to the light-emitting elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:μLED顯示面板</p>
        <p type="p">110_1、110_2、110_3:畫素電路</p>
        <p type="p">120:顯示模組</p>
        <p type="p">Data_R、Data_G與Data_B:顯示資料</p>
        <p type="p">VDD:驅動電壓</p>
        <p type="p">EM1、EM2:發光信號</p>
        <p type="p">VSS:接地端</p>
        <p type="p">P1-P3:發光元件</p>
        <p type="p">SW1-SW5:開關</p>
        <p type="p">SF1、SF2:子畫框</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1114" publication-number="202617948">
    <tif-files tif-type="multi-tif">
      <tif file="114116370.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有脂肪酸衍生物之組成物及其在工業程序中之用途</chinese-title>
        <english-title>COMPOSITION WITH FATTY ACID DERIVATIVES AND USE IN INDUSTRIAL PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C10G75/02</main-classification>
        <further-classification edition="200601120260202B">C10G75/04</further-classification>
        <further-classification edition="200601120260202B">C10M105/34</further-classification>
        <further-classification edition="200601120260202B">C10M105/68</further-classification>
        <further-classification edition="200601320260202B">C10N30/00</further-classification>
        <further-classification edition="200601320260202B">C10N30/10</further-classification>
        <further-classification edition="200601320260202B">C10N30/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商藝康美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECOLAB USA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維亞卡拉曼　卡門斯瓦拉　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VYAKARANAM, KAMESWARA R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達瓦　阿希施</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHAWAN, ASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾納斯勒　巴薩姆　卡馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALNASLEH, BASSAM KAMAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪西爾　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASERE, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆卡瑪拉　羅賓德拉納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKKAMALA, RAVINDRANATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示包括脂肪酸衍生物之組成物及使用該等組成物作為分散劑、防汙劑、或兩者之方法。該等組成物可用以防止或減少石油化學程序中所使用之設備中之聚合物形成及聚合物沉積。該等脂肪酸衍生物組成物由具有少量或不具有樹脂酸及甘油且亦具有少量C16:0-脂肪酸及C18:0-脂肪酸、以及總量高的C18部分不飽和脂肪酸之脂肪酸製劑製備，且/或該等脂肪酸衍生物組成物由大豆脂肪酸及/或芥花籽脂肪酸製備。該脂肪酸衍生物可用於組成物及方法中以控制工業程序期間非所要的聚合、非所要的腐蝕、及/或非所要的微粒材料沉降。此外，本揭露之組成物具有延長儲存穩定性之額外效益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compositions including fatty acid derivatives and methods using the compositions as dispersants, antifoulants, or both. The compositions can be used to prevent or reduce polymer formation and polymer deposition in equipment used in petrochemical processes. The fatty acid derivative compositions are prepared from fatty acid preparations have low amounts of, or no, resin acids and glycerol, and also have low amounts of C16:0- and C18:0-fatty acids, and high total amounts of C18 partially unsaturated fatty acids, and/or the fatty acid derivative compositions are prepared from soy fatty acids and/or canola fatty acids. The fatty acid derivative can be used in compositions and methods to control unwanted polymerization, unwanted corrosion, and/or unwanted settling of particulate materials during industrial processes. Also, compositions of the disclosure have the additional benefit of prolonged storage stability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1115" publication-number="202618275">
    <tif-files tif-type="multi-tif">
      <tif file="114116379.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測量一或多個反應室中之氣體濃度之系統及方法</chinese-title>
        <english-title>A SYSTEM AND METHOD FOR MEASURING A GAS CONCENTRATION IN ONE OR MORE REACTION CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01N33/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商菲爾薇解析公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIAVI SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑恩森　凱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN, KELLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽瑞維爾　卡羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THORAVAL, CAROLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維斯　芭芭拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIES, BARBARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾菲　麥可　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOFI, MICHAEL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於測定一或多個反應室中之氣體之濃度之系統。該系統包含經組態以向該一或多個反應室提供反應能量之能源。氣量計能夠測量該一或多個反應室中之氣體之濃度。亦揭示了一種用於測定一或多個反應室中之氣體產物之濃度之方法，亦揭示了一種測試套組及一種反應室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for determining a concentration of a gas in one or more reaction chambers. The system comprises an energy source configured to provide a reaction energy to the one or more reaction chambers. A gas meter is capable of measuring a concentration of a gas in the one or more reaction chambers. A method for determining a concentration of a gaseous product in one or more reaction chambers is also disclosed, a test kit and a reaction chamber are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">20:反應室</p>
        <p type="p">40:能源</p>
        <p type="p">50:氣量計</p>
        <p type="p">70:電腦</p>
        <p type="p">72:非暫時性電腦可讀媒體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1116" publication-number="202618444">
    <tif-files tif-type="multi-tif">
      <tif file="114116416.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遮罩以及製造半導體裝置的方法</chinese-title>
        <english-title>MASK AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G03F7/00</main-classification>
        <further-classification edition="200601120260123B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧宇倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, YU-LUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宣瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSUAN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MENG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造半導體裝置的方法，包括以下步驟：在基板上方形成光阻劑層；及使該光阻劑層與該遮罩接觸。該遮罩包括：裝置區域，包括位於第一層級的裝置圖案；重疊區域，圍繞該裝置區域且具有位於第二層級的光吸收材料；及周邊區域，圍繞該裝置區域及該重疊區域且包括位於第三層級的光阻擋材料，其中該第一、第二及第三層級處於不同位置。該光阻劑層經由該遮罩曝露於光化輻射。自該光阻劑層移除該遮罩，且移除該光阻劑層的未曝露於該光化輻射的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor device includes forming a resist layer over a substrate and contacting the resist layer with a mask. The mask includes: a device region including a device pattern at a first level, an overlapping region surrounding the device region and having a light absorption material at a second level, and a peripheral region surrounding the device region and the overlapping region, and including a light blocking material at a third level, wherein the first, second, and third levels are at different positions. The resist layer is exposed to actinic radiation through the mask. The mask is removed from the resist layer, and portions of the resist layer not exposed to the actinic radiation are removed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1、2:區域</p>
        <p type="p">10:遮罩</p>
        <p type="p">15:周邊區域</p>
        <p type="p">20:圖案區域</p>
        <p type="p">25:光吸收層</p>
        <p type="p">30:框架區域</p>
        <p type="p">40:光阻擋層</p>
        <p type="p">45:對準標記圖案</p>
        <p type="p">H1:高度</p>
        <p type="p">W1:寬度</p>
        <p type="p">X、Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1117" publication-number="202617393">
    <tif-files tif-type="multi-tif">
      <tif file="114116420.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙切割手工具及切割面之視覺指示器</chinese-title>
        <english-title>DUAL-CUT HAND TOOL AND VISUAL INDICATOR OF CUTTING SURFACES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">B26B17/00</main-classification>
        <further-classification edition="200601120260124B">B26D3/16</further-classification>
        <further-classification edition="200601120260124B">B26B27/00</further-classification>
        <further-classification edition="200601120260124B">B26B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商史奈普昂公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNAP-ON INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多伊爾　大衛　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOYLE, DAVID T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種手工具，其具有藉由一樞軸耦合之一第一臂及一第二臂以及遠離樞軸被限定為第一臂及第二臂之一第一端之一部分之一手柄。該手工具包含在第一臂及第二臂之一第二端處毗鄰於樞軸之一鼻部。該鼻部包含：一第一鉗夾，其包含第一臂之第二端，第一鉗夾包含經形成以限定一第一切割輪廓及一第二切割輪廓之一肩部；一第二鉗夾，其包含第二臂之第二端，其中第一鉗夾與第二鉗夾協作以限定包含第一切割輪廓及第二切割輪廓之一切割刃；及一指示器，其設置在肩部上，其中指示器相對於第二切割輪廓識別出第一切割輪廓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hand tool having a first arm and a second arm coupled by a pivot and a handle defined away from the pivot as part of a first end of the first and second arms. The hand tool includes a nose adjacent to the pivot at a second end of the first and second arms. The nose includes a first jaw including the second end of the first arm, the first jaw including a shoulder formed to define a first cutting profile and a second cutting profile, a second jaw including the second end of the second arm, wherein the first jaw and the second jaw cooperate to define a cutting edge including the first cutting profile and the second cutting profile, and an indicator provided on the shoulder, wherein the indicator identifies the first cutting profile from the second cutting profile.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雙切割鉗</p>
        <p type="p">102:樞軸</p>
        <p type="p">104:手柄</p>
        <p type="p">106:握把</p>
        <p type="p">108:鼻部</p>
        <p type="p">110:鉗夾</p>
        <p type="p">112:切割刃</p>
        <p type="p">120:第一臂/手柄</p>
        <p type="p">122:第一端</p>
        <p type="p">124:第二端</p>
        <p type="p">126:第一握把</p>
        <p type="p">130:第一鉗夾/鉗夾</p>
        <p type="p">140:第二臂/手柄</p>
        <p type="p">142:第一端</p>
        <p type="p">144:第二端</p>
        <p type="p">146:第二握把</p>
        <p type="p">150:第二鉗夾/鉗夾</p>
        <p type="p">CL:中心線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1118" publication-number="202619541">
    <tif-files tif-type="multi-tif">
      <tif file="114116425.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置及形成積體電路裝置的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251110B">H10D62/10</main-classification>
        <further-classification edition="202501120251110B">H10D64/20</further-classification>
        <further-classification edition="202501120251110B">H10D88/00</further-classification>
        <further-classification edition="200601120251110B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高魁佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, KUEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓瓊玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHIUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於形成積體電路的製程包括在晶圓之基板之上形成半導體鰭片，及上覆半導體鰭片形成犧牲閘極結構。製程包括藉由執行包括乾式蝕刻製程及濕式蝕刻製程的多步驟蝕刻製程從犧牲閘極結構移除副產物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for forming an integrated circuit includes forming a semiconductor fin above a substrate of a wafer and forming a sacrificial gate structure overlying the semiconductor fin. The process includes removing a byproduct layer from the sacrificial gate structure by performing a multi-step etching process including a dry etching process followed by a wet etching process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路</p>
        <p type="p">101:替代積體電路、積體電路</p>
        <p type="p">120:副產物積聚</p>
        <p type="p">126,127:閘極間隔層、間隔層</p>
        <p type="p">136:內部間隔物</p>
        <p type="p">140:源極/汲極區</p>
        <p type="p">144:CESL層、CESL、介電層</p>
        <p type="p">146:介電層</p>
        <p type="p">150:高K介電層、高K閘極介電層</p>
        <p type="p">152:閘極金屬</p>
        <p type="p">153:突出</p>
        <p type="p">156:原生氧化物層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1119" publication-number="202619470">
    <tif-files tif-type="multi-tif">
      <tif file="114116453.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路元件及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251001B">H10B10/00</main-classification>
        <further-classification edition="202501120251001B">H10D84/85</further-classification>
        <further-classification edition="200601120251001B">H01L23/528</further-classification>
        <further-classification edition="202501120251001B">H10D86/01</further-classification>
        <further-classification edition="200601120251001B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　建隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, KIAN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路元件包括在第一方向上延伸的一對堆疊主動區結構。積體電路亦包括與一對堆疊主動區結構相交且與在第二方向上延伸的第一、第二、第三、第四閘極軌道閘極軌道對應地對準的第一開關閘極導體、第一互補式場效電晶體閘極導體、第二互補式場效電晶體閘極導體及第二開關閘極導體。在第一閘極軌道與第二閘極軌道之間在第二方向上延伸的第一互補式場效電晶體端導體導電連接至第二互補式場效電晶體閘極導體。在第三閘極軌道與第四閘極軌道之間在第二方向上延伸的第二互補式場效電晶體端導體導電連接至第一互補式場效電晶體閘極導體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a pair of stacked active-region structures extending in a first direction. The integrated circuit also includes a first switching gate-conductor, a first CFET (complementary field effect transistor) gate-conductor, a second CFET gate-conductor, and a second switching gate-conductor intersecting the pair of stacked active-region structures and aligned correspondingly with a first gate track, a second gate track, a third gate track, and a fourth gate track extending in a second direction. A first CFET terminal-conductor extending in the second direction between the first gate track and the second gate track is conductively connected to the second CFET gate-conductor. A second CFET terminal-conductor extending in the second direction between the third gate track and the fourth gate track is conductively connected to the first CFET gate-conductor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">80A:第一對堆疊主動區結構</p>
        <p type="p">80B:第二對堆疊主動區結構</p>
        <p type="p">82A、82B:上部主動區結構</p>
        <p type="p">84A、84B:下部主動區結構</p>
        <p type="p">100:電路單元</p>
        <p type="p">101、102、108、109:單元邊界</p>
        <p type="p">105:分割邊界</p>
        <p type="p">122A、122B、124A、124B:節點連接結構</p>
        <p type="p">132DA、132DB、132UA、132UB、134A、134B、135DA、135DB、135UA、135UB、136A、136B、138DA、138DB、138UA、138UB:端導體</p>
        <p type="p">152DA、152DB、152UA、152UB、154A、154B、156A、156B、158DA、158DB、158UA、158UB:閘極導體</p>
        <p type="p">162A、162B、168A、168B:位元線導體</p>
        <p type="p">165A、165B:開關選擇導體</p>
        <p type="p">182A、182B、184A、184B:電力線導體</p>
        <p type="p">A-A’、B-B’、C-C’:切割平面/線</p>
        <p type="p">i101DB、i101UA、i101UB、i109DB、i109UA、i109UB:邊界隔離區</p>
        <p type="p">SRAM1、SRAM2:SRAM位元單元電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1120" publication-number="202619557">
    <tif-files tif-type="multi-tif">
      <tif file="114116462.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D84/01</main-classification>
        <further-classification edition="202501120251001B">H10D64/01</further-classification>
        <further-classification edition="202501120251001B">H10D84/85</further-classification>
        <further-classification edition="202301120251001B">H10B10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸　廣湖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUC, QUANG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈盈均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAO, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　建隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, KIAN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　露</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置及其形成方法。一種例示性方法包括在基板上方形成鰭片，鰭片之第一部分包含由複數個第一犧牲層交織的複數個第一通道層，鰭片之第二部分包含由複數個第二犧牲層交織的複數個第二通道層；形成延伸穿過鰭片的溝槽，使複數個第一犧牲層與複數個第二犧牲層以不同蝕刻速度側向凹陷；以及用第一閘極結構替換複數個第一犧牲層之剩餘部分，用第二閘極結構替換複數個第二犧牲層之剩餘部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and methods of forming the same are provided. An exemplary method includes forming a fin over a substrate, a first portion of the fin comprising a plurality of first channel layers interleaved by a plurality of first sacrificial layers, and a second portion of the fin comprising a plurality of second channel layers interleaved by a plurality of second sacrificial layers, forming a trench extending through the fin, laterally recessing the plurality of first sacrificial layers and the plurality of second sacrificial layers at different etch rates, and replacing a remaining portion of the plurality of first sacrificial layers with a first gate structure and replacing a remaining portion of the plurality of second sacrificial layers with a second gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102~122:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1121" publication-number="202619319">
    <tif-files tif-type="multi-tif">
      <tif file="114116478.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高功率效率的雙向晶粒間通訊系統及方法</chinese-title>
        <english-title>POWER EFFICIENT BIDIRECTIONAL DIE-TO-DIE COMMUNICATION SYSTEMS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H04L25/02</main-classification>
        <further-classification edition="201901120260123B">G06F1/3237</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏克　查爾斯沃爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOECKER, CHARLES WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛龍　艾瑞克道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROEN, ERIC DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚葛瑞拉　夏卡史瑞尼瓦沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANGIRALA, SHANKAR SRINIVASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希夫納蘭　拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIVNARAINE, RAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述使用共享路徑在第一晶粒與第二晶粒之間進行雙向通訊的系統及方法。該方法包括以下步驟：在第一操作階段期間，允許使用共享路徑的第一晶粒與第二晶粒之間的雙向通訊。該方法進一步包括以下步驟：在第二操作階段期間：（1）暫停使用共享路徑的第一晶粒與第二晶粒之間的雙向通訊，（2）藉由將第一發送驅動器的輸入終端耦接至一電壓位準，以停駐第一發送驅動器，以及（3）藉由將第二發送驅動器的輸入終端耦接至相同電壓位準，以停駐第二發送驅動器，其中該電壓位準係為電壓供應位準或接地位準中之一者。亦描述用於使雙向通訊更有效率的訊號的時脈閘控的附加系統及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for bidirectional communication between a first die and a second die using a shared route are described. The method includes, during a first phase of operation, allowing bidirectional communication between the first die and the second die using the shared route. The method further includes, during a second phase of operation: (1) pausing bidirectional communication between the first die and the second die using the shared route, (2) parking the first transmit driver by coupling an input terminal of the first transmit driver to a voltage level, and (3) parking the second transmit driver by coupling an input terminal of the second transmit driver to the same voltage level, where the voltage level is one of a voltage supply level or a ground level. Additional systems and methods for clock gating of signals that make the bidirectional communication even more efficient are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1200:流程圖</p>
        <p type="p">1210:步驟</p>
        <p type="p">1220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1122" publication-number="202619519">
    <tif-files tif-type="multi-tif">
      <tif file="114116489.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/01</main-classification>
        <further-classification edition="202501120260123B">H10D30/43</further-classification>
        <further-classification edition="202501120260123B">H10D30/62</further-classification>
        <further-classification edition="202501120260123B">H10D64/01</further-classification>
        <further-classification edition="202501120260123B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林衍廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李啟弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHII-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實施例中，一種方法可包括在基板上形成多層堆疊，多層堆疊具有第一半導體層及第二半導體層的交替層。方法亦可包括：在第一區域中形成鄰近第一半導體層及第二半導體層的第一源極/汲極區域，第一源極/汲極區域具有蓋層；在第一源極/汲極區域上形成保護層；在第二區域中形成鄰近第一半導體層及第二半導體層的第二源極/汲極區域；自第一源極/汲極區域上移除保護層；用第一金屬閘極結構替換第一區域中的第一半導體層；及用第二金屬閘極結構替換第二區域中的第一半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an embodiment, a method may include forming a multi-layer stack over a substrate, the multi-layer stack having alternating layers of first semiconductor layers and second semiconductor layers. The method may also include forming first source/drain regions adjacent the first semiconductor layers and the second semiconductor layers in a first region, the first source/drain regions having a cap layer, forming a protection layer over the first source/drain regions, forming second source/drain regions adjacent the first semiconductor layers and the second semiconductor layers in a second region, removing the protection layer from over the first source/drain regions, replacing the first semiconductor layers in the first region with a first metal gate structure, and replacing the first semiconductor layers in the second region with a second metal gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50P:p型區域</p>
        <p type="p">66:鰭片</p>
        <p type="p">81:第一間隔件</p>
        <p type="p">83:第二間隔件</p>
        <p type="p">92C:第三半導體材料層</p>
        <p type="p">92D:第四半導體材料層/蓋層</p>
        <p type="p">95:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1123" publication-number="202617819">
    <tif-files tif-type="multi-tif">
      <tif file="114116524.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乳劑型環氧樹脂硬化劑組成物及水系環氧樹脂組成物</chinese-title>
        <english-title>EMULSION-TYPE EPOXY RESIN CURING AGENT COMPOSITION AND WATER-BASED EPOXY RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08G59/18</main-classification>
        <further-classification edition="200601120260119B">C08G59/32</further-classification>
        <further-classification edition="200601120260119B">C09J163/02</further-classification>
        <further-classification edition="200601120260119B">C07C211/51</further-classification>
        <further-classification edition="200601120260119B">C08L63/10</further-classification>
        <further-classification edition="200601120260119B">C08F2/30</further-classification>
        <further-classification edition="200601120260119B">C09D5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衞藤元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETOU, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種乳劑型環氧樹脂硬化劑組成物、及摻合其之水系環氧樹脂組成物。該乳劑型環氧樹脂硬化劑組成物含有：成分(A)：對於多環氧基化合物(a1)1.0莫耳，使1.0~2.8莫耳之含環結構之多胺(a2)與其進行反應而得之反應組成物，成分(B)：HLB值為14.0以上之具有芳香環之非離子性乳化劑，成分(C)：共溶劑，及，水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An emulsion-type epoxy resin curing agent composition comprising: &lt;br/&gt;Component (A): a reaction composition obtained by reacting 1.0 mol of a polyepoxy compound (a1) with 1.0 to 2.8 mol of a polyamine containing a cyclic structure (a2), &lt;br/&gt;Component (B): a nonionic emulsifier having an HLB value of 14.0 or higher and an aromatic ring, &lt;br/&gt;Component (C): a co-solvent, and &lt;br/&gt;Water; &lt;br/&gt;and a water-based epoxy resin composition formulated with the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1124" publication-number="202618316">
    <tif-files tif-type="multi-tif">
      <tif file="114116610.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於量測受測裝置處之波形的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR MEASURING WAVEFORMS AT DEVICES UNDER TEST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01R31/28</main-classification>
        <further-classification edition="200601120260123B">G01R13/02</further-classification>
        <further-classification edition="202001120260123B">G01R31/08</further-classification>
        <further-classification edition="200601120260123B">G01R31/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商是德科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEYSIGHT TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高野顯一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">用於在受測裝置處量測電壓及電流波形之方法、系統、及電腦可讀媒體。一種例示方法包括從一量測儀器之一信號產生器輸出一電氣信號；在連至該量測儀器之一輸出電阻的一輸入處量測一第一電壓；在該量測儀器之該輸出電阻之一輸出處量測一第二電壓；以及使用該第一電壓、該第二電壓及將該量測儀器電氣連接至一受測裝置(DUT)之一傳輸線之一傳播延遲，在電氣連接至該量測儀器之該DUT處確定一測試量測電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and computer readable media for measuring voltage and current waveforms at devices under test. An example method includes outputting an electrical signal from a signal generator of a measurement instrument; measuring a first voltage at an input to an output resistance of the measurement instrument; measuring a second voltage at an output of the output resistance of the measurement instrument; and determining a test measurement voltage at a device under test (DUT) electrically connected to the measurement instrument using the first voltage, the second voltage, and a propagation delay of a transmission line electrically connecting the measurement instrument to the DUT.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:系統；DUT</p>
        <p type="p">202:DUT</p>
        <p type="p">204:量測儀器</p>
        <p type="p">206:同軸纜線；信號產生器</p>
        <p type="p">208:信號產生器</p>
        <p type="p">210:類比數位轉換器；ADC</p>
        <p type="p">212:類比數位轉換器；ADC</p>
        <p type="p">214:輸出電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1125" publication-number="202619534">
    <tif-files tif-type="multi-tif">
      <tif file="114116620.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619534</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有蕭特基接觸結構的功率半導體</chinese-title>
        <english-title>POWER SEMICONDUCTOR WITH SCHOTTKY CONTACT STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260126B">H10D30/66</main-classification>
        <further-classification edition="202501120260126B">H10D30/01</further-classification>
        <further-classification edition="202501120260126B">H10D64/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商美格納半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGNACHIP SEMICONDUCTOR, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金起煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KI HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JI YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴贊毫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, CHAN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文壽泳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, SU YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全盛燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, SEONG CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓珍聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JIN SEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜棋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, KI TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在現</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JAE HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有一蕭特基接觸結構的功率半導體包含在一第一方向上以一預設間隔來間隔開的閘極區域；具有一第一導電類型的一高度摻雜源極區域，其定位在所述閘極區域之間；一源極接點區域，其被設置在具有所述第一導電類型的所述高度摻雜源極區域上；具有一第二導電類型的複數個經埋入柱區域，其在一交叉所述第一方向的第二方向上以一預設間隔來間隔開；以及蕭特基接觸區域，其形成在具有所述第二導電類型的所述複數個經埋入柱區域交叉所述閘極區域的點處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power semiconductor with a Schottky contact structure includes gate regions spaced apart by a predetermined interval in a first direction; a highly doped source region of a first conductivity-type positioned between the gate regions; a source contact region disposed on the highly doped source region of the first conductivity-type; a plurality of buried pillar regions of a second conductivity-type spaced at a preset interval in a second direction intersecting the first direction; and Schottky contact regions formed at a point where the plurality of buried pillar regions of the second conductivity-type intersect with the gate regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率半導體</p>
        <p type="p">110:閘極區域</p>
        <p type="p">122:高度摻雜源極區域</p>
        <p type="p">130:源極接點區域</p>
        <p type="p">140:經埋入柱區域</p>
        <p type="p">200:蕭特基接觸區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1126" publication-number="202617612">
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      <tif file="114116637.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超純水製造方法及超純水製造裝置</chinese-title>
        <english-title>METHOD OF PRODUCING ULTRAPURE WATER, AND ULTRAPURE WATER PRODUCTION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">C02F1/42</main-classification>
        <further-classification edition="202301120260202B">C02F1/44</further-classification>
        <further-classification edition="200601120260202B">B01D61/02</further-classification>
        <further-classification edition="200601120260202B">B01D61/04</further-classification>
        <further-classification edition="200601320260202B">C02F103/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商野村微科學工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA MICRO SCIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯山真充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIYAMA, MASAMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天谷徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAYA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川龍三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, RYUZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之超純水製造方法係具有除去包含將海水淡化處理後之海水淡化處理水之原水的懸浮物質，而得到前處理水的前處理；除去前處理水中之總有機碳成分及離子成分之至少一者，來製造一次純水的一次處理；除去一次純水中之雜質，來製造超純水的二次處理；原水之硼濃度以成為根據超純水要求的硼濃度算出的容許值以下的方式來調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of producing ultrapure water of the present disclosure includes: pre-treatment to obtain pre-treated water by removing suspended matter from raw water containing desalinated water obtained by desalinating seawater; a primary treatment in which at least one of all organic carbon components and ionic components in the pre-treated water is removed to produce primary pure water; and a secondary treatment of removing impurities from the primary pure water to produce ultrapure water, with a boron concentration of the raw water being adjusted to below an allowable value calculated from a boron concentration required for the ultrapure water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:前處理裝置</p>
        <p type="p">11:一次純水裝置</p>
        <p type="p">12:二次純水裝置</p>
        <p type="p">14:工業用水</p>
        <p type="p">19:POU</p>
        <p type="p">20:PIT</p>
        <p type="p">22:純水槽</p>
        <p type="p">28:循環線路</p>
        <p type="p">30:海水</p>
        <p type="p">31:槽</p>
        <p type="p">32:海水淡化處理水</p>
        <p type="p">40:海水淡化裝置</p>
        <p type="p">42:海水淡化處理部</p>
        <p type="p">43、44、52、75、76:管道</p>
        <p type="p">46:海水淡化處理水槽</p>
        <p type="p">48、70:硼監測儀</p>
        <p type="p">50:切換閥</p>
        <p type="p">60:硼除去裝置</p>
        <p type="p">62:高壓逆滲透膜裝置</p>
        <p type="p">64:添加部</p>
        <p type="p">64A:貯存部</p>
        <p type="p">64B:供給管</p>
        <p type="p">64C:調整閥</p>
        <p type="p">65:鹼</p>
        <p type="p">73:閥</p>
        <p type="p">74:槽</p>
        <p type="p">100:超純水製造裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1127" publication-number="202618265">
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      <tif file="114116692.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>缺陷偵測系統以及執行半導體基板的電子束檢測的方法</chinese-title>
        <english-title>DEFECT DETECTION SYSTEM AND METHOD OF PERFORMING ELECTRON BEAM INSPECTION OF SEMICONDUCTOR SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250602B">G01N23/2251</main-classification>
        <further-classification edition="200601120250602B">H01J37/32</further-classification>
        <further-classification edition="201201120250602B">G03F1/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭育宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳廣行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUANG-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOMENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">偵測系統包括配置為產生第一電子束並使第一電子束撞擊樣品的第一電子源，配置為產生第二電子束並使第二電子束撞擊樣品的第二電子源、偵測器以及控制系統。控制系統配置為控制第一電子源使第一電子束掃描樣品區域，通過改變第二電子束著陸能量及束電流中至少一個來控制樣品電荷狀態，控制偵測器以偵測由樣品射出的電子，接收來自偵測器的偵測器訊號，以及從偵測器訊號產生電壓對比圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection system includes a first electron source configured to generate a first electron beam and to cause the first electron beam to impinge on a sample, a second electron source configured to generate a second electron beam and to cause the second electron beam to impinge on the sample, a detector, and a control system. The control system is configured to control the first electron source to cause the first electron beam to scan an area of the sample, control a charge state of the sample by varying at least one of a landing energy and a beam current of the second electron beam, control the detector to detect electrons emitted by the sample, receive a detector signal from the detector, and generate a voltage contrast image from the detector signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:目標羽流</p>
        <p type="p">85:液滴接收器</p>
        <p type="p">100:系統、極紫外光微影工具</p>
        <p type="p">101:聚焦單元</p>
        <p type="p">102:極紫外光輻射源</p>
        <p type="p">104:曝光裝置</p>
        <p type="p">105:腔室</p>
        <p type="p">106:激勵雷射源</p>
        <p type="p">108:雷射產生器</p>
        <p type="p">110:收集鏡</p>
        <p type="p">112:雷射導引光學元件</p>
        <p type="p">114:聚焦設備</p>
        <p type="p">115:液滴產生器</p>
        <p type="p">117:噴嘴</p>
        <p type="p">LR0,LR2:束</p>
        <p type="p">BF:基板樓層</p>
        <p type="p">DMP1,DMP2:阻尼器</p>
        <p type="p">DP:目標液滴</p>
        <p type="p">EUV:極紫外光</p>
        <p type="p">MF:基準樓層</p>
        <p type="p">PP1,PP2:基座板</p>
        <p type="p">ZE:激發區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1128" publication-number="202617958">
    <tif-files tif-type="multi-tif">
      <tif file="114116759.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116759</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板用洗淨劑、洗淨完畢的半導體基板之製造方法、電子元件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C11D7/22</main-classification>
        <further-classification edition="200601120260126B">C11D7/32</further-classification>
        <further-classification edition="200601120260126B">C11D7/50</further-classification>
        <further-classification edition="200601120260126B">B08B3/08</further-classification>
        <further-classification edition="200601120260126B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滋野井悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGENOI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉村宣明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMURA, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對銅之耐蝕性優異、並且釕含有物的去除性優異之半導體基板用洗淨劑、以及洗淨完畢的半導體基板之製造方法及電子元件之製造方法。本發明的半導體基板用洗淨劑包含：嘌呤化合物，選自嘌呤及嘌呤衍生物中；及特定聚合物，具備具有羥基之重複單元及陽離子性基中的至少一者，前述半導體基板用洗淨劑顯示鹼性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1129" publication-number="202617917">
    <tif-files tif-type="multi-tif">
      <tif file="114116765.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>增黏劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250912B">C09K3/00</main-classification>
        <further-classification edition="200601120250912B">C09J4/04</further-classification>
        <further-classification edition="200601120250912B">C09J11/08</further-classification>
        <further-classification edition="200601120250912B">C09J133/04</further-classification>
        <further-classification edition="200601120250912B">C08F220/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千葉大二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIBA, DAIJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三枝俊亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIEDA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種可較佳地用作增黏劑，且由於分子量較高，因此少量添加即可獲得期望之黏度，進而於溶解後無拉絲之增黏劑。  &lt;br/&gt;本發明之增黏劑含有重量平均分子量為400,000～1,000,000之甲基丙烯酸樹脂，該甲基丙烯酸樹脂使用Bertz複雜度指數40以上之鏈轉移劑進行聚合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1130" publication-number="202619520">
    <tif-files tif-type="multi-tif">
      <tif file="114116793.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/01</main-classification>
        <further-classification edition="202501120260123B">H10D30/62</further-classification>
        <further-classification edition="202501120260123B">H10D84/01</further-classification>
        <further-classification edition="202501120260123B">H10D84/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供了半導體裝置及其製造方法。半導體裝置包括基板、覆蓋基板並為至少兩個裝置提供多個主動區域的鰭片、設置以電隔離至少兩個裝置的主動區域的鰭絕緣結構，其中鰭絕緣結構延伸穿過鰭片並進入基板，其中鰭絕緣結構包括第一介電材料、以及位在鰭片的相對設置的多個側面上鄰近鰭片的一對接縫隔離結構，其中所述對接縫隔離結構定義出鰭片的側面上的鰭絕緣結構的多個邊界。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and methods for manufacturing the same are provided. The semiconductor devices include a substrate, a fin overlying the substrate and providing active regions for at least two devices, a fin-insulating structure positioned to electrically isolate the active regions for the at least two devices, wherein the fin-insulating structure extends through the fin and into the substrate, wherein the fin-insulating structure includes a dielectric material, and a pair of seam-isolating structures positioned adjacent to the fin on oppositely disposed sides thereof, wherein the seam-isolating structures define boundaries of the fin-insulating structure on the sides of the fin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:鰭片</p>
        <p type="p">216:淺溝槽隔離</p>
        <p type="p">218:虛設鰭片</p>
        <p type="p">242:第一閘極間隔物</p>
        <p type="p">244:第二閘極間隔物</p>
        <p type="p">246:金屬閘極層</p>
        <p type="p">268:鰭絕緣結構</p>
        <p type="p">270:基板</p>
        <p type="p">274:金屬接觸層</p>
        <p type="p">276:SAC絕緣材料層</p>
        <p type="p">290:接縫隔離結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1131" publication-number="202619206">
    <tif-files tif-type="multi-tif">
      <tif file="114116796.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116796</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可由不同角度位置安裝的中繼連接器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01R13/74</main-classification>
        <further-classification edition="200601120260123B">H01H50/04</further-classification>
        <further-classification edition="200601120260123B">H01R13/213</further-classification>
        <further-classification edition="201101120260123B">H01R24/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商廣瀨電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沼田健汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUMATA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種中繼連接器，可以由不同角度位置選擇性地安裝於基板和面板等的安裝對象。  &lt;br/&gt;　　[技術內容]一種中繼連接器，具備：外殼本體，至少包含：第一連接器嵌合的第一嵌合空間、及第二連接器嵌合的第二嵌合空間；及端子，被保持於外殼本體；外殼本體，進一步具備複數突出部，複數突出部至少包含比外殼本體的外表面更朝外方突出的第一突出部及第二突出部。第一突出部，具有沿著與第一方向交叉的第一面形成的第一抵接面，第一抵接面的設置態樣，是在將中繼連接器沿著第一方向觀看時，可以從第一抵接面的觀看側看到第一抵接面的至少一部分。第二突出部，具有沿著與第二方向交叉的第二面形成的第二抵接面，第二抵接面的設置態樣，是在將中繼連接器沿著第二方向觀看時，可以從第二抵接面的觀看側看到第二抵接面的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:中繼連接器</p>
        <p type="p">3A:基板(安裝對象)</p>
        <p type="p">3Aa:固定手段</p>
        <p type="p">10:外殼本體</p>
        <p type="p">11:第一嵌合部</p>
        <p type="p">11a:第一嵌合空間</p>
        <p type="p">11b:第一嵌合部的外表面</p>
        <p type="p">11c:段差部</p>
        <p type="p">12:第二嵌合部</p>
        <p type="p">12b:第二嵌合部的外表面</p>
        <p type="p">13:垂直隔壁</p>
        <p type="p">16:抵接面</p>
        <p type="p">18:凹陷部</p>
        <p type="p">21A:第一突出部</p>
        <p type="p">21Aa:第一抵接面</p>
        <p type="p">21Ac:第三抵接面</p>
        <p type="p">22A:第二突出部</p>
        <p type="p">22Ab:第二抵接面</p>
        <p type="p">22B:第二突出部</p>
        <p type="p">23A:缺口</p>
        <p type="p">24A:缺口</p>
        <p type="p">24B:缺口</p>
        <p type="p">51:第一纜線連接器</p>
        <p type="p">52A~52C:第二纜線連接器</p>
        <p type="p">61:電纜</p>
        <p type="p">62:電纜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1132" publication-number="202618020">
    <tif-files tif-type="multi-tif">
      <tif file="114116911.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在基板上形成熱介面材料的系統和方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR FORMING THERMAL INTERFACE MATERIAL ON SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C23C14/35</main-classification>
        <further-classification edition="200601120260126B">C23C14/56</further-classification>
        <further-classification edition="200601120260126B">C23C14/06</further-classification>
        <further-classification edition="200601120260126B">H01L21/203</further-classification>
        <further-classification edition="200601120260126B">H01L21/304</further-classification>
        <further-classification edition="200601120260126B">H01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　洸漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, KEITH KWONG HON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾沛爾　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPELL, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克諾普　塞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNUPP, SETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝巴德　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPARD, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰爾　丹尼爾康瑞德保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIRE, DANIEL KONRAD PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於處理基板的方法和設備包含在基板上濺射具有第一厚度的第一種晶層，該第一種晶層包括具有相對於基板的傾斜結晶定向的熱介面材料；在第一種晶層上濺射具有第二厚度的第二層，該第二層包括熱介面材料；以及研磨第二層，直到第二層的表面粗糙度適合於熔融接合、熱壓接合或混合接合中的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for processing a substrate include sputtering a first seed layer having a first thickness on the substrate, the first seed layer comprising a thermal interface material having a tilted crystallographic orientation with respect to the substrate; sputtering a second layer having a second thickness on the first seed layer, the second layer comprising the thermal interface material; and polishing the second layer until a surface roughness of the second layer is suitable for at least one of fusion bonding, thermal compression bonding, or hybrid bonding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:設備前端模組(EFEM)</p>
        <p type="p">103:FOUP</p>
        <p type="p">104:第一裝載閘腔室</p>
        <p type="p">105:機器人</p>
        <p type="p">106:移送腔室</p>
        <p type="p">107:機器人</p>
        <p type="p">108:研磨腔室</p>
        <p type="p">116:沉積腔室</p>
        <p type="p">120:第二裝載閘腔室</p>
        <p type="p">130:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1133" publication-number="202618904">
    <tif-files tif-type="multi-tif">
      <tif file="114116914.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組成物</chinese-title>
        <english-title>POLISHING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/304</main-classification>
        <further-classification edition="201201120260131B">B24B37/00</further-classification>
        <further-classification edition="200601120260131B">C09K3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多田真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊山茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAYAMA, AKANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長野貴仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGANO, TAKAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種新穎研磨用組成物，其儘管控制選擇比，卻可抑制研磨後之PID數量。  &lt;br/&gt;　　[解決手段] 一種研磨用組成物，其包含膠質氧化矽、鹼金屬鹽，及具有醯胺鍵之高分子化合物，且pH為9.0~11.5，其中前述研磨用組成物滿足下述條件(i)及/或(ii)：(i)在具有設置有凹部之第1層與以埋填該凹部內之方式來形成之第2層之研磨對象物中，係用於研磨前述第2層而使前述第1層露出的步驟，且前述第1層為選自具有氧-矽鍵者或具有氮-矽鍵者，前述第2層具有矽-矽鍵，(ii)前述膠質氧化矽之矽醇基數為6個/nm&lt;sup&gt;2&lt;/sup&gt;以上22個/nm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a new polishing composition that can suppress the number of PIDs after polishing while controlling a selectivity. &lt;br/&gt; Provided is a polishing composition comprising colloidal silica, an alkali metal salt, and a polymer compound having an amide bond, the polishing composition having a pH of 9.0 to 11.5, (i) wherein the polishing composition is used in a step of polishing a second layer to expose a first layer in an object to be polished including the first layer provided with a recess portion and the second layer formed to fill the inside of the recess portion, and wherein the first layer is selected from the group consisting of a layer having an oxygen-silicon bond and a layer having a nitrogen-silicon bond, and the second layer has a silicon-silicon bond; and/or (ii) wherein the number of silanol groups in the colloidal silica is 6/nm&lt;sup&gt;2&lt;/sup&gt; or more and 22/nm&lt;sup&gt;2&lt;/sup&gt; or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1134" publication-number="202618056">
    <tif-files tif-type="multi-tif">
      <tif file="114116935.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C16/513</main-classification>
        <further-classification edition="200601120260202B">C23C16/52</further-classification>
        <further-classification edition="200601120260202B">C23C16/56</further-classification>
        <further-classification edition="200601120260202B">H01J37/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/67</further-classification>
        <further-classification edition="200601120260202B">H01L21/311</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠控制氮化膜的蝕刻量之技術。  &lt;br/&gt;  本揭露一態樣之基板處理方法，係具有：工序(a)，係準備表面具有氮化膜的基板；工序(b)，係使該基板曝露於從包含氫氣與氧氣的第1處理氣體生成的電漿；工序(c)，係對該基板供給包含含氟氣體與鹼性氣體的第2處理氣體；工序(d)，係依序進行第1次數的該工序(b)與該工序(c)；以及工序(e)，係在該工序(d)之後對該基板進行熱處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1135" publication-number="202619094">
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        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H01L23/48</main-classification>
        <further-classification edition="200601120250602B">H01L25/00</further-classification>
        <further-classification edition="200601120250602B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CXMT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹堪宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, KANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊淩藝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, LING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱曉東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, XIAODONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種半導體結構，包括：基板；設置在基板上的第一介質層，其具有遠離基板的第一表面；第一鍵合墊穿過第一表面並延伸至第一表面下方第一深度；第二鍵合墊穿過第一表面並延伸至第一表面下方第二深度，第二深度小於第一深度；第二介質層設置在第一表面上，第二介質層中設置有第一間隙和第二間隙，第一間隙暴露出第一鍵合墊的頂表面，第二間隙暴露出第二鍵合墊的頂表面。本公開實施例提供的半導體結構中的第一鍵合墊和第二鍵合墊相對於第二介質層的表面凹陷值通過控制第二介質層的厚度來保持一致，避免使用高精度的表面平坦化工藝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:半導體器件</p>
        <p type="p">30:層間絕緣層</p>
        <p type="p">40:第一導電層</p>
        <p type="p">50:第一介質層</p>
        <p type="p">51:第一表面</p>
        <p type="p">60:第二介質層</p>
        <p type="p">601:第一間隙</p>
        <p type="p">602:第二間隙</p>
        <p type="p">70:第一鍵合墊</p>
        <p type="p">71:第二鍵合墊</p>
        <p type="p">701、711:頂表面</p>
        <p type="p">D1:第一深度</p>
        <p type="p">D2:第二深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1136" publication-number="202618946">
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      <tif file="114116938.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H01L21/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CXMT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹堪宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, KANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>季宏凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, HONGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開實施例提供了一種半導體結構的製造方法，包括：提供第一基板，第一基板具有中心區域和邊緣區域；形成覆蓋中心區域和邊緣區域的第一介質層，其中，在遠離中心區域的方向上，覆蓋邊緣區域的第一介質層的厚度逐漸減小；形成覆蓋邊緣區域的第一介質層的第一填充層；平坦化第一填充層，在第一填充層的表面形成與中心區域的第一介質層的表面齊平的第一邊緣區域。本公開實施例提供的製造方法所獲得的半導體結構表面平坦的區域的面積更大，可以有效的改善邊緣區域與中心區域不平整區域面積大的問題，進一步增加了基板的有效使用面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103、S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1137" publication-number="202619095">
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      <tif file="114116977.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
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          <doc-number>202619095</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H01L23/48</main-classification>
        <further-classification edition="200601120250801B">H01L23/528</further-classification>
        <further-classification edition="200601120250801B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔虎浚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金知秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JISOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珍圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵賢俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUNJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐薋瀅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, JAHYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁圭泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, KYUTAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓東煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, DONG-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種範例半導體裝置包括：一基體，其具有彼此相對之一第一表面及一第二表面；一邏輯區塊，其設置在該基體之該第一表面上；一電力遞送網路，其包括該基體之該第二表面上之連接至該邏輯區塊的電力線；以及一連接結構，其穿透該基體且連接一上晶片墊與一下晶片墊，其中該上晶片墊或該下晶片墊中之至少一者可與該邏輯區塊垂直地重疊，且該連接結構可包括與該邏輯區塊水平地間隔開且穿透該基體之一貫通傳導圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example semiconductor device includes a substrate having a first surface and a second surface opposite each other, a logic block provided on the first surface of the substrate, a power delivery network including power lines connected to the logic block on the second surface of the substrate, and a connection structure penetrating the substrate and connecting an upper chip pad and a lower chip pad, wherein at least one of the upper chip pad or the lower chip pad may vertically overlap the logic block, and the connection structure may include a through conductive pattern that is horizontally spaced apart from the logic block and penetrates the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:基體</p>
        <p type="p">105a:第一表面</p>
        <p type="p">105b:第二表面</p>
        <p type="p">1101a:第一上晶片墊</p>
        <p type="p">1101b:第二上晶片墊</p>
        <p type="p">1103a:第一下晶片墊</p>
        <p type="p">1103b:第二下晶片墊</p>
        <p type="p">1150:第二連接端子</p>
        <p type="p">1250:第三連接端子</p>
        <p type="p">A-A':線</p>
        <p type="p">AC:主動接點</p>
        <p type="p">BC:背側接點</p>
        <p type="p">BM:背側佈線線路</p>
        <p type="p">BMa:第一下傳導圖案</p>
        <p type="p">BMb:第二下傳導圖案</p>
        <p type="p">BMc:第三下傳導圖案</p>
        <p type="p">BP:貫通傳導圖案</p>
        <p type="p">BVa:第一下傳導通孔、下傳導通孔</p>
        <p type="p">BVb:第二下傳導通孔、下傳導通孔</p>
        <p type="p">BVc:第三下傳導通孔</p>
        <p type="p">FM:上佈線線路</p>
        <p type="p">FMa:第一上傳導圖案</p>
        <p type="p">FMb:第二上傳導圖案</p>
        <p type="p">FMc:第三上傳導圖案</p>
        <p type="p">FVa:第一上傳導通孔、傳導通孔</p>
        <p type="p">FVb:第二上傳導通孔、傳導通孔</p>
        <p type="p">FVc:第三上傳導通孔、傳導通孔</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">ICSa,ICSb:連接結構</p>
        <p type="p">LCL:下連接線</p>
        <p type="p">IP:邏輯區塊</p>
        <p type="p">PDN:電力分布網路、電力遞送網路</p>
        <p type="p">SD:源極/汲極圖案</p>
        <p type="p">STI:裝置隔離層</p>
        <p type="p">UCL:上連接線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1138" publication-number="202619563">
    <tif-files tif-type="multi-tif">
      <tif file="114117024.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117024</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251121B">H10D84/83</main-classification>
        <further-classification edition="202501120251121B">H10D64/20</further-classification>
        <further-classification edition="202501120251121B">H10D62/10</further-classification>
        <further-classification edition="202501120251121B">H10D84/01</further-classification>
        <further-classification edition="200601120251121B">H01L21/20</further-classification>
        <further-classification edition="200601120251121B">H01L21/027</further-classification>
        <further-classification edition="200601120251121B">H01L21/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>鄭秉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PING-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳稚軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭示內容的半導體結構包括：第一主動區域及第二主動區域；第一閘極結構，設置在該第一主動區域上方；第二閘極結構，設置在該第二主動區域上方；及閘極隔離特徵，夾在該第一閘極結構的側壁與該第二閘極結構的側壁之間。該閘極隔離特徵包括：第一介電層，與該第一閘極結構的該側壁及該第二閘極結構的該側壁介接；擴散阻障襯墊，與該第一介電層介接；及第二介電層，與該擴散阻障襯墊介接。該第二介電層藉由該擴散阻障襯墊與該第一介電層隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure according to the present disclosure includes a first active region and a second active region, a first gate structure disposed over the first active region, a second gate structure disposed over the second active region, and a gate isolation feature sandwiched between a sidewall of the first gate structure and a sidewall of the second gate structure. The gate isolation feature includes a first dielectric layer interfacing the sidewall of the first gate structure and the sidewall of the second gate structure, a diffusion barrier liner interfacing the first dielectric layer, and a second dielectric layer interfacing the diffusion barrier liner. The second dielectric layer is spaced apart from the first dielectric layer by the diffusion barrier liner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">103:隔離特徵</p>
        <p type="p">104:基底鰭片</p>
        <p type="p">106B:第一底部通道結構</p>
        <p type="p">106T:第一頂部通道結構</p>
        <p type="p">108B:第二底部通道結構</p>
        <p type="p">108T:第二頂部通道結構</p>
        <p type="p">110:第一底部閘極結構</p>
        <p type="p">112:第二底部閘極結構</p>
        <p type="p">114:閘極介電層</p>
        <p type="p">120:第一頂部閘極結構</p>
        <p type="p">122:第二頂部閘極結構</p>
        <p type="p">128:絕緣層</p>
        <p type="p">140:閘極隔離特徵</p>
        <p type="p">142:無氧介電層</p>
        <p type="p">144:氧阻斷層</p>
        <p type="p">146:含氧介電層</p>
        <p type="p">300:平坦化製程</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1139" publication-number="202617191">
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          <doc-number>202617191</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卵巢功能之診斷劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K51/04</main-classification>
        <further-classification edition="200601120260202B">C07D401/12</further-classification>
        <further-classification edition="200601120260202B">G01N33/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友成悠葵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMONARI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚田秀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKADA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明係關於一種卵巢功能之診斷劑，其含有通式(1-0)所表示之化合物作為有效成分。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="183px" width="412px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[通式(1-0)中，R表示-O(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-、-O(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;OC&lt;sub&gt;2&lt;/sub&gt;H&lt;sub&gt;4&lt;/sub&gt;-、-CH&lt;sub&gt;2&lt;/sub&gt;O(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-或-CH&lt;sub&gt;2&lt;/sub&gt;O(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;OC&lt;sub&gt;2&lt;/sub&gt;H&lt;sub&gt;4&lt;/sub&gt;-，n表示1～5之整數，Q&lt;sup&gt;1&lt;/sup&gt;表示F或-OCH&lt;sub&gt;3&lt;/sub&gt;]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1140" publication-number="202618890">
    <tif-files tif-type="multi-tif">
      <tif file="114117148.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/20</main-classification>
        <further-classification edition="202501120260123B">H10D30/47</further-classification>
        <further-classification edition="202501120260123B">H10D30/01</further-classification>
        <further-classification edition="202501120260123B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＩＱＥ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IQE PLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩格爾　扎卡里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGEL, ZACHARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉柏汀　歐雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LABOUTIN, OLEG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯坦　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASTEIN, LEWIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於一種半導體結構，其包含：基板；複數個III-V層，其在基板上方；以及第一III-V層，其在複數個III-V層上方。第一III-V層包含：第一子層，其包含第一元素集合；以及第二子層，其在包含第一元素集合之第一子層上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a semiconductor structure comprising: a substrate; a plurality of III-V layers over the substrate; and a first III-V layer over the plurality of III-V layers. The first III-V layer comprises: a first sub-layer comprising a first set of elements; and a second sub-layer over the first sub-layer comprising the first set of elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:HEMT磊晶半導體結構/半導體結構</p>
        <p type="p">110:基板</p>
        <p type="p">120:緩衝層</p>
        <p type="p">130:通道層</p>
        <p type="p">140:障壁層</p>
        <p type="p">150:頂蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1141" publication-number="202619547">
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      <tif file="114117173.zip" no="1">
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      <publication-reference>
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          <doc-number>202619547</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D62/17</main-classification>
        <further-classification edition="202501120251001B">H10D64/27</further-classification>
        <further-classification edition="202501120251001B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文炳鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, BYUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金民佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>黃東勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全在鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JAE HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONG KWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
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              <chinese-name name-type="organization">
                <last-name>李元暢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WON CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，其包括第一及第二主動圖案在基體上沿第一水平方向延伸，該第一及第二主動圖案在第二水平方向上間隔開；場絕緣層，其在基體上且包圍第一及第二主動圖案之側壁；第一及第二閘極電極，其分別在該第一及第二主動圖案上沿第二水平方向延伸，第一及第二閘極電極在第二水平方向上間隔開；以及閘極切口，其在第二水平方向上分隔第一及第二閘極電極。該閘極切口包括部分地在場絕緣層內部之第一部分及在該第一部分上垂直延伸之第二部分。該第二部分之側壁具有連續傾斜輪廓。該第二部分之底部之寬度大於該第二部分之頂部之寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including first and second active patterns extending in a first horizontal direction on a substrate, the first and second active patterns spaced apart in a second horizontal direction; a field insulating layer on the substrate and surrounding sidewalls of the first and second active patterns; first and second gate electrodes respectively extending in the second horizontal direction on the first and second active patterns, the first and second gate electrodes spaced apart in the second horizontal direction; and a gate cut separating the first and second gate electrodes in the second horizontal direction. The gate cut including a first portion partially inside the field insulating layer, and a second portion vertically extending on the first portion. Sidewalls of the second portion have continuous sloped profile. A width of a bottom of the second portion is greater than a width of a top of the second portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基體</p>
        <p type="p">101:第一主動圖案</p>
        <p type="p">102:第二主動圖案</p>
        <p type="p">105:場絕緣層</p>
        <p type="p">111:第一導電層</p>
        <p type="p">112:第二導電層</p>
        <p type="p">121:第一填充導電層</p>
        <p type="p">122:第二填充導電層</p>
        <p type="p">141:第一閘極絕緣層</p>
        <p type="p">142:第二閘極絕緣層</p>
        <p type="p">151:第一罩蓋圖案</p>
        <p type="p">152:第二罩蓋圖案</p>
        <p type="p">170:閘極切口</p>
        <p type="p">171:第一部分</p>
        <p type="p">172:第二部分</p>
        <p type="p">180:第二蝕刻停止層</p>
        <p type="p">185:第二層間絕緣層</p>
        <p type="p">BNW1:第一複數個底部奈米片材</p>
        <p type="p">BNW2:第二複數個底部奈米片材</p>
        <p type="p">CB1:第一閘極接點</p>
        <p type="p">CB2:第二閘極接點</p>
        <p type="p">C-C':線</p>
        <p type="p">DR1:第一水平方向</p>
        <p type="p">DR2:第二水平方向</p>
        <p type="p">DR3:垂直方向</p>
        <p type="p">G1:第一閘極電極</p>
        <p type="p">G2:第二閘極電極</p>
        <p type="p">NS1:第一奈米片材隔離層</p>
        <p type="p">NS2:第二奈米片材隔離層</p>
        <p type="p">UNW1:第一複數個上部奈米片材</p>
        <p type="p">UNW2:第二複數個上部奈米片材</p>
        <p type="p">V1:第一通孔</p>
        <p type="p">V2:第二通孔</p>
        <p type="p">W3,W4:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1142" publication-number="202618792">
    <tif-files tif-type="multi-tif">
      <tif file="114117288.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非揮發性記憶體編寫電路及其方法</chinese-title>
        <english-title>NON-VOLATILE MEMORY PROGRAMMING CIRCUIT AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250620B">G11C17/16</main-classification>
        <further-classification edition="200601120250620B">G11C17/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范銘彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, MING-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳程安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯享宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, HSIANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王至皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">非揮發性記憶體編寫電路包括單次編寫唯讀記憶體(OTPROM)單元、電流源、編寫完成偵測器及控制邏輯電路。OTPROM單元包括相互耦接的熔絲元件與場效電晶體。電流源耦接熔絲元件以使得熔絲元件據以接收編寫電流，電流源與熔絲元件耦接於具有編寫電壓的節點。編寫完成偵測器接收編寫電壓或編寫電流並據以產生編寫完成數位訊號，其中編寫完成數位訊號用以指示OTPROM單元是否已編寫完成。控制邏輯電路耦接編寫完成偵測器以接收編寫完成數位訊號並據以產生第一控制訊號，且透過字元線傳輸第一控制訊號至場效電晶體的控制端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-volatile memory programming circuit includes a one-time programmable read-only memory (OTPROM) cell, a current source, a programming completion detector, and a control logic circuit. The OTPROM cell includes a fuse element and a field effect transistor (FET) coupled to each other. The current source is coupled to the fuse element, such that the fuse element receives a programming current. The current source and the fuse element are coupled to a node having a programming voltage. The programming completion detector receives the programming voltage or the programming current, thereby generating a programmed digital signal. The programmed digital signal indicates whether the OTPROM cell has been programmed. The control logic circuit is coupled to the programming completion detector to receive the programmed digital signal, thereby generating a first control signal. The control logic circuit transmits the first control signal to a control terminal of the FET through a word line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:非揮發性記憶體編寫電路</p>
        <p type="p">110:OTPROM單元</p>
        <p type="p">120:電流源</p>
        <p type="p">130:編寫完成偵測器</p>
        <p type="p">140:控制邏輯電路</p>
        <p type="p">150:電壓箝位電路</p>
        <p type="p">160:位元線驅動器</p>
        <p type="p">170:字元線驅動器</p>
        <p type="p">180:電荷泵</p>
        <p type="p">BL:位元線</p>
        <p type="p">C1:第一控制訊號</p>
        <p type="p">C2:第二控制訊號</p>
        <p type="p">I&lt;sub&gt;CLAMP&lt;/sub&gt;:箝位電流</p>
        <p type="p">I&lt;sub&gt;CMP&lt;/sub&gt;:電流</p>
        <p type="p">I&lt;sub&gt;PGM&lt;/sub&gt;:編寫電流</p>
        <p type="p">M&lt;sub&gt;1&lt;/sub&gt;:場效電晶體</p>
        <p type="p">M&lt;sub&gt;P&lt;/sub&gt;:傳輸閘</p>
        <p type="p">ND:節點</p>
        <p type="p">PGM&lt;sub&gt;success&lt;/sub&gt;:編寫完成數位訊號</p>
        <p type="p">R&lt;sub&gt;fuse&lt;/sub&gt;:熔絲元件</p>
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:供應電壓</p>
        <p type="p">V&lt;sub&gt;NEG&lt;/sub&gt;:負電壓</p>
        <p type="p">V&lt;sub&gt;PGM&lt;/sub&gt;:編寫電壓</p>
        <p type="p">V&lt;sub&gt;POS&lt;/sub&gt;:正電壓</p>
        <p type="p">V&lt;sub&gt;REF&lt;/sub&gt;:參考電壓</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1143" publication-number="202618094">
    <tif-files tif-type="multi-tif">
      <tif file="114117521.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種塊件裝配件及用於佈設鐵軌的套件及其安裝塊件裝配件的方法</chinese-title>
        <english-title>BLOCK ASSEMBLY AND KIT FOR LAYING RAILS AND METHOD OF INSTALLING BLOCK ASSEMBLY THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">E01B26/00</main-classification>
        <further-classification edition="200601120260123B">E01B29/32</further-classification>
        <further-classification edition="200601120260123B">E01B1/00</further-classification>
        <further-classification edition="200601120260123B">E01B3/32</further-classification>
        <further-classification edition="200601120260123B">E01B3/40</further-classification>
        <further-classification edition="200601120260123B">E01B9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商奧鋼聯鐵路系統有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOESTALPINE RAILWAY SYSTEMS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商奧鋼聯鐵路系統諾特拉克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOESTALPINE RAILWAY SYSTEMS NORTRAK LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得森　文森特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERSEN, VINCENT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴　梅倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMON, LARRY T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯陶特　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOUT, JOHN BARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼爾森　蔡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIELSEN, CHASE W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基羅斯奧羅斯科　里卡多何塞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUIROS OROZCO, RICARDO JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所公開的技術方案涉及配置用於直接固定鐵路軌道元件的塊件裝配件。塊件裝配件配置為經由多個鑄入式螺紋嵌入緊固件可操作地與鐵軌緊固件連接。塊件裝配件可以放置在混凝土板上。此外，塊件裝配件可以部分地埋在澆注的混凝土中。塊件裝配件包括多個凹槽，所述多個凹槽與澆注的混凝土接合，以便維持塊件裝配件的位置。塊件裝配件包括被包含在塊件裝配件內的鋼筋裝配件，使得在不會產生通常與鋼筋延伸部分相關聯的問題的情況下增加塊件裝配件的整體性。此外，鋼筋裝配件配置有優化數量的彎曲和焊接點，以便增加整體性並降低製造成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed solution relates to a block assembly that is configured for direct fixation of railway track elements. The block assembly is configured to be operatively connected to a rail fastener via a plurality of cast-in threaded insert fasteners. The block assembly may be placed on a concrete slab. Further, the block assembly may be partially buried in poured concrete. The block assembly comprises a plurality of indentations that interface with the poured concrete in order to maintain the position of the block assembly. The block assembly comprises a rebar assembly that is contained within the block assembly such that the integrity of the block assembly is increased without introducing problems typically associated with rebar extensions. Further, rebar assembly is configured with an optimized number of bends and welding points in order to increase integrity and reduce manufacturing costs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:固定裝配件</p>
        <p type="p">102:鐵軌</p>
        <p type="p">103X:第一軸線</p>
        <p type="p">103Y:第二軸線</p>
        <p type="p">103Z:第三軸線</p>
        <p type="p">201:緊固件裝配件</p>
        <p type="p">203AA:第一螺栓</p>
        <p type="p">203AB:第二螺栓</p>
        <p type="p">203BA:第三螺栓</p>
        <p type="p">203BB:第四螺栓</p>
        <p type="p">203Z:多個螺栓</p>
        <p type="p">204AA:第一鎖定墊圈</p>
        <p type="p">204AB:第二鎖定墊圈</p>
        <p type="p">204BA:第三鎖定墊圈</p>
        <p type="p">204BB:第四鎖定墊圈</p>
        <p type="p">204Z:多個鎖定墊圈</p>
        <p type="p">205:緊固件基座</p>
        <p type="p">206A:第一夾構件</p>
        <p type="p">206B:第二夾構件</p>
        <p type="p">206Z:多個夾構件</p>
        <p type="p">301:塊件裝配件</p>
        <p type="p">308A:第一凹槽</p>
        <p type="p">308B:第二凹槽</p>
        <p type="p">308Z:多個凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1144" publication-number="202619127">
    <tif-files tif-type="multi-tif">
      <tif file="114117526.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含具有包含條狀金屬化互連件的金屬化部分的溝槽電容器裝置的封裝</chinese-title>
        <english-title>PACKAGE COMPRISING A TRENCH CAPACITOR DEVICE WITH A METALLIZATION PORTION COMPRISING BAR METALLIZATION INTERCONNECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/58</main-classification>
        <further-classification edition="200601120260123B">H01L23/00</further-classification>
        <further-classification edition="200601120260123B">H01L23/498</further-classification>
        <further-classification edition="202301120260123B">H01L25/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩托　安尼奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾德雷特　曼紐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALDRETE, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普達　皮義許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, PIYUSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，其包含：一基材；及一被動裝置，其透過至少第一複數個焊料互連件耦接至該基材。該被動裝置包含：一溝槽電容器裝置；一囊封層；及一金屬化部分，其耦接至該溝槽電容器裝置及該囊封層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising a substrate; and a passive device coupled to the substrate through at least a first plurality of solder interconnects. The passive device comprises a trench capacitor device; an encapsulation layer; and a metallization portion coupled to the trench capacitor device and the encapsulation layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝</p>
        <p type="p">101:板</p>
        <p type="p">102:基材</p>
        <p type="p">103:整合裝置</p>
        <p type="p">104:底部填充物</p>
        <p type="p">105:被動裝置</p>
        <p type="p">107:金屬化部分</p>
        <p type="p">110:板介電層</p>
        <p type="p">112:板互連件</p>
        <p type="p">114:焊料互連件</p>
        <p type="p">120:介電層</p>
        <p type="p">122:互連件</p>
        <p type="p">124:阻焊層</p>
        <p type="p">126:阻焊層</p>
        <p type="p">130:柱互連件</p>
        <p type="p">132:焊料互連件</p>
        <p type="p">150:囊封層</p>
        <p type="p">151:溝槽電容器裝置</p>
        <p type="p">152:焊料互連件</p>
        <p type="p">170:介電層</p>
        <p type="p">172:金屬化互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1145" publication-number="202617423">
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      <tif file="114117554.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>底部成形站、形成折疊底部的方法、及用於製造織物袋的裝置</chinese-title>
        <english-title>BOTTOM FORMING STATION, METHOD FOR FORMING A FOLD-OVER BOTTOM, AND DEVICE FOR MANUFACTURING FABRIC BAGS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260124B">B31B70/26</main-classification>
        <further-classification edition="201701120260124B">B31B70/36</further-classification>
        <further-classification edition="201701120260124B">B31B70/64</further-classification>
        <further-classification edition="201701120260124B">B31B70/16</further-classification>
        <further-classification edition="201701120260124B">B31B70/98</further-classification>
        <further-classification edition="201701120260124B">B31B70/10</further-classification>
        <further-classification edition="201701120260124B">B31B70/00</further-classification>
        <further-classification edition="201701320260124B">B31B150/00</further-classification>
        <further-classification edition="201701320260124B">B31B155/00</further-classification>
        <further-classification edition="201701320260124B">B31B160/20</further-classification>
        <further-classification edition="201701320260124B">B31B170/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商史太林格有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STARLINGER &amp; CO GESELLSCHAFT M.B.H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦爾納　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALLNER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦辛格　瓦爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZENECKER, WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種底部成形站（16），用於形成折疊底部，包括：輸送裝置（20），用於沿輸送方向（21）輸送織物筒狀段（11）；折疊裝置（22），用於將該織物筒狀段的端部折疊到該織物筒狀段的織物筒壁上；熱氣噴嘴（12），用於噴射熱氣的，較佳為熱空氣；及壓合裝置（25），用於將該織物筒狀段的端部壓在該織物筒狀段（11）的織物筒壁上以形成折疊底部；其中，該熱氣噴嘴（23）包括至少一個第一出口開口（26），用於向該織物筒壁的外側噴射熱氣；及至少一個第二出口開口（27），用於向該織物筒狀段的端部的內側噴射熱氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bottom forming station (16) for forming a fold-over bottom, comprising: a conveying device (20) for conveying the fabric tube section in a conveying direction (21), a folding device (22) for folding an end portion of the fabric tube section (11) onto a fabric tube wall of the fabric tube section, a hot gas nozzle (12) for discharging hot gas, preferably hot air, and a pressing device (25) for pressing the end portion against the fabric tube wall of the fabric tube section (11) to form the fold-over bottom, wherein the hot gas nozzle (23) comprises at least one first outlet opening (26) for discharging hot gas in the direction of the outside of the fabric tube wall and at least one second outlet opening (27) for discharging hot gas in the direction of the inside of the end portion of the fabric tube section (11).</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:織物筒狀段</p>
        <p type="p">11A:第一織物筒壁</p>
        <p type="p">11B:第二織物筒壁</p>
        <p type="p">11D:間隙</p>
        <p type="p">14A:輸送方向</p>
        <p type="p">16:底部成形站</p>
        <p type="p">20:輸送裝置</p>
        <p type="p">21:輸送方向</p>
        <p type="p">22:折疊裝置</p>
        <p type="p">23:熱氣噴嘴</p>
        <p type="p">24:導引裝置</p>
        <p type="p">25:壓合裝置</p>
        <p type="p">25A:第一壓輥</p>
        <p type="p">25B:第二壓輥</p>
        <p type="p">31:第一流道</p>
        <p type="p">32:第二流道</p>
        <p type="p">33:調節裝置</p>
        <p type="p">34:第一比例閥</p>
        <p type="p">35:第二比例閥</p>
        <p type="p">36:第一氣體加熱單元</p>
        <p type="p">37:第二氣體加熱單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1146" publication-number="202618895">
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      <tif file="114117564.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618895</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>n型矽鍺層之形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">H01L21/208</main-classification>
        <further-classification edition="200601120260121B">H01L21/225</further-classification>
        <further-classification edition="200601120260121B">H01L21/388</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋鋁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYO ALUMINIUM KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木紹太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南山偉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMIYAMA, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻孝輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種n型矽鍺層之形成方法，其係不需要化學氣相沉積法及濺鍍成膜，即可安全且容易地形成n型矽鍺層。&lt;br/&gt;本發明係提供一種n型矽鍺層之形成方法，&lt;br/&gt;其特徵係依序具有：&lt;br/&gt;調製步驟，調製含有（i）鋁、鍺、及含有n型摻雜元素之化合物、（ii）樹脂、以及（iii）溶劑之膏狀組成物；&lt;br/&gt;塗布步驟，將前述膏狀組成物塗布於含矽基板；以及&lt;br/&gt;燒成步驟，以600℃以上1400℃以下之溫度進行加熱，使前述含矽基板的矽成分與前述膏狀組成物中的鋁、鍺及n型摻雜元素形成合金；且&lt;br/&gt;前述膏狀組成物，係於該膏狀組成物中含有1質量%以上80質量%以下之前述鋁作為固體成分，且相對於前述鋁100質量份，含有超過1質量份且5000質量份以下之前述鍺；&lt;br/&gt;前述含有n型摻雜元素之化合物，係含有選自磷、銻、砷及鉍所成群中至少一種元素；&lt;br/&gt;前述含有n型摻雜元素之化合物的含量，相對於前述鋁及前述鍺的含量合計100質量份為1.5質量份以上1000質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1147" publication-number="202619564">
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      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619564</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251128B">H10D84/83</main-classification>
        <further-classification edition="202501120251128B">H10D84/01</further-classification>
        <further-classification edition="202501120251128B">H10D62/10</further-classification>
        <further-classification edition="202501120251128B">H10D62/834</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖均達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHUN-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊愷潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種例示性堆疊裝置結構，其包括設置在基板上方的半導體層堆疊及雙功函數金屬(DWFM)閘極。半導體層堆疊包括設置在第二半導體層上方的第一半導體層。DWFM閘極包括第一閘極介電層、第二閘極介電層、第一類型功函數金屬層、及第二類型功函數金屬層。第一閘極介電層設置在第一半導體層上方，第二閘極介電層設置在第二半導體層上方。第一類型功函數金屬層設置在第一閘極介電層上方，第二類型功函數金屬層設置在第二閘極介電層上方。第一類型功函數金屬層或第二類型功函數金屬層中之至少一者具有漸變成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An exemplary stacked device structure includes a semiconductor layer stack disposed over a substrate and a dual work function metal (DWFM) gate. The semiconductor layer stack includes a first semiconductor layer disposed over a second semiconductor layer. The DWFM gate includes a first gate dielectric layer, a second gate dielectric layer, a first type work function metal layer, and a second type work function metal layer. The first gate dielectric layer is disposed over the first semiconductor layer, and the second gate dielectric layer is disposed over the second semiconductor layer. The first type work function metal layer is disposed over the first gate dielectric layer, and the second type work function metal layer is disposed over the second gate dielectric layer. At least one of the first type work function metal layer or the second type work function metal layer has a gradient composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405~440:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1148" publication-number="202618776">
    <tif-files tif-type="multi-tif">
      <tif file="114117615.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體電路及其操作方法</chinese-title>
        <english-title>MEMORY CIRCUITS AND METHODS FOR OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">G11C11/413</main-classification>
        <further-classification edition="200601120251023B">G11C7/10</further-classification>
        <further-classification edition="200601120251023B">G11C7/12</further-classification>
        <further-classification edition="200601120251023B">G11C8/08</further-classification>
        <further-classification edition="200601120251023B">G11C7/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張盟昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體電路，其包括記憶體陣列，記憶體陣列包含第一記憶體單元及第二記憶體單元，第一記憶體單元中之各者用以儲存資料位元，第二記憶體單元中之各子集用以儲存修復位元，修復位元指示對應第一記憶體單元之位置及隨機位元；暫存器電路，其用以轉移或鎖存複數個修復位元；比較電路，其耦接至暫存器電路，比較電路用以回應於判定位址信號與由修復位元指示的對應第一記憶體單元之位置匹配而提供匹配信號；及多工器，其耦接至比較電路，該多工器用以基於匹配信號輸出隨機位元而非由對應第一記憶體單元儲存的資料位元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory circuit includes a memory array comprising first memory cells and second memory cells, each of the first memory cells configured to store a data bit, and each subset of the second memory cells configured to store repair bits, the repair bits indicating a location of a corresponding first memory cell and a random bit; register circuits, the register circuits configured to transfer or latch the plurality of repair bits; a compare circuit coupled to the register circuits, the compare circuit configured to provide a match signal, in response to determining that an address signal matches the location of the corresponding first memory cell indicated by the repair bits; and a multiplexer coupled to the compare circuit, the multiplexer configured to output the random bit instead of the data bit stored by the corresponding first memory cell, based on the match signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:方法</p>
        <p type="p">910~970:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1149" publication-number="202619537">
    <tif-files tif-type="multi-tif">
      <tif file="114117636.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/67</main-classification>
        <further-classification edition="202501120260123B">H10D62/10</further-classification>
        <further-classification edition="202501120260123B">H10D64/23</further-classification>
        <further-classification edition="202501120260123B">H10D64/27</further-classification>
        <further-classification edition="202501120260123B">H10D30/01</further-classification>
        <further-classification edition="202501120260123B">H10D30/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何柏慷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, PO-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃才育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSAI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體裝置及形成該半導體裝置的方法。該半導體裝置可包括一第一源極/汲極區、相鄰於該第一源極/汲極區的一第一奈米結構、一第二源極/汲極區、相鄰於該第二源極/汲極區的一第二奈米結構、一閘極結構、一間隔物及一介電層。該閘極結構可包括一閘極電極及一閘極介電質。該閘極電極之一第一部分及該閘極介電質的一第一部分可係在該第一奈米結構與該第二奈米結構之間。該間隔物之一第一部分可係在該第一源極/汲極區與該第二源極/汲極區之間。該介電層之一第一部分可係在該閘極介電質之該第一部分與該間隔物的該第一部分之間。該介電層可包括不同於該閘極介電質及該間隔物的一材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and the method of forming the same are provided. The semiconductor device may include a first source/drain region, a first nanostructure adjacent the first source/drain region, a second source/drain region, a second nanostructure adjacent the second source/drain region, a gate structure, a spacer, and a dielectric layer. The gate structure may include a gate electrode and a gate dielectric. A first portion of the gate electrode and a first portion of the gate dielectric may be between the first nanostructure and the second nanostructure. A first portion of the spacer may be between the first source/drain region and the second source/drain region. A first portion of the dielectric layer may be between the first portion of the gate dielectric and the first portion of the spacer. The dielectric layer may include a different material from the gate dielectric and the spacer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">54A~54C:第二奈米結構</p>
        <p type="p">66:鰭片</p>
        <p type="p">77:介電層</p>
        <p type="p">81:間隔物</p>
        <p type="p">90:內部間隔物</p>
        <p type="p">92:磊晶源極/汲極區</p>
        <p type="p">94:觸點蝕刻終止層(CESL)</p>
        <p type="p">96:第一層間介電質(ILD)</p>
        <p type="p">100:閘極介電質</p>
        <p type="p">102:閘極電極</p>
        <p type="p">103:閘極結構</p>
        <p type="p">104:閘極遮罩</p>
        <p type="p">106:第二層間介電質(ILD)</p>
        <p type="p">110:第一氧化矽區</p>
        <p type="p">112:源極/汲極觸點</p>
        <p type="p">114:閘極觸點</p>
        <p type="p">120:半導體裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1150" publication-number="202618797">
    <tif-files tif-type="multi-tif">
      <tif file="114117645.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲存裝置和儲存裝置的除錯與分析方法</chinese-title>
        <english-title>STORAGE DEVICE AND METHODS FOR DEBUGGING AND PROFILING A STORAGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">G11C29/52</main-classification>
        <further-classification edition="200601120250910B">G06F11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　宗旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZONGWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮楚馬尼　瑞卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITCHUMANI, REKHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種儲存裝置以及對儲存裝置進行除錯及分析的方法。所述儲存裝置可包括：第一記憶體媒體，包括第一區及第二區；以及處理器，耦合至第一記憶體媒體。所述處理器可被配置成：自計算裝置的應用程式接收第一命令，其中第一命令與第一資料相關聯；辨識觸發條件的出現；基於辨識出觸發條件的出現而辨識與第一資料相關聯的第二資料；以及將第二資料儲存於第一區中，其中計算裝置被配置成自第一區擷取第二資料，以判斷與第一資料相關聯的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A storage device and methods for debugging and profiling a storage device are disclosed. The storage device may include: a first memory medium comprising a first region and a second region; and a processor coupled to the first memory medium. The processor may be configured to: receive a first command from an application of a computing device, wherein the first command is associated with first data; identify an occurrence of a trigger condition; based on identifying the occurrence of the trigger condition, identify second data associated with the first data; and store the second data in the first region, wherein the computing device is configured to retrieve the second data from the first region for determining a state associated with the first data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主機計算裝置/主機</p>
        <p type="p">102:儲存裝置/儲存記憶體裝置</p>
        <p type="p">104:資料通訊鏈路</p>
        <p type="p">106:處理器</p>
        <p type="p">108:主記憶體</p>
        <p type="p">110:主機介面控制器/介面控制器</p>
        <p type="p">114:應用程式</p>
        <p type="p">116:除錯及分析(D&amp;amp;P)引擎</p>
        <p type="p">120:儲存控制器</p>
        <p type="p">122:儲存記憶體/記憶體</p>
        <p type="p">122a:除錯區</p>
        <p type="p">122b:資料快取區/快取區</p>
        <p type="p">124:非揮發性記憶體(NVM)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1151" publication-number="202619104">
    <tif-files tif-type="multi-tif">
      <tif file="114117712.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/495</main-classification>
        <further-classification edition="200601120260123B">H01L23/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋長達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHINAGA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森山豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYAMA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠降低半導體元件與導線之電阻之半導體裝置。  &lt;br/&gt;半導體裝置100具備：半導體元件30；第1金屬層16，其與上述半導體元件30電性連接；接合層20，其接合於上述第1金屬層16上，且為燒結金屬或焊料；導線24，其接合於上述接合層20上；及第2金屬層22，其設置於貫通上述接合層20之第1孔內，且將上述第1金屬層16與上述導線24電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基底</p>
        <p type="p">12,18:絕緣層</p>
        <p type="p">14:通孔</p>
        <p type="p">16:金屬層(第1金屬層)</p>
        <p type="p">20:接合層</p>
        <p type="p">20A:孔(第1孔)</p>
        <p type="p">22:金屬層(第2金屬層)</p>
        <p type="p">24:導線</p>
        <p type="p">30:半導體元件</p>
        <p type="p">31,36:基板</p>
        <p type="p">32,33,34,37,38,39,42,43:電極</p>
        <p type="p">35:被動元件</p>
        <p type="p">40:電子零件</p>
        <p type="p">41:本體</p>
        <p type="p">100:半導體裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1152" publication-number="202619088">
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      <tif file="114117808.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
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          <doc-number>202619088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統的熱介面材料</chinese-title>
        <english-title>THERMAL INTERFACE MATERIAL FOR SUBSTRATE PROCESSING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">H01L23/373</main-classification>
        <further-classification edition="200601120260124B">C09K5/14</further-classification>
        <further-classification edition="200601120260124B">C08L83/04</further-classification>
        <further-classification edition="201701120260124B">C01B32/158</further-classification>
        <further-classification edition="200601120260124B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>剛杜爾　巴拉岡卡達拉　謙德拉西卡拉　考希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANDUR BALAGANGADHARA, CHANDRASHEKARA KAUSHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉梅什　赫曼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMESH, HEMANTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　敏督</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MINGDU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MM</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋伯　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEBB, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉文納　希發古瑪拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REVANNA, SHIVAKUMARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿耆尼霍提　普拉巴特　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGNIHOTRI, PRABHAT K</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　維奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, VINAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板處理系統組成件的熱介面材料包括奈米碳管及添加至奈米碳管之填充材料。填充材料包括聚二甲基矽氧烷及氮化鋁。製造基板處理系統組成件之熱介面材料的製造方法包括：處理奈米碳管及透過在模具中將包含聚二甲基矽氧烷及氮化鋁之填充材料添加至經處理之奈米碳管中來形成熱介面材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thermal interface material for components of a substrate processing system includes carbon nanotubes and a filler material added to the carbon nanotubes. The filler material includes polydimethylsiloxane and aluminum nitride. A method of manufacturing a thermal interface material for components of a substrate processing system includes processing carbon nanotubes and forming the thermal interface material by adding a filler material including polydimethylsiloxane and aluminum nitride to the processed carbon nanotubes in a mold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:熱介面材料(TIM)</p>
        <p type="p">250:奈米碳管(CNT)</p>
        <p type="p">252:填充材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1153" publication-number="202617281">
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      <tif file="114117817.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117817</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B08B3/02</main-classification>
        <further-classification edition="200601120260123B">B08B3/04</further-classification>
        <further-classification edition="200601120260123B">B08B3/10</further-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮島啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAJIMA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋朋宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永井泰彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, YASUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前川直嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEGAWA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理方法包含：第1單側噴出工序，其一面使第2外噴嘴停止處理液之噴出，一面使第1外噴嘴執行處理液之噴出，該第2外噴嘴配置於較內槽靠上方，向由升降機保持之基板噴出處理液，該第1外噴嘴以於沿相對於由升降機保持之基板垂直之方向觀察時、位於相對於通過基板中心之鉛直線與第2外噴嘴為相反側之方式，配置於較內槽靠上方，向由升降機保持之基板噴出處理液；及第2單側噴出工序，其一面使第1外噴嘴停止處理液之噴出，一面使第2外噴嘴執行處理液之噴出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing method includes causing a first outer nozzle to discharge a processing liquid while causing a second outer nozzle to stop discharging a processing liquid, the first outer nozzle and the second outer nozzle arranged at positions higher than a position of the inner bath so as to be positioned opposite to each other with respect to a vertical line passing through a center of the substrate when viewed in a direction perpendicular to the substrate held on the lifter, and discharging the processing liquid toward the substrate held on the lifter, and causing the second outer nozzle to discharge the processing liquid while causing the first outer nozzle to stop discharging the processing liquid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:升降機</p>
        <p type="p">16:升降致動器</p>
        <p type="p">21:內槽</p>
        <p type="p">23:處理液噴嘴</p>
        <p type="p">27v:排液閥</p>
        <p type="p">31A:第1外噴嘴</p>
        <p type="p">31B:第2外噴嘴</p>
        <p type="p">32A:第1沖洗液閥</p>
        <p type="p">32B:第2沖洗液閥</p>
        <p type="p">C1:中心</p>
        <p type="p">DIW:去離子水</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1154" publication-number="202619083">
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      <tif file="114117825.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減輕積體電路封裝中的熱點的微結構陣列</chinese-title>
        <english-title>MICRO-STRUCTURE ARRAY FOR MITIGATION OF HOT SPOTS IN INTEGRATED CIRCUIT PACKAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/36</main-classification>
        <further-classification edition="200601120260123B">H01L23/00</further-classification>
        <further-classification edition="200601120260123B">H01L23/31</further-classification>
        <further-classification edition="200601120260123B">H01L23/48</further-classification>
        <further-classification edition="200601120260123B">H01L23/498</further-classification>
        <further-classification edition="202301120260123B">H01L25/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>贊達夫　斯易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANDAVI, SEYED HADI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏帕爾　阿斯塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPPAL, AASTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德布　納班庫爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEB, NABANKUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孝謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAOQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　晢永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JE-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維多多　特安戈諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIDODO, TRIANGGONO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　薩維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUN, XAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包括第一積體電路(IC)晶粒，其包含第一表面和與第一IC晶粒橫向相鄰的第二IC晶粒，第二IC晶粒包含第二表面。在第一IC晶粒和第二IC晶粒的全部之上的結構構件包括面向第一表面和第二表面的第一側、與第一側相對的第二側以及一個或多個被動特徵。所述設備還包括與第一表面與第二表面兩者以及第一側接觸的介電質材料的層。所述層可以包括在第一側與第一表面之間延伸的多個第一金屬特徵，其中金屬特徵中的至少一個與被動特徵中的一個接觸。結構構件可以包括在第一側與第二側之間延伸的多個第二金屬特徵。被動特徵可以包括矽或第二金屬特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises a first integrated circuit (IC) die comprising a first surface and a second IC die laterally adjacent to the first IC die comprising a second surface. A structural member over an entirety of the first and second IC dies includes a first side facing the first and second surfaces, a second side opposite the first side, and one or more passive features. The apparatus also comprises a layer of dielectric material contacting the first side and both of the first and second surfaces. The layer may comprise a plurality of first metal features extending between the first side and the first surface, where at least one of the metal features contacts one of the passive features. The structural member may comprise a plurality of second metal features extending between the first and second sides. The passive features may comprise silicon or the second metal features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:IC封裝</p>
        <p type="p">102:封裝基板</p>
        <p type="p">104,106,108:IC晶粒</p>
        <p type="p">110:第一介電質材料</p>
        <p type="p">112:模製材料</p>
        <p type="p">114:電路板</p>
        <p type="p">116:插座</p>
        <p type="p">118:結構矽構件</p>
        <p type="p">120:熱沉</p>
        <p type="p">122:熱介面材料</p>
        <p type="p">124:第二級互連</p>
        <p type="p">127,128,130:焊盤</p>
        <p type="p">132:第一級互連</p>
        <p type="p">134,136:金屬特徵</p>
        <p type="p">138,140:介電質材料</p>
        <p type="p">142,150,152:層</p>
        <p type="p">144,146,148:特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1155" publication-number="202617929">
    <tif-files tif-type="multi-tif">
      <tif file="114117888.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子點體、量子點組成物、波長轉換材料及此等之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">C09K11/02</main-classification>
        <further-classification edition="202501120260124B">H10H20/851</further-classification>
        <further-classification edition="200601120260124B">C08F220/28</further-classification>
        <further-classification edition="200601120260124B">C08K9/04</further-classification>
        <further-classification edition="201101120260124B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳶島一也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBISHIMA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木伸司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野島義弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIMA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種含有藉由激發光發出螢光之量子點之量子點體，前述量子點含有半導體奈米粒子之核心與覆於該半導體奈米粒子之核心之半導體奈米粒子之外殼，且前述量子點之表面係以具有下述(I)式所示之甲基丙烯醯氧乙基與親水基之化合物所修飾者為特徵之量子點體。藉此，提供一種可維持高發光效率，並改善對高極性溶劑之分散性之量子點體。  &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="341px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(R&lt;sub&gt;1&lt;/sub&gt;表示親水基。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:量子點體</p>
        <p type="p">2:核心</p>
        <p type="p">3:外殼</p>
        <p type="p">4:量子點</p>
        <p type="p">5:具有甲基丙烯醯氧乙基與親水基之化合物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1156" publication-number="202619103">
    <tif-files tif-type="multi-tif">
      <tif file="114117892.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子元件嵌於熱增益型凹穴基板之互連板</chinese-title>
        <english-title>INTERCONNECT BOARD WITH ELECTRONIC COMPONENT EMBEDDED IN THERMALLY ENHANCED CAVITY SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L23/492</main-classification>
        <further-classification edition="200601120260126B">H01L23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺橋半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIDGE SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　文強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHARLES W. C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王家忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIACHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳珮雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">互連板包括熱增益型凹穴基板、電子元件、防裂介電層及電路層。熱增益型凹穴基板中之凹穴係由第一傳導島之導熱表面與應力釋除樹脂層之內環繞側壁定義成。熱增益型凹穴基板進一步包括導電柱作為垂直導電通道。凹穴內之電子元件附接至導熱表面上，並被防裂介電層覆蓋且側向環繞。電路層可提供電子元件與導電柱之間的電連接。對於涉及散熱需求高之電子元件(例如功率晶片)的應用，第一傳導島可進一步包括與電子元件底面接觸之金屬化部，以改善熱管理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interconnect board includes a thermally enhanced cavity substrate, an electronic component, a crack-inhibiting dielectric layer and a circuitry layer. The cavity in the thermally enhanced cavity substrate is defined by a heat conduction surface of a first conductive island and inner surrounding sidewalls of a stress-relief resin layer. The thermally enhanced cavity substrate further includes electrically conductive posts as vertical electrical conduction channel. The electronic component in the cavity is attached onto the heat conduction surface and covered and laterally surrounded by the crack-inhibiting dielectric layer. The circuitry layer can provide electrical connections between the electronic component and the electrically conductive posts. For applications involving electrical components with high thermal demand (such as power chips), the first conductive island may further include a metallized segment in contact with the bottom surface of the electronic component to improve thermal management.</p>
      </isu-abst>
      <representative-img>
        <p type="p">16:第一傳導島</p>
        <p type="p">16S1:導熱表面</p>
        <p type="p">16S2:凹入表面</p>
        <p type="p">17:導電柱</p>
        <p type="p">18:第二傳導島</p>
        <p type="p">19:黏著劑</p>
        <p type="p">23:應力釋除樹脂層</p>
        <p type="p">24:界面介電層</p>
        <p type="p">31:電子元件</p>
        <p type="p">41:防裂介電層</p>
        <p type="p">43:電路層</p>
        <p type="p">46:導熱電絕緣層</p>
        <p type="p">161:基部</p>
        <p type="p">162:垂直部</p>
        <p type="p">166:金屬化區</p>
        <p type="p">311:頂部電極層</p>
        <p type="p">313:底部電極層</p>
        <p type="p">431:佈線</p>
        <p type="p">433:導電貫孔</p>
        <p type="p">435:傳導墊</p>
        <p type="p">436:第一金屬化凹部</p>
        <p type="p">438:第二金屬化凹部</p>
        <p type="p">3111:第一接觸墊</p>
        <p type="p">3113:第二接觸墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1157" publication-number="202617614">
    <tif-files tif-type="multi-tif">
      <tif file="114117903.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減少硫化氫清除反應固體積垢</chinese-title>
        <english-title>MITIGATION OF HYDROGEN SULFIDE SCAVENGING REACTION SOLIDS FOULING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260121B">C02F1/68</main-classification>
        <further-classification edition="200601120260121B">C10G29/24</further-classification>
        <further-classification edition="200601120260121B">C10G75/04</further-classification>
        <further-classification edition="200601320260121B">C02F101/10</further-classification>
        <further-classification edition="200601320260121B">C02F103/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＢＬ科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BL TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝格瑞亞　喜特許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAGARIA, HITESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿德瓦萊　莫舒德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEWALE, MOSHOOD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自工業製程流體中移除硫化氫之方法，該方法包含向該工業製程流體中添加處理組合物，其中該處理組合物包含基於甲醛之硫化物清除劑與亞硫酸氫鹽及/或鏻之混合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of removing hydrogen sulfide from an industrial process fluid, the method comprising adding a treatment composition to the industrial process fluid, wherein the treatment composition comprises a mixture of a formaldehyde-based sulfide scavenger and a bisulfite and/or a phosphonium.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1158" publication-number="202618373">
    <tif-files tif-type="multi-tif">
      <tif file="114117955.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像透鏡系統及包括此成像透鏡系統的電子裝置</chinese-title>
        <english-title>IMAGING LENS SYSTEM AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">G02B9/64</main-classification>
        <further-classification edition="202101120251230B">G02B7/02</further-classification>
        <further-classification edition="200601120251230B">G02B5/20</further-classification>
        <further-classification edition="200601120251230B">G02B15/14</further-classification>
        <further-classification edition="200601120251230B">G02B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳宣豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, SEON HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像透鏡系統包括自物體側起依序設置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡及第八透鏡，其中第一透鏡包括反射表面，且成像透鏡系統滿足0＜f1/f＜20，其中f是成像透鏡系統的焦距，且f1是第一透鏡的焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens sequentially disposed from an object side, wherein the first lens includes a reflective surface, and the imaging lens system satisfies 0 ＜ f1/f ＜ 20, where f is a focal length of the imaging lens system and f1 is a focal length of the first lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像透鏡系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">IF:濾光片</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">LG1:第一透鏡組</p>
        <p type="p">LG2:第二透鏡組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1159" publication-number="202619113">
    <tif-files tif-type="multi-tif">
      <tif file="114117961.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117961</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01L23/528</main-classification>
        <further-classification edition="200601120251001B">H01L23/48</further-classification>
        <further-classification edition="200601120251001B">H01L23/49</further-classification>
        <further-classification edition="200601120251001B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳羿輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃以理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-LII</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳榮佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUNG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔暉軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, HUI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構及其製造方法。半導體結構包括：互連結構，位於半導體基板上方且具有頂部金屬特徵；襯墊，位於互連結構上方；及延伸導電線，具有電連接至襯墊且延伸至遠端的近端，其中延伸導電線包括：近端部分，沿第一方向延伸；及非近端部分，沿與第一方向橫向的第二方向延伸，且其中延伸導電線電連接至頂部金屬特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor structures and methods of fabrication are provided. A semiconductor structure includes an interconnect structure lying over a semiconductor substrate and having a top metal feature; a pad lying over the interconnect structure; and an extended conductive line having a proximal end electrically connected to the pad and extending to a distal end, wherein the extended conductive line include a proximal portion extending in a first direction and a non-proximal portion extending in second direction transverse to the first direction, and wherein the extended conductive line is electrically connected to the top metal feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">107:導電特徵</p>
        <p type="p">115:再分佈通孔</p>
        <p type="p">200:襯墊</p>
        <p type="p">201:主體</p>
        <p type="p">205:端面</p>
        <p type="p">220:延伸連接線</p>
        <p type="p">224:近端/端壁</p>
        <p type="p">225:終端/遠端/端壁</p>
        <p type="p">D1:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1160" publication-number="202618793">
    <tif-files tif-type="multi-tif">
      <tif file="114117963.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體單元、記憶體裝置及其製造方法</chinese-title>
        <english-title>MEMORY CELL, MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G11C17/16</main-classification>
        <further-classification edition="202301120251001B">H10B20/25</further-classification>
        <further-classification edition="202501120251001B">H10D89/10</further-classification>
        <further-classification edition="202001120251001B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤野頼信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJINO, YORINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳佑海人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, YUMITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林谷峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史毅駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括複數個記憶體單元、字線、複數個位元線及複數個源極線。各記憶體單元包括單次可程式(OTP)元件及複數個選擇電晶體。字線連接至記憶體單元的選擇電晶體的閘極端。位元線並聯連接於第一節點與記憶體單元的OTP元件的第一OTP元件端之間。源極線並聯連接且將記憶體單元的選擇電晶體的第二源極/汲極端連接至第二節點。亦揭示一種製造記憶體裝置的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a plurality of memory cells, a word line, a plurality of bit lines, and a plurality of source lines. Each memory cell includes an one-time programmable (OTP) element and a plurality of select transistors. The word line is connected to gate terminals of the select transistors of a memory cell. The bit lines are connected in parallel between a first node and a first OTP element terminal of the OTP element of the memory cell. The source lines are connected in parallel and connects second source/drain terminals of the select transistors of the memory cell to a second node. A method for manufacturing the memory device is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:記憶體單元</p>
        <p type="p">210、260、270、280:OTP元件</p>
        <p type="p">220:選擇電晶體</p>
        <p type="p">230、240、250:互連線</p>
        <p type="p">BL:位元線</p>
        <p type="p">SL:源極線</p>
        <p type="p">WL:字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1161" publication-number="202618995">
    <tif-files tif-type="multi-tif">
      <tif file="114117986.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板接合裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/677</main-classification>
        <further-classification edition="200601120260123B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本光治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板接合裝置係包含：第一夾具；第二夾具，係配置於比第一夾具還要下方；至少一個致動器，係使被第一夾具保持的第一基板以及被第二夾具保持的第二基板相對性地動作；殼體，係收容了第一夾具以及第二夾具；送風風扇，係將空氣輸送至殼體的內部；以及空氣導引件，係將藉由送風風扇而被供給至殼體的內部的空氣經由第一通氣口導引至第一夾具的方向。第一通氣口係以於鉛直方向觀看時重合至第一夾具之方式配置於第一夾具的上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板接合裝置</p>
        <p type="p">2e:接合單元</p>
        <p type="p">6:殼體</p>
        <p type="p">8:隔壁</p>
        <p type="p">8p:周壁</p>
        <p type="p">8u:上壁</p>
        <p type="p">10:台座</p>
        <p type="p">11:第一夾具</p>
        <p type="p">15:第一框架</p>
        <p type="p">15o:第一開口部</p>
        <p type="p">16:第一樑部</p>
        <p type="p">17:第一柱部</p>
        <p type="p">21:第二夾具</p>
        <p type="p">43:風扇過濾器單元</p>
        <p type="p">43o:吐出口</p>
        <p type="p">44:外殼</p>
        <p type="p">45:空氣過濾器</p>
        <p type="p">46:送風風扇</p>
        <p type="p">47:電動馬達</p>
        <p type="p">50:空氣流路</p>
        <p type="p">54:第一框架內流路</p>
        <p type="p">H1:第一通氣口</p>
        <p type="p">H3:排氣口</p>
        <p type="p">W1:第一基板</p>
        <p type="p">W2:第二基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1162" publication-number="202617815">
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          <doc-number>202617815</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物之製造方法、硬化物、及電子零件</chinese-title>
        <english-title>RESIN COMPOSITION, METHOD OF PRODUCING CURED PRODUCT, CURED PRODUCT AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F290/14</main-classification>
        <further-classification edition="200601120260202B">C08F299/02</further-classification>
        <further-classification edition="200601120260202B">C08G73/10</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商艾曲迪微系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HD MICROSYSTEMS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原武彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANBARA, TAKEHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物，包含聚醯亞胺前驅物，所述聚醯亞胺前驅物包含聚合性的不飽和鍵，具有下述通式（1）所表示的結構單元且滿足下述條件A及條件B。式中，X表示四價有機基，Y表示二價有機基，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子或一價有機基。&lt;br/&gt;條件A：超過70莫耳%的X為包含聯苯結構的四價有機基X1&lt;br/&gt;條件B：超過50莫耳%的Y為包含聯苯結構的二價有機基Y1&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="254px" width="377px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition, comprising a polyimide precursor that includes a polymerizable unsaturated bond and a structural unit represented by the following Formula (1),&lt;br/&gt;wherein X represents a quadrivalent organic group, Y represents a divalent organic group, and each of R1 and R2 independently represents a hydrogen atom or a monovalent organic group, and&lt;br/&gt;wherein the polyimide precursor satisfies the following Condition A and Condition B:&lt;br/&gt;Condition A: over 70 mol % of X is a quadrivalent organic group X1 that includes a biphenyl structure; and&lt;br/&gt;Condition B: over 50 mol % of Y is a divalent organic group Y1 that includes a biphenyl structure.&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="187px" width="372px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體基板</p>
        <p type="p">2:保護膜</p>
        <p type="p">3:第一導體層</p>
        <p type="p">4:層間絕緣膜</p>
        <p type="p">5:感光性樹脂層</p>
        <p type="p">6A、6B、6C:窗</p>
        <p type="p">7:第二導體層</p>
        <p type="p">8:表面保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1163" publication-number="202618870">
    <tif-files tif-type="multi-tif">
      <tif file="114118015.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>參考載體位置之晶粒接合對準的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DIE BONDING ALIGNMENT REFERENCED TO CARRIER POSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01L21/02</main-classification>
        <further-classification edition="200601120260119B">H01L23/00</further-classification>
        <further-classification edition="200601120260119B">H01L23/544</further-classification>
        <further-classification edition="200601120260119B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休斯曼　賽門　雷納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUISMAN, SIMON REINALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多克　維克托　賽巴斯汀安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLK, VICTOR SEBASTIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　賈格　皮耶特　威廉　荷曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE JAGER, PIETER WILLEM HERMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡駑戈帕蘭　斯安　帕拉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENUGOPALAN, SYAM PARAYIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法拉馬茲　維娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARAMARZI, VINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種系統及方法，該系統及方法用於：判定一或多個半導體施體晶粒相對於該一或多個半導體施體晶粒之一載體上之一或多個載體標記之一位置；及基於該位置，參考該一或多個載體標記將該一或多個半導體施體晶粒對準於一或多個對應受體部位以進行接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for determining a position of one or more semiconductor donor dies relative to one or more carrier marks on a carrier of the one or more semiconductor donor dies; and aligning the one or more semiconductor donor dies to one or more corresponding acceptor locations, referenced to the one or more carrier marks, for bonding, based on the position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:提供</p>
        <p type="p">501:施體晶粒或受體基板定位系統</p>
        <p type="p">502:接合</p>
        <p type="p">504:量測</p>
        <p type="p">506:量測</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1164" publication-number="202617562">
    <tif-files tif-type="multi-tif">
      <tif file="114118072.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板處理站的磁性感測器組件</chinese-title>
        <english-title>A MAGNETIC SENSOR ASSEMBLY FOR A SUBSTRATE PROCESS STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">B65G49/06</main-classification>
        <further-classification edition="200601120260119B">B65G54/02</further-classification>
        <further-classification edition="200601120260119B">G01B7/02</further-classification>
        <further-classification edition="200601120260119B">H01L21/67</further-classification>
        <further-classification edition="200601120260119B">H01L21/677</further-classification>
        <further-classification edition="200601120260119B">H02K41/02</further-classification>
        <further-classification edition="201601120260119B">H02P25/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾伊曼　埃里希馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUMANN, ERICH MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康勒　康斯坦丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONLE, KONSTANTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統的實施例包括載體以支撐基板，該載體包含正弦波元件。此外，該系統亦包括處理站，該處理站包括外殼；設置在該外殼內的膜，該膜將該外殼內的第一區域與第二區域隔開。此外，該處理站包括設置在該第一區域中的第一磁懸浮致動器組件，該第一磁懸浮致動器組件包括複數個定子以使該載體在該第二區域內懸浮並驅動該載體；以及複數個感測器組件。每個感測器組件包括第一感測器以偵測該膜與該正弦波元件的上表面的第一部分之間的第一距離，該上表面限定了正弦波剖面；以及第二感測器以偵測該膜與該上表面的第二部分之間的第二距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of a system includes a carrier to support a substrate, the carrier including a sinusoidal element. In addition, the system includes a process station including a housing, a membrane disposed in the housing that a first region from a second region within the housing. In addition, the process station includes a first magnetic levitation actuator assembly disposed in the first region that includes a plurality of stators to levitate and drive the carrier within the second region, and a plurality of sensor assemblies. Each sensor assembly includes a first sensor to detect a first distance between the membrane and a first portion of an upper surface of the sinusoidal element, the upper surface defining a sinusoidal profile, and a second sensor to detect a second distance between the membrane and a second portion of the upper surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130:載體</p>
        <p type="p">205:站/處理腔室</p>
        <p type="p">206:膜</p>
        <p type="p">207:第一區域</p>
        <p type="p">208:第二區域</p>
        <p type="p">211:底面</p>
        <p type="p">220:框架構件</p>
        <p type="p">230:線性定子</p>
        <p type="p">240:磁懸浮元件</p>
        <p type="p">260:正弦波元件</p>
        <p type="p">261:上表面</p>
        <p type="p">262:中線</p>
        <p type="p">270:校準感測器組件</p>
        <p type="p">272:第一感測器</p>
        <p type="p">273:空間</p>
        <p type="p">A1:第一距離</p>
        <p type="p">A2:第二距離</p>
        <p type="p">A3:第三距離</p>
        <p type="p">D1:間隔距離</p>
        <p type="p">G1:中位間隙</p>
        <p type="p">P1:週期</p>
        <p type="p">S1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1165" publication-number="202619505">
    <tif-files tif-type="multi-tif">
      <tif file="114118128.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251020B">H10D1/40</main-classification>
        <further-classification edition="202501120251020B">H10D1/47</further-classification>
        <further-classification edition="202301120251020B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭新立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭茹雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, RU-SHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡鐸欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, TUO-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁育瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種包括薄膜電阻器的半導體裝置及其製造方法。該方法包括在第一金屬化層內形成包括具有不同矽鉻成分的子層的矽鉻基薄膜電阻器，在矽鉻基薄膜電阻器的端部和接觸結構上形成接觸區。該方法更包括在第一金屬化層上形成包括與接觸結構接觸的其他接觸結構的第二金屬化層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a thin film resistor and a method of fabricating the same are disclosed. The method includes forming, within a first metallization layer, a silicon chromium-based thin film resistor including sub-layers with different silicon chromium compositions, forming contact regions on ends of the silicon chromium based thin film resistor and on contact structures. The method further includes forming, on the first metallization layer, a second metallization layer including other contact structures in contact with the contact structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:薄膜電阻器層/SiCr層</p>
        <p type="p">d0,d1,d2:位置</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1166" publication-number="202619521">
    <tif-files tif-type="multi-tif">
      <tif file="114118156.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250922B">H10D30/01</main-classification>
        <further-classification edition="202501120250922B">H10D30/40</further-classification>
        <further-classification edition="202501120250922B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許清白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHING-PAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宗育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構的形成方法。此方法包含在基板上以垂直方向交替堆疊通道層和犧牲層以形成半導體堆疊，將半導體堆疊圖案化以形成從基板突出的鰭狀結構，在鰭狀結構中形成源極/汲極溝槽，橫向凹蝕鰭狀結構中的犧牲層以形成第一凹槽，以及擴展第一凹槽以形成第二凹槽。在擴展第一凹槽之後，第二凹槽之一的垂直尺寸大於犧牲層的厚度。此方法更包含在第二凹槽中形成內間隔物，以及在源極/汲極溝槽中形成源極/汲極部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a semiconductor structure is provided. The method includes alternately stacking channel layers and sacrificial layers on a substrate in a vertical direction to form a semiconductor stack, patterning the semiconductor stack to form a fin-shaped structure protruding from the substrate, forming a source/drain trench in the fin-shaped structure, laterally recessing the sacrificial layers in the fin-shaped structure to form first recesses, and enlarging the first recesses to form second recesses. One of the second recesses has a vertical dimension greater than a thickness of the sacrificial layer after enlarging the first recesses. The method further includes forming inner spacers in the second recesses, and forming a source/drain feature in the source/drain trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:區塊</p>
        <p type="p">104:區塊</p>
        <p type="p">106:區塊</p>
        <p type="p">108:區塊</p>
        <p type="p">110:區塊</p>
        <p type="p">112:區塊</p>
        <p type="p">114:區塊</p>
        <p type="p">116:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1167" publication-number="202619471">
    <tif-files tif-type="multi-tif">
      <tif file="114118157.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置和其製造方法與產生其佈局圖的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING AND METHOD OF GENERATING LAYOUT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251001B">H10B10/00</main-classification>
        <further-classification edition="202501120251001B">H10D89/10</further-classification>
        <further-classification edition="202001120251001B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路裝置，包括定位在基板中的靜態隨機存取記憶體裝置，該SRAM裝置包括第一互補場效電晶體、第二CFET、第三CFET、及第四CFET，第一CFET包括定位在第一高度處的第一通道閘電晶體，第二CFET包括定位在第一高度處的第一下拉電晶體及定位在第二高度處的第一上拉電晶體，第三CFET包括定位在第一高度處的第二下拉電晶體及定位在第二高度處的第二上拉電晶體，第四CFET包括定位在第一高度處的第二通道閘電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit (IC) device includes a static random-access memory (SRAM) device positioned in a substrate, the SRAM device including a first complementary field-effect transistor (CFET) including a first pass-gate transistor positioned at a first elevation, a second CFET including a first pull-down transistor positioned at the first elevation and a first pull-up transistor positioned at a second elevation, a third CFET including a second pull-down transistor positioned at the first elevation and a second pull-up transistor positioned at the second elevation, and a fourth CFET including a second pass-gate transistor positioned at the first elevation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體單元/SRAM單元</p>
        <p type="p">BL:位元線</p>
        <p type="p">BLB:位元線</p>
        <p type="p">ND:互連區/結構/節點</p>
        <p type="p">PD:下拉電晶體</p>
        <p type="p">PG:通道閘電晶體</p>
        <p type="p">PU:上拉電晶體</p>
        <p type="p">VDD:功率供應電壓/功率供應電壓節點/功率供應電壓線</p>
        <p type="p">VSS:參考電壓/參考電壓節點/參考電壓線</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1168" publication-number="202618765">
    <tif-files tif-type="multi-tif">
      <tif file="114118158.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體電路及操作記憶體電路的方法</chinese-title>
        <english-title>MEMORY CIRCUIT AND METHOD FOR OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251008B">G11C5/14</main-classification>
        <further-classification edition="200601120251008B">G11C7/10</further-classification>
        <further-classification edition="200601120251008B">G11C7/22</further-classification>
        <further-classification edition="200601120251008B">G11C8/08</further-classification>
        <further-classification edition="200601120251008B">G11C8/14</further-classification>
        <further-classification edition="202501120251008B">H10D62/10</further-classification>
        <further-classification edition="202501120251008B">H10D64/20</further-classification>
        <further-classification edition="202301120251008B">H10B63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山雅義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, MASAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體電路包括：記憶體陣列，包括耦合至字元線的記憶體單元；及驅動器電路，經由該字元線耦合至該些記憶體單元的。該驅動器電路包括：p型電晶體，耦合在該字元線與在該第一、第二及第三電源電壓中選擇的可切換電壓之間；反相器，具有輸入端，用以接收在第一邏輯狀態下提供的選擇訊號的邏輯反相版本以斷言該字元線，及輸出端，用以提供中間訊號；及第一n型電晶體，具有閘極端、第一源極/汲極端及第二源極/汲極端。該閘極端用以接收在該第一電源電壓與第四電源電壓之間切換的控制訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory circuit includes a memory array including memory cells coupled to a word line and a driver circuit coupled to the memory cells through the word line. The driver circuit includes a p-type transistor coupled between the word line and a switchable voltage selected among first, second, and third supply voltages, an inverter having an input configured to receive a logically inverted version of a selection signal provided at a first logic state to assert the word line and an output configured to provide an intermediate signal, and a first n-type transistor having a gate terminal, a first source/drain terminal, and a second source/drain terminal. The gate terminal is configured to receive a control signal switching between the first supply voltage and a fourth supply voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:記憶體電路</p>
        <p type="p">330:驅動器電路</p>
        <p type="p">331:第一p型電晶體</p>
        <p type="p">332:第一n型電晶體</p>
        <p type="p">333:第二p型電晶體</p>
        <p type="p">334:第二n型電晶體</p>
        <p type="p">335:反相器</p>
        <p type="p">338:交叉耦合電晶體</p>
        <p type="p">360:開關電路</p>
        <p type="p">CTL:控制訊號</p>
        <p type="p">HV:高壓</p>
        <p type="p">LV:低壓</p>
        <p type="p">SEL:選擇訊號</p>
        <p type="p">SW_R、SW_RST、SW_SET:開關</p>
        <p type="p">tr:電晶體</p>
        <p type="p">VDD:第一電源電壓</p>
        <p type="p">VDMAX:第四電源電壓</p>
        <p type="p">VGH:訊號</p>
        <p type="p">VS:中間訊號</p>
        <p type="p">VWL:可切換電壓</p>
        <p type="p">VWLRST:第三電源電壓</p>
        <p type="p">VWLSET:第二電源電壓</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1169" publication-number="202617582">
    <tif-files tif-type="multi-tif">
      <tif file="114118379.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微機電裝置中的抗粘附離子潤滑劑</chinese-title>
        <english-title>ANTI-STICTION IONIC LUBRICANTS IN MEMS DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B81B3/00</main-classification>
        <further-classification edition="200601120260202B">B81C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商德州儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEXAS INSTRUMENTS INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里斯　優路伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARIS, UROOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾普特金　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPTEKIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢納柏　穆拉里德哈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANABE, MURALIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在實例中，一種微機電裝置包含：一可移動元件，其經組態以接觸一表面之一部分；及一離子液體，其位於該表面之該部分上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In examples, a microelectromechanical device comprises a moveable element configured to contact a portion of a surface, and an ionic liquid on the portion of the surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">604:鏡面</p>
        <p type="p">606:電極</p>
        <p type="p">608:扭轉鉸鏈</p>
        <p type="p">610:彈簧尖端</p>
        <p type="p">612:潤滑劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1170" publication-number="202617691">
    <tif-files tif-type="multi-tif">
      <tif file="114118412.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物及阻劑圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C309/42</main-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D327/04</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新田和行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高山寿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAYAMA, TOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由曝光產生酸，且藉由酸之作用而對顯影液之溶解性改變之阻劑組成物。含有藉由酸之作用而對顯影液之溶解性改變之樹脂成分(A1)、藉由曝光而產生酸之酸產生劑成分(B)，與界面活性劑(G01)。酸產生劑成分(B)及界面活性劑(G01)，不含二氟甲基及三氟甲基。惟，將成為式(np1)、(np2)或(np3)所示之結構之情形除外。X&lt;sup&gt;1&lt;/sup&gt;表示-OR&lt;sup&gt;1&lt;/sup&gt;、-N(R&lt;sup&gt;2&lt;/sup&gt;)R&lt;sup&gt;1&lt;/sup&gt;或-N(R&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;。X&lt;sup&gt;2&lt;/sup&gt;表示甲基等。X&lt;sup&gt;3&lt;/sup&gt;表示亞甲基等。R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;1&lt;/sup&gt;表示亞甲基等。  &lt;br/&gt;&lt;img align="absmiddle" height="123px" width="410px" file="ed10119.JPG" alt="ed10119.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1171" publication-number="202617618">
    <tif-files tif-type="multi-tif">
      <tif file="114118474.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支持玻璃基板、層積體、層積體之製造方法、半導體封裝之製造方法及玻璃基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C03C3/076</main-classification>
        <further-classification edition="200601120260202B">C03C3/087</further-classification>
        <further-classification edition="200601120260202B">C03C3/093</further-classification>
        <further-classification edition="200601120260202B">H01L23/12</further-classification>
        <further-classification edition="200601120260202B">H01L23/15</further-classification>
        <further-classification edition="200601120260202B">H01L23/29</further-classification>
        <further-classification edition="200601120260202B">H01L23/31</further-classification>
        <further-classification edition="200601120260202B">H01L21/56</further-classification>
        <further-classification edition="200601120260202B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田都</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, MIYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, MICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供具有高生產性、高機械強度、於短波長下具有高透過率，並在與半導體封裝的熱膨脹係數整合性方面優異的支持玻璃基板。  &lt;br/&gt;　　本發明相關之支持玻璃基板，係用於支持加工基板的支持玻璃基板，作為玻璃組成，以莫爾%計，含有SiO&lt;sub&gt;2&lt;/sub&gt; 50~70.5%、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 1~15%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 0~15%、MgO 1~15%、CaO 1~15%、Na&lt;sub&gt;2&lt;/sub&gt;O 1~25%、K&lt;sub&gt;2&lt;/sub&gt;O 1~10%、ZrO&lt;sub&gt;2&lt;/sub&gt; 0.5~10%，且莫爾比(Na&lt;sub&gt;2&lt;/sub&gt;O+K&lt;sub&gt;2&lt;/sub&gt;O)/(B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;+MgO+CaO)為1~4。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:層積體</p>
        <p type="p">10:支持玻璃基板</p>
        <p type="p">11:加工基板</p>
        <p type="p">12:剝離層</p>
        <p type="p">13:黏著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1172" publication-number="202619522">
    <tif-files tif-type="multi-tif">
      <tif file="114118539.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及用以製造其之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/01</main-classification>
        <further-classification edition="202501120260123B">H10D30/43</further-classification>
        <further-classification edition="202501120260123B">H10D30/62</further-classification>
        <further-classification edition="202501120260123B">H10D62/10</further-classification>
        <further-classification edition="202501120260123B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供具有絕緣結構的半導體元件及製造方法。一種方法包含在基板上形成鰭；在鰭上形成閘極，其中側壁間隔物與閘極橫向相鄰；移除側壁間隔物的上部；藉由移除閘極的選定區段及移除位於選定區段下方的選定鰭形成空腔；以及在空腔中形成絕緣特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices with insulation structures and methods of fabrication are provided. A method includes forming fins over a substrate; forming a gate over the fins, wherein a sidewall spacer is laterally adjacent to the gate; removing an upper portion of the sidewall spacer; forming a cavity by removing a selected segment of the gate and removing a selected fin located under the selected segment; and forming an insulation feature in the cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">S1010,S1020,S1030,S1040,S1050,S1060,S1070,S1080,S1090,S1100,S1110,S1120,S1130,S1140,S1150,S1160,S1170,S1180,S1190,S1200:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1173" publication-number="202618606">
    <tif-files tif-type="multi-tif">
      <tif file="114118573.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造積體電路裝置的方法及其建模系統</chinese-title>
        <english-title>METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE AND MODELING SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120251105B">G06F30/392</main-classification>
        <further-classification edition="202501120251105B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪如薏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖姜婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIANG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁雅欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YA-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳澤銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造積體電路的方法包括接收一積體電路佈局圖，該積體電路佈局圖包括：在一第一方向上與一第一導體體積相鄰的一第一半導體體積；在第一方向上從第一導體體積延伸到第二半導體體積的一第二導體體積；以及一介面，包括第一半導體體積和第二導體體積各自的平面區域，該平面區域垂直於與第一方向垂直的第二方向；基於第一半導體體積或第二導體體積的一個或多個尺寸值判斷介面的等效電阻值；以及利用等效電阻值修改與積體電路佈局圖相對應的一積體電路元件模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing an IC includes receiving an IC layout diagram including a first semiconductor volume adjacent to a first conductor volume in a first direction, a second conductor volume extending from the first conductor volume to a second semiconductor volume in the first direction, and an interface including a planar region of each of the first semiconductor volume and the second conductor volume perpendicular to a second direction perpendicular to the first direction, determining an equivalent resistance value of the interface based on one or more dimensional values of the first semiconductor volume or the second conductor volume, and modifying an IC device model corresponding to the IC layout diagram by using the equivalent resistance value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:IC製造系統</p>
        <p type="p">620:設計室</p>
        <p type="p">622:IC設計佈局圖</p>
        <p type="p">630:遮罩室</p>
        <p type="p">644:遮罩製造</p>
        <p type="p">650:IC製造廠</p>
        <p type="p">652:製造工具</p>
        <p type="p">653:半導體晶片</p>
        <p type="p">660:IC裝置</p>
        <p type="p">1132:資料準備</p>
        <p type="p">1145:遮罩(光罩)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1174" publication-number="202619558">
    <tif-files tif-type="multi-tif">
      <tif file="114118739.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D84/01</main-classification>
        <further-classification edition="202501120251103B">H10D64/01</further-classification>
        <further-classification edition="202501120251103B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何士融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, SHIH-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡寬侃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, KUAN-KAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昕揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, HSIN YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RUI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊固峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構的形成方法包括以下步驟：形成下源極/汲極區域；形成第一接觸蝕刻終止層及位於第一接觸蝕刻終止層上方的第一層間介電層；在第一層間介電層上方形成上源極/汲極區域；及形成第二接觸蝕刻終止層及位於第二接觸蝕刻終止層上方的第二層間介電層。執行蝕刻製程以在第一接觸蝕刻終止層、第一層間介電層、第二接觸蝕刻終止層及第二層間介電層中形成溝槽；在溝槽中形成虛設襯墊；在溝槽中形成介電襯墊；在溝槽中形成接觸插塞且由虛設襯墊及介電襯墊環繞；及移除虛設襯墊以形成空氣間隔物。空氣間隔物環繞接觸插塞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a semiconductor structure includes forming a lower source/drain region, forming a first contact etch stop layer and a first inter-layer dielectric over the first contact etch stop layer, forming an upper source/drain region over the first inter-layer dielectric and forming a second contact etch stop layer and a second inter-layer dielectric over the second contact etch stop layer, performing an etching process to form a trench in the first contact etch stop layer, the first inter-layer dielectric, the second contact etch stop layer, and the second inter-layer dielectric, forming a dummy liner in the trench, forming a dielectric liner in the trench, forming a contact plug in the trench and encircled by the dummy liner and the dielectric liner, and removing the dummy liner to form an air spacer. The air spacer encircles the contact plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">32:介電隔離區域</p>
        <p type="p">45:鰭片間隔物</p>
        <p type="p">62L:下源極/汲極區域</p>
        <p type="p">62U:上源極/汲極區域</p>
        <p type="p">66:第一CESL</p>
        <p type="p">68:第一ILD</p>
        <p type="p">70:第二CESL</p>
        <p type="p">72:第二ILD</p>
        <p type="p">114、134、164:介電襯墊</p>
        <p type="p">116:接觸插塞</p>
        <p type="p">135A~135C:源極/汲極矽化物層</p>
        <p type="p">136、136A、136B:接觸插塞</p>
        <p type="p">138、144A、144B:區域</p>
        <p type="p">142、142A、142B、166:空氣間隔物</p>
        <p type="p">142A1~142A3、142B1~142B3:空氣間隔物部分</p>
        <p type="p">148:蝕刻終止層</p>
        <p type="p">150:介電層</p>
        <p type="p">152、152A、152B:導電特徵</p>
        <p type="p">156:介電基板</p>
        <p type="p">158:矽化物層</p>
        <p type="p">160:背側接觸插塞</p>
        <p type="p">162:背側再分佈線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1175" publication-number="202619508">
    <tif-files tif-type="multi-tif">
      <tif file="114118956.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容器結構及其製造方法</chinese-title>
        <english-title>CAPACITOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D1/60</main-classification>
        <further-classification edition="202501120251103B">H10D1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余科京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KEJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭安皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ANHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝炳邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, PING-PANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電容器結構，其包括垂直在基板上方的至少兩個第一底部金屬通孔；在第一底部金屬通孔上方並與之接觸的第一底部金屬層；及在第一底部金屬層上方的深溝槽電容器。深溝槽電容器包括在第一底部金屬層之頂表面上方並與之接觸的底部電極；在底部電極上方的頂部電極；及在底部電極與頂部電極之間的介電層。底部電極在與第一底部金屬層之頂表面相鄰的位準處側向界定具有第一矩形形狀的第一區域。第一底部金屬層側向界定比第一區域大並側向覆蓋第一區域的第二區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitor structure includes at least two first bottom metal vias vertically over a substrate; a first bottom metal layer over and in contact with the first bottom metal vias; and a deep trench capacitor over the first bottom metal layer. The deep trench capacitor includes a bottom electrode over and in contact with a top surface of the first bottom metal layer; a top electrode over the bottom electrode; and a dielectric layer between the bottom electrode and the top electrode. The bottom electrode at a level adjacent to the top surface of the first bottom metal layer laterally defines a first area having a first rectangular shape. The first bottom metal layer laterally defines a second area larger than the first area and laterally covering the first area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">12:第一電晶體</p>
        <p type="p">20:電容器</p>
        <p type="p">20T:深溝槽</p>
        <p type="p">22:底部電極</p>
        <p type="p">22B:底部部分</p>
        <p type="p">24:頂部電極</p>
        <p type="p">24B:底部部分</p>
        <p type="p">25:ILD</p>
        <p type="p">26:介電層</p>
        <p type="p">26B:底部部分</p>
        <p type="p">28:覆蓋層</p>
        <p type="p">31:第一底部金屬層/底部金屬層/底部金屬線</p>
        <p type="p">31F:頂表面</p>
        <p type="p">32:第一底部金屬通孔/底部金屬通孔/通孔</p>
        <p type="p">33:第二底部金屬層/第二底部金屬線</p>
        <p type="p">34:第二底部金屬通孔</p>
        <p type="p">41:第一頂部通孔/第一頂部金屬通孔</p>
        <p type="p">42:第一頂部金屬層/第一頂部金屬線</p>
        <p type="p">43:頂部接觸襯墊</p>
        <p type="p">100A:電容器電路/電路/結構</p>
        <p type="p">I:線</p>
        <p type="p">II:線</p>
        <p type="p">III:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1176" publication-number="202618951">
    <tif-files tif-type="multi-tif">
      <tif file="114118968.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、校正用基板及校正方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/66</main-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂﨑哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAZAKI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸本洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在說明一種基板處理裝置、校正用基板及校正方法，可在不變更用以處理基板之處理室內所配置之輻射溫度感測器之位置的情形下，校正輻射溫度感測器。一種基板處理裝置，具備：固持部，用以固持基板或校正用基板；加熱部，用以加熱被固持部所固持的基板或校正用基板；及輻射溫度感測器，用以偵測從基板或校正用基板釋出之紅外線，而測定基板或校正用基板之溫度分布。校正用基板包含：第一主面，與加熱部成對向；及第二主面，係與第一主面相反的面，以輻射溫度感測器測定溫度分布。第二主面包含：第一部分，有第一材料露出來；及第二部分，有輻射率低於第一材料之第二材料露出來。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">HR:高輻射率構件(第一材料)</p>
        <p type="p">J:校正用基板(第二材料)</p>
        <p type="p">Ja:頂面(第二主面)</p>
        <p type="p">J1:部分(第二部分)</p>
        <p type="p">J2:部分(第一部分)</p>
        <p type="p">J2a:中心部分</p>
        <p type="p">J2b:圓環部分</p>
        <p type="p">Jd:中心部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1177" publication-number="202619400">
    <tif-files tif-type="multi-tif">
      <tif file="114118994.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於燈具冷卻之擋板配置</chinese-title>
        <english-title>BAFFLE ARRANGEMENT FOR LAMP COOLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05B3/00</main-classification>
        <further-classification edition="200601120260123B">H05B1/02</further-classification>
        <further-classification edition="200601120260123B">H05B3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘迪　維許瓦思庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDEY, VISHWAS KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉迪安　雅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORADIAN, ALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏普迪　安諾庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BODEPUDI, ANIL KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種配備擋板的處理腔室，該擋板經佈置以增強處理腔室內燈具的冷卻。在一個態樣中，處理腔室包括限定上部腔室的上部外殼。該處理腔室亦具有罩和具有燈具架的上部燈具模組，該燈具架經佈置以保持複數個上部燈具。罩與上部燈具模組連接。該罩、該上部燈具模組和該上部外殼限定該上部腔室的外通道。該處理腔室亦包含將該外通道分隔為上區段和下區段的擋板。該擋板經佈置以促進冷卻流體流經下區段並流向上部燈具，以提供對上部燈具的冷卻的流動。亦提供了一種操作具有處理腔室的處理系統的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process chamber equipped with a baffle arranged to enhance cooling of lamps of the process chamber is provided. In one aspect, a process chamber includes an upper housing defining an upper chamber. The process chamber also has a shroud and an upper lamp module having a lamp holder arranged to hold a plurality of upper lamps. The shroud is connected to the upper lamp module. The shroud, the upper lamp module, and the upper housing define an outer passage of the upper chamber. The process chamber also includes a baffle separating the outer passage into an upper section and a lower section. The baffle is arranged to facilitate a flow of a cooling fluid flowing through the lower section to the upper lamps to provide cooling thereto. A method of operating a processing system having a process chamber is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理系統</p>
        <p type="p">102:處理腔室</p>
        <p type="p">104:氣源</p>
        <p type="p">106:排氣泵</p>
        <p type="p">108:控制器</p>
        <p type="p">110:外殼結構</p>
        <p type="p">112:石英腔室</p>
        <p type="p">114:上窗口</p>
        <p type="p">116:下窗口</p>
        <p type="p">118:處理體積</p>
        <p type="p">120:板</p>
        <p type="p">122:板</p>
        <p type="p">124:基板支撐組件</p>
        <p type="p">126:支撐件</p>
        <p type="p">128:軸</p>
        <p type="p">130:懸架</p>
        <p type="p">132:致動器</p>
        <p type="p">134:基板</p>
        <p type="p">136:預熱環</p>
        <p type="p">138:上部燈具</p>
        <p type="p">140:下部燈具</p>
        <p type="p">142:外反射體</p>
        <p type="p">144:內反射體</p>
        <p type="p">146:處理器</p>
        <p type="p">148:記憶體</p>
        <p type="p">150:電路</p>
        <p type="p">152:上部腔室組件</p>
        <p type="p">154:上部組件</p>
        <p type="p">156:下部組件</p>
        <p type="p">158:入口管道</p>
        <p type="p">242:擋板</p>
        <p type="p">CF:冷卻流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1178" publication-number="202619023">
    <tif-files tif-type="multi-tif">
      <tif file="114119002.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理腔室的邊緣環配置以及相關腔室套件和方法</chinese-title>
        <english-title>EDGE RING CONFIGURATIONS FOR PROCESSING CHAMBERS AND RELATED CHAMBER KITS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/687</main-classification>
        <further-classification edition="200601120260123B">C23C16/46</further-classification>
        <further-classification edition="200601120260123B">C23C16/458</further-classification>
        <further-classification edition="200601120260123B">C30B25/10</further-classification>
        <further-classification edition="200601120260123B">C30B25/12</further-classification>
        <further-classification edition="200601120260123B">C30B25/14</further-classification>
        <further-classification edition="200601120260123B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達摩哈朗　拉傑穆拉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHAMODHARAN, RAJA MURALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樹坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHU-KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　作明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫哈納達斯　卡萊法楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOHANADASS, KALAIVANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　阿尼克尼汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKETNITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例係關於多區段基板支撐、相關處理套組、處理腔室、元件以及半導體製造的方法。在一或多個實施例中，處理腔室包括腔室主體、一或多個熱源、支撐和邊緣環。腔室主體包括處理空間、在腔室主體中形成的一或多個氣體注入通道，以及在腔室主體中形成的一或多個氣體排氣通道。這些熱源可用於加熱處理空間。支撐設置在處理空間中，邊緣環至少部分地受到支撐。邊緣環包括環形部分，並且有肩部抵靠支撐，使環形部分與支撐之間留有間隙。邊緣環定義內部部分，其大小和形狀適合支撐基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to multi-section substrate supports, and related process kits, processing chambers, components, and methods for semiconductor manufacturing. In one or more embodiments, a processing chamber includes a chamber body, one or more heat sources, a support, and an edge ring. The chamber body includes a processing volume, one or more gas inject passages formed in the chamber body, and one or more gas exhaust passages formed in the chamber body. The one or more heat sources are operable to heat the processing volume. The support is disposed in the processing volume, and the edge ring is at least partially supported by the support. The edge ring includes an annular section, and a shoulder abutting against the support to position the annular section at a gap from the support. The edge ring defines an inner portion that is sized and shaped to support a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112a:支撐</p>
        <p type="p">112b:支撐</p>
        <p type="p">112c:支撐</p>
        <p type="p">150:腔室套件/處理套組</p>
        <p type="p">169:第二板</p>
        <p type="p">301:邊緣環</p>
        <p type="p">303:邊緣環</p>
        <p type="p">305:支柱結構</p>
        <p type="p">309:支柱結構</p>
        <p type="p">405a:頂表面</p>
        <p type="p">407:柱子</p>
        <p type="p">411a:頂表面</p>
        <p type="p">417a:頂表面</p>
        <p type="p">1021:第一支臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1179" publication-number="202618538">
    <tif-files tif-type="multi-tif">
      <tif file="114119034.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618538</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體超頻裝置及記憶體超頻方法</chinese-title>
        <english-title>MEMORY OVERCLOCKING DEVICE AND MEMORY OVERCLOCKING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">G06F3/06</main-classification>
        <further-classification edition="201901120250701B">G06F1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡嘉志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIA-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　光線</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE, QUANG-TUYEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏良霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, LIANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　行義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HANG-YEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彥竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YEN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖哲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, TSE-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高聖亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHENG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體超頻裝置包含記憶體及處理器。記憶體儲存複數個指令及基本輸入輸出系統。處理器用以根據記憶體的複數個指令執行以下步驟：藉由基本輸入輸出系統根據超頻演算法針對待測物進行超頻預測；藉由基本輸入輸出系統根據超頻預測以輸出最佳超頻結果資訊；以及根據最佳超頻結果資訊、待測物的硬體資訊及頻率閾值範圍資訊輸出至少二合規結果資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory overclocking device includes a memory and a processor. The memory stores a plurality of commands and a basic input/output system. The processor is configured to perform the following steps according to the plurality of commands in the memory: performing an overclocking prediction for an object under test according to an overclocking algorithm through the basic input/output system; outputting a best overclocking result data according to the overclocking prediction through the basic input/output system; and outputting at least two compliance result data according to the best overclocking result data, a hardware data of the object under test and a frequency threshold range data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體超頻裝置</p>
        <p type="p">110:記憶體</p>
        <p type="p">111:基本輸入輸出系統</p>
        <p type="p">120:處理器</p>
        <p type="p">900:待測物</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1180" publication-number="202618080">
    <tif-files tif-type="multi-tif">
      <tif file="114119036.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磷化銦基板及半導體磊晶晶圓</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C30B29/40</main-classification>
        <further-classification edition="202501120260202B">H10D62/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＸ金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JX ADVANCED METALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木健二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種磷化銦基板，其關於對基板表面藉由ToF-SIMS分析而獲得之質荷比m/z≦350之能夠鑑定的所有陽離子碎片離子，（僅由H、C、N、O及F構成之碎片離子之相對強度）/（包含In及P中之一種以上與H、C、N、O及F中之一種以上之碎片離子之相對強度）為0.6以上0.9以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1181" publication-number="202617152">
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      <tif file="114119085.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>杭丁頓氏舞蹈症的治療</chinese-title>
        <english-title>TREATMENT OF HUNTINGTON'S DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/5025</main-classification>
        <further-classification edition="200601120260202B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＰＴＣ治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PTC THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比爾斯　布萊恩　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEERS, BRIAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴哈塔查亞　艾努拉德哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATTACHARYYA, ANURADHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷德勞　艾美　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREDLAU, AMY LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述了在有需要的受試者中治療杭丁頓氏舞蹈症之方法。該方法包括向該有需要的受試者投與治療有效量的2-[3-(2,2,6,6-四甲基哌啶-4-基)-3H-[1,2,3]三唑并[4,5-c]嗒𠯤-6-基]-5-(2H-1,2,3-三唑-2-基)苯酚或其藥學上可接受的鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention describes methods of treating Huntington's disease in a subject in need thereof. The method comprising administrating to the subject in need thereof a therapeutically effective amount of 2-[3-(2,2,6,6-tetramethylpiperidin-4-yl)-3H-[1,2,3]triazolo[4,5-c]pyridazin-6-yl]-5-(2H-1,2,3-triazol-2-yl)phenol or a pharmaceutically acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1182" publication-number="202618075">
    <tif-files tif-type="multi-tif">
      <tif file="114119128.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單晶生長的方法、單晶生長設備及其控制裝置</chinese-title>
        <english-title>SINGLE CRYSTAL GROWTH METHOD, SINGLE CRYSTAL GROWTH DEVICE, AND CONTROL APPARATUS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">C30B15/20</main-classification>
        <further-classification edition="200601120250801B">G06F17/13</further-classification>
        <further-classification edition="200601120250801B">G06F17/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中環領先半導體科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃末</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁俊萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單晶生長的方法、單晶生長設備及其控制裝置，該方法包括：等徑生長階段中，晶棒實際直徑與時間t之間的初始函數記為&lt;img align="absmiddle" height="30px" width="70px" file="ed10137.JPG" alt="ed10137.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，當&lt;img align="absmiddle" height="30px" width="50px" file="ed10141.JPG" alt="ed10141.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;滿足預設條件時，鎖定晶體的提拉速率，並利用依次後續n個不同測量時刻晶棒實際直徑的測量結果對初始函數進行分段校正，以得到校正後的分段函數&lt;img align="absmiddle" height="29px" width="71px" file="ed10138.JPG" alt="ed10138.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，計算對應時刻的&lt;img align="absmiddle" height="33px" width="43px" file="ed10139.JPG" alt="ed10139.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，通過&lt;img align="absmiddle" height="47px" width="55px" file="ed10140.JPG" alt="ed10140.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;與設定值x進行比較，來調節單晶爐中的加熱功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A single crystal growth method, a single crystal growth device, and a control apparatus thereof are provided. The method includes: during the constant diameter growth stage, the initial function between the actual diameter of a crystal rod and time t being denoted as&lt;img align="absmiddle" height="30px" width="70px" file="ed10137.JPG" alt="ed10137.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;; when&lt;img align="absmiddle" height="30px" width="50px" file="ed10141.JPG" alt="ed10141.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;satisfies a preset condition, the pulling rate of the crystal being locked; the initial function being piecewise corrected using the measurement results of the actual diameter of the crystal rod at n subsequent different measurement moments, to obtain a corrected piecewise function&lt;img align="absmiddle" height="29px" width="71px" file="ed10138.JPG" alt="ed10138.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;; the value&lt;img align="absmiddle" height="33px" width="43px" file="ed10139.JPG" alt="ed10139.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;at corresponding moment being calculated; and the heating power in the single crystal furnace being adjusted by comparing&lt;img align="absmiddle" height="47px" width="55px" file="ed10140.JPG" alt="ed10140.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;with the set value x.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1183" publication-number="202618842">
    <tif-files tif-type="multi-tif">
      <tif file="114119184.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119184</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於疊對之具有永久磁透鏡及正晶圓偏壓之高電壓柱</chinese-title>
        <english-title>HIGH-VOLTAGE COLUMN WITH PERMANENT MAGNET LENS AND POSITIVE WAFER BIAS FOR OVERLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01J37/14</main-classification>
        <further-classification edition="200601120260120B">H01J37/20</further-classification>
        <further-classification edition="200601120260120B">H01J37/244</further-classification>
        <further-classification edition="200601120260120B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛林　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERLING, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆雷　勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAY, LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包含：一電子源，其產生一電子束；一載物台，其將一工件固持在該電子束之一路徑中；一磁物鏡，其安置在該電子束之一路徑中；一聚焦元件，其在該電子束之該路徑中安置在該磁物鏡與該載物台之間；及一反向散射電子偵測器，其在該電子束之該路徑中安置在該聚焦元件與該磁物鏡之間。從該工件發射反向散射電子、次級電子及x射線。用該反向散射電子偵測器量測該等反向散射電子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes an electron source that generates an electron beam, a stage that holds a workpiece in a path of the electron beam, a magnetic objective lens disposed in a path of the electron beam, a focus element disposed in the path of the electron beam between the magnetic objective lens and the stage, and a backscattered electron detector disposed in the path of the electron beam between the focus element and the magnetic objective lens. Backscattered electrons, secondary electrons, and x-rays are emitted from the workpiece. The backscattered electrons are measured with the backscattered electron detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:x射線偵測器</p>
        <p type="p">146:定位載物台</p>
        <p type="p">152:電子束</p>
        <p type="p">160:電子源</p>
        <p type="p">200:電子束系統</p>
        <p type="p">210:工件</p>
        <p type="p">220:提取器</p>
        <p type="p">222:聚光透鏡</p>
        <p type="p">224:源偏轉器</p>
        <p type="p">226:次級電子及反向散射電子偵測器</p>
        <p type="p">228:上偏轉器</p>
        <p type="p">229:下偏轉器</p>
        <p type="p">230:磁物鏡</p>
        <p type="p">232:透鏡後偏轉器</p>
        <p type="p">234:反向散射電子偵測器</p>
        <p type="p">236:聚焦元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1184" publication-number="202619012">
    <tif-files tif-type="multi-tif">
      <tif file="114119200.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造設備用零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/683</main-classification>
        <further-classification edition="200601120260123B">H01L21/3065</further-classification>
        <further-classification edition="200601120260123B">C23C16/458</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, TARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久野達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田夏樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體製造設備用零件的一範例即晶圓載置台10包括：在上表面具有晶圓載置面21以及聚焦環載置面26中至少一者之陶瓷板20、在上下方向貫通陶瓷板20且具有下側變細的錐狀內周面24a之栓塞配置孔24、以及嵌合至栓塞配置孔24且具有下側變細的錐狀外周面50a並容許氣體在上下方向流通之栓塞50。栓塞50的外周面50a比栓塞配置孔24的內周面24a更陡斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓載置台</p>
        <p type="p">20:陶瓷板</p>
        <p type="p">21:晶圓載置面</p>
        <p type="p">22:電極</p>
        <p type="p">24:栓塞配置孔</p>
        <p type="p">24a:內周面</p>
        <p type="p">26:聚焦環載置面</p>
        <p type="p">30:底板</p>
        <p type="p">32:冷媒流道</p>
        <p type="p">34:氣孔</p>
        <p type="p">34a:大徑部</p>
        <p type="p">40:金屬接合層</p>
        <p type="p">42:貫通孔</p>
        <p type="p">50:栓塞</p>
        <p type="p">50a:外周面</p>
        <p type="p">52:緻密部</p>
        <p type="p">54:通氣部</p>
        <p type="p">60:聚焦環</p>
        <p type="p">62:圓周溝</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1185" publication-number="202618398">
    <tif-files tif-type="multi-tif">
      <tif file="114119206.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於路徑規劃的頭戴式裝置和方法</chinese-title>
        <english-title>HEAD-MOUNTED DISPLAY AND METHOD FOR PATH PLANNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250604B">G02B27/01</main-classification>
        <further-classification edition="202201120250604B">G06V20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王有慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於路徑規劃的頭戴式裝置和方法。方法包含：取得場域的佈局圖、點雲地圖以及歷史路徑點；通過感測器取得當前點雲，並且比對當前點雲與點雲地圖以產生當前路徑點；以及根據佈局圖以及點雲地圖產生當前路徑點與歷史路徑點之間的虛擬路徑，並輸出虛擬路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head-mounted device and a method for path planning are provided. The method includes: obtaining a layout diagram, a point cloud map, and a historical waypoint; obtaining a current point cloud through a sensor and comparing the current point cloud with the point cloud map to generate a current waypoint; and generating a virtual path between the current waypoint and the historical waypoint according to the layout diagram and the point cloud map, and outputting the virtual path .</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501,S502,S503:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1186" publication-number="202619427">
    <tif-files tif-type="multi-tif">
      <tif file="114119220.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子零件之製造方法及電子零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05K3/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木根悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINE, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西篤司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗田隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電子零件之製造方法包括以下步驟：藉由對包含於結構中具有苯環之熱硬化性樹脂之基材10照射雷射光21以對熱硬化性樹脂進行改質，而於基材10之表面11、基材10之內部、或基材10之表面11及內部之兩者形成包含石墨烯及石墨中之一者或兩者之導電部13。熱硬化性樹脂可包含環氧樹脂及酚樹脂中之至少一種樹脂。雷射光21之波長可為200 nm以上1100 nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">8:電子零件</p>
        <p type="p">10:基材</p>
        <p type="p">11:表面</p>
        <p type="p">13:導電部</p>
        <p type="p">21:雷射光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1187" publication-number="202617392">
    <tif-files tif-type="multi-tif">
      <tif file="114119271.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監視裝置及監視程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B25J19/00</main-classification>
        <further-classification edition="200601120260123B">B25J9/16</further-classification>
        <further-classification edition="200601120260123B">G05B19/048</further-classification>
        <further-classification edition="200601120260123B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝舒瀟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, SHUXIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">有關本揭示的其中一樣態的監視裝置係具有透過網路連接到產業機械和攜帶式終端，並將產業機械的狀態發送到攜帶式終端的功能；其中，該監視裝置具備：接收部，其係從產業機械接收可動部的位置資訊；模型生成部，其係根據已接收到的可動部的位置資訊，來生成表示產業機械的3維產業機械模型；產生部，其係產生包含已生成的3維產業機械模型的網頁；以及發送部，其係將網頁發送到攜帶式終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:姿勢確認頁面</p>
        <p type="p">110:第1區域</p>
        <p type="p">111:機器人狀態確認表</p>
        <p type="p">130:第2區域</p>
        <p type="p">131:機器人姿勢履歷表</p>
        <p type="p">132:選擇方框</p>
        <p type="p">133:顯示按鈕</p>
        <p type="p">135:顯示區域</p>
        <p type="p">137:操作面板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1188" publication-number="202619481">
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      <tif file="114119298.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202619481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H10B12/00</main-classification>
        <further-classification edition="202301120260123B">H10B10/00</further-classification>
        <further-classification edition="202301120260123B">H10B41/70</further-classification>
        <further-classification edition="202301120260123B">H10B99/00</further-classification>
        <further-classification edition="202501120260123B">H10D1/68</further-classification>
        <further-classification edition="202501120260123B">H10D30/67</further-classification>
        <further-classification edition="202501120260123B">H10D84/80</further-classification>
        <further-classification edition="202501120260123B">H10D84/83</further-classification>
        <further-classification edition="202501120260123B">H10D86/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神保安弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINBO, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮入秀和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAIRI, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上広樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤暁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種容易微型化的半導體裝置。提供一種能夠高積體化的半導體裝置。該半導體裝置包括第一導電層、位於第一導電層上並具有第一凸部的半導體層、夾著第一凸部彼此對置的第二導電層及第三導電層、第一絕緣層及第二絕緣層以及第一凸部上的第四導電層，第一絕緣層位於第一凸部與第二導電層之間，第二絕緣層位於第一凸部與第三導電層之間，半導體層包含金屬氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">11:絕緣層</p>
        <p type="p">12:基板</p>
        <p type="p">15:記憶單元</p>
        <p type="p">20:電晶體</p>
        <p type="p">21:半導體層</p>
        <p type="p">22:絕緣層</p>
        <p type="p">23:導電層</p>
        <p type="p">24:導電層</p>
        <p type="p">25:導電層</p>
        <p type="p">30:電容器</p>
        <p type="p">51:導電層</p>
        <p type="p">52:絕緣層</p>
        <p type="p">53:導電層</p>
        <p type="p">56:絕緣層</p>
        <p type="p">57:絕緣層</p>
        <p type="p">71a:凸部</p>
        <p type="p">71b:凸部</p>
        <p type="p">71c:凸部</p>
        <p type="p">72a:區域</p>
        <p type="p">72b:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1189" publication-number="202619380">
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      <tif file="114119425.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線電存取網路（ＲＡＮ）使用者設備（ＵＥ）識別符隱私</chinese-title>
        <english-title>RADIO ACCESS NETWORK (RAN) USER EQUIPMENT (UE) IDENTIFIER PRIVACY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260123B">H04W8/26</main-classification>
        <further-classification edition="200901120260123B">H04W12/02</further-classification>
        <further-classification edition="202101120260123B">H04W12/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金弘壹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SOO BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍恩　蓋文伯納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORN, GAVIN BERNARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩爾基斯　蓋比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARKIS, GABI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈爾米　阿齊茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOLMIEH, AZIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐茲圖爾克　歐茲肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZTURK, OZCAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示用於無線通訊的系統及技術。例如，一種程序可包括：基於第一無線電網路臨時識別符(RNTI)來與一網路節點進行通訊；判定切換至一第二RNTI；及基於該第二RNTI來與該網路節點進行通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are systems and techniques for wireless communications. For instance, a process can include communicating with a network node based on first radio network temporary identifier (RNTI), determining to switch to a second RNTI, and communicating with the network node based on the second RNTI.</p>
      </isu-abst>
      <representative-img>
        <p type="p">702:網路節點</p>
        <p type="p">704:小區無線電網路臨時識別符(C-RNTI)</p>
        <p type="p">706:使用者設備(UE)</p>
        <p type="p">708:傳輸(多個)C-RNTI的指示</p>
        <p type="p">710:觸發(多個)C-RNTI變更</p>
        <p type="p">712:應用新C-RNTI</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1190" publication-number="202617789">
    <tif-files tif-type="multi-tif">
      <tif file="114119446.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層膜及積層膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C08F2/48</main-classification>
        <further-classification edition="200601120260121B">C23C14/34</further-classification>
        <further-classification edition="200601120260121B">C23C14/08</further-classification>
        <further-classification edition="200601120260121B">B29C59/14</further-classification>
        <further-classification edition="201501120260121B">G02B1/115</further-classification>
        <further-classification edition="200601120260121B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長命翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOMEI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本幸大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施方式之積層膜(1)具備基材膜(2)、配置於基材膜(2)之厚度方向一面之硬化樹脂層(3)、及配置於硬化樹脂層(3)之厚度方向一面之無機物層(4)。於硬化樹脂層(3)之厚度方向一面形成有1個以上之凸部(B)，凸部(B)之平均面積為80 nm&lt;sup&gt;2&lt;/sup&gt;以上500 nm&lt;sup&gt;2&lt;/sup&gt;以下。硬化樹脂層(3)之厚度方向一面之算術平均高度Sa為1.0 nm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積層膜</p>
        <p type="p">2:基材膜</p>
        <p type="p">3:硬化樹脂層</p>
        <p type="p">3a:電漿處理表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1191" publication-number="202617360">
    <tif-files tif-type="multi-tif">
      <tif file="114119481.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617360</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭力扳手方塊件承載座結構改良</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250611B">B25B13/28</main-classification>
        <further-classification edition="200601120250611B">B25B23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扭力扳手方塊件承載座結構改良，包括一桿體、一方塊件、一承載座及一彈簧，依序設於扳手的一管體內；該桿體和該承載座的相對端各設一凹部，該方塊件設於兩個該凹部之間；更包括一定位組件，設於該承載座和該彈簧之間；該組件包括一定位軸及一法蘭；基於該法蘭，該定位軸被區分為一第一段部和一第二段部；該第一段部穿入並緊配於該載座的一中心軸孔，該第二段部穿入該彈簧的內徑，該承載座的底面和該彈簧的端部夾制限位該法蘭。透過上述的結構安排，該承載座及該彈簧的位置被精確固定，有效提升扭力傳遞效率並增加結構穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:扳手頭</p>
        <p type="p">11:桿體</p>
        <p type="p">111:凹部</p>
        <p type="p">12:承載座</p>
        <p type="p">121:凹部</p>
        <p type="p">13:方塊件</p>
        <p type="p">14:定位組件</p>
        <p type="p">141:定位軸</p>
        <p type="p">142:法蘭</p>
        <p type="p">143:第一段部</p>
        <p type="p">144:第二段部</p>
        <p type="p">15:彈簧</p>
        <p type="p">16:管體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1192" publication-number="202618427">
    <tif-files tif-type="multi-tif">
      <tif file="114119569.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119569</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光纖耦合自由基檢測</chinese-title>
        <english-title>FIBER COUPLED RADICAL DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02F1/355</main-classification>
        <further-classification edition="200601120260123B">G02F1/377</further-classification>
        <further-classification edition="200601120260123B">G02F1/39</further-classification>
        <further-classification edition="200601120260123B">H01S5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述的實施例涉及一種裝置，包括腔室和耦合到腔室的分子自由基檢測器。在一個實施例中，分子自由基檢測器包括二極體雷射，以及通過第一光纖與二極體雷射耦合的週期性極化鋰鈮酸鹽（PPLN）波導。在一個實施例中，濾光片通過第二光纖與PPLN波導光學耦合，且檢測器與濾光片光學耦合。在一個實施例中，PPLN波導被配置為在光束通過腔室中的光學端口之前對來自二極體雷射的光束進行頻率倍增。在一個實施例中，檢測器被配置為在光束通過腔室之後接收該光束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes a chamber, and a molecular radical detector coupled to the chamber. In an embodiment, the molecular radical detector includes a diode laser, and a periodically poled lithium niobate (PPLN) waveguide coupled to the diode laser by a first optical fiber. In an embodiment, a filter is optically coupled to the PPLN waveguide by a second optical fiber, and a detector is optically coupled to the filter. In an embodiment, the PPLN waveguide is configured to frequency double a beam originating from the diode laser before the beam passes through an optical port in the chamber. In an embodiment, the detector is configured to receive the beam after the beam passes through the chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:吸收光譜工具</p>
        <p type="p">110:雷射模組</p>
        <p type="p">112:二極體雷射</p>
        <p type="p">113:輸出光束</p>
        <p type="p">114:光學隔離器</p>
        <p type="p">115:轉換光束</p>
        <p type="p">116:PPLN波導</p>
        <p type="p">117:光纖</p>
        <p type="p">118:光纖準直器</p>
        <p type="p">120:腔室</p>
        <p type="p">133:光譜濾光片</p>
        <p type="p">134:檢測器</p>
        <p type="p">1ω:第一波長</p>
        <p type="p">2ω:第二波長</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1193" publication-number="202618736">
    <tif-files tif-type="multi-tif">
      <tif file="114119574.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於顯示面板的驅動方法、顯示驅動裝置和顯示裝置</chinese-title>
        <english-title>DRIVING METHOD FOR DISPLAY PANEL, DISPLAY DRIVING DEVICE, AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250609B">G09G3/20</main-classification>
        <further-classification edition="200601120250609B">H02H9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於顯示面板的驅動方法包括在第一時脈週期顯示用於第N-M個像素列的待顯示資料，並獲取用於第N個像素列的待顯示資料，用於第N個像素列待顯示資料預期在從第一時脈週期的起始時刻起經過預設延遲時段後被顯示，預設延遲時段爲M個時脈週期；以及響應於用於第N個像素列的待顯示資料的錯誤事件，向第N-M+1到第N1-1個像素列提供閘極驅動信號，並禁止向第N1至N2個像素列提供閘極驅動信號，像素列的閘極驅動信號包括預充電時段和顯示時段，預充電時段爲Q個時脈週期，Q小於M，N1大於等於N-M+Q+1且小於等於N，N2大於等於N且小於等於多個像素列的數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driving method for a display panel, display driving device, and display device are provided. The method includes: in a first clock cycle, displaying to-be-displayed data for (N-M)-th pixel row and obtaining to-be-displayed data for N-th pixel row expected to be displayed after a preset delay period from a start time instant of the first clock cycle, the preset delay period lasting for M clock cycles; and providing gate driving signals for (N-M+1)-th to (N1-1)-th pixel rows and inhibiting providing gate driving signals for N1-th to N2-th pixel rows in response to an error event in the to-be-displayed data for N-th pixel row, wherein a gate driving signal for each pixel row includes a pre-charging period and a displaying period, the pre-charging period lasts for Q clock cycles, and wherein N-M+Q+1≤N1≤N, and N≤N2≤T(a number of the plurality of pixel rows).</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:流程</p>
        <p type="p">S410,S420:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1194" publication-number="202618952">
    <tif-files tif-type="multi-tif">
      <tif file="114119627.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造薄層移轉用供體晶圓之方法及該供體晶圓</chinese-title>
        <english-title>METHOD FOR PRODUCING A DONOR WAFER FOR THE TRANSFER OF THIN LAYERS, AND DONOR WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/66</main-classification>
        <further-classification edition="200601120260123B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧西耶　瑟弗林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUCHIER, SEVERIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史渥森班曲　華特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZENBACH, WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOULET, ROMAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾　紀堯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERRE, GUILLAUME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衛迪茲　茱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIDIEZ, JULIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於製造一供體晶圓之方法，包括以下步驟：a) 提供單晶材料製之一供體底材，該供體底材在一薄層從該供體底材移轉至一受體底材以形成一複合結構後，已被回收再利用至少一次，該複合結構包括全部或部分由該薄層所形成之一表面層，該表面層設置在該受體底材上，以及提供該複合結構，b) 透過檢查該表面層之自由表面，來檢測該表面層上面及/或當中存在的缺陷，以檢查該複合結構之品質，所述缺陷接着被分類爲非嚴重的第一類缺陷及嚴重的第二類缺陷，c) 若在步驟b)中被分類爲第二類缺陷的密度低於一預定缺陷密度，則選定該供體底材，d) 將步驟c)中選定之該供體底材經由鍵合而接合至一載體底材，以形成該供體晶圓。本發明亦涉及一供體晶圓，其包括單晶碳化矽製、厚度在100 &lt;img align="absmiddle" height="25px" width="31px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;至300 &lt;img align="absmiddle" height="25px" width="31px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;之間的一供體底材，該供體底材設置在一載體底材上，其特徵在於，該供體底材的一自由面具有小於0.5 缺陷/cm&lt;sup&gt;2&lt;/sup&gt;的微管缺陷或夾雜物缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for producing a donor wafer, the method comprising the following steps: a) providing a donor substrate made of a monocrystalline material, said donor substrate having been recycled at least once, after transferring a thin layer from said donor substrate to an acceptor substrate so as to form a composite structure, said composite structure comprising a surface layer formed in whole or in part by the thin layer and arranged on the acceptor substrate, and providing the composite structure, b) checking the quality of the composite structure by inspecting a free surface of the surface layer to detect defects present on and/or in the surface layer, said defects then being classified in a first, non-critical, category or in a second, critical, category, c) selecting the donor substrate if a density of defects classified in the second category in step b) is less than a predetermined density, d) joining the donor substrate selected in step c) to a carrier substrate, by bonding, to form the donor wafer. The invention also relates to a donor wafer comprising a donor substrate made of monocrystalline silicon carbide, having a thickness of between 100&lt;img align="absmiddle" height="25px" width="31px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; and 300 &lt;img align="absmiddle" height="25px" width="31px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, arranged on a carrier substrate, and characterized in that a free face of the donor substrate has fewer than 0.5 defect/cm&lt;sup&gt;2&lt;/sup&gt; micropipe or inclusion defects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1195" publication-number="202617632">
    <tif-files tif-type="multi-tif">
      <tif file="114119633.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有使用具有有限之鉬污染的加熱元件之退火步驟的用於生產經燒結之積層體之程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY WITH ANNEALING STEP USING A HEATING ELEMENT WITH LIMITED MOLYBDENUM CONTAMINATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C04B35/119</main-classification>
        <further-classification edition="200601120260130B">C04B35/44</further-classification>
        <further-classification edition="200601120260130B">C04B35/626</further-classification>
        <further-classification edition="200601120260130B">C04B35/645</further-classification>
        <further-classification edition="200601120260130B">C04B38/00</further-classification>
        <further-classification edition="200601120260130B">B28B3/02</further-classification>
        <further-classification edition="200601120260130B">B22F3/14</further-classification>
        <further-classification edition="200601120260130B">B32B18/00</further-classification>
        <further-classification edition="200601120260130B">F27D11/02</further-classification>
        <further-classification edition="200601120260130B">H05B1/02</further-classification>
        <further-classification edition="200601120260130B">H05B3/00</further-classification>
        <further-classification edition="200601120260130B">H05B3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納隆　馬修喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELON, MATTHEW JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布蘭斯基　丹尼爾Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRANSKI, DANIEL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.     將第一粉末引入內部容積以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.      具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.     至少部分地藉由模具之內表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.     使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.      該熱藉由施加在該模具、該內部容積、或兩者上的電壓產生，且&lt;br/&gt;ii.     該積層體包含第一層&lt;br/&gt;c.     使用至少一個加熱元件使該積層體經受熱處理，其中該至少一個加熱元件包含內部區域及至少部分地圍繞該內部區域的外部區域；&lt;br/&gt;其中&lt;br/&gt;該外部區域的鉬含量小於該內部區域的鉬含量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer&lt;br/&gt;c. subjecting the layered body to a heat treatment using at least one heating element, wherein the at least one heating element comprises an inner region and an outer region that at least partially surrounds the inner region;&lt;br/&gt;wherein&lt;br/&gt;a molybdenum content of the outer region is less than a molybdenum content of the inner region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">001:第一推動構件</p>
        <p type="p">002:第一活塞</p>
        <p type="p">003:衝頭</p>
        <p type="p">004:衝頭內表面</p>
        <p type="p">005:內表面</p>
        <p type="p">006:模具</p>
        <p type="p">007:衝頭內表面</p>
        <p type="p">008:衝頭</p>
        <p type="p">009:第二活塞</p>
        <p type="p">010:第二推動構件</p>
        <p type="p">011:壓縮軸</p>
        <p type="p">012:電源</p>
        <p type="p">013:內部容積</p>
        <p type="p">014:第一粉末層</p>
        <p type="p">100:裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1196" publication-number="202617823">
    <tif-files tif-type="multi-tif">
      <tif file="114119670.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G59/40</main-classification>
        <further-classification edition="200601120260202B">C08L63/00</further-classification>
        <further-classification edition="201801120260202B">C08K3/013</further-classification>
        <further-classification edition="200601120260202B">B32B27/38</further-classification>
        <further-classification edition="200601120260202B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋永有輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKINAGA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池平秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEHIRA, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供可形成抑制翹曲量產生、介電損耗角正切低、回焊耐性優異之硬化物之樹脂組成物等。  &lt;br/&gt;　　[解決手段]一種樹脂組成物，含有(A-1)以式(1)所表示之環氧樹脂、及(B)具有25℃以下之玻璃轉移溫度Tg，或於25℃以下為液態，且(B)成分之重量平均分子量大於5000至1000000以下之聚合物。  &lt;br/&gt;&lt;img align="absmiddle" height="165px" width="554px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1197" publication-number="202618039">
    <tif-files tif-type="multi-tif">
      <tif file="114119690.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗佈處理工具之泵送路徑內的表面</chinese-title>
        <english-title>COATING SURFACES WITHIN A PUMPING PATH OF A PROCESSING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C23C16/40</main-classification>
        <further-classification edition="200601120260126B">C23C16/44</further-classification>
        <further-classification edition="200601120260126B">C23C16/455</further-classification>
        <further-classification edition="200601120260126B">C23C16/50</further-classification>
        <further-classification edition="200601120260126B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克唐納　戈登　艾立克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACDONALD, GORDON ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯派斯　庫爾特　奧古斯都</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIES, KURT AUGUSTUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬利卡爾　維尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALIEKKAL, VINEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普森科維拉甘　拉杰什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTHENKOVILAKAM, RAGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞迪　卡蒲　瑟利西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, KAPU SIRISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞丹扎　克里斯托弗　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IADANZA, CHRISTOPHER NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露對處理工具的排放系統的泵送路徑內的表面施加塗層的系統和方法。在一範例中，方法包括將塗層前驅物混合物引入泵送路徑，以及將反應物氣體混合物引入與排放系統流體耦接的遠端電漿產生器。在遠端電漿產生器中產生反應物氣體混合物的自由基物種。使反應物氣體混合物的自由基物種流入泵送路徑。塗層前驅物與反應物氣體混合物的反應性物種在泵送路徑內反應，從而在表面上形成塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods are disclosed for applying a coating to surfaces within a pumping path of an exhaust system of a processing tool. In one example, a method comprises introducing a coating precursor mixture into the pumping path and introducing a reactant gas mixture into a remote plasma generator fluidically coupled to the exhaust system. Radical species of the reactant gas mixture are generated at the remote plasma generator. The radical species of the reactant gas mixture are flowed into the pumping path. The coating precursor and the reactive species of the reactant gas mixture are reacted within the pumping path to form the coating on the surfaces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210-250:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1198" publication-number="202617674">
    <tif-files tif-type="multi-tif">
      <tif file="114119697.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119697</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有烴末端基之化合物、表面處理劑、硬化被膜及物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C211/03</main-classification>
        <further-classification edition="200601120260202B">C07C271/16</further-classification>
        <further-classification edition="200601120260202B">C07C275/10</further-classification>
        <further-classification edition="200601120260202B">C07C323/12</further-classification>
        <further-classification edition="200601120260202B">C07F7/10</further-classification>
        <further-classification edition="200601120260202B">C07F7/18</further-classification>
        <further-classification edition="200601120260202B">C07F7/21</further-classification>
        <further-classification edition="200601120260202B">C07F9/09</further-classification>
        <further-classification edition="200601120260202B">C08L83/04</further-classification>
        <further-classification edition="200601120260202B">C09D183/04</further-classification>
        <further-classification edition="200601120260202B">C09K3/18</further-classification>
        <further-classification edition="201501120260202B">G02B1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒匈隆介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKOH, RYUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂野安則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKANO, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">含有下式之含有烴末端基之化合物的表面處理劑，可形成撥水性、滑性、髒污拭除性、耐摩耗性，特別是耐鋼絲絨摩耗性、耐濕式摩耗性耐藥品性為優異之硬化被膜。  &lt;br/&gt;&lt;img align="absmiddle" height="72px" width="272px" file="ed10228.JPG" alt="ed10228.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(R&lt;sup&gt;1&lt;/sup&gt;含有碳數12以上之1價或2價直鏈狀非取代脂肪族飽和烴基，不含烴之支鏈構造之碳數12～80之1價烴基、R&lt;sup&gt;2&lt;/sup&gt;為H、鹵素原子、羥基、矽氧烷基、-OSi(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;基、  &lt;br/&gt;-OSi(C&lt;sub&gt;2&lt;/sub&gt;H&lt;sub&gt;5&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;基、胺基、SH基、1價烴基、R&lt;sup&gt;1&lt;/sup&gt;、-V-Z-(Y-A)&lt;sub&gt;m&lt;/sub&gt;或-Y-A、U為單鍵、C或3或4價有機基、V為單鍵或2價烴基、Z為單鍵、C、Si、N、S或3～8價之有機基、Y為單鍵或2價烴基、A為1價反應性基、k為0、1或2、m為1～7)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1199" publication-number="202618894">
    <tif-files tif-type="multi-tif">
      <tif file="114119704.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使自由基物種與未沉積膜前驅物反應之方法及處理機台</chinese-title>
        <english-title>REACTING RADICAL SPECIES WITH UNDEPOSITED FILM PRECURSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/205</main-classification>
        <further-classification edition="200601120260126B">B01D53/34</further-classification>
        <further-classification edition="200601120260126B">C23C16/50</further-classification>
        <further-classification edition="200601120260126B">C23C16/448</further-classification>
        <further-classification edition="200601120260126B">B01D53/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克唐納　戈登　艾立克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACDONALD, GORDON ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯派斯　庫爾特　奧古斯都</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIES, KURT AUGUSTUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多迪亞　阿什　尼勒什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DODHIA, AARSH NILESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普森科維拉甘　拉杰什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTHENKOVILAKAM, RAGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞迪　卡蒲　瑟利西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, KAPU SIRISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施羅德　托德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, TODD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波爾　艾瑞卡　莎古拉　斯特蘭德貝里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POHL, ERICA SAKURA STRANDBERG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈姆　特洛伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOMM, TROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露的範例關於從處理工具移除未沉積膜前驅物的系統和方法。其中揭露的一範例提供一種處理工具的操作方法。方法包括將前驅物引入處理工具的處理腔室中的電漿中，以在處理腔室中的基板上沉積膜。在將前驅物引入處理腔室中的電漿時，將遠端電漿中形成的自由基物種引入處理工具的泵送路徑，從而與來自處理腔室的未沉積前驅物反應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples are disclosed that relate to systems and methods for removing undeposited film precursors from a processing tool. One disclosed example provides a method of operating a processing tool. The method comprises introducing a precursor into a plasma in a processing chamber of the processing tool to deposit a film on a substrate in the processing chamber. While introducing the precursor into the plasma in the processing chamber, radical species formed in a remote plasma are introduced into a pumping path of the processing tool to react with undeposited precursor from the processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210:步驟</p>
        <p type="p">220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1200" publication-number="202618996">
    <tif-files tif-type="multi-tif">
      <tif file="114119732.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動基板定心</chinese-title>
        <english-title>AUTOMATIC SUBSTRATE CENTERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/677</main-classification>
        <further-classification edition="200601120260123B">B25J9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫德里奇　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERDRICH, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波提夫　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOTEV, ROUMEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史派克　納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIKER, NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫曼　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMANN, EDWARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷森特　韋恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LASANTE, WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有自動基板定心之基板運送設備，包括：基板運送室；機器人運送裝置；基板偵測感測器，設置此等基板偵測感測器，以致運送室的每一面具有至少一個不同之對應基板偵測感測器，此基板偵測感測器偵測運動經過此面中的一或多個基板運送開口之基板並生成一偵測信號。控制系統係用確定性現場匯流排通訊網路通訊地連接至機器人運送裝置的驅動區段及每一個基板偵測感測器。控制系統具有：輸入節點，對應於每一個基板偵測感測器；及機器人運送控制器，建構為控制機器人運送裝置之姿勢及動作。每一個基板偵測信號係基於確定性現場匯流排通訊網路的確定性時序藉由機器人運送控制器所接收，且機器人運送控制器基於確定性時序確定一基板偏移量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate transport apparatus, with automatic substrate centering, includes: a substrate transport chamber; a robot transport; substrate detection sensors disposed so that each face of the chamber has at least one different corresponding substrate detection sensor that detects the substrate moved through one or more substrate transport opening in the face and generates a detection signal. A control system is communicably connected with a deterministic field bus communication network to a drive section of the robot transport and each substrate detection sensor. The control system has: an in node corresponding to each substrate detection sensor, and a robot transport controller configured to control pose and motion of the robot transport. Each substrate detection signal is received by the robot transport controller based on deterministic timing of the deterministic field bus communication network, and the robot transport controller determines a substrate offset based on the deterministic timing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板運送設備</p>
        <p type="p">110:機械臂運送設備</p>
        <p type="p">110DM:馬達</p>
        <p type="p">110DS:驅動區段</p>
        <p type="p">110E:末端效應器</p>
        <p type="p">110F:前臂連桿</p>
        <p type="p">110U:上臂</p>
        <p type="p">125:基板運送室</p>
        <p type="p">126:基板運送開口或端口</p>
        <p type="p">126V:閥門</p>
        <p type="p">150:基板偵測感測器</p>
        <p type="p">170:基板固持站</p>
        <p type="p">188:面</p>
        <p type="p">199:機械臂運送控制器</p>
        <p type="p">199CS:控制系統</p>
        <p type="p">199P:控制器處理器</p>
        <p type="p">AIS:類比輸入感測器</p>
        <p type="p">CCN:公共通訊節點</p>
        <p type="p">Ec:偏心率</p>
        <p type="p">ECN:確定性現場匯流排通訊網路</p>
        <p type="p">FCA:快速擷取演算法</p>
        <p type="p">FNS:輸入節點/切面節點</p>
        <p type="p">LL:負載鎖</p>
        <p type="p">PM:製程模組</p>
        <p type="p">SHS:固持地點</p>
        <p type="p">SVS:氣動開/關感測器</p>
        <p type="p">VSN:機器視覺感測器</p>
        <p type="p">W:基板</p>
        <p type="p">Wc:中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1201" publication-number="202618218">
    <tif-files tif-type="multi-tif">
      <tif file="114119752.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>距離測量及厚度測量之方法及裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01B11/14</main-classification>
        <further-classification edition="200601120260123B">G01B11/06</further-classification>
        <further-classification edition="202201120260123B">G01B9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商普雷茨特光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRECITEC OPTRONIK GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧斯　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUTH, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里杰　安卓亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRIEGER, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一種測量與透明物體(30)之距離以及測量該透明物體(30)之厚度的方法中，光源(12)產生測量光，將該測量光分為參考光及物體光，將該測量光導入參考臂(16)或導入物體臂(18)。第一光譜儀對該參考光之在該參考臂(16)中被反射的參考光分量與該物體光之在該物體臂(18)中被該物體(30)反射的物體光分量之第一干涉進行檢測，由此得到第一光譜。第二光譜儀對該參考光分量與該物體光分量之第二干涉進行檢測，該第二光譜儀可與該第一光譜儀相同，其中該參考光分量之相位相對於該物體光分量之相位偏移φ。由此得到第二光譜。為進行厚度測量，計算單元(38)將該第一光譜與該第二光譜相加，並且對該等光譜之和進行傅立葉變換。為進行距離測量，該計算單元(38)自該第二光譜減去該第一光譜，並且對該等光譜之差進行傅立葉變換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:測量裝置</p>
        <p type="p">12:光源</p>
        <p type="p">16:參考臂</p>
        <p type="p">18:物體臂</p>
        <p type="p">30:物體</p>
        <p type="p">32:玻璃板</p>
        <p type="p">34:玻璃板</p>
        <p type="p">36a:光譜儀</p>
        <p type="p">36b:光譜儀</p>
        <p type="p">38:計算單元</p>
        <p type="p">62:掃描裝置</p>
        <p type="p">64:掃描鏡</p>
        <p type="p">66:轉軸</p>
        <p type="p">68:掃描鏡</p>
        <p type="p">70:轉軸</p>
        <p type="p">72:f-θ物鏡</p>
        <p type="p">140:光纖耦合器；耦合器</p>
        <p type="p">L1:透鏡</p>
        <p type="p">L2:透鏡</p>
        <p type="p">L3:透鏡</p>
        <p type="p">OL:物體光</p>
        <p type="p">RL:參考光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1202" publication-number="202619459">
    <tif-files tif-type="multi-tif">
      <tif file="114119767.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可維護之液浸冷卻</chinese-title>
        <english-title>MAINTAINABLE LIQUID IMMERSION COOLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商瑟普默技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBMER TECHNOLOGIES SL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科希　福內爾　包</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHI FORNELL, PAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩拉薩　阿維拉　赫蘇斯　恩里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERAZA AVILA, JESUS ENRIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於安裝熱產生電子組件的IT硬體的熱管理的方法及裝置。本熱管理系統包括經由公共歧管互連的複數個浸入式冷卻箱組合件。冷卻劑分配單元（CDU）經由公共歧管流體地連接至浸箱。裝置配置及尺度使得能夠在正常狀態（其中所有CDU都是起作用的）與保養配置（其中至少一個CDU是離線的）之間切換，而維持標稱冷卻能力並避免浸槽內溫度波動/變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method and apparatus for the thermal management of IT hardware mounting heat generating electronic components. The present thermal management system comprises a plurality of immersion cooling tank assemblies interconnected via a common manifold. Coolant distribution units (CDUs) are connected fluidically to the immersion tanks via common manifold. The apparatus configuration and dimensioning enables switching between a normal state (where all CDUs are active) to a servicing configuration (where at least one CDU is off-line), whilst maintaining the nominal cooling capacity and avoiding temperature fluctuation/variations within the immersion tanks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:浸入式冷卻箱(浸入浴)</p>
        <p type="p">14:內部腔室</p>
        <p type="p">16:溢流緩衝儲器</p>
        <p type="p">17a、41:溫度感測器</p>
        <p type="p">17b:液位感測器</p>
        <p type="p">18、19、25、26、44、45、46、47、48、49:連接導管</p>
        <p type="p">20a:第一浸入式冷卻箱組合件</p>
        <p type="p">20b:第二浸入式冷卻箱組合件</p>
        <p type="p">21:歧管</p>
        <p type="p">22a:第一冷卻劑分配單元(CDU)</p>
        <p type="p">22b:第二冷卻劑分配單元(CDU)</p>
        <p type="p">23:第一流導管</p>
        <p type="p">24:第二流導管</p>
        <p type="p">27、29:入口</p>
        <p type="p">28、30:出口</p>
        <p type="p">31:液體流入口</p>
        <p type="p">32:液體流出口</p>
        <p type="p">33、34:流量閥</p>
        <p type="p">35、36:閥</p>
        <p type="p">37:分流區段</p>
        <p type="p">38:顆粒過濾器/捕集器</p>
        <p type="p">39:泵</p>
        <p type="p">40:壓力感測器</p>
        <p type="p">42:熱交換器</p>
        <p type="p">42a:熱交換器第一側</p>
        <p type="p">42b:熱交換器第二側</p>
        <p type="p">43:控制閥</p>
        <p type="p">50a、50b、51a、51b:連接點</p>
        <p type="p">52、53:隔離閥</p>
        <p type="p">54:工作流體迴路/設施供水系統(FWS)</p>
        <p type="p">55、56:條件感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1203" publication-number="202619523">
    <tif-files tif-type="multi-tif">
      <tif file="114119785.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在全包覆式閘極(GAA)奈米片元件中藉由選擇性PECVD製程之低介電常數內部間隔墊形成</chinese-title>
        <english-title>LOW K INNER SPACER FORMATION BY SELECTIVE PECVD PROCESS IN GATE-ALL-AROUND (GAA) NANOSHEET DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/01</main-classification>
        <further-classification edition="200601120260123B">C23C16/04</further-classification>
        <further-classification edition="200601120260123B">C23C16/32</further-classification>
        <further-classification edition="200601120260123B">C23C16/40</further-classification>
        <further-classification edition="200601120260123B">C23C16/50</further-classification>
        <further-classification edition="200601120260123B">C23C16/56</further-classification>
        <further-classification edition="200601120260123B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佳良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　世海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEONG, SAI HOOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　卡希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, KASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLICK, ABHIJIT BASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">形成全包覆式場效應電晶體(GAA FET)奈米片結構的一部分的方法包括執行表面改性製程，以使形成於鰭片狀柱體上方的閘極間隔墊的暴露表面及奈米片通道的暴露表面鈍化，該鰭片狀柱體包括一堆疊的奈米片通道和犧牲層，並執行選擇性沉積製程，在犧牲層的暴露表面上沉積低介電常數介電材料，其中，該表面改性製程包括基於自由基的電漿製程，而該選擇性沉積製程為電漿增強化學氣相沉積(PECVD)製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a portion of a gate-all-around field-effect transistor (GAA FET) nanosheet structure includes performing a surface modification process to passivate an exposed surface of a gate spacer formed over a fin-shaped column and exposed surfaces of nanosheet channels, the fin-shaped column comprising a stack of the nanosheet channels and sacrificial layers, and performing a selective deposition process to deposit low-k dielectric material on exposed surfaces of the sacrificial layers, wherein the surface modification process comprises a radical-based plasma process, and the selective deposition process is a plasma enhanced chemical vapor deposition (PECVD) process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體結構</p>
        <p type="p">202:鰭片狀柱體</p>
        <p type="p">204:源極/汲極(S/D)凹槽</p>
        <p type="p">206:基板</p>
        <p type="p">208:奈米片通道</p>
        <p type="p">210:犧牲層</p>
        <p type="p">212:虛擬閘極</p>
        <p type="p">214:虛擬氧化層</p>
        <p type="p">216:閘極間隔墊</p>
        <p type="p">218:內部間隔墊</p>
        <p type="p">220:硬遮罩</p>
        <p type="p">222:遮罩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1204" publication-number="202617557">
    <tif-files tif-type="multi-tif">
      <tif file="114119792.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶式輸送機之監視方法及電腦程式</chinese-title>
        <english-title>MONITORING METHOD FOR CONVEYOR BELT, AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251118B">B65G43/02</main-classification>
        <further-classification edition="200601120251118B">G01N21/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川𨺓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠適當評估帶式輸送機之輸送物落下時之資訊的帶式輸送機之監視方法等。根據本發明之一態樣，提供一種帶式輸送機之監視方法，其具備檢測步驟與特定步驟，檢測步驟及特定步驟；於檢測步驟中，藉由位置傳感器檢測自帶式輸送機之輸送面落下之輸送物；於特定步驟中，基於位置傳感器之檢測內容，特定已落下之輸送物之位置資訊及/或堆積狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a monitoring method for a conveyor belt, etc. that can appropriately evaluate information when a conveyance object of the conveyor belt falls. According to one aspect of the present disclosure, a monitoring method for a conveyor belt is provided in which the monitoring method including a detection step of detecting, by a position sensor, a conveyance object that has fallen from a conveying surface of the conveyor belt, and a specification step of specifying position information and/or a deposited state of the conveyance object that has fallen, based on detected contents of the position sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:帶式輸送機</p>
        <p type="p">3:位置傳感器</p>
        <p type="p">4:輸送物</p>
        <p type="p">11a:上部皮帶</p>
        <p type="p">11b:下部皮帶</p>
        <p type="p">12:滾輪</p>
        <p type="p">13a:頭部皮帶輪</p>
        <p type="p">13b:尾部皮帶輪</p>
        <p type="p">D1:流動方向</p>
        <p type="p">G:地面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1205" publication-number="202617861">
    <tif-files tif-type="multi-tif">
      <tif file="114119823.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>1,1-二氰基乙烯組成物用容器、及裝有內容物的容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08L23/00</main-classification>
        <further-classification edition="200601120260126B">B65D1/00</further-classification>
        <further-classification edition="200601120260126B">B65D65/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIROTA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井四季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, SHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻富敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INATOMI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抑制因1,1-二氰基乙烯所造成的著色、具有包含烯烴聚合物且鋁濃度小於100質量ppm的烯烴聚合物部之1,1-二氰基乙烯組成物用容器，及裝有內容物的容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1206" publication-number="202618345">
    <tif-files tif-type="multi-tif">
      <tif file="114119825.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學積層構件及光學積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02B5/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國友潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNITOMO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係以良好產率提供光學積層體。光學積層構件具有厚度為8µm以下之第一光學機能層與厚度為8µm以下之第二光學機能層；第一光學機能層與第二光學機能層係透過接著劑層積層；第二光學機能層之厚度相對於第一光學機能層之厚度的比為0.25以上且4以下；接著劑層之厚度小於第一光學機能層之厚度；且，接著劑層之厚度小於第二光學機能層之厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學積層構件</p>
        <p type="p">31:第一光學機能層(正C板)</p>
        <p type="p">32:第二光學機能層(第三λ/4構件)</p>
        <p type="p">40:接著劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1207" publication-number="202617981">
    <tif-files tif-type="multi-tif">
      <tif file="114119958.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於抗體藥物複合體工程之糖苷合成酶突變體</chinese-title>
        <english-title>GLYCOSYNTHASE MUTANTS FOR ANTIBODY-DRUG CONJUGATE ENGINEERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12N9/24</main-classification>
        <further-classification edition="200601120260102B">C12P21/00</further-classification>
        <further-classification edition="201701120260102B">A61K47/54</further-classification>
        <further-classification edition="201701120260102B">A61K47/68</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣浩鼎生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBI PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴明添</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, MING-TAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, JUN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝殷程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊佳軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, JIA-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林曉含</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIAO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係有關用於抗體藥物複合體(ADC)工程的新穎糖苷合成酶。稱為EndoSc-D233Q/E350N及EndoSc-D233Q/E350Q的酶突變體在一示例性抗體之Fc區的保守N297醣基化位點處含有聚醣結合及/或修飾活性。已經證明EndoSc-D233Q/E350N及EndoSc-D233Q/E350Q的糖苷合成酶活性可應用於以不同受體為標靶的各種單株抗體。已經發現mAb-GlcNAc及mAb-GlucNAc(Fuc)皆為兩個EndoSc突變體的適用受質。。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to novel glycosynthase enzymes for antibody or antibody-drug conjugates (ADCs) engineering. The enzyme mutants, termed EndoSc-D233Q/E350N and EndoSc-D233Q/E350Q, contain the glycan conjugation and/or modification activity at the conserved N297 glycosylation site of Fc region of an exemplary antibody. It has been demonstrated that the glycosynthase activities of EndoSc-D233Q/E350N and EndoSc-D233Q/E350Q can be applied to various mAbs targeting different receptors. It has been found that both mAb-GlcNAc and mAb-GlucNAc(Fuc) were suitable substrates for both EndoSc mutants.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1208" publication-number="202618694">
    <tif-files tif-type="multi-tif">
      <tif file="114119973.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對象部分檢測裝置及移行台車</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260123B">G06T7/00</main-classification>
        <further-classification edition="202401120260123B">G05D1/43</further-classification>
        <further-classification edition="202401120260123B">G05D1/244</further-classification>
        <further-classification edition="201701120260123B">G06T7/60</further-classification>
        <further-classification edition="202201120260123B">G06V10/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本將吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之對象部分檢測裝置(41)係檢測在藉由攝影裝置被攝影的攝影影像中所包含的四角形狀之對象部分的裝置。對象部分檢測裝置(41)具備有：記憶部(41E)，其記憶相當於對象部分的四角形狀圖案；擷取部(43)，其擷取可成為在攝影影像中所包含的四角形狀之頂點的複數個頂點候補；及檢測部(45)，其從藉由擷取部(43)所擷取的複數個頂點候補中，導出可構成四角形狀圖案之頂點的頂點候補之組合，並根據所導出的頂點候補之組合，來檢測四角形狀之對象部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">IM:原始影像(攝影影像)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1209" publication-number="202619542">
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      <tif file="114119975.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D62/10</main-classification>
        <further-classification edition="202501120260123B">H10D12/00</further-classification>
        <further-classification edition="202501120260123B">H10D30/66</further-classification>
        <further-classification edition="202501120260123B">H10D62/60</further-classification>
        <further-classification edition="202501120260123B">H10D64/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新電元工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神宮梓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINGU, AZUSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松崎欣史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAKI, YOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高PRSM耐受量的半導體裝置。&lt;br/&gt;  本發明的半導體裝置包括：半導體基體；絕緣層，形成在半導體基體的表面上並且具有使半導體基體的表面露出的開口；以及表面電極，至少形成在與開口重疊的區域並且在開口處與半導體基體連接，其中，半導體基體具有：n型的漂移層；p型的雜質區域，形成在漂移層的表層部並且與表面電極接觸；以及柱狀區域，以規定的間隔配置在形成有p型的雜質區域的區域中，雜質濃度比p型的雜質區域的雜質濃度高，並且位置比p型的雜質區域深，從規定的柱狀區域來看，鄰接的柱狀區域形成在俯視時成為正六邊形的頂點的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:半導體基體</p>
        <p type="p">111:低電阻半導體層</p>
        <p type="p">112:漂移層</p>
        <p type="p">113:p型的雜質區域(第二導電型的雜質區域)</p>
        <p type="p">114:柱狀區域</p>
        <p type="p">115:第一高濃度區域</p>
        <p type="p">116:周邊雜質區域</p>
        <p type="p">117:第二高濃度區域</p>
        <p type="p">118:保護環</p>
        <p type="p">120:絕緣層</p>
        <p type="p">122:開口</p>
        <p type="p">130:表面電極</p>
        <p type="p">132:場板電極</p>
        <p type="p">134:第二表面電極</p>
        <p type="p">136:EQR電極</p>
        <p type="p">150:保護絕緣膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1210" publication-number="202618780">
    <tif-files tif-type="multi-tif">
      <tif file="114120001.zip" no="1">
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      <volno>24</volno>
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        <document-id>
          <doc-number>202618780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含柱支撐結構之記憶體器件</chinese-title>
        <english-title>MEMORY DEVICE INCLUDING PILLAR SUPPORT STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G11C16/04</main-classification>
        <further-classification edition="200601120260123B">G11C5/06</further-classification>
        <further-classification edition="200601120260123B">H01L21/768</further-classification>
        <further-classification edition="202301120260123B">H10B41/10</further-classification>
        <further-classification edition="202301120260123B">H10B41/27</further-classification>
        <further-classification edition="202301120260123B">H10B43/10</further-classification>
        <further-classification edition="202301120260123B">H10B43/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝波德森　賈斯汀　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPHERDSON, JUSTIN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普塔　席德哈沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, SIDHARTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康堤　安娜　瑪莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONTI, ANNA MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一些實施例包含設備及形成該等設備之方法。該等設備之一者包含一記憶體器件，該記憶體器件包含：一第一疊層，其包含與第一介電材料層級交錯之第一導電材料層級；一第二疊層，其包含與第二介電材料層級交錯之第二導電材料層級；記憶體胞元串，其等包含延伸穿過該第一疊層及該第二疊層之各者之至少一部分之柱；一第一導電觸件，其接觸該等第一導電材料層級之一層級；一第二導電觸件，其接觸該等第二導電材料層級之一層級；及一介電柱，其在自該第一疊層至該第二疊層之方向上延伸，該介電柱包含處於該等第一導電材料層級之該層級與該等第二導電材料層級之該層級之間的一端部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory device, which includes: a first deck including first levels of conductive materials interleaved with first levels of dielectric materials; a second deck including second levels of conductive materials interleaved with second levels of dielectric materials; memory cell strings including pillars extending through at least a portion of each of the first deck and the second deck; a first conductive contact contacting a level of the first levels of conductive materials; a second conductive contact contacting a level of the second levels of conductive materials; and a dielectric pillar extending in the direction from the first deck to the second deck, the dielectric pillar including an end portion between the level of the first levels of conductive material and the level of the second levels of conductive materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:記憶體器件</p>
        <p type="p">201:記憶體陣列</p>
        <p type="p">202:記憶體胞元</p>
        <p type="p">270&lt;sub&gt;N-1&lt;/sub&gt;:資料線</p>
        <p type="p">270&lt;sub&gt;N&lt;/sub&gt;:資料線</p>
        <p type="p">290:源極</p>
        <p type="p">420&lt;sub&gt;0&lt;/sub&gt;:階梯結構</p>
        <p type="p">454:區</p>
        <p type="p">501至512:層級</p>
        <p type="p">521:疊層</p>
        <p type="p">522:疊層</p>
        <p type="p">523:疊層</p>
        <p type="p">531:介電材料/介電材料層級</p>
        <p type="p">532:導電材料/導電材料層級</p>
        <p type="p">532E:邊緣</p>
        <p type="p">550:柱(記憶體胞元柱)</p>
        <p type="p">595:電路系統</p>
        <p type="p">599:基板</p>
        <p type="p">644:介電柱</p>
        <p type="p">646:介電柱</p>
        <p type="p">646’:介電柱</p>
        <p type="p">665&lt;sub&gt;SGD3&lt;/sub&gt;:導電觸件</p>
        <p type="p">665&lt;sub&gt;SGS0&lt;/sub&gt;:導電觸件</p>
        <p type="p">665&lt;sub&gt;WL&lt;/sub&gt;:導電觸件</p>
        <p type="p">705:介電材料</p>
        <p type="p">721L:層級</p>
        <p type="p">722L:層級</p>
        <p type="p">723L:層級</p>
        <p type="p">730:結構</p>
        <p type="p">791:導電路徑</p>
        <p type="p">BL&lt;sub&gt;N-1&lt;/sub&gt;:信號</p>
        <p type="p">BL&lt;sub&gt;N&lt;/sub&gt;:信號</p>
        <p type="p">SGD0&lt;sub&gt;0&lt;/sub&gt;:信號</p>
        <p type="p">SGD3&lt;sub&gt;0&lt;/sub&gt;:信號</p>
        <p type="p">SGS0:信號</p>
        <p type="p">SRC:信號</p>
        <p type="p">Tr1:電晶體</p>
        <p type="p">Tr2:電晶體</p>
        <p type="p">WL&lt;sub&gt;0&lt;/sub&gt;至WL&lt;sub&gt;M&lt;/sub&gt;:信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1211" publication-number="202617337">
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      <tif file="114120046.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切割裝置及切割品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B23Q11/08</main-classification>
        <further-classification edition="200601120260131B">B24B27/06</further-classification>
        <further-classification edition="200601120260131B">B24B55/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深井元樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAI, MOTOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内慎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原直己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, NAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具有滑動機構(50S)，使複數滑動門體(51)滑動於相同方向，來切換開狀態與閉狀態；滑動機構(50S)具有：複數軌道對(54, 55)，分別對應該些滑動門體(51)；及複數旋轉體(52, 53)，分別設置於該些滑動門體；各該軌道對(54, 55)具有：上軌道(54)，抵接設置於滑動門體(51)之上側部分之旋轉體(52, 53)；及下軌道(55)，抵接設置於滑動門體(51)之下側部分之旋轉體(52, 53)；其中，複數上軌道(54)以上下方向排列方式配置，複數下軌道(55)以上下方向排列方式配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5a:保持部材</p>
        <p type="p">5b:旋轉機構</p>
        <p type="p">5c:移動機構</p>
        <p type="p">6:切割機構</p>
        <p type="p">6a:刀片</p>
        <p type="p">6b:旋轉軸</p>
        <p type="p">16:滾珠螺桿機構</p>
        <p type="p">17:驅動源</p>
        <p type="p">18:滑塊</p>
        <p type="p">19:固定台框</p>
        <p type="p">30:噴嘴</p>
        <p type="p">30a:切削水用噴嘴</p>
        <p type="p">30b:冷卻水用噴嘴</p>
        <p type="p">30c:洗淨水用噴嘴</p>
        <p type="p">31:廢棄物回收部</p>
        <p type="p">33:保護殼</p>
        <p type="p">33A:第一保護殼</p>
        <p type="p">33B:第二保護殼</p>
        <p type="p">34:承接板部材</p>
        <p type="p">35:滑動部材</p>
        <p type="p">35a:前端部</p>
        <p type="p">40:壁體</p>
        <p type="p">41:開口</p>
        <p type="p">42:上外蓋</p>
        <p type="p">43:下外蓋</p>
        <p type="p">50:滑動門構造體</p>
        <p type="p">50S:滑動機構</p>
        <p type="p">51:滑動門體</p>
        <p type="p">51A:第一滑動門體</p>
        <p type="p">51B:第二滑動門體</p>
        <p type="p">52:上旋轉體</p>
        <p type="p">53:下旋轉體</p>
        <p type="p">54:上軌道</p>
        <p type="p">55:下軌道</p>
        <p type="p">OS:外部空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1212" publication-number="202616954">
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          <doc-number>202616954</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人類諾羅病毒去活化劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A01N31/04</main-classification>
        <further-classification edition="200601120260202B">A01N31/02</further-classification>
        <further-classification edition="200601120260202B">A01N37/04</further-classification>
        <further-classification edition="200601120260202B">A01N37/36</further-classification>
        <further-classification edition="200601120260202B">A01N59/26</further-classification>
        <further-classification edition="200601120260202B">A01P1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新高股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIITAKA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平石依里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAISHI, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾﨑恵太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種人類諾羅病毒去活化劑及衛生材料，該人類諾羅病毒去活化劑的人類諾羅病毒去活化效果優異。本發明有關一種人類諾羅病毒去活化劑，其特徵在於，包含(a)乙醇、以及(b)選自由葡萄糖酸、延胡索酸、乳酸、蘋果酸、琥珀酸、檸檬酸及磷酸所組成之群組中的至少一種酸，且該人類諾羅病毒去活化劑的pH值為1～6。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1213" publication-number="202617318">
    <tif-files tif-type="multi-tif">
      <tif file="114120087.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含特別是雷射鑽孔單元的至少一個加工單元的加工裝置</chinese-title>
        <english-title>MACHINING DEVICE COMPRISING AT LEAST ONE MACHINING UNIT, IN PARTICULAR LASER DRILLING UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260126B">B23K26/382</main-classification>
        <further-classification edition="201401120260126B">B23K26/08</further-classification>
        <further-classification edition="201601120260126B">H01M8/0271</further-classification>
        <further-classification edition="201601120260126B">H01M8/1213</further-classification>
        <further-classification edition="200601120260126B">G05B19/416</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅謝爾　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROSCHEL, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡卡爾　阿曼　辛格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKAR, AMAN SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎斯特　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUEST, DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉柏森　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILBERTSON, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯格　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURGER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊尼　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REINIG, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基德羅斯基　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIEDROWSKI, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉夫　烏利希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAF, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之起點為一種加工裝置（10），其具有特別是雷射鑽孔單元之至少一個加工單元（12），該加工單元包含雷射元件（18）及至少一個光學元件（22），處於至少一種操作狀態之該加工單元配置以在電化學電池之基板（16）中製造至少一個孔，且該加工裝置具有包含至少一個耦接元件（50）之至少一個固持單元（24），該至少一個耦接元件（50）配置以收納電化學電池之至少一個基板（16）。  &lt;br/&gt;提議該固持單元（24）具有連接至該至少一個耦接元件（50）之至少一個可旋轉安裝的旋轉元件（52）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The starting point of the invention is a machining device (10) having at least one machining unit (12), in particular laser drilling unit, which comprises a laser element (18) and at least one optical element (22), the machining unit in at least one operating state being configured to make at least one hole in a substrate for an electrochemical cell (16), and having at least one holding unit (24) which comprises at least one coupling element (50), the at least one coupling element (50) being configured to receive at least one substrate for an electrochemical cell (16). &lt;br/&gt;It is proposed that the holding unit (24) has at least one rotatably mounted rotary element (52) connected to the at least one coupling element (50).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:加工裝置</p>
        <p type="p">12:加工單元</p>
        <p type="p">14:穿孔</p>
        <p type="p">16:基板</p>
        <p type="p">18:雷射元件</p>
        <p type="p">20:雷射脈衝</p>
        <p type="p">22:光學元件</p>
        <p type="p">24:固持單元</p>
        <p type="p">50:耦接元件</p>
        <p type="p">52:旋轉元件</p>
        <p type="p">54:表面</p>
        <p type="p">56:驅動單元</p>
        <p type="p">58:旋轉軸</p>
        <p type="p">60:雷射光束</p>
        <p type="p">62:運算單元</p>
        <p type="p">64:孔</p>
        <p type="p">66:離心力</p>
        <p type="p">68:轉速</p>
        <p type="p">70:燒蝕產物</p>
        <p type="p">72:耦接點</p>
        <p type="p">74:連接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1214" publication-number="202619543">
    <tif-files tif-type="multi-tif">
      <tif file="114120180.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251107B">H10D62/10</main-classification>
        <further-classification edition="202501120251107B">H10D64/20</further-classification>
        <further-classification edition="202501120251107B">H10D84/01</further-classification>
        <further-classification edition="202501120251107B">H10D84/80</further-classification>
        <further-classification edition="200601120251107B">H01L21/76</further-classification>
        <further-classification edition="200601120251107B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RUI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昕揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, HSIN YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUAN-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何士融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, SHIH-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡寬侃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, KUAN-KAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱宗凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TSUNG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤韋翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, WEI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置及其形成方法。半導體裝置可包括第一介電層、第一介電層中的第一源極/汲極區、第一源極/汲極區之側壁上的第一奈米結構、在第一奈米結構周圍的第一閘極結構、電連接至第一源極/汲極區的第一導電觸點、及在第一導電觸點之第一部分與第一源極/汲極區之間的第一金屬半導體合金區。第一導電觸點之第一部分可延伸穿過第一源極/汲極區，且第一導電觸點之第一部分包含第一側壁及在剖面圖中與第一側壁相對的第二側壁。第一金屬半導體合金區之第一部分可在第一側壁上，第一金屬半導體合金區之第二部分可在第二側壁上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and the method of forming are provided. The semiconductor device may include a first dielectric layer, a first source/drain region in the first dielectric layer, a first nanostructure on a sidewall of the first source/drain region, a first gate structure around the first nanostructure, a first conductive contact electrically connected to the first source/drain region, and a first metal-semiconductor alloy region between the first portion of the first conductive contact and the first source/drain region. A first portion of the first conductive contact may extend through the first source/drain region, and the first portion of the first conductive contact comprises a first sidewall and a second sidewall opposite the first sidewall in a cross-sectional view. A first portion of the first metal-semiconductor alloy region may be on the first sidewall and a second portion of the first metal-semiconductor alloy region may be on the second sidewall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">20':半導體鰭片</p>
        <p type="p">26L:下部半導體奈米結構</p>
        <p type="p">26U:上部半導體奈米結構</p>
        <p type="p">44:閘極間隔物</p>
        <p type="p">54:內部間隔物</p>
        <p type="p">56:介電隔離層</p>
        <p type="p">62L:下部磊晶源極/汲極區</p>
        <p type="p">62U:上部磊晶源極/汲極區</p>
        <p type="p">66:第一CESL</p>
        <p type="p">68:第一ILD</p>
        <p type="p">70:第二CESL</p>
        <p type="p">78:閘極介電質</p>
        <p type="p">80L:下部閘電極</p>
        <p type="p">80U:上部閘電極</p>
        <p type="p">90:閘極結構</p>
        <p type="p">90L:下部閘極結構</p>
        <p type="p">90U:上部閘極結構</p>
        <p type="p">92:閘極遮罩</p>
        <p type="p">94L:下部金屬半導體合金區</p>
        <p type="p">94U:上部金屬半導體合金區</p>
        <p type="p">96:源極/汲極觸點</p>
        <p type="p">96A:源極/汲極觸點</p>
        <p type="p">96B:源極/汲極觸點</p>
        <p type="p">99:介電襯裡</p>
        <p type="p">104:第三CESL</p>
        <p type="p">106:第三ILD</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1215" publication-number="202619357">
    <tif-files tif-type="multi-tif">
      <tif file="114120207.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置、光檢測系統、及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H04N25/704</main-classification>
        <further-classification edition="202301120260123B">H04N25/70</further-classification>
        <further-classification edition="202501120260123B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口哲司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, TETSUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古閑史彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, FUMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富樫秀晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOGASHI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部泰一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TAIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKUBO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之一實施形態之光檢測裝置具備：第1光電轉換元件及第2光電轉換元件，其等分別具有對光進行光電轉換之光電轉換膜；讀出電路，其包含電性連接於上述第1光電轉換元件之第1浮動擴散部、與電性連接於上述第2光電轉換元件之第2浮動擴散部，可輸出基於蓄積於上述第1浮動擴散部之電荷之信號。上述讀出電路具有可將上述第1浮動擴散部與上述第2浮動擴散部電性連接之第1電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11a,11b:光電轉換部</p>
        <p type="p">15:讀出電路</p>
        <p type="p">AMP,BIN,RST,SEL:電晶體</p>
        <p type="p">FDA,FDB:浮動擴散部</p>
        <p type="p">L2:信號線</p>
        <p type="p">SBIN,SRST,SSEL:信號</p>
        <p type="p">PX:像素</p>
        <p type="p">VDD:電源電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1216" publication-number="202617633">
    <tif-files tif-type="multi-tif">
      <tif file="114120237.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617633</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用包含玻璃的加熱元件以退火步驟來生產燒結積層體的程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY WITH ANNEALING STEP USING A HEATING ELEMENT COMPRISING GLASS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C04B35/119</main-classification>
        <further-classification edition="200601120260202B">C04B35/44</further-classification>
        <further-classification edition="200601120260202B">C04B35/626</further-classification>
        <further-classification edition="200601120260202B">C04B35/645</further-classification>
        <further-classification edition="200601120260202B">C04B38/00</further-classification>
        <further-classification edition="200601120260202B">B22F3/14</further-classification>
        <further-classification edition="200601120260202B">B28B3/02</further-classification>
        <further-classification edition="200601120260202B">B30B11/02</further-classification>
        <further-classification edition="200601120260202B">B30B15/34</further-classification>
        <further-classification edition="200601120260202B">B32B18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納隆　馬修喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELON, MATTHEW JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;c.    使用至少一個加熱元件來使該積層體經受熱處理，其中該至少一個加熱元件包含核心及至少部分地圍繞該核心的外層；&lt;br/&gt;其中&lt;br/&gt;該外層包含下列中之至少一者或全部：玻璃、氧化釔、氧化鋁、其組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;c. subjecting the layered body to a heat treatment using at least one heating element, wherein the at least one heating element comprises a core and an outer layer that at least partially surrounds the core;&lt;br/&gt;wherein&lt;br/&gt;the outer layer comprises at least one or all of the following: glass, yttria, alumina, a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">001:第一推動構件</p>
        <p type="p">002:第一活塞</p>
        <p type="p">003:第一衝頭；衝頭</p>
        <p type="p">004:第一衝頭內部表面</p>
        <p type="p">005:模具之內部表面</p>
        <p type="p">006:模具</p>
        <p type="p">007:第二衝頭內部表面</p>
        <p type="p">008:第二衝頭；衝頭</p>
        <p type="p">009:第二活塞</p>
        <p type="p">010:第二推動構件</p>
        <p type="p">011:壓縮軸</p>
        <p type="p">012:電源</p>
        <p type="p">013:內部容積</p>
        <p type="p">014:第一層粉末</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1217" publication-number="202618871">
    <tif-files tif-type="multi-tif">
      <tif file="114120239.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用具有羥官能基的鈍化分子選擇性鈍化氮化矽</chinese-title>
        <english-title>SELECTIVE PASSIVATION OF SILICON NITRIDE USING PASSIVATION MOLECULE HAVING HYDROXYL FUNCTIONAL GROUPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01L21/02</main-classification>
        <further-classification edition="200601120260202B">H01L21/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商慧盛材料美國責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSUM MATERIALS US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔　馬薩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONH, MAHSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢德拉　哈里賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRA, HARIPIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　新建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, XINJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程嵐霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, LANXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種將基材表面選擇性鈍化的方法，其中，所述基材的表面包括至少一包含氮化矽的第一表面和至少一包含氮化矽以外的材料的第二表面。該方法包括將表面暴露於至少一二醇的步驟，其中二醇選擇性地與氮化矽反應以將第一表面鈍化，從而使第二表面實質上未反應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for selectively passivating a surface of a substrate, wherein the surface of the substrate includes at least a first surface comprising silicon nitride and at least a second surface comprising a material other than silicon nitride. The method includes the step of exposing the surface to at least one diol wherein the diol selectively reacts with the silicon nitride to passivate the first surface thereby leaving the second surface substantially unreacted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基材</p>
        <p type="p">102:第一表面</p>
        <p type="p">104:第二表面</p>
        <p type="p">106:鈍化區</p>
        <p type="p">108:介電膜</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1218" publication-number="202619041">
    <tif-files tif-type="multi-tif">
      <tif file="114120266.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/00</main-classification>
        <further-classification edition="200601120260123B">H01L23/31</further-classification>
        <further-classification edition="200601120260123B">H01L23/66</further-classification>
        <further-classification edition="202301120260123B">H01L25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森山豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYAMA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋長達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHINAGA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高安裝之自由度之半導體裝置及半導體裝置之製造方法。  &lt;br/&gt;本發明之半導體裝置具有：導電性基材，其具有第1主面；半導體晶片，其設置於上述第1主面，且具備第1電極；第1絕緣層，其設置於上述第1主面，且覆蓋上述半導體晶片；第1配線層，其設置於上述第1絕緣層之上，且包含電性連接於上述第1電極之第1配線；第2絕緣層，其設置於上述第1絕緣層之上，且覆蓋上述第1配線層；及第2配線層，其設置於上述第2絕緣層之上，且包含電性連接於上述第1配線之外部端子；且於與上述第1主面垂直之俯視下，上述外部端子延伸至較上述第2絕緣層之側面更靠外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">100:金屬板</p>
        <p type="p">101:第1主面</p>
        <p type="p">110,120,130:晶片</p>
        <p type="p">111,112,113,121,122,131,132,611,612:電極</p>
        <p type="p">115,125,135,615:本體部</p>
        <p type="p">210:第1絕緣層</p>
        <p type="p">211,221:通孔</p>
        <p type="p">220:第2絕緣層</p>
        <p type="p">226,227:側面</p>
        <p type="p">310:第1配線層</p>
        <p type="p">311,312,313,314,315,323,324:配線</p>
        <p type="p">320:第2配線層</p>
        <p type="p">321,322:外部端子</p>
        <p type="p">610:電子零件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1219" publication-number="202617028">
    <tif-files tif-type="multi-tif">
      <tif file="114120309.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清掃機器人</chinese-title>
        <english-title>ROBOT CLEANER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">A47L11/40</main-classification>
        <further-classification edition="200601120260122B">A47L11/20</further-classification>
        <further-classification edition="200601120260122B">A47L11/16</further-classification>
        <further-classification edition="200601120260122B">A47L11/206</further-classification>
        <further-classification edition="200601120260122B">A47L9/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KOOKHAENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳廷玩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, JUNGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁仁圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, IN GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種清掃機器人，其中，將用於清掃的流體供應到根據需要執行旋轉和垂直移動的拖布。根據本發明的一態樣，清掃機器人包括：主體；拖布部件，具有拖布，該拖布安裝在主體的下側上並配置以繞著縱向的拖布旋轉軸旋轉；以及流體供應部件，配置以向拖布部件供應流體。該拖布部件包含：拖布盤，拖布安裝在其上，拖布盤配置以繞著拖布旋轉軸旋轉，並透過引入流體的第一流動路徑向拖布供應流體；以及流動路徑連接器，安裝為在拖布盤旋轉時被限制旋轉，該流動路徑連接器配置以透過將第一流動路徑與流體供應部件相互連接的連接流動路徑向拖布盤供應流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a robot cleaner, in which a fluid for cleaning is supplied to a mop that performs rotation and vertical movement as needed. According to an aspect of the present disclosure, the robot cleaner includes: a main body; a mop part having a mop installed on a lower side of the main body and configured to rotate about a longitudinal mop rotation shaft; and a fluid supply part configured to supply fluid to the mop part. The mop part includes: a mop plate on which the mop is installed, the mop plate being configured to rotate about the mop rotation shaft and to supply the fluid to the mop through a first flow path into which the fluid is introduced; and a flow path connector installed to be restricted from rotating when the mop plate rotates, the flow path connector being configured to supply the fluid to the mop plate through a connection flow path interconnecting the first flow path and the fluid supply part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主體</p>
        <p type="p">101:控制器</p>
        <p type="p">105:集塵盒</p>
        <p type="p">106:風扇馬達</p>
        <p type="p">110:緩衝器</p>
        <p type="p">111:第一致動器</p>
        <p type="p">112:第二致動器</p>
        <p type="p">120:水箱</p>
        <p type="p">400:加熱器</p>
        <p type="p">710:拖布、第一拖布</p>
        <p type="p">720:拖布、第二拖布</p>
        <p type="p">730:拖布盤、第一拖布盤</p>
        <p type="p">740:拖布盤、第二拖布盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1220" publication-number="202618453">
    <tif-files tif-type="multi-tif">
      <tif file="114120344.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板的製造方法及組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G03F7/11</main-classification>
        <further-classification edition="200601120260128B">G03F7/26</further-classification>
        <further-classification edition="200601120260128B">C08G65/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡勇気</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田坪大来</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATSUBO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永縄温子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGANAWA, ATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真弓公佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAYUMI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平澤賢悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRASAWA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成埋入性及平坦性優異的膜的半導體基板的製造方法及組成物。一種半導體基板的製造方法，包括抗蝕劑底層膜形成用組成物塗敷步驟、抗蝕劑圖案形成步驟以及蝕刻步驟，所述抗蝕劑底層膜形成用組成物含有具有下述式（1）所表示的結構單元與下述式（2）所表示的結構單元各兩個以上作為重複單元的聚合物、及溶媒。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="301px" width="353px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，Ar&lt;sup&gt;1&lt;/sup&gt;為具有至少一個碳數3～20的芳香環的n價有機基；X為m價有機基；n及m為2～5的整數；式（1）的*與式（2）的**鍵結；選自由Ar&lt;sup&gt;1&lt;/sup&gt;及X所組成的群組中的至少一個具有交聯性基）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1221" publication-number="202619472">
    <tif-files tif-type="multi-tif">
      <tif file="114120425.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及用於形成半導體裝置的方法</chinese-title>
        <english-title>MEMORY DEVICES AND METHOD FOR FORMING SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251110B">H10B10/00</main-classification>
        <further-classification edition="200601120251110B">G11C7/12</further-classification>
        <further-classification edition="200601120251110B">G11C7/14</further-classification>
        <further-classification edition="200601120251110B">G11C8/08</further-classification>
        <further-classification edition="202501120251110B">H10D62/10</further-classification>
        <further-classification edition="202501120251110B">H10D64/20</further-classification>
        <further-classification edition="202501120251110B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　建隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, KIAN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置，包括基板，其具有彼此相對的第一側與第二側；第一電晶體、第二電晶體、及第三電晶體，形成在基板之第一側上的第一層級處，第一至第三電晶體各個形成有第一導電性；以及第四電晶體、第五電晶體、第六電晶體、及第七電晶體，形成在基板之第一側上的第二層級處，第四至第七電晶體各個具有第二導電性，其中第一層級相對於第二層級垂直設置。第一至第七電晶體可操作地形成靜態隨機存取記憶體(SRAM)單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a substrate having a first side and a second side opposite to each other; a first transistor, a second transistor, and a third transistor formed at a first level on the first side of the substrate, the first to third transistors each formed with a first conductivity; and a fourth transistor, a fifth transistor, a sixth transistor, and a seventh transistor formed at a second level on the first side of the substrate, the fourth to seventh transistors each formed with a second conductivity, wherein the first level is vertically disposed with respect to the second level. The first to seventh transistors operatively form a Static Random Access Memory (SRAM) cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體單元</p>
        <p type="p">101:第一電壓參考/單元邊界</p>
        <p type="p">103:第二電壓參考</p>
        <p type="p">110:共同節點/節點</p>
        <p type="p">112:共同節點/節點</p>
        <p type="p">PD1:第一下拉電晶體/電晶體</p>
        <p type="p">PD2:第二下拉電晶體/電晶體</p>
        <p type="p">PU1:第一上拉電晶體/電晶體</p>
        <p type="p">PU2:第二上拉電晶體/電晶體</p>
        <p type="p">RBL:讀取位元線</p>
        <p type="p">RPG:電晶體</p>
        <p type="p">RWL:讀取字元線</p>
        <p type="p">VDD:供應電壓</p>
        <p type="p">VSS:地面電壓</p>
        <p type="p">WBL:寫入位元線</p>
        <p type="p">WBLB:寫入位元線棒</p>
        <p type="p">WPG1:電晶體</p>
        <p type="p">WPG2:電晶體</p>
        <p type="p">WWL:寫入字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1222" publication-number="202617425">
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      <tif file="114120444.zip" no="1">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120444</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬塑膠複合結構及其製備方法和應用</chinese-title>
        <english-title>METALLIC-PLASTIC COMPOSITE STRUCTURE, METHOD FOR PREPARING SAME, AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B32B15/04</main-classification>
        <further-classification edition="200601120260126B">B32B15/09</further-classification>
        <further-classification edition="200601120260126B">B32B15/20</further-classification>
        <further-classification edition="200601120260126B">B32B27/20</further-classification>
        <further-classification edition="200601120260126B">B32B3/08</further-classification>
        <further-classification edition="200601120260126B">B32B3/26</further-classification>
        <further-classification edition="200601120260126B">B32B3/30</further-classification>
        <further-classification edition="200601120260126B">B32B33/00</further-classification>
        <further-classification edition="201901120260126B">B32B7/08</further-classification>
        <further-classification edition="200601120260126B">C25D11/06</further-classification>
        <further-classification edition="200601120260126B">C25D11/08</further-classification>
        <further-classification edition="200601120260126B">C25D11/26</further-classification>
        <further-classification edition="200601120260126B">H05K5/02</further-classification>
        <further-classification edition="200601120260126B">H05K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商比亞迪股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYD COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雲俠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUNXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁俊萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種金屬塑膠複合結構及其製備方法和應用，包括層疊設置相互連接的第一金屬層和第二金屬層，以及包括依次層疊設置在第一金屬層的未與第二金屬層連接的表面上的第一氧化膜層和第一塑膠層，和/或依次層疊設置在第二金屬層的未與第一金屬層連接的表面上的第二氧化膜層和第二塑膠層；第一金屬層和第二金屬層為不同材質金屬層；第一氧化膜層包括多個第一納米孔，相鄰兩個第一納米孔之間的最短距離小於或等於50nm；和/或第二氧化膜層包括多個第二納米孔，相鄰兩個第二納米孔之間的最短距離小於或等於50nm。有利於獲得金屬層與塑膠層結合力強的金屬塑膠複合結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a metallic-plastic composite structure, a method for preparing same, and an application thereof. The structure includes a first metallic layer and a second metallic layer that are stacked on and connected to each other, and further includes a first oxide film layer and a first plastic layer that are sequentially stacked on a surface of the first metallic layer that is not connected to the second metallic layer, and/or a second oxide film layer and a second plastic layer that are sequentially stacked on a surface of the second metallic layer that is not connected to the first metallic layer. The first metallic layer and the second metallic layer are made of different metallic materials; the first oxide film layer includes a plurality of first nanopores, and a shortest distance between two adjacent first nanopores of the plurality of first nanopores is smaller than or equal to 50 nm; and/or the second oxide film layer includes a plurality of second nanopores, and a shortest distance between two adjacent second nanopores of the plurality of second nanopores is smaller than or equal to 50 nm. Such a configuration is conducive to obtaining the metallic-plastic composite structure having strong bonding strength between the metallic layer and the plastic layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:區域</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">S3:第三表面</p>
        <p type="p">S4:第四表面</p>
        <p type="p">100:金屬塑膠複合結構</p>
        <p type="p">11:第一金屬層</p>
        <p type="p">12:第二金屬層</p>
        <p type="p">13:第一氧化膜層</p>
        <p type="p">14:第一塑膠層</p>
        <p type="p">15:第二氧化膜層</p>
        <p type="p">16:第二塑膠層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1223" publication-number="202619515">
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      <tif file="114120462.zip" no="1">
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          <doc-number>202619515</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>同時形成ＰＦＥＴ　ＥＰＩ硬遮罩以及ＮＦＥＴ部分底部介電隔離層的選擇性製程</chinese-title>
        <english-title>SELECTIVE PROCESS FOR SIMULTANEOUS PFET EPI HARDMASK AND NFET PARTIAL BOTTOM DIELECTRIC ISOLATION LAYER FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260119B">H10D30/00</main-classification>
        <further-classification edition="202501120260119B">H10D30/01</further-classification>
        <further-classification edition="202501120260119B">H10D30/43</further-classification>
        <further-classification edition="202501120260119B">H10D62/10</further-classification>
        <further-classification edition="202501120260119B">H10D62/13</further-classification>
        <further-classification edition="202501120260119B">H10D84/01</further-classification>
        <further-classification edition="202501120260119B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴斯克　維拉拉格萬Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASKER, VEERARAGHAVAN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥倫布　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLOMBEAU, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本文所描述的實施例大體而言係關於在垂直溝槽結構中形成硬遮罩和底部介電隔離層的方法。一種形成環繞閘極場效應電晶體的方法包含在基板的垂直結構的通道表面和底表面上沉積共形的氧化物層，這些垂直結構包含具有限定NMOS接觸溝槽的NMOS垂直結構的NMOS部分，以及具有限定PMOS接觸溝槽的PMOS結構的PMOS部分，該等PMOS接觸溝槽中沉積了PMOS源極/汲極層。該方法進一步包含在垂直結構的底表面上選擇性蝕刻共形的氧化物層，抑制共形的氧化物層，在垂直結構的底表面上選擇性沉積氮化物層，蝕刻共形的氧化物層以暴露垂直結構的通道表面，以及在NMOS接觸溝槽的底表面上沉積NMOS源極/汲極層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein generally relate to methods of forming hardmask and bottom dielectric isolation layers in vertical trench structures. A method of forming a gate-all-around field-effect transistor includes depositing a conformal oxide layer on a channel surface and a bottom surface of vertical structures of a substrate, the vertical structures including an NMOS portion having NMOS vertical structures defining NMOS contact trenches and a PMOS portion having PMOS structures defining PMOS contact trenches having a PMOS source/drain layer deposited therein. The method further includes selectively etching the conformal oxide layer at the bottom surface of the vertical structures, inhibiting the conformal oxide layer, selectively depositing a nitride layer at the bottom surface of the vertical structures, etching the conformal oxide layer to expose the channel surface of the vertical structures, and depositing an NMOS source/drain layer on the bottom surface of the NMOS contact trenches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:半導體結構</p>
        <p type="p">322:NMOS基板層</p>
        <p type="p">324:NMOS垂直結構</p>
        <p type="p">324A:NMOS底表面</p>
        <p type="p">326:NMOS接觸溝槽</p>
        <p type="p">342:PMOS基板層</p>
        <p type="p">344:PMOS垂直結構</p>
        <p type="p">344A:PMOS底表面</p>
        <p type="p">346:PMOS接觸溝槽</p>
        <p type="p">348:PMOS源極/汲極epi層</p>
        <p type="p">352:BDI部分</p>
        <p type="p">354:硬遮罩部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1224" publication-number="202619375">
    <tif-files tif-type="multi-tif">
      <tif file="114120491.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內容播放程式、記錄媒體及內容播放方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H04S7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞笛思股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADIUS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香田進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHDA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於避免發生終端裝置因播放內容之環境，而以非內容提供者所謀求之播放方式播放內容的問題。&lt;br/&gt;  本發明之內容播放程式係在終端裝置(1)之處理器(16)執行以下處理：機器判斷處理，其係判斷連接於該終端裝置或該終端裝置所具備之音響裝置(3)是否對應以第一播放方式進行之內容播放；及播放處理，其係使用資料來使內容在音響裝置3播放；於做出音響裝置3係對應以第一播放方式進行之內容播放之判斷時，會於播放處理中使用第一播放方式的資料來使內容在音響裝置3播放；於做出音響裝置3係未對應以第一播放方式進行之內容播放之判斷時，會於播放處理中使用第二播放方式的內容資料來使內容在音響裝置3播放。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:內容播放方法</p>
        <p type="p">A1:機器判斷步驟</p>
        <p type="p">A2、A21、A22:播放步驟</p>
        <p type="p">A3:資訊傳送步驟</p>
        <p type="p">A4:通道資訊取得步驟</p>
        <p type="p">A5:資訊判斷步驟</p>
        <p type="p">B1:資訊取得步驟</p>
        <p type="p">B2:許可判斷步驟</p>
        <p type="p">B3:資料傳送步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1225" publication-number="202619265">
    <tif-files tif-type="multi-tif">
      <tif file="114120519.zip" no="1">
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      <volno>24</volno>
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          <doc-number>202619265</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120519</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在無位置感測器之情況下達成無刷DC馬達之零及超低速度操作的控制方法</chinese-title>
        <english-title>CONTROL METHOD TO ACHIEVE ZERO AND ULTRA-LOW SPEED OPERATION FOR BRUSHLESS DC MOTOR WITHOUT POSITION SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260123B">H02P6/185</main-classification>
        <further-classification edition="201601120260123B">H02P6/18</further-classification>
        <further-classification edition="201601120260123B">H02P6/182</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科沃美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QORVO US, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張紹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁汶濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, WENTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇諾內斯　荷西Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUINONES, JOSE I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於使用基於電感的轉子位置偵測控制一無刷直流馬達或一永磁同步馬達之系統及方法。將電壓脈衝施加至馬達繞組，並量測所得電壓。根據該等測得電壓判定該等繞組的電感，並且比較該等測得電感與其順序之間的關係以判定該轉子位置。隨後，基於該轉子位置控制該馬達。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a system and a method for controlling a brushless direct current motor or a permanent magnet synchronous motor using inductance-based rotor position detection. Voltage pulses are applied to the motor windings and the resulting voltages are measured. The inductances of the windings are determined from the measured voltages, and the relationship between the measured inductances and their order is compared to determine the rotor position. The motor is then controlled based on the rotor position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1226" publication-number="202618905">
    <tif-files tif-type="multi-tif">
      <tif file="114120589.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120589</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/304</main-classification>
        <further-classification edition="200601120260126B">H01L21/02</further-classification>
        <further-classification edition="201401120260126B">B23K26/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川晋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種將基板平坦化之技術。本發明之基板處理方法，包括：基板準備程序，準備基板，此基板具有第一主面及與前述第一主面相反方向之第二主面，且前述第一主面具有起伏；分佈圖資料取得程序，取得前述第一主面的前述起伏之分佈圖資料；起伏降低程序，基於前述第一主面的前述起伏之分佈圖資料進行前述第一主面之雷射加工，藉以降低前述第一主面的前述起伏；以及翹曲降低程序，進行前述第二主面之雷射加工，藉以降低因前述第一主面之雷射加工所產生之前述第一主面的翹曲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1227" publication-number="202619343">
    <tif-files tif-type="multi-tif">
      <tif file="114120684.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於影片編解碼的第一個編解碼圖片的指示</chinese-title>
        <english-title>INDICATION OF FIRST CODED PICTURE FOR VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260123B">H04N19/174</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳渏紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃毓文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種通過指示第一編解碼圖片來編解碼影片序列的方法。一個影片編解碼器接收要編碼或解碼為影片序列的資料，包括複數個影片圖片。該影片編解碼器在位元流中編解碼一個指示，以識別特定圖片作為第一編解碼圖片，在影片序列中任何其他圖片之前要編解碼。可能有一個或多個其他圖片在影片序列中是排程在第一編解碼圖片之前顯示的前導圖片。特定圖片可能被選擇為第一編解碼圖片，以使使用幀內編解碼圖片的好處更均勻地分佈在整個影片序列中。該影片編解碼器按照該編解碼指示的順序編碼或解碼複數個影片圖片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for coding a video sequence by indicating the first coded picture is provided. A video coder receives data to be encoded or decoded as a video sequence comprising a plurality of video pictures. The video coder encodes or decodes an indication in a bitstream to identify a particular picture as the first coded picture to be coded before any other pictures in the video sequence. There may be one or more other pictures in the video sequence that are leading pictures scheduled to be displayed before the first coded picture. The particular picture may be selected to be the first coded picture to make the benefit of using Intra-coded picture more evenly distributed throughout the video sequence. The video coder encodes or decodes the plurality of video pictures in an order in accordance with the coded indication.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:過程</p>
        <p type="p">810~840:塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1228" publication-number="202618479">
    <tif-files tif-type="multi-tif">
      <tif file="114120702.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於判定混合批料品質之方法、系統及電腦程式產品</chinese-title>
        <english-title>METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR DETERMINING MIXING BATCH QUALITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G05B19/4155</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維托平面玻璃有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VITRO FLAT GLASS LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜姆　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUM, ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾森　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILSON, CARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以判定一混合物內組分之比率的方法、系統及電腦程式，該方法藉由下述進行：接收與玻璃屑及玻璃批料材料之混合物影像相關聯的影像資料，自一屬意區內之該混合物的影像資料來判定該混合物的溫度，基於該混合物的溫度來判定該混合物中玻璃屑與玻璃批料材料的比率，以及基於該混合物中玻璃屑與玻璃批料材料的比率而產生一動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, and computer program for determining a ratio of components within a mixture by receiving image data associated with an image of a mixture of cullet and glass batch material, determining the temperature of the mixture from the image data of the mixture within a region of interest, determining a ratio of cullet to glass batch material in the mixture based on the temperature of the mixture, and causing an action based on the ratio of cullet to glass batch material in the mixture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:混合系統</p>
        <p type="p">102:玻璃批料材料、玻璃批料、批料材料</p>
        <p type="p">104:玻璃屑</p>
        <p type="p">106:混合物、批料-玻璃屑混合物、玻璃屑-玻璃批料材料混合物</p>
        <p type="p">108:混合輪</p>
        <p type="p">110:爐</p>
        <p type="p">112:運送器、運送器條帶</p>
        <p type="p">114:玻璃屑容器</p>
        <p type="p">120:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1229" publication-number="202617692">
    <tif-files tif-type="multi-tif">
      <tif file="114120798.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三芳基鋶鹽化合物、其製造方法、及該化合物之用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C381/12</main-classification>
        <further-classification edition="200601120260202B">C07C317/14</further-classification>
        <further-classification edition="200601120260202B">C09K3/00</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商四國化成工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIKOKU CHEMICALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木勇介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子昌央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥村尚登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUMURA, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤川和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKAWA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富士平和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIHIRA, YAMATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫井彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOI, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田琢磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎的三芳基鋶鹽化合物及其製造方法。又，本發明提供包含該三芳基鋶鹽化合物之光酸產生劑、包含該光酸產生劑之阻劑組成物、使用該阻劑組成物之阻劑圖案之形成方法等。本發明關於化學式(I)所示化合物、包含該化合物之光酸產生劑、包含該光酸產生劑之阻劑組成物、及使用該阻劑組成物之阻劑圖案之形成方法。&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="318px" file="ed10055.JPG" alt="ed10055.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (式中，R&lt;sup&gt;1&lt;/sup&gt;表示氫原子；鹵素原子；-CF&lt;sub&gt;3&lt;/sub&gt;；-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;2&lt;/sup&gt;；碳數1~10之烷基；-OH；選自式(S-1)~式(S-4)之聚合性基；或選自式(R-1)~式(R-7)之酸反應性基。R&lt;sup&gt;2&lt;/sup&gt;表示-CF&lt;sub&gt;3&lt;/sub&gt;、-CF&lt;sub&gt;2&lt;/sub&gt;CF&lt;sub&gt;3&lt;/sub&gt;、碳數1~10之烷基、或苯基。[A]&lt;sup&gt;-&lt;/sup&gt;表示三氟甲磺酸陰離子(TfO&lt;sup&gt;-&lt;/sup&gt;)或鹵化物離子)。&lt;br/&gt;&lt;img align="absmiddle" height="106px" width="536px" file="ed10056.JPG" alt="ed10056.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;(式中，R&lt;sup&gt;1a&lt;/sup&gt;表示氫原子或甲基，Y表示單鍵或碳數1~3之伸烷基)。&lt;br/&gt;&lt;img align="absmiddle" height="191px" width="597px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (式中，Y與前述相同。R&lt;sup&gt;51&lt;/sup&gt;~R&lt;sup&gt;53&lt;/sup&gt;相同或不同，表示氫原子、碳數1~20之烷基、碳數2~8之烯基或碳數4~18之芳香族基，或者是，亦可R&lt;sup&gt;51&lt;/sup&gt;與R&lt;sup&gt;52&lt;/sup&gt;連接，與各別所鍵結之碳原子一同形成碳數3~20之脂肪族烴環。R&lt;sup&gt;54&lt;/sup&gt;及R&lt;sup&gt;55&lt;/sup&gt;相同或不同，表示氫原子、碳數1~6之烷基。R&lt;sup&gt;56&lt;/sup&gt;表示碳數1~20之烷基、碳數3~20之脂環式烴基。前述烷基、脂肪族烴環、及脂環式烴基所含之-CH2-，亦可取代為-O-或-S-。d表示0~4之整數。惟，式(R-1)、式(R-3)、及式(R-5)~(R-7)中，係排除R&lt;sup&gt;51&lt;/sup&gt;~R&lt;sup&gt;53&lt;/sup&gt;全部為氫原子的情況)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1230" publication-number="202618455">
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          <doc-number>202618455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含反射標記及透射標記之微影設備及量測微影設備中之像差之方法</chinese-title>
        <english-title>LITHOGRAPHIC APPARATUS COMPRISING A REFLECTIVE MARK AND A TRANSMISSIVE MARK AND A METHOD OF MEAURING ABERRATIONS IN A LITHOGRAPHIC APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G03F7/20</main-classification>
        <further-classification edition="200601120260116B">G03F9/00</further-classification>
        <further-classification edition="200601120260116B">G02B5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪肯　德克　揚　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIKKEN, DIRK JAN WILLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　德瑞克　雲　傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, DERICK YUN CHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於一種用於一微影設備之反射標記，該反射標記包含一或多個第一部分及一或多個第二部分，該一或多個第一部分及該一或多個第二部分經配置以形成一繞射光柵，其中該一或多個第一部分之一反射率大於該一或多個第二部分之一反射率，且該一或多個第二部分之一反射率大於1%；且本揭示亦係關於一種用於一微影設備之透射標記，該透射標記包含一或多個第一部分及一或多個第二部分，該一或多個第一部分及該一或多個第二部分經配置以形成一繞射光柵，其中該一或多個第一部分之一透射率大於該一或多個第二部分之一透射率，且該一或多個第二部分之一透射率大於1%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a reflective mark for a lithographic apparatus, the reflective mark comprising one or more first portions and one or more second portions arranged to form a diffraction grating, wherein a reflectance of the one or more first portions is greater than a reflectance of the one or more second portions, and a reflectance of the one or more second portions is greater than 1%, and also to a transmissive mark for a lithographic apparatus, the transmissive mark comprising one or more first portions and one or more second portions arranged to form a diffraction grating, wherein a transmittance of the one or more first portions is greater than a transmittance of the one or more second portions, and a transmittance of the one or more second portions is greater than 1%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">34:第一繞射光束/正第一(+1&lt;sup&gt;st&lt;/sup&gt;)階第一繞射光束</p>
        <p type="p">35:第一繞射光束/第零(0&lt;sup&gt;th&lt;/sup&gt;)階第一繞射光束</p>
        <p type="p">36:第一繞射光束/負第一(-1&lt;sup&gt;st&lt;/sup&gt;)階第一繞射光束</p>
        <p type="p">44:第二繞射光束/正第一(+1&lt;sup&gt;st&lt;/sup&gt;)階第二繞射光束</p>
        <p type="p">45:第二繞射光束/第零(0&lt;sup&gt;th&lt;/sup&gt;)階第二繞射光束</p>
        <p type="p">46:第二繞射光束/負第一(-1&lt;sup&gt;st&lt;/sup&gt;)階第二繞射光束</p>
        <p type="p">47:第二繞射光束/較高階繞射光束</p>
        <p type="p">48:第二繞射光束/較高階繞射光束</p>
        <p type="p">310:感測器裝置</p>
        <p type="p">311:透射標記</p>
        <p type="p">312:輻射感測器</p>
        <p type="p">PS:投影系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1231" publication-number="202618574">
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      <tif file="114120839.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120839</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經由串列匯流排之聚合附屬控制</chinese-title>
        <english-title>AGGREGATED SUBORDINATE CONTROL OVER A SERIAL BUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G06F13/42</main-classification>
        <further-classification edition="202201120260123B">H04L61/5069</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科沃美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QORVO US, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克爾　丹尼爾查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KERR, DANIEL CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩戈　克里斯托弗張</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGO, CHRISTOPHER TRUONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯姆　詹姆斯馬克羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOOM, JAMES MARK ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露中描述了經由一串列匯流排之聚合附屬控制。在本文中，一種串列匯流排電路包括多個附屬電路，該多個附屬電路各自經組態以基於經程式化至一各別控制暫存器中之一各別一或多個控制位元而操作。可理解地，若該等附屬電路中之各者中的該(等)控制暫存器透過多個匯流排電報而個別地經程式化，則該串列匯流排之大部分已經有限的頻寬將被浪費。就此而言，在本文中所揭露之實施例中，一單一匯流排電報可經組態以承載可同時程式化多個附屬電路中之該(等)控制暫存器的一聚合控制字。因此，有可能減少用於程式化該等附屬電路之匯流排電報，由此有助於節省該串列匯流排之頻寬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aggregated subordinate control over a serial bus is described in the present disclosure. Herein, a serial bus circuit includes multiple subordinate circuits each configured to operate based on a respective one or more control bits programmed into a respective control register(s). Understandably, if the control register(s) in each of the subordinate circuits is programmed individually through multiple bus telegrams, then much of the already limited bandwidth of the serial bus will be wasted. In this regard, in embodiments disclosed herein, a single bus telegram can be configured to carry an aggregated control word that can simultaneously program the control register(s) in multiple subordinate circuits. As a result, it is possible to reduce bus telegrams for programming the subordinate circuits, thus helping to conserve bandwidth of the serial bus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:串列匯流排電路</p>
        <p type="p">12:主電路</p>
        <p type="p">14(1):附屬電路</p>
        <p type="p">14(2):附屬電路</p>
        <p type="p">14(3):附屬電路</p>
        <p type="p">14(4):附屬電路</p>
        <p type="p">14(N):附屬電路</p>
        <p type="p">16:串列匯流排</p>
        <p type="p">18(1):控制器</p>
        <p type="p">18(2):控制器</p>
        <p type="p">18(3):控制器</p>
        <p type="p">18(4):控制器</p>
        <p type="p">20(1):暫存器組</p>
        <p type="p">20(2):暫存器組</p>
        <p type="p">20(3):暫存器組</p>
        <p type="p">20(4):暫存器組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1232" publication-number="202618872">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>114120842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板批次通過化學處理浴之最佳化定向</chinese-title>
        <english-title>OPTIMIZATION OF THE ORIENTATION OF SUBSTRATES PASSING IN BATCHES INTO CHEMICAL TREATMENT BATHS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/02</main-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商梭意泰科公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　伊莎貝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERIN, ISABELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多芬　恩佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUPHIN, ENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜克那伊　龐　維諾妮可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUQUENNOY-PONT, VERONIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種施加至彼此平行固持之複數個基板(Sub)之處理程序，該處理包括處理之至少兩個連續序列，該等序列之各者包括含於配備用於注入處理溶液之軌之容器中之至少一個化學浴中之至少一個浸蘸，該注入軌包括施配噴嘴，該等噴嘴沿該注入軌分佈，該等基板(Sub)各實質上垂直於該注入軌安置，其中：針對根據第一定向(Or1)所定向之該等基板(Sub)實施該至少兩個浸蘸之第一者，該第一定向圍繞法向於該等基板之軸線成角度地指示；且針對根據第二定向(Or2)所定向之該等基板之至少一部分實施該至少兩個浸蘸之第二者，該第二定向(Or2)不同於該第一定向(Or1)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Treatment process applied to a plurality of substrates (Sub) held parallel to one another, the treatment comprising at least two successive sequences of treatments, each of the sequences comprising at least one dip in at least one chemical bath contained in a container equipped with a rail for injecting a treatment solution, the injection rail comprising dispensing nozzles, the nozzles being distributed along the injection rail, the substrates (Sub) each being disposed substantially perpendicular to the injection rail, wherein: a first of the at least two dips is carried out with the substrates (Sub) oriented according to a first orientation (Or1), which is angularly indicated about an axis normal to the substrates; and a second of the at least two dips is carried out with at least a part of the substrates oriented according to a second orientation (Or2), which is different from the first orientation (Or1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">Or1:第一定向</p>
        <p type="p">Or2:第二定向</p>
        <p type="p">Or3:第三定向</p>
        <p type="p">Sub:基板</p>
        <p type="p">WC:濕式載體</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1233" publication-number="202617858">
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      <tif file="114120858.zip" no="1">
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          <doc-number>202617858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組合物、聚矽氧烷膜、光學構件、及紫外線發光裝置</chinese-title>
        <english-title>CURABLE COMPOSITION, POLYSILOXANE FILM, OPTICAL MEMBER, AND ULTRAVIOLET LIGHT-EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08K5/098</main-classification>
        <further-classification edition="200601120260202B">C08L83/06</further-classification>
        <further-classification edition="202501120260202B">H10H20/85</further-classification>
        <further-classification edition="202501120260202B">H10H20/854</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>折田雄一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORITA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>染谷武紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMEYA, TAKENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種硬化性組合物，其包含：具有烷氧基之聚矽烷醇、具有烷氧基之氫倍半矽氧烷、及具有烷氧基之氫聚矽氧烷中之至少任一者；及金屬元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:透鏡(透光性構件)</p>
        <p type="p">6:硬化性組合物膜</p>
        <p type="p">10:光學構件</p>
        <p type="p">31:對向面(第2界面)</p>
        <p type="p">32:凸曲面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1234" publication-number="202618919">
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      <tif file="114120861.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於原子層沉積及原子層蝕刻的底部反應效率調控的方法</chinese-title>
        <english-title>METHOD OF BOTTOM REACTION EFFICIENCY MODULATION FOR ALD AND ALE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/3065</main-classification>
        <further-classification edition="200601120260123B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯　傳偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OR, DAVID T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　疆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所描述的實施例提供了用於高深寬比結構的原子層沉積和原子層蝕刻的方法。在一些實施例中，提供了脈衝氣體稀釋方法。該方法包括提供基板，該基板包含腔體，腔體具有第一表面和第二表面，其中第一表面設置在腔體中的第二表面下方。該方法包括供應第一氣體，在高壓下脈衝第二氣體，並創建濃度梯度，其中在腔體的第一表面處存在更高濃度的第一氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein provide methods for atomic layer deposition and atomic layer etching of high aspect ratio structures. In some embodiments, a pulsed gas dilution method is provided. The method includes providing a substrate, the substrate includes a cavity, the cavity having a first surface and a second surface, where the first surface is disposed below the second surface in the cavity. The method includes supplying a first gas, pulsing a second gas at a high pressure, and creating a concentration gradient where there is a higher concentration of the first gas at the first surface of the cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100C:接觸結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:基於矽的部分</p>
        <p type="p">106:腔體</p>
        <p type="p">108:底表面</p>
        <p type="p">110:第一氣體</p>
        <p type="p">112:頂表面</p>
        <p type="p">114:第二氣體</p>
        <p type="p">116:稀釋氣體</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1235" publication-number="202617376">
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          <doc-number>202617376</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於鉸接臂連桿的摩擦制動器</chinese-title>
        <english-title>FRICTION BRAKE FOR ARTICULATING ARM LINKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">B25J9/10</main-classification>
        <further-classification edition="200601120260119B">B25J17/00</further-classification>
        <further-classification edition="200601120260119B">B25J19/00</further-classification>
        <further-classification edition="200601120260119B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都索查　艾利森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DSOUZA, ALISON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示例性的鉸接臂包括第一鉸接臂段、第二鉸接臂段，以及可動連接第一鉸接臂段和第二鉸接臂段的鉸接連桿。鉸接連桿包括具有第一端和第二端的軸，該軸貫穿第一鉸接臂段和第二鉸接臂段，並且包括摩擦制動器，該摩擦制動器包括張力塊和張力螺絲。鉸接臂的設計使得軸的第二端設置在穿過張力塊的孔中，而張力螺絲則在大致垂直於該孔的方向上貫穿張力塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary articulating arms include a first articulating arm segment, a second articulating arm segment, and an articulating linkage movably connecting the first articulating arm segment and the second articulating arm segment. An articulating linkage includes a shaft having a first end and a second end, the shaft extending through the first articulating arm segment and the second articulating arm segment, and a friction brake comprising a tension block and a tension screw. Articulating arms include where the second end of the shaft is disposed in an aperture extending through the tension block, and the tension screw extends through the tension block in a direction generally perpendicular to the aperture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">502:鉸接連桿</p>
        <p type="p">504:摩擦制動器</p>
        <p type="p">518:臂段</p>
        <p type="p">524:第一端</p>
        <p type="p">526a:上臂</p>
        <p type="p">526b:下臂</p>
        <p type="p">534:軸</p>
        <p type="p">534a:第一端</p>
        <p type="p">534b:第二端</p>
        <p type="p">538:致動器</p>
        <p type="p">540:導向組件</p>
        <p type="p">542:孔</p>
        <p type="p">544:張力塊</p>
        <p type="p">546:制動支撐</p>
        <p type="p">550:張力間隙</p>
        <p type="p">552:前側</p>
        <p type="p">554:背面</p>
        <p type="p">556:孔</p>
        <p type="p">558:突起</p>
        <p type="p">560:凸緣</p>
        <p type="p">562:內側側壁</p>
        <p type="p">x:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1236" publication-number="202618005">
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          <doc-number>114120864</doc-number>
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      <invention-title>
        <chinese-title>標的核酸之判別方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260202B">C12Q1/6851</main-classification>
        <further-classification edition="201801120260202B">C12Q1/686</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI MEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海老沼宏幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBINUMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種標的核酸之判別方法，其可藉由相對容易之方法以1個螢光波長同時判別複數之標的核酸，且對於希特林缺陷症（citrin deficiency）等存在較多致病變異體（pathogenic variant）之疾病之檢查亦有用。  &lt;br/&gt;本發明之標的核酸之判別方法包括下述步驟（a）、與下述（b）～（c）及/或下述（d）～（e），且藉由同時多重即時PCR來判別樣本中所包含之2以上之標的核酸。  &lt;br/&gt;（a）使樣本、引子組、及螢光標記探針接觸，而擴增樣本中之標的核酸之步驟。  &lt;br/&gt;（b）製作步驟（a）之擴增曲線，由設定之閾值獲得Ct值之步驟。  &lt;br/&gt;（c）將針對各標的核酸設定之Ct值、與步驟（b）中所獲得之Ct值進行比較之步驟。  &lt;br/&gt;（d）製作步驟（a）之擴增曲線，獲得所設定之循環數內之螢光值之步驟。  &lt;br/&gt;（e）將針對各標的核酸設定之循環數內之螢光值、與步驟（d）中所獲得之螢光值進行比較之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1237" publication-number="202619262">
    <tif-files tif-type="multi-tif">
      <tif file="114120888.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電夾具及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H02N13/00</main-classification>
        <further-classification edition="200601120260123B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商創意科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREATIVE TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高垣龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGAKI, RYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川喬彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種靜電夾具及其製造方法，使靜電夾具具備樹脂製介電層，以及優秀的耐久度與吸附力。  &lt;br/&gt;　　[解決手段] 一種靜電夾具，在介電層(1)與絕緣層(3)之間具有電極層(2)；至少介電層是以包含熱可塑性樹脂的介電層樹脂材料所形成，電極層是以包含熱可塑性樹脂與導電性填料的電極層樹脂材料所形成，這些介電層與電極層不使用黏著劑，而是直接接合；介電層(1)的厚度為300μm以上，在室溫下的體積電阻率為1×10&lt;sup&gt;9&lt;/sup&gt;Ω･cm以上且小於1×10&lt;sup&gt;13&lt;/sup&gt;Ω･cm。而且，使用3D列印機的熱熔層積法，將包含熱可塑性樹脂而形成絕緣層的絕緣層樹脂材料、包含熱可塑性樹脂與導電性填料而形成電極層的電極層樹脂材料、包含熱可塑性樹脂而形成介電層的介電層樹脂材料，依序堆積硬化而得到上述靜電夾具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">X:靜電夾具</p>
        <p type="p">Y1-Y1:線</p>
        <p type="p">Y2-Y2:線</p>
        <p type="p">Y3-Y3:線</p>
        <p type="p">Y4-Y4:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1238" publication-number="202617607">
    <tif-files tif-type="multi-tif">
      <tif file="114120890.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活性物質、電極材料、電極、二次電池、電池組、及電極的回收方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C01G33/00</main-classification>
        <further-classification edition="201001120260202B">H01M4/131</further-classification>
        <further-classification edition="200601120260202B">H01M4/36</further-classification>
        <further-classification edition="201001120260202B">H01M4/485</further-classification>
        <further-classification edition="200601120260202B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東芝股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA TOSHIBA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤亜里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, ASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深谷太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAYA, TARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保科圭吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINA, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田芳明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可實現倍率性能優異的二次電池之活性物質、電極材料、及電極，倍率性能優異的二次電池及電池組，以及可提升電極的回收率之電極的回收方法。  &lt;br/&gt;　　根據實施形態，提供包含含有單斜晶型鈮鈦氧化物相的氧化物粒子之活性物質。針對氧化物粒子的X射線繞射光譜包含23.6°以上24.3°以下的範圍出現之最大峰值P1及25.8°以上26.6°以下的範圍出現之複數峰值。將25.8°以上26.6°以下的範圍出現之峰值中峰值強度最大的3個峰值的峰值強度按從大到小之順序分別設為I2,I3,及I4時，I2/I4為5以上26以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">41,42,P1,P2,P3,P4:峰值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1239" publication-number="202617255">
    <tif-files tif-type="multi-tif">
      <tif file="114120916.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過膜分離從含有氟化物的廢水中回收氟化物</chinese-title>
        <english-title>RECOVERY OF FLUORIDE FROM FLUORIDE-CONTAINING WASTE WATER THROUGH MEMBRANE SEPARATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B01D61/24</main-classification>
        <further-classification edition="200601120260202B">B01D61/36</further-classification>
        <further-classification edition="200601120260202B">B01D69/02</further-classification>
        <further-classification edition="200601120260202B">B01D69/08</further-classification>
        <further-classification edition="200601120260202B">C01B7/19</further-classification>
        <further-classification edition="202301120260202B">C02F1/44</further-classification>
        <further-classification edition="202301120260202B">C02F1/66</further-classification>
        <further-classification edition="200601220260202B">B01D63/02</further-classification>
        <further-classification edition="200601320260202B">C02F101/14</further-classification>
        <further-classification edition="200601320260202B">C02F103/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商藝康美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECOLAB USA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雍　順祜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SEONG-HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於從廢水中去除氟化物的系統及技術可涉及將包含氟離子的廢水酸化以形成氫氟酸。將該廢水酸化後，經酸化之廢水可接觸膜之第一側，以引起該氫氟酸中之至少一部分穿過該膜到該膜之第二側。可使該膜之該第二側與收集流體接觸以收集穿過該膜的該氫氟酸。可從含有該膜的外殼排出具有降低的氟離子濃度的經處理之廢水。還可從含有該膜的該外殼排出已經收集了穿過該膜的該氫氟酸的該收集流體。在一些應用中，已經收集了該氫氟酸的該收集流體可經處理，以分離並回收該氫氟酸，供後續使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques for removing fluoride from waste water may involve acidifying a waste water that includes fluoride ions to form hydrofluoric acid. After acidifying the waste water, the acidified waste water can contact a first side of a membrane to cause at least a portion of the hydrofluoric acid to pass through the membrane to a second side of the membrane. The second side of the membrane can be contacted with a collection fluid to collect the hydrofluoric acid passing through the membrane. A treated wastewater having a reduced concentration of fluoride ions can be discharged from a housing containing the membrane. The collection fluid having collected the hydrofluoric acid passing through the membrane can also be discharged from the housing containing the membrane. In some applications, the collection fluid having collected the hydrofluoric acid can be processed to separate and recover the hydrofluoric acid for subsequent use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:膜</p>
        <p type="p">104:外殼</p>
        <p type="p">106:進料流</p>
        <p type="p">108:收集流體料流</p>
        <p type="p">110:經處理之水流</p>
        <p type="p">112:收集流體料流</p>
        <p type="p">114:酸泵</p>
        <p type="p">116:酸源</p>
        <p type="p">118:水源</p>
        <p type="p">120:進料入口</p>
        <p type="p">122:泵</p>
        <p type="p">124:收集流體源</p>
        <p type="p">126:收集流體入口</p>
        <p type="p">128:收集流體出口</p>
        <p type="p">130A:收集流體泵</p>
        <p type="p">130B:收集流體真空泵</p>
        <p type="p">150:控制器</p>
        <p type="p">152:處理器</p>
        <p type="p">154:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1240" publication-number="202617241">
    <tif-files tif-type="multi-tif">
      <tif file="114120918.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理流體中的污染物的方法和裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR TREATING CONTAMINANT IN A FLUID</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B01D3/14</main-classification>
        <further-classification edition="200601120260127B">B01D3/32</further-classification>
        <further-classification edition="200601120260127B">B01D53/14</further-classification>
        <further-classification edition="200601120260127B">B01D59/22</further-classification>
        <further-classification edition="200601120260127B">B01D59/34</further-classification>
        <further-classification edition="200601120260127B">B01D59/50</further-classification>
        <further-classification edition="202401120260127B">B01J35/39</further-classification>
        <further-classification edition="200601120260127B">C10G15/00</further-classification>
        <further-classification edition="200601120260127B">C10G55/02</further-classification>
        <further-classification edition="202301120260127B">C02F9/00</further-classification>
        <further-classification edition="202301220260127B">C02F1/04</further-classification>
        <further-classification edition="202301220260127B">C02F1/32</further-classification>
        <further-classification edition="202301220260127B">C02F1/72</further-classification>
        <further-classification edition="200601320260127B">C02F101/36</further-classification>
        <further-classification edition="200601320260127B">C02F103/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商因維克塔水公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVICTA WATER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰勒　傑森　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAYLOR, JASON EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾德蒙　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDMOND, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於處理流體中之污染物的系統，該系統包含污染物濃縮子階段及PCD子階段。該污染物濃縮子階段經組態以接收包含污染物之流體供應物，且(1)自第一出口輸出包含第一濃度之該污染物的第一部分，及(2)自第二出口輸出包含第二濃度之該污染物的第二部分，該第一濃度大於該第二濃度。該PCD子階段包含PCD容器及在該PCD容器中之PCD光催化劑。該污染物濃縮子階段之該第一出口經流體流連接至該PCD容器之入口。本發明亦關於多階段系統，其包含一或多個污染物濃縮子階段及一或多個PCD子階段。本發明亦關於處理流體中之污染物的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems for treating contaminant in a fluid, the system comprising a contaminant concentration sub-stage and a PCD sub-stage. The contaminant concentration sub-stage is configured to receive a fluid supply comprising a contaminant, and to output (1) from a first outlet a first portion comprising a first concentration of the contaminant, and (2) from a second outlet a second portion comprising a second concentration of the contaminant, the first concentration greater than the second concentration. The PCD sub-stage comprises a PCD vessel and a PCD photocatalyst that is in the PCD vessel. The first outlet of the contaminant concentration sub-stage is fluid-flow connected to an inlet of the PCD vessel. Also, multistage systems comprising one or more contaminant concentration sub-stages and one or more PCD sub-stages. Also, methods of treating contaminant in a fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">290:分離階段第一個分餾塔</p>
        <p type="p">291:分離階段第二個分餾塔</p>
        <p type="p">292:分離階段第三個分餾塔</p>
        <p type="p">293:分離階段第四個分餾塔</p>
        <p type="p">294:分離階段第五個分餾塔</p>
        <p type="p">295:污染物濃縮階段第一個分餾塔</p>
        <p type="p">296:污染物濃縮階段第二個分餾塔</p>
        <p type="p">297:污染物濃縮階段第三個分餾塔</p>
        <p type="p">298:污染物濃縮階段第四個分餾塔</p>
        <p type="p">299:PCD容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1241" publication-number="202617124">
    <tif-files tif-type="multi-tif">
      <tif file="114120992.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>身體護理裝置</chinese-title>
        <english-title>BODY CARE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61H37/00</main-classification>
        <further-classification edition="200601120260123B">A61H39/04</further-classification>
        <further-classification edition="200601120260123B">A47C9/00</further-classification>
        <further-classification edition="200601120260123B">A47C1/032</further-classification>
        <further-classification edition="200601120260123B">A47C7/14</further-classification>
        <further-classification edition="200601120260123B">A47C7/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴性俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸炯圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUK, HYUNGKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種藉由實體地刺激就坐使用者的身體而能夠提供按摩的身體護理裝置。該身體護理裝置包括：本體架；座架，裝設在本體架上，該座架被配置以支撐使用者的臀部；靠背架，其有一端耦接至座架，該靠背架被配置以支撐使用者的背部；遮罩，可旋轉地安裝在本體架上，該遮罩被配置以當旋轉時覆蓋靠背架的另一端；以及遮罩驅動器，配置以將本體架與遮罩彼此連接，該遮罩驅動器被配置以相對於本體架旋轉遮罩，其中，遮罩驅動器在遮罩旋轉時在本體架的前後方向上移動遮罩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a body care apparatus capable of providing massage by physically stimulating the body of a seated user. The body care apparatus includes a body frame, a seat frame mounted to the body frame, the seat frame being configured to support a user’s buttocks, a backrest frame having one end coupled to the seat frame, the backrest frame being configured to support the user’s back, a canopy rotatably installed on the body frame, the canopy being configured to cover the other end of the backrest frame when rotated, and a canopy driver configured to connect the body frame and the canopy to each other, the canopy driver being configured to rotate the canopy relative to the body frame, wherein the canopy driver moves the canopy in a forward-backward direction of the body frame when the canopy is rotated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:本體</p>
        <p type="p">120:本體蓋</p>
        <p type="p">130:輪</p>
        <p type="p">220a:上蓋</p>
        <p type="p">221:第一擱置面</p>
        <p type="p">221a:臀部擱置面</p>
        <p type="p">300:靠背部</p>
        <p type="p">320a:前蓋</p>
        <p type="p">320b:側蓋</p>
        <p type="p">321:第二擱置面</p>
        <p type="p">400:遮罩</p>
        <p type="p">1000:身體護理裝置</p>
        <p type="p">X,Y,Z:方向、軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1242" publication-number="202618445">
    <tif-files tif-type="multi-tif">
      <tif file="114120993.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於感測器表面清潔之方法、裝置及系統</chinese-title>
        <english-title>METHOD, DEVICE AND SYSTEM FOR SENSOR SURFACE CLEANING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G03F7/00</main-classification>
        <further-classification edition="200601120260123B">B08B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班諾吉　尼魯潘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANERJEE, NIRUPAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾門斯　雅各布斯　科內利斯　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMENS, JACOBUS CORNELIS JOSEPHUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫默斯　史蒂芬　尚　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMMERS, STEFAN JEAN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯茲　康納利　馬利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROPS, CORNELIUS MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於使用一清潔裝置清潔一感測器表面之方法，該清潔裝置包含：一供應配置，其用於將一清潔氣體及一清潔液體遞送至一清潔空間；及一抽取配置，其中該方法包含：將該清潔裝置置放於該感測器表面附近；將該清潔氣體及該清潔液體遞送至該清潔空間；控制該清潔裝置，其方式為在使用期間，產生一清潔混合物且將其限制於該清潔空間中，該清潔混合物與該感測器表面接觸，且其中該清潔氣體及該清潔液體在兩者之間形成接觸面；藉由在該抽取配置處施加一經縮減壓力而自該清潔空間抽取該清潔混合物及任何清潔殘餘物；及自該感測器移除該清潔裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a method for cleaning a sensor surface using a cleaning device which comprises a supply arrangement for delivering a cleaning gas and a cleaning liquid to a cleaning space, and an extract arrangement, wherein the method comprises: placing the cleaning device in proximity to the sensor surface, delivering the cleaning gas and the cleaning liquid to the cleaning space, controlling the cleaning device in such a way that during use a cleaning mixture is created and confined in the cleaning space, the cleaning mixture being in contact with the sensor surface, and wherein the cleaning gas and the cleaning liquid define contact surfaces between both, extracting the cleaning mixture and any cleaning residue from the cleaning space by applying a reduced pressure at the extract arrangement, and removing the cleaning device from the sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CD:清潔裝置</p>
        <p type="p">CSF:接觸面</p>
        <p type="p">CSP:清潔空間</p>
        <p type="p">EXT:抽取配置</p>
        <p type="p">GAS:清潔氣體</p>
        <p type="p">GASCH:氣體通道</p>
        <p type="p">GASINL:氣體入口</p>
        <p type="p">LIQ:清潔液體</p>
        <p type="p">LIQCH:液體通道</p>
        <p type="p">MIX:清潔混合物</p>
        <p type="p">OUTL:出口</p>
        <p type="p">P_ext:減壓</p>
        <p type="p">SENS:感測器</p>
        <p type="p">SF:感測器表面</p>
        <p type="p">SUP:供應配置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1243" publication-number="202617119">
    <tif-files tif-type="multi-tif">
      <tif file="114121000.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>身體護理裝置</chinese-title>
        <english-title>BODY CARE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61H7/00</main-classification>
        <further-classification edition="200601120260123B">A61H15/00</further-classification>
        <further-classification edition="200601120260123B">A61H39/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴性俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸炯圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUK, HYUNGKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種身體護理裝置，能夠藉由物理刺激使用者的身體來提供按摩。該身體護理裝置包括：基座部；主桿部，安裝以在該基座部的橫向方向上可繞著桿旋轉軸旋轉；傾角凸輪部，配置為使得該主桿部延伸並透過其不平行於與該桿旋轉軸正交的假想線的區塊來耦接；按摩臂部，耦接至該傾角凸輪部以受制於該傾角凸輪部的位移；球導引凹槽部，連續地形成在該基座部中；以及球接頭部，配置為使得其一端耦接至該按摩臂部，而其另一端插入到該球導引凹槽部中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a body care apparatus capable of providing massage by physically stimulating the body of a user. The body care apparatus includes a base portion, a main rod portion installed so as to be rotatable about a rod rotating shaft in a transverse direction of the base portion, an angled cam portion configured such that the main rod portion extends and is coupled through a section thereof that is not parallel to an imaginary line orthogonal to the rod rotating shaft, a massage arm portion coupled to the angled cam portion so as to be constrained to displacement of the angled cam portion, a ball guide groove portion continuously formed in the base portion, and a ball joint portion configured such that one end thereof is coupled to the massage arm portion and the other end thereof is inserted into the ball guide groove portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基座部</p>
        <p type="p">200:主桿部</p>
        <p type="p">300:傾角凸輪部</p>
        <p type="p">400:按摩臂部</p>
        <p type="p">1000:身體護理裝置</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1244" publication-number="202617125">
    <tif-files tif-type="multi-tif">
      <tif file="114121001.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>身體護理裝置</chinese-title>
        <english-title>BODY CARE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61H37/00</main-classification>
        <further-classification edition="200601120260123B">A61H39/04</further-classification>
        <further-classification edition="200601120260123B">A47C9/00</further-classification>
        <further-classification edition="200601120260123B">A47C1/032</further-classification>
        <further-classification edition="200601120260123B">A47C1/024</further-classification>
        <further-classification edition="200601120260123B">A47C7/14</further-classification>
        <further-classification edition="200601120260123B">A47C7/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金綵苑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸炯圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUK, HYUNG KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種身體護理裝置。身體護理裝置包括：座架、本體架、及座驅動器。複數個滾輪可旋轉地耦接至座架。本體架可包含行走面，滾輪在行走面上於前後方向上行走。座驅動器設置在本體架處，以在前後方向上移動座架。行走面在前後方向上形成具有不同高度的曲面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A body care apparatus is disclosed. The body care apparatus includes a seat frame, a body frame, and a seat driver. A plurality of rollers is rotatably coupled to the seat frame. The body frame includes a traveling surface on which the rollers travel in a forward-backward direction. The seat driver is provided at the body frame to move the seat frame in the forward-backward direction. The traveling surface forms a curved surface having different heights in the forward-backward direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:本體</p>
        <p type="p">111:基座</p>
        <p type="p">112:引導件</p>
        <p type="p">113:行走面</p>
        <p type="p">200:座部</p>
        <p type="p">210:座架</p>
        <p type="p">221a:臀部擱置面</p>
        <p type="p">231:滾輪</p>
        <p type="p">231a:第一滾輪</p>
        <p type="p">231b:第二滾輪</p>
        <p type="p">300:靠背部</p>
        <p type="p">310:靠背架</p>
        <p type="p">321:第二擱置面</p>
        <p type="p">400:遮罩</p>
        <p type="p">500:座驅動器</p>
        <p type="p">501:1a點</p>
        <p type="p">600:靠背驅動器</p>
        <p type="p">601:1b點</p>
        <p type="p">602:2b點</p>
        <p type="p">S:移動段</p>
        <p type="p">Y,Z:方向、軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1245" publication-number="202618523">
    <tif-files tif-type="multi-tif">
      <tif file="114121026.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置、資訊處理方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260123B">G06F3/0346</main-classification>
        <further-classification edition="200601120260123B">G02B27/01</further-classification>
        <further-classification edition="200601120260123B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商睛姿控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINS HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菰田泰生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMODA, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示技術提高與連續性操作指標相關之可用性。本揭示技術之一態樣之裝置(眼鏡產品裝置2)係操作具備顯示畫面(顯示器151)之操作對象裝置3者，且具備處理器(處理部200)，該處理器執行：自佩戴於使用者之身體之規定部位之感測器(六軸感測器230)取得與規定部位之動作相關之動作資訊；基於設定為如下(1)～(3)中任一者之操作模式而控制指標：(1)移動模式，其可基於動作資訊，對操作對象裝置發送與使顯示於顯示畫面之指標在顯示畫面上移動相關之移動信號；(2)限制模式，其限制指標在顯示畫面上移動；(3)按下模式，其可基於動作資訊，對操作對象裝置3發送與在顯示畫面上之指標之位置執行按下操作相關之按下信號；將操作模式設定為按下模式；在將操作模式設定為按下模式之後，基於在按下模式中取得之動作資訊中、與用於發送按下信號之第1動作相關之動作資訊、及與第1動作後之第2動作相關之動作資訊是否滿足與規定部位之動作相關之第1條件，將按下操作後之操作模式設定為移動模式或限制模式之一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理系統</p>
        <p type="p">2:眼鏡產品裝置</p>
        <p type="p">3:操作對象裝置</p>
        <p type="p">20:鏡架</p>
        <p type="p">22:資訊處理裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1246" publication-number="202617760">
    <tif-files tif-type="multi-tif">
      <tif file="114121066.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向ａＣ１ｓ、ＴｆＲ或兩者的結合蛋白及其組成物</chinese-title>
        <english-title>BINDING PROTEINS THAT TARGET AC1S, TFR, OR BOTH, AND COMPOSITIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/18</main-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
        <further-classification edition="200601120260202B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健臻公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENZYME CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡普德維拉　塞西爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAPDEVILA, CECILE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜沛耶爾　布蘭丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPERRIER, BLANDINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈蒙德　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMMOND, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯梅爾　艾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISMAIL, AYMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡瑟里亞　薩格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATHURIA, SAGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷卡薩　妮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEKSA, NINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬塞羅　亞歷山德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASIERO, ALESSANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　晟惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGHAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱　宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史泰因梅茲　安科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINMETZ, ANKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>贊格　什漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENGER, SERHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了靶向激活的C1s（aC1s）的結合蛋白、以及靶向aC1s和中樞神經系統蛋白（例如，轉鐵蛋白受體1）的雙特異性結合蛋白。還提供了該等結合蛋白用於治療補體介導的神經障礙之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides binding proteins that target activated C1s (aC1s), as well as bispecific binding proteins that target aC1s and a central nervous system protein (e.g., transferrin receptor 1). Also provided is the use of these binding proteins to treat neurological complement-mediated disorders.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1247" publication-number="202616952">
    <tif-files tif-type="multi-tif">
      <tif file="114121074.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速、自溶解的發泡抗菌片劑及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A01N25/00</main-classification>
        <further-classification edition="200601120260127B">A01N33/00</further-classification>
        <further-classification edition="200601120260127B">A01P1/00</further-classification>
        <further-classification edition="200601120260127B">A61K8/02</further-classification>
        <further-classification edition="200601120260127B">A61K8/41</further-classification>
        <further-classification edition="200601120260127B">A61Q19/10</further-classification>
        <further-classification edition="200601120260127B">C11D17/00</further-classification>
        <further-classification edition="200601120260127B">C11D17/06</further-classification>
        <further-classification edition="200601120260127B">C11D3/04</further-classification>
        <further-classification edition="200601120260127B">C11D3/37</further-classification>
        <further-classification edition="200601120260127B">C11D3/48</further-classification>
        <further-classification edition="200601120260127B">C11D3/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商捷和實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIAPHUA INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　裕德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUE TAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>李　忠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
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          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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        <p type="p">一種快速、自溶解的發泡抗菌片劑及其製備方法，包括抗菌成分、發泡劑、聚合物和攪拌崩解劑。抗菌成分、發泡劑和攪拌崩解劑分散並封裝在聚合物中，形成快速、自溶解、可發泡抗菌片劑，封裝的功能成分可以在不增加額外含水量的情況下使用簡單的容器實現安全運輸，從而大大減少運輸體積和重量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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  <tw-patent-application no="1248" publication-number="202619524">
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      <tif file="114121113.zip" no="1">
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      <isuno>9</isuno>
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          <doc-number>202619524</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＭＯＳＦＥＴ、用於產生ＭＯＳＦＥＴ的方法以及由所述方法產生的ＭＯＳＦＥＴ</chinese-title>
        <english-title>MOSFETS, METHOD FOR PRODUCING MOSFET AND MOSFET PRODUCED THEREBY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260126B">H10D30/01</main-classification>
        <further-classification edition="200601120260126B">H01L21/324</further-classification>
        <further-classification edition="200601120260126B">H01L21/20</further-classification>
        <further-classification edition="202501120260126B">H10D30/60</further-classification>
        <further-classification edition="202501120260126B">H10D64/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維克斯　史蒂芬　拉爾森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEEKS, STEPHEN LARSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿卡納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARCHANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾特　喬舒亞　斯圖爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLT, JOSHUA STUART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅加利尼　盧多維科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGALINI, LUDOVICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希南　悉達多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAN, SIDDARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丘齊克　邁克爾　帕特里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUDZIK, MICHAEL PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里尼瓦桑　拉加夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SREENIVASAN, RAGHAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　漢塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, HANSEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達特　呂西安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATE, LUCIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本主題相關於藉由直接在碳化矽表面上施加氮化預處理（例如，電漿或熱）來產生金屬氧化物半導體場效電晶體的系統和方法。氮化預處理後可以接著沉積閘極氧化層。以此方式，取代使用熱氧化物和熱氮氧化物退火，氮在介面處被引入以鈍化陷阱而沒有碳化矽的任何熱氧化。此外，後退火步驟可以被執行，導致遷移率的改善。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present subject matter relates to systems and methods for producing a MOSFET by applying a nitridation pre-treatment (e.g., plasma or thermal) directly on a silicon carbide surface. The nitridation pre-treatment can be followed by a deposited gate oxide. In this way, instead of using a thermal oxide and a thermal nitrogen oxide anneal, nitrogen is introduced at the interface to passivate traps without any thermal oxidation of the silicon carbide. In addition, the post-anneal step can be performed, resulting in an improvement in mobility.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:金屬氧化物半導體場效電晶體</p>
        <p type="p">112:基板</p>
        <p type="p">113:磊晶層</p>
        <p type="p">114:井</p>
        <p type="p">115:溝槽</p>
        <p type="p">116:閘極氧化層</p>
        <p type="p">118:含氮層</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1249" publication-number="202618485">
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      <tif file="114121166.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618485</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置、狀態資訊之生成方法、判定方法及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G05B23/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科納維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANADEVIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬野元秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMANO, MOTOHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊瀬顕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISE, AKIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">即便在反映出對象設施的狀態的時間點針對每個感測器而不同的情況下，亦能夠考慮該些的感測器資料來掌握對象設施的狀態。資訊處理裝置（1A）包括：關係指標算出部（103），針對使設置於對象設施的多個感測器成對而得的感測器的組的各者，算出表示感測器資料的關係性的關係指標；以及狀態資訊生成部（104），使用所述關係指標生成表示對象設施的狀態的狀態資訊，關係指標算出部（103）針對使在不同的時間點獲得的感測器資料成對而得的感測器資料的組，算出所述關係指標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
        <p type="p">1A:資訊處理裝置</p>
        <p type="p">10A:控制部</p>
        <p type="p">11:儲存部</p>
        <p type="p">12:輸入部</p>
        <p type="p">13:輸出部</p>
        <p type="p">101:資料取得部</p>
        <p type="p">102:劃分部</p>
        <p type="p">103:關係指標算出部</p>
        <p type="p">104:狀態資訊生成部</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1250" publication-number="202617259">
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        <document-id>
          <doc-number>114121172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細緻氣泡生成器、處理液供給裝置以及基板處理裝置</chinese-title>
        <english-title>FINE BUBBLE GENERATOR, PROCESSING LIQUIS SUPPLYING APPARATUS, AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260127B">B01F23/20</main-classification>
        <further-classification edition="202201120260127B">B01F25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中根慎悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANE, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種即使在液體的流量已經變動之情形中亦能使細緻氣泡的生成效率穩定之技術。細緻氣泡生成器(1)係具備：第一管部(21)；第二管部(23)，係位於比第一管部(2)還靠下游側；狹窄管部(24)，係位於第一管部(21)與第二管部(23)之間，並具有流路剖面積朝向下游而變小之部分；以及可變機構(27)，係因應第一管部(21)的流量變更狹窄管部(24)中的流路剖面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:細緻氣泡生成器</p>
        <p type="p">21:第一管部</p>
        <p type="p">23:第二管部</p>
        <p type="p">24:狹窄管部</p>
        <p type="p">25:閥外殼</p>
        <p type="p">27:可變機構</p>
        <p type="p">29:分支管部</p>
        <p type="p">31:閥體</p>
        <p type="p">33:進退驅動部</p>
        <p type="p">41:凸緣部</p>
        <p type="p">43:導環</p>
        <p type="p">252:擴寬部</p>
        <p type="p">253:調整螺絲</p>
        <p type="p">311:軸部</p>
        <p type="p">331:隔膜</p>
        <p type="p">332:施力部</p>
        <p type="p">333:導件部</p>
        <p type="p">334:軸承部</p>
        <p type="p">A1:軸</p>
        <p type="p">d:間隙</p>
        <p type="p">P1,P2:流入口</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1251" publication-number="202618000">
    <tif-files tif-type="multi-tif">
      <tif file="114121188.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生產間隔子-特異性DNA重組酶之方法</chinese-title>
        <english-title>METHOD FOR PRODUCING SPACER-SPECIFIC DNA RECOMBINING ENZYMES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N15/54</main-classification>
        <further-classification edition="200601120260202B">C12N15/10</further-classification>
        <further-classification edition="200601120260202B">C12N9/10</further-classification>
        <further-classification edition="200601120260202B">C12N15/63</further-classification>
        <further-classification edition="200601120260202B">A61K31/7088</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德勒斯登工業大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNISCHE UNIVERSITAET DRESDEN KOERPERSCHAFT DES OEFFENTLICHEN RECHTS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布赫霍爾茨　弗蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHHOLZ, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾斯頓　珍娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOERSTEN, JENNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭辛　菲利克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANSING, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯科斯基　羅加茨　馬切伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASZKOWSKI-ROGACZ, MACIEJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種生產間隔子-特異性 DNA 重組酶（DNA recombining enzyme，DRE）的方法，該方法包括以下步驟：a) 提供一種表現載體庫，其編碼多種 DRE 變體 （variants of a DRE ，vDRE），其中與非變體 DRE （non-variant DRE，nvDRE）相比，該 vDRE 的胺基酸序列包含一個或多個胺基酸修飾，該vDRE係衍生自該非變體 DRE，其中該 nvDRE 可以結合到包含半位點 A（half-site A，HSA）、間隔子 （Spacer）和半位點 B（half-site B，HSB） 的第一目標位點，其中各表現載體包括：(i) 第一區域，其包含編碼多種 vDRE 之一的核苷酸序列，該核苷酸序列與表現控制序列可操作地連接；(ii) 第二區域，其包含核苷酸序列，該核苷酸序列從 5’ 至 3’方向包括第一目標位點、長度至少為 1 個核苷酸的插入核苷酸序列（insert nucleotide sequence，INS）和第二目標位點，其中該第一及第二目標位點各自都包含 HSA、變體間隔子（variant spacer，vSpacer） 和 HSB，其中變體間隔子至少在一個核苷酸上與間隔子不同；b) 將表現載體庫引入宿主細胞；c) 在宿主細胞中表現多種 vDRE；d) 視需要地從宿主細胞中分離 DNA；以及 e) 測定 vDRE 是否對至少一個表現載體的目標位點表現出活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention pertains to a method for generating a spacer-specific DNA recombining enzyme (DRE), the method comprising the steps of: a) providing a library of expression vectors encoding a plurality of variants of a DRE (vDRE), wherein the amino acid sequences of the vDREs comprise one or more amino acid modifications in comparison to a non-variant DRE (nvDRE) from which the vDREs are derived, wherein the nvDRE binds to a first target site comprising in 5’ to 3’ direction a half-site A (HSA), a spacer (Spacer) and a half-site B (HSB), wherein each expression vector comprises: (i) a first region comprising a nucleotide sequence encoding one of the vDREs from among the plurality of vDREs operably linked to an expression control sequence, and (ii) a second region comprising a nucleotide sequence comprising in 5’ to 3’ direction a first target site, an insert nucleotide sequence (INS) of a length at least 1 nucleotide and a second target site, wherein each of the first and second target site comprises the HSA, a variant spacer (vSpacer) and the HSB, wherein the vSpacer differs by at least one nucleotide from the Spacer; b) introducing the library of expression vectors into host cells; c) expressing the plurality of vDREs in the host cells; d) optionally isolating DNA from the host cells; and e) determining whether the vDRE shows activity on the target sites of at least one expression vector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1252" publication-number="202619241">
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      <tif file="114121195.zip" no="1">
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      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力轉換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">H02M1/08</main-classification>
        <further-classification edition="200701120250701B">H02M1/44</further-classification>
        <further-classification edition="200601120250701B">H02M3/156</further-classification>
        <further-classification edition="200601120250701B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立產機系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門田充弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOTA, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田賢治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永俊祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於改善電力轉換裝置之效率，且抑制模式切換時之衝擊或不穩定動作。&lt;br/&gt;本發明之電力轉換裝置1具備：斬波器4，其具有開關元件41、42，使用該等開關元件將電池電壓V&lt;sub&gt;BAT&lt;/sub&gt;與直流鏈路電壓V&lt;sub&gt;DC&lt;/sub&gt;進行雙向轉換；逆變器5，其將直流鏈路電壓V&lt;sub&gt;DC&lt;/sub&gt;與交流電壓進行雙向轉換；及控制裝置8，其控制逆變器5與斬波器4。控制裝置8可選擇藉由使開關元件41、42進行接通、斷開動作而根據電壓指令值V&lt;sub&gt;DCref&lt;/sub&gt;控制直流鏈路電壓V&lt;sub&gt;DC&lt;/sub&gt;之SW模式、與將開關元件41設為始終接通狀態之TH模式之任一者，作為控制斬波器4之動作模式，且於使斬波器4之動作模式自SW模式轉變至TH模式時，使電壓指令值V&lt;sub&gt;DCref&lt;/sub&gt;減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電力轉換裝置</p>
        <p type="p">2:電池</p>
        <p type="p">3:交流系統</p>
        <p type="p">4:斬波器</p>
        <p type="p">5:逆變器</p>
        <p type="p">6:電容器</p>
        <p type="p">7:濾波器</p>
        <p type="p">8:控制裝置</p>
        <p type="p">9:電壓檢測器</p>
        <p type="p">21:電動勢</p>
        <p type="p">22:內部阻抗</p>
        <p type="p">41:開關元件</p>
        <p type="p">42:開關元件</p>
        <p type="p">43:電抗器</p>
        <p type="p">44:電容器</p>
        <p type="p">45:電壓檢測器</p>
        <p type="p">46:電壓檢測器</p>
        <p type="p">47:電流檢測器</p>
        <p type="p">CS&lt;sub&gt;INV&lt;/sub&gt;:控制信號</p>
        <p type="p">DS&lt;sub&gt;INV&lt;/sub&gt;:檢測信號</p>
        <p type="p">G&lt;sub&gt;1&lt;/sub&gt;:閘極電壓</p>
        <p type="p">G&lt;sub&gt;2&lt;/sub&gt;:閘極電壓</p>
        <p type="p">I&lt;sub&gt;L&lt;/sub&gt;:電抗器電流</p>
        <p type="p">V&lt;sub&gt;BAT&lt;/sub&gt;:電池電壓</p>
        <p type="p">V&lt;sub&gt;BO&lt;/sub&gt;:啟動電壓</p>
        <p type="p">V&lt;sub&gt;BR&lt;/sub&gt;:電壓降</p>
        <p type="p">V&lt;sub&gt;DC&lt;/sub&gt;:直流鏈路電壓</p>
        <p type="p">V&lt;sub&gt;R&lt;/sub&gt;:交流電壓</p>
        <p type="p">V&lt;sub&gt;S&lt;/sub&gt;:交流電壓</p>
        <p type="p">V&lt;sub&gt;T&lt;/sub&gt;:交流電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1253" publication-number="202617865">
    <tif-files tif-type="multi-tif">
      <tif file="114121239.zip" no="1">
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      <volno>24</volno>
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          <doc-number>202617865</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水溶性薄膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08L29/04</main-classification>
        <further-classification edition="200601120260119B">C07C31/22</further-classification>
        <further-classification edition="200601120260119B">C07C247/00</further-classification>
        <further-classification edition="200601120260119B">C08L3/00</further-classification>
        <further-classification edition="200601120260119B">C08L5/00</further-classification>
        <further-classification edition="200601120260119B">C08J5/18</further-classification>
        <further-classification edition="200601120260119B">B65D65/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帆玉葵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODAMA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤友彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種水溶性薄膜，其係包含多醣類、塑化劑A、及塑化劑B之水溶性薄膜，其中前述塑化劑A係玻璃轉移溫度(Tg)為-30℃以下，前述塑化劑B係玻璃轉移溫度(Tg)為0℃以上，前述塑化劑A及塑化劑B的合計含量相對於前述水溶性薄膜的質量而言超過20質量%且為90質量%以下，聚乙烯醇系樹脂的含量相對於前述水溶性薄膜的質量而言小於30質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1254" publication-number="202618687">
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      <tif file="114121244.zip" no="1">
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        <document-id>
          <doc-number>202618687</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理裝置、影像處理器及影像處理方法</chinese-title>
        <english-title>IMAGE PROCESSING DEVICE, IMAGE PROCESSOR AND IMAGE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250701B">G06T3/40</main-classification>
        <further-classification edition="202401120250701B">G06T5/90</further-classification>
        <further-classification edition="200601120250701B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張奇珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHI JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宛柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WAN JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊昇儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔文俠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, WEN-HSIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像處理方法，包含：透過影像處理器，接收初始影像；根據區域參數及初始影像，設定第一核心影像及第一週邊影像，其中區域參數用以指示第一核心影像的大小；以及分別調整第一核心影像及第一週邊影像的大小，以產生第二核心影像及第二週邊影像，其中第一核心影像及第一週邊影像的調整比例不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing method comprises: receiving an initial image by an image processor; setting a first core image and a first peripheral image according to a regional parameter and the initial image, wherein the region parameter is configured to indicate the size of the first core image; and adjusting the size of the first core image and the first peripheral image respectively to generate a second core image and a second peripheral image, wherein the adjustment ratios of the first core image and the first peripheral image are different.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:影像處理器</p>
        <p type="p">111:運算電路</p>
        <p type="p">111A:非線性縮放模組</p>
        <p type="p">112:記憶體</p>
        <p type="p">HD:主機裝置</p>
        <p type="p">Img1A:初始影像</p>
        <p type="p">Img1B:調整影像</p>
        <p type="p">Img2:輸出影像</p>
        <p type="p">Sadj:調整訊號</p>
        <p type="p">Sed:裝置資訊訊號</p>
        <p type="p">Sosd:設定訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1255" publication-number="202618071">
    <tif-files tif-type="multi-tif">
      <tif file="114121251.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121251</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於一平面工件之濕式處理的設備、用於該設備之一單元的裝置及操作該設備之方法</chinese-title>
        <english-title>APPARATUS FOR WET PROCESSING OF A PLANAR WORKPIECE, DEVICE FOR A CELL OF THE APPARATUS AND METHOD OF OPERATING THE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">C25D5/08</main-classification>
        <further-classification edition="200601120260125B">C25D7/12</further-classification>
        <further-classification edition="200601120260125B">C25D17/06</further-classification>
        <further-classification edition="200601120260125B">H01L21/67</further-classification>
        <further-classification edition="200601120260125B">H05K3/06</further-classification>
        <further-classification edition="200601120260125B">B08B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商德國艾托特克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATOTECH DEUTSCHLAND GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫諾　菲德納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIENER, FERDINAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫茲　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNZE, HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席勒　布瑞塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHELLER, BRITTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於一平面工件之濕式處理之一設備之一單元的裝置，其包括一結構，該結構包括第一及第二壁(13a、13b)。該工件可在一中心平面(4)中在一第一方向(&lt;i&gt;y&lt;/i&gt;)上移動通過該第一壁與該第二壁(13a、13b)之間之一空間(3)。用於將加壓液體引入該第一壁與該第二壁(13a、13b)之間之孔隙(27)提供於該中心平面(4)之相對側上且面向該中心平面(4)。該等孔隙(27)在該第一方向(&lt;i&gt;y&lt;/i&gt;)及橫向於該第一方向(&lt;i&gt;y&lt;/i&gt;)之一第二方向(&lt;i&gt;x&lt;/i&gt;)上分佈。用於使該液體離開該空間(3)之排放開口(28a、28b)沿著該空間(3)在該第一方向(&lt;i&gt;y&lt;/i&gt;)上之一幅度界定於在該第二方向(&lt;i&gt;x&lt;/i&gt;)上所見之相對側上。該等第一及第二壁(13a、13b)形成對來自該空間之在垂直於該中心平面(4)之一方向(&lt;i&gt;z&lt;/i&gt;)上的液體流之阻隔。穿過該等壁(13a、13b)提供通道(23a、23b、24a、24b)，各通道(23a、23b、24a、24b)經配置以將液體傳導至該等孔隙(27)之一各自者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for a cell of an apparatus for wet processing of a planar workpiece, comprises a structure comprising first and second walls (13a,b). The workpiece is movable in a central plane (4) through a space (3) between the first and second walls (13a,b) in a first direction (&lt;i&gt;y&lt;/i&gt;). Apertures (27) for introducing pressurised liquid between the first and second walls (13a,b) are provided on opposite sides of the central plane (4) and facing the central plane (4). The apertures (27) are distributed in the first direction (&lt;i&gt;y&lt;/i&gt;) and in a second direction (&lt;i&gt;x&lt;/i&gt;) transverse to the first direction (&lt;i&gt;y&lt;/i&gt;). Discharge openings (28a,b) for the liquid to leave the space (3) are defined on opposite sides, seen in the second direction (&lt;i&gt;x&lt;/i&gt;), along an extent of the space (3) in the first direction (&lt;i&gt;y&lt;/i&gt;). The first and second walls (13a,b) form barriers to liquid flow from the space in a direction (&lt;i&gt;z&lt;/i&gt;) perpendicular to the central plane (4). Channels (23a,b, 24a,b) are provided through the walls (13a,b), each channel (23a,b, 24a,b) arranged to conduct liquid to a respective one of the apertures (27).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:裝置</p>
        <p type="p">2a,2b:液體分配裝置</p>
        <p type="p">3:空間</p>
        <p type="p">7:輸送裝置</p>
        <p type="p">8:夾鉗</p>
        <p type="p">9:驅動器</p>
        <p type="p">10a,10b:液體入口</p>
        <p type="p">11a,11b:液體供應導管</p>
        <p type="p">12a,12b:腔室</p>
        <p type="p">16a,16b:內壁/阻隔</p>
        <p type="p">17a,17b:液體分配空間</p>
        <p type="p">18c:腔室中之間隙</p>
        <p type="p">18f:腔室中之間隙</p>
        <p type="p">19a,19b:腔室側壁</p>
        <p type="p">20a,20b:發散液體導管</p>
        <p type="p">21b:導流板</p>
        <p type="p">28a,28b:排放開口/間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1256" publication-number="202617934">
    <tif-files tif-type="multi-tif">
      <tif file="114121265.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用鹵化反應之鎢的濕式原子層蝕刻的方法</chinese-title>
        <english-title>METHODS FOR WET ATOMIC LAYER ETCHING OF TUNGSTEN USING HALOGENATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K13/00</main-classification>
        <further-classification edition="200601120260202B">C23F1/16</further-classification>
        <further-classification edition="200601120260202B">C23F1/26</further-classification>
        <further-classification edition="200601120260202B">H01L21/3213</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大漢　圖拉西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAHAL, TULASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿貝爾　凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABEL, KATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在濕式ALE製程中蝕刻鎢的各種方法的實施例係予以提供。本文所揭露的方法係使用多種濕式蝕刻化學物質來：(a) 在濕式ALE製程的表面改質步驟中，對鎢表面進行鹵化並形成自限性鹵化鎢鈍化層；以及 (b) 在濕式ALE製程的溶解步驟中，選擇性地去除鹵化鎢鈍化層。在本文所揭露的實施例中，使用含有溶解在非水溶劑中的鹵化劑的表面改質溶液來形成自限性鹵化鎢鈍化層，該鈍化層在水性溶解溶液中透過反應性溶解/水解選擇性地去除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of methods are provided for etching tungsten in a wet ALE process. The methods disclosed herein use a wide variety of wet etch chemistries to: (a) halogenate a tungsten surface and form a self-limiting, tungsten halide passivation layer in a surface modification step of the wet ALE process, and (b) selectively remove the tungsten halide passivation layer in a dissolution step of the wet ALE process. In the embodiments disclosed herein, a surface modification solution containing a halogenation agent dissolved in non-aqueous solvent is used to form a self-limiting, tungsten halide passivation layer, which is selectively removed in an aqueous dissolution solution via reactive dissolution/hydrolysis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:表面改質步驟</p>
        <p type="p">205:鎢層</p>
        <p type="p">210:介電材料</p>
        <p type="p">215:表面改質溶液</p>
        <p type="p">220:鹵化劑</p>
        <p type="p">225:鹵化鎢鈍化層</p>
        <p type="p">230:第一清洗步驟</p>
        <p type="p">235:第一清洗溶液</p>
        <p type="p">240:溶解步驟</p>
        <p type="p">245:溶解溶液</p>
        <p type="p">250:第二清洗步驟</p>
        <p type="p">255:第二清洗溶液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1257" publication-number="202618714">
    <tif-files tif-type="multi-tif">
      <tif file="114121275.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙張處理裝置</chinese-title>
        <english-title>PAPER SHEET PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G07D9/00</main-classification>
        <further-classification edition="201901120260127B">G07D11/50</further-classification>
        <further-classification edition="200601120260127B">G07D13/00</further-classification>
        <further-classification edition="200601120260127B">B65H5/28</further-classification>
        <further-classification edition="200601120260127B">B65H29/00</further-classification>
        <further-classification edition="200601120260127B">B65H33/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井澤伸也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野智範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊尾瀨晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IOSE, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市南倫之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIMINAMI, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻見涉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAMI, SHORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原悠紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係在於提供一種紙張處理裝置，其為能夠隨著情況而定來選擇性地提高便利性或提高第1收納部的安全性。本發明有關的紙張處理裝置1具備：形成有連通口101a之箱體100、配置在前述箱體的外部之出入處理部200、能夠選擇性地配置在前述箱體的外部與前述箱體的內部之至少1個第1收納部500、600、配置在前述箱體的內部之第2收納部700、從前述出入處理部的內部起通過前述第1收納部的內部及前述連通口延伸到前述第2收納部的內部為止之輸送通路RO。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a paper sheet processing device that can select between increasing convenience and increasing the security of the first storage unit depending on the situation. The paper sheet processing device 1 of the present invention comprises a box body 100 in which a communication port 101a is formed, an input/output processing unit 200 arranged outside the box body, at least one first storage unit 500, 600 that can be selectively arranged outside the box body or inside the box body, a second storage unit 700 arranged inside the box body, and a transport path RO extending from the inside of the input/output processing unit through the inside of the first storage unit and the communication port to the inside of the second storage unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紙張處理裝置</p>
        <p type="p">100:金庫(箱體)</p>
        <p type="p">101:本體</p>
        <p type="p">101a:連通口</p>
        <p type="p">102:前門</p>
        <p type="p">200:出入處理裝置(出入處理部)</p>
        <p type="p">201:插入口</p>
        <p type="p">202:排出口</p>
        <p type="p">203:輸送機構(第1輸送部)</p>
        <p type="p">204:定心部</p>
        <p type="p">205:辨識部</p>
        <p type="p">206:暫時保留部</p>
        <p type="p">207:排出集積部</p>
        <p type="p">208:忘記取出紙張收納部</p>
        <p type="p">300:外側支撐部</p>
        <p type="p">400:內側支撐部</p>
        <p type="p">500:補充裝置(第1收納部)</p>
        <p type="p">501:給紙盤</p>
        <p type="p">502:輸送機構(第2輸送部)</p>
        <p type="p">600:迴流式收納裝置(第1收納部)</p>
        <p type="p">601:第1鼓輪部</p>
        <p type="p">602:第2鼓輪部</p>
        <p type="p">603:輸送機構(第2輸送部)</p>
        <p type="p">700:回收箱(第2收納部)</p>
        <p type="p">800:中繼構件(中繼部)</p>
        <p type="p">AW:頂壁部</p>
        <p type="p">BW:底壁部</p>
        <p type="p">CW:後壁部</p>
        <p type="p">EW:右壁部</p>
        <p type="p">RO:輸送通路</p>
        <p type="p">RO1:第1輸送通路</p>
        <p type="p">RO2:第2輸送通路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1258" publication-number="202618715">
    <tif-files tif-type="multi-tif">
      <tif file="114121276.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618715</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙張處理裝置、紙張處理方法、及、程式</chinese-title>
        <english-title>PAPER SHEET PROCESSING DEVICE, PAPER SHEET PROCESSING METHOD, AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G07D9/00</main-classification>
        <further-classification edition="201901120260127B">G07D11/50</further-classification>
        <further-classification edition="201601120260127B">G07D7/00</further-classification>
        <further-classification edition="200601120260127B">B65H5/28</further-classification>
        <further-classification edition="200601120260127B">B65H29/51</further-classification>
        <further-classification edition="200601120260127B">B65H33/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井澤伸也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野智範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊尾瀨晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IOSE, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市南倫之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIMINAMI, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻見涉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAMI, SHORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原悠紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題是實現一種紙張處理裝置，其為在由複數個單元所構成的紙張處理裝置中，於錯誤發生時，能夠高精度地偵測紙張的位置。在𧦡紙張處理裝置中，被設置於搬運路之各個搬運路感測器分別顯示的紙張之通過狀況的資料（日誌資料）為由記憶部所記憶保持著，例如，在錯誤發生時（異常狀態被偵測的情況），能夠藉由鑑別動作模式、鑑別已鑑別的動作模式中之搬運路徑、解析存在於鑑別的搬運路徑之搬運路感測器的日誌資料，而高精度地偵測紙張（例如，紙幣）的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present application is to provide a paper sheet processing device comprising a plurality of units, which is a paper sheet processing device that is capable of detecting the position of a paper sheet with high accuracy when an error occurs. In the paper sheet processing device, data (log data) indicating the passing status of paper sheets is stored in a memory unit for each transport path sensor installed on the transport path. Therefore, for example, when an error occurs (when an abnormal condition is detected), the operating mode is identified, the transport path in the identified operating mode is identified, and the log data of the transport path sensors present on the identified transport path is analyzed, thereby making it possible to detect the position of paper sheets (e.g., banknotes) with high accuracy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紙幣入出鈔處理部</p>
        <p type="p">2:搬運路連接部</p>
        <p type="p">3:收納處理部</p>
        <p type="p">31-1:第1迴流式收納部</p>
        <p type="p">31-N:第N迴流式收納部</p>
        <p type="p">32:收納部</p>
        <p type="p">100:紙幣處理裝置(紙張處理裝置)</p>
        <p type="p">Psr1:控制部</p>
        <p type="p">G_c_snsr:搬運路感測器群</p>
        <p type="p">G_anm_snsr:異常偵測感測器群</p>
        <p type="p">Mem1:記憶部</p>
        <p type="p">IF1:通訊介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1259" publication-number="202618716">
    <tif-files tif-type="multi-tif">
      <tif file="114121277.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
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          <doc-number>202618716</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙張處理裝置</chinese-title>
        <english-title>PAPER SHEET PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G07D9/00</main-classification>
        <further-classification edition="201901120260127B">G07D11/50</further-classification>
        <further-classification edition="200601120260127B">G07F19/00</further-classification>
        <further-classification edition="200601120260127B">B65H29/00</further-classification>
        <further-classification edition="200601120260127B">B65H31/00</further-classification>
        <further-classification edition="200601120260127B">B65H33/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井澤伸也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野智範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊尾瀨晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IOSE, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市南倫之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIMINAMI, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻見涉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAMI, SHORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原悠紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係在於提供一種能夠盡可能地提高便利性的紙張處理裝置。本發明有關的紙張處理裝置1為具備：形成有連通口101a之箱體100、被配置於前述箱體的外部且用於暫時保留之紙張的暫時保留部206、用於搬運在前述暫時保留部所保留之前述紙張的第1搬運部203、被配置於前述箱體之內部且用於收納經由前述第1搬運部透過前述連通口的搬運之前述紙張的收納部600、700。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a paper sheet processing device that can increase convenience as much as possible. The paper sheet processing device 1 according to the present invention comprises a box 100 having a communication opening 101a, a temporary storage unit 206 arranged outside the box for temporarily storing paper sheets, a first transport unit 203 for transporting the paper sheets stored in the temporary storage unit, and storage units 600 and 700 arranged inside the box for storing the paper sheets transported by the first transport unit through the communication opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紙張處理裝置</p>
        <p type="p">100:金庫(箱體)</p>
        <p type="p">101:本體</p>
        <p type="p">101a:連通口</p>
        <p type="p">102:前門</p>
        <p type="p">200:輸入輸出處理裝置</p>
        <p type="p">201:插入口</p>
        <p type="p">202:排出口</p>
        <p type="p">203:搬運機構(第1搬運部)</p>
        <p type="p">204:定心部</p>
        <p type="p">205:識別部</p>
        <p type="p">206:暫時保留部</p>
        <p type="p">207:排出積累部</p>
        <p type="p">208:忘取紙張收納部</p>
        <p type="p">300:外側支撐部</p>
        <p type="p">400:內側支撐部</p>
        <p type="p">500:補充裝置</p>
        <p type="p">501:供紙盤</p>
        <p type="p">502:搬運機構</p>
        <p type="p">600:迴流式收納裝置(收納部)</p>
        <p type="p">601:第1鼓輪部</p>
        <p type="p">602:第2鼓輪部</p>
        <p type="p">603:搬運機構(第2搬運部)</p>
        <p type="p">700:回收箱(收納部)</p>
        <p type="p">800:中繼構件(中繼部)</p>
        <p type="p">AW:頂壁部</p>
        <p type="p">CW:後壁部</p>
        <p type="p">EW:右壁部</p>
        <p type="p">RO:搬運路</p>
        <p type="p">RO1:第1搬運路</p>
        <p type="p">RO2:第2搬運路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1260" publication-number="202618035">
    <tif-files tif-type="multi-tif">
      <tif file="114121288.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618035</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成具有減少的基板背側損傷的高密度碳膜的方法</chinese-title>
        <english-title>METHOD FOR FORMING HIGH DENSITY CARBON FILMS WITH REDUCED SUBSTRATE BACKSIDE DAMAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C23C16/26</main-classification>
        <further-classification edition="200601120260123B">C23C16/455</further-classification>
        <further-classification edition="200601120260123B">C23C16/509</further-classification>
        <further-classification edition="200601120260123B">C23C16/52</further-classification>
        <further-classification edition="200601120260123B">C23C16/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾卡納亞卡　提里尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EKANAYAKA, THILINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃銳贇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, RUIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘古德　阿布希吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANGUDE, ABHIJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　新海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XINHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在實施例中，提供了一種用於處理基板的方法。該方法包括使包含碳氫化合物前驅物氣體的處理氣體流入處理腔室的處理容積；加熱並將基板支撐件維持在低於約450℃的處理溫度下；施加雙射頻（RF）功率以產生沉積電漿供沉積碳膜至基板上；及進行退火製程來退火沉積於基板上的碳膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an embodiment, a method for processing a substrate is provided. The method includes flowing a processing gas comprising a hydrocarbon precursor gas into a processing volume of a process chamber, heating and maintaining the substrate support at a processing temperature of less than about 450℃, applying a dual radio frequency (RF) power to generate a deposition plasma for depositing a carbon film on the substrate, and performing an annealing process to anneal the carbon film deposited on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室</p>
        <p type="p">102:腔室主體</p>
        <p type="p">104:支撐件/支撐構件</p>
        <p type="p">106:面板</p>
        <p type="p">107:蓋組件</p>
        <p type="p">110:隔離器</p>
        <p type="p">114:導管</p>
        <p type="p">116:氣體混合區</p>
        <p type="p">118,126:開口</p>
        <p type="p">120:處理容積</p>
        <p type="p">127:匹配器</p>
        <p type="p">128:加熱元件</p>
        <p type="p">129:偏壓電極</p>
        <p type="p">130:RF棒</p>
        <p type="p">132:RF電源</p>
        <p type="p">133:加熱電源</p>
        <p type="p">140:擋板</p>
        <p type="p">142:表面</p>
        <p type="p">143:軸件</p>
        <p type="p">148:氣源</p>
        <p type="p">149:質量流量控制器</p>
        <p type="p">150:遠端電漿源</p>
        <p type="p">152:排放裝置</p>
        <p type="p">154:基板</p>
        <p type="p">160:電漿</p>
        <p type="p">162:控制器</p>
        <p type="p">164:處理器</p>
        <p type="p">166:記憶體</p>
        <p type="p">168:支援電路</p>
        <p type="p">D1,D2:尺寸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1261" publication-number="202618855">
    <tif-files tif-type="multi-tif">
      <tif file="114121407.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121407</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以降低離子傾斜及電漿非均勻性之具有分拆頂電極的混合式電漿腔室</chinese-title>
        <english-title>HYBRID PLASMA CHAMBER WITH SPLIT TOP ELECTRODE TO REDUCE ION TILTING AND PLASMA NON-UNIFORMITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01J37/32</main-classification>
        <further-classification edition="200601120260119B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏　朱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOEB, JULINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派特森　亞歷山大　米勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATERSON, ALEXANDER MILLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於產生電漿之系統。系統包含電漿腔室，配置用於產生電漿，其中電漿腔室包含下電極，下電極位於在垂直方向上具有中心軸的靜電夾盤（ESC）內。系統包含分拆頂電極，配置於下電極以上，其中分拆頂電極包含主電極以及外電極，外電極在參考中心軸之水平方向上圍繞主電極。系統包含介電質，分隔主電極與外電極。系統包含至少一變壓器耦合電漿（TCP）線圈，垂直地配置於分拆頂電極上方。系統包含在水平方向上圍繞下電極與ESC之邊緣環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for generating plasma. The system including a plasma chamber configured for generating plasma, wherein the plasma chamber includes a lower electrode located within an electrostatic chuck (ESC) having a central axis in a vertical direction. The system including a split top electrode disposed above the lower electrode, wherein the split top electrode includes a main electrode and an outer electrode surrounding the main electrode in a horizontal direction referenced to the central axis. The system including a dielectric separating the main electrode and the outer electrode. The system including at least one transformer coupled plasma (TCP) coil vertically disposed over the split top electrode. The system including an edge ring surrounding the lower electrode and ESC in the horizontal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿處理系統</p>
        <p type="p">101A:頂電極</p>
        <p type="p">102:電漿處理腔室</p>
        <p type="p">114:氣體源</p>
        <p type="p">116:控制器</p>
        <p type="p">118:靜電夾盤(ESC)</p>
        <p type="p">120:基板</p>
        <p type="p">122:下電極</p>
        <p type="p">123:外電極</p>
        <p type="p">124:主電極</p>
        <p type="p">125:介電質</p>
        <p type="p">126:邊緣環</p>
        <p type="p">127:耦合環</p>
        <p type="p">130:電漿</p>
        <p type="p">150:偏壓功率源</p>
        <p type="p">160:射頻(RF)功率產生器</p>
        <p type="p">161:射頻(RF)功率產生器</p>
        <p type="p">165:匹配電路</p>
        <p type="p">166:匹配電路</p>
        <p type="p">170:重點部分</p>
        <p type="p">175:中心軸</p>
        <p type="p">181:TES功率源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1262" publication-number="202617676">
    <tif-files tif-type="multi-tif">
      <tif file="114121414.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機膜形成用苯磺酸鹽化合物、有機膜形成用組成物、有機膜形成方法、圖案形成方法</chinese-title>
        <english-title>BENZENESULFONIC ACID SALT COMPOUND FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C211/63</main-classification>
        <further-classification edition="200601120260202B">C07C309/31</further-classification>
        <further-classification edition="200601120260202B">C07C309/39</further-classification>
        <further-classification edition="200601120260202B">C07D213/20</further-classification>
        <further-classification edition="200601120260202B">C07F9/50</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/09</further-classification>
        <further-classification edition="200601120260202B">G03F7/11</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤村昂志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAMURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三井亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供可形成使用作為多層阻劑用之有機下層膜時塗佈缺陷、成膜性、填埋性結果等塗佈性優良的膜，且作為光阻劑材料亦為有用的使用了不屬於全氟烷基化合物(PFAS)之苯磺酸鹽的有機膜形成用組成物、使用其之圖案形成方法、及適用於其之化合物。  &lt;br/&gt;該課題之解決手段為一種有機膜形成用組成物，其特徵為含有：  &lt;br/&gt;有機膜形成用樹脂及/或化合物(A)，  &lt;br/&gt;以下式(1)表示，且該式(1)中之陰離子部分的分子量為200以上，而且不含全氟烷基之苯磺酸鹽化合物(B)，及  &lt;br/&gt;溶劑(C)。  &lt;br/&gt;&lt;img align="absmiddle" height="35px" width="56px" file="ed10109.JPG" alt="ed10109.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="255px" width="651px" file="ed10110.JPG" alt="ed10110.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sub&gt;1&lt;/sub&gt;表示也可具有不包含全氟烷基之取代基的直鏈狀、環狀或分支狀之碳數1~20之烷基、烯基、側氧基烷基、芳基、芳烷基、或-P(R)&lt;sub&gt;2&lt;/sub&gt;(R為碳數1~20之烷基、芳基)、或鹵素原子或硝基，n表示1~5之整數，A&lt;sup&gt;+&lt;/sup&gt;表示銨陽離子、吡啶鎓陽離子、鋶陽離子、鏻陽離子、咪唑鎓陽離子、哌啶鎓陽離子、吡咯啶鎓陽離子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a composition for forming an organic film, containing: a resin and/or compound (A) for forming an organic film; a benzenesulfonic acid salt compound (B) represented by the following formula (1), an anion moiety in the formula (1) having a molecular weight of 200 or more, and the compound (B) not containing a perfluoroalkyl group; and a solvent (C), where R&lt;sub&gt;1&lt;/sub&gt; represents a linear, cyclic, or branched, alkyl group, alkenyl group, oxoalkyl group, aryl group, or aralkyl group having 1 to 20 carbon atoms and optionally having a substituent not containing a perfluoroalkyl group, represents -P(R)&lt;sub&gt;2&lt;/sub&gt;, R being an alkyl group or aryl group having 1 to 20 carbon atoms, or represents a halogen atom or a nitro group, “n” represents an integer of 1 to 5, and A&lt;sup&gt;+&lt;/sup&gt; represents an ammonium cation, a pyridinium cation, a sulfonium cation, a phosphonium cation, an imidazolium cation, a piperidinium cation, or a pyrrolidinium cation. This can provide: a composition for forming an organic film that makes it possible to form a film excellent in coating properties, such as coating defects, film-formability, and filling property results, when used as an organic underlayer film for a multilayer resist, that is also useful as a photoresist material, and that contains a benzenesulfonic acid salt that is not a perfluoroalkyl compound (PFAS); a patterning process using the composition; and a compound suitable for the composition. &lt;br/&gt;&lt;img align="absmiddle" height="118px" width="305px" file="ed10111.JPG" alt="ed10111.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:被加工層</p>
        <p type="p">2a:形成於被加工層之圖案</p>
        <p type="p">3:有機膜</p>
        <p type="p">3a:有機膜圖案</p>
        <p type="p">4:含矽之阻劑下層膜</p>
        <p type="p">4a:含矽之阻劑下層膜圖案</p>
        <p type="p">5:阻劑上層膜</p>
        <p type="p">5a:阻劑上層膜圖案</p>
        <p type="p">6:曝光部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1263" publication-number="202619395">
    <tif-files tif-type="multi-tif">
      <tif file="114121428.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境物聯網裝置及由其執行的方法</chinese-title>
        <english-title>AMBIENT INTERNET OT THINGS DEVICE AND METHOD PERFORMED THEREBY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H04W72/20</main-classification>
        <further-classification edition="200901120260123B">H04W8/22</further-classification>
        <further-classification edition="200901120260123B">H04W52/36</further-classification>
        <further-classification edition="200901120260123B">H04W74/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福亞德　亞瑟　穆罕默德　穆斯塔法　卡梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUAD, YASER MOHAMED MOSTAFA KAMAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　昱含</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YUHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩托里　菲利普　瓊　馬克　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARTORI, PHILIPPE JEAN MARC MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在環境物聯網（Internet of things，IoT）系統中執行D2R（device to reader）和R2D（reader to device）傳輸的裝置和方法。由環境IoT裝置執行的方法包括從讀取器接收控制指示以觸發D2R傳輸；識別為D2R傳輸執行的基礎重傳次數；執行D2R傳輸的初始傳輸；以及基於基礎重傳次數執行D2R傳輸的基礎重傳。D2R傳輸的基礎重傳中的連續基礎重傳基於環境IoT裝置的CW能量收集能力由時域間隔彼此分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus and methods are disclosed for performing D2R and R2D transmission in an ambient IoT system. A method performed by an ambient IoT device includes receiving, from a reader, a control indication to trigger a D2R transmission; identifying a number of base retransmissions to perform for the D2R transmission; performing an initial transmission of the D2R transmission; and performing base retransmissions of the D2R transmission based on the number of base retransmissions. Consecutive base retransmissions among the base retransmissions of the D2R transmission are separated from each other by a time domain interval based on a CW energy harvesting ability of the ambient IoT device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1301、1302、1303、1304:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1264" publication-number="202617127">
    <tif-files tif-type="multi-tif">
      <tif file="114121429.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含矽酸三鈣之覆髓材料及其製備方法</chinese-title>
        <english-title>PULP CAPPING MATERIALS CONTAINING TRICALCIUM SILICATE AND PREPARATION METHODS FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260126B">A61K6/818</main-classification>
        <further-classification edition="202001120260126B">A61K6/838</further-classification>
        <further-classification edition="202001120260126B">A61K6/853</further-classification>
        <further-classification edition="202001120260126B">A61K6/871</further-classification>
        <further-classification edition="202001120260126B">A61K6/876</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜昱至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林弘萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林勳章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSUN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳蓉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種覆髓材料，包含生物活性玻璃纖維、矽酸三鈣以及二氧化鋯。本發明之覆髓材料之初始硬化時間能下降至7分鐘。本發明之覆髓材料對細胞無明顯毒性，而且能顯著提升細胞存活率，並增強了牙髓幹細胞中的鹼性磷酸酶和牙本質唾液酸磷酸蛋白之礦化基因的表現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a pulp capping material comprising bioactive glass fibers, mesoporous tricalcium silicate, and zirconia dioxide. The initial setting time of this pulp capping material can be reduced to 7 minutes. The material exhibits no significant cytotoxicity and can significantly enhance cell viability. Additionally, it increases the expression of alkaline phosphatase and Dentin Sialophosphoprotein mineralization genes in dental pulp stem cells.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1265" publication-number="202619393">
    <tif-files tif-type="multi-tif">
      <tif file="114121468.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及相關裝置</chinese-title>
        <english-title>A COMMUNICATION METHOD AND RELATED APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H04W72/0453</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王碧釵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BICHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李雪茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XUERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種通信方法及相關裝置，有效地避免了多使用者頻分複用時使用者間的干擾。該方法包括：將N個元素映射到第二頻域資源上，生成第一信號，該第二頻域資源包括N個第二頻域單元，該N個第二頻域單元是根據M個第一頻域單元和第一參數確定的，第一參數大於0且不為1，M和N為正整數，N大於M；基於第一頻域資源發送該第一信號，該第一頻域資源包括M個第一頻域單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a communication method and a related apparatus, to effectively avoid interference between users during frequency division multiplexing of multiple users. The method includes: mapping N elements to a second frequency domain resource to generate a first signal, where the second frequency domain resource includes N second frequency domain units, and the N second frequency domain units are determined based on the M first frequency domain units and a first parameter; and the first parameter is greater than 0 and is not 1, M and N are positive integers, and N is greater than M; sending the first signal based on a first frequency domain resource, where the first frequency domain resource includes M first frequency domain units.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:通信方法</p>
        <p type="p">S501、S502:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1266" publication-number="202617193">
    <tif-files tif-type="multi-tif">
      <tif file="114121470.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>次氯酸放出裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61L9/12</main-classification>
        <further-classification edition="200601120260202B">A61L9/14</further-classification>
        <further-classification edition="200601120260202B">G01N27/06</further-classification>
        <further-classification edition="200601120260202B">G01D21/02</further-classification>
        <further-classification edition="200601320260202B">A61L101/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小原弘士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHARA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部祥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATABE, YOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]掌握次氯酸的放出量。&lt;br/&gt;  [解決手段]次氯酸放出裝置是如下次氯酸放出裝置，具備：貯存槽，貯存次氯酸水；及放出機構，將次氯酸從貯存槽放出至空間中，前述次氯酸放出裝置中，作為主控制裝置250，具備：狀態資訊取得部261，取得狀態資訊，前述狀態資訊是包含放出機構的動作狀態、空間的狀態及次氯酸水的狀態之至少一者的資訊；濃度資訊取得部262，取得濃度資訊，前述濃度資訊顯示次氯酸水的濃度；及放出量算出部263，依據濃度資訊與狀態資訊，來算出次氯酸朝空間的放出量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">230:供給裝置</p>
        <p type="p">241:搬送構件</p>
        <p type="p">242:送風機</p>
        <p type="p">250:主控制裝置</p>
        <p type="p">261:狀態資訊取得部</p>
        <p type="p">262:濃度資訊取得部</p>
        <p type="p">263:放出量算出部</p>
        <p type="p">264:量資訊取得部</p>
        <p type="p">265:減少量算出部</p>
        <p type="p">266:除臭量算出部</p>
        <p type="p">267:通知部</p>
        <p type="p">268:供給控制部</p>
        <p type="p">271:室溫感測器</p>
        <p type="p">272:濕度感測器</p>
        <p type="p">280:水位感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1267" publication-number="202617830">
    <tif-files tif-type="multi-tif">
      <tif file="114121477.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚碳酸酯系樹脂組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C08G64/30</main-classification>
        <further-classification edition="200601120260130B">C08G64/38</further-classification>
        <further-classification edition="200601120260130B">C08G77/18</further-classification>
        <further-classification edition="200601120260130B">C08G77/44</further-classification>
        <further-classification edition="200601120260130B">C08F2/44</further-classification>
        <further-classification edition="200601120260130B">A61K31/047</further-classification>
        <further-classification edition="200601320260130B">C10N30/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保昌浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井手田一茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDETA, KAZUSHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小草優希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGUSA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明藉由下述聚碳酸酯系樹脂組合物，提供一種製造時之消泡性能優異並且透明性優異之聚碳酸酯系樹脂組合物，上述聚碳酸酯系樹脂組合物包含聚碳酸酯-聚有機矽氧烷共聚物(A)，並且上述聚碳酸酯-聚有機矽氧烷共聚物(A)包含聚碳酸酯嵌段及含有下述通式(1)所表示之結構單元(A-1)之聚有機矽氧烷嵌段，且鈉原子、鎂原子、鉀原子、鈣原子及銫原子之合計含量未達8質量ppm。  &lt;br/&gt;&lt;img align="absmiddle" height="78px" width="190px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[通式(1)中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子、鹵素原子、碳數1～10之烷基、碳數1～10之烷氧基、碳數6～12之芳基或碳數7～22之烷基芳基]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1268" publication-number="202618305">
    <tif-files tif-type="multi-tif">
      <tif file="114121514.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在半導體產品的測試中為單獨的半導體產品提供溫度控制空間的溫度控制裝置和溫度控制系統</chinese-title>
        <english-title>TEMPERATURE CONTROL DEVICE AND TEMPERATURE CONTROL SYSTEM FOR PROVIDING TEMPERATURE CONTROL SPACE FOR INDIVIDUAL SEMICONDUCTOR PRODUCT IN TEST OF SEMICONDUCTOR PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">G01R1/44</main-classification>
        <further-classification edition="202001120250902B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＡＴＥＣＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATECO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李澤善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAEK SEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金虎男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HO NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文成哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, SUNG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔Ｓｅ　Ｉ　Ｍｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SE I MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一個實施例提供一種溫度控制系統，用於在半導體產品的測試中為單獨的半導體產品提供溫度控制空間，所述溫度控制系統包括：插入部，配置以將半導體產品裝載到具有敞開的一個表面的容納空間中；測試托盤，其上裝載有複數個插入部；測試器，配置以在安裝測試托盤的狀態下透過插入部測試半導體產品；以及溫度控制裝置，在測試托盤安裝在測試器上的狀態下與測試托盤或插入部的一個表面緊密接觸，並被配置以將容納空間與外部空間分離且控制容納空間的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided according to one embodiment of the present disclosure, a temperature control system for providing a temperature control space for an individual semiconductor product in a test of a semiconductor product includes an insert configured to load the semiconductor product into an accommodating space with open one surface, a test tray on which a plurality of the inserts are loaded, a tester configured to test the semiconductor product through the insert in a state where the test tray is mounted, and a temperature control device in close contact with one surface of the test tray or the insert in a state where the test tray is mounted on the tester and configured to separate the accommodating space from an external space and control temperature of the accommodating space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:溫度控制系統</p>
        <p type="p">100:溫度控制裝置</p>
        <p type="p">110:乾燥室</p>
        <p type="p">120:循環室</p>
        <p type="p">130:管道部</p>
        <p type="p">200:測試器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1269" publication-number="202617029">
    <tif-files tif-type="multi-tif">
      <tif file="114121522.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配備水箱的清掃機器人</chinese-title>
        <english-title>ROBOT CLEANER EQUIPPED WITH WATER TANK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A47L11/40</main-classification>
        <further-classification edition="200601120260123B">A47L11/20</further-classification>
        <further-classification edition="200601120260123B">A47L11/16</further-classification>
        <further-classification edition="200601120260123B">A47L9/28</further-classification>
        <further-classification edition="200601120260123B">A47L11/206</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KOOKHAENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳廷玩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, JUNGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁仁圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, IN GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種清掃機器人。根據本發明的一實施例，該清掃機器人可以包括：主體、水箱、水處理過濾器、以及加熱器。該加熱器可以配置以加熱已通過水處理過濾器的水。該清掃機器人可以配置為使得儲存於水箱中的水可以選擇性地通過或繞過水處理過濾器及加熱器兩者。在一般使用水清掃的情況下，該清掃機器人可以配置為使得水可以繞過水處理過濾器及加熱器，然而，在使用熱水或蒸汽清掃的情況下，可以使水通過水處理過濾器及加熱器。因此，可以減少水處理過濾器的使用頻率，同時可以有效防止水垢形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a robot cleaner. According to one embodiment of the present disclosure, a robot cleaner may include a main body, a water tank, a water treatment filter, and a heater. The heater may be configured to heat water that has passed through the water treatment filter. The robot cleaner may be configured such that water stored in the water tank may selectively pass through both the water treatment filter and the heater or bypass both the water treatment filter and the heater. The robot cleaner may be configured such that, in general water-based cleaning, the water may bypass the water treatment filter and the heater, whereas in the case of cleaning using hot water or steam, the water may pass through the water treatment filter and the heater. Accordingly, the water treatment filter may be used less frequently, while scale formation may be effectively prevented.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主體</p>
        <p type="p">107:電池</p>
        <p type="p">200:水箱</p>
        <p type="p">201:第一室</p>
        <p type="p">202:第二室</p>
        <p type="p">300:水處理過濾器</p>
        <p type="p">400:加熱器</p>
        <p type="p">510:第一流動路徑</p>
        <p type="p">520:第二流動路徑</p>
        <p type="p">610:泵、第一泵</p>
        <p type="p">620:泵、第二泵</p>
        <p type="p">700:拖布</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1270" publication-number="202618018">
    <tif-files tif-type="multi-tif">
      <tif file="114121595.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濺鍍方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C23C14/34</main-classification>
        <further-classification edition="200601120260123B">C23C14/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多田憲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, NORITOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之濺鍍方法是在令以稀有氣體充填的腔室(110)內的壓力為2Pa以上的狀態下，將Yb氧化物作為靶材材料(200)來對基板(10)進行濺鍍之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">100:濺鍍裝置</p>
        <p type="p">110:腔室</p>
        <p type="p">120:基板保持部</p>
        <p type="p">121:固定治具</p>
        <p type="p">130:靶材保持部</p>
        <p type="p">140:氣體供給部</p>
        <p type="p">151:真空泵</p>
        <p type="p">152:閥</p>
        <p type="p">160:電源</p>
        <p type="p">170:磁性電路</p>
        <p type="p">200:靶材材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1271" publication-number="202617793">
    <tif-files tif-type="multi-tif">
      <tif file="114121602.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121602</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芳基烷基改質茚組成物、硬化性樹脂材料、預浸體、樹脂薄膜、覆金屬積層板、印刷線路板、及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F12/34</main-classification>
        <further-classification edition="200601120260202B">C08J5/18</further-classification>
        <further-classification edition="200601120260202B">C08J5/24</further-classification>
        <further-classification edition="200601120260202B">B32B15/08</further-classification>
        <further-classification edition="200601120260202B">H05K1/03</further-classification>
        <further-classification edition="200601120260202B">H01L23/14</further-classification>
        <further-classification edition="200601120260202B">H01L23/29</further-classification>
        <further-classification edition="200601120260202B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHIITA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹智彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種芳基烷基改質茚組成物，其包含在茚環上具有芳基烷基的化合物之中的一分子中的芳基烷基的數目不同的複數種化合物，並且，一分子中的芳基烷基的數目為1的化合物的含量以從GPC圖表圖的面積比例算出的值計為1％以下，組成物中存在的芳基烷基的至少一個為具有含聚合性不飽和鍵的基的芳基烷基，組成物中存在的芳基烷基的至少一個為不具有含聚合性不飽和鍵的基的芳基烷基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1272" publication-number="202619572">
    <tif-files tif-type="multi-tif">
      <tif file="114121658.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直堆疊電晶體結構以及包括其之神經網路裝置</chinese-title>
        <english-title>VERTICALLY STACKED TRANSISTOR STRUCTURE AND NEURAL NETWORK DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D88/00</main-classification>
        <further-classification edition="202301120260123B">H10B43/30</further-classification>
        <further-classification edition="202301120260123B">H10B43/20</further-classification>
        <further-classification edition="202301120260123B">H10B51/30</further-classification>
        <further-classification edition="202301120260123B">H10B51/20</further-classification>
        <further-classification edition="202301120260123B">G06N3/065</further-classification>
        <further-classification edition="202301120260123B">G06N3/0464</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DEOKHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金在名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEMYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JEONGGEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庸敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONGKYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供了一種垂直堆疊電晶體結構及一種包含其之神經網路裝置。該垂直堆疊電晶體結構可包括一第一電晶體及一第二電晶體，該第二電晶體在一第一方向上位於該第一電晶體上。該第一電晶體可包括一第一通道、一第一源極區、一第一汲極區、一第一閘極絕緣層及一第一閘極電極。該第二電晶體可包括一第二通道、一第二源極區、一第二汲極區、一第二閘極絕緣層及一第二閘極電極。該第一閘極絕緣層及該第二閘極絕緣層中之一者可包括一順電材料。該第一閘極絕緣層及該第二閘極絕緣層中之另一者可包括一資料記錄材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a vertically stacked transistor structure and a neural network device comprising the same. The vertically stacked transistor structure may include a first transistor and a second transistor on the first transistor in a first direction. The first transistor may include a first channel, a first source region, a first drain region, a first gate insulating layer, and a first gate electrode. The second transistor may include a second channel, a second source region, a second drain region, a second gate insulating layer, and a second gate electrode. One of the first gate insulating layer and the second gate insulating layer may include a paraelectric material. The other one of the first gate insulating layer and the second gate insulating layer may include a data recording material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:突觸裝置</p>
        <p type="p">111:基體</p>
        <p type="p">112:絕緣層</p>
        <p type="p">113:間隔體</p>
        <p type="p">121,131:通道</p>
        <p type="p">122,132:源極區</p>
        <p type="p">123,133:汲極區</p>
        <p type="p">124,134:閘極絕緣層</p>
        <p type="p">125,135:閘極電極</p>
        <p type="p">mTR:記憶體電晶體</p>
        <p type="p">sTR:選擇電晶體</p>
        <p type="p">Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1273" publication-number="202619042">
    <tif-files tif-type="multi-tif">
      <tif file="114121661.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機聚合物基體上的驅動器晶片</chinese-title>
        <english-title>DRIVER CHIP ON ORGANIC POLYMER SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/00</main-classification>
        <further-classification edition="200601120260123B">G02F1/1345</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商弗萊克英納寶技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEXENABLE TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞維斯　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REEVES, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種裝置，其包含：一有機聚合物支撐基體，其支撐至少一個金屬軌道且支撐電氣連接至該至少一個金屬軌道之一驅動器晶片，該支撐基體亦支撐一或多個圖案化層，該一或多個圖案化層至少在該驅動器晶片與該支撐基體之間界定一襯墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is disclosed a device comprising: an organic polymer support substrate supporting at least one metal track and supporting a driver chip electrically connected to the at least one metal track, the support substrate also supporting one or more patterned layers at least defining a pad between the driver chip and the support substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:支撐基體</p>
        <p type="p">12:驅動器晶片</p>
        <p type="p">16:導體凸塊</p>
        <p type="p">18:導電黏著劑</p>
        <p type="p">22:金屬軌道</p>
        <p type="p">26:間隔物材料襯墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1274" publication-number="202619236">
    <tif-files tif-type="multi-tif">
      <tif file="114121666.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達用芯構件的製造方法及定子的製造方法</chinese-title>
        <english-title>MOTOR CORE COMPONENT MANUFACTURING METHOD AND STATOR MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H02K15/022</main-classification>
        <further-classification edition="200601120260123B">H02K15/095</further-classification>
        <further-classification edition="202501120260123B">H02K15/0273</further-classification>
        <further-classification edition="202501120260123B">H02K15/0275</further-classification>
        <further-classification edition="202501120260123B">H02K15/0278</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＨＴ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀健人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, KENTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笠谷和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASATANI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森一左</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, KAZUSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種馬達用芯構件的製造方法及定子的製造方法，可提高以大致U字形的芯構件排列成圓環狀而製作的馬達用芯的線圈占積率。本發明的馬達用芯構件的製造方法係包含：電磁鋼板準備步驟，係準備複數片長度經調整為在彎曲之後前端會成為平坦狀態的電磁鋼板35(35a)；層積步驟，係將前述電磁鋼板依長度的順序層積為使中央部對齊為直線狀；熔接步驟，係於重疊的前述電磁鋼板的前述中央部沿著厚度方向形成熔接部34，而獲得將前述電磁鋼板一體化的芯塊36；彎曲步驟，係將前述芯塊朝向最短的電磁鋼板的一側彎曲成大致U字形；及熱處理步驟，係將前述芯塊以維持於彎曲的狀態進行退火。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a motor core component manufacturing method and a stator manufacturing method that can increase coil space factor of motor cores fabricated by arranging approximately U-shaped core components in a circular pattern. The motor core component manufacturing method according to the present invention includes: an electromagnetic steel sheet preparation step in which a plurality of electromagnetic steel sheets 35 (35a) are prepared, each adjusted in length so that their tips become flat after bending; a stacking step in which the electromagnetic steel sheets are stacked lengthwise so that their central portions are linear; a welding step in which the central portions of the stacked electromagnetic steel sheets are welded 34 in thickness direction to produce a core block 36 integrating the electromagnetic steel sheets; a bending step in which the core block is bent into an approximately U-shape toward the shortest electromagnetic steel sheet; and a heat treatment step in which the core block is annealed while being bent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:定子</p>
        <p type="p">12:定子芯</p>
        <p type="p">30,30a,30b,30c,30d,30e,30f,30g,30h,30i,30j,30k,30l:芯構件</p>
        <p type="p">31:周面部</p>
        <p type="p">32a,32b:腳部</p>
        <p type="p">33:前端</p>
        <p type="p">60,60a,60b,60c,60d,60e,60f,60g,60h,60i,60j,60k,60l:筒狀線圈</p>
        <p type="p">61:被覆線</p>
        <p type="p">62:繞線筒</p>
        <p type="p">64a,64b:凸緣部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1275" publication-number="202617956">
    <tif-files tif-type="multi-tif">
      <tif file="114121678.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121678</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清洗機用清洗劑組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C11D1/835</main-classification>
        <further-classification edition="200601120260202B">C11D1/38</further-classification>
        <further-classification edition="200601120260202B">C11D1/72</further-classification>
        <further-classification edition="200601120260202B">C11D1/722</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田真里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, MARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村卓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之清洗機用清洗劑組合物含有(a)下述通式(a1)表示之非離子界面活性劑、(b)陽離子界面活性劑、及(c)鹼劑。  &lt;br/&gt;R&lt;sup&gt;1a&lt;/sup&gt;-O-(EO)&lt;sub&gt;a&lt;/sub&gt;(AO)&lt;sub&gt;b&lt;/sub&gt;-H           (a1)  &lt;br/&gt;[式中，R&lt;sup&gt;1a&lt;/sup&gt;為碳數8以上18以下之烴基，R&lt;sup&gt;1a&lt;/sup&gt;-O-之與氧原子鍵結之R&lt;sup&gt;1a&lt;/sup&gt;之碳原子為二級碳原子，EO為伸乙氧基，AO為伸丙氧基或伸丁氧基，EO與AO可以嵌段鍵結或無規之方式加成，EO或AO之任一者均可先加成；a、b為平均加成莫耳數，分別獨立地為1以上50以下之數]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1276" publication-number="202617875">
    <tif-files tif-type="multi-tif">
      <tif file="114121684.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物膜</chinese-title>
        <english-title>RESIN COMPOSITION FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C08L63/00</main-classification>
        <further-classification edition="200601120260129B">C08G59/22</further-classification>
        <further-classification edition="201801120260129B">C08K3/105</further-classification>
        <further-classification edition="200601120260129B">C08L33/26</further-classification>
        <further-classification edition="200601120260129B">C08K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正田勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASADA, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浜坂智美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMASAKA, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浜坂剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMASAKA, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的樹脂組成物膜包含環氧樹脂(A)、氮化鋁填充材(B)及氧化鋁填充材(C)，相對於環氧樹脂(A)100質量份，包含合計700至1400質量份的氮化鋁填充材(B)及氧化鋁填充材(C)；環氧樹脂(A)包含固體環氧樹脂及液體環氧樹脂；殘留溶劑量為3.5%以下；藉由設定應變為10%、頻率為1Hz、溫度範圍為60至180℃的動態黏彈性測定所求得的最低熔融黏度溫度位於85至130℃的範圍內、最低熔融黏度η&lt;sub&gt;10%&lt;/sub&gt;位於1000至10000泊的範圍內，以及藉由設定應變為0.1%的動態黏彈性測定所求得之於最低熔融黏度溫度的熔融黏度η&lt;sub&gt;0.1%&lt;/sub&gt;位於300000至2000000泊的範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The resin composition film of the present invention includes epoxy resin (A), aluminum nitride filler (B), and aluminum oxide filler (C), and contains a total of 700 to 1400 parts by weight of aluminum nitride filler (B) and aluminum oxide filler (C) relative to 100 parts by weight of epoxy resin (A). The epoxy resin (A) comprises solid epoxy resin and liquid epoxy resin; residual solvent content is 3.5% or less; the minimum melt viscosity temperature obtained by dynamic viscoelasticity measurement at a strain of 10%, frequency of 1 Hz, and temperature range of 60 to 180°C falls within 85 to 130°C; minimum melt viscosityη10% is within the range of 1000 to 10000 poise, and the melt viscosity η0.1% at the minimum melt viscosity temperature obtained by dynamic viscoelasticity measurement with a strain of 0.1% is within the range of 300000 to 2000000 poise.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1277" publication-number="202617396">
    <tif-files tif-type="multi-tif">
      <tif file="114121715.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無菌夾捏裝置及其操作方法</chinese-title>
        <english-title>STERILE PINCHING DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B26D7/01</main-classification>
        <further-classification edition="200601120260123B">A61B17/00</further-classification>
        <further-classification edition="200601120260123B">B01L9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>興全貿易股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CINTRADE ENTERPRISE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉育伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃芊慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, QIAN-CI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴笠豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, LI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAN, BO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">無菌夾捏裝置包括兩半元件。半元件具有基部結構、連接基部結構之第一側的第一卡扣結構以及連接基部結構之相對於第一側的第二側的第二卡扣結構。兩半元件的形狀輪廓為完全相同的，且兩半元件之其中一者用以相對於兩半元件之另一者翻轉180度，使得兩半元件之其中一者與兩半元件之另一者朝向彼此靠近以配對卡扣，且兩半元件之其中一者的基部結構與兩半元件之另一者的基部結構形成對角空間，對角空間用以容置套管以藉由兩半元件夾捏套管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無菌夾捏裝置</p>
        <p type="p">110:半元件</p>
        <p type="p">111:抵接端</p>
        <p type="p">112:基部結構</p>
        <p type="p">113:抵接槽</p>
        <p type="p">114:第一卡扣結構</p>
        <p type="p">115:凸出端</p>
        <p type="p">116:第二卡扣結構</p>
        <p type="p">1144:卡扣端件</p>
        <p type="p">1164:卡扣凹槽</p>
        <p type="p">A:對角空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1278" publication-number="202618841">
    <tif-files tif-type="multi-tif">
      <tif file="114121744.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於離子植入器之熱優化萃取板</chinese-title>
        <english-title>THERMALLY OPTIMIZED EXTRACTION PLATE FOR ION IMPLANTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01J37/08</main-classification>
        <further-classification edition="200601120260119B">H01J37/147</further-classification>
        <further-classification edition="200601120260119B">H01J37/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥勞克林　亞當　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCLAUGHLIN, ADAM M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢尼　奎格　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANEY, CRAIG R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種離子源及離子植入系統，所述離子源及離子植入系統利用萃取板在萃取開孔周圍形成溫度升高的區，所述萃取板對熱量的流動進行控制。萃取板具有與離子源中的最熱組件對應的較厚部分。該些較厚部分朝向萃取開孔延伸，以將熱量帶向萃取開孔。較厚部分可直接位於電漿產生器上方，電漿產生器可為間接加熱式陰極。此外，較厚部分亦可直接位於反射極及/或側電極上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion source and ion implantation system are disclosed that utilize an extraction plate that controls the flow of heat to create a region around the extraction aperture that has an elevated temperature. The extraction plate has thicker portions that correspond to the hottest components in the ion source. These thicker portions extend toward the extraction aperture to bring the heat toward the extraction aperture. The thicker portions may be located directly above the plasma generator, which may be an indirectly heated cathode. Further, the thicker portions may also be located directly above the repeller and/or side electrodes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:萃取板</p>
        <p type="p">310:萃取開孔</p>
        <p type="p">320:陰極熱量捕獲區</p>
        <p type="p">325:陰極熱量傳導區</p>
        <p type="p">330:反射極熱量捕獲區</p>
        <p type="p">335:反射極熱量傳導區</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1279" publication-number="202617262">
    <tif-files tif-type="multi-tif">
      <tif file="114121749.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反應裝置以及反應裝置的溫度控制方法</chinese-title>
        <english-title>REACTION APPRATUS AND METHOD FOR COTROLLING TEMPREATURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B01J19/20</main-classification>
        <further-classification edition="200601120260127B">F27B9/40</further-classification>
        <further-classification edition="200601120260127B">F27B9/36</further-classification>
        <further-classification edition="200601120260127B">F27D19/00</further-classification>
        <further-classification edition="200601120260127B">G05D23/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬尾甲太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古木賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平隼也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIRA, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原脇六四</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARAWAKI, MUTSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">反應裝置係具備缸(101)、溫度調節單元(320)、加熱器單元(360)、感測器單元(350)及控制部。加熱器單元(360)係具有：加熱器(111U)、(111D)、(111R)、(111L)，係設於缸(101)的上下左右。感測器單元(350)係具備：溫度感測器，係設於缸(101)的上下左右。溫度調節單元(320)係以溫度感測器的測定溫度成為設定溫度的方式進行回饋控制。輸出限制部係於上側的溫度感測器與下側的溫度感測器的溫度差超過臨限值溫度時限制上側的溫度調節器(321)的回饋輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:缸</p>
        <p type="p">109:驅動馬達</p>
        <p type="p">110,120,130,140:溫度控制區域</p>
        <p type="p">111D,111L,111R,111U,121D,121L,121R,121U,131D,131L,131R,131U,141D,141L,141R,141U:加熱器</p>
        <p type="p">112D,112L,112R,112U,122D,122L,122R,122U,132D,132L,132R,132U,142D,142L,</p>
        <p type="p">142R,142U:溫度感測器</p>
        <p type="p">150:溫度控制裝置</p>
        <p type="p">310:控制部</p>
        <p type="p">320:溫度調節單元</p>
        <p type="p">321:溫度調節器</p>
        <p type="p">330:輸出限制單元</p>
        <p type="p">331:輸出限制部</p>
        <p type="p">340:加熱器驅動單元</p>
        <p type="p">341:加熱器驅動部</p>
        <p type="p">350:感測器單元</p>
        <p type="p">360:加熱器單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1280" publication-number="202618486">
    <tif-files tif-type="multi-tif">
      <tif file="114121750.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>狀態判定方法以及狀態判定系統</chinese-title>
        <english-title>STATE DETERMINATION METHOD AND STATE DETERMINATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G05B23/02</main-classification>
        <further-classification edition="201901120260123B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村知玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOMOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用機器學習模型(M)，機器學習模型(M)係將能夠實測的第一變數以及不能夠實測的第二變數作為解釋變數並將能夠實測的第三變數作為反應變數。對機器學習模型(M)輸入第一變數的實測值以及正常時的第二變數並取得從機器學習模型(M)輸出的第三變數的推定值。然後，比較第三變數的推定值與實測值，藉此判定裝置的狀態。藉此，即使無法實測第二變數本身亦能判定裝置的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">M:機器學習模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1281" publication-number="202617647">
    <tif-files tif-type="multi-tif">
      <tif file="114121766.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法及鎓鹽化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C25/18</main-classification>
        <further-classification edition="200601120260202B">C07C317/14</further-classification>
        <further-classification edition="200601120260202B">C07C317/18</further-classification>
        <further-classification edition="200601120260202B">C07C317/22</further-classification>
        <further-classification edition="200601120260202B">C07C317/40</further-classification>
        <further-classification edition="200601120260202B">C07C317/44</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D317/70</further-classification>
        <further-classification edition="200601120260202B">C07D327/06</further-classification>
        <further-classification edition="200601120260202B">C07D327/10</further-classification>
        <further-classification edition="200601120260202B">C07D331/04</further-classification>
        <further-classification edition="200601120260202B">C07D333/46</further-classification>
        <further-classification edition="200601120260202B">C07D333/48</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C07D335/02</further-classification>
        <further-classification edition="200601120260202B">C07D495/10</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, NOZOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大宮拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMIYA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤紅希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, AKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部祐大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, YUDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田悠里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種於利用下一代技術來形成抗蝕劑圖案時可獲得CDU、LWR及CD裕度優異且顯影缺陷少的抗蝕劑膜的感放射線性組成物以及圖案形成方法。另外，目的在於提供一種可較佳地用於所述感放射線性組成物的鎓鹽化合物。一種感放射線性組成物，含有：聚合物（A），包含具有酸解離性基的結構單元（I）；及溶劑（E），且滿足以下條件的至少一個。（條件1）所述感放射線性組成物更含有特定式所表示的鎓鹽化合物（B）。（條件2）所述聚合物（A）更包含特定式所表示的結構單元（II）或特定式所表示的結構單元（III）。（條件3）所述感放射線性組成物更含有所述聚合物（A）以外的聚合物，該聚合物包含所述結構單元（II）或所述結構單元（III）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1282" publication-number="202617964">
    <tif-files tif-type="multi-tif">
      <tif file="114121770.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
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          <doc-number>202617964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啤酒風味飲料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12C12/00</main-classification>
        <further-classification edition="200601120260202B">C12C7/04</further-classification>
        <further-classification edition="202101120260202B">A23L2/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日啤酒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI BREWERIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川路伸吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAKAWAJI, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木繭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供：一種啤酒風味飲料，其包含麥芽及啤酒花作為原料，真實萃取物之比率為5.0%Plato以上，異α酸濃度(mg/L)相對於脯胺酸濃度(mg/L)之比為0.05以上，沉香醇濃度(μg/L)相對於異α酸濃度(mg/L)之比為0.12以上；作為醱酵啤酒風味飲料之上述所記載之啤酒風味飲料；作為濃縮型啤酒風味飲料之上述所記載之啤酒風味飲料；酒精濃度為5.0體積%以上之上述所記載之啤酒風味飲料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1283" publication-number="202618346">
    <tif-files tif-type="multi-tif">
      <tif file="114121828.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學異向性積層體及包含該積層體的圓偏光板</chinese-title>
        <english-title>OPTICALLY ANISOTROPIC LAMINATE AND CIRCULAR POLARIZER INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B5/30</main-classification>
        <further-classification edition="200601120260126B">G02F1/13363</further-classification>
        <further-classification edition="200601120260126B">G02F1/1335</further-classification>
        <further-classification edition="201901120260126B">B32B7/023</further-classification>
        <further-classification edition="200601120260126B">B32B7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部峻也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, SHUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種即使在強光之下觀察時，亦不產生混濁不均之光學異向性積層體及圓偏光板。  &lt;br/&gt;本發明之光學異向性積層體，係依序相鄰設置有：聚合性液晶化合物進行定向而成的第一液晶相位差膜、第一接著劑層及聚合性液晶化合物進行定向而成的第二液晶相位差膜，且  &lt;br/&gt;與前述第一接著劑層相接之第一液晶相位差膜面的液晶分子定向方向，以及與前述第一接著劑層相接之第二液晶相位差膜面的液晶分子定向方向所形成的夾角為0±10°，且，  &lt;br/&gt;第一液晶相位差膜及第二液晶相位差膜之厚度分別為0.1至3μm，  &lt;br/&gt;第一接著劑層之厚度為20nm以上200nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to provide an optically anisotropic laminate and a circular polarizer that do not exhibit cloudy irregularities even when viewed under strong light. &lt;br/&gt;Provided as a solution in the present invention is an optically anisotropic laminate that includes a first liquid crystal retardation film formed by aligning a polymerizable liquid crystal compound, a first adhesive layer, and a second liquid crystal retardation film formed by aligning a polymerizable liquid crystal compound, arranged adjacently in this order; wherein the angle formed by the liquid crystal molecular alignment direction of the first liquid crystal retardation film surface in contact with the first adhesive layer and the liquid crystal molecular alignment direction of the second liquid crystal retardation film surface in contact with the first adhesive layer is 0 ± 10°, the first liquid crystal retardation film and the second liquid crystal retardation film each have a thickness of 0.1 to 3 μm, and the first adhesive layer has a thickness of between 20 nm and 200 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1284" publication-number="202619422">
    <tif-files tif-type="multi-tif">
      <tif file="114121834.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05K1/09</main-classification>
        <further-classification edition="200601120260123B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉木優作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAKI, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田周作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, SHUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田真樹子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, MAKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板1具備金屬支持層2、端子41A、及第1絕緣層3。第1絕緣層3具有第1方向上之一側之第1端緣E11、及第1方向上之另一側之第2端緣E12。端子41A具有第1方向上之一側之第3端緣E13、及第1方向上之另一側之第4端緣E14。金屬支持層2具有第1方向上之一側之第5端緣E15、及第1方向上之另一側之第6端緣E16。第3端緣E13及第5端緣E15配置於第1端緣E11與第2端緣E12之間。第1端緣E11與第5端緣E15之間之距離D2與距離D1之總和為15 μm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線電路基板</p>
        <p type="p">2:金屬支持層</p>
        <p type="p">3:第1絕緣層</p>
        <p type="p">4:電路圖案</p>
        <p type="p">5:第2絕緣層</p>
        <p type="p">20:凹部</p>
        <p type="p">41A,41B:端子</p>
        <p type="p">42A,42B:配線</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:距離</p>
        <p type="p">D3:距離</p>
        <p type="p">E1:金屬支持層之一端部</p>
        <p type="p">E2:金屬支持層之另一端部</p>
        <p type="p">E11:第1端緣</p>
        <p type="p">E12:第2端緣</p>
        <p type="p">E13:第3端緣</p>
        <p type="p">E14:第4端緣</p>
        <p type="p">E15:第5端緣</p>
        <p type="p">E16:第6端緣</p>
        <p type="p">W0:寬度</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
        <p type="p">W11:寬度</p>
        <p type="p">W21:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1285" publication-number="202619416">
    <tif-files tif-type="multi-tif">
      <tif file="114121835.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05K1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中智章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高倉隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAKURA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹岡良介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAOKA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板1具備配線部3A、及支持配線部3A之一端部之支持部2A。配線部3A具有第1絕緣層12、配線133A、金屬支持層11及被覆層15。被覆層15具有被覆金屬支持層11之側面S1之第1部分151、及被覆厚度方向上之金屬支持層11之另一側之表面S2之第2部分152。第2部分152之厚度T12較第1部分151之厚度T11更厚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線電路基板</p>
        <p type="p">3A:配線部</p>
        <p type="p">3B:配線部(第2配線部)</p>
        <p type="p">11:金屬支持層</p>
        <p type="p">12:第1絕緣層</p>
        <p type="p">13:電路圖案</p>
        <p type="p">14:第2絕緣層</p>
        <p type="p">15:被覆層</p>
        <p type="p">133A,133B,133C:配線</p>
        <p type="p">151:第1部分</p>
        <p type="p">152:第2部分</p>
        <p type="p">D1,D2:間隔</p>
        <p type="p">E1:(厚度方向上之金屬支持層之)一端部</p>
        <p type="p">E2:(厚度方向上之金屬支持層之)另一端部</p>
        <p type="p">S1:(金屬支持層之)側面</p>
        <p type="p">S2:(金屬支持層之另一側之)表面</p>
        <p type="p">T1,T11,T12:厚度</p>
        <p type="p">W1,W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1286" publication-number="202618339">
    <tif-files tif-type="multi-tif">
      <tif file="114121836.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜鏡積層體及鏡構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B5/00</main-classification>
        <further-classification edition="201501120260126B">G02B1/18</further-classification>
        <further-classification edition="201501120260126B">G02B1/115</further-classification>
        <further-classification edition="200601120260126B">C08G63/183</further-classification>
        <further-classification edition="200601120260126B">C01G33/00</further-classification>
        <further-classification edition="200601120260126B">C08K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中一生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓岡岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBURAOKA, GAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上哲史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, TETSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之膜鏡積層體(1)朝向厚度方向一側依序具備基材膜(2)、金屬反射層(3)、反射調整層(4)、及撥水層(5)。反射調整層(4)具備矽氧化物層(43)，撥水層(5)配置於矽氧化物層(43)之厚度方向一面。又，於撥水層(5)之厚度方向一面，水接觸角為110°以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜鏡積層體</p>
        <p type="p">2:基材膜</p>
        <p type="p">3:金屬反射層</p>
        <p type="p">4:反射調整層</p>
        <p type="p">5:撥水層</p>
        <p type="p">21:透明樹脂膜</p>
        <p type="p">22:硬化樹脂層</p>
        <p type="p">41:低折射率層</p>
        <p type="p">42:高折射率層</p>
        <p type="p">43:矽氧化物層</p>
        <p type="p">t1:低折射率層之厚度</p>
        <p type="p">t2:高折射率層之厚度</p>
        <p type="p">t3:矽氧化物層之厚度</p>
        <p type="p">T1:金屬反射層之厚度</p>
        <p type="p">T2:反射調整層之厚度</p>
        <p type="p">T3:撥水層之厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1287" publication-number="202618359">
    <tif-files tif-type="multi-tif">
      <tif file="114121856.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及在光子區上方具有保護層的扇出中介件中整合光子積體電路的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING PIC IN FOI WITH PROTECTIVE LAYER OVER PHOTONIC REGION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02B6/13</main-classification>
        <further-classification edition="200601120260123B">H01L23/28</further-classification>
        <further-classification edition="200601120260123B">H01L23/488</further-classification>
        <further-classification edition="200601120260123B">H01L21/56</further-classification>
        <further-classification edition="200601120260123B">H01L21/60</further-classification>
        <further-classification edition="202301120260123B">H01L25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　全豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, SWAIN HONG ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　貴忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KAI CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　佩燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUA, LINDA PEI EE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其具有第一互連結構，該第一互連結構中具有開口。PIC安置於該第一互連結構上方，其中光子區與該第一互連結構中之該開口對準。至少部分地穿過該PIC形成複數個導電通孔。具有複數個導電通孔之互連組件安置於該第一互連結構上方。複數個凸塊可形成於該第一互連結構上方。第二互連結構安置於該PIC及該互連組件上方。保護層安置於該開口內處於該光子區上方。電組件安置於該第二互連結構上方。該保護層可具有形成於該PIC上方之障壁及安置於該障壁內處於該光子區上方之環氧樹脂材料。替代地，該保護層具有安置於該光子區上方之環氧樹脂材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has a first interconnect structure with an opening in the first interconnect structure. A PIC is disposed over the first interconnect structure with a photonic region aligned with the opening in the first interconnect structure. A plurality of conductive vias is formed at least partially through the PIC. An interconnect component having a plurality of conductive vias is disposed over the first interconnect structure. A plurality of bumps can be formed over the first interconnect structure. A second interconnect structure is disposed over the PIC and interconnect component. A protective layer is disposed within the opening over the photonic region. An electrical component is disposed over the second interconnect structure. The protective layer can have a dam formed over the PIC and an epoxy material disposed within the dam over the photonic region. Alternatively, the protective layer has an epoxy material disposed over the photonic region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:導電層</p>
        <p type="p">113:電路</p>
        <p type="p">114:導電膏或凸塊</p>
        <p type="p">122:基底基板材料</p>
        <p type="p">130:導電通孔</p>
        <p type="p">134:導電層</p>
        <p type="p">150:導電通孔</p>
        <p type="p">152:光子敏感區</p>
        <p type="p">156:導電層</p>
        <p type="p">157:障壁</p>
        <p type="p">158:環氧樹脂材料/環氧樹脂</p>
        <p type="p">180:互連結構</p>
        <p type="p">182:導電層</p>
        <p type="p">184:絕緣層</p>
        <p type="p">186:導電柱或基座</p>
        <p type="p">191:導電膏或凸塊</p>
        <p type="p">240:封裝膠或模製化合物</p>
        <p type="p">244:表面</p>
        <p type="p">250:互連結構</p>
        <p type="p">252:導電層</p>
        <p type="p">254:絕緣層</p>
        <p type="p">256:導電柱或基座</p>
        <p type="p">258:球或凸塊</p>
        <p type="p">262:導電柱或基座</p>
        <p type="p">270:電組件</p>
        <p type="p">274:光源</p>
        <p type="p">276:FOI封裝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1288" publication-number="202618347">
    <tif-files tif-type="multi-tif">
      <tif file="114121858.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學異向性積層體及包含該積層體的圓偏光板</chinese-title>
        <english-title>OPTICALLY ANISOTROPIC LAMINATE AND CIRCULAR POLARIZING PLATE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">G02B5/30</main-classification>
        <further-classification edition="201901120260122B">B32B7/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>源千博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMOTO, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幡中伸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種即使在強光之下觀察時，亦不產生混濁不均之光學異向性積層體及圓偏光板。  &lt;br/&gt;本發明之光學異向性積層體，係依序相鄰設置有：聚合性液晶化合物進行定向而成的第一液晶相位差膜、黏接著劑層1及聚合性液晶化合物進行定向而成的第二液晶相位差膜，且，  &lt;br/&gt;與前述黏接著劑層1相接之第一液晶相位差膜面的液晶分子定向方向，以及與前述黏接著劑層1相接之第二液晶相位差膜面的液晶分子定向方向所形成的夾角為0±10°，且，  &lt;br/&gt;第一液晶相位差膜及第二液晶相位差膜之厚度分別為0.1至3μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to provide an optically anisotropic laminate and a circular polarizing plate that do not cause cloudy unevenness even when observed under strong light. &lt;br/&gt;Provided as a solution in the present invention is an optically anisotropic laminate that includes a first liquid crystal retardation film formed by orientating a polymerizable liquid crystal compound, an adhesive layer 1, and a second liquid crystal retardation film formed by orientating a polymerizable liquid crystal compound that are arranged adjacent to each other in this order. The angle between the liquid crystal molecular orientation direction of a first liquid crystal retardation film surface in contact with the adhesive layer 1 and the liquid crystal molecular orientation direction of a second liquid crystal retardation film surface in contact with the adhesive layer 1 is 0±10°. The first liquid crystal retardation film and the second liquid crystal retardation film each have a thickness of 0.1 to 3 μm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1289" publication-number="202618924">
    <tif-files tif-type="multi-tif">
      <tif file="114121882.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法，半導體裝置的製造方法，程式及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251229B">H01L21/31</main-classification>
        <further-classification edition="200601120251229B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長橋知也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAHASHI, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是在於提供一種在包括向基板供應反應物的工序之成膜工序中，可使成膜效率提升的技術。  &lt;br/&gt;　　其解決手段是具有藉由進行預定次數包括下列工序的循環而在基板上形成膜的工序，  &lt;br/&gt;　　(a)以第一分壓來對於前述基板供應與前述基板的表面反應的第一反應物之工序；及  &lt;br/&gt;　　(b)在(a)之後，將處理空間排氣，使得存在於前述基板的前述處理空間內之藉由前述基板的表面與前述第一反應物的反應所生成的反應生成物的分壓成為第二分壓之工序，  &lt;br/&gt;　　且(a)及(b)是分別進行為：將前述第一分壓及前述第二分壓設為前述第二分壓相對於前述第一分壓的比率為預定的分壓比率以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1290" publication-number="202618057">
    <tif-files tif-type="multi-tif">
      <tif file="114121884.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>原料監視系統、處理裝置、氣體供給方法及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251211B">C23C16/52</main-classification>
        <further-classification edition="200601120251211B">G05B19/048</further-classification>
        <further-classification edition="200601120251211B">C23C16/455</further-classification>
        <further-classification edition="200601120251211B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渥美光一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATSUMI, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示，係提供一種「具有：氣體供給管，將使原料成為氣體狀的氣體供給至處理室；容器，被設置於前述氣體供給管，儲存前述原料；流量調整器，被設置於前述氣體供給管，調節前述氣體的流量；及監視部，被構成為能夠監視因前述原料的氣化引起之所需的壓力變化後的前述容器內之壓力是否在前述流量調整器的動作壓力範圍內」的技術。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:反應管</p>
        <p type="p">2:處理室</p>
        <p type="p">18:O形環</p>
        <p type="p">29:處理爐</p>
        <p type="p">31:晶圓</p>
        <p type="p">32:晶舟</p>
        <p type="p">35:蓋體</p>
        <p type="p">41:控制器</p>
        <p type="p">42:加熱器</p>
        <p type="p">44:分歧管</p>
        <p type="p">45:晶舟支撐台</p>
        <p type="p">46:O形環</p>
        <p type="p">47:第1氣體供給管</p>
        <p type="p">48:第2氣體供給</p>
        <p type="p">49:MFC</p>
        <p type="p">51:儲存部</p>
        <p type="p">52:閥</p>
        <p type="p">53:載體氣體供給管</p>
        <p type="p">54:MFC</p>
        <p type="p">55:閥</p>
        <p type="p">56:噴嘴</p>
        <p type="p">57:氣體供給孔</p>
        <p type="p">58:MFC</p>
        <p type="p">59:閥</p>
        <p type="p">61:載體氣體供給管</p>
        <p type="p">62:MFC</p>
        <p type="p">63:閥</p>
        <p type="p">66:氣體排氣管</p>
        <p type="p">67:閥</p>
        <p type="p">68:真空泵</p>
        <p type="p">69:晶舟旋轉機構</p>
        <p type="p">71:液體原料單元</p>
        <p type="p">72:載體氣體源</p>
        <p type="p">73:反應氣體源</p>
        <p type="p">74:載體氣體源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1291" publication-number="202619065">
    <tif-files tif-type="multi-tif">
      <tif file="114121933.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121933</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體組件以及封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR ASSEMBLY AND PACKAGING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/28</main-classification>
        <further-classification edition="200601120260123B">H01L23/498</further-classification>
        <further-classification edition="202301120260123B">H01L25/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商力特半導體（無錫）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITTELFUSE SEMICONDUCTOR (WUXI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休斯　羅德里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGHES, RHODRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王弘政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MATHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於半導體器件中的角部應力減小的半導體組件、封裝結構和相關方法。該組件包括多個半導體裸晶和多個間隔件。多個間隔件中的每個間隔件被設置在多個半導體裸晶中的兩個半導體裸晶之間，並且被配置為分離多個半導體裸晶中的兩個半導體裸晶。多個間隔件中的至少一個間隔件具有至少一個延伸間隔件角部特徵件，至少一個延伸間隔件角部特徵件被配置為朝向與至少一個間隔件相鄰設置的多個半導體裸晶中的至少一個半導體裸晶的至少一個角部延伸。至少一個延伸間隔件角部特徵件被配置為減少至少一個半導體裸晶上的應力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor assembly, a packaging structure, and associated method for corner stress reduction in semiconductor devices. The assembly includes a plurality of semiconductor dies and a plurality of spacers. Each spacer in the plurality of spacers is disposed between and configured to separate two semiconductor dies in the plurality of semiconductor dies. At least one spacer in the plurality of spacers has at least one extended spacer corner feature configured to extend toward at least one corner of at least one semiconductor die in the plurality of semiconductor dies disposed adjacent to the at least one spacer. At least one extended spacer corner feature is configured to reduce stress on at least one semiconductor die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體組件</p>
        <p type="p">202:夾部</p>
        <p type="p">204:接觸區域</p>
        <p type="p">206a、206b、206c:半導體裸晶</p>
        <p type="p">208a、208b、208c:間隔件</p>
        <p type="p">210a、210b、210c:引線框架</p>
        <p type="p">212a、212b、212c、212d:延伸接觸角部特徵件</p>
        <p type="p">214a、214b、214c、214d:延伸間隔件角部特徵件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1292" publication-number="202618399">
    <tif-files tif-type="multi-tif">
      <tif file="114121938.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運輸工具及其驅動方法</chinese-title>
        <english-title>VEHICLE AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">G02B27/01</main-classification>
        <further-classification edition="202001120250910B">G02B30/27</further-classification>
        <further-classification edition="201801120250910B">H04N13/366</further-classification>
        <further-classification edition="202201120250910B">B60R1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佳憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉承霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HONG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭軒廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HSUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種運輸工具及其驅動方法。運輸工具用於對第一位置及第二位置分別提供具有投射距離的第一影像及第二影像。運輸工具包含擋風玻璃以及顯示裝置。顯示裝置用於產生多個第一光束與多個第二光束投射於擋風玻璃一側，且於擋風玻璃的另一側呈現第一影像及第二影像。顯示裝置包含顯示器以及透鏡結構，其中顯示器包含多個第一子像素以及多個第二子像素，且透鏡結構設置於顯示器上。第一子像素與第二子像素產生的光分別經由透鏡結構形成第一光束與第二光束，其中第一光束形成第一影像，且第二光束形成第二影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle and a driving method thereof are provided. The vehicle is configured to provide a first image and a second image with a projection distance respectively to a first position and a second position. The vehicle includes a windshield and a display device. The display device is configured to generate a plurality of first light beams and a plurality of second light beams to be projected on a side of the windshield and to present the first image and the second image on another side of the windshield. The display device includes a display and a lens structure, wherein the display includes a plurality of first sub-pixels and a plurality of second sub-pixels, and the lens structure is disposed on the display. Light generated from the first sub-pixels and the second sub-pixels respectively forms the first light beams and the second light beams through the lens structure, wherein the first light beams form the first image, and the second light beams form the second image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:運輸工具</p>
        <p type="p">12:擋風玻璃</p>
        <p type="p">12S:表面</p>
        <p type="p">14:顯示裝置</p>
        <p type="p">14S:出光面</p>
        <p type="p">D1,D2:距離</p>
        <p type="p">IM:影像</p>
        <p type="p">L:光束</p>
        <p type="p">LE:左眼</p>
        <p type="p">P1:第一位置</p>
        <p type="p">PD:投射距離</p>
        <p type="p">PT1,PT3:點</p>
        <p type="p">PT2:交點</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1293" publication-number="202617845">
    <tif-files tif-type="multi-tif">
      <tif file="114121967.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121967</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改良之波長色散之光學補償膜</chinese-title>
        <english-title>OPTICAL COMPENSATION FILMS WITH IMPROVED WAVELENGTH DISPERSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08J5/18</main-classification>
        <further-classification edition="200601120260119B">G02B5/30</further-classification>
        <further-classification edition="200601120260119B">G02F1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊士曼化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EASTMAN CHEMICAL COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張倩倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張忠博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHONGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃夢菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學補償膜廣泛用於平板顯示器中。光學補償膜之延遲之波長色散為影響顯示器之性能的關鍵參數之一。始終需要具有反向色散之補償膜，其延遲隨著光波長增加而增加。然而，當前補償膜不能完全滿足反向色散之要求，尤其對於長波長光(λ＞ 550nm)而言。本申請案揭示對長波長光具有良好反向色散之補償膜，其包含吸收峰大於700nm的某些添加劑。該等補償膜具有&lt;img align="absmiddle" height="48px" width="118px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;img align="absmiddle" height="48px" width="29px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Optical compensation films are widely adopted in flat panel displays. Wavelength dispersion of retardation of optical compensation films is one of the critical parameters impacting the performance of displays. Compensation films with reverse dispersion, of which the retardation increases along with light wavelength increasing, is always desired. However, current compensation films can’t fully meet the requirement of reverse dispersion, especially for long wavelength light (λ＞ 550nm). This application discloses compensation films with good reverse dispersion for long wavelength light comprising certain additives that have an absorption peak greater than 700nm. The compensation films have &lt;img align="absmiddle" height="48px" width="147px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1294" publication-number="202618446">
    <tif-files tif-type="multi-tif">
      <tif file="114121968.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板支撐總成</chinese-title>
        <english-title>SUBSTRATE SUPPORT ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G03F7/00</main-classification>
        <further-classification edition="200601120260123B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿加　阿尼爾　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGAR, ANIL CAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴布紐　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEBOUGNOUX, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃壯雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHUANGXIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　吉斯　比卓斯　法新克司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN GILS, PETRUS FRANCISCUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇曼　馬汀　哈吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMMAN, MAARTEN HARTGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　德　奇斯　沃特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER CHIJS, WOUTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏魯　寇瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULU, KORAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於一微影設備之基板支撐總成，其包含：一基板支撐區域，其經組態以支撐一基板；及一蓋板，其定位於該基板支撐區域之徑向外側並環繞該基板支撐區域，且經組態以提供鄰近於該基板之一表面的一表面，其中：該蓋板具有面向該基板支撐區域之一內邊緣及與該內邊緣對置之一外邊緣，且該外邊緣相對於該蓋板之該表面傾斜；該基板之該表面在被支撐於該基板支撐區域上時相對於該基板支撐總成之一表面具有一第一高度；且該蓋板之該表面相對於該基板支撐總成之該表面具有小於該第一高度之一第二高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate support assembly for a lithographic apparatus comprises: a substrate supporting area configured to support a substrate; and a cover plate positioned radially outwards of and surrounding the substrate supporting area, and configured to provide a surface adjacent to a surface of the substrate, wherein: the cover plate has an inner edge facing the substrate supporting area and an outer edge opposite to the inner edge, and the outer edge is slanted with respect to the surface of the cover plate; the surface of the substrate has a first height with respect to a surface of the substrate support assembly when supported on the substrate supporting area; and the surface of the cover plate has a second height with respect to the surface of the substrate support assembly that is less than the first height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板支撐總成</p>
        <p type="p">11:蓋板</p>
        <p type="p">12:蓋板表面</p>
        <p type="p">13:內邊緣</p>
        <p type="p">14:外邊緣</p>
        <p type="p">15:間隙</p>
        <p type="p">20:基板支撐區域</p>
        <p type="p">21:表面</p>
        <p type="p">22:基板表面</p>
        <p type="p">50:塊體</p>
        <p type="p">51:基板支撐件</p>
        <p type="p">52:瘤節</p>
        <p type="p">53:基底表面</p>
        <p type="p">65:開口</p>
        <p type="p">h1:第一高度</p>
        <p type="p">h2:第二高度</p>
        <p type="p">h3:第三高度</p>
        <p type="p">h4:第四高度</p>
        <p type="p">W:基板</p>
        <p type="p">WT:基板台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1295" publication-number="202617605">
    <tif-files tif-type="multi-tif">
      <tif file="114121976.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜、物品及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260126B">C01F17/218</main-classification>
        <further-classification edition="200601120260126B">C23C14/26</further-classification>
        <further-classification edition="200601120260126B">C23C16/452</further-classification>
        <further-classification edition="200601120260126B">C23C14/34</further-classification>
        <further-classification edition="201601120260126B">H02J50/05</further-classification>
        <further-classification edition="200601120260126B">H01L21/3065</further-classification>
        <further-classification edition="200601120260126B">H05H1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池俊彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抑制由電漿處理引起之發塵之技術。  &lt;br/&gt;本發明提供一種包含含碳金屬氟氧化物之膜。該膜中之含碳金屬氟氧化物由M&lt;sub&gt;a&lt;/sub&gt;O&lt;sub&gt;b&lt;/sub&gt;F&lt;sub&gt;c&lt;/sub&gt;C&lt;sub&gt;d&lt;/sub&gt;表示，此處，上述M表示金屬原子，上述a、b、c及d表示原子比，且滿足0＜a＜1且0＜b＜1且0＜c＜1且0＜d＜1且a＋b＋c＋d＝1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1296" publication-number="202616957">
    <tif-files tif-type="multi-tif">
      <tif file="114121987.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有擬除蟲菊酯化合物與亞磷酸三硬脂酯之組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A01N53/06</main-classification>
        <further-classification edition="200601120260202B">A01N53/04</further-classification>
        <further-classification edition="200601120260202B">A01N53/08</further-classification>
        <further-classification edition="200601120260202B">A01N53/10</further-classification>
        <further-classification edition="200601120260202B">A01N25/10</further-classification>
        <further-classification edition="200601120260202B">A01N25/22</further-classification>
        <further-classification edition="200601120260202B">A01P7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>園部芙史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONOBE, FUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池平昌史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEHIRA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種新穎的組成物，其含有擬除蟲菊酯化合物與特定的抗氧化劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1297" publication-number="202617792">
    <tif-files tif-type="multi-tif">
      <tif file="114122001.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芳基烷基化茚組成物的製造方法、硬化性樹脂材料、預浸體、樹脂膜、覆金屬積層板、印刷線路板及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F12/00</main-classification>
        <further-classification edition="200601120260202B">C08J5/24</further-classification>
        <further-classification edition="200601120260202B">B32B15/08</further-classification>
        <further-classification edition="200601120260202B">B32B15/082</further-classification>
        <further-classification edition="200601120260202B">H05K1/03</further-classification>
        <further-classification edition="200601120260202B">H01L23/14</further-classification>
        <further-classification edition="200601120260202B">H01L23/29</further-classification>
        <further-classification edition="200601120260202B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹智彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種芳基烷基化茚組成物的製造方法，其包含如下步驟：使具有含聚合性不飽和鍵之基之芳基烷基加成於茚化合物的步驟；及，對於經加成有具有含聚合性不飽和鍵之基之芳基烷基之茚化合物，使不具有含聚合性不飽和鍵之基之芳基烷基進行加成的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1298" publication-number="202618364">
    <tif-files tif-type="multi-tif">
      <tif file="114122012.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光連接部件、機器之製造方法、及機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B6/36</main-classification>
        <further-classification edition="200601120260126B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅野泰徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木昌輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能在可開閉之機器中增加傳輸容量的同時實現小型化或薄型化之連接部件。  &lt;br/&gt;光連接部件具備：光纖，其包括第1端及相反側之第2端；以及鉸鏈部件，其供光纖穿過。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光連接部件</p>
        <p type="p">10:光纖</p>
        <p type="p">11:第1端</p>
        <p type="p">12:第2端</p>
        <p type="p">20:鉸鏈部件</p>
        <p type="p">21:鉸鏈軸</p>
        <p type="p">22:第1構件</p>
        <p type="p">23:貫通孔(第1貫通孔)</p>
        <p type="p">24:第2構件</p>
        <p type="p">25:貫通孔(第2貫通孔)</p>
        <p type="p">30:第1光部件</p>
        <p type="p">40:第2光部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1299" publication-number="202619611">
    <tif-files tif-type="multi-tif">
      <tif file="114122038.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相位差層積層體、光學積層體及相位差層積層體之製造方法</chinese-title>
        <english-title>A RETARDATION LAYER LAMINATE, AN OPTICAL LAMINATE AND MANUFACTURING METHOD OF A RETARDATION LAYER LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260126B">H10K50/86</main-classification>
        <further-classification edition="200601120260126B">G02F1/13363</further-classification>
        <further-classification edition="200601120260126B">B32B7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部峻也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, SHUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為兼具相位差層積層體及光學積層體之辨視性(干涉不均等)的改善及液晶相位差層間浮翹的減低。  &lt;br/&gt;本發明之解決手段為一種相位差層積層體，係依序具有第一液晶相位差層、具有20~200nm之厚度之第一貼合層、及第二液晶相位差層。第一液晶相位差層及第二液晶相位差層之至少一者的前述第一貼合層側的表面之Si原子之原子濃度為0.5~10at%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The purpose of this invention is to achieve both improvement in visibility (interference unevenness and the like) and reduction in floating between liquid crystal retardation layers in a retardation layer laminate and an optical laminate. The solution mean is that the retardation layer laminate has, in this order, a first liquid crystal retardation layer, a first bonding layer having a thickness of 20 to 200 nm, and a second liquid crystal retardation laye. The atomic concentration of Si atoms on the surface of at least one of the first liquid crystal retardation layer and the second liquid crystal retardation layer facing to the first bonding layer is 0.5 to 10 at %.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:第一液晶相位差層</p>
        <p type="p">40:第一貼合層</p>
        <p type="p">50:第二液晶相位差層</p>
        <p type="p">150:第二貼合層</p>
        <p type="p">180:第一保護層</p>
        <p type="p">190:第二保護層</p>
        <p type="p">220:直線偏光片</p>
        <p type="p">300:相位差層積層體</p>
        <p type="p">400:光學積層體</p>
        <p type="p">500:外側黏著劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1300" publication-number="202618498">
    <tif-files tif-type="multi-tif">
      <tif file="114122046.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱介質控制裝置及熱介質控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G05D23/19</main-classification>
        <further-classification edition="200601120260126B">F28F27/02</further-classification>
        <further-classification edition="200601120260126B">F16K11/22</further-classification>
        <further-classification edition="200601120260126B">B08B9/02</further-classification>
        <further-classification edition="200601120260126B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河西晃士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANISHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">第一供給配管係被連接於第一配管，且係用以將第一溫度的熱介質經由第一配管供給予流道內，該第一配管係用以將熱介質供給予熱交換構件的流道內。第一回流配管被連接於被連結於第二配管，且使在流道內流動之熱介質回到第一溫度控制部內之槽，該第二配管係用以排出在流道內流動之熱介質。第二供給配管係被連接於第一配管，且係用於將第二溫度的熱介質，經由第一配管供給予流道內。第二回流配管係被連接於第二配管，且係用於使在流道內流動之熱介質回到第二溫度控制部內之槽。第一切換部係將被供給予第一配管之熱介質進行切換。第二切換部係將自第二配管排出的熱介質之排出處進行切換。第一旁通管係被設置於第二配管與第一溫度控制部內的槽之間。第一閥係被設置於第一旁通管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1110基台</p>
        <p type="p">1110a流道</p>
        <p type="p">50溫度控制裝置</p>
        <p type="p">50a、50b配管</p>
        <p type="p">51a第一溫度控制部</p>
        <p type="p">51b第二溫度控制部</p>
        <p type="p">510a、510b閥</p>
        <p type="p">511a、511b:熱交換器</p>
        <p type="p">512a、512b:槽</p>
        <p type="p">52a、52b:配管</p>
        <p type="p">53a、53b:配管</p>
        <p type="p">54a:第一切換部</p>
        <p type="p">54b:第二切換部</p>
        <p type="p">540a:第一供給閥</p>
        <p type="p">540b:第一回流閥</p>
        <p type="p">541a:第二供給閥</p>
        <p type="p">541b:第二回流閥</p>
        <p type="p">55a:第一旁通管</p>
        <p type="p">55b:第二旁通管</p>
        <p type="p">56a:第一旁通閥</p>
        <p type="p">56b:第二旁通閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1301" publication-number="202619066">
    <tif-files tif-type="multi-tif">
      <tif file="114122056.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含具有可變大小凸塊互連件的被動裝置的封裝</chinese-title>
        <english-title>PACKAGE COMPRISING A PASSIVE DEVICE WITH VARIABLE SIZED BUMP INTERCONNECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/28</main-classification>
        <further-classification edition="200601120260123B">H01L23/488</further-classification>
        <further-classification edition="200601120260123B">H01L23/535</further-classification>
        <further-classification edition="202301120260123B">H01L25/16</further-classification>
        <further-classification edition="202501120260123B">H10D1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　艷梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YANMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　新雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, SUN WOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周崇義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史東　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，其包含一封裝中介層及耦接至該封裝中介層的一第一整合裝置。該封裝中介層包含一第一金屬化部分；一第二金屬化部分；一被動裝置，其位於該第一金屬化部分與該第二金屬化部分之間。該被動裝置包含複數個凸塊互連件。該複數個凸塊互連件包含：第一複數個凸塊互連件，其中來自該第一複數個凸塊互連件之各凸塊互連件包含一第一最小寬度；及第二複數個凸塊互連件，其中來自該第二複數個凸塊互連件之各凸塊互連件包含大於該第一最小寬度的一第二最小寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising a package interposer and a first integrated device coupled to the package interposer. The package interposer comprises a first metallization portion; a second metallization portion; a passive device located between the first metallization portion and the second metallization portion. The passive device comprises a plurality of bump interconnects. The plurality of bump interconnects comprise a first plurality of bump interconnects, where each bump interconnect from the first plurality of bump interconnects comprises a first minimum width; and a second plurality of bump interconnects, where each bump interconnect from the second plurality of bump interconnects comprises a second minimum width that is greater than the first minimum width.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:被動裝置</p>
        <p type="p">205:凸塊互連件</p>
        <p type="p">207:凸塊互連件</p>
        <p type="p">207a,207b,207c,207d:凸塊互連件</p>
        <p type="p">210a:第一隅角區域</p>
        <p type="p">210b:第二隅角區域</p>
        <p type="p">210c:第三隅角區域</p>
        <p type="p">210d:第四隅角區域</p>
        <p type="p">220a:第一隅角</p>
        <p type="p">220b:第二隅角</p>
        <p type="p">220c:第三隅角</p>
        <p type="p">220d:第四隅角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1302" publication-number="202619354">
    <tif-files tif-type="multi-tif">
      <tif file="114122070.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機致動器及包括其之相機模組</chinese-title>
        <english-title>CAMERA ACTUATOR AND CAMERA MODULE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260126B">H04N23/68</main-classification>
        <further-classification edition="202101120260126B">G02B7/04</further-classification>
        <further-classification edition="200601120260126B">H02K41/035</further-classification>
        <further-classification edition="202101120260126B">G02B7/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓民錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, MIN SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛東賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOL, DONG HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種相機致動器，包含：一外殼；一第一載體，設置於該外殼內部；一第二載體，設置於該第一載體內部且可沿一光軸方向移動； 以及設置於該外殼一第一側面的一第一線圈與一第二線圈，以及設置於與該第一側面相對之該外殼一第二側面的一第三線圈與一第四線圈，其中該第一線圈與該第二線圈沿垂直於該光軸方向的一第一方向配置，該第三線圈與該第四線圈則沿該第一方向配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment discloses a camera actuator including: a housing; a first carrier disposed inside the housing; a second carrier that is disposed inside the first carrier and is movable in an optical axis direction; a first coil and a second coil disposed on a first side surface of the housing, and a third coil and a fourth coil disposed on a second side surface of the housing facing the first side surface; wherein the first coil and the second coil are disposed in a first direction perpendicular to the optical axis direction, and the third coil and the fourth coil are disposed in the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1110:外殼</p>
        <p type="p">1120:導引單元</p>
        <p type="p">1130:電路板單元</p>
        <p type="p">1140:第一載體</p>
        <p type="p">1150:第二載體</p>
        <p type="p">1160:止擋件</p>
        <p type="p">1170:蓋板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1303" publication-number="202619032">
    <tif-files tif-type="multi-tif">
      <tif file="114122090.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用ＶＦＭ和ＴＣＢ形成互連結構的半導體裝置及方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERCONNECT STRUCTURE USING VFM AND TCB</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/768</main-classification>
        <further-classification edition="200601120260123B">H01L23/31</further-classification>
        <further-classification edition="200601120260123B">H01L23/538</further-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
        <further-classification edition="202301120260123B">H01L25/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＪＣＥＴ　星科金朋韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹汝俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, YEOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喜秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴俊熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容描述一種半導體裝置，其具有第一基板及第二基板或互連基板，其中互連結構使用VFM信號結合熱及/或壓力形成於該第一基板與第二基板或互連基板之間。該互連結構可為凸塊或具有導電柱之凸塊。接近該第一基板及該第二基板而安置之微波源產生該VFM信號。可在使用該VFM信號時將熱及壓力施加至該互連結構。可在使用該VFM信號時將熱或壓力施加至該互連結構。非導電膜可在該第一基板與第二基板之間的該互連結構周圍形成。環氧樹脂及焊劑材料可在該第一基板與第二基板之間的該互連結構周圍形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has a first substrate and a second substrate or interconnect substrate with an interconnect structure formed between the first substrate and second substrate or interconnect substrate using a VFM signal, in combination with heat and/or pressure. The interconnect structure can be a bump or a bump with conductive pillars. A microwave source disposed in proximity to the first and second substrates generates the VFM signal. Heat and pressure can be applied to the interconnect structure while using the VFM signal. Heat or pressure can be applied to the interconnect structure while using the VFM signal. A non-conductive film can be formed around the interconnect structure between the first substrate and second substrate. An epoxy and flux material can be formed around the interconnect structure between the first substrate and second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112a:導電層</p>
        <p type="p">112b:導電層</p>
        <p type="p">136:指示箭頭/熱壓力指示符</p>
        <p type="p">138:指示箭頭/熱指示符</p>
        <p type="p">142:可變頻率微波信號</p>
        <p type="p">270a:電性組件</p>
        <p type="p">270b:電性組件</p>
        <p type="p">272:導電柱</p>
        <p type="p">274:導電柱</p>
        <p type="p">276:中間凸塊材料/凸塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1304" publication-number="202617973">
    <tif-files tif-type="multi-tif">
      <tif file="114122125.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人類滋養層幹細胞分泌體、外泌體及其用途</chinese-title>
        <english-title>HUMAN TROPHOBLAST STEM CELL SECRETOMES, EXOSOMES, AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N5/0735</main-classification>
        <further-classification edition="201501120260202B">A61K35/545</further-classification>
        <further-classification edition="200601120260202B">A61P27/02</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
        <further-classification edition="200601120260202B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安斯瑞德生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACCELERATED BIOSCIENCES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示分泌體（條件培養基）及其可用於治療一疾病或病況的方法。本發明揭示外泌體及其可用於治療一疾病或病況的方法。本發明揭示包含有分泌體（條件培養基）與外泌體的組成物及其可用於治療一疾病或病況的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are secretomes (conditioned media), and methods that can be used to treat a disease or condition. Described herein are exosomes and methods that can be used to treat a disease or condition. Described herein are compositions comprising secretomes (conditioned media) and exosomes and methods that can be used to treat a disease or condition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1305" publication-number="202617765">
    <tif-files tif-type="multi-tif">
      <tif file="114122132.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＩＬ－２１抑制劑在製備用於治療或預防化膿性汗腺炎的藥劑的用途</chinese-title>
        <english-title>USE OF IL-21 INHIBITOR IN MANUFACTURE OF A MEDICAMENT FOR TREATING OR PREVENTING HIDRADENITIS SUPPURATIVA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/24</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商阿爾米雷爾有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALMIRALL, S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛佩茲阿爾馬格羅　羅莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ ALMAGRO, ROSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供IL-21抑制劑以及包含其的藥物製劑和劑型用於治療或預防化膿性汗腺炎（HS）的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides the use of an IL-21 inhibitor, as well as pharmaceutical formulations, and dosage forms comprising the same for use in the treatment or prophylaxis of Hidradenitis Suppurativa (HS).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1306" publication-number="202617811">
    <tif-files tif-type="multi-tif">
      <tif file="114122162.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>烯烴-芳香族乙烯化合物-芳香族多烯共聚物及其製造方法、含有該共聚物之組合物、以及其等之硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08F255/08</main-classification>
        <further-classification edition="200601120260119B">C08F210/16</further-classification>
        <further-classification edition="200601120260119B">B32B15/082</further-classification>
        <further-classification edition="200601120260119B">B32B15/085</further-classification>
        <further-classification edition="200601120260119B">B32B15/20</further-classification>
        <further-classification edition="202501120260119B">C08L23/20</further-classification>
        <further-classification edition="200601120260119B">C08L25/08</further-classification>
        <further-classification edition="200601120260119B">C08L51/06</further-classification>
        <further-classification edition="200601120260119B">H01B3/44</further-classification>
        <further-classification edition="200601120260119B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅藤諒介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANTO, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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        <p type="p">本發明提供一種不揮發性且低分子量、能夠實現較高之交聯密度之新穎之烯烴-芳香族乙烯化合物-芳香族多烯共聚物及其製造方法等。本發明之烯烴-芳香族乙烯化合物-芳香族多烯共聚物之數量平均分子量(Mn)為500以上且未達12,000，包含烯烴單體單元、芳香族乙烯化合物單體單元、及芳香族多烯單體單元，且具有來自上述芳香族多烯單體單元之芳香族乙烯基，上述芳香族乙烯基之個數為每上述數量平均分子量(Mn)為2個以上，且每上述芳香族乙烯基之上述數量平均分子量(Mn)為500以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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          <doc-number>114122175</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水中油型乳化化妝料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K8/06</main-classification>
        <further-classification edition="200601120260202B">A61K8/37</further-classification>
        <further-classification edition="200601120260202B">A61K8/34</further-classification>
        <further-classification edition="200601120260202B">A61Q1/00</further-classification>
        <further-classification edition="200601120260202B">A61Q19/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
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              <chinese-name name-type="organization">
                <last-name>萩尾友美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIO, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村井日奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAI, HINAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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                <last-name>早瀨基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASE, MOTOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐野宏充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANO, HIROMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供的水中油型乳化化妝料，係乳化粒子呈均勻、著色顏料不凝聚、安定性優異、且經時之高溫安定性優異。  &lt;br/&gt;本發明相關的水中油型乳化化妝料，係含有下述成分(A)、(B)、(C)及(D)：  &lt;br/&gt;(A)經利用從胺基酸、醯基化胺基酸、烷氧基烷基鈦、烷基烷氧基矽烷、及25℃呈液狀且未含羥基的甘油脂肪酸酯中選擇之1種或2種以上施行處理過的著色顏料；  &lt;br/&gt;(B)至少含有(B1)具碳數16~22脂肪酸之聚氧乙烯山梨糖醇脂肪酸酯的非離子性界面活性劑；  &lt;br/&gt;(C)25℃呈固態的脂肪酸酯；  &lt;br/&gt;(D)陰離子性界面活性劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1308" publication-number="202618901">
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      <volno>24</volno>
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          <doc-number>202618901</doc-number>
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        <document-id>
          <doc-number>114122181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、基板處理系統及參數之校正方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/302</main-classification>
        <further-classification edition="200601120260123B">H01L21/66</further-classification>
        <further-classification edition="201901120260123B">G06N20/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>坂口慶介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAGUCHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林累輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, RUIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
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          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
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          </agent>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在適當地控制將基板的表面加以蝕刻後之該基板的表面形狀。本發明之基板處理方法，用以處理基板，該基板包含第1基板及比該第1基板更後處理的第2基板，該基板處理方法包含下述步驟：使用於以複數之相異蝕刻條件蝕刻該基板中的蝕刻對象時之包含該蝕刻對象的徑向蝕刻量分布之複數學習資料，從預先決定的該第1基板中的該蝕刻對象之預先決定的第1目標蝕刻量分布，藉由最佳化方法，決定可在該第1基板執行的推定蝕刻量分布，以決定此時的最佳蝕刻條件；基於該最佳蝕刻條件，蝕刻該第1基板中的該蝕刻對象；於進行該蝕刻之後測定該第1基板的厚度，藉此取得實測蝕刻量分布；取得該推定蝕刻量分布與該實測蝕刻量分布的差異量；及基於該差異量，校正該學習資料與該第2基板中的該蝕刻對象之預先決定的第2目標蝕刻量分布中任一者或二者。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
      </representative-img>
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          <doc-number>114122196</doc-number>
        </document-id>
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      <invention-title>
        <chinese-title>積層鐵芯的製造方法及製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
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        <main-classification edition="200601120260202B">H01F41/02</main-classification>
        <further-classification edition="202501120260202B">H02K15/02</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
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                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒牧高志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAMAKI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">在對具有已透過接著劑層11b積層之複數個鐵芯片1a之積層體2進行加熱來製造積層鐵芯時，設置以包圍積層體2的方式來放射近紅外線之4個發熱體30。各發熱體是配置成滿足「0.38＜0.88((W-D&lt;sub&gt;1&lt;/sub&gt;)/W)&lt;sup&gt;0.22&lt;/sup&gt;×(L-D&lt;sub&gt;1&lt;/sub&gt;)/L)&lt;sup&gt;0.20&lt;/sup&gt;≦1.0」。其中，在上述式中，W是表示相互相向之發熱體30之間的距離，D&lt;sub&gt;1&lt;/sub&gt;是表示積層體2的直徑，L是表示發熱體30的長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:鐵芯片</p>
        <p type="p">2:積層體</p>
        <p type="p">2a:外周面</p>
        <p type="p">22:熱源部</p>
        <p type="p">220:一端</p>
        <p type="p">222:另一端</p>
        <p type="p">30:發熱體</p>
        <p type="p">301:長邊</p>
        <p type="p">500:正方形</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:直徑</p>
        <p type="p">L:長度</p>
        <p type="p">W&lt;sub&gt;x&lt;/sub&gt;,W&lt;sub&gt;y&lt;/sub&gt;:距離</p>
        <p type="p">X:第1方向</p>
        <p type="p">Y:第2方向</p>
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        <document-id>
          <doc-number>114122209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
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      <classification-ipc>
        <main-classification edition="200601120260202B">C08K3/08</main-classification>
        <further-classification edition="200601120260202B">C08L101/00</further-classification>
        <further-classification edition="200601120260202B">C08L63/00</further-classification>
        <further-classification edition="200601120260202B">H01F1/147</further-classification>
        <further-classification edition="200601120260202B">H01F1/26</further-classification>
        <further-classification edition="200601120260202B">H01F27/255</further-classification>
        <further-classification edition="200601120260202B">H01F41/02</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大山秀樹</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>OOYAMA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤瑞季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種塗佈性為優異、且可得到高相對磁導率的硬化物的樹脂組成物等。  &lt;br/&gt;　　[解決手段] 一種樹脂組成物，包含：(A)奈米結晶磁性粉、(B)包含Fe及Ni的磁性粉、及(C)熱硬化性樹脂，其中，(B)成分中所包含的Fe及Ni的含有比(Fe的含有量/Ni的含有量)為0.85以上1.25以下，相對於(B)成分100質量%，(B)成分中所包含的氧原子的含有量為0.3質量%以上，樹脂組成物中所包含的粒子整體的10%粒徑(D&lt;sub&gt;10&lt;/sub&gt;)為0.2μm以上4μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1311" publication-number="202618873">
    <tif-files tif-type="multi-tif">
      <tif file="114122210.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122210</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉積用於半導體元件的含矽膜的方法</chinese-title>
        <english-title>METHODS OF DEPOSITING SILICON-CONTAINING FILMS FOR SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種透過電漿增強原子層沉積（PEALD）沉積含矽膜的方法。範例方法包括在處理系統中將基板暴露於含矽的前驅物；將基板暴露於含氮反應物；將基板暴露於第一電漿，該第一電漿包含氮（N&lt;sub&gt;2&lt;/sub&gt;）或氫（H&lt;sub&gt;2&lt;/sub&gt;）中一或多種，以及氬（Ar）或氦（He）中一或多種；並將基板暴露於第二電漿，該第二電漿包含氮（N&lt;sub&gt;2&lt;/sub&gt;）、氬（Ar）、氦（He）、氧（O&lt;sub&gt;2&lt;/sub&gt;）、一氧化二氮（N&lt;sub&gt;2&lt;/sub&gt;O）或二氧化碳（CO&lt;sub&gt;2&lt;/sub&gt;）中一或多種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing silicon-containing films by plasma-enhanced atomic layer deposition (PEALD) are disclosed. Exemplary methods include exposing a substrate in a processing system to a silicon-containing precursor; exposing the substrate to a nitrogen-containing reactant; exposing the substrate to a first plasma including one or more of nitrogen (N&lt;sub&gt;2&lt;/sub&gt;) or hydrogen (H&lt;sub&gt;2&lt;/sub&gt;), and one or more of argon (Ar) or helium (He); and exposing the substrate to a second plasma including one or more of nitrogen (N&lt;sub&gt;2&lt;/sub&gt;), argon (Ar), helium (He), oxygen (O&lt;sub&gt;2&lt;/sub&gt;), nitrous oxide (N&lt;sub&gt;2&lt;/sub&gt;O), or carbon dioxide (CO&lt;sub&gt;2&lt;/sub&gt;).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">11:操作</p>
        <p type="p">12:操作</p>
        <p type="p">13:操作</p>
        <p type="p">14:操作</p>
        <p type="p">15:操作</p>
        <p type="p">16:操作</p>
        <p type="p">17:操作</p>
        <p type="p">18:操作</p>
        <p type="p">19:決策點</p>
        <p type="p">20:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1312" publication-number="202618084">
    <tif-files tif-type="multi-tif">
      <tif file="114122214.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於締捲加工紗之裝置</chinese-title>
        <english-title>DEVICE FOR TEXTURING YARN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">D02G1/16</main-classification>
        <further-classification edition="200601120260123B">D01D11/00</further-classification>
        <further-classification edition="200601120260123B">D01D5/22</further-classification>
        <further-classification edition="200601120260123B">D02J1/02</further-classification>
        <further-classification edition="200601120260123B">D02J1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＳＳＭ恰特斯威特美特勒公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SSM SCHARER SCHWEITER METTLER AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科瑞司帝　馬塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRISTE, MARCEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瑞斯　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARIS, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敦維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於締捲加工紗之裝置，該裝置包含一締捲加工紡嘴(2)及一衝擊元件(9)。該締捲加工紡嘴(2)具有一紡嘴入口(3)及一紡嘴出口(4)，該紡嘴出口藉由一紡嘴膛孔(5)及連接至該紡嘴膛孔(5)之一壓縮空氣連接件(7)連接至該紡嘴入口(3)。該衝擊元件(9)經配置成在一距離(8)處與該紡嘴出口(4)相對，且該締捲加工紡嘴(2)與該衝擊元件(9)配置於一共同締捲加工軸(1)上。該衝擊元件(9)具有指向該締捲加工紡嘴(2)之該紡嘴出口(4)之一凹形形狀之衝擊表面(10)及與該衝擊表面(10)相對之一衝擊元件出口(18)。該衝擊表面(10)藉由一衝擊元件膛孔(13)連接至該衝擊元件出口(18)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a device for texturing yarn, the device comprising a texturing nozzle (2) and an impact element (9). The texturing nozzle (2) has a nozzle inlet (3) and a nozzle outlet (4) connected to the nozzle inlet (3) by a nozzle bore (5) and a compressed air connection (7) connected to the nozzle bore (5). The impact element (9) is arranged opposite the nozzle outlet (4) at a distance (8), and the texturing nozzle (2) and the impact element (9) are arranged in a common texturing axis (1). The impact element (9) has a concavely shaped impact surface (10) directed toward the nozzle outlet (4) of the texturing nozzle (2) and an impact element outlet (18) opposite the impact surface (10). The impact surface (10) is connected to the impact element outlet (18) by an impact element bore (13).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:締捲加工軸</p>
        <p type="p">2:締捲加工紡嘴</p>
        <p type="p">3:紡嘴入口</p>
        <p type="p">4:紡嘴出口</p>
        <p type="p">5:紡嘴膛孔</p>
        <p type="p">6:紡嘴出口直徑</p>
        <p type="p">7:壓縮空氣連接件</p>
        <p type="p">8:距離</p>
        <p type="p">9:衝擊元件</p>
        <p type="p">10:衝擊表面；凹形形狀之衝擊表面</p>
        <p type="p">11:衝擊表面直徑</p>
        <p type="p">12:衝擊表面深度</p>
        <p type="p">13:衝擊元件膛孔</p>
        <p type="p">14:膛孔直徑</p>
        <p type="p">15:膛孔軸</p>
        <p type="p">18:衝擊元件出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1313" publication-number="202619258">
    <tif-files tif-type="multi-tif">
      <tif file="114122219.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧振式電源轉換電路及其驅動方法</chinese-title>
        <english-title>RESONANT POWER CONVERSION CIRCUIT AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250708B">H02M3/325</main-classification>
        <further-classification edition="200601120250708B">H02M7/217</further-classification>
        <further-classification edition="200601120250708B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊大勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TA-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林梓誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種諧振式電源轉換電路，包括諧振電容、變壓器、上橋電晶體、下橋電晶體以及控制電路。諧振電容耦接於諧振節點以及接地端之間。變壓器包括耦接於切換節點以及諧振節點之間之初級線圈。上橋電晶體將輸入電壓提供至切換節點，下橋電晶體將切換節點耦接至接地端。當控制電路判斷驅動上橋電晶體或下橋電晶體之驅動頻率進入頻率範圍時，控制電路同時關斷上橋電晶體以及下橋電晶體延遲時間，而將驅動頻率移至頻率範圍之外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resonant power conversion circuit includes a resonant capacitor, a transformer, a high-side transistor, a low-side transistor, and a control circuit. The resonant capacitor is coupled between a resonant node and a ground. The transformer includes a primary coil coupled between a switch node and the resonant node. The high-side transistor provides an input voltage to the switch node. The low-side transistor couples the switch node to the ground. When the control circuit determines that a frequency driving the high-side transistor and the low-side transistor is in a frequency range, the control circuit turns off both the high-side transistor and the low-side transistor for a delay time to move the driving frequency outside the frequency range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:諧振式電源轉換電路</p>
        <p type="p">111:上橋電晶體</p>
        <p type="p">112:下橋電晶體</p>
        <p type="p">120:第一電流偵測電路</p>
        <p type="p">130:積分器</p>
        <p type="p">131:積分放大器</p>
        <p type="p">140:全波整流裝置</p>
        <p type="p">150:第二電流偵測電路</p>
        <p type="p">160:控制電路</p>
        <p type="p">170:位準移位電路</p>
        <p type="p">180:整流電路</p>
        <p type="p">190:回授電路</p>
        <p type="p">TM:變壓器</p>
        <p type="p">LR:諧振電感</p>
        <p type="p">CR:諧振電容</p>
        <p type="p">HSD:上橋驅動電路</p>
        <p type="p">LSD:下橋驅動電路</p>
        <p type="p">PS:初級線圈</p>
        <p type="p">SS:次級線圈</p>
        <p type="p">NR:諧振節點</p>
        <p type="p">SW:切換節點</p>
        <p type="p">HSG:上橋閘極驅動信號</p>
        <p type="p">LSG:下橋閘極驅動信號</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">C1:第一電容</p>
        <p type="p">C2:第二電容</p>
        <p type="p">C3:第三電容</p>
        <p type="p">R1:第一電阻</p>
        <p type="p">R2:第二電阻</p>
        <p type="p">R3:第三電阻</p>
        <p type="p">R4:第四電阻</p>
        <p type="p">R5:第五電阻</p>
        <p type="p">R6:第六電阻</p>
        <p type="p">R7:第七電阻</p>
        <p type="p">FW:整流信號</p>
        <p type="p">FB:回授電壓</p>
        <p type="p">SZ:交叉信號</p>
        <p type="p">COUT:輸出電容</p>
        <p type="p">HS:上橋驅動信號</p>
        <p type="p">LS:下橋驅動信號</p>
        <p type="p">D1:第一整流元件</p>
        <p type="p">D2:第二整流元件</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">DR:穩壓元件</p>
        <p type="p">VD1:第一分壓電壓</p>
        <p type="p">PD:光耦合元件</p>
        <p type="p">LED:二極體</p>
        <p type="p">Q:電晶體</p>
        <p type="p">VCC:供應電壓</p>
        <p type="p">VCS:電流偵測電壓</p>
        <p type="p">CS:電流偵測信號</p>
        <p type="p">INT:積分信號</p>
        <p type="p">OCP:過電流信號</p>
        <p type="p">ND1:第一偵測節點</p>
        <p type="p">ND2:第二偵測節點</p>
        <p type="p">VREF:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1314" publication-number="202617738">
    <tif-files tif-type="multi-tif">
      <tif file="114122272.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於癌症治療之CIP2A　RNA剪接修飾劑</chinese-title>
        <english-title>CIP2A RNA SPLICE MODIFIERS FOR USE IN TREATMENT OF CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D519/00</main-classification>
        <further-classification edition="200601120260202B">C07D513/04</further-classification>
        <further-classification edition="200601120260202B">A61K31/5025</further-classification>
        <further-classification edition="200601120260202B">A61K31/454</further-classification>
        <further-classification edition="200601120260202B">A61K31/4985</further-classification>
        <further-classification edition="200601120260202B">A61K31/439</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商歐瑞克製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIC PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅梅羅　Ｆ　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMERO, F. ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅博茲　塔克　科倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERTS, TUCKER CURRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝藍克　布萊恩　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLANK, BRIAN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　喬安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, JOANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維卡瑞亞　瑞克夏　哈蘇卡拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEKARIYA, RAKESH HARSUKHLAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱恩提拉　梅莉莎　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNTTILA, MELISSA R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示減少細胞中全長CIP2A蛋白質之表現的方法，其中該細胞包含CIP2A前驅mRNA，該方法包含使該細胞與式(I)化合物或其醫藥學上可接受之鹽接觸，藉此減少該細胞中全長CIP2A蛋白質之表現。本文亦揭示治療有需要個體之癌症的方法，該方法包含向該個體投與式(I)化合物或其醫藥學上可接受之鹽，藉此治療該個體之該癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of decreasing the expression of full-length CIP2A protein in a cell, wherein the cell comprises CIP2A pre-mRNA, the method comprising contacting the cell with a compound of Formula (I), or a pharmaceutically acceptable salt thereof, thereby decreasing expression of full-length CIP2A protein in the cell. Also disclosed herein are methods of treating cancer in a subject in need thereof, the method comprising administering to the subject a compound of Formula (I), or a pharmaceutically acceptable salt thereof, thereby treating the cancer in the subject.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1315" publication-number="202617766">
    <tif-files tif-type="multi-tif">
      <tif file="114122282.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特異性結合胸腺基質淋巴細胞生成素（ＴＳＬＰ）的單克隆抗體或其抗原結合片段及其用途</chinese-title>
        <english-title>MONOCLONAL ANTIBODY OR ANTIGEN-BINDING FRAGMENT THEREOF THAT SPECIFICALLY BINDS TO THYMIC STROMAL LYMPHOPOIETIN (TSLP), AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/24</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P11/06</further-classification>
        <further-classification edition="200601120260202B">A61P11/02</further-classification>
        <further-classification edition="200601120260202B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俄羅斯聯邦商拜奧卡德聯合股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOINT STOCK COMPANY ''BIOCAD''</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉紹娃　奧爾加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASHOVA, OLGA NIKOLAEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴托什　烏麗安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARTOSH, ULIANA IVANOVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維諾加多瓦　艾琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINOGRADOVA, ELENA VLADIMIROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多羅寧　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DORONIN, ALEKSANDR NIKOLAEVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茲維多娃　達麗婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZVEZDOVA, DARIA SERGEEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科茲洛娃　葉卡捷琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZLOVA, EKATERINA SERGEEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫茲明科娃　阿納塔西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUZMINKOVA, ANASTASIIA ANDREEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆胡迪諾娃　雷娜塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHUTDINOVA, RENATA RUSTAMOVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼卡諾羅娃　瑪麗娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKANOROVA, MARINA VALERIEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特多維尼科娃　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUDOVISHNIKOVA, ANNA ALEKSANDROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里托諾娃　亞娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHARITONOVA, IANA VLADIMIROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩羅佐　狄密崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROZOV, DMITRY VALENTINOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及生物技術和醫學領域，尤其涉及特異性結合胸腺基質淋巴細胞生成素(TSLP)的單克隆抗體或其抗原結合片段。本發明還涉及編碼該抗體的核酸、表達載體、宿主細胞及其製備方法、製備本發明抗體的方法、包含本發明抗體的藥物組合物、包含本發明抗體及其他治療活性化合物的藥物組合物、治療由胸腺基質淋巴細胞生成素(TSLP)介導的疾病或病症的方法、所述抗體或其藥物組合物用於治療由TSLP介導的疾病或病症的用途、以及所述抗體及其他治療活性化合物用於治療由TSLP介導的疾病或病症的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of biotechnology and medicine, in particular to a monoclonal antibody or antigen-binding fragment thereof that specifically binds to thymic stromal lymphopoietin (TSLP). The invention further relates to nucleic acids encoding said antibody, expression vectors, host cells and methods for producing same, methods for producing the antibodies according to the invention, pharmaceutical compositions comprising the antibody according to the invention, pharmaceutical compositions comprising the antibody according to the invention and other therapeutically active compounds, methods for treating diseases or disorders mediated by thymic stromal lymphopoietin (TSLP), uses of the antibodies or pharmaceutical compositions thereof for treating diseases or disorders mediated by TSLP, and uses of the antibodies and other therapeutically active compounds for treating diseases or disorders mediated by TSLP.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1316" publication-number="202618251">
    <tif-files tif-type="multi-tif">
      <tif file="114122286.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型ＬＥＤ以測試亮度及色彩準確度的自動化基於ＡＩ之電致發光測試設備</chinese-title>
        <english-title>AN AUTOMATED AI-BASED ELECTROLUMINESCENCE TESTING EQUIPMENT FOR MICROLEDS TO TEST FOR LUMINOSITY AND COLOR ACCURACY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01N21/66</main-classification>
        <further-classification edition="200601120260202B">G01N21/95</further-classification>
        <further-classification edition="202001120260202B">G01R31/26</further-classification>
        <further-classification edition="202001120260202B">G01R31/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種LED基材系統的自動化電致發光測試設備，其中一自動化電致發光測試設備檢查模組用以判定進入的處理材料的品質，且一自動化電致發光測試設備處理模組用以處理該處理材料，一自動化電致發光測試設備後處理模組用以檢查所得之該處理材料的可接受性，且一自動化電致發光測試設備歷史模組用以針對所有歷史資料分析最近處理的後處理結果以尋找該自動化電致發光測試設備處理模組中之增強處理改變，且一自動化電致發光測試設備整合模組用以基於該自動化電致發光測試設備歷史模組的該等結果來更新該自動化電致發光測試設備處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an automated electroluminescence testing equipment of LED substrates system in which an automated electroluminescence testing equipment inspection module is used to determine quality of incoming processing material, and an automated electroluminescence testing equipment process module is used to process the processing material , an automated electroluminescence testing equipment post-process module is used to inspect the resultant process material for acceptability, and an automated electroluminescence testing equipment historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated electroluminescence testing equipment process module, and an automated electroluminescence testing equipment integration module to update the automated electroluminescence testing equipment process module based upon the results of the automated electroluminescence testing equipment historical module.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方電致發光測試AI網路</p>
        <p type="p">104:通訊介面</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:基本模組</p>
        <p type="p">110:ET檢查模組</p>
        <p type="p">112:ET處理模組</p>
        <p type="p">114:ET後處理模組</p>
        <p type="p">116:ET歷史模組；歷史模組</p>
        <p type="p">118:ET整合模組</p>
        <p type="p">120:ET檢查資料庫；檢查資料庫</p>
        <p type="p">122:ET處理資料庫</p>
        <p type="p">124:ET後處理資料庫</p>
        <p type="p">126:ET網路資料庫</p>
        <p type="p">128:雲端</p>
        <p type="p">130:電致發光測試預處理</p>
        <p type="p">132:通訊介面</p>
        <p type="p">134:記憶體</p>
        <p type="p">136:電致發光測試預處理AI模組</p>
        <p type="p">138:電致發光測試預處理資料庫</p>
        <p type="p">140:電致發光測試處理；電致發光處理</p>
        <p type="p">142:通訊介面</p>
        <p type="p">144:記憶體</p>
        <p type="p">146:電致發光測試處理AI模組</p>
        <p type="p">148:電致發光測試處理資料庫</p>
        <p type="p">150:電致發光測試後處理</p>
        <p type="p">152:通訊介面</p>
        <p type="p">154:記憶體</p>
        <p type="p">156:電致發光測試後處理AI模組</p>
        <p type="p">158:電致發光測試後處理資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1317" publication-number="202617756">
    <tif-files tif-type="multi-tif">
      <tif file="114122309.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於預防或治療脂質代謝疾病之三重ＧＬＰ－１／ＧＩＰ／升糖素受體促效劑及包含該促效劑之醫藥組成物</chinese-title>
        <english-title>TRIPLE GLP-1/GIP/GLUCAGON RECEPTOR AGONIST AND PHARMACEUTICAL COMPOSITION COMPRISING SAME FOR PREVENTING OR TREATING LIPID METABOLISM DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C07K14/605</main-classification>
        <further-classification edition="200601120260126B">A61K38/26</further-classification>
        <further-classification edition="200601120260126B">A61P3/06</further-classification>
        <further-classification edition="200601120260126B">C07K1/107</further-classification>
        <further-classification edition="201701120260126B">A61K47/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓美藥品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANMI PHARM. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金佑韓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YO HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG KUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴恩珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUN JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種對GLP-1、GIP和升糖素受體具有活性之三重促效劑在預防或治療脂質代謝疾病的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to use of a triple agonist with activity to GLP-1, GIP, and glucagon receptors for the prevention or treatment of lipid metabolism diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1318" publication-number="202617990">
    <tif-files tif-type="multi-tif">
      <tif file="114122312.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於抑制病毒之方法及組成物</chinese-title>
        <english-title>METHODS AND COMPOSITIONS FOR INHIBITING VIRUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N15/113</main-classification>
        <further-classification edition="200601120260202B">A61K31/712</further-classification>
        <further-classification edition="200601120260202B">A61K31/7115</further-classification>
        <further-classification edition="200601120260202B">A61P31/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾利格斯醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALIGOS THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔迪孔達　山托許　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THATIKONDA, SANTHOSH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢戈曼　里歐尼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIGELMAN, LEONID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　大衛　伯納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, DAVID BERNARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德賓　雅妮克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEBING, YANNICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷特　勞倫斯　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLATT, LAWRENCE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　勁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉萬施　維韋克　庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJWANSHI, VIVEK KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於具有增強螺旋度的STOPS&lt;sup&gt;™&lt;/sup&gt;抗病毒化合物的衍生物，其中該等化合物係S-抗原轉運抑制寡核苷酸聚合物。本申請案進一步係關於用於製造該等化合物的程序以及使用該等化合物治療疾病及病況的方法。在一些實施例中，該等疾病及病況係關於B型肝炎及/或D型肝炎。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to derivatives of STOPS&lt;sup&gt;™&lt;/sup&gt; antiviral compounds having enhanced helicity, wherein the compounds are S-antigen transport inhibiting oligonucleotide polymers. This application further relates to processes for making the compounds and methods of using them to treat diseases and conditions. In some embodiments, the diseases and conditions are related to hepatitis B and/or hepatitis D.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1319" publication-number="202619181">
    <tif-files tif-type="multi-tif">
      <tif file="114122323.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力連接器</chinese-title>
        <english-title>POWER CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250903B">H01R13/40</main-classification>
        <further-classification edition="200601120250903B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪永熾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電力連接器，包括絕緣本體及兩電力端子，絕緣本體設有向前貫穿的對接槽，兩電力端子分別位於對接槽的橫向兩側；每一電力端子至少包括第一端子片及第二端子片，第二端子片貼附於第一端子片的橫向外側，第一端子片包括第一基部、自第一基部向前延伸的複數第一彈性臂及自第一彈性臂末端弧型彎折的第一接觸部，第二端子片包括第二基部、自第二基部向前延伸的複數第二彈性臂及自第二彈性臂末端弧型彎折的第二接觸部，第二接觸部設有開口，第一接觸部局部延伸入所述開口，增大了第一、第二彈性臂的側向尺寸，加大電流通過，改善了溫升問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a power connector comprises an insulative body and two power terminals. The insulative body includes a mating slot extending forward, and the two electrical terminals are respectively positioned on the lateral sides of the mating slot. Each electrical terminal includes at least a first terminal blade and a second terminal blade. The second terminal blade is attached to the lateral outer side of the first terminal blade. The first terminal blade includes a first base portion, a plurality of first elastic arms extending forward from the first base portion, and a first contact portion bent from the end of the first elastic arm in the arcuate shape. The second terminal blade includes a second base portion, a plurality of second elastic arms extending forward from the second base portion, and a second contact portion bent from the end of the second elastic arm in the arcuate shape. The second contact portion has an opening, into which the first contact portion partially extends so that the lateral dimensions of the first and second elastic arms get increased as well as the current-carrying capacity to effectively addresses the issue of temperature rise .</p>
      </isu-abst>
      <representative-img>
        <p type="p">313:第一接觸部</p>
        <p type="p">323:第二接觸部</p>
        <p type="p">324:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1320" publication-number="202617727">
    <tif-files tif-type="multi-tif">
      <tif file="114122335.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向B7-H3和PSMA的雙特異性抗體及抗體-藥物偶聯物</chinese-title>
        <english-title>BISPECIFIC ANTIBODIES AND ANTIBODY-DRUG CONJUGATES TARGETING B7-H3 AND PSMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D491/22</main-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔志鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, ZHIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝紅梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, HONGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何衛明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, WEIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟文強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAI, WENQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊方龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FANGLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　立忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JOHN LIUZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供靶向B7-H3和PSMA的雙特異性抗體以及抗體-藥物偶聯物，以及它們用於治療腫瘤的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are bispecific antibodies and antibody-drug conjugates targeting B7-H3 and PSMA, and use thereof in the treatment of tumors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1321" publication-number="202617887">
    <tif-files tif-type="multi-tif">
      <tif file="114122343.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title>RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C08L83/07</main-classification>
        <further-classification edition="200601120260123B">C08L83/05</further-classification>
        <further-classification edition="200601120260123B">C04B35/581</further-classification>
        <further-classification edition="200601120260123B">B01J23/42</further-classification>
        <further-classification edition="201801120260123B">C08K3/014</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今坂祐作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMASAKA, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯田健文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIDA, TAKEFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的樹脂組成物包含分子內具有1個以上與矽原子鍵結之烯基的直鏈狀聚矽氧烷(A)、氫有機聚矽氧烷(B)、導熱性填料(C)和鉑觸媒(D)，其中，直鏈狀聚矽氧烷(A)的黏度在25℃中為100mPa・s以下，相對於整個樹脂組成物，與矽原子鍵結的烯基之物質量係在8.3至26.0μmol/g的範圍內，相對於直鏈狀聚矽氧烷(A)100質量份，氫有機聚矽氧烷(B)的含量為1.0至50.0質量份，相對於整個樹脂組成物，導熱性填料(C)的含量係大於80體積%，相對於直鏈狀聚矽氧烷(A)，鉑觸媒(D)的含量以鉑元素計為0.1至1,000質量ppm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition according to the present invention contains a linear polysiloxane (A) having one or more silicon-bonded alkenyl groups within a molecule, a hydrogen polyorganosiloxane (B), a thermally conductive filler (C), and a platinum catalyst (D); wherein the linear polysiloxane (A) has a viscosity of 100 mPa・s or less at 25°C, the amount of the silicon-bonded alkenyl groups relative to the entire resin composition is in the range of 8.3 to 26.0 μmol/g, the content of the hydrogen polyorganosiloxane (B) per 100 parts by mass of the linear polysiloxane (A) is 1.0 to 50.0 parts by mass, the content of the thermally conductive filler (C) relative to the entire resin composition is greater than 80% by volume, and the content of the platinum catalyst (D) relative to the linear polysiloxane (A) is 0.1 to 1,000 ppm by mass in terms of the platinum element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1322" publication-number="202617767">
    <tif-files tif-type="multi-tif">
      <tif file="114122345.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用ＣＤ２８／ＯＸ４０雙特異性抗體的實體器官移植受試者的治療</chinese-title>
        <english-title>TREATMENT OF SOLID ORGAN TRANSPLANT SUBJECTS WITH CD28/OX40 BISPECIFIC ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P37/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利西拉　拉米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LISSILAA, RAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇拉特　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURATT, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯　傑西卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOSS, JESSICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了用於治療或預防有需要的受試者的實體器官移植排斥反應之方法，該等方法包括向該受試者投與多特異性結合蛋白，該等多特異性結合蛋白包含 (a) 對CD28具有結合特異性的第一抗原結合結構域（ABD），該第一抗原結合結構域包含免疫球蛋白單可變結構域（ISVD）（例如，VHH）；以及 (b) 對OX40具有結合特異性的第二ABD，該第二ABD包含免疫球蛋白重鏈可變結構域（VH）和免疫球蛋白輕鏈可變結構域（VL）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods for the treatment or prevention of solid organ transplant rejection in a subject in need thereof, comprising administering to the subject a multispecific binding proteins comprising (a) a first antigen binding domain (ABD) comprising an immunoglobulin single variable domain (ISVD) (e.g., VHH) with binding specificity to CD28; and (b) a second ABD comprising an immunoglobulin heavy chain variable domain (VH) and an immunoglobulin light chain variable domain (VL) with binding specificity to OX40.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1323" publication-number="202617179">
    <tif-files tif-type="multi-tif">
      <tif file="114122359.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗PD-L1抗體和抗CTLA-4抗體聯合治療腫瘤</chinese-title>
        <english-title>COMBINED TREATMENT OF TUMORS WITH ANTI-PD-L1 ANTIBODIES AND ANTI-CTLA-4 ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K39/395</main-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海盛迪醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI SHENGDI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王姝妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耿皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
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                <last-name>孫穎</last-name>
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                <last-name>SUN, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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                <last-name>唐芊</last-name>
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                <last-name>TANG, QIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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                <last-name>李偉霞</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LI, WEIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>洪武雄</last-name>
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              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
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              <address>臺北市</address>
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        <p type="p">本揭露涉及抗PD-L1抗體和抗CTLA-4抗體聯合治療腫瘤。具體而言，本公涉及抗PD-L1抗體聯合抗CTLA-4抗體治療腫瘤的方法及醫藥用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to the combined treatment of tumors with anti-PD-L1 antibodies and anti-CTLA-4 antibodies. Specifically, the disclosure relates to a method and pharmaceutical use for treating tumors using anti-PD-L1 antibodies in combination with anti-CTLA-4 antibodies.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
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  <tw-patent-application no="1324" publication-number="202617721">
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          <doc-number>114122367</doc-number>
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      <invention-title>
        <chinese-title>化合物、組成物及方法</chinese-title>
        <english-title>COMPOUNDS, COMPOSITIONS, AND METHODS</english-title>
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        <main-classification edition="200601120260202B">C07D487/04</main-classification>
        <further-classification edition="200601120260202B">C07D519/00</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
        <further-classification edition="200601120260202B">A61P3/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>美商騰維療法股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENVIE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>巴達薩里恩　艾力克斯　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAGDASARIAN, ALEX L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>布切爾　西里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHER, CYRIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>奎格　羅伯特　Ａ　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAIG, ROBERT A. II</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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                <last-name>迪　文森提　費達戈　賈維爾</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>DE VICENTE FIDALGO, JAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>艾斯卓達　安東尼　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESTRADA, ANTHONY A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福克斯　布萊恩　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX, BRIAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>賀夫曼　班傑明　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUFFMAN, BENJAMIN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>萊克薩　卡特琳娜　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEXA, KATRINA W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>歐希波夫　邁可森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSIPOV, MAKSIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <inventor app-type="applicant" sequence="10">
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              <chinese-name name-type="organization">
                <last-name>維登　約翰　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIDEN, JOHN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本揭示案概言之係關於黏脂素-1 (TRPML1)之小分子調節劑及其作為治療劑之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally relates to small molecule modulators of Mucolipin-1 (TRPML1), and their use as therapeutic agents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1325" publication-number="202617840">
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          <doc-number>202617840</doc-number>
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        <document-id>
          <doc-number>114122381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板的製造方法及膜形成用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G79/00</main-classification>
        <further-classification edition="200601120260202B">C09D1/00</further-classification>
        <further-classification edition="200601120260202B">G03F7/09</further-classification>
        <further-classification edition="200601120260202B">G03F7/11</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
        <further-classification edition="200601120260202B">H01L21/304</further-classification>
        <further-classification edition="200601120260202B">H01L21/3065</further-classification>
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                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>尾崎優貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>芹澤龍一</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SERIZAWA, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>木股寛統</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMATA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
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              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明提供一種膜形成時的基板的周緣部的清洗性良好且能夠形成耐蝕刻性優異的膜（金屬硬遮罩）的半導體基板的製造方法及膜形成用組成物。一種半導體基板的製造方法，包括於基板上塗敷膜形成用組成物的步驟，所述膜形成用組成物含有由至少一種金屬原子及至少一種有機酸構成的金屬化合物、以及溶媒，所述金屬原子是金屬氟化物時的沸點為700℃以上的金屬原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
        <p type="p">無</p>
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    </description>
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  <tw-patent-application no="1326" publication-number="202619321">
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          <doc-number>114122390</doc-number>
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      <invention-title>
        <chinese-title>用於動態峰值控制的連續時間線性均衡器(CTLE)電路及其方法</chinese-title>
        <english-title>A CONTINUOUS TIME LINEAR EQUALIZER (CTLE) CIRCUIT FOR DYNAMIC PEAKING CONTROL AND METHODS THEREOF</english-title>
      </invention-title>
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        <main-classification edition="200601120260131B">H04L25/03</main-classification>
        <further-classification edition="200601120260131B">H03H11/04</further-classification>
        <further-classification edition="200601120260131B">H03F3/45</further-classification>
        <further-classification edition="200601120260131B">H03H11/54</further-classification>
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                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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                <last-name>西塔蘭　馬諾哈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEETHARAM, MANOHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
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              <chinese-name name-type="organization">
                <last-name>瑞迪　阿　桑托什　庫馬爾</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>REDDY, A SANTOSH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
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              <chinese-name name-type="organization">
                <last-name>雷薩姆　戈平納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYASAM, GOPINATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
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              <chinese-name name-type="organization">
                <last-name>莫爾塔蒂　拉格文德拉</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>MOLTHATI, RAGHAVENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IN</english-country>
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          <inventor app-type="applicant" sequence="5">
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              <chinese-name name-type="organization">
                <last-name>哈兹拉　塞卡特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAZRA, SAIKAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森　蘇拉迪普</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SEN, SOURADIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IN</english-country>
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          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　塔毛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, TAMAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連續時間線性均衡器（CTLE）電路包括：一或多個可調諧開關，位於一或多個負載電感器的差動節點兩端，其中所述一或多個可調諧開關被配置成控制電感器峰值；一或多個溫度相依偏壓電壓區塊，連接至所述一或多個可調諧開關，其中所述一或多個溫度相依偏壓電壓區塊被配置成藉由控制所述一或多個可調諧開關的閘極來對溫度相依劣化進行補償；以及一或多個製程變化管理區塊，連接至所述一或多個可調諧開關，其中所述一或多個製程變化管理區塊被配置成對製程變化進行補償。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A continuous time linear equalizer (CTLE) circuit includes one or more tunable switches across differential nodes of one or more load inductors wherein the one or more tunable switches are configured to control inductor peaking, one or more temperature dependent bias voltage blocks connected to the one or more tunable switches, wherein the one or more temperature dependent bias voltage blocks are configured compensate for temperature dependent degradation by controlling gates of the one or more tunable switches, and one or more process variation management blocks connected to the one or more tunable switches, wherein the one or more process variation management blocks is configured to compensate for a process variation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連續時間線性均衡器(CTLE)電路</p>
        <p type="p">I&lt;sub&gt;5&lt;/sub&gt;,410:第二開關</p>
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;,402:負載電感器/電感器</p>
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;,404:負載電感器/電感器</p>
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;,402:寄生電阻器</p>
        <p type="p">R&lt;sub&gt;2&lt;/sub&gt;,404:寄生電阻器</p>
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;,404:可調諧開關/開關</p>
        <p type="p">V&lt;sub&gt;1&lt;/sub&gt;,402:溫度相依偏壓電壓區塊/溫度相依電壓源</p>
        <p type="p">V&lt;sub&gt;2&lt;/sub&gt;,404:第一開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1327" publication-number="202617965">
    <tif-files tif-type="multi-tif">
      <tif file="114122400.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>柑橘風味飲料及柑橘風味飲料之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12G3/06</main-classification>
        <further-classification edition="200601120260202B">A23L2/00</further-classification>
        <further-classification edition="200601120260202B">A23L2/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日集團控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI GROUP HOLDINGS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日啤酒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI BREWERIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上明大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, MINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種飲料及其製造方法，該飲料藉由利用於飲料中隨時間增加之對異丙基甲苯，實現香味上之新穎之價值，即降低類油墨香氣之強度，增強香味複雜性。  &lt;br/&gt;本發明係一種容器包裝柑橘風味飲料，其對異丙基甲苯濃度為125 μg/L以上，並且相對於對異丙基甲苯濃度，α-萜品醇濃度為12倍以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1328" publication-number="202618849">
    <tif-files tif-type="multi-tif">
      <tif file="114122401.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適應性停留時間顯微鏡技術</chinese-title>
        <english-title>ADAPTIVE DWELL TIME MICROSCOPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01J37/28</main-classification>
        <further-classification edition="200601120260126B">H01J37/10</further-classification>
        <further-classification edition="200601120260126B">H01J37/244</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＥＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基夫特　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIEFT, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　弗里斯　蘭伯特斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE VRIES, LAMBERTUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比肖夫　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISCHOFF, MAARTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗賴塔格　伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREITAG, BERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里嫩　魯德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRIJNEN, RUUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費伯　派比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FABER, PYBE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於顯微鏡中之適應性像素停留時間的使用方法，其包括：以掃描模式使光束源所發射之光束掃描樣品，從而使光束於第一掃描位置與樣品產生交互作用。在某些範例中，該方法包括至少藉由顯微鏡的探測器，監測與樣品第一掃描位置相關之第一累積粒子數量，其中該第一累積粒子數量對應於光束在該位置與樣品的交互作用。在其他範例中，該方法包括於第一停留時間結束後、且於第一停留期屆滿前，若符合訊號標準，則根據所述掃描模式，將光束移至樣品的第二掃描位置，其中該訊號標準係基於第一累積粒子數量所定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for adaptive pixel dwell time usage in a microscope that includes scanning a beam emitted by a beam source over a sample in a scan pattern such that the beam interacts with the sample at a first scanning location according to the scan pattern. In some examples, the method includes monitoring, by at least using a detector of the microscope, a first cumulative number of particles associated with the first scanning location of the sample such that the first cumulative number of particles correspond to an interaction of the beam with the sample at the first scanning location. In some examples, the method includes moving, after a first dwell time and before a first dwell period elapses, the beam to a second scanning location of the sample according to the scan pattern if a signal criterion is met such that the signal criterion is based on the first cumulative number of particles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:掃描顯微鏡系統</p>
        <p type="p">101:掃描電子顯微鏡</p>
        <p type="p">102:電子源</p>
        <p type="p">103:陽極</p>
        <p type="p">104:聚光透鏡</p>
        <p type="p">105:掃描線圈</p>
        <p type="p">106:物鏡</p>
        <p type="p">107:電子束</p>
        <p type="p">108:樣品</p>
        <p type="p">109:第一發射</p>
        <p type="p">110:第二發射</p>
        <p type="p">111:第一探測器</p>
        <p type="p">112:第二探測器</p>
        <p type="p">113:可移動平台</p>
        <p type="p">114:第二探測器的中心線</p>
        <p type="p">200a:控制單元</p>
        <p type="p">200b:真空控制器</p>
        <p type="p">210:機械泵系統</p>
        <p type="p">220:超高真空泵</p>
        <p type="p">230:真空室</p>
        <p type="p">250:數據處理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1329" publication-number="202617208">
    <tif-files tif-type="multi-tif">
      <tif file="114122402.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>A CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61M39/18</main-classification>
        <further-classification edition="200601120260123B">A61M39/10</further-classification>
        <further-classification edition="202301120260123B">A61J1/00</further-classification>
        <further-classification edition="200601120260123B">C12M1/26</further-classification>
        <further-classification edition="200601120260123B">A61J1/20</further-classification>
        <further-classification edition="200601120260123B">C12M1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商奧瑞生物技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIBIOTECH LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　湯瑪士　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKER, THOMAS EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種連接器，其包含：外殼；流體導管，其至少部分地設置於該外殼內；致動機構，其經構形以致使該流體導管與閥元件之間的相對移動以使該流體導管能夠可操作地接合該閥元件，由此透過該流體導管及該閥元件提供流體連通；及鎖定機構，其包括可樞轉以便鎖定或解鎖該致動機構之至少一個鎖定元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a connector including a housing, a fluid conduit provided at least partially within the housing, an actuating mechanism configured to cause relative movement between the fluid conduit and the valve element to enable the fluid conduit to operably engage the valve element, thereby providing a fluid communication through the fluid conduit and the valve element, and a locking mechanism comprising at least one locking element pivotable so as to lock or unlock the actuating mechanism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器</p>
        <p type="p">102:外殼</p>
        <p type="p">104:遠端</p>
        <p type="p">106:近端</p>
        <p type="p">108:外蓋</p>
        <p type="p">110:扁平後壁</p>
        <p type="p">112:彎曲前壁</p>
        <p type="p">114:縱向延伸狹槽</p>
        <p type="p">118:蓋帽</p>
        <p type="p">122:容器接納部分</p>
        <p type="p">124:內螺釘螺紋部分</p>
        <p type="p">126:防旋轉螺紋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1330" publication-number="202618845">
    <tif-files tif-type="multi-tif">
      <tif file="114122410.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組、設備、及使用模組之方法</chinese-title>
        <english-title>MODULE, APPARATUS, AND METHOD OF USING THE MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01J37/20</main-classification>
        <further-classification edition="200601120260120B">H01J37/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史忻閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, XINYUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瀛龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YINGLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　賀蒙　馬卓恩　配特思　克力司提安斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN HEUMEN, MARTIJN PETRUS CHRISTIANUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於測量一基板支撐件上之一基板之夾持狀態的模組。該模組包含一接腳，該接腳經配置使得在一基板置放於該基板支撐件上時，該接腳藉由與該基板之鄰近於該接腳的一局部區接觸而位移。該模組進一步包含一感測器，該感測器經組態以基於該接腳之移動而判定該基板之該局部區與該基板支撐件之間的一距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a module for measuring clamping status of a substrate on a substrate support. The module comprises a pin arranged such that, when a substrate is placed on the substrate support, the pin is displaced by contact with a local region of the substrate adjacent to the pin. The module further comprises a sensor configured to determine a distance between the local region of the substrate and the substrate support based on movement of the pin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">207:基板支撐件</p>
        <p type="p">208:基板</p>
        <p type="p">277:對向表面</p>
        <p type="p">400:模組</p>
        <p type="p">410:接腳</p>
        <p type="p">420:感測器</p>
        <p type="p">421:類比轉數位轉換器</p>
        <p type="p">430:傳輸線</p>
        <p type="p">431:放大器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1331" publication-number="202617814">
    <tif-files tif-type="multi-tif">
      <tif file="114122412.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共聚物、用於無機粉體的分散劑、及漿料組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F290/06</main-classification>
        <further-classification edition="202201120260202B">C09K23/42</further-classification>
        <further-classification edition="202201120260202B">C09K23/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOF CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小室晴香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMURO, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>灰本陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAIMOTO, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的技術問題在於提供一種即使在將水、有機溶劑用作溶媒的情況下、或者提高了粉體濃度的情況下，也能使無機粉體良好地分散，將漿料組合物的黏度調整得較低的共聚物。其解決手段為一種共聚物，其為包含成分(a)、成分(b)及成分(c)作為結構單元的共聚物，所述成分(a)為式(1) R&lt;sup&gt;1&lt;/sup&gt;O(C&lt;sub&gt;2&lt;/sub&gt;H&lt;sub&gt;4&lt;/sub&gt;O)&lt;sub&gt;m&lt;/sub&gt;R&lt;sup&gt;2&lt;/sup&gt;所表示的聚氧乙烯化合物，所述成分(b)為式(2) R&lt;sup&gt;3&lt;/sup&gt;O(AO)&lt;sub&gt;n&lt;/sub&gt;R&lt;sup&gt;4&lt;/sup&gt;所表示的聚氧化烯化合物，所述成分(c)為馬來酸系化合物，所述共聚物中，所述成分(a)與所述成分(b)的合計的比例為40莫耳%以上，且所述成分(a)與所述成分(b)的莫耳比((a):(b))為97:3~50:50。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1332" publication-number="202618408">
    <tif-files tif-type="multi-tif">
      <tif file="114122424.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼鏡</chinese-title>
        <english-title>EYEWARE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">G02C5/00</main-classification>
        <further-classification edition="200601120260131B">G02C5/06</further-classification>
        <further-classification edition="200601120260131B">G02C5/20</further-classification>
        <further-classification edition="200601120260131B">G02C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商睛姿控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINS HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅田敬一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASADA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種具備鏡腳長調整機構之眼鏡，其應對例如希望在調整時無須摘戴而可簡便地與頭部完美貼合之要求，又，特別是應對在兒童之佩戴時，希望配合成長而持續使用、希望安全地佩戴等來自監護人等之要求。&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;本發明之眼鏡包含：鏡框；鏡腳，其在和與鏡框經由鉸鏈連接之前端為相反之後端設置具有開口之母螺紋部；腳套，其設置有插通孔，包含鏡腳之後端之後端部藉由插入於該插通孔而可向鏡腳之延伸方向相對地進退；螺旋彈簧，其收容於插通孔而對鏡腳與腳套之間施加彈簧力；及調整螺釘，其以主體部貫通螺旋彈簧之方式插入於插通孔而公螺紋部螺合於母螺紋部，藉由調整公螺紋部與母螺紋部之螺合量，而調整鏡腳之後端部收容於插通孔之收容長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided eyewear equipped with a temple length adjustment mechanism to respond to demand from parents and the like, including demand to make the eyewear just fit the head so simply that there will be no need to put on and take off the eyewear, for example, in making adjustments, or when the eyewear is worn by children, in particular, demand to continue using the eyewear by keeping pace with the growth of the children or to allow the children to wear the eyewear safely. Eyewear includes: a lens frame; a temple provided with a female thread part having an opening in a rear end opposite a front end connected to the lens frame via a hinge; a temple tip provided with an insertion hole that enables relative forward and backward movement in an extending direction of the temple when a rear end portion including the rear end of the temple is pushed in; a coil spring that applies a spring force between the temple and the temple tip by being contained in the insertion hole; and an adjustment screw configured to adjust containment length by which the rear end portion of the temple is contained in the insertion hole when a shank is pushed into the insertion hole with the shank penetrating the coil spring, a male thread part is screwed into the female thread part, and a threading amount between the male thread part and the female thread part is adjusted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">140:鏡腳</p>
        <p type="p">140a:後端面</p>
        <p type="p">140b:後端部</p>
        <p type="p">141:母螺紋部</p>
        <p type="p">150:腳套</p>
        <p type="p">151:延伸部</p>
        <p type="p">151a:內側面</p>
        <p type="p">151b:外側面</p>
        <p type="p">152:彎曲部</p>
        <p type="p">153:插通孔</p>
        <p type="p">153a:後部開口緣</p>
        <p type="p">160:調整螺釘</p>
        <p type="p">161:主體部</p>
        <p type="p">162:公螺紋部</p>
        <p type="p">163:螺釘頭</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1333" publication-number="202617609">
    <tif-files tif-type="multi-tif">
      <tif file="114122427.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬複合氧化物、複合體、觸媒油墨、氧產生觸媒及電極、以及金屬複合氧化物及複合體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C01G55/00</main-classification>
        <further-classification edition="200601120260202B">B01J23/46</further-classification>
        <further-classification edition="202101120260202B">C25B1/04</further-classification>
        <further-classification edition="202101120260202B">C25B11/081</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原国豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, GUOHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小寺史晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODERA, FUMIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁建軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JIANJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大坪尚人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUBO, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之金屬複合氧化物含有鉀、銥、釕及氧。前述金屬複合氧化物含有銥與釕之複合氧化物作為必要成分，並含有錳鋇礦結構之KRu&lt;sub&gt;4&lt;/sub&gt;O&lt;sub&gt;8&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1334" publication-number="202618055">
    <tif-files tif-type="multi-tif">
      <tif file="114122434.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板支撐件用冷卻劑流控制系統</chinese-title>
        <english-title>COOLANT FLOW CONTROL SYSTEM FOR SUBSTRATE SUPPORTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C23C16/458</main-classification>
        <further-classification edition="200601120260119B">C23C16/46</further-classification>
        <further-classification edition="200601120260119B">C23C16/509</further-classification>
        <further-classification edition="200601120260119B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬侯羅　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAROHL, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　索瑞什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, SAURISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱拉納瓦　亞提斯雅　烏梅什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALLANNAVAR, ATITHYA UMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里斯納帕　薩蒂莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAPPA, SATHISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>察翠　安伯瑞許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHHATRE, AMBARISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包含：基板支撐件，包含冷卻通道；冷卻劑供應源，配置成供應冷卻劑；以及流控制系統，配置成接收來自冷卻劑供應源的冷卻劑，並將冷卻劑供應至冷卻通道，且選擇性地將冷卻劑的一部分加以導流使其不流至冷卻通道。流控制系統包含閥和計量器。該閥配置成接收來自冷卻劑供應源的冷卻劑流體，以將冷卻劑流體的第一部分供應至基板支撐件中的冷卻通道，並選擇性地將冷卻劑流體的第二部分加以導流使其不流至冷卻通道。計量器配置成收集來自該閥的冷卻劑流率資訊，且該流控制系統配置成基於該資訊將冷卻劑流體的一部分導流至冷卻劑供應源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system comprises a substrate support comprising a cooling channel, a coolant supply configured to supply a coolant, and a flow control system configured to receive the coolant from the coolant supply and to supply the coolant to the cooling channel and to selectively divert a portion of the coolant from flowing to the cooling channel. The flow control system comprises a valve and a meter. The valve is configured to receive coolant fluid from a coolant supply, to supply a first portion of the coolant fluid to a cooling channel in a substrate support, and to selectively divert a second portion of the coolant fluid from flowing to the cooling channel. The meter is configured to collect coolant flow rate information from the valve, and the flow control system is configured to divert a portion of the coolant fluid to the coolant supply based on the information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200-1:冷卻劑流控制系統、FCS</p>
        <p type="p">202:冷卻劑供應系統</p>
        <p type="p">204:基板支撐件</p>
        <p type="p">206:冷卻通道</p>
        <p type="p">208:加熱器</p>
        <p type="p">210:溫度感測器</p>
        <p type="p">212:電源供應器</p>
        <p type="p">214:系統控制器</p>
        <p type="p">215:溫度感測器</p>
        <p type="p">220:旁通流控制閥、旁通閥</p>
        <p type="p">222:流計量器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1335" publication-number="202618222">
    <tif-files tif-type="multi-tif">
      <tif file="114122448.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軌道高度檢測方法、軌道高度調整方法、及軌道高度檢測裝置</chinese-title>
        <english-title>RAIL HEIGHT DETECTION METHOD, RAIL HEIGHT ADJUSTMENT METHOD, AND RAIL HEIGHT DETECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">G01C5/00</main-classification>
        <further-classification edition="200601120260124B">B65G49/07</further-classification>
        <further-classification edition="200601120260124B">B65G35/00</further-classification>
        <further-classification edition="200601120260124B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益井和輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">軌道高度檢測方法具備受光裝置設置步驟S12及高度檢測步驟S13，前述受光裝置設置步驟S12是將受光側保持裝置以已於上下方向上定位於軌道之測定地點的狀態設置，並且將保持於受光側保持裝置的受光裝置設成可從投光裝置接收雷射光的方向；前述高度檢測步驟S13是從投光裝置將雷射光沿著水平方向投射，並且使投射雷射光的方向繞著上下軸心旋繞，藉由受光裝置來檢測以該受光裝置為基準的雷射光的受光高度；一邊使測定地點沿著軌道移動，一邊反覆進行受光裝置設置步驟S12及高度檢測步驟S13。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11:投光裝置設置步驟</p>
        <p type="p">S12:受光裝置設置步驟</p>
        <p type="p">S13:高度檢測步驟</p>
        <p type="p">S14:基準地點變更步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1336" publication-number="202617991">
    <tif-files tif-type="multi-tif">
      <tif file="114122462.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脂質—聚核酸結合物組合物及其用途</chinese-title>
        <english-title>LIPID-POLYNUCLEIC ACID CONJUGATE COMPOSITIONS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N15/113</main-classification>
        <further-classification edition="200601120260202B">C07H21/04</further-classification>
        <further-classification edition="200601120260202B">A61K31/713</further-classification>
        <further-classification edition="201701120260202B">A61K47/54</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商靖因藥業（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIRIUS THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉德肖　柯特　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRADSHAW, CURT W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼古拉斯　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHOLAS, ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示聚核酸結合物組合物，其包含聚核酸分子及一或多個用於將該聚核酸分子靶向遞送至目標細胞的靶向部分，諸如去唾液酸糖蛋白受體靶向部分及親脂性部分。本發明亦揭示醫藥組合物，其包含聚核酸結合物組合物。此外，本發明提供本文所描述之聚核酸結合物組合物及包含聚核酸結合物組合物之醫藥組合物的方法及/或用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are polynucleic acid conjugate compositions comprising a polynucleic acid molecule and one or more targeting moiety such as an asialoglycoprotein receptor targeting moiety and a lipophilic moiety, for targeted delivery of the polynucleic acid molecule to a target cell. Disclosed herein are also pharmaceutical compositions comprising polynucleic acid conjugate composition. Further, provided herein are methods and/or uses of polynucleic acid conjugate composition and pharmaceutical composition comprising polynucleic acid conjugate composition described herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1337" publication-number="202618102">
    <tif-files tif-type="multi-tif">
      <tif file="114122469.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衛生洗淨裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">E03D9/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田純旗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, JUNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神祐紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田雄也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, KATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎恒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種能夠抑制高度的衛生洗淨裝置。本發明提供一種衛生洗淨裝置，其特徵為，具備：殼；噴嘴單元，具有以向上方凸出的方式彎曲的洗淨噴嘴且在所述殼與便器之間進行進退移動；齒條，被連接於所述噴嘴單元且具有撓性；齒輪，與所述齒條發生嚙合；驅動馬達，經由所述齒輪使所述齒條移動，由此使所述噴嘴單元進行進退；齒條導件，引導所述齒條；及支撐部，可滑動地支撐所述噴嘴單元，所述支撐部具有上面以向上方凸出的方式彎曲的噴嘴配置部，所述上面具有：頂部；第1傾斜面，從所述頂部伴隨靠近前方而下降；及第2傾斜面，從所述頂部伴隨靠近後方而下降，收納狀態的所述洗淨噴嘴在上下方向上與所述頂部發生重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">42:噴嘴配置部</p>
        <p type="p">42t:上面</p>
        <p type="p">49:頂部</p>
        <p type="p">49a:第1傾斜面</p>
        <p type="p">49b:第2傾斜面</p>
        <p type="p">60:噴嘴單元</p>
        <p type="p">85:洗淨噴嘴</p>
        <p type="p">C60:中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1338" publication-number="202618103">
    <tif-files tif-type="multi-tif">
      <tif file="114122470.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衛生洗淨裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">E03D9/08</main-classification>
        <further-classification edition="201801120260128B">B05B15/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田純旗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, JUNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神祐紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田雄也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, KATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎恒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種能夠抑制水滴落的衛生洗淨裝置。本發明提供一種衛生洗淨裝置，其特徵為，具備：殼；及噴嘴單元，在所述殼與便器之間進行進退移動，所述噴嘴單元具有：洗淨噴嘴，具有向人體局部吐水的吐水口；及流路切換閥，切換向所述吐水口供水的流路的通水與止水，在所述洗淨噴嘴已被收納的狀態下，所述吐水口位於與所述流路切換閥的流入口相比更靠近上方的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:支撐部</p>
        <p type="p">44:噴嘴清洗部</p>
        <p type="p">44b:突出部</p>
        <p type="p">44c:清洗部流入口</p>
        <p type="p">60:噴嘴單元</p>
        <p type="p">70:流路切換閥</p>
        <p type="p">74a:噴出流出口</p>
        <p type="p">74b:流入口</p>
        <p type="p">74c:主體清洗流出口</p>
        <p type="p">78a:突出部</p>
        <p type="p">78b:突出部</p>
        <p type="p">78c:突出部</p>
        <p type="p">83:吐水口</p>
        <p type="p">85:洗淨噴嘴</p>
        <p type="p">H74b:高度</p>
        <p type="p">H75b:高度</p>
        <p type="p">H83:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1339" publication-number="202617448">
    <tif-files tif-type="multi-tif">
      <tif file="114122488.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝訂具，以及活頁夾</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B42F13/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國譽股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐野千畝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANO, CHIUNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤顕裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎裕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">係能夠提供一種裝訂具，其不僅能夠穩定地裝訂具有裝訂孔之文件，且使用者容易操作。因此，裝訂具(A)，係具有構成為包含作為複數個裝訂環之非鎖定環(C)及鎖定用環(D)之第一環群(G1)、第二環群(G2)，以及第三環群(G3)。裝訂具(A)，係構成為僅藉由對於位於第一、第二環群(G1、G2)之間之第三環群(G3)之作為操作用環之鎖定用環(D)施加操作力，便能夠自裝訂文件之閉姿勢變更姿勢為能夠使文件裝卸之開姿勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一連結板</p>
        <p type="p">1t:第一卡合突起</p>
        <p type="p">1w:第一凹部</p>
        <p type="p">2:第二連結板</p>
        <p type="p">2t:第二卡合突起</p>
        <p type="p">2w:第二凹部</p>
        <p type="p">B:基部</p>
        <p type="p">C:非鎖定環</p>
        <p type="p">D:鎖定用環</p>
        <p type="p">c1,d1:第一環構成構件</p>
        <p type="p">c2,d2:第二環構成構件</p>
        <p type="p">d3,d4:卡合部</p>
        <p type="p">G1:第一環群</p>
        <p type="p">G2:第二環群</p>
        <p type="p">G3:第三環群</p>
        <p type="p">m1:第一對向面</p>
        <p type="p">m2:第二對向面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1340" publication-number="202617857">
    <tif-files tif-type="multi-tif">
      <tif file="114122489.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由二氧化矽聚合物網絡形成減少甲醛釋放</chinese-title>
        <english-title>REDUCING FORMALDEHYDE EMISSION FROM SILICA CONTAINING POLYMER NETWORK FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08K3/30</main-classification>
        <further-classification edition="200601120260202B">C08K3/36</further-classification>
        <further-classification edition="200601120260202B">C08K5/5445</further-classification>
        <further-classification edition="200601120260202B">C08K9/06</further-classification>
        <further-classification edition="200601120260202B">C08L21/00</further-classification>
        <further-classification edition="200601120260202B">B60C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商默曼堤效能材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMENTIVE PERFORMANCE MATERIALS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　雷斯利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LESLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕帕斯　克里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPPAS, CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞巴　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYBA, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢搭塞蘭　尤格士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRASEKARAN, YOGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉詹德蘭　卡特希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJENDRAN, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製造橡膠的過程(與所製造的橡膠)特別是包括二氧化矽添加物的輪胎橡膠，其減少、控制、或消除在橡膠製造期間釋放有害甲醛。較佳的二氧化矽系橡膠添加物能夠減少在橡膠製造期間釋放甲醛。過程及/或成分達成優異的橡膠與輪胎的製造，不具有此有害的釋放。可將有效減少甲醛釋放的胺基矽烷(較佳是胺基丙基三乙氧基矽烷)引入至第一橡膠混合程序。替代地，在橡膠加工之前可使用矽烷例如胺基矽烷(較佳是胺基丙基三乙氧基矽烷)或可水解烷氧基甲基胺官能化矽烷(較佳是矽烷化三聚氰胺甲醛樹脂)預處理及/或官能化二氧化矽系添加物。更容易控制且更安全地收集以烷氧基甲基胺官能化矽烷預處理產生的任何甲醛以避免暴露至工作人員。可結合這些方法。可在固化前將胺基矽烷、烷氧基甲基胺官能化矽烷、與烷氧基甲基胺樹脂引入至橡膠混合過程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for manufacturing rubber, (and the rubber produced) especially tire rubber including silica additives, reduces, controls, or eliminates harmful formaldehyde emissions during rubber manufacture. Preferred silica-based rubber additives can reduce formaldehyde emission during rubber manufacturing. The process and/or ingredients lead to the manufacture of exceptional rubber and tires, without such harmful emissions. Aminosilanes (preferably aminopropyltriethoxysilane) effective for reducing formaldehyde emission can be incorporated into the first rubber mixing pass. Alternatively, silanes, such as aminosilanes (preferably aminopropyltriethoxysilane) or hydrolyzable alkoxymethylamino-functional silanes (preferably Silylated Melamine Formaldehyde Resin) can be used to pretreat and/or functionalize the silica-based additives prior to rubber processing. Any formaldehyde generated from the pretreatment with an alkoxymethylamino-functional silane is more easily controlled and more safely collected to avoid exposure to workers. These methods can be combined. Aminosilanes, alkoxymethylamino-functional silanes, and alkoxymethylamino resins can be incorporated into the rubber mixing process prior to curing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1341" publication-number="202617736">
    <tif-files tif-type="multi-tif">
      <tif file="114122507.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種含嘧啶多元并環類衍生物抑制劑的晶型及其製備方法</chinese-title>
        <english-title>CRYSTALLINE FORM OF PYRIMIDINE-FUSED POLYCYCLIC DERIVATIVE INHIBITOR AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D498/22</main-classification>
        <further-classification edition="200601120260202B">A61K31/5386</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊詩怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咼臨松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, LINSONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種含嘧啶多元并環類衍生物抑制劑的晶型及其製備方法。具體涉及一種具有通式(I)化合物的晶型、製備方法和含有治療有效量的該晶型的醫藥組成物以及其在治療癌症中的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a crystalline form of a pyrimidine-fused polycyclic derivative inhibitor and a preparation method thereof. Particularly, it relates to a crystalline form of a compound represented by Formula (I), a preparation method thereof, a pharmaceutical composition containing a therapeutically effective amount of said crystalline form, and its use in the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1342" publication-number="202618348">
    <tif-files tif-type="multi-tif">
      <tif file="114122509.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏光板、偏光件的製造方法及偏光板的製造方法</chinese-title>
        <english-title>POLARIZING PLATE, METHOD FOR MANUFACTURING POLARIZER, AND METHOD FOR MANUFACTURING POLARIZING PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B5/30</main-classification>
        <further-classification edition="200601120260127B">G02F1/1335</further-classification>
        <further-classification edition="200601120260127B">C08K5/21</further-classification>
        <further-classification edition="200601120260127B">C08K5/405</further-classification>
        <further-classification edition="200601120260127B">C08K5/3435</further-classification>
        <further-classification edition="200601120260127B">C09J11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田謙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係抑制由聚乙烯醇系樹脂膜所構成的偏光件中的多烯化。  &lt;br/&gt;偏光板100係具備：在聚乙烯醇系樹脂膜中吸附配向有二色性色素的偏光件101、以及經由接著劑層102積層於偏光件101之至少一面上的保護膜103。接著劑層102係含有脲化合物。偏光件101係含有自由基捕捉劑。脲化合物係選自由脲、脲衍生物、硫脲及硫脲衍生物所構成群組中之至少一種。自由基捕捉劑係受阻胺系化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to suppress polyenization in a polarizer made of a polyvinyl alcohol-based resin film. &lt;br/&gt;A polarizing plate 100 includes a polarizer 101 in which a dichroic dye is adsorbed and oriented on a polyvinyl alcohol-based resin film, and a protective film 103 laminated on at least one surface of the polarizer 101 via an adhesive layer 102. The adhesive layer 102 contains a urea compound. The polarizer 101 contains a radical scavenger. The urea compound is at least one selected from the group consisting of urea, urea derivatives, thiourea and thiourea derivatives. The radical scavenger is a hindered amine compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:偏光板</p>
        <p type="p">101:偏光件</p>
        <p type="p">102:貼合層</p>
        <p type="p">103:第1保護膜</p>
        <p type="p">104:第2保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1343" publication-number="202617782">
    <tif-files tif-type="multi-tif">
      <tif file="114122555.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>關於結合ＳＴＥＡＰ—１蛋白之抗體藥物結合物（ＡＤＣ）的方法及組合物</chinese-title>
        <english-title>METHODS AND COMPOSITIONS RELATED TO ANTIBODY DRUG CONJUGATES (ADCS) THAT BIND STEAP-1 PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/30</main-classification>
        <further-classification edition="200601120260202B">C07D491/22</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德森特克斯治療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADCENTRX THERAPEUTICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商艾德森特克斯治療上海股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADCENTRX THERAPEUTICS SHANGHAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>察莉塔　艾德　皮亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHALLITA-EID, PIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭茂君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, MAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　東駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛特曼　沙賓　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROTTMANN, SABINE G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　理察　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RICHARD H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述結合至STEAP-1蛋白及其變異體之抗體藥物結合物(ADC)。STEAP-1在正常成人組織中展現出組織特異性表現，且在表I中所列之癌症中異常表現。因此，本發明之ADC提供一種用於治療癌症之治療性組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Antibody drug conjugates (ADCs) that bind to STEAP-1 protein(s) and variants thereof are described herein. STEAP-1 exhibits tissue specific expression in normal adult tissue, and is aberrantly expressed in the cancers listed in Table I. Consequently, the ADCs of the invention provide a therapeutic composition for the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1344" publication-number="202618336">
    <tif-files tif-type="multi-tif">
      <tif file="114122557.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618336</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像鏡頭與電子裝置</chinese-title>
        <english-title>IMAGING LENS ASSEMBLY AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260123B">G02B1/115</main-classification>
        <further-classification edition="201501120260123B">G02B1/118</further-classification>
        <further-classification edition="200601120260123B">G02B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀奇瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEI-FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范丞緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴炫叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, SYUAN RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEN-PANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像鏡頭，具有一光軸，包含一透鏡組，透鏡組包含複數個透鏡，所述透鏡沿光軸設置，並包含一第一透鏡以及至少一抗反射膜。第一透鏡包含一第一物側面以及一第一像側面。光軸通過第一物側面。第一像側面沿光軸的方向相對第一物側面設置。抗反射膜設置於第一物側面與第一像側面中的至少一面，抗反射膜包含一奈米結構層以及一中介層。奈米結構層的主要成分為氧化鋁，其包含非定向延伸的複數個脊狀凸起，且脊狀凸起自一底部向一頂部漸縮延伸。透過抗反射膜的脊狀凸起有助於形成漸變折射率，以提供較佳的低反射率表現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging lens assembly has an optical axis, which includes a lens element assembly. The lens element assembly includes a plurality of lens elements. The lens elements are arranged along the optical axis, and include a first lens element and at least one anti-reflection coating. The first lens element includes a first object-side surface and a first image-side surface. The optical axis passes through the first object-side surface. The first image-side surface is disposed relative to the first object-side surface along the optical axis. The anti-reflection coating is disposed on at least one of the first object-side surface and the first image-side surface. The anti-reflection coating includes a nano structure layer and an intermediate layer. The main material of the nano structure layer is Aluminium Oxide. The nano structure layer includes a plurality of ridge-like protrusions extending non-directionaly. Each of the ridge-like protrusions tapers from a bottom to a top. It is favorable for providing better low reflectance performance via the gradient refractive index formed by the ridge-like protrusions of the anti-reflection coating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:第一透鏡</p>
        <p type="p">121:第一物側面</p>
        <p type="p">122:第一像側面</p>
        <p type="p">123:抗反射膜</p>
        <p type="p">1231:中介層</p>
        <p type="p">1232:奈米結構層</p>
        <p type="p">12321:脊狀凸起</p>
        <p type="p">D:第一物側面與第一像側面於鄰近光軸的間距</p>
        <p type="p">H:垂直高度</p>
        <p type="p">X:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1345" publication-number="202619565">
    <tif-files tif-type="multi-tif">
      <tif file="114122568.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D84/83</main-classification>
        <further-classification edition="202501120260123B">H10D30/62</further-classification>
        <further-classification edition="202501120260123B">H10D64/20</further-classification>
        <further-classification edition="201101120260123B">B82Y10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊永鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YOUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洪信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONGSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁絡渶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, NAKYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路裝置包括位於奈米片堆疊結構之間的錘形狀的片分隔壁，藉此提高閘極電極的圖案化裕度並防止或減少有效通道寬度減小。亦即，積體電路裝置可在奈米片場效電晶體中提供增強的穩定效能及改善的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a hammer-shaped sheet separation wall between nanosheet stack structures, thereby improving a patterning margin of a gate electrode and preventing or reducing an effective channel width from being decreased. That is, the integrated circuit device may provide increased stable performance and improved reliability in a nanosheet field-effect transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積體電路裝置</p>
        <p type="p">A-A':線</p>
        <p type="p">A1B:第一寬度</p>
        <p type="p">A2B:第三寬度</p>
        <p type="p">A1H:第二寬度</p>
        <p type="p">A2H:第四寬度</p>
        <p type="p">B1、E1:第一高度</p>
        <p type="p">B2、E2:第二高度</p>
        <p type="p">BSUB:基礎基板層</p>
        <p type="p">C1:厚度</p>
        <p type="p">C2、D2:寬度</p>
        <p type="p">D1:豎直厚度</p>
        <p type="p">FA:鰭型主動區</p>
        <p type="p">FA1:第一鰭型主動區</p>
        <p type="p">FA2:第二鰭型主動區</p>
        <p type="p">GCL:閘極頂蓋層</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">GE11、GE12:第一閘極電極</p>
        <p type="p">GE21:第二閘極電極</p>
        <p type="p">GE22:電極結構</p>
        <p type="p">GOX:閘極介電膜</p>
        <p type="p">IDT:鋸齒形間隔件</p>
        <p type="p">LP:襯墊圖案</p>
        <p type="p">LP1:第一襯墊圖案</p>
        <p type="p">LP2:第二襯墊圖案</p>
        <p type="p">NS:奈米片/最上部奈米片</p>
        <p type="p">NSS:奈米片堆疊結構</p>
        <p type="p">NSS1:第一奈米片堆疊結構</p>
        <p type="p">NSS2:第二奈米片堆疊結構</p>
        <p type="p">STI:溝渠隔離</p>
        <p type="p">SW:片分隔壁</p>
        <p type="p">SW1:第一片分隔壁</p>
        <p type="p">SW2:第二片分隔壁</p>
        <p type="p">SWB:本體</p>
        <p type="p">SWH:頭部</p>
        <p type="p">TRE:溝渠</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1346" publication-number="202617921">
    <tif-files tif-type="multi-tif">
      <tif file="114122580.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生產經再生之熱管理流體組成物之系統及程序</chinese-title>
        <english-title>SYSTEM AND PROCESSES FOR PRODUCING RECLAIMED THERMAL MANAGEMENT FLUID COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K5/04</main-classification>
        <further-classification edition="200601120260202B">F25B45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑　布然克斯　簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN-BLANKS, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱管理流體再生之程序包括收集至少一種經回收之熱管理流體以形成經收集之熱管理流體，該經收集之熱管理流體包含CO&lt;sub&gt;2&lt;/sub&gt;；分析該經收集之熱管理流體，以判定組成物流體並測量雜質；以及基於該分析之結果來處理該經收集之熱管理流體。該分析包括判定該流體之不可冷凝之氣體的含量及CO&lt;sub&gt;2&lt;/sub&gt;含量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process of thermal management fluid reclamation includes collecting at least one recovered thermal management fluid to form a collected thermal management fluid, the collected thermal management fluid comprising CO&lt;sub&gt;2&lt;/sub&gt;; analyzing the collected thermal management fluid to determine a composition fluid and measure impurities; and processing the collected thermal management fluid based on the results of the analysis. The analysis includes determining a content of non-condensable gases and a CO&lt;sub&gt;2&lt;/sub&gt; content of the fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1347" publication-number="202619607">
    <tif-files tif-type="multi-tif">
      <tif file="114122582.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體、鈣鈦礦太陽電池、積層體之製造方法及鈣鈦礦太陽電池之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H10K30/50</main-classification>
        <further-classification edition="200601120260123B">C25D9/08</further-classification>
        <further-classification edition="202301120260123B">H10K30/40</further-classification>
        <further-classification edition="202301120260123B">H10K30/86</further-classification>
        <further-classification edition="201901120260123B">B32B7/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工藤円</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDO, MADOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤幹人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUTO, MIKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可獲得具有優異輸出特性的鈣鈦礦太陽電池之積層體。本發明之積層體係於依序具有透光性電極層、電洞傳輸層、鈣鈦礦層、電子傳輸層及集電極層之鈣鈦礦太陽電池中，成為透光性電極層及電洞傳輸層之積體層；上述積層體具有：成為透光性電極層之導電構件；及被配置於導電構件之表面而成為電洞傳輸層之氧化鎳層；氧化鎳層之膜厚為5.0 nm以上且300.0 nm以下，且上述積層體可滿足條件1及條件2。條件1：藉由對表面未經被覆之導電構件進行循環伏安法而獲得第1循環伏安圖，將該第1循環伏安圖中所出現之陽極峰之峰值電流及峰值電位分別設為電流值A及電位V。藉由對積層體進行循環伏安法而獲得第2循環伏安圖，將該第2循環伏安圖中電位V下之電流值設為電流值B。此時，根據式(1)(被覆率(%)＝(1－B/A)×100)而算出之被覆率為90%以上。條件2：積層體之全光線穿透率為70%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:積層體</p>
        <p type="p">8:導電構件</p>
        <p type="p">9:氧化鎳層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1348" publication-number="202617922">
    <tif-files tif-type="multi-tif">
      <tif file="114122599.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於經混合之熱管理流體之再生之系統及程序</chinese-title>
        <english-title>SYSTEMS AND PROCESSES FOR RECLAMATION OF MIXED THERMAL MANAGEMENT FLUIDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K5/04</main-classification>
        <further-classification edition="200601120260202B">F25B45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯塔西奧　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STASIO, ANTHONY F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱管理流體再生之程序，其包括：(i)分析包括第一冷媒化合物及第二冷媒化合物的經混合之熱管理流體，以判定該第一冷媒化合物及第二冷媒化合物，並判定該經混合之熱管理流體中該第一冷媒化合物之量及第二冷媒化合物之量；及(ii)藉由下列中之一或多者處理該經混合之熱管理流體，以形成具有至少98%之純度的經再生之組成物：(a)用與該第一冷媒化合物、該第二冷媒化合物、或兩者相同的原始或經再生之冷媒稀釋該經混合之熱管理流體，及/或(b)蒸餾該經混合之熱管理流體，以形成適合用作經再生之熱管理流體的至少第一蒸餾物及具有非理想組成物的至少第二蒸餾物，以及處理該第二蒸餾物以使其具有符合AHRI 700的純度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process of thermal management fluid reclamation includes: (i) analyzing a mixed thermal management fluid including a first refrigerant compound and a second refrigerant compound to determine the first and second refrigerant compounds and to determine amounts of the first and second refrigerant compounds in the mixed thermal management fluid; and (ii) treating the mixed thermal management fluid to form a reclaimed composition having a purity of at least 98% by one or more of: (a) diluting the mixed thermal management fluid with virgin or reclaimed refrigerant which is the same as the first refrigerant compound, the second refrigerant compound or both, and/or (b) distilling the mixed thermal management fluid to form at least a first distillate suitable for use as a reclaimed thermal management fluid and at least a second distillate having a non-ideal composition, and treating the second distillate to have a purity which meets AHRI 700.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1349" publication-number="202618191">
    <tif-files tif-type="multi-tif">
      <tif file="114122609.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於回收及再生熱管理流體的系統及程序</chinese-title>
        <english-title>SYSTEMS AND PROCESSES FOR RECOVERY AND RECLAMATION OF THERMAL MANAGEMENT FLUIDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">F25B45/00</main-classification>
        <further-classification edition="200601120260123B">C09K5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯塔西奧　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STASIO, ANTHONY F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱管理流體再生之程序，其包括：(i)分析至少包括第一冷媒化合物的經回收的熱管理流體，以判定該經回收的熱管理流體之經回收的組成物，且基於該經回收的熱管理流體之該經回收的組成物，判定針對該經回收的熱管理流體的冷媒標示；(ii)將該經回收的熱管理流體與相同冷媒標示之至少一種其他經回收的熱管理流體合併，以形成經合併的熱管理流體；(iii)分析該經合併的熱管理流體的組成；(iv)識別目標產物；及(v)基於該組成之分析且基於經識別的目標產物來純化該經合併的熱管理流體。該純化形成該目標產物或針對該目標產物的摻合組分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process of thermal management fluid reclamation includes: (i) analyzing a recovered thermal management fluid including at least a first refrigerant compound to determine a recovered composition of the recovered thermal management fluid and a refrigerant designation for the recovered thermal management fluid based on the recovered composition of the recovered thermal management fluid; (ii) combining the recovered thermal management fluid with at least one other recovered thermal management fluid of the same refrigerant designation to form a combined thermal management fluid; (iii) analyzing the combined thermal management fluid for composition; (iv) identifying a target product; and (v) purifying the combined thermal management fluid based on the analysis of the composition and based on the identified target product. The purification forms the target product or a blending component for the target product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統，程序</p>
        <p type="p">12:接收容器，熱管理流體</p>
        <p type="p">14:接收容器，熱管理流體</p>
        <p type="p">16:分析，測試站，步驟</p>
        <p type="p">20:熱管理流體，系統</p>
        <p type="p">22:純化系統</p>
        <p type="p">24:純化系統，蒸餾系統</p>
        <p type="p">26:廢料流</p>
        <p type="p">28:餾出物流，單一組分，熱管理流體</p>
        <p type="p">30:餾出物，餾出物流，熱管理流體</p>
        <p type="p">32:非理想組成物，一或多個其他流</p>
        <p type="p">34:剩餘物流</p>
        <p type="p">36:處理器</p>
        <p type="p">40:系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1350" publication-number="202618164">
    <tif-files tif-type="multi-tif">
      <tif file="114122613.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護套筒系統和組裝方法</chinese-title>
        <english-title>PROTECTIVE SLEEVE SYSTEMS AND METHODS OF ASSEMBLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">F16L57/06</main-classification>
        <further-classification edition="200601120260126B">H02G9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商班狄特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDUIT CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱勒　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLER, BRIAN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種供使用於例如離岸水下應用中的保護套筒系統。保護套筒系統包括用於配接在一起以保護水下部件之頂部半套筒及底部半套筒，於此頂部半套筒及底部半套筒包括凸起部，當頂部半套筒及底部半套筒配接在一起時，此等凸起部靠近在一起以形成一夾具，於此鎖定構件被使用於夾緊此夾具，以將頂部半套筒及底部半套筒鎖固在一起。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A protective sleeving system for use in, for example, offshore subsea applications is provided. The protective sleeving system includes a top half sleeve and a bottom half sleeve for mating together to protect an underwater feature, where the top half sleeve and the bottom half sleeves include lobes that come together to form a cleat when the top half sleeve and the bottom half sleeve are mated together, where a locking member is used to clamp the cleat to secure the top half sleeve and the bottom half sleeve together.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:纜線保護套筒系統</p>
        <p type="p">110:頂部半套筒</p>
        <p type="p">111:突出部分</p>
        <p type="p">112:承納部分</p>
        <p type="p">112a:頂部凹槽</p>
        <p type="p">113:外殼本體</p>
        <p type="p">120:底部半套筒</p>
        <p type="p">121:突出部分</p>
        <p type="p">121a:底部凹槽</p>
        <p type="p">122:承納部分</p>
        <p type="p">123:外殼本體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1351" publication-number="202618874">
    <tif-files tif-type="multi-tif">
      <tif file="114122614.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122614</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在基板上形成結構之方法及填充基板上之凹陷特徵的相關聯方法</chinese-title>
        <english-title>METHODS OF FORMING A STRUCTURE ON A SUBSTRATE AND ASSOCIATED METHODS OF FILLING A RECESSED FEATURE ON A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01L21/02</main-classification>
        <further-classification edition="200601120260119B">H01L21/31</further-classification>
        <further-classification edition="200601120260119B">H01L21/3205</further-classification>
        <further-classification edition="200601120260119B">H01L21/762</further-classification>
        <further-classification edition="200601120260119B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡赫爾　克日什托夫　卡米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KACHEL, KRZYSZTOF KAMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露採用金屬順序溶滲合成製程填充基板上之凹陷特徵的方法。所揭露之方法包括在一凹陷特徵內形成一有機層，以及將金屬物種引入至該有機層中以使得形成一金屬晶種層。隨後可自該金屬晶種層形成一塊狀金屬層以填充該凹陷特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for filling a recessed feature on a substrate employing metal sequential infiltration synthesis processes are disclosed. The disclosed methods include forming an organic layer within a recessed feature and introducing metal species into the organic layer to allow the formation of a metal seed layer. A bulk metal layer can subsequently be formed from the metal seed layer to fill the recessed feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:子步驟</p>
        <p type="p">110:子步驟</p>
        <p type="p">112:循環迴路</p>
        <p type="p">114:步驟</p>
        <p type="p">116:步驟</p>
        <p type="p">118:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1352" publication-number="202617115">
    <tif-files tif-type="multi-tif">
      <tif file="114122620.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸收性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61F13/511</main-classification>
        <further-classification edition="200601120260202B">A61F13/532</further-classification>
        <further-classification edition="200601120260202B">A61F13/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大王製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIO PAPER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田芽依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>與那霸獎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONAHA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊東莉菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, RINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的吸收性物品，具有：非固定區域，形成於前述中央區域，其中背片與肌膚側構造部沒有被固定而使背片與肌膚側構造部可相對滑動；及，非固定區域以外之固定區域；在從肌膚側使固定區域和固定區域各自吸收等量的著色液後，從非肌膚側觀看吸收性物品，並將由CIE L*a*b*色彩系統所規定的非固定區域中的L*值設為Ln，將固定區域中的L*值設為Lf，比較結果為Ln＞Lf。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸收性物品</p>
        <p type="p">3:頂片</p>
        <p type="p">4:吸收體部</p>
        <p type="p">7:側片</p>
        <p type="p">8:黏接劑</p>
        <p type="p">8a:側部黏接劑</p>
        <p type="p">8b:本體黏接劑</p>
        <p type="p">21:固定區域</p>
        <p type="p">25:非固定區域</p>
        <p type="p">bd:吸收性物品的本體(本體)</p>
        <p type="p">C:中央區域</p>
        <p type="p">CL:前後方向中心線</p>
        <p type="p">D1:前後方向(長邊方向)</p>
        <p type="p">D2:橫方向(短邊方向)</p>
        <p type="p">F:前方區域</p>
        <p type="p">Q:體液排出口對向部</p>
        <p type="p">R:後方區域</p>
        <p type="p">wg:翼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1353" publication-number="202618004">
    <tif-files tif-type="multi-tif">
      <tif file="114122628.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嵌入具有聚集誘導發光的分子之微生物可降解聚合物及其用於細菌檢測和抗生素篩選的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12Q1/02</main-classification>
        <further-classification edition="200601120260202B">G01N21/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雄醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李偉鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭家宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIA-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦爾吉斯　埃爾德霍斯　瓦達克查利爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARGHESE, ELDHOSE VADAKKECHALIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEN-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組合物，其包含一外殼層，其中該外殼層包含一微生物可降解聚合物以及複數個具有聚集誘導發光的分子。本發明也提供一種檢測細菌存在的方法，其包含將一樣本與上述組合物接觸，由於細菌會導致該組合物中的螢光強度衰減，故透過該螢光強度的變化從而判斷出該樣本中是否有細菌存在。本發明進一步提供一種抗生素的篩選方法，其包含將上述組合物與細菌接觸後，再加入待測抗生素，並透過該組合物的螢光強度變化來評估待測抗生素的有效性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1354" publication-number="202617169">
    <tif-files tif-type="multi-tif">
      <tif file="114122639.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122639</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貧血風險降低劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260202B">A61K35/744</main-classification>
        <further-classification edition="200601120260202B">A61P7/06</further-classification>
        <further-classification edition="201601120260202B">A23L33/135</further-classification>
        <further-classification edition="200601120260202B">A23L2/52</further-classification>
        <further-classification edition="200601120260202B">A23C9/123</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商養樂多本社股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA YAKULT HONSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>地方獨立行政法人東京都健康長壽醫療中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO METROPOLITAN INSTITUTE FOR GERIATRICS AND GERONTOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諏訪貴士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島本一史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAMOTO, KAZUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天本隆太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAMOTO, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳幸利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, YUKITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於抑制貧血之發病之藥劑或飲食品。本發明之貧血發病風險降低劑係以副乾酪乳桿菌YIT 9029(FERM BP-1366)作為有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1355" publication-number="202617535">
    <tif-files tif-type="multi-tif">
      <tif file="114122683.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有更佳安全餘量的壓力容器蓋</chinese-title>
        <english-title>CAP FOR PRESSURE VESSEL WITH IMPROVED SAFETY MARGINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">B65D45/32</main-classification>
        <further-classification edition="200601120260122B">B65D55/04</further-classification>
        <further-classification edition="200601120260122B">B65D55/06</further-classification>
        <further-classification edition="200601120260122B">B65D55/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康門思瑞德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>A COMMON THREAD, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉森　格蘭特肯吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARSEN, GRANT KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於關閉容器的蓋子。蓋子包括側壁，用於與容器的容器表面接合。側壁包括側壁段，配置為與容器的容器表面接合，以及側壁段的接合面，用於與容器的容器表面接合。接合面朝內，由具有第一硬度的第一材料形成。蓋子在接合面外徑向有強化元件，由第二材質形成，第二材質的硬度高於第一硬度，而接合面的變形受到強化元件的限制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cap is provided for closing a container. The cap includes a sidewall for mating with a finish of a container. The sidewall includes a sidewall segment where the sidewall is configured to mate with the finish of the container and a mating surface of the sidewall segment for mating with the finish of the container. The mating surface faces inward and is formed from a first material having a first stiffness. The cap has a reinforcing element radially outside of the mating surface formed from a second material having a second stiffness higher than the first stiffness, and deformation of the mating surface is limited by the reinforcing element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:側壁</p>
        <p type="p">140:側壁段</p>
        <p type="p">150:接合面</p>
        <p type="p">160:軸線</p>
        <p type="p">170:強化元件</p>
        <p type="p">900:容器</p>
        <p type="p">910:蓋子</p>
        <p type="p">920:壓力釋放閥</p>
        <p type="p">930:按鈕</p>
        <p type="p">1000:壓力產生結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1356" publication-number="202617892">
    <tif-files tif-type="multi-tif">
      <tif file="114122696.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顏料組成物、著色組成物及成形體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09B23/01</main-classification>
        <further-classification edition="200601120260202B">C09B23/08</further-classification>
        <further-classification edition="200601120260202B">C09B47/04</further-classification>
        <further-classification edition="200601120260202B">C09B57/00</further-classification>
        <further-classification edition="200601120260202B">C09B57/08</further-classification>
        <further-classification edition="200601120260202B">C09B57/12</further-classification>
        <further-classification edition="200601120260202B">C09B67/20</further-classification>
        <further-classification edition="200601120260202B">C09B67/22</further-classification>
        <further-classification edition="200601120260202B">C09D17/00</further-classification>
        <further-classification edition="200601120260202B">G02B5/20</further-classification>
        <further-classification edition="200601120260202B">G02F1/1335</further-classification>
        <further-classification edition="202301120260202B">H10K59/122</further-classification>
        <further-classification edition="202301120260202B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池洋匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, HIROMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水郁馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, IKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車孝福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHA, HYOBOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顏料組成物，能夠於不使紫外線區域之吸光度上升之情況下提昇可見光全域之吸光度。又，本發明提供一種著色組成物及成形體，能夠於不妨礙活性能量線硬化之情況下實現較高之遮光性。本發明之顏料組成物包含下述通式（i）所表示之化合物（A）之1種或2種以上、及顏料（B）。上述顏料（B）包含選自由碳黑、苯并二呋喃酮（benzodifuranone）系顏料、及苝系顏料所組成之群中之1種或2種以上之顏料。  &lt;img align="absmiddle" height="65px" width="270px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1357" publication-number="202617932">
    <tif-files tif-type="multi-tif">
      <tif file="114122716.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螢光體粉末及使用其之噴墨用墨水、發光元件、發光裝置及螢光體粉末之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C09K11/08</main-classification>
        <further-classification edition="200601120260128B">C09K11/56</further-classification>
        <further-classification edition="201401120260128B">C09D11/30</further-classification>
        <further-classification edition="202501120260128B">H10H20/851</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田子愛理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGO, AIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下桃花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, MOMOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲村昌晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAMURA, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶田浩之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJITA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝田信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSUTA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種微細且發光效率較高之螢光體粉末及其製造方法。該螢光體粉末至少包含2族元素(A)、硫(S)及發光中心元素(M)，體積基準下之累積90%直徑(D90)為10.0 μm以下，藉由WPPF法對X射線繞射分佈進行解析所求出之晶格應變(σ)為0.300%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1358" publication-number="202617588">
    <tif-files tif-type="multi-tif">
      <tif file="114122725.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122725</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬硫化物前驅物之製造方法及金屬硫化物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C01B17/42</main-classification>
        <further-classification edition="200601120260202B">C01G15/00</further-classification>
        <further-classification edition="201401120260202B">C09D11/30</further-classification>
        <further-classification edition="202501120260202B">H10H20/851</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田子愛理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGO, AIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲村昌晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAMURA, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下桃花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, MOMOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶田浩之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJITA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝田信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSUTA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可藉由簡易之方法獲得微細且碳含有率較小之金屬硫化物的金屬硫化物前驅物之製造方法及金屬硫化物之製造方法。金屬硫化物前驅物之製造方法包括如下步驟：準備第1原料液，上述第1原料液包含沸點為110℃以下之第1有機溶劑及金屬鹽；準備第2原料液，上述第2原料液包含沸點為110℃以下之第2有機溶劑、硫及鹼金屬硫化物；將上述第1原料液與上述第2原料液進行混合，獲得包含金屬硫化物前驅物及鹼金屬鹽之反應液；及自上述反應液回收金屬硫化物前驅物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1359" publication-number="202617540">
    <tif-files tif-type="multi-tif">
      <tif file="114122726.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>標本取出用袋及標本取出用裝置</chinese-title>
        <english-title>SPECIMEN RETRIEVAL BAG AND SPECIMEN RETRIEVAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B65D83/00</main-classification>
        <further-classification edition="200601120260126B">A61B17/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商希拉格國際有限公司（瑞士）</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CILAG GMBH INTERNATIONAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住倍川澄股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SB-KAWASUMI LABORATORIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電木股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO BAKELITE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木善悦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ZENETSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有川清貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIKAWA, KIYOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田新悦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARATA, SHINETSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大岸範史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHGISHI, NORIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粕谷淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASUYA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種標本取出用袋及標本取出用裝置，其容易將摘出之標本以收容之狀態取出到體外。其具備袋本體（2），該袋本體（2）具有經由開口（2a）收容標本（切除片）之收容部（2b）。袋本體（2）從開口（2a）向斜下方傾斜至位於開口（2a）的相反側之末端部亦即裏端部（2c）。亦即，袋本體（2）具有與開口（2a）的中心軸交叉之方向的分量和沿著中心軸的延伸方向觀察時遠離開口（2a）之方向的分量而延伸之標本取出用袋（1），藉此解決上述課題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a specimen retrieval bag and a specimen retrieval device that easily retrieves a removed specimen out of a body in a state where the removed specimen is stored. Provided is a bag body 2 including a storage portion 2b that stores a specimen (excision piece) via an opening 2a. The bag body 2 is obliquely inclined downward from the opening 2a to a tip portion (back end portion 2c) on a side opposite to the opening 2a. That is, the bag body 2 achieves the abovedescribed object by a specimen retrieval bag 1 extending with a component in a direction intersecting with a central axis of the opening 2a and a component in a direction away from the opening 2a when viewed in an extending direction of the central axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:標本取出用袋</p>
        <p type="p">2:袋本體</p>
        <p type="p">2a:開口</p>
        <p type="p">2b:收容部</p>
        <p type="p">2c:裏端部(末端部)</p>
        <p type="p">2d:基端部</p>
        <p type="p">2h:屈曲部</p>
        <p type="p">4:繩體(手持部)</p>
        <p type="p">5:收容筒(手持部)</p>
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    </description>
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        <document-id>
          <doc-number>114122732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療黑色素瘤之組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR TREATMENT OF MELANOMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K39/00</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
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              <chinese-name name-type="organization">
                <last-name>德商拜恩技術股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONTECH SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>莎新　烏葛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHIN, UGUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>圖雷奇　奧資連</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURECI, OZLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特恩科娃　祖札娜　吉拉科娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRNKOVA, ZUZANA JIRAKOVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席巴奇　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEEBACH, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊　依斯萊爾斯萊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOWY, ISRAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於治療黑色素瘤之組合物及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides compositions and methods for treatment of melanoma.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1361" publication-number="202617168">
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      <isuno>9</isuno>
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          <doc-number>202617168</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肌量及/或肌力降低抑制劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260202B">A61K35/741</main-classification>
        <further-classification edition="200601120260202B">A61P21/00</further-classification>
        <further-classification edition="201601120260202B">A23L33/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商養樂多本社股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA YAKULT HONSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>地方獨立行政法人東京都健康長壽醫療中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO METROPOLITAN INSTITUTE FOR GERIATRICS AND GERONTOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天本隆太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAMOTO, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤美紀子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MIKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島本一史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAMOTO, KAZUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諏訪貴士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳幸利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, YUKITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明提供一種抑制肌肉量之降低且可用於維持改善肌力及肌功能之醫藥品、食品及可調配於其等之素材。  &lt;br/&gt;本發明係一種肌量及/或肌力降低抑制劑，其以普通擬桿菌之菌體或菌體培養物作為有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
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  <tw-patent-application no="1362" publication-number="202617797">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、顯示裝置及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F212/14</main-classification>
        <further-classification edition="200601120260202B">C08F8/12</further-classification>
        <further-classification edition="200601120260202B">C08G73/10</further-classification>
        <further-classification edition="200601120260202B">C08K5/04</further-classification>
        <further-classification edition="200601120260202B">C08K5/28</further-classification>
        <further-classification edition="200601120260202B">C08L25/04</further-classification>
        <further-classification edition="200601120260202B">C08L79/04</further-classification>
        <further-classification edition="200601120260202B">C08L79/08</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼木順平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONIKI, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐伯昭典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAEKI, AKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀本聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
        </inventors>
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              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種相容性優異、具有優異的平坦性的樹脂組成物，為了解決所述課題，亦提出一種樹脂組成物，其包含選自由聚醯亞胺樹脂、聚苯并噁唑樹脂、該些的前驅物及該些的共聚物所組成的群組中的一種以上的樹脂（（A）成分）、在單元結構中含有羥基苯乙烯單元的樹脂、醌二疊氮化合物及有機溶媒，並且（A）成分具有源自二胺的式（1）所表示的二價的結構單元。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="224px" width="551px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（X表示碳數1～15的二價烴基、-O-、-S-、-SO&lt;sub&gt;2&lt;/sub&gt;-、或單鍵，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示-CH&lt;sub&gt;2&lt;/sub&gt;-、-C(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;-、-O-、-NHC(=O)-、或-C(=O)NH-，t分別獨立地表示0或1的整數，*表示與醯胺鍵、醯亞胺鍵或噁唑環的氮原子鍵結的鍵結部）</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:TFT</p>
        <p type="p">3:TFT絕緣層</p>
        <p type="p">4:配線</p>
        <p type="p">5:平坦化層</p>
        <p type="p">6:接觸孔</p>
        <p type="p">7:第一電極</p>
        <p type="p">8:畫素分割層</p>
        <p type="p">9:有機EL層</p>
        <p type="p">10:第二電極</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1363" publication-number="202617937">
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      <volno>24</volno>
      <isuno>9</isuno>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、硬化膜及半導體裝置</chinese-title>
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C09K19/12</main-classification>
        <further-classification edition="200601120260119B">C08K5/105</further-classification>
        <further-classification edition="201801120260119B">C08K3/011</further-classification>
        <further-classification edition="200601120260119B">C08F2/44</further-classification>
        <further-classification edition="200601120260119B">G03F7/028</further-classification>
        <further-classification edition="200601120260119B">C08L79/08</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電木股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO BAKELITE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木咲子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, SAKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋映子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, EIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠製造對脆性破壞之耐性優異並且具有高圖案形成精度的硬化膜之感光性樹脂組成物、可靠性及圖案形成精度高的硬化膜、以及包含該硬化膜之半導體裝置。本發明的感光性樹脂組成物係用於製造半導體裝置的硬化膜之感光性樹脂組成物，其含有酚樹脂（A）、交聯劑（B）及酸產生劑（C），交聯劑（B）含有於常溫時為固體之第1成分及於常溫時為液體之第2成分，前述感光性樹脂組成物之硬化物的拉伸伸長率為25%以上，前述感光性樹脂組成物被供於形成溝槽的寬度10μm、膜厚5μm的溝槽圖案時，在前述溝槽圖案的截面中，面對前述溝槽之端面的錐角為50°以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a photosensitive resin composition capable of producing a cured film having excellent resistance to brittle fracture and high patterning accuracy, a cured film having high reliability and patterning accuracy, and a semiconductor device including the cured film. &lt;br/&gt;The photosensitive resin composition of the present invention is a photosensitive resin composition used for producing a cured film of a semiconductor device, the photosensitive resin composition including a phenolic resin (A), a crosslinking agent (B) and an acid generator (C), wherein the crosslinking agent (B) includes a first component that is solid at room temperature and a second component that is liquid at room temperature, a tensile elongation of a cured product of the photosensitive resin composition is 25% or more, and when the photosensitive resin composition is used to form a trench pattern having a trench width of 10 μm and a film thickness of 5 μm, a cross section of the trench pattern has an end surface facing the trench with a taper angle of 50° or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:被檢體</p>
        <p type="p">21:矽晶圓</p>
        <p type="p">22:溝槽圖案</p>
        <p type="p">24:硬化膜</p>
        <p type="p">26:溝槽</p>
        <p type="p">212:上表面</p>
        <p type="p">252:端面</p>
        <p type="p">θ:錐角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1364" publication-number="202618447">
    <tif-files tif-type="multi-tif">
      <tif file="114122771.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於開發度量衡資料中之空間及語義關係之圖像神經網路</chinese-title>
        <english-title>GRAPH NEURAL NETWORKS FOR EXPLOITING SPATIAL AND SEMANTIC RELATIONS IN METROLOGY DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G03F7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪基奇　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIKIC, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RS</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴加蘭　納斯塔蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJALAN, NASTARAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索拉斯　杜阿爾特　艾力克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOARES DUARTE, ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種使用一圖像神經網路以處理使用一微影設備而圖案化的一基板之一經圖案化部分之度量衡資料以產生特性化該基板之該經圖案化部分之特性化資訊的方法。該方法包含獲得度量衡資料，界定一圖像神經網路之一圖像，基於該度量衡資料界定該圖像之各節點之特徵資料，及至少一次進行以下操作：使用該圖像神經網路且針對各節點產生與該節點相關聯之各節點之對應訊息資料，且針對各節點基於該對應一或多個訊息資料更新該節點之該特徵資料以形成經更新特徵資料。該方法進一步包含根據該經更新特徵資料產生該特性化資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of using a graph neural network to process metrology data of a patterned portion of a substrate patterned using a lithographic apparatus, to generate characterization information characterizing the patterned portion of the substrate. The method comprises obtaining metrology data, defining a graph of a graph neural network, defining feature data for each node of the graph based on the metrology data, and at least once generating, using the graph neural network and for each node, corresponding message data for each node associated with the node and updating, for each node, the feature data for the node based on the corresponding one or more message data, to form updated feature data. The method further comprises generating the characterization information from the updated feature data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:神經網路系統</p>
        <p type="p">501:度量衡資料</p>
        <p type="p">502:所關注參數(「PoI」)</p>
        <p type="p">503:預處理模組</p>
        <p type="p">504:圖像神經網路(GNN)</p>
        <p type="p">505:所關注參數產生模組</p>
        <p type="p">506:圖像產生級</p>
        <p type="p">507:訊息傳遞級</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1365" publication-number="202619405">
    <tif-files tif-type="multi-tif">
      <tif file="114122780.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制包括在3D環境中之照明裝置的方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS OF CONTROLLING A LIGHTING DEVICE COMPRISED IN A 3D ENVIRONMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260127B">H05B47/175</main-classification>
        <further-classification edition="202001120260127B">H05B47/155</further-classification>
        <further-classification edition="202001120260127B">H05B45/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商双翼公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYVRN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維佐利　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEZZOLI, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格勞普曼　提莫西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAUPMANN, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供控制照明裝置的方法及設備。為了達到該目標，接收代表3D環境的區域集中的每個區域（50）所佔據的體積的第一數據。接收代表與每個區域（50）相關的顏色屬性的第二數據。接收代表照明裝置（61）在3D環境中的位置的第三數據。根據第一數據及第三數據檢查照明裝置（61）與區域（50）之間的交集存在性。根據檢查結果控制照明裝置（61）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided methods and apparatus of controlling a lighting device (61). To reach that aim, first data representative of a volume occupied by each region (50) of a set of regions in a 3D environment is received. Second data representative of color attributes associated with each region (50) is received. Third data representative of a position of the lighting device (61) in the 3D environment is received. A presence of an intersection between the lighting device (61) and the regions (50) is checked according to the first and third data. The lighting device (61) is controlled according to a result of the checking.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:區域</p>
        <p type="p">61:照明裝置</p>
        <p type="p">611:參考點</p>
        <p type="p">612:左側部分</p>
        <p type="p">613:右側部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1366" publication-number="202617644">
    <tif-files tif-type="multi-tif">
      <tif file="114122790.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生產氫氯（氟）碳化合物之程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING HYDROCHLORO(FLUORO)CARBON COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C17/278</main-classification>
        <further-classification edition="200601120260202B">C07C19/01</further-classification>
        <further-classification edition="200601120260202B">C07C19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供一種程序，該程序涉及在催化劑系統之存在下使鹵烷反應物與烯烴接觸，以生產包括鹵烷插入產物的產物流，其中該產物流含有小於約10 wt.%的副產物短鏈聚合物、寡聚物、二聚物及/或其他聚合物產物，以及藉由該程序所生產之組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is a process involving contacting a haloalkane reactant with an olefin in the presence of a catalyst system to produce a product stream including a haloalkane insertion product, wherein the product stream contains less than about 10 wt.% of byproduct telomers, oligomers, dimers and/or other polymeric products, as well as compositions produced by this process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1367" publication-number="202617643">
    <tif-files tif-type="multi-tif">
      <tif file="114122802.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生產氫（氯）氟碳化合物之程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING HYDRO(CHLORO)FLUOROCARBON COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C17/20</main-classification>
        <further-classification edition="200601120260202B">C07C19/08</further-classification>
        <further-classification edition="200601120260202B">C07C19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克森　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACKSON, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供一種程序，包括在催化劑存在下，在不含或實質上不含超強酸的條件下，使鹵烷反應物與氟化劑在液相中接觸，以產生包括鹵烷產物、較佳的是氫（氯）氟碳化合物的產物流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process is provided which includes contacting a haloalkane reactant with a fluorination agent in the liquid phase, in the presence of a catalyst, under conditions which are free of or substantially free of a superacid, to produce a product stream including a haloalkane product, preferably a hydro(chloro)fluorocarbon.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1368" publication-number="202617645">
    <tif-files tif-type="multi-tif">
      <tif file="114122806.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於（氫）氯（氟）碳化物之回收程序</chinese-title>
        <english-title>PROCESS FOR (HYDRO)CHLORO(FLUORO)CARBON RECOVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C17/278</main-classification>
        <further-classification edition="200601120260202B">C07C17/383</further-classification>
        <further-classification edition="200601120260202B">C07C17/395</further-classification>
        <further-classification edition="200601120260202B">C07C19/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉德利　麥克　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRADLEY, MICHAEL A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克森　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACKSON, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種回收程序，其包括(i)將有效量的處理試劑與組成物接觸或混合，以形成經處理之組成物，該組成物包括至少一種選自下列的成分：至少一種（氫）鹵烷、至少一種（氫）氯（氟）碳化物、至少一種金屬、至少一種金屬鹽、至少一種有機腈氧化還原系統、至少一種磷酸鹽、至少一種膦、至少一種金屬磷酸鹽錯合物、至少一種金屬膦錯合物、及其組合；及將經處理之組成物進行分離，諸如蒸餾或分餾，以回收至少一種（氫）鹵烷及至少一種（氫）氯（氟）碳化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A recovery process includes (i) contacting or mixing an effective amount of a treatment reagent with a composition to form a treated composition, the composition including at least one member selected from at least one (hydro)haloalkane, at least one (hydro)chloro(fluoro)carbon, at least one metal, at least one metal salt, at least one organic nitrile redox system, at least one phosphate, at least one phosphine, at least one metal phosphate complex, at least one metal phosphine complex, and combinations thereof; and subjecting the treated composition to separation, such as distillation or fractionation, to recover the at least one (hydro)haloalkane and the at least one (hydro)chloro(fluoro)carbon.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1369" publication-number="202617768">
    <tif-files tif-type="multi-tif">
      <tif file="114122817.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122817</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生抗ＣＤ１９抗體之方法</chinese-title>
        <english-title>METHODS OF PRODUCING ANTI-CD19 ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">C12P21/08</further-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61K9/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商澤納仕生物製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENAS BIOPHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵　梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　維一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEIYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供產生特異性結合人類CD19之抗體或抗原結合片段的組合物及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides compositions and methods of producing antibodies or antigen-binding fragment that specifically bind human CD19.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1370" publication-number="202617923">
    <tif-files tif-type="multi-tif">
      <tif file="114122830.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含氟烯烴及天然冷媒之組成物及其用途</chinese-title>
        <english-title>COMPOSITIONS COMPRISING FLUOROOLEFINS AND NATURAL REFRIGERANTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K5/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>修格斯　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGHES, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蒙尼　盧克　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMONI, LUKE DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">以HFO為主要組分的HFO與HC之冷媒摻合物可提供比目前HFO更好的冷卻能力，並維持低可燃性。以HC為主要組分的HFO與HC之冷媒摻合物容許在降低之可燃性下更多的HC充填。此類組成物包括：(i)至少一種選自下列的化合物：HFO-1234ze(E)、HFO-1234ze(Z)、HFO-1336mzz(E)、HFO-1336mzz(Z)、HCFO-1233zd(E)、HCFO-1233zd(Z)、CFO-1112、及其組合；(ii)至少一種選自下列的其他化合物：HC-290、HC-1270、R-600、R-600a、R-601、R-601a、R-744、R-717、及其組合；以及可選地(iii)至少一種選自下列的其他化合物：HFC-134、HFC-134a、HFC-125、HFC-32、HFC-152a、及其組合。此等組成物可用作空調、熱泵、製冷、及/或冷凍器中的冷媒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Refrigerant blends of HFOs and HCs, having HFOs as the main component, provide better cooling capacity than incumbent HFOs and maintain low flammability. Refrigerant blends of HFOs and HCs, having HCs as the main component, allow for larger HC charge at reduced flammability. Such compositions include (i) at least one compound selected from HFO-1234ze(E), HFO-1234ze(Z), HFO-1336mzz(E), HFO-1336mzz(Z), HCFO-1233zd(E), HCFO-1233zd(Z), CFO-1112, and combinations thereof, (ii) at least one other compound selected from HC-290, HC-1270, R-600, R-600a, R-601, R-601a, R-744, R-717, and combinations thereof, and optionally (iii) at least one other compound selected from HFC-134, HFC-134a, HFC-125, HFC-32, HFC-152a, and combinations thereof. These compositions are useful as refrigerants in air conditioning, heat pumps, refrigeration, and/or chillers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1371" publication-number="202618014">
    <tif-files tif-type="multi-tif">
      <tif file="114122841.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋼板、鍍層鋼板及鋼板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C22C38/14</main-classification>
        <further-classification edition="200601120260202B">C21D6/00</further-classification>
        <further-classification edition="200601120260202B">C21D8/02</further-classification>
        <further-classification edition="200601120260202B">C21D9/46</further-classification>
        <further-classification edition="200601120260202B">C23C2/06</further-classification>
        <further-classification edition="200601120260202B">C23C2/40</further-classification>
        <further-classification edition="200601120260202B">B21B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商神戶製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上俊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, TOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一態樣，其係關於一種鋼板，其以質量%計，含有：C：0.010%以上0.050%以下、Si：0%以上1.00%以下、Mn：0%以上0.80%以下、Al：0.01%以上0.10%以下、Ti：0.04%以上0.20%以下、B：1ppm以上50ppm以下，及N：0ppm以上80ppm以下，殘餘部為鐵及不可避免雜質，Ti相對於C之質量比(Ti)/(C)為3.6以上，於垂直於壓延方向之面中的再結晶組織之面積率為25%以下，且於垂直於壓延方向之面中，在板厚1/4之位置，以透射型電子顯微鏡(TEM)或掃描透射型電子顯微鏡(STEM)觀察時，析出物之圓相當直徑為26nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1372" publication-number="202619176">
    <tif-files tif-type="multi-tif">
      <tif file="114122866.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122866</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彈簧連接器</chinese-title>
        <english-title>SPRING CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01R13/04</main-classification>
        <further-classification edition="200601120260131B">H01R13/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商友華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOWO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋謙太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島崎壮史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAZAKI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金井久直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAI, HISANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種彈簧連接器，其能夠抑制因為振動或衝擊所引起之不連續導通之發生。彈簧連接器係具備：管體；接觸銷，其前端部從前述管體的開口突出；及彈簧，係將前述接觸銷朝突出方向彈推；前述管體係在外周具有透孔，該透孔係使前述接觸銷的一部分朝前述管體的相對於前述突出方向大致垂直之方向露出；在前述管體的外周裝設有彈性構件，該彈性構件係將從前述透孔露出之前述接觸銷的露出部朝前述大致垂直之方向推壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a spring connector that is capable of suppressing occurrence of discontinuous conduction due to vibration or impact.&lt;br/&gt;A spring connector includes: a tube; a contact pin whose tip portion protrudes from an opening of the tube, and a spring that urges the contact pin in the protruding direction; wherein the tube has a through hole on outer periphery that exposes a part of the contact pin in an approximately perpendicular direction with respect to the protruding direction of the tube; and an elastic member is attached to the outer periphery of the tube that presses an exposed portion of the contact pin exposed from the through hole in the approximately perpendicular direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:彈簧連接器</p>
        <p type="p">10:接觸銷</p>
        <p type="p">11,22c,32:大徑部</p>
        <p type="p">12,22a,31:小徑部</p>
        <p type="p">12a:露出部</p>
        <p type="p">13:有底孔</p>
        <p type="p">20:管體</p>
        <p type="p">21:內管體部</p>
        <p type="p">21a:大徑面</p>
        <p type="p">21b:小徑面</p>
        <p type="p">22b:中間徑部</p>
        <p type="p">22d:插入部</p>
        <p type="p">23:橫槽</p>
        <p type="p">24:透孔</p>
        <p type="p">25:外管體部</p>
        <p type="p">26:孔部</p>
        <p type="p">26a:內周面</p>
        <p type="p">26b:底面</p>
        <p type="p">27:後端面</p>
        <p type="p">30:線圈彈簧</p>
        <p type="p">40:圓環狀彈性體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1373" publication-number="202617712">
    <tif-files tif-type="multi-tif">
      <tif file="114122868.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>STAT6調節劑及其使用之方法</chinese-title>
        <english-title>STAT6 MODULATORS AND METHODS OF USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/04</main-classification>
        <further-classification edition="200601120260202B">C07D487/04</further-classification>
        <further-classification edition="200601120260202B">C07D413/10</further-classification>
        <further-classification edition="200601120260202B">A61K31/437</further-classification>
        <further-classification edition="200601120260202B">A61K31/444</further-classification>
        <further-classification edition="200601120260202B">A61K31/501</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61K31/422</further-classification>
        <further-classification edition="200601120260202B">A61P17/14</further-classification>
        <further-classification edition="200601120260202B">A61P11/06</further-classification>
        <further-classification edition="200601120260202B">A61P11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷瑟拉股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYTHERA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波露　文凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOLLU, VENKAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鵬宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　俊虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUNHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董　慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於調節STAT6之化合物、組合物及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides for compounds, compositions, and methods for modulating STAT6.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1374" publication-number="202617825">
    <tif-files tif-type="multi-tif">
      <tif file="114122882.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電極材料之聚醯胺基胺分散劑</chinese-title>
        <english-title>POLYAMIDOAMINE DISPERSANT FOR ELECTRODE MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G63/08</main-classification>
        <further-classification edition="200601120260202B">C08G63/685</further-classification>
        <further-classification edition="200601120260202B">C08G73/02</further-classification>
        <further-classification edition="200601120260202B">C08L67/04</further-classification>
        <further-classification edition="200601120260202B">C08L79/02</further-classification>
        <further-classification edition="202201120260202B">C09K23/16</further-classification>
        <further-classification edition="202201120260202B">C09K23/52</further-classification>
        <further-classification edition="200601120260202B">H01M4/02</further-classification>
        <further-classification edition="200601120260202B">H01M4/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡波尼　皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAPONI, PIER FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　克禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KERH LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克　荷姆特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACK, HELMUT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考曼　史黛芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUMANN, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅夫勒　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOEFFLER, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分散劑，其係藉由將聚醯胺基胺C與至少二種聚酯P及至少一種羧酸或其酸酐或其酯Q反應而獲得；其中該聚醯胺基胺C係可自至少一個類型的物質B的重複自反應獲得及/或可自至少一種B與至少一種物質A的交叉反應獲得，其中該至少一種B係該至少一種物質A與至少一種連接子D之加成物，且B含有1至15個胺反應性基團，該至少一種物質A係支鏈脂族及/或直鏈脂族及/或環脂族或芳族聚胺，且該至少一種連接子D係丙烯酸酯、順丁烯二酸/反丁烯二酸單酯或順丁烯二酸/反丁烯二酸二酯，或其混合物。亦提供製造分散劑之方法、分散液、包含該分散劑及該分散液之電化學裝置、及該分散劑及該分散液之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dispersant obtained by reacting polyamidoamine C with at least two polyesters P and at least one carboxylic acid or its anhydride or its ester Q; wherein said polyamidoamine C is obtainable from repetitive self-reaction of at least one type of substance B and / or from cross-reaction of at least one B with at least one substance A, wherein the at least one B is an adduct of the at least one substance A and at least one linker D, and B contains 1-15 amine-reactive groups, the at least one substance A is a branched and / or linear aliphatic and / or cycloaliphatic or aromatic polyamine, and the at least one linker D is an acrylate, a maleate / fumarate mono-ester or a maleate / fumarate di-ester, or a mixture thereof. A process for producing a dispersant, a dispersion, an electrochemical device comprising, and use of the dispersant and the dispersion are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1375" publication-number="202619308">
    <tif-files tif-type="multi-tif">
      <tif file="114122884.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊裝置及具有其之通訊系統</chinese-title>
        <english-title>COMMUNICATION DEVICE AND COMMUNICATION SYSTEM HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250701B">H04B7/0413</main-classification>
        <further-classification edition="200601120250701B">H01Q1/52</further-classification>
        <further-classification edition="200601120250701B">H01Q21/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬琳惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, LIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊裝置，包括基板、第一收發模組、第二收發模組、以及設置於基板表面上的第一循環器、第二循環器、第一天線模組、第二天線模組和屏蔽框架。第一收發模組和第二收發模組設置於基板表面上之相對二側。第一循環器和第二循環器透過基板分別電性或通訊連接第一收發模組和第二收發模組。第一天線模組和第二天線模組透過基板分別電性或通訊連接第一循環器和第二循環器。屏蔽框架內部定義出多個封閉的隔離區域，以令第一及第二收發模組分佈於此些隔離區域中，或令第一收發模組、第二收發模組、第一循環器及第二循環器分佈於此些隔離區域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication device comprises a substrate, a first transceiver module, a second transceiver module, and a first circulator, a second circulator, a first antenna module, a second antenna module and a shielding frame disposed on a surface of the substrate. The first transceiver module and the second transceiver module are disposed on two opposite sides of the surface of the substrate. The first circulator and the second circulator are respectively electrically or communicatively connected to the first transceiver module and the second transceiver module through the substrate. The first antenna module and the second antenna module are respectively electrically or communicatively connected to the first circulator and the second circulator through the substrate. The shielding frame defines a plurality of closed separated areas therein, so that the first transceiver module and the second transceiver module are distributed in these separated areas, or the first transceiver module, the second transceiver module, the first circulator and the second circulator are distributed in these separated areas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:通訊裝置</p>
        <p type="p">201:低雜訊放大器</p>
        <p type="p">2011:第一低雜訊放大器</p>
        <p type="p">2012:第二低雜訊放大器</p>
        <p type="p">202:數位步進衰減器</p>
        <p type="p">2021:第一數位步進衰減器</p>
        <p type="p">2022:第二數位步進衰減器</p>
        <p type="p">203:中頻放大器</p>
        <p type="p">2031:第一中頻放大器</p>
        <p type="p">2032:第二中頻放大器</p>
        <p type="p">210:基板</p>
        <p type="p">220:調變器</p>
        <p type="p">221:第一調變器</p>
        <p type="p">222:第二調變器</p>
        <p type="p">230:解調器</p>
        <p type="p">231:第一解調器</p>
        <p type="p">232:第二解調器</p>
        <p type="p">240:循環器</p>
        <p type="p">241:第一循環器</p>
        <p type="p">242:第二循環器</p>
        <p type="p">250:天線模組</p>
        <p type="p">251:第一天線模組</p>
        <p type="p">252:第二天線模組</p>
        <p type="p">260:功率放大器</p>
        <p type="p">261:第一功率放大器</p>
        <p type="p">262:第二功率放大器</p>
        <p type="p">270:接收開關模組</p>
        <p type="p">280:時脈緩衝器</p>
        <p type="p">290:屏蔽框架</p>
        <p type="p">291,292,293,294,295,296:屏蔽件</p>
        <p type="p">RX1:第一接收單元</p>
        <p type="p">RX2:第二接收單元</p>
        <p type="p">SA:隔離區域</p>
        <p type="p">TX1:第一發射單元</p>
        <p type="p">TX2:第二發射單元</p>
        <p type="p">TR1:第一收發模組</p>
        <p type="p">TR2:第二收發模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1376" publication-number="202617257">
    <tif-files tif-type="multi-tif">
      <tif file="114122890.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過濾膜及其製造方法</chinese-title>
        <english-title>FILTRATION MEMBRANES AND METHOD OF MANUFACTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B01D67/00</main-classification>
        <further-classification edition="200601120260123B">B01D71/26</further-classification>
        <further-classification edition="200601120260123B">B01D71/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦電子材料國際有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>繆爾　蕭恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUIR, SEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIND, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種過濾膜，包括包含聚合物的多孔膜和設置在該多孔膜的一側或兩側上的衍生化的聚多巴胺層。該衍生化的聚多巴胺層在氧化劑的存在下設置在該多孔膜上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A filtration membrane includes a porous membrane that comprises a polymer and a derivatized polydopamine layer disposed on one or both sides of the porous membrane. The derivatized polydopamine layer is disposed on the porous membrane in the presence of an oxidizing agent.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1377" publication-number="202618011">
    <tif-files tif-type="multi-tif">
      <tif file="114122891.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有高強度的可加工銅合金</chinese-title>
        <english-title>MACHINABLE COPPER ALLOY WITH HIGH STRENGTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C22C9/00</main-classification>
        <further-classification edition="200601120260123B">H01B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬騰榮公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATERION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特里布斯　卡羅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRYBUS, CAROLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格德翁　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEDEON, MIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫利二世　約翰Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULI JR., JOHN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希特　瑞亞Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEATER, RHEA C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫斯納　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSNER, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷恩　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREHN, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格倫辛　弗里茨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRENSING, FRITZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含鈹和至少一種“N”元素的可加工銅合金。該銅合金可以含有鈹並且具有低濃度的鉛，例如不大於900ppm的鉛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A machinable copper alloy comprising beryllium and at least one “N” element. The copper alloy may contain beryllium and has low levels of lead, e.g., no more than 900 ppm of lead.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1378" publication-number="202617757">
    <tif-files tif-type="multi-tif">
      <tif file="114122912.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經化學修飾之肽及其用途</chinese-title>
        <english-title>CHEMICALLY MODIFIED PEPTIDES AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/605</main-classification>
        <further-classification edition="200601120260202B">A61K38/26</further-classification>
        <further-classification edition="200601120260202B">A61P3/00</further-classification>
        <further-classification edition="200601120260202B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商紐羅克里生物科學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅佐　亞當　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEZO, ADAM R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何榮軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, RONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於經化學修飾之肽及其在治療某些疾病或病症中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to chemically modified peptides and uses thereof in treating certain diseases or disorders.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1379" publication-number="202617465">
    <tif-files tif-type="multi-tif">
      <tif file="114122915.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鄰接元件</chinese-title>
        <english-title>ABUTMENT ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B60M1/20</main-classification>
        <further-classification edition="200601120260202B">H02G3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商富雷爾＋弗賴股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURRER + FREY AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富雷爾　比特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURRER, BEAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種用於連接在縱向方向（4）上延伸的兩個導電軌段（12）的鄰接元件（38），每個導電軌段包括在橫向於縱向方向（4）的橫向方向（6）上延伸的橫樑（14），該橫樑攜載與高度方向（8）相反地延伸的兩個支撐臂（16），每個支撐臂橫向於縱向方向（4）和橫向方向（6）。在每個支撐臂（16）的下側上，如在高度方向（8）上觀察那樣，夾持臂（18）被佈置用於固持接觸線（10），並且每個支撐臂（16）包括至少一個導軌接觸元件（36），該至少一個導軌接觸元件取向在橫向方向（6）上並且在高度方向（8）上起作用。鄰接元件包括：在縱向方向上延伸的基體（42），該基體在橫向方向（6）上由兩個相對的橫向面（44，46）界定；軌道鄰接接合元件（40），該軌道鄰接接合元件形成在橫向面（46）中的一個上，用於當橫向面（46）放置在具有軌道接觸元件（36）的支撐臂（16）上時，在高度方向（8）上與軌道接觸元件（36）形狀配合地接合，其中，軌道鄰接接合元件（40）包括間隙段（62），該間隙段在具有軌道接觸元件（36）的支撐臂（16）上的安裝狀態下在高度方向（8）和橫向方向（6）兩者上與軌道接觸元件（36）間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接觸線</p>
        <p type="p">12:導電軌段</p>
        <p type="p">14:橫樑</p>
        <p type="p">16:支撐臂</p>
        <p type="p">18:夾持臂</p>
        <p type="p">2:架空導電軌</p>
        <p type="p">20:內部空間</p>
        <p type="p">22:內部加強元件</p>
        <p type="p">24:外部加強元件</p>
        <p type="p">26:進料通道</p>
        <p type="p">28:張緊元件</p>
        <p type="p">30:第一夾持臂段</p>
        <p type="p">32:第二夾持臂段</p>
        <p type="p">34:保護壁</p>
        <p type="p">36:軌道接觸元件</p>
        <p type="p">38:鄰接元件</p>
        <p type="p">4:縱向方向</p>
        <p type="p">40:軌道鄰接接合元件</p>
        <p type="p">52:錐角</p>
        <p type="p">56:螺釘</p>
        <p type="p">6:橫向方向</p>
        <p type="p">8:高度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1380" publication-number="202618779">
    <tif-files tif-type="multi-tif">
      <tif file="114122925.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於單層式儲存單元複製回寫操作的方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR SLC COPYBACK OPERATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G11C11/56</main-classification>
        <further-classification edition="200601120260126B">G11C16/34</further-classification>
        <further-classification edition="200601120260126B">G11C29/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛思開海力士存儲器產品解決方案公司　(亦以思得名稱營業)</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡塔瓦拉　古勒札爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATHAWALA, GULZAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦誇爾　約格甚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKCHAURE, YOGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德福里斯　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE VRIES, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾頓　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLTON, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安維信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, YUSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴兌訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, TAEHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙完益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, WANIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露內容的某些實施例，藉由儲存裝置的處理電路執行一種方法，以用於將資料寫入儲存裝置的記憶體。所述方法是相關於執行程式以利用單一程式化命令來將被寫入記憶體的第一部分中的複數個單層式儲存單元(SLC)內的資料寫入記憶體的第二部分中的複數個多層式儲存單元(MLC)。單一程式化命令包含在記憶體的第一部分中的每一個SLC的位址，且可選地包含有關SLC讀取位準的移位的額外的資訊。執行單一程式化命令包含從所述複數個SLC的每一個SLC讀取、將個別的SLC資料的至少某些資料儲存在複數個鎖存器中、以及將儲存在複數個鎖存器中的SLC資料寫入所述複數個MLC。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In accordance with some embodiments of the present disclosure, a method is performed by processing circuitry of a storage device for writing data to memory of a storage device. The method is related to executing a program to write data written in a plurality of single-layer cells (SLCs) in a first portion of the memory to a plurality of multi-level cells (MLCs) in a second portion of the memory using a single program command. The single program command includes an address of each SLC in the first portion of the memory and optionally, additional information regarding SLC read-level shifts. Executing the single program command includes reading from each SLC of the plurality of SLCs, storing at least some of the respective SLC data in the plurality of latches, and writing the SLC data that was stored in the plurality of latches to the plurality of MLCs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:裝置</p>
        <p type="p">102:記憶體控制器</p>
        <p type="p">103:記憶體</p>
        <p type="p">104:主機</p>
        <p type="p">105:命令</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1381" publication-number="202619464">
    <tif-files tif-type="multi-tif">
      <tif file="114122926.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括碳奈米結構（CNS）填料於液晶聚合物（LCP）基材中的電磁干擾（EMI）吸收材料</chinese-title>
        <english-title>ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBERS INCLUDING CARBON NANOSTRUCTURE (CNS) FILLER WITHIN LIQUID CRYSTAL POLYMER (LCP) MATRIX</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05K9/00</main-classification>
        <further-classification edition="201101120260123B">B82Y30/00</further-classification>
        <further-classification edition="201101120260123B">H01R13/6598</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷爾德科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAIRD TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克斑　道格拉斯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCBAIN, DOUGLAS S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特蘭蒂納　艾瑞克　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRANTINA, ERIC E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示包括碳奈米結構（CNS）填料於一液晶聚合物（LCP）基材中的電磁干擾（EMI）吸收材料及組成物。在例示性具體實例中，一電磁干擾（EMI）吸收材料在一基材內包含碳奈米結構填料。該基材包含液晶聚合物。且該EMI吸收材料在該基材內包括至少約0.1重量%但不超過約5重量%的該碳奈米結構填料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are electromagnetic interference (EMI) absorbers and compositions including carbon nanostructure (CNS) filler within a liquid crystal polymer (LCP) matrix. In exemplary embodiments, an electromagnetic interference (EMI) absorber comprises carbon nanostructure filler within a matrix. The matrix comprises liquid crystal polymer. And the EMI absorber includes at least about 0.1 weight percent but not more than about 5 weight percent of the carbon nanostructure filler within the matrix.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可射出模製的熱塑性EMI吸收材料丸粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1382" publication-number="202618066">
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      <tif file="114122927.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618066</doc-number>
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        <document-id>
          <doc-number>114122927</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、藉由使用其處理含金屬層的方法及藉由使用其製造半導體裝置的方法</chinese-title>
        <english-title>COMPOSITION, METHOD OF TREATING METAL-CONTAINING LAYER BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23F1/34</main-classification>
        <further-classification edition="200601120260202B">H01L21/306</further-classification>
        <further-classification edition="200601120260202B">H01L21/308</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAM, CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高基淏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, GIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNGCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金吉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹園植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, WONSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙旻炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MINHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河東勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, DONGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成物、一種藉由使用其處理含金屬層的方法及一種藉由使用其製造半導體裝置的方法，該組成物包括氧化劑、一以銨為主之緩衝劑以及一蝕刻控制劑，其中該蝕刻控制劑包括一由式1表示之化合物。&lt;br/&gt;  (式1)&lt;br/&gt;  R&lt;sub&gt;1&lt;/sub&gt;-O-(L&lt;sub&gt;1&lt;/sub&gt;-O)&lt;sub&gt;n&lt;/sub&gt;-X&lt;sub&gt;1&lt;/sub&gt;-T&lt;sub&gt;1&lt;/sub&gt;&lt;br/&gt;  其中，在式1中，&lt;br/&gt;  R&lt;sub&gt;1&lt;/sub&gt;為一具有1至50個碳原子之飽和或不飽和脂族端基，&lt;br/&gt;  L&lt;sub&gt;1&lt;/sub&gt;為一具有1至10個碳原子之飽和或不飽和脂族連接基團，&lt;br/&gt;  n為一自1至30之整數，&lt;br/&gt;  *-X&lt;sub&gt;1&lt;/sub&gt;-T&lt;sub&gt;1&lt;/sub&gt;為*-C(R&lt;sub&gt;2&lt;/sub&gt;)(R&lt;sub&gt;3&lt;/sub&gt;)-C(=O)-O-T&lt;sub&gt;1&lt;/sub&gt;或*-S(=O)&lt;sub&gt;2&lt;/sub&gt;-O-T&lt;sub&gt;1&lt;/sub&gt;，&lt;br/&gt;  R&lt;sub&gt;2&lt;/sub&gt;及R&lt;sub&gt;3&lt;/sub&gt;各自獨立地為氫或C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt;烷基，&lt;br/&gt;  T&lt;sub&gt;1&lt;/sub&gt;為氫、鹼金屬或銨基，&lt;br/&gt;  *為與一相鄰原子之一鍵結位點，以及&lt;br/&gt;  R&lt;sub&gt;1&lt;/sub&gt;、L&lt;sub&gt;1&lt;/sub&gt;及該C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt;烷基中之至少一個氫任擇地經C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt;烷基、C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt;烯基、C&lt;sub&gt;3&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt;碳環基、C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt;雜環基或其一組合取代。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a composition, a method of treating a metal-containing layer by using the same, and a method of manufacturing a semiconductor device by using the same, the composition including an oxidizer, an ammonium-based buffer, and an etching controller, wherein the etching controller includes a compound represented by Formula 1.&lt;br/&gt; (Formula 1)&lt;br/&gt; R&lt;sub&gt;1&lt;/sub&gt;-O-(L&lt;sub&gt;1&lt;/sub&gt;-O)&lt;sub&gt;n&lt;/sub&gt;-X&lt;sub&gt;1&lt;/sub&gt;-T&lt;sub&gt;1&lt;/sub&gt;&lt;br/&gt; wherein, in Formula 1,&lt;br/&gt; R&lt;sub&gt;1&lt;/sub&gt; is a saturated or unsaturated aliphatic terminal group having 1 to 50 carbon atoms,&lt;br/&gt; L&lt;sub&gt;1&lt;/sub&gt; is a saturated or unsaturated aliphatic linking group having 1 to 10 carbon atoms,&lt;br/&gt; n is an integer from 1 to 30,&lt;br/&gt; *-X&lt;sub&gt;1&lt;/sub&gt;-T&lt;sub&gt;1&lt;/sub&gt; is *-C(R&lt;sub&gt;2&lt;/sub&gt;)(R&lt;sub&gt;3&lt;/sub&gt;)-C(=O)-O-T&lt;sub&gt;1&lt;/sub&gt; or *-S(=O)&lt;sub&gt;2&lt;/sub&gt;-O-T&lt;sub&gt;1&lt;/sub&gt;,&lt;br/&gt; R&lt;sub&gt;2&lt;/sub&gt; and R&lt;sub&gt;3&lt;/sub&gt; are each independently hydrogen or a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt; alkyl group,&lt;br/&gt; T&lt;sub&gt;1&lt;/sub&gt; is hydrogen, an alkali metal, or an ammonium group,&lt;br/&gt; * is a bonding site with a neighboring atom, and&lt;br/&gt; at least one hydrogen in R&lt;sub&gt;1&lt;/sub&gt;, L&lt;sub&gt;1&lt;/sub&gt; and the C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt; alkyl group is optionally substituted with a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt; alkyl group, a C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt; alkenyl group, a C&lt;sub&gt;3&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt; carbocyclic group, a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;30&lt;/sub&gt; heterocyclic group, or a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1383" publication-number="202617713">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啶GPR52調節劑及其使用方法
      </chinese-title>
        <english-title>NAPHTHYRIDINE GPR52 MODULATORS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/04</main-classification>
        <further-classification edition="200601120260202B">C07D401/04</further-classification>
        <further-classification edition="200601120260202B">C07D403/04</further-classification>
        <further-classification edition="200601120260202B">C07D487/04</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61K31/444</further-classification>
        <further-classification edition="200601120260202B">A61K31/506</further-classification>
        <further-classification edition="200601120260202B">A61K31/501</further-classification>
        <further-classification edition="200601120260202B">A61K31/4725</further-classification>
        <further-classification edition="200601120260202B">A61K31/502</further-classification>
        <further-classification edition="200601120260202B">A61K31/53</further-classification>
        <further-classification edition="200601120260202B">A61K31/4985</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賴柏學院有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEBER INSTITUTE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波斯尼　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POSLUSNEY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴羅　詹姆士　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARROW, JAMES C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　萊昂　巴勃羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE LEON, PABLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布克勒　英格麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHLER, INGRID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃義方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YIFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩斯特　格倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERNST, GLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供調節GPR52活性之化合物。此等化合物可為GPR52促效劑。本文亦提供包含該等調節GPR52之化合物的組合物以及其使用方法。該等方法可用於治療神經、神經精神及神經退化性疾病或病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides compounds that modulate GPR52 activity. These compounds may be GPR52 agonists. Also provided herein are compositions comprising the GPR52 modulating compounds, and their methods of use. The methods are useful for the treatment of neurological, neuropsychiatric, and neurodegenerative diseases or disorders.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1384" publication-number="202617761">
    <tif-files tif-type="multi-tif">
      <tif file="114122958.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體募集分子</chinese-title>
        <english-title>ANTIBODY-RECRUITING MOLECULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/18</main-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="201701120260202B">A61K47/54</further-classification>
        <further-classification edition="201701120260202B">A61K47/62</further-classification>
        <further-classification edition="200601120260202B">A61K39/00</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商艾伯霖克斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABLYNX NV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯蒂爾斯　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASTEELS, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴沃赫萊爾　廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE VOGELAERE, LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福伯特　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUBERT, ELLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本技術關於藥物遞送領域，並提供了包含至少一個基於蛋白質的載體構建單元或由其組成的分子，其中該基於蛋白質的載體構建單元包含至少兩個附接點或偶聯位點，其中該分子進一步包含 (i) 至少兩個抗體結合組分，較佳的是至少兩個半抗原單元，較佳的是選自磷酸膽鹼、二硝基苯基（DNP）、半乳糖-α-1,3-半乳糖（αGal）和鼠李糖（Rha），更較佳的是至少二個鼠李糖分子，其直接或藉由連接子共價連接到該至少一個基於蛋白質的構建單元中包含的至少一個偶聯位點或附接點，和 (ii) 至少一個靶向部分，其直接或藉由連接子共價連接到該至少一個基於蛋白質的構建單元中包含的至少一個偶聯位點或附接點。特別地，本技術分子中包含的至少一個基於蛋白質的構建單元：a) 包含至少一個偶聯位點或附接點；b) 具有2.5至70 kDa的分子量；c) 具有球狀三維（3D）結構；d) 在室溫下在水溶液中測量的溶解度為10 mg/mL或更高；以及e) 不特異性結合任何人類蛋白質或以K&lt;sub&gt;D&lt;/sub&gt;值大於5 x 10&lt;sup&gt;-4&lt;/sup&gt; mol/公升結合一種或多種人類蛋白質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present technology relates to the field of drug delivery and provides molecules comprising or consisting of at least one protein-based carrier building block, wherein the protein-based carrier building block comprises at least two attachment point(s) or conjugation site(s), wherein the molecule further comprises (i) at least two antibody-binding components, preferably at least two hapten units, preferably selected from phosphorylcholine, dinitrophenyl (DNP), galactose-α-1,3-galactose (αGal) and rhamnose (Rha), more preferably at least two rhamnose molecules, covalently linked, directly or by means of a linker, to at least one conjugation site or attachment point comprised in the at least one protein-based building block and (ii) at least one targeting moiety covalently linked, directly or by means of a linker, to at least one conjugation site or attachment point comprised in the at least one protein-based building block. In particular, the at least one protein-based building block comprised in the molecule of the technology: a) comprises at least one conjugation site or attachment point; b) has a molecular mass of 2.5 to 70 kDa; c) has a globular three-dimensional (3D) structure; d) has a solubility of 10 mg/mL or more, measured in an aqueous solution at room temperature; and e) does not specifically bind to any human protein or binds one or more human proteins with a K&lt;sub&gt;D&lt;/sub&gt; value greater than 5 x 10&lt;sup&gt;-4&lt;/sup&gt; mol/litre.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1385" publication-number="202617769">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體藥物結合物</chinese-title>
        <english-title>ANTIBODY DRUG CONJUGATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">C07D491/22</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商映恩生物製藥（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUALITY BIOLOGICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜恩技術股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONTECH SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱　陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施　榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱忠遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHONGYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒂貝斯　拉烏爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIBES, RAOUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫格　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENGER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方梁華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, LIANGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含特異性結合至B7-H3之抗體或其片段的抗體藥物結合物(ADC)，其用於治療癌症，特別是去勢抵抗性前列腺癌及小細胞肺癌。本發明亦關於含有此等抗體-藥物結合物之組合物，其用於治療癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to antibody drug conjugates (ADCs) comprising an antibody or fragment thereof that specifically binds to B7-H3, for use in the treatment of cancers, in particular castration-resistant prostate cancer and small-cell lung cancer. The invention also relates to compositions containing such antibody-drug conjugates, for use in the treatment of cancers.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1386" publication-number="202617197">
    <tif-files tif-type="multi-tif">
      <tif file="114122966.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122966</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於血液製品病原體滅活之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR PATHOGEN INACTIVATION OF BLOOD PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61M1/36</main-classification>
        <further-classification edition="200601120260202B">A61M1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西勒斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布林曼　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRINGMANN, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雀爾斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHURCH, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍坦　美樂蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLTAN, MELODY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾森　洛依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISON, LLOYD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆夫提　娜希德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUFTI, NAHEED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾松　尼爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSSON, NILS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕塔　維娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATA, VEENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖塔　瑪麗亞　菲莉西亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTA MARIA, FELICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史登　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STERN, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦爾賓頓　布萊克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARBINGTON, BLAKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於血液製品及組合物的病原體滅活之方法及系統，包括使用裝置(例如，包含經構形以控制流體流動的組件)以測定血液組合物病原體滅活所需的病原體滅活化合物(PIC)的量(例如，至少部分地基於一或多個輸入參數)且實現將血液組合物及PIC轉移至例如處理套件的容器中的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods and systems for the pathogen inactivation of blood products and compositions, including methods of using devices (&lt;i&gt;e.g.&lt;/i&gt;, comprising component(s) configured to control flow of fluid(s)) to determine the amount of pathogen inactivation compound (PIC) necessary for pathogen inactivation of a blood composition (&lt;i&gt;e.g.&lt;/i&gt;, based at least in part on one or more input parameters) and allow transfer of the blood composition and the PIC into a container, &lt;i&gt;e.g.&lt;/i&gt;, of a processing set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:血液組合物容器</p>
        <p type="p">104:混合容器</p>
        <p type="p">106:PIC容器</p>
        <p type="p">108:稀釋劑容器</p>
        <p type="p">110:顯示器</p>
        <p type="p">112:條碼掃描儀</p>
        <p type="p">114:標籤印表機</p>
        <p type="p">116:消耗品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1387" publication-number="202619302">
    <tif-files tif-type="multi-tif">
      <tif file="114122976.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202619302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置以及消除電子裝置的接收訊號中的自干擾的方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD OF CANCELLING SELF-INTERFERENCE IN A RECEPTION SIGNAL OF AN ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H04B1/10</main-classification>
        <further-classification edition="200601120260123B">H04B1/04</further-classification>
        <further-classification edition="201501120260123B">H04B1/525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳侖錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, YOONSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔明均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MYEONGGYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任炯先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, HYUNG SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔弘旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許準會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, JOONHOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包括：濾波器電路，自接收訊號提取存在於用於發射訊號的發射通道與用於接收訊號的接收通道之間的雙工間隙洩漏（duplex gap leakage，DGL）分量，基於發射訊號及DGL分量對接收訊號的實際交互調變失真（intermodulation distortion，IMD）分量進行建模以產生估計的IMD分量；以及消除電路，對估計的IMD分量實行數位濾波操作以產生經濾波IMD分量，並自接收訊號消除經濾波IMD分量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a filter circuit extracting a duplex gap leakage (DGL) component present between a transmission channel for a transmission signal and a reception channel for a reception signal, from the reception signal, modeling an actual intermodulation distortion (IMD) component of the reception signal based on the transmission signal and the DGL component to generate an estimated IMD component, and a cancellation circuit performing a digital filtering operation on the estimated IMD component to generate a filtered IMD component and cancelling the filtered IMD component from the reception signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線通訊裝置</p>
        <p type="p">110:處理器</p>
        <p type="p">120:射頻積體晶片(RFIC)</p>
        <p type="p">130:前端模組(FEM)</p>
        <p type="p">RX:接收訊號</p>
        <p type="p">RX_CAN:消除了IMD分量的接收訊號</p>
        <p type="p">TX:發射訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1388" publication-number="202617096">
    <tif-files tif-type="multi-tif">
      <tif file="114122992.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>植針結構及植入裝置</chinese-title>
        <english-title>INSERTION NEEDLE STRUCTURE AND INSERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61B17/34</main-classification>
        <further-classification edition="200601120260123B">A61B5/145</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華廣生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONIME CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃立綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳界行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEH-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TSUNG-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種植針結構，用於容置生物感測器並將其部分植入生物體皮表下。植針結構包含一針尖以及一針身。針身與針尖一體連接並具有一容置空間用以容納生物感測器，且針身包含一底牆、二側牆、二坡段以及二圓弧連接段。二側牆分別位於底牆的二側，二側牆至少部分不平行，且各側牆至少部分平直。二坡段分別位於底牆的二側，各坡段連接於各側牆與針尖之間並概呈凸弧狀。各圓弧連接段連接於各側牆與底牆之間，及連接於各坡段與底牆之間。其中，針尖自底牆及二圓弧連接段延伸。藉此植針結構可更順暢地插入生物體皮表。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an insertion needle structure for receiving and allowing a biosensor to be partially implanted underneath a skin surface of an organism. The insertion needle structure includes a needle sharp and a needle body. The needle body is integrally connected to the needle sharp and has a receiving space for receiving the biosensor. The needle body includes a base wall, two side walls, two slop sections and two curved connecting sections. The two side walls are located at two sides of the base wall, respectively, the two side walls are at least partially nonparallel, and each of the two side walls is at least partially flat. The two slope sections are located at the two sides of the base wall, respectively, each of the slope sections is connected between each of the side walls and the needle sharp, and each of the slope sections is curved. Each of the curved connecting sections is connected between each of the side walls and the base wall and between each of the slope sections and the base wall. The needle sharp extends from the base wall and the curved connecting sections. Therefore, the insertion needle structure can be more smoothly inserted into the skin surface of the organism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:植針結構</p>
        <p type="p">1100:針身</p>
        <p type="p">1110:側牆</p>
        <p type="p">1110a:第一區段</p>
        <p type="p">1110b:第二區段</p>
        <p type="p">1111:第一內緣</p>
        <p type="p">1112:第一外緣</p>
        <p type="p">1120:坡段</p>
        <p type="p">1121:第二內緣</p>
        <p type="p">1122:第二外緣</p>
        <p type="p">1130:底牆</p>
        <p type="p">1140:圓弧連接段</p>
        <p type="p">1200:針尖</p>
        <p type="p">1300:組裝主體</p>
        <p type="p">1310:平直牆</p>
        <p type="p">1400:連接主體</p>
        <p type="p">1410:連接牆</p>
        <p type="p">I1:中心線</p>
        <p type="p">S1:容置空間</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">X:寬度方向</p>
        <p type="p">Y:長度方向</p>
        <p type="p">Z:高度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1389" publication-number="202617567">
    <tif-files tif-type="multi-tif">
      <tif file="114122993.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑件之轉移構造</chinese-title>
        <english-title>TRANSFER STRUCTURE OF SLIDER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B65G54/02</main-classification>
        <further-classification edition="200601120260123B">H02K41/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＨＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山中修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本聖也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種滑件之轉移構造，其可使滑件從輸送機裝置平順地轉移至線性模組上。一種滑件(4)從輸送機裝置朝向線性模組(5b)之轉移構造，其中，線性模組(5b)具備有線性馬達之定子(11)、及線性導件之軌道(12)；滑件(4)具備有線性馬達之動子、及線性導件之塊體(22)。在線性模組(5b)設有導引支撐具(15)，當滑件(4)從輸送機裝置轉移至線性模組(5b)時，其與滑件(4)相接觸而可抑制滑件(4)之傾斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a transfer structure of a slider for smooth transfer of the slider (4) from a conveyor device toward a linear module (5b), wherein the linear module (5b) comprises a stator (11) of a linear motor and a rail (12) of a linear guide, and the slider (4) comprises a rotor of the linear motor and a block (22) of the linear guide. The linear module (5b) is provided with a guide support (15) which is contacted with the slider (4) when the slider (4) is transferred from the conveyor device to the linear module (5b), so as to inhibit the slider (4) from slanting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:滑件</p>
        <p type="p">4a:滑件之底面</p>
        <p type="p">4b:滑件之側面</p>
        <p type="p">5b:線性模組</p>
        <p type="p">11:線性馬達之定子</p>
        <p type="p">12:線性導件之軌道</p>
        <p type="p">12a:滾動移行溝槽</p>
        <p type="p">13:框架</p>
        <p type="p">14:位置感測器</p>
        <p type="p">15:導引支撐具</p>
        <p type="p">16:導引間隔具</p>
        <p type="p">17:樹脂部</p>
        <p type="p">18:本體部</p>
        <p type="p">22:線性導件之塊體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1390" publication-number="202618856">
    <tif-files tif-type="multi-tif">
      <tif file="114123028.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用模組化諧振電路回收RF能量的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR RECOVERING RF ENERGY USING MODULAR RESONANT CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H01J37/32</main-classification>
        <further-classification edition="200601120260116B">H02M3/335</further-classification>
        <further-classification edition="200601120260116B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　阿密特　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, AMIT KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述使用模組化諧振電路回收射頻(RF)能量的系統及方法。其中一系統包含複數模組化諧振電路。複數模組化諧振電路之各者包含二極體、開關及電感器，開關並聯耦接至二極體以形成並聯電路，電感器與並聯電路串聯耦接以形成串聯電路。模組化諧振電路包含透過串聯二極體耦接至電感器的電容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for recovering radio frequency (RF) energy using modular resonant circuits are described. One of the systems includes a plurality of modular resonant circuits. Each of the plurality of modular resonant circuits includes a diode, a switch coupled in parallel to the diode to form a parallel circuit, and an inductor coupled in series with the parallel circuit to form a series circuit. The modular resonant circuit includes a capacitor coupled to the inductor through a series diode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C1a:電容器</p>
        <p type="p">C1b:電容器</p>
        <p type="p">Cna:電容器、平衡電容器</p>
        <p type="p">Cnb:電容器</p>
        <p type="p">D1a:二極體</p>
        <p type="p">D1b:二極體</p>
        <p type="p">Dna:二極體</p>
        <p type="p">Dnb:二極體</p>
        <p type="p">L1~Ln:電感器</p>
        <p type="p">R1~Rn:電阻器</p>
        <p type="p">SW1~SWn:開關</p>
        <p type="p">VS1~VSn:電壓源</p>
        <p type="p">100:系統</p>
        <p type="p">102:主機電腦</p>
        <p type="p">104:充電器電路</p>
        <p type="p">106:離子通量補償(IFC)電路</p>
        <p type="p">108:電漿腔室</p>
        <p type="p">110:磁能回收(MER)電路</p>
        <p type="p">1121~112n:模組化諧振電路</p>
        <p type="p">114:諧振電感器</p>
        <p type="p">116:電壓感測器</p>
        <p type="p">118:二極體</p>
        <p type="p">120:阻隔電容器</p>
        <p type="p">122:處理器</p>
        <p type="p">124:記憶體裝置</p>
        <p type="p">126:RF連接</p>
        <p type="p">128:點</p>
        <p type="p">130:RF連接</p>
        <p type="p">132:RF連接</p>
        <p type="p">134:點</p>
        <p type="p">136:RF連接</p>
        <p type="p">1381:連接</p>
        <p type="p">138n:連接</p>
        <p type="p">140:脈衝DC電壓</p>
        <p type="p">142:非正弦RF電壓、非正弦電壓</p>
        <p type="p">144:電壓量測信號、量測信號</p>
        <p type="p">1461~146n:on控制信號</p>
        <p type="p">1481~148n:off控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1391" publication-number="202618937">
    <tif-files tif-type="multi-tif">
      <tif file="114123048.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶粒接合膜及其製造方法、切割晶粒接合一體型膜及其製造方法、以及半導體裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/52</main-classification>
        <further-classification edition="201801120260123B">C09J7/35</further-classification>
        <further-classification edition="200601120260123B">C09J11/04</further-classification>
        <further-classification edition="200601120260123B">C09J11/06</further-classification>
        <further-classification edition="200601120260123B">C09J11/08</further-classification>
        <further-classification edition="200601120260123B">C09J201/00</further-classification>
        <further-classification edition="200601120260123B">H01L21/301</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口紘平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAE, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大沼悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONUMA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋吉利泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYOSHI, TOSHIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種晶粒接合膜。該晶粒接合膜含有藉由還原法製造之含銀粒子及由式（1）表示之化合物。含銀粒子的含量以晶粒接合膜的總量為基準為70質量%以上。  &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="458px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式（1）中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;分別獨立地表示氫原子、鹵素原子、可經鹵素原子取代之甲基或可經鹵素原子取代之乙基。  &lt;br/&gt;其中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;中的至少一個為鹵素原子、可經鹵素原子取代之甲基或可經鹵素原子取代之乙基。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:晶粒接合膜</p>
        <p type="p">20:支撐膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1392" publication-number="202617279">
    <tif-files tif-type="multi-tif">
      <tif file="114123049.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異物除去裝置及異物除去方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260123B">B08B1/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林博昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]可防止半導體元件的檢查良率的下降，並可提升半導體元件的檢查效率。  &lt;br/&gt;　　[解決手段]異物除去裝置，具備：將基板夾持於之間的複數個滾輪對，複數個滾輪對沿與基板的表面平行的方向排列，基板在各滾輪對之間沿著平行的方向往返移動，複數個滾輪對具有：與基板接觸並將基板朝往路方向驅動的複數個第1滾輪對，及與基板接觸並將基板朝返路方向驅動的複數個第2滾輪對，黏著片介於第1滾輪對與基板之間，及第2滾輪對與基板之間中的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S:進入空間</p>
        <p type="p">W:晶圓</p>
        <p type="p">10:異物除去裝置</p>
        <p type="p">11:第1驅動模組</p>
        <p type="p">12:第2驅動模組</p>
        <p type="p">13:第1上部單元</p>
        <p type="p">14:第1下部單元</p>
        <p type="p">15:第1上部驅動輪</p>
        <p type="p">16:第1下部驅動輪</p>
        <p type="p">17:第2上部單元</p>
        <p type="p">18:第2下部單元</p>
        <p type="p">19:第2上部驅動輪</p>
        <p type="p">20:第2下部驅動輪</p>
        <p type="p">21:黏著片</p>
        <p type="p">22:黏著片</p>
        <p type="p">23:黏著片</p>
        <p type="p">24:黏著片</p>
        <p type="p">25:第1上部送出輪</p>
        <p type="p">26:第1上部捲取輪</p>
        <p type="p">27:第1下部送出輪</p>
        <p type="p">28:第1下部捲取輪</p>
        <p type="p">29:第2上部送出輪</p>
        <p type="p">30:第2上部捲取輪</p>
        <p type="p">31:第2下部送出輪</p>
        <p type="p">32:第2下部捲取輪</p>
        <p type="p">33:往路止動件</p>
        <p type="p">34:返路止動件</p>
        <p type="p">36:綠燈</p>
        <p type="p">37:攝像機</p>
        <p type="p">38:離子產生器</p>
        <p type="p">39:綠燈</p>
        <p type="p">40:攝像機</p>
        <p type="p">41:離子產生器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1393" publication-number="202618838">
    <tif-files tif-type="multi-tif">
      <tif file="114123050.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微通道板及其製造方法、相關影像增強管及夜視系統</chinese-title>
        <english-title>MICROCHANNEL PLATE, MANUFACTURING METHOD, ASSOCIATED IMAGE INTENSIFIER TUBE AND NIGHT VISION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01J9/12</main-classification>
        <further-classification edition="200601120260123B">H01J43/04</further-classification>
        <further-classification edition="200601120260123B">H01J31/50</further-classification>
        <further-classification edition="200601120260123B">G02B23/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商佛托尼斯法國簡易股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOTONIS FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏左特　馬蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAZOT, MATTHIEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯卡　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASCAL, FABIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種微通道板(18)，包含一本體(39)，設有複數個管狀微通道(25)，其迴轉軸彼此平行；及一功能化層(33)，其存在每一微通道(25)之內表面上。&lt;br/&gt;  根據本發明，形成本體(39)的材料係純二氧化矽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns a microchannel plate (18) comprising a body (39) provided with a plurality of tubular microchannels (25) having their axes of revolution parallel to one another; and a functionalization layer (33) present on an inner surface of each microchannel (25).&lt;br/&gt; According to the invention, the material forming the body (39) is pure silica.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:微通道板</p>
        <p type="p">25:微通道板</p>
        <p type="p">39:本體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1394" publication-number="202617330">
    <tif-files tif-type="multi-tif">
      <tif file="114123053.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合真空靜電吸盤</chinese-title>
        <english-title>HYBRID VACUUM ELECTROSTATIC CHUCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B23Q3/08</main-classification>
        <further-classification edition="200601120260123B">B23Q3/15</further-classification>
        <further-classification edition="200601120260123B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIAN, GANESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅恰　朱安Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHA, JUAN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施例大體而言係關於一種具有真空和靜電吸附功能的基板吸附裝置及相關方法。在一或多個實施例中，基板吸附裝置包含具有吸附表面的主體及與主體耦接的軸，該軸位於該吸附表面的對側。該基板吸附裝置進一步包括設置在該主體內的吸附電極以及在主體內形成的真空通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present invention generally relate to a substrate chucking apparatus having both vacuum and electrostatic chucking functions and related methods. In one or more embodiments, a substrate chucking apparatus incudes a body having a chucking surface and a shaft coupled to the body opposite to the chucking surface. The substrate chucking apparatus further includes a chucking electrode disposed within the body and a vacuum channel formed within the body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">115:主體</p>
        <p type="p">116:吸附電極</p>
        <p type="p">117:電源</p>
        <p type="p">118:隔離變壓器</p>
        <p type="p">119:真空通道</p>
        <p type="p">125:軸</p>
        <p type="p">150:混合吸附裝置</p>
        <p type="p">151:吸附表面</p>
        <p type="p">152:開口</p>
        <p type="p">153:通道</p>
        <p type="p">162:真空泵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1395" publication-number="202618182">
    <tif-files tif-type="multi-tif">
      <tif file="114123060.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>復熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">F23L15/00</main-classification>
        <further-classification edition="200601120260129B">F28F1/10</further-classification>
        <further-classification edition="200601120260129B">F23C3/00</further-classification>
        <further-classification edition="200601120260129B">F23D14/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外爐工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI RO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河本祐作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口脩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾松大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMATSU, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阪本佳史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, YOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川端健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鹿園直毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIKAZONO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村勝彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSU, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井元尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, MOTOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田幹則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOTTA, MIKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永知佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, CHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嶋村彰紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAMURA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種更加提升燃燒排氣與燃燒用空氣之間的熱交換功能的復熱器。&lt;br/&gt;  [解決手段]一種復熱器3，是在於輻射管1內流動的燃燒排氣與為了使輻射管1用的燃燒器燃燒用的燃燒用空氣之間進行熱交換的復熱器3，在復熱器3的外表面，形成有在復熱器3的長邊方向上延伸成鋸齒形狀的複數個溝部7。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:復熱器</p>
        <p type="p">7:溝部</p>
        <p type="p">8:突出部</p>
        <p type="p">9:凸緣</p>
        <p type="p">31:本體部</p>
        <p type="p">31a:分割體</p>
        <p type="p">31b:接合部</p>
        <p type="p">32:前端部</p>
        <p type="p">33:半球部</p>
        <p type="p">34:圓筒部</p>
        <p type="p">38:前端</p>
        <p type="p">39:後端</p>
        <p type="p">71:屈曲部</p>
        <p type="p">71a:彎折</p>
        <p type="p">71b:彎折</p>
        <p type="p">72:前端</p>
        <p type="p">X:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1396" publication-number="202618504">
    <tif-files tif-type="multi-tif">
      <tif file="114123080.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123080</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基於感測器資料來動態地調整低壓差穩壓器的參數的校正電路</chinese-title>
        <english-title>CORRECTION CIRCUIT FOR DYNAMICALLY ADJUSTING A PARAMETER OF A LOW DROPOUT REGULATOR BASED ON SENSOR DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G05F1/575</main-classification>
        <further-classification edition="200601120260123B">G05F1/567</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英飛淩科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INFINEON TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋亞里　伊蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEYARI, ERAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈魯什　阿夫里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARUSH, AVRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">茲敘述與低壓差穩壓電路系統的穩定性相關的技術。電路包括放大器，其基於在反饋迴路電壓與參考電壓的比較結果來提供電壓。耦合到此放大器的比較電路基於經測量溫度來動態地調整被供應到放大器的電流量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Technologies related to low dropout regulation circuitry stabilization are described. A circuit includes an amplifier to supply a voltage based on a comparison of a feedback loop voltage and a reference voltage. A comparison circuit coupled to the amplifier dynamically adjusts an amount of current supplied to the amplifier based on a measured temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路</p>
        <p type="p">110:低壓差穩壓器(LDO)</p>
        <p type="p">112:放大器</p>
        <p type="p">114:通路元件</p>
        <p type="p">116:分壓器</p>
        <p type="p">120:校正電路</p>
        <p type="p">I&lt;sub&gt;OUT&lt;/sub&gt;:負載電流</p>
        <p type="p">V&lt;sub&gt;FB&lt;/sub&gt;:反饋電壓</p>
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:LDO輸出電壓</p>
        <p type="p">V&lt;sub&gt;REF&lt;/sub&gt;:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1397" publication-number="202619043">
    <tif-files tif-type="multi-tif">
      <tif file="114123083.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合混合結構</chinese-title>
        <english-title>COMPOSITE HYBRID STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/00</main-classification>
        <further-classification edition="202301120260123B">H01L25/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏佐　賽普里恩　艾米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZOH, CYPRIAN EMEKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克曼　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WORKMAN, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　桂蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, GUILIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於製造具有導電接觸墊之介電層的方法，以及直接接合這些介電層之介電接合表面及導電接合表面的方法。在一些態樣中，該方法包括將拋光停止層安置於介電層之頂部上之介電接合表面上。將導電層安置於該拋光停止層之頂部上，且接著進行拋光以形成具有經拋光導電接合表面之導電接觸墊。在拋光程序期間，該拋光停止層減少介電邊緣之圓化以及緊密間隔之導電接合表面之間的這些介電接合表面之侵蝕。由此產生之經拋光介電接合表面及導電接合表面直接接合至另一介電層之介電接合表面及導電接合表面以形成導電互連。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for fabrication dielectric layers having conductive contact pads, and directly bonding the dielectric and conductive bonding surfaces of the dielectric layers. In some aspects, the method includes disposing a polish stop layer on dielectric bonding surfaces on top of a dielectric layer. A conductive layer is disposed on top of the polish stop layer and then polished to form conductive contact pads having polished conducting bonding surfaces. During the polishing process, the polish stop layer reduces rounding of dielectric edges and erosion of the dielectric bonding surfaces between closely spaced conductive bonding surfaces. The resulting polished dielectric and conductive bonding surfaces are directly bonded to dielectric and conductive bonding surfaces of another dielectric layer to form conductive interconnects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:複合撓性混合接合式結構</p>
        <p type="p">111:混合接合表面</p>
        <p type="p">114a:組件/第一組件/晶粒</p>
        <p type="p">114b:組件/第二組件/晶粒</p>
        <p type="p">118:撓性混合接合層/撓性混合接合基板/撓性層</p>
        <p type="p">120:介電層</p>
        <p type="p">122:介電層</p>
        <p type="p">124:混合接合界面</p>
        <p type="p">128:撓性子層</p>
        <p type="p">130:撓性子層</p>
        <p type="p">132:撓性子層</p>
        <p type="p">134:撓性子層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1398" publication-number="202617483">
    <tif-files tif-type="multi-tif">
      <tif file="114123087.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617483</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧座艙整合系統及其行人偵測方法</chinese-title>
        <english-title>SMART COCKPIT INTEGRATION SYSTEM AND PEDESTRIAN DETECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251118B">B60W30/095</main-classification>
        <further-classification edition="202201120251118B">B60R1/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇美車電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIMEI MOTOR ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐學賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSUEH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王承謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-CHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝正達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧座艙整合系統，包含：環景影像擷取裝置及環景影像偵測伺服器。環景影像擷取裝置用以擷取車輛周圍之環景影像。環景影像偵測伺服器與環景影像擷取裝置連接以接收環景影像且包含行人偵測模組、影像分析模組及告警模組。行人偵測模組用以以行人偵測模型對環景影像進行偵測後，產生偵測框以在環景影像中框選出行人影像。影像分析模組用以根據偵測框於影像中心之相對位置決定偵測框上之偵測點，以計算偵測點與影像中心之行人距離。告警模組用以判斷行人距離是否小於或等於告警距離，若是則產生告警訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart cockpit integration system includes: a surround image capture device and a surround image detection server. The surround image capture device is used for capturing a surround image around a vehicle. The surround image detection server is connected to the surround image capture device to receive the surround image, and includes: a pedestrian detection module, an image analysis module and an alarm module. The pedestrian detection module is used for detecting the surround image with a pedestrian detection model and then generating a detection frame to select the pedestrian image in the surround image. The image analysis module is used for determining a detection point on the detection frame according to a relative position of the detection frame to an image center, so as to calculate a pedestrian distance between the detection point and the image center. The alarm module is used for determining whether the pedestrian distance is less than or equal to the alarm distance, and if so, generating an alarm signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智慧座艙整合系統</p>
        <p type="p">110:環景影像偵測伺服器</p>
        <p type="p">111:行人偵測模組</p>
        <p type="p">112:影像分析模組</p>
        <p type="p">113:告警模組</p>
        <p type="p">114:影像轉換模組</p>
        <p type="p">120:環景影像擷取裝置</p>
        <p type="p">130:告警裝置</p>
        <p type="p">140:顯示裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1399" publication-number="202618857">
    <tif-files tif-type="multi-tif">
      <tif file="114123088.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氟抗電漿介電成分</chinese-title>
        <english-title>FLUORINE PLASMA RESISTANT DIELECTRIC COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瓦科利　阿米爾Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVAKOLI, AMIR H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露大體而言係關於提供電漿處理腔室及其方法。該電漿處理腔室包括由蓋子覆蓋的腔室主體，腔室主體和蓋子限定了腔室內部空間。基板支撐安置在腔室內部空間內的支撐軸上。基板支撐包含主體，該主體具有上層，該上層包含陶瓷成分，以及下層，該下層包含氮化物、氧化物或碳化物。網格嵌入在下層中。一或多個加熱元件安置在靠近支撐軸的網格下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally provides plasma processing chambers and methods thereof. The plasma processing chambers comprises a chamber body covered by a lid, the chamber body and the lid defining a chamber interior volume. A substrate support is disposed on a support shaft within the chamber interior volume. The substrate support includes a body having a top layer including a ceramic composition and a lower layer including a nitride, an oxide, or a carbide. A mesh is embedded in the lower layer. One or more heating elements are disposed below the mesh proximal to the support shaft.</p>
      </isu-abst>
      <representative-img>
        <p type="p">124:氣箱</p>
        <p type="p">201:靜電吸盤</p>
        <p type="p">202:主體</p>
        <p type="p">202A:上層</p>
        <p type="p">202B:層</p>
        <p type="p">210:接合層</p>
        <p type="p">216:第一側</p>
        <p type="p">224:第二側</p>
        <p type="p">249:加熱元件</p>
        <p type="p">254:吸附電極</p>
        <p type="p">255:外徑</p>
        <p type="p">281:內部部分</p>
        <p type="p">282:外部部分</p>
        <p type="p">290:網格</p>
        <p type="p">292:導線</p>
        <p type="p">294:導線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1400" publication-number="202617180">
    <tif-files tif-type="multi-tif">
      <tif file="114123096.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩定的藥學製劑</chinese-title>
        <english-title>STABLE PHARMACEUTICAL PREPARATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K39/395</main-classification>
        <further-classification edition="200601120260202B">C07K16/24</further-classification>
        <further-classification edition="200601120260202B">A61K9/08</further-classification>
        <further-classification edition="200601120260202B">A61K47/22</further-classification>
        <further-classification edition="200601120260202B">A61K47/26</further-classification>
        <further-classification edition="200601120260202B">A61K47/36</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商賽特瑞恩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELLTRION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭聖恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, SUNG-EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金廣友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANG-WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金水晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洙荷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SU-HA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JUN-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李在彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAE-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓元鎔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, WON-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸宰珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAM, JAE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的穩定的藥學製劑包含：(A)依奇珠單抗(Ixekizumab)；及(B)組胺酸緩衝劑。根據本發明的穩定的藥學製劑包含抗體，特別是基於在加速條件及苛刻條件下優異的穩定性，長期保管穩定性優異，可靜脈或皮下給藥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stable pharmaceutical preparation according to the present invention comprises (A) ixekizumab; and (B) a histidine buffer. The stable pharmaceutical preparation according to the present invention comprises an antibody, exhibits excellent stability under accelerated and stringent conditions, as well as excellent long-term storage stability, and can be administered intravenously or subcutaneously.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1401" publication-number="202617181">
    <tif-files tif-type="multi-tif">
      <tif file="114123098.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗血漿激肽釋放酶抗體調配物</chinese-title>
        <english-title>ANTI-PLASMA KALLIKREIN ANTIBODY FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K39/395</main-classification>
        <further-classification edition="200601120260202B">C07K16/40</further-classification>
        <further-classification edition="200601120260202B">A61K47/18</further-classification>
        <further-classification edition="200601120260202B">A61K47/22</further-classification>
        <further-classification edition="200601120260202B">A61K47/26</further-classification>
        <further-classification edition="200601120260202B">A61K9/08</further-classification>
        <further-classification edition="200601120260202B">A61P7/10</further-classification>
        <further-classification edition="200601120260202B">A61M5/178</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商奧斯提亞治療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRIA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯施　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUESCH, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　薩迪什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SATISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威廉斯　伊娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAMS, EVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郁　寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示針對血漿激肽釋放酶之抗體，例如抗血漿激肽釋放酶抗體之調配物。該等調配物包括例如胺基酸、糖及界面活性劑。所揭示之調配物可用於向個體投與以治療血漿激肽釋放酶相關病症，諸如遺傳性血管水腫(HAE)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are formulations of antibodies directed against plasma kallikrein, e.g., anti-plasma kallikrein antibodies. The formulations include, for example, amino acids, sugars, and surfactants. The disclosed formulations are useful for administration to subjects to treat plasma kallikrein associated disorders such as hereditary angioedema (HAE).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1402" publication-number="202617770">
    <tif-files tif-type="multi-tif">
      <tif file="114123124.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經穩定化之結合分子</chinese-title>
        <english-title>STABILIZED BINDING MOLECULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
        <further-classification edition="200601120260202B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商生物極公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOARCTIC AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛克　朗尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALK, RONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷斯科加爾德　波　歐拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRESKGARD, PER-OLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍內克　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONEK, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉哈馬爾　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARHAMMAR, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞登　漢娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUDON, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯特爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISTER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德斯朱　麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDERSJOO, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種經穩定化之結合分子(例如抗體或其抗原結合片段)及其治療及診斷用途，該經穩定化之結合分子結合至人類運鐵蛋白受體1 (transferrin receptor 1；TfR1)之蛋白酶樣域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a stabilized binding molecule, for example an antibody or antigen-binding fragment thereof, which binds to the protease-like domain of human transferrin receptor 1 (TfR1), and to therapeutic and diagnostic uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1403" publication-number="202617998">
    <tif-files tif-type="multi-tif">
      <tif file="114123135.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＲＳＶ　ＦＧ嵌合體ｍＲＮＡ疫苗</chinese-title>
        <english-title>RSV FG CHIMERIC MRNA VACCINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N15/45</main-classification>
        <further-classification edition="200601120260202B">A61K39/155</further-classification>
        <further-classification edition="200601120260202B">C07K14/135</further-classification>
        <further-classification edition="200601120260202B">A61P31/14</further-classification>
        <further-classification edition="200601120260202B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＫＭ生物醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KM BIOLOGICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山上亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUE, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥飼正治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORIKAI, MASAHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明創造用以預防RSV感染症的新穎mRNA疫苗，其免疫原性及藥效超越基於日本專利第7253034號(專利文獻7)所製作的呼吸道融合細胞病毒(RSV)F蛋白與G蛋白組成之RSV FG嵌合體蛋白疫苗及mRNA疫苗。RSV FG嵌合體mRNA疫苗係藉由在RSV F蛋白胞外域中連結有跨膜域的基本骨架上，插入RSV G蛋白之高度保留結構域而製作。進行免疫原性及藥效評估之結果，已確認本發明之RSV FG嵌合體mRNA疫苗之免疫原性及藥效超越基於特許文獻7所製作的RSV FG嵌合體蛋白疫苗及mRNA疫苗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a novel mRNA vaccine for preventing RSV infection, which exhibits superior immunogenicity and efficacy compared to the RSV FG chimeric protein vaccine and mRNA vaccine based on Japanese Patent No. 7253034 (Patent Literature 7). The RSV FG chimeric mRNA vaccine is created by inserting the highly conserved domain of the RSV G protein into the basic backbone of the RSV F protein's ectodomain, to which the transmembrane region is linked. Based on the results of immunogenicity and efficacy evaluations, the RSV FG chimeric mRNA vaccine of the present invention has been confirmed to be superior in immunogenicity and efficacy to the RSV FG chimeric protein vaccine and mRNA vaccine based on Patent Literature 7.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1404" publication-number="202617722">
    <tif-files tif-type="multi-tif">
      <tif file="114123163.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含氮雜環類衍生物抑制劑、其製備方法和應用</chinese-title>
        <english-title>NITROGEN-CONTAINING HETEROCYCLIC DERIVATIVE INHIBITOR, PREPARATION METHOD THEREFOR AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D487/04</main-classification>
        <further-classification edition="200601120260202B">C07D519/00</further-classification>
        <further-classification edition="200601120260202B">C07D401/14</further-classification>
        <further-classification edition="200601120260202B">C07D471/04</further-classification>
        <further-classification edition="200601120260202B">C07D498/22</further-classification>
        <further-classification edition="200601120260202B">A61K31/538</further-classification>
        <further-classification edition="200601120260202B">A61K31/513</further-classification>
        <further-classification edition="200601120260202B">A61K31/496</further-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61K31/454</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61K31/506</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫廣俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, GUANGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及含氮雜環類衍生物抑制劑、其製備方法和應用。特別地，本發明涉及式(I)所示的化合物、其製備方法及含有該化合物的醫藥組成物，及其在治療癌症中的用途，其中式(I)中的各取代基與說明書中的定義相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a nitrogen-containing heterocyclic derivative inhibitor, preparation method therefor and use thereof. In particular, the invention relates to compounds of formula (I), methods for their preparation, pharmaceutical compositions containing said compounds, and the use thereof in treating cancer, wherein each substituent in formula (I) is as defined in the specification.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1405" publication-number="202617164">
    <tif-files tif-type="multi-tif">
      <tif file="114123170.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123170</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療HBV/HIV共同感染之方法</chinese-title>
        <english-title>METHOD OF TREATING HBV/HIV COINFECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/712</main-classification>
        <further-classification edition="201001120260202B">C12N15/113</further-classification>
        <further-classification edition="200601120260202B">A61P31/18</further-classification>
        <further-classification edition="200601120260202B">A61P31/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商葛蘭素史密斯克藍智慧財產發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLAXOSMITHKLINE INTELLECTUAL PROPERTY DEVELOPMENT LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕夫　梅蘭妮　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAFF, MELANIE T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西奧多　狄更斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEODORE, DICKENS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫札雷　馬詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEZAREH, MARJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波恩　艾瑞克　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOURNE, ERIC J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多曼　葛瑞絲　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLMAN, GRACE E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於治療患有HBV/HIV共同感染之人類的慢性B型肝炎感染之方法。該等方法包含向患有HBV/HIV共同感染之人類投與治療有效量之反義寡核苷酸(antisense oligonucleotide；ASO)，其中該個體具有不大於臨限值含量之HBsAg基線含量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to methods for treating chronic hepatitis B infection in a human having HBV/HIV coinfection. The methods comprise administering to a human having HBV/HIV coinfection a therapeutically effective amount of an antisense oligonucleotide (ASO), wherein the subject has a HBsAg baseline level of not greater than a threshold level.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1406" publication-number="202617978">
    <tif-files tif-type="multi-tif">
      <tif file="114123178.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123178</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多模態平台免疫療法及腫瘤專一性Ｔ細胞。</chinese-title>
        <english-title>MULTI-MODALITY PLATFORM IMMUNOTHERAPY AND TUMOR-SPECIFIC T CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N5/0783</main-classification>
        <further-classification edition="202501120260202B">A61K35/17</further-classification>
        <further-classification edition="202501120260202B">A61K40/11</further-classification>
        <further-classification edition="202501120260202B">A61K40/36</further-classification>
        <further-classification edition="200601120260202B">G01N33/574</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泰克利森有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECLISON, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　瑞民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, RUEY-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於治療癌症之自體細胞療法。經動脈替拉紮明栓塞(Transarterial tirapazamine embolization；TATE)療法誘導腫瘤壞死，該療法併與抗PD-1療法組合會透過TATE誘導之經該抗PD-1抗體活化之抗腫瘤T細胞的擴增來增強抗PD-1之功效。自經TATE及PD-1治療之患者收集PBMC以用於RNA及DNA提取以及對該等PBMC中T細胞群之TCR互補區3進行次代定序(next generation sequencing；NGS)分析，表明發生抗腫瘤專一性T細胞受體(TCR)之純系擴增。擴增用於投與癌症患者之PBMC群會優先擴增靶向腫瘤細胞之效應T細胞群，而無需進行基因操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an autologous cell therapy for treating a cancer. Transarterial tirapazamine embolization (TATE) therapy induces tumor necrosis, which, in combination with anti-PD-1 therapy, enhances the efficacy of anti-PD-1 through TATE-induced expansion of anti-tumor T cells activated by the anti-PD-1 antibody. PBMCs collected from TATE and PD-1-treated patients for RNA and DNA extraction and next generation sequencing (NGS) analysis of complementarity region-3 of the TCR from T cell populations in the PBMCs show that clonal expansion of anti-tumor specific T cell receptors (TCRs) occurs. Expansion of the PBMC population for administration to a cancer patient preferentially expands the population of effector T cells targeting the tumor cells without a need for genetic manipulation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1407" publication-number="202617399">
    <tif-files tif-type="multi-tif">
      <tif file="114123185.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂供給機構、樹脂成形裝置、及樹脂成形品的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250905B">B29C33/36</main-classification>
        <further-classification edition="200601120250905B">B29C43/18</further-classification>
        <further-classification edition="200601120250905B">B29C43/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤智行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須江絢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUE, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠抑制板的位置偏移的樹脂供給機構等。樹脂供給機構包括第一載台、第一板、分配器及計量器。在第一載台形成有第一開口。第一板在配置於第一載台上的狀態下覆蓋第一開口。計量器在第一載台向下方移動之後，通過第一開口自下方支撐第一板。在第一載台及第一板中的一者形成有第一定位銷及第二定位銷，在另一者形成有第一插入孔及第二插入孔。與第一載台向下方移動之前相比，在第一載台向下方移動之後，第一定位銷的外周面與第一插入孔的內周面之間的最短距離更長，且第二定位銷的外周面與第二插入孔的內周面之間的最短距離更長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樹脂成形裝置</p>
        <p type="p">10:第一模組</p>
        <p type="p">20:第二模組</p>
        <p type="p">30:第三模組</p>
        <p type="p">40:第四模組</p>
        <p type="p">50:第一搬送機構</p>
        <p type="p">60:第二搬送機構</p>
        <p type="p">70:控制部</p>
        <p type="p">100:脫模膜供給部</p>
        <p type="p">200:脫模膜配置部</p>
        <p type="p">250:分配器</p>
        <p type="p">300:樹脂成形部</p>
        <p type="p">410:基板供給部</p>
        <p type="p">420:基板收納部</p>
        <p type="p">430:基板載置部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1408" publication-number="202617653">
    <tif-files tif-type="multi-tif">
      <tif file="114123199.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>甲醇水溶液之製造方法及製造裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PRODUCING METHANOL AQUEOUS SOLUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C07C29/15</main-classification>
        <further-classification edition="200601120260129B">C07C29/76</further-classification>
        <further-classification edition="200601120260129B">C07C29/80</further-classification>
        <further-classification edition="200601120260129B">C07C31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田晃宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林田華緒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHIDA, HANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部貴典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>垣見篤志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKIMI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種甲醇水溶液之製造方法，係藉由按順序或按倒序含有下列步驟來獲得甲醇水溶液；  &lt;br/&gt;去離子步驟，係從粗甲醇去除離子性物質，以及  &lt;br/&gt;有機物去除步驟，係從粗甲醇去除水、及甲醇以外的有機物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing a methanol aqueous solution, comprising: &lt;br/&gt;a deionization step for removing ionic substances from crude methanol, and &lt;br/&gt;an organic substance removal step for removing water and organic substances other than methanol from the crude methanol, &lt;br/&gt;wherein the steps are carried out in this order or in the reverse order to obtain said methanol aqueous solution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1409" publication-number="202618001">
    <tif-files tif-type="multi-tif">
      <tif file="114123211.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>核酸序列</chinese-title>
        <english-title>NUCLEIC ACID SEQUENCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N15/86</main-classification>
        <further-classification edition="200601120260202B">C12N15/63</further-classification>
        <further-classification edition="200601120260202B">C12N15/34</further-classification>
        <further-classification edition="201501120260202B">A61K35/761</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商ＵＣＢ生物製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCB BIOPHARMA SRL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯　歐諾　優瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAS, ONUR YUSUF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩昌　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PECHAN, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含腺病毒基因組序列之重組多核苷酸領域。本發明亦關於包含此等核酸序列之方法及製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to the field of recombinant polynucleotides comprising adenoviral genome sequences. It also relates to methods and processes comprising such nucleic acid sequences.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1410" publication-number="202617084">
    <tif-files tif-type="multi-tif">
      <tif file="114123217.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運用康達效應的手持式尿流計</chinese-title>
        <english-title>HANDHELD COANDĂ EFFECT UROFLOWMETER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">A61B5/20</main-classification>
        <further-classification edition="200601120260122B">G01N33/493</further-classification>
        <further-classification edition="200601120260122B">A61B10/00</further-classification>
        <further-classification edition="200601120260122B">G01N1/20</further-classification>
        <further-classification edition="201801120260122B">G16H80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李蘭史丹佛學院理事會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雄醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳妤甄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JE-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉卡什　馬努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRAKASH, MANU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種運用康達效應的手持式尿流計，包含一漏斗；一圓筒，其附接至該漏斗之一底端；一螺旋葉片轉子，其中該螺旋葉片轉子係定位於該圓筒內且經調適來在該圓筒內沿著該圓筒之一縱向軸線自由地旋轉；多個固定至該螺旋葉片轉子之例如磁鐵的基準件；一感測器，其固定至該圓筒並適用於感測該等基準件隨著該螺旋葉片轉子轉動之移動；及微處理器，連接至該感測器。該微處理器自該螺旋形葉片轉子之一感測旋轉計算一狹窄流速。能為評估具有泌尿道症候群之患者提供即時、準確、小巧、使用者友好且非侵入性的尿流速測量方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:漏斗</p>
        <p type="p">102:上蓋</p>
        <p type="p">116:圓柱磁鐵</p>
        <p type="p">118:轉子</p>
        <p type="p">120:筒體</p>
        <p type="p">122:下蓋</p>
        <p type="p">124:排水口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1411" publication-number="202618866">
    <tif-files tif-type="multi-tif">
      <tif file="114123227.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多點雷射持續的電漿光源</chinese-title>
        <english-title>MULTI-SPOT LASER-SUSTAINED PLASMA LIGHT SOURCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01J65/04</main-classification>
        <further-classification edition="200601120260126B">H01S3/091</further-classification>
        <further-classification edition="200601120260126B">G02B27/10</further-classification>
        <further-classification edition="200601120260126B">G01N21/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布特納爾　亞歷山德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUETTNER, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾芳戴鮑爾　巴喜德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESFANDYARPOUR, VAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　托比亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, TOBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種雷射持續電漿(LSP)寬頻光源。該LSP寬頻光源可包含經組態以產生一泵浦光束之一泵浦源及經組態以將該泵浦光束準直為一準直泵浦光束之一或多個準直光學元件。該光源可包含一或多個聚焦光學元件及位於該一或多個準直光學元件與該一或多個聚焦光學元件之間的一共軛平面處之一分束器。該光源可包含一氣體容納結構。該分束器可經組態以將該準直泵浦光束分裂成一組泵浦細光束，其中該一或多個聚焦光學元件經組態以將該組泵浦細光束聚焦至氣體內之一組焦點位置以在不同焦點位置處產生多個電漿區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An LSP broadband light source is disclosed. The LSP broadband light source may include a pump source configured to generate a pump beam and one or more collimating optical elements configured to collimate the pump beam into a collimated pump beam. The light source may include one or more focusing optical elements and a beamsplitter located at a conjugate plane between the one or more collimating optical elements and the one or more focusing optical elements. The light source may include a gas containment structure. The beamsplitter may be configured to split the collimated pump beam into a set of pump beamlets, wherein the one or more focusing optical elements are configured to focus the set of pump beamlets to a set of focus positions within the gas to generate multiple plasma regions at the different focus positions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雷射持續電漿(LSP)寬頻光源</p>
        <p type="p">102:泵浦源</p>
        <p type="p">104:泵浦光束</p>
        <p type="p">106:準直光學元件</p>
        <p type="p">108:準直泵浦光束</p>
        <p type="p">110:聚焦光學元件</p>
        <p type="p">112:分束器</p>
        <p type="p">114:共軛平面</p>
        <p type="p">116:氣體容納結構</p>
        <p type="p">117:氣體</p>
        <p type="p">118:電漿區域</p>
        <p type="p">118a至118c:電漿區域</p>
        <p type="p">120:泵浦細光束</p>
        <p type="p">120a至120c:泵浦細光束</p>
        <p type="p">122:焦點位置</p>
        <p type="p">122a至122c:焦點位置</p>
        <p type="p">124:寬頻光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1412" publication-number="202617913">
    <tif-files tif-type="multi-tif">
      <tif file="114123248.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617913</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附分隔件之雙面黏著帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C09J133/08</main-classification>
        <further-classification edition="201501120260126B">G02B1/111</further-classification>
        <further-classification edition="201801120260126B">C09J7/22</further-classification>
        <further-classification edition="201901120260126B">B32B7/035</further-classification>
        <further-classification edition="200601120260126B">B32B27/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川本友也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本瞭太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, RYOUTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤史哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATOU, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緒方雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, YUDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧尻絢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIJIRI, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種附分隔件之雙面黏著帶，其於貼合於曲面時，能夠抑制分隔件自黏著帶隆起。  &lt;br/&gt;本發明係一種附分隔件之雙面黏著帶，其具有：具有黏著劑層之雙面黏著帶、及位於上述雙面黏著帶之至少一面之分隔件，於以拉伸速度100 mm/min對在上述雙面黏著帶之一面具有分隔件之積層體進行啞鈴拉伸試驗時，上述積層體之長度伸長2.0%時不會斷裂，且上述積層體之長度伸長2.0%時之拉伸強度為17 N以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1413" publication-number="202618875">
    <tif-files tif-type="multi-tif">
      <tif file="114123249.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由紫外線處理之低Ｋ膜熱膨脹係數調節</chinese-title>
        <english-title>LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎　紀一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, CHI-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, LI-QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡卡塔拉曼　尚卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATARAMAN, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種用於在基板上調節介電膜的熱膨脹係數(CTE)的方法。在一些實施例中，該方法包括將基板定位於處理腔室內，在基板上形成介電膜堆疊，以及使用紫外線源固化介電膜以修改該介電膜的CTE。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for modulating the coefficient of thermal expansion (CTE) of dielectric films on a substrate is provided. In some embodiments, the method includes positioning a substrate within a processing chamber, forming a dielectric film stack on the substrate, and curing the dielectric film with a UV source to modify a CTE of the dielectric film</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210:操作</p>
        <p type="p">220:操作</p>
        <p type="p">230:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1414" publication-number="202618067">
    <tif-files tif-type="multi-tif">
      <tif file="114123255.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除垢用清洗液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23G1/06</main-classification>
        <further-classification edition="202301120260202B">C02F5/00</further-classification>
        <further-classification edition="202301120260202B">C02F5/08</further-classification>
        <further-classification edition="202301120260202B">C02F5/10</further-classification>
        <further-classification edition="200601120260202B">C11D1/62</further-classification>
        <further-classification edition="200601120260202B">C11D3/04</further-classification>
        <further-classification edition="200601120260202B">C11D3/20</further-classification>
        <further-classification edition="200601120260202B">C11D3/28</further-classification>
        <further-classification edition="200601120260202B">C23G1/10</further-classification>
        <further-classification edition="200601120260202B">C23G1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商長瀨化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASE CHEMTEX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野光三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, KOZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種垢之清洗性優異並且防蝕性優異之除垢用清洗液。本發明係關於一種除垢用清洗液，其包含水、氟化合物、無機酸、界面活性劑、及多元羧酸，且pH未達6。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1415" publication-number="202617855">
    <tif-files tif-type="multi-tif">
      <tif file="114123260.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物、組合物之製造方法、非線形光學膜、非線形光學膜之形成方法及光調變器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260202B">C08K3/10</main-classification>
        <further-classification edition="200601120260202B">C08L101/06</further-classification>
        <further-classification edition="200601120260202B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島奏也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, SOUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂東祥匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDO, YOSHIMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朝戸良輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASATO, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松元香樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五郎丸英貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOROHMARU, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種組合物及上述組合物之製造方法、以及非線形光學膜，上述組合物能夠於不改變電光特性之情況下提高所形成之膜之熱耐久性及耐溶解性。本發明係關於一種組合物，其包含非線形光學活性高分子化合物、含金屬元素之化合物、及溶劑，且上述金屬元素係選自由錫、鈦、鉍、鋅、鋯、鐵、錳、銅、鉛、鎳、鈷、銻、鉿及鋁所組成之群中之至少一種，相對於上述組合物之全部固形物成分，選自上述群中之金屬元素之含有率之合計為10～200質量ppm，上述非線形光學活性高分子化合物具有側鏈，上述側鏈包含胺基甲酸酯鍵或脲鍵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1416" publication-number="202617703">
    <tif-files tif-type="multi-tif">
      <tif file="114123265.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物或其鹽、動物寄生蟲防治劑、寄生的防治方法、疾病的預防及治療方法、以及化合物的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D401/14</main-classification>
        <further-classification edition="200601120260202B">A61K31/4439</further-classification>
        <further-classification edition="200601120260202B">A61P33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本曹達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SODA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崎山訓史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKIYAMA, NORIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清野宏行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEINO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井麻記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, MAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤徹朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, TETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小辰将之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTATSU, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池山聖一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEYAMA, SEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村優香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口昌宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種化合物或其鹽，所述化合物由式（I）表示。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="274px" width="310px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;〔式（I）中，R&lt;sup&gt;1&lt;/sup&gt;為經取代或未經取代的C1～6烷基，X為硫原子、亞磺醯基、磺醯基等，R&lt;sup&gt;2&lt;/sup&gt;分別獨立地為經取代或未經取代的C1～6烷基、鹵基等，n表示R&lt;sup&gt;2&lt;/sup&gt;的數量，且為0、1或2，R&lt;sup&gt;3&lt;/sup&gt;為經取代或未經取代的C2～6烯基，R&lt;sup&gt;4&lt;/sup&gt;為經取代或未經取代的C1～6烷基〕</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1417" publication-number="202618926">
    <tif-files tif-type="multi-tif">
      <tif file="114123266.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於蝕刻製程之後使用含硼蝕刻劑之殘餘物移除</chinese-title>
        <english-title>RESIDUE REMOVAL AFTER ETCH PROCESSES USING A BORON-CONTAINING ETCHANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/311</main-classification>
        <further-classification edition="200601120260123B">C09K13/00</further-classification>
        <further-classification edition="200601120260123B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BAIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　小林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOLIN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐萬興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WANXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　振江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, ZHENJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　安川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性半導體處理方法可以包含將含硼的蝕刻劑前驅物提供至半導體處理腔室的處理區域。基板可以被裝設在該處理區域內。這些方法可以包含將含氫前驅物、氦，或兩者與含硼的蝕刻劑前驅物一起提供至處理區域。這些方法可以包含使基板與含硼的蝕刻劑前驅物和含氫前驅物接觸。這些方法可以包含相對於基板上的第二材料，選擇性地移除第一材料的至少一部分，同時從處理區域的一或多個表面移除蝕刻副產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include providing a boron-containing etchant precursor to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. The methods may include providing a hydrogen-containing precursor, helium, or both to the processing region with the boron-containing etchant precursor. The methods may include contacting the substrate with the boron-containing etchant precursor and the hydrogen-containing precursor. The methods may include selectively removing at least a portion of a first material on the substrate relative to a second material second material on the substrate while removing an etch byproduct from one or more surfaces of the processing region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:操作</p>
        <p type="p">410:操作</p>
        <p type="p">415:操作</p>
        <p type="p">420:操作</p>
        <p type="p">425:操作</p>
        <p type="p">430:操作</p>
        <p type="p">435:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1418" publication-number="202617728">
    <tif-files tif-type="multi-tif">
      <tif file="114123267.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體藥物偶聯物及其應用</chinese-title>
        <english-title>ANTIBODY-DRUG CONJUGATES AND APPLICATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D491/22</main-classification>
        <further-classification edition="200601120260202B">C07K16/32</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商普米斯生物技術（珠海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOTHEUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃威峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅羿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖華媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUAYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳連娣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭紹崗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHAOGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及抗體藥物偶聯物及其應用，具體提供了所示的化合物、其藥學上可接受的鹽、其立體異構體、其前藥或其溶劑合物。以式I所示的化合物、其藥學上可接受的鹽、其立體異構體、其前藥或其溶劑合物製備的ADC分子，體內穩定性高，藥效優異，具有廣闊的應用前景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to antibody-drug conjugates and applications thereof. Specifically, it provides the disclosed compounds, their pharmaceutically acceptable salts, stereoisomers, prodrugs, or solvates. ADC molecules prepared using compounds represented by formula I or their pharmaceutically acceptable salts, stereoisomers, prodrugs, or solvates, exhibit high in vivo stability, excellent efficacy, and hold broad application prospects.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1419" publication-number="202618953">
    <tif-files tif-type="multi-tif">
      <tif file="114123279.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構之異質整合</chinese-title>
        <english-title>HETEROGENOUS INTEGRATION OF SEMICONDUCTOR STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/66</main-classification>
        <further-classification edition="200601120260123B">H01L21/768</further-classification>
        <further-classification edition="200601120260123B">H01L23/00</further-classification>
        <further-classification edition="200601120260123B">H01L23/522</further-classification>
        <further-classification edition="200601120260123B">H01L23/532</further-classification>
        <further-classification edition="200601120260123B">H01L25/00</further-classification>
        <further-classification edition="202301120260123B">H01L25/065</further-classification>
        <further-classification edition="202301120260123B">H01L25/18</further-classification>
        <further-classification edition="202301120260123B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布珊　巴拉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUSHAN, BHARAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥丹尼　特蘭斯　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCDANIEL, TERRENCE B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克比　凱爾　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRBY, KYLE K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　阿克斯海　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, AKSHAY N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞克　庫諾　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAREKH, KUNAL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於製造半導體裝置總成，且更特定言之用於半導體結構之異質整合之系統、裝置及方法。一半導體裝置總成可包含接合至一第二半導體裝置之一第一半導體裝置。該第一半導體裝置可包含具有第一氣隙之一第一介電材料，及安置在該第一介電材料上方且具有第二氣隙之一第二介電材料。該第一半導體裝置亦可包含嵌入於該第一介電材料中之一第一金屬化層、安置在該第一介電材料與該第二介電材料之間之一第二金屬化層、至少部分嵌入於該第二介電材料中之一第三金屬化層，及穿過該第一介電材料延伸於該第一金屬化層與該第二金屬化層之間之一或多個第一導通體。該一或多個第一導通體之各者可具有至少10之一縱橫比。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, devices, and methods for making semiconductor device assemblies, and more particularly for the heterogenous integration of semiconductor structures, are provided herein. A semiconductor device assembly can include a first semiconductor device bonded to a second semiconductor device. The first semiconductor device can include a first dielectric material having first airgaps and a second dielectric material disposed above the first dielectric material and having second airgaps. The first semiconductor device can also include a first metallization layer embedded in the first dielectric material, a second metallization layer disposed between the first dielectric material and the second dielectric material, a third metallization layer at least partially embedded in the second dielectric material, and one or more first vias extending through the first dielectric material between the first metallization layer and the second metallization layer. Each of the one or more first vias can have an aspect ratio of at least 10.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體裝置總成</p>
        <p type="p">210:第一半導體裝置</p>
        <p type="p">212:第一接合墊</p>
        <p type="p">214:基板</p>
        <p type="p">220:第二半導體裝置</p>
        <p type="p">222:第二介電材料</p>
        <p type="p">224:第二金屬化層</p>
        <p type="p">226:氣隙</p>
        <p type="p">228:第二導通體</p>
        <p type="p">230:第三金屬化層</p>
        <p type="p">232:第三導通體</p>
        <p type="p">234:第四金屬化層</p>
        <p type="p">236:第三介電材料</p>
        <p type="p">238:氣隙</p>
        <p type="p">240:第二接合墊</p>
        <p type="p">242:導通體</p>
        <p type="p">244:蝕刻圖徵</p>
        <p type="p">250:記憶體結構</p>
        <p type="p">251:第一介電材料</p>
        <p type="p">252:基板</p>
        <p type="p">254:字線</p>
        <p type="p">256:位元線</p>
        <p type="p">258:第一金屬化層</p>
        <p type="p">259:第一導通體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1420" publication-number="202617970">
    <tif-files tif-type="multi-tif">
      <tif file="114123280.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123280</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鞘氨醇單胞菌屬在促進毛髮生長的用途</chinese-title>
        <english-title>USE OF SPHINGOMONAS SP. FOR PROMOTING HAIR GROWTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N1/20</main-classification>
        <further-classification edition="201501120260202B">A61K35/74</further-classification>
        <further-classification edition="200601120260202B">A61P17/14</further-classification>
        <further-classification edition="201701120260202B">A61K8/99</further-classification>
        <further-classification edition="200601120260202B">A61Q7/00</further-classification>
        <further-classification edition="201601120260202B">A23L33/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商科優迪絲生物技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUTISBIO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔源祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, WON WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐銀英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, EUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴敏知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, MIN JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種鞘氨醇單胞菌屬微生物，尤其是油鞘氨醇單胞菌在促進毛髮生長或預防脫髮方面之用途。包含鞘氨醇單胞菌屬微生物（尤其是油鞘氨醇單胞菌），或其溶解物、培養液或萃取物之組合物，能提高毛髮長度之生長速度，並增加毛囊細胞中與生長促進相關因子之表達，從而有助於促進毛髮生長或預防脫髮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of microorganisms of the genus &lt;i&gt;Sphingomonas&lt;/i&gt;, particularly &lt;i&gt;Sphingomonas olei&lt;/i&gt;, for promoting hair growth or preventing hair loss. A composition comprising a microorganism of the genus &lt;i&gt;Sphingomonas&lt;/i&gt;, (particularly &lt;i&gt;Sphingomonas olei&lt;/i&gt;), or a lysate, culture medium, or extract thereof, enhances the growth rate of hair length and increases the expression of growth-promoting factors in hair follicle cells, and is therefore useful for promoting hair growth or preventing hair loss.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1421" publication-number="202619390">
    <tif-files tif-type="multi-tif">
      <tif file="114123282.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啟用超寬頻（ＵＷＢ）之連接裝置中的功率節省</chinese-title>
        <english-title>POWER SAVING IN ULTRA-WIDE BAND (UWB) ENABLED CONNECTED DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260116B">H04W52/54</main-classification>
        <further-classification edition="200901120260116B">H04W52/04</further-classification>
        <further-classification edition="201801120260116B">H04W76/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤尼亞爾　阿曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIYAL, AMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔努庫　菲斯威斯瓦拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANUKU, VISWESWARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杰米尼　蘇密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEMINI, SUMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於啟用超寬頻(ultra-wide band, UWB)之連接裝置中的功率節省的方法、組件、裝置、及系統。一些態樣更具體地係關於在共置裝置處的一認證程序。在一些實例中，一種第一無線裝置可經由一第一無線電存取技術(radio access technology, RAT)與一第二裝置通訊，該第二裝置與該第一無線裝置共置。該第一無線裝置可係能夠經由一第二RAT與一第三無線裝置通訊。該第一無線裝置可經由該第一RAT將指示經由該第二RAT在該第一無線裝置與該第三無線裝置之間的一第一通訊狀態的一訊息傳輸向該第二裝置。在一些實例中，該第二無線裝置可基於接收該訊息，而改變該第二無線裝置與該第三無線裝置之間的一第二通訊狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides methods, components, devices and systems for power saving in ultra-wide band (UWB) enabled connected devices. Some aspects more specifically relate to an authentication procedure at collocated devices. In some examples, a first wireless device may communicate via a first radio access technology (RAT) with a second device that is collocated with the first wireless device. The first wireless device may be capable of communicating with a third wireless device via a second RAT. The first wireless device may transmit, via the first RAT, a message to the second device that is indicative of a first status of communications between the first wireless device and the third wireless device via the second RAT. In some examples, the second wireless device may change a second status of communications between the second wireless device and the third wireless device based on reception of the message.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:傳訊圖</p>
        <p type="p">405-a:第一無線裝置</p>
        <p type="p">405-b:第二無線裝置</p>
        <p type="p">405-c:第三無線裝置</p>
        <p type="p">410-a:無線連接</p>
        <p type="p">410-b:BLE連接</p>
        <p type="p">410-c:UWB連接</p>
        <p type="p">410-d:藍牙連接</p>
        <p type="p">415:雲端伺服器</p>
        <p type="p">420:保留</p>
        <p type="p">425:金鑰</p>
        <p type="p">430:控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1422" publication-number="202617161">
    <tif-files tif-type="multi-tif">
      <tif file="114123297.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於核酸遞送之脂質組合物</chinese-title>
        <english-title>LIPID COMPOSITIONS FOR NUCLEIC ACID DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/7088</main-classification>
        <further-classification edition="202501120260202B">A61K9/127</further-classification>
        <further-classification edition="200601120260202B">A61K47/18</further-classification>
        <further-classification edition="200601120260202B">A61K47/24</further-classification>
        <further-classification edition="200601120260202B">A61K47/14</further-classification>
        <further-classification edition="200601120260202B">A61K9/10</further-classification>
        <further-classification edition="200601120260202B">A61P31/00</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
        <further-classification edition="200601120260202B">C07C279/12</further-classification>
        <further-classification edition="200601120260202B">C07C237/22</further-classification>
        <further-classification edition="200601120260202B">C07C233/36</further-classification>
        <further-classification edition="200601120260202B">C07C335/08</further-classification>
        <further-classification edition="200601120260202B">C07C69/34</further-classification>
        <further-classification edition="200601120260202B">C07C233/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜恩技術股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONTECH SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜恩技術運輸科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONTECH DELIVERY TECHNOLOGIES GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘茲奈　史提芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANZNER, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩烏塞多　埃斯皮諾薩　馬力歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAUCEDO-ESPINOSA, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法斯　薩拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAHS, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案尤其提供包含陽離子脂質、陰離子可電離脂質及核酸之組合物及該等組合物之用途，其中：該陽離子脂質包含陽離子頭基、第一橋基及第一脂質尾基；該陰離子可電離脂質包含陰離子可電離頭基、第二橋基及第二脂質尾基；該陽離子脂質具有約700 Å&lt;sup&gt;3&lt;/sup&gt;至約1500 Å&lt;sup&gt;3&lt;/sup&gt;之脂質體積，及/或該陰離子可電離脂質具有約700 Å&lt;sup&gt;3&lt;/sup&gt;至約1500 Å&lt;sup&gt;3&lt;/sup&gt;之脂質體積；或該陽離子脂質及該陰離子可電離脂質具有大於1400 Å&lt;sup&gt;3&lt;/sup&gt;之組合脂質體積。在一些實施例中，本揭示案提供新陽離子脂質及新陰離子可電離脂質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides, among other things, composition and uses of said compositions comprising a cationic lipid, an anionically ionizable lipid, and a nucleic acid, wherein: the cationic lipid comprises a cationic head group, a first bridge group, and a first lipid tail group; the anionically ionizable lipid comprises an anionically ionizable head group, a second bridge group, and a second lipid tail group; the cationic lipid has a lipidic volume from about 700 Å&lt;sup&gt;3&lt;/sup&gt; to about 1500 Å&lt;sup&gt;3&lt;/sup&gt;, and/or the anionically ionizable lipid has a lipidic volume from about 700 Å&lt;sup&gt;3&lt;/sup&gt; to about 1500 Å&lt;sup&gt;3&lt;/sup&gt;; or the cationic lipid and the anionically ionizable lipid have a combined lipidic volume greater than 1400 Å&lt;sup&gt;3&lt;/sup&gt;. In some embodiments, the present disclosure provides new cationic lipids and new anionically ionizable lipids.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1423" publication-number="202617790">
    <tif-files tif-type="multi-tif">
      <tif file="114123298.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光可固化組合物</chinese-title>
        <english-title>PHOTOCURABLE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F2/50</main-classification>
        <further-classification edition="200601120260202B">C08F22/32</further-classification>
        <further-classification edition="200601120260202B">C09J4/00</further-classification>
        <further-classification edition="200601120260202B">C09J4/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商波士提克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSTIK SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋拉　帕西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRA, PATXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法吉　安里可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAGGI, ENRICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮雷茲　多拉多　艾娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEREZ DORADO, EVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於光可固化組合物，其包括  &lt;br/&gt;-  具有高於或等於500 g/mol之分子量之基於氧化膦之光起始劑P；  &lt;br/&gt;-  氰基丙烯酸酯；及  &lt;br/&gt;-  茂金屬化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a photocurable composition comprising: &lt;br/&gt;- a phosphine oxide-based photoinitiator P having a molecular weight higher than or equal to 500 g/mol; &lt;br/&gt;- a cyanoacrylate; and &lt;br/&gt;- a metallocene compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1424" publication-number="202617992">
    <tif-files tif-type="multi-tif">
      <tif file="114123301.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>INHBE　RNA干擾劑</chinese-title>
        <english-title>INHBE RNA INTERFERENCE AGENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N15/113</main-classification>
        <further-classification edition="200601120260202B">A61K31/713</further-classification>
        <further-classification edition="200601120260202B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴納比　韋恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARNABY, WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴韋爾　賽斯　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAWEL, SETH ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎格　凱文　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAIG, KEVIN PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　志濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHRISTINE CHIH-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊根　瑪麗珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGGEN, MARIJEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗林蓬　卡瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRIMPONG, KWAME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榮格　邁爾　費歐娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, MAIRE FIONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁爾斯　瑞貝卡　陸斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILES, REBECCA RUTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫亞瑞迷　麥可　帕揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOAZAMI, MICHAEL PAYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾　寇瑞　塞諾伊　羅伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL KHOURY SEJNAUI,ROBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特雷瓦斯基斯　詹姆斯　雷納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREVASKIS, JAMES LEONARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　冀波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於新穎的治療化合物，稱為RNAi劑，其降低INHBE之表現(由INHBE基因表現)，從而降低mRNA表現及蛋白質表現。此等RNAi劑可用於治療涉及調節INHBE表現及功能之疾病，諸如肥胖症或心血管代謝病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel therapeutic compounds, known as RNAi agents, that decrease expression of INHBE (expressed by the INHBE gene), thereby decreasing expression of mRNA and protein expression. Such RNAi agents are useful in the treatment of diseases involving the regulation of INHBE expression and function, such as obesity or cardiometabolic disorders.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1425" publication-number="202618902">
    <tif-files tif-type="multi-tif">
      <tif file="114123320.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乾式蝕刻方法、半導體裝置之製造方法及蝕刻裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/302</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山內邦裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, KUNIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池亜紀応</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, AKIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種能夠減少蝕刻殘渣之沉積之乾式蝕刻方法、半導體裝置之製造方法及蝕刻裝置。  &lt;br/&gt;本發明係關於一種乾式蝕刻方法，其藉由如下氣體蝕刻含有鍺之被蝕刻膜，該氣體即：  &lt;br/&gt;選自由IF&lt;sub&gt;7&lt;/sub&gt;、IF&lt;sub&gt;5&lt;/sub&gt;、BrF&lt;sub&gt;5&lt;/sub&gt;、BrF&lt;sub&gt;3&lt;/sub&gt;、MoF&lt;sub&gt;6&lt;/sub&gt;、GeF&lt;sub&gt;4&lt;/sub&gt;及ClF所組成之群中之至少一種氣體(第1氣體)；以及  &lt;br/&gt;選自由F&lt;sub&gt;2&lt;/sub&gt;、ClF&lt;sub&gt;3&lt;/sub&gt;及BrF&lt;sub&gt;5&lt;/sub&gt;所組成之群中之至少一種氣體且與上述第1氣體不同之氣體(第2氣體)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1426" publication-number="202617428">
    <tif-files tif-type="multi-tif">
      <tif file="114123328.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>皮膚設計薄片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B32B27/00</main-classification>
        <further-classification edition="200601120260127B">B32B27/30</further-classification>
        <further-classification edition="201901120260127B">B32B7/022</further-classification>
        <further-classification edition="201901120260127B">B32B7/023</further-classification>
        <further-classification edition="200601120260127B">B32B27/40</further-classification>
        <further-classification edition="201901120260127B">B32B7/06</further-classification>
        <further-classification edition="200601120260127B">A61K8/02</further-classification>
        <further-classification edition="200601120260127B">A61K8/81</further-classification>
        <further-classification edition="200601120260127B">A61K8/87</further-classification>
        <further-classification edition="200601120260127B">A61Q1/00</further-classification>
        <further-classification edition="200601120260127B">B41M5/50</further-classification>
        <further-classification edition="200601120260127B">B44C1/165</further-classification>
        <further-classification edition="200601120260127B">B44C1/17</further-classification>
        <further-classification edition="200601120260127B">C08J5/18</further-classification>
        <further-classification edition="202001120260127B">C08J7/04</further-classification>
        <further-classification edition="201801120260127B">C09J7/22</further-classification>
        <further-classification edition="201801120260127B">C09J7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今倉柚子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAKURA, YUZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAI, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種皮膚設計薄片，其能抑制在印表機進行皮膚設計圖像印刷時之貼紙部之剝離，同時在自皮膚剝離貼紙部時疼痛感較小。皮膚設計薄片(S)具有脫模薄片(10)與貼紙部(20)，脫模薄片(10)具有依序積層之第1基材(11)及脫模層(12)，貼紙部(20)以可自脫模薄片(10)剝離的方式設置於脫模層(12)上，貼紙部(20)具有自脫模薄片(10)側起，依序積層黏著層(21)及第2基材(22)之積層構成。貼紙部(20)自脫模薄片(10)之剝離力為0.07N/20mm以上、5.0N/20mm以下。自脫模薄片(10)剝離貼紙部(20)後露出之脫模層(12)表面之水接觸角為80˚以上、109˚以下。貼紙部(20)之黏著層(21)對SUS板之黏著力為1.0N/20mm以上、10.0N/20mm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:脫模薄片</p>
        <p type="p">11:第1基材(脫模薄片基材)</p>
        <p type="p">12:脫模層</p>
        <p type="p">20:貼紙部</p>
        <p type="p">21:黏著層</p>
        <p type="p">22:第2基材(貼紙基材)</p>
        <p type="p">25:表面部</p>
        <p type="p">S:皮膚設計薄片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1427" publication-number="202618499">
    <tif-files tif-type="multi-tif">
      <tif file="114123335.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用MOS裝置的低電壓參考產生器</chinese-title>
        <english-title>LOW VOLTAGE REFERENCE GENERATOR USING MOS DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G05F1/46</main-classification>
        <further-classification edition="200601120260123B">G05F1/567</further-classification>
        <further-classification edition="200601120260123B">G05F1/575</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張韋標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEIBIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁　科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加勒普　布魯諾　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARLEPP, BRUNO W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於從供應電壓產生參考電壓及參考電流的技術。所揭示的參考電壓與參考電流產生器電路包括電晶體（例如，MOS）裝置與互連電阻器的組合。由於電晶體裝置中之電子遷移率的溫度行為，互連電阻器具有經選擇以抵消電晶體裝置中之熱敏效應的溫度係數。互連電阻器可實施為電阻器堆疊，該等電阻器堆疊包括由電絕緣層分隔的經互連金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques for generating reference voltages and reference currents from a supply voltage are disclosed. A disclosed reference voltage and reference current generator circuit includes a combination of transistor (e.g., MOS) devices and interconnect resistors. The interconnect resistors have temperature coefficients that are selected to negate temperature sensitive effects in the transistor devices due to electron mobility temperature behavior in the transistor devices. The interconnect resistors may be implemented as resistor stacks that include interconnected metal layers separated by electrically insulating layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:產生器電路</p>
        <p type="p">902:電流產生器電路</p>
        <p type="p">904:輸出產生器電路；產生器電路</p>
        <p type="p">906A~906H:MOS裝置</p>
        <p type="p">908:放大器</p>
        <p type="p">910:電阻器</p>
        <p type="p">912:節點</p>
        <p type="p">914,916,918,920:電阻器</p>
        <p type="p">922:放大器</p>
        <p type="p">930:輸出參考電壓信號；輸出電壓信號</p>
        <p type="p">940:輸出參考電流信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1428" publication-number="202618160">
    <tif-files tif-type="multi-tif">
      <tif file="114123353.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有安裝指示器的管接頭</chinese-title>
        <english-title>PIPE COUPLINGS HAVING INSTALLATION INDICATORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">F16L19/025</main-classification>
        <further-classification edition="200601120260122B">F16L19/02</further-classification>
        <further-classification edition="200601120260122B">F16L17/04</further-classification>
        <further-classification edition="200601120260122B">F16L21/06</further-classification>
        <further-classification edition="200601120260122B">F16L23/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＡＳＣ工程解決方案有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASC ENGINEERED SOLUTIONS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CROSS, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示的管接頭實例包括：接頭主體，接頭主體具有第一接頭段和第二接頭段，第一接頭段在第一端具有第一凸耳，第二接頭段具有與第一凸耳相對的第二凸耳；第一緊固件，第一緊固件透過第一凸耳和第二凸耳安裝到接頭主體上，並配置為擰緊管接頭；以及第一安裝指示器，指示器位於第一凸耳上，並在管接頭被擰緊時與第二凸耳的第一指示器面重疊，其中，當管接頭被正確擰緊時，第一安裝指示器與第二凸耳上的第一反向指示器處於預定的對齊位置，而當管接頭未被擰緊時，第一安裝指示器與第一反向指示器未處於預定的對齊位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed example pipe couplings include: a coupling body having a first coupling segment and a second coupling segment, the first coupling segment having a first lug on a first end and the second coupling segment having a second lug opposite the first lug; a first fastener mounted to the coupling body via the first and second lugs and configured to tighten the pipe coupling; and a first installation indicator on the first lug and arranged to overlap a first indicator face of the second lug as the pipe coupling is tightened, wherein the first installation indicator is in a predetermined alignment with a first counter indicator on the second lug when the pipe coupling is correctly-tightened and is not in the predetermined alignment with the first counter indicator when the pipe coupling is under tightened.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:管接頭</p>
        <p type="p">104a:管段</p>
        <p type="p">104b:管段</p>
        <p type="p">110:接頭段</p>
        <p type="p">112:接頭段</p>
        <p type="p">118:中央部分</p>
        <p type="p">122:接頭軸</p>
        <p type="p">124:軸向前端</p>
        <p type="p">130:弧形鍵</p>
        <p type="p">132:第一凸耳</p>
        <p type="p">134:第二凸耳</p>
        <p type="p">150:緊固件</p>
        <p type="p">150b:第二緊固件</p>
        <p type="p">152:螺紋螺釘</p>
        <p type="p">154:螺釘頭</p>
        <p type="p">156:螺釘軸</p>
        <p type="p">157:軸螺紋</p>
        <p type="p">158:螺紋螺母</p>
        <p type="p">170b:第二指示器</p>
        <p type="p">172b:指示器面</p>
        <p type="p">224:軸向後端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1429" publication-number="202617172">
    <tif-files tif-type="multi-tif">
      <tif file="114123358.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>方法</chinese-title>
        <english-title>METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K38/22</main-classification>
        <further-classification edition="200601120260202B">A61P3/04</further-classification>
        <further-classification edition="200601120260202B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商西蘭製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEALAND PHARMA A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里芬　強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFFIN, JON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫塞　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HESSE, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種藉由投與高劑量之派曲林肽(petrelintide)以治療超重、肥胖、糖尿病及/或相關病症及/或減輕體重之方法。本發明亦關於一種藉由投與人類女性個體非腸促胰島素肽激素(non-incretin peptide hormone)以治療超重、肥胖、糖尿病及/或相關病症及/或以減輕體重之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for treating overweight, obesity, diabetes and/or related disorders, and/or for reducing body weight, by administering petrelintide at a high dose. The invention also relates to a method for treating overweight, obesity, diabetes and/or related disorders, and/or for reducing body weight, in a human female subject, by administering a non-incretin peptide hormone.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1430" publication-number="202617753">
    <tif-files tif-type="multi-tif">
      <tif file="114123366.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工程化基因轉錄阻抑工具及其用途</chinese-title>
        <english-title>ENGINEERED GENE TRANSCRIPTIONAL REPRESSOR TOOLS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/47</main-classification>
        <further-classification edition="200601120260202B">C12N15/62</further-classification>
        <further-classification edition="200601120260202B">C12N9/10</further-classification>
        <further-classification edition="201001120260202B">C12N15/113</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商益杰立科新加坡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPIGENIC THERAPEUTICS PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛少帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, SHAOSHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭文博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, WENBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮爭艶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, ZHENGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鵬程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PENGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臧贏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANG, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及工程化基因轉錄阻抑工具及其用途，具體涉及一種表觀遺傳編輯劑，其包含轉錄激活物樣效應器(TALE)域、至少一種表觀遺傳修飾結構域、和至少一種轉錄調節結構域，其中各結構域可直接或間接地連接；或者各結構域形成不同的融合物並以招募方式相互作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to engineered gene transcriptional repressor tools and uses thereof, specifically involving an epigenetic editor comprising a Transcription Activator-Like Effector (TALE) domain, at least one epigenetic modification domain, and at least one transcriptional regulation domain, wherein the domains may be directly or indirectly connected; or the domains form different fusion proteins that interact with each other through recruitment.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1431" publication-number="202617754">
    <tif-files tif-type="multi-tif">
      <tif file="114123367.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向Ｂ型肝炎病毒基因的工程化基因轉錄阻抑工具及其用途</chinese-title>
        <english-title>ENGINEERED GENE TRANSCRIPTIONAL REPRESSOR TOOLS TARGETING HEPATITIS B VIRUS GENE AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/47</main-classification>
        <further-classification edition="200601120260202B">C12N9/10</further-classification>
        <further-classification edition="201001120260202B">C12N15/113</further-classification>
        <further-classification edition="200601120260202B">C12N15/85</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
        <further-classification edition="200601120260202B">A61P31/20</further-classification>
        <further-classification edition="200601120260202B">A61P1/16</further-classification>
        <further-classification edition="200601120260202B">G01N33/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商益杰立科（上海）生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPIGENIC THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭文博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, WENBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛少帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, SHAOSHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮爭艶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, ZHENGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙軍政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JUNZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳壘磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LEILEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種表觀遺傳編輯劑，其包含轉錄激活物樣效應器(TALE)域、至少一種表觀遺傳修飾結構域、和至少一種轉錄調節結構域；其中，該TALE域能夠特異性結合HBV基因和/或HBV基因的調控元件上的靶核苷酸序列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to an epigenetic editor comprising a transcription activator-like effector (TALE) domain, at least one epigenetic-modifying domain, and at least one transcription-regulatory domain, wherein the TALE domain specifically binds to a target nucleotide sequence located within the HBV gene and/or a regulatory element thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1432" publication-number="202617755">
    <tif-files tif-type="multi-tif">
      <tif file="114123368.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向ＰＣＳＫ９的工程化基因轉錄阻抑工具及其用途</chinese-title>
        <english-title>ENGINEERED GENE TRANSCRIPTIONAL REPRESSOR TOOLS TARGETING PCSK9 AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/47</main-classification>
        <further-classification edition="200601120260202B">C12N9/10</further-classification>
        <further-classification edition="200601120260202B">C12N15/62</further-classification>
        <further-classification edition="201001120260202B">C12N15/113</further-classification>
        <further-classification edition="200601120260202B">C12N15/85</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
        <further-classification edition="200601120260202B">A61P3/06</further-classification>
        <further-classification edition="200601120260202B">G01N33/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商益杰立科（上海）生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPIGENIC THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛少帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, SHAOSHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭文博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, WENBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮爭艶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, ZHENGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鵬程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PENGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳壘磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LEILEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種表觀遺傳編輯劑，其包含轉錄激活物樣效應器(TALE)域、至少一種表觀遺傳修飾結構域、和至少一種轉錄調節結構域；其中，該TALE域能夠特異性結合PCSK9基因和/或PCSK9基因的調控元件上的靶核苷酸序列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to an epigenetic editor comprising a transcription activator-like effector (TALE) domain, at least one epigenetic-modifying domain, and at least one transcription-regulatory domain, wherein the TALE domain specifically binds to a target nucleotide sequence located within the PCSK9 gene and/or a regulatory element thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1433" publication-number="202617189">
    <tif-files tif-type="multi-tif">
      <tif file="114123370.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療瓜胺酸血症Ｉ型之ＡＳＳ１基因插入</chinese-title>
        <english-title>ASS1 GENE INSERTION FOR THE TREATMENT OF CITRULLINEMIA TYPE I</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K48/00</main-classification>
        <further-classification edition="200601120260202B">C12N9/22</further-classification>
        <further-classification edition="200601120260202B">C12N9/00</further-classification>
        <further-classification edition="201001120260202B">C12N15/113</further-classification>
        <further-classification edition="200601120260202B">C12N15/85</further-classification>
        <further-classification edition="200601120260202B">C12N15/90</further-classification>
        <further-classification edition="200601120260202B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷傑納榮製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩發尼斯　伊凡吉羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEFANIS, EVANGELOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙賓　利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SABIN, LEAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古薩羅娃　維多利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUSAROVA, VIKTORIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯馬里斯　埃里克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMAGRIS, ERIKS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福蒂　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOTI, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎喬利亞　阿爾蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANJOLIA, ARTI MAHENDRA PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉斯　卡斯滕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSS, CARSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供核酸構築體及組成物，其允許將精胺琥珀酸合成酶1 (ASS1)編碼序列插入標靶基因體基因座（諸如內源&lt;i&gt;ASS1&lt;/i&gt;基因座）中及/或表現該ASS1編碼序列。亦提供核酸酶藥劑（例如靶向內源&lt;i&gt;ASS1&lt;/i&gt;基因座）或編碼核酸酶藥劑的核酸以促進該核酸構築體整合至標靶基因體基因座（諸如內源&lt;i&gt;ASS1&lt;/i&gt;基因座）中。該核酸構築體及組成物可用於將&lt;i&gt;ASS1&lt;/i&gt;核酸引入細胞中的方法、將&lt;i&gt;ASS1&lt;/i&gt;核酸整合至標靶基因體基因座中的方法、在細胞中表現ASS1的方法、及治療對象之瓜胺酸血症I型或ASS1缺乏症的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Nucleic acid constructs and compositions that allow insertion of an argininosuccinate synthase 1 (ASS1) coding sequence into a target genomic locus such as an endogenous &lt;i&gt;ASS1 &lt;/i&gt;locus and/or expression of the ASS1 coding sequence are provided. Also provided are nuclease agents (e.g., targeting an endogenous &lt;i&gt;ASS1 &lt;/i&gt;locus) or nucleic acids encoding nuclease agents to facilitate integration of the nucleic acid constructs into a target genomic locus such as an endogenous &lt;i&gt;ASS1 &lt;/i&gt;locus. The nucleic acid constructs and compositions can be used in methods of introducing an &lt;i&gt;ASS1 &lt;/i&gt;nucleic acid into a cell, methods of integration of an &lt;i&gt;ASS1 &lt;/i&gt;nucleic acid into a target genomic locus, methods of expression of ASS1 in a cell, and in methods of treating citrullinemia type I or ASS1 deficiency in a subject.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1434" publication-number="202617734">
    <tif-files tif-type="multi-tif">
      <tif file="114123382.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>GSPT1降解劑化合物、包含其的藥物組合物和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D495/04</main-classification>
        <further-classification edition="200601120260202B">C07D405/04</further-classification>
        <further-classification edition="200601120260202B">C07D413/04</further-classification>
        <further-classification edition="200601120260202B">C07D401/10</further-classification>
        <further-classification edition="200601120260202B">C07D405/14</further-classification>
        <further-classification edition="200601120260202B">C07D401/04</further-classification>
        <further-classification edition="200601120260202B">C07D471/04</further-classification>
        <further-classification edition="200601120260202B">A61K31/454</further-classification>
        <further-classification edition="200601120260202B">A61K31/4525</further-classification>
        <further-classification edition="200601120260202B">A61K31/4523</further-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61K31/517</further-classification>
        <further-classification edition="200601120260202B">A61K31/513</further-classification>
        <further-classification edition="200601120260202B">A61K31/4535</further-classification>
        <further-classification edition="200601120260202B">A61K31/55</further-classification>
        <further-classification edition="200601120260202B">A61K31/4025</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭永勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YONGYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常玉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冬冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, DONGDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　東舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DONGZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供新的GSPT1蛋白調節劑。本公開的新GSPT1調節劑具有高親合力，能夠降解GSPT1，因此具有預防和治療與GSPT1有關的疾病、障礙或病症的潛力。  &lt;br/&gt;&lt;img align="absmiddle" height="195px" width="284px" file="ed10632.JPG" alt="ed10632.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1435" publication-number="202619242">
    <tif-files tif-type="multi-tif">
      <tif file="114123383.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源供應器及其運作方法</chinese-title>
        <english-title>POWER SUPPLY UNIT AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H02M1/08</main-classification>
        <further-classification edition="200601120250801B">H02M3/156</further-classification>
        <further-classification edition="200601120250801B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周清和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHING-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧永泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YUNG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一電源供應器，包含外殼、輸出電壓控制線、電源轉換電路、輸出控制電路、電流檢測電路、回授電路、耦合電路和電源轉換控制電路。電源轉換電路接收輸入電壓。回授電路接收檢測電壓信號和檢測電流信號以對應地產生控制信號。耦合電路依據控制信號產生電源轉換控制信號。電源轉換控制電路依據電源轉換控制信號產生轉換信號。當輸出電壓控制線設置為導通時，輸出控制電路設置電源轉換電路以對應地產生第一輸出電壓。當輸出電壓控制線設置為不導通時，輸出控制電路設置電源轉換電路以對應地產生第二輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply includes a housing, an output voltage control line, a power conversion circuit, an output control circuit, a current detection circuit, a feedback circuit, a coupling circuit and a power conversion control circuit. The power conversion circuit receives an input voltage. The feedback circuit receives a detection voltage signal and a detection current signal to correspondingly generate a control signal. The coupling circuit generates a power conversion control signal based on the control signal. The power conversion control circuit generates a conversion signal based on the power conversion control signal. When the output voltage control line is conducted, the output control circuit sets the power conversion circuit to correspondingly generate a first output voltage. When the output voltage control line is not conducted, the output control circuit sets the power conversion circuit to correspondingly generate a second output voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">102:電源轉換電路</p>
        <p type="p">102a:第一輸入端</p>
        <p type="p">102b:第二輸入端</p>
        <p type="p">102c:第一輸出端</p>
        <p type="p">102d:第二輸出端</p>
        <p type="p">104:電流檢測電路</p>
        <p type="p">108:輸出控制電路</p>
        <p type="p">110:第一回授電路</p>
        <p type="p">111:耦合電路</p>
        <p type="p">112:電源轉換控制電路</p>
        <p type="p">114:功率因數修正電路</p>
        <p type="p">114a:第一交流輸入端</p>
        <p type="p">114b:第二交流輸入端</p>
        <p type="p">114c:第一功因修正輸出端</p>
        <p type="p">114d:第二功因修正輸出端</p>
        <p type="p">500:外殼</p>
        <p type="p">520,540:連接線</p>
        <p type="p">560:輸出電壓控制線</p>
        <p type="p">CW:控制端</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">V1a:第一檢測電壓信號</p>
        <p type="p">V1b:第一檢測電流信號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Iout:輸出電流</p>
        <p type="p">I/P:原始電壓</p>
        <p type="p">CS:電源轉換控制信號</p>
        <p type="p">CS1:第一控制信號</p>
        <p type="p">Sc:轉換信號</p>
        <p type="p">C1:第一電容</p>
        <p type="p">C2:第二電容</p>
        <p type="p">Ra:第一跨壓電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1436" publication-number="202619007">
    <tif-files tif-type="multi-tif">
      <tif file="114123398.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>平面定位台、以及定位方法</chinese-title>
        <english-title>COMBINED LONG-STROKE AND SHORT-STROKE POSITIONING STAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/68</main-classification>
        <further-classification edition="200601120260126B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商先進科技新加坡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMPT SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥　國鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAK, KUOK HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關　家勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAN, KA SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫　偉光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOK, WAI KWONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種平面定位台以及定位方法。所述平面定位台包括：可被驅動以運動至平面上不同位置的集成平面運動台，以及包含在集成平面運動台內的平面夾具台。多個線圈組件安裝在集成平面運動臺上，用於與安裝在平面夾具臺上的磁體進行電磁相互作用。所述電磁相互作用可以選擇性地將平面夾具台與集成平面運動台耦合以使其一起運動，或者使平面夾具台與集成平面運動台解除耦合，以驅動平面夾具台相對于集成平面運動台運動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A planar positioning stage has an integrated planar motion stage that is drivable to move to different locations on a plane, and a planar fixture stage contained within the integrated planar motion stage. Multiple coil assemblies are mounted on the integrated planar motion stage that are configured for electromagnetic interaction with magnets mounted on the planar fixture stage. The said electromagnetic interaction may selectively either couple the planar fixture stage to move together with the integrated planar motion stage or to decouple the planar fixture stage from the integrated planar motion stage to drive the planar fixture stage to move relative to the integrated planar motion stage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:平面定位台</p>
        <p type="p">12:基座</p>
        <p type="p">14:集成平面運動台</p>
        <p type="p">16:平面夾具台</p>
        <p type="p">18:Y滑架</p>
        <p type="p">20:Y直線電機</p>
        <p type="p">22:Y導軌</p>
        <p type="p">24:X滑架</p>
        <p type="p">26:X直線電機</p>
        <p type="p">28:平面電機</p>
        <p type="p">30:平面台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1437" publication-number="202617771">
    <tif-files tif-type="multi-tif">
      <tif file="114123401.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合ＩＬ－１３之抗體及結合ＯＸ４０Ｌ之抗體</chinese-title>
        <english-title>ANTIBODIES THAT BIND IL-13 AND ANTIBODIES THAT BIND OX40L</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">C07K16/24</further-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61K38/47</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾普吉醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APOGEE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏席恩　胡桑　席夏姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAHEEN, HUSSAM HISHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯普森　肯尼斯　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMPSON, KENNETH EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈文　彼得　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARWIN, PETER EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基瑟拉克　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISELAK, TOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　秉賀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYONG HA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　愛瑞克　法蘭克林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ERIC FRANKLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐　傑森　季崧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JASON ZEE SEUG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨德森　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDERSON, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達姆博考斯基　卡爾　林登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAMBKOWSKI, CARL LINDEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達波拉　蕾貝卡　盧希爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DABORA, REBECCA LUCILLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾耶思　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOYES, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述結合OX40L及IL-13之抗體或其抗原結合片段之組合及其使用方法。在某些態樣中，本文描述抑制OX40L及IL-13生物活性之方法。在某些態樣中，本文描述包含該等抗OX40L及抗IL-13抗體或其抗原結合片段之醫藥組合物。在某些態樣中，本文中所描述之該等抗體及方法用於治療發炎性疾病或病症(例如，與OX40L及/或IL-13含量升高相關)。  &lt;br/&gt;本文亦描述包含以下之組合物及組合：結合OX40L之抗體或抗原結合區、結合IL-13之抗體或抗原結合區，及玻尿酸酶或其變異體，以及描述藉由投與此等組合物及組合來治療人類患者之發炎性病症或疾病的相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are antibodies, or antigen binding fragments thereof, that bind OX40L and IL-13 in combination and methods of use thereof. In certain aspects, described herein are methods of inhibiting OX40L and IL-13 biological activity. In certain aspects, described herein are pharmaceutical compositions comprising the anti-OX40L and anti-IL-13 antibodies, or antigen binding fragments thereof. In certain aspects, the antibodies and methods described herein are used for treatment of an inflammatory disease or disorder (&lt;i&gt;e.g.,&lt;/i&gt; associated with elevated levels of OX40L and/or IL-13). &lt;br/&gt;Also described herein are compositions and combinations comprising an antibody or an antigen binding region that binds OX40L, an antibody or antigen binding region that binds IL-13, and a hyaluronidase or variant thereof, as well as related methods of treating an inflammatory disorder or disease in a human patient by administering such compositions and combinations.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1438" publication-number="202617687">
    <tif-files tif-type="multi-tif">
      <tif file="114123402.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
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          <doc-number>202617687</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C309/06</main-classification>
        <further-classification edition="200601120260202B">C07C309/10</further-classification>
        <further-classification edition="200601120260202B">C07C309/12</further-classification>
        <further-classification edition="200601120260202B">C07C309/17</further-classification>
        <further-classification edition="200601120260202B">C07C309/71</further-classification>
        <further-classification edition="200601120260202B">C07C317/18</further-classification>
        <further-classification edition="200601120260202B">C07C317/24</further-classification>
        <further-classification edition="200601120260202B">C07C317/44</further-classification>
        <further-classification edition="200601120260202B">C07C381/00</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D211/46</further-classification>
        <further-classification edition="200601120260202B">C07D307/93</further-classification>
        <further-classification edition="200601120260202B">C07D327/06</further-classification>
        <further-classification edition="200601120260202B">C07D327/08</further-classification>
        <further-classification edition="200601120260202B">C07D333/46</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C07D405/04</further-classification>
        <further-classification edition="200601120260202B">C08F20/10</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野文博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, FUMIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙嶋美沙樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKASHIMA, MISAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤研由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, AKIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子明弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物形成的光阻膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法及電子器件之製造方法，所述感光化射線性或感放射線性樹脂組成物含有藉由酸的作用而極性增大之樹脂和具有特定結構的鎓鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1439" publication-number="202617866">
    <tif-files tif-type="multi-tif">
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          <doc-number>202617866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>煅燒用樹脂組成物及煅燒用片材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08L29/04</main-classification>
        <further-classification edition="200601120260126B">C08L67/03</further-classification>
        <further-classification edition="201801120260126B">C08K3/011</further-classification>
        <further-classification edition="200601120260126B">A61L17/12</further-classification>
        <further-classification edition="200601120260126B">H01G4/30</further-classification>
        <further-classification edition="200601120260126B">H01G9/052</further-classification>
        <further-classification edition="200601120260126B">H01G4/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商綜研化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOKEN CHEMICAL &amp; ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中美千翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, MICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠獲得在燒成性及彎曲強度方面優異之片材的煅燒用樹脂組成物。根據本案，提供一種煅燒用樹脂組成物，其包含聚乳酸(A)、以及SP值為9.6(cal/cm&lt;sup&gt;3&lt;/sup&gt;)&lt;sup&gt;1/2&lt;/sup&gt;以上之塑化劑(B)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1440" publication-number="202617157">
    <tif-files tif-type="multi-tif">
      <tif file="114123478.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啶化合物的藥物組成物
      </chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITIONS COMPRISING NAPHTHYRIDINE COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">A61K31/5377</main-classification>
        <further-classification edition="200601120260116B">A61K31/4375</further-classification>
        <further-classification edition="200601120260116B">A61K31/4355</further-classification>
        <further-classification edition="200601120260116B">A61K9/20</further-classification>
        <further-classification edition="200601120260116B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾瑞茲　努尼茲　菲爾南多　安東尼歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALVAREZ-NUNEZ, FERNANDO ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊　約翰　印</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, JOHN INN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯爾桑德　貝諾許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHORSAND, BEHNOUSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　袁宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIANG, YUAN-HON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YICONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONG, HWEE JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了藥物組成物，其包含化合物A，&lt;img align="absmiddle" height="155px" width="201px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;（如1-40 wt%的化合物A），其中該藥物組成物適用於口服施用。在一些實施方式中，所揭露之組成物適用於高載藥量。所揭露之組成物適用於治療對抑制蛋白精胺酸甲基轉移酶5（PRMT5）有響應的疾病或障礙（例如，癌症）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are pharmaceutical compositions comprising Compound A, &lt;img align="absmiddle" height="151px" width="198px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, such as 1-40 wt% Compound A, wherein the pharmaceutical compositions are suitable for oral administration. In some embodiments, the disclosed compositions are suitable for high drug loading. The disclosed compositions are suitable for treating diseases or disorders responsive to inhibiting protein arginine methyltransferase 5 (PRMT5) (e.g., cancer).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1441" publication-number="202618947">
    <tif-files tif-type="multi-tif">
      <tif file="114123482.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123482</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有位置特定處理的接合方法</chinese-title>
        <english-title>BONDING METHOD WITH LOCATION SPECIFIC PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/60</main-classification>
        <further-classification edition="200601120260123B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊恩　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYAN, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內茨班德　克里斯多福　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NETZBAND, CHRISTOPHER MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>默巴納索　齊毛比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MBANASO, CHIMAOBI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾德　亞當　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILDEA, ADAM J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成已接合晶圓的方法，該方法包含接收包含第一表面特性的第一晶圓，以及接收包含第二表面特性的第二晶圓；基於該第一表面特性，在該第一晶圓上執行第一位置特定處理，以得到包含第三表面特性的第一待接合表面；以及將該第一待接合表面與該第二晶圓接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a bonded wafer, where the method includes receiving a first wafer including a first surface characteristic and a second wafer including a second surface characteristic; based on the first surface characteristic, performing a first location specific processing on the first wafer to obtain a first surface-to-be-bonded including a third surface characteristic; and bonding the first surface-to-be-bonded of the first wafer with the second wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">310,320,330:方格</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1442" publication-number="202617587">
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      <tif file="114123490.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氫生成裝置</chinese-title>
        <english-title>APPARATUS FOR HYDROGEN GENERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C01B3/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽有健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAARI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎義倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>當房誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>室矢健吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUROYA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本村航平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOMURA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;　　提供一種氫生成裝置，能夠抑制高度過高之情事。  &lt;br/&gt;[解決手段]  &lt;br/&gt;　　一種氫生成裝置，係具備：反應器(14)，係具備觸媒，且將烴熱分解；處理裝置(50)，係處理包含因熱分解產生之碳之溢流粒子；以及：搬運通路，係將反應器內之溢流粒子，藉由搬運流體搬運至處理裝置。於搬運通路之溢流粒子之流動方向與水平方向所成之角度，且係以自水平方向往垂直上方向前進側為正之角度，係設定為零以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:壓縮機</p>
        <p type="p">12:熱交換器</p>
        <p type="p">14:反應器</p>
        <p type="p">14a:觸媒供給口</p>
        <p type="p">14b:出口</p>
        <p type="p">16:加熱裝置</p>
        <p type="p">18:觸媒</p>
        <p type="p">20:噴嘴</p>
        <p type="p">22:旋風器</p>
        <p type="p">24:過濾裝置</p>
        <p type="p">26:固體取出裝置</p>
        <p type="p">28:壓縮機</p>
        <p type="p">30:溢流管</p>
        <p type="p">32:腔</p>
        <p type="p">34:孔板</p>
        <p type="p">36:喇叭口</p>
        <p type="p">40:溢流粒子搬運管</p>
        <p type="p">42:傳熱管</p>
        <p type="p">44:外管</p>
        <p type="p">50:處理裝置</p>
        <p type="p">52:金屬濾網</p>
        <p type="p">54:固體取出裝置</p>
        <p type="p">56:吸引通路</p>
        <p type="p">58:流量控制閥</p>
        <p type="p">60:壓力控制閥</p>
        <p type="p">70:氫純化裝置</p>
        <p type="p">72:回歸通路</p>
        <p type="p">74:壓縮機</p>
        <p type="p">80:控制裝置</p>
        <p type="p">82:PU</p>
        <p type="p">84:記憶體</p>
        <p type="p">90:壓力感測器</p>
        <p type="p">92:壓力感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1443" publication-number="202619566">
    <tif-files tif-type="multi-tif">
      <tif file="114123524.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250905B">H10D84/83</main-classification>
        <further-classification edition="202501120250905B">H10D62/60</further-classification>
        <further-classification edition="202301120250905B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, DEOK LAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋熙贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HEE CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金澤中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEK JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴相勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">該半導體裝置包括：一基體，其包括一NMOS區及一PMOS區；一第一閘極堆疊及一第一源極/汲極區，其鄰近於該第一閘極堆疊，以及一電晶體，其在該PMOS區中，包括一第二閘極堆疊及鄰近於該第二閘極堆疊之一第二源極/汲極區，其中該第一閘極堆疊包括序列堆疊之一第一高介電常數絕緣膜、一插入層、一第一金屬層及一第一保護層，該第二閘極堆疊包括序列堆疊之一第二高介電常數絕緣膜、一第二金屬層及一第二保護層，該第一保護層之氧濃度高於該第一金屬層之氧濃度，且該第二保護層之氧濃度高於該第二金屬層之氧濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The semiconductor device includes a substrate including an NMOS region and a PMOS region, a first gate stack and a first source/drain region adjacent to the first gate stack and a transistor in the PMOS region, including a second gate stack and a second source/drain region adjacent to the second gate stack, wherein the first gate stack includes a first high dielectric constant insulating film, an insertion layer, a first metal layer and a first protection layer that are sequentially stacked, the second gate stack includes a second high dielectric constant insulating film, a second metal layer and a second protection layer that are sequentially stacked, an oxygen concentration of the first protection layer is higher than an oxygen concentration of the first metal layer, and an oxygen concentration of the second protection layer is higher than an oxygen concentration of the second metal layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基體</p>
        <p type="p">105:第一源極/汲極區</p>
        <p type="p">107:第二源極/汲極區</p>
        <p type="p">110:裝置隔離膜</p>
        <p type="p">121:第一界面絕緣膜</p>
        <p type="p">122:第二界面絕緣膜</p>
        <p type="p">131:第一高介電常數絕緣膜</p>
        <p type="p">132:第二高介電常數絕緣膜</p>
        <p type="p">141:第一金屬層</p>
        <p type="p">142:第二金屬層</p>
        <p type="p">151:第一保護層</p>
        <p type="p">152:第二保護層</p>
        <p type="p">161:第一傳導膜結構</p>
        <p type="p">161a:第一下傳導膜</p>
        <p type="p">161b:第一插入傳導膜</p>
        <p type="p">161c:第一上傳導膜</p>
        <p type="p">162:第二傳導膜結構</p>
        <p type="p">162a:第二下傳導膜</p>
        <p type="p">162b:第二插入傳導膜</p>
        <p type="p">162c:第二上傳導膜</p>
        <p type="p">171:第一硬遮罩圖案</p>
        <p type="p">172:第二硬遮罩圖案</p>
        <p type="p">181:第一閘極間隔件</p>
        <p type="p">182:第二閘極間隔件</p>
        <p type="p">210:插入層</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">G1:第一閘極堆疊</p>
        <p type="p">G2:第二閘極堆疊</p>
        <p type="p">H1,H2:高度</p>
        <p type="p">RN:NMOS區</p>
        <p type="p">RP:PMOS區</p>
        <p type="p">T1,T2,T3,T4,T5,T6:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1444" publication-number="202617637">
    <tif-files tif-type="multi-tif">
      <tif file="114123527.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以分隔壁塔同時生產高純度MTBE及高純度異丁烯之技術</chinese-title>
        <english-title>CONCURRENT PRODUCTION OF HIGH PURITY MTBE AND HIGH PURITY ISOBUTYLENE WITH DIVIDING WALL COLUMN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C07C11/09</main-classification>
        <further-classification edition="200601120260129B">C07C29/84</further-classification>
        <further-classification edition="200601120260129B">C07C31/04</further-classification>
        <further-classification edition="200601120260129B">C07C41/42</further-classification>
        <further-classification edition="200601120260129B">C07C43/04</further-classification>
        <further-classification edition="200601120260129B">C07C7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商魯瑪斯科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴里亞斯　羅塞特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARIAS, ROSETTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考特　麥克　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOTT, MICHAEL JON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種共同生產高純度甲基三級丁基醚及高純度異丁烯之製程。該製程包括將一粗MTBE流供給至一分隔壁塔中。將該粗MTBE流分成一輕烴、一第一側流、一第二側流及一重烴。供給該第一側流及該第二側流之一第一部份至一反應器且分解，產生一未處理IB流。回收該第二側流之一第二部份作為一高純度MTBE產物。供給該未處理IB流及一萃取劑至回收一頂部沖洗反應器流出物及一底部產物之一甲醇萃取塔。供給該沖洗反應器流出物至一IB分隔壁塔及下列中之一或多者：一輕端頂部物、一高純度IB流及一IB底部產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for the coproduction of high purity methyl tertiary butyl ether and high purity isobutylene. The process includes feeding a crude MTBE stream into a dividing wall column. The crude MTBE stream is separated into a light hydrocarbon, a first side-stream, a second side-stream, and a heavy hydrocarbon. The first side-stream and a first portion of the second-side stream are fed to a reactor and decomposed, producing a raw IB stream. A second portion of the second side-stream is recovering as a high purity MTBE product. The raw IB stream and an extractant are fed to a methanol extraction column where an overhead washed reactor effluent and a bottoms product are recovered. The washed reactor effluent is fed to an IB dividing wall column and one or more of a light ends overhead, an high purity IB stream, and an IB bottom product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:粗MTBE；MTBE</p>
        <p type="p">2:輕烴</p>
        <p type="p">3:第一側流</p>
        <p type="p">5:第二側流；高純度MTBE</p>
        <p type="p">5a:第一部份</p>
        <p type="p">5b:第二部份</p>
        <p type="p">7:重烴</p>
        <p type="p">9:未處理IB流；未處理IB</p>
        <p type="p">11:萃取劑；底部流；底部物</p>
        <p type="p">12:分隔壁塔；MTBE分隔壁塔</p>
        <p type="p">13:沖洗反應器流出物</p>
        <p type="p">14:反應器；IB反應器</p>
        <p type="p">15,21:底部產物</p>
        <p type="p">16:甲醇萃取塔；萃取塔</p>
        <p type="p">17:輕端頂部物</p>
        <p type="p">18:甲醇分隔壁塔</p>
        <p type="p">19:高純度IB之第一側流</p>
        <p type="p">20:IB分隔壁塔；IB分隔壁分餾塔</p>
        <p type="p">23:液體副產物</p>
        <p type="p">25:純甲醇產物</p>
        <p type="p">27:第二側流</p>
        <p type="p">29:頂部產物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1445" publication-number="202619168">
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      <tif file="114123551.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123551</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及連接器元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260123B">H01R12/71</main-classification>
        <further-classification edition="200601120260123B">H01R13/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中理史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">問題：製造容易，能夠小型化和低高度，以及提高可靠性。&lt;br/&gt;  解決手段：連接器包括基座、附接於所述基座的多個端子以及加強金屬配件，其中，所述基座包括一對側壁和連接於所述側壁的各端的一對端壁，所述側壁支持所述端子，以及所述加強金屬配件連接於所述端壁；所述端子包括在所述連接器的寬度方向上延伸的基板連接部、一端連接於所述基板連接部的第二接觸部以及連接於所述第二接觸部的另一端的第一接觸部；所述側壁包括底板部和從所述底板部在嵌合方向上突設的凸壁；以及所述第一接觸部所具有的第一接觸面在與所述凸壁的第一側面和第二側面對應的位置露出於所述凸壁的第一側面和第二側面，以及所述第二接觸部所具有的第二接觸面在相對所述凸壁的第一側面和第二側面向寬度方向內側偏置的位置露出於所述凸壁的第一側面和第二側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一連接器</p>
        <p type="p">10A:左半體部</p>
        <p type="p">10B:右半體部</p>
        <p type="p">11:第一基座</p>
        <p type="p">12:第一凸部</p>
        <p type="p">12a:嵌合面</p>
        <p type="p">12b:外側面</p>
        <p type="p">12c:內側面</p>
        <p type="p">12d:端子間壁</p>
        <p type="p">13:凹槽部</p>
        <p type="p">14:延長端部</p>
        <p type="p">16:第一突出端部</p>
        <p type="p">17:底板部</p>
        <p type="p">17a:下板部</p>
        <p type="p">17b:上板部</p>
        <p type="p">18:側壁</p>
        <p type="p">51:第一加強配件</p>
        <p type="p">62:尾部</p>
        <p type="p">60:端子列</p>
        <p type="p">61、61A、61B:第一端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1446" publication-number="202618342">
    <tif-files tif-type="multi-tif">
      <tif file="114123555.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遮光構件以及具有其的光學元件</chinese-title>
        <english-title>LIGHT SHIELDING MEMBER AND OPTICAL ELEMENT HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">G02B5/04</main-classification>
        <further-classification edition="200601120250910B">G02B5/20</further-classification>
        <further-classification edition="200601120250910B">G02B3/00</further-classification>
        <further-classification edition="200601120250910B">G02B27/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張道炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DO HYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳浩植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, HO SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昶旼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOON HA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴德容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DUCK YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種遮光構件被提供。遮光構件包括設置於遮光構件的第一內周表面上的第一突出部，第一內周表面延伸於與光軸相交的第一方向上，以及設置於遮光構件的第二內周表面上的第二突出部，第二內周表面延伸於與光軸相交的第二方向上。第一突出部的第一平均尺寸被配置成不同於第二突出部的第二平均尺寸。第一突出部或第二突出部相對於第一內周表面的平分線或第二內周表面的平分線非對稱地形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light shielding member is provided. The light shielding member includes a first protrusion disposed on a first inner peripheral surface of the light shielding member extending in a first direction intersecting an optical axis, and a second protrusion disposed on a second inner peripheral surface of the light shielding member extending in a second direction, intersecting the optical axis. A first average size of the first protrusion is configured to be different from a second average size of the second protrusion. The first protrusion or the second protrusion is formed asymmetrically with respect to a bisector of the first inner peripheral surface or a bisector of the second inner peripheral surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:遮光構件</p>
        <p type="p">110:突出部、第一突出部</p>
        <p type="p">120:第二突出部</p>
        <p type="p">A:第一內周表面</p>
        <p type="p">AL、BL:長度</p>
        <p type="p">B:第二內周表面</p>
        <p type="p">C:光軸</p>
        <p type="p">W:透光窗口</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1447" publication-number="202618389">
    <tif-files tif-type="multi-tif">
      <tif file="114123564.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250916B">G02B13/18</main-classification>
        <further-classification edition="200601120250916B">G02B11/34</further-classification>
        <further-classification edition="202101120250916B">G02B7/02</further-classification>
        <further-classification edition="200601120250916B">G02B5/126</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學成像系統包括第一接合透鏡、第二接合透鏡、以及第三接合透鏡，沿著光學成像系統的光軸從光學成像系統的物側朝向成像平面按遞增數字順序依序設置並以預定距離彼此間隔開，其中第一接合透鏡、第二接合透鏡、以及第三接合透鏡中的每一個包括由塑膠材料或玻璃材料製成的中央透鏡；接合到中央透鏡的物側表面、具有折射力且由與中央透鏡所製成的材料不同的材料製成的透鏡；以及接合到中央透鏡的像側表面、具有折射力且由與中央透鏡所製成的材料不同的材料製成的透鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first bonded lens, a second bonded lens, and a third bonded lens sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane and spaced apart from each other by predetermined distances, wherein each of the first bonded lens, the second bonded lens, and the third bonded lens includes a central lens made of a plastic material or a glass material; a lens bonded to an object-side surface of the central lens, having a refractive power, and made of a material different from the material of which the central lens is made; and a lens bonded to an image-side surface of the central lens, having a refractive power, and made of a material different from the material of which the central lens is made.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">190:第九透鏡</p>
        <p type="p">CL1:第一接合透鏡</p>
        <p type="p">CL2:第二接合透鏡</p>
        <p type="p">CL3:第三接合透鏡</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1448" publication-number="202618058">
    <tif-files tif-type="multi-tif">
      <tif file="114123574.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜沉積厚度即時測量裝置及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR REAL-TIME IN-SITU MEASURING THICKNESS OF THIN FILM DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C23C16/52</main-classification>
        <further-classification edition="200601120260123B">C23C16/455</further-classification>
        <further-classification edition="200601120260123B">G01B21/08</further-classification>
        <further-classification edition="200601120260123B">G06F17/10</further-classification>
        <further-classification edition="202301120260123B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慶煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, KYUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慶煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, KYUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及生產工序中在不損傷測量試樣表面的情況下在沉積設備中直接迅速地測量薄膜厚度的技術，為即時測量形成薄膜的腔室內部殘留的物質的化學成分並分析來測量薄膜厚度的技術。本發明的薄膜沉積厚度即時測量裝置包括：腔室，進行薄膜沉積工序；分析儀，即時測量薄膜沉積工序中所述腔室內的氣態物質；以及運算部，基於由所述分析儀測量的數據通過下述數式計算薄膜沉積厚度。薄膜沉積厚度={[a1×Σ（薄膜沉積副產物的量）]×[a2×Σ（氧副產物的量）]×[a3×Σ（氮副產物的量）]+a4}/[a5×Σ（沉積氣體的量）]×a6，其中，a1、a2、a3、a4、a5及a6為預先規定的常數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention is about measuring the thickness of the thin film directly from the deposition equipment without damaging the surface of the measurement sample in the production process, and it is a technology that measures and interprets the chemical components of the material remaining inside the chamber where the thin film is formed in real time. The device for measuring the thickness of thin film deposition in real time according to the present invention includes a chamber in which a thin film deposition process is performed; an analyzer that measures gaseous substances in the chamber in real time during the thin film deposition process; and a calculation unit that calculates the thickness of thin film deposition by the following equation based on the data measured by the analyzer above. Thin film deposition thickness = {[a1 × Σ (amount of thin film deposition by-products)] × [a2 × Σ (amount of oxygen by-products)] × [a3 × Σ (amount of nitrogen by-products)] + a4} / [a5 × Σ (amount of deposition gas)] × a6a1, a2, a3, a4, a5 and a6 are predetermined constants.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:薄膜沉積厚度即時測量裝置</p>
        <p type="p">11:腔室</p>
        <p type="p">12:分析儀</p>
        <p type="p">13:運算部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1449" publication-number="202617176">
    <tif-files tif-type="multi-tif">
      <tif file="114123576.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療血友病Ｂ的方法</chinese-title>
        <english-title>METHOD FOR TREATING HEMOPHILIA B</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K38/36</main-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
        <further-classification edition="200601120260202B">C07K14/745</further-classification>
        <further-classification edition="200601120260202B">C12N15/86</further-classification>
        <further-classification edition="200601120260202B">A61P7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俄羅斯聯邦商拜奧卡德聯合股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOINT STOCK COMPANY ''BIOCAD''</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞歷山卓　亞雷克西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEKSANDROV, ALEKSEI ALEKSANDROVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維諾加多瓦　艾琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINOGRADOVA, ELENA VLADIMIROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃裡米娃　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EREMEEVA, ANNA VIKTOROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津金納奧里翰　阿里納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZINKINA-ORIKHAN, ARINA VALEREVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫克斯高茲　伊洛娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUKSGAUZ, ILONA ALEKSANDROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧茨基　安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUTSKII, ANTON ALEKSANDROVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林科娃　尤利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINKOVA, IULIIA NIKOLAEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧加諾瓦　瑪麗娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGANOVA, MARINA ALBERTOVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞斯堤戈　艾可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USTIUGOV, IAKOV IUREVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩羅佐　狄密崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROZOV, DMITRY VALENTINOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及醫學領域，特別是涉及一種用於治療血友病B的方法，包括施用預定劑量的重組病毒載體AAV5-FIX，以及涉及預定劑量的重組病毒載體AAV5-FIX的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of medicine, in particular to a method for treating hemophilia B, comprising administering a recombinant viral vector AAV5-FIX in predetermined doses, as well as to use of the recombinant viral vector AAV5-FIX in predetermined doses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1450" publication-number="202619345">
    <tif-files tif-type="multi-tif">
      <tif file="114123580.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜態網格編碼器中之視訊動態網格寫碼之熵編碼改善</chinese-title>
        <english-title>VIDEO-DYNAMIC MESH CODING ENTROPY ENCODING IMPROVEMENTS IN STATIC-MESH ENCODER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260126B">H04N19/44</main-classification>
        <further-classification edition="201401120260126B">H04N19/13</further-classification>
        <further-classification edition="201401120260126B">H04N19/17</further-classification>
        <further-classification edition="201401120260126B">H04N19/597</further-classification>
        <further-classification edition="201401120260126B">H04N19/70</further-classification>
        <further-classification edition="201401120260126B">H04N19/91</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克塔　安尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKHTAR, ANIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汎　德　奧維拉　葛特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER AUWERA, GEERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞瑪蘇布雷蒙尼安　阿達許　克里許納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASUBRAMONIAN, ADARSH KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡達　雷圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOODA, REETU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲維克茲　馬塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置，其經組態以從包括經編碼網格資料之一位元串流中解碼一網格，其中作為解碼該網格之一部分，該裝置之一或多個處理器經組態以基於經編碼網格資料來判定包括一組頂點之一基礎網格；對第一經熵編碼資料、第二經熵編碼資料、及第三經熵編碼資料應用熵解碼包含使用一共用非旁路上下文，以用於對第一截斷一元(TU)資料、第二TU資料、及第三TU資料之各者之至少一個位元子進行熵解碼，其中該第一TU資料、該第二TU資料、及該第三TU資料被包括在語法元素之二值化表示中，該等語法元素表示頂點之法向向量之分量之第一殘差值及第二殘差值以及一頂點之一法向向量之一分量之一第二殘差值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device is configured to decode a mesh from a bitstream that includes the encoded mesh data, wherein, as part of decoding the mesh, one or more processors of the device are configured to determine, based on encoded mesh data, a base mesh that includes a set of vertices; apply the entropy decoding to first, second, and third entropy-encoded data comprises using a shared non-bypass context for entropy decoding at least one bin of each of the first truncated unary (TU) data, the second TU data, and the third TU data, where the first, second, and third TU data are included in binarized representations of syntax elements representing first and second residual values of components of normal vectors of vertices and a second residual value of a component of a normal vector of a vertex.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3200,3202,3204,3206,3208,3210,3212,3214,3216,3218,3220,3222:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1451" publication-number="202617982">
    <tif-files tif-type="multi-tif">
      <tif file="114123582.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含經修飾之葡萄糖腦苷脂酶多肽之融合蛋白及其方法</chinese-title>
        <english-title>FUSION PROTEINS COMPRISING MODIFIED GLUCOCEREBROSIDASE POLYPEPTIDES AND METHODS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N9/24</main-classification>
        <further-classification edition="200601120260202B">C07K14/79</further-classification>
        <further-classification edition="200601120260202B">C07K14/705</further-classification>
        <further-classification edition="200601120260202B">A61K38/47</further-classification>
        <further-classification edition="200601120260202B">A61K38/40</further-classification>
        <further-classification edition="200601120260202B">A61P25/28</further-classification>
        <further-classification edition="200601120260202B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商戴納立製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENALI THERAPEUTICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科恩　約翰　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COAN, JOHN PHILLIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維斯　奧利弗　布雷耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIS, OLIVER BRAYER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里歐立斯　米漢利斯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIOLIS, MIHALIS S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬翁　凱瑟　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHON, CATHAL S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎爾奎茲　阿拉姆　納比爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QERQEZ, AHLAM NABIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汝格　萊昂內爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUGE,LIONEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁天驁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, TIANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供能夠跨越血腦障壁(BBB)轉運且包含葡萄糖腦苷脂酶(GCase)-Fc融合多肽之蛋白質。某些實施例亦提供使用此類蛋白質治療GCase缺陷之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are proteins, which are capable of being transported across the blood-brain barrier (BBB) and comprise a glucocerebrosidase (GCase)-Fc fusion polypeptide. Certain embodiments also provide methods of using such proteins to treat a GCase deficiency.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1452" publication-number="202618933">
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      <tif file="114123609.zip" no="1">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於蝕刻表面之方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR ETCHING A SURFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/3213</main-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇曼　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURMAN, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里什塔布　米哈伊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHTAB, MIKHAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿托索　艾莉莎　卡羅利娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATOSUO, ELISA KAROLIINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法姆　埃琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARM, ELINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德茲拉　查理斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZELAH, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅梅羅　帕特里西奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMERO, PATRICIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於蝕刻之方法及相關系統。本揭露之實施例包含藉由執行包含複數個蝕刻循環之一循環蝕刻製程來蝕刻一可蝕刻層。來自該複數個蝕刻循環之蝕刻循環包含一揮發反應物脈衝，該揮發反應物脈衝包含使一基板暴露於一揮發反應物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and related systems for etching. Embodiments of the present disclosure comprise etching an etchable layer by executing a cyclical etching process comprising a plurality of etching cycles. Ones from the plurality of etching cycles comprise a volatilization reactant pulse that comprises exposing a substrate to a volatilization reactant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:步驟</p>
        <p type="p">112:步驟</p>
        <p type="p">113:吹掃</p>
        <p type="p">114:步驟</p>
        <p type="p">115:吹掃</p>
        <p type="p">116:蝕刻循環</p>
        <p type="p">117:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1453" publication-number="202618048">
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      <tif file="114123619.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618048</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理用氣體輸送系統及技術</chinese-title>
        <english-title>SYSTEMS AND TECHNIQUES FOR GAS DELIVERY FOR SEMICONDUCTOR PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">C23C16/455</main-classification>
        <further-classification edition="200601120260120B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德　蓋瑞　布里杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIND, GARY BRIDGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉賈　哈里尼　尼維沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJA, HARINI NIVETHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉杜爾　為岈沙嘎爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITTUR, VISHALSAGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些實施例中，提供一系統。該系統可具有：一多站式處理腔室，包含具有一第一氣體分配器的一第一處理站、及具有一第二氣體分配器的一第二處理站；一第一積儲器，建構以容納加壓至高於在該腔室中的壓力之第一製程氣體；一第一流動路徑，跨越在該第一積儲器與該第一氣體分配器之間且與其流體連接；一第一快動作閥門，沿著該第一流動路徑，建構以控制沿著該第一流動路徑的第一氣流且建構以在75毫秒或更少之內開啟及關閉；一第二流動路徑，跨越在該第一積儲器與該第二氣體分配器之間且與其流體連接；及一第二快動作閥門，沿著該第二流動路徑，建構以控制沿著該第二流動路徑的氣流且建構以在75毫秒或更少之內開啟及關閉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a system is provided. The system may have a multi-station processing chamber having a first processing station having a first gas distributor and a second processing station having a second gas distributor, a first accumulator configured to contain a first process gas pressurized above a pressure in the chamber, a first flow path spanning between, and fluidically connecting, the first accumulator and the first gas distributor, a first fast-acting valve along the first flow path configured to control the first gas flow along the first flow path and configured to open and close in 75 milliseconds or less, a second flow path spanning between, and fluidically connecting, the first accumulator and the second gas distributor, and a second fast-acting valve along the second flow path configured to control gas flow along the second flow path and configured to open and close in 75 milliseconds or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102A,102B:處理站</p>
        <p type="p">104A,104B:氣體分配器</p>
        <p type="p">106A,106B:基板支座</p>
        <p type="p">108A,108B:晶圓</p>
        <p type="p">110:氣體輸送系統</p>
        <p type="p">112:積儲器</p>
        <p type="p">114:第一流動路徑</p>
        <p type="p">120:閥門</p>
        <p type="p">122:第一流量限制器</p>
        <p type="p">123:控制器</p>
        <p type="p">124:第二流動路徑</p>
        <p type="p">128:第二快動作閥門</p>
        <p type="p">130:第二流量限制器</p>
        <p type="p">132:部分</p>
        <p type="p">140:第一製程氣體源</p>
        <p type="p">142:壓力感測器</p>
        <p type="p">144:入口控制閥門</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1454" publication-number="202618847">
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      <isuno>9</isuno>
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          <doc-number>202618847</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電子顯微鏡的電子偵測器</chinese-title>
        <english-title>ELECTRON DETECTOR FOR AN ELECTRON MICROSCOPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01J37/244</main-classification>
        <further-classification edition="200601120260123B">H01J37/26</further-classification>
        <further-classification edition="200601120260123B">H01J37/153</further-classification>
        <further-classification edition="201801120260123B">G01N23/22</further-classification>
        <further-classification edition="201801120260123B">G01N23/2251</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司顯微鏡有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS MICROSCOPY GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商卡爾蔡司顯微鏡有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS MICROSCOPY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司多重掃描電子顯微鏡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS MULTISEM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃姆里奇　丹尼爾　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMMRICH, DANIEL ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿諾　雷納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARNOLD, RAINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛艾拉　迪亞哥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERRA, DIEGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒納特　剛瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHEUNERT, GUNTHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里斯　凱瑟雷娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIES, KATHARINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍勒　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAEMMLE, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於電子顯微鏡(10)的電子偵測器(22)，其產生一次電子束(16)以照射樣品(18)，該電子偵測器具有一含有內腔積(34)的管狀部(32)。該一次電子束(16)可穿過該內腔積(34)以照射該樣品(18)。該電子偵測器(22)具有一偵測器元件(26)，該偵測器元件配置在該管狀部(32)的外部，並配置成偵測來自該樣品(18)並沿與該一次電子束(16)的方向相反方向之第二方向(42)移動的電子。沿該第二方向(42)在該偵測器元件(26)的上游配置了一濾光柵(28)，該濾光柵沿橫向越過該電子束(16)的射束方向之第三方向(60)延伸。該電子偵測器(22)具有一絕緣體(36)，該絕緣體使該濾光柵(28)及該管狀部(32)彼此電絕緣，使得該濾光柵(28)可相對於該殼體(24)處於負電位。多個由導電材料製成的電極(48、50、52)配置在該管狀部(32)的外部，並且配置成在該濾光柵(28)與該偵測器元件(26)之間實現主要均勻電場(56)。該電場(56)具有多個等位線(66)，其在該第三方向(60)主要平行於濾光柵(28)延伸。該等電極(48、50、52)更配置成有針對性扭曲該絕緣體(36)區域中的該電場(56)，使得該濾光柵(28)與該偵測器元件(26)之間限定區域(68)內的等位線(66)具有不均勻、主要呈下降趨勢的路線。該限定區域(68)從濾光柵(28)開始沿該第二方向(42)延伸，並且從該管狀部(32)開始沿該第三方向(60)延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electron detector (22) for an electron microscope (10), which generates a primary electron beam (16) in order to illuminate a sample (18), has a tubular portion (32) with an inner volume (34). The primary electron beam (16) can pass through the inner volume (34) in order to illuminate the sample (18). The electron detector (22) has a detector element (26) arranged outside the tubular portion (32) and configured to detect electrons coming from the sample (18) and moving in a second direction (42) in the opposite direction to the direction of the primary electron beam (16). Arranged upstream of the detector element (26) in the second direction (42) is a filter grid (28) which extends in a third direction (60) running transversely to the beam direction of the electron beam (16). The electron detector (22) has an insulator (36) that electrically insulates the filter grid (28) and the tubular portion (32) from each other, such that the filter grid (28) can be at a negative electrical potential relative to the housing (24). A multiplicity of electrodes (48, 50, 52) made of an electrically conductive material are arranged outside the tubular portion (32) and are configured to effect a predominantly homogeneous electric field (56) between the filter grid (28) and the detector element (26). The electric field (56) has equipotential lines (66) which run predominantly parallel to the filter grid (28) in the third direction (60). The electrodes (48, 50, 52) are further configured to distort the electric field (56) in the area of the insulator (36) in a targeted manner such that the equipotential lines (66) in a defined area (68) between the filter grid (28) and the detector element (26) have an inhomogeneous, predominantly falling course. The defined area (68) extends in the second direction (42) starting from the filter grid (28) and in the third direction (60) starting from the tubular portion (32).</p>
      </isu-abst>
      <representative-img>
        <p type="p">28:濾光柵</p>
        <p type="p">48:第一電極</p>
        <p type="p">50:第二電極</p>
        <p type="p">52:第三電極</p>
        <p type="p">66:等位線</p>
        <p type="p">68:限定區域</p>
        <p type="p">70:另外區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1455" publication-number="202619037">
    <tif-files tif-type="multi-tif">
      <tif file="114123629.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123629</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體製造之具有選擇性處理周邊的基板及其處理方法</chinese-title>
        <english-title>SUBSTRATE FOR SEMICONDUCTOR FABRICATION HAVING SELECTIVELY TREATED PERIMETER AND METHOD OF TREATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/78</main-classification>
        <further-classification edition="200601120260126B">H01L21/265</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康斯坦丁　盧伊克貝努伊特文森羅伯特吉恩克洛德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONSTANTIN, LOIC BENOIT VINCENT ROBERT JEAN-CLAUDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃茲尼　莎拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOZNY, SARAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文件揭露了一種用於半導體製造的基板，其內部部分被周邊界定，其中周邊整體均已經過選擇性處理，以形成相對於內部部分具有增加硬度的硬化周邊。同時，也揭露了選擇性處理用於半導體製造的基板的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate for semiconductor fabrication having an interior portion bound by a perimeter, wherein all of the perimeter has been selectively treated to form a hardened perimeter having an increased hardness relative to the interior portion is disclosed herein. Methods to selectively treat a substrate for semiconductor fabrication are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1456" publication-number="202618968">
    <tif-files tif-type="multi-tif">
      <tif file="114123632.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖案形成裝置，圖案形成方法及記憶媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/67</main-classification>
        <further-classification edition="200601120260126B">H01L21/677</further-classification>
        <further-classification edition="200601120260126B">H01L21/027</further-classification>
        <further-classification edition="200601120260126B">G05B19/4155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]針對在溶劑氣氛內進行圖案形成處理的裝置，提高生產性。  &lt;br/&gt;　　[解決手段]一種圖案形成裝置，具備：溶劑處理室，其具有收容基板的腔室、溶劑蒸氣的供給口，並進行圖案形成處理，藉由供給到前述腔室內的前述溶劑蒸氣來處理前述基板，進而於該基板上形成圖案；熱處理室，其具有收容前述溶劑處理室所處理之前述基板的腔室、加熱前述基板的加熱器，並進行乾燥處理，藉由以前述加熱器進行加熱，使形成有前述圖案的前述基板乾燥；搬運機構，是在前述溶劑處理室與前述熱處理室之間搬運前述基板；以及框體，是將前述溶劑處理室、前述熱處理室、前述搬運機構，收容在共通的收容空間中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">41:圖案形成裝置</p>
        <p type="p">300:框體</p>
        <p type="p">301:溶劑處理室</p>
        <p type="p">302:熱處理室</p>
        <p type="p">320:腔室</p>
        <p type="p">321:上部腔室</p>
        <p type="p">322:下部腔室</p>
        <p type="p">330:蓮蓬頭</p>
        <p type="p">331:供給口</p>
        <p type="p">332:氣體供給管</p>
        <p type="p">340:外周排氣路</p>
        <p type="p">341:外周排氣管</p>
        <p type="p">350:調溫板</p>
        <p type="p">351:保持構件</p>
        <p type="p">360:升降銷</p>
        <p type="p">361:升降驅動部</p>
        <p type="p">420:腔室</p>
        <p type="p">421:上部腔室</p>
        <p type="p">422:下部腔室</p>
        <p type="p">430:蓮蓬頭</p>
        <p type="p">431:供給口</p>
        <p type="p">432:氣體供給管</p>
        <p type="p">440:外周排氣路</p>
        <p type="p">441:外周排氣管</p>
        <p type="p">450:熱板</p>
        <p type="p">451:保持構件</p>
        <p type="p">460:升降銷</p>
        <p type="p">461:升降驅動部</p>
        <p type="p">K1:收容空間</p>
        <p type="p">R1:溶劑處理區域</p>
        <p type="p">R2:乾燥區域</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1457" publication-number="202619013">
    <tif-files tif-type="multi-tif">
      <tif file="114123646.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有保護塗層之靜電卡盤</chinese-title>
        <english-title>ELECTROSTATIC CHUCK WITH PROTECTIVE COATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/683</main-classification>
        <further-classification edition="200601120260123B">H02N13/00</further-classification>
        <further-classification edition="200601120260123B">C23C16/458</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃得法萊德　卡羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALDFRIED, CARLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯　建安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, JIANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊辛斯基　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYBCZYNSKI, JAKUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">如本文中所描述，靜電卡盤可至少包含：一第一層；一第二層，其包含一有機材料；一囊封塗層；及一第三層。該第二層位於該第一與第三層之間，使得該第二層之至少一部分不被覆蓋。該囊封塗層覆蓋未被覆蓋之該第二層之至少該部分。該囊封塗層可藉由原子層沈積或藉由化學氣相沈積來形成，使得其至少囊封該第二層之該未覆蓋部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Electrostatic chucks, as described herein, can include at least a first layer, a second layer including an organic material, an encapsulation coating, and a third layer. The second layer is located between the first and third layer such that at least a portion of the second layer is not covered. The encapsulation coating covers at least the portion of the second layer that is not covered. The encapsulation coating can be formed by atomic layer deposition or by chemical vapor deposition such that it encapsulates at least the uncovered portion of the second layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:靜電卡盤</p>
        <p type="p">104:頂部</p>
        <p type="p">106:底部</p>
        <p type="p">108:側</p>
        <p type="p">110:第一層</p>
        <p type="p">112:第二層</p>
        <p type="p">114:有機材料</p>
        <p type="p">116:第三層</p>
        <p type="p">120:囊封塗層</p>
        <p type="p">124:部分</p>
        <p type="p">126:膜</p>
        <p type="p">132:電極層</p>
        <p type="p">134:電極針</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1458" publication-number="202617171">
    <tif-files tif-type="multi-tif">
      <tif file="114123672.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固體分散體以及包含其的組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K38/12</main-classification>
        <further-classification edition="200601120260202B">A61K47/38</further-classification>
        <further-classification edition="200601120260202B">A61K47/20</further-classification>
        <further-classification edition="200601120260202B">A61K9/14</further-classification>
        <further-classification edition="200601120260202B">A61K9/20</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村玲良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南阪本真菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMISAKAMOTO, MANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村和哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中江慎一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAE, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固體分散體，其包含：成分（1），其為選自由式（I）所表示之化合物、及其藥學上容許之鹽以及其等的藥學上容許之溶劑合物所組成之群組的1個或複數個；以及成分（2），其為選自由羥丙基甲基纖維素及其衍生物所組成之群組的1個或複數個的聚合物，並且，成分（1）的總含量每1質量份的成分（2）的總含量為，大於0.1質量份且小於1.0質量份。一種組成物，其包含該固體分散體及烷基硫酸鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1459" publication-number="202617693">
    <tif-files tif-type="multi-tif">
      <tif file="114123674.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備3-甲基硒基丙醛之方法</chinese-title>
        <english-title>PROCESS FOR PREPARING 3-METHYLSELENOPROPANAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C391/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商艾迪索法國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADISSEO FRANCE S.A.S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡契德　馬克西姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUCHEDE, MAXIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛迪爾　麥列尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUDIER, MYLENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢瑞恩　薇薇安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENRYON, VIVIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博塞特　西里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSSET, CYRIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於製備3-甲基硒基丙醛(MSeP)之方法，其特徵在於該方法包含下列步驟：&lt;br/&gt;  a)提供CH&lt;sub&gt;3&lt;/sub&gt;SeLi之一溶液及丙烯醛之一溶液，&lt;br/&gt;  b)混合CH&lt;sub&gt;3&lt;/sub&gt;SeLi之該溶液及丙烯醛之該溶液，以獲得一反應介質，其中該丙烯醛係轉換成MSeP，&lt;br/&gt;  c)任擇地單離及/或純化在該反應介質中依此獲得之MSeP。&lt;br/&gt;  本發明亦關於從依此製備之MSeP製造2-羥基-4-甲基硒基丁酸及硒基甲硫胺酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a process for preparing 3-methylselenopropanal (MSeP), characterized in that it comprises the following steps of:&lt;br/&gt; a) providing a solution of CH&lt;sub&gt;3&lt;/sub&gt;SeLi and a solution of acrolein,&lt;br/&gt; b) mixing the solution of CH&lt;sub&gt;3&lt;/sub&gt;SeLi and the solution of acrolein to obtain a reaction medium in which the acrolein is converted into MSeP,&lt;br/&gt; c) optionally isolating and/or purifying MSeP thus obtained in the reaction medium.&lt;br/&gt; The invention also relates to the manufacture of 2-hydroxy-4-methylselenobutyric acid and selenomethionine from MSeP thus prepared.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1460" publication-number="202619135">
    <tif-files tif-type="multi-tif">
      <tif file="114123679.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃料電池內的整合逆流熱質交換器</chinese-title>
        <english-title>INTEGRATED COUNTER FLOW HEAT AND MASS EXCHANGERS WITHIN FUEL CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260202B">H01M8/02</main-classification>
        <further-classification edition="201601120260202B">H01M8/10</further-classification>
        <further-classification edition="201601120260202B">H01M8/1004</further-classification>
        <further-classification edition="202101120260202B">C25B9/00</further-classification>
        <further-classification edition="200601220260202B">H01M4/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商能源相關裝置公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENERGY RELATED DEVICES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈卡帝　羅伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOCKADAY, ROBERT G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在平面陣列燃料電池內的整合熱質交換器，利用成對的平行逆流通道透過氣體滲透的介電擴散層進行質量和熱交換，以實現空間均勻的熱量和分子輸送。提供燃料電池所需的空間均勻的溫度和濕度環境以及膜控制，以達到最佳效能、燃料效率，並向環境提供有用的熱量和淡化水。減少介面連接，實現系統的印製，提高精確度和可靠性。使系統能更快適應動態負載和環境變化，擴大操作環境範圍，提供更高的效率和效能。應用於向移動和固定系統提供電力，這些系統暴露於廣泛的環境條件和效能需求下，用於加熱、電力供應、燃料生產、冷卻、空氣淨化、水淨化和加濕。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Integration of heat and mass exchangers within planar array fuel cells, using paired parallel counter flow channels to mass exchange and heat exchange via concentration and heat gradients through a gas permeable dielectric diffusion layer for spatially uniform delivery of heat and molecules. Provide the spatially uniform temperature and humidity environment and membrane control needed by fuel cells for optimum performance, fuel efficiency, and delivery of useful heat and desalinated water to the environment. Reduce interface connections and enable printing of the system, greater precision, and reliability. Enable faster adaptation to dynamic loads and the environment, enlarge the operating environment range, provide greater efficiency and performance. Applications to provide power to mobile and stationary systems that are exposed to a wide range of environmental conditions and performance demands for heating, electric power, fuel production, cooling, cleaning air, water purification, and humidification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:氧電極</p>
        <p type="p">102:加濕燃料電池的水電解質流路</p>
        <p type="p">103:氫氣流入</p>
        <p type="p">104:氫氣分流管與熱交換器</p>
        <p type="p">105:新鮮空氣流入</p>
        <p type="p">106:半透膜</p>
        <p type="p">107:半透膜上的冷凝水</p>
        <p type="p">108:冷凝水</p>
        <p type="p">109:排氣</p>
        <p type="p">110:熱交換器排氣管</p>
        <p type="p">111:往加濕膜管路中的液態水電解質</p>
        <p type="p">112:冷凝水</p>
        <p type="p">113:吸附在半透膜外表面的冷凝水</p>
        <p type="p">114:氧電極集電體</p>
        <p type="p">115:燃料電池電解質與介電基板</p>
        <p type="p">116:燃料電池電極</p>
        <p type="p">117:氧燃料電池電極</p>
        <p type="p">118:氫電極集電體</p>
        <p type="p">119:雙向回流分流管：雙蛇形或雙螺旋氧氣分流管</p>
        <p type="p">120:催化加熱床</p>
        <p type="p">121:通往熱交換器排氣管的入口</p>
        <p type="p">122:進出座艙的加熱空氣</p>
        <p type="p">123:噴射腔加熱器</p>
        <p type="p">124:通往催化加熱器的氫氣通道</p>
        <p type="p">125:雙蛇形或螺旋形氫氣分流管</p>
        <p type="p">126:加濕膜管燃料與氣體擴散層</p>
        <p type="p">127:氫電極集電體</p>
        <p type="p">128:電解質</p>
        <p type="p">129:氧燃料電極集電體</p>
        <p type="p">130:進氣熱交換段</p>
        <p type="p">131:具毛細結構與冷凝工作流體的熱管</p>
        <p type="p">132:半透膜管內部的電解質毛細輸送</p>
        <p type="p">133:薄層驅動微閥</p>
        <p type="p">134:電氣導通孔</p>
        <p type="p">135:電解質</p>
        <p type="p">137:冷凝的工作流體</p>
        <p type="p">138:熱管內的高表面積毛細材料</p>
        <p type="p">139:流入空氣分流管的氣流</p>
        <p type="p">140:洩壓微閥</p>
        <p type="p">141:從電解質與氣體擴散層蒸發水分的半透膜</p>
        <p type="p">142:潤濕半透膜的毛細材料</p>
        <p type="p">143:半透膜內的液態電解質</p>
        <p type="p">144:輸送熱量的熱管</p>
        <p type="p">145:冷凝水</p>
        <p type="p">146:缺水電解質出口的管道連接</p>
        <p type="p">147:缺水電解質</p>
        <p type="p">148:可調式再循環電解質流量節流器</p>
        <p type="p">149:新鮮電解質流入</p>
        <p type="p">150:新鮮電解質流入的管道連接</p>
        <p type="p">151:新鮮電解質流入的管道連接</p>
        <p type="p">152:新鮮電解質流入</p>
        <p type="p">153:可調式再循環電解質流量節流器</p>
        <p type="p">154:缺水電解質</p>
        <p type="p">155:缺水電解質出口的管道連接</p>
        <p type="p">156:排氣</p>
        <p type="p">157:空氣流入</p>
        <p type="p">158:半透膜</p>
        <p type="p">159:循環電解質</p>
        <p type="p">160:含氫管道</p>
        <p type="p">161:屏障開口上受濕度與溫度驅動的雙材料薄層致動器</p>
        <p type="p">162:氣流</p>
        <p type="p">163:洩壓閥</p>
        <p type="p">164:排出的氫氣與雜質氣體</p>
        <p type="p">165:熱管內的毛細通道材料</p>
        <p type="p">166:多孔催化床</p>
        <p type="p">167:半透膜</p>
        <p type="p">168:半透膜</p>
        <p type="p">169:屏障開口上受濕度與溫度驅動的雙材料薄層致動器</p>
        <p type="p">170:屏障開口上受濕度與溫度驅動的雙材料薄層致動器</p>
        <p type="p">171:熱管中的冷凝工作流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1461" publication-number="202618049">
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      <tif file="114123686.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>歧管總成、包括歧管總成之反應器系統及用於將氣體混合物供應至反應室之相關聯方法</chinese-title>
        <english-title>MANIFOLD ASSEMBLIES, REACTOR SYSTEMS INCLUDING MANIFOLD ASSEMBLIES, AND ASSOCIATED METHODS FOR SUPPLYING A GAS MIXTURE TO A REACTION CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">C23C16/455</main-classification>
        <further-classification edition="200601120260131B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁婧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WENTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查瓦拉　帕尼特　辛格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAWLA, PARNEET SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬杜里　阿迪亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUDHURY, ADITYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇俊威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, JUNWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪摩斯　亞歷山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMOS, ALEXANDROS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了歧管總成、包括歧管總成之反應器系統，以及採用歧管總成將一氣體混合物供應至一反應室之相關聯方法。所揭露之該等歧管總成包括用於將一第一氣體引入至一歧管主體中之一第一氣體注入口，及用於將一第二氣體引入至該歧管主體中之一第二氣體注入口，以及用於將該第一氣體與該第二氣體混合之一氣室。揭露了包括歧管總成之反應器系統，且揭露了採用一歧管總成將一氣體混合物供應至反應室之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Manifold assemblies, reactor systems including manifold assemblies and associated method for supplying a gas mixture to a reaction chamber employing manifold assemblies are disclosed. The manifold assemblies disclosed include a first gas injection port for introducing a first gas into a manifold body and a second gas injection port for introducing a second gas into the manifold body and a plenum for mixing the first gas and the second gas. Reactor systems including manifold assemblies are disclosed and methods for supplying a gas mixture to reaction chamber employing a manifold assembly are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:歧管總成</p>
        <p type="p">102:中心軸線</p>
        <p type="p">104:歧管主體</p>
        <p type="p">106:孔</p>
        <p type="p">108:第一氣流</p>
        <p type="p">110:第一氣體注入口</p>
        <p type="p">112:第二氣流</p>
        <p type="p">114:氣體混合物流</p>
        <p type="p">116:第二氣體注入口</p>
        <p type="p">118:第一氣體入口通道</p>
        <p type="p">120:第二氣體入口通道</p>
        <p type="p">122:入口塊</p>
        <p type="p">124:混合器塊</p>
        <p type="p">126:傳送塊</p>
        <p type="p">128:入口孔</p>
        <p type="p">130:混合器孔</p>
        <p type="p">132:傳送孔</p>
        <p type="p">134:傳送導管</p>
        <p type="p">136:傳送入口</p>
        <p type="p">138:傳送出口</p>
        <p type="p">H&lt;sub&gt;1&lt;/sub&gt;:高度</p>
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1462" publication-number="202616967">
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        <document-id>
          <doc-number>114123689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於吸菸製品的過濾嘴及包括其的吸菸製品</chinese-title>
        <english-title>FILTER FOR SMOKING ARTICLE, SMOKING ARTICLE HAVING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A24D3/10</main-classification>
        <further-classification edition="200601120260123B">A24D3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KT&amp;G CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珉姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, MIN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇聖鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, SUNG JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬京培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KYENG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁眞哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河成薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鍾喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐昇潼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SEUNG DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴恩英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃永男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YEONG NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於吸菸製品的過濾嘴及包括其的吸菸製品。上述用於吸菸製品的過濾嘴包括過濾嘴部，上述過濾嘴部包括：再生纖維素絲束，包含再生纖維素系纖維；及單分子添加劑，分散於上述再生纖維素絲束中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:吸菸製品</p>
        <p type="p">10:吸菸物質部</p>
        <p type="p">20:過濾嘴部</p>
        <p type="p">30a:吸菸物質部包裝紙</p>
        <p type="p">30b:過濾嘴部包裝紙</p>
        <p type="p">40:菸嘴紙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1463" publication-number="202618353">
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      <tif file="114123691.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618353</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有層間波導結構之光學元件</chinese-title>
        <english-title>OPTICAL DEVICES WITH INTERLAYER WAVEGUIDE STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G02B6/12</main-classification>
        <further-classification edition="200601120260116B">G02B6/122</further-classification>
        <further-classification edition="200601120260116B">G02B6/13</further-classification>
        <further-classification edition="200601120260116B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉福斯　伊莉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAFFOSSE, ELISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          </inventor>
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              <chinese-name name-type="organization">
                <last-name>楊子蛟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZIJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅晉欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, JINXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包含光學元件。該光學元件包含：第一元件部分，對應於第一金屬化層級，包含位於第一平面上的至少第一導電線；第二元件部分，對應於第二金屬化層級，包含位於不同於第一平面的第二平面上的至少第二導電線；以及第一波導，包含位於第一平面與第二平面之間的第三平面上的第一內核。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes an optical device. The optical device includes a first device section corresponding to a first metallization level including at least a first conductive line located at a first plane, a second device section corresponding to a second metallization level including at least a second conductive line located at a second plane different from the first plane, and a first waveguide including a first inner core located at a third plane between the first plane and the second plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200A:元件</p>
        <p type="p">202A:基板</p>
        <p type="p">210A:元件部分</p>
        <p type="p">212A:介電層</p>
        <p type="p">213A:內核</p>
        <p type="p">215A:阻障層</p>
        <p type="p">216A:通孔</p>
        <p type="p">218A:導電線</p>
        <p type="p">220A:元件部分</p>
        <p type="p">222A:加襯結構</p>
        <p type="p">224A:內核</p>
        <p type="p">225A:阻障層</p>
        <p type="p">226A:通孔</p>
        <p type="p">228A:導電線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1464" publication-number="202619421">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123706</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H05K1/05</main-classification>
        <further-classification edition="200601120260126B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本貴士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹岡良介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAOKA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板1具備金屬支持層2、第1絕緣層3、端子41、及散熱層6。第1絕緣層3包括聚醯亞胺，且吸水率為0.40%以上。散熱層6相對於第1絕緣層3配置於端子41之相反側，且配置於金屬支持層2與第1絕緣層3之間。散熱層6與金屬支持層2及第1絕緣層3該兩者接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線電路基板</p>
        <p type="p">2:金屬支持層</p>
        <p type="p">3:第1絕緣層</p>
        <p type="p">4:導體圖案</p>
        <p type="p">5:第2絕緣層</p>
        <p type="p">6:散熱層</p>
        <p type="p">41:端子</p>
        <p type="p">42:配線</p>
        <p type="p">411:第1導體層</p>
        <p type="p">412:第2導體層</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1465" publication-number="202617635">
    <tif-files tif-type="multi-tif">
      <tif file="114123710.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反應性氣體之再利用方法及再利用系統</chinese-title>
        <english-title>REUSE METHOD AND REUSE SYSTEM FOR REACTIVE GAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C04B41/66</main-classification>
        <further-classification edition="200601120260126B">C23C16/56</further-classification>
        <further-classification edition="200601120260126B">B01D53/38</further-classification>
        <further-classification edition="200601120260126B">H01L21/321</further-classification>
        <further-classification edition="200601120260126B">F01K25/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野義宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成田裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARITA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種反應性氣體之再利用方法，從電子零件之製造步驟中使用反應性氣體的化學反應處理的結果所排出之含有使用完畢而未反應的反應性氣體的使用完畢氣體，將該使用完畢而未反應的反應性氣體分離回收，並利用該化學反應處理將所分離回收後之該使用完畢而未反應的反應性氣體再利用。將使用所分離回收後之該使用完畢而未反應的反應性氣體的前段處理與採用未使用的反應性氣體的後段處理予以組合作為該化學反應處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reuse method for a reactive gas wherein, when separating and recovering used unreacted reactive gas from a used gas containing the used unreacted reactive gas discharged as a result of chemical reaction processing that uses the reactive gas in a production process for electronic componentry, and then reusing the separated and recovered used unreacted reactive gas in the chemical reaction processing, the chemical reaction processing combines a preprocess using the separated and recovered used unreacted reactive gas and a postprocess using unused reactive gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:化學反應處理部</p>
        <p type="p">11,MFC1~16:質流控制器</p>
        <p type="p">12,B1~B16:閥</p>
        <p type="p">13,131~134:腔室</p>
        <p type="p">20:使用完畢氣體收集，分配部</p>
        <p type="p">21,211~214:排氣真空泵浦</p>
        <p type="p">22,221~224:切換閥</p>
        <p type="p">23,231~234:分析計</p>
        <p type="p">30:分離回收部</p>
        <p type="p">31:回收氣體接收槽</p>
        <p type="p">32:回收裝置</p>
        <p type="p">33:回收氣體槽</p>
        <p type="p">40:除害處理部</p>
        <p type="p">41:排氣氣體接收槽</p>
        <p type="p">42:除害裝置</p>
        <p type="p">43:除害出口槽</p>
        <p type="p">44:排水處理裝置</p>
        <p type="p">100:系統</p>
        <p type="p">EG:使用完畢氣體</p>
        <p type="p">L1~L4:新供給管線</p>
        <p type="p">L5~L12:供給管線</p>
        <p type="p">L13~L16:再利用供給管線</p>
        <p type="p">L17~L24:排氣管線</p>
        <p type="p">L25~L28:回收管線</p>
        <p type="p">L29~L32:除害管線</p>
        <p type="p">PG1,PG2:沖洗用氣體</p>
        <p type="p">RG,RG1,RG2:反應性氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1466" publication-number="202618220">
    <tif-files tif-type="multi-tif">
      <tif file="114123718.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>實作使用圖案化基板離散有效介質折射率分析而生成的特徵</chinese-title>
        <english-title>IMPLEMENTING FEATURES GENERATED USING DISCRETE EFFECTIVE MEDIUM REFRACTIVE ANALYSIS OF PATTERNED SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G01B11/24</main-classification>
        <further-classification edition="200601120260116B">G01N21/25</further-classification>
        <further-classification edition="200601120260116B">G01N21/41</further-classification>
        <further-classification edition="200601120260116B">G01N21/88</further-classification>
        <further-classification edition="200601120260116B">G01N21/95</further-classification>
        <further-classification edition="201901120260116B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯蘭拉希姆　伊曼賽拉芬妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISLAM RAHIM, IMAAN SERAPHINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　湯瑪斯河霏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, THOMAS HO FAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰卡瑞恩　瓦魯揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKARIAN, VAROUJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝昭釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHAOZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃里克森　布萊克Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERICKSON, BLAKE W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括由至少一個處理裝置獲取與圖案化基板相關的光譜資料，然後由該處理裝置使用離散有效介質折射率分析（DEMRA）來分析該圖案化基板從光譜資料生成一組特徵，並由該處理裝置使用機器學習模型處理該組特徵，以從該組特徵預測該圖案化基板的至少一個特性。該組特徵包括一組擬合參數，對應於經驗模型，該模型將與圖案化基板相關的至少一個有效折射率指數與入射到圖案化基板上的光的波長相關聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes obtaining, by at least one processing device, spectral data associated with a patterned substrate, generating, by the at least one processing device from the spectral data, a set of features using discrete effective medium refractive analysis (DEMRA) of the patterned substrate, and processing, by the at least one processing device, the set of features using a machine learning model to predict at least one characteristic of the patterned substrate from the set of features. The set of features includes a set of fitted parameters corresponding to an empirical model that relates at least one effective index of refraction associated with the patterned substrate to a wavelength of light incident on the patterned substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:圖示</p>
        <p type="p">510:基板</p>
        <p type="p">520-1:層</p>
        <p type="p">520-2:層</p>
        <p type="p">520-3:層</p>
        <p type="p">525:孔隙</p>
        <p type="p">530:氣氛</p>
        <p type="p">540:入射光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1467" publication-number="202619044">
    <tif-files tif-type="multi-tif">
      <tif file="114123722.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含整合裝置及金屬化部分的封裝</chinese-title>
        <english-title>PACKAGE COMPRISING INTEGRATED DEVICE AND A METALLIZATION PORTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L23/00</main-classification>
        <further-classification edition="200601120260126B">H01L23/31</further-classification>
        <further-classification edition="200601120260126B">H01L23/36</further-classification>
        <further-classification edition="200601120260126B">H01L25/00</further-classification>
        <further-classification edition="202301120260126B">H01L25/065</further-classification>
        <further-classification edition="202301120260126B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史東　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　艷梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YANMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　建文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JIANWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，其包含：一金屬化部分；一整合裝置，其包含複數個柱互連件，其中該整合裝置透過該複數個柱互連件耦接至該金屬化部分；及一囊封層，其至少部分地囊封該整合裝置，其中該囊封層耦接至該金屬化部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising a metallization portion; an integrated device comprising a plurality of pillar interconnects, wherein the integrated device is coupled to the metallization portion through the plurality of pillar interconnects; and an encapsulation layer at least partially encapsulating the integrated device, wherein the encapsulation layer is coupled to the metallization portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:囊封層</p>
        <p type="p">114:焊料互連件</p>
        <p type="p">202:金屬化部分</p>
        <p type="p">203:墊互連件</p>
        <p type="p">205:整合裝置</p>
        <p type="p">206:鈍化層</p>
        <p type="p">207:凸塊下金屬化互連件；凸塊金屬化互連件</p>
        <p type="p">209:柱互連件</p>
        <p type="p">220:介電層</p>
        <p type="p">222:金屬化互連件</p>
        <p type="p">223:柱體互連件</p>
        <p type="p">503:墊互連件</p>
        <p type="p">505:整合裝置</p>
        <p type="p">506:鈍化層</p>
        <p type="p">509:焊料互連件</p>
        <p type="p">600:封裝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1468" publication-number="202617138">
    <tif-files tif-type="multi-tif">
      <tif file="114123731.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去癌達溶液醫藥製劑</chinese-title>
        <english-title>CABAZITAXEL SOLUTION PHARMACEUTICAL PREPARATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/337</main-classification>
        <further-classification edition="200601120260202B">A61K9/08</further-classification>
        <further-classification edition="200601120260202B">A61K47/26</further-classification>
        <further-classification edition="200601120260202B">A61K47/10</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田眞也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於去癌達(Cabazitaxel)的溶液醫藥製劑，其為去癌達的無乙醇且能直接輸液稀釋的製劑，並且保存穩定性優異。詳細而言，本發明係關於去癌達溶液醫藥製劑，其為包含去癌達作為有效成分之溶液醫藥製劑，並包含聚山梨醇酯、選自聚乙二醇及/或丙二醇之二醇溶劑以及有機酸，將前述溶液醫藥製劑以水進行稀釋，去癌達濃度為0.1mg/mL的溶液的pH為大於3.5且5.5以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an ethanol-free Cabazitaxel solution preparation that can be directly diluted for infusion and exhibits excellent storage stability. More specifically, the present invention provides a Cabazitaxel solution pharmaceutical preparation including Cabazitaxel as the active ingredient, and also includes a polysorbate, a glycol solvent selected from polyethylene glycol and/or propylene glycol, and an organic acid. When this solution pharmaceutical preparation is diluted with water to a Cabazitaxel concentration of 0.1 mg/mL, the pH of the resulting solution is greater than 3.5 and less than or equal to 5.5.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1469" publication-number="202617889">
    <tif-files tif-type="multi-tif">
      <tif file="114123732.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提升生物基配方中相容性之功能化植物油基四級胺</chinese-title>
        <english-title>FUNCTIONALIZED PLANT OIL-BASED QUATERNARY AMINES FOR ENHANCED MISCIBILITY IN BIOBASED FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C08L91/00</main-classification>
        <further-classification edition="200601120260129B">C09D175/04</further-classification>
        <further-classification edition="200601120260129B">C09D191/00</further-classification>
        <further-classification edition="200601120260129B">C09J175/04</further-classification>
        <further-classification edition="200601120260129B">C09J191/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商生物黏合劑股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOBOND ADHESIVES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特　理查　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HART, RICHARD E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種改質之植物油基四級胺，具有在生物基配方中提升之相容性，亦包含製造該改質植物油基四級胺之方法、使用該改質植物油基四級胺之方法，以及包含及/或衍生自該改質植物油基四級胺之產品。該改質植物油基四級胺具有足夠之相容性，可用於作用於多種材料之塗層及膠合劑中，包含陶瓷、玻璃、混凝土、木材、金屬、鍍鋅及未鍍鋅鋼、磁磚、紙類包裝材料、複合材料、紡織品及塑膠。此外，由於該改質植物油基四級胺為一種生物來源材料，該塗層及膠合劑可由總含量為24%至95%之生物基材料所組成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modified plant oil-based quaternary amine with enhanced miscibility in biobased formulations, as well as methods of making the modified plant oil-based quaternary amine, methods of using the modified plant oil-based quaternary amine, and products incorporating and/or derived from the modified plant oil-based quaternary amine. The modified plant oil-based quaternary amine has sufficient miscibility to be useful in coatings and adhesives acting on many materials including ceramic, glass, concrete, wood, metal, galvanized &amp;amp; ungalvanized steel, tile, paper packaging, composites, textile, and plastic. Further, as the modified plant oil-based quaternary amine is a biologically derived material, the coatings and adhesives may be composed of bio-based material(s) totaling from 24% to 95%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1470" publication-number="202618010">
    <tif-files tif-type="multi-tif">
      <tif file="114123764.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無方向性電磁鋼板之製造方法及無方向性電磁鋼板</chinese-title>
        <english-title>METHOD OF MANUFACTURING NON-ORIENTED ELECTRICAL STEEL SHEET AND NON-ORIENTED ELECTRICAL STEEL SHEET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C21D8/12</main-classification>
        <further-classification edition="200601120260202B">C22C38/00</further-classification>
        <further-classification edition="200601120260202B">C22C38/14</further-classification>
        <further-classification edition="200601120260202B">C22C38/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商努可爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUCOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤勇人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山茂宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, SHIGEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保智幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUBO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田明男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙島稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKASHIMA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村井剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水藤政人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUITO, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多田睦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, CHIKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加洛　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALLO, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬納斯　布拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONAS, BRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉爾森　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARSON, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">無方向性電磁鋼板之製造方法，包含精鍊步驟、連續鑄造步驟、搬運步驟、熱壓延步驟、熱壓延板退火步驟、冷壓延步驟與最終退火步驟，且板坯之成分組成，為C：0.0050質量%以下、Si：2.00~4.50質量%、Mn：2.00質量%以下、Al：2.50質量%以下、Ti：0.0100質量%以下、P：0.20質量%以下、N：0.0050質量%以下、O：0.0050質量%以下、S：0.0030質量%以下，將由式(1)所算出的Ti碳氮化物之平衡析出溫度設為T0(℃)、熱壓延步驟中的熱壓延之開始溫度設為T1(℃)時，T0及T1滿足式(2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1471" publication-number="202617597">
    <tif-files tif-type="multi-tif">
      <tif file="114123817.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123817</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜用碳片、薄膜及薄膜用碳片的製造方法</chinese-title>
        <english-title>CARBON SHEET FOR PELLICLE, PELLICLE AND METHOD FOR MANUFACTURING OF THE CARBON SHEET FOR PELLICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260130B">C01B32/16</main-classification>
        <further-classification edition="201201120260130B">G03F1/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商奧爽樂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AWEXOME RAY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭謹洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, KEUNSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮拜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔智元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金世勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIHM, SE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種薄膜用碳片，所述薄膜用碳片包括由多個碳奈米管構成的束狀物，且孔隙率P對線密度D（[公克/千米]）的比率（P/D）處於0.2至10的範圍內，並且提供了一種薄膜及一種薄膜用碳片的製造方法，所述薄膜用碳片是自立式的且對紫外線具有優異的透射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a carbon sheet for pellicle that includes a bundle composed of a plurality of carbon nanotubes, and a ratio (P/D) of porosity P to linear density D ([g/km]) is in a range of 0.2 to 10, and provided is a pellicle and a method of manufacturing a carbon sheet for pellicle that is free-standing and have an excellent transmittance against UV rays.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:薄膜</p>
        <p type="p">110:碳片</p>
        <p type="p">120:薄膜框架</p>
        <p type="p">200:光遮罩</p>
        <p type="p">200P:遮罩圖案</p>
        <p type="p">300:透鏡</p>
        <p type="p">400:基板</p>
        <p type="p">L:光源</p>
        <p type="p">PR:光阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1472" publication-number="202619551">
    <tif-files tif-type="multi-tif">
      <tif file="114123830.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙極性接面型電晶體</chinese-title>
        <english-title>BIPOLAR JUNCTION TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D64/23</main-classification>
        <further-classification edition="200601120260123B">H01L23/528</further-classification>
        <further-classification edition="202501120260123B">H10D10/01</further-classification>
        <further-classification edition="202501120260123B">H10D10/40</further-classification>
        <further-classification edition="202501120260123B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商達爾科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIODES INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫特　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTT, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑞德　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JERRED, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴利　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RILEY, LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙極性接面型電晶體(BJT)，其包括：一半導體區；及複數個金屬觸點，其等定位於該半導體區之一頂部表面上，其中該複數個金屬觸點包括與一或多個發射極區接觸之一或多個第一金屬觸點及與該半導體區之一主體區之一上表面接觸之一或多個第二金屬觸點。一或多個絕緣結構定位於該半導體區之一頂部表面上，其中該等絕緣結構將該一或多個第一金屬觸點與該一或多個第二金屬觸點隔離。一金屬層定位於該等絕緣結構上方，其中該金屬層與一或多個第一金屬觸點接觸且藉由該等絕緣結構與該一或多個第二金屬觸點隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bipolar junction transistor (BJT) comprising a semiconductor region and a plurality of metal contacts, located on a top surface of the semiconductor region, where the plurality of metal contacts comprise one or more first metal contacts that are in contact with one or more emitter regions and one or more second metal contacts that are in contact with an upper surface of a body region of the semiconductor region. One or more insulating structures are located on a top surface of the semiconductor region, where the insulating structures isolate the one or more first metal contacts from the one or more second metal contacts. A metal layer is located over the insulating structures, where the metal layer is in contact with one or more first metal contacts and is isolated from the one or more second metal contacts by the insulating structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:集電極區/集電極層</p>
        <p type="p">2:漂移區/漂移層</p>
        <p type="p">3:主體區/基極區</p>
        <p type="p">4:發射極接觸區/發射極區</p>
        <p type="p">5:絕緣區</p>
        <p type="p">6A:第一金屬觸點/發射極電極/金屬接觸區/發射極觸點/發射極連接</p>
        <p type="p">6B:第二金屬觸點/基極電極/基極觸點/基極金屬觸點/基極連接</p>
        <p type="p">7:介電區/層間介電質</p>
        <p type="p">8:金屬接觸層/金屬層/上金屬層/頂部金屬片/頂部發射極金屬層</p>
        <p type="p">9:金屬層</p>
        <p type="p">100:裝置/雙極性接面型電晶體晶片/半導體晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1473" publication-number="202617925">
    <tif-files tif-type="multi-tif">
      <tif file="114123840.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>浸入式冷卻單元、介電工作流體在浸入式冷卻單元的浴槽中的用途以及對電子組件進行冷卻的方法</chinese-title>
        <english-title>IMMERSION COOLING UNIT, USE OF DIELECTRIC WORKING FLUID IN BATH OF IMMERSION COOLING UNIT, AND METHOD OF COOLING ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K5/10</main-classification>
        <further-classification edition="200601120260202B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商德紅公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEHON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德紅　克里斯托夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEHON, CHRISTOPHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒孔特　勞拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LECOMTE, LAURA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種浸入式冷卻單元（1），所述浸入式冷卻單元（1）包括：浸入池，界定內部空腔（3）；浴槽（5），包括部分地填充內部空腔的介電工作流體及氣相以形成雙相系統；所述單元（1）更包括：冷凝裝置，在內部空腔中定位於電子組件上方以不浸入介電工作流體中；以及至少一個電子組件（7），完全地或至少部分地浸入所述浴槽（5）中；所述單元（1）的顯著特點在於，介電工作流體包含全氟-4-甲基-2-戊烯並且氣相包括至少20%的濕度水準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an immersion cooling unit (1) comprising an immersion cell defining an internal cavity (3), a bath (5) comprising a dielectric working fluid partially filling the internal cavity and a gaseous phase so as to form a two-phase system; the unit (1) further comprising a condensation device which is positioned in the internal cavity above the electronic component so as not to be immersed in the dielectric working fluid and at least one electronic component (7) which is totally or at least partially immersed in said bath (5); the unit (1) is remarkable in that the dielectric working fluid comprises perfluoro-4-methyl-2-pentene and in that the gaseous phase comprises a humidity level of at least 20%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單元/冷卻單元/浸入式冷卻單元</p>
        <p type="p">3:內部空腔</p>
        <p type="p">5:浴槽</p>
        <p type="p">7:電子組件</p>
        <p type="p">9:冷凝裝置</p>
        <p type="p">11、13:散熱器</p>
        <p type="p">15:空氣循環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1474" publication-number="202617985">
    <tif-files tif-type="multi-tif">
      <tif file="114123852.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎反轉錄酶及其用途</chinese-title>
        <english-title>NOVEL REVERSE TRANSCRIPTASES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N15/10</main-classification>
        <further-classification edition="200601120260202B">C12N9/12</further-classification>
        <further-classification edition="200601120260202B">C12N9/22</further-classification>
        <further-classification edition="200601120260202B">C12N15/62</further-classification>
        <further-classification edition="200601120260202B">C12N15/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商生命編輯治療學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIFEEDIT THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾索　德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELSO, DREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEUL, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉梅奇　莉蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMECH, LILIAN T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內瑟理　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NETHERY, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施沃切特　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWOCHERT, TIMOTHY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供用於結合於所關注目標序列之組合物及方法。該等組合物可用於經由聚合酶編輯來編輯所關注之目標序列。該等組合物包含：反轉錄酶（RT）（及編碼其之聚核苷酸）；DNA結合多肽（及編碼其之聚核苷酸）；聚合酶編輯器（PE）增強多肽（及編碼其之聚核苷酸）；包含RT及異源多肽之融合蛋白，其中該異源多肽可包括DNA結合多肽及PE增強多肽；包含RT及DNA結合多肽，視情況進一步包括PE增強多肽之聚合酶編輯器（PE）（或編碼PE之任何或所有組分的一種或多種聚核苷酸）；以及包含PE及一種或多種聚合酶編輯引導RNA（PEgRNA）的PE系統（或編碼其之聚核苷酸）。亦提供包含該等聚核苷酸之載體及宿主細胞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions and methods for binding to a target sequence of interest are provided. The compositions find use in editing a target sequence of interest via polymerase editing. Compositions comprise: reverse transcriptases (RTs) (and polynucleotides encoding the same); DNA-binding polypeptides (and polynucleotides encoding the same); polymerase editor (PE)-enhancing polypeptides (and polynucleotides encoding the same); fusion proteins comprising an RT and a heterologous polypeptide, where the heterologous polypeptide can include a DNA-binding polypeptide and a PE-enhancing polypeptide; polymerase editors (PEs) comprising an RT and a DNA-binding polypeptide, optionally further including a PE-enhancing polypeptide (or one or more polynucleotides encoding any or all components of the PE); and PE systems comprising the PEs and one or more polymerase editing guide RNAs (PEgRNAs) (or polynucleotide(s) encoding the same). Vectors and host cells comprising the polynucleotides are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1475" publication-number="202616961">
    <tif-files tif-type="multi-tif">
      <tif file="114123858.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有香辛料的巧克力基材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A23G1/48</main-classification>
        <further-classification edition="200601120260202B">A23G1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOTTE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮫島一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMESHIMA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美克朗克陽子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMIKRANK, YOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松倉有里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKURA, YUURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題在於提供能感受到香辛料的香味，且香辛料的刺激感經減少的巧克力等。又，課題在於提供在含有香辛料的巧克力等中，維持香辛料的香味，且減少香辛料的刺激感的方法。提供包含香辛料且體積平均直徑未滿20μm的含有香辛料的巧克力基材、包含該含有香辛料的巧克力基材的含有香辛料的巧克力，及巧克力加工品。提供減少含有香辛料的巧克力基材刺激感的方法，該方法包括使該巧克力基材之原料組成物進行微粒化而將體積平均直徑作成未滿20μm的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1476" publication-number="202617073">
    <tif-files tif-type="multi-tif">
      <tif file="114123864.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連續分析物監測儀</chinese-title>
        <english-title>CONTINUOUS ANALYTE MONITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61B5/145</main-classification>
        <further-classification edition="200601120260123B">A61B5/1486</further-classification>
        <further-classification edition="201801120260123B">G16H50/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商羅氏糖尿病照護公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHE DIABETES CARE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛克瑞奇　賴瑞　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOCKRIDGE, LARRY LEWIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利伯特　賈斯汀　布萊特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYBBERT, JUSTIN BRETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡地歐　米契爾　艾倫　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CADIO, MICHEL ALAIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎寧安　亞倫　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUNNINGHAM, AARON PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷比爾　康納　雅各布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KREHBIEL, CONNOR JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹森　漢斯　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENSEN, HANS P</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林蘭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係涉及一種連續分析物監測裝置，其包括感測器及電基板。該感測器具有 (i) 包括至少一個電極的活體內部分，以及 (ii) 從該活體內部分延伸且包括可操作地連接至該至少一個電極之至少一個電觸點的離體部分。該電基板包括至少一個基座部分及從該至少一個基座部分延伸的至少一個可撓性部分。該至少一個基座部分係相對於該連續分析物監測裝置的殼體固定地安裝。該至少一個可撓性部分包括第一接觸墊。該至少一個可撓性部分係可相對於該至少一個基座部分移動以抵靠該離體部分，使得該電基板使該至少一個可撓性部分偏壓抵靠該離體部分之第一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A continuous analyte monitor device includes a sensor and an electrical substrate. The sensor has (i) an in vivo portion including at least one electrode, and (ii) an ex vivo portion extending from the in vivo portion and including at least one electrical contact operably connected to the at least one electrode. The electrical substrate includes at least one base portion and at least one flexible portion extending from the at least one base portion. The at least one base portion is fixedly mounted relative to a housing of the continuous analyte monitor device. The at least one flexible portion includes a first contact pad. The at least one flexible portion is movable relative to the at least one base portion against the ex vivo portion, such that the electrical substrate biases the at least one flexible portion against a first side of the ex vivo portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:CAM裝置</p>
        <p type="p">128:收發器</p>
        <p type="p">132:記憶體</p>
        <p type="p">134:電池</p>
        <p type="p">136:感測器</p>
        <p type="p">138:電基板</p>
        <p type="p">140:處理器</p>
        <p type="p">144:殼體</p>
        <p type="p">148:活體內部分</p>
        <p type="p">152:離體部分</p>
        <p type="p">156:電極</p>
        <p type="p">168:接收表面</p>
        <p type="p">174:感測器開口</p>
        <p type="p">178:支撐件</p>
        <p type="p">184:通道</p>
        <p type="p">204:第一基座部分</p>
        <p type="p">208:第二基座部分</p>
        <p type="p">210:下殼體外殼</p>
        <p type="p">214:上殼體外殼</p>
        <p type="p">240:通道方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1477" publication-number="202617601">
    <tif-files tif-type="multi-tif">
      <tif file="114123867.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一氧化碳氣體之製造方法及移送方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260202B">C01B32/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友精化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO SEIKA CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平岡良介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAOKA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田弘樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田冴子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, SAEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種一氧化碳氣體之製造方法，其包括將一氧化碳氣體從第1容器通過金屬配管移送至第2容器之移送步驟。在移送步驟中，將金屬配管內的一氧化碳氣體的單位面積流量設為A（NL/min/m&lt;sup&gt;2&lt;/sup&gt;）時，以A的常用對數logA成為-1～5的方式移送一氧化碳氣體，並且金屬配管的長度為0.5～100m，內徑為0.5～30mm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第1容器</p>
        <p type="p">20:金屬配管</p>
        <p type="p">30:第2容器</p>
        <p type="p">40:壓縮機</p>
        <p type="p">50:流量計</p>
        <p type="p">60:氣體供給設備</p>
        <p type="p">100:一氧化碳氣體的製造設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1478" publication-number="202618296">
    <tif-files tif-type="multi-tif">
      <tif file="114123883.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查裝置</chinese-title>
        <english-title>INSPECTION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">G01R1/067</main-classification>
        <further-classification edition="202001120260119B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田勝男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUTA, KATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤友和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤純一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, JUNICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實現能夠高精度地測定檢查中的被檢查體的表面溫度。  　　本發明是一種檢查裝置，係使被檢查體的電極端子與導電性接觸子接觸，以在測試儀與被檢查體之間進行電性連接，並檢查被檢查體的檢查裝置，其特徵為具備：被檢查體支持部，其支持被檢查體；紅外線受光部，其至少以被檢查體作為溫度測定對象物，對前述被檢查體所放射之紅外線進行受光；及溫度測量裝置，其具有基於來自紅外線受光部的紅外線，轉換成溫度測定對象物之溫度的溫度轉換功能，被檢查體支持部在被檢查體支持部的周緣區域或周緣附近具有黑體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢查裝置</p>
        <p type="p">10:溫度測量裝置</p>
        <p type="p">12:光纖</p>
        <p type="p">13:測試頭</p>
        <p type="p">14:探針卡</p>
        <p type="p">15:探針組裝體</p>
        <p type="p">16:紅外線受光部</p>
        <p type="p">17:探針</p>
        <p type="p">18:電性連接單元</p>
        <p type="p">20:被檢查體</p>
        <p type="p">30:黑體</p>
        <p type="p">40:夾具</p>
        <p type="p">41:黑體載置部</p>
        <p type="p">50:探針台</p>
        <p type="p">51:θ軸平台</p>
        <p type="p">52:Z軸平台</p>
        <p type="p">53:Y軸平台</p>
        <p type="p">54:X軸平台</p>
        <p type="p">101:溫度轉換部</p>
        <p type="p">102:溫度修正部</p>
        <p type="p">103:溫度顯示部</p>
        <p type="p">131:夾具溫度感測器</p>
        <p type="p">132:黑體載置部溫度感測器</p>
        <p type="p">133:溫度訊號收授部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1479" publication-number="202618920">
    <tif-files tif-type="multi-tif">
      <tif file="114123887.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽蝕刻期間的鈍化</chinese-title>
        <english-title>PASSIVATION DURING SILICON ETCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H01L21/3065</main-classification>
        <further-classification edition="200601120260116B">H01J37/32</further-classification>
        <further-classification edition="202501120260116B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈登　瑪德蓮　派克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORDON, MADELEINE PARKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口　直志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, MARK NAOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供利用由蝕刻氣體混合物及添加劑產生之蝕刻電漿蝕刻矽及/或鍺材料(相對於對比材料)的方法及設備。該方法包括利用由蝕刻氣體混合物及作為添加劑之矽鹵化物氣體產生的蝕刻電漿蝕刻多晶矽(相對於氧化物材料)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatuses for etching silicon and/or germanium material relative to a contrast material using an etching plasma generated from an etching gas mixture and an additive are provided herein. Methods include etching polysilicon relative to oxide material using an etching plasma generated from an etching gas mixture and a silicon halide gas as an additive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">190:操作</p>
        <p type="p">192:操作</p>
        <p type="p">193:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1480" publication-number="202617319">
    <tif-files tif-type="multi-tif">
      <tif file="114123898.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123898</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖案化基板上的穿基板通孔形成</chinese-title>
        <english-title>THROUGH SUBSTRATE VIA FORMATION ON PATTERNED SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260123B">B23K26/382</main-classification>
        <further-classification edition="201401120260123B">B23K26/402</further-classification>
        <further-classification edition="200601120260123B">C23C14/02</further-classification>
        <further-classification edition="200601120260123B">C23C14/14</further-classification>
        <further-classification edition="200601120260123B">G03F7/16</further-classification>
        <further-classification edition="200601320260123B">B23K103/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉福斯　伊莉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAFFOSSE, ELISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾森　查爾斯湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLSON, CHARLES THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏恩特　馬文路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERNT, MARVIN LOUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了處理基板的方法。在某些實施例中，一種處理基板的方法包含：從基板的背面到基板的正面形成穿通孔開口，該基板具有安置於基板的正面上的正面金屬互連，該等正面金屬互連透過穿通孔開口暴露；以及填充穿通孔開口以形成通孔，以及在基板的背面上形成背面金屬互連，其中背面金屬互連透過穿通孔電氣耦接至正面金屬互連。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of processing a substrate are provided herein. In some embodiments, a method for processing a substrate includes: forming through via openings in a substrate from a back side of the substrate to a front side of the substrate, the substrate having front side metal interconnects disposed on the front side of the substrate that are exposed by the through via openings; and filling the through via openings to form through vias and forming back side metal interconnects on the back side of the substrate, wherein the back side metal interconnects are electrically coupled to the front side metal interconnects by the through vias.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:方法</p>
        <p type="p">104:方法</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1481" publication-number="202617344">
    <tif-files tif-type="multi-tif">
      <tif file="114123903.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板滑移偵測</chinese-title>
        <english-title>SUBSTRATE SLIP DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260119B">B24B37/005</main-classification>
        <further-classification edition="201201120260119B">B24B37/10</further-classification>
        <further-classification edition="201201120260119B">B24B37/30</further-classification>
        <further-classification edition="200601120260119B">B24B49/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　浩權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, JUSTIN H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　迪芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PON, DEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JEONGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及在化學機械研磨（CMP）過程中偵測基板是否滑移的方法。在一或多個實施例中，拋光系統還包括平臺組件，該平臺組件可能包括：設置在平臺上的拋光墊、配置用於旋轉平臺的平臺馬達，並且可能包括平臺馬達編碼器，以及配置用於偵測在拋光過程中生成平臺馬達扭矩所需的平臺馬達電流量的平臺馬達感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method of detecting whether a substrate has slipped during a chemical mechanical polishing (CMP) process. In one or more embodiments, a polishing system also includes a platen assembly may include: a polishing pad disposed over a platen, a platen motor that is configured to rotate the platen and may include a platen motor encoder, and a platen motor sensor configured to detect an amount of platen motor current required to generate a platen motor torque during a polishing process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302:操作</p>
        <p type="p">304:操作</p>
        <p type="p">306:操作</p>
        <p type="p">308:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1482" publication-number="202618333">
    <tif-files tif-type="multi-tif">
      <tif file="114123911.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高折射率膜的製造方法、具有高折射率膜之光學部件的製造方法、高折射率膜及具有高折射率膜的光學部件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260202B">G02B1/10</main-classification>
        <further-classification edition="202301120260202B">H10K50/854</further-classification>
        <further-classification edition="202301120260202B">H10K59/95</further-classification>
        <further-classification edition="202301120260202B">H10K71/00</further-classification>
        <further-classification edition="201501220260202B">G02B1/111</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木貴志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井香太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供能夠透過溼式處理來提升折射率之高折射率膜的製造方法、具有高折射率膜之光學部件的製造方法。本發明係關於高折射率膜的製造方法，其包含：微粒子分散膜形成工序，形成包含金屬氧化物微粒子的微粒子分散膜；以及溼式處理工序，於透過前述微粒子分散膜形成工序形成的微粒子分散膜之上塗布包含鈦氧烷（titanoxane）的液體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1483" publication-number="202617192">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>敷層基材及敷層基材的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61L2/232</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村挙子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TAKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明渡純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKEDO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田陽一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田剛慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, TAKEJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">〈課題〉提供具有優異的抗病毒性、抗菌性之敷層基材的製造方法與藉此獲得的敷層基材。〈解決手段〉敷層基材具有基材與敷蓋於基材之表面的界面活性劑，其中構成界面活性劑的元素在基材之表面上與源自基材的元素以共價鍵鍵結。共價鍵選自由碳―碳之共價鍵、碳―氮之共價鍵及碳―氧之共價鍵而成之群組。具有縮二胍系結構的化合物之類似物係洛赫西定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:敷層基材</p>
        <p type="p">101:基材</p>
        <p type="p">102:界面活性劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1484" publication-number="202618028">
    <tif-files tif-type="multi-tif">
      <tif file="114123915.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於具有大臨界尺寸的圖案之快速碳栓塞填充</chinese-title>
        <english-title>FAST CARBON PLUGFILL FOR PATTERNS WITH LARGE CRITICAL DIMENSIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C23C16/04</main-classification>
        <further-classification edition="200601120260119B">C23C16/26</further-classification>
        <further-classification edition="200601120260119B">C23C16/509</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳立華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　智昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JI HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼拉姆拉朱　巴拉蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEELAMRAJU, BHARATI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美諾　卡斯克蘇瑞希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENON, KARTHIKSURESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉亞南　拉賈雷姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARAYANAN, RAJARAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫許魯須薩　派瑞尚特庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULSHRESHTHA, PRASHANT KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班傑明拉吉　戴米安拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENJAMIN RAJ, DAEMIAN RAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河盛元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在某些實施例中，一種方法包含將基板結構定位至製程腔室的處理空間中，以及將烴前驅物以約400sccm至約800sccm的前驅物流速流入處理腔室的處理空間中，以提供沉積物種。該方法進一步包含將蝕刻氣體以約0.1sccm至約250sccm的蝕刻氣體流動速率流入處理腔室的處理空間中，以提供蝕刻物種。該方法進一步包含向處理空間提供約700W至約1500W的高頻射頻（HFRF）電源，以在處理腔室的處理空間中產生RF電漿。該方法進一步包含在基板結構的表面上形成基於碳的栓塞填充層，以及在基板結構的特徵內形成基於碳的栓塞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a method includes positioning a substrate structure into a processing volume of a process chamber and flowing a hydrocarbon precursor into the processing volume of the processing chamber at a precursor flow rate of about 400 sccm to about 800 sccm to provide a deposition species. The method further includes flowing an etchant gas into the processing volume of the processing chamber at an etchant gas flow rate of about 0.1 sccm to about 250 sccm to provide a etchant species. The method further includes providing a high frequency radio frequency (HFRF) power of about 700 W to about 1500 W to the processing volume to generate a RF plasma in the processing volume of the processing chamber. The method further includes forming a carbon based plugfill layer over the surface of the substrate structure and a carbon based plug within the feature of the substrate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:特徵</p>
        <p type="p">304:側壁</p>
        <p type="p">320:基於碳的栓塞填充層</p>
        <p type="p">324a:區域</p>
        <p type="p">324b:厚度</p>
        <p type="p">326b:栓塞高度</p>
        <p type="p">328:間隙</p>
        <p type="p">400b:裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1485" publication-number="202617276">
    <tif-files tif-type="multi-tif">
      <tif file="114123919.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連續材料流的分類及揀選</chinese-title>
        <english-title>CLASSIFYING AND SORTING A STREAM OF CONTIGUOUS MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B07C5/34</main-classification>
        <further-classification edition="200601120260126B">B07C5/36</further-classification>
        <further-classification edition="200601120260126B">B65G47/26</further-classification>
        <further-classification edition="200601120260126B">B03B9/06</further-classification>
        <further-classification edition="200601120260126B">B65G43/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商索特拉科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SORTERA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉維斯　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEVERS, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝瑞　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERRY, JACOB JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特里　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARTLEY, KYLE THOMAS KOKJER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍瑞爾　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORRELL, NICHOLAS XAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小嘉西亞　曼紐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA, JR.,MANUEL GERARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科迪克　凱利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORDZIK, KELLY KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於對連續的材料流內的材料進行分類、評估及揀選的系統及方法。對材料流的區段進行分類和評估，無論這些區段是構成整個材料件或物料件的一部分。接著根據分類和評估來執行揀選。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for classifying, evaluating, and sorting materials within a contiguous stream of materials. Segments of the material stream are classified and evaluated, whether such segments make up a whole material piece or a portion of a material piece. The sorting is then performed as a function of the classifications and evaluations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1500:系統和程序(系統和方法)</p>
        <p type="p">1501:程序塊</p>
        <p type="p">1502:程序塊</p>
        <p type="p">1503:程序塊</p>
        <p type="p">1504:程序塊</p>
        <p type="p">1505:程序塊</p>
        <p type="p">1506:程序塊</p>
        <p type="p">1507:程序塊</p>
        <p type="p">1508:程序塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1486" publication-number="202618400">
    <tif-files tif-type="multi-tif">
      <tif file="114123935.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴組件</chinese-title>
        <english-title>HEAD WORN ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">G02B27/01</main-classification>
        <further-classification edition="200601120260125B">A42B3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＢＡＥ系統公營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE SYSTEMS PLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥爾斯　洛里湯馬斯亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLS, RORY THOMAS ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊德利　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRADLEY, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示有一種頭戴組件，包含：可佩戴框架；可選擇地附接之護目鏡組件，用於安裝在框架；磁性緊固件，分佈於框架與護目鏡組件之間，且被偏置以將護目鏡組件固持在此框架；護目鏡組件包含至少兩個輪廓特徵，此框架包含用於至少兩個輪廓特徵的每一個之物理往復運動特徵，當框架及護目鏡組件係在操作對齊條件中時，至少兩個輪廓特徵的每一個穩定地佔據其各自之往復運動特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is disclosed a head worn assembly comprising: a wearable frame; a selectively attachable visor assembly for mounting at the frame; a magnetic fastener distributed between the frame and visor assembly, and biased to hold the visor assembly at the frame; the visor assembly comprising at least two profiled features, the frame comprising a physically reciprocating feature for each of the at least two profiled features, the each of the at least two profiled features stably occupying its respective reciprocating feature when the frame and visor assembly are in an operational alignment condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:框架</p>
        <p type="p">21:輪廓特徵</p>
        <p type="p">22:輪廓特徵</p>
        <p type="p">23:輪廓特徵</p>
        <p type="p">24:表面</p>
        <p type="p">30:磁性緊固件</p>
        <p type="p">32:磁性元件</p>
        <p type="p">34:鐵磁性元件</p>
        <p type="p">40:護目鏡</p>
        <p type="p">41:輪廓特徵</p>
        <p type="p">42:輪廓特徵</p>
        <p type="p">43:輪廓特徵</p>
        <p type="p">44:載體構件</p>
        <p type="p">45:框架鄰接表面</p>
        <p type="p">46:第一合成器</p>
        <p type="p">47:隆起線</p>
        <p type="p">48:第二合成器眼罩</p>
        <p type="p">49:合成器孔</p>
        <p type="p">100:頭戴組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1487" publication-number="202617182">
    <tif-files tif-type="multi-tif">
      <tif file="114123942.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用莫蘇妥珠單抗皮下給藥作為單藥療法或與來那度胺組合治療癌症之方法</chinese-title>
        <english-title>METHODS OF TREATING CANCER USING SUBCUTANEOUS DOSING OF MOSUNETUZUMAB AS A MONOTHERAPY OR IN COMBINATION WITH LENALIDOMIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K39/395</main-classification>
        <further-classification edition="200601120260202B">A61K31/454</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔西　山謬爾　迪恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRACY, SAMUEL DEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王爵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班登　布蘭登　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENDER, BRENDAN CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　以夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷賽尼　伊拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSSEINI, IRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　奇中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐海爾　卡羅　伊萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'HEAR, CAROL ELAINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比歐多　朱利安納　馬克斯　拉格拉斯塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONDO, JULIANA MARQUES LAGRASTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚　乃舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, NAI SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費林　伊安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLINN, IAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏克　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURKE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, MICHAEL CHING-SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　孟山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MEI SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關　安東尼亞　樸　月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAN, ANTONIA PUI-YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟　泳君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUN, YONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及治療患有 CD20 陽性細胞增生性病症 (例如，B 細胞增生性病症，諸如非何杰金氏淋巴瘤或慢性淋巴球性白血病) 的個體。更具體而言，本發明係有關藉由皮下投予莫蘇妥珠單抗作為單藥療法或與來那度胺組合來治療患有 B 細胞增生性病症的個體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the treatment of subjects having CD20-positive cell proliferative disorders (e.g., B cell proliferative disorders, such as non-Hodgkin’s lymphomas or chronic lymphocytic leukemia). More specifically, the invention pertains to the treatment of subjects having a B cell proliferative disorder by subcutaneous administration of mosunetuzumab as a monotherapy or in combination with lenalidomide.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1488" publication-number="202617723">
    <tif-files tif-type="multi-tif">
      <tif file="114123957.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細胞週期蛋白依賴性激酶抑制劑</chinese-title>
        <english-title>CYCLIN-DEPENDENT KINASE INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D487/04</main-classification>
        <further-classification edition="200601120260202B">C07D519/00</further-classification>
        <further-classification edition="200601120260202B">C07D471/04</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61K31/55</further-classification>
        <further-classification edition="200601120260202B">A61K31/53</further-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里納　卡琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRINER, KARIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約瑟夫　薩揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOSEPH, SAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮菲斯特　凱斯　布魯斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFISTER, KEITH BRUCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮尼亞　微微克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUNIYAR, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　特洛伊　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, TROY DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元　強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　曉芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XIAOYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查克利　佛瑞德利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZECRI, FREDERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於抑制細胞週期蛋白依賴性激酶、如CDK2（細胞週期蛋白依賴性激酶2或細胞分裂蛋白激酶2）和CDK4（細胞週期蛋白依賴性激酶4或細胞分裂蛋白激酶4）的化合物，並且關於用於製備所述化合物之方法、包含所述化合物的藥物組成物以及所述化合物在治療由CDK2和/或CDK4介導的病症、疾病和障礙中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to compounds which inhibit Cyclin-Dependent Kinases such as CDK2 (Cyclin-Dependent Kinase 2 or Cell Division protein Kinase 2) and CDK4 (Cyclin-Dependent Kinase 4 or Cell Division protein Kinase 4), and to processes for the preparation of said compounds, pharmaceutical compositions comprising said compounds, and use of said compounds in the treatment of conditions, diseases and disorders mediated by CDK2 and/or CDK4.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1489" publication-number="202619204">
    <tif-files tif-type="multi-tif">
      <tif file="114123965.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260123B">H01R13/6582</main-classification>
        <further-classification edition="200601120260123B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商友華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOWO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器，係具備：第一連接器部，係具有第一連接導體及至少部分地位於前述第一連接導體之周圍的第一屏蔽導體；第二連接器部，係具有第二連接導體及至少部分地位於前述第二連接導體之周圍的第二屏蔽導體；及屏蔽連接導體；前述第一連接器部、前述第二連接器部及前述屏蔽連接導體係構成為：可將前述第一連接導體、前述第二連接導體、前述第一屏蔽導體及前述第二屏蔽導體以使前述第一連接導體及前述第二連接導體相互電性連接、且使前述第一屏蔽導體及前述第二屏蔽導體經由前述屏蔽連接導體而相互電性連接的狀態配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector includes: a first connector portion having a first connecting conductor and a first shielding conductor disposed at least partially around the first connecting conductor; a second connector portion having a second connecting conductor and a second shielding conductor disposed at least partially around the second connecting conductor; and a shield connecting conductor. The first connector portion, the second connector portion and the shield connecting conductor are configured to allow the first connecting conductor, the second connecting conductor, the first shielding conductor and the second shielding conductor to be arranged in a state in which the first connecting conductor and the second connecting conductor are electrically connected to each other, and the first shielding conductor and the second shielding conductor are electrically connected to each other via the shield connecting conductor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連接器</p>
        <p type="p">24:第一平坦板</p>
        <p type="p">34:第二平坦板</p>
        <p type="p">100:第一連接器部</p>
        <p type="p">102:第一中心軸</p>
        <p type="p">110:第一連接銷</p>
        <p type="p">112:筒體</p>
        <p type="p">114:柱塞</p>
        <p type="p">116:第一突起部</p>
        <p type="p">120:第一屏蔽外殼</p>
        <p type="p">122:第一屏蔽緊固軸</p>
        <p type="p">122a:貫通孔</p>
        <p type="p">124:第一屏蔽凸緣</p>
        <p type="p">126:第一屏蔽凸台</p>
        <p type="p">130:第一屏蔽緊固具</p>
        <p type="p">140:第一絕緣體</p>
        <p type="p">142:第一絕緣芯體</p>
        <p type="p">144:第一絕緣延伸體</p>
        <p type="p">150:第一密封件</p>
        <p type="p">200:第二連接器部</p>
        <p type="p">202:第二中心軸</p>
        <p type="p">210:第二連接銷</p>
        <p type="p">212:軸部</p>
        <p type="p">214:寬幅部</p>
        <p type="p">216:第二突起部</p>
        <p type="p">220:第二屏蔽外殼</p>
        <p type="p">222:第二屏蔽緊固軸</p>
        <p type="p">224:第二屏蔽凸緣</p>
        <p type="p">226:第二屏蔽凸台</p>
        <p type="p">230:第二屏蔽緊固具</p>
        <p type="p">240:第二絕緣體</p>
        <p type="p">242:第二絕緣芯體</p>
        <p type="p">244:第二絕緣延伸體</p>
        <p type="p">250:第二密封件</p>
        <p type="p">300:屏蔽連接銷</p>
        <p type="p">302:基端部</p>
        <p type="p">304:柱部</p>
        <p type="p">310:屏蔽線圈彈簧</p>
        <p type="p">400:第一基板</p>
        <p type="p">500:第二基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1490" publication-number="202617704">
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          <doc-number>202617704</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芳香環類化合物、其製備方法及其在醫藥上的應用</chinese-title>
        <english-title>AROMATIC COMPOUND, PREPARATION METHOD THEREOF AND PHARMACEUTICAL USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D401/14</main-classification>
        <further-classification edition="200601120260202B">A61K31/55</further-classification>
        <further-classification edition="200601120260202B">A61K31/4709</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
        <further-classification edition="200601120260202B">A61P9/10</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費洪博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI, HONGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蔡華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CAIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及芳香環類化合物、其製備方法及其在醫藥上的應用。具體而言，本揭露涉及一種通式(I)所示的芳香環類化合物、其製備方法及含有該類化合物的醫藥組成物以及其作為治療劑的用途，特別是作為Nav抑制劑的用途和其在製備治療和/或減輕疼痛和疼痛相關疾病的藥物中的用途。其中通式(I)中各基團如說明書中所定義。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="204px" width="263px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an aromatic compound, preparation method thereof and pharmaceutical use thereof. Specifically, the present disclosure relates to an aromatic compound represented by general formula (I), a preparation method thereof, a pharmaceutical composition comprising same, and pharmaceutical use thereof, particularly, use thereof as a Nav inhibitor and use thereof in preparing a medicarment for treating and/or alleviating pain and a pain-related disease. Groups in general formula (I) are as defined in the description.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="197px" width="287px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1491" publication-number="202617594">
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        <document-id>
          <doc-number>114123981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳／矽－碳複合體、其製造方法、包含其之負極活性物質及全固態電池</chinese-title>
        <english-title>CARBON/SILICON-CARBON COMPOSITE, PROCESSES FOR PREPARING THE SAME, ANODE ACTIVE MATERIAL AND ALL-SOLID-STATE BATTERY COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260119B">C01B32/05</main-classification>
        <further-classification edition="200601120260119B">C01B33/021</further-classification>
        <further-classification edition="200601120260119B">H01M4/38</further-classification>
        <further-classification edition="201001120260119B">H01M4/587</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓國科學技術院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO HEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全孝鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HYOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
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                <last-name>任城甲</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>IM, SUNG GAP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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              <chinese-name name-type="organization">
                <last-name>姜旼廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MINJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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              <chinese-name name-type="organization">
                <last-name>金相賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANGHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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              <chinese-name name-type="organization">
                <last-name>崔健優</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHOI, KEONWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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                <last-name>平謹榕</last-name>
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              <address>臺北市</address>
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        <p type="p">本發明涉及一種碳/矽-碳複合體及其製造方法。根據本發明之實施例之碳/矽-碳複合體具有優異之碳薄膜厚度均一性，且應用於電池時具有優異之導電度，並可緩解因矽之體積膨脹所產生之應力，且可表現出優異之容量維持率，並可發揮優異之循環壽命效果。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
        <p type="p">100:碳薄膜</p>
        <p type="p">200:載置部</p>
        <p type="p">300:流入口</p>
        <p type="p">400:流出口</p>
        <p type="p">500:加熱部</p>
        <p type="p">1000:反應器</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1492" publication-number="202617595">
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        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳／矽–無機層複合體、其製造方法、包含其之負極活性物質及全固態電池</chinese-title>
        <english-title>CARBON/SILICON-INORGANIC COMPOSITE, PROCESSES FOR PREPARING THE SAME, ANODE ACTIVE MATERIAL AND ALL-SOLID-STATE BATTERY COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260202B">C01B32/05</main-classification>
        <further-classification edition="200601120260202B">C01B33/027</further-classification>
        <further-classification edition="200601120260202B">H01M4/02</further-classification>
        <further-classification edition="200601120260202B">H01M4/36</further-classification>
        <further-classification edition="200601120260202B">H01M4/38</further-classification>
        <further-classification edition="201001120260202B">H01M4/587</further-classification>
        <further-classification edition="201001120260202B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓國科學技術院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO HEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全孝鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HYOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任城甲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, SUNG GAP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜旼廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MINJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金相賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANGHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔健優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, KEONWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明涉及一種碳/矽-無機層複合體及其製造方法。根據本發明之一實施例之碳/矽-無機層複合體，於碳/矽複合體之表面形成無機層，透過去除矽之Si-H部位與懸掛鍵（dangling bond）部位，可降低氣體生成，並應用於鋰二次電池之負極活性物質或全固態電池之SEI（Solid Electrolyte Interphase）形成時，透過減少與電解質之副反應，可提升初始庫倫效率（ICE）。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:多孔性碳載體</p>
        <p type="p">20:矽</p>
        <p type="p">30:無機層</p>
        <p type="p">100:碳/矽-無機層複合體</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1493" publication-number="202618278">
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        <document-id>
          <doc-number>114123991</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>藥物研發支援裝置、藥物研發支援裝置的作動方法、藥物研發支援裝置的作動程式以及評價方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01N33/50</main-classification>
        <further-classification edition="200601120260202B">G01N33/48</further-classification>
        <further-classification edition="200601120260202B">G01N33/483</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白石泰士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAISHI, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺絵里子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, ERIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三好隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYOSHI, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">一種藥物研發支援裝置，其具備處理器，處理器進行如下處理：獲取包括局部電場電位之神經細胞的細胞外電位的測量資料；及依據局部電場電位之頻率帶中的強度篩選真同步爆發和偽同步爆發。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
        <p type="p">43:篩選條件</p>
        <p type="p">65:PSD圖表</p>
        <p type="p">66:功率譜密度PSD的柵格圖</p>
        <p type="p">PSD:功率譜密度</p>
        <p type="p">THD:臨界值密度</p>
        <p type="p">THP2:臨界值比例</p>
        <p type="p">THT:臨界值時間</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1494" publication-number="202617153">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＭＮＫ抑制劑之固態分散體調配物</chinese-title>
        <english-title>SOLID DISPERSION FORMULATIONS OF MNK INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/506</main-classification>
        <further-classification edition="200601120260202B">A61K47/38</further-classification>
        <further-classification edition="200601120260202B">A61K47/10</further-classification>
        <further-classification edition="200601120260202B">A61K9/20</further-classification>
        <further-classification edition="200601120260202B">A61K9/48</further-classification>
        <further-classification edition="200601120260202B">A61K9/14</further-classification>
        <further-classification edition="200601120260202B">A61P25/06</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商4Ｅ治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>4E THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩恩　詹姆斯　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHN, JAMES J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德　瑞恩　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDER, RYAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供MNK抑制劑之非晶形固態分散體組成物及調配物，以及其用於治療MNK相關疾病、病症及病狀的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides amorphous solid dispersion compositions and formulations of MNK inhibitors, as well as uses thereof for the treatment of MNK-associated diseases, disorders, and conditions.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1495" publication-number="202617772">
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      <tif file="114124007.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617772</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124007</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＣＤ７９ｂ抗體藥物接合物</chinese-title>
        <english-title>ANTI-CD79B ANTIBODY DRUG CONJUGATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">C07D491/22</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
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                <last-name>美商艾伯維有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>ABBVIE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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                <last-name>貝萊爾　大衛　葛雷哥瑞</last-name>
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                <last-name>BELAIR, DAVID GREGORY</last-name>
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              <chinese-name name-type="organization">
                <last-name>艾瑟拉珍　卡莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZERADJENE, KAMEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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                <last-name>季　承</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>JI, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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                <last-name>麥可克魯斯奇　安德魯　傑佛瑞</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>MCCLUSKEY, ANDREW JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CA</english-country>
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              <chinese-name name-type="organization">
                <last-name>萊麗　蕾琴娜　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REILLY, REGINA M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任思遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, SIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>托烏　黛博拉　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOUW, DEBRA S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　瑪雷里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLKE, MALERIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖　玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本揭露係關於抗CD79b抗體及包含該抗體的抗CD79b抗體藥物接合物（抗CD79b ADC），其中抗CD79b ADC進一步包含拓撲異構酶1抑制劑(Top1i)藥物作為有效負載。本揭露進一步關於一種方法，其使用此類抗CD79b ADC，用於治療B細胞非霍奇金氏淋巴瘤(B-NHL)、瀰漫性大B細胞淋巴瘤(DLBCL)、伯基特氏淋巴瘤(Burkitt’s lymphoma)、被套細胞淋巴瘤及濾泡淋巴瘤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to anti-CD79b antibodies and anti-CD79b antibody drug conjugates (anti-CD79b ADCs) comprising thereof, where the anti-CD79b ADCs further comprise a topoisomerase 1 inhibitor (Top1i) drug as a payload. The present disclosure further relates to methods of using such anti-CD79b ADCs for treating B-cell non-Hodgkin lymphoma (B-NHL), diffuse large B cell lymphoma (DLBCL), Burkitt’s lymphoma, mantle cell lymphoma, and follicular lymphoma.</p>
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      </representative-img>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124008</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽基板與具有鈣鈦礦型構造之化合物之薄膜之積層體、以及具有該積層體之磁性記憶體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01F10/22</main-classification>
        <further-classification edition="202301120260202B">H10B61/00</further-classification>
        <further-classification edition="202301120260202B">H10N50/10</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>地方獨立行政法人神奈川縣立產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>東正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZUMA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重松圭</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SHIGEMATSU, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可於室溫下利用電場進行資訊之寫入及讀取，且使用聚集於矽基板上之多鐵性物質之磁性記憶體元件及磁性記憶體裝置。本發明之積層體係矽基板與具有鈣鈦礦型構造之式(1)所表示之化合物之薄膜之積層體。  &lt;br/&gt;BiFe&lt;sub&gt;1-x&lt;/sub&gt;A&lt;sub&gt;x&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; (1)  &lt;br/&gt;(式(1)中，A選自由Co及Mn所組成之群，x滿足0.05≦x≦0.25)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:矽基板</p>
        <p type="p">2:下部電極</p>
        <p type="p">3:薄膜</p>
        <p type="p">4:上部電極</p>
        <p type="p">5,6:緩衝層</p>
        <p type="p">10:磁性記憶體元件</p>
        <p type="p">20:讀取部</p>
        <p type="p">E:電壓</p>
        <p type="p">M:磁化方向</p>
      </representative-img>
    </description>
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          <doc-number>114124024</doc-number>
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        <chinese-title>用於基因體編輯之經修飾之嚮導ＲＮＡ</chinese-title>
        <english-title>MODIFIED GUIDE RNAS FOR GENOME EDITING</english-title>
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        <main-classification edition="200601120260202B">C12N15/11</main-classification>
        <further-classification edition="201001120260202B">C12N15/113</further-classification>
        <further-classification edition="200601120260202B">C12N9/22</further-classification>
        <further-classification edition="200601120260202B">A61K31/7088</further-classification>
        <further-classification edition="200601120260202B">A61P9/00</further-classification>
        <further-classification edition="200601120260202B">A61P3/00</further-classification>
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              <chinese-name name-type="organization">
                <last-name>美商英特利亞醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELLIA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>莫雷帕帝　薩賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULEPATI, SABIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>歐莉維拉　瑞恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLIVEIRA, RUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>BR</english-country>
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              <chinese-name name-type="organization">
                <last-name>迪威維迪　維維克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DWIVEDI, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IN</english-country>
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              <chinese-name name-type="organization">
                <last-name>卡拉卡　蓋梅姿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARACA, GAMZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>康裘莉亞　阿提　馬亨德拉　布拉科許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANJOLIA, ARTI MAHENDRA PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IN</english-country>
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          <inventor app-type="applicant" sequence="6">
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              <chinese-name name-type="organization">
                <last-name>達斯　崔夏</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>DAS, TRISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IN</english-country>
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              <chinese-name name-type="organization">
                <last-name>曼尼　海雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANEY, HAYLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>布恩斯　尚恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURNS, SEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於在基因體編輯方法中具有改良之活體外及活體內活性的經修飾之嚮導RNA。在一些實施例中，本揭露提供了用於修飾PCSK9基因之組合物及方法。在一些態樣中，本揭露提供了一種嚮導RNA、其組合物以及包含如本文所述之嚮導RNA或組合物之醫藥組合物。在一些態樣中，本揭露亦提供了使用如本文所述之嚮導RNA、其組合物或醫藥組合物之用途及方法，其用於誘導PCSK9基因中之雙股斷裂或單股斷裂、用於減少細胞或個體中PCSK9基因之表現以及用於治療患有PCSK9相關疾病或疾患或處於患有該疾病或疾患之風險下的患者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to modified guide RNAs having improved in vitro and in vivo activity in genome editing methods. In some embodiments, the present disclosure provides compositions and methods for modifying a PCSK9 gene. In some aspects, the present disclosure provides a guide RNA, compositions thereof, and pharmaceutical compositions comprising a guide RNA or a composition as described herein. In some aspects, the present disclosure also provides uses and methods of using a guide RNA, a composition thereof, or a pharmaceutical composition as described herein, for inducing a double-strand break or a single-strand break in a PCSK9 gene, for reducing expression of a PCSK9 gene in a cell or subject, and for treating a patient having or at risk of having a PCSK9-related disease or condition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1498" publication-number="202619482">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H10B12/00</main-classification>
        <further-classification edition="202501120260123B">H10D1/68</further-classification>
        <further-classification edition="202501120260123B">H10D62/13</further-classification>
        <further-classification edition="202501120260123B">H10D64/23</further-classification>
        <further-classification edition="202501120260123B">H10D64/27</further-classification>
        <further-classification edition="202501120260123B">H10D64/62</further-classification>
        <further-classification edition="202501120260123B">H10D84/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宰浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金燦爛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BITNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張誠桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊貴福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GUIFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭舜旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SOONWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括主動圖案，延伸在第一水平方向中並包含第一源極/汲極區、第二源極/汲極區以及在第一和第二源極/汲極區之間的通道區，第一源極/汲極區包含第一區和在通道區和第一區之間的第二區，金屬半導體化合物層在主動圖案的第一源極/汲極區的第一區上，位元線延伸在垂直方向中並接觸主動圖案，以及閘極電極垂直地重疊主動圖案的通道區的至少部分並延伸在第二水平方向中，第二水平方向相交第一水平方向，其中第一區在第一水平方向中的第一長度大於第二區在第一水平方向中的第二長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes an active pattern extending in a first horizontal direction and including a first source/drain region, a second source/drain region and a channel region between the first and second source/drain regions, the first source/drain region including a first region and a second region between the channel region and the first region, a metal-semiconductor compound layer on the first region of the first source/drain region of the active pattern, a bit line extending in a vertical direction and contacting the active pattern, and a gate electrode vertically overlapping at least a portion of the channel region of the active pattern and extending in a second horizontal direction, the second horizontal direction intersecting the first horizontal direction, wherein a first length of the first region in the first horizontal direction is greater than a second length of the second region in the first horizontal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:半導體裝置</p>
        <p type="p">101:基底</p>
        <p type="p">110:主動圖案</p>
        <p type="p">120:金屬半導體化合物層</p>
        <p type="p">140:閘極介電層</p>
        <p type="p">142:閘極電極</p>
        <p type="p">144:閘極頂蓋層</p>
        <p type="p">150:絕緣結構</p>
        <p type="p">152:第一絕緣圖案</p>
        <p type="p">154:第二絕緣圖案</p>
        <p type="p">156:第三絕緣圖案</p>
        <p type="p">160:位元線</p>
        <p type="p">163:第一導電層</p>
        <p type="p">164:第二導電層</p>
        <p type="p">165:接觸結構</p>
        <p type="p">170:電容器結構</p>
        <p type="p">171:第一電極</p>
        <p type="p">172:第二電極</p>
        <p type="p">173:電容器介電質</p>
        <p type="p">175:板電極</p>
        <p type="p">180:接觸插塞</p>
        <p type="p">A:區域</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1499" publication-number="202617714">
    <tif-files tif-type="multi-tif">
      <tif file="114124041.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三環稠雜環類PDE3/4雙重抑制劑關鍵中間體的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/04</main-classification>
        <further-classification edition="200601120260202B">C07D217/26</further-classification>
        <further-classification edition="200601120260202B">C07D217/04</further-classification>
        <further-classification edition="200601120260202B">C07C233/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商遼寧海思科製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAONING HAISCO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭軍輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JUNHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊代勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DAISHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆元強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, YUANQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮烈江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, LIEJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YIFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋世鏵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, SHIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竇贏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOU, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種三環稠雜環類PDE3/4雙重抑制劑關鍵中間體（式（I））的製備方法，該方法反應路線新穎，反應條件溫和，操作簡單，反應產率高，產品純度高，後處理方便，適合於工業化生產。  &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="185px" file="ed10058.JPG" alt="ed10058.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1500" publication-number="202619460">
    <tif-files tif-type="multi-tif">
      <tif file="114124043.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲葉遼太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INABA, RYOUTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本潤一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係一種電子裝置(10)，其具備：安裝有發熱零件(18)之印刷基板(12)、收容印刷基板之殼體(14)。於印刷基板設有至少一部分面向殼體之外側的安裝零件(20)，於殼體之內面設有熱傳導材料(16)。從發熱零件發出之熱經由熱傳導材料而傳遞至安裝零件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">12:印刷基板</p>
        <p type="p">14:殼體</p>
        <p type="p">16:熱傳導材料</p>
        <p type="p">18:發熱零件</p>
        <p type="p">20:安裝零件</p>
        <p type="p">22:連接器</p>
        <p type="p">24:連接器</p>
        <p type="p">26:埠</p>
        <p type="p">28:外殼</p>
        <p type="p">30:埠</p>
        <p type="p">32:外殼</p>
        <p type="p">34:基底構件</p>
        <p type="p">36:蓋構件</p>
        <p type="p">38:背面</p>
        <p type="p">40:零件面</p>
        <p type="p">42:蓋本體</p>
        <p type="p">46:發熱零件之面</p>
        <p type="p">48:第1孔</p>
        <p type="p">50:第2孔</p>
        <p type="p">52:第1端部</p>
        <p type="p">54:第2端部</p>
        <p type="p">56:彎曲部</p>
        <p type="p">58:安裝零件之面</p>
        <p type="p">60:安裝零件之面</p>
        <p type="p">62:第1熱傳導片</p>
        <p type="p">64:第2熱傳導片</p>
        <p type="p">66:第3熱傳導片</p>
        <p type="p">68:第3熱傳導片</p>
        <p type="p">X:方向</p>
        <p type="p">X1:方向</p>
        <p type="p">X2:方向</p>
        <p type="p">Z:方向</p>
        <p type="p">Z1:方向</p>
        <p type="p">Z2:方向</p>
        <p type="p">IV-IV:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1501" publication-number="202618297">
    <tif-files tif-type="multi-tif">
      <tif file="114124044.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>尖端長度校正裝置與方法及探針系統</chinese-title>
        <english-title>DEVICE AND METHOD FOR TIP LENGTH CALIBRATION AND PROBE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01R1/067</main-classification>
        <further-classification edition="200601120260123B">G01R31/28</further-classification>
        <further-classification edition="200601120260123B">G01R35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺矽科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MPI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏廷安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, TING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁博翊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, PO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐育壎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉斯曼　塞巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIESSMANN, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種尖端長度校正裝置與方法及探針系統。該尖端長度校正裝置包括一基座、一位置調整機構以及一目標偵測模組。位置調整機構與目標偵測模組設置於基座上，位置調整機構經配置以將一探針組件移動至一感測區域內，且目標偵測模組經配置以判斷探針組件的一尖端部是否存在感測區域內，從而可獲得一經校正的尖端長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tip length calibration device, a probe system including the same, a tested semiconductor device, a method for producing the same, a method for tip length calibration, and a method for testing an unpackaged semiconductor device. The tip length calibration device includes a base, a position adjusting mechanism, and a target detection module. The position adjusting mechanism and the target detection module are disposed on the base. The position adjusting mechanism is configured to move the probe assembly to a sensing region, and the target detection module is configured to determine whether a tip portion of the probe assembly is present in the sensing region, such that a calibrated tip length can be acquired.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:尖端長度校正裝置</p>
        <p type="p">11:基座</p>
        <p type="p">111:校正平台</p>
        <p type="p">12:位置調整機構</p>
        <p type="p">121:第一位移組件</p>
        <p type="p">122:第二位移組件</p>
        <p type="p">123:第三位移組件</p>
        <p type="p">124:安裝板</p>
        <p type="p">13:目標偵測模組</p>
        <p type="p">131:光發射器</p>
        <p type="p">132:光接收器</p>
        <p type="p">133:調光部件</p>
        <p type="p">134:放大器</p>
        <p type="p">2:探針組件</p>
        <p type="p">21:固持部件</p>
        <p type="p">22:探針</p>
        <p type="p">23:非接觸式感測器</p>
        <p type="p">d1:第一方向</p>
        <p type="p">d2:第二方向</p>
        <p type="p">d3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1502" publication-number="202617162">
    <tif-files tif-type="multi-tif">
      <tif file="114124059.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>凍乾及冷凍ＭＲＮＡ－ＬＮＰ調配物</chinese-title>
        <english-title>LYOPHILIZED AND FROZEN MRNA-LNP FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/7088</main-classification>
        <further-classification edition="202501120260202B">A61K9/127</further-classification>
        <further-classification edition="200601120260202B">A61K47/10</further-classification>
        <further-classification edition="200601120260202B">A61K47/32</further-classification>
        <further-classification edition="200601120260202B">A61K9/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻　君皖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHUN-WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張豐鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FENG-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>範俁辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YUCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係涉及包含核酸 (NA)-脂質奈米顆粒 (LNP) 顆粒之凍乾及冷凍藥物調配物，其中該 NA-LNP 顆粒包含包封於脂質奈米顆粒中的核酸，其中該調配物進一步包含賦形劑，該賦形劑包含凍乾保護劑或冷凍保護劑及緩衝液，且其中該凍乾保護劑或冷凍保護劑為聚乙烯吡咯烷酮 (PVP) 或聚乙二醇 (PEG)。亦提供了製備該凍乾及冷凍調配物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to lyophilized and frozen pharmaceutical formulations comprising a nucleic acid (NA)-lipid nanoparticle (LNP) particle, wherein the NA-LNP particle comprises a nucleic acid encapsulated in the lipid nanoparticle, wherein the formulation further comprises an excipient comprising a lyoprotectant or cryoprotectant and a buffer, and wherein the lyoprotectant or cryoprotectant is a polyvinylpyrrolidone (PVP) or a polyethylene glycol (PEG). Methods of making the lyophilized and frozen formulations are also provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1503" publication-number="202618043">
    <tif-files tif-type="multi-tif">
      <tif file="114124069.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124069</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>前驅物輸送管線熱管理用的技法</chinese-title>
        <english-title>TECHNIQUES FOR THERMAL MANAGEMENT OF A PRECURSOR DELIVERY LINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C23C16/44</main-classification>
        <further-classification edition="200601120260121B">C23C16/448</further-classification>
        <further-classification edition="200601120260121B">C23C16/455</further-classification>
        <further-classification edition="200601120260121B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷斯　馬文　克萊頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREES, MARVIN CLAYTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瑪　戴維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, DAVINDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派　烏迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, UDAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王塞納克運　潘亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONGSENAKHUM, PANYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂文斯　卡特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEVENS, CARTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達瑪索　查理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAMASO, CHARLIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板處理系統，其具有基板處理腔室；以及透過至少五米長之流動管線與其流體耦接的安瓿，該流動管線包括由第一材料形成並與熱控制裝置熱耦合之至少一金屬輸送管。該基板處理系統配置成使安瓿中所含之至少一部分液體或固體前驅物進入氣態，並使所得前驅物蒸氣通過流動管線輸送至基板處理腔室。該熱控制裝置配置成將沿流動管線之溫度保持在第一溫度與第二溫度之間，第一溫度高於前驅物蒸氣的凝結溫度，且第二溫度高於第一溫度不超過10°C。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing system having a substrate processing chamber; and an ampoule, fluidically coupled therewith by a flow line having a length of at least five meters, the flow line including at least one metal delivery tube, formed from a first material, and thermally coupled with a thermal control arrangement. The substrate processing system is configured to cause at least a portion of a liquid or solid precursor contained in the ampoule to enter a gaseous state, and to deliver resulting precursor vapor through the flow line to the substrate processing chamber. The thermal control arrangement is configured to maintain temperatures along the flow line between a first temperature and a second temperature, the first temperature being higher than a condensation temperature of the precursor vapor and the second temperature being no greater than 10°C higher than the first temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:前驅物輸送系統</p>
        <p type="p">102:流量控制器</p>
        <p type="p">106:閥</p>
        <p type="p">108:閥</p>
        <p type="p">118:流動管線</p>
        <p type="p">128:處理腔室、製程腔室</p>
        <p type="p">160:控制器</p>
        <p type="p">1000:安瓿</p>
        <p type="p">1100:外殼</p>
        <p type="p">1103:區域</p>
        <p type="p">1104:前驅物</p>
        <p type="p">1200:控制閥裝置</p>
        <p type="p">1202:入口閥</p>
        <p type="p">1204:旁通閥</p>
        <p type="p">1206:出口閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1504" publication-number="202617417">
    <tif-files tif-type="multi-tif">
      <tif file="114124073.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617417</doc-number>
        </document-id>
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          <doc-number>114124073</doc-number>
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        <chinese-title>用於基於波導之顯示器之波導光柵黏合劑及基於波導之顯示器之製造方法</chinese-title>
        <english-title>WAVEGUIDE GRATING ADHESIVES FOR WAVEGUIDE-BASED DISPLAYS AND METHODS OF MANUFACTURING THEREOF</english-title>
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        <main-classification edition="200601120260123B">B29D11/00</main-classification>
        <further-classification edition="200601120260123B">G02B6/124</further-classification>
        <further-classification edition="200601120260123B">G02B5/18</further-classification>
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                <first-name></first-name>
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                <last-name>DIGILENS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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        </applicants>
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                <last-name>亞伯拉罕　希布</last-name>
                <first-name></first-name>
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                <last-name>ABRAHAM, SHIBU</last-name>
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                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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                <last-name>莫拉德　拉特森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORAD, RATSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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                <last-name>辛戈拉尼　哈迪克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINGORANI, HARDIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
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                <last-name>希爾　布魯克</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HILL, BROOKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>查克拉博蒂　薩斯瓦塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKRABORTY, SASWATA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>顧　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明揭示用於基於波導之顯示器之具有黏合劑之波導光柵之系統及方法。如本文中描述之該等波導顯示器包括經組態以保護光柵結構免受污染物影響之一黏合劑材料。如本文中描述之該波導顯示器可用一噴墨列印機製造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for waveguide gratings with adhesive for waveguide-based displays. The waveguide displays as described herein comprise an adhesive material configured to protect the grating structures from contaminants. The waveguide display as described herein can be manufactured with an inkjet printer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:步驟</p>
        <p type="p">304:步驟</p>
        <p type="p">306:步驟</p>
        <p type="p">308:步驟</p>
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        <document-id>
          <doc-number>114124074</doc-number>
        </document-id>
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        <chinese-title>甲基丙烯酸系樹脂之製造方法、甲基丙烯酸系樹脂之再生方法、甲基丙烯酸系樹脂、單體組成物及甲基丙烯酸系樹脂組成物</chinese-title>
        <english-title></english-title>
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      <classification-ipc>
        <main-classification edition="200601120260202B">C08J11/08</main-classification>
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          <applicant app-type="applicant" sequence="1">
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                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
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                <last-name>平野佑典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>伊藤大晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>梶原透</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIWARA, TOORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明係可從含有甲基丙烯酸系樹脂的塑膠中充分除去異物、且低成本的甲基丙烯酸系樹脂之製造方法。本發明的甲基丙烯酸系樹脂之製造方法，係包括有：步驟(A)，係將含有甲基丙烯酸系樹脂的塑膠與醇進行混合，使上述甲基丙烯酸系樹脂溶解；步驟(B)，係將上述步驟(A)所獲得溶液中含有的不溶成分，利用固液分離而除去；步驟(C)，係利用相分離法從經固液分離後的溶液中製造上述甲基丙烯酸系樹脂；步驟(D)，係將在由上述步驟(C)所製造的上述甲基丙烯酸系樹脂中殘留之上述醇，利用壓榨或離心分離而除去。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
      </representative-img>
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        <document-id>
          <doc-number>114124089</doc-number>
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      <invention-title>
        <chinese-title>光阻平滑化及保護</chinese-title>
        <english-title>PHOTORESIST SMOOTHENING AND PROTECTION</english-title>
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      <classification-ipc>
        <main-classification edition="200601120260123B">G03F7/40</main-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>周雅欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YA-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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          </inventor>
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              <chinese-name name-type="organization">
                <last-name>蔡豪哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HAO-TSO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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                <last-name>葉庭毓</last-name>
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                <last-name>YEH, TING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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                <last-name>施晶華</last-name>
                <first-name></first-name>
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                <last-name>SHIH, CHING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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                <last-name>徐國翔</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HSU, KUO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
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              <address>新竹市</address>
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        <p type="p">本文提供用於在圖案化光阻材料上沉積材料的方法及設備。方法包含在電漿環境中暴露圖案化光阻材料於含碳沉積前驅物氣體與含氧鈍化氣體，隨後使用選用的含氧蝕刻電漿進行修整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatuses for depositing a material onto a patterned photoresist material are provided herein. Methods include exposing the patterned photoresist material to a carbon-containing deposition precursor gas and an oxygen-containing passivation gas in a plasma environment, followed by trimming using an optional oxygen-containing etching plasma.</p>
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        <p type="p">102,104,106:操作</p>
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        <chinese-title>化合物及發光器件</chinese-title>
        <english-title>COMPOUND AND LIGHT-EMITTING DEVICE</english-title>
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        <main-classification edition="200601120260202B">C09K11/06</main-classification>
        <further-classification edition="200601120260202B">C07C211/54</further-classification>
        <further-classification edition="200601120260202B">C07D209/86</further-classification>
        <further-classification edition="200601120260202B">C07D307/91</further-classification>
        <further-classification edition="202301120260202B">H10K50/15</further-classification>
        <further-classification edition="202301120260202B">H10K50/125</further-classification>
        <further-classification edition="202301120260202B">H10K85/60</further-classification>
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                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>梶山一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIYAMA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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                <last-name>川上祥子</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>KAWAKAMI, SACHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木恒徳</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SUZUKI, TSUNENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明
              </last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HASHIMOTO, NAOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>林有毅</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HAYASHI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬尾哲史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種特性良好的發光器件。提供一種新穎的有機化合物。該發光器件至少包括一對電極間的發光層及電洞傳輸層。發光層包含主體的第一化合物及客體的第二化合物。第二化合物的HOMO能階高於第一化合物的HOMO能階。電洞傳輸層包含含有氘的第三化合物。第三化合物由通式(G1)表示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a light-emitting device having favorable characteristics. To provide a novel organic compound. The light-emitting device includes at least a light-emitting layer and a hole-transport layer between a pair of electrodes. The light-emitting layer includes a first compound as a host and a second compound as a guest. The HOMO level of the second compound is higher than the HOMO level of the first compound. The hole-transport layer includes a third compound including deuterium. The third compound is represented by General Formula (G1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發光器件</p>
        <p type="p">101:第一電極</p>
        <p type="p">102:第二電極</p>
        <p type="p">103:有機化合物層</p>
        <p type="p">111:電洞注入層</p>
        <p type="p">112:電洞傳輸層</p>
        <p type="p">113:發光層</p>
        <p type="p">114:電子傳輸層</p>
        <p type="p">115:電子注入層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1508" publication-number="202618050">
    <tif-files tif-type="multi-tif">
      <tif file="114124100.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蓮蓬頭總成、控制蓮蓬頭總成之熱分佈的方法、及製造蓮蓬頭總成之方法</chinese-title>
        <english-title>SHOWERHEAD ASSEMBLY, METHOD OF CONTROLLING THERMAL PROFILE OF SHOWERHEAD ASSEMBLY, AND METHOD OF MANUFACTURING SHOWERHEAD ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C23C16/455</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹蒂旺　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANTIWONG, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班納　薩梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNA, SAMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種用於在一反應腔室內分配一氣體之蓮蓬頭總成。此蓮蓬頭總成包括一頂板、一氣體分配板及複數個熱可控區域。此氣體分配板耦接至此頂板。此氣體分配板亦具有面向此頂板的一頂表面及配置以面向安置於此反應腔室內之一基板的一底表面。此複數個熱可控區域經製造於此頂板及此氣體分配板中之至少一者中。亦描述控制蓮蓬頭總成之熱分佈的方法及製造蓮蓬頭總成之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A showerhead assembly for distributing a gas within a reaction chamber is provided. The showerhead assembly includes a top plate, a gas distribution plate, and a plurality of thermally controllable zones. The gas distribution plate is coupled to the top plate. The gas distribution plate also has a top surface facing the top plate and a bottom surface configured to face a substrate disposed within the reaction chamber. The plurality of thermally controllable zones are fabricated in at least one of the top plate and the gas distribution plate. Methods of controlling thermal profile of showerhead assemblies and methods of making showerhead assemblies are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:蓮蓬頭總成</p>
        <p type="p">102:氣體分配總成，氣體分配板</p>
        <p type="p">104:孔口</p>
        <p type="p">106:腔室，區</p>
        <p type="p">108:頂板</p>
        <p type="p">110:氣體入口</p>
        <p type="p">112:基板</p>
        <p type="p">122:路徑</p>
        <p type="p">124:路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1509" publication-number="202617178">
    <tif-files tif-type="multi-tif">
      <tif file="114124117.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多價肺炎球菌多醣-蛋白質共軛物組成物及使用其之方法</chinese-title>
        <english-title>MULTIVALENT PNEUMOCOCCAL POLYSACCHARIDE-PROTEIN CONJUGATE COMPOSITIONS AND METHODS OF USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61K39/09</main-classification>
        <further-classification edition="200601120260123B">A61K39/116</further-classification>
        <further-classification edition="200601120260123B">A61K39/39</further-classification>
        <further-classification edition="200601120260123B">A61K39/385</further-classification>
        <further-classification edition="200601120260123B">A61P11/00</further-classification>
        <further-classification edition="200601120260123B">A61P27/16</further-classification>
        <further-classification edition="200601120260123B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK BIOSCIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賽諾菲巴斯德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI PASTEUR INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申珍煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JINHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安京俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, KYUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覺　莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYAW, MOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔拉加　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TALAGA, PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供多價肺炎球菌共軛物組成物，其包含22-27種不同的肺炎球菌莢膜多醣-蛋白質共軛物，其中各肺炎球菌莢膜多醣-蛋白質共軛物包含與來自不同肺炎鏈球菌血清型之莢膜多醣共軛的蛋白載體，其中該等肺炎鏈球菌血清型係選自1、3、4、5、6A、6B、7F、8、9N、9V、10A、11A、12F、14、15A、15B、15C、18C、19A、19F、22F、23A、23B、23F、24F、33F及35B。亦提供產生多價肺炎球菌共軛物組成物之方法及使用該組成物預防個體之肺炎鏈球菌感染或疾病之方法。亦提供包含至少一種多醣-蛋白質共軛物之免疫原性組成物及其製備方法，其中該多醣為來自肺炎鏈球菌血清型15A、15C、23A、23B、24F及/或35B之莢膜多醣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are multivalent pneumococcal conjugate compositions comprising 22-27 different pneumococcal capsular polysaccharide-protein conjugates, wherein each pneumococcal capsular polysaccharide-protein conjugate comprises a protein carrier conjugated to a capsular polysaccharide from a different serotype of &lt;i&gt;Streptococcus pneumoniae&lt;/i&gt;, wherein the &lt;i&gt;Streptococcus pneumoniae&lt;/i&gt; serotypes are selected from 1, 3, 4, 5, 6A, 6B, 7F, 8, 9N, 9V, 10A, 11A, 12F, 14, 15A, 15B, 15C, 18C, 19A, 19F, 22F, 23A, 23B, 23F, 24F, 33F, and 35B. Also provided are methods of producing the multivalent pneumococcal conjugate compositions and methods of using the same for prophylaxis against &lt;i&gt;Streptococcus pneumoniae&lt;/i&gt;infection or disease in a subject. Also provided are immunogenic compositions comprising at least one polysaccharide-protein conjugate wherein the polysaccharide is a capsular polysaccharide from &lt;i&gt;Streptococcus pneumoniae&lt;/i&gt;serotype 15A, 15C, 23A, 23B, 24F, and/or 35B and methods of preparing the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1510" publication-number="202617726">
    <tif-files tif-type="multi-tif">
      <tif file="114124152.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＭＹＴ１激酶抑制劑、其藥物組合物及其用途</chinese-title>
        <english-title>COMPOUNDS AS MYT1 KINASE INHIBITORS, PHARMACEUTICAL COMPOSITIONS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D487/14</main-classification>
        <further-classification edition="200601120260202B">C07D487/22</further-classification>
        <further-classification edition="200601120260202B">C07D498/22</further-classification>
        <further-classification edition="200601120260202B">C07D471/22</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61K31/55</further-classification>
        <further-classification edition="200601120260202B">A61K31/5386</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣東東陽光藥業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNSHINE LAKE PHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章維紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭紅濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, HONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝洪朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, HONGPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭大華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, DAHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉韋良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, WEILIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧偉康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, WEIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾惠婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, HUITING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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                <last-name>趙嘉文</last-name>
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        <p type="p">本發明屬於藥物領域，具體地，本發明涉及一種Myt1激酶抑制劑化合物、其藥物組合物及其用途。具體地，本發明涉及式 (I) 化合物，或式 (I) 所示化合物的立體異構體、互變異構體、氮氧化物、溶劑化物、代謝產物、藥學上可接受的鹽或前藥，其中各變數具有本發明所述的含義。本發明涉及的化合物和其藥物組合物作為Myt1激酶抑制劑可用於製備用於預防或治療Myt1 相關疾病的藥物，尤其可用於製備用於預防或治療癌症的藥物。</p>
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      <invention-title>
        <chinese-title>組成物及聚合物</chinese-title>
        <english-title>COMPOSITION AND POLYMER</english-title>
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                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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                <last-name>太郎
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                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SUGAWARA, RYUTARO</last-name>
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                <first-name></first-name>
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              <address></address>
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                <last-name>上原卓也</last-name>
                <first-name></first-name>
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                <last-name>UEHARA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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                <last-name>小林三朗</last-name>
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                <last-name>KOBAYASHI, SABURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
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        <p type="p">[課題]提供顯示良好之基材選擇性，可形成刷密度及耐熱性良好之聚合物刷之組成物及聚合物。  &lt;br/&gt;　　[解決手段]一種組成物，其使用於選擇性修飾具有包含材質互為不同之2個以上之區域之表面之基材，其中含有聚合物(A)與溶劑(S)，聚合物(A)具有嵌段(A1)與嵌段(A2)，嵌段(A1)具有構成單位，且該構成單位具有源自選自由苯乙烯、苯乙烯衍生物及(α取代)丙烯酸酯所成群之至少1種，嵌段(A2)具有2個以上之下述式(1)所示之基，式(1)所示之基係與碳原子鍵結。  &lt;br/&gt;&lt;img align="absmiddle" height="36px" width="305px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，X為單鍵或氧原子，R&lt;sup&gt;1&lt;/sup&gt;為烷基。)</p>
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        <p type="p">
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        <chinese-title>用於抑制發炎之細胞之製備方法、用於抑制發炎之細胞、抗發炎組成物及促進抑制發炎作用之方法</chinese-title>
        <english-title></english-title>
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      <classification-ipc>
        <main-classification edition="201001120260202B">C12N5/0775</main-classification>
        <further-classification edition="201501120260202B">A61K35/28</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
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                <last-name>日商樂敦製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHTO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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                <last-name>香港商樂敦尖端研究香港有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHTO ADVANCED RESEARCH HONG KONG LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
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                <last-name>香港商宏聲醫療控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>SONIKURE HOLDINGS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>HK</english-country>
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                <last-name>飯阪亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IISAKA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>譚　晞彥</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>TAM, HEI YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
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              <chinese-name name-type="organization">
                <last-name>孫　瑋良</last-name>
                <first-name></first-name>
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                <last-name>SUEN, WEI LEUNG LANGSTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>張　倩行</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHEUNG, SIN HANG SARAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>HK</english-country>
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              <chinese-name name-type="organization">
                <last-name>李　浩然</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LI, HO YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
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                <last-name>查隆因派薩　普拉帕森</last-name>
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                <last-name>CHAROENYINGPAISAL, PRAPATSORN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TH</english-country>
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                <last-name>盧　巧兒</last-name>
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                <last-name>LO, HAU YI PAULISALLY</last-name>
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                <first-name></first-name>
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              <address></address>
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                <last-name>林志剛</last-name>
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        <p type="p">本發明的目的在於提供對於發炎的治療效果更高之細胞。  &lt;br/&gt;　　本發明為一種用於抑制發炎之細胞之製備方法，其特徵在於對細胞進行超音波處理。前述超音波處理的超音波的強度為50mW/cm&lt;sup&gt;2&lt;/sup&gt;~5000mW/cm&lt;sup&gt;2&lt;/sup&gt;，頻率為20kHz~ 20MHz，前述細胞較佳為間葉系幹細胞。</p>
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        <p type="p">
        </p>
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          <doc-number>114124184</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙環結構及包含其的寡核苷酸</chinese-title>
        <english-title>A BICYCLIC STRUCTURE AND AN OLIGONUCLEOTIDE COMPRISING THE SAME</english-title>
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        <main-classification edition="201001120260202B">C12N15/113</main-classification>
        <further-classification edition="200601120260202B">C07F9/59</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海拓界生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUOJIE BIOTECH (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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        </applicants>
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          <inventor app-type="applicant" sequence="1">
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                <last-name>劉浩淼</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LIU, HAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>李云飛</last-name>
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                <last-name>LI, YUNFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>李宇祺</last-name>
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                <last-name>LI, YUQI</last-name>
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                <first-name></first-name>
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                <last-name>王鍇</last-name>
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                <last-name>WANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>林曉燕</last-name>
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                <last-name>LIN, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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                <last-name>洪武雄</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
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        <p type="p">本揭露涉及一種雙環結構及包含其的寡核苷酸。具體而言，本發明涉及一種修飾的寡核苷酸，該寡核苷酸中包含至少1個如式(I’)所示的結構，其中各官能團如本揭露上下文中定義。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="172px" width="249px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to a bicyclic structure and an oligonucleotide comprising the same. Specifically, the present invention relates to a modified oligonucleotide comprising at least one structure as shown in formula (I'), wherein each functional group is defined in the context of the present disclosure.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="179px" width="205px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
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          <doc-number>114124186</doc-number>
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      <invention-title>
        <chinese-title>用於治療骨髓增生病症之間質蛋白酶—２抑制劑</chinese-title>
        <english-title>MATRIPTASE-2 INHIBITOR FOR TREATMENT OF MYELOPROLIFERATIVE DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/713</main-classification>
        <further-classification edition="201001120260202B">C12N15/113</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
        <further-classification edition="200601120260202B">A61P7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商賽倫斯治療有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILENCE THERAPEUTICS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪堤奈茲　艾爾伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINEZ, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛克　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOK, HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高梅茲　帕羅　蒙妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOMEZ PALOU, MONICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯提亞　伊格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOSTIAR, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪查席克　瑪西爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHACEK, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡西尼　巴斯提安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASINI, BASTIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用SLN124對&lt;i&gt;TMPRSS6&lt;/i&gt;進行治療性抑制以用於預防、防治或治療真性紅血球增多症(Polycythaemia vera；PV)，且尤其關於SLN124雙股siRNA分子在預防、防治或治療真性紅血球增多症(PV)相關病狀中之治療性用途的有效劑量及劑量方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the therapeutic inhibition of &lt;i&gt;TMPRSS6&lt;/i&gt; by SLN124 for the prevention, prophylaxis, or treatment of Polycythaemia vera (PV) and in particular to effective doses and dosage regimes for the therapeutic use of the SLN124 double stranded siRNA molecule in the prevention, prophylaxis or treatment of conditions associated with Polycythaemia vera (PV).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1515" publication-number="202619117">
    <tif-files tif-type="multi-tif">
      <tif file="114124188.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括互連結構的積體電路裝置及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICES INCLUDING INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L23/535</main-classification>
        <further-classification edition="200601120260126B">H01L21/768</further-classification>
        <further-classification edition="200601120260126B">H01L21/302</further-classification>
        <further-classification edition="200601120260126B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尊秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOHNSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳重席</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JOONGSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明概念的一些實施例，可提供積體電路裝置。積體電路裝置可包括下部導電線路、下部導電線路上的導電通孔以及下部導電線路和導電通孔之間的停止圖案。停止圖案的側表面可與下部導電線路的側表面和導電通孔的側表面對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to some embodiments of the inventive concepts, an integrated circuit device may be provided. The integrated circuit device may include a lower conductive line, a conductive via on the lower conductive line and a stopping pattern between the lower conductive line and the conductive via. A side surface of the stopping pattern may be aligned with the side surface of the lower conductive line and the side surface of the conductive via.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202,204,206,208,210,212,214,216,218:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1516" publication-number="202618546">
    <tif-files tif-type="multi-tif">
      <tif file="114124190.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於序列分析演算法的通用向量加速系統</chinese-title>
        <english-title>UNIVERSAL VECTOR ACCELERATION SYSTEM FOR SEQUENCE ANALYSIS ALGORITHMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260123B">G06F9/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴塞羅那超級計算中心　國家超級計算中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARCELONA SUPERCOMPUTING CENTER - CENTRO NACIONAL DE SUPERCOMPUTACION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕翁　雷拉　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAVON RIERA, JULIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦爾加斯　瓦蒂維索　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARGAS VALDIVIESO, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅哈斯　莫拉萊斯　卡羅斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROJAS MORALES, CARLOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬可　索拉　聖地牙哥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCO SOLA, SANTIAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩薩爾　歐斯曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNSAL, OSMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里斯塔爾　克斯托曼　阿德里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRISTAL KESTELMAN, ADRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於加速一演算法之執行的系統（1），其適於連接至一向量處理單元（VPU）（2）之向量資料路徑，該向量處理單元包含一向量暫存器檔案（VRF）（3）及一算術邏輯單元（ALU）（4）。該系統（1）包含連接至該VRF（3）之一資料編碼器（6）、連接至該VRF（3）及至該資料編碼器（6）之一或多個直接映射緩衝器（5）。該資料編碼器（6）自該VRF（3）接收資料，施加一靜態位元編碼並將經編碼資料發送至該一或多個緩衝器（5）；該存取控制模組（7）將資料自該VRF（3）傳送至該一或多個緩衝器（5）及/或將指令自該等緩衝器（5）傳送至該ALU（4）；以及該一或多個緩衝器（5）自該VRF（3）及/或自該資料編碼器（6）接收資料，將其儲存於該緩衝器（5）內之一位置中並將其遞送至該存取控制模組（7）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a system (1) for accelerating the execution of an algorithm, adapted to connect to the vector datapath of a Vector Processing Unit (VPU) (2) comprising a Vector Register File (VRF) (3) and an arithmetic logic unit (ALU) (4). The system (1) comprises a data encoder (6) connected to the VRF (3), one or more direct-mapped buffers (5) connected to the VRF (3) and to the data encoder (6). The data encoder (6) receives data from the VRF (3), applies a static-bit encoding and sends the encoded data to the one or more buffers (5); the access control module (7) transfers data from the VRF (3) to the one or more buffers (5) and/or instructions from the buffers (5) to the ALU (4); and the one or more buffers (5) receive data from the VRF (3) and/or from the data encoder (6), store it in a position within the buffer (5) and deliver it to the access control module (7).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統</p>
        <p type="p">2:向量處理單元(VPU)</p>
        <p type="p">3:向量暫存器檔案(VRF)</p>
        <p type="p">4:算術邏輯單元(ALU)</p>
        <p type="p">5:緩衝器</p>
        <p type="p">6:資料編碼器</p>
        <p type="p">7:存取控制模組</p>
        <p type="p">8:計數ALU模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1517" publication-number="202619143">
    <tif-files tif-type="multi-tif">
      <tif file="114124194.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用無功負載的電池管理的系統</chinese-title>
        <english-title>BATTERY MANAGEMENT USING A REACTIVE LOAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01M10/48</main-classification>
        <further-classification edition="201901120260126B">G01R31/389</further-classification>
        <further-classification edition="201901120260126B">G01R31/392</further-classification>
        <further-classification edition="201401120260126B">H01M10/615</further-classification>
        <further-classification edition="200601120260126B">H02J7/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商銳萊控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RELECTRIFY HOLDINGS PTY LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅科　安東尼奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCCO, ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">涉及一種被配置為管理電池電芯之間的無功能量傳輸的電池系統，包括：多個電池電芯模組；無功電路和開關電路，開關電路被配置為選擇性地將任意一個或多個電池電芯模組與無功電路連接，並且配置與無功電路連接的每個電池電芯模組的相對極性。在第一模式中，控制器被配置為通過無功電路將一個或多個電池電芯模組連接至外部負載的輸出端，在第二模式中，控制器被配置為：將電池電芯模組從輸出端斷開，以及通過以影響無功交流相位的極性將選擇的一個或多個電池電芯模組與無功電路交變地連接，來驅動無功電路中的無功電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">276:均衡電芯模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1518" publication-number="202619567">
    <tif-files tif-type="multi-tif">
      <tif file="114124207.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D84/83</main-classification>
        <further-classification edition="202501120260123B">H10D30/43</further-classification>
        <further-classification edition="202501120260123B">H10D62/10</further-classification>
        <further-classification edition="202501120260123B">H10D62/13</further-classification>
        <further-classification edition="202501120260123B">H10D64/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金茶惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴柱勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹喆珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, CHEOLJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許大弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, DAIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括第一主動圖案，包括在垂直於基底表面的第一方向上間隔開的第一片材，位於第一主動圖案上的第二主動圖案，還包括在第一方向上間隔開的第二片材，在第二方向上連接到第一主動圖案的第一源極/汲極圖案，位於第一源極/汲極圖案上且在第二方向上連接到第二主動圖案的第二源極/汲極圖案，以及在第三方向上延伸並環繞著第一和第二主動圖案而延伸的閘極電極。第一源極/汲極圖案包括沿著凹部的內表面形成的第一薄膜，第一源極/汲極圖案設於所述凹部，以及包括位於第一薄膜上並填充所述凹部的第二薄膜。在包括第一和第三方向的剖面上，凹部的寬度隨著與基板距離的減少而減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first active pattern including first sheets spaced apart in a first direction perpendicular to a surface of a substrate, a second active pattern on the first active pattern and including second sheets spaced apart in the first direction, a first source/drain pattern connected to the first active pattern in a second direction, a second source/drain pattern on the first source/drain pattern and connected to the second active pattern in the second direction, and a gate electrode extending in a third direction and extending around the first and the second active patterns. The first source/drain pattern includes a first film along an inner surface of a recess where the first source/drain pattern is disposed and a second film on the first film and filling the recess. On a cross-section including the first and third directions, the recess decreases in width with decreasing distance to the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">W250:寬度</p>
        <p type="p">194:第四層間絕緣膜</p>
        <p type="p">197:第二蝕刻終止膜</p>
        <p type="p">193:第三層間絕緣膜</p>
        <p type="p">196:第一蝕刻終止膜</p>
        <p type="p">192:第二層間絕緣膜</p>
        <p type="p">162:第二源極/汲極蝕刻終止膜</p>
        <p type="p">191:第一層間絕緣膜</p>
        <p type="p">150US:上表面</p>
        <p type="p">161:第一源極/汲極蝕刻終止膜</p>
        <p type="p">320:第二柵欄薄膜</p>
        <p type="p">310:第一柵欄薄膜</p>
        <p type="p">P:區域</p>
        <p type="p">101P:突出部分</p>
        <p type="p">B:線</p>
        <p type="p">150R:凹部</p>
        <p type="p">W150:寬度</p>
        <p type="p">TR:溝槽</p>
        <p type="p">201b:配線填充膜</p>
        <p type="p">201a:配線阻隔膜</p>
        <p type="p">201:配線線路</p>
        <p type="p">175b:導孔填充膜</p>
        <p type="p">175a:導孔阻隔膜</p>
        <p type="p">175:配線導孔</p>
        <p type="p">172b:第二源/汲極接觸填充膜</p>
        <p type="p">172a:第二源極/汲極接觸阻隔膜</p>
        <p type="p">172:第二源極/汲極接觸件</p>
        <p type="p">250:第二源極/汲極圖案</p>
        <p type="p">250BS:下表面</p>
        <p type="p">171b:第一源極/汲極接觸填充膜</p>
        <p type="p">171a:第一源極/汲極接觸阻隔膜</p>
        <p type="p">171:第一源極/汲極接觸件</p>
        <p type="p">152:第二薄膜</p>
        <p type="p">151:第一薄膜</p>
        <p type="p">150:第一源極/汲極圖案</p>
        <p type="p">105:場絕緣膜</p>
        <p type="p">101:鰭狀圖案</p>
        <p type="p">100:基底</p>
        <p type="p">D1、D2、D3:第一方向、第二方向、第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1519" publication-number="202617720">
    <tif-files tif-type="multi-tif">
      <tif file="114124212.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有芳基連接子之升糖素受體促效劑及其治療用途</chinese-title>
        <english-title>GLUCAGON RECEPTOR AGONISTS WITH ARYL LINKERS AND THEIR USE AS THERAPIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/10</main-classification>
        <further-classification edition="200601120260202B">A61K31/506</further-classification>
        <further-classification edition="200601120260202B">A61K31/444</further-classification>
        <further-classification edition="200601120260202B">A61K31/4439</further-classification>
        <further-classification edition="200601120260202B">A61P3/04</further-classification>
        <further-classification edition="200601120260202B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿傑格斯　恰羅　法蘭西斯可　賈威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGEJAS CHICHARRO, FRANCISCO JAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安東尼　莎拉　梅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTHONY, SARAH MAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賓漢　坦納　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BINGHAM, TANNER WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布坎南　崔維斯　拉蒙特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHANAN, TRAVIS LAMONTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康諾　史考特　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONNER, SCOTT E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫明　葛拉漢　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUMMING, GRAHAM ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋茲　梅森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GATZ, MASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　史帝芬　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN, STEVEN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納普　瑞秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNAPP, RACHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭斯瓦拉　賈亞納　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINESWALA, JAYANA P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬里穆圖　喬提拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARIMUTHU, JOTHIRAJAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧日祖　艾菲迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIZU, IFEDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷弗托　亞歷山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REVUELTO, ALEJANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德斯　札拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDS, ZARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>憲普　塔比塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHEMPP, TABITHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔帕　畢斯努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAPA, BISHNU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖拉杜　亞斯克瑞巴納　馬奎爾　安吉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLEDO ESCRIBANO, MIGUEL ANGEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="20">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>揚庫納斯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONKUNAS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="21">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬汀尼茲　派瑞茲　荷西　安東尼歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINEZ PEREZ,JOSE ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="22">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特洛米茲克　艾瑞克　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TROMICZAK,ERIC G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種式(I)化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="136px" width="264px" file="ed10894.JPG" alt="ed10894.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;或其醫藥學上可接受之鹽。本文亦揭示一種醫藥組合物，其包含式(I)化合物或其醫藥學上可接受之鹽，及醫藥學上可接受之添加劑。本文進一步揭示一種經由使用式(I)化合物或其醫藥學上可接受之鹽調節升糖素受體來預防或治療疾病或病況的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a compound of formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="132px" width="266px" file="ed10895.JPG" alt="ed10895.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;or a pharmaceutically acceptable salt thereof. Also disclosed herein is a pharmaceutical composition comprising a compound of formula (I), or a pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable additive. Further disclosed herein is a method for preventing or treating a disease or condition through the modulation of the glucagon receptor using a compound of formula (I), or a pharmaceutically acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1520" publication-number="202617971">
    <tif-files tif-type="multi-tif">
      <tif file="114124234.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自甲醇製備C6-C26脂肪酸</chinese-title>
        <english-title>PRODUCTION OF C6-C26 FATTY ACIDS FROM METHANOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N1/20</main-classification>
        <further-classification edition="200601120260202B">C12N9/16</further-classification>
        <further-classification edition="200601120260202B">C12P7/04</further-classification>
        <further-classification edition="202201120260202B">C12P7/6409</further-classification>
        <further-classification edition="200601320260202B">C12R1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梵布蘭特　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIRANT, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯斯　亞歷山大　約翰納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUIS, ALEKSANDER JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施法柏　齊瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SVAB, ZIVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蘭克　妮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLENC, NINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯賽克　格雷高爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSEC, GREGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能自甲醇製備至少一種C6-C26游離脂肪酸或其混合物之微生物，該微生物包含至少一個能表現硫酯酶(TE)之基因及至少一個能表現至少一種脂肪醇還原酶(FAR)之基因。本發明進一步提供製造至少一種C6-C26游離脂肪酸或其混合物及製造C6-C26游離脂肪醇或其混合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a&lt;i/&gt;microorganism capable of producing at least one C6-C26 free fatty acid or a mixture thereof from methanol, said microorganism comprising at least one gene enabling the expression of a thioesterase (TE) and at least one gene enabling the expression of at least one Fatty Alcohol Reductase (FAR). The present invention further provides methods for the manufacture of at least one C6-C26 free fatty acids or mixtures thereof and C6-C26 free fatty alcohols or mixtures thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1521" publication-number="202617988">
    <tif-files tif-type="multi-tif">
      <tif file="114124240.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療性環狀ＤＮＡ形式</chinese-title>
        <english-title>THERAPEUTIC CIRCULAR DNA FORMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N15/11</main-classification>
        <further-classification edition="200601120260202B">C12N9/12</further-classification>
        <further-classification edition="200601120260202B">C12N9/16</further-classification>
        <further-classification edition="200601120260202B">C12P19/34</further-classification>
        <further-classification edition="200601120260202B">A61K31/713</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商旗艦先鋒創新有限責任(ＶＩＩ)公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAGSHIP PIONEERING INNOVATIONS VII, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘迺迪　愛德華　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENNEDY, EDWARD MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布列頓　卡米洛　阿亞拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRETON, CAMILO AYALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯朗　卡爾　偉恩　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, CARL WAYNE, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米德　布萊恩　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEAD, BRIAN PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了例如包含一或多個經化學修飾的核鹼基的雙股DNA（dsDNA）分子。在一些實施方式中，該dsDNA分子係環狀的並且包含第一股和第二股，其中該第一股包含一或多個經化學修飾的核鹼基，並且該第二股不含經化學修飾的核鹼基。在一些實施方式中，該dsDNA分子包含啟動子序列和編碼效應子的效應子序列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides, for example, double stranded DNA (dsDNA) molecules comprising one or more chemically modified nucleobases. In some embodiments, the dsDNA molecule is circular and comprises a first strand and a second strand, wherein the first strand comprises one or more chemically modified nucleobases, and the second strand is free of chemically modified nucleobases. In some embodiments, the dsDNA molecule comprises a promoter sequence and an effector sequence that encodes an effector.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1522" publication-number="202618954">
    <tif-files tif-type="multi-tif">
      <tif file="114124279.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250805B">H01L21/66</main-classification>
        <further-classification edition="200601120250805B">H01L21/768</further-classification>
        <further-classification edition="200601120250805B">H01L21/67</further-classification>
        <further-classification edition="202001120250805B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾福廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, FU-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置及其製造方法。電子裝置的製造方法包括：提供基板；對基板進行開孔製程，以在基板中形成穿孔；對基板進行第一檢測步驟，以獲得第一檢測結果；以及根據第一檢測結果判斷穿孔的狀態是否異常。當判斷穿孔的狀態為異常時，對基板進行穿孔重工製程，其中穿孔重工製程包括進行重工方向判定步驟，以決定在進行穿孔重工製程時是否需要翻轉基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes: providing a substrate; performing a hole-forming process on the substrate to form a through hole in the substrate; performing a first inspection step to the substrate to obtain a first inspection result; and judging whether a state of the through hole is abnormal according to the first inspection result. A through hole rework process is performed on the substrate when it is judged that the state of the through hole is abnormal. The through hole rework process includes performing a rework direction determining step to determine whether the substrate needs to be flipped during performing the through hole rework process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100,S200,S300,S400,S500,S410,S420,S430,S440,S310:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1523" publication-number="202619615">
    <tif-files tif-type="multi-tif">
      <tif file="114124285.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及包括其之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">H10K59/80</main-classification>
        <further-classification edition="202301120260202B">H10K59/131</further-classification>
        <further-classification edition="202301120260202B">H10K59/121</further-classification>
        <further-classification edition="201601120260202B">G09G3/3208</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高裕敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金慶昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴注燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔忠碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHUNG SOCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">顯示裝置包括：像素驅動電路部分，包括電晶體；連接電極，位於像素驅動電路部分上，並電性連接像素驅動電路部分的電晶體；第一電極層，位於連接電極上，第一電極層接收電源電壓，且包括複數個第一電極；傳輸線組，位於與第一電極層不同的層中，電性連接第一電極層，且在平面圖中與第一電極層形成網格結構；分隔件，位於第一電極層上；以及第二電極層，位於第一電極層上，並被分隔件分隔成複數個第二電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes: a pixel driving circuit part including a transistor, a connection electrode located on the pixel driving circuit part and electrically connected to the transistor of the pixel driving circuit part, a first electrode layer located on the connection electrode, the first electrode layer receiving a power supply voltage and including a plurality of first electrodes, a transmission line group located in a different layer from the first electrode layer, electrically connected to the first electrode layer, and forming a mesh structure with the first electrode layer in plan view, a separator located on the first electrode layer, and a second electrode layer located on the first electrode layer and separated into a plurality of second electrodes by the separator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BR1:第一橋接元件</p>
        <p type="p">BR2:第二橋接元件</p>
        <p type="p">CNT1:第一接觸孔</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">E1:第一電極層</p>
        <p type="p">E1a,E1b,E1c:第一電極</p>
        <p type="p">TL1:第一傳輸線</p>
        <p type="p">TLG:傳輸線組</p>
        <p type="p">PCa:第一像素驅動電路部分</p>
        <p type="p">PCb:第二像素驅動電路部分</p>
        <p type="p">PCc:第三像素驅動電路部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1524" publication-number="202618794">
    <tif-files tif-type="multi-tif">
      <tif file="114124294.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">G11C19/28</main-classification>
        <further-classification edition="202501120260119B">H10D30/00</further-classification>
        <further-classification edition="200601120260119B">G02F1/133</further-classification>
        <further-classification edition="200601120260119B">G09G3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYAMA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是提供一種耗電量低且能夠防止輸出的電位的幅度變小的使用單極性電晶體的半導體裝置。一種半導體裝置，包括：具有第一電位的第一佈線；具有第二電位的第二佈線；具有第三電位的第三佈線；極性相同的第一電晶體及第二電晶體；以及選擇是對第一電晶體及第二電晶體的閘極提供第一電位還是對第一電晶體及第二電晶體的閘極提供第三電位以及選擇是否對第一電晶體及第二電晶體的汲極端子提供第一電位的多個第三電晶體。其中，第一電晶體的源極端子與第二佈線連接，並且第二電晶體的源極端子與第三佈線連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device that includes transistors having the same polarity consumes less power and can prevent a decrease in amplitude of a potential output. The semiconductor device includes a first wiring having a first potential, a second wiring having a second potential, a third wiring having a third potential, a first transistor and a second transistor having the same polarity, and a plurality of third transistors for selecting supply of the first potential to gates of the first transistor and the second transistor or supply of the third potential to the gates of the first transistor and the second transistor and for selecting whether to supply one potential to drain terminals of the first transistor and the second transistor. A source terminal of the first transistor is connected to the second wiring, and a source terminal of the second transistor is connected to the third wiring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:電路</p>
        <p type="p">102:電晶體</p>
        <p type="p">103:電晶體</p>
        <p type="p">104:佈線電位VDD</p>
        <p type="p">105:佈線電位VSS</p>
        <p type="p">106:佈線電位VEE</p>
        <p type="p">107:佈線電位Vin</p>
        <p type="p">108:佈線電位Vout</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1525" publication-number="202618448">
    <tif-files tif-type="multi-tif">
      <tif file="114124296.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>位圖傾斜補償</chinese-title>
        <english-title>BITMAP SKEW COMPENSATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G03F7/00</main-classification>
        <further-classification edition="200601120260123B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商麥可尼克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYCRONIC AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬卡林加姆　巴拉昌德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOKKALINGAM, BALACHANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾林　弗雷德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IHREN, FREDRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於提供經方位角補償之光柵化圖案資料之方法，其包括獲得(S10)表示一待印刷圖案之原始光柵化圖案資料。識別(S20)該原始光柵化圖案資料中之邊緣像素。獲得(S30)包括旨在於用於印刷該圖案之一掃描期間使用之一微掃掠的一方位角之掃描定義資料。定義(S40)相對於該原始光柵化圖案資料在負方向上傾斜達該方位角之一方位角像素陣列。藉由以下來判定(S50)經方位角補償之光柵化圖案資料：依據該原始光柵化圖案資料中之各自重疊像素之強度，將一強度指派(S52)給該經方位角補償之光柵化圖案資料中與該原始光柵化圖案資料中之該等邊緣像素的任何者重疊之像素。本發明亦揭示一種用於印刷一圖案之方法、用於處理印刷資料之裝置，及印刷裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for providing azimuth compensated rasterized pattern data comprises obtaining (S10) of original rasterized pattern data, representing a pattern to be printed. Edge pixels are identified (S20) in the original rasterized pattern data. Scan defining data are obtained (S30), comprising an azimuth angle for a micro-sweep intended to be used during a scan for printing the pattern. An azimuth pixel array is defined (S40), angled relative to the original rasterized pattern data by the azimuth angle in negative direction. Azimuth compensated rasterized pattern data is determined (S50) by assigning (S52) an intensity to pixels in the azimuth compensated rasterized pattern data that overlaps with any of the edge pixels in the original rasterized pattern data, in dependence of intensities of respective overlapped pixels in the original rasterized pattern data. A method for printing a pattern, a device for processing print data and a printing device are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:步驟/獲得</p>
        <p type="p">S20:步驟/識別</p>
        <p type="p">S30:步驟/獲得</p>
        <p type="p">S40:步驟/定義</p>
        <p type="p">S50:步驟/判定</p>
        <p type="p">S52:步驟/指派</p>
        <p type="p">S54:步驟/複製</p>
        <p type="p">S60:步驟/儲存</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1526" publication-number="202617186">
    <tif-files tif-type="multi-tif">
      <tif file="114124305.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＢＣＬ－ＸＬ降解劑抗體結合物及其用途</chinese-title>
        <english-title>BCL-XL DEGRADER ANTIBODY CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260202B">A61K47/68</main-classification>
        <further-classification edition="200601120260202B">C07K16/30</further-classification>
        <further-classification edition="200601120260202B">C07D471/04</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商飛爾富來生物公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIREFLY BIO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　尚恩　威斯力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, SEAN WESLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛羅曼　克里斯多福　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROHMANN, CHRISTOPH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳新朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, XINPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希瓦塔雷　維迪亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIVATARE, VIDYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹　溫蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, WENDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾史丹格　伯恩哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEIERSTANGER, BERNHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式I之蛋白質降解劑抗體結合物組合物，其包含藉由與一或多個Bcl-xL靶蛋白結合劑及VHL配位體(TPI-Sp-VHL)部分結合而連接之抗體。本發明亦提供包含反應性官能基之TPI-Sp-VHL衍生物中間體組合物。此類中間體組合物為經由連接體或連接部分形成該等降解劑抗體結合物之適宜受質。本發明進一步提供用該等降解劑抗體結合物治療諸如癌症等疾病及病症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides protein-degrader antibody conjugate compositions of Formula I comprising an antibody linked by conjugation to one or more Bcl-xL target protein binder and VHL ligand (TPI-Sp-VHL) moieties. The invention also provides TPI-Sp-VHL derivative intermediate compositions comprising a reactive functional group. Such intermediate compositions are suitable substrates for formation of the degrader antibody conjugates through a linker or linking moiety. The invention further provides methods of treating diseases and disorders such as cancer with the degrader antibody conjugates.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1527" publication-number="202618456">
    <tif-files tif-type="multi-tif">
      <tif file="114124307.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置、光源裝置、控制方法以及程式</chinese-title>
        <english-title>CONTROL APPARATUS, LIGHT SOURCE APPARATUS, CONTROL METHOD AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G03F7/20</main-classification>
        <further-classification edition="200601120260123B">G01N21/84</further-classification>
        <further-classification edition="200601120260123B">H05G2/00</further-classification>
        <further-classification edition="200601120260123B">G01N21/956</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雷射科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LASERTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾喬爾　霍爾貝克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARL JOEL, HALLBAECK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西澤正泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZAWA, MASAYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小市真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOICHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種能使附著物減少之控制裝置、光源裝置、控制方法以及程式。本發明的光源裝置100的控制部160為控制裝置，用以從複數個模式中決定要執行的模式。於複數個模式包含有：第一模式，係以光源裝置100對被靶保持部110保持的靶材112照射雷射從而所產生的照明光L1照明試樣500；以及第二模式，係光源裝置100對附著於靶保持部110的表面的附著物照射雷射，藉此削減附著物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11至S13:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1528" publication-number="202617962">
    <tif-files tif-type="multi-tif">
      <tif file="114124325.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124325</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啤酒風味發酵飲料及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12C5/02</main-classification>
        <further-classification edition="200601120260202B">C12C12/04</further-classification>
        <further-classification edition="200601120260202B">A23L2/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商麒麟控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIN HOLDINGS KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋沙織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藝萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKI, MEBAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋友理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種新穎之啤酒風味發酵飲料，其雖降低了嘌呤體濃度，但改善了因嘌呤體濃度降低所導致之香味變差。根據本發明，提供一種啤酒風味發酵飲料，其係嘌呤體濃度為35,000 ppb以下、或腺苷濃度為15,000 ppb以下、或鳥苷濃度為56,000 ppb以下者，且2-戊基呋喃濃度為0.5 ppb以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1529" publication-number="202618029">
    <tif-files tif-type="multi-tif">
      <tif file="114124329.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用在成形蝕刻之後的還原處理之碳膜沉積</chinese-title>
        <english-title>CARBON FILM DEPOSITION WITH REDUCING TREATMENT AFTER SHAPING ETCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C16/04</main-classification>
        <further-classification edition="200601120260202B">C23C16/26</further-classification>
        <further-classification edition="200601120260202B">C23C16/455</further-classification>
        <further-classification edition="200601120260202B">C23C16/505</further-classification>
        <further-classification edition="200601120260202B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多迪亞　阿什　尼勒什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DODHIA, AARSH NILESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克唐納　戈登　艾立克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACDONALD, GORDON ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　史貴凡迪　巴頓　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN SCHRAVENDIJK, BART J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普森科維拉甘　拉杰什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTHENKOVILAKAM, RAGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞迪　卡蒲　瑟利西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, KAPU SIRISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施羅德　托德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, TODD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示有關執行碳膜沉積製程的實例，該碳膜沉積製程使用循環式沉積/蝕刻方法，而不在碳膜內形成平坦化停止層。一個所揭示的實例提供在基板上沉積碳膜的方法，該基板設置於處理工具之處理腔室中。該方法包含執行第一碳沉積循環，以沉積碳膜的第一部分。該方法更包含執行氧化蝕刻製程，以使碳膜之第一部分成形。該方法更包含在執行氧化蝕刻製程之後，對碳膜之第一部分執行還原電漿處理。該方法更包含執行第二碳沉積循環，以在碳膜之第一部分上沉積碳膜之第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples are disclosed that relate to performing a carbon film deposition process that utilizes a cyclic deposition/etch approach without forming a planarization stop layer within the carbon film. One disclosed example provides a method of depositing a carbon film on a substrate disposed in a processing chamber of a processing tool. The method comprises performing a first carbon deposition cycle to deposit a first portion of the carbon film. The method further comprises performing an oxidative etching process to shape the first portion of the carbon film. The method further comprises performing a reducing plasma treatment on the first portion of the carbon film after performing the oxidative etching process. The method further comprises performing a second carbon deposition cycle to deposit a second portion of the carbon film over the first portion of the carbon film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">404:步驟</p>
        <p type="p">406:步驟</p>
        <p type="p">407:步驟</p>
        <p type="p">410:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1530" publication-number="202617538">
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      <tif file="114124330.zip" no="1">
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          <doc-number>202617538</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包裝袋的製造方法及包裝袋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B65D81/34</main-classification>
        <further-classification edition="200601120260126B">B65D33/01</further-classification>
        <further-classification edition="200601120260126B">B65D75/58</further-classification>
        <further-classification edition="201701120260126B">B31B70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木和美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, KAZUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下野貴裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMONO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一實施形態的包裝袋的製造方法係含有下述步驟：製造具有第1至第3面部的中間體之步驟，第1面部係具有第1翼片區域及第1a袋本體區域，第2面部係具有與第1翼片區域構成中間體的第1部分之第2翼片區域及第2a袋本體區域，第3面部係具有與第1a袋本體區域構成中間體的第2部分之第1b袋本體區域及與第2a袋本體區域構成中間體的第3部分之第2b袋本體區域；在中間體形成蒸氣排出部之步驟；在以使第2b袋本體區域接於第1b袋本體區域的方式將第3部分倒往第2部分的狀態下，在第1至第3部分的兩側緣部形成封合部之步驟；及以使第2a袋本體區域接於第1翼片區域的方式將第2部分往第1部分翻折之翻折步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1531" publication-number="202618030">
    <tif-files tif-type="multi-tif">
      <tif file="114124335.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腔室預塗佈</chinese-title>
        <english-title>CHAMBER PRECOAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C16/04</main-classification>
        <further-classification edition="200601120260202B">C23C16/26</further-classification>
        <further-classification edition="200601120260202B">C23C16/44</further-classification>
        <further-classification edition="200601120260202B">C23C16/50</further-classification>
        <further-classification edition="200601120260202B">C23C16/52</further-classification>
        <further-classification edition="200601120260202B">H01L21/02</further-classification>
        <further-classification edition="200601120260202B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高政寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, ZHENG NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高珺賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, JUNXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雯晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WENQING NMN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所述技術係關於對處理基板用半導體處理設備預處理的方法，以及所得之設備。在一態樣中，該方法包括在半導體處理設備之處理腔室內的暴露表面上沉積預塗層，其中預塗層包含摻雜碳膜，且其中在處理腔室中不具基板下，將預塗層沉積在處理腔室內的暴露表面上。在許多示例中，該設備配置成沉積基於碳之材料，例如可灰化硬遮罩。在諸多示例中，預塗層為矽摻雜碳膜。在其他例子中，可使用其他類型的預塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques described herein relate to methods for preparing a semiconductor processing apparatus for processing substrates, as well as the resulting apparatus. In one aspect, the method includes depositing a precoat on exposed surfaces within a processing chamber of the semiconductor processing apparatus, where the precoat comprises a doped carbon film, and where the precoat is deposited on the exposed surfaces within the processing chamber in the absence of a substrate in the processing chamber. In many examples, the apparatus is configured to deposit a carbon-based material such as an ashable hardmask. In various examples, the precoat is a silicon-doped carbon film. Other types of precoats may be used in other cases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:操作</p>
        <p type="p">103:操作</p>
        <p type="p">105:操作</p>
        <p type="p">107:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1532" publication-number="202617131">
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          <doc-number>202617131</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產製脂質奈米粒子之方法</chinese-title>
        <english-title>METHOD FOR PRODUCING LNPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260202B">A61K9/127</main-classification>
        <further-classification edition="201701120260202B">A61K47/60</further-classification>
        <further-classification edition="201701120260202B">A61K47/69</further-classification>
        <further-classification edition="201101120260202B">B82Y5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛格瑪艾瑞契有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMA-ALDRICH CO. LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　巧華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, QIAOHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡聞乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-CHYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勵依儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YIYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, KIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特斯　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTERS, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚　剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於產製脂質奈米粒子(LNP)之方法，其包括以下步驟：(a)進行用於製備LNP之參考方法，該參考方法包括(a1)經由第一混合室之第一入口埠引入水性溶液之第一入口物流，及經由該第一混合室之第二入口埠引入脂質溶液之第二入口物流，由此混合該水性溶液及該脂質溶液以便產製LNP，及(a2)經由該第一混合室之出口埠回收包含所產製LNP之第一出口物流之步驟；及(b)根據該參考方法在第二混合室中產製LNP，其中該第二混合室之第一入口埠、第二入口埠及出口埠之內徑各按相同因子成比例地比該第一混合室之第一入口埠、第二入口埠及出口埠之內徑大至少5%，其中該第一出口物流及該第二出口物流之線性流速基本上相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for producing lipid nanoparticles (LNPs), comprising the steps of (a) performing a reference method for the preparation of LNPs, the reference method comprising the steps of (a1) introducing a first inlet stream of an aqueous solution via a first inlet port of a first mixing chamber, and introducing a second inlet stream of a lipid solution via a second inlet port of the first mixing chamber, thereby mixing the aqueous solution and the lipid solution so as to produce LNPs, and (a2) recovering a first outlet stream comprising the produced LNPs via an outlet port of the first mixing chamber, and (b) producing LNPs according to the reference method in a second mixing chamber, wherein the inner diameters of the first inlet port, second inlet port and outlet port of the second mixing chamber are each by the same factor proportionally bigger by at least 5% than the inner diameters of the first inlet port, second inlet port and outlet port of the first mixing chamber, wherein the linear flow rate of the first outlet stream and the second outlet stream are essentially identical.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1533" publication-number="202617950">
    <tif-files tif-type="multi-tif">
      <tif file="114124353.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>（全）氟聚醚聚合物組成物</chinese-title>
        <english-title>(PER)FLUOROPOLYETHER POLYMER COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C10M147/04</main-classification>
        <further-classification edition="200601120260202B">C10M175/00</further-classification>
        <further-classification edition="200601120260202B">C10M177/00</further-classification>
        <further-classification edition="200601320260202B">C10N20/00</further-classification>
        <further-classification edition="200601320260202B">C10N30/06</further-classification>
        <further-classification edition="200601320260202B">C10N40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商世索科專業聚合物義大利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYENSQO SPECIALTY POLYMERS ITALY S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦西斯　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WLASSICS, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒芬提　史帝芬諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLEFANTI, STEFANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安特努奇　艾曼紐拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTENUCCI, EMANUELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種包含至少一種全氟聚醚(PFPE)聚合物和含氫化合物的組成物，並且關於其在包括真空系統的若干行業中作為潤滑劑之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition comprising at least one perfluoropolyether (PFPE) polymer and hydrogen-containing compounds, and to its use as lubricant in several industries, including vacuum systems.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1534" publication-number="202617682">
    <tif-files tif-type="multi-tif">
      <tif file="114124359.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於液相肽及寡核苷酸合成之選擇性可溶三醯胺衍生撐體</chinese-title>
        <english-title>SELECTIVELY SOLUBLE TRIAMIDE-DERIVED SUPPORTS FOR LIQUID-PHASE PEPTIDE AND OLIGONUCLEOTIDE SYNTHESIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C237/42</main-classification>
        <further-classification edition="200601120260202B">C07H21/00</further-classification>
        <further-classification edition="200601120260202B">C07H1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維諾達有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERANOVA, L.P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚慶偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, QINGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯歐　艾力克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOVAL, ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福斯特　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSTER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考夫林　丹尼　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUGHLIN, DANIEL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種保護試劑，其甚至在酸性條件下可以高產率移除，並且可在有機合成反應，諸如肽合成、寡核苷酸合成及類似者中，提供高純度之所得產物。該保護試劑為衍生自三醯胺的式(I)之選擇性可溶化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a protecting reagent that can be removed in a high yield even under acidic conditions and can afford a resulting product at a high purity in an organic synthesis reaction such as peptide synthesis, oligonucleotide synthesis, and the like. The protecting reagent is a selectively soluble compound of Formula (I), which is derived from a triamide.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1535" publication-number="202617684">
    <tif-files tif-type="multi-tif">
      <tif file="114124361.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物、聚合物、全像記錄媒體、光學材料、及光學零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C271/16</main-classification>
        <further-classification edition="200601120260202B">C07C271/48</further-classification>
        <further-classification edition="200601120260202B">C07C275/10</further-classification>
        <further-classification edition="200601120260202B">C07D417/14</further-classification>
        <further-classification edition="200601120260202B">C08F220/36</further-classification>
        <further-classification edition="200601120260202B">G02B5/32</further-classification>
        <further-classification edition="200601120260202B">G03H1/02</further-classification>
        <further-classification edition="200601120260202B">G11B7/0065</further-classification>
        <further-classification edition="200601120260202B">G11B7/244</further-classification>
        <further-classification edition="201301120260202B">G11B7/24044</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部晃子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABE, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下修治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名倉椋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKURA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上一真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門間裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組合物，其適於形成具有較高之耐溶劑性，且具有高折射率之硬化膜。本發明係一種組合物，其係包含下述聚合性化合物(A)及下述聚合性化合物(B)者，且相對於上述聚合性化合物(A)100質量份，上述聚合性化合物(B)之含量為0.0001質量份以上且10質量份以下。  &lt;br/&gt;聚合性化合物(A)：具有下述式(1)所表示之結構，且折射率為1.60以上之化合物  &lt;br/&gt;聚合性化合物(B)：下述式(2)所表示之化合物          &lt;img align="absmiddle" height="283px" width="412px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sup&gt;1&lt;/sup&gt;為氫原子或甲基。L&lt;sup&gt;1&lt;/sup&gt;為(n&lt;sup&gt;1&lt;/sup&gt;＋1)價連結基。n&lt;sup&gt;1&lt;/sup&gt;為1或2。式(2)中，R&lt;sup&gt;2&lt;/sup&gt;為氫原子或甲基。L&lt;sup&gt;2&lt;/sup&gt;為(n&lt;sup&gt;2&lt;/sup&gt;＋1)價連結基。n&lt;sup&gt;2&lt;/sup&gt;為1或2)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">LD:記錄光用半導體雷射光源</p>
        <p type="p">LED:後曝光用LED</p>
        <p type="p">M1:鏡</p>
        <p type="p">M2:鏡</p>
        <p type="p">PD1:光偵測器</p>
        <p type="p">PD2:光偵測器</p>
        <p type="p">PBS:偏振分光鏡</p>
        <p type="p">S:全像記錄用媒體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1536" publication-number="202617063">
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      <tif file="114124376.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124376</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物水平管理方法及系統、分析物檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>ANALYTE LEVEL MANAGEMENT METHOD AND SYSTEM, ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61B5/00</main-classification>
        <further-classification edition="200601120260123B">A61B5/1455</further-classification>
        <further-classification edition="200601120260123B">A61B5/145</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物水平管理及分析物檢測方法、系統、媒體及設備，屬於光學分析領域，所述方法包括：數據採集步驟：實時採集反映分析物受到光線照射而產生的反射信號或者激發信號在成像區域中不均勻分佈的光譜數據；模型分析步驟：將採集到的光譜數據輸入分析物檢測模型，得到成像區域中分析物的水平，所述分析物的水平包括分析物與光譜數據關聯的信息；提醒步驟：在分析物的水平超過預設範圍時，展示提醒信息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and equipment for managing and detecting analytes belong to the field of optical analysis. The method comprises: a data acquisition step for real-time acquisition of spectral data reflecting the uneven distribution of reflection signals or excitation signals generated by analytes exposed to light in an imaging area; a model analysis step for inputting the acquired spectral data into an analyte detection model to obtain the level of the analyte in the imaging area, wherein the level of the analyte includes information associated with the analyte and the spectral data; and a reminder step for displaying a reminder message when the level of the analyte exceeds a preset range.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1537" publication-number="202617075">
    <tif-files tif-type="multi-tif">
      <tif file="114124379.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物檢測中的圖像處理方法及系統、分析物檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND SYSTEM FOR ANALYTE DETECTION, ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="200601120260127B">G01N21/64</further-classification>
        <further-classification edition="201701120260127B">G06T7/11</further-classification>
        <further-classification edition="200601120260127B">G06T5/50</further-classification>
        <further-classification edition="202201120260127B">G06V40/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物檢測中的圖像處理方法、系統、媒體及設備，包括：通過紅外光照射第一區域並成像，得到成像區域的第一圖像；根據第一圖像的灰度分佈，將成像區域劃分為不同的灰度區域；選擇灰度值符合預設要求的灰度區域作為血管所在區域；通過紫外光照射第一區域並成像，得到成像區域的第二圖像；從第二圖像中血管所在區域對應的位置選取多個灰度值符合要求的像素點作為檢測點；根據所選檢測點計算灰度平均值，去除灰度值與灰度平均值差值超過預設範圍的檢測點，並再次補充選擇新檢測點，直至所有檢測點的灰度值與灰度平均值差值在預設範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing method, system, media, and device for analyte detection include: irradiating a first area with infrared light and imaging it to obtain a first image of the imaging area; dividing the imaging area into different grayscale areas based on the grayscale distribution of the first image; selecting a grayscale area whose grayscale value meets preset requirements as the area where a blood vessel is located; irradiating the first area with ultraviolet light and imaging it to obtain a second image of the imaging area; selecting a plurality of pixel points whose grayscale values meet the requirements from positions corresponding to the area where the blood vessel is located in the second image as detection points; calculating the grayscale average value based on the selected detection points, removing detection points whose grayscale value difference with the grayscale average value exceeds a preset range, and selecting new detection points again until the grayscale value difference with the grayscale average value of all detection points is within the preset range.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1538" publication-number="202617076">
    <tif-files tif-type="multi-tif">
      <tif file="114124384.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物光譜採集系統及檢測系統</chinese-title>
        <english-title>ANALYTE SPECTRUM ACQUISITION SYSTEM AND DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">A61B5/1455</main-classification>
        <further-classification edition="200601120260126B">A61B5/145</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物光譜採集系統及檢測系統，包括殼體和成像光譜探測裝置，成像光譜探測裝置獲取成像區域的光信號，成像光譜探測裝置包括傳感器和週期性像素級濾光結構，週期性像素級濾光結構設置在傳感器表面；週期性像素級濾光結構對進入的光信號進行光譜調製，傳感器生成包含待測光譜信息的圖像。本申請設置在傳感器表面的週期性像素級濾光結構對進入的光信號進行光譜調製，以便於傳感器生成包含待測光譜信息的圖像，有助於提高分析物光譜採集的便捷性，檢測時無需與分析物電化學反應，特別是對活體中的分析物進行檢測時，實現無創檢測的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An analyte spectrum acquisition system and detection system includes a housing and an imaging spectrum detection device. The imaging spectrum detection device acquires light signals from an imaging area. The imaging spectrum detection device includes a sensor and a periodic pixel-level filter structure. The periodic pixel-level filter structure is disposed on the surface of the sensor. The periodic pixel-level filter structure spectrally modulates the incoming light signal, and the sensor generates an image containing the spectral information to be measured. The periodic pixel-level filter structure disposed on the surface of the sensor in the present application spectrally modulates the incoming light signal so that the sensor generates an image containing the spectral information to be measured, which helps to improve the convenience of analyte spectrum acquisition. No electrochemical reaction with the analyte is required during detection, especially when detecting analytes in living organisms, thereby achieving the purpose of non-invasive detection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像區域</p>
        <p type="p">200:檢測設備</p>
        <p type="p">201:光源</p>
        <p type="p">202:成像光譜探測裝置</p>
        <p type="p">203:控制器</p>
        <p type="p">204:第一帶通濾光片</p>
        <p type="p">205:鏡頭</p>
        <p type="p">206:第二帶通濾光片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1539" publication-number="202617077">
    <tif-files tif-type="multi-tif">
      <tif file="114124385.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="200601120260127B">A61B5/145</further-classification>
        <further-classification edition="200601120260127B">G01N21/25</further-classification>
        <further-classification edition="201701120260127B">G06T7/00</further-classification>
        <further-classification edition="201701120260127B">G06T7/11</further-classification>
        <further-classification edition="201701120260127B">G06T7/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物的檢測方法、系統、媒體及設備，方法包括：成像步驟：通過第一波長範圍內的結構光照射第一區域並對第一區域進行成像，得到成像區域的第一圖像；以及通過第二波長範圍內的紫外光照射第一區域並對第一區域進行成像，得到成像區域的第二圖像；光譜獲取步驟：從第一圖像中獲取反映分析物在成像區域中不均勻分佈的深度信息；根據深度信息，從第二圖像中獲取所需位置的反映分析物在成像區域中不均勻分佈的光譜數據；分析步驟：根據獲取的光譜數據得到成像區域中分析物的信息。本申請實現檢測點、參考點的準確選擇，讓檢測結果更準確。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and device for detecting an analyte are provided. The method includes: an imaging step in which a first region is illuminated by structured light within a first wavelength range and imaged to obtain a first image of the imaging region; and the first region is illuminated by ultraviolet light within a second wavelength range and imaged to obtain a second image of the imaging region; a spectral acquisition step in which depth information reflecting the uneven distribution of the analyte in the imaging area is obtained from the first image; and spectral data reflecting the uneven distribution of the analyte in the imaging area at a desired location is obtained from the second image based on the depth information; and an analysis step in which information about the analyte in the imaging area is obtained based on the obtained spectral data. The application enables accurate selection of detection points and reference points, resulting in more accurate detection results.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1540" publication-number="202617078">
    <tif-files tif-type="multi-tif">
      <tif file="114124386.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="200601120260127B">A61B5/145</further-classification>
        <further-classification edition="200601120260127B">G01N21/25</further-classification>
        <further-classification edition="201701120260127B">G06T7/00</further-classification>
        <further-classification edition="201701120260127B">G06T7/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物的檢測方法、系統、媒體及設備，方法包括：成像步驟：通過第一波長範圍內的單波長紅外光照射第一區域並進行成像，得到成像區域的第一圖像；通過第二波長範圍內的紫外光照射第一區域並進行成像，得到成像區域的第二圖像；光譜獲取步驟：從第一圖像中獲取反映分析物的灰度分佈情況數據；根據灰度分佈情況數據，分別從第一圖像和第二圖像中獲取所需位置的反映分析物的紅外光強度值和螢光光譜數據；分析步驟：根據紅外光強度值和螢光光譜數據得到成像區域中分析物的信息。本申請實現檢測點、參考點的準確選擇，讓檢測結果更準確。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and device for detecting an analyte are provided. The method comprises: an imaging step: illuminating a first region with single-wavelength infrared light within a first wavelength range and imaging the region to obtain a first image of the imaged region; illuminating the first region with ultraviolet light within a second wavelength range and imaging the region to obtain a second image of the imaged region; a spectral acquisition step: acquiring grayscale distribution data reflecting the analyte from the first image; and, based on the grayscale distribution data, acquiring infrared light intensity values and fluorescence spectrum data reflecting the analyte at desired locations from the first and second images, respectively; and an analysis step: acquiring information about the analyte in the imaged region based on the infrared light intensity values and fluorescence spectrum data. The application enables accurate selection of detection points and reference points, resulting in more accurate detection results.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1541" publication-number="202617079">
    <tif-files tif-type="multi-tif">
      <tif file="114124387.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="200601120260127B">A61B5/145</further-classification>
        <further-classification edition="200601120260127B">G01N21/25</further-classification>
        <further-classification edition="201701120260127B">G06T7/00</further-classification>
        <further-classification edition="201701120260127B">G06T7/11</further-classification>
        <further-classification edition="201701120260127B">G06T7/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物的檢測方法、系統、媒體及設備，包括：通過第一波長範圍內的寬譜的可見光或近紅外光或可見-近紅外光照射第一區域並進行成像，得到成像區域的第一圖像；通過第二波長範圍內的紫外光照射第一區域並進行成像，得到成像區域的第二圖像；從第一圖像中獲取反映分析物的顏色或灰度分佈情況數據；根據顏色或灰度分佈情況數據，分別從第一圖像和第二圖像中獲取所需位置的反映分析物的反射光譜數據和螢光光譜數據；根據反射光譜數據和螢光光譜數據得到成像區域中分析物的信息。本申請實現檢測點、參考點的準確選擇，讓檢測結果更準確。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and device for detecting an analyte comprise: illuminating a first region with broad-spectrum visible light, near-infrared light, or visible-near-infrared light within a first wavelength range and imaging the region to obtain a first image of the imaged region; illuminating the first region with ultraviolet light within a second wavelength range and imaging the region to obtain a second image of the imaged region; obtaining color or grayscale distribution data reflecting the analyte from the first image; obtaining reflectance spectrum data and fluorescence spectrum data reflecting the analyte at desired locations from the first and second images, respectively, based on the color or grayscale distribution data; and obtaining information about the analyte in the imaged region based on the reflectance spectrum data and fluorescence spectrum data. The application enables accurate selection of detection points and reference points, resulting in more accurate detection results.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1542" publication-number="202617080">
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          <doc-number>202617080</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124388</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="200601120260127B">A61B5/145</further-classification>
        <further-classification edition="200601120260127B">G01N21/25</further-classification>
        <further-classification edition="201701120260127B">G06T7/00</further-classification>
        <further-classification edition="201701120260127B">G06T7/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物的檢測方法、系統、媒體及設備，包括：成像步驟：通過第一波長範圍內的寬譜的可見光或近紅外光或可見-近紅外光照射第一區域並進行成像，得到成像區域的第一圖像；光譜獲取步驟：從第一圖像中獲取反映分析物在成像區域中不均勻分佈的顏色或灰度分佈情況數據；根據所述顏色或灰度分佈情況數據，從第一圖像中獲取所需位置的反映分析物在成像區域中不均勻分佈的反射光譜數據；分析步驟：根據獲取的反射光譜數據得到成像區域中分析物的信息。本申請進一步實現檢測點、參考點的準確選擇，讓檢測結果更準確。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and device for detecting an analyte comprise: an imaging step: illuminating a first region with broad-spectrum visible light, near-infrared light, or visible-near-infrared light within a first wavelength range and imaging the region to obtain a first image of the region; a spectral acquisition step: acquiring, from the first image, color or grayscale distribution data reflecting the uneven distribution of the analyte in the region; and, based on the color or grayscale distribution data, acquiring, from the first image, reflectance spectrum data reflecting the uneven distribution of the analyte in the region at a desired location; and an analysis step: obtaining information about the analyte in the region based on the acquired reflectance spectrum data. The application further enables accurate selection of detection points and reference points, resulting in more accurate detection results.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1543" publication-number="202617081">
    <tif-files tif-type="multi-tif">
      <tif file="114124389.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="200601120260127B">A61B5/145</further-classification>
        <further-classification edition="200601120260127B">G01N21/25</further-classification>
        <further-classification edition="201701120260127B">G06T7/00</further-classification>
        <further-classification edition="201701120260127B">G06T7/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物的檢測方法、系統、媒體及設備，包括：成像步驟：通過第一波長範圍內的寬譜可見光/寬譜近紅外光照射第一區域並成像，得到成像區域的第一圖像；通過第二波長範圍內的寬譜近紅外光/寬譜可見光照射第一區域並成像，得到成像區域的第二圖像；光譜獲取步驟：從第一圖像獲取反映分析物的顏色/灰度分佈情況數據；根據顏色/灰度分佈情況數據，分別從第一圖像和第二圖像獲取所需位置的反映分析物的反射光譜數據；分析步驟：根據獲取的反射光譜數據得到成像區域中分析物的信息。本申請實現檢測點、參考點的準確選擇，讓檢測結果準確。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and device for detecting an analyte comprise: an imaging step: illuminating a first region with broadband visible light/broadband near-infrared light within a first wavelength range and imaging the region to obtain a first image of the imaging region; illuminating the first region with broadband near-infrared light/broadband visible light within a second wavelength range and imaging the region to obtain a second image of the imaging region; a spectral acquisition step: acquiring color/grayscale distribution data reflecting the analyte from the first image; and acquiring reflectance spectrum data reflecting the analyte at desired locations from the first and second images, respectively, based on the color/grayscale distribution data; and an analysis step: obtaining information about the analyte in the imaging region based on the acquired reflectance spectrum data. The application enables accurate selection of detection points and reference points, ensuring accurate detection results.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1544" publication-number="202618246">
    <tif-files tif-type="multi-tif">
      <tif file="114124391.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124391</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物檢測中的圖像處理方法及系統、分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND SYSTEM FOR ANALYTE DETECTION, ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260123B">G01N21/35</main-classification>
        <further-classification edition="200601120260123B">A61B5/145</further-classification>
        <further-classification edition="200601120260123B">A61B5/1455</further-classification>
        <further-classification edition="201701120260123B">G06T7/10</further-classification>
        <further-classification edition="200601120260123B">A61B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物檢測中的圖像處理方法、系統、媒體及設備，屬於光學分析領域，所述方法包括：圖像獲取步驟：獲取對第一區域進行成像得到的紅外灰度圖像；分區步驟：根據像素梯度區分暗點和亮點，將紅外灰度圖像分為暗點區域和亮點區域；選點步驟：計算並選擇第一目標候選點；篩選步驟：對第一目標候選點進行離群點檢測和篩選，得到第一目標所在位置。本申請對皮膚上的血管所在區域和非血管所在區域進行劃分，以在對應的區域內選擇採集點，使採集的光學數據更準確。同時，有效篩選和去除候選點中的離群點，降低異常點位對採集結果準確性的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing method, system, media and equipment for analyte detection belong to the field of optical analysis. The method comprises: an image acquisition step: acquiring an infrared grayscale image obtained by imaging a first area; a partitioning step: distinguishing dark spots and bright spots based on pixel gradients, and dividing the infrared grayscale image into a dark spot area and a bright spot area; a point selection step: calculating and selecting a first target candidate point; a screening step: performing outlier detection and screening on the first target candidate point to obtain the location of the first target. The present application divides the area where blood vessels are located and the area where non-blood vessels are located on the skin to select collection points within the corresponding area, making the collected optical data more accurate. At the same time, outliers in the candidate points are effectively screened and removed, reducing the impact of abnormal points on the accuracy of the collection results.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1545" publication-number="202617082">
    <tif-files tif-type="multi-tif">
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      <volno>24</volno>
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      <publication-reference>
        <document-id>
          <doc-number>202617082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124392</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析物檢測的信息顯示方法及系統、分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>INFORMATION DISPLAY METHOD AND SYSTEM FOR ANALYTE DETECTION, ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="200601120260127B">A61B5/145</further-classification>
        <further-classification edition="200601120260127B">G01N21/25</further-classification>
        <further-classification edition="200601120260127B">G06T11/20</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物檢測、信息顯示方法、系統、媒體及設備，屬於光學分析領域，所述方法包括：指令獲取步驟：獲取來自用戶的操作指令，操作指令包括檢測指令和統計指令；第一顯示步驟：在操作指令為檢測指令時，啟動分析物檢測系統的檢測流程並在顯示器上顯示正在執行的流程名稱，在檢測流程完成後，在顯示器上顯示分析物的檢測結果以及預設的參考範圍；第二顯示步驟：在操作指令為統計指令時，從分析物檢測系統的存儲器中獲取歷史檢測結果，將所獲取的歷史檢測結果處理為圖表形式在顯示器上顯示。本申請可使用戶瞭解真實的檢測結果變化趨勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and device for analyte detection and information display belong to the field of optical analysis. The method comprises: an instruction acquisition step for acquiring an operation instruction from a user, the operation instruction including a detection instruction and a statistical instruction; a first display step for initiating a detection process of an analyte detection system and displaying the name of the process being executed on a display when the operation instruction is the detection instruction; after the detection process is completed, displaying the analyte detection result and a preset reference range on the display; and a second display step for acquiring historical detection results from the analyte detection system's memory when the operation instruction is the statistical instruction, processing the acquired historical detection results into a chart, and displaying them on the display. The application enables users to understand the actual trend of detection result changes.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1546" publication-number="202617083">
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      <volno>24</volno>
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          <doc-number>202617083</doc-number>
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          <doc-number>114124393</doc-number>
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        <chinese-title>分析物檢測中的圖像處理方法及系統、分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND SYSTEM FOR ANALYTE DETECTION, ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A61B5/1455</main-classification>
        <further-classification edition="201701120260127B">G06T7/11</further-classification>
        <further-classification edition="200601120260127B">G06T5/20</further-classification>
        <further-classification edition="200601120260127B">G01N21/64</further-classification>
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                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
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              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物的檢測、圖像處理方法、系統、媒體及設備，包括：圖像獲取步驟：獲取第一區域的紅外灰度圖像；極小值尋找步驟：將紅外灰度圖像轉化為二維矩陣，依次對x、y方向每行、列矩陣進行求導，找尋極小值點，記錄極小值點兩側像素灰度值保持單調的數量；等尺寸矩陣創建步驟：創建二維矩陣的等尺寸矩陣，對極小值點位進行非零替代；區域篩選步驟：將一矩陣作為卷積核對等尺寸矩陣進行卷積，得到卷積後矩陣之中元素數值越大，代表該點所對應位置在目標區域的概率越大，將該卷積矩陣中元素及其對應位置進行從大到小排序，篩選目標區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media and device for detecting an analyte and processing images comprise: an image acquisition step of acquiring an infrared grayscale image of a first area; a minimum value finding step of converting the infrared grayscale image into a two-dimensional matrix, sequentially performing derivatives on each row and column of the matrix in the x and y directions to find a minimum point, and recording the number of pixel grayscale values on both sides of the minimum point to maintain a monotonic state; an equal-size matrix creation step of creating an equal-size matrix of the two-dimensional matrix and performing non-zero substitution on the minimum point; and a region screening step of convolving the equal-size matrix using a matrix as a convolution kernel, wherein the larger the value of the element in the convolved matrix, the greater the probability that the position corresponding to the point is in the target area, and the elements and their corresponding positions in the convolution matrix are sorted from large to small to screen the target area.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
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  <tw-patent-application no="1547" publication-number="202617074">
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      <volno>24</volno>
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          <doc-number>202617074</doc-number>
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        <document-id>
          <doc-number>114124394</doc-number>
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      <invention-title>
        <chinese-title>分析物檢測的圖像處理方法及系統、分析物檢測的方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND SYSTEM FOR ANALYTE DETECTION, METHOD AND SYSTEM FOR ANALYTE DETECTION, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61B5/145</main-classification>
        <further-classification edition="200601120260123B">A61B5/026</further-classification>
        <further-classification edition="200601120260123B">A61B5/00</further-classification>
        <further-classification edition="201701120260123B">G06T7/00</further-classification>
        <further-classification edition="201701120260123B">G06T7/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商森舒瑞私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENSURA PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宏志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析物的檢測、圖像處理方法、系統、媒體及設備，包括：圖像獲取步驟：獲取第一區域的紅外灰度圖像；第一目標篩選步驟：將紅外灰度圖像轉化為二維矩陣，記錄預先選中的第一目標區域，篩選出橫縱坐標的最大值、最小值：&lt;img align="absmiddle" height="28px" width="53px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="24px" width="40px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="25px" width="43px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="30px" width="45px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；檢索區域確定步驟：將&lt;img align="absmiddle" height="26px" width="84px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="26px" width="70px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="27px" width="63px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="25px" width="30px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="27px" width="82px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;作為檢索區域邊界，m為預設的拓展距離，得到檢索區域；第二目標篩選步驟：對檢索區域依據灰度進行從大到小排序，選擇灰度最大的前預設數量個坐標作為第二目標區域。可以分辨出紅外灰度圖像中的無血管的皮膚區域，以便準確獲取圖像中無血管的皮膚區域的光譜數據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, system, media, and device for detecting and processing analytes comoprise: an image acquisition step: acquiring an infrared grayscale image of a first region; a first target screening step: converting the infrared grayscale image into a two-dimensional matrix, recording a preselected first target region, and screening out the maximum and minimum values of the horizontal and vertical coordinates: &lt;img align="absmiddle" height="28px" width="53px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="24px" width="40px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="25px" width="43px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="30px" width="45px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;; a search region determination step: using &lt;img align="absmiddle" height="26px" width="84px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;br/&gt;&lt;img align="absmiddle" height="26px" width="70px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="27px" width="63px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;img align="absmiddle" height="25px" width="30px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="27px" width="82px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;as search region boundaries, with m being a preset expansion distance, to obtain the search region; and a second target screening step: sorting the search regions from largest to smallest based on grayscale, selecting the preset number of coordinates with the largest grayscale as the second target region. The application can identify avascular skin regions in the infrared grayscale image, thereby allowing accurate acquisition of spectral data for the avascular skin regions in the image.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1548" publication-number="202617848">
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      <volno>24</volno>
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        <document-id>
          <doc-number>114124398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>再循環聚烯烴除臭方法</chinese-title>
        <english-title>RECYCLED POLYOLEFINS DEODORIZATION PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C08J11/04</main-classification>
        <further-classification edition="201901120260129B">B29C48/05</further-classification>
        <further-classification edition="200601120260129B">B01D19/00</further-classification>
        <further-classification edition="200601120260129B">B29B7/84</further-classification>
        <further-classification edition="200601120260129B">B01J20/08</further-classification>
        <further-classification edition="200601120260129B">C08F2/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商佛沙里斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSALIS S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯卡維洛　弗朗西斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCAVELLO, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費利薩里　里卡多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELISARI, RICCARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋扎尼　埃米利亞諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEZZANI, EMILIANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿桑德里　法比奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSANDRI, FABIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐蒂塞洛　安東尼奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PONTICIELLO, ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里奇　毛羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICCI, MAURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
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      <isu-abst lang="tw">
        <p type="p">一種用於製造經除臭聚烯烴的方法，其始於一消費後再循環聚烯烴原料。該方法進一步包含落股式除臭技術，其在特定製程參數下顯著降低了原料中的帶氣味物質，尤其是半揮發性有機化合物(SVOC)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Process for the production of deodorized polyolefins, starting from a post-consumer recycled polyolefins feedstock. The process further comprises the falling strand deodorization technology, which, under specific process parameters, significantly reduces the odoriferous substances and, particularly, the semi-volatile organic compounds (SVOCs) of the feedstock.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:除臭裝置</p>
        <p type="p">3:入口區段</p>
        <p type="p">5:分配器，第一分配器，第二同心分配器</p>
        <p type="p">6:孔隙</p>
        <p type="p">8:蒸氣出口，蒸氣輸出口</p>
        <p type="p">10:封閉容器</p>
        <p type="p">12:收納部，部件，聚合物出口</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1549" publication-number="202617849">
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        <document-id>
          <doc-number>114124399</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>用於食品接觸級應用之再循環乙烯基芳香族聚合物去污方法</chinese-title>
        <english-title>RECYCLED VINYL AROMATIC POLYMERS DECONTAMINATION PROCESS FOR FOOD-CONTACT GRADE APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C08J11/04</main-classification>
        <further-classification edition="201901120260130B">B29C48/05</further-classification>
        <further-classification edition="200601120260130B">B29B17/00</further-classification>
        <further-classification edition="200601120260130B">C08F6/10</further-classification>
        <further-classification edition="200601120260130B">C07C15/46</further-classification>
        <further-classification edition="200601120260130B">C07C7/04</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商佛沙里斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSALIS S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲奧羅托　尼古拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIOROTTO, NICOLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比洛蒂　克勞迪奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BILOTTI, CLAUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加維奧利　薩拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAVIOLI, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費利薩里　里卡多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELISARI, RICCARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利昂　馬可　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEONE, MARCO ALESSIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里埃羅　弗朗西斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARRIERO, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">食品接觸級乙烯基芳香族聚合物之製造方法，其始於消費後再循環乙烯基芳香族原料。該方法進一步包含落股式去污技術，其在特定製程參數下顯著減少該原料的污染物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Process for the production of food-contact grade vinyl aromatic polymers, starting from a post-consumer recycled vinyl aromatic feedstock. The process further comprises the falling strand decontamination technology, which, under specific process parameters, significantly reduces the contaminates of the feedstock.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:去污裝置</p>
        <p type="p">3:入口區段</p>
        <p type="p">5:分配器，第一分配器，第二同心分配器</p>
        <p type="p">6:孔隙</p>
        <p type="p">8:蒸氣出口</p>
        <p type="p">10:封閉容器</p>
        <p type="p">12:聚合物出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1550" publication-number="202618539">
    <tif-files tif-type="multi-tif">
      <tif file="114124402.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擴展記憶體的裝置及其方法</chinese-title>
        <english-title>APPARATUS FOR EXTENDED MEMORY AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G06F3/06</main-classification>
        <further-classification edition="200601120260123B">G06F12/02</further-classification>
        <further-classification edition="200601120260123B">G06F15/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　瑪麗　梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, MARIE MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮楚馬尼　瑞卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITCHUMANI, REKHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種擴展記憶體的裝置及其方法。一種擴展記憶體的裝置可包括：第一處理器件；第二處理器件；第一記憶體器件；以及第二記憶體器件。第一邏輯記憶體空間及第二邏輯記憶體空間被配置成分別分配給第一處理器件及第二處理器件。第一邏輯記憶體空間及第二邏輯記憶體空間更被配置成映射至第一記憶體器件或第二記憶體器件中的一者的第一實體記憶體空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus for extended memory and method thereof are disclosed. An apparatus for extended memory may include a first processing device; a second processing device; a first memory device; and a second memory device. A first logical memory space and a second logical memory space are configured to be allocated for respectively the first processing device and the second processing device. The first logical memory space and the second logical memory space are further configured to be mapped to a first physical memory space of one of the first memory device or the second memory device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計算記憶體器件</p>
        <p type="p">102:處理器件</p>
        <p type="p">104:擴展記憶體器件</p>
        <p type="p">106:基礎晶粒</p>
        <p type="p">108:記憶體晶粒</p>
        <p type="p">110:資料通訊鏈路</p>
        <p type="p">112:主機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1551" publication-number="202617148">
    <tif-files tif-type="multi-tif">
      <tif file="114124404.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124404</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療眼後段疾病之方法</chinese-title>
        <english-title>METHODS FOR TREATING POSTERIOR SEGMENT EYE DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/4709</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商協和麒麟股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOWA KIRIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田晋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORITA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示治療患有眼後段疾病之人類患者之方法，該方法包括每天向該人類患者之該眼睛經局部投與維持有效劑量之替沃尼布(tivozanib)調配物作為維持期劑量或治療有效劑量之替沃尼布調配物1至3次。該方法可進一步包括使用抗VEGF藥劑進行誘導期治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are methods of treating a human patient with a posterior segment eye disease, the method comprising topically administering a maintenance effective dose of a tivozanib formulation as a maintenance phase dose or a therapeutically effective dose of a tivozanib formulation 1 to 3 times per day to the eye of the human patient. The method may further comprise an induction phase treatment with an anti-VEGF agent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1552" publication-number="202617144">
    <tif-files tif-type="multi-tif">
      <tif file="114124405.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為沃納症候群ＲＥＣＱ　ＤＮＡ解旋酶調節劑的５員核心化合物及其用途</chinese-title>
        <english-title>5-MEMBERED CORE COMPOUNDS AS MODULATORS OF WERNER SYNDROME RECQ DNA HELICASE AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">A61K31/425</main-classification>
        <further-classification edition="200601120260116B">A61K31/4155</further-classification>
        <further-classification edition="200601120260116B">A61K31/4025</further-classification>
        <further-classification edition="200601120260116B">C07D207/09</further-classification>
        <further-classification edition="200601120260116B">C07D403/04</further-classification>
        <further-classification edition="200601120260116B">C07D417/14</further-classification>
        <further-classification edition="200601120260116B">A61K31/145</further-classification>
        <further-classification edition="200601120260116B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瑪亞　路里亞　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAYO, NURIA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿拉費特阿迪里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALAFATE, ADILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝蘭查德　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLANCHARD, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋恩斯　柯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAINES, COLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古靈曼　凱文　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENMAN, KEVIN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特　伊美爾達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOT, IMELDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ME</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇勒　馬修　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALLER, MATTHEW R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普里艾托　庫莫　凱撒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIETO KULLMER, CESAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭門　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANMAN, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛培茲　派翠西亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ, PATRICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, VU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪諾尼　弗蘭塞斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANONI, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥迪納　喬斯　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDINA, JOSE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　葛瑞克　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, GARRICK PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏恩杜堤　米勞尼　麥塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNDURTY, MILAUNI MEHTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維斯特蓋德　麥克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VESTERGAARD, MIKKEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　惠玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝晶晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, JINGJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="20">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WENHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了具有作為沃納症候群RecQ DNA解旋酶（WRN）抑制劑的活性的化合物，包含該等化合物的藥物組成物，以及治療某些病症（例如癌症，包括但不限於結直腸癌、子宮內膜癌、胃癌和卵巢癌）的方法。特別地，本揭露提供了式 (A-I) 的化合物：&lt;img align="absmiddle" height="98px" width="129px" file="ed11289.JPG" alt="ed11289.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ，及其藥學上可接受的鹽，其中取代基如本文所述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are compounds having activity as inhibitors of Werner Syndrome RecQ DNA helicase (WRN), pharmaceutical compositions comprising the compounds, and methods of treating certain disorders, such as cancer, including but not limited to colorectal, endometrial, gastric and ovarian cancer. In particular, the disclosure provides compounds of Formula (A-I): &lt;img align="absmiddle" height="87px" width="144px" file="ed11290.JPG" alt="ed11290.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , and pharmaceutically acceptable salts thereof, wherein the substituents are as described herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1553" publication-number="202617394">
    <tif-files tif-type="multi-tif">
      <tif file="114124409.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124409</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>容器蓋子的切割方法</chinese-title>
        <english-title>METHOD FOR CUTTING CLOSURES FOR CONTAINERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B26D1/00</main-classification>
        <further-classification edition="200601120260123B">B26D5/20</further-classification>
        <further-classification edition="200601120260123B">B26D5/24</further-classification>
        <further-classification edition="200601120260123B">B26D7/06</further-classification>
        <further-classification edition="200601120260123B">B26D7/26</further-classification>
        <further-classification edition="200601120260123B">B26D1/03</further-classification>
        <further-classification edition="200601120260123B">B26D3/00</further-classification>
        <further-classification edition="200601120260123B">B65D41/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商沙克米機械商業合作艾莫勒精簡公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACMI COOPERATIVA MECCANICI IMOLA SOCIETA' COOPERATIVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘納利　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENAZZI, DAVIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫圖里尼　馬蒂歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENTURINI, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門左利尼　魯傑羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENZOLINI, RUGGERO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文說明了一種用於“系留”型蓋子的切割方法，其中使攜帶蓋子的主軸朝向具有一個或多個水平刀片和至少一個垂直或傾斜刀片的切割器件移動。在切割時，所述主軸旋轉，並且所述蓋子在所述切割器件上滾動。將所述主軸若干次饋送到所述切割器件，每次攜帶不同的蓋子，所述主軸包含由比所述刀片更柔軟的材料製成的部分，因此當切割時，所述刀片穿透到蓋子材料中並且因此插進所述主軸的所述較柔軟部分中。使將所述蓋子攜帶朝向所述切割器件的主軸饋送與所述主軸的旋轉相協調，使得每次將所述主軸饋送到所述切割器件時，所述垂直或傾斜刀片總是遇到所述主軸的所述較柔軟部分的同一區域。所述方法提供了初步步驟，在所述初步步驟中，使所述刀片以這樣的方式移動，即，從遠離標稱工作位置的初始位置開始逐漸增加所述刀片插進所述柔軟部分中的深度，並且到達最終位置，在所述最終位置中，所述刀片以比所述刀片在其處於所述標稱工作位置時插進的深度更大的深度插進所述柔軟部分中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Herein described is a cutting method for closure of the “tethered” type, wherein a spindle which carries a closure is moved towards a cutting device with one or more horizontal blades and at least one vertical or oblique blade. When cutting, the spindle rotates and the closure rolls on the cutting device. The spindle, which is fed several times to the cutting device each time carrying a different closure comprising a portion made of a material softer than the blades, therefore when cutting the blades penetrate into the closure material and therefore sink into the softer portion of the spindle. The spindle feed which carries the closure towards the cutting device is coordinated with the rotation of the spindle so that the vertical or oblique blade, each time the spindle is fed to the cutting device, always encounters the same area of the softer portion of the spindle. The method provides for a preliminary step in which the blades are moved in such a way as to gradually increase the depth with which they sink into the soft portion starting from an initial position distant from a nominal working position and reaching a final position in which the blades sink into the soft portion with a greater depth than the depth with which they sink when they are in the nominal working position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:蓋子</p>
        <p type="p">3:切割器件</p>
        <p type="p">4:水平刀片</p>
        <p type="p">5:垂直或傾斜刀片</p>
        <p type="p">6:主軸</p>
        <p type="p">7:柔軟部分</p>
        <p type="p">10:支撐主體</p>
        <p type="p">11:鎖定環形元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1554" publication-number="202619200">
    <tif-files tif-type="multi-tif">
      <tif file="114124428.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01R13/652</main-classification>
        <further-classification edition="201101120260123B">H01R13/6471</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王裕民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIA-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林南宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, NAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬世勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, SHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳祖陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，其包括絕緣體及設置於所述絕緣體上若干信號端子及若干接地端子，所述信號端子排列成至少一對並用以傳輸差分信號，所述接地端子包括分別設置在所述一對信號端子兩側并与信号端子排列成一排的第一接地端子和第二接地端子，所述接地端子向配合方向延伸且超出所述一對信號端子，所述電連接器進一步包括導電件，所述導電件與所述第一接地端子及第二接地端子電性連接但未與所述一對信號端子電性連接，所述第一接地端子及第二接地端子與所述導電件的導電率相同。本發明中的電連接器可提供更好的接地性能，且製程簡單，成本低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a insulative housing and plural signal terminals and plural ground terminals disposed on the insulative housing. The signal terminals are arranged in at least one pair and are used to transmit differential signals. The ground terminals include a first ground terminal and a second ground terminal respectively arranged on both sides of the pair of signal terminals and are arranged in a row with the signal terminals. The ground terminal extends beyond the pair of signal terminals along the mating direction. The electrical connector further includes a conductive member disposed on the insulative housing, the conductive member is electrically connected to the first ground terminal and the second ground terminal but is not electrically connected to the pair of signal terminals, and the first ground terminal and the second ground terminal have the same conductivity as the conductive member. The electrical connector of the present invention can provide better grounding performance, and has a simple manufacturing process and low cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電連接器</p>
        <p type="p">110:絕緣體</p>
        <p type="p">111:基部</p>
        <p type="p">112:舌板</p>
        <p type="p">115:配合面</p>
        <p type="p">120:導電端子</p>
        <p type="p">1211b,1221b:配合區</p>
        <p type="p">1211c,1221c:導引末端</p>
        <p type="p">141:第一部分</p>
        <p type="p">1411:平臺部</p>
        <p type="p">142:第二部分</p>
        <p type="p">1421:缺口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1555" publication-number="202619339">
    <tif-files tif-type="multi-tif">
      <tif file="114124436.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124436</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視訊寫碼中的適應性迴路濾波器聯合最佳化</chinese-title>
        <english-title>ADAPTIVE LOOP FILTER JOINT OPTIMIZATION IN VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260126B">H04N19/117</main-classification>
        <further-classification edition="201401120260126B">H04N19/147</further-classification>
        <further-classification edition="201401120260126B">H04N19/176</further-classification>
        <further-classification edition="201401120260126B">H04N19/82</further-classification>
        <further-classification edition="201401120260126B">H04N19/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲維克茲　馬塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鴻滔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞瑞金　法迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEREGIN, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示了一種用於解碼視訊資料之裝置，該裝置經組態以：接收該視訊資料之第一圖像之區塊的旗標，其中該旗標的第一值指示該區塊的濾波器參數待傳訊，且其中該旗標的第二值指示該區塊的該等濾波器參數待從該視訊資料之第二圖像之共同定位區塊再利用；回應於該旗標等於該第二值，使用該共同定位區塊的該等濾波器參數對該第一圖像之該區塊進行濾波，以便判定第一經濾波區塊；基於該第一經濾波區塊判定該第一圖像之該區塊的經解碼版本；及輸出該視訊資料的經解碼圖像，該經解碼圖像包括該第一圖像的該經解碼版本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for decoding video data is configured to receive a flag for a block of a first picture of the video data, wherein a first value for the flag indicates that filter parameters for the block are to be signaled and wherein a second value for the flag indicates that the filter parameters for the block are to be reused from a collocated block of a second picture of the video data; in response to the flag being equal to the second value, filter the block of the first picture using the filter parameters of the collocated block to determine a first filtered block; determine a decoded version of the block of the first picture based on the first filtered block; and output a decoded picture of the video data that includes the decoded version of the first picture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:步驟</p>
        <p type="p">602:步驟</p>
        <p type="p">604:步驟</p>
        <p type="p">606:步驟</p>
        <p type="p">608:步驟</p>
        <p type="p">610:步驟</p>
        <p type="p">612:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1556" publication-number="202617715">
    <tif-files tif-type="multi-tif">
      <tif file="114124449.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>咪唑并［１，２－ａ］吡啶化合物的新穎鹽晶型及其製備方法</chinese-title>
        <english-title>CRYSTAL FORM OF NOVEL SALT OF IMIDAZO[1,2-a]PYRIDINE COMPOUND AND PREPARATION METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/04</main-classification>
        <further-classification edition="200601120260202B">A61K31/437</further-classification>
        <further-classification edition="200601120260202B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商第一藥品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEIL PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商安康尼克治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONCONIC THERAPEUTICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全聖賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, SEONG HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安楨丌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, JUNG GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安成完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUNG WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種咪唑并[1,2-a]吡啶化合物的新穎鹽，更具體地，係關於一種氮雜環丁烷-1-基{8-[(2,6-二甲基苄基)胺基]-2,3-二甲基咪唑并[1,2-a]吡啶-6-基}甲酮二磷酸鹽的晶型及其製備方法。根據本發明的該二磷酸鹽晶型展現出優異的溶解度、容積密度、光/熱穩定性以及酸/鹼穩定性，使其在藥物製劑應用方面具有極高的實用價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a novel salt of an imidazo[1,2-a]pyridine compound, and more specifically, to a crystalline form of azetidin-1-yl{8-[(2,6-dimethylbenzyl)amino]-2,3-dimethylimidazo[1,2-a]pyridin-6-yl}methanone diphosphate and a method for preparing the same. The diphosphate crystalline form according to the present invention exhibits excellent solubility, bulk density, light/temperature stability, and acid/base stability, making it highly useful for pharmaceutical formulation applications.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1557" publication-number="202617147">
    <tif-files tif-type="multi-tif">
      <tif file="114124456.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＫＩＦ１８Ａ抑制劑治療非小細胞肺癌的用途</chinese-title>
        <english-title>USE OF KIF18A INHIBITORS IN THE TREATMENT OF NON-SMALL CELL LUNG CARCINOMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/4545</main-classification>
        <further-classification edition="200601120260202B">A61K9/00</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏遠峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊方龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FANG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SI-QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種KIF18A抑制劑在製備治療肺癌（如非小細胞肺癌）疾病的藥物的用途，藥理實驗證明了化合物1或化合物2可以抑制非小細胞肺癌異質瘤生長。與AMG650相比，化合物1或化合物2較低的藥物暴露量可以降低潛在的藥物蓄積毒性。顯示化合物1或化合物2對非小細胞肺癌有明顯治療作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of KIF18A inhibitor in the preparation of a medicament for treating lung carcinoma(such as non-small carcinoma).Pharmacological experiments have demonstrated the Compound 1 or Compound 2 can inhibit the growth of non-small cell lung carcinoma xenografts.Compared with AMG650,the lower drug exposure of Compound 1 or Compound 2 can reduce potential drug accumulation toxicity.The results indicate that Compound 1 or Compound 2 has a significant therapeutic effect on non-small cell lung carcinoma.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1558" publication-number="202617350">
    <tif-files tif-type="multi-tif">
      <tif file="114124466.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617350</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨液供給裝置、研磨裝置、及研磨液供給方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B24B57/02</main-classification>
        <further-classification edition="200601120260123B">H01L21/304</further-classification>
        <further-classification edition="201201120260123B">B24B37/12</further-classification>
        <further-classification edition="201201120260123B">B24B37/30</further-classification>
        <further-classification edition="201201120260123B">B24B37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵永鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, YEONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>檜森洋輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMORI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李應旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案可一邊將漿料的濃度保持為一定，一邊調整添加劑的濃度。本案所提供之研磨液供給裝置370係包含：第一流量控制器386，其係可調整具有預定的漿料濃度且包含添加劑的第一研磨液的流量；第二流量控制器396，其係可調整具有與第一研磨液相同的漿料濃度的第二研磨液的流量；研磨液混合機398，其係將由第一流量控制器386被吐出的第一研磨液與由第二流量控制器396被吐出的第二研磨液加以混合；及噴嘴399，其係將由研磨液混合機398被吐出的第三研磨液供給至研磨平台350。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">350:研磨平台</p>
        <p type="p">370:研磨液供給裝置</p>
        <p type="p">382:第一藥液供給裝置</p>
        <p type="p">383:添加劑濃度感測器</p>
        <p type="p">384:第一閥</p>
        <p type="p">385:定壓閥</p>
        <p type="p">386:第一流量控制器</p>
        <p type="p">392:第二藥液供給裝置</p>
        <p type="p">394:第二閥</p>
        <p type="p">396:第二流量控制器</p>
        <p type="p">398:研磨液混合機</p>
        <p type="p">399:噴嘴</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1559" publication-number="202617751">
    <tif-files tif-type="multi-tif">
      <tif file="114124485.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124485</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備病毒蛋白之方法及其用途</chinese-title>
        <english-title>METHODS FOR PREPARING VIRAL PROTEINS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/005</main-classification>
        <further-classification edition="200601120260202B">C12N7/00</further-classification>
        <further-classification edition="200601120260202B">A61K39/12</further-classification>
        <further-classification edition="200601120260202B">A61K39/145</further-classification>
        <further-classification edition="200601120260202B">A61P31/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯納德　伊莎貝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERNARD, ISABELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾沃薩　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALVOSA, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏雷蒂爾　塞德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHARRETIER, CEDRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬林　文生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARIN, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊尼特　迪迪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLENET, DIDIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請關於用於製備病毒蛋白，例如流感血球凝集素蛋白和/或流感神經胺糖酸苷酶蛋白之方法，包含因此獲得的病毒蛋白的免疫原性組成物和包含其的疫苗，以及使用它們的方法，特別是在預防和/或治療由病毒，例如流感病毒引起的疾病或病症中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to methods for preparing viral proteins, such as influenza hemagglutinin proteins and/or influenza neuraminidase proteins, immunogenic compositions comprising the viral proteins thus obtained and vaccines comprising the same, as well as methods of using the same, in particular in the prevention and/or treatment of diseases or conditions caused by viruses, such as influenza viruses.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1560" publication-number="202617705">
    <tif-files tif-type="multi-tif">
      <tif file="114124486.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為CYP11A1抑制劑之雜環化合物</chinese-title>
        <english-title>HETEROCYCLIC COMPOUNDS AS CYP11A1 INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D401/14</main-classification>
        <further-classification edition="200601120260202B">C07D471/10</further-classification>
        <further-classification edition="200601120260202B">C07D401/12</further-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61K31/444</further-classification>
        <further-classification edition="200601120260202B">A61K31/501</further-classification>
        <further-classification edition="200601120260202B">A61K31/506</further-classification>
        <further-classification edition="200601120260202B">A61K31/53</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商優領醫藥科技（香港）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACERAND THERAPEUTICS (HONG KONG) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁宏斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, HONGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　桑吉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, SANJEEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李曼華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WENMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘偉濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, WEITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游國龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KUO-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了式I的雜環化合物、其藥學上可接受的鹽、其製備方法、包含所述化合物任一種的藥物組合物及其作為CYP11A1抑制劑治療癌症的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are heterocyclic compounds of Formula I, a pharmaceutically acceptable salt thereof, their preparation methods, pharmaceutical compositions containing one of the compounds, and their use as CYP11A1 inhibitors for treating cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1561" publication-number="202617696">
    <tif-files tif-type="multi-tif">
      <tif file="114124487.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ROCK抑制劑及其用途</chinese-title>
        <english-title>ROCK INHIBITORS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D217/02</main-classification>
        <further-classification edition="200601120260202B">A61K31/472</further-classification>
        <further-classification edition="200601120260202B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商愛爾康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALCON INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯普茲恩斯基　卡賽　卡西米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOPCZYNSKI, CASEY CASIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史都迪凡特　吉爾　馬里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STURDIVANT, JILL MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克路爾　麥可　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCLURE, MICHAEL SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬許　安賈利　畢倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOSHI, ANJALI BIREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供包含金剛烷甲酸4-(3-胺基-1-(異喹啉-6-基胺基)-1-側氧基丙-2-基)苄酯之式之化合物(例如式(I)或式(II)之化合物)或其醫藥上可接受之鹽。該等化合物可用於降低眼內壓及用於治療青光眼或眼高壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds comprising a formula of 4-(3-amino-1-(isoquinolin-6-ylamino)-1-oxopropan-2-yl)benzyl adamantane carboxylate (e.g., compounds of formula (I) or formula (II)) or a pharmaceutically acceptable salt thereof. The compounds are useful for reducing intraocular pressure and for treating glaucoma or ocular hypertension.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1562" publication-number="202617716">
    <tif-files tif-type="multi-tif">
      <tif file="114124493.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>咪唑并［１，２－ａ］吡啶化合物的新穎鹽及其製備方法</chinese-title>
        <english-title>NOVEL SALT OF IMIDAZO[1,2-A]PYRIDINE COMPOUND AND PREPARATION METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/04</main-classification>
        <further-classification edition="200601120260202B">A61K31/437</further-classification>
        <further-classification edition="200601120260202B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商第一藥品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEIL PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商安康尼克治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONCONIC THERAPEUTICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全聖賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, SEONG HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安楨丌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, JUNG GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安成完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUNG WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種咪唑并[1,2-a]吡啶化合物的新穎鹽，且更具體地，係關於一種氮雜環丁烷-1-基{8-[(2,6-二甲基苄基)胺基]-2,3-二甲基咪唑并[1,2-a]吡啶-6-基}甲酮二磷酸鹽及其製備方法。根據本發明的該二磷酸鹽展現出優異的溶解度、容積密度、光/溫度穩定性以及酸/鹼穩定性，使其在藥物製劑應用方面具有極高的實用價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a novel salt of an imidazo[1,2-a]pyridine compound, and more specifically, to azetidin-1-yl{8-[(2,6-dimethylbenzyl)amino]-2,3-dimethylimidazo[1,2-a]pyridin-6-yl} methanone diphosphate and a method for preparing the same. The diphosphate according to the present invention exhibits excellent solubility, bulk density, light/temperature stability, and acid/base stability, making it highly useful for pharmaceutical formulation applications.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1563" publication-number="202617087">
    <tif-files tif-type="multi-tif">
      <tif file="114124494.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於陣列定位之設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR ARRAY POSITIONING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260123B">A61B5/256</main-classification>
        <further-classification edition="200601120260123B">A61B5/00</further-classification>
        <further-classification edition="200601120260123B">A61N1/04</further-classification>
        <further-classification edition="200601120260123B">A61N1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮傑昂　安德魯　當肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIDGEON, ANDREW DUNCAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇帝斯　伍德寇克　奈文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS-WOODCOCK, NIVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法瑞　湯姆士　凱瑟琳　安　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARRELL-THOMAS, KATHRYN ANNE LOUISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫爾曼　亨利　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOORMAN, HENRY JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊斯　麥可　羅伯特　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONES, MICHAEL ROBERT GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於將至少一個電極陣列定位於一使用者之一軀幹上的設備。該設備包括一綁帶，該綁帶經組態以圍繞該使用者之該軀幹延伸，其中該綁帶界定經組態以面向該使用者之一內表面。至少一個對準特徵設置於該綁帶之該內表面上，該至少一個對準特徵指示用於將該至少一個電極陣列緊固至該綁帶之該內表面的一位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for positioning at least one electrode array on a torso of a user is disclosed. The apparatus includes a strap that is configured to extend around the torso of the user, wherein the strap defines an inner surface that is configured to face the user. At least one alignment feature is provided on the inner surface of the strap, the at least one alignment feature indicating a position for securing the at least one electrode array to the inner surface of the strap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:設備</p>
        <p type="p">20:綁帶</p>
        <p type="p">22:內表面</p>
        <p type="p">30:對準特徵</p>
        <p type="p">32:凹部</p>
        <p type="p">36:發泡體層</p>
        <p type="p">60:附接元件</p>
        <p type="p">70:可撓性材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1564" publication-number="202619610">
    <tif-files tif-type="multi-tif">
      <tif file="114124500.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機電致發光元件、控制有機電致發光元件的發光波長之方法、用於實施該方法之程式及記錄有該程式之電腦可讀取記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260119B">H10K50/11</main-classification>
        <further-classification edition="202301120260119B">H10K50/15</further-classification>
        <further-classification edition="202301120260119B">H10K50/16</further-classification>
        <further-classification edition="202301120260119B">H10K50/18</further-classification>
        <further-classification edition="202301120260119B">H10K50/852</further-classification>
        <further-classification edition="202301120260119B">H10K59/10</further-classification>
        <further-classification edition="200601120260119B">H01S5/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商考拉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOALA TECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧夫雷　摩根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUFFRAY, MORGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班傑科　法蒂瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENCHEIKH, FATIMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的有機電致發光元件具備：電洞注入部；電子注入部；及配置於電洞注入部與電子注入部之間的有機部，該有機部包含發光層，藉由將該有機電致發光元件以有機部具有形成為在沿與厚度方向正交的方向剖切之剖面圖中折射率沿既定方向週期性地變化之折射率週期結構、電場強度週期結構或電流強度週期結構且來自發光層的光在該等週期結構中引起共振的方式構成，在元件設計時的模擬或品質檢查時，目標參數的數量減少，能夠準確、容易且高效地進行該等作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1565" publication-number="202617685">
    <tif-files tif-type="multi-tif">
      <tif file="114124530.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物、聚合性組合物、全像記錄媒體、聚合物、光學材料、及光學零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C271/16</main-classification>
        <further-classification edition="200601120260202B">C08F20/30</further-classification>
        <further-classification edition="200601120260202B">C08F20/36</further-classification>
        <further-classification edition="200601120260202B">G02B1/04</further-classification>
        <further-classification edition="200601120260202B">G02B5/18</further-classification>
        <further-classification edition="200601120260202B">G02B5/20</further-classification>
        <further-classification edition="200601120260202B">G02B5/32</further-classification>
        <further-classification edition="202301120260202B">H10K59/10</further-classification>
        <further-classification edition="202301120260202B">H10K59/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名倉椋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKURA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部晃子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABE, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下修治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上一真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠田淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種化合物，其作為光學材料或光學零件有用，且兼具高折射率、高透明性、易聚合性、化學穩定性、對於各種溶劑之高溶解性、及溶解液之保存穩定性。本發明係一種化合物，其由下述式(1)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="110px" width="317px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，n表示1～3之整數。L表示可分支之(n＋1)價連結基。Y&lt;sup&gt;1&lt;/sup&gt;、Y&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示碳原子、氮原子、氧原子及硫原子之合計數為7～20之芳香環基。Ar&lt;sup&gt;1&lt;/sup&gt;、Ar&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示可具有取代基之芳香族烴基。不會由Ar&lt;sup&gt;1&lt;/sup&gt;與Y&lt;sup&gt;1&lt;/sup&gt;、Ar&lt;sup&gt;2&lt;/sup&gt;與Y&lt;sup&gt;2&lt;/sup&gt;形成環結構。p、q分別獨立地表示0～5之整數。其中，p及q不會均為0。R&lt;sup&gt;1&lt;/sup&gt;表示氫原子或甲基]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:LED單元</p>
        <p type="p">L1:記錄光用半導體雷射光源</p>
        <p type="p">L2:再生光用雷射光源</p>
        <p type="p">M1:鏡</p>
        <p type="p">M2:鏡</p>
        <p type="p">M3:鏡</p>
        <p type="p">PBS:偏振分光鏡</p>
        <p type="p">PD1:光偵測器</p>
        <p type="p">PD2:光偵測器</p>
        <p type="p">PD3:光偵測器</p>
        <p type="p">S:全像記錄媒體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1566" publication-number="202617135">
    <tif-files tif-type="multi-tif">
      <tif file="114124540.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提升精神與活力用組成物、改善無力感與疲勞感用組成物</chinese-title>
        <english-title>COMPOSITION FOR ENHANCING VITALITY AND ENERGY, COMPOSITION FOR IMPROVING APATHY AND FATIGUE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/12</main-classification>
        <further-classification edition="200601120260202B">A61K36/73</further-classification>
        <further-classification edition="200601120260202B">A61P43/00</further-classification>
        <further-classification edition="201601120260202B">A23L33/105</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芳珂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANCL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坪川雅哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBOKAWA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水良樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻田剛史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林田真理子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, MARIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種用於提升精神或活力的組成物或用於改善無力感與疲勞感的組成物。為解決上記課題，本發明提供一種含有仙鶴草酚類用以提升精神與活力用組成物或改善無力感與疲勞感用組成物。此外，本發明提供一種以龍牙草萃取物形式含有仙鶴草酚類用以提升精神與活力用組成物或改善無力感與疲勞感用組成物。根據本發明，能夠提供一種用於提升精神與活力的組成物或用於改善無力感與疲勞感的組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The purpose of the present invention is to provide a complex for enhancing vitality and energy or a complex for improving fatigue and tiredness. In order to solve the above problems, the present invention provides a complex containing agrimol for enhancing vitality and energy or for improving fatigue and tiredness. In addition, the present invention also provides a complex containing agrimol in the form of agrimony extract for enhancing vitality and energy or for improving fatigue and tiredness. Based on the present invention, a complex for enhancing vitality and energy or a complex for improving fatigue and tiredness is provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1567" publication-number="202617670">
    <tif-files tif-type="multi-tif">
      <tif file="114124552.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124552</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去除方法、溶劑組成物、及半導體元件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C69/67</main-classification>
        <further-classification edition="200601120260202B">C07C69/675</further-classification>
        <further-classification edition="200601120260202B">C07C69/708</further-classification>
        <further-classification edition="200601120260202B">C11D7/50</further-classification>
        <further-classification edition="200601120260202B">B08B3/08</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田拓巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外山瑛章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYAMA, EISHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤英之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越後雅敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECHIGO, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的去除方法係去除金屬化合物或半金屬化合物的方法，其包含下述步驟：使用含有包含下述通式(b-1)表示之化合物(B1)之溶劑(B)的溶劑組成物將該金屬化合物或半金屬化合物去除。  &lt;br/&gt;&lt;img align="absmiddle" height="132px" width="319px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[上述式(b-1)中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1~10的烷基]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1568" publication-number="202617613">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124559</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析方法、分析系統及水處理系統</chinese-title>
        <english-title>ANALYSIS METHOD, ANALYSIS SYSTEM, AND WATER TREATMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">C02F1/44</main-classification>
        <further-classification edition="202301120260202B">C02F1/58</further-classification>
        <further-classification edition="200601120260202B">G01N33/18</further-classification>
        <further-classification edition="200601120260202B">B01D61/12</further-classification>
        <further-classification edition="200601120260202B">B01D61/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村勇規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋一重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUSHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤史生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDO, FUMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於分析方法、分析系統及水處理系統。本發明之將試樣水所包含的低分子量成分加以定量之分析系統(1)，具備：逆滲透膜裝置(10)，試樣水供給至其中，具備具有在水溫25℃之每1MPa有效壓力的純水透過通量為0.7m/天以下之透過係數的逆滲透膜(11)；分析裝置(30)，從逆滲透膜裝置(10)排出的濃縮水供給至其中，將低分子量成分加以定量；以及運算裝置(40)，依據逆滲透膜裝置(10)中的低分子量成分之濃縮倍率與分析裝置(30)中之測定值，將試樣水中的低分子量成分之濃度算出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An analysis system (1) which quantifies a low molecular weight component contained in a sample water comprises: a reverse osmosis membrane device (10) to which the sample water is provided and which comprises a reverse osmosis membrane (11) that has a permeability coefficient such that the pure water permeation flux per 1 MPa of effective pressure at a water temperature of 25°C is 0.7 m/d or less; an analysis device (30) to which the concentrate discharged from the reverse osmosis membrane device (10) is supplied, and which quantifies the low molecular weight component; and a calculation device (40) which calculates the concentration of the low molecular weight component in the sample water based on the concentration rate of the low molecular weight component in the reverse osmosis membrane device (10) and the measurement value of the analysis device (30).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:分析系統</p>
        <p type="p">10:逆滲透膜裝置</p>
        <p type="p">11:逆滲透膜</p>
        <p type="p">12:試樣水配管</p>
        <p type="p">13:泵</p>
        <p type="p">14:濃縮水配管</p>
        <p type="p">15:透過水配管</p>
        <p type="p">20:配管</p>
        <p type="p">21:驅動電路</p>
        <p type="p">22:壓力調節閥</p>
        <p type="p">30:分析裝置</p>
        <p type="p">40:運算裝置</p>
        <p type="p">41:濃度算出部</p>
        <p type="p">42:濃縮倍率儲存部</p>
        <p type="p">Q&lt;sub&gt;b&lt;/sub&gt;:濃縮水之流量</p>
        <p type="p">Q&lt;sub&gt;f&lt;/sub&gt;:供給水之流量</p>
        <p type="p">Q&lt;sub&gt;p&lt;/sub&gt;:透過水之流量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1569" publication-number="202617660">
    <tif-files tif-type="multi-tif">
      <tif file="114124571.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貧金屬團簇化合物、具有其之多聚結構體、其製造方法、包含其之感光性組合物、使用該組合物之圖案形成方法、基板及基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C61/08</main-classification>
        <further-classification edition="200601120260202B">C07C61/22</further-classification>
        <further-classification edition="200601120260202B">C07F9/94</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山元啓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KEISHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部繁樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長山和弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAYAMA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋田拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKITA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, AKANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本洋揮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種貧金屬團簇化合物，其能夠獲得作為可形成超微細圖案之光阻而言實用性較高之感光性組合物。  &lt;br/&gt;本發明之貧金屬團簇化合物之特徵在於：包含貧金屬原子、羧酸酯配體A、氧配體及/或羥配體，且該羧酸酯配體具有鍵結於羧酸酯基之脂環式結構，作為上述貧金屬原子，鉍、銻、銦等較為適宜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1570" publication-number="202618079">
    <tif-files tif-type="multi-tif">
      <tif file="114124590.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124590</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磊晶晶圓</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C30B29/06</main-classification>
        <further-classification edition="200601120260126B">C30B25/20</further-classification>
        <further-classification edition="200601120260126B">C23C16/24</further-classification>
        <further-classification edition="200601120260126B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSUKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木温</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原壽樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種磊晶晶圓，其在單晶Si基板上具有單晶Si磊晶層(Si磊晶層)，其中，Si磊晶層的單晶Si的晶格間距為5.408Å以下，單晶Si基板中的摻雜劑從單晶Si基板向Si磊晶層內減少且擴散，並且在單晶Si基板與Si磊晶層的界面處的Si磊晶層側具有比單晶Si基板側局部更高地偏析的濃度分佈，前述磊晶晶圓是貼合用晶圓，Si磊晶層具有作為貼合後的薄膜化過程中的蝕刻阻擋層或研磨阻擋層的功能。藉此，提供一種磊晶晶圓，尤其在矽器件製作步驟中，貼合後進行薄膜化時具有作為蝕刻/研磨步驟中的阻擋層的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:磊晶晶圓</p>
        <p type="p">2:基板</p>
        <p type="p">3:第一磊晶層</p>
        <p type="p">4:第二磊晶層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1571" publication-number="202617173">
    <tif-files tif-type="multi-tif">
      <tif file="114124620.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>MAZDUTIDE的應用</chinese-title>
        <english-title>USE OF MAZDUTIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61K38/26</main-classification>
        <further-classification edition="200601120260123B">A61K47/18</further-classification>
        <further-classification edition="200601120260123B">A61K47/26</further-classification>
        <further-classification edition="200601120260123B">A61P3/04</further-classification>
        <further-classification edition="200601120260123B">A61P3/10</further-classification>
        <further-classification edition="200601120260123B">A61P19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商信達生物製藥（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOVENT BIOLOGICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種mazdutide的應用。一種如式(I)所示的化合物在製備降低患者尿酸位準藥物中的應用；式(I)如本發明所示。本發明的mazdutide具有顯著的降尿酸的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1572" publication-number="202617926">
    <tif-files tif-type="multi-tif">
      <tif file="114124628.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多元醇酯油及其等於電動車中作為熱傳流體及可選的壓縮機潤滑劑之用途</chinese-title>
        <english-title>POLYOL ESTER OILS AND THEIR USES AS HEAT TRANSFER FLUIDS AND, OPTIONALLY, COMPRESSOR LUBRICANTS IN ELECTRIC VEHICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K5/10</main-classification>
        <further-classification edition="200601120260202B">C10M105/38</further-classification>
        <further-classification edition="201401120260202B">H01M10/613</further-classification>
        <further-classification edition="201401120260202B">H01M10/625</further-classification>
        <further-classification edition="201401120260202B">H01M10/656</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商盧伯利索公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE LUBRIZOL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳兆飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷克斯特羅　布莉姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKESTRAW, BRIDGETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩西爾　派翠克Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOSIER, PATRICK E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">直接冷卻電氣組件之方法，其中該電氣組件與包含至少50 wt%多元醇酯(POE)油之熱傳流體接觸。一種具有熱管理系統及可選的車輛氣候控制系統之車輛，其中該熱管理系統及該可選的車輛氣候控制系統裝有包含至少50 wt%多元醇酯(POE)油之熱傳流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of direct cooling electrical componentry, wherein the electrical componentry are contacted with a heat transfer fluid comprising at least 50 wt% of a polyol ester (POE) oil. A vehicle having a thermal management system and, optionally, a vehicle climate control system, wherein the thermal management system and the optional vehicle climate control system are charged with a heat transfer fluid comprising at least 50 wt% of a polyol ester (POE) oil.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1573" publication-number="202619432">
    <tif-files tif-type="multi-tif">
      <tif file="114124646.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>印刷電路板</chinese-title>
        <english-title>PRINTED CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">H05K3/42</main-classification>
        <further-classification edition="200601120260124B">H05K1/11</further-classification>
        <further-classification edition="200601120260124B">H05K3/40</further-classification>
        <further-classification edition="200601120260124B">C25D5/02</further-classification>
        <further-classification edition="200601120260124B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具敎憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, KYO HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李珍鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIN HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁仁晧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, IN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例之一種印刷電路板包含：一絕緣層，其包含一通孔部；及一導通孔，其安置於該絕緣層之該通孔部中；其中該導通孔包括：一連接部，其安置於該絕緣層之該通孔部中；一第一襯墊，其安置於該絕緣層之一上表面上及該連接部之上表面上；及一第二襯墊，其安置於該絕緣層之一下表面及該連接部之一下表面之下方，其中該連接部之該上表面在一朝下方向上包括一凹面形狀，該連接部之該下表面在一朝上方向上包括一凹面形狀，該第一襯墊之一下表面包括與該連接部之該上表面相對應的一凸面形狀，及該第二襯墊之一上表面包括與該連接部之該下表面相對應的一凸面形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A printed circuit board according to an embodiment includes: an insulating layer including a via hole; and a via disposed in the via hole of the insulating layer, wherein the via includes; a connection portion disposed in the via hole of the insulating layer; a first pad disposed on an upper surface of the insulating layer and an upper surface of the connection portion; and a second pad disposed under a lower surface of the insulating layer and a lower surface of the connection portion, wherein the upper surface of the connection portion has a concave shape in a downward direction, the lower surface of the connection portion has a concave shape in an upward direction, a lower surface of the first pad has a convex shape corresponding to the upper surface of the connection portion, and an upper surface of the second pad has a convex shape corresponding to the lower surface of the connection portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:印刷電路板</p>
        <p type="p">110:絕緣層</p>
        <p type="p">120:晶種層</p>
        <p type="p">130:電路圖型</p>
        <p type="p">140:導通孔</p>
        <p type="p">141:連接部</p>
        <p type="p">142:第一襯墊</p>
        <p type="p">143:第二襯墊</p>
        <p type="p">W1:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1574" publication-number="202619256">
    <tif-files tif-type="multi-tif">
      <tif file="114124654.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在輸入電壓Ｖｉｎ與輸出電壓Ｖｏｕｔ之間執行ＤＣ–ＤＣ電壓轉換的電路</chinese-title>
        <english-title>ELECTRICAL CIRCUIT CONFIGURED TO PERFORM DC TO DC VOLTAGE CONVERSION BETWEEN INPUT VOLTAGE VIN AND OUTPUT VOLTAGE VOUT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H02M3/158</main-classification>
        <further-classification edition="200701120260123B">H02M1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛比克微系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPIC MICROSYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔　慧念</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, HUI NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示了一種用於混合式 DC-DC 電壓轉換的系統。一個方面包括一個配置用於在輸入電壓與輸出電壓之間執行 DC-DC 電壓轉換的電路。該電路包括第一電性網路，其包含七個切換電晶體與兩個飛行電容，及第二電性網路，其包含六個切換電晶體與一個飛行電容。第一電性網路與第二電性網路至少在輸入節點、輸出節點與切換節點相互連接。在第二電性網路中的六個切換電晶體中，有兩個切換電晶體可進一步連接第一電性網路與第二電性網路。該電路還可包括連接於切換節點與輸出節點之間的電感。所述 DC-DC 電壓轉換可涉及一個包含六個不同切換系統狀態的重複循環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems for hybrid DC-DC voltage conversion are disclosed. One aspect includes an electrical circuit configured to perform a DC-DC voltage conversion between an input voltage and an output voltage. The electrical circuit includes a first electrical network that includes seven switching transistors and two flying capacitors, and a second electrical network that includes six switching transistors and one flying capacitor. The first electrical network and the second electrical network may be interconnected at least at each of an input node, an output node, and a switching node. Two switching transistors of the six switching transistors in the second electrical network may further connect the first electrical network and the second electrical network. The electrical circuit may include an inductor connected between the switching node and the output node. The DC-DC voltage conversion may involve a repeating cycle of six distinct switching system states.</p>
      </isu-abst>
      <representative-img>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;in&lt;/i&gt;
        &lt;/sub&gt;:輸入電壓</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;out&lt;/i&gt;
        &lt;/sub&gt;:輸出電壓</p>
        <p type="p">M1A,M2A,M3A,M4A,M5A,M6A,M7A,M1B,M2B,M3B,M4B,M5B,M6B,M7B:功率型N通道場效電晶體</p>
        <p type="p">C1A,C2A,C1B:飛行電容</p>
        <p type="p">L4:電感</p>
        <p type="p">PSW:具反向阻斷特性之功率開關</p>
        <p type="p">SW:切換節點</p>
        <p type="p">A:汲極</p>
        <p type="p">B:源極</p>
        <p type="p">C:本體電位</p>
        <p type="p">100:混合式DC-DC電壓轉換器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1575" publication-number="202619254">
    <tif-files tif-type="multi-tif">
      <tif file="114124655.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在輸入電壓Ｖｉｎ與輸出電壓Ｖｏｕｔ之間執行ＤＣ－ＤＣ電壓轉換的電路</chinese-title>
        <english-title>ELECTRICAL CIRCUIT CONFIGURED TO PERFORM DC TO DC VOLTAGE CONVERSION BETWEEN INPUT VOLTAGE VIN AND OUTPUT VOLTAGE VOUT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H02M3/156</main-classification>
        <further-classification edition="200701120260123B">H02M1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛比克微系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPIC MICROSYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔　慧念</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, HUI NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所述的是一種混合式直流對直流（Hybrid DC-DC）轉換器。某一實施例為一種配置以在輸入電壓 &lt;img align="absmiddle" height="30px" width="26px" file="ed10064.JPG" alt="ed10064.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;與輸出電壓 &lt;img align="absmiddle" height="36px" width="35px" file="ed10065.JPG" alt="ed10065.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;之間執行DC-DC電壓轉換之電路。該電路可包含一第一電網，其中包括七個切換電晶體與兩個飛行電容。該電路亦可包含一第二電網，其中包括七個切換電晶體與兩個飛行電容。於一種實施態樣中，該第一電網與該第二電網至少於與輸入電壓相關之輸入節點、與輸出電壓相關之輸出節點及一切換節點相互連接。該電路亦可包含一電感器，該電感器連接於該切換節點與該輸出節點之間。於一種實施態樣中，該DC-DC電壓轉換涉及四種不同切換系統狀態之重複循環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Hybrid DC-DC converters are described. One aspect is an electrical circuit configured to perform a DC-DC voltage conversion between an input voltage &lt;img align="absmiddle" height="30px" width="27px" file="ed10066.JPG" alt="ed10066.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; and an output voltage &lt;img align="absmiddle" height="30px" width="34px" file="ed10067.JPG" alt="ed10067.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The electrical circuit may include a first electrical network that includes seven switching transistors and two flying capacitors. The electrical circuit may further include a second electrical network that includes seven switching transistors and two flying capacitors. In an aspect, the first electrical network and the second electrical network are interconnected at least at each of an input node associated with the input voltage, an output node associated with the output voltage, and a switching node. The electrical circuit may also include an inductor connected between the switching node and the output node. In an aspect, the DC-DC voltage conversion involves a repeated cycle of four distinct switching system states.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VO:輸出電壓</p>
        <p type="p">M1A,M2A,M3A,M4A,M5A,M6A,M7A,M1B,M2B,M3B,M4B,M5B,M6B,M7B:切換電晶體</p>
        <p type="p">C1A,C2A,C1B,C2B:飛行電容</p>
        <p type="p">L1:電感器</p>
        <p type="p">SW:切換節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1576" publication-number="202618146">
    <tif-files tif-type="multi-tif">
      <tif file="114124656.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性彈簧</chinese-title>
        <english-title>MAGNETIC SPRING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">F16F6/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商碧綠威自動化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PBA SYSTEMS PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　偉耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONG, WEI YAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　俊元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHOON WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坦納孔　蘇蘭吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THENNAKOON, SURANJITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種包括定子和滑塊的磁性彈簧，滑塊可相對於定子沿第一軸線移動，定子可繞第一軸線旋轉。定子的旋轉將磁性彈簧從中性配置轉換到第一偏移配置。在中性配置中，定子磁體和滑塊磁體的磁極沿著第二軸線對齊和定向。在第一偏移配置中，滑塊磁體的磁極保持沿著第二軸線定向，定子磁體的磁極沿著偏移軸線定向，並且不與滑塊磁體的磁極對準，偏移軸線以力調節角從第二軸線成角度地偏移。在第一偏移配置中產生的磁性彈力低 於在中性配置中產生的磁性彈力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic spring comprising a stator and a slider is disclosed, the slider movable along a first axis with respect to the stator, and the stator is rotatable around the first axis. Rotation of the stator shifts the magnetic spring from a neutral configuration to a first offset configuration. In the neutral configuration, the poles of the stator magnet and the slider magnet are aligned and oriented along a second axis. In the first offset configuration, the poles of the slider magnet remain oriented along the second axis, and the poles of the stator magnet are oriented along an offset axis, and are not aligned with the poles of the slider magnet, the offset axis being angularly offset from the second axis by a force adjustment angle. The magnetic spring force generated in the first offset configuration is lower than the magnetic spring force generated in the neutral configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">24:定子磁體</p>
        <p type="p">34:滑塊磁體</p>
        <p type="p">OA:偏移軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1577" publication-number="202618334">
    <tif-files tif-type="multi-tif">
      <tif file="114124665.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有至少一個平滑層和光學配置的光學元件</chinese-title>
        <english-title>OPTICAL ELEMENT INCLUDING AT LEAST ONE SMOOTHING LAYER AND OPTICAL ARRANGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260123B">G02B1/10</main-classification>
        <further-classification edition="201501120260123B">G02B1/115</further-classification>
        <further-classification edition="201201120260123B">G03F1/84</further-classification>
        <further-classification edition="201501120260123B">G02B1/11</further-classification>
        <further-classification edition="200601120260123B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾曼　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMANN, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃克斯邁耶　傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERXMEYER, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種光學元件 （1），其包含：一基板（2）；以及一光學塗層（3），其中該光學塗層用於反射紫外光（UV）或可見光（VIS）波長區域的輻射（4），該光學塗層具有複數層（6、7），該複數層從該基板（2）的方向沿著該光學塗層（3）的自由表面（5）依序排列，且該複數層的層粗糙度（12）隨著與該基板（2）的距離增加而增加。除了該複數層（6、7）之外，還有至少一個平滑層（9、9a）設置在該光學塗層內，至少一個平滑層（9、9a）的層粗糙度（12）低於該複數層中任一層（6、7）的層粗糙度。本發明亦關於一種光學配置，其包含至少一個如上所述的光學元件（1）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an optical element (1) comprising： a substrate (2), and an optical coating (3) for reflection of radiation (4) in the UV or VIS wavelength region, having a plurality of layers (6, 7) that are successive from the direction of the substrate (2) in the direction of a free surface (5) of the optical coating (3) and have increasing layer roughness (12) with increasing distance from the substrate (2). At least one smoothing layer (9) which is disposed within the coating (3) in addition to the plurality of layers (6, 7) has lower layer roughness (12) than one of the layers (6, 7). The invention also relates to an optical arrangement comprising： at least one optical element (1) as described further up.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學元件</p>
        <p type="p">2:基板</p>
        <p type="p">3:光學塗層</p>
        <p type="p">4:輻射</p>
        <p type="p">5:自由表面/清晰表面</p>
        <p type="p">6:第一層/複數層</p>
        <p type="p">7:第二層/複數層</p>
        <p type="p">8:層組</p>
        <p type="p">9:平滑層</p>
        <p type="p">10:層組</p>
        <p type="p">λ:所用波長</p>
        <p type="p">d:物理厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1578" publication-number="202619359">
    <tif-files tif-type="multi-tif">
      <tif file="114124695.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124695</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於連接複數個資料網路節點的光學資料網路</chinese-title>
        <english-title>OPTICAL DATA NETWORK FOR CONNECTING A PLURALITY OF DATA NETWORK NODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H04Q11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商閃電公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAPE B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡米利　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMILLI, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛克　卓哥斯　史提芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALK, DRAGOS-STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特魯　克勞迪烏　法席爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATRU, CLAUDIU-VASILE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於連接複數個資料網路節點(N1-1、N2-1、N3-1、N4-1)之光學資料網路(10-1)。該光學資料網路(10-1)包括：i)該複數個資料網路節點(N1-1、N2-1、N3-1、N4-1)，資料(99)包括資料封包(99p)，其中各資料網路節點(N1-1、N2-1、N3-1、N4-1)具有一網路介面(NI)；及ii)一資料連接網路(100-1)，其包括至少一個資料交換機(SW)及用於允許在該複數個資料網路節點(N1-1、N2-1、N3-1、N4-1)對之間建立資料鏈路(DL1、DL2)之複數個光學連接(50)。該至少一個資料交換機(SW)之至少一者係包括至少一個封包交換機(PS、EPS)及至少一個電路交換機(CS、OCS)之一智慧資料交換機(SSW)。至少兩個網路介面係包括一資料分類器(25)之智慧網路介面(SN、SNC)，該資料分類器(25)經組態用於根據一分類方案來將該等資料封包(99p)分成包含第一訊務類別(D1)及一第二訊務類別(D2)之至少兩個訊務類別。該智慧資料交換機(SSW)及該等網路介面(SN、SNC)經組態以將該第一訊務類別(D1)之該等資料封包(99p)路由至該封包交換機(PS、EPS)且將該第二訊務類別(D2)之該等資料封包(99p)路由至該電路交換機(CS、OCS)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an optical data network (10-1) for connecting a plurality of data network nodes (N1-1, N2-1, N3-1, N4-1). The optical data network (10-1) comprises: i) the plurality of data network nodes (N1-1, N2-1, N3-1, N4-1), the data (99) comprising data packets (99p), wherein each data network node (N1-1, N2-1, N3-1, N4-1) is provided with a network interface (NI); and ii) a data connection network (100-1) comprising at least one data switch (SW) and a plurality of optical connections (50) for allowing establishment of data links (DL1, DL2) between pairs of said plurality of data network nodes (N1-1, N2-1, N3-1, N4-1). At least one of the at least one data switch (SW) is a smart data switch (SSW) comprising at least one packet switch (PS, EPS) and at least one circuit switch (CS, OCS). At least two network interfaces are smart network interfaces (SN, SNC) comprising a data classifier (25) configured for classifying the data packets (99p) into at least two traffic classes including first traffic class (D1) and a second traffic class (D2) in accordance with a classification scheme. The smart data switch (SSW) and the network interfaces (SN, SNC) are configured to route the data packets (99p) of the first traffic class (D1) to the packet switch (PS, EPS) and to route the data packets (99p) of the second traffic class (D2) to the circuit switch (CS, OCS).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10-1:光學資料網路</p>
        <p type="p">50:光學連接</p>
        <p type="p">100-1:資料連接網路</p>
        <p type="p">CS:電路交換機</p>
        <p type="p">DL1:資料鏈路</p>
        <p type="p">DL2:資料鏈路</p>
        <p type="p">EPS:電子封包交換機</p>
        <p type="p">N1-1:資料網路節點</p>
        <p type="p">N2-1:資料網路節點</p>
        <p type="p">NI:網路介面</p>
        <p type="p">NN-1:資料網路節點</p>
        <p type="p">OCS:光學電路交換機</p>
        <p type="p">PS:封包交換機</p>
        <p type="p">SC:交換機控制器</p>
        <p type="p">SN:智慧網路介面</p>
        <p type="p">SNC:智慧網路介面</p>
        <p type="p">SSW:智慧資料交換機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1579" publication-number="202618454">
    <tif-files tif-type="multi-tif">
      <tif file="114124709.zip" no="1">
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      <volno>24</volno>
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        <document-id>
          <doc-number>202618454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻膜成膜方法、光阻膜成膜裝置及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G03F7/16</main-classification>
        <further-classification edition="200601120260127B">B08B9/00</further-classification>
        <further-classification edition="200601120260127B">F24F6/02</further-classification>
        <further-classification edition="200601120260127B">G03F7/004</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志村悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMURA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉原孝介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIHARA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達文多爾發　阿諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUENDORFFER, ARNAUD ALAIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井寛之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於光阻膜成膜方法、光阻膜成膜裝置及記錄媒體，在藉由氣體處理於基板將光阻膜時，提高處理效率。本發明之光阻膜成膜方法，具備：成膜步驟，使包含收納基板之處理容器內的處理空間之調整區域，成為相較於該調整區域的外側之第1環境氣氛更為低氧濃度及低濕度且為該外側的壓力或該壓力附近的壓力之第2環境氣氛，將含光阻成分之氣體供給至係該第2環境氣氛的該處理空間，而於該基板將光阻膜成膜；以及加熱步驟，在成為該第2環境氣氛的該處理空間，將曝光前之形成有該光阻膜的該基板加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓處理系統</p>
        <p type="p">3:處理站</p>
        <p type="p">31:層</p>
        <p type="p">32,90:晶圓搬運區域</p>
        <p type="p">33,95:晶圓搬運裝置</p>
        <p type="p">6:光阻膜成膜裝置</p>
        <p type="p">8:熱處理裝置</p>
        <p type="p">91:殼體</p>
        <p type="p">92:搬運臂</p>
        <p type="p">93:基台</p>
        <p type="p">94:移動機構</p>
        <p type="p">96:排氣機構</p>
        <p type="p">96A:排氣口</p>
        <p type="p">97:N&lt;sub&gt;2&lt;/sub&gt;氣體供給機構</p>
        <p type="p">97A:N&lt;sub&gt;2&lt;/sub&gt;氣體供給口</p>
        <p type="p">G1:第1區塊</p>
        <p type="p">G2:第2區塊</p>
        <p type="p">R0:調整區域</p>
        <p type="p">R1:上部區域</p>
        <p type="p">R2:下部區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1580" publication-number="202617198">
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      <tif file="114124716.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有藉由浮球封閉之氣體抽氣的醫療注射裝置</chinese-title>
        <english-title>MEDICAL INJECTION DEVICE WITH GAS EVACUATION CLOSED BY A FLOAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61M5/00</main-classification>
        <further-classification edition="200601120260123B">A61M5/145</further-classification>
        <further-classification edition="200601120260123B">A61M5/14</further-classification>
        <further-classification edition="200601120260123B">A61M39/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商加柏公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERBET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達瓦爾　吉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVAL, JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克勞拉德　文森特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CROULARD, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭帝厄　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PONTHIEUX, ANTONIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡克林　傑羅姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CACLIN, JEROME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿拉德　盧多維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLARD, LUDOVIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用來將醫療液體從醫療液體容器注射進醫療管路中的注射裝置，該注射裝置包含一主體、一安排在該主體中用以沿著縱向方向移動的活塞(6)；一穿過該活塞(6)的抽氣路徑，其中該活塞包含一空腔(8)及一將該空腔連接至該主體的內空間(4)之第一通路(14)；及一浮球(12)，其係安裝成漂浮在該醫療液體上及安裝成沿著縱向方向在該空腔(8)內於下列之間移動：裝填組態，其中第三與第四密封介面(18,19)搭配以在第二封閉場所(Z2)處封閉該抽氣路徑(10)；及注射組態，其中第一及第二密封介面(16,17)搭配以在第一封閉場所(Z1)處封閉該抽氣路徑(10)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An injection device for injecting into a medical tubing a medical liquid from a medical liquid container, said injection device comprising a body, a piston (6) arranged in the body for travelling along the longitudinal direction, an evacuation path traversing the piston (6) comprising a cavity (8) and a first passage (14) connecting the cavity to an inner space (4) of the body, and a float (12) configured for floating on the medical liquid and configured for travelling within the cavity (8) along the longitudinal direction between a filling configuration wherein third and fourth sealing interfaces (18, 19) cooperate to close the evacuation path (10) at a second closing location (Z2), and an injection configuration wherein first and second sealing interfaces (16, 17) cooperate to close the evacuation path (10) at a first closing location (Z1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">4a:下空間</p>
        <p type="p">4b:上空間</p>
        <p type="p">5a:周邊密封</p>
        <p type="p">6:活塞</p>
        <p type="p">6a:下壁</p>
        <p type="p">6b:上壁</p>
        <p type="p">6c:周圍壁</p>
        <p type="p">7:下介面</p>
        <p type="p">8:空腔</p>
        <p type="p">9:入口</p>
        <p type="p">10:抽氣路徑</p>
        <p type="p">14:通路，第一通路</p>
        <p type="p">15:通路，第二通路</p>
        <p type="p">16:第一密封介面</p>
        <p type="p">17:第二密封介面</p>
        <p type="p">24:附屬件</p>
        <p type="p">25:腳</p>
        <p type="p">26:閉塞部分</p>
        <p type="p">31:突出物</p>
        <p type="p">32:氣體體積</p>
        <p type="p">34:醫療液體，準確規定的醫療液體體積</p>
        <p type="p">110:注射裝置</p>
        <p type="p">1112:可替代的浮球</p>
        <p type="p">Z:縱向方向</p>
        <p type="p">Z1:第一封閉場所，第一密封場所</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1581" publication-number="202619114">
    <tif-files tif-type="multi-tif">
      <tif file="114124730.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124730</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01L23/528</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁民友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金碩壎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUKHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳成男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYU, SUNGNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包括一位元線、與該位元線間隔開之一資料儲存結構、在該位元線與該資料儲存結構之間的一字元線結構、電氣連接該位元線與該資料儲存結構之一第一通道圖案、以及包括位於該字元線結構與該第一通道圖案之間的一插入部分之一閘極絕緣層。該字元線結構包括一閘極圖案、在該閘極圖案與該位元線之間的一絕緣圖案以及在該閘極圖案與該資料儲存結構之間的一功函數圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device including a bit line, a data storage structure spaced apart from the bit line, a word line structure between the bit line and the data storage structure, a first channel pattern electrically connecting the bit line and the data storage structure, and a gate insulating layer including an interposed portion between the word line structure and the first channel pattern. The word line structure includes a gate pattern, an insulating pattern between the gate pattern and the bit line, and a work-function pattern between the gate pattern and the data storage structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基體</p>
        <p type="p">11:填充圖案</p>
        <p type="p">12:第一插入圖案</p>
        <p type="p">13:第二插入圖案</p>
        <p type="p">15:下部絕緣層</p>
        <p type="p">16:上部絕緣層</p>
        <p type="p">21:閘極絕緣層</p>
        <p type="p">22:層間圖案</p>
        <p type="p">31:第一導電圖案</p>
        <p type="p">32:第二導電圖案</p>
        <p type="p">51:功函數圖案</p>
        <p type="p">52:閘極圖案</p>
        <p type="p">53:第一絕緣圖案</p>
        <p type="p">54:第二絕緣圖案</p>
        <p type="p">55:第三絕緣圖案</p>
        <p type="p">61:下部功函數圖案</p>
        <p type="p">62:下部閘極圖案</p>
        <p type="p">64:第一下部絕緣圖案</p>
        <p type="p">65:第二下部絕緣圖案</p>
        <p type="p">71:上部功函數圖案</p>
        <p type="p">72:上部閘極圖案</p>
        <p type="p">74:第一上部絕緣圖案</p>
        <p type="p">75:第二上部絕緣圖案</p>
        <p type="p">A-A':線</p>
        <p type="p">BO:位元線</p>
        <p type="p">CI:電容器絕緣層</p>
        <p type="p">CL:通道圖案</p>
        <p type="p">CL1:第一通道圖案</p>
        <p type="p">CL2:第二通道圖案</p>
        <p type="p">CL3:第三通道圖案</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">DS:資料儲存結構</p>
        <p type="p">EL1:第一電極</p>
        <p type="p">EL2:第二電極</p>
        <p type="p">LC:下部導電結構</p>
        <p type="p">Q1:區</p>
        <p type="p">UC:上部導電結構</p>
        <p type="p">WO:字元線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1582" publication-number="202617151">
    <tif-files tif-type="multi-tif">
      <tif file="114124756.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124756</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＷＲＮ解旋酶調節劑及其使用方法</chinese-title>
        <english-title>WRN HELICASE MODULATORS AND METHODS OF USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">A61K31/497</main-classification>
        <further-classification edition="200601120260116B">A61K31/4184</further-classification>
        <further-classification edition="200601120260116B">A61P35/00</further-classification>
        <further-classification edition="200601120260116B">C07D213/81</further-classification>
        <further-classification edition="200601120260116B">C07D239/34</further-classification>
        <further-classification edition="200601120260116B">C07D241/24</further-classification>
        <further-classification edition="200601120260116B">C07D241/28</further-classification>
        <further-classification edition="200601120260116B">C07D401/12</further-classification>
        <further-classification edition="200601120260116B">C07D417/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＭＯＭＡ治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖雷　莫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOURE, MOMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥高恩　梅雷德斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGOWAN, MEREDETH A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特勒　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUTLER, JOHN R</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, CEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏永紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, YONGHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古茲　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUZI, TIMOTHY J</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於式(I')化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="196px" width="192px" file="ed10178.JPG" alt="ed10178.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;　　及其前驅藥、醫藥學上可接受之鹽、醫藥組合物、使用方法及其製備方法。本文所揭示之化合物適用於調節沃納解旋酶(Werner Helicase)(WRN)活性且可用於治療牽涉WRN活性之病症，諸如癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to compounds of Formula (I’): &lt;br/&gt;&lt;img align="absmiddle" height="190px" width="174px" file="ed10179.JPG" alt="ed10179.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;br/&gt;and to their prodrugs, pharmaceutically acceptable salts, pharmaceutical compositions, methods of use, and methods for their preparation. The compounds disclosed herein are useful for modulating Werner Helicase (WRN) activity and may be used in the treatment of disorders in which WRN activity is implicated, such as cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1583" publication-number="202618245">
    <tif-files tif-type="multi-tif">
      <tif file="114124758.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124758</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光罩缺陷偵測之偏振控制及最佳化</chinese-title>
        <english-title>POLARIZATION CONTROL AND OPTIMIZATION FOR PHOTOMASK DEFECT DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G01N21/21</main-classification>
        <further-classification edition="200601120260126B">G01N21/956</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄海峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>是　瑞方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, RUI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配方產生系統可包含具有經組態以執行程式指令之一或多個處理器之一控制器。該等指令可致使處理器針對一或多種缺陷類型產生一效能矩陣。該效能矩陣可包含利用與一檢驗系統之一偏振控制光學器件中至少兩個波板之旋轉位置相關聯的照明光之多種偏振狀態產生之檢驗資料。該偏振控制光學器件可包含一偏振分束器及波板。該系統可藉由使照明光傳播穿過光學器件到達樣本並由一偵測器透過光學器件擷取來自樣本之光來產生檢驗資料。該等處理器可識別滿足一檢驗容限之一運行時偏振狀態且使用該等運行時偏振狀態來產生一檢驗配方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A recipe generation system may include a controller with one or more processors configured to execute program instructions. The instructions may cause the processors to generate a performance matrix for one or more defect types. The performance matrix may include inspection data generated with multiple polarization states of illumination light associated with rotational positions of at least two waveplates in a polarization controlling optics of an inspection system. The polarization controlling optics may include a polarizing beam splitter and the waveplates. The system may generate inspection data by propagating illumination light through the optics to the sample and capturing light from the sample by a detector through the optics. The processors may identify a run-time polarization state satisfying an inspection tolerance and generate an inspection recipe using the run-time polarization states.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢驗系統</p>
        <p type="p">102:樣本</p>
        <p type="p">104:缺陷</p>
        <p type="p">106:檢驗子系統</p>
        <p type="p">108:照明源/寬頻電漿照明源</p>
        <p type="p">110:照明/光學照明/連續波(CW)照明/脈衝式照明/經調變照明/平頂圓形照明</p>
        <p type="p">112:樣本光/所收集樣本光</p>
        <p type="p">114:偵測器</p>
        <p type="p">116:偏振控制光學器件</p>
        <p type="p">118:波板/實體波板</p>
        <p type="p">120:偏振分束器</p>
        <p type="p">122:控制器</p>
        <p type="p">124:處理器</p>
        <p type="p">126:記憶體</p>
        <p type="p">136:成像子系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1584" publication-number="202616955">
    <tif-files tif-type="multi-tif">
      <tif file="114124803.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防除根瘤黴類所致之植物病害之組成物及防除方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A01N43/56</main-classification>
        <further-classification edition="200601120260202B">A01N43/58</further-classification>
        <further-classification edition="200601120260202B">A01P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學植保股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS CROP &amp; LIFE SOLUTIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内藤良平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAITO, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防除根瘤黴類所致之植物病害之組成物，其含有下式(1)表示之化合物或其鹽作為有效成分，式中，Ar1表示無取代或被n個R1取代之苯基，R1表示氟原子、氯原子、溴原子、甲基、三氟甲基、甲氧基、乙氧基、或氰基，n表示1~5之整數，Ar2表示無取代或被1~5個R2取代之苯基，R2表示氟原子、氯原子、溴原子、甲基、甲氧基、或氰基，m表示1~5之整數，X表示-NH-或直接鍵結，Q表示具有含氮環結構(2-吡啶酮骨架、嗒𠯤骨架、或吡唑骨架)之基。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="152px" width="231px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1585" publication-number="202617979">
    <tif-files tif-type="multi-tif">
      <tif file="114124805.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉基因之內含子靶向插入</chinese-title>
        <english-title>INTRONIC TARGETED INSERTION OF TRANSGENES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N5/0783</main-classification>
        <further-classification edition="200601120260202B">C12N5/10</further-classification>
        <further-classification edition="200601120260202B">C12N15/11</further-classification>
        <further-classification edition="200601120260202B">C12N15/85</further-classification>
        <further-classification edition="200601120260202B">C12N15/90</further-classification>
        <further-classification edition="202501120260202B">A61K40/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商諾佛　儂迪克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVO NORDISK A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉赫曼　沙米姆　赫伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAHMAN, SHAMIM HERBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗羅尼　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FROGNE, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關包含一關閉序列及一或多個轉基因序列之細胞，該些序列插入內源基因之內含子的兩個等位基因中。本發明係有關一種用於製造細胞之最佳化方法，該細胞包含一關閉基因及可能的一或多個轉基因表現。本發明簡化關閉過程並改進關閉效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to cells comprising a shutdown sequence and one or more transgene sequences inserted into both alleles of an intron of an endogenous gene. The invention relates to an optimised process for manufacturing of cells comprising a gene shutdown and, potentially, one or more transgene expression. The invention simplifies the shutdown process and improves shutdown efficiency.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1586" publication-number="202618031">
    <tif-files tif-type="multi-tif">
      <tif file="114124825.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在現存圖案化遮罩上的選擇性沉積</chinese-title>
        <english-title>SELECTIVE DEPOSITION ON AN EXISTING PATTERNED MASK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C23C16/04</main-classification>
        <further-classification edition="200601120260128B">C23C16/14</further-classification>
        <further-classification edition="200601120260128B">C23C16/458</further-classification>
        <further-classification edition="200601120260128B">C23C16/509</further-classification>
        <further-classification edition="200601120260128B">C23C16/52</further-classification>
        <further-classification edition="200601120260128B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多夫納　亞力克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DORFNER, ALEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以處理一基板的方法包含：在設置於一處理腔室中的一基板托架上接收該基板，該基板包含一待處理層和設置在該待處理層上的一已圖案化遮罩。該方法更包含：將一處理氣體流入該處理腔室，以及用該處理氣體的金屬置換該已圖案化遮罩的材料，以形成佔據與該已圖案化遮罩相同位置的一金屬圖案化遮罩。且該方法更包含：使用該金屬圖案化遮罩作為一蝕刻遮罩，而蝕刻該待處理層以形成一已圖案化層，該已圖案化層包含特徵部開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate includes receiving the substrate on a substrate holder disposed in a processing chamber: the substrate including a layer to be processed and a patterned mask disposed over the layer to be processed. The method further includes flowing a processing gas into the processing chamber: and replacing a material of the patterned mask with a metal of the processing gas to form a metal patterned mask occupying a same location as the patterned mask. And the method further includes etching: using the metal patterned mask as an etch mask: the layer to be processed to form a patterned layer: the patterned layer including feature openings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:底層</p>
        <p type="p">130:介電層</p>
        <p type="p">145:開口</p>
        <p type="p">200:電子裝置</p>
        <p type="p">240:核心</p>
        <p type="p">250:硬遮罩</p>
        <p type="p">a:滲透深度</p>
        <p type="p">b:核心CD</p>
        <p type="p">c:核心高度</p>
        <p type="p">h:遮罩厚度</p>
        <p type="p">w:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1587" publication-number="202619033">
    <tif-files tif-type="multi-tif">
      <tif file="114124828.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理方法</chinese-title>
        <english-title>METHOD FOR SEMICONDUCTOR PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/768</main-classification>
        <further-classification edition="200601120260123B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米澤亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEZAWA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤凱鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KAI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧森克　赫里特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEUSINK, GERRIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐麥拉　大衛　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'MEARA, DAVID L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體製造方法，包含：將設置在導電特徵上方的氧化物層去除、在該導電特徵上方流動鎵前驅物，以及在流動該鎵前驅物後，在該導電特徵上方沉積金屬。該導電特徵係與介電特徵相鄰。該金屬係相對於該介電特徵而選擇性沉積在該導電特徵上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for semiconductor manufacturing includes removing an oxide layer disposed over a conductive feature, flowing a gallium precursor over the conductive feature, and depositing a metal over the conductive feature after flowing the gallium precursor. The conductive feature is adjacent to a dielectric feature. The metal is deposited selectively over the conductive feature relative to the dielectric feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體結構</p>
        <p type="p">200A:第一區域</p>
        <p type="p">200B:第二區域</p>
        <p type="p">202:第一層</p>
        <p type="p">204:第二層</p>
        <p type="p">222:鎵層</p>
        <p type="p">244:導電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1588" publication-number="202617502">
    <tif-files tif-type="multi-tif">
      <tif file="114124846.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有液壓制動器的車把轉向車輛之控制組件</chinese-title>
        <english-title>A CONTROL ASSEMBLY FOR A HANDLEBAR-STEERED VEHICLE WITH A HYDRAULIC BRAKE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B62K21/12</main-classification>
        <further-classification edition="200601120260123B">B62K23/06</further-classification>
        <further-classification edition="200601120260123B">B62L3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商萊卡母動力傳動系統有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAICAM DRIVELINE S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈卡爾迪　馬泰奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIACCARDI, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博納多　珊德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONARDO, SANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一匣筒（15）被插入於車把管（10）中，匣筒（15）於其內部形成一腔室（19），用於制動器主缸（13）之活塞（16）。匣筒沿車把管（10）之軸向以及角向根據一預定角度定向，由一鎖定元件（40）鎖定，鎖定元件穿過兩相對貫穿狹槽（37、38），貫穿狹槽（37、38）設於車把管（10）之一預定軸向位置處。匣筒（15）於軸向上被限制於鎖定元件（40），鎖定元件（40）容納於匣筒（15）中所設之一凹槽（33）中，凹槽（33）具有一對應於鎖定元件（40）形狀之非圓形形狀，以使匣筒（15）依照預定定向保持定位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cartridge (15) is inserted into the tube (10) of the handlebar, which cartridge forms a chamber (19) for the piston (16) of the brake master cylinder (13). The cartridge is locked axially along the tube and angularly according to a predetermined angular orientation, by a locking element (40) which is threaded through two opposite through-slots (37, 38) obtained in the tube of the handlebars at a predetermined axial position. The cartridge (15) is axially constrained against the locking element (40), which is received within a recess (33) obtained in the cartridge, having a non-circular shape corresponding to the shape of the locking element, in order to retain the cartridge in position according to the predetermined orientation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:車把管</p>
        <p type="p">11:內腔</p>
        <p type="p">12:內圓柱表面</p>
        <p type="p">13:制動器主缸</p>
        <p type="p">14:開放端</p>
        <p type="p">15:匣筒</p>
        <p type="p">16:活塞</p>
        <p type="p">17:外表面</p>
        <p type="p">18:腔室</p>
        <p type="p">22:控制桿</p>
        <p type="p">23:傳動機構</p>
        <p type="p">24:搖臂桿</p>
        <p type="p">25:連桿</p>
        <p type="p">26:壓縮彈簧</p>
        <p type="p">35:中心孔/螺紋孔</p>
        <p type="p">38:第二狹槽/狹槽/貫穿狹槽</p>
        <p type="p">40:橫向鎖定元件</p>
        <p type="p">41:中央通孔</p>
        <p type="p">42:固定元件/鎖定螺絲</p>
        <p type="p">x:中心軸線/縱向軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1589" publication-number="202617503">
    <tif-files tif-type="multi-tif">
      <tif file="114124847.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有液壓制動器的車把轉向車輛之控制組件</chinese-title>
        <english-title>A CONTROL ASSEMBLY FOR A HYDRAULIC BRAKE OF A HANDLEBAR-STEERED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B62K21/12</main-classification>
        <further-classification edition="200601120260123B">B62K23/06</further-classification>
        <further-classification edition="200601120260123B">B62L3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商萊卡母動力傳動系統有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAICAM DRIVELINE S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博納多　珊德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONARDO, SANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅西　馬蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSSI, MATTIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈卡爾迪　馬泰奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIACCARDI, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於致動整合於一車把管（10）內之制動器主缸（13）的傳動機構，包括一連桿（30），具有一第一端（31）以及另一端（32），第一端（31）以繞一球面耦接之方式旋轉連接於該制動器主缸之活塞（14）之一端部（14a），另一端（32）以旋轉方式連接至一中間傳動桿（17）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The transmission mechanism for actuating a brake master cylinder （13） integrated into the tube （10） of a handlebar comprises a connecting rod （30） having a first end （31） rotatably connected about a spherical coupling to an end （14a） of a piston （14） of the brake master cylinder, and another end （32） rotatably connected about an intermediate transmission lever （17）.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:車把管</p>
        <p type="p">10a:車把管端部</p>
        <p type="p">11:制動器控制桿</p>
        <p type="p">11a:第一橫向軸線</p>
        <p type="p">12:匣筒</p>
        <p type="p">13:制動器主缸</p>
        <p type="p">14:活塞</p>
        <p type="p">14a:端部</p>
        <p type="p">15:腔體</p>
        <p type="p">16:傳動機構</p>
        <p type="p">17:中間傳動桿</p>
        <p type="p">17a:第二橫向軸線</p>
        <p type="p">17c:中間桿臂部</p>
        <p type="p">21:滾輪</p>
        <p type="p">22:第二桿</p>
        <p type="p">27:圓柱形腔體</p>
        <p type="p">30:連桿</p>
        <p type="p">31:第一端</p>
        <p type="p">31a:球面耦接</p>
        <p type="p">32:第二端</p>
        <p type="p">32a:第四橫向軸線</p>
        <p type="p">36:凹座</p>
        <p type="p">37:杯狀鎖定元件</p>
        <p type="p">X:中央軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1590" publication-number="202618939">
    <tif-files tif-type="multi-tif">
      <tif file="114124861.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>摻雜介電封裝膜</chinese-title>
        <english-title>DOPED DIELECTRIC PACKAGING FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/56</main-classification>
        <further-classification edition="200601120260126B">H01L21/316</further-classification>
        <further-classification edition="200601120260126B">H01L23/29</further-classification>
        <further-classification edition="200601120260126B">C23C16/505</further-classification>
        <further-classification edition="201901120260126B">B32B7/022</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鵬翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, PENGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>季　春海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, CHUNHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, GUANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示的是與在晶粒上沉積經摻雜封裝膜相關的範例。一個範例提供一種在晶粒上沉積經摻雜封裝膜的方法。該方法包含將該晶粒暴露至前驅物氣體混合物，該前驅物氣體混合物包含矽氧化物前驅物和一或更多摻質前驅物，其中，將該晶粒暴露至該前驅物氣體混合物係在該晶粒上沉積該經摻雜封裝膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples are disclosed that relate to depositing a doped packaging film over a die. One example provides a method of depositing a doped packaging film over a die. The method comprises exposing the die to a precursor gas mixture, the precursor gas mixture comprises a silicon oxide precursor and one or more dopant precursors, wherein exposing the die to the precursor gas mixture deposits the doped packaging film over the die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:計算系統</p>
        <p type="p">702:邏輯子系統</p>
        <p type="p">704:儲存子系統</p>
        <p type="p">706:顯示子系統</p>
        <p type="p">708:輸入子系統</p>
        <p type="p">710:通信子系統</p>
        <p type="p">712:指令</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1591" publication-number="202617133">
    <tif-files tif-type="multi-tif">
      <tif file="114124864.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>大腸送達性無縫膠囊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K9/48</main-classification>
        <further-classification edition="200601120260202B">A61K31/522</further-classification>
        <further-classification edition="201701120260202B">A61K47/44</further-classification>
        <further-classification edition="201701120260202B">A61K47/42</further-classification>
        <further-classification edition="200601120260202B">A61K47/36</further-classification>
        <further-classification edition="201601120260202B">A23P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商森下仁丹股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA JINTAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題：本發明提供一種可輕易實現無縫膠囊之大腸送達的大腸送達性無縫膠囊。&lt;br/&gt;  本發明之解決手段：本發明提供一種大腸送達性無縫膠囊，其特徵在於：&lt;br/&gt;  其係一種無縫膠囊，具備核心、包覆前述核心的中間層及包覆前述中間層的皮膜；&lt;br/&gt;  前述中間層含有熔點在50℃以上的油性物質；&lt;br/&gt;  在前述中間層之藉由壓縮破壞試驗得到的應力應變曲線中，&lt;br/&gt;  滿足下述式(1)之關係：&lt;br/&gt;  0.2≦脆性(B)/硬度(H)≦0.6　・・・式(1)&lt;br/&gt;  (式中，前述硬度(H)係於前述應力應變曲線的降伏點之應力，且前述脆性(B)係前述降伏點與斷裂點之應力差。)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1592" publication-number="202617347">
    <tif-files tif-type="multi-tif">
      <tif file="114124876.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於研磨製程中在流體內使用化學添加物的增強矽研磨</chinese-title>
        <english-title>ENHANCED SILICON GRIND USING CHEMICAL ADDITIVES IN FLUID DURING GRINDING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260123B">B24B37/30</main-classification>
        <further-classification edition="201201120260123B">B24B37/24</further-classification>
        <further-classification edition="200601120260123B">B24B57/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯特海德　湯瑪士Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSTERHELD, THOMAS H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米克海琳全柯　伊卡特瑞納Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKHAYLICHENKO, EKATERINA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出了一種研磨基板表面的方法和裝置。該方法包括使用承載頭將基板放置在接近研磨表面的位置，在基板上施加壓力以將基板的未拋光表面壓至研磨表面，將研磨流體流動到未拋光表面，該研磨流體包含pH調整劑、黏度添加劑、界面活性劑或其組合，並使用研磨表面對未拋光表面進行研磨，以在基板上產生拋光表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for grinding a surface of a substrate is presented. The method includes positioning a substrate proximate a grinding surface using a carrier head, providing a pressure on the substrate to press an unpolished surface of the substrate to the grinding surface, flowing a grinding fluid onto the unpolished surface, the grinding fluid comprising a pH adjuster, viscosity additives, a surfactant, or combinations thereof, and grinding the unpolished surface using the grinding surface to create a polished surface on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302:操作</p>
        <p type="p">304:操作</p>
        <p type="p">306:操作</p>
        <p type="p">308:操作</p>
        <p type="p">310:操作</p>
        <p type="p">312:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1593" publication-number="202618260">
    <tif-files tif-type="multi-tif">
      <tif file="114124878.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用神經網路的多晶粒缺陷檢測</chinese-title>
        <english-title>MULTI-DIE DEFECT DETECTION USING A NEURAL NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01N21/956</main-classification>
        <further-classification edition="202201120260123B">G06V10/82</further-classification>
        <further-classification edition="201701120260123B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊　沙佩塔許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, SAPTARSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種在半導體樣品中的運行時缺陷檢測的系統和方法。該方法包括：獲得針對該樣品上的複數個晶粒獲取的複數個運行時影像；按輸入次序將該複數個運行時影像饋送到神經網路(NN)的複數個輸入通道，其中該NN是先前在訓練階段中訓練的；及由該NN同時地處理該複數個運行時影像，以獲得複數個缺陷圖，每個缺陷圖與相應運行時影像相對應並且指示其缺陷候選存在的概率。每個給定運行時影像使用該複數個運行時影像中的剩餘影像作為目標影像的參考影像來被處理為該目標影像，並且該目標影像的該缺陷圖保持不變，不管該輸入次序的改變如何。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a system and method of runtime defect detection in a semiconductor specimen. The method includes obtaining a plurality of runtime images acquired for a plurality of dies on the specimen, feeding the plurality of runtime images to a plurality of input channels of a neural network (NN) in an input order, wherein the NN is previously trained in a training phase, and processing, by the NN, the plurality of runtime images simultaneously, to obtain a plurality of defect maps, each corresponding to a respective runtime image and indicating probabilities of defect candidate presence thereof. Each given runtime image is processed as a target image using remaining images in the plurality of runtime images as reference images of the target image, and the defect map of the target image remains invariant, irrespective of changes to the input order.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1594" publication-number="202617783">
    <tif-files tif-type="multi-tif">
      <tif file="114124892.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>５Ｔ４結合蛋白</chinese-title>
        <english-title>5T4-BINDING PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/30</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商解方治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLVE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特金斯　傑夫瑞　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATKINS, JEFFRY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POW, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭努蒂　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANNUTTI, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑森　凱蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JESSEN, KATTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供結合至5T4之重組蛋白及使用其治療癌症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides recombinant proteins that bind to 5T4 and methods of using them to treat cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1595" publication-number="202617264">
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          <doc-number>202617264</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬有機構造體、氣體吸附劑、揉合紗、纖維製品及樹脂複合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B01J20/22</main-classification>
        <further-classification edition="200601120260202B">A61L9/01</further-classification>
        <further-classification edition="200601120260202B">A61L9/014</further-classification>
        <further-classification edition="200601120260202B">D01F1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東亞合成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOAGOSEI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花井　早川真由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANAI (HAYAKAWA), MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田喜直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, YOSHINAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種金屬有機構造體，其具有：選自由Zr、Zn、Al及Mg所組成之群中之至少1種金屬原子；以及具有選自由羧基及羧酸酯基所組成之群中之至少1種基之有機配位基；上述金屬有機構造體包含上述有機配位基之局部缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1596" publication-number="202618038">
    <tif-files tif-type="multi-tif">
      <tif file="114124916.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣相沉積設備及其晶圓溫度調節方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C16/34</main-classification>
        <further-classification edition="200601120260202B">C23C16/455</further-classification>
        <further-classification edition="200601120260202B">C23C16/458</further-classification>
        <further-classification edition="200601120260202B">C23C16/52</further-classification>
        <further-classification edition="200601120260202B">C23C16/54</further-classification>
        <further-classification edition="202501120260202B">H10H20/01</further-classification>
        <further-classification edition="202501120260202B">H10H20/825</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡建正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴若皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　世平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, SHIPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氣相沉積設備及其晶圓溫度調節方法，涉及半導體設備技術領域。氣相沉積設備包含托盤、腔室頂蓋和導流板，導流板設置在托盤和腔室頂蓋之間並與托盤相對，導流板與托盤之間形成反應區域，導流板與腔室頂蓋之間形成調溫區域；控制單元基於晶圓的徑向溫度分佈結果調節向調溫區域內注入的傳熱氣體的熱導率；晶圓包括中心區域和環繞中心區域的邊緣區域，導流板包括與中心區域位置對應的環形中間區域；調節傳熱氣體的熱導率前後，環形中間區域的溫度變化幅度大於導流板其他區域的溫度變化幅度。本發明能夠有效提高晶圓表面溫度的一致性，保證晶圓表面生長的薄膜的物理、化學性質滿足工藝要求，大大提高了晶圓加工的良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:氣相沉積設備</p>
        <p type="p">20:反應腔</p>
        <p type="p">20a:調溫區域</p>
        <p type="p">20a_1:中間調溫區</p>
        <p type="p">20b:反應區域</p>
        <p type="p">201:腔室頂蓋</p>
        <p type="p">202:反應腔側壁</p>
        <p type="p">203:底板</p>
        <p type="p">205:抽氣裝置</p>
        <p type="p">210:進氣裝置</p>
        <p type="p">220:托盤</p>
        <p type="p">221:晶圓承載盤</p>
        <p type="p">230:組分供給源</p>
        <p type="p">231:流量調節閥</p>
        <p type="p">240:下測溫儀</p>
        <p type="p">250:加熱元件</p>
        <p type="p">260:控制單元</p>
        <p type="p">270a、270b:測溫感測器</p>
        <p type="p">280:導流板</p>
        <p type="p">280a:中間區域</p>
        <p type="p">280b:邊緣區域</p>
        <p type="p">280c:中心區域</p>
        <p type="p">290a、290b、290c:測溫感測器</p>
        <p type="p">j1:間隙</p>
        <p type="p">W:晶圓</p>
        <p type="p">Wa:中心區域</p>
        <p type="p">Wb:邊緣區域</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1597" publication-number="202617145">
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        <document-id>
          <doc-number>114124933</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＫＩＦ１８Ａ抑制劑治療卵巢癌的用途</chinese-title>
        <english-title>USE OF KIF18A INHIBITORS IN THE TREATMENT OF OVARIAN CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/439</main-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏遠峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊方龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FANG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SI-QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種KIF18A抑制劑在製備治療卵巢癌疾病的藥物中的用途。藥理實驗證明了化合物1-3可以抑制卵巢癌異質瘤生長，高劑量化合物可使小鼠腫瘤消退。與AMG650相比，化合物1-3較低的藥物暴露量可以降低潛在的藥物蓄積毒性。顯示化合物1-3對卵巢癌有明顯治療作用，且安全性良好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of a KIF18A inhibitor in the preparation of a medicament for treating ovarian cancer. Pharmacological experiments have demonstrated that Compounds 1-3 can inhibit the growth of ovarian cancer xenografts, and high-dose administration of the compounds can lead to tumor regression in mice. Compared with AMG650, Compounds 1-3 have lower drug exposure, which can reduce the potential toxicity caused by drug accumulation. The results indicate that Compounds 1-3 exert a significant therapeutic effect on ovarian cancer with good safety.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1598" publication-number="202617893">
    <tif-files tif-type="multi-tif">
      <tif file="114124959.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>核-殼化合物、感光性樹脂組合物和層、濾色器和感測器</chinese-title>
        <english-title>CORE-SHELL COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION AND LAYER, COLOR FILTER, AND SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">C09B57/00</main-classification>
        <further-classification edition="200601120250801B">C09B67/02</further-classification>
        <further-classification edition="200601120250801B">G03F7/004</further-classification>
        <further-classification edition="200601120250801B">G03F7/027</further-classification>
        <further-classification edition="200601120250801B">G03F7/031</further-classification>
        <further-classification edition="200601120250801B">G03F7/033</further-classification>
        <further-classification edition="200601120250801B">G02B5/20</further-classification>
        <further-classification edition="202501120250801B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文熙朝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, HEEJO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴白晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BAEK SOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐光源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KWANGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金益辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, ICKJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴秀彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全映珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, YOUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種核-殼化合物、包含所述核-殼化合物的感光性樹脂組合物、使用所述感光性樹脂組合物製造的感光性樹脂層、包括所述感光性樹脂層的濾色器、以及包括所述濾色器的互補金屬氧化物半導體圖像感測器，所述核-殼化合物包括由化學式1表示的核和包圍所述核的殼，所述殼由化學式2表示：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="451px" width="399px" file="ed10067.JPG" alt="ed10067.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="229px" width="450px" file="ed10068.JPG" alt="ed10068.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1 and a shell surrounding the core, the shell being represented by Chemical Formula 2: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="422px" width="350px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="198px" width="479px" file="ed10070.JPG" alt="ed10070.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1599" publication-number="202617545">
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      <tif file="114125029.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高架搬運車</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B65G1/00</main-classification>
        <further-classification edition="200601120260123B">B66C13/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木歩夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, AYUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">高架搬運車(1)具有行走部(2)與懸掛部(3)。懸掛部(3)具備：連接於行走部(2)的本體框架(4)；以垂掛於本體框架(4)的兩端的方式安裝的前框架(8A)及後框架(8B)；本體部(7)，其具有懸掛保持物品(90)的保持部(11)；橫向輸送部(5)，其對於本體框架(4)將本體部(7)可朝寬度方向移動地支承；分別設在前框架(8A)及後框架(8B)之一對導引部(31、31)；及經由一對導引部(31、31)，將前框架(8A)與後框架(8B)在較本體框架(4)更下方相連的連結部(35)。連結部(35)配合藉由橫向輸送部(5)所送出的本體部(7)的動作進行移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:懸掛部</p>
        <p type="p">4:本體框架</p>
        <p type="p">5:水平驅動單元(橫向輸送部)</p>
        <p type="p">6:旋轉驅動單元</p>
        <p type="p">7:升降驅動單元(本體部)</p>
        <p type="p">7A:框體</p>
        <p type="p">7Aa:框體的一部分</p>
        <p type="p">8A:前框架</p>
        <p type="p">10:升降部</p>
        <p type="p">30:框架防振機構</p>
        <p type="p">31:導引部</p>
        <p type="p">31A:第一導引構件</p>
        <p type="p">31B:第二導引構件</p>
        <p type="p">31C:第三導引構件</p>
        <p type="p">33:連接部</p>
        <p type="p">33A:第一連接構件</p>
        <p type="p">33B:第二連接構件</p>
        <p type="p">35:連結部</p>
        <p type="p">37:補強構件</p>
        <p type="p">37A:主面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1600" publication-number="202618021">
    <tif-files tif-type="multi-tif">
      <tif file="114125048.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁控濺鍍裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C23C14/35</main-classification>
        <further-classification edition="200601120260126B">H01J37/34</further-classification>
        <further-classification edition="200601120260126B">C23C14/54</further-classification>
        <further-classification edition="200601120260126B">H01L21/203</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>難波武志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMBA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福山聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUYAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗原義明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURIHARA, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>末木凛太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEKI, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之磁控濺鍍裝置具備皆收容於腔室內部之：靶(20)，其釋放成膜粒子；磁鐵(22)，其設置於靶之背面側；高電壓施加單元(31)，其對靶施加高電壓；殼體(40)，其以露出靶之正面之方式收容靶、磁鐵及高電壓施加單元，而形成靶電極(50)；絕緣板(30)，其於磁鐵之底面及側面與殼體之內壁之間，設置橫穿磁鐵之底面並通過磁鐵之側面且與腔室之內部連通之、形成殘留空氣之排氣流路之間隙而配置複數個板材；及被處理材，其於將供給至腔室內之惰性氣體離子化而使其與靶之正面碰撞時，藉由自靶之正面擊出之粒子而成膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:靶</p>
        <p type="p">22:磁鐵</p>
        <p type="p">23:磁鐵殼體</p>
        <p type="p">30:絕緣板</p>
        <p type="p">31:高電壓施加單元</p>
        <p type="p">32,33:冷卻水路</p>
        <p type="p">40:殼體(保持構件)</p>
        <p type="p">50:靶電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1601" publication-number="202619569">
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      <tif file="114125060.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於互補場效電晶體的佈線</chinese-title>
        <english-title>ROUTING FOR COMPLEMENTARY FIELD-EFFECT TRANSISTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260127B">H10D84/90</main-classification>
        <further-classification edition="202501120260127B">H10D84/85</further-classification>
        <further-classification edition="202501120260127B">H10D88/00</further-classification>
        <further-classification edition="202501120260127B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那拉希哈　史利許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARASIMHA, SHREESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片包括：一第一擴散區，其在一第一方向上延伸；及一第二擴散區，其在該第一方向上延伸，其中該第一擴散區及該第二擴散區在垂直於該第一方向的一第二方向上堆疊。該晶片亦包括：一第一軌道，其在該第一擴散區上方於該第一方向上延伸；及一第二軌道，其在該第二擴散區下方於該第一方向上延伸。該晶片亦包括：一第一頂側接觸件，其耦接在該第一擴散區的一第一頂部表面與該第一軌道之間；一第一背側接觸件，其耦接在該第二擴散區的一第一底部表面與該第二軌道之間；及一垂直連接器，其耦接在該第一軌道與該第二軌道之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip includes a first diffusion region extending in a first direction, and a second diffusion region extending in the first direction, wherein the first diffusion region and the second diffusion region are stacked in a second direction perpendicular to the first direction. The chip also includes a first track extending in the first direction above the first diffusion region and a second track extending in the first direction below the second diffusion region. The chip also includes a first topside contact coupled between a first top surface of the first diffusion region and the first track, a first backside contact coupled between a first bottom surface of the second diffusion region and the second track, and a vertical connector coupled between the first track and the second track.</p>
      </isu-abst>
      <representative-img>
        <p type="p">610:互補場效電晶體(CFET)結構</p>
        <p type="p">612:擴散區</p>
        <p type="p">614:擴散區</p>
        <p type="p">632:源極/汲極</p>
        <p type="p">642:源極/汲極</p>
        <p type="p">644:源極/汲極</p>
        <p type="p">705:佈線結構</p>
        <p type="p">710,712:頂側軌道</p>
        <p type="p">714,716:頂側軌道</p>
        <p type="p">720,722,724,726:背側軌道</p>
        <p type="p">732:通孔</p>
        <p type="p">734:通孔</p>
        <p type="p">740:垂直連接器</p>
        <p type="p">750:供應軌</p>
        <p type="p">755:接地軌</p>
        <p type="p">770:方向</p>
        <p type="p">775:方向</p>
        <p type="p">780:邊緣</p>
        <p type="p">Vdd:供應電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1602" publication-number="202619148">
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      <isuno>9</isuno>
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          <doc-number>202619148</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池單元組件、用於製造電池單元組合和電池組的夾具結構</chinese-title>
        <english-title>BATTERY CELL ASSEMBLY, JIG STRUCTURE FOR MANUFACTURING SAME, AND BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260126B">H01M50/244</main-classification>
        <further-classification edition="202101120260126B">H01M50/264</further-classification>
        <further-classification edition="202101120260126B">H01M50/502</further-classification>
        <further-classification edition="202101120260126B">H01M50/271</further-classification>
        <further-classification edition="202101120260126B">H01M50/249</further-classification>
        <further-classification edition="200601120260126B">B29C39/10</further-classification>
        <further-classification edition="200601120260126B">B29C39/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田秉峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, BYEONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, JI MYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禁宗潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEUM, JONG YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的示例性實施例的電池單元組件包括複數個電池單元，以及灌封單元，設置於所述複數個電池單元外部且插入於所述複數個電池單元之間並經配置以固定所述複數個電池單元。根據本揭露的電池單元組件可不包括具有用於接收複數個電池單元的接收空間的單獨外殼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery cell assembly according to an exemplary embodiment of the present disclosure includes a plurality of battery cells, and a potting unit disposed outside the plurality of battery cells and interposed between the plurality of battery cells and configured to fix the plurality of battery cells. A battery cell assembly according to the present disclosure may not include a separate housing having a receiving space for receiving a plurality of battery cells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電池單元組件</p>
        <p type="p">20:灌封單元</p>
        <p type="p">40:耦合構件</p>
        <p type="p">50:下板</p>
        <p type="p">70:頂框</p>
        <p type="p">72:安裝部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1603" publication-number="202618929">
    <tif-files tif-type="multi-tif">
      <tif file="114125078.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於填隙期間減少底層氧化</chinese-title>
        <english-title>REDUCED UNDERLAYER OXIDATION DURING GAP FILL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/316</main-classification>
        <further-classification edition="200601120260126B">H01L21/318</further-classification>
        <further-classification edition="200601120260126B">C23C16/455</further-classification>
        <further-classification edition="200601120260126B">H01L21/762</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達萬　蘇克蘭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHAWAN, SUKRANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索曼　巴斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMAN, BHASKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈羅伊　蘇密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGHA ROY, SUSMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈許　蘇里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, SUPRIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈爾　阿奇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGHAL, AKHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">範例處理方法可能包括將一或更多沉積前驅物提供至半導體處理腔室的處理區域。基板可以位於該處理區域內。一層界定一或更多特徵的第一含矽材料的層可以設置在基板上。該些方法可能包括將基板與一或更多沉積前驅物接觸。該接觸可能會在第一含矽材料上沉積襯墊材料。該些方法可能包括執行原子層沉積（ALD）製程。該ALD製程可能在一或更多特徵中沉積含矽與氧的材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary processing methods may include providing one or more deposition precursors to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region. A layer of a first silicon-containing material defining one or more features may be disposed on the substrate. The methods may include contacting the substrate with the one or more deposition precursors. The contacting may deposit a liner material on the first silicon-containing material. The methods may include performing an atomic layer deposition (ALD) process. The ALD process may deposit a silicon-and-oxygen-containing material in the one or more features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">205:操作</p>
        <p type="p">210:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1604" publication-number="202618858">
    <tif-files tif-type="multi-tif">
      <tif file="114125089.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於RF偏壓功率傳輸之低介電常數RF桿</chinese-title>
        <english-title>LOW-K RF ROD FOR RF BIAS POWER DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H01J37/32</main-classification>
        <further-classification edition="200601120260116B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡度希　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDUCCI, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍納瓦爾　奇朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONNAVAR, KIRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德里格斯　錫爾弗斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUES, SILVERST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬斯瓦米　卡提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASWAMY, KARTIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊利薩格　拉瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELIZAGA, LARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處所述的實施例係關於一種包含內部桿組件的裝置。在一個實施例中，內部桿組件包括第一桿和與第一桿大約為九十度定向的第二桿。在一個實施例中，橋電性連接至第一桿和第二桿。在一個實施例中，第一絕緣體位於內部桿組件的外表面上，並且外殼包圍內部桿組件。在一個實施例中，第二絕緣體位於外殼的外表面上，並且殼體圍繞該外殼。在一個實施例中，殼體的內部表面與第二絕緣體之間保持有氣隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes an inner rod assembly. In an embodiment, the inner rod assembly includes a first rod and a second rod oriented approximately ninety degrees with respect to the first rod. In an embodiment, a bridge is electrically coupled to the first rod and the second rod. In an embodiment, a first insulator is over an outer surface of the inner rod assembly, and a shell is provided around the inner rod assembly. In an embodiment, a second insulator is provided over an outer surface of the shell, and a housing surrounds the shell. In an embodiment, an interior surface of the housing is spaced away from the second insulator by an air gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">420:桿組件</p>
        <p type="p">421:水平部分</p>
        <p type="p">422:垂直部分</p>
        <p type="p">423:角落區域</p>
        <p type="p">425&lt;sub&gt;A&lt;/sub&gt;:上部</p>
        <p type="p">425&lt;sub&gt;B&lt;/sub&gt;:下部</p>
        <p type="p">448&lt;sub&gt;A&lt;/sub&gt;:元件</p>
        <p type="p">448&lt;sub&gt;B&lt;/sub&gt;:元件</p>
        <p type="p">448&lt;sub&gt;C&lt;/sub&gt;:元件</p>
        <p type="p">464&lt;sub&gt;A&lt;/sub&gt;:夾套</p>
        <p type="p">464&lt;sub&gt;B&lt;/sub&gt;:夾套</p>
        <p type="p">465&lt;sub&gt;A&lt;/sub&gt;:分離絕緣體</p>
        <p type="p">465&lt;sub&gt;B&lt;/sub&gt;:分離絕緣體</p>
        <p type="p">467:連接器</p>
        <p type="p">468:連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1605" publication-number="202619591">
    <tif-files tif-type="multi-tif">
      <tif file="114125095.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619591</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體內的發光材料結構及相關方法</chinese-title>
        <english-title>LUMIPHORIC MATERIAL STRUCTURES WITHIN LIGHT-EMITTING DIODES AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260119B">H10H20/816</main-classification>
        <further-classification edition="202501120260119B">H10H20/819</further-classification>
        <further-classification edition="202501120260119B">H10H20/841</further-classification>
        <further-classification edition="202501120260119B">H10H20/851</further-classification>
        <further-classification edition="202501120260119B">H10H20/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科銳ＬＥＤ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREELED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍斯特　史蒂文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUESTER, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHECK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯爾　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALL, NIKOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德里斯柯爾　丹尼爾　卡爾頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRISCOLL, DANIEL CARLETON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示包括發光二極體（LED）之固態照明裝置，且更特定言之，揭示LED內之發光材料的布置及相關方法。發光材料併入或以其他方式嵌入於LED晶片及LED晶圓內。提供嵌入式發光材料，使得由主動LED結構產生之光的至少一些部分在離開LED晶片表面之前經受波長轉換。發光材料層包括定位於反射層與主動LED結構之間的發光粒子及黏合層之布置。發光材料層及/或發光粒子可在LED晶片及/或LED晶圓之區內圖案化。相關方法包括在反射層之前將發光粒子及黏合層沉積於LED晶片及LED晶圓中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly arrangements of lumiphoric materials within LEDs and related methods are disclosed. Lumiphoric materials are incorporated or otherwise embedded within LED chips and LED wafers. Embedded lumiphoric materials are provided so that at least some portions of light generated by active LED structures are subject to wavelength conversion before exiting LED chip surfaces. Lumiphoric material layers include arrangements of lumiphoric particles and binder layers positioned between reflective layers and active LED structures. Lumiphoric material layers and/or lumiphoric particles may be patterned within regions of LED chips and/or LED wafers. Related methods include depositing lumiphoric particles and binder layers before reflective layers in LED chips and LED wafers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:LED晶片</p>
        <p type="p">12:主動LED結構</p>
        <p type="p">12':台面側壁</p>
        <p type="p">14:p型層</p>
        <p type="p">16:n型層</p>
        <p type="p">18:主動層</p>
        <p type="p">20:基板</p>
        <p type="p">22:發光材料層</p>
        <p type="p">24:電流擴散層</p>
        <p type="p">26:發光粒子</p>
        <p type="p">28:黏合層</p>
        <p type="p">30:介電反射層</p>
        <p type="p">32:反射層</p>
        <p type="p">32':反射層互連件</p>
        <p type="p">34:鈍化層</p>
        <p type="p">36:p接觸</p>
        <p type="p">38:n接觸</p>
        <p type="p">40:p接觸互連件</p>
        <p type="p">42:n接觸互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1606" publication-number="202618298">
    <tif-files tif-type="multi-tif">
      <tif file="114125099.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電性接觸子及電性連接裝置</chinese-title>
        <english-title>ELECTRICAL CONTACTOR AND ELECTRICAL CONNECTING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G01R1/067</main-classification>
        <further-classification edition="200601120260127B">H01L21/66</further-classification>
        <further-classification edition="200601120260127B">C04B35/58</further-classification>
        <further-classification edition="200601120260127B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久我智昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUGA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供具有高硬度、耐磨耗性，且導電性優異的電性接觸子及電性連接裝置。  &lt;br/&gt;　　本發明相關的電性接觸子是具有本體部、作為本體部之一方的前端部且與第1接觸對象接觸的第1接觸部、及作為本體部之另一方的前端部且與第2接觸對象接觸的第2接觸部的電性接觸子，其由包含鈦的導電性陶瓷材形成。又，本發明相關的電性連接裝置具備複數個接觸子，其具備與收容於框體中之被檢查體的電極部接觸的第1接觸部、及與形成在基板上之配線接觸的第2接觸部，且各個接觸子為本發明的電性接觸子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針裝置</p>
        <p type="p">10:框體</p>
        <p type="p">11:第1面</p>
        <p type="p">12:第2面</p>
        <p type="p">20:探針</p>
        <p type="p">21:第1接觸部</p>
        <p type="p">22:第2接觸部</p>
        <p type="p">30:彈性部</p>
        <p type="p">100:被檢查體</p>
        <p type="p">101:電極端子</p>
        <p type="p">200:基板</p>
        <p type="p">201:電極墊</p>
        <p type="p">220:接觸區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1607" publication-number="202617494">
    <tif-files tif-type="multi-tif">
      <tif file="114125129.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛鞍座及其製造方法與模具</chinese-title>
        <english-title>SADDLE FOR VEHICLES, METHOD AND MOLD FOR ITS MAKING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B62J1/00</main-classification>
        <further-classification edition="200601120260123B">B62J1/26</further-classification>
        <further-classification edition="200601120260123B">B62J1/18</further-classification>
        <further-classification edition="201001120260123B">B29D99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商賽理皇家集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SELLE ROYAL GROUP S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪爾法蒂　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALFATTI, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢格林　芭芭拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIGOLIN, BARBARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於車輛之鞍座，該車輛諸如自行車或機車，以及關於一種用於製造鞍座及/或用於將覆蓋元件或罩體施加至諸如自行車或機車之車輛的鞍座之襯墊組件的方法。  &lt;br/&gt;本發明亦係關於一種用於例如藉助於前述方法來製造鞍座且尤其用於將覆蓋元件或罩體施加至諸如自行車或機車之車輛的鞍座之襯墊組件的模具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a saddle for vehicles, such as bicycles or motorcycles and a method for making a saddle and/or for applying a covering element or cover to a padding component of a saddle for vehicles, such as bicycles or motorcycles. &lt;br/&gt;The present invention also relates to a mold for making a saddle, and in particular for applying a covering element or cover to a padding component of a saddle for vehicles, such as bicycles or motorcycles, for example by means of the aforementioned method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鞍座</p>
        <p type="p">3:襯墊組件</p>
        <p type="p">3a:外表面</p>
        <p type="p">3b:分離線或區段</p>
        <p type="p">3b1:第一長度</p>
        <p type="p">3b2:第二長度</p>
        <p type="p">3b3:連接長度</p>
        <p type="p">4:胞元</p>
        <p type="p">5:覆蓋元件或罩體</p>
        <p type="p">AP:前部部分</p>
        <p type="p">F:前部</p>
        <p type="p">G1:群組</p>
        <p type="p">G2:群組</p>
        <p type="p">G3:群組</p>
        <p type="p">IP:中間部分</p>
        <p type="p">PP:後部部分</p>
        <p type="p">R:後部</p>
        <p type="p">Z1:第一功能分區/第一分區或後部分區</p>
        <p type="p">Z2:第二功能分區/第二分區或中心分區</p>
        <p type="p">Z3:第三分區或側向分區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1608" publication-number="202617159">
    <tif-files tif-type="multi-tif">
      <tif file="114125131.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膦酸化合物、其藥物組合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/675</main-classification>
        <further-classification edition="200601120260202B">C07F9/6561</further-classification>
        <further-classification edition="200601120260202B">C07F9/6574</further-classification>
        <further-classification edition="200601120260202B">A61K31/664</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮濤濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, TAOTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曉金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王璐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於醫藥化學領域，涉及膦酸化合物及其用途，結構如式（I’）所示，具體地，還涉及所述化合物的藥物組合物以及其在製備用於治療疾病的藥物中的用途。  &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="323px" file="ed11013.JPG" alt="ed11013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1609" publication-number="202617719">
    <tif-files tif-type="multi-tif">
      <tif file="114125133.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經取代之吡啶及嘧啶</chinese-title>
        <english-title>SUBSTITUTED PYRIDINES AND PYRIMIDINES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/08</main-classification>
        <further-classification edition="200601120260202B">C07D401/14</further-classification>
        <further-classification edition="200601120260202B">A61K31/497</further-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61K31/444</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾奇塔克醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCHITECT THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　洋　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOUNG K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宥辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YOU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳巧新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, HAU SUN SAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波茲雷里　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORZILLERI, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述式I或式II化合物或其醫藥學上可接受之鹽、包含該等化合物之醫藥組合物、製備方法及使用方法。本發明之化合物可抑制SLC15A4與TASL之間的相互作用，且咸信其適用於治療自體免疫疾病，諸如全身性紅斑狼瘡，或發炎病狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes compounds of Formula I or II, or a pharmaceutically acceptable salt thereof, pharmaceutical compositions comprising the compounds, methods of preparation, and methods of use. The compounds of the disclosure can inhibit the interaction between SLC15A4 and TASL, and are believed to be useful for treating an autoimmune disease, such as systemic lupus erythematosus, or an inflammatory condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1610" publication-number="202619150">
    <tif-files tif-type="multi-tif">
      <tif file="114125142.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池組以及包括其之電子裝置</chinese-title>
        <english-title>BATTERY PACK AND ELECTRICAL DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260123B">H01M50/502</main-classification>
        <further-classification edition="202101120260123B">H01M50/509</further-classification>
        <further-classification edition="202101120260123B">H01M50/507</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁誠桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SEONG-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李永奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNG-KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭東逵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, DONG-GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的電池組可包括：多個電池芯，包括第一電極和第二電極；電池框架，配置為支撐和儲存多個電池芯；電源匯流排，設置在電池框架的一側的最外側區域，並由多個連接線在一個方向上電連接到電池芯；以及電源匯流排座部，包括在一個方向上突出以引導電源匯流排的安裝的電源匯流排導引肋，並配置為使電源匯流排安裝於其上，其中電源匯流排的一個表面和電源匯流排導引肋的一端可具有相同高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery pack according to the present disclosure may include: a plurality of battery cells including a first electrode and a second electrode; a cell frame configured to support and store the plurality of battery cells; a power busbar disposed at an outermost region on one side of the cell frame, and electrically connected to the battery cells in one direction by a plurality of connecting wires; and a power busbar seating portion including a power busbar guide rib protruding in one direction to guide the seating of the power busbar, and configured such that the power busbar is seated thereon, wherein one surface of the power busbar and one end of the power busbar guide rib may have the same height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池組</p>
        <p type="p">100:電池芯</p>
        <p type="p">200:電池框架</p>
        <p type="p">210:電源匯流排座部</p>
        <p type="p">220:副匯流排座部</p>
        <p type="p">230:連接匯流排座部</p>
        <p type="p">240:底板</p>
        <p type="p">300:電源匯流排</p>
        <p type="p">310:電源端子</p>
        <p type="p">400:副匯流排</p>
        <p type="p">500:連接匯流排</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1611" publication-number="202617994">
    <tif-files tif-type="multi-tif">
      <tif file="114125149.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於肌肉障礙的組成物和方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR MUSCLE DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N15/113</main-classification>
        <further-classification edition="200601120260202B">C12N15/86</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
        <further-classification edition="200601120260202B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯謝德里　沙奧拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SESHADRI, SAURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔必包德巴爾　謝里夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABEBORDBAR, SHARIF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔必包德巴爾　沙雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABEBORDBAR, SHAYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了重組核酸，該等重組核酸包含含有miR-138或miR-139支架序列的初級微小RNA（pri-miRNA）支架以及靶向基因轉錄物的指導序列。本文還揭露了使用這樣的重組核酸用於抑制基因或基因產物表現的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides recombinant nucleic acids comprising a primary microRNA (pri-miRNA) scaffold comprising a scaffold sequence of miR-138 or miR-139 together with a guide sequence that targets a gene transcript. Methods of use of such recombinant nucleic acids for inhibiting expression of a gene or gene product are also disclosed herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1612" publication-number="202617871">
    <tif-files tif-type="multi-tif">
      <tif file="114125161.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機交聯粒子、有機交聯粒子的製造方法、含有有機交聯粒子之組成物、硬化體、覆銅箔層壓板、可撓性覆銅箔層壓板、層間絕緣材、樹脂塗覆銅箔</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C08L53/02</main-classification>
        <further-classification edition="202501120260122B">C08L23/08</further-classification>
        <further-classification edition="200601120260122B">C08L25/10</further-classification>
        <further-classification edition="200601120260122B">C08F4/64</further-classification>
        <further-classification edition="200601120260122B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤遼太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種低介電特性優異之有機交聯粒子。解決該課題之手段為一種有機交聯粒子，係含有烯烴-芳香族乙烯基化合物-芳香族多烯共聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1613" publication-number="202617885">
    <tif-files tif-type="multi-tif">
      <tif file="114125185.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱導性聚矽氧組合物</chinese-title>
        <english-title>THERMALLY CONDUCTIVE SILICONE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C08L83/05</main-classification>
        <further-classification edition="200601120260122B">C08L83/07</further-classification>
        <further-classification edition="200601120260122B">C08K5/5415</further-classification>
        <further-classification edition="200601120260122B">C08K3/22</further-classification>
        <further-classification edition="200601120260122B">C10M107/50</further-classification>
        <further-classification edition="200601120260122B">C09K3/12</further-classification>
        <further-classification edition="200601120260122B">B01J23/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商漢高股份有限及兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIANYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　道強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, DAOQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉海洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAIYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高文廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, WENTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱瑞睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, RUIRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱星宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種熱導性聚矽氧組合物，且尤其係關於在固化時展現良好熱導率及超低模數之組合、較佳地在高溫或苛刻熱循環條件下具有高抗老化性之熱導性聚矽氧組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a thermally conductive silicone composition, and in particular relates to a thermally conductive silicone composition exhibiting a combination of good thermal conductivity and ultra-low modulus, preferably high aging resistance under high temperature or harsh thermal cycling conditions when cured.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1614" publication-number="202618783">
    <tif-files tif-type="multi-tif">
      <tif file="114125189.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉助於擴展器架構進行記憶體裝置的存取控制之方法及設備</chinese-title>
        <english-title>METHOD FOR PERFORMING ACCESS CONTROL OF MEMORY DEVICE WITH AID OF EXPANDER ARCHITECTURE, AND ASSOCIATED APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251021B">G11C16/06</main-classification>
        <further-classification edition="200601120251021B">G06F13/14</further-classification>
        <further-classification edition="201601120251021B">G06F12/0866</further-classification>
        <further-classification edition="200601120251021B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藉助於擴展器架構進行記憶體裝置的存取控制之方法及相關設備，記憶體裝置可包含記憶體控制器與非揮發性(NV)記憶體。該方法可包含：透過一輸入輸出(IO)擴展器電路將至少一命令從記憶體控制器傳送至NV記憶體，IO擴展器電路耦接於記憶體控制器與NV記憶體之間，以開始藉由多個通道分別對NV記憶體元件進行至少一存取操作；以及在進行任何存取操作的期間，利用IO擴展器電路擴展記憶體控制器對NV記憶體的IO控制，以供存取相對應於複數個子通道中的任何子通道的至少一NV記憶體元件，該複數個子通道從該多個通道中的一單一通道分裂而得。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for performing access control of a memory device with aid of expander architecture and associated apparatus are provided, where the memory device may include a memory controller and a non-volatile (NV) memory. The method may include: sending at least one command from the memory controller to the NV memory through an input-output-expander (IO-expander) circuit, with the IO-expander circuit being coupled between the memory controller and the NV memory, in order to start performing at least one access operation on the plurality of NV memory elements via multiple channels, respectively; and during performing any access operation among the at least one access operation, utilizing the IO-expander circuit to expand IO control of the memory controller over the NV memory, for accessing at least one NV memory element corresponding to any sub-channel among a plurality of sub-channels, the plurality of sub-channels split from a single channel among the multiple channels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">50:主機裝置</p>
        <p type="p">52:處理器</p>
        <p type="p">54:電源供應電路</p>
        <p type="p">58,118:傳輸介面電路</p>
        <p type="p">100:記憶體裝置</p>
        <p type="p">110:快閃記憶體控制器</p>
        <p type="p">112:微處理器</p>
        <p type="p">112C:程式碼</p>
        <p type="p">112M:唯讀記憶體(ROM)</p>
        <p type="p">114:控制邏輯電路</p>
        <p type="p">115:輸入輸出(IO)擴展器電路</p>
        <p type="p">115F:介面(IF)電路</p>
        <p type="p">116:隨機存取記憶體(RAM)</p>
        <p type="p">120:快閃記憶體模組</p>
        <p type="p">122-1~122-N:快閃記憶體元件</p>
        <p type="p">DP(0)~DP(N):資料保護電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1615" publication-number="202618449">
    <tif-files tif-type="multi-tif">
      <tif file="114125201.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微影設備之倍縮光罩捕獲配置</chinese-title>
        <english-title>RETICLE CAPTURE ARRANGEMENT FOR A LITHOGRAPHIC APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G03F7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫利泰爾諾　馬修　史蒂芬　比頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLITERNO, MATTHEW STEPHEN BEATON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　戴　克豪夫　馬卡斯　安德納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DE KERKHOF, MARCUS ADRIANUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫曼諾夫　羅伯特　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMANOFF, ROBERT JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩斯　斐爾康　維特　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEREZ-FALCON, VICTOR ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種包括用於夾持諸如一倍縮光罩之一物件之一靜電夾頭的載物台配置。該靜電夾頭包括：至少一個主要電源，其用於將電力至少提供至該靜電夾頭；及至少一個備用電源，其可操作以在該至少一個主要電源未將電力提供至該靜電夾頭之情況下將電力提供至該靜電夾頭以將該物件保持至少一時段，其中該至少一個備用電源經組態以供應不大於5 mA之一電流，及/或該備用電源及該靜電夾頭儲存不大於10 J。另外，亦描述一種用以將倍縮光罩載物台移動至一預定義位置且捕獲該倍縮光罩之配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stage arrangement including an electrostatic clamp for clamping an object such a reticle. The electrostatic clamp includes at least one primary power supply for providing power at least to the electrostatic clamp; and at least one backup power supply operable to provide power to the electrostatic clamp to retain the object for at least a time period in the event of the at least one primary power supply not providing power to the electrostatic clamp, wherein the at least the one backup power supply is configured to supply a current no larger than 5 mA and/or the backup power supply and the electrostatic clamp store no more than 10 J. In addition an arrangement is described to move the reticle stage to a pre-defined location and capture the reticle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:Y噴嘴模組</p>
        <p type="p">205:倍縮光罩遮罩葉片</p>
        <p type="p">210:倍縮光罩載物台</p>
        <p type="p">215:倍縮光罩位置</p>
        <p type="p">220:倍縮光罩位置</p>
        <p type="p">225:區</p>
        <p type="p">230:支撐件</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1616" publication-number="202618565">
    <tif-files tif-type="multi-tif">
      <tif file="114125220.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉助於選擇性軟位元傳輸進行記憶體裝置的資料保護控制之方法及設備</chinese-title>
        <english-title>METHOD FOR PERFORMING DATA PROTECTION CONTROL OF MEMORY DEVICE WITH AID OF SELECTIVE SOFT-BIT TRANSMISSION, AND ASSOCIATED APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G06F12/14</main-classification>
        <further-classification edition="200601120251001B">G06F13/14</further-classification>
        <further-classification edition="201601120251001B">G06F12/08</further-classification>
        <further-classification edition="200601120251001B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供藉助於選擇性軟位元傳輸進行記憶體裝置的資料保護控制之方法及設備，該記憶體裝置可包含記憶體控制器和非揮發性(NV)記憶體。該方法可包含：向NV記憶體傳送至少一讀取命令以及控制器側指示，該控制器側指示用以選擇性地在NV記憶體啟用選擇性軟位元傳輸，以供取得針對複數個區塊中的一第一區塊內的一第一頁面的軟解碼資訊，其中該第一頁面用以儲存第一資料；以及從NV記憶體接收該軟解碼資訊以及記憶體側指示，其中該記憶體側指示於一第一週期中用以指出NV記憶體是否將於一第二週期中傳輸至少一軟位元，該第二週期在該第一週期之後。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for performing data protection control of a memory device with aid of selective soft-bit transmission and associated apparatus are provided, where the memory device may include a memory controller and a non-volatile (NV) memory. The method may include: sending at least one read command as well as a controller-side indication, the controller-side indication for selectively enabling the selective soft-bit transmission at the NV memory, to the NV memory for obtaining soft-decoding information regarding a first page within a first block among the plurality of blocks, wherein the first page is arranged to store first data; and receiving the soft-decoding information as well as a memory-side indication from the NV memory, wherein the memory-side indication at a first cycle is arranged to indicate whether the NV memory is going to transmit at least one soft bit at a second cycle, the second cycle coming after the first cycle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">50:主機裝置</p>
        <p type="p">52:處理器</p>
        <p type="p">54:電源供應電路</p>
        <p type="p">58,118:傳輸介面電路</p>
        <p type="p">100:記憶體裝置</p>
        <p type="p">110:快閃記憶體控制器</p>
        <p type="p">112:微處理器</p>
        <p type="p">112C:程式碼</p>
        <p type="p">112M:唯讀記憶體(ROM)</p>
        <p type="p">114:控制邏輯電路</p>
        <p type="p">116:隨機存取記憶體(RAM)</p>
        <p type="p">120:快閃記憶體模組</p>
        <p type="p">122-1~122-N:快閃記憶體元件</p>
        <p type="p">130:資料保護(DP)電路</p>
        <p type="p">130C:資料保護控制(DPC)電路</p>
        <p type="p">NC:雜訊消除器</p>
        <p type="p">ENDEC:編碼器與解碼器電路</p>
        <p type="p">RNDRN:隨機化器與解隨機化器電路</p>
        <p type="p">DQ:資料訊號</p>
        <p type="p">IND:預定指示訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1617" publication-number="202616963">
    <tif-files tif-type="multi-tif">
      <tif file="114125221.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>豆乳之製造方法及豆乳</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260202B">A23L11/65</main-classification>
        <further-classification edition="201601120260202B">A23L11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商龜甲萬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKKOMAN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那須敦史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASU, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲原丈晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHARA, TAKEHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古賀希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, NOZOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野直土</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNO, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沼野一明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUMANO, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">［課題］本發明提供一種豆乳之製造方法，其係能以與傳統相同的大豆配合量製造大豆固體成分濃度比傳統更高的豆乳，並且亦可降低源自大豆之不適氣味；並提供一種豆乳，其係在維持豆乳風味之同時源自大豆之不適氣味降低。  &lt;br/&gt;［解決手段］本發明中：步驟S3，對於大豆或脫脂大豆經磨碎後進行固液分離而獲得之未滅菌豆乳，藉由間接加熱方式或電加熱方式，預熱至液溫達90℃以上；步驟S4，對於預熱後的未滅菌豆乳，以蒸氣注入方式或蒸氣浸出方式等蒸氣直接加熱方式進行滅菌處理；步驟S5，對於滅菌處理後的滅菌豆乳，進行減壓冷卻至液溫達85℃以下；連續進行上述各步驟，同時將預熱時的液溫與減壓冷卻時的液溫之差設定為5～35℃，獲得含有3質量%以上的大豆蛋白且對應每1質量%大豆蛋白之己醛含量為15ppb以下的豆乳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:磨碎步驟</p>
        <p type="p">S2:固液分離步驟</p>
        <p type="p">S3:預熱步驟</p>
        <p type="p">S4:滅菌處理步驟</p>
        <p type="p">S5:減壓冷卻步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1618" publication-number="202619120">
    <tif-files tif-type="multi-tif">
      <tif file="114125223.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆疊半導體架構中之冗餘接合焊墊</chinese-title>
        <english-title>REDUNDANT BOND PADS IN STACKED SEMICONDUCTOR ARCHITECTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L23/538</main-classification>
        <further-classification edition="200601120260123B">H01L23/488</further-classification>
        <further-classification edition="200601120260123B">H01L21/60</further-classification>
        <further-classification edition="202301120260123B">H01L25/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布珊　巴拉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUSHAN, BHARAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞克　庫諾　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAREKH, KUNAL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海内克　拉爾斯　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEINECK, LARS P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　阿克斯海　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, AKSHAY N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述用於堆疊半導體架構中之冗餘接合焊墊之方法、系統及裝置。一半導體裝置可經形成具有一或多個冗餘結構。一記憶體晶片及一邏輯晶粒可經形成具有將多個接合焊墊互連在一起之一重佈層。該重佈層可將該等接合焊墊與一共同通孔耦合，其中該共同通孔與一各別裝置之電路系統介接。額外地或替代地，一記憶體晶片及一邏輯晶粒可經形成具有形成平行電路徑之冗餘通孔路徑。該等冗餘通孔路徑可將裝置電路系統與一裝置之各別接合焊墊耦合。該記憶體晶片及該邏輯晶粒可接合在一起以形成一半導體裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for redundant bond pads in stacked semiconductor architectures are described. A semiconductor device may be formed one or more redundant structures. A memory chip and a logic die may be formed with a redistribution layer that interconnects multiple bonding pads together. The redistribution layer may couple the bonding pads with a common via, where the common via interfaces with circuitry of a respective device. Additionally, or alternatively, a memory chip and a logic die may be formed with redundant via paths that form parallel electrical paths. The redundant via paths may couple device circuitry with respective bonding pads of a device. The memory chip and the logic die may be bonded together to form a semiconductor device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300-a:架構</p>
        <p type="p">300-b:架構</p>
        <p type="p">305-a:晶粒</p>
        <p type="p">305-b:晶粒</p>
        <p type="p">310-a:記憶體晶片</p>
        <p type="p">310-b:記憶體晶片</p>
        <p type="p">315:層</p>
        <p type="p">320:層</p>
        <p type="p">325-a:接合</p>
        <p type="p">325-b:接合</p>
        <p type="p">325-c:接合</p>
        <p type="p">325-d:接合</p>
        <p type="p">330:重佈層(RDL)</p>
        <p type="p">335:重佈層(RDL)</p>
        <p type="p">340:通孔</p>
        <p type="p">345:通孔</p>
        <p type="p">350:導電焊墊</p>
        <p type="p">350-a:導電焊墊</p>
        <p type="p">350-b:導電焊墊</p>
        <p type="p">350-c:導電焊墊</p>
        <p type="p">350-d:導電焊墊</p>
        <p type="p">350-e:導電焊墊</p>
        <p type="p">350-f:導電焊墊</p>
        <p type="p">355:電路系統</p>
        <p type="p">360:電路系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1619" publication-number="202618262">
    <tif-files tif-type="multi-tif">
      <tif file="114125245.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶電粒子系統中的覆蓋靶材測量和位移補償以及相關方法</chinese-title>
        <english-title>OVERLAY TARGET MEASUREMENT AND SHIFT COMPENSATION IN CHARGED PARTICLE SYSTEMS AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">G01N23/203</main-classification>
        <further-classification edition="201801120260119B">G01N23/2206</further-classification>
        <further-classification edition="201801120260119B">G01N23/2251</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>依薩可夫　依格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISAKOV, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜夫戴芬　艾薩夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUVDEVAN, ASSAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞朱萊　哈瑞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZULAY, HAREL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤迪　亞柏拉哈莫夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UDI, ABRAHAMOV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種補償帶電粒子系統的不同類型感測器的回應時間差異的方法和系統。這涉及獲得覆蓋靶材的第一和第二次級電子圖像以及反向散射電子圖像，此等圖像是根據第一和第二掃瞄圖案用照射電子束進行掃瞄的。基於第一圖像和旋轉的第二圖像之間的配準，決定次級電子位移和反向散射電子位移。基於此等位移決定補償位移。此等圖像是使用低於用於產生第一反向散射電子圖像的反向散射電子感測器的回應週期的像素抓取週期獲取的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and system that compensate for differences in response times of different types of sensors of a charged particle system. This involves obtaining first and second secondary electron images and backscattered electron images of an overlay target, scanned with an illuminating electron beam in accordance with first and second scan patterns. A secondary electron shift and a backscattered electron shift are determined based on a registration between the first and a rotated second images. A compensation shift is determined based on these shifts. The images are acquired using a pixel grab period lower than a response period of a backscattered electron sensor used to generate the first backscattered electron image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">101:步驟</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1620" publication-number="202619423">
    <tif-files tif-type="multi-tif">
      <tif file="114125254.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125254</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貫通電極基板、安裝基板及貫通電極基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H05K1/11</main-classification>
        <further-classification edition="200601120260123B">H05K3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉持悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOCHI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田侑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬渡宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAWATARI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">貫通電極係包含於最小部閉鎖貫通孔的閉鎖電極、第1填充電極以及第2填充電極。閉鎖電極係包含位於最小部的閉鎖部分、從閉鎖部分沿著壁面擴展至第1面的第1部分以及從閉鎖部分沿著壁面擴展至第2面的第2部分。第1填充電極係位於第1部分的內側，且於基板的厚度方向位於閉鎖部分與第1面之間。第2填充電極係位於第2部分的內側，且於厚度方向位於閉鎖部分與第2面之間。閉鎖電極係包含複數第1結晶粒。第1填充電極以及第2填充電極係分別包含具有與第1結晶粒不同之結晶構造的複數第2結晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基板</p>
        <p type="p">13:第1面</p>
        <p type="p">14:第2面</p>
        <p type="p">16:壁面</p>
        <p type="p">20:貫通電極</p>
        <p type="p">21:閉鎖電極</p>
        <p type="p">23:閉鎖部分</p>
        <p type="p">24:第1部分</p>
        <p type="p">25:第2部分</p>
        <p type="p">27:第1填充電極</p>
        <p type="p">28:第2填充電極</p>
        <p type="p">151:中心點</p>
        <p type="p">161:第1端</p>
        <p type="p">162:第2端</p>
        <p type="p">163:最小部</p>
        <p type="p">201:晶種層</p>
        <p type="p">211:第1邊界</p>
        <p type="p">212:第2邊界</p>
        <p type="p">231:第1底部</p>
        <p type="p">232:第2底部</p>
        <p type="p">233:第1虛擬面</p>
        <p type="p">234:第2虛擬面</p>
        <p type="p">241,251,271,281:端面</p>
        <p type="p">L1:中心軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1621" publication-number="202617170">
    <tif-files tif-type="multi-tif">
      <tif file="114125256.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>植物性添加劑及其在促進生長與防治球蟲病中的應用</chinese-title>
        <english-title>PHYTOGENIC ADDITIVE AND APPLICATION THEREOF IN PROMOTING GROWTH AND COMBATING COCCIDIOSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K36/48</main-classification>
        <further-classification edition="200601120260202B">A61P33/00</further-classification>
        <further-classification edition="201601120260202B">A23K10/30</further-classification>
        <further-classification edition="201601120260202B">A23K50/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中央研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACADEMIA SINICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐麗芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHYUR, LIE-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連一洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, YI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MING-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭源斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUAN-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮氏　明雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, MINH TUYET THI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張孟亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MENG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種組合物，其包含有效量之紅菽草(&lt;i&gt;Trifolium pratense&lt;/i&gt;, TP)萃取物(TPE)或其中所含之活性成分(TP_API)、或TP及TPE或TP及TP_API的組合。本揭示進一步提供該組合物之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a composition comprising an effective amount of a &lt;i&gt;Trifolium pratense&lt;/i&gt; (TP) extract (TPE) or an active ingredient(s) contained therein (TP_API), or a combination of TP and TPE or TP and TP_API. The present disclosure further provides uses of the composition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1622" publication-number="202617495">
    <tif-files tif-type="multi-tif">
      <tif file="114125274.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將自行車鞍座連接至自行車座桿的叉</chinese-title>
        <english-title>FORK FOR CONNECTING A BICYCLE SADDLE TO THE SEAT POST OF A BICYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B62J1/02</main-classification>
        <further-classification edition="200601120260123B">B62J1/08</further-classification>
        <further-classification edition="200601120260123B">B62K19/16</further-classification>
        <further-classification edition="201501120260123B">B33Y80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商賽理皇家集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SELLE ROYAL GROUP S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪爾法蒂　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALFATTI, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢格林　芭芭拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIGOLIN, BARBARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安東法托　安德亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDOLFATTO, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於自行車鞍座領域，並且特定而言，係關於一種用於將一自行車鞍座連接或連結至一自行車之座桿的連接元件，諸如一叉或導軌，以及一種生產此連接元件之方法。  &lt;br/&gt;本發明亦係關於一種包含諸如一叉或導軌之此類連接元件的自行車鞍座，以及一種包含此類鞍座之自行車。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of bicycle saddles and, in particular, concerns a connection element, such as for example a fork or rail, for connecting or linking a bicycle saddle to the seat post of a bicycle as well as a method of production of such connection element. &lt;br/&gt;The present invention also relates to a bicycle saddle comprising such a connection element, such as for example a fork or rail, as well as a bicycle comprising such a saddle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:叉/連接元件</p>
        <p type="p">2:主體</p>
        <p type="p">2a:約束部分</p>
        <p type="p">2b:叉部或棒桿</p>
        <p type="p">2b1:第一前端/第一端</p>
        <p type="p">2b2:第二端</p>
        <p type="p">2c:連接部分</p>
        <p type="p">3:加強組件或插入件</p>
        <p type="p">3a:支撐組件或部分</p>
        <p type="p">3b:支撐組件或部分</p>
        <p type="p">3c:主連接區段</p>
        <p type="p">3c2:末端部分</p>
        <p type="p">3d:輔助連接區段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1623" publication-number="202617773">
    <tif-files tif-type="multi-tif">
      <tif file="114125282.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＢＤＣＡ２抗體及其用途</chinese-title>
        <english-title>ANTI-BDCA2 ANTIBODIES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">C12N15/13</further-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州博之銳生物製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIORAY PHARMACEUTICAL (HANGZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商浙江博銳生物製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIORAY PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHENHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聶磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIE, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王艶爽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANSHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣美珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, MEIZHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐統</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王海彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAIBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及抗BDCA2抗體及其用途。具體地，本揭露涉及抗BDCA2抗體或其抗原結合片段、編碼其的核酸、包含其的醫藥組成物以及其在治療疾病中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to anti-BDCA2 antibodies and uses thereof. Specifically, the disclosure involves anti-BDCA2 antibodies or antigen-binding fragments thereof, nucleic acids encoding the antibodies or antigen-binding fragments thereof, pharmaceutical compositions containing the antibodies or antigen-binding fragments thereof, and their uses in the treatment of diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1624" publication-number="202617729">
    <tif-files tif-type="multi-tif">
      <tif file="114125297.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嗒胺類化合物及其醫藥用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D491/22</main-classification>
        <further-classification edition="200601120260202B">A61K31/5025</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧佳佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鐵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡垚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武文超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於醫藥化學領域，涉及嗒𠯤胺類化合物及其醫藥用途，結構如式(I)所示，具體地，還涉及所述化合物的製備方法、藥物組合物以及其在治療疾病中的用途。  &lt;br/&gt;&lt;img align="absmiddle" height="198px" width="175px" file="ed10854.JPG" alt="ed10854.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1625" publication-number="202617203">
    <tif-files tif-type="multi-tif">
      <tif file="114125298.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>主動柱塞</chinese-title>
        <english-title>ACTIVE PLUNGER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">A61M5/315</main-classification>
        <further-classification edition="200601120260126B">A61M5/36</further-classification>
        <further-classification edition="200601120260126B">A61M5/145</further-classification>
        <further-classification edition="200601120260126B">A61M5/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商加柏公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERBET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡克林　傑羅姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CACLIN, JEROME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於注射一醫療流體之注射裝置(1)，其包含：&lt;br/&gt;  - 一注射筒(14)，其包含：一本體(2)，其在一縱向方向(X)上延伸，界定一內部空間(15)；及一柱塞(3)，其經組配以分隔該本體(2)之該內部空間(15)與該注射筒(2)之一外部空間(16)，該柱塞(3)經組配用於沿著該縱向方向(X)在該內部空間(15)內來回行進，包含一抽空路徑(10)及一第一固定構件(21)，該抽空路徑(10)包含一內部腔室(45)，該柱塞(3)包含一移動式選擇器(6)，該移動式選擇器至少包含一下部部分(11)及一上部部分(12)，該下部部分(11)包含一密封表面(33)，該移動式選擇器(6)經組配以在一封閉位置與一打開位置之間切換，在該封閉位置中，該密封表面(33)與該抽空路徑(10)重疊，在該打開位置中，該移動式選擇器(6)釋放該抽空路徑(10)，&lt;br/&gt;  - 一注射器(9)，其包含一流體偵測系統(8)及至少一電動注射器推桿(4)，該電動注射器推桿(4)包含一命令桿(5)及經組配以固定該第一固定構件(21)之一第二固定構件(22)，該流體偵測系統(8)經組配以在偵測到一流體時觸發該命令桿(5)，&lt;br/&gt;  一封閉系統(7)，其經組配以允許該移動式選擇器(6)自一打開位置切換至一封閉位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Injection device (1) for injecting a medical fluid comprising:&lt;br/&gt; - A syringe (14) comprising a body (2) extending in a longitudinal direction (X) defining an inner space (15) and a plunger (3) configurated to separate said inner space (15) of said body (2) from an outer space (16) of said syringe (2), said plunger (3) configured for travelling back and forth within the inner space (15) along the longitudinal direction (X) comprising an evacuation path (10) and a first fixation mean (21), said evacuation path (10) comprises an internal chamber (45), said plunger (3) comprises a mobile selector (6) comprising at least a lower portion (11) and an upper portion (12), said lower portion (11) comprising a sealing surface (33), said mobile selector (6) configured to switch between a closed position in which said sealing surface (33) overlap said evacuation path (10) and an open position in which said mobile selector (6) liberate said evacuation path (10),&lt;br/&gt; - An injector (9) comprising a fluid detection system (8) and at least a motorized injector ram (4), said motorized injector ram (4) comprising a command stem (5), and a second fixation mean (22) configured to fix said first fixation mean (21), said fluid detection system (8) configured to trigger the command stem (5) when a fluid is detected,&lt;br/&gt; A closing system (7) configured to allow said mobile selector (6) to switch from an open position to a closed position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:注射裝置</p>
        <p type="p">2:本體</p>
        <p type="p">3:柱塞</p>
        <p type="p">4:電動注射器推桿</p>
        <p type="p">5:命令桿</p>
        <p type="p">6:移動式選擇器</p>
        <p type="p">7:封閉系統</p>
        <p type="p">8:流體偵測系統</p>
        <p type="p">9:注射器</p>
        <p type="p">10:抽空路徑</p>
        <p type="p">11:下部部分</p>
        <p type="p">12:上部部分</p>
        <p type="p">14:注射筒</p>
        <p type="p">15:內部空間</p>
        <p type="p">16:外部空間</p>
        <p type="p">19:彈簧</p>
        <p type="p">21:第一固定構件</p>
        <p type="p">22:第二固定構件</p>
        <p type="p">23:第一徑向肋狀物表面</p>
        <p type="p">24:第二徑向肋狀物表面</p>
        <p type="p">25:第一徑向凹槽表面</p>
        <p type="p">26:第二凹槽表面</p>
        <p type="p">30:自由末端部分</p>
        <p type="p">31:第一承載表面</p>
        <p type="p">32:第二承載表面</p>
        <p type="p">33:密封表面</p>
        <p type="p">35:光束傳輸器</p>
        <p type="p">36:光束接收器</p>
        <p type="p">40:密封接頭</p>
        <p type="p">42:縱向軸桿</p>
        <p type="p">45:內部腔室</p>
        <p type="p">46:內部徑向表面</p>
        <p type="p">48:遠端</p>
        <p type="p">49:凹部</p>
        <p type="p">X:縱向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1626" publication-number="202619538">
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      <volno>24</volno>
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          <doc-number>202619538</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260126B">H10D30/67</main-classification>
        <further-classification edition="202301120260126B">H10B12/00</further-classification>
        <further-classification edition="202501120260126B">H10D1/68</further-classification>
        <further-classification edition="202501120260126B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮入秀和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAIRI, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神保安弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINBO, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村川努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAWA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井坂史人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISAKA, FUMITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉田求</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURATA, MOTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種易於微型化的半導體裝置及半導體裝置的製造方法。該半導體裝置包括第一絕緣層、第二絕緣層及電晶體。電晶體包括第一導電層、第二導電層、第一半導體層、第三絕緣層及第三導電層。第一絕緣層位於第一導電層上並具有到達第一導電層的狹縫，第二導電層位於第一絕緣層上，第一半導體層包括與第二導電層接觸的第一部分、沿著狹縫的側面的第二部分及在狹縫的內部與第一導電層的頂面接觸的第三部分，第三導電層具有隔著第三絕緣層與第一半導體層的第二部分對置的部分，第二絕緣層具有隔著第三絕緣層及第三導電層與第一半導體層的第二部分對置的部分以及隔著第一半導體層的第三部分與第一導電層的頂面重疊的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device that can be easily miniaturized is provided. The semiconductor device includes a first insulating layer, a second insulating layer, and a transistor. The transistor includes a first conductive layer, a second conductive layer, a first semiconductor layer, a third insulating layer, and a third conductive layer. The first insulating layer is over the first conductive layer and includes a slit reaching the first conductive layer. The second conductive layer is over the first insulating layer. The first semiconductor layer includes a first portion in contact with the second conductive layer, a second portion along a side surface of the slit, and a third portion in contact with a top surface of the first conductive layer in the slit. The third conductive layer includes a portion facing a second portion of the first semiconductor layer with the third insulating layer therebetween. The second insulating layer includes a portion facing the second portion of the first semiconductor layer with the third insulating layer and the third conductive layer of the first semiconductor layer therebetween and a portion overlapping with the top surface with the third portion of the first conductive layer therebetween.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:電晶體</p>
        <p type="p">10b:電晶體</p>
        <p type="p">11:絕緣層</p>
        <p type="p">15:記憶單元</p>
        <p type="p">20:狹縫</p>
        <p type="p">21:半導體層</p>
        <p type="p">22:絕緣層</p>
        <p type="p">23:導電層</p>
        <p type="p">23a:導電層</p>
        <p type="p">23b:導電層</p>
        <p type="p">24:導電層</p>
        <p type="p">24a:導電層</p>
        <p type="p">24b:導電層</p>
        <p type="p">25:導電層</p>
        <p type="p">25a:導電層</p>
        <p type="p">25b:導電層</p>
        <p type="p">26:導電層</p>
        <p type="p">27:插頭</p>
        <p type="p">30:電容器</p>
        <p type="p">35:絕緣層</p>
        <p type="p">41:絕緣層</p>
        <p type="p">44:絕緣層</p>
        <p type="p">46:絕緣層</p>
        <p type="p">51:導電層</p>
        <p type="p">52:絕緣層</p>
        <p type="p">53:導電層</p>
        <p type="p">55:導電層</p>
        <p type="p">56:絕緣層</p>
        <p type="p">59:絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1627" publication-number="202617748">
    <tif-files tif-type="multi-tif">
      <tif file="114125320.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Apelin-13多肽突變體</chinese-title>
        <english-title>APELIN-13 PEPTIDE MUTANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K7/08</main-classification>
        <further-classification edition="200601120260202B">A61K38/10</further-classification>
        <further-classification edition="200601120260202B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浙江大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHEJIANG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>良渚實驗室</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANGZHU LABORATORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戢素玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, SUYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了Apelin-13多肽突變體、包含該Apelin-13多肽突變體的藥物組成物及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1628" publication-number="202617758">
    <tif-files tif-type="multi-tif">
      <tif file="114125326.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表現構築體</chinese-title>
        <english-title>EXPRESSION CONSTRUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/705</main-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="201001120260202B">C12N5/0783</further-classification>
        <further-classification edition="200601120260202B">C12N15/86</further-classification>
        <further-classification edition="202501120260202B">A61K40/11</further-classification>
        <further-classification edition="202501120260202B">A61K40/31</further-classification>
        <further-classification edition="202501120260202B">A61K40/42</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商圭爾醫療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUELL THERAPEUTICS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥戈文　珍妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGOVERN, JENNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種表現構築體、包含該表現構築體之核酸或載體或細胞，及該表現構築體、核酸、載體或細胞之各種用途。特定言之，提供一種表現構築體，其包含PGK啟動子可操作地連接至(i)編碼嵌合抗原受體(chimeric antigen receptor；CAR)之第一核苷酸序列及(ii)編碼FOXP3多肽之第二核苷酸序列，其中該第一核苷酸序列位於該第二核苷酸序列上游。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An expression construct, a nucleic acid or vector or cell comprising said expression construct, and various uses of said expression construct, nucleic acid, vector or cell is disclosed herein. Particularly, an expression construct comprising a PGK promoter operably linked to (i) a first nucleotide sequence encoding a chimeric antigen receptor (CAR), and (ii) a second nucleotide sequence encoding a FOXP3 polypeptide, wherein the first nucleotide sequence is located upstream of the second nucleotide sequence, is provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1629" publication-number="202617986">
    <tif-files tif-type="multi-tif">
      <tif file="114125340.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125340</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>試管內轉錄反應用組成物及試管內轉錄反應方法</chinese-title>
        <english-title>COMPOSITION FOR IN VITRO TRANSCRIPTION REACTION AND METHOD FOR IN VITRO TRANSCRIPTION REACTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N15/10</main-classification>
        <further-classification edition="200601120260202B">C12N9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片富山化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM TOYAMA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中啓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">組成物包含：選自由4-(2-羥基乙基)-1-哌嗪乙烷磺酸及2-嗎啉基乙烷磺酸所組成的群組中的至少一種緩衝劑、以及包含能夠與轉錄反應產物的末端鍵結的加帽化合物的加帽試劑，緩衝劑的濃度為5 mM～35 mM，pH為5.0～7.5的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1630" publication-number="202617558">
    <tif-files tif-type="multi-tif">
      <tif file="114125354.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送車系統及中繼裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B65G47/61</main-classification>
        <further-classification edition="200601120260126B">B65G49/07</further-classification>
        <further-classification edition="200601120260126B">B65G1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤靖久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YASUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之搬送車系統(1)具備有：上層搬送車(10A)，其在被設於上層(UL)之天花板(W1c)的軌道(4)移行；下層搬送車(10B)，其在被設於下層(DL)之天花板(W3c)的軌道(4)移行；及中繼裝置(40)，其中繼上層搬送車(10A)與下層搬送車(10B)之間的物品(90)之交接。中繼裝置(40)具有被設於上層(UL)之地板面(W2f)的上層載置部(43)、被設於下層(DL)的下層載置部(56)、及在上層載置部(43)與下層載置部(56)之間交接物品(90)的移載裝置(50)。上層搬送車(10A)係對上層載置部(43)移載物品(90)，下層搬送車(10B)係對下層載置部(56)移載物品(90)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:搬送車系統</p>
        <p type="p">4:軌道</p>
        <p type="p">4A:支柱</p>
        <p type="p">6:側邊軌道緩衝區</p>
        <p type="p">6A,56A:第一懸吊部</p>
        <p type="p">6B,56B:第一連接部</p>
        <p type="p">6C,56C:載置棚架</p>
        <p type="p">6D,56D:第二連接部</p>
        <p type="p">10:搬送車</p>
        <p type="p">10A:上層搬送車</p>
        <p type="p">10B:下層搬送車</p>
        <p type="p">20:第一本體部</p>
        <p type="p">40:中繼裝置</p>
        <p type="p">41:收容部</p>
        <p type="p">41A:側面部</p>
        <p type="p">41B:上面部</p>
        <p type="p">41Ba:開口部</p>
        <p type="p">43:上層載置部</p>
        <p type="p">45:滑動部</p>
        <p type="p">50:移載裝置</p>
        <p type="p">51:第二本體部</p>
        <p type="p">52:橫向傳送部</p>
        <p type="p">53:第二保持部</p>
        <p type="p">54:懸吊構件</p>
        <p type="p">56:下層載置部</p>
        <p type="p">80:防火門</p>
        <p type="p">90:物品</p>
        <p type="p">DL:下層</p>
        <p type="p">S,Sw:空間</p>
        <p type="p">UL:上層</p>
        <p type="p">W1:第一間隔壁</p>
        <p type="p">W1c,W3c:天花板</p>
        <p type="p">W2:第二間隔壁</p>
        <p type="p">W2f:地板面</p>
        <p type="p">W2h:第一開口部</p>
        <p type="p">W3:第三間隔壁</p>
        <p type="p">W3h:第二開口部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1631" publication-number="202618457">
    <tif-files tif-type="multi-tif">
      <tif file="114125371.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125371</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>方法、調整方法、以及曝光裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G03F7/20</main-classification>
        <further-classification edition="200601120260121B">G02B26/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤正紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川戸聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWADO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法，包含：使測量光入射至配置有第一狀態之複數個能傾斜的鏡之空間光調變器之動作；接收來自前述空間光調變器之光之動作；以及基於前述接收之光與基準位置之關係，評價前述第一狀態之動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:DMD(數位反射元件)</p>
        <p type="p">500:測量裝置</p>
        <p type="p">501:安裝部</p>
        <p type="p">502:圖案控制部</p>
        <p type="p">503:光源</p>
        <p type="p">504:拍攝部</p>
        <p type="p">505:算出部</p>
        <p type="p">506:透鏡</p>
        <p type="p">CHP:晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1632" publication-number="202617700">
    <tif-files tif-type="multi-tif">
      <tif file="114125373.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617700</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備4-胺基-呋喃之方法</chinese-title>
        <english-title>METHOD FOR PREPARING 4-AMINO-FURANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D307/68</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜耳廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布羅姆　德克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROHM, DIRK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡麥達　施利希　曼紐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEDA-SCHLICH, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫比亞克　安德列斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REMBIAK, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於製備通式(&lt;b&gt;I&lt;/b&gt;)之4-胺基-呋喃及其鹽之新穎方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a novel method for preparing 4-amino-furanes of the general formula (&lt;b&gt;I&lt;/b&gt;) and salts thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1633" publication-number="202618040">
    <tif-files tif-type="multi-tif">
      <tif file="114125391.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125391</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉積用於半導體元件之含矽膜之方法</chinese-title>
        <english-title>METHODS OF DEPOSITING SILICON-CONTAINING FILMS FOR SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">C23C16/40</main-classification>
        <further-classification edition="200601120260120B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德維勒茲　扎卡里Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEVEREAUX, ZACHARY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼斯里　湯瑪士喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNISLEY, THOMAS JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布洋　巴斯卡爾喬帝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUYAN, BHASKAR JYOTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩利　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALY, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈爾　阿奇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGHAL, AKHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了透過增強氣相沉積，例如，增強化學氣相沉積（PECVD）或增強原子層沉積（PEALD）的方式來沉積含矽膜的方法。示範性方法包括將處理系統中的基板暴露於含矽前驅物；將基板暴露於含氧試劑；以及將基板暴露於惰性氣體的電漿中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing silicon-containing films by plasma-enhanced vapor deposition, e.g., plasma-enhanced chemical vapor deposition (PECVD) or plasma-enhanced atomic layer deposition (PEALD), are disclosed. Exemplary methods include exposing a substrate in a processing system to a silicon-containing precursor; exposing the substrate to an oxygen-containing reagent; and exposing the substrate to a plasma of an inert gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">11~17:操作</p>
        <p type="p">18:決策點</p>
        <p type="p">19:操作</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1634" publication-number="202617735">
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      <tif file="114125400.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617735</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>稠合醯亞胺類化合物及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D498/04</main-classification>
        <further-classification edition="200601120260202B">C07D519/00</further-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61K31/55</further-classification>
        <further-classification edition="200601120260202B">A61K31/496</further-classification>
        <further-classification edition="200601120260202B">A61K31/5377</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉保民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱炎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭偉晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於醫藥化學領域，公開了一系列稠合醯亞胺類化合物及其應用，具體公開了式(I)所示化合物、其立體異構體及其藥學上可接受的鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="165px" width="210px" file="ed11172.JPG" alt="ed11172.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1635" publication-number="202617150">
    <tif-files tif-type="multi-tif">
      <tif file="114125403.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嚴重發熱伴血小板減少症候群病毒感染症之治療劑</chinese-title>
        <english-title>SEVERE FEVER WITH THROMBOCYTOPENIA SYNDROME VIRUS INFECTION THERAPEUTIC AGENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/4965</main-classification>
        <further-classification edition="200601120260202B">A61P31/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片富山化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM TOYAMA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由對有腎功能障礙的嚴重發熱伴血小板減少症候群病毒感染症患者投予6-氟-3-羥基-2-吡𠯤甲醯胺或其鹽，而可治療嚴重發熱伴血小板減少症候群病毒感染症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">6-Fluoro-3-hydroxy-2-pyrazinecarboxamide or a salt thereof can be administered to a patient with Severe Fever with Thrombocytopenia Syndrome virus infection who has kidney dysfunction. to treat Severe Fever with Thrombocytopenia Syndrome virus infection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1636" publication-number="202617694">
    <tif-files tif-type="multi-tif">
      <tif file="114125411.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶型</chinese-title>
        <english-title>CRYSTALLINE FORMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C07D207/14</main-classification>
        <further-classification edition="200601120260116B">A61K51/04</further-classification>
        <further-classification edition="200601120260116B">C07B59/00</further-classification>
        <further-classification edition="200601120260116B">A61P25/00</further-classification>
        <further-classification edition="200601320260116B">A61K101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英格瑞治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGRAIL THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姆哈斯卡爾　蘇尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MHASKAR, SUNIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加維　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARVEY, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐永梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YONGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李同全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TONGQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛友篇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, YOUPIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章中華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋小葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, XIAOYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供5-氯-N-((2S,3S)-1-(二氘(苯基)甲基)-2-甲基吡咯啶-3-基)-2-甲氧基-4-(三氘甲基胺基)苯甲醯胺的晶型、包含其的組合物以及製備和使用該晶型之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are crystalline forms of 5-chloro-N-((2S,3S)-1-(dideutero(phenyl)methyl)-2-methylpyrrolidin-3-yl)-2-methoxy-4-(trideuteromethylamino)benzamide, compositions comprising the same, and methods of making and using such crystalline form.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1637" publication-number="202618401">
    <tif-files tif-type="multi-tif">
      <tif file="114125420.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多層輸出耦合光柵之多層波導</chinese-title>
        <english-title>MULTILAYER WAVEGUIDE WITH MULTILAYER OUT-COUPLING GRATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B27/01</main-classification>
        <further-classification edition="200601120260126B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波利索夫　拉迪米爾尼可拉艾維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORISOV, VLADIMIR NIKOLAEVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種用於擴增實境及其他裝置之光學元件。該光學元件包括：一多層波導；一輸入耦合元件，其用於將成像光引導至該多層波導中；及一輸出耦合元件，其與該輸入耦合元件間隔開以用於將光引導出該多層波導以在一觀測者之視野中形成一虛擬影像。該輸出耦合元件係一繞射光學元件，其包括折射率不同之兩個或更多個繞射光柵層。在該輸出耦合元件中包括多個繞射光柵層導致藉由跨越一寬入射角範圍之成像光產生的虛擬影像之亮度均一性的改良。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical element for augmented reality and other devices is described. The optical element includes a multilayer waveguide, an in-coupling element for directing imaging light into the multilayer waveguide, and an out-coupling element spaced apart from the in-coupling element for directing light out of the multilayer waveguide to form a virtual image in the viewing field of an observer. The out-coupling element is a diffractive optical element that includes two or more diffractive grating layers that differ in refractive index. Inclusion of multiple diffraction grating layers in the out-coupling element leads to an improvement in the brightness uniformity of virtual images produced by imaging light spanning a wide range of incidence angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學元件</p>
        <p type="p">102:入射表面</p>
        <p type="p">104:背表面</p>
        <p type="p">105:波導</p>
        <p type="p">106:高折射率層</p>
        <p type="p">108:低折射率層</p>
        <p type="p">110:輸入耦合光柵</p>
        <p type="p">115:輸出耦合光柵</p>
        <p type="p">120:成像光</p>
        <p type="p">135:輸出光</p>
        <p type="p">145:法線</p>
        <p type="p">150、α:入射角</p>
        <p type="p">152、δ:繞射角</p>
        <p type="p">d1、d2:厚度</p>
        <p type="p">z:厚度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1638" publication-number="202617071">
    <tif-files tif-type="multi-tif">
      <tif file="114125445.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聽力檢測系統及其方法</chinese-title>
        <english-title>HEARING DETECTION SYSTEM AND METHOD FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61B5/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人雅文兒童聽語文教基金會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHILDREN'S HEARING FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪右真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬英娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, YING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聽力檢測系統，包含：第一聲音裝置；第二聲音裝置；處理裝置，通訊連接第一聲音裝置以及第二聲音裝置，該處理裝置根據一第一聲音產出指令使第一聲音裝置或第二聲音裝置發出一第一聲音；以及影像擷取裝置，通訊連接處理裝置，該影像擷取裝置擷取第一目標使用者的第一臉部影像以產生第一臉部影像資料；其中處理裝置根據第一臉部影像資料產生第一眼動方向資料；其中處理裝置接收一輸入資料其指示出第一目標使用者是否聽到第一聲音；其中處理裝置以第一眼動方向資料以及輸入資料訓練處理裝置的學習模組，藉以使學習模組可根據第二眼動方向資料產生判斷資料，該判斷資料指示出一第二目標使用者是否聽到該第一聲音裝置或該第二聲音裝置發出的一第二聲音。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hearing detection system, comprising: a first sound device; a second sound device; a processing device communicatively connected to the first sound device and the second sound device, the processing device causes the first sound device or the second sound device to generate a first sound according to a first sound generating instruction; and an image capturing device communicatively connected to the processing device, the image capturing device captures a first facial image of a first target user and generate a first facial image data; wherein the processing device generate a first eye movement direction data based on the first facial image data; wherein the processing device receives an input data that indicating whether the first target user hear the first sound; wherein the processing device uses the first eye movement direction data and the input data to train a learning module of the processing device, so that the learning module can generate a determining data based on a second eye movement direction data, wherein the determining data indicates whether a second target user hear a second sound generated by the the first sound device or the second sound device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:聽力檢測系統</p>
        <p type="p">110:處理裝置</p>
        <p type="p">112:學習模組</p>
        <p type="p">120:第一聲音裝置</p>
        <p type="p">130:第二聲音裝置</p>
        <p type="p">140:影像擷取裝置</p>
        <p type="p">810:第一側部方向</p>
        <p type="p">820:第二側部方向</p>
        <p type="p">900:第一目標使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1639" publication-number="202617851">
    <tif-files tif-type="multi-tif">
      <tif file="114125457.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>再循環包含聚酯及含纖維素纖維之組成物的方法</chinese-title>
        <english-title>METHOD OF RECYCLING COMPOSITIONS COMPRISING POLYESTER AND CELLULOSE-CONTAINING FIBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08J11/24</main-classification>
        <further-classification edition="200601120260202B">C08L1/02</further-classification>
        <further-classification edition="200601120260202B">C08L67/02</further-classification>
        <further-classification edition="200601120260202B">C08K7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商ＲＥＪＵ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施瓦茲　雷蒙德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, RAIMUND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈克爾　馬盧斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HACKEL, MARIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德曼　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDERMANN, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝頓　法布里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BETTON, FABRICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種再循環聚酯及含纖維素纖維的方法，該方法包含機械處理包含聚酯（諸如PET）、含纖維素纖維（諸如聚酯棉）、及乙二醇之組成物，解聚合該組成物中的該聚酯，且可選地分離該經解聚合聚酯產物及含纖維素纖維並再循環其等，以及提供包含可藉由該方法獲得的再循環組成物之組成物及物品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a method of recycling polyester and cellulose-containing fibers, the method comprising mechanically treating a composition comprising polyester, such as PET, cellulose-containing fibers, such as polycotton, and ethylene glycol, depolymerizing the polyester in the composition and optionally separating the depolymerized polyester product and cellulose-containing fibers and recycling them, as well as providing compositions and articles comprising recycled compositions obtainable by said method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:起始進料</p>
        <p type="p">2:預處理清潔單元</p>
        <p type="p">3:分離單元</p>
        <p type="p">4:機械處理單元</p>
        <p type="p">5:解聚合反應器</p>
        <p type="p">6:分離單元</p>
        <p type="p">7:分離柱</p>
        <p type="p">8:棉</p>
        <p type="p">9:解聚合物</p>
        <p type="p">10:解聚合催化劑</p>
        <p type="p">11:乙二醇</p>
        <p type="p">12:新鮮的乙二醇</p>
        <p type="p">13:再循環線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1640" publication-number="202617730">
    <tif-files tif-type="multi-tif">
      <tif file="114125460.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偶聯物之連接子及其使用方法</chinese-title>
        <english-title>LINKERS FOR CONJUGATES AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D491/22</main-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞虹製藥（美國）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIERIS PHARMACEUTICALS (USA), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衣　作安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, ZUOAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　峪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供可用作偶聯物之連接子的化合物、包含此等化合物之偶聯物、其醫藥組合物及使用該等化合物、偶聯物及醫藥組合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds useful as linkers for conjugates, conjugates comprising these compounds, pharmaceutical compositions thereof, and method of using the compounds, conjugates and pharmaceutical compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1641" publication-number="202617762">
    <tif-files tif-type="multi-tif">
      <tif file="114125466.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特異性結合潛伏肌生長抑制素的抗原結合分子及其醫藥用途</chinese-title>
        <english-title>ANTIGEN BINDING MOLECULES THAT SPECIFICALLY BIND TO LATENT-MYOSTATIN AND THEIR MEDICAL USES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/18</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P21/00</further-classification>
        <further-classification edition="200601120260202B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁惠惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, HUIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本披露涉及特異性結合潛伏肌生長抑制素的抗原結合分子及其醫藥用途。具體地，本披露涉及特異性結合潛伏肌生長抑制素的抗原結合分子在製備預防或治療肌肉萎縮、肌營養不良症、肥胖和惡液質的藥物中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to antigen binding molecules that specifically bind to latent-myostatin and their medical uses. Specifically, the present disclosure relates to the use of antigen binding molecules that specifically bind to latent myostatin in the preparation of medicaments for preventing or treating muscle atrophy, muscular dystrophy, obesity and cachexia.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1642" publication-number="202618063">
    <tif-files tif-type="multi-tif">
      <tif file="114125468.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅構件、層積體、覆銅層壓板、以及配線基板</chinese-title>
        <english-title>COPPER MEMBER, STACKED BODY, COPPER-COVERED STACKED PLATE AND WIRING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C23F1/00</main-classification>
        <further-classification edition="200601120260126B">B32B15/08</further-classification>
        <further-classification edition="200601120260126B">H05K1/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二嶋悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若林慶彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKABAYASHI, YOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供表面具有凹凸形狀的銅構件，其中上述凹凸形狀的凸部具有略無懸挑形狀的銅構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a copper member including a convexoconcave shape on a surface, wherein a convex portion of the convexoconcave shape has a shape with approximately no eave.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:銅構件</p>
        <p type="p">1a:凹凸形狀</p>
        <p type="p">1b:凸部</p>
        <p type="p">S1:表面</p>
        <p type="p">S2:表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1643" publication-number="202617731">
    <tif-files tif-type="multi-tif">
      <tif file="114125479.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合物及其用途</chinese-title>
        <english-title>CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D491/22</main-classification>
        <further-classification edition="200601120260202B">C07K16/30</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商解方治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLVE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭努蒂　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANNUTTI, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特金斯　傑夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATKINS, JEFF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑森　凱蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JESSEN, KATTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POW, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供抗體藥物結合物，其中該抗體為5T4抗體。此等化合物可用作抗癌劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are antibody drug conjugates, wherein the antibody is a 5T4 antibody. Such compounds can be useful as anti-cancer agents.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1644" publication-number="202618200">
    <tif-files tif-type="multi-tif">
      <tif file="114125487.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱管熱膨脹改良</chinese-title>
        <english-title>HEAT PIPE THERMAL EXPANSION MODIFICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">F28D15/02</main-classification>
        <further-classification edition="200601120260115B">F16L51/00</further-classification>
        <further-classification edition="200601120260115B">G21C15/257</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西屋電器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊克　約翰　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOJEK, JOHN, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹佩西亞　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMPRESCIA, TYLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布倫特　勞力　Ａ　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLUNT, RORY A.F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內斯特　克里斯托佛　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NESTOR, CHRISTOPHER M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種熱管，其包含：一長形管道，其界定一縱向軸線；一環形芯，其經定位於該長形管道中；一芯塞，其經定位於該長形管道中且經附接至該環形芯之一端，其中該芯塞包含界定一開口之一環形本體；一熱膨脹改良裝置，其包含：一環形塞，其經附接至該長形管道之一端；及一長形桿，其自該環形塞延伸且通過該芯塞中之該開口，其中該長形桿界定朝向該長形管道相對於該縱向軸線徑向延伸之一突起，且其中該芯塞經定位於該突起與該環形塞中間；及一端帽，其經附接至該環形塞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat pipe includes: an elongate tube defining a longitudinal axis; an annular wick positioned in the elongate tube; a wick plug positioned in the elongate tube and attached to an end of the annular wick, where the wick plug includes an annular body defining an opening; a thermal expansion modification device including: an annular plug attached to an end of the elongate tube; and an elongate stem extending from the annular plug and through the opening in the wick plug, where the elongate stem defines a protrusion extending radially relative to the longitudinal axis toward the elongate tube, and where the wick plug is positioned intermediate the protrusion and the annular plug; and an end cap attached to the annular plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:熱管</p>
        <p type="p">210:長形管道</p>
        <p type="p">212:開口</p>
        <p type="p">220:環形芯</p>
        <p type="p">222:內開口</p>
        <p type="p">230:芯塞</p>
        <p type="p">232:環形本體</p>
        <p type="p">234:開口</p>
        <p type="p">236:環形突起</p>
        <p type="p">240:冷凝器端帽</p>
        <p type="p">250:熱膨脹改良裝置</p>
        <p type="p">252:環形塞</p>
        <p type="p">253:凸緣部分</p>
        <p type="p">254:內通路</p>
        <p type="p">256:長形桿</p>
        <p type="p">257:內通路</p>
        <p type="p">258:外表面</p>
        <p type="p">259:突起</p>
        <p type="p">LA:縱向軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1645" publication-number="202618201">
    <tif-files tif-type="multi-tif">
      <tif file="114125494.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將芯塞附接至芯的方法及裝置</chinese-title>
        <english-title>METHODS AND DEVICES FOR ATTACHING A WICK PLUG TO A WICK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">F28D15/02</main-classification>
        <further-classification edition="200601120260116B">B23P11/02</further-classification>
        <further-classification edition="200601120260116B">F16B4/00</further-classification>
        <further-classification edition="200601120260116B">B25B11/00</further-classification>
        <further-classification edition="200601120260116B">G21C15/257</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西屋電器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內斯特　克里斯托佛　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NESTOR, CHRISTOPHER M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹佩西亞　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMPRESCIA, TYLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊克　約翰　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOJEK, JOHN, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴佩斯蒂　麥可　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAPRESTI, MICHAEL A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種將一芯塞附接至一環形芯之方法，其中該環形芯界定一外徑。該方法包含：將該芯塞至少部分定位於該環形芯內；將一夾具放置於該環形芯之該外徑之上；及將該夾具、該環形芯及該芯塞加熱至足以熱膨脹該芯塞及該環形芯以由該夾具將一壓縮力施加至該芯塞及該環形芯上以將該芯塞及該環形芯壓縮在一起之一溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of attaching a wick plug to an annular wick with the annular wick defining an outside diameter. The method includes positioning the wick plug at least partially within the annular wick; placing a clamp over the outside diameter of the annular wick; and heating the clamp, the annular wick, and the wick plug to a temperature sufficient to thermally expand the wick plug and the annular wick to exert a compressive force onto the wick plug and the annular wick by the clamp to compress the wick plug and the annular wick together.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">1002:步驟</p>
        <p type="p">1004:步驟</p>
        <p type="p">1006:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1646" publication-number="202617774">
    <tif-files tif-type="multi-tif">
      <tif file="114125496.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗KIT抗體及其醫藥用途</chinese-title>
        <english-title>ANTI-KIT ANTIBODY AND PHARMACEUTICAL USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉心義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓天婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, TIANTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及抗KIT抗體及其醫藥用途。具體地，本揭露涉及抗KIT抗體及其在製備預防或治療炎症性和自身免疫性等疾病的藥物中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to anti-KIT antibody and pharmaceutical use thereof. Specifically, this disclosure relates to anti KIT antibodies and their use in the preparation of drugs for the prevention or treatment of inflammatory and autoimmune diseases.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1647" publication-number="202617565">
    <tif-files tif-type="multi-tif">
      <tif file="114125503.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125503</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板收納容器以及過濾器部</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B65G49/07</main-classification>
        <further-classification edition="200601120260126B">H01L21/673</further-classification>
        <further-classification edition="202101120260126B">F24F8/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商未來兒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRAIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溜渕晴也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMARIBUCHI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及基板收納容器以及過濾器部。基板收納容器(1)具有：容器主體；蓋體；密封部件；過濾器部(80)，具有能夠將基板收納空間與容器主體的外部的空間連通的通氣路(801)、配置於通氣路(801)的過濾器(85)以及形成通氣路(801)的殼體(81、82、83)，配置於容器主體，氣體能夠經過過濾器(85)在容器主體的外部的空間與基板收納空間之間通過，容器主體(2)具有供殼體(81、82、83)插入的被插入凹部以及固定殼體(81、82、83)的固定部(2401)，殼體(81、82、83)具有固定於固定部(2401)的被固定部(8343)，具有不能使殼體(81、82、83)旋轉而與容器主體(2)螺合的非圓筒形狀的外部輪廓形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:壁部</p>
        <p type="p">24:下壁</p>
        <p type="p">80:供氣用過濾器部</p>
        <p type="p">83:噴嘴部(殼體)</p>
        <p type="p">88:密接墊</p>
        <p type="p">2401:過濾器部收納部(固定部)</p>
        <p type="p">2402:貫通孔</p>
        <p type="p">8343:柱狀凸部(被固定部)</p>
        <p type="p">D21:上方向</p>
        <p type="p">D22:下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1648" publication-number="202617504">
    <tif-files tif-type="multi-tif">
      <tif file="114125536.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於車輛的車把組合件及其組裝方法</chinese-title>
        <english-title>STEM ASSEMBLY FOR A VEHICLE AND METHOD OF ASSEMBLING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B62K21/12</main-classification>
        <further-classification edition="200601120260123B">B62K21/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印度商ＴＶＳ電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TVS MOTOR COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇契奇　茲沃尼米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUCIC, ZVONIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫馬亞　庫納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMAYA, KUNAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博斯拉　尼萊許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOTHRA, NILESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種用於車輛(102)的車把組合件(100)。車把組合件包含上模塊和下模塊。下模塊(106)適於可樞轉地連接到上模塊(104)。下模塊(106)包含一個或多個第一開口(114)及一個或多個第二開口(116)。一個或多個第一開口(114)及一個或多個第二開口(116)適於接收一條或多條纜線並經由頭管(112)佈線至一或多個車輛部件。車把組合件(100)減少了車輛(102)中的整體零件數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Present disclosure relates to a stem assembly (100) for a vehicle (102).The stem assembly (100) comprises of an upper block (104) and a lower block (106).The lower block (106) is adapted to be pivotally connected to the upper block (104).The lower block (106) comprises one or more first openings (114) and one or more second openings (116).The one or more first openings (114) and the one or more second openings (116) are adapted to receive and route one or more cables through a headtube (112) to one or more vehicle components. The stem assembly (100) reduces overall part count in the vehicle (102).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車把組合件</p>
        <p type="p">104:上模塊</p>
        <p type="p">104a:第一部分</p>
        <p type="p">104b:第二部分</p>
        <p type="p">106:下模塊</p>
        <p type="p">108:下整流罩</p>
        <p type="p">108a:中空主體部分</p>
        <p type="p">108b:突出部分</p>
        <p type="p">118:配件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1649" publication-number="202619149">
    <tif-files tif-type="multi-tif">
      <tif file="114125548.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池組以及包含其之載具</chinese-title>
        <english-title>BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260126B">H01M50/367</main-classification>
        <further-classification edition="202101120260126B">H01M50/342</further-classification>
        <further-classification edition="202101120260126B">H01M50/383</further-classification>
        <further-classification edition="202101120260126B">H01M50/375</further-classification>
        <further-classification edition="202101120260126B">H01M50/317</further-classification>
        <further-classification edition="202101120260126B">H01M50/249</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承律</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SEUNG-RYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的電池組可包括：複數個電池陣列結構，包含複數個單電池；包裝箱，包含設置在複數個電池陣列結構一側的底部構件，並具有形成在底部構件上的第一儲存空間，其中複數個電池陣列結構被儲存，及形成在底部構件上的第二儲存空間，其中電池陣列結構未被儲存；以及複數個排氣空間，形成在底部構件上以便與複數個電池陣列結構一對一對應，其中密接觸區域設置在底部構件上排氣空間的周邊，使得電池陣列結構與其密接觸，並且其中複數個排氣空間在第一儲存空間中彼此隔離，並與第二儲存空間隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery pack according to the present disclosure may include: a plurality of cell array structures including a plurality of battery cells; a pack case including a bottom member disposed on one side of the plurality of cell array structures, and having a first storage space where the plurality of cell array structures are stored and a second storage space where the cell array structure is not stored, which are formed on the bottom member; and a plurality of venting spaces formed on the bottom member so as to correspond one-to-one with the plurality of cell array structures, wherein a close-contact area is provided on a periphery of the venting space on the bottom member such that the cell array structures is in close contact therewith, and wherein the plurality of venting spaces are isolated from each other in the first storage space, and are isolated from the second storage space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池組</p>
        <p type="p">100:電池陣列結構</p>
        <p type="p">110:單電池</p>
        <p type="p">200:電氣元件</p>
        <p type="p">210:電氣單元</p>
        <p type="p">220:電池模組控制器</p>
        <p type="p">230:匯流排</p>
        <p type="p">300:包裝箱</p>
        <p type="p">400:排氣裝置</p>
        <p type="p">S:儲存空間</p>
        <p type="p">S1:第一儲存空間</p>
        <p type="p">S2:第二儲存空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1650" publication-number="202619014">
    <tif-files tif-type="multi-tif">
      <tif file="114125566.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板支撐件</chinese-title>
        <english-title>SUBSTRATE SUPPORT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/683</main-classification>
        <further-classification edition="200601120260127B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯　斯文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOSS, SVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種經構形以支撐一基板之基板支撐件。該基板支撐件包含複數個經同心配置之夾持區域，其中該複數個經同心配置之夾持區域中之各者中界定有至少一個抽取孔口。該至少一個抽取孔口經構形以自該對應夾持區域抽取流體。N+1夾持區域中之抽取孔口之一數目大於N夾持區域中之抽取孔口之一數目，N為大於或等於1之一整數。該至少一個抽取孔口與一對應抽取通道直接流體連通。與該N+1夾持區域中之一抽取孔口直接流體連通的該對應抽取通道與對應於該N夾持區域中之一抽取孔口且與其直接流體連通的一抽取通道直接流體連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate support configured to support a substrate. The substrate support comprising a plurality of concentrically arranged clamping regions, wherein at least one extraction orifice is defined in each of the plurality of concentrically arranged clamping regions. The at least one extraction orifice is configured to extract fluid from the corresponding clamping region. A number of extraction orifices in the N+1 clamping region is greater than a number of extraction orifices in the N clamping region, N being an integer greater than or equal to 1. The at least one extraction orifice is in direct fluid communication with a corresponding extraction channel. The corresponding extraction channel in direct fluid communication with an extraction orifice in the N+1 clamping region is in direct fluid communication with an extraction channel corresponding to, and in direct fluid communication with, an extraction orifice in the N clamping region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板支撐件</p>
        <p type="p">12:抽取孔口</p>
        <p type="p">13:抽取通道</p>
        <p type="p">14:供應介面</p>
        <p type="p">141:抽取通道</p>
        <p type="p">A-A:線</p>
        <p type="p">C:中心</p>
        <p type="p">R:區域</p>
        <p type="p">Z1:夾持區域</p>
        <p type="p">Z2:夾持區域</p>
        <p type="p">Z3:夾持區域</p>
        <p type="p">Z4:夾持區域</p>
        <p type="p">Z5:夾持區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1651" publication-number="202617775">
    <tif-files tif-type="multi-tif">
      <tif file="114125607.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125607</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＣＥＡＣＡＭ５抗體－藥物結合物以及其製備方法及用途</chinese-title>
        <english-title>ANTI-CEACAM5 ANTIBODY-DRUG CONJUGATE AND METHOD FOR PREPARATION AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">C07D491/22</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅順濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, SHUNTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何亞軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, YAJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李莉容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LIRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范玥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張毅濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瑞紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, RUIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙沙沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, SHASHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, HU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋宏梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HONGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚淼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, XIANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛均友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, JUNYOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於抗體-藥物結合物以及其製備方法及用途，且具體而言係關於用於治療CEACAM5陽性癌症之抗體-藥物結合物，包括抗CEACAM5抗體及與該抗體結合之藥物-連接體分子。在一些實施例中，該抗體為人類化的。在一些實施例中，該抗體對CEACAM5陽性細胞具有優良之結合活性，且可有效地將藥物遞送至CEACAM5陽性細胞。在一些實施例中，該藥物包括DNA拓撲異構酶抑制劑。本申請案之抗體-藥物結合物具有更佳之藥物-抗體結合比率，且對某些癌症具有良好的靶向殺滅效應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to an antibody-drug conjugate and a method for preparation and use thereof, and specifically relates to an antibody-drug conjugate for treating CEACAM5-positive cancer, including an anti-CEACAM5 antibody, and drug-linker molecules conjugated to the antibody. In some embodiments, the antibody is humanized. In some embodiments, the antibody has excellent binding activity to CEACAM5-positive cells, and can efficiently deliver drugs to CEACAM5-positive cells. In some embodiments, the drug includes a DNA topoisomerase inhibitor. The antibody-drug conjugate of the present application has a better drug-antibody conjugation ratio, and has a good targeted killing effect on certain cancers.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1652" publication-number="202618720">
    <tif-files tif-type="multi-tif">
      <tif file="114125639.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125639</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊系統、獨居裝置及用於獨居裝置與接收裝置無線通訊的方法</chinese-title>
        <english-title>WIRELESS COMMUNICATION SYSTEM, STANDALONE DEVICE AND METHOD FOR STANDALONE DEVICE WIRELESSLY COMMUNICATING WITH RECIPIENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G08B21/04</main-classification>
        <further-classification edition="200601120251001B">G08B25/10</further-classification>
        <further-classification edition="201801120251001B">G16H40/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓國權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON, JEREMY KWOK-KUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　榮灼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WINGCHERK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一方面提供了一種用於獨居裝置與接收裝置無線通訊的方法。方法包括藉由管理者設置第一預設時間於獨居裝置的喚醒鬧鐘。方法同樣包括於第一預設時間觸發獨居裝置的喚醒鬧鐘。喚醒鬧鐘致能獨居裝置的第一按鈕的指示燈閃爍。方法同樣包括若使用者在第二預設時間之內沒有按下第一按鈕來取消獨居裝置的喚醒鬧鐘，則藉由獨居裝置通知接收裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an aspect of the disclosure, a method for a standalone device wirelessly communicating with a recipient device is provided. The method comprises setting, by an administrator, a wake-up alarm of the standalone device with a first preset time, a wellness check notification from the recipient device. The method also comprises triggering the wake-up alarm of the standalone device by the first preset time, wherein the wake-up alarm enables to flash an indication light of a first button of the standalone device. The method also comprises informing, by the standalone device, the recipient device if the wake-up alarm of the standalone device is not canceled by pressing the first button by a user within a second preset time. All communications between the standalone device user and recipient device user do not require any monitoring service.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">610~S640:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1653" publication-number="202619367">
    <tif-files tif-type="multi-tif">
      <tif file="114125657.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳機</chinese-title>
        <english-title>EARPHONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250731B">H04R1/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張郭懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種耳機，該耳機包括耳帽裝配結構和耳帽，耳帽裝配結構包括外殼、導音管和彈性支架，導音管包括主體部和主體部下端朝外側延伸形成的外擴部，外擴部位於外殼內並與外殼的內壁抵接，主體部伸出外殼，彈性支架設置於導音管內並且包括彈扣，彈扣伸出導音管，耳帽上設有卡合槽以與彈扣扣合連接，耳帽的底部設置於外殼和導音管之間，耳帽分別與外殼和外擴部抵接。由此，耳機通過將扣合連接的耳帽與外殼和導音管抵接，使得耳帽可以簡單地完成裝配並且不易脫出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an earphone, which comprises an earcap assembly structure and an earcap. The earcap assembly structure includes a housing, a sound guiding tube, and an elastic support. The sound guiding tube comprises a main body portion and an outwardly expanded portion formed by an outward extension from a lower end of the main body portion. The outwardly expanded portion is positioned inside the housing and abuts against an inner wall of the housing. The main body portion extends outwardly from the housing. The elastic support is disposed within the sound guiding tube and includes a snap hook, which extends outward from the sound guiding tube. The earcap is provided with a locking groove configured to engage with the snap hook. A bottom portion of the earcap is positioned between the housing and the sound guiding tube, and the earcap abuts both the housing and the outwardly expanded portion. Through the engagement between the snap hook and the locking groove, and the abutment of the earcap with both the housing and the outwardly expanded portion, the earcap can be assembled easily and securely, thereby reducing the likelihood of detachment during use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:導音管</p>
        <p type="p">12:彈性支架</p>
        <p type="p">121:彈扣</p>
        <p type="p">13:外殼</p>
        <p type="p">131:開口</p>
        <p type="p">21:耳塞部</p>
        <p type="p">22:連接部</p>
        <p type="p">221:卡合槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1654" publication-number="202619366">
    <tif-files tif-type="multi-tif">
      <tif file="114125658.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳機</chinese-title>
        <english-title>EARPHONES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250711B">H04R1/04</main-classification>
        <further-classification edition="200601120250711B">H04R5/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張郭懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種耳機，該耳機包括耳帽裝配結構和耳帽，耳帽裝配結構包括導音管和彈性支架，彈性支架設置於導音管內並且包括彈扣，彈扣伸出導音管，耳帽包括耳塞部和連接部，連接部設置為管狀並且被配置為套設於導音管上，耳塞部包覆於連接部外側，耳塞部的硬度小於連接部，連接部的內側壁上設有卡合槽以與彈扣扣合連接。由此，耳機通過彈性支架上的彈扣和連接部上的卡合槽即可完成扣合，使得耳帽可以簡單地完成裝配並且不易脫出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an earphone comprising an ear cap assembly structure and an ear cap. The ear cap assembly structure includes a sound guide tube and an elastic support. The elastic support is disposed within the sound guide tube and includes a resilient locking member that protrudes from the sound guide tube. The ear cap includes an earplug portion and a connecting portion. The connecting portion is tubular and configured to be sleeved onto the sound guide tube, while the earplug portion is formed on the outer surface of the connecting portion. The earplug portion has a lower hardness than the connecting portion. A snap-fit groove is provided on the inner wall of the connecting portion for engagement with the resilient locking member. This design allows the ear cap to be easily assembled onto the earphone via the engagement between the snap-fit groove and the resilient locking member, ensuring secure attachment and preventing accidental detachment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:導音管</p>
        <p type="p">12:彈性支架</p>
        <p type="p">121:彈扣</p>
        <p type="p">13:外殼</p>
        <p type="p">21:耳塞部</p>
        <p type="p">22:連接部</p>
        <p type="p">221:卡合槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1655" publication-number="202619473">
    <tif-files tif-type="multi-tif">
      <tif file="114125669.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125669</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有單石３Ｄ堆疊結構的靜態隨機存取記憶體裝置及包括此靜態隨機存取記憶體裝置的電子設備</chinese-title>
        <english-title>STATIC RANDOM-ACCESS MEMORY DEVICE HAVING MONOLITHIC 3D STACK STRUCTURE AND ELECTRONIC APPARATUS INCLUDING THE STATIC RANDOM-ACCESS MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260119B">H10B10/00</main-classification>
        <further-classification edition="202501120260119B">H10D84/85</further-classification>
        <further-classification edition="202501120260119B">H10D64/27</further-classification>
        <further-classification edition="202501120260119B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>首爾大學校產學協力團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOUL NATIONAL UNIVERSITY R&amp;DB FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尙元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金文鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MUNHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金載俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOONSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, JUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳嬉堤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, HUIJE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOONYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈在旴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIM, JAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張炯碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, HYEONGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　魯興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, LUHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所提供者為一種具有一單石三維堆疊結構之靜態隨機存取記憶體(SRAM)裝置及一種包括該SRAM裝置之電子設備。該SRAM裝置包括：一第一層，其包括第一及第二電晶體；一第二層，其堆疊在該第一層上且包括第三及第四電晶體；以及一第三層，其堆疊在該第二層上且包括第五及第六電晶體。該第一至第六電晶體中之每一者包括內含一種二維半導體材料之一通道層。該第五及第六電晶體中之至少一者之一閘極被配置為與該第一至第四電晶體中之至少一者之一閘極相交。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a static random-access memory (SRAM) device having a monolithic three-dimensional stack structure and an electronic apparatus including the SRAM device. The SRAM device includes a first tier including first and second transistors, a second tier stacked on the first tier and including third and fourth transistors, and a third tier stacked on the second tier and including fifth and sixth transistors. Each of the first to sixth transistors includes a channel layer including a two-dimensional semiconductor material. A gate of at least one of the fifth and sixth transistors is arranged to intersect a gate of at least one of the first to fourth transistors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一隔離層</p>
        <p type="p">102:第二隔離層</p>
        <p type="p">111:第一源極</p>
        <p type="p">112:第二源極</p>
        <p type="p">131:第一閘極</p>
        <p type="p">131':第一閘極接點</p>
        <p type="p">132:第二閘極</p>
        <p type="p">132':第二閘極接點</p>
        <p type="p">140:第一通道層</p>
        <p type="p">161:第一金屬線</p>
        <p type="p">162:第二金屬線</p>
        <p type="p">170:供應電壓線</p>
        <p type="p">201:第三隔離層</p>
        <p type="p">202:第四隔離層</p>
        <p type="p">221:第一汲極</p>
        <p type="p">222:第二汲極</p>
        <p type="p">231:第三閘極</p>
        <p type="p">231':第三閘極接點</p>
        <p type="p">232:第四閘極</p>
        <p type="p">232':第四閘極接點</p>
        <p type="p">240:第二通道層</p>
        <p type="p">261:第三金屬線</p>
        <p type="p">262:第四金屬線</p>
        <p type="p">270:接地電壓線</p>
        <p type="p">291:第三連接層</p>
        <p type="p">292:元件</p>
        <p type="p">301:第五隔離層</p>
        <p type="p">302:第六隔離層</p>
        <p type="p">331:第五閘極</p>
        <p type="p">332:第六閘極</p>
        <p type="p">341:第三通道層</p>
        <p type="p">342:第四通道層</p>
        <p type="p">x,y,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1656" publication-number="202618202">
    <tif-files tif-type="multi-tif">
      <tif file="114125680.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125680</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成芯的方法及裝置</chinese-title>
        <english-title>METHODS AND DEVICES FOR FORMING A WICK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">F28D15/02</main-classification>
        <further-classification edition="200601120260115B">B21D53/06</further-classification>
        <further-classification edition="200601120260115B">B21D11/10</further-classification>
        <further-classification edition="200601120260115B">B21D37/16</further-classification>
        <further-classification edition="200601120260115B">B21D37/12</further-classification>
        <further-classification edition="200601120260115B">G21C15/257</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西屋電器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內斯特　克里斯托佛　Ｍ　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NESTOR, CHRISTOPHER M., III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹佩西亞　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMPRESCIA, TYLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊克　約翰　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOJEK, JOHN, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴佩斯蒂　麥可　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAPRESTI, MICHAEL A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種形成用於一熱管之一環形芯之方法。該方法包含：圍繞一長形桿形成芯材料之複數個層；將該長形桿及芯材料之該等層放置至一環形模總成之一中心模開口中；將該桿、芯材料之該等層及該環形模總成放置至一夾具之一中心夾具開口中，其中該夾具經構形以使該桿、芯材料之該等層及該環形模總成固持在一起；及將該桿、芯材料之該等層、該環形模總成及該夾具加熱至足以使該桿朝向該環形模總成之該中心模開口熱膨脹以將芯材料之該等層壓縮於該桿與該環形模總成之該中心模開口之間之一溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming an annular wick for a heat pipe is disclosed. The method includes forming a plurality of layers of wick material around an elongate rod; placing the elongate rod and the layers of wick material into a central die opening of an annular die assembly; placing the rod, the layers of wick material, and the annular die assembly into a central clamp opening of a clamp, where the clamp is configured to hold the rod, the layers of wick material, and the annular die assembly together; and heating the rod, the layers of wick material, the annular die assembly, and the clamp to a temperature sufficient to thermally expand the rod toward the central die opening of the annular die assembly to compress the layers of wick material between the rod and the central die opening of the annular die assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2000:方法</p>
        <p type="p">2002:步驟</p>
        <p type="p">2004:步驟</p>
        <p type="p">2006:步驟</p>
        <p type="p">2008:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1657" publication-number="202617717">
    <tif-files tif-type="multi-tif">
      <tif file="114125710.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＰＤＥ３／４雙重抑制劑的晶型物、藥物組合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/04</main-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商西藏海思科製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIZANG HAISCO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳清平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QINGPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竇贏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOU, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種式（I）化合物的晶型、其製備方法，以及它們在製備相關藥物中的應用。&lt;br/&gt;&lt;img align="absmiddle" height="179px" width="297px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1658" publication-number="202617709">
    <tif-files tif-type="multi-tif">
      <tif file="114125723.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＶＡＶ１的靶向降解</chinese-title>
        <english-title>TARGETED DEGRADATION OF VAV1</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D403/10</main-classification>
        <further-classification edition="200601120260202B">C07D401/10</further-classification>
        <further-classification edition="200601120260202B">C07D413/10</further-classification>
        <further-classification edition="200601120260202B">C07D491/107</further-classification>
        <further-classification edition="200601120260202B">C07D413/14</further-classification>
        <further-classification edition="200601120260202B">C07D401/14</further-classification>
        <further-classification edition="200601120260202B">A61K31/513</further-classification>
        <further-classification edition="200601120260202B">A61K31/527</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商蒙特羅莎治療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTE ROSA THERAPEUTICS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡布雷　澤維爾　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CABRE, XAVIER LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法斯欽　伯恩哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FASCHING, BERNHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利亞多　愛麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIARDO, ELISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克阿利斯特　蘿拉　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCALLISTER, LAURA ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧萊因科瓦斯　弗拉基米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLEINIKOVAS, VLADIMIRAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里曾　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RITZEN, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之特徵在於降解原癌基因VAV 1蛋白（VAV1）的化學實體（例如，化合物或其藥學上可接受的鹽）。該等化學實體可用於治療患有可以藉由降低VAV1水平來治療的障礙或疾病（如癌症、炎性或自體免疫疾病）的受試者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure features chemical entities (e.g., a compound or a pharmaceutically acceptable salt thereof) that degrades Proto-oncogene VAV 1 protein (VAV1). The chemical entities are useful for treating subjects having a disorder or disease that can be treated by reducing the level of VAV1, such as cancer, inflammatory or autoimmune disorders.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1659" publication-number="202617706">
    <tif-files tif-type="multi-tif">
      <tif file="114125724.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617706</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＶＡＶ１的靶向降解</chinese-title>
        <english-title>TARGETED DEGRADATION OF VAV1</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D401/14</main-classification>
        <further-classification edition="200601120260202B">C07D405/14</further-classification>
        <further-classification edition="200601120260202B">C07D413/14</further-classification>
        <further-classification edition="200601120260202B">C07D401/10</further-classification>
        <further-classification edition="200601120260202B">C07D471/10</further-classification>
        <further-classification edition="200601120260202B">C07D487/10</further-classification>
        <further-classification edition="200601120260202B">C07D471/04</further-classification>
        <further-classification edition="200601120260202B">C07D417/14</further-classification>
        <further-classification edition="200601120260202B">C07D487/04</further-classification>
        <further-classification edition="200601120260202B">A61K31/4545</further-classification>
        <further-classification edition="200601120260202B">A61K31/506</further-classification>
        <further-classification edition="200601120260202B">A61K31/496</further-classification>
        <further-classification edition="200601120260202B">A61K31/501</further-classification>
        <further-classification edition="200601120260202B">A61K31/519</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商蒙特羅莎治療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTE ROSA THERAPEUTICS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡布雷　澤維爾　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CABRE, XAVIER LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法斯欽　伯恩哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FASCHING, BERNHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利亞多　愛麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIARDO, ELISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克阿利斯特　蘿拉　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCALLISTER, LAURA ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧萊因科瓦斯　弗拉基米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLEINIKOVAS, VLADIMIRAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里曾　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RITZEN, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之特徵在於降解原癌基因VAV 1蛋白（VAV1）的化學實體（例如，化合物或其藥學上可接受的鹽）。該等化學實體可用於治療患有可以藉由降低VAV1水平來治療的障礙或疾病（如癌症、炎性或自體免疫疾病）的受試者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure features chemical entities (e.g., a compound or a pharmaceutically acceptable salt thereof) that degrades Proto-oncogene VAV 1 protein (VAV1). The chemical entities are useful for treating subjects having a disorder or disease that can be treated by reducing the level of VAV1, such as cancer, inflammatory or autoimmune disorders.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1660" publication-number="202617146">
    <tif-files tif-type="multi-tif">
      <tif file="114125725.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125725</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含靶向ＶＡＶ１的降解劑的組合</chinese-title>
        <english-title>COMBINATIONS COMPRISING VAV1-TARGETING DEGRADERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/444</main-classification>
        <further-classification edition="200601120260202B">A61K31/513</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商蒙特羅莎治療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTE ROSA THERAPEUTICS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡布雷　澤維爾　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CABRE, XAVIER LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科菲　羅里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COFFEY, RORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法斯欽　伯恩哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FASCHING, BERNHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利亞多　愛麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIARDO, ELISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克阿利斯特　蘿拉　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCALLISTER, LAURA ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧萊因科瓦斯　弗拉基米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLEINIKOVAS, VLADIMIRAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩盧索　瑪麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PELUSO, MARISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里曾　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RITZEN, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的特徵係降解人原癌基因VAV 1蛋白（VAV1）的化學實體（例如，化合物或其藥學上可接受的鹽），其與治療劑組合。本揭露的特徵還在於該等組合作為藥物之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure features chemical entities (e.g., a compound or a pharmaceutically acceptable salt thereof) that degrade human Proto-oncogene VAV 1 protein (VAV1), in combination with a therapeutic agent. This disclosure also features the use of these combinations as a medicament.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1661" publication-number="202618563">
    <tif-files tif-type="multi-tif">
      <tif file="114125740.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算儲存裝置中的保留記憶體空間</chinese-title>
        <english-title>RESERVED MEMORY SPACE IN COMPUTATIONAL STORAGE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260122B">G06F12/0866</main-classification>
        <further-classification edition="200601120260122B">G06F13/14</further-classification>
        <further-classification edition="200601120260122B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛思開海力士存儲器產品解決方案公司(亦以思得名稱營業)</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX NAND PRODUCT SOLUTIONS CORP.(DBA SOLIDIGM)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約翰　魯德力克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHN, RUDELIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂文　威廉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEVEN, WILLIAMS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文森　拉佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINCENT, LAZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞繆爾　布拉德肖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMUEL, BRADSHAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係針對一記憶體系統中之記憶體空間管理，該記憶體系統包括一記憶體控制器、與該記憶體控制器相異之一資料處理器，及一非揮發性記憶體(例如，NAND快閃記憶體)。該非揮發性記憶體包括複數個記憶體區塊。該資料處理器執行一第一程式以處理第一資料。根據該第一資料已由該第一程式處理之一判斷，該第一資料位於該複數個記憶體區塊之一第一子集中。該複數個記憶體區塊之該第一子集在該非揮發性記憶體中具有固定實體位置，且保留供該第一程式使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application is directed to memory space management in a memory system that includes a memory controller, a data processor distinct from the memory controller, and a non-volatile memory (e.g., NAND flash memory). The non-volatile memory includes a plurality of memory blocks. The data processor executes a first program to process first data. In accordance with a determination that the first data is processed by the first program, the first data is in a first subset of the plurality of memory blocks. The first subset of the plurality of memory blocks has fixed physical locations in the non-volatile memory and is reserved for the first program.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:記憶體系統</p>
        <p type="p">202:記憶體控制器</p>
        <p type="p">220:主機裝置</p>
        <p type="p">224:SRAM緩衝器</p>
        <p type="p">228A:DRAM緩衝器</p>
        <p type="p">240:記憶體裝置</p>
        <p type="p">300:電腦系統/記憶體系統</p>
        <p type="p">302:計算儲存資源</p>
        <p type="p">304:裝置記憶體</p>
        <p type="p">306:非揮發性記憶體</p>
        <p type="p">308:通訊網狀架構</p>
        <p type="p">310:計算儲存功能</p>
        <p type="p">312:資料處理器</p>
        <p type="p">314:資源儲存庫</p>
        <p type="p">315:計算儲存引擎</p>
        <p type="p">316:計算儲存引擎環境</p>
        <p type="p">318:功能資料記憶體</p>
        <p type="p">320:所分配FDM</p>
        <p type="p">330:記憶體讀取或寫入請求</p>
        <p type="p">340:資料處理請求</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1662" publication-number="202617400">
    <tif-files tif-type="multi-tif">
      <tif file="114125751.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>真空袋成形系統、強化纖維複合成形體之製造方法及聚乙烯醇薄膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B29C43/12</main-classification>
        <further-classification edition="200601120260123B">B29C70/44</further-classification>
        <further-classification edition="200601120260123B">B29C70/54</further-classification>
        <further-classification edition="200601120260123B">B32B27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新田正直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTA, MASANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石內由圭里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIUCHI, YUKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉本純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMOTO, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種真空袋成形系統，其在強化纖維複合材料的熱壓釜成形等之中，可減少通氣管、離型薄膜等之副資材的使用，在從真空袋排氣時，封袋薄膜與成形材料之間不易留下空隙，作業性優異，且可進行表面性良好之成形體的成形。一種真空袋成形系統，其具備真空袋與前述真空袋內之排氣用的真空閥，在前述真空袋內部，收納有直接配置或隔著其他構件而配置於模具上之成形材料，前述真空袋具有表面未經壓紋處理之屬於聚乙烯醇薄膜的封袋薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:模具</p>
        <p type="p">11:離型劑</p>
        <p type="p">12:成形材料</p>
        <p type="p">13:封袋薄膜</p>
        <p type="p">14:真空閥</p>
        <p type="p">15:真空袋</p>
        <p type="p">16:密封膠帶(密封部位)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1663" publication-number="202617320">
    <tif-files tif-type="multi-tif">
      <tif file="114125753.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分割加工品的製造方法及加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260126B">B23K26/40</main-classification>
        <further-classification edition="201401120260126B">B23K26/351</further-classification>
        <further-classification edition="200601320260126B">B23K101/40</further-classification>
        <further-classification edition="200601320260126B">B23K103/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪思科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DISCO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關家一馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIYA, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種能夠提升對具有被分割要素之被加工物施行分割加工時的加工效率之分割加工品的製造方法及加工裝置。&lt;br/&gt;  [解決手段]執行以下步驟：載置步驟，將具備分割加工的對象即被分割要素並且被分割要素已固定於支撐構件之被加工物載置於輸送機；及分割步驟，對已被載置在輸送機之被加工物照射雷射光束，來將被加工物分割成複數個分割加工品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:被加工物</p>
        <p type="p">4:被分割要素</p>
        <p type="p">12:支撐構件</p>
        <p type="p">14:接著層</p>
        <p type="p">16:分割加工品(器件封裝)</p>
        <p type="p">20:加工裝置(雷射加工裝置)</p>
        <p type="p">22:輸送機</p>
        <p type="p">22a:搬送面</p>
        <p type="p">24:照射機構</p>
        <p type="p">28:雷射光束</p>
        <p type="p">40:照射單元</p>
        <p type="p">42:檢測部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1664" publication-number="202617776">
    <tif-files tif-type="multi-tif">
      <tif file="114125766.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療ＳＭＡＲＣＢ１缺陷型癌症之方法</chinese-title>
        <english-title>METHODS OF TREATING SMARCB1-DEFICIENT CANCERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="200601120260202B">C07K16/30</further-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克努爾　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNORR, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾德里克　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULDRICK, THOMAS S., JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供治療SMARCB1缺陷型癌症之方法。在某些具體例中，該等方法包含向有需要之個體投與抗MUC16/抗CD3抗體或其抗原結合片段。在某些具體例中，該等方法進一步包含向該有需要之個體投與PD-1抑制劑(例如抗PD-1抗體)或PD-L1抑制劑(例如抗PD-L1抗體)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods of treating a SMARCB1-deficient cancer. In certain embodiments, the methods comprise administering an anti-MUC16/anti-CD3 antibody or antigen-binding fragment thereof to a subject in need thereof. In certain embodiments, the methods further comprise administering a PD-1 inhibitor (&lt;i&gt;e.g.&lt;/i&gt;, an anti-PD-1 antibody) or a PD-L1 inhibitor (&lt;i&gt;e.g.&lt;/i&gt;, an anti-PD-L1 antibody) to the subject in need thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1665" publication-number="202617980">
    <tif-files tif-type="multi-tif">
      <tif file="114125769.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造重組鹼性磷酸酶之方法</chinese-title>
        <english-title>METHODS OF MANUFACTURING RECOMBINANT ALKALINE PHOSPHATASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N9/16</main-classification>
        <further-classification edition="200601120260202B">A61K38/46</further-classification>
        <further-classification edition="200601120260202B">A61P19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿雷希昂製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEXION PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈達瓦特　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODAWAT, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇伊　希光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUI, SIGUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班托　帕特里夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENTO, PATRICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">特徵係製造重組鹼性磷酸酶之方法，其對糖基化模式（諸如最終產品中之唾液酸、甘露糖、及岩藻糖）提供更精確的品質控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Featured are methods of manufacturing recombinant alkaline phosphatases that provide more precise quality control over glycosylation patterns such as sialic acid, mannose, and fucose in the final product.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1666" publication-number="202618016">
    <tif-files tif-type="multi-tif">
      <tif file="114125778.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以微波氧化進行氮化矽介電質之選擇性蝕刻</chinese-title>
        <english-title>SELECTIVE ETCHING OF SILICON NITRIDE DIELECTRICS WITH MICROWAVE OXIDATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C23C14/00</main-classification>
        <further-classification edition="200601120260126B">C23C14/06</further-classification>
        <further-classification edition="200601120260126B">C23C14/34</further-classification>
        <further-classification edition="200601120260126B">C23C14/08</further-classification>
        <further-classification edition="200601120260126B">C23C14/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　程玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷迪　桑達拉潘迪恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, SUNDARAPANDIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那雅客　亞文內許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAYAK, AVINASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董　瑋玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, WEILING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, ANNIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪馬迪亞姆　希里什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADIMADHYAM, SIREESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維索卡　伊蓮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYSOK, IRENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在基板上沉積薄膜的方法包含將包含濺射工作氣體和反應性氣體的製程氣體流動至物理氣相沉積腔室的處理區域。濺射工作氣體包括惰性氣體，且反應性氣體包括氮。該方法進一步包括對安置於處理腔室中的靶材偏壓，其中對靶材的偏壓包括在使製程氣體流動時提供至少30千瓦（kW）的直流（DC）功率至靶材，以及在使製程氣體流動並對靶材偏壓時，將安置於處理區域內的基板加熱至約200°C至約400°C的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for depositing a layer on a substrate includes flowing a process gas that comprises a sputtering working gas and a reactive gas to a processing region of a physical vapor deposition chamber. The sputtering working gas comprises an inert gas and the reactive gas comprises nitrogen. The method further includes biasing a target disposed in a processing chamber, wherein the biasing of the target comprises providing a direct current (DC) power of at least 30 kilowatts (kW) to the target while the process gas is flowing, and heating the substrate disposed within the processing region to a temperature between about 200 °C and about 400 °C while flowing the process gas and biasing the target.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302~308:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1667" publication-number="202618391">
    <tif-files tif-type="multi-tif">
      <tif file="114125785.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分割照明系統</chinese-title>
        <english-title>SPLIT ILLUMINATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B21/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納夫塔利　榮恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAFTALI, RON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費德曼　哈姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELDMAN, HAIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈爾貝格　包里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLBERG, BORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐隆　萊姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORON, RAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朗施塔特　伊泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANGSTADTER, ITAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種光學系統。該光學系統包括輸入瞳孔，該輸入瞳孔用於輸入照明輻射，以及第一和第二場分裂階段。該第一場分裂階段被配置為沿選定的第一軸將輸入照明輻射分割為第一選定數量的照明光束。該第二場分裂階段被配置為接收該第一選定數量的照明光束，並將該第一選定數量的照明光束分割為沿選定的第二軸的第二選定數量的照明光束。因此，該光學系統提供藉由該輸出瞳孔出口的選定數量的照明光束，並對具有選定空間形狀的區域進行照明。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical system is described. The optical system comprises an input pupil for input of illumination radiation, and first and second field splitting stages. The first field splitting stage is configured to divide input illumination radiation into a first selected number of illumination beams along a selected first axis. The second field splitting stage is configured for receiving the first selected number of illumination beams and dividing said first selected number of illumination beam into a second selected number of illumination beams along a selected second axis. The optical system thus provides a selected number of illumination beams exiting through said output pupil and providing illumination of a region of a selected spatial shape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:取樣</p>
        <p type="p">100:光學系統</p>
        <p type="p">120:輸入照明光束</p>
        <p type="p">122:光束</p>
        <p type="p">123:照明光束</p>
        <p type="p">124:照明光束</p>
        <p type="p">125:光束元件</p>
        <p type="p">126:光束元件</p>
        <p type="p">130:輸入瞳孔</p>
        <p type="p">140:透鏡</p>
        <p type="p">150:第一分裂階段</p>
        <p type="p">160:透鏡配置</p>
        <p type="p">170:第二分裂階段</p>
        <p type="p">180:透鏡配置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1668" publication-number="202619493">
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          <doc-number>202619493</doc-number>
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        <document-id>
          <doc-number>114125795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性移位暫存器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260126B">H10B61/00</main-classification>
        <further-classification edition="202301120260126B">H10N50/20</further-classification>
        <further-classification edition="202501120260126B">H10D48/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中宏和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, HIROKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鶴田聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUTA, HIJIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中井孝洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中辻知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATSUJI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肥後友也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGO, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之磁性移位暫存器具備複數個磁性移位暫存器部、寫入部及讀出部。複數個磁性移位暫存器部之各者包含於特定方向延伸之磁性體層。寫入部將複數個磁性移位暫存器部電性串聯連接。藉由使對應於串列資料之脈衝電流於寫入部中流動，而將自旋資訊轉印至磁性體層。自旋資訊係藉由伴隨移位電流於特定方向流動之磁壁移動而緩存於複數個磁性移位暫存器部中。讀出部可讀出緩存於複數個磁性移位暫存器部中之自旋資訊。複數個磁性移位暫存器部之特定方向上之兩端之電阻互不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:磁性移位暫存器</p>
        <p type="p">10:磁性移位暫存器部</p>
        <p type="p">10a:第一磁性移位暫存器部</p>
        <p type="p">10b:第二磁性移位暫存器部</p>
        <p type="p">10c:第三磁性移位暫存器部</p>
        <p type="p">10d:第四磁性移位暫存器部</p>
        <p type="p">10e:第五磁性移位暫存器部</p>
        <p type="p">20:寫入部</p>
        <p type="p">30:讀出部</p>
        <p type="p">40:電流源</p>
        <p type="p">I&lt;sub&gt;P&lt;/sub&gt;:脈衝電流</p>
        <p type="p">I&lt;sub&gt;S&lt;/sub&gt;:移位電流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1669" publication-number="202618291">
    <tif-files tif-type="multi-tif">
      <tif file="114125801.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125801</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>插座板、自動試驗裝置的介面裝置及自動試驗裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G01R1/04</main-classification>
        <further-classification edition="202001120260126B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛德萬測試股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANTEST CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬下貴仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SESHIMO, TAKAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種使訊號高密度化的介面裝置。插座PCB 214在其第一面上設置有插座引導件。中介層218與插座PCB 214的第二面以能夠裝卸的方式連接。在插座PCB 214的第二面上形成有多個第二墊P2，所述多個第二墊P2能夠與中介層的多個電極接觸且呈矩陣狀配置。多個第二墊P2在列方向與行方向各者上被交替地分配有訊號接腳SIG與接地接腳GND。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">214:插座PCB(插座印刷基板)</p>
        <p type="p">218:中介層</p>
        <p type="p">GND:接地接腳</p>
        <p type="p">P2:第二墊(墊)</p>
        <p type="p">PU:最小單位</p>
        <p type="p">SIG:訊號接腳(第二接腳)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1670" publication-number="202619494">
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          <doc-number>202619494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性移位暫存器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260126B">H10B61/00</main-classification>
        <further-classification edition="202301120260126B">H10N50/20</further-classification>
        <further-classification edition="202501120260126B">H10D48/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中宏和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, HIROKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鶴田聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUTA, HIJIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中井孝洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中辻知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATSUJI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肥後友也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGO, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明之磁性移位暫存器具備複數個磁性移位暫存器部、寫入部及讀出部。藉由使對應於串列資料之脈衝電流於寫入部中流動，而將串列資料之各位元所對應之自旋資訊轉印至複數個磁性移位暫存器部之磁性體層。轉印至磁性體層之自旋資訊，藉由伴隨移位電流於特定方向流動之磁壁移動而緩存於複數個磁性移位暫存器部中。讀出部係自複數個磁性移位暫存器部之各者逐個讀出自旋資訊，上述自旋資訊係於同一時刻緩存於複數個磁性移位暫存器部中，且對應於串列資料中不同順序之位元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:磁性移位暫存器</p>
        <p type="p">10:磁性移位暫存器部</p>
        <p type="p">10a:第一磁性移位暫存器部</p>
        <p type="p">10b:第二磁性移位暫存器部</p>
        <p type="p">10c:第三磁性移位暫存器部</p>
        <p type="p">10d:第四磁性移位暫存器部</p>
        <p type="p">10e:第五磁性移位暫存器部</p>
        <p type="p">20:寫入部</p>
        <p type="p">30:讀出部</p>
        <p type="p">40:電流源</p>
        <p type="p">I&lt;sub&gt;P&lt;/sub&gt;:脈衝電流</p>
        <p type="p">I&lt;sub&gt;S&lt;/sub&gt;:移位電流</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1671" publication-number="202619348">
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      <isuno>9</isuno>
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        <document-id>
          <doc-number>114125808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於點雲壓縮的框間預測</chinese-title>
        <english-title>INTER-PREDICTION FOR POINT CLOUD COMPRESSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260126B">H04N19/597</main-classification>
        <further-classification edition="201401120260126B">H04N19/172</further-classification>
        <further-classification edition="201401120260126B">H04N19/503</further-classification>
        <further-classification edition="201401120260126B">H04N19/70</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>拉瑪蘇拉莫尼安　艾達希克里斯南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASUBRAMONIAN, ADARSH KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范德奧維拉　吉爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER AUWERA, GEERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克塔　安尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKHTAR, ANIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡達　瑞圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOODA, REETU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡克基維克茲　瑪塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種解碼點雲資料之方法包括：在一單一階段中將一縮放及偏移應用於一參考框，以產生一經更新參考框；及基於該經更新參考框解碼一目前框的該點雲資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of decoding point cloud data includes applying a scale and offset to a reference frame in a single stage to generate an updated reference frame; and decoding the point cloud data of a current frame based on the updated reference frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2200:參考框</p>
        <p type="p">2202,2204,2206,2208:步驟</p>
        <p type="p">2210:經更新參考框</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1672" publication-number="202618846">
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        <document-id>
          <doc-number>114125813</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用掃描電子顯微鏡對非平面半導體基結構進行成像</chinese-title>
        <english-title>IMAGING OF NONPLANAR SEMICONDUCTOR-BASED STRUCTURES USING A SCANNING ELECTRON MICROSCOPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01J37/21</main-classification>
        <further-classification edition="200601120260202B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司多重掃描電子顯微鏡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS MULTISEM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米克施　伯庸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKSCH, BJOERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費勒　坦賈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELLER, TANJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡芬尼耶斯　馬克西姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMPANIIETS, MAKSYM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼克　菲立克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENKE, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋里奇　保羅　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEIRICH, PAUL MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒伯特　凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUBERT, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞德林　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIDLING, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用以透過掃描電子顯微鏡對半導體基結構進行成像的方法和系統，其能夠提供改良的影像對比度及/或識別半導體基結構的特徵尺寸的準確性。在一實施例中，所述方法包含：建立SEM的束參數的第一值；第一調整階段，用於調整第一值並獲得第二值；第二調整階段，用於調整第二值並獲得第三值；以及使用第三值控制SEM的成像組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a method and a system for imaging semiconductor-based structures by a scanning electron microscope that can provide improved image contrast and/or accuracy in identifying feature dimensions of semiconductor-based structures. In one implementation, the method comprises establishing first values of the SEM’s beam parameters; a first adjustment stage to adjust the first values and obtain second values; a second adjustment stage to adjust second values and obtain third values; and controlling imaging components of the SEM using the third values.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2000:方法</p>
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          <doc-number>114125825</doc-number>
        </document-id>
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      <invention-title>
        <chinese-title>一種ＰＳＤ－９５多肽抑制劑的可藥用鹽及其製備方法</chinese-title>
        <english-title>A PHARMACEUTICALLY ACCEPTABLE SALT OF PSD-95 PEPTIDE INHIBITOR AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K7/08</main-classification>
        <further-classification edition="200601120260202B">A61K38/10</further-classification>
        <further-classification edition="200601120260202B">A61P9/00</further-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商福建盛迪醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIAN SHENGDI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳向寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIANGNING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAJIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林溪泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, XIQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃慶港</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, QINGGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭昌山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CHANGSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種PSD-95多肽抑制劑的可藥用鹽及其製備方法。具體地，本揭露提供了一種式(I)化合物的可藥用鹽。式(I)化合物的可藥用鹽具有良好的穩定性，適合用於臨床治療。</p>
        <p type="p">r-K-K-R-r-Q-R-R-r-G-Aib-Dab-T-Tle-Tle-T-D-V(SEQ ID NO.01) (I)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a pharmaceutically acceptable salt of PSD-95 peptide inhibitor and preparation method thereof. Specifically, the disclosure provides a pharmaceutically acceptable salt of a compound of formula (I). The pharmaceutically acceptable salts of compound (I) have good stability and are suitable for clinical treatment. </p>
        <p type="p">r-K-K-R-r-Q-R-R-r-G-Aib-Dab-T-Tle-Tle-T-D-V (SEQ ID NO. 01) (I)</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1674" publication-number="202617739">
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          <doc-number>202617739</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種稠合三環化合物、其製備方法及其在醫藥上的應用</chinese-title>
        <english-title>A CONDENSED TRICYCLIC COMPOUND, ITS PREPARATION METHOD AND APPLIATION IN MEDICINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D519/00</main-classification>
        <further-classification edition="200601120260202B">A61K31/5383</further-classification>
        <further-classification edition="200601120260202B">A61K31/553</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種稠合三環化合物、其製備方法及其在醫藥上的應用。具體而言，本揭露涉及一種通式(I)所示的化合物、其製備方法及含有該化合物的醫藥組成物以及其作為治療劑的用途，特別是作為RAS抑制劑的用途和在製備用於治療和/或預防RAS介導的或依賴性的疾病或病症的藥物中的用途。其中通式(I)中各基團如說明書中所定義。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="302px" width="396px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a condensed tricyclic compound, its preparation method and application in medicine. Specifically, the present disclosure relates to a compound represented by general formula (I), its preparation method, a pharmaceutical composition containing the same, and their use as a therapeutic agent, particularly as a RAS inhibitor and their use in the preparation of medicaments for the treatment and/or prevention of RAS mediated or dependent diseases or conditions. The functional groups in formula (I) are as defined in the specification.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="252px" width="314px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1675" publication-number="202617544">
    <tif-files tif-type="multi-tif">
      <tif file="114125877.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬運袋及吊掛搬運具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B65D88/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星裕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下真語</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係用以搬運內容物之搬運袋(10)、(20)。搬運袋(10)、(20)具備內容物之填充口(13)、(23)、及內容物之排出口(12)、(22)。於側面觀察搬運袋(10)、(20)時具有自填充口(13)、(23)朝向排出口(12)、(22)之傾斜區域(14)、(24)。搬運袋(20)較佳為具備筒狀之內袋(21)、位於內袋(21)之上端之填充口(23)、位於內袋(21)之下端之排出口(22)、及覆蓋位於內袋(21)之下端區域之傾斜區域(24)之外表面且由剛直體構成之導引構件(26)。導引構件(26)於其內表面之至少一部分具有朝向排出口(22)之傾斜面(28)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:搬運袋</p>
        <p type="p">21:內袋</p>
        <p type="p">22:排出口</p>
        <p type="p">22a:排出部</p>
        <p type="p">26:導引構件</p>
        <p type="p">30:吊掛構件</p>
        <p type="p">31:開口部</p>
        <p type="p">32:中央部</p>
        <p type="p">33:臂部</p>
        <p type="p">33a:基部</p>
        <p type="p">33b:前端區域</p>
        <p type="p">34:緊固用繩</p>
        <p type="p">35:環構件</p>
        <p type="p">36:封閉構件</p>
        <p type="p">37:開閉桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1676" publication-number="202618465">
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      <tif file="114125889.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618465</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯影用流體供給裝置、顯影裝置及顯影用流體供給方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G03F7/32</main-classification>
        <further-classification edition="200601120260127B">G03F9/00</further-classification>
        <further-classification edition="200601120260127B">G03F7/004</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚建次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水永耕市</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNAGA, KOUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛丸浩二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIMARU, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大島和彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOSHIMA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野圭悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田端佑真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABATA, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土山正志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYAMA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村竜成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, RYUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙木慎介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAKI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於顯影用流體供給裝置、顯影裝置及顯影用流體供給方法。供給包含弱酸之氣體及霧化物其中的至少任一者之顯影用流體，其適用於含金屬之光阻的顯影。本發明之顯影用流體供給裝置，具有：供給路，連接至顯影部，該顯影部將形成有含金屬之光阻膜而施行過曝光處理的基板，藉由包含弱酸之氣體及霧化物其中的至少任一者之顯影用流體予以顯影；顯影用流體生成部，由顯影用液體生成該顯影用流體；以及加熱部，將經由該供給路而供給至該顯影部的該顯影用流體加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:顯影單元</p>
        <p type="p">330:噴淋頭</p>
        <p type="p">500:供給機構</p>
        <p type="p">501:氣化器</p>
        <p type="p">502:供給路</p>
        <p type="p">503:加熱器</p>
        <p type="p">504:開閉閥</p>
        <p type="p">505:分支路</p>
        <p type="p">506:開閉閥</p>
        <p type="p">511:供給源</p>
        <p type="p">512:氣體供給路</p>
        <p type="p">513:供給機器群</p>
        <p type="p">513a:氣體流量調節閥</p>
        <p type="p">521:儲存槽</p>
        <p type="p">522:液體供給路</p>
        <p type="p">523:供給機器群</p>
        <p type="p">523a:液體流量調節閥</p>
        <p type="p">530:排液儲存槽</p>
        <p type="p">541,542,543:流路</p>
        <p type="p">550:濃度感測器</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1677" publication-number="202617140">
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      <tif file="114125895.zip" no="1">
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          <doc-number>202617140</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125895</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硫雜環戊基衍生物的藥物製劑及其在醫藥上的用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/381</main-classification>
        <further-classification edition="200601120260202B">A61K31/4436</further-classification>
        <further-classification edition="200601120260202B">A61K47/38</further-classification>
        <further-classification edition="200601120260202B">A61K47/32</further-classification>
        <further-classification edition="200601120260202B">A61K47/12</further-classification>
        <further-classification edition="200601120260202B">A61K47/04</further-classification>
        <further-classification edition="200601120260202B">A61K9/20</further-classification>
        <further-classification edition="200601120260202B">A61K9/48</further-classification>
        <further-classification edition="200601120260202B">A61K9/14</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, TINGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種硫雜環戊基衍生物的藥物製劑及其在醫藥上的用途，所述的藥物製劑包含治療有效量的活性成分M和藥用賦形劑，所述的活性成分M選自通式(I)所述的化合物或者其立體異構體、互變異構體、氘代物、溶劑化物、前藥、代謝產物、藥學上可接受的鹽或共晶，所述藥物製劑包含1-800mg活性成分M。本發明還涉及所述藥物製劑用於製備治療疼痛相關藥物中的用途。  &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="218px" file="ed10639.JPG" alt="ed10639.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1678" publication-number="202618898">
    <tif-files tif-type="multi-tif">
      <tif file="114125899.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合式金屬與金屬氮化物沉積</chinese-title>
        <english-title>INTEGRATED METAL AND METAL NITRIDE DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/285</main-classification>
        <further-classification edition="200601120260122B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　舉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, JUWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈皮納思　珊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOPINATH, SANJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>可里伊許特克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIM, ISHTAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托賓　杰弗里　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBIN, JEFFREY ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王塞納克運　潘亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONGSENAKHUM, PANYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾許地安尼　凱翰　阿畢迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHTIANI, KAIHAN ABIDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">含金屬膜和金屬氮化物膜係在沒有中介的真空中斷的情況下沉積。在一些實施例中，若干膜係在同一腔室中沉積。在一些實施例中，金屬氮化物膜為鈦氮化物膜。在同一或其他實施例中，含金屬膜可能是含鉬膜，例如鉬矽化物膜。應用的範例包含埋入式字元線(bWL)以及2D和3D DRAM，包含底部和頂部電極。在一些實施例中，這些方法可用於源極/汲極接點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Metal-containing films and metal nitride films are deposited without an intervening vacuum break. In some embodiments, the films are deposited in the same chamber. In some embodiments, the metal nitride films are titanium nitride films. In the same or other embodiments, the metal-containing films may be molybdenum-containing films, such as molybdenum silicide films. Examples of applications include buried wordline (bWL) and 2D and 3D DRAM, including bottom and top electrodes. In some embodiments, the methods may be used for source/drain contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">851:操作</p>
        <p type="p">853:操作</p>
        <p type="p">855:操作</p>
        <p type="p">857:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1679" publication-number="202619015">
    <tif-files tif-type="multi-tif">
      <tif file="114125902.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電卡盤構件及靜電卡盤裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/683</main-classification>
        <further-classification edition="200601120260123B">C04B41/87</further-classification>
        <further-classification edition="200601120260123B">C23C14/34</further-classification>
        <further-classification edition="200601120260123B">C23C14/50</further-classification>
        <further-classification edition="200601120260123B">C23C16/458</further-classification>
        <further-classification edition="200601120260123B">H01L21/3065</further-classification>
        <further-classification edition="200601120260123B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友大阪水泥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO OSAKA CEMENT CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴垣息吹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAGAKI, IBUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提高了耐腐蝕性的新穎的靜電卡盤構件。另外，提供一種具有此種靜電卡盤構件並提高了耐腐蝕性的新穎的靜電卡盤裝置。一種靜電卡盤構件，包括：靜電吸附用電極；以及板狀的電介質基板，內包靜電吸附用電極，具有供板狀試樣載置的載置面，電介質基板在電介質基板的表面的至少一部分具有保護膜，所述保護膜是以選自氧化物、氟化物及氟氧化物的群組中的至少一種陶瓷為材料而形成，所述材料包含選自稀土元素、Mg、Ca、Al、Si及Zr的群組中的至少一種，保護膜的厚度為0.01 μm以上且10 μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:靜電卡盤構件</p>
        <p type="p">10x:載置面</p>
        <p type="p">10y:電介質基板的載置面側的周緣部</p>
        <p type="p">11:電介質基板</p>
        <p type="p">11a:表面</p>
        <p type="p">13:靜電吸附用電極/電極</p>
        <p type="p">19:保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1680" publication-number="202619227">
    <tif-files tif-type="multi-tif">
      <tif file="114125908.zip" no="1">
      </tif>
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          <doc-number>202619227</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125908</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線充電印刷電路板</chinese-title>
        <english-title>WIRELESS CHARGING PRINTED CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260126B">H02J50/10</main-classification>
        <further-classification edition="200601120260126B">H01F27/28</further-classification>
        <further-classification edition="201601120260126B">H02J50/00</further-classification>
        <further-classification edition="200601120260126B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉晏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴雲菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種多功能無線充電印刷電路板，其透過在多層上形成短程天線和多個充電線圈來實現，其中上述短程天線和至少一個充電線圈整合在單層上。無線充電印刷電路板的充電側可設置一個或多個溫度偵測單元，以有效散熱並避免過溫事故。可在無線充電印刷電路板的底部貼上鐵氧體片，以提高無線充電效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a multi-function charging printed circuit board by forming a short-range antenna and multiple charging coils on multiple layers, wherein the short-range antenna and at least one charging coil is integrated on a single layer. One or more temperature-detecting units are disposed on the charging side of the charging printed circuit board for effectively dissipating heat and avoiding over-temperature accidents. A ferrite sheet is attached to the bottom side of the wireless charging printed circuit board for improving the efficiency of wireless charging.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:溫度偵測單元</p>
        <p type="p">20:鐵氧體片</p>
        <p type="p">CS:充電側</p>
        <p type="p">BS:底側</p>
        <p type="p">100:無線充電印刷電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1681" publication-number="202617732">
    <tif-files tif-type="multi-tif">
      <tif file="114125910.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物、補體D因子抑制劑、及醫藥組合物</chinese-title>
        <english-title>COMPOUND, COMPLEMENT FACTOR D INHIBITOR, AND PHARMACEUTICAL COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D491/22</main-classification>
        <further-classification edition="200601120260202B">A61K31/4184</further-classification>
        <further-classification edition="200601120260202B">A61K31/4439</further-classification>
        <further-classification edition="200601120260202B">A61K31/4162</further-classification>
        <further-classification edition="200601120260202B">A61P27/02</further-classification>
        <further-classification edition="200601120260202B">A61P11/00</further-classification>
        <further-classification edition="200601120260202B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商亞克醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALCHEMEDICINE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二宮智尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINOMIYA, TOMOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中圭悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種化合物或其醫藥上可容許之鹽，該化合物係由下述式(1)所表示：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="181px" width="222px" file="ed10073.JPG" alt="ed10073.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，可變部如說明書中所記載]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compound represented by the following formula (1): &lt;br/&gt;&lt;img align="absmiddle" height="155px" width="219px" file="ed10074.JPG" alt="ed10074.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein variables are as described herein; &lt;br/&gt;or a pharmaceutically acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1682" publication-number="202618007">
    <tif-files tif-type="multi-tif">
      <tif file="114125921.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟骨樣組織形成特性評價用標記</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260202B">C12Q1/6876</main-classification>
        <further-classification edition="201001120260202B">C12N5/077</further-classification>
        <further-classification edition="201001120260202B">C12N5/0775</further-classification>
        <further-classification edition="200601120260202B">A61L27/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商創革醫療科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELLSEED INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＮＡ晶片研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DNA CHIP RESEARCH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤千香子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, CHIKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾純子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, JUNKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本節子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, SETSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮川玲奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKAWA, REINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貫島匡生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURASHIMA, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤良隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>的場亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATOBA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於提供適於軟骨修復的細胞培養物、特別是適於透明軟骨修復的細胞培養物的技術。一種軟骨樣組織形成特性評價用標記，包含選自由（1）黏附相關基因、（2）血管生成相關基因、（3）ECM相關基因、（4）膠原蛋白相關基因、（5）細胞移行相關基因、（6）線粒體相關基因所組成的群組中的一種或兩種以上的基因標記。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1683" publication-number="202619034">
    <tif-files tif-type="multi-tif">
      <tif file="114125938.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/768</main-classification>
        <further-classification edition="200601120260128B">H01L23/532</further-classification>
        <further-classification edition="200601120260128B">C23C16/34</further-classification>
        <further-classification edition="202501120260128B">H10D64/60</further-classification>
        <further-classification edition="200601120260128B">H01L21/3205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武安一成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEYASU, ISSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原正道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, MASAMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石坂忠大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKA, TADAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種在凹部內填埋配線金屬時會形成具有合適特性之氮化鈦層作為密合層之技術。  &lt;br/&gt;  在對層積有形成有用以填埋配線金屬之凹部的矽絕緣體層且在該凹部的底面露出有含鈦層或鎢層之基板進行處理時，對該基板供給含氮原子氣體的電漿以使該矽絕緣體層的側壁及該含鈦層或該鎢層氮化。接著，在該矽絕緣體層的側壁面形成氮化鈦層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:凹部</p>
        <p type="p">201:Si層</p>
        <p type="p">202:SiO層</p>
        <p type="p">203:TiSi層</p>
        <p type="p">203b:TiSiN層</p>
        <p type="p">204:SiON層</p>
        <p type="p">205:TiN層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1684" publication-number="202618559">
    <tif-files tif-type="multi-tif">
      <tif file="114125957.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具熱度追蹤之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD WITH HOTNESS TRACKING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G06F11/34</main-classification>
        <further-classification edition="200601120251001B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛容三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YOUNGSAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳德載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, DEOK JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於提供熱度追蹤之記憶體裝置及一種操作該記憶體裝置之方法。該裝置包括：一記憶體陣列，其包括一記憶體空間；一控制器，其經組態以基於來自一主機之一聚焦請求而設定該記憶體空間中之聚焦位址範圍以用於熱度追蹤；以及一或多個計數器，其包括一計數器，該計數器經組態以針對該一或多個聚焦位址範圍當中之一對應聚焦位址範圍的記憶體存取進行計數以判定一經計數值，且將該經計數值提供至該主機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device for providing hotness tracking and a method operating the memory device are provided. The device includes a memory array including a memory space, a controller configured to set focus address ranges in the memory space based on a focus request from a host for hotness tracking, and one or more counters including a counter configured to count memory accesses to a corresponding focus address range among the one or more focus address ranges to determine a counted value, and provide the counted value to the host.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電子裝置</p>
        <p type="p">210:主機</p>
        <p type="p">220:記憶體裝置</p>
        <p type="p">221:控制器</p>
        <p type="p">223:記憶體陣列</p>
        <p type="p">2221,2222,2223:計數器</p>
        <p type="p">2231:記憶體空間</p>
        <p type="p">2241,2242,2243:聚焦位址範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1685" publication-number="202617546">
    <tif-files tif-type="multi-tif">
      <tif file="114125960.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自動儲存和取出系統的服務車輛</chinese-title>
        <english-title>SERVICE VEHICLE FOR AN AUTOMATED STORAGE AND RETRIEVAL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B65G1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>挪威商自動存儲技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUTOSTORE TECHNOLOGY AS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧斯崔翰　特朗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUSTRHEIM, TROND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾巴肯　喬金Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYRBAKKEN, JOAKIM A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費特取　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITJE, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑爾德維克　奧伊斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GJERDEVIK, OYSTEIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露案涉及一種用於在自動儲存與取出系統中運行的服務車輛，前述自動儲存及取出系統包括一結構構件網格，其之間提供了複數儲存空間以用於儲存複數儲存容器，其中該服務車輛包括：一底盤，該底盤具有移動部件，其用於在該網格上方以如向前或向後方向的複數個車輛移動方向而移動該服務車輛；一使用者控制器，為一使用者提供該使用者控制器以控制該移動部件；以及一座椅，該座椅用於支撐一使用者；其中該座椅可配置為至少一第一配置以及一第二配置，在該第一配置中該座椅面朝相對於該底盤的一第一座椅方向，在該第二配置中該座椅面朝相對於該底盤的一第二座椅方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a service vehicle for operation in an automated storage and retrieval system, said automated storage and retrieval system comprising a grid of structural members amongst which a plurality of storage spaces are provided for storing a plurality of storage containers, wherein the service vehicle comprises: a chassis having movement means for moving the service vehicle over the grid in a plurality of vehicle movement directions such as a forward and a backward direction; a user control providing for a user to control the movement means; and a seat for supporting a user; wherein the seat is configurable in at least a first configuration in which the seat faces a first seat direction relative to the chassis, and a second configuration in which the seat faces a second seat direction relative to the chassis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:服務車輛</p>
        <p type="p">S1:第一座椅方向</p>
        <p type="p">S2:第二座椅方向</p>
        <p type="p">520:使用者控制器</p>
        <p type="p">530:座椅</p>
        <p type="p">550:第一配置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1686" publication-number="202618210">
    <tif-files tif-type="multi-tif">
      <tif file="114125962.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>位置測量裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01B7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科機床股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC MACHINE TOOL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内克佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, KATSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立石一真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATEISHI, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋爪昭博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIZUME, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀淳一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, JUNICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內尾祥貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIO, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野真弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種位置測量裝置具備：標尺構件，其具備沿第一方向延伸的第一面；呈環狀的多個標尺線圈，其沿第一方向排列地配置於第一面；滑塊構件，其具備與第一面相對的第二面，且能夠相對於標尺構件在第一方向上相對移動；激勵線圈，其設置於第二面，且產生變化磁場以使標尺線圈產生感應電流；及檢測線圈，其具備接收伴隨感應電流的感應磁場並產生檢測電壓的第一部位、一端與第一部位連接且相對於一端的另端側向離開第一面的方向延伸的第二部位及與第二部位的另端側連接且沿著第一面的方向上延伸的第三部位，檢測線圈保持於滑塊構件並檢測感應磁場。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:位置測量裝置</p>
        <p type="p">110:標尺</p>
        <p type="p">111:接縫</p>
        <p type="p">120:滑塊</p>
        <p type="p">130:標尺構件</p>
        <p type="p">131:上表面</p>
        <p type="p">140:標尺線圈</p>
        <p type="p">150:滑塊構件</p>
        <p type="p">151:通孔</p>
        <p type="p">152:上表面</p>
        <p type="p">153:下表面</p>
        <p type="p">160,170:激勵線圈</p>
        <p type="p">180:檢測線圈</p>
        <p type="p">181:第一部位</p>
        <p type="p">182:第二部位</p>
        <p type="p">183:第三部位</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1687" publication-number="202618025">
    <tif-files tif-type="multi-tif">
      <tif file="114125983.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125983</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿增強成核層形成</chinese-title>
        <english-title>PLASMA ENHANCED NUCLEATION LAYER FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C23C16/02</main-classification>
        <further-classification edition="200601120260126B">C23C16/08</further-classification>
        <further-classification edition="200601120260126B">C23C16/50</further-classification>
        <further-classification edition="200601120260126B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岳詩雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUE, SHIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　薩希爾賈庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, SAHIL JAYKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岑嘉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEN, JIAJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳周玹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JU HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱奎鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, KUIXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例包括用於電漿增強成核層形成的設備和方法。在低於或等於攝氏450度的處理溫度下將含鉬前驅物（MCP）注入處理腔室。從包含氫的前驅物氣體、或還原氣體中產生電漿。利用電漿和MCP在處理腔室內的基板上形成鉬成核層。在鉬成核層之上沉積一鉬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure include apparatus and methods for plasma enhanced nucleation layer formations. A molybdenum-containing precursor (MCP) is injected into a processing chamber at a processing temperature less than or equal to 450 degrees Celsius. A plasma is generated from a precursor gas that includes hydrogen, or a reduction gas. A molybdenum nucleation layer is formed on a substrate within the processing chamber using the plasma and the MCP. A layer of molybdenum is deposited over the molybdenum nucleation layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502:操作</p>
        <p type="p">504:操作</p>
        <p type="p">506:操作</p>
        <p type="p">508:操作</p>
        <p type="p">510:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1688" publication-number="202619121">
    <tif-files tif-type="multi-tif">
      <tif file="114125996.zip" no="1">
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        <document-id>
          <doc-number>202619121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線基板及其檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L23/538</main-classification>
        <further-classification edition="202301120260126B">H01L25/16</further-classification>
        <further-classification edition="200601120260126B">H01L21/768</further-classification>
        <further-classification edition="200601120260126B">H05K1/11</further-classification>
        <further-classification edition="200601120260126B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高野貴正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, TAKAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>善見誠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMI, SEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">配線基板係具備載體基板、剝離層、中間層及再配線層。再配線層係具備層積的複數個絕緣層與複數個導電層。複數個導電層係包含：第1導電層及第2導電層；位於中間層上之第3導電層及第4導電層；構成將第1導電層與第3導電層電氣性連接之第1路徑的至少1個導電層；構成將第2導電層與第4導電層電氣性連接之第2路徑的至少1個導電層；以及構成將第1路徑的一部分與第2路徑的一部分電氣性連接之第3路徑的至少1個導電層。中間層係至少包含在俯視中圍繞第3導電層的第1島部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:配線基板群</p>
        <p type="p">12:載體基板</p>
        <p type="p">13:剝離層</p>
        <p type="p">14:中間層</p>
        <p type="p">20:再配線層</p>
        <p type="p">20A:第1配線層</p>
        <p type="p">20B:第2配線層</p>
        <p type="p">20C:第3配線層</p>
        <p type="p">21:絕緣層</p>
        <p type="p">22:導電層</p>
        <p type="p">22A:第1導電層</p>
        <p type="p">22B:第2導電層</p>
        <p type="p">22C:第3導電層</p>
        <p type="p">22D:第4導電層</p>
        <p type="p">25:配線</p>
        <p type="p">26:貫通電極</p>
        <p type="p">131:第1下面</p>
        <p type="p">132:第1上面</p>
        <p type="p">141:第2下面</p>
        <p type="p">142:第2上面</p>
        <p type="p">143:島部分</p>
        <p type="p">144:海部分</p>
        <p type="p">145:第1開口</p>
        <p type="p">146:第2開口</p>
        <p type="p">201:第3下面</p>
        <p type="p">202:第3上面</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D3:第3方向</p>
        <p type="p">K1:第1開口之寬度</p>
        <p type="p">K2:第2開口之寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1689" publication-number="202617759">
    <tif-files tif-type="multi-tif">
      <tif file="114126032.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>白蛋白結合化合物</chinese-title>
        <english-title>ALBUMIN-BINDING COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/76</main-classification>
        <further-classification edition="200601120260202B">C07K14/605</further-classification>
        <further-classification edition="201701120260202B">A61K47/64</further-classification>
        <further-classification edition="200601120260202B">A61K38/27</further-classification>
        <further-classification edition="200601120260202B">A61P3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商阿仙帝斯製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASCENDIS PHARMA A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯普羅多　肯尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPROGOE, KENNETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢謝　尼可拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISEK, NICOLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋斯布羅德　山謬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISBROD, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種式(Ia)或(Ib)之化合物、包含至少一種此類化合物之醫藥組合物、其用途及其他相關態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a compound of formula (Ia) or (Ib), to pharmaceutical compositions comprising at least one such compound, their uses and other related aspects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1690" publication-number="202618041">
    <tif-files tif-type="multi-tif">
      <tif file="114126033.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜方法及成膜裝置</chinese-title>
        <english-title>FILM FORMING METHOD AND FILM FORMING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C23C16/42</main-classification>
        <further-classification edition="200601120260127B">C23C16/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井口雄介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGUCHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種相較於絕緣體區域可在半導體區域形成更厚的金屬膜的技術。為了達成上述目的，本發明一實施態樣之成膜方法，其特徵為包含以下步驟：準備於表面具有含矽半導體區域與絕緣體區域的基板；以及對該基板同時供給含第1金屬的原料氣體與蝕刻第1膜層的蝕刻氣體，以於該基板的該表面形成含該第1金屬的該第1膜層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metal-containing film forming method includes preparing a substrate having a semiconductor region containing silicon and an insulator region on a surface of 5 the substrate, and forming a first film containing a first metal on the surface of the substrate by simultaneously supplying a raw material gas containing the first metal and an etching gas for etching the first film to the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S12,S14,S16,S18:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1691" publication-number="202617583">
    <tif-files tif-type="multi-tif">
      <tif file="114126038.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減少鎳與氧化鎳層形成之兩階段電鍍</chinese-title>
        <english-title>TWO STAGE PLATING FOR REDUCED NI AND NIO LAYER FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B81B3/00</main-classification>
        <further-classification edition="200601120260126B">B81B7/02</further-classification>
        <further-classification edition="200601120260126B">B81C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商門絡微系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENLO MICROSYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯爾　喬琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREWER, JOLEYN EILEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗斯特　唐納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUST, DONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那沙　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASSAR, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於微機電系統(MEMS)開關的梁可包括第一層，其包含鎳合金；以及第二層，其位於該第一層的至少一部分上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A beam for a microelectromechanical system (MEMS) switch may include a first layer including a nickel alloy and a second layer on at least a portion of the first layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:MEMS開關</p>
        <p type="p">112:輸入埠</p>
        <p type="p">114:輸出埠</p>
        <p type="p">116:控制埠</p>
        <p type="p">120:第一接觸點</p>
        <p type="p">122:第二接觸點</p>
        <p type="p">124:致動閘</p>
        <p type="p">130:梁</p>
        <p type="p">132:第一層</p>
        <p type="p">134:第二層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1692" publication-number="202618292">
    <tif-files tif-type="multi-tif">
      <tif file="114126041.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卡固環部件</chinese-title>
        <english-title>LOCKING RING MEMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01R1/04</main-classification>
        <further-classification edition="200601120260202B">G01R1/073</further-classification>
        <further-classification edition="200601120260202B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田貴生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUTA, TAKAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孝幸
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARUMI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種卡固環部件，其就算在高溫環境下，也使陶瓷與金屬之間的接著劑之耐久性提高。  &lt;br/&gt;　　[解決手段]本發明為一種板狀的卡固環部件，用於將探針基板安裝至探測機的頂板，前述探測機係被具備在使用於被檢查體之檢查的檢查裝置；其中卡固環部件具有：環形狀部；以及突起形狀部，從該環形狀部的周緣部向外側方向形成凸形狀，並且沿著周緣部而分離地進行配置；卡固環部件所具有的環形狀部係具有與探針基板相對向之一方的表面、以及與一方的表面為相反側之另一方的表面；在卡固環部件所具有的環形狀部的與探針基板相對向的面側，藉由分離而被配置在複數個部位的接著劑，被接著在探針基板的一方的表面；在卡固環部件的被配置有接著劑的複數個部位處，是被設置有凹形狀部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:檢查裝置</p>
        <p type="p">12:探測機</p>
        <p type="p">14:測試頭</p>
        <p type="p">18:檢查台</p>
        <p type="p">20:卡盤頂部</p>
        <p type="p">24:載置面</p>
        <p type="p">26:被檢查體</p>
        <p type="p">28:卡夾持器</p>
        <p type="p">30:探針</p>
        <p type="p">32:探針基板</p>
        <p type="p">34:中介層</p>
        <p type="p">38:錨定件</p>
        <p type="p">40:接觸端子</p>
        <p type="p">58:配線電路基板</p>
        <p type="p">60:連接纜線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1693" publication-number="202617786">
    <tif-files tif-type="multi-tif">
      <tif file="114126045.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防止礦物原材料的黏附及堵塞的方法</chinese-title>
        <english-title>METHOD FOR PREVENTING ADHESION OF AND CLOGGING WITH MINERAL RAW MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C08F2/28</main-classification>
        <further-classification edition="200601120260121B">C09D5/16</further-classification>
        <further-classification edition="200601120260121B">B29B9/00</further-classification>
        <further-classification edition="200601120260121B">C09K3/18</further-classification>
        <further-classification edition="200601120260121B">C08J3/07</further-classification>
        <further-classification edition="200601120260121B">C04B28/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷山奈津美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIYAMA, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防止礦物原材料的黏附及堵塞的方法，所述方法藉由以下方式進行：在轉移及處理設施中對其中礦物原材料已與陽離子油包水乳液聚合物接觸的原材料混合物實行轉移及處理中的至少任一者、以及防止在轉移及處理設施中發生礦物原材料的黏附及堵塞，其中陽離子油包水乳液聚合物具有為10.0分升/公克或小於10.0分升/公克的固有黏度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preventing adhesion of and clogging with a mineral raw material by performing at least any of transfer and treatment of a raw material mixture in which a mineral raw material has been brought into contact with a cationic w/o emulsion polymer in a transfer and treatment facility and preventing adhesion of and clogging with the mineral raw material in the transfer and treatment facility, wherein the cationic w/o emulsion polymer has an intrinsic viscosity of 10.0 dL/g or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1694" publication-number="202618157">
    <tif-files tif-type="multi-tif">
      <tif file="114126090.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流量控制機構、基板處理裝置、半導體裝置之製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">F16K25/00</main-classification>
        <further-classification edition="200601120260123B">F16K3/314</further-classification>
        <further-classification edition="200601120260123B">F16K27/02</further-classification>
        <further-classification edition="200601120260123B">F16K49/00</further-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄司拓人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOJI, TAKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠抑制異物向閥體附著的技術。  &lt;br/&gt;流量控制機構具有：閥體，其係以於至少一部分由配管形成之處理氣體的流路內與氣體流動之方向相交的方向作為軸，而可旋轉地被支撐著，且其被加熱為較上述配管更為高溫，並將表面中之至少一部分的輻射率設為上述配管之內表面的輻射率以下；以及驅動部，其使上述閥體旋轉，而使上述流路之開度變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">52A、52B:配管</p>
        <p type="p">57:閥箱</p>
        <p type="p">58:蝶形閥(閥體)</p>
        <p type="p">87:閥板</p>
        <p type="p">90:驅動部</p>
        <p type="p">91:蝶形閥用外部加熱部</p>
        <p type="p">92:配管用外部加熱部</p>
        <p type="p">101~102:溫度計</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1695" publication-number="202618791">
    <tif-files tif-type="multi-tif">
      <tif file="114126091.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G11C16/26</main-classification>
        <further-classification edition="200601120260121B">G06F11/10</further-classification>
        <further-classification edition="200601120260121B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜奎彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, KYU-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐寧焄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOUNGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪昌植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, CHANGSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尙玧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴榮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹炫喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HYUN-CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施例記憶體裝置包括位元線感測放大器、與位元線感測放大器連接的全域位元線、分別與電性連接周邊電路結構和胞元陣列結構的接合墊連接的中間位元線、與中間位元線中的每一個連接的區域位元線、與區域位元線中的每一個連接的記憶胞、以及在讀取操作或寫入操作的期間基於從記憶體控制器接收的位址選擇性地連接中間位元線的部分與全域位元線的位元線選擇電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example memory device includes a bitline sense amplifier, a global bitline connected with the bitline sense amplifier, intermediate bitlines respectively connected with bonding pads electrically connecting a peripheral circuit structure and a cell array structure, local bitlines connected with each of the intermediate bitlines, memory cells connected with each of the local bitlines, and a bitline selection circuit selectively connecting a portion of the intermediate bitlines with the global bitline based on an address received from a memory controller during a read or write operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">RA:列位址</p>
        <p type="p">MBL11、MBL12、MBL1x:中間位元線</p>
        <p type="p">LBL11、LBL12、LBL13、LBL14、LBL1(2x)、LBL1(2x-1):區域位元線</p>
        <p type="p">GBL1:全域位元線</p>
        <p type="p">1101:CS</p>
        <p type="p">1102:PS</p>
        <p type="p">SCA1:子胞元陣列</p>
        <p type="p">SL11、SL12、SL1x:選擇線</p>
        <p type="p">1132:BL MUX</p>
        <p type="p">PD11、PD12、PD1x:接合墊</p>
        <p type="p">1131、ST11、ST12、ST1x:選擇電晶體</p>
        <p type="p">1141:BLSA1</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1696" publication-number="202618969">
    <tif-files tif-type="multi-tif">
      <tif file="114126092.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及異常偵測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/67</main-classification>
        <further-classification edition="200601120260127B">G01M3/38</further-classification>
        <further-classification edition="200601120260127B">G01N21/47</further-classification>
        <further-classification edition="200601120260127B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李水根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUGUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂﨑哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAZAKI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係可高精確度地偵測有關漏液之異常。  &lt;br/&gt;本發明之基板處理裝置具備：腔室、噴嘴、測定部、流路開閉部、控制部。腔室可收容基板。噴嘴設置於腔室內，朝基板供給處理液。測定部將光投射至基板，而測定從基板之反射光的強度。流路開閉部進行將處理液供給予噴嘴之供給流路的開閉。控制部對流路開閉部輸出使開啟供給流路之開動作進行的開信號及使關閉供給流路之閉動作進行的閉信號。控制部依據於閉信號輸出後，以測定部測定之反射光的強度，偵測有關處理液從噴嘴洩漏之異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟</p>
        <p type="p">S102:步驟</p>
        <p type="p">S103:步驟</p>
        <p type="p">S104:步驟</p>
        <p type="p">S105:步驟</p>
        <p type="p">S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1697" publication-number="202618850">
    <tif-files tif-type="multi-tif">
      <tif file="114126119.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126119</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶電粒子工具、校正方法、檢測方法</chinese-title>
        <english-title>CHARGED PARTICLE TOOL, CALIBRATION METHOD, INSPECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H01J37/28</main-classification>
        <further-classification edition="201801120260116B">G01N23/225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史羅特　歐文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SLOT, ERWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬格努斯　艾爾伯圖斯　維克　傑拉杜斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGNUS, ALBERTUS VICTOR GERARDUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯哥圖奇　瑪麗克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOTUZZI, MARIJKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史莫克曼　厄文　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMAKMAN, ERWIN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種帶電粒子工具，該帶電粒子工具經組態以自一帶電粒子束產生複數個子射束並且將下游之該等子射束引導朝向一樣本位置，該工具帶電粒子工具包含：至少三個帶電粒子光學組件；一偵測器模組；及一控制器。該偵測器模組經組態以回應於自該樣本位置之方向之上游傳播的帶電粒子而產生一偵測信號。該控制器經組態以在一校正模式下操作該工具。該等帶電粒子光學組件包括：一帶電粒子源，其經組態以發射一帶電粒子束；及一射束產生器，其經組態以產生該等子射束。該偵測信號含有關於該等帶電粒子光學組件中之至少兩者的對準的資訊。該等帶電粒子光學組件包含兩個或多於兩個帶電粒子光學元件，該兩個或多於兩個帶電粒子光學元件包含可監測該等帶電粒子之一孔徑陣列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charged-particle tool configured to generate a plurality of sub-beams from a beam of charged particles and direct the sub-beams downbeam toward a sample position, the tool charged-particle tool comprising at least three charged-particle-optical components; a detector module; and a controller. Thea detector module is configured to generate a detection signal in response to charged particles that propagate upbeam from the direction of the sample position. The controller is configured to operate the tool in a calibration mode. The charged-particle-optical components include: a charged-particle source configured to emit a beam of charged particles and a beam generator configured to generate the sub-beams. The detection signal contains information about alignment of at least two of the charged-particle-optical components. The charged-particle optical components comprise two or more charged-particle optical elements comprising an array of apertures for which the charged particles may be monitored.</p>
      </isu-abst>
      <representative-img>
        <p type="p">405:捕獲電極</p>
        <p type="p">406:射束孔徑</p>
        <p type="p">d&lt;sub&gt;mirror&lt;/sub&gt;:距離</p>
        <p type="p">e:電子</p>
        <p type="p">E:電場</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1698" publication-number="202618970">
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      <tif file="114126125.zip" no="1">
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          <doc-number>202618970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於混合接合的大氣電漿活化</chinese-title>
        <english-title>ATMOSPHERIC PLASMA ACTIVATION FOR HYBRID BONDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/67</main-classification>
        <further-classification edition="200601120260127B">H01L21/677</further-classification>
        <further-classification edition="200601120260127B">H01L21/683</further-classification>
        <further-classification edition="200601120260127B">H01L21/302</further-classification>
        <further-classification edition="200601120260127B">H05H1/24</further-classification>
        <further-classification edition="200601320260127B">B23K101/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉克里希南　卡蒂克納拉亞南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALAKRISHNAN, KARTHIK NARAYANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱普迪　亞南斯克里許納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUPUDI, ANANTHKRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅塔　高拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEHTA, GAURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　海文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書提供了多腔室處理工具的實施例。在某些實施例中，多腔室處理工具包括：設備前端模組（EFEM），其具有一或多個裝載埠以用於接收一或多種類型的基板；相互耦合的複數個大氣模組主機，其中第一大氣模組主機與EFEM耦合，並且複數個大氣模組主機中每一個都包括轉移腔室和一或多個與轉移腔室耦合的處理腔室，其中複數個大氣模組主機中至少一者包括接合器腔室，且其中轉移腔室包括緩衝區，該緩衝區內有複數個架子以用於支撐一或多種類型的基板，並且包括轉移機器人；以及大氣電漿活化模組，該模組設置在轉移腔室或一或多個處理腔室中之一者中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of multi-chamber processing tools are provided herein. In some embodiments, a multi-chamber processing tool includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; a plurality of atmospheric modular mainframes coupled to each other and having a first atmospheric modular mainframe coupled to the EFEM, wherein each of the plurality of atmospheric modular mainframes include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein at least one of the plurality of atmospheric modular mainframes includes a bonder chamber, wherein the transfer chamber includes a buffer having a plurality of shelves for supporting the one or more types of substrates and includes a transfer robot; and an atmospheric plasma activation module disposed in the transfer chamber or one of the one or more process chambers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:基板</p>
        <p type="p">116:轉移腔室</p>
        <p type="p">120:緩衝區</p>
        <p type="p">126:轉移機器人</p>
        <p type="p">310:框架</p>
        <p type="p">312:頂板</p>
        <p type="p">316:通道開口</p>
        <p type="p">320:伸縮臂</p>
        <p type="p">322:架子</p>
        <p type="p">330:端效器</p>
        <p type="p">340:平台</p>
        <p type="p">350:電漿模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1699" publication-number="202617015">
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          <doc-number>202617015</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>容納單元、煮豆裝置及煮豆製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A47J27/12</main-classification>
        <further-classification edition="200601120260131B">A47J27/10</further-classification>
        <further-classification edition="200601120260131B">A47J27/14</further-classification>
        <further-classification edition="200601120260131B">A47J36/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商九冷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUREI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>網內亞貴子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMIUCHI, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>開禮菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAKI, REINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻原繪里子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGIHARA, ERIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種有利於一邊抑制滋味減少一邊烹煮豆類的技術。&lt;br/&gt;  [解決手段]一種容納單元，係用於配置在可儲留煮液之鍋的內側，該容納單元具備劃分容納空間之頂部、側壁部及底部；該容納空間係供容納藉由煮液所烹煮的豆類；側壁部及底部中的至少任一者具有連通容納空間外側與容納空間的開口，且在側壁部及底部的整體中，開口率為3.0%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:煮豆裝置</p>
        <p type="p">15:支持具</p>
        <p type="p">20:鍋</p>
        <p type="p">22:中心軸體</p>
        <p type="p">30:容納容器</p>
        <p type="p">35:開口</p>
        <p type="p">C:中心軸線</p>
        <p type="p">S1:內側空間</p>
        <p type="p">S2:容納空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1700" publication-number="202617141">
    <tif-files tif-type="multi-tif">
      <tif file="114126133.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含氘化N,N-二甲基色胺之醫藥組合物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITIONS COMPRISING DEUTERATED N,N-DIMETHYLTRYPTAMINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/4045</main-classification>
        <further-classification edition="200601120260202B">A61P25/00</further-classification>
        <further-classification edition="200601120260202B">A61P25/22</further-classification>
        <further-classification edition="200601120260202B">A61P25/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商賽本英國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYBIN UK LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹姆士　伊蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAMES, ELLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古德　梅根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOD, MEGHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬爾　澤拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOEL, ZELAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞特利奇　卡羅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUTLEDGE, CAROL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷扎爾　馬莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAYZELL, MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含氘化&lt;i&gt;N,N&lt;/i&gt;-二甲基色胺或其醫藥上可接受之鹽之醫藥組合物、其用途及使用該等組合物之治療方法。此等組合物包含有效劑量之氘化&lt;i&gt;N,N&lt;/i&gt;-二甲基色胺以引發致幻體驗，且在治療精神或神經病症方面及在致幻輔助心理療法方面具有潛在用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Pharmaceutical compositions comprising deuterated &lt;i&gt;N,N&lt;/i&gt;-dimethyltryptamine, or a pharmaceutically acceptable salt thereof, uses thereof, and methods of treatment using the compositions. These compositions comprise an effective dose of deuterated &lt;i&gt;N,N&lt;/i&gt;-dimethyltryptamine to elicit a psychedelic experience, and have potential uses in the treatment of psychiatric or neurological disorders, and in psychedelic-assisted psychotherapy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1701" publication-number="202618997">
    <tif-files tif-type="multi-tif">
      <tif file="114126139.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>映射系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/677</main-classification>
        <further-classification edition="200601120260127B">B65G49/07</further-classification>
        <further-classification edition="200601120260127B">G01N21/89</further-classification>
        <further-classification edition="200601120260127B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＤＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TDK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小番達裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTSUGAI, TATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部知史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TOMOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤紘大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即使在半導體工廠內收納不同的對象物的容器混合存在並被輸送那樣的狀態下，也能夠正確地檢測收納於容器的對象物的收納狀態的映射系統。映射系統具有：基板資訊獲取部，獲取基板資訊，此基板資訊是收納於作為以在工廠內輸送中或能夠輸送的狀態設置的容器的任意一個的規定容器中的基板的資訊；映射閾值確定部，使用上述基板資訊，確定在上述規定容器的映射時使用的映射閾值；以及映射部，使用上述映射閾值對上述規定容器進行映射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:映射系統</p>
        <p type="p">12:主機電腦</p>
        <p type="p">14:製程裝置控制部</p>
        <p type="p">16:容器輸送系統</p>
        <p type="p">20:基板資訊獲取部</p>
        <p type="p">22:基板資訊</p>
        <p type="p">30:映射閾值確定部</p>
        <p type="p">42:固有符號獲取部</p>
        <p type="p">44:基板資訊儲存部</p>
        <p type="p">48:資訊讀出部</p>
        <p type="p">50:裝載埠裝置</p>
        <p type="p">60:映射部</p>
        <p type="p">82:規定容器</p>
        <p type="p">83:前開式晶圓傳送盒編號(固有符號)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1702" publication-number="202617106">
    <tif-files tif-type="multi-tif">
      <tif file="114126140.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126140</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>牙科用塗覆系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61C17/00</main-classification>
        <further-classification edition="200601120260131B">A61C19/06</further-classification>
        <further-classification edition="200601120260131B">A61C8/00</further-classification>
        <further-classification edition="201701120260131B">A61C5/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木計芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木計芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了提供可將成為齲齒的起點之存在於牙冠部的裂縫更確實地封填之系統。  &lt;br/&gt;　　對有微裂縫(T0)存在的牙齒(T)噴射含有鑽石粉末的塗覆粉末(Q)。藉此，使複數個塗覆粉末(Q)填充於微裂縫(T0)，且以附著於牙齒(T)的表面之基底層為起點進行堆積。然後，在牙齒(T)的表面塗佈黏著劑(R)，以將堆積在該牙齒(T)的表面上之塗覆粉末(Q)固結的方式使該黏著劑(R)進行硬化，藉此形成牙齒(T)的塗覆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主體部</p>
        <p type="p">11:握持部</p>
        <p type="p">12:扳機部</p>
        <p type="p">20:黏著劑供應部</p>
        <p type="p">21:粉體供應源(第1粉體供應源)</p>
        <p type="p">200:控制裝置</p>
        <p type="p">201:黏著劑路徑</p>
        <p type="p">202:黏著劑噴嘴</p>
        <p type="p">211:粉體路徑(第1粉體路徑)</p>
        <p type="p">212:粉體噴嘴(第1粉體噴嘴)</p>
        <p type="p">H:手</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1703" publication-number="202618799">
    <tif-files tif-type="multi-tif">
      <tif file="114126159.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126159</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於隱形眼鏡適配之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR CONTACT LENS FITTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260127B">G16H10/20</main-classification>
        <further-classification edition="201201120260127B">G06Q50/10</further-classification>
        <further-classification edition="202001120260127B">G06F30/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商壯生和壯生視覺關懷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李詠玩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNG WAN (CHRIS)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金松姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SONG HEE A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁裕集</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU JIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於適配一隱形眼鏡之方法可包括：從第一使用者裝置及在與一隱形眼鏡提供者相關聯的一運算裝置處接收對於一問卷的一回應；從一第二使用者裝置接收與一隱形眼鏡配戴者相關聯的臨床資料；將輸入提供至一AI經訓練模型（機器學習模型），其中該輸入可包括對於該問卷的該等回應及該臨床資料，且其中該經訓練模型係經訓練以接收對於該問卷的一輸入回應及輸入臨床資料，並推斷出一隱形眼鏡建議；基於對於該問卷的該等回應及該臨床資料，從該經訓練模型接收與該隱形眼鏡配戴者相關聯的一隱形眼鏡建議；及將該隱形眼鏡建議的一指示傳輸至該第一使用者裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for fitting a contact lens may include: receiving, from a first user device and at a computing device associated with a contact provider, a response to a questionnaire; receiving, from a second user device, clinical data associated with a contact lens wearer; providing input to a AI trained model (Machine Learning Model), where the input may include the responses to the questionnaire and the clinical data, and where the trained model is trained to receive an input response to the questionnaire and input clinical data and infer a contact lens recommendation; receiving, from the trained model, a contact lens recommendation associated with the contact lens wearer based on the responses to the questionnaire and the clinical data; and transmitting, to the first user device, an indication of the contact lens recommendation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:消費者使用者裝置</p>
        <p type="p">120:隱形眼鏡提供者伺服器</p>
        <p type="p">130:護眼提供者使用者裝置</p>
        <p type="p">140:經訓練模型</p>
        <p type="p">150:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1704" publication-number="202619016">
    <tif-files tif-type="multi-tif">
      <tif file="114126183.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在視覺檢驗期間固持電子構件的載體、視覺檢驗裝置及檢驗方法</chinese-title>
        <english-title>CARRIER FOR HOLDING ELECTRONIC COMPONENTS DURING VISUAL INSPECTION, VISUAL INSPECTION DEVICE AND INSPECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/683</main-classification>
        <further-classification edition="200601120260122B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷商貝西荷蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESI NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫曼斯　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMANS, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧迪什　桑德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUDISH, SANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種用於在視覺檢驗期間固持電子構件的載體，其包括：基座結構，基座結構固持吸盤，吸盤具有抓取外端，用於抓取及固持電子構件，該等吸盤在其相對的基座外端上被附接至基座結構。亦設置有背景結構，其至少部分地覆蓋吸盤之側邊。本發明亦有關一種包括此種載體以及朝向載體的光學攝影機的視覺檢驗裝置，以及一種用於電子構件之視覺檢驗的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a carrier for holding electronic components during visual inspection, comprising: a base structure holding suction cups with gripping outer ends for gripping and holding electronic components, which suction cups are attached to the base structure on their opposite base outer ends. Also is provided a background structure at least partially covering the sides of the suction cups. The invention also relates to a visual inspection device comprising such a carrier and an optical camera directed towards the carrier as well as a method for visual inspection of electronic components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:載體</p>
        <p type="p">13:吸盤</p>
        <p type="p">14:基座結構</p>
        <p type="p">15:接觸表面</p>
        <p type="p">16:突起</p>
        <p type="p">17:抓取外端</p>
        <p type="p">18:基座外端</p>
        <p type="p">19:通道</p>
        <p type="p">20:背景結構</p>
        <p type="p">21:可見表面</p>
        <p type="p">22:開口</p>
        <p type="p">23:耦接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1705" publication-number="202618971">
    <tif-files tif-type="multi-tif">
      <tif file="114126184.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126184</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於衝壓電子構件的裝置、系統及方法</chinese-title>
        <english-title>DEVICE, SYSTEM AND METHOD FOR PUNCHING ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/67</main-classification>
        <further-classification edition="200601120260127B">B30B15/26</further-classification>
        <further-classification edition="200601120260127B">B21D37/04</further-classification>
        <further-classification edition="200601120260127B">G05B19/404</further-classification>
        <further-classification edition="200601120260127B">B21D28/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷商貝西荷蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESI NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒爾那克　羅伯圖　克利司汀拿　約翰尼斯　瑪麗亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOENAKER, ROBERTUS CHRISTINA JOHANNES MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茲維爾斯　約翰內斯　格哈德斯　奧古斯蒂努斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZWEERS, JOHANNES GERHARDUS AUGUSTINUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種用於衝壓被包含在帶有電子構件之一載體中的電子構件的裝置，其包括：兩個可相對位移的壓機部件，其各自承載一衝壓工具部件；一衝壓工具，其帶有兩個協作的衝壓工具部件，其中該至少兩個協作的衝壓工具部件中之至少一者包括一衝頭工具部件，且其中該至少兩個協作的衝壓工具部件中之另一者包括用於支撐及固持該電子構件的一模具工具部件，從而該等壓機部件中之每一者；以及用於一衝壓工具部件的一位置（高度）調整機構。本發明亦有關一種用於線內衝壓電子構件的系統以及一種用於衝壓電子構件的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a device for punching electronic components included in a carrier with electronic components, comprising two relative displaceable press parts each carrying a punching tool part; a punching tool with two co-operating punching tool parts, wherein at least one of the at least two co-operating punching tool parts comprises a punch tool part, and wherein another of the at least two co-operating punching tool parts comprises a die tool part for supporting and holding the electronic component, whereby each of the press parts; and a position (height) adjustment for a punching tool part. The invention also relates to a system for in-line punching electronic components and to a method for punching electronic components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:衝壓裝置</p>
        <p type="p">11:連接件</p>
        <p type="p">12:電子構件</p>
        <p type="p">13:上壓機部件</p>
        <p type="p">14:下壓機部件</p>
        <p type="p">15:衝壓工具部件</p>
        <p type="p">16:衝壓工具部件</p>
        <p type="p">17:位置(高度)調整機構</p>
        <p type="p">18:輪</p>
        <p type="p">P&lt;sub&gt;3&lt;/sub&gt;:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1706" publication-number="202617348">
    <tif-files tif-type="multi-tif">
      <tif file="114126198.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126198</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於研磨半導體晶圓之研磨頭組件</chinese-title>
        <english-title>POLISHING HEAD ASSEMBLIES FOR POLISHING SEMICONDUCTOR WAFERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260123B">B24B37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉恩　泰波斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, TAPAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴哈格維特　桑米特　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHAGAVAT, SUMEET S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞伯查特　彼得　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBRECHT, PETER D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於矽晶圓之單面研磨之研磨頭組件。該等研磨頭組件可包含一模板及/或安置於該模板與該研磨頭組件之頂蓋之底板之間的一模板支撐件，在該模板之邊緣處具有一階部。某些研磨頭組件可包含具有一較薄底板之一頂蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Polishing head assemblies for single side polishing of silicon wafers. The polishing head assemblies may include a template having a step at the edge of the template and/or a template support disposed between the template and the floor of the cap of the polishing head assembly. Some polishing head assemblies may include a cap having a thinner floor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:研磨頭組件</p>
        <p type="p">302:腔室</p>
        <p type="p">310:研磨頭</p>
        <p type="p">318:模板</p>
        <p type="p">340:頂蓋</p>
        <p type="p">342:底板</p>
        <p type="p">360:階部</p>
        <p type="p">366:底板凹部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1707" publication-number="202617777">
    <tif-files tif-type="multi-tif">
      <tif file="114126218.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗αVβ6抗體及抗體-藥物結合物</chinese-title>
        <english-title>ANTI-ΑVΒ6 ANTIBODIES AND ANTIBODY-DRUG CONJUGATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C07K16/28</main-classification>
        <further-classification edition="200601120260116B">C07K16/30</further-classification>
        <further-classification edition="200601120260116B">A61K39/395</further-classification>
        <further-classification edition="200601120260116B">A61P35/00</further-classification>
        <further-classification edition="201701120260116B">A61K47/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西健公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEAGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊恩　穆林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYAN, MAUREEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維思登朵芙　蘿莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTENDORF, LORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁耶　埃里克　布拉德利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYER, ERIC BRADLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯特納　希瑟　簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSTNER, HEATHER JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供新穎抗αvβ6抗體及抗體-藥物結合物以及使用此類抗αvβ6抗體及抗體-藥物結合物治療癌症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are novel anti-αvβ6 antibodies and antibody-drug conjugates and methods of using such anti-αvβ6 antibodies and antibody-drug conjugates to treat cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1708" publication-number="202616969">
    <tif-files tif-type="multi-tif">
      <tif file="114126219.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於促進冷卻的紡織品</chinese-title>
        <english-title>TEXTILE CONFIGURED TO PROMOTE COOLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260123B">A41D31/04</main-classification>
        <further-classification edition="200601120260123B">A41D27/28</further-classification>
        <further-classification edition="200601120260123B">A41D27/10</further-classification>
        <further-classification edition="200601120260123B">D04B21/20</further-classification>
        <further-classification edition="200601120260123B">D04B21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商耐克創新有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKE INNOVATE C.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪金森　凱倫　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAWKINSON, KAREN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩根　丹尼爾　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORGAN, DANIEL P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文各方面涉及一種紡織品，該紡織品包括由第一多根紗線或纖維形成的第一層。該第一層包括第一組孔口，每個孔口具有第一開口大小。該紡織品還包括由第二多根紗線或纖維形成的第二層。該第二層包括第二組孔口。該第二組孔口中的每個孔口與第一組孔口中的對應孔口軸向對準。第二組孔口中的每個孔口具有第二開口大小，該第二開口大小小於第一組孔口中的孔口的第一開口大小。第一層比第二層相對更親水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects herein are directed to textile that includes a first layer formed from a first plurality of yarns or fibers. The first layer includes a first set of apertures, each aperture having a first opening size. The textile further includes a second layer formed from a second plurality of yarns or fibers. The second layer includes a second set of apertures. Each aperture in the second set of apertures is axially aligned with a corresponding aperture in the first set of apertures. Each aperture in the second set of apertures has a second opening size that is smaller than the first opening size of apertures in the first set of apertures. The first layer is relatively more hydrophilic than the second layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1200:上身服裝</p>
        <p type="p">1202:軀幹部分</p>
        <p type="p">1204:左臂部分</p>
        <p type="p">1206:右臂部分</p>
        <p type="p">1208:第一組應力減小分</p>
        <p type="p">1210:中心線</p>
        <p type="p">1212:周邊</p>
        <p type="p">1214:最近側點</p>
        <p type="p">1216:最遠側點</p>
        <p type="p">1218:第二組應力減小分區</p>
        <p type="p">1220:腋下區</p>
        <p type="p">1222:左接縫</p>
        <p type="p">1224:右接縫</p>
        <p type="p">1226:周邊</p>
        <p type="p">1228:未附接邊緣</p>
        <p type="p">1230:未附接邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1709" publication-number="202617733">
    <tif-files tif-type="multi-tif">
      <tif file="114126237.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三負載抗體藥物結合物（ＡＤＣ）</chinese-title>
        <english-title>TRIPLE-PAYLOAD ANTIBODY-DRUG CONJUGATES (ADCS)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D491/22</main-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商阿拉里斯生物技術股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARARIS BIOTECH AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯特蘭　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERTRAND, ROMAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾汀格　托勒　伊莎貝拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATTINGER-TOLLER, ISABELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普羅伯斯特　菲力浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROBST, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛　瑞秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAY, RACHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡藍伯格　麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALLENBERGER, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉布洛斯斯基　德瑞岡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRABULOVSKI, DRAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史皮卻　菲力浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPYCHER, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種抗體藥物結合物(ADC)，其具有式A-L，其中A為抗體或抗體片段，且其中L為連接子，該連接子包含：作為第一負載的細胞可滲透的拓樸異構酶I抑制劑，較佳為細胞可滲透的喜樹鹼(camptothecin)細胞毒性分子；作為第二負載的非細胞可滲透的拓樸異構酶I抑制劑，較佳為非細胞可滲透的喜樹鹼細胞毒性分子；及作為第三負載的毒素或細胞毒素，更佳為奧瑞他汀(auristatin)，且甚至更佳為單甲基奧瑞他汀E (Monomethyl auristatin E；MMAE)。此外，描述一種醫藥組合物，其包含該ADC及至少一種醫藥學上可接受之成分。此外，描述一種ADC，其係用於治療罹患贅生性疾病、處於罹患贅生性疾病之風險下及/或經診斷患有贅生性疾病之患者的方法中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described is an antibody-drug conjugate (ADC) having the formula A-L, wherein A is an antibody or an antibody fragment and wherein L is a linker, said linker comprising: as a first payload a topoisomerase I inhibitor which is cell-permeable, preferably a camptothecin cytotoxic molecule which is cell-permeable; as a second payload a topoisomerase I inhibitor which is not cell-permeable, preferably a camptothecin cytotoxic molecule which is not cell-permeable; and as a as a third payload a toxin or a cytotoxin, more preferably an auristatin, and even more preferably MMAE (Monomethyl auristatin E). Moreover, described is a pharmaceutical composition comprising said ADC and at least one pharmaceutically acceptable ingredient. Further, described is an ADC for use in a method of treating a patient suffering from, being at risk of developing, and/or being diagnosed for a neoplastic disease.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1710" publication-number="202617154">
    <tif-files tif-type="multi-tif">
      <tif file="114126238.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療類風濕性關節炎之ＭＮＫ抑制劑</chinese-title>
        <english-title>MNK INHIBITORS FOR TREATING RHEUMATOID ARTHRITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/506</main-classification>
        <further-classification edition="200601120260202B">A61K31/5377</further-classification>
        <further-classification edition="200601120260202B">A61K31/501</further-classification>
        <further-classification edition="200601120260202B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商4Ｅ治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>4E THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩福爾斯　喬漢　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERNFORS, JOHAN PATRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供治療類風濕性關節炎之方法，其包含投與MNK抑制劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods of treating rheumatoid arthritis comprising administering a MNK inhibitor.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1711" publication-number="202619027">
    <tif-files tif-type="multi-tif">
      <tif file="114126242.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用清潔及蝕刻操作處理絕緣體上半導體結構之方法</chinese-title>
        <english-title>METHODS OF PROCESSING SEMICONDUCTOR-ON-INSULATOR STRUCTURES USING CLEAN-AND-ETCH OPERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/762</main-classification>
        <further-classification edition="200601120260126B">H01L21/306</further-classification>
        <further-classification edition="200601120260126B">H01L21/304</further-classification>
        <further-classification edition="200601120260126B">H01L21/02</further-classification>
        <further-classification edition="200601120260126B">B08B3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　慶旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, QINGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>厄克　亨利　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERK, HENRY F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　海河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, HAIHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯特　傑佛瑞　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIBBERT, JEFFREY L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　嘯飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, XIAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅托斯　查爾斯　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOTTES, CHARLES R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種自一經接合結構製備一絕緣體上半導體結構之方法，該經接合結構包含：一處置基板；一供體基板，其包含一分裂平面；及一介電層，其定位於該處置基板與該供體基板之間，該方法包含在該分裂平面處分裂該經接合結構以形成包含該處置基板、該介電層及一裝置層之一經分裂結構。該單晶半導體裝置層在與該介電層相對之一曝露表面處界定一受損區。該受損區包含單晶半導體材料且自該曝露表面延伸一厚度。該方法亦包含使用一清潔及蝕刻操作自該經分裂結構移除該受損區，該清潔及蝕刻操作包含在足以移除該受損區之一溫度下及一持續時間內使該裝置層之該曝露表面與一鹼性溶液接觸，且在移除該受損區之情況下平滑化該裝置層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of preparing a semiconductor-on-insulator structure from a bonded structure including a handle substrate, a donor substrate including a cleave plane, and a dielectric layer positioned between the handle substrate and the donor substrate, the method includes cleaving the bonded structure at the cleave plane to form a cleaved structure including the handle substrate, the dielectric layer, and a device layer. The single crystal semiconductor device layer defines a damaged region at an exposed surface opposite the dielectric layer. The damaged region includes single crystal semiconductor material and extends a thickness from the exposed surface. The method also includes removing the damaged region from the cleaved structure using a clean-and-etch operation that includes contacting the exposed surface of the device layer with an alkaline solution at a temperature and for a duration sufficient to remove the damaged region and smoothing the device layer with the damaged region removed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多層結構/絕緣體上半導體結構</p>
        <p type="p">102:單晶半導體處置基板</p>
        <p type="p">104:中間層</p>
        <p type="p">106:電荷捕獲層</p>
        <p type="p">108:介電層/絕緣或絕緣體層</p>
        <p type="p">110:裝置層</p>
        <p type="p">112:曝露或外表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1712" publication-number="202619590">
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      <tif file="114126244.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619590</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型LED結構和微型顯示面板</chinese-title>
        <english-title>MICRO LED STRUCTURE AND MICRO DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260116B">H10H20/00</main-classification>
        <further-classification edition="202501120260116B">H10H20/816</further-classification>
        <further-classification edition="202501120260116B">H10H29/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝元坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YUANKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方安樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, ANLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉德帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DESHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種微型發光二極管(LED)結構，包括台面結構。所述台面結構進一步包括具有第一導電類型的第一類型半導體層、形成在所述第一半導體層上的發光層、和形成在所述發光層上的第二類型半導體層，所述第二類型半導體層具有不同於所述第一導電類型的第二導電類型。所述第一類型半導體層進一步包括第一類型半導體區和圍繞所述第一類型半導體區形成的離子注入區，所述離子注入區的電阻比所述半導體區的電阻高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro light emitting diode (LED) structure, includes a mesa structure. The mesa structure further includes a first type semiconductor layer having a first conductive type, a light emitting layer formed on the first semiconductor layer, a second type semiconductor layer formed on the light emitting layer, the second type semiconductor layer having a second conductive type different from the first conductive type. The first type semiconductor layer further includes a first type semiconductor region and an ion implantation region formed around the first type semiconductor region , the ion implantation region having a resistance higher than a resistance of the semiconductor region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">01:台面結構</p>
        <p type="p">02:頂部觸頭</p>
        <p type="p">03:底部觸頭</p>
        <p type="p">04:頂部導體層</p>
        <p type="p">101:第一類型半導體層</p>
        <p type="p">102:發光層</p>
        <p type="p">103:第二類型半導體層</p>
        <p type="p">104:元件</p>
        <p type="p">105:元件</p>
        <p type="p">1011:反射鏡</p>
        <p type="p">1012:第一類型半導體區</p>
        <p type="p">1013:離子注入區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1713" publication-number="202617750">
    <tif-files tif-type="multi-tif">
      <tif file="114126247.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617750</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126247</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含表位與多肽的組成物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS COMPRISING EPITOPES AND POLYPEPTIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K14/00</main-classification>
        <further-classification edition="200601120260202B">C07K16/18</further-classification>
        <further-classification edition="200601120260202B">C07K16/28</further-classification>
        <further-classification edition="200601120260202B">C07K14/705</further-classification>
        <further-classification edition="200601120260202B">G01N33/53</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安吉利斯治療學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGELES THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查德哈利　普立特　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUDHARY, PREET M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供新型肽表位標記物及包含該標記物之重組多核苷酸、多肽、載體、細胞與組成物。本申請亦提供合成抗原受體（SAR）之新型設計、新型抗原結合域、新型SAR構建體及新型細胞治療產品製造方法。此類新型方法與組成物於細胞治療領域具廣泛應用價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application provides novel peptide epitope tags and recombinant polynucleotide, polypeptides, vectors, cells and compositions comprising the tags. The application also provides novel designs for synthetic antigen receptors (SARs), novel antigen binding domains, novel SAR constructs and novel methods for manufacturing of cell therapy products. These novel methods and compositions have broad uses in cellular therapy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1714" publication-number="202617763">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>114126250</doc-number>
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      <invention-title>
        <chinese-title>抗N3pGlu澱粉樣蛋白β抗體及其用途</chinese-title>
        <english-title>ANTI-N3PGLU AMYLOID BETA PROTEIN ANTIBODIES AND USES THEREOF</english-title>
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      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/18</main-classification>
        <further-classification edition="200601120260202B">A61K39/395</further-classification>
        <further-classification edition="200601120260202B">A61P25/28</further-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大陸商齊魯製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QILU PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>李啟育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WENJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李道遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DAOYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂文昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, WENHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安振明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, ZHENMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫麗霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, LIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王桂江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUIJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卜令麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BU, LINGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>季琳雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, LINYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及抗N3pGlu澱粉樣蛋白β抗體及其用途，以及包含該抗N3pGlu澱粉樣蛋白β抗體的藥物組合物。該抗N3pGlu澱粉樣蛋白β抗體具有顯著優異的親和力、穩定性和特異性。另外，本公開還提供了抗N3pGlu澱粉樣蛋白β抗體用於治療β澱粉樣蛋白引起的疾病（例如，阿爾茨海默病、唐氏綜合症或腦澱粉樣血管病等）的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to anti-N3pGlu amyloid beta protein antibodies and uses thereof, as well as pharmaceutical compositions containing the anti-N3pGlu amyloid beta protein antibodies. The anti-N3pGlu amyloid beta protein antibodies exhibit significantly superior affinity, stability, and specificity. Furthermore, the present disclosure provides the uses of the anti-N3pGlu amyloid beta protein antibodies for treating diseases caused by the amyloid beta protein (e.g., Alzheimer's disease, Down syndrome, or cerebral amyloid angiopathy).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1715" publication-number="202619017">
    <tif-files tif-type="multi-tif">
      <tif file="114126255.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合零件及半導體製造裝置用構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/683</main-classification>
        <further-classification edition="200601120260127B">H01L21/3065</further-classification>
        <further-classification edition="201601120260127B">C23C4/134</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>要藤拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOTO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小木曽裕佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGISO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">冷卻板30係在略圓板狀的導電性板40設置絕緣噴塗膜50。絕緣噴塗膜50具備平面被覆部51a、52、53、54、外角彎曲面被覆部55、57及內角彎曲面被覆部56。就此等被覆部51a、52、53、54、55、56、57而言，氣孔率皆為8.0%以下，氣孔徑為5.0μm以上的最接近氣孔間的平均距離皆為4.0μm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓載置台</p>
        <p type="p">20:陶瓷板</p>
        <p type="p">21:晶圓載置面</p>
        <p type="p">22:電極</p>
        <p type="p">30:冷卻板</p>
        <p type="p">32:冷媒流路</p>
        <p type="p">40:導電性板</p>
        <p type="p">41:圓形上表面</p>
        <p type="p">41a:外周部</p>
        <p type="p">42:上部周壁面</p>
        <p type="p">43:環狀面</p>
        <p type="p">44:下部周壁面</p>
        <p type="p">45:上部外角彎曲面</p>
        <p type="p">46:內角彎曲面</p>
        <p type="p">47:下部外角彎曲面</p>
        <p type="p">50:絕緣噴塗膜</p>
        <p type="p">51a:圓形上表面被覆部</p>
        <p type="p">52:上部周壁面被覆部</p>
        <p type="p">53:環狀面被覆部</p>
        <p type="p">54:下部周壁面被覆部</p>
        <p type="p">55:上部外角彎曲面被覆部</p>
        <p type="p">56:內角彎曲面被覆部</p>
        <p type="p">57:下部外角彎曲面被覆部</p>
        <p type="p">60:接合層</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1716" publication-number="202618814">
    <tif-files tif-type="multi-tif">
      <tif file="114126258.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵(Fe)系扁平金屬粉及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01F1/24</main-classification>
        <further-classification edition="202201120260127B">B22F1/068</further-classification>
        <further-classification edition="202201120260127B">B22F1/16</further-classification>
        <further-classification edition="200601120260127B">B22F9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬礦山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>行延雅也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKINOBU, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供：粉體特性及磁特性優異之鐵（Fe）系扁平金屬粉及其製造方法。該鐵（Fe）系扁平金屬粉具有至少包含鐵（Fe）作為磁性金屬之扁平金屬粒子。上述扁平金屬粒子於表面具備包含無機氧化物作為主成分之絕緣塗佈層。上述扁平金屬粉之平均粒徑為0.2 μm以上3 μm以下，平均縱橫比為2以上15以下，且根據下述（1）式所求出之粒徑CV值（變異係數）為25%以下。  &lt;br/&gt;粒徑CV值（%）＝粒徑之標準偏差/平均粒徑×100                （1）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1717" publication-number="202617724">
    <tif-files tif-type="multi-tif">
      <tif file="114126268.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>苯並二氮䓬類化合物、藥物組合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D487/04</main-classification>
        <further-classification edition="200601120260202B">C07D491/147</further-classification>
        <further-classification edition="200601120260202B">C07D519/00</further-classification>
        <further-classification edition="200601120260202B">A61K31/5517</further-classification>
        <further-classification edition="200601120260202B">A61P25/20</further-classification>
        <further-classification edition="200601120260202B">A61P25/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宜昌人福藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YICHANG HUMANWELL PHARMACEUTICAL CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝田鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, TIANPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田巒鳶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, LUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　速波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SUBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲龍妹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QU, LONGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉敏麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MINLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>符義剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, YIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳垚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了苯並二氮䓬類化合物、藥物組合物及其用途。具體提供了一種式I所示化合物、其立體異構體、氘代物或其藥學上可接受的鹽。本發明所提供的化合物具有如下一個或多個優勢效果：（1）本發明的化合物有較好的靜脈鎮靜麻醉效果；（2）本發明的化合物藥物蓄積作用小、耐受性良好；（3）本發明的化合物具有更快速甦醒的麻醉作用。&lt;br/&gt;&lt;img align="absmiddle" height="182px" width="178px" file="ed10772.JPG" alt="ed10772.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1718" publication-number="202617569">
    <tif-files tif-type="multi-tif">
      <tif file="114126270.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於接合至少兩層材料網的設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR SPLICING AT LEAST TWO-LAYER MATERIAL WEBS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">B65H19/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＭＢ自動化有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MB AUTOMATION GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科赫　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOCH, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾福特　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERFURT, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍赫曼　斯溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOCHMANN, SVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾霍夫　約翰內斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARHOFFER, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛查　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOCHAU, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊秀鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於接合兩個材料網之接合設備，其包括：用於連接兩個材料網之一接合站；該接合站上游之兩個間隔網饋送器。該接合站及該等網饋送器可相對於彼此移動，使得該接合站在一第一或第二對準位置中與該兩個網饋送器之一者對準。該接合設備用於：藉由該等網饋送器之一者傳送一材料網通過該接合站直至此材料網即將用盡；藉由一切割設備定長切割此材料網；使該接合站相對於該網饋送器移動，使得該接合站與另一網饋送器對準；透過該網饋送器將另一材料網傳送至該接合站中，使得該另一材料網之一開始定位成接近即將用盡之該材料網之切割端；及自一個材料網之末端及另一材料網之開始之一頂部或底部按壓一第一或第二連接條。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A splicing apparatus for splicing two material webs comprising: a splicing station for connecting two material webs; two spaced web feeders upstream of the splicing station. The splicing station and the web feeders are movable relative to each other so that the splicing station is aligned with one of the two web feeders in a first or second alignment position. The splicing apparatus is used to convey a material web through the splicing station by means of one of the web feeders until this material web is coming to an end; to cut this material web to length by means of a cutting apparatus; to move the splicing station relative to the web feeder so that the splicing station is aligned with the other web feeder; for conveying the other material web through the web feeder into the splicing station so that a beginning of the other material web is located near the cut end of the material web coming to an end; and for pressing a first or second connecting strip from a top or bottom of the end of one and the beginning of the other material web.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1:支撐件</p>
        <p type="p">A2:支撐件</p>
        <p type="p">AA:支撐件驅動器</p>
        <p type="p">AP1:第一對準位置</p>
        <p type="p">BW1:第一網輥</p>
        <p type="p">BW1':第一網輥</p>
        <p type="p">BW2:第二網輥</p>
        <p type="p">BW2':第二網輥</p>
        <p type="p">BW3:第三網輥</p>
        <p type="p">BW3':第三網輥</p>
        <p type="p">BW4:網輥配置</p>
        <p type="p">BW5:網輥配置</p>
        <p type="p">BW6:網輥配置</p>
        <p type="p">BW7:網輥配置</p>
        <p type="p">BZ1:第一網饋送器/第一路徑饋送器</p>
        <p type="p">BZ2:第二網饋送器</p>
        <p type="p">DA1:第一驅動器</p>
        <p type="p">DA1':經控制第二驅動器</p>
        <p type="p">ECU:電子控制單元</p>
        <p type="p">GA1:第一反支撐件</p>
        <p type="p">GA1':第一反支撐件</p>
        <p type="p">K:刀片</p>
        <p type="p">KAY:刀片驅動器</p>
        <p type="p">KAZ:刀片驅動器</p>
        <p type="p">MB1:第一材料網</p>
        <p type="p">MB2:第二材料網</p>
        <p type="p">OS:上壓印器</p>
        <p type="p">p--:真空源</p>
        <p type="p">PAS:位置及/或對準感測器配置</p>
        <p type="p">SA1:第一致動器</p>
        <p type="p">SA2:第二致動器</p>
        <p type="p">SA2':第二致動器</p>
        <p type="p">SA3:第三定位驅動器</p>
        <p type="p">SA3':第三定位驅動器</p>
        <p type="p">SA4:致動器</p>
        <p type="p">SA4':致動器</p>
        <p type="p">SS:接合站</p>
        <p type="p">STA1:第一壓印器驅動器</p>
        <p type="p">SV:切割設備</p>
        <p type="p">TS:溫度感測器</p>
        <p type="p">US:下壓印器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1719" publication-number="202618955">
    <tif-files tif-type="multi-tif">
      <tif file="114126289.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於經改良光信號檢測之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR IMPROVED OPTICAL SIGNAL DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/66</main-classification>
        <further-classification edition="200601120260127B">G01N21/62</further-classification>
        <further-classification edition="200601120260127B">G01J3/26</further-classification>
        <further-classification edition="200601120260127B">G01N21/25</further-classification>
        <further-classification edition="200601120260127B">G05B11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商梅瑞堤儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERITY INSTRUMENTS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫尼　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUENY, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有可用於經改良半導體程序監測之經改良光譜解析度及信雜比之光信號檢測系統。該經改良光譜解析度可與經改良光譜鑑別相關聯，其中個別監測光譜頻寬之窄部分。在一個實例中，提供一種光信號檢測系統，其包含：(1)一光介面，其經組態以接收一光信號；(2)一窄帶通濾光器，其經組態以透射該接收光信號之一部分；(3)一光標準具，其與該窄帶通濾光器串聯，經組態以進一步對該接收光信號進行濾光，其中該帶通濾光器之一通帶與該光標準具之一通帶之組合經組態以為該光信號提供小於1.0 nm之一光頻寬；及(4)一多像素光感測器，其經組態以基本上同時收集該經濾光光信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides an optical signal detection system with improved spectral resolution and signal-to-noise that can be used for improved monitoring of semiconductor processes. The improved spectral resolution may be associated with improved spectral discrimination where narrow portions of spectral bandwidth are individually monitored. In one example, an optical signal detection system is provided that includes:(1) an optical interface configured to receive an optical signal, (2) a narrow bandpass filter configured to transmit a portion of the received optical signal, (3) an optical etalon in series with the narrow bandpass filter, configured to further filter the received optical signal, wherein the combination of a passband of the bandpass filter and a passband of the optical etalon is configured to provide an optical bandwidth of less than 1.0 nm for the optical signal, and (4) a multipixel optical sensor configured to essentially simultaneously collect the filtered optical signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:程序系統</p>
        <p type="p">110:半導體處理工具</p>
        <p type="p">120:晶圓</p>
        <p type="p">130:電漿</p>
        <p type="p">135:處理室</p>
        <p type="p">140:光介面</p>
        <p type="p">141:光介面</p>
        <p type="p">142:光介面</p>
        <p type="p">150:光源</p>
        <p type="p">153:光纖電纜總成</p>
        <p type="p">155:光束</p>
        <p type="p">157:光纖電纜總成</p>
        <p type="p">159:光纖電纜總成</p>
        <p type="p">160:光信號檢測系統</p>
        <p type="p">170:信號處理器</p>
        <p type="p">180:輸出</p>
        <p type="p">185:通訊鏈路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1720" publication-number="202618480">
    <tif-files tif-type="multi-tif">
      <tif file="114126293.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置製造中的動態製程控制</chinese-title>
        <english-title>DYNAMIC PROCESS CONTROL IN ELECTRONIC DEVICE MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G05B19/4155</main-classification>
        <further-classification edition="200601120260121B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇米諾　毛羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIMINO, MAURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>露波默斯基　德米翠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUBOMIRSKY, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括接收針對製程配方的第一製程運行的第一資料集，該第一資料集包括第一製程參數值、第一效能資料和該製程配方的目標效能資料。該方法進一步包括使用動態控制器處理第一資料集，以確定對於至少一個製程參數與第一製程參數值不同的第二製程參數值。該方法進一步包括接收針對該製程配方的第二次製程運行的第二資料集，該第二資料集包括第二製程參數值、第二效能和該製程配方的目標效能資料。該方法進一步包括，回應於確定第二效能資料滿足關於目標效能資料的一或多個標準，將第二製程參數值保存為該製程配方的最終製程參數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes receiving a first data set for a first process run of a process recipe, the first data set comprising first process parameter values, first performance data and target performance data of the process recipe. The method further includes process the first data set using a dynamic controller to determine second process parameter values that differ from the first process parameter values for at least one process parameter. The method further includes receiving a second data set for a second process run of the process recipe, the second data set comprising the second process parameter values, second performance, and the target performance data of the process recipe. The method further includes, responsive to determining that the second performance data satisfies one or more criteria with respect to the target performance data, saving the second process parameter values as final process parameter values for the process recipe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製造腔室</p>
        <p type="p">104:基板支撐組件</p>
        <p type="p">106:噴淋頭</p>
        <p type="p">108:腔室主體</p>
        <p type="p">110:內部體積</p>
        <p type="p">112:側壁</p>
        <p type="p">114:底部</p>
        <p type="p">116:排氣口</p>
        <p type="p">118:泵系統</p>
        <p type="p">120:氣體分配盤</p>
        <p type="p">122:基座</p>
        <p type="p">124:軸</p>
        <p type="p">126:加熱器</p>
        <p type="p">128:反射器</p>
        <p type="p">150:控制器</p>
        <p type="p">152:動態控制器</p>
        <p type="p">170:伺服器計算裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1721" publication-number="202617930">
    <tif-files tif-type="multi-tif">
      <tif file="114126298.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子點組成物、固化膜以及顯示設備</chinese-title>
        <english-title>QUANTUM DOT COMPOSITION, CURED FILM AND DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K11/02</main-classification>
        <further-classification edition="200601120260202B">C09K11/62</further-classification>
        <further-classification edition="200601120260202B">G02B5/20</further-classification>
        <further-classification edition="200601120260202B">G09F9/00</further-classification>
        <further-classification edition="201101120260202B">B82Y20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴溫柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, ON YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹振燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUN, JIN SUOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愼度重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DO JOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宰熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金圭泳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYU YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李範珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BUM JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭成顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露量子點組成物、固化膜、以及顯示裝置。量子點組成物包括I-III-VI族量子點，其中I-III-VI族量子點包括胺基硫醇化合物和(甲基)丙烯酸酯化合物之間的反應產物作為第一配體，其中(甲基)丙烯酸酯化合物包括單官能(甲基)丙烯酸酯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a quantum dot composition, a cured film, and a display apparatus. The quantum dot composition includes group I-III-VI quantum dots, wherein the group I-III-VI quantum dots include a reaction product between an aminothiol compound and a (meth)acrylate compound as a first ligand, wherein the (meth)acrylate compound includes a monofunctional (meth)acrylate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3、3r、3g:量子點</p>
        <p type="p">10:光源</p>
        <p type="p">11:顯示裝置</p>
        <p type="p">111:第一基板</p>
        <p type="p">112:第一電極</p>
        <p type="p">113:像素定義膜</p>
        <p type="p">114:第二電極層</p>
        <p type="p">115:第一平面化層</p>
        <p type="p">116:第二基板</p>
        <p type="p">117:遮光構件</p>
        <p type="p">118:第二平面化層</p>
        <p type="p">119:密封層</p>
        <p type="p">120:有機發光層</p>
        <p type="p">120a:第一有機發光層</p>
        <p type="p">120b:第二有機發光層</p>
        <p type="p">120c:第三有機發光層</p>
        <p type="p">130:濾色器層</p>
        <p type="p">130b:第三濾色器</p>
        <p type="p">130g:第二濾色器</p>
        <p type="p">130r:第一濾色器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1722" publication-number="202619028">
    <tif-files tif-type="multi-tif">
      <tif file="114126300.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調式低K介電質膜之遠端電感耦合電漿自由基沉積</chinese-title>
        <english-title>REMOTE ICP RADICAL DEPOSITION OF TUNABLE LOW-K DIELECTRIC FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/762</main-classification>
        <further-classification edition="200601120260127B">C23C16/505</further-classification>
        <further-classification edition="200601120260127B">C23C16/452</further-classification>
        <further-classification edition="200601120260127B">C23C16/448</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佳良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　卡希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, KASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLICK, ABHIJIT BASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種處理基板的方法。該方法包括將基板置於處理腔室的處理區域中，並將反應氣體流入該處理腔室的遠端電漿區域，通過噴頭中的第二複數個通道將前驅物氣體流入處理區域，使用反應氣體在遠端電漿區域內產生電感耦合電漿以形成電漿自由基，並使處理區域中的前驅物氣體暴露於電漿自由基，以在基板上形成具有至少95%階梯覆蓋度的介電質膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate is provided. The method includes disposing a substrate in a processing region of a process chamber and flowing a reaction gas into a remote plasma region of the process chamber, flowing a precursor gas into the processing region through the second plurality of channels in the showerhead, generating an inductively coupled plasma in the remote plasma region using the reaction gas to form plasma radicals, and exposing the precursor gas in the processing region to plasma radicals to form a dielectric film on the substrate with at least 95% step coverage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202:操作</p>
        <p type="p">204:操作</p>
        <p type="p">206:操作</p>
        <p type="p">208:操作</p>
        <p type="p">210:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1723" publication-number="202618956">
    <tif-files tif-type="multi-tif">
      <tif file="114126309.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>台座及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/66</main-classification>
        <further-classification edition="200601120260131B">H01L21/683</further-classification>
        <further-classification edition="200601120260131B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田陽一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠在調溫時具有高熱交換效率且同時減少流體的壓力損耗之技術。  &lt;br/&gt;  台座係藉由調溫用流體的流通來調整載置面所載置之基板的溫度。台座係具備：具有凹部的流道形成構件及組裝在該流道形成構件以覆蓋該凹部且與該凹部一起形成使該調溫用流體流通的流通空間的蓋構件。該蓋構件係具有藉由層積造形所形成的熱交換部。該熱交換部係在該流道形成構件與該蓋構件組裝後的狀態下，位於該流通空間之上部的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">45:載置台</p>
        <p type="p">45s:載置面</p>
        <p type="p">46:底板</p>
        <p type="p">47:吸盤頂部</p>
        <p type="p">50:調溫機構</p>
        <p type="p">51:流道形成構件</p>
        <p type="p">511:凹部</p>
        <p type="p">512:流入埠</p>
        <p type="p">513:流出埠</p>
        <p type="p">514:外周部</p>
        <p type="p">514a:內側段差</p>
        <p type="p">51s:配置空間</p>
        <p type="p">52:蓋構件</p>
        <p type="p">521:熱交換部</p>
        <p type="p">522:晶格構造</p>
        <p type="p">53:流通空間</p>
        <p type="p">53a:流道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1724" publication-number="202619613">
    <tif-files tif-type="multi-tif">
      <tif file="114126313.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260122B">H10K59/131</main-classification>
        <further-classification edition="202301120260122B">H10K59/80</further-classification>
        <further-classification edition="200601120260122B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李弼錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PILSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪性珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種顯示裝置，其包含：基底層，包含設置複數個像素的顯示區域以及設置於該顯示區域周圍的非顯示區域；導電層，在平面圖中與該複數個像素的至少一部分重疊；第一電源線，與該複數個像素電性連接；以及第二電源線，與該複數個像素電性連接。該導電層包含：第一導電層，在平面圖中與該複數個像素中的第一像素重疊；以及第二導電層，在平面圖中與該複數個像素中的第二像素重疊，並且與該第一導電層隔開設置。該第一電源線包含：第1-1電源線，透過該第一導電層電性連接至該第一像素；以及第1-2電源線，透過該第二導電層電性連接至該第二像素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a display device including a base layer including a display area in which multiple pixels are disposed, and a non-display area disposed around the display area, a conductive layer overlapping a least a portion of multiple pixels in a plan view, a first power line electrically connected to multiple pixels, and a second power line electrically connected to multiple pixels. The conductive layer includes a first conductive layer overlapping a first pixel of multiple pixels in a plan view, and a second conductive layer overlapping a second pixel of multiple pixels in a plan view and disposed apart from the first conductive layer. The first power line includes a 1-1-th power line electrically connected to the first pixel through the first conductive layer, and a 1-2-th power line electrically connected to the second pixel through the second conductive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AA':區域</p>
        <p type="p">CD3:驅動連接部</p>
        <p type="p">CE1:第一連接部</p>
        <p type="p">CE2:第二連接部</p>
        <p type="p">CE3:第三連接部</p>
        <p type="p">CNE:連接電極</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">EP:發射部</p>
        <p type="p">I-I':線</p>
        <p type="p">Rk:第一列</p>
        <p type="p">Rk+1:第二列</p>
        <p type="p">SPR:分隔件</p>
        <p type="p">UT:發射單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1725" publication-number="202618487">
    <tif-files tif-type="multi-tif">
      <tif file="114126316.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126316</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚類參數資料以識別工業設備的行為模式</chinese-title>
        <english-title>CLUSTERING PARAMETER DATA TO IDENTIFY BEHAVIOR PATTERN OF INDUSTRIAL EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G05B23/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧森堡商保爾伍斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUL WURTH S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞德里克　肖卡特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOCKAERT, CEDRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍耶茲　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYEZ, HENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特謝拉　馬科斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEIXEIRA, MARCOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了識別執行工業過程的工業設備的行為模式（Z），電腦使用適配器模組（200）和預測器模組（500）來執行電腦實現的方法（400）。適配器模組（200）從屬於工業設備的元件的資料提供者接收（410）原始參數資料[X]，適配器模組（200）根據元件之間的關係將原始參數資料[X]聚類（420）為資料集群。元件之間的靜態關係由工業過程預定義，並且元件之間的動態關係由正在接收的參數資料定義。適配器模組（200）將集群值分配（430）給資料集群，並將集群值作為權重[W]應用（440）於參數資料[X]以獲得適配參數資料[Y]。預測器模組（500）使用適配參數資料[Y]執行（450）行為預測，得到行為模式（Z）。  &lt;br/&gt;&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To identify a behavior pattern (Z) of industrial equipment that performs an industrial process, a computer uses an adaptor module (200) and a predictor module (500) to perform a computer-implemented method (400). The adaptor module (200) receives (410) original parameter data [X] from data providers that belong to components of the industrial equipment, the adaptor module (200) clusters (420) original parameter data [X] to data clusters according to relations between the components. Static relations between the components are pre-defined by the industrial process, and dynamic relations between the components are defined by parameter data that are being received. The adaptor module (200) assigns (430) cluster values to the data clusters, and applies (440) the cluster values as weights [W] to the parameter data [X] to obtain adapted parameter data [Y]. The predictor module (500) performs (450) the behavior prediction with adapted parameter data [Y] results in the behavior pattern (Z).</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:適配器模組</p>
        <p type="p">400:方法</p>
        <p type="p">410、420、430、440、450:步驟</p>
        <p type="p">500:預測器模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1726" publication-number="202618748">
    <tif-files tif-type="multi-tif">
      <tif file="114126319.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備、其製造方法及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY APPARATUS, ELECTRONIC DEVICE INCLUDING THE SAME AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260115B">G09G3/32</main-classification>
        <further-classification edition="201601120260115B">G09G3/3233</further-classification>
        <further-classification edition="202501120260115B">H10H20/80</further-classification>
        <further-classification edition="202501120260115B">H10H20/83</further-classification>
        <further-classification edition="202501120260115B">H10H29/01</further-classification>
        <further-classification edition="202501120260115B">H10H29/39</further-classification>
        <further-classification edition="202301120260115B">H10K77/10</further-classification>
        <further-classification edition="202501120260115B">H10D86/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李揆汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GYUJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全亨一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HYUNG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太昌一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAE, CHANG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示設備，包含：複數個島區域彼此間隔設置，以及連接該複數個島區域的複數個橋區域；基板；像素驅動電路部分，設置於該基板上；第一電極墊，設置於該像素驅動電路部分上以電性連接至該像素驅動電路部分；第二電極墊，設置於該像素驅動電路部分上以電性連接至電源電壓；第一觸碰導電層，設置於該像素驅動電路部分上，並包含一第一導電圖案；以及無機發光二極體，設置於該第一電極墊與該第二電極墊上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a plurality of island areas each arranged to be spaced apart from each other and a plurality of bridge areas connecting the plurality of island areas, a substrate, a pixel driving circuit portion arranged on the substrate, a first electrode pad arranged on the pixel driving circuit portion to be electrically connected to the pixel driving circuit portion, a second electrode pad arranged on the pixel driving circuit portion to be electrically connected to a power voltage, a first touch conductive layer arranged on the pixel driving circuit portion and including a first conductive pattern, and an inorganic light-emitting diode arranged on the first electrode pad and the second electrode pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示設備</p>
        <p type="p">100:基板</p>
        <p type="p">101:第一基底層</p>
        <p type="p">102:第一阻擋層</p>
        <p type="p">103:第二基底層</p>
        <p type="p">104:第二阻擋層</p>
        <p type="p">111:緩衝層</p>
        <p type="p">113:閘極絕緣層</p>
        <p type="p">115:第一層間絕緣層</p>
        <p type="p">117:第二層間絕緣層</p>
        <p type="p">119:第一有機絕緣層</p>
        <p type="p">121:第二有機絕緣層</p>
        <p type="p">123:第三有機絕緣層</p>
        <p type="p">125:第一平坦化層</p>
        <p type="p">127:第二平坦化層</p>
        <p type="p">200:觸碰單元</p>
        <p type="p">230:無機發光二極體</p>
        <p type="p">231:第一半導體層</p>
        <p type="p">232:第二半導體層</p>
        <p type="p">233:中間層</p>
        <p type="p">235:第一電極</p>
        <p type="p">238:第二電極</p>
        <p type="p">241:第一電極墊</p>
        <p type="p">242:第二電極墊</p>
        <p type="p">Act:半導體層</p>
        <p type="p">AD1:第一黏合層</p>
        <p type="p">CE1:第一電極</p>
        <p type="p">CE2:第二電極</p>
        <p type="p">CM1:第一連接電極</p>
        <p type="p">CM2:第二連接電極</p>
        <p type="p">CP1:第一連接部分</p>
        <p type="p">CP2:第二連接部分</p>
        <p type="p">Cst:儲存電容器</p>
        <p type="p">DE:汲極電極</p>
        <p type="p">EAB:橋區域</p>
        <p type="p">EAI:島區域</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">IOL:無機絕緣材料層</p>
        <p type="p">MTL1:第一觸碰導電層</p>
        <p type="p">MTL2:第二觸碰導電層</p>
        <p type="p">OL:絕緣層</p>
        <p type="p">PC:像素驅動電路部分</p>
        <p type="p">SE:源極電極</p>
        <p type="p">SHP1:第一屏蔽層</p>
        <p type="p">TFT:薄膜電晶體</p>
        <p type="p">VSSL:第二電壓線</p>
        <p type="p">WL:布線</p>
        <p type="p">WL1:第一布線</p>
        <p type="p">WL2:第二布線</p>
        <p type="p">WL3:第三布線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1727" publication-number="202618299">
    <tif-files tif-type="multi-tif">
      <tif file="114126335.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針卡組件以及其製造方法</chinese-title>
        <english-title>PROBE CARD ASSEMBLY AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">G01R1/067</main-classification>
        <further-classification edition="200601120260119B">G01R1/073</further-classification>
        <further-classification edition="200601120260119B">G01R3/00</further-classification>
        <further-classification edition="200601120260119B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＡＭＳＴ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMST CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋柄昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, BYUNG CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈允姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIM, YUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鍾寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金恩玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, EUN OK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種探針卡組件以及其製造方法。本發明提供一種在以窄間隔配置的同時具有即使有檢查對象元件的溫度變化亦可以保持恆定的間隔的探針銷構件的探針卡組件。根據本發明的探針卡組件包括：電路基板，被施加用於檢查對象元件的電檢查的訊號；框架基板，結合於所述電路基板的一面且形成有複數個開口部；導電介質，設置於所述開口部且與所述電路基板電連接；探針基板，結合於所述導電介質；以及探針銷構件，在所述探針基板中結合於所述導電介質的相反側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針卡組件</p>
        <p type="p">2:晶圓</p>
        <p type="p">10:電路基板</p>
        <p type="p">20:框架基板</p>
        <p type="p">30:導電介質</p>
        <p type="p">40:探針基板</p>
        <p type="p">50:探針銷構件</p>
        <p type="p">60:加固件</p>
        <p type="p">70:探針基板結合構件</p>
        <p type="p">80:平坦度調整螺絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1728" publication-number="202618044">
    <tif-files tif-type="multi-tif">
      <tif file="114126350.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉積製程內的節流閥位置端點控制</chinese-title>
        <english-title>THROTTLE VALVE POSITION ENDPOINT CONTROL WITHIN A DEPOSITION PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C23C16/44</main-classification>
        <further-classification edition="200601120260121B">C23C16/505</further-classification>
        <further-classification edition="200601120260121B">C23C16/52</further-classification>
        <further-classification edition="200601120260121B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高豔濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YANTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任連娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, LIANJUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱永欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YONGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了與節流閥（TV）端點控制相關的技術。可以初始化沉積製程。在沉積製程期間，可以執行節流閥穩定化步驟。此節流閥穩定化步驟可以包含確定耦接至處理腔室的排氣埠的節流閥的節流閥位置，並確定該節流閥位置是否滿足節流閥位置標準。沉積製程可以回應於確定節流閥位置滿足節流閥位置標準，進入沉積製程的下一步驟，並在基板上沉積膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Technologies related to throttle valve (TV) endpoint control of a deposition process are described. A deposition process may be initialized. During the deposition process, a throttle valve stabilization step may be performed. This throttle valve stabilization step may include determining a throttle valve position for a throttle valve coupled to an exhaust port of the processing chamber and determining whether the throttle valve position satisfies a throttle valve position criterion. The deposition process may proceed to a next step of the deposition process and depositing a film on a substrate in response to determining that the throttle valve position satisfies the throttle valve position criterion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">126:排氣埠</p>
        <p type="p">128:泵系統</p>
        <p type="p">176:加熱元件</p>
        <p type="p">200:處理系統</p>
        <p type="p">202:處理腔室</p>
        <p type="p">204:面板</p>
        <p type="p">206:節流閥</p>
        <p type="p">208:氣體管線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1729" publication-number="202618917">
    <tif-files tif-type="multi-tif">
      <tif file="114126353.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法，半導體裝置的製造方法，程式及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">H01L21/306</main-classification>
        <further-classification edition="200601120251128B">H01L21/67</further-classification>
        <further-classification edition="200601120251128B">G05B19/4155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田英樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORITA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田原開悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAHARA, KAIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本𨺓治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立花淳平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIBANA, JUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是在於提供一種可精密地從基板上去除物質的技術。  &lt;br/&gt;　　其解決手段為藉由進行以下的工序來去除基板上的物質，  &lt;br/&gt;　　(a)從第一供給部來對基板供給含有鹵素元素的蝕刻氣體及與前述蝕刻氣體反應的反應氣體的其中任一方的第一氣體之工序；及  &lt;br/&gt;　　(b)在執行(a)的同時，從與前述第一供給部不同的第二供給部來對前述基板供給前述蝕刻氣體及前述反應氣體的其中與前述一方不同的另一方的第二氣體，以調整藉由前述第一氣體與前述第二氣體的反應所產生的反應生成物的分壓在前述基板面內的分佈之工序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:晶圓(基板)</p>
        <p type="p">201:處理室</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:反應管</p>
        <p type="p">207:加熱器</p>
        <p type="p">231:排氣管</p>
        <p type="p">231a:排氣口</p>
        <p type="p">232a,232b:氣體供給管</p>
        <p type="p">249a:噴嘴(第一供給部)</p>
        <p type="p">249b:噴嘴(第二供給部)</p>
        <p type="p">250a,250b:氣體供給孔</p>
        <p type="p">263:溫度感測器</p>
        <p type="p">L1,L2:直線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1730" publication-number="202618972">
    <tif-files tif-type="multi-tif">
      <tif file="114126354.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置，基板處理方法，半導體裝置的製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">H01L21/67</main-classification>
        <further-classification edition="200601120251204B">C23C16/455</further-classification>
        <further-classification edition="200601120251204B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田伸輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中谷俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATANI, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是在於提供一種能夠提高基板處理生產率的技術。  &lt;br/&gt;　　其解決手段為提供一種技術，其具備：  &lt;br/&gt;　　處理室，其處理基板；  &lt;br/&gt;　　原料供給部，其具有儲存原料的可更換的複數的容器，將原料供給至處理室；  &lt;br/&gt;　　判定部，其在基板的處理中確認現在使用中的容器內的原料的剩餘量，從剩餘量判定是否需要將原料的供給從現在使用中的容器切換到待機中的容器；及  &lt;br/&gt;　　控制部，其構成為能夠根據判定部所判定的判定結果，將現在使用中的容器切換到待機中的容器，控制為繼續原料的供給。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1731" publication-number="202617699">
    <tif-files tif-type="multi-tif">
      <tif file="114126355.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617699</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖案形成方法、化合物，及高分子化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D305/06</main-classification>
        <further-classification edition="200601120260202B">C07D307/12</further-classification>
        <further-classification edition="200601120260202B">C07D307/93</further-classification>
        <further-classification edition="200601120260202B">C07D309/06</further-classification>
        <further-classification edition="200601120260202B">C07D407/12</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08F220/32</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　慶信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, KHANHTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種阻劑組成物，係因曝光而產生酸，且因酸之作用使對顯影液之溶解性改變之阻劑組成物。含有因酸之作用使對顯影液之溶解性改變之樹脂成分(A1)，前述樹脂成分(A1)具有由下述通式(a0-m)所表示之化合物衍生而來之構成單元(a0)。W&lt;sup&gt;0&lt;/sup&gt;表示含聚合性基之基。R&lt;sup&gt;01&lt;/sup&gt;及R&lt;sup&gt;02&lt;/sup&gt;係分別獨立地表示可具有取代基之鏈狀之烴基，R&lt;sup&gt;01&lt;/sup&gt;及R&lt;sup&gt;02&lt;/sup&gt;可相互鍵結而形成環構造。R&lt;sup&gt;03&lt;/sup&gt;表示可具有取代基之鏈狀之烴基。m0及n0係分別獨立地表示0至4之整數，2≦m0+n0≦8。R&lt;sup&gt;04&lt;/sup&gt;表示取代基。p0表示0以上至2(m0+n0)以下之整數。  &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="342px" file="ed10149.JPG" alt="ed10149.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1732" publication-number="202618734">
    <tif-files tif-type="multi-tif">
      <tif file="114126372.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分離式顯示屏穿戴裝置</chinese-title>
        <english-title>WEARABLE DEVICE WITH DETACHABLE DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250804B">G09F9/00</main-classification>
        <further-classification edition="200601120250804B">A61B5/00</further-classification>
        <further-classification edition="200601120250804B">G04G17/02</further-classification>
        <further-classification edition="201001120250804B">G04G21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英華達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC APPLIANCES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張思忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SZU-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許翔迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIANG TI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凃姝仰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, SHU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種分離式顯示屏穿戴裝置，其包含腕帶組件和顯示螢幕組件。腕帶組件包含連接部以及連接該連接部之帶體，其可用以供使用者配帶，並於配帶時量測使用者生理資訊和運動資訊。顯示螢幕組件包含顯示螢幕，可用來執行智慧功能。腕帶組件之連接部及顯示螢幕組件分別包含互相對應的第一磁吸結構與第二磁吸結構，顯示螢幕組件可透過第一磁吸結構以及第二磁吸結構互相吸引而可分離地組合於腕帶組件上。藉此，腕帶組件和顯示螢幕組件可分離而各自執行其功能，或互相組合以同時執行兩者之功能並於將其顯示於顯示螢幕組件之顯示螢幕上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wearable device with detachable display includes a wristband assembly including a connecting part and a wristband body connected to the connecting part, and a display assembly including a display. The wristband assembly is configured for a user to wear and measure physiological information and motion information of the user when the user wears it. The display assembly is configured to perform an intelligent function. The connecting part of the wristband assembly and the display assembly respectively include a first magnetic attachment structure and a second magnetic attachment structure corresponding to each other to detachably couple the display assembly and the wristband assembly. Thereby, the wristband assembly and the display assembly can be separated from each other to perform their own functions independently, or combined with each other to perform both functions and display the functions on the display of the display assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:分離式顯示屏穿戴裝置</p>
        <p type="p">10:腕帶組件</p>
        <p type="p">12:螢幕組件</p>
        <p type="p">100:連接部</p>
        <p type="p">102:帶體</p>
        <p type="p">120:顯示螢幕</p>
        <p type="p">122:第二磁吸結構</p>
        <p type="p">1000:第一磁吸結構</p>
        <p type="p">1002:腕帶螢幕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1733" publication-number="202618934">
    <tif-files tif-type="multi-tif">
      <tif file="114126373.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結晶氧化物膜、薄膜電晶體及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/363</main-classification>
        <further-classification edition="202501120260122B">H10D30/67</further-classification>
        <further-classification edition="202501120260122B">H10D62/81</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口幸士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永富久乗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATOMI, HISANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩瀨信博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASE, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上一吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種能夠控制遲滯現象之結晶氧化物膜、薄膜電晶體及電子機器。本發明係關於一種結晶氧化物膜，其含有作為主成分之In、選自由Ga、Al及Y所組成之群中之至少2種、及選自由Ce、Tb、Nd、Mn、Ru、Pd及Pt所組成之群中之至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1734" publication-number="202617464">
    <tif-files tif-type="multi-tif">
      <tif file="114126406.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126406</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動電池更換系統及方法</chinese-title>
        <english-title>AUTOMATIC BATTERY EXCHANGE SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260126B">B60L53/80</main-classification>
        <further-classification edition="201901120260126B">B60L53/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛波提克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMBOTIC LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱波　泰德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEPPLE, TODD E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁格曼　佐伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DINGEMAN, ZOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂芬斯　馬特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEVENS, MATT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝裡根　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERRIGAN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於自動導引車機器人之電池的自動電池交換的自動電池交換站，該站包括具有實質上封閉之組態的外殼封閉件，其圍繞該站，具有狹窄的開口，形成從該封閉件內至該站外的該機器人之該電池的通道，使得該封閉件為該站提供預定的阻燃等級；設置在該封閉件內的機器人轉移機構，該轉移機構具有驅動部分，為該轉移機構提供至少一個自由度，以及末端執行器，其組態以抓取該電池，使得該電池藉由該轉移機構相對於該站在該至少一個自由度上移動；電池儲存站，具有分佈在該封閉件內的電池儲存位置之陣列，以及其中該轉移機構係配置以經由該至少一個自由度在至少一個該等儲存位置和該站外之間移動，使得通過該狹窄的開口將該站外的該機器人的該電池與在該等電池儲存位置中儲存電池進行交換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic battery swapping station for automatic battery swapping of a battery of an automated guided vehicle robot, the station including a housing closure, with a configuration that is substantially closed, enclosing the station, with a narrowed opening, forming access from inside the closure to the battery of the robot outside the station, so that the closure provides a predetermined fire retardant rating to the station; a robotic transfer mechanism disposed inside the closure, the transfer mechanism having a drive section, providing the transfer mechanism at least one degree of freedom, and an end effector configured to grip the battery so that the battery is moved by the transfer mechanism, relative to the station, in the at least one degree of freedom; a battery storage with an array of battery storage locations distributed inside the closure, and wherein the transfer mechanism is arranged to move, via the at least one degree of freedom, between at least one of the storage locations and outside the station so as to swap the battery of the robot outside the station with a stored battery in the storage locations through the narrowed opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130C:自動電池充電/交換站</p>
        <p type="p">130CF:框架</p>
        <p type="p">720:通風口</p>
        <p type="p">784:維持門</p>
        <p type="p">900:結構引導牆壁</p>
        <p type="p">910:車輪擋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1735" publication-number="202618876">
    <tif-files tif-type="multi-tif">
      <tif file="114126457.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過緻密化介電層處理半導體基板之方法</chinese-title>
        <english-title>METHODS FOR SEMICONDUCTOR SUBSTRATE PROCESSING BY DENSIFYING A DIELECTRIC LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林旺樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WANGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許致遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塗俊欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHUN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊燿青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAU CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱永星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YUNG HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種處理一單晶半導體基板之方法，其包含提供該單晶半導體基板，其中該單晶半導體基板包含：兩個大體上平行之主表面，其等之一者係該單晶半導體基板之一前表面且其等之另一者係該單晶半導體基板之一後表面；一圓周邊緣，其結合該等前及後表面；及一塊體區，其介於該等前與後表面之間。該方法進一步包含將一緻密劑施覆至與該單晶半導體基板之該前表面界面接觸之一介電層，其中施覆該緻密劑使該介電層緻密化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of processing a single crystal semiconductor substrate including providing the single crystal semiconductor substrate, where the single crystal semiconductor substrate includes two major, generally parallel surfaces, one of which is a front surface of the single crystal semiconductor substrate and the other of which is a back surface of the single crystal semiconductor substrate, a circumferential edge joining the front and back surfaces, and a bulk region between the front and back surfaces. The method further includes applying a densification agent to a dielectric layer in interfacial contact with the front surface of the single crystal semiconductor substrate, where applying the densification agent densifies the dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單晶半導體基板</p>
        <p type="p">3:前表面</p>
        <p type="p">5:後表面</p>
        <p type="p">7:假想中心平面</p>
        <p type="p">9:晶圓塊體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1736" publication-number="202618877">
    <tif-files tif-type="multi-tif">
      <tif file="114126500.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對準標記及其使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01L21/02</main-classification>
        <further-classification edition="200601120260202B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商龍雲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAZMO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐野一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANO, ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">對準標記具備有第1標記部與第2標記部，該等標記部係當從與虛擬平面垂直之方向觀察時，各自具有在該虛擬平面內朝向從第1方向傾斜之方向延伸的相同長度之線段要素。第2標記部係被形成為當從與虛擬平面垂直之方向觀察時，線段要素之形狀成為在該虛擬平面內以朝向與第1方向垂直之第2方向延伸的虛擬線為軸而將第1標記部之線段要素予以反轉後的形狀。第1標記部及第2標記部係被形成為當兩個工件之相對位置關係成為既定之位置關係時，線段要素之中點彼此相互一致。各線段要素係被形成為當將在第1方向上之分量作為第1分量且將在第2方向上之分量作為第2分量時，第2分量之長度Lb係較第1分量之長度La更大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:對準標記</p>
        <p type="p">61:第1標記部</p>
        <p type="p">62:第2標記部</p>
        <p type="p">Da:第1方向</p>
        <p type="p">Db:第2方向</p>
        <p type="p">Lb、Lc:長度</p>
        <p type="p">△L、△Lb:偏移量</p>
        <p type="p">Pg:中點</p>
        <p type="p">Ph:交點</p>
        <p type="p">Q1、Q2:線段要素</p>
        <p type="p">e1、e2:基準端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1737" publication-number="202618226">
    <tif-files tif-type="multi-tif">
      <tif file="114126539.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於確定與晶圓的重量或質量相關的資訊之設備</chinese-title>
        <english-title>APPARATUS FOR DETERMINING INFORMATION RELATING TO THE WEIGHT OR MASS OF A WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G01G21/22</main-classification>
        <further-classification edition="200601120260127B">G01G23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商美特拉斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METRYX LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾略特　格雷戈爾　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLIOTT, GREGOR ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐文斯　山姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OWENS, SAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆薩維　亞伯拉罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOOSAVI, ABRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於確定與晶圓重量或質量相關的資訊之設備，該設備包括 : 配置成支撐晶圓的支座，其中支座配置成從晶圓上方及從晶圓下方遮蔽晶圓上的電荷；佈設成抵消支座之至少部分重量的配重件；以及佈設成產生測量輸出之測量裝置，其指示支座及支座所支撐之晶圓的總重量與配重件所抵消之重量之間的差值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus for determining information relating to the weight or mass of a wafer, the apparatus comprising: a support configured to support the wafer, wherein the support is configured to shield charges on the wafer from above the wafer and from below the wafer; a counterweight arranged to counterbalance at least part of the weight of the support; and a measurement device arranged to generate measurement output indicative of a difference between the combined weight of the support and the wafer supported by the support and a weight counterbalanced by the counterweight.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:稱重設備</p>
        <p type="p">3:秤杆</p>
        <p type="p">5:樞軸點</p>
        <p type="p">7:支座</p>
        <p type="p">9:法拉第籠</p>
        <p type="p">10:晶圓支撐元件</p>
        <p type="p">11:電磁鐵</p>
        <p type="p">13:永久磁鐵</p>
        <p type="p">15:配重件</p>
        <p type="p">17:抵靠面</p>
        <p type="p">19:控制器、處理器</p>
        <p type="p">W:半導體晶圓、晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1738" publication-number="202618998">
    <tif-files tif-type="multi-tif">
      <tif file="114126556.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L21/677</main-classification>
        <further-classification edition="200601120260130B">B25J9/06</further-classification>
        <further-classification edition="200601120260130B">H02K9/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商昕芙旎雅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINFONIA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若林宏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKABAYASHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船戶学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNATO, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;　　特別適用於在真空腔室內搬送搬送對象物的用途，實現了透過分散配置馬達來抑制臂部的體積的同時，適當提升馬達的冷卻效率的搬送裝置。  &lt;br/&gt;[解決手段]  &lt;br/&gt;　　此搬送裝置(10)，構成為具備有：用關節軸(L1、L2、L3)連接第1臂部(11)、第2臂部(12)、手部(13)，將用於驅動關節軸(L1、L2、L3)的馬達(3A、3B、4A、4B)配置於臂部(11、12)內的多關節型臂部單元(1)、及將冷媒(Re)供給至用於驅動各關節軸(L1、L2、L3)的馬達(3A、3B、4A、4B)的冷媒供給路(51、52、53)，於馬達(3A、3B、4A、4B)採用直驅式馬達，於直驅式馬達(3A、3B、4A、4B)設置有：冷媒供給路(51、52、53)、及將通過冷媒供給路(51、52、53)的冷媒的一部分引導至定子(32、42)以進行冷卻的冷卻路(61、62、63、64)，將通過冷卻路(61、62、63、64)的冷媒(Re)經由冷媒排出路(71、72、73)從臂部單元(1)的基端排出，在至少一部分的冷媒供給路(51、52)，將通過該冷媒供給路(51、52)的冷媒(Re)送入下一段馬達(3B、4A、4B)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:臂部單元</p>
        <p type="p">11:第1臂部</p>
        <p type="p">11a:第1歧管</p>
        <p type="p">12:第2臂部</p>
        <p type="p">12a:第2歧管</p>
        <p type="p">13a:手部</p>
        <p type="p">13b:手部</p>
        <p type="p">2:本體部</p>
        <p type="p">3:馬達</p>
        <p type="p">3A,3B:馬達</p>
        <p type="p">31:支軸</p>
        <p type="p">31h:中空部</p>
        <p type="p">32:定子</p>
        <p type="p">32a:定子鐵心</p>
        <p type="p">32b:定子線圈</p>
        <p type="p">32H:定子外殼</p>
        <p type="p">33:轉子</p>
        <p type="p">4:馬達</p>
        <p type="p">4A,4B:馬達</p>
        <p type="p">41a:旋轉軸</p>
        <p type="p">41b:旋轉軸</p>
        <p type="p">42:定子</p>
        <p type="p">42a:定子鐵心</p>
        <p type="p">42b:定子線圈</p>
        <p type="p">42H:定子外殼</p>
        <p type="p">43:轉子</p>
        <p type="p">L1,L2,L3,L4:關節軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1739" publication-number="202618999">
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      <tif file="114126557.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送裝置及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">H01L21/677</main-classification>
        <further-classification edition="200601120251128B">H01L21/68</further-classification>
        <further-classification edition="200601120251128B">H01L21/687</further-classification>
        <further-classification edition="200601120251128B">B65G47/22</further-classification>
        <further-classification edition="200601120251128B">B65G49/07</further-classification>
        <further-classification edition="200601120251128B">B25J9/10</further-classification>
        <further-classification edition="200601120251128B">B25J19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商昕芙旎雅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINFONIA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田峰尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, MINETAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川優司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部岳史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABE, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高島弘明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKASHIMA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]利用事前動作正確取得關於晶圓徑及晶圓位置偏差等的資訊，謀求搬送精度的提升的搬送裝置。  &lt;br/&gt;　　[解決手段]具備將保持於手部(13)的晶圓(W)從搬送原位置(S)向搬送目標位置(E)搬送的搬送機構的機器人(1)；及設於搬送原位置(S)與搬送目標位置(E)之間的感測器(4)；機器人(1)，在搬送開始前，進行使手部(13)往返運動而讓感測器(4)檢測晶圓(W)邊緣的預備動作；在往返運動的一動作時，將感測器(4)檢測晶圓(W)邊緣的2處時的機器人座標系中的手部(13)的基準位置(中心位置)作為第1檢測位置座標(X&lt;sub&gt;HL1&lt;/sub&gt;,Y&lt;sub&gt;HL1&lt;/sub&gt;),(X&lt;sub&gt;HR1&lt;/sub&gt;,Y&lt;sub&gt;HR1&lt;/sub&gt;)、第2檢出位置座標(X&lt;sub&gt;HL2&lt;/sub&gt;,Y&lt;sub&gt;HL2&lt;/sub&gt;),(X&lt;sub&gt;HR2&lt;/sub&gt;,Y&lt;sub&gt;HR2&lt;/sub&gt;)取得；在往返運動的另一動作時，將使手部(13)在相對於與進行方向交叉的方向偏移的狀態下進行動作時感測器(4)檢測晶圓(W)邊緣的1處時的機器人座標系中的手部(13)的基準位置(中心位置)作為第3檢測位置(X&lt;sub&gt;HL3&lt;/sub&gt;,Y&lt;sub&gt;HL3&lt;/sub&gt;),(X&lt;sub&gt;HR3&lt;/sub&gt;,Y&lt;sub&gt;HR3&lt;/sub&gt;)取得；基於第1、第2、第3檢測位置(X&lt;sub&gt;HL1&lt;/sub&gt;,Y&lt;sub&gt;HL1&lt;/sub&gt;),(X&lt;sub&gt;HR1&lt;/sub&gt;,Y&lt;sub&gt;HR1&lt;/sub&gt;),(X&lt;sub&gt;HL2&lt;/sub&gt;,Y&lt;sub&gt;HL2&lt;/sub&gt;),(X&lt;sub&gt;HR2&lt;/sub&gt;,Y&lt;sub&gt;HR2&lt;/sub&gt;), (X&lt;sub&gt;HL3&lt;/sub&gt;,Y&lt;sub&gt;HL3&lt;/sub&gt;),(X&lt;sub&gt;HR3&lt;/sub&gt;,Y&lt;sub&gt;HR3&lt;/sub&gt;)，算出機器人座標系中的感測器的位置座標(X’&lt;sub&gt;L&lt;/sub&gt;,Y’&lt;sub&gt;L&lt;/sub&gt;),(X’&lt;sub&gt;R&lt;/sub&gt;,Y’&lt;sub&gt;R&lt;/sub&gt;)、及晶圓(W)徑(Dw)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:感測器</p>
        <p type="p">(X&lt;sub&gt;HL1&lt;/sub&gt;,Y&lt;sub&gt;HL1&lt;/sub&gt;),(X&lt;sub&gt;HR1&lt;/sub&gt;,Y&lt;sub&gt;HR1&lt;/sub&gt;):第1檢測位置座標</p>
        <p type="p">(X&lt;sub&gt;HL2&lt;/sub&gt;,Y&lt;sub&gt;HL2&lt;/sub&gt;),(X&lt;sub&gt;HR2&lt;/sub&gt;,Y&lt;sub&gt;HR2&lt;/sub&gt;):第2檢測位置座標</p>
        <p type="p">(X&lt;sub&gt;HL3&lt;/sub&gt;,Y&lt;sub&gt;HL3&lt;/sub&gt;),(X&lt;sub&gt;HR3&lt;/sub&gt;,Y&lt;sub&gt;HR3&lt;/sub&gt;):第3檢測位置座標</p>
        <p type="p">(X&lt;sub&gt;HL4&lt;/sub&gt;,Y&lt;sub&gt;HL4&lt;/sub&gt;),(X&lt;sub&gt;HR4&lt;/sub&gt;,Y&lt;sub&gt;HR4&lt;/sub&gt;):第4檢測位置座標</p>
        <p type="p">θ&lt;sub&gt;4&lt;/sub&gt;:預定角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1740" publication-number="202617508">
    <tif-files tif-type="multi-tif">
      <tif file="114126586.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126586</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自行車之懸吊配置</chinese-title>
        <english-title>SUSPENSION ARRANGEMENT FOR A BICYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B62K25/08</main-classification>
        <further-classification edition="200601120260123B">B62K25/10</further-classification>
        <further-classification edition="200601120260123B">B62J1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林奇　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYNCH, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於一自行車之懸吊組件。該懸吊組件可包括：一第一正腔室；一活塞，其可在一壓縮方向上沿著一軸線從一第一位置移動通過該第一正腔室至一第二位置；以及一正腔室通路，其在該活塞位於該第一位置時與該第一正腔室流體連通，且在該活塞位於該第二位置時與該第一正腔室之流體連通分開。一第二正腔室可設置成與該正腔室通路流體連通，其中該第二正腔室相對於該軸線在一徑向尺寸上至少部分地重疊該第一正腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A suspension component for a bicycle is provided. The suspension component may include a first positive chamber, a piston movable through the first positive chamber along an axis from a first position to a second position in a compression direction, and a positive chamber passage in fluid communication with the first positive chamber with the piston in the first position, and separated from fluid communication with the first positive chamber with the piston in the second position. A second positive chamber may be provided in fluid communication with the positive chamber passage, wherein the second positive chamber is at least in part overlapping the first positive chamber in a radial dimension relative to the axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:懸吊組件</p>
        <p type="p">302:懸吊本體</p>
        <p type="p">304:活塞</p>
        <p type="p">306:第一正腔室</p>
        <p type="p">308:活塞腔室</p>
        <p type="p">310:負腔室</p>
        <p type="p">312:第一活塞密封件，第一密封件</p>
        <p type="p">313:第二活塞密封件，第二密封件</p>
        <p type="p">314:活塞軸</p>
        <p type="p">316:軸密封件</p>
        <p type="p">318:第二正腔室</p>
        <p type="p">320:第一正腔室通路</p>
        <p type="p">322:第三正腔室</p>
        <p type="p">324:第二正腔室通路</p>
        <p type="p">326:調整閥</p>
        <p type="p">328:正腔室壁</p>
        <p type="p">330:第二旁通形貌體</p>
        <p type="p">332:第一旁通形貌體</p>
        <p type="p">333:旁通裝置</p>
        <p type="p">B:軸線</p>
        <p type="p">C:壓縮方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1741" publication-number="202618159">
    <tif-files tif-type="multi-tif">
      <tif file="114126594.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>施工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">F16L5/02</main-classification>
        <further-classification edition="200601120260123B">E04B1/66</further-classification>
        <further-classification edition="200601120260123B">E04B1/76</further-classification>
        <further-classification edition="200601120260123B">E04B1/682</further-classification>
        <further-classification edition="200601120260123B">H02G3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松川大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKAWA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田義人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, YOSHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下昌己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深石孝嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAISHI, TAKATSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, YUUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之施工方法包括：第1步驟，其係將結構體（2）貼附於設置部（1）；及第2步驟，其係使貫通物（5）貫通結構體（2），且將結構體（2）與貫通物（5）之間隙密封；且結構體（2）具備具有伸縮性之第1層、及伸縮性較第1層低之第2層。根據本發明，可提供一種可容易地封閉貫通物周圍之間隙之施工方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設置部</p>
        <p type="p">2:結構體</p>
        <p type="p">5:貫通物</p>
        <p type="p">11:開口部</p>
        <p type="p">21:孔(切縫)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1742" publication-number="202618756">
    <tif-files tif-type="multi-tif">
      <tif file="114126615.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及使用加熱器驅動膽固醇液晶顯示裝置的方法</chinese-title>
        <english-title>DISPLAY DEVICE AND METHOD FOR DRIVING CHOLESTERIC LIQUID-CRYSTAL DISPLAY DEVICE USING HEATER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G09G3/36</main-classification>
        <further-classification edition="200601120250901B">G09G3/20</further-classification>
        <further-classification edition="200601120250901B">G02F1/133</further-classification>
        <further-classification edition="200601120250901B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能勢將樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOSE, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富田順二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMITA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示裝置，其包括膽固醇液晶顯示面板、加熱器及驅動電路。膽固醇液晶顯示面板包括以堆疊結構進行排列的第一顯示單元、第二顯示單元及第三顯示單元。加熱器經設置以與膽固醇液晶顯示面板接觸，並經配置以在膽固醇液晶顯示面板的畫面更新程序之前的第一期間加熱膽固醇液晶顯示面板，且響應於畫面更新程序完成，在第二期間停止加熱膽固醇液晶顯示面板。驅動電路經配置以在畫面更新程序的期間重新寫入在第一顯示單元、第二顯示單元及第三顯示單元中的多個膽固醇液晶分子的像素值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is provided, which includes a cholesteric liquid crystal display panel, a heater, and a driving circuit. The cholesteric liquid crystal display panel includes a first display unit, a second display unit, and a third display unit arranged in a stacked structure. The heater is disposed in contact with the cholesteric liquid crystal display panel and is configured to heat the cholesteric liquid crystal display panel during a first period before a screen updating process of the cholesteric liquid crystal display panel. The heater ceases heating the cholesteric liquid crystal display panel during a second period in response to completion of the screen updating process. The driving circuit is configured to rewrite pixel values of cholesteric liquid crystal molecules within the first liquid crystal layer, the second liquid crystal layer, and the third liquid crystal layer using a driving scheme during the screen updating process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:方法</p>
        <p type="p">710:步驟</p>
        <p type="p">720:步驟</p>
        <p type="p">730:步驟</p>
        <p type="p">740:步驟</p>
        <p type="p">750:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1743" publication-number="202617505">
    <tif-files tif-type="multi-tif">
      <tif file="114126621.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自行車之控制裝置</chinese-title>
        <english-title>CONTROL DEVICE FOR A BICYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">B62K21/12</main-classification>
        <further-classification edition="200601120260121B">B62K23/06</further-classification>
        <further-classification edition="200601120260121B">B62L3/02</further-classification>
        <further-classification edition="200601120260121B">B62M25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史旺森　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANSON, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬洪尼　道格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHONEY, DOUG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　瑞恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIMM, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可安裝至一自行車之一把手的控制裝置係包括：一外殼；一扳桿，其耦接至該外殼且可相對於該外殼樞轉；以及一總泵部分，其由該外殼支撐。該總泵部分具有一流體缸筒。該流體缸筒具有一第一端以及與該第一端相對的一第二端，在其等之間有一筒狀壁。一開口係延伸穿過該總泵部分，自該第一端延伸至該第二端。該控制裝置亦包括：一插塞，其經由在該流體缸筒之該第一端處的開口，可移除式連接至該總泵部分；以及一活塞總成，其由該外殼支撐。該活塞總成係為可相對於該總泵部分移動的。該外殼係由一第一材料製成，且該總泵部分係由一第二材料製成。該第二材料係不同於該第一材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control device mountable to a handlebar of a bicycle includes a housing, a lever coupled to and pivotable relative to the housing, and a master cylinder portion supported by the housing. The master cylinder portion has a fluid cylinder. The fluid cylinder has a first end and a second end opposite the first end with a cylindrical wall therebetween. An opening extends through the master cylinder portion, from the first end to the second end. The control device also includes a plug removably connected to the master cylinder portion via the opening at the first end of the fluid cylinder, and a piston assembly supported by the housing. The piston assembly is movable relative to the master cylinder portion. The housing is made of a first material, and the master cylinder portion is made of a second material. The second material is different than the first material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">64:彎把式把手，把手</p>
        <p type="p">100:自行車控制裝置，控制裝置</p>
        <p type="p">102:煞車扳桿</p>
        <p type="p">104:外殼</p>
        <p type="p">112:換檔扳桿總成</p>
        <p type="p">120:夾具</p>
        <p type="p">122:外蓋體，蓋體</p>
        <p type="p">125:握柄</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1744" publication-number="202618317">
    <tif-files tif-type="multi-tif">
      <tif file="114126641.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶粒級測試系統及其控制方法</chinese-title>
        <english-title>DIE-LEVEL TEST SYSTEM AND METHOD FOR CONTROLLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01R31/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商株式會社塞米克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪莞植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WON SEEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛柄玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴基宅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KI TACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅俊善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, JUN SEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓相榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SANGYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種晶粒級測試系統及其控制方法。本發明的晶粒級測試系統包括：至少一個分選器腔室模組，設置有一個以上的用以放置移動卡盤的卡盤基座，移動卡盤用以放置由晶圓切割而成的複數個晶粒，並且用以將每一個晶粒從放置有由晶圓切割而成的複數個晶粒的膜體轉移並配置於卡盤基座上放置的移動卡盤；至少一個測試腔室模組，設置有一個以上的用以放置移動卡盤的卡盤基座，用以接收從分選器腔室模組搬入的放置有晶粒的移動卡盤，並對放置於移動卡盤的晶粒進行測試；裝載器模組，相對於分選器腔室模組和測試腔室模組搬入和搬出移動卡盤；以及控制部，用以控制分選器腔室模組、測試腔室模組和裝載器模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a die-level testing system and controlling method. The die-level testing system of the invention includes: at least one sorter chamber module, provided with one or more chuck bases for placing movable chucks, the movable chucks is used to place a plurality of dies diced from a wafer, and for transferring each die from a film containing the plurality of dies diced from the wafer and placing it on the movable chuck placed on the chuck base; at least one test chamber module, provided with one or more chuck bases for placing movable chucks, for receiving movable chucks containing dies from the sorter chamber module, and for testing the dies placed on the movable chucks; a loader module for loading and unloading the movable chucks relative to the sorter chamber module and the test chamber module; and a control portion for controlling the sorter chamber module, the test chamber module, and the loader module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:晶粒級測試系統</p>
        <p type="p">21:分選器腔室模組</p>
        <p type="p">22:裝載器模組</p>
        <p type="p">23:測試腔室模組</p>
        <p type="p">24:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1745" publication-number="202618124">
    <tif-files tif-type="multi-tif">
      <tif file="114126694.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隧道挖掘機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">E21D9/087</main-classification>
        <further-classification edition="200601120260127B">E21D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商地中空間開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNDERGROUND INFRASTRUCTURE TECHNOLOGIES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三宅大助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKE, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">該隧道挖掘機具備：刀盤；以及多個刀具刀頭，其包括在旋轉中心位置的徑向上配置於最內周側的中心刀頭。中心刀頭包括：母材；以及第一硬質刀片，其包括第一切削挖掘面，並安裝於母材，其中，該第一切削挖掘面是沿著與徑向平行的方向延伸的側面，並且對地下的砂土以及障礙物中的至少任一個進行切削或挖掘。從掘進方向側觀察，第一硬質刀片的第一切削挖掘面以不包括刀盤的旋轉中心位置的方式配置於從旋轉中心位置向徑向的外側錯開的位置，且配置於最靠掘進方向側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:刀盤</p>
        <p type="p">11:中央部</p>
        <p type="p">12:刀具輻條</p>
        <p type="p">2:刀具刀頭</p>
        <p type="p">22:砂土挖掘用刀頭</p>
        <p type="p">23:中心刀頭</p>
        <p type="p">231:母材</p>
        <p type="p">232:第一硬質刀片</p>
        <p type="p">232a:第一硬質刀片的切削挖掘面</p>
        <p type="p">233:第二硬質刀片</p>
        <p type="p">234:第三硬質刀片</p>
        <p type="p">Gap:錯開量</p>
        <p type="p">Pb:中心刀頭的中心位置</p>
        <p type="p">Pc:旋轉中心位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1746" publication-number="202619574">
    <tif-files tif-type="multi-tif">
      <tif file="114126695.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126695</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路和設計包括多個胞元的積體電路的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND METHOD OF DESIGNING AN INTEGRATED CIRCUIT COMPRISING A PLURALITY OF CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260202B">H10D89/10</main-classification>
        <further-classification edition="202001120260202B">G06F30/39</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃殷珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, EUNJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋東衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, DONGHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了積體電路和設計包括多個胞元的積體電路的方法。積體電路包括：佈置在基底的前側上的多個裝置；第一背側圖案和第二背側圖案，其中第一背側圖案和第二背側圖案在第一背側配線層中沿著第一軌道在第一方向上延伸，其中第一背側配線層在基底的背側上，以及其中第一背側圖案和第二背側圖案經組態以接收第一供應電壓並將第一供應電壓提供給多個裝置中的至少一個；以及第三背側圖案，位於第一背側圖案和第二背側圖案之間，在第一背側配線層中沿著第一軌道在第一方向上延伸，其中第三背側圖案經組態以接收源供應電壓並將源供應電壓提供給多個裝置的第一裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Integrated circuit and method of designing an integrated circuit comprising a plurality of cells are provided. An integrated circuit comprising: a plurality of devices arranged on a front side of a substrate; a first backside pattern and a second backside pattern, wherein the first backside pattern and the second backside pattern extend in a first direction along a first track in a first backside wiring layer, wherein the first backside wiring layer is on a back side of the substrate, and wherein the first backside pattern and the second backside pattern are configured to receive a first supply voltage and provide the first supply voltage to at least one of the plurality of devices; and a third backside pattern extending in the first direction along the first track between the first backside pattern and the second backside pattern, in the first backside wiring layer, wherein the third backside pattern is configured to receive a source supply voltage and provide the source supply voltage to a first device of the plurality of devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:佈局</p>
        <p type="p">BM1:第一背側配線層</p>
        <p type="p">BM11、BM12、BM13、BM14、BM15、BM16、BM17、BM18、BM19:背側圖案</p>
        <p type="p">C01:第一胞元</p>
        <p type="p">C02:第二胞元</p>
        <p type="p">C03:第三胞元</p>
        <p type="p">C04:第四胞元</p>
        <p type="p">C05:第五胞元</p>
        <p type="p">C05:第八胞元</p>
        <p type="p">C06:第六胞元</p>
        <p type="p">C07:第七胞元</p>
        <p type="p">C08:第八胞元</p>
        <p type="p">C09:第九胞元</p>
        <p type="p">C10:第十胞元</p>
        <p type="p">C11:第十一胞元</p>
        <p type="p">C12:第十二胞元</p>
        <p type="p">C13:第十三胞元</p>
        <p type="p">C14:第十四胞元</p>
        <p type="p">R1:第一列</p>
        <p type="p">R2:第二列</p>
        <p type="p">R3:第三列</p>
        <p type="p">R4:第四列</p>
        <p type="p">VDD:正供應電壓</p>
        <p type="p">RVDD:正源供應電壓、源供應電壓</p>
        <p type="p">VSS:負供應電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1747" publication-number="202617496">
    <tif-files tif-type="multi-tif">
      <tif file="114126723.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三輪折疊式自行車</chinese-title>
        <english-title>THREE-WHEEL FOLDING BICYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260124B">B62J25/04</main-classification>
        <further-classification edition="201301120260124B">B62K5/02</further-classification>
        <further-classification edition="200601120260124B">B62K15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商歐梅薩公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORMESA S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅尼奇尼　奇亞拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENICHINI, CHIARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種三輪自行車（100），其包含一框架（1），該框架具有一降低的腳踏板（10），該降低的腳踏板在該三輪自行車之該框架（1）之一中央下部位置中安置在踏板（3）前方，以使使用者將一個腳擱置在該降低的腳踏板（10）上；該降低的腳踏板（10）包含連接至該框架之一前管（12）之一前部元件（4）、連接至該框架之一後管（14）之一後部元件（5），以及將該前部元件（4）連接至該後部元件（5）之一鉸鏈（6）；該鉸鏈（6）具有一豎直旋轉軸（Z），使得該前部元件（4）可相對於該後部元件（5）旋轉，從而使該降低的腳踏板（10）自一閉合操作位置移動至一打開非操作位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-wheel bicycle (100) comprises a frame (1) with a lowered footboard (10) disposed in front of the pedals (3) in a central lower position of the frame (1) of the three-wheel bicycle to let the user to rest one foot on the lowered footboard (10); the lowered footboard (10) comprises a front element (4) connected to a front tube (12) of the frame, a rear element (5) connected to a rear tube (14) of the frame, and a hinge (6) connecting the front element (4) to the rear element (5); said hinge (6) has a vertical axis of rotation (Z) so that the front element (4) can rotate relative to the rear element (5), moving the lowered footboard (10) from a closed operating position to an open non-operating position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:框架</p>
        <p type="p">2:前輪</p>
        <p type="p">3:踏板</p>
        <p type="p">4:前部元件</p>
        <p type="p">5:後部元件</p>
        <p type="p">6:鉸鏈</p>
        <p type="p">10:降低的腳踏板</p>
        <p type="p">12:前管</p>
        <p type="p">13:豎直管</p>
        <p type="p">14:後管</p>
        <p type="p">15:水平管</p>
        <p type="p">16:豎直管</p>
        <p type="p">17:套筒</p>
        <p type="p">20:後輪</p>
        <p type="p">21:輪轂</p>
        <p type="p">22:軸</p>
        <p type="p">30:傳動裝置</p>
        <p type="p">31:齒輪</p>
        <p type="p">32:小齒輪</p>
        <p type="p">43:膜</p>
        <p type="p">100:三輪自行車</p>
        <p type="p">M:把手</p>
        <p type="p">S:鞍座</p>
        <p type="p">Z:豎直旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1748" publication-number="202618434">
    <tif-files tif-type="multi-tif">
      <tif file="114126727.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射型光罩空白基板、及反射型光罩的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260128B">G03F1/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[解決手段]一種反射型光罩空白基板，其具備：基板、反射曝光光的多層反射膜、多層反射膜的保護膜、及吸收曝光光並具有相位移功能的光吸收膜，光吸收膜含有80至90原子%的釕(Ru)、5至15原子%的鉭(Ta)、及10原子%以下的氮(N)，且不含有氧(O)，光吸收膜的厚度為38至50nm，光吸收膜之相對於曝光光的反射率為10至14%，相對於曝光光的相位差為205至225度。  &lt;br/&gt;　　[效果]作為反射型光罩時，可提供具有晶圓轉印特性高(NILS之值大)、遮蔽效應之影響小之更薄的光吸收膜之反射型光罩空白基板，例如，在晶圓上之經微細化的線與間距圖案中，可得到賦予良好的圖案之高晶圓轉印特性(NILS)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:多層反射膜</p>
        <p type="p">3:保護膜</p>
        <p type="p">4:光吸收膜</p>
        <p type="p">100:反射型光罩空白基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1749" publication-number="202618303">
    <tif-files tif-type="multi-tif">
      <tif file="114126732.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造具有針孔之薄玻璃基板的方法以及對應系統及總成</chinese-title>
        <english-title>METHODS OF MANUFACTURING THIN GLASS SUBSTRATES WITH PINHOLES, AND CORRESPONDING SYSTEMS AND ASSEMBLIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G01R1/073</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡岭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代尼卡　馬叔強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEJNEKA, MATTHEW JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許博峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　興華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施勒德三世　喬瑟夫法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER III, JOSEPH FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種製造一外殼基板之方法。該方法包含提供包含玻璃之基板區段，並且該等基板區段中之各基板區段具有小於約1.5毫米的一厚度。該方法亦包含：在該等基板區段中之各基板區段中形成針孔；堆疊該等基板區段以使得該等針孔對準；在堆疊該等基板區段時，在鄰近基板區段之間的一個或多個容積中提供一黏著材料；及固結該等基板區段與該黏著材料以形成該外殼基板。該外殼基板具有約4毫米或更大之一總厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a housing substrate is provided. The method comprises providing substrate sections comprising glass, and each substrate section of the substrate sections has a thickness of less than about 1.5 millimeters. The method also comprises forming pinholes in each substrate section of the substrate sections, stacking the substrate sections so that the pinholes align, providing an adhesive material in one or more volumes between adjacent substrate sections when the substrate sections are stacked, and consolidating the substrate sections and the adhesive material to form the housing substrate. The housing substrate has an overall thickness of about 4 millimeters or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1750" publication-number="202619500">
    <tif-files tif-type="multi-tif">
      <tif file="114126767.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合接合記憶體及邏輯裝置</chinese-title>
        <english-title>HYBRID BONDED MEMORY AND LOGIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260127B">H10B80/00</main-classification>
        <further-classification edition="200601120260127B">H01L23/00</further-classification>
        <further-classification edition="200601120260127B">H01L25/00</further-classification>
        <further-classification edition="202301120260127B">H01L25/065</further-classification>
        <further-classification edition="202301120260127B">H01L25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈　虹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦利葉　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARIOT, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特卡　拉杰詡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATKAR, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種接合結構被揭示。所述接合結構可包含基板。所述接合結構可包含第一記憶體單元，其設置在所述基板上。所述第一記憶體單元可具有第一記憶體晶粒堆疊、以及設置在第一堆疊上的第一邏輯控制器。所述第一邏輯控制器可以管理傳遞往返所述第一記憶體晶粒堆疊的資料。所述接合結構亦可包含處理器晶粒，其沿著接合介面混合接合至所述第一記憶體單元、以及垂直互連，其將所述基板連接至所述處理器晶粒。所述接合結構可進一步包含第二記憶體單元，其設置在所述基板上。所述第二記憶體單元可包含第二記憶體晶粒堆疊、以及設置在第二堆疊上的第二邏輯控制器。所述第二邏輯控制器可以管理傳遞往返所述第二記憶體晶粒堆疊的資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonded structure is disclosed. The bonded structure can include a substrate. The bonded structure can include a first memory unit disposed on the substrate. The first memory unit can have a first stack of memory dies and a first logic controller disposed on the first stack. The first logic controller can manage data communicated to or from the first stack of memory dies. The bonded structure can also include a processor die hybrid bonded to the first memory unit along a bonding interface and a vertical interconnect connecting the substrate to the processor die. The bonded structure can further include a second memory unit disposed on the substrate. The second memory unit can include a second stack of memory dies and a second logic controller disposed on the second stack. The second logic controller can manage data communicated to or from the second stack of memory dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:接合結構</p>
        <p type="p">202:基板</p>
        <p type="p">203:記憶體晶粒</p>
        <p type="p">204:記憶體單元</p>
        <p type="p">204a:第一記憶體單元</p>
        <p type="p">204b:第二記憶體單元</p>
        <p type="p">205:邏輯控制器</p>
        <p type="p">205a:第一邏輯控制器</p>
        <p type="p">205b:第二邏輯控制器</p>
        <p type="p">206:垂直互連單元</p>
        <p type="p">207:囊封體</p>
        <p type="p">208:導電凸塊</p>
        <p type="p">210:處理器晶粒</p>
        <p type="p">211:第一側</p>
        <p type="p">212:接合層</p>
        <p type="p">213:第二側</p>
        <p type="p">214:散熱器</p>
        <p type="p">215:接合介面</p>
        <p type="p">216:底膠填充</p>
        <p type="p">220:層</p>
        <p type="p">220a:基底層</p>
        <p type="p">220b:第二層</p>
        <p type="p">220c...220n:額外層</p>
        <p type="p">222:垂直互連</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1751" publication-number="202617489">
    <tif-files tif-type="multi-tif">
      <tif file="114126769.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用在產品儲存設備的多目的揀選推車</chinese-title>
        <english-title>MULTI-PURPOSE PICK CARTS FOR USE AT PRODUCT STORAGE FACILITIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B62B3/14</main-classification>
        <further-classification edition="202401120260126B">G06Q10/08</further-classification>
        <further-classification edition="200601120260126B">B62B3/00</further-classification>
        <further-classification edition="200601120260126B">B62B3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛波提克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMBOTIC LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福斯奈特　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSNIGHT, WILLIAM J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅謝爾　德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHELLE, DEVIN W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蘭特　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANT, ALAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃赫斯特　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARHURST, JULIAN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種推車，用於在產品儲存設備處運送複數個物品。此推車包括：車架；輪子，安裝至車架並支撐此車架；至少一個支撐構件，安裝至車架，並建構為支撐於其上的常溫物品；冷藏隔間，安裝至車架及至少一個支撐構件之至少一者，並建構為在其中儲存低溫物品；及冷凍隔間，安裝至車架及至少一個支撐構件的至少一者，並建構為於其中儲存冷凍物品</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cart, for transporting a plurality of items at a product storage facility, is provided. The cart includes: a frame; wheels mounted to and supporting the frame; at least one support member mounted to the frame and configured to support ambient-temperature items thereon; a refrigerator compartment mounted to at least one of the frame and the at least one support member and configured to store chilled items therein; and a freezer compartment mounted to at least one of the frame and the at least one support member and configured to store frozen items therein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:揀選推車</p>
        <p type="p">104b-104c:輪子</p>
        <p type="p">105:儲存隔間</p>
        <p type="p">106a:頂部支撐構件</p>
        <p type="p">106b:中間支撐構件</p>
        <p type="p">106c:底部支撐構件</p>
        <p type="p">107:儲存隔間</p>
        <p type="p">131:指示器</p>
        <p type="p">200:產品儲存設備</p>
        <p type="p">202:產品儲存結構</p>
        <p type="p">215:工作站</p>
        <p type="p">216:揀選區域</p>
        <p type="p">218:揀選區域</p>
        <p type="p">220:袋子</p>
        <p type="p">224:裝袋站</p>
        <p type="p">225:操作員</p>
        <p type="p">226:指示器</p>
        <p type="p">232:搬運箱</p>
        <p type="p">235:機器人</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1752" publication-number="202618304">
    <tif-files tif-type="multi-tif">
      <tif file="114126774.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電性連接裝置</chinese-title>
        <english-title>ELECTRICAL CONNECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01R1/073</main-classification>
        <further-classification edition="200601120260202B">G01R1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横内匡俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOUCHI, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福士直城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅田竜一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEDA, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈良勇斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電性連接裝置，係具備：探針，係前端部與檢查對象物接觸；配線基板，係於面對探針之基端部的第一表面配置有表面電極配線；及探針墊，係配置於第一表面。探針墊係於沿著厚度方向貫穿表面電極配線之貫穿孔的內側中，以與表面電極配線隔開的方式配置。探針的基端部係連接於表面電極配線與探針墊中的任一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connection device according to the present invention includes a probe whose tip contacts an object to be tested, a wiring board with surface electrode wiring arranged on its first surface that faces the base end of the probe, and a probe pad arranged on the first surface. The probe pad is located inside a through-hole that penetrates the surface electrode wiring in the thickness direction, and is spaced apart from the surface electrode wiring. The base end of the probe is connected to either the surface electrode wiring or the probe pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電性連接裝置</p>
        <p type="p">2:檢查對象物</p>
        <p type="p">10G:接地探針</p>
        <p type="p">10S:信號探針</p>
        <p type="p">10V:電源探針</p>
        <p type="p">20:探針導板</p>
        <p type="p">30:配線基板</p>
        <p type="p">31B:表面電極配線</p>
        <p type="p">31P:探針墊</p>
        <p type="p">32:電極端子</p>
        <p type="p">33B:內部電極配線</p>
        <p type="p">34B:接觸通孔</p>
        <p type="p">200:導板孔</p>
        <p type="p">300:貫穿孔</p>
        <p type="p">301:第一表面</p>
        <p type="p">302:第二表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1753" publication-number="202619612">
    <tif-files tif-type="multi-tif">
      <tif file="114126779.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126779</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及包括顯示裝置之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260127B">H10K59/123</main-classification>
        <further-classification edition="201601120260127B">G09G3/3225</further-classification>
        <further-classification edition="202301120260127B">H10K59/122</further-classification>
        <further-classification edition="202301120260127B">H10K59/131</further-classification>
        <further-classification edition="202301120260127B">H10K59/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEGYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宰溶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JAEYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭珉在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, MIN-JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種顯示裝置，其包括發光元件及連接到發光元件的像素驅動電路。發光元件連接在用於接收第一電源電壓的第一電源線與第一節點之間。像素驅動電路包括驅動電晶體及複數個開關電晶體。驅動電晶體為N型電晶體，且複數個開關電晶體中的至少一者為P型電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is provided that includes a light emitting element and a pixel drive circuit connected to the light emitting element. The light emitting element is connected between a first power line configured to receive a first power voltage and a first node. The pixel drive circuit includes a drive transistor and a plurality of switching transistors. The drive transistor is an N-type transistor, and at least one of the plurality of switching transistors is a P-type transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AE:陽極</p>
        <p type="p">CE:陰極</p>
        <p type="p">Chold,Cst:電容器</p>
        <p type="p">DLj:資料線</p>
        <p type="p">ELVDD:第一電源</p>
        <p type="p">ELVSS:第二電源</p>
        <p type="p">EM1,EM2:發光訊號</p>
        <p type="p">EML1i,EML2i:發光控制線</p>
        <p type="p">GC,GR,GW:掃描訊號</p>
        <p type="p">GCLi,GRLi,GWLi:掃描線</p>
        <p type="p">LD:發光部</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">N3:第三節點</p>
        <p type="p">PCij:像素驅動電路</p>
        <p type="p">PL1:第一電源線</p>
        <p type="p">PL2:第二電源線</p>
        <p type="p">PXij:像素</p>
        <p type="p">T1:第一電晶體</p>
        <p type="p">T2:第二電晶體</p>
        <p type="p">T3:第三電晶體</p>
        <p type="p">T4:第四電晶體</p>
        <p type="p">T5:第五電晶體</p>
        <p type="p">T6:第六電晶體</p>
        <p type="p">Vcint:初始化電壓</p>
        <p type="p">Vdata:資料訊號</p>
        <p type="p">VL1:參考電壓線</p>
        <p type="p">VL2:第一初始化電壓線</p>
        <p type="p">Vref:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1754" publication-number="202617888">
    <tif-files tif-type="multi-tif">
      <tif file="114126842.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於降低材料硬度和／或減少從熱界面材料遷移的材料的擴散的包括矽烷偶合劑的熱界面材料</chinese-title>
        <english-title>THERMAL INTERFACE MATERIALS INCLUDING SILANE COUPLING AGENTS FOR DECREASING MATERIAL HARDNESS AND/OR FOR REDUCING SPREADING OF MATERIAL(S) MIGRATING FROM THE THERMAL INTERFACE MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08L83/07</main-classification>
        <further-classification edition="201801120260202B">C08K3/013</further-classification>
        <further-classification edition="200601120260202B">C08K3/22</further-classification>
        <further-classification edition="200601120260202B">C08K5/5419</further-classification>
        <further-classification edition="200601120260202B">C09K5/14</further-classification>
        <further-classification edition="200601120260202B">H05K7/20</further-classification>
        <further-classification edition="200601120260202B">H05K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商天津萊爾德電子材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIANJIN LAIRD TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀蘭迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LANDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雪峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, XUEFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了用於降低材料硬度和/或用於減少從其中遷移的材料的擴散(如果有的話)的包括矽烷偶合劑的示例性熱界面材料(廣義地講，複合物)。還公開了降低材料硬度和/或減少從複合物遷移的材料擴散(如果有的話)的示例性方法，所述複合物用於管理熱和/或電磁干擾(EMI)。在示例性具體實例中，複合物包含基質、基質內的一或多種功能性填料和基質內的矽烷偶合劑。基於複合物的總重量，複合物包含至少約0.5重量%的矽烷偶合劑，和/或複合物包含足以降低複合物硬度的矽烷偶合劑的量，使得複合物配置成具有高回復率和低壓縮力和/或減少從複合物遷移的材料(如果有的話)的擴散。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are exemplary thermal interface materials (broadly, composites) including silane coupling agents for decreasing material hardness and/or for reducing the spreading of material(s), if any, migrating therefrom. Also disclosed are exemplary methods of decreasing material hardness and/or reducing spreading of material(s), if any, migrating from composites useful for management of heat and/or electromagnetic interference (EMI). In exemplary embodiments, a composite comprises a matrix, one or more functional fillers within the matrix, and silane coupling agent within the matrix. The composite includes at least about 0.5 weight percent of the silane coupling agent based on a total weight of the composite, and/or the composite includes an amount of the silane coupling agent sufficient to decrease hardness of the composite such that the composite is configured to have a high recovery and low compression force and/or to reduce spreading of material(s), if any, migrating from the composite.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1755" publication-number="202617631">
    <tif-files tif-type="multi-tif">
      <tif file="114126843.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑄造材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C04B35/10</main-classification>
        <further-classification edition="200601120260202B">C04B35/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商黑崎播磨股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROSAKIHARIMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種能夠減輕施工時之作業負擔，且同時能夠不須乾燥步驟之鑄造材料。  &lt;br/&gt;　　作為解決手段，為提供一種鑄造材料，其係相對於耐火原料摻混物100質量%，將鋁酸鈣中選自CA、CA2及C12A7之一種以上以合計為0.05~1質量%來添加，並將乳酸鋁以0.1~1.2質量%之添加率來添加，且該耐火原料摻混物係含有氧化矽灰0.2~12質量%，及添加水後會引起再水化反應並硬化之耐火原料之反應性氧化鋁0.1~2質量%，殘餘部分為其他耐火原料所成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1756" publication-number="202618458">
    <tif-files tif-type="multi-tif">
      <tif file="114126874.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於校正影像之方法</chinese-title>
        <english-title>METHOD OF CORRECTING AN IMAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G03F7/20</main-classification>
        <further-classification edition="200601120260127B">G03H1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭基金會科研院所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STICHTING NEDERLANDSE WETENSCHAPPELIJK ONDERZOEK INSTITUTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭ＶＵ基金會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STICHTING VU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭阿姆斯特丹大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITEIT VAN AMSTERDAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹　包伊夫　亞歷　傑福瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEN BOEF, ARIE JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝根　馬克　康士坦　喬翰尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAGGEN, MARK CONSTANT JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維利加斯　洛佩茲　大衛　亞歷杭德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VILLEGAS LOPEZ, DAVID ALEJANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛曼　布拉姆　安東尼烏斯　杰拉杜斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOMANS, BRAM ANTONIUS GERARDUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高曼斯　湯瑪斯　馬丁努斯　柏圖斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOMMANS, THOMAS MARTINUS PETRUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布吉思　羅賓　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUIJS, ROBIN DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　沙伊克　西奧多羅斯　湯馬士　馬里納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN SCHAIJK, THEODORUS THOMAS MARINUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅姆維克　塔瑪拉　克里斯汀娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CROMWIJK, TAMARA CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種方法，其包含：基於經散射輻射獲得至少兩個信號，該經散射輻射來自一度量衡目標且由一度量衡系統之一輻射感測器偵測；獲得包含該至少兩個信號之相位的一第一資料集；自該第一資料集計算由一輻射感測器偵測之一信號之一強度值的一校正。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method comprising obtaining at least two signals based on scattered radiation from a metrology target and detected by a radiation sensor of a metrology system obtaining a first data set comprising the phases of the at least two signals calculating from the first data set a correction of an intensity value of a signal as detected by a radiation sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:df-DHM</p>
        <p type="p">1010:第一照明輻射光束</p>
        <p type="p">1011:第一經散射光束</p>
        <p type="p">1012:第一經散射光束之部分</p>
        <p type="p">1020:第二照明輻射光束</p>
        <p type="p">1021:第二經散射光束</p>
        <p type="p">1022:第二經散射光束之部分</p>
        <p type="p">1030:第一參考光束</p>
        <p type="p">1040:第二參考光束</p>
        <p type="p">1050:基板</p>
        <p type="p">1060:度量衡目標</p>
        <p type="p">1070:物鏡</p>
        <p type="p">1080:影像感測器</p>
        <p type="p">1090:處理單元</p>
        <p type="p">OA:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1757" publication-number="202618300">
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      <tif file="114126881.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高頻應用的包括接觸元件的探針卡</chinese-title>
        <english-title>PROBE CARD COMPRISING CONTACT ELEMENTS FOR HIGH-FREQUENCY APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01R1/067</main-classification>
        <further-classification edition="200601120260202B">G01R1/073</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商探針科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNOPROBE S. P. A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋托裡　裡卡爾多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VETTORI, RICCARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種用於測試待測器件的探針卡，其具有沿並排放置方向以彼此間的給定距離排列的多個接觸元件。接觸元件具有：介面端，被配置為將來自待測器件的信號傳輸至探針卡的信號傳輸線；主體部分；以及接觸部分，包括用於接觸待測器件的接觸墊的端部。接觸部分的端部沿第一軸線與介面端間隔開，並且沿不同於第一軸線的第二軸線測量的主體部分的尺寸被選擇為在相對於沿並排放置方向的接觸元件之間距離的50%和150%之間的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe card for testing a device under test is described, which has a plurality of contact elements arranged at a given distance from each other along a side by side placing direction. The contact elements have an interface end configured to transmit a signal coming from the device under test to a signal transmission line of the probe card, a body portion, and a contact portion comprising an end adapted to contact contact pads of the device under test. The end of the contact portion is spaced from the interface end along a first axis, and a dimension of the body portion measured along a second axis that is different from the first axis is selected in a range between 50% and 150% with respect to the distance between the contact elements along the side by side placing direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接觸元件</p>
        <p type="p">10a:接觸部分</p>
        <p type="p">10b:介面端</p>
        <p type="p">100:探針卡</p>
        <p type="p">150:柔性膜</p>
        <p type="p">160:印刷電路板</p>
        <p type="p">Dir:方向</p>
        <p type="p">Dis:距離</p>
        <p type="p">DUT:待測器件</p>
        <p type="p">DUTa:接觸墊</p>
        <p type="p">Fa:面</p>
        <p type="p">Fb:面</p>
        <p type="p">H-H:第一軸線</p>
        <p type="p">SW:半導體晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1758" publication-number="202618442">
    <tif-files tif-type="multi-tif">
      <tif file="114126915.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於呈現與由檢查系統發現的缺陷相關的資料的基於人工智慧的方法</chinese-title>
        <english-title>AN ARTIFICIAL INTELLIGENCE BASED METHOD FOR PRESENTING DATA RELATED TO DEFECTS DISCOVERED BY AN INSPECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260127B">G03F1/84</main-classification>
        <further-classification edition="200601120260127B">G01N21/88</further-classification>
        <further-classification edition="201901120260127B">G06N20/00</further-classification>
        <further-classification edition="200601120260127B">G06T11/20</further-classification>
        <further-classification edition="201701120260127B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶索迪　奧塔爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YESODI, ORTAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐法西　尤瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALFASSI, YUVAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴契爾　馬塞羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACHER, MARCELO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種呈現藉由檢查半導體晶圓或遮罩產生的缺陷資料的方法，該方法包括接收包括每缺陷的複數個屬性的缺陷資料，使用t-分佈隨機鄰點嵌入來將缺陷屬性從多維屬性空間嵌入到低維空間中，以及在2D顯示器上顯示嵌入到低維空間中的缺陷資料作為散點圖。一種用於檢查晶圓或遮罩的系統，該系統包括用於呈現藉由檢查晶圓或遮罩產生的缺陷資料的使用者介面，該使用者介面實施一種方法，該方法包括接收包括每缺陷的複數個屬性的缺陷資料，使用t-分佈隨機鄰點嵌入來將缺陷屬性從多維屬性空間嵌入到低維空間中，以及在2D顯示器上顯示嵌入到低維空間中的缺陷資料作為散點圖。亦描述了相關裝置和方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of presenting defects data produced by inspection of semiconductor wafers or masks, the method including receiving defect data including a plurality of attributes per defect, using t-distributed Stochastic Neighbor Embedding to embed the defects attributes from a multi-dimensional attribute space into a lower-dimension space, and displaying the defect data embedded into the lower-dimension space on a 2D display as a scatter plot. A system for inspecting wafers or masks, the system including a user interface for presenting defect data produced by inspection of wafers or masks, the user interface implementing a method including receiving defect data including a plurality of attributes per defect, using t-distributed Stochastic Neighbor Embedding to embed the defects attributes from a multi-dimensional attribute space into a lower-dimension space, and displaying the defects data embedded into the lower-dimension space on a 2D display as a scatter plot. Related apparatus and methods are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">602:缺陷資料</p>
        <p type="p">604:平面</p>
        <p type="p">606:散點圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1759" publication-number="202617805">
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      <tif file="114126933.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126933</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物及阻劑圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08F220/18</main-classification>
        <further-classification edition="200601120260126B">C08F220/28</further-classification>
        <further-classification edition="200601120260126B">C08F220/32</further-classification>
        <further-classification edition="200601120260126B">C08F220/36</further-classification>
        <further-classification edition="200601120260126B">G03F7/004</further-classification>
        <further-classification edition="200601120260126B">G03F7/039</further-classification>
        <further-classification edition="200601120260126B">G03F7/20</further-classification>
        <further-classification edition="200601120260126B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂卷拓治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMAKI, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角田力太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNODA, RIKITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種阻劑組成物，其含有藉由酸之作用而對顯影液之溶解性改變之基材成分(A)、藉由曝光產生酸之酸產生劑成分(B)與氟添加劑成分(F)，前述基材成分(A)包含高分子化合物(A1)，該高分子化合物(A1)具有說明書中記載之一般式(a1-1)所示之結構單元(a1)，及包含說明書中記載之一般式(a2-1)所示之含有內酯之環式基、含有-SO&lt;sub&gt;2&lt;/sub&gt;-之環式基或含有碳酸酯之環式基之任一者的結構單元(a2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1760" publication-number="202617532">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可堆疊運送箱及用於其之方法</chinese-title>
        <english-title>STACKABLE TOTE AND METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B65D21/032</main-classification>
        <further-classification edition="200601120260127B">B25J15/00</further-classification>
        <further-classification edition="200601120260127B">B65D21/02</further-classification>
        <further-classification edition="200601120260127B">B65G1/137</further-classification>
        <further-classification edition="200601120260127B">B65D25/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛波提克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMBOTIC LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜查姆　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUCHARME, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多納海　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONAGHEY, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽門　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMON, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於自動化儲存和取回系統的可堆疊運送箱。可堆疊運送箱包括一般截頭錐形的運送箱殼罩，具有在運送箱殼罩內形成空腔的壁。圍繞空腔之運送箱殼罩的頂部具有上緣，鄰接空腔的開口，上緣具有平坦表面以接觸且支撐自動化所接收的另一運送箱。離隙槽形成於上緣中，而形成用於自動地堆疊其他運送箱與可堆疊運送箱之機器人的手臂工具之末端的擒縱空間，以在標準棧板上形成具有標準高度的堆疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stackable tote for an automated storage and retrieval system. The stackable tote includes a tote casement of a general frustum shape with walls forming a void within the tote casement. A top of the tote casement surrounding the void has an upper rim, bounding an opening of the void, the upper rim having a flat surface for contacting and supporting another tote received by automation. A relief channel is formed in the upper rim forming an escapement space for an end of arm tool of a robot automatically stacking the other tote with the stackable tote to form a stack with a standard height on a standard pallet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">264,264A:破包貨物容器、可堆疊運送箱</p>
        <p type="p">264LD:加蓋容器、加蓋運送箱</p>
        <p type="p">264NL:無蓋運送箱</p>
        <p type="p">290~293:堆疊</p>
        <p type="p">300T:頂部</p>
        <p type="p">310:上緣</p>
        <p type="p">320:空腔</p>
        <p type="p">320P:開口</p>
        <p type="p">ESP:擒縱空間</p>
        <p type="p">LPAL:棧板裝載</p>
        <p type="p">PAL:棧板</p>
        <p type="p">PH:高度</p>
        <p type="p">PL:長度</p>
        <p type="p">PW:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1761" publication-number="202617778">
    <tif-files tif-type="multi-tif">
      <tif file="114126961.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126961</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙特異性抗體產品之連續製造製程</chinese-title>
        <english-title>CONTINUOUS MANUFACTURING PROCESS FOR BISPECIFIC ANTIBODY PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C07K16/28</main-classification>
        <further-classification edition="200601120260123B">C07K16/30</further-classification>
        <further-classification edition="200601120260123B">C12M3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歌梅茲　娜塔莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOMEZ, NATALIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辜達　雀潭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOUDAR, CHETAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯潘　羅西尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHPANDE, ROHINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克歐達里安　海地耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARKHORDARIAN, HEDIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於生產雙特異性抗體產品的連續上游製造製程，該雙特異性抗體產品包含至少兩個結合結構域。該製程至少包括以下步驟：(i) 在灌注生物反應器中提供能夠表現雙特異性抗體產品的至少一種哺乳動物細胞培養物，(ii) 以第一灌注速率培養該哺乳動物細胞培養物直至達到活細胞密度設定點，以及 (iii) 以第二灌注速率維持灌注培養，其中該生物反應器中的雙特異性抗體產品濃度保持低於閾值。然後將該雙特異性抗體產品進行後續下游加工。此外，本發明提供了藉由該連續上游製造製程生產的雙特異性抗體產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a continuous upstream manufacturing process for the production of bispecific antibody products, which comprise at least two binding domains. The process comprises at least the steps of (i) providing in a perfusion bioreactor at least one mammalian cell culture, which is capable of expressing the bispecific antibody product, (ii) growing the mammalian cell culture at a first perfusion rate until a set point viable cell density is reached, and (iii) maintaining perfusion culture at a second perfusion rate, wherein the bispecific antibody product concentration in the bioreactor is kept below a threshold value. The bispecific antibody product is then subject to subsequent downstream processing. Moreover, the invention provides a bispecific antibody product produced by the continuous upstream manufacturing process.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1762" publication-number="202618851">
    <tif-files tif-type="multi-tif">
      <tif file="114126967.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126967</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運作雙射束裝置的方法與對應的設備</chinese-title>
        <english-title>METHOD OF OPERATING A DUAL BEAM DEVICE AND CORRESPONDING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01J37/28</main-classification>
        <further-classification edition="200601120260202B">H01J37/30</further-classification>
        <further-classification edition="200601120260202B">H01J37/304</further-classification>
        <further-classification edition="200601120260202B">H01L21/66</further-classification>
        <further-classification edition="202301120260202B">H10B41/20</further-classification>
        <further-classification edition="202301120260202B">H10B43/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯柏　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORB, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種運作一雙射束裝置的方法。為了調整樣本相對於雙射束裝置的兩射束的交點的位置，使用了參考點的位置和樣本的地形資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of operating a charged particle beam device is provided. For adjusting a sample with respect to an intersection point of two beams of the dual beam device, a position for a reference point and topography information of the sample is used.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300、301、302:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1763" publication-number="202617822">
    <tif-files tif-type="multi-tif">
      <tif file="114127002.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物及電子零件裝置</chinese-title>
        <english-title>CURABLE COMPOSITION AND ELECTRONIC COMPONENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C08G59/24</main-classification>
        <further-classification edition="200601120260129B">C08L101/16</further-classification>
        <further-classification edition="200601120260129B">C08L63/00</further-classification>
        <further-classification edition="200601120260129B">C08F2/10</further-classification>
        <further-classification edition="200601120260129B">C08K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種硬化性組成物，包含生物質來源的硬化性成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A curable composition contains a curable component derived from biomass.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1764" publication-number="202617556">
    <tif-files tif-type="multi-tif">
      <tif file="114127011.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送設備</chinese-title>
        <english-title>TRANSPORT FACILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B65G43/00</main-classification>
        <further-classification edition="200601120260131B">B65G35/00</further-classification>
        <further-classification edition="200601120260131B">B65G1/04</further-classification>
        <further-classification edition="202401120260131B">G05D1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中芳孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">搬送設備100具備在可移動區1移動以搬送物品的複數台搬送車5、和用以控制搬送車5的控制系統。在可移動區1設有用以對搬送車5充電的複數個可充電地點4、和用以使搬送車5進行物品的交接的複數個可移載地點3。控制系統執行中繼搬送處理。在中繼搬送處理中，從複數個可移載地點3選擇中繼地點T，且從複數個可充電地點4選擇對第1搬送車5A進行充電的充電地點C。位於搬送車5的搬送路徑R內且最接近交付地點G的可移載地點3設定作為中繼地點T。充電地點C是從自中繼地點T起位於選擇範圍A2內的可充電地點4之中選擇。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transport facility includes a plurality of transport vehicles that travel in a travel area to transport articles, and a control system that controls the plurality of transport vehicles. The travel area includes a plurality of rechargeable points for recharging the plurality of transport vehicles, and a plurality of transfer points at each of which the plurality of transport vehicles transfer the articles. The control system performs a relay transport process. In the relay transport process, a relay point is selected from the plurality of transfer points, and a recharge point for recharging a first transport vehicle is selected from the plurality of rechargeable points. The relay point is a transfer point closest to the unload point on a transport path of the transport vehicle. The recharge point is selected from rechargeable points of the plurality of rechargeable points within a selection range from the relay point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可移動區</p>
        <p type="p">2:可移動路徑</p>
        <p type="p">3:可移載地點</p>
        <p type="p">4:可充電地點</p>
        <p type="p">5:搬送車</p>
        <p type="p">5A:第1搬送車</p>
        <p type="p">5B:第2搬送車</p>
        <p type="p">10:對象物品</p>
        <p type="p">21:主直線部</p>
        <p type="p">22:副直線部</p>
        <p type="p">23:直線部</p>
        <p type="p">24:分歧直線部</p>
        <p type="p">25:曲線部</p>
        <p type="p">26:合流部</p>
        <p type="p">27:分歧部</p>
        <p type="p">53:蓄電裝置</p>
        <p type="p">100:搬送設備</p>
        <p type="p">A2:選擇範圍</p>
        <p type="p">C:充電地點</p>
        <p type="p">F:順向</p>
        <p type="p">G:交付地點</p>
        <p type="p">R:搬送路徑</p>
        <p type="p">S:接收地點</p>
        <p type="p">T:中繼地點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1765" publication-number="202617837">
    <tif-files tif-type="multi-tif">
      <tif file="114127020.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜方法及成膜裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C08G77/18</main-classification>
        <further-classification edition="200601120260130B">C08F291/10</further-classification>
        <further-classification edition="200601120260130B">C23C16/42</further-classification>
        <further-classification edition="200601120260130B">C23C14/16</further-classification>
        <further-classification edition="200601120260130B">C23C14/14</further-classification>
        <further-classification edition="200601120260130B">H01L23/15</further-classification>
        <further-classification edition="200601120260130B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩下光秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASHITA, MITSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田晴心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, SEISHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;本發明旨在提供一種成膜方法及成膜裝置。  &lt;br/&gt;[解決手段]  &lt;br/&gt;一種成膜方法，依序包含：準備基板，其在表面之不同區域具有第1金屬膜與第1絕緣膜；使用第1分子結合劑，在該第1絕緣膜之表面與該第1金屬膜之表面兩者上形成第1結合膜；在該第1結合膜之表面上形成第2金屬膜，藉由該第1結合膜結合該第1絕緣膜與該第2金屬膜，並且藉由該第1結合膜結合該第1金屬膜與該第2金屬膜；以及藉由對該基板進行退火處理，在該第1結合膜與該第1金屬膜之界面及該第1結合膜與該第2金屬膜之界面產生擴散。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S105:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1766" publication-number="202618340">
    <tif-files tif-type="multi-tif">
      <tif file="114127066.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透鏡單元、相機模組、防反射膜、遮光構件的製造方法以及鏡筒的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B5/00</main-classification>
        <further-classification edition="202101120260127B">G02B7/02</further-classification>
        <further-classification edition="201501120260127B">G02B1/111</further-classification>
        <further-classification edition="202101120260127B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索馬龍股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂爪直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAZUME, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種有效去除入射到相機模組1的透鏡單元2上的不必要光的技術。將黏合劑樹脂設為A成分，將聚乙烯縮醛樹脂設為A1成分，將黑色材料設為B成分，黑色顏料和樹脂的複合物設為B1成分。相機模組1的透鏡單元2具有沿光軸方向X層疊的透鏡組，該透鏡組由透鏡41、43、45、47和49組成。在透鏡41和43之間、透鏡43和45之間以及透鏡47和49之間設置有墊片61、63、65。在作為墊片61、63、65本體的基材61a、63a、65a中的至少一個的、至少端面上層疊有防反射膜7。防反射膜7由樹脂組成物形成，至少包含A成分和B成分，A成分包含A1成分，B成分包含平均粒徑為2μm以上且6μm以下的B1成分。B成分相對於A成分的質量比為7以上且14以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:防反射膜</p>
        <p type="p">61、63、65:墊片(環狀遮光構件)</p>
        <p type="p">61a、63a、65a:墊片基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1767" publication-number="202617547">
    <tif-files tif-type="multi-tif">
      <tif file="114127073.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動倉庫</chinese-title>
        <english-title>AUTOMATED WAREHOUSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B65G1/04</main-classification>
        <further-classification edition="200601120260131B">B65G1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀江智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原步實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田昌重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, MASASHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在自動倉庫中，廊道4在相對於複數個Y方向軌道21的至少一部分的Y方向軌道21即對象Y方向軌道21T鄰接於Y方向第1側Y1的位置，配置成沿著X方向延伸，移動裝置5具備：支撐搬送車1的支撐台51、配置於支撐台51且可供搬送車1行走的支撐軌道52、及使支撐台51移動的移動機構53，在對象Y方向軌道21T與比廊道4更靠近Y方向第1側Y1的位置之間，設置有可供搬送車1沿著Y方向通行的通行路徑6，移動機構53構成為可使支撐台51朝相對於廊道4鄰接於Y方向第1側Y1的位置移動，以供搬送車1可在支撐軌道52與通行路徑6之間沿著Y方向通行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:搬送車</p>
        <p type="p">1T:對象搬送車</p>
        <p type="p">2:行走軌道</p>
        <p type="p">3:容置部</p>
        <p type="p">4:第1廊道(廊道)</p>
        <p type="p">5:移動裝置</p>
        <p type="p">6:通行路徑</p>
        <p type="p">8:第1支撐框架(支撐框架)</p>
        <p type="p">8a:支撐部</p>
        <p type="p">9:第2支撐框架</p>
        <p type="p">11:Y方向車輪</p>
        <p type="p">12:X方向車輪</p>
        <p type="p">21:Y方向軌道</p>
        <p type="p">21T:對象Y方向軌道</p>
        <p type="p">51:支撐台</p>
        <p type="p">52:支撐軌道</p>
        <p type="p">53:移動機構</p>
        <p type="p">81:第1支撐構件</p>
        <p type="p">82:第2支撐構件</p>
        <p type="p">531:升降部</p>
        <p type="p">F:樓層</p>
        <p type="p">P:基準位置</p>
        <p type="p">W:物品</p>
        <p type="p">Y:Y方向</p>
        <p type="p">Y1:Y方向第1側</p>
        <p type="p">Y2:Y方向第2側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1768" publication-number="202617623">
    <tif-files tif-type="multi-tif">
      <tif file="114127082.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板設備及方法</chinese-title>
        <english-title>SUBSTRATE APPARATUS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C03C17/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周立維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁智瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　安平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭廸揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, DIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板設備包含一材料層。該材料層之一第二主表面被層壓至一玻璃基板之一第一主表面。該材料層在該材料層之一第一側部分及/或一第二側部分中之至少一者中但不在該材料層之一中心部分中被形成有複數個表面不連續部。方法包含使該材料層之該第一側部分或該第二側部分中之至少一者形成有該複數個表面不連續部。方法進一步包含將該材料層之該第二主表面層壓至該玻璃基板之該第一主表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Substrate apparatus comprise a layer of material. A second major surface of the layer of material is laminated to a first major surface of a glass substrate. The layer of material is formed with a plurality of surface discontinuities in at least one of a first side portion and/or a second side portion of the layer of material but not a central portion of the layer of material. Methods comprise forming at least one of the first side portion or the second side portion of the layer of material with the plurality of surface discontinuities. Methods further comprise laminating the second major surface of the layer of material to the first major surface of the glass substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:視圖</p>
        <p type="p">101:基板設備</p>
        <p type="p">103:玻璃基板</p>
        <p type="p">105:材料層</p>
        <p type="p">205,219:第一側部分</p>
        <p type="p">209,223:第二側部分</p>
        <p type="p">214:第一主表面</p>
        <p type="p">217:第二主表面</p>
        <p type="p">301:不連續部/表面不連續部</p>
        <p type="p">303:平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1769" publication-number="202618228">
    <tif-files tif-type="multi-tif">
      <tif file="114127094.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測量力和／或扭矩的裝置</chinese-title>
        <english-title>DEVICE FOR MEASURING A FORCE AND/OR TORQUE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G01L1/04</main-classification>
        <further-classification edition="200601120260123B">G01L3/14</further-classification>
        <further-classification edition="200601120260123B">G01L1/14</further-classification>
        <further-classification edition="202001120260123B">G01L5/16</further-classification>
        <further-classification edition="200601120260123B">G01L1/24</further-classification>
        <further-classification edition="200601120260123B">G01L1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商諾拉機器人學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEURA ROBOTICS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴瑞特　艾蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARRETT, EAMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於測量力(F)和/或扭矩(M)的裝置(10)，其具有變形體(10)，該變形體(10)包括第一緊固元件(11)、沿方向(Z)與第一緊固元件(11)間隔開地佈置的第二緊固元件(12)和佈置在兩個緊固元件(11，12)之間的至少一個長度元件(15)，該長度元件(15)具有第一端(15a)、第二端(15b)和沿著縱向方向(R)的長度(L)，其中，作用於變形體(10)的力(F)或作用於變形體(10)的扭矩(M)導致長度元件(15)的變形，其中，在變形體(10)上，機械放大器(20)的驅動側輸入端(21)借助耦合元件(30)緊固，其中，在機械放大器(20)的從動側輸出端(22)佈置有測量標準件(25)，並且長度元件(15)的變形導致測量標準件(25)的運動，其中，測量標準件(25)的運動可以由掃描元件(40)檢測，其中，裝置(1)包括評估單元(70)，該評估單元(70)構成為評估由至少一個掃描元件(40)檢測的信號並據此計算作用於兩個緊固元件(11，12)之間的力(F)和/或扭矩(M)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a device (10) for measuring a force (F) and/or torque (M) with a deformation body (10), which comprises a first fastening element (11), a second fastening element (12) arranged spaced apart in a direction (Z) from the first fastening element (11) and at least one elongated element (15) arranged between the two fastening elements (11, 12) and comprising a first end (15a), a second end (15b) and a length (L) along a longitudinal direction (R), wherein a force (F) acting on the deformation body (10) or a torque (M) acting on the deformation body (10) leads to a deformation of the elongated element (15), wherein an input-side input (21) of a mechanical amplifier (20) is fastened to the deformation body (10) by means of a coupling element (30), wherein a material measure (25) is arranged on an output-side output (22) of the mechanical amplifier (20) and a deformation of the elongated element (15) leads to a movement of the material measure (25), wherein the movement of the material measure (25) can be detected by a scanning element (40), wherein the device (1) comprises an evaluation unit (70) which is designed to evaluate the signals detected by the at least one scanning element (40) and to calculate therefrom the forces (F) and/or torques (M) acting between the two fastening elements (11, 12).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1770" publication-number="202618932">
    <tif-files tif-type="multi-tif">
      <tif file="114127114.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127114</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>襯墊層之選擇性沉積</chinese-title>
        <english-title>SELECTIVE DEPOSITION OF LINER LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/32</main-classification>
        <further-classification edition="200601120260128B">H01L21/768</further-classification>
        <further-classification edition="200601120260128B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加達米迪　瓦姆西克里希納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADDAMEDI, VAMSHI KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克哈嘉　艾比杜亞西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAJA, ABDUL AZIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高立剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林吉瓦迪　卡爾提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLINJIVADI, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡利亞班　姆蘇庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALIAPPAN, MUTHUKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈德西卡爾巴斯德西　瓦希迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHODSI KARBASDEHI, VAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈維提　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAVERTY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了在半導體元件中沉積襯墊層的方法。在某些實施例中，該方法包含在基板上沉積包含碳的碳層，該基板具有至少一個特徵，包含側壁表面，及具有碳表面的碳層；以及相對於碳表面，在側壁表面上選擇性地沉積襯墊層。在其他實施例中，該方法包含相對於基板特徵的頂部第一部分，在基板特徵的底部第二部分上選擇性地沉積包括碳的碳層，該頂部第一部分具有側壁表面，該碳層具有碳表面；蝕刻該碳表面；以及在該頂部第一部分的側壁表面上沉積保形層，該保形層是相對於該碳表面選擇性地沉積在側壁表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing a liner layer in a semiconductor device are described. In some embodiments, the method includes depositing a carbon layer including carbon on a substrate, the substrate having at least one feature including a sidewall surface and the carbon layer having a carbon surface; and selectively depositing the liner layer on the sidewall surface over the carbon surface. In other embodiments, the method includes depositing a carbon layer comprising carbon in a bottom second portion of a substrate feature selectively over a top first portion of the substrate feature, the top first portion having a sidewall surface, the carbon layer having a carbon surface; etching the carbon surface; and depositing the conformal layer on the sidewall surface of the top first portion, the conformal layer deposited on the sidewall surface selectively over the carbon surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板</p>
        <p type="p">204:側壁表面</p>
        <p type="p">205:頂表面</p>
        <p type="p">210:碳層</p>
        <p type="p">211:碳表面</p>
        <p type="p">212:襯墊層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1771" publication-number="202617003">
    <tif-files tif-type="multi-tif">
      <tif file="114127120.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附接於遊戲圍欄之可摺疊式兒童支撐組件及包含其之系統</chinese-title>
        <english-title>COLLAPSIBLE CHILD SUPPORT ASSEMBLY ATTACHABLE TO A PLAY YARD AND SYSTEMS INCLUDING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">A47D9/00</main-classification>
        <further-classification edition="200601120260125B">A47D13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得Ｒ　塔基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETER R, TUCKEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬納森Ｍ　帕切拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN M, PACELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M, HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示內容係針對用於可摺疊並可透過單手使用摺疊的遊戲圍欄之可摺疊式上層物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed to collapsible topper for a play yard that is collapsible, and may be collapsed via one-handed use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:系統</p>
        <p type="p">8:框架</p>
        <p type="p">10:頂軌；遊戲圍欄頂軌；遊戲圍欄軌條</p>
        <p type="p">12:支腳</p>
        <p type="p">14:紡織品組件</p>
        <p type="p">20:可摺疊式上層物；上層物；兒童支撐組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1772" publication-number="202618859">
    <tif-files tif-type="multi-tif">
      <tif file="114127122.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻電源點火控制方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01J37/32</main-classification>
        <further-classification edition="200601120260202B">H05H1/24</further-classification>
        <further-classification edition="200601120260202B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市恒運昌真空技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN CSL VACUUM SCIENCE AND TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桂浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐亞海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝幸光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種射頻電源點火控制方法及系統，該方法應用於包括功率放大器的射頻電源，所述方法包括：控制所述功率放大器輸出高於目標功率的功率信號至腔室負載或輸入負載，以使所述腔室負載中的氣體過衝點火；在所述氣體點火成功後，控制所述功率放大器輸出預設目標功率範圍內的恆定功率信號至所述腔室負載或輸入負載。本發明通過控制功率放大器輸出超過目標功率的功率信號到腔室負載或輸入負載，實現了氣體過衝點火。一旦點火成功，它會調節功率放大器輸出恆定功率信號，以保持在預設目標功率範圍內，從而解決了點火成功率低的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S20:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1773" publication-number="202619468">
    <tif-files tif-type="multi-tif">
      <tif file="114127140.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127140</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於安裝構件的方法及可適合用於其的設備</chinese-title>
        <english-title>METHOD FOR MOUNTING COMPONENTS AND APPARATUS SUITABLE THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H05K13/04</main-classification>
        <further-classification edition="200601120260127B">H05K13/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商貝思瑞士股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESI SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯皮爾　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEER, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法林格　伯恩哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAHRINGER, BERNHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在使用設備（100）將構件接合在基板上時減少位置相關的放置誤差之方法，該設備具有安裝頭載體（200）、台車（210）及穿梭車（220），該穿梭車具有光學對準設備（400）及安裝頭（150），其中，穿梭車（220）在兩個位置之間的可重複運動能夠實現更高的定位精度/或定位速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:構件安裝設備</p>
        <p type="p">150:安裝頭</p>
        <p type="p">200:安裝頭載體</p>
        <p type="p">210:台車</p>
        <p type="p">215:台車編碼器</p>
        <p type="p">217:構件放置位置處的台車位置</p>
        <p type="p">220:穿梭車</p>
        <p type="p">225:穿梭車編碼器</p>
        <p type="p">230:穿梭車驅動器</p>
        <p type="p">250:台車驅動器</p>
        <p type="p">300:基板</p>
        <p type="p">400:光學對準設備</p>
        <p type="p">500:台車載體</p>
        <p type="p">600:構件</p>
        <p type="p">710:第一路徑長度</p>
        <p type="p">720:第二路徑長度</p>
        <p type="p">730:預設距離</p>
        <p type="p">800:構件放置位置</p>
        <p type="p">820:構件容置位置</p>
        <p type="p">840:組件位置</p>
        <p type="p">850:基板位置</p>
        <p type="p">910:第一軸(Y)</p>
        <p type="p">920:第二軸(X)</p>
        <p type="p">930:第三軸(Z)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1774" publication-number="202616973">
    <tif-files tif-type="multi-tif">
      <tif file="114127149.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓力分配側入式鞋類</chinese-title>
        <english-title>PRESSURE DISTRIBUTING SIDE ENTRY FOOTWEAR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">A43B23/02</main-classification>
        <further-classification edition="200601120260124B">A43C11/00</further-classification>
        <further-classification edition="200601120260124B">A43C11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAW, THOMAS J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAW, THOMAS J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露系統及方法，其包括提供一種鞋類物品，具有鞋底及耦接到鞋底的鞋面，鞋面包括足趾部、足跟部及開放內部。開放內部設置在足趾部與足跟部之間，且沒有形成鞋面的一部分的任何材料。開放內部在鞋面中提供開口，其允許使用者的足部的足趾以一角度向內滑入到足趾部中，在這之後可旋轉鞋類及/或使用者的足部的足跟，以令使用者的足部的足跟與足跟部接合。鞋類可選地包括開放外部及緊固機構，緊固機構進行關節連接以在使用者的足部上提供均勻的壓力分佈，用於使舒適性和穩定性最大化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods are disclosed that include providing an article of footwear having a sole and an upper coupled to the sole, the upper comprising a toe portion, a heel portion, and an open inner portion. The open inner portion is disposed between the toe portion and the heel portion and is void of any material that forms a portion of the upper. The open inner portion provides an opening in the upper that allows sliding the toes of a user’s foot inwardly at an angle into the toe portion, whereafter the footwear and/or the heel of a user’s foot can be rotated to engage the heel of the user’s foot with the heel portion. The footwear optionally includes an open outer portion and a fastening mechanism which articulates to provide even pressure distribution across a user’s foot for maximum comfort and stability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鞋類物品(鞋類)</p>
        <p type="p">102:鞋底</p>
        <p type="p">104:鞋床</p>
        <p type="p">106:鞋面</p>
        <p type="p">108:足趾部</p>
        <p type="p">110:足跟部</p>
        <p type="p">112:外部</p>
        <p type="p">114:內部</p>
        <p type="p">116:後部</p>
        <p type="p">118:可撓式側部</p>
        <p type="p">120:過渡部</p>
        <p type="p">122:緊固機構</p>
        <p type="p">124:第一緊固部件</p>
        <p type="p">126:第二緊固部件</p>
        <p type="p">128:耦接裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1775" publication-number="202619407">
    <tif-files tif-type="multi-tif">
      <tif file="114127184.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127184</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紅外線電漿光回收熱光伏打氫電漿電力產生器</chinese-title>
        <english-title>INFRARED PLASMA LIGHT RECYCLING THERMOPHOTOVOLTAIC HYDROGEN PLASMA ELECTRICAL POWER GENERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H05H1/24</main-classification>
        <further-classification edition="201401120260127B">H02S10/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商明亮光源能源公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRILLIANT LIGHT POWER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾斯　雷戴爾　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLS,RANDELL L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種電力產生器，其提供電力及熱功率之至少一者，該電力產生器包括：(i)至少一個反應單元，其用於涉及可藉由獨特分析及光譜特徵來識別之原子氫產物之反應；(ii)熔融金屬注入系統，其包括將熔融金屬流提供至該反應單元之諸如電磁泵的至少一個泵及接收該熔融金屬流的至少一個儲集器；及(iii)引燃系統，其包括電源，該電源將低電壓、高電流電能提供至至少一個熔融金屬流以引燃電漿，從而起始該反應之快速動力學及能量增益。在一些實施例中，該電力產生器可包括：(v)供應至該電漿之H&lt;sub&gt;2&lt;/sub&gt;及O&lt;sub&gt;2&lt;/sub&gt;源；(vi)熔融金屬回收系統；及(vii)電力轉換器，其能夠使用具有電漿光回收之聚光熱光伏打單元將從該單元中之電漿輸出之高功率光轉換為電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power generator is described that provides at least one of electrical and thermal power comprising (i) at least one reaction cell for reactions involving atomic hydrogen products identifiable by unique analytical and spectroscopic signatures, (ii) a molten metal injection system comprising at least one pump such as an electromagnetic pump that provides a molten metal stream to the reaction cell and at least one reservoir that receives the molten metal stream, and (iii) an ignition system comprising an electrical power source that provides low-voltage, high-current electrical energy to the at least one steam of molten metal to ignite a plasma to initiate rapid kinetics of the reaction and an energy gain. In some embodiments, the power generator may comprise: (v) a source of H&lt;sub&gt;2&lt;/sub&gt; and O&lt;sub&gt;2&lt;/sub&gt; supplied to the plasma, (vi) a molten metal recovery system, and (vii) a power converter capable of converting the high-power light output from plasma in the cell into electricity using concentrator thermophotovoltaic cells with plasma light recycling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5b4:光伏打(PV)窗腔室/PV窗腔/PV窗/圓頂/透明反應單元腔室或腔/黑體發射體</p>
        <p type="p">5b10:保持外殼或壁/外保持環</p>
        <p type="p">5b10a:內保持環</p>
        <p type="p">5b31c:基板</p>
        <p type="p">1013:T形螺栓圓頂夾箝/光伏打(PV)窗腔夾箝</p>
        <p type="p">1014:第一柱/襯套</p>
        <p type="p">1015:夾緊螺栓伸縮管</p>
        <p type="p">1016:基板夾緊機構延伸部</p>
        <p type="p">1017:第二柱</p>
        <p type="p">1018:夾箝彈簧</p>
        <p type="p">1019:墊圈及螺帽</p>
        <p type="p">1020:擰緊螺栓</p>
        <p type="p">1021:夾箝托架</p>
        <p type="p">1022:基板托架機構延伸部</p>
        <p type="p">1023:圓頂夾箝-托架突片</p>
        <p type="p">1024:托架螺栓</p>
        <p type="p">1025:托架彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1776" publication-number="202617058">
    <tif-files tif-type="multi-tif">
      <tif file="114127192.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理方法、電子設備及存儲介質</chinese-title>
        <english-title>METHOD FOR PROCESSING IMAGES, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">A61B3/12</main-classification>
        <further-classification edition="202201120250902B">G06V40/14</further-classification>
        <further-classification edition="202201120250902B">G06V40/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靜廣軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHING, KUANG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種影像處理方法、電子設備及存儲介質，所述方法包括：對眼底圖像進行血管提取，得到血管圖像；將所述血管圖像劃分為第一血管圖像和第二血管圖像；計算所述第一血管圖像中血管對應的像素點的第一參數，以及所述第二血管圖像中所述血管對應的像素點的第二參數；根據所述第一參數與所述第二參數，確定所述眼底圖像的圖像分類結果，所述圖像分類結果包括左眼圖像和右眼圖像。上述方法能夠減少眼底圖像的分類成本以及提高分類精度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for processing images, an electronic device, and a storage medium. The method includes: performing a vascular extraction on a fundus image, and obtaining a vascular image; dividing the vascular image into a first vascular image and a second vascular image; calculating a first parameter of pixel points corresponding to a vasculature in the first vascular image and a second parameter of the vascular corresponding to pixel points in the second vascular image; determining a image classification result of the fundus image based on the first parameter and the second parameter, the image classification result includes a left eye image and a right eye image. The method can effectively reduce classification cost of fundus images, and improve classification accuracy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S103:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1777" publication-number="202618450">
    <tif-files tif-type="multi-tif">
      <tif file="114127220.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微影圖案化基板之成像遮罩堆疊及方法</chinese-title>
        <english-title>IMAGING MASK STACKS AND METHODS FOR LITHOGRAPHICALLY PATTERNING A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G03F7/00</main-classification>
        <further-classification edition="200601120260128B">G03F7/004</further-classification>
        <further-classification edition="200601120260128B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>修里　里歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HULI, LIOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰伯利　坎達巴拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAPILY, KANDABARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮原孝広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAHARA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">如本文所述，本揭露內容提供以下者的諸多實施例：成像遮罩堆疊、產生成像遮罩堆疊之平台、以及使用成像遮罩堆疊對基板進行微影圖案化之方法。根據本揭露內容的成像遮罩堆疊包括於較厚遮罩層上或上方形成的較薄(例如5 nm或更薄)光敏感成像層，該較厚遮罩層具有顯著高於光敏感成像層的蝕刻選擇性(例如1:10或更高)。在一些實施例中，成像遮罩堆疊可包括一或更多額外薄膜層，例如第二光敏感成像層及/或敏感性增強層，其增強光敏感成像層內電磁輻射的吸收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides various embodiments of imaging mask stacks, platforms for producing an imaging mask stack, and methods for lithographically patterning a substrate using an imaging mask stack, as described herein. An imaging mask stack in accordance with the present disclosure includes a relatively thin (e.g., 5 nm or less) photosensitive imaging layer formed on or above a thicker mask layer having a significantly higher etch selectivity (e.g., 1:10 or more) than the photosensitive imaging layer. In some embodiments, the imaging mask stack may include one or more additional thin film layers, such as a second photosensitive imaging layer and/or a sensitivity enhancement layer, which enhances absorption of electromagnetic radiation within the photosensitive imaging layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">610、620、630、640:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1778" publication-number="202618973">
    <tif-files tif-type="multi-tif">
      <tif file="114127246.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製程化學品減排及回收的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PROCESS CHEMISTRY ABATEMENT AND RECYCLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/67</main-classification>
        <further-classification edition="200601120260127B">B01D53/053</further-classification>
        <further-classification edition="200601120260127B">B01J20/22</further-classification>
        <further-classification edition="200601120260127B">G01N21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧托　勞倫　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTTO, LAUREN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種處理系統，用於捕獲並回收來自半導體製造操作的製程氣體。該系統包含配置成處理基板的製程腔室，以及耦接於製程腔室並配置成移除來自製程腔室的製程廢氣的廢氣排放系統。包含第一金屬有機框架(MOF)容器的減排系統耦接於廢氣排放系統下游，其中第一MOF容器配置成捕獲製程廢氣的第一氣體物種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing system is provided for capturing and recycling process gases from semiconductor manufacturing operations. The system includes a process chamber configured to process a substrate and an exhaust system coupled to the process chamber and configured to remove process effluent from the process chamber. An abatement system including a first metal-organic framework (MOF) container is coupled downstream of the exhaust system, where the first MOF container is configured to capture a first gas species of the process effluent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理系統</p>
        <p type="p">12:多級過濾系統</p>
        <p type="p">14:減排系統</p>
        <p type="p">102:製程腔室</p>
        <p type="p">104:化學品供應系統</p>
        <p type="p">105:廢氣排放系統</p>
        <p type="p">112:氣流管線</p>
        <p type="p">113:過濾器</p>
        <p type="p">114:中和器</p>
        <p type="p">115:氟物種去除器</p>
        <p type="p">116a:第一上游閥、閥</p>
        <p type="p">116b:第一下游閥、閥</p>
        <p type="p">116c:第二上游閥、閥</p>
        <p type="p">116d:第二下游閥、閥</p>
        <p type="p">116e:旁通管線閥、旁通閥</p>
        <p type="p">116f:上游閥、閥</p>
        <p type="p">116g:上游閥、閥</p>
        <p type="p">118:壓力感測器</p>
        <p type="p">120a:第一MOF容器、MOF容器</p>
        <p type="p">120b:第二MOF容器、MOF容器</p>
        <p type="p">122:節流閥</p>
        <p type="p">126:粗泵浦</p>
        <p type="p">130:氣體出口</p>
        <p type="p">132:閥</p>
        <p type="p">134:法蘭</p>
        <p type="p">136:閥</p>
        <p type="p">140:旁通管線</p>
        <p type="p">142:第二處理管線</p>
        <p type="p">144:第一處理管線</p>
        <p type="p">150:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1779" publication-number="202617158">
    <tif-files tif-type="multi-tif">
      <tif file="114127252.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療病毒感染之方法及醫藥配方</chinese-title>
        <english-title>METHODS AND PHARMACEUTICAL FORMULATIONS FOR TREATING VIRAL INFECTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/551</main-classification>
        <further-classification edition="200601120260202B">A61K31/675</further-classification>
        <further-classification edition="200601120260202B">A61K9/20</further-classification>
        <further-classification edition="200601120260202B">A61K9/24</further-classification>
        <further-classification edition="200601120260202B">A61K47/38</further-classification>
        <further-classification edition="200601120260202B">A61K47/26</further-classification>
        <further-classification edition="200601120260202B">A61K47/32</further-classification>
        <further-classification edition="200601120260202B">A61K47/12</further-classification>
        <further-classification edition="200601120260202B">A61P31/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬桑德　娜塔莎　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASAND, NATASHA G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史佩格　黛安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPERGER, DIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供使用化合物1或其醫藥上可接受之鹽、化合物2或其醫藥上可接受之鹽治療及/或預防HIV感染的方法。本揭露進一步提供醫藥配方、特別是固體口服劑型，其包含化合物1或其醫藥上可接受之鹽、及化合物2或其醫藥上可接受之鹽。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="201px" width="310px" file="ed10104.JPG" alt="ed10104.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="404px" width="449px" file="ed10105.JPG" alt="ed10105.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides methods of treating and/or preventing HIV infections using a Compound 1, or a pharmaceutically acceptable salt thereof, a Compound 2, or a pharmaceutically acceptable salt thereof. The discourse further provides pharmaceutical formulations, particularly solid oral dosage forms comprising a Compound 1, or a pharmaceutically acceptable salt thereof, and a Compound 2, or a pharmaceutically acceptable salt thereof.&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="201px" width="292px" file="ed10106.JPG" alt="ed10106.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="411px" width="443px" file="ed10107.JPG" alt="ed10107.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1780" publication-number="202617005">
    <tif-files tif-type="multi-tif">
      <tif file="114127274.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附接於遊戲圍欄之可摺疊式兒童支撐組件及包含其之系統</chinese-title>
        <english-title>COLLAPSIBLE CHILD SUPPORT ASSEMBLY ATTACHABLE TO A PLAY YARD AND SYSTEMS INCLUDING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">A47D13/06</main-classification>
        <further-classification edition="200601120260125B">A47D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強納森Ｍ　帕塞拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN M, PACELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M, HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示內容係針對一種用於可摺疊的遊戲圍欄之可摺疊式頂部附件。該可摺疊式頂部附件也包括配置用於可拆卸地附接於該遊戲圍欄之一頂軌的一收納件殼體。該頂部附件也包括有可旋轉耦接到該收納件殼體的一對軌條的一框架。該頂部附件也包括一板材組件。該可摺疊式頂部附件具有使用配置，其中該框架和該板材組件並未折起，以及摺疊配置，其中該框架和該板材組件為折起。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed to a collapsible topper for a play yard that is collapsible. The collapsible topper also includes a receiver housing configured for removable attachment to a top rail of the play yard. The topper also includes a frame with a pair of rails rotatably coupled to the receiver housing. The topper also includes a board assembly. The collapsible topper has a use configuration, where the frame and the board assembly are not folded, and a collapsed configuration, where the frame and the board assembly are folded.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:系統</p>
        <p type="p">8:框架</p>
        <p type="p">10:頂軌；遊戲圍欄頂軌；遊戲圍欄軌條</p>
        <p type="p">12:支腳</p>
        <p type="p">14:紡織品組件</p>
        <p type="p">20:可摺疊式頂部附件；頂部附件；兒童支撐組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1781" publication-number="202617345">
    <tif-files tif-type="multi-tif">
      <tif file="114127302.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CMP製程用修整器與創成/監控拋光墊孔隙的方法與製程</chinese-title>
        <english-title>DRESSER FOR CMP PROCESS AND METHOD AND PROCESS FOR CREATING AND MONITORING POLISHING PAD PORES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260126B">B24B37/005</main-classification>
        <further-classification edition="201201120260126B">B24B53/017</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合盈光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>H.P.B. OPTOELECTRONICS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許玄岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSUAN-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙元慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, YUAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於CMP（化學機械平坦化）製程的修整器，以及一種生成與監控拋光墊孔隙的方法與製程。該修整器包含一基板、至少一片片狀體，與一模組化研磨單元。所述至少一片片狀體設置於該基板的一側面上，而模組化研磨單元則設置於該片狀體上。該模組化研磨單元由多個研磨單體所構成，這些研磨單體以間隔方式設置於片狀體上，且各研磨單體具有一凸出部。各該研磨單體的凸出部具備不同的高度。透過修整器中這些研磨單體的凸出部對拋光墊進行加工時，可於拋光墊表面形成具有局部等高與共平面特性之劃刻型溝槽結構；同時，透過各該研磨單體的次級凸部（次凸部），可在拋光墊上進一步形成側向形貌，達成孔隙的創成控制。本發明可有效保留拋光液，並有效控制修整器與拋光墊因受熱所產生的熱膨脹效應，改善傳統CMP製程中常見的表面紋理不均等問題，從而降低整體CMP製程的成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a conditioner for use in a CMP (Chemical Mechanical Polishing) process, and a method and process for generating and monitoring the porosity of a polishing pad. The conditioner comprises a substrate, at least one plate body, and a modular abrasive unit. The at least one plate body is disposed on one side of the substrate, and the modular abrasive unit is disposed on the plate body. The modular abrasive unit comprises a plurality of abrasive elements, which are spaced apart on the plate body, each having a protrusion. The protrusions of the abrasive elements have different heights. By polishing the polishing pad using the protrusions of the abrasive elements on the conditioner, localized iso-height and co-planar grooved structures are formed on the surface of the polishing pad. Additionally, secondary protrusions of the abrasive elements form lateral surface profiles on the polishing pad, thereby enabling the generation and control of pad porosity. This invention effectively retains the polishing slurry, and controls the thermal expansion caused by heat generated between the conditioner and the polishing pad, thereby improving surface texture uniformity and reducing the overall cost of the CMP process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:修整器</p>
        <p type="p">20:基板</p>
        <p type="p">30:片狀體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1782" publication-number="202617902">
    <tif-files tif-type="multi-tif">
      <tif file="114127303.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127303</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氧化物研磨組合物及研磨方法</chinese-title>
        <english-title>OXIDE POLISHING COMPOSITIONS AND POLISHING METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09G1/02</main-classification>
        <further-classification edition="200601120260202B">C09K3/14</further-classification>
        <further-classification edition="201201120260202B">B24B37/04</further-classification>
        <further-classification edition="200601120260202B">H01L21/304</further-classification>
        <further-classification edition="200601120260202B">H01L21/306</further-classification>
        <further-classification edition="200601120260202B">H01L21/3105</further-classification>
        <further-classification edition="200601120260202B">H01L21/762</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商慧盛材料美國責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSUM MATERIALS US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　曉波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, XIAOBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯　約瑟Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSE, JOSEPH D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕雷拉　克里希納Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURELLA, KRISHNA P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周鴻君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供淺溝隔離(STI)化學機械平坦化(CMP)研磨組合物、其使用方法和系統。該CMP研磨組合物包含二氧化鈰塗覆的無機氧化物顆粒磨料，例如二氧化鈰塗覆的二氧化矽；以及雙化學添加劑，用於提供可調式氧化物膜去除速率和可調式SiN膜去除速率，以及低氧化物溝槽淺盤效應和高氧化物：SiN選擇性。雙化學添加劑包含至少一種含聚矽氧與氟的化合物；以及至少一種具有多於一個羥基官能基的非離子有機分子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria coated inorganic oxide particles, such as ceria-coated silica; and dual chemical additives for providing the tunable oxide film removal rates and tunable SiN film removal rates and low oxide trench dishing and high oxide : SiN selectivity. Dual chemical additives comprise at least one silicone-and-fluorine containing compound; and at least one of non-ionic organic molecule having more than one hydroxyl functional group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1783" publication-number="202618974">
    <tif-files tif-type="multi-tif">
      <tif file="114127312.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像配方的自動建立</chinese-title>
        <english-title>AUTOMATIC CREATION OF AN IMAGING RECIPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/67</main-classification>
        <further-classification edition="202001120260127B">G06F30/30</further-classification>
        <further-classification edition="201701120260127B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫奇克　瓦迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUCHIK, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿布拉莫維茨　亞尼夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABRAMOVITZ, YANIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福克斯　丹圖維亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUCHS, DAN TUVIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿蘇林　伊塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASULIN, ITAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
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              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">提供了一種自動最佳化電子束工具影像配方的系統和方法。該方法包括獲取半導體關注取樣（SOI）的材料和結構特性；執行主束照射電子與該SOI之間互動的第一模擬，該模擬在各種主束配置下進行，以獲取電子逃逸分佈的極角和逃逸能量的映射；根據這些映射執行第二模擬，用以收集和偵測不同成像配置下的逃逸電子，以獲取在每個成像配置下對於該SOI上關注測量（MOI）的訊號剖面；並為該電子束工具建立影像配方，包括配置以達成該訊號剖面中該MOI最佳對比度的主束參數和工具影像參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for automatic optimization of an imaging recipe of an electron beam tool are provided. The method includes obtaining material and structural properties of a semiconductor specimen of interest (SOI); performing a first simulation of the interaction between irradiated electrons of a primary beam and the SOI at various primary beam configurations to obtain maps of escaped electron distribution in terms of polar angle and escape energy; performing, based on the maps, a second simulation of the collection and detection of escaped electrons at different imaging configurations to obtain a signal profile of a measurement of interest (MOI) on the SOI at each imaging configuration; and creating an imaging recipe for the electron beam tool, comprising primary beam parameters and tool imaging parameters configured to achieve optimal contrast of the MOI in the signal profile.</p>
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        <p type="p">202:步驟</p>
        <p type="p">204:步驟</p>
        <p type="p">206:步驟</p>
        <p type="p">208:步驟</p>
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          <doc-number>114127319</doc-number>
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        <chinese-title>光電轉換元件、光感測器、發電裝置及光電轉換方法</chinese-title>
        <english-title></english-title>
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        <main-classification edition="202301120260127B">H10K30/50</main-classification>
        <further-classification edition="202301120260127B">H10K30/60</further-classification>
        <further-classification edition="200601120260127B">C07D213/38</further-classification>
        <further-classification edition="202301120260127B">H10K85/60</further-classification>
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                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
          <applicant app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>國立研究開發法人理化學研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIKEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>岡本敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉本斯　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIBBONS, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>小川直毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村優男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MASAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>十倉好紀</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>TOKURA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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                <last-name>南出泰亜</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>MINAMIDE, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧田佑馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIDA, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤美紀子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MIKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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    <description>
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        <p type="p">本發明提供一種新穎之光電轉換元件，即便於室溫以上之高溫下，亦使藉由對光電轉換部之光入射所產生之載子之散射較少，從而能夠高效率地自光電轉換部提取由該載子之移動所產生之電流。  &lt;br/&gt;本發明之光電轉換元件具備：光電轉換部，其包含有機非線性光學材料，且不具有p-n接合；以及第1及第2電極，其等設置於上述光電轉換部，且隔開間隔配置；  &lt;br/&gt;上述光電轉換部於上述第1及第2電極之間以一致之方向極化，具有空間反轉對稱性被破壞之構造，藉此解決上述課題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
      </representative-img>
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  <tw-patent-application no="1785" publication-number="202617779">
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        <document-id>
          <doc-number>114127333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗PD-L1抗體及其於增進T細胞功能之用途</chinese-title>
        <english-title>ANTI-PD-L1 ANTIBODIES AND THEIR USE TO ENHANCE T-CELL FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C07K16/28</main-classification>
        <further-classification edition="200601120260123B">C12N15/13</further-classification>
        <further-classification edition="200601120260123B">A61K39/395</further-classification>
        <further-classification edition="200601120260123B">A61K31/7068</further-classification>
        <further-classification edition="200601120260123B">A61K39/00</further-classification>
        <further-classification edition="200601120260123B">A61P35/00</further-classification>
        <further-classification edition="200601120260123B">A61P31/00</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾賓　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRVING, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣　吉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEUNG, JEANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利哈　蘇非　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEHAR, SOPHIE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥爾　漢瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAECKER, HEATHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬森　山賈夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARIATHASAN, SANJEEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本申請案係關於一種抗PD-L1抗體，編碼其之核酸，其治療性組合物，及其用於增進T細胞功能以調升細胞介導之免疫反應及治療T細胞功能障礙病症(包括感染，例如急性及慢性感染，及腫瘤免疫)之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to anti-PD-L1 antibodies, nucleic acid encoding the same, therapeutic compositions thereof, and their use enhance T-cell function to upregulate cell-mediated immune responses and for the treatment of T cell dysfunctional disorders, including infection (e.g., acute and chronic) and tumor immunity.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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        <document-id>
          <doc-number>114127335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法，半導體裝置的製造方法，基板處理裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
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        <main-classification edition="200601120260130B">H01L21/768</main-classification>
        <further-classification edition="200601120260130B">H01L23/532</further-classification>
        <further-classification edition="200601120260130B">H01L23/522</further-classification>
        <further-classification edition="200601120260130B">C23C16/505</further-classification>
        <further-classification edition="200601120260130B">C23C16/34</further-classification>
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              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>三浦義𨺓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯浅和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUASA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>町田俊太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHIDA, SHUNTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種技術，其具備：  &lt;br/&gt;　　準備工序，其準備對於基板進行了光阻去除處理的狀態的基板，該基板是具有：有機層間絕緣膜、含有第一金屬的第一含金屬膜、設在前述第一含金屬膜與前述有機層間絕緣膜之間的第一擴散防止膜、以及形成於前述第一含金屬膜的側方的光阻；及  &lt;br/&gt;　　擴散防止膜形成工序，其在前述光阻去除處理中前述第一擴散防止膜的一部分被去除而形成的前述第一含金屬膜與前述有機層間絕緣膜之間的空間中形成第二擴散防止膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">115:晶舟升降機</p>
        <p type="p">115s:擋板開閉機構</p>
        <p type="p">121:控制器</p>
        <p type="p">201:處理室</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:反應管</p>
        <p type="p">207:加熱器</p>
        <p type="p">209:歧管</p>
        <p type="p">217:晶舟</p>
        <p type="p">218:隔熱板</p>
        <p type="p">219:密封蓋</p>
        <p type="p">219s:擋板</p>
        <p type="p">220a,220b,220c:O型環</p>
        <p type="p">231:排氣管</p>
        <p type="p">231a:排氣口</p>
        <p type="p">232a,232b,232c,232d,232e,232f,232g,232h:氣體供給管</p>
        <p type="p">241a,241b,241c,241d,241e,241f,241g,241h:MFC</p>
        <p type="p">243a,243b,243c,243d,243e,243f,243g,243h:閥門</p>
        <p type="p">244:閥門</p>
        <p type="p">245:壓力感測器</p>
        <p type="p">246:真空泵</p>
        <p type="p">248:集成型供給系統</p>
        <p type="p">249a,249b,249c:噴嘴</p>
        <p type="p">250a,250b,250c:氣體供給孔</p>
        <p type="p">255:旋轉軸</p>
        <p type="p">263:溫度感測器</p>
        <p type="p">267:旋轉機構</p>
        <p type="p">270:加熱器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1787" publication-number="202618179">
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      <tif file="114127336.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618179</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃燒裝置及控制方法</chinese-title>
        <english-title>COMBUSTION DEVICE AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">F23G5/50</main-classification>
        <further-classification edition="200601120260129B">F23J15/00</further-classification>
        <further-classification edition="200601120260129B">F23N5/00</further-classification>
        <further-classification edition="200601120260129B">F23L1/00</further-classification>
        <further-classification edition="201401120260129B">G01N21/3504</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工環境　化學工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES ENVIRONMENTAL &amp; CHEMICAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横井智記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOI, SATOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大丸卓一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIMARU, TAKUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西宮立享</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMIYA, TATSUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬戸口稔彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SETOGUCHI, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本研二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今田潤司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMADA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤芳久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百瀬大峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMOSE, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供降低NOx排出量之垃圾燒卻設備的控制方法。燃燒裝置，具備：火爐，其流入有燃燒後的氣體；一次燃燒室，其包含烘乾段、燃燒段、及後燃燒段，是一邊燃燒一邊搬運被燒卻物的爐本體，在將前述被燒卻物之搬運方向的上游側稱為前，將前述搬運方向之下游側稱為後的情況，具有：從前述火爐往前方延伸的前天花板部、從前述火爐往後方延伸的後天花板部、從前述後天花板部的後端部往下方延伸的後壁；二次燃燒室，其連接於前述一次燃燒室的出口側來設置，且具有二次燃燒用氣體供給噴嘴；光學計測裝置，其設置在前述一次燃燒室並檢測特定波長範圍的對象；以及裝置，其算出前述特定波長的對象的檢測位置，使前述檢測位置之未燃成分氣體的反應活化並促進NOx的產生，藉此使NOx濃度早期地增加，藉此使後續在還原區域的還原反應速度增加。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provide a control method for waste incineration facilities that reduces NOx emissions. A furnace body that includes a furnace into which gas after combustion flows, a drying stage, a combustion stage, and a post-combustion stage, and conveys incinerated materials while burning them, where the upstream side in the direction of conveying the incinerated materials is called the front side and the downstream side in the direction of conveying the materials is called the rear side. The primary combustion chamber has a front ceiling extending forward from the furnace, a rear ceiling extending rearward from the furnace, and a rear wall extending downward from the rear end of the rear ceiling. The secondary combustion chamber is connected to the outlet side of the primary combustion chamber and has a gas supply nozzle for secondary combustion. The combustion system has a primary combustion chamber, a secondary combustion chamber, and an optical measurement device for detecting objects in a specific wavelength band in the primary combustion chamber, and a means for calculating a detection position of a target of a specific wavelength and activating a reaction of unburned gas at the detection position to promote the generation of NOx, thereby increasing the NOx concentration at an early stage and thereby increasing the reduction reaction rate in the downstream reduction zone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:燃燒設備</p>
        <p type="p">2:控制裝置</p>
        <p type="p">3:燃燒爐</p>
        <p type="p">4:排熱回收鍋爐</p>
        <p type="p">5:減溫塔</p>
        <p type="p">6:集塵裝置</p>
        <p type="p">7:煙道</p>
        <p type="p">8:煙囪</p>
        <p type="p">20:供給機構</p>
        <p type="p">21:料斗</p>
        <p type="p">22:送料機</p>
        <p type="p">23:水分計測器</p>
        <p type="p">24:灑水裝置</p>
        <p type="p">30:爐本體</p>
        <p type="p">30a:烘乾段</p>
        <p type="p">30b:燃燒段</p>
        <p type="p">30c:後燃燒段</p>
        <p type="p">31:爐內溫度感測器</p>
        <p type="p">32:可見光攝影機</p>
        <p type="p">33:紅外線攝影機</p>
        <p type="p">35:爐內壓力感測器</p>
        <p type="p">40:爐床</p>
        <p type="p">40a:爐床面</p>
        <p type="p">41:火格子</p>
        <p type="p">43:排出通道</p>
        <p type="p">50a~50e:風箱</p>
        <p type="p">51a~51e:風箱壓力感測器</p>
        <p type="p">55:前天花板部</p>
        <p type="p">57:後天花板部</p>
        <p type="p">59:後壁</p>
        <p type="p">60:火爐</p>
        <p type="p">60a:前壁</p>
        <p type="p">60b:後壁</p>
        <p type="p">70:送風機構</p>
        <p type="p">71:送風機</p>
        <p type="p">71A:第1送風機</p>
        <p type="p">71B:第2送風機</p>
        <p type="p">72:一次空氣管線</p>
        <p type="p">73:空氣預熱器</p>
        <p type="p">73a:預熱溫度感測器</p>
        <p type="p">74:二次空氣管線</p>
        <p type="p">74a:第1供給口</p>
        <p type="p">74b:第2供給口</p>
        <p type="p">75:調節器</p>
        <p type="p">75a~75e:一次空氣調節器</p>
        <p type="p">75B:二次空氣調節器</p>
        <p type="p">76:空氣流量感測器</p>
        <p type="p">76A:第1空氣流量感測器</p>
        <p type="p">76B:第2空氣流量感測器</p>
        <p type="p">77:第1空氣壓力感測器</p>
        <p type="p">81:氣體感測器</p>
        <p type="p">91:第1EGR噴嘴</p>
        <p type="p">93:第2EGR噴嘴</p>
        <p type="p">97:角度調整機構</p>
        <p type="p">D:搬運方向</p>
        <p type="p">F:火焰</p>
        <p type="p">S:被燒卻物</p>
        <p type="p">V,V’:處理空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1788" publication-number="202619174">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127347</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有整合耦合、閂鎖、對準、電纜管理及防塵元件的模組化聯動連接器總成</chinese-title>
        <english-title>MODULAR GANGED CONNECTOR ASSEMBLIES WITH INTEGRATED COUPLING, LATCHING, ALIGNMENT, CABLE MANAGEMENT, AND DUST PROTECTION ELEMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01R13/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊維頓製造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVITON MANUFACTURING CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊格　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAGG, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴利　喬恩　克拉克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RILEY, JON CLARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聯動連接器系統促進資料中心環境中之高密度電纜安裝。該系統可包含具有對準特徵之模組化聯動連接器總成、一磁性輔助掣子及一推動螺釘耦合機構。該等對準特徵可促進搭接連接器之間之預對準，且該磁性掣子可在最終接合之前提供暫時保持。一螺紋推動螺釘總成可經由機械優勢施加一耦合力，使一單一安裝者能夠達成完全連接器搭接。插線面板總成可使用懸臂式卡扣托架保持前側及後側聯動連接器模組，且可支撐抽屜滑動機構以改良接達。額外元件可包含用於保護連接器端面之可移除防塵蓋及用於維持外殼內之光纖之彎曲半徑之內部電纜管理捲軸。綜上所述，此等特徵可簡化安裝、改良對準準確度、降低污染風險、且支援資料通訊系統中之聯動連接器之模組化維修。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ganged connector system facilitates high-density cabling installations in datacenter environments. The system can include modular ganged connector assemblies having alignment features, a magnetically assisted detent, and a push screw coupling mechanism. The alignment features can facilitate pre-alignment between mating connectors, and the magnetic detent can provide temporary retention prior to final engagement. A threaded push screw assembly can apply a coupling force via mechanical advantage, enabling a single installer to achieve full connector mating. Patch panel assemblies can retain front- and rear-side ganged connector modules using cantilevered snap-fit brackets and can support drawer slide mechanisms for improved access. Additional elements can include removable dust caps for protecting connector end faces and internal cable management spools for maintaining bend radii of optical fibers within the housing. Taken together, these features can simplify installation, improve alignment accuracy, reduce contamination risk, and support modular servicing of ganged connectors in data communication systems.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:聯動連接器裝置(GCA)</p>
        <p type="p">102:外殼</p>
        <p type="p">104:開口</p>
        <p type="p">106:連接器</p>
        <p type="p">120:界面側</p>
        <p type="p">130:後側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1789" publication-number="202618237">
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      <tif file="114127355.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618237</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於雷射光束焦散測量的裝置及方法以及雷射光束系統</chinese-title>
        <english-title>DEVICE AND METHOD FOR LASER BEAM CAUSTIC MEASUREMENT AND LASER BEAM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G01M11/02</main-classification>
        <further-classification edition="200601120260128B">G02B27/10</further-classification>
        <further-classification edition="200601120260128B">H01S3/00</further-classification>
        <further-classification edition="200601120260128B">H05G2/00</further-classification>
        <further-classification edition="200601120260128B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾哈德　斯特芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERHARD, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蘭森　維克多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANSON, VIKTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基寧格　克萊門斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIENINGER, CLEMENS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾特　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERDT, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈恩　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAHN, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於測量雷射光束之焦散參數之裝置包括用於將該雷射光束分離成至少三個空間分開的部分光束之光束分離器，以及用於偵測所述部分光束之影像之偵測單元。自該裝置之輸入端至該光束分離器的光束路徑定義該雷射光束之光束軸，該雷射光束沿該光束軸傳播直至進入該光束分離器。該光束分離器包括光學透鏡，及部分反射表面，該部分反射表面配置以藉由在該光學透鏡內之部分反射將該雷射光束分離成所述至少三個部分光束。該光學透鏡經離軸定位使得該光學透鏡之光軸離軸延伸至該光束軸，及/或該光學透鏡係傾斜的，使得該光學透鏡之該光軸與該光束軸形成從0°偏離之角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for measuring caustic parameters of a laser beam includes a beam splitter for splitting the laser beam into at least three spatially separated partial beams, and a detection unit for detecting images of the partial beams. A beam path from an input of the device to the beam splitter defines a beam axis for the laser beam, along which the laser beam propagates until entering the beam splitter. The beam splitter includes an optical lens, and a partially reflective surface configured to split the laser beam into the at least three partial beams by partial reflection within the optical lens. The optical lens is positioned off-axis such that an optical axis of the optical lens extends off-axis to the beam axis, and/or the optical lens is tilted such that the optical axis of the optical lens forms an angle with the beam axis that deviates from 0°.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:雷射光束系統</p>
        <p type="p">12:光束產生器</p>
        <p type="p">14:雷射光束</p>
        <p type="p">16、20:光學組合件</p>
        <p type="p">18:傳播方向</p>
        <p type="p">22:靶室</p>
        <p type="p">24:光束分離器</p>
        <p type="p">26:測量雷射光束</p>
        <p type="p">28:裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1790" publication-number="202618360">
    <tif-files tif-type="multi-tif">
      <tif file="114127375.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有導引結構及環繞包覆基質的光子晶片以及修改該光子晶片的方法</chinese-title>
        <english-title>PHOTONIC CHIP HAVING A GUIDING STRUCTURE AND A SURROUNDING CLADDING MATRIX, AND METHOD OF MODIFYING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B6/13</main-classification>
        <further-classification edition="200601120260127B">G02B6/122</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商菲姆圖姆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEMTUM INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝魯比　珍菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERUBE, JEAN-PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅比喬　路易斯拉斐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBICHAUD, LOUIS-RAFAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜瓦爾　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUVAL, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種用於修改光子晶片之方法，該光子晶片具有一導引結構及環繞該導引結構之一包覆基質，其中該導引結構及該包覆基質經組配用於在該光子晶片內導引一光模態。該方法通常包含：導引在該包覆基質之一部分內的一校正雷射光束之一焦點，該包覆基質之該部分與該導引結構間隔開且接近該導引結構，該校正雷射光束具有大於該包覆基質之一帶隙波長的一中心波長，其中，在該導引後，該包覆基質之該部分吸收該校正雷射光束之至多10個光子，藉此創建與該導引結構間隔開之一局部永久性基質改變，該永久性基質改變修改該導引結構之一有效折射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is described a method for modifying a photonic chip having a guiding structure and a cladding matrix surrounding the guiding structure, where the guiding structure and the cladding matrix are configured for guiding an optical mode within the photonic chip. The method generally has directing a focal point of a corrective laser beam within a portion of the cladding matrix, the portion of the cladding matrix being spaced away from and proximate to the guiding structure, the corrective laser beam having a central wavelength greater than a bandgap wavelength of the cladding matrix, wherein, upon said directing, the portion of the cladding matrix absorbs at most 10 photons of said corrective laser beam thereby creating a local permanent matrix change spaced apart from the guiding structure, the permanent matrix change modifying an effective refractive index of the guiding structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光子晶片</p>
        <p type="p">11:基體</p>
        <p type="p">12:導引結構</p>
        <p type="p">14:包覆基質</p>
        <p type="p">20:雷射誘發之永久性基質改變，永久性基質改變，局部永久性基質改變</p>
        <p type="p">20’:不同密度之區域，雷射誘發之永久性基質改變，局部永久性基質改變</p>
        <p type="p">100:系統</p>
        <p type="p">106:框架</p>
        <p type="p">110:校正雷射設備</p>
        <p type="p">112:校正雷射光束</p>
        <p type="p">114:焦點</p>
        <p type="p">120:光子晶片測試設備</p>
        <p type="p">130:電腦視覺設備</p>
        <p type="p">132:攝影機</p>
        <p type="p">150:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1791" publication-number="202619398">
    <tif-files tif-type="multi-tif">
      <tif file="114127378.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於隨機接取程序之通訊方法、終端裝置及網路裝置以及相關之非暫時性電腦程式產品</chinese-title>
        <english-title>COMMUNICATION METHOD, TERMINAL DEVICE AND NETWORK DEVICE FOR RANDOM ACCESS PROCEDURE AND NON-TRANSITORY COMPUTER PROGRAM PRODUCT RELATED THERETO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260122B">H04W74/08</main-classification>
        <further-classification edition="202301120260122B">H04W72/12</further-classification>
        <further-classification edition="200901120260122B">H04W28/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特爾提南　山繆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURTINEN, SAMULI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳春麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西伯爾　貝諾斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEBIRE, BENOIST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容之實施例係關於用於隨機接取程序之方法、裝置以及電腦可讀媒體。該方法包含：在一終端裝置處將一隨機接取程序中之一隨機接取請求傳輸至一網路裝置；回應於在該隨機接取程序中自該網路裝置接收到用於該終端裝置之一上行鏈路授予，判定由該上行鏈路授予指示之一第一資料單元的一第一大小是否匹配儲存於該終端裝置之一緩衝器中之一第二資料單元的一第二大小；回應於判定該第一大小不匹配該第二大小，判定該第二資料單元之用於後續傳輸之一第一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to methods, devices and computer readable mediums for random access procedure. The method comprises transmitting, at a terminal device, a random access request in a random access procedure to a network device; in response to receiving, in the random access procedure, from the network device an uplink grant for the terminal device, determining whether a first size of a first data unit indicated by the uplink grant matches a second size of a second data unit stored in a buffer of the terminal device; in response to determining that the first size mismatches the second size, determining a first part of the second data unit for subsequent transmissions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:實例方法</p>
        <p type="p">310、320、330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1792" publication-number="202618957">
    <tif-files tif-type="multi-tif">
      <tif file="114127401.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用表面檢測工具用於分析半導體晶圓缺陷之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR ANALYZING SEMICONDUCTOR WAFER DEFECTS USING SURFACE INSPECTION TOOLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/66</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡政焜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴德軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, TE-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴文源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, SAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧佩奇　大衛　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUPRECHT, DAVID JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分析一晶圓之一表面之方法包含：自一基於光之表面檢測工具接收由該表面檢測工具關於該晶圓之該表面產生之一第一資料集及由該表面檢測工具關於該晶圓之該表面產生之一第二資料集。該第一資料集對應於該表面檢測工具之一第一通道，並且該第二資料集對應於該表面檢測工具之一第二通道且不同於該第一資料集。該方法包含至少部分地基於該第一資料集及該第二資料集而判定該晶圓之該表面上是否存在一不良的表面缺陷，且基於該判定而對該晶圓進行分類。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of analyzing a surface of a wafer includes receiving, from a light based surface inspection tool, a first set of data produced by the surface inspection tool with respect to the surface of the wafer and a second set of data produced by the surface inspection tool with respect to the surface of the wafer. The first set of data corresponds to a first channel of the surface inspection tool and the second set of data corresponds to a second channel of the surface inspection tool and is different than the first set of data. The method includes determining whether or not an undesirable surface defect exists on the surface of the wafer based at least in part on the first set of data and the second set of data, and the wafer is sorted based on the determination.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:晶圓</p>
        <p type="p">400:表面檢測工具/工具</p>
        <p type="p">402:光</p>
        <p type="p">404:光</p>
        <p type="p">406:透鏡收集器</p>
        <p type="p">408:鏡</p>
        <p type="p">410:偵測器</p>
        <p type="p">412:橢球面鏡</p>
        <p type="p">414:偵測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1793" publication-number="202618991">
    <tif-files tif-type="multi-tif">
      <tif file="114127425.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於監測容器或容器組件狀態的方法以及檢查系統</chinese-title>
        <english-title>METHOD FOR MONITORING A STATE OF A CONTAINER OR CONTAINER COMPONENT, AND INSPECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/673</main-classification>
        <further-classification edition="201201120260127B">G03F1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布魯克斯自動化(德國)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩拉斯瓦圖拉　賈格迪什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARASWATULA, JAGDISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格魯柏　傑尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUBER, JANNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威德曼　烏度</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIDMANN, UDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於監測被調適及組配來固持晶圓或標線片之一容器(110)之一狀態之方法及檢查系統，該容器包含一本體(115)、一蓋體(120)及設置於該本體(115)上或該蓋體(120)上之一墊片(122)，該墊片(122)被組配及調適來確保該本體(115)與該蓋體(120)之間之一氣密密封，以提供在該容器(110)內之一封閉空間，其相對於一外側環境係氣密密封，該方法包含使該墊片(122)對比於一背景(106)成像，其中該墊片(122)及該背景(106)係設置有不同色彩及/或設置有不同圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method and inspection system for monitoring a state of a container (110) adapted and configured to hold wafers or reticles, the container comprising a body (115), a lid (120) and a gasket (122) provided on the body (115) or on the lid (120), the gasket (122) being configured and adapted to ensure a gas-tight seal between the body (115) and the lid (120) in order to provide a closed space within the container (110), which is gas-tightly sealed relative to an outside environment, the method comprising imaging the gasket (122) against a background (106), wherein the gasket (122) and the background (106) are provided with different colours and/or are provided with different patterns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢查系統</p>
        <p type="p">102:檢查腔室，腔室</p>
        <p type="p">104:開蓋器</p>
        <p type="p">106:背景，開蓋器板，物件</p>
        <p type="p">108:固持機構</p>
        <p type="p">110:容器，FOUP</p>
        <p type="p">115:本體，本體或殼罩</p>
        <p type="p">120:蓋體，物件</p>
        <p type="p">122:墊片，物件</p>
        <p type="p">130:照射手段</p>
        <p type="p">132:額外照射，額外照明，LED</p>
        <p type="p">150:攝影機，高解析度攝影機</p>
        <p type="p">152:評估單元</p>
        <p type="p">154:輪廓擷取單元</p>
        <p type="p">160:箭號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1794" publication-number="202617548">
    <tif-files tif-type="multi-tif">
      <tif file="114127467.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送設備</chinese-title>
        <english-title>TRANSPORT FACILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B65G1/04</main-classification>
        <further-classification edition="200601120260131B">B65G1/137</further-classification>
        <further-classification edition="200601120260131B">B65G43/08</further-classification>
        <further-classification edition="202401120260131B">G05D1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村和誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KAZUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種搬送設備1，具備搬送車2及供搬送車2行走之地板面31。搬送車2會搬送搬送對象物10。搬送車2具備在地板面31上滾動之車輪222、及用於辨識地板面31上的自身車位置的自身車位置辨識裝置23。搬送車2是構成為依據由自身車位置辨識裝置23所辨識之自身車位置的辨識結果，行走於從事先設定之可行走路徑23R之中選擇出之路徑。在車輪軌跡WT當中因與車輪222的摩擦所形成之摩耗會變得比其他處更大之特定處P配置有補強構件4。補強構件4具有耐摩耗性比地板面31更高之表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:搬送設備</p>
        <p type="p">2:搬送車</p>
        <p type="p">222:車輪</p>
        <p type="p">23:自身車位置辨識裝置</p>
        <p type="p">23R:可行走路徑</p>
        <p type="p">231:被檢測部</p>
        <p type="p">232:檢測部</p>
        <p type="p">3:搬送區</p>
        <p type="p">31:地板面</p>
        <p type="p">32:出庫工作站</p>
        <p type="p">33:入庫工作站</p>
        <p type="p">34:行走區</p>
        <p type="p">4:補強構件</p>
        <p type="p">10:搬送對象物</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">P:特定處</p>
        <p type="p">P1:第1特定處</p>
        <p type="p">P2:第2特定處</p>
        <p type="p">P3:第3特定處</p>
        <p type="p">W1:驅動輪</p>
        <p type="p">W2:從動輪</p>
        <p type="p">WT:車輪軌跡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1795" publication-number="202619100">
    <tif-files tif-type="multi-tif">
      <tif file="114127490.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種電源模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">H01L23/488</main-classification>
        <further-classification edition="200601120251230B">H01L23/48</further-classification>
        <further-classification edition="200601120251230B">H01L23/52</further-classification>
        <further-classification edition="200601120251230B">H01L23/36</further-classification>
        <further-classification edition="200601120251230B">H01L23/28</further-classification>
        <further-classification edition="202501120251230B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏佳佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秋凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種電源模組。本發明實施例的電源模組包括基板、至少一個電感結構和導熱結構。其中，基板的內部包括至少一個裸晶片，頂面設置有第一焊墊。電感結構設置於基板的頂面並透過第一焊墊與裸晶片電連接，電感結構包括磁芯。導熱結構至少多工處理電感結構的部分或為獨立結構，導熱結構包括形成在基板頂面與磁芯底面之間的第一部分、從磁芯底面延伸至磁芯頂面的第二部分和形成在磁芯頂面的第三部分，第一部分、第二部分和第三部分連接在一起。由此，透過形成並利用導熱結構作為裸晶片的導熱路徑，本發明實施例可以改善在將晶片嵌入到基板內部時，電源模組的散熱性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基板</p>
        <p type="p">12:電感結構</p>
        <p type="p">13:導熱結構</p>
        <p type="p">111:第一焊墊</p>
        <p type="p">112:第二焊墊</p>
        <p type="p">121:磁芯</p>
        <p type="p">122:繞組</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1796" publication-number="202618425">
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      <tif file="114127501.zip" no="1">
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          <doc-number>202618425</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於驅動電光顯示器的方法</chinese-title>
        <english-title>METHODS FOR DRIVING AN ELECTRO-OPTIC DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260126B">G02F1/167</main-classification>
        <further-classification edition="200601120260126B">G09G3/20</further-classification>
        <further-classification edition="200601120260126B">G01R27/02</further-classification>
        <further-classification edition="200601120260126B">H03K17/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾孟森　卡爾瑞蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMUNDSON, KARL RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　德平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIM, TECK PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克克萊瑞　麥可Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCREARY, MICHAEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉達瓦克　科斯塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LADAVAC, KOSTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RS</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於驅動電光顯示器的方法，該等電光顯示器包括：設置在一共用電極及一背板之間的電光材料。該背板包括一像素電極陣列，每個像素電極係耦接到一電晶體。一顯示控制器將波形施加到該等像素電極。該方法包括：將第一測量波形施加到第一部分像素電極。在該第一測量波形的每個訊框期間，相同的時間相依電壓係施加到該第一部分像素電極的每個像素電極。該方法包括：基於流經一電流測量電路的該電流的測量及在該第一測量波形期間施加到每個像素電極的該等時間相依電壓，判定鄰近該第一部分像素電極的該電光材料的阻抗，以及基於鄰近該第一部分像素電極的該電光材料的阻抗，選擇驅動波形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for driving electro-optic displays including electro-optic material disposed between a common electrode and a backplane. The backplane includes an array of pixel electrodes, each coupled to a transistor. A display controller applies waveforms to the pixel electrodes. The method includes applying first measurement waveforms to a first portion of the pixel electrodes. During each frame of the first measurement waveforms, the same time-dependent voltages are applied to each pixel electrode of the first portion of pixel electrodes. The method includes determining the impedance of the electro-optic material in proximity to the first portion of pixel electrodes based on a measurement of the current flowing through a current measurement circuit and the time-dependent voltages applied to each pixel electrode during the first measurement waveforms, and selecting driving waveforms based on the impedance of the electro-optic material in proximity to the first portion of pixel electrodes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:主動矩陣顯示器</p>
        <p type="p">602:墨水層</p>
        <p type="p">604:Vcom</p>
        <p type="p">606:電流測量電路</p>
        <p type="p">608:頂面電極</p>
        <p type="p">610:源極驅動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1797" publication-number="202617030">
    <tif-files tif-type="multi-tif">
      <tif file="114127560.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔基站、清潔系統、清潔部更換方法、清潔部清洗方法及電腦可讀存儲介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">A47L11/40</main-classification>
        <further-classification edition="200601120260125B">A47L11/282</further-classification>
        <further-classification edition="200601120260125B">A47L11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成盼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦運根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔基站用於容納清潔設備，清潔基站包括：基站本體和安裝於基站本體的驅動機構；換布機構與驅動機構傳動連接，能夠在驅動機構的驅動下相對於基站本體運動，使得換布機構能夠在更換位置、翻轉位置和收納位置之間運動其中，更換位置、翻轉位置和收納位置在基站本體的底面上的投影至少部分錯位設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔基站</p>
        <p type="p">110:基站本體</p>
        <p type="p">120:換布機構</p>
        <p type="p">130:驅動機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1798" publication-number="202617380">
    <tif-files tif-type="multi-tif">
      <tif file="114127565.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人系統及機器人系統的教示方法</chinese-title>
        <english-title>ROBOT SYSTEM AND ROBOT SYSTEM TEACHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B25J9/22</main-classification>
        <further-classification edition="200601120260131B">B25J9/16</further-classification>
        <further-classification edition="200601120260131B">B25J13/08</further-classification>
        <further-classification edition="200601120260131B">B25J19/02</further-classification>
        <further-classification edition="200601120260131B">G01N21/88</further-classification>
        <further-classification edition="200601120260131B">G05B19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳沼啓人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGINUMA, KEITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原一範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西理史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNISHI, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本隼一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀家俊輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIKE, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川智明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三妙彬斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMMYO, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">機器人系統係具備：面狀攝像部，係對包含照明部照射照明光的工件的照射部分的區域進行攝像；顯示部，係顯示面狀攝像部所攝像到的圖像；機械臂，係使工件與照明部相對移動；以及控制部，係在顯示部顯示面狀攝像部所攝像到的圖像的狀態下，受理機械臂的動作的教示，以使照明光照射的照射部分成為要以機器人進行作業的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robot system according to the present disclosure includes: an area imaging unit for capturing an image of an area that includes an illuminated portion of a workpiece illuminated by a lighting unit; a display unit for displaying the image captured by the area imaging unit; a robot arm for moving the lighting unit and the workpiece relative to each other; and a control unit that receives instructions for operating the robot arm while the image captured by the area imaging unit is displayed on the display unit, so that the illuminated portion is the area where the robot will perform work.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:機械臂</p>
        <p type="p">13:前端構件</p>
        <p type="p">13a:基端部分</p>
        <p type="p">13b:前側部分</p>
        <p type="p">20:照明部</p>
        <p type="p">30:線狀攝像部</p>
        <p type="p">40:面狀攝像部</p>
        <p type="p">50:安裝構件</p>
        <p type="p">51:本體部</p>
        <p type="p">52:位置變更機構</p>
        <p type="p">52a:基端部</p>
        <p type="p">52b:前端部</p>
        <p type="p">52c:鉸鏈</p>
        <p type="p">53:焦點位置指示構件</p>
        <p type="p">200:工件</p>
        <p type="p">200a:表面</p>
        <p type="p">L1:旋轉軸線</p>
        <p type="p">L2:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1799" publication-number="202619417">
    <tif-files tif-type="multi-tif">
      <tif file="114127582.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H05K1/02</main-classification>
        <further-classification edition="200601120260126B">H05K1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＯＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小紫秀人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMURASAKI, HIDETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大庭久恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBA, HISAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置的製造方法，包括：第一步驟，準備配線基板，該配線基板包括具有可撓性的絕緣基材與形成於絕緣基材的導電層；以及第二步驟，沿著對象物的立體形狀使配線基板變形，藉以使配線基板被覆該對象物。配線基板包括相互位於相反側的第一面及第二面與折曲構造，其中該折曲構造中的複數條折曲線在平面視角下以曲線的波浪形狀沿第一軸延伸，並沿著與該第一軸相交的第二軸排列，第一面及第二面各別包括複數條稜線及複數條谷線，複數條折曲線的各者對應於第一面的複數條稜線的任一者及第二面的複數條谷線的任一者，或者，對應於第一面的複數條谷線的任一者及第二面的複數條稜線的任一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of device includes: a first step of preparing a wiring board, wherein the wiring board includes a flexible insulating substrate and a conductive layer formed on the insulating substrate; and a second step of deforming the wiring board along the three-dimensional shape of an object, thereby covering the object with the wiring board. The wiring board includes a first surface and a second surface located on opposite sides of each other, and a folding structure. Wherein a plurality of folding lines extend along a first axis in a curved wavy shape in a planar perspective and are arranged along a second axis intersecting the first axis. The first surface and the second surface respectively include a plurality of ridges and a plurality of valleys, and each of the plurality of folding lines correspond to any one of the plurality of ridges of the first surface and any one of the plurality of valleys of the second surface, or correspond to any one of the plurality of valleys of the first surface and any one of the plurality of ridges of the second surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:第一步驟</p>
        <p type="p">S11:準備步驟</p>
        <p type="p">S12:成形步驟</p>
        <p type="p">S2:第二步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1800" publication-number="202619408">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>供電裝置、半導體處理設備及使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H05H1/30</main-classification>
        <further-classification edition="200601120251201B">H01L21/302</further-classification>
        <further-classification edition="200601120251201B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種供電裝置、半導體處理設備及使用方法，所述供電裝置用於反應腔，所述反應腔內設有基座；所述供電裝置包括：電容器，其包括第一極板和第二極板；所述第一極板與所述基座連接，所述第二極板與電源連接，所述電容器用於向所述基座放電；第一開關，串聯在所述電容器和所述基座之間，用於控制所述電容器的放電頻率；以及第一電量控制模組，其輸入端與所述第一極板連接，其輸出端與所述電源連接，用於獲取所述電容器的剩餘電量以及在所述第一開關斷開且所述電容器的剩餘電量低於預設值時控制所述電源向所述電容器充電。本發明可以對電容器的放電電量進行及時地補充，從而避免出現電容器因儲能不足而導致放電速度變慢的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基片</p>
        <p type="p">110:反應腔</p>
        <p type="p">120:基座</p>
        <p type="p">200:電源</p>
        <p type="p">210:電容器</p>
        <p type="p">2101:第一極板</p>
        <p type="p">2102:第二極板</p>
        <p type="p">220:第一開關</p>
        <p type="p">230:第一電量控制模組</p>
        <p type="p">2301:第一採集單元</p>
        <p type="p">2302:第一計算單元</p>
        <p type="p">2303:第一控制單元</p>
        <p type="p">240:第二電量控制模組</p>
        <p type="p">2401:第二採集單元</p>
        <p type="p">2402:第二計算單元</p>
        <p type="p">2403:第二控制單元</p>
        <p type="p">250:第二開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1801" publication-number="202618860">
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理設備及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250924B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　志堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, GERALD ZHE YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電漿處理設備及方法，所述電漿處理設備包含：真空的反應腔，其內設有下電極組件，反應腔的上方設有與下電極組件相對的上電極；第一脈衝直流電源，其向下電極組件提供第一脈衝直流信號，第一脈衝直流信號的脈衝週期包括第一階段和第二階段；第一脈衝直流信號在第一階段、第二階段分別具有第一電壓、第二電壓，第二電壓低於第一電壓；第二脈衝電源，其向上電極提供第二脈衝信號；第二脈衝信號與第一脈衝直流信號具有相同的頻率；第二脈衝信號的電壓至少在第二階段為呈上升斜坡的正電壓，以補償基片表面電漿鞘層的電壓降。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電漿處理設備</p>
        <p type="p">20:反應腔</p>
        <p type="p">202:靜電吸盤</p>
        <p type="p">2021:介電層</p>
        <p type="p">2022:電漿介電層</p>
        <p type="p">2023:金屬基座</p>
        <p type="p">203:氣體噴淋頭</p>
        <p type="p">220:氣體供應裝置</p>
        <p type="p">230:聚焦環</p>
        <p type="p">231:邊緣電極</p>
        <p type="p">240:源射頻電源</p>
        <p type="p">270:同步控制單元</p>
        <p type="p">W:基片</p>
        <p type="p">TWR:第二脈衝電源</p>
        <p type="p">PDC1:第一脈衝直流電源</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1802" publication-number="202618839">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>升降環組件及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250923B">H01J37/04</main-classification>
        <further-classification edition="200601120250923B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張一川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧繼強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種升降環組件及電漿處理裝置，所述升降環組件包括：升降環，可升降地設置在所述電漿處理裝置的反應腔內；調節模組，設置在所述反應腔的外部，用於調節所述升降環的電位，該調節模組的一端與所述升降環連接，另一端接地，本發明可調節升降環與下電極之間的電勢差，進而調節電漿對升降環的轟擊強度，不僅使蝕刻過程中的聚合物不易沉積在升降環表面，還能提高清潔過程中對升降環的清潔強度，從而減少升降環表面的聚合物沉積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:反應腔</p>
        <p type="p">21:氣體噴淋頭</p>
        <p type="p">22:升降環</p>
        <p type="p">23:傳片口</p>
        <p type="p">24:側壁</p>
        <p type="p">25:基座</p>
        <p type="p">26:電漿約束環</p>
        <p type="p">27:調節模組</p>
        <p type="p">28:導電層</p>
      </representative-img>
    </description>
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        <document-id>
          <doc-number>114127705</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔半導體零部件的裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250916B">B08B11/00</main-classification>
        <further-classification edition="200601120250916B">B08B3/02</further-classification>
        <further-classification edition="200601120250916B">B08B3/08</further-classification>
        <further-classification edition="200601120250916B">B08B3/10</further-classification>
        <further-classification edition="200601120250916B">H01L21/302</further-classification>
        <further-classification edition="200601120250916B">C11D11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁重時</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱俊麒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種清潔半導體零部件的裝置及方法，所述裝置至少包含：第一容器，所述第一容器用於盛放液體二氧化碳；第二容器，所述第二容器用於盛放增強清洗劑；控制單元；增壓計量泵；所述第一容器通過第一管路與所述控制單元相連通；所述第二容器通過第二管路與所述控制單元相連通；所述增壓計量泵設於所述第二管路上；所述液體二氧化碳和所述增強清洗劑在所述控制單元中形成的混合物通過第三管路及清洗噴嘴噴射到半導體零部件的表面，對所述半導體零部件進行清潔。利用該方法可以對半導體零部件上的顆粒污染物進行高效清潔，從而提升晶片產品良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一容器</p>
        <p type="p">2:第二容器</p>
        <p type="p">3:控制單元</p>
        <p type="p">31:第一管路</p>
        <p type="p">32:第二管路</p>
        <p type="p">33:第三管路</p>
        <p type="p">331:清洗噴嘴</p>
        <p type="p">34:第四管路</p>
        <p type="p">4:增壓計量泵</p>
        <p type="p">5:空氣壓縮機</p>
        <p type="p">6:半導體零部件</p>
        <p type="p">7:專用治具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1804" publication-number="202617884">
    <tif-files tif-type="multi-tif">
      <tif file="114127725.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127725</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯胺組成物</chinese-title>
        <english-title>POLYAMIDE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C08L77/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王麗俠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹奇　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANKE, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滕飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍曼　雷恩哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINEMANN, REINHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其包含：至少50重量%之聚醯胺部分；該聚醯胺部分係由下列所組成：a) 50至95重量份之至少一種基於具有10至20個碳原子之環脂族二胺及具有8至18個碳原子之脂族二羧酸之環脂族聚醯胺；以及b) 50至5重量份之至少一種在單體單元中具有平均9至12個C原子之線型脂族聚醯胺，其中，a)與b)之重量份之總和為100。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition, comprising: at least 50% by weight of a polyamide fraction; the polyamide fraction consisting of: a) 50 to 95 parts by weight of at least one cycloaliphatic polyamide based on a cycloaliphatic diamine having 10-20 carbon atoms and an aliphatic dicarboxylic acid having 8-18 carbon atoms; and b) 50 to 5 parts by weight of at least one linear aliphatic polyamide having an average of from 9 to 12 C atoms in the monomer units, wherein the sum of the parts by weight of a) and b) is 100.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1805" publication-number="202619403">
    <tif-files tif-type="multi-tif">
      <tif file="114127727.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>受電裝置用以控制供電裝置上的光源的控制方法及系統</chinese-title>
        <english-title>CONTROL METHOD AND SYSTEM FOR CONTROLLING A LIGHT SOURCE ON A SOURCE DEVICE BY A SINK DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250801B">H05B45/30</main-classification>
        <further-classification edition="202001120250801B">H05B45/10</further-classification>
        <further-classification edition="202001120250801B">H05B45/20</further-classification>
        <further-classification edition="200601120250801B">G06F13/42</further-classification>
        <further-classification edition="200601120250801B">G06F1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾科半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARK HDPS SEMICONDUCTOR PTE. LIMITED.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊宗諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TSUNG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種受電裝置用以控制供電裝置上的光源的控制方法，包含建立供電裝置及受電裝置之間的通用序列匯流排介面的連結，通用序列匯流排介面傳遞廠商定義訊息，廠商定義訊息包含光控探索指令、光控確認訊息與光源控制指令其中之一；供電裝置傳送光控探索指令至受電裝置；若受電裝置支援廠商定義訊息傳送光源控制指令，受電裝置回應光控確認訊息至供電裝置；受電裝置傳送光源控制指令至供電裝置；及供電裝置中的控制器依據所接收到的光源控制指令，改變光源所發出的光訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method for a sink device to control a light source on a source device includes establishing a Universal Serial Bus (USB) interface connection between the source device and the sink device, wherein the USB interface transmits a Vendor Defined Message (VDM), and the VDM includes one of a light control discovery command, a light control acknowledgement message, and a light source control command; transmitting, by the source device, the light control discovery command to the sink device; responding, by the sink device, with the light control acknowledgement message to the source device if the sink device supports transmitting the light source control command via the VDM; transmitting, by the sink device, the light source control command to the source device; and changing, by a controller in the source device, a light signal emitted by the light source according to the received light source control command.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:受電裝置用以控制供電裝置上的光源的控制系統</p>
        <p type="p">10:供電裝置</p>
        <p type="p">11:受電裝置</p>
        <p type="p">L:連結</p>
        <p type="p">10a:控制器</p>
        <p type="p">10b:光源</p>
        <p type="p">11a:應用程式操作介面</p>
        <p type="p">11b:通用序列匯流排控制器</p>
        <p type="p">11c:記憶體</p>
        <p type="p">11d:電池</p>
        <p type="p">11e:電池管理系統</p>
        <p type="p">P1及P2:連接埠</p>
        <p type="p">12:通用序列匯流排介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1806" publication-number="202617418">
    <tif-files tif-type="multi-tif">
      <tif file="114127743.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱固化設備</chinese-title>
        <english-title>THERMAL CURING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B29D11/00</main-classification>
        <further-classification edition="200601120260127B">B29C35/04</further-classification>
        <further-classification edition="200601120260127B">B29C33/00</further-classification>
        <further-classification edition="200601120260127B">F27D7/06</further-classification>
        <further-classification edition="200601120260127B">F27B9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商愛爾康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALCON INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史雀司樂　優朵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUESSLER, UDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾韋恩　菲爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAUERWEIN, PHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIRL, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李博　史戴芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEB, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種用於使多個閉合接觸透鏡模具中容納的透鏡形成材料熱固化的設備，該設備包括固化烘箱，該固化烘箱包括用於容納固化托盤的疊置體的固化腔室，其中疊置體中的每個固化托盤佈置在相應的預定豎直層級處。固化烘箱進一步包括供應通道和將供應通道與固化腔室隔開的擋板，擋板包括多個供應孔。在腔室入口處，固化腔室僅經由供應孔與供應通道流體地連接，其中，擋板的多個供應孔沿著多個水平延伸的行佈置，其中多個行中的一個所述行佈置在要佈置疊置體中的固化托盤的所述預定豎直層級中的每相鄰豎直層級之間的中間豎直層級處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for thermal curing of a lens-forming material contained in a plurality of closed contact lens molds, comprises a curing oven comprising a curing chamber for accommodating a stack of curing trays, with each curing tray of the stack arranged at a respective predetermined vertical level. The curing oven further comprises a supply channel and a baffle separating the supply channel from the curing chamber, the baffle comprising a plurality of supply holes. At a chamber inlet, the curing chamber is fluidly connected with the supply channel via the supply holes only, wherein the plurality of supply holes of the baffle are arranged along a plurality of horizontally extending rows, with one said row of the plurality of rows being arranged at an intermediate vertical level between each adjacent ones of the said predetermined vertical levels at which the curing trays of the stack are to be arranged.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:固化烘箱</p>
        <p type="p">2:固化腔室</p>
        <p type="p">3:擋板</p>
        <p type="p">4:加熱通道</p>
        <p type="p">5:供應通道</p>
        <p type="p">6:疊置體</p>
        <p type="p">11:隔熱烘箱壁</p>
        <p type="p">31:供應孔</p>
        <p type="p">32:水平延伸的行</p>
        <p type="p">43:加熱器</p>
        <p type="p">44:風扇</p>
        <p type="p">60:固化托盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1807" publication-number="202619594">
    <tif-files tif-type="multi-tif">
      <tif file="114127764.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置以及包括發光裝置的顯示裝置</chinese-title>
        <english-title>LIGHT-EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250915B">H10H20/83</main-classification>
        <further-classification edition="202501120250915B">H10H20/84</further-classification>
        <further-classification edition="202501120250915B">H10H20/857</further-classification>
        <further-classification edition="202501120250915B">H10H29/49</further-classification>
        <further-classification edition="201601120250915B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳暎澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, YOUNGTEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金柱成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOOSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴俊勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOONYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONGCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓周憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JOOHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃京旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUNGWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊式</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JUNSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋相勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, SANGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉珉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MINCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種發光裝置及一種包括該發光裝置之顯示裝置。該發光裝置可包括內含序列堆疊之發光結構之一發光單元，其中該等發光結構中之每一者包括序列堆疊之一第一傳導性類型半導體層、一主動層及一第二傳導性類型半導體層。該發光裝置可進一步包括與該等發光結構之該等第一傳導性類型半導體層接觸且在該發光單元之一下表面上之個別電極。該等個別電極中之至少兩者可具有傳導通孔結構。與該等發光結構之該等第二傳導性類型半導體層之側表面接觸的一共同電極可配置在該發光單元之一側表面上。該等發光結構之該等第一傳導性類型半導體層及該等主動層之側表面可藉由一絕緣層與該共同電極絕緣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting device and a display device including the same are provided. The light-emitting device may include a light-emitting unit including light-emitting structures that are sequentially stacked, wherein each of the light-emitting structures includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer that are sequentially stacked. The light-emitting device may further include individual electrodes in contact with the first conductivity-type semiconductor layers of the light-emitting structures and on a lower surface of the light-emitting unit. At least two of the individual electrodes may have conductive via structures. A common electrode, which is in contact with side surfaces of the second conductivity-type semiconductor layers of the light-emitting structures, may be arranged on a side surface of the light-emitting unit. Side surfaces of the first conductivity-type semiconductor layers and the active layers of the light-emitting structures may be insulated from the common electrode by an insulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:發光裝置</p>
        <p type="p">10:第一發光結構、發光結構</p>
        <p type="p">11,21,31:第一傳導性類型半導體層</p>
        <p type="p">11s,12s,13s,21s,22s,23s,31s,32s,33s:側表面</p>
        <p type="p">12,22,32:主動層</p>
        <p type="p">13,23,33:第二傳導性類型半導體層</p>
        <p type="p">20:第二發光結構、發光結構</p>
        <p type="p">30:第三發光結構、發光結構</p>
        <p type="p">40:共同電極</p>
        <p type="p">60:絕緣層</p>
        <p type="p">61:第一絕緣層</p>
        <p type="p">62:第二絕緣層</p>
        <p type="p">63:第三絕緣層</p>
        <p type="p">71:第一個別電極</p>
        <p type="p">71a:第一電極墊</p>
        <p type="p">72:第二個別電極</p>
        <p type="p">72a:第二電極墊</p>
        <p type="p">72b:第二傳導通孔</p>
        <p type="p">72c,73c,74:鈍化層</p>
        <p type="p">73:第三個別電極</p>
        <p type="p">73a:第三電極墊</p>
        <p type="p">73b:第三傳導通孔</p>
        <p type="p">100:發光單元</p>
        <p type="p">101:上表面</p>
        <p type="p">200:基體</p>
        <p type="p">201,202,203:接合墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1808" publication-number="202618365">
    <tif-files tif-type="multi-tif">
      <tif file="114127769.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用半導體條帶之重構晶圓級裝置</chinese-title>
        <english-title>RECONSTITUTED WAFER-SCALE DEVICES USING SEMICONDUCTOR STRIPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B6/42</main-classification>
        <further-classification edition="200601120260127B">G02B6/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特美特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTMATTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫迪　米圖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODI, MITUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉特　克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHARATH, KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　光爵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩內　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANE, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述使用一基於重構之製造方法實現電子積體電路(EIC)與光子積體電路(PIC)之晶圓級異質整合之製造技術及封裝。藉由組裝已知良好晶粒(KGD)之「條帶」來形成晶圓級光子裝置。此等條帶包含已自一晶圓單粒化之相鄰倍縮光罩之陣列。一條帶可包含自一晶圓單粒化之一單一列(或行)倍縮光罩或彼此相鄰之多列(或行)，從而實現二維組裝及增加之覆蓋範圍。晶圓重構涉及將KGD之一或多個條帶轉移且接合至一目標基板。一KGD係並非一排除區帶之部分之一倍縮光罩，且已經驗證以正常工作。因此，一重構晶圓包含已經驗證為功能完全正常之條帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are manufacturing techniques and packages that enable wafer-scale heterogenous integration of electronic integrated circuits (EIC) with photonic integrated circuits (PIC) using a reconstitution-based fabrication approach. Wafer-scale photonic devices are formed by assembling strips of known-good dies (KGD). Such strips include arrays of adjacent reticles that have been singulated from a wafer. A strip can include a single row (or column) of reticles singulated from a wafer or multiple rows (or columns) that are adjacent to one another, enabling two-dimensional assembly and increased coverage. Wafer reconstitution involves transferring and bonding one or more strips of KGDs to a target substrate. A KGD is a reticle that is not part of an exclusion zone and has been verified to work properly. Thus, a reconstituted wafer includes strips that have verified to be fully functional.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:源晶圓/原始晶圓</p>
        <p type="p">201:條帶</p>
        <p type="p">202:條帶</p>
        <p type="p">203:條帶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1809" publication-number="202619335">
    <tif-files tif-type="multi-tif">
      <tif file="114127771.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有動態深度感測的投影裝置及其投影方法</chinese-title>
        <english-title>PROJECTION APPARATUS WITH DYNAMIC DEPTH SENSING AND PROJECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H04N5/74</main-classification>
        <further-classification edition="200601120251103B">H04N9/31</further-classification>
        <further-classification edition="200601120251103B">G03B21/14</further-classification>
        <further-classification edition="200601120251103B">G03B21/53</further-classification>
        <further-classification edition="201701120251103B">G06T7/50</further-classification>
        <further-classification edition="202401120251103B">G06T3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鎮城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUNG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有動態深度感測的投影裝置和投影方法，該投影裝置具有投影單元、深度感測單元和處理器。該深度感測單元以與該投影單元保持固定的相對位置關係，且與該投影單元以相同的視角面向相同的方向設置。處理器經配置以：透過投影單元投影具有目標物的投影畫面至投影區域；透過深度感測單元獲取表示投影單元至投影區域的距離的距離參數；以及基於距離參數調整投影畫面中的目標物。無論距離遠近，都不影響投影畫面中特定目標物的尺寸大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projection apparatus with dynamic depth sensing and projection method thereof are provided. The projection apparatus comprising a projection unit, a depth sensing unit, and a processor. The depth sensing unit is arranged to maintain a fixed relative positional relationship with the projection unit, and is set up to face the same direction with the same viewing angle as the projection unit. The processor is configured to: project a projection image containing a target object to a projection target through the projection unit; obtain a distance parameter representing the distance from the projection unit to the projection target through the depth sensing unit; and adjust the target object in the projection image based on the distance parameter. Regardless of the distance, it does not affect the size of the target object in the projection image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:投影裝置</p>
        <p type="p">110:處理器</p>
        <p type="p">120:儲存媒體</p>
        <p type="p">130:投影單元</p>
        <p type="p">140:深度感測單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1810" publication-number="202617539">
    <tif-files tif-type="multi-tif">
      <tif file="114127801.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127801</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隔熱容器及隔熱容器之容器本體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B65D81/38</main-classification>
        <further-classification edition="200601120260130B">B65D85/72</further-classification>
        <further-classification edition="200601120260130B">A47J41/02</further-classification>
        <further-classification edition="200601120260130B">A47J41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京洛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYORAKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商虎牌熱水瓶股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIGER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池口尚宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEGUCHI, NAOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田攻一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>末岡正章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEOKA, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樽野真輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARUNO, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薦田弦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMODA, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可抑制內容器與外容器之熔接不良的隔熱容器。根據本發明，提供一種隔熱容器，具備容器本體；前述容器本體具備：內容器、以及以覆蓋前述內容器之方式配置的外容器；前述內容器與前述外容器之間係設置有密閉空間；前述內容器具備：口部、以及外徑大於前述口部的胴部；前述胴部具備：隨著從前述口部遠離而外徑變大的肩部、以及相連於前述肩部之外緣且隨著從前述口部遠離而外徑變小的縮徑部；若將前述外緣處之前述內容器的外徑設為D1，將前述肩部中鄰接於前述外緣之部位的曲率半徑設為R1，則R1／D1為0.10以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:容器本體</p>
        <p type="p">1a:口部</p>
        <p type="p">1b:胴部</p>
        <p type="p">1c:底部</p>
        <p type="p">2a:口部</p>
        <p type="p">10:隔熱容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1811" publication-number="202617310">
    <tif-files tif-type="multi-tif">
      <tif file="114127802.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工方法及雷射加工裝置</chinese-title>
        <english-title>LASER MACHINING METHOD AND LASER MACHINING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251222B">B23K26/04</main-classification>
        <further-classification edition="200601120251222B">B23K26/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＥＯ科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EO TECHNICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳官</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNG KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示的雷射加工方法包括以下步驟：使具有較凹槽的目標寬度小的第一加工寬度的加工束位於所述目標寬度的內側（即第一位置），且在使加工束相對於加工對象物相對移動的同時執行一次加工；以及交替執行多個二次加工與多個三次加工，所述多個二次加工與多個三次加工使所述加工束依序位於相對於所述第一位置在所述第一方向上每移動第一步的多個第二位置及相對於所述第一位置向所述第二位置的相反側每移動第二步的多個第三位置，且在使所述加工束相對於所述加工對象物在所述第二方向上相對移動的同時執行加工。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The laser processing method includes a step of performing primary processing by positioning a processing beam having a first processing width smaller than a target width of a groove at a first position inside the target width and moving the processing beam relative to a workpiece, and a step of performing a plurality of secondary processings and a plurality of ternary processings sequentially by sequentially positioning the processing beam at a plurality of second positions moved by a first step each time in the first direction with respect to the first position a plurality of third positions moved by a second step in a direction opposite to the second position with respect to the first position and processing the workpiece while moving the processing beam relative to the workpiece in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S20、S30、S40、S50:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1812" publication-number="202618026">
    <tif-files tif-type="multi-tif">
      <tif file="114127872.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>選擇性沉積矽氮化物膜</chinese-title>
        <english-title>SELECTIVELY DEPOSITING A SILICON NITRIDE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C16/02</main-classification>
        <further-classification edition="200601120260202B">C23C16/04</further-classification>
        <further-classification edition="200601120260202B">C23C16/34</further-classification>
        <further-classification edition="200601120260202B">C23C16/455</further-classification>
        <further-classification edition="200601120260202B">C23C16/52</further-classification>
        <further-classification edition="200601120260202B">C23C16/56</further-classification>
        <further-classification edition="200601120260202B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼　德　卡斯楚　瑞吉兒　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NYE DE CASTRO, RACHEL ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒邁爾　保羅　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMAIRE, PAUL C</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　喬爾　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, JOEL DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克勞克林　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCLAUGHLIN, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪斯曼恩　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAUSMANN, DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文介紹了一種沉積矽氮化物膜的方法。本方法包括加熱具有第一成分的第一表面區域以及第二成分的第二表面區域的基板。將基板曝露於抑制劑，其中抑制劑選擇性鍵結於第一成分的第一表面區域。將基板曝露於含矽前驅物以及含氮前驅物，以在第二表面區域上熱沉積矽氮化物膜。抑制劑抑制了矽氮化物膜在第一表面區域的沉積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of depositing a silicon nitride film is presented. The method comprises heating a substrate having a first surface region of a first composition and a second surface region of a second composition. The substrate is exposed to an inhibitor that selectively bonds to the first surface region of the first composition. The substrate is exposed to a silicon-containing precursor and to a nitrogen-containing precursor to thermally deposit the silicon nitride film on the second surface region. The inhibitor inhibits deposition of the silicon nitride film on the first surface region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:方法</p>
        <p type="p">810:步驟</p>
        <p type="p">820:步驟</p>
        <p type="p">830:步驟</p>
        <p type="p">840:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1813" publication-number="202617576">
    <tif-files tif-type="multi-tif">
      <tif file="114127888.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手動鏈式吊車</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B66D3/16</main-classification>
        <further-classification edition="200601120260130B">B66D1/28</further-classification>
        <further-classification edition="200601120260130B">F16D1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商開道股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河西貴幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASAI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種具有能夠防止脫落且能夠防止輪罩徑向尺寸大型化的鏈條導向件之手動鏈式吊車；手動鏈式吊車（10）係包括：鏈式吊車主體框架，圓筒狀的輪罩（7），係收容操縱輪（6），且在周面（7c）具有供拉鏈（5）進出之一對貫通孔（71），一對鏈條導向件（73），係安裝於貫通孔（71），對拉鏈（5）的通過進行引導；鏈條導向件（73）係具有：圓弧板狀的主體部（73a），係嵌合於貫通孔（71），外周凸緣部（73b），係從主體部（73a）的一端向外側延伸設置，且與輪罩（7）的外周面（7d）抵接，內周凸緣部（73c），係從主體部（73a）的另一端向內側延伸設置，並且向與周向垂直的兩側方向延伸設置，且與輪罩（7）的內周面（7e）抵接，螺釘固定部（73d），係將內周凸緣部（73c）利用螺釘固定在輪罩（7）的內周側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:輪罩</p>
        <p type="p">7c:周面</p>
        <p type="p">7d:外周面</p>
        <p type="p">7e:內周面</p>
        <p type="p">71:貫通孔</p>
        <p type="p">72:擴徑部</p>
        <p type="p">73:鏈條導向件</p>
        <p type="p">73a:主體部</p>
        <p type="p">73b:外周凸緣部</p>
        <p type="p">73c:內周凸緣部</p>
        <p type="p">73d:螺釘固定部</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1814" publication-number="202617575">
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          <doc-number>202617575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手動鏈式吊車</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B66D1/58</main-classification>
        <further-classification edition="200601120260130B">B66D3/16</further-classification>
        <further-classification edition="200601120260130B">F16D43/21</further-classification>
        <further-classification edition="200601120260130B">F16D7/02</further-classification>
        <further-classification edition="200601120260130B">F16D65/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商開道股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城田明典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIROTA, AKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河西貴幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASAI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種即使在捲繞操作時被輸入過大負荷，亦能夠使可傳遞轉矩穩定，並且成本低且小型化之手動鏈式吊車；手動鏈式吊車（10）係包括：驅動軸（8），係形成有公螺紋（8a）；驅動部件（14），係呈筒狀，且具有母螺紋（14a），並且具有插裝在操縱輪（7）內徑側之小徑部（14b）以及大徑部（14c）；施力部件（16），在由摩擦板（F1）、（F2）夾持了操縱輪（7）之狀態下，此施力部件（16）對驅動部件（14）施力；壓板（15），係將作用力向摩擦板（F2）傳遞；制動機構（20），係透過公螺紋（8a）與母螺紋（14a）的螺合而產生之緊固力被按壓，並且，驅動部件（14）和摩擦板（F1）之相對旋轉被抑制，壓板（15）和摩擦板（F2）之相對旋轉被抑制，藉此，摩擦板（F2）之夾持操縱輪（7）的面能夠相對旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鏈式吊車主體</p>
        <p type="p">6a:金屬環</p>
        <p type="p">7:操縱輪</p>
        <p type="p">7a:內周部</p>
        <p type="p">7b:縮徑部</p>
        <p type="p">8:驅動軸</p>
        <p type="p">8a:公螺紋</p>
        <p type="p">8b:螺紋部</p>
        <p type="p">8c:階梯部</p>
        <p type="p">8d:凸緣部</p>
        <p type="p">8e:螺栓部</p>
        <p type="p">8f:螺合部</p>
        <p type="p">14:驅動部件</p>
        <p type="p">14a:母螺紋</p>
        <p type="p">14b:小徑部</p>
        <p type="p">14c:大徑部</p>
        <p type="p">14g:空間</p>
        <p type="p">14h:公螺紋</p>
        <p type="p">15:壓板</p>
        <p type="p">16:碟形彈簧(施力部件)</p>
        <p type="p">17:彈簧緊固螺母</p>
        <p type="p">18:開槽螺母</p>
        <p type="p">20:制動機構</p>
        <p type="p">21:襯套</p>
        <p type="p">22:棘輪</p>
        <p type="p">23:爪部</p>
        <p type="p">71:鏈槽</p>
        <p type="p">B:制動板</p>
        <p type="p">F1:摩擦板</p>
        <p type="p">F2:摩擦板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1815" publication-number="202617577">
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          <doc-number>202617577</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手動鏈式吊車</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B66D3/16</main-classification>
        <further-classification edition="200601120260130B">B66D1/28</further-classification>
        <further-classification edition="200601120260130B">F16D1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商開道股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河西貴幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASAI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種能夠提高輪罩的強度並且能夠抑制大型化之手動鏈式吊車；手動鏈式吊車10係包括：操縱輪7，係供作業人員進行手拉操作之拉鏈卷繞6，框架1，係軸支承操縱輪7的驅動軸71且與操縱輪7相鄰地設置；以及輪罩8，係具有覆蓋操縱輪7的外周且形成為圓筒狀之圓筒部8e，此圓筒部8e的一端8a封閉、另一端8b設有開口端8c，此開口端8c以能夠旋轉之方式安裝於框架11；框架11係具有圓環狀支承環11e，此支承環11e係從輪罩8側的表側面11a隆起，且直徑比開口端8c的直徑小，輪罩8以將開口端8c配置於支承環11e外周之狀態安裝於框架11。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:框架</p>
        <p type="p">11a:表側面</p>
        <p type="p">11b:背側面</p>
        <p type="p">11c:凹面</p>
        <p type="p">11c1:外凹面</p>
        <p type="p">11c2:內凹面</p>
        <p type="p">11c3:爪軸孔</p>
        <p type="p">11c4:軸承孔</p>
        <p type="p">11d:外周壁</p>
        <p type="p">11e:圓環狀加強筋</p>
        <p type="p">11f:補強用加強筋</p>
        <p type="p">11g:槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1816" publication-number="202618948">
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      <tif file="114127899.zip" no="1">
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      <volno>24</volno>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低電阻鉬互連線的微加工</chinese-title>
        <english-title>MICROFABRICATION OF LOW-RESISTANCE MOLYBDENUM INTERCONNECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/60</main-classification>
        <further-classification edition="200601120260126B">H01L21/3205</further-classification>
        <further-classification edition="200601120260126B">H01L21/321</further-classification>
        <further-classification edition="200601120260126B">H01L21/3213</further-classification>
        <further-classification edition="200601120260126B">H01L21/762</further-classification>
        <further-classification edition="200601120260126B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏根　李　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROGAN, LEE J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克尼　凱爾　喬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAKENEY, KYLE JORDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里菲斯　馬修　伯特倫　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFFITHS, MATTHEW BERTRAM EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼迪亞　大衛　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDIA, DAVID JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾卡西亞　亞什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARGASYA, YASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種利用模板層製造半導體基板的方法與設備，以形成具有低電阻的鉬膜，其低電阻源於該鉬膜內部晶粒尺寸較大。本文所述的方法與設備可用於在積體電路中製造鉬線或互連。所製造的鉬線可在空氣暴露（air break）及下游處理期間具備對抗氧化損害的能力，並能維持低電阻。該方法可用於沉積鉬作為襯墊層以填充特徵和/或直接填充特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods and apparatus for fabricating a semiconducting substrate using a template layer to form a film of molybdenum having a low resistance attributed to the large size of its internal crystalline grains. The method and apparatus described herein may be used to fabricate molybdenum lines or interconnects in an integrated circuit. Fabricated molybdenum lines may be robust against oxidative damage during air break and downstream processing and be able to maintain low resistance. The method may be used to deposit molybdenum to fill features as a liner layer and/or fill features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:處理</p>
        <p type="p">501,503,505,507,509,511,513:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1817" publication-number="202618975">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉加工裝置及旋轉加工方法</chinese-title>
        <english-title>SPIN PROCESSING APPARATUS AND SPIN PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/67</main-classification>
        <further-classification edition="200601120260128B">B05C11/08</further-classification>
        <further-classification edition="200601120260128B">F16J15/447</further-classification>
        <further-classification edition="200601120260128B">B05C11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三益半導體工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIMASU SEMICONDUCTOR INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小笠原俊一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGASAWARA, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村匡宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, KUNIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>糸井悠貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種旋轉加工裝置及旋轉加工方法，將處理液滴下至旋轉的基板上進行旋轉加工時，防止旋轉加工的處理液和周圍的氣氛朝前述基板的外周部的背側擴散。  &lt;br/&gt;　　[技術內容] 一種旋轉加工裝置，包含：旋轉軸；及旋轉吸附載台，具備：在載置基板的狀態下藉由前述旋轉軸而被旋轉的旋轉載置部、及將前述旋轉載置部的下部支撐並藉由前述旋轉軸而被旋轉的轉子部、及形成於前述旋轉載置部的外周部及前述轉子部的外周部之間的間隙；及非旋轉淨化盒，被設於前述旋轉吸附載台的下方，與前述間隙連通；及迷宮部，被設於位於前述轉子部下方的前述非旋轉淨化盒的外緣；及側吹部，朝前述淨化盒供給氣體，將氣體朝前述間隙送風。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本發明的旋轉加工裝置</p>
        <p type="p">12:旋轉軸</p>
        <p type="p">14:旋轉載置部</p>
        <p type="p">16:轉子部</p>
        <p type="p">18:外周部</p>
        <p type="p">20:外周部</p>
        <p type="p">24:非旋轉淨化盒</p>
        <p type="p">26:迷宮部</p>
        <p type="p">28:側吹部</p>
        <p type="p">30:吸附孔</p>
        <p type="p">32:處理液回收機構</p>
        <p type="p">34:吸引中空部</p>
        <p type="p">44:旋轉翼片部</p>
        <p type="p">46:氣體密封機構</p>
        <p type="p">G:間隙</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1818" publication-number="202617895">
    <tif-files tif-type="multi-tif">
      <tif file="114127910.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617895</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非氟系共聚物及包含其之表面改質劑</chinese-title>
        <english-title>FLUORINE-FREE COPOLYMER AND SURFACE MODIFIER CONTAINING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C09D4/02</main-classification>
        <further-classification edition="202501120260128B">C08L23/0869</further-classification>
        <further-classification edition="200601120260128B">C08F283/12</further-classification>
        <further-classification edition="200601120260128B">C08F2/50</further-classification>
        <further-classification edition="200601120260128B">C08G77/18</further-classification>
        <further-classification edition="200601120260128B">C08F214/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼歐斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEOS COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平松信志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAMATSU, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹內規貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, NORITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  提供一種可對塗膜之硬化膜賦予調平性，且同時賦予重複塗佈性之化合物。&lt;br/&gt;  [解決手段]&lt;br/&gt;  一種非氟系共聚物，其特徵在於包含聚矽氧單體及親水性單體(惟，排除前述聚矽氧單體)作為重複單元，且&lt;br/&gt;  (1)前述聚矽氧單體之數量平均分子量為200~6000，&lt;br/&gt;  (2)前述聚矽氧單體(S)與前述親水性單體(H)之重量比，將兩者合計設為100重量份時，S：H＝0.1重量份：99.9重量份~49重量份：51重量份，&lt;br/&gt;  (3)前述非氟系共聚物之氟含量為1質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a compound that can impart leveling properties and recoatability to a cured coating film.&lt;br/&gt; The present invention is directed to a copolymer containing a silicone monomer and a hydrophilic monomer (excluding the silicone monomer) as repeating units, characterized in that: (1) the number average molecular weight of the silicone monomer is 200 to 6000; (2) the weight ratio of the silicone monomer (S) to the hydrophilic monomer (H) is S:H=0.1 part by weight:99.9 parts by weight to 49 parts by weight:51 parts by weight, where the total of the silicone monomer (S) and hydrophilic monomer (H) is 100 parts by weight; and (3) the fluorine content is 1% by mass or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1819" publication-number="202616974">
    <tif-files tif-type="multi-tif">
      <tif file="114127976.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性扣具</chinese-title>
        <english-title>MAGNETIC BUCKLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A44B11/25</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商歐斯瑪貿易（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSMAR TRADING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李邱宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIU-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴天琮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁性扣具，包括母扣和公扣，母扣設有鎖孔、卡鎖件和第一磁性件；公扣設有鎖舌和第二磁性件；第一磁性件和第二磁性件在閉鎖方向上彼此吸引，其特徵在於，在母扣內設有第三磁性件，在鎖舌沿閉鎖方向插入鎖孔的過程中的第一階段，第三磁性件與第二磁性件之間的磁作用力可驅使卡鎖件沿垂直於閉鎖方向的第一方向移動至第一位置或使卡鎖件保持於第一位置；在鎖舌沿閉鎖方向插入鎖孔的過程中的第二階段，第三磁性件與第二磁性件之間的磁作用力可驅使卡鎖件沿垂直於閉鎖方向的第二方向由第一位置移動至第二位置而與鎖舌接合。本發明可大大簡化卡鎖件的結構，並且可縮小卡鎖件的體積，從而利於將結構小型化而擴大應用範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic buckle comprises a female buckle and a male buckle, wherein the female buckle is provided with a lock hole, a locking member and a first magnetic member; the male buckle is provided with a lock tongue and a second magnetic member; the first magnetic member and the second magnetic member attract each other in a locking direction, and is characterized in that a third magnetic member is provided in the female buckle, and in the first stage of the process of the lock tongue being inserted into the lock hole along the locking direction, the magnetic force between the third magnetic member and the second magnetic member can drive the locking member to move to a first position along a first direction perpendicular to the locking direction or keep the locking member in the first position; in the second stage of the process of the lock tongue being inserted into the lock hole along the locking direction, the magnetic force between the third magnetic member and the second magnetic member can drive the locking member to move from the first position to the second position along a second direction perpendicular to the locking direction and engage with the lock tongue. The present invention can greatly simplify the structure of the locking member and reduce the volume of the locking member, thereby facilitating the miniaturization of the structure and expanding the scope of application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:公扣</p>
        <p type="p">11:鎖舌</p>
        <p type="p">111:凹槽部</p>
        <p type="p">12:第二磁性件</p>
        <p type="p">20:母扣</p>
        <p type="p">21:第一磁性件</p>
        <p type="p">22:卡鎖件</p>
        <p type="p">221:卡鎖部</p>
        <p type="p">222:解鎖部</p>
        <p type="p">223:磁鐵安裝部</p>
        <p type="p">2231:磁鐵安裝槽</p>
        <p type="p">224:圍合部</p>
        <p type="p">225:聯動部</p>
        <p type="p">2251:作用面</p>
        <p type="p">226:凸柱部</p>
        <p type="p">23:第三磁性件</p>
        <p type="p">24:鎖孔</p>
        <p type="p">25:殼體</p>
        <p type="p">251:第一殼體</p>
        <p type="p">252:第二殼體</p>
        <p type="p">253:磁鐵架</p>
        <p type="p">254:限位柱</p>
        <p type="p">255:限位凹槽</p>
        <p type="p">26:解鎖件</p>
        <p type="p">261:按壓部</p>
        <p type="p">262:彈性臂</p>
        <p type="p">263:聯動柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1820" publication-number="202618474">
    <tif-files tif-type="multi-tif">
      <tif file="114127997.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127997</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工監控方法、加工監控裝置、計算設備及計算機可讀存儲介質</chinese-title>
        <english-title>PROCESSING MONITORING METHOD, PROCESSING MONITORING DEVICE, COMPUTING EQUIPMENT, AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G05B19/042</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳吉蘭丁智能科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELLIGENT GRINDING TECHNOLOGY (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢雪峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BI, XUEFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JINSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供的一種加工監控方法、加工監控裝置、計算設備及計算機可讀存儲介質，通過實時獲取第一加工過程中的第一信息，基於第一信息檢索模型庫內的模型，匹配第二信息與第一信息相同的物理模型，匹配出的物理模型表徵材料去除特徵與比切削量之間的第二關係，排除了刀具類型及工件材料的影響，體現第二加工過程中的加工特性，通過比較第一關係與第二關係，獲得第一加工過程與第二加工過程的區別，以提供監控建議，由於第一關係、第二關係基於材料去除特徵與比切削量而獲取，未採用工藝條件強相關的信號進行學習而生成監控閾值，較好的適用於各種加工場景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the present invention provide a processing monitoring method, a processing monitoring device, computing equipment, and a computer-readable storage medium. By acquiring first information during a first processing operation in real time and retrieving models from a model library based on the first information, a physical model matching the first information with second information is identified. The matched physical model characterizes a second relationship between material removal characteristics and specific cutting volume, eliminating the influence of tool type and workpiece material, and reflecting the machining characteristics of a second processing operation. By comparing the first relationship with the second relationship, differences between the first and second processing operations are determined to provide monitoring recommendations. Since the first and second relationships are derived based on material removal characteristics and specific cutting volume—without relying on process condition-dependent signals for learning and generating monitoring thresholds—this approach is well-suited for various machining scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工件加工系統</p>
        <p type="p">101:數控機床</p>
        <p type="p">102:監控設備</p>
        <p type="p">103:雲端設備</p>
        <p type="p">104:應用終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1821" publication-number="202617578">
    <tif-files tif-type="multi-tif">
      <tif file="114128061.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吊掛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B66D3/16</main-classification>
        <further-classification edition="200601120260131B">B66D1/58</further-classification>
        <further-classification edition="200601120260131B">F16D43/21</further-classification>
        <further-classification edition="200601120260131B">F16D7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商開道股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河西貴幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASAI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種能夠在不會大型化的情況下確保充分的減速比之吊掛。吊掛（10）具有驅動軸（40）、第一齒輪減速部、第二齒輪減速部以及負載滑輪軸（80）；第一齒輪減速部具備設置於驅動軸（40）的軸向的另一側之小齒輪、以及與小齒輪嚙合而使驅動速度減速之第一齒輪（63）；第二齒輪減速部具備第二齒輪以及與此第二齒輪嚙合而使驅動速度減速之負載齒輪（70），第二齒輪在比第一齒輪（63）更靠軸向的另一側與第一齒輪（63）以共同的旋轉軸一體地旋轉；負載滑輪軸（80）係與負載齒輪（70）同軸並從此負載齒輪（70）呈與驅動軸（40）平行地朝向軸向的一側方向延伸，與負載齒輪（70）一體地旋轉並且具有負載滑輪（84）；第一齒輪減速部位於負載滑輪（84）的外周部的半徑方向外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吊掛</p>
        <p type="p">11:第一框架</p>
        <p type="p">11f:側板部</p>
        <p type="p">11h:安裝孔</p>
        <p type="p">11k,12k:齒輪箱壁面部</p>
        <p type="p">12:第二框架</p>
        <p type="p">12f:側板部</p>
        <p type="p">13:連接軸</p>
        <p type="p">14:輪罩</p>
        <p type="p">14a:罩部</p>
        <p type="p">14b:凸緣部</p>
        <p type="p">14c:鏈條插通部</p>
        <p type="p">15:支撐板</p>
        <p type="p">15a:貫穿孔</p>
        <p type="p">15b:罩插通孔</p>
        <p type="p">16:保護部件</p>
        <p type="p">17:齒輪罩</p>
        <p type="p">20:上部掛鉤</p>
        <p type="p">30:手輪</p>
        <p type="p">30b:中心部側面</p>
        <p type="p">34:輪擋</p>
        <p type="p">40:驅動軸</p>
        <p type="p">50:制動機構</p>
        <p type="p">55:棘輪</p>
        <p type="p">55a:棘爪部</p>
        <p type="p">56:棘爪部件</p>
        <p type="p">56a:棘爪軸</p>
        <p type="p">56b:施力彈簧</p>
        <p type="p">60:減速齒輪部件</p>
        <p type="p">63:大徑齒輪</p>
        <p type="p">70:負載齒輪</p>
        <p type="p">71:中心孔</p>
        <p type="p">80:負載滑輪軸</p>
        <p type="p">81:齒輪安裝部</p>
        <p type="p">84:負載滑輪</p>
        <p type="p">90:導板</p>
        <p type="p">92:鏈條導引件</p>
        <p type="p">100:下部掛鉤</p>
        <p type="p">C1:手鏈</p>
        <p type="p">C1a:金屬環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1822" publication-number="202619140">
    <tif-files tif-type="multi-tif">
      <tif file="114128072.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電解液及金屬電池</chinese-title>
        <english-title>ELECTROLYTE SOLUTION AND METAL BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250902B">H01M10/0569</main-classification>
        <further-classification edition="201001120250902B">H01M10/052</further-classification>
        <further-classification edition="201001120250902B">H01M4/1391</further-classification>
        <further-classification edition="202101120250902B">H01M50/183</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳偉新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏吟赬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, YIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王依仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝登存</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, DENG-TSWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電解液及金屬電池。所述電解液包括溶劑、第一聚集體結構和第二聚集體結構。第一聚集體結構和第二聚集體結構分別包含彼此配位的陽離子以及陰離子，其中所述陽離子以及所述陰離子係解離自鹽類，其中第一聚集體結構中單一的陽離子與陰離子之間的配位數為2，第二聚集體結構中單一的陽離子與陰離子之間的配位數為3以上，且第二聚集體結構與第一聚集體結構的份量比值≧1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrolyte solution and a metal battery are provided. The electrolyte solution includes a solvent, a first aggregate structure and a second aggregate structure. The first aggregate structure and the second aggregate structure respectively include cations and anions that are coordinated with each other and dissociated from a salt. In the first aggregate structure, the coordination number between a single one cation of the cations and the anions is 2, while in the second aggregate structure, the coordination number between a single one of the cations and the anions is greater than 3, and a ratio of a quantity of the second aggregate structure and a quantity of the first aggregate structure is equal to or greater than 1.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1823" publication-number="202618034">
    <tif-files tif-type="multi-tif">
      <tif file="114128093.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造極紫外光可圖案化硬遮罩的方法</chinese-title>
        <english-title>METHODS FOR MAKING EUV PATTERNABLE HARD MASKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C23C16/18</main-classification>
        <further-classification edition="200601120260127B">C23C16/448</further-classification>
        <further-classification edition="201201120260127B">G03F1/22</further-classification>
        <further-classification edition="200601120260127B">G03F7/20</further-classification>
        <further-classification edition="200601120260127B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳呈昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENGHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏德曼　蒂莫西　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEIDMAN, TIMOTHY WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納迪　凱蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARDI, KATIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出在半導體基板上製造EUV可圖案化之薄膜之方法，方法包括：將有機金屬前驅物之蒸氣流與逆反應物之蒸氣流混合，以形成聚合的有機金屬材料；並將類有機金屬聚合物材料沉積在半導體基板之表面上。混合及沉積操作之執行可藉由化學氣相沉積（CVD）、原子層沉積（ALD）、及ALD與CVD之組合，例如不連續的類ALD製程，其中金屬前驅物及逆反應物不論在時間上或空間上均為分離的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for making thin-films on semiconductor substrates, which may be patterned using EUV, include: mixing a vapor stream of an organometallic precursor with a vapor stream of a counter-reactant so as to form a polymerized organometallic material; and depositing the organometallic polymer-like material onto the surface of the semiconductor substrate. The mixing and depositing operations may be performed by chemical vapor deposition (CVD), atomic layer deposition (ALD), and ALD with a CVD component, such as a discontinuous, ALD-like process in which metal precursors and counter-reactants are separated in either time or space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理</p>
        <p type="p">2:處理</p>
        <p type="p">3:處理</p>
        <p type="p">4:處理</p>
        <p type="p">5:處理</p>
        <p type="p">6:處理</p>
        <p type="p">7:處理</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1824" publication-number="202617467">
    <tif-files tif-type="multi-tif">
      <tif file="114128104.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>定位組件及載具</chinese-title>
        <english-title>POSITIONING ASSEMBLY AND CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B60N2/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李如意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RUYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MO, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張錕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寧歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NING, HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種定位組件及載具。該定位組件包括第一定位組件、第二定位組件以及鎖定機構。第一定位組件和第二定位組件兩者中的一者設有交叉呈T形的第一軌道和第二軌道，另一者設有第一滑動件和第二滑動件。第一滑動件沿第一軌道滑移，第二滑動件沿第二軌道滑移，以使第一定位組件在第二定位組件上具有後向使用模式和側向使用模式。鎖定機構設於第一定位組件和第二定位組件中的一者。當處於後向使用模式時，鎖定機構與第一定位組件和第二定位組件中的另一者鎖定配合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a positioning assembly and a carrier. The positioning assembly includes a first positioning assembly, a second positioning assembly and a locking mechanism. One of the first positioning assembly and the second positioning assembly is provided with a first rail and a second rail that intersect with each other to form a T-shape, and the other is provided with a first sliding member and a second sliding member. The first sliding member is slidable along the first rail, and the second sliding member is slidable along the second rail, so that the first positioning assembly has a rearward⁃facing usage mode and a lateral-facing usage mode on the second positioning assembly. The locking mechanism is provided on one of the first positioning assembly and the second positioning assembly. When in the rearward⁃facing usage mode, the locking mechanism is locked and engaged with the other of the first positioning assembly and the second positioning assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A100:載具</p>
        <p type="p">A110:定位組件</p>
        <p type="p">A113:旋轉座</p>
        <p type="p">A115:連接座</p>
        <p type="p">A1151:連接部</p>
        <p type="p">A1152:支撐部</p>
        <p type="p">A1153:安裝空間</p>
        <p type="p">A1161:卡槽</p>
        <p type="p">A120:第二定位組件</p>
        <p type="p">A124A:ISOFIX連接器</p>
        <p type="p">A124B:支撐腿</p>
        <p type="p">A125A:頂蓋</p>
        <p type="p">A125B:底蓋</p>
        <p type="p">A160:安全帶夾器</p>
        <p type="p">F1:第一方向</p>
        <p type="p">F2:第二方向</p>
        <p type="p">F3:第三方向</p>
        <p type="p">F4:第四方向</p>
        <p type="p">U1-U1:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1825" publication-number="202618402">
    <tif-files tif-type="multi-tif">
      <tif file="114128107.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於擴增實境裝置之光學元件</chinese-title>
        <english-title>OPTICAL ELEMENT FOR AUGMENTED REALITY DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">G02B27/01</main-classification>
        <further-classification edition="200601120260131B">G02B27/00</further-classification>
        <further-classification edition="201501120260131B">G02B1/10</further-classification>
        <further-classification edition="201501120260131B">G02B1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波利索夫　拉迪米爾尼可拉艾維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORISOV, VLADIMIR NIKOLAEVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學元件，其包括耦合至一光導及一支撐基板之一輸入耦合光柵，該輸入耦合光柵經組態以將光導引至該光導及該支撐基板中，且滿足以下關係：&lt;img align="absmiddle" height="46px" width="185px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中&lt;img align="absmiddle" height="42px" width="32px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;為該支撐基板之折射率且FOV為該光學元件之視野（度）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical element that includes an incoupling grating coupled to a lightguide and a support substrate, the incoupling grating being configured to guide light into the lightguide and the support substrate, and the following relationship being satisfied: &lt;img align="absmiddle" height="39px" width="173px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, wherein &lt;img align="absmiddle" height="42px" width="32px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; is the refractive index of the support substrate and FOV is the field of view (degrees) of the optical element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學元件</p>
        <p type="p">105:系統</p>
        <p type="p">200:光導</p>
        <p type="p">210:支撐基板</p>
        <p type="p">300:輸入耦合光柵</p>
        <p type="p">400:輸出耦合光柵</p>
        <p type="p">500a:藍色波長光</p>
        <p type="p">505:投影儀</p>
        <p type="p">515:使用者</p>
        <p type="p">520:輸入光</p>
        <p type="p">525:輸出光</p>
        <p type="p">A,B,C,D:點</p>
        <p type="p">Ds:表面傳播距離</p>
        <p type="p">Dv:體積傳播距離</p>
        <p type="p">t&lt;sub&gt;L&lt;/sub&gt;,t&lt;sub&gt;S&lt;/sub&gt;:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1826" publication-number="202618500">
    <tif-files tif-type="multi-tif">
      <tif file="114128134.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>功率級電路、多相穩壓器以及其控制電路與控制方法</chinese-title>
        <english-title>POWER STAGE CIRCUIT, MULTIPHASE VOLTAGE REGULATOR, AND CONTROL CIRCUIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G05F1/56</main-classification>
        <further-classification edition="200601120250901B">G05F1/59</further-classification>
        <further-classification edition="200601120250901B">G06F1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王珽弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊獅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種用於多相穩壓器的控制電路。控制電路包括切換控制電路以及監控電路。切換控制電路用以提供控制訊號以控制功率級電路。監控電路用以接收來自功率級電路中的至少一者的一報告訊號，並判斷該報告訊號是否指示相應功率級電路中已準備好上電。當該報告訊號指示相應功率級電路中已準備好上電後，提供控制訊號以使相應功率級電路上電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control circuit for a multiphase voltage regulator is provided. The control circuit includes a switching control circuit and a monitor circuit. The switching control circuit is configured to provide plural control signals to control plural power stage circuits. The monitor circuit is configured to receive a report signal from at least one of the power stage circuits, and determine whether the report signal indicates the corresponding power stage circuit is ready to be powered on. After the report signal indicates that the corresponding power stage circuit is ready to be powered on, the control signal is provided to power on the corresponding power stage circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:控制電路</p>
        <p type="p">12-1~12-n:功率級電路</p>
        <p type="p">100:多相穩壓器</p>
        <p type="p">Cout:輸出電容</p>
        <p type="p">I1~In:相電流</p>
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;~L&lt;sub&gt;n&lt;/sub&gt;:電感</p>
        <p type="p">MON:監控引腳</p>
        <p type="p">PWM:切換控制引腳</p>
        <p type="p">PWM1~PWMn:切換控制引腳</p>
        <p type="p">RDY:報告訊號</p>
        <p type="p">RP:報告引腳</p>
        <p type="p">S&lt;sub&gt;PWM1&lt;/sub&gt;~S&lt;sub&gt;PWMn&lt;/sub&gt;:控制訊號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1827" publication-number="202617223">
    <tif-files tif-type="multi-tif">
      <tif file="114128137.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訓練裝置及其相應的滑動單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">A63B21/062</main-classification>
        <further-classification edition="200601120260126B">A63B23/00</further-classification>
        <further-classification edition="200601120260126B">A63B23/035</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商坂下Ｒｅ　Ｌｉｆｅ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKASHITA-RE-LIFE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊山高司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IYAMA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>操心一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISAO, SINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是在提供一種相較於先前技術，零件數量較少的滑動單元、或成本低廉的滑動單元、以及具備該滑動單元的訓練裝置。本發明的一樣態的滑動單元(13(8))，其具備：框體(1300)，是在軌道上滑動自如地被安裝在該軌道上，隨著使用者的訓練在前述軌道上滑動；旋轉部，其旋轉自如地被安裝在框體(1300)上，承受訓練中來自使用者的身體的力；凸輪(1311)，是隨著該旋轉部的旋轉而旋轉；以及從動節構件(1312)，是與凸輪(1311)接觸，隨著凸輪(1311)的旋轉而移動，從動節構件(1312)，隨凸輪(1311)從基準位置順時針及逆時針的旋轉，使被彈推的負荷傳遞構件(14)朝向與彈推相反的方向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13,13(1):滑動單元</p>
        <p type="p">14:負荷傳遞構件</p>
        <p type="p">1300:框體</p>
        <p type="p">1301:旋轉部</p>
        <p type="p">1302:傘齒輪</p>
        <p type="p">1303:傘齒輪</p>
        <p type="p">1304:曲柄</p>
        <p type="p">1305:連結構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1828" publication-number="202619374">
    <tif-files tif-type="multi-tif">
      <tif file="114128146.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＭＥＭＳ模組</chinese-title>
        <english-title>MEMS MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H04R19/00</main-classification>
        <further-classification edition="200601120260119B">H04R19/02</further-classification>
        <further-classification edition="200601120260119B">H04R19/04</further-classification>
        <further-classification edition="200601120260119B">B81B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任鍾凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, JONG BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池七永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, CHIL YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭斗燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, DOO CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本公開的一個實施例的一MEMS模組包括：一基板；一第一MEMS結構，設置在基板上；一第二MEMS結構，設置在基板上並且與第一MEMS結構間隔開；以及一分隔壁結構，設置在第一MEMS結構和第二MEMS結構之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one embodiment disclosed herein, the MEMS module comprises: a substrate; a first MEMS structure disposed on the substrate; a second MEMS structure disposed on the substrate and spaced apart from the first MEMS structure; and a partition structure disposed between the first MEMS structure and the second MEMS structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:MEMS模組</p>
        <p type="p">110:基板</p>
        <p type="p">120:第一MEMS結構</p>
        <p type="p">130:第二MEMS結構</p>
        <p type="p">140:分隔壁結構(分隔第一與第二MEMS結構)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1829" publication-number="202619000">
    <tif-files tif-type="multi-tif">
      <tif file="114128154.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板搬運機器人的教示系統及基板搬運機器人的教示方法</chinese-title>
        <english-title>SUBSTRATE TRANSFER ROBOT TEACHING SYSTEM AND TEACHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/677</main-classification>
        <further-classification edition="200601120260127B">B25J9/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋崎知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIZAKI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水一平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, IPPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野真也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種基板搬運機器人的教示系統，包括基板搬運機器人（2）、攝像機（5）以及教示裝置（7），基板搬運機器人（2）具有在一側的面上保持基板（9）的手部（3）與支承前述手部（3）能夠移動的臂部（22），基板搬運機器人（2）向目標位置搬運基板（9）或從目標位置搬運基板（9），攝像機（5）固定於手部（3），用於拍攝布置於目標位置且具有實體標示（72）的治具（70），教示裝置（7）根據攝像機（5）拍攝到的治具（70）的影像，對基板搬運機器人（2）教示使手部（3）保持基板（9）或解除對基板（9）的保持的教示位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate transfer robot teaching system according to the present invention includes a substrate transfer robot (2) having a hand (3) that holds a substrate (9) on one surface and an arm (22) that movably supports the hand and transports the substrate to or from a target position; a camera (5) fixed to the hand for capturing an image of a jig (70) that is placed at the target position and has a marker (72); and a teaching device (7) that, based on the image of the jig captured by the camera, teaches the substrate transfer robot a teaching position at which the hand holds or releases the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:手部</p>
        <p type="p">17:開口</p>
        <p type="p">41:FOUP(Front Opening Unified Pod；前開式晶圓傳送盒)</p>
        <p type="p">411:側壁</p>
        <p type="p">412:支承部</p>
        <p type="p">50:影像</p>
        <p type="p">70:治具</p>
        <p type="p">71:主體</p>
        <p type="p">72:實體標示</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1830" publication-number="202619364">
    <tif-files tif-type="multi-tif">
      <tif file="114128181.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳帽裝配結構和耳機</chinese-title>
        <english-title>EARTIP ASSEMBLING STRUCTURE AND EARPHONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250805B">H04R1/02</main-classification>
        <further-classification edition="200601120250805B">H04R5/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張郭懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供了一種耳帽裝配結構和耳機，該耳帽裝配結構包括外殼、導音管以及彈性支架，導音管設置於外殼內並伸出外殼，彈性支架設置於導音管內並且包括彈扣和彈性臂，彈性臂連接彈扣並且沿水平方向彎折，彈扣伸出導音管以與耳帽扣合連接。由此，耳帽裝配結構透過彈性臂配合彈扣即可實現與耳帽扣合連接，使得耳帽可以簡單地完成裝配並且不易脫出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An eartip assembling structure and an earphone are disclosed. The eartip assembling structure includes a housing, a sound guiding tube and an elastic bracket. The sound guiding tube is disposed in the housing and is extended out of the housing. The elastic bracket is disposed in the sound guiding tube. The elastic bracket includes a buckle and an elastic arm. The elastic arm is connected to the buckle and is bended along a horizontal direction. The buckle is extended out of the sound guiding tube to fasten with a eartip. The eartip assembling structure is fastened with the eartip through the elastic arm and the buckle, making the eartip easy to assemble and not easy to fall off.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:導音管</p>
        <p type="p">12:彈性支架</p>
        <p type="p">121:彈扣</p>
        <p type="p">13:外殼</p>
        <p type="p">21:耳塞部</p>
        <p type="p">22:連接部</p>
        <p type="p">221:卡合槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1831" publication-number="202619365">
    <tif-files tif-type="multi-tif">
      <tif file="114128182.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳帽裝配結構和耳機</chinese-title>
        <english-title>EARTIP ASSEMBLING STRUCTURE AND EARPHONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250805B">H04R1/02</main-classification>
        <further-classification edition="200601120250805B">H04R5/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張郭懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供了一種耳帽裝配結構和耳機，該耳帽裝配結構包括外殼、導音管以及彈性支架，導音管設置於外殼內並伸出外殼，彈性支架設置於導音管內並且包括彈扣和彈性臂，彈性臂連接彈扣並且沿垂直方向彎折，彈扣伸出導音管以與耳帽扣合連接。由此，耳帽裝配結構透過彈性臂配合彈扣即可實現與耳帽扣合連接，使得耳帽可以簡單地完成裝配並且不易脫出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An eartip assembling structure and an earphone are disclosed. The eartip assembling structure includes a housing, a sound guiding tube and an elastic bracket. The sound guiding tube is disposed in the housing and is extended out of the housing. The elastic bracket is disposed in the sound guiding tube. The elastic bracket includes a buckle and an elastic arm. The elastic arm is connected to the buckle and is bended along a vertical direction. The buckle is extended out of the sound guiding tube to fasten with a eartip. The eartip assembling structure is fastened with the eartip through the elastic arm and the buckle, making the eartip easy to assemble and not easy to fall off.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:導音管</p>
        <p type="p">12:彈性支架</p>
        <p type="p">121:彈扣</p>
        <p type="p">13:外殼</p>
        <p type="p">21:耳塞部</p>
        <p type="p">22:連接部</p>
        <p type="p">221:卡合槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1832" publication-number="202617488">
    <tif-files tif-type="multi-tif">
      <tif file="114128228.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移行車系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251225B">B61B13/00</main-classification>
        <further-classification edition="200601120251225B">B61B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永野賢悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGANO, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村陽一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之移行車系統具備軌道與移行車。移行車具有：本體部；移行車輪；連結部，其包含可旋轉地支撐移行車輪之支撐部，且連結本體部與移行車輪；第1切換部，其藉由使連結部相對於本體部回轉，而使移行車輪之狀態於移行車輪可於第1軌道上滾動的第1狀態與移行車輪可於第2軌道上滾動的第2狀態之間切換；及限制部，其於藉由第1切換部而使移行車輪之狀態於第1狀態與第2狀態之間切換的特定期間之至少一部分內，對於軌道靜態接觸或接近，從而限制移行車之位移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:移行車</p>
        <p type="p">20:移行台車</p>
        <p type="p">30:移行部</p>
        <p type="p">31:移行車輪</p>
        <p type="p">32:輔助車輪</p>
        <p type="p">33:移行驅動馬達</p>
        <p type="p">34:台座部</p>
        <p type="p">35:連結部</p>
        <p type="p">36:支撐部</p>
        <p type="p">40:車輪回轉機構(第1切換部)</p>
        <p type="p">45:連結部導引輥</p>
        <p type="p">50:台車單元</p>
        <p type="p">51:上表面罩</p>
        <p type="p">53:殼體</p>
        <p type="p">60:可動式導引裝置</p>
        <p type="p">61:導引輥(限制部)</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1833" publication-number="202617527">
    <tif-files tif-type="multi-tif">
      <tif file="114128232.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工件插入裝置</chinese-title>
        <english-title>WORKPIECE INSERTION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B65B15/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威爾斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO WELD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小寺克義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODERA, KATSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種有利於將工件以穩定姿勢收納在腔室中的工件插入裝置。向載帶的腔室插入工件的工件插入裝置具備：基台，其具有傾斜面；分度工作台，其具有多個收納部，並且沿著傾斜面延伸；引導部，其具有引導面；工件移動裝置，其以使定位於排出位置的收納部內的工件經由由傾斜面及引導面區劃的工件路徑而朝向定位於供給位置的腔室移動的方式，對工件作用推進力；以及姿勢矯正磁鐵，其對工件的前端側端部在供給位置作用在包括上方分量的吸引方向上起作用的磁力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:編帶裝置</p>
        <p type="p">10:分度工作台</p>
        <p type="p">10a:收納部</p>
        <p type="p">10b:噴嘴</p>
        <p type="p">11:基台</p>
        <p type="p">11s:傾斜面</p>
        <p type="p">15:引導部</p>
        <p type="p">20a:腔室</p>
        <p type="p">20b:進給孔</p>
        <p type="p">25:帶通路</p>
        <p type="p">30:帶輪</p>
        <p type="p">30a:進給齒</p>
        <p type="p">33:抽吸連接路</p>
        <p type="p">35:移動部</p>
        <p type="p">37:工件保持用磁鐵</p>
        <p type="p">45:插入感測器</p>
        <p type="p">51:引導面</p>
        <p type="p">51b:上方引導面</p>
        <p type="p">53:進氣孔</p>
        <p type="p">55:姿勢矯正磁鐵</p>
        <p type="p">57:支承台</p>
        <p type="p">60:工件插入用磁鐵</p>
        <p type="p">61:第一移動用磁鐵</p>
        <p type="p">62:第二移動用磁鐵</p>
        <p type="p">65:輸送時工件保持用磁鐵</p>
        <p type="p">70:抽吸設備</p>
        <p type="p">71:回吹裝置</p>
        <p type="p">100:工件</p>
        <p type="p">101:磁性體</p>
        <p type="p">102a:第一電極</p>
        <p type="p">102b:第二電極</p>
        <p type="p">d1:長度方向</p>
        <p type="p">D:吸引方向</p>
        <p type="p">P1:排出位置</p>
        <p type="p">P2:供給位置</p>
        <p type="p">R:工件路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1834" publication-number="202617256">
    <tif-files tif-type="multi-tif">
      <tif file="114128288.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>中空絲膜元件、中空絲膜模組、脫氣方法及氣體加成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">B01D63/02</main-classification>
        <further-classification edition="200601120260115B">B01D19/00</further-classification>
        <further-classification edition="200601120260115B">B01D63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙石昂汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAISHI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於：增大膜面積。  &lt;br/&gt;本發明之中空絲膜元件2具備：液體流通管21；複數個中空絲膜22；第一固定部24，其位於第一延伸方向D1之端部，將複數個中空絲膜22固定於液體流通管21；及第二固定部25，其位於第二延伸方向D2之端部，將複數個中空絲膜22固定於液體流通管21；且於第一固定部24之外周面24a，形成有第一O形環槽24b，於第二固定部25之外周面25a，形成有第二O形環槽25b。本發明之中空絲膜模組1具備：外殼3，其收容中空絲膜元件2；第一O形環4，其嵌入形成於第一固定部24之第一O形環槽24b內，且壓接於第一固定部24及外殼3；及第二O形環5，其嵌入形成於第二固定部25之第二O形環槽25b內，且壓接於第二固定部25及外殼3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:中空絲膜元件</p>
        <p type="p">2a:第一元件端部</p>
        <p type="p">2b:第二元件端部</p>
        <p type="p">21:液體流通管</p>
        <p type="p">21a:中空部</p>
        <p type="p">21b:第一端液體流通管開口</p>
        <p type="p">21c:第二端液體流通管開口</p>
        <p type="p">21d:開口</p>
        <p type="p">21e:端部</p>
        <p type="p">21f:端部</p>
        <p type="p">22:中空絲膜</p>
        <p type="p">22a:中空部</p>
        <p type="p">22b:第一端中空絲膜開口</p>
        <p type="p">22c:第二端中空絲膜開口</p>
        <p type="p">24:第一固定部</p>
        <p type="p">24a:外周面</p>
        <p type="p">24b:第一O形環槽</p>
        <p type="p">25:第二固定部</p>
        <p type="p">25a:外周面</p>
        <p type="p">25b:第二O形環槽</p>
        <p type="p">D:延伸方向</p>
        <p type="p">D1:第一延伸方向</p>
        <p type="p">D2:第二延伸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1835" publication-number="202618138">
    <tif-files tif-type="multi-tif">
      <tif file="114128328.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油壓裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">F15B11/028</main-classification>
        <further-classification edition="200601120260129B">F15B11/044</further-classification>
        <further-classification edition="200601120260129B">F15B11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上林淳浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBAYASHI, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種驅動油壓缸的油壓裝置，其不會使油壓裝置的保養作業變得複雜，並能夠控制油壓缸的桿件的推出速度。在油壓裝置(10)的桿側通路(22)中，流動有從油壓缸(100)的桿室(105)排出的驅動用作動油。油壓裝置(10)的控制閥(40)根據泵(61)所供給的控制用作動油的壓力而作動，從而控制桿側通路(22)中的驅動用作動油的流動。油壓裝置(10)的控制器(70)對泵(61)向控制閥(40)供給的控制用作動油的壓力進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:油壓裝置</p>
        <p type="p">15:油箱</p>
        <p type="p">16:儲油器</p>
        <p type="p">20:油壓回路</p>
        <p type="p">21:頭側通路</p>
        <p type="p">22:桿側通路</p>
        <p type="p">26:第一導壓通路</p>
        <p type="p">27:第二導壓通路</p>
        <p type="p">30:供給側主通路</p>
        <p type="p">31:第一供給通路</p>
        <p type="p">32:第二供給通路</p>
        <p type="p">35:排出側主通路</p>
        <p type="p">36:第一排出通路</p>
        <p type="p">37:第二排出通路</p>
        <p type="p">40:控制閥</p>
        <p type="p">41:溢流閥</p>
        <p type="p">51:第一插式閥</p>
        <p type="p">52:第二插式閥</p>
        <p type="p">55:切換閥</p>
        <p type="p">56:第一方向切換閥</p>
        <p type="p">57:第二方向切換閥</p>
        <p type="p">58:第三方向切換閥</p>
        <p type="p">60:泵單元</p>
        <p type="p">61:油壓泵</p>
        <p type="p">62:電動機</p>
        <p type="p">63:泵控制器</p>
        <p type="p">70:控制器</p>
        <p type="p">71:微電腦</p>
        <p type="p">72:記憶裝置</p>
        <p type="p">100:油壓缸</p>
        <p type="p">101:缸管</p>
        <p type="p">102:活塞</p>
        <p type="p">103:桿件</p>
        <p type="p">104:頭室</p>
        <p type="p">105:桿室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1836" publication-number="202619406">
    <tif-files tif-type="multi-tif">
      <tif file="114128343.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、電磁波遮蔽調整方法、基板處理方法、半導體裝置之製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05H1/18</main-classification>
        <further-classification edition="200601120260102B">H05H1/24</further-classification>
        <further-classification edition="200601120260102B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>室林正季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUROBAYASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠防止電磁波之漏洩之技術。  &lt;br/&gt;本發明之基板處理裝置包含：容器，其供處理基板；電漿產生部，其設置於前述容器之外周，具有施加有高頻電力之電極、連接於前述電極之饋電路、及經由前述饋電路朝前述電極供給前述高頻電力之供給部；屏蔽件，其設置於前述電極之外周，遮蔽自前述電極放射之電磁波；開口部，其設置於前述屏蔽件，供前述饋電路插通；複數個遮蔽部，其等在前述開口部之周圍、及前述供給部之與前述開口部對向之部位之周圍，分別以彼此相互重疊之方式設置；及控制部，其能夠將前述電漿產生部以相對於前述屏蔽件相對性地移動之方式進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板處理裝置</p>
        <p type="p">200:晶圓(基板之一例)</p>
        <p type="p">201:處理室</p>
        <p type="p">201a:電漿產生空間</p>
        <p type="p">201b:基板處理空間</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:處理容器(容器之一例)</p>
        <p type="p">210:上部容器</p>
        <p type="p">211:下部容器</p>
        <p type="p">212:諧振線圈(電極之一例)</p>
        <p type="p">213:可動抽頭</p>
        <p type="p">214:固定接地</p>
        <p type="p">215:可動抽頭</p>
        <p type="p">216:電漿產生部</p>
        <p type="p">217:晶座</p>
        <p type="p">217a:貫通孔</p>
        <p type="p">217b:加熱器</p>
        <p type="p">217c:阻抗調整電極</p>
        <p type="p">221:控制器</p>
        <p type="p">224:屏蔽件</p>
        <p type="p">228:加熱器</p>
        <p type="p">230:氣體供給部</p>
        <p type="p">231:氣體排氣管</p>
        <p type="p">232:氣體供給管</p>
        <p type="p">232a:第1氣體供給管</p>
        <p type="p">232b:第2氣體供給管</p>
        <p type="p">232c:惰性氣體供給管</p>
        <p type="p">233:蓋體</p>
        <p type="p">234:氣體導入口</p>
        <p type="p">235:氣體排氣口</p>
        <p type="p">236:氣體供給頭</p>
        <p type="p">237:緩衝室</p>
        <p type="p">238:開口</p>
        <p type="p">239:氣體吹出口</p>
        <p type="p">240:遮蔽板</p>
        <p type="p">242:APC閥</p>
        <p type="p">243a:閥</p>
        <p type="p">243b:閥</p>
        <p type="p">244:閘閥</p>
        <p type="p">245:搬入出口</p>
        <p type="p">246:真空泵</p>
        <p type="p">250a:第1氣體供給源</p>
        <p type="p">250b:第2氣體供給源</p>
        <p type="p">250c:惰性氣體供給源</p>
        <p type="p">252a,252b,252c:MFC(質流控制器)</p>
        <p type="p">253a 253b,253c:閥</p>
        <p type="p">266:晶圓頂升銷</p>
        <p type="p">268:晶座升降機構</p>
        <p type="p">272:RF感測器</p>
        <p type="p">273:高頻電源</p>
        <p type="p">274:匹配器</p>
        <p type="p">275:阻抗可變機構</p>
        <p type="p">276:加熱器電力調整機構</p>
        <p type="p">277:供給部</p>
        <p type="p">278:饋電路</p>
        <p type="p">279:開口部</p>
        <p type="p">A~F:信號線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1837" publication-number="202619595">
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      <tif file="114128374.zip" no="1">
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          <doc-number>202619595</doc-number>
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        <document-id>
          <doc-number>114128374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型發光二極體晶片及其形成方法、汽車車燈</chinese-title>
        <english-title>MICRO LIGHT EMITTING DIODE CHIP AND FORMING METHOD THEREOF, AND AUTOMOBILE LAMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10H20/841</main-classification>
        <further-classification edition="202501120251001B">H10H20/855</further-classification>
        <further-classification edition="202501120251001B">H10H20/857</further-classification>
        <further-classification edition="202501120251001B">H10H29/01</further-classification>
        <further-classification edition="202501120251001B">H10H29/14</further-classification>
        <further-classification edition="202501120251001B">H10H20/01</further-classification>
        <further-classification edition="201601120251001B">F21K9/00</further-classification>
        <further-classification edition="201801320251001B">F21W105/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種微型發光二極體晶片及其形成方法、汽車車燈，其中微型發光二極體晶片包括：第一磊晶層，第一磊晶層具有相對的第一側和第二側；位於第一側的複數個多量子阱層，多量子阱層與第一磊晶層接觸；位於第一側的複數個第二磊晶層，每個多量子阱層位於第一磊晶層和對應的第二磊晶層之間；位於第一側的複數個導電反射鏡層，每個導電反射鏡層與對應的第二磊晶層電性連接，且每個導電反射鏡層包圍對應的多量子阱層的非出光側。通過增設的複數個導電反射鏡層，導電反射鏡層不僅能夠滿足微型發光二極體晶片電性連接的需求，還能夠將多量子阱層朝向非出光側發射的光線進行阻擋與反射，以此提升微型發光二極體晶片的光電轉化效率以及減少光串擾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro light-emitting diode chip and a method for forming the same, and an automobile lamp, wherein the micro light-emitting diode chip comprises: a first epitaxial layer, the first epitaxial layer having a first side and a second side++ opposite to each other; a plurality of multi-quantum well layers located on the first side, the multi-quantum well layers being in contact with the first epitaxial layer; a plurality of second epitaxial layers located on the first side, each multi-quantum well layer being located between the first epitaxial layer and the corresponding second epitaxial layer; and a plurality of conductive reflector layers located on the first side, each conductive reflector layer being electrically connected to the corresponding second epitaxial layer, and each conductive reflector layer surrounding the non-light-emitting side of the corresponding multi-quantum well layer. By adding a plurality of conductive reflector layers, the conductive reflector layers can not only meet the electrical connection requirements of the micro-LED chip, but also block and reflect the light emitted from the multi-quantum well layer toward the non-light-emitting side, thereby improving the photoelectric conversion efficiency of the micro-LED chip and reducing optical crosstalk.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101a:第一側</p>
        <p type="p">101b:第二側</p>
        <p type="p">105:第一歐姆接觸層</p>
        <p type="p">106:第二磊晶層</p>
        <p type="p">107:多量子阱層</p>
        <p type="p">108:第一磊晶層</p>
        <p type="p">109:導電反射鏡層</p>
        <p type="p">110:鈍化層</p>
        <p type="p">111:第一導電插塞</p>
        <p type="p">112:介質層</p>
        <p type="p">113:第一對位元標記</p>
        <p type="p">114:第四導電插塞</p>
        <p type="p">115:第二導電結構</p>
        <p type="p">116:第一導電結構</p>
        <p type="p">117:第二歐姆接觸層</p>
        <p type="p">119:微透鏡</p>
        <p type="p">120:螢光層</p>
        <p type="p">121:圍壩結構</p>
        <p type="p">1081:凸起部</p>
        <p type="p">2001:驅動電路層</p>
        <p type="p">2002:驅動背板導電插塞</p>
        <p type="p">2003:功能導電插塞</p>
        <p type="p">3001:金屬板</p>
        <p type="p">3002:第二導電插塞</p>
        <p type="p">3003:第三導電插塞</p>
        <p type="p">3004:第二對位元標記</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1838" publication-number="202618906">
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        <document-id>
          <doc-number>114128504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>從物體上分離出物體部分的方法和承接系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/304</main-classification>
        <further-classification edition="200601120260127B">H01L21/306</further-classification>
        <further-classification edition="200601120260127B">B01D29/11</further-classification>
        <further-classification edition="200601120260127B">C23F1/08</further-classification>
        <further-classification edition="200601120260127B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商雷納科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENA TECHNOLOGIES GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMITT, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯格　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUGGER, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫斯　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HESS, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朵恩　法比昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DORN, FABIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛斯特　尼歐斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種從物體上分離出物體部分的方法，其中沿著待分離物體部分在物體材料中局部誘發材料缺陷(80)；透過在蝕刻介質中蝕刻物體而從物體分離出(88)物體部分，含有材料缺陷的物體材料比沒有缺陷的物體材料受到較強的蝕刻；物體在蝕刻前佈置在支架(40)中(82)；支架(40)在蝕刻前佈置在濾籃(10)中(84)；為了蝕刻物體，以濾籃(10)及連同其中佈置的支架(40)所組成承接系統(60)至少段落式佈置在蝕刻介質中(86)；從物體分離出來的至少一部分物體部分被留滯在濾籃中(90)。本發明還關於一種執行該方法的濾籃和支架以及承接系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:濾籃</p>
        <p type="p">12:底板</p>
        <p type="p">16:側板</p>
        <p type="p">18:狹長側板</p>
        <p type="p">40:支架</p>
        <p type="p">42:底部</p>
        <p type="p">53:上緣</p>
        <p type="p">55:側板</p>
        <p type="p">62:基材</p>
        <p type="p">64:輸入管</p>
        <p type="p">66:蝕刻液流</p>
        <p type="p">67:蝕刻液</p>
        <p type="p">97:從支架引出蝕刻液</p>
        <p type="p">98:從濾籃引出蝕刻液</p>
        <p type="p">99:蝕刻液溢出容器</p>
        <p type="p">100:容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1839" publication-number="202616945">
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        <document-id>
          <doc-number>114128543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動物用排泄物處理材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A01K1/015</main-classification>
        <further-classification edition="200601120260127B">B01J20/24</further-classification>
        <further-classification edition="200601120260127B">B01J20/28</further-classification>
        <further-classification edition="200601120260127B">B01J20/30</further-classification>
        <further-classification edition="200601120260127B">A01K1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商優你　嬌美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNICHARM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋野泰洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKINO, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本泰生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種動物用排泄物處理材料，其即使長時間使用時，也不易吸附排泄物，排泄物所致的著色、膨脹、龜裂等外觀的變化少。本揭示之動物用排泄物處理材料具有以下的構成。  &lt;br/&gt;　　一種動物用排泄物處理材料，其特徵在於包含作為主成分的源自植物的材料、結合樹脂與撥水劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統化廁所</p>
        <p type="p">3:動物用排泄物處理材料</p>
        <p type="p">5:上側容器</p>
        <p type="p">7:下側容器</p>
        <p type="p">9:排泄物處理薄片</p>
        <p type="p">11:殼罩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1840" publication-number="202618323">
    <tif-files tif-type="multi-tif">
      <tif file="114128576.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於預測電池能源儲存系統的電池健康狀態的裝置及電腦系統</chinese-title>
        <english-title>APPARATUS AND COMPUTER SYSTEM FOR PREDICTING BATTERY HEALTH STATE OF BATTERY ENERGY STORAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250910B">G01R31/392</main-classification>
        <further-classification edition="201901120250910B">G01R31/396</further-classification>
        <further-classification edition="201901120250910B">G01R31/3842</further-classification>
        <further-classification edition="202301120250910B">G06N3/0442</further-classification>
        <further-classification edition="202301120250910B">G06N3/0985</further-classification>
        <further-classification edition="202301120250910B">G06N3/08</further-classification>
        <further-classification edition="202301120250910B">G06F18/27</further-classification>
        <further-classification edition="201801120250910B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王金龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JINLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃湙傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於預測具有一或多個電化學電池單元的目標電池模組的電池健康狀態值的裝置，其包括處理器和記憶體。記憶體具有儲存在其上的電腦可執行指令，當其由處理器執行時，使得該裝置進行下列操作：取得機器學習模型，其已利用與參考電池模組相關聯的第一資料段以及對應於第一資料段的第一電池健康狀態值進行訓練；在目標電池模組的一或多個充電循環中收集目標電池模組的電池充電資料；從電池充電資料擷取第二資料段；轉換第二資料段以對齊第一資料段；以及將轉換後的第二資料段輸入至機器學習模型，以預測目標電池模組的電池健康狀態值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for predicting a battery health state value of a target battery module having one or more electrochemical battery cells is provided. The apparatus includes a processor and a memory. The memory has computer-executable instructions stored thereupon which, when executed by the processor, cause the apparatus to perform the following operations: obtain a machine-learning model, which has been trained with first data segments and first battery health state values corresponding to first data segments associated with a reference battery module; collect battery charging data of the target battery module over one or more charging cycles of the target battery module; extract a second data segment from the battery charging data; transform the second data segment to align with the first data segments; and input the transformed second data segment to the machine-learning model to predict a battery health state value of the target battery module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池能源儲存系統</p>
        <p type="p">11:負載</p>
        <p type="p">12:通訊連結</p>
        <p type="p">100:電池能源儲存裝置</p>
        <p type="p">110:控制裝置</p>
        <p type="p">111:微控制器單元</p>
        <p type="p">112:揮發性記憶體</p>
        <p type="p">113:資料儲存裝置</p>
        <p type="p">114:唯讀記憶體</p>
        <p type="p">115:通訊模組</p>
        <p type="p">118:內部匯流排</p>
        <p type="p">120:電池組</p>
        <p type="p">121:電池模組</p>
        <p type="p">122:資料擷取電路</p>
        <p type="p">200:運算裝置</p>
        <p type="p">1211:電池單元</p>
        <p type="p">1212:電壓感測器</p>
        <p type="p">1213:電流感測器</p>
        <p type="p">1214:溫度感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1841" publication-number="202619122">
    <tif-files tif-type="multi-tif">
      <tif file="114128607.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128607</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01L23/538</main-classification>
        <further-classification edition="200601120251001B">H01L23/528</further-classification>
        <further-classification edition="200601120251001B">H01L23/498</further-classification>
        <further-classification edition="200601120251001B">H01L23/36</further-classification>
        <further-classification edition="200601120251001B">H01L25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旋乃仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUAN, NAI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包含基板、多個凸塊及晶片。基板具有上表面與下表面。基板包含多個下接點、多個上接點、第一走線層、第二走線層、金屬散熱單元、凹槽及穩壓器。第一走線層設置於上表面與下表面之間。第二走線層位於第一走線層上。金屬散熱單元設置於第一走線層及第二走線層之間。凹槽設置於基板之一側。第一走線層之一部分裸露於凹槽之槽底。穩壓器設置於凹槽中且電性連接於第一走線層。各凸塊電性連接於各上接點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a plurality of bumps, and a chip. The substrate has an upper surface and a lower surface and includes a plurality of lower contacts, a plurality of upper contacts, a first trace layer, a second trace layer, a metal heat dissipation unit, a cavity, and a voltage regulator. The first trace layer is disposed between the upper surface and the lower surface. The second trace layer is located above the first trace layer. The metal heat dissipation unit is disposed between the first trace layer and the second trace layer. The cavity is formed on one side of the substrate, with a portion of the first trace layer exposed at the bottom of the cavity. The voltage regulator is disposed in the cavity and electrically connected to the first trace layer. Each of the bump is electrically connected to each of the upper contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">11:基板</p>
        <p type="p">12:凸塊</p>
        <p type="p">13:晶片</p>
        <p type="p">14:晶片接點</p>
        <p type="p">15:錫球</p>
        <p type="p">111:下接點</p>
        <p type="p">112:上接點</p>
        <p type="p">113:第一走線層</p>
        <p type="p">114:第二走線層</p>
        <p type="p">115:第一導電通孔</p>
        <p type="p">116:第二導電通孔</p>
        <p type="p">117:第三導電通孔</p>
        <p type="p">118:金屬散熱單元</p>
        <p type="p">119:凹槽</p>
        <p type="p">120:穩壓器</p>
        <p type="p">121:穩壓器接點</p>
        <p type="p">20:半導體裝置</p>
        <p type="p">21:基板</p>
        <p type="p">22:第一晶片</p>
        <p type="p">23:第二晶片</p>
        <p type="p">24:第一金屬連接柱</p>
        <p type="p">25:第二金屬連接柱</p>
        <p type="p">26:金屬散熱罩</p>
        <p type="p">27:模封層</p>
        <p type="p">211:下接點</p>
        <p type="p">212:上接點</p>
        <p type="p">2111:接地接點</p>
        <p type="p">2121:第一接點</p>
        <p type="p">2122:第二接點</p>
        <p type="p">261:水平部分</p>
        <p type="p">262:側邊部分</p>
        <p type="p">1:半導體結構</p>
        <p type="p">30:第三金屬連接柱</p>
        <p type="p">40:膠層</p>
        <p type="p">1121:凸塊接點</p>
        <p type="p">1122:第一連接柱接點</p>
        <p type="p">2112:第二連接柱接點</p>
        <p type="p">213:導電通孔</p>
        <p type="p">X,Y,Z:投影方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1842" publication-number="202617460">
    <tif-files tif-type="multi-tif">
      <tif file="114128625.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251017B">B60L50/16</main-classification>
        <further-classification edition="200601120251017B">B60L15/20</further-classification>
        <further-classification edition="200710120251017B">B60K6/36</further-classification>
        <further-classification edition="201201120251017B">B60W10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商椿本鏈條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKIMOTO CHAIN CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綱島宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNASHIMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田翔二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明為了提供一種能夠防止駐車制動機構的破損或損耗而長時間地發揮駐車制動機構的所期待的功能的車輛控制裝置，而設為包括以如下方式構成的控制部（115）的結構：在藉由設置於駐車制動機構（120）中的制動部件的附近的動作狀態偵測感測器（111）偵測到駐車制動機構（120）處於作動狀態時，抑止因加速踏板（109）的操作產生車輛驅動力。制動部件包括咬合離合器（130），所述咬合離合器（130）藉由機械性咬合禁止設置有車輪的車軸的旋轉。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
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        <p type="p">105:驅動裝置</p>
        <p type="p">106:馬達</p>
        <p type="p">107:減速機</p>
        <p type="p">108:駐車制動器操作部</p>
        <p type="p">109:加速踏板</p>
        <p type="p">110:車輛控制裝置</p>
        <p type="p">111:動作狀態偵測感測器</p>
        <p type="p">115:控制部</p>
        <p type="p">116:車速感測器</p>
        <p type="p">120:駐車制動機構</p>
        <p type="p">121:選檔器驅動機構</p>
        <p type="p">130:咬合離合器</p>
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          <doc-number>114128626</doc-number>
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      <invention-title>
        <chinese-title>車輛控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251106B">B60W10/04</main-classification>
        <further-classification edition="201201120251106B">B60W10/10</further-classification>
        <further-classification edition="201201120251106B">B60W10/18</further-classification>
        <further-classification edition="200601120251106B">B60L15/10</further-classification>
        <further-classification edition="200601120251106B">B60L15/20</further-classification>
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                <last-name>日商椿本鏈條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKIMOTO CHAIN CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>綱島宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNASHIMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>田邊充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>廣田翔二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>西田篤史</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>NISHIDA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明為了提供一種能夠防止駐車制動機構的破損或損耗而長時間地發揮駐車制動機構的所期待的功能的車輛控制裝置，而設為包括以如下方式構成的控制部（115）的結構：在藉由操作狀態偵測感測器（111）偵測到駐車制動機構（120）處於作動狀態時，抑止因加速踏板（109）的操作產生車輛驅動力，在藉由車速感測器（116）偵測到車輛處於行駛狀態時，抑止因駐車制動器操作部（108）的操作產生制動部件切換力，所述操作狀態偵測感測器（111）對駐車制動器操作部（108）的操作狀態進行偵測，所述駐車制動器操作部（108）以能夠在使駐車制動機構（120）成為作動狀態的作動位置與使駐車制動機構（120）成為解除狀態的解除位置之間由車輛駕駛者進行操作的方式構成。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">105:驅動裝置</p>
        <p type="p">106:馬達</p>
        <p type="p">107:減速機</p>
        <p type="p">108:駐車制動器操作部</p>
        <p type="p">109:加速踏板</p>
        <p type="p">110:車輛控制裝置</p>
        <p type="p">111:操作狀態偵測感測器</p>
        <p type="p">115:控制部</p>
        <p type="p">116:車速感測器</p>
        <p type="p">120:駐車制動機構</p>
        <p type="p">121:選檔器驅動機構</p>
        <p type="p">130:咬合離合器</p>
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        <document-id>
          <doc-number>114128627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>小型車輛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">B60J5/04</main-classification>
        <further-classification edition="200601120251128B">B60N2/04</further-classification>
        <further-classification edition="200601120251128B">B60N2/12</further-classification>
        <further-classification edition="200601120251128B">B60N2/14</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商椿本鏈條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKIMOTO CHAIN CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綱島宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNASHIMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田翔二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>西田篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="5">
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              <chinese-name name-type="organization">
                <last-name>星野亮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>山内昌彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="7">
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              <chinese-name name-type="organization">
                <last-name>小山剛司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYAMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明提供一種藉由簡單的結構使得在車體的狹小的空間內儘可能的大小的座席不與其他結構發生干涉而能夠旋轉的小型車輛。本發明的小型車輛100包括：車體110，設置有供使用者就座的以縱向一行配置的座席120；行駛用車輪130，使車體110沿著行進方向進退移動；及驅動源，驅動行駛用車輪130，座席120以能夠經由旋轉軸132旋轉180度以上的方式連接於車體110，車體110包括搭乘口111，所述搭乘口111包括容許座席120的旋轉的開口。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
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        <p type="p">100:小型車輛</p>
        <p type="p">110:車體</p>
        <p type="p">111:搭乘口</p>
        <p type="p">120:座席</p>
        <p type="p">121:座面</p>
        <p type="p">122:靠背</p>
        <p type="p">123:操作面板(操作部)</p>
        <p type="p">130:行駛用車輪</p>
        <p type="p">131:連接基部</p>
        <p type="p">132:旋轉軸</p>
        <p type="p">ta:搭乘口的長度</p>
        <p type="p">tb:座席的長度</p>
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        <chinese-title>用戶操作的偵測系統及其方法</chinese-title>
        <english-title>DETECTION SYSTEM FOR USER OPERATION AND METHOD THEREOF</english-title>
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        <main-classification edition="202201120251008B">G06F3/0488</main-classification>
        <further-classification edition="202201120251008B">G06V40/20</further-classification>
        <further-classification edition="200601120251008B">G01B11/03</further-classification>
        <further-classification edition="200601120251008B">G01B11/22</further-classification>
        <further-classification edition="200601120251008B">G02B26/12</further-classification>
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                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>邱盟賀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MENG-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>梁哲瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>劉顓瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>唐聖傑</last-name>
                <first-name></first-name>
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                <last-name>TANG, SHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃禎頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>吳庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭創元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHUANG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用戶操作的偵測系統及其方法。在方法中，發出雷射光並透過振鏡模組產生在掃描區域上移動的雷射掃描線。事件型光學感測器偵測雷射掃描線的光學變化資訊，以產生包括深度資訊的第一座標參數。影像擷取裝置拍攝掃描區域，以決定目標物件的第二座標參數。處理器將第一座標參數映射至第二座標參數，並依據第二座標參數的變化資訊決定目標物件的行為。藉此，可提升與投影內容互動的直觀性與準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection system for user operation and method thereof are provided. In the method, a laser beam is emitted and formed into a laser scanning line moving on a scanning area via a galvanometer module. An event-based optical sensor detects optical change information of the laser scanning line to generate a first coordinate parameter that includes depth information. An image capture device captures the scanning area to determine a second coordinate parameter of a target object. A processor maps the first coordinate parameter to the second coordinate parameter and determines a behavior of the target object based on change information of the second coordinate parameter. Therefore, the intuitiveness and accuracy of interacting with projected content could be enhanced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410~S480:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1846" publication-number="202617100">
    <tif-files tif-type="multi-tif">
      <tif file="114128710.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療身體組織的裝置</chinese-title>
        <english-title>DEVICE FOR TREATMENT OF BODY TISSUE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61B18/22</main-classification>
        <further-classification edition="200601120260131B">A61N5/06</further-classification>
        <further-classification edition="200601120260131B">A61N5/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉脫維亞商樂導光學國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIA LIGHT GUIDE OPTICS INTERNATIONAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>札爾林斯　歐斯卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DZERINS, OSKARS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法福羅澤　道曼茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFAFRODS, DAUMANTS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於治療身體組織之裝置（17），其尤其用於靜脈曲張（較佳為下肢靜脈曲張）、精索靜脈曲張及/或血管畸形之永久閉塞；及/或用於美容手術，較佳為雷射輔助脂肪分解；及/或用於腫瘤治療，藉助於雷射誘導之熱療法及/或光動力療法；及/或尤其用於照射腦組織、用於耳鼻喉應用（尤其係組織壞死）、用於藉由雷射光進行表面消毒、用於皮膚病治療（包括應用於皮膚及/或指甲），及/或用於治療藏毛竇、肛瘺及/或痔瘡，藉助於光擴散器（13）以用於藉由雷射光能量及/或藉由電磁輻射照射該組織，其中該光擴散器（13）設計成相對於該光擴散器（13）之縱向中心軸橫向且腔內地照射輻射。依據本發明，滑動層（51）至少在某些區域中，較佳在該擴散器（13）之前遠端之區域中及/或在該擴散器（13）之能量發射之區域中，尤其完全地設置於該擴散器（13）之遠端之外表面（尤其最外表面）上，尤其為了減少與該周圍組織之摩擦及/或尤其為了減少與該周圍組織之黏附。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a device (17) for treatment of body tissue, in particular for the permanent occlusion of varicose veins, preferably in the lower limbs, of varicocele and/or of vascular malformations and/or for the use in aesthetic surgeries, preferably laser assisted lipolysis, and/or for tumor treatment by means of laser induced thermotherapy and/or photodynamic therapy, and/or in particular for the irradiation of brain tissue, for ear-nose-throat applications, in particular necrosis of tissue, for surface disinfection by laser light, for dermatologic treatment, including application on skin and/or nails and/or for treatment of pilonidal sinus, anal fistula and/or hemorrhoids, by means of a light diffuser (13) for irradiating said tissue by laser light energy and/or by electromagnetic radiation, wherein the light diffuser (13) is designed to irradiate the radiation laterally with respect to a longitudinal center axis of the light diffuser (13) and endoluminally. According to the invention, a sliding layer (51) is provided on an outer surface, in particular the outermost surface, of a distal end of the diffuser (13) at least in certain regions, preferably in the region of the front distal end of the diffuser (13) and/or in the region of the energy emission of the diffuser (13), in particular completely, in particular to reduce friction with and/or in particular to reduce adhesion to said surrounding tissue.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:芯</p>
        <p type="p">2:包層</p>
        <p type="p">3:緩衝層</p>
        <p type="p">4:溝槽</p>
        <p type="p">5:溝槽</p>
        <p type="p">6:反射器</p>
        <p type="p">7:蓋</p>
        <p type="p">8:區段</p>
        <p type="p">9:膠</p>
        <p type="p">10:源</p>
        <p type="p">12:波導</p>
        <p type="p">13:擴散器</p>
        <p type="p">14:外鞘</p>
        <p type="p">17:裝置</p>
        <p type="p">25:保護鞘</p>
        <p type="p">51:滑動層</p>
        <p type="p">52:保護構件</p>
        <p type="p">A:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1847" publication-number="202619137">
    <tif-files tif-type="multi-tif">
      <tif file="114128711.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128711</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃料電池堆疊、燃料電池裝置</chinese-title>
        <english-title>FUEL CELL STACK, FUEL CELL APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260127B">H01M8/12</main-classification>
        <further-classification edition="201601120260127B">H01M8/0606</further-classification>
        <further-classification edition="201601120260127B">H01M8/2425</further-classification>
        <further-classification edition="200601120260127B">C01B3/04</further-classification>
        <further-classification edition="200601120260127B">B01J23/755</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍格　亨利科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUNGE, HENRICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於使用氨（A）操作之燃料電池裝置（10）之燃料電池堆疊（12），其具有複數個彼此堆疊之燃料電池（100）及複數個互連器（96），其中在二個相鄰燃料電池（100）之間分別設置互連器（96）。  &lt;br/&gt;提出每個互連器（96）均具有用於將氨（A）轉化為氮氣（N）及氫氣（H）之氨裂解劑（98）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a fuel cell stack (12) for a fuel cell apparatus (10) for operating with ammonia (A), having a plurality of fuel cells (100) stacked above one another and a plurality of interconnectors (96), wherein an interconnector (96) is arranged in each case between two adjacent fuel cells (100). &lt;br/&gt;It is proposed that the interconnectors (96) each have an ammonia cracker (98) for converting the ammonia (A) into nitrogen (N) and hydrogen (H).</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:燃料電池堆疊</p>
        <p type="p">96:互連器</p>
        <p type="p">98:氨裂解劑</p>
        <p type="p">100:燃料電池</p>
        <p type="p">102:燃料室</p>
        <p type="p">104:燃料入口</p>
        <p type="p">A:氨</p>
        <p type="p">H:氫氣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1848" publication-number="202618976">
    <tif-files tif-type="multi-tif">
      <tif file="114128730.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128730</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體清洗用幫浦裝置</chinese-title>
        <english-title>PUMP DEVICE FOR SEMICONDUCTOR CLEANING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/67</main-classification>
        <further-classification edition="200601120260127B">F04B43/06</further-classification>
        <further-classification edition="200601120260127B">F04B39/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商杰宜斯科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEUS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李康源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GANGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SEUNG DAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金建亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GUN HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種半導體清洗用幫浦裝置，其包括：波紋管驅動部；閥部，其連接於波紋管驅動部而控制流體之進出；吸入部，其連接於閥部而供流體流入；排出部，其連接於閥部而排出流體；罩蓋部，其包覆排出部；及結露減少部，其形成於罩蓋部而減緩形成於排出部之結露及結冰。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體清洗用幫浦裝置</p>
        <p type="p">10:波紋管驅動部</p>
        <p type="p">20:閥部</p>
        <p type="p">30:吸入部</p>
        <p type="p">40:排出部</p>
        <p type="p">50:罩蓋部</p>
        <p type="p">60:結露減少部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1849" publication-number="202618131">
    <tif-files tif-type="multi-tif">
      <tif file="114128743.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非蒸發性吸氣劑模組</chinese-title>
        <english-title>NON-EVAPORABLE GETTER MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">F04B37/14</main-classification>
        <further-classification edition="200601120260127B">F04B37/04</further-classification>
        <further-classification edition="202101120260127B">B22F10/38</further-classification>
        <further-classification edition="200601120260127B">B01J20/28</further-classification>
        <further-classification edition="202101120260127B">B22F10/28</further-classification>
        <further-classification edition="200601120260127B">B01D53/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商沙斯格特斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAES GETTERS S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波瑟利　托瑪索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PORCELLI, TOMMASO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布賽托　碧翠絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUSETTO, BEATRICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆拉　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURA, MICHELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加里托諾塔　亞歷山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALLITOGNOTTA, ALESSANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁赫　法蘭西斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DINH, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種非蒸發性吸氣劑（NEG）材料之吸氣劑模組（1），其藉由提供微觀尺度孔隙度(porosity)與巨觀尺度孔隙度之間的比率而經改良以用於高及超高真空裝備中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to a getter module (1) of non-evaporable getter (NEG) material, improved for the use in high and ultra-high vacuum equipment by providing a specific ratio between microscale and macroscale porosity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸氣劑模組</p>
        <p type="p">2:表面</p>
        <p type="p">3:空腔</p>
        <p type="p">4:表面</p>
        <p type="p">5:縱樑</p>
        <p type="p">6:空腔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1850" publication-number="202618151">
    <tif-files tif-type="multi-tif">
      <tif file="114128769.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變速裝置及行駛車輛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251026B">F16H37/02</main-classification>
        <further-classification edition="200601120251026B">F16H3/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商椿本鏈條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKIMOTO CHAIN CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綱島宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNASHIMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田翔二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野亮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山内昌彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山剛司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYAMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種變速裝置及行駛車輛，該變速裝置為簡單的結構，可抑制製造成本，可實現小型化、輕量化，且布局自由度高。一種變速裝置100，在具有大致平行的旋轉軸的第一軸101與第二軸102之間以多個變速比來傳遞旋轉，其中，第一軸101具有可同軸地旋轉的第一旋轉體110、第二旋轉體120及切換旋轉體150，第二軸102具有第三旋轉體130及第四旋轉體140，第一旋轉體110與第三旋轉體130經由第一傳遞條體111來傳遞旋轉，第二旋轉體120與第四旋轉體140經由第二傳遞條體121來傳遞旋轉，切換旋轉體150構成為可切換自切換旋轉體150向第一旋轉體110傳遞動力的第一傳遞狀態與自切換旋轉體150向第二旋轉體120傳遞動力的第二傳遞狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:變速裝置</p>
        <p type="p">101:第一軸</p>
        <p type="p">102:第二軸</p>
        <p type="p">110:第一鏈輪(第一旋轉體)</p>
        <p type="p">111:第一鏈條(第一傳遞條體)</p>
        <p type="p">112:第一離合承接面(軸向側面)</p>
        <p type="p">120:第二鏈輪(第二旋轉體)</p>
        <p type="p">121:第一鏈條(第二傳遞條體)</p>
        <p type="p">122:第二離合承接面(軸向側面)</p>
        <p type="p">130:第三鏈輪(第三旋轉體)</p>
        <p type="p">140:第四鏈輪(第四旋轉體)</p>
        <p type="p">150:切換旋轉體</p>
        <p type="p">151:第一離合面(軸向側面)</p>
        <p type="p">152:第二離合面(軸向側面)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1851" publication-number="202618801">
    <tif-files tif-type="multi-tif">
      <tif file="114128823.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於生成式人工智慧的臨床作業流程優化系統及方法</chinese-title>
        <english-title>CLINICAL WORKFLOW OPTIMIZATION SYSTEM VIA GENERATIVE ARTIFICIAL INTELLIGENCE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251001B">G16H40/20</main-classification>
        <further-classification edition="201801120251001B">G16H50/20</further-classification>
        <further-classification edition="201801120251001B">G16H10/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG SHAN MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山醫學大學附設醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG SHAN MEDICAL UNIVERSITY HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈偉誌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周英香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本申請關於一種臨床作業流程優化系統，包括資料處理分析平台以及生成式人工智慧模型集合。資料處理分析平台與用戶裝置及醫院資訊系統伺服器電性連接或通訊連接，並提供設定完成的小幫手工具。生成式人工智慧模型集合與資料處理分析平台通訊連接。其中當用戶裝置選擇其中一個小幫手工具執行任務指令時，資料處理分析平台透過生成式人工智慧模型集合中的生成式人工智慧模型解讀任務指令的內容以及執行任務指令，且資料處理分析平台將任務指令的執行結果呈現給用戶裝置，其中執行該任務指令所需的資料是記載於該任務指令的內容，或者來自於該醫院資訊系統伺服器、該用戶裝置或一外部資料庫。在平台上，使用者可根據需求，透過平台提供的標準化與模組化小幫手模組，使用自然語言自主開發建立臨床資料處理工具，無需具備程式設計能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A clinical workflow optimization system is provided. The system includes a data process and analysis platform communication connected with a user device and a hospital information system (HIS) server, and a generative artificial intelligence (AI) model set electrically/communication connected with the data process and analysis platform. The data process and analysis platform provides one or more configured assistant tools. Wherein, when the user device selects one of the assistant tools to execute a mission instruction, the data process and analysis platform uses one model of the generative AI model set to interpret the mission instruction and executes the mission instruction, and the analysis platform presents an executing result of the mission instruction to the user device, wherein data required to execute the mission instructions is recorded in the content of the mission instructions, or provided from the hospital information system server, the user device, or an external database. On the platform, users can independently develop and build clinical data processing tools using natural language, tailored to their specific needs, through standardized and modular assistant tools provided by the platform, and without requiring any programming skills.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:臨床作業流程優化系統</p>
        <p type="p">110:用戶裝置</p>
        <p type="p">111:電腦主機</p>
        <p type="p">112:行動裝置</p>
        <p type="p">120:醫院資訊系統伺服器</p>
        <p type="p">130:資料處理與分析平台</p>
        <p type="p">140:使用者模組</p>
        <p type="p">141:資料處理與分析作業模組</p>
        <p type="p">142:資料處理與分析工具開發與管理模組</p>
        <p type="p">150:資料來源模組</p>
        <p type="p">151:醫院資料元資料模組</p>
        <p type="p">152:互操作格式資料元資料模組</p>
        <p type="p">153:用戶檔案與訊號元資料模組</p>
        <p type="p">160:生成式人工智慧模型集</p>
        <p type="p">161~16N:生成式人工智慧模型</p>
        <p type="p">170:平台伺服器</p>
        <p type="p">200:人機介面</p>
        <p type="p">1000:小幫手工具</p>
        <p type="p">300:外部資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1852" publication-number="202619038">
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        <document-id>
          <doc-number>202619038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工方法及加工裝置</chinese-title>
        <english-title>PROCESSING METHOD AND PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/78</main-classification>
        <further-classification edition="201401120260127B">B23K26/364</further-classification>
        <further-classification edition="201401120260127B">B23K26/38</further-classification>
        <further-classification edition="200601120260127B">B23K26/073</further-classification>
        <further-classification edition="200601120260127B">B23K26/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO SEIMITSU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相川力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIKAWA, CHIKARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在第一步驟中，將第一雷射照射於切割道上的加工對象區域，並同時沿著加工對象區域進行掃描，藉以在構造物的深度方向形成用以分斷存在於加工對象區域中之構造物的第一區域及用以使構造物易於分斷的第二區域中的至少一者。於接續第一步驟的第二步驟中，將第二雷射照射於加工對象區域，並同時沿著加工對象區域進行掃描，藉以除去構造物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a first step, by irradiating a first laser onto a processing target region on a street while scanning along the processing target region, at least one of the first region, which divides a structure present in the processing target region, and a second region, which facilitates the division of the structure, is formed in the depth direction of the structure. In the second step following the first step, a second laser is irradiated onto the processing target region while scanning along the processing target region, thereby removing the structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:切割道</p>
        <p type="p">10:加工對象區域</p>
        <p type="p">11:光點</p>
        <p type="p">12:掃描軌跡</p>
        <p type="p">60:構造物</p>
        <p type="p">d1:長度</p>
        <p type="p">W:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1853" publication-number="202616977">
    <tif-files tif-type="multi-tif">
      <tif file="114128871.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱形眼鏡包裝盒</chinese-title>
        <english-title>CONTACT LENS PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">A45C11/04</main-classification>
        <further-classification edition="200601120260115B">B65D3/12</further-classification>
        <further-classification edition="200601120260115B">B65D75/32</further-classification>
        <further-classification edition="200601120260115B">B65D81/22</further-classification>
        <further-classification edition="200601120260115B">B65D83/04</further-classification>
        <further-classification edition="200601120260115B">B65D85/38</further-classification>
        <further-classification edition="200601120260115B">G02C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商壯生和壯生視覺關懷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波普韋爾　山姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POPWELL, SAM JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史霍爾　布雷特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHORE, BRETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安思爾　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANSELL, SCOTT F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克蘭　伊斯梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKRAM, ISMAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華德　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARD, DANIEL GRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩姆斯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMS, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於經改良的隱形眼鏡包裝盒及其中所使用的鏡片支撐件。一隱形眼鏡包裝盒可具有一蓋、一基底，該基底具有一井，該井包含在井底部之上固定升高的一凸出圓頂；及一後壁，其自圓頂底部邊緣向上延伸，以不論該隱形眼鏡包裝盒之定位如何皆將該隱形眼鏡保持在該圓頂上方之所欲位置且浸沒於該包裝盒溶液中。該包裝盒亦可具有一鏡片支撐件，該鏡片支撐件經組態以在該鏡片支撐件上能夠藉由一使用者單次觸碰轉移的一定位將該隱形眼鏡提出該包裝盒溶液。該包裝盒可包括一鎖定機構，該鎖定機構經組態以在該鏡片支撐件提升至一預定提升角度時將該槓桿鎖定就位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to improved contact lens packages and lens supports for use therein. A contact lens package may have a lid, a base having a well comprising a convex dome fixedly elevated above the well bottom and a rear wall extending up from the dome bottom edge to maintain the contact lens in the desired position over the dome and submerged in the packaging solution regardless of the position of the contact lens package. The package may also have a lens support configured lift the contact lens out of the packaging solution in a position on the lens support capable of single-touch transfer by a user. The package may include a locking mechanism configured to lock the lever in place when the lens support is lifted to a predetermined lift angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:隱形眼鏡包裝盒</p>
        <p type="p">110:基底；包裝盒</p>
        <p type="p">114:樞軸線</p>
        <p type="p">115:凸緣</p>
        <p type="p">116:後壁；井；基底</p>
        <p type="p">118:槓桿</p>
        <p type="p">122a:手指接合特徵；手指壓凹</p>
        <p type="p">136:井；圓頂；鏡片；蓋；後壁</p>
        <p type="p">138:鏡片；圓頂；隱形眼鏡；鏡片支撐件</p>
        <p type="p">139b:後空腔；側空腔</p>
        <p type="p">140:鏡片支撐件</p>
        <p type="p">152:密封圓緣；熱封圓緣</p>
        <p type="p">163:安裝突片</p>
        <p type="p">184:圓頂；碗體；後壁結合處；中央壓凹</p>
        <p type="p">198:凹陷區；中央壓凹</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1854" publication-number="202616982">
    <tif-files tif-type="multi-tif">
      <tif file="114128887.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭髮理順裝置</chinese-title>
        <english-title>HAIR DETANGLING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A46B9/02</main-classification>
        <further-classification edition="200601120260130B">A45D7/00</further-classification>
        <further-classification edition="200601120260130B">A45D24/00</further-classification>
        <further-classification edition="200601120260130B">A46B3/00</further-classification>
        <further-classification edition="200601120260130B">A46B5/02</further-classification>
        <further-classification edition="200601120260130B">A46B9/06</further-classification>
        <further-classification edition="200601120260130B">B25G1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商糾結立順有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANGLE TEEZER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯普森　麥可　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMPSON, MICHAEL PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡普蘭　瑞秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAPLAN, RACHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁爾斯　詹姆斯　大衛　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILES, JAMES DAVID WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞耶斯　斯蒂芬　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAYERS, STEPHEN ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍恩　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONE, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於理順頭髮的裝置包括刷毛之陣列。每根刷毛從根部延伸至自由端，且用於理順頭髮的裝置具有縱向軸線。至少一些刷毛包括：從根部延伸之相對較寬的第一細長部分，以及從第一部分延伸至自由端之相對較窄的第二部分。包括第一及區段部分之至少一些刷毛定向成使得：(a) 至少一些刷毛的細長部分設置成與頭髮護理裝置之縱向軸線成斜角，或(b) 至少一些刷毛的細長部分與包括第一及第二部分之至少一些相鄰刷毛的細長部分不對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for detangling hair comprises an array of bristles. Each bristle extends from a base to a free end and the device for detangling hair has a longitudinal axis. At least some of the bristles comprise a first, relatively wide, elongate portion which extends from the base and a second, relatively narrow, portion which extends from the first portion to the free end. At least some of the bristles comprising first and section portions are oriented (a) such that the elongate portion of the at least some bristles is arranged at an oblique angle to the longitudinal axis of the hair care device, or (b) such that the elongate portion of the at least some bristles is not aligned with the elongate portion of at least some adjacent bristles comprising first and second portions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:刷具</p>
        <p type="p">2:頭部部分</p>
        <p type="p">3:手柄</p>
        <p type="p">4:表面</p>
        <p type="p">6:第一刷毛</p>
        <p type="p">7:第二刷毛</p>
        <p type="p">A:縱向軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1855" publication-number="202619039">
    <tif-files tif-type="multi-tif">
      <tif file="114128910.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切晶黏晶膜、及半導體裝置之製造方法</chinese-title>
        <english-title>DICING DIE BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/78</main-classification>
        <further-classification edition="200601120260127B">B32B27/32</further-classification>
        <further-classification edition="201801120260127B">C09J7/29</further-classification>
        <further-classification edition="201801120260127B">C09J7/30</further-classification>
        <further-classification edition="200601120260127B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角野雅俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKUNO, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>入江瞳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIE, HITOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀井勝利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEI, KATSUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田公平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中浦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAURA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土生剛志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABU, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種切晶黏晶膜等，上述切晶黏晶膜具備：切晶帶，其具有基材層及重疊於該基材層之單面之黏著劑層；及黏晶片，其重疊於上述黏著劑層；上述切晶帶在伸長5%並保持3分鐘時具有65%以上之應力緩和率，上述黏著劑層對上述黏晶片具有0.30 N/20 mm以下之黏著力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is, for example, a dicing die bonding film including: a dicing tape including a base layer and an adhesive layer layered on one side of the base layer; and a die bonding sheet layered on the adhesive layer. The dicing tape has a stress relaxation rate of 65% or more when the dicing tape is held stretched by 5% for three minutes. The adhesive layer has an adhesive force of 0.30 N/20 mm or less to the die bonding sheet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:切晶黏晶膜</p>
        <p type="p">10:黏晶片</p>
        <p type="p">20:切晶帶</p>
        <p type="p">21:基材層</p>
        <p type="p">22:黏著劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1856" publication-number="202616956">
    <tif-files tif-type="multi-tif">
      <tif file="114128915.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用Ｎ－甲氧基（苯基乙基）－吡唑甲醯胺的水稻穗部病害的殺真菌處理</chinese-title>
        <english-title>FUNGICIDAL TREATMENT FOR PANICLE DISEASES IN RICE USING N-METHOXY(PHENYLETHYL)-PYRAZOLE CARBOXAMIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A01N43/56</main-classification>
        <further-classification edition="200601120260202B">A01P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商先正達農作物保護股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYNGENTA CROP PROTECTION AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關廷龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, TINGLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇晶晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JINGJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN,LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏玉順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YUSHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜光青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, GUANGQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於N-甲氧基(苯基乙基)-吡唑甲醯胺用於控制有用植物的植物病原性病害，特別是植物病原性真菌之用途，並且涉及控制有用植物上的這樣的病害和/或真菌之方法。特別地，本發明關於3-(二氟甲基)-&lt;i&gt;N&lt;/i&gt;-甲氧基-1-甲基-&lt;i&gt;N&lt;/i&gt;-[1-甲基-2-(2,4,6-三氯-苯基)乙基]-1&lt;i&gt;H&lt;/i&gt;-吡唑-4-甲醯胺（氟唑菌醯羥胺）用於控制水稻植物上的作為髒穗病（DPD）的病原體的稻平臍蠕孢、新月彎孢黴、木賊鐮刀菌、禾穀鐮刀菌、鏈格孢菌和/或稻帚枝黴之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of N-methoxy(phenylethyl)-pyrazole carboxamides for the control of phytopathogenic diseases of useful plants, especially phytopathogenic fungi, and to a method of controlling such diseases, and/or fungi, on useful plants. In particular, the present invention relates to the use of 3-(difluoromethyl)-&lt;i&gt;N&lt;/i&gt;-methoxy-1-methyl-&lt;i&gt;N&lt;/i&gt;-[1-methyl-2-(2,4,6-trichloro-phenyl)ethyl]-1&lt;i&gt;H&lt;/i&gt;-pyrazole-4-carboxamide (pydiflumetofen) for the control of &lt;i&gt;Bipolaris oryzae, Curvularia lunata, Fusarium equiseti, Fusarium graminearum, Alternaria alternata&lt;/i&gt; and/or &lt;i&gt;Sarocladium oryzae &lt;/i&gt;as causative agents for dirty panicle disease (DPD) on rice plants.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1857" publication-number="202617432">
    <tif-files tif-type="multi-tif">
      <tif file="114128960.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏光板</chinese-title>
        <english-title>POLARIZING PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B32B27/08</main-classification>
        <further-classification edition="200601120260202B">B32B27/30</further-classification>
        <further-classification edition="200601120260202B">B32B3/30</further-classification>
        <further-classification edition="200601120260202B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手塚慶典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TETSUKA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸田純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本拓弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種可抑制基於間歇性裂縫的外觀不良的偏光板。  &lt;br/&gt;其解決手段係偏光板100，其依序備有第一保護膜、聚乙烯醇系偏光元件20、第二保護膜。聚乙烯醇系偏光元件20的一側的表面20a，係具有：波型結構20MV，其係具有沿著MD方向各自延伸達15mm以上的在TD方向中被交互配置的山部20M及谷部20V；複數裂縫20CR，其係於波型結構的谷部20V中，沿著MD方向延伸達10mm以下。表面20a的算術平均高Sa，以及，在沿著TD方向及偏光元件20的厚度方向，且包含偏光元件的表面20a的裂縫20CR的底20CRB的剖面之表面形狀輪廓中，各裂縫20CR的底20CRB的高度，與鄰接各裂縫20CR的2個山部20M的峰20MP中較高者的高度，其差ΔZ，係滿足下式。  &lt;br/&gt;　　ΔZ/Sa≦5.5</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a polarizing plate capable of suppressing appearance defects caused by intermittent cracks. &lt;br/&gt;As a solution, a polarizing plate 100 comprises, in this order, a first protective film, a polyvinyl alcohol (PVA)-based polarizer 20, and a second protective film. One surface 20a of the PVA-based polarizer 20 includes: a wavy structure 20MV having ridges 20M and valleys 20V that each extend along the MD direction for a length of 15 mm or more and are alternately arranged in the TD direction; and a plurality of cracks 20CR located in the valleys 20V of the wavy structure and extending along the MD direction for a length of 10 mm or less. In a surface-shape profile of a cross section taken along the TD direction and the thickness direction of the polarizer 20, and including the bottoms 20CRB of the cracks 20CR on the surface 20a of the polarizer, the arithmetic mean height Sa of the surface 20a and the difference ΔZ between the height of each crack bottom 20CRB and the higher of the peak heights 20MP of the two ridges 20M adjacent to the crack 20CR satisfy the following expression. &lt;br/&gt;　　ΔZ/Sa≦5.5</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:聚乙烯醇系偏光元件</p>
        <p type="p">20a:表面</p>
        <p type="p">20CR:裂縫</p>
        <p type="p">20CRB:底</p>
        <p type="p">20M:山部</p>
        <p type="p">20MV:波型結構</p>
        <p type="p">20MP:峰</p>
        <p type="p">20V:谷部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1858" publication-number="202618921">
    <tif-files tif-type="multi-tif">
      <tif file="114128966.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128966</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250917B">H01L21/3065</main-classification>
        <further-classification edition="200601120250917B">H01L21/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井都</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, MIYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原謙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAHARA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">作為本揭示的一實施態樣所述的使用電漿蝕刻金屬膜的電漿處理方法，具有：藉由使用含有氧元素的氣體與含有鹵素元素的氣體所生成的電漿來蝕刻前述金屬膜的第一工程；在前述第一工程之後，藉由電漿來氮化前述經蝕刻的金屬膜的第二工程；及在前述第二工程之後，藉由使用含有鹵素元素的氣體所生成的電漿，蝕刻前述經氮化的金屬膜的第三工程，重複前述第二工程及前述第三工程至經蝕刻的前述金屬膜的深度成為特定深度為止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1859" publication-number="202619189">
    <tif-files tif-type="multi-tif">
      <tif file="114129008.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129008</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器組合</chinese-title>
        <english-title>CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250818B">H01R13/629</main-classification>
        <further-classification edition="201101120250818B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑟拉　吉米安立奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACERA, JIMMY ENRIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器組合包含第一連接器以及第二連接器。第一連接器包含第一絕緣殼體、複數個第一端子以及卡扣元件。第一端子連接第一絕緣殼體。卡扣元件沿第一方向彈性連接第一絕緣殼體。第二連接器包含第二絕緣殼體、複數個第二端子以及卡扣部。第二絕緣殼體配置以至少部分抵接第一絕緣殼體。第二端子連接第二絕緣殼體，並配置以沿第二方向連接第一端子，第二方向與第一方向彼此相交。卡扣部連接第二絕緣殼體，並配置以至少部分進入第一絕緣殼體內，卡扣元件配置以相對第一絕緣殼體沿第一方向移動並卡扣於卡扣部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector assembly includes a first connector and a second connector. The first connector includes a first housing, a plurality of first terminal and a snapping piece. The first terminals are connected with the first housing. The snapping piece is elastically connected with the first housing along a first direction. The second connector includes a second housing, a plurality of second terminal and a snapping portion. The second housing is configured to at least partially abut against the first housing. The second terminals are connected with the second housing and configured to connect with the first terminals along a second direction which intersects with the first direction. The snapping portion is connected with the second housing and configured to at least partially enter into the first housing. The snapping piece is configured to move relative to the first housing along the first direction and snap with the snapping portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一連接器</p>
        <p type="p">111:第一絕緣殼體</p>
        <p type="p">1111:側板</p>
        <p type="p">1114:頂板</p>
        <p type="p">1114r:避位部</p>
        <p type="p">1115:底板</p>
        <p type="p">113:卡扣元件</p>
        <p type="p">1131:第一主體</p>
        <p type="p">1131e:內緣</p>
        <p type="p">1132:勾部</p>
        <p type="p">114:彈性元件</p>
        <p type="p">115:移動元件</p>
        <p type="p">1151:第二主體</p>
        <p type="p">1151a:結構部</p>
        <p type="p">1151b:樞接部</p>
        <p type="p">1151c:延伸部</p>
        <p type="p">1152:凸出部</p>
        <p type="p">1153:限位部</p>
        <p type="p">1154:把手</p>
        <p type="p">120:第二連接器</p>
        <p type="p">121:第二絕緣殼體</p>
        <p type="p">123:卡扣部</p>
        <p type="p">124:鎖固件</p>
        <p type="p">200:板體</p>
        <p type="p">G-G:線段</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">H1:第一穿孔</p>
        <p type="p">HR:限位孔</p>
        <p type="p">OP3:第三開口</p>
        <p type="p">R:凹陷空間</p>
        <p type="p">SA:抵壓面</p>
        <p type="p">SM:活動空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1860" publication-number="202618883">
    <tif-files tif-type="multi-tif">
      <tif file="114129018.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光微影法</chinese-title>
        <english-title>PHOTOLITHOGRAPHIC METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/027</main-classification>
        <further-classification edition="200601120260127B">H01L21/308</further-classification>
        <further-classification edition="200601120260127B">G03F7/20</further-classification>
        <further-classification edition="200601120260127B">G03F7/075</further-classification>
        <further-classification edition="200601120260127B">G03F7/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商濰坊星泰克微電子材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNTIFIC MATERIALS (WEIFANG), LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫遜運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周元基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YUANJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成圖案的方法，包含：提供待形成圖案的基板；在該基板上形成第一矽光阻層；將該第一矽光阻層的部分曝光於活化波長的輻射；固化並顯影該經曝光之第一矽光阻層，以去除該第一矽光阻層未固化的部分，並在該基板上形成第一固化光阻圖案。在顯影該經固化之第一矽光阻層後，在該基板上形成第二矽光阻層；將該第二矽光阻層不在該第一固化光阻圖案上的區域中的部分曝光於活化波長的輻射；固化並顯影該經曝光之第二矽光阻層；&lt;br/&gt;  以去除該第二矽光阻層該未固化的部分，在該基板上形成第二固化光阻圖案。接著，蝕刻該基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a pattern comprising: providing a substrate in which a pattern is to be formed; forming a first silicon photoresist layer over the substrate; exposing a portion of the first silicon photoresist layer to an activating wavelength of radiation; curing and develoing the exposed first silicon photoresist layer to remove an uncured portion of the first silicon photoresist layer and to form a first pattern of cured photoresist over the substrate. After developing the cured first silicon photoresist layer forming a second silicon photoresist layer over the substrate; exposing a portion of the second silicon photoresist layer in a region which is not over the first pattern of cured photoresist to an activating wavelength of radiation; curing and developing the exposed second silicon photoresist layer; &lt;br/&gt; to remove the uncured portion of the second silicon photoresist layer to form a second pattern of cured photoresist over the substrate. The substrate is then etched.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工件</p>
        <p type="p">10:基板</p>
        <p type="p">11:凹槽</p>
        <p type="p">14a:第一矽光阻層、矽光阻、第二層光阻、光阻層、光阻</p>
        <p type="p">14b-1:固化光阻</p>
        <p type="p">14b-2:固化光阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1861" publication-number="202617326">
    <tif-files tif-type="multi-tif">
      <tif file="114129048.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉支撐裝置以及工件之支撐方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B23Q1/50</main-classification>
        <further-classification edition="200601120260131B">B23Q1/26</further-classification>
        <further-classification edition="200601120260131B">B23Q1/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴斯卡魯工學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASCAL ENGINEERING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二宮隆司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINOMIYA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在能夠繞第一軸旋轉地支撐工件的旋轉支撐裝置中，第二工作台可以支撐工件的同時，相對於第一工作台而繞第一軸旋轉。支撐裝置係，當第二工作台相對於第一工作台而繞第一軸旋轉時，與第二工作台分開，並且當第二工作台不繞第一軸旋轉時，能夠從正交於第一軸的方向支撐第二工作台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旋轉支撐裝置</p>
        <p type="p">2:主軸</p>
        <p type="p">3:切削工具</p>
        <p type="p">4,41:基座</p>
        <p type="p">10:工具機械</p>
        <p type="p">100:第一工作台</p>
        <p type="p">110:旋轉接頭</p>
        <p type="p">111:流路</p>
        <p type="p">120:旋轉構件</p>
        <p type="p">130:滾齒凸輪</p>
        <p type="p">131:輸入軸</p>
        <p type="p">132:凸輪從動件</p>
        <p type="p">140:滾柱軸承</p>
        <p type="p">200:第二工作台</p>
        <p type="p">201:流路</p>
        <p type="p">210:軸構件</p>
        <p type="p">300:軸支撐裝置</p>
        <p type="p">310:頭部</p>
        <p type="p">400:夾緊裝置</p>
        <p type="p">500:噴嘴</p>
        <p type="p">600,610,620:管路</p>
        <p type="p">P:支撐區域</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1862" publication-number="202618012">
    <tif-files tif-type="multi-tif">
      <tif file="114129053.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>集流體以及儲能元件</chinese-title>
        <english-title>CURRENT COLLECTOR AND POWER STORAGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251107B">C22C21/02</main-classification>
        <further-classification edition="200601120251107B">C22C38/16</further-classification>
        <further-classification edition="200601120251107B">H01M4/64</further-classification>
        <further-classification edition="200601120251107B">H01M4/62</further-classification>
        <further-classification edition="202101120251107B">C25B11/061</further-classification>
        <further-classification edition="200601120251107B">H01B1/02</further-classification>
        <further-classification edition="201601120251107B">H01M8/021</further-classification>
        <further-classification edition="202301120251107B">H10K71/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖譽凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉佳兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-ERH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖世傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳金銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭憲清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SHIAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏淞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種集流體以及儲能元件。集流體包括基材以及合金層。合金層位於基材的一側。合金層的材料為合金材料。合金材料包括鋁、矽以及至少三種其他元素。基於合金材料的元素總和為100莫耳百分比，鋁以及矽的元素總和為大於或等於70莫耳百分比。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A current collector and a power storage device are provided. The current collector includes a substrate and an alloy layer. The alloy layer is located on one side of the substrate. A material of the alloy layer is alloy material. The alloy material includes aluminum, silicon and at least three other elements. Based on a sum of the elements of the alloy material is 100 mole percent, a sum of the elements of aluminum and silicon is greater than or equal to 70 mole percent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:集流體</p>
        <p type="p">110:基材</p>
        <p type="p">120:合金層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1863" publication-number="202618371">
    <tif-files tif-type="multi-tif">
      <tif file="114129162.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機模組及包括相機模組之相機設備</chinese-title>
        <english-title>CAMERA MODULE AND CAMERA APPARATUS INCLUDING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260124B">G02B7/09</main-classification>
        <further-classification edition="202301120260124B">H04N23/68</further-classification>
        <further-classification edition="201601120260124B">H02K11/01</further-classification>
        <further-classification edition="200601120260124B">G02B27/64</further-classification>
        <further-classification edition="200601120260124B">H02K41/035</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金敬源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昶年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHANG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧炫奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROH, HYUN GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據實施例之一種相機模組可包括一基座20，安置於該基座20上之一第一鏡頭組合件110及一第二鏡頭組合件120，其中該第一鏡頭組合件110可包括一第一驅動部分116及一第三驅動部分141。該第二鏡頭組合件120可包括一第二驅動部分126及一第四驅動部分142。在該第一鏡頭組合件110中，該第一驅動部分116可包括一第一磁體116b及一第一磁軛116a。該第三驅動部分141可包括一第一線圈部分141b及一第三磁軛141a。在該第二鏡頭組合件120中，該第二驅動部分126可包括一第二磁體126b及一第二磁軛126a，且該第四驅動部分142可包括一第二線圈部分142b及一第四磁軛142a。該第一磁軛116a可包括一第一支撐部分116a1，及自該第一支撐部分116a1朝向該第一磁體116b之一第一側表面延伸的一第一側突出部分116a2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module according to an embodiment may include a base 20, a first lens assembly 110 and a second lens assembly 120 disposed on the base 20, wherein the first lens assembly 110 may include a first driving part 116 and a third driving part 141. The second lens assembly 120 may include a second driving part 126 and a fourth driving part 142. In the first lens assembly 110, the first driving part 116 may include a first magnet 116b and a first yoke 116a. The third driving part 141 may include a first coil part 141b and a third yoke 141a. In the second lens assembly 120, the second driving part 126 may include a second magnet 126b and a second yoke 126a, and the fourth driving part 142 may include a second coil part 142b and a fourth yoke 142a. The first yoke 116a may include a first support portion 116a1 and a first side protruding portion 116a2 extending from the first support portion 116a1 toward a first side surface of the first magnet 116b.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基座</p>
        <p type="p">41:第一電路板</p>
        <p type="p">42:第二電路板</p>
        <p type="p">100:相機模組</p>
        <p type="p">110:第一鏡頭組合件</p>
        <p type="p">120:第二鏡頭組合件</p>
        <p type="p">130:第三鏡頭組合件</p>
        <p type="p">116:第一驅動部分</p>
        <p type="p">116a:第一磁軛</p>
        <p type="p">116b:第一磁體</p>
        <p type="p">126:第二驅動部分</p>
        <p type="p">126a:第二磁軛</p>
        <p type="p">126b:第二磁體</p>
        <p type="p">141:第三驅動部分</p>
        <p type="p">141a:第三磁軛</p>
        <p type="p">141b:第一線圈部分</p>
        <p type="p">142:第四驅動部分</p>
        <p type="p">142a:第四磁軛</p>
        <p type="p">142b:第二線圈部分</p>
        <p type="p">180:影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1864" publication-number="202618293">
    <tif-files tif-type="multi-tif">
      <tif file="114129215.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於晶圓測試的主機板組件以及測試板系統</chinese-title>
        <english-title>MOTHERBOARD ASSEMBLY FOR WAFER TESTING AND A TESTER BOARD SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G01R1/06</main-classification>
        <further-classification edition="202001120250901B">G01R31/26</further-classification>
        <further-classification edition="200601120250901B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商睿進記憶體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELLIGENT MEMORY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濮　必得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POECHMUELLER, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述了一種用於測試晶圓的主機板組件。主機板組件包括探針卡，探針卡具有設置在中心區域中的多個針以及設置在中心區域外的多個微連接器。每個微連接器與多個針通訊地耦接。主機板組件還包括下部主機板，下部主機板包括多個片，每個片具有至少一個處理器和至少一個記憶體通道。每個記憶體通道與探針卡的微連接器通訊地耦接。間隙將下部主機板與探針卡豎直地分開並隔離。晶圓被定大小和尺寸為擱置在用於測試的探針卡的針上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motherboard assembly and a test board system for testing wafers are described. The motherboard assembly includes a probe card having a plurality of needles disposed in a center region and a plurality of micro connectors disposed outside the center region. Each micro connector is communicatively coupled with a plurality of needles. The motherboard assembly also includes a lower motherboard comprising a plurality of tiles, each tile having at least one processor and at least one memory channel. Each memory channel is communicatively coupled with a micro connector of the probe card. A gap vertically separates and insulates the lower motherboard from the probe card. A wafer is sized and dimensioned to rest on the needles of the probe card for testing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120B:主機板</p>
        <p type="p">900B:探針卡</p>
        <p type="p">980:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1865" publication-number="202618369">
    <tif-files tif-type="multi-tif">
      <tif file="114129261.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透鏡與透鏡組件</chinese-title>
        <english-title>LENS AND LENS ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260131B">G02B7/02</main-classification>
        <further-classification edition="200601120260131B">G02B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁召渼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SO MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐寅燾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, IN DO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透鏡，包括光學部分及凸緣部分，光學部分包括一對在垂直於光軸的方向上彼此面對的筆直部分，以及連接該對筆直部分的弧形部分。凸緣部分沿著光學部分的一部分的周邊延伸。其中，凸緣部分從該對筆直部分的筆直部分延伸並與弧形部分間隔開，並且光學部分折射光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens includes an optical portion including a pair of straight portions facing each other in a direction perpendicular to an optical axis, and an arc portion connecting the pair of straight portions; and a flange portion extending along a portion of a perimeter of the optical portion, wherein the flange portion extends from a straight portion of the straight portions and is spaced apart from the arc portion, and the optical portion refracts light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學部分</p>
        <p type="p">110:筆直部分</p>
        <p type="p">120:弧形部分</p>
        <p type="p">200:突出部</p>
        <p type="p">300:凸緣部分</p>
        <p type="p">A:區域</p>
        <p type="p">D1、D2:最大直徑</p>
        <p type="p">W1、W2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1866" publication-number="202619139">
    <tif-files tif-type="multi-tif">
      <tif file="114129327.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固體電解質用氧化物及其製造方法、以及固體電解質及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260128B">H01M10/0562</main-classification>
        <further-classification edition="201001120260128B">H01M4/13</further-classification>
        <further-classification edition="200601120260128B">H01M4/62</further-classification>
        <further-classification edition="200601120260128B">H01B1/06</further-classification>
        <further-classification edition="200601120260128B">C01B35/12</further-classification>
        <further-classification edition="200601120260128B">C01D15/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本板硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHEET GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>公立大學法人大阪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY PUBLIC CORPORATION OSAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋康史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮內太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAUCHI, TARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>作田敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKUDA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本橋宏大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOHASHI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晃敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, AKITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成可由式I表示之固體電解質用氧化物。  &lt;br/&gt;式I：xLi&lt;sub&gt;3&lt;/sub&gt;BO&lt;sub&gt;3&lt;/sub&gt;・yLi&lt;sub&gt;2&lt;/sub&gt;SO&lt;sub&gt;4&lt;/sub&gt;・zG  &lt;br/&gt;G為選自由B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、SiO&lt;sub&gt;2&lt;/sub&gt;、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;&lt;sub&gt;、&lt;/sub&gt;P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、GeO&lt;sub&gt;2&lt;/sub&gt;、V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、TeO&lt;sub&gt;2&lt;/sub&gt;、Li&lt;sub&gt;3&lt;/sub&gt;PO&lt;sub&gt;4&lt;/sub&gt;、Li&lt;sub&gt;4&lt;/sub&gt;B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;及Li&lt;sub&gt;2&lt;/sub&gt;B&lt;sub&gt;4&lt;/sub&gt;O&lt;sub&gt;7&lt;/sub&gt;所組成之群中之至少1者，x、y及z為滿足30≤x≤98、1≤y≤40、0.5≤z≤60、x/y≥2、x＋y＋z＝100之數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1867" publication-number="202619018">
    <tif-files tif-type="multi-tif">
      <tif file="114129373.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供抗腐蝕性及耐磨性的基板支架表面處理</chinese-title>
        <english-title>SUBSTRATE HOLDER SURFACE TREATMENTS PROVIDING CORROSION RESISTANCE AND WEAR RESISTANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/683</main-classification>
        <further-classification edition="200601120260127B">C23C16/458</further-classification>
        <further-classification edition="200601120260127B">C23C14/50</further-classification>
        <further-classification edition="200601120260127B">C23C28/04</further-classification>
        <further-classification edition="200601120260127B">C23C16/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波奈康提　哈利Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PONNEKANTI, HARI K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡晨非</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHENFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖健閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫特尼　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUTNEY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓　湯瑪斯Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, THOMAS K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒爾　馬克大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHULL, MARC DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德里　克里斯多佛勞倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEAUDRY, CHRISTOPHER LAURENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所描述的實施例係關於基板支架系統。設備包括基板支架的基底結構、形成在該基底結構的表面上的鈍化層，以及形成在該鈍化層上的類鑽碳（DLC）塗層。該基板支架用於接收基板。該鈍化層為該基板支架提供針對至少一種製程化學品的抗腐蝕性。該DLC塗層為該基板支架提供耐磨性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to substrate holder systems. An apparatus includes a base structure of a substrate holder, a passivation layer formed on a surface of the base structure, and a diamond-like carbon (DLC) coating formed on the passivation layer. The substrate holder is to receive a substrate. The passivation layer provides corrosion resistance for the substrate holder with respect to at least one process chemistry. The DLC coating provides wear resistance for the substrate holder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:圖示</p>
        <p type="p">510:雷射</p>
        <p type="p">512:光束</p>
        <p type="p">520:材料</p>
        <p type="p">530:材料/粉末</p>
        <p type="p">540:材料</p>
        <p type="p">550:材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1868" publication-number="202618822">
    <tif-files tif-type="multi-tif">
      <tif file="114129378.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>回收容器及電子零件之製造方法</chinese-title>
        <english-title>COLLECTION CONTAINER AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260130B">H01G13/00</main-classification>
        <further-classification edition="200601120260130B">G01R31/00</further-classification>
        <further-classification edition="200601120260130B">B07C5/34</further-classification>
        <further-classification edition="200601120260130B">B07C5/36</further-classification>
        <further-classification edition="202001120260130B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商慧萌高新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMO LABORATORY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田雄介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了提供可緩和對電子零件造成的衝撃之回收裝置及電子零件之製造方法。  &lt;br/&gt;　　電子零件分選裝置之回收容器具備箱狀的收納部、緩衝構件，收納部在上方具有開口部，緩衝構件以向下傾斜的狀態由收納部之內壁部懸臂支承，且在從電子零件分選裝置之排出路徑經由開口部供應之電子零件的軌跡上具有承受面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:回收容器</p>
        <p type="p">31:收納部</p>
        <p type="p">33:支承構件</p>
        <p type="p">34:緩衝構件</p>
        <p type="p">34a:承受面</p>
        <p type="p">151:排出路徑</p>
        <p type="p">151a:排出口</p>
        <p type="p">311:開口部</p>
        <p type="p">312:內壁部</p>
        <p type="p">331:固定面</p>
        <p type="p">332:傾斜面</p>
        <p type="p">341:基部</p>
        <p type="p">342:前端部</p>
        <p type="p">C:晶片電子零件</p>
        <p type="p">R1,R2:軌跡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1869" publication-number="202619605">
    <tif-files tif-type="multi-tif">
      <tif file="114129409.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129409</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含電路部及發射部的顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE INCLUDING CIRCUIT PART AND EMISSION PART</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251110B">H10H29/30</main-classification>
        <further-classification edition="202501120251110B">H10H29/39</further-classification>
        <further-classification edition="202501120251110B">H10H29/49</further-classification>
        <further-classification edition="201601120251110B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵賢稷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUN-JIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹晶燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, JUNG-SEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文炳俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUN, BYUNG-JUNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含電路部與發射部的顯示裝置。顯示裝置包括：具有顯示區及在顯示區周圍之非顯示區的顯示面板、位於顯示區之多個邊緣部分中的第一及第二閘極驅動單元、位於多個邊緣部分之間設置於顯示區的中央部分中並連接至第一及第二閘極驅動單元的多個電路部以及位於第一及第二閘極驅動單元及多個電路部上方並連接至多個電路部的多個發射部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a circuit part and an emission part. The display device includes: a display panel having a display area and a non-display area around the display area; first and second gate driving units in edge portions of the display area; a plurality of circuit parts in a central portion of the display area between the edge portions and connected to the first and second gate driving units; and a plurality of emission parts above the first and second gate driving units and the plurality of circuit parts and connected to the plurality of circuit parts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:顯示裝置</p>
        <p type="p">120:時序控制單元</p>
        <p type="p">122:資料驅動單元</p>
        <p type="p">124,126:閘極驅動單元</p>
        <p type="p">128:顯示面板</p>
        <p type="p">DA:顯示區</p>
        <p type="p">DCS:資料控制訊號</p>
        <p type="p">DL:資料線</p>
        <p type="p">CP:電路部</p>
        <p type="p">EP:發射部</p>
        <p type="p">GCS:閘極控制訊號</p>
        <p type="p">GL:閘極線</p>
        <p type="p">NA:非顯示區</p>
        <p type="p">RGB:影像資料</p>
        <p type="p">SP:子像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1870" publication-number="202617031">
    <tif-files tif-type="multi-tif">
      <tif file="114129448.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移動機器人自動清掃方法和裝置、移動機器人</chinese-title>
        <english-title>METHOD AND DEVICE FOR AUTOMATIC CLEANING OF MOBILE ROBOTS, AND MOBILE ROBOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A47L11/40</main-classification>
        <further-classification edition="200601120260127B">A47L11/24</further-classification>
        <further-classification edition="200601120260127B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹麗娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, LINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫文秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, WENXIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種移動機器人自動清掃方法和裝置、移動機器人及存儲介質，涉及智能清潔設備技術領域。該方法採集場景的當前圖像，識別當前圖像中的物體，確定物體的類型；在場景的地圖上，將識別出的物體標記為初步障礙物；結合初步障礙物的類型，基於沿牆感測器進行相應的清掃操作。可以看到，本申請實施例通過圖像識別和沿牆感測器對場景中物體進行智能識別和分類，並據此執行精確的清掃操作，提高了移動機器人的清掃效率和準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a method and device for automatic cleaning of a mobile robot, as well as the mobile robot and storage medium, relating to the field of intelligent cleaning equipment technology. The method collects the current image of the scene, identifies objects within the image, and determines the type of objects. On the map of the scene, the identified objects are marked as preliminary obstacles. Based on the type of preliminary obstacles and the data from the wall-following sensors, corresponding cleaning operations are performed. As can be seen, the embodiment of this application intelligently identifies and classifies objects in the scene through image recognition and wall-following sensors, and performs precise cleaning operations based on this, improving the cleaning efficiency and accuracy of the mobile robot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1871" publication-number="202618163">
    <tif-files tif-type="multi-tif">
      <tif file="114129562.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129562</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>排熱回收裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">F16L51/02</main-classification>
        <further-classification edition="200601120260123B">F28D7/16</further-classification>
        <further-classification edition="200601120260123B">F28F9/013</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外爐工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI RO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有松毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMATSU, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫井範之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種排熱回收裝置，前述排熱回收裝置會防止起因於因傳熱管群的溫度差所產生之熱應力的接合部的損傷。&lt;br/&gt;  [解決手段]一種排熱回收裝置1，是將供被加熱流體5流動之傳熱管群20設置於供排氣3流動之流通路10的內部，前述排熱回收裝置1具備：支撐構件30，支撐傳熱管群20的端部22；接合部25，將傳熱管群20的端部22接合/固定於支撐構件30；及伸縮接頭17、45，將藉由接合部25而接合/固定有傳熱管群20之支撐構件30連接成可變位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:排熱回收裝置</p>
        <p type="p">10:流通路</p>
        <p type="p">11:殼體</p>
        <p type="p">15:開口</p>
        <p type="p">17:第1伸縮接頭</p>
        <p type="p">20:傳熱管群</p>
        <p type="p">22:端部</p>
        <p type="p">25:接合部</p>
        <p type="p">30:支撐構件</p>
        <p type="p">45:第2伸縮接頭</p>
        <p type="p">50:連結管道</p>
        <p type="p">L:長度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1872" publication-number="202617864">
    <tif-files tif-type="multi-tif">
      <tif file="114129686.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有優異耐熱性的窗戶組合物</chinese-title>
        <english-title>WINDOW COMPOSITION WITH EXCELLENT HEAT RESISTANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">C08L27/24</main-classification>
        <further-classification edition="200601120251130B">C08L83/04</further-classification>
        <further-classification edition="202501120251130B">C08L23/0869</further-classification>
        <further-classification edition="202401120251130B">B01J35/53</further-classification>
        <further-classification edition="200601120251130B">B29B11/12</further-classification>
        <further-classification edition="200601120251130B">B29B11/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫薰秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, HOON SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG KI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於具有優異耐熱性的窗戶組合物。窗戶組合物包括氯化聚氯乙烯以及矽酮-丙烯酸抗衝擊改質劑，其中矽酮-丙烯酸抗衝擊改質劑包括核心與殼層，核心包含矽氧烷聚合物，且殼層包含(甲基)丙烯酸聚合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a window composition with excellent heat resistance. The window composition includes chlorinated polyvinyl chloride and a silicone-acrylic impact modifier, wherein the silicone-acrylic impact modifier includes a core containing a siloxane polymer and a shell containing a (meth)acrylic polymer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1873" publication-number="202617661">
    <tif-files tif-type="multi-tif">
      <tif file="114129734.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617661</doc-number>
        </document-id>
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        <document-id>
          <doc-number>114129734</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬錯合物、分離劑及目標氣體之分離方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C63/68</main-classification>
        <further-classification edition="200601120260202B">C07C65/03</further-classification>
        <further-classification edition="200601120260202B">C07C205/57</further-classification>
        <further-classification edition="200601120260202B">C07D207/416</further-classification>
        <further-classification edition="200601120260202B">C07D213/06</further-classification>
        <further-classification edition="200601120260202B">B01J20/22</further-classification>
        <further-classification edition="200601120260202B">B01J20/28</further-classification>
        <further-classification edition="200601120260202B">B01D53/02</further-classification>
        <further-classification edition="200601120260202B">B01D53/04</further-classification>
        <further-classification edition="200601120260202B">B01D53/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人京都大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOTO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商柯萊斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRASUS CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北川進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大竹研一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTAKE, KEN-ICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本裕俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, HIROTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>脇坂拓生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKISAKA, TAKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤部聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIBE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉賢広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧村吉邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUMURA, YOSHIKUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">提供能夠以高於以往材料的能量效率從混合氣體中分離回收目標氣體特別是二氧化碳之金屬錯合物。一種具有二維片層相互嵌合並且層合的結構之金屬錯合物，其係由芳香族1,3-二羧酸化合物之二陰離子；選自鎂、鈣、鉻、鉬、鎢、錳、鐵、釕、鈷、銠、鎳、鈀、銅、鋅及鎘的金屬之二陽離子；與具有雙吡啶基乙烯結構之有機雙牙配位子所構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1874" publication-number="202617303">
    <tif-files tif-type="multi-tif">
      <tif file="114129795.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑽石工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B23B27/20</main-classification>
        <further-classification edition="200601120260102B">B23B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電工硬質合金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC HARDMETAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天笠友洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAGASA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANOBE, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東泰助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHI, TAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田裕介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井大起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久木野暁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUKINO, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之鑽石構件具有切削面部及逃隙面。切削面部與逃隙面之稜線形成切削刃。切削面部之算術平均粗糙度為0.1 μm以上1.0 μm以下。針對鑽石構件，藉由使用穿透式電子顯微鏡之電子能量損失光譜法，測定伴隨碳之K殼電子激發所產生之能量損失。使用能量損失，求出石墨相中來自碳之π鍵之π&lt;sup&gt;＊&lt;/sup&gt;峰的強度、以及石墨相及鑽石相之各者中來自碳之σ鍵之σ&lt;sup&gt;＊&lt;/sup&gt;峰的強度。於將π&lt;sup&gt;＊&lt;/sup&gt;峰之強度除以σ&lt;sup&gt;＊&lt;/sup&gt;峰之強度所得之值設為I&lt;sub&gt;π&lt;/sub&gt;&lt;sub&gt;＊&lt;/sub&gt;/I&lt;sub&gt;σ&lt;/sub&gt;&lt;sub&gt;＊&lt;/sub&gt;之情形時，鑽石構件於切削面部之表面之I&lt;sub&gt;π&lt;/sub&gt;&lt;sub&gt;＊&lt;/sub&gt;/I&lt;sub&gt;σ&lt;/sub&gt;&lt;sub&gt;＊&lt;/sub&gt;為0.2以上2以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:切削面</p>
        <p type="p">2:逃隙面</p>
        <p type="p">3:切削刃</p>
        <p type="p">4:鑽石構件</p>
        <p type="p">5:鑽石部</p>
        <p type="p">6:石墨變質層</p>
        <p type="p">7:釺料</p>
        <p type="p">8:本體部</p>
        <p type="p">10:鑽石工具</p>
        <p type="p">11:第1切削面部</p>
        <p type="p">12:第2切削面部</p>
        <p type="p">19:連接點</p>
        <p type="p">21:第1逃隙面部</p>
        <p type="p">22:第2逃隙面部</p>
        <p type="p">30:被接合面</p>
        <p type="p">31:第1被接合面部</p>
        <p type="p">32:第2被接合面部</p>
        <p type="p">101:第1方向</p>
        <p type="p">102:第2方向</p>
        <p type="p">H:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1875" publication-number="202617211">
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      <tif file="114129821.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有各向異性材料層及泡棉層的可移位換能器陣列</chinese-title>
        <english-title>SHIFTABLE TRANSDUCER ARRAY WITH ANISOTROPIC MATERIAL LAYER AND FOAM LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61N1/36</main-classification>
        <further-classification edition="200601120260131B">A61N1/04</further-classification>
        <further-classification edition="202101120260131B">A61B5/251</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>哈拉維伊　諾亞</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HALAVEE, NOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <english-country>IL</english-country>
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          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫爾索　伯茲</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>MARSAULT, BOAZ</last-name>
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                <last-name>雅各比　艾利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAACOBI, ELIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IL</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾　塔爾　戈蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAR-TAL, GOLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IL</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪妮　倪贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANY, NITZAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦瑟曼　約拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WASSERMAN, YORAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
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          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧布科夫斯基　史塔斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBUCHOVSKY, STAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
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          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克普勒尼可　娜塔莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUPLENNIK, NATALIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏皮羅　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAPIRO, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>果龍　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLOM, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
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        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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        <p type="p">一種用於將腫瘤治療場遞送至一個體之身體的換能器設備，該換能器設備包括：電極陣列，該陣列經組態以定位在該個體之身體上方，其中該陣列之正面面向該個體之身體，該陣列包含電極元件；各向異性材料層，其電耦接至該電極陣列並且位於該陣列之該正面之前側上，該各向異性材料層包含正面及背面，該背面面向該電極陣列，該各向異性材料層進一步包括穿過該各向異性材料層之該正面及該背面之一孔；以及泡棉層，其耦接至該各向異性材料層之該正面並且覆蓋該各向異性材料層之該正面上之該孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transducer apparatus for delivering tumor treating fields to a subject's body, the transducer apparatus including: an array of electrodes, the array configured to be positioned over the subject's body with a front face of the array facing the subject's body, the array comprising electrode elements; an anisotropic material layer electrically coupled to the array of electrodes and located on a front side of the front face of the array, the anisotropic material layer comprising a front face and a back face, the back face facing the array of electrodes, the anisotropic material layer further including a hole passing through the front face and the back face of the anisotropic material layer; and a foam layer coupled to the front face of the anisotropic material layer and covering the hole on the front face of the anisotropic material layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:換能器設備/換能器/換能器陣列</p>
        <p type="p">102A:電極元件</p>
        <p type="p">102B:電極元件</p>
        <p type="p">102C:電極元件</p>
        <p type="p">104:基板/基板層</p>
        <p type="p">106:印刷電路板(PCB)連接器</p>
        <p type="p">108:引線連接器</p>
        <p type="p">110:各向異性材料層</p>
        <p type="p">120:質心</p>
        <p type="p">122:孔</p>
        <p type="p">124:泡棉材料層</p>
        <p type="p">126A:空白空間</p>
        <p type="p">126B:空白空間</p>
        <p type="p">126C:空白空間</p>
        <p type="p">126D:空白空間</p>
        <p type="p">1D-1D':區段</p>
      </representative-img>
    </description>
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        <document-id>
          <doc-number>114129822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用於腫瘤治療場換能器中的柔性層</chinese-title>
        <english-title>FLEXIBLE LAYER FOR USE IN A TUMOR TREATING FIELDS TRANSDUCER</english-title>
      </invention-title>
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        <main-classification edition="200601120260131B">A61N1/36</main-classification>
        <further-classification edition="200601120260131B">A61N1/04</further-classification>
        <further-classification edition="200601120260131B">A61B5/00</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
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                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
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        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各比　艾利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAACOBI, ELIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈拉維伊　諾亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALAVEE, NOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>果龍　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLOM, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將腫瘤治療場遞送至個體之身體的換能器設備，該換能器設備包含：一或多個電極元件之陣列，該陣列經組態以定位於該個體之身體上方，其中該陣列之正面面向該個體之身體；各向異性材料層，其電耦接至該陣列且位於該陣列之該正面之前側上，該各向異性材料層包含正面及背面，該背面面向該陣列；以及柔性層，其耦接至該各向異性材料層之該正面且經組態以接觸該個體之身體，其中該柔性層包含柔性材料及可選地包含黏著劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transducer apparatus for delivering tumor treating fields to a subject’s body, the transducer apparatus comprising an array of one or more electrode elements, the array configured to be positioned over the subject’s body with a front face of the array facing the subject’s body, an anisotropic material layer electrically coupled to the array and located on a front side of the front face of the array, the anisotropic material layer comprising a front face and a back face, the back face facing the array, and a flexible layer coupled to the front face of the anisotropic material layer and configured to contact the subject’s body, wherein the flexible layer comprises a flexible material and, optionally, an adhesive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:換能器設備</p>
        <p type="p">101:導電材料層</p>
        <p type="p">102:基板</p>
        <p type="p">103:正面</p>
        <p type="p">104:電極元件</p>
        <p type="p">106:各向異性材料層</p>
        <p type="p">105:背面</p>
        <p type="p">106A:正面</p>
        <p type="p">106B:背面</p>
        <p type="p">107:導電配線</p>
        <p type="p">108:非導電材料邊界/柔性層</p>
        <p type="p">110A:外周邊</p>
        <p type="p">110B:外周邊</p>
        <p type="p">112:導電皮膚接觸黏著劑層</p>
        <p type="p">112A:正面</p>
        <p type="p">112B:背面</p>
        <p type="p">114:導電上部黏著劑層</p>
        <p type="p">116:內邊緣</p>
        <p type="p">118:外邊緣，邊緣密封部分</p>
        <p type="p">118A:邊緣密封部分</p>
        <p type="p">120:距離</p>
        <p type="p">122:距離，厚度</p>
        <p type="p">124A:表面</p>
        <p type="p">124B:表面</p>
        <p type="p">124C:表面</p>
        <p type="p">126:厚度</p>
        <p type="p">150:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1877" publication-number="202617688">
    <tif-files tif-type="multi-tif">
      <tif file="114129872.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C309/12</main-classification>
        <further-classification edition="200601120260202B">C07C309/17</further-classification>
        <further-classification edition="200601120260202B">C07C309/73</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D327/08</further-classification>
        <further-classification edition="200601120260202B">C07D333/54</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C09K3/00</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08F212/32</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且EL、LWR、CDU、DOF等微影性能優良的化學增幅阻劑組成物所使用的鋶鹽型單體、含有來自該鋶鹽型單體之重複單元的聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。&lt;br/&gt;  該課題之解決手段為一種鋶鹽型單體，係以下式(A)表示。&lt;br/&gt;&lt;img align="absmiddle" height="126px" width="427px" file="ed10370.JPG" alt="ed10370.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1878" publication-number="202618977">
    <tif-files tif-type="multi-tif">
      <tif file="114129881.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合裝置、接合方法及剪線器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250912B">H01L21/67</main-classification>
        <further-classification edition="200601120250912B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野浩章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手井森介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋邦行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KUNIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥畑稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORIHATA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠對導線可靠地形成切口的接合裝置等。接合裝置包括：毛細管，供導線插通；以及剪線器，在自毛細管抽出的導線形成切口，剪線器包括：切入部，具有向導線切入的刀部；以及接受部，具有與導線接觸的接觸面，在剪線器關閉的狀態下，刀部向導線切入並且與接觸面在相向的同時分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">122:支撐臂</p>
        <p type="p">200:剪線器</p>
        <p type="p">210:切入部</p>
        <p type="p">211:主體部</p>
        <p type="p">212:刀部</p>
        <p type="p">213:突出部</p>
        <p type="p">220:接受部</p>
        <p type="p">221:主體部</p>
        <p type="p">222:接觸面</p>
        <p type="p">224:偏移部</p>
        <p type="p">300:導線</p>
        <p type="p">300a:無空氣焊球/FAB</p>
        <p type="p">300b:切口</p>
        <p type="p">D:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1879" publication-number="202619431">
    <tif-files tif-type="multi-tif">
      <tif file="114129884.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅包覆膜、包含其的電子組件及裝置以及製造銅包覆膜的方法</chinese-title>
        <english-title>COPPER CLAD FILM, ELECTRONIC COMPONENT AND DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE COPPER CLAD FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H05K3/38</main-classification>
        <further-classification edition="200601120260116B">H05K1/03</further-classification>
        <further-classification edition="200601120260116B">B32B15/088</further-classification>
        <further-classification edition="200601120260116B">B32B15/20</further-classification>
        <further-classification edition="200601120260116B">C23C28/00</further-classification>
        <further-classification edition="200601120260116B">C25D5/02</further-classification>
        <further-classification edition="200601120260116B">C23C14/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東麗先端素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED MATERIALS KOREA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旼材</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭昇謨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SEUNG MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG DEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李龍鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種銅包覆膜、各包含該銅包覆膜的一種電子組件及一種裝置以及一種製造該銅包覆膜的方法。該銅包覆膜包含一含聚醯亞胺基板、配置於該含聚醯亞胺基板之一側上之一鎳連結層及配置於該鎳連結層上之一銅層，其中該含聚醯亞胺基板之一厚度係3 μm至10 μm，且當藉由使用一MIT耐折強度測試儀根據JIS C 6471量測彎曲性時，該銅包覆膜具有5,000次或更多之一疲勞壽命。根據一個態樣，該銅包覆膜在該銅層與具有一相對較小厚度之該基板之間具有經改良抗彎曲性以及經改良室溫黏著性及耐熱黏著性。另外，由於該銅包覆膜即使在其包含具有一相對較小厚度之一含聚醯亞胺基板時亦具有足夠位準之室溫黏著性及耐熱黏著性，因此可實現薄化。另外，藉由根據一實施例之製造一銅包覆膜的方法，可在製造一普通CCL期間防止褶皺之產生且改良可運行性，從而實現一超薄CCL之穩定生產。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a copper clad film, an electronic component and a device each including the copper clad film, and a method of manufacturing the copper clad film. The copper clad film includes a polyimide-containing substrate, a nickel tie layer arranged on one side of the polyimide-containing substrate, and a copper layer arranged on the nickel tie layer, wherein a thickness of the polyimide-containing substrate is 3 to 10 μm, and the copper clad film has a fatigue life of 5,000 times or more when bendability is measured by using an MIT folding endurance tester in accordance with JIS C 6471. The copper clad film according to one aspect has improved bending resistance and improved room-temperature adhesion and heat-resistant adhesion between the copper layer and the substrate having a relatively small thickness. In addition, since the copper clad film has sufficient levels of room-temperature adhesion and heat-resistant adhesion even when it includes a polyimide-containing substrate having a relatively small thickness, thinning may be achieved. In addition, by the method of manufacturing a copper clad film according to an embodiment, it is possible to prevent the generation of wrinkles and improve runnability during the manufacture of a general CCL, thereby enabling stable production of an ultra-thin CCL.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一保護膜</p>
        <p type="p">21:含聚醯亞胺基板</p>
        <p type="p">31:鎳連結層</p>
        <p type="p">41:銅層</p>
        <p type="p">100:銅包覆膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1880" publication-number="202618196">
    <tif-files tif-type="multi-tif">
      <tif file="114129929.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>排熱回收裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">F28D7/16</main-classification>
        <further-classification edition="200601120260129B">F23L15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外爐工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI RO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有松毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMATSU, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫井範之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本俊輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村德勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, TOKUKATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種排熱回收裝置，前述排熱回收裝置會防止起因於因傳熱管的溫度差所產生之熱應力的接合部的損傷。&lt;br/&gt;  [解決手段]一種排熱回收裝置1，是將供被加熱流體5流動之傳熱管群20設置於供排氣3流動之流通路10的內部，前述排熱回收裝置1具備：支撐部32，支撐傳熱管群20的端部22；接合部25，將傳熱管群20的端部22接合/固定於支撐部32；及供給部65，將冷卻流體7供給至支撐部32，支撐部32可被由供給部65所供給之冷卻流體7冷卻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:冷卻流體</p>
        <p type="p">20:傳熱管群</p>
        <p type="p">21:貫通孔</p>
        <p type="p">22:端部</p>
        <p type="p">24:內側隔熱材</p>
        <p type="p">25:接合部</p>
        <p type="p">30:支撐構件</p>
        <p type="p">32:支撐部</p>
        <p type="p">70:冷卻箱</p>
        <p type="p">72:冷卻殼體</p>
        <p type="p">73:冷卻空間</p>
        <p type="p">74:入口</p>
        <p type="p">75:出口</p>
        <p type="p">76:間隙隔熱材</p>
        <p type="p">77:測定部(熱電偶)</p>
        <p type="p">L:上下方向</p>
        <p type="p">III-III:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1881" publication-number="202618238">
    <tif-files tif-type="multi-tif">
      <tif file="114129969.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙鏡筒裝置</chinese-title>
        <english-title>DOUBLE-BARREL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250912B">G01M11/02</main-classification>
        <further-classification edition="202101120250912B">G02B7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA OPTICAL CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳月葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUE-YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEI, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭逸銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉華唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUA-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林仁昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃加孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-HSIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊琮銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙鏡筒裝置，包括第一鏡筒、第二鏡筒、中間連接部以及距離檢測元件。中間連接部設置在所述第一鏡筒和第二鏡筒之間，所述第一鏡筒與所述中間連接部固定連接，所述第二鏡筒可相對於所述中間連接部運動以改變所述第一鏡筒和所述第二鏡筒之間的距離，其中一基準線分別與第一鏡筒的第一光軸與第二鏡筒的第二光軸垂直相連。距離檢測元件僅設在所述第二筒部與該中間連接部之間，用於檢測所述第一光軸與所述第二光軸的距離變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A double-barrel device includes a first barrel, a second barrel, a middle connecting portion and a distance detecting element. The middle connecting portion is disposed between the first barrel and the second barrel. The first barrel is fixed to the middle connecting portion. The second barrel is movable with respect to the middle connecting portion to change the distance between the first barrel and the second barrel. A baseline is perpendicularly connected to a first optical axis of the first barrel and a second optical axis of the second barrel. The distance detecting element is only disposed between the second barrel and the middle connecting portion for detecting the change of distance between the first optical axis and the second optical axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:第二鏡筒</p>
        <p type="p">300:中間連接部</p>
        <p type="p">400:距離檢測元件</p>
        <p type="p">401:第一元件</p>
        <p type="p">401b:第二表面</p>
        <p type="p">402:第二元件</p>
        <p type="p">402a:內側表面</p>
        <p type="p">402b:外側表面</p>
        <p type="p">402c:第三表面</p>
        <p type="p">404:發射部</p>
        <p type="p">405:接收部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1882" publication-number="202618907">
    <tif-files tif-type="multi-tif">
      <tif file="114129982.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨布</chinese-title>
        <english-title>POLISHING CLOTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/304</main-classification>
        <further-classification edition="201201120260131B">B24B37/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商霓塔杜邦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTA DUPONT INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村千響</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, CHINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川端丈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, JO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨布，其具有由纖維構成之不織布、及含浸於該不織布中之樹脂組合物，上述研磨布具備研磨面，將垂直於上述研磨面之方向設為縱向，獲取與上述縱向平行之剖面之CT圖像，於該CT圖像中之上述纖維之複數個剖面中，按面積自大到小之順序將2%之個數之上述剖面作為測定對象，根據作為該測定對象之各個上述剖面之形狀，確定具有該剖面之纖維之配向方向，於將該配向方向相對於上述縱向未達30°之上述剖面之個數比率作為上述纖維之縱配向率(X(%))時，該縱配向率(X(%))未達12.1%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polishing cloth including a nonwoven fabric formed of fibers, and a resin composition impregnated in the nonwoven fabric, and having a polishing surface, wherein, with a direction perpendicular to the polishing surface being a longitudinal direction, CT images of cross sections parallel to the longitudinal direction are acquired; among a plurality of cross sections of the fibers in the CT images, 2% of the cross sections in descending order of area are selected as measurement targets; orientation directions of the fibers having the cross section are determined from the shapes of the cross sections determined as the measurement targets; when the ratio of the number of the cross sections in which each of the orientation directions is less than 30° to the longitudinal direction is defined as a longitudinal orientation rate (X (%)) of the fibers, the polishing cloth has a longitudinal orientation rate (X (%)) of less than 12.1%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:研磨布</p>
        <p type="p">1b:背面</p>
        <p type="p">1p:研磨面</p>
        <p type="p">11f:纖維</p>
        <p type="p">12:樹脂組合物</p>
        <p type="p">13:空隙部</p>
        <p type="p">D1:縱向</p>
        <p type="p">D2:橫向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1883" publication-number="202619089">
    <tif-files tif-type="multi-tif">
      <tif file="114129999.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129999</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置冷卻結構</chinese-title>
        <english-title>ELECTRONIC DEVICE COOLING STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L23/473</main-classification>
        <further-classification edition="200601120260127B">H01L23/367</further-classification>
        <further-classification edition="200601120260127B">H01L21/48</further-classification>
        <further-classification edition="200601120260127B">F28F3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克曼　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WORKMAN, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　羅恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>房炅模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, KYONG-MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可透過方法形成具有第一側及與該第一側相對之第二側的冷卻結構，該方法包含：在第一基板中形成入口及出口；在該第一基板之第二側上形成至少一個通道，其中該至少一個通道與該入口及該出口流體連通；在第二基板之第一側上形成複數個噴嘴；及在與該第二基板之該第一側相對的該第二基板之第二側上形成複數個通道。該複數個通道與該複數個噴嘴對準，且該第一基板之第二側接合至該第二基板之該第一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid communication with the inlet and outlet, forming a plurality of nozzles on the first side of a second substrate, and forming a plurality of channels on the second side of the second substrate opposite the first side of the second substrate. The plurality of channels is aligned with the plurality of nozzles, and the second side of the first substrate is bonded to the first side of the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:接合結構</p>
        <p type="p">202:入口</p>
        <p type="p">204:出口</p>
        <p type="p">208:噴嘴</p>
        <p type="p">210:元件</p>
        <p type="p">216:元件</p>
        <p type="p">218:積體裝置晶粒</p>
        <p type="p">222:接合界面</p>
        <p type="p">230:冷卻結構</p>
        <p type="p">246:空腔</p>
        <p type="p">248:空腔</p>
        <p type="p">500:半導體裝置封裝</p>
        <p type="p">502:散熱器/散熱片</p>
        <p type="p">504:封裝基板</p>
        <p type="p">506:囊封體</p>
        <p type="p">508:外側表面</p>
        <p type="p">510:頂表面</p>
        <p type="p">512:側</p>
        <p type="p">514:埠/連接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1884" publication-number="202617441">
    <tif-files tif-type="multi-tif">
      <tif file="114130053.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>罐子之印刷機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B41F17/22</main-classification>
        <further-classification edition="200901120260131B">B41F17/13</further-classification>
        <further-classification edition="200601120260131B">B41C1/10</further-classification>
        <further-classification edition="200601120260131B">B41C1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋製罐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYO SEIKAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高取偉織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATORI, IORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種結構簡單、不會於印版輥筒或印刷機其他部件上產生結露、可實現印刷品質穩定之罐子之印刷機。  &lt;br/&gt;本發明之解決手段在於一種罐子之印刷機100，其具有滑槽111、心軸輪112、具有印版輥筒114之多個油墨裝置113、橡皮布輪123、以及包含調節印版輥筒114周圍溫濕度之印版輥筒溫度調節單元131之溫度調節管理部130，且溫度調節管理部130還具有控制部135，印版輥筒溫度調節單元131具有調節向印版輥筒114送風之空氣之溫濕度之溫濕度調節機構132、及將經溫濕度調節機構132調節溫濕度後之空氣送風之印版輥筒送風機構133，控制部135構成為可控制溫濕度調節機構132將送風之空氣設定為規定溫濕度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:罐子之印刷機</p>
        <p type="p">110:印刷裝置</p>
        <p type="p">111:滑槽</p>
        <p type="p">112:心軸輪</p>
        <p type="p">113:油墨裝置</p>
        <p type="p">114,114a,114b,114c,114d,114e,114f,114g,114h:印版輥筒</p>
        <p type="p">123:橡皮布輪</p>
        <p type="p">124:塗佈輥</p>
        <p type="p">125:轉接盤</p>
        <p type="p">140:空間內溫度調節單元</p>
        <p type="p">141:密閉壁部</p>
        <p type="p">142:側壁部</p>
        <p type="p">143:作業者出入口</p>
        <p type="p">144:頂壁部</p>
        <p type="p">145:密閉空間內送風機構</p>
        <p type="p">146:供氣機構</p>
        <p type="p">147:排氣機構</p>
        <p type="p">148:搬入搬出口</p>
        <p type="p">150:搬送路徑溫度調節單元</p>
        <p type="p">151:上游側搬送機構</p>
        <p type="p">152:下游側搬送機構</p>
        <p type="p">A1:來自供氣機構之供氣</p>
        <p type="p">A2:通向排氣機構之排氣</p>
        <p type="p">P:罐子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1885" publication-number="202618354">
    <tif-files tif-type="multi-tif">
      <tif file="114130089.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍺離子植入的矽波導光電二極體及其製造方法</chinese-title>
        <english-title>GERMANIUM ION-IMPLANTED SILICON WAVEGUIDE PHOTODIODE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G02B6/12</main-classification>
        <further-classification edition="200601120260202B">G02B6/134</further-classification>
        <further-classification edition="202501120260202B">H10F30/223</further-classification>
        <further-classification edition="202501120260202B">H10F71/00</further-classification>
        <further-classification edition="202501120260202B">H10F77/40</further-classification>
        <further-classification edition="202501120260202B">H10F77/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛　玥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張倩妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　永安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POON, WING ON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何品毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種光電二極體，包括絕緣體上矽基板、波導結構、Ge⁺植入區，以及第一低溫氧化層與第二低溫氧化層。絕緣體上矽基板包含埋入式氧化層與矽層，並且波導結構形成於矽層中。Ge⁺植入區形成於波導結構內，並透過離子佈植的方式，在劑量範圍5×10¹² cm⁻²至3×10¹⁵ cm⁻²之間進行，以實現全矽結構於電通信O頻段與C頻段的次能隙線性光感測。第一低溫氧化層與第二低溫氧化層能界定出植入窗口，且植入窗口與Ge⁺植入區採對齊配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photodiode includes an SOI substrate, a waveguide structure, a Ge⁺-implanted region, and first and second LTO layers. The SOI substrate includes a buried oxide layer and a silicon layer. The waveguide structure is formed in the silicon layer. The Ge⁺-implanted region is formed within the waveguide by ion implantation at a dose of 5×10¹² to 3×10¹⁵ cm⁻² to enable all-silicon sub-bandgap linear photodetection at the telecommunications O-and C-bands. The LTO layers define an implantation window aligned with the Ge⁺-implanted region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:經Ge+植入的矽波導光電二極體</p>
        <p type="p">110:基板</p>
        <p type="p">114:矽層</p>
        <p type="p">112:埋入式氧化層</p>
        <p type="p">116:矽波導層</p>
        <p type="p">120:第一輕摻雜區</p>
        <p type="p">122:第二輕摻雜區</p>
        <p type="p">124:第一重摻雜區</p>
        <p type="p">126:第二重摻雜區</p>
        <p type="p">130:第一低溫氧化物層</p>
        <p type="p">132:第二低溫氧化物層</p>
        <p type="p">134:植入窗口</p>
        <p type="p">140:Ge&lt;sup&gt;+&lt;/sup&gt;植入區</p>
        <p type="p">150:第一金屬接點</p>
        <p type="p">152:第二金屬接點</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
        <p type="p">W3:寬度</p>
        <p type="p">W4:寬度</p>
        <p type="p">W5:寬度</p>
        <p type="p">W6:寬度</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <p type="p">T3:厚度</p>
        <p type="p">D1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1886" publication-number="202619358">
    <tif-files tif-type="multi-tif">
      <tif file="114130203.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低雜訊斜坡產生並具備較低AVDD電源供應之交錯式開關電容積分器數位類比轉換器</chinese-title>
        <english-title>INTERLEAVING SWITCH CAP INTEGRATOR DAC FOR LOW NOISE RAMP GENERATION WITH LOWER AVDD POWER SUPPLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04N25/75</main-classification>
        <further-classification edition="202301120260102B">H04N25/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王云翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUNYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭嘉羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JIAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　育昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明闡述了用於在利用低電源供應電壓操作時進行低雜訊斜坡產生之交錯式開關電容積分器數位類比轉換器(DAC)之實施例。在一項實施例中，一種影像感測器包含：複數個像素，其被配置成一像素陣列之若干列及若干行；一位元線，其被電耦合至一主動像素；及一開關式電容器電流數位類比轉換器(IDAC)，其被耦合至該位元線。IDAC包含複數個開關組，其中每一開關組經組態以接收用於控制開關組之開關之斷開及閉合之一控制信號。該等控制信號在時間上偏移。一積分器被耦合至該複數個開關組。該積分器經組態以基於自該複數個開關組接收之輸入信號而產生一輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of interleaving switch cap integrator digital-to-analog converter (DAC) for low noise ramp generation while operating with low power supply voltage are described. In one embodiment, an image sensor includes: a plurality of pixels arranged in rows and columns of a pixel array; a bitline electrically coupled to an active pixel; and a switched capacitor current digital to analog converter (IDAC) coupled to the bitline. The IDAC includes a plurality of switch banks, where each switch bank is configured to receive a control signal for controlling opening and closing of switches of the switch bank. The control signals are offset in time. An integrator is coupled to the plurality of switch banks. The integrator is configured for generating an output signal based on input signals received from the plurality of switch banks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像系統</p>
        <p type="p">102:像素陣列</p>
        <p type="p">104:控制電路系統</p>
        <p type="p">106:讀出電路系統</p>
        <p type="p">110:功能邏輯</p>
        <p type="p">112:影像感測器像素/像素</p>
        <p type="p">118:位元線/輸出位元線</p>
        <p type="p">C1-Cx:行</p>
        <p type="p">P1-Pn:像素</p>
        <p type="p">R1-Ry:列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1887" publication-number="202618815">
    <tif-files tif-type="multi-tif">
      <tif file="114130308.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種在複合非磁性材料中散佈有磁性填料的複合磁性材料及相關裝置和方法</chinese-title>
        <english-title>COMPOSITE MAGNETIC MATERIAL WITH MAGNETIC FILLER DISPERSED IN COMPOSITE NON-MAGNETIC MATERIAL AND ASSOCIATED DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01F1/24</main-classification>
        <further-classification edition="200601120260127B">H01F1/37</further-classification>
        <further-classification edition="200601120260127B">H01F41/02</further-classification>
        <further-classification edition="202201120260127B">B22F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫至堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, ZHIJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洸洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANG-SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請請求保護一種複合磁性材料及其形成方法。該複合磁性材料包括複合非磁性材料(MA)和包含散佈在複合非磁性材料(MA)中的包覆型磁性顆粒(MB)的磁性填料。包覆型磁性顆粒(MB)包括大尺寸顆粒，其中值直徑在33.6µm至54.8µm之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite magnetic material and a method for forming a composite magnetic material. The composite magnetic material includes a composite non-magnetic material (MA) and a magnetic filler including coated magnetic particles (MB) dispersed in the composite non-magnetic material (MA). The coated magnetic particles (MB) include large sized particles having sizes in median diameters essentially ranging from 33.6µm to 54.8µm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:封裝模組</p>
        <p type="p">11:基板</p>
        <p type="p">11D:第二表面</p>
        <p type="p">11U:第一表面</p>
        <p type="p">12:功率開關單元</p>
        <p type="p">12B:背面</p>
        <p type="p">12T:頂面</p>
        <p type="p">13:導電線圈</p>
        <p type="p">13S:主體</p>
        <p type="p">14:磁性模塑料(MMC)</p>
        <p type="p">15:電容性儲能裝置</p>
        <p type="p">111:導電佈線結構</p>
        <p type="p">112:焊墊</p>
        <p type="p">113:接腳</p>
        <p type="p">121:導電焊墊</p>
        <p type="p">122:底部填充材料</p>
        <p type="p">123:導電柱/凸塊</p>
        <p type="p">124:導電晶片附著材料</p>
        <p type="p">131:第一線圈端子</p>
        <p type="p">132:第二線圈端子</p>
        <p type="p">133:導電附著材料</p>
        <p type="p">136:薄絕緣層</p>
        <p type="p">141:非磁性材料</p>
        <p type="p">142:包覆型磁性金屬顆粒</p>
        <p type="p">143:磁性金屬顆粒</p>
        <p type="p">144:絕緣包覆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1888" publication-number="202618816">
    <tif-files tif-type="multi-tif">
      <tif file="114130310.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有表面包覆型磁性顆粒的複合磁性材料及其相關裝置和方法</chinese-title>
        <english-title>COMPOSITE MAGNETIC MATERIAL WITH SURFACE COATED MAGNETIC PARTICLES AND ASSOCIATED DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01F1/24</main-classification>
        <further-classification edition="200601120260127B">H01F1/37</further-classification>
        <further-classification edition="200601120260127B">H01F41/02</further-classification>
        <further-classification edition="202201120260127B">B22F1/16</further-classification>
        <further-classification edition="200601120260127B">H01F27/255</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫至堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, ZHIJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洸洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANG-SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合磁性材料及其製造方法。複合磁性材料包括複合非磁性材料(MA)和磁性填料，包括散佈在複合非磁性材料(MA)中的包覆型磁性顆粒(MB)。包覆型磁性顆粒(MB)表面包覆有絕緣包覆層(MB2)，其中含有矽(Si)元素，以在所述複合磁性材料中的質量百分比衡量在0.52%至2.93%之間，且允許±20%的預定公差範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite magnetic material and a method for forming a composite magnetic material. The composite magnetic material includes a composite non-magnetic material (MA) and a magnetic filler including coated magnetic particles (MB) dispersed in the composite non-magnetic material (MA). The coated magnetic particles (MB) are surface coated with an insulation coating layer (MB2) that contains element Silicon (Si) in an amount of 0.52% to 2.93% of the composite magnetic material by mass with a predetermined tolerance margin of ±20%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:封裝模組</p>
        <p type="p">11:基板</p>
        <p type="p">11D:第二表面</p>
        <p type="p">11U:第一表面</p>
        <p type="p">12:功率開關單元</p>
        <p type="p">12B:背面</p>
        <p type="p">12T:頂面</p>
        <p type="p">13:導電線圈</p>
        <p type="p">13S:主體</p>
        <p type="p">14:磁性模塑料(MMC)</p>
        <p type="p">15:電容性儲能裝置</p>
        <p type="p">111:導電佈線結構</p>
        <p type="p">112:焊墊</p>
        <p type="p">113:接腳</p>
        <p type="p">121:導電焊墊</p>
        <p type="p">122:底部填充材料</p>
        <p type="p">123:導電柱/凸塊</p>
        <p type="p">124:導電晶片附著材料</p>
        <p type="p">131:第一線圈端子</p>
        <p type="p">132:第二線圈端子</p>
        <p type="p">133:導電附著材料</p>
        <p type="p">136:薄絕緣層</p>
        <p type="p">141:非磁性材料</p>
        <p type="p">142:包覆型磁性金屬顆粒</p>
        <p type="p">143:磁性金屬顆粒</p>
        <p type="p">144:絕緣包覆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1889" publication-number="202617371">
    <tif-files tif-type="multi-tif">
      <tif file="114130334.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有結合式束緊封合子組件之束帶裝置</chinese-title>
        <english-title>STRAPPING DEVICE WITH A COMBINED TENSIONING-AND-SEALING SUBASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">B25B25/00</main-classification>
        <further-classification edition="200601120260116B">B65B13/02</further-classification>
        <further-classification edition="200601120260116B">B65B13/22</further-classification>
        <further-classification edition="200601120260116B">B65B13/18</further-classification>
        <further-classification edition="200601120260116B">B65B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賽諾得工業集團有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGNODE INDUSTRIAL GROUP LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫伯薛米德　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBSCHMID, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之各實施例提供一種束帶裝置，其係配置以將束帶束緊於一負載上，並透過不同類型之束緊封合輪的旋轉方式，將該束帶之兩重疊區域接合。在一束緊循環期間，該束緊封合輪被週期地驅動，以在一旋轉方向上旋轉，使該束帶之一部分移動於另一部分之上，進而將該束帶束緊於該負載上。在一封合循環期間，該束緊封合輪於兩個相反旋轉方向上進行旋轉擺動，以在該束帶之重疊部分局部熔融並將其接合在一起。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of the present disclosure provide a strapping device configured to tension strap around a load and to join two areas of overlapping portions of the strap together via different types of rotation of a tensioning-and-sealing wheel. During a tensioning cycle, the tensioning-and-sealing wheel is periodically driven to rotate in one rotational direction to move one of the portions of strap over the other to tension the strap around the load. During a sealing cycle, the tensioning-and-sealing wheel is rotationally oscillated in two opposing rotational directions to locally melt two areas of the overlapping strap portions to join them together.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:束帶工具</p>
        <p type="p">100:外殼</p>
        <p type="p">150:工作組件</p>
        <p type="p">800:可樞轉搖臂</p>
        <p type="p">810:基座板</p>
        <p type="p">850:束緊封合板</p>
        <p type="p">900:手動槓桿</p>
        <p type="p">1410:第一按鈕式致動器</p>
        <p type="p">1440:第二按鈕式致動器</p>
        <p type="p">1500:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1890" publication-number="202619246">
    <tif-files tif-type="multi-tif">
      <tif file="114130342.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130342</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於降低電磁干擾的無橋功率因數校正電路</chinese-title>
        <english-title>A BRIDGELESS POWER FACTOR CORRECTION CIRCUIT FOR REDUCING ELECTROMAGNETIC INTERFERENCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260122B">H02M1/42</main-classification>
        <further-classification edition="200701120260122B">H02M1/44</further-classification>
        <further-classification edition="200601120260122B">H02M7/217</further-classification>
        <further-classification edition="200601120260122B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電源整合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER INTEGRATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋納　安東尼烏斯　雅各布斯　約翰尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WERNER, ANTONIUS JACOBUS JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆興達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, XINGDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了一種用於降低電磁干擾（EMI）的無橋功率因數校正（PFC）電路。電流源與低頻支路的開關並聯放置。電流源可以在AC輸入電壓的過零期間被接通，以限制電流並降低電壓變化率。相應地，在不需要大的被動濾波器或複雜電路系統的情況下，可以有利地降低EMI。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bridgeless power factor correction (PFC) circuit for reducing electromagnetic interference (EMI) is disclosed herein. A current source is placed in parallel with a switch of a low frequency leg. The current source may be turned on during zero crossings of the AC input voltage to limit current and reduce the rate of change in voltage. In turn, EMI may be advantageously reduced without the need for large passive filters or complicated circuitry.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:電源</p>
        <p type="p">212、214、216、218:NFET</p>
        <p type="p">220:支路</p>
        <p type="p">400:無橋PFC電路</p>
        <p type="p">406:支路</p>
        <p type="p">408:閘邏輯控制器</p>
        <p type="p">412:AC過零控制器</p>
        <p type="p">422、424:電流源</p>
        <p type="p">C、C_Pg:電容器</p>
        <p type="p">CTRL1、CTRL2:控制電壓</p>
        <p type="p">G1、G2、G3、G4:閘極驅動信號</p>
        <p type="p">GND:中性接地</p>
        <p type="p">GND2:大地接地</p>
        <p type="p">IL:電感器電流</p>
        <p type="p">L:電感器</p>
        <p type="p">Nacp:正輸入節點</p>
        <p type="p">Nacn:負輸入節點</p>
        <p type="p">Nfb、NX:節點</p>
        <p type="p">R:電阻器</p>
        <p type="p">S1、S2、S3、S4:開關</p>
        <p type="p">Vac:AC輸入電壓</p>
        <p type="p">Vacp、Vacn、Vfb、VDS_H、VDS_L:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1891" publication-number="202617207">
    <tif-files tif-type="multi-tif">
      <tif file="114130368.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鼻插管系統</chinese-title>
        <english-title>NASAL CANNULA SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A61M16/08</main-classification>
        <further-classification edition="200601120260130B">A61M16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商費雪派克醫療保健有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡連那　傑森　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLENNER, JASON ALLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>琳恩　布蘭特　Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAING, BRENT IAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑威爾　凱文　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWELL, KEVIN BLAKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種適用於在呼吸支援系統中使用的鼻插管系統、鼻插管總成、鼻插管及其組件，該呼吸支援系統被整構成將呼吸氣體流輸送到患者的上氣道。該鼻插管總成可包括：聯接構件，該聯接構件被設置成可接納該呼吸氣體流；框架，該框架與該聯接構件相聯接；和一個或多個鼻插柱模組，該一個或多個鼻插柱模組與該框架可利用拆卸方式聯接。該聯接構件能夠相對於該框架旋轉，以改變從其接納該呼吸氣體流的一側。數個不同的鼻插柱模組可具有不同的鼻插柱幾何形狀，該不同的鼻插柱幾何形狀可包括至少一個非對稱鼻插柱幾何形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nasal cannula system, a nasal cannula assembly, a nasal cannula and components thereof suitable for use in a respiratory support system configured to deliver a flow of respiratory gases to an upper airway of a patient are described. The nasal cannula assembly may include a coupling member arranged to receive the flow of respiratory gases, a frame coupled with the coupling member, and one or more nasal prong modules removably coupled with the frame. The coupling member may be rotatable with respect to the frame to change the side from which the flow of respiratory gases is received. A number of different nasal prong modules may have different nasal prong geometries, which may include at least one asymmetric nasal prong geometry.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:呼吸支援系統</p>
        <p type="p">110:氣體源</p>
        <p type="p">112:氣體源出口</p>
        <p type="p">114:過濾器</p>
        <p type="p">120:加溼器供應導管</p>
        <p type="p">130:加溼器</p>
        <p type="p">132:加溼器底座</p>
        <p type="p">134:加溼室</p>
        <p type="p">140:吸氣導管</p>
        <p type="p">142:聯結器</p>
        <p type="p">144:聯結器</p>
        <p type="p">146:管</p>
        <p type="p">150:鼻插管總成</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1892" publication-number="202618459">
    <tif-files tif-type="multi-tif">
      <tif file="114130452.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於熱調節系統之消音器及其填充方法、熱調節方法，以及微影設備</chinese-title>
        <english-title>SILENCER FOR THERMAL CONDITIONING SYSTEM AND METHOD FOR FILLING THEREOF, THERMAL CONDITIONING METHOD, AND LITHOGRAPHIC APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G03F7/20</main-classification>
        <further-classification edition="200601120260128B">F16L55/04</further-classification>
        <further-classification edition="200601120260128B">G05D23/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷札伊哈　阿布杜拉希姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REZAEIHA, ABDOLRAHIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費傑茲　馬里斯　威爾赫摩斯　理歐那朵司　亨利克司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEIJTS, MAURICE WILHELMUS LEONARDUS HENDRICUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉拉傑　維涅什　斯里尼瓦桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALARAJ, VIGNESH SRINIVASAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種消音器，其經組態以使一熱調節流體導管中之一熱調節流體中之一聲波消音，該消音器包含：  &lt;br/&gt;-      一消音器殼體，其包含一內腔，其中一熱調節流體腔配置於該內腔內部，  &lt;br/&gt;-      一第一入口，其配置於殼體壁中，  &lt;br/&gt;-      一第一通道，其連接至該第一入口，  &lt;br/&gt;-      一第二入口，其配置於該殼體壁中，  &lt;br/&gt;-      一第二通道，其連接至該第二入口，  &lt;br/&gt;其中該第一通道及該第二通道完全配置於該殼體壁外部，  &lt;br/&gt;且本發明係關於一種包含該消音器之微影設備、一種填充該消音器之方法、一種對該消音器進行排洩之方法、一種使用該消音器對一物件進行熱調節之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A silencer configured to silence an acoustic wave in a thermal conditioning fluid in a thermal conditioning fluid duct, the silencer comprising: &lt;br/&gt;- a silencer housing comprising an inner cavity, wherein a thermal conditioning fluid cavity is arranged inside the inner cavity, &lt;br/&gt;- a first entrance arranged in the housing wall, &lt;br/&gt;- a first channel connected to the first entrance, &lt;br/&gt;- a second entrance arranged in the housing wall, &lt;br/&gt;- a second channel connected to the second entrance, &lt;br/&gt;wherein the first channel and the second channel are arranged fully outside the housing wall, &lt;br/&gt;and a lithographic apparatus comprising the silencer, a method of filling the silencer, a method of draining the silencer, a method of thermally conditioning an object using the silencer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:消音器</p>
        <p type="p">16:熱調節流體</p>
        <p type="p">17:熱調節流體導管</p>
        <p type="p">19:內腔</p>
        <p type="p">21:流體腔</p>
        <p type="p">23:第一通道</p>
        <p type="p">25:第二通道</p>
        <p type="p">27:氣體腔</p>
        <p type="p">31:第一入口邊緣</p>
        <p type="p">33:第二入口邊緣</p>
        <p type="p">37:第一側壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1893" publication-number="202619592">
    <tif-files tif-type="multi-tif">
      <tif file="114130500.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合型晶圓及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260121B">H10H20/819</main-classification>
        <further-classification edition="202501120260121B">H10H20/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石崎順也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古屋翔吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUYA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種接合型晶圓及其製造方法，該接合型晶圓具有設置在起始基板上的多層的化合物半導體層、設置在前述多層的化合物半導體層上的樹脂層及隔著前述樹脂層進行接合的紫外線及可見光穿透性基板，前述多層的化合物半導體層具有具活性層功能的第一化合物半導體層與接合於前述樹脂層且為最上層的第二化合物半導體層，前述樹脂層的厚度T與前述第二化合物半導體層的厚度G之關係滿足T＞0.3845×ln(G)－0.464且T≦1.0 μm。藉此，可提供一種接合型晶圓及其製造方法，其著眼於磊晶層的厚度、特別是造成晶圓的翹曲的層厚與接合層兼犧牲層厚之關係並能一併良好地保持昇華性與接合性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:接合型晶圓</p>
        <p type="p">2:起始基板</p>
        <p type="p">3:化合物半導體層</p>
        <p type="p">3a:第一化合物半導體層</p>
        <p type="p">3b:第二化合物半導體層</p>
        <p type="p">4:樹脂層</p>
        <p type="p">5:紫外線及可見光穿透性基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1894" publication-number="202619243">
    <tif-files tif-type="multi-tif">
      <tif file="114130506.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130506</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多相穩壓器的控制電路、多相穩壓器以及其控制方法</chinese-title>
        <english-title>CONTROL CIRCUIT FOR MULTIPHASE VOLTAGE REGULATOR, MULTIPHASE VOLTAGE REGULATOR AND METHOD FOR CONTROLLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H02M1/08</main-classification>
        <further-classification edition="200601120251103B">H02M1/14</further-classification>
        <further-classification edition="200601120251103B">G05F1/565</further-classification>
        <further-classification edition="200601120251103B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳暐中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONG, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧驄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, CONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昱輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於多相穩壓器的控制電路，包括切換控制電路和監控電路。切換控制電路用以提供多個控制訊號以控制多個功率級電路。每個功率級電路用以提供一相電流。監控電路用以接收至少一功率級電路的至少一報告訊號，並判定該報告訊號是否指示啟動相。在接收到指示啟動相的報告訊號後，將控制訊號提供給被判定為啟動相的功率級電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control circuit for a multiphase voltage regulator includes a switching control circuit, and a monitor circuit. The switching control circuit is configured to provide a plurality of control signals to control a plurality of power stage circuits. Each of the power stage circuit is configured to provide a phase current. The monitor circuit is configured to receive at least one report signal from at least one of the power stage circuits, and determine whether the report signal indicates an activated phase. After the report signal indicating the activated phase is received, the control signal is provided to the power stage circuit determined as the activated phase.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:控制電路、多相控制器積體電路</p>
        <p type="p">12-1~12-n:功率級電路</p>
        <p type="p">100:多相穩壓器</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">I1~In:相電流</p>
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;~L&lt;sub&gt;n&lt;/sub&gt;:電感</p>
        <p type="p">S&lt;sub&gt;PWM1&lt;/sub&gt;~S&lt;sub&gt;PWMn&lt;/sub&gt;:控制訊號</p>
        <p type="p">PWM:切換控制接腳</p>
        <p type="p">PWM1~PWMn:切換控制接腳</p>
        <p type="p">MON:監控接腳</p>
        <p type="p">RP:報告接腳</p>
        <p type="p">Sta:報告訊號</p>
        <p type="p">Cout:輸出電容</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1895" publication-number="202617471">
    <tif-files tif-type="multi-tif">
      <tif file="114130576.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童約束系統和載具</chinese-title>
        <english-title>CHILD RESTRAINT SYSTEM AND CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B60N2/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭欽明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHINMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳筱甄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIAOJEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開公開了一種兒童約束系統和載具。兒童約束系統包括座椅主體和保護層。座椅主體用於將兒童容納於其上，所述座椅主體具有座椅殼體。保護層附接至所述座椅主體的所述座椅殼體，或者形成為所述座椅主體的所述座椅殼體的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure discloses a child restraint system and a carrier. The child restraint system includes a seat body and protective layer. The seat body is configured to accommodate a child thereon and has a seat shell. The protective layer is attached to the seat shell of the seat body, or is formed as at least a part of the seat shell of the seat body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:嬰兒汽車座椅</p>
        <p type="p">10A:座椅主體</p>
        <p type="p">10B:頂篷組件</p>
        <p type="p">10C:提手</p>
        <p type="p">10D:座椅安全帶</p>
        <p type="p">110:頂篷</p>
        <p type="p">111:主附接件</p>
        <p type="p">112:側附接件</p>
        <p type="p">130:座椅殼體底座</p>
        <p type="p">131:前凹部</p>
        <p type="p">135:後連接杆</p>
        <p type="p">140:連接元件</p>
        <p type="p">150:ISOFIX結構</p>
        <p type="p">190:支撐肋結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1896" publication-number="202619609">
    <tif-files tif-type="multi-tif">
      <tif file="114130615.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件之製造方法、化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260127B">H10K39/32</main-classification>
        <further-classification edition="202301120260127B">H10K30/20</further-classification>
        <further-classification edition="202301120260127B">H10K30/30</further-classification>
        <further-classification edition="200601120260127B">C07D487/04</further-classification>
        <further-classification edition="202301120260127B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子和平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, KAZUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木優子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦寛記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米久田康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKUTA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種在接收到藍綠色光時的量子效率的電場強度依賴性小的光電轉換元件。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜包含由式（1）表示之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="597px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1897" publication-number="202618217">
    <tif-files tif-type="multi-tif">
      <tif file="114130618.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通過對橢圓偏振訊號進行代數分析之多層薄膜特性分析方法及其裝置</chinese-title>
        <english-title>MULTILAYER THIN FILM CHARACTERISTIC ANALYSIS METHOD AND DEVICE BY ALGEBRAIC ANALYSIS OF ELLIPSOMETRY SIGNALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250912B">G01B11/06</main-classification>
        <further-classification edition="200601120250912B">G01N21/21</further-classification>
        <further-classification edition="200601120250912B">G01N21/41</further-classification>
        <further-classification edition="200601120250912B">G01N21/84</further-classification>
        <further-classification edition="200601120250912B">G06F17/12</further-classification>
        <further-classification edition="200601120250912B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁荷大學校産學協力團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪錫在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SEOKJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種通過對橢圓偏振訊號進行代數分析之多層薄膜特性分析方法及其裝置。本發明提供一種用於分析由入射介質與基板之間層疊之多個薄膜所構成之多層薄膜樣品的多層薄膜特性之方法，包含以下步驟：第一步驟，儲存針對入射介質中多個入射角所測量之反射係數比的測量結果資料；第二步驟，針對由聯立超越方程式構成之反射係數理論模型，應用關於薄膜厚度之展開函數，導出關於複折射率與厚度之代數多項式方程式；第三步驟，以所述第二步驟中所導出之代數多項式方程式的解為基礎，計算所述多個薄膜中各個薄膜之複折射率與厚度之近似值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1898" publication-number="202619420">
    <tif-files tif-type="multi-tif">
      <tif file="114130662.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙面銅箔層壓膜、包含其之印刷電路板、及製造雙面銅箔層壓膜之方法</chinese-title>
        <english-title>DOUBLE-SIDED COPPER-CLAD LAMINATED FILM, PRINTED CIRCUIT BOARD INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE DOUBLE-SIDED COPPER-CLAD LAMINATED FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">H05K1/03</main-classification>
        <further-classification edition="200601120260115B">B32B15/088</further-classification>
        <further-classification edition="200601120260115B">B32B15/20</further-classification>
        <further-classification edition="200601120260115B">H05K3/38</further-classification>
        <further-classification edition="200601120260115B">C23C14/34</further-classification>
        <further-classification edition="200601120260115B">C25D5/02</further-classification>
        <further-classification edition="200601120260115B">C23F1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東麗先端素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED MATERIALS KOREA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旼材</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康鎣大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HYUNG DAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁愚得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, WOO DEUG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG DEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種雙面銅箔層壓膜、一種包含其之印刷電路板及一種製造該雙面銅箔層壓膜之方法。該雙面銅箔層壓膜包含：聚醯亞胺基基板，其具有大於10 μm但小於或等於30 μm之一厚度；一第一鎳層，其配置於該聚醯亞胺基基板之一第一表面上；一第一銅層，其配置於與該聚醯亞胺基基板之該第一表面對置之該第一鎳層之一表面上；一第二鎳層，其配置於該聚醯亞胺基基板之一第二表面上；及一第二銅層，其配置於與該聚醯亞胺基基板之該第二表面對置之該第二鎳層之一表面上，其中該第一銅層之一厚度或該第二銅層之一厚度相對於該聚醯亞胺基基板之一厚度大於或等於10%但小於25%，當藉由使用含有氯化鐵(II)之一蝕刻溶液來蝕刻該第一銅層之一表面或該第二銅層之一表面時，藉由能量色散光譜術(EDAX)或電子探針微量分析(EPMA)偵測不到鉻，且一膜表面上之捲曲具有小於0.1 mm之一高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a double-sided copper-clad laminated film, a printed circuit board including the same, and a method of manufacturing the double-sided copper-clad laminated film. The double-sided copper-clad laminated film includes: a polyimide-based substrate having a thickness greater than 10 μm but less than or equal to 30 μm; a first nickel layer arranged on a first surface of the polyimide-based substrate; a first copper layer arranged on a surface of the first nickel layer that is opposite the first surface of the polyimide-based substrate; a second nickel layer arranged on a second surface of the polyimide-based substrate; and a second copper layer arranged on a surface of the second nickel layer that is opposite the second surface of the polyimide-based substrate, wherein a thickness of the first copper layer or a thickness of the second copper layer is greater than or equal to 10 % but less than 25 % relative to a thickness of the polyimide-based substrate, chromium is not detected by energy dispersive spectroscopy (EDAX) or electron probe microanalysis (EPMA) when etching a surface of the first copper layer or a surface of the second copper layer by using an etching solution containing ferric(II) chloride, and curls on a film surface have a height of less than 0.1 mm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:第一銅層</p>
        <p type="p">410:第一鎳層</p>
        <p type="p">420:聚醯亞胺基基板</p>
        <p type="p">430:第二鎳層</p>
        <p type="p">440:第二銅層</p>
        <p type="p">480:雙面銅箔層壓膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1899" publication-number="202618093">
    <tif-files tif-type="multi-tif">
      <tif file="114130740.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>造紙機的排水板條</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">D21F1/54</main-classification>
        <further-classification edition="200601120260131B">D21F1/48</further-classification>
        <further-classification edition="200601120260131B">D21F1/32</further-classification>
        <further-classification edition="200601120260131B">D21F7/00</further-classification>
        <further-classification edition="200601120260131B">D21F11/00</further-classification>
        <further-classification edition="200601120260131B">D21F1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴托穆斯　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARTELMUSS, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴托穆斯　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARTELMUSS, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種造紙機的排水板條(1)，其具有基體(5)，所述基體具有橫向於篩網帶(3)的運動方向(4)定向的縱向。所述基體(5)具有至少一個沿排水板條(1)的縱向(2)延伸的、壓力密封的、封閉的腔室(7)，其中，所述腔室(7)具有與壓力管線(8)連接的接口、壁(11)和與所述壁(11)相連的側壁(13、14)，所述壁具有朝向造紙機的篩網帶(3)的表面(12)。所述腔室(7)的壁(11)的形態能夠改變，並且根據壓力變化檢測壁(11)的形態變化的裝置(17)布置在腔室(7)中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:排水板條</p>
        <p type="p">4:箭頭；運動方向</p>
        <p type="p">5:基體</p>
        <p type="p">7:腔室</p>
        <p type="p">8:壓力管線</p>
        <p type="p">9:管線</p>
        <p type="p">11:可變形的壁</p>
        <p type="p">12:表面</p>
        <p type="p">13:側壁</p>
        <p type="p">14:側壁</p>
        <p type="p">15:下部件</p>
        <p type="p">17:裝置</p>
        <p type="p">18:底部表面</p>
        <p type="p">19:具有較低彎曲剛度的區域</p>
        <p type="p">20:上部件</p>
        <p type="p">21:具有較高彎曲剛度的區域</p>
        <p type="p">22:具有較高彎曲剛度的區域</p>
        <p type="p">23:凹槽</p>
        <p type="p">24:具有較低彎曲剛度的區域</p>
        <p type="p">25:凹槽</p>
        <p type="p">26:具有較低彎曲剛度的區域</p>
        <p type="p">27:凹槽</p>
        <p type="p">28:前邊緣</p>
        <p type="p">29:凹槽</p>
        <p type="p">41:內表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1900" publication-number="202618771">
    <tif-files tif-type="multi-tif">
      <tif file="114130752.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>存儲裝置、存儲系統及其操作方法</chinese-title>
        <english-title>STORAGE DEVICE, STORAGE SYSTEM, AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G11C11/401</main-classification>
        <further-classification edition="200601120251103B">G11C7/10</further-classification>
        <further-classification edition="200601120251103B">G11C8/06</further-classification>
        <further-classification edition="202301120251103B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技控股有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES HOLDING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, CHUNYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍宗亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUO, ZONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牟文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MU, WENJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種存儲裝置、存儲系統及其操作方法，該存儲裝置包括沿第一方向堆疊的第一記憶體管芯及管芯組；管芯組包括沿第一方向堆疊的M個第二記憶體管芯；每個第二記憶體管芯與第三記憶體管芯連接，並被配置為：能夠通過第二記憶體管芯的N個資料通道與第三記憶體管芯進行（N*X）位元頻寬的資料交互；M、N、X均為正整數；第一記憶體管芯與第三記憶體管芯連接，並被配置為：能夠通過第一記憶體管芯的N個資料通道與第三記憶體管芯進行（N*X）位元頻寬的資料交互，且在管芯組的第一資料通道對應的存儲部分發生故障時替換第一資料通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a storage device, a storage system, and an operating method thereof. The storage device includes a first memory die and a die group stacked along a first direction; the die group includes M second memory dies stacked along the first direction; each second memory die is connected to a third memory die, and is configured to: be capable of performing data interaction of (N*X) bit bandwidth with the third memory die through N data channels of the second memory die; M, N, and X are all positive integers; the first memory die is connected to the third memory die, and configured to: be capable of performing data interaction of (N*X) bit bandwidth with the third memory die through N data channels of the first memory die, and in an event of a failure in a storage portion corresponding to a first data channel of the chip group, replace the first data channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">401:第一記憶體管芯</p>
        <p type="p">402:管芯組</p>
        <p type="p">403:第二記憶體管芯</p>
        <p type="p">X/Y:X/Y軸方向</p>
        <p type="p">Z:Z軸方向(第一方向)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1901" publication-number="202619495">
    <tif-files tif-type="multi-tif">
      <tif file="114130767.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性記憶體</chinese-title>
        <english-title>MAGNETORESISTIVE RANDOM ACCESS MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260121B">H10B61/00</main-classification>
        <further-classification edition="202301120260121B">H10N50/80</further-classification>
        <further-classification edition="202301120260121B">H10N50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林君明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林君明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提出一種磁性記憶體，包含一磁性隧道結及一電晶體結構。所述磁性隧道結包含一磁固定層、一隧道屏障層、一磁自由層及至少一磁性增強層。所述隧道屏障層與所述磁固定層堆疊。所述磁自由層與所述隧道屏障層堆疊。所述至少一磁性增強層對應於所述磁自由層或所述磁固定層中的至少一者設置。所述電晶體結構與所述磁性隧道結電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a magnetoresistive random access memory (MRAM), including a magnetic tunnel junction (MTJ) and a transistor structure. The magnetic tunnel junction includes a magnetic fixed layer, a tunnel barrier layer, a magnetic free layer and at least one magnetic enhancement layer. The tunnel barrier layer is stacked with the magnetic fixed layer. The magnetic free layer is stacked with the tunnel barrier layer. The at least one magnetic enhancement layer is disposed corresponding to at least one of the magnetic free layers or the magnetic fixed layers. The transistor structure is electrically connected to the magnetic tunnel junction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:磁性記憶體</p>
        <p type="p">11:磁性隧道結</p>
        <p type="p">12:位元線</p>
        <p type="p">13:讀取字元線</p>
        <p type="p">14:電晶體結構</p>
        <p type="p">15:導電結構</p>
        <p type="p">16:寫入線</p>
        <p type="p">111:磁固定層</p>
        <p type="p">113:隧道屏障層</p>
        <p type="p">115:磁自由層</p>
        <p type="p">141:源極區域</p>
        <p type="p">142:通道區域</p>
        <p type="p">143:汲極區域</p>
        <p type="p">144:閘極絕緣層</p>
        <p type="p">145:閘極區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1902" publication-number="202618767">
    <tif-files tif-type="multi-tif">
      <tif file="114130778.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置、系統及其運算方法</chinese-title>
        <english-title>MEMORY DEVICE, SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G11C7/06</main-classification>
        <further-classification edition="200601120251204B">G11C7/10</further-classification>
        <further-classification edition="200601120251204B">G11C7/22</further-classification>
        <further-classification edition="200601120251204B">G11C29/44</further-classification>
        <further-classification edition="200601120251204B">G06F11/08</further-classification>
        <further-classification edition="200601120251204B">G06F7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張欽鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯思宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, SZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范振嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳耕暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括複數個記憶體單元以及控制器。控制器用以對一或多個記憶體裝置中的輸入資料執行運算指令。一或多個記憶體單元中的每一者包括：記憶體單元陣列，用以將資料儲存在記憶體單元中；以及外圍電路，用以接收至少一部分輸入資料，自記憶體單元陣列讀取儲存資料並根據控制器的運算指令對至少一部分輸入資料及儲存資料執行運算操作。控制器用以根據一或多個記憶體單元中的每一者的運算操作的執行結果來判定執行運算指令的運算結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An memory device includes a plurality of memory units and a controller. The controller is configured for execution of a computing instruction on input data in one or more memory device. Each of the one or more memory units includes: a memory cell array configured to store data in memory cells and a peripheral circuit configured to: receive at least one portion of the input data, read stored data from the memory cell array, and execute a computing operation on the at least one portion of the input data and the stored data according to the computing instruction from the controller. The controller is configured to determine a computing result of the execution of the computing instruction based on a result of execution of the computing operation in each of the one or more memory units.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:記憶體裝置</p>
        <p type="p">112:控制器</p>
        <p type="p">114:介面</p>
        <p type="p">116:控制電路</p>
        <p type="p">118:組態暫存器</p>
        <p type="p">120:主機裝置</p>
        <p type="p">132:記憶體組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1903" publication-number="202618812">
    <tif-files tif-type="multi-tif">
      <tif file="114130832.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用一步式熱施用製程的PPTC材料</chinese-title>
        <english-title>PPTC MATERIAL WITH ONE-STEP HOT APPLICATION PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01C7/02</main-classification>
        <further-classification edition="200601120260123B">H05B3/14</further-classification>
        <further-classification edition="200601120260123B">G01K7/16</further-classification>
        <further-classification edition="202501120260123B">C08L23/08</further-classification>
        <further-classification edition="200601120260123B">C08K3/04</further-classification>
        <further-classification edition="200601120260123B">C08J3/24</further-classification>
        <further-classification edition="200601120260123B">C08J3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商力特福斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITTELFUSE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, FLORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔曉龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, JIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多姆斯　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOMS, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種利用一步式熱施用製程的 PPTC 材料。一種用於製備聚合物正溫度係數（polymeric positive temperature coefficient，PPTC）化合物並且將這樣的化合物共形地施用到基板的方法可以包括：製備並且混合原材料，以形成 PPTC 混合物；通過聚合物共混設備加工 PPTC 混合物，其中該 PPTC 混合物被加熱並且被擠壓為 PPTC 化合物；對聚合物化合物執行聚束製程，以在 PPTC 化合物中建立聚合物鏈之間的交聯；以及使用熱施用製程將 PPTC 化合物施用到基板，其中該 PPTC 化合物被加熱並且被共形地施用到基板的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing a preparing a polymeric positive temperature coefficient (PPTC) compound and conformally applying such compound to a substrate in accordance with an embodiment of the present disclosure may include preparing and mixing raw materials to form a PPTC mixture, processing the PPTC mixture through polymer compounding equipment, wherein the PPTC mixture is heated and is extruded as a PPTC compound, performing a beaming process on the polymer compound to establish crosslinking between polymer chains in the PPTC compound, and applying the PPTC compound to a substrate using a hot application process wherein the PPTC compound is heated and is conformally applied to a surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100、110、120、130、140:框</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1904" publication-number="202619614">
    <tif-files tif-type="multi-tif">
      <tif file="114130936.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251103B">H10K59/35</main-classification>
        <further-classification edition="202301120251103B">H10K59/38</further-classification>
        <further-classification edition="202301120251103B">H10K50/818</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭晟九</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SUNGGOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示裝置，包括：基板，具有子像素，該子像素包含發光區及圍繞該發光區的非發光區；反射電極，位於該基板上；堤部，位於該反射電極上；以及有機發光元件，位於該反射電極及該堤部上。該堤部配置在該子像素的該非發光區中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a display device including a substrate having a subpixel, and the subpixel including an emissive area and a non-emissive area surrounding the emissive area, a reflective electrode on the substrate, a bank on the reflective electrode, and an organic light-emitting element on the reflective electrode and the bank. The bank is disposed in the non-emissive area in the subpixel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">2:基板</p>
        <p type="p">4:第一電極</p>
        <p type="p">9:彩色濾光層</p>
        <p type="p">21:第一子像素、子像素</p>
        <p type="p">22:第二子像素、子像素</p>
        <p type="p">23:第三子像素、子像素</p>
        <p type="p">31:第一薄膜電晶體、薄膜電晶體</p>
        <p type="p">32:第二薄膜電晶體、薄膜電晶體</p>
        <p type="p">33:第三薄膜電晶體、薄膜電晶體</p>
        <p type="p">41:陽極電極</p>
        <p type="p">42:反射電極</p>
        <p type="p">91:第一彩色濾光片、彩色濾光片</p>
        <p type="p">92:第二彩色濾光片、彩色濾光片</p>
        <p type="p">93:第三彩色濾光片、彩色濾光片</p>
        <p type="p">41a:第一陽極電極、陽極電極</p>
        <p type="p">41b:第二陽極電極、陽極電極</p>
        <p type="p">41c:第三陽極電極、陽極電極</p>
        <p type="p">42a:第一反射電極</p>
        <p type="p">42a':第一連接電極</p>
        <p type="p">42b:第二反射電極</p>
        <p type="p">42b':第二連接電極</p>
        <p type="p">42c:第三反射電極</p>
        <p type="p">42c':第三連接電極</p>
        <p type="p">CT1:第一接觸孔</p>
        <p type="p">CT2:第二接觸孔</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">EA1:第一發光區、發光區</p>
        <p type="p">EA2:第二發光區、發光區</p>
        <p type="p">EA3:第三發光區、發光區</p>
        <p type="p">NEA1:第一非發光區、非發光區</p>
        <p type="p">NEA2:第二非發光區、非發光區</p>
        <p type="p">NEA3:第三非發光區、非發光區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1905" publication-number="202617409">
    <tif-files tif-type="multi-tif">
      <tif file="114130968.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於加工和熔化聚合物材料的擠出機或多螺桿擠出機</chinese-title>
        <english-title>EXTRUDER OR MULTI-SCREW EXTRUDER FOR PROCESSING AND MELTING POLYMERIC MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260115B">B29C48/685</main-classification>
        <further-classification edition="201901120260115B">B29C48/40</further-classification>
        <further-classification edition="201901120260115B">B29C48/25</further-classification>
        <further-classification edition="200601120260115B">B29B17/00</further-classification>
        <further-classification edition="200601320260115B">B29K105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商愛麗瑪工程回收機械公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EREMA ENGINEERING RECYCLING MASCHINEN UND ANLAGEN GESELLSCHAFT M.B.H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費區丁格　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEICHTINGER, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡貝爾　羅嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBER, ROLAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於加工及熔化聚合物材料的擠出機或多螺桿擠出機（1），特別是雙螺桿擠出機（1），具有至少兩個可在共同的殼體（2）中旋轉的螺桿（3a、3b、…）、用於將待加工材料送入擠出機（1）的進料區域（A）以及用於熔化材料的下游擠出區域（C），其中殼體（2）在進料區域（A）中具有至少一個形成在其側壁上的進料口（4），進料口用於將待加工材料引入螺桿（3a、3b、…）的收集區域，其特徵在於，殼體（2）在進料區域（A）中或在進料口（4）周圍的區域中，具有在擠出機（1）的部分縱向區段上沿螺桿（3a、3b、…）延伸的袋狀部（5），在殼體（2）中，至少在袋狀部（5）的縱向區段中，在兩個直接相鄰的螺桿（3a、3b、…）之間的區域或在從一個螺桿到相鄰螺桿的材料轉移區域中，形成至少一個伸入殼體（2）的內部區域（15）且沿輸送方向（6）延伸的三角部（20）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:擠出機、多螺桿擠出機、雙螺桿擠出機</p>
        <p type="p">2:殼體</p>
        <p type="p">3a,3b:螺桿</p>
        <p type="p">3a',3b':縱軸</p>
        <p type="p">4:進料口</p>
        <p type="p">5:袋狀部</p>
        <p type="p">6:輸送方向、縱向</p>
        <p type="p">7:螺桿間隙</p>
        <p type="p">8:內壁</p>
        <p type="p">9:位點、端點</p>
        <p type="p">11:末端</p>
        <p type="p">12:橫向</p>
        <p type="p">15:內部區域</p>
        <p type="p">31:驅動裝置</p>
        <p type="p">40:殼體縱軸</p>
        <p type="p">A:進料區域</p>
        <p type="p">B:過渡區域</p>
        <p type="p">C:擠出區域</p>
        <p type="p">LE:最長長度、長度</p>
        <p type="p">LT:長度區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1906" publication-number="202617032">
    <tif-files tif-type="multi-tif">
      <tif file="114131002.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清掃機器人工作站</chinese-title>
        <english-title>ROBOT CLEANER STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
        <further-classification edition="200601120260130B">A47L9/28</further-classification>
        <further-classification edition="200601120260130B">A47L13/17</further-classification>
        <further-classification edition="200601120260130B">D06F29/00</further-classification>
        <further-classification edition="200601120260130B">F26B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳炅浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYOU, KYOUNGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳廷玩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, JUNGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JUNGBAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種清掃機器人工作站，包括：殼體，設置在廚櫃的下方；座部件，設置在殼體中並配置以容納清掃機器人；以及門，可旋轉地耦接至殼體並配置以打開或關閉座部件的出入口，其中，該門具有設置在殼體下端的旋轉軸，從而提升便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a robot cleaner station including a housing disposed below a kitchen cabinet, a seating part disposed in the housing and configured to accommodate a robot cleaner, and a door rotatably coupled to the housing and configured to open or close an inlet/outlet of the seating part, in which the door has a rotary shaft disposed at a lower end of the housing, thereby improving convenience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清掃機器人工作站</p>
        <p type="p">110:殼體</p>
        <p type="p">111:外壁</p>
        <p type="p">121:基座</p>
        <p type="p">122:洗滌板</p>
        <p type="p">123:耦接壁</p>
        <p type="p">124:內壁</p>
        <p type="p">126:門</p>
        <p type="p">126a:門驅動部件</p>
        <p type="p">140:集塵部件</p>
        <p type="p">141:集塵部件殼體</p>
        <p type="p">144:集塵袋抽屜</p>
        <p type="p">147,148:集塵流路</p>
        <p type="p">150:集塵模組</p>
        <p type="p">160:拖布清洗部件</p>
        <p type="p">163:清潔劑容器</p>
        <p type="p">170:拖布烘乾部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1907" publication-number="202618361">
    <tif-files tif-type="multi-tif">
      <tif file="114131016.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光波導基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B6/13</main-classification>
        <further-classification edition="200601120260127B">G02B6/30</further-classification>
        <further-classification edition="200601120260127B">G02B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京瓷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOCERA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎本昇悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOMOTO, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田恵子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, KEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之光波導基板具有基板、光波導、及槽部。光波導具有下部纖殼、纖芯、及上部纖殼。下部纖殼位於基板之上。纖芯位於下部纖殼之上。上部纖殼位於下部纖殼及纖芯之上。槽部沿纖芯之長邊方向延伸，其長邊方向上之第1端部到達基板之側面。槽部位於下部纖殼之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光波導基板</p>
        <p type="p">10:基板</p>
        <p type="p">20:光波導</p>
        <p type="p">21:纖芯</p>
        <p type="p">22:上部纖殼</p>
        <p type="p">23:下部纖殼</p>
        <p type="p">30:槽部</p>
        <p type="p">30a:槽部</p>
        <p type="p">30b:槽部</p>
        <p type="p">101:安裝面</p>
        <p type="p">t1:厚度</p>
        <p type="p">t2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1908" publication-number="202618908">
    <tif-files tif-type="multi-tif">
      <tif file="114131130.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618908</doc-number>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114131130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨方法及研磨裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/304</main-classification>
        <further-classification edition="201201120260128B">B24B37/013</further-classification>
        <further-classification edition="200601120260128B">B24B49/12</further-classification>
        <further-classification edition="200601120260128B">G01B11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下将毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之研磨方法，係在工件（W）的研磨過程中，藉由拍攝裝置（24）以預定的時間間隔生成工件（W）的表面內的第1區域之第1影像及第2區域之第2影像，並在工件（W）的研磨過程中測定工件（W）的表面上的測定點（MP）之膜厚，根據第1影像上的圖案的傾斜角度、第2影像上的圖案的傾斜角度以及上述預定的時間間隔算出單位時間內工件（W）的旋轉角度，並算出對於測定點（MP）的膜厚進行測定的測定時間與生成第2影像之拍攝時間的時間差，再根據測定點（MP）與工件（W）之中心點的相對位置、單位時間內工件（W）的旋轉角度以及時間差決定工件（W）的表面上的測定點之座標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:膜厚感測器</p>
        <p type="p">24:拍攝裝置</p>
        <p type="p">CP:工件之中心</p>
        <p type="p">J:路徑</p>
        <p type="p">TP:研磨載台之中心</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1909" publication-number="202618930">
    <tif-files tif-type="multi-tif">
      <tif file="114131138.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131138</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>填充設置於反應室內之基板上之凹陷特徵的方法以及使用可流動層結構填充基板上之凹陷特徵的方法</chinese-title>
        <english-title>METHODS FOR FILLING RECESSED FEATURES ON A SUBSTRATE DISPOSED WITHIN A REACTION CHAMBER AND METHODS FOR FILLING RECESSED FEATURES ON THE SUBSTRATE WITH A FLOWABLE LAYER STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/316</main-classification>
        <further-classification edition="200601120260128B">C23C16/455</further-classification>
        <further-classification edition="200601120260128B">H01L21/324</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德里格斯　李奧納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUEZ, LEONARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾塞努　米哈埃拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALSEANU, MIHAELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種填充基板上之凹陷特徵的方法。所揭露之方法包括在該基板上沉積一可流動層結構及將該可流動層結構加熱至高於該可流動層結構之玻璃轉移溫度。沉積該可流動層結構之方法包括使用原子層沉積製程來沉積一基於氧化鋁之可流動層結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for filling a recessed feature on a substrate are disclosed. The methods disclosed include depositing a flowable layer structure on the substrate and heating the flowable layer structure above the glass transition temperature of the flowable layer structure. Methods for depositing the flowable layer structure include depositing an aluminum oxide based flowable layer structure employing atomic layer deposition processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102至106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1910" publication-number="202618824">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01H13/02</main-classification>
        <further-classification edition="200601120260102B">H01H13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＩＤＥＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川瀨祐輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉健廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長江哲彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAE, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石見崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的係簡略化裝卸結構，可圓滑且確實地進行分離動作。  &lt;br/&gt;本發明之外殼20之軸部20A係具有卡合溝21，由支撐部5可轉動地所支撐之環狀部4係具有卡合部40。卡合溝21，係具有：軸方向溝21a，係允許卡合部40之進入；第一傾斜面21b&lt;sub&gt;1&lt;/sub&gt;，係干涉卡合部40使環狀部4沿著周方向移動；周方向溝21c，係將卡合部40施力配置於鎖緊位置，藉此將環狀部4及支撐部5不可沿著軸方向移動地固定於外殼20。軸方向溝21a，亦發揮作為支撐部5之內周面51之突部52所卡合之凹部之功能。當卡合部40於鎖緊位置時，突部52卡合於軸方向溝21a，藉此使環狀部4及支撐部5不可沿著周方向移動地固定於外殼20。支撐部5，係具有：保持部7，係將環狀部4保持於卡合部40配置於周方向溝21c之後端之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:外殼</p>
        <p type="p">4:環狀部</p>
        <p type="p">4D:外周面</p>
        <p type="p">5:支撐部</p>
        <p type="p">7:保持部</p>
        <p type="p">73:板彈簧部(彈性部)</p>
        <p type="p">73a,41:卡止凸部(卡止部)</p>
      </representative-img>
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  <tw-patent-application no="1911" publication-number="202618125">
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          <doc-number>202618125</doc-number>
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        <document-id>
          <doc-number>114131242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>波力發電裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">F03B13/14</main-classification>
        <further-classification edition="200601120260131B">F03B13/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中村股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川富市</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, TOMIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狩野裕章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARINO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種創新的波力發電裝置，其係可藉由簡易手段提高發電效率，在小型化、量產性、成本等方面亦優異。&lt;br/&gt;  本發明係一種波力發電裝置，其係由以下所成：漂浮部2；葉輪部3，係藉由此漂浮部2的上下運動而在水中旋轉；發電部5，係藉由此葉輪部3的葉部6的旋轉而發電；並且前述波力發電裝置，係以下構成：以靜止狀態具備容體部8，前述容體部8係收容與漂浮部2一起上下運動之葉部6；此葉部6係與漂浮部2的上下運動連動並靠近容體部8內的周壁部9上下運動，藉此承受此容體部8內的水而旋轉並效率良好地發電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水面</p>
        <p type="p">2:漂浮部</p>
        <p type="p">3:葉輪部</p>
        <p type="p">4:旋轉軸</p>
        <p type="p">5:發電部</p>
        <p type="p">6:葉部</p>
        <p type="p">7:發電用旋轉部</p>
        <p type="p">8:容體部</p>
        <p type="p">9:周壁部</p>
        <p type="p">10:安裝部</p>
        <p type="p">13:漂浮部導引機構</p>
        <p type="p">14:葉輪部導引機構</p>
        <p type="p">15:中心導引軸</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1912" publication-number="202618366">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618366</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學麵包板及相關結構</chinese-title>
        <english-title>OPTICAL BREADBOARD AND RELATED STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260130B">G02B7/00</main-classification>
        <further-classification edition="200601120260130B">G02B27/32</further-classification>
        <further-classification edition="200601120260130B">G02B27/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商新港公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWPORT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　阿爾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾森　小盧修斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILSON, LUCIOUS, JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示光學麵包板的實施例。在一實施例中，光學麵包板包含第一薄片、第二薄片及核心，所述核心定位於所述第一薄片與所述第二薄片之間並且接合至所述第一薄片和所述第二薄片。所述核心包括複數個縱向構件，其沿長度接合在一起。所述縱向構件之各者具有包含複數個肋部的內部結構，其中每個肋部具有第一縱向肋部部分和第二縱向肋部部分，其中所述第二縱向肋部部分經設計以具有於其中形成的複數個螺紋孔洞，使得所述螺紋孔洞排列為二維網格。所述縱向構件可由擠製材料（例如鋁）形成。所述第一薄片包含複數個通道，其經設計以容許一個或多個固定件插入所述核心中的所述螺紋孔洞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of an optical breadboard are disclosed. In one embodiment, the optical breadboard includes first sheet, a second sheet, and a core positioned between and bonded to the first sheet and the second sheet. The core includes a plurality of longitudinal members bonded together along their lengths. Each of the longitudinal members have an interior structure including a plurality of ribs, wherein each rib has a first longitudinal rib portion and a second longitudinal rib portion, wherein the second longitudinal rib portion is sized to have a plurality of threaded holes formed therein, so that the threaded holes are arranged in a two-dimensional grid. The longitudinal members may be formed from an extruded material, such as aluminum. The first sheet includes a plurality of passages sized to allow one or more fasteners to be inserted into the threaded holes in the core.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學麵包板組件、麵包板</p>
        <p type="p">100:第一薄片、頂部薄片</p>
        <p type="p">104:周邊</p>
        <p type="p">110:二維網格</p>
        <p type="p">200:第二薄片、底部薄片</p>
        <p type="p">202:頂表面</p>
        <p type="p">300:核心</p>
        <p type="p">305:二維網格</p>
        <p type="p">600:端構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1913" publication-number="202617509">
    <tif-files tif-type="multi-tif">
      <tif file="114131325.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131325</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>操作桿</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250911B">B62L3/02</main-classification>
        <further-classification edition="200601120250911B">G05G1/04</further-classification>
        <further-classification edition="200601120250911B">G05G5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商安斯泰莫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTEMO, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上原和真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHARA, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種操作桿，其可提升調節構件之操作性，並可良好地調整抓握量。  &lt;br/&gt;本發明之解決手段為，將被設置成可經由轉動軸13而轉動之操作桿5，分割成桿本體21與敲擊器22，而在桿本體21與敲擊器22之間配置調整抓握量之調節螺栓23。藉由被設置在遠離手把側之第1連接部21c、及被設置在轉動軸13之軸向的兩端側之一對第2連接部21d,21d而將桿本體21的操作部21b與分岔腕21e之間加以連接。於第1連接部21c與一對第2連接部21d,21d之間，設置有供調節螺栓23露出之開口部24,24。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:液壓主缸裝置</p>
        <p type="p">2:手把</p>
        <p type="p">3:握柄</p>
        <p type="p">4:液壓主缸</p>
        <p type="p">4a:缸身</p>
        <p type="p">4b:車體安裝腕</p>
        <p type="p">4d:分岔狀支架</p>
        <p type="p">5:操作桿</p>
        <p type="p">7:支架</p>
        <p type="p">12:儲液槽</p>
        <p type="p">13:轉動軸</p>
        <p type="p">21:桿本體</p>
        <p type="p">21a:轉動基部</p>
        <p type="p">21b:操作部</p>
        <p type="p">21c:第1連接部</p>
        <p type="p">21d:第2連接部</p>
        <p type="p">21e:分岔腕</p>
        <p type="p">22:敲擊器</p>
        <p type="p">22c:轉動限制片</p>
        <p type="p">23:調節螺栓</p>
        <p type="p">23b:轉盤操作部</p>
        <p type="p">24:開口部</p>
        <p type="p">25:段差部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1914" publication-number="202618892">
    <tif-files tif-type="multi-tif">
      <tif file="114131375.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調整的接地與偏壓面積</chinese-title>
        <english-title>ADJUSTABLE GROUNDING AND BIASING AREA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/203</main-classification>
        <further-classification edition="200601120260128B">C23C14/34</further-classification>
        <further-classification edition="200601120260128B">C23C14/54</further-classification>
        <further-classification edition="200601120260128B">H05H1/03</further-classification>
        <further-classification edition="200601120260128B">H01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘俊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, JUNJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　祥金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, XIANGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡雪菲　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHEFI, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例描述了一種裝置，該裝置包括具有接地腔室屏蔽件的處理腔室，該接地腔室屏蔽件至少部分地界定了處理區域。電極設置於該處理腔室的該處理區域內。該電極包括穿過電極延伸的孔隙，並且該電極設置於濺射靶材與基板之間。電壓源被配置為對該電極施加正DC偏壓。接地電極屏蔽件設置於該處理區域內，且從該電極延伸一定距離。該距離是可調的，以改變該電極的表面積與該接地電極屏蔽件的表面積的比率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure describe an apparatus that includes a processing chamber having a grounded chamber shield that at least partially defines a processing region. An electrode is disposed within the processing region of the processing chamber. The electrode includes apertures extending through the electrode and the electrode is disposed between a sputtering target and a substrate. A voltage source is configured to apply a positive DC bias to the electrode. A grounded electrode shield is disposed within the processing region and extends a distance from the electrode. The distance is adjustable to vary a ratio of a surface area of the electrode to a surface area of the grounded electrode shield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201':組件</p>
        <p type="p">201'-1:頂部側</p>
        <p type="p">201'-2:底部側</p>
        <p type="p">201'A:電極</p>
        <p type="p">204:上部部分</p>
        <p type="p">207:接地元件</p>
        <p type="p">224:離子通量</p>
        <p type="p">230:接地電極屏蔽件</p>
        <p type="p">230-1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1915" publication-number="202617574">
    <tif-files tif-type="multi-tif">
      <tif file="114131406.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131406</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高架搬運車系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B66C7/12</main-classification>
        <further-classification edition="200601120251201B">B66C7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤秀憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">高架搬運車系統是具備：搬運車可行走的第一檢查用軌道；搬運車可行走的第二檢查用軌道，至少一部分在俯視中與第一檢查用軌道相重疊，並且被設置於與第一檢查用軌道為不同的高度位置；以及昇降機，使搬運車在第一檢查用軌道與第二檢查用軌道之間移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高架搬運車系統</p>
        <p type="p">2:檢查塔</p>
        <p type="p">4:行走用軌道</p>
        <p type="p">4B:退避部</p>
        <p type="p">6:搬運車</p>
        <p type="p">60:高處檢查用軌道(第一檢查用軌道)</p>
        <p type="p">70:低處檢查用軌道(第二檢查用軌道)</p>
        <p type="p">71:入線用軌道</p>
        <p type="p">72:離線用軌道</p>
        <p type="p">80:中段檢查用軌道(第三檢查用軌道)</p>
        <p type="p">81:繞行用軌道</p>
        <p type="p">90:昇降機</p>
        <p type="p">90A:第一昇降機</p>
        <p type="p">90B:第二昇降機</p>
        <p type="p">91:昇降軌道</p>
        <p type="p">92:導柱</p>
        <p type="p">C:搬運推車</p>
        <p type="p">F:地板面</p>
        <p type="p">IA:檢查區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1916" publication-number="202619209">
    <tif-files tif-type="multi-tif">
      <tif file="114131458.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>次190奈米之深紫外光雷射光束產生技術</chinese-title>
        <english-title>SUB-190 NANOMETER DEEP-ULTRAVIOLET LASER BEAM GENERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01S3/109</main-classification>
        <further-classification edition="200601120260128B">G02F1/355</further-classification>
        <further-classification edition="200601120260128B">H01S3/23</further-classification>
        <further-classification edition="200601120260128B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科希倫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHERENT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍森　諾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODGSON, NORMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史克萊普西克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCRIPSICK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以生成次190奈米雷射光束之雷射設備係包括用以生成一初始深紫外光雷射光束之一深紫外光固態雷射源、用以生成至少一個別中紅外線雷射光束之至少一中紅外線固態雷射源、以及用以經由和頻生成從該初始深紫外光及中紅外線雷射光束產生一輸出深紫外光雷射光束之至少一個三硼酸鋰晶體。每一中紅外線固態雷射源包括(a)一鈥、銩或鉻摻雜增益晶體或增益纖維，或者(b)一光學泵激式半導體增益材料，以生成該個別中紅外線雷射光束。雷射設備可組配來供連續波及脈衝操作，因此提供多方面解決方案給需要低於190奈米之DUV雷射輻射之應用。有利地，本方案依賴於三硼酸鋰。三硼酸鋰晶體可隨工業應用所需要的品質及尺寸來成長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laser apparatus for generating a sub-190 nanometer laser beam includes a deep-ultraviolet solid-state laser source to generate an initial deep-ultraviolet laser beam, at least one mid-infrared solid-state laser source to generate at least one respective mid-infrared laser beam, and at least one lithium triborate crystal to generate an output deep-ultraviolet laser beam from the initial deep-ultraviolet and mid-infrared laser beams via sum-frequency generation. Each mid-infrared solid-state laser source includes (a) a holmium-, thulium-, or chromium-doped gain crystal or gain fiber or (b) an optically-pumped semiconductor gain material to generate the respective mid-infrared laser beam. The laser apparatus may be configured for continuous-wave and pulsed operation, thus offering versatile solutions for applications requiring DUV laser radiation below 190 nanometers. Advantageously, the present approach relies on lithium triborate. Lithium triborate crystals can be grown with the quality and dimensions needed for industrial applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雷射設備，設備</p>
        <p type="p">110:DUV雷射源，DUV源</p>
        <p type="p">120:中IR雷射源，中IR源</p>
        <p type="p">122:固態增益介質，增益介質</p>
        <p type="p">124:光學活性離子</p>
        <p type="p">130:系列LBO晶體，LBO晶體</p>
        <p type="p">170:初始DUV雷射光束，初始DUV光束</p>
        <p type="p">180:中IR雷射光束，中IR光束</p>
        <p type="p">190:次190nmDUV輸出雷射光束，DUV輸出光束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1917" publication-number="202618978">
    <tif-files tif-type="multi-tif">
      <tif file="114131475.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131475</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/67</main-classification>
        <further-classification edition="200601120260128B">B32B37/12</further-classification>
        <further-classification edition="200601120260128B">G01B11/00</further-classification>
        <further-classification edition="200601120260128B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯野克宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IINO, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可縮小接合系統之佔地面積的技術。  &lt;br/&gt;依本發明之一態樣的接合系統包含：對第一基板及第二基板進行指定之處理的處理站；及將第一基板、第二基板，及將第一基板及第二基板接合而形成的疊合基板對處理站搬入搬出的搬入搬出站。處理站包含：進行第一基板、第二基板及疊合基板之搬運的搬運裝置；在搬入搬出站與搬運裝置之間進行第一基板、第二基板及疊合基板之傳遞的傳遞部；對第一基板塗布黏接劑的塗布裝置；將塗布有黏接劑的第一基板，及第二基板進行接合而形成疊合基板的接合裝置；及將第一基板、第二基板及疊合基板進行熱處理的熱處理裝置。又，熱處理裝置與接合裝置係疊設配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:接合系統</p>
        <p type="p">3:處理站</p>
        <p type="p">33:第二檢查部</p>
        <p type="p">41:熱處理裝置</p>
        <p type="p">42:接合裝置</p>
        <p type="p">51:塗布裝置</p>
        <p type="p">52:排液裝置</p>
        <p type="p">60:第二搬運區域(搬運區域之一例)</p>
        <p type="p">60a:第一面</p>
        <p type="p">60b:第二面</p>
        <p type="p">61:第二搬運裝置(搬運裝置之一例)</p>
        <p type="p">86:周緣部檢查裝置</p>
        <p type="p">95:實用程序區域</p>
        <p type="p">G1:第一處理區塊</p>
        <p type="p">G2:第二處理區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1918" publication-number="202618481">
    <tif-files tif-type="multi-tif">
      <tif file="114131481.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦實現的方法及其用途、電腦系統及電腦程式產品</chinese-title>
        <english-title>COMPUTER-IMPLEMENTED METHOD AND USE THEREOF, COMPUTER SYSTEM AND COMPUTER PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">G05B19/42</main-classification>
        <further-classification edition="200601120260122B">G05B19/04</further-classification>
        <further-classification edition="202001120260122B">G06F30/27</further-classification>
        <further-classification edition="200601120260122B">F27D19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商保羅伍斯義大利股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUL WURTH ITALIA S. P. A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維琴蒂尼　阿爾貝托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VICENTINI, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">時變氣流參數（{P}|3）被應用於適配為加工煤餅（113）的至少一個搗固焦爐（103）的排放管道系統（143、143’、183）的集氣主管（183）中的壓力控制設備（163）。參數（{P}|3）是由電腦（203）藉由預先訓練的神經網路（253）提供的參數值序列（503）。電腦（203）接收輸入參數（{X}|3）的集合（303），具有模態參數集合（{X0}），其表示煤餅（113）插入搗固焦爐（103）的裝料模態；以及煤餅特性參數集合（{X1}），表示煤餅（113）在插入之前的特性。神經網路（253）已經用來自參考操作的輸入參數的歷史數據集合和時變氣流參數的歷史序列做為真值進行了訓練。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A time-variant gas-flow parameter ({P}|3) is applied to a pressure-control device (163) in a gas-collecting main (183) of an offtake piping system (143, 143', 183) of at least one stamp-charging coke-oven (103) that is adapted to process a coal-cake (113). The parameter ({P}|3) is a parameter value sequence (503) that is provided by a computer (203) with a pre-trained neural network (253). The computer (203) receives a set (303) of input parameters ({X}|3), with a modality parameter set ({X0}) that represents a charging modality by that the coal-cake (113) is to be inserted into the stamp-charging coke-oven (103), and a coal-cake property parameter set ({X1}) that represents a property of the coal-cake (113) before insertion. The neural network (253) has been trained with historical data-sets of input parameters from reference operations and with historical sequences of time-variant gas-flow parameters as the ground-truth.</p>
      </isu-abst>
      <representative-img>
        <p type="p">103、103’:搗固焦爐</p>
        <p type="p">113:將由焦爐處理的煤餅(即，在操作中)</p>
        <p type="p">133:O2感測器</p>
        <p type="p">143、143’:管道</p>
        <p type="p">163:控制設備</p>
        <p type="p">183:排放管道系統中的集氣主管GCM，在閥之前的上游，在壓力控制設備之後的下游</p>
        <p type="p">193:操作者</p>
        <p type="p">203:電腦(具有網路)、執行方法的電腦</p>
        <p type="p">253:神經網路(在操作中)</p>
        <p type="p">283:測試單元</p>
        <p type="p">303:實際輸入參數集合，用於操作</p>
        <p type="p">503:待辨識的特定序列，用於操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1919" publication-number="202617568">
    <tif-files tif-type="multi-tif">
      <tif file="114131487.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙張處理裝置及搬運中繼構件</chinese-title>
        <english-title>PAPER SHEET PROCESSING DEVICE AND TRANSPORT RELAY COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250906B">B65H5/02</main-classification>
        <further-classification edition="200601120250906B">G07D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新谷直也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTANI, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠容易地盡可能將在搬運中繼部阻塞的紙張取出之紙張處理裝置。本發明有關的紙張處理裝置1為具備：具有連通口FW1之箱體100、配置於箱體之外部的輸入輸出處理部200、配置於箱體之內部的收納部700、從輸入輸出處理部之內部起通過連通口延伸到收納部之內部的搬運路；嵌入於連通口、用以中繼輸入輸出處理部之側的搬運路及收納部之側的搬運路間之紙張的搬運、且由2個以上之構件所構成的搬運中繼構件800；搬運路為通過搬運中繼構件之內側，2個以上的構件中之一部分的構件801為固定於連通口之內部，2個以上的構件中之其他的構件802為能夠自由裝卸地裝設於一部分的構件，當其他的構件為從一部分的構件被卸下之時則露出搬運路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a paper sheet processing device that can remove paper sheets jammed in a transport relay section as easily as possible. The paper sheet processing device 1 according to the present invention comprises: a box 100 having a communication port FW1, an input/output processing section 200 arranged outside the box, a storage section 700 arranged inside the box, a transport path extending from the inside of the input/output processing section through the communication port to the inside of the storage section; a transport relay component 800 that is fitted into the communication port, relaying the transport of paper sheets between the transport path on the input/output processing section side and the transport path on the storage section side, and comprising two or more components; wherein the transport path passes through the inside of the transport relay component, a part 801 of the two or more components are fixed inside the communication port, and another part 802 of the two or more components can be detachably attached to the part of the components, and when the other part is detached from the part of the components, the transport path is exposed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:中繼構件(搬運中繼部)</p>
        <p type="p">801:第1中繼構件</p>
        <p type="p">802:第2中繼構件</p>
        <p type="p">MA:本體部</p>
        <p type="p">MA1:基體部</p>
        <p type="p">MA2:左側壁部</p>
        <p type="p">MA3:左側突起部</p>
        <p type="p">MA4:右側壁部</p>
        <p type="p">MC:光學感測器(發光部、受光部)</p>
        <p type="p">NA1a:開口</p>
        <p type="p">NA1b:右側溝</p>
        <p type="p">NA2:突起部</p>
        <p type="p">NA3:左側卡止部(卡止部)</p>
        <p type="p">NA4:右側突起部</p>
        <p type="p">NA5:右側卡止部(卡止部)</p>
        <p type="p">NB:輥</p>
        <p type="p">NC:反射構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1920" publication-number="202617571">
    <tif-files tif-type="multi-tif">
      <tif file="114131488.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙張處理裝置</chinese-title>
        <english-title>PAPER SHEET PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">B65H29/51</main-classification>
        <further-classification edition="200601120251130B">B65H33/06</further-classification>
        <further-classification edition="200601120251130B">B65H5/28</further-classification>
        <further-classification edition="200601120251130B">G07D9/00</further-classification>
        <further-classification edition="201901120251130B">G07D11/16</further-classification>
        <further-classification edition="200601120251130B">G07D13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新谷直也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTANI, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種紙張處理裝置，其為能夠盡可能有效率地進行收納部之取出裝入。本發明有關的紙張處理裝置1具備：具有在第1側開口之本體部101、能夠開關前述本體部之開口的門部102、設置於前述本體部之內部的嵌合部RE1、RE2、及連通口FW1之箱體100；配置於前述本體部之外部的輸入輸出處理部200；具有能夠自由裝卸地嵌合於前述嵌合部的被嵌合部RO1、RO2之收納部700；以及從前述輸入輸出處理部之內部起通過前述連通口延伸到前述收納部之內部的搬運路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a paper sheet processing device capable of loading and unloading a storage section as efficiently as possible. The paper sheet processing device 1 of the present invention comprises a main body portion 101 opening to a first side, a door portion 102 capable of opening and closing the opening of the main body portion, a box 100 having engaging portions RE1, RE2 provided inside the main body portion and a communication port FW1, an input/output processing portion 200 arranged outside the main body portion, a storage portion 700 having engaged portions RO1, RO2 that can be detachably engaged with the engaging portion, and a transport path extending from the inside of the input/output processing portion through the communication portion to the inside of the storage portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紙張處理裝置</p>
        <p type="p">100:框體</p>
        <p type="p">101:本體部</p>
        <p type="p">102:前門</p>
        <p type="p">200:輸入輸出處理裝置</p>
        <p type="p">201:出入口</p>
        <p type="p">300:外部支撐構件</p>
        <p type="p">400:內部支撐構件</p>
        <p type="p">402:側壁部</p>
        <p type="p">402a:第1載置部</p>
        <p type="p">402b:第2載置部</p>
        <p type="p">403:突起部</p>
        <p type="p">403a:本體部</p>
        <p type="p">500:框架</p>
        <p type="p">700:回收箱</p>
        <p type="p">801:第1中繼構件</p>
        <p type="p">FW:中間壁部</p>
        <p type="p">RE1:第1凹部</p>
        <p type="p">RE2:第2凹部</p>
        <p type="p">SB:金庫</p>
        <p type="p">RO1:第1棒部</p>
        <p type="p">RO2:第2棒部</p>
        <p type="p">AW:頂壁部</p>
        <p type="p">BW:底壁部</p>
        <p type="p">CW:後壁部</p>
        <p type="p">DW:左壁部</p>
        <p type="p">FR:本體部</p>
        <p type="p">FR1:底壁部</p>
        <p type="p">FR2:後壁部</p>
        <p type="p">FR4:右壁部</p>
        <p type="p">CP:第2中繼連接器</p>
        <p type="p">CS:連接器支撐構件</p>
        <p type="p">OS:第1外部支撐構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1921" publication-number="202617472">
    <tif-files tif-type="multi-tif">
      <tif file="114131511.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於兒童汽車安全座椅之可移動底座</chinese-title>
        <english-title>MOVABLE BASE FOR CHILD CAR SEAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B60N2/28</main-classification>
        <further-classification edition="200601120260130B">B60N2/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞繆爾　吉爾哈特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMUEL, GEARHART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科林Ｆ　埃格特　克羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLIN F, EGGERT-CROWE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾Ｓ　梅森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYLE S, MASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納撒尼爾Ｗ　基伯勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATHANIEL W, KEEBLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪斯Ｋ　克萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS K, KLINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在一車輛中使用之兒童約束系統包括可安裝至一車輛座椅上之一支撐底座。該支撐底座包括一第一底座部分及一第二底座部分，該第一底座部分可相對於該第二底座部分旋轉。一兒童安全座椅以可拆卸方式連接至該第一底座部分。該第一底座部分之旋轉由該第一底座部分之該旋轉期間兩個樞軸點的一平移限定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A child restraint system for use in a vehicle includes a support base mountable to a vehicle seat. The support base includes a first base portion and a second base portion, the first base portion being rotatable relative to the second base portion. A child seat is removably connected to the first base portion. Rotation of the first base portion is defined by a translation of two pivot points during the rotation of the first base portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">32:底座靠背部分</p>
        <p type="p">34:前端</p>
        <p type="p">38:相對橫向側/橫向邊緣</p>
        <p type="p">39:相對橫向側/橫向邊緣</p>
        <p type="p">50:第一底座部分</p>
        <p type="p">52:第二底座部分</p>
        <p type="p">55:前端</p>
        <p type="p">56:上部表面</p>
        <p type="p">57:後端</p>
        <p type="p">58:相對橫向側</p>
        <p type="p">59:相對橫向側</p>
        <p type="p">62a:第一定位元件</p>
        <p type="p">62b:第二定位元件</p>
        <p type="p">64a:第一定位槽</p>
        <p type="p">64b:第二定位槽</p>
        <p type="p">64b1:第一部分</p>
        <p type="p">64b2:第二部分</p>
        <p type="p">C1b:中心線</p>
        <p type="p">C1u:中心線</p>
        <p type="p">L1b:中心縱向軸線</p>
        <p type="p">L1u:中心縱向軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1922" publication-number="202617963">
    <tif-files tif-type="multi-tif">
      <tif file="114131521.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發酵啤酒風味飲料及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251205B">C12C5/02</main-classification>
        <further-classification edition="200601120251205B">C12C12/04</further-classification>
        <further-classification edition="201901120251205B">C12G3/04</further-classification>
        <further-classification edition="200601120251205B">C12G3/06</further-classification>
        <further-classification edition="200601120251205B">C12G3/08</further-classification>
        <further-classification edition="200601120251205B">A23L2/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日集團控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI GROUP HOLDINGS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日啤酒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI BREWERIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金沢孟紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAZAWA, TAKENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發酵啤酒風味飲料、及上述發酵啤酒風味飲料之製造方法，該發酵啤酒風味飲料之外觀發酵度為100.0%以上，於將脯胺酸濃度(mg/100 mL)相對於原麥芽汁萃取物(%Plato)之比之值設為X，將乙酸乙酯濃度(mg/L)之值設為Y之情形時，X為1.5以上，Y/X為4.0以上7.0以下，上述發酵啤酒風味飲料之製造方法包括：釀造步驟，其係對包含麥芽及水之混合物進行糖化處理，對所獲得之糖化液進行煮沸處理而製備發酵原料液；以及發酵步驟，其係於所獲得之發酵原料液中接種酵母來進行發酵；於發酵步驟後不包括添加或去除乙醇或有助於萃取物量之成分(但是，水除外)之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1923" publication-number="202617033">
    <tif-files tif-type="multi-tif">
      <tif file="114131627.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清掃機器人工作站</chinese-title>
        <english-title>ROBOT CLEANER STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
        <further-classification edition="200601120260130B">A47L9/28</further-classification>
        <further-classification edition="200601120260130B">D06F29/00</further-classification>
        <further-classification edition="200601120260130B">F26B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高武鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, MOOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹南一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, NAMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪禎順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JUNGSOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種清掃機器人工作站，該清掃機器人工作站需要：集塵袋，用於收集清掃機器人的集塵盒內的灰塵；以及連接集塵馬達的複數條流動路徑，並且該清掃機器人工作站可藉由在上下方向上堆疊該複數條流動路徑來最大化空間利用效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a robot cleaner station, and the robot cleaner station needs a dust bag for sucking in a dustbin of a robot cleaner, and a plurality of flow paths connecting a dust collecting motor, and the robot cleaner station may maximize spatial efficiency by stacking the plurality of flow paths in upward and downward directions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:清掃機系統</p>
        <p type="p">110:殼體</p>
        <p type="p">120:基座部</p>
        <p type="p">140:集塵部件</p>
        <p type="p">145:集塵馬達</p>
        <p type="p">147:第一集塵流動路徑、集塵流動路徑</p>
        <p type="p">148:第二集塵流動路徑、集塵流動路徑</p>
        <p type="p">160:拖布清洗部件</p>
        <p type="p">170:拖布乾燥部件</p>
        <p type="p">200:清掃機器人</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1924" publication-number="202617456">
    <tif-files tif-type="multi-tif">
      <tif file="114131641.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>修改懸架控制系統的操作方面</chinese-title>
        <english-title>MODIFYING OPERATIONAL ASPECTS OF A SUSPENSION CONTROL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">B60G17/016</main-classification>
        <further-classification edition="201801120260128B">G06F9/44</further-classification>
        <further-classification edition="200601120260128B">B62J1/08</further-classification>
        <further-classification edition="200601120260128B">B62K25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商福克斯制造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃里克森　埃弗里特　歐文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERICKSEN, EVERET OWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波洛克　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLLOCK, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德斯利　阿里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDSLEY, ARIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧特尼斯　克里斯托弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTTERNESS, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得森　埃文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERSON, EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑爾　埃文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER, EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁克爾斯　扎卡里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHAELS, ZACHARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗拉古利亞　邁克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAGUGLIA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科普倫　喬舒亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COAPLEN, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於修改懸架控制系統的操作方面的系統和方法。該方法接收修改請求並訪問交通工具的一個或更多個電子部件的控制系統。基於所述請求來修改電子部件中的一個或更多個電子部件的原始操作方面。當接收到返回請求時，將電子部件中的一個或更多個電子部件的經修改的操作方面返回至其原始操作方面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for modifying operational aspects of a suspension control system. The method receives a modification request and accesses a control system of one or more electronic components of a vehicle. The original operational aspect of one or more of the electronic components is modified based on the request. When a return request is received, the modified operational aspect of the one or more of the electronic components is returned back to its original operational aspect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:底部支架軸線</p>
        <p type="p">12:樞轉點</p>
        <p type="p">13:前鏈輪組件</p>
        <p type="p">14:軸</p>
        <p type="p">15:後軸</p>
        <p type="p">17:鏈條張緊裝置</p>
        <p type="p">18:後鏈輪</p>
        <p type="p">19:鏈條</p>
        <p type="p">205:用戶介面</p>
        <p type="p">24:主框架</p>
        <p type="p">26:擺臂</p>
        <p type="p">28:前輪</p>
        <p type="p">30:後輪</p>
        <p type="p">32:座</p>
        <p type="p">33:升降座桿</p>
        <p type="p">34:叉</p>
        <p type="p">35f,35r:感測器</p>
        <p type="p">36:把手</p>
        <p type="p">37:前減震組件</p>
        <p type="p">38:後減震組件</p>
        <p type="p">39:控制器</p>
        <p type="p">50:自行車</p>
        <p type="p">60:轉向管</p>
        <p type="p">65:電源</p>
        <p type="p">83:座管</p>
        <p type="p">93:開關</p>
        <p type="p">95:移動裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1925" publication-number="202618132">
    <tif-files tif-type="multi-tif">
      <tif file="114131703.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣流產生裝置及其方法</chinese-title>
        <english-title>AIRFLOW GENERATING DEVICE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">F04B43/04</main-classification>
        <further-classification edition="200601120260128B">F04B45/04</further-classification>
        <further-classification edition="200601120260128B">B81B3/00</further-classification>
        <further-classification edition="200601120260128B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商知微電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XMEMS LABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任頡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, JYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣流產生裝置包括設置於一第一區域的一第一單元以及設置於一第二區域的一第二單元。第一單元在第一區域產生具有一第一極性的一第一空氣壓力，第二單元在第二區域產生具有一第二極性的一第二空氣壓力。第二極性與第一極性相反。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An airflow generating device includes a first cell and a second cell. The first cell is disposed within a first region and generates a first air pressure with a first polarity. The second cell is disposed within a second region and generates a second air pressure with a second polarity. The second polarity is opposite to the first polarity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氣流產生裝置</p>
        <p type="p">10p,20p:瓣片對</p>
        <p type="p">12:開口</p>
        <p type="p">140:蓋體結構</p>
        <p type="p">Rg1,Rg2:區域</p>
        <p type="p">AF&lt;sub&gt;1&lt;/sub&gt;,AF&lt;sub&gt;2&lt;/sub&gt;,AF&lt;sub&gt;3&lt;/sub&gt;,AF&lt;sub&gt;4&lt;/sub&gt;:氣流</p>
        <p type="p">P+,P-:空氣壓力</p>
        <p type="p">t&lt;sub&gt;1&lt;/sub&gt;,t&lt;sub&gt;2&lt;/sub&gt;,t&lt;sub&gt;3&lt;/sub&gt;,t&lt;sub&gt;4&lt;/sub&gt;:時點</p>
        <p type="p">X,Z:座標方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1926" publication-number="202618318">
    <tif-files tif-type="multi-tif">
      <tif file="114131764.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號接收裝置、方法、類比至數位混合測試板卡和測試機</chinese-title>
        <english-title>SIGNAL RECEIVING APPARATUS AND METHOD, ANALOG-TO-DIGITAL MIXED TEST BOARD, AND TEST MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G01R31/28</main-classification>
        <further-classification edition="200601120250901B">G06F11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州長川科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU CHANGCHUAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘鋒浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, FENG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧成龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, CHENG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金胚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIN-PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武文睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種訊號接收裝置、方法、類比至數位混合測試板卡和測試機，訊號接收裝置包括主測試單元和子測試單元，子測試單元中，外部時脈晶片輸出固定頻率的取樣時脈至類比至數位轉換裝置，數位波形採集器接收類比至數位轉換裝置根據取樣時脈輸出的固定頻率的原始波形，對原始波形進行重取樣處理，產生所需的任意頻率的重構波形並發送至第一通訊模組。主測試單元中，透過第二通訊模組接收重構波形並發送至波形接收模組，波形接收模組將接收的重構波形存入儲存模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal receiving apparatus and method, an analog-to-digital mixed test board, and a test machine are provided. The signal receiving apparatus includes a main test unit and a sub-test unit. In the sub-test unit, an external clock chip is configured to output a sampling clock at a fixed frequency to an analog-to-digital conversion apparatus, and a digital waveform collector is configured to receive an original waveform at a fixed frequency output by an analog-to-digital conversion apparatus according to the sampling clock, perform resampling processing on the original waveform, generate a reconstructed waveform at any required frequency, and transmit the reconstructed waveform to a first communication module. In the main test unit, the reconstructed waveform is received by a second communication module and sent to a waveform receiving module, and the waveform receiving module is configured to store the received reconstructed waveform into a storage module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:子測試單元</p>
        <p type="p">110:數位波形採集器</p>
        <p type="p">120:第一通訊模組</p>
        <p type="p">130:外部時脈晶片</p>
        <p type="p">140:類比至數位轉換裝置</p>
        <p type="p">200:主測試單元</p>
        <p type="p">210:第二通訊模組</p>
        <p type="p">220:波形接收模組</p>
        <p type="p">230:儲存模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1927" publication-number="202617689">
    <tif-files tif-type="multi-tif">
      <tif file="114131804.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131804</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法、聚合物及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">C07C309/12</main-classification>
        <further-classification edition="200601120250901B">C07C309/17</further-classification>
        <further-classification edition="200601120250901B">C07C381/12</further-classification>
        <further-classification edition="200601120250901B">C07D307/33</further-classification>
        <further-classification edition="200601120250901B">C07D307/77</further-classification>
        <further-classification edition="200601120250901B">C07D317/70</further-classification>
        <further-classification edition="200601120250901B">C07D327/06</further-classification>
        <further-classification edition="200601120250901B">C07D333/76</further-classification>
        <further-classification edition="200601120250901B">C07D409/12</further-classification>
        <further-classification edition="200601120250901B">C08F212/14</further-classification>
        <further-classification edition="200601120250901B">C08F220/38</further-classification>
        <further-classification edition="200601120250901B">G03F7/004</further-classification>
        <further-classification edition="200601120250901B">G03F7/039</further-classification>
        <further-classification edition="200601120250901B">G03F7/20</further-classification>
        <further-classification edition="200601120250901B">G03F7/32</further-classification>
        <further-classification edition="200601120250901B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, NOZOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於圖案形成時感度或CDU、LWR、MEEF、顯影缺陷抑制性、圖案矩形性優異的感放射線性組成物、圖案形成方法、聚合物及化合物。一種感放射線性組成物，含有：包含源自下述式（1）所表示的化合物的結構單元（I）的聚合物、及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="232px" width="326px" file="ed10068.JPG" alt="ed10068.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（1）中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1～40的一價有機基；其中，於A&lt;sup&gt;-&lt;/sup&gt;為-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;的情況下，R&lt;sup&gt;1&lt;/sup&gt;為包含環狀結構的碳數3～40的一價有機基；A&lt;sup&gt;-&lt;/sup&gt;為-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、-COO&lt;sup&gt;-&lt;/sup&gt;或-N&lt;sup&gt;-&lt;/sup&gt;-SO&lt;sub&gt;2&lt;/sub&gt;-R&lt;sup&gt;X&lt;/sup&gt;；R&lt;sup&gt;X&lt;/sup&gt;為碳數1～20的一價有機基；R&lt;sup&gt;2&lt;/sup&gt;為氫原子或碳數1～20的一價有機基；R&lt;sup&gt;3&lt;/sup&gt;為羥基或碳數1～20的一價有機基；其中，R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;6&lt;/sup&gt;的任意一個具有一個聚合性基）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1928" publication-number="202617435">
    <tif-files tif-type="multi-tif">
      <tif file="114131856.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>疊層體、疊層體之製造方法及圖案形成方法</chinese-title>
        <english-title>LAMINATE, PROCESS FOR MANUFACTURING LAMINATE, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B32B27/18</main-classification>
        <further-classification edition="200601120260202B">B32B27/28</further-classification>
        <further-classification edition="200601120260202B">B32B27/30</further-classification>
        <further-classification edition="200601120260202B">C07C69/63</further-classification>
        <further-classification edition="200601120260202B">C08G77/14</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/075</further-classification>
        <further-classification edition="200601120260202B">G03F7/09</further-classification>
        <further-classification edition="200601120260202B">G03F7/11</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三井亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，兼顧高感度及高解析度且可形成微細圖案之疊層體，如此的疊層體之製造法及如此的圖案形成方法。&lt;br/&gt;  該課題之解決手段為一種疊層體，其特徵為按順序具備：&lt;br/&gt;  基板，&lt;br/&gt;  含矽之阻劑下層膜，係得自含有熱交聯性聚矽氧烷之含矽之阻劑下層膜組成物，該熱交聯性聚矽氧烷含有下述通式(1)~(3)表示之重複單元中之任一種以上、及下述通式(4)~(6)表示之重複單元中之任一種以上，及&lt;br/&gt;  阻劑膜，係得自阻劑組成物，該阻劑組成物含有選自下式(7)表示之超原子價碘化合物、下式(8)表示之超原子價碘化合物、下式(9)表示之超原子價碘化合物中之至少1種超原子價碘化合物、含羧基之化合物、及溶劑。&lt;br/&gt;&lt;img align="absmiddle" height="747px" width="659px" file="ed10115.JPG" alt="ed10115.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a laminate including a substrate, a silicon-containing resist underlayer film obtained from a silicon-containing resist underlayer film composition that contains a thermally crosslinkable polysiloxane containing any one or more from repeating units represented by the following general formulae (1) to (3) and any one or more from repeating units represented by the following general formulae (4) to (6), and a resist film obtained from a resist composition that contains at least one hypervalent iodine compound selected from a hypervalent iodine compound represented by the following formula (7), a hypervalent iodine compound represented by the following formula (8) and a hypervalent iodine compound represented by the following formula (9), a carboxy group-containing compound, and a solvent, in the listed order. This can provide a laminate that can satisfy both high sensitivity and high resolvability and allow for formation of a fine pattern in photolithography with a high energy line, a process for manufacturing such a laminate, and such a patterning process.&lt;br/&gt;&lt;img align="absmiddle" height="486px" width="568px" file="ed10116.JPG" alt="ed10116.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1929" publication-number="202617620">
    <tif-files tif-type="multi-tif">
      <tif file="114131875.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃物品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C03C3/085</main-classification>
        <further-classification edition="200601120260129B">C30B9/12</further-classification>
        <further-classification edition="200601120260129B">C03B5/23</further-classification>
        <further-classification edition="200601120260129B">C03B17/06</further-classification>
        <further-classification edition="200601120260129B">C03B7/094</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十嵐仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGARASHI, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>広瀬元之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, MOTOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之玻璃物品之製造方法具有：在進行修理前，於較進行上述修理之部位上游側，使熔融玻璃之溫度自較相當於黏度1.0×10&lt;sup&gt;4&lt;/sup&gt; dPa・s之溫度高之溫度下降至較相當於黏度1.0×10&lt;sup&gt;4&lt;/sup&gt; dPa・s之溫度低之溫度。上述製造方法具有：在使上述熔融玻璃之溫度下降前，將熔融爐保持之上述熔融玻璃自第1玻璃變更為第2玻璃。上述第1玻璃於相當於黏度1.0×10&lt;sup&gt;4&lt;/sup&gt; dPa・s～1.0×10&lt;sup&gt;7&lt;/sup&gt; dPa・s之溫度區域內之結晶生長速度之最大值為50 μm/hr以上。上述第2玻璃於相當於黏度1.0×10&lt;sup&gt;4&lt;/sup&gt; dPa・s～1.0×10&lt;sup&gt;7&lt;/sup&gt; dPa・s之溫度區域內之結晶生長速度之最大值為40 μm/hr以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S206:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1930" publication-number="202617408">
    <tif-files tif-type="multi-tif">
      <tif file="114131889.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>2軸擠出機或2軸捏和機之傳動齒輪裝置、使用其之2軸擠出機及2軸捏和機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260123B">B29C48/40</main-classification>
        <further-classification edition="200601120260123B">F16H1/22</further-classification>
        <further-classification edition="200601120260123B">B29B7/38</further-classification>
        <further-classification edition="200601120260123B">F16H37/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科技新穎股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNOVEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤宏平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種可以在不變更2支螺旋軸的中心間的距離之情形下，傳輸更大的驅動力之傳動齒輪裝置。&lt;br/&gt;  [解決手段]一種傳動齒輪裝置，具備驅動軸、第1、第2從動軸、第1、第2相向齒輪、及第1、第2傳輸齒輪。驅動軸具有第1及第2驅動齒輪。第1從動軸連結於第1螺旋軸，且具備與第1驅動齒輪卡合之第1從動齒齒，第2從動軸連結於第2螺旋軸，且具備與第2驅動齒輪卡合之第2從動齒輪。第1相向齒輪是就第1從動齒輪配置在與第1驅動齒輪相向之位置，且與第1從動齒輪卡合。第2相向齒輪是就第2從動齒輪配置在與第2驅動齒輪相向之位置，且與第2從動齒輪卡合。第1傳輸齒輪將第1驅動齒輪的旋轉驅動傳輸至第1相向齒輪，第2傳輸齒輪將第2驅動齒輪的旋轉驅動傳輸至第2相向齒輪。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:傳動齒輪裝置</p>
        <p type="p">3:驅動軸</p>
        <p type="p">4:第1相向齒輪</p>
        <p type="p">5:第2相向齒輪</p>
        <p type="p">6:第1傳輸齒輪</p>
        <p type="p">7:第2傳輸齒輪</p>
        <p type="p">8:第1驅動齒輪</p>
        <p type="p">9:第2驅動齒輪</p>
        <p type="p">11:第1從動軸</p>
        <p type="p">12:第2從動軸</p>
        <p type="p">13:第1從動齒輪</p>
        <p type="p">14:第2從動齒輪</p>
        <p type="p">A1,A2,B1,B2,C1,C2,D1,D2:中心</p>
        <p type="p">θ1,θ4,θ5:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1931" publication-number="202616966">
    <tif-files tif-type="multi-tif">
      <tif file="114131915.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>萊賽爾纖維束包、吸煙製品過濾嘴、吸煙製品及其製造方法</chinese-title>
        <english-title>BALE OF LYOCELL TOW, FILTERS, SMOKING ARTICLES AND METHOD FOR PREPARING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">A24D3/06</main-classification>
        <further-classification edition="200601120260128B">A24D3/10</further-classification>
        <further-classification edition="200601120260128B">D01F2/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KT&amp;G CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷薫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鍾喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐昇潼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SEUNG DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴恩英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃永男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YEONG NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珉姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, MIN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇聖鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, SUNG JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬京培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KYENG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁眞哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河成薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及：萊賽爾絲束的捆包；包括萊賽爾絲束的吸菸製品的過濾嘴；以及吸菸製品。根據本申請的萊賽爾絲束的捆包和吸菸製品的過濾嘴可以替代現有技術中傳統的醋酸纖維素絲束包和過濾嘴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to: a bale of lyocell tow; a filter for a smoking article including the lyocell tow; and a smoking article. The bale of lyocell tow and the filter for a smoking article according to the present application can replace conventional bales of cellulose acetate tow and filters in the art.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1932" publication-number="202617924">
    <tif-files tif-type="multi-tif">
      <tif file="114131976.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有高穩定流量的單部分可分配物</chinese-title>
        <english-title>ONE-PART DISPENSABLES HAVING HIGH STABLE FLOW RATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C09K5/08</main-classification>
        <further-classification edition="200601120260128B">C08K3/22</further-classification>
        <further-classification edition="200601120260128B">C08K5/20</further-classification>
        <further-classification edition="200601120260128B">C08L83/04</further-classification>
        <further-classification edition="200601120260128B">H01L23/373</further-classification>
        <further-classification edition="200601120260128B">H05K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商天津萊爾德電子材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIANJIN LAIRD TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付紅光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, HONGGUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雪峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, XUEFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供具有高穩定流量的單部分可分配物。公開了可用於管理熱和/或電磁干擾（EMI）的示例性複合物，例如單部分可分配熱管理和/或電磁干擾（EMI）減輕材料等。在示例性實施方式中，複合物包含基質、在基質內的一種或更多種填料、和在基質內的可溫度活化觸變劑。在將複合物加熱至預定最低溫度達至少預定最小時間量時，可溫度活化觸變劑可活化的，由此，可溫度活化觸變劑的活化增加複合物的流量和隨時間的流量穩定性。還公開了增強可用於管理熱和/或電磁干擾（EMI）的複合物的流量特性的示例性方法。在示例性方法中，使用了可溫度活化觸變劑來增加複合物的流量並增加隨時間的流量穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are exemplary composites useful for the management of heat and/or electromagnetic interference (EMI), such as one-part dispensable thermal management and/or electromagnetic interference (EMI) mitigation materials, &lt;i&gt;etc. &lt;/i&gt;In exemplary embodiments, a composite comprises a matrix, one or more fillers within the matrix, and a temperature-activatable thixotropic agent within the matrix. The temperature-activatable thixotropic agent is activatable upon heating of the composite to a predetermined minimum temperature for at least a predetermined minimum amount of time whereby activation of the temperature-activatable thixotropic agent increases flow rate and flow rate stability over time of the composite. Also disclosed are exemplary methods of enhancing flow rate characteristics of composites that are useful for management of heat and/or electromagnetic interference (EMI). In exemplary methods, a temperature-activatable thixotropic agent is used to increase flow rate and increase flow rate stability over time of the composite.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:單部分可分配物</p>
        <p type="p">104:基底</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1933" publication-number="202617187">
    <tif-files tif-type="multi-tif">
      <tif file="114131978.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反-環辛烯調配物</chinese-title>
        <english-title>TRANS-CYCLOOCTENE FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260121B">A61K47/68</main-classification>
        <further-classification edition="200601120260121B">A61K47/12</further-classification>
        <further-classification edition="200601120260121B">A61K47/26</further-classification>
        <further-classification edition="200601120260121B">A61K47/36</further-classification>
        <further-classification edition="200601120260121B">A61K47/18</further-classification>
        <further-classification edition="200601120260121B">A61K9/19</further-classification>
        <further-classification edition="200601120260121B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商泰格沃克斯製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGWORKS PHARMACEUTICALS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊因　勞倫斯　Ｈ　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIJN, LAURENS HENRI JOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅比拉德　馬克　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBILLARD, MARC STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅辛　拉斐拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSSIN, RAFFAELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維斯堤根　羅尼　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSTEEGEN, RONNY MATHIEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥基　柯林　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCKEE, COLIN MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費根　馬丁　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEIGHAN, MARTIN ERICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈內　桑傑瓦尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHONE, SANJEEVANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容包括一種組成物，其包含緩衝液及反-環辛烯(TCO)，該等TCO可具有改良的特性，例如在臨床使用中。在某些實施例中，該等TCO與其他TCO相比可具有改良的活體外及活體內特性。在某些實施例中，本文所揭露之組成物提供改良的穩定性及/或儲存壽命。本揭露內容亦關於活體內使用該等組成物之方法，以及該等組成物之醫療用途、包含該等TCO之組合及/或製備該等組成物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein include compositions comprising a buffer, and &lt;i&gt;trans&lt;/i&gt;-cyclooctenes (TCOs) that may have improved properties, for example in clinical use. In certain embodiments, the TCOs may have improved &lt;i&gt;in vitro &lt;/i&gt;and &lt;i&gt;in vivo&lt;/i&gt; properties as compared to other TCOs. In certain embodiments, the compositions disclosed herein provide improved stability and/or shelf life. The disclosure also pertains to &lt;i&gt;in vivo&lt;/i&gt; methods of using said compositions, as well as medical uses thereof, combinations comprising said TCOs, and/or methods of preparing said compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1934" publication-number="202617034">
    <tif-files tif-type="multi-tif">
      <tif file="114131993.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清掃機器人工作站</chinese-title>
        <english-title>ROBOT CLEANER STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
        <further-classification edition="200601120260130B">A47L9/28</further-classification>
        <further-classification edition="200601120260130B">D06F29/00</further-classification>
        <further-classification edition="200601120260130B">F26B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高武鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, MOOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹南一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, NAMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪禎順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JEONGSOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種清掃機器人工作站，包括：殼體；座部，設置在殼體中，並允許清掃機器人的至少一部分與其耦接；及集塵部件，配置以收集清掃機器人的集塵箱中的灰塵，且集塵部件可包含：集塵部件殼體，允許將集塵箱中的灰塵引入至其中、集塵馬達，配置以提供吸入集塵箱中的灰塵的吸力、及集塵部件基座，配置以支撐集塵部件殼體和集塵馬達，且集塵部件基座可形成配置以將引入到集塵部件殼體中的空氣排放至集塵馬達的流路，並且與使用額外的軟管或管道的情況相比，可以藉由允許用於集塵的部件也能形成流路，來確保更大的空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a robot cleaner station, including: a housing; a seating portion disposed in the housing and allowing at least a portion of a robot cleaner to be coupled thereto; and a dust collecting part configured to collect dust in a dustbin of the robot cleaner, and the dust collecting part may include: a dust collecting part housing allowing the dust in the dustbin to be introduced thereinto; a dust collecting motor configured to provide a suction force sucking in the dust in the dustbin; and a dust collecting part base configured to support the dust collecting part housing and the dust collecting motor, and the dust collecting part base may form a flow path configured to discharge air introduced into the dust collecting part housing to the dust collecting motor, and there is an effect that a wider space can be secured compared to a case of using an additional hose or pipe by allowing parts used for dust collection to serve to form flow paths as well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清掃機器人工作站</p>
        <p type="p">110:殼體</p>
        <p type="p">111:外壁</p>
        <p type="p">121:底座</p>
        <p type="p">122:清洗板</p>
        <p type="p">123:耦接壁</p>
        <p type="p">124:內壁</p>
        <p type="p">126:門</p>
        <p type="p">126a:門驅動部件</p>
        <p type="p">140:集塵部件</p>
        <p type="p">141:集塵部件殼體</p>
        <p type="p">144:集塵袋抽屜</p>
        <p type="p">147:集塵流路、第一集塵流路</p>
        <p type="p">145:集塵馬達</p>
        <p type="p">160:拖布清洗部件</p>
        <p type="p">163:清潔劑容器</p>
        <p type="p">170:拖布烘乾部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1935" publication-number="202617690">
    <tif-files tif-type="multi-tif">
      <tif file="114132006.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法、聚合物及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C07C309/12</main-classification>
        <further-classification edition="200601120251103B">C07C309/17</further-classification>
        <further-classification edition="200601120251103B">C07C317/04</further-classification>
        <further-classification edition="200601120251103B">C07C317/44</further-classification>
        <further-classification edition="200601120251103B">C07C381/12</further-classification>
        <further-classification edition="200601120251103B">C07D307/93</further-classification>
        <further-classification edition="200601120251103B">C07D321/10</further-classification>
        <further-classification edition="200601120251103B">C07D327/04</further-classification>
        <further-classification edition="200601120251103B">C07D327/06</further-classification>
        <further-classification edition="200601120251103B">C07D327/08</further-classification>
        <further-classification edition="200601120251103B">C07D333/54</further-classification>
        <further-classification edition="200601120251103B">C07D335/16</further-classification>
        <further-classification edition="200601120251103B">C08F212/14</further-classification>
        <further-classification edition="200601120251103B">C08F220/38</further-classification>
        <further-classification edition="200601120251103B">G03F7/004</further-classification>
        <further-classification edition="200601120251103B">G03F7/039</further-classification>
        <further-classification edition="200601120251103B">G03F7/20</further-classification>
        <further-classification edition="200601120251103B">G03F7/32</further-classification>
        <further-classification edition="200601120251103B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樫下幸志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHISHITA, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感放射線性組成物、圖案形成方法及化合物。感放射線性組成物含有：聚合物，其包含源自下述式（1）所表示的化合物的結構單元（I）、及具有酸解離性基的結構單元（II）；以及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="221px" width="452px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，A為碳數1～40的一價有機基；R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;為氫原子、-CN、-NO&lt;sub&gt;2&lt;/sub&gt;、-F、-CF&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;a&lt;/sup&gt;、-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;b&lt;/sup&gt;、-COR&lt;sup&gt;c&lt;/sup&gt;、或者該些基以外的碳數1～20的一價有機基（a）；其中，於R&lt;sup&gt;1&lt;/sup&gt;為-F的情況下，與R&lt;sup&gt;1&lt;/sup&gt;所鍵結的碳原子鍵結的R&lt;sup&gt;2&lt;/sup&gt;為-F以外的基；選自由R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;所組成的群組中的至少一個為氫原子以外的基；Z&lt;sup&gt;+&lt;/sup&gt;為包含聚合性基的一價有機陽離子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1936" publication-number="202617836">
    <tif-files tif-type="multi-tif">
      <tif file="114132013.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨粒的製造方法、化學機械研磨用組成物及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C08G77/16</main-classification>
        <further-classification edition="200601120260129B">C01B33/14</further-classification>
        <further-classification edition="200601120260129B">C01B33/148</further-classification>
        <further-classification edition="200601120260129B">C09G1/16</further-classification>
        <further-classification edition="200601120260129B">C09K3/14</further-classification>
        <further-classification edition="200601120260129B">C08G77/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福與翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUYO, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀井康孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEI, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可高速研磨氧化矽膜且可抑制氧化矽膜的研磨時的研磨缺陷的產生、並且貯存後的研磨特性亦優異的化學機械研磨用組成物及使用其的研磨方法。另外，提供一種可用於該化學機械研磨用組成物的研磨粒的製造方法。本發明的研磨粒的製造方法包括：步驟（a），對含有羥基（-OH）經由共價鍵而固定於表面的粒子及具有環氧基的烷氧基矽烷（A）的混合物進行加熱；步驟（b），於所述步驟（a）後，添加鹼性化合物並進行加熱；及步驟（c），於所述步驟（b）後，添加含有具有兩個以上的羥基（-OH）的有機基的羥基矽烷（C）並進行加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1937" publication-number="202617959">
    <tif-files tif-type="multi-tif">
      <tif file="114132017.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理用組成物及處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">C11D7/26</main-classification>
        <further-classification edition="200601120260106B">C11D1/42</further-classification>
        <further-classification edition="200601120260106B">C11D3/20</further-classification>
        <further-classification edition="200601120260106B">C09K3/32</further-classification>
        <further-classification edition="200601120260106B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁浩淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, HAO CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森康介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田野裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體處理用組成物及使用其的處理方法，所述半導體處理用組成物藉由提高保存穩定性，即便於保存規定期間後，亦可維持良好的處理特性，進而可提高半導體元件製造的良率。本發明的半導體處理用組成物含有（A）下述通式（1）所表示的化合物、（B）下述通式（2）所表示的化合物及（D）液狀介質，於將所述（A）成分的含量設為M&lt;sub&gt;A&lt;/sub&gt;[質量%]，將所述（B）成分的含量設為M&lt;sub&gt;B&lt;/sub&gt;[質量%]時，M&lt;sub&gt;A&lt;/sub&gt;/M&lt;sub&gt;B&lt;/sub&gt;=1.0×10&lt;sup&gt;3&lt;/sup&gt;～1.0×10&lt;sup&gt;6&lt;/sup&gt;。  &lt;br/&gt;&lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;OR&lt;sup&gt;2&lt;/sup&gt;OH    ····（1）  &lt;br/&gt;HCOOH ····（2）  &lt;br/&gt;&lt;br/&gt;（所述式（1）中，R&lt;sup&gt;1&lt;/sup&gt;表示一價有機基，R&lt;sup&gt;2&lt;/sup&gt;表示二價有機基）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1938" publication-number="202617648">
    <tif-files tif-type="multi-tif">
      <tif file="114132038.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法、聚合物及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">C07C25/18</main-classification>
        <further-classification edition="200601120250901B">C07C309/12</further-classification>
        <further-classification edition="200601120250901B">C07C309/17</further-classification>
        <further-classification edition="200601120250901B">C07C309/52</further-classification>
        <further-classification edition="200601120250901B">C07C317/18</further-classification>
        <further-classification edition="200601120250901B">C07C317/44</further-classification>
        <further-classification edition="200601120250901B">C07C381/12</further-classification>
        <further-classification edition="200601120250901B">C07D307/77</further-classification>
        <further-classification edition="200601120250901B">C07D327/06</further-classification>
        <further-classification edition="200601120250901B">C07D333/54</further-classification>
        <further-classification edition="200601120250901B">C07D333/76</further-classification>
        <further-classification edition="200601120250901B">C07D493/18</further-classification>
        <further-classification edition="200601120250901B">C08F212/14</further-classification>
        <further-classification edition="200601120250901B">C08F220/38</further-classification>
        <further-classification edition="200601120250901B">G03F7/004</further-classification>
        <further-classification edition="200601120250901B">G03F7/039</further-classification>
        <further-classification edition="200601120250901B">G03F7/20</further-classification>
        <further-classification edition="200601120250901B">G03F7/32</further-classification>
        <further-classification edition="200601120250901B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樫下幸志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHISHITA, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感放射線性組成物、圖案形成方法及化合物。感放射線性組成物含有：聚合物，其包含源自下述式（1）所表示的化合物的結構單元（I）、及具有酸解離性基的結構單元（II）；以及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="201px" width="413px" file="ed10070.JPG" alt="ed10070.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，A為包含聚合性基的碳數2～40的一價有機基；R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;為氫原子、-CN、-NO&lt;sub&gt;2&lt;/sub&gt;、-F、-CF&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;a&lt;/sup&gt;、-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;b&lt;/sup&gt;、-COR&lt;sup&gt;c&lt;/sup&gt;、或者除-CF&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;a&lt;/sup&gt;、-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;b&lt;/sup&gt;、-COR&lt;sup&gt;c&lt;/sup&gt;或-CF&lt;sub&gt;3&lt;/sub&gt;以外的碳數1～20的一價有機基（a）；其中，於R&lt;sup&gt;1&lt;/sup&gt;為-F的情況下，與R&lt;sup&gt;1&lt;/sup&gt;所鍵結的碳原子鍵結的R&lt;sup&gt;2&lt;/sup&gt;為-F以外的基；選自由R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;所組成的群組中的至少一個為氫原子以外的基；Z&lt;sup&gt;+&lt;/sup&gt;為一價有機陽離子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1939" publication-number="202617027">
    <tif-files tif-type="multi-tif">
      <tif file="114132042.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備</chinese-title>
        <english-title>CLEANING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/34</main-classification>
        <further-classification edition="200601120260130B">A47L11/40</further-classification>
        <further-classification edition="200601120260130B">A47L13/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曉亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種清潔設備，包括：清潔元件，清潔元件配置為與待清潔表面干涉以清潔待清潔表面；容器，容器與清潔元件連接；散熱系統，散熱系統包括流體管路，流體管路的兩端與容器連通；發熱元件，發熱元件與流體管路相接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a cleaning apparatus, including: a cleaning element, configured to interfere with a surface to be cleaned to clean the surface to be cleaned; a container, the container being connected to the cleaning element; a heat dissipation system including a fluid pipeline, where both ends of the fluid pipeline are in communication with the container; and a heating element, the heating element being in contact with the fluid pipeline.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:容器</p>
        <p type="p">130:散熱系統</p>
        <p type="p">131:流體管路</p>
        <p type="p">132:水泵</p>
        <p type="p">1321:限位部</p>
        <p type="p">140:發熱元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1940" publication-number="202619436">
    <tif-files tif-type="multi-tif">
      <tif file="114132058.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132058</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成形品的製造方法及成形品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H05K3/46</main-classification>
        <further-classification edition="200601120260128B">B29C51/14</further-classification>
        <further-classification edition="200601120260128B">B29C51/10</further-classification>
        <further-classification edition="200601120260128B">B29C51/42</further-classification>
        <further-classification edition="200601120260128B">C09D5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商藤倉股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKURA LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小清水和敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIMIZU, KAZUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富塚稔瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMITSUKA, TOSHIMIZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立川泰之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIKAWA, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">成形品1的製造方法，具備：接合層形成步驟，在基板10上形成接合層20；第一阻劑層形成步驟，在離型膜80形成保護層70；導體部形成步驟，在保護層70上形成第二導體部61；第二阻劑層形成步驟，形成底漆層30而覆蓋第二導體部61；貼合步驟，將底漆層30與接合層20貼合；剝離步驟，將離型膜80從保護層70剝離而形成電路板150；以及成形步驟，將電路板150立體成形而形成成形部，其中保護層70在150℃下的應變10%的應力為0.5MPa以下；底漆層30在150℃下的應變10%的應力為0.5MPa以下；保護層70在100℃下的應變10%的應力為0.2MPa以上；底漆層30在100℃下的應變10%的應力為0.2MPa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:接合層</p>
        <p type="p">30:底漆層</p>
        <p type="p">41:第一導體部</p>
        <p type="p">50:跳線阻劑層</p>
        <p type="p">61:第二導體部</p>
        <p type="p">62:第二連接部</p>
        <p type="p">70:保護層</p>
        <p type="p">80:離型膜</p>
        <p type="p">100:中間體</p>
        <p type="p">150:電路板</p>
        <p type="p">200,300:樹脂材料</p>
        <p type="p">701:孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1941" publication-number="202618022">
    <tif-files tif-type="multi-tif">
      <tif file="114132064.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在製程腔室中沉積塗層的方法</chinese-title>
        <english-title>METHOD FOR DEPOSITING A COATING IN PROCESS CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C23C14/46</main-classification>
        <further-classification edition="200601120260121B">C23C16/08</further-classification>
        <further-classification edition="200601120260121B">C23C16/06</further-classification>
        <further-classification edition="200601120260121B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班凱　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEHNKE, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲路茲朵爾　維希德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIROUZDOR, VAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特拉爾　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRAHLE, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德里　克里斯多佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEAUDRY, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了塗覆用於製程腔室的製品的方法。該方法包括使用包含第一源和第二源的雙源來執行離子輔助沉積（IAD），以在製品的至少一個表面上沉積保護層。該第一源包含金屬氧化物，並且該第二源包含金屬氟化物。當執行IAD時，控制該金屬氧化物與該金屬氟化物的比率，以使得發生該保護層的底部與該保護層的頂部之間的氟化物含量的梯度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of coating an article for a process chamber is provided. The method includes performing an ion assisted deposition (IAD) using a dual source include a first source and a second source to deposit a protective layer on at least one surface of the article. The first source includes a metal oxide and the second source includes a metal fluoride. When the IAD is performed, a ratio of the metal oxide to the metal fluoride is controlled, such that a gradient in fluoride content between a bottom of the protective layer and the top of the protective layer occurs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:製品</p>
        <p type="p">305:主體</p>
        <p type="p">308:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1942" publication-number="202617309">
    <tif-files tif-type="multi-tif">
      <tif file="114132084.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高強度鋼之改善的可點焊性及點焊強度</chinese-title>
        <english-title>IMPROVED SPOT WELDABILITY AND SPOT WELD STRENGTH WITH HIGH STRENGTH STEELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B23K11/11</main-classification>
        <further-classification edition="200601120260202B">B23K11/16</further-classification>
        <further-classification edition="200601120260202B">B23K31/12</further-classification>
        <further-classification edition="200601120260202B">C22C38/32</further-classification>
        <further-classification edition="200601120260202B">C22C38/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商克利夫蘭克利夫斯鋼鐵產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEVELAND-CLIFFS STEEL PROPERTIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇布拉馬尼安　莫翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANIAN, MOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康斯達克　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMSTOCK, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪斯　葛蘭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, GRANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種改善的焊接方案，其使用電流斜升方法，其中當將電流施加至正在焊接之金屬板時，電流在焊接時間期間遞增或增加。於一些版本中，可使用超過一個使用斜升方法之加熱階段。所得焊接產品顯示改善的可焊性及點焊強度，如由增加之銲核(weld nugget)尺寸及改善之十字形拉伸試驗所見。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An improved welding schedule uses a current ramp-up approach where the electric current escalates or increases during the welding time when electric current is applied to the metal sheets being welded. In some versions more than one heat stage that uses the ramp-up approach can be used. Resulting welded products show improved weldability and spot weld strength as seen by increased size of the weld nugget and improved cross tension testing.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1943" publication-number="202618061">
    <tif-files tif-type="multi-tif">
      <tif file="114132093.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結構構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">C23C24/04</main-classification>
        <further-classification edition="200601120260131B">C04B35/50</further-classification>
        <further-classification edition="200601120260131B">C04B35/48</further-classification>
        <further-classification edition="200601120260131B">H01L21/306</further-classification>
        <further-classification edition="200601120260131B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂元千里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, SENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種具有對電漿的足夠的耐久性之結構構件。 &lt;br/&gt;  本發明的解決手段為一種結構構件10，包含：基材100；覆蓋基材100的表面110之保護膜200。保護膜200包含以鑭鋯氧化物作為主成分，保護膜200的壓痕硬度大於7.2GPa。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1944" publication-number="202618062">
    <tif-files tif-type="multi-tif">
      <tif file="114132094.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結構構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C23C24/04</main-classification>
        <further-classification edition="200601120251201B">C23C16/44</further-classification>
        <further-classification edition="200601120251201B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂元千里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, SENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
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        <p type="p">本發明的課題為提供一種具有對電漿的足夠的耐久性之結構構件。 &lt;br/&gt;  本發明的解決手段為一種結構構件10，包含：基材100；覆蓋基材100的表面110之保護膜200。保護膜200包含以鑭鋯氧化物作為主成分的結晶，該結晶的晶格常數為10.830×10&lt;sup&gt;-10&lt;/sup&gt;m以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
      </representative-img>
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  <tw-patent-application no="1945" publication-number="202618922">
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          <doc-number>114132095</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>結構構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250905B">H01L21/3065</main-classification>
        <further-classification edition="200601120250905B">H01J37/32</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂元千里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, SENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種具有對電漿的足夠的耐久性之結構構件。 &lt;br/&gt;  本發明的解決手段為一種結構構件10，包含：基材100；覆蓋基材100的表面110之保護膜200。保護膜200包含以鑭釔氧化物作為主成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1946" publication-number="202617338">
    <tif-files tif-type="multi-tif">
      <tif file="114132129.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工作機械之冷卻液淨化裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B23Q11/12</main-classification>
        <further-classification edition="200601120260131B">B01D21/24</further-classification>
        <further-classification edition="200601120260131B">B01D21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商西鐵城精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CITIZEN MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITOH, RYUUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草野誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSANO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡洋一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, YOHICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星出春奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHIDE, HARUNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係一種工作機械之冷卻液淨化裝置，具備自冷卻液中去除異物之過濾器1022，以及用以吸入冷卻液之吸入部20，吸入部20係具備：上面部201，係設置於過濾器1022之下方，具有供冷卻液流入之開口；下面部202，係設置於上面部201之下方，具有供冷卻液流出之開口204且尺寸小於上面部201；以及斜面部203，係具有複數個將上面部201與下面部202連接之傾斜面2031、2032、2033、2034。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
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        <p type="p">20:吸入部</p>
        <p type="p">201:上面部</p>
        <p type="p">2011:第一邊部</p>
        <p type="p">2012:第二邊部</p>
        <p type="p">2013:第三邊部</p>
        <p type="p">2014:第四邊部</p>
        <p type="p">202:下面部</p>
        <p type="p">2021:第一邊</p>
        <p type="p">2022:第二邊</p>
        <p type="p">2023:第三邊</p>
        <p type="p">2024:第四邊</p>
        <p type="p">202:下面部</p>
        <p type="p">2021:第一邊</p>
        <p type="p">2022:第二邊</p>
        <p type="p">2023:第三邊</p>
        <p type="p">2024:第四邊</p>
        <p type="p">203:斜面部</p>
        <p type="p">2031:第一斜面部</p>
        <p type="p">2032:第二斜面部</p>
        <p type="p">2033:第三斜面部</p>
        <p type="p">2034:第四斜面部</p>
        <p type="p">204:排出口</p>
        <p type="p">21:漏斗部</p>
        <p type="p">22:第一流路部</p>
        <p type="p">221:第一開口部</p>
        <p type="p">222:第二開口部</p>
        <p type="p">23:第二流路部</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1947" publication-number="202617419">
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          <doc-number>114132143</doc-number>
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        <chinese-title>光學元件積層體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
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        <main-classification edition="200601120260128B">B29D11/00</main-classification>
        <further-classification edition="200601120260128B">B29C51/10</further-classification>
        <further-classification edition="200601120260128B">G02C7/10</further-classification>
        <further-classification edition="200601120260128B">B32B27/00</further-classification>
        <further-classification edition="200601120260128B">G02B5/23</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YASUTOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野塚遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONOZUKA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桐山萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIYAMA, MOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種光學元件積層體的製造方法，其使用一積層體。積層體具備：功能性薄膜，其具有第1主面及第2主面且包含功能性色素及胺酯系樹脂；接著層，其與功能性薄膜的第1主面密合；第1剝離材料，其將接著層被覆且能夠從接著層剝離；及第2剝離材料，其將功能性薄膜的第2主面被覆且能夠從功能性薄膜剝離；且任意地進一步具備：保護層，其位於功能性薄膜與第2剝離材料之間且與功能性薄膜的第2主面密合。胺酯系樹脂包含：從由聚胺酯樹脂、聚胺酯脲樹脂、聚硫代胺酯樹脂及聚硫代胺酯脲樹脂所組成的群組中選出的至少1種樹脂。製造方法包括：將積層體的第1剝離材料剝離而獲得接著層已露出的第1結構體；及使已露出的接著層積層於具有曲面狀的主面的光學元件基材的一主面上並使其與光學元件基材接著而獲得光學元件積層體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1B:第1結構體</p>
        <p type="p">2:功能性薄膜</p>
        <p type="p">4:第2剝離材料</p>
        <p type="p">11:光學元件基材</p>
        <p type="p">200:真空壓空成型機</p>
        <p type="p">201:上部殼體</p>
        <p type="p">202:下部殼體</p>
        <p type="p">203:台桌</p>
        <p type="p">204:基底</p>
        <p type="p">205:台座</p>
        <p type="p">H1~H3:加熱器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1948" publication-number="202618322">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號產生裝置、方法、類比至數位混合測試板卡和測試機</chinese-title>
        <english-title>SIGNAL GENERATING APPARATUS AND METHOD, ANALOG-TO-DIGITAL MIXED TEST BOARD, AND TEST MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G01R31/3181</main-classification>
        <further-classification edition="200601120251001B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州長川科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU CHANGCHUAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙軼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧成龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, CHENG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫傳鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武文睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種訊號產生裝置、方法、類比至數位混合測試板卡和測試機，訊號產生裝置包括：任意波形產生器、讀寫控制模組、外部時脈晶片和儲存裝置；外部時脈晶片用於輸出固定頻率的取樣時脈至數位至類比轉換裝置；讀寫控制模組連接任意波形產生器和儲存裝置，用於根據接收的讀請求指令從儲存裝置讀取原始波形，並將讀取的原始波形返回至任意波形產生器；任意波形產生器用於對接收的原始波形進行重取樣處理，產生與取樣時脈的頻率匹配的重構波形；其中，重構波形用於數位至類比轉換裝置根據外部時脈晶片輸出的取樣時脈進行數位至類比轉換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal generating apparatus and method, an analog-to-digital mixed test board, and a test machine are provided. The signal generating apparatus includes an arbitrary waveform generator, a read/write control module, an external clock chip, and a storage apparatus. The external clock chip is configured to output a sampling clock at a fixed frequency to a digital-to-analog conversion apparatus. The read/write control module is connected to the arbitrary waveform generator and the storage apparatus, and is configured to read an original waveform from the storage apparatus according to a received read request instruction, and return the read original waveform to the arbitrary waveform generator. The arbitrary waveform generator is configured to perform resampling processing on the received original waveform to generate a reconstructed waveform that matches a frequency of the sampling clock. The reconstructed waveform is used by the digital-to-analog conversion apparatus to perform digital-to-analog conversion according to the sampling clock output by the external clock chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:任意波形產生器</p>
        <p type="p">120:讀寫控制模組</p>
        <p type="p">130:外部時脈晶片</p>
        <p type="p">140:儲存裝置</p>
        <p type="p">150:數位至類比轉換裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1949" publication-number="202616976">
    <tif-files tif-type="multi-tif">
      <tif file="114132153.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扣結件構件、扣結件構件之連續件、扣結件總成、形成扣結件構件之方法及形成扣結件總成之方法</chinese-title>
        <english-title>FASTENER MEMBER, CONTINUOUS PIECE OF FASTENER MEMBER, FASTENER ASSEMBLY, METHOD OF FORMING FASTENER MEMBER AND METHOD OF FORMING FASTENER ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A44B18/00</main-classification>
        <further-classification edition="200601120260131B">A44B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武川誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEKAWA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史文森　科拉塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANSON, COLTAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種扣結件構件，其可包括一基部及複數個鉤列，該複數個鉤列自該基部突出，該複數個鉤列中之各者均在垂直於該扣結件構件之一縱向方向的一方向上延伸，該複數個鉤列中之相鄰之鉤列在該縱向方向上間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fastener member can include a base and a plurality of hook rows protruding from the base, each of the plurality of hook rows extending in a direction perpendicular to a longitudinal direction of the fastener member, adjacent hook rows of the plurality of hook rows spaced apart in the longitudinal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:扣結件總成</p>
        <p type="p">110a:第一扣結件構件</p>
        <p type="p">110b:第二扣結件構件</p>
        <p type="p">412:第二或底部表面</p>
        <p type="p">420:鉤</p>
        <p type="p">820:雙鉤元件/頂端</p>
        <p type="p">880:鉤收納凹部或區域</p>
        <p type="p">915:空隙距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1950" publication-number="202618423">
    <tif-files tif-type="multi-tif">
      <tif file="114132184.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132184</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射式顯示裝置</chinese-title>
        <english-title>REFLECTIVE DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250923B">G02F1/13357</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元太科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宜育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁兆民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, JAU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖經桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHING-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭兆峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種反射式顯示裝置包含反射式顯示面板、設置於反射式顯示面板上的蓋板及設置於反射式顯示面板與蓋板之間的前光模組。前光模組包含光源及導光板。導光板包含本體、第一微結構、第二微結構及第三微結構。本體具有第一表面、第二表面及入光面，光源設置於入光面，第一表面位於第二表面與蓋板之間，第二表面位於反射式顯示面板與第一表面之間。第一微結構設置於第一表面上，第二微結構設置於第一微結構上並覆蓋第一微結構的一部分，第三微結構設置於第二表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reflective display device includes a reflective display panel, a cover plate disposed on the reflective display panel, and a front light module disposed between the reflective display panel and the cover plate. The front light module includes a light source and a light guide plate. The light guide plate includes a main body, a first microstructure, a second microstructure and a third microstructure. The main body has a first surface, a second surface and a light incident surface. The light source is located at the light incident surface. The first surface is located between the second surface and the cover plate. The second surface is located between the reflective display panel and the first surface. The first microstructure is disposed on the first surface, the second microstructure is disposed on the first microstructures and covers a portion of the first microstructure, and the third microstructure is disposed on the second surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:反射式顯示裝置</p>
        <p type="p">100:反射式顯示面板</p>
        <p type="p">200:蓋板</p>
        <p type="p">300:前光模組</p>
        <p type="p">302:光源</p>
        <p type="p">304:導光板</p>
        <p type="p">400:連接層</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">G:空氣間隔</p>
        <p type="p">IS:入光面</p>
        <p type="p">LP:本體</p>
        <p type="p">M1:第一微結構</p>
        <p type="p">M2:第二微結構</p>
        <p type="p">M3:第三微結構</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1951" publication-number="202618884">
    <tif-files tif-type="multi-tif">
      <tif file="114132212.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理系統</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/027</main-classification>
        <further-classification edition="200601120260131B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旭祐一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚洋二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, YOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種基板處理方法，該基板處理方法包含下列步驟：將包含具有第1圖型之元件的第1基板與第2基板接合而形成疊合基板；測定該疊合基板之皺摺；對該疊合基板進行皺摺減少之處理；藉著對已進行該皺摺減少處理之該疊合基板進行微影，而形成具有第2圖型之第1光阻膜，該皺摺減少處理包含下列步驟：決定使該疊合基板產生該皺摺之第1應力；決定緩和該第1應力之第2應力；於該疊合基板之其中一面形成賦予該第2應力之皺摺修正膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing method comprising: bonding a first substrate including a device having a first pattern and a second substrate to form a bonded substrate; measuring a distortion of the bonded substrate; processing the bonded substrate by a distortion reduction process; and forming a first resist film having a second pattern by performing photolithography on the bonded substrate which is processed by the distortion reduction process; wherein the distortion reduction process includes determining a first stress causing the distortion in the bonded substrate; determining a second stress that relieves the first stress; and forming a distortion correction film that applies the second stress on one surface of the bonded substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">St101~St110:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1952" publication-number="202617649">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學增幅負型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C07C25/18</main-classification>
        <further-classification edition="200601120260126B">C07C43/225</further-classification>
        <further-classification edition="200601120260126B">C07C309/42</further-classification>
        <further-classification edition="200601120260126B">C07C309/73</further-classification>
        <further-classification edition="200601120260126B">C07C309/75</further-classification>
        <further-classification edition="200601120260126B">C07C309/77</further-classification>
        <further-classification edition="200601120260126B">C07C381/12</further-classification>
        <further-classification edition="200601120260126B">C07D327/08</further-classification>
        <further-classification edition="200601120260126B">C08F212/14</further-classification>
        <further-classification edition="200601120260126B">C08F220/30</further-classification>
        <further-classification edition="200601120260126B">G03F7/004</further-classification>
        <further-classification edition="200601120260126B">G03F7/038</further-classification>
        <further-classification edition="200601120260126B">G03F7/20</further-classification>
        <further-classification edition="200601120260126B">G03F7/32</further-classification>
        <further-classification edition="201201120260126B">G03F1/24</further-classification>
        <further-classification edition="200601120260126B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可獲得圖案形成時之解像性提升且LER及圖案忠實性良好的阻劑圖案的化學增幅負型阻劑組成物、及阻劑圖案形成方法。  &lt;br/&gt;一種化學增幅負型阻劑組成物，包含(A)由下式(A)表示之鎓鹽構成之光酸產生劑、及(B)基礎聚合物，該基礎聚合物包含含有下式(B1)表示之重複單元之聚合物。  &lt;br/&gt;&lt;img align="absmiddle" height="308px" width="573px" file="ed10366.JPG" alt="ed10366.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt having a substituent group on the carbon atom adjoining the sulfo group in the anion and containing a triarylbenzene or diarylbenzene structure generates a benzenesulfonic acid having a moderate acidity and limited diffusion. A chemically amplified negative resist composition comprising the onium salt as an acid generator and a polymer is processed by lithography to form a pattern of rectangular profile with reduced LER.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1953" publication-number="202617803">
    <tif-files tif-type="multi-tif">
      <tif file="114132233.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>媒液組成物、漿料組成物及電子零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F220/14</main-classification>
        <further-classification edition="200601120260202B">C08F220/18</further-classification>
        <further-classification edition="200601120260202B">C08L33/06</further-classification>
        <further-classification edition="200601120260202B">C08K5/01</further-classification>
        <further-classification edition="200601120260202B">C08K5/05</further-classification>
        <further-classification edition="200601120260202B">C08K5/101</further-classification>
        <further-classification edition="200601120260202B">H01B1/22</further-classification>
        <further-classification edition="200601120260202B">H01G4/12</further-classification>
        <further-classification edition="200601120260202B">H01G4/232</further-classification>
        <further-classification edition="200601120260202B">H01G4/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大丈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, JO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山內健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠製作溫度所導致之黏度變化較少且黏度不均較少之導電膏之媒液（vehicle）組成物。又，本發明提供一種包含該媒液組成物之漿料組成物、使用該漿料組成物而成之電子零件。  &lt;br/&gt;本發明係一種媒液組成物，其含有黏合劑樹脂及媒液溶劑，上述黏合劑樹脂含有(甲基)丙烯酸樹脂或聚乙烯縮醛樹脂，上述媒液溶劑含有有機溶劑A及莰基（bornyl）系化合物B，上述有機溶劑A含有選自由松油醇、松油醇乙酸酯、二氫松油醇及二氫松油醇乙酸酯所組成之群中之至少一者，上述莰基系化合物B含有選自由莰醇、異莰醇、乙酸莰酯及乙酸異莰酯所組成之群中之至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1954" publication-number="202618181">
    <tif-files tif-type="multi-tif">
      <tif file="114132262.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工廠系統及燃燒方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">F23J15/00</main-classification>
        <further-classification edition="200601120251231B">F23J7/00</further-classification>
        <further-classification edition="200601120251231B">F23L7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿川𨺓一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGAWA, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種能源效率優異且能夠進行生質燃燒及二氧化碳的回收/利用之工廠系統及燃燒方法。  &lt;br/&gt;　　[解決手段]一種工廠系統，其具備：燃燒爐，係供給包含從其他裝置排出之廢棄氧及過剩氧中的至少一方之含氧氣體、至少包含二氧化碳之回收氣體及生質燃料，並在氧存在下燃燒前述生質燃料；排出氣體回收裝置，係回收從前述燃燒爐排出且至少包含二氧化碳之排出氣體，並將前述排出氣體的至少一部分作為前述回收氣體而再度供給至前述燃燒爐；及二氧化碳壓縮部，係供給由前述排出氣體回收裝置回收之排出氣體的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:其他裝置</p>
        <p type="p">20:燃燒系統</p>
        <p type="p">22:供給裝置</p>
        <p type="p">23:氮分離裝置</p>
        <p type="p">24:生質燃燒爐</p>
        <p type="p">25:排煙處理裝置</p>
        <p type="p">26:氮分離裝置</p>
        <p type="p">27:排出氣體回收裝置</p>
        <p type="p">28:壓縮裝置</p>
        <p type="p">100:工廠系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1955" publication-number="202618909">
    <tif-files tif-type="multi-tif">
      <tif file="114132266.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>漿料輸送方法</chinese-title>
        <english-title>SLURRY DELIVERY METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/304</main-classification>
        <further-classification edition="200601120260128B">B24B57/02</further-classification>
        <further-classification edition="200601120260128B">B05B7/04</further-classification>
        <further-classification edition="201201120260128B">B24B37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達拉拉珍　海力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUNDARARAJAN, HARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張壽松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHOU-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昊晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAOSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　建設</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, JIANSHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤川孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">拋光方法包括混合載送氣體和漿料以形成拋光混合物，將拋光混合物噴霧到拋光墊的表面，並在拋光墊和基板之間創造相對運動以拋光基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of polishing includes mixing a carrier gas and a slurry to form a polishing mixture, aerosolizing the polishing mixture onto a surface of a polishing pad, and creating relative motion between the polishing pad and a substrate to polish the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:混合物</p>
        <p type="p">61:接合面</p>
        <p type="p">63:對稱軸</p>
        <p type="p">64:端口/噴嘴</p>
        <p type="p">66:漿料供應線</p>
        <p type="p">68:氣體供應線</p>
        <p type="p">124:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1956" publication-number="202618266">
    <tif-files tif-type="multi-tif">
      <tif file="114132270.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高通量Ｘ射線光子光譜學的陷波濾波器</chinese-title>
        <english-title>NOTCH FILTER FOR HIGH THROUGHPUT X-RAY PHOTON SPECTROSCOPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260130B">G01N23/2252</main-classification>
        <further-classification edition="200601120260130B">H01J37/256</further-classification>
        <further-classification edition="200601120260130B">G21K1/10</further-classification>
        <further-classification edition="200601120260130B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周芬　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUVIN, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>理曼　艾隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITMAN, ALON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種樣品表徵系統，該樣品表徵系統包括：表徵工具，該表徵工具被配置為產生被指引朝向被測試樣品的電子束；X射線光子能量色散偵測器（EDX），該X射線光子能量色散偵測器被配置為收集從該被測試樣品發射的X射線光子；及濾波器元件，該濾波器元件在該表徵工具中定位在該被測試樣品與該EDX之間，該濾波器元件包括帶阻濾波器，該帶阻濾波器被配置為允許具有預定能量範圍的攜帶資訊的X射線光子從其中透射並且防止具有與該預定能量範圍不同的能量範圍的無關光子到達該EDX，借此，與沒有該濾波器元件的樣品表徵系統相比，到達該EDX的攜帶資訊的X射線光子的計數與到達該EDX的總光子計數之間的比率增大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a sample characterization system including a characterization tool configured to generate an electron beam directed toward a tested sample; an X-ray photon energy dispersive detector (EDX) configured to collect X-ray photons emitted from the tested sample; and a filter assembly positioned in the characterization tool between the tested sample and the EDX, the filter assembly including a band-stop filter configured to allow transmission therethrough of information-carrying X-ray photons having a predetermined energy range and preventing irrelevant photons having an energy range different from the predetermined energy range from reaching the EDX, whereby a ratio between a count of information-carrying X-ray photons reaching the EDX and an overall photon count reaching the EDX is increased as compared to a sample characterization system without the filter assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">410:濾波器系統</p>
        <p type="p">414:帶阻濾波器</p>
        <p type="p">416:電子濾波器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1957" publication-number="202617650">
    <tif-files tif-type="multi-tif">
      <tif file="114132273.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽型單體、單體型光酸產生劑、聚合物、化學增幅阻劑組成物、及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT TYPE MONOMER, MONOMERIC PHOTO-ACID GENERATOR, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C25/18</main-classification>
        <further-classification edition="200601120260202B">C07C309/17</further-classification>
        <further-classification edition="200601120260202B">C07C309/75</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D307/93</further-classification>
        <further-classification edition="200601120260202B">C07D327/08</further-classification>
        <further-classification edition="200601120260202B">C07D333/54</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C09K3/00</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08F220/38</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且微影性能優良之化學增幅阻劑組成物中含有之聚合物之材料即作為單體型光酸產生劑使用的鎓鹽型單體、由該鎓鹽型單體構成之單體型光酸產生劑、含有來自該單體型光酸產生劑之重複單元之聚合物、包含含有該聚合物之基礎聚合物的化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;本發明之解決手段係一種鎓鹽型單體，其特徵為以下述通式(A)表示。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="192px" width="498px" file="ed10279.JPG" alt="ed10279.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is onium salt type monomer, wherein the onium salt type monomer is represented by the following general formula (A). This provides: an onium salt type monomer used as a monomeric photo-acid generator, which is a material for a polymer contained in a chemically amplified resist composition that has excellent solvent solubility, high sensitivity, high contrast, and excellent lithography performance in photolithography using high-energy beams; a monomeric photo-acid generator consisting of the onium salt type monomer; a polymer containing a repeating unit derived from the monomeric photo-acid generator; a chemically amplified resist composition containing a base polymer that contains the polymer; and a patterning process using the chemically amplified resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="159px" width="473px" file="ed10280.JPG" alt="ed10280.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1958" publication-number="202618471">
    <tif-files tif-type="multi-tif">
      <tif file="114132283.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子照相用載體及二成分顯影劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G03G9/08</main-classification>
        <further-classification edition="200601120260202B">G03G9/083</further-classification>
        <further-classification edition="200601120260202B">G03G9/087</further-classification>
        <further-classification edition="200601120260202B">G03G9/09</further-classification>
        <further-classification edition="200601120260202B">G03G9/10</further-classification>
        <further-classification edition="200601120260202B">G03G9/107</further-classification>
        <further-classification edition="200601120260202B">G03G9/113</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商關東電化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANTO DENKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田智大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電子照相用載體及使用其之二成分顯影劑，該電子照相用載體係包含具有磁性之芯材粒子、及將上述芯材粒子之表面以樹脂被覆之被覆層的樹脂被覆載體，且  &lt;br/&gt;上述被覆層至少含有丙烯酸樹脂、及與該丙烯酸樹脂處於混合狀態之矽酮單體或矽酮低聚物、或者於與丙烯酸樹脂混合之狀態下使矽酮單體或低聚物硬化而得之硬化物，  &lt;br/&gt;來自矽酮單體或矽酮低聚物之成分於構成上述被覆層之樹脂中所占之含量為2質量%以上20質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載體</p>
        <p type="p">2,2':電極</p>
        <p type="p">3,3':磁極</p>
        <p type="p">4:支持台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1959" publication-number="202617951">
    <tif-files tif-type="multi-tif">
      <tif file="114132296.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑脂組成物</chinese-title>
        <english-title>GREASE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C10M169/02</main-classification>
        <further-classification edition="200601120260202B">C10M169/04</further-classification>
        <further-classification edition="200601120260202B">C10M101/02</further-classification>
        <further-classification edition="200601120260202B">C10M105/38</further-classification>
        <further-classification edition="200601120260202B">C10M107/02</further-classification>
        <further-classification edition="200601120260202B">C10M115/08</further-classification>
        <further-classification edition="200601120260202B">C10M117/02</further-classification>
        <further-classification edition="200601120260202B">C10M117/04</further-classification>
        <further-classification edition="200601120260202B">C10M131/10</further-classification>
        <further-classification edition="200601120260202B">C10M145/24</further-classification>
        <further-classification edition="200601120260202B">C10M149/06</further-classification>
        <further-classification edition="200601320260202B">C10N10/02</further-classification>
        <further-classification edition="200601320260202B">C10N20/02</further-classification>
        <further-classification edition="200601320260202B">C10N30/06</further-classification>
        <further-classification edition="200601320260202B">C10N40/02</further-classification>
        <further-classification edition="200601320260202B">C10N40/04</further-classification>
        <further-classification edition="200601320260202B">C10N40/06</further-classification>
        <further-classification edition="200601320260202B">C10N50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商協同油脂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYODO YUSHI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口美幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, MIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅崎晶高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGASAKI, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>筒井大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUTSUI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種滑脂組成物，其中不包含PFAS(全氟烷基化合物及聚氟烷基化合物)，且油非擴散性優。本發明之滑脂組成物係含有基油、增稠劑、及非離子系界面活性劑，該非離子系界面活性劑為在PGMEA的濃度為0.05質量%時，表面張力為22.5至26.5mN/m之界面活性劑，且不包含PFAS(全氟烷基化合物及聚氟烷基化合物)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a grease composition that is free of PFAS (perfluoroalkyl compounds and polyfluoroalkyl compounds) and has excellent oil non-diffusibility. The grease composition of the present invention contains a base oil, a thickener, and a nonionic surfactant, the nonionic surfactant having a surface tension of 22.5 to 26.5 mN/m when its concentration in PGMEA is 0.05% by mass, and is free of PFAS (perfluoroalkyl compounds and polyfluoroalkyl compounds).</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1960" publication-number="202618979">
    <tif-files tif-type="multi-tif">
      <tif file="114132344.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體稀釋裝置及液體稀釋方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H01L21/67</main-classification>
        <further-classification edition="202201120260116B">B01F35/80</further-classification>
        <further-classification edition="200601120260116B">G05D11/16</further-classification>
        <further-classification edition="202201120260116B">B01F35/71</further-classification>
        <further-classification edition="202201120260116B">B01F35/221</further-classification>
        <further-classification edition="202201120260116B">B01F23/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱殿濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, DIANTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐時座</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, SHIZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>初振明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, ZHENMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種液體稀釋裝置及液體稀釋方法，包括：至少兩個一級稀釋槽，用於通入原液和稀釋介質進行一級稀釋得到第一稀釋液；至少兩個二級稀釋槽，每個所述二級稀釋槽均與所述至少兩個一級稀釋槽連通，用於通入所述第一稀釋液和稀釋介質進行二級稀釋得到第二稀釋液，所述第二稀釋液用於供給至使用場所；所述液體稀釋裝置被配置為使所述至少兩個一級稀釋槽交替地向所述二級稀釋槽供給所述第一稀釋液，且使所述至少兩個二級稀釋槽交替地向所述使用場所供給所述第二稀釋液。本申請的液體稀釋裝置能夠持續且穩定地調配符合目標濃度的稀釋液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:一級稀釋槽</p>
        <p type="p">1a:第一槽</p>
        <p type="p">1b:第二槽</p>
        <p type="p">2:二級稀釋槽</p>
        <p type="p">2a:第三槽</p>
        <p type="p">2b:第四槽</p>
        <p type="p">3:氣動閥</p>
        <p type="p">4:流量計</p>
        <p type="p">5:開關閥</p>
        <p type="p">6:泵</p>
        <p type="p">7:濃度檢測器</p>
        <p type="p">8:溫度檢測器</p>
        <p type="p">9:溫度調節器</p>
        <p type="p">15:供液管</p>
        <p type="p">10:液體稀釋裝置</p>
        <p type="p">11:第一進液管</p>
        <p type="p">12:第二進液管</p>
        <p type="p">13:第三進液管</p>
        <p type="p">14:第四進液管</p>
        <p type="p">16:自迴圈管</p>
        <p type="p">17:液位控制器</p>
        <p type="p">18a:第一出液管</p>
        <p type="p">18b:第二出液管</p>
        <p type="p">19a:第三出液管</p>
        <p type="p">19b:第四出液管</p>
        <p type="p">20:軟體控制部</p>
        <p type="p">30:使用場所</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1961" publication-number="202618615">
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          <doc-number>202618615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132347</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於具雜訊的記憶消除的具有精細調整模型參數的積體電路</chinese-title>
        <english-title>INTEGRATED CIRCUIT WITH FINE TUNING MODEL PARAMETERS FOR NOISY MEMORY CANCELLATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260128B">G06N3/08</main-classification>
        <further-classification edition="202301120260128B">G06N3/063</further-classification>
        <further-classification edition="202301120260128B">G06N3/04</further-classification>
        <further-classification edition="200601120260128B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商塔拉斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAALAS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴吉克　勒朱比沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJIC, LJUBISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示了涉及具有儲存於密集記憶體中之大型機器學習模型之運算架構的方法及系統。一種所揭示之方法包括將一機器學習模型添加至一運算架構，其中該機器學習模型在添加至該運算架構之後在該運算架構上進行訓練，且該機器學習模型儲存於該運算架構上之至少一個記憶體中。該所揭示之方法亦包括微調該機器學習模型，以抵消該運算架構上之該機器學習模型可能因該至少一個記憶體而導致的一效能降低。該微調可包括在該運算架構上對該機器學習模型進行訓練。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems that involve computing architectures with large machine learning models stored in dense memories are disclosed herein. A disclosed method includes adding a machine learning model to a computing architecture, where the machine learning model was trained on the computing architecture after being added to the computing architecture, and the machine learning model is stored in at least one memory on the computing architecture. The disclosed method also includes fine-tuning the machine learning model to counteract a decrease in performance of the machine learning model on the computing architecture that is attributable to the at least one memory. The fine-tuning may include training the machine learning model on the computing architecture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:運算架構</p>
        <p type="p">101:模型核心</p>
        <p type="p">102:微調部分</p>
        <p type="p">103:參數</p>
        <p type="p">104:微調參數</p>
        <p type="p">105:推理引擎</p>
        <p type="p">106:推理輸出</p>
        <p type="p">107:輸入/輸入影像</p>
        <p type="p">108:第一記憶體</p>
        <p type="p">109:第二記憶體</p>
        <p type="p">110:雜訊源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1962" publication-number="202618769">
    <tif-files tif-type="multi-tif">
      <tif file="114132382.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置、記憶體設備及方法</chinese-title>
        <english-title>MEMORY DEVICE, MEMORY APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G11C7/10</main-classification>
        <further-classification edition="200601120251204B">G11C7/22</further-classification>
        <further-classification edition="200601120251204B">G11C8/10</further-classification>
        <further-classification edition="200601120251204B">G11C11/4063</further-classification>
        <further-classification edition="202301120251204B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHE-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體設備，包含複數個秩。該些秩的每一者包含至少一個記憶體裝置。該些秩中的複數個第一秩中的一或多者用以根據一或多個第一訊號而致能。該些第一秩用以根據一第二訊號被選擇，且該第二訊號與該一或多個第一訊號不同。該些第一秩中的該一或多者用以響應於接收該一或多個第一訊號及該第二訊號，而執行一或多個第一操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus including a plurality of ranks. Each of the plurality of ranks includes at least one memory device. One or more first ranks of a plurality of first ranks of the plurality of ranks are configured to be enabled based on one or more first signals. The plurality of first ranks are configured to be selected based on a second signal that is different from the one or more first signals. The one or more first ranks are configured to perform one or more first operations in response to receiving the one or more first signals and the second signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">602:步驟</p>
        <p type="p">604:步驟</p>
        <p type="p">606:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1963" publication-number="202619001">
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      <tif file="114132385.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理系統及搬運方法</chinese-title>
        <english-title>PROCESSING SYSTEM AND TRANSFER METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/677</main-classification>
        <further-classification edition="200601120260126B">H01L21/68</further-classification>
        <further-classification edition="200601120260126B">B25J9/16</further-classification>
        <further-classification edition="200601120260126B">G05B19/418</further-classification>
        <further-classification edition="200601120260126B">B65G49/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>網倉紀彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMIKURA, NORIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北正知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, MASATOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可有效率地更換處理室內的消耗構件之技術。  &lt;br/&gt;依本發明之一態樣之處理系統，具備於其內部安裝有消耗構件之腔室、收納該消耗構件之收納模組、檢測該消耗構件的位置之位置檢測感測器、連接於該腔室及該收納模組，並具有在該腔室與該收納模組之間搬運該消耗構件之搬運機器人之真空搬運模組，以及控制部，該控制部係構成為用以執行以下步驟：步驟(a)，控制該搬運機器人將安裝於該腔室之該消耗構件搬運至該收納模組，步驟(b)，以該位置檢測感測器檢測出搬運至該收納模組之該消耗構件的位置，以及步驟(c)，控制該搬運機器人，基於在該步驟(b)中檢測出之該消耗構件的位置，將與該消耗構件不同之新的消耗構件進行位置校正並從該收納模組搬運至該腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a processing system. The processing system comprises: a chamber in which a consumable member is installed; a storage module configured to store the consumable member; a position detection sensor configured to detect a position of the consumable member; a vacuum transfer module connected to the chamber and the storage module, the vacuum transfer module having a transfer robot configured to transfer the consumable member between the chamber and the storage module; and a controller. The controller is configured to perform processes of: (a) controlling the transfer robot to transfer the consumable member installed in the chamber to the storage module; (b) detecting the position of the consumable member transferred to the storage module by the position detection sensor; and (c) controlling the transfer robot to transfer a new consumable member different from the consumable member from the storage module to the chamber at a position adjusted based on the position of the consumable member detected in the process (b).</p>
      </isu-abst>
      <representative-img>
        <p type="p">CU:控制部</p>
        <p type="p">PM1~PM12:製程模組</p>
        <p type="p">PS:處理系統</p>
        <p type="p">LM:大氣搬運模組</p>
        <p type="p">SM:收納模組</p>
        <p type="p">TM1,TM2:真空搬運模組</p>
        <p type="p">TR1,TR2:搬運機器人</p>
        <p type="p">G1~G4:閘閥</p>
        <p type="p">LP1~LP5:載入埠</p>
        <p type="p">LL1,LL2:裝載鎖定模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1964" publication-number="202618019">
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          <doc-number>202618019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濺鍍裝置以及其所使用的支援程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C23C14/34</main-classification>
        <further-classification edition="200601120260108B">C23C14/56</further-classification>
        <further-classification edition="200601120260108B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新柯隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINCRON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲瀬陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INASE, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤光人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, MITSUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以在對應於成膜條件的最佳傾斜角度下濺鍍成膜的濺鍍裝置，包括能夠減壓並且在基板(2)形成膜的腔室(12)、以及設置在前述腔室的內部的包括濺鍍電極(131)的電極單元(13)，前述電極單元經由傾斜單元(15)而由軸(14)支持，前述軸相對於前述腔室能夠沿第一軸向(X)移動，並且能夠沿第二軸向(Z)移動，前述第一軸向平行於成膜位置的前述基板的表面，前述第二軸向垂直於成膜位置的前述基板的表面，前述傾斜單元能夠調節裝配於前述濺鍍電極的靶材(132)的表面相對於成膜位置的前述基板的表面形成的傾斜角度(θ)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:濺鍍裝置</p>
        <p type="p">2:基板</p>
        <p type="p">11:殼體</p>
        <p type="p">12:腔室</p>
        <p type="p">13:電極單元</p>
        <p type="p">14:軸</p>
        <p type="p">15:傾斜單元</p>
        <p type="p">16:基座</p>
        <p type="p">111:排氣口</p>
        <p type="p">112:排氣裝置</p>
        <p type="p">113:側壁板</p>
        <p type="p">114:底板</p>
        <p type="p">115:頂板</p>
        <p type="p">116:滑板</p>
        <p type="p">121:成膜室</p>
        <p type="p">122:多孔石英板</p>
        <p type="p">123:多孔金屬板</p>
        <p type="p">124:氣體供給裝置</p>
        <p type="p">131:濺鍍電極</p>
        <p type="p">132:靶材</p>
        <p type="p">133:可動板</p>
        <p type="p">141:升降板</p>
        <p type="p">142:進給螺桿機構</p>
        <p type="p">161:旋轉軸</p>
        <p type="p">162:驅動裝置</p>
        <p type="p">163:加熱器</p>
        <p type="p">C1:旋轉中心點</p>
        <p type="p">C2:中心點</p>
        <p type="p">PL1,PL2:面</p>
        <p type="p">X:偏移長度/長度</p>
        <p type="p">Z:高度</p>
        <p type="p">θ:傾斜角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1965" publication-number="202617163">
    <tif-files tif-type="multi-tif">
      <tif file="114132412.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617163</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>修飾的雙鏈核糖核酸及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">A61K31/7088</main-classification>
        <further-classification edition="201001120260116B">C12N15/113</further-classification>
        <further-classification edition="200601120260116B">A61K48/00</further-classification>
        <further-classification edition="200601120260116B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商維亞臻生物技術（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISIRNA THERAPEUTICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸劍宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JIANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀輝君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, HUIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒　曉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, XIAOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一類能夠增強抑制目標基因表現效果之dsRNA、其結合物、及其在製備治療相關疾病藥物中之應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1966" publication-number="202618186">
    <tif-files tif-type="multi-tif">
      <tif file="114132426.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空間淨化裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260130B">F24F8/00</main-classification>
        <further-classification edition="202101120260130B">F24F7/00</further-classification>
        <further-classification edition="200601120260130B">A61L9/00</further-classification>
        <further-classification edition="200601120260130B">A61L9/03</further-classification>
        <further-classification edition="200601120260130B">A61L9/05</further-classification>
        <further-classification edition="202301120260130B">C02F1/461</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯田佳奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIDA, KANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口正太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海老櫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBI, SAKURA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">空間淨化裝置(1)具備：電解槽(10)，貯存包含氯化物離子(Cl&lt;sup&gt;-&lt;/sup&gt;)之第1水溶液(L1)並且進行電解而生成次氯酸；氯化物離子供給槽(20)，貯存包含Cl&lt;sup&gt;-&lt;/sup&gt;之第2水溶液(L2)並且藉由有隔膜電解使第2水溶液(L2)中所含之Cl&lt;sup&gt;-&lt;/sup&gt;穿透陰離子交換膜(41)而供給至第1水溶液(L1)；及高濃度氯化物水溶液供給槽(30)，貯存包含比第2水溶液(L2)更高濃度的Cl&lt;sup&gt;-&lt;/sup&gt;之高濃度氯化物水溶液(HC)並且供給至第2水溶液(L2)。在補充因為有隔膜電解而減少的第2水溶液(L2)中所含之Cl&lt;sup&gt;-&lt;/sup&gt;時，係將高濃度氯化物水溶液(HC)供給至第2水溶液(L2)，以使第2水溶液(L2)中所含之Cl&lt;sup&gt;-&lt;/sup&gt;的濃度相對於第1水溶液(L1)的Cl&lt;sup&gt;-&lt;/sup&gt;的濃度維持在預定的濃度差的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:空間淨化裝置</p>
        <p type="p">10:電解槽</p>
        <p type="p">11:電解槽側陽極</p>
        <p type="p">12:電解槽側陰極</p>
        <p type="p">13:空氣供給部</p>
        <p type="p">14:送風管</p>
        <p type="p">15:電解槽側內部空間</p>
        <p type="p">16:水回收部</p>
        <p type="p">17:釋出口</p>
        <p type="p">18:水位檢測部</p>
        <p type="p">20:氯化物離子供給槽</p>
        <p type="p">21:氯化物離子供給槽側陰極</p>
        <p type="p">22:氯化物離子供給槽側內部空間</p>
        <p type="p">23:第1排出口</p>
        <p type="p">30:高濃度氯化物水溶液供給槽</p>
        <p type="p">31:送出部</p>
        <p type="p">32:吸入側管件</p>
        <p type="p">33:滴下側管件</p>
        <p type="p">41:陰離子交換膜</p>
        <p type="p">42:陽離子交換膜</p>
        <p type="p">50:金屬離子供給槽</p>
        <p type="p">51:金屬離子供給槽側陽極</p>
        <p type="p">52:金屬離子供給槽側內部空間</p>
        <p type="p">53:第2排出口</p>
        <p type="p">60:電流控制部</p>
        <p type="p">61,62,63,64:配線</p>
        <p type="p">A:空氣流路</p>
        <p type="p">B:氣泡</p>
        <p type="p">C:殼體</p>
        <p type="p">HC:高濃度氯化物水溶液</p>
        <p type="p">L1:第1水溶液</p>
        <p type="p">L2:第2水溶液</p>
        <p type="p">L3:第3水溶液</p>
        <p type="p">M:混合空氣</p>
        <p type="p">R:外部空間</p>
        <p type="p">S1,S2,S3:液面</p>
        <p type="p">III-III:線</p>
        <p type="p">x,y,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1967" publication-number="202618270">
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      <volno>24</volno>
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          <doc-number>202618270</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132492</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波檢查裝置及透鏡位置之調整方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G01N29/24</main-classification>
        <further-classification edition="200601120260116B">G01N29/04</further-classification>
        <further-classification edition="200601120260116B">G01N29/26</further-classification>
        <further-classification edition="200601120260116B">F16M11/04</further-classification>
        <further-classification edition="200601120260116B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立電力解決方案股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI POWER SOLUTIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子純基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, JUNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>住川健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMIKAWA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊川耕太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUKAWA, KOUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱地彬文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMACHI, AKIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種可兼顧探針之透鏡保護與使用填隙片之距離調整之容易度的超音波檢查裝置。  &lt;br/&gt;本揭示之超音波檢查裝置具備：探針1，其對使用超音波之檢查對象即檢查對象物進行上述超音波之發送或接收之至少一者即收發；掃描測量裝置，其於xy平面內掃描探針1；及控制裝置，其控制探針1之驅動；且探針1具備：探針本體10，其於上述檢查對象物之側具備供上述超音波通過之透鏡11；及配件20，其包圍透鏡11而安裝於探針本體10，具備較透鏡11更向上述檢查對象物之側延伸之複數個凸部22。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針</p>
        <p type="p">10:探針本體</p>
        <p type="p">11:透鏡</p>
        <p type="p">20:配件</p>
        <p type="p">21:端部</p>
        <p type="p">22:凸部</p>
        <p type="p">30:構件</p>
        <p type="p">31:表面</p>
        <p type="p">40:填隙片</p>
        <p type="p">41:表面</p>
        <p type="p">50:間隔件</p>
        <p type="p">60:支持構件</p>
        <p type="p">61:螺合件</p>
        <p type="p">111:下端</p>
        <p type="p">A:A部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1968" publication-number="202617710">
    <tif-files tif-type="multi-tif">
      <tif file="114132512.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備異唑啉化合物及其中間物之方法</chinese-title>
        <english-title>PROCESS FOR MAKING AN ISOXAZOLINE COMPOUND AND INTERMEDIATE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C07D413/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商益農美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELANCO US INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蝶芙　珍　瑪莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEFAUW, JEAN MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, GUANMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　京誕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JINGDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於製備對映異構純的式（1）之異㗁唑啉化合物之方法，  &lt;br/&gt;&lt;img align="absmiddle" height="174px" width="450px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。  &lt;br/&gt;本發明亦提供用於製備對映異構純的式（1）之異㗁唑啉化合物之方法，其特徵在於藉由結晶改良3-甲基-5-[(5S)-5-(3,4,5-三氯苯基)-5-(三氟甲基)-4H-異㗁唑-3-基]噻吩-2-甲酸之對映異構純度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides processes for making enantiomerically pure isoxazoline compounds of formula (1), &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="432px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. &lt;br/&gt;The present disclosure also provides processes for making enantiomerically pure isoxazoline compounds of formula (1) characterized by improving the enantiomeric purity of 3-methyl-5-[(5S)-5-(3,4,5-trichlorophenyl)-5-(trifluoromethyl)-4H-isoxazol-3-yl]thiophene-2-carboxylic acid by crystallization.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1969" publication-number="202618878">
    <tif-files tif-type="multi-tif">
      <tif file="114132563.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合裝置以及接合方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/02</main-classification>
        <further-classification edition="200601120260131B">B23K20/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水英樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">接合裝置係具備：羥基測定部，係對第一基板的接合面以及第二基板的接合面進行羥基測定。羥基測定部係具備：紫外線照射部，係對第一基板的接合面以及第二基板的接合面進行紫外線照射；以及受光部，係接受進行了紫外線照射的第一基板的接合面或者第二基板的接合面所發出的螢光，並輸出與所接受的螢光對應的螢光資料。羥基測定部係在第一基板以及第二基板被搬入至接合室前先進行羥基測定。藉此，能抑制因為接合面的羥基量不足導致發生接合不良。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:接合裝置</p>
        <p type="p">2:裝載埠</p>
        <p type="p">2a:第一裝載埠</p>
        <p type="p">2b:第二裝載埠</p>
        <p type="p">2c:第三裝載埠</p>
        <p type="p">3:電漿處理室</p>
        <p type="p">4:處理液供給室</p>
        <p type="p">5:接合室</p>
        <p type="p">11:第一搬運室</p>
        <p type="p">12:第二搬運室</p>
        <p type="p">13:第三搬運室</p>
        <p type="p">14:第四搬運室</p>
        <p type="p">21:第一對準器</p>
        <p type="p">22:第一中繼台</p>
        <p type="p">23:第二中繼台</p>
        <p type="p">24:第三中繼台</p>
        <p type="p">25:第四中繼台</p>
        <p type="p">30:控制部</p>
        <p type="p">31:顯示部</p>
        <p type="p">31a:顯示部</p>
        <p type="p">31b:顯示部</p>
        <p type="p">40:羥基測定部</p>
        <p type="p">CA1至CA3:承載器</p>
        <p type="p">RB1:第一搬運機器人</p>
        <p type="p">RB1a:軌道</p>
        <p type="p">RB2:第二搬運機器人</p>
        <p type="p">RB3:第三搬運機器人</p>
        <p type="p">RB4:第四搬運機器人</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1970" publication-number="202617651">
    <tif-files tif-type="multi-tif">
      <tif file="114132570.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、光酸產生劑、化學增幅阻劑組成物、及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, PHOTO-ACID GENERATOR, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C25/18</main-classification>
        <further-classification edition="200601120260202B">C07C309/17</further-classification>
        <further-classification edition="200601120260202B">C07C309/75</further-classification>
        <further-classification edition="200601120260202B">C07C381/00</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D307/93</further-classification>
        <further-classification edition="200601120260202B">C07D327/08</further-classification>
        <further-classification edition="200601120260202B">C07D333/54</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C09K3/00</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，溶劑溶解性優良，雖控制酸擴散但仍為高感度、高對比度，且微影性能優良的化學增幅阻劑組成物中所含之使用作為光酸產生劑的鎓鹽、由該鎓鹽構成的光酸產生劑、含有該光酸產生劑之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鎓鹽，其特徵為：係以下述通式(1)表示。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="179px" width="418px" file="ed10313.JPG" alt="ed10313.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an onium salt, wherein the onium salt is represented by the following general formula (1). This provides: an onium salt used in a chemically amplified resist composition as a photo-acid generator having excellent solvent solubility, having high sensitivity and high contrast while also suppressing acid diffusion, and having excellent lithography performance in photolithography using high-energy beams; a photo-acid generator consisting of the onium salt; a chemically amplified resist composition containing the photo-acid generator; and a patterning process using the chemically amplified resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="394px" file="ed10314.JPG" alt="ed10314.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1971" publication-number="202617477">
    <tif-files tif-type="multi-tif">
      <tif file="114132571.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液壓控制單元及跨騎式車輛</chinese-title>
        <english-title>HYDRAULIC PRESSURE CONTROL UNIT AND STRADDLE-TYPE VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">B60T8/17</main-classification>
        <further-classification edition="200601120260128B">B60T13/66</further-classification>
        <further-classification edition="200601120260128B">B60R16/03</further-classification>
        <further-classification edition="200601120260128B">H02M3/156</further-classification>
        <further-classification edition="200601120260128B">B62L3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田祐希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能使液壓控制機構之組件之輸出提高之液壓控制單元。  &lt;br/&gt;液壓控制單元10，具備：基體60、被組入於該基體60且包含用於控制剎車液壓的組件的液壓控制機構、控制組件之動作的控制電路73、將搭載於自動二輪車1之車載電源91與控制電路73電氣連接的第1電源線L1、以及將車載電源91與組件電氣連接的第2電源線L2，第1電源線L1具有將自車載電源91供應之電壓轉換成使控制電路73作動之第1作動電壓的降壓電路92，並將第1作動電壓供應給控制電路73，第2電源線L2將比第1作動電壓高之電壓供應給組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hydraulic pressure control unit capable of improving output of a component of a hydraulic pressure control mechanism is provided. &lt;br/&gt;A hydraulic pressure control unit 10 includes a base body 60, a hydraulic pressure control mechanism, a control circuit 73, a first power line L1, and a second power line L2. The hydraulic pressure control mechanism is incorporated in the base body 60 and includes a component that controls brake hydraulic pressure. The control circuit 73 controls operation of the component. The first power line L1 electrically couples an in-vehicle power supply 91 installed to a two-wheeled motorcycle 1 and the control circuit 73 to one another. The second power line L2 electrically couples the in-vehicle power supply 91 and the component to one another. The first power line L1 includes a voltage reducing circuit 92 that converts voltage supplied from the in-vehicle power supply 91 into a first actuation voltage for actuation of the control circuit 73, and supplies the first actuation voltage to the control circuit 73. The second power line L2 supplies voltage higher than the first actuation voltage to the component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">42a:第1線圈(組件)</p>
        <p type="p">42b:第2線圈(組件)</p>
        <p type="p">42c:第3線圈(組件)</p>
        <p type="p">42d:第4線圈(組件)</p>
        <p type="p">50:馬達(組件)</p>
        <p type="p">71:控制器</p>
        <p type="p">72:印刷電路板(基板)</p>
        <p type="p">73:控制電路</p>
        <p type="p">90:電源電路</p>
        <p type="p">91:車載電源</p>
        <p type="p">92:降壓電路(第1轉換部)</p>
        <p type="p">93:升壓電路(第2轉換部)</p>
        <p type="p">94:開關元件</p>
        <p type="p">95:開關驅動電路</p>
        <p type="p">L1:第1電源線</p>
        <p type="p">L2:第2電源線</p>
        <p type="p">L3:第3電源線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1972" publication-number="202617619">
    <tif-files tif-type="multi-tif">
      <tif file="114132581.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃積層體之製造方法及玻璃積層體</chinese-title>
        <english-title>METHOD FOR MANUFACTURING GLASS LAMINATE AND GLASS LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C03C3/076</main-classification>
        <further-classification edition="200601120260130B">G02F1/017</further-classification>
        <further-classification edition="201501120260130B">G02B1/113</further-classification>
        <further-classification edition="200601120260130B">C03C3/078</further-classification>
        <further-classification edition="200601120260130B">C03C3/083</further-classification>
        <further-classification edition="200601120260130B">C03C17/06</further-classification>
        <further-classification edition="200601120260130B">B32B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下暢彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, NOBUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之玻璃積層體之製造方法係於玻璃基板形成包含高折射率材料之膜，由上述膜形成超表面結構，上述玻璃基板之鹼金屬元素之總量以質量基準計為200 ppm以下，50～200℃下之上述玻璃基板與結晶化前之上述高折射率材料之平均CTE之差為±0.5 ppm/K以內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1973" publication-number="202617590">
    <tif-files tif-type="multi-tif">
      <tif file="114132585.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132585</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C01B21/20</main-classification>
        <further-classification edition="200601120260202B">C07C53/10</further-classification>
        <further-classification edition="200601120260202B">C07C53/122</further-classification>
        <further-classification edition="200601120260202B">C07C53/124</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D327/08</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08F220/30</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供可獲得改善圖案形成時之解析度，且LER、解析度、圖案忠實性及劑量寬容度經改善之阻劑圖案的化學增幅正型阻劑組成物，及阻劑圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種化學增幅正型阻劑組成物，含有：  &lt;br/&gt;(A)淬滅劑，由下式(A)表示之鎓鹽構成，  &lt;br/&gt;(B)基礎聚合物，包含含有下式(B1)表示之重複單元，且因酸的作用而分解並增加對鹼顯影液之溶解度的聚合物，及  &lt;br/&gt;(C)光酸產生劑。  &lt;br/&gt;&lt;img align="absmiddle" height="44px" width="169px" file="ed10218.JPG" alt="ed10218.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，Xq&lt;sup&gt;-&lt;/sup&gt;為陰離子。惟，以Xq&lt;sup&gt;-&lt;/sup&gt;作為共軛鹼之酸(XqH)，其沸點未達165℃且分子量為150以下。  &lt;br/&gt;&lt;img align="absmiddle" height="181px" width="343px" file="ed10219.JPG" alt="ed10219.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemically amplified positive resist composition comprising (A) a quencher in the form of an onium salt containing an anion (Xq-) which forms a conjugate acid (XqH) having a boiling point of lower than 165°C and a molecular weight of up to 150, (B) a base polymer, and (C) a photoacid generator exhibits a high resolution and forms a pattern of satisfactory profile with low LER, fidelity and improved dose margin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1974" publication-number="202618958">
    <tif-files tif-type="multi-tif">
      <tif file="114132605.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於工具上過程監控和工具控制的基於因果關係的特徵學習</chinese-title>
        <english-title>CAUSALITY-BASED FEATURE LEARNING FOR ON-TOOL PROCESS MONITORING AND TOOL CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/66</main-classification>
        <further-classification edition="200601120260131B">G01N21/25</further-classification>
        <further-classification edition="202301120260131B">G06F18/21</further-classification>
        <further-classification edition="201901120260131B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴提亞　新哈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATIA, SIDHARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述的實施例涉及一種方法，包括從複數個基板獲取光譜資料集和關鍵尺寸（CD）資料集，並通過特徵提取流程從光譜資料集中提取光譜特徵，及從CD資料集中提取CD特徵。在某一個實施例中，方法進一步包括對光譜特徵實施第一徑向基分解流程，對CD特徵實施第二徑向基分解流程，以得出光譜徑向基分解係數和CD徑向基分解係數，並基於時間趨勢識別光譜徑向基分解係數與CD徑向基分解係數之間的因果關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to a method that includes obtaining a set of spectral data and a set of critical dimension (CD) data from a plurality of substrates, and extracting a spectral feature from the set of spectral data and a CD feature from the set of CD data with a feature extraction process. In an embodiment, the method further comprises implementing a first radial basis decomposition process on the spectral feature and a second radial basis decomposition process on the CD feature to develop a spectral radial basis decomposition coefficient and CD radial basis decomposition coefficient, and identifying a causal relationship between the spectral radial basis decomposition coefficient and the CD radial basis decomposition coefficient based on a temporal trend.</p>
      </isu-abst>
      <representative-img>
        <p type="p">670:製程</p>
        <p type="p">671:操作</p>
        <p type="p">672:操作</p>
        <p type="p">673:操作</p>
        <p type="p">674:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1975" publication-number="202617899">
    <tif-files tif-type="multi-tif">
      <tif file="114132621.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617899</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴墨墨水組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260202B">C09D11/30</main-classification>
        <further-classification edition="201401120260202B">C09D11/36</further-classification>
        <further-classification edition="200601120260202B">H05B33/10</further-classification>
        <further-classification edition="202301120260202B">H10K50/15</further-classification>
        <further-classification edition="202301120260202B">H10K50/16</further-classification>
        <further-classification edition="202301120260202B">H10K50/17</further-classification>
        <further-classification edition="202301120260202B">H10K71/13</further-classification>
        <further-classification edition="202301120260202B">H10K71/15</further-classification>
        <further-classification edition="202301120260202B">H10K85/60</further-classification>
        <further-classification edition="201101120260202B">B82Y20/00</further-classification>
        <further-classification edition="201101120260202B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田久保千晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKUBO, CHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田徹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田忠俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TADATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種技術，其使用於包含發光元件之層的形成且有助於提升包含含金屬的奈米材料之噴墨墨水組成物的吐出性及提升該組成物中之含金屬的奈米材料的分散性。本實施形態之噴墨墨水組成物包含：含金屬的奈米材料，其係由選自由電洞注入材料、電洞輸送材料、電子輸送材料及電極材料組成之群組中之材料所構成；與分散介質，其包含二醇系溶劑與非醇系溶劑，在25℃之體積彈性模數為2.0GPa以上2.7GPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1976" publication-number="202618597">
    <tif-files tif-type="multi-tif">
      <tif file="114132636.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在分散式材料測試系統中傳輸測試檔案</chinese-title>
        <english-title>TRANSFERRING TEST FILES IN DISTRIBUTED MATERIAL TESTING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260128B">G06F21/62</main-classification>
        <further-classification edition="201901120260128B">G06F16/176</further-classification>
        <further-classification edition="200601120260128B">G01N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱薩　丹尼爾文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAESAR, DANIEL VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼可　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICOL, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORSE, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述分散式材料測試系統的實例，該等分散式材料測試系統允許使用者在使用不同資料集的使用者群組（亦即，團隊）之間傳輸檔案。在一些實例中，分散式材料測試系統使用集中式資料儲存庫，該集中式資料儲存庫被分離成相異資料集（及/或資料分區），使得一個團隊所使用的資料集無法由任何其他團隊存取。使用者將檔案傳輸給不同團隊的其他使用者的能力提供了一種跨團隊資料分區共享及/或複製檔案而同時仍保持資料分區完整的方式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are examples of distributed material testing systems that allow users to transfer files between user groups (i.e., teams) that use different data sets. In some examples, the distributed material testing systems use a centralized data repository that is separated into distinct data sets (and/or data partitions), such that the data set used by one team is not accessible by any other team. The ability for users to transfer files to other users on different teams provides a way for files to be shared and/or copied across team data partitions, while still keeping the data partitions intact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600c:GUI</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1977" publication-number="202617260">
    <tif-files tif-type="multi-tif">
      <tif file="114132657.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣固接觸裝置</chinese-title>
        <english-title>GAS SOLID CONTACTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B01J8/24</main-classification>
        <further-classification edition="200601120260130B">B01J8/44</further-classification>
        <further-classification edition="200601120260130B">B01D45/12</further-classification>
        <further-classification edition="200601120260130B">B07B4/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商伊爾金斯私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YILKINS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾特沃特　埃弗特　簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLTVOORT, EVERT-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯格曼　彼得　克里斯蒂安　阿爾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERGMAN, PETER CHRISTIAAN ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於藉由與一氣流接觸來處理一微粒材料流之裝置(10)包括一殼體(12)，該殼體(12)界定一處理腔室(18)及配置在該處理腔室(18)下方之一充氣部(20)，其等藉由一氣體分配板(30)分離，其中該處理腔室(18)界定用於該微粒材料流與該氣流之間之接觸之一接觸路徑(22)，該接觸路徑(22)包括複數個區段，其中區段(36；38’；38’’；40)藉由具備一傳送通路(48；48’；48’’)之一隔板(34；34’；34’’)彼此分離。該氣體分配板(30)具備氣體開口(32)，該等氣體開口(32)經構形以容許該氣流從該充氣部(20)通過至該處理腔室(18)，以在沿著該接觸路徑(22)之一移位方向上建置微粒生物質材料之一移位。該氣體分配板(30)包括至少一個廢料排出開口(60)，該至少一個廢料排出開口(60)經構形用於容許微粒通過至一排出單元(64)且具有大於該等氣體開口(32)之一大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device (10) for processing a flow of particulate material by contact with a gas flow comprises a housing (12) defining a processing chamber (18) and a plenum (20) arranged below the processing chamber (18) separated by a gas distribution plate (30), wherein the processing chamber (18) defines a contact path (22) for contact between the flow of particulate material and the gas flow, the contact path (22) comprising a plurality of sections, wherein sections (36;38’; 38’’; 40) are separated from one another by a partition (34; 34’; 34’’) provided with a transfer passage (48; 48’; 48’’). The gas distribution plate (30) is provided with gas openings (32) configured to allow passage of the gas flow from the plenum (20) to the processing chamber (18) to establish a displacement of particulate biomass material in a displacement direction along the contact path (22). The gas distribution plate (30) comprises at least one reject discharge opening (60) configured for allowing passage of particulates to a discharge unit (64) and having a size larger than the gas openings (32).</p>
      </isu-abst>
      <representative-img>
        <p type="p">26:氣體入口</p>
        <p type="p">30:氣體分配板</p>
        <p type="p">32:氣體開口</p>
        <p type="p">34:隔板</p>
        <p type="p">60:廢料排出開口</p>
        <p type="p">62:廢料通道</p>
        <p type="p">64:收集單元</p>
        <p type="p">66:氣體噴嘴</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1978" publication-number="202618349">
    <tif-files tif-type="multi-tif">
      <tif file="114132667.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏光膜、光學積層體及有機EL顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">G02B5/30</main-classification>
        <further-classification edition="200601120260131B">C09B31/02</further-classification>
        <further-classification edition="200601120260131B">C09K9/02</further-classification>
        <further-classification edition="200601120260131B">C08J5/18</further-classification>
        <further-classification edition="202301120260131B">H10K50/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高永幸佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAE, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西島孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIJIMA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森浦透成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIURA, YUKINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋下田貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGETA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中興一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KOUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可抑制染色不均且具有優異光學耐久性之偏光膜、光學積層體及有機EL顯示裝置。本發明實施形態之偏光膜包含有聚乙烯醇系樹脂及有機染料。該偏光膜之厚度為10µm以下。該偏光膜之單體透射率為45%以上。該偏光膜之偏光度為95%以下。該有機染料包含有第1染料，該第1染料係具有下述式(1)所示脲骨架之偶氮化合物或其鹽。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="655px" file="ed10484.JPG" alt="ed10484.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:偏光板</p>
        <p type="p">11:偏光膜</p>
        <p type="p">12:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1979" publication-number="202617927">
    <tif-files tif-type="multi-tif">
      <tif file="114132668.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C09K5/10</main-classification>
        <further-classification edition="200601120260127B">C07C21/18</further-classification>
        <further-classification edition="200601120260127B">H01L23/473</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川上貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野幸希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGANO, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鹽田英史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOTA, HIDEFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱介質，包含下述式(1)所示化合物，且前述熱介質係用於半導體製造裝置中之構成構件之冷卻或加熱。&lt;br/&gt;  Rf&lt;sup&gt;1&lt;/sup&gt;-CH=CH-Rf&lt;sup&gt;2&lt;/sup&gt;　　　(1)&lt;br/&gt;  式(1)中，Rf&lt;sup&gt;1&lt;/sup&gt;為碳原子數3~6之支鏈狀氟烷基，Rf&lt;sup&gt;2&lt;/sup&gt;為碳原子數1~6之氟烷基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1980" publication-number="202618350">
    <tif-files tif-type="multi-tif">
      <tif file="114132672.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏光板及含有該偏光板之圓偏光板</chinese-title>
        <english-title>POLARIZING PLATE AND CIRCULAR POLARIZING PLATE CONTAINING THE POLARIZING PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G02B5/30</main-classification>
        <further-classification edition="200601120260121B">G02F1/13363</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野崎真衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAKI, MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲田清孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INADA, KIYOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永安智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAYASU, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供耐光性優良的偏光板及含有該偏光板的圓偏光板。  &lt;br/&gt;本發明之解決手段為一種偏光板，係從辨識側依序具有樹脂層、貼合層a、水平偏光膜及保護層的偏光板，  &lt;br/&gt;前述水平偏光膜，係與前述保護層相鄰，且其構成係包含有含有聚合性液晶化合物及二色性色素的聚合性液晶組成物的硬化物，並具有0.1至5μm的厚度，  &lt;br/&gt;前述保護層，係含有聚合性化合物的硬化性組成物的硬化物層，  &lt;br/&gt;前述偏光板的水平偏光膜之辨識側的層所構成的積層體，於波長380nm下的穿透率為10%以下，於波長400nm下的穿透率為20%以下，於波長450nm下的穿透率為80%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a polarizing plate with excellent light resistance and a circularly polarizing plate including the same. &lt;br/&gt;The means for solving the problem of the present invention is a polarizing plate which is provided with a resin layer, an adhesive layer a, a horizontal polarizing film, and a protective layer in this order from a viewing side, &lt;br/&gt;wherein the horizontal polarizing film is adjacent to the protective layer, and is a cured product of a polymerizable liquid crystal composition containing a polymerizable liquid crystal compound and a dichroic dye, and has a thickness of 0.1 to 5 μm, &lt;br/&gt;the protective layer is a cured layer of a curable composition containing a polymerizable compound, &lt;br/&gt;and a laminate comprising layers of the polarizing plate closer to the viewing side than the horizontal polarizing film has a transmittance of 10% or less at a wavelength of 380 nm, a transmittance of 20% or less at a wavelength of 400 nm, and a transmittance of 80% or more at a wavelength of 450 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1981" publication-number="202617967">
    <tif-files tif-type="multi-tif">
      <tif file="114132678.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132678</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攪拌裝置及攪拌系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">C12M1/02</main-classification>
        <further-classification edition="200601120260131B">C12M1/36</further-classification>
        <further-classification edition="202201120260131B">B01F27/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松由尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSU, YOSHINAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤彰久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, AKIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川尚樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邉和男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅野伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松澤貴司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日比野雄平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIBINO, YUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本攪拌裝置具備：呈中空狀的外部構造物；以及內部構造物，其是配置於外部構造物內，沿水平方向的第一方向延伸，藉此在與外部構造物的內周面之間區劃出收容培養液及空氣的環狀流路，環狀流路具有: 縮小區域，是作為與內部構造物的第一方向正交的水平方向的第二方向一方側的區域；以及擴大區域，是在內部構造物的第二方向另一方側的區域，流路剖面積比縮小區域大，並進一步具備有驅動部，其是對環狀流路的培養液施加外力，使得培養液從擴大區域越過內部構造物的頂部朝向縮小區域流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:攪拌裝置</p>
        <p type="p">10:外部構造物</p>
        <p type="p">L1:液面</p>
        <p type="p">23:空氣供給孔</p>
        <p type="p">A1:培養用空氣</p>
        <p type="p">25:液體供給孔</p>
        <p type="p">C:培養液</p>
        <p type="p">R1:縮小區域</p>
        <p type="p">43:圓筒外周面</p>
        <p type="p">40:內部構造物</p>
        <p type="p">41:旋轉體</p>
        <p type="p">R2:放大區域</p>
        <p type="p">26:液體排出孔</p>
        <p type="p">L2:液面</p>
        <p type="p">24:空氣排出孔</p>
        <p type="p">44a:頂部</p>
        <p type="p">21:外周面</p>
        <p type="p">22:圓筒內周面</p>
        <p type="p">20:圓筒體</p>
        <p type="p">O1:中心軸線</p>
        <p type="p">O2:偏心軸線</p>
        <p type="p">50:驅動部</p>
        <p type="p">51:電動機</p>
        <p type="p">44b:底部</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1982" publication-number="202617196">
    <tif-files tif-type="multi-tif">
      <tif file="114132700.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼科透鏡夾持器</chinese-title>
        <english-title>OPHTHALMIC LENS GRIPPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61M1/00</main-classification>
        <further-classification edition="200601120260131B">A61F9/007</further-classification>
        <further-classification edition="200601120260131B">G02C13/00</further-classification>
        <further-classification edition="200601120260131B">G02C7/02</further-classification>
        <further-classification edition="200601120260131B">A61F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商愛爾康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALCON INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈拉斯　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLLAS, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛里特達爾　莫莉莎　柯琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRYTDAL, MELISSA COREEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑茲拉夫　伊多爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JETZLAFF, EDUARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾森諾格　大衛　安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICENOGLE, DAVID ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼庫拉斯　科尼利厄斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICULAS, CORNELIUS DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布林克門　菲力可斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRINCKMANN, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷奈斯奇米德特　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENESCHMIDT, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾韋恩　菲爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAUERWEIN, PHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐曼　喬漢娜絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUMANN, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博朗　馬熙斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAUN, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於夾持眼科透鏡的柔性夾持器頭部包括：夾持部分，該夾持部分佈置在夾持器頭部的縱向遠端處並且包括用於與要夾持的眼科透鏡接觸的凸形接觸表面；安裝部分，該安裝部分佈置在夾持部分的近側；樞轉部分，該樞轉部分佈置在安裝部分與夾持部分之間，其中，夾持部分可圍繞樞轉部分相對於安裝部分柔性地樞轉；以及主真空供應通道。夾持部分包括佈置在夾持器頭部的眼科表面中的至少三個抽吸開口。夾持器頭部進一步包括多個副真空供應通道，該多個副真空供應通道包括流體地連接至主真空供應通道的近端和流體地連接至佈置在凸形接觸表面中的至少三個抽吸開口之一的遠端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flexible gripper head for gripping an ophthalmic lens, comprises a gripping portion arranged at a distal longitudinal end of the gripper head and comprising a convex contact surface for contacting the ophthalmic lens to be gripped, a mounting portion arranged proximal to the gripping portion, a pivot portion arranged between the mounting portion and the gripping portion, wherein the gripping portion is flexibly pivotable with respect to the mounting portion about the pivot portion, and a principal vacuum supply channel. The gripping portion comprises at least three suction openings arranged in the ophthalmic surface of the gripper head. The gripper head further comprises a plurality of secondary vacuum supply channels comprising a proximal end fluidically connected to the principal vacuum supply channel and a distal end fluidically connected to one of the at least three suction openings arranged in the convex contact surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:夾持器頭部</p>
        <p type="p">12:主真空供應通道</p>
        <p type="p">13:副真空供應通道</p>
        <p type="p">14:縱向軸線</p>
        <p type="p">15:樞轉部分</p>
        <p type="p">16:夾持部分</p>
        <p type="p">17:安裝部分</p>
        <p type="p">18a:近側圓錐形部分</p>
        <p type="p">18b:遠側圓錐形部分</p>
        <p type="p">120:真空供應開口</p>
        <p type="p">131:近端</p>
        <p type="p">132:遠端</p>
        <p type="p">160:凸形接觸表面</p>
        <p type="p">161:抽吸開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1983" publication-number="202618980">
    <tif-files tif-type="multi-tif">
      <tif file="114132722.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多級裝置及其控制方法以及晶粒鍵合裝置</chinese-title>
        <english-title>MULTI-STAGE APPARATUS, ITS CONTROL METHOD AND DIE BONDING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01L21/67</main-classification>
        <further-classification edition="200601120251001B">H01L21/687</further-classification>
        <further-classification edition="200601120251001B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商細美事有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亨俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYONGJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李龍埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴奎南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GYUNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種多級裝置及其控制方法以及晶粒鍵合裝置，多級裝置可以包括：夾持部；第一容納部，與所述第一半導體材料的至少一部分相對應地形成以使得能够從第一機械臂接收第一半導體材料；以及第二容納部，與所述第二半導體材料的至少一部分相對應地形成以使得能够從第二機械臂接收第二半導體材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">510:多級裝置</p>
        <p type="p">511:夾持部</p>
        <p type="p">511a:銷孔</p>
        <p type="p">511b:多孔式真空卡盤</p>
        <p type="p">512(A1):升降銷</p>
        <p type="p">513(A2):升降塊</p>
        <p type="p">514:框架</p>
        <p type="p">515:擴展環</p>
        <p type="p">515b:貫通窗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1984" publication-number="202619216">
    <tif-files tif-type="multi-tif">
      <tif file="114132745.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H02H3/20</main-classification>
        <further-classification edition="200601120251201B">H02H7/18</further-classification>
        <further-classification edition="200601120251201B">H02J7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三美電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUMI ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田裕一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下順司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，在搭載有控制二次電池的充放電的積體電路的半導體裝置中，保護積體電路免受施加到外部端子的異常的高電壓的影響。半導體裝置具備：第一外部端子，與二次電池連接；第二外部端子，與所述第一外部端子電性連接，將從所述二次電池接收的電壓輸出到外部；第三外部端子，對外部輸入或輸出信號；第一積體電路，具有控制所述二次電池的充放電並輸入或輸出信號的第一信號端子；以及第二積體電路，具有與所述第三外部端子連接的第二信號端子、與所述第一信號端子連接的第三信號端子、配置在所述第二信號端子與所述第三信號端子之間的第一開關、以及在檢測到所述第二信號端子的過電壓時切斷所述第一開關的過電壓保護電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池保護模組</p>
        <p type="p">110:控制IC</p>
        <p type="p">120:保護IC</p>
        <p type="p">200:電池組</p>
        <p type="p">300:二次電池</p>
        <p type="p">B+、B-:外部端子</p>
        <p type="p">BAT:端子</p>
        <p type="p">C1、C2、C3、C4:電容</p>
        <p type="p">CD、DD:寄生二極體</p>
        <p type="p">CH1A、CH1B:端子</p>
        <p type="p">CH2A、CH2B:端子</p>
        <p type="p">CH3A、CH3B:端子</p>
        <p type="p">COUT:充電控制端子</p>
        <p type="p">DOUT:放電控制端子</p>
        <p type="p">DRV1、DRV2、DRV3:驅動器</p>
        <p type="p">E1、E2:外部端子</p>
        <p type="p">GND1、GND2:接地端子</p>
        <p type="p">IVDD:內部電源線</p>
        <p type="p">LV:低電壓信號</p>
        <p type="p">MODE:模式控制電路</p>
        <p type="p">OVP:過電壓保護電路</p>
        <p type="p">P+、P-:外部端子</p>
        <p type="p">R1、R2、R3、R4:電阻</p>
        <p type="p">REG:電源端子</p>
        <p type="p">S1、S2:端子</p>
        <p type="p">STBY:待機模式信號</p>
        <p type="p">SW1、SW2:開關</p>
        <p type="p">TCNT1、TCNT2:控制信號</p>
        <p type="p">TR1、TR2、TR3、TR4、TR5:電晶體</p>
        <p type="p">UVP:低電壓保護電路</p>
        <p type="p">V1、V2:電壓</p>
        <p type="p">V+:端子</p>
        <p type="p">VDD1、VDD2:電源電壓(電源端子)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1985" publication-number="202618981">
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          <doc-number>202618981</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將半導體元件壓靠在引線接合機上的支撐結構上的夾持最佳化的方法、及相關方法</chinese-title>
        <english-title>METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/67</main-classification>
        <further-classification edition="200601120260126B">H01L23/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商庫利克和索夫工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULICKE AND SOFFA INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁正虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JEONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦　巍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾哈邁德　齊亞烏丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMAD, ZIAUDDIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種使用複數個夾持臂調整一半導體元件壓靠在一引線接合機上的一支撐結構上的夾持的方法，該方法包括以下步驟：（a）在該半導體元件的複數個位置處，檢測該半導體元件相對於該支撐結構的一懸浮指標；以及（b）根據一夾持力設定，基於該步驟（a）的結果，調整該半導體元件壓靠在該支撐結構上的夾持，該夾持力設定執行以下的至少一種（i）對該等夾持臂的每一個施加不同量的力（ii）對該等夾持臂的每一個施加不同的z軸位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine using a plurality of clamp arms, the method comprising the steps of: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a) according to a clamping force profile, the clamping force profile applying at least one of (i) a different amount of force for each of the plurality of clamp arms, and (ii) a different z-axis position for each of the plurality of clamp arms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700,702:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1986" publication-number="202617832">
    <tif-files tif-type="multi-tif">
      <tif file="114132806.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶配向劑、液晶配向膜、及液晶顯示元件以及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08G73/10</main-classification>
        <further-classification edition="200601120260126B">C08L79/08</further-classification>
        <further-classification edition="200601120260126B">C08K5/13</further-classification>
        <further-classification edition="200601120260126B">C08K5/17</further-classification>
        <further-classification edition="200601120260126B">C08K5/20</further-classification>
        <further-classification edition="200601120260126B">C08K5/1515</further-classification>
        <further-classification edition="200601120260126B">C08K5/3445</further-classification>
        <further-classification edition="200601120260126B">C08K5/5419</further-classification>
        <further-classification edition="200601120260126B">C08J5/18</further-classification>
        <further-classification edition="200601120260126B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>別府功一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEPPU, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本泰宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤夏樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供液晶配向劑、液晶配向膜、及液晶顯示元件以及其製造方法，該液晶配向劑能得到密接性優良，且能以高水準抑制AC殘影之液晶配向膜。  &lt;br/&gt;一種液晶配向劑，其含有：含有1種以上之聚合物之聚合物成分(P)、化合物(C1)及化合物(C2)，其中，前述聚合物成分(P)含有選自由聚醯亞胺前驅物、及作為該聚醯亞胺前驅物之醯亞胺化物的聚醯亞胺構成之群組之中至少1種之聚合物(p)。化合物(C1)：具有2個以上之下式(c-1)~(c-1’)之中任一者表示之結構之化合物。化合物(C2)：下式(c-2)~(c-2’)之中任一者表示之化合物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="448px" width="701px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1987" publication-number="202618670">
    <tif-files tif-type="multi-tif">
      <tif file="114132820.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132820</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力成本管理裝置、電力成本管理裝置之控制方法、程式、及電力成本管理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260122B">G06Q50/06</main-classification>
        <further-classification edition="202301120260122B">G06Q10/063</further-classification>
        <further-classification edition="200601120260122B">H02J13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦幸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電力成本管理裝置具備：預想電力市場價格算出部，其基於包含電力之過去之電力市場價格之過去電力市場價格資訊、將來之一定期間中之氣象預報資訊、及包含一定期間中之電力系統之電力使用推測之使用推測資訊，算出一定期間中之預想電力市場價格；預想電力成本算出部，其基於預想電力市場價格算出部算出之預想電力市場價格、及預先設定之生產計畫中之使複數個生產設備將來運轉之運轉排程，算出預想之一定期間之預想電力成本；及設備運轉等級產生部，其基於預想電力成本算出部算出之預想電力成本，產生規定了複數個生產設備中應運轉之生產設備之複數個運轉順序之順位之設備運轉等級。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電力成本管理裝置</p>
        <p type="p">1000:電力成本管理系統</p>
        <p type="p">DB:管理伺服器SV之資料庫</p>
        <p type="p">DB1:生產設備之運轉實績資料庫</p>
        <p type="p">DB2:生產設備之運轉狀態資料庫</p>
        <p type="p">DB3:生產計劃資料庫</p>
        <p type="p">DB4:設備維護計畫資料庫</p>
        <p type="p">DBXa:電力使用量、費用實績資料庫</p>
        <p type="p">DBXb:預報資料收集資料庫</p>
        <p type="p">SV:管理伺服器</p>
        <p type="p">U:產品</p>
        <p type="p">Z:生產設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1988" publication-number="202619208">
    <tif-files tif-type="multi-tif">
      <tif file="114132887.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射脈衝產生系統</chinese-title>
        <english-title>LASER PULSE GENERATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01S3/0959</main-classification>
        <further-classification edition="201401120260120B">B23K26/06</further-classification>
        <further-classification edition="201401120260120B">B23K26/0622</further-classification>
        <further-classification edition="201401120260120B">B23K26/064</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商埃克薩克蒂斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EXAKTIS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　彥偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YANWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩克迪納瓦特　安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKDINAWAT, ANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種雷射脈衝產生系統的系統、方法和裝置，包括：至少一個電子線性加速器，用於加速來自電子源的電子；沿第一電子束路徑佈置的第一波蕩器，用於使沿該第一電子束路徑透過該第一波蕩器的電子發射第一電磁輻射；至少部分與該第一波蕩器重疊的光學空腔，用於將該第一電磁輻射沿第一光學路徑限制在該光學空腔內；以及沿第二電子束路徑佈置的第二波蕩器，該第二電子束路徑與該第一電子束路徑不同，該第二波蕩器配置為使沿該第二電子束路徑移動的電子發射第二電磁輻射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, methods, and apparatus are described for a laser pulse generation system including at least one electron linear accelerator configured to accelerate electrons from an electron source, a first undulator arranged along a first electron beam path and configured to cause electrons moving along the first electron beam path through the first undulator to emit a first electromagnetic emission, an optical cavity at least partially overlapping with the first undulator and configured to confine the first electromagnetic emission within the optical cavity along a first optical path, and a second undulator arranged along a second electron beam path different from the first electron beam path, the second undulator being configured to cause electrons moving along the second electron beam path to emit a second electromagnetic emission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:流程圖</p>
        <p type="p">802-808:流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1989" publication-number="202618059">
    <tif-files tif-type="multi-tif">
      <tif file="114132894.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132894</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體器件製造用基座</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C23C16/54</main-classification>
        <further-classification edition="200601120260116B">H01L21/304</further-classification>
        <further-classification edition="200601120260116B">H01L23/60</further-classification>
        <further-classification edition="200601120260116B">H01L23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
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                <last-name>日商三菱綜合材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>松尾文晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, FUMIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
        </inventors>
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              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">半導體器件製造用基座(1)為由單晶矽或多晶矽所構成的第一面(1a)及第二面(1b)平行的圓板狀，比電阻值可為10Ω･cm以下，在第一面的基板載置面(1a)上形成有1個以上用於容納處理基板的凹部(2)，在其基板載置面側所測定到的翹曲為20μm以下，其翹曲可形成於基板載置面(1a)作為凸部的方向上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">1a:第一面(基板載置面)</p>
        <p type="p">2:凹部</p>
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    </description>
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  <tw-patent-application no="1990" publication-number="202619377">
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      <isuno>9</isuno>
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          <doc-number>202619377</doc-number>
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        <document-id>
          <doc-number>114132895</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>第１通訊裝置、第２通訊裝置、第３通訊裝置、通訊方法及通訊系統</chinese-title>
        <english-title></english-title>
      </invention-title>
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        <main-classification edition="201801120260127B">H04W4/02</main-classification>
        <further-classification edition="202301120260127B">H04W72/23</further-classification>
        <further-classification edition="200901120260127B">H04W48/18</further-classification>
        <further-classification edition="200901120260127B">H04W24/10</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小見聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一態樣所涉及之第1通訊裝置，係具有：送訊部，係將包含有用來特定出感測之參加者所需之特定資訊、和用來指定感測方法所需之指定資訊在內的第1感測請求，發送至第2通訊裝置；和收訊部，係從前記第2通訊裝置接收感測結果的相關資訊，該感測結果是基於，藉由基於前記第1感測請求而被特定之前記參加者，使用前記感測方法所被感測到之資料而獲得。若依據本揭露之一態樣，則可適切地利用無線感測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:UE</p>
        <p type="p">20:BS</p>
        <p type="p">30:NF伺服器</p>
        <p type="p">40:應用程式伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1991" publication-number="202619378">
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        <document-id>
          <doc-number>114132896</doc-number>
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      <invention-title>
        <chinese-title>第１通訊裝置、第２通訊裝置、第３通訊裝置、通訊方法及通訊系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260127B">H04W4/02</main-classification>
        <further-classification edition="202301120260127B">H04W72/23</further-classification>
        <further-classification edition="200901120260127B">H04W24/10</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小見聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊入菜那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUIRE, NANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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        <p type="p">本揭露之一態樣所涉及之第1通訊裝置，係具有：收訊部，係將控制資訊予以接收，該控制資訊係表示：包含有感測方法及感測品質之至少1者在內的感測要領；和送訊部，係將前記感測要領的執行之指示所需之指示資訊，發送至第2通訊裝置。若依據本揭露之一態樣，則可適切地利用無線感測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
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  <tw-patent-application no="1992" publication-number="202617977">
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      <isuno>9</isuno>
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        <document-id>
          <doc-number>114132913</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>傳訊增強之經工程改造之細胞及其使用方法</chinese-title>
        <english-title>SIGNALING-ENHANCED ENGINEERED CELLS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260116B">C12N5/078</main-classification>
        <further-classification edition="201001120260116B">C12N5/0783</further-classification>
        <further-classification edition="201501120260116B">A61K35/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商諾奇治療（加拿大）公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOTCH THERAPEUTICS (CANADA) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆魯甘　達里尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURUGAN, DHAARINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤　賈斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, JUSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢卓瑟卡朗　錫達斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRASEKARAN, SIDDARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽西比　克里斯托弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAXBY, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普羅查卡　蘿拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROCHAZKA, LAURA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞布拉罕　黎賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABRAHAM, LIBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡迭　麥可　杭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CADELL, MICHAEL HUNTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渥　瓦萊瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALL, VALERIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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        <p type="p">本揭露提供細胞激素傳訊受體以在諸如 iPSC 衍生之 CD8+ T 細胞的細胞中提供 STAT3 及 STAT5 傳訊。該等細胞激素傳訊受體可處於內源性或外源性啟動子之控制下，以調節其在細胞中之表現。本揭露亦提供包含該等細胞激素傳訊受體或細胞激素傳訊受體與分泌的細胞激素之組合的經工程改造之細胞，以及該等經工程改造之細胞的使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides cytokine signaling receptors to provide STAT3 and STAT5 signaling in cells such as iPSC-derived CD8+ T cells. The cytokine signaling receptors may be under the control of endogenous or exogenous promoters to regulate their expression in a cell. The present disclosure also provides engineered cells comprising the cytokine signaling receptors, or a combination of a cytokine signaling receptor and a secreted cytokine, as well as methods of use of the engineered cells.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
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  <tw-patent-application no="1993" publication-number="202618208">
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        <document-id>
          <doc-number>114132915</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>防彈系統</chinese-title>
        <english-title>BALLISTIC PROTECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">F41H1/02</main-classification>
        <further-classification edition="200601120260115B">F41H5/04</further-classification>
        <further-classification edition="200601120260115B">A44B11/25</further-classification>
        <further-classification edition="200601120260115B">A41D13/05</further-classification>
        <further-classification edition="200601120260115B">A41D27/00</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商梅勒瓦利歐系統有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEHLER VARIO SYSTEM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米羅諾瓦　塔蒂亞娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRONOVA, TATYANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種防彈系統，其具有  &lt;br/&gt;-一防彈背心，其包含  &lt;br/&gt;o 一第一後裝甲（12），  &lt;br/&gt;o 一第一前裝甲（2），以及  &lt;br/&gt;o 一前蓋，其可進入一開啟狀態及一閉合狀態，且其在處於一閉合狀態時覆蓋該第一前裝甲（2），以及  &lt;br/&gt;-一外裝甲，其包含  &lt;br/&gt;o 一第二後裝甲，以及  &lt;br/&gt;o 一第二前裝甲，  &lt;br/&gt;其中該第一後裝甲（12）經由一第一肩帶（10）連接至該第一前裝甲（2）且經由一第二肩帶（22）連接至該前蓋，並且該第二後裝甲經由另外兩個肩帶連接至該第二前裝甲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a ballistic protection system with &lt;br/&gt;- a ballistic protective vest comprising &lt;br/&gt;o a first back armor (12), &lt;br/&gt;o a first front armor (2) and &lt;br/&gt;o a front cover, which can be brought into an open and a closed state and which, when in a closed state, covers the first front armor (2), and &lt;br/&gt;- an over-armor comprising &lt;br/&gt;o a second back armor and &lt;br/&gt;o a second front armor, &lt;br/&gt;wherein the first back armor (12) is connected to the first front armor (2) via a first shoulder strap (10) and to the front cover via a second shoulder strap (22), and the second back armor is connected to the second front armor via two further shoulder straps.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:第一前裝甲</p>
        <p type="p">4:第一側元件</p>
        <p type="p">6:第二側元件</p>
        <p type="p">8:拉鏈</p>
        <p type="p">10:第一肩帶</p>
        <p type="p">12:第一後裝甲</p>
        <p type="p">14:連接突片</p>
        <p type="p">16:魔術貼元件</p>
        <p type="p">18:相對元件</p>
        <p type="p">22:第二肩帶</p>
        <p type="p">28:連接件</p>
        <p type="p">30:突片</p>
        <p type="p">32:突片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1994" publication-number="202617952">
    <tif-files tif-type="multi-tif">
      <tif file="114132918.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>潤滑脂組成物及潤滑脂封入軸承</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C10M169/02</main-classification>
        <further-classification edition="200601120260202B">C10M115/08</further-classification>
        <further-classification edition="200601120260202B">C10M117/02</further-classification>
        <further-classification edition="200601120260202B">F16C33/66</further-classification>
        <further-classification edition="200601320260202B">C10N10/02</further-classification>
        <further-classification edition="200601320260202B">C10N10/04</further-classification>
        <further-classification edition="200601320260202B">C10N20/02</further-classification>
        <further-classification edition="200601320260202B">C10N30/02</further-classification>
        <further-classification edition="200601320260202B">C10N30/06</further-classification>
        <further-classification edition="200601320260202B">C10N40/02</further-classification>
        <further-classification edition="200601320260202B">C10N50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＴＮ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NTN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小畑智彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBATA, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤涼太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDOU, RYOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題係在於提供即使在高速旋轉條件下，亦能防止潤滑脂洩漏，且能抑制軸承內部發熱的潤滑脂組成物、以及封入有該潤滑脂組成物的潤滑脂封入軸承。  &lt;br/&gt;　　用以解決課題之手段為，一種潤滑脂組成物(7)，係為封入於滾動軸承(1)中，且含有基礎油與增稠劑的潤滑脂組成物，其特徵係在於，前述基礎油在40℃下的動態黏度係為12mm&lt;sup&gt;2&lt;/sup&gt;/s以上26mm&lt;sup&gt;2&lt;/sup&gt;/s以下，且在溫度25℃、應變量1×10&lt;sup&gt;-5&lt;/sup&gt;～5×10&lt;sup&gt;-3&lt;/sup&gt;、頻率1Hz下的的儲存彈性率最大值係在6000Pa～50000Pa的範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:角接觸滾珠軸承</p>
        <p type="p">2:內輪</p>
        <p type="p">3:外輪</p>
        <p type="p">4:滾珠(滾動體)</p>
        <p type="p">5:保持器</p>
        <p type="p">6:密封構件</p>
        <p type="p">7:潤滑脂組成物</p>
        <p type="p">α:接觸角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1995" publication-number="202618392">
    <tif-files tif-type="multi-tif">
      <tif file="114132919.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄層片移設裝置及薄層片之移設方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G02B21/34</main-classification>
        <further-classification edition="200601120251001B">G01N1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一宮豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKKU, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在從試料(SAM)取得薄層片(LM)之際，抑制鑷子(16)或薄層片(LM)碰撞到試料(SAM)，並抑制薄層片(LM)的位置偏移。在將薄層片(LM)藉由鑷子(16)而予以夾持後，朝著從薄層片(LM)的端部(LMa)往薄層片(LM)的端部(LMb)之方向，令鑷子(16)做移動。其後，以使得薄層片(LM)會從試料(SAM)的連接部(SAMa)分離的方式，令鑷子(16)做移動，以從試料(SAM)取得薄層片(LM)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1996" publication-number="202617025">
    <tif-files tif-type="multi-tif">
      <tif file="114132920.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備</chinese-title>
        <english-title>CLEANING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/24</main-classification>
        <further-classification edition="200601120260130B">A47L11/40</further-classification>
        <further-classification edition="200601120260130B">B25J9/12</further-classification>
        <further-classification edition="200601120260130B">B25J9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔設備。清潔設備包括：機器主體，機器主體開設有臂倉，臂倉設置有倉口；機械臂，機械臂與機器主體連接，並通過倉口可伸出或收納至臂倉；觸動組件，觸動組件設置在機器主體上，位於倉口周側，觸動組件配置為受到機械應力發送訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a cleaning device. The cleaning device includes: a machine body, which is equipped with an arm compartment that has an opening; a robotic arm that is connected to the machine body and can extend or retract into the arm compartment through the opening; and an actuation component, which is installed on the machine body, located around the opening, and configured to send a signal in response to mechanical stress.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔設備</p>
        <p type="p">110:機器主體</p>
        <p type="p">111:臂倉</p>
        <p type="p">121:觸動件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1997" publication-number="202617035">
    <tif-files tif-type="multi-tif">
      <tif file="114132921.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備</chinese-title>
        <english-title>CLEANING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/282</further-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔設備。清潔設備包括：機器主體；位於機器主體的底部的至少兩個驅動輪，驅動輪轉動用於帶動機器主體移動；位於機器主體底部的輔助輪，輔助輪相對於至少兩個驅動輪之間的連線位於機器主體的後側，輔助輪與機器主體活動連接並可在第一位置和第二位置之間切換，其中，輔助輪處於第二位置時低於其處於第一位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a cleaning device. The cleaning device includes: a machine body; at least two driving wheels located at the bottom of the machine body, which rotate to drive the machine body to move; and an auxiliary wheel located at the bottom of the machine body, positioned at the rear side of the machine body relative to the connection between the at least two driving wheels. The auxiliary wheel is movably connected to the machine body and can switch between a first position and a second position, wherein the auxiliary wheel is lower when in the second position than when in the first position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔設備</p>
        <p type="p">110:機器主體</p>
        <p type="p">112:收納槽</p>
        <p type="p">113:從動輪安裝槽</p>
        <p type="p">120:驅動輪</p>
        <p type="p">130:輔助輪</p>
        <p type="p">140:連接臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1998" publication-number="202617764">
    <tif-files tif-type="multi-tif">
      <tif file="114132935.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＴＬ１Ａ抗體及其用途</chinese-title>
        <english-title>ANTIBODIES AGAINST TL1A AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C07K16/18</main-classification>
        <further-classification edition="200601120260114B">A61K39/395</further-classification>
        <further-classification edition="200601120260114B">A61P37/00</further-classification>
        <further-classification edition="200601120260114B">A61P35/00</further-classification>
        <further-classification edition="200601120260114B">A61P3/00</further-classification>
        <further-classification edition="200601120260114B">A61P19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商埃蘭迪爾實驗室有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EARENDIL LABS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　禎平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHENPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇晨鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHENPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冉昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAN, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種分離的抗原結合片段，其能夠特異性結合TNF樣蛋白A(TL1A)，其包含重鏈可變區(VH)，其中該VH包含至少一個重鏈互補決定區(HCDR)，其包含選自SEQ ID NO：1、SEQ ID NO：5和SEQ ID NO：14中所示的胺基酸序列的胺基酸序列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an isolated antigen-binding protein specifically binding to TNF-like protein A (TL1A), comprising a heavy chain variable region (VH) comprising at least one heavy chain complementarity-determining region (HCDR) comprising an amino acid sequence shown in SEQ ID NO:1, SEQ ID NO:5, or SEQ ID NO:14.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1999" publication-number="202617524">
    <tif-files tif-type="multi-tif">
      <tif file="114132953.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人機場行李處理系統</chinese-title>
        <english-title>ROBOTIC AIRPORT BAGGAGE HANDLING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B64F1/32</main-classification>
        <further-classification edition="200601120260131B">B65G43/08</further-classification>
        <further-classification edition="200601120260131B">B65G47/90</further-classification>
        <further-classification edition="200601120260131B">B65G65/00</further-classification>
        <further-classification edition="200601120260131B">B25J9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商靈巧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXTERITY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格拉瓦爾　維卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGRAWAL, VIKAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石　月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ZW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅農　薩米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENON, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭詠翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種機器人行李處理系統。該系統自一或多個感測器接收資料，並使用自該一或多個感測器接收之感測器資料來產生一行李處理工作空間之一三維視圖，以產生並實施使用一或多個機器人臂根據需要拾取及放置行李物品之一計畫以進行以下之一或兩者：(1)將行李物品自一第一行李傳送帶裝載至一手推車、單位裝載裝置(ULD)或其他容器中或上；及(2)自一手推車、單位裝載裝置(ULD)或其他容器移除行李物品，並將各物品放置在一第二行李傳送帶上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robotic baggage handlings system is disclosed. The system receives data from one or more sensors and uses sensor data received from the one or more sensors to generate a three-dimensional view of a baggage handling workspace to generate and implement a plan to use one or more robotic arms to pick and place baggage items as needed to do one or both of (1) load baggage items from a first baggage conveyor into or onto a trolley, Unit Load Device (ULD), or other container; and (2) remove baggage items from a trolley, Unit Load Device (ULD), or other container and place each on a second baggage conveyor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:移動機器人</p>
        <p type="p">104:相機</p>
        <p type="p">106:物品</p>
        <p type="p">108:飛機</p>
        <p type="p">110:行李傳送帶</p>
        <p type="p">112:行李手推車</p>
        <p type="p">114:路徑</p>
        <p type="p">116:機器人</p>
        <p type="p">118:傳送帶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2000" publication-number="202618502">
    <tif-files tif-type="multi-tif">
      <tif file="114132966.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132966</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換電路的控制器及其輸出級的控制方法</chinese-title>
        <english-title>CONTROLLER AND METHOD OF CONTROLLING OUTPUT STAGE OF POWER CONVERSION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05F1/565</main-classification>
        <further-classification edition="200601120260102B">H02M1/08</further-classification>
        <further-classification edition="200601120260102B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力智電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPI SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銀康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIN-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉東閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TUNG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電源轉換電路的控制器及其輸出級的控制方法。控制器耦接輸出級並提供脈寬調變訊號控制輸出級產生輸出電壓及輸出電流。控制器包括控制電路、模式判斷電路及調整電路。控制電路耦接輸出級並產生脈寬調變訊號至輸出級。模式判斷電路耦接輸出級。在電源轉換電路進入輕載模式時，模式判斷電路根據輸出電流產生啟用訊號。調整電路分別耦接輸出級、模式判斷電路及控制電路。在啟用訊號啟用調整電路時，調整電路根據與輸出電壓相關的回授電壓及第一參考值產生第一調整訊號至控制電路，以調整脈寬調變訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A controller and a method of controlling an output stage of a power conversion circuit are disclosed. The controller, coupled to an output stage, provides a PWM signal to control output stage to generate an output voltage and an output current. The controller includes a control circuit, a mode determination circuit and an adjustment circuit. The control circuit, coupled to the output stage, generates the PWM signal to the output stage. When the power conversion circuit enters light-load mode, the mode determination circuit generates an enable signal according to the output current. The adjustment circuit is coupled to the output stage, mode determination circuit and control circuit respectively. When the adjustment circuit is activated by the enable signal, the adjustment circuit generates a first adjustment signal to the control circuit according to a feedback voltage related to output voltage and a first reference value to adjust the PWM signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:電源轉換電路</p>
        <p type="p">30:控制器</p>
        <p type="p">300:控制電路</p>
        <p type="p">302:模式判斷電路</p>
        <p type="p">304:調整電路</p>
        <p type="p">306:補償電路</p>
        <p type="p">OS:輸出級</p>
        <p type="p">TR:比較結果</p>
        <p type="p">PWM:脈寬調變訊號</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">ISEN:輸出電流</p>
        <p type="p">EN:啟用訊號</p>
        <p type="p">VFB:反饋電壓</p>
        <p type="p">VREF1:第一參考值</p>
        <p type="p">VREF2:第二參考值</p>
        <p type="p">ADJ1:第一調整訊號</p>
        <p type="p">ADJ2:第二調整訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2001" publication-number="202619110">
    <tif-files tif-type="multi-tif">
      <tif file="114132974.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132974</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腐蝕隔離電極陣列組件</chinese-title>
        <english-title>CORROSION ISOLATING ELECTRODE ARRAY ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">H01L23/522</main-classification>
        <further-classification edition="200601120260129B">C23F13/00</further-classification>
        <further-classification edition="200601120260129B">H05K1/11</further-classification>
        <further-classification edition="200601120260129B">A61N1/05</further-classification>
        <further-classification edition="200601120260129B">G01N27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商結構8實驗室股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FABRIC8LABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼科爾　瑞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHOLL, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福勒　傑拉斯　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOWLER-GERACE, LEWIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙伊克　卡里穆拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAIK, KAREEMULLAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAIN, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷特　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHITE, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及腐蝕隔離電極陣列組件。一種電極陣列組件(101)，其包括具有電極(111)的電極陣列(113)、連接電路(115)和供電層(200)，該供電層被配置為向連接電路(115)供應電力(270)。供電層(200)包括由至少兩種導電材料製成的條帶(203A、203B)。條帶(203A、203B)的每一個包括段(202A、202B)，每個段電耦接至相應的兩個電極(111)並在它們之間延伸。供電層(200)進一步包括直通開口，每個直通開口都限定在相鄰的段(202A、202B)之間。連接電路(115)可選擇性地控制，以將電力(270)從供電層(200)供應到一個或多個電極(111)。至少一些段(202A、202B)中的每一個包括在相應的兩個電極(111)之間的腐蝕-隔離橋(210)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode array assembly (101) includes an electrode array (113) having electrodes (111), connection circuits (115), and a power supply layer (200) configured to supply electrical power (270) to the connection circuits (115). The power supply layer (200) includes strips (203A, 203B) made of at least two electrically conductive materials. Each one of the strips (203A, 203B) includes segments (202A, 202B) each electrically coupled to and extending between a corresponding two of the electrodes (111). The power supply layer (200) further includes pass-through openings each defined between adjacent ones of the segments (202A, 202B). The connection circuits (115) are selectively controllable to supply the electrical power (270) from the power supply layer (200) to one or more of the electrodes (111). Each one of at least some of the segments (202A, 202B) includes a corrosion-isolation bridge (210) between the corresponding two of the electrodes (111).&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電化學沉積系統</p>
        <p type="p">101:電極陣列組件</p>
        <p type="p">105:陰極</p>
        <p type="p">110:電解質溶液</p>
        <p type="p">111:電極</p>
        <p type="p">112:基座板</p>
        <p type="p">113:電極陣列</p>
        <p type="p">115:連接電路</p>
        <p type="p">119:電源</p>
        <p type="p">122:控制器</p>
        <p type="p">123:感測器</p>
        <p type="p">130:材料</p>
        <p type="p">131:沉積表面</p>
        <p type="p">191:電沉積池</p>
        <p type="p">200:供電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2002" publication-number="202617610">
    <tif-files tif-type="multi-tif">
      <tif file="114133018.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水處理方法及水處理系統</chinese-title>
        <english-title>WATER TREATMENT METHOD AND WATER TREATMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260119B">C02F1/20</main-classification>
        <further-classification edition="202301120260119B">C02F1/28</further-classification>
        <further-classification edition="202301120260119B">C02F1/30</further-classification>
        <further-classification edition="202301120260119B">C02F1/42</further-classification>
        <further-classification edition="202301120260119B">C02F1/44</further-classification>
        <further-classification edition="202301120260119B">C02F9/00</further-classification>
        <further-classification edition="202301120260119B">C02F3/28</further-classification>
        <further-classification edition="200601320260119B">C02F101/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋悠介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具有：流通第1水W1的第1管線L1、流通第2水W2的第2管線L2、第1管線L1與第2管線L2的匯流部(中間槽)33、連接於中間槽33，且使第1水W1與第2水W2匯流的水W3流通的第3管線L3、及設置於第3管線L3的水處理裝置6的水處理系統1之水處理方法具有：取得第1及第2水W1、W2的中間槽33的入口P1、P2之至少一者的水質參數、及第1及第2水W1、W2的中間槽33之入口P1、P2中的流量參數；以及基於至少一者的水質參數與流量參數來決定水處理裝置6的運轉條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water treatment method in a water treatment system 1 having a first line L1 through which a first water W1 flows, a second line L2 through which a second water W2 flows, a confluence section (intermediate tank) 33 of the first line L1 and the second line L2, a third line L3 which is connected to the intermediate tank 33 and through which flows a water W3 which is the confluence of the first water W1 and the second water W2, and a water treatment device 6 provided in the third line L3, wherein the method includes a step of acquiring at least one water quality parameter at inlets P1 and P2 of the intermediate tank 33 for the first and second waters W1 and W2 respectively, a step of acquiring flow rate parameters at inlets P1 and P2 of the intermediate tank 33 for the first and second waters W1 and W2 respectively, and a step of determining the operating conditions of the water treatment device 6 based on the at least one water quality parameter and the flow rate parameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水處理系統</p>
        <p type="p">2:前處理裝置</p>
        <p type="p">3:純水製造裝置</p>
        <p type="p">4:子系統</p>
        <p type="p">5:使用點</p>
        <p type="p">6:水處理裝置</p>
        <p type="p">7:控制部</p>
        <p type="p">21:過濾器</p>
        <p type="p">22:活性碳塔</p>
        <p type="p">31:離子去除裝置</p>
        <p type="p">32:逆滲透膜裝置</p>
        <p type="p">33:中間槽(匯流部)</p>
        <p type="p">34:第1脫氧裝置</p>
        <p type="p">35:紫外線照射裝置(水處理裝置)</p>
        <p type="p">36:離子交換體填充裝置</p>
        <p type="p">37:第2脫氧裝置</p>
        <p type="p">61,62:第1及第2TOC濃度計(水質參數取得部)</p>
        <p type="p">71,72:第1及第2DO濃度計(水質參數取得部)</p>
        <p type="p">81,82:第1及第2流量計(流量參數取得部)</p>
        <p type="p">D:流通方向</p>
        <p type="p">D1,D2,D3:DO濃度</p>
        <p type="p">F1,F2,F3,F4:流量</p>
        <p type="p">L1:第1管線</p>
        <p type="p">L2:第2管線</p>
        <p type="p">L3:第3管線</p>
        <p type="p">L4:母管</p>
        <p type="p">P1,P2,P4,P5:入口</p>
        <p type="p">P3:分支部</p>
        <p type="p">T1,T2,T3:TOC濃度</p>
        <p type="p">W1:第1水</p>
        <p type="p">W2:第2水</p>
        <p type="p">W3:水</p>
        <p type="p">V1:閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2003" publication-number="202617591">
    <tif-files tif-type="multi-tif">
      <tif file="114133020.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學增幅負型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C01B21/20</main-classification>
        <further-classification edition="200601120260202B">C07C25/18</further-classification>
        <further-classification edition="200601120260202B">C07C53/06</further-classification>
        <further-classification edition="200601120260202B">C07C53/10</further-classification>
        <further-classification edition="200601120260202B">C07C53/122</further-classification>
        <further-classification edition="200601120260202B">C07C53/124</further-classification>
        <further-classification edition="200601120260202B">C07C211/63</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D327/08</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08F220/30</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="201201120260202B">G03F1/24</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供圖案形成時之解像性提升且能獲得LER、解像性、圖案忠實性及劑量寬容度有所改善之阻劑圖案之化學增幅負型阻劑組成物，並提供阻劑圖案形成方法。一種化學增幅負型阻劑組成物，包含：(A)淬滅劑，由下式(A)表示之鎓鹽構成；(B)基礎聚合物，包含含有下式(B1)表示之重複單元之聚合物；及(C)光酸產生劑，&lt;br/&gt;&lt;img align="absmiddle" height="41px" width="156px" file="ed10263.JPG" alt="ed10263.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  式中，Xq&lt;sup&gt;-&lt;/sup&gt;為陰離子，惟以Xq&lt;sup&gt;-&lt;/sup&gt;為共軛鹼的酸(XqH)，其沸點未達165℃且分子量為150以下。&lt;br/&gt;&lt;img align="absmiddle" height="202px" width="377px" file="ed10264.JPG" alt="ed10264.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemically amplified negative resist composition comprising (A) a quencher in the form of an onium salt containing an anion (Xq&lt;sup&gt;-&lt;/sup&gt;) which forms a conjugate acid (XqH) having a boiling point of lower than 165°C and a molecular weight of up to 150, (B) a base polymer, and (C) a photoacid generator exhibits a high resolution and forms a pattern of satisfactory profile with low LER, fidelity and improved dose margin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2004" publication-number="202617107">
    <tif-files tif-type="multi-tif">
      <tif file="114133053.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膽管管狀支架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260130B">A61F2/04</main-classification>
        <further-classification edition="201301120260130B">A61F2/07</further-classification>
        <further-classification edition="201601120260130B">A61B90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西澤建夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZAWA, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>権志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GON, CHIMYON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">〈課題〉提供在開腹手術時或腹腔鏡手術時能夠以簡易的技術來確實界定膽管之位置的自膽管之外側之可視性優異的膽管管狀支架。〈解決手段〉本發明相關之膽管管狀支架1係留置於膽管內的膽管管狀支架1，其中膽管管狀支架1由可撓性的管狀部件1T而成，管狀部件1T的一部分或整體構成為包含會因激發光之照射而放出指定波段之螢光的螢光色素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:管狀支架</p>
        <p type="p">1T:管狀部件</p>
        <p type="p">2:遠位端面</p>
        <p type="p">3:近位端面</p>
        <p type="p">11:直筒部</p>
        <p type="p">12:遠位端部</p>
        <p type="p">13:近位端部</p>
        <p type="p">21,31:瓣部</p>
        <p type="p">21a,31a:基端部</p>
        <p type="p">21b,31b:末端部</p>
        <p type="p">23,33:開口部</p>
        <p type="p">41:內視鏡標記</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2005" publication-number="202618840">
    <tif-files tif-type="multi-tif">
      <tif file="114133054.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用安裝在離子發射器上的天線進行自適應電荷中和的方法和裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR ADAPTIVE CHARGE NEUTRALIZATION USING AN ANTENNA MOUNTED TO AN ION EMITTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01J37/05</main-classification>
        <further-classification edition="200601120260122B">H01J37/08</further-classification>
        <further-classification edition="200601120260122B">H01J37/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海曼　史蒂芬班諾德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEYMANN, STEVEN BERNARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅契可夫　亞力斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOCHKOV, ALEKSEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德尼斯基　愛德華安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLDYNSKI, EDWARD ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛雷洛　祖安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERRERO, JUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡西歐　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASSIO, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示的示例性離子發射器包括：主體；在該主體上的複數個發射器噴嘴；經配置為向該複數個發射器噴嘴供應高頻率交流電(AC)信號的電源供應器；經配置為量測由該複數個發射器噴嘴所發射之離子的離子平衡的天線；經配置為基於經由該天線量測的該離子平衡來控制該電源供應器之控制電路系統；以及由該主體支撐且經配置為將該天線定位在該複數個發射器噴嘴的發射路徑內之天線吊架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed example ion emitters include: a body; a plurality of emitter nozzles on the body; a power supply configured to supply a high frequency alternating current (AC) signal to the plurality of emitter nozzles; an antenna configured to measure an ion balance of ions emitted by the plurality of emitter nozzles; control circuitry configured to control the power supply based on the ion balance measured via the antenna; and an antenna hanger supported by the body and configured to position the antenna within an emission path of the plurality of emitter nozzles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:AC電荷中和離子發射器</p>
        <p type="p">106:離子發射器噴嘴</p>
        <p type="p">108:天線</p>
        <p type="p">112:天線吊架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2006" publication-number="202617616">
    <tif-files tif-type="multi-tif">
      <tif file="114133104.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用夾層紙包裝玻璃片之方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PACKING GLASS SHEETS WITH INTERLEAF PAPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C03B40/033</main-classification>
        <further-classification edition="200601120260128B">C08L29/04</further-classification>
        <further-classification edition="200601120260128B">C09K3/16</further-classification>
        <further-classification edition="200601120260128B">B65B23/20</further-classification>
        <further-classification edition="200601120260128B">B65B35/50</further-classification>
        <further-classification edition="200601120260128B">B65B61/00</further-classification>
        <further-classification edition="200601120260128B">D21H27/10</further-classification>
        <further-classification edition="200601120260128B">D21H13/30</further-classification>
        <further-classification edition="200601120260128B">D21H17/23</further-classification>
        <further-classification edition="200601120260128B">D21H21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　明煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MING-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古莫　尼特亞蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, NITYANSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華柴克　汪妲賈妮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALCZAK, WANDA JANINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於玻璃片之夾層，其包括一基材及沉積於該基材上之一塗層材料，其中該塗層材料包括一分散介質、一水溶性界面活性劑及一水不溶性消泡劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interleaf for glass sheets includes a substrate and a coating material deposited on the substrate wherein the coating material includes a dispersing medium, a water soluble surfactant, and a water insoluble defoamer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:夾層</p>
        <p type="p">22,32:第一主表面</p>
        <p type="p">24,34:第二主表面</p>
        <p type="p">30:基材</p>
        <p type="p">40:塗層材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2007" publication-number="202618923">
    <tif-files tif-type="multi-tif">
      <tif file="114133128.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置、蝕刻方法、具有三維結構之ＮＡＮＤ快閃記憶體之製造方法及蝕刻氣體組合物</chinese-title>
        <english-title>PLASMA PROCESSING APPARATUS, ETCHING METHOD, MANUFACTURING METHOD OF A NAND FLASH MEMORY WITH A THREE-DIMENSIONAL STRUCTURE, AND ETCHING GAS COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/3065</main-classification>
        <further-classification edition="200601120260123B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須田隆太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDA, RYUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸村幕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMURA, MAJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之例示性實施方式之基板處理方法包括向電漿處理裝置之腔室內提供基板之步驟。基板具有含矽膜及設置於含矽膜上之遮罩。基板處理方法進而包括將載置有基板之基板支持體之溫度控制為0℃以下之步驟。基板處理方法進而包括以下步驟：利用由包含氟化氫氣體、以及選自由氟碳氣體及氫氟碳氣體所組成之群中之至少1種含碳氣體之第1處理氣體生成的電漿，對含矽膜進行蝕刻。進行蝕刻之步驟中，藉由來自電漿之化學物種對膜進行蝕刻。將惰性氣體除外之第1處理氣體中，氟化氫氣體之流量最多。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2008" publication-number="202617833">
    <tif-files tif-type="multi-tif">
      <tif file="114133129.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔片、具清潔功能之搬送構件、清潔片之製造方法</chinese-title>
        <english-title>CLEANING SHEET, TRANSFER MEMBER PROVIDED WITH CLEANING FUNCTION, AND METHOD OF PRODUCING CLEANING SHEET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G73/10</main-classification>
        <further-classification edition="200601120260202B">C09D179/08</further-classification>
        <further-classification edition="200601120260202B">B32B27/28</further-classification>
        <further-classification edition="202401120260202B">B08B1/00</further-classification>
        <further-classification edition="200601120260202B">H01L21/02</further-classification>
        <further-classification edition="200601120260202B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深道佑一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAMICHI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種潔淨性、異物去除性能及搬送性能優異之清潔片。  &lt;br/&gt;本發明之實施方式之清潔片具備清潔層，該清潔層包含聚醯亞胺系樹脂，且藉由全反射螢光X射線分析法所測得之對矽晶圓之轉印金屬量為1×10&lt;sup&gt;11&lt;/sup&gt; atoms/cm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a cleaning sheet excellent in cleanliness, foreign particle-removing performance, and transfer performance. The cleaning sheet includes a cleaning layer. The cleaning layer contains a polyimide-based resin. The cleaning layer has an amount of a metal transferred to a silicon wafer of 1×10&lt;sup&gt;11&lt;/sup&gt; atoms/cm&lt;sup&gt;2&lt;/sup&gt; or less, which is measured by a total reflection X-ray fluorescence analysis method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:清潔層</p>
        <p type="p">20:保護膜</p>
        <p type="p">100:清潔片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2009" publication-number="202618047">
    <tif-files tif-type="multi-tif">
      <tif file="114133138.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133138</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體供給裝置及氣體供給方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/448</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大陽日酸股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO NIPPON SANSO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田逸人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井政輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田吉史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, YOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水秀治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, HIDEHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種效率良好的氣體供給裝置及氣體供給方法。供給裝置係具備：氣體的分離膜，使製品氣體穿透；氣體分離容器，收容分離膜；及加熱裝置，對分離膜進行加熱；氣體分離容器係具有：第一空間部，儲存製品氣體的原料溶液；第二空間部，由第一空間部與分離膜所區劃；載體氣體導入口，與第二空間部連通，並將載體氣體導入第二空間部；及送出口，與第二空間部連通，並將載體氣體與製品氣體的混合氣體從第二空間部送出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:分離膜</p>
        <p type="p">10:筒狀體</p>
        <p type="p">100:供給裝置</p>
        <p type="p">2:氣體分離容器</p>
        <p type="p">20:加熱裝置</p>
        <p type="p">21:液面感測器</p>
        <p type="p">29:溫度感測器</p>
        <p type="p">31:第一空間部</p>
        <p type="p">32:第二空間部</p>
        <p type="p">41:原料溶液導入口</p>
        <p type="p">42:載體氣體導入口</p>
        <p type="p">43:排氣口</p>
        <p type="p">44:送出口</p>
        <p type="p">5:液量控制機構</p>
        <p type="p">51:送液機構</p>
        <p type="p">52:送液機構</p>
        <p type="p">6:壓力控制機構</p>
        <p type="p">61:閥裝置</p>
        <p type="p">70:原料容器</p>
        <p type="p">71:配管</p>
        <p type="p">72:液供給管</p>
        <p type="p">73:排洩管</p>
        <p type="p">73a:前端部</p>
        <p type="p">74:排氣管</p>
        <p type="p">79:閥裝置</p>
        <p type="p">82:載體氣體供給管</p>
        <p type="p">84:混合氣體供給管</p>
        <p type="p">89:濃度感測器</p>
        <p type="p">G1:氣體</p>
        <p type="p">G2:氣體</p>
        <p type="p">G3:氣體</p>
        <p type="p">L1:溶液</p>
        <p type="p">L2:溶液</p>
        <p type="p">L3:溶液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2010" publication-number="202618077">
    <tif-files tif-type="multi-tif">
      <tif file="114133145.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低溫磊晶之組合前驅物化學</chinese-title>
        <english-title>COMBINATORIAL PRECURSOR CHEMISTRY FOR LOW TEMPERATURE EPITAXY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C30B25/02</main-classification>
        <further-classification edition="200601120260202B">C30B25/14</further-classification>
        <further-classification edition="200601120260202B">C30B25/16</further-classification>
        <further-classification edition="200601120260202B">C30B29/06</further-classification>
        <further-classification edition="200601120260202B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪格提斯　喬伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARGETIS, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托勒　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLLE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪士　尚恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, SHAWN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例大體而言係關於半導體製造製程領域，更特定言之係關於前驅物化學及沉積含矽膜以形成半導體元件的方法。在一或多個實施例中，一種方法包括使含矽前驅物與摻雜物前驅物在600℃或更低的溫度下共流入處理腔室內，以在設置該處理腔室內的基板上沉積磊晶層。該含矽前驅物選自由以下組成的列表：矽烷（SiH&lt;sub&gt;4&lt;/sub&gt;）、二矽烷（Si₂H₆）、三矽烷（Si&lt;sub&gt;3&lt;/sub&gt;H&lt;sub&gt;8&lt;/sub&gt;）、四矽烷（Si₄H₁₀）、單氯三矽烷（Si₃H₇Cl）、雙碘矽烷（SiH₂I₂）和雙溴矽烷（SiH₂Br₂）。該摻雜物前驅物選自由以下組成的列表：磷烷（PH₃）、三氯化磷（PCl₃）、三溴化磷（PBr₃）、三級丁基磷烷（TBP）、三三級丁基硼烷（(tBu)&lt;sub&gt;3&lt;/sub&gt;B）、三級丁基砷烷（TBAs）、三氯化砷（AsCl₃）、三矽基磷烷（TSP）、三異丙基硼烷（(iPr)&lt;sub&gt;3&lt;/sub&gt;B）、三級丁基矽烷（(tBu)SiH&lt;sub&gt;3&lt;/sub&gt;）、異丙基矽烷（(iPr)SiH&lt;sub&gt;3&lt;/sub&gt;）、四(三級丁基)錫（(tBu)&lt;sub&gt;4&lt;/sub&gt;Sn）、四(異丙基)錫（(iPr)&lt;sub&gt;4&lt;/sub&gt;Sn）、四(三級丁基)鍺烷（(tBu)&lt;sub&gt;4&lt;/sub&gt;Ge）、四(異丙基)鍺烷（(iPr)&lt;sub&gt;4&lt;/sub&gt;Ge）、四氯化鍺（GeCl&lt;sub&gt;4&lt;/sub&gt;）、四氯化碳（CCl&lt;sub&gt;4&lt;/sub&gt;）和六氯二矽烷（Si&lt;sub&gt;2&lt;/sub&gt;C&lt;sub&gt;l6&lt;/sub&gt;）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to the field of semiconductor manufacturing processes, more particularly, to precursor chemistries and methods of depositing silicon-containing films for forming semiconductor devices. In one or more embodiments, a method includes co-flowing a silicon-containing precursor with a dopant precursor into a processing chamber at a temperature of 600 °C or less to deposit an epitaxial layer over a substrate disposed within the processing chamber. The silicon-containing precursor is selected from a list consisting of silane (SiH&lt;sub&gt;4&lt;/sub&gt;), disilane (Si₂H₆), trisilane(Si&lt;sub&gt;3&lt;/sub&gt;H&lt;sub&gt;8&lt;/sub&gt;), tetrasilane (Si₄H₁₀), monochlorotrisilane (Si₃H₇Cl), diiodosilane (SiH₂I₂), and dibromosilane (SiH₂Br₂). The dopant precursor selected from a list consisting of phosphine (PH₃), phosphorus trichloride (PCl₃), phosphorus tribromide (PBr₃), tert-butylphosphine (TBP), tri-tert-butylborane ((tBu)3B), tert-butylarsine (TBAs), arsenic trichloride (AsCl₃), trisilylphosphine (TSP), triisopropylborane (iPr)&lt;sub&gt;3&lt;/sub&gt;B, tert-butylsilane ((tBu)SiH&lt;sub&gt;3&lt;/sub&gt;), isopropylsilane ((iPr)SiH&lt;sub&gt;3&lt;/sub&gt;), tetrakis(tert-butyl)tin ((tBu)&lt;sub&gt;4&lt;/sub&gt;Sn), tetrakis(isopropyl)tin ((iPr)&lt;sub&gt;4&lt;/sub&gt;Sn), tetrakis(tert-butyl)germane ((tBu)&lt;sub&gt;4&lt;/sub&gt;Ge), tetrakis(isopropyl)germane ((iPr)&lt;sub&gt;4&lt;/sub&gt;Ge), germanium tetrachloride (GeCl&lt;sub&gt;4&lt;/sub&gt;), carbon tetrachloride (CCl&lt;sub&gt;4&lt;/sub&gt;), and hexachlorodisilane (Si&lt;sub&gt;2&lt;/sub&gt;Cl&lt;sub&gt;6&lt;/sub&gt;).</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:控制器</p>
        <p type="p">210:基板</p>
        <p type="p">272:中央處理單元(CPU)</p>
        <p type="p">274:記憶體</p>
        <p type="p">276:支援電路</p>
        <p type="p">400:處理腔室</p>
        <p type="p">402:腔室主體</p>
        <p type="p">412:上部分</p>
        <p type="p">414:下部分</p>
        <p type="p">415:中央窗口部分</p>
        <p type="p">416:上圓頂</p>
        <p type="p">417:底部部分</p>
        <p type="p">419:周邊凸緣</p>
        <p type="p">420:氣室</p>
        <p type="p">421:第二氣室</p>
        <p type="p">422:O形環</p>
        <p type="p">423:預熱環</p>
        <p type="p">425:周邊凸緣</p>
        <p type="p">426:基座</p>
        <p type="p">427:基座支撐軸</p>
        <p type="p">429:致動器</p>
        <p type="p">430:圓頂</p>
        <p type="p">431:圍罩</p>
        <p type="p">432:基板支撐組件</p>
        <p type="p">433:升舉銷</p>
        <p type="p">435:燈具</p>
        <p type="p">437:支撐銷</p>
        <p type="p">440:襯墊</p>
        <p type="p">442:升舉銷接觸件</p>
        <p type="p">450:沉積氣體</p>
        <p type="p">460:軸</p>
        <p type="p">474:氣體傳輸系統</p>
        <p type="p">476:氣源</p>
        <p type="p">478:前驅物源</p>
        <p type="p">480:液體蒸發器</p>
        <p type="p">482:液體前驅物源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2011" publication-number="202618233">
    <tif-files tif-type="multi-tif">
      <tif file="114133151.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監控洩漏偵測器之漂移的方法及相關設備</chinese-title>
        <english-title>METHOD OF MONITORING DRIFT OF A LEAK DETECTOR AND ASSOCIATED EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G01M3/20</main-classification>
        <further-classification edition="200601120260128B">G01D18/00</further-classification>
        <further-classification edition="200601120260128B">G01D3/02</further-classification>
        <further-classification edition="200601120260128B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商普發真空公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFEIFFER VACUUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦努爾　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUNOUAR, JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈奎特　吉斯蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACQUOT, GHISLAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維里爾　克萊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERRIER, CLAIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於監控設備(100)的示蹤氣體洩漏偵測器(1)的測量漂移的方法，該設備(100)能夠對放置在測量室(101)中的被測部件(A)執行密封測試循環。  &lt;br/&gt;　　所述方法包括以下步驟：  &lt;br/&gt;　　將具有預定義的濃度值的示蹤氣體注入與該洩漏偵測器(1)連通的管路中，  &lt;br/&gt;　　透過該洩漏偵測器(1)測量示蹤氣體內部濃度，  &lt;br/&gt;　　將測量值與預定義的濃度值進行比較，  &lt;br/&gt;　　如果存在差異，則確定校正係數，以及  &lt;br/&gt;　　在所述測試循環期間將校正係數應用於該測量室(101)中示蹤氣體的濃度的測量值。  &lt;br/&gt;　　本發明亦關於執行所述方法的設備(100)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns a method for monitoring drift of measurements by a tracer gas leak detector (1) of an equipment (100) able to carry out a seal test cycle on a part (A) under test placed in a measuring chamber (101). &lt;br/&gt;Said method includes the following steps: &lt;br/&gt;injection of the tracer gas with a predefined concentration value into a pipe communicating with the leak detector (1), &lt;br/&gt;measurement by the leak detector (1) of a tracer gas internal concentration, &lt;br/&gt;comparison of the measured value with the predefined concentration value, &lt;br/&gt;if there is a difference, determination of a correction coefficient, and &lt;br/&gt;application of the correction coefficient to the measured value of the concentration of the tracer gas in the measuring chamber (101) during said test cycle. &lt;br/&gt;The invention also concerns equipment (100) for executing said method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:洩漏偵測器</p>
        <p type="p">2A:渦輪分子真空幫浦</p>
        <p type="p">2B:主真空幫浦</p>
        <p type="p">3:壓力計/感測器</p>
        <p type="p">4:示蹤氣體注入元件</p>
        <p type="p">100:設備</p>
        <p type="p">101:測量室</p>
        <p type="p">A:被測部件</p>
        <p type="p">F:箭頭</p>
        <p type="p">V1~V5:閥門</p>
        <p type="p">P1~P3:抽氣組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2012" publication-number="202618848">
    <tif-files tif-type="multi-tif">
      <tif file="114133152.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶電粒子線裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250904B">H01J37/26</main-classification>
        <further-classification edition="200601120250904B">H01J37/153</further-classification>
        <further-classification edition="200601120250904B">H01J37/244</further-classification>
        <further-classification edition="200601120250904B">H01J37/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉迫奈浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURASAKO, NAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横須賀俊之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOSUKA, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小辻秀幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTSUJI, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白石勝彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAISHI, KATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川野源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANO, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">能夠提供一種可減低受到複數個帶電粒子線照射的試料的觀察像的失真之帶電粒子線裝置。具備：帶電粒子線源，將複數個帶電粒子線朝向試料射出；檢測器，檢測藉由受到前述帶電粒子線的各者的照射而從前述試料放出的訊號電子並輸出檢測訊號；透鏡，使前述訊號電子匯聚至前述檢測器；控制部，基於前述檢測訊號而生成觀察像，並且控制各部；該帶電粒子線裝置，其特徵為，前述控制部，對於觀察對象亦即觀察試料以相異的幀取得觀察像，並且測定各觀察像中的特徵量，基於測定出的特徵量的差分值而設定前述透鏡的條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鏡體</p>
        <p type="p">101:電子槍</p>
        <p type="p">102:電子線</p>
        <p type="p">103:1次光學透鏡</p>
        <p type="p">104:多射束形成部</p>
        <p type="p">105:多射束</p>
        <p type="p">106:多檢測器</p>
        <p type="p">107:射束分離器</p>
        <p type="p">108:偏向器</p>
        <p type="p">109:平台</p>
        <p type="p">110:試料</p>
        <p type="p">111:訊號電子</p>
        <p type="p">112:2次光學透鏡</p>
        <p type="p">120:控制部</p>
        <p type="p">121:顯示部</p>
        <p type="p">122:記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2013" publication-number="202617800">
    <tif-files tif-type="multi-tif">
      <tif file="114133158.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嵌段共聚物、分散劑、及著色組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08F220/06</main-classification>
        <further-classification edition="200601120260126B">C08F293/00</further-classification>
        <further-classification edition="200601120260126B">C08L53/02</further-classification>
        <further-classification edition="200601120260126B">C09B43/20</further-classification>
        <further-classification edition="200601120260126B">C08F297/02</further-classification>
        <further-classification edition="200601120260126B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水達彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種嵌段共聚物，該嵌段共聚物於用作著色組合物之分散劑時，著色材料之分散性能高，且能夠改善所獲得之著色組合物之鹼性顯影性。&lt;br/&gt;  嵌段共聚物係具有A嵌段及B嵌段者，其特徵在於：上述A嵌段實質上不含有具有氰基之結構單元(b-1)及具有鹼性基之結構單元(b-2)，上述B嵌段含有具有氰基之結構單元(b-1)及具有鹼性基之結構單元(b-2)，構成上述B嵌段之結構單元100mol%中之上述結構單元(b-1)之含有率為1mol%～50mol%，上述B嵌段中之上述結構單元(b-1)與上述結構單元(b-2)之莫耳比((b-1)/(b-2))為0.01～1.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2014" publication-number="202617876">
    <tif-files tif-type="multi-tif">
      <tif file="114133171.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片狀樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C08L63/02</main-classification>
        <further-classification edition="200601120260122B">C08K3/22</further-classification>
        <further-classification edition="202201120260122B">C01F7/026</further-classification>
        <further-classification edition="200601120260122B">C09K3/12</further-classification>
        <further-classification edition="200601120260122B">C10M107/50</further-classification>
        <further-classification edition="200601120260122B">C09K5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤友宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大門滿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIMON, MICHIRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幡中伸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有良好的外觀的片狀樹脂組成物。一種片狀樹脂組成物，包含氧化鋁粒子、芳香族環氧樹脂以及矽烷偶合劑，相對於所述片狀樹脂組成物的固體成分而言的氧化鋁粒子的比例為50質量%以上且99質量%以下，所述氧化鋁粒子在卡爾費歇爾測定中，在自溫度200℃歷時50分鐘升溫至900℃時，檢測出90 ppm以上且500 ppm以下的H&lt;sub&gt;2&lt;/sub&gt;O，厚度為0.10 mm以上且1.00 mm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2015" publication-number="202617036">
    <tif-files tif-type="multi-tif">
      <tif file="114133200.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備、清潔基站、清潔設備的除垢方法、電腦程式產品以及電腦可讀存儲介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">A47L11/40</main-classification>
        <further-classification edition="200601120260128B">B08B9/027</further-classification>
        <further-classification edition="200601120260128B">B08B3/08</further-classification>
        <further-classification edition="200601120260128B">B08B3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳洛克創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李智軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱亮亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及清潔設備的技術領域，公開了一種清潔設備、清潔基站、清潔系統、清潔設備的除垢方法、電腦程式產品、電腦可讀存儲介質。清潔設備包括清潔部件、第一清水源、第一水處理部件和除垢裝置；第一水處理部件適用於對流經所述第一水處理部件中的水進行處理；第一除垢裝置連接於第一水處理部件，清潔設備具有第一除垢模式，在所述除垢模式下：所述第一除垢裝置將所述第一水處理部件的水垢與所述第一水處理部件脫離；第一清水源的水可流入第一水處理部件並將含有水垢的水排出第一水處理部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔部件</p>
        <p type="p">200:第一清水源</p>
        <p type="p">210:第一抽水泵</p>
        <p type="p">300:第一水處理部件</p>
        <p type="p">412:第一輸料泵</p>
        <p type="p">500:第一過濾部件</p>
        <p type="p">710:流通管道</p>
        <p type="p">730:污水箱</p>
        <p type="p">740:第一換向閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2016" publication-number="202619076">
    <tif-files tif-type="multi-tif">
      <tif file="114133233.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>囊封混合接合結構</chinese-title>
        <english-title>ENCAPSULATED HYBRID BONDED STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">H01L23/31</main-classification>
        <further-classification edition="200601120260129B">B32B5/16</further-classification>
        <further-classification edition="200601120260129B">H01L21/56</further-classification>
        <further-classification edition="200601120260129B">H01L23/373</further-classification>
        <further-classification edition="200601120260129B">H01L23/522</further-classification>
        <further-classification edition="200601120260129B">H01L23/538</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦利葉　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARIOT, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈　虹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特卡　拉杰詡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATKAR, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子構件包含混合接合到載體的第一裝置晶粒、囊封所述第一裝置晶粒的側表面的囊封劑、以及覆蓋元件，其被設置直接接合到所述第一裝置晶粒的頂表面之上。所述囊封劑包括內嵌於其中的顆粒，並且其中在所述囊封劑的頂表面與所述覆蓋元件的底表面之間的介面並無研磨顆粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic component including a first device die hybrid bonded to a carrier, an encapsulant encapsulating side surfaces of the first device die and a cover element disposed over directly bonded to a top surface of the first device die. The encapsulant comprises particles embedded therein, and wherein an interface between a top surface of the encapsulant and a bottom surface of the cover element lacks ground particles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電子構件</p>
        <p type="p">202:載體</p>
        <p type="p">204A:第一晶粒</p>
        <p type="p">204B:第二晶粒</p>
        <p type="p">206:覆蓋元件</p>
        <p type="p">208:焊料球</p>
        <p type="p">210:囊封劑</p>
        <p type="p">221:通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2017" publication-number="202618407">
    <tif-files tif-type="multi-tif">
      <tif file="114133241.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光路的自動再校準系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR AUTO-RECALIBRATION OF AN OPTICAL PATH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G02B27/64</main-classification>
        <further-classification edition="200601120260128B">G02B26/08</further-classification>
        <further-classification edition="202301120260128B">H10N30/20</further-classification>
        <further-classification edition="200601120260128B">H02N2/00</further-classification>
        <further-classification edition="200601120260128B">G05D3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新析生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYNCELL (TAIWAN) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡哲豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHE-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳一德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝永達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIE, YONG-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動再校準系統，包括提供光的照光光源；光抵達的第一壓電致動器；光從第一壓電致動器抵達的一個或多個光學元件；光從光學元件抵達的第二壓電致動器；光從第二壓電致動器抵達的第一分光器，並部分透射至物鏡；光從第一壓電致動器或第二壓電致動器或第一分光器抵達的第一位置感測器；部分光從第一分光器反射至的第二位置感測器；以及電耦接第一壓電致動器、第二壓電致動器、第一位置感測器及第二位置感測器的控制器，且控制器透過根據第二位置感測器調整第二壓電致動器與根據第一位置感測器調整第一壓電致動器來進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An auto-recalibration system includes an illumination light source providing a light; a first piezo mount the light arrives at; one or more optical elements the light from the first piezo mount arrives at; a second piezo mount the light from one or more optical elements arrives at; a first beam splitter that the light from the second piezo mount partially passes through the first beam splitter to an objective; a first position detector the light arrives at from the first or second piezo mount or the first beam splitter; a second position detector a part of the light reflects from the first beam splitter to; and a controller that electrically couples to the first/second piezo mount and the first/second position detector, and controls by adjusting the second piezo mount according to the second position detector and adjusting the first piezo mount according to the first position detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:自動再校準系統</p>
        <p type="p">202:物鏡</p>
        <p type="p">211:照光光源</p>
        <p type="p">241A:第一壓電致動器</p>
        <p type="p">241B:第二壓電致動器</p>
        <p type="p">242A:第一位置感測器</p>
        <p type="p">242B:第二位置感測器</p>
        <p type="p">243:分光器</p>
        <p type="p">248A:第一固定式反射鏡</p>
        <p type="p">248B:第二固定式反射鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2018" publication-number="202619278">
    <tif-files tif-type="multi-tif">
      <tif file="114133244.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放大電路及包括其的射頻電路</chinese-title>
        <english-title>AMPLIFYING CIRCUIT AND RF CIRCUIT INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03F3/189</main-classification>
        <further-classification edition="200601120260102B">H04B1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鍾敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫周希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, JUHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉相珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鐘洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONGSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及放大電路和射頻（RF）電路。放大電路包括第一放大器電路、第二放大器電路、以及共模反饋電路。第一放大器電路包括被配置成接收第一輸入電壓信號並連接到第一節點和第二節點的第一電晶體。位於電源電壓線和第一節點之間的第一電流源被配置成供應第一電流到第一電晶體。第二電流源位於第一節點和第二節點之間並與第一電晶體並聯連接，其中從第一節點流動到第二節點的第一電流的路徑基於第一輸入電壓信號的第一電壓位準與第一預定電壓位準的比較來確定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an amplifying circuit and a radio-frequency (RF) circuit. The amplifying circuit includes a first amplifier circuit, a second amplifier circuit, and a common mode feedback circuit. The first amplifier circuit includes a first transistor configured to receive a first input voltage signal and connected to a first node and a second node. A first current source located between a power voltage line and the first node is configured to supply a first current to the first transistor. A second current source is located between the first node and the second node and is connected in parallel with the first transistor, wherein a path of a first current flowing from the first node to the second node is determined based on a comparison of the first voltage level of the first input voltage signal to a first predetermined voltage level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:放大電路</p>
        <p type="p">510、520:放大器</p>
        <p type="p">530:共模反饋電路</p>
        <p type="p">AS1~AS3:電流源</p>
        <p type="p">AT1~AT8:電晶體</p>
        <p type="p">AN1~AN5:節點</p>
        <p type="p">C1、C2:電容器</p>
        <p type="p">VIN1、VIP1、VIN2、VIP2:輸入電壓</p>
        <p type="p">VON:輸出電壓</p>
        <p type="p">VB1、VB2:偏壓電壓</p>
        <p type="p">VOP:輸出電壓</p>
        <p type="p">VDD:電源供應電壓/電源電壓</p>
        <p type="p">VF1:反饋電壓</p>
        <p type="p">VCMO:共模輸出電壓</p>
        <p type="p">VREF:參考電壓</p>
        <p type="p">IS1、IS2:可變電流源</p>
        <p type="p">Id:下拉電流</p>
        <p type="p">R1、R2:電阻器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2019" publication-number="202617829">
    <tif-files tif-type="multi-tif">
      <tif file="114133261.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高性能材料作為未來的營養物</chinese-title>
        <english-title>HIGH PERFORMANCE MATERIAL AS NUTRIENT OF THE FUTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G63/688</main-classification>
        <further-classification edition="200601120260202B">C08G63/78</further-classification>
        <further-classification edition="200601120260202B">C08G63/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商海洋安全公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCEANSAFE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>司韋澤　曼努埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWEIZER, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種製造可生物降解聚酯製品之方法，該聚酯製品包含特定比例之乙二醇、對苯二甲酸、戊二酸二甲酯，以及5-磺基間苯二甲酸二甲酯鈉等單體，該特定比例使所得製品於海洋及土壤環境中可降解，且降解過程中不產生有毒物質，致使聚酯降解產物可成為微生物之營養源。本發明進一步關於由該方法製得之可生物降解聚酯製品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for producing biodegradable polyester articles comprising monomers of ethylene glycol, terephthalic acid, dimethylgluturate, sodium dimethyl 5-sulfoisophthalate in specific ratios that permit the resultant articles to be degradable in marine and soil environments with no toxic products from degradation such that polyester breakdown products can be nutrients for microbes. The invention further relates biodegradable polyester articles obtained from said process.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2020" publication-number="202617702">
    <tif-files tif-type="multi-tif">
      <tif file="114133283.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、疊層體及圖案形成方法</chinese-title>
        <english-title>RESIST COMPOSITION, LAMINATE, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D347/00</main-classification>
        <further-classification edition="200601120260202B">C07C55/12</further-classification>
        <further-classification edition="200601120260202B">C07C55/16</further-classification>
        <further-classification edition="200601120260202B">C07C57/145</further-classification>
        <further-classification edition="200601120260202B">C07C57/30</further-classification>
        <further-classification edition="200601120260202B">C07C57/34</further-classification>
        <further-classification edition="200601120260202B">C07C63/70</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08F220/06</further-classification>
        <further-classification edition="200601120260202B">C08F220/28</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/09</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影，尤其電子束(EB)微影及EUV微影中，感度及解析度優良的阻劑組成物、及使用該阻劑組成物之圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種阻劑組成物，其特徵為含有下式(1)表示之超原子價碘化合物、含羧基之化合物及溶劑。式中，m為0時n為0~4之整數，m為1時n為0~6之整數，m為2時n為0~8之整數。R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;為鹵素原子或碳數1~10之烴基。R&lt;sup&gt;4&lt;/sup&gt;為鹵素原子或碳數1~40之烴基。R&lt;sup&gt;5&lt;/sup&gt;為羰基或碳數1~10之伸烴基。I及R&lt;sup&gt;5&lt;/sup&gt;鍵結於芳香環上之相鄰的碳原子。  &lt;br/&gt;&lt;img align="absmiddle" height="195px" width="338px" file="ed10172.JPG" alt="ed10172.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a resist composition including a hypervalent iodine compound represented by the following formula (1), a carboxy group-containing compound, and a solvent. In the formula (1), “n” represents an integer of 0 to 4 when “m” is 0, an integer of 0 to 6 when “m” is 1, and an integer of 0 to 8 when “m” is 2; R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; represent a halogen atom or a hydrocarbyl group having 1 to 10 carbon atoms; R&lt;sup&gt;4&lt;/sup&gt; represents a halogen atom or a hydrocarbyl group having 1 to 40 carbon atoms; R&lt;sup&gt;5&lt;/sup&gt; represents a carbonyl group or a hydrocarbylene group having 1 to 10 carbon atom; and I and R&lt;sup&gt;5&lt;/sup&gt; are bonded to adjacent carbon atoms of the aromatic ring. This can provide: a resist composition that exhibits excellent sensitivity and resolution in photolithography using a high-energy beam, particularly in electron beam (EB) lithography and EUV lithography; and a patterning process using the resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="171px" width="297px" file="ed10173.JPG" alt="ed10173.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2021" publication-number="202617654">
    <tif-files tif-type="multi-tif">
      <tif file="114133286.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化層、硬化層的製造方法以及蝕刻方法</chinese-title>
        <english-title>RESIN COMPOSITION, CURED LAYER, MANUFACTURING METHOD OF CURED LAYER AND ETCHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250924B">C07C39/08</main-classification>
        <further-classification edition="200601120250924B">C07C69/54</further-classification>
        <further-classification edition="201501120250924B">G02B1/11</further-classification>
        <further-classification edition="200601120250924B">G03F7/004</further-classification>
        <further-classification edition="200601120250924B">C08L63/04</further-classification>
        <further-classification edition="200601120250924B">C08F2/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新應材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED ECHEM MATERIALS COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白浩鼎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, HAO-DING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡凱雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, KAI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組成物、硬化層、硬化層的製造方法以及蝕刻方法。樹脂組成物包括樹脂（A）、交聯劑（B）以及溶劑（C）。樹脂（A）包括由下述式（A-1）表示的結構。交聯劑（B）包括包含由下述式（B-1）表示的第一結構單元以及下述式（B-2）表示的第二結構單元的聚合物。基於樹脂（A）的使用量為100重量份，交聯劑（B）的使用量為60重量份至150重量份，及溶劑（C）的使用量為2400重量份至99900重量份。&lt;br/&gt;&lt;img align="absmiddle" height="339px" width="267px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt;&lt;img align="absmiddle" height="174px" width="222px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt;  在式（A-1）、式（B-1）以及式（B-2）中，各取代基的定義與說明書所定義的相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition, a cured layer, a manufacturing method of a cured layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B) and a solvent (C). The resin (A) includes a structure represented by the following Formula (A-1). The crosslinking agent (B) includes a polymer including a first structural unit represented by the following Formula (B-1) and a second structural unit represented by the following Formula (B-2). Based on a usage amount of the resin (A) being 100 parts by weight, a usage amount of the crosslinking agent (B) is 60 parts by weight to 150 parts by weight, and a usage amount of the solvent (C) is 2400 parts by weight to 99900 parts by weight.&lt;br/&gt;&lt;img align="absmiddle" height="172px" width="289px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt;&lt;img align="absmiddle" height="329px" width="271px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt; In Formula (A-1), Formula (B-1) and Formula (B-2), the definition of each substituent is the same as defined in the specification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2022" publication-number="202617666">
    <tif-files tif-type="multi-tif">
      <tif file="114133295.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有環己烷-1,2,4-三丙酸之三甲酯及鄰苯二甲酸二烷基酯之塑化劑組成物</chinese-title>
        <english-title>PLASTICIZER COMPOSITION CONTAINING TRIMETHYL ESTERS OF CYCLOHEXANE-1,2,4-TRIPROPIONIC ACID AND DIALKYL PHTHALATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C69/608</main-classification>
        <further-classification edition="200601120260202B">C08K5/12</further-classification>
        <further-classification edition="200601120260202B">C08L101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格瑞斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRASS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯瑟克　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSEK, MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　艾可斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN EICKELS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種塑化劑組成物，其包含式（1）之化合物  &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="341px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及至少一種鄰苯二甲酸二烷基酯，其中該鄰苯二甲酸二烷基酯中之兩個烷基各具有9個或10個碳原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a plasticizer composition comprising a compound of the formula (1) &lt;br/&gt;&lt;img align="absmiddle" height="172px" width="346px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and at least one dialkyl phthalate, where the two alkyl groups in the dialkyl phthalate each have 9 or 10 carbon atoms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2023" publication-number="202617667">
    <tif-files tif-type="multi-tif">
      <tif file="114133296.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環己烷-1,2,4-三丙酸之三戊酯及含有此酯之塑化劑組成物</chinese-title>
        <english-title>TRIPENTYL ESTERS OF CYCLOHEXANE-1,2,4-TRIPROPIONIC ACID AND PLASTICIZER COMPOSITIONS CONTAINING THEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C69/608</main-classification>
        <further-classification edition="200601120260202B">C08K5/12</further-classification>
        <further-classification edition="200601120260202B">C08L101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格瑞斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRASS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯瑟克　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSEK, MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　艾可斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN EICKELS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於式（1）之環己烷-1,2,4-三丙酸之三烷基酯  &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="325px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;其中三個烷基R各具有5個碳原子，在該等烷基中55 mol%至95 mol%為正戊基。本發明進一步提供一種塑化劑組成物，其包含以上提及的式（1）之環己烷-1,2,4-三丙酸之三烷基酯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to trialkyl esters of cyclohexane-1,2,4-tripropionic acid of the formula (1) &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="321px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;in which the three alkyl groups R each have 5 carbon atoms, of which 55 to 95 mol% are n-pentyl radicals. The present invention further provides a plasticizer composition comprising the aforementioned trialkyl esters of cyclohexane-1,2,4-tripropionic acid of the formula (1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2024" publication-number="202617668">
    <tif-files tif-type="multi-tif">
      <tif file="114133297.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有環己烷-1,2,4-三丙酸之三甲酯及1,4-環己烷二甲酸二烷基酯之塑化劑組成物</chinese-title>
        <english-title>PLASTICIZER COMPOSITION CONTAINING TRIMETHYL ESTERS OF CYCLOHEXANE-1,2,4-TRIPROPIONIC ACID AND A DIALKYL CYCLOHEXANE-1,4-DICARBOXYLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C69/608</main-classification>
        <further-classification edition="200601120260202B">C08K5/12</further-classification>
        <further-classification edition="200601120260202B">C08L101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格瑞斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRASS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯瑟克　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSEK, MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　艾可斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN EICKELS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種塑化劑組成物，其包含式（1）之化合物  &lt;br/&gt;&lt;img align="absmiddle" height="169px" width="346px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及至少一種環己烷-1,4-二羧酸二烷基酯，其中該環己烷-1,4-二羧酸二烷基酯中之兩個烷基各具有8個或9個碳原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a plasticizer composition comprising a compound of the formula (1) &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="344px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and at least one dialkyl cyclohexane-1,4-dicarboxylate, where the two alkyl groups in the dialkyl cyclohexane-1,4-dicarboxylate each have 8 or 9 carbon atoms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2025" publication-number="202617669">
    <tif-files tif-type="multi-tif">
      <tif file="114133298.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有環己烷-1,2,4-三丙酸之三甲酯及其長鏈衍生物之塑化劑組成物</chinese-title>
        <english-title>PLASTICIZER COMPOSITION CONTAINING TRIMETHYL ESTERS OF CYCLOHEXANE-1,2,4-TRIPROPIONIC ACID AND LONGER-CHAIN DERIVATIVES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C69/608</main-classification>
        <further-classification edition="200601120260202B">C08K5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格瑞斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRASS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯瑟克　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSEK, MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　艾可斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN EICKELS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種塑化劑組成物，其包含式（1）之化合物  &lt;br/&gt;&lt;img align="absmiddle" height="169px" width="335px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及至少一種環己烷-1,2,4-三丙酸之長鏈三烷基酯，其中環己烷-1,2,4-三丙酸之三烷基酯中之三個烷基各具有4至9個碳原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a plasticizer composition comprising a compound of the formula (1) &lt;br/&gt;&lt;img align="absmiddle" height="165px" width="339px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and at least one longer-chain trialkyl ester of cyclohexane-1,2,4-tripropionic acid, wherein the three alkyl groups in the trialkyl ester of cyclohexane-1,2,4-tripropionic acid each have 4 to 9 carbon atoms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2026" publication-number="202618036">
    <tif-files tif-type="multi-tif">
      <tif file="114133302.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異質磊晶晶圓及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C23C16/30</main-classification>
        <further-classification edition="200601120260122B">C23C16/32</further-classification>
        <further-classification edition="200601120260122B">C23C16/44</further-classification>
        <further-classification edition="200601120260122B">C23C16/455</further-classification>
        <further-classification edition="200601120260122B">C23C16/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSUKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原壽樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木温</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上東洋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHIGASHI, YOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種異質磊晶晶圓及其製造方法，該異質磊晶晶圓具有單晶矽基板上的3C-SiC磊晶層與該3C-SiC磊晶層上的矽氧化膜。藉此可提供一種異質磊晶晶圓及其製造方法，該異質磊晶晶圓不會發生基底面差排的問題並具有與矽相當的高可靠性的閘極絕緣膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:異質磊晶晶圓</p>
        <p type="p">2:單晶矽基板</p>
        <p type="p">3:3C-SiC磊晶層</p>
        <p type="p">5:矽氧化膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2027" publication-number="202617898">
    <tif-files tif-type="multi-tif">
      <tif file="114133328.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>印刷油墨</chinese-title>
        <english-title>PRINTING INKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260202B">C09D11/03</main-classification>
        <further-classification edition="200601120260202B">B41M1/10</further-classification>
        <further-classification edition="200601120260202B">B41M3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商西克帕控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICPA HOLDING SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒費富瑞　奧立佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEFEBVRE, OLIVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩寶林　麥西默</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SABOURIN, MAXIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氧化乾燥凹版油墨。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an oxidative drying intaglio ink.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2028" publication-number="202618426">
    <tif-files tif-type="multi-tif">
      <tif file="114133329.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消除電泳顯示器更新時色偏之方法</chinese-title>
        <english-title>METHODS FOR REMOVING COLOR SHIFTS DURING ELECTROPHORETIC DISPLAY UPDATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260120B">G02F1/167</main-classification>
        <further-classification edition="201901120260120B">G02F1/16766</further-classification>
        <further-classification edition="201901120260120B">G02F1/1685</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德里瓦拉　阿密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELIWALA, AMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>札雷斯基　喬納生Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZALESKY, JONATHAN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用「P」型波形來減少色漂、重影、及其他瞬間色偏之方法。雖然此方法對於調節白色狀態漂移最有用，但相關技術可被使用於解決其他多粒子色彩平台、以及色彩濾光陣列(CFA)電泳顯示器中的色彩狀態漂移。此等方法有助於修復部分更新方法可能伴隨之色漂，亦即藉此在第一與第二影像之間，僅只顯示面板的一部分會由控制器接收更新指令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for using “P” type waveforms to reduce color drift, ghosting, and other transient color shifts. While the method is most useful for regulating white state drift, related techniques can be used to address color state drift in other multi-particle color platforms, as well as in color-filter-array (CFA) electrophoretic displays. The methods help to fix color drift that may accompany partial update methods, i.e., whereby only a portion of the display panel receives update instructions from the controller between a first and a second image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電泳顯示器</p>
        <p type="p">110:透明電極</p>
        <p type="p">120:電泳介質</p>
        <p type="p">121:粒子</p>
        <p type="p">122:粒子</p>
        <p type="p">123:粒子</p>
        <p type="p">124:粒子</p>
        <p type="p">126:微膠囊</p>
        <p type="p">130:底部電極</p>
        <p type="p">140:黏著劑層</p>
        <p type="p">150:基板</p>
        <p type="p">160:保護層</p>
        <p type="p">170:黏著劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2029" publication-number="202617549">
    <tif-files tif-type="multi-tif">
      <tif file="114133341.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133341</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移載裝置</chinese-title>
        <english-title>TRANSFER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B65G1/04</main-classification>
        <further-classification edition="200601120260130B">B65G47/82</further-classification>
        <further-classification edition="200601120260130B">B65G47/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀江智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原步實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村浩章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田昌重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, MASASHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種移載裝置，具備：第1進退部13，被第1進退支撐部11支撐；第2進退部23，被第2進退支撐部21支撐；間隔變更機構；及第1限制部6與第2限制部7，限制支撐物品的位置，第1限制部6具備對支撐物品相向之第1相向面6a，第2限制部7具備對支撐物品相向之第2相向面7a，第1限制部6以第1相向面6a位於比第1進退部13更靠近寬度方向第2側Y2的方式被第1進退支撐部11支撐，第2限制部7以第2相向面7a位於比第2進退部23更靠近寬度方向第1側Y1的方式被第2進退支撐部21支撐。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第1進退支撐部</p>
        <p type="p">13:第1進退部</p>
        <p type="p">2:支撐部</p>
        <p type="p">21:第2進退支撐部</p>
        <p type="p">23:第2進退部</p>
        <p type="p">4:移載對象地點</p>
        <p type="p">6:第1限制部</p>
        <p type="p">6a:第1相向面</p>
        <p type="p">6b:第1傾斜面</p>
        <p type="p">7:第2限制部</p>
        <p type="p">7a:第2相向面</p>
        <p type="p">7b:第2傾斜面</p>
        <p type="p">8:卡止部</p>
        <p type="p">D1:第1設定間隔</p>
        <p type="p">S1:重複姿勢</p>
        <p type="p">S2:退避姿勢</p>
        <p type="p">T1:基準位置</p>
        <p type="p">T2:突出目標位置</p>
        <p type="p">W:物品</p>
        <p type="p">X:移載方向</p>
        <p type="p">X1:移載方向第1側</p>
        <p type="p">X2:移載方向第2側</p>
        <p type="p">Y:寬度方向</p>
        <p type="p">Y1:寬度方向第1側</p>
        <p type="p">Y2:寬度方向第2側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2030" publication-number="202618343">
    <tif-files tif-type="multi-tif">
      <tif file="114133357.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G02B5/18</main-classification>
        <further-classification edition="200601120260130B">G02B3/08</further-classification>
        <further-classification edition="201501120260130B">G02B1/14</further-classification>
        <further-classification edition="201901120260130B">B32B7/023</further-classification>
        <further-classification edition="200601120260130B">B32B27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田和史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, KAZUFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武本博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEMOTO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含具有非週期凹凸結構之繞射光學元件且能夠適當地發揮該繞射光學元件之功能的光學積層體。本發明之實施方式之光學積層體具有：基材；繞射光學元件，其設置於基材且具有非週期凹凸結構；及光學功能輔助層，其以覆蓋繞射光學元件之方式設置；且繞射光學元件之折射率為1.50～2.70，光學功能輔助層之折射率未達1.30。於一實施方式中，繞射光學元件為相位菲涅耳透鏡或超穎透鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:繞射光學元件</p>
        <p type="p">120:基材</p>
        <p type="p">140:光學功能輔助層</p>
        <p type="p">160:黏著劑層</p>
        <p type="p">180:保護層</p>
        <p type="p">200:光學積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2031" publication-number="202617968">
    <tif-files tif-type="multi-tif">
      <tif file="114133361.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617968</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分注攪拌裝置以及培養系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">C12M1/02</main-classification>
        <further-classification edition="200601120260131B">C12M1/36</further-classification>
        <further-classification edition="202201120260131B">B01F27/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松由尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSU, YOSHINAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤彰久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, AKIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川尚樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邉和男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅野伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松澤貴司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日比野雄平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIBINO, YUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">係具備：分注單元，係能夠升降，並且能夠供給、排出分注物；分注尖端，係以自分注單元朝向下方突出之方式，能夠裝卸地安裝於分注單元，並能夠自前端吐出、吸入前述分注物；容器，係收容培養液，並且伴隨於分注單元之升降使分注尖端插入、拔出；以及旋轉機構，係於使分注尖端插入至容器之狀態下，令分注尖端及容器繞往上下方向延伸之軸線相對旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:分注攪拌裝置</p>
        <p type="p">31:安裝管</p>
        <p type="p">60:收容盒</p>
        <p type="p">61:收容盤</p>
        <p type="p">61a:側面</p>
        <p type="p">61b:上表面</p>
        <p type="p">62:收容凹部</p>
        <p type="p">62a:內側面</p>
        <p type="p">62b:底面</p>
        <p type="p">70:蓋部</p>
        <p type="p">72a:插通孔</p>
        <p type="p">73:空氣通路</p>
        <p type="p">73a:主通路</p>
        <p type="p">73b:分歧通路</p>
        <p type="p">75:空氣供給管</p>
        <p type="p">76:過濾器</p>
        <p type="p">80:內部載台</p>
        <p type="p">81:外部載台</p>
        <p type="p">82:第二電動機</p>
        <p type="p">82a:第二電動機本體</p>
        <p type="p">82b:第二輸出軸</p>
        <p type="p">85:尖端罩</p>
        <p type="p">C:培養液</p>
        <p type="p">O:軸線</p>
        <p type="p">V:容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2032" publication-number="202617596">
    <tif-files tif-type="multi-tif">
      <tif file="114133365.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳奈米管及其製造方法</chinese-title>
        <english-title>CARBON NANOTUBES AND METHOD FOR MANUFACTURING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260202B">C01B32/158</main-classification>
        <further-classification edition="201701120260202B">C01B32/162</further-classification>
        <further-classification edition="201701120260202B">C01B32/174</further-classification>
        <further-classification edition="200601120260202B">H01M4/62</further-classification>
        <further-classification edition="201001120260202B">H01M10/05</further-classification>
        <further-classification edition="201101120260202B">B82Y30/00</further-classification>
        <further-classification edition="201101120260202B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金世賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金緣伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YEONYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜賢俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HYUN JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金韓娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG MYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃銖賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SUHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示具有優異的導電性以及卓越的儲存及運輸效率之新穎的碳奈米管，製造該碳奈米管之方法，碳奈米管分散液，包含該碳奈米管之電極結構，及一種包括該碳奈米管之二次電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are novel carbon nanotubes having excellent electrical conductivity as well as superior storage and transportation efficiency, a method for manufacturing the carbon nanotubes, a carbon nanotube dispersion, an electrode structure comprising the carbon nanotubes, and a secondary battery including the carbon nanotubes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2033" publication-number="202618460">
    <tif-files tif-type="multi-tif">
      <tif file="114133368.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理光感測器的方法、用於處理光感測器的系統以及包含該系統的光學測量系統</chinese-title>
        <english-title>METHOD FOR TREATING A PHOTOSENSOR, SYSTEM FOR TREATING A PHOTOSENSOR, AND OPTICAL MEASURING SYSTEM COMPRISING SUCH A SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G03F7/20</main-classification>
        <further-classification edition="202301120260128B">H04N25/626</further-classification>
        <further-classification edition="202301120260128B">H04N25/63</further-classification>
        <further-classification edition="200601120260128B">G01N21/93</further-classification>
        <further-classification edition="200601120260128B">G01J1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷克波姆　鹿茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREKERBOHM, LUTZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋勒　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELLER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於處理光感測器（24）的方法，特別適用於半導體微影的一光學測量系統。光感測器（24）具有一感測器表面，該感測器表面具有多個光敏像素，這些光敏像素設計用於利用內部光電效應將光轉換為一電訊號。該方法包括以下步驟：確定由一暗電流效應及/或一重影效應引起的一影像像差的程度；用UV光輻射該光感測器（24）的該感測器表面；重複確定該影像像差的程度以及輻射該感測器表面，直到確定的該影像像差的程度低於一指定水準。藉由該UV輻射提高光感測器的品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method for treating a photosensor (24), in particular for use in an optical measuring system for semiconductor lithography. The photosensor (24) has a sensor surface having a plurality of photosensitive pixels which are designed to convert light into an electrical signal using the internal photoelectric effect. The method comprises the following steps： &lt;br/&gt;- determining an extent of an image aberration caused by a dark current effect and/or a ghosting effect; &lt;br/&gt;- irradiating the sensor surface of the photosensor (24) with UV light; &lt;br/&gt;- repeating the determination of the extent of the image aberration and the irradiation of the sensor surface until the determined extent of the image aberration falls below a specified level. &lt;br/&gt;The quality of the photosensor is improved by the UV irradiation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:支架</p>
        <p type="p">24:光感測器</p>
        <p type="p">25:UV光源</p>
        <p type="p">26:勻光器</p>
        <p type="p">27:準直器</p>
        <p type="p">28:評估單元</p>
        <p type="p">29:控制單元</p>
        <p type="p">30:可變光闌裝置；光闌裝置；光闌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2034" publication-number="202617000">
    <tif-files tif-type="multi-tif">
      <tif file="114133411.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>餐椅安全帶裝置</chinese-title>
        <english-title>SAFETY BELT ASSEMBLY FOR DINNING CHAIR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47D1/02</main-classification>
        <further-classification edition="200601120260130B">A47D13/00</further-classification>
        <further-classification edition="200601120260130B">A47D13/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉一萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, I-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭郁璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾祖華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種利於收納、外出攜帶的增高型餐椅安全帶裝置，除可結合一般市售餐椅使用、將幼兒限位在餐椅上以提高幼兒乘坐餐椅的穩定性與安全性外，本揭露之餐椅安全帶裝置更附有增高的可拆卸式坐墊部和圍兜配件，可讓幼兒在外用餐可不受身型所限而影響用餐動作進行，提升幼兒和幼兒照護者在外用餐體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The safety belt assembly for dinning chair as disclosed is easy for storage and carrying out. The safety belt assembly provides the child sitting on a dinning chair with an improved stability and safety when being combined with the dinning chair. Besides, the safety belt assembly for dinning chair as disclosed is equipped with a detachable seat cushion and a bib attachable thereto. The safety belt assembly for dinning chair as disclosed allows the child to eat outside without being restricted by his/her height or body shape, thereby improving the child’s and his/her caregiver’s dining experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:餐椅安全帶裝置</p>
        <p type="p">110:本體</p>
        <p type="p">111:第一部分</p>
        <p type="p">111U:上緣</p>
        <p type="p">111L2、111R2:第一側緣部分</p>
        <p type="p">112:第二部分</p>
        <p type="p">112U:上緣</p>
        <p type="p">113:第三部分</p>
        <p type="p">113L、113R:兩側</p>
        <p type="p">S:容置空間</p>
        <p type="p">120:肩帶組件</p>
        <p type="p">121:第一肩帶本體</p>
        <p type="p">122:第二肩帶本體</p>
        <p type="p">123、124:調整帶</p>
        <p type="p">127:限位環部</p>
        <p type="p">128:限位環部</p>
        <p type="p">141:第一連接帶</p>
        <p type="p">141A:第一端(固定端)</p>
        <p type="p">141B:第二端(連接端)</p>
        <p type="p">142:第二連接帶</p>
        <p type="p">142A:第一端(固定端)</p>
        <p type="p">142B:第二端(連接端)</p>
        <p type="p">143A:母扣件</p>
        <p type="p">143B:公插件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2035" publication-number="202618263">
    <tif-files tif-type="multi-tif">
      <tif file="114133413.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄層片移設裝置及薄層片之移設方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251008B">G01N23/2202</main-classification>
        <further-classification edition="201801120251008B">G01N23/2206</further-classification>
        <further-classification edition="201801120251008B">G01N23/2251</further-classification>
        <further-classification edition="200601120251008B">H01J37/26</further-classification>
        <further-classification edition="200601120251008B">H01L21/677</further-classification>
        <further-classification edition="200601120251008B">H01L21/687</further-classification>
        <further-classification edition="200601120251008B">G01J9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麻畑達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHATA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一宮豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKKU, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在薄層片(LM)吸附於鑷子(16)的情況下，藉由使薄層片(LM)迅速且穩定地從鑷子(16)脫離，以繼續進行移設作業。首先，在將被製作於試料(SAM)的薄層片(LM)以鑷子(16)夾持後，藉由令鑷子(16)做移動，以從試料(SAM)取得薄層片(LM)。接著，在薄層片(LM)被鑷子(16)所夾持的狀態下，令薄層片(LM)接觸於樣品架(21)後，鬆開鑷子(16)。接著，在鑷子(16)的鬆開後，薄層片(LM)是吸附於鑷子(16)的情況下，實施用來使薄層片(LM)脫離鑷子(16)所需之脫離處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2036" publication-number="202618264">
    <tif-files tif-type="multi-tif">
      <tif file="114133415.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133415</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄層片移設裝置及薄層片之移設方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251008B">G01N23/2202</main-classification>
        <further-classification edition="201801120251008B">G01N23/2206</further-classification>
        <further-classification edition="201801120251008B">G01N23/2251</further-classification>
        <further-classification edition="200601120251008B">H01J37/26</further-classification>
        <further-classification edition="200601120251008B">H01L21/677</further-classification>
        <further-classification edition="200601120251008B">H01L21/687</further-classification>
        <further-classification edition="200601120251008B">G01J3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麻畑達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHATA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一宮豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKKU, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">正確地測知薄層片(LM)及膜(23)之接觸，並適切地管理薄層片(LM)之按壓量。在將被製作於試料(SAM)的薄層片(LM)以鑷子(16)夾持後，藉由令鑷子(16)做移動，以從試料(SAM)取得薄層片(LM)。在薄層片(LM)被鑷子(16)所夾持的狀態下，令薄層片(LM)接觸於樣品架(21)的膜(23)。在令鑷子(16)做移動以使薄層片(LM)按壓至膜(23)之際，隨應於膜(23)的干涉像之強度變化，而令鑷子(16)之移動被停止，將薄層片(LM)載置於膜(23)上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2037" publication-number="202618925">
    <tif-files tif-type="multi-tif">
      <tif file="114133441.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理薄膜的方法及製造記憶體裝置的方法</chinese-title>
        <english-title>METHOD OF TREATING THIN FILMS AND METHOD OF MANUFACTURING MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01L21/31</main-classification>
        <further-classification edition="200601120260128B">C23C16/455</further-classification>
        <further-classification edition="202501120260128B">H10D64/68</further-classification>
        <further-classification edition="202501120260128B">H10D1/60</further-classification>
        <further-classification edition="202301120260128B">H10B43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＥＧＴＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGTM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹圭鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KYU HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭玹姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, HYUN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金哈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HA NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭主煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JU HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹賢植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYEON SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韓彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAN BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白善永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAIK, SUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓智娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JI YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種處理薄膜的方法，該方法包含：將一封蓋前驅物供應至置放有一基體的腔室之內部，以使該封蓋前驅物吸附至形成於該基體上之一薄膜上；吹掃該腔室之內部；將一第一反應材料供應至該腔室之內部以形成一應力源層；吹掃該腔室之內部；將該基體退火；將一蝕刻引發劑供應至該腔室之內部；吹掃該腔室之內部；將一第二反應材料供應至該腔室之內部以活化該蝕刻引發劑；及吹掃該腔室的內部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of treating thin films, the method comprising: supplying a capping precursor to the inside of a chamber where a substrate is placed to adsorb the capping precursor onto a thin film formed on the substrate; purging the inside of the chamber; supplying a first reaction material to the inside of the chamber to form a stressor layer; purging the inside of the chamber; annealing the substrate; supplying an etch initiator to the inside of the chamber; purging the inside of the chamber; supplying a second reaction material to the inside of the chamber to activate the etch initiator; and purging the inside of the chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2038" publication-number="202617671">
    <tif-files tif-type="multi-tif">
      <tif file="114133461.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物組成物、相位差膜形成用組成物、配向膜形成用組成物及相位差材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C69/734</main-classification>
        <further-classification edition="200601120260202B">C08F20/40</further-classification>
        <further-classification edition="200601120260202B">C08J5/18</further-classification>
        <further-classification edition="200601120260202B">G02B1/04</further-classification>
        <further-classification edition="200601120260202B">G02B5/30</further-classification>
        <further-classification edition="200601120260202B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉井友基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森内正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIUCHI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合物組成物，含有在側鏈具有下列式(a)表示之感光性基(p1)的聚合物(P)，上述聚合物(P)具有來自於具有前述感光性基(p1)和聚合性不飽和鍵之單體化合物的結構單元(X1)。  &lt;br/&gt;&lt;img align="absmiddle" height="87px" width="374px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(a)中，Ar表示具有伸芳基之碳數6~30之2價有機基，Ar以構成芳香族烴環之碳原子和-CR=中之碳原子鍵結。L表示單鍵或-O-。R&lt;sub&gt;M&lt;/sub&gt;表示碳數1~4之1價有機基。m為1~12之整數。R及R’各自獨立地表示氫原子、鹵素原子、氰基或碳數1~3之烷基，該烷基中之氫原子之一部分或全部亦可被氟原子取代，R及R’中之至少一者表示氫原子以外的基或鹵素原子。*表示原子鍵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2039" publication-number="202617665">
    <tif-files tif-type="multi-tif">
      <tif file="114133462.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物組成物、相位差膜形成用組成物、配向膜形成用組成物及相位差材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C69/54</main-classification>
        <further-classification edition="200601120260202B">C08F20/40</further-classification>
        <further-classification edition="200601120260202B">C08L33/14</further-classification>
        <further-classification edition="200601120260202B">C08J5/18</further-classification>
        <further-classification edition="200601120260202B">G02B5/30</further-classification>
        <further-classification edition="200601120260202B">G02F1/1335</further-classification>
        <further-classification edition="200601120260202B">G02F1/1337</further-classification>
        <further-classification edition="200601120260202B">H05B33/02</further-classification>
        <further-classification edition="202301120260202B">H10K50/85</further-classification>
        <further-classification edition="202301120260202B">H10K59/10</further-classification>
        <further-classification edition="202301120260202B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉井友基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森内正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIUCHI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤枝司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIEDA, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合物組成物，含有在側鏈具有下述式(a)表示之感光性基(p1)的聚合物(P)，前述聚合物(P)具有來自具有聚合性不飽和鍵的單體化合物之結構單元。&lt;br/&gt;&lt;img align="absmiddle" height="57px" width="344px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (式(a)中，Ar表示具有伸芳基的碳數6~30之2價有機基，Ar以構成芳香族烴環的碳原子與-CR=中之碳原子鍵結。&lt;br/&gt;  L表示單鍵或-O-。&lt;br/&gt;  m為1~12之整數。&lt;br/&gt;  R及R’各自獨立地表示氫原子、鹵素原子、氰基、或碳數1~3之烷基，該烷基中之氫原子的一部分或全部也可被氟原子取代，R及R’中的至少一者表示氫原子以外的基或原子。&lt;br/&gt;  ＊表示原子鍵。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2040" publication-number="202618074">
    <tif-files tif-type="multi-tif">
      <tif file="114133514.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電沉積/電鍍金屬的方法與系統</chinese-title>
        <english-title>METHOD AND SYSTEM OF ELECTRODEPOSITING/ELECTROPLATING METAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C25D17/06</main-classification>
        <further-classification edition="200601120260127B">C25D7/12</further-classification>
        <further-classification edition="200601120260127B">C25D21/12</further-classification>
        <further-classification edition="200601120260127B">H01L21/288</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥伯斯特　賈斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBERST, JUSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克羅　布萊恩　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCKALEW, BRYAN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾克森　卡里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THORKELSSON, KARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">進行金屬至半導體基板上之透遮罩特徵部中的順序電沉積，以例如減少唇形密封件對遮罩材料上之壓力的不利後果。在第一電鍍步驟中，利用唇形密封件電沉積第一金屬(例如，鎳)，該唇形密封件具有在距離基板邊緣第一距離處接觸半導體基板的最內接觸點。在第二電鍍步驟中，利用唇形密封件電沉積第二金屬(例如，錫)，該唇形密封件具有在距離基板邊緣比第一距離更大之距離處接觸半導體基板的最內接觸點。這容許將唇形密封件的壓力從第一電沉積步驟期間可能已被損壞的點進行至少部分偏移，且容許將第一電沉積步驟期間可能已形成於遮罩材料中的任何裂縫與電解質隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Sequential electrodeposition of metals into through-mask features on a semiconductor substrate is conducted such as to reduce the deleterious consequences of lipseal’s pressure onto the mask material. In a first electroplating step, a first metal (e.g., nickel) is electrodeposited using a lipseal that has an innermost point of contact with the semiconductor substrate at a first distance from the edge of the substrate. In a second electroplating step, a second metal (e.g., tin) is electrodeposited using a lipseal that has an innermost point of contact with the semiconductor substrate at a greater distance from the edge of the substrate than the first distance. This allows to at least partially shift the lipseal pressure from a point that could have been damaged during the first electrodeposition step and to shield from electrolyte any cracks that might have formed in the mask material during the first electroplating step.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:步驟</p>
        <p type="p">303:步驟</p>
        <p type="p">305:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2041" publication-number="202617810">
    <tif-files tif-type="multi-tif">
      <tif file="114133516.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有非均勻形態之聚矽氧水凝膠隱形眼鏡</chinese-title>
        <english-title>SILICONE HYDROGEL CONTACT LENSES HAVING NON-UNIFORM MORPHOLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C08F230/08</main-classification>
        <further-classification edition="200601120260123B">C08L83/04</further-classification>
        <further-classification edition="200601120260123B">C08L39/06</further-classification>
        <further-classification edition="200601120260123B">C08J3/075</further-classification>
        <further-classification edition="200601120260123B">G02C1/04</further-classification>
        <further-classification edition="200601120260123B">G02C7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商壯生和壯生視覺關懷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里　阿札姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLI, AZAAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里德勒　唐納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIEDERER, DONALD E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古茲曼　亞力山德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUZMAN, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑塔馬利亞　貝納多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTA MARIA, BERNARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所述的是一種具有非均勻形態之聚矽氧水凝膠隱形眼鏡。該隱形眼鏡可由反應性混合物所製成，該反應混合物包含：含聚矽氧組分；親水性組分；非反應性聚合內部潤濕劑；及聚合起始劑，該隱形眼鏡具有至少約60巴勒(barrer)之透氧性，並且其中該聚合非反應性內部潤濕劑對聚矽氧在該隱形眼鏡中之莫耳比，在無表面處理下在該隱形眼鏡之表面中比在其主體中大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described is a silicone hydrogel contact lens having non-uniform morphology. The contact lens may be made from a reactive mixture comprising: a silicone-containing component; a hydrophilic component; a non-reactive polymeric internal wetting agent; and a polymerization initiator, the contact lens having an oxygen permeability of at least about 60 barrers, and wherein the molar ratio in the lens of the polymeric non-reactive internal wetting agent to silicone, without a surface treatment, is greater in the lens's surface than in its bulk.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2042" publication-number="202617122">
    <tif-files tif-type="multi-tif">
      <tif file="114133517.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133517</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伸展運動機</chinese-title>
        <english-title>STRETCHING EXERCISE MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">A61H23/02</main-classification>
        <further-classification edition="200601120260116B">A61H1/02</further-classification>
        <further-classification edition="200601120260116B">A63B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大東電機工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAITO ELECTRIC MACHINE INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沼田康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUMATA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水新策</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, SHINSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">伸展運動機10具備：本體部11，具有對使用者U的身體進行按壓之按壓機構30；一對掛肩部12，從本體部11延伸設置且掛在使用者U的左右的肩膀S；及一對束緊部13，將一對掛肩部12分別束緊於使用者U的左右的肩膀S；該伸展運動機10係將本體部11裝設於使用者U的背部B而使用，在該伸展運動機10中，當藉由一對束緊部13將一對掛肩部12分別束緊於使用者U的左右的肩膀S時，本體部11係涵蓋從使用者U的左右的肩膀S至背部B的範圍而裝設，且於可對使用者U的背部B中之包含左右肩胛骨之間的區域之被施療部X進行按壓的位置，配置按壓機構30。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stretching exercise machine 10 includes: a main body part 11 including apressing mechanism 30 configured to press the body of a user U; a pair of strap parts 12 extending from the main body part 11 and hangable from the left and right shoulders S of the user U; and a pair of fastening parts 13 configured to fasten the pair of strap parts 12 onto the left and right shoulders S of the user U. The stretching exercise machine 10 is usable with the main body part 11 put on the back B of the user U. In a state in which the pair of strap parts 12 are fastened onto the left and right shoulders S of the user U by the pair of fastening parts 13, the main body part 11 is put on a region from the left and right shoulders S to the back B of the user U, and the pressing mechanism 30 is placed at a position where the pressing mechanism 30 is pressable against a treatment target X covering a region between the left and right shoulder blades in the back B of the user U.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,10A:伸展運動機</p>
        <p type="p">11:本體部</p>
        <p type="p">12:掛肩部</p>
        <p type="p">12a:左掛肩部</p>
        <p type="p">12b:右掛肩部</p>
        <p type="p">12c:狹縫</p>
        <p type="p">15,17:外裝罩</p>
        <p type="p">15a,17a:第1布狀構件</p>
        <p type="p">15c:第1面</p>
        <p type="p">17b:第2布狀構件</p>
        <p type="p">19:保持部</p>
        <p type="p">21:束緊帶</p>
        <p type="p">22:扣環</p>
        <p type="p">23:握持部</p>
        <p type="p">U:使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2043" publication-number="202618045">
    <tif-files tif-type="multi-tif">
      <tif file="114133527.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於淨化製程氣體之方法及CVD反應器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C16/44</main-classification>
        <further-classification edition="200601120260202B">C23C16/455</further-classification>
        <further-classification edition="200601120260202B">B01D49/00</further-classification>
        <further-classification edition="200601120260202B">B01D53/00</further-classification>
        <further-classification edition="200601120260202B">B01D53/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商愛思強歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIXTRON SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍肯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEUKEN, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種加工CVD反應器4工作時產生之包括所有輔助氣流在內的使用過的氣體之方法，該使用過的氣體首先在加工裝置40中淨化，或在氣體洗滌器25中進行處置。在分析裝置19中對該經過加工之使用過的氣體的雜質進行定性及定量分析。根據此處得到的分析結果及對使用該氣體之方法步驟之認識，分類裝置17將該經過淨化的使用過的氣體作為再循環氣體分類至不同的容器12、13、14，其中每個容器12、13、14皆對應一應用等級，該應用等級給定能夠在哪個製程步驟中在CVD反應器中將該再循環氣體作為載氣重複使用。氣體之重新使用之特點在於，該使用過的氣體中的任何殘餘雜質皆不會對該製程產生負面影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:CVD反應器</p>
        <p type="p">12:容器</p>
        <p type="p">13:容器</p>
        <p type="p">14:容器</p>
        <p type="p">17:第二分類裝置</p>
        <p type="p">19:第二分析裝置</p>
        <p type="p">25:第一氣體洗滌器</p>
        <p type="p">39:供氣裝置</p>
        <p type="p">40:加工裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2044" publication-number="202617331">
    <tif-files tif-type="multi-tif">
      <tif file="114133542.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性夾持器</chinese-title>
        <english-title>MAGNET GRIPPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">B23Q3/15</main-classification>
        <further-classification edition="200601120260129B">H01F7/122</further-classification>
        <further-classification edition="200601120260129B">G02F1/09</further-classification>
        <further-classification edition="200601120260129B">B25J15/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢島久志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAJIMA, HISASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">磁性夾持器(10)係吸附工件(W)之磁性夾持器，其具備永電磁鐵(12)、線圈(14)、磁軛(16)及顯示薄片(30)，永電磁鐵(12)包含第1永久磁鐵(12a)及第2永久磁鐵(12b)；線圈(14)至少纏繞在第2永久磁鐵的外周，且藉由使電流流過而可讓第2永久磁鐵的磁化方向反轉；磁軛(16)在內側收容永電磁鐵；顯示薄片(30)具有使用由具有磁性的粒子製成之光子晶體的介質(30a)，且隨著第2永久磁鐵之磁化方向的反轉而改變顏色。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnet gripper (10) for attracting a workpiece (W) includes: a permanent magnet (12) including a first permanent magnet (12a) and a second permanent magnet (12b); a coil (14) wound at least around the second permanent magnet to cause a direction of magnetization of the second permanent magnet to be reversed by a current flowing through the coil; a yoke (16) internally accommodating the permanent magnet; and a display sheet (30) that includes a medium (30a) using a photonic crystal of magnetic particles and has a color changeable in response to the reversal of the direction of magnetization of the second permanent magnet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:磁性夾持器</p>
        <p type="p">12:永電磁鐵</p>
        <p type="p">12a:第1永久磁鐵</p>
        <p type="p">12b:第2永久磁鐵</p>
        <p type="p">14:線圈</p>
        <p type="p">16:磁軛</p>
        <p type="p">16b:下軛</p>
        <p type="p">16t:上軛</p>
        <p type="p">16u:外軛</p>
        <p type="p">20:被覆構件</p>
        <p type="p">30:顯示薄片</p>
        <p type="p">Nm:非磁性體</p>
        <p type="p">Rd:襯墊</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2045" publication-number="202619264">
    <tif-files tif-type="multi-tif">
      <tif file="114133544.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機械臂掉電保護電路及掃地機器人</chinese-title>
        <english-title>MECHANICAL ARM POWER-FAILURE PROTECTION CIRCUIT AND ROBOT VACUUM CLEANER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H02P3/06</main-classification>
        <further-classification edition="200601120260127B">H02P3/12</further-classification>
        <further-classification edition="200601120260127B">H02P3/22</further-classification>
        <further-classification edition="200601120260127B">H02P6/24</further-classification>
        <further-classification edition="200601120260127B">B25J9/16</further-classification>
        <further-classification edition="200601120260127B">A47L11/24</further-classification>
        <further-classification edition="200601120260127B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒綠武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, LVWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇澤彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, ZEBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種機械臂掉電保護電路及掃地機器人，涉及電機控制技術領域，包括供電模組、微控制模組、繼電器和機械臂控制模組，當供電模組供電時，繼電器的控制端通電以控制公共端與第二連接端導通，微控制模組控制供電模組與電機的輸入端連接；當供電模組斷電時，繼電器的控制端斷電，公共端與第一連接端導通，電機的輸入端與接地端連接，電機的線圈形成回路電流並產生阻力以減緩機械臂下降。本申請利用繼電器自動切換的功能，在電源斷開時迅速切換電機的連接狀態，利用電機自身的物理特性產生阻力從而減緩機械臂下降，電路結構簡單、成本低，無需佔據較大的安裝空間，能夠應用於各種尺寸型號的機械臂，具有較為廣泛的應用範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a mechanical arm power-failure protection circuit and a robot vacuum cleaner, which relates to the field of motor control technology. The system includes a power supply module, a microcontroller module, a relay, and a mechanical arm control module. When the power supply module is powered on, the control terminal of the relay is energized to control the connection between the common terminal and the second connection terminal, and the microcontroller module controls the connection between the power supply module and the input terminal of the motor. When the power supply module loses power, the control terminal of the relay is de-energized, and the common terminal is connected to the first connection terminal, while the motor's input terminal is connected to the ground terminal. The motor's coil forms a closed loop current, creating resistance that slows down the descent of the mechanical arm. This application utilizes the automatic switching function of the relay to quickly change the motor's connection state when the power is cut off, and uses the physical properties of the motor itself to generate resistance, thereby slowing the descent of the mechanical arm. The circuit structure is simple, cost-effective, requires minimal installation space, and can be applied to mechanical arms of various sizes and models, offering a broad range of applications.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2046" publication-number="202618910">
    <tif-files tif-type="multi-tif">
      <tif file="114133565.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於藉由線鋸切將工件切分成晶圓的線材</chinese-title>
        <english-title>WIRE FOR DIVIDING A WORKPIECE INTO WAFERS BY MEANS OF WIRE SAWING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/304</main-classification>
        <further-classification edition="200601120260122B">H01L21/67</further-classification>
        <further-classification edition="200601120260122B">B26D1/547</further-classification>
        <further-classification edition="200601120260122B">B26D1/553</further-classification>
        <further-classification edition="200601120260122B">B23D61/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商世創電子材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILTRONIC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮茲奇　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIETSCH, GEORG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於藉由線鋸和磨料漿料同時將工件切分成多個均勻晶圓的處於拉伸應力下的線材，其中該線材具有多個兩種不同波長的捲曲（部），其幅度在選定拉伸應力下相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Wire under tensile stress for dividing a workpiece into a multiplicity of uniform wafers simultaneously by means of a wire saw and a slurry of abrasives, wherein the wire has a multiplicity of crimps of two different wavelengths, the amplitudes of which are identical at the selected tensile stress.</p>
      </isu-abst>
      <representative-img>
        <p type="p">27:第一捲曲幅度</p>
        <p type="p">28:第二捲曲幅度</p>
        <p type="p">29:第一捲曲波長</p>
        <p type="p">30:第二捲曲波長</p>
        <p type="p">38:中性軸線</p>
        <p type="p">55:長波長捲曲</p>
        <p type="p">56:短波長捲曲</p>
        <p type="p">57:捲曲頂端處中性軸線上點</p>
        <p type="p">58:圓形有效橫截面</p>
        <p type="p">59:橢圓形有效橫截面</p>
        <p type="p">60:基礎平滑線材軸線</p>
        <p type="p">61:具消失曲率中性軸線上點</p>
        <p type="p">A&lt;sub&gt;1&lt;/sub&gt;:第一捲曲幅度</p>
        <p type="p">A&lt;sub&gt;2&lt;/sub&gt;:第二捲曲幅度</p>
        <p type="p">λ&lt;sub&gt;1&lt;/sub&gt;:第一捲曲波長</p>
        <p type="p">λ&lt;sub&gt;2&lt;/sub&gt;:第二捲曲波長</p>
        <p type="p">d:直徑</p>
        <p type="p">d&lt;sub&gt;eff&lt;/sub&gt;:有效直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2047" publication-number="202618301">
    <tif-files tif-type="multi-tif">
      <tif file="114133566.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針及檢查裝置</chinese-title>
        <english-title>PROBE AND INSPECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">G01R1/067</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商友華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOWO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野里銀太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONOZATO, GINTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種探針及檢查裝置，該探針具備：基端部；前端部，係與檢查對象物接觸；第一樑部，係與前述基端部連接；以及第二樑部，係與前述第一樑部連接並支持前述前端部；其中，前述第一樑部係具有用以使前述前端部被壓入前述檢查對象物時之前述第一樑部的撓曲增大的構造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe according to the present disclosure includes a base end, a tip end that contacts an object to be inspected, a first beam connected to the base end, and a second beam connected to the first beam and supporting the tip end, wherein the first beam has a structure for increasing the deflection of the first beam when the tip end is pressed into the object to be inspected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:檢查對象物</p>
        <p type="p">22:焊墊</p>
        <p type="p">200:中繼基板</p>
        <p type="p">300:探針</p>
        <p type="p">310:基端部</p>
        <p type="p">320:前端部</p>
        <p type="p">330:樑部</p>
        <p type="p">332:彈性樑部</p>
        <p type="p">332a:水平延伸部</p>
        <p type="p">332b:垂直延伸部</p>
        <p type="p">332c:傾斜延伸部</p>
        <p type="p">333a:第一端部</p>
        <p type="p">333b:第二端部</p>
        <p type="p">333c:第三端部</p>
        <p type="p">333d:第四端部</p>
        <p type="p">333e:第五端部</p>
        <p type="p">333f:第六端部</p>
        <p type="p">334:連接樑部</p>
        <p type="p">335a:第七端部</p>
        <p type="p">335b:第八端部</p>
        <p type="p">336a:水平支持樑部</p>
        <p type="p">336b:傾斜支持樑部</p>
        <p type="p">337a:第九端部</p>
        <p type="p">337b:第十端部</p>
        <p type="p">337c:第十一端部</p>
        <p type="p">337d:第十二端部</p>
        <p type="p">338:前端樑部</p>
        <p type="p">339a:第十三端部</p>
        <p type="p">339b:第十四端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2048" publication-number="202619164">
    <tif-files tif-type="multi-tif">
      <tif file="114133582.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電磁波吸收材料及電磁波吸收片材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">H01Q17/00</main-classification>
        <further-classification edition="200601120260129B">B32B27/20</further-classification>
        <further-classification edition="200601120260129B">C08K3/04</further-classification>
        <further-classification edition="200601120260129B">C08K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田怜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光田祥貢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUTA, YOSHITSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, HIRAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠減薄介電層，進而具有可撓性之電磁波吸收材料及使用其之電磁波吸收片材。  &lt;br/&gt;本發明係一種電磁波吸收材料，其特徵在於包含黑鉛、及具備下式(1)所表示之結晶相之無機填料。  &lt;br/&gt;MQ&lt;sub&gt;x&lt;/sub&gt;Ti&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;x&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;y&lt;/sub&gt;RE              (1)  &lt;br/&gt;式(1)中，M表示1種以上之鹼土金屬元素，Q表示1種以上之過渡金屬，RE表示1種以上之稀土元素，x、y滿足以下。  &lt;br/&gt;0.0≦x＜1.0  &lt;br/&gt;0.00≦y＜0.05</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2049" publication-number="202616992">
    <tif-files tif-type="multi-tif">
      <tif file="114133590.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133590</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>家具腳部</chinese-title>
        <english-title>FURNITURE FOOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A47B91/00</main-classification>
        <further-classification edition="200601120260131B">A47B91/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雅詩立傢俱工業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHLEY FURNITURE INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍金斯　約翰　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAWKINS, JOHN B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕里什　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARRISH, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種家具座椅，在底部表面上具有複數個鍵孔形狀的鍵槽接收複數個腳部。各該腳部具有一基座部分及一成一體的栓釘部分。該基座部分提供一種向下逐漸變細至一地板接合端之一形狀，其中栓釘部分自基座部分向上延伸。當自一端觀看時，每一腳部的栓釘部分具有一鍵形狀以與鍵槽互接並在相應的鍵槽中正確地旋轉定位該腳部。栓釘部分具有與其成一體的複數個彈簧構件，當每一栓釘插入一相應的鍵槽中時，彈簧構件偏轉且然後將栓釘部分保持於鍵槽中並將該腳部保持於家具座椅的底部表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A furniture seat with a plurality of key slots having a key hole shape, on a bottom surface receives a plurality of feet. Each of the plurality of feet having a base portion and a unitary peg portion. The base portion providing a shape with downward taper to a floor engaging end with the peg portion extending upwardly from the base portion. The peg portion of each foot, when viewed from an end, having a key shape to interface with the key slots and to properly rotationally orient the foot in the respective key slot. The peg portion having a plurality of spring members unitary therewith that deflect as each peg is inserted into a respective key slot and that then retain peg portion in the key slot and the foot to the bottom surface of the furniture seat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">48:家具腳部</p>
        <p type="p">55:面板</p>
        <p type="p">502:主體部分</p>
        <p type="p">504:栓釘部分</p>
        <p type="p">508:連續壁板</p>
        <p type="p">510:內部空腔區域</p>
        <p type="p">512:壁板</p>
        <p type="p">516:壁板</p>
        <p type="p">517:外壁表面</p>
        <p type="p">522:分隔件</p>
        <p type="p">C-C:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2050" publication-number="202619263">
    <tif-files tif-type="multi-tif">
      <tif file="114133638.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>速度選擇模塊</chinese-title>
        <english-title>SPEED SELECTION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">H02P1/22</main-classification>
        <further-classification edition="200601120260115B">H02P1/40</further-classification>
        <further-classification edition="200601120260115B">H01H13/70</further-classification>
        <further-classification edition="200601120260115B">G09F9/33</further-classification>
        <further-classification edition="200601120260115B">H05K1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商實耐寶公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNAP-ON INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周建軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JIANJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬航宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, HANGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何浩倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, HAOLUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種速度選擇模塊，其允許獨立地控制和顯示電動工具的正向旋轉方向和反向旋轉方向的速度設置。速度選擇模塊包括兩個選擇按鈕（正向選擇按鈕和反向選擇按鈕）和設置在速度選擇印刷電路板（PCB）上的與每個方向對應的照明元件（例如發光二極管（LED）），該印刷電路板用於獨立地控制正向旋轉方向和反向旋轉方向的速度設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A speed selection module that allows for independent control and display of speed settings of forward and reverse rotational directions of a power tool. The speed selection module includes two selection buttons (forward and reverse) and illumination elements (such as light emitting diodes (LEDs)) corresponding to each direction disposed on a speed selection printed circuit board (PCB) for independent control of speed settings of the forward and reverse rotational directions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:控制器組件</p>
        <p type="p">114:速度選擇模塊</p>
        <p type="p">130:控制印刷電路板(PCB)</p>
        <p type="p">132:電力接收端子</p>
        <p type="p">134:導線</p>
        <p type="p">136:速度選擇印刷電路板(PCB)</p>
        <p type="p">150:速度選擇蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2051" publication-number="202616942">
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      <tif file="114133674.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>田地作業車輛的示教方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A01C11/00</main-classification>
        <further-classification edition="200601120260130B">A01B69/00</further-classification>
        <further-classification edition="200601120260130B">A01B49/00</further-classification>
        <further-classification edition="200601120260130B">A01M7/00</further-classification>
        <further-classification edition="202401120260130B">G05D1/248</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商井關農機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISEKI &amp; CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東靖之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHI, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小佐野光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSANO, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景浦宏一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEURA, KOUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明人注意到，關於以往的農田作業車輛的示教方法，利用便利的功能時的使用便利性未必好。更具體而言，本發明人注意到要求透過較少的手動操作實現高精度的作業。一種田地作業車輛的示教方法，其對田地作業車輛示教用於在田地（50）進行自動行駛的行駛路徑，所述田地作業車輛具備行駛車體和能夠檢測所述行駛車體的位置的衛星定位單元，所述示教方法的特徵在於，包含如下行程：在中斷了對所述田地（50）的外周形狀進行示教的行駛用示教功能的執行時，從與所述中斷的位置不同的位置再次開始所述行駛用示教功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:田地</p>
        <p type="p">51:障礙物</p>
        <p type="p">D:對角線</p>
        <p type="p">E:材料補給邊</p>
        <p type="p">Va:頂點</p>
        <p type="p">Vb:頂點</p>
        <p type="p">Vc:頂點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2052" publication-number="202619346">
    <tif-files tif-type="multi-tif">
      <tif file="114133675.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理方法及其視訊處理器</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND VIDEO PROCESSOR THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251001B">H04N19/513</main-classification>
        <further-classification edition="201401120251001B">H04N19/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃議弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張孝恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIAO-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像處理方法，用於一視訊處理器，包括在一第一時點接收一第一輸入幀以及在一第二時點接收一第二輸入幀。當該第二輸入幀不是該第一輸入幀對應的一第一預定後續幀時，根據該第一輸入幀與該第二輸入幀以內插方式產生一第一插補幀。當在一第三時點未接收到任何輸入幀時，根據該第一輸入幀與該第二輸入幀以外插方式產生一第二插補幀，其中，該第三時點與該第二時點之間的一時間差實質上大於或等於一時間差閾值。透過動態切換於外插與內插之間可提高影像播放的流暢度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing method for a video processor includes receiving a first input frame a first time instant and receiving a second input frame a second time instant. When the second input frame is not to a first next scheduled frame corresponding to the first input frame, a first mend frame is generated using interpolation according to the first and second input frames. When no input frame is received at a third time instant, a second mend frame is generated using extrapolation according to the first and second input frames. A time difference between the third time point and second time point is substantially longer than or equal to a time difference threshold. The video playback smoothness can be improved by dynamically switching between extrapolation and interpolation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2053" publication-number="202618242">
    <tif-files tif-type="multi-tif">
      <tif file="114133677.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分散式材料測試系統的管理</chinese-title>
        <english-title>MANAGEMENT OF DISTRIBUTED MATERIAL TESTING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G01N3/08</main-classification>
        <further-classification edition="200601120260115B">G01N3/62</further-classification>
        <further-classification edition="201901120260115B">G06F16/24</further-classification>
        <further-classification edition="201901120260115B">G06F16/248</further-classification>
        <further-classification edition="202301120260115B">G06Q10/20</further-classification>
        <further-classification edition="201201120260115B">G06Q50/04</further-classification>
        <further-classification edition="200601120260115B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱薩　丹尼爾文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAESAR, DANIEL VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼可　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICOL, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORSE, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了從複數個材料測試系統收集資料的分散式材料測試系統的實例。在一些實例中，中央管理伺服器用於收集資料並且基於所收集的資料來識別涉及所選材料測試系統的狀態資訊、統計度量、及/或歷史事件。在一些實例中，因為使用了中央管理伺服器，狀態資訊、統計度量、及/或歷史事件可以經由與中央管理伺服器通訊的任何介面來存取。在一些實例中，管理者及/或管理員可使用狀態資訊、統計度量、及/或歷史事件來監測測試活動、識別及/或解決問題、及/或規劃未來測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are examples of distributed material testing systems that collect data from a plurality of material testing systems. In some examples, a central management server is used to collect the data and identify status information, statistical metrics, and/or historical events pertaining to selected material testing systems based on the collected data. In some examples, because the central management server is used, the status information, statistical metrics, and/or historical events can be accessed through any interface in communication with the central management server. In some examples, the status information, statistical metrics, and/or historical events may be used by managers and/or administrators to monitor testing activities, identify and/or address issues, and/or plan for future tests.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500b:統計度量GUI</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2054" publication-number="202617427">
    <tif-files tif-type="multi-tif">
      <tif file="114133690.zip" no="1">
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          <doc-number>202617427</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃積層體及太陽電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">B32B17/10</main-classification>
        <further-classification edition="200601120260116B">C03C17/34</further-classification>
        <further-classification edition="202501120260116B">H10F77/42</further-classification>
        <further-classification edition="202301120260116B">H10K85/50</further-classification>
        <further-classification edition="200601120260116B">H01B5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日野高文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINO, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示之玻璃積層體包含：玻璃薄膜，其具有第1主面及第2主面；2層樹脂層，係配置於第1主面及第2主面各自上；及，無機氧化物層，係配置於樹脂層上。玻璃積層體在應變分布之能譜中，1.4mm&lt;sup&gt;-1&lt;/sup&gt;之空間頻率下之應變分布之能量值為0以上且1000以下。應變分布之能譜係藉由以下方式所得之頻譜：將10mm×10mm之試樣在150℃之環境下保持2小時後，在23℃之環境下保持30分鐘，並測定此時試樣之應變分布。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:玻璃積層體</p>
        <p type="p">11:玻璃薄膜</p>
        <p type="p">11a:第1主面</p>
        <p type="p">11b:第2主面</p>
        <p type="p">21:第1樹脂層</p>
        <p type="p">21a,22a:接著層</p>
        <p type="p">21b,22b:樹脂薄膜</p>
        <p type="p">22:第2樹脂層</p>
        <p type="p">31:無機氧化物層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2055" publication-number="202617868">
    <tif-files tif-type="multi-tif">
      <tif file="114133691.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻燃防蟻樹脂組成物、電纜及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08L33/12</main-classification>
        <further-classification edition="200601120260119B">C08F2/44</further-classification>
        <further-classification edition="200601120260119B">C08L27/06</further-classification>
        <further-classification edition="200601120260119B">C08K5/57</further-classification>
        <further-classification edition="200601120260119B">C08K5/59</further-classification>
        <further-classification edition="200601120260119B">B29B11/10</further-classification>
        <further-classification edition="200601320260119B">C04B103/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古河電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本雅也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北嶋乃樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAJIMA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑崎悠介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWASAKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種阻燃防蟻樹脂組成物與使用該阻燃防蟻樹脂組成物之電纜及其製造方法，該阻燃防蟻樹脂組成物能夠以單層構成阻燃性及防蟻性優良之護套，具有優良的熱安定性，並且充分滿足作為電纜的護套所需之機械特性也就是拉伸強度及伸長率，而且，耐寒性及耐油性亦優良，而適合用於形成電纜的護套。&lt;br/&gt;      阻燃防蟻樹脂組成物至少含有聚氯乙烯樹脂、MBS樹脂、聚酯系塑化劑、安定劑及阻燃劑，相對於聚氯乙烯樹脂100質量份，MBS樹脂的含量為1質量份以上且20質量份以下的範圍，聚酯系塑化劑的含量為20質量份以上且40質量份以下的範圍，安定劑的含量為4質量份以上且20質量份以下的範圍，並且，阻燃劑的含量為3質量份以上且20質量份以下的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2056" publication-number="202617429">
    <tif-files tif-type="multi-tif">
      <tif file="114133705.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133705</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配管構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B32B27/00</main-classification>
        <further-classification edition="200601120260202B">B32B1/08</further-classification>
        <further-classification edition="200601120260202B">C08L71/12</further-classification>
        <further-classification edition="200601120260202B">F16L9/12</further-classification>
        <further-classification edition="200601120260202B">F16L9/14</further-classification>
        <further-classification edition="200601120260202B">F16L57/00</further-classification>
        <further-classification edition="200601120260202B">F16L58/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭有機材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI YUKIZAI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田友晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, TOMOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種配管構件，其係在主要輸送熱水(50℃以上100℃以下的液體)之內表面由含有聚苯醚系樹脂的樹脂組成物所構成之筒狀或管狀的配管構件中，可抑制伴隨該液體之送液所引起之變形，且在50℃以上100℃以下之拉伸彈性模數高，進而耐衝擊性優異；本發明的配管構件(1)的特徵在於：接觸液體的內表面具備由含有聚苯醚系樹脂的樹脂組成物所構成之部分(3)，樹脂組成物的線膨脹係數為8.5×10&lt;sup&gt;-5&lt;/sup&gt;/℃以下，80℃下的拉伸彈性模數為1000~3000MPa。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配管構件</p>
        <p type="p">3:第1管部</p>
        <p type="p">5:外裝部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2057" publication-number="202618468">
    <tif-files tif-type="multi-tif">
      <tif file="114133709.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>校正方法、模具製造方法、壓印方法、物品製造方法和資訊處理裝置</chinese-title>
        <english-title>CORRECTION METHOD, MOLD MANUFACTURING METHOD, IMPRINT METHOD, ARTICLE MANUFACTURING METHOD, AND INFORMATION PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">G03F9/00</main-classification>
        <further-classification edition="202001120260129B">G06F30/39</further-classification>
        <further-classification edition="201101120260129B">B82Y40/00</further-classification>
        <further-classification edition="200601120260129B">H01L21/304</further-classification>
        <further-classification edition="200601120260129B">B29C59/02</further-classification>
        <further-classification edition="202001320260129B">G06F119/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香川正行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGAWA, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種由資訊處理裝置校正要在壓印處理中使用的模具的圖案的設計資料的校正方法，該壓印處理在基板上的壓印材料中形成圖案，該校正方法包括：獲得在測試模具中形成的凹形圖案元素的實際體積；確定校正值，該校正值用於通過圖案元素在與測試模具的表面平行的平面方向上的尺寸來校正圖案元素的實際體積與設計體積之間的差異；以及基於校正值來校正設計資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a correction method of correcting, by an information processing apparatus, design data of a pattern of a mold to be used in an imprint process of forming a pattern in an imprint material on a substrate, comprising: obtaining an actual volume of a concave pattern element formed in a test mold; determining a correction value for correcting a difference between the actual volume and a design volume of the pattern element by a dimension of the pattern element in a plane direction parallel to a surface of the test mold; and correcting the design data based on the correction value.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2058" publication-number="202616971">
    <tif-files tif-type="multi-tif">
      <tif file="114133712.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於鞋類製品的鞋底結構</chinese-title>
        <english-title>SOLE STRUCTURE FOR AN ARTICLE OF FOOTWEAR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">A43B13/14</main-classification>
        <further-classification edition="200601120260129B">A43B13/18</further-classification>
        <further-classification edition="200601120260129B">A43B13/12</further-classification>
        <further-classification edition="202201120260129B">A43B7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商耐克創新有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKE INNOVATE C.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢　查爾斯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CHARLES S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於鞋類製品的鞋底結構，包括中底底盤，該中底底盤具有限定鞋床的第一側、設置在與該第一側相對的一側上的第二側、在第一側與第二側之間形成在該中底底盤內的第一凹穴，以及在第二側與第一凹穴之間延伸的第一孔。第一內部緩衝元件設置在該中底底盤的第一凹穴中，並且第一阻擋元件在第一內部緩衝元件與第一孔之間設置在該中底底盤的第一凹穴內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sole structure for an article of footwear includes a midsole chassis having a first side defining a footbed, a second side disposed on an opposite side from the first side, a first pocket formed within the midsole chassis between the first side and the second side, and a first aperture extending between the second side and the first pocket. A first interior cushioning element is disposed in the first pocket of the midsole chassis and a first barrier element is disposed within the first pocket of the midsole chassis between the first interior cushioning element and the first aperture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鞋類製品</p>
        <p type="p">18:前端</p>
        <p type="p">20:後端</p>
        <p type="p">22:內側</p>
        <p type="p">24:外側</p>
        <p type="p">100:鞋面</p>
        <p type="p">102:內部空腔</p>
        <p type="p">104:腳踝開口</p>
        <p type="p">200:鞋底結構</p>
        <p type="p">202:中底</p>
        <p type="p">204:外底</p>
        <p type="p">206:中底底盤</p>
        <p type="p">208:上緩衝元件</p>
        <p type="p">210:下緩衝元件</p>
        <p type="p">212:內部緩衝元件</p>
        <p type="p">214:內部緩衝元件</p>
        <p type="p">224:頂側</p>
        <p type="p">230:鞋床</p>
        <p type="p">258:週邊凸緣</p>
        <p type="p">298:前足緩衝凹穴</p>
        <p type="p">300:足跟緩衝凹穴</p>
        <p type="p">304:外側前足開口</p>
        <p type="p">308:外側足跟開口</p>
        <p type="p">A&lt;sub&gt;10&lt;/sub&gt;:縱向軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2059" publication-number="202617113">
    <tif-files tif-type="multi-tif">
      <tif file="114133731.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內褲型吸收性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A61F13/496</main-classification>
        <further-classification edition="200601120260130B">A61F13/49</further-classification>
        <further-classification edition="200601120260130B">A61F13/491</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商優你　嬌美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNICHARM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內田祥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史異</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田賢一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, KENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種內褲型吸收性物品(1)，係具有吸收性本體(10)與腰圍構件(20)與卡合構件(30)與腰圍彈性構件(26)，其中，具有用於將腰圍構件(20)前後分離的一對的分離部(25)，在吸收性本體(10)的兩側部具有防漏壁彈性構件(61)，在比吸收性芯體(11)更靠非肌膚側具有胯下彈性構件(50)，在長方向上，防漏壁彈性構件(61)的前側端，位在比在前腰圍部(20f)與分離部(25)重疊的最後側的腰圍彈性構件(26b)更靠前側的位置，胯下彈性構件(50)的前側端位在比前述最後側的腰圍彈性構件(26b)更靠後側的位置，胯下彈性構件(50)的後側端，位在比中央位置(CL)更靠後側的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:內褲型吸收性物品</p>
        <p type="p">10:吸收性本體</p>
        <p type="p">11:吸收性芯體</p>
        <p type="p">11es:最外側的端</p>
        <p type="p">20:腰圍構件</p>
        <p type="p">20b:後腰圍部</p>
        <p type="p">20f:前腰圍部</p>
        <p type="p">20np:內側的端</p>
        <p type="p">21:非肌膚側薄片</p>
        <p type="p">22:肌膚側薄片</p>
        <p type="p">23:肌膚側薄片</p>
        <p type="p">25:扎孔線(分離部)</p>
        <p type="p">26:腰圍彈性構件</p>
        <p type="p">26b:腰圍彈性構件</p>
        <p type="p">30:卡合構件</p>
        <p type="p">30eb:後側之端</p>
        <p type="p">31:基材薄片</p>
        <p type="p">32:卡合部</p>
        <p type="p">40:側接合部</p>
        <p type="p">40b:側接合部(後側)</p>
        <p type="p">40bb:後側端</p>
        <p type="p">40f:側接合部(前側)</p>
        <p type="p">40fb:後側端</p>
        <p type="p">50:胯下彈性構件</p>
        <p type="p">50eb:後側端</p>
        <p type="p">50ef:前側端</p>
        <p type="p">61:防漏壁彈性構件</p>
        <p type="p">61ef:前側端</p>
        <p type="p">66f:前側端部固定部</p>
        <p type="p">91:高壓榨部</p>
        <p type="p">CL:中央位置</p>
        <p type="p">NP:最窄位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2060" publication-number="202617608">
    <tif-files tif-type="multi-tif">
      <tif file="114133734.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133734</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬酸化合物分散液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C01G35/00</main-classification>
        <further-classification edition="200601120260202B">H01M4/36</further-classification>
        <further-classification edition="201001120260202B">H01M4/505</further-classification>
        <further-classification edition="200601120260202B">H01M4/62</further-classification>
        <further-classification edition="201001120260202B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦高史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>來間拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURUMA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷方惣一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKATA, SOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元野隆二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTONO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原周平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, SYUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之金屬酸化合物分散液含有選自由鑭、釔、鈰、釹、鋯、鈮、鉭、鉬、鎢、鈦、鋁所組成之群中之1種以上之金屬種類M，且含有：選自由鹼金屬元素及/或鹼土族金屬元素所組成之群中之1種以上之元素X及有機酸，且藉由動態光散射法所測定之D50(體積累計基準)為100nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2061" publication-number="202617788">
    <tif-files tif-type="multi-tif">
      <tif file="114133755.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F2/44</main-classification>
        <further-classification edition="200601120260202B">C08F220/36</further-classification>
        <further-classification edition="200601120260202B">C08F290/14</further-classification>
        <further-classification edition="200601120260202B">C08G77/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/027</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/075</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人東京理科大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO UNIVERSITY OF SCIENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有光晃二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMITSU, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川信広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種聚矽氧烷含有硬化性組成物，即使進行顯影，硬化反應亦可充分進行而形成樹脂層。本發明之一形態係一種硬化性組成物，含有：具有環氧基之聚矽氧烷之第一成分；以及含有羰基、與前述羰基鍵結之基且藉由加熱從前述羰基游離而產生鹼之第一基、以及含有乙烯性雙鍵之第二基之化合物之第二成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2062" publication-number="202617839">
    <tif-files tif-type="multi-tif">
      <tif file="114133772.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>撥水劑組成物</chinese-title>
        <english-title>WATER REPELLENT COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08G77/20</main-classification>
        <further-classification edition="200601120260119B">C09K3/18</further-classification>
        <further-classification edition="200601120260119B">C08F220/18</further-classification>
        <further-classification edition="201901120260119B">A41D31/10</further-classification>
        <further-classification edition="200601120260119B">C09D5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚田大翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKADA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福本可奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, KANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀川希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIKAWA, NOZOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種撥水劑組成物，係包含含有下式所示含矽單體所衍生的重複單元之聚合物(A)、及分散劑(B)，  &lt;br/&gt;CH&lt;sub&gt;2&lt;/sub&gt;=C(-R&lt;sup&gt;a&lt;/sup&gt;)-X-SiZ&lt;sub&gt;3&lt;/sub&gt;&lt;br/&gt;[式中：  &lt;br/&gt;R&lt;sup&gt;a&lt;/sup&gt;為氫原子或碳數1至5之烴基，  &lt;br/&gt;X為選自由X&lt;sup&gt;1&lt;/sup&gt;及X&lt;sup&gt;2&lt;/sup&gt;所成群組的一種以上所構成之2價基，  &lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt;為選自由-O-、-C(=O)-、及-NR’-(式中，R’在每次出現時獨立為氫原子或碳數1至30之烴基)所成群組的一種以上所構成之基，  &lt;br/&gt;X&lt;sup&gt;2&lt;/sup&gt;為碳數1至40之2價脂肪族烴基，  &lt;br/&gt;Z分別獨立為碳數1至10之烴基或-(O-SiZ&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-O-SiZ&lt;sup&gt;2&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;，  &lt;br/&gt;Z&lt;sup&gt;1&lt;/sup&gt;分別獨立為碳數1至10之烴基或-OSiZ&lt;sup&gt;11&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;，  &lt;br/&gt;Z&lt;sup&gt;11&lt;/sup&gt;分別獨立為碳數1至10之烴基或-OSiZ&lt;sup&gt;111&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;，  &lt;br/&gt;Z&lt;sup&gt;111&lt;/sup&gt;分別獨立為碳數1至10之烴基，  &lt;br/&gt;Z&lt;sup&gt;2&lt;/sup&gt;分別獨立為碳數1至10之烴基或-OSiZ&lt;sup&gt;21&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;，  &lt;br/&gt;Z&lt;sup&gt;21&lt;/sup&gt;分別獨立為碳數1至10之烴基或-OSiZ&lt;sup&gt;211&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;，  &lt;br/&gt;Z&lt;sup&gt;211&lt;/sup&gt;分別獨立為碳數1至10之烴基，  &lt;br/&gt;n分別獨立為0至196之整數]  &lt;br/&gt;前述聚合物(A)含有前述含矽單體所衍生之重複單元，在前述聚合物(A)的重量中，前述重複單元的重量佔90重量%以上，及  &lt;br/&gt;前述聚合物(A)之數平均分子量為60000以上4000000以下。  &lt;br/&gt;藉由該撥水劑組成物可對基材(尤其是纖維製品)賦予良好撥水性及良好抗滑移性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water repellent composition comprising a polymer (A) containing a repeating unit derived from a silicon-containing monomer represented by the following formula, and a dispersant (B)， &lt;br/&gt;CH&lt;sub&gt;2&lt;/sub&gt;=C(-R&lt;sup&gt;a&lt;/sup&gt;)-X-SiZ&lt;sub&gt;3&lt;/sub&gt;&lt;br/&gt;[wherein: &lt;br/&gt;R&lt;sup&gt;a&lt;/sup&gt; is a hydrogen atom or a C1-C5 hydrocarbon group, &lt;br/&gt;X is a divalent group composed of one or more selected from the group consisting of X&lt;sup&gt;1&lt;/sup&gt; and X&lt;sup&gt;2&lt;/sup&gt;, &lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt; is a group composed of one or more selected from the group consisting of -O-, -C(=O)-, and -NR'-, where R' is independently a hydrogen atom or a hydrocarbon group having 1 to 30 carbon atoms at each occurrence, &lt;br/&gt;X&lt;sup&gt;2&lt;/sup&gt; is a divalent aliphatic hydrocarbon group having 1 to 40 carbon atoms, &lt;br/&gt;Z is independently a C1-C10 hydrocarbyl group or -(O-SiZ&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-O-SiZ&lt;sup&gt;2&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;, &lt;br/&gt;Z&lt;sup&gt;1&lt;/sup&gt; are each independently a C1-C10 hydrocarbyl group or -OSiZ&lt;sup&gt;11&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;, &lt;br/&gt;Z&lt;sup&gt;11&lt;/sup&gt; are each independently a C1-C10 hydrocarbyl group or -OSiZ&lt;sup&gt;111&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;, &lt;br/&gt;Z&lt;sup&gt;111&lt;/sup&gt; are each independently a C1-C10 hydrocarbyl group, &lt;br/&gt;Z&lt;sup&gt;2&lt;/sup&gt; are each independently a C1-C10 hydrocarbyl group or -OSiZ&lt;sup&gt;21&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;, &lt;br/&gt;Z&lt;sup&gt;21&lt;/sup&gt; are each independently a C1-C10 hydrocarbyl group or -OSiZ&lt;sup&gt;211&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;, &lt;br/&gt;Z&lt;sup&gt;211&lt;/sup&gt; are each independently a C1-C10 hydrocarbyl group, &lt;br/&gt;n is independently an integer from 0 to 196] &lt;br/&gt;In the polymer (A), an amount of the repeating unit derived from the silicon-containing monomer is 90% by weight or more based on the weight of the polymer (A), and a number average molecular weight of the polymer (A) is 60000 or more and 4000000 or less. &lt;br/&gt;The water repellent composition can impart good water repellency and good slip resistance to a substrate (particularly a fiber product).</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2063" publication-number="202617795">
    <tif-files tif-type="multi-tif">
      <tif file="114133774.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎（甲基）丙烯醯胺、包含此之組成物、硬化性組成物、接著劑、密封材、硬化物、半導體裝置及電子零件</chinese-title>
        <english-title>NOVEL (METH)ACRYLAMIDE, COMPOSITION CONTAINING THE SAME, CURABLE COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F22/38</main-classification>
        <further-classification edition="200601120260202B">C09D4/00</further-classification>
        <further-classification edition="200601120260202B">C09J4/00</further-classification>
        <further-classification edition="200601120260202B">C09K3/10</further-classification>
        <further-classification edition="200601120260202B">H01L23/29</further-classification>
        <further-classification edition="200601120260202B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納美仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤文子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, AYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩谷一希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAYA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供可解決以往具有二聚物酸骨架的雙馬來醯亞胺之課題的新穎物質、其高濃度組成物、含有此之硬化性組成物、接著劑或密封材、此等硬化而成的硬化物、及包含該硬化物的半導體裝置或電子零件。  &lt;br/&gt;本發明提供二聚物酸改質N-取代(甲基)丙烯醯胺、其高濃度組成物、包含此之硬化性組成物、接著劑或密封材、此等硬化而成之硬化物、及包含該硬化物的半導體裝置或電子零件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a novel substance capable of overcoming problems associated with conventional bismaleimides having a dimer-acid skeleton, a high-concentration composition thereof, a curable composition containing the same, an adhesive or a sealing material, a cured product obtained therefrom, and a semiconductor device or an electronic component comprising the cured product. &lt;br/&gt;The present invention provides a dimer-acid-modified N-substituted (meth)acrylamide, a high-concentration composition thereof, a curable composition containing the same, an adhesive or a sealing material, a cured product obtained therefrom, and a semiconductor device or an electronic component comprising the cured product.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2064" publication-number="202617541">
    <tif-files tif-type="multi-tif">
      <tif file="114133790.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板收納容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B65D85/86</main-classification>
        <further-classification edition="200601120260127B">H01L21/673</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越聚合物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU POLYMER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板收納容器包括：容器主體，能夠上下多層地收納多個基板；蓋體，將容器主體正面的開口關閉；前保持器，設置於蓋體；支撐體，設置於容器主體的左右的側面，在容器主體的開口未被蓋體關閉的狀態下，對多個基板進行支撐；以及支撐結構，設置於容器主體的左右的側面或背面，在容器主體的開口被蓋體關閉的狀態下，在與前保持器之間對多個基板進行保持。前保持器具有：基部，裝設於蓋體；以及多個基板按壓部，在上下方向上配置且分別包括對基板進行支撐的保持部。保持部包括在基板被支撐體支撐的狀態下在與基板的下表面之間形成間隙的接受肋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:蓋體</p>
        <p type="p">40:前保持器</p>
        <p type="p">41:基部</p>
        <p type="p">42:基板按壓部</p>
        <p type="p">45:保持槽</p>
        <p type="p">45a:第一傾斜面</p>
        <p type="p">45b:第二傾斜面</p>
        <p type="p">46:引入面</p>
        <p type="p">47:拉出面</p>
        <p type="p">48:邊界</p>
        <p type="p">49:接受肋</p>
        <p type="p">422:保持部</p>
        <p type="p">G:間隙</p>
        <p type="p">L:距離</p>
        <p type="p">θ1、θ2、θ3、θ4、θ5:傾斜角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2065" publication-number="202619070">
    <tif-files tif-type="multi-tif">
      <tif file="114133794.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有二相熱管理裝置的積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE HAVING A TWO-PHASE THERMAL MANAGEMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L23/29</main-classification>
        <further-classification edition="200601120260102B">H01L23/14</further-classification>
        <further-classification edition="200601120260102B">H01L23/427</further-classification>
        <further-classification edition="200601120260102B">H01L23/34</further-classification>
        <further-classification edition="200601120260102B">H01L23/04</further-classification>
        <further-classification edition="200601120260102B">H01L23/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>於　友民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YOUMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼克法爾　納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKFAR, NADER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各種態樣大致上係關於一積體電路裝置，諸如一經封裝積體電路裝置。在一些態樣中，一積體電路裝置包括一半導體晶粒及熱耦接至該半導體晶粒的一蓋。該蓋包括一二相熱管理裝置。該積體電路裝置亦包括與該半導體晶粒及該蓋接觸的一界面層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to an integrated circuit device, such as a packaged integrated circuit device. In some aspects, an integrated circuit device includes a semiconductor die and a lid thermally coupled to the semiconductor die. The lid includes a two-phase thermal management device. The integrated circuit device also includes an interface layer in contact with the semiconductor die and the lid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:印刷電路板(PCB)</p>
        <p type="p">104:基材</p>
        <p type="p">106:晶粒附接</p>
        <p type="p">108:晶粒</p>
        <p type="p">110:冷卻結構；二相熱管理裝置</p>
        <p type="p">114:模製化合物(MC)</p>
        <p type="p">120:導電互連件(CI)</p>
        <p type="p">122:界面層</p>
        <p type="p">150:封裝層(PL)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2066" publication-number="202617995">
    <tif-files tif-type="multi-tif">
      <tif file="114133800.zip" no="1">
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        <document-id>
          <doc-number>114133800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反義誘導之酸性α-葡萄苷酶中的外顯子2包含</chinese-title>
        <english-title>ANTISENSE-INDUCED EXON2 INCLUSION IN ACID ALPHA-GLUCOSIDASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260123B">C12N15/113</main-classification>
        <further-classification edition="200601120260123B">A61K31/712</further-classification>
        <further-classification edition="200601120260123B">A61K48/00</further-classification>
        <further-classification edition="200601120260123B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商撒拉巴塔療法公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAREPTA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩多大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURDOCH UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾騰　史蒂芬　多納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILTON, STEVEN DONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛瑞踏呵　蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLETCHER, SUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翰森　格如納　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSON, GUNNAR JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝斯特霍克　李察　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESTWICK, RICHARD KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史克尼爾　佛德里克　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNELL, FREDERICK J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本文所揭示的內容係關於用於誘導外顯子包含以作為對第II型肝醣蓄積病（GSD-II）（亦稱為龐貝症、肝醣病II、酸性麥芽糖酶缺乏（AMD）、酸性α-葡萄苷酶缺乏、與溶酶體性α-葡萄苷酶缺乏）的醫療的反義寡聚物與相關的組成物與方法，且更具體言之係關於誘導外顯子2之包含並藉此恢復由GAA基因編碼的酵素性活性的酸性α-葡萄苷酶（GAA）蛋白質之水平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to antisense oligomers and related compositions and methods for inducing exon inclusion as a treatment for glycogen storage disease type II (GSD-II) (also known as Pompe disease, glycogenosis II, acid maltase deficiency (AMD), acid alpha-glucosidase deficiency, and lysosomal alpha-glucosidase deficiency), and more specifically relates to inducing inclusion of exon 2 and thereby restoring levels of enzymatically active acid alpha-glucosidase (GAA) protein encoded by the &lt;i&gt;GAA&lt;/i&gt; gene.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2067" publication-number="202617566">
    <tif-files tif-type="multi-tif">
      <tif file="114133861.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬運車系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B65G49/07</main-classification>
        <further-classification edition="200601120260130B">B65G1/00</further-classification>
        <further-classification edition="200601120260130B">H01L21/677</further-classification>
        <further-classification edition="200601120260130B">H01L21/68</further-classification>
        <further-classification edition="200601120260130B">G05B19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青本和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOMOTO, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">高架搬運車系統，具備：複數通口；及行走軌道；及搬運車；及教學台車，藉由在與複數通口的各個對應的行走停止位置將教學組件下降至通口來取得教學資料；及判別台車；及台車控制器，控制搬運車、教學台車及判別台車；判別台車，具有：攝像裝置，取得使用於位置偏離的判別用的畫像；及判別部，依據攝像裝置所取得的畫像來位置偏離的判別；及輸出部，將判別部的判別結果輸出。台車控制器，是依據從輸出部所輸出的判別結果，將被判別為有位置偏離的通口設成特定通口並輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高架搬運車系統</p>
        <p type="p">10:搬運車</p>
        <p type="p">20:教學台車</p>
        <p type="p">30:判別台車</p>
        <p type="p">33:攝像裝置(檢測部)</p>
        <p type="p">34:記憶部</p>
        <p type="p">35:判別部</p>
        <p type="p">36:輸出部</p>
        <p type="p">37:控制部</p>
        <p type="p">40:台車控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2068" publication-number="202617701">
    <tif-files tif-type="multi-tif">
      <tif file="114133881.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617701</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D333/54</main-classification>
        <further-classification edition="200601120260202B">C07D333/56</further-classification>
        <further-classification edition="200601120260202B">C07D333/68</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡知昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物的感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法，其中，感光化射線性或感放射線性樹脂組成物含有樹脂、光酸產生劑、及酸擴散控制劑，並且酸擴散控制劑中的至少一種包含具有特定結構的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2069" publication-number="202619461">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水冷散熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H05K7/20</main-classification>
        <further-classification edition="200601120260122B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古河電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内村泰博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIMURA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤裕士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種水冷散熱器，能夠提升設置位置的自由度。&lt;br/&gt;      一種水冷散熱器，冷卻記憶體，該水冷散熱器，具備：配管群，由複數個配管構成，該配管具有接觸部、第1彎曲部及第2彎曲部，該接觸部與被設置在記憶體模組上的記憶體熱接觸且直線狀地延伸，該第1彎曲部與前述接觸部的一端連結，該第2彎曲部與前述接觸部的另一端連結，在該配管中，前述第1彎曲部的一端與前述接觸部的連結部的高度，與前述第1彎曲部的另一端的高度相異，及/或，前述第2彎曲部的一端與前述接觸部的連結部的高度，與前述第2彎曲部的另一端的高度相異；入口側歧管，與前述配管群中的前述第1彎曲部的另一端連結，並將冷媒供給至前述配管群中；及，出口側歧管，與前述配管群中的前述第2彎曲部的另一端連結，並將前述冷媒從前述配管群排出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水冷散熱器</p>
        <p type="p">10:配管群</p>
        <p type="p">11b:第1彎曲部</p>
        <p type="p">11c:第2彎曲部</p>
        <p type="p">20:入口側歧管</p>
        <p type="p">30:出口側歧管</p>
        <p type="p">40:熱傳導片</p>
        <p type="p">70:記憶體模組</p>
        <p type="p">71:記憶體</p>
        <p type="p">80:基板</p>
        <p type="p">81:插槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2070" publication-number="202617806">
    <tif-files tif-type="multi-tif">
      <tif file="114133899.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>撥液劑組合物、撥液劑處理物、賦予撥液性之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F220/18</main-classification>
        <further-classification edition="200601120260202B">C08F220/36</further-classification>
        <further-classification edition="200601120260202B">C08F222/16</further-classification>
        <further-classification edition="200601120260202B">C08L33/04</further-classification>
        <further-classification edition="200601120260202B">C08L35/02</further-classification>
        <further-classification edition="200601120260202B">C09D133/04</further-classification>
        <further-classification edition="200601120260202B">C09D135/02</further-classification>
        <further-classification edition="200601120260202B">C09K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOF CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板東孝信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDO, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本伸之輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, SHINNOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之撥液劑組合物包含：聚合物(A)，其具有來自下述式(1)所示之單體(a)之結構單元、及來自具有碳數6～28之烷基之丙烯酸單體(b)之結構單元；以及液狀介質。  &lt;br/&gt;根據本發明，可提供一種撥液劑組合物、利用上述撥液劑組合物處理而成之撥液劑處理物、及使用上述撥液劑組合物之賦予撥液性之方法，上述撥液劑組合物包含對被處理物顯示出優異之撥液性且與極性溶劑之相容性良好之非氟系聚合物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="91px" width="335px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，X表示O或NH基，R&lt;sup&gt;1&lt;/sup&gt;表示碳數為1以上28以下之烷基。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2071" publication-number="202617812">
    <tif-files tif-type="multi-tif">
      <tif file="114133902.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著膠帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08F265/06</main-classification>
        <further-classification edition="201801120260119B">C09J7/38</further-classification>
        <further-classification edition="201801120260119B">C09J7/26</further-classification>
        <further-classification edition="200601120260119B">B65D81/34</further-classification>
        <further-classification edition="200601120260119B">B32B27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商霓塔股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐古圭輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種蒸氣排出性、保持性、及抑制容器變形性優異之黏著膠帶。  &lt;br/&gt;　　一種用以壓貼具有蒸氣釋放口之容器來密封蒸氣釋放口所使用之黏著膠帶，其具備膜狀基材，與積層於基材之至少單面上之感壓黏著劑層，且感壓黏著劑層之表面具有凹凸構造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏著膠帶</p>
        <p type="p">2:基材</p>
        <p type="p">3:感壓黏著劑層</p>
        <p type="p">100:容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2072" publication-number="202618143">
    <tif-files tif-type="multi-tif">
      <tif file="114133922.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多排平行迴圈滾子以減少行程脈動的線性滾子型材導軌</chinese-title>
        <english-title>LINEAR ROLLER PROFILE RAIL GUIDE WITH A PLURALITY OF PARALLEL CIRCULATING ROWS OF ROLLERS TO REDUCE STROKE PULSATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">F16C29/04</main-classification>
        <further-classification edition="200601120260115B">B23Q1/26</further-classification>
        <further-classification edition="200601120260115B">F16C33/46</further-classification>
        <further-classification edition="200601120260115B">F16C33/66</further-classification>
        <further-classification edition="200601120260115B">B23Q1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商施內貝格爾控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEEBERGER HOLDING AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榮格林　馬塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNGLING, MARCEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內茨　康斯坦丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NETZ, KONSTANTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹恩　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANN, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線性滾子型材導軌，其包括具有至少四個滾子運行軌道面的型材導軌以及能沿所述型材導軌的縱向方向移動的導向滑架（10），所述導向滑架具有形成在主體（11）上的至少四個滾子運行軌道面。所述導向滑架（10）上設置有分別用於彼此並排設置的多排滾子（R1，R2）的至少四個滿額配置式滾子偏轉裝置（UV1，UV2），其中，在其中一個滾子偏轉裝置（UV1，UV2）的滾子迴圈通道中，當所述導向滑架（10）沿所述型材導軌的縱向方向移動時，第一排滾子中的滾子（R1）以及第二排滾子中的滾子（R2）分別平行於預設的第一平面（E1，E2）沿一環形閉合滾子軌道並排迴圈。各滾子偏轉裝置（UV1，UV2）的滾子迴圈通道內設有分隔腹板（TS），其在第一排滾子（R1）和第二排滾子（R2）之間延伸，並將第一排滾子中的滾子（R1）和第二排滾子中的滾子（R2）在空間上分隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The linear roller profile rail guide comprises a profile guide rail with at least four roller running track surfaces and a guide carriage (10) moveable in the longitudinal direction of the profile guide rail with at least four roller running track surfaces formed on a main body (11). At least four full complement roller deflection devices (UV1, UV2) are arranged on the guide carriage (10), each for a plurality of rows of rollers (R1, R2) arranged next to each other, wherein, in a roller circulation channel of one of the roller deflection devices (UV1, UV2), when the guide carriage (10) moves in the longitudinal direction of the profile guide rail, the rollers (R1) of a first row of rollers and the rollers (R2) of a second row of rollers circulate next to each other along a ring-shaped closed roller orbit respectively parallel to a predetermined first plane (E1, E2). A separating web (TS) is arranged in the roller circulation channel of the respective roller deflection device (UV1, UV2), which extends between the first row of rollers (R1) and the second row of rollers (R2) and spatially separates the rollers (R1) of the first row of rollers from the rollers (R2) of the second row of rollers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:導向滑架</p>
        <p type="p">11:主體</p>
        <p type="p">UV1，UV2:滾子偏轉裝置</p>
        <p type="p">R1，R2:滾子</p>
        <p type="p">E1，E2:第一平面</p>
        <p type="p">TS:分隔腹板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2073" publication-number="202617695">
    <tif-files tif-type="multi-tif">
      <tif file="114133928.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D213/89</main-classification>
        <further-classification edition="200601120260202B">C07D215/60</further-classification>
        <further-classification edition="200601120260202B">C07D263/57</further-classification>
        <further-classification edition="200601120260202B">C07D277/62</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡知昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上農悠花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMINO, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物的感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法，上述感光化射線性或感放射線性樹脂組成物含有樹脂、光酸產生劑、及酸擴散控制劑，其中，上述酸擴散控制劑中的至少一種包含具有特定結構的化合物，上述具有特定結構的化合物的含量相對於上述感光化射線性或感放射線性樹脂組成物之總固體成分為0.5質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2074" publication-number="202617881">
    <tif-files tif-type="multi-tif">
      <tif file="114133935.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乳液及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08L71/00</main-classification>
        <further-classification edition="200601120260202B">C08K5/098</further-classification>
        <further-classification edition="200601120260202B">C08J3/02</further-classification>
        <further-classification edition="200601120260202B">C09K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼歐斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEOS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市原豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIHARA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種乳液，係包含下列之乳液：&lt;br/&gt;  (A)下述式(I)所示全氟聚醚油、&lt;br/&gt;  (B)下述式(II)所示全氟聚醚羧酸鹽、&lt;br/&gt;  (C)水溶性有機溶劑、及&lt;br/&gt;  (D)水；&lt;br/&gt;  其中前述水溶性有機溶劑(C)之辛醇-水分佈係數(logP)之質量平均值在-0.33~0之範圍；&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="75px" width="625px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (式中，Rf、Rf’、p、q、r係如說明書所定義)；&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="71px" width="478px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (式中，Rf”、X、Y、n係如說明書所定義)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2075" publication-number="202617037">
    <tif-files tif-type="multi-tif">
      <tif file="114133952.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133952</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清掃機器人工作站</chinese-title>
        <english-title>ROBOT CLEANER STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
        <further-classification edition="200601120260130B">A47L9/28</further-classification>
        <further-classification edition="200601120260130B">D06F29/00</further-classification>
        <further-classification edition="200601120260130B">F26B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高武鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, MOOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹南一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, NAMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪禎順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JEONGSOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種清掃機器人工作站，且藉由增加穿過集塵袋的空氣的入口與出口之間的距離，可防止灰塵集中積聚在集塵袋的特定區域中，從而使用集塵袋的最大容量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a robot cleaner station, and by increasing a distance between an inlet and outlet of air passing through the dust bag, it is possible to prevent dust from intensively accumulating in a specific area of a dust bag, thereby using the maximum capacity of the dust bag.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清掃機器人工作站</p>
        <p type="p">110:殼體</p>
        <p type="p">111:外壁</p>
        <p type="p">121:底座</p>
        <p type="p">122:清洗板</p>
        <p type="p">123:耦接壁</p>
        <p type="p">124:內壁</p>
        <p type="p">126:門</p>
        <p type="p">126a:門驅動單元</p>
        <p type="p">140:集塵單元</p>
        <p type="p">141:集塵單元殼體</p>
        <p type="p">144:集塵袋抽屜</p>
        <p type="p">147:集塵流路、第一集塵流路</p>
        <p type="p">145:集塵馬達</p>
        <p type="p">160:拖布清洗單元</p>
        <p type="p">163:清潔劑容器</p>
        <p type="p">170:拖布烘乾單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2076" publication-number="202617038">
    <tif-files tif-type="multi-tif">
      <tif file="114133954.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清掃機器人工作站</chinese-title>
        <english-title>ROBOT CLEANER STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
        <further-classification edition="200601120260130B">A47L9/28</further-classification>
        <further-classification edition="200601120260130B">D06F29/00</further-classification>
        <further-classification edition="200601120260130B">F26B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹南一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, NAMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高武鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, MOOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪禎順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JEONGSOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種清掃機器人工作站並包括：殼體；座部單元，其設置在殼體中且清掃機器人的至少一部分耦接至該座部單元；以及集塵單元，其配置以收集清掃機器人的集塵箱內部的灰塵，其中該集塵單元包含：集塵馬達，其配置以提供用於抽吸集塵箱內部的灰塵的抽吸力；以及集塵馬達殼體，其配置以容納集塵馬達，該集塵馬達的旋轉軸設置在垂直方向上以堆疊並佈置集塵所需的流路，且空氣使用堆疊的流路來引入及排放，從而最大化空間效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a robot cleaner station and includes a housing, a seating unit which is disposed in the housing and to which at least a portion of a robot cleaner is coupled, and a dust collection unit configured to collect dust inside a dust bin of the robot cleaner, wherein the dust collection unit includes a dust collection motor configured to provide a suction force for suctioning the dust inside the dust bin, and a dust collection motor housing configured to accommodate the dust collection motor, a rotational axis of the dust collection motor is disposed in a vertical direction to stack and arrange flow paths required for dust collection, and air is introduced and discharged using the stacked flow paths, thereby maximizing space efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清掃機器人工作站</p>
        <p type="p">110:殼體</p>
        <p type="p">111:外壁</p>
        <p type="p">121:底座</p>
        <p type="p">122:清洗板</p>
        <p type="p">123:耦接壁</p>
        <p type="p">124:內壁</p>
        <p type="p">126:門</p>
        <p type="p">126a:門驅動單元</p>
        <p type="p">140:集塵單元</p>
        <p type="p">141:集塵單元殼體</p>
        <p type="p">144:集塵袋抽屜</p>
        <p type="p">147:集塵流路、第一集塵單元流路</p>
        <p type="p">145:集塵馬達</p>
        <p type="p">160:拖布清洗單元</p>
        <p type="p">163:清潔劑容器</p>
        <p type="p">170:拖布烘乾單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2077" publication-number="202617543">
    <tif-files tif-type="multi-tif">
      <tif file="114133965.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板收納容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">B65D85/90</main-classification>
        <further-classification edition="200601120251103B">H01L21/673</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越聚合物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU POLYMER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本間史也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONMA, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板收納容器包括：容器主體，能夠上下多層地收納多個基板；蓋體，將容器主體正面的開口關閉；前保持器，設置於蓋體；以及支撐結構，設置於容器主體的左右的側面或背面，在容器主體的開口被蓋體關閉的狀態下，在與前保持器之間對多個基板進行保持。前保持器具有：基部，裝設於蓋體；以及多個基板按壓部，在上下方向上配置且分別包括對基板進行支撐的保持部。保持部包括：保持槽，對基板進行保持；引入面，將基板提升至保持槽；以及拉出面，將基板自支撐結構的接受槽拉出。拉出面與引入面的邊界以曲面形成。曲面中的靠近左右的側面的外側部分的曲率半徑較曲面中的遠離左右的側面的內側部分的曲率半徑大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">45:保持槽</p>
        <p type="p">45b:第二傾斜面</p>
        <p type="p">46:引入面</p>
        <p type="p">47:拉出面</p>
        <p type="p">48:邊界曲面(曲面)</p>
        <p type="p">422:保持部</p>
        <p type="p">481:外側部分</p>
        <p type="p">482:內側部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2078" publication-number="202617004">
    <tif-files tif-type="multi-tif">
      <tif file="114133981.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>睡箱</chinese-title>
        <english-title>CARRYCOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47D13/02</main-classification>
        <further-classification edition="200601120260130B">A47D13/08</further-classification>
        <further-classification edition="200601120260130B">B62B9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種睡箱，包括：圍框；底架；收折機構，連接在圍框和底架間並有展開和收折狀態；鎖定件，活動設於收折機構並具有鎖止和解鎖位置，當處於鎖止位置時，鎖定件對收折機構鎖定，當處於解鎖位置時，鎖定件解除對收折機構的鎖定；和釋鎖機構，包括第一操作件和第二操作件，第一操作件移動設於收折機構且有鎖定和釋鎖位置，第一操作件驅動鎖定件移動，當第一操作件處於鎖定位置時，鎖定件處於鎖止位置，當第一操作件處於釋鎖位置時，鎖定件處於解鎖位置；第二操作件活動設於收折機構並有第一和第二位置，當第二操作件處於第一位置時，第二操作件位於第一操作件的移動路徑；當第二操作件處於第二位置時，第二操作件偏離第一操作件的移動路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a carrycot, including: a surrounding frame; a chassis; a folding mechanism connected between the surrounding frame and the chassis and having an unfolded state and a folded state; a locking member movably provided on the folding mechanism and having a detent position and a release position, wherein when the locking member is in the detent position, the locking member locks the folding mechanism in the unfolded state, and when the locking member is in the release position, the locking member unlocks the folding mechanism in the unfolded state; and an unlocking mechanism including a first operating member and a second operating member. The first operating member is movably provided on the folding mechanism and has a lock position and an unlock position. The first operating member is configured to drive the locking member to move. When the first operating member is in the lock position, the locking member is in the detent position, and when the first operating member is in the unlock position, the locking member is in the release position. The second operating member is movably provided on the folding mechanism and has a first position and a second position. When the second operating member is in the first position, the second operating member is in a movement path of the first operating member; and when the second operating member is in the second position, the second operating member is displaced from the movement path of the first operating member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:睡箱</p>
        <p type="p">101:承載空間</p>
        <p type="p">100:圍框</p>
        <p type="p">110:側部圍杆</p>
        <p type="p">120:橫向圍杆</p>
        <p type="p">130:轉動環</p>
        <p type="p">200:底架</p>
        <p type="p">210:轉動連接部</p>
        <p type="p">300:收折機構</p>
        <p type="p">310:第一支撐件</p>
        <p type="p">311:第一連接部</p>
        <p type="p">312:第一樞接部</p>
        <p type="p">320:第二支撐件</p>
        <p type="p">322:第二樞接部</p>
        <p type="p">324:引導面</p>
        <p type="p">400:釋鎖機構</p>
        <p type="p">410:第一操作件</p>
        <p type="p">411:握持部</p>
        <p type="p">4111:操作面</p>
        <p type="p">413:抵推部</p>
        <p type="p">414:抵壓部</p>
        <p type="p">420:第二操作件</p>
        <p type="p">500:握把</p>
        <p type="p">600:鎖定件</p>
        <p type="p">F1:第一方向</p>
        <p type="p">F2:第二方向</p>
        <p type="p">F3:第三方向</p>
        <p type="p">F4:第四方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2079" publication-number="202617828">
    <tif-files tif-type="multi-tif">
      <tif file="114134030.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶聚酯、液晶聚酯之製造方法及成形品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G63/60</main-classification>
        <further-classification edition="200601120260202B">C08G63/87</further-classification>
        <further-classification edition="200601120260202B">C09K19/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大友新治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTOMO, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種液晶聚酯，其具有較高之熱穩定性且成形時因未熔融物而產生之結塊較少。  &lt;br/&gt;本發明之液晶聚酯含有：第一單體單元，其具有萘環；第二單體單元，其具有萘環，且與上述第一單體單元不同；及第三單體單元，其係源自芳香族二羧酸之單體單元，且與上述第一單體單元及上述第二單體單元不同；且上述液晶聚酯中之鹼金屬離子之含量為5～40質量ppm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2080" publication-number="202619313">
    <tif-files tif-type="multi-tif">
      <tif file="114134045.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多埠光學分布塊的波長選擇塊</chinese-title>
        <english-title>WAVELENGTH SELECTION BLOCK FOR A MULTI-PORT OPTICAL DISTRIBUTION BLOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H04J14/02</main-classification>
        <further-classification edition="200601120260130B">G02B6/293</further-classification>
        <further-classification edition="200601120260130B">G02B6/35</further-classification>
        <further-classification edition="200601120260130B">H04Q11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商閃電公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAPE B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡米利　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMILLI, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於一多埠光學分布塊(PDB-2)之波長選擇塊(WSB-2)。該波長選擇塊(WSB-2)包括：i)一光學輸入(INP)，其用於接收攜載一多波長光學信號(λA)之一光纖(1)，該多波長光學信號(λA)包括第一數目(K)個個別波長光學信號(λ1…λK)；及ii)第二數目(Y)個光學輸出(OUTP-1…OUTP-Y)。該波長選擇塊(WSB-2)包括四個連續級(S1…S4)。在一第一級中，將該多波長光學信號(λA)分割成連續個別波長光學信號(λ1…λK)。在一第二級(S2)中，將各個別波長光學信號(λ1…λK)分割成該各自個別波長光學信號(λ1…λK)之一連續複本群組(GR-1…GR-K)，複本之數目等於倍增因數(Y)。在一第三級(S3)中，個別地閘控各連續複本群組(GR-1…GR-K)之各複本以選擇性地傳遞或阻擋該各自個別波長光學信號(λ1…λK)，以便獲得一各自經閘控個別波長光學信號(λ1g…λKg)。在一第四級(S4)中，組合來自各連續群組(GR-1…GR-K)之各連續經閘控個別波長光學信號(λ1g…λKg)，以便獲得一各自經閘控多波長光學信號(λAg)，其中每一各自經閘控多波長光學信號(λAg)與一各自光學輸出(OUTP-1…OUTP-Y)耦合。本發明亦係關於一種光學分布塊(PDB-2)，其包括另外數目(N)個此等波長選擇塊(WSB-2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a wavelength selection block (WSB-2) for a multi-port optical distribution block (PDB-2). The wavelength selection block (WSB-2) comprises: i) an optical input (INP) for receiving an optical fibre (1) carrying a multi-wavelength optical signal (λA) comprising a first number (K) of individual wavelength optical signals (λ1..λK); and ii) a second number (Y) of optical outputs (OUTP-1..OUTP-Y). The wavelength selection block (WSB-2) comprises four consecutive stages (S1..S4). In a first stage the multi-wavelength optical signal (λA) is split into consecutive individual wavelength optical signals (λ1..λK). In a second stage (S2) each individual wavelength optical signal (λ1..λK) is split into a consecutive group (GR-1..GR-K) of copies of the respective individual wave-length optical signal (λ1..λK), the number of copies equalling the multiplication factor (Y). In a third stage (S3) each copy of each consecutive group (GR-1..GR-K) of copies is individually gated for selectively passing or blocking the respective individual wavelength optical signal (λ1..λK) so as to obtain a respective gated individual wavelength optical signal (λ1g..λKg). In a fourth stage (S4) each consecutive gated individual wavelength optical signal (λ1g..λKg) from each consecutive group (GR-1..GR-K) is combined so as to obtain a respective gated multi-wavelength optical signal (λAg), wherein each respective gated multi-wavelength optical signal (λAg) is coupled with a respective optical output (OUTP-1..OUTP-Y). The invention also relates to an optical distribution block (PDB-2) comprising a further number (N) of such wavelength selection blocks (WSB-2).</p>
      </isu-abst>
      <representative-img>
        <p type="p">EPS:電子封包交換機</p>
        <p type="p">INP:光學輸入</p>
        <p type="p">OCS1至OCS3:光學電路交換機</p>
        <p type="p">OUTP:光學輸出</p>
        <p type="p">P1b:複數</p>
        <p type="p">P2o:複數</p>
        <p type="p">PDB2:第二光學分布塊</p>
        <p type="p">Si1:第一組</p>
        <p type="p">SMM:交換矩陣模組</p>
        <p type="p">So2:第二組/數目</p>
        <p type="p">Ti1至TiN:光學輸入端子</p>
        <p type="p">To1a至To1d:輸出端子</p>
        <p type="p">To2:第二輸出端子</p>
        <p type="p">To3:第三輸出端子</p>
        <p type="p">To4:第四輸出端子</p>
        <p type="p">WSB-2:波長選擇塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2081" publication-number="202618808">
    <tif-files tif-type="multi-tif">
      <tif file="114134056.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於含鈾核心的非液態製造</chinese-title>
        <english-title>NON-LIQUID MANUFACTURE FOR URANIUM BEARING KERNEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G21C3/62</main-classification>
        <further-classification edition="200601120260202B">G21C21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西屋電器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉赫達　愛德華　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAHODA, EDWARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於產生一燃料核心之方法。該方法包括產生包括濃縮鈾之一乾可裂材料，自該乾可裂材料形成一顆粒，該顆粒具有1毫米或更小之一直徑；及熱處理該顆粒以產生該燃料核心。本發明亦提供一種用於乾可裂材料之壓機系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing a fuel kernel is provided. The method comprises producing a dry fissile material comprising enriched uranium, forming a particle from the dry fissile material, the particle having a diameter of 1 millimeter or less; and thermally processing the particle to produce the fuel kernel. A press system for dry fissile material is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">310:產生包括濃縮鈾之一乾可裂材料</p>
        <p type="p">320:自該乾可裂材料形成一顆粒</p>
        <p type="p">325:收集殘餘乾可裂材料且將殘餘材料作為一輸入返回至形成程序</p>
        <p type="p">330:熱處理該顆粒以產生該燃料核心</p>
        <p type="p">340:產生具有該燃料核心之燃料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2082" publication-number="202617530">
    <tif-files tif-type="multi-tif">
      <tif file="114134062.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於降低包裝中氧氣比例的灌裝機和用於降低包裝中氧氣比例的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">B65B31/04</main-classification>
        <further-classification edition="202501120260116B">A23B2/704</further-classification>
        <further-classification edition="202201120260116B">B01F23/10</further-classification>
        <further-classification edition="200601120260116B">B65B3/04</further-classification>
        <further-classification edition="200601120260116B">B65B25/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商康美包（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIG COMBIBLOC (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商康美包服務股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIG SERVICES AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
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          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴雷　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAREJ, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>朗根　克里斯托弗　蒂莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANGEN, CHRISTOPHER THIEMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿利克　瑪蕾娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALICKE, MARLENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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              <chinese-name name-type="organization">
                <last-name>漢森　雅妮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSEN, JANINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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              <chinese-name name-type="organization">
                <last-name>蓋斯勒　漢諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEISSLER, HANNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯梅茨　英戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMETS, INGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱珀斯　延斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUYPERS, JENS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗萊舍　斯特凡妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEISCHER, STEFANIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>策爾　烏韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZELL, UWE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔永华</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, YONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          </agent>
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              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於降低包裝(2)中氧氣比例的灌裝機(1)以及一種用於降低包裝(2)中氧氣比例的方法。為了在包裝(2)中提供低比例的氧氣並且優選地以低量的惰性氣體和/或蒸汽消耗來成形包裝(2)，提出一種灌裝機(1)，其中：第二供應裝置(16)被配置成以間歇的方式向第二供應裝置(16)的至少一個混合室(28)和/或第二噴嘴(29)供應惰性氣體並且以間歇的方式向第二供應裝置(16)的至少一個混合室(28)和/或第二噴嘴(29)供應蒸汽，優選彼此分開地供應惰性氣體和蒸汽，惰性氣體優選為第一惰性氣體(24)。此外，提出了根據本揭露的用於降低包裝(2)中氧氣比例的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:灌裝機</p>
        <p type="p">2:包裝</p>
        <p type="p">3:成型裝置</p>
        <p type="p">4:成捆件</p>
        <p type="p">5:坯料</p>
        <p type="p">6:套筒</p>
        <p type="p">7:進給裝置</p>
        <p type="p">8:芯軸</p>
        <p type="p">9:芯軸輪</p>
        <p type="p">10:加熱單元</p>
        <p type="p">11:預折疊單元</p>
        <p type="p">12:按壓機</p>
        <p type="p">13:單元格</p>
        <p type="p">14:輸送裝置</p>
        <p type="p">15:第一供應裝置</p>
        <p type="p">16:第二供應裝置</p>
        <p type="p">17,17’:惰性氣體罐</p>
        <p type="p">18:第二惰性氣體</p>
        <p type="p">19,19’:惰性氣體管路</p>
        <p type="p">20,20’,20”:控制裝置</p>
        <p type="p">21,21’:惰性氣體閥</p>
        <p type="p">22:第一噴嘴</p>
        <p type="p">23:灌裝裝置</p>
        <p type="p">24:第一惰性氣體</p>
        <p type="p">25:外部蒸汽供應源</p>
        <p type="p">26:蒸汽管路</p>
        <p type="p">27:蒸汽閥</p>
        <p type="p">28:混合室</p>
        <p type="p">29:第二噴嘴/噴嘴</p>
        <p type="p">30:密封裝置</p>
        <p type="p">55,55’,55”:控制單元</p>
        <p type="p">F1:第一灌裝介質</p>
        <p type="p">F2:第二灌裝介質</p>
        <p type="p">T:輸送方向</p>
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    </description>
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        <chinese-title>新穎之反丁烯二酸酯系樹脂及含有其之薄膜</chinese-title>
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      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F22/14</main-classification>
        <further-classification edition="200601120260202B">C08J5/18</further-classification>
        <further-classification edition="200601120260202B">G02B5/30</further-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>日商東楚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>公立大學法人大阪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY PUBLIC CORPORATION OSAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中岡江美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAOKA, EMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>吉村飛鳥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, ASUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>小峯拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMINE, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北川貴裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺美咲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MISAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本章一</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>MATSUMOTO, AKIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木祥仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, YASUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種高溫下的儲存模數優異的新穎之反丁烯二酸酯系樹脂及含有其之薄膜。  &lt;br/&gt;一種反丁烯二酸酯系樹脂，包含下記式(1)所示的殘基單元及下記式(2)所示的殘基單元。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="241px" width="361px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sub&gt;1&lt;/sub&gt;及R&lt;sub&gt;2&lt;/sub&gt;各自獨立地表示具有降莰烷骨架的烷基。)  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="254px" width="360px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sub&gt;3&lt;/sub&gt;及R&lt;sub&gt;4&lt;/sub&gt;各自獨立地表示碳原子數1～12的直鏈狀烷基、碳原子數3～12的支鏈狀烷基或碳原子數3～6的環狀烷基。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
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    </description>
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        <document-id>
          <doc-number>114134085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏晶用有機改質矽氧樹脂組成物、其硬化物、及光半導體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09J183/05</main-classification>
        <further-classification edition="200601120260202B">C09J183/07</further-classification>
        <further-classification edition="200601120260202B">C09J11/04</further-classification>
        <further-classification edition="200601120260202B">C09J11/06</further-classification>
        <further-classification edition="200601120260202B">H01L21/52</further-classification>
        <further-classification edition="202501120260202B">H10H20/85</further-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林之人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, YUKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>茂木勝成</last-name>
                <first-name></first-name>
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                <last-name>MOTEKI, MASANARI</last-name>
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                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
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              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種黏晶用有機改質矽氧樹脂組成物，其含有下述(A)～(E)成分且組成物中的與矽原子鍵結的氫原子的數目相對於加成反應性碳-碳雙鍵的合計數為1.1～3.0倍；&lt;br/&gt;  　　(A)(a)下述通式(1)表示的化合物與(b)1分子中具有2個加成反應性碳-碳雙鍵的多環式烴類的加成反應產物且1分子中具有2個加成反應性碳-碳雙鍵的加成反應產物，&lt;br/&gt;&lt;img align="absmiddle" height="215px" width="492px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；&lt;br/&gt;  (B)下述通式(2)表示的有機矽化合物，&lt;br/&gt;&lt;img align="absmiddle" height="264px" width="652px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；&lt;br/&gt;  (C)鉑族金屬觸媒；(D)1分子中具有2個以上的縮水甘油氧基且不具有加成反應性碳-碳雙鍵及矽原子的化合物；以及(E)特定發煙氧化矽。&lt;br/&gt;  　　藉此，提供一種硬化物、能夠獲得該硬化物的黏晶用有機改質矽氧樹脂組成物、及光半導體元件，該硬化物的高溫時的LED元件與基板的接著力優異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2085" publication-number="202617640">
    <tif-files tif-type="multi-tif">
      <tif file="114134098.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻圖案形成用組成物及其用途</chinese-title>
        <english-title>RESIST PATTERN FORMING COMPOSITION AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C13/61</main-classification>
        <further-classification edition="200601120260202B">C07C15/24</further-classification>
        <further-classification edition="200601120260202B">C07C31/20</further-classification>
        <further-classification edition="200601120260202B">C07C31/125</further-classification>
        <further-classification edition="200601120260202B">C07C35/30</further-classification>
        <further-classification edition="200601120260202B">C07C49/413</further-classification>
        <further-classification edition="200601120260202B">C07C49/437</further-classification>
        <further-classification edition="200601120260202B">C07C69/36</further-classification>
        <further-classification edition="200601120260202B">C07D241/12</further-classification>
        <further-classification edition="200601120260202B">C07D307/33</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商默克專利有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保有輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長原達郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAHARA, TATSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[問題]提供一種光阻圖案形成用組成物及使用其來製造光阻圖案的方法。&lt;br/&gt;  [解決手段]一種光阻圖案形成用組成物，其係一種高性能材料可使用在奈米技術製程的半導體裝置製造步驟中，例如，製造一控制在基材上形成的液晶、量子點或OLED顯示器之半導體裝置的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem] To provide a resist pattern forming composition and a method for producing a resist pattern using the same.&lt;br/&gt; [Solution] A resist pattern forming composition is a high-performance material that can be used in a semiconductor device producing step of a nanotechnology process, for example, a step of producing a semiconductor device that controls liquid crystals, quantum dots, or OLED displays formed on a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">2:感光性樹脂層(光阻膜)</p>
        <p type="p">2A:光阻圖案</p>
        <p type="p">3:顯影溶液</p>
        <p type="p">4:光阻圖案形成用組成物(嵌入溶液)</p>
        <p type="p">4A:固相(由固化組分(A)構成的嵌入膜)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2086" publication-number="202618489">
    <tif-files tif-type="multi-tif">
      <tif file="114134104.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作業車輛的控制方法、作業車輛用控制程式、作業車輛用控制系統及作業系統</chinese-title>
        <english-title>WORK VEHICLE CONTROL METHOD, WORK VEHICLE CONTROL PROGRAM, WORK VEHICLE CONTROL SYSTEM, AND WORK SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260131B">G05D1/22</main-classification>
        <further-classification edition="202001120260131B">B60W50/08</further-classification>
        <further-classification edition="202201120260131B">G06F3/0484</further-classification>
        <further-classification edition="200601120260131B">A01B69/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商洋馬控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANMAR HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩村圭将</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMURA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種作業車輛的控制方法、作業車輛用控制程式、作業車輛用控制系統及作業系統，其能夠謀求：使作業車輛開始特定動作的時機之自由度提高。  &lt;br/&gt;　　[解決手段]作業車輛的控制方法為，作業車輛的控制方法是具有：使作業車輛執行特定動作；以及使顯示部顯示出顯示畫面。用於開始特定動作的開始條件是包含與顯示部的顯示相關的顯示條件；在將第一畫面(指導畫面Dp1)作為顯示畫面來顯示中、以及將與第一畫面(指導畫面Dp1)不同的第二畫面(中斷畫面Dp2)作為顯示畫面來顯示中並且畫面遷移的態樣滿足特定條件、的任一者符合之情況下，判斷為滿足顯示條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem] To provide a work vehicle control method, a work vehicle control program, a work vehicle control system, and a work system, capable of improving a degree of freedom of a timing at which a work vehicle is caused to start a specific action. &lt;br/&gt;[Solution] A work vehicle control method includes causing the work vehicle to perform a specific action and causing a display portion to display a display screen. A start condition for starting the specific action includes a display condition related to the display of the display portion, and it is determined that the display condition is satisfied when either a first screen (guidance screen Dp1) is being displayed as the display screen or a second screen (interruption screen Dp2) different from the first screen (guidance screen Dp1) is being displayed as the display screen and a mode of screen transition satisfies a specific condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Dp1:指導畫面</p>
        <p type="p">Dp2:中斷畫面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2087" publication-number="202618503">
    <tif-files tif-type="multi-tif">
      <tif file="114134121.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多相穩壓器的控制電路以及功率級電路、多相穩壓器以及其控制方法</chinese-title>
        <english-title>CONTROL CIRCUIT AND POWER STAGE FOR MULTIPHASE VOLTAGE REGULATOR, MULTIPHASE VOLTAGE REGULATOR AND METHOD FOR CONTROLLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G05F1/565</main-classification>
        <further-classification edition="200601120260108B">H02M1/08</further-classification>
        <further-classification edition="200601120260108B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳暐中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONG, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧驄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, CONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昱輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於多相穩壓器的控制電路，包括切換控制電路和監測電路。該切換控制電路配置為提供一控制訊號以控制多個功率級電路。每個該功率級電路配置為提供一相電流。該監測電路配置為從該至少一功率級電路接收一報告訊號，並判斷該報告訊號是否指示一對應的功率級電路的一預充電週期完成。在該報告訊號指示該對應的功率級電路的該預充電週期完成之後，提供該控制訊號以開啟該對應的功率級電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control circuit for a multiphase voltage regulator includes a switching control circuit and a monitor circuit. The switching control circuit is configured to provide a control signal to control a plurality of power stage circuits. Each of the power stage circuit is configured to provide a phase current. The monitor circuit is configured to receive a report signal from at least one of the power stage circuits, and determine whether the report signal indicates a pre-charge period of the corresponding power stage circuit is finished. After the report signal indicates that the pre-charge period of the corresponding power stage circuit is finished, the control signal is provided to power on the corresponding power stage circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:控制電路、多相控制器積體電路</p>
        <p type="p">12-1,12-2,12-n:功率級電路</p>
        <p type="p">100:多相穩壓器</p>
        <p type="p">Vin:輸入電壓、輸入端</p>
        <p type="p">Vout:輸出電壓、輸出端</p>
        <p type="p">I1,I2,In:相電流</p>
        <p type="p">L1,L2,Ln:電感</p>
        <p type="p">S&lt;sub&gt;PWM1&lt;/sub&gt;,S&lt;sub&gt;PWM2&lt;/sub&gt;,S&lt;sub&gt;PWMn&lt;/sub&gt;:控制訊號</p>
        <p type="p">PWM:切換控制接腳</p>
        <p type="p">PWM1,PWM2,PWMn:切換控制接腳</p>
        <p type="p">RP:報告接腳</p>
        <p type="p">Pre:報告訊號</p>
        <p type="p">MON:監測接腳</p>
        <p type="p">Cout:輸出電容</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2088" publication-number="202617039">
    <tif-files tif-type="multi-tif">
      <tif file="114134178.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134178</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備和清潔系統</chinese-title>
        <english-title>CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
        <further-classification edition="200601120260130B">A47L13/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔設備和清潔系統，其中清潔設備包括：氣流驅動組件和流體儲存裝置，氣流驅動組件與流體儲存裝置上下疊置，流體儲存裝置設置於氣流驅動組件靠近待清潔面的一側。由此，能夠節省橫向和縱向空間，對設備主體的內部結構予以簡化，提升設備主體內部空間的利用率，進而縮小清潔設備的整體體積，令其能夠在狹窄空間裡自如作業和便利存放。同時，優化了清潔設備的重心分佈。當氣流驅動組件處於上方，流體儲存裝置位於下方時，能讓清潔設備在運行期間更為穩固，顯著降低了快速移動、轉彎或者跨越一些小阻礙時傾倒的可能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a cleaning device and cleaning system, wherein the cleaning device includes: an airflow-driven component and a fluid storage device. The airflow-driven component is stacked vertically with the fluid storage device, with the fluid storage device positioned on the side of the airflow-driven component that is closer to the surface to be cleaned. This arrangement helps save lateral and vertical space, simplifies the internal structure of the device body, and improves the utilization of internal space, thereby reducing the overall volume of the cleaning device, enabling it to operate freely in narrow spaces and be conveniently stored. Additionally, it optimizes the distribution of the cleaning device's center of gravity. When the airflow-driven component is positioned above and the fluid storage device is located below, the cleaning device becomes more stable during operation, significantly reducing the likelihood of tipping over when moving quickly, turning, or crossing small obstacles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氣流驅動組件</p>
        <p type="p">11:風力驅動單元</p>
        <p type="p">12:風道</p>
        <p type="p">121:第一導流板</p>
        <p type="p">122:第二導流板</p>
        <p type="p">1221:彎折部</p>
        <p type="p">2:流體儲存裝置</p>
        <p type="p">3:集塵盒</p>
        <p type="p">31:吸塵口</p>
        <p type="p">32:出風口</p>
        <p type="p">4:主刷</p>
        <p type="p">5:過濾部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2089" publication-number="202618114">
    <tif-files tif-type="multi-tif">
      <tif file="114134182.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>門擋本體部、門擋承受部及門擋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">E05C17/02</main-classification>
        <further-classification edition="200601120260130B">E05C17/04</further-classification>
        <further-classification edition="200601120260130B">E05C1/08</further-classification>
        <further-classification edition="200601120260130B">E05F1/14</further-classification>
        <further-classification edition="200601120260130B">E06B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商驪住股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIXIL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村越精工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKOSHI MFG CORP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部真二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上祐喜子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, YUKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野僚太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬場辰也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BABA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可確實將門體保持在開位置，並且在下端與地板表面之間隙狹窄的門體亦可設置之門擋本體部。  &lt;br/&gt;門擋本體部3，其設置於門體1之下端，具備：殼體30；柱體33，其可進退地收容於殼體內，其一端從殼體的下表面突出；第1彈性構件35，其設置於柱體的外周，並抵抗柱體的自重將柱體往上方施力；及磁性構件34，其設置於柱體，藉由磁力將柱體朝向設置於地板表面的門擋承受部吸引；柱體在第1彈性構件的施力進行作用的狀態下，在其另一端與前述殼體的內表面之間具有空隙CL1、CL2、CL3並收容於殼體內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:門體</p>
        <p type="p">2:框體</p>
        <p type="p">3:門擋本體部</p>
        <p type="p">4:門擋承受部</p>
        <p type="p">10:門擋</p>
        <p type="p">20:開口部</p>
        <p type="p">30:殼體</p>
        <p type="p">31:外殼體</p>
        <p type="p">311:基底部</p>
        <p type="p">312:筒部</p>
        <p type="p">313:蓋部</p>
        <p type="p">33:柱體(卡合部)</p>
        <p type="p">37:蓋構件</p>
        <p type="p">40:本體部</p>
        <p type="p">401:被卡合溝槽</p>
        <p type="p">43:蓋</p>
        <p type="p">F:地板表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2090" publication-number="202617883">
    <tif-files tif-type="multi-tif">
      <tif file="114134197.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134197</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濕氣硬化性樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C08L75/04</main-classification>
        <further-classification edition="200601120260119B">C09J175/04</further-classification>
        <further-classification edition="200601120260119B">C08F2/50</further-classification>
        <further-classification edition="200601120260119B">C08F4/30</further-classification>
        <further-classification edition="200601120260119B">C08G18/09</further-classification>
        <further-classification edition="200601120260119B">C08G18/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩原康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIWARA, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河田晋治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWADA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上西恭子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENISHI, KYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穗北祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOKITA, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山脇大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAWAKI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之濕氣硬化性樹脂組成物，其包含化合物（A），上述化合物（A）於分子末端具有至少1個異氰酸酯基，且於分子中具有2個以上之聚合性雙鍵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2091" publication-number="202618089">
    <tif-files tif-type="multi-tif">
      <tif file="114134209.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水循環系統、動作模式切換方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">D06F39/08</main-classification>
        <further-classification edition="200601120260130B">A47L15/42</further-classification>
        <further-classification edition="200601120260130B">B08B3/10</further-classification>
        <further-classification edition="202301120260130B">C02F1/42</further-classification>
        <further-classification edition="202301120260130B">C02F1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商夏普股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARP KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀元純生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIMOTO, SUMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船見慎太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAMI, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能夠減輕洗滌所用的水的切換作業負擔的水循環系統及動作模式切換方法。洗滌系統（100）具備：路徑形成部（51），形成經由水箱（21）、洗衣機1及過濾器（31）的第一鹼性離子水（WA1）的循環路徑（R1）；第二泵（29），使第一鹼性離子水（WA1）沿循環方向（D1）流動；第二切換閥（36），能夠開閉連接自來水龍頭（200）與水箱21的第一供水路3（5～37）；切換處理部，將向水箱（21）的供水模式在使用第二泵（29）的第一模式與使用第二切換閥（36）的第二模式之間進行切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">（無）</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:洗滌系統</p>
        <p type="p">51:路徑形成部</p>
        <p type="p">D1:循環方向</p>
        <p type="p">26:第一切換閥</p>
        <p type="p">27:排水路</p>
        <p type="p">200:自來水龍頭</p>
        <p type="p">27A:外部排出口</p>
        <p type="p">35:第一供水路</p>
        <p type="p">36:第二切換閥</p>
        <p type="p">38:第三供水路</p>
        <p type="p">R1:循環路徑</p>
        <p type="p">38A:止回閥</p>
        <p type="p">24A:止回閥</p>
        <p type="p">1:洗衣機</p>
        <p type="p">11:框體</p>
        <p type="p">29:第二泵</p>
        <p type="p">11B:供水口</p>
        <p type="p">25:第三水路</p>
        <p type="p">24:第二水路</p>
        <p type="p">23:第一泵</p>
        <p type="p">30:第五水路</p>
        <p type="p">31:過濾器</p>
        <p type="p">32:第六水路</p>
        <p type="p">37:第二供水路</p>
        <p type="p">41:pH感測器</p>
        <p type="p">40:浮子感測器</p>
        <p type="p">WA1:第一鹼性離子水</p>
        <p type="p">33:離子水供給部</p>
        <p type="p">WA2:第二鹼性離子水</p>
        <p type="p">33A:離子水儲存部</p>
        <p type="p">33B:離子水供給路</p>
        <p type="p">33C:離子水供給泵</p>
        <p type="p">34:中性水供給部</p>
        <p type="p">WA3:中性水</p>
        <p type="p">34A:中性水儲存部</p>
        <p type="p">34B:中性水供給路</p>
        <p type="p">34C:中性水供給泵</p>
        <p type="p">21E:第二供水口</p>
        <p type="p">21C:第一供給口</p>
        <p type="p">21A:第一供水口</p>
        <p type="p">21B:排水口</p>
        <p type="p">21D:第二供給口</p>
        <p type="p">21:水箱</p>
        <p type="p">2:水循環裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2092" publication-number="202618090">
    <tif-files tif-type="multi-tif">
      <tif file="114134210.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134210</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水循環系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">D06F39/08</main-classification>
        <further-classification edition="200601120260130B">A47L15/42</further-classification>
        <further-classification edition="200601120260130B">B08B3/10</further-classification>
        <further-classification edition="202301120260130B">C02F1/42</further-classification>
        <further-classification edition="202301120260130B">C02F1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商夏普股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARP KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉持優理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOCHI, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船見慎太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAMI, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能夠對水箱內進行除菌的水循環系統。洗滌系統100具備：過濾器28，淨化從洗衣機1的洗滌槽排出的第一鹼性離子水WA1；水箱21，儲存由過濾器28淨化後的第一鹼性離子水WA1；路徑形成部41，形成第一鹼性離子水WA1的循環路徑R1，第一鹼性離子水WA1經由過濾器28、水箱21及所述洗滌槽；離子水供給部30，向水箱21供給使水箱21內的第一鹼性離子水WA1的pH值上升的第二鹼性離子水WA2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">（無）</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:水循環裝置</p>
        <p type="p">100:洗滌系統</p>
        <p type="p">D1:循環方向</p>
        <p type="p">41:路徑形成部</p>
        <p type="p">R1:循環路徑</p>
        <p type="p">1:洗衣機</p>
        <p type="p">11:框體</p>
        <p type="p">11B:供水口</p>
        <p type="p">25:第三水路</p>
        <p type="p">26:第二泵</p>
        <p type="p">27:第四水路</p>
        <p type="p">24:第二水路</p>
        <p type="p">12:門</p>
        <p type="p">11C:排水口</p>
        <p type="p">23:第一泵</p>
        <p type="p">22:第一水路</p>
        <p type="p">28:過濾器</p>
        <p type="p">29:第五水路</p>
        <p type="p">30:離子水供給部</p>
        <p type="p">30A:離子水儲存部</p>
        <p type="p">30B:離子水供給路</p>
        <p type="p">30C:離子水供給泵</p>
        <p type="p">31:中性水供給部</p>
        <p type="p">31A:中性水儲存部</p>
        <p type="p">31B:中性水供給路</p>
        <p type="p">31C:中性水供給泵</p>
        <p type="p">34:pH感測器</p>
        <p type="p">WA1:第一鹼性離子水</p>
        <p type="p">33:浮子感測器</p>
        <p type="p">21:水箱</p>
        <p type="p">21A:供水口</p>
        <p type="p">21B:排水口</p>
        <p type="p">21C:第一供給口</p>
        <p type="p">21D:第二供給口</p>
        <p type="p">WA2:第二鹼性離子水</p>
        <p type="p">WA3:中性水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2093" publication-number="202617040">
    <tif-files tif-type="multi-tif">
      <tif file="114134213.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔機器人、清潔系統、運動控制方法、電子設備、電腦程式產品及電腦可讀儲存媒體</chinese-title>
        <english-title>CLEANING ROBOT, CLEANING SYSTEM, MOVEMENT CONTROL METHOD, ELECTRONIC DEVICE, COMPUTER PROGRAM PRODUCT AND COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">A47L11/40</main-classification>
        <further-classification edition="202401120260129B">G05D1/622</further-classification>
        <further-classification edition="200601120260129B">B62D57/032</further-classification>
        <further-classification edition="202401120260129B">G05D1/43</further-classification>
        <further-classification edition="200601120260129B">B25J5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高麗明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種清潔機器人、清潔系統、運動控制方法、電子設備、電腦程式產品及電腦可讀儲存媒體，清潔機器人包括機身和行走機構，行走機構包括驅動輪行走單元；驅動輪行走單元包括：支架，其設置在機身上；主驅動輪組件，其包括可轉動地設置在支架上的主驅動輪和可驅動主驅動輪相對支架轉動的主驅動輪動力機構；擺臂組件，其包括擺臂和與擺臂的動力輸入端驅動連接以用於使擺臂擺動的擺臂動力機構；副驅動輪組件，其包括可轉動地設置在擺臂的動力輸出端的副驅動輪以及用於驅動副驅動輪相對擺臂的動力輸出端轉動的副驅動輪動力機構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a cleaning robot, a cleaning system, a movement control method, an electronic device, a computer program product, and a computer readable storage medium. The cleaning robot includes a body and a walking mechanism. The walking mechanism includes a driving wheel walking unit. The driving wheel walking unit includes a bracket arranged on the body, a main driving wheel assembly including a main driving wheel rotatably arranged on the bracket and a main driving wheel power mechanism that can drive the main driving wheel to rotate relative to the bracket, a swing arm assembly including a swing arm and a swing arm power mechanism connected to a power input end of the swing arm for swinging the swing arm, and a secondary driving wheel assembly including a secondary driving wheel rotatably arranged at a power output end of the swing arm and a secondary driving wheel power mechanism for driving the secondary driving wheel to rotate relative to the power output end of the swing arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:主驅動輪</p>
        <p type="p">21:副驅動輪</p>
        <p type="p">41:轉動件</p>
        <p type="p">42:擺臂</p>
        <p type="p">43:第一彈性件</p>
        <p type="p">61:支架盒</p>
        <p type="p">62:支架蓋</p>
        <p type="p">71:滑動件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2094" publication-number="202617520">
    <tif-files tif-type="multi-tif">
      <tif file="114134215.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水上航行器轉向系統、雙推水上航行器轉向方法及水上航行器</chinese-title>
        <english-title>WATERCRAFT STEERING SYSTEM, METHOD FOR STEERING DUAL-PROPULSION WATERCRAFT, AND WATERCRAFT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">B63H25/42</main-classification>
        <further-classification edition="200601120260129B">B63H21/21</further-classification>
        <further-classification edition="200601120260129B">B63H5/08</further-classification>
        <further-classification edition="200601120260129B">B63H11/107</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商恩夫高股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENVGO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔布　麥可Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIBOU, MICHAEL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮斯古德　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEASGOOD, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水上航行器的轉向系統，其具有雙推進器，這些推進器的推力軸在俯視平面圖中固定由縱向中心線作向外偏離。在彎轉期間，控制器作差別性地指令推力，得使艙外側推進器產生比艙內側推進器更大的推力。推力軸的外向排齊產生一個淨橫向力，而其由水上航行器重心處的垂直偏移產生一個滾動力矩，使船體向彎轉內側頃航。該系統無需旋轉式驅動器或方向舵即可實現傾航彎轉，並支持低速下作零半徑機動。實施例包括電動螺旋槳潛式艙或射水噴咀、滑行和水翼航行器，以及調節頃航角度的非強制性回饋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A steering system for a watercraft having twin propulsion units whose thrust axes are fixed to diverge outward from a longitudinal centerline in plan view. During a turn, a controller differentially commands thrust such that the outboard propulsion unit produces greater thrust than the inboard unit. The outward alignment of the thrust axes yields a net lateral force whose vertical offset from the craft’s center of gravity produces a rolling moment that banks the hull inward toward the turn. The system enables banked turns without swiveling drives or rudders and supports zero-radius maneuvers at low speeds. Embodiments include electric propeller pods or water-jet nozzles, planing and hydrofoil craft, and optional feedback to regulate bank angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:船體</p>
        <p type="p">12:中心線</p>
        <p type="p">20R、20L:推進器</p>
        <p type="p">22R、22L:軸線</p>
        <p type="p">F_L、F_R、L_L、L_R:分量</p>
        <p type="p">θ:外傾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2095" publication-number="202617816">
    <tif-files tif-type="multi-tif">
      <tif file="114134218.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機聚矽氧烷及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C08F290/14</main-classification>
        <further-classification edition="200601120260129B">C08G77/445</further-classification>
        <further-classification edition="200601120260129B">C09D183/14</further-classification>
        <further-classification edition="200601120260129B">C08L83/10</further-classification>
        <further-classification edition="201901120260129B">B32B7/06</further-classification>
        <further-classification edition="201801120260129B">C09J7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川内宏紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAUCHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種有效用於提供能夠形成低速及高速剝離時的剝離力均小的硬化皮膜的剝離塗佈劑的、新的有機聚矽氧烷及其製造方法。一種有機聚矽氧烷，由下述平均組成式（1）表示：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="197px" width="574px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;相互獨立地為碳數3～20的烯基，R&lt;sup&gt;2&lt;/sup&gt;表示連結基，且為碳數1～10的二價烴基，另外，R&lt;sup&gt;3&lt;/sup&gt;相互獨立地為選自經取代或未經取代的、碳數1～20的一價烴基、碳數1～20的烷氧基、碳數1～10的鹵化烷基、具有羥基的有機基、及具有醯氧基的有機基中的基，進而，a、b、c、d、e、f及g為a≧0、b≧0、c≧0、d≧0、e≧0、f≧0、g≧0，且a+c+e為1以上，且滿足2≦a+b+c+d+e+f+g≦15000）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2096" publication-number="202618788">
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        <document-id>
          <doc-number>114134228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非揮發性記憶體胞元的抹除操作</chinese-title>
        <english-title>ERASE OPERATION FOR NON-VOLATILE MEMORY CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">G11C16/14</main-classification>
        <further-classification edition="200601120260122B">G11C16/34</further-classification>
        <further-classification edition="200601120260122B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>李　英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LY, ANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAM, HIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克馬丁　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCMARTIN, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, KHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊任偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳　鐘元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, JONG-WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳滿堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MAN-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈延容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YEN JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, THOAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, NGHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, VIET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, HIEU VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢曉州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, XIAO ZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個示例中，一種用於抹除非揮發性記憶體胞元的方法包括執行預抹除序列，該預抹除序列包括以步階模式向非揮發性記憶體胞元的端子施加電壓；以及執行抹除序列，該抹除序列包括向非揮發性記憶體胞元的端子施加複數個電壓遞增的脈衝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a method for erasing a non-volatile memory cell comprises performing a pre-erase sequence comprising applying voltages in a step pattern to a terminal of the non-volatile memory cell; and performing an erase sequence comprising applying a plurality of pulses of increasing voltages to the terminal of the non-volatile memory cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:抹除波形</p>
        <p type="p">801:預抹除序列</p>
        <p type="p">802:抹除序列</p>
        <p type="p">803:基礎位準</p>
        <p type="p">804~808:序列</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2097" publication-number="202617437">
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      <tif file="114134238.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617437</doc-number>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114134238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學片材、片材物品、偏光板、顯示裝置及面板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B32B27/30</main-classification>
        <further-classification edition="201901120260126B">B32B7/022</further-classification>
        <further-classification edition="201901120260126B">B32B7/023</further-classification>
        <further-classification edition="200601120260126B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古井玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUI, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成川隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARIKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋幹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOHASHI, MIKIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹井理哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEI, MICHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚田賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKADA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學片材包含第1面及第2面。光學片材自第2面朝向第1面依序包含基材層及功能層。基材層含有丙烯酸樹脂。功能層含有樹脂硬化物。關於作為自第1面之沖蝕試驗之試驗結果而獲得之沖蝕深度(μm)及沖蝕率(μm/g)，將沖蝕率相對於沖蝕深度之變化量之變化梯度定義為沖蝕率斜率((μm/g)/μm)。於以橫軸為沖蝕深度且以縱軸為沖蝕率斜率之圖表上，對試驗結果進行擬合之高斯函數之最大值H((μm/g)/μm)相對於高斯函數之半高全寬W(μm)之比(H/W)為2.0以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學片材</p>
        <p type="p">11:第1面</p>
        <p type="p">11X:凹凸面</p>
        <p type="p">12:第2面</p>
        <p type="p">20:功能層</p>
        <p type="p">21:第1面</p>
        <p type="p">21X:凹凸面</p>
        <p type="p">22:第2面</p>
        <p type="p">26:基底部</p>
        <p type="p">27:粒子</p>
        <p type="p">30:中間層</p>
        <p type="p">40:基材層</p>
        <p type="p">41:第1面</p>
        <p type="p">42:第2面</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2098" publication-number="202618982">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處置半導體載板的設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251121B">H01L21/67</main-classification>
        <further-classification edition="200601120251121B">B65G49/07</further-classification>
        <further-classification edition="200601120251121B">B25J9/16</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商芯印能半導體科技（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處置半導體載板的設備，包括：處置腔、n個加熱腔、至少n+1個暫存區、升降裝置以及機械手臂。n個加熱腔是與處置腔連通。至少n+1個暫存區是置於處置腔中。升降裝置是置於處置腔中，經配置以傳送可移轉的金屬晶舟盒至n個加熱腔或n+1個暫存區的其中之一，可移轉的金屬晶舟盒是用以容置及批次傳送複數個半導體載板，n個加熱腔以及至少n+1個暫存區是經配置以容納可移轉的金屬晶舟盒。機械手臂是置於處置腔中，經配置由載板裝載系統依序傳送複數個半導體載板至可移轉的金屬晶舟盒。其中， n為一大於或等1的整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處置半導體載板的設備</p>
        <p type="p">90:FOUP(前開式晶圓傳送盒)</p>
        <p type="p">100:處置腔</p>
        <p type="p">100A:第一側</p>
        <p type="p">100B:第二側</p>
        <p type="p">102:加熱腔</p>
        <p type="p">103:工作燈</p>
        <p type="p">104:暫存區</p>
        <p type="p">106:升降裝置</p>
        <p type="p">107:升降裝置軌道</p>
        <p type="p">108:機械手臂</p>
        <p type="p">110:對準器</p>
        <p type="p">112:裝載端口</p>
        <p type="p">114:中央控制單元</p>
        <p type="p">200:金屬晶舟盒</p>
        <p type="p">301:批次傳送區</p>
        <p type="p">302:依序傳送區</p>
        <p type="p">1061:叉具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2099" publication-number="202618752">
    <tif-files tif-type="multi-tif">
      <tif file="114134273.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260122B">G09G3/3225</main-classification>
        <further-classification edition="202001120260122B">H05B45/32</further-classification>
        <further-classification edition="202001120260122B">H05B45/325</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼集團公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY GROUP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井久夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, HISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 能夠削減進行時間控制型的發光控制之情況下的控制系的消耗電力。  &lt;br/&gt;　　[解決手段] PWM生成電路，係基於所定之位元數的PWM控制值，而從生成用脈衝列中抽出所定之脈衝，以將PWM控制訊號予以生成。生成用脈衝列，係藉由：由PWM控制值的下位元的各位元所對應之脈衝寬的脈衝所成之下位脈衝列、和由異於下位元之PWM控制值的上位元所表示之最大數量的所定之脈衝寬的脈衝所成之上位脈衝列，而被構成。本技術係可適用於例如，由LED所成之像素是被配置成陣列狀的LED顯示器等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31:平移暫存器</p>
        <p type="p">32:標頭偵測電路</p>
        <p type="p">36:POR生成電路</p>
        <p type="p">41,41-1~41-4:暫存器</p>
        <p type="p">192:IC</p>
        <p type="p">211:計數器</p>
        <p type="p">212:PWM控制電路</p>
        <p type="p">213:重置控制電路</p>
        <p type="p">221-1~221-3:PWM生成電路</p>
        <p type="p">231-1~231-3:上位位元處理電路</p>
        <p type="p">232,232-1~232-3:下位位元處理電路</p>
        <p type="p">233-1~233-3:邏輯積電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2100" publication-number="202617996">
    <tif-files tif-type="multi-tif">
      <tif file="114134284.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙股寡核苷酸、共軛物和組合物以及它們的用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260202B">C12N15/113</main-classification>
        <further-classification edition="200601120260202B">A61K31/713</further-classification>
        <further-classification edition="201701120260202B">A61K47/54</further-classification>
        <further-classification edition="200601120260202B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京炫景瑞醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGERNA THERAPEUTICS (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HAITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃淵余</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高永鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YONGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種雙股寡核苷酸、共軛物和組合物以及它們的用途，涉及核酸藥物技術領域。該雙股寡核苷酸包含正義股和反義股，且所述正義股和所述反義股中的17-23個核苷酸至少部分地反向互補形成雙股體區；該雙股體區含有至少5個硫代磷酸雙酯核苷間鍵；該雙股寡核苷酸中存在至少一個懸垂端，且懸垂端不位於反義股的5'末端；懸垂端包含至少一個[2'-R&lt;sub&gt;1&lt;/sub&gt;-2'-R&lt;sub&gt;2&lt;/sub&gt;]修飾的核苷酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2101" publication-number="202617873">
    <tif-files tif-type="multi-tif">
      <tif file="114134286.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08L61/32</main-classification>
        <further-classification edition="200601120260202B">C08L63/00</further-classification>
        <further-classification edition="200601120260202B">C08L65/00</further-classification>
        <further-classification edition="200601120260202B">C08L79/04</further-classification>
        <further-classification edition="201801120260202B">C08K3/013</further-classification>
        <further-classification edition="200601120260202B">C08K5/5399</further-classification>
        <further-classification edition="200601120260202B">B32B27/06</further-classification>
        <further-classification edition="200601120260202B">B32B27/20</further-classification>
        <further-classification edition="200601120260202B">H05K1/03</further-classification>
        <further-classification edition="200601120260202B">H01L23/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田万桜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供清漆穩定性優異的樹脂組成物。本發明的解決手段是一種樹脂組成物，其包含(A)環氧樹脂、(B)馬來醯亞胺樹脂、特定範圍的量的(C)無機填充材料及特定的(D)環狀磷腈化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2102" publication-number="202617863">
    <tif-files tif-type="multi-tif">
      <tif file="114134308.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08L25/18</main-classification>
        <further-classification edition="200601120260202B">C08L61/18</further-classification>
        <further-classification edition="200601120260202B">C08L65/00</further-classification>
        <further-classification edition="200601120260202B">C08L71/10</further-classification>
        <further-classification edition="200601120260202B">C08L79/04</further-classification>
        <further-classification edition="200601120260202B">C08L101/12</further-classification>
        <further-classification edition="201801120260202B">C08K3/013</further-classification>
        <further-classification edition="200601120260202B">B32B27/00</further-classification>
        <further-classification edition="200601120260202B">B32B27/20</further-classification>
        <further-classification edition="200601120260202B">H05K1/03</further-classification>
        <further-classification edition="200601120260202B">H01L23/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村嘉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蜷川隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINAGAWA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供能夠實現介電損耗角正切低且與導體層的密合強度優異的固化物、另外在固化前能夠呈現良好柔軟性的樹脂組成物；使用該樹脂組成物的樹脂片；包含該樹脂組成物的固化物的電路基板；包含該電路基板的半導體裝置。  &lt;br/&gt;　　[解決手段] 一種樹脂組成物，其包含(A)含有特定結構單元和特定末端基團的化合物、(B)馬來醯亞胺樹脂、(C)無機填充材料和(D)液態熱固性樹脂(其中不包括屬於馬來醯亞胺樹脂和環氧樹脂的物質)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2103" publication-number="202618081">
    <tif-files tif-type="multi-tif">
      <tif file="114134324.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶體生長系統之自動裝載</chinese-title>
        <english-title>AUTOMATIC LOADING OF A CRYSTAL GROWING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C30B35/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＰＶＡ泰帕爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PVA TEPLA AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒爾特　亞力山德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHULTE, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明呈現一種用於一晶體生長系統之載料器，該載料器包含：一生長單元容座，其用於在該載料器上容納一生長單元；一載料器定心裝置，其用於使該載料器在該晶體生長系統上定心，其中該載料器定心裝置包含配置於該載料器上之至少一個第一定心元件，該至少一個第一定心元件用於使該載料器在至少一個定心元件容座上定心。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charge carrier for a crystal growing system is presented, comprising a growth cell receptacle for receiving a growth cell on the charge carrier, a carrier centering device for centering the charge carrier on the crystal growing system, wherein the carrier centering device comprises at least one first centering element arranged on the charge carrier for centering the charge carrier on at least one centering element receptacle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:載料器</p>
        <p type="p">12:載料器之圓周邊緣</p>
        <p type="p">13:生長單元容座</p>
        <p type="p">15:凸緣蓋/封閉的圓盤或凸緣蓋/蓋區段</p>
        <p type="p">17:定心環/第一定心元件/第一精細定心元件/定心元件/定心部件</p>
        <p type="p">19:密封側面/倒角密封側面/傾斜設計之密封側面</p>
        <p type="p">40:定心翼片/外部配置之定心翼片</p>
        <p type="p">44:第一粗略定心元件/粗略定心元件/粗略定心裝置/粗略定心部件/第一定心元件/定心元件/定心部件/定心銷</p>
        <p type="p">50:耦接翼片/外部配置之耦接翼片</p>
        <p type="p">52:第二粗略定心元件/粗略定心裝置/粗略定心元件/粗略定心部件/第一定心元件/定心元件/定心部件/定心銷</p>
        <p type="p">55:介質耦接件/連接器</p>
        <p type="p">59:定心銷/第一定心元件/第一精細定心元件/定心元件/定心部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2104" publication-number="202618243">
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      <tif file="114134328.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微粒測定裝置、微粒測定系統以及微粒測定方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260130B">G01N15/14</main-classification>
        <further-classification edition="200601120260130B">G01N21/53</further-classification>
        <further-classification edition="202401120260130B">G01N15/06</further-classification>
        <further-classification edition="200601120260130B">G05D16/20</further-classification>
        <further-classification edition="200601120260130B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹入聡一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEIRI, SOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村明威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, AKITAKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIHARA, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]使漂浮於通過配管內之流體之微粒之測定靈敏度及檢測率提升。  &lt;br/&gt;　　[解決手段]微粒測定系統，係具有光源、檢測部、量測部、流速控制部。光源，係構成為朝向在連接至處理裝置之減壓下之配管內流通之流體照射光。檢測部，係構成為檢測漂浮於通過配管內之光之照射區域之流體之微粒所散射之散射光。量測部，係構成為根據散射光之檢測結果量測微粒之計數。流速控制部，係構成為令使比照射區域更下游之配管內比照射區域更上游之配管內更低壓，且調整通過照射區域之流體之速度之流量之氣體，流入至下游之配管內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理裝置</p>
        <p type="p">11:排氣裝置</p>
        <p type="p">12:配管</p>
        <p type="p">12a:配管</p>
        <p type="p">12b:配管</p>
        <p type="p">13:壓力計</p>
        <p type="p">14:壓力控制閥</p>
        <p type="p">20:控制部</p>
        <p type="p">30:微粒測定裝置</p>
        <p type="p">31:光源</p>
        <p type="p">32:接收元件</p>
        <p type="p">33:氣體流入機構</p>
        <p type="p">34:監測控制部</p>
        <p type="p">100:微粒測定系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2105" publication-number="202618239">
    <tif-files tif-type="multi-tif">
      <tif file="114134334.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵道車輛的異常檢測方法、及異常檢測程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G01M17/08</main-classification>
        <further-classification edition="200601120260130B">G01M7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本智彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根来尚志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGORO, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鐵道車輛(1)的異常檢測方法，其具備準備工程、加振工程、檢測工程及判定工程。在準備工程中，準備鐵道車輛(1)。鐵道車輛(1)包含台車(2)、車體(3)、致動器(11)及加速度感測器(12)。致動器(11)配置於台車(2)與車體(3)之間。在加振工程中，藉由致動器(11)以既定的加振頻率對車體(3)進行加振。在檢測工程中，以加速度感測器(12)檢測被加振之車體(3)的加速度。在判定工程中，當所檢測到之車體(3)的加速度的頻率與加振頻率不同時，判定鐵道車輛(1)的零件已發生異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2106" publication-number="202618231">
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      <tif file="114134335.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓力感測器及壓力感測器系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G01L9/04</main-classification>
        <further-classification edition="200601120260130B">G01L1/04</further-classification>
        <further-classification edition="200601120260130B">G01L1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉翔平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼頭義昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中積誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZUMI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈昌勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIM, CHANGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金澤周介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAZAWA, SHUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板垣元士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAGAKI, MOTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之壓力感測器(11A)，具備：承受部(12A)，設於中央；支承部(13A)，設於承受部之周圍；複數個連結部(14A、15A、16A、17A)，沿著基準面(S1)延伸，設於承受部與支承部之間，第1端部連接於承受部，第2端部連接於支承部；及檢測部(22A、23A)，設於複數個連結部之至少一部分，檢測出複數個連結部之至少一個之應變；複數個連結部，當從與基準面正交之方向(Z)觀察時，具有彎曲部或折曲部(14cA、15cA、16cA、17cA)之至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">11A:壓力感測器</p>
        <p type="p">11G:片材</p>
        <p type="p">11aG:缺口</p>
        <p type="p">12A:承受部</p>
        <p type="p">13A:支承部</p>
        <p type="p">13aA、13bA:第1支承片</p>
        <p type="p">13cA、13dA:第2支承片</p>
        <p type="p">14A、15A、16A、17A:連結部</p>
        <p type="p">14aA、15aA、16aA、17aA:第1連結片</p>
        <p type="p">14bA、15bA、16bA、17bA:第2連結片</p>
        <p type="p">14cA、15cA、16cA、17cA:折曲部</p>
        <p type="p">22A、23A:檢測部</p>
        <p type="p">32A:段差層</p>
        <p type="p">S1:基準面</p>
        <p type="p">S6:支承構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2107" publication-number="202617636">
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      <volno>24</volno>
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          <doc-number>202617636</doc-number>
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        <document-id>
          <doc-number>114134349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於烯烴生產之密集型電加熱器</chinese-title>
        <english-title>COMPACT ELECTRICAL HEATER FOR OLEFIN PRODUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C07C4/04</main-classification>
        <further-classification edition="200601120260116B">C10G9/24</further-classification>
        <further-classification edition="200601120260116B">C10G9/14</further-classification>
        <further-classification edition="200601120260116B">F27D11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商魯瑪斯科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達蘭　肯達沙米　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM, KANDASAMY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電加熱器系統，包括：一加熱器塊；橫越該加熱器塊之複數個加熱元件孔；橫越該加熱器塊之複數個輻射盤管孔；複數個電加熱元件，其安置在該複數個加熱元件孔內；及複數個輻射盤管，其安置在該複數個輻射盤管孔內。一種用於烯烴生產之方法包括：使用一電加熱器來加熱複數個輻射盤管；將一烴混合物饋至複數個入口管中；控制複數個電加熱元件之溫度以將一加熱器塊加熱至一所欲溫度；裂解該複數個輻射盤管中之該烴混合物以產生一經裂解流出物；經由複數個出口管收集該裂解流出物；以及使用一熱交換器來冷卻該經裂解流出物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical heater system includes a heater block, a plurality of heating element holes transversing the heater block, a plurality of radiant coil holes transversing the heater block, a plurality of electrical heating elements disposed within the plurality of heating element holes, and a plurality of radiant coils disposed within the plurality of radiant coil holes. A process for olefin production includes heating a plurality of radiant coils using an electrical heater, feeding a hydrocarbon mixture into a plurality of inlet tubes, controlling a temperature of a plurality of electrical heating elements to heat a heater block to a desired temperature, cracking the hydrocarbon mixture in the plurality of radiant coils to produce a cracked effluent, collecting the cracked effluent through a plurality of outlet tubes, and cooling the cracked effluent using a heat exchanger.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電加熱器系統</p>
        <p type="p">101:加熱器塊</p>
        <p type="p">103:加熱元件孔、元件孔、孔</p>
        <p type="p">105:入口管孔、孔</p>
        <p type="p">107:出口管孔、孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2108" publication-number="202617972">
    <tif-files tif-type="multi-tif">
      <tif file="114134352.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改良的轉葡萄糖基化活性之馬里乳桿菌突變型菌株、使用其製備葡萄糖基化甜菊醣苷之方法、包含其之用以製備葡萄糖基化甜菊醣苷的組成物、以及甜味組成物</chinese-title>
        <english-title>LACTOBACILLUS MALI MUTANT STRAIN HAVING IMPROVED TRANSGLUCOSYLATION ACTIVITY, METHOD OF PREPARING GLUCOSYLATED STEVIOL GLYCOSIDES USING THE SAME, COMPOSITION FOR PREPARING GLUCOSYLATED STEVIOL GLYCOSIDES COMPRISING THE SAME AND SWEETENING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C12N1/20</main-classification>
        <further-classification edition="200601120260202B">C12P19/56</further-classification>
        <further-classification edition="201601120260202B">A23L27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＣＪ第一製糖股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CJ CHEILJEDANG CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴藝琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YE LIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李美善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MI SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金龍顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭求映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, GOO YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋在明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JAE MYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴晟喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供突變型馬里乳桿菌菌株，其具有改良的甜菊醣苷之葡萄糖基化活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a mutant Lactobacillus mali strain having improved glucosylation activity of steviol glycosides.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2109" publication-number="202617657">
    <tif-files tif-type="multi-tif">
      <tif file="114134361.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>再循環對苯二甲酸及其製造方法</chinese-title>
        <english-title>RECYCLED TEREPHTHALIC ACID AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C51/09</main-classification>
        <further-classification edition="200601120260202B">C07C63/26</further-classification>
        <further-classification edition="200601120260202B">C07C67/03</further-classification>
        <further-classification edition="200601120260202B">C07C67/48</further-classification>
        <further-classification edition="200601120260202B">C07C69/82</further-classification>
        <further-classification edition="200601120260202B">C08J11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安秀彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜淍植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JU-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴真姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIN-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張有美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田敏較</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, MINGYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙顯埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYUN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡熙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HEE-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種製備再循環對苯二甲酸的方法，該方法包含：用解聚合溶劑將包含棉花與合成纖維的摻合織物解聚合以產生解聚合產物，過濾該解聚合產物以分離濾液，自該濾液中獲得再循環鄰苯二甲酸二烷基酯，及對該再循環鄰苯二甲酸二烷基酯進行水解；以及藉此製備的再循環對苯二甲酸，該再循環對苯二甲酸具有高純度及產率以及改良的顏色。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for preparing recycled terephthalic acid, which comprises depolymerizing a blended textile comprising cotton and a synthetic fiber with a depolymerization solvent to produce a depolymerization product; filtering the depolymerization product to separate a filtrate; obtaining a recycled dialkyl phthalate from the filtrate; and subjecting the recycled dialkyl phthalate to hydrolysis, and to recycled terephthalic acid prepared thereby and having high purity and yield, along with improved color.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2110" publication-number="202617014">
    <tif-files tif-type="multi-tif">
      <tif file="114134388.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134388</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合式鈦金屬鍋具及其製造方法</chinese-title>
        <english-title>COMPOSITE TITANIUM METAL COOKWARE AND THE MANUFACTURE METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">A47J27/00</main-classification>
        <further-classification edition="200601120251023B">A47J36/02</further-classification>
        <further-classification edition="200601120251023B">B32B15/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽鈦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIMAS TITAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝涵淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HAN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝涵婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HAN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種複合式鈦金屬鍋具，其包括：一多層鍋具本體，多層鍋具本體包含位於多層鍋具本體的內側面的一鈦金屬層，和位於多層鍋具本體的外側面的一不鏽鋼層，和位於鈦金屬層和不鏽鋼層之間的鋁合金夾層結構；鋁合金夾層結構包含至少二個鋁合金材料層透過第一次原子擴散接合手段結合在一起，其中至少二個鋁合金材料層具有不同的抗拉強度；其中，鈦金屬層和不鏽鋼層是透過第二次原子擴散接合手段結合於鋁合金夾層結構的兩側面。本發明同時還公開一種複合式鈦金屬鍋具的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite titanium metal cookware includes a multi-layer cookware body. The multi-layer cookware body includes a titanium metal layer located on the inner side of the multi-layer cookware body; a stainless steel layer on the outer side, and an aluminum alloy sandwich structure located between the titanium metal layer and the stainless steel layer. The aluminum alloy sandwich structure includes at least two aluminum alloy material layers bonded together by a first atomic diffusion bonding method. The at least two aluminum alloy material layers have different tensile strengths. The titanium metal layer and the stainless steel layer are combined on both sides of the aluminum alloy sandwich structure by a second atomic diffusion bonding means. The invention also discloses a method for manufacturing a composite titanium metal cookware.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合式鈦金屬鍋具</p>
        <p type="p">10:多層鍋具本體</p>
        <p type="p">101:內側面</p>
        <p type="p">102:外側面</p>
        <p type="p">11:凹穴狀空間</p>
        <p type="p">12:握把</p>
        <p type="p">13:提把</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2111" publication-number="202617205">
    <tif-files tif-type="multi-tif">
      <tif file="114134398.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於輸氧的鼻導管設備和相關方法</chinese-title>
        <english-title>NASAL CANNULA APPARATUS FOR OXYGEN DELIVERY AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A61M16/00</main-classification>
        <further-classification edition="200601120260130B">A61M16/08</further-classification>
        <further-classification edition="200601120260130B">A61M16/20</further-classification>
        <further-classification edition="200601120260130B">A61B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣原蓄醫學科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEALOMED SCIENTIFIC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　正綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, EDWARD DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　美嫦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SUZANNA LUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　偉華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BRYAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林良俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIANG-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韻親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵瓊慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮達發</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鼻導管設備，包括連接至主體的一對鼻導管，其中該主體限定了內部主體腔。主體適於圍繞使用者頭部固定，在大致鼻孔和上唇之間與使用者接合，且一對鼻導管與鼻孔接合，使得使用者肺部和主體腔之間流體連通。呼吸氣體流入主體腔，之後借助一對鼻導管輸送到使用者。流出氣體借助一對鼻導管從肺部流入主體腔，之後借助排氣管從主體腔排出。設置在主體內的流入閥控制流入主體腔的呼吸氣體。主體內可以設置流出閥，用於控制主體腔與排氣管之間的流體連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The nasal cannula apparatus includes a pair of nasal cannula connected to a body defining an internal body chamber. The body is adapted to be secured about the head of a user in engagement with the user generally between the nares and the upper lip and with the pair of nasal cannula engaged with the nares to fluidly communicate between the user’s lungs and the body chamber. Respiratory gas is communicated into the body chamber for delivery to the user via the pair of nasal cannula. Outflow gas is communicated from the lungs via the pair of nasal cannula into the body chamber for discharge from the body chamber via a discharge tube. An inflow valve disposed within the body controls communication of respiratory gas into the body chamber. An outflow valve may be disposed within the body to control fluid communication between the body chamber and the discharge tube.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鼻導管設備</p>
        <p type="p">11:呼吸氣體</p>
        <p type="p">13:流出氣體</p>
        <p type="p">20:主體</p>
        <p type="p">25:主體腔</p>
        <p type="p">26a、26b:鼻導管</p>
        <p type="p">28a、28b:遠端開口</p>
        <p type="p">31a、31b:連接器</p>
        <p type="p">33a、33b:帶</p>
        <p type="p">37a、37b:夾子</p>
        <p type="p">40:供氣管</p>
        <p type="p">43:袋</p>
        <p type="p">44:屬性</p>
        <p type="p">45:袋蓄氣區</p>
        <p type="p">47:供氣通路</p>
        <p type="p">50:排氣管</p>
        <p type="p">60:插入件</p>
        <p type="p">70:防窒息閥</p>
        <p type="p">77:連接器</p>
        <p type="p">80:套件</p>
        <p type="p">82:過濾器</p>
        <p type="p">84:感測器</p>
        <p type="p">86:PEEP閥</p>
        <p type="p">99:氣源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2112" publication-number="202618927">
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      <tif file="114134401.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理方法、半導體裝置之製造方法、處理裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L21/311</main-classification>
        <further-classification edition="200601120260130B">H01L21/306</further-classification>
        <further-classification edition="200601120260130B">C09K13/08</further-classification>
        <further-classification edition="200601120260130B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本隆治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田原開悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAHARA, KAIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田英樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORITA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供可效率佳地施行基板表面之氧化膜蝕刻的技術。  &lt;br/&gt;本發明係包括：(a)準備表面具有形成為較原本所必要之厚度T&lt;sub&gt;1&lt;/sub&gt;剛好多出厚度T&lt;sub&gt;2&lt;/sub&gt;之含氮膜、與氧化膜的基板之步驟；以及(b)藉由對上述基板供應含氟物質，利用由上述含氮膜與上述含氟物質進行化學反應生成的物質X，將上述基板表面的上述氧化膜施行蝕刻之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2113" publication-number="202617983">
    <tif-files tif-type="multi-tif">
      <tif file="114134410.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於選擇高Ｍ６Ｐ重組蛋白之方法</chinese-title>
        <english-title>METHOD FOR SELECTION OF HIGH M6P RECOMBINANT PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C12N9/26</main-classification>
        <further-classification edition="200601120260123B">C07K1/18</further-classification>
        <further-classification edition="200601120260123B">C07K1/22</further-classification>
        <further-classification edition="200601120260123B">C07K1/34</further-classification>
        <further-classification edition="200601120260123B">A61K38/47</further-classification>
        <further-classification edition="200601120260123B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿米庫斯醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMICUS THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　宏Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, HUNG V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥特沙爾　羅素</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTSCHALL, RUSSELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於生產、捕獲、和純化重組人溶酶體蛋白之方法。此類重組人溶酶體蛋白可以具有高含量的甘露糖-6-磷酸殘基。亦描述了包括此類重組人溶酶體蛋白之藥物組成物，以及此類重組人溶酶體蛋白的治療方法及用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for the production, capturing and purification of recombinant human lysosomal proteins are described. Such recombinant human lysosomal proteins can have high content of mannose-6-phosphate residues. Also described are pharmaceutical compositions comprising such recombinant human lysosomal proteins, as well as methods of treatment and uses of such recombinant human lysosomal proteins.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">601:生物反應器</p>
        <p type="p">603:過濾系統</p>
        <p type="p">605:蛋白質捕獲系統</p>
        <p type="p">607:病毒殺滅步驟</p>
        <p type="p">609:第二層析系統</p>
        <p type="p">611:病毒殺滅步驟</p>
        <p type="p">613:第三層析系統</p>
        <p type="p">615:過濾系統</p>
        <p type="p">617:產物調節步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2114" publication-number="202618046">
    <tif-files tif-type="multi-tif">
      <tif file="114134420.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法，半導體裝置的製造方法，程式及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C23C16/44</main-classification>
        <further-classification edition="200601120260119B">C23C16/455</further-classification>
        <further-classification edition="200601120260119B">C23C16/52</further-classification>
        <further-classification edition="200601120260119B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松野豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNO, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可使成膜速率提升的技術。  &lt;br/&gt;　　具有：a)對基板供給包含構成膜的主元素以及鹵素元素的第1氣體之工序；b)對基板供給包含氫的第1還原氣體之工序；c)對基板供給包含氫而和第1還原氣體相異的材料的第2還原氣體之工序；d)並行進行a)與b)，在並行的期間，將第1還原氣體的供給量相比於第1還原氣體的供給開始時予以減少之工序；e)將a)與c)進行規定次數，而在基板形成前述膜之工序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板處理裝置</p>
        <p type="p">115:晶舟升降機(BE)</p>
        <p type="p">121:控制器</p>
        <p type="p">200:晶圓</p>
        <p type="p">201:處理室</p>
        <p type="p">201a:預備室</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:外管</p>
        <p type="p">204:內管</p>
        <p type="p">204a:排氣孔</p>
        <p type="p">206:排氣路</p>
        <p type="p">207:加熱器</p>
        <p type="p">209:歧管(MF)</p>
        <p type="p">217:晶舟</p>
        <p type="p">218:斷熱板</p>
        <p type="p">219:封帽(SC)</p>
        <p type="p">220a,220b:O型環</p>
        <p type="p">231:排氣管</p>
        <p type="p">243:APC(Auto Pressure Controller；自動壓力控制)閥</p>
        <p type="p">245:壓力感測器</p>
        <p type="p">246:泵浦</p>
        <p type="p">255:旋轉軸</p>
        <p type="p">267:旋轉機構</p>
        <p type="p">310,320,330,510,520,530:氣體供給管</p>
        <p type="p">312,322,332,512,522,532:質量流量控制器(MFC)</p>
        <p type="p">314,324,334,514,524,534:閥</p>
        <p type="p">410,420,430:噴嘴</p>
        <p type="p">410a,420a,430a:氣體供給孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2115" publication-number="202618042">
    <tif-files tif-type="multi-tif">
      <tif file="114134449.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>SiGe磊晶晶圓及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C16/42</main-classification>
        <further-classification edition="200601120260202B">C23C16/455</further-classification>
        <further-classification edition="200601120260202B">C23C16/52</further-classification>
        <further-classification edition="200601120260202B">C30B25/02</further-classification>
        <further-classification edition="200601120260202B">C30B25/16</further-classification>
        <further-classification edition="200601120260202B">C30B29/52</further-classification>
        <further-classification edition="200601120260202B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋慶太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, KEITARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木温</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSUKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原壽樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種SiGe磊晶晶圓及其製造方法，該SiGe磊晶晶圓在矽基板上具備以SiGe為主成分之SiGe層，且具有矽基板上的第一SiGe層、該第一SiGe層上的第二SiGe層及該第二SiGe層上的第三SiGe層，前述第一SiGe層的Ge組成比自前述矽基板側起向前述第二SiGe層側增加，前述第二SiGe層的Ge組成比自前述第一SiGe層側起向前述第三SiGe層側減少，並且前述第三SiGe層的Ge組成比在厚度方向上呈固定。藉此，提供一種SiGe磊晶晶圓及其製造方法，該SiGe磊晶晶圓在矽基板上異質磊晶成長有SiGe層，並且適於半導體裝置製作且已降低差排密度與翹曲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:SiGe磊晶晶圓</p>
        <p type="p">2:矽基板</p>
        <p type="p">3:第一SiGe層</p>
        <p type="p">4:第二SiGe層</p>
        <p type="p">5:第三SiGe層</p>
        <p type="p">6:SiGe緩衝層</p>
        <p type="p">7:裝置層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2116" publication-number="202617552">
    <tif-files tif-type="multi-tif">
      <tif file="114134459.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>升降搬送裝置</chinese-title>
        <english-title>ELAVATING TRANSPORT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B65G1/127</main-classification>
        <further-classification edition="200601120260102B">B65G21/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉永和治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINAGA, KAZUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種升降搬送裝置100，具備：複數個保持體1，保持搬送對象物10；及循環裝置2，使保持體1沿著具備有升降區間之循環路徑循環。循環裝置2具備：傳動構件21，使複數個保持體1沿著循環路徑循環；引導機構22，沿著循環路徑引導傳動構件21；及引導軌道221，引導複數個保持體1的沿著循環路徑之移動。複數個保持體1的各者具備有被引導軌道221引導之被引導機構12，並且相對於引導軌道221偏向軸方向第1側L1而配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保持體</p>
        <p type="p">11:支撐台</p>
        <p type="p">111:載置面</p>
        <p type="p">12:被引導機構</p>
        <p type="p">2:循環裝置</p>
        <p type="p">21:傳動構件</p>
        <p type="p">22:引導機構</p>
        <p type="p">22A:對象旋轉體</p>
        <p type="p">220:旋轉體</p>
        <p type="p">221:引導軌道</p>
        <p type="p">23:固定構造</p>
        <p type="p">231:第1基座部</p>
        <p type="p">232:第2基座部</p>
        <p type="p">234:支柱</p>
        <p type="p">235:橋接構造</p>
        <p type="p">3:移交部</p>
        <p type="p">31:第1移交部</p>
        <p type="p">32:第2移交部</p>
        <p type="p">33:通路面</p>
        <p type="p">5:落下限制機構</p>
        <p type="p">51:伸出部</p>
        <p type="p">52:限制部</p>
        <p type="p">10:搬送對象物</p>
        <p type="p">100:升降搬送裝置</p>
        <p type="p">101:搬送車</p>
        <p type="p">L:軸方向</p>
        <p type="p">L1:軸方向第1側</p>
        <p type="p">L2:軸方向第2側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2117" publication-number="202617746">
    <tif-files tif-type="multi-tif">
      <tif file="114134472.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、預浸體、樹脂薄膜、覆金屬積層板、印刷線路板、及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">C07F9/6581</main-classification>
        <further-classification edition="200601120260120B">C08F220/52</further-classification>
        <further-classification edition="200601120260120B">C08L63/02</further-classification>
        <further-classification edition="200601120260120B">C08L71/08</further-classification>
        <further-classification edition="200601120260120B">C08K3/36</further-classification>
        <further-classification edition="200601120260120B">H01L23/28</further-classification>
        <further-classification edition="200601120260120B">H05K1/03</further-classification>
        <further-classification edition="200601120260120B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀨良祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真藤祐二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATO, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫倉亞唯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOKURA, AI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安部慎一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春日圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASUGA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹口彩香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEGUCHI, AYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種樹脂組成物，其包含：熱硬化性樹脂(A)、具有磷腈結構及聯苯結構的磷系化合物(B)、及相對於樹脂組成物的固體成分為30質量％以上的填充材料(C)。亦揭示一種預浸體、樹脂薄膜、覆金屬積層板、印刷線路板、及半導體封裝體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2118" publication-number="202619162">
    <tif-files tif-type="multi-tif">
      <tif file="114134481.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多諧振天線</chinese-title>
        <english-title>MULTI-RESONANT ANTENNA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260114B">H01Q5/364</main-classification>
        <further-classification edition="201501120260114B">H01Q5/10</further-classification>
        <further-classification edition="200601120260114B">H01Q9/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥屋尾博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYAO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是提供具有在複數個運行頻率下諧振之構造的天線。多諧振天線10包括：主天線30以及附加放射元件270。主天線30包括：封閉環狀的主部320以及供電部210。供電部210具有：第一供電部位220、第二供電部位250、第一供電點2421、以及第二供電點252。第一供電部位220及第二供電部位250各自從主部320朝向外側延伸。第一供電點2421設置於第一供電部位220。第二供電點252設置於第二供電部位250。附加放射元件270直接從第一供電部位220朝向主天線30的外側延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-resonant antenna comprises a main antenna and an additional radiation element. The main antenna comprises a main portion and a feeding portion. The main portion has a closed ring shape. The feeding portion has a first feeding part, a second feeding part, a first feeding point and a second feeding point. Each of the first feeding part and the second feeding part extends outward of the main antenna from the main portion. The first feeding point is provided at the first feeding part. The second feeding point is provided at the second feeding part. The additional radiation element extends outward of the main antenna directly from the first feeding part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:多諧振天線</p>
        <p type="p">30:主天線</p>
        <p type="p">40:激發源</p>
        <p type="p">210:供電部</p>
        <p type="p">220:第一供電部位</p>
        <p type="p">230:第一部位</p>
        <p type="p">240:第二部位</p>
        <p type="p">241:第一段</p>
        <p type="p">242:第二段</p>
        <p type="p">2421:第一供電點</p>
        <p type="p">2422:直線部</p>
        <p type="p">245:中心</p>
        <p type="p">250:第二供電部位</p>
        <p type="p">252:第二供電點</p>
        <p type="p">260:開放槽</p>
        <p type="p">270:附加放射元件</p>
        <p type="p">271:基部</p>
        <p type="p">272:附加直線部</p>
        <p type="p">274:第一延伸部</p>
        <p type="p">320:主部</p>
        <p type="p">330:第一部</p>
        <p type="p">334:第二部</p>
        <p type="p">336:第三部</p>
        <p type="p">338:第四部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2119" publication-number="202617880">
    <tif-files tif-type="multi-tif">
      <tif file="114134500.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜組成物及覆膜織物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250917B">C08L67/02</main-classification>
        <further-classification edition="200601120250917B">C08K5/3477</further-classification>
        <further-classification edition="200601120250917B">D06N3/00</further-classification>
        <further-classification edition="200601120250917B">D06N3/12</further-classification>
        <further-classification edition="200601120250917B">B32B27/12</further-classification>
        <further-classification edition="200601120250917B">B32B27/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>G-FUN INDUSTRIAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃松筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SUNG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊鈺坪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YU-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成膜組成物，包含：共聚聚酯、甲醚化胺基樹脂交聯劑、成膜促進劑及有機溶劑。該共聚聚酯由對苯二甲酸、飽和脂肪族二元酸、乙二醇及飽和脂肪族二元醇共聚合而得。該共聚聚酯的玻璃轉化溫度範圍為-20℃至20℃。該成膜促進劑是選自於對甲苯磺酸或十二烷基苯磺酸。本發明還提供一種包含由該成膜組成物成膜而得的薄膜的覆膜織物。本發明成膜組成物可形成覆蓋於底布的薄膜，且包含該薄膜的覆膜織物具有較高的耐水壓能力及抗扭曲能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2120" publication-number="202618452">
    <tif-files tif-type="multi-tif">
      <tif file="114134516.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻劑組成物及圖案形成方法</chinese-title>
        <english-title>PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G03F7/039</main-classification>
        <further-classification edition="200601120260130B">C08F220/26</further-classification>
        <further-classification edition="200601120260130B">G03F7/004</further-classification>
        <further-classification edition="200601120260130B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦電子材料國際有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯希森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, XISEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MINGQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靜怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JINGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸一葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YIYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡梅倫　詹姆斯Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMERON, JAMES F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田晋太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合物，其具有衍生自具有式(I)的第一單體的重複單元，其中R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;3&lt;/sub&gt;、R&lt;sub&gt;4&lt;/sub&gt;、R&lt;sub&gt;5&lt;/sub&gt;、R&lt;sub&gt;6&lt;/sub&gt;獨立地是H、具有1至20個碳原子的直鏈或支鏈或脂環族取代或未取代的烷基、或具有5至20個碳原子的取代或未取代的芳香族基團；R&lt;sub&gt;2&lt;/sub&gt;選自空缺，具有1至最高達20、最高達15個碳原子的直鏈或支鏈或脂環族取代或未取代的烷基或具有5至20個碳原子的取代或未取代的芳香族基團；並且n係0至3的整數，或R&lt;sub&gt;1&lt;/sub&gt;和R&lt;sub&gt;2&lt;/sub&gt;或R&lt;sub&gt;1&lt;/sub&gt;和R&lt;sub&gt;6&lt;/sub&gt;與其所附接的環結構中的碳原子一起形成環狀結構。該聚合物可以用於光阻劑組成物中。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="193px" width="236px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polymer having a repeating unit derived from a first monomer of formula (I) wherein R&lt;sub&gt;1&lt;/sub&gt;, R&lt;sub&gt;3&lt;/sub&gt;, R&lt;sub&gt;4&lt;/sub&gt;, R&lt;sub&gt;5&lt;/sub&gt;, R&lt;sub&gt;6&lt;/sub&gt; are independently H, a linear or branched or alicyclic substituted or unsubstituted alkyl group having from 1 to 20 carbon atoms, or a substituted or unsubstituted aromatic group having from 5 to 20 carbon atoms; R&lt;sub&gt;2&lt;/sub&gt; is chosen from null, a linear or branched or alicyclic substituted or unsubstituted alkyl group having from 1 up to 20, up to 15 carbon atoms or a substituted or unsubstituted aromatic group having from 5 to 20 carbon atoms; and n is an integer of 0 to 3, or R&lt;sub&gt;1&lt;/sub&gt; and R&lt;sub&gt;2&lt;/sub&gt; or R&lt;sub&gt;1&lt;/sub&gt; and R&lt;sub&gt;6&lt;/sub&gt; together with the carbon atoms in the ring structure to which they are attached form cyclic structures. The polymer can be used in a photoresist composition.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="176px" width="210px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
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      </representative-img>
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          <doc-number>202617841</doc-number>
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        <document-id>
          <doc-number>114134546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>弱錨定液晶配向劑、液晶顯示元件、及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G81/02</main-classification>
        <further-classification edition="200601120260202B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三宅一世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKE, KAZUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野慎躍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種弱錨定液晶配向劑，使用於形成具有液晶、及液晶配向膜的液晶胞之前述液晶配向膜，含有接枝共聚物，該接枝共聚物具有選自於由聚醯胺酸、聚醯胺酸酯、聚醯亞胺、聚醯胺、及聚脲構成之群組中之至少1種的聚合物(A)、及與前述液晶相容且展現弱錨定性的聚合物(B)，前述聚合物(A)與前述聚合物(B)鍵結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:橫向電場液晶顯示元件</p>
        <p type="p">2:梳齒電極基板</p>
        <p type="p">2a:基材</p>
        <p type="p">2b:線狀電極</p>
        <p type="p">2c:液晶配向膜</p>
        <p type="p">3:液晶</p>
        <p type="p">4:相對基板</p>
        <p type="p">4a:液晶配向膜</p>
        <p type="p">4b:基材</p>
        <p type="p">L:電場線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2122" publication-number="202616950">
    <tif-files tif-type="multi-tif">
      <tif file="114134554.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202616950</doc-number>
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      </publication-reference>
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        <document-id>
          <doc-number>114134554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塊莖或捲貝處理裝置及塊莖或捲貝處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A01M21/02</main-classification>
        <further-classification edition="200601120260130B">A01B39/18</further-classification>
        <further-classification edition="200601120260130B">A01B33/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人農業　食品產業技術總合研究機構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL AGRICULTURE AND FOOD RESEARCH ORGANIZATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田俊輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊達勇太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATE, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅見秀則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAMI, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林英和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEDA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的塊莖或捲貝處理裝置，是在提供具有：挖掘部(10)，是連同土壤一起挖起塊莖(A)或捲貝；旋耕機(13)，是爪部在挖掘部(10)的上方旋轉；輸送帶部(20)，是將利用挖掘部(10)挖起的塊莖(A)或捲貝與土壤進行粗分離；以及滾子部(30)，是壓碎從輸送帶部(20)被搬運的塊莖(A)或捲貝，該裝置是處理埋藏在水田的土壤中的多年生雜草的塊莖(A)或捲貝的塊莖或捲貝處理裝置，其是藉由將挖掘部(10)作成沿旋耕機(13)的旋轉軌跡的曲面形狀，控制被輸送帶部(20)所搬運的泥土量，使泥土與塊莖(A)或捲貝的分離變得容易，而能夠迅速且高效率地進行塊莖處理或捲貝處理的塊莖或捲貝處理裝置及塊莖或捲貝處理方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:挖掘部</p>
        <p type="p">13:旋耕機</p>
        <p type="p">20:輸送帶部</p>
        <p type="p">30:滾子部</p>
        <p type="p">31:第1滾子</p>
        <p type="p">32:第2滾子</p>
        <p type="p">40:橇板</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2123" publication-number="202619077">
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      <tif file="114134561.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202619077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L23/31</main-classification>
        <further-classification edition="200601120260130B">H01L23/36</further-classification>
        <further-classification edition="200601120260130B">H01L23/48</further-classification>
        <further-classification edition="200601120260130B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUL BEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周名佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MYUNG JEA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林基泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, GI TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翰古文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, GYU WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，一種電子裝置包含：基板，其具有導電結構；電子組件，其在所述基板的第一側處耦合到所述導電結構，其中所述電子組件包含面向所述基板的所述第一側的第一側及與所述第一側相對的第二側；垂直互連件，其圍繞所述電子組件安置，其中所述垂直互連件在所述基板的所述第一側處耦合到所述導電結構；熱主體，其耦合到所述電子組件的所述第二側；插入件，其耦合到所述垂直互連件，其中所述插入件包含限定開口並圍繞所述熱主體安置的內側壁；以及囊封物，其安置在所述熱主體和所述插入件的所述內側壁之間，圍繞所述垂直互連件且圍繞所述電子組件，其中所述熱主體從所述囊封物暴露。本文中還公開了其它實施例和相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, an electronic device includes a substrate having a conductive structure, an electronic component coupled to the conductive structure at a first side of the substrate, wherein the electronic component includes a first side facing the first side of the substrate and a second side opposite the first side, vertical interconnects disposed around the electronic component, wherein the vertical interconnects are coupled to the conductive structure at the first side of the substrate, a thermal body coupled to the second side of the electronic component, an interposer coupled to the vertical interconnects, wherein the interposer includes inner sidewalls defining an opening disposed around the thermal body, and an encapsulant disposed between the thermal body and the inner sidewalls of the interposer, around the vertical interconnects, and around the electronic component, wherein the thermal body is exposed from the encapsulant. Other examples and related methods are also disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:電子組件</p>
        <p type="p">118:熱界面材料</p>
        <p type="p">120:熱主體</p>
        <p type="p">130:基板</p>
        <p type="p">132:介電結構</p>
        <p type="p">134:導電結構</p>
        <p type="p">136:外部端子</p>
        <p type="p">138:內部端子</p>
        <p type="p">140:插入件</p>
        <p type="p">142:介電結構</p>
        <p type="p">144:導電結構</p>
        <p type="p">146:外部端子</p>
        <p type="p">148:內部端子</p>
        <p type="p">149:中心開口</p>
        <p type="p">150:垂直互連件</p>
        <p type="p">151:核心結構</p>
        <p type="p">152:可熔材料</p>
        <p type="p">160:囊封物</p>
        <p type="p">170:外部互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2124" publication-number="202618804">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618804</doc-number>
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        <document-id>
          <doc-number>114134566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>精子篩選輔助裝置、精子篩選輔助系統及精子篩選輔助程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260202B">G16H50/30</main-classification>
        <further-classification edition="201801120260202B">G16H50/20</further-classification>
        <further-classification edition="201701120260202B">G06T7/00</further-classification>
        <further-classification edition="200601120260202B">A61B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＲＣＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>棚瀬将康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANASE, MASAYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能自檢體中之精子之中選擇適合顯微授精之優質精子的精子篩選輔助裝置。本發明提供一種精子篩選輔助裝置，其具備：指標計算部，其計算出與於動態影像中識別出之精子之品質相關之至少1個指標；評價部，其基於至少1個指標，相對評價於動態影像之第1時間間隔中識別出之第1精子、及於動態影像之與第1時間間隔不同之第2時間間隔中識別出之第2精子的品質；及顯示控制部，其於動態影像之第1時間間隔中，相對於第1精子建立關聯而顯示與第1精子之至少1個指標相關之資訊，並且顯示由評價部評價出之第1精子與第2精子之相對品質評價。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:精子篩選輔助系統</p>
        <p type="p">10:精子篩選輔助裝置</p>
        <p type="p">20:攝像裝置</p>
        <p type="p">S:樣本</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2125" publication-number="202617478">
    <tif-files tif-type="multi-tif">
      <tif file="114134599.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液壓控制單元及跨騎式車輛</chinese-title>
        <english-title>HYDRAULIC PRESSURE CONTROL UNIT AND STRADDLE-TYPE VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B60T8/34</main-classification>
        <further-classification edition="200601120260130B">F04B17/03</further-classification>
        <further-classification edition="200601120260130B">H02K5/16</further-classification>
        <further-classification edition="200601120260130B">H02K5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諸徳睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, DERUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明獲得即使為不經由減速機構而以馬達單元之輸出軸來驅動泵裝置之構成，亦能抑制從橫方向作用於馬達單元之輸出軸之負載過大的情況的液壓控制單元。  &lt;br/&gt;本發明之液壓控制單元，具備：基體；馬達單元，係泵裝置之驅動源，且具有定子、轉子、固定於前述轉子的輸出軸、及蓋；以及軸承，其設置於前述基體，插入有前述輸出軸；前述蓋具備：覆蓋前述定子之外周側的筒部、及從前述筒部之外周面突出的凸緣；前述馬達單元係利用形成於前述基體的凹部之底部與塑性變形部夾持前述凸緣，而被固定於前述基體；前述凸緣具備凸緣主部、以及剛性比前述凸緣主部低之複數個剛性減低部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To obtain a hydraulic pressure control unit capable of suppressing excessive load acting on an output shaft of a motor unit in a lateral direction even with a configuration in which the output shaft of the motor unit drives a pump device without intervention of a deceleration mechanism. &lt;br/&gt;A hydraulic pressure control unit according to the present invention includes a base body, a motor unit, and a bearing. The motor unit is a driving source of a pump device and includes a stator, a rotor, an output shaft fixed to the rotor, and a cover. The bearing is provided to the base body and the output shaft is inserted into the bearing. The cover includes a cylindrical part covering an outer peripheral side of the stator and a flange projecting from an outer peripheral surface of the cylindrical part. The motor unit is fixed to the base body in such a manner that the flange is held between a bottom part of a recess formed at the base body and a plastic deformation part. The flange includes a flange main part and multiple stiffness reduced parts having stiffness lower than stiffness of the flange main part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">25:進入閥</p>
        <p type="p">50:泵裝置</p>
        <p type="p">51:柱塞</p>
        <p type="p">61:控制基板</p>
        <p type="p">70:馬達單元</p>
        <p type="p">71:定子</p>
        <p type="p">72:轉子</p>
        <p type="p">73:輸出軸</p>
        <p type="p">73a:旋轉軸</p>
        <p type="p">74:偏心部</p>
        <p type="p">80:蓋</p>
        <p type="p">81:筒部</p>
        <p type="p">82:凸緣</p>
        <p type="p">100:液壓控制單元</p>
        <p type="p">101:軸承</p>
        <p type="p">110:基體</p>
        <p type="p">110a:面</p>
        <p type="p">111:凹部</p>
        <p type="p">111a:底部</p>
        <p type="p">111b:階部</p>
        <p type="p">112:塑性變形部</p>
        <p type="p">113:軸承用凹部</p>
        <p type="p">120:殼體</p>
        <p type="p">Z:觀察方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2126" publication-number="202618620">
    <tif-files tif-type="multi-tif">
      <tif file="114134608.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134608</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自使用生成式人工智慧(GAI)模型獲得之經改善結果準確性</chinese-title>
        <english-title>IMPROVED ACCURACY OF RESULTS OBTAINED FROM USE OF A GENERATIVE ARTIFICIAL INTELLIGENCE (GAI) MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260127B">G06N20/00</main-classification>
        <further-classification edition="202301120260127B">G06N3/008</further-classification>
        <further-classification edition="200601120260127B">G06F11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴哈得　曼尼緒　雅男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHIDE, MANISH ANAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維穆蘭達　佩太　奇斯霍爾　法瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEMULAMANDA, PRATAP KISHORE VARMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查瑪提　拉維　錢達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAMARTHY, RAVI CHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡塔里　馬達維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATARI, MADHAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於改善自使用一生成式人工智慧(GAI)模型獲得之結果準確性的方法、電腦程式產品及電腦系統。執行該GAI模型以生成分別針對Q個提示中之Q個問題的Q個答案。運算該Q個問題之多個c度量中之各c度量的一c評分。對於該多個c度量中之X個c度量，運算出的c評分超過零。生成分別對應於該X個c度量的X個擷取增強生成(RAG)形狀。使用該X個RAG形狀判定多個RAG形狀多重態及相關聯多重態評分。自該多個RAG形狀多重態選擇具有一最高RAG多重態評分之一頂部RAG形狀多重態。該頂部RAG形狀多重態以圖形方式顯示於一顯示裝置上。在自以圖形方式顯示的頂部RAG形狀多重態識別出該GAI模型之不準確性的一根本原因之後改善該GAI模型之準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, computer program product, and computer system for improving accuracy of results obtained from use of a generative artificial intelligence (GAI) model. The GAI model is executed to generate Q answers to Q questions in Q prompts, respectively. A c-score is computed for each c-metric of multiple c-metrics of the Q questions. The computed c-score exceeds zero for X c-metrics of the multiple c-metrics. X Retrieval-Augmented Generation (RAG) shapes respectively corresponding to the X c-metrics are generated. Multiple RAG shape multiplets and associated multiplet scores are determined using the X RAG shapes. A top RAG shape multiplet having a highest RAG multiplet score is selected from the multiple RAG shape multiplets. The top RAG shape multiplet is graphically displayed on a display device. The GAI model's accuracy is improved after a root cause of the GAI model's inaccuracy was identified from the graphically displayed top RAG shape multiplet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:步驟</p>
        <p type="p">320:步驟</p>
        <p type="p">330:步驟</p>
        <p type="p">340:步驟</p>
        <p type="p">350:步驟</p>
        <p type="p">360:步驟</p>
        <p type="p">370:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2127" publication-number="202618355">
    <tif-files tif-type="multi-tif">
      <tif file="114134609.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用深通孔之背側波導及調變器整合</chinese-title>
        <english-title>BACKSIDE WAVEGUIDE AND MODULATOR INTEGRATION WITH DEEP VIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">G02B6/12</main-classification>
        <further-classification edition="200601120260131B">G02F1/035</further-classification>
        <further-classification edition="200601120260131B">H01L21/768</further-classification>
        <further-classification edition="202501120260131B">H10D84/80</further-classification>
        <further-classification edition="202201120260131B">G06N10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　瑞龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, RUILONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅賓　約書亞　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUBIN, JOSHUA MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李桃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳倩文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QIANWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有使用一深通孔整合之一背側波導及調變器之光子積體電路。在一個態樣中，一種半導體裝置包括：一光子積體電路，其在該半導體裝置之一前側上具有一光學波導及一光學調變器，其中該光學波導及該光學調變器具有面向該半導體裝置之一背側的平坦底表面；以及接點，其包括將該光學調變器之一頂表面連接至該半導體裝置之該背側的深通孔。替代地，該光學波導及該光學調變器可具有面向該半導體裝置之該前側的平坦頂表面。亦提供一種形成本發明半導體裝置之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Photonics integrated circuits having a backside waveguide and modulator integrated using a deep via are provided. In one aspect, a semiconductor device includes: a photonics integrated circuit having an optical waveguide and an optical modulator on a frontside of the semiconductor device, where the optical waveguide and the optical modulator have flat bottom surfaces facing a backside of the semiconductor device; and contacts including deep vias that connect a top surface of the optical modulator to the backside of the semiconductor device. Alternatively, the optical waveguide and the optical modulator can have flat top surfaces facing the frontside of the semiconductor device. A method of forming the present semiconductor devices is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1001:晶圓</p>
        <p type="p">1001c:半導體層</p>
        <p type="p">3006a:主動層</p>
        <p type="p">3006b:主動層</p>
        <p type="p">3006c:主動層</p>
        <p type="p">5002:STI區</p>
        <p type="p">9014:源極/汲極區</p>
        <p type="p">9016:層間介電質</p>
        <p type="p">12004:層間介電質</p>
        <p type="p">12006b:中段製程接點</p>
        <p type="p">12006b':深通孔</p>
        <p type="p">12006c:中段製程接點</p>
        <p type="p">15002:層間介電質</p>
        <p type="p">15003:後段製程接點</p>
        <p type="p">15004:後段製程互連層</p>
        <p type="p">15008:載體晶圓</p>
        <p type="p">23002':層間介電質</p>
        <p type="p">25002a':背側接點</p>
        <p type="p">25004':背側互連層</p>
        <p type="p">31000:半導體裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2128" publication-number="202617780">
    <tif-files tif-type="multi-tif">
      <tif file="114134630.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與經腫瘤活化之靶定PSMA及效應細胞抗原之抗體相關之組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS RELATED TO TUMOR ACTIVATED ANTIBODIES TARGETING PSMA AND EFFECTOR CELL ANTIGENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C07K16/28</main-classification>
        <further-classification edition="200601120260123B">C07K16/30</further-classification>
        <further-classification edition="200601120260123B">A61K39/395</further-classification>
        <further-classification edition="200601120260123B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商詹努克斯治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANUX THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎貝爾　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPBELL, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪拉蒙多　湯瑪斯　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIRAIMONDO, THOMAS R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供選擇性結合至PSMA及效應細胞抗原(諸如CD3)的多特異性抗體、其醫藥組合物以及核酸，及其製造及發現方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are multispecific antibodies that selectively bind to PSMA and effector cell antigens such as CD3, pharmaceutical compositions thereof, as well as nucleic acids, and methods for making and discovering the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2129" publication-number="202617642">
    <tif-files tif-type="multi-tif">
      <tif file="114134635.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134635</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造部分氯化烷烴的裝置和方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR PRODUCING PARTIALLY CHLORINATED ALKANES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C17/02</main-classification>
        <further-classification edition="200601120260202B">C07C17/38</further-classification>
        <further-classification edition="200601120260202B">C07C19/045</further-classification>
        <further-classification edition="200601120260202B">B01J19/24</further-classification>
        <further-classification edition="200601120260202B">B01D3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商蒂森克魯伯伍德有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THYSSENKRUPP UHDE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商蒂森克魯伯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THYSSENKRUPP AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商西湖維諾立有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTLAKE VINNOLIT GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班傑　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENJE, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡默霍夫　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMMERHOFER, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷奇　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KREJCI, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種用於藉由烯烴的直接氯化來製造部分氯化烷烴的裝置和方法。具體而言本發明有關於一種藉由乙烯(ethene)(同義字:乙烯(ethylene))的直接氯化來製造1,2-二氯乙烷的裝置和方法。本發明的特徵在於，一迴圈反應器被用來直接氯化，其中用於所製造的部分氯化烷烴的排出部在迴圈反應器(於操作狀態中)的垂直位置上配置於迴圈反應器的側壁上，其配置為低於迴圈反應器的高度的一半。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a device and a method for producing partially chlorinated alkanes by direct chlorination of alkenes. In particular, the present invention relates to a device and a method for producing 1,2-dichloroethane by direct chlorination of ethene (synonym: ethylene). The invention is characterized in that a loop reactor is used for direct chlorination, wherein the discharge for the produced partially chlorinated alkane is arranged in a vertical position of the loop reactor (in the operating state) on a side wall of the loop reactor, which is arranged below half the height of the loop reactor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:迴圈反應器</p>
        <p type="p">2:氯化劑，具體而言為氯</p>
        <p type="p">2a:用於氯化劑的第二供給部</p>
        <p type="p">3:用於要被氯化的烯烴的的一供給部，具體而言為乙烯</p>
        <p type="p">4:上升管</p>
        <p type="p">5:上升區</p>
        <p type="p">6:落下區</p>
        <p type="p">7:用於部分氯化烷烴的第一排出部</p>
        <p type="p">8:洩壓閥</p>
        <p type="p">9:相分離容器</p>
        <p type="p">10:部分氯化烷烴的氣態第二子流</p>
        <p type="p">11:壓力控制閥</p>
        <p type="p">12:高沸點管柱</p>
        <p type="p">13:用於部分氯化烷烴的液態第一子流的排出部</p>
        <p type="p">14:用於熱回收的散熱器，選擇性的</p>
        <p type="p">15:冷卻器</p>
        <p type="p">16:混合裝置，具體而言為液體噴射氣體壓縮器</p>
        <p type="p">17:部分氯化烷烴的液態第一子流</p>
        <p type="p">17a:用於返回反應器的子流的支流</p>
        <p type="p">18:幫浦</p>
        <p type="p">19:用於氣態、部分氯化烷烴的排出部</p>
        <p type="p">20:熱交換器</p>
        <p type="p">21:用於冷凝的部分氯化烷烴的供給部</p>
        <p type="p">22:儲存槽</p>
        <p type="p">23:EDC冷凝幫浦</p>
        <p type="p">24:高沸點管柱的第二子流</p>
        <p type="p">25:高沸點管柱的集液槽幫浦</p>
        <p type="p">26:來自高沸點管柱的頭部流，以蒸氣形式</p>
        <p type="p">27:用於部分氯化烷烴的產物冷凝器</p>
        <p type="p">28:用於高沸點管柱的返回槽</p>
        <p type="p">29:返回幫浦</p>
        <p type="p">30:冷凝的部分氯化烷烴的第一子流</p>
        <p type="p">31:冷凝的部分氯化烷烴的第二子流</p>
        <p type="p">32:汽提塔</p>
        <p type="p">33:部分氯化烷烴的純化流</p>
        <p type="p">34:汽提塔的集液槽幫浦</p>
        <p type="p">35:汽提塔的再循環蒸發器</p>
        <p type="p">36:用於惰性氣體的供給部</p>
        <p type="p">37:汽提器頭部流，以蒸氣形式</p>
        <p type="p">38:冷凝器</p>
        <p type="p">39:低溫冷凍器</p>
        <p type="p">40:來自冷凝貯藏器的排出氣體流</p>
        <p type="p">41:用於惰性氣體的供給裝置</p>
        <p type="p">42:汽提器頭部冷凝貯藏器</p>
        <p type="p">43:汽提器頭部冷凝幫浦</p>
        <p type="p">44:用於非冷凝產物的排出選項</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2130" publication-number="202617112">
    <tif-files tif-type="multi-tif">
      <tif file="114134637.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸收性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61F13/15</main-classification>
        <further-classification edition="200601120260202B">A61F13/511</further-classification>
        <further-classification edition="200601120260202B">A61F13/532</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大王製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIO PAPER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊東莉菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, RINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>與那霸獎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONAHA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田芽依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吸收性物品，具有不透液性的背片、及被配置於前述背片的肌膚側之肌膚側構造部；前述肌膚側構造部，包含被直接配置於前述背片的肌膚側之吸收體部、及被配置於前述吸收體部的肌膚側之透液性的頂片；該吸收性物品具有由前述背片與前述肌膚側構造部沒有被固定而成的非固定區域，在前述非固定區域中，前述背片與前述肌膚側構造部可相對滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸收性物品</p>
        <p type="p">3:頂片</p>
        <p type="p">4:吸收體部</p>
        <p type="p">7:側片</p>
        <p type="p">8:黏接劑</p>
        <p type="p">8a:側部黏接劑</p>
        <p type="p">8b:本體黏接劑</p>
        <p type="p">9b:本體用防偏移部(防偏移部)</p>
        <p type="p">9w:翼用防偏移部</p>
        <p type="p">21:固定區域</p>
        <p type="p">25:非固定區域</p>
        <p type="p">A:易變形區域的橫方向的長度</p>
        <p type="p">bd:吸收性物品本體(本體)</p>
        <p type="p">C:中央區域</p>
        <p type="p">CL:前後方向中心線</p>
        <p type="p">D1:前後方向(長邊方向)</p>
        <p type="p">D2:橫方向(短邊方向)</p>
        <p type="p">F:前方區域</p>
        <p type="p">k:長度</p>
        <p type="p">Q:體液排出口對向部</p>
        <p type="p">R:後方區域</p>
        <p type="p">wg:翼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2131" publication-number="202617920">
    <tif-files tif-type="multi-tif">
      <tif file="114134653.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱性複合矽氧橡膠片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C09K5/02</main-classification>
        <further-classification edition="200601120260129B">C01B33/16</further-classification>
        <further-classification edition="201801120260129B">C09J7/38</further-classification>
        <further-classification edition="200601120260129B">C08L83/05</further-classification>
        <further-classification edition="200601120260129B">C08L83/14</further-classification>
        <further-classification edition="201801120260129B">C08K3/014</further-classification>
        <further-classification edition="200601120260129B">B32B25/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤晃洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村一晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, ISSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋皓大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>依田昌弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YODA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種導熱性複合矽氧橡膠片，其特徵在於，具有：導熱性矽氧橡膠片；及熱軟化性矽氧凝膠層，其配置於該導熱性矽氧橡膠片的單面或兩面，厚度為5～100μm，且70℃時的絕對黏度為5～1000Pa･s；使用焊料糊黏著力試驗器並藉由定壓侵入方式所測得的前述熱軟化性矽氧凝膠層的黏力為0.098N以上。藉此，提供一種導熱性複合矽氧橡膠片，其熱阻較低，能夠藉由瞬間接觸顯現黏著性，並且保管時抑制黏著力下降，因此保管性優異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2132" publication-number="202617908">
    <tif-files tif-type="multi-tif">
      <tif file="114134654.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617908</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蓄電元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260202B">C09J7/25</main-classification>
        <further-classification edition="200601120260202B">C09J133/08</further-classification>
        <further-classification edition="200601120260202B">C09J11/06</further-classification>
        <further-classification edition="200601120260202B">C09J11/08</further-classification>
        <further-classification edition="201001120260202B">H01M10/0587</further-classification>
        <further-classification edition="202101120260202B">H01M50/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田実桜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, MIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松﨑悠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAKI, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種蓄電元件，其具備黏著帶，該黏著帶係可用於電極構件之捲繞固定者，該黏著帶於高溫下(例如，200℃～300℃)亦發揮充分之黏著力，且尺寸變化受到抑制而耐熱性優異。  &lt;br/&gt;本發明之實施方式之蓄電元件包含捲繞複數個薄膜電極所構成之捲繞體、將該捲繞體捲繞固定之黏著帶、及電解液，該黏著帶具備基材、及配置於該基材之至少單側之黏著劑層，該基材包含聚苯硫醚，該黏著劑層包含作為基礎聚合物之丙烯酸系聚合物、異氰酸酯系交聯劑、及黏著賦予樹脂，該丙烯酸系聚合物包含特定量之來自C5-15丙烯酸單體之結構單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基材</p>
        <p type="p">20:黏著劑層</p>
        <p type="p">100:黏著帶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2133" publication-number="202617542">
    <tif-files tif-type="multi-tif">
      <tif file="114134709.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>面板收納容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B65D85/86</main-classification>
        <further-classification edition="200601120251201B">B65D81/02</further-classification>
        <further-classification edition="200601120251201B">H01L21/673</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越聚合物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU POLYMER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大貫和正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONUKI, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種面板收納容器，其能降低面板損壞的可能性。面板收納容器包括：容器主體，劃定用於收納多張面板的內部空間；以及支承機構，設置在內部空間，並且用於支承多張面板，支承機構具備：軸，在前後方向上延伸且用於支承多張面板中的一張面板，軸的後端部固定於容器主體；以及振動抑制部件，設置在軸的前端部，並且抑制軸的振動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">61:支承部件</p>
        <p type="p">61a:軸</p>
        <p type="p">61b:彈性體</p>
        <p type="p">61c:振動抑制部件</p>
        <p type="p">70:殼體</p>
        <p type="p">71:殼體主體</p>
        <p type="p">72:蓋部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2134" publication-number="202617826">
    <tif-files tif-type="multi-tif">
      <tif file="114134717.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title>RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G63/199</main-classification>
        <further-classification edition="200601120260202B">C08L67/02</further-classification>
        <further-classification edition="200601120260202B">C08K5/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亥里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAE-RI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG-GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慎鏞埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YONG-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SE-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種樹脂組成物，其中塑化劑之遷移現象減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a resin composition in which the migration phenomenon of a plasticizer is reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2135" publication-number="202618911">
    <tif-files tif-type="multi-tif">
      <tif file="114134735.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱導性化學機械拋光(CMP)墊</chinese-title>
        <english-title>THERMALLY CONDUCTIVE CHEMICAL MECHANICAL POLISHING (CMP) PAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L21/304</main-classification>
        <further-classification edition="201201120260130B">B24B37/24</further-classification>
        <further-classification edition="200601120260130B">C08L75/04</further-classification>
        <further-classification edition="200601120260130B">C08K3/04</further-classification>
        <further-classification edition="200601120260130B">B24D18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商崇碩科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXUS TECHNOLOGY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇格瑞　約翰　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUGRUE, JOHN KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致豫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示熱導性化學機械拋光(CMP)墊。在一態樣中，用於CMP系統之拋光墊包含具有拋光晶圓性質之至少一種第一材料及經配置以提高該拋光墊之熱傳遞係數(HTC)之至少一種第二材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Thermally conductive chemical mechanical polishing (CMP) pads are disclosed. In one aspect, a polishing pad for a CMP system includes at least one first material having properties for polishing a wafer and at least one second material configured to increase a heat transfer coefficient (HTC) of the polishing pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:拋光墊</p>
        <p type="p">150:基材載體/冷卻平臺</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2136" publication-number="202618367">
    <tif-files tif-type="multi-tif">
      <tif file="114134739.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鏡頭組件</chinese-title>
        <english-title>LENS ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120251113B">G02B7/00</main-classification>
        <further-classification edition="202101120251113B">G02B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐寅燾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, IN DO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁東晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DONG SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透鏡組件包括透鏡，其包括折射光線的光學部，以及沿著光學部的周邊延伸的凸緣部、墊片在光軸方向上與凸緣部接觸，以及容納透鏡和墊片的透鏡鏡筒。從光軸到凸緣部和墊片之間的接觸點的距離小於光學部的最大半徑。光學部的周邊包括邊緣部和連接部。在透過光軸和連接部的橫截面視圖中，透鏡與墊片間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens assembly includes a lens including an optical portion refracting light, and a flange portion extending along a periphery of the optical portion, a spacer in contact with the flange portion in an optical axis direction, and a lens barrel accommodating the lens and the spacer. A distance from an optical axis to a contact point between the flange portion and the spacer is less than a maximum radius of the optical portion. The periphery of the optical portion includes an edge portion and a connection portion. In a cross-sectional view passing through the optical axis and the connection portion, the lens is spaced apart from the spacer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學部</p>
        <p type="p">300:透鏡鏡筒</p>
        <p type="p">1000:透鏡組件</p>
        <p type="p">DA:對角軸</p>
        <p type="p">I-I'、II-II'、III-III':線</p>
        <p type="p">LA:長軸</p>
        <p type="p">OA:光軸方向</p>
        <p type="p">RT:固定器</p>
        <p type="p">SA:短軸</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2137" publication-number="202618255">
    <tif-files tif-type="multi-tif">
      <tif file="114134799.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134799</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵合晶圓的檢測方法及裝置</chinese-title>
        <english-title>BONDED WAFER INSPECTION METHOD AND DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G01N21/88</main-classification>
        <further-classification edition="200601120260128B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>匈牙利商瑟米萊半導體物理實驗公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMILAB SEMICONDUCTOR PHYSICS LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科瓦克斯　佐爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOVACS, ZSOLT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯瓦克思　左爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOVACS, ZSOLT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基斯　佐爾坦塔馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISS, ZOLTAN TAMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種用於偵測鍵合晶圓（BW）缺陷的鍵合晶圓檢測方法及裝置。待檢測的鍵合晶圓（BW）具有前表面和後表面，該方法包括：產生具有一偏振狀態和一傳播方向的照明光，該照明光的一波長位於一紅外範圍內，使得在該前表面與該後表面的至少一個的一方向上，該鍵合晶圓（BW）在該鍵合晶圓（BW）內的該傳播方向的至少一部分上對該照明光保持透明，將該照明光從其中該鍵合晶圓對該照明光為透明的該方向引導至該鍵合晶圓（BW），該傳播方向實質垂直於該前表面與該後表面的至少一個，使該照明光的至少一第一部分進入該鍵合晶圓(BW)，從而在鍵合晶圓(BW)內誘導該照明光的該第一部分的至少一部分反射以產生反射光，收集該反射光的一部分，並根據該偏振狀態對該收集到的反射光進行濾波，以獲得偏振濾波後的反射光，將該偏振濾光後的反射光引導至一偵測器，透過該偵測器偵測該偏振濾光後的反射光，基於該偵測的偏振濾光後的反射光產生一影像，基於該影像，識別該鍵合晶圓（BW）中存在機械應力誘導雙折射的至少一個區域，基於該識別出的至少一個區域，偵測該鍵合晶圓（BW）中的該缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonded wafer inspection method and device for detecting a defect in a bonded wafer (BW) are disclosed. The bonded wafer (BW) to be inspected has a front face and a back face, and the method comprises: producing illumination light with a polarization state and a propagation direction, the illumination light having a wavelength in an infrared range at which the bonded wafer (BW) is transparent from a direction of at least one of the front face and the back face along at least a portion of the propagation direction within said bonded wafer (BW), guiding said illumination light to the bonded wafer (BW) from the direction in which the bonded wafer is transparent to the illumination light, the propagation direction being substantially perpendicular to at least one of the front face and the back face, making at least a first portion of the illumination light to enter the bonded wafer (BW), thereby inducing reflection of at least a portion of said first portion of the illumination light in the bonded wafer (BW) to create reflected light, collecting a portion of the reflected light and filtering said collected reflected light based on the polarization state to obtain polarization-filtered reflected light, guiding the polarization-filtered reflected light to a detector, detecting said polarization-filtered reflected light by the detector, creating an image from said detected polarization-filtered reflected light, based on the image, identifying at least one region in the bonded wafer (BW) having mechanical stress induced birefringence, based on the at least one region identified, detecting the defect in the bonded wafer (BW).</p>
      </isu-abst>
      <representative-img>
        <p type="p">BW:鍵合晶圓</p>
        <p type="p">H:晶圓托架</p>
        <p type="p">11:主光源</p>
        <p type="p">12:照明光學系統</p>
        <p type="p">13:第一偏振片</p>
        <p type="p">14:分束器</p>
        <p type="p">15:延遲器</p>
        <p type="p">16:物鏡托架</p>
        <p type="p">17a:第一物鏡</p>
        <p type="p">17b:第二物鏡</p>
        <p type="p">17c:第三物鏡</p>
        <p type="p">18:第二偏振片</p>
        <p type="p">19:成像光學系統</p>
        <p type="p">20:攝影機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2138" publication-number="202617886">
    <tif-files tif-type="multi-tif">
      <tif file="114134843.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617886</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明阻燃性雙軸延伸樹脂片、及其成形品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C08L83/06</main-classification>
        <further-classification edition="200601120260127B">B29C51/04</further-classification>
        <further-classification edition="200601120260127B">B32B27/30</further-classification>
        <further-classification edition="201901120260127B">B32B7/035</further-classification>
        <further-classification edition="200601120260127B">C07C21/073</further-classification>
        <further-classification edition="200601120260127B">C08J5/22</further-classification>
        <further-classification edition="201601120260127B">H01M8/0217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＦＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新谷精豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINYA, SEIHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中亮大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野晋吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤嘉久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種剛性、韌性優異且兼具透明性與優異的阻燃性之透明阻燃性雙軸延伸樹脂片及其成形品。&lt;br/&gt;  本發明是一種透明阻燃性雙軸延伸樹脂片，其特徵在於，具有以下結構：在將複數片雙軸延伸聚丙烯片加以積層、熱熔接而成的厚度0.1mm～6mm的雙軸延伸透明樹脂片(L)的至少一方的表面塗佈底漆，進一步形成透明軟質矽氧樹脂層(α)。本發明之透明阻燃性雙軸延伸樹脂片可用作鈣鈦礦太陽電池用的透明支架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">L:雙軸延伸透明樹脂片</p>
        <p type="p">α:透明軟質矽氧樹脂層</p>
        <p type="p">β:底漆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2139" publication-number="202617586">
    <tif-files tif-type="multi-tif">
      <tif file="114134854.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>方法及設備</chinese-title>
        <english-title>PROCESS AND PLANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">C01B3/04</main-classification>
        <further-classification edition="200601120260120B">C01B3/30</further-classification>
        <further-classification edition="200601120260120B">C10G49/04</further-classification>
        <further-classification edition="200601120260120B">C10G49/18</further-classification>
        <further-classification edition="202301120260120B">C02F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商強生瑪西大維科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON MATTHEY DAVY TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克法蘭　凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCFARLANE, KATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯威尼　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWINNEY, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃頓　麥可　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTON, MICHAEL JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於催化裂解液氨原料以產生裂解氣體流之方法，其包括以下步驟：i)藉由與液體熱交換介質熱交換來將該液氨原料加熱至中間溫度以產生經冷却之液體熱交換介質；及ii)使用該經冷却之液體熱交換介質來為一或多個下游製程提供冷却。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for the catalytic cracking of a liquid ammonia feedstock to produce a cracked gas stream, comprising the steps of i) heating the liquid ammonia feedstock to an intermediate temperature by heat exchange with a liquid heat exchange medium to produce a cooled liquid heat exchange medium; and ii) using the cooled liquid heat exchange medium to provide cooling to one or more downstream processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液態氨</p>
        <p type="p">20a:預加熱器</p>
        <p type="p">20b:加熱構件</p>
        <p type="p">30:氨裂解反應器</p>
        <p type="p">31:熱交換器</p>
        <p type="p">32:熱交換器</p>
        <p type="p">40:冷却/冷却器</p>
        <p type="p">50:氨洗滌系統</p>
        <p type="p">60:儲存槽</p>
        <p type="p">70:蒸餾系統</p>
        <p type="p">80:冷却器</p>
        <p type="p">90:變壓吸附裝置</p>
        <p type="p">95:壓縮</p>
        <p type="p">201a:氨原料流</p>
        <p type="p">201b:氨原料流</p>
        <p type="p">202a:液體熱交換介質</p>
        <p type="p">202b:液體熱交換介質</p>
        <p type="p">202c:液體熱交換介質</p>
        <p type="p">203:熱煙道氣</p>
        <p type="p">204:純氫流</p>
        <p type="p">205:尾氣</p>
        <p type="p">206:富氨流</p>
        <p type="p">207:重級分</p>
        <p type="p">208:富水流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2140" publication-number="202619151">
    <tif-files tif-type="multi-tif">
      <tif file="114134857.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134857</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池組及包含其的載具</chinese-title>
        <english-title>BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260130B">H01M50/503</main-classification>
        <further-classification edition="202101120260130B">H01M50/509</further-classification>
        <further-classification edition="201901120260130B">B60L50/60</further-classification>
        <further-classification edition="200601120260130B">H01M10/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庸鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋鐘珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JONG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鐘善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONG-SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安埈永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, JUN-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭義澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, EUI-CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭仁赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, IN-HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭渽勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, JAE-HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺龍赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG-HYUCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鎭浯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN-OH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種透過改善電流偏差而具有改良的使用壽命的電池組。電池組包括多個電池單體；以及匯流排組件，匯流排組件在多個電池單體的一側與多個電池單體電連接並形成為具有預定寬度和預定角度中的至少一者，預定寬度和預定角度被預設以實現多個電池單體之間的均勻電流分佈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a battery pack having an improved lifespan by improving current deviation. The battery pack includes a plurality of battery cells; and a bus bar assembly electrically connected to the plurality of battery cells at one side of the plurality of battery cells and formed to have at least one of a predetermined width and a predetermined angle that are preset to enable uniform current distribution among the plurality of battery cells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電池組</p>
        <p type="p">10:電池單體</p>
        <p type="p">12:電極、第一電極、正電極</p>
        <p type="p">14:電極、第二電極、負電極</p>
        <p type="p">50:匯流排組件</p>
        <p type="p">70:冷卻管</p>
        <p type="p">100:雙向連接匯流排</p>
        <p type="p">900:單向連接匯流排</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2141" publication-number="202617891">
    <tif-files tif-type="multi-tif">
      <tif file="114134884.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08L101/08</main-classification>
        <further-classification edition="200601120260202B">C08K5/1515</further-classification>
        <further-classification edition="200601120260202B">C08K5/17</further-classification>
        <further-classification edition="200601120260202B">G02B5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本觸媒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>持松拓途</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIMATSU, TAKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物，其含有具有酯鍵且玻璃轉移溫度為80℃以上之熱塑性樹脂(A)、環氧化合物(B)、以及沸點為100℃以上之溶劑(C)，且前述熱塑性樹脂(A)與前述環氧化合物(B)之質量比((A)/(B))為5以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2142" publication-number="202617436">
    <tif-files tif-type="multi-tif">
      <tif file="114134893.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134893</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜、膜之製造方法、偏光板、液晶顯示器及圖像顯示裝置模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B32B27/20</main-classification>
        <further-classification edition="200601120260202B">B32B27/30</further-classification>
        <further-classification edition="200601120260202B">B32B3/30</further-classification>
        <further-classification edition="201901120260202B">B32B7/023</further-classification>
        <further-classification edition="201501120260202B">G02B1/111</further-classification>
        <further-classification edition="201501120260202B">G02B1/14</further-classification>
        <further-classification edition="200601120260202B">G02B5/30</further-classification>
        <further-classification edition="200601120260202B">G02F1/1335</further-classification>
        <further-classification edition="200601120260202B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮宅潤一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKE, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤嘉秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YOSHIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種膜，其即便為單層硬化膜亦發揮優異之透明性與優異之防眩性，此外還發揮優異之耐擦傷性。本發明之膜具有透明基材與設置於上述透明基材表面之硬化膜，硬化膜為硬化性組合物之硬化物，硬化性組合物至少含有二官能(甲基)丙烯酸酯與三官能以上之(甲基)丙烯酸酯，三官能以上之(甲基)丙烯酸酯之比率相對於硬化性組合物之不揮發成分之總質量為50質量%以上，硬化膜之表面形成有不規則之褶皺狀凹凸結構，塗膜面之均方根斜率Sdq未達0.3，塗膜面之展開界面面積率Sdr為3.0%以下，膜之霧度為60%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜</p>
        <p type="p">2:透明基材</p>
        <p type="p">3:硬化膜</p>
        <p type="p">2a:硬化膜之表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2143" publication-number="202617935">
    <tif-files tif-type="multi-tif">
      <tif file="114134894.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134894</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移除金屬氧化物之組合物、相關系統及相關方法</chinese-title>
        <english-title>COMPOSITIONS, RELATED SYSTEMS, AND RELATED METHODS OF REMOVING METAL OXIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K13/08</main-classification>
        <further-classification edition="200601120260202B">H01L21/311</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳幸臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSING-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖明吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊閔傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於自結構移除金屬氧化物之組合物、相關系統及方法。該組合物包含基於該組合物之總重量計10重量%至25重量%之氟化銨。該組合物包含基於該組合物之總重量計0.1重量%至1重量%之氟化氫。該組合物包含基於該組合物之總重量計0.1重量%至1重量%之氮化物抑制劑。當該組合物接觸包含氮化矽表面及金屬氧化物表面之結構時，該組合物選擇性地蝕刻該金屬氧化物表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Composition, related systems and methods of removing metal oxides from a structure. The composition comprises 10% to 25% by weight of an ammonium fluoride based on a total weight of the composition. The composition comprises 0.1% to 1% by weight of a hydrogen fluoride based on a total weight of the composition. The composition comprises 0.1% to 1% by weight of a nitride inhibitor based on a total weight of the composition. When the composition contacts a structure comprising a silicon nitride surface and a metal oxide surface, the composition selectively etches the metal oxide surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自結構移除金屬氧化物之方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2144" publication-number="202617683">
    <tif-files tif-type="multi-tif">
      <tif file="114134917.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抑制圖案塌陷之組成物、製造圖案之方法及製造裝置之方法</chinese-title>
        <english-title>PATTERN COLLAPSE INHIBITING COMPOSITION, METHOD FOR PRODUCING PATTERN, AND METHOD FOR MANUFACTURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C251/38</main-classification>
        <further-classification edition="200601120260202B">C07C251/42</further-classification>
        <further-classification edition="200601120260202B">F26B3/18</further-classification>
        <further-classification edition="200601120260202B">F26B5/04</further-classification>
        <further-classification edition="200601120260202B">G03F7/40</further-classification>
        <further-classification edition="200601120260202B">H01L21/306</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商默克專利有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保有輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長原達郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAHARA, TATSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[問題]提供一種抑制圖案塌陷之組成物及使用該抑制圖案塌陷之組成物來製造圖案之方法。&lt;br/&gt;  [解決方案]一種抑制圖案塌陷之組成物，其包含一固化組分(A)及一溶劑(B)，其中該固化組分(A)係二環丙基酮肟、2,2,4,4-四甲基-3-戊酮肟或其混合物。該抑制圖案塌陷之組成物係一種高功能性材料，其可使用在奈米技術製程之半導體裝置製造製程中，例如，用來控制在基材上形成之液晶、量子點或OLED顯示器的半導體裝置製造製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem] To provide a pattern collapse inhibiting composition and a method for producing a pattern using the pattern collapse inhibiting composition.&lt;br/&gt; [Solution] A pattern collapse inhibiting composition comprising a solidifying component (A) and a solvent (B), wherein the solidifying component (A) is dicyclopropylketone oxime, 2,2,4,4-tetramethyl-3-pentanone oxime, or a mixture thereof. The pattern collapse inhibiting composition is a highly functional material that can be used in a semiconductor device production process of a nanotechnology process, for example, a semiconductor device production process for controlling a liquid crystal, quantum dot, or OLED display formed on a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">1A:基材圖案</p>
        <p type="p">2:感光性樹脂層(光阻膜)</p>
        <p type="p">2A:光阻圖案</p>
        <p type="p">3:顯影劑</p>
        <p type="p">4:抑制圖案塌陷之組成物(嵌入液體)</p>
        <p type="p">4A:固相(包括固化組分(A)的嵌入膜)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2145" publication-number="202617579">
    <tif-files tif-type="multi-tif">
      <tif file="114134932.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134932</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送車</chinese-title>
        <english-title>TRANSPORT VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">B66F5/04</main-classification>
        <further-classification edition="200601120260122B">B66F9/12</further-classification>
        <further-classification edition="200601120260122B">B66F9/20</further-classification>
        <further-classification edition="202401120260122B">G05D1/241</further-classification>
        <further-classification edition="202401120260122B">G05D1/243</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉永和治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINAGA, KAZUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村和誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KAZUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田晃大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是容易避免被叉件所支撐的托板接觸障礙物感測器之搬送車，在搬送車中，叉件1是配置成從升降裝置2朝向後側D2突出，車體3具備：本體部31，支撐行走驅動裝置；及一對腳部32，相對於叉件1的升降軌跡在寬度方向的兩側中，配置成從本體部31朝向後側D2突出，第1障礙物感測器91A是配置成從一對腳部32的其中一者即第1腳部32A的上表面突出，第2障礙物感測器91B是配置成從一對腳部32的另一者即第2腳部32B的上表面突出，第1障礙物感測器91A及第2障礙物感測器91B是配置成在沿著寬度方向W的寬度方向視角下與升降裝置2重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:叉件</p>
        <p type="p">2:升降裝置</p>
        <p type="p">3:車體</p>
        <p type="p">31:本體部</p>
        <p type="p">32:腳部</p>
        <p type="p">32A:第1腳部</p>
        <p type="p">32B:第2腳部</p>
        <p type="p">33:罩蓋</p>
        <p type="p">91A:第1障礙物感測器</p>
        <p type="p">91B:第2障礙物感測器</p>
        <p type="p">94:第1托板檢測感測器(托板檢測感測器)</p>
        <p type="p">95:第2托板檢測感測器</p>
        <p type="p">96:第3托板檢測感測器</p>
        <p type="p">97:第1衝撞偵測感測器</p>
        <p type="p">98:第2衝撞偵測感測器</p>
        <p type="p">951:第1止擋件</p>
        <p type="p">952:第1微動開關</p>
        <p type="p">961:第2止擋件</p>
        <p type="p">962:第2微動開關</p>
        <p type="p">B:雷射光</p>
        <p type="p">D:前後方向</p>
        <p type="p">D1:前側</p>
        <p type="p">D2:後側</p>
        <p type="p">S1:第1檢測面(檢測面)</p>
        <p type="p">W:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2146" publication-number="202617263">
    <tif-files tif-type="multi-tif">
      <tif file="114134940.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調濕液、調濕液的製造方法、調濕方法及調濕裝置</chinese-title>
        <english-title>LIQUID DESICCANT SOLUTION, METHOD FOR PRODUCING THE SAME, HUMIDITY CONTROL METHOD, AND HUMIDITY CONTROL APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B01J20/04</main-classification>
        <further-classification edition="200601120260202B">B01J20/22</further-classification>
        <further-classification edition="200601120260202B">B01J20/28</further-classification>
        <further-classification edition="200601120260202B">B01D53/26</further-classification>
        <further-classification edition="200601120260202B">B01D53/28</further-classification>
        <further-classification edition="200601120260202B">F24F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大能空調股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DYNA-AIR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田政利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三上芳宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKAMI, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包括氯化鋰、水、水溶性防鏽劑及離子液體的調濕液。一種調濕液的製造方法，包括：藉由將包括離子液體及水的離子液體水溶液與水溶性防鏽劑混合，以調製添加劑的步驟；以及將包括氯化鋰及水的氯化鋰水溶液與該添加劑混合的步驟。以及一種包括用以使該調濕液與空氣接觸的調濕部之調濕裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A humidity control liquid includes lithium chloride, water, a water-soluble rust inhibitor, and an ionic liquid. A method for manufacturing the humidity control liquid includes: preparing an additive by mixing an ionic liquid aqueous solution including an ionic liquid and water with the water-soluble rust inhibitor; and mixing the additive with a lithium chloride aqueous solution including lithium chloride and water. A humidity control liquid device includes a humidity control portion for contacting the humidity control liquid with air.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液體除濕空調機</p>
        <p type="p">20:處理機</p>
        <p type="p">21:空氣取入口</p>
        <p type="p">22:排氣口</p>
        <p type="p">23:調濕液</p>
        <p type="p">24:氣液接觸器</p>
        <p type="p">25:調濕液排出口</p>
        <p type="p">26:調濕液供應口</p>
        <p type="p">30:再生機</p>
        <p type="p">31:空氣取入口</p>
        <p type="p">32:排氣口</p>
        <p type="p">33:調濕液</p>
        <p type="p">34:氣液接觸器</p>
        <p type="p">35:調濕液排出口</p>
        <p type="p">36:調濕液供應口</p>
        <p type="p">41:熱交換器</p>
        <p type="p">42:熱泵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2147" publication-number="202617852">
    <tif-files tif-type="multi-tif">
      <tif file="114134942.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體材料、其製備方法及使用其來製備對苯二甲酸之方法</chinese-title>
        <english-title>LIQUID MATERIAL, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING TEREPHTHALIC ACID USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08J11/24</main-classification>
        <further-classification edition="200601120260202B">C07C51/087</further-classification>
        <further-classification edition="200601120260202B">C07C63/26</further-classification>
        <further-classification edition="200601120260202B">C07C67/03</further-classification>
        <further-classification edition="200601120260202B">C07C69/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜淍植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JU-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴真姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIN-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安秀彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張有美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡熙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HEE-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種液體原料、其製備方法及使用其來製備對苯二甲酸的方法。液體原料係經由廢棄聚酯的醇解來獲得且包含特定化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a liquid raw material, to a process for preparing the same, and to a process for preparing terephthalic acid using the same. The liquid raw material is obtained through alcoholysis of waste polyester and comprises specific compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2148" publication-number="202617056">
    <tif-files tif-type="multi-tif">
      <tif file="114134977.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視覺矯正模擬工具</chinese-title>
        <english-title>VISION CORRECTION SIMULATION TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A61B3/028</main-classification>
        <further-classification edition="200601120260130B">A61B3/08</further-classification>
        <further-classification edition="201101120260130B">G06T19/00</further-classification>
        <further-classification edition="200601120260130B">G02C7/04</further-classification>
        <further-classification edition="200601120260130B">A61F2/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商壯生和壯生視覺關懷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>契哈布　哈里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEHAB, KHALED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾凱寧　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARKKAINEN, THOMAS R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南基維爾　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANKIVIL, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾頓　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILTON, ANDREW PAUL FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包恩　理查德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWN, RICHARD THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個一般態樣中，方法可包括接收複數個影像集。該等影像集中之至少一者可包括版本集。該版本集中之至少一者可對應於一隱形眼鏡、人工水晶體(IOL)、及/或漸進式附加鏡片(PAL)之至少一種光學屬性。該版本集中之該至少一者可包括一影像對。該影像對可包括一左眼影像及一右眼影像。方法可包括接收隱形眼鏡、IOL、或PAL資訊之一指示。該隱形眼鏡、IOL、或PAL資訊可包括該至少一種光學屬性。方法可包括使該左眼影像呈現給使用者之一左眼。方法可包括使該右眼影像呈現給該使用者之一右眼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one general aspect, methods may include receiving a plurality of image sets. At least one of the image sets may include a set of versions. At least one of the set of versions may correspond to at least one optical attribute of a contact lens, interocular lens (IOL), and/or progressive addition lens (PAL). The at least one of the set of versions may include an image pair. The image pair may include a left eye image and a right eye image. Methods may include receiving an indication of contact lens, IOL, or PAL information. The contact lens, IOL, or PAL information may include the at least one optical attribute. Methods may include causing the left eye image to be presented to a left eye of the user. Methods may include causing the right eye image to be presented to a right eye of the user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:頭戴式裝置</p>
        <p type="p">310:使用者的面部</p>
        <p type="p">320:左眼孔徑</p>
        <p type="p">330:右眼孔徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2149" publication-number="202618013">
    <tif-files tif-type="multi-tif">
      <tif file="114135030.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>麻田散鐵系不鏽鋼鋼板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C22C38/00</main-classification>
        <further-classification edition="200601120260102B">C22C38/18</further-classification>
        <further-classification edition="200601120260102B">C22C38/38</further-classification>
        <further-classification edition="200601120260102B">C21D6/00</further-classification>
        <further-classification edition="200601120260102B">C21D8/02</further-classification>
        <further-classification edition="200601120260102B">C21D9/46</further-classification>
        <further-classification edition="200601120260102B">B21B3/02</further-classification>
        <further-classification edition="200601120260102B">F16D65/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>束村基行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAMURA, MOTOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供不需要淬火處理，而可適用於各種二輪機車之碟式煞車素材鋼板的不鏽鋼鋼板。適當地控制成分組成，並將組織平衡指標F控制於100~250範圍內，晶粒內平均方位差：1°以下且將粒徑：50μm以下的肥粒鐵粒面積分率設為0.01~50.00%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2150" publication-number="202617834">
    <tif-files tif-type="multi-tif">
      <tif file="114135040.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶配向劑、液晶配向膜及其製造方法、液晶元件以及聚合物組成物</chinese-title>
        <english-title>LIQUID CRYSTAL ALIGNING AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND METHOD FOR PRODUCING THE SAME, LIQUID CRYSTAL DEVICE, AND POLYMER COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C08G73/10</main-classification>
        <further-classification edition="200601120251103B">C08L79/08</further-classification>
        <further-classification edition="200601120251103B">C08K5/07</further-classification>
        <further-classification edition="200601120251103B">C08K5/098</further-classification>
        <further-classification edition="200601120251103B">C08K5/17</further-classification>
        <further-classification edition="200601120251103B">C08K5/3437</further-classification>
        <further-classification edition="200601120251103B">C08J5/18</further-classification>
        <further-classification edition="200601120251103B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石部徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIBE, TOORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種液晶配向劑，其可獲得在顯示出良好的液晶配向性的同時，電壓保持率及力學特性優異的液晶元件。一種液晶配向劑，其含有聚合物成分以及金屬錯合物，所述金屬錯合物由包含與鋁、鋯及鈦不同的元素的金屬離子、及配位子形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2151" publication-number="202618017">
    <tif-files tif-type="multi-tif">
      <tif file="114135056.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>真空沉積系統及在真空沉積系統中塗覆基板的方法</chinese-title>
        <english-title>VACUUM DEPOSITION SYSTEM AND METHOD OF COATING SUBSTRATES IN A VACUUM DEPOSITION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C23C14/24</main-classification>
        <further-classification edition="200601120260123B">C23C14/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈格迪什　阿維納什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAGADISH, AVINASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>ＰＪ　吉里什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>P J, GIRISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博斯基　蘇哈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHOSKI, SUHAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種腔室組件。該腔室組件包括：第一真空腔室，提供具有第一導軌的第一真空區域，並擁有帶有第一凹槽的第一背壁；第二真空腔室，提供與第一真空區域分開的第二真空區域，並擁有帶有第二凹槽的第二背壁，第二背壁面向第一背壁；以及一或多個肋件結構，設置在第一凹槽和第二凹槽中以及第一真空區域和第二真空區域之外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chamber assembly is described. The chamber assembly includes a first vacuum chamber providing a first vacuum region with a first track and having a first back wall with a first recess; a second vacuum chamber providing a second vacuum region with a second track separated from the first vacuum region, and having a second back wall with a second recess, the second back wall facing the first back wall; and one or more rib structures provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:虛線</p>
        <p type="p">100:腔室組件</p>
        <p type="p">100a:第一真空腔室</p>
        <p type="p">100b:第二真空腔室</p>
        <p type="p">201:主體</p>
        <p type="p">202:背壁</p>
        <p type="p">203:真空區域</p>
        <p type="p">204:凹槽</p>
        <p type="p">206:肋件結構</p>
        <p type="p">208:外肋件結構</p>
        <p type="p">212:真空區域的中央區域</p>
        <p type="p">213:入口區域</p>
        <p type="p">214:出口區域</p>
        <p type="p">224:開口</p>
        <p type="p">226:開口</p>
        <p type="p">A:部分</p>
        <p type="p">w1:寬度</p>
        <p type="p">w2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2152" publication-number="202618060">
    <tif-files tif-type="multi-tif">
      <tif file="114135062.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有鈀和金之無銀表面塗層</chinese-title>
        <english-title>SILVER FREE SURFACE COATING WITH PALLADIUM AND GOLD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C23C18/44</main-classification>
        <further-classification edition="200601120260202B">A01N25/08</further-classification>
        <further-classification edition="200601120260202B">A01N59/16</further-classification>
        <further-classification edition="200601120260202B">A01P1/00</further-classification>
        <further-classification edition="200601120260202B">A61L2/238</further-classification>
        <further-classification edition="200601120260202B">A61L27/30</further-classification>
        <further-classification edition="200601120260202B">A61L29/10</further-classification>
        <further-classification edition="200601120260202B">A61L29/14</further-classification>
        <further-classification edition="200601120260202B">A61L31/08</further-classification>
        <further-classification edition="200601120260202B">A61L31/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商防菌公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACTIGUARD AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索德瓦爾　比利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SODERVALL, BILLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑切斯　哈維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ, JAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種物件，該物件具有包含鈀和金之粒子之表面塗層，其中該塗層不含銀且不含釹。該等粒子在該表面上之總量是在0.25至1.40 µg/cm&lt;sup&gt;2&lt;/sup&gt;之範圍內，其中金構成該總量之45-60 wt%。該等粒子及該物件之最外面10 µm包含小於30 ppm銀。平均粒子直徑是在20與80 nm之間，且具有100 nm或更大直徑之粒子構成粒子總數之至少2%。該塗層提供生物相容性及抗微生物性兩者，且對於意欲與人類或動物血液接觸之醫療裝置特別有利，此乃因其對抗血液凝固及血栓形成而沒有與銀或釹相關之缺點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object is provided with a surface coating comprising particles of palladium and gold, where the coating is silver-free and neodymium-free. The total amount of the particles on the surface is in the range of 0.25 to 1.40 µg/cm&lt;sup&gt;2&lt;/sup&gt;, with gold constituting 45-60 wt% of the total amount. The particles and the outermost 10 µm of the object comprise less than 30 ppm silver. The mean particle diameter is between 20 and 80 nm, and particles with a diameter of 100 nm or more constitute at least 2% of the total number of particles. The coating provides both biocompatible and antimicrobial properties and is particularly advantageous for medical devices intended for contact with human or animal blood, as it counteracts blood clotting and thrombosis without the disadvantages associated with silver or neodymium.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2153" publication-number="202618473">
    <tif-files tif-type="multi-tif">
      <tif file="114135071.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、資訊處理方法及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">G05B13/04</main-classification>
        <further-classification edition="200601120260120B">G05B17/02</further-classification>
        <further-classification edition="200601120260120B">G06F9/06</further-classification>
        <further-classification edition="202301120260120B">G06N3/08</further-classification>
        <further-classification edition="200601120260120B">H01L21/027</further-classification>
        <further-classification edition="200601120260120B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢﨑雄馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAZAKI, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種實現考慮到具有學習功能之單元特性之基板處理的基板處理裝置、資訊處理方法及電腦程式。  &lt;br/&gt;本發明之基板處理裝置係具備指令值產生部之基板處理裝置，該指令值產生部產生要輸入至基板處理相關之對象單元之指令值，對象單元具有基於所輸入之指令值及與該指令值對應之自身之輸出值來調整應答特性的功能，指令值產生部將對象單元之第1模型記憶於記憶部中，該對象單元之第1模型係基於假定對象單元之應答特性為規定特性所產生之指令值與對象單元根據該指令值所輸出之輸出值之資料而產生者，將對象單元之第2模型記憶於記憶部中，該對象單元之第2模型係基於假定對象單元之應答特性為第1模型之特性所產生之指令值與對象單元根據該指令值所輸出之輸出值之資料而產生，且基於第1模型及第2模型產生向對象單元之指令值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:上位控制單元(上位單元)</p>
        <p type="p">5:下位控制單元(對象單元)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2154" publication-number="202619019">
    <tif-files tif-type="multi-tif">
      <tif file="114135077.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板支撐件</chinese-title>
        <english-title>SUBSTRATE SUPPORT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01L21/683</main-classification>
        <further-classification edition="200601120260120B">H01L21/687</further-classification>
        <further-classification edition="200601120260120B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　仰山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YANG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎班　丹東尼斯　帝朵勒　懷慕斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEMPEN, ANTONIUS THEODORUS WILHELMUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡默　吉傑斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAMER, GIJS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　戴　凡　史蒂芬努斯　科內利斯　萊昂納德斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DE VEN, STEPHANUS CORNELIS LEONARDUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於支撐一基板之基板支撐件。該基板支撐件包含：一主體，其具有一表面；及複數個突出部，其自該主體之該表面突起。該複數個突出部之遠端界定用於一基板之一支撐表面。該基板支撐件亦包含一密封部件，其具有容納該複數個突出部之一大小及/或形狀。該密封部件具可撓性且具有附接至該表面之一固定端及一自由端。當該基板支撐於該基板支撐件上且經受一夾持力時，該密封部件至少部分地安置於該基板支撐件與該基板之間，且該密封部件之該自由端與該基板之底表面之間的一距離小於該主體之該表面與該基板之該底表面之間的一距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate support for supporting a substrate. The substrate support comprises a main body having a surface, and a plurality of projections protruding from the surface of the main body. The distal ends of the plurality of projections define a support surface for a substrate. The substrate support also comprises a seal member of a size and/or shape to accommodate the plurality of projections. The seal member is flexible and has a fixed end attached to the surface and a free end. When the substrate is supported on the substrate support and subject to a clamping force, the seal member is at least partly disposed between the substrate support and the substrate and a distance between the free end of the seal member and the bottom surface of the substrate is smaller than a distance between the surface of the main body and the bottom surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板支撐件</p>
        <p type="p">5:密封部件</p>
        <p type="p">10:主體</p>
        <p type="p">11:上表面/表面</p>
        <p type="p">12:抽取孔口/抽取開口</p>
        <p type="p">20:瘤節/突出部</p>
        <p type="p">40:密封部件</p>
        <p type="p">52:固定端</p>
        <p type="p">55:黏附劑</p>
        <p type="p">E:箭頭</p>
        <p type="p">F:力箭頭</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2155" publication-number="202616972">
    <tif-files tif-type="multi-tif">
      <tif file="114135086.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組裝包括後跟穩定器的鞋面的方法</chinese-title>
        <english-title>METHOD FOR ASSEMBLING A SHOE UPPER COMPRISING A HEEL COUNTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A43B13/28</main-classification>
        <further-classification edition="200601120260130B">A43B13/38</further-classification>
        <further-classification edition="200601120260130B">A43B13/41</further-classification>
        <further-classification edition="200601120260130B">A43B21/00</further-classification>
        <further-classification edition="200601120260130B">A43B23/08</further-classification>
        <further-classification edition="200601120260130B">A43B23/26</further-classification>
        <further-classification edition="200601120260130B">A43D11/00</further-classification>
        <further-classification edition="200601120260130B">A43D8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商迪卡儂公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DECATHLON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑斯　克萊兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENS, CLAIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加塔　芬妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GATTA, FANNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於組裝一鞋面（1）的方法，該鞋面（1）包括一外殼（6）和一內壁（8），該內壁（8）具有一後跟區域（8a），一穩定器（11）佈置在該後跟區域（8a）上，該方法包括以下步驟：在該區域（8a）安裝一鞋舌（14），而形成具有該內壁（8）的一部分的一殼體（15），該殼體可經由一下狹縫（16）進出；在該鞋舌（14）的該內表面上設置一黏合材料，而形成該殼體（15）的該內壁（8）的該部分沒有黏合材料；將一內靴（7）的至少一層（9、10）施加（apply）於該殼（6）上以用於其黏合，留下該縫隙（16）可以自由地進出；將該穩定器（11）的至少一個上部（11b）插入該狹縫（16）中，以將該部分放置在該殼體（15）中，使該穩定器位於該後跟區域（8a）上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for assembling an upper (1) comprising an outer shell (6) with an inner wall (8) having a heel zone (8a) on which a counter (11) is arranged, said method providing for : equipping the zone (8a) with a tongue (14) forming a housing (15) with a portion of the inner wall (8), said housing being accessible via a lower slit (16); disposing an adhesive material on the inner surface of the tongue (14), the portion of the inner wall (8) forming the housing (15) being devoid of adhesive material; applying at least one layer (10) of an inner boot (7) to the shell (6) for its gluing, leaving the slit (16) freely accessible; inserting into the slit (16) at least one upper portion (11b) of the counter (11) in order to place it in the housing (15) with said counter on the heel zone (8a).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鞋面</p>
        <p type="p">3:空間</p>
        <p type="p">6:外殼</p>
        <p type="p">7:內靴</p>
        <p type="p">8:內壁</p>
        <p type="p">9:內層</p>
        <p type="p">10:泡沫層</p>
        <p type="p">11:穩定器</p>
        <p type="p">14:鞋舌</p>
        <p type="p">15:殼體</p>
        <p type="p">16:下狹縫</p>
        <p type="p">19:上邊緣</p>
        <p type="p">20:縫合</p>
        <p type="p">21:保護層</p>
        <p type="p">11a:基部</p>
        <p type="p">11b:上部</p>
        <p type="p">1b:高筒</p>
        <p type="p">8a:後跟區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2156" publication-number="202617909">
    <tif-files tif-type="multi-tif">
      <tif file="114135103.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工件加工用片、工件加工物的製造方法及工件加工用片的使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260129B">C09J7/30</main-classification>
        <further-classification edition="201801120260129B">C09J7/20</further-classification>
        <further-classification edition="200601120260129B">H01L21/301</further-classification>
        <further-classification edition="200601120260129B">C09J133/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岸正憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGISHI, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桐畑朋佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIHATA, TOMOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題：提供一種工件加工用片，其在將工件加工物直接接合到晶圓之際，可以抑制工件加工物與晶圓或與工件加工物的接合部中空隙的面積擴大。  &lt;br/&gt;解決手段：一種工件加工用片，其為用於加工用以製造直接接合的加工物的工件的工件加工用片，將具有80mm×100mm的尺寸的工件加工用片，將在25℃的甲苯15g中使之浸漬24小時的甲苯溶劑的10μL分，藉由凝膠滲透色譜法測定，將測定結果製成色譜圖表時，其中縱軸設為檢測電壓，橫軸設為從導入甲苯溶劑到藉由管柱溶出的溶出時間，算出從對應標準聚苯乙烯換算數量平均分子量為250萬時的溶出時間到對應標準聚苯乙烯換算數量平均分子量為200時的溶出時間的範圍內檢測成分的峰值面積為4000mV．秒以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">B:基準線</p>
        <p type="p">P:峰值</p>
        <p type="p">PA:陰影部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2157" publication-number="202618128">
    <tif-files tif-type="multi-tif">
      <tif file="114135113.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉盤升降塔</chinese-title>
        <english-title>CAROUSEL LIFTING TOWER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251124B">F03D13/20</main-classification>
        <further-classification edition="200601120251124B">B66C1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商德希尼布能源法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNIP ENERGIES FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡薩雷斯　瑪雅　米格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONZALEZ-MAYA, MIGUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">轉盤升降塔可促進風力渦輪機發電機(WTG)及其他建構的組裝。在一個實例中，轉盤升降塔包括塔，該塔可以向上成角度的定向定位並可界定塔軸線。在該實例中，轉盤升降塔進一步包括升降框架，其可以可移動地安裝在塔上以允許升降框架沿著塔軸線平移。此外，在該實例中，轉盤升降塔包括耦接至升降框架的轉盤。轉盤可繞塔軸線旋轉。此外，在該實例中，轉盤升降塔包括轉盤上的負載處置器。負載處置器可以可釋放地與待升降的組件接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carousel lifting tower may facilitate assembly of a wind turbine generator (WTG) and other constructs. In one example, the carousel lifting tower includes a tower, which may be positioned in an upwardly angled orientation, and which may define a tower axis. In the example, the carousel lifting tower further includes a lift frame, which may be movably mounted on the tower to allow translation of the lift frame along the tower axis. Additionally, in the example, the carousel lifting tower includes a carousel coupled to the lift frame. The carousel may rotate about the tower axis. Moreover, in the example, the carousel lifting tower includes a load handler on the carousel. The load handler may releasably engage with a component to be lifted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:轉盤升降塔</p>
        <p type="p">102:碼頭</p>
        <p type="p">104:水體</p>
        <p type="p">106:浮動平台</p>
        <p type="p">108:塔</p>
        <p type="p">112a:柱</p>
        <p type="p">112b:柱</p>
        <p type="p">112c:柱</p>
        <p type="p">112d:柱</p>
        <p type="p">114:頂部表面</p>
        <p type="p">116:升降框架</p>
        <p type="p">118:升降裝置</p>
        <p type="p">120:升降纜線</p>
        <p type="p">122:轉盤</p>
        <p type="p">124:負載處置器</p>
        <p type="p">130:第一突出區段</p>
        <p type="p">132:第二突出區段</p>
        <p type="p">134:配重</p>
        <p type="p">136:軌</p>
        <p type="p">138:塔轉向架</p>
        <p type="p">140:控制器</p>
        <p type="p">142:第一WTG塔區段</p>
        <p type="p">150:塔軸線</p>
        <p type="p">152:頂部表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2158" publication-number="202618269">
    <tif-files tif-type="multi-tif">
      <tif file="114135125.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電極、電化學感測器、生物感測器及電極之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G01N27/327</main-classification>
        <further-classification edition="200601120260130B">G01N27/30</further-classification>
        <further-classification edition="200601120260130B">C25D3/12</further-classification>
        <further-classification edition="200601120260130B">B32B15/08</further-classification>
        <further-classification edition="200601120260130B">G01N33/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田渓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>釜野雄輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMANO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電極朝向厚度方向一側依序具備基材膜、及具有電化學活性之電化學活性層。電化學活性層包含含有鎳之合金。電化學活性層之厚度方向一面之至少一部分露出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基材膜</p>
        <p type="p">3:金屬底層</p>
        <p type="p">4:電化學活性層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2159" publication-number="202619324">
    <tif-files tif-type="multi-tif">
      <tif file="114135126.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於最小化驅動測驗（ＭＤＴ）的使用者設備（ＵＥ）選擇與報告相關性</chinese-title>
        <english-title>UE SELECTION AND REPORTS CORRELATION FOR MDT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260127B">H04L41/0803</main-classification>
        <further-classification edition="202201120260127B">H04L41/16</further-classification>
        <further-classification edition="200901120260127B">H04W24/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商ＬＭ艾瑞克生(ＰＵＢＬ)電話公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　朱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIANG, ZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖托薩　安傑羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTONZA, ANGELO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索西迪　潘那吉歐弟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALTSIDIS, PANAGIOTIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之實施例揭示一種在使用者設備中用於執行一MDT程序之方法。該方法包含：從一網路節點接收用於一追蹤記錄工作階段之一追蹤記錄工作階段參考(TRSR)，該TRSR包含一基於連續管理之MDT首碼；及隨後將至少包含該基於連續管理之MDT首碼之MDT量測傳輸至該網路節點。一種在一網路節點中之對應方法包含：從一連續MDT消費者接收與一基於連續管理之MDT首碼相關聯之一追蹤參考(TR)；為一追蹤記錄工作階段分配一追蹤記錄工作階段參考(TRSR)，該TRSR使用該所接收之基於連續管理之MDT首碼；將該TR及該TRSR傳輸至經選擇用於該追蹤記錄工作階段之一使用者設備(UE)；及隨後從該UE接收至少包含該基於連續管理之MDT首碼之MDT量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of a method in user equipment for performing an MDT process. The method includes: receiving, from a network node, a Trace Recording Session Reference (TRSR) for a Trace Recording session, the TRSR including a continuous management-based MDT prefix; and subsequently transmitting, to the network node, MDT measurements including at least the continuous management-based MDT prefix. A corresponding method in a network node includes: receiving, from a continuous MDT consumer, a Trace Reference (TR) associated with a continuous management-based MDT prefix; allocating a Trace Recording Session Reference (TRSR) for a Trace Recording session, the TRSR using the received continuous management-based MDT prefix; transmitting, to a user equipment (UE) selected for the Trace Recording session, the TR and TRSR; and subsequently receiving, from the UE, MDT measurements including at least the continuous management-based MDT prefix.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:步驟1</p>
        <p type="p">102:步驟2</p>
        <p type="p">104:步驟3</p>
        <p type="p">106:步驟4</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2160" publication-number="202617903">
    <tif-files tif-type="multi-tif">
      <tif file="114135130.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組成物及研磨方法</chinese-title>
        <english-title>POLISHING COMPOSITION AND POLISHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">C09G1/02</main-classification>
        <further-classification edition="200601120260131B">C09K3/14</further-classification>
        <further-classification edition="200601120260131B">C01B33/149</further-classification>
        <further-classification edition="200601120260131B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木章太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野達彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, TATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩崎一晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坪田翔吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBOTA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤昌明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芦高圭史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHITAKA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">依據本發明時，提供研磨用組成物之pH為未達7時，實現具有矽-矽鍵結之材料之高的研磨速度，且具有矽-矽鍵結之材料之研磨速度對具有氧-矽鍵結之材料之研磨速度之比可形成良好之範圍的手段。本發明係有關包含下述(A)成分及下述(B)成分，pH未達7的研磨用組成物；(A)成分：表面修飾二氧化矽粒子，其包含二氧化矽粒子與對前述二氧化矽粒子進行表面修飾之表面修飾基，前述表面修飾基包含重量平均分子量為80以上7,000以下的聚氧化烯鏈；(B)成分：水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides means that can achieve a high polishing removal rate of a material having a silicon-silicon bond and can satisfy a ratio of a polishing removal rate of the material having a silicon-silicon bond to a polishing removal rate of a material having an oxygen-silicon bond within a good range, when the pH of a polishing composition is less than 7. The present disclosure relates to a polishing composition containing the following component (A) and the following component (B) and having a pH of less than 7; component (A): surface-modified silica particles containing silica particles and a surface-modifying group that modifies a surface of the silica particles and contains a polyoxyalkylene chain having a weight average molecular weight of 80 or more and 7,000 or less; and component (B): water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2161" publication-number="202616964">
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      <isuno>9</isuno>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135140</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>澱粉麵及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260129B">A23L17/60</main-classification>
        <further-classification edition="201601120260129B">A23L29/256</further-classification>
        <further-classification edition="201601120260129B">A23L7/109</further-classification>
        <further-classification edition="201601120260129B">A23L7/104</further-classification>
        <further-classification edition="201601120260129B">A23L7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛時可克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACECOOK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香山晉吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYAMA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野倫睦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, NORIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下靖介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, SEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東田潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHIDA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤川真奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKAWA, MANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀨智幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供：一種澱粉麵之製造方法，其不需要老化步驟，即便在麵團中和進特性賦予原料，仍可製造出製造適性優異，且熱水還原後不易熱水泡軟的澱粉麵；以及，利用該製造方法所製造之澱粉麵。&lt;br/&gt;  本揭示有關澱粉麵之製造方法，包含原材料混合步驟、製麵步驟、α化步驟及乾燥步驟，且不含老化步驟，前述原材料混合步驟中之原材料包含澱粉、特性賦予原料、鹼劑及海藻酸酯，且不含麵粉及/或麩質，經由前述乾燥步驟所得之麵的懸浮液其pH超過6.5且在9以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2162" publication-number="202618141">
    <tif-files tif-type="multi-tif">
      <tif file="114135187.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不銹鋼自鑽自攻螺絲及其製造方法</chinese-title>
        <english-title>SELF-DRILLING AND THREAD-FORMING SCREW MADE OF STAINLESS STEEL AND METHOD FOR ITS MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">F16B25/10</main-classification>
        <further-classification edition="200601120260123B">F16B35/06</further-classification>
        <further-classification edition="200601120260123B">B21K1/56</further-classification>
        <further-classification edition="200601120260123B">B21K1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＳＦＳ集團國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SFS GROUP INTERNATIONAL AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德柴克　瑪庫思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSAG, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費德勒　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEDERER, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示闡述一種由不銹鋼材料製成之自鑽自攻螺絲(100)，其具有彼此合併或彼此毗鄰之以下功能區段：一螺絲尖端(110)、具有一終接圓頂(130)之一截頭圓錐(120)，截頭圓錐(120)連接至一圓柱形桿，該圓柱形桿至少在某些區段中帶螺紋。具有一力施加點之一頭部(160)連接至桿之另一端。在截頭圓錐(120)之包殼上配置有由縱向延伸之弓形肋(201、...205)組成之一螺紋狀浮凸結構。此等肋之特徵在於，當沿縱向方向觀看時，其彼此前後地配置，但彼此間隔開，且遵循一虛擬螺旋曲線。  &lt;br/&gt;藉由在一桿形坯料之第一縱向端處進行冷成型而藉由鐓鍛來形成一螺絲頭部，此種螺絲可完全由一不銹鋼材料製造，而無需一製造後熱處理程序，以提高材料硬度。在坯料之第二縱向端處為螺絲尖端形成由縱向延伸之弓形肋組成之特殊螺紋狀浮凸結構，其中此形狀係藉由在兩個對置之工具夾爪之間橫向於縱向軸線進行一夾壓移動來達成。在一後續螺紋滾壓程序期間，自桿上剪切掉突出之材料突片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A self-drilling, thread-forming screw (100) made of stainless steel material is described, which has the following functional sections that merge into one another or are adjacent to one another: A screw tip (110), a truncated cone (120) having a terminating dome (130), which is connected to a cylindrical shank that is threaded at least in sections. A head (160) with a force application point is connected to the other end of the shank. A thread-like relief structure consisting of longitudinally extended, arcuate ribs (201, ...205) is arranged on the jacket of the truncated cone (120). These ribs are characterized in that, when viewed in the longitudinal direction, they are arranged one behind the other but spaced apart from each other and follow a virtual helical curve. &lt;br/&gt;Such a screw can be manufactured entirely from a stainless steel material without a post-manufacturing heat treatment process to improve the material hardness by forming a screw head by cold forming at the first longitudinal end of a shank-shaped blank by upsetting. The screw tip is formed at the second longitudinal end of the blank with the special thread-like relief structure consisting of longitudinally extended, arcuate ribs, wherein this shape is achieved by a pinching movement transverse to the longitudinal axis between two opposing tool jaws. Protruding material tabs are sheared off the shank during a subsequent thread rolling process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:截頭圓錐</p>
        <p type="p">121:圓錐半部/截頭圓錐之前半部/半部/第一截頭圓錐半部</p>
        <p type="p">122:圓錐半部/截頭圓錐之後半部/半部/第二截頭圓錐半部</p>
        <p type="p">125:相交平面/切割平面/平面</p>
        <p type="p">175:劃分線</p>
        <p type="p">176:劃分線</p>
        <p type="p">201:肋/弓形肋/區段</p>
        <p type="p">202:肋/弓形肋/區段</p>
        <p type="p">203:肋/弓形肋/區段</p>
        <p type="p">204:肋/弓形肋/區段</p>
        <p type="p">205:肋/弓形肋/區段</p>
        <p type="p">221:入口</p>
        <p type="p">222:出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2163" publication-number="202617064">
    <tif-files tif-type="multi-tif">
      <tif file="114135206.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置定向對準以用於改善血壓估計</chinese-title>
        <english-title>DEVICE ORIENTATION ALIGNMENT FOR IMPROVED BLOOD PRESSURE ESTIMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">A61B5/00</main-classification>
        <further-classification edition="200601120251231B">A61B5/021</further-classification>
        <further-classification edition="200601120251231B">A61B5/024</further-classification>
        <further-classification edition="200601120251231B">A61B5/145</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭文翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, WENHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯克斯　艾蜜莉　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS, EMILY KATHRYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史科尼德　約翰　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, JOHN KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷洛夫　艾文　麥克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRELOFF, EVAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾夫　寇特妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLFF, COURTNEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些所揭示的方法涉及：由控制系統控制至少一個感測器，以基於設備之目前定向來擷取對應於動脈之目前動脈位置的影像資料。一些此類方法涉及：由控制系統獲得與設備先前經校準的至少一個經校準動脈位置相關聯的校準資訊，其中校準資訊包括由至少一個感測器擷取的經校準動脈位置的影像資料。一些此類方法涉及：由控制系統判定對應於目前動脈位置的影像資料與對應於經校準動脈位置的影像資料之間的臨限相似度。一些此類方法涉及：由控制系統基於臨限相似度來判定設備之目前定向對應於設備在經校準動脈位置處經校準時之定向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some disclosed methods involve controlling, by a control system, at least one sensor to capture image data corresponding to a current arterial location of an artery based on a current orientation of the apparatus. Some such methods involve obtaining, by the control system, calibration information associated with at least one calibrated arterial location at which the apparatus was previously calibrated, wherein the calibration information includes image data captured by the at least one sensor of the calibrated arterial location. Some such methods involve determining, by the control system, a threshold similarity between the image data corresponding to the current arterial location and the image data corresponding to the calibrated arterial location. Some such methods involve determining, by the control system and based on the threshold similarity, that the current orientation of the apparatus corresponds to the orientation of the apparatus when calibrated at the calibrated arterial location.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:設備</p>
        <p type="p">301:控制系統</p>
        <p type="p">302:顯示系統</p>
        <p type="p">303:光聲感測器系統</p>
        <p type="p">304:超音波感測器系統</p>
        <p type="p">305:光學感測器系統</p>
        <p type="p">306:攝影機感測器系統</p>
        <p type="p">307:介面系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2164" publication-number="202618023">
    <tif-files tif-type="multi-tif">
      <tif file="114135236.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135236</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CVD反應器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C23C16/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商愛思強歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIXTRON SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢　利文大衛理查約翰尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEE, LEVIN DAVID RICHARD JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾茲沃斯　賈里德李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLZWARTH, JARED LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博伊德　亞登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾克爾坎普　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EICKELKAMP, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布克　伊恩唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOOKER, IAN DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費列　德克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAHLE, DIRK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格羅納茲　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRONARZ, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米科利　伊利歐</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>MICCOLI, ILIO</last-name>
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                <last-name>福爾曼　阿克塞爾</last-name>
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              <english-name name-type="organization">
                <last-name>FOLLMANN, AXEL</last-name>
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              <english-country>DE</english-country>
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              <chinese-name name-type="organization">
                <last-name>雷爾斯　拉爾夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIERS, RALF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <english-country>DE</english-country>
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                <last-name>勞佛　彼得塞巴德</last-name>
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              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUFFER, PETER SEBALD</last-name>
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                <first-name></first-name>
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              <english-country>DE</english-country>
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                <last-name>巴斯特克　托斯滕維爾納</last-name>
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              <english-name name-type="organization">
                <last-name>BASTKE, TORSTEN WERNER</last-name>
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                <first-name></first-name>
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              <english-country>DE</english-country>
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                <last-name>道爾斯伯格　馬丁</last-name>
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              <english-name name-type="organization">
                <last-name>DAUELSBERG, MARTIN</last-name>
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                <first-name></first-name>
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              <english-country>DE</english-country>
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                <last-name>科爾柏格　馬塞爾</last-name>
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                <last-name>KOLLBERG, MARCEL</last-name>
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              <english-country>DE</english-country>
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              <chinese-name name-type="organization">
                <last-name>哈恩　烏茲赫爾維格</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HAHN, UTZ HERWIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>DE</english-country>
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              <chinese-name name-type="organization">
                <last-name>布克　皮西里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOOKER, PITSIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
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              <chinese-name name-type="organization">
                <last-name>羅傑克　卡斯滕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROJEK, KARSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <english-country>DE</english-country>
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                <last-name>毛德　克里斯多夫馬丁</last-name>
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              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAUDER, CHRISTOF MARTIN</last-name>
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                <first-name></first-name>
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              <english-country>DE</english-country>
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                <last-name>凱佩爾　迪特馬</last-name>
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              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEIPER, DIETMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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              <chinese-name name-type="organization">
                <last-name>呂嫩比格　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNENBURGER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
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              <english-country>DE</english-country>
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                <last-name>費宏　奧利維耶</last-name>
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              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERON, OLIVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <english-country>DE</english-country>
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              <chinese-name name-type="organization">
                <last-name>穆基諾維奇　梅里姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKINOVIC, MERIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
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              <english-country>BA</english-country>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
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              </chinese-name>
              <address>臺北市</address>
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                <last-name>宿希成</last-name>
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              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於用於在一或多個基板(21)上沉積層之一種裝置及一種方法，其中，在具有殼體壁(3、4、5)之殼體(2)中佈置有製程室(12)，該製程室上方由製程室頂部(13)界定，底部由用於容置該一個或該等多個基板(21)之基板座配置(14、15、16)界定，可藉由氣體入口構件(6)將由氣體混合系統(10)提供的製程氣體送入該製程室中，其中，由加熱裝置(17)將該基板座配置(14、15、16)加熱至＞800℃的製程溫度，其中，該製程室頂部(13)與該基板座配置(14、15、16)間隔較小的豎直距離，使得該製程室頂部(13)達到至少500℃的溫度，並且該裝置具有光學裝置(22)，該光學裝置透過光路(25)穿過該殼體壁(3)之開口(23)與該基板(21)或該基板座配置(14、15、16)的表面協作。根據本發明，該光學裝置(22)具有導光體(101、101’)，其特別是由玻璃纖維管線構成並且將該開口(23)與遠離該開口(23)而佈置在光學模組(102)中的光學元件(103)連接在一起。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:上殼體壁</p>
        <p type="p">13:製程室頂部</p>
        <p type="p">20:基板架</p>
        <p type="p">21:基板</p>
        <p type="p">22:光學裝置/感測器/光學感測器/氣體出口構件/測量裝置</p>
        <p type="p">23、23’:開口</p>
        <p type="p">26、26’:開口</p>
        <p type="p">101:柔性導光體、玻璃纖維、導光體</p>
        <p type="p">101’:柔性導光體、導光體</p>
        <p type="p">102:光學模組</p>
        <p type="p">103:光學元件、光源、雷射器、感測器、高溫計</p>
        <p type="p">103’:光學元件</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2165" publication-number="202617570">
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        <document-id>
          <doc-number>114135263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>料盤拆料頭裝置</chinese-title>
        <english-title>HEAD-DETACHING DEVICE FOR TAPE REEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">B65H19/20</main-classification>
        <further-classification edition="200601120251124B">B65H16/00</further-classification>
        <further-classification edition="200601120251124B">B65H19/12</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商環旭電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>曾耀興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YAO-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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                <last-name>谷遠洋</last-name>
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              <english-name name-type="organization">
                <last-name>GU, YUAN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>沈霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹　憬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>李冠儒</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LEE, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種料盤拆料頭裝置，包括料盤夾持機構、拆料頭機構和裁剪機構，拆料頭機構包括拆料頭本體及用於驅動拆料頭本體移動的移載模組。拆料頭本體又進一步包括上刀頭、下刀頭以及用於驅動上刀頭和下刀頭開合的第一驅動件，下刀頭呈鏟形構造，用於鏟起料帶的料頭，且在下刀頭鏟起料頭的同時，上刀頭和下刀頭逐漸閉合直至夾住被鏟起的料頭，實現對料頭的夾持。此時，再通過移載模組驅動拆料頭本體移動便能實現料頭的撕離。裁剪機構包括電動剪刀和兩個相對設置的料帶抓手，兩個料帶抓手能夠交替夾持並撕拉料帶，保證料帶張緊度的同時還不易扯斷料帶，有利於電動剪刀剪掉料帶的無料區，為貼片機做好換料前料盤拆料頭工序，生產線的生產效率更高且成本低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head-detaching device for tape reel includes a reel clamping mechanism, a tape head removing mechanism, and a cutting mechanism. The tape head removing mechanism includes a head-detaching body and a transferring module for driving the movement of the head-detaching body. The head-detaching body further includes an upper blade, a lower blade, and a first driving component for driving the opening and closing of the upper and lower blades. The lower blade has a shovel-shaped structure for lifting the tape head of the material tape. While the lower blade lifts the tape head, the upper and lower blades gradually close until clamping the lifted tape head, thereby achieving clamping of the tape head. At this point, the tape head can be torn off by moving the head-detaching body via the transferring module. The cutting mechanism includes an electric scissor and two oppositely arranged material tape grippers. The two material tape grippers can alternately clamp and pull the material tape, ensuring the tension of the material tape without easily tearing it off, which facilitates the electric scissor to cut off the non-material area of the material tape, preparing for the tape head removing process of the tape reel before material replacement for the placement machine, thereby achieving higher production efficiency and lower cost in the production line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:拆料頭機構</p>
        <p type="p">210:上刀頭</p>
        <p type="p">220:下刀頭</p>
        <p type="p">230:第一驅動件</p>
        <p type="p">240:擋件</p>
        <p type="p">250:緩衝件</p>
        <p type="p">261:第一豎直移載模組</p>
        <p type="p">262:第一水平移載模組</p>
        <p type="p">263:第二水平移載模組</p>
        <p type="p">270:雷射感測器</p>
        <p type="p">280:固定架</p>
        <p type="p">290:撐料件</p>
        <p type="p">602:攝像模組</p>
      </representative-img>
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      <invention-title>
        <chinese-title>電腦程式、資訊處理方法、學習模型之產生方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260130B">G06N20/00</main-classification>
        <further-classification edition="202301120260130B">G06F18/214</further-classification>
        <further-classification edition="202301120260130B">G06F18/24</further-classification>
        <further-classification edition="200601120260130B">H01L21/67</further-classification>
        <further-classification edition="202401120260130B">G01N15/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大見則文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMI, NORIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>川人大希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHITO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>相田航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIDA, KOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長池宏史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAIKE, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電腦程式、資訊處理方法、學習模型之產生方法及資訊處理裝置，其等有望支援應對基板處理裝置之周用容器內所產生之微粒的措施。  &lt;br/&gt;本實施方式之電腦程式使電腦執行如下處理：獲取微粒資料，該微粒資料包含基板處理裝置之處理容器內所產生之微粒之位置資訊；向學習模型輸入所獲取到之微粒資料，該學習模型已以將微粒資料作為輸入而受理，輸出與各微粒之發塵源相關之資訊之方式進行過機器學習；獲取上述學習模型所輸出之與發塵源相關之資訊；輸出所獲取到之上述與發塵源相關之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1,1A,1B:資訊處理裝置(電腦)</p>
        <p type="p">3,3A,3B:基板處理裝置</p>
        <p type="p">4:製程DB</p>
        <p type="p">5:發塵源預測模型</p>
        <p type="p">6:回收方法預測模型</p>
        <p type="p">7:模型DB</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2167" publication-number="202617725">
    <tif-files tif-type="multi-tif">
      <tif file="114135274.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>2-[3-[4-胺基-3-(2-氟-4-苯氧基-苯基)-1H-吡唑并[3,4-d]嘧啶-1-基]哌啶-1-羰　基]-4-甲基-4-[4-(氧環丁烷-3-基)哌-1-基]戊-2-烯腈之晶形</chinese-title>
        <english-title>CRYSTALLINE FORMS OF 2-[3-[4-AMINO-3- (2-FLUORO-4-PHENOXY-PHENYL)-1H-PYRAZOLO [3,4-D]PYRIMIDIN-1-YL]PIPERIDINE-1-CARBONYL]- 4-METHYL-4-[4-(OXETAN-3-YL)PIPERAZIN- 1-YL]PENT-2-ENENITRILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C07D487/04</main-classification>
        <further-classification edition="200601120260116B">A61K31/519</further-classification>
        <further-classification edition="200601120260116B">A61P29/00</further-classification>
        <further-classification edition="200601120260116B">A61P37/00</further-classification>
        <further-classification edition="200601120260116B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普林斯匹亞生物製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRINCIPIA BIOPHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費亞希凡沙　帕西特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHIASIVONGSA, PASIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜　柯爾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BY, KOLBOT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑姆　吉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUM, JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露化合物(&lt;b&gt;I&lt;/b&gt;)之晶形：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="190px" width="253px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;。亦揭露包含其之醫藥組成物、使用其治療由BTK活性介導之病症及病況之方法、及用於製造化合物(&lt;b&gt;I&lt;/b&gt;)及其晶形之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Crystalline forms of Compound (I): &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="203px" width="275px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;are disclosed. Pharmaceutical compositions comprising the same, methods of treating disorders and conditions mediated by BTK activity using the same, and methods for making Compound (&lt;b&gt;I&lt;/b&gt;) and crystalline forms thereof are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2168" publication-number="202617324">
    <tif-files tif-type="multi-tif">
      <tif file="114135278.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>助焊劑、及熔接接頭之製造方法</chinese-title>
        <english-title>FLUX AND METHOD FOR PRODUCING WELDED JOINT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B23K35/362</main-classification>
        <further-classification edition="200601120260202B">B23K9/18</further-classification>
        <further-classification edition="200601120260202B">C22C38/00</further-classification>
        <further-classification edition="200601120260202B">C22C38/14</further-classification>
        <further-classification edition="200601120260202B">C22C38/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立花隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIBANA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加茂孝浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於熔接的助焊劑，其中C：0.050%~5.000%、Cr：0%~20.0%作為合金成分，且包含選自Ba氧化物、Ca氧化物、Mn氧化物、Mg氧化物、Fe氧化物、Zr氧化物所構成群組中之至少1種氧化物；BL=1.3[BaO]+0.5[CaO+MnO+Na&lt;sub&gt;2&lt;/sub&gt;O+K&lt;sub&gt;2&lt;/sub&gt;O]+0.2[MgO+FeO]+0.05[ZrO&lt;sub&gt;2&lt;/sub&gt;]-0.05[Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;]-0.2[TiO&lt;sub&gt;2&lt;/sub&gt;]-0.5[SiO&lt;sub&gt;2&lt;/sub&gt;]+5([C]+[Mg]+[Fe])的鹼度BL為2.0~60.0；粒度分布如下：大於2.00mm：40%以下、大於1.00mm且為2.00mm以下：5~50%、大於0.50mm且為1.00mm以下：5~75%、大於0.25mm且為0.50mm以下：5~50%、0.25mm以下：40%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2169" publication-number="202618512">
    <tif-files tif-type="multi-tif">
      <tif file="114135284.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子組件及垂直供電模組</chinese-title>
        <english-title>AN ELECTRONICS ASSEMBLY AND A VERTICAL POWER DELIVERY MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G06F1/18</main-classification>
        <further-classification edition="200601120251001B">G06F1/26</further-classification>
        <further-classification edition="200601120251001B">H05K1/11</further-classification>
        <further-classification edition="200601120251001B">H05K1/18</further-classification>
        <further-classification edition="200601120251001B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛挺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種電子組件及垂直供電模組。電子組件包括母板、處理器、以及垂直供電模組。母板包括第一面和第二面。處理器包括安裝在母板的第一面處理器基板；垂直供電模組電連接至處理器以為處理器提供供電。垂直供電模組透過貫穿母板的孔附著至處理器基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronics assembly and a vertical power delivery module are disclosed. The electronics assembly has a motherboard, a processor, and the vertical power delivery module. The motherboard has a first side and a second side. The processor has a substrate which is mounted on the first side of the motherboard. The vertical power delivery module is electrically connected to deliver power to the processor. The vertical power delivery module is attached to the substrate of the processor through a hole that extends through the motherboard.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電子組件</p>
        <p type="p">206:球柵陣列</p>
        <p type="p">207:頂面</p>
        <p type="p">208:背面</p>
        <p type="p">209:處理器基板</p>
        <p type="p">210:母板</p>
        <p type="p">211:電源模組</p>
        <p type="p">212:冷板</p>
        <p type="p">213:輸出電容器</p>
        <p type="p">214:熱界面材料</p>
        <p type="p">230:通孔垂直供電模組</p>
        <p type="p">231:第一模組基板</p>
        <p type="p">232:第二模組基板</p>
        <p type="p">233:電容器層</p>
        <p type="p">234:電容器</p>
        <p type="p">235:子模組</p>
        <p type="p">236:控制器</p>
        <p type="p">D1:厚度</p>
        <p type="p">D2:厚度</p>
        <p type="p">D3:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2170" publication-number="202619418">
    <tif-files tif-type="multi-tif">
      <tif file="114135313.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H05K1/02</main-classification>
        <further-classification edition="200601120260127B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高倉隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAKURA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙口圭吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGUCHI, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板1具備配線部3A、及支持配線部3A之一端部之第1支持部2A。配線部3A具有金屬支持層11、第1絕緣層12、及配線133A。配線133A具有配置於第1絕緣層12上之第1導體層1331、及被覆第1導體層1331且與第1絕緣層12接觸之第2導體層1332。配線133A之厚度T11相對於第1導體層1331之厚度T21之比率(T11/T21)為2.0以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2A:第1支持部</p>
        <p type="p">3A:配線部</p>
        <p type="p">11:金屬支持層</p>
        <p type="p">12:第1絕緣層(絕緣層之一例)</p>
        <p type="p">13:導體圖案</p>
        <p type="p">14:第2絕緣層</p>
        <p type="p">133A:配線</p>
        <p type="p">1330:凹部</p>
        <p type="p">1331:第1導體層</p>
        <p type="p">1332:第2導體層</p>
        <p type="p">C:中央部</p>
        <p type="p">D1:凹部之深度</p>
        <p type="p">D11:寬度方向上之配線之一側之側面與第1導體層之間的距離</p>
        <p type="p">D12:寬度方向上之配線之另一側之側面與第1導體層之間的距離</p>
        <p type="p">E:端部</p>
        <p type="p">S1:厚度方向上之配線之一端面</p>
        <p type="p">S2:寬度方向上之配線之一側之側面</p>
        <p type="p">S3:寬度方向上之配線之另一側之側面</p>
        <p type="p">T1:金屬支持層之厚度</p>
        <p type="p">T11:配線之厚度</p>
        <p type="p">T12:端部之厚度</p>
        <p type="p">T21:第1導體層之厚度</p>
        <p type="p">W1:金屬支持層之寬度</p>
        <p type="p">W11:配線之寬度</p>
        <p type="p">W21:第1導體層之寬度</p>
        <p type="p">△T:中央部之厚度與端部之厚度之差</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2171" publication-number="202617430">
    <tif-files tif-type="multi-tif">
      <tif file="114135314.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於汽車內飾應用之紫外光固化油墨疊層及包含其之基板</chinese-title>
        <english-title>ULTRAVIOLET CURABLE INK STACKS FOR AUTOMOTIVE INTERIOR APPLICATIONS AND SUBSTRATES COMPRISING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B32B27/00</main-classification>
        <further-classification edition="200601120260202B">B32B27/16</further-classification>
        <further-classification edition="201901120260202B">B32B7/023</further-classification>
        <further-classification edition="201401120260202B">C09D11/101</further-classification>
        <further-classification edition="200601120260202B">B44C5/00</further-classification>
        <further-classification edition="200601120260202B">B60R13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛曼　柯瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMAN, COREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里森　亞倫布萊德利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLEASON, AARON BRADLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛倫鄧　約翰沃特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUNDEN, JOHN WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱炳潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOO, BYUNG YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡農戈　曼達基尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANUNGO, MANDAKINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥達　曼努吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDA, MANOJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥爾斯　提摩西愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYERS, TIMOTHY EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">紫外光固化油墨疊層包括第一著色層及第二著色層。按該第一著色層之總重量計，該第一著色層包括小於或等於4 wt%之第一顏料。按該第二著色層之總重量計，該第二著色層包括大於4 wt%之第二顏料。當將該紫外光固化油墨疊層安置於透明基板上且經由暴露於紫外光輻射進行固化以形成厚度小於或等於15 µm之固化油墨疊層時，該固化油墨疊層展現出大於或等於4.0之光學密度，該光學密度係針對可見光譜內的光以垂直入射方式穿過該厚度透射所量測的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultraviolet curable ink stack includes a first pigmented layer and a second pigmented layer. The first pigmented layer includes less than or equal to 4 wt% of a first pigment, based on a total weight of the first pigmented layer. The second pigmented layer includes greater than 4 wt% of a second pigment, based on a total weight of the second pigmented layer. When the ultraviolet curable ink stack is disposed and cured on a transparent substrate via exposure to ultraviolet radiation to form a cured ink stack having a thickness less than or equal to 15 µm, the cured ink stack exhibits an optical density that is greater than or equal to 4.0, as measured for light in the visible spectrum transmitted through the thickness at normal incidence.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105,200,300:車輛內飾系統</p>
        <p type="p">110:中控台底座</p>
        <p type="p">120,220,320:彎曲表面</p>
        <p type="p">130,230,330:顯示器</p>
        <p type="p">210:儀錶盤底座</p>
        <p type="p">215:儀錶面板</p>
        <p type="p">310:儀錶盤轉向軸距</p>
        <p type="p">2000:車輛內飾</p>
        <p type="p">2-2:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2172" publication-number="202617946">
    <tif-files tif-type="multi-tif">
      <tif file="114135316.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135316</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理反應性原料的催化劑的再生方法</chinese-title>
        <english-title>METHOD FOR REGENERATING A CATALYST FOR PROCESSING REACTIVE FEEDSTOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">C10G65/08</main-classification>
        <further-classification edition="200601120260120B">C10G45/02</further-classification>
        <further-classification edition="200601120260120B">C10G45/06</further-classification>
        <further-classification edition="200601120260120B">B01J38/06</further-classification>
        <further-classification edition="200601120260120B">C01B3/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商托普索公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPSOE A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德森　克拉斯　傑克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSSON, KLAS JERKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　阿舍溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, ASHWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布林奇　拉爾森　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRINCH-LARSEN, MATHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於再生製程外殼及包含沉澱銨鹽之催化劑的方法，以及一種用於連續加氫處理(hydrotreating)包含氮及鹵化物之原料的方法及製程設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for regeneration of a process enclosure and a catalyst comprising precipitated ammonium salts, and a process and a process plant for continuous hydrotreating a feedstock comprising nitrogen and halides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:反應性原料</p>
        <p type="p">102:富氫氣體</p>
        <p type="p">104:進料流</p>
        <p type="p">106:沖洗氣體流</p>
        <p type="p">108A:第一入口管線</p>
        <p type="p">108B:第二入口管線</p>
        <p type="p">110A:來自第一穩定化反應器(STA)的出口流</p>
        <p type="p">110B:來自第二穩定化反應器(STB)的出口流</p>
        <p type="p">112:再循環產物流</p>
        <p type="p">114:單個物料流</p>
        <p type="p">116:經純化之烴流</p>
        <p type="p">120:二相富烴流</p>
        <p type="p">122:第一液體產物流</p>
        <p type="p">124:氣相產物流</p>
        <p type="p">126:洗滌水</p>
        <p type="p">130:富氫氣體</p>
        <p type="p">132:輕質產物</p>
        <p type="p">133:酸性水</p>
        <p type="p">134:第一液體產物流</p>
        <p type="p">136:汽提塔進料</p>
        <p type="p">138:汽提介質</p>
        <p type="p">142:水</p>
        <p type="p">144:汽提產物</p>
        <p type="p">145:汽提塔塔頂餾出物</p>
        <p type="p">148:回流物</p>
        <p type="p">151:酸性水</p>
        <p type="p">152:補充氫氣/硫化流</p>
        <p type="p">154:富氫洗滌氣體</p>
        <p type="p">156:再循環氣體</p>
        <p type="p">158:沖洗氣體</p>
        <p type="p">160:鍋爐給水</p>
        <p type="p">162:蒸汽</p>
        <p type="p">164:添加的熱高壓蒸汽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2173" publication-number="202617298">
    <tif-files tif-type="multi-tif">
      <tif file="114135327.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱軋帶鋼卷材的加工方法及設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B21C47/26</main-classification>
        <further-classification edition="200601120260127B">B21C47/04</further-classification>
        <further-classification edition="200601120260127B">B21C47/24</further-classification>
        <further-classification edition="200601120260127B">C21D9/52</further-classification>
        <further-classification edition="200601120260127B">C21D8/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商阿莫瓦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMOVA GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸柏克　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUEBKE, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種加工熱軋帶鋼卷材、特別是由熱軋鋼帶構成之卷材的方法，具有以下步驟：（1.）將所捲取的圓形熱軋帶鋼卷材放置在底座上、較佳放置在帶捲架或托板上，（2.）透過將成型力施加至該卷材的兩個相對側上而將該卷材自圓形形狀成型為非圓形形狀，（3.）隨後在該捲取成卷材的熱軋帶鋼之自重的影響下將該所成型的非圓形卷材變形為圓形形狀。本發明亦有關於一種用於實施根據本發明之方法的設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備</p>
        <p type="p">2:帶捲架</p>
        <p type="p">3:帶材</p>
        <p type="p">4a:成型缸筒</p>
        <p type="p">4b:成型缸筒</p>
        <p type="p">5a:支撐輥</p>
        <p type="p">5b:支撐輥</p>
        <p type="p">5c:支撐輥</p>
        <p type="p">5d:支撐輥</p>
        <p type="p">6a:樞軸承</p>
        <p type="p">6b:樞軸承</p>
        <p type="p">7a:基座</p>
        <p type="p">7b:基座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2174" publication-number="202617559">
    <tif-files tif-type="multi-tif">
      <tif file="114135328.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於側面支承之可自動更換墊片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B65G47/74</main-classification>
        <further-classification edition="200601120260130B">B65G49/00</further-classification>
        <further-classification edition="200601120260130B">B65H75/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商阿莫瓦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMOVA GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施耐德　馬克思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬喬溫斯基　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHOWINSKI, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於由金屬材料(較佳由鋼或銅及其合金)構成的卷材或半成品之支承件，該支承件具有用於該卷材或半成品的支承面以及可安裝至該支承上且可再次移除的可更換墊片，該可更換墊片以至少部分覆蓋該支承面的方式構建，其中可藉由可更換墊片輸送裝置將該可更換墊片移動至該支承面上以及使其遠離該支承面。本發明亦有關於一種在支承件上中安放及視情況移除可更換墊片的方法，其特徵在於以下步驟：(1.)將該可更換墊片轉入至該支承面上方，(2.)以某種方式將第一卷材或半成品放置在該支承面上，使得該可更換墊片完全覆蓋第一卷材或半成品與該支承面之間的面積，(3.)自該可更換墊片及該支承件移除該第一卷材或半成品，並且(4.)將該可更換墊片自該支承面上方之區域轉出，視情況隨後(5.)將第二卷材或半成品直接放置在該支承件上，該第二卷材或半成品具有與該第一卷材或半成品有所不同之表面特性或者由與該第一卷材或半成品有所不同之材料構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支座</p>
        <p type="p">3:支承面</p>
        <p type="p">4:可更換墊片</p>
        <p type="p">5:可更換墊片輸送裝置</p>
        <p type="p">7a:支撐輥</p>
        <p type="p">7b:支撐輥</p>
        <p type="p">8:基座</p>
        <p type="p">9a:支架/支臂</p>
        <p type="p">9b:支架/支臂</p>
        <p type="p">10a:旋轉軸</p>
        <p type="p">10b:驅動馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2175" publication-number="202618912">
    <tif-files tif-type="multi-tif">
      <tif file="114135331.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618912</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組成物</chinese-title>
        <english-title>POLISHING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/304</main-classification>
        <further-classification edition="200601120260131B">C09K3/14</further-classification>
        <further-classification edition="201201120260131B">B24B37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都築敦史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部将志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種研磨用組成物，其能以高研磨速度來研磨碳膜，且相對於氮化矽膜之研磨速度而能以更高的研磨速度來研磨碳膜。一種研磨用組成物，其包含：陰離子改質氧化矽粒子、非離子性界面活性劑及陰離子性高分子，且pH為1.0以上5.0以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a polishing composition that can polish a carbon film at a high polishing removal rate, and can polish the carbon film at a high polishing removal rate with respect to a polishing removal rate of a silicon nitride film. A polishing composition, containing an anion-modified silica particle; a nonionic surfactant; and an anionic polymer, wherein a pH of the polishing composition is 1.0 or more and 5.0 or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2176" publication-number="202617507">
    <tif-files tif-type="multi-tif">
      <tif file="114135335.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人力驅動車輛之操作裝置</chinese-title>
        <english-title>OPERATING DEVICE FOR HUMAN-POWERED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">B62K23/00</main-classification>
        <further-classification edition="200601120260121B">B62K23/02</further-classification>
        <further-classification edition="200601120260121B">B62K23/06</further-classification>
        <further-classification edition="200601120260121B">G05G1/04</further-classification>
        <further-classification edition="202001120260121B">B62J6/16</further-classification>
        <further-classification edition="200601120260121B">B62L3/02</further-classification>
        <further-classification edition="200601120260121B">B62M25/04</further-classification>
        <further-classification edition="200601120260121B">B62M25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日高祐一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDAKA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井拓真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駒田耕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMADA, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>掛橋駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKEHASHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一人力驅動車輛之操作裝置包括一基座部件及一操作部件。該基座部件在一縱向方向上延伸。該基座部件包含一第一端部分及一第二端部分。該第二端部分包含一蓋部分，該蓋部分在該縱向方向上設置於該第一端部分之一相反側上。該操作部件包含一外表面，該外表面經組態以在其中該操作部件處於一靜止位置中之一靜止狀態中背對該第一端部分。該蓋部分經組態以配置於該操作部件之一樞轉移動軌道上，以便當在該縱向方向上觀看時，在該靜止狀態中與該操作部件之該外表面至少部分地重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating device for a human-powered vehicle comprises a base member and an operating member. The base member extends in a longitudinal direction. The base member includes a first end portion and a second end portion. The second end portion includes a cover portion provided on a reverse side of the first end portion in the longitudinal direction. The operating member includes an outer surface configured to face away from the first end portion in a rest state where the operating member is in a rest position. The cover portion is configured to be arranged on a pivotal movement track of the operating member so as to at least partly overlap with the outer surface of the operating member in the rest state as viewed in the longitudinal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:車把</p>
        <p type="p">10:操作裝置</p>
        <p type="p">12:基座部件</p>
        <p type="p">14:操作部件</p>
        <p type="p">14A:近端部分</p>
        <p type="p">14B:遠端部分</p>
        <p type="p">14C:外表面</p>
        <p type="p">14D:最上部端</p>
        <p type="p">16:第一端部分</p>
        <p type="p">18:第二端部分</p>
        <p type="p">44:蓋部分</p>
        <p type="p">44A:最下部端</p>
        <p type="p">44B:下部端</p>
        <p type="p">44T:橫向中心</p>
        <p type="p">54:側向表面</p>
        <p type="p">56:額外側向表面</p>
        <p type="p">A1:樞軸線</p>
        <p type="p">A5:中心軸線</p>
        <p type="p">CP:橫向中心平面</p>
        <p type="p">D1:縱向方向</p>
        <p type="p">D4:軸向方向</p>
        <p type="p">HC:車把中心平面</p>
        <p type="p">L1:側向長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2177" publication-number="202618772">
    <tif-files tif-type="multi-tif">
      <tif file="114135381.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>列錘緩解的裝置和方法</chinese-title>
        <english-title>DEVICE AND METHODS FOR ROW-HAMMER MITIGATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G11C11/406</main-classification>
        <further-classification edition="200601120251201B">G11C29/00</further-classification>
        <further-classification edition="200601120251201B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　宗旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZONGWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮茲馬尼　瑞克哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITCHUMANI, REKHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">裝置包含處理器和記憶體，其中記憶體儲存指令，當由處理器執行時，導致處理器接收與記憶體裝置的第一列相關聯的第一請求，識別與第一列相關聯的第二列，識別與第二列相關聯的第一計數器值，確定第一計數器值滿足閾值，以及基於第一計數器值滿足閾值為第二列發出刷新請求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device comprising a processor and a memory, wherein the memory stores instructions that, when executed by the processor, cause the processor to receive a first request associated with a first row of a memory device, identify a second row associated with the first row, identify a first counter value associated with the second row, determine that the first counter value satisfies a threshold value, and issue a refresh request for the second row based on the first counter value satisfying the threshold value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:製程</p>
        <p type="p">602、604、606、608、610、612、614、616、618、620、622、624:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2178" publication-number="202618983">
    <tif-files tif-type="multi-tif">
      <tif file="114135386.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體檢測曲線的平滑方法、清潔控制方法、電子設備及半導體製程設備</chinese-title>
        <english-title>GAS DETECTION CURVE SMOOTHING METHOD, CLEANING CONTROL METHOD, ELECTRONIC EQUIPMENT AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/67</main-classification>
        <further-classification edition="200601120260123B">H01L21/3065</further-classification>
        <further-classification edition="201401120260123B">G01N21/3504</further-classification>
        <further-classification edition="202101120260123B">G01N27/62</further-classification>
        <further-classification edition="200601120260123B">G05B13/02</further-classification>
        <further-classification edition="200601120260123B">G06F17/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫靜怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JING YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蘇樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SU LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種氣體檢測曲線的平滑方法、清潔控制方法、電子設備及半導體製程設備，氣體檢測曲線的平滑方法包括：獲取終點檢測裝置輸出的清潔輸出氣體的曲線；清潔輸出氣體的曲線包括清潔輸出氣體的首個清潔輸出值至當前清潔輸出值之間所有的清潔輸出值；以首個清潔輸出值作為首個清潔估計值，基於預設遺忘參數，對清潔輸出氣體的曲線進行平滑處理，得到與各清潔輸出值對應的清潔估計值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a gas detection curve smoothing method, a cleaning control method, an electronic equipment, and a semiconductor process equipment. The gas detection curve smoothing method includes: obtaining a curve of a clean output gas output by an endpoint detection device; the clean output gas curve includes all clean output values between the first clean output value and the current clean output value of the clean output gas; using the first clean output value as the first clean estimated value, and based on a preset forgetting parameter, smoothing the curve of the clean output gas to obtain a clean estimated value corresponding to each clean output value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S102:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2179" publication-number="202617678">
    <tif-files tif-type="multi-tif">
      <tif file="114135418.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶配向劑、液晶配向膜及使用其之液晶顯示元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C217/84</main-classification>
        <further-classification edition="200601120260202B">C08G73/12</further-classification>
        <further-classification edition="200601120260202B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川和典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本佳道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, YOSHIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明目的是提供一種液晶配向膜，即使製作液晶配向膜時煅燒步驟的溫度低，液晶配向的安定性也高，且電壓保持率高。尤其，目的是從ESG或SDGs的觀點來考量可減少消耗的能量，此外，對於藉由光配向處理所得到的液晶顯示元件的液晶配向膜是有用的。另外，目的是提供一種用來製作該液晶配向膜之液晶配向劑，及具有該液晶配向膜之液晶顯示元件。一種液晶配向劑，其含有選自於聚醯亞胺前驅物及聚醯亞胺的至少一種聚合物，該聚醯亞胺前驅物及聚醯亞胺具有選自於下述式[1]及式[1-A]之結構的至少一種結構。  &lt;br/&gt;&lt;img align="absmiddle" height="220px" width="447px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(上述式中的各記號的意思如說明書所定義。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:橫向電場液晶顯示元件</p>
        <p type="p">2:梳齒電極基板</p>
        <p type="p">2a:基板</p>
        <p type="p">2b:線狀電極</p>
        <p type="p">2c:液晶配向膜</p>
        <p type="p">3:液晶</p>
        <p type="p">4:對向基板</p>
        <p type="p">4a:液晶配向膜</p>
        <p type="p">4b:基板</p>
        <p type="p">L:電力線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2180" publication-number="202618051">
    <tif-files tif-type="multi-tif">
      <tif file="114135420.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿增強ＡＬＤ製程中穩定且快速之流體轉換的基於儲層的前驅物輸送</chinese-title>
        <english-title>RESERVOIR-BASED PRECURSOR DELIVERY FOR STABLE AND RAPID FLOW TRANSITIONS IN A PLASMA-ENHANCED ALD PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C23C16/455</main-classification>
        <further-classification edition="200601120260121B">C23C16/52</further-classification>
        <further-classification edition="200601120260121B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱德拉雅　狄瓦卡Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEDLAYA, DIWAKAR N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛瑪　雪恩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, SHASHANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴加瓦德　曼朱納塔古德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAGAVAD, MANJUNATHAGOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈許　蘇里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, SUPRIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈羅伊　蘇密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGHA ROY, SUSMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯塔吉　伍迪特瑟亞坎特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAGI, UDIT SURYAKANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊漢　帕亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOUHAN, PRIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬巴利帕帝爾　曼朱納斯維拉帕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOBARI PATIL, MANJUNATH VEERAPPA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裘德胡瑞　盧盼卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOUDHURY, RUPANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古魯拉吉　蘇曼斯庫魯迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GURURAJ, SUMANTH KURUDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例涉及與氣體儲層相關的裝置和方法，用於將氣體快速輸送至處理腔室以處理基板。該氣體儲層包含第一表面和第二表面，第一表面限定了氣體儲層的長度，第二表面限定了氣體儲層的高度；複數個隔室，每個隔室可操作以保持氣體，且有至少兩個隔室包含加熱能力，還有分流器，該分流器安置於複數個隔室下方並與氣體分配盤及閥塊耦接，還包含複數個氣體分配盤氣體管線和複數個氣體儲層氣體管線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to devices and methods related to gas reservoirs for fast delivery of gases to a processing chamber for processing of a substrate. The gas reservoir includes a first surface and a second surface, the first surface defining a length of the gas reservoir, and the second surface defining a height of the gas reservoir; a plurality of compartments, each compartment operable to hold a gas, and at least two compartments include heating capabilities, a splitter where the splitter is disposed below the plurality of compartments and the splitter is coupled to a gas panel and a valve block, a plurality of gas panel gas lines, and a plurality of gas reservoir gas lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室</p>
        <p type="p">102:氣體儲層</p>
        <p type="p">104:閥塊</p>
        <p type="p">120:氣體儲層氣體管線</p>
        <p type="p">122:氣體分配盤氣體管線</p>
        <p type="p">124:閥塊氣體管線</p>
        <p type="p">126:氣體分配盤</p>
        <p type="p">200:處理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2181" publication-number="202618885">
    <tif-files tif-type="multi-tif">
      <tif file="114135421.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及具備其之基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/027</main-classification>
        <further-classification edition="200601120260122B">B08B5/04</further-classification>
        <further-classification edition="200601120260122B">B05C11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西山耕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIYAMA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係構成為，外部氣體經由位於外錐部15b與旋轉夾盤8所保持的基板之間的環狀間隙、即第1流路M1，而被吸入至杯體19內之液體回收室N1，液體回收室N1之被吸入的外部氣體係經由位於中壁部23與下杯體30中之下壁部31之間的圓筒形狀間隙、即第2流路M2，而被吸入至氣體回收室N2，並從排氣開口30a排出，並且構成為，第2流路M2之流路截面積與第1流路M1之截面積相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">8:旋轉夾盤</p>
        <p type="p">15:上杯體</p>
        <p type="p">20:中杯體</p>
        <p type="p">22:內錐部</p>
        <p type="p">23:中壁部</p>
        <p type="p">25:嵌合壁部</p>
        <p type="p">26:圓筒壁部</p>
        <p type="p">30:下杯體</p>
        <p type="p">30a:排氣開口</p>
        <p type="p">31:下壁部</p>
        <p type="p">35:外框體</p>
        <p type="p">37:內框體</p>
        <p type="p">61:軸保持構件</p>
        <p type="p">62:支撐構件</p>
        <p type="p">N1:液體回收室</p>
        <p type="p">N2:氣體回收室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2182" publication-number="202617954">
    <tif-files tif-type="multi-tif">
      <tif file="114135430.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產業洗淨用組成物及洗淨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C11D1/22</main-classification>
        <further-classification edition="200601120260202B">C11D1/72</further-classification>
        <further-classification edition="200601120260202B">C11D3/20</further-classification>
        <further-classification edition="200601120260202B">C11D17/00</further-classification>
        <further-classification edition="200601120260202B">B08B3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井孝德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>照沼良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERUNUMA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田裕輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供包含3-甲基-1,3-丁二醇、界面活性劑及水的產業洗淨用組成物及使用該產業洗淨用組成物的洗淨方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2183" publication-number="202617955">
    <tif-files tif-type="multi-tif">
      <tif file="114135431.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗淨劑及洗淨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C11D1/22</main-classification>
        <further-classification edition="200601120260127B">C11D1/72</further-classification>
        <further-classification edition="200601120260127B">C11D3/20</further-classification>
        <further-classification edition="200601120260127B">C11D17/00</further-classification>
        <further-classification edition="200601120260127B">B08B3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井孝德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>照沼良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERUNUMA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係包含通式(1)表示之化合物(I)的洗淨劑以及使用該洗淨劑的洗淨方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2184" publication-number="202618130">
    <tif-files tif-type="multi-tif">
      <tif file="114135444.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135444</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手槍握把式電動氣泵工具</chinese-title>
        <english-title>PISTOL-GRIP STYLE ELECTRIC AIR PUMP TOOLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">F04B35/04</main-classification>
        <further-classification edition="200601120260129B">F04B39/10</further-classification>
        <further-classification edition="200601120260129B">F04B39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商實耐寶公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNAP-ON INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　丹特　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, DANTE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加貝　尼古拉斯　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GABBEY, NICHOLAS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾　喬治　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALL, GEORGE R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種手槍握把式工具，包括由電動馬達驅動的氣泵、以及可操作地聯接至馬達以操作馬達的觸發器。該工具還可以包括可移除地聯接至氣泵的儲存器，並且適於接收諸如電池組的可移除的電源。該工具可以用於對車輛或其它機器內的系統或部件進行測試和診斷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pistol-grip style tool that includes an air pump driven by an electric motor, and a trigger operably coupled to the motor to operate the motor. The tool may also include a reservoir that removably couples to the air pump, and be adapted to receive a removable power source, such as a battery pack. The tool may be used to perform tests and diagnostics on systems or parts within a vehicle or other machine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工具</p>
        <p type="p">102:殼體</p>
        <p type="p">106:氣泵</p>
        <p type="p">108:觸發器</p>
        <p type="p">110:儲存器</p>
        <p type="p">112:馬達殼體部分</p>
        <p type="p">114:手柄殼體部分</p>
        <p type="p">116:電源接收端</p>
        <p type="p">118:電池組</p>
        <p type="p">124:第一泵連接件</p>
        <p type="p">132:腔室</p>
        <p type="p">134:第一儲存器連接器</p>
        <p type="p">136:第二儲存器連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2185" publication-number="202617680">
    <tif-files tif-type="multi-tif">
      <tif file="114135466.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶配向劑、液晶配向膜、及使用其之液晶顯示元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C229/64</main-classification>
        <further-classification edition="200601120260202B">C08G73/10</further-classification>
        <further-classification edition="200601120260202B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川和典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本佳道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, YOSHIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的係提供一種液晶配向膜，其即使製作液晶配向膜時的燒製步驟之溫度低，亦可在藉由利用聚醯亞胺之光分解反應之光配向處理所得之液晶顯示元件中，抑制藉由光分解而產生之聚醯亞胺之分解物。尤其從ESG、SDGs的觀點來看，本發明之目的係可削減消耗能量。再者，本發明之目的係提供一種用來製作該液晶配向膜之液晶配向劑、及具有該液晶配向膜之液晶顯示元件。&lt;br/&gt;  一種液晶配向劑，其含有選自具有下述式[1]之結構之聚醯亞胺前驅物及聚醯亞胺的至少1種聚合物，&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="150px" width="599px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (上述式中的各記號之意義係如說明書所定義)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:橫向電場液晶顯示元件</p>
        <p type="p">2:梳齒電極基板</p>
        <p type="p">2a:基板</p>
        <p type="p">2b:線狀電極</p>
        <p type="p">2c:液晶配向膜</p>
        <p type="p">3:液晶</p>
        <p type="p">4:對向基板</p>
        <p type="p">4a:液晶配向膜</p>
        <p type="p">4b:基板</p>
        <p type="p">L:電力線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2186" publication-number="202618598">
    <tif-files tif-type="multi-tif">
      <tif file="114135470.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618598</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加密檔案中資料存取之安全控制</chinese-title>
        <english-title>SECURE CONTROL OF ACCESS TO DATA IN AN ENCRYPTED FILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260113B">G06F21/62</main-classification>
        <further-classification edition="201301120260113B">G06F21/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商諾斯洛普葛魯門系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORTHROP GRUMMAN SYSTEMS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾伊　布萊恩　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOE, BRIAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿菲尼達德　弗朗西斯　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AFINIDAD, FRANCIS B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾伊　霍普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOE, HOPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉茨　史蒂文　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RATTS, STEVEN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種行動運算平台的安全客戶端向金鑰伺服器發送對密鑰之請求。該請求包括表徵節點之環境的當前狀態的環境資料，並與該金鑰伺服器建立密碼心跳。該安全客戶端從該金鑰伺服器接收密鑰，將該密鑰儲存於揮發性記憶體中，並使用該密鑰解密加密檔案以在該揮發性記憶體中創建解密檔案。該安全客戶端監測從接收到最後一個經過認證的心跳訊息以來的時間。回應於該時間超過預定的超時窗口或回應於從該金鑰伺服器接收到指示該解密檔案的授權被撤銷的訊息或回應於判定該節點不在授權環境中，該安全客戶端從該揮發性記憶體中刪除該密鑰並關閉該解密檔案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A security client of a mobile computing platform transmits a request for the secret key to a key server. The request includes environmental data characterizing a current state of the environment of the node and establishes a cryptographic heartbeat with the key server. The security client receives a secret key from the key server, stores the secret key in volatile memory and decrypts the encrypted file using the secret key to create a decrypted file in the volatile memory. The security client monitors a time since a last authenticated heartbeat message was received. Responsive to the time exceeding a predetermined timeout window or responsive to receiving a message from the key server indicating that authorization to the decrypted file is revoked or responsive to determining that the node is not in an authorized environment, the security client deletes the secret key from the volatile memory and closes the decrypted file.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:ODKMS</p>
        <p type="p">104:行動運算平台</p>
        <p type="p">108:節點</p>
        <p type="p">112:環境感測器</p>
        <p type="p">120:揮發性記憶體</p>
        <p type="p">124:非揮發性記憶體</p>
        <p type="p">128:處理器</p>
        <p type="p">130:網路</p>
        <p type="p">134:金鑰伺服器</p>
        <p type="p">136:加密檔案</p>
        <p type="p">138:金鑰</p>
        <p type="p">142:安全客戶端</p>
        <p type="p">146:密鑰</p>
        <p type="p">150:安全通訊通道</p>
        <p type="p">152:計時器</p>
        <p type="p">153:資料消費模組</p>
        <p type="p">154:認證引擎</p>
        <p type="p">158:解密檔案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2187" publication-number="202618415">
    <tif-files tif-type="multi-tif">
      <tif file="114135484.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有三維曲面部之調光膜及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G02F1/13</main-classification>
        <further-classification edition="200601120260128B">G02F1/1334</further-classification>
        <further-classification edition="200601120260128B">H01B5/14</further-classification>
        <further-classification edition="201901120260128B">B32B7/02</further-classification>
        <further-classification edition="200601120260128B">B29D11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小橋正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBASHI, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚雅徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾込大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGOMI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種調光膜，其依序包含第一透明導電膜、含有高分子基質及液晶成分之調光層、及第二透明導電膜，且具有三維曲面部，上述第一透明導電膜包含第一樹脂基材及配置於上述第一樹脂基材之上述調光層側之第一電極層，上述第二透明導電膜包含第二樹脂基材及配置於上述第二樹脂基材之上述調光層側之第二電極層，上述第一透明導電膜及上述第二透明導電膜之上述三維曲面部之中央部之厚度平均值相對於端部之厚度平均值之比率為97%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一透明導電膜</p>
        <p type="p">12:第一樹脂基材</p>
        <p type="p">14:第一電極層</p>
        <p type="p">20:調光層</p>
        <p type="p">30:第二透明導電膜</p>
        <p type="p">32:第二樹脂基材</p>
        <p type="p">34:第二電極層</p>
        <p type="p">100:調光膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2188" publication-number="202618015">
    <tif-files tif-type="multi-tif">
      <tif file="114135487.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消耗部件之塗層用成膜裝置、及具有含矽的膜之消耗部件的製造方法</chinese-title>
        <english-title>FILM FORMING APPARATUS FOR COATING CONSUMABLE PART, AND METHOD FOR MANUFACTURING CONSUMABLE PART HAVING FILM CONTAINING SILICON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260126B">C23C4/067</main-classification>
        <further-classification edition="201601120260126B">C23C4/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永関一也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASEKI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤道茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MICHISHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於抑制氧化而成膜。  &lt;br/&gt;本發明之成膜裝置之排氣部將腔室內減壓至特定之真空度。保持部配置於腔室內，保持成膜對象構件。供給部對上述成膜對象構件之表面供給包含矽之成膜材料。熱源能夠於特定之真空度下進行加熱而將所供給之成膜材料熔融。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A film forming apparatus is disclosed. The apparatus comprises a chamber; an exhaust unit configured to reduce the pressure in the chamber to a predetermined vacuum level; a holder disposed in the chamber and configured to hold a film forming target member on which a film is to be formed; a supply unit configured to supply a film forming material containing silicon to a surface of&lt;b/&gt;the film forming target member; and a heat source configured to perform heating at the predetermined vacuum level to melt the supplied film forming material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:供給部</p>
        <p type="p">31:收容部</p>
        <p type="p">32:筒</p>
        <p type="p">32a:供給口</p>
        <p type="p">33:節流機構</p>
        <p type="p">40a:電子束</p>
        <p type="p">P:構件</p>
        <p type="p">S1:矽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2189" publication-number="202617051">
    <tif-files tif-type="multi-tif">
      <tif file="114135491.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水臭氧衛生處理系統</chinese-title>
        <english-title>AQUA-OZONE HYGIENIZATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">A47L25/00</main-classification>
        <further-classification edition="202301120260116B">C02F1/78</further-classification>
        <further-classification edition="200601120260116B">C01B13/11</further-classification>
        <further-classification edition="200601120260116B">A61L2/20</further-classification>
        <further-classification edition="200601120260116B">A61L9/015</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百特環保科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOTEK ENVIRONMENTAL SCIENCE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, GAVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐名勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MAXWELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蒙斯　達倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMMONS, DARREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朗戈　艾弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONGO, IVOR J. J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾斯　布羅克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLLS, H. BROCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種水臭氧衛生處理系統，包括一個用於容納待處理物品的水箱。該系統允許用戶在三種衛生處理方法之間進行選擇：非潤濕霧化噴霧(用於除臭)；潤濕噴霧(用於消毒)；浸泡(用於全面淨化、除臭和消毒)。水箱內設有一個平臺，在平臺下方形成水儲槽，並提供頂部表面用於放置物品。系統包括一個電化學發生器，可由水產生臭氧濃縮液，該液體通過迴圈泵從水儲槽中抽取。連接於電化學發生器的噴嘴可切換，將臭氧濃縮液以霧化噴霧或噴射噴霧方式分配。在操作過程中，根據所選的處理方法，液體會被霧化或噴射到物品表面，或在平臺上積聚以浸泡物品。本發明旨在提供靈活且全面的衛生處理選項，可適應多種需求和應用場景，滿足現代生活方式對效率、安全性和便利性的要求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aqua-ozone hygienization system is disclosed, including a tank configured to hold an item for treatment. The system enables user selection between three hygienization methods: a non-wetting atomized mist for deodorization, a wetting spray for disinfection, or an immersion for comprehensive purification, deodorization, and disinfection. A platform within the tank forms a water reservoir beneath it and provides a top surface for item placement. The system includes an electrochemical generator that produces ozonated concentrate liquid from water, supplied by a circulating pump drawing from the reservoir. A nozzle connected to the electrochemical generator is switchable between dispensing the ozonated concentrate liquid as either an atomized mist or spray. During operation, the liquid is either misted or sprayed onto the item, or accumulates on the platform to immerse the item, depending on the selected treatment method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:水臭氧衛生處理系統</p>
        <p type="p">102:噴嘴</p>
        <p type="p">104:水箱</p>
        <p type="p">118:臭氧濃縮液</p>
        <p type="p">142:平臺</p>
        <p type="p">144:外部容器</p>
        <p type="p">202A:毛巾</p>
        <p type="p">202B:襯衫或上衣</p>
        <p type="p">202C:運動服</p>
        <p type="p">202D:運動服</p>
        <p type="p">210:健身器材</p>
        <p type="p">304:用戶</p>
        <p type="p">402:放置</p>
        <p type="p">404:放置</p>
        <p type="p">406:放置</p>
        <p type="p">408:注入</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2190" publication-number="202619312">
    <tif-files tif-type="multi-tif">
      <tif file="114135497.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>執行無儀器校準的方法與裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PERFORMING INSTRUMENT-FREE CALIBRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260127B">H04B17/11</main-classification>
        <further-classification edition="201501120260127B">H04B17/21</further-classification>
        <further-classification edition="200601120260127B">G01R31/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奇燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-TSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭介勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIEH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾柏森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, PO-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯　振偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, JEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包括第一集成電路和第二集成電路。該第一集成電路包括一測試音訊號產生電路，用於在校準過程中產生測試音訊號。從該第一集成電路輸出的第一測試訊號是根據該測試音訊號產生的。該第二集成電路包括一功率檢測電路，用於對第二測試訊號進行功率檢測以在校準過程中產生功率檢測值。該第二測試訊號是從該第一測試訊號衍生的，且至少一個該第一集成電路和該第二集成電路的校準是基於該功率檢測值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a first integrated circuit and a second integrated circuit. The first integrated circuit includes a test tone generator circuit used to generate a test tone signal during a calibration procedure. A first test signal output from the first integrated circuit is generated according to the test tone signal. The second integrated circuit includes a power detector circuit used to perform power detection upon a second test signal for generating a power detection value during the calibration procedure. The second test signal is derived from the first test signal, and calibration of at least one of the first integrated circuit and the second integrated circuit is based on the power detection value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">102:調製解調器</p>
        <p type="p">104:中頻集成電路(IF IC)</p>
        <p type="p">106:毫米波集成電路(mmW IC)</p>
        <p type="p">108:非揮發性記憶體</p>
        <p type="p">110、112:介面</p>
        <p type="p">114、116:放大器電路</p>
        <p type="p">118:測試音訊號產生電路(TTG)</p>
        <p type="p">120:功率檢測電路(PD)</p>
        <p type="p">LUT:增益表</p>
        <p type="p">S&lt;sub&gt;TT&lt;/sub&gt;:測試音訊號</p>
        <p type="p">S&lt;sub&gt;T1&lt;/sub&gt;、S&lt;sub&gt;T2&lt;/sub&gt;:測試訊號</p>
        <p type="p">X、Y:功率檢測值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2191" publication-number="202617515">
    <tif-files tif-type="multi-tif">
      <tif file="114135509.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人力驅動載具之電源供應裝置</chinese-title>
        <english-title>POWER SUPPLY DEVICE FOR HUMAN-POWERED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260121B">B62M6/80</main-classification>
        <further-classification edition="201001120260121B">B62M6/90</further-classification>
        <further-classification edition="202001120260121B">B62J43/00</further-classification>
        <further-classification edition="202001120260121B">B62J45/00</further-classification>
        <further-classification edition="202001120260121B">B62J45/20</further-classification>
        <further-classification edition="202001120260121B">B62J50/20</further-classification>
        <further-classification edition="202001120260121B">B62J99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三島栄治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHIMA, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎陵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬野尾宣久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENOO, NORIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於人力驅動載具之電源供應裝置。該電源供應裝置包括一基座、一第一電連接埠、一第二電連接埠及一第三電連接埠。該第一電連接埠設置到該基座，該第一電連接埠具有一第一連接組態。該第二電連接埠設置到該基座，並具有一第二連接組態。該第三電連接埠設置到該基座，並具有一第三連接組態。該第一連接組態、該第二連接組態及該第三連接組態具有相同形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">14:基座</p>
        <p type="p">24:殼體</p>
        <p type="p">26:端蓋</p>
        <p type="p">42:第一電纜線</p>
        <p type="p">42a,44a,46a,80:第一電連接器</p>
        <p type="p">44:第二電纜線</p>
        <p type="p">46:第三電纜線</p>
        <p type="p">50:第一電連接埠</p>
        <p type="p">52:第二電連接埠</p>
        <p type="p">54:第三電連接埠</p>
        <p type="p">60:第一接受孔</p>
        <p type="p">62:第二接受孔</p>
        <p type="p">64:第三接受孔</p>
        <p type="p">70:第一連接組態</p>
        <p type="p">72:第二連接組態</p>
        <p type="p">74:第三連接組態</p>
        <p type="p">82:第二電連接器</p>
        <p type="p">84:第三電連接器</p>
        <p type="p">A1:縱向</p>
        <p type="p">D1:第一方向</p>
        <p type="p">d1:第一最大直徑</p>
        <p type="p">d2:第二最大直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2192" publication-number="202618554">
    <tif-files tif-type="multi-tif">
      <tif file="114135519.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135519</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F11/10</main-classification>
        <further-classification edition="200601120251201B">G11C7/06</further-classification>
        <further-classification edition="200601120251201B">G06F7/487</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張欽鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜彥寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YEN-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁洛銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, LOCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於管理記憶體內計算裝置故障的系統、裝置、方法、及電路。記憶體裝置包含：複數個記憶體單元及用以在記憶體單元中執行計算指令的電路系統。記憶體單元包含：記憶體單元陣列及包含耦接至記憶體單元陣列的複數個子電路的周邊電路。每個子電路包含：內部感測放大器、鎖存器及乘法器。電路系統用以：藉由外部的外部感測放大器判斷子電路中的內部感測放大器、鎖存器、或乘法器中的至少一者是否有缺陷來判斷子電路是否有缺陷，並且響應於判斷子電路有缺陷，執行一或多個對應動作，包含將用周邊電路中的冗餘子電路替換子電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, devices, methods, and circuits for managing failures of in-memory computing devices. An example memory device includes: a plurality of memory units and a circuitry configured for execution of a computing instruction in one or more memory units. A memory unit includes: a memory cell array and a peripheral circuit including a plurality of subcircuits coupled to the memory cell array. Each subcircuit includes: one or more internal sense amplifiers, one or more latches, and one or more multipliers. The circuitry is configured to: determine whether a subcircuit is defective by determining whether at least one of an internal sense amplifier, a latch, or a multiplier in the subcircuit is defective using an external sense amplifier external to the memory unit, and in response to determining that the subcircuit is defective, perform one or more corresponding actions including replacing the subcircuit with a redundant subcircuit in the peripheral circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:記憶體裝置</p>
        <p type="p">112:控制器</p>
        <p type="p">114:介面</p>
        <p type="p">116:控制電路系統</p>
        <p type="p">118:配置暫存器</p>
        <p type="p">120:主機裝置</p>
        <p type="p">132:記憶體組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2193" publication-number="202617506">
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      <tif file="114135522.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617506</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纖維核心握持器</chinese-title>
        <english-title>FIBER CORE GRIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B62K21/26</main-classification>
        <further-classification edition="200601120260102B">D03D7/00</further-classification>
        <further-classification edition="200601120260102B">D03D1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商福克斯制造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德魯　傅雷瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREW, FRASER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有可撓性核心的纖維核心握持器。該纖維核心握持器包括由一彈性材料及一可撓性核心（諸如可撓性編織核心）形成的一握持構件。該可撓性編織核心包括具有延伸通過其中的一孔隙的一第一端蓋及一第二端蓋。該可撓性編織核心亦包括以一螺旋形狀編織在一起的複數個纖維以在該複數個纖維之間建立空間，且為該可撓性編織核心提供小於約100%的一填充容量。該握持構件可耦接至該可撓性編織核心，且當該纖維核心握持器耦接至一車把時，該握持構件穿透過該複數個纖維之間的該等空間並接觸該車把。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fiber core grip with a flexible core is provided. The fiber core grip includes a grip member formed of an elastomeric material and a flexible core, such as a flexible woven core. The flexible woven core includes a first end cap having an aperture extending -therethrough and a second end cap. The flexible woven core also includes a plurality of fibers woven together in a helix shape to create spaces between the plurality of fibers and provide the flexible woven core with a fill capacity of less than about 100%. The grip member may be coupled to the flexible woven core, and the grip member penetrates through the spaces between the plurality of fibers and contacts a handlebar when the fiber core grip is coupled to the handlebar.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:纖維核心握持器</p>
        <p type="p">12:握持構件</p>
        <p type="p">20:可撓性編織核心</p>
        <p type="p">22:纖維</p>
        <p type="p">24:空間</p>
        <p type="p">26:第一端蓋</p>
        <p type="p">28:第二端蓋</p>
        <p type="p">29:環形截頭圓錐形構件</p>
        <p type="p">31:軸向分離鎖定式環</p>
        <p type="p">32:開槽部分</p>
        <p type="p">34:緊固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2194" publication-number="202618549">
    <tif-files tif-type="multi-tif">
      <tif file="114135525.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618549</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置、記憶體系統及資料輸出方法</chinese-title>
        <english-title>MEMORY DEVICE, MEMORY SYSTEM AND DATA OUTPUTTING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F9/302</main-classification>
        <further-classification edition="200601120251201B">G06F3/06</further-classification>
        <further-classification edition="200601120251201B">G06F7/487</further-classification>
        <further-classification edition="200601120251201B">G06F7/485</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張欽鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范振嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯思宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, SZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張坤龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUEN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置，包含多個記憶體單元及控制器。控制器耦接至多個記憶體單元，且用以對多個記憶體單元中的輸入資料執行運算指令。多個記憶體單元用以儲存資料、自控制器接收輸入資料，並根據來自控制器的運算指令對輸入資料及儲存資料依序執行多個運算操作，以產生多個運算結果至控制器。控制器用以：控制多個記憶體單元依序執行多個運算操作中的第一運算操作及第二運算操作；儲存對應於第一運算操作的第一運算結果；輸出第一運算結果；以及在輸出第一運算結果時，儲存對應於第二運算操作的第二運算結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device is provided in the present disclosure. The memory device comprises a plurality of memory units and a controller. The controller is coupled to the plurality of memory units and is configured to perform a computing instruction on the plurality of memory units. The plurality of memory units are configured to store data, receive input data from the controller, and sequentially perform a plurality of computing operations on the input data and stored data according to the computing instruction from the controller, so as to generate a plurality of computing results to the controller. The controller is configured to: control the plurality of memory units to sequentially perform a first computing operation and a second computing operation of the plurality of computing operations; store a first computing result corresponding to the first computing operation; output the first computing result; and during outputting the first computing result, store a second computing result corresponding to the second computing operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:記憶體裝置</p>
        <p type="p">112:控制器</p>
        <p type="p">114:介面</p>
        <p type="p">116:控制電路</p>
        <p type="p">118:組態暫存器</p>
        <p type="p">120:主機裝置</p>
        <p type="p">132:記憶體組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2195" publication-number="202618106">
    <tif-files tif-type="multi-tif">
      <tif file="114135542.zip" no="1">
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      <volno>24</volno>
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        <document-id>
          <doc-number>202618106</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>屈曲約束支撐件及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">E04B1/98</main-classification>
        <further-classification edition="200601120260131B">E04C5/00</further-classification>
        <further-classification edition="200601120260131B">E04H9/02</further-classification>
        <further-classification edition="200601120260131B">F16F15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商傑富意希必路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE CIVIL ENGINEERING &amp; CONSTRUCTION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸張涼太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBARI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩田啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOTA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辰巳信二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATSUMI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田孝人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TAKATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種屈曲約束支撐件及其製造方法，其中藉由對屈曲約束支撐件的軸力管、和設置於軸力管的兩端部且與建築結構物的主體接合的接合構件的接合部位的形狀進行研究，從而提高基於軸力管的能量吸收性能，容易於工廠製作。一種屈曲約束支撐件，具有：軸力管，承載軸力；加強管，以覆蓋所述軸力管的外周的方式於內部插入所述軸力管；一組端部板，以封閉所述軸力管的兩端部的方式與該兩端部接合；以及一組十字板，經由所述端部板與所述軸力管的兩端部接合且成為向建築結構物的主體的固定部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:屈曲約束支撐件</p>
        <p type="p">11:軸力管</p>
        <p type="p">12:加強管</p>
        <p type="p">13:端部板</p>
        <p type="p">14:十字板</p>
        <p type="p">15:塞焊縫(加強管固定部)</p>
        <p type="p">21:框架側十字板</p>
        <p type="p">22:拼接板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2196" publication-number="202617672">
    <tif-files tif-type="multi-tif">
      <tif file="114135584.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法、鎓鹽化合物及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C07C69/736</main-classification>
        <further-classification edition="200601120251103B">C07C309/12</further-classification>
        <further-classification edition="200601120251103B">C07C381/12</further-classification>
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        <further-classification edition="200601120251103B">G03F7/004</further-classification>
        <further-classification edition="200601120251103B">G03F7/039</further-classification>
        <further-classification edition="200601120251103B">G03F7/20</further-classification>
        <further-classification edition="200601120251103B">G03F7/32</further-classification>
        <further-classification edition="200601120251103B">H01L21/027</further-classification>
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              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織克聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>中川淳史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>江崎郁哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESAKI, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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      <isu-abst lang="tw">
        <p type="p">本發明提供一種於圖案形成時感度、CDU及Min CD優異的感放射線性組成物等。一種感放射線性組成物，含有：聚合物，包含具有酸解離性基的結構單元（I）；以及溶劑，所述感放射線性組成物中，至少所述感放射線性組成物含有具有下述式（a）所表示的部分結構（a）且藉由曝光而產生酸的鎓鹽化合物（1），或者所述聚合物具有下述式（a）所表示的部分結構（a）。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="268px" width="544px" file="ed10072.JPG" alt="ed10072.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;為酸解離性基；L&lt;sup&gt;1&lt;/sup&gt;為二價鏈狀有機基；Ar為碳數3～20的芳香環；L&lt;sup&gt;2&lt;/sup&gt;為單鍵或（y+2）價的有機基；W&lt;sup&gt;-&lt;/sup&gt;為-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;或-COO&lt;sup&gt;-&lt;/sup&gt;；Z&lt;sup&gt;+&lt;/sup&gt;為一價鎓陽離子；n1+n2≧1；x及y為0或1；於L&lt;sup&gt;2&lt;/sup&gt;為單鍵的情況下，y為0，於所述聚合物中的所述部分結構（a）中，x+y為1或2）</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135596</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/304</main-classification>
        <further-classification edition="200601120260131B">B24B49/02</further-classification>
        <further-classification edition="200601120260131B">B24B49/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
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              <chinese-name name-type="organization">
                <last-name>宮﨑充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外崎宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOTOZAKI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠實現測定工序的最優化的基板處理裝置。基板處理裝置具備：裝卸部，該裝卸部與殼體的正面側外壁相鄰地橫向排列配置複數個裝載埠；以及上層測定模組和下層測定模組，該上層測定模組和下層測定模組與殼體的側面側外壁相鄰且沿鉛垂方向排列配置，並且用於測定基板的表面狀態，該側面側外壁與前述的正面側外壁連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">55:輸送機械手</p>
        <p type="p">56:水平移動機構</p>
        <p type="p">57:上下移動機構</p>
        <p type="p">100:盒存儲裝置(輸送容器)</p>
        <p type="p">200:測定單元</p>
        <p type="p">201:基板輸送位置</p>
        <p type="p">202:基板接受位置</p>
        <p type="p">301:收容框架</p>
        <p type="p">D1:控制部</p>
        <p type="p">D2:測定部</p>
        <p type="p">FL:地板</p>
        <p type="p">ML:上層測定模組、下層測定模組</p>
        <p type="p">LC:下部收容空間</p>
        <p type="p">PL:殼體</p>
        <p type="p">PL1:第一外壁(正面側外壁)</p>
        <p type="p">PL2:第二外壁(側面側外壁)</p>
        <p type="p">UC:上部收容空間</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2198" publication-number="202618886">
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        <document-id>
          <doc-number>114135619</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/027</main-classification>
        <further-classification edition="200601120260126B">H01L21/02</further-classification>
        <further-classification edition="200601120260126B">C23C16/455</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板垣雄翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAGAKI, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都築伶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUZUKI, REIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吾
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMITOMO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本治士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, HARUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBASHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">[課題]提供一種形成具有與光阻膜之開口圖案反轉的圖案之金屬含有膜的技術。  &lt;br/&gt;　　[解決手段]根據本公開之一態樣的基板處理方法，包括：(a)準備具有底層膜與配置於上述底層膜上且形成有第1開口圖案之光阻膜的基板的工程；(b)供給包含金屬含有前驅物之原料氣體，在低於上述金屬含有前驅物之沸點的溫度下，將包含上述金屬含有前驅物所含之金屬的流動膜填充於上述第1開口圖案的開口部中，之後，藉由硬化上述流動膜而在上述開口部上形成金屬含有膜的工程；以及(c)移除上述光阻膜，形成具有與上述第1開口圖案反轉的第2開口圖案之上述金屬含有膜的工程。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳奈米管結構體</chinese-title>
        <english-title>CARBON NANOTUBE STRUCTURAL BODY</english-title>
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        <main-classification edition="201701120260128B">C01B32/16</main-classification>
        <further-classification edition="200601120260128B">B82B1/00</further-classification>
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        <further-classification edition="201301120260128B">H01G11/10</further-classification>
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                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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        </applicants>
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          <inventor app-type="applicant" sequence="1">
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                <last-name>金世雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SE UN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>李良勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YANG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>KR</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>河炳旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, BYEONG UK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金槿映</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>KIM, GEUN YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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                <last-name>車志熏</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHA, JI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>KR</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洗瑗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種碳奈米管結構體，其中碳奈米管結構體的平均抗壓強度與平均體密度滿足特定相關性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a carbon nanotube structural body in which the average compressive strength and the average bulk density of the carbon nanotube structural body satisfy a certain correlation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用於製造碳奈米管結構體的設備</p>
        <p type="p">110:螺桿進料機</p>
        <p type="p">120:壓縮機</p>
        <p type="p">121,122:滾輪</p>
        <p type="p">121a,122a:突起</p>
        <p type="p">121b,122b:溝槽</p>
        <p type="p">130:容置槽</p>
        <p type="p">131:容置部分</p>
        <p type="p">140:振盪器</p>
        <p type="p">150:漏斗</p>
        <p type="p">160:永久磁鐵</p>
        <p type="p">180:磁分離器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2200" publication-number="202619397">
    <tif-files tif-type="multi-tif">
      <tif file="114135651.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理無線通訊系統中的資源的無線通訊方法及通訊裝置</chinese-title>
        <english-title>WIRELESS COMMUNICATION METHOD AND COMMUNICATION DEVICE FOR HANDLING RESOURCE IN A WIRELESS COMMUNICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260127B">H04W72/54</main-classification>
        <further-classification edition="202301120260127B">H04W72/23</further-classification>
        <further-classification edition="202301120260127B">H04W72/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐永霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏宏宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一通訊裝置的無線通訊方法，包含有：透過一第一通道，與一網路端執行至少一通訊運作；以及根據一指示、一時間約束及一干擾條件中至少一者，在一第二通道上運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication method of a communication device comprises: performing at least one communication operation with a network via a first channel (CH); and operating on a second CH according to at least one of an indication, a temporal constraint, and an interference condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流程</p>
        <p type="p">1000,1002,1004,1006:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2201" publication-number="202617900">
    <tif-files tif-type="multi-tif">
      <tif file="114135652.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電性油墨、銅鎳燒結膜的製造方法及銅鎳燒結膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260202B">C09D11/52</main-classification>
        <further-classification edition="200601120260202B">H01B1/22</further-classification>
        <further-classification edition="200601120260202B">H01B5/00</further-classification>
        <further-classification edition="200601120260202B">H01B13/00</further-classification>
        <further-classification edition="200601120260202B">H05K1/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬鑛山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸倉凜太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKURA, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>半澤和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANZAWA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狩敦
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGARI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能形成低體積電阻率之金屬配線的導電性油墨、銅鎳燒結膜的製造方法，及銅鎳燒結膜。  &lt;br/&gt;　　一種導電性油墨，其包含銅粒子、銅錯合物及鎳錯合物，前述銅錯合物為Cu(HCOO)&lt;sub&gt;2&lt;/sub&gt;(L)&lt;sub&gt;m&lt;/sub&gt;所示之錯合物，前述鎳錯合物為Ni(HCOO)&lt;sub&gt;2&lt;/sub&gt;(L)&lt;sub&gt;n&lt;/sub&gt;所示之錯合物，前述L為選自2-胺基-2-甲基-1-丙醇、1-胺基-2-丙醇、2-胺基-1-丁醇、2-(甲基胺基)乙醇、2-胺基乙醇之至少任一個，前述m為2~6之自然數，前述n為2~6之自然數，相對於前述銅粒子與前述銅錯合物所包含的銅的合計，前述銅錯合物所包含的銅的比例為0.5質量%~15.0質量%，相對於前述銅粒子與前述銅錯合物所包含的銅與前述鎳錯合物所包含的鎳的合計，前述鎳錯合物所包含的鎳的比例為0.5質量%~7.0質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2202" publication-number="202617001">
    <tif-files tif-type="multi-tif">
      <tif file="114135670.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>椅具</chinese-title>
        <english-title>CHAIR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47D1/02</main-classification>
        <further-classification edition="200601120260130B">A47D1/04</further-classification>
        <further-classification edition="200601120260130B">A47C7/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡問渠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WENQU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種椅具，包括椅具本體和能夠連接於所述椅具本體的支撐腿，所述椅具本體的下部和所述支撐腿的上部中的一者設置有安裝部，另一者設置有插接部，所述插接部能夠沿著插接方向插接於所述安裝部以將所述支撐腿安裝到所述椅具本體，其中，所述安裝部的周向側壁的內表面上設置有朝向內部突起的緊配肋，當所述插接部插接於所述安裝部時，所述緊配肋發生彈性變形而抵靠於所述插接部與所述安裝部的周向側壁之間，從而將所述支撐腿穩固地安裝到所述椅具本體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a chair, including a chair body and support legs connectable to the chair body. One of a lower part of the chair body and an upper part of the support legs is provided with a mounting part, and the other of the lower part of the chair body and the upper part of the support legs is provided with an insertion part. The insertion part is insertable into the mounting part along an insertion direction to mount the support legs to the chair body. A tight-fitting rib protruding inwardly is provided on an inner surface of a periphery sidewall of the mounting part, and when the insertion part is inserted into the mounting part, the tight-fitting rib undergoes elastic deformation to abut between the insertion part and the periphery sidewall of the mounting part, thereby securely mounting the support legs to the chair body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:安裝部</p>
        <p type="p">110:周向側壁</p>
        <p type="p">120:安裝槽</p>
        <p type="p">130:緊配肋</p>
        <p type="p">140:抵接塊</p>
        <p type="p">150:防呆肋</p>
        <p type="p">160:鎖定孔</p>
        <p type="p">170:底壁</p>
        <p type="p">W:厚度方向</p>
        <p type="p">H:高度方向</p>
        <p type="p">D:深度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2203" publication-number="202617846">
    <tif-files tif-type="multi-tif">
      <tif file="114135694.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯分解用組成物、聚酯分解物的製造方法、以及聚酯製造方法</chinese-title>
        <english-title>COMPOSITION FOR POLYESTER DECOMPOSITION, METHOD FOR PRODUCING POLYESTER DECOMPOSITION PRODUCT, AND METHOD FOR PRODUCING POLYESTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C08J11/02</main-classification>
        <further-classification edition="200601120260127B">C08J11/04</further-classification>
        <further-classification edition="200601120260127B">C08L67/03</further-classification>
        <further-classification edition="200601120260127B">C08J11/26</further-classification>
        <further-classification edition="200601120260127B">C08G63/183</further-classification>
        <further-classification edition="200601120260127B">C08G63/189</further-classification>
        <further-classification edition="200601120260127B">C08G64/04</further-classification>
        <further-classification edition="200601120260127B">B29B17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川恵太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高垣和弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGAKI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚酯分解用組成物，其含有鹼、一元醇、碳酸酯、以及以預定的化學式所示之化合物群中之至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition for polyester decomposition, comprising an alkali, a monohydric alcohol, a carbonate, and at least one compound selected from the group of compounds represented by the given chemical formula.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2204" publication-number="202618253">
    <tif-files tif-type="multi-tif">
      <tif file="114135705.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135705</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體狀態感測器、液體狀態判斷裝置以及油壓單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G01N21/85</main-classification>
        <further-classification edition="200601120260116B">F16N29/00</further-classification>
        <further-classification edition="200601120260116B">G01N21/01</further-classification>
        <further-classification edition="201901120260116B">F15B21/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清家光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIKE, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綾戸健二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYADO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口陽生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, HARUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北浦雅也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAURA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種液體狀態感測器、液體狀態判斷裝置以及油壓單元，抑制異物引起的誤檢測。</p>
        <p type="p">液體狀態感測器(1)安裝在配管的中途。其包括：連接部(31、32)，其具有對配管的流路進行中繼的主流路(20)；分流部(33a~33c、34、11)，其具有從主流路(20)分歧的迂迴流路(21)；以及檢測部(13)，其檢測穿透在迂迴流路(21)中流動的液體之後的光的顏色。迂迴流路(21)的流路剖面形成為小於主流路(20)的流路剖面，在迂迴流路(21)的側方安裝有檢測部(13)。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:第一感測器(液體狀態感測器)</p>
        <p type="p">10:感測器構件</p>
        <p type="p">11:塊體(光透射部)</p>
        <p type="p">12:感測器殼體</p>
        <p type="p">13:感測器主體(檢測部)</p>
        <p type="p">14:微電腦(判斷部)</p>
        <p type="p">20:主流路</p>
        <p type="p">21:迂迴流路</p>
        <p type="p">30:配管構件</p>
        <p type="p">31:T配管(連接部)</p>
        <p type="p">32:短管(連接部)</p>
        <p type="p">33a~33c:管路構件(分流部)</p>
        <p type="p">34:軟管(分流部)</p>
        <p type="p">130:分配回油配管(回油配管)</p>
        <p type="p">F:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2205" publication-number="202619501">
    <tif-files tif-type="multi-tif">
      <tif file="114135719.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135719</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶體裝置</chinese-title>
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251202B">H10B80/00</main-classification>
        <further-classification edition="202301120251202B">H10B12/00</further-classification>
        <further-classification edition="202501120251202B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金瑜辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YUJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　珍優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容描述一種半導體記憶體裝置，其包括記憶體胞元、區域位元線、字線、全域位元線、區域位元線多工器及感測放大器。該等記憶體胞元沿著第一、第二及第三方向配置。該等區域位元線及該等字線連接至該等記憶體胞元。該等區域位元線中之各者在該第一方向上延伸。該等字線中之各者在該第三方向上延伸。該等全域位元線安置於該等區域位元線上。該等區域位元線多工器控制該等區域位元線與該等全域位元線之間的電氣連接。該等感測放大器驅動該等區域位元線及該等全域位元線。安置於一相同層級處、在該第二方向上相鄰且連接至不同區域位元線之記憶體胞元電氣連接至一相同字線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor memory device includes memory cells, local bitlines, wordlines, global bitlines, local bitline multiplexers and sense amplifiers. The memory cells are arranged along first, second and third directions. The local bitlines and the wordlines are connected to the memory cells. Each of the local bitlines extends in the first direction. Each of the wordlines extends in the third direction. The global bitlines are disposed on the local bitlines. The local bitline multiplexers control electrical connections between the local bitlines and the global bitlines. The sense amplifiers drive the local bitlines and the global bitlines. Memory cells, which are disposed at a same level, adjacent in the second direction, and connected to different local bitlines, are electrically connected to a same wordline.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GBL11,GBL12,GBL21,GBL22:全域位元線</p>
        <p type="p">LBL11,LBL12,LBL21,LBL22,LBL31,LBL32:區域位元線</p>
        <p type="p">LMUX11,LMUX12,LMUX21,LMUX22,LMUX31,LMUX32:區域位元線多工器</p>
        <p type="p">MC11,MC12:記憶體胞元，胞元串，第一胞元串列</p>
        <p type="p">MC21,MC22:記憶體胞元，胞元串，第二胞元串列</p>
        <p type="p">MC31,MC32:記憶體胞元，胞元串，第三胞元串列</p>
        <p type="p">MC41,MC42:記憶體胞元，胞元串，第四胞元串列</p>
        <p type="p">SA11,SA12,SA21,SA22:感測放大器</p>
        <p type="p">WL11,WL12,WL21,WL22,WL31,WL32:字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2206" publication-number="202617114">
    <tif-files tif-type="multi-tif">
      <tif file="114135727.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>短褲型衛生巾</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251021B">A61F13/496</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大王製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIO PAPER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹澤裕美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEZAWA, HIROMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種短褲型衛生巾，包括：內裝體，其與穿著者的體液排出口相對，並且包含吸收體；外裝體，其前身部分與後身部分成為一體，且形成有腹部開口部及左右一對腿部開口部，並且配置於所述內裝體的非肌膚面側；以及吸汗片，其沿所述穿著者的腹圍配置於所述外裝體的肌膚面側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:短褲型衛生巾</p>
        <p type="p">10:外裝體</p>
        <p type="p">12:內層片</p>
        <p type="p">14E1,14E2:第一方向D1的端部</p>
        <p type="p">15E1,15E2:接合部</p>
        <p type="p">18:腿圍輪廓</p>
        <p type="p">20:內裝體</p>
        <p type="p">23:吸收體</p>
        <p type="p">31,31C,31E1,31E2:腹圍彈性部件</p>
        <p type="p">35:腿圍彈性部件</p>
        <p type="p">40f:前身部分側的吸汗片</p>
        <p type="p">40b:後身部分側的吸汗片</p>
        <p type="p">41f:前身部分側的吸汗片的側緣部</p>
        <p type="p">41b:後身部分側的吸汗片的側緣部</p>
        <p type="p">42:前身部分的側緣部</p>
        <p type="p">43:後身部分的側緣部</p>
        <p type="p">F:前身部分</p>
        <p type="p">B:後身部分</p>
        <p type="p">CL:前後方向中央</p>
        <p type="p">D1:第一方向(前後方向)</p>
        <p type="p">D2:第二方向(左右方向)</p>
        <p type="p">C:中央區域</p>
        <p type="p">E1:前方區域</p>
        <p type="p">E2:後方區域</p>
        <p type="p">L1:接合部的上下方向的長度</p>
        <p type="p">L2:吸汗片的上下方向的長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2207" publication-number="202619008">
    <tif-files tif-type="multi-tif">
      <tif file="114135824.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合工具</chinese-title>
        <english-title>BONDING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/68</main-classification>
        <further-classification edition="200601120260131B">F16F15/00</further-classification>
        <further-classification edition="200601120260131B">G03F9/00</further-classification>
        <further-classification edition="200601120260131B">F16C32/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽格　奧拉夫　約翰內斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIJGER, OLAV JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種接合工具，其包含：一框架；一載物台，其耦接至該框架，其中該載物台包含一可移動部件，該可移動部件經組態以相對於該框架移動，使得施加至該可移動部件之一致動力引起一反作用力；及一平衡機構，其經組態以至少部分地抵消由施加至該可移動部件之該致動力引起之該反作用力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding tool comprises: a frame; a stage coupled to the frame, wherein the stage comprises a movable member configured to move relative to the frame such that an actuation force applied to the movable member causes a reaction force; and a balance mechanism configured to at least partly counteract the reaction force caused by the actuation force applied to the movable member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基座框架</p>
        <p type="p">20:可移動部件</p>
        <p type="p">30:支撐部件</p>
        <p type="p">31:線圈</p>
        <p type="p">41:導引件</p>
        <p type="p">80:基座框架/平衡機構</p>
        <p type="p">81:平衡質量塊</p>
        <p type="p">82:支撐軸承</p>
        <p type="p">86:重力補償器</p>
        <p type="p">202:支撐載物台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2208" publication-number="202617890">
    <tif-files tif-type="multi-tif">
      <tif file="114135828.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性樹脂組成物、磁性糊料、磁性片材及成形體</chinese-title>
        <english-title>MAGNETIC RESIN COMPOSITION, MAGNETIC PASTE, MAGNETIC SHEET AND MOLDED BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08L101/00</main-classification>
        <further-classification edition="200601120260202B">C08L101/12</further-classification>
        <further-classification edition="200601120260202B">C08K3/08</further-classification>
        <further-classification edition="200601120260202B">H01F1/147</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福家直仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUYA, NAOHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村朋史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEMURA, TOMOHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二川優平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUTAKAWA, YUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示課題在於提供一種可同時實現提升磁特性、提升流動性及抑制於硬化物產生之翹曲等變形的磁性樹脂組成物。磁性樹脂組成物含有熱硬化性樹脂(A)、彈性體(B)及磁性填料(C)，前述彈性體(B)包含在25℃下為液狀之熱塑性樹脂(B-1)。熱塑性樹脂(B-1)包含選自於由聚酯多元醇樹脂及(甲基)丙烯酸樹脂所構成群組中之至少1種。相對於磁性樹脂組成物之固體成分總量，彈性體(B)之含量為0.05質量%以上且1.50質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2209" publication-number="202619295">
    <tif-files tif-type="multi-tif">
      <tif file="114135831.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時脈再生電路及串列資料傳輸裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03L7/08</main-classification>
        <further-classification edition="200601120260102B">H04L7/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中智一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種能夠抑制再生時脈之波動的時脈再生電路。  &lt;br/&gt;　　[解決手段]時脈再生電路，係將從已接收之資料進行緩衝的緩衝器輸出資料之時序上所使用的再生時脈，使用鎖相電路內的分頻器的分頻比來加以生成。時脈再生電路係具有：計數器，係隨應於資料的收訊而將計數值予以計數上升，並且隨應於再生時脈而將計數值予以計數下降；和滯後超前濾波器，係以使得從計數值的更新到再生時脈的生成為止的傳遞函數的控制頻帶的低頻頻帶的增益會增幅的方式，對來自計數器的計數值，執行滯後超前濾波器處理；和演算部，係將已被執行過滯後超前濾波器處理的計數值進行所定演算，基於所定演算後的計數值，而將分頻器的分頻比予以算出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:收訊部</p>
        <p type="p">4:資料緩衝器</p>
        <p type="p">5:時脈再生電路</p>
        <p type="p">10:分頻比算出電路</p>
        <p type="p">11:資料計數器</p>
        <p type="p">12:滯後超前濾波器</p>
        <p type="p">13:乘算器</p>
        <p type="p">14:加算器</p>
        <p type="p">20:分數式PLL電路</p>
        <p type="p">21:分數式分頻器</p>
        <p type="p">22:PFD</p>
        <p type="p">23:CP</p>
        <p type="p">24:VCO</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2210" publication-number="202618268">
    <tif-files tif-type="multi-tif">
      <tif file="114135835.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於量測所沉積介電材料之量的系統、設備及裝置</chinese-title>
        <english-title>SYSTEM, APPARATUS, AND DEVICE FOR MEASURING AN AMOUNT OF DEPOSITED DIELECTRIC MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">G01N27/22</main-classification>
        <further-classification edition="200601120260120B">C23C16/52</further-classification>
        <further-classification edition="200601120260120B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海明格　漢內洛爾　阿佐拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEMMINGER, HANNELORE AZORA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波普　史蒂文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOPP, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威克勒　傑瑞德　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINKLER, JERELD LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭露用於量測一反應腔室內沉積之介電材料之一量的系統、設備及裝置。該等設備及裝置可用於近即時地量測所沉積材料之一量，使得量測值可用於控制及/或提供關於該等系統之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, apparatus, and devices for measuring an amount of dielectric material deposited within a reaction chamber are disclosed. The apparatus and devices can be used to measure an amount of deposited material in near real time, such that the measurements can be used to control and/or provide information regarding the systems.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:反應腔室</p>
        <p type="p">104:反應空間</p>
        <p type="p">106:基座</p>
        <p type="p">108:氣體分佈系統</p>
        <p type="p">110:排放源</p>
        <p type="p">112:控制器</p>
        <p type="p">114:裝置</p>
        <p type="p">116:基板</p>
        <p type="p">118:溫度調節裝置</p>
        <p type="p">120:機構</p>
        <p type="p">122:下部腔室區</p>
        <p type="p">124:上部腔室區</p>
        <p type="p">126:底部腔室壁</p>
        <p type="p">127:腔室壁</p>
        <p type="p">128:上表面/表面</p>
        <p type="p">130:閘閥開口</p>
        <p type="p">132:氣體源</p>
        <p type="p">134:氣體分佈裝置</p>
        <p type="p">136:管線</p>
        <p type="p">138:閥</p>
        <p type="p">140:入口</p>
        <p type="p">142:孔</p>
        <p type="p">144:氣室</p>
        <p type="p">146:電容量測裝置</p>
        <p type="p">148:導線</p>
        <p type="p">150:導線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2211" publication-number="202617737">
    <tif-files tif-type="multi-tif">
      <tif file="114135863.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為RAS抑制劑之大環化合物</chinese-title>
        <english-title>MACROCYCLIC COMPOUNDS AS RAS INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D515/22</main-classification>
        <further-classification edition="200601120260202B">A61K31/504</further-classification>
        <further-classification edition="200601120260202B">A61K31/5377</further-classification>
        <further-classification edition="200601120260202B">A61K31/5383</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商百濟神州Ｉ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEONE MEDICINES I GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭益安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐三甲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, SANJIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供具有以下結構之化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="325px" width="366px" file="ed10871.JPG" alt="ed10871.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;b&gt; &lt;/b&gt;&lt;b/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;或其醫藥學上可接受之鹽、水合物或溶劑合物，其中取代基係如本文所定義；該等物質之醫藥組合物及用於調節多種RAS突變體之活性之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds having the following structure: &lt;br/&gt;&lt;img align="absmiddle" height="320px" width="363px" file="ed10872.JPG" alt="ed10872.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;b&gt; &lt;/b&gt;&lt;b/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;or pharmaceutically acceptable salts, hydrates, or solvates thereof, wherein the substituents are as defined herein, their pharmaceutical compositions and uses for modulating the activity of of multiple RAS mutants.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2212" publication-number="202618697">
    <tif-files tif-type="multi-tif">
      <tif file="114135875.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260123B">G06T7/70</main-classification>
        <further-classification edition="201701120260123B">G06T7/73</further-classification>
        <further-classification edition="201101120260123B">G06T15/20</further-classification>
        <further-classification edition="201101120260123B">G06T19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商萬代股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清宮僚太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIYOMIYA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於在拍攝對象物，使用拍攝到之對象物之三維模型資料產生將三維模型配置於假想空間上之映像時，防止三維模型資料之動作之不自然。  &lt;br/&gt;本發明之資訊處理裝置包含：掃描控制機構，其控制掃描器之位置及角度，掃描設置於旋轉台之被攝體之外觀並產生掃描圖像；資料產生機構，其根據前述掃描圖像產生三維模型資料；及映像產生機構，其產生將基於前述三維模型資料之三維模型配置於假想空間內之映像；且進一步包含：受理機構，其受理對於前述三維模型資料之關節位置之指定輸入；且前述資料產生機構係與基於指定輸入之前述關節位置之關節資訊建立關聯而產生前述三維模型資料；前述映像產生機構產生基於前述關節資訊使前述三維模型資料之關節作動之三維模型之映像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:圖像處理系統</p>
        <p type="p">100:資訊處理裝置</p>
        <p type="p">110:掃描器</p>
        <p type="p">120:支持臂</p>
        <p type="p">130:模型支持裝置</p>
        <p type="p">140:顯示裝置</p>
        <p type="p">140A:操作部</p>
        <p type="p">150:頭戴式耳機</p>
        <p type="p">160:深度感測器</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2213" publication-number="202616978">
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      <tif file="114135882.zip" no="1">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>護髮裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A45D1/00</main-classification>
        <further-classification edition="200601120260114B">A45D1/02</further-classification>
        <further-classification edition="200601120260114B">A45D1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藪內梨世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABUUCHI, RISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金森芳彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAMORI, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮坂亞有子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYASAKA, AYUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">實施形態1之護髮裝置(1)具備有可對毛髮進行施術之施術部(20)。又，施術部(20)具備有第1施術部(210)、及與第1施術部(210)的第1相向壁在第1方向上相向之第2施術部(220)。又，在第1施術部(210)形成有可將在氣流產生機構(40)產生之全部的氣流導入的第1流路(P1)。此第1流路(P1)具備有形成於第1相向壁且可將氣流朝向毛髮接納部(S1)吹出的第1吹出口(P1b)。並且，在第2施術部(220)形成有可使從第1吹出口(P1b)朝向毛髮接納部(S1)吹出之氣流從第3方向的另一邊往外部空氣放出的第2吹出口(P2b)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吹風造型器(護髮裝置)</p>
        <p type="p">1a:第1臂部</p>
        <p type="p">1b:第2臂部</p>
        <p type="p">1c:鉸鏈部</p>
        <p type="p">10:把持部</p>
        <p type="p">110:第1把持部</p>
        <p type="p">120:第2把持部</p>
        <p type="p">20:施術部</p>
        <p type="p">210:第1施術部</p>
        <p type="p">211:外側殼體(第1殼體)</p>
        <p type="p">2111:第1限制壁(限制壁)</p>
        <p type="p">2121,2221:周壁部</p>
        <p type="p">21211:周壁本體</p>
        <p type="p">21212:拓寬部</p>
        <p type="p">2123:分割壁</p>
        <p type="p">2124:第1毛髮擋件(毛髮擋件)</p>
        <p type="p">220:第2施術部</p>
        <p type="p">221:外側殼體(第2殼體)</p>
        <p type="p">2211:第2限制壁(限制壁)</p>
        <p type="p">222:內側殼體</p>
        <p type="p">2222:第2相向壁</p>
        <p type="p">2224:第2毛髮擋件(毛髮擋件)</p>
        <p type="p">40:氣流產生機構</p>
        <p type="p">41:吸入口</p>
        <p type="p">44:流路</p>
        <p type="p">45:氣流出口</p>
        <p type="p">P1:第1流路</p>
        <p type="p">P1a:第1流入口</p>
        <p type="p">P1b:第1吹出口</p>
        <p type="p">P2:第2流路</p>
        <p type="p">P2a:第2流入口</p>
        <p type="p">P2b:第2吹出口</p>
        <p type="p">P11:第1空間(空間)</p>
        <p type="p">P12:第2空間(空間)</p>
        <p type="p">S1:毛髮接納部</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2214" publication-number="202617381">
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        <document-id>
          <doc-number>114135886</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測作業處所之位置之裝置、機器人系統、檢測作業處所之位置之方法及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B25J9/22</main-classification>
        <further-classification edition="200601120251201B">G05B19/42</further-classification>
        <further-classification edition="200601120251201B">B25J13/08</further-classification>
        <further-classification edition="200601120251201B">B25J19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松原瑶太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSUBARA, YOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木忠則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TADANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
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    <description>
      <isu-abst lang="tw">
        <p type="p">有時會對藉由搬送裝置搬送之尺寸未知之物品進行規定之作業。在如此之情形下，要求高速且高精度地檢測被搬送之物品之位置之技術。  &lt;br/&gt;本發明之檢測作業處所之位置之裝置60包含：特徵位置取得部62，其基於相機32A、32B拍攝到之物品之圖像資料，取得物品100之檢測目標特徵之位置；作業位置取得部64，其取得特徵位置取得部62取得之位置Q、及與搬送裝置12之高度方向正交之方向上之作業處所之位置；定位執行部66，其使移動高度感測器20之機器人18動作，執行將高度感測器20配置於作業位置取得部64取得之位置之定位動作；及檢測執行部68，其使藉由定位動作而配置之高度感測器20動作，執行檢測高度方向上之作業處所之位置之檢測動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機器人系統</p>
        <p type="p">12:搬送裝置</p>
        <p type="p">14:搬送感測器</p>
        <p type="p">16:視覺感測器</p>
        <p type="p">18,22:機器人</p>
        <p type="p">20:高度感測器</p>
        <p type="p">24:控制裝置</p>
        <p type="p">30,42,52:伺服馬達</p>
        <p type="p">32A,32B:相機</p>
        <p type="p">54:處理器</p>
        <p type="p">56:記憶體</p>
        <p type="p">58:I/O介面</p>
        <p type="p">59:匯流排</p>
        <p type="p">60:裝置</p>
        <p type="p">62:特徵位置取得部</p>
        <p type="p">64:作業位置取得部</p>
        <p type="p">66:定位執行部</p>
        <p type="p">68:檢測執行部</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2215" publication-number="202618137">
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          <doc-number>202618137</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體溶解液體生成裝置以及氣體溶解液體生成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">F04F5/04</main-classification>
        <further-classification edition="202201120260130B">B01F23/232</further-classification>
        <further-classification edition="200601120260130B">F04F5/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商明電舍股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEIDENSHA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦敏徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">氣體溶解液體生成裝置(1)，係具備：泵浦(2)，係吸引液體；噴射器(3)，係配置於該泵浦(2)之一次側，對於藉由前述吸引所導入之前述液體之流動注入氣體，並吐出氣體溶解液體；暫存儲槽(4)，係能夠儲留受到吸引導入之前述氣體，或是自前述噴射器之氣體吸引部倒流之液體；以及排出管線(5)，係自暫存儲槽(4)將前述液體排出至泵浦(2)之一次側吸引管線(7)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氣體溶解液體生成裝置</p>
        <p type="p">2:泵浦</p>
        <p type="p">3:噴射器</p>
        <p type="p">4:暫存儲槽</p>
        <p type="p">5:排出管線</p>
        <p type="p">6:儲槽</p>
        <p type="p">7:一次側吸引管線</p>
        <p type="p">8:送回管線</p>
        <p type="p">9:流入管線</p>
        <p type="p">10:氣體吸引管線</p>
        <p type="p">11:氣體導入管線</p>
        <p type="p">12:液位感測器</p>
        <p type="p">31:流入部</p>
        <p type="p">32:氣體吸引部</p>
        <p type="p">33:吐出部</p>
        <p type="p">V1,V2:流量控制閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2216" publication-number="202617664">
    <tif-files tif-type="multi-tif">
      <tif file="114135915.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備3-羥基-2-亞甲基鏈烷酸烷酯之方法</chinese-title>
        <english-title>PROCESS FOR PREPARING ALKYL 3-HYDROXY-2-METHYLENEALKANOATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C67/343</main-classification>
        <further-classification edition="200601120260202B">C07C69/732</further-classification>
        <further-classification edition="200601120260202B">B01J31/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜耳廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立煦晴斯基　安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LISHCHYNSKYI, ANTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫比亞克　安德列斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REMBIAK, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西布　丹妮斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIBU, DENISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於製備通式(&lt;b&gt;I&lt;/b&gt;)之3-羥基-2-亞甲基鏈烷酸烷酯之新穎方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a novel process for preparing alkyl 3-hydroxy-2-methylenealkanoates of the general formula (&lt;b&gt;I&lt;/b&gt;).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2217" publication-number="202617804">
    <tif-files tif-type="multi-tif">
      <tif file="114135920.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物、包括其之阻劑組成物及使用該阻劑組成物的圖案形成的方法</chinese-title>
        <english-title>POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/16</main-classification>
        <further-classification edition="200601120260102B">C08F220/22</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭允鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAK, YOONHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金範錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BEOMSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金惠蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYERAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴滸潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HOYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李在俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林圭鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, KYUHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔玹碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HYUNSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河旻永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, MINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種包括由下式1表示之第一重複單元的聚合物、一種包括其之阻劑組成物及一種使用該阻劑組成物的圖案形成方法。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="185px" width="349px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  在式1中，L&lt;sub&gt;11&lt;/sub&gt;、L&lt;sub&gt;12&lt;/sub&gt;、a11、a12、X&lt;sub&gt;11&lt;/sub&gt;及X&lt;sub&gt;12&lt;/sub&gt;如本文所描述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a polymer including a first repeating unit represented by Formula 1 below, a resist composition including the same, and a pattern formation method using the resist composition.&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="185px" width="359px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; In Formula 1, L&lt;sub&gt;11&lt;/sub&gt;, L&lt;sub&gt;12&lt;/sub&gt;, a11, a12, X&lt;sub&gt;11&lt;/sub&gt;, and X&lt;sub&gt;12&lt;/sub&gt; are as described herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2218" publication-number="202619048">
    <tif-files tif-type="multi-tif">
      <tif file="114135941.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及形成功率積體電路作為具有磁芯之電源管理積體電路的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING POWER IC AS PMIC WITH MAGNETIC CORE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01L23/14</main-classification>
        <further-classification edition="200601120251201B">H01L23/528</further-classification>
        <further-classification edition="200601120251201B">H01L23/049</further-classification>
        <further-classification edition="200601120251201B">H01L23/60</further-classification>
        <further-classification edition="200601120251201B">H01L25/10</further-classification>
        <further-classification edition="200601120251201B">H01L21/98</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋管理私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC MANAGEMENT PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李琇彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUPIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋智娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔榮仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNGIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, JEONGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種半導體裝置，其具有第一基板及安置於該第一基板之第一表面上方之第一電組件。第二電組件安置於與該第一基板之該第一表面相對的該第一基板之第二表面上方。該第二電組件展現來自磁性材料或磁線圈之磁吸引力。該第一基板具有開口，且該第二電組件具有延伸穿過該第一基板中之該開口之一或多個底腳。第三電組件安置於第二基板上方，且該第二基板安置於該第一基板上方。導電支柱連接該第一基板與該第二基板。可在該第一電組件周圍沉積囊封物，並在該第二電組件上方安置屏蔽層。該第二電組件可提供電源管理功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has a first substrate and a first electrical component disposed over a first surface of the first substrate. A second electrical component is disposed over a second surface of the first substrate opposite the first surface of the first substrate. The second electrical component exhibits magnetic attraction from magnetic material or a magnetic coil. The first substrate has an opening and the second electrical component has one or more feet extending through the opening in the first substrate. A third electrical component is disposed over a second substrate and the second substrate is disposed over the first substrate. A conductive post connects the first substrate and second substrate. An encapsulant can be deposited around the first electrical component and a shielding layer is disposed over the second electrical component. The second electrical component can provide a power management function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:基板</p>
        <p type="p">122:芯材料</p>
        <p type="p">124:主表面</p>
        <p type="p">126:主表面</p>
        <p type="p">140:黏著層/黏著劑材料/環氧樹脂</p>
        <p type="p">144:導電材料</p>
        <p type="p">146a:電組件</p>
        <p type="p">146b:電組件</p>
        <p type="p">146d:電組件</p>
        <p type="p">146e:電組件</p>
        <p type="p">146f:U型芯電組件</p>
        <p type="p">147:內部芯</p>
        <p type="p">148:導電立柱/導電柱</p>
        <p type="p">156:導電材料</p>
        <p type="p">158:底腳/突出部</p>
        <p type="p">162:本體</p>
        <p type="p">164:本體</p>
        <p type="p">167:電芯</p>
        <p type="p">182:芯材料</p>
        <p type="p">184:主表面</p>
        <p type="p">186:主表面</p>
        <p type="p">190:導電材料/導電膏</p>
        <p type="p">196a:電組件</p>
        <p type="p">196b:電組件</p>
        <p type="p">196c:電組件</p>
        <p type="p">196d:電組件</p>
        <p type="p">198:總成</p>
        <p type="p">202:黏著層</p>
        <p type="p">206:散熱片/散熱器/屏蔽層</p>
        <p type="p">210:功率IC</p>
        <p type="p">212:囊封物/模製化合物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2219" publication-number="202618076">
    <tif-files tif-type="multi-tif">
      <tif file="114135945.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單晶生長方法、控制裝置和單晶生長裝置</chinese-title>
        <english-title>MONOCRYSTAL GROWTH METHOD, CONTROL DEVICE AND MONOCRYSTAL GROWTH DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">C30B15/20</main-classification>
        <further-classification edition="200601120251001B">C30B35/00</further-classification>
        <further-classification edition="200601120251001B">C30B29/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海新昇半導體科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZING SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮睿超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, RUICHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金光勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬靜如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單晶生長方法、控制裝置和單晶生長裝置，其中單晶生長方法包括：在長晶爐的坩堝中放置矽料；對所述坩堝進行加熱，以使所述矽料熔融為矽熔體；將籽晶浸入所述矽熔體中，並以當前提拉速度向上旋轉提拉所述籽晶，使所述矽熔體在所述籽晶下端凝固結晶，以得到晶棒；其中，通過所述坩堝的當前實際位置與當前目標位置的偏差值對預設提拉速度進行補償，得到所述當前提拉速度，以控制所述坩堝當前的拉速與溫度梯度比值。本發明的單晶生長方法，通過坩堝的當前實際位置與當前目標位置的偏差值對預設提拉速度進行補償，控制坩堝的當前的拉速與溫度梯度比值保持不變，進而減少了單晶缺陷，提高了單晶質量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a monocrystal growth method, a control device and a monocrystal growth device. The monocrystal growth method comprises: feeding silicon materials in a crucible of a growth furnace, melting the silicon materials to form a melt by heating the crucible, immersing a seed crystal into the melt, and pulling the seed crystal rotatingly and upward at a current pulling speed, such that the melt crystallizes at the lower end of the seed crystal and a crystal ingot is produced. The current pulling speed is obtained by compensating for a predetermined pulling speed based on a deviation between a current actual position of the crucible and the current target position, such that the ratio of the pulling speed (V) to temperature gradient (G) can be controlled. Accordingly, the V/G ratio can be kept constant, the defects can be reduced and the crystal quality can be enhanced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220、S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2220" publication-number="202617606">
    <tif-files tif-type="multi-tif">
      <tif file="114136043.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含氧化鈰聚合物複合顆粒之CMP組合物</chinese-title>
        <english-title>CMP COMPOSITION INCLUDING CERIA POLYMER COMPOSITE PARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260121B">C01F17/235</main-classification>
        <further-classification edition="200601120260121B">C09G1/16</further-classification>
        <further-classification edition="200601120260121B">C08K3/22</further-classification>
        <further-classification edition="200601120260121B">C09K3/14</further-classification>
        <further-classification edition="200601120260121B">C08L33/10</further-classification>
        <further-classification edition="200601120260121B">C08F8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛倫拜　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUMBINE, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾德　威廉　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARD, WILLIAM J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種化學機械拋光組合物，其包括以下、由以下組成或基本上由以下組成：液體載劑，以及分散於該液體載劑中之氧化鈰聚合物複合顆粒。該等氧化鈰聚合物複合顆粒包括氧化鈰顆粒，由氧化鈰顆粒組成或基本上由氧化鈰顆粒組成，該等氧化鈰顆粒共價鍵結至聚合物基質且至少部分嵌入其中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier and ceria polymer composite particles dispersed in the liquid carrier. The ceria polymer composite particles comprise, consist of, or consist essentially of ceria particles covalently bonded to and at least partially embedded in a polymer matrix.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2221" publication-number="202619002">
    <tif-files tif-type="multi-tif">
      <tif file="114136060.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板搬送模組及基板搬送模組的運用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/677</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣凌欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LINGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在用於藉由搬送體在為真空環境氣氛的搬送空間中搬送基板的基板搬送模組中，在維持真空環境氣氛的狀態下對用於透過磁浮使搬送體移動的磁塊進行取下/安裝。  &lt;br/&gt;本揭露之基板搬送模組係構成進行基板的處理的半導體製造裝置，用於在為真空環境氣氛的搬送空間搬送基板；基板搬送模組係具備腔室，腔室係構成搬送空間且具有由分別具備電磁鐵的多個磁塊構成的分隔壁，電磁鐵係用於形成會作用在用於在搬送空間搬送基板的搬送體上設置的磁鐵而在已使搬送體浮起後的狀態下使搬送體移動的磁場；分隔壁係構成為能夠一邊使用用於維持搬送空間內為真空環境氣氛的狀態的真空維持機構，一邊取下/安裝磁塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31:內側磁塊部</p>
        <p type="p">32:外側磁塊部</p>
        <p type="p">34:殼體</p>
        <p type="p">340:螺孔</p>
        <p type="p">341:內部空間</p>
        <p type="p">342:上壁</p>
        <p type="p">343:下壁</p>
        <p type="p">344:側壁</p>
        <p type="p">35:第1連接部</p>
        <p type="p">36:第2連接部</p>
        <p type="p">37:凹部</p>
        <p type="p">4:框體部</p>
        <p type="p">40:螺孔</p>
        <p type="p">41:貫通口</p>
        <p type="p">44:環狀構件</p>
        <p type="p">441:配置槽</p>
        <p type="p">45:環狀構件</p>
        <p type="p">451:配置槽</p>
        <p type="p">46:螺絲</p>
        <p type="p">47:凹部</p>
        <p type="p">6:銷-鉗機構</p>
        <p type="p">6A:第1鉗單元</p>
        <p type="p">61:銷</p>
        <p type="p">611:側面</p>
        <p type="p">62:鉗</p>
        <p type="p">63:殼體</p>
        <p type="p">631:內壁面</p>
        <p type="p">64:活塞</p>
        <p type="p">641:彈簧</p>
        <p type="p">642:開口</p>
        <p type="p">65:滾珠</p>
        <p type="p">66,66A:挾持用流道</p>
        <p type="p">67,67A:解除用流道</p>
        <p type="p">68:作動流體供應源</p>
        <p type="p">68A:供應道</p>
        <p type="p">VA1,VA2:閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2222" publication-number="202617095">
    <tif-files tif-type="multi-tif">
      <tif file="114136085.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫療錨固裝置、其醫療錨固裝置操作方法及其醫療錨固系統</chinese-title>
        <english-title>MEDICAL ANCHORING DEVICE, MEDICAL ANCHORING DEVICE OPERATING METHOD THEREOF AND MEDICAL ANCHORING SYSTEM FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61B17/00</main-classification>
        <further-classification edition="201601120260131B">A61B50/10</further-classification>
        <further-classification edition="200601120260131B">A61B17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芮科生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIBCURE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧韋智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇永晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YUNG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇則宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, TSE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種醫療錨固裝置，其包含：一第一導線部，其具有一第一端及一第二端；一第二導線部，其具有一第三端及一第四端；一第一穿刺部，其連接至該第一導線部之該第一端，並配置成刺穿一人體之一目標腔體之一腔壁的一第一目標位置；一第二穿刺部，其連接至該第二導線部之該第三端，並配置成刺穿該目標腔體之該腔壁的一第二目標位置，其中該第二目標位置與該第一目標位置不同；以及一連接部，其連接至該第一導線部之該第二端及該第二導線之該第四端，該連接部配置成連接該目標腔體內部之一目標物件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A medical anchoring device, comprising: a first wire portion having a first end and a second end; a second wire portion having a third end and a fourth end; a first puncturing portion connecting to the first end of the first wire portion and configured to puncture through a first target position of a cavity wall of a target cavity of a human body; a second puncturing portion connecting to the third end of the second wire portion and configured to puncture through a second target position of the cavity wall of the target cavity, the second target position is different to the first target position; and a connecting portion connecting to the second end of the first wire portion and the fourth end of the second wire, the connecting portion is configured to connect a target object inside the target cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">410:第一導線部</p>
        <p type="p">420:第二導線部</p>
        <p type="p">430:第一穿刺部</p>
        <p type="p">440:第二穿刺部</p>
        <p type="p">450:連接部</p>
        <p type="p">460:第三導線部</p>
        <p type="p">470:第三穿刺部</p>
        <p type="p">810:腔壁</p>
        <p type="p">812:第一目標位置</p>
        <p type="p">814:第二目標位置</p>
        <p type="p">816:第三目標位置</p>
        <p type="p">820:腹腔</p>
        <p type="p">830:目標器官</p>
        <p type="p">910、920、930:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2223" publication-number="202619340">
    <tif-files tif-type="multi-tif">
      <tif file="114136097.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於視訊寫碼的適應性迴路濾波器縮放因子</chinese-title>
        <english-title>ADAPTIVE LOOP FILTER SCALING FACTORS FOR VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/117</main-classification>
        <further-classification edition="201401120260102B">H04N19/102</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲維克茲　馬塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鴻滔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞瑞金　法迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEREGIN, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵宜庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, YITING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種經組態以寫碼視訊資料的設備可：重建視訊資料之區塊；判定該區塊的樣本的濾波器類別；判定各濾波器類別中的樣本的一或多個濾波器子類別；且對各濾波器子類別中的該等樣本應用濾波器，其包括對各濾波器子類別中的樣本應用各別縮放因子。該濾波器係適應性迴路濾波器(ALF)、解區塊濾波器、樣本適應性偏移濾波器、雙邊濾波器、交叉分量樣本適應性偏移濾波器(CC-SAO)、交叉分量適應性迴路濾波器(CC-ALF)、或基於神經網路之濾波器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus configured to code video data may reconstruct a block of video data, determine a filter class for samples of the block, determine one or more filter sub-classes for samples in each filter class, and apply a filter to the samples in each filter sub-class, including applying a respective scaling factor to samples in each filter sub-class. The filter is an adaptive loop filter (ALF), a deblocking filter, a sample adaptive offset filter, a bilateral filter, a cross-component sample adaptive offset filter (CC-SAO), a cross-component adaptive loop filter (CC-ALF), or a neural network-based filter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:來源裝置</p>
        <p type="p">104:視訊來源</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:輸出介面</p>
        <p type="p">110:電腦可讀取媒體</p>
        <p type="p">112:儲存裝置</p>
        <p type="p">114:檔案伺服器</p>
        <p type="p">116:目的地裝置</p>
        <p type="p">118:顯示裝置</p>
        <p type="p">120:記憶體</p>
        <p type="p">122:輸入介面</p>
        <p type="p">200:視訊編碼器</p>
        <p type="p">300:視訊解碼器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2224" publication-number="202617961">
    <tif-files tif-type="multi-tif">
      <tif file="114136125.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔組合物</chinese-title>
        <english-title>CLEANING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C11D7/32</main-classification>
        <further-classification edition="200601120260202B">C11D7/34</further-classification>
        <further-classification edition="200601120260202B">C11D7/36</further-classification>
        <further-classification edition="200601120260202B">C11D7/50</further-classification>
        <further-classification edition="200601120260202B">H01L21/02</further-classification>
        <further-classification edition="200601120260202B">H01L21/304</further-classification>
        <further-classification edition="200601120260202B">H01L21/3213</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東友精細化工有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGWOO FINE-CHEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>房淳洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, SOON HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JEONG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜韓星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HAN BYEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙亨鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種清潔組合物。根據本發明實施方式的清潔組合物包括環醯胺基化合物、極性非質子溶劑和氟基化合物。清潔組合物可以快速去除矽基聚合物而不產生殘留物、不蝕刻金屬層。清潔組合物可用於在半導體裝置的製造中的晶圓的清潔製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a cleaning composition. The cleaning composition according to an embodiment of the present invention includes a cyclic amide compound, a polar aprotic solvent and a fluoro compound. The cleaning composition can swiftly remove the silicon-based polymer without generating residue and without etching the metal layer. The cleaning composition can be used in the cleaning process of wafers in the manufacturing of semiconductor devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2225" publication-number="202618984">
    <tif-files tif-type="multi-tif">
      <tif file="114136135.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密封門組件、傳輸腔室和半導體製程設備</chinese-title>
        <english-title>SEALING DOOR ASSEMBLY, TRANSFER CHAMBER, AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251002B">H01L21/67</main-classification>
        <further-classification edition="200601120251002B">H01L21/677</further-classification>
        <further-classification edition="200601120251002B">B25J9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡晨宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫晉博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JIN BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉耀琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YAO QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI KA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種密封門組件、傳輸腔室和半導體製程設備，該密封門組件包括門板、導軌和連接組件，該連接組件包括第一襯套、第二襯套和滑塊，該第二襯套套設於該第一襯套之外，且該第二襯套的內表面與該第一襯套的外表面球面配合，該第二襯套設於該滑塊，該門板與該滑塊連接，該第一襯套滑動地套設於該導軌，在該門板藉由該第一襯套與該導軌的滑動配合沿該導軌移動的過程中，該第一襯套與該第二襯套藉由球面配合對該第一襯套進行角度補償。上述方案可以解決相關技術中的傳輸腔室存在軸套與導軌之間的摩擦較大而導致雜質顆粒較多的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a sealing door assembly, a transfer chamber, and semiconductor processing equipment. The sealing door assembly includes a door panel, a guide rail, and a connecting assembly. The connecting assembly comprises a first bushing, a second bushing, and a slider. The second bushing is sleeved outside the first bushing, and the inner surface of the second bushing is spherically matched with the outer surface of the first bushing. The second bushing is provided on the slider, and the door panel is connected to the slider. The first bushing is slidably sleeved on the guide rail. During the process in which the door panel moves along the guide rail through the sliding fit between the first bushing and the guide rail, the first bushing and the second bushing perform angular compensation for the first bushing through the spherical fit. The solution above can solve the problem in the related art where excessive friction between the bushing and the guide rail in the transfer chamber leads to a large number of impurity particles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腔室本體</p>
        <p type="p">110:傳輸通道</p>
        <p type="p">210:門板</p>
        <p type="p">212:透明視窗</p>
        <p type="p">220:導軌</p>
        <p type="p">240:門框</p>
        <p type="p">260:第一驅動件</p>
        <p type="p">280:第二驅動件</p>
        <p type="p">300:第二襯套</p>
        <p type="p">400:晶圓盒定位機構</p>
        <p type="p">510:底座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2226" publication-number="202618844">
    <tif-files tif-type="multi-tif">
      <tif file="114136136.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
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          <doc-number>202618844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻電流傳輸結構、半導體製程設備、射頻電流的檢測方法及機台的檢測方法</chinese-title>
        <english-title>RADIO FREQUENCY CURRENT TRANSMISSION STRUCTURE, SEMICONDUCTOR PROCESSING EQUIPMENT, METHOD FOR DETECTING RADIO FREQUENCY CURRENT, AND METHOD FOR DETECTING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01J37/147</main-classification>
        <further-classification edition="200601120251103B">G01R33/24</further-classification>
        <further-classification edition="200601120251103B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王景遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JING YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王蕾越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東彧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DONG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種射頻電流傳輸結構、半導體製程設備、射頻電流的檢測方法及機台的檢測方法，涉及半導體領域。射頻電流傳輸結構應用於半導體製程設備，射頻電流傳輸結構包括：由內至外依次設置的饋入件、介質層、第一回流層、磁性材料層和第二回流層；饋入件的一端用於接收射頻電流，饋入件的另一端用於連接至射頻接收件，第一回流層和第二回流層各自的一端分別用於連接至接地件，射頻接收件與接地件連接，一回流層和第二回流層各自的另一端分別用於引出射頻電流，且第一回流層中的電流大於第二回流層中的電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a radio frequency (RF) current transmission structure, a semiconductor processing equipment, a method for detecting a RF current, and a method for detecting an equipment, all pertaining to the semiconductor field. The RF current transmission structure is applied to a semiconductor processing equipment and includes, in order from the inside out: a feed-in component, a dielectric layer, a first return layer, a magnetic material layer, and a second return layer. One end of the feed-in component is used to receive the RF current, while the other end is used to connect to an RF receiving component. One end of each of the first and second return layers is respectively used to connect to a grounding component, and the RF receiving component is connected to the grounding component. The other end of each of the first and second return layers is respectively used to output the RF current, and the current in the first return layer is greater than the current in the second return layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">01:腔體</p>
        <p type="p">02:上電極裝置</p>
        <p type="p">03:下電極裝置</p>
        <p type="p">04:上電極射頻源裝置</p>
        <p type="p">05:下電極射頻源裝置</p>
        <p type="p">06:信號處理裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2227" publication-number="202617041">
    <tif-files tif-type="multi-tif">
      <tif file="114136158.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備控制方法及相關設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">B25J9/16</further-classification>
        <further-classification edition="200601120260130B">B25J13/08</further-classification>
        <further-classification edition="202201120260130B">G06V20/10</further-classification>
        <further-classification edition="202401120260130B">G05D1/648</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種清潔設備控制方法及相關設備，涉及清潔設備控制領域，上述清潔設備包括抓取機械臂，該方法包括：獲取第一目標區域的感知圖像資訊；基於感知圖像資訊確定是否存在待抓取物體；在存在所述待抓取物體的情況下，獲取所述待抓取物體的待分析圖像資訊；基於所述待分析圖像資訊確定所述待抓取物體的抓取參數資訊；基於所述抓取參數資訊控制抓取機械臂對所述待抓取物體執行抓取操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
        <p type="p">S140:步驟</p>
        <p type="p">S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2228" publication-number="202617042">
    <tif-files tif-type="multi-tif">
      <tif file="114136171.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備控制方法、控制裝置、電子設備、存儲介質及清潔設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A47L11/40</main-classification>
        <further-classification edition="200601120260127B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔設備控制方法、控制裝置、清潔設備及相關設備，涉及智慧家居技術領域，方法包括控制開啟第一圖像採集裝置和/或第二圖像採集裝置；在第一圖像採集裝置和第二圖像採集裝置中的一者處於有效狀態，另一者處於無效狀態時，清潔設備響應於用戶的切換指令，將處於有效狀態下的圖像採集裝置切換為無效狀態，將處於無效狀態下的圖像採集裝置切換為有效狀態；清潔設備調整機械臂模組的位姿資訊和/或調整底盤的位置資訊以更新第一圖像和/或第二圖像。由於機械臂模組具有很高的自由度，因此可以查看到多角度、多方位的第一圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔設備控制方法</p>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2229" publication-number="202617939">
    <tif-files tif-type="multi-tif">
      <tif file="114136188.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種液晶組合物及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K19/34</main-classification>
        <further-classification edition="200601120260102B">C09K19/42</further-classification>
        <further-classification edition="200601120260102B">C09K19/44</further-classification>
        <further-classification edition="200601120260102B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京八億時空液晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高豔麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊雪彪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁志豔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉宇行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳卯先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雲鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承賀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及液晶材料技術領域，尤其涉及一種液晶組合物及其應用，所述液晶組合物包括一種或多種通式I所示結構的化合物、一種或多種通式II所示結構的化合物，一種或多種通式III所示結構的化合物，以及一種或多種通式Ⅳ所示結構的化合物。本發明提供的液晶組合物具有旋轉粘度低、彈性常數大、光學各向異性大、回應速度快以及良好的低溫互溶性等優異性能，能夠有效改善液晶顯示器的回應速度，能夠用於多種顯示模式的快回應液晶顯示，其在VA、IPS或FFS模式顯示器中的使用能明顯改善液晶顯示器的顯示效果，尤其適用於IPS和FFS模式液晶顯示器。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="117px" width="277px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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        <document-id>
          <doc-number>114136191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測試電子元件的處理機的拾取器控制系統及拾取器組合件</chinese-title>
        <english-title>SYSTEM FOR CONTROLLING PICKER IN HANDLER FOR TESTING ELECTRONIC COMPONENTS AND PICKER ASSEMBLY THEREOF</english-title>
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      <classification-ipc>
        <main-classification edition="200601120260121B">H01L21/677</main-classification>
        <further-classification edition="200601120260121B">B65G47/91</further-classification>
        <further-classification edition="200601120260121B">B65G49/07</further-classification>
        <further-classification edition="202001120260121B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商泰克元股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於測試電子元件的處理機的拾取器控制系統及拾取機械手。&lt;br/&gt;  依據本發明，如下控制，驅使拾取器下降時，在第一下降區段讓拾取器以預設速度下降，在低於第一下降區段的第二下降區段讓拾取器保持預設的按壓力地下降，停電時回歸機構自動解除拾取器與電子元件的接觸。&lt;br/&gt;  適用了本發明時，能防止拾取器所致電子元件的損傷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:下端</p>
        <p type="p">S1:第一下降區段</p>
        <p type="p">S2:第二下降區段</p>
        <p type="p">U:頂端</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2231" publication-number="202617655">
    <tif-files tif-type="multi-tif">
      <tif file="114136218.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617655</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物、組成物、（共）聚合物、膜形成用組成物，及化合物之製造方法</chinese-title>
        <english-title>COMPOUND, COMPOSITION, (CO)POLYMER, FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING COMPOUND</english-title>
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      <classification-ipc>
        <main-classification edition="200601120260202B">C07C41/30</main-classification>
        <further-classification edition="200601120260202B">C07C43/313</further-classification>
        <further-classification edition="200601120260202B">C07C45/63</further-classification>
        <further-classification edition="200601120260202B">C07C45/71</further-classification>
        <further-classification edition="200601120260202B">C07C47/565</further-classification>
        <further-classification edition="200601120260202B">C07C47/575</further-classification>
        <further-classification edition="200601120260202B">C07D309/12</further-classification>
        <further-classification edition="200601120260202B">C08F212/14</further-classification>
        <further-classification edition="200601120260202B">C08L25/18</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小熊威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGUMA, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀內淳矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIUCHI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤𨺓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越後雅敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECHIGO, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為提供一種下述式(0)表示之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="290px" width="441px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，  &lt;br/&gt;　　A為碳數6～30之芳香族基，  &lt;br/&gt;　　X&lt;sup&gt;1&lt;/sup&gt;為單鍵或酯鍵，  &lt;br/&gt;　　O為氧原子，  &lt;br/&gt;　　I為碘原子，  &lt;br/&gt;　　R&lt;sup&gt;1&lt;/sup&gt;為氫原子或甲基，  &lt;br/&gt;　　R&lt;sup&gt;2&lt;/sup&gt;分別獨立為氫原子或酸分解性基，且R&lt;sup&gt;2&lt;/sup&gt;之至少一個為酸分解性基，  &lt;br/&gt;　　n為1以上之整數，  &lt;br/&gt;　　m為2以上之整數，  &lt;br/&gt;　　且m＞n)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compound represented by the following formula (0): &lt;br/&gt;&lt;img align="absmiddle" height="240px" width="243px" file="ed10098.JPG" alt="ed10098.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(in the formula, &lt;br/&gt;A is an aromatic group having 6 to 30 carbon atoms, &lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt; is a single bond or an ester bond, &lt;br/&gt;O is an oxygen atom, &lt;br/&gt;I is an iodine atom, &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt; is a hydrogen atom or a methyl group, &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt; is each independently a hydrogen atom or an acidolytic group, with at least one R&lt;sup&gt;2&lt;/sup&gt; being an less acidolytic group, &lt;br/&gt;n is an integer of 1 or greater, &lt;br/&gt;m is an integer of 2 or greater, &lt;br/&gt;and m ＞ n).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
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      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616958</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有不溶性豆類食物纖維加熱處理物之保水劑</chinese-title>
        <english-title></english-title>
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      <classification-ipc>
        <main-classification edition="200601120260121B">A21D2/16</main-classification>
        <further-classification edition="201601120260121B">A23L13/00</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商不二製油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI OIL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福原宏章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUHARA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口浩輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西口直邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIGUCHI, NAOKUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井名苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, NANAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金谷洋幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANATANI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題&lt;br/&gt;本發明之目的在於提供一種以供應穩定之大豆為原料、能夠使飲食品保水之材料。&lt;br/&gt;解決手段&lt;br/&gt;發現3質量%溶液之均質化處理前後之黏度滿足特定數值範圍的不溶性豆類食物纖維加熱處理物或不溶性豆類食物纖維加熱處理物之乾燥物可解決課題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2233" publication-number="202617679">
    <tif-files tif-type="multi-tif">
      <tif file="114136249.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件、聚醯亞胺及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C217/90</main-classification>
        <further-classification edition="200601120260202B">C07C217/94</further-classification>
        <further-classification edition="200601120260202B">C07C219/34</further-classification>
        <further-classification edition="200601120260202B">C07C229/64</further-classification>
        <further-classification edition="200601120260202B">C07C233/44</further-classification>
        <further-classification edition="200601120260202B">C08F2/44</further-classification>
        <further-classification edition="200601120260202B">C08F283/04</further-classification>
        <further-classification edition="200601120260202B">C08F290/14</further-classification>
        <further-classification edition="200601120260202B">C08G73/10</further-classification>
        <further-classification edition="200601120260202B">C08G73/12</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/027</further-classification>
        <further-classification edition="200601120260202B">G03F7/031</further-classification>
        <further-classification edition="200601120260202B">G03F7/037</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野崎敦靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAKI, ATSUYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含樹脂及光聚合起始劑之樹脂組成物、硬化上述組成物而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體器件及其製造方法、以及新型聚醯亞胺及化合物，前述樹脂為聚醯亞胺樹脂，其包含0.30mmol/g以上的由式（AA-1）表示之結構，並且波長365nm下的莫耳吸光係數為1000L·mol&lt;sup&gt;-1&lt;/sup&gt;·cm&lt;sup&gt;-1&lt;/sup&gt;以下。  &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="230px" file="ed10107.JPG" alt="ed10107.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2234" publication-number="202617820">
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          <doc-number>202617820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光敏樹脂組合物、使用此組合物的乾膜光阻及其製造方法、抗蝕劑圖案及裝置</chinese-title>
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM PHOTORESIST AND METHOD FOR PREPARING THE SAME, RESIST PATTERN AND DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G59/20</main-classification>
        <further-classification edition="200601120260202B">C08G59/68</further-classification>
        <further-classification edition="200601120260202B">C08K5/06</further-classification>
        <further-classification edition="200601120260202B">C08K5/07</further-classification>
        <further-classification edition="200601120260202B">C08K5/45</further-classification>
        <further-classification edition="200601120260202B">C08K5/55</further-classification>
        <further-classification edition="200601120260202B">C08L63/00</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">H05K3/06</further-classification>
        <further-classification edition="200601120260202B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓友澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, WOO TACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於能夠基於120微米的膜厚度形成精細圖案、並實現優異的附著力、解析度、剛性和耐化學性的光敏樹脂組合物、使用其的乾膜光阻、用於製備其的方法、抗蝕劑圖案、以及使用其的顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a photosensitive resin composition capable of forming fine patterns based on a 120 ㎛ film thickness, and implementing excellent adhesion, resolution, rigidity, and chemical resistance, a dry film photoresist using the same, a method for preparing the same, a resist pattern, and a display device using the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2235" publication-number="202619166">
    <tif-files tif-type="multi-tif">
      <tif file="114136253.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>各向異性導電片以及各向異性導電片的連接方法、電氣設備及檢查插座</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01R11/01</main-classification>
        <further-classification edition="200601120260130B">H01R13/24</further-classification>
        <further-classification edition="200601120260130B">H01B5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水保力馬科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI POLYMATECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮永佳苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYANAGA, KANAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提高各向異性導電片的連接可靠性的各向異性導電片以及各向異性導電片的連接方法。一種各向異性導電片（100），具有：基片（103），由高分子基質的橡膠狀彈性體構成，以及多個導電部（104），由多個導電性粒子（107）在基片（103）的厚度方向上連結而形成；導電部（104）具有接點粒子，所述接點粒子是位於基片（103）的表面的一側的所述導電性粒子，所述接點粒子具有從所述表面突出並與連接物件導通接觸的接點部，所述基片（103）具有保持接點部（107b1）的側面的圓角狀保持部（109）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">H:高度</p>
        <p type="p">D:重心間距離</p>
        <p type="p">100:各向異性導電片</p>
        <p type="p">101:彈性連接器部</p>
        <p type="p">103:基片</p>
        <p type="p">103a:第一表面</p>
        <p type="p">103b:第二表面</p>
        <p type="p">104:導電部</p>
        <p type="p">105:導通連接區域</p>
        <p type="p">107:導電性粒子</p>
        <p type="p">107a:第一導電性粒子</p>
        <p type="p">107a1、107b1:接點部</p>
        <p type="p">107b:第二導電性粒子</p>
        <p type="p">108:導電性粒子層</p>
        <p type="p">108a:第一導電性粒子層</p>
        <p type="p">108b:第二導電性粒子層</p>
        <p type="p">200:第一連接物件</p>
        <p type="p">201、301:導通連接部</p>
        <p type="p">300:第二連接物件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2236" publication-number="202618809">
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      <tif file="114136257.zip" no="1">
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          <doc-number>202618809</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>各向異性導電片以及各向異性導電片的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H01B1/20</main-classification>
        <further-classification edition="200601120260116B">H05K3/32</further-classification>
        <further-classification edition="200601120260116B">B32B5/16</further-classification>
        <further-classification edition="200601120260116B">H01F41/16</further-classification>
        <further-classification edition="200601120260116B">H01F13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水保力馬科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI POLYMATECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮永佳苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYANAGA, KANAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種各向異性導電片以及各向異性導電片的製造方法，提高各向異性導電片的連接可靠性。一種各向異性導電片（100），具有：基片（103），由高分子基質構成，以及多個導電部（104），由示出磁性的多個導電性粒子（107）在基片（103）的厚度方向上鏈接而形成；多個導電部（104）不受導電性粒子（107）間的磁力排斥的影響，以基於規定的設計配置的規則的間隔配置於基片（103），各個導電部（104）通過兩個以上的導電性粒子（107）在基片（103）的厚度方向上串聯地鏈接而形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:各向異性導電片</p>
        <p type="p">101:彈性連接器部</p>
        <p type="p">102:外框部</p>
        <p type="p">103:基片</p>
        <p type="p">104:導電部</p>
        <p type="p">105:導通連接區域</p>
        <p type="p">106:外側區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2237" publication-number="202617479">
    <tif-files tif-type="multi-tif">
      <tif file="114136259.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液壓控制單元及跨騎式車輛</chinese-title>
        <english-title>HYDRAULIC PRESSURE CONTROL UNIT AND STRADDLE-TYPE VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B60T8/40</main-classification>
        <further-classification edition="200601120260130B">H02K5/04</further-classification>
        <further-classification edition="200601120260130B">H02K5/24</further-classification>
        <further-classification edition="201301120260130B">B62K11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水越耕太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUKOSHI, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿維安托　拉卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVIANTO, RAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在跨騎式車輛用、具備馬達單元與具備凸緣部且覆蓋馬達單元的殼體之外周面至少一部分之蓋的液壓控制單元中，提供一種能減輕從該蓋對該殼體之負荷之液壓控制單元，以及具備該液壓控制單元的跨騎式車輛。  &lt;br/&gt;上述液壓控制單元，其於上述馬達單元中上述蓋與上述殼體之間的至少一部分，設置有用於抑制上述蓋與上述殼體之接觸的緩衝部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a hydraulic pressure control unit for a straddle-type vehicle, wherein the hydraulic pressure control unit includes a motor unit, and a cover including a flange part and covering at least a portion of an outer peripheral surface of a housing of the motor unit, and may reduce a load from the cover to the housing, and a straddle-type vehicle provided with the hydraulic pressure control unit. In the hydraulic pressure control unit, the motor unit includes, at at least a portion between the cover and the housing, a buffer part to suppress contact between the cover and the housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">25:進口閥</p>
        <p type="p">50:泵裝置</p>
        <p type="p">51:柱塞</p>
        <p type="p">61:控制基板</p>
        <p type="p">70:馬達單元</p>
        <p type="p">71:定子</p>
        <p type="p">72:轉子</p>
        <p type="p">73:殼體</p>
        <p type="p">74:輸出軸</p>
        <p type="p">74a:旋轉軸</p>
        <p type="p">75:偏心部</p>
        <p type="p">80:蓋</p>
        <p type="p">90:緩衝部</p>
        <p type="p">91:空隙</p>
        <p type="p">100:液壓控制單元</p>
        <p type="p">101:軸承</p>
        <p type="p">110:基體</p>
        <p type="p">110a:面</p>
        <p type="p">111:凹部</p>
        <p type="p">111a:底部</p>
        <p type="p">111b:段部</p>
        <p type="p">112:塑性變形部</p>
        <p type="p">113:軸承用凹部</p>
        <p type="p">120:控制基板用殼體</p>
        <p type="p">Z:觀察方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2238" publication-number="202619133">
    <tif-files tif-type="multi-tif">
      <tif file="114136297.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圓筒形二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01M4/78</main-classification>
        <further-classification edition="201401120260123B">H01M10/64</further-classification>
        <further-classification edition="202101120260123B">H01M50/636</further-classification>
        <further-classification edition="202101120260123B">H01M50/26</further-classification>
        <further-classification edition="200601120260123B">H01G4/232</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口勇馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">特徵在於：具備：包含正極與負極之電極體(14)、用以容置電極體(14)之有底圓筒狀的外裝罐(20)、及用以封閉外裝罐(20)的開口部(24)之封口體(30)，在外裝罐(20)的側面部(22)設置有朝向外裝罐(20)的徑方向內側凹陷的凹溝部(23)，封口體(30)包含外周緣被墊片(40)夾持且固定於外裝罐(20)之封口板(31)、及從封口板(31)朝向電極體(14)側突出之突出部(32)，突出部(32)的徑方向外側的面(32A)的至少一部分抵接於墊片(40)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:圓筒形二次電池</p>
        <p type="p">14:電極體</p>
        <p type="p">16:絕緣板</p>
        <p type="p">18:正極引線</p>
        <p type="p">20:外裝罐</p>
        <p type="p">22:側面部</p>
        <p type="p">23:凹溝部</p>
        <p type="p">23A:徑方向內端</p>
        <p type="p">30:封口體</p>
        <p type="p">31:封口板</p>
        <p type="p">32:突出部</p>
        <p type="p">32A:外表面</p>
        <p type="p">32B:下表面</p>
        <p type="p">32C:外周緣</p>
        <p type="p">33:中央部</p>
        <p type="p">34:外周部</p>
        <p type="p">34A:上表面</p>
        <p type="p">34B:下表面</p>
        <p type="p">34C:側面</p>
        <p type="p">35:薄肉部</p>
        <p type="p">40:墊片</p>
        <p type="p">40A:下端部</p>
        <p type="p">41:本體部</p>
        <p type="p">42:凸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2239" publication-number="202619323">
    <tif-files tif-type="multi-tif">
      <tif file="114136327.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊方法和設備</chinese-title>
        <english-title>METHOD AND APPARATUS OF WIRELESS COMMUNICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H04L27/26</main-classification>
        <further-classification edition="200601120251103B">H04L5/00</further-classification>
        <further-classification edition="202301120251103B">H04W72/0453</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通訊方法，包括：生成多個重複的頻域段，其中每個該多個重複的頻域段包括多個正交頻分複用（OFDM）子載波；對該多個重複的頻域段執行相位旋轉操作，包含對同一重複的頻域段內的不同OFDM子載波應用不同的相位旋轉；以及根據該相位旋轉操作的輸出生成OFDM信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication method includes: generating a plurality of duplicated frequency-domain segments, wherein each of the plurality of duplicated frequency-domain segments includes a plurality of orthogonal frequency division multiplexing (OFDM) subcarrier tones; performing a phase rotation operation upon the plurality of duplicated frequency-domain segments, including applying different phase rotations to different OFDM subcarrier tones within a same duplicated frequency-domain segment; and generating an OFDM signal according to an output of the phase rotation operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:第一處理電路</p>
        <p type="p">204:相位旋轉電路</p>
        <p type="p">206:第二處理電路</p>
        <p type="p">208:編碼器電路</p>
        <p type="p">210:映射器電路</p>
        <p type="p">211_1~211_N:重複的頻域段</p>
        <p type="p">212_1~212_N:乘法器</p>
        <p type="p">214:IFFT電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2240" publication-number="202619437">
    <tif-files tif-type="multi-tif">
      <tif file="114136330.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H05K3/46</main-classification>
        <further-classification edition="200601120260131B">H05K1/09</further-classification>
        <further-classification edition="200601120260131B">H05K1/05</further-classification>
        <further-classification edition="200601120260131B">H05K3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高倉隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAKURA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中智章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板(1)具備：金屬支持基板(11)；絕緣層(12)，其配置於金屬支持基板(11)之厚度方向一面；及導體圖案(13)，其配置於絕緣層(12)之厚度方向一面。導體圖案(13)具備配線(131)，配線(131)包含第1配線(131A)、第2配線(131B)及第3配線(131C)。第2配線(131B)之厚度T2大於第1配線(131A)之厚度T1，第3配線(131C)之厚度T3大於第2配線(131B)之厚度T2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:金屬支持基板</p>
        <p type="p">12:絕緣層(基底絕緣層)</p>
        <p type="p">13:導體圖案</p>
        <p type="p">14:上蓋絕緣層</p>
        <p type="p">112A:配線支持部</p>
        <p type="p">112B:配線支持部</p>
        <p type="p">112C:配線支持部</p>
        <p type="p">131A:第1配線</p>
        <p type="p">131B:第2配線</p>
        <p type="p">131C:第3配線</p>
        <p type="p">1311:第1導體層</p>
        <p type="p">1312:第2導體層</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <p type="p">T3:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2241" publication-number="202617862">
    <tif-files tif-type="multi-tif">
      <tif file="114136354.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於熱固性組合物、固化組合物及基於彼等之預浸材及層合物之低聚物</chinese-title>
        <english-title>OLIGOMERS FOR THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LAMINATES BASED ON SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C08L25/10</main-classification>
        <further-classification edition="200601120260130B">C08F212/36</further-classification>
        <further-classification edition="200601120260130B">C09K21/12</further-classification>
        <further-classification edition="200601120260130B">C11D1/38</further-classification>
        <further-classification edition="200601120260130B">B32B27/04</further-classification>
        <further-classification edition="200601120260130B">B32B15/082</further-classification>
        <further-classification edition="200601120260130B">H05K1/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商埃索拉美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOLA USA CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NING PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　德凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, TECK KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於適用於製造諸如電路板基材之電子材料的低聚物及包括其之熱固性組合物，以及基於該等熱固性組合物之固化組合物、預浸材及層合物。本發明之一個態樣為一種經苯基取代之低聚物，其為低聚混合物之反應產物，該低聚混合物包含：苯乙烯及二乙烯苯中之一或多者，以及異丙烯基苯及二異丙烯基苯中之一或多者，其中該低聚物的經甲基取代之乙烯基殘基數目與乙烯基殘基總數之比為至少20%；且該低聚混合物的多官能(例如雙官能)反應物的乙烯基殘基與所有反應物的乙烯基殘基之比為至少50%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to oligomers and thermosetting compositions including the same suitable for use in making electronic materials such as circuit board substrates, as well as cured compositions, prepregs and laminates based on such thermosetting compositions. One aspect of the disclosure is a phenyl-substituted oligomer that is a reaction product of an oligomerization mixture comprising one or more of styrene and divinylbenzene; and one or more of isopropenylbenzene and diisopropenylbenzene, wherein the oligomer has a ratio of number of methyl-substituted vinyl residues to total number of vinyl residues of at least 20%; and the oligomerization mixture has a ratio of vinyl residues of polyfunctional (e.g., difunctional) reactants to vinyl residues of all reactants of at least 50%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:預浸材</p>
        <p type="p">110:網狀基材</p>
        <p type="p">120:固化產物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2242" publication-number="202617877">
    <tif-files tif-type="multi-tif">
      <tif file="114136393.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組合物、使用此組合物的乾膜光阻及其製造方法、光阻圖案及裝置</chinese-title>
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM PHOTORESIST AND METHOD FOR PREPARING THE SAME, RESIST PATTERN AND DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C08L63/02</main-classification>
        <further-classification edition="200601120260116B">C08L63/04</further-classification>
        <further-classification edition="200601120260116B">C08G59/32</further-classification>
        <further-classification edition="200601120260116B">G03F7/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全勝韓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, SEUNG HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是關於一種感光性樹脂組合物，包括三種或更多種不同的環氧樹脂，包括第一環氧樹脂、第二環氧樹脂、以及第三環氧樹脂，其中三種或更多種不同的環氧樹脂各自獨立地具有在60℃到105℃範圍內的軟化點，以及使所述感光性樹脂組合物的乾膜光阻、其製備方法、光阻圖案以及裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a photosensitive resin composition comprising three or more different epoxy resins, including a first epoxy resin, a second epoxy resin, and a third epoxy resin, wherein the three or more different epoxy resins each independently have a softening point in a range of 60℃ to 105℃, and a dry film photoresist, a method for preparing the same, a resist pattern, and a device using the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2243" publication-number="202617878">
    <tif-files tif-type="multi-tif">
      <tif file="114136394.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光敏樹脂組合物、使用此組合物的乾膜光阻及其製造方法、抗蝕劑圖案及顯示裝置</chinese-title>
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM PHOTORESIST AND METHOD FOR PREPARING THE SAME, RESIST PATTERN AND DISPLAY DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C08L63/02</main-classification>
        <further-classification edition="200601120260116B">C08L63/04</further-classification>
        <further-classification edition="200601120260116B">C08G59/32</further-classification>
        <further-classification edition="200601120260116B">C11D1/60</further-classification>
        <further-classification edition="201801120260116B">C08K3/014</further-classification>
        <further-classification edition="200601120260116B">G03F7/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓友澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, WOO TACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於能夠基於120微米的膜厚度形成精細圖案、並實現優異的附著力、解析度、剛性和耐化學性的光敏樹脂組合物、使用其的乾膜光阻、用於製備其的方法、抗蝕劑圖案、以及使用其的顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a photosensitive resin composition capable of forming fine patterns based on a 120 ㎛ film thickness, and implementing excellent adhesion, resolution, rigidity, and chemical resistance, a dry film photoresist using the same, a method for preparing the same, a resist pattern, and a display device using the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2244" publication-number="202618567">
    <tif-files tif-type="multi-tif">
      <tif file="114136399.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低功耗雙倍資料速率（ＬＰＤＤＲ）相容高頻寬　ＮＡＮＤ（ＨＢＮ）的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR LOW-POWER DOUBLE DATA RATE (LPDDR) COMPATIBLE HIGH BANDWIDTH NAND (HBN)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F13/16</main-classification>
        <further-classification edition="200601120251201B">G06F13/40</further-classification>
        <further-classification edition="200601120251201B">G11C16/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　宗旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZONGWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　好彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HO BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮茲馬尼　瑞克哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITCHUMANI, REKHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, MYUNG JUNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於低功耗雙倍資料速率（LPDDR）相容高頻寬NAND（HBN）的系統和方法，包括從應用程式接收與記憶體裝置相關聯的請求，請求為請求類型；經由記憶體控制器向記憶體裝置發出第一命令，第一命令基於請求類型；輪詢記憶體裝置以獲得記憶體裝置的狀態，狀態與記憶體裝置對於請求的就緒狀態相關聯；基於狀態確定記憶體裝置已就緒；以及經由記憶體控制器向記憶體裝置發出第二命令以滿足請求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for low-power double data rate (LPDDR) compatible High Bandwidth NAND (HBN) include receiving, from an application, a request associated with a memory device, the request being of a request type; issuing a first command to the memory device via a memory controller, the first command based on the request type; polling the memory device for a status of the memory device, the status associated with a readiness of the memory device for the request; determining that the memory device is ready based on the status; and issuing a second command to the memory device via the memory controller to fulfill the request.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:主機</p>
        <p type="p">104:記憶體裝置</p>
        <p type="p">106:應用程式</p>
        <p type="p">108:處理器</p>
        <p type="p">110:記憶體控制器</p>
        <p type="p">114:前端控制器</p>
        <p type="p">116:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2245" publication-number="202617835">
    <tif-files tif-type="multi-tif">
      <tif file="114136414.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法及半導體器件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G73/10</main-classification>
        <further-classification edition="200601120260202B">C08G73/12</further-classification>
        <further-classification edition="200601120260202B">C08K5/3447</further-classification>
        <further-classification edition="200601120260202B">C08K5/353</further-classification>
        <further-classification edition="200601120260202B">C08L79/08</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">G03F7/40</further-classification>
        <further-classification edition="200601120260202B">B32B15/08</further-classification>
        <further-classification edition="200601120260202B">H01L21/312</further-classification>
        <further-classification edition="200601120260202B">H01L23/29</further-classification>
        <further-classification edition="200601120260202B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小澤友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAWA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法及半導體器件，前述樹脂組成物包含選自由環化樹脂及環化樹脂的前驅物組成之群組中的至少1種樹脂P和具有特定的結構之化合物A。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2246" publication-number="202617646">
    <tif-files tif-type="multi-tif">
      <tif file="114136441.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高純度E-1,2-二氟乙烯的製備</chinese-title>
        <english-title>PREPARATION OF HIGH PURITY E-1,2-DIFLUOROETHYLENE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C17/38</main-classification>
        <further-classification edition="200601120260202B">C07C21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希維特　艾倫　卡普洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEVERT, ALLEN CAPRON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種程序，其包括：提供組成物，其包括E-1,2-二氟乙烯(HFO-E-1132)及Z-1,2-二氟乙烯(HFO-Z-1132)；及藉由分離程序將該HFO-Z-1132與該HFO-E-1132分離，以提供包含該HFO-E-1132且不含或實質上不含HFO-Z-1132的經純化組成物，該分離程序係選自：該組成物之萃取蒸餾、該組成物中的該HFO-Z-1132之化學吸收、及該組成物中的該HFO-Z-1132之化學反應。在另一態樣中，該程序包括：蒸餾HFO-E/Z-1132組成物以提供包括HFO-E-1132且不含或實質上不含HFO-Z-1132的第一餾分及包括大量HFO-Z-1132及少量HFO-E-1132的第二餾分；收集該第一餾分作為經純化組成物；將該第二餾分轉化為1,1,2-三氟乙烷、1,2-二溴-1,2-二氟乙烷、或1,2-二氯-1,2-二氟乙烷；將該1,1,2-三氟乙烷、1,2-二溴-1,2-二氟乙烷、或1,2-二氯-1,2-二氟乙烷轉化為HFO-E/Z-1132；及回收該HFO-E/Z-1132以進行蒸餾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process includes providing a composition including E-1,2-difluoroethylene (HFO-E-1132), and Z-1,2-difluoroethylene (HFO-Z-1132), and separating the HFO-Z-1132 from the HFO-E-1132 by a separation process selected from extractive distillation of the composition, chemical absorption of the HFO-Z-1132 in the composition, and chemical reaction of the HFO-Z-1132 in the composition to provide a purified composition comprising the HFO-E-1132 and being free of or substantially free of HFO-Z-1132. In another aspect, the process includes distilling the HFO-E/Z-1132 composition to provide a first fraction including HFO-E-1132 and free of or substantially free of HFO-Z-1132 and a second fraction including a major amount of HFO-Z-1132 and a minor amount of HFO-E-1132, collecting the first fraction as a purified composition, converting the second fraction to 1,1,2-trifluoroethane, 1,2-dibromo-1,2-difluoroethane or 1,2-dichloro-1,2-difluoroethane, converting the 1,1,2-trifluoroethane, 1,2-dibromo-1,2-difluoroethane or 1,2-dichloro-1,2-difluoroethane to HFO-E/Z-1132, and recycling the HFO-E/Z-1132 for distillation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2247" publication-number="202619283">
    <tif-files tif-type="multi-tif">
      <tif file="114136467.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有堆疊諧振器的變壓器</chinese-title>
        <english-title>TRANSFORMER WITH STACKED RESONATORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H03H7/09</main-classification>
        <further-classification edition="200601120260130B">H03H7/42</further-classification>
        <further-classification edition="200601120260130B">H04B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛晨暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達爾維什　米拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARVISHI, MILAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊正安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種堆疊諧振器電路，其包括一變壓器及多個諧振器電路。該變壓器電路可包括一一次線圈及一二次線圈且可接收來自一特定電路的一輸入信號。耦接至該變壓器的該多個諧振器電路可衰減包括在該輸入信號中的一或多個頻率分量，以產生該輸入信號的一經濾波版本。該變壓器電路可將該輸入信號的該經濾波版本中繼至一不同電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stacked resonator circuit that includes a transformer and multiple resonator circuits is disclosed. The transformer circuit may include a primary coil and secondary coil and may receive an input signal from a particular circuit. The multiple resonator circuit, which are coupled to the transformer, may attenuate one or more frequency components included in the input signal to generate a filtered version of the input signal. The transformer circuit can relay the filtered version of the input signal to a different circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:射頻電路</p>
        <p type="p">101:電路</p>
        <p type="p">102:電路</p>
        <p type="p">103:堆疊諧振器電路</p>
        <p type="p">104:變壓器</p>
        <p type="p">105:諧振器</p>
        <p type="p">106:諧振器</p>
        <p type="p">107:輸入信號</p>
        <p type="p">108:信號</p>
        <p type="p">109:信號</p>
        <p type="p">110:輸出信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2248" publication-number="202619282">
    <tif-files tif-type="multi-tif">
      <tif file="114136470.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括並聯梳狀線圈的濾波器電路</chinese-title>
        <english-title>FILTER CIRCUIT INCLUDING PARALLEL COMB-LIKE COILS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H03H7/01</main-classification>
        <further-classification edition="200601120260127B">H03H7/09</further-classification>
        <further-classification edition="200601120260127B">H01P1/203</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡澤米　瓦南卡斯提　哈米德雷薩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZEMI VARNAMKHASTI, HAMIDREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊正安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露大致上係關於具有串聯諧振器電路系統的濾波器（例如，帶通濾波器）。具體而言，本揭露係關於包括形成串聯諧振器電路系統的多個交叉耦接梳狀(comb-like)線圈的濾波器。該濾波器可包括多個梳狀線圈。該等梳狀線圈可藉由將該等梳狀線圈之第一端子彼此耦接並將該等梳狀線圈之第二端子彼此耦接來進行交叉耦接或並聯耦接。各梳狀線圈可具有一各別諧振頻率範圍。該濾波器的該諧振頻率範圍可對應於彼此交叉耦接的該多個梳狀線圈中之各者的諧振頻率範圍的組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is generally directed to filters (e.g., band-pass filters) having series resonator circuitry. In particular, this disclosure is directed to filters including multiple cross-coupled comb-like coils forming the series resonator circuitry. The filter may include multiple comb-like coils. The comb-like coils may be cross-coupled, or coupled in parallel, by coupling first terminals of the comb-like coils to each other and coupling second terminals of the comb-like coils to each other. Each comb-like coil may have a respective resonating frequency range. The resonating frequency range of the filter may correspond to a combination of resonating frequency ranges of each of the multiple comb-like coils cross-coupled to each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:梳狀線圈</p>
        <p type="p">52-1:第一層；層</p>
        <p type="p">54-1:跡線；中介跡線</p>
        <p type="p">56:第一端子；端子</p>
        <p type="p">58:第二端子；端子</p>
        <p type="p">60:耦接器</p>
        <p type="p">62:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2249" publication-number="202618914">
    <tif-files tif-type="multi-tif">
      <tif file="114136472.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組合物、研磨用組合物之製造方法及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L21/304</main-classification>
        <further-classification edition="200601120260130B">C09G1/02</further-classification>
        <further-classification edition="202501120260130B">C01G45/1207</further-classification>
        <further-classification edition="200601120260130B">C01G25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中貝雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨用組合物，其係包含過錳酸鹽之組成，且能夠實現更高之研磨去除速度。本發明所提供之研磨用組合物包含過錳酸鹽及碳酸鋯化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2250" publication-number="202617433">
    <tif-files tif-type="multi-tif">
      <tif file="114136495.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136495</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗反射膜、及眼罩</chinese-title>
        <english-title>ANTI-REFLECTION FILM AND EYE SHIELD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B32B27/08</main-classification>
        <further-classification edition="200601120260123B">B32B27/18</further-classification>
        <further-classification edition="201501120260123B">G02B1/14</further-classification>
        <further-classification edition="201501120260123B">G02B1/11</further-classification>
        <further-classification edition="200601120260123B">G02C7/16</further-classification>
        <further-classification edition="200601120260123B">A61F9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, CHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田優花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抗反射膜1，其具備由樹脂形成之光學功能層11，光學功能層11具有包含以可見光之波長以下之間距排列之凸部13或凹部14的微細凹凸構造12，光學功能層11之壓入彈性模數為45 MPa以上，光學功能層11之吸水率為11質量%以上，且光學功能層11之表面之水接觸角為65°以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:抗反射膜</p>
        <p type="p">10:基材</p>
        <p type="p">10A:正面</p>
        <p type="p">10B:背面</p>
        <p type="p">11:光學功能層</p>
        <p type="p">12:微細凹凸構造</p>
        <p type="p">13:凸部</p>
        <p type="p">14:凹部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2251" publication-number="202619281">
    <tif-files tif-type="multi-tif">
      <tif file="114136515.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適應於輸入電流變化及輸出電壓位準移位的跨阻抗放大器</chinese-title>
        <english-title>TRANSIMPEDANCE AMPLIFIER ADAPTIVE TO INPUT CURRENT VARIATION AND OUTPUT VOLTAGE LEVEL SHIFT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H03F3/50</main-classification>
        <further-classification edition="200601120260108B">H03F1/30</further-classification>
        <further-classification edition="200601120260108B">H03F1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷神公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYTHEON COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　朝陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHAOYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩頓　馬修　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORTON, MATTHEW A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包括一跨阻抗放大器，該跨阻抗放大器具有至少一個輸入端及一輸出端。該設備亦包括一適應性輸入電流變化電路，該適應性輸入電流變化電路連接至該跨阻抗放大器之該至少一個輸入端且經組態以接收至少一個輸入電流並將該至少一個輸入電流調整至一選定輸入電流，該選定輸入電流被提供至該跨阻抗放大器之該至少一個輸入端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a transimpedance amplifier having at least one input and an output. The apparatus also includes an adaptive input current variation circuit connected to the at least one input of the transimpedance amplifier and configured to receive at least one input current and adjust the at least one input current to a selected input current provided to the at least one input of the transimpedance amplifier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:跨阻抗放大器</p>
        <p type="p">202:適應性輸入電流變化電路</p>
        <p type="p">204:輸出電壓位準移位電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2252" publication-number="202618774">
    <tif-files tif-type="multi-tif">
      <tif file="114136519.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136519</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有用於命令／位址及寫入資料的單一時脈的ＤＲＡＭ</chinese-title>
        <english-title>DRAM WITH SINGLE CLOCK FOR COMMAND/ADDRESS AND WRITE DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G11C11/4063</main-classification>
        <further-classification edition="200601120260126B">G11C7/10</further-classification>
        <further-classification edition="200601120260126B">G11C8/18</further-classification>
        <further-classification edition="200601120260126B">G06F13/14</further-classification>
        <further-classification edition="200601120260126B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬哈占　拉傑許　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHAJAN, RAJESH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　基宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐成旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SEONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆克吉　蘇巴斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHERJEE, SUBHASIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內馬蒂　法里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMATI, FARID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動態隨機存取記憶體(DRAM)裝置包括一組DRAM單元及一外部介面，該外部介面包括一對時脈介面引腳、用於一命令及位址匯流排的四個引腳、及用於一資料匯流排的32個引腳。該命令及位址匯流排經組態以將記憶體命令及位址輸送至該組DRAM單元，而該資料匯流排經組態以將記憶體存取資料輸送至該組DRAM單元及輸送來自該組DRAM單元的記憶體存取資料。該DRAM裝置包括耦接至該對引腳的一時脈分布電路，且經組態以在該對引腳接收一差動時脈信號，且由該時脈分布電路基於該第一差動時脈信號而驅動該命令及位址匯流排上的資訊的有效性的一指示以及該資料匯流排上的寫入資料整體的有效性的一指示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic random-access memory (DRAM) device includes a set of DRAM cells and an external interface, which includes a pair of clock interface pins, four pins for a command and address bus, and 32 pins for a data bus. The command and address bus is configured to convey memory commands and addresses to the set of DRAM cells, while the data bus is configured to convey memory access data to and from the set of DRAM cells. The DRAM device includes a clock distribution circuit coupled to the pair of pins, and is configured to receive at the pair of pins, a differential clock signal, and drive, by the clock distribution circuit based on the first differential clock signal, an indication of validity of information on the command and address bus, as well as an entirety of write data on the data bus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:DRAM裝置</p>
        <p type="p">510:引腳</p>
        <p type="p">520:時脈驅動器</p>
        <p type="p">530A:跡線</p>
        <p type="p">530B:跡線</p>
        <p type="p">530C:跡線</p>
        <p type="p">530D:跡線</p>
        <p type="p">540:時脈分布電路</p>
        <p type="p">550A:內部寫入資料電路；寫入資料電路</p>
        <p type="p">550B:內部寫入資料電路；寫入資料電路</p>
        <p type="p">550C:內部寫入資料電路；寫入資料電路</p>
        <p type="p">550D:內部寫入資料電路；寫入資料電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2253" publication-number="202619279">
    <tif-files tif-type="multi-tif">
      <tif file="114136561.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低雜訊堆疊式場效電晶體設計</chinese-title>
        <english-title>LOW NOISE STACKED FIELD EFFECT TRANSISTOR DESIGN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H03F3/193</main-classification>
        <further-classification edition="200601120260130B">H03F1/26</further-classification>
        <further-classification edition="202501120260130B">H10D62/10</further-classification>
        <further-classification edition="202501120260130B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西普拉克　多瑪戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIPRAK, DOMAGOJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種利用水平堆疊式場效電晶體(FET)的低雜訊放大器結構。該堆疊式FET結構包括水平堆疊且串聯連接（例如，具有一共用源極/汲極區域）的兩個FET。該堆疊式FET結構描述閘極之間的一節距，該節距增加超出針對該裝置之一電晶體區域界定的一最小節距。增加該節距將使該堆疊式結構中的一第二FET之一冶金通道長度減小到低於該最小節距的冶金通道長度。減少該冶金通道長度改善該低雜訊放大器結構的信號雜訊比。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low-noise amplifier structure utilizing horizontally stacked field-effect transistors (FETs) is described. The stacked FET structure includes two FETs stacked horizontally and connected in series (e.g., with a shared source/drain region). The stacked FET structure described a pitch between gates that is increased above a minimum pitch defined for a transistor region of the device. Increasing the pitch reduces a metallurgical channel length of a second FET in the stacked structure below what the metallurgical channel length would be at the minimum pitch. Reducing the metallurgical channel length improves the signal-to-noise ratio of the low-noise amplifier structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:低雜訊放大器(LNA)</p>
        <p type="p">202:基材</p>
        <p type="p">203:電晶體區域</p>
        <p type="p">204:主動區域</p>
        <p type="p">206:閘極區域</p>
        <p type="p">210:場效電晶體(FET)</p>
        <p type="p">212:閘極材料；閘極</p>
        <p type="p">213:間隔物</p>
        <p type="p">214:通道區域</p>
        <p type="p">215:冶金通道長度</p>
        <p type="p">216:摻雜區域</p>
        <p type="p">216A:延伸區域</p>
        <p type="p">218:摻雜區域</p>
        <p type="p">218A:延伸區域</p>
        <p type="p">218B:延伸區域</p>
        <p type="p">220:場效電晶體(FET)</p>
        <p type="p">222:閘極材料</p>
        <p type="p">223:間隔物</p>
        <p type="p">224:通道區域</p>
        <p type="p">226:摻雜區域</p>
        <p type="p">226A:延伸區域</p>
        <p type="p">230:接觸件</p>
        <p type="p">232:接觸件</p>
        <p type="p">250:節距</p>
        <p type="p">252:閘極長度</p>
        <p type="p">259:通道長度</p>
        <p type="p">260:冶金通道長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2254" publication-number="202619276">
    <tif-files tif-type="multi-tif">
      <tif file="114136570.zip" no="1">
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      <volno>24</volno>
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        <document-id>
          <doc-number>202619276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適應於輸入電流變化及輸出電壓位準移位的跨阻抗放大器</chinese-title>
        <english-title>TRANSIMPEDANCE AMPLIFIER ADAPTIVE TO INPUT CURRENT VARIATION AND OUTPUT VOLTAGE LEVEL SHIFT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03F3/08</main-classification>
        <further-classification edition="200601120260102B">H03F1/34</further-classification>
        <further-classification edition="200601120260102B">H03F3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷神公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYTHEON COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　朝陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHAOYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩頓　馬修　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORTON, MATTHEW A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包括一跨阻抗放大器，該跨阻抗放大器具有至少一個輸入端及一輸出端。一輸出電壓位準移位電路連接至該跨阻抗放大器之該輸出端。該輸出電壓位準移位電路經組態以產生一經位準移位之輸出電壓，其中該經位準移位之輸出電壓係回應於一參考輸出電壓而適應的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a transimpedance amplifier having at least one input and an output. An output voltage level shift circuit is connected to the output of the transimpedance amplifier. The output voltage level shift circuit is configured to generate a level-shifted output voltage, where the level-shifted output voltage is adaptive responsive to a reference output voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:跨阻抗放大器</p>
        <p type="p">202:適應性輸入電流變化電路</p>
        <p type="p">204:輸出電壓位準移位電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2255" publication-number="202619438">
    <tif-files tif-type="multi-tif">
      <tif file="114136619.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層電路板及其製造方法以及包括該多層電路板的電子設備</chinese-title>
        <english-title>MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF,AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251113B">H05K3/46</main-classification>
        <further-classification edition="200601120251113B">H05K3/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商斯天克有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEMCO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫東銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, DONG EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴孝振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG SHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種多層電路板及其製造方法以及包括該多層電路板的電子設備，透過使用單面軟性覆銅板和樹脂塗布銅皮來減少製造工序並降低製造成本。該多層電路板包括：核心層；第二電路層，形成在核心層的第一面上；第一層間絕緣層，覆蓋第二電路層；第一電路層，形成在第一層間絕緣層上；第二層間絕緣層，形成在核心層的第二面上；以及第三電路層，形成在第二層間絕緣層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
        <p type="p">S140:步驟</p>
        <p type="p">S150:步驟</p>
        <p type="p">S160:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2256" publication-number="202617639">
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      <tif file="114136663.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617639</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136663</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物、樹脂組成物、硬化物、預浸體、樹脂複合片、印刷配線板、半導體裝置、及低介電填料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C13/547</main-classification>
        <further-classification edition="200601120260202B">C08F232/08</further-classification>
        <further-classification edition="200601120260202B">C08J5/24</further-classification>
        <further-classification edition="200601120260202B">B32B15/08</further-classification>
        <further-classification edition="200601120260202B">B32B27/00</further-classification>
        <further-classification edition="200601120260202B">H05K1/03</further-classification>
        <further-classification edition="200601120260202B">H01L23/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東田和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHITA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二村圭亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUTAMURA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛田健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀井孝幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂健人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKA, KENTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供化合物、以及樹脂組成物、硬化物、預浸體、樹脂複合片、印刷配線板、半導體裝置、及低介電填料。本發明內容之化合物係以式(1A)表示之化合物及/或以式(1B)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="215px" width="409px" file="ed10091.JPG" alt="ed10091.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;        </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2257" publication-number="202619123">
    <tif-files tif-type="multi-tif">
      <tif file="114136668.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619123</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模製分層橋接及其製造方法</chinese-title>
        <english-title>MOLDED LAYERED BRIDGE AND METHOD OF MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L23/538</main-classification>
        <further-classification edition="202301120260131B">H01L25/16</further-classification>
        <further-classification edition="200601120260131B">H01L21/56</further-classification>
        <further-classification edition="200601120260131B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商戴卡科技美國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DECA TECHNOLOGIES USA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維斯　羅賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIS, ROBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾森　提摩西Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSON, TIMOTHY L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢夏普　克雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISHOP, CRAIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山德施托姆　克利福德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDSTROM, CLIFFORD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫曼　保羅Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFFMAN, PAUL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種中介層，其包括一橋接器，該橋接器具有一部件，該部件包括一基底材料及安置於該部件上方之一或多個橋接重佈層(RDL)，其中該等橋接RDL包括導電跡線之交替層及包括聚醯亞胺之交錯介電層，以及安置於該等橋接RDL之間的一橋接囊封劑；該中介層包含貫穿模製互連件，其安置於該橋接器之一周邊中；一囊封劑，其安置於該等貫穿模製互連件周圍及該橋接部件周圍，以及一前側中介層增層，其在該等囊封劑上方、該等貫穿模製互連件上方及該橋接器上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is an interposer comprising a bridge having a component comprising a base material and one or more bridge redistribution layers (RDLs) disposed over the component, where the bridge RDLs comprise alternating layers of electrically conductive traces and interleaved dielectric layers comprising polyimide, and a bridge encapsulant disposed between the bridge RDLs, including through mold interconnects disposed in a periphery of the bridge, an encapsulant disposed around the through mold interconnects and around the bridge component, and a frontside interposer build-up over the encapsulants, over the through mold interconnects, and over the bridge.</p>
      </isu-abst>
      <representative-img>
        <p type="p">103:雙面橋接器，橋接器</p>
        <p type="p">104:跡線</p>
        <p type="p">120:貫穿模製互連件，貫穿模製互連柱，貫穿模製通孔</p>
        <p type="p">180:第一元件</p>
        <p type="p">185:前側互連件</p>
        <p type="p">190:第二元件</p>
        <p type="p">203:垂直互連件，中介層</p>
        <p type="p">205:電源/接地封裝級互連件，電源/接地互連件</p>
        <p type="p">210:訊號封裝級互連件，訊號互連件</p>
        <p type="p">300:電子組件，組件</p>
        <p type="p">302:電子組件，組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2258" publication-number="202619347">
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          <doc-number>202619347</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>重疊區塊內部預測(OBIP)</chinese-title>
        <english-title>OVERLAPPED BLOCK INTRA PREDICTION (OBIP)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/593</main-classification>
        <further-classification edition="201401120260102B">H04N19/182</further-classification>
        <further-classification edition="201401120260102B">H04N19/11</further-classification>
        <further-classification edition="201401120260102B">H04N19/117</further-classification>
        <further-classification edition="201401120260102B">H04N19/157</further-classification>
        <further-classification edition="201401120260102B">H04N19/176</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商內數位ＣＥ專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒　連克　法布里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE LEANNEC, FABRICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜馬斯　帝艾里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUMAS, THIERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朵夜　迪蒂爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOYEN, DIDIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於使用重疊區塊內部預測來預測一視訊中之一當前區塊之方法，該當前區塊經內部寫碼，該方法包括：使用針對該當前區塊所判定之一內部模式來獲得一第一預測區塊；使用針對該當前區塊之一鄰近區塊所判定之一預測模式來獲得至少一個第二預測區塊；及針對該當前區塊之至少一部分使用利用該第一預測區塊及該至少一個第二預測區塊之一重疊區塊內部預測混合來預測該當前區塊。亦提供用於基於該預測來編碼或解碼該當前區塊之方法及對應設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for predicting a current block in a video using overlapped block intra prediction is provided, the current block being intra-coded, the method comprises obtaining a first prediction block using an intra mode determined for the current block, obtaining at least one second prediction block using a prediction mode determined for a neighboring block of the current block, and predicting the current block using an overlapped block intra prediction blending using the first prediction block and the at least one second prediction block for at least a part of the current block. Methods for encoding or decoding the current block based on the predicting are also provided as well as corresponding apparatuses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">1010:自一當前區塊之一內部模式獲得當前區塊之一第一預測區塊</p>
        <p type="p">1020:自一鄰近區塊之一預測模式獲得當前區塊之至少一個第二預測區塊</p>
        <p type="p">1030:用OBIP混合來預測當前區塊</p>
        <p type="p">1040:基於預測來編碼/解碼當前區塊</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2259" publication-number="202618887">
    <tif-files tif-type="multi-tif">
      <tif file="114136677.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">H01L21/027</main-classification>
        <further-classification edition="200601120260121B">C23C16/04</further-classification>
        <further-classification edition="200601120260121B">C23C16/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米澤隆宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEZAWA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中根由太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANE, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川裕騎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理方法包含如下步驟：(a)準備基板，上述基板具備蝕刻對象膜、及上述蝕刻對象膜上之含金屬遮罩，上述含金屬遮罩具備露出上述蝕刻對象膜之至少一個開口；及(b)使用包含金屬鹵化物之第1處理氣體，於上述含金屬遮罩上形成含金屬沉積物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2260" publication-number="202617017">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於烹飪器具的溫度感測裝置及無線通訊改進方案</chinese-title>
        <english-title>TEMPERATURE SENSING DEVICES AND WIRELESS COMMUNICATION IMPROVEMENTS FOR COOKING APPLIANCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A47J36/32</main-classification>
        <further-classification edition="202101120260131B">G01K1/024</further-classification>
        <further-classification edition="202101120260131B">G01K1/02</further-classification>
        <further-classification edition="202401120260131B">H04B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商艾普迅實驗室有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPTION LABS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾曼　法雷爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLEMAN, FARRELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉漢　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALLAGHAN, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉明豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, MING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種溫度感測裝置包括第一收發器裝置和第二收發器裝置，該第一收發器裝置被配置成在第一操作頻率下操作，該第二收發器裝置被配置成在第二操作頻率下操作，第二操作頻率不同於第一操作頻率。溫度感測裝置還可以包括一個或多個處理器和非暫時性電腦可讀介質，非暫時性電腦可讀介質在其上儲存有指令，當指令由一個或多個處理器執行時，使得一個或多個處理器檢測接收信號強度指示符（RSSI），並且回應於RSSI超過預定閾值在第一收發器裝置與第二收發器裝置之間切換，RSSI指示一個或多個無線收發器裝置與遠離溫度感測裝置的裝置之間的無線連接的強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:遠端裝置</p>
        <p type="p">12:無線裝置</p>
        <p type="p">200:烹飪器具</p>
        <p type="p">202:烹飪室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2261" publication-number="202618065">
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      <tif file="114136710.zip" no="1">
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          <doc-number>202618065</doc-number>
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        <document-id>
          <doc-number>114136710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含醇胺之鉬蝕刻抑制劑之CMP組合物</chinese-title>
        <english-title>CMP COMPOSITION INCLUDING ALCOHOL AMINE MOLYBDENUM ETCH INHIBITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C23F1/26</main-classification>
        <further-classification edition="200601120260130B">C01B33/14</further-classification>
        <further-classification edition="200601120260130B">C08G18/32</further-classification>
        <further-classification edition="200601120260130B">C01G39/02</further-classification>
        <further-classification edition="200601120260130B">C09G1/16</further-classification>
        <further-classification edition="200601120260130B">C09K3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>徐維新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯政遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明提供一種化學機械拋光組合物，其包括以下、由以下組成或基本上由以下組成：液體載劑；分散於該液體載劑中之膠態二氧化矽粒子；含鐵拋光加速劑；與該含鐵拋光加速劑結合之穩定劑；包含至少三個醇基及至少兩個胺基之醇胺化合物；及小於約4之pH。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, colloidal silica particles dispersed in the liquid carrier; an iron-containing polishing accelerator; a stabilizer bound to the iron-containing polishing accelerator; an alcohol amine compound including at least three alcohol groups and at least two amine groups; and a pH of less than about 4.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2262" publication-number="202618612">
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      <tif file="114136745.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618612</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於以分子輸入操作之語言模型的分詞器</chinese-title>
        <english-title>TOKENIZER FOR LANGUAGE MODELS TO OPERATE WITH MOLECULAR INPUTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">G06N3/045</main-classification>
        <further-classification edition="202301120251201B">G06N3/044</further-classification>
        <further-classification edition="202001120251201B">G06F40/284</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋國梁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, GUOLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">可將一分子詞彙添加至一語言模型之一分詞器。該分子詞彙可包括字元串作為字組，該等字組基於一分子資料庫而表示原子環境、明確原子位置、及前向連接位置，該分子資料庫包括描述分子及其屬性之資料。可針對該分詞器定義一分子語法，該分子語法將該等分子之各者表示為一各別分子句，該分子句由對應於一各別分子中之原子之一數量並包括來自該分子詞彙之字組的元組構成。可根據該分子詞彙及該分子語法將該等分子符記化。該語言模型可經訓練以針對分子執行屬性預測，或使用該等經符記化分子及其屬性來識別具有目標屬性之分子。該經訓練語言模型可針對不在該分子資料庫中之一分子執行屬性預測，或識別具有該等目標屬性之分子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A molecular vocabulary can be added to a tokenizer of a language model. The molecular vocabulary can include character strings as words representing atomic environments, explicit atomic positions, and forward-connecting positions based on a molecular database that includes data describing molecules and their properties. A molecular syntax can be defined for the tokenizer that represents each of the molecules as a respective molecular sentence made up of tuples corresponding to a quantity of atoms in a respective molecule and including words from the molecular vocabulary. The molecules can be tokenized according to the molecular vocabulary and the molecular syntax. The language model can be trained to perform property prediction for molecules or to identify molecules having targeted properties using the tokenized molecules and their properties. The trained language model can perform property prediction for a molecule not in the molecular database or identify molecules having the targeted properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102,104,106,108,110:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2263" publication-number="202617659">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617659</doc-number>
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        <document-id>
          <doc-number>114136830</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C53/10</main-classification>
        <further-classification edition="200601120260202B">C07C65/10</further-classification>
        <further-classification edition="200601120260202B">C07C309/31</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D211/06</further-classification>
        <further-classification edition="200601120260202B">C07D213/70</further-classification>
        <further-classification edition="200601120260202B">C07D239/38</further-classification>
        <further-classification edition="200601120260202B">C07D265/30</further-classification>
        <further-classification edition="200601120260202B">C07D279/12</further-classification>
        <further-classification edition="200601120260202B">C07D309/12</further-classification>
        <further-classification edition="200601120260202B">C07D409/10</further-classification>
        <further-classification edition="200601120260202B">C07D411/04</further-classification>
        <further-classification edition="200601120260202B">C07D417/10</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡知昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之第一課題在於提供一種對曝光後顯影前的加熱溫度的依賴性較小的感光化射線性或感放射線性樹脂組成物。又，本發明之第二課題在於提供一種涉及上述感光化射線性或感放射線性樹脂組成物的光阻膜、圖案形成方法、及電子器件之製造方法。本發明之感光化射線性或感放射線性樹脂組成物包含樹脂、光酸產生劑、及酸擴散控制劑，其中，上述光酸產生劑及上述酸擴散控制劑中的至少一方為由式（1）表示的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2264" publication-number="202619020">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202619020</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脈衝電源功率組件、晶圓承載裝置及半導體製程設備</chinese-title>
        <english-title>PULSED POWER SUPPLY MODULE, WAFER CARRIER DEVICE, AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/683</main-classification>
        <further-classification edition="200701120260123B">H02M1/44</further-classification>
        <further-classification edition="200601120260123B">H05K9/00</further-classification>
        <further-classification edition="200601120260123B">H05K7/20</further-classification>
        <further-classification edition="200601120260123B">H01F27/30</further-classification>
        <further-classification edition="200601120260123B">H01F38/14</further-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王蕾越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王景遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JING YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東彧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DONG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種脈衝電源功率組件、晶圓承載裝置及半導體製程設備，包括：板卡，具有相背的第一板面和第二板面；功率管，設置在第一板面；冷卻裝置，設置在朝向板卡的第一板面的一側，且與功率管導熱連接；耗散元件，為貼片元件並設置在第一板面且與冷卻裝置導熱連接；共模電感，設置在第二板面上，其副邊線纜穿過板卡並與耗散元件電連接。使共模電感與功率管、冷卻裝置分別位於板卡的兩側，可實現對脈衝電源功率組件結構佈局的優化；與共模電感配合的耗散元件為體積較小的貼片元件，其能避免半導體製程設備的內部空間中EMI的發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a pulsed power supply module, a wafer carrier device, and a semiconductor processing equipment, including: a circuit board having a first board surface and a second board surface on opposite sides; a power transistor disposed on the first board surface; a cooling device mounted on a side facing the first board surface of the circuit board, thermally connected to the power transistor; a dissipative component, which is a surface-mount device disposed on the first board surface and thermally connected to the cooling device; and a common-mode inductor disposed on the second board surface, with its secondary winding cable passing through the circuit board and electrically connected to the dissipative component. By positioning the common-mode inductor and the power transistor/cooling device on opposite sides of the circuit board, the structural layout of the pulsed power supply module can be optimized. The dissipative component paired with the common-mode inductor is a compact surface-mount device, which can prevent the occurrence of EMI within the internal space of the semiconductor processing equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">6:板卡</p>
        <p type="p">8:冷卻裝置</p>
        <p type="p">9:耗散元件</p>
        <p type="p">11:導熱件</p>
        <p type="p">101:環形磁芯</p>
        <p type="p">102:原邊線纜</p>
        <p type="p">103:副邊線纜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2265" publication-number="202618249">
    <tif-files tif-type="multi-tif">
      <tif file="114136896.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136896</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頻寬度量衡設備之校準</chinese-title>
        <english-title>CALIBRATION OF BANDWIDTH METROLOGY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G01N21/64</main-classification>
        <further-classification edition="200601120260127B">G01N21/21</further-classification>
        <further-classification edition="200601120260127B">G01N21/31</further-classification>
        <further-classification edition="200601120260127B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商希瑪有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYMER, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜菲　湯瑪斯　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUFFEY, THOMAS PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格爾吉諾夫　弗拉迪斯拉夫　巴甫洛夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERGINOV, VLADISLAV PAVLOV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種設備，其包括：一單元，其界定包括一校準材料之一內部，該單元在操作中被置放於一校準路徑中；一光學配置，其包括一或多個光學元件，該一或多個光學元件經組態以產生沿著該校準路徑沿著相反方向被引導穿過該單元的一校準光束對；一偵測器，其經組態以感測自該校準光束對與該校準材料之間的一相互作用產生的光；及一控制系統，其與該偵測器且與一頻寬度量衡設備通信。該控制系統經組態以至少基於來自該偵測器之一輸出來校準該頻寬度量衡設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes: a cell defining an interior including a calibration material, the cell, in operation, placed in a calibration path; an optical arrangement including one or more optical elements configured to produce a pair of calibration light beams directed along the calibration path along opposite directions through the cell; a detector configured to sense light produced from an interaction between the pair of calibration light beams and the calibration material; and a control system in communication with the detector and with a bandwidth metrology apparatus. The control system is configured to calibrate the bandwidth metrology apparatus based at least on an output from the detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">142:輸出</p>
        <p type="p">150:控制系統</p>
        <p type="p">402A:區/窗</p>
        <p type="p">403:區</p>
        <p type="p">405:單元</p>
        <p type="p">406:內部</p>
        <p type="p">407:材料/校準材料</p>
        <p type="p">908:路徑</p>
        <p type="p">921i:光束/校準光束</p>
        <p type="p">921ii:光束/校準光束</p>
        <p type="p">924i:透鏡</p>
        <p type="p">924ii:透鏡</p>
        <p type="p">926:位置</p>
        <p type="p">940:偵測器/實施</p>
        <p type="p">941:螢光</p>
        <p type="p">943:透鏡</p>
        <p type="p">944:光學濾波器/濾波器</p>
        <p type="p">945:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2266" publication-number="202617440">
    <tif-files tif-type="multi-tif">
      <tif file="114136897.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>３Ｄ列印模型校正方法、系統、及電腦程式產品</chinese-title>
        <english-title>3D PRINTING MODEL CORRECTION METHODS, SYSTEMS AND COMPUTER PROGRAM PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260130B">B33Y50/02</main-classification>
        <further-classification edition="201701120260130B">B29C64/393</further-classification>
        <further-classification edition="202001120260130B">G06F30/20</further-classification>
        <further-classification edition="200601120260130B">G06T17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡邦公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBON, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊克　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAAKER, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克洛斯特　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOSTER, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於識別一三維(3D)模型中之特徵之方法可包含：接收一3D模型；分析該3D模型以判定該3D模型是否包含一次優特徵；及輸出指示該3D模型是否包含該次優特徵之一通知。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for identifying features in a three-dimensional (3D) model may include receiving a 3D model, analyzing the 3D model to determine whether the 3D model includes a suboptimal feature, and outputting a notification indicating whether the 3D model includes the suboptimal feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">410:步驟</p>
        <p type="p">420:步驟</p>
        <p type="p">430:步驟</p>
        <p type="p">440:步驟</p>
        <p type="p">450:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2267" publication-number="202617906">
    <tif-files tif-type="multi-tif">
      <tif file="114136943.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617906</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化型塗布劑組合物、固化物以及層疊體</chinese-title>
        <english-title>CURABLE COATING COMPOSITION, CURED PRODUCT AND LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C09J4/02</main-classification>
        <further-classification edition="200601120260129B">C08G18/79</further-classification>
        <further-classification edition="200601120260129B">C08F2/50</further-classification>
        <further-classification edition="200601120260129B">C09D133/08</further-classification>
        <further-classification edition="200601120260129B">C09D183/14</further-classification>
        <further-classification edition="201901120260129B">B32B7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荒川化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKAWA CHEMICAL INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳生侑佑里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGYU, YUURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田早紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTA, SAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水口真司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAKUCHI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻田貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJITA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[技術問題]提供一種固化型塗布劑組合物，所述固化型塗布劑組合物提供具有輕剝離力且矽酮轉移量少的固化物的層。&lt;br/&gt;  [技術手段]涉及一種固化型塗布劑組合物、包含該組合物的固化物、具有該固化物的層的層疊體，其中，所述固化型塗布劑組合物包含反應成分的產物（A）和多（甲基）丙烯酸酯（B），所述反應成分包含具有3個以上異氰酸酯基的多異氰酸酯（a1）、具有羥基的聚矽氧烷（a2）以及具有羥基的光聚合引發劑（a3）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem] To provide a curable coating composition that provides a cured layer with low release force and minimal silicone migration.&lt;br/&gt; [Solution] The present invention relates to a curable coating composition comprising a product (A) of reaction components including a polyisocyanate (a1) having three or more isocyanate groups, a polysiloxane (a2) having a hydroxy group, and a photopolymerization initiator (a3) having a hydroxy group, and a poly(meth)acrylate (B); a cured product comprising the composition; and a laminate having a layer of the cured product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2268" publication-number="202618992">
    <tif-files tif-type="multi-tif">
      <tif file="114136945.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L21/673</main-classification>
        <further-classification edition="201901120260130B">B32B7/06</further-classification>
        <further-classification edition="201801120260130B">C09J7/30</further-classification>
        <further-classification edition="200601120260130B">C09J9/00</further-classification>
        <further-classification edition="200601120260130B">C09J133/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）及加工對象物（20），所述黏著性膜（10）包括基材層（A）及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（C）的所述加工對象物（20）進行加工的步驟，所述黏著性樹脂層（C）包含含有熱硬化性樹脂的熱膨脹性微小球。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for manufacturing an electronic device, including: a step of preparing a structure (100), the structure (100) including an adhesive film (10) and an object to be processed (20), the adhesive film (10) including a substrate layer (A) and an adhesive resin layer (C), and the object to be processed (20) being temporarily fixed to the adhesive resin layer (C); and a step of processing the object to be processed (20) temporarily fixed to the adhesive resin layer (C), the adhesive resin layer (C) containing thermally expandable microspheres including a thermosetting resin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著性膜</p>
        <p type="p">20:加工對象物</p>
        <p type="p">30:支撐構件</p>
        <p type="p">40:加工後的加工對象物</p>
        <p type="p">100:結構體</p>
        <p type="p">A:基材層</p>
        <p type="p">C:黏著性樹脂層</p>
        <p type="p">X1:步驟</p>
        <p type="p">X2:步驟</p>
        <p type="p">X3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2269" publication-number="202618091">
    <tif-files tif-type="multi-tif">
      <tif file="114137001.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衣類處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">D06F39/12</main-classification>
        <further-classification edition="200601120251130B">D06F25/00</further-classification>
        <further-classification edition="200601120251130B">D06F58/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商林内股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RINNAI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村悠輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">衣類處理裝置(1)構成為當開閉門蓋(12)開啟時，成為絲屑收集單元(19)向連通路(102a)內側突出的第一狀態，當開閉門蓋(12)封閉時，成為該開閉門蓋(12)與該絲屑收集單元(19)抵接且該開閉門蓋(12)將該絲屑收集單元(19)朝連通路(102a)外側推壓而使該絲屑收集單元(19)向該連通路(102a)內側的突出幅度較該第一狀態為小的第二狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:衣類乾燥機</p>
        <p type="p">3:旋轉滾筒</p>
        <p type="p">4:風扇外殼</p>
        <p type="p">5:燃燒室</p>
        <p type="p">9:燃燒器</p>
        <p type="p">11:本體外殼</p>
        <p type="p">11a:前壁</p>
        <p type="p">11b:後壁</p>
        <p type="p">11c:上壁</p>
        <p type="p">11d:下壁</p>
        <p type="p">12:開閉門蓋</p>
        <p type="p">12b:後框</p>
        <p type="p">12d:後窗部</p>
        <p type="p">12e:扣件</p>
        <p type="p">12g:傾斜面</p>
        <p type="p">14:前滾筒支承部</p>
        <p type="p">15:支軸</p>
        <p type="p">17:供氣導管</p>
        <p type="p">19:絲屑收集單元</p>
        <p type="p">19a:吸入部</p>
        <p type="p">19b:濾網部</p>
        <p type="p">20:排氣導管</p>
        <p type="p">21:供排氣風扇</p>
        <p type="p">30:施力構件</p>
        <p type="p">30b:支承部</p>
        <p type="p">40:吸氣口</p>
        <p type="p">43:前壁</p>
        <p type="p">44:後壁</p>
        <p type="p">57:流出口</p>
        <p type="p">100:衣類取出&lt;img align="absmiddle" height="23px" width="17px" file="d10007.TIF" alt="其他非圖式ed10007.png" img-content="character" orientation="portrait" inline="no" giffile="ed10007.png"/&gt;口</p>
        <p type="p">100a:外周緣</p>
        <p type="p">101:入口形成部</p>
        <p type="p">102:圓筒部</p>
        <p type="p">102a:連通路</p>
        <p type="p">103:下導管部</p>
        <p type="p">110:周壁</p>
        <p type="p">111:後滾筒支承部</p>
        <p type="p">120:連接導管</p>
        <p type="p">121:開口部</p>
        <p type="p">130:滾筒開口</p>
        <p type="p">131:筒身</p>
        <p type="p">133:後壁</p>
        <p type="p">135:小圓孔</p>
        <p type="p">151:風扇滑輪</p>
        <p type="p">152:固定凸緣</p>
        <p type="p">153:覆蓋板</p>
        <p type="p">154:風扇驅動滑輪</p>
        <p type="p">155:風扇皮帶</p>
        <p type="p">160:傳動皮帶</p>
        <p type="p">170:流入口</p>
        <p type="p">171:導管連接口</p>
        <p type="p">190:絲屑濾網</p>
        <p type="p">194:吸入孔</p>
        <p type="p">194:小孔</p>
        <p type="p">200:排氣部</p>
        <p type="p">210:開口部</p>
        <p type="p">G:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2270" publication-number="202617652">
    <tif-files tif-type="multi-tif">
      <tif file="114137042.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、抗蝕劑圖案形成方法、感放射線性酸產生劑及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C07C25/18</main-classification>
        <further-classification edition="200601120251103B">C07C309/24</further-classification>
        <further-classification edition="200601120251103B">C07C309/43</further-classification>
        <further-classification edition="200601120251103B">C07C309/44</further-classification>
        <further-classification edition="200601120251103B">C07C309/47</further-classification>
        <further-classification edition="200601120251103B">C07C309/51</further-classification>
        <further-classification edition="200601120251103B">C07C309/58</further-classification>
        <further-classification edition="200601120251103B">C07C309/59</further-classification>
        <further-classification edition="200601120251103B">C07C381/12</further-classification>
        <further-classification edition="200601120251103B">C07D327/06</further-classification>
        <further-classification edition="200601120251103B">C07D333/46</further-classification>
        <further-classification edition="200601120251103B">C07D333/76</further-classification>
        <further-classification edition="200601120251103B">C07D335/02</further-classification>
        <further-classification edition="200601120251103B">C09K3/00</further-classification>
        <further-classification edition="200601120251103B">C08F212/14</further-classification>
        <further-classification edition="200601120251103B">C08F220/38</further-classification>
        <further-classification edition="200601120251103B">G03F7/004</further-classification>
        <further-classification edition="200601120251103B">G03F7/038</further-classification>
        <further-classification edition="200601120251103B">G03F7/039</further-classification>
        <further-classification edition="200601120251103B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口拓弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柄川冬輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGAWA, FUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感放射線性組成物，含有聚合物（P）且滿足第一要件及第二要件中的一個以上，所述聚合物（P）包含具有酸解離性基的結構單元。第一要件：聚合物（P）更包含源自式（1）所表示的鎓鹽化合物的結構單元。第二要件：更含有式（1）所表示的鎓鹽化合物。式（1）中，A&lt;sup&gt;1&lt;/sup&gt;為-OH、-COOH、-NHCOR&lt;sup&gt;7&lt;/sup&gt;、-CONHR&lt;sup&gt;7&lt;/sup&gt;、-SH、-COH、-NHSO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;7&lt;/sup&gt;、-SO&lt;sub&gt;2&lt;/sub&gt;NHR&lt;sup&gt;7&lt;/sup&gt;或-SO&lt;sub&gt;3&lt;/sub&gt;H。J&lt;sup&gt;+&lt;/sup&gt;為感放射線性陽離子。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="162px" width="328px" file="ed10062.JPG" alt="ed10062.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2271" publication-number="202619338">
    <tif-files tif-type="multi-tif">
      <tif file="114137056.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裸眼三維液晶單元和製造其的方法、顯示裝置</chinese-title>
        <english-title>STEREOSCOPIC LIQUID CRYSTAL CELL, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260123B">H04N13/302</main-classification>
        <further-classification edition="202001120260123B">G02B30/27</further-classification>
        <further-classification edition="202001120260123B">G02B30/20</further-classification>
        <further-classification edition="200601120260123B">G02F1/1335</further-classification>
        <further-classification edition="200601120260123B">G02F1/1339</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷亞有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商鐳亞電子（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA ELECTRONICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>215500中國江蘇省蘇州市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克瑞伯斯　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KREBBERS, ANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的至少一個實施例提供了一種裸眼三維液晶單元和製造其的方法、顯示裝置。該裸眼三維液晶單元包括：上基板組件，包括上基板以及設置在上基板下方的上電極層；下基板組件，包括下基板以及設置在下基板上方的下電極層；中間層，設置在下基板組件和上基板組件之間，中間層包括：設置在上電極層下方的透鏡組件；設置在透鏡組件和下基板組件之間的至少一間隙控制件；以及填充透鏡組件、至少一間隙控制件和下電極層之間的間隙的液晶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">At least one embodiment of the present disclosure provides a stereoscopic liquid crystal cell, a method for manufacturing the same, and a display device. The stereoscopic liquid crystal cell includes: an upper substrate assembly including an upper substrate and an upper electrode layer disposed below the upper substrate; a lower substrate assembly including a lower substrate and a lower electrode layer disposed above the lower substrate; an intermediate layer disposed between the lower substrate assembly and the upper substrate assembly, the intermediate layer comprising: a lens assembly disposed below the upper electrode layer; at least one spacer disposed between the lens assembly and the lower substrate assembly; and liquid crystal filling a gap between the lens assembly, the at least one spacer and the lower electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:上基板組件</p>
        <p type="p">24:下基板組件</p>
        <p type="p">26:中間層</p>
        <p type="p">221:上基板</p>
        <p type="p">222:上電極層</p>
        <p type="p">241:下基板</p>
        <p type="p">242:下電極層</p>
        <p type="p">261:透鏡組件</p>
        <p type="p">262:間隙控制件</p>
        <p type="p">263:液晶</p>
        <p type="p">264:絕緣層</p>
        <p type="p">265:密封組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2272" publication-number="202619124">
    <tif-files tif-type="multi-tif">
      <tif file="114137072.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內嵌橋接的封裝基板及其製造方法</chinese-title>
        <english-title>PACKAGING SUBSTRATE HAVING EMBEDDED BRIDGE AND MANUFACTURING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L23/538</main-classification>
        <further-classification edition="200601120260130B">H01L23/15</further-classification>
        <further-classification edition="200601120260130B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　性振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實現例涉及一種內嵌橋接的封裝基板，其包括：玻璃芯，具有腔體及貫穿電極；橋接，設置在所述腔體；集成電極，設置在所述橋接的一表面及所述玻璃芯的一表面上；以及絕緣材料，設置在所述玻璃芯與所述橋接之間及所述集成電極之間。所述橋接包括：作為支撐體的橋接芯；以及橋接電極，設置在所述橋接芯內部，所述橋接電極使所述橋接一表面的至少兩個點彼此電連接，所述橋接電極的兩個末端暴露於橋接芯的表面。所述集成電極是與所述貫穿電極及所述橋接電極中的至少一個電連接的導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment relates to a packaging substrate having an embedded bridge, and comprises: a glass core having a cavity and through-electrodes; a bridge disposed in the cavity; an integrated electrode disposed on one surface of the bridge and on one surface of the glass core; and an insulating material disposed between the glass core and the bridge and between the integrated electrode. The bridge comprises: a bridge core, which is a support; and a bridge electrode disposed inside the bridge core, electrically interconnecting at least two points on one face of the bridge, with both ends exposed to a surface of the bridge core. The integrated electrode is an electrically conductive layer electrically connected to at least one of the through-electrodes and the bridge electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:層合玻璃</p>
        <p type="p">23a:第一玻璃</p>
        <p type="p">23b:第二玻璃</p>
        <p type="p">74a:橋接內部電極</p>
        <p type="p">76:固定部</p>
        <p type="p">74t:橋接貫穿電極</p>
        <p type="p">42:貫穿電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2273" publication-number="202616949">
    <tif-files tif-type="multi-tif">
      <tif file="114137112.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137112</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備具有捲筒裝卸機構的拖曳裝置的釣魚用捲線器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251009B">A01K89/015</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古洛布萊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBERIDE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永井諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, RYOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤大智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太良享平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIRA, KYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種具備具有捲筒裝卸機構的拖曳裝置的釣魚用捲線器，不在拖曳裝置另外設置按鈕等，而兼備制動力調整與捲筒的裝卸的雙方的功能&lt;br/&gt;  本發明的解決手段為一種釣魚用捲線器，包含：捲線器本體；配設在捲線器本體之操作部；被支撐在捲線器本體之捲筒軸；配設在捲筒軸，藉由操作部的捲繞操作而捲繞釣線之捲筒；可調整對捲筒的制動力之拖曳裝置，拖曳裝置具有拖曳旋鈕，藉由操作拖曳旋鈕使調整對捲筒的制動力與從捲筒軸卸下捲筒的雙方為可能而構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3a:前面軸環</p>
        <p type="p">4:捲筒軸</p>
        <p type="p">4a:圓周槽</p>
        <p type="p">4b:止轉銷</p>
        <p type="p">10:捲筒裝卸機構</p>
        <p type="p">11:筒軸</p>
        <p type="p">11a:第一端部</p>
        <p type="p">11b:第二端部</p>
        <p type="p">12:槽</p>
        <p type="p">13:按鈕</p>
        <p type="p">13a:按壓操作部(被按壓部)</p>
        <p type="p">13b:筒部(卡合部)</p>
        <p type="p">13c:推拔</p>
        <p type="p">13d:突出部</p>
        <p type="p">14:推迫彈簧</p>
        <p type="p">51:拖曳旋鈕</p>
        <p type="p">53:制動構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2274" publication-number="202617817">
    <tif-files tif-type="multi-tif">
      <tif file="114137116.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137116</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻膜</chinese-title>
        <english-title>PHOTORESIST FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G8/28</main-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/022</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/09</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長春人造樹脂廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG CHUN PLASTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜安邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, AN-PANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳易霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王炳傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, ZIHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光阻膜，其在曝光前具有一鑿痕硬度為B至3H，且該光阻膜具有至少一玻璃轉化溫度(Glass Transition Temperature, Tg)小於100°C。本發明除了具備高表面硬度及良好成膜性，其更無須乘載膜之輔助即可直接轉印，且膜體軟硬適中而易於收捲，又能達到理想的曝光解析度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a photoresist film which, prior to exposure, exhibits a gouge hardness ranging from B to 3H, and possesses at least one glass transition temperature (Tg) of less than 100 °C. In addition to having high surface hardness and excellent film-forming properties, the photoresist film of the present invention can be directly transferred without the need for a supporting carrier film. Moreover, the film body has a moderate balance of softness and hardness that facilitates roll-up, while still achieving an ideal exposure resolution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2275" publication-number="202618375">
    <tif-files tif-type="multi-tif">
      <tif file="114137149.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B11/30</main-classification>
        <further-classification edition="202101120260127B">G02B7/105</further-classification>
        <further-classification edition="200601120260127B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林茂宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MAOZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳白娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BAINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIANPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、第四透鏡及第五透鏡，其中，當被攝物由無窮遠移到微距時，該光學成像鏡頭對應形成一第一對焦狀態及一第二對焦狀態來達到對焦目的。第五透鏡具有負屈光率，第五透鏡的物側面的一光軸區域為凹面，第五透鏡的像側面的一光軸區域為凹面。其中，光學成像鏡頭的透鏡只有五片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens includes a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element in sequence along an optical axis from an object side to an image side. When the object moves from infinity to macro, the optical imaging lens correspondingly forms a first focusing state and a second focusing state to achieve the focusing purpose. The fifth lens element has negative refractive power, an optical axis region of the object-side surface of the fifth lens element is convex, and an optical axis region of the image-side surface of the fifth lens element is convex. Lens elements included by the optical imaging lens are only five lens elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學成像鏡頭</p>
        <p type="p">2:光圈</p>
        <p type="p">3:濾光片</p>
        <p type="p">4:成像面</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">I:光軸</p>
        <p type="p">11、21、31、41、51:物側面</p>
        <p type="p">12、22、32、42、52:像側面</p>
        <p type="p">13、16、23、26、33、36、43、46、53、56:光軸區域</p>
        <p type="p">14、17、24、27、34、37、44、47、54、57:圓周區域</p>
        <p type="p">10:第一透鏡</p>
        <p type="p">20:第二透鏡</p>
        <p type="p">30:第三透鏡</p>
        <p type="p">40:第四透鏡</p>
        <p type="p">50:第五透鏡</p>
        <p type="p">81:前透鏡組</p>
        <p type="p">82:後透鏡組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2276" publication-number="202617374">
    <tif-files tif-type="multi-tif">
      <tif file="114137180.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制機器人裝置以執行任務</chinese-title>
        <english-title>CONTROLLING ROBOTIC DEVICES TO PERFORM TASKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B25J9/00</main-classification>
        <further-classification edition="200601120260131B">B25J13/06</further-classification>
        <further-classification edition="200601120260131B">B25J9/10</further-classification>
        <further-classification edition="200601120260131B">B25J9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商忒克塔系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACTA SYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>果達　達瑞爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDA, DARIUSZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HARRY ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫格德　達山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEGDE, DARSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯清凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, QINGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱日嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於控制機器人裝置執行任務之方法可包括判定對應於與一機器人裝置的複數個指頭的一指頭耦接的感測器的一區段的一力測量。該力測量包括在該區段中基於對應於一時間與一物體接觸而判定的一力的一量值及該力的一形心的一定位。該方法可進一步包括判定對應於該時間的該指頭的一指頭定位，且基於一預測移動該指頭以穩定該物體來執行一任務。一機器學習模型可基於該力測量及該指頭定位產生該預測。亦描述並主張其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for controlling a robotic device to perform a task may include determining a force measurement corresponding to a section of sensors coupled with a digit of a plurality of digits of a robotic device. The force measurement may include a magnitude of a force and a position of a centroid of the force in the section that are determined based on contact with an object corresponding to a time. The method may further include determining a digit position of the digit corresponding to the time, and moving the digit, based on a prediction, to stabilize the object to perform a task. A machine learning model can generate the prediction based on the force measurement and the digit position. Other aspects are also described and claimed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:輸入</p>
        <p type="p">102:機器人裝置</p>
        <p type="p">103:輸出</p>
        <p type="p">104A~104E:指頭</p>
        <p type="p">105:區段</p>
        <p type="p">106:控制器</p>
        <p type="p">107:運動感測器</p>
        <p type="p">108:資料結構</p>
        <p type="p">110:測量</p>
        <p type="p">111:訓練資料</p>
        <p type="p">112:目標資料</p>
        <p type="p">114A:場景攝影機</p>
        <p type="p">114B:感測攝影機</p>
        <p type="p">115:示範裝置</p>
        <p type="p">116A~116E:指頭</p>
        <p type="p">117:感測器區段</p>
        <p type="p">119A:場景攝影機</p>
        <p type="p">119B:感測攝影機</p>
        <p type="p">121:輸入</p>
        <p type="p">123:輸出</p>
        <p type="p">129:運動感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2277" publication-number="202619004">
    <tif-files tif-type="multi-tif">
      <tif file="114137183.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板搬送裝置及基板搬送方法</chinese-title>
        <english-title>SUBSTRATE CARRIER APPARATUS AND SUBSTRATE CARRYING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/677</main-classification>
        <further-classification edition="200601120260122B">H01L21/683</further-classification>
        <further-classification edition="200601120260122B">G01H11/06</further-classification>
        <further-classification edition="200601120260122B">G01H9/00</further-classification>
        <further-classification edition="200601120260122B">B25J19/02</further-classification>
        <further-classification edition="200601120260122B">B65G49/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種於光學感測器之升降期間可減少光學感測器之振動之技術。  &lt;br/&gt;基板搬送裝置具備末端執行器21、搬送驅動部22、光學感測器29、振動感測器27、及振子28。末端執行器21支持基板。搬送驅動部22包含使末端執行器21升降之升降驅動部24、及使末端執行器21於進退方向移動之進退移動部23。光學感測器29設置於末端執行器21，檢測基板收容器內之基板。振動感測器27檢測光學感測器29之振動。振子28與搬送驅動部22分開設置。振子28基於振動感測器27之檢測，使光學感測器29於鉛直方向振動，減少因搬送驅動部22之驅動所致之光學感測器29之振動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板搬送裝置(第1搬送單元)</p>
        <p type="p">21:末端執行器</p>
        <p type="p">22:搬送驅動部</p>
        <p type="p">23:進退驅動部</p>
        <p type="p">24:升降驅動部</p>
        <p type="p">25:旋轉驅動部</p>
        <p type="p">26:移動驅動部</p>
        <p type="p">27:振動感測器</p>
        <p type="p">28:振子</p>
        <p type="p">29:光學感測器</p>
        <p type="p">211A:第1長條部分</p>
        <p type="p">212:連結部分</p>
        <p type="p">231:臂</p>
        <p type="p">232:馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2278" publication-number="202618547">
    <tif-files tif-type="multi-tif">
      <tif file="114137207.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將硬體裝置整合至異質計算平台之執行緒執行環境中</chinese-title>
        <english-title>INTEGRATING HARDWARE DEVICES INTO A THREAD EXECUTION ENVIRONMENT OF A HETEROGENEOUS COMPUTING PLATFORM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260108B">G06F9/30</main-classification>
        <further-classification edition="200601120260108B">G06F9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾　宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, TZUNG REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施　天寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, TIEN-PAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於將硬體輸入/輸出(「I/O」)裝置整合至一異質計算平台之一執行緒執行環境中的系統及方法，包括電腦可讀媒體。在計算平台處使用與硬體I/O裝置通信之一中央處理器來實施該等方法。該中央處理器實例化用於執行一機器學習(「ML」)工作負載之一任務的一第一處理執行緒且產生一第一指令，該第一指令將第一處理執行緒分配給平台之一硬體I/O裝置。回應於在硬體I/O裝置處執行第一指令，將硬體I/O裝置整合至中央處理器之一執行緒執行環境中。該硬體I/O裝置藉由使用硬體I/O裝置之一矩陣計算單元執行向量乘法來執行ML工作負載之任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems, including computer-readable media, are described for integrating hardware Input/Output (“I/O”) devices into a thread execution environment of a heterogeneous computing platform. The methods are implemented at the computing platform using a central processor that communicates with the hardware I/O devices. The central processor instantiates a first processing thread that is used to execute a task of a machine-learning (“ML”) workload and generates a first instruction that allocates the first processing thread to a hardware I/O device of the platform. The hardware I/O device is integrated into a thread execution environment of the central processor in response to executing the first instruction at the hardware I/O device. The hardware I/O device executes the task of the ML workload by performing vector multiplications using a matrix computing unit of the hardware I/O device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:異質計算平台/系統</p>
        <p type="p">102:系統單晶片</p>
        <p type="p">104:中央處理器</p>
        <p type="p">105:記憶體控制器</p>
        <p type="p">106:共用記憶體</p>
        <p type="p">108:人工智慧/機器學習(AI/ML)執行緒控制管理器</p>
        <p type="p">110:IP/電路區塊</p>
        <p type="p">112:影像信號處理器</p>
        <p type="p">114:數位信號處理器</p>
        <p type="p">116:專用處理單元</p>
        <p type="p">117:圖形處理單元</p>
        <p type="p">118:可插拔AI/ML加速器引擎(PAAE)</p>
        <p type="p">122:記憶體裝置</p>
        <p type="p">130:計算裝置/使用者/用戶端裝置</p>
        <p type="p">130a:智慧型電話</p>
        <p type="p">130b:平板電腦</p>
        <p type="p">130c:膝上型電腦</p>
        <p type="p">130d:智慧型手錶(或可穿戴裝置)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2279" publication-number="202618190">
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      <tif file="114137223.zip" no="1">
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      <volno>24</volno>
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          <doc-number>202618190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">F25B31/02</main-classification>
        <further-classification edition="200601120260123B">F25B49/02</further-classification>
        <further-classification edition="200601120260123B">H02P27/06</further-classification>
        <further-classification edition="201601120260123B">H02P29/60</further-classification>
        <further-classification edition="200701120260123B">H02M7/5387</further-classification>
        <further-classification edition="202501120260123B">H10D62/832</further-classification>
        <further-classification edition="200601120260123B">H02K9/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝田一貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOTA, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>入野裕介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRINO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸成辰也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONARI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種使用搭載有SiC元件之逆變器之高效率之冷卻裝置。  &lt;br/&gt;本揭示之冷卻裝置具有：冷媒電路，其包含內置馬達之壓縮機、冷凝器、節流裝置及蒸發器；旁通電路，其自冷媒電路分支；逆變器，其驅動馬達；及控制部；且驅動壓縮機之馬達藉由旁通電路中流動之冷媒而冷卻；控制馬達之控制部使包含寬帶隙半導體元件之逆變器以載波頻率10 kHz以上動作；馬達之額定轉速[rpm]與額定功率[kW]之平方根之積為180,000以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:壓縮機驅動系統</p>
        <p type="p">10:壓縮機</p>
        <p type="p">11:馬達</p>
        <p type="p">12:控制板</p>
        <p type="p">13:電源</p>
        <p type="p">14:逆變器</p>
        <p type="p">15:內部電源</p>
        <p type="p">16:磁性軸承控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2280" publication-number="202619344">
    <tif-files tif-type="multi-tif">
      <tif file="114137233.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態畫像編碼裝置、動態畫像解碼裝置、動態畫像編碼方法、動態畫像解碼方法及畫像傳送系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251201B">H04N19/20</main-classification>
        <further-classification edition="201401120251201B">H04N19/46</further-classification>
        <further-classification edition="201401120251201B">H04N19/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>峯澤彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEZAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤坂信太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKASAKA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡原浩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAHARA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴇矢悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKIYA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古田訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供可將特徵映射有效率地進行編碼的動態畫像編碼裝置。  &lt;br/&gt;解決方式：動態畫像編碼裝置(11)係具備：特徵映射轉換部(112)，其係使用由畫像(T)所抽出的複數特徵量，選擇一個特徵映射或複數個特徵映射來進行打包；及編碼部(113)，其係使用所被選擇出的一個或複數個特徵映射來進行編碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:動態畫像編碼裝置</p>
        <p type="p">111:特徵量抽出部</p>
        <p type="p">112:特徵映射轉換部</p>
        <p type="p">113,114:編碼部</p>
        <p type="p">115:記憶體</p>
        <p type="p">Fe:編碼串流</p>
        <p type="p">T:畫像</p>
        <p type="p">Te:編碼串流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2281" publication-number="202618267">
    <tif-files tif-type="multi-tif">
      <tif file="114137240.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於監測裝置的壁狀態之感測器配置及方法</chinese-title>
        <english-title>SENSOR ARRANGEMENT AND METHOD FOR MONITORING A STATUS OF A WALL OF DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G01N25/18</main-classification>
        <further-classification edition="200601120260116B">G01N25/72</further-classification>
        <further-classification edition="200601120260116B">H01L21/67</further-classification>
        <further-classification edition="200601120260116B">C23C16/00</further-classification>
        <further-classification edition="200601120260116B">G01B21/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列支敦斯登商英飛康股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INFICON AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫維契柯　伊格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUVYCHKO, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉皮多特　馬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAPIDOT, MATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於監測裝置的壁之一部分上的材料沉積或用於監測裝置的壁之一部分的狀態之感測器配置，該感測器配置包括：&lt;br/&gt;  一溫度感測元件，其可附接或附接至該壁的該部分；&lt;br/&gt;  一熱換能器，其可附接或附接至該壁的該部分，其中該熱換能器設計成用於向該壁的該部分傳遞一熱脈衝；以及&lt;br/&gt;  一處理單元，其可操作地連接至該溫度感測元件，用於接收該壁的該部分之一測量溫度，&lt;br/&gt;  其中該處理單元係佈置及配置成儲存該測量溫度的一時間過程(time course)及/或評估該測量溫度的該時間過程之一特性。&lt;br/&gt;  本發明的範圍進一步在於使用該設備的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sensor arrangement for monitoring material deposition on a section of wall of a device or for monitoring the status of a section of a wall of a device, the sensor arrangement comprising:&lt;br/&gt; - a temperature sensing element, which is attachable or attached to said section of the wall,&lt;br/&gt; - a heat transducer, which is attachable or attached to said section of the wall, wherein the heat transducer is designed to deliver a thermal pulse to said section of the wall, and&lt;br/&gt; - a processing unit operationally connected to said temperature sensing element for receiving a measured temperature of said section of the wall,&lt;br/&gt; wherein the processing unit is arranged and configured to store a time course of said measured temperature and/or to evaluate a characteristic of said time course of said measured temperature.&lt;br/&gt; Further in the scope of the invention lies method using the apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:感測器配置</p>
        <p type="p">11:溫度感測元件</p>
        <p type="p">12:熱換能器</p>
        <p type="p">13:處理單元</p>
        <p type="p">14,14':時間過程</p>
        <p type="p">20:壁</p>
        <p type="p">21:材料沉積</p>
        <p type="p">
        &lt;img align="absmiddle" height="16px" width="11px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;:溫度</p>
        <p type="p">t:時間</p>
        <p type="p">P:電力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2282" publication-number="202618796">
    <tif-files tif-type="multi-tif">
      <tif file="114137252.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測金屬線路中的缺陷的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE DETECTING DEFECT IN METAL LINES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G11C29/12</main-classification>
        <further-classification edition="200601120260123B">G11C29/50</further-classification>
        <further-classification edition="200601120260123B">G11C29/02</further-classification>
        <further-classification edition="200601120260123B">G11C5/14</further-classification>
        <further-classification edition="200601120260123B">G01R31/30</further-classification>
        <further-classification edition="200601120260123B">G11C11/4091</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊勝敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SENG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炳喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BYEONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：電源控制電路，其被配置為產生包括在測試模式訊號被致能時被控制的時段期間產生的脈衝的應力訊號，以及被配置為透過基於應力訊號驅動金屬線路來向金屬線路施加應力；以及電源電路，其被配置為在電源控制訊號被致能的區間期間向感測放大器提供驅動電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a power control circuit configured to generate a stress signal including pulses generated during a period that is controlled when a test mode signal is enabled and configured to apply stress to a metal line by driving the metal line based on the stress signal, and a power supply circuit configured to supply a driving voltage to a sense amplifier during an interval while a power control signal is enabled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:電源控制電路</p>
        <p type="p">11:應力控制電路(STR CTR)</p>
        <p type="p">12:電源控制訊號產生電路(VC SIG GEN)</p>
        <p type="p">20:電源電路(VOL SUP)</p>
        <p type="p">30:感測放大器(SA)</p>
        <p type="p">40:記憶體電路</p>
        <p type="p">50:缺陷檢測電路(DEF DET)</p>
        <p type="p">BL:位元線</p>
        <p type="p">BLB:反相位元</p>
        <p type="p">CAP:電容器</p>
        <p type="p">EN:致能訊號</p>
        <p type="p">MC:記憶體單元</p>
        <p type="p">ML1:第一金屬線路</p>
        <p type="p">ML2:第二金屬線路</p>
        <p type="p">ML3:第三金屬線路</p>
        <p type="p">RTO:第一驅動電壓</p>
        <p type="p">SEL1:第一選擇訊號</p>
        <p type="p">SEL2:第二選擇訊號</p>
        <p type="p">SEL3:第三選擇訊號</p>
        <p type="p">SAP1:第一電源控制訊號</p>
        <p type="p">SAP2:第二電源控制訊號</p>
        <p type="p">SAPN:第三電源控制訊號</p>
        <p type="p">SB:第二驅動電壓</p>
        <p type="p">SR:應力訊號</p>
        <p type="p">TM:測試模式訊號</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2283" publication-number="202619024">
    <tif-files tif-type="multi-tif">
      <tif file="114137263.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有彎曲的面向基材表面之熱處理設備</chinese-title>
        <english-title>THERMAL-PROCESS APPARATUSES WITH CURVED SUBSTRATE-FACING SURFACES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/687</main-classification>
        <further-classification edition="200601120260102B">H01L21/673</further-classification>
        <further-classification edition="200601120260102B">H01L21/324</further-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班柏格　賽西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMESBERGER, SETH J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　炳辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, BYUNG-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">支撐系統之一些實施例包含一熱源；一彎曲結構，其中該彎曲結構具有一彎曲支撐表面及一平坦底部表面，其中該平坦底部表面面向該熱源之一表面；及一留存板，其包括放置在該熱源之該表面上的一第一表面、相反於該第一表面之一第二表面、及一留存特徵，其中該彎曲結構被定位在該留存特徵中且該彎曲支撐表面之至少部分延伸在該留存板之該第二表面上方，且其中該留存特徵具有表面，其限制該彎曲結構遠離該熱源之移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments of a support system comprise a thermal source; a curved structure, wherein the curved structure has a curved supporting surface and a flat bottom surface, wherein the flat bottom surface faces a surface of the thermal source; and a retaining plate including a first surface that rests on the surface of the thermal source, a second surface opposite to the first surface, and a retaining feature, wherein the curved structure is positioned in the retaining feature and at least part of the curved supporting surface extends above the second surface of the retaining plate, and wherein the retaining feature has surface that limits movement of the curved structure away from the thermal source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">42:熱源</p>
        <p type="p">49:平坦表面</p>
        <p type="p">80A:內彎曲結構</p>
        <p type="p">80B:外彎曲結構</p>
        <p type="p">90:留存板</p>
        <p type="p">98:第二表面</p>
        <p type="p">99:第一表面</p>
        <p type="p">300:基材</p>
        <p type="p">302:外邊緣</p>
        <p type="p">rg:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2284" publication-number="202617796">
    <tif-files tif-type="multi-tif">
      <tif file="114137312.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改質共軛二烯系聚合物、改質共軛二烯系聚合物之製造方法、捆包物、橡膠組合物、及輪胎</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F212/08</main-classification>
        <further-classification edition="200601120260202B">C08F230/08</further-classification>
        <further-classification edition="200601120260202B">C08F236/06</further-classification>
        <further-classification edition="200601120260202B">C08F4/48</further-classification>
        <further-classification edition="200601120260202B">C08F8/42</further-classification>
        <further-classification edition="200601120260202B">C08C19/42</further-classification>
        <further-classification edition="200601120260202B">C08L15/00</further-classification>
        <further-classification edition="200601120260202B">C08K3/04</further-classification>
        <further-classification edition="200601120260202B">C08K3/36</further-classification>
        <further-classification edition="200601120260202B">B60C1/00</further-classification>
        <further-classification edition="200601120260202B">B60C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部拓馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATABE, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋爪裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIZUME, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石坂隆宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKA, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久村謙太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HISAMURA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種改質共軛二烯系聚合物，其滿足下述＜條件(i)＞～＜條件(v)＞。  &lt;br/&gt;＜條件(i)＞  &lt;br/&gt;於100℃下測定之慕尼黏度為100以上。  &lt;br/&gt;＜條件(ii)＞  &lt;br/&gt;玻璃轉移溫度為-95℃～-45℃。  &lt;br/&gt;＜條件(iii)＞  &lt;br/&gt;矽原子之含量相對於改質共軛二烯系聚合物之總量為170 ppm以上，矽原子之含量相對於氮原子之含量之質量比為3以上。  &lt;br/&gt;＜條件(iv)＞  &lt;br/&gt;改質率為70質量%以上。  &lt;br/&gt;＜條件(v)＞  &lt;br/&gt;藉由附有黏度檢測器之GPC-光散射法測定法所得之分支度(Bn)為6以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2285" publication-number="202618068">
    <tif-files tif-type="multi-tif">
      <tif file="114137325.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137325</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電解器系統</chinese-title>
        <english-title>ELECTROLYSER SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260202B">C25B1/00</main-classification>
        <further-classification edition="202101120260202B">C25B9/17</further-classification>
        <further-classification edition="202101120260202B">C25B9/70</further-classification>
        <further-classification edition="201601120260202B">H01M8/12</further-classification>
        <further-classification edition="201601120260202B">H01M8/2465</further-classification>
        <further-classification edition="201601120260202B">H01M8/2484</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商席瑞絲電力有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERES POWER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多曼斯基　托馬茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOMANSKI, TOMASZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電化學電池系統，其包含：一殼體；電化學電池單元之複數個堆疊，其含於該殼體內；以及一歧管，其經組配以將流體供應至該等複數個堆疊及/或自該等複數個堆疊排出流體。該歧管經組配以由該殼體之一第一末端處的一第一部位支撐並固定至該第一部位。該歧管經進一步組配以在該殼體內之一第二部位處由該殼體支撐並相對於該殼體鉸接，該第二部位遠離該殼體之該第一末端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrochemical cell system comprising an enclosure, a plurality of stacks of electrochemical cell units contained within the enclosure, and a manifold configured to supply fluid to and/or exhaust fluid from the plurality of stacks. The manifold is configured to be supported by and fixed to a first location at a first end of the enclosure. The manifold is further configured to be supported by, and articulated relative to, the enclosure at a second location within the enclosure, distal from the first end of the enclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電解器堆疊</p>
        <p type="p">14:殼體</p>
        <p type="p">16:內部隔熱層</p>
        <p type="p">18:可移除式蓋</p>
        <p type="p">20:隔熱層</p>
        <p type="p">22:支撐床</p>
        <p type="p">24:共用容積</p>
        <p type="p">26:第一支撐腳</p>
        <p type="p">28:第二支撐腳</p>
        <p type="p">30:樞轉臂</p>
        <p type="p">32:歧管</p>
        <p type="p">34:樞轉式支撐框架</p>
        <p type="p">38:第一末端</p>
        <p type="p">40:另一末端</p>
        <p type="p">50:鉸鏈/鉸鏈軸線</p>
        <p type="p">200:電解器系統/電解系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2286" publication-number="202618553">
    <tif-files tif-type="multi-tif">
      <tif file="114137326.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>故障根因定位方法、系統、電腦存儲介質和程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G06F11/07</main-classification>
        <further-classification edition="201901120251103B">G06F16/901</further-classification>
        <further-classification edition="200601120251103B">G06F11/30</further-classification>
        <further-classification edition="200601120251103B">G06F11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竇同東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOU, TONGDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李本凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BENKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及電腦技術領域，並且更具體地涉及一種故障根因定位方法、實施該方法的故障根因定位系統、電腦可讀存儲介質和電腦程式產品。該方法包括：獲取應用系統的架構拓撲圖和異常告警資訊；基於架構拓撲圖和異常告警資訊構建排障邏輯樹，排障邏輯樹利用各節點之間的邏輯關係指示架構拓撲圖中各配置元件之間的潛在的故障傳播鏈路；對排障邏輯樹進行定性分析，以識別導致故障的潛在故障點；對排障邏輯樹進行定量分析，以計算各潛在故障點的故障概率和影響程度；以及根據定性分析和定量分析的結果確定根因故障點，並獲取根因故障點的故障傳播鏈路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:故障根因定位方法，方法</p>
        <p type="p">S110,S120,S130,S140,S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2287" publication-number="202619210">
    <tif-files tif-type="multi-tif">
      <tif file="114137339.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有整合波長控制之雷射系統</chinese-title>
        <english-title>LASER SYSTEM WITH INTEGRATED WAVELENGTH CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01S5/068</main-classification>
        <further-classification edition="200601120260131B">H01S5/40</further-classification>
        <further-classification edition="200601120260131B">G01J9/02</further-classification>
        <further-classification edition="200601120260131B">H04J14/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特美特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTMATTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里尼瓦桑　斯里尼瓦桑　阿什溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVASAN, SRINIVASAN ASHWYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森伯格　傑西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSENBERG, JESSIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布南達　達里司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUNANDAR, DARIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述具有精確波長控制之緊湊型高功率可調諧光源。由發明者開發且本文所描述之可調諧光源使用與波分多工(WDM)方案相容之雷射陣列以使此等源特別適合用於需要高水準資料處理量之應用中。此等源使用整合式波長計來量測光學發射之波長。此等波長計整體形成於裝載該雷射陣列之相同基板上以導致比可使用習知外部儀器達成之佔用面積小很多之一佔用面積。本文所描述之波長計使用光學干涉儀作為一回饋控制迴路之部分以確保雷射發射所要載波波長之光。一波長計可將一雷射之發射波長映射至一校準光源之發射波長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are compact, high-power tunable optical sources with precise wavelength control. The tunable optical sources developed by the inventors and described herein use laser arrays that are compatible with wavelength division multiplexing (WDM) schemes, making these sources particularly suitable for use in applications requiring high levels of data throughput. These sources use integrated wavemeters to measure the wavelength of optical emission. These wavemeters are formed monolithically on the same substrate hosting the laser array, resulting in a much smaller footprint than what is possible using conventional, external instrumentation. The wavemeters described herein use optical interferometers as part of a feedback control loop to ensure that the lasers emit light at the desired carrier wavelengths. A wavemeter can map the wavelength of emission of a laser to the wavelengths of emission of a calibrated optical source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體基板</p>
        <p type="p">50:可調諧光源</p>
        <p type="p">100&lt;sub&gt;1&lt;/sub&gt;至100&lt;sub&gt;N&lt;/sub&gt;:可調諧雷射</p>
        <p type="p">102&lt;sub&gt;1&lt;/sub&gt;至102&lt;sub&gt;N&lt;/sub&gt;:分接頭耦合器</p>
        <p type="p">104&lt;sub&gt;1&lt;/sub&gt;至104&lt;sub&gt;N&lt;/sub&gt;:光學放大器</p>
        <p type="p">110:信號組合器</p>
        <p type="p">112:抖動信號產生器</p>
        <p type="p">120:波長計</p>
        <p type="p">122:校準光源</p>
        <p type="p">130:光學組合器</p>
        <p type="p">132&lt;sub&gt;1&lt;/sub&gt;至132&lt;sub&gt;N&lt;/sub&gt;:標準具</p>
        <p type="p">134&lt;sub&gt;1&lt;/sub&gt;至134&lt;sub&gt;N&lt;/sub&gt;:輸入/輸出(I/O)耦合器</p>
        <p type="p">140:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2288" publication-number="202617213">
    <tif-files tif-type="multi-tif">
      <tif file="114137345.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將腫瘤治療場(TTFIELDS)施加到受試者的身體之電極組件的自動配對</chinese-title>
        <english-title>AUTOMATIC PAIRING OF ELECTRODE ASSEMBLIES THAT ARE USED TO APPLY TUMOR TREATING FIELDS (TTFIELDS) TO A SUBJECT’S BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61N1/36</main-classification>
        <further-classification edition="200601120260131B">A61N1/04</further-classification>
        <further-classification edition="200601120260131B">A61N1/40</further-classification>
        <further-classification edition="202101120260131B">A61B5/251</further-classification>
        <further-classification edition="202101120260131B">A61B5/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　彼得森　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH-PETERSEN, KATHRYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於可使用一組電極組件將交流電場（例如，TTField）施加於一受試者的身體中。系統藉由接收與該等電極組件相關聯之資料（例如，來自慣性感測器）來動態地組態如何將交流電壓施加至該等電極組件。基於此所接收之資料，該系統判定該等電極組件之相對位置。該系統接著基於所判定之相對位置來動態地組態如何將交流電壓施加至該等電極組件。在一些具體實例中，該動態組態包含（a）基於該等所判定之相對位置來辨識該等電極組件中之哪些被安置於一所關注區的相對側上，及（b）將該等電極組件分組成對以使得該等交流電壓將施加至經安置於該所關注區之相對側上的電極組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Alternating electric fields (e.g., TTFields) can be imposed in a subject's body using a set of electrode assemblies. The system dynamically configures how alternating voltages are applied to the electrode assemblies by receiving data (e.g., from inertial sensors) associated with the electrode assemblies. Based on this received data, the system determines the relative locations of the electrode assemblies. The system then dynamically configures how alternating voltages are applied to the electrode assemblies based on the determined relative locations. In some embodiments, the dynamic configuration comprises (a) recognizing which of the electrode assemblies are disposed on opposite sides of a region of interest based on the determined relative locations, and (b) grouping the electrode assemblies into pairs so that the alternating voltages will be applied to electrode assemblies that are disposed on opposite sides of the region of interest.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:電極組件</p>
        <p type="p">10B:電極組件</p>
        <p type="p">10C:電極組件</p>
        <p type="p">10D:電極組件</p>
        <p type="p">12A:位置識別元件</p>
        <p type="p">12C:位置識別元件</p>
        <p type="p">12D:位置識別元件</p>
        <p type="p">20:AC信號產生器</p>
        <p type="p">30:控制器</p>
        <p type="p">40:開關陣列</p>
        <p type="p">44:電纜</p>
        <p type="p">50:智慧型手機裝置</p>
        <p type="p">70:參考框架</p>
        <p type="p">100:系統</p>
        <p type="p">R:所關注區</p>
        <p type="p">#1:輸出埠</p>
        <p type="p">#2:輸出埠</p>
        <p type="p">#3:輸出埠</p>
        <p type="p">#4:輸出埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2289" publication-number="202617856">
    <tif-files tif-type="multi-tif">
      <tif file="114137365.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、磁性體、具磁性體之基板、電子零件、結構體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08K3/22</main-classification>
        <further-classification edition="200601120260202B">C08L101/00</further-classification>
        <further-classification edition="200601120260202B">H01F1/36</further-classification>
        <further-classification edition="200601120260202B">H01F1/37</further-classification>
        <further-classification edition="200601120260202B">H01F17/04</further-classification>
        <further-classification edition="200601120260202B">H01F27/255</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田誠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之第一課題在於提供一種組成物，其在填充於形成有貫通孔等孔部之基板的上述孔部中時的埋入性優異。又，本發明之第二課題在於提供磁性體、具磁性體之基板、電子零件、及結構體之製造方法。本發明之組成物包含第一磁性體粒子、種類不同於上述第一磁性體粒子的第二磁性體粒子、以及聚合性化合物，上述第一磁性體粒子及上述第二磁性體粒子中的至少一者滿足式（1）的關係。  &lt;br/&gt;　　式（1）：D90/D10≦2.50  &lt;br/&gt;　　式中，D10係體積頻率粒度分佈中累積值為10%時的粒徑。D90係體積頻率粒度分佈中累積值為90%時的粒徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2290" publication-number="202619036">
    <tif-files tif-type="multi-tif">
      <tif file="114137377.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、製造橋接模組的方法及具有橋接模組的小晶片結構</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MAKING BRIDGE MODULES AND CHIPLET STRUCTURES HAVING THE BRIDGE MODULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251203B">H01L21/768</main-classification>
        <further-classification edition="200601120251203B">H01L23/535</further-classification>
        <further-classification edition="200601120251203B">H01L23/538</further-classification>
        <further-classification edition="200601120251203B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋管理私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC MANAGEMENT PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喜秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明恩喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYUNG, EUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種半導體裝置，其具有包含接觸襯墊之橋接晶粒。電性組件安裝至該橋接晶粒以形成橋接模組。該橋接模組安置於載體上方。第一導電層形成於該載體上。第一絕緣層形成於該第一導電層及該橋接模組上方。開口穿過該第一絕緣層形成以曝露該第一導電層。第二導電層形成於該第一絕緣層上方。該載體被移除。第一半導體晶粒電耦接至該電性組件及該橋接晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has a bridge die comprising a contact pad. An electrical component is mounted to the bridge die to form a bridge module. The bridge module is disposed over a carrier. A first conductive layer is formed on the carrier. A first insulating layer is formed over the first conductive layer and bridge module. An opening is formed through the first insulating layer to expose the first conductive layer. A second conductive layer is formed over the first insulating layer. The carrier is removed. A first semiconductor die is electrically coupled to the electrical component and bridge die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">64a:接觸襯墊</p>
        <p type="p">64b:導電跡線</p>
        <p type="p">64c:導電通孔</p>
        <p type="p">104:橋接模組</p>
        <p type="p">122:芯</p>
        <p type="p">124:導電層</p>
        <p type="p">136:接觸襯墊</p>
        <p type="p">140:絕緣層</p>
        <p type="p">150:導電層</p>
        <p type="p">154:絕緣層</p>
        <p type="p">156:導電層</p>
        <p type="p">160:阻焊層</p>
        <p type="p">162:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2291" publication-number="202617468">
    <tif-files tif-type="multi-tif">
      <tif file="114137389.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>載具和底座</chinese-title>
        <english-title>CARRIER AND BASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B60N2/26</main-classification>
        <further-classification edition="200601120260130B">B60N2/28</further-classification>
        <further-classification edition="200601120260130B">B60N2/433</further-classification>
        <further-classification edition="200601120260130B">B62B9/12</further-classification>
        <further-classification edition="200601120260130B">A47D13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭徵文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙廣輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, GUANGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳玉彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李如意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RUYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張錕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MO, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種載具和底座，該載具包括乘載本體和樞轉部，該樞轉部能夠樞轉地連接於所述乘載本體並具有連接車輛座椅的鎖定鉤。所述載具還包括與所述樞轉部聯動設置的檔位調節結構。所述檔位調節結構能被操作以將所述樞轉部相對於所述乘載本體鎖定在多個樞轉位置的其中之一。本公開的載具能夠將錨定組件固定在多個樞轉位置，從而便於儲藏並且能夠方便地鎖定錨定角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a carrier and a base, wherein the carrier includes a carrying body and a pivoting part pivotally connected to the carrying body, the pivoting part having a locking hook for connecting a vehicle seat, wherein the carrier further comprises a gear adjustment structure arranged in linkage with the pivoting part, the gear adjustment structure is able to be operated to lock the pivoting part to one of a plurality of pivoted positions in respect with the carrying body. The carrier according to the disclosure can fix an anchor assembly in a plurality of pivoted positions, thereby facilitating storage and locking the anchor angle conveniently.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載具</p>
        <p type="p">1A:前緣</p>
        <p type="p">100:樞轉部</p>
        <p type="p">110:驅動部</p>
        <p type="p">111:卡扣部</p>
        <p type="p">120:外蓋</p>
        <p type="p">121:基部</p>
        <p type="p">122:延伸部</p>
        <p type="p">123:容置槽</p>
        <p type="p">124:孔</p>
        <p type="p">130:本體件</p>
        <p type="p">131:基部</p>
        <p type="p">132:延伸部</p>
        <p type="p">133:中心孔</p>
        <p type="p">134:孔</p>
        <p type="p">135:鎖定鉤</p>
        <p type="p">140:內蓋</p>
        <p type="p">141:基部</p>
        <p type="p">142:延伸部</p>
        <p type="p">143:中心孔</p>
        <p type="p">144:第二卡槽</p>
        <p type="p">150:卡合件</p>
        <p type="p">151:外齒</p>
        <p type="p">152:中心孔</p>
        <p type="p">160:復位件</p>
        <p type="p">170:第一卡槽</p>
        <p type="p">180:連接軸</p>
        <p type="p">300:乘載本體</p>
        <p type="p">310:容置槽</p>
        <p type="p">320:空腔</p>
        <p type="p">330:側部</p>
        <p type="p">340:凹部</p>
        <p type="p">400:檔位調節結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2292" publication-number="202617879">
    <tif-files tif-type="multi-tif">
      <tif file="114137390.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137390</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光樹脂組成物、乾膜光阻及其製備方法、阻劑圖案與使用其的元件</chinese-title>
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM PHOTORESIST AND METHOD FOR PREPARING THE SAME, RESIST PATTERN AND DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">C08L63/02</main-classification>
        <further-classification edition="200601120260116B">C08L63/04</further-classification>
        <further-classification edition="200601120260116B">C08G59/32</further-classification>
        <further-classification edition="200601120260116B">C07D249/18</further-classification>
        <further-classification edition="200601120260116B">G03F7/038</further-classification>
        <further-classification edition="202201120260116B">C09K23/20</further-classification>
        <further-classification edition="200601120260116B">C08F2/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全勝韓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, SEUNG HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於感光樹脂組成物，包括三種或更多種不同的環氧樹脂，包括第一環氧樹脂、第二環氧樹脂與第三環氧樹脂；以及含有苯并三唑系化合物的紫外線吸收劑，其中含有感光樹脂組成物的乾燥產物的感光樹脂層具有一曝光量，在使用41步驟階梯片以具有波長355 nm的紫外線照射後，用顯影劑顯影時，在剩餘步驟編號為17步驟的曝光量在220 mJ/cm&lt;sup&gt;2&lt;/sup&gt;至620 mJ/cm&lt;sup&gt;2&lt;/sup&gt;的範圍內，以及乾膜光阻、其製備方法、阻劑圖案與使用其的元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a photosensitive resin composition comprising three or more different epoxy resins including a first epoxy resin, a second epoxy resin, and a third epoxy resin; and an ultraviolet absorber containing a benzotriazole-based compound, wherein the photosensitive resin layer containing a dried product of the photosensitive resin composition has an exposure amount, at which the residual step number is 17 steps upon development with a developer after irradiation with ultraviolet rays having a wavelength of 355 nm using a 41-step step tablet, in a range of 220 mJ/cm&lt;sup&gt;2&lt;/sup&gt; to 620 mJ/cm&lt;sup&gt;2&lt;/sup&gt;, and a dry film photoresist, a method for preparing the same, a resist pattern, and a device using the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2293" publication-number="202618033">
    <tif-files tif-type="multi-tif">
      <tif file="114137454.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高純度有機金屬薄膜前驅體及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251017B">C23C16/08</main-classification>
        <further-classification edition="200601120251017B">C23C16/14</further-classification>
        <further-classification edition="200601120251017B">C07B49/00</further-classification>
        <further-classification edition="200601120251017B">C01F5/30</further-classification>
        <further-classification edition="202301120251017B">H10K71/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇先科半導體新材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU SHEKOY SEMICONDUCTOR NEW MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏志原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, ZHIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王旭喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XUZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種高純度有機金屬薄膜前驅體及其製備方法，方法包括：在氮氣保護下，將金屬鹵化物裝入燒瓶中，並注入醚類溶劑，冷卻至溫度A；在設定時間內向燒瓶中緩慢注射甲基氯化鎂，在此過程中控制反應溫度不超過溫度B；注射完成後，將反應溫度升至溫度C並攪拌回流；回流完成後，再次將反應溶液冷卻至溫度A，並將製備好的格氏試劑緩慢注入到反應溶液中，在注入過程中控制反應溫度不超過溫度B；注射完成後，將反應溫度升至溫度C並攪拌回流；反應終止後，通過減壓過濾分離氯化鎂，並通過濾液的減壓蒸餾除去溶劑，得到有機金屬薄膜前驅體。本發明具備製備過程安全性好、產率高、產品純度高、製備效率高等優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2294" publication-number="202617686">
    <tif-files tif-type="multi-tif">
      <tif file="114137463.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有縮二脲鍵和２個以上包含烯鍵式不飽和雙鍵的官能團的化合物、密合性改善劑、固化性組合物以及固化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C275/62</main-classification>
        <further-classification edition="200601120260202B">C09K3/00</further-classification>
        <further-classification edition="200601120260202B">C09J11/06</further-classification>
        <further-classification edition="200601120260202B">C09J133/10</further-classification>
        <further-classification edition="201801120260202B">C09D7/63</further-classification>
        <further-classification edition="200601120260202B">C09D133/10</further-classification>
        <further-classification edition="200601120260202B">C09D5/28</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/027</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大阪有機化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA ORGANIC CHEMICAL INDUSTRY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加畑雅之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABATA, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種能夠賦予優異的密合性的化合物、包含該化合物的密合性改善劑、包含該化合物或該密合性改善劑的固化性組合物以及固化物。本發明的化合物具有縮二脲鍵和2個以上包含烯鍵式不飽和雙鍵的官能團，通過配合於固化性組合物，能夠對該固化性組合物賦予密合性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2295" publication-number="202617945">
    <tif-files tif-type="multi-tif">
      <tif file="114137482.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617945</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137482</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種多產乙烯和丙烯的催化裂解方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C10G11/04</main-classification>
        <further-classification edition="200601120260202B">C10G11/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉凌濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LINGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許友好</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YOUHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔劍洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, JIANHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱金泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JINQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢恩會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, ENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種烴類多產乙烯和丙烯的催化裂解方法，包括：S1、使烴類原料在反應器系統內與催化劑接觸並進行反應，得到反應油劑；其中，所述反應器系統至少包括兩個反應區，第一反應區和在第一反應區下游的第二反應區，所述烴類原料在第一反應區的下方或下部引入，所述第一反應區的催化劑平均固含率大於0.2且所述第一反應區催化劑固含率大於0.2的區域在所述第一反應區中的體積佔比為0.2~0.7，所述第二反應區的催化劑平均固含率小於0.1；S2、將所述反應油劑進行氣固分離，得到積碳催化劑和油氣；S3、使所述積碳催化劑進行再生，所得再生催化劑返回所述反應器中循環使用。本發明在反應初始階段採用高催化劑固含率以增加烴分子與催化劑活性中心的接觸，顯著提高催化裂解反應的比例，降低熱裂解反應程度；反應後續階段採用較低催化劑固含率，減少生成的乙烯和丙烯再轉化，減少氫轉移反應和縮合反應，使雙烯/(甲烷+焦炭)的產率比大幅提高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:反應器</p>
        <p type="p">11:原料進料噴嘴</p>
        <p type="p">12:預提升蒸汽管線</p>
        <p type="p">2:再生器</p>
        <p type="p">21:空氣輸送管</p>
        <p type="p">22:第二旋風分離器</p>
        <p type="p">23:再生煙氣輸送管</p>
        <p type="p">24:再生催化劑輸送管</p>
        <p type="p">3:汽提器</p>
        <p type="p">31:汽提蒸汽輸送管</p>
        <p type="p">32:待生催化劑輸送管</p>
        <p type="p">4:沉降器</p>
        <p type="p">41:第一旋風分離器</p>
        <p type="p">42:油氣輸出管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2296" publication-number="202617867">
    <tif-files tif-type="multi-tif">
      <tif file="114137488.zip" no="1">
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      <volno>24</volno>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏光膜、偏光薄膜、積層偏光薄膜、影像顯示面板及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08L29/04</main-classification>
        <further-classification edition="200601120260202B">C08K3/16</further-classification>
        <further-classification edition="200601120260202B">C08K3/38</further-classification>
        <further-classification edition="200601120260202B">C08J3/24</further-classification>
        <further-classification edition="200601120260202B">C08J5/18</further-classification>
        <further-classification edition="200601120260202B">B32B27/18</further-classification>
        <further-classification edition="200601120260202B">B32B27/30</further-classification>
        <further-classification edition="201901120260202B">B32B7/023</further-classification>
        <further-classification edition="200601120260202B">G02B5/30</further-classification>
        <further-classification edition="200601120260202B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八木汐海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGI, SHIOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嶋津亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAZU, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島奈津美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種偏光膜，係二色性物質吸附定向於聚乙烯醇系薄膜、且經硼酸交聯而定向固定者；前述偏光膜之厚度為20µm以下，且滿足通式：B/A≧2.0所示長度之比的條件(通式中，A表示偏光膜之對吸收軸呈平行之長度(mm)，B表示偏光膜之對吸收軸呈正交之長度(mm)，且為900以上之值)；前述偏光膜包含0.05重量%以上之鋅元素；前述偏光膜無50µm以上之異物，且JIS B 0601-2001中規定之最大高度(Rz)小於5µm；並且，前述偏光膜在對吸收軸呈正交方向上，硼之含有比率(重量%)的最大值與最小值之差為0.4重量%以下。該偏光膜可兼顧在熱衝擊試驗中之耐裂痕性及在加熱可靠性試驗中之耐紅變性，而具有良好之外觀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2297" publication-number="202617214">
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      <tif file="114137510.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可撓式電極陣列</chinese-title>
        <english-title>FLEXIBLE ELECTRODE ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61N1/36</main-classification>
        <further-classification edition="200601120260131B">A61N1/04</further-classification>
        <further-classification edition="202101120260131B">A61B5/251</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各比　艾利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAACOBI, ELIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈拉維伊　諾亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALAVEE, NOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種用於遞送腫瘤治療場至受試者身體的換能器設備。所述換能器設備可包含圍繞一質心配置的電極元件陣列，並且每一個電極元件和所述質心等距或大致等距。所述換能器設備可進一步包含一PCB或撓性電路，其包含至少一電連接器部分。所述至少一電連接器部分的每一個別的電連接器部分可以延伸在所述電極元件陣列的一對應的相鄰的電極元件對之間。所述電極元件陣列的每一個電極元件包含最接近所述陣列的質心的一部分，並且每一個電連接器部分和所述對應的相鄰的電極元件對的最接近所述陣列的質心的部分徑向向外地間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transducer apparatus for delivering tumor treating fields to a subject’s body is disclosed. The transducer apparatus can include an array of electrode elements arranged around a centroid and each electrode element equidistant or approximately equidistant from the centroid. The transducer apparatus can further include a PCB or flex circuit including at least one electrical connector portion. Each respective electrical connector portion of the at least one electrical connector portion can extend between a corresponding pair of adjacent electrode elements of the array of electrode elements. Each electrode element of the array of electrode elements includes a portion most proximal to the centroid of the array, and each electrical connector portion is spaced radially outwardly of the portions of the corresponding pair of adjacent electrode elements most proximal to the centroid of the array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:換能器設備</p>
        <p type="p">20:電極元件</p>
        <p type="p">20a:第一電極元件</p>
        <p type="p">20b:第二電極元件</p>
        <p type="p">24:質心</p>
        <p type="p">28:電極元件的部分</p>
        <p type="p">29:空孔空間</p>
        <p type="p">30:印刷電路板(PCB)/撓性電路</p>
        <p type="p">34:電連接器部分</p>
        <p type="p">38:邊緣</p>
        <p type="p">60:電連接器</p>
        <p type="p">61:橋接的連接器</p>
        <p type="p">70:端</p>
        <p type="p">72:端</p>
        <p type="p">74:徑向線</p>
        <p type="p">76:徑向線</p>
        <p type="p">m:量測</p>
        <p type="p">r&lt;sub&gt;d&lt;/sub&gt;:徑向尺寸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2298" publication-number="202618482">
    <tif-files tif-type="multi-tif">
      <tif file="114137602.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137602</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>教示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251203B">G05B19/42</main-classification>
        <further-classification edition="200601120251203B">B25J13/06</further-classification>
        <further-classification edition="200601120251203B">B25J13/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫澤源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, ZEYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋祐輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">教示裝置具備：操作履歷記錄部，將與圖像處理的設定參數有關的使用者的操作履歷及圖像處理的處理結果，就圖像處理的複數次執行量加以記錄；及操作履歷顯示部，根據已記錄的操作履歷及處理結果，以可視覺辨識由使用者所進行之設定參數的調整與處理結果的關係性的方式來進行顯示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:操作履歷顯示畫面</p>
        <p type="p">301,302,303,304,305,306:圖表</p>
        <p type="p">310,320:圖像</p>
        <p type="p">311,321:攝像圖像</p>
        <p type="p">312,322:數值資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2299" publication-number="202619050">
    <tif-files tif-type="multi-tif">
      <tif file="114137640.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層基板、配線基板、積層基板之製造方法、配線基板之製造方法及半導體封裝</chinese-title>
        <english-title>LAMINATED SUBSTRATE, WIRING SUBSTRATE, METHOD OF MANUFACTURING LAMINATED SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L23/15</main-classification>
        <further-classification edition="200601120260130B">H05K1/03</further-classification>
        <further-classification edition="200601120260130B">C03C17/32</further-classification>
        <further-classification edition="200601120260130B">C03C17/36</further-classification>
        <further-classification edition="200601120260130B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原久美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBARA, KUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植木真治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEKI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北爪貴洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZUME, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤陽一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中厚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋田幸仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKITA, YUKIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡瑞樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伴野優梨子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNO, YURIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種積層基板，其能夠降低包含玻璃之無機基板因機械破壞或熱衝擊而產生裂痕。積層基板(100)係具有複數個配線基板(110)者，該配線基板(110)具有：包含玻璃之無機基板(10)、以被覆包含玻璃之無機基板(10)之至少一部分之方式配置之1層或2層以上之絕緣樹脂層(21、22)、及配置於包含玻璃之無機基板(10)及絕緣樹脂層(21、22)之至少一表面之配線部(3)，且包含玻璃之無機基板(10)與絕緣樹脂層(21、22)之剝離強度為4.9 N/cm以上49 N/cm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:配線部</p>
        <p type="p">4:連接端子</p>
        <p type="p">10:包含玻璃之無機基板</p>
        <p type="p">21,22:絕緣樹脂層</p>
        <p type="p">100:積層基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2300" publication-number="202618556">
    <tif-files tif-type="multi-tif">
      <tif file="114137644.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>錯誤位址資訊的獲取處理方法和電子裝置</chinese-title>
        <english-title>METHOD OF ACQUIRING AND PROCESSING ERROR ADDRESS INFORMATION AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G06F11/22</main-classification>
        <further-classification edition="201301120251103B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長邁半導體（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGMAI SEMICONDUCTOR (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李茂源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MAO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種錯誤位址資訊的獲取處理方法和電子裝置，所述方法包括：回應於使用者交互介面檢測到資料讀取操作，讀取目標測試物件的目標測試資料，目標測試資料包括目標測試物件的錯誤位址測試資料中指定位址範圍對應的錯誤位址測試資料；基於目標測試資料，在使用者交互介面的視圖視窗內顯示第一類型視圖，第一類型視圖被配置為指示指定位址範圍內不同位址的測試結果資訊；回應於使用者交互介面檢測到視圖切換操作，基於目標測試資料，在使用者交互介面的視圖視窗內顯示第二類型視圖，第二類型視圖被配置為指示指定位址範圍中的錯誤位址在目標測試物件上的位置分佈資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of acquiring and processing error address information and an electronic device are provided. The method includes: in response to detecting a data read operation in a user interaction interface, reading target test data of a target test object, in which the target test data includes error address test data corresponding to a specified address range in error address test data of the target test object; based on the target test data, displaying a first-type view in a view window of the user interaction interface, in which the first-type view is configured to indicate test result information of different addresses in the specified address range; and in response to detecting a view switching operation in the user interaction interface, based on the target test data, displaying a second-type view in the view window of the user interaction interface, in which the second-type view is configured to indicate location distribution information of an error address in the specified address range on the target test object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210、220、230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2301" publication-number="202619051">
    <tif-files tif-type="multi-tif">
      <tif file="114137653.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層基板、配線基板、積層基板之製造方法、配線基板之製造方法及半導體封裝</chinese-title>
        <english-title>LAMINATED SUBSTRATE, WIRING SUBSTRATE, METHOD OF MANUFACTURING LAMINATED SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L23/15</main-classification>
        <further-classification edition="200601120260130B">H05K1/03</further-classification>
        <further-classification edition="200601120260130B">C03C17/32</further-classification>
        <further-classification edition="200601120260130B">C03C17/36</further-classification>
        <further-classification edition="200601120260130B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原久美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBARA, KUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植木真治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEKI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北爪貴洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZUME, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤陽一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中厚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋田幸仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKITA, YUKIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡瑞樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伴野優梨子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNO, YURIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種積層基板，其提昇絕緣樹脂層之耐脆性，且能夠降低包含玻璃之無機基板之裂痕產生。本發明之積層基板係具有複數個配線基板(110)之積層基板(100)，該配線基板(110)具有包含玻璃之無機基板(10)、以被覆包含玻璃之無機基板(10)之至少一部分之方式配置之1層或2層以上之絕緣樹脂層(2)、及配置於包含玻璃之無機基板(10)及絕緣樹脂層(2)之至少一表面之配線部(3)，且絕緣樹脂層(2)之拉伸彈性模數為1.0 GPa以上30 GPa以下，及/或絕緣樹脂層(2)之拉伸強度為25 MPa以上200 MPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:配線部</p>
        <p type="p">4:連接端子</p>
        <p type="p">10:包含玻璃之無機基板</p>
        <p type="p">21,22:絕緣樹脂層</p>
        <p type="p">100:積層基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2302" publication-number="202617215">
    <tif-files tif-type="multi-tif">
      <tif file="114137684.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於受試者身體進行腫瘤治療場治療的換能器陣列</chinese-title>
        <english-title>TRANSDUCER ARRAYS FOR A SUBJECT'S BODY FOR TUMOR TREATING FIELDS TREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61N1/36</main-classification>
        <further-classification edition="200601120260131B">A61N1/04</further-classification>
        <further-classification edition="200601120260131B">A61N1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各比　艾利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAACOBI, ELIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈拉維伊　諾亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALAVEE, NOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧布科夫斯基　史塔斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBUCHOVSKY, STAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾　塔爾　戈蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAR-TAL, GOLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑞爾　亞米兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIEL, AMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於遞送腫瘤治療場至一受試者的身體之換能器設備，所述換能器設備包括複數個電極次組件，其被配置以設置在所述受試者的身體之上，其具有面對所述受試者的身體的一正面以及和所述正面相反的一背面，每一個電極次組件包括至少一電極元件；一非等向性材料層的複數個片段，其分別耦接到至少一電極元件，非等向性材料層的每一個片段包括一正面以及和所述正面相反的一背面，並且其中當從垂直於所述電極次組件的所述正面的一方向觀看時，非等向性材料層的每一相應片段是間隔開的，並且未觸及非等向性材料層的所述複數個片段的其它片段；以及一撓性電連接器，其電連接所述複數個電極次組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transducer apparatus for delivering tumor treating fields to a subject’s body, the transducer apparatus comprising a plurality of electrode subassemblies configured to be positioned over the subject’s body with a front face facing the subject’s body and a back face opposite the front face, each electrode subassembly comprising at least one electrode element; a plurality of sections of an anisotropic material layer, each coupled to at least one electrode element, each section of anisotropic material layer comprising a front face and a back face opposite the front face, and wherein when viewed from a direction perpendicular to the front face of the electrode subassemblies, each respective section of anisotropic material layer is spaced apart and is not touching other sections of the plurality of sections of anisotropic material layer; and a flexible electrical connector electrically connecting the plurality of electrode subassemblies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:電極次組件</p>
        <p type="p">104:非等向性材料層</p>
        <p type="p">106:電極元件</p>
        <p type="p">108:撓性電連接器</p>
        <p type="p">702:剝離蓋</p>
        <p type="p">800B:換能器設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2303" publication-number="202617533">
    <tif-files tif-type="multi-tif">
      <tif file="114137692.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蓋組件及帶蓋容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B65D41/04</main-classification>
        <further-classification edition="200601120260131B">B65D43/16</further-classification>
        <further-classification edition="200601120260131B">B65D47/06</further-classification>
        <further-classification edition="200601120260131B">A47J41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皇冠金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商膳魔師股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鹿島航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部晋太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種蓋組件，可一邊旋轉操作噴嘴帽蓋，一邊透過螺合而適切地將噴嘴帽蓋安裝設置在帽蓋本體的噴嘴部。[解決手段]在噴嘴帽蓋9嵌裝至設置在旋動構件11的前端側的連結部11a的內側的狀態下，噴嘴帽蓋9繞著連結部11a的中心軸AX1旋轉自如且搖動自如地被安裝，並且，噴嘴帽蓋9的中心軸AX2相對於連結部11a的中心軸AX1可傾斜的角度範圍，在連結部11a的前後方向上大於左右方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蓋組件</p>
        <p type="p">7:噴嘴部</p>
        <p type="p">7a:通液口</p>
        <p type="p">8:帽蓋本體</p>
        <p type="p">8a:周壁部</p>
        <p type="p">8b:上壁部</p>
        <p type="p">8c:內壁部</p>
        <p type="p">8d:段差部</p>
        <p type="p">9:噴嘴帽蓋</p>
        <p type="p">9a:周壁部</p>
        <p type="p">9b:頂壁部</p>
        <p type="p">9c:孔部</p>
        <p type="p">9d:圓形凸部</p>
        <p type="p">9e:縮徑部</p>
        <p type="p">9f:凸緣部</p>
        <p type="p">9g:突起部</p>
        <p type="p">10:鉸鏈部</p>
        <p type="p">11:旋動構件</p>
        <p type="p">11a:連結部</p>
        <p type="p">14:第一陰螺紋部</p>
        <p type="p">15:止水襯墊</p>
        <p type="p">15a:彈性凸緣部</p>
        <p type="p">16:卡合凸部</p>
        <p type="p">16a:下表面</p>
        <p type="p">17:卡合凹部</p>
        <p type="p">18:第二陰螺紋部</p>
        <p type="p">20:栓襯墊</p>
        <p type="p">20a:嵌入部</p>
        <p type="p">20b:栓部</p>
        <p type="p">20c:突出部</p>
        <p type="p">20d:擴徑部</p>
        <p type="p">20e:凸緣部</p>
        <p type="p">20f:上方肋部</p>
        <p type="p">AX1、AX2、AX3:中心軸</p>
        <p type="p">θ1:角度範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2304" publication-number="202617534">
    <tif-files tif-type="multi-tif">
      <tif file="114137693.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蓋組件及帶蓋容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B65D41/04</main-classification>
        <further-classification edition="200601120260131B">B65D43/02</further-classification>
        <further-classification edition="200601120260131B">B65D47/06</further-classification>
        <further-classification edition="200601120260131B">A47J41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皇冠金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商膳魔師股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部晋太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種蓋組件，可自噴嘴帽蓋對於噴嘴部的螺合僅稍微進行的鎖緊途中的狀態開始，將設置於噴嘴部的先端側的通液口加以密封。[解決手段]互相螺合的噴嘴部7側之陽螺紋部19與噴嘴帽蓋9側之陰螺紋部18之間，設有使噴嘴帽蓋9能夠相對於噴嘴部7在軸方向移動的間隙，於噴嘴帽蓋9對噴嘴部7的螺合僅稍微進行的鎖緊途中狀態下，將外蓋12安裝於帽蓋本體8時，藉由抵接於噴嘴帽蓋9的外蓋12下壓噴嘴帽蓋9，而成為栓襯墊20被抵壓於通液口7a的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:蓋組件</p>
        <p type="p">100A:帶蓋容器</p>
        <p type="p">2:容器本體</p>
        <p type="p">2a:底部</p>
        <p type="p">2b:本體部</p>
        <p type="p">2c:口頸部</p>
        <p type="p">2d:上部開口部</p>
        <p type="p">3:外容器</p>
        <p type="p">4:內容器</p>
        <p type="p">5:真空絕熱層</p>
        <p type="p">6:懸伸部</p>
        <p type="p">7:噴嘴部</p>
        <p type="p">7a:通液口</p>
        <p type="p">8:帽蓋本體</p>
        <p type="p">8a:周壁部</p>
        <p type="p">8b:上壁部</p>
        <p type="p">8c:內壁部</p>
        <p type="p">9:噴嘴帽蓋</p>
        <p type="p">9a:周壁部</p>
        <p type="p">9b:頂壁部</p>
        <p type="p">9c:孔部</p>
        <p type="p">9d:圓形凸部</p>
        <p type="p">9e:縮徑部</p>
        <p type="p">10:鉸鏈部</p>
        <p type="p">11:旋動構件</p>
        <p type="p">11a:連結部</p>
        <p type="p">12:外蓋</p>
        <p type="p">12a:底壁部</p>
        <p type="p">12b:周壁部</p>
        <p type="p">12c:開口部</p>
        <p type="p">13:第一陽螺紋部</p>
        <p type="p">14:第一陰螺紋部</p>
        <p type="p">15:止水襯墊</p>
        <p type="p">15a:彈性凸緣部</p>
        <p type="p">16:卡合凸部</p>
        <p type="p">17:卡合凹部</p>
        <p type="p">18:第二陰螺紋部</p>
        <p type="p">20:栓襯墊</p>
        <p type="p">20a:嵌入部</p>
        <p type="p">20b:栓部</p>
        <p type="p">20c:突出部</p>
        <p type="p">20d:擴徑部</p>
        <p type="p">20f:上方肋部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2305" publication-number="202617550">
    <tif-files tif-type="multi-tif">
      <tif file="114137717.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制物品移動穿過訂單履行設施的自動化系統和方法</chinese-title>
        <english-title>AUTOMATED SYSTEMS AND METHODS OF CONTROLLING MOVEMENT OF ITEMS THROUGH ORDER FULFILLMENT FACILITIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">B65G1/04</main-classification>
        <further-classification edition="200601120260122B">B65G1/06</further-classification>
        <further-classification edition="200601120260122B">B65G1/137</further-classification>
        <further-classification edition="200601120260122B">B65G47/02</further-classification>
        <further-classification edition="202301120260122B">G06Q10/087</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛波提克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMBOTIC LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福斯奈特　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSNIGHT, WILLIAM J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蘭特　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANT, ALAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史文森　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANSON, KYLE A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃赫斯特　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARHURST, JULIAN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾伯特　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELBLAT, BRIAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾伯特　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELBLAT,BRIAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種零售履行系統，包括：儲存結構；複數個行動機器人，建構成側向沿著儲存結構通道且垂直穿過儲存結構來移動，以存放和擷取容器而來往於複數個容器儲存處；以及容器輸入/輸出介面系統，包括容器存取艙的矩陣，其中複數個行動機器人建構成透過機器人介面來遞送和擷取容器而來往於容器存取艙。每個容器存取艙包括自主互鎖系統，與複數個行動機器人分開而被啟動來回應於在個別容器存取艙之多個容器的一容器之存在，以使阻障系統轉換成能讓作業員透過存取面來存取容器的存取狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A retail fulfillment system, including: a storage structure; a plurality of mobile robots configured to move laterally along storage structure aisles and vertically through the storage structure to deposit and retrieve containers to and from the plurality of container storage locations; and a container input/output interface system including: a matrix of container access bays where the plurality of mobile robots are configured to deliver and retrieve the containers to and from the container access bays through a robot interface. Each of the container access bays includes an autonomous interlock system that is activated, separate from the plurality of mobile robots, in response to a presence of a container, of the containers, at the respective one of the container access bays to cause a barrier system to transition to an access state enabling access by an operator through the access face to the container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訂單履行系統</p>
        <p type="p">102:中央控制電路</p>
        <p type="p">112:容器輸入/輸出(I/O)介面系統</p>
        <p type="p">202:自主行動機器人</p>
        <p type="p">204:儲存結構</p>
        <p type="p">206~207:工作站</p>
        <p type="p">208:階層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2306" publication-number="202619583">
    <tif-files tif-type="multi-tif">
      <tif file="114137762.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複曲面微透鏡影像感測器</chinese-title>
        <english-title>TORIC-MICROLENS IMAGE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10F39/12</main-classification>
        <further-classification edition="202301120260123B">H04N25/704</further-classification>
        <further-classification edition="200601120260123B">G02B3/06</further-classification>
        <further-classification edition="200601120260123B">G02B27/16</further-classification>
        <further-classification edition="202101120260123B">G03B13/36</further-classification>
        <further-classification edition="202101120260123B">G02B7/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晏筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YEN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸　震偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像感測器，包括半導體基板和複曲面微透鏡，半導體基板包括具有多列像素和多行像素的像素陣列，像素陣列的像素單元包括像素陣列的一個或多個像素，複曲面微透鏡佈置在半導體基板上，並位於像素陣列的對應的像素單元正上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image sensor includes a semiconductor substrate and a toric microlens. The semiconductor substrate includes a pixel array having a plurality of rows of pixels and a plurality of columns of pixels. A pixel cell of the pixel array includes one or more pixels of the pixel array. The toric microlens is disposed on the semiconductor substrate and directly above a corresponding pixel cell of the pixel array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1,A2,A3:軸</p>
        <p type="p">D1,D2:對角軸</p>
        <p type="p">S&lt;sub&gt;H&lt;/sub&gt;:水平距離</p>
        <p type="p">S&lt;sub&gt;V&lt;/sub&gt;:垂直距離</p>
        <p type="p">724(0),724(1),724(2),724(3):像素單元</p>
        <p type="p">761(0),761(1),761(2),761(3):彩色濾光片</p>
        <p type="p">780(0),780(1),780(2),780(3):微透鏡</p>
        <p type="p">790:超單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2307" publication-number="202619101">
    <tif-files tif-type="multi-tif">
      <tif file="114137832.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附有導電柱之基板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01L23/488</main-classification>
        <further-classification edition="200601120260130B">H01L21/60</further-classification>
        <further-classification edition="200601120260130B">B22F3/10</further-classification>
        <further-classification edition="200601120260130B">B22F7/00</further-classification>
        <further-classification edition="200601120260130B">H05K3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本真澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, MASUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江尻芳則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EJIRI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水千晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, CHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成田真生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARITA, MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種附有導電柱之基板，其具備基板及設置於該基板的主面上之導電柱，導電柱具有與基板的主面平行的截面積隨著朝向導電柱的頂面側而變小之錐形的側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2308" publication-number="202618113">
    <tif-files tif-type="multi-tif">
      <tif file="114137915.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合桿鎖</chinese-title>
        <english-title>JOINTED BAR LOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">E05B71/00</main-classification>
        <further-classification edition="200601120260127B">E05B67/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商安博歐葛斯特布雷米克索尼公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABUS AUGUST BREMICKER SOEHNE KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種接合桿鎖，具體用於兩輪車，該接合桿鎖包括鎖本體和接合桿裝置，該接合桿裝置具有以鉸接方式彼此連接的多個接合桿，其中，鎖本體和/或接合桿在各種情況下至少局部地設置有硬塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a jointed bar lock, in particular for a two-wheeler, comprising a lock body and a jointed bar arrangement that has a plurality of jointed bars connected to one another in an articulated manner, wherein the lock body and/or the jointed bars is/are at least regionally provided with a hard coating in each case.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:接合桿裝置</p>
        <p type="p">13:接合桿鎖</p>
        <p type="p">15:鎖本體</p>
        <p type="p">17:鎖殼體</p>
        <p type="p">19:鎖定機構</p>
        <p type="p">21:鑰匙</p>
        <p type="p">23:接合桿</p>
        <p type="p">25:鉸接接頭</p>
        <p type="p">27:第一端部區段</p>
        <p type="p">29:第二端部區段</p>
        <p type="p">31:第一接合桿</p>
        <p type="p">33:最後接合桿</p>
        <p type="p">35:縱向邊緣</p>
        <p type="p">37:中央區域</p>
        <p type="p">41:鉚釘元件</p>
        <p type="p">43:盤元件</p>
        <p type="p">61:硬塗層</p>
        <p type="p">G:接合軸線</p>
        <p type="p">L:縱向範圍</p>
        <p type="p">Q:橫向範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2309" publication-number="202617023">
    <tif-files tif-type="multi-tif">
      <tif file="114137941.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可拆卸的拖布板的清掃機器人</chinese-title>
        <english-title>ROBOT CLEANER WITH DETACHABLE MOP PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">A47L11/10</main-classification>
        <further-classification edition="200601120251231B">A47L11/164</further-classification>
        <further-classification edition="200601120251231B">A47L11/24</further-classification>
        <further-classification edition="200601120251231B">A47L11/28</further-classification>
        <further-classification edition="200601120251231B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KOOKHAENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG-GEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種清掃機器人，包括：主體、基板、拖布致動器、驅動器、以及拖布板。驅動器耦接至拖布致動器的拖布軸，並配置以從下部位置向上移動到上部位置。在上部位置，驅動器由拖布軸沿第一旋轉方向旋轉。第一卡扣部形成在基板的下表面上，而第二卡扣部形成在拖布板的上表面上。當拖布板在上部位置沿第一旋轉方向旋轉時，第二卡扣部被第一卡扣部卡扣並向下傾斜滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a robot cleaner including a main body, a base plate, a mop actuator, a driver, and a mop plate. The driver is coupled to a mop shaft of the mop actuator, and is configured to move upward from a lower position to an upper position. At the upper position, the driver is rotated by the mop shaft in a first rotational direction. A first catching portion is formed on a lower surface of the base plate, and a second catching portion is formed on an upper surface of the mop plate. When the mop plate rotates in the first rotational direction at the upper position, the second catching portion is caught by the first catching portion and slides downward at an incline.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150:基板</p>
        <p type="p">152:支撐架支撐孔</p>
        <p type="p">200:拖布致動器</p>
        <p type="p">210:拖布軸</p>
        <p type="p">213:軸凸緣</p>
        <p type="p">220:拖布軸殼體</p>
        <p type="p">300:支撐架</p>
        <p type="p">350:軸承</p>
        <p type="p">360:O形環</p>
        <p type="p">400:驅動器</p>
        <p type="p">480:第二緊固部</p>
        <p type="p">610:第一磁性部</p>
        <p type="p">700:拖布板</p>
        <p type="p">701:第一板</p>
        <p type="p">702:第二板</p>
        <p type="p">703:板緩衝器</p>
        <p type="p">705:拖布</p>
        <p type="p">710:第二卡扣部</p>
        <p type="p">720:第一緊固部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2310" publication-number="202617580">
    <tif-files tif-type="multi-tif">
      <tif file="114137946.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>掩模版轉移裝置</chinese-title>
        <english-title>Mask transfer device</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">B67B7/00</main-classification>
        <further-classification edition="200601120251231B">B67B7/14</further-classification>
        <further-classification edition="201201120251231B">G03F1/66</further-classification>
        <further-classification edition="200601120251231B">G03F7/20</further-classification>
        <further-classification edition="200601120251231B">B65G47/90</further-classification>
        <further-classification edition="200601120251231B">B25B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海御微半導體技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI YUWEI SEMICONDUCTOR TECHNOLOGY CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭教增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIAOZENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種掩模版轉移裝置，該裝置包括底座、開蓋機構和轉移機構，其中，開蓋機構設於底座，且具有承載座、開蓋件和開蓋驅動器，開蓋件能轉動地設於承載座，開蓋件的轉動軸線與放置於承載座的掩模版存儲盒中蓋體的轉動軸線重合，開蓋驅動器的輸出端與開蓋件驅動連接，開蓋件上設有吸盤以吸附蓋體；轉移機構設置為抓取掩模版存儲盒的盒體中的掩模版，並將掩模版移出盒體。上述設置提高了開蓋的成功率，提高了掩模版的轉移效率，降低掩模版滑落損傷的機率，以確保掩模版被安全轉移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mask transfer device comprises a base, a cover opening mechanism and a transfer mechanism , wherein the cover opening mechanism is arranged on the base and comprises a bearing seat , a cover opening member and a cover opening driver, the cover opening member is rotatably arranged on the bearing seat, and the rotation axis of the cover opening member is aligned with the mask storage device placed on the bearing seat . The rotation axes of the cover body in the box coincide with each other, the output end of the cover opening driver is connected to the cover opening member , and the cover opening member is provided with a suction cup for adsorbing the cover body ; the transfer mechanism is configured to grab the mask in the box body of the mask storage box and move the mask out of the box body . The above configuration improves the success rate of cover opening, improves the efficiency of mask transfer, and reduces the probability of mask slippage and damage, thereby ensuring that the mask is safely transferred.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:掩模版存儲盒</p>
        <p type="p">2000:掩模版</p>
        <p type="p">100:底座</p>
        <p type="p">200:開蓋機構</p>
        <p type="p">300:轉移機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2311" publication-number="202619510">
    <tif-files tif-type="multi-tif">
      <tif file="114137975.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速恢復逆向二極體及其形成方法</chinese-title>
        <english-title>METHOD OF FORMING A FAST RECOVERY INVERSE DIODE AND FAST RECOVERY INVERSE DIODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251110B">H10D8/01</main-classification>
        <further-classification edition="202501120251110B">H10D62/10</further-classification>
        <further-classification edition="202501120251110B">H10D62/60</further-classification>
        <further-classification edition="200601120251110B">H01L21/20</further-classification>
        <further-classification edition="200601120251110B">H01L21/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商力特福斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITTELFUSE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫德　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAIND, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法可包括提供半導體基板，包含第一厚度摻雜劑、第一摻雜劑極性、以及第一摻雜劑濃度的第一層；以及具有大於第一厚度的第二厚度、第二極性、以及第二摻雜劑濃度的第二層，其中第二層定義大於第一摻雜劑濃度的第二摻雜劑濃度。方法可更包括形成具有第二摻雜劑極性的摻雜劑的分離擴散區域圍繞第一層的周邊，其中分離擴散區域從第一表面延伸至大於第一層的第一厚度的分離深度。方法也可包括執行半導體基板的薄化藉由從第二表面移除第二層的部分，其中在薄化之後，第二層包含小於第一厚度的第三厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method may include providing a semiconductor substrate, comprising a first layer of a first thickness dopant, a first dopant polarity, and a first dopant concentration; and a second layer having a second thickness greater than the first thickness, a second polarity, and second dopant concentration, wherein the second layer defines a second dopant concentration, greater than the first dopant concentration. The method may further include forming a separation diffusion region having a dopant of the second dopant polarity around a periphery of the first layer, where the separation diffusion region extends from a first surface to a separation depth, greater than the first thickness of the first layer. The method may also include performing a thinning of the semiconductor substrate by removing a portion of the second layer from the second surface, wherein after the thinning, the second layer comprises a third thickness, less than the first thickness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:流程</p>
        <p type="p">302~312:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2312" publication-number="202619182">
    <tif-files tif-type="multi-tif">
      <tif file="114137979.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137979</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接組件</chinese-title>
        <english-title>ELECTRICAL CONNECTION ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">H01R13/40</main-classification>
        <further-classification edition="200601120251023B">H01R13/648</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張若禕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接組件包括連接模組、導電膜以及晶片。前述連接模組包括殼體以及複數導電元件，其中前述殼體設有安裝壁，前述導電元件露出前述安裝壁。前述導電膜包括骨架、與前述骨架相固定的彈性體以及嵌入在前述彈性體中的複數轉接導電元件。前述晶片設有複數導電部。前述導電膜被夾持在前述安裝壁與前述晶片之間，前述導電元件藉由前述轉接導電元件與前述導電部實現電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connection assembly includes a connection module, a conductive film and a chip. The connection module includes a housing and a number of conductive elements. The housing is provided with a mounting wall, and the conductive elements are exposed to the mounting wall. The conductive film includes a skeleton, an elastomer fixed to the skeleton, and a number of transfer conductive elements embedded in the elastomer. The chip is provided with a number of conductive portions. The conductive film is sandwiched between the mounting wall and the chip. The conductive elements are electrically connected to the conductive portions through the transfer conductive elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶片</p>
        <p type="p">3:導電膜</p>
        <p type="p">4:連接模組</p>
        <p type="p">4114:第二穿孔</p>
        <p type="p">5:保持蓋</p>
        <p type="p">51:開口</p>
        <p type="p">52:第一穿孔</p>
        <p type="p">6:緊固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2313" publication-number="202619171">
    <tif-files tif-type="multi-tif">
      <tif file="114137980.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接組件</chinese-title>
        <english-title>ELECTRICAL CONNECTION ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251128B">H01R12/72</main-classification>
        <further-classification edition="201101120251128B">H01R13/6581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張若禕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接組件包括連接模組、插座以及導電膜。連接模組包括第一殼體以及複數第一導電元件。第一殼體設有第一安裝壁。插座設有第二殼體以及複數第二導電元件。第二殼體設有收容空間以及位於收容空間的底部的第二安裝壁。導電膜包括骨架、彈性體以及複數轉接導電元件。導電膜收容於收容空間中。導電膜被夾持在第一安裝壁與第二安裝壁之間，彈性體至少被連接模組擠壓，第一導電元件藉由轉接導電元件與第二導電元件實現電性連接。相較於習知技術，本發明實施方式縮短了導電路徑，有利於提高訊號傳輸的品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connection assembly includes a connection module, a socket and a conductive film. The connection module includes a first housing and a number of first conductive elements. The first housing is provided with a first mounting wall. The socket includes a second housing and a number of second conductive elements. The second housing includes a receiving space and a second mounting wall. The conductive film includes a skeleton, an elastomer and a number of transfer conductive elements. The conductive film is received in the receiving space. The conductive film is sandwiched between the first mounting wall and the second mounting wall, and the elastomer is at least pressed by the connection module. The first conductive elements are electrically connected to the second conductive elements through the transfer conductive elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶片</p>
        <p type="p">11:導電部</p>
        <p type="p">AT1:第一轉接端子</p>
        <p type="p">C:圖21中畫框部分</p>
        <p type="p">S1:第一訊號導電端子</p>
        <p type="p">S2:第二訊號導電端子</p>
        <p type="p">S3:第三訊號導電端子</p>
        <p type="p">S4:第四訊號導電端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2314" publication-number="202617385">
    <tif-files tif-type="multi-tif">
      <tif file="114137992.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產業機械的操作裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B25J13/06</main-classification>
        <further-classification edition="200601120251201B">B25J13/00</further-classification>
        <further-classification edition="200601120251201B">B25J9/16</further-classification>
        <further-classification edition="200601120251201B">B25J9/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高沖英里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAOKI, HIDESATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠功士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷明彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚裕真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOTSUKA, YUUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作裝置，為產業機械的操作裝置，包括：外殼，具有背面且在內部界定收納空間。控制基板，配置於收納空間內。連接器，安裝於控制基板的安裝面上。其中，在外殼的背面上，在外殼的厚度方向設有比周圍還要凹陷的凹部；在凹部的內側面，相對於與厚度方向垂直相交的面，使連接器的連接方向朝向斜外方傾斜，連接器的連接口能向外部露出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:教示操作盤</p>
        <p type="p">20:控制基板</p>
        <p type="p">21:基材</p>
        <p type="p">22、23:安裝面</p>
        <p type="p">24:連接器</p>
        <p type="p">25:連接口</p>
        <p type="p">26:電子元件</p>
        <p type="p">30:外殼</p>
        <p type="p">31:收納空間</p>
        <p type="p">40:表殼體</p>
        <p type="p">41:開口面</p>
        <p type="p">42:肋體</p>
        <p type="p">43:支撐面</p>
        <p type="p">45:螢幕裝置</p>
        <p type="p">46:薄膜式鍵盤</p>
        <p type="p">50:裏殼體</p>
        <p type="p">50a:凹部</p>
        <p type="p">50o:開口部</p>
        <p type="p">50s:底面</p>
        <p type="p">51:開口面</p>
        <p type="p">52:肋體</p>
        <p type="p">53:前端面</p>
        <p type="p">55:啟動開關</p>
        <p type="p">56:突出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2315" publication-number="202617382">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產業機械的操作裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251226B">B25J9/22</main-classification>
        <further-classification edition="201301120251226B">G06F3/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷明彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚裕真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOTSUKA, YUUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠功士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高沖英里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAOKI, HIDESATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作裝置，是一種產業機械的操作裝置，包括本體殼體，包括顯示窗。平板狀的顯示器放置於本體殼體內，且在顯示窗配置顯示面。觸控面板相對於顯示面以預定間隔固定於本體殼體，且堵住顯示窗。框架元件在顯示器的外周圍區域，覆蓋在顯示器的厚度方向上延伸的外側面及厚度方向的兩側面，且以彈性材料所製。在本體殼體的內側面，設置包圍顯示窗的嵌合內側面。顯示器透過使安裝於顯示器的框架元件的外周圍嵌合於嵌合內側面，並透過以本體殼體在顯示器的厚度方向上夾住框架元件，以固定在本體殼體上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:第一半殼</p>
        <p type="p">8:顯示窗</p>
        <p type="p">9:周壁</p>
        <p type="p">9a:嵌合內側面</p>
        <p type="p">11:顯示器</p>
        <p type="p">11a:前面</p>
        <p type="p">11b:背面</p>
        <p type="p">12:框架元件</p>
        <p type="p">12a:背面</p>
        <p type="p">12b:內側面</p>
        <p type="p">13:環形溝槽</p>
        <p type="p">13a:溝底</p>
        <p type="p">13b:溝壁</p>
        <p type="p">14:側面</p>
        <p type="p">15:凸條</p>
        <p type="p">32:肋條</p>
        <p type="p">40:觸控面板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2316" publication-number="202617384">
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      <tif file="114137994.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產業機械的操作裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J13/00</main-classification>
        <further-classification edition="200601120260102B">B25J13/06</further-classification>
        <further-classification edition="200601120260102B">H05K5/02</further-classification>
        <further-classification edition="200601120260102B">H05K5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷明彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚裕真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOTSUKA, YUUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠功士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高沖英里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAOKI, HIDESATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作裝置，是一種產業機械的操作裝置。操作裝置包括第一殼體及第二殼體，第一殼體與第二殼體透過相互組合而在內部界定出收納電子元件的收納空間。第一殼體具有第一斜面，第一斜面相對於第一殼體與第二殼體組合的方向，斜向向外傾斜。第二殼體具有抵擋片，在第一殼體與第二殼體組合的狀態下，抵擋片配置為與第一斜面隔著間隙。間隙的大小為間隙在第一殼體及第二殼體至少其中之一因外力產生彈性變形時消滅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">s:間隙</p>
        <p type="p">20:機殼</p>
        <p type="p">21:收納空間</p>
        <p type="p">30:表殼體</p>
        <p type="p">31:開口部</p>
        <p type="p">32:底面</p>
        <p type="p">33:周壁</p>
        <p type="p">35:肋條</p>
        <p type="p">36:斜面</p>
        <p type="p">37:凹溝</p>
        <p type="p">40:裏殼體</p>
        <p type="p">41:開口部</p>
        <p type="p">42:底面</p>
        <p type="p">43:周壁</p>
        <p type="p">45:肋條</p>
        <p type="p">46:斜面</p>
        <p type="p">47:段部</p>
        <p type="p">60:密封元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2317" publication-number="202617853">
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      <tif file="114138003.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138003</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子材料用組成物及電子材料的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260127B">C08K3/011</main-classification>
        <further-classification edition="200601120260127B">C08K5/33</further-classification>
        <further-classification edition="200601120260127B">C08G18/04</further-classification>
        <further-classification edition="200601120260127B">C08L33/10</further-classification>
        <further-classification edition="200601120260127B">C08L63/04</further-classification>
        <further-classification edition="200601120260127B">C08L63/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口亞季子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田薰平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野尻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIRI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野憂子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部宏平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子材料用組成物及電子材料的製造方法，該電子材料用組成物含有：&lt;br/&gt;  (A)具有選自由羥基、羧基、可生成羥基的基團及可生成羧基的基團所組成之群組中的1種以上的基團(X)之化合物；&lt;br/&gt;  (B)具有1個或2個選自由異氰酸酯基及封閉異氰酸酯基所組成之群組中的1種以上的基團(Y)之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2318" publication-number="202617249">
    <tif-files tif-type="multi-tif">
      <tif file="114138059.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廢氣處理系統及方法</chinese-title>
        <english-title>EXHAUST GAS PROCESSING SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B01D53/34</main-classification>
        <further-classification edition="200601120260123B">B01D53/48</further-classification>
        <further-classification edition="200601120260123B">B01D53/56</further-classification>
        <further-classification edition="200601120260123B">B01D53/92</further-classification>
        <further-classification edition="200601120260123B">F01N3/08</further-classification>
        <further-classification edition="200601120260123B">F01N5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商蜆殼國際研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫雷洛　布拉德利　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORELLO, BRADLEY DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可處理氣流之系統包括：一硫去除單元，其可從該氣流中去除硫並產生第一經處理氣流；一氮氧化物去除單元，其設置在該硫去除單元下游並與其流體耦接；及一熱交換系統，其設置在該硫去除單元與該氮氧化物去除單元之間。該熱交換系統包括：一第一加熱元件，其可加熱該第一經處理氣流並產生具有一第一溫度的第一經加熱氣流；以一第二加熱元件，其設置在該第一加熱元件下游並與其流體耦接。該第二加熱元件可接收並加熱該第一經加熱氣流並產生第二經加熱氣流，且該第二經加熱氣流具有大於該第一溫度的一第二溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system that may treat a gas stream includes a sulfur removal unit that may remove sulfur from the gas stream and generate a first treated gas stream; an oxides of nitrogen removal unit disposed downstream from and fluidly coupled to the sulfur removal unit; and a heat exchange system disposed between the sulfur removal unit and the oxides of nitrogen removal unit. The heat exchange system includes a first heating element that may heat the first treated gas stream and generate a first heated gas stream having a first temperature, and a second heating element disposed downstream from and fluidly coupled to the first heating element. The second heating element may receive and heat the first heated gas stream and generate a second heated gas stream, and the second heated gas stream has a second temperature that is greater than the first temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2319" publication-number="202617329">
    <tif-files tif-type="multi-tif">
      <tif file="114138061.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具機</chinese-title>
        <english-title>MACHINE TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251226B">B23Q3/06</main-classification>
        <further-classification edition="200601120251226B">B23B19/02</further-classification>
        <further-classification edition="200601120251226B">B23B31/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商星精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAR MICRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香川祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志鎌耕一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGAMA, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出野真敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENO, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤弘樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶優介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠以廉價之構成且高精度地導出把持部之把持力之工具機。  &lt;br/&gt;本發明之工具機具備：第1主軸4，其具有把持工件W1之筒夾夾頭41；第1主軸台3，其將第1主軸4以可使其自由旋轉之方式予以支持；氣缸33，其產生驅動力，該驅動力使筒夾夾頭41在把持工件W1之把持狀態與解除工件W1之把持之把持解除狀態之間進行狀態變化；非旋轉傳遞構件34，其傳遞自氣缸33接受到之驅動力；旋轉傳遞構件45，其與第1主軸4一起旋轉，將自非旋轉傳遞構件34接受到之驅動力傳遞至筒夾夾頭41；應變檢測機構46，其安裝於非旋轉傳遞構件34，對當驅動力自氣缸33傳遞至筒夾夾頭41時所產生之非旋轉傳遞構件34之應變進行檢測；及導出部23，其基於應變檢測機構46之檢測結果，導出筒夾夾頭41之把持力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The machine tool includes: a first spindle that includes a collet chuck that grips a workpiece; a first headstock that rotatably supports the first spindle; an air cylinder that generates a driving force for changing a state of the collet chuck between a gripping state for gripping the workpiece and a release state for releasing the grip of the workpiece; a non-rotary transmitting member that transmits the driving force received from the air cylinder; a rotary transmitting member that rotates together the first spindle and transmits to the collet chuck the driving force received from the non-rotary transmitting member; strain detection means that is attached to the non-rotary transmitting member and detects a strain of the non-rotary transmitting member produced when the driving force is transmitted from the air cylinder to the collet chuck, and a deriving unit that derives the gripping force of the collet chuck based on a detection result of the strain detection means.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:第1主軸台(主軸台)</p>
        <p type="p">4:第1主軸(主軸)</p>
        <p type="p">30:第1主軸台主體</p>
        <p type="p">33:氣缸(致動器)</p>
        <p type="p">34:非旋轉傳遞構件</p>
        <p type="p">40:主軸主體</p>
        <p type="p">42:轉軸端蓋</p>
        <p type="p">45:旋轉傳遞構件</p>
        <p type="p">46:應變檢測機構</p>
        <p type="p">321:缸筒</p>
        <p type="p">340:活塞桿</p>
        <p type="p">341:換檔桿</p>
        <p type="p">342:搖臂軸</p>
        <p type="p">343:連接銷</p>
        <p type="p">452:換檔器</p>
        <p type="p">453:爪構件</p>
        <p type="p">457:調節螺母</p>
        <p type="p">461:信號線</p>
        <p type="p">Z1:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2320" publication-number="202617896">
    <tif-files tif-type="multi-tif">
      <tif file="114138066.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子材料用組成物及電子材料的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C09D4/02</main-classification>
        <further-classification edition="201801120260127B">C08K3/011</further-classification>
        <further-classification edition="200601120260127B">C08K5/33</further-classification>
        <further-classification edition="200601120260127B">C08G18/04</further-classification>
        <further-classification edition="200601120260127B">C08L33/10</further-classification>
        <further-classification edition="200601120260127B">C08L63/04</further-classification>
        <further-classification edition="200601120260127B">C08L63/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口亞季子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田薰平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野尻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIRI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野憂子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部宏平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子材料用組成物，其含有：&lt;br/&gt;  (A)具有選自由羥基、羧基、可生成羥基的基團及可生成羧基的基團所組成之群組中的1種以上的基團(X)之化合物；&lt;br/&gt;  (B)具有乙烯性不飽和基與選自由異氰酸酯基及封閉異氰酸酯基所組成之群組中的1種以上的基團(Y)之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2321" publication-number="202618721">
    <tif-files tif-type="multi-tif">
      <tif file="114138114.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138114</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交通分析方法和裝置</chinese-title>
        <english-title>TRAFFIC ANALYZING METHOD AND DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G08G1/01</main-classification>
        <further-classification edition="202201120251103B">G06V20/52</further-classification>
        <further-classification edition="202301120251103B">G06N3/08</further-classification>
        <further-classification edition="201701120251103B">G06T7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光林智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEOTEK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒恆安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZOU, HENG-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種交通分析裝置。交通分析裝置可包括一相機、一處理器和一記憶體。相機可用以擷取關聯於一道路景象之影片。記憶體可耦接處理器。處理器可用以使用一第一機器學習模型分析影片之一第一片段，以產生一第一交通描述，將第一交通描述嵌入和影片之第一片段同步之一第一影片編碼參數中，以及使用一第二機器學習模型根據第一影片編碼參數分析影片之一第二片段，以產生一第二交通描述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A traffic analyzing device is provided. The traffic analyzing device may include a camera, a processor and a memory. The camera be configured to capture a video associated with a scene of a road. The memory may be coupled to the processor. The processor may be configured to apply a first machine learning model to analyze a first segment of the video to generate a first traffic depiction, embed the first traffic depiction in a first video encoding parameter synchronized with the first segment of the video, and apply a second machine learning model to analyze a second segment of the video according to the first video encoding parameter to generate a second traffic depiction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:流程圖</p>
        <p type="p">S710~S740:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2322" publication-number="202619021">
    <tif-files tif-type="multi-tif">
      <tif file="114138183.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於接合堆疊之脫離的具鈍化層之載體</chinese-title>
        <english-title>CARRIER FOR DEBONDING OF BONDED STACK WITH PASSIVATION LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/683</main-classification>
        <further-classification edition="201901120260123B">B32B7/06</further-classification>
        <further-classification edition="200601120260123B">B32B15/04</further-classification>
        <further-classification edition="200601120260123B">C03C17/36</further-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商脈衝鍛造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULSEFORGE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森　伊恩　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAWSON, IAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　哈利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施洛德　寇特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHRODER, KURT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可重複使用之載體結構，其用於在暫時接合循環期間暫時承載電子結構，該電子結構待藉由脫離光自該載體結構脫離。該可重複使用之載體結構包括對至少一些該脫離光實質上透明的載體主體、光吸收層。該可重複使用之載體結構可包括鈍化層，該鈍化層經組態以保護該光吸收層免於降解，因此該載體結構可用於多個暫時接合循環，其中該載體結構以黏著方式接合至該可重複使用之載體結構。該可重複使用之載體結構可包括保護中間層，該保護中間層經組態以在接合循環期間保護該載體主體的承載表面免於降解。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reusable carrier structure for temporarily carrying electronics structures to be debonded from the carrier structure by a debonding light during temporary bonding cycles. The reusable carrier structure includes a carrier body that is substantially transparent to at least some of the debonding light, a light-absorbing layer. The reusable carrier structure can include a passivation layer configured to protect the light-absorbing layer from degradation so the carrier structure can be used in multiple temporary bonding cycles in which the carrier structure is adhesively bonded to the reusable carrier structure. The reusable can include a protective interlayer configured to protect a carrying surface of the carrier body from degradation during bonding cycles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:可重複使用之載體結構</p>
        <p type="p">20:電子結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2323" publication-number="202617019">
    <tif-files tif-type="multi-tif">
      <tif file="114138213.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括緊湊、可拆卸、彈性阻尼稱重組的咖啡研磨定量設備</chinese-title>
        <english-title>COFFEE GRINDER-DOSER COMPRISING A COMPACT, REMOVABLE, ELASTICALLY DAMPED WEIGHING GROUP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A47J42/38</main-classification>
        <further-classification edition="200601120260131B">A47J42/44</further-classification>
        <further-classification edition="200601120260131B">A47J42/40</further-classification>
        <further-classification edition="200601120260131B">A47J31/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商費倫扎拓ＭＣ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIORENZATO M.C. SRL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利桑德龍　盧卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LISSANDRON, LUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種咖啡研磨定量設備（10），其使用緊湊的集成式稱重組（140）提供實時重量控制，該稱重組（140）可以水平插入的可互換稱重卡匣的方式從機器外部拆卸。該咖啡研磨定量設備（10）在機身前部（130）安裝在機器支撐殼體（103）提供的插入座部（113）中，並且具有自支撐剛性外殼和附接末端（143），該附接末端（143）以懸臂進行支撐並且對縱向主體進行彈性阻尼，該縱向主體包括稱重傳感器，該稱重傳感器具有自由向外彎曲的末端和固定到稱重傳感器上的相對末端、用於稱重傳感器管理的電子卡以及集成式連接裝置。該稱重傳感器通過前開口（147）連接到過濾保持器叉形件（117）並且與外部前面板（116）相關聯，該外部前面板（116）用於至少從正面覆蓋該附接末端（143），減震環被插置在附接末端固定孔（145）中，以便對在機器內部浮動的該縱向主體進行彈性支撐。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coffee grinder and dose measuring device (10) providing real-time weight control using a compact integrated weighing group (140) removable from outside the machine in the manner of a horizontally inserted interchangeable cartridge. The device (10) is mounted on the front portion of the machine body (130) in an insertion seat afforded in the machine casing (103, 113), and exhibits a self-supporting rigid housing and an attachment extremity that supports in cantilever and elastically dampens a longitudinal element comprising a load cell which exhibits a freely flexing outward extremity and an opposite extremity fixed to the load cell, an electronic card for load cell management, and integrated means for connecting. The load cell is connected to a filter holder fork (117) through a front opening and associated to an external front cover plate (116) serving to frontally cover at least the attachment extremity, damping elements being interposed in attachment extremity fixing holes in order to elastically support the longitudinal element in floatation inside the machine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:機身</p>
        <p type="p">103:支撐殼體</p>
        <p type="p">113:插入座部</p>
        <p type="p">114:插入開口</p>
        <p type="p">115:固定孔</p>
        <p type="p">116:外部前面板</p>
        <p type="p">117:叉形件</p>
        <p type="p">118:過濾保持器固持元件</p>
        <p type="p">119:第一固定螺釘</p>
        <p type="p">130:機身前部</p>
        <p type="p">140:稱重組</p>
        <p type="p">141:剛性外殼</p>
        <p type="p">142:縱向主體</p>
        <p type="p">143:附接末端</p>
        <p type="p">146:固定螺釘</p>
        <p type="p">161:隔離器件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2324" publication-number="202618810">
    <tif-files tif-type="multi-tif">
      <tif file="114138219.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬氧化物變阻器裝置、熱保護金屬氧化物變阻器裝置、正溫度係數裝置及熔絲</chinese-title>
        <english-title>METAL OXIDE VARISTOR DEVICE, THERMALLY PROTECTED METAL OXIDE VARISTOR DEVICE, POSITIVE TEMPERATURE COEFFICIENT DEVICE, AND FUSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01C1/034</main-classification>
        <further-classification edition="200601120260202B">H01C7/02</further-classification>
        <further-classification edition="200601120260202B">H01C7/108</further-classification>
        <further-classification edition="200601120260202B">H01C7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商力特福斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITTELFUSE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾　俊昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSANG, CHUN-KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狄遲　葛登　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIETSCH, GORDON T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">金屬氧化物變阻器裝置包括：金屬氧化物變阻器晶片；配置在金屬氧化物變阻器晶片的相對側面上的導電的第一電極和第二電極；分別連接至第一電極和第二電極的導電的第一引線和第二引線；以及覆蓋金屬氧化物變阻器晶片、第一電極、第二電極、以及第一引線和第二引線的部分的減弧阻燃塗層，減弧阻燃塗層包含由懸浮在聚矽氧樹脂中的填充材料形成的聚矽氧組成物，其中填充材料包含三聚氰胺、胍、鳥嘌呤、乙內醯脲、尿囊素、尿素、三聚氰胺-甲醛、三聚氰胺-氰尿酸聚合物和硼酸中的一或多者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, electrically conductive first and second leads connected to the first and second electrodes, respectively, and an arc mitigating, flame retarding coating covering the MOV chip, the first and second electrodes, and portions of the first and second leads, the arc mitigating, flame retarding coating comprising a silicone composition formed of a filler material suspended in a silicone resin, wherein the filler material includes one or more of melamine, guanidine, guanine, hydantoin, allantoin, urea, melamine-formaldehyde, melamine-cyanurate polymer, and boric acid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:金屬氧化物變阻器裝置</p>
        <p type="p">12:金屬氧化物變阻器晶片</p>
        <p type="p">14a:電極</p>
        <p type="p">15,16:引線</p>
        <p type="p">20:塗層</p>
        <p type="p">21:殼體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2325" publication-number="202618440">
    <tif-files tif-type="multi-tif">
      <tif file="114138244.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻圖案形成方法及利用此方法製造的半導體裝置</chinese-title>
        <english-title>PHOTORESIST PATTERN FORMING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251103B">G03F1/82</main-classification>
        <further-classification edition="201201120251103B">G03F1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＹＣ化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YCCHEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金起洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GI HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林玹贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, HYUN CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">光阻圖案形成方法，用於使用典型光阻形成具有增加的深寬比的圖案，以及使用其製造的半導體裝置。光阻圖案形成方法可藉由在清洗步驟中使用加熱超純水和/或加熱沖洗溶液來減少清洗後旋轉乾燥製程期間的圖案塌陷缺陷，藉此增強整體製程良率並提供具有增強性能的半導體裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photoresist pattern forming method for forming a pattern with an increased aspect ratio using a typical photoresist and a semiconductor device manufactured using the same. The photoresist pattern forming method can reduce pattern collapse defects during a post-cleaning spin-drying process by using heated ultrapure water and/or a heated rinse solution in a cleaning step, thereby enhancing the overall process yield and providing the semiconductor device having enhanced performance.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2326" publication-number="202618037">
    <tif-files tif-type="multi-tif">
      <tif file="114138261.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低介電常數原子層沉積間隙填充方法及材料</chinese-title>
        <english-title>LOW-K ALD GAP-FILL METHODS AND MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C23C16/30</main-classification>
        <further-classification edition="200601120260130B">C23C16/40</further-classification>
        <further-classification edition="200601120260130B">C23C16/32</further-classification>
        <further-classification edition="200601120260130B">C23C16/455</further-classification>
        <further-classification edition="200601120260130B">C23C16/56</further-classification>
        <further-classification edition="200601120260130B">H01L21/02</further-classification>
        <further-classification edition="200601120260130B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞伯　喬瑟夫　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABEL, JOSEPH R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格紐　道格拉斯　華特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGNEW, DOUGLAS WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉芙依　艾里恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAVOIE, ADRIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科廷　伊恩　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIN, IAN JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　普魯夏坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, PURUSHOTTAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">諸多實施例包括提供低介電常數(低-k)膜的方法。在一實施例中，交替ALD循環和摻質材料用以產生新家族之矽基低-k材料。更詳細地說，這些材料是被發展用來填充具有內凹角特徵之高深寬比結構。然而，這些膜亦可用在毯覆式應用，其中可以使用共形的奈米疊層。諸多實施例亦揭示SiOF以及SiOCF、SiONF、GeOCF、和GeOF。相似膜可包括具有碘與溴之鹵化物衍生物(例如，以「I」或「Br」來取代「F」)。本說明書揭示其他方法、化學機制、及技術。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments include methods to produce low dielectric-constant (low-k) films. In one embodiment, alternating ALD cycles and dopant materials are used to generate a new family of silicon-based low-k materials. Specifically, these materials were developed to fill high-aspect-ratio structures with re-entrant features. However, such films are also useful in blanket applications where conformal nanolaminates are applicable. Various embodiments also disclose SiOF as well as SiOCF, SiONF, GeOCF, and GeOF. Analogous films may include halide derivatives with iodine and bromine (e.g., replace “F” with “I” or “Br”). Other methods, chemistries, and techniques are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">505:操作</p>
        <p type="p">510:ALD製程流程</p>
        <p type="p">511:給劑操作</p>
        <p type="p">513:沖洗操作</p>
        <p type="p">515:氧化操作</p>
        <p type="p">517:第二沖洗操作</p>
        <p type="p">530:摻質製程流程</p>
        <p type="p">531:點燃操作</p>
        <p type="p">533:摻雜操作</p>
        <p type="p">535:沖洗操作</p>
        <p type="p">550:退火製程控制流程</p>
        <p type="p">551:點燃操作</p>
        <p type="p">553:摻雜操作</p>
        <p type="p">555:沖洗操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2327" publication-number="202617838">
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      <tif file="114138301.zip" no="1">
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        <document-id>
          <doc-number>114138301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有烷氧基矽基官能化三聚異氰酸酯助黏劑之聚苯基矽氧烷</chinese-title>
        <english-title>POLYPHENYLSILOXANE WITH ALKOXYSILYL FUNCTIONALIZED ISOCYANURATE ADHESION PROMOTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">C08G77/18</main-classification>
        <further-classification edition="200601120260129B">C08L83/05</further-classification>
        <further-classification edition="200601120260129B">C08L83/07</further-classification>
        <further-classification edition="200601120260129B">C07C265/02</further-classification>
        <further-classification edition="200601120260129B">C07F7/18</further-classification>
        <further-classification edition="200601120260129B">C09D183/14</further-classification>
        <further-classification edition="201801120260129B">C08K3/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUNGEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權敏姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, MIN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　佔傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHANJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　弼忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, BIZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周曉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, XIAOYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種組成物，其包含a)一或多種式1化合物：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="277px" width="208px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；  &lt;br/&gt;&lt;br/&gt;b)二乙烯基封端之聚苯基矽氧烷；c)乙烯基封端之聚苯基矽氧烷樹脂；d)氫苯基矽氧烷；及e)矽氫化催化劑；其中R、D&lt;sup&gt;H&lt;/sup&gt;、x、m、及n如本文所定義。本發明之組成物可用作電子裝置之塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition comprising a) one or more compounds of Formula 1: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="286px" width="213px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;; &lt;br/&gt;&lt;br/&gt;b) a divinyl-terminated polyphenylsiloxane; c) a vinyl-terminated polyphenylsiloxane resin; d) a hydrogenphenylsiloxane; and e) a hydrosilylation catalyst; where R, D&lt;sup&gt;H&lt;/sup&gt;, x, m, and n are as defined herein. The composition of the present invention is useful as a coating for electronic devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2328" publication-number="202617918">
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      <tif file="114138310.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617918</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磨粒、漿料、研磨方法、及零件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C09K3/14</main-classification>
        <further-classification edition="202001120260128B">C01F17/00</further-classification>
        <further-classification edition="200601120260128B">C08K3/22</further-classification>
        <further-classification edition="201201120260128B">B24B37/00</further-classification>
        <further-classification edition="201201120260128B">B24B37/34</further-classification>
        <further-classification edition="200601120260128B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安徳七海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTOKU, NANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田遼平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯倉大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIKURA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田勇太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木快</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種漿料，其含有包含鈰系粒子的磨粒，前述鈰系粒子經以具有1個三烷氧基矽烷基及包含雜原子的官能基的矽烷化合物進行表面處理。一種研磨方法，具備使用所述漿料來研磨被研磨部件之步驟。一種磨粒，其包含鈰系粒子，所述鈰系粒子經以具有1個三烷氧基矽烷基及包含雜原子的官能基的矽烷化合物進行表面處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2329" publication-number="202617624">
    <tif-files tif-type="multi-tif">
      <tif file="114138331.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">C03C27/10</main-classification>
        <further-classification edition="200601120260127B">C03C17/32</further-classification>
        <further-classification edition="200601120260127B">B32B17/10</further-classification>
        <further-classification edition="201901120260127B">B32B7/023</further-classification>
        <further-classification edition="200601120260127B">B32B7/10</further-classification>
        <further-classification edition="200601120260127B">B32B37/02</further-classification>
        <further-classification edition="200601120260127B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本誠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示之玻璃積層體包含具有第1主面及第2主面之玻璃薄膜與配置於第1主面上之樹脂層。樹脂層12於前述樹脂層之外周部具有厚度為5µm以上且30µm以下之薄壁部。樹脂層之外周端位於較玻璃薄膜之外周端更靠中央側。玻璃薄膜之外周端與樹脂層之外周端的距離為1µm以上且小於25µm。樹脂層中未受到雷射加工之部分之厚度為40µm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:玻璃積層體</p>
        <p type="p">11:玻璃薄膜</p>
        <p type="p">11a:第1主面</p>
        <p type="p">11b:第2主面</p>
        <p type="p">12:樹脂層</p>
        <p type="p">12t:薄壁部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2330" publication-number="202618069">
    <tif-files tif-type="multi-tif">
      <tif file="114138361.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有冷凝水收集功能的氫氣產生器</chinese-title>
        <english-title>HYDROGEN GENERATOR WITH CONDENSATE COLLECTING FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260123B">C25B1/04</main-classification>
        <further-classification edition="200601120260123B">C25B15/08</further-classification>
        <further-classification edition="202101120260123B">C25B9/13</further-classification>
        <further-classification edition="200601120260123B">A61M16/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信湧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信湧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有冷凝水收集功能的氫氣產生器包含水箱、電解槽、冷凝過濾裝置、濕化器及整合式流道裝置。水箱具有容置空間以容置電解水。電解槽接收該電解水以產生並輸出含氫氣體。冷凝過濾裝置耦接電解槽以冷凝及過濾含氫氣體。濕化器具有互相隔離的集水室及濕化室。集水室用以收集冷凝後的含氫氣體所產生的冷凝水，並且濕化室用以容置補充水且接收含氫氣體至補充水中。整合式流道裝置耦接水箱、電解槽、冷凝過濾裝置及濕化器，以使濕化室的補充水可自濕化室、集水室、冷凝過濾裝置補充至水箱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hydrogen generator with condensate collecting function includes a water tank having a containing space for containing the water, an electrolysis module, a condensing and filtering device, a humidifying module and an integrated flow channel device. The electrolysis module receives the water to generate and output gas comprising hydrogen. The condensing and filtering device is coupled to the electrolysis module to condense and filter the gas comprising hydrogen. The humidifying module includes a water collecting chamber for collecting the condensate generated by the condensed gas comprising hydrogen and a humidifying chamber for containing the supplement water and receiving the gas comprising hydrogen. The integrated flow channel device is coupled to the water tank, the electrolysis module, the condensing and filtering device and the humidifying module and configured to supplement the supplement water of the humidifying chamber to the water tank.</p>
      </isu-abst>
      <representative-img>
        <p type="p">E:氫氣產生裝置</p>
        <p type="p">1:水箱</p>
        <p type="p">3:整合式流道裝置</p>
        <p type="p">4:濕化器</p>
        <p type="p">5:冷凝過濾裝置</p>
        <p type="p">80:霧化器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2331" publication-number="202617910">
    <tif-files tif-type="multi-tif">
      <tif file="114138378.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電性粒子</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251215B">C09J9/02</main-classification>
        <further-classification edition="200601120251215B">B22F9/24</further-classification>
        <further-classification edition="200601120251215B">C22C19/03</further-classification>
        <further-classification edition="202301120251215B">C22C1/10</further-classification>
        <further-classification edition="200601120251215B">H01B1/02</further-classification>
        <further-classification edition="200601120251215B">H01B5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商博邁立鋮股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROTERIAL, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森英人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, HIDEHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村絢子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, JUNKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滋賀尚吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種導電性粒子，其能夠應對伴隨著電子/電氣設備的高功能化的電極的窄間距化，可有助於確保使得積層的基板間的間隙恆定化的平坦度。一種導電性粒子，具有包含Ni及P的球狀的芯以及覆蓋所述芯的鍍覆層，且圓形度為0.870以上，較佳為累計體積分佈曲線中的中值粒徑d50為0.5 μm以上且100.0 μm以下，並且（d90-d50）/d50≦1.50，較佳為體積電阻率小於1.00×10&lt;sup&gt;-5&lt;/sup&gt; Ω·m，較佳為所述鍍覆層為Sn-Bi合金鍍覆、Ag鍍覆、Cu鍍覆中的任一者，亦可在所述芯與所述鍍覆層之間更具有Ni鍍覆層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:導電性粒子</p>
        <p type="p">10:芯</p>
        <p type="p">11:鍍覆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2332" publication-number="202617389">
    <tif-files tif-type="multi-tif">
      <tif file="114138404.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138404</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機械手</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J15/08</main-classification>
        <further-classification edition="200601120260102B">B25J9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太朗
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSUBARA, YOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木忠則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TADANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口隼司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本開示的一個態樣涉及一種機械手，其是裝備在垂直多關節型、水平多關節型、極座標型等各種不同種類的機械臂的末端，且是可以使用的。機械手具有安裝在機械臂的末端之基座部。在基座部支撐多個握持部。多個握持部，是相對於基座部被固定。多個握持部，是各自的中心線互朝向前方遠離的方向傾斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機械手</p>
        <p type="p">10:基底板</p>
        <p type="p">11:接合板</p>
        <p type="p">13,14:支撐臺</p>
        <p type="p">15,16:吸附墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2333" publication-number="202618918">
    <tif-files tif-type="multi-tif">
      <tif file="114138459.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>供液裝置和基板處理設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01L21/306</main-classification>
        <further-classification edition="202201120251103B">B01F23/2326</further-classification>
        <further-classification edition="200601120251103B">C09K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬澤賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, ZEXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>初振明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, ZHENMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及半導體設備領域，特別是供液裝置和基板處理設備。供液裝置包括：供液槽，用於容納溶液；供氣組件，包括第一供氣部，其中，第一供氣部用於向供液槽中的溶液中提供含氧的氣體；控制器，與供氣元件電連接，被配置為：控制第一供氣部的進氣時間以及第一供氣部的進氣量以使得在該進氣時間內供液槽中的溶液的氧含量達到第一預設值且保持穩定。本申請改善了現有技術中因溶液中氧含量變化使得刻蝕速率產生變化，進而影響刻蝕形狀的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:進液管路</p>
        <p type="p">40:供液槽</p>
        <p type="p">50:製程腔</p>
        <p type="p">60:供液管路</p>
        <p type="p">70:供氣元件</p>
        <p type="p">72:第一供氣部</p>
        <p type="p">80:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2334" publication-number="202619172">
    <tif-files tif-type="multi-tif">
      <tif file="114138486.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可插式通訊模組之EEPROM寫入保護</chinese-title>
        <english-title>WRITE PROTECTION FOR EEPROM OF A PLUGGABLE COMMUNICATION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260123B">H01R12/72</main-classification>
        <further-classification edition="200601120260123B">H01R13/642</further-classification>
        <further-classification edition="200601120260123B">G11C16/22</further-classification>
        <further-classification edition="200601120260123B">H01R13/64</further-classification>
        <further-classification edition="200601120260123B">G11C7/24</further-classification>
        <further-classification edition="201301120260123B">G06F21/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商泰科電子(上海)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯特洛　布萊恩　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSTELLO, BRIAN PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉松華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SONGHUA (CEDAR)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅耶斯　喬爾　內森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYERS, JOEL NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里金傑　德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLICKINGER, DREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可插式通訊模組(200)包含一電路卡(250)，其具有具一邊緣(252)的一基板(258)。所述可插式通訊模組包含一EEPROM元件(300)，其具有一電源引腳(312)、一串列資料引腳(314)、一串列時脈接點(316)、一接地引腳(318)、以及用於編程該EEPROM元件的一寫入控制引腳(320)。所述可插式通訊模組在靠近該邊緣處包含一接點焊墊場(262)，其具有訊號焊墊(264)、接地焊墊(266)、一電力焊墊、一串列資料焊墊(270)、一串列時脈焊墊(272)和一寫入焊墊(280)。該寫入焊墊係位於距所述訊號焊墊前方的該電路卡的邊緣一編程深度處，以將該寫入焊墊配接至插座連接器(112)，而不將訊號焊墊配接至插座連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pluggable communication module (200) includes a circuit card (250) having a substrate (258) with an edge (252). The pluggable communication module includes an EEPROM device (300) having a power supply pin (312), a serial data pin (314), a serial clock pin (316), a ground pin (318), and a write control pin (320) for programming the EEPROM device. The pluggable communication module includes a contact pad field (262) proximate to the edge having signal pads (264), ground pads (266), a power pad, a serial data pad (270), a serial clock pad (272), and a write pad (280). The write pad is located at a programming depth from the edge of the circuit card forward of the signal pads to mate the write pad to the receptacle connector (112) without mating to the signal pads to the receptacle connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">250:電路卡</p>
        <p type="p">252:邊緣</p>
        <p type="p">254:上表面</p>
        <p type="p">258:基板</p>
        <p type="p">260:接點</p>
        <p type="p">262:接點焊墊場</p>
        <p type="p">264:訊號焊墊</p>
        <p type="p">266:接地焊墊</p>
        <p type="p">266a:堆疊式接地焊墊</p>
        <p type="p">268:電力焊墊</p>
        <p type="p">270:串列資料焊墊</p>
        <p type="p">272:串列時脈焊墊</p>
        <p type="p">274:編程接地焊墊</p>
        <p type="p">280:寫入焊墊</p>
        <p type="p">282:橫軸</p>
        <p type="p">284:縱軸</p>
        <p type="p">286:橫軸</p>
        <p type="p">290:前端</p>
        <p type="p">292:後端</p>
        <p type="p">294:第一深度</p>
        <p type="p">300:記憶體元件</p>
        <p type="p">302:電阻器</p>
        <p type="p">310:導件</p>
        <p type="p">312:電源引腳</p>
        <p type="p">314:串列資料引腳</p>
        <p type="p">316:串列時脈引腳</p>
        <p type="p">318:編程接地引腳</p>
        <p type="p">320:寫入控制引腳</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2335" publication-number="202619194">
    <tif-files tif-type="multi-tif">
      <tif file="114138525.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及連接器對</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">H01R13/6461</main-classification>
        <further-classification edition="201101120260102B">H01R13/6581</further-classification>
        <further-classification edition="200601120260102B">H01R13/639</further-classification>
        <further-classification edition="201101120260102B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野公保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, KIMIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松下英廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA, HIDEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">問題：提供一種能穩定地維持端子的接觸狀態的連接器，適合用於高速信號傳輸，能夠製成多極化，具有簡單的構造，成本低，便於對接作業，小型低高度，且可靠性高。解決手段：一種連接器包括殼體和保持在所述殼體中的端子單元；其中，所述端子單元包括信號端子、包圍所述信號端子的屏蔽端子、以及安裝有所述信號端子和所述屏蔽端子的端子殼體，所述端子殼體包括從所述屏蔽端子向外突出的擠壓肋，以及所述殼體形成有收容所述端子單元的端子單元收容腔，所述端子單元被收容並保持在所述端子單元收容腔內，且所述屏蔽端子不與所述殼體接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連接器</p>
        <p type="p">11:連接器殼體</p>
        <p type="p">11a:長邊部</p>
        <p type="p">11b:短邊部</p>
        <p type="p">11c:對接面</p>
        <p type="p">12:凹部</p>
        <p type="p">12a:溝部</p>
        <p type="p">13:凸條部</p>
        <p type="p">14:側壁部</p>
        <p type="p">14a:高壁部</p>
        <p type="p">14b:低壁部</p>
        <p type="p">14c:缺口部</p>
        <p type="p">14d:突壁部</p>
        <p type="p">60:端子單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2336" publication-number="202619195">
    <tif-files tif-type="multi-tif">
      <tif file="114138526.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及連接器對</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251231B">H01R13/6471</main-classification>
        <further-classification edition="201101120251231B">H01R12/72</further-classification>
        <further-classification edition="200601120251231B">H01R13/652</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野公保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, KIMIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松下英廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA, HIDEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">問題：提供連接器，其能穩定地維持端子的接觸狀態，適合用於高速信號傳輸，能夠製成多極化，具有簡單的構造，成本低，便於對接作業，小型低高度，且可靠性高。解決手段：連接器包括殼體、保持在所述殼體中的信號端子、以及包圍所述信號端子的屏蔽端子，其中，所述屏蔽端子包括U字狀端子和片狀端子，所述U字狀端子包括本體部、從所述本體部的兩端延伸出的一對側板部以及可彈性變形的第二接點部，所述第二接點部連接於各側板部的上端，並與對應連接器的屏蔽端子接觸，所述片狀端子包括可彈性變形的的第三接點部，所述第三接點部與所述對應連接器的屏蔽端子的本體部接觸，以及所述本體部與所述對應連接器的片狀端子的可彈性變形的第三接點部接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連接器</p>
        <p type="p">11:連接器殼體</p>
        <p type="p">11a:長邊部</p>
        <p type="p">11b:短邊部</p>
        <p type="p">11c:對接面</p>
        <p type="p">12:凹部</p>
        <p type="p">12a:溝部</p>
        <p type="p">13:凸條部</p>
        <p type="p">14:側壁部</p>
        <p type="p">14a:高壁部</p>
        <p type="p">14b:低壁部</p>
        <p type="p">14c:缺口部</p>
        <p type="p">14d:突壁部</p>
        <p type="p">60:端子單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2337" publication-number="202617519">
    <tif-files tif-type="multi-tif">
      <tif file="114138543.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於模組運輸的可重複使用的格柵系統及方法</chinese-title>
        <english-title>RE-USABLE GRILLAGE SYSTEM AND METHODS FOR MODULE TRANSPORTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">B63B25/24</main-classification>
        <further-classification edition="200601120260124B">B63B25/28</further-classification>
        <further-classification edition="200601120260124B">B65G67/60</further-classification>
        <further-classification edition="200601120260124B">E02B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商德希尼布能源法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNIP ENERGIES FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布瑟林　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUTHERIN, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜普萊西克斯　紀堯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU PLESSIX, GUILLAUME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維　布魯諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVY, BRUNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧奎奧　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUQUIAU, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文可提供一種具有一組格柵單元的可重複使用的格柵系統以用於模組運輸。該等格柵單元之各者可包括具有一第一端及一第二端的一中心梁。各格柵單元可進一步包括定位在該中心梁的該第一端處的第一橫梁及定位在該中心梁的該第二端處的一第二橫梁。另外，各格柵單元可包括一第一群組之連接器元件，其具有從該第一橫梁延伸的一第一連接器元件及從該第二橫梁延伸的一第二連接器元件。各格柵單元的一第二群組之連接器元件可包括從該第一橫梁延伸的一第三連接器元件及從該第二橫梁延伸的一第四連接器元件。該第一群組之連接器元件及該第二群組之連接器元件可間隔開一連接器元件間隔距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A re-usable grillage system with a set of grillage units can be provided for module transportation. Each of the grillage units can include a central beam with a first end and a second end. Each grillage unit can further include first cross beam positioned at the first end of the central beam and a second cross beam positioned at the second end of the central beam. Additionally, each grillage unit can include a first group of connector elements with a first connector element extending from the first cross beam and a second connector element extending from the second cross beam. A second group of connector elements of each grillage unit can include a third connector element extending from the first cross beam and a fourth connector element extending from the second cross beam. The first and second groups of connector elements can be spaced apart a connector element spacing distance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:第一船舶</p>
        <p type="p">102a:甲板框架</p>
        <p type="p">102b:甲板框架</p>
        <p type="p">104:格柵單元</p>
        <p type="p">105:水面</p>
        <p type="p">106a:模組</p>
        <p type="p">108a:貨物甲板</p>
        <p type="p">112a:第一甲板框架間隔距離</p>
        <p type="p">200:可重複使用的格柵系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2338" publication-number="202618560">
    <tif-files tif-type="multi-tif">
      <tif file="114138610.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體模組及包括記憶體模組之記憶體系統</chinese-title>
        <english-title>MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE MEMORY MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F12/02</main-classification>
        <further-classification edition="201601120260102B">G06F12/0806</further-classification>
        <further-classification edition="201601120260102B">G06F12/084</further-classification>
        <further-classification edition="200601120260102B">G11C8/04</further-classification>
        <further-classification edition="200601120260102B">G11C8/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金智男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHINAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金廣洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANGSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種根據本揭露內容之一實施例的記憶體模組可包含： 一第一記憶體裝置，其包括第一複數個記憶體排組、第二複數個記憶體排組及一第一再新管理電路；以及一第二記憶體裝置，其包括第三複數個記憶體排組、第四複數個記憶體排組及一第二再新管理電路，其中該第一再新管理電路經組配以管理對該等第一複數個記憶體排組及該等第三複數個記憶體排組執行再新之一次數，且該第二再新管理電路經組配以管理對該等第二複數個記憶體排組及該等第四複數個記憶體排組執行再新之一次數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory module according to an embodiment of present disclosure may comprise: a first memory device including a first plurality of memory banks, a second plurality of memory banks, and a first refresh management circuit; and a second memory device including a third plurality of memory banks, a fourth plurality of memory banks, and a second refresh management circuit, wherein the first refresh management circuit is configured to manage a number of times refresh is performed for the first and third plurality of memory banks, and the second refresh management circuit is configured to manage a number of times refresh is performed for the second and fourth plurality of memory bank.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:記憶體裝置</p>
        <p type="p">1100:第一記憶體裝置</p>
        <p type="p">1200:第二記憶體裝置</p>
        <p type="p">1300:第三記憶體裝置</p>
        <p type="p">1400:第四記憶體裝置</p>
        <p type="p">2000:主機裝置</p>
        <p type="p">2100:命令發出電路</p>
        <p type="p">2200:再新排程電路</p>
        <p type="p">ADDR:位址</p>
        <p type="p">BNK1_D1,BNK1_D2,BNK1_D3,BNK1_D4,BNK2_D1,BNK2_D2,BNK2_D3,BNK2_D4,BNK64_D1,BNK64_D2,BNK64_D3,BNK64_D4:記憶體排組</p>
        <p type="p">CA:命令/位址信號</p>
        <p type="p">CMD:命令</p>
        <p type="p">DQa:第一複數個資料接腳</p>
        <p type="p">DQb:第二複數個資料接腳</p>
        <p type="p">DQc:第三複數個資料接腳</p>
        <p type="p">DQd:第四複數個資料接腳</p>
        <p type="p">MS:記憶體系統</p>
        <p type="p">RCD:暫存器時脈驅動器</p>
        <p type="p">SBNKa:第一子排組</p>
        <p type="p">SBNKb:第二子排組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2339" publication-number="202617663">
    <tif-files tif-type="multi-tif">
      <tif file="114138627.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617663</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法、化合物、化合物的製造方法及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C67/14</main-classification>
        <further-classification edition="200601120260202B">C07C67/347</further-classification>
        <further-classification edition="200601120260202B">C07C69/73</further-classification>
        <further-classification edition="200601120260202B">C07C69/732</further-classification>
        <further-classification edition="200601120260202B">C07C69/734</further-classification>
        <further-classification edition="200601120260202B">C07C231/12</further-classification>
        <further-classification edition="200601120260202B">C07C233/47</further-classification>
        <further-classification edition="200601120260202B">C07C253/30</further-classification>
        <further-classification edition="200601120260202B">C07C255/38</further-classification>
        <further-classification edition="200601120260202B">C07D207/34</further-classification>
        <further-classification edition="200601120260202B">C07D307/33</further-classification>
        <further-classification edition="200601120260202B">C07D307/56</further-classification>
        <further-classification edition="200601120260202B">C07D333/28</further-classification>
        <further-classification edition="200601120260202B">C08F220/10</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/039</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
        <further-classification edition="200601120260202B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, SHOUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口拓弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織克聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於圖案形成時可以與先前同等以上的水準發揮感度、LWR及顯影缺陷抑制性的感放射線性組成物等。一種感放射線性組成物，含有：聚合物，包含下述式（1）所表示的結構單元（I）；及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="338px" width="324px" file="ed10070.JPG" alt="ed10070.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（R&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;2&lt;/sup&gt;及Ar滿足下述（A1）或（A2）：（A1）R&lt;sup&gt;1&lt;/sup&gt;為氫原子、鹵素原子或碳數1～20的一價有機基，L&lt;sup&gt;2&lt;/sup&gt;為單鍵或二價連結基，Ar為具有碘基的經取代或未經取代的一價芳香環基；或（A2）R&lt;sup&gt;1&lt;/sup&gt;與Ar相互結合並形成二價脂環基，該脂環基與Ar所表示的具有碘基的二價芳香環基形成縮合環；R&lt;sup&gt;4&lt;/sup&gt;為氰基、硝基、&lt;sup&gt;*&lt;/sup&gt;-CO-R&lt;sup&gt;41&lt;/sup&gt;或包含-CO-作為環構成結構的環式基；R&lt;sup&gt;41&lt;/sup&gt;為一價有機基；其中，於R&lt;sup&gt;4&lt;/sup&gt;為氰基、硝基或&lt;sup&gt;*&lt;/sup&gt;-CO-R&lt;sup&gt;41&lt;/sup&gt;的情況下，n為1以上）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2340" publication-number="202619544">
    <tif-files tif-type="multi-tif">
      <tif file="114138650.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶粒及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DIE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251110B">H10D62/10</main-classification>
        <further-classification edition="202501120251110B">H10D88/00</further-classification>
        <further-classification edition="200601120251110B">H01L21/76</further-classification>
        <further-classification edition="200601120251110B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力智電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPI SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淞丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛光博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, KUANG-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體晶粒及其製造方法。半導體晶粒的製造方法包括以下步驟。在基底上形成半導體堆疊結構，其中基底包括晶粒區及劃片區，劃片區位於相鄰的晶粒區之間。在半導體堆疊結構之上形成介電層。在劃片區中移除部分介電層及部分半導體堆疊結構，以形成第一溝槽、第二溝槽及第三溝槽，其中第二溝槽位於第一溝槽與第三溝槽之間，第一溝槽、第二溝槽及第三溝槽分別暴露出基底。在第二溝槽中執行鋸切製程，以切割基底，而使相鄰的晶粒區分開，以形成多個半導體晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor die and a manufacturing method thereof are provided. The manufacturing method of the semiconductor die includes following steps. A semiconductor stack structure is formed on a substrate. The substrate includes die regions and a scribe line region. The scribe line region is located between the adjacent die regions. A dielectric layer is formed over the semiconductor stack structure. A portion of the dielectric layer and a portion of the semiconductor stack structure in the scribe line region are removed to form a first trench, a second trench and a third trench. The second trench is located between the first trench and the third trench. The first trench, the second trench and the third trench expose the substrate respectively. A cutting process is performed in the second trench to cut the substrate and separate the die regions to form multiple semiconductor dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體晶粒</p>
        <p type="p">102:元件區</p>
        <p type="p">104:周邊區</p>
        <p type="p">110:基底</p>
        <p type="p">120:半導體堆疊結構</p>
        <p type="p">122:第一半導體層</p>
        <p type="p">124:第二半導體層</p>
        <p type="p">126:暗裂</p>
        <p type="p">130:介電層</p>
        <p type="p">140:電晶體</p>
        <p type="p">142:閘極</p>
        <p type="p">144:源極</p>
        <p type="p">146:汲極</p>
        <p type="p">148:p型半導體結構</p>
        <p type="p">150:保護結構</p>
        <p type="p">152:第一保護結構</p>
        <p type="p">154:第二保護結構</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">S1:第一面</p>
        <p type="p">S2:第二面</p>
        <p type="p">S3:頂面</p>
        <p type="p">T1:第一溝槽</p>
        <p type="p">T2:第二溝槽</p>
        <p type="p">T3:第三溝槽</p>
        <p type="p">TC:切割溝槽</p>
        <p type="p">TP:保護溝槽</p>
        <p type="p">θ’:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2341" publication-number="202618127">
    <tif-files tif-type="multi-tif">
      <tif file="114138711.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138711</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧風力發電系統及其發電方法</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE WIND POWER GENERATION SYSTEM AND ITS POWER GENERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260131B">F03D9/25</main-classification>
        <further-classification edition="200601120260131B">H02M5/40</further-classification>
        <further-classification edition="200601120260131B">H02P9/04</further-classification>
        <further-classification edition="200601120260131B">F03D7/04</further-classification>
        <further-classification edition="201901120260131B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳聖圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SUNG GU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳聖圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SUNG GU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種人工智慧風力發電系統及其發電方法，包括：人工風結構體，形成有風壓移動之移動空間；生成電動機，佈置於該人工風結構體之移動空間中供空氣壓力流入之入口，以生成人工風；葉片旋轉軸，佈置於該人工風結構體之移動空間中，並結合有藉由移動之風壓形成旋轉壓力之發電葉片；發電機，連接該葉片旋轉軸，並接收旋轉力以形成電能；數位控制器，於該移動空間中控制該生成電動機之驅動，以維持風壓，使相對於該發電機依每秒頻率60 Hz形成電源；以及循環變頻器，電連接於該發電機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:風力發電系統</p>
        <p type="p">2:葉片旋轉軸</p>
        <p type="p">3:旋轉軸襯套或軸承</p>
        <p type="p">4:發電機</p>
        <p type="p">5:生成電動機</p>
        <p type="p">21:發電葉片</p>
        <p type="p">100:人工風結構體</p>
        <p type="p">200:誘導單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2342" publication-number="202617473">
    <tif-files tif-type="multi-tif">
      <tif file="114138732.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童座椅配件</chinese-title>
        <english-title>CHILD SEAT ACCESSORIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">B60N2/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊德Ｓ　哈姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLYDE S, HARMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊夫　馬爾姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIF, MALM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大衛Ａ　雷曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVID A, LEHMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯斯Ｌ　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUCE L, WILLIAMS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德魯Ｊ　霍斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREW J, HORST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M., HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兒童座椅系統包括具有一座椅殼體之一兒童座椅，該座椅殼體包括一座椅底部及可以一角度自該座椅底部延伸之一座椅靠背。紡織品為可定位成與該座椅殼體重疊配置之紡織品。一套帶總成包括一胯部分。一第一磁性組件經安裝至該胯部分，且一第二磁性組件經安裝至該座椅殼體及該等紡織品中之至少一者。該第一磁性組件可與該第二磁性組件接合以收起該胯部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A child seat system includes a child seat having a seat shell including a seat bottom and a seat back extendable from the seat bottom at an angle. Soft goods are soft goods positionable in overlapping arrangement with the seat shell. A harness assembly includes a crotch portion. A first magnetic component is mounted to the crotch portion and a second magnetic component is mounted to at least one of the seat shell and the soft goods. The first magnetic component is engageable with the second magnetic component to stow the crotch portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:胯帶</p>
        <p type="p">105:胯部分</p>
        <p type="p">120:第一磁性組件</p>
        <p type="p">122:第二磁性組件</p>
        <p type="p">124:紡織品</p>
        <p type="p">126:紡織品之上部表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2343" publication-number="202619158">
    <tif-files tif-type="multi-tif">
      <tif file="114138740.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊裝置</chinese-title>
        <english-title>COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01Q1/24</main-classification>
        <further-classification edition="200601120251103B">H01Q1/36</further-classification>
        <further-classification edition="200601120251103B">H04M1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳兆育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐仲淼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石明生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, MING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉王鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, WANG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊裝置，包括一裝置外殼、一功能鈕、一第一天線模組及一第二天線模組。裝置外殼具有相對的一前表面及一後表面，且具有從前表面貫穿至後表面的一貫孔。功能鈕配置於貫孔內，其中在貫孔的軸向上，功能鈕的寬度小於貫孔的深度。第一天線模組配置於裝置外殼且位於貫孔的一側。第二天線模組配置於裝置外殼且位於貫孔的另一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication device includes a device housing, a function button, a first antenna module, and a second antenna module. The device housing has a front surface and a rear surface facing each other, and has a through hole extending from the front surface to the rear surface. The function button is disposed within the through hole, wherein in an axial direction of the through hole, a width of the function button is less than a depth of the through hole. The first antenna module is disposed within the device housing and located on one side of the through hole. The second antenna module is disposed within the device housing and located on another side of the through hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通訊裝置</p>
        <p type="p">110:裝置外殼</p>
        <p type="p">110a:前表面</p>
        <p type="p">110b:後表面</p>
        <p type="p">110d、110e:側壁</p>
        <p type="p">110f:頂壁</p>
        <p type="p">110g:底壁</p>
        <p type="p">112:殼體</p>
        <p type="p">1121:中空凸台</p>
        <p type="p">114:蓋體</p>
        <p type="p">1141:鎖附件</p>
        <p type="p">114a:開口</p>
        <p type="p">116:密封環</p>
        <p type="p">118:發光元件</p>
        <p type="p">119:太陽能面板</p>
        <p type="p">130:功能鈕</p>
        <p type="p">140:第一天線模組</p>
        <p type="p">150:第二天線模組</p>
        <p type="p">160:運算電路板</p>
        <p type="p">180:彈性保護層</p>
        <p type="p">S:容納空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2344" publication-number="202618548">
    <tif-files tif-type="multi-tif">
      <tif file="114138764.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>置換前綴指令</chinese-title>
        <english-title>PERMUTE PREFIX INSTRUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251203B">G06F9/30</main-classification>
        <further-classification edition="200601120251203B">G06F9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁尼茲維森特　亞歷杭德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINEZ VICENTE, ALEJANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂德　喬治大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEED, GEORGE DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含指令解碼電路系統及處理電路系統。回應於指定至少一個置換源向量暫存器及一目的地向量暫存器的一置換前綴指令，該指令解碼電路系統經組態以產生一微運算以控制該處理電路系統執行至少一個置換運算，以對該至少一個置換源向量暫存器指定的至少一個置換源向量運算元的向量元素進行置換，以產生對應於該目的地向量暫存器的一置換向量運算元。該置換前綴指令具有提供一指令融合提示的一編碼，該指令融合提示向該指令解碼電路系統指示該置換前綴指令之後的程式順序中的一下一指令預期係一向量處理指令，該向量處理指令指定該置換前綴指令的該目的地向量暫存器作為用於定義待對其應用一向量處理運算的一源向量運算元的一源向量暫存器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises instruction decoding circuitry and processing circuitry. In response to a permute prefix instruction specifying at least one permute source vector register and a destination vector register, the instruction decoding circuitry is configured to generate a micro-operation to control the processing circuitry to perform at least a permute operation to permute vector elements of at least one permute source vector operand specified by the at least one permute source vector register to generate a permuted vector operand corresponding to the destination vector register. The permute prefix instruction has an encoding providing an instruction fusion hint indicating to the instruction decoding circuitry that a next instruction in program order after the permute prefix instruction is expected to be a vector processing instruction specifying, as a source vector register for defining a source vector operand to which a vector processing operation is to be applied, the destination vector register of the permute prefix instruction.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2345" publication-number="202619394">
    <tif-files tif-type="multi-tif">
      <tif file="114138781.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行動通訊中優化的邏輯通道優先處理之方法及裝置</chinese-title>
        <english-title>METHODS AND APPARATUSES FOR ENHANCED LOGICAL CHANNEL PRIORITIZATION IN MOBILE COMMUNICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251103B">H04W72/12</main-classification>
        <further-classification edition="202301120251103B">H04W72/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李衍毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出行動通訊中優化的（enhanced）邏輯通道優先處理（Logical Channel Prioritization，LCP）的方案。適用之裝置（如：使用者設備(User Equipment，UE)）可選擇用於上行（uplink，UL）授權之複數個邏輯通道。然後，所述裝置將該上行授權之資源分配給該複數邏輯通道中之一或多個邏輯通道，該一或多個邏輯通道中之至少一邏輯通道承載具備一第一剩餘時間之一第一資料與具備一第二剩餘時間之一第二資料，該第一剩餘時間係與一第一封包資料匯聚協定（Packet Data Convergence Protocol，PDCP）丟棄計時器相關聯且小於一門檻值，而該第二剩餘時間係與一第二PDCP丟棄計時器相關聯且大於或等於該門檻值，且於該上行授權之資源分配過程中，該第一資料之優先順序高於該第二資料。接著，所述裝置根據該上行授權之資源分配，執行到該網路節點之一新傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various solutions for enhanced logical channel prioritization (LCP) in mobile communications are described. An apparatus may select a plurality of logical channels for an uplink (UL) grant, and allocate resources of the UL grant to one or more of the logical channels. At least one of the one or more of the logical channels carries first data with a first remaining time of a first associated packet data convergence protocol (PDCP) discard timer less than a threshold and carries second data with a second remaining time of a second associated PDCP discard timer greater than or equal to the threshold. In particular, the first data is prioritized over the second data during the allocation of the resources of the UL grant. Then, the apparatus may perform a new transmission to a network node based on the allocation of the resources of the UL grant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:程序</p>
        <p type="p">610~630:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2346" publication-number="202619177">
    <tif-files tif-type="multi-tif">
      <tif file="114138783.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138783</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及連接器對</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01R13/05</main-classification>
        <further-classification edition="201101120260130B">H01R13/6471</further-classification>
        <further-classification edition="201101120260130B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野公保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, KIMIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松下英廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA, HIDEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">問題：提供連接器，其能穩定地維持端子的接觸狀態，適合用於高速信號傳輸，能夠用於多極化，具有簡單的構造，成本低，便於對接作業，小型低高度，且可靠性高。解決手段：連接器具有與對應連接器的對應端子連接的端子，所述端子包括：本體部；基板連接部，其連接於所述本體部的一端；以及接觸部，其連接於所述本體部的另一端，所述接觸部包括第一接觸部和第二接觸部，所述第二接觸部包括與所述對應端子接觸的自由端，以及所述第一接觸部與所述對應端子的自由端接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連接器</p>
        <p type="p">11:連接器殼體</p>
        <p type="p">11a:長邊部</p>
        <p type="p">11b:短邊部</p>
        <p type="p">11c:對接面</p>
        <p type="p">12:凹部</p>
        <p type="p">12a:溝部</p>
        <p type="p">13:凸條部</p>
        <p type="p">14:側壁部</p>
        <p type="p">14a:高壁部</p>
        <p type="p">14b:低壁部</p>
        <p type="p">14c:缺口部</p>
        <p type="p">14d:突壁部</p>
        <p type="p">60:端子單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2347" publication-number="202619604">
    <tif-files tif-type="multi-tif">
      <tif file="114138802.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合的光子半導體裝置系統以及方法</chinese-title>
        <english-title>INTEGRATED PHOTONIC SEMICONDUCTOR DEVICE SYSTEMS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260124B">H10H29/10</main-classification>
        <further-classification edition="200601120260124B">G02B6/12</further-classification>
        <further-classification edition="202301120260124B">H01L25/16</further-classification>
        <further-classification edition="200601120260124B">G02B6/42</further-classification>
        <further-classification edition="202501120260124B">H10H20/825</further-classification>
        <further-classification edition="200601120260124B">G02B6/13</further-classification>
        <further-classification edition="200601120260124B">G06N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商新矽私人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEW SILICON CORPORATION PTE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊普科夫斯基　丹尼爾萊昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEPKOWSKI, DANIEL LEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　永堅Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KENNETH ENG KIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　安德魯英圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, ANDREW YOUNGKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲茲拉德二世　尤金Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITZGERALD JR., EUGENE A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛　靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭示，提供一種整合的光電子裝置。該裝置包含：第一層，包含一或多個光學發射器，該等光學發射器經配置為發射可見波長光；第二層，包含互補金屬氧化物半導體(CMOS)裝置，其中該第二層與該第一層堆疊以在單一基板上形成單片式結構；至少一個光偵測器，形成於該第一層或該第二層中且經配置為偵測可見波長光；至少一個波導結構，形成於該第一層或該第二層中的至少一者內，該至少一個波導結構經配置為實質上跨該裝置或在該裝置內傳輸光學信號；至少一個CMOS傳輸電路，形成於該第二層中且電性連接至該至少一個光學發射器；至少一個CMOS接收電路，形成於該第二層中且電性連接至該至少一個光偵測器；以及複數個平面金屬互連件，可配置以提供該CMOS傳輸電路、該CMOS接收電路、該光偵測器及/或該光學發射器中的一或多者之間的電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In accordance with the present disclosure, an integrated optoelectronic device is provided. The device comprises a first layer comprising one or more optical emitters, the optical emitters configured to emit visible wavelength light, a second layer comprising complementary metal-oxide-semiconductor (CMOS) devices, wherein the second layer is stacked with the first layer to form a monolithic structure on a single substrate, at least one photodetector formed in either the first layer or the second layer and configured to detect visible wavelength light, at least one waveguide structure formed within at least one of the first layer or the second layer, the at least one waveguide structure configured to transmit optical signals substantially across or within the device, at least one CMOS transmit circuit formed in the second layer and electrically connected to the at least one optical emitter, at least one CMOS receive circuit formed in the second layer and electrically connected to the at least one photodetector, and a plurality of planar metallic interconnects configurable to provide electrical connectivity between one or more of the CMOS transmit circuit, the CMOS receive circuit, the photodetector, and/or the optical emitter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600d:示例性實施例</p>
        <p type="p">610d:光學發射器</p>
        <p type="p">612d:光學發射器</p>
        <p type="p">620d:光偵測器</p>
        <p type="p">622d:光偵測器</p>
        <p type="p">630d:耦合器</p>
        <p type="p">632d:耦合器</p>
        <p type="p">634d:光學波導</p>
        <p type="p">636d:耦合器</p>
        <p type="p">638d:耦合器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2348" publication-number="202619130">
    <tif-files tif-type="multi-tif">
      <tif file="114138862.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微裝置匣結構</chinese-title>
        <english-title>MICRODEVICE CARTRIDGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01L25/00</main-classification>
        <further-classification edition="202501120260202B">H10H20/00</further-classification>
        <further-classification edition="202501120260202B">H10H29/10</further-classification>
        <further-classification edition="202501120260202B">H10H20/857</further-classification>
        <further-classification edition="201701120260202B">H01L21/77</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法西　伊莎諾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FATHI, EHSANOLLAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈維爾聶尼　布拉奈夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAVIRNENI, PRANAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞德吉瑪奇　巴哈瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADEGHIMAKKI, BAHAREH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾拉亞希　維索　瑪迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALAYASHI, WISSAL MAHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示將微裝置整合至系統基板中之結構及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">What is disclosed structures and methods of integrating micro devices into system substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">108:平坦化層</p>
        <p type="p">110:中間基板</p>
        <p type="p">112:接合層</p>
        <p type="p">206:緩衝層</p>
        <p type="p">220:襯墊</p>
        <p type="p">222:襯墊</p>
        <p type="p">230:背板</p>
        <p type="p">240:微裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2349" publication-number="202618072">
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      <tif file="114138877.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618072</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電鍍設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">C25D7/12</main-classification>
        <further-classification edition="200601120251023B">C25D17/00</further-classification>
        <further-classification edition="200601120251023B">C25D19/00</further-classification>
        <further-classification edition="200601120251023B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宏超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HONGCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刁建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIAO, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖炎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈照偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, ZHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請的實施例提供了一種電鍍設備，包括電鍍槽、夾持件和升降機構，電鍍槽用於容納電鍍液。夾持件設置在電鍍槽上方，用於水平夾持基板；升降機構與夾持件相連接，用於帶動夾持件升降以升降基板；升降機構包括橫梁和兩組升降組件，橫梁與夾持件相連接，兩組升降組件分別與橫梁的兩端鉸接。本申請的電鍍設備能夠對大尺寸的基板進行電鍍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:夾持件</p>
        <p type="p">2:電鍍槽</p>
        <p type="p">3:升降機構</p>
        <p type="p">31:橫梁</p>
        <p type="p">32:升降組件</p>
        <p type="p">321:升降電機</p>
        <p type="p">322:連杆</p>
        <p type="p">323:連接塊</p>
        <p type="p">4:第一鉸接結構</p>
        <p type="p">5:第二鉸接結構</p>
        <p type="p">6:位置傳感器</p>
        <p type="p">7:漿葉板</p>
        <p type="p">71:驅動電機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2350" publication-number="202617960">
    <tif-files tif-type="multi-tif">
      <tif file="114138892.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於從含金屬抗蝕劑移除邊緣珠粒的組合物、含金屬抗蝕劑的顯影劑組合物、以及使用所述組合物形成圖案的方法</chinese-title>
        <english-title>COMPOSITION FOR REMOVING EDGE BEADS FROM METAL-CONTAINING RESISTS, DEVELOPER COMPOSITION OF METAL-CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C11D7/26</main-classification>
        <further-classification edition="200601120260202B">C11D7/32</further-classification>
        <further-classification edition="200601120260202B">C11D7/50</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛羅莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, ROSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文炯朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, HYUNGRANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金兌鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴時均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SI-KYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭澤秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAK, TAEKSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴慶熏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GYEONGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種用以從含金屬抗蝕劑移除邊緣珠粒的組合物或一種含金屬抗蝕劑的顯影劑組合物、以及一種利用所述組合物或所述顯影劑組合物來形成或提供圖案的方法。用以從含金屬抗蝕劑移除邊緣珠粒的所述組合物或含金屬抗蝕劑的所述顯影劑組合物可包含：環狀化合物，在環中包括至少一個選自N、O和S的雜原子和至少兩個羰基；以及溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition to remove edge beads from a metal-containing resist or a developer composition of a metal-containing resist and a method of forming or providing patterns utilizing the composition or the developer composition are disclosed. The composition to remove edge beads from the metal-containing resist or the developer composition of the metal-containing resist may include a cyclic compound including at least one heteroatom selected from among N, O, and S in a ring and at least two carbonyl groups; and a solvent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:襯底</p>
        <p type="p">110P:特徵圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2351" publication-number="202617821">
    <tif-files tif-type="multi-tif">
      <tif file="114138893.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138893</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻下層膜形成用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G59/20</main-classification>
        <further-classification edition="200601120260202B">C08G59/62</further-classification>
        <further-classification edition="200601120260202B">C08G59/66</further-classification>
        <further-classification edition="200601120260202B">C08G59/68</further-classification>
        <further-classification edition="200601120260202B">G03F7/11</further-classification>
        <further-classification edition="200601120260202B">G03F7/16</further-classification>
        <further-classification edition="200601120260202B">G03F7/40</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下和彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田登喜雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHITA, TOKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤勇樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種光阻下層膜形成用組成物，其係可形成對於半導體用濕蝕刻液具有優異耐性的保護膜，且可滿足以下所有特性：良好的塗布性及短時間內的膜硬化性、良好的保存穩定性。  &lt;br/&gt;本發明之光阻下層膜形成用組成物係含有：  &lt;br/&gt;（A）具有以由下述式（I）表示之環狀醚結構所示之反應基之化合物或聚合物；  &lt;br/&gt;（B）具有對於前述（A）中之反應基具反應性之反應基之化合物或聚合物；  &lt;br/&gt;（C）由下述式（II-1）、下述式（II-2）、或下述式（II-3）表示之離子性硬化觸媒；及  &lt;br/&gt;（D）溶劑。  &lt;br/&gt;&lt;img align="absmiddle" height="117px" width="379px" file="ed10058.JPG" alt="ed10058.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或&lt;img align="absmiddle" height="114px" width="234px" file="ed10059.JPG" alt="ed10059.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="371px" width="619px" file="ed10060.JPG" alt="ed10060.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2352" publication-number="202617741">
    <tif-files tif-type="multi-tif">
      <tif file="114138908.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138908</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體光刻膠組成物及使用組成物形成圖案方法</chinese-title>
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251210B">C07F7/22</main-classification>
        <further-classification edition="200601120251210B">C07C49/14</further-classification>
        <further-classification edition="200601120251210B">C07C215/36</further-classification>
        <further-classification edition="200601120251210B">G03F7/004</further-classification>
        <further-classification edition="200601120251210B">C09K13/00</further-classification>
        <further-classification edition="200601120251210B">C08F220/20</further-classification>
        <further-classification edition="200601120251210B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旻映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜恩美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, EUNMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昇淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SEONGYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹厚淨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HUJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐也隱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YAEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體光刻膠組成物和使用半導體光刻膠組成物形成圖案的方法。半導體光刻膠組成物包括有機金屬化合物；二酮化合物；包括兩個或更多羥基的醇；以及溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition are provided. The semiconductor photoresist composition includes an organometallic compound; a diketone compound; an alcohol including two or more hydroxyl groups; and a solvent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">108:圖案</p>
        <p type="p">112:有機薄膜圖案</p>
        <p type="p">114:薄膜圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2353" publication-number="202617291">
    <tif-files tif-type="multi-tif">
      <tif file="114138914.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔裝置及真空處理裝置</chinese-title>
        <english-title>CLEANING DEVICE AND VACUUM TREATMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">B08B15/04</main-classification>
        <further-classification edition="200601120251110B">B08B13/00</further-classification>
        <further-classification edition="200601120251110B">B08B9/027</further-classification>
        <further-classification edition="200601120251110B">H05H1/24</further-classification>
        <further-classification edition="200601120251110B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIBA STEC, CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊義雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔裝置，捕集所導入的對象氣體中的除去對象物並利用電漿進行分解，所述清潔裝置包括：框體，呈筒狀，且在沿著其軸向的一端側與另一端側分別形成有氣體導入口與氣體導出口；捕集板，設置於所述框體內，形成將自所述氣體導入口導入的所述對象氣體引導至所述氣體導出口的流路，並且捕集在所述流路中流動的所述除去對象物；以及電漿生成部，生成所述電漿，所述電漿生成部經由形成於所述框體的側壁的電漿導入口，將所生成的所述電漿導入至所述流路內、或在所述流路內生成所述電漿，所述捕集板為沿著所述軸向的螺旋形狀，所述電漿導入口沿著由所述捕集板形成的螺旋狀的所述流路形成有多個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a cleaning device that captures substances to be removed in an introduced target gas and decomposes the same using plasma, including: a cylindrical housing with a gas inlet and a gas outlet formed at one end and the other end along an axial direction thereof; a collection plate installed within the housing, which forms a flow path that guides the target gas introduced from the gas inlet to the gas outlet and captures the substances to be removed flowing through the flow path; and a plasma generation unit that generates the plasma. The plasma generation unit introduces the plasma generated into the flow path through a plasma inlet formed in a side wall of the housing, or generates the plasma within the flow path, and the collection plate has a spiral shape along the axial direction, and multiple plasma inlets are formed along the spiral flow path formed by the collection plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:框體</p>
        <p type="p">2:捕集板</p>
        <p type="p">3:電漿生成部</p>
        <p type="p">11:主體部</p>
        <p type="p">12:頂板</p>
        <p type="p">13:底板</p>
        <p type="p">14:支撐柱</p>
        <p type="p">100:清潔裝置</p>
        <p type="p">A:流路</p>
        <p type="p">G1:氣體導入口</p>
        <p type="p">G2:氣體導出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2354" publication-number="202618152">
    <tif-files tif-type="multi-tif">
      <tif file="114138936.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧波減速器、機械臂和清潔設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">F16H49/00</main-classification>
        <further-classification edition="200601120251124B">F16H1/32</further-classification>
        <further-classification edition="200601120251124B">F16H55/06</further-classification>
        <further-classification edition="200601120251124B">F16H55/08</further-classification>
        <further-classification edition="201201120251124B">F16H57/021</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段傳林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, CHUANLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成盼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦運根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, YUNGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種諧波減速器、機械臂和清潔設備。諧波減速器包括了剛輪、柔輪和輸出部，在諧波減速器工作過程中，輸出部可以連接於柔輪或剛輪中的一者，進行動力的輸出。該諧波減速器的剛輪包括了環部，而柔輪嚙合於環部，且剛輪通過注塑製程製成，基於此通過注塑製程製備環部，能夠降低剛輪的生產成本，降低剛輪的重量，進而降低諧波減速器的成本和重量，利於諧波減速器的推廣使用，尤其是便於將諧波減速器應用在可移動的智能家電上，在能夠保障傳動效果的同時，使得智能家電的移動能夠更加靈活。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:剛輪</p>
        <p type="p">111:環部</p>
        <p type="p">112:插接部</p>
        <p type="p">114:座體</p>
        <p type="p">116:限位件</p>
        <p type="p">120:柔輪</p>
        <p type="p">121:齒段</p>
        <p type="p">123:固定部</p>
        <p type="p">131:輸出盤</p>
        <p type="p">140:外連部</p>
        <p type="p">141:殼體</p>
        <p type="p">142:第一軸承</p>
        <p type="p">150:蓋板</p>
        <p type="p">160:波發生器</p>
        <p type="p">161:凸輪</p>
        <p type="p">162:第二軸承</p>
        <p type="p">170:輸入部</p>
        <p type="p">180:第三軸承</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2355" publication-number="202617252">
    <tif-files tif-type="multi-tif">
      <tif file="114138993.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氟化化合物之蓄熱式熱氧化</chinese-title>
        <english-title>REGENERATIVE THERMAL OXIDATION OF FLUORINATED COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">B01D53/70</main-classification>
        <further-classification edition="200601120260131B">F23G7/06</further-classification>
        <further-classification edition="200601120260131B">C04B35/10</further-classification>
        <further-classification edition="200601120260131B">F23L15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾奇　肯尼斯　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELCH, KENNETH PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施克林　傑伊　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHICKLING, JAY SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種蓄熱式熱氧化器(regenerative thermal oxidizer, RTOx)，其可銷毀饋料氣體中之氟化化合物。該RTOx包括燃燒室、燃燒器、及熱量回收填充床。該燃燒器耦接至該燃燒室。該燃燒器係經組態以接收該饋料氣體、燃料氣體、及氧化氣體。該燃料氣體包括甲烷。該氧化氣體包括氧。該燃燒器係經組態以在該氧化氣體之存在下燃燒該饋料氣體及該燃料氣體以產生熱量及包括含氟化物副產物的排氣氣體。該熱量回收填充床係設置在該燃燒室內。該熱量回收填充床係由包括氧化鋁的陶瓷材料製成，該熱量回收填充床經組態以吸收藉由燃燒該饋料氣體及該燃料氣體所產生的該熱量的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A regenerative thermal oxidizer (RTOx) can destroy fluorinated compounds in a feed gas. The RTOx includes a combustion chamber, a burner, and a heat recovery packing bed. The burner is coupled to the combustion chamber. The burner is configured to receive the feed gas, a fuel gas, and an oxidizing gas. The fuel gas includes methane. The oxidizing gas includes oxygen. The burner is configured to combust the feed gas and the fuel gas in the presence of the oxidizing gas to produce heat an exhaust gas that includes a fluoride-containing byproduct. The heat recovery packing bed is disposed within the combustion chamber. The heat recovery packing bed is made of a ceramic material that includes aluminum oxide that is configured to absorb at least a portion of the heat produced by the combustion of the feed gas and the fuel gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:RTOx，蓄熱式熱氧化器</p>
        <p type="p">101:饋料氣體</p>
        <p type="p">102:燃燒室</p>
        <p type="p">103:燃料氣體</p>
        <p type="p">104:燃燒器</p>
        <p type="p">105:氧化氣體</p>
        <p type="p">106:熱量回收填充床</p>
        <p type="p">107:排氣氣體</p>
        <p type="p">108:隔熱材料</p>
        <p type="p">109:第二饋料氣體</p>
        <p type="p">111:第三饋料氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2356" publication-number="202617316">
    <tif-files tif-type="multi-tif">
      <tif file="114139010.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射壓焊工序中的晶片變形控制方法</chinese-title>
        <english-title>CHIP WARPAGE CONTROL METHOD IN LASER COMPRESSION BONDING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">B23K26/21</main-classification>
        <further-classification edition="201401120260102B">B23K26/70</further-classification>
        <further-classification edition="200601120260102B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬來西亞商正齊科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MI EQUIPMENT (M) SDN. BHD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙哲柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHEOL JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李聖翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNG HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李亨株</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYEONG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明通過焊接框架（10）吸附半導體晶片（C）並在半導體晶片（C）底部面凸塊塗敷助焊劑，且在整列與基板（P）的位置之後將其放置在基板（P）上並施加壓力，從設置在所述焊接框架（10）的上部的雷射發生器（20）照射雷射光束（L）以將半導體晶片（C）焊接在基板（P），以在雷射壓焊工序中，通過吸附式焊接框架拾取半導體晶片，在助焊劑浸漬、位置整列或焊接過程中通過雷射進行預熱來將處於變形狀態的半導體晶片最大程度展開成平坦狀態，由此可以維持確切地拾取狀態來將助焊劑的塗敷不良、整列不良及焊接不良等問題的發生最小化，本發明包括如下步驟，所述雷射發生器（20）通過規定的溫度進行預熱，以便焊接框架（10）吸附半導體晶片（C）的狀態下使得半導體晶片（C）復原到原來的平坦狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a laser compression bonding process which adsorbs a semiconductor chip (C) with a bonding tool (10) to apply a flux to a bump on the bottom surface of the semiconductor chip (C) in order to minimize the occurrence of problems such as flux application defect, alignment failure, bonding failure, etc. by unfolding the semiconductor chip transformed by preheating with a laser as flat as possible in a process of flux dipping or position alignment or bonding by picking up the semiconductor chip with an adsorption type bonding tool in a laser compression bonding process, and which bonds the semiconductor chip (C) to a substrate (P) by irradiating a laser beam (L) from a laser generator (20) installed in the upper part of the bonding tool (10) while placing and pressing the semiconductor chip on the substrate P after aligning the position with the substrate (P), wherein the laser generator (20) preheats the semiconductor chip (C) at a predetermined temperature in order to restore the semiconductor chip (C) to an original flat state while the bonding tool (10) adsorbs the semiconductor chip (C).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:焊接框架</p>
        <p type="p">20:雷射發生器</p>
        <p type="p">C:半導體晶片</p>
        <p type="p">L:雷射(束)</p>
        <p type="p">Z1:拾取區域</p>
        <p type="p">Z2:助焊劑浸漬區域</p>
        <p type="p">Z3:位置整列區域</p>
        <p type="p">Z4:焊接區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2357" publication-number="202618461">
    <tif-files tif-type="multi-tif">
      <tif file="114139015.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微影系統及物品製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/20</main-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八重樫憲司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAEGASHI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">微影系統，具備：成形裝置，其具有對模具進行保持的模具保持部，使用前述模具使基板上的組成物成形；以及搬送部，其將被施予有脫模劑的前述模具搬送至前述模具保持部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:模具</p>
        <p type="p">10:介面模組</p>
        <p type="p">20:前後處理模組</p>
        <p type="p">30:儲料倉(保管部)</p>
        <p type="p">31:檢測部</p>
        <p type="p">32:遮蓋機構</p>
        <p type="p">40:搬送部</p>
        <p type="p">41,42,43,44:搬送機器人(搬送手)</p>
        <p type="p">45:中繼部</p>
        <p type="p">50:供應裝置</p>
        <p type="p">51:載台</p>
        <p type="p">52:液滴吐出部</p>
        <p type="p">60a,60b,60c,60d:成形裝置</p>
        <p type="p">61:基板保持部</p>
        <p type="p">62:模具保持部</p>
        <p type="p">70:控制部</p>
        <p type="p">100:微影系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2358" publication-number="202618488">
    <tif-files tif-type="multi-tif">
      <tif file="114139034.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設備點檢系統、設備點檢裝置、設備點檢方法、以及設備點檢程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">G05B23/02</main-classification>
        <further-classification edition="200601120260124B">B25J9/16</further-classification>
        <further-classification edition="200601120260124B">G05B19/418</further-classification>
        <further-classification edition="202301120260124B">G06Q10/20</further-classification>
        <further-classification edition="201201120260124B">G06Q50/04</further-classification>
        <further-classification edition="201901120260124B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>掛野真弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKENO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山地雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAJI, YUDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安部雅哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 本揭露之目的是透過判定各個點檢位置是否需要設備控制，將設備控制到可點檢的狀態，而無需對設備施加不必要的控制。  &lt;br/&gt;[解決方案] 設備點檢系統(500)，使用機器人(200)來點檢設備(300)。設備點檢系統(500)，包括設備狀態控制部(120)。設備狀態控制部(120)，取得要使用機器人(200)進行點檢的點檢位置。對於各個點檢位置(511)，設備狀態控制部(120)，基於點檢位置(511)的狀態，判定是否需要設備控制亦即對設備(300)的控制），以便在點檢位置(511)進行點檢。當設備狀態控制部(120)，判定需要設備控制，則設備狀態控制部(120)將用於執行設備控制的控制資料(60)傳送至設備(300)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">51:點檢位置資訊</p>
        <p type="p">52:設備資料</p>
        <p type="p">53:點檢資料</p>
        <p type="p">60:控制資料</p>
        <p type="p">100:設備點檢裝置</p>
        <p type="p">110:設備資料收集部</p>
        <p type="p">120:設備狀態控制部</p>
        <p type="p">200:機器人</p>
        <p type="p">210:自身位置估計部</p>
        <p type="p">220:移動控制部</p>
        <p type="p">230:點檢部</p>
        <p type="p">300:設備</p>
        <p type="p">310:設備資料輸出部</p>
        <p type="p">320:設備控制部</p>
        <p type="p">500:設備點檢系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2359" publication-number="202618258">
    <tif-files tif-type="multi-tif">
      <tif file="114139039.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139039</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢查物體的基於影像感測器的檢查裝置</chinese-title>
        <english-title>INSPECTION DEVICE FOR IMAGE SENSOR-BASED INSPECTION OF AN OBJECT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G01N21/95</main-classification>
        <further-classification edition="200601120260128B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＭＢ自動化有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MB AUTOMATION GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦斯科　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASKO, ONDREJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾　潔西卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAYER, JESSICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於一物體（3）的基於影像感測器之檢查的檢查裝置，其中該檢查裝置（1）包含：  &lt;br/&gt;一輸送裝置，其用於沿著一輸送路徑輸送待檢查之一實體物體（3）；一影像感測器系統（6），其具有至少一個影像感測器（35），該至少一個影像感測器用於在該物體（3）藉助於該輸送裝置沿著該輸送路徑相對於該影像感測器系統（6）連續移動時，沿著一觀察方向（18）至少部分地掃描該物體（3）；以及一照明裝置，其用於在可由該影像感測器系統（6）偵測到之一波長範圍內照明待檢查之該物體（3）之一表面，使得該影像感測器系統（6）可至少分段地在以此方式照明之一表面區中對該表面執行基於影像感測器之偵測。該影像感測器系統（6）具有一數目N個數位行掃描攝影機（7），其中N ≥ 1，該些數位行掃描攝影機經個別地或累積地組態為接觸式影像感測器CIS，各數位行掃描攝影機具有配置成一行之複數個攝影機像素（27）且具有一各別透鏡（28），其中該N個行掃描攝影機（7）之該些行各自橫向於該輸送路徑延行。該照明裝置經組態以產生用於照明待檢查之該物體（3）之該表面之光，並且使該光沿著一光束路徑（24）對準，該光束路徑之方向與該觀察方向（18）重合或自其偏離至多30°。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an inspection device for image sensor-based inspection of an object (3), wherein the inspection device (1) comprises: &lt;br/&gt;a transport device for transporting a physical object (3) to be inspected along a transport path; an image sensor system (6) with at least one image sensor (35) for at least partially scanning the object (3) along a viewing direction (18) while the object (3) is continuously moved relative to the image sensor system (6) by means of the transport device along the transport path; and an illumination device for illuminating a surface of the object (3) to be inspected in a wavelength range that can be detected by the image sensor system (6), so that the image sensor system (6) can perform image sensor-based detection of the surface in a surface region illuminated in this way, at least in sections. The image sensor system (6) has a number N, with N ≥ 1, of digital line scan cameras (7), configured individually or cumulatively as contact image sensor, CIS, each with a plurality of camera pixels (27) arranged in a line and having a respective lens (28), wherein the lines of the N line scan cameras (7) each run transversely to the transport path. The illumination device is configured to generate light for illuminating the surface of the object (3) to be inspected and to align it along a beam path (24), the direction of which coincides with the viewing direction (18) or deviates therefrom by at most 30°.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢查裝置</p>
        <p type="p">2:系統</p>
        <p type="p">3:物體</p>
        <p type="p">4:第一真空傳送帶</p>
        <p type="p">5:第二真空傳送帶</p>
        <p type="p">8:影像評估裝置</p>
        <p type="p">9:屏蔽裝置</p>
        <p type="p">11:清潔裝置</p>
        <p type="p">12:供應輥</p>
        <p type="p">13:起始基板</p>
        <p type="p">14:分離裝置</p>
        <p type="p">15:固定裝置</p>
        <p type="p">16:導引滾輪</p>
        <p type="p">17:調整裝置</p>
        <p type="p">v:速度</p>
        <p type="p">x:輸送方向</p>
        <p type="p">y:Y方向</p>
        <p type="p">z:Z方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2360" publication-number="202619052">
    <tif-files tif-type="multi-tif">
      <tif file="114139040.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成具有玻璃基板的電子裝置的方法</chinese-title>
        <english-title>METHOD FOR FORMING AN ELECTRONIC DEVICE WITH A GLASS SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">H01L23/15</main-classification>
        <further-classification edition="200601120260124B">H01L21/60</further-classification>
        <further-classification edition="201401120260124B">B23K26/21</further-classification>
        <further-classification edition="200601120260124B">H01L21/768</further-classification>
        <further-classification edition="200601120260124B">H01L23/498</further-classification>
        <further-classification edition="200601120260124B">H01L23/522</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＪＣＥＴ星科金朋韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹汝俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, YEOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喜秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於形成電子裝置的方法，所述方法包括：提供玻璃基板，其中所述玻璃基板在其頂表面上具有頂部再分佈層；將電子元件附接在所述玻璃基板的所述頂部再分佈層上；通過穿過所述玻璃基板進行雷射輔助鍵合來將所述電子元件鍵合到所述頂部再分佈層上；在所述玻璃基板上形成包封劑層以包封所述電子元件和所述頂部再分佈層；在所述玻璃基板中形成多個通孔；將底部再分佈層形成到所述玻璃基板的底表面上；以及將焊料凸塊安裝到所述底部再分佈層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:玻璃基板</p>
        <p type="p">120:頂部再分佈層</p>
        <p type="p">121:導電結構</p>
        <p type="p">131:焊料材料</p>
        <p type="p">141:電子元件</p>
        <p type="p">142:電子元件</p>
        <p type="p">150:透明載體</p>
        <p type="p">160:雷射源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2361" publication-number="202617847">
    <tif-files tif-type="multi-tif">
      <tif file="114139092.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於獲得經純化分枝乙烯酯流之單體回收系統及方法</chinese-title>
        <english-title>MONOMER RECOVERY SYSTEM AND PROCESS FOR OBTAINING A PURIFIED BRANCHED VINYL ESTER STREAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08J11/02</main-classification>
        <further-classification edition="200601120260202B">B01D3/14</further-classification>
        <further-classification edition="200601120260202B">C07C67/54</further-classification>
        <further-classification edition="200601120260202B">C07C69/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴西商布拉斯科股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRASKEM S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利馬　艾莉安娜　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIMA, ELIANA VIDAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布羅廖　瑪利亞　Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROGLIO, MARIA IGNEZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於獲得經純化分枝乙烯酯流的回收系統及方法。純化系統係由以下構成：單級或多級氣-液相分離器(S1)，用於將饋料流分離成頂部流(S1')及底部流(S1'')；蒸餾塔(C3)，用於將(S1'')流分離成頂部流(C3')及底部流(C3'')；以及蒸餾塔(C4)，用於將(C3'')流分離成含有經純化分枝乙烯酯流的頂部流(C4')及底部流(C4'')。該方法具有以下步驟：將饋料流注入單級或多級氣-液相分離器(S1)中且回收頂部流(S1')及底部流(S1'')；將(S1'')流注入蒸餾塔(C3)中且回收頂部流(C3')及底部流(C3'')；以及將(C3'')流注入蒸餾塔(C4)中且回收頂部流(C4')及底部流(C4'')。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a recovery system and process for obtaining purified branched vinyl ester stream. The purification system is made of a vapor-liquid phase separator of one or multiple stages (S1) for separating an overhead stream (S1') and a bottom stream (S1'') from a feed stream; a distillation column (C3) for separating an overhead stream (C3') and a bottom stream (C3'') from (S1'') stream; and a distillation column (C4) for separating an overhead stream (C4') with the purified branched vinyl ester stream and a bottom stream (C4'') from (C3'') stream. The process has the steps of injecting a feed stream to a vapor-liquid phase separator of one or multiple stages (S1) and recovering an overhead stream (S1') and a bottom stream (S1''); injecting (S1'') stream to a distillation column (C3) and recovering an overhead stream (C3') and a bottom stream (C3''); and injecting (C3'') stream to a distillation column (C4) and recovering an overhead stream (C4') and a bottom stream (C4'').</p>
      </isu-abst>
      <representative-img>
        <p type="p">C3,C4:蒸餾塔</p>
        <p type="p">S1:單級或多級氣-液相分離器</p>
        <p type="p">D1':饋料流</p>
        <p type="p">E1',E3':排氣流</p>
        <p type="p">C3':包含輕質溶劑餾分的頂部流</p>
        <p type="p">C3":包含富分枝乙烯酯餾分的底部流</p>
        <p type="p">C4':包含經純化分枝乙烯酯流的頂部流</p>
        <p type="p">C4":包含污染物及重組分的底部流</p>
        <p type="p">S1':頂部流</p>
        <p type="p">S1":底部流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2362" publication-number="202618940">
    <tif-files tif-type="multi-tif">
      <tif file="114139096.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基板的製造方法</chinese-title>
        <english-title>MANUFACTURE METHOD FOR A PACKAGING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/56</main-classification>
        <further-classification edition="200601120260102B">H01L21/302</further-classification>
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>
        <further-classification edition="200601120260102B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李始勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SI HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE KYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李榮奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNGGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種封裝基板的製造方法，本發明的實例的封裝基板的製造方法包括如下步驟來製造封裝基板：準備步驟，準備包括形成有空腔部的芯層的備用基板，所述空腔部包括元件部安裝空間和包圍所述元件部安裝空間的空腔內側面；表面處理步驟，提高所述空腔內側面的至少一部分的表面能；元件部安裝步驟, 在完成所述表面處理步驟的所述空腔部安裝元件部；以及封裝層形成步驟，利用封裝層製備用組合物來形成包圍所述元件部的表面的至少一部分的封裝層。在這種情況下，能夠有效地抑制在封裝基板內形成封裝層和絕緣層的過程中可能會發生的缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a packaging substrate according to the present disclosure comprises: a preparation step of preparing a preliminary substrate which comprises a core layer in which a cavity portion comprises a device mounting space and an inner side surface of the cavity surrounding the device mounting space; a surface treatment step of increasing surface energy of at least a portion of the inner side surface of the cavity; and an encapsulation layer forming step of forming an encapsulation layer which comprises surrounding at least a portion of the surface of the device portion with an encapsulation layer-forming composition, thereby manufacturing the packaging substrate. In this case, defects that may occur in a process of forming the encapsulation layer and an insulating layer in the packaging substrate may be effectively suppressed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:備用基板</p>
        <p type="p">10:芯層</p>
        <p type="p">11:空腔部</p>
        <p type="p">12:空腔開口部</p>
        <p type="p">13:空腔內側面</p>
        <p type="p">14:元件部安裝空間</p>
        <p type="p">20:元件部</p>
        <p type="p">30:粘合膜</p>
        <p type="p">40:空腔導電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2363" publication-number="202617110">
    <tif-files tif-type="multi-tif">
      <tif file="114139097.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降眼壓訓練裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">A61F9/00</main-classification>
        <further-classification edition="200601120260131B">A61H5/00</further-classification>
        <further-classification edition="200601120260131B">A61N2/00</further-classification>
        <further-classification edition="200601120260131B">A61N1/36</further-classification>
        <further-classification edition="200601120260131B">A61M21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商麥寶科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METABRAIN TECHNOLOGY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷文芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李信達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIN-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種降眼壓訓練裝置，包括支架單元、虛擬顯示單元、音頻刺激單元、經顱刺激單元和控制單元；所述支架單元包括頂側部、後側部和兩個耳部；所述虛擬顯示單元包括顯示眼鏡；所述音頻刺激單元包括兩個揚聲器，兩個揚聲器用於播送拍頻樂曲，所述拍頻樂曲具有音頻頻率差；經顱刺激單元包括兩個第一刺激媒介，所述第一刺激媒介用於進行經顱電刺激或進行經顱磁刺激；本發明所提供的降眼壓訓練裝置能夠通過設置的顯示眼鏡、揚聲器和第一刺激媒介，在單次療程中對使用者進行多種降眼壓訓練，達到加乘降低使用者的眼壓的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支架單元</p>
        <p type="p">2:虛擬顯示單元</p>
        <p type="p">21:顯示眼鏡</p>
        <p type="p">3:音頻刺激單元</p>
        <p type="p">31:揚聲器</p>
        <p type="p">4:眼罩單元</p>
        <p type="p">5:穴位刺激單元</p>
        <p type="p">51:頭穴位激光刺激媒介</p>
        <p type="p">52:足套</p>
        <p type="p">53:足穴位激光刺激媒介</p>
        <p type="p">6:經顱刺激單元</p>
        <p type="p">7:運動單元</p>
        <p type="p">71:座架</p>
        <p type="p">72:飛輪</p>
        <p type="p">73:踏板組</p>
        <p type="p">74:電力模塊</p>
        <p type="p">75:能源轉換模塊</p>
        <p type="p">8:控制單元</p>
        <p type="p">9:使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2364" publication-number="202619462">
    <tif-files tif-type="multi-tif">
      <tif file="114139136.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05K7/20</main-classification>
        <further-classification edition="200601120260102B">F28D1/06</further-classification>
        <further-classification edition="200601120260102B">H01L23/467</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木貝慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, BEJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木貝慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, BEJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的冷卻系統包括：冷卻箱；用於冷卻熱源的冷卻體；收納部，其由收納所述熱源及所述冷卻體的收納箱或袋等構成；引導部，其設置在所述冷卻箱與所述收納部之間，用於將來自所述收納部內部的流體引導至所述冷卻箱的內部；以及驅動部，其用於形成從所述收納部向所述冷卻箱的流體流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:冷卻箱</p>
        <p type="p">20:收納部</p>
        <p type="p">30:吸引部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2365" publication-number="202618281">
    <tif-files tif-type="multi-tif">
      <tif file="114139172.zip" no="1">
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    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子部件的檢查裝置以及電子部件的檢查裝置用帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N35/04</main-classification>
        <further-classification edition="200601120260102B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺大亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田悠人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原崇義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, TAKAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子部件的檢查裝置以及電子部件的檢查裝置用帶，能夠一邊直接確認黏貼於帶的表面的多個電子部件的晶片的狀態，一邊精度良好地進行檢查，並且使檢查的作業速度提高。本發明的檢查裝置具備：一對夾持夾具，其在X方向上移動自如，並夾持帶TA的兩個外緣部；一對擠壓用輪W，其在X方向上彼此對置，旋轉自如且在X方向上移動自如；驅動機構（馬達MWL、MWR、MRL），其驅動夾持夾具和擠壓用輪W；以及檢查機構51，其對黏貼於帶TA的表面的多個晶片TI的狀態進行檢查，檢查裝置在夾持以表面為外側被折疊後的帶TA的狀態下，藉由使擠壓用輪W旋轉，由此擠壓被夾持的帶TA，藉由利用檢查機構51對在擠壓用輪W之間露出的帶TA的部分進行觀察，從而檢查晶片TI的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">TA:帶(檢查裝置用帶)</p>
        <p type="p">TI:晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2366" publication-number="202617443">
    <tif-files tif-type="multi-tif">
      <tif file="114139196.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>色帶卡匣</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">B41J17/24</main-classification>
        <further-classification edition="200601120251128B">B41J33/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商精工愛普生股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIKO EPSON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甕健二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木泰志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, TAISHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山響</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, HIBIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種可使色帶之收容量增大之色帶卡匣。  &lt;br/&gt;本發明之色帶卡匣係安裝於印刷裝置者，且包含：卡匣殼體，其收容色帶；及齒輪系，其被收容於卡匣殼體；且於被安裝於印刷裝置之狀態下，捲取色帶之捲取輥之旋轉軸線與捲取軸之旋轉軸線不同；齒輪系構成為將捲取軸之動力傳遞至捲取輥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:色帶卡匣</p>
        <p type="p">12:卡匣殼體</p>
        <p type="p">13:第1殼體</p>
        <p type="p">13A:側壁</p>
        <p type="p">22:按壓滾筒</p>
        <p type="p">28:色帶收容區域</p>
        <p type="p">29:齒輪系收容區域</p>
        <p type="p">30:色帶</p>
        <p type="p">31:送出輥</p>
        <p type="p">31A:送出芯</p>
        <p type="p">32:捲取輥</p>
        <p type="p">32A:捲取芯</p>
        <p type="p">40:齒輪系</p>
        <p type="p">41:第1齒輪</p>
        <p type="p">42:第2齒輪</p>
        <p type="p">43:第3齒輪</p>
        <p type="p">50:規制部</p>
        <p type="p">110:頭</p>
        <p type="p">111:頭罩</p>
        <p type="p">113:送出軸</p>
        <p type="p">114:捲取軸</p>
        <p type="p">R1:第1周向</p>
        <p type="p">X,Y,Z:軸</p>
        <p type="p">X1:第1寬度方向</p>
        <p type="p">X2:第2寬度方向</p>
        <p type="p">Y1:前方</p>
        <p type="p">Y2:後方</p>
        <p type="p">Z1:上方</p>
        <p type="p">Z2:下方</p>
        <p type="p">Z11:第1旋轉軸線</p>
        <p type="p">Z12:第2旋轉軸線</p>
        <p type="p">Z13:第3旋轉軸線</p>
        <p type="p">Z14:第4旋轉軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2367" publication-number="202618462">
    <tif-files tif-type="multi-tif">
      <tif file="114139202.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139202</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>曝光設備、物品製造方法、及控制方法</chinese-title>
        <english-title>EXPOSURE APPARATUS, ARTICLE MANUFACTURING METHOD, AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G03F7/20</main-classification>
        <further-classification edition="200601120260107B">G03F9/00</further-classification>
        <further-classification edition="200601120260107B">G01B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本智洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種曝光設備，其執行藉由使用原始版在基板上形成圖案的曝光處理，該設備包含：被組態以固持該原始版的夾頭；被組態以固持該夾頭的原始版座台；被組態以測量該原始版的位置的第一測量裝置；被組態以測量該夾頭相對於該原始版座台的位置的第二測量裝置；及被組態以根據該第二測量裝置的測量值相對於參考值的偏差，來控制在該原始版與該基板在該曝光處理中之相對位置的控制器，其中該控制器被組態以根據該第一測量裝置的測量值執行校正該參考值的校正處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an exposure apparatus that performs an exposure process of forming a pattern onto a substrate by using an original plate, the apparatus comprising: a chuck configured to hold the original plate; an original plate stage configured to hold the chuck; a first measurement device configured to measure a position of the original plate; a second measurement device configured to measure a position of the chuck with respect to the original plate stage; and a controller configured to control a relative position between the original plate and the substrate in the exposure process, based on a deviation of a measurement value of the second measurement device with respect to a reference value, wherein the controller is configured to execute a calibration process of calibrating the reference value based on a measurement value of the first measurement device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:照明光學系統</p>
        <p type="p">20:座台裝置</p>
        <p type="p">21:夾頭</p>
        <p type="p">21a:開口部</p>
        <p type="p">22:原始版座台</p>
        <p type="p">23:第一驅動機制</p>
        <p type="p">24:第二驅動機制</p>
        <p type="p">25:參考板</p>
        <p type="p">30:投影光學系統</p>
        <p type="p">40:基板座台</p>
        <p type="p">41:基板驅動機制</p>
        <p type="p">50:控制器</p>
        <p type="p">61:第一測量裝置</p>
        <p type="p">62:第二測量裝置</p>
        <p type="p">100:曝光設備</p>
        <p type="p">R:原始版</p>
        <p type="p">S:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2368" publication-number="202618078">
    <tif-files tif-type="multi-tif">
      <tif file="114139203.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生產多晶半導體材料的方法</chinese-title>
        <english-title>PROCESS FOR PRODUCING POLYCRYSTALLINE SEMICONDUCTOR MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251021B">C30B28/12</main-classification>
        <further-classification edition="200601120251021B">C30B29/36</further-classification>
        <further-classification edition="200601120251021B">C30B29/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商瓦克化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACKER CHEMIE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得　菲拉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIOTR, FILAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安卓亞斯　胡柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREAS, HUBER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的主題是一種用於生產多晶半導體材料的方法，包括將含有氫氣和至少一種半導體組分的反應氣體引入氣相沉積反應器的反應室中，反應室由反應器殼體和底板界定，其中反應氣體通過位於底板中的至少一個噴嘴引入，並且其中反應室包含附著到底板的至少兩個細絲棒，半導體材料沉積在細絲棒上，其中至少兩個細絲棒其長度不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The subject of the invention is a process for producing polycrystalline semiconductor material, comprising introducing a reaction gas containing hydrogen plus at least one semiconductor component into a reaction chamber, bounded by a reactor shell and a bottom plate, of a vapor deposition reactor, wherein the reaction gas is introduced through at least one nozzle located in the bottom plate and wherein the reaction chamber contains, attached to the bottom plate, at least two filament rods onto which the semiconductor material is deposited, wherein at least two filament rods differ in their length.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣相沉積反應器</p>
        <p type="p">10:底板</p>
        <p type="p">11:噴嘴</p>
        <p type="p">12:反應器殼體</p>
        <p type="p">13:噴嘴</p>
        <p type="p">14:反應室</p>
        <p type="p">15:氣體出口</p>
        <p type="p">16:細絲棒</p>
        <p type="p">17:單棒</p>
        <p type="p">18:細絲棒</p>
        <p type="p">19:單棒</p>
        <p type="p">20:橋</p>
        <p type="p">22:電極</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2369" publication-number="202618897">
    <tif-files tif-type="multi-tif">
      <tif file="114139206.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成無雜質金屬合金膜的方法</chinese-title>
        <english-title>METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">H01L21/283</main-classification>
        <further-classification edition="200601120260125B">C23C16/455</further-classification>
        <further-classification edition="200601120260125B">C23C16/448</further-classification>
        <further-classification edition="200601120260125B">C23C16/08</further-classification>
        <further-classification edition="200601120260125B">H01L21/3205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班傑　葛堤卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJAJ, GEETIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡雷　達桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAKARE, DARSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉迪亞　皮耶納桑薩利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORADIA, PRERNA SONTHALIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維瑟爾　羅伯特詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISSER, ROBERT JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊逸雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YIXIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫區　賈桂琳Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WRENCH, JACQUELINE S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>干德可塔　史林尼維斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANDIKOTA, SRINIVAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述了藉由將基板表面暴露於鹵化物前驅物及有機矽烷反應物來沉積金屬膜的方法。該鹵化物前驅物包含具有以下通式(I)的化合物：MQ&lt;sub&gt;z&lt;/sub&gt;R&lt;sub&gt;m&lt;/sub&gt;，其中M為金屬，Q為選自Cl、Br、F或I的鹵素，z為自1至6，R選自烷基、CO，及環戊二烯基，並且m為0至6。鋁反應物包含具有以下通式(II)或通式(III)的化合物：&lt;br/&gt;             &lt;img align="absmiddle" height="349px" width="264px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;        ，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;、R&lt;sup&gt;6&lt;/sup&gt;、R&lt;sup&gt;7&lt;/sup&gt;、R&lt;sup&gt;8&lt;/sup&gt;、R&lt;sup&gt;a&lt;/sup&gt;、R&lt;sup&gt;b&lt;/sup&gt;、R&lt;sup&gt;c&lt;/sup&gt;、R&lt;sup&gt;d&lt;/sup&gt;、R&lt;sup&gt;e&lt;/sup&gt;，及R&lt;sup&gt;f&lt;/sup&gt;獨立的選自氫(H)、經取代烷基或未經取代烷基；並且X、Y、X'，及Y’獨立地選自氮(N)及碳(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing a metal film by exposing a substrate surface to a halide precursor and an organosilane reactant are described. The halide precursor comprises a compound of general formula (I): MQ&lt;sub&gt;z&lt;/sub&gt;R&lt;sub&gt;m&lt;/sub&gt;, wherein M is a metal, Q is a halogen selected from Cl, Br, F or I, z is from 1 to 6, R is selected from alkyl, CO, and cyclopentadienyl, and m is from 0 to 6. The aluminum reactant comprises a compound of general formula (II) or general formula (III): &lt;img align="absmiddle" height="350px" width="302px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;                   &lt;b&gt;,&lt;/b&gt;wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, R&lt;sup&gt;5&lt;/sup&gt;, R&lt;sup&gt;6&lt;/sup&gt;, R&lt;sup&gt;7&lt;/sup&gt;, R&lt;sup&gt;8&lt;/sup&gt;, R&lt;sup&gt;a&lt;/sup&gt;, R&lt;sup&gt;b&lt;/sup&gt;, R&lt;sup&gt;c&lt;/sup&gt;, R&lt;sup&gt;d&lt;/sup&gt;, R&lt;sup&gt;e&lt;/sup&gt;, and R&lt;sup&gt;f&lt;/sup&gt; are independently selected from hydrogen (H), substituted alkyl or unsubstituted alkyl; and X, Y, X', and Y' are independently selected from nitrogen (N) and carbon (C).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">20:預處理操作</p>
        <p type="p">30:沉積操作</p>
        <p type="p">40:操作</p>
        <p type="p">50:操作</p>
        <p type="p">60:操作</p>
        <p type="p">70:操作</p>
        <p type="p">80:決定</p>
        <p type="p">90:後處理操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2370" publication-number="202617904">
    <tif-files tif-type="multi-tif">
      <tif file="114139291.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139291</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨劑組合物及使用研磨劑組合物的研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">C09G1/02</main-classification>
        <further-classification edition="200601120260125B">C09K3/14</further-classification>
        <further-classification edition="200601120260125B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山口精研工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI SEIKEN KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤優治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀本真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIMOTO, SANAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原口哲朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARAGUCHI, TETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巣河慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨劑組合物，其實現研磨速度等的鏡面研磨加工的迅速化，並且提升鏡面研磨後半導體晶圓之晶圓表面的平滑性及平坦性而可達成高加工精度的鏡面精加工，且保存穩定性優異。該研磨劑組合物係用以將包含III-V族化合物作為構成成分之研磨對象物進行研磨加工，其具備：膠質氧化矽；氧化劑；氧化促進劑，用以促進氧化劑對於研磨對象物表面的氧化反應；穩定劑，用以控制氧化促進劑對於研磨對象物表面之氧化反應的促進作用；及水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2371" publication-number="202618803">
    <tif-files tif-type="multi-tif">
      <tif file="114139299.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139299</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多模態機器學習系統及方法</chinese-title>
        <english-title>MULTIMODAL MACHINE LEARNING SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">G16H50/20</main-classification>
        <further-classification edition="201801120260102B">G16H50/50</further-classification>
        <further-classification edition="201901120260102B">G06N20/00</further-classification>
        <further-classification edition="202301120260102B">G06N3/08</further-classification>
        <further-classification edition="202201120260102B">G06V10/40</further-classification>
        <further-classification edition="201701120260102B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中央研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACADEMIA SINICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡春美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHUN-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許昭萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHAO-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張毓廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳丹霓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, DAN-NI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多模態機器學習系統，用以產生多模態輸入資料組。多模態機器學習系統包括編碼器層及融合層。編碼器層包含至少一單模態分析模型，用以對至少一全光譜圖像的複數個資料點進行分析，以產生至少一全光譜圖像的決策值。融合層用以將該至少一全光譜圖像的決策值與至少一非光譜資料進行融合而產生多模態輸入資料組，其中該至少一非光譜資料組包含至少一臨床資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multimodal machine learning system for generate a multimodal input data set. The multimodal machine learning system includes an encoder layer and a fusion layer. The encoder layer includes at least a single-modal classification model for analyzing a plurality of data points of at least one full spectrum image, so to generate at least one decision value of the at least one full spectrum image. The fusion layer is used to fuse the at least one decision value of the at least one full spectrum image with at least one non-spectral data including at least one clinical data, so as to generate the multimodal input data set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多模態機器學習系統</p>
        <p type="p">10:特徵選擇層</p>
        <p type="p">20:編碼器層</p>
        <p type="p">30:融合層</p>
        <p type="p">40:最終決策層</p>
        <p type="p">21A、21B:單模態分析模型</p>
        <p type="p">41:多模態分析模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2372" publication-number="202619105">
    <tif-files tif-type="multi-tif">
      <tif file="114139380.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成細間距垂直引線互連結構的方法</chinese-title>
        <english-title>METHOD FOR FORMING FINE-PITCH VERTICAL WIRE INTERCONNECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251212B">H01L23/498</main-classification>
        <further-classification edition="200601120251212B">H01L23/495</further-classification>
        <further-classification edition="200601120251212B">H01L21/768</further-classification>
        <further-classification edition="200601120251212B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商先進科技新加坡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMPT SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　景耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, KENG YEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘松海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, SONG HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONG LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　池觀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, CHI KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴炫旼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYEON MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於形成垂直引線互連結構的引線鍵合方法，包括以下步驟：使用引線鍵合工具在襯底上的鍵合焊盤處形成引線鍵合；將引線鍵合工具從鍵合焊盤上移開，以延長位於引線鍵合工具和引線鍵合之間的一段鍵合引線；通過使用引線鍵合工具將毛細管和球形引線鍵合之間的該段鍵合引線上的點抵住引線鍵合的一部分進行按壓，從而形成鍵合引線的弱化部分；以及通過移動引線鍵合工具拉直該段鍵合引線，並使鍵合引線在該弱化部分斷裂，以形成垂直引線互連結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wire bonding method for forming a vertical wire interconnect includes the steps offorming a wire bond at a bonding pad on a substrate using a wire bonding tool; movingthe wire bonding tool away from the bonding pad to extend a length of the bondingwire positioned between the wire bonding tool and the wire bond; forming a weakenedportion of the bonding wire by pressing a point on the length of the bonding wirebetween the capillary and the ball wire bond against a portion of the wire bond with thewire bonding tool, and straightening the length of the bonding wire and breaking thebonding wire at the weakened portion by moving the wire bonding tool to form a verticalwire interconnect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104a:點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2373" publication-number="202618928">
    <tif-files tif-type="multi-tif">
      <tif file="114139399.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置的製造方法、灰階光罩及半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD, GRAYSCALE MASK AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251104B">H01L21/314</main-classification>
        <further-classification edition="200601120251104B">H01L21/32</further-classification>
        <further-classification edition="200601120251104B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　睿韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, RUI-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　生興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SIN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　偉斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WUI-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一半導體裝置的製造方法、一灰階光罩以及一半導體裝置。方法包括：提供一基板，並且於其上形成一無機層及一光阻層；配置一灰階光罩，該灰階光罩包含一具有兩個透光區的第一光罩，以及一具有兩個具有不同透光率的濾光區的第二光罩。曝光光線經灰階光罩穿透，以在光阻層上進行單次且具不同能量的曝光，經顯影後形成具有高度差異的光阻圖案。最後，藉由離子蝕刻將該光阻圖案轉移至無機層，使無機層形成具有對應高度差異的蝕刻微結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device manufacturing method, grayscale mask and semiconductor device are provided. The method includes providing a substrate, forming an inorganic layer and a photoresist layer thereon, and arranging a grayscale mask comprising a first mask having two transparent regions and a second mask having two filter regions with different transmittances. An exposure light passes through the grayscale mask to perform a single exposure with varying energy on the photoresist layer, forming a photoresist pattern with height differences after developing. Finally, the photoresist pattern is transferred into the inorganic layer by ion etching, forming etched microstructures with corresponding height differences.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">11:基底</p>
        <p type="p">12:膜層</p>
        <p type="p">13:感測區</p>
        <p type="p">2:遮光圖案</p>
        <p type="p">3:無機層</p>
        <p type="p">R:光阻層</p>
        <p type="p">m:灰階光罩</p>
        <p type="p">m1:第一光罩</p>
        <p type="p">m11:遮光區</p>
        <p type="p">m12:透光區</p>
        <p type="p">m13:遮光結構</p>
        <p type="p">m2:第二光罩</p>
        <p type="p">m21:第一濾光區</p>
        <p type="p">m22:第二濾光區</p>
        <p type="p">ms:透光基板</p>
        <p type="p">D:曝光路徑</p>
        <p type="p">L:曝光光線</p>
        <p type="p">L1:第一曝光光線</p>
        <p type="p">L2:第二曝光光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2374" publication-number="202617919">
    <tif-files tif-type="multi-tif">
      <tif file="114139418.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨方法、漿料及磨粒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C09K3/14</main-classification>
        <further-classification edition="200601120260126B">C09G1/02</further-classification>
        <further-classification edition="201201120260126B">B24B37/00</further-classification>
        <further-classification edition="200601120260126B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田慎太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南征志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野雅博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種研磨方法，其包括使用漿料對具有含有樹脂材料之樹脂部之被研磨構件的前述樹脂部進行研磨之研磨步驟，前述漿料含有具有氧化矽粒子及存在於前述氧化矽粒子的表面之鋁成分之磨粒。一種漿料，其用於對具有含有樹脂材料之樹脂部之被研磨構件的前述樹脂部進行研磨，其中，前述漿料含有具有氧化矽粒子及存在於前述氧化矽粒子的表面之鋁成分之磨粒。一種磨粒，其用於對具有含有樹脂材料之樹脂部之被研磨構件的前述樹脂部進行研磨，其中，前述磨粒具有氧化矽粒子及存在於前述氧化矽粒子的表面之鋁成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2375" publication-number="202617517">
    <tif-files tif-type="multi-tif">
      <tif file="114139424.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變速器吊架</chinese-title>
        <english-title>DERAILLEUR HANGER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120251231B">B62M9/125</main-classification>
        <further-classification edition="201001120251231B">B62M9/121</further-classification>
        <further-classification edition="200601120251231B">B62K25/30</further-classification>
        <further-classification edition="201201120251231B">F16H57/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下村忠央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOMURA, TADAHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶山翔大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYAMA, SHOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田慎一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種變速器吊架包含一第一部分、一第二部分、一第三部分及一銷。該第一部分包含用於接收一輪轂軸之一軸接收孔。該第二部分包含用於支撐一變速器之一變速器支撐面。該第三部分包含面向一第一方向之一第一表面、面向與該第一方向相反之一第二方向之一第二表面及面向該第一方向之一第三表面。該銷包含耦合至該第三部分之一第一部件、在該第一方向上自該第三表面突出以接收於一自行車車架之一銷接收部分中之一第二部件及安置於該第一部件與該第二部件之間的一易斷部件。該易斷部件在將一預定力或更高力施加至該銷之後相對於該第一部件及該第二部件斷裂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A derailleur hanger includes a first portion, a second portion, a third portion and a pin. The first portion includes an axle receiving bore for receiving a hub axle. The second portion includes a derailleur support surface for supporting a derailleur. The third portion includes a first surface facing in a first direction, a second surface facing in a second direction opposite the first direction, and a third surface facing in the first direction. The pin includes a first part coupled to the third portion, a second part projecting in the first direction from the third surface to be received in a pin receiving portion of a bicycle frame, and a frangible part disposed between the first part and the second part. The frangible part breaks relative to the first part and the second part upon application of a predetermined force or higher to the pin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:變速器吊架總成</p>
        <p type="p">20:貫通軸</p>
        <p type="p">28:後部</p>
        <p type="p">33:限制構件</p>
        <p type="p">34:變速器吊架</p>
        <p type="p">36:吊架螺栓</p>
        <p type="p">36a:內螺紋</p>
        <p type="p">41:第一部分</p>
        <p type="p">42:第二部分</p>
        <p type="p">43:第三部分</p>
        <p type="p">44:銷</p>
        <p type="p">45:主體</p>
        <p type="p">46:周緣</p>
        <p type="p">48:軸接收孔</p>
        <p type="p">52:輪轂接觸面</p>
        <p type="p">57:額外變速器支撐面</p>
        <p type="p">58:固定螺栓接收孔</p>
        <p type="p">62:第二表面</p>
        <p type="p">74:第一鏈條限制部分</p>
        <p type="p">74a:第一鏈條限制面</p>
        <p type="p">76:第二鏈條限制部分</p>
        <p type="p">78:套環</p>
        <p type="p">F:自行車車架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2376" publication-number="202617662">
    <tif-files tif-type="multi-tif">
      <tif file="114139425.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造(甲基)丙烯酸酯之方法</chinese-title>
        <english-title>PROCESS FOR PRODUCTION OF A (METH)ACRYLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C67/04</main-classification>
        <further-classification edition="200601120260102B">C07C67/08</further-classification>
        <further-classification edition="200601120260102B">C07C67/62</further-classification>
        <further-classification edition="200601120260102B">C07C69/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉修夫　泰爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIESHOFF, TILE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路羅斯基　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUROWSKI, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格羅斯曼　奥列格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROSSMANN, OLEG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克藍普　瑪賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAMP, MARVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於製造(甲基)丙烯酸酯之方法，其中醇或烯烴及(甲基)丙烯酸系化合物在觸媒之存在下轉化為該(甲基)丙烯酸酯，其中該(甲基)丙烯酸酯係存在於容器中且該容器含有氣相及液相，其中該液相包含該(甲基)丙烯酸酯及視情況選用之該醇或該烯烴、該(甲基)丙烯酸系化合物及/或該觸媒，且該氣相包含基於該總氣相計少於0.1莫耳%之氧。  &lt;br/&gt;本發明進一步關於該(甲基)丙烯酸酯之用途及其製造系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is directed to a process for production of a (meth)acrylate, wherein an alcohol or an alkene, and a (meth)acrylic compound are converted into the (meth)acrylate in presence of a catalyst, wherein the (meth)acrylate is present in a vessel and the vessel contains a gaseous phase and a liquid phase, wherein the liquid phase comprises the (meth)acrylate and optionally the alcohol or the alkene, the (meth)acrylic compound and/or the catalyst, and the gaseous phase comprises less than 0.1 mol.-% of oxygen, based on the total gaseous phase. &lt;br/&gt;The invention is further directed to the use of the (meth)acrylate and a system for production thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2377" publication-number="202619526">
    <tif-files tif-type="multi-tif">
      <tif file="114139531.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139531</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氮化物半導體電晶體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251216B">H10D30/47</main-classification>
        <further-classification edition="202501120251216B">H10D62/80</further-classification>
        <further-classification edition="202501120251216B">H10D62/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今関裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAZEKI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠提高失真特性之氮化物半導體電晶體。  &lt;br/&gt;本發明之氮化物半導體電晶體具有：障壁層，其具有具備氮極性之第1上表面；通道層，其位於上述第1上表面之上，具有具備氮極性之第2上表面，且具有第1方向之第1極化；及鐵電層，其位於上述第2上表面之上，具有與上述第1方向相反之第2方向之第2極化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氮化物半導體電晶體</p>
        <p type="p">10:基板</p>
        <p type="p">20:氮化物半導體層</p>
        <p type="p">21:緩衝層</p>
        <p type="p">21A,22A,23A,24A:上表面</p>
        <p type="p">22:障壁層</p>
        <p type="p">23:通道層</p>
        <p type="p">23B,24B:下表面</p>
        <p type="p">24:鐵電層</p>
        <p type="p">30:絕緣膜</p>
        <p type="p">30D,30G,30S:開口</p>
        <p type="p">40D,40S:凹部</p>
        <p type="p">41D,41S:再生長層</p>
        <p type="p">42D:汲極電極</p>
        <p type="p">42S:源極電極</p>
        <p type="p">43:閘極電極</p>
        <p type="p">51,52:二維電子氣</p>
        <p type="p">P1,P2:極化</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2378" publication-number="202618552">
    <tif-files tif-type="multi-tif">
      <tif file="114139534.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於異構多處理器上的任務調度方法與裝置</chinese-title>
        <english-title>ACTIVITY-AWARE PERFORMANCE AND POWER MODELS FOR TASK SCHEDULING ON HETEROGENEOUS MULTIPROCESSORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">G06F9/50</main-classification>
        <further-classification edition="201901120260124B">G06F1/32</further-classification>
        <further-classification edition="200601120260124B">G06F9/48</further-classification>
        <further-classification edition="200601120260124B">G06F11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YA-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴建元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昆灝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">任務調度是基於在異構多處理器計算系統中收集的活動指數進行的。個別任務活動指數和個別處理器活動指數均包括任務執行的非停滯時間及相應的處理器操作點（OPP），以及記憶體訪問的停滯時間及相應的記憶體操作點（OPP）。非停滯時間和停滯時間分別基於至少相應的處理器OPP和相應的記憶體OPP進行縮放。系統使用縮放的非停滯時間和縮放的停滯時間來估算在給定的處理器OPP和給定的記憶體OPP下分配給定任務時每個處理器的容量和動態功率。還估算了該給定任務的負載需求。任務調度器將該給定任務分配給目標處理器並請求記憶體資源以執行該給定任務，以滿足功率和性能標準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Task scheduling is performed based on activity indexes collected in a heterogeneous multiprocessor computing system. Both per-task activity indexes and per-processor activity indexes include non-stall time of task execution and a corresponding processor operating point (OPP), and stall time of memory access and a corresponding memory OPP. The non-stall time and the stall time are scaled based on at least the corresponding processor OPP and the corresponding memory OPP, respectively. The system uses using the scaled non-stall time and the scaled stall time to estimate capacity and dynamic power of each processor when assigned a given task at a given processor OPP and a given memory OPP. The load demand of the given task is also estimated. A task scheduler assigns the given task to a target processor and requests memory resources for executing the given task to satisfy power and performance criteria.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:異構處理器</p>
        <p type="p">111:操作系統</p>
        <p type="p">112:中介軟體</p>
        <p type="p">113:應用程式</p>
        <p type="p">120:記憶體子系統</p>
        <p type="p">130:活動監控器</p>
        <p type="p">400:任務調度模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2379" publication-number="202618985">
    <tif-files tif-type="multi-tif">
      <tif file="114139554.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腔室異常處理方法和半導體製程設備</chinese-title>
        <english-title>CHAMBER ABNORMALITY HANDLING METHOD AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01L21/67</main-classification>
        <further-classification edition="200601120251103B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮麗麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, LI LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開腔室異常處理方法和半導體製程設備，包括獲取任一酸槽腔室和水槽腔室的狀態，若任一目標器件所處的酸槽腔室的狀態是異常狀態，且目標器件在酸槽腔室內的溶液中的浸泡時長大於酸槽腔室的允許浸泡時長，則執行目標器件保護操作，目標器件保護操作用於保護目標器件，以減小目標器件的過泡損傷，並暫停執行目標器件的清洗任務，直到酸槽腔室的狀態從異常狀態轉變為正常狀態且接收到指示目標器件可繼續加工的指令後，才繼續執行目標器件的清洗任務，以免已出現過泡損傷的目標器件繼續執行後續的清洗任務，以降低目標器件報廢的風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a chamber abnormality handling method and semiconductor process equipment, which includes obtaining the status of any acid tank chamber and water tank chamber. If the status of the acid tank chamber where any target device is located is abnormal, and the soaking time of the target device in the solution within the acid tank chamber exceeds the allowable soaking time of the acid tank chamber, a target device protection operation is performed. The target device protection operation is used to protect the target device in order to reduce over-soaking damage to the target device, and the cleaning task of the target device is suspended. The cleaning task will only resume after the status of the acid tank chamber changes from abnormal to normal and an instruction indicating that the target device can continue processing is received. This prevents target devices that have already suffered over-soaking damage from continuing with subsequent cleaning tasks, thereby reducing the risk of the target device being scrapped.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2380" publication-number="202616968">
    <tif-files tif-type="multi-tif">
      <tif file="114139556.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衣服</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251217B">A41D1/00</main-classification>
        <further-classification edition="200601120251217B">A41D1/06</further-classification>
        <further-classification edition="200601120251217B">A41D27/00</further-classification>
        <further-classification edition="200601120251217B">A41D27/10</further-classification>
        <further-classification edition="200601120251217B">A41D29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木貝慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, BEJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木貝慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, BEJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的衣服包括：軀幹部和與軀幹部相連的一對袖部。軀幹部與袖部的連接位置構成連接部(肩部周圍)。軀幹部的上端構成軀幹上端部(肩峰)。軀幹上端部(肩峰)的中央位置設有領口。軀幹部的側部構成軀幹側部(衣身側)。在軀幹上端部(肩峰)、領口、連接部(肩部周圍)、軀幹側部(衣身側) 及袖部中，任一部位或一個以上部位設有可擴展的調整部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:衣服</p>
        <p type="p">5:上衣(衣服)</p>
        <p type="p">10:軀幹部</p>
        <p type="p">15:袖部</p>
        <p type="p">20:連接部(袖窿或袖孔)</p>
        <p type="p">40:軀幹部(除衣身側部外，還包括軀幹上下端部、領口部、前門襟邊緣部、前門襟部、後中心線部、面料拼接部)</p>
        <p type="p">50:軀幹上端部(肩峰/肩頂)</p>
        <p type="p">100:調整部</p>
        <p type="p">120:連接調整部(袖窿或袖孔調整部)</p>
        <p type="p">130:袖子調整部</p>
        <p type="p">131:第一袖子調整部</p>
        <p type="p">132:第二袖子調整部</p>
        <p type="p">141:第一軀幹調整部</p>
        <p type="p">142:第二軀幹調整部</p>
        <p type="p">150:軀幹上端調整部(肩峰/肩頂調整部)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2381" publication-number="202617518">
    <tif-files tif-type="multi-tif">
      <tif file="114139563.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變速器吊架總成及變速器吊架</chinese-title>
        <english-title>DERAILLEUR HANGER ASSEMBLY AND DERAILLEUR HANGER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120251128B">B62M9/128</main-classification>
        <further-classification edition="201001120251128B">B62M9/125</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下村忠央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOMURA, TADAHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田寬司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶山翔大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYAMA, SHOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種變速器吊架總成包含一變速器吊架、一吊架墊圈及一吊架螺栓。該變速器吊架包含具有一內螺紋之一軸接收孔及在一安裝狀態中接觸一自行車車架之一車架附接面。該吊架墊圈具有在一車架接觸面與一螺栓接觸面之間延伸之一螺栓接收開口。該吊架螺栓包含一桿部及一頭部。該頭部具有面向該桿部之一軸向方向之一軸向接觸面。該桿部包含螺合地耦合至該變速器吊架之該內螺紋之一外螺紋部分。在其中該吊架螺栓在沒有該吊架墊圈之情況下擰緊至該變速器吊架之一狀態中，該軸向接觸面與該車架附接面之間的一距離大於該自行車車架之一厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A derailleur hanger assembly includes a derailleur hanger, a hanger washer and a hanger bolt. The derailleur hanger includes an axle receiving bore having an internal thread and a frame attachment surface that contacts a bicycle frame in a mounted state. The hanger washer has a bolt receiving opening extending between a frame contact surface and a bolt contact surface. The hanger bolt includes a shaft portion and a head portion. The head portion has an axial contact surface facing in an axial direction of the shaft portion. The shaft portion includes an externally threaded portion that is threadedly coupled to the internal thread of the derailleur hanger. A distance between the axial contact surface and the frame attachment surface is larger than a thickness of the bicycle frame in a state where the hanger bolt is tightened to the derailleur hanger without the hanger washer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">434:變速器吊架</p>
        <p type="p">441:第一部分</p>
        <p type="p">442:第二部分</p>
        <p type="p">443:第三部分</p>
        <p type="p">444:銷</p>
        <p type="p">445:主體</p>
        <p type="p">446:周緣</p>
        <p type="p">448:軸接收孔</p>
        <p type="p">448a:內螺紋</p>
        <p type="p">452:輪轂接觸面</p>
        <p type="p">454:邊緣面</p>
        <p type="p">457:開口界定面</p>
        <p type="p">458:固定螺栓接收孔</p>
        <p type="p">474:第一鏈條限制部分</p>
        <p type="p">474a:第一鏈條限制面</p>
        <p type="p">476:第二鏈條限制部分</p>
        <p type="p">476a:第二鏈條限制面</p>
        <p type="p">481:脊面</p>
        <p type="p">483:鄰接面</p>
        <p type="p">491:第一倒角</p>
        <p type="p">493:第二倒角</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">S2:第二側/內側</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2382" publication-number="202619545">
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      <tif file="114139575.zip" no="1">
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        <document-id>
          <doc-number>114139575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有能量障壁之極性半導體超晶格</chinese-title>
        <english-title>POLAR SEMICONDUCTOR SUPERLATTICE WITH ENERGY BARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D62/10</main-classification>
        <further-classification edition="202501120260102B">H10D62/40</further-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
        <further-classification edition="200601120260102B">H01L21/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商西拉娜ＵＶ科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILANNA UV TECHNOLOGIES PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼科爾斯　喬丹　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHOLLS, JORDAN ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞坦艾柯維克　比塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATANACKOVIC, PETAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於一種半導體結構，其包括具有一窄能隙(NBG)層及一寬能隙(WBG)層之重複單位晶胞之一超晶格。該NBG層及該WBG層分別包括一NBG極性半導體材料及一WBG極性半導體材料。一能量障壁區域與該超晶格接觸，該能量障壁區域包括總共N層交替的該WBG極性半導體材料及該NBG極性半導體材料，其中該能量障壁區域之一總厚度等於該超晶格之N/2個單位晶胞之一厚度，且其中N為大於或等於4之偶數。該能量障壁區域之該N個層(WBG層或NBG層)中之層均比該超晶格之該單位晶胞之對應層(WBG或NBG)厚且薄以形成該能量障壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a semiconductor structure including a superlattice with repeating unit cells of a narrow bandgap (NBG) layer and a wide bandgap (WBG) layer. The NBG and WBG layers include an NBG and a WBG polar semiconductor material, respectively. An energy barrier region is in contact with the superlattice, including a total of N layers of alternating the WBG and NBG polar semiconductor materials, wherein a total thickness of the energy barrier region is equal to a thickness of N/2 unit cells of the superlattice, and wherein N is an even number greater than or equal to 4. Layers of the N layers of the energy barrier region, either WBG layers or NBG layers, are both thicker and thinner than a corresponding layer (either WBG or NBG) of the unit cell of the superlattice to form the energy barrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:重複單位晶胞</p>
        <p type="p">110:厚度/SL WBG層厚度</p>
        <p type="p">120:厚度</p>
        <p type="p">132:厚度</p>
        <p type="p">134:厚度</p>
        <p type="p">142:第一SL</p>
        <p type="p">144:第二SL</p>
        <p type="p">150:能量障壁區域</p>
      </representative-img>
    </description>
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          <doc-number>202619409</doc-number>
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        <document-id>
          <doc-number>114139595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>點火電路及等離子體產生裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H05H1/30</main-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市恒運昌真空技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN CSL VACUUM SCIENCE AND TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桂浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝幸光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂衛平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種點火電路及等離子體產生裝置，涉及射頻電源技術領域，該點火電路包括：輸入電路，用於接入射頻電源；輸出電路，用於輸出第一電壓；開關電路，分別與輸入電路和輸出電路電連接，用於導通或關斷輸入電路與輸出電路之間的通路；控制電路，與開關電路的受控端連接，用於輸出對應的控制信號，以控制開關電路導通或關斷，該電路結構簡潔且高效，能夠降低電路複雜度，提高點火效率，提高了等離子體的生成效率與穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:輸入電路</p>
        <p type="p">200:輸出電路</p>
        <p type="p">300:開關電路</p>
        <p type="p">400:控制電路</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2384" publication-number="202617807">
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      <tif file="114139604.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617807</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139604</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光固化樹脂、製備方法及應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251022B">C08F220/18</main-classification>
        <further-classification edition="200601120251022B">C08K5/357</further-classification>
        <further-classification edition="200601120251022B">C08K5/10</further-classification>
        <further-classification edition="200601120251022B">C08F2/48</further-classification>
        <further-classification edition="200601120251022B">C08L75/16</further-classification>
        <further-classification edition="200601120251022B">C08L33/08</further-classification>
        <further-classification edition="202001120251022B">A61K6/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海飛凱材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何洪聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋述國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種光固化樹脂、製備方法及應用，屬於光固化3D列印技術領域。本申請提供的光固化樹脂包括聚氨酯丙烯酸酯低聚物、改性丙烯酸酯低聚物、活性稀釋劑、光引發劑、光穩定劑和染料，其中，聚氨酯丙烯酸酯低聚物可以提高光固化樹脂的韌性和反應速度，降低光固化樹脂的體積收縮，改性丙烯酸酯低聚物可以提高光固化樹脂的耐久性，調節硬度和韌性，同時降低光固化樹脂的體積收縮，活性稀釋劑可以提高光固化樹脂的硬度和韌性；採用聚氨酯丙烯酸酯低聚物、改性丙烯酸酯低聚物和活性稀釋劑複配，並限定各組分用量，使各組分充分發揮協同作用，從而使光固化樹脂在具有較低體積收縮、較高硬度的同時保持高韌性與耐久性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制方法、清潔機器人以及存儲介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251028B">G05D1/648</main-classification>
        <further-classification edition="202401120251028B">G05D1/43</further-classification>
        <further-classification edition="200601120251028B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張琳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制方法、清潔機器人以及存儲介質，該控制方法包括：若清潔機器人滿足預設的電池容量檢測條件，則獲取電池的剩餘容量；以及基於剩餘容量，調整電池的荷電狀態閾值，荷電狀態閾值用於在清潔機器人位於基站之外的情況下，確定是否控制清潔機器人返回基站進行充電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟</p>
        <p type="p">S102:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2386" publication-number="202618261">
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      <isuno>9</isuno>
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          <doc-number>202618261</doc-number>
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        <document-id>
          <doc-number>114139606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於偵測及特性化半導體晶圓，尤其砷化鎵晶圓上之粒子及其他缺陷的裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR DETECTING AND CHARACTERIZING PARTICLES AND OTHER DEFECTS ON SEMICONDUCTOR WAFERS, IN PARTICULAR GALLIUM ARSENIDE WAFERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G01N21/956</main-classification>
        <further-classification edition="200601120251103B">G01N21/94</further-classification>
        <further-classification edition="202401120251103B">G01N15/0205</further-classification>
        <further-classification edition="200601120251103B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商弗賴貝格化合物原料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREIBERGER COMPOUND MATERIALS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪弗　金傑　馬克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHEFFER-CZYGAN, MAX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗萊傑　沃夫朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLIEGEL, WOLFRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於量測晶圓之表面性質的裝置(V)，其包含：&lt;br/&gt;  一光源(1)，其經調適以輸出一經定向光束；&lt;br/&gt;  一偵測器配置(2)，其經調適以偵測當該光束照射於該晶圓(W)上時產生之一方位散射特性(散射之不對稱性)、發射特性在前向方向上之一對準(亦稱為反散射)及一天頂散射；&lt;br/&gt;  一晶圓固持器(3)，一晶圓可安裝於該晶圓固持器上；&lt;br/&gt;  及一評估單元(4)。&lt;br/&gt;  一對應方法同樣為本申請案之主題。&lt;br/&gt;  裝置及方法尤其用於充分分開地偵測晶圓表面上之COP (&lt;i&gt;晶體源生微坑&lt;/i&gt;)及粒子且判定其大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a device (V) for measuring surface properties of wafers, comprising:&lt;br/&gt; a light source (1) which is adapted to output a directed light beam;&lt;br/&gt; a detector arrangement (2) which is adapted to detect an azimuth scattering characteristic (asymmetry of the scattering), an alignment of the emission characteristic in the forward direction (also backscattering) and a zenith scattering which arise when the light beam impinges on the wafer (W);&lt;br/&gt; a wafer holder (3) on which a wafer can be mounted;&lt;br/&gt; and an evaluation unit (4).&lt;br/&gt; A corresponding method is likewise the subject matter of the application.&lt;br/&gt; Device and method serve in particular to detect COPs (&lt;i&gt;crystal&lt;/i&gt;&lt;i&gt;originated&lt;/i&gt;&lt;i&gt;pits&lt;/i&gt;) and particles on the wafer surface sufficiently separately and to determine their size.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2-1:區域偵測器</p>
        <p type="p">2-2:區域偵測器</p>
        <p type="p">2-3:區域偵測器</p>
        <p type="p">2-4:區域偵測器</p>
        <p type="p">2-5:區域偵測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2387" publication-number="202618052">
    <tif-files tif-type="multi-tif">
      <tif file="114139619.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學氣相沉積裝置</chinese-title>
        <english-title>CHEMICAL VAPOR DEPOSITION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">C23C16/455</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>ＴＥＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TES CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳祚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYEOUNG-JO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐東湜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUH, DONG-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃今燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, GEUM-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種化學氣相沉積裝置，更具體地，係有關於一種化學氣相沉積裝置，在向基板供應氣體時劃分供應氣體的區域，並獨立控制每個區域供應的氣體的流量、流速或濃度，從而能夠提高基板上薄膜的生長速度，並提高薄膜的厚度均勻性和摻雜均勻性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外腔</p>
        <p type="p">110:容納空間</p>
        <p type="p">200:氣體供應部</p>
        <p type="p">220:導流板組件</p>
        <p type="p">232:頂板</p>
        <p type="p">234:第一中間板</p>
        <p type="p">236:第二中間板</p>
        <p type="p">238:底板</p>
        <p type="p">240:第一供應空間</p>
        <p type="p">250:第二供應空間</p>
        <p type="p">260:第三供應空間</p>
        <p type="p">300:腔室</p>
        <p type="p">310:上蓋</p>
        <p type="p">312:處理空間</p>
        <p type="p">320:基座</p>
        <p type="p">330:上加熱器</p>
        <p type="p">340:下加熱器</p>
        <p type="p">350:進氣管</p>
        <p type="p">360:排氣管</p>
        <p type="p">1000:化學氣相沉積裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2388" publication-number="202618206">
    <tif-files tif-type="multi-tif">
      <tif file="114139620.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251121B">F28F3/02</main-classification>
        <further-classification edition="200601120251121B">G06F1/20</further-classification>
        <further-classification edition="200601120251121B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島和彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉岡健人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAOKA, TAKEHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑中康司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木沢晋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIZAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的一方式的冷卻裝置包括冷板、多個翅片、第一流路和第二流路。冷板與熱源熱接觸。多個翅片配置於冷板的兩個主面中的一個主面，並在第一方向上相互空開間隔地排列。第一流路在一個主面中相對於多個翅片配置於與第一方向交叉的第二方向的一側，並與製冷劑的流入口連通。第二流路在一個主面中相對於多個翅片配置於第二方向的另一側，並與製冷劑的流出口連通。翅片的至少一部分在俯視觀察時與第一流路或者第二流路重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:翅片</p>
        <p type="p">21、21A、21B、21C、21D:翅片組</p>
        <p type="p">30:中間板</p>
        <p type="p">40:流入口</p>
        <p type="p">50:流出口</p>
        <p type="p">60:第一流路</p>
        <p type="p">61:第一單獨流路</p>
        <p type="p">62:第二單獨流路</p>
        <p type="p">70:第二流路</p>
        <p type="p">71:第三單獨流路</p>
        <p type="p">72:第四單獨流路</p>
        <p type="p">R:區域</p>
        <p type="p">X、Y、Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2389" publication-number="202617914">
    <tif-files tif-type="multi-tif">
      <tif file="114139634.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251222B">C09J175/14</main-classification>
        <further-classification edition="200601120251222B">C08G18/30</further-classification>
        <further-classification edition="200601120251222B">C08F2/34</further-classification>
        <further-classification edition="200601120251222B">B32B27/40</further-classification>
        <further-classification edition="201901120251222B">A41D31/102</further-classification>
        <further-classification edition="201901120251222B">A41D31/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千千和宏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIJIWA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金川善典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAGAWA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供透濕性及層間黏接力優異的積層體。一種積層體，其具有基材以及與上述基材的至少一面接觸的透濕膜，上述透濕膜包含濕氣固化型聚氨酯熱熔樹脂組合物的固化物，上述濕氣固化型聚氨酯熱熔樹脂組合物含有使包含聚乙二醇和/或聚氧乙烯聚氧丙烯二醇(a1)的多元醇(A)與多異氰酸酯(B)進行反應而得到的氨基甲酸酯預聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2390" publication-number="202618183">
    <tif-files tif-type="multi-tif">
      <tif file="114139641.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體燃燒器裝置及加熱調理器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">F24C3/00</main-classification>
        <further-classification edition="200601120260131B">F24C3/12</further-classification>
        <further-classification edition="200601120260131B">F23D14/00</further-classification>
        <further-classification edition="200601120260131B">F23D3/12</further-classification>
        <further-classification edition="200601120260131B">F23D14/46</further-classification>
        <further-classification edition="200601120260131B">F23D14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商林內股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RINNAI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺井一浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸田爽香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUTA, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠抑制剛從單獨燃燒狀態轉移到同時燃燒狀態後發生溢火現象的氣體燃燒器裝置及加熱調理器。本發明的氣體燃燒器裝置(16)具有主燃燒器部(36)與副燃燒器部(38)，主燃燒器部(36)及副燃燒器部(38)同時燃燒之同時燃燒狀態下的最小火力係較僅有副燃燒器部(38)燃燒之單獨燃燒狀態下的最大火力更大，然而，氣體量調節閥(55)之同時燃燒最小火力開度係設定為較單獨燃燒最大火力開度更小。控制手段(60)係在氣體量調節閥(55)的開度較單獨燃燒最大火力開度更小且為同時燃燒最小火力開度以上的中間開度時，打開開閉閥(56)而將燃燒器(39)的燃燒狀態從單獨燃燒狀態切換為同時燃燒狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">16:爐灶燃燒器裝置(氣體燃燒器裝置)</p>
        <p type="p">20:燃燒器主體</p>
        <p type="p">30:燃燒器頭部</p>
        <p type="p">31:主火口</p>
        <p type="p">32:副火口</p>
        <p type="p">36:主燃燒器部</p>
        <p type="p">38:副燃燒器部</p>
        <p type="p">39:燃燒器</p>
        <p type="p">41:主燃燒器部用混合管</p>
        <p type="p">42:副燃燒器部用混合管</p>
        <p type="p">51:共通氣體供給路</p>
        <p type="p">52:主燃燒器部用氣體供給路</p>
        <p type="p">53:副燃燒器部用氣體供給路</p>
        <p type="p">54:安全閥</p>
        <p type="p">55:氣體量調節閥</p>
        <p type="p">56:開閉閥</p>
        <p type="p">57:火力指示手段</p>
        <p type="p">58:點火手段</p>
        <p type="p">59:火焰監測手段</p>
        <p type="p">60:控制器(控制手段)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2391" publication-number="202618184">
    <tif-files tif-type="multi-tif">
      <tif file="114139642.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139642</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體燃燒器裝置及加熱調理器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">F24C3/00</main-classification>
        <further-classification edition="200601120260131B">F24C3/12</further-classification>
        <further-classification edition="200601120260131B">F23D14/00</further-classification>
        <further-classification edition="200601120260131B">F23D3/12</further-classification>
        <further-classification edition="200601120260131B">F23D14/46</further-classification>
        <further-classification edition="200601120260131B">F23D14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商林內股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RINNAI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺井一浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸田爽香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUTA, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠抑制因剛從同時燃燒狀態切換到單獨燃燒狀態後在副燃燒器部產生的黃色火焰而導致煙灰附著於調理容器等被加熱物的氣體燃燒器裝置及加熱調理器。本發明的氣體燃燒器裝置(16)具有主燃燒器部(36)與副燃燒器部(38)，主燃燒器部(36)及副燃燒器部(38)同時燃燒的同時燃燒狀態下的最小火力係較僅有副燃燒器部(38)燃燒的單獨燃燒狀態下的最大火力更大，不過，氣體量調節閥(55)的同時燃燒最小火力開度設定為較單獨燃燒最大火力開度更小。控制手段(60)在氣體量調節閥(55)的開度較單獨燃燒最大火力開度更小且為同時燃燒最小火力開度以上的中間開度時，關閉開閉閥(56)而將燃燒器(39)的燃燒狀態從同時燃燒狀態切換為單獨燃燒狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">16:爐灶燃燒器裝置(氣體燃燒器裝置)</p>
        <p type="p">20:燃燒器主體</p>
        <p type="p">30:燃燒器頭部</p>
        <p type="p">31:主火口</p>
        <p type="p">32:副火口</p>
        <p type="p">36:主燃燒器部</p>
        <p type="p">38:副燃燒器部</p>
        <p type="p">39:燃燒器</p>
        <p type="p">41:主燃燒器部用混合管</p>
        <p type="p">42:副燃燒器部用混合管</p>
        <p type="p">51:共通氣體供給路</p>
        <p type="p">52:主燃燒器部用氣體供給路</p>
        <p type="p">53:副燃燒器部用氣體供給路</p>
        <p type="p">54:安全閥</p>
        <p type="p">55:氣體量調節閥</p>
        <p type="p">56:開閉閥</p>
        <p type="p">57:火力指示手段</p>
        <p type="p">58:點火手段</p>
        <p type="p">59:火焰監測手段</p>
        <p type="p">60:控制器(控制手段)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2392" publication-number="202617026">
    <tif-files tif-type="multi-tif">
      <tif file="114139649.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139649</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行走輪組件及清潔設備</chinese-title>
        <english-title>WALKING WHEEL ASSEMBLY AND CLEANING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47L11/283</main-classification>
        <further-classification edition="200601120260102B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃金虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JINHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種行走輪組件和清潔設備。行走輪組件包括輪支架、滾輪及導向延長件。輪支架提供朝向行進方向的前側傾斜向上的第一導向面；滾輪安裝於輪支架且能夠繞輪軸旋轉；導向延長件安裝於輪支架的行進方向的前側，導向延長件能夠在收起狀態和伸展狀態之間切換。在伸展狀態，導向延長件提供第二導向面，沿著朝向行進方向的前側傾斜向上的方向，第二導向面與第一導向面接續。行走輪組件可以根據障礙物的高度對導向延長件的狀態進行切換，可以提高了越障能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a walking wheel assembly and a cleaning device. The walking wheel assembly includes a wheel bracket, a roller, and a guiding extension member. The wheel bracket provides a first guiding surface inclined upward towards a front side of a traveling direction, the roller is mounted to the wheel bracket and is capable of rotating around a wheel axle, the guiding extension member is mounted to the front side of the traveling direction of the wheel bracket, and the guiding extension member is capable of switching between a retracted state and an extended state. In the extended state, the guiding extension member provides a second guiding surface inclined upward towards the front side of the traveling direction, and the second guiding surface continues with the first guiding surface. The walking wheel assembly may switch the state of the guiding extension member according to a height of an obstacle, thereby improving obstacle-crossing capability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:行走輪組件</p>
        <p type="p">1:輪支架</p>
        <p type="p">11:第一導向面</p>
        <p type="p">2:滾輪</p>
        <p type="p">3:導向延長件</p>
        <p type="p">31:第二導向面</p>
        <p type="p">6:支架轉軸</p>
        <p type="p">8:樞軸</p>
        <p type="p">1000a:第一障礙物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2393" publication-number="202618704">
    <tif-files tif-type="multi-tif">
      <tif file="114139672.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618704</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於擴充實境應用之真實場景表現中之照明</chinese-title>
        <english-title>LIGHTING IN REAL SCENE REPRESENTATION FOR EXTENDED REALITY APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260108B">G06V20/20</main-classification>
        <further-classification edition="202201120260108B">G06V10/141</further-classification>
        <further-classification edition="200601120260108B">G02B27/01</further-classification>
        <further-classification edition="200601120260108B">G02B26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商內數位ＣＥ專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱耶特　皮埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOUET, PIERRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫茲林　帕特里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRTZLIN, PATRICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒列夫爾　西爾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LELIEVRE, SYLVAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費弗　達西耶　艾蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAIVRE D'ARCIER, ETIENNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方丹　盧瓦克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FONTAINE, LOIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種擴充實境系統，其包括一呈現引擎及一場景理解模組，該場景理解模組經組態以依一通用方式管理場景之包含真實光之真實部分之表現。該呈現引擎用場景描述初始化該場景理解模組，該場景描述包括描述用以整合包含真實光之真實場景及擴充實境場景之虛擬部分之參數之資料。該場景理解模組由於自感測器或資料庫獲得之資料而管理一場景理解表現且提醒該呈現引擎進行該場景理解表現之更新。針對該兩個模組之間的互動定義一通用API。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An extended reality system is proposed comprising a presentation engine and a scene understanding module configured to manage representation of the real part of the scene including real light in a generic way. The presentation engine initializes the scene understanding module with the scene description that comprises data describing parameters to integrate the real scene including real light and the virtual part of the extended reality scene. The scene understanding module manages a scene understanding representation thanks to data obtained from sensors or databases and warns the presentation engine of updates of the scene understanding representation. A generic API is defined for interactions between the two modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:具現化/場景理解(SU)模組</p>
        <p type="p">22:場景理解表現</p>
        <p type="p">23:呈現引擎模組/擴充實境場景呈現引擎(PE)</p>
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  <tw-patent-application no="2394" publication-number="202618700">
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          <doc-number>114139673</doc-number>
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      <invention-title>
        <chinese-title>頭像動畫位元串流格式</chinese-title>
        <english-title>AVATAR ANIMATION BITSTREAM FORMAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">G06T13/40</main-classification>
        <further-classification edition="200601120260102B">G06T9/00</further-classification>
        <further-classification edition="201401120260102B">H04N19/70</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商內數位ＣＥ專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈姆扎　亞曼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMZA, AHMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科瓦　雷加泰羅　若奧　佩德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COVA REGATEIRO, JOAO PEDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈瑟蘭　菲利普　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSSELIN, PHILIPPE HENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於對頭像動畫資料進行編碼及解碼之方法及系統。根據對應關係資訊將包含骨架、變形、混合形狀或關鍵點參數之源頭像參數映射至對應目標頭像參數。將該等經映射參數及源參數編碼於包括頭像動畫單元(AAU)之一資料串流中，各AAU具有一標頭及有效負載。組態AAU發信號通知設定檔、時間標度及對應關係索引。控制、變形、關節及關鍵點AAU攜載動畫資料。該資料串流實現頭像動畫之高效跨平台傳輸，且解碼產生並渲染具有經同步動畫之目標頭像網格。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and system for encoding and decoding avatar animation data are disclosed. Source avatar parameters, including skeletal, morph, blendshape or keypoint parameters, are mapped to corresponding target avatar parameters according to correspondence information. The mapped parameters and source parameters are encoded in a data stream comprising avatar animation units (AAUs), each with a header and payload. Configuration AAUs signal profile, timescale and correspondence indices. Control, morph, joint and keypoint AAUs carry animation data. The data stream enables efficient cross-platform transmission of avatar animation, and decoding generates and renders target avatar meshes with synchronized animation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">11:步驟</p>
        <p type="p">12:步驟</p>
        <p type="p">13:步驟</p>
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  <tw-patent-application no="2395" publication-number="202618570">
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        <document-id>
          <doc-number>114139681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多小晶片配置中的動態頻率調整</chinese-title>
        <english-title>DYNAMIC FREQUENCY ADJUSTMENT IN MULTI-CHIPLET ARRANGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F13/36</main-classification>
        <further-classification edition="200601120251201B">G06F13/38</further-classification>
        <further-classification edition="200601120251201B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉斯瓦卡爾　阿尼克特維納亞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHARASWADKAR, ANIKET VINAYAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈埃爾　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOEL, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露大致上係關於多處理器配置，且更具體地係關於用於多小晶片配置的動態頻率調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to multi-processor arrangements and, more particularly, to dynamic frequency adjustments for multi-chiplet arrangements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:處理元件；PE</p>
        <p type="p">120:本機記憶體</p>
        <p type="p">130:交叉(X-bar)互連件</p>
        <p type="p">201:處理核心；核心</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2396" publication-number="202617551">
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        <document-id>
          <doc-number>114139731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>料箱取放方法、管理設備、機器人及倉儲系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">B65G1/04</main-classification>
        <further-classification edition="200601120251128B">B65G1/137</further-classification>
        <further-classification edition="200601120251128B">B65G43/08</further-classification>
        <further-classification edition="200601120251128B">B65G1/06</further-classification>
        <further-classification edition="202301120251128B">G06Q10/087</further-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>中國大陸商深圳市庫寶軟件有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN KUBO SOFTWARE CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商深圳市海柔創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAI ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭睿群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JUI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐聖東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, SHENGDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種料箱取放方法、管理設備、機器人及倉儲系統。該方法應用於倉儲系統中的管理設備，倉儲貨架的各貨架列包括至少一個分組，每個分組的多層存儲位中包括至少一個空閒存儲位，該方法包括：確定機器人待執行的出庫搬運任務，出庫搬運任務用於指示機器人取出並搬運目標存儲位上的出庫料箱；確定目標存儲位對應的目標貨架列上的目標分組中的一個空閒存儲位作為目標入庫位；將入庫搬運任務發送至機器人，入庫搬運任務包括目標入庫位，入庫搬運任務用於指示機器人將搭載的入庫料箱搬運至目標入庫位。本申請的技術方案，能夠使倉儲貨架達到持久穩定的庫位利用率，使倉儲貨架的空閒存儲位均衡分佈，提高機器人的搬運效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2397" publication-number="202617108">
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        <document-id>
          <doc-number>114139754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>椎體間內固定器具</chinese-title>
        <english-title>INTERVERTEBRAL INTERNAL FIXATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">A61F2/44</main-classification>
        <further-classification edition="200601120251231B">A61F2/46</further-classification>
        <further-classification edition="200601120251231B">A61B17/70</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本脊椎紀事股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPINE CHRONICLE JAPAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米澤則隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEZAWA, NORITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一個實施方式為一種椎體間內固定器具，其插入被上側的椎體與下側的椎體夾持的椎間，具備多個獨立的彈性部件，該彈性部件為了與上側和下側的椎體的終板接觸而分別具有上下成對的接觸面，該多個彈性部件單獨地具有上下成對的接觸面之間的彈性。在埋入有椎體間內固定器具的椎間盤腔的上下的椎體終板局部地骨折（破損）了的情況下，與骨折位置接觸的彈性部件會沉降，但能夠抑制對其他的彈性部件的沉降的波及，從而保持為穩定。由此，能夠提供一種椎體間內固定器具，即便是構成椎間盤腔的椎體骨因骨質疏鬆癥等而脆弱的病例，在被埋入的情況下也保持為穩定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One embodiment of the present invention is an intervertebral internal fixation device inserted into the intervertebral space clamped by the upper vertebra and the lower vertebra. It comprises multiple independent elastic members, each elastic member having paired upper and lower contact surfaces to contact the endplates of the upper and lower vertebra respectively. Each of the multiple elastic members independently possesses elasticity between the paired upper and lower contact surfaces. In cases where the upper and lower vertebral endplates, into which the intervertebral internal fixation device is embedded, are locally fractured (damaged), the elastic member in contact with the fracture site will settle, but the spread of settling to other elastic members can be suppressed, thereby maintaining stability. Consequently, it is possible to provide an intervertebral internal fixation device that remains stable even when the vertebral bone forming the intervertebral disc cavity is fragile due to osteoporosis or other conditions after being implanted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1-1、1-2、1-3:彈性板(第1彈性部件)</p>
        <p type="p">2-1、2-2、2-3:接觸面</p>
        <p type="p">3:基部構造</p>
        <p type="p">4:支承梁(第1支承部件)</p>
        <p type="p">10:椎體間內固定器具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2398" publication-number="202619125">
    <tif-files tif-type="multi-tif">
      <tif file="114139761.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139761</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線圖案形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L23/538</main-classification>
        <further-classification edition="200601120260126B">H01L21/768</further-classification>
        <further-classification edition="200601120260126B">G03F7/20</further-classification>
        <further-classification edition="200601120260126B">G03F9/00</further-classification>
        <further-classification edition="200601120260126B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤正紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野恭志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為提升基板上FO－WLP之配線圖案形成中之處理量，曝光裝置，具備：空間光調變器；作成部，從測量在第1基板上配置複數個之半導體晶片組各個中所含之半導體晶片之位置的測量系統取得測量結果，根據測量結果，決定將半導體晶片間加以連接之配線圖案，在生成所決定之配線圖案時作成利用於空間光調變器之控制的第1控制資料，將之儲存於第1記憶部；以及曝光處理部，使用第1控制資料控制空間光調變器，以曝光出將半導體晶片間加以連接之配線圖案；在曝光處理部對與第1基板不同之第2基板進行曝光處理之期間，實施第1基板上之半導體晶片之位置的測量、測量結果的取得、配線圖案的決定、第1控制資料的作成、以及第1控制資料往第1記憶部的儲存中之至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">30L、30R:基板載台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2399" publication-number="202617708">
    <tif-files tif-type="multi-tif">
      <tif file="114139767.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>丙烯醯胺類化合物及其醫藥用途</chinese-title>
        <english-title>ACRYLAMIDE COMPOUNDS AND PHARMACEUTICAL USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C07D403/06</main-classification>
        <further-classification edition="200601120251103B">C07D401/06</further-classification>
        <further-classification edition="200601120251103B">C07D405/12</further-classification>
        <further-classification edition="200601120251103B">C07D401/14</further-classification>
        <further-classification edition="200601120251103B">C07D471/04</further-classification>
        <further-classification edition="200601120251103B">C07D487/04</further-classification>
        <further-classification edition="200601120251103B">C07D413/14</further-classification>
        <further-classification edition="200601120251103B">A61K31/506</further-classification>
        <further-classification edition="200601120251103B">A61K31/4439</further-classification>
        <further-classification edition="200601120251103B">A61K31/519</further-classification>
        <further-classification edition="200601120251103B">A61K31/437</further-classification>
        <further-classification edition="200601120251103B">A61K31/4709</further-classification>
        <further-classification edition="200601120251103B">A61K31/444</further-classification>
        <further-classification edition="200601120251103B">A61K31/4985</further-classification>
        <further-classification edition="200601120251103B">A61K31/4196</further-classification>
        <further-classification edition="200601120251103B">A61K31/553</further-classification>
        <further-classification edition="200601120251103B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州百誠醫藥科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU BIO-SINCERITY PHARMA-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苗雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIAO, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林遠望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUANWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫亞男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷少偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, SHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚世界</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, SHIJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭軍凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JUNKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈錫明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, XIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮恩光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, ENGUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王江海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIANGHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樓金芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, JINFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及醫藥技術領域，具體涉及XPO1抑制劑、其製備方法及其在醫藥上的應用。本發明提供了一種式（IA）或（IB）所述XPO1抑制劑及其組合物及用途，所述化合物可以用於治療或預防XPO1介導的疾病或病症及相關疾病或病症。&lt;br/&gt;&lt;img align="absmiddle" height="171px" width="368px" file="ed10207.JPG" alt="ed10207.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of pharmaceutical technology, specifically to XPO1 inhibitors, methods for preparation, and their pharmaceutical applications. The present invention provides XPO1 inhibitors of Formula (IA) or (IB), their compositions and uses thereof. The compounds of the present invention can be used to treat or prevent XPO1-mediated diseases or conditions and related diseases or conditions.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2400" publication-number="202618463">
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      <tif file="114139768.zip" no="1">
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      <isuno>9</isuno>
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          <doc-number>202618463</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>曝光設備、曝光方法及物品製造方法</chinese-title>
        <english-title>EXPOSURE APPARATUS, EXPOSURE METHOD, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G03F7/20</main-classification>
        <further-classification edition="200601120260115B">G03F9/00</further-classification>
        <further-classification edition="200601120260115B">H01L21/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤隆紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種曝光設備，用於對基板上的照射區域進行掃描曝光，包含：平台，被配置以保持該基板；測量裝置，被配置以在曝光之前針對沿該基板的掃描方向排列在該照射區域中的複數個測量區域中的每一個測量表面高度；以及控制器，被配置以控制該平台的驅動，其中，該複數個測量區域包括第一測量區域和第二測量區域，以及其中，該控制器被配置以根據針對該第一測量區域和該第二測量區域的表面高度的測量值，控制該平台的驅動，以在該第一測量區域的曝光中將該第一測量區域的該表面高度佈置在目標高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an exposure apparatus that performs scanning exposure to a shot region on a substrate, comprising: a stage configured to hold the substrate; a measurement device configured to measure a surface height prior to exposure for each of a plurality of measurement regions arrayed in the shot region along a scanning direction of the substrate; and a controller configured to control driving of the stage, wherein the plurality of measurement regions include a first and second measurement regions, and wherein the controller is configured to control, based on measurement values of surface heights for the first and second measurement regions, driving of the stage to arrange the surface height of the first measurement region at a target height in exposure of the first measurement region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:照明光學系統</p>
        <p type="p">12:原板</p>
        <p type="p">13:原板平台</p>
        <p type="p">13a:箭頭</p>
        <p type="p">14:投影光學系統</p>
        <p type="p">15:基板</p>
        <p type="p">16:基板平台</p>
        <p type="p">16a:箭頭</p>
        <p type="p">17:測量裝置</p>
        <p type="p">18:條形反射鏡</p>
        <p type="p">19:條形反射鏡</p>
        <p type="p">20:控制器</p>
        <p type="p">21:干涉儀</p>
        <p type="p">22:干涉儀</p>
        <p type="p">23:原板驅動機構</p>
        <p type="p">24:基板驅動機構</p>
        <p type="p">100:曝光設備</p>
        <p type="p">170:光源</p>
        <p type="p">171:準直透鏡</p>
        <p type="p">172:狹縫構件</p>
        <p type="p">172a:接合面</p>
        <p type="p">173:光學系統</p>
        <p type="p">174:反射鏡</p>
        <p type="p">175:反射鏡</p>
        <p type="p">176:光接收光學系統</p>
        <p type="p">177:校正光學系統</p>
        <p type="p">178:光電轉換器</p>
        <p type="p">179:處理器</p>
        <p type="p">AX:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2401" publication-number="202619173">
    <tif-files tif-type="multi-tif">
      <tif file="114139773.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卡緣連接器</chinese-title>
        <english-title>CARD EDGE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260115B">H01R12/72</main-classification>
        <further-classification edition="200601120260115B">H01R13/40</further-classification>
        <further-classification edition="200601120260115B">H01R13/42</further-classification>
        <further-classification edition="200601120260115B">H01R13/46</further-classification>
        <further-classification edition="200601120260115B">H01R13/639</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳兆軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHAO-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐國峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古曉琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, XIAO-QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉大隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TA-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印小虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, XIAO-HU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種卡緣連接器，包括：底座，設置有卡槽；耳扣，樞接於底座；滑動片，滑動連接於底座，滑動片的第一端與耳扣之間設置有連動結構；導向塊，連接於滑動片的第二端；彈力件，連接於滑動片與底座之間；其中，插接部插入卡槽時，插接部的一端抵於導向塊並帶動滑動片沿第一方向移動，以使連動結構帶動耳扣轉動至關閉狀態，同時彈力件發生形變；插接部接近於導向塊的一端遠離卡槽時，彈力件恢復形變並帶動滑動片沿第二方向移動，以使連動結構帶動耳扣轉動至打開狀態。用戶插入或拔出板卡時，耳扣可以自動地發生關閉或釋放，使得板卡插拔更加方便。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a card edge connector, including: a base having a card slot; an ear buckle pivotally connected to the base; a sliding plate slidably connected to the base, with a linkage structure being provided between a first end of the sliding plate and the ear buckle; a guide block connected to a second end of the sliding plate; and an elastic member connected between the sliding plate and the base. When a plug-in of a card is inserted into the card slot, one end of the plug-in part abuts against the guide block and drives the sliding plate to move in a first direction, so that the linkage structure drives the ear buckle to rotate to a closed state, and the elastic member deforms at the same time. When the end of the plug-in close to the guide block moves away from the card slot, the elastic member recovers and drives the sliding plate to move in a second direction, so that the linkage structure drives the ear buckle to rotate to an open state. When a user inserts or removes the card, the ear buckle can automatically close or release, making the insertion and removal of the card more convenient.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:卡緣連接器</p>
        <p type="p">10:底座</p>
        <p type="p">11:卡槽</p>
        <p type="p">15:固定槽</p>
        <p type="p">20:耳扣</p>
        <p type="p">23:擋塊</p>
        <p type="p">30:滑動片</p>
        <p type="p">31:第一端</p>
        <p type="p">32:第二端</p>
        <p type="p">40:導向塊</p>
        <p type="p">60:殼蓋</p>
        <p type="p">61:開口</p>
        <p type="p">70:連動結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2402" publication-number="202619255">
    <tif-files tif-type="multi-tif">
      <tif file="114139814.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種供電電路以及用於控制切換式電源電路的控制電路</chinese-title>
        <english-title>A POWER SUPPLY CIRCUIT AND A CONTROL CIRCUIT FOR CONTROLLING A SWITCHING POWER SUPPLY CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H02M3/156</main-classification>
        <further-classification edition="200601120260109B">H02M1/08</further-classification>
        <further-classification edition="200601120260109B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張煜昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請請求保護一種用於控制切換式電源電路的控制電路。當切換式電源電路被配置為經第一電源軌耦合至下游電路，並經下游電路耦接至第二電源軌進而耦接至目標負載時，切換式電源電路需要對輸入電壓進行轉換，從而在所述第一電源軌上產生第一輸出電壓以及在所述第二電源軌上產生第二輸出電壓。本申請同時利用了表徵第一輸出電壓的第一電壓回饋訊號和表徵第二輸出電壓的第二電壓回饋訊號來參與產生控制電路的輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention claims protection for a control circuit for a switching power supply circuit. When the switching power supply circuit is configured to be coupled to a downstream circuit via a first power rail, the downstream circuit is configured to be coupled to the target load via a second power rail, the switching power supply circuit needs to convert an input voltage to generate a first output voltage on the first power rail and a second output voltage on the second power rail. The present application utilizes both a first voltage feedback signal representing the first output voltage and a second voltage feedback signal representing the second output voltage to generate the output signal of the control circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:切換式電源電路</p>
        <p type="p">102:下游電路</p>
        <p type="p">103:目標負載</p>
        <p type="p">104:比較電路</p>
        <p type="p">105:恆定時間產生電路</p>
        <p type="p">106:邏輯電路</p>
        <p type="p">107:第一電源軌</p>
        <p type="p">110:誤差放大電路</p>
        <p type="p">111:第一電壓比較電路</p>
        <p type="p">200:供電電路</p>
        <p type="p">C1:第一電容</p>
        <p type="p">C2:第二電容</p>
        <p type="p">Ctrl:控制訊號</p>
        <p type="p">L1:第一電感</p>
        <p type="p">L2:第二電感</p>
        <p type="p">Q:輸出端</p>
        <p type="p">R:重設端</p>
        <p type="p">S:設定端</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">T2:第二端子</p>
        <p type="p">T3:第三端子</p>
        <p type="p">T4:第四端子</p>
        <p type="p">Tc:固定時間控制訊號</p>
        <p type="p">Vc:誤差放大訊號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vldd:第一輸出電壓</p>
        <p type="p">Vlfb:第一電壓回饋訊號</p>
        <p type="p">Vref:參考電壓訊號</p>
        <p type="p">Vrfb:第二電壓回饋訊號</p>
        <p type="p">Vrdd:第二輸出電壓</p>
        <p type="p">Vshot:單脈衝訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2403" publication-number="202617390">
    <tif-files tif-type="multi-tif">
      <tif file="114139816.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>把持裝置及控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251226B">B25J15/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美倍亞三美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEBEA MITSUMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤一瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇野寿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNO, JUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井悠貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明檢測所把持的對象物的脫落。  &lt;br/&gt;把持裝置（1）包括用於把持對象物（200）的把持部（7）、根據馬達（5）的旋轉力來對把持部（7）進行驅動的驅動機構（6）、以及對馬達（5）進行驅動的馬達驅動控制裝置（2）。馬達驅動控制裝置（2）在藉由把持部（7）對對象物（200）進行把持後進行判定對象物（200）是否自把持部（7）脫落的脫落判定處理。馬達驅動控制裝置（2）在脫落判定處理中對開始馬達（5）的線圈（51a、51b）的激磁起至電流（Ia、Ib）達到電流基準值（Ith）為止的時間即電流上升時間（dT）進行多次測定，並基於電流上升時間（dT）有無變化來判定對象物（200）是否自把持部（7）脫落。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:把持裝置</p>
        <p type="p">2:馬達驅動控制裝置</p>
        <p type="p">3:控制電路</p>
        <p type="p">4:驅動電路</p>
        <p type="p">5:馬達(步進馬達)</p>
        <p type="p">6:驅動機構</p>
        <p type="p">7:把持部</p>
        <p type="p">8_1、8_2:移動部</p>
        <p type="p">9_1、9_2:指部</p>
        <p type="p">200:對象物</p>
        <p type="p">P:中心位置</p>
        <p type="p">Sc:驅動指令訊號</p>
        <p type="p">Sd、Sda、Sdb:驅動控制訊號</p>
        <p type="p">Sia、Sib:電流檢測訊號</p>
        <p type="p">Vbef:電壓</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2404" publication-number="202619224">
    <tif-files tif-type="multi-tif">
      <tif file="114139819.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139819</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電芯均衡電路及蓄電池裝置</chinese-title>
        <english-title>CELL BALANCING CIRCUIT AND BATTERY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H02J7/10</main-classification>
        <further-classification edition="200601120251201B">H01M10/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商艾普凌科有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABLIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電芯均衡電路，其可對串聯連接的各電池電芯始終進行電芯均衡動作。一種電芯均衡電路（100），對產生電芯電壓（V1）的電池電芯（11）與和電池電芯（11）串聯連接且產生電芯電壓（V2）的電池電芯（12）的電芯均衡進行控制，所述電芯均衡電路（100）具有：分壓電路（103），輸出作為電池電芯（11）與電池電芯（12）的平均電壓的分壓電壓（Vd1）；差分電壓電流轉換器（101），使電芯均衡電流（Ib1）從電池電芯（11）放電，所述電芯均衡電流（Ib1）是根據從分壓電壓（Vd1）減去電芯電壓（V2）後的電壓差而產生；以及差分電壓電流轉換器（102），使電芯均衡電流（Ib2）從電池電芯（12）放電，所述電芯均衡電流（Ib2）是根據使正負反向後的所述電壓差而產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a cell balancing circuit capable of constantly performing cell balancing operation for each battery cell connected in series. A cell balancing circuit 100 that controls cell balancing between a battery cell 11 that generates a cell voltage V1 and a battery cell 12 which is connected in series with the battery cell 11 and generates a cell voltage V2, including: a voltage divider circuit 103 that outputs a voltage divider voltage Vd1 as an average voltage of the battery cell 11 and the battery cell 12; a differential voltage-to-current converter 101 that discharges a cell balancing current Ib1 generated according to a voltage difference obtained by subtracting the cell voltage V2 from the voltage divider voltage Vd1 from the battery cell 11; and a differential voltage-to-current converter 102 that discharges from the battery cell 12 a cell balancing current Ib2 generated according to the voltage difference with polarity reversed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:蓄電池裝置</p>
        <p type="p">11:電池電芯(第一電池電芯)</p>
        <p type="p">11a、12a:電池</p>
        <p type="p">11b、12b:內部電阻</p>
        <p type="p">12:電池電芯(第二電池電芯)</p>
        <p type="p">100:電芯均衡電路</p>
        <p type="p">101:差分電壓電流轉換器(第一差分電壓電流轉換器)</p>
        <p type="p">102:差分電壓電流轉換器(第二差分電壓電流轉換器)</p>
        <p type="p">103:分壓電路(第一分壓電路)</p>
        <p type="p">103a、103b、R1a、R1b、R2a、R2b:電阻</p>
        <p type="p">C1、C2:電容器</p>
        <p type="p">CB1、CB2、VC1、VC2、VDD、VSS:端子</p>
        <p type="p">EB+:外部正極端子</p>
        <p type="p">EB-:外部負極端子</p>
        <p type="p">Ib1:電芯均衡電流(第一電芯均衡電流)</p>
        <p type="p">Ib2:電芯均衡電流(第二電芯均衡電流)</p>
        <p type="p">Id:放電電流</p>
        <p type="p">LD:負載</p>
        <p type="p">P:主電流路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2405" publication-number="202617813">
    <tif-files tif-type="multi-tif">
      <tif file="114139826.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光固化樹脂、製備方法及應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251226B">C08F283/10</main-classification>
        <further-classification edition="202001120251226B">B33Y70/10</further-classification>
        <further-classification edition="200601120251226B">C08F2/48</further-classification>
        <further-classification edition="200601120251226B">C08F220/18</further-classification>
        <further-classification edition="200601120251226B">C08K5/34</further-classification>
        <further-classification edition="200601120251226B">C08K5/37</further-classification>
        <further-classification edition="200601120251226B">C08K5/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海飛凱材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何洪聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋述國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種光固化樹脂、製備方法及應用，屬於光固化3D列印技術領域。本申請提供的光固化樹脂包括丙烯酸酯低聚物、活性稀釋劑、多官能度硫醇、阻聚劑、苯並噁唑類吸收劑和紫外線吸收劑，其中，丙烯酸酯低聚物和活性稀釋劑為光固化樹脂的主體，在此基礎上同時添加多官能度硫醇和阻聚劑，可以在提高固化速率的同時抑制低能量下的反應速度，在提升固化度的同時，降低固化厚度，有利於提高列印精度。並且，通過添加苯並噁唑類吸收劑和紫外線吸收劑，也可以降低固化厚度，各組分發揮協同作用，從而提高列印精度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2406" publication-number="202617302">
    <tif-files tif-type="multi-tif">
      <tif file="114139833.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉬鈮合金燒結坯及其製備方法、鉬鈮合金靶材及其用途</chinese-title>
        <english-title>MOLYBDENUM-NIOBIUM ALLOY SINTERED ADOBE AND PREPARATION METHOD THEREOF, MOLYBDENUM-NIOBIUM ALLOY TARGET AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251022B">B22F3/10</main-classification>
        <further-classification edition="200601120251022B">C22C27/04</further-classification>
        <further-classification edition="200601120251022B">C23C14/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中鎢稀有金屬新材料（湖南）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CMT RARE METAL ADVANCED MATERIALS (HUNAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏修宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, XIU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易小明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, XIAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙騰飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, TENG-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋立強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, LI-QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係鉬鈮合金靶材技術領域，具體係一種鉬鈮合金燒結坯及其製備方法、鉬鈮合金靶材及其用途。其製備方法之步驟係將一鉬鈮合金壓坯進行一燒結處理，得到一鉬鈮合金燒結坯。其中，該鉬鈮合金壓坯中包含鉬真空粉和氫化鈮粉，而該燒結處理包含一真空低溫燒結和一氫氣氣氛高溫燒結，該真空低溫燒結之溫度係介於1300℃至1500℃之間，而該氫氣氣氛高溫燒結之溫度係介於2000℃至2250℃之間。且，該鉬鈮合金燒結坯之內部組織無氣孔、裂紋、分層、夾雜等缺陷、緻密度係大於99%、氧含量係小於100ppm、氫含量係小於10ppm、燒結坯的晶粒均勻，且平均晶粒尺寸係小於55μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the technical field of molybdenum-niobium alloy target materials, and particularly relates to a molybdenum-niobium alloy sintered adobe and preparation method thereof, molybdenum-niobium alloy target and use thereof. The preparation method comprises sintering a molybdenum-niobium alloy compact to obtain a molybdenum-niobium alloy sintered adobe.The molybdenum-niobium alloy compact contains molybdenum vacuum powder and niobium hydride powder, and the sintering process includes vacuum low temperature sintering and hydrogen atmosphere high temperature sintering. The vacuum low temperature sintering is between 1300°C and 1500°C, while the hydrogen atmosphere high temperature sintering is between 2000°C and 2250°C.The molybdenum-niobium alloy sintered adobe has an internal structure free of defects such as pores, cracks, delamination, or inclusions, a density greater than 99%, an oxygen content less than 100 ppm, a hydrogen content less than 10 ppm, and uniform grains with an average grain size less than 55 μm.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2407" publication-number="202617469">
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      <tif file="114139840.zip" no="1">
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        <document-id>
          <doc-number>202617469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>座椅</chinese-title>
        <english-title>SEAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251217B">B60N2/26</main-classification>
        <further-classification edition="201801120251217B">B60N2/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡問渠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WENQU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇映平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YINGPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉開勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KAIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮軍靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, JUNJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳燕民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YANMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提出了一種座椅，包括：承載組件；支撐組件，設置在承載組件下方，用以支撐承載組件，支撐組件包括底架，底架的前端與承載組件連接，底架與承載組件之間的間隙從底架的前端朝底架的後端逐漸增大；安全擋件，位於底架的前端和底架的後端之間，連接承載組件與支撐組件以遮蓋底架與承載組件之間的間隙。本公開的座椅透過安全擋件能有效防止嬰幼兒鑽入承載組件與支撐組件之間的間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a seat, including a carrying component, a supporting component, and a safety shield. The supporting component is disposed below the carrying component and configured to support the carrying component. The supporting component includes a base frame, a front end of the base frame is connected to the carrying component, and a gap between the base frame and the carrying component gradually increases from a front end of the base frame toward a rear end of the base frame. The safety shield is located between the front end of the base frame and the rear end of the base frame, and connected to the carrying component and the supporting component to cover a gap between the base frame and the carrying component. The seat of the present disclosure can effectively prevent an infant from getting into the gap between the carrying component and the supporting component through the safety shield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:座椅</p>
        <p type="p">200:承載組件</p>
        <p type="p">220:座布</p>
        <p type="p">221:座位部分</p>
        <p type="p">222:背靠部分</p>
        <p type="p">300:支撐組件</p>
        <p type="p">310:支撐件</p>
        <p type="p">320:底架</p>
        <p type="p">500:安全擋件</p>
        <p type="p">510:上側</p>
        <p type="p">520:下側、第二側邊</p>
        <p type="p">522:連接件</p>
        <p type="p">523:連接部</p>
        <p type="p">524:結合部</p>
        <p type="p">530:遮擋片</p>
        <p type="p">600:提手</p>
        <p type="p">5241:第一結合部</p>
        <p type="p">5242:第二結合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2408" publication-number="202618540">
    <tif-files tif-type="multi-tif">
      <tif file="114139842.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於資料存取管理的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DATA ACCESS MANAGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F3/06</main-classification>
        <further-classification edition="200601120251201B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　永蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNGSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　宗旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZONGWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提供用於資料存取管理的系統和方法。該方法包括由裝置確定裝置的第一命令佇列中的第一命令和裝置的第二命令佇列中的第二命令與記憶體中的相同位址關聯，第一命令佇列經組態以儲存與第二命令佇列不同的命令類型，確定第一命令相對於第二命令具有執行優先權，由裝置發送第一命令以供執行，以及由裝置對第二命令暫停執行，使得第二命令基於正在執行的第一命令而保留在第二命令佇列中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are systems and methods for data access management. A method includes determining, by a device, that a first command in a first command queue of the device and a second command in a second command queue of the device are associated with a same address in a memory, the first command queue being configured to store a command type different from that of the second command queue, determining that the first command has a priority of execution over the second command, sending, by the device, the first command to be executed, and placing, by the device, a hold on the second command, such that the second command is retained in the second command queue based on the first command being executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5000:方法</p>
        <p type="p">5001、5002、5003、5004:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2409" publication-number="202617784">
    <tif-files tif-type="multi-tif">
      <tif file="114139915.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橡膠改質用纖維素纖維、橡膠改質用纖維素纖維水分散體、橡膠組成物及其製造方法、橡膠複合物、以及交聯橡膠組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08B15/00</main-classification>
        <further-classification edition="200601120260102B">C08L1/02</further-classification>
        <further-classification edition="200601120260102B">C08L21/00</further-classification>
        <further-classification edition="200601120260102B">C08K3/06</further-classification>
        <further-classification edition="200601120260102B">C08K5/14</further-classification>
        <further-classification edition="200601120260102B">C08K7/02</further-classification>
        <further-classification edition="200601120260102B">C08J3/20</further-classification>
        <further-classification edition="200601120260102B">C08J5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商王子控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJI HOLDINGS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KOH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横内秀行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOUCHI, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神林洸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBAYASHI, KO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種橡膠改質用纖維素纖維、橡膠改質用纖維素纖維水分散體、含有該橡膠改質用纖維素纖維與橡膠成分的橡膠組成物及其製造方法、使用所述橡膠組成物的橡膠複合物以及使所述橡膠複合物交聯而成的交聯橡膠組成物，所述橡膠改質用纖維素纖維藉由添加於橡膠成分中，從而在交聯後獲得的交聯橡膠組成物中，特別是低伸長率區域中的模數提高效果優異。本發明的橡膠改質用纖維素纖維含有不規則游離度為850 mL以下、且長度加權平均纖維長度為0.4 mm以上的粗大纖維素纖維。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:圓筒</p>
        <p type="p">2:進料部</p>
        <p type="p">3:片狀混合物</p>
        <p type="p">4:刮板</p>
        <p type="p">10:雙滾筒烘乾機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2410" publication-number="202619267">
    <tif-files tif-type="multi-tif">
      <tif file="114139916.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減速機的角度傳遞誤差之估計方法及估計裝置、以及馬達之控制方法及控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251103B">H02P21/16</main-classification>
        <further-classification edition="201601120251103B">H02P21/18</further-classification>
        <further-classification edition="201601120251103B">H02P21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科儀器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC INSTRUMENTS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人長岡技術科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横倉勇希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOKURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大石潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHISHI, KIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鶴岡拓海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUOKA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲　春胜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BO, XUANTHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花岡正志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANAOKA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口翔大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在具有馬達、負載、以及其輸入軸藉由馬達驅動且其輸出軸上連接有負載的減速機的設備中，於以運算量估計減速機的角度傳遞誤差時，該設備被分成由減速機及負載組成的負載側設備、與包含馬達且係從馬達至減速機之輸入軸的部分的馬達側設備。基於在負載中測定的加速度與馬達之旋轉的角速度，使用與負載側設備對應的觀測器（減速機ATE觀測器），計算減速機的角度傳遞誤差所導致之負載側速度的振動成分的估計值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">17:編碼器</p>
        <p type="p">20:減速機</p>
        <p type="p">30:負載</p>
        <p type="p">31:加速度感測器</p>
        <p type="p">35:馬達及帶部分</p>
        <p type="p">41:負載側設備</p>
        <p type="p">42:馬達側設備</p>
        <p type="p">51:減速機ATE觀測器</p>
        <p type="p">61:微分器</p>
        <p type="p">62:位置速度控制器</p>
        <p type="p">63:減法元件</p>
        <p type="p">64:逆傳遞函數運算部</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;、D&lt;sub&gt;m&lt;/sub&gt;:黏滯阻尼</p>
        <p type="p">D&lt;sub&gt;s&lt;/sub&gt;:扭轉阻尼</p>
        <p type="p">i&lt;sub&gt;cmps&lt;/sub&gt;:補償電流</p>
        <p type="p">i&lt;sub&gt;q&lt;/sub&gt;:q軸電流</p>
        <p type="p">
        &lt;img align="absmiddle" height="37px" width="31px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;:q軸電流指令</p>
        <p type="p">J&lt;sub&gt;1&lt;/sub&gt;、J&lt;sub&gt;m&lt;/sub&gt;:慣量</p>
        <p type="p">k:常數</p>
        <p type="p">K&lt;sub&gt;s&lt;/sub&gt;:扭轉剛性</p>
        <p type="p">K&lt;sub&gt;t&lt;/sub&gt;:扭矩常數</p>
        <p type="p">R:綜合減速比</p>
        <p type="p">R&lt;sub&gt;b&lt;/sub&gt;:帶的減速比</p>
        <p type="p">s:拉普拉斯算子</p>
        <p type="p">T'&lt;sub&gt;m&lt;/sub&gt;(s):逆傳遞函數</p>
        <p type="p">α&lt;sub&gt;11&lt;/sub&gt;:加速度</p>
        <p type="p">θ&lt;sub&gt;m&lt;/sub&gt;:旋轉角度(馬達的位置)</p>
        <p type="p">θ&lt;sub&gt;s&lt;/sub&gt;:扭轉角</p>
        <p type="p">
        &lt;img align="absmiddle" height="30px" width="26px" file="d10002.TIF" alt="其他非圖式ed10002.png" img-content="character" orientation="portrait" inline="no" giffile="ed10002.png"&gt;
        &lt;/img&gt;:扭轉角速度</p>
        <p type="p">μ:常數</p>
        <p type="p">τ&lt;sub&gt;belt&lt;/sub&gt;:帶外部干擾扭矩</p>
        <p type="p">τ&lt;sub&gt;s&lt;/sub&gt;:扭轉扭矩</p>
        <p type="p">
        &lt;img align="absmiddle" height="28px" width="20px" file="d10003.TIF" alt="其他非圖式ed10003.png" img-content="character" orientation="portrait" inline="no" giffile="ed10003.png"&gt;
        &lt;/img&gt;:扭轉扭矩的估計值</p>
        <p type="p">τ&lt;sub&gt;step&lt;/sub&gt;:步階性外部干擾扭矩</p>
        <p type="p">
        &lt;img align="absmiddle" height="33px" width="33px" file="d10004.TIF" alt="其他非圖式ed10004.png" img-content="character" orientation="portrait" inline="no" giffile="ed10004.png"&gt;
        &lt;/img&gt;:馬達側外部干擾扭矩</p>
        <p type="p">ω&lt;sub&gt;err&lt;/sub&gt;:角度傳遞誤差</p>
        <p type="p">
        &lt;img align="absmiddle" height="25px" width="40px" file="d10005.TIF" alt="其他非圖式ed10005.png" img-content="character" orientation="portrait" inline="no" giffile="ed10005.png"&gt;
        &lt;/img&gt;:角度傳遞誤差的估計值</p>
        <p type="p">
        &lt;img align="absmiddle" height="27px" width="43px" file="d10006.TIF" alt="其他非圖式ed10006.png" img-content="character" orientation="portrait" inline="no" giffile="ed10006.png"&gt;
        &lt;/img&gt;:角度傳遞誤差的一階微分的估計值</p>
        <p type="p">ω&lt;sub&gt;1&lt;/sub&gt;、ω&lt;sub&gt;11&lt;/sub&gt;:速度</p>
        <p type="p">ω&lt;sub&gt;m&lt;/sub&gt;:角速度</p>
        <p type="p">
        &lt;img align="absmiddle" height="29px" width="31px" file="d10007.TIF" alt="其他非圖式ed10007.png" img-content="character" orientation="portrait" inline="no" giffile="ed10007.png"&gt;
        &lt;/img&gt;:角速度的一階微分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2411" publication-number="202618376">
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      <tif file="114139918.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G02B11/30</main-classification>
        <further-classification edition="202101120260121B">G02B7/02</further-classification>
        <further-classification edition="200601120260121B">G02B9/60</further-classification>
        <further-classification edition="200601120260121B">G02B3/00</further-classification>
        <further-classification edition="200601120260121B">G02B13/00</further-classification>
        <further-classification edition="200601120260121B">G02B13/06</further-classification>
        <further-classification edition="200601120260121B">G02B23/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖華濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUABIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUNG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬靜如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學成像鏡頭，其從物側至像側依序包括第一、第二、第三、第四及第五透鏡。本發明透過控制透鏡的凹凸曲面排列及滿足至少兩條件式，使光學成像鏡頭具有較小的體積與大的視場角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an optical imaging lens. The optical imaging lens comprises five lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and satisfying at least two inequalities, the optical imaging lens may be provided with smaller volume and great field of view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學成像鏡頭</p>
        <p type="p">STO:光圈</p>
        <p type="p">L1:第一透鏡</p>
        <p type="p">L2:第二透鏡</p>
        <p type="p">L3:第三透鏡</p>
        <p type="p">L4:第四透鏡</p>
        <p type="p">L5:第五透鏡</p>
        <p type="p">TF:濾光片</p>
        <p type="p">IMA:成像面</p>
        <p type="p">L1A1,L2A1,L3A1,L4A1,L5A1,TFA1:物側面</p>
        <p type="p">L1A2,L2A2,L3A2,L4A2,L5A2,TFA2:像側面</p>
        <p type="p">L1A1C,L1A2C,L2A1C,L2A2C,L3A1C,L3A2C,L4A1C,L4A2C,L5A1C,L5A2C:光軸區域</p>
        <p type="p">L1A1P,L1A2P,L2A1P,L2A2P,L3A1P,L3A2P,L4A1P,L4A2P,L5A1P,L5A2P:圓周區域</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2412" publication-number="202617860">
    <tif-files tif-type="multi-tif">
      <tif file="114139941.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纖維素纖維、纖維素纖維水分散體、橡膠複合材及其製造方法、橡膠複合物、及交聯橡膠組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L1/00</main-classification>
        <further-classification edition="200601120260102B">C08L21/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/14</further-classification>
        <further-classification edition="200601120260102B">C08K7/02</further-classification>
        <further-classification edition="200601120260102B">C08J3/03</further-classification>
        <further-classification edition="200601120260102B">C08J3/20</further-classification>
        <further-classification edition="200601120260102B">C08J3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商王子控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJI HOLDINGS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KOH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横内秀行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOUCHI, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神林洸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBAYASHI, KO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於提供一種纖維素纖維、該纖維素纖維的水分散體（纖維素纖維水分散體）、含有橡膠成分及該纖維素纖維的橡膠複合材、含有該橡膠複合材及交聯劑的橡膠複合物、使該橡膠複合物交聯而成的交聯橡膠組成物，所述纖維素纖維藉由添加於橡膠成分中，從而在交聯後獲得的交聯橡膠組成物中，低伸長率區域中的模數提高效果優異，且可充分維持交聯橡膠組成物的拉伸伸長率，進而提供所述橡膠複合材的製造方法。本發明的纖維素纖維在製成固體成分濃度0.2質量%的水分散體、並在下述條件下進行離心分離而獲得沈澱物及上清液時，沈澱物包含粗大纖維素纖維，沈澱物的不規則游離度為950 mL以下，上清液中的固體成分包含纖維寬度100 nm以下的微細纖維狀纖維素。  &lt;br/&gt;條件：以12,000 G進行10分鐘離心分離</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:圓筒</p>
        <p type="p">2:進料部</p>
        <p type="p">3:片狀混合物</p>
        <p type="p">4:刮板</p>
        <p type="p">10:雙滾筒烘乾機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2413" publication-number="202619384">
    <tif-files tif-type="multi-tif">
      <tif file="114139967.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139967</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切換方法與設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR HANDOVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260124B">H04W36/18</main-classification>
        <further-classification edition="200901120260124B">H04W36/34</further-classification>
        <further-classification edition="200901120260124B">H04W24/10</further-classification>
        <further-classification edition="202401120260124B">H04W74/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商聯發科技（新加坡）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余倉緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TSANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供切換方法與設備。其中一種切換方法，包括：由設備的處理器向網路節點發送報告，其中該報告包括在接收到切換命令之後中斷時間將開始的最早時機的資訊；由該處理器從該網路節點接收該切換命令；以及由該處理器在發送該報告後和該中斷時間之前與該網路節點進行通信。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for handover are provided. In one novel aspect, a method may involve transmitting, by a processor of an apparatus, a report comprising information regarding an earliest time occasion that an interrupted time will start after receiving a handover command to a network node; receiving, by the processor, the handover command from the network node; and communicating, by the processor, with the network node after transmitting the report and before the interrupted time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:過程</p>
        <p type="p">710-730:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2414" publication-number="202618986">
    <tif-files tif-type="multi-tif">
      <tif file="114139977.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251219B">H01L21/67</main-classification>
        <further-classification edition="200601120251219B">G05B19/04</further-classification>
        <further-classification edition="200601120251219B">G05B19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口龍太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅澤義弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEZAWA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>望月宏朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIZUKI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋栄治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠高精度地進行各處理單元之動作優化的基板處理裝置等。  &lt;br/&gt;基板處理裝置具備：複數個單元控制器，其等進行對應之處理單元之動作優化；主控制器，其依照基板處理裝置之指示，向各單元控制器指示對應之處理單元之動作；及記憶部。主控制器自各單元控制器獲取優化結果之群，基於優化結果，導出評估值及與各單元控制器對應之時間序列控制參數之群。主控制器將包含所導出之評估值及時間序列控制參數之群的資料集與上述指示或上述指示中之一時點建立關聯並記憶。主控制器對各指示或對一指示中之各時點進行上述處理，並記憶與各指示或各時點建立關聯之複數個資料集。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:控制部(上位控制器)</p>
        <p type="p">5:下位控制器</p>
        <p type="p">5a:壓力調節控制器</p>
        <p type="p">5b:電源調節控制器</p>
        <p type="p">5c:氣體流量調節控制器</p>
        <p type="p">5d:ESC溫度調節控制器</p>
        <p type="p">6:感測器</p>
        <p type="p">7:被控制機器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2415" publication-number="202618053">
    <tif-files tif-type="multi-tif">
      <tif file="114140016.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴淋頭及使用噴淋頭之製程室</chinese-title>
        <english-title>SHOWERHEAD AND PROCESSING CHAMBER USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C23C16/455</main-classification>
        <further-classification edition="200601120260126B">B05B1/14</further-classification>
        <further-classification edition="200601120260126B">F28F3/12</further-classification>
        <further-classification edition="200601120260126B">F28F3/02</further-classification>
        <further-classification edition="200601120260126B">C23C16/46</further-classification>
        <further-classification edition="200601120260126B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞普　利皮姚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAP, LIPYEOW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>為克拉曼　尼溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIKRAMAN, NIVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王塞納克運　潘亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONGSENAKHUM, PANYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德　蓋瑞　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIND, GARY B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">噴淋頭之底部係由一第一金屬材料所製成、具有包含一氣體入口的一第一表面及一第二表面、且包含複數通道。面板係由一第二金屬材料所製成、且具有附接至該底部的複數側表面及沿著該第二表面定義一充氣室的一底表面。該面板包含自該底表面向上延伸通過充氣室且與該第二表面接觸的複數壁及沿著該複數壁設置的複數出口。加熱器係設置於沿著該底部之一周邊的一溝槽中。冷卻板係設置於該第一表面上且包含冷卻劑用之一導管。一板係由一第三材料所製成並位於該冷卻板與該底部之間，該第三材料之熱導率係低於該第一及該第二金屬材料的熱導率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A base portion of a showerhead is made of a first metallic material, has a first surface including a gas inlet and a second surface, and includes passages. A faceplate is made of a second metallic material and has side surfaces attached to the second surface and has a bottom surface that along with the second surface define a plenum. The faceplate includes walls that extend from the bottom surface upwards through the plenum and that contact the second surface, and outlets arranged along the walls. A heater is disposed in a groove along a periphery of the base portion. A cooling plate is arranged on the first surface and includes a conduit for a coolant. A plate is made of a third material having a lower thermal conductivity than the first and second metallic materials and is arranged between the cooling plate and the base portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:噴淋頭</p>
        <p type="p">301:頂表面</p>
        <p type="p">302:底部</p>
        <p type="p">302-1、302-2:元件</p>
        <p type="p">303:底表面</p>
        <p type="p">304:面板</p>
        <p type="p">305:充氣室</p>
        <p type="p">307:凸緣</p>
        <p type="p">309:頂表面</p>
        <p type="p">310:入口</p>
        <p type="p">311:溝槽</p>
        <p type="p">312:平臺</p>
        <p type="p">313:頂板</p>
        <p type="p">315:O形環</p>
        <p type="p">316、316-1、316-2、316-3、...、及316-N:垂直壁</p>
        <p type="p">317:凸緣</p>
        <p type="p">319:溝槽</p>
        <p type="p">308:幹部</p>
        <p type="p">320:冷卻板</p>
        <p type="p">322:加熱器線圈</p>
        <p type="p">324:導管</p>
        <p type="p">325:溝槽</p>
        <p type="p">326:平坦環</p>
        <p type="p">327、327-1、327-2、327-3、...、及327-N:孔洞/貫孔</p>
        <p type="p">333:周邊部</p>
        <p type="p">335:頂表面</p>
        <p type="p">339:底表面</p>
        <p type="p">343:環</p>
        <p type="p">349:頂表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2416" publication-number="202619584">
    <tif-files tif-type="multi-tif">
      <tif file="114140038.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有奈米光子透鏡陣列的影像感測器及包括該影像感測器的電子設備</chinese-title>
        <english-title>IMAGE SENSOR HAVING NANO-PHOTONIC LENS ARRAY AND ELECTRONIC APPARATUS INCLUDING THE IMAGE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251211B">H10F39/12</main-classification>
        <further-classification edition="202501120251211B">H10F77/40</further-classification>
        <further-classification edition="201101120251211B">B82Y20/00</further-classification>
        <further-classification edition="200601120251211B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧淑英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROH, SOOKYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙春來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHOONLAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安城模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUNGMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李受娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所提供者為一種影像感測器，其包括：一感測器基體，其包括一第一像素、一第二像素、一第三像素及一第四像素；以及一奈米光子透鏡陣列，其包括一第一超穎區、一第二超穎區、一第三超穎區及一第四超穎區，該第一至第四超穎區中之每一者包括組配來將入射光分色之複數個主奈米結構，該主奈米結構之一臨界尺寸大於或等於像素節距之1/20，且在該第三超穎區中，該等主奈米結構之中心點僅位於一第三區段中，該第三區段包含沿著該第三超穎區之一邊沿界定之一第一部分、在一第一方向上從該第三超穎區之一中心延伸之一第二部分、以及在與該第一方向相交之一第二方向上從該第三超穎區之該中心延伸的一第三部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is an image sensor including a sensor substrate including a first pixel, a second pixel, a third pixel, and a fourth pixel, and a nano-photonic lens array including a first meta-region, a second meta-region, a third meta-region, and a fourth meta-region, each of the first to fourth meta-regions including a plurality of main nano-structures that are configured to color-separate incident light, a critical dimension of the main nano-structure being greater than or equal to 1/20 of the pixel pitch, and in the third meta-region, center points of the main nano-structures being only in a third section, the third section comprising a first portion defined along a rim of the third meta-region, a secnd portion extending in a first direction from a center of the third meta-region, and a third portion extending in a second direction crossing the first direction from the center of the third meta-region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:感測器基體</p>
        <p type="p">111:第一像素</p>
        <p type="p">112:第二像素</p>
        <p type="p">120:濾色層</p>
        <p type="p">121:第一濾色器</p>
        <p type="p">122:第二濾色器</p>
        <p type="p">130:間隔體層</p>
        <p type="p">140:奈米光子透鏡陣列</p>
        <p type="p">141:第一超穎區</p>
        <p type="p">142:第二超穎區</p>
        <p type="p">150:抗反射層</p>
        <p type="p">1100:影像感測器</p>
        <p type="p">DL:介電層</p>
        <p type="p">NP:奈米結構</p>
        <p type="p">P:像素節距</p>
        <p type="p">X:第一方向、方向</p>
        <p type="p">Y:第二方向、方向</p>
        <p type="p">Z:第三方向、方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2417" publication-number="202618438">
    <tif-files tif-type="multi-tif">
      <tif file="114140046.zip" no="1">
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      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>極紫外線防護膜的壽命預測方法</chinese-title>
        <english-title>METHOD FOR PREDICTING THE LIFETIME OF EUV PELLICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260131B">G03F1/62</main-classification>
        <further-classification edition="200601120260131B">G01N21/59</further-classification>
        <further-classification edition="200601120260131B">G01N21/41</further-classification>
        <further-classification edition="200601120260131B">H01L21/027</further-classification>
        <further-classification edition="202001320260131B">G06F119/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商艾弗斯特半導體設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINE SEMITECH CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭一鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, EIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙相珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SANG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔在爀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JAE HYUCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種預測極紫外線防護膜的壽命的方法，更詳細而言是有關於一種利用極紫外線防護膜的透過率來預測極紫外線防護膜的壽命的方法。本發明提供一種極紫外線防護膜的壽命預測方法，所述方法包括以下步驟：a）獲得極紫外線防護膜在自紅外線區域至紫外線區域的波長帶中的透過率資料；b）獲得極紫外線防護膜在自紅外線區域至紫外線區域的波長帶中的複折射率資料；c）利用所述透過率資料及所述複折射率資料來執行光學建模，並獲取有關於極紫外線防護膜根據波長的密度與透過率之間的關係的資訊；以及d）對極紫外線防護膜對具有屬於自紅外線區域至紫外線區域的波長帶的波長的至少一個測定束的透過率進行測定，並基於測定出的透過率及在所述c）步驟中獲取的有關於密度與透過率之間的關係的資訊，提取極紫外線防護膜的推定密度並藉此來預測極紫外線防護膜的殘存壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3、S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2418" publication-number="202617434">
    <tif-files tif-type="multi-tif">
      <tif file="114140050.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B32B27/16</main-classification>
        <further-classification edition="200601120260202B">B32B27/30</further-classification>
        <further-classification edition="200601120260202B">C08F220/06</further-classification>
        <further-classification edition="200601120260202B">C08F220/18</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/027</further-classification>
        <further-classification edition="200601120260202B">G03F7/031</further-classification>
        <further-classification edition="200601120260202B">G03F7/033</further-classification>
        <further-classification edition="200601120260202B">G03F7/09</further-classification>
        <further-classification edition="200601120260202B">G03F7/115</further-classification>
        <further-classification edition="200601120260202B">H05K3/06</further-classification>
        <further-classification edition="200601120260202B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古谷創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTANI, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸野真之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHINO, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光性樹脂積層體，其係具備支撐膜、及含有感光性樹脂組成物之感光性樹脂層；  &lt;br/&gt;前述感光性樹脂層的厚度T為200μm以上；  &lt;br/&gt;相對於前述感光性樹脂組成物的所有固體成分質量，前述感光性樹脂組成物係含有  &lt;br/&gt;（A）鹼可溶性高分子：30質量%～70質量%；  &lt;br/&gt;（B）具有乙烯性不飽和鍵之化合物：20質量%～50質量%；  &lt;br/&gt;（C）光聚合起始劑：0.01質量%～20質量%；及  &lt;br/&gt;（D）有機溶劑；  &lt;br/&gt;前述感光性樹脂層中所含之前述（D）有機溶劑的含量比例S為0.01質量%～3質量%；且前述感光性樹脂層中所含之前述（D）有機溶劑之中，沸點100℃以下之有機溶劑的比率為50質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2419" publication-number="202617798">
    <tif-files tif-type="multi-tif">
      <tif file="114140086.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗蝕劑底層膜形成用組成物及半導體基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F212/14</main-classification>
        <further-classification edition="200601120260102B">C08F220/10</further-classification>
        <further-classification edition="200601120260102B">G03F7/11</further-classification>
        <further-classification edition="200601120260102B">G03F7/26</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ　股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井一憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻孝史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田和弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKADA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋将人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBASHI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田垣安宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTAGAKI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成抗蝕劑圖案矩形性優異的抗蝕劑底層膜的抗蝕劑底層膜形成用組成物及半導體基板的製造方法。一種抗蝕劑底層膜形成用組成物，含有：聚合物，具有下述式（1）所表示的重複單元；以及溶媒。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="305px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（所述式（1）中，Y為碳數1～20的2+k價的有機基。X&lt;sup&gt;0&lt;/sup&gt;為碳數1～40的一價有機基。k為1～5的整數。於k為2以上的情況下，多個X&lt;sup&gt;0&lt;/sup&gt;相互相同或不同。於k個X&lt;sup&gt;0&lt;/sup&gt;中包含至少兩個由下述式（a）表示的部分結構。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="287px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;所述式（a）中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1～20的一價有機基。*為與X&lt;sup&gt;0&lt;/sup&gt;中的其他部分的鍵結鍵）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2420" publication-number="202619022">
    <tif-files tif-type="multi-tif">
      <tif file="114140100.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基座及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01L21/683</main-classification>
        <further-classification edition="200601120251103B">C04B37/02</further-classification>
        <further-classification edition="200601120251103B">B23K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商美科陶瓷科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICO CERAMICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴昭煐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田秉佶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUN, BYUNG GIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康大成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DAE SEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奎羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYU RA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種基座及其製造方法，在本發明的基座的基體製造方法中，所述基體包括：分別由各材料製成的下板和上板；以及位於所述下板和所述上板之間的接合部，所述基體製造方法可以包括：將第一活性金屬層和第一鋁層依次層疊在所述上板的接合面的步驟；將第二活性金屬層和第二鋁層依次層疊在所述下板的接合面的步驟；以及將釺焊填充層夾設在所述上板的所述第一鋁層和所述下板的所述第二鋁層之間，並且通過熱處理將所述釺焊填充層、所述第一鋁層以及所述第二鋁層轉化為釺焊接合層，以使所述下板和所述上板釺焊接合的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210:下板</p>
        <p type="p">215:孔</p>
        <p type="p">220:上板</p>
        <p type="p">311:第二活性金屬層</p>
        <p type="p">321:第一活性金屬層</p>
        <p type="p">325:釺焊接合層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2421" publication-number="202618749">
    <tif-files tif-type="multi-tif">
      <tif file="114140127.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140127</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251201B">G09G3/32</main-classification>
        <further-classification edition="201601120251201B">G09G3/3225</further-classification>
        <further-classification edition="201601120251201B">G09G3/3233</further-classification>
        <further-classification edition="202201120251201B">H05B44/00</further-classification>
        <further-classification edition="200601120251201B">H05B33/02</further-classification>
        <further-classification edition="200601120251201B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤利彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤港</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MINATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上妻宗広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZUMA, MUNEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIDETOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種新穎的顯示裝置。該顯示裝置包括設置顯示驅動電路的第一元件層、設置信號線的信號線層、設置電源線的電源線層以及設置由顯示驅動電路驅動的像素電路的第二元件層。信號線具有對顯示驅動電路傳送用來驅動顯示驅動電路的信號的功能。電源線具有對顯示驅動電路供應電源電壓的功能。第二元件層隔著信號線層及電源線層設置在第一元件層的上方。信號線層設置在第一元件層與電源線層之間。電源線層設置在信號線層與第二元件層之間。在第二元件層中像素電路在行方向及列方向上排列設置。電源線以相鄰的像素電路的間隔的整數倍的間隔設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">L&lt;sub&gt;B&lt;/sub&gt;:長度</p>
        <p type="p">L&lt;sub&gt;PIX&lt;/sub&gt;:長度</p>
        <p type="p">24:電源線</p>
        <p type="p">32:像素電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2422" publication-number="202617242">
    <tif-files tif-type="multi-tif">
      <tif file="114140161.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自熱解油回收苯乙烯單體</chinese-title>
        <english-title>RECOVERY OF STYRENE MONOMER FROM PYROLYSIS OIL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D3/14</main-classification>
        <further-classification edition="200601120260102B">C07C7/04</further-classification>
        <further-classification edition="200601120260102B">C07C4/22</further-classification>
        <further-classification edition="200601120260102B">C07C15/46</further-classification>
        <further-classification edition="200601120260102B">C08J11/12</further-classification>
        <further-classification edition="200601120260102B">C10G1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商德希尼布能源法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNIP ENERGIES FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦利埃爾　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALLIERES, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢曉普　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISHOP, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於一種系統，該系統可用於减少自熱解油蒸餾之苯乙烯單體產物中存在的雜質。該系統可包括位於解聚合單元下游之分餾系列。該分餾系列可包括串聯之四個分餾塔，並產生包含至少99.0 wt%苯乙烯及300 ppm或更少異丙苯之苯乙烯單體產物流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system can be used to reduce the impurities present in a styrene monomer product distilled from a pyrolysis oil. The system can include a fractionation train downstream from a depolymerization unit. The fractionation train may include four fractionation columns in series and produce a styrene monomer product stream comprises at least 99.0 wt% styrene and 300 ppm or less cumene.</p>
      </isu-abst>
      <representative-img>
        <p type="p">103:熱解油流</p>
        <p type="p">105:純化程序</p>
        <p type="p">106:苯乙烯單體產物流</p>
        <p type="p">201:第一分餾塔</p>
        <p type="p">202:第一頂部流</p>
        <p type="p">203:第一底部流</p>
        <p type="p">204:第二分餾塔</p>
        <p type="p">205:第二頂部流</p>
        <p type="p">206:第二底部流</p>
        <p type="p">207:第三分餾塔</p>
        <p type="p">208:第三頂部流</p>
        <p type="p">209:第三底部流</p>
        <p type="p">210:第四分餾塔</p>
        <p type="p">211:第四底部流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2423" publication-number="202618331">
    <tif-files tif-type="multi-tif">
      <tif file="114140166.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統裝置</chinese-title>
        <english-title>OPTICAL SYSTEM APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260131B">G01S17/89</main-classification>
        <further-classification edition="200601120260131B">G01S7/481</further-classification>
        <further-classification edition="201501120260131B">F21V29/10</further-classification>
        <further-classification edition="201501120260131B">F21V29/87</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＣＩＶＡＸ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCIVAX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣半導體照明股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSLC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村智宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中覚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱振甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段　忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOAN, TRUNG TRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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        <p type="p">本發明的目的在於提供一種光學系統裝置，其比現存的光學系統裝置更小型化，且可抑制在光照射單元或驅動器中產生的熱的蓄積。一種光學系統裝置（100），包括：光照射單元（1），能夠照射光；驅動器（2），與光照射單元（1）電連接，控制光照射單元的照射，所述驅動器（2）配置在所述光照射單元（1）的光軸方向的背面側；以及散熱部（3），至少光照射單元（1）的照射角的範圍相對於光而言透明，並且與光照射單元（1）及驅動器（2）能夠熱傳導地接觸。散熱部（3）以光照射單元（1）或驅動器（2）的表面不與氣體接觸的方式進行密封。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
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        <p type="p">1:光照射單元</p>
        <p type="p">2:驅動器</p>
        <p type="p">3:散熱部</p>
        <p type="p">9:框體</p>
        <p type="p">21、22、23、24:配線</p>
        <p type="p">100:光學系統裝置</p>
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    </description>
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  <tw-patent-application no="2424" publication-number="202618439">
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        <document-id>
          <doc-number>114140181</doc-number>
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      <invention-title>
        <chinese-title>防護膜框、防護膜及曝光原版</chinese-title>
        <english-title>PELLICLE FRAME, PELLICLE, AND ORIGINAL PLATE FOR EXPOSURE</english-title>
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        <main-classification edition="201201120260128B">G03F1/64</main-classification>
        <further-classification edition="200601120260128B">G03F7/20</further-classification>
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              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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        </applicants>
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              <chinese-name name-type="organization">
                <last-name>石川彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>大久保敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUBO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>高村一夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHMURA, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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        <p type="p">一種防護膜框，包括支撐防護薄膜的第一面、以及位於與所述第一面相反的一側的光罩側的第二面，所述防護膜框於所述防護膜框的沿著寬度方向的剖面中具有第一形狀，所述第一形狀中，第二面的長度較第一面的長度小，於所述防護膜框的外側於所述第一面與所述第二面之間包括凹陷，於自所述第一形狀製作出具有與所述第一形狀相同面積的架空的コ字的形狀時，所述第一形狀的剖面二次力矩較所述コ字的剖面二次力矩大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一面</p>
        <p type="p">2:第二面</p>
        <p type="p">10:防護膜框</p>
        <p type="p">10a:膜支撐體</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2425" publication-number="202617160">
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        <document-id>
          <doc-number>114140182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阿茲夫定類藥物的製藥用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/7068</main-classification>
        <further-classification edition="200601120260202B">A61K31/706</further-classification>
        <further-classification edition="200601120260202B">A61K31/7076</further-classification>
        <further-classification edition="200601120260202B">A61P25/28</further-classification>
        <further-classification edition="200601120260202B">A61P29/00</further-classification>
        <further-classification edition="200601120260202B">A61P37/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大陸商河南真實生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>李　磐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>賈麗敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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              <chinese-name name-type="organization">
                <last-name>秦志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
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              <chinese-name name-type="organization">
                <last-name>汪玉潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
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        <p type="p">式（I）所示化合物或其藥學上可接受的鹽或它們的同位素標記化合物在製備預防或治療神經退化性疾病或自身免疫及系統性炎症疾病或代謝與心血管疾病或呼吸系統疾病或眼科疾病或腎臟疾病的藥物中的用途。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
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      <representative-img>
      </representative-img>
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          <doc-number>114140188</doc-number>
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        <chinese-title>半導體封裝及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME</english-title>
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        <main-classification edition="200601120260122B">H01L23/60</main-classification>
        <further-classification edition="200601120260122B">H01L23/31</further-classification>
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        <further-classification edition="200601120260122B">H01Q1/38</further-classification>
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                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>邱桑茂</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHIU, SANG-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>謝亞叡</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>HSIEH, YA-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>陳麒元</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHEN, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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          <inventor app-type="applicant" sequence="4">
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              <chinese-name name-type="organization">
                <last-name>林世欽</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LIN, SHIH-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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    <description>
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        <p type="p">提供了一種半導體封裝及其形成方法。該半導體封裝包括第一基板、第一積體電路（IC）、天線、模塑化合物、屏蔽層以及第一屏蔽牆結構。該第一基板包括彼此相對的第一表面和第二表面。該天線位於該第一基板的該第一表面附近。該第一積體電路（IC）安裝於該第一基板的該第二表面並與該天線耦接。該模塑化合物封裝該第一 IC。該屏蔽層覆蓋該模塑化合物。該第一屏蔽牆結構嵌入該第一基板中並與該屏蔽層耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package and a method for forming a semiconductor package are provided. The semiconductor package includes a first substrate, a first integrated circuit (IC), an antenna, a molding compound, a shielding layer, and a first shielding wall structure. The first substrate includes a first surface and a second surface opposite to each other, The antenna is located close to the first surface of the first substrate. The first integrated circuit (IC) is mounted on the second surface of the first substrate and coupled to the antenna. The molding compound encapsulates the first IC. The shielding layer covers the molding compound. The first shielding wall structure is embedded in the first substrate and coupled to the shielding layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500A:半導體封裝</p>
        <p type="p">102,104:積體電路</p>
        <p type="p">103,105,107:導電結構</p>
        <p type="p">106:連接器元件</p>
        <p type="p">110:模塑化合物</p>
        <p type="p">110E,250E,200AE:側壁</p>
        <p type="p">200A:基板</p>
        <p type="p">200AT,202T:頂表面</p>
        <p type="p">200AB,202B:底表面</p>
        <p type="p">202:芯</p>
        <p type="p">204:導電材料</p>
        <p type="p">205:非導電材料牆</p>
        <p type="p">206:介電層</p>
        <p type="p">208:導電跡線</p>
        <p type="p">210-1A,210-2A:重分佈層</p>
        <p type="p">212:通孔</p>
        <p type="p">214:導電墊</p>
        <p type="p">220:天線</p>
        <p type="p">230-1,230-2:鈍化層</p>
        <p type="p">250:屏蔽層</p>
        <p type="p">260:屏蔽牆結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2427" publication-number="202619136">
    <tif-files tif-type="multi-tif">
      <tif file="114140241.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可加壓系統</chinese-title>
        <english-title>PRESSURISABLE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260128B">H01M8/04082</main-classification>
        <further-classification edition="201601120260128B">H01M8/04746</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商席瑞絲電力有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERES POWER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬拉迪　馬魯帝　Ｒ　Ｎ　Ｖ　Ｌ　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLADI, MARUTHI ROCHISHNU NAGA VENKATA LAKSHMI NARASIMHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝克罕薩里　阿卜度爾卡里姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEIKHANSARI, ABDOLKARIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>墨菲　安德魯　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURPHY, ANDREW PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種系統及一種用於該系統之方法。該系統包含：至少二個可加壓流體容積，其彼此不流體連通；至少二個壓力調節器，其經組配以調節各別的該等至少二個可加壓流體容積中之壓力；至少二個引導管路，其各自經組配以將參考壓力提供至該等至少二個壓力調節器中之各別者；及一流量限制裝置。該系統經組配使得在一減壓條件下，該等至少二個引導管路彼此流體連通且與該流量限制裝置流體連通。另外，在該減壓條件下，該等引導管路經組配以藉由其中的流體流經該流量限制裝置而逐漸減壓，藉此減小用於該等至少二個壓力調節器之該等參考壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for the system. The system comprising at least two pressurisable fluid volumes which are not in fluidic communication with one another, at least two pressure regulators configured to regulate pressure in the respective at least two pressurisable fluid volumes, at least two pilot lines, each configured to provide a reference pressure to a respective one of the at least two pressure regulators, and a flow restriction device. The system is configured such that in a depressurisation condition the at least two pilot lines are in fluidic communication with one another and with the flow restriction device. Further, in the depressurisation condition, the pilot lines are configured to gradually depressurise by flow of fluid therein through the flow restriction device, thereby reducing the reference pressures for the at least two pressure regulators.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:第一流體容積，流體容積</p>
        <p type="p">70:第一流體，流體供應源，燃料或吹掃氣體供應源</p>
        <p type="p">72:第二流體，吹掃氣體，流體供應源，燃料或吹掃氣體供應源</p>
        <p type="p">84:壓力調節器，第一壓力調節器</p>
        <p type="p">88:引導管路，第一引導管路</p>
        <p type="p">92:流量限制裝置</p>
        <p type="p">98:電子壓力控制器，第一電子壓力控制器</p>
        <p type="p">106:供應管路</p>
        <p type="p">108:常閉閥</p>
        <p type="p">114:第一常開閥，常開閥</p>
        <p type="p">134:排出口</p>
        <p type="p">138:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2428" publication-number="202617066">
    <tif-files tif-type="multi-tif">
      <tif file="114140252.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統裝置及具備其的PPG傳感器、血氧濃度量測裝置、血糖值量測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">A61B5/024</main-classification>
        <further-classification edition="200601120260124B">A61B5/1455</further-classification>
        <further-classification edition="200601120260124B">G02B6/42</further-classification>
        <further-classification edition="200601120260124B">G01N21/49</further-classification>
        <further-classification edition="202501120260124B">H10F55/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＣＩＶＡＸ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCIVAX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣半導體照明股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSLC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村智宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中覚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱振甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段　忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOAN, TRUNG TRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種比現有的光學系統裝置進一步小型化的光學系統裝置。本發明的光學系統裝置（100）包括：光照射部件（1），能夠照射光；及第一光檢測部件（2），對由光接收面（21）所接收的光的訊息進行檢測，其中，光接收面（21）配置於光照射部件（1）所照射的光的光軸線上，且以避免光照射部件（1）的光直接照射至光接收面（21）的方式配置。光照射部件（1）可配置於第一光檢測部件（2）的背面側。另外，可包括傳輸通路（3），所述傳輸通路（3）利用入射部（31）使光照射部件（1）的光入射，並且利用出射部（32）使光照射部件（1）的光出射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光照射部件</p>
        <p type="p">2:第一光檢測部件</p>
        <p type="p">3:傳輸通路</p>
        <p type="p">12、22:背面</p>
        <p type="p">21:光接收面</p>
        <p type="p">31:入射部</p>
        <p type="p">32:出射部</p>
        <p type="p">36:第一傳輸通路</p>
        <p type="p">37:第二傳輸通路</p>
        <p type="p">38:連接部</p>
        <p type="p">100:光學系統裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2429" publication-number="202619067">
    <tif-files tif-type="multi-tif">
      <tif file="114140254.zip" no="1">
      </tif>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140254</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有鍍銅源極焊盤的半導體封裝及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE HAVING ELECTROPLATED COPPER SOURCE PADS AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251028B">H01L23/28</main-classification>
        <further-classification edition="200601120251028B">H01L23/495</further-classification>
        <further-classification edition="200601120251028B">H01L21/56</further-classification>
        <further-classification edition="200601120251028B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　彥迅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, YAN XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　隆慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LONG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>管靈鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, LINGPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德　馬督兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBDE, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種半導體封裝包括引線框架、場效應電晶體（FET）、銅層、源極金屬夾和模塑封裝。FET在其頂表面具有閘極匯流排、閘極電極和源極電極，在其底表面具有汲極電極。模塑封裝包裹FET、銅層、源極金屬夾以及引線框架的大部分。本發明還公開了一種製造多個半導體封裝的方法，該方法包括以下步驟：提供晶圓；沉積種子層；施加光刻膠層；形成開口；電鍍銅；去除光刻膠層；去除種子層；施加研磨工藝；進行切割工藝；安裝FET到引線框架；安裝源極金屬夾；形成模塑封裝；以及進行分割工藝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package comprises a lead frame, an FET, a copper layer, a source metal clip, and a molding encapsulation. The FET comprises a gate bus line, a gate electrode, and a source electrode on a top surface of the FET and a drain electrode on a bottom surface of the FET. A method comprises the steps of providing a wafer; attaching a seed layer; applying a photoresist layer; forming openings; electro plating of copper; removing the photoresist layer; removing the seed layer; applying a grinding process; applying a dicing process; attaching a lead frame; mounting source metal clips; forming a molding encapsulation; and applying a singulation process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">120:引線框架</p>
        <p type="p">140:FET</p>
        <p type="p">170:源極金屬夾</p>
        <p type="p">181:閘極金屬夾</p>
        <p type="p">190:模塑封裝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2430" publication-number="202619533">
    <tif-files tif-type="multi-tif">
      <tif file="114140260.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及形成半導體結構的方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260108B">H10D30/62</main-classification>
        <further-classification edition="202501120260108B">H10D62/10</further-classification>
        <further-classification edition="202501120260108B">H10D62/815</further-classification>
        <further-classification edition="200601120260108B">H01L21/20</further-classification>
        <further-classification edition="200601120260108B">H01L21/76</further-classification>
        <further-classification edition="200601120260108B">H01L21/3065</further-classification>
        <further-classification edition="200601120260108B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈盈均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江育賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊固峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的半導體結構包括：在基板中的未摻雜半導體特徵；在基板上方的第一底部奈米結構和第二底部奈米結構；在未摻雜半導體特徵上且介於第一底部奈米結構和第二底部奈米結構之間的底部磊晶特徵；在第一底部奈米結構上的第一隔離層；在第二層奈米結構上的第二隔離層；底部磊晶特徵上的底部接觸蝕刻停止層(CESL)，第一隔離層上的第一頂部奈米結構，第二隔離層上的第二頂部奈米結構，在底部CESL上並延伸於第一頂部奈米結構和第二頂部奈米結構之間的頂部磊晶特徵，以及在頂部磊晶特徵上的頂部CESL。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure according to the present disclosure includes an undoped semiconductor feature in a substrate, a first bottom nanostructure and a second bottom nanostructure over the substrate, a bottom epitaxial feature over the undoped semiconductor feature and between the first bottom nanostructure and the second bottom nanostructure, a first isolation layer over the first bottom nanostructure, a second isolation layer over the second nanostructure, a bottom contact etch stop layer (CESL) over the bottom epitaxial feature, a first top nanostructure over the first isolation layer, a second top nanostructure over the second isolation layer, a top epitaxial feature over the bottom CESL and extending between the first top nanostructure and the second top nanostructure, and a top CESL over the top epitaxial feature. A composition of the bottom CESL is different from a composition of the top CESL.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:前體結構/半導體元件</p>
        <p type="p">202:基板</p>
        <p type="p">208M:中間矽層/矽層</p>
        <p type="p">210B:基底鰭片/基底部分</p>
        <p type="p">210C:通道區域</p>
        <p type="p">210SD:源極/汲極區</p>
        <p type="p">211:中間介電質層</p>
        <p type="p">222:閘極間隔物</p>
        <p type="p">224:內間隔物特徵</p>
        <p type="p">226:基底磊晶層</p>
        <p type="p">230:底部源極/汲極特徵</p>
        <p type="p">232:底部接觸蝕刻停止層(CESL)/底部CESL</p>
        <p type="p">234:底部層間電介質(ILD)層/底部ILD層</p>
        <p type="p">240:頂部源極/汲極特徵</p>
        <p type="p">242:頂部接觸蝕刻停止層(CESL)/頂部CESL</p>
        <p type="p">244:頂部層間介電質(ILD)層/頂部ILD層</p>
        <p type="p">246B:底部閘極介電質層</p>
        <p type="p">246T:頂部閘極介電質層</p>
        <p type="p">248B:底部閘極電極</p>
        <p type="p">248T:頂部閘極電極</p>
        <p type="p">250B:底部閘極結構/第一閘極結構</p>
        <p type="p">250T:頂部閘極結構/第二閘極結構</p>
        <p type="p">2080B:底部通道構件</p>
        <p type="p">2080T:頂部通道構件</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2431" publication-number="202619513">
    <tif-files tif-type="multi-tif">
      <tif file="114140265.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>凹陷式虛擬單溝槽閘極IGBT</chinese-title>
        <english-title>RECESSED DUMMY SINGLE TRENCH GATE IGBT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251208B">H10D12/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　文軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WENJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕德馬納班　卡西克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PADMANABHAN, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　宏勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, HONGYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭智博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHIBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德　馬督兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBDE, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種半導體器件，包括：由半導體材料組成的基板，具有輕摻雜第一導電類型離子的漂移區，在基板中形成並摻雜第二導電類型離子的本體區。在漂移區中形成的虛擬溝槽。該虛擬溝槽形成到基板中比本體區底部更深的深度。在虛擬溝槽中形成的絕緣層，在虛擬溝槽中絕緣層上形成的虛擬電極，虛擬電極頂部位於虛擬溝槽中本體區底部下方的深度，在有源閘極溝槽中形成的閘極電極，該閘極電極從本體區的一部分延伸到有源閘極溝槽中本體區底部下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device comprising a substrate comprised of a semiconductor material having a drift region lightly doped with ions of a first conductivity type and a body region formed the substrate doped with ions of the second conductivity type. A dummy trench may be formed in the drift region. The dummy trench is formed to a depth in the substrate deeper than a bottom depth of the body region. An insulation layer formed over the substrate in the dummy trench. A dummy electrode is formed over the insulation layer in the dummy trench. The top of the dummy electrode is at a depth in the dummy trench below the bottom of the body region and a gate electrode formed in the active gate trench wherein the gate electrode extends from a portion of the body region to below the bottom of the body region in the active gate trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:漂移區</p>
        <p type="p">102:緩衝層</p>
        <p type="p">103:載流子存儲層</p>
        <p type="p">104:本體區</p>
        <p type="p">105:發射區</p>
        <p type="p">106:本體接觸區</p>
        <p type="p">107:頂部絕緣層</p>
        <p type="p">108:發射極插頭</p>
        <p type="p">109:閘極電極</p>
        <p type="p">110:虛擬電極</p>
        <p type="p">111:虛擬絕緣層</p>
        <p type="p">112:有源閘極絕緣層</p>
        <p type="p">113:發射極金屬層</p>
        <p type="p">114:集電區</p>
        <p type="p">115:集電極金屬層</p>
        <p type="p">116:有源閘極溝槽</p>
        <p type="p">117:虛擬溝槽</p>
        <p type="p">118:漸變部分</p>
        <p type="p">120:本體區底部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2432" publication-number="202618153">
    <tif-files tif-type="multi-tif">
      <tif file="114140272.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>柔輪、諧波減速器、機械臂和自動清潔設備</chinese-title>
        <english-title>FLEXIBLE WHEEL, HARMONIC REDUCER, ROBOTIC ARM, AND AUTOMATIC CLEANING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">F16H49/00</main-classification>
        <further-classification edition="200601120260131B">F16H55/08</further-classification>
        <further-classification edition="200601120260131B">F16H55/17</further-classification>
        <further-classification edition="200601120260131B">F16D1/06</further-classification>
        <further-classification edition="200601120260131B">B25J9/10</further-classification>
        <further-classification edition="200601120260131B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段傳林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, CHUANLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成盼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種柔輪、諧波減速器、機械臂和自動清潔設備，其中柔輪包括輪體和連接部，連接部設置在輪體上，連接部凸出於輪體的表面。柔輪通過設置輪體和凸出於輪體表面的連接部，避免了現有技術中注塑連接孔時產生收縮的問題，有效防止了因連接孔收縮導致的齒形注塑填充不滿等缺陷，從而提高了傳動精度，確保柔輪在傳動過程中能夠穩定、準確地傳遞動力，也能使得柔輪更易採用注塑工藝一體成型，提高了良品率。通過設置多個連接柱，能夠分散受力，使得柔輪與扭矩輸出載體的連接更加穩定可靠。相較於現有技術中在柔輪上形成連接孔的方式，本實施例中的柔輪的整體強度更高，能夠提高諧波減速器的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a flexible wheel, a harmonic reducer, a robotic arm, and an automatic cleaning device. The flexible wheel includes a wheel body and a connecting part, where the connecting part is arranged on the wheel body and protrudes from the surface of the wheel body. By setting the wheel body and the protruding connecting part, the flexible wheel avoids the shrinkage problem that occurs during injection molding of connecting holes in the prior art. This effectively prevents defects such as incomplete tooth profile injection molding caused by hole shrinkage, thereby improving transmission accuracy and ensuring stable and accurate power transmission during operation. It also makes the flexible wheel easier to be molded using injection molding, increasing the yield rate. By providing multiple connecting columns, the force can be distributed, making the connection between the flexible wheel and the torque output carrier more stable and reliable. Compared to the method in the prior art of forming connecting holes on the flexible wheel, the flexible wheel in this embodiment has higher overall strength and can extend the lifespan of the harmonic reducer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輪體</p>
        <p type="p">11:裝配孔</p>
        <p type="p">12:傳動齒</p>
        <p type="p">13:腰段</p>
        <p type="p">2:連接柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2433" publication-number="202618643">
    <tif-files tif-type="multi-tif">
      <tif file="114140287.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合複數個促銷方之優惠券發行與兌換方法與系統</chinese-title>
        <english-title>A VOUCHER ISSUANCE AND REDEMPTION METHOD AND SYSTEM FOR INTEGRATING A PLURALITY OF PROMOTERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251028B">G06Q30/0207</main-classification>
        <further-classification edition="202301120251028B">G06Q30/0241</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　可玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO LING, CHEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　可玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO LING, CHEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種整合複數個促銷方之優惠券發行與兌換方法，其包括：根據該優先權重決定各促銷方所獲得的優惠券面額額度，決定對應於各促銷方對應各商家的產品或服務的各優惠項目所對應的優惠面額，藉以決定各促銷方所得到對應各商家的產品或服務的優惠項目的優惠券張數，以產生複數張對應於各商家的優惠券。整合複數個促銷方之優惠券發行與兌換系統包括彼此電連接的多個硬體電路，其係配置成多個模組，該等模組包括：優惠券發行模組、通訊模組、優惠券推薦模組、訂單生成模組、差額支付模組與優惠券支付模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a voucher issuance and redemption method, including: determining voucher face amount received by each promoter based on the priority weight, and determining the discount face value corresponding to each discount item corresponding to the product or service of each merchant, thereby determining the number of vouchers for the discount items corresponding to products or services of each merchant received by each promoter, so as to generate a plurality of vouchers corresponding to each merchant. A voucher issuance and redemption system includes a plurality of hardware circuits electrically connected with each other, which are configured into a plurality of modules, including: a voucher issuance module, a communication module, a voucher recommendation module, an order generation module, a difference payment module and a voucher payment module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:優惠券發行與兌換伺服器</p>
        <p type="p">5:電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2434" publication-number="202617043">
    <tif-files tif-type="multi-tif">
      <tif file="114140288.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備控制方法、裝置、程式產品、存儲介質及清潔設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">A47L11/40</main-classification>
        <further-classification edition="200601120260121B">A47L11/24</further-classification>
        <further-classification edition="200601120260121B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種清潔設備控制方法、裝置、程式產品、存儲介質及清潔設備，所述清潔設備的底盤設有機械臂，所述方法包括：如果所述清潔設備在行走過程中遇到待越過的障礙物，控制所述清潔設備按照目標越障策略執行越障動作，所述目標越障策略包括所述機械臂輔助所述清潔設備越過所述障礙物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2435" publication-number="202618853">
    <tif-files tif-type="multi-tif">
      <tif file="114140314.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提升產能的雙掃描型離子注入系統</chinese-title>
        <english-title>DUAL SCAN TYPE ION IMPLANT SYSTEM WITH IMPROVED THROUGHPUT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/317</main-classification>
        <further-classification edition="200601120260102B">H01J37/256</further-classification>
        <further-classification edition="200601120260102B">H01J37/08</further-classification>
        <further-classification edition="200601120260102B">H01J37/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/68</further-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
        <further-classification edition="200601120260102B">H01L21/677</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">H01L21/265</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商耐貝爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINEBELL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔文壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MOON SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫容宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOHN, YONG SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JEONG SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安賢煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, HYUN HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一實施例的提升產能的雙掃描型離子注入系統的特徵在於，包括：第一裝載鎖定腔室組件，與EFEM的一端連接；第二裝載鎖定腔室組件，與該EFEM的另一端連接；單個真空傳輸模組（VTM），同時與該些第一裝載鎖定腔室組件及第二裝載鎖定腔室組件連接；第一及第二雙臂真空機器人，配置在該真空傳輸模組（VTM）的內部；單個工藝腔室，與該真空傳輸模組（VTM）連接，並且在真空氣氛下實現離子束的掃描；及第一及第二掃描機器人，配置在該工藝腔室的內部，從該EFEM，第一裝載鎖定腔室組件及第二裝載鎖定腔室組件、單個真空傳輸模組（VTM）、單個工藝腔室及該工藝腔室的內部的第一及第二掃描機器人透過互不重疊的不同的晶圓掃描移送路徑分別接收晶圓後，由該些第一及第二掃描機器人交替地進行離子束掃描，並且控制為即使該些第一及第二掃描機器人中的某一個掃描機器人無法正常操作，剩餘一個掃描機器人仍繼續進行正常操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工藝腔室</p>
        <p type="p">20-1、20-2:第一、第二掃描機器人</p>
        <p type="p">40-1、40-2:第一、第二裝載鎖定腔室組件</p>
        <p type="p">50:單個真空傳輸模組(VTM)</p>
        <p type="p">60-1、60-2:第一、第二真空機器人</p>
        <p type="p">70:對準器(Aligner)</p>
        <p type="p">P1、P2:第一、第二晶圓掃描移送路徑</p>
        <p type="p">W:晶圓</p>
        <p type="p">B:離子束照射區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2436" publication-number="202617044">
    <tif-files tif-type="multi-tif">
      <tif file="114140317.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140317</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備和異物檢測方法</chinese-title>
        <english-title>CLEANING DEVICE AND FOREIGN OBJECT DETECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">A47L11/40</main-classification>
        <further-classification edition="200601120251124B">G05G23/00</further-classification>
        <further-classification edition="200601120251124B">F16H21/08</further-classification>
        <further-classification edition="200601120251124B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李兆達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHAODA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔設備和異物檢測方法，清潔設備包括殼體、探測頭、伸縮裝置和檢測件，殼體沿第一方向的側壁為開口壁，開口壁形成有與殼體的內部連通的開口；探測頭用於對周圍環境進行探測，探測頭伸出狀態以及縮回狀態；伸縮裝置設置於殼體內，伸縮裝置包括傳動機構和活動組件，活動組件沿第一方向可移動設置在傳動機構上，探測頭設置在活動組件，傳動機構能夠驅動活動組件沿第一方向移動，使得探測頭在伸出狀態和縮回狀態之間切換；檢測件的檢測端設於開口壁和活動組件之間。本申請提供的清潔設備和異物檢測方法，能夠對異物進行檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a cleaning device and a foreign object detection method. The cleaning device includes a housing, a detection probe, a telescopic device, and a detector. A side wall of the housing along a first direction is an opening wall, which forms an opening communicated to interior of the housing. The detection probe is used to detect a surrounding environment, and has an extended and a retracted state. The telescopic device is arranged inside the housing, and includes a transmission mechanism and a movable component. The movable component is movably arranged on the transmission mechanism along the first direction, and the detection probe is arranged on the movable component. The transmission mechanism can drive the movable component to move along the first direction, so that the detection probe switches between the extended state and the retracted state. A detection end of the detector is located between the opening wall and the movable component. The cleaning device and the foreign object detection method provided in this application are capable of detecting foreign objects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:探測頭</p>
        <p type="p">3111:感應端</p>
        <p type="p">3112:鉸接端</p>
        <p type="p">312:第二連桿</p>
        <p type="p">313:第三連桿</p>
        <p type="p">314:第四連桿</p>
        <p type="p">3141:杆體</p>
        <p type="p">3142:承載座</p>
        <p type="p">3142a:導向孔</p>
        <p type="p">315:馬達</p>
        <p type="p">32:活動組件</p>
        <p type="p">32a:滑槽</p>
        <p type="p">321:支撐件</p>
        <p type="p">321a:導向柱</p>
        <p type="p">3211:導向座</p>
        <p type="p">3212:擠壓板</p>
        <p type="p">322:彈性件</p>
        <p type="p">4:檢測端</p>
        <p type="p">5:限位蓋</p>
        <p type="p">7:第一感應件</p>
        <p type="p">8:第二感應件</p>
        <p type="p">9:電路板</p>
        <p type="p">A:感應槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2437" publication-number="202619247">
    <tif-files tif-type="multi-tif">
      <tif file="114140321.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140321</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不對稱半橋電路的控制方法、控制晶片、電源電路及充電器</chinese-title>
        <english-title>ASYMMETRIC HALF-BRIDGE CIRCUIT CONTROL METHOD, CONTROL CHIP, POWER SUPPLY CIRCUIT AND CHARGER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260122B">H02M1/42</main-classification>
        <further-classification edition="200701120260122B">H02M1/44</further-classification>
        <further-classification edition="200601120260122B">H02M1/08</further-classification>
        <further-classification edition="200601120260122B">H02M3/04</further-classification>
        <further-classification edition="200601120260122B">G06F1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市奧海科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN AOHAI TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KEHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙偉躍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, WEIYUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許道飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, DAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, XIUGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種不對稱半橋電路的控制方法、控制晶片、電源電路及充電器。控制方法包括：獲取不對稱半橋電路的第一檢測數據；若第一檢測數據滿足預設輕載條件，則控制第一開關電晶體關斷，獲取當前輸出電壓和第一開關電晶體的當前關斷電流；根據當前輸出電壓和第一開關電晶體的當前關斷電流，獲取第二開關電晶體的當前導通時間，其中，當前導通時間與當前關斷電流成正比例關係，與當前輸出電壓成反比例關係，能夠克服由於不對稱半橋電路輸出電壓變化帶來的勵磁電感退磁時間變化，能夠使變壓器退磁後的負電流在預設區間之內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Asymmetric half-bridge circuit control method, control chip, power supply circuit and charger are disclosed. The control method includes: acquiring first detection data of the asymmetrical half-bridge circuit; if the first detection data meets a preset light load condition, controlling a first switching transistor to turn off and acquiring a current output voltage and a current turn-off current of the first switching transistor; acquiring a current conduction time of a second switching transistor based on the current output voltage and the current turn-off current of the first switching transistor, wherein the current conduction time is directly proportional to the current turn-off current and inversely proportional to the current output voltage, which can overcome the change in the demagnetization time of the excitation inductor caused by the change in the output voltage of the asymmetrical half-bridge circuit, and can keep an negative current of a transformer after demagnetization within a preset range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C1:諧振電容</p>
        <p type="p">C2:諧振電容</p>
        <p type="p">C3:電容</p>
        <p type="p">D1:續流二極體</p>
        <p type="p">HG:控制晶片</p>
        <p type="p">L1:諧振電感</p>
        <p type="p">LG:控制晶片</p>
        <p type="p">LM:勵磁電感</p>
        <p type="p">T1:變壓器</p>
        <p type="p">R1:電阻</p>
        <p type="p">Q1:第一開關電晶體</p>
        <p type="p">Q2:第二開關電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2438" publication-number="202617742">
    <tif-files tif-type="multi-tif">
      <tif file="114140351.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140351</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於ＥＵＶ微影製程之有機金屬錫氧羧酸根團簇</chinese-title>
        <english-title>ORGANOMETALLIC TIN OXO CARBOXYLATE CLUSTERS FOR EUV LITHOGRAPHY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07F7/22</main-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/38</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利希坦貝格　尼爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LICHTENBERGER, NIELS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈德森　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUDSON, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法克勒　飛利浦　漢斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FACKLER, PHILIPP HANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示及主張之標的物係關於具有烯基有機配體及羧酸根配體之Sn&lt;sub&gt;6&lt;/sub&gt;-氧團簇、其合成、其調配物及其在EUV微影製程中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed and claimed subject matter relates to Sn&lt;sub&gt;6&lt;/sub&gt;-oxo clusters with alkenyl organic ligands and carboxylate ligands, the synthesis thereof, formulations thereof and the use thereof in EUV lithography.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2439" publication-number="202617136">
    <tif-files tif-type="multi-tif">
      <tif file="114140372.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CXCL5拮抗劑或抑制劑在製備治療、改善或預防腎臟疾病或症狀之醫藥組成物的用途</chinese-title>
        <english-title>USE OF CXCL5 ANTAGONIST OR INHIBITOR IN MANUFACTURE OF A PHARMACEUTICAL COMPOSITION FOR TREATING, AMELIORATING, OR PREVENTING RENAL DISEASE OR CONDITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">A61K31/18</main-classification>
        <further-classification edition="200601120251103B">A61K31/713</further-classification>
        <further-classification edition="200601120251103B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TING-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳肇文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JAW-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種CXCL5拮抗劑或抑制劑之用途，其係用於製備治療、改善或預防腎臟疾病或症狀的醫藥組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a use of CXCL5 antagonist or inhibitor in manufacture of a pharmaceutical composition for treating, ameliorating, or preventing renal disease or condition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2440" publication-number="202617235">
    <tif-files tif-type="multi-tif">
      <tif file="114140468.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251212B">A63F13/24</main-classification>
        <further-classification edition="201401120251212B">A63F13/54</further-classification>
        <further-classification edition="200601120251212B">H04R5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPS ALPINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供控制器，能夠使在空間上有擴展的音響從用手保持並操作的殼體的發聲部到達操作者的耳朵。在視頻遊戲、VR的操作中使用的控制器(1)的殼體(10)的上表面(11)設置有主發聲部(20)，在下表面(12)設置有副發聲部(25)。效果音以最短時間從主發聲部(20)到達操作者的耳朵，效果音具有時間差地從副發聲部(25)到達操作者。通過在從主發聲部(20)發出的聲音和從副發聲部(25)發出的聲音中產生傳遞函數的差，從而能夠得到在空間上有擴展感的音響效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:控制器</p>
        <p type="p">2:操作部件</p>
        <p type="p">10:殼體</p>
        <p type="p">11:上表面</p>
        <p type="p">12:下表面</p>
        <p type="p">13:左側面</p>
        <p type="p">14:右側面</p>
        <p type="p">15:前側面</p>
        <p type="p">16:後側面</p>
        <p type="p">17:左保持部</p>
        <p type="p">18:右保持部</p>
        <p type="p">20:主發聲部</p>
        <p type="p">X1,X2,Y1,Y2,Z1,Z2:方向</p>
        <p type="p">O:中心線</p>
        <p type="p">Ⅲ,IV:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2441" publication-number="202617377">
    <tif-files tif-type="multi-tif">
      <tif file="114140539.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617377</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產業機械的教示裝置、教示方法以及教示程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">B25J9/16</main-classification>
        <further-classification edition="200601120260115B">B25J9/22</further-classification>
        <further-classification edition="200601120260115B">B25J13/06</further-classification>
        <further-classification edition="200601120260115B">B65G43/08</further-classification>
        <further-classification edition="200601120260115B">B65G47/19</further-classification>
        <further-classification edition="200601120260115B">B65G47/90</further-classification>
        <further-classification edition="200601120260115B">G05B19/414</further-classification>
        <further-classification edition="200601120260115B">G05B19/4155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, RIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中隆博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種產業機械的教示裝置，為了簡易地教示將整列搬入之貨物以預設的堆疊模式高效率地配置於搬出場所的棧板上之棧板堆疊動作，教示由可以同時搬送以整列狀態搬入之多個物品的手掌部進行之棧板堆疊動作；教示裝置可以設定表示手掌部從搬入場所同時取起之一個以上物品的拾取群組，或是表示手掌部在搬出場所同時配置之一個以上物品的置放群組至少其一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:教示裝置</p>
        <p type="p">10:機器人</p>
        <p type="p">11:手掌部</p>
        <p type="p">20:控制裝置</p>
        <p type="p">30:輸送帶</p>
        <p type="p">31:擋板</p>
        <p type="p">40:棧板</p>
        <p type="p">100:物品搬送系統</p>
        <p type="p">W:物品</p>
        <p type="p">X:搬入場所</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2442" publication-number="202617339">
    <tif-files tif-type="multi-tif">
      <tif file="114140540.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617339</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具保管裝置以及工件加工系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">B23Q13/00</main-classification>
        <further-classification edition="200601120260119B">B23Q3/157</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田裕昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種工具保管裝置，為了在確保工件周圍有廣闊的空間的同時，壓低工具更換所需時間以縮短加工時間之目的，包括殼體，設置於可固定要被機械加工之工件的工件搭載面下方，可收容一個以上的工具；以及工具持拿部，設置為可收容在殼體內部，可拆卸地持拿工具；工具持拿部可以將所持拿的至少一個工具配置於可從殼體外部取出的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具保管裝置</p>
        <p type="p">2:殼體</p>
        <p type="p">3:工件搭載面</p>
        <p type="p">4:擋板</p>
        <p type="p">5:窗部</p>
        <p type="p">6:工具持拿部</p>
        <p type="p">7:持拿孔</p>
        <p type="p">8:光電感測器</p>
        <p type="p">9:發光部</p>
        <p type="p">10:受光部</p>
        <p type="p">13:直動機構</p>
        <p type="p">14:導軌</p>
        <p type="p">15:致動器</p>
        <p type="p">50:工具</p>
        <p type="p">52:錐柄</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617375</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J9/02</main-classification>
        <further-classification edition="200601120260102B">B25J9/18</further-classification>
        <further-classification edition="200601120260102B">B25J9/22</further-classification>
        <further-classification edition="200601120260102B">B25J19/02</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田淳哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巣山慶太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYAMA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部泰樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TA, KENTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甲田友希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOUDA, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機器人，包括至少一個可動機構、蓋體及密封元件。可動機構包括第一元件、第二元件及輸出側編碼器。第二元件相對於第一元件移動。輸出側編碼器檢測出第二元件相對於第一元件的移動量。輸出側編碼器包括刻度及檢測頭，刻度固定於第一元件或是第二元件其中之一，並沿移動方向延伸。檢測頭固定於第一元件或第二元件其中之另一，並讀取刻度。蓋體固定於第一元件或第二元件其中之一，蓋體包圍刻度及檢測頭的周圍。密封元件密封住蓋體與第一元件或第二元件其中之另一之間的間隙，並允許第二元件相對於第一元件的移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:第一軸線</p>
        <p type="p">2:基座</p>
        <p type="p">3:旋轉胴體</p>
        <p type="p">10:馬達</p>
        <p type="p">11:馬達軸</p>
        <p type="p">12:減速機</p>
        <p type="p">13:輸入側編碼器</p>
        <p type="p">14:輸出側編碼器</p>
        <p type="p">15:齒輪</p>
        <p type="p">16:中央孔</p>
        <p type="p">17:圓筒狀元件</p>
        <p type="p">17a:外周面</p>
        <p type="p">18:貫穿孔</p>
        <p type="p">19:線條體</p>
        <p type="p">20:刻度</p>
        <p type="p">21:檢測頭</p>
        <p type="p">22:板體</p>
        <p type="p">23:螺栓</p>
        <p type="p">24:蓋體</p>
        <p type="p">25:周壁部</p>
        <p type="p">27:隔壁部</p>
        <p type="p">28:密封元件</p>
        <p type="p">30:軸承</p>
        <p type="p">31:密封元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2444" publication-number="202619085">
    <tif-files tif-type="multi-tif">
      <tif file="114140546.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆疊積體電路裝置及散熱方法</chinese-title>
        <english-title>STACKED INTEGRATED CIRCUIT DEVICE AND METHODS OF THERMAL DISSIPATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">H01L23/367</main-classification>
        <further-classification edition="200601120251110B">H01L21/768</further-classification>
        <further-classification edition="200601120251110B">H01L23/535</further-classification>
        <further-classification edition="200601120251110B">H01L23/538</further-classification>
        <further-classification edition="202501120251110B">H10D88/00</further-classification>
        <further-classification edition="202301120251110B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁鉉權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, HYOUN KWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了堆疊積體電路裝置及散熱方法。在一個或多個範例中，所述裝置和方法包括：在第一堆疊層記憶體和第二堆疊層記憶體之間垂直佈線用於散熱的第一矽通孔 (TSV)；將用於散熱的第二矽通孔水平佈線在以下至少一者之間：第一堆疊層記憶體的實體層（PHY）和第一堆疊層記憶體的第一記憶體晶粒之間，或第二堆疊層記憶體的實體層（PHY）和第二堆疊層記憶體的第一記憶體晶粒之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a stacked IC device and methods for thermal dissipation. In one or more examples, the device and methods include routing, for heat dissipation, a first through-silicon via (TSV) vertically between a first stack of memory and a second stack of memory; routing, for heat dissipation, a second TSV horizontally between at least one of: a physical layer (PHY) of the first stack of memory and a first memory die of the first stack of memory, or a PHY of the second stack of memory and a first memory die of the second stack of memory.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">105:機器</p>
        <p type="p">110:處理器</p>
        <p type="p">115:記憶體</p>
        <p type="p">120:儲存裝置</p>
        <p type="p">125:記憶體控制器</p>
        <p type="p">130:裝置驅動器</p>
        <p type="p">135:電源供應器</p>
        <p type="p">145:發送器</p>
        <p type="p">150:接收器</p>
        <p type="p">160:寫入電路</p>
        <p type="p">165:讀取電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2445" publication-number="202619129">
    <tif-files tif-type="multi-tif">
      <tif file="114140547.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括電應力保護電路的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING ELECTRICAL STRESS PROTECTION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01L23/60</main-classification>
        <further-classification edition="202501120260108B">H10D89/60</further-classification>
        <further-classification edition="202501120260108B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昌洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHANGSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括第一導電類型的半導體基底；電連接至輸入接墊的第一電極；第二導電類型的第一摻雜區域，通過第一接觸插塞電連接至第一電極，並在水平於半導體基底平面的第一方向上彼此間隔開；第二導電類型的第二摻雜區域，在垂直於第一方向的第二方向上與第一摻雜區域中的各者間隔開；以及通過第二接觸插塞電連接至第二摻雜區域中的每一者的第二電極，第二電極電連接至接地電極。第二電極在垂直於半導體基底平面的第三方向上重疊第一摻雜區域和半導體基底之間的空乏區的至少部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a semiconductor substrate of a first conductivity type; a first electrode electrically connected to an input pad; first doped regions of a second conductivity type electrically connected to the first electrode through first contact plugs, and spaced apart from each other in a first direction horizontal to a plane of the semiconductor substrate; second doped regions of the second conductivity type spaced apart from respective ones of the first doped regions in a second direction perpendicular to the first direction; and a second electrode electrically connected to each of the second doped regions through second contact plugs, the second electrode being electrically connected to a ground electrode. The second electrode overlaps at least portions of a depletion region between the first doped regions and the semiconductor substrate in a third direction perpendicular to the plane of the semiconductor substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:保護電路</p>
        <p type="p">110:基底</p>
        <p type="p">131:第一電極</p>
        <p type="p">132A1、132A2:第二電極</p>
        <p type="p">B:基極</p>
        <p type="p">BR:區域</p>
        <p type="p">C:摻雜區域</p>
        <p type="p">CB:邊界</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">DR:空乏區</p>
        <p type="p">F1、F2、Fn:指狀件</p>
        <p type="p">h:距離</p>
        <p type="p">LN:互連電極</p>
        <p type="p">PAD_IN:輸入接墊</p>
        <p type="p">VSS:接地電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2446" publication-number="202618569">
    <tif-files tif-type="multi-tif">
      <tif file="114140548.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>系統晶片、系統晶片的操作方法以及加速器</chinese-title>
        <english-title>SYSTEM-ON-CHIP, OPERATING METHOD OF SYSTEM-ON-CHIP AND ACCELERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F13/28</main-classification>
        <further-classification edition="200601120260102B">G06F12/02</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳俊熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, JUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴峻奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統晶片，包括：加速器，被配置成基於自主機處理器接收到的指令來產生對與神經網路操作對應的需求資料的需求請求，並且基於根據神經網路操作所預測的記憶體存取型樣而產生對預取資料的預取請求；記憶體控制器，被配置成基於需求請求而自記憶體讀取需求資料並基於預取請求而自記憶體讀取預取資料；以及系統快取，被配置成將自記憶體讀取的預取資料及需求資料中的至少一者儲存為讀取資料，其中加速器被配置成對自系統快取接收的讀取資料實行神經網路操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system-on-chip, including: an accelerator configured to generate a demand request for demand data corresponding to a neural network operation, based on an instruction received from a host processor, and to generate a prefetch request for prefetch data based on a memory access pattern predicted according to the neural network operation; a memory controller configured to read the demand data from a memory based on the demand request, and to read the prefetch data from the memory based on the prefetch request; and a system cache configured to store, as read data, at least one of the prefetch data and the demand data read from the memory, wherein the accelerator is configured to perform the neural network operation on the read data received from the system cache.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">100:神經處理單元(NPU)</p>
        <p type="p">101:直接記憶體存取(DMA)引擎</p>
        <p type="p">102:預取模組</p>
        <p type="p">110:記憶體</p>
        <p type="p">120:系統快取</p>
        <p type="p">130:其他元件</p>
        <p type="p">140:介面</p>
        <p type="p">MAP:記憶體存取模式</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2447" publication-number="202617791">
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      <tif file="114140555.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯亞胺膜、其製備方法、包括其的多層膜、可撓性金屬箔層壓板及電子部件</chinese-title>
        <english-title>POLYIMIDE FILM, PREPARATION METHOD THEREOF, MULTILAYER FILM, FLEXIBLE METAL FOIL CLAD LAMINATE AND ELECTRONIC COMPONENT COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251031B">C08F8/46</main-classification>
        <further-classification edition="200601120251031B">C08J5/22</further-classification>
        <further-classification edition="200601120251031B">C07C211/09</further-classification>
        <further-classification edition="200601120251031B">C08G73/10</further-classification>
        <further-classification edition="200601120251031B">C08G81/00</further-classification>
        <further-classification edition="202301120251031B">H10K71/16</further-classification>
        <further-classification edition="200601120251031B">B32B15/088</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商聚醯亞胺尖端素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI ADVANCED MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂文眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, MOON-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡洙京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, SU-KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACK, SUNG-YUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元東榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WON, DONG-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種聚醯亞胺膜及其製備方法，該聚醯亞胺膜包括聚醯亞胺，該聚醯亞胺包括二酐單體及二胺單體作為聚合單元，該二酐單體包括二苯酮四羧酸二酐、聯苯四羧酸二酐及均苯四甲酸二酐，該二胺單體包括1,3-雙(4-胺基苯氧基)苯、1,4-雙(4-胺基苯氧基)苯或其等的組合、及對苯二胺，介電損耗率為0.0030以下，與銅箔的黏著力為0.8kgf/cm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2448" publication-number="202618987">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、其運行方法及包括其的基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">H01L21/67</main-classification>
        <further-classification edition="200601120260131B">H01S5/42</further-classification>
        <further-classification edition="200601120260131B">G05D23/32</further-classification>
        <further-classification edition="200601120260131B">H05B6/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全轃標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JIN PYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛捧浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUL, BONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹星進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅俊永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, JUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李碩徽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEOCK HWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明一實施例的對半導體基板執行溫度控制的基板處理裝置中，基板處理裝置包括：支撐卡盤，用於支撐半導體基板並執行溫度控制；支撐架，一側容納於支撐卡盤中形成的凹槽；多個光吸收部，設置於支撐卡盤的一面；多個雷射器，向光吸收部照射雷射，其分別包括由多個VCSEL元件排列形成的VCSEL陣列；及溫度測量部，用於測量支撐卡盤的溫度。基板處理裝置被配置為：利用溫度測量部確認支撐卡盤的即時溫度；執行基於目標溫度，針對雷射器確定其雷射強度並執行雷射照射的第一動作；當利用溫度測量部確認支撐卡盤已達到目標溫度時，終止雷射照射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板處理系統</p>
        <p type="p">110:基板處理裝置</p>
        <p type="p">120:電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2449" publication-number="202619399">
    <tif-files tif-type="multi-tif">
      <tif file="114140582.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理不可用窗口調整的無線通信方法及相關無線通信設備</chinese-title>
        <english-title>WIRELESS COMMUNICATION METHOD FOR DEALING WITH UNAVAILABLE WINDOW ADJUSTMENT AND RELATED WIRELESS COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">H04W76/19</main-classification>
        <further-classification edition="200901120260102B">H04W16/14</further-classification>
        <further-classification edition="200901120260102B">H04W88/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康皓華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HAO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐建芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEN-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭至鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通信方法包括：生成第一幀，其中該第一幀被配置為承載第一無線通信設備的不可用窗口的資訊；將該第一幀發送至第二無線通信設備；在該第一幀被發送後生成第二幀，其中該第二幀被配置為承載指示該不可用窗口調整的資訊；以及將該第二幀發送至該第二無線通信設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication method includes: generating a first frame, wherein the first frame is configured to carry information of an unavailable window of a first wireless communication device; sending the first frame to a second wireless communication device; generating a second frame after the first frame is sent, wherein the second frame is configured to carry information indicative of an unavailable window adjustment of the unavailable window; and sending the second frame to the second wireless communication device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線通信系統</p>
        <p type="p">102、104:無線通信裝置</p>
        <p type="p">112、122:處理器</p>
        <p type="p">114、124:記憶體</p>
        <p type="p">116、126:控制電路</p>
        <p type="p">117、127:網路介面電路</p>
        <p type="p">118、128:發送(TX)電路</p>
        <p type="p">120、130:接收(RX)電路</p>
        <p type="p">134、146:初始控制幀(ICF)</p>
        <p type="p">136、142:初始控制響應幀(ICR)</p>
        <p type="p">144:控制響應幀(CRF)</p>
        <p type="p">L1、LM:鏈路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2450" publication-number="202619040">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有以不同操作電壓的多階快取的邏輯半導體晶粒</chinese-title>
        <english-title>LOGIC SEMICONDUCTOR DIE WITH MULTIPLE LEVEL CACHES OPERATEDAT DIFFERENT VOLTAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/78</main-classification>
        <further-classification edition="200601120260122B">H01L23/52</further-classification>
        <further-classification edition="201601120260122B">G06F12/08</further-classification>
        <further-classification edition="200601120260122B">G11C11/413</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日日新半導體架構股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTION AND COLLABORATION LABORATORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧超群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單片式晶粒包括基材、第一處理邏輯單元、一組第一低階快取以及第一高階快取。第一處理邏輯單元位於基材中中，且第一處理邏輯單元在第一操作電壓下進行操作。此組第一低階快取位於基材中；第一高階快取位於基材中。其中，此組第一低階快取中的每一者，在第二操作電壓下進行操作；第一高階快取在第三操作電壓下進行操作，且第二操作電壓高於第一操作電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A monolithic die includes a substrate, a first processing logic unit within the substrate, a set of first low level caches within the substrate, and a first high level cache within the substrate; wherein the first processing logic unit is operated at a first operating voltage; each first low level cache is operated at a second operating voltage; the first high level cache is operated at a third operating voltage, and the second operating voltage is higher than the first operating voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3510:SOC晶粒</p>
        <p type="p">3520:新的晶粒</p>
        <p type="p">3530:新的單片式晶粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2451" publication-number="202617045">
    <tif-files tif-type="multi-tif">
      <tif file="114140657.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>側向平移機構、清潔機器人及其控制方法</chinese-title>
        <english-title>LATERAL TRANSLATION MECHANISM, CLEANING ROBOT, AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">A47L11/40</main-classification>
        <further-classification edition="200601120251124B">H02K7/06</further-classification>
        <further-classification edition="200601120251124B">F16H59/00</further-classification>
        <further-classification edition="200601120251124B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瑞旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, RUIWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及清潔機器人領域。本發明公開了一種側向平移機構、清潔機器人及控制方法，側向平移機構應用在清潔機器人上，側向平移機構包括側向平移驅動組件，側向平移驅動組件和濕式清潔件連接，側向平移驅動組件用於驅動濕式清潔件在回收位置和伸出位置之間平移；濕式清潔件處於伸出位置時濕式清潔件在操作面上的投影與底殼在操作面上的投影的聯集大於濕式清潔件處於回收位置時濕式清潔件在操作面上的投影與底殼在操作面上的投影的聯集；濕式清潔件在操作面內的平移方向與底殼的運動方向相交。本申請案實施例的側向平移機構能夠帶動濕式清潔件伸出機身對沿邊區域進行清掃，且可帶動濕式清潔件回收至機身內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the field of cleaning robots. The present disclosure discloses a lateral translation mechanism, a cleaning robot, and a control method. The lateral translation mechanism is applied to the cleaning robot, and the lateral translation mechanism includes a lateral translation driving assembly. The lateral translation driving assembly is connected to a wet cleaning component, and the lateral translation driving assembly is configured to drive the wet cleaning component to translate between a retracted position and an extended position. A union of the projection of the wet cleaning component onto an operating surface and the projection of a bottom shell onto the operating surface when the wet cleaning component is in the extended position is greater than a union of the projection of the wet cleaning component onto the operating surface and the projection of the bottom shell onto the operating surface when the wet cleaning component is in the retracted position. The translation direction of the wet cleaning component within the operating surface intersects with the movement direction of the bottom shell. The lateral translation mechanism of embodiments of the present application can drive the wet cleaning component to extend out of the machine body to clean an edge area, and can also drive the wet cleaning component to retract into the machine body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:步驟</p>
        <p type="p">1:緊固件</p>
        <p type="p">2:底殼</p>
        <p type="p">3:彈性件</p>
        <p type="p">4:導杆</p>
        <p type="p">5:絲杆</p>
        <p type="p">6:絲杆螺母</p>
        <p type="p">7:聯軸器</p>
        <p type="p">8:驅動電機</p>
        <p type="p">9:電機保持架</p>
        <p type="p">10:電路板</p>
        <p type="p">11:平移支架</p>
        <p type="p">12:支撑件</p>
        <p type="p">13:滑動輥</p>
        <p type="p">14:卡簧</p>
        <p type="p">15:濕式清潔件</p>
        <p type="p">29:第二升降支架</p>
        <p type="p">30:第一升降支架</p>
        <p type="p">32:第三避讓槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2452" publication-number="202619025">
    <tif-files tif-type="multi-tif">
      <tif file="114140659.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140659</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓承載裝置溫度控制方法及半導體製程設備</chinese-title>
        <english-title>TEMPERATURE CONTROL METHOD FOR WAFER CARRIER DEVICE AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01L21/687</main-classification>
        <further-classification edition="200601120251201B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李爽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了晶圓承載裝置溫度控制方法及半導體製程設備；其中，該方法包括：當製程腔室執行製程任務時，獲取晶圓承載裝置的第一溫度；若第一溫度滿足預設波動條件，控制製程腔室按照溫度控制模式執行製程任務；在溫度控制模式中，根據第二溫度、加熱溫度和預設溫度閾值對加熱裝置進行控制，以使晶圓承載裝置的溫度保持穩定。該控制方式中，在製程腔室執行製程任務中，當晶圓承載裝置的第一溫度滿足預設波動條件時，藉由溫度控制模式對加熱裝置進行控制，改善了晶圓在製程過程中的溫差過大問題，提高了沉積薄膜的均勻性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a temperature control method for a wafer carrier device and a semiconductor processing equipment; wherein, the method includes: when the process chamber performs a processing task, acquiring a first temperature of the wafer carrier device; if the first temperature satisfies a preset fluctuation condition, controlling the process chamber to perform the processing task according to a temperature control mode; in the temperature control mode, controlling a heating device based on a second temperature, a heating temperature, and a preset temperature threshold, so as to maintain the temperature of the wafer carrier device at a stable level. In this control method, during the execution of the processing task in the process chamber, when the first temperature of the wafer carrier device satisfies the preset fluctuation condition, the heating device is controlled by the temperature control mode, thereby improving the issue of excessive temperature difference of the wafer during the processing and enhancing the uniformity of the deposited film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S302:步驟</p>
        <p type="p">S304:步驟</p>
        <p type="p">S306:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2453" publication-number="202617870">
    <tif-files tif-type="multi-tif">
      <tif file="114140701.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相分離構造形成用樹脂組成物、包含相分離構造之構造體的製造方法，及嵌段共聚物</chinese-title>
        <english-title>RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, METHOD FOR PRODUCING STRUCTURE INCLUDING PHASE-SEPARATED STRUCTURE, AND BLOCK COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">C08L53/00</main-classification>
        <further-classification edition="200601120260113B">C08F297/02</further-classification>
        <further-classification edition="200601120260113B">C08F293/00</further-classification>
        <further-classification edition="200601120260113B">C08J3/21</further-classification>
        <further-classification edition="200601120260113B">B01J13/06</further-classification>
        <further-classification edition="200601120260113B">B01J13/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮城賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGI, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯野翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IINO, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題：提供一種可形成取向性及面內均勻性優異的相分離構造之相分離構造形成用樹脂組成物、使用其之包含相分離構造之構造體的製造方法，及用於前述相分離構造形成用樹脂組成物之嵌段共聚物。  &lt;br/&gt;　　解決方式：一種相分離構造形成用樹脂組成物，其含有：具有第1嵌段、第2嵌段及第3嵌段之嵌段共聚物，且第3嵌段係位於第1嵌段與第2嵌段之間，第1嵌段係由下述式(b1)所示之結構單元的重複結構所構成之聚合物所構成，第2嵌段係由下述式(b2)所示之結構單元的重複結構所構成之聚合物所構成，第3嵌段係由源自高LogP單體之結構單元的重複結構所構成之聚合物所構成，高LogP單體之LogP值係高於甲基丙烯酸甲酯的LogP值。  &lt;br/&gt;&lt;img align="absmiddle" height="198px" width="180px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2454" publication-number="202619315">
    <tif-files tif-type="multi-tif">
      <tif file="114140705.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140705</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>協調波束成形和協調空間重用　PPDU　格式及信令的方法和裝置</chinese-title>
        <english-title>COORDINATED BEAMFORMING AND COORDINATED SPATIAL REUSE PPDU FORMAT AND SIGNALING METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04L5/00</main-classification>
        <further-classification edition="200601120260102B">H04B7/06</further-classification>
        <further-classification edition="201701120260102B">H04B7/024</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佑瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘　剑函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIANHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　昇泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, SHENGQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冯　淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, SHULING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方博雋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, POCHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮爾二世　湯姆士艾德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARE, JR. THOMAS EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了在無線通信中協調波束成形 (CBF 或 CoBF) 和協調空間重用 (CSR 或 CoSR) 物理層 (PHY) 協議數據單元 (PPDU) 格式和信令的技術。一種裝置（例如，一個工作終端 (STA)）通過以下方式執行涉及多存取點 (MAP) 協調傳輸的無線通信：(i) 生成並傳輸一個 PPDU 或 (ii) 接收並處理該 PPDU。該 PPDU 包括一個傳統前導碼，後接一個 AMP 包。該 PPDU 包括一個指示，包含 CBF、CSR 或兩者的格式和信令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques pertaining to coordinated beamforming (CBF or CoBF) and coordinated spatial reuse (CSR or CoSR) physical-layer (PHY) protocol data unit (PPDU) format and signaling in wireless communications are described. An apparatus (e.g., a station (STA)) performs a wireless communication involving a multi-access point (MAP) coordinated transmission by: (i) generating and transmitting a PPDU or (ii) receiving and processing the PPDU. The PPDU includes a legacy preamble followed by an AMP package. The PPDU includes an indication of a format and signaling of CBF, CSR, or both.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:流程</p>
        <p type="p">910、912、914:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2455" publication-number="202618770">
    <tif-files tif-type="multi-tif">
      <tif file="114140739.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於動態隨機存取記憶體的一次編程記憶體裝置的編程方法、讀取方法及測試與修正方法</chinese-title>
        <english-title>PROGRAMMING METHOD, READING METHOD, AND TESTING AND CORRECTION METHOD OF DRAM-BASED ONE TIME PROGRAMMING MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C11/40</main-classification>
        <further-classification edition="200601120260102B">G11C11/409</further-classification>
        <further-classification edition="200601120260102B">G11C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛普科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　文良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WENLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種基於動態隨機存取記憶體(DRAM)的一次編程(OTP)記憶體裝置的編程方法。一所選擇頁面的一所選擇字線被開啟。一感測電路被開啟以將該所選擇頁面的第一資料集感測至該感測電路。一電極板電壓V&lt;sub&gt;PLT&lt;/sub&gt;被設定至一高電壓並對所選擇頁面進行編程。該電極板電壓V&lt;sub&gt;PLT&lt;/sub&gt;被降低，且該所選擇頁面的該字線被關閉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A programming method of a DRAM (dynamic random-access memory)-based one time programming (OTP) memory device is provided. A selected word line (WL) of a selected page is turned on. A sensing circuit is turned on to sense a first data set in the selected page into the sensing circuit. A cell plate voltage (V&lt;sub&gt;PLT&lt;/sub&gt;) is set to a high voltage and the selected page is programmed. The V&lt;sub&gt;PLT&lt;/sub&gt; is lowered, and the selected WL of the selected page is turned off.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:記憶體裝置</p>
        <p type="p">300A:第一記憶體陣列</p>
        <p type="p">300B:第二記憶體陣列</p>
        <p type="p">302:控制器</p>
        <p type="p">304:充電泵浦電路</p>
        <p type="p">306:列解碼器</p>
        <p type="p">308:行解碼器</p>
        <p type="p">310:寫入驅動器</p>
        <p type="p">312:電極板電壓(V&lt;sub&gt;PLT&lt;/sub&gt;)開關</p>
        <p type="p">320:感測放大器</p>
        <p type="p">322:行選擇開關</p>
        <p type="p">324:預充電電路</p>
        <p type="p">326:陣列電壓(V&lt;sub&gt;ARY&lt;/sub&gt;)開關</p>
        <p type="p">328:感測電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2456" publication-number="202618753">
    <tif-files tif-type="multi-tif">
      <tif file="114140790.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子紙顯示器裝置及其驅動方法</chinese-title>
        <english-title>ELECTRONIC PAPER DISPLAY DEVICE AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251113B">G09G3/34</main-classification>
        <further-classification edition="201901120251113B">G02F1/166</further-classification>
        <further-classification edition="201901120251113B">G02F1/1675</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元太科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳紀良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳蔚宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡學宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, XUE-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子紙顯示器裝置及其驅動方法。電子紙顯示器裝置包括電子紙顯示面板及閘極陣列驅動器，其中所述電子紙顯示器裝置中的電子紙顯示面板及所述閘極陣列驅動器設置於電子紙顯示器基板上。所述電子紙顯示面板包括N條掃描線。所述驅動方法包括：基於控制所述閘極陣列驅動器以對所述電子紙顯示面板中的所述N條掃描線進行具備跨越K條掃描線的交錯式掃描。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic paper display (EPD) device and a driving method thereof are provided. The electronic paper display device comprises an electronic paper display panel and a gate driver on array (GOA), where the EPD panel and the GOA of the EPD device are disposed on an EPD substrate. The EPD panel includes N scan lines. The driving method includes following steps. An interlaced scan across K scan lines for the N scan lines are performed based on controlling the gate driver on array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S330:電子紙顯示器裝置的驅動方法的各步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2457" publication-number="202619160">
    <tif-files tif-type="multi-tif">
      <tif file="114140804.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140804</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線基板及配線基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">H01Q1/38</main-classification>
        <further-classification edition="200601120260125B">H05K1/02</further-classification>
        <further-classification edition="200601120260125B">H05K3/10</further-classification>
        <further-classification edition="200601120260125B">H01Q1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木綱一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKE, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配線基板，具備：基板，具有透明性；複數個第1配線，配置於基板的上表面，並在第1方向上延長，且具有與基板相接的背面、及朝向背面的相反側的正面；及第2配線，配置於基板的上表面，並在與第1方向交叉的第2方向上延長，且具有與基板相接的背面、及朝向背面的相反側的正面。第1配線具有一對側面，前述一對側面是在第1方向上延長，且與第1配線的背面相鄰，第2配線的一對側面是分別朝向內側凹入。第2配線具有一對側面，前述一對側面是在第2方向上延長，且與第2配線的背面相鄰，第2配線的一對側面是分別朝向內側凹入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:配線基板</p>
        <p type="p">100:基板</p>
        <p type="p">102:第1側</p>
        <p type="p">104:第2側</p>
        <p type="p">200:第1配線</p>
        <p type="p">300:第2配線</p>
        <p type="p">D1,D2,D3:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2458" publication-number="202618988">
    <tif-files tif-type="multi-tif">
      <tif file="114140824.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可旋轉頂板組件的多站工具</chinese-title>
        <english-title>MULTI-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/67</main-classification>
        <further-classification edition="200601120260127B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑟　卡爾　費德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEESER, KARL FREDERICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉芙依　艾里恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAVOIE, ADRIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供具有多站處理腔室的半導體處理工具，包括轉動軸承機構，該轉動軸承機構允許半導體處理工具的頂板組件在維修及保養操作期間轉動。在一些實行例中，可提供垂直位移機構，該垂直位移機構可用於將頂板組件在第一配置與第二配置之間轉變，其中頂板組件至少在第二配置中係可轉動的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor processing tools with multi-station processing chambers are provided that include a rotational bearing mechanism that allows a top plate assembly thereof to be rotated during maintenance and service operations. In some implementations, a vertical displacement mechanism may be provided that may be used to transition the top plate assembly between a first configuration and a second configuration, with the top plate assembly being rotatable in at least the second configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體處理工具</p>
        <p type="p">102:基部</p>
        <p type="p">104:腔室外殼</p>
        <p type="p">106:晶圓支撐件</p>
        <p type="p">108:晶圓支撐件致動器</p>
        <p type="p">110:晶圓</p>
        <p type="p">112:開口</p>
        <p type="p">114:密封件</p>
        <p type="p">116:頂板組件</p>
        <p type="p">118:頂板</p>
        <p type="p">120:孔口</p>
        <p type="p">122:氣體分佈組件</p>
        <p type="p">124:氣體分佈板</p>
        <p type="p">126:密封件</p>
        <p type="p">128:氣體分佈埠口</p>
        <p type="p">130:閥</p>
        <p type="p">132:升降特徵部</p>
        <p type="p">134:頂部組件</p>
        <p type="p">136:頂部組件外殼</p>
        <p type="p">138:垂直升降致動器</p>
        <p type="p">140:鎖定致動器</p>
        <p type="p">142:氣體分佈系統</p>
        <p type="p">144:射頻(RF)產生器</p>
        <p type="p">146:轉動軸承機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2459" publication-number="202618070">
    <tif-files tif-type="multi-tif">
      <tif file="114140859.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140859</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於銅電鍍之包含晶粒細化劑之非酸性組成物</chinese-title>
        <english-title>NON-ACIDIC COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN REFINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C25D3/38</main-classification>
        <further-classification edition="200601120260102B">C25D5/50</further-classification>
        <further-classification edition="200601120260102B">C25D7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞諾　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARNOLD, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福路格　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUEGEL, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安傑哈德特　納迪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGELHARDT, NADINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾姆尼　夏洛特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMNET, CHARLOTTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈斯　詹　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORGES, JAN NICLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於在半導體基板上沉積銅之組成物，該組成物包含：  &lt;br/&gt;（a）銅離子；  &lt;br/&gt;（b）式G1a或G1b之晶粒細化劑  &lt;br/&gt;&lt;img align="absmiddle" height="308px" width="330px" file="ed10075.JPG" alt="ed10075.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;或其鹽；  &lt;br/&gt;（c）錯合劑；及  &lt;br/&gt;（d）視需要選用之緩衝劑或鹼以將pH調節至7至13之pH；  &lt;br/&gt;其中  &lt;br/&gt;R&lt;sup&gt;G1&lt;/sup&gt;       為下式之胺甲醯基：  &lt;br/&gt;&lt;img align="absmiddle" height="119px" width="144px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；  &lt;br/&gt;R&lt;sup&gt;G2&lt;/sup&gt;       選自由以下組成之群：（a）羧基、（b）磺酸酯基、（c）硫酸酯基、（d）胺甲醯基、（e）C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;4&lt;/sub&gt;烷氧基、（f）鹵素、（g）CN及（h）C&lt;sub&gt;6&lt;/sub&gt;-C&lt;sub&gt;12&lt;/sub&gt;芳基，其中芳基未經取代或經基團（a）至（h）中之一或多者取代；及  &lt;br/&gt;X&lt;sup&gt;G1&lt;/sup&gt;      選自C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;6&lt;/sub&gt;烷二基，其可經一或二個O中斷；  &lt;br/&gt;R&lt;sup&gt;G11&lt;/sup&gt;、R&lt;sup&gt;G12&lt;/sup&gt; 獨立地選自H、C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;4&lt;/sub&gt;烷基、C&lt;sub&gt;6&lt;/sub&gt;至C&lt;sub&gt;12&lt;/sub&gt;芳基、C&lt;sub&gt;6&lt;/sub&gt;至C&lt;sub&gt;12&lt;/sub&gt;芳基烷基；C&lt;sub&gt;6&lt;/sub&gt;至C&lt;sub&gt;12&lt;/sub&gt;烷基芳基；  &lt;br/&gt;其中該組成物之pH值為7至13。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a composition for depositing copper on a semiconductor substrate, the composition comprising &lt;br/&gt;(a) copper ions; &lt;br/&gt;(b) a grain refiner of formula G1a or G1b &lt;br/&gt;&lt;img align="absmiddle" height="299px" width="340px" file="ed10077.JPG" alt="ed10077.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;or salts thereof &lt;br/&gt;(c) a complexing agent; and &lt;br/&gt;(d) optionally a buffer or a base to adjust the pH to a pH of from 7 to 13; &lt;br/&gt;wherein &lt;br/&gt;R&lt;sup&gt;G1&lt;/sup&gt; is a carbamoyl group of formula &lt;br/&gt;&lt;img align="absmiddle" height="110px" width="143px" file="ed10078.JPG" alt="ed10078.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ; &lt;br/&gt;R&lt;sup&gt;G2&lt;/sup&gt; is selected from the group consisting of (a) carboxyl, (b) sulfonate, (c) sulfate (d) carbamoyl, (e) C&lt;sub&gt;1&lt;/sub&gt; to C&lt;sub&gt;4&lt;/sub&gt; alkoxy, (f) halogen, (g) CN, and (h) C&lt;sub&gt;6&lt;/sub&gt;-C&lt;sub&gt;12&lt;/sub&gt; aryl, which aryl is unsubstituted or substituted by one or more of the groups (a) to (h); and &lt;br/&gt;X&lt;sup&gt;G1&lt;/sup&gt; is selected from C&lt;sub&gt;1&lt;/sub&gt; to C&lt;sub&gt;6&lt;/sub&gt; alkanediyl, which may be interrupted by one or two O; &lt;br/&gt;R&lt;sup&gt;G11&lt;/sup&gt;, R&lt;sup&gt;G12&lt;/sup&gt; are independently selected from H, C&lt;sub&gt;1&lt;/sub&gt; to C&lt;sub&gt;4&lt;/sub&gt; alkyl, C&lt;sub&gt;6&lt;/sub&gt; to C&lt;sub&gt;12&lt;/sub&gt; aryl, C&lt;sub&gt;6&lt;/sub&gt; to C&lt;sub&gt;12&lt;/sub&gt; arylalkyl; C&lt;sub&gt;6&lt;/sub&gt; to C&lt;sub&gt;12&lt;/sub&gt; alkylaryl; &lt;br/&gt;wherein the pH of the composition is from 7 to 13.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2460" publication-number="202618493">
    <tif-files tif-type="multi-tif">
      <tif file="114140863.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人控制方法、機器人、控制器及電腦可讀儲存媒介</chinese-title>
        <english-title>ROBOT CONTROL METHOD, ROBOT, CONTROLLER, AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">G05D1/622</main-classification>
        <further-classification edition="202401120260102B">G05D1/628</further-classification>
        <further-classification edition="200601120260102B">G05B19/42</further-classification>
        <further-classification edition="201701120260102B">G06T7/70</further-classification>
        <further-classification edition="201701120260102B">G06T7/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹麗娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, LINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案適用於機器人技術領域，提供了一種機器人控制方法、機器人、控制器及電腦可讀儲存媒介，包括：獲取包括障礙物的圖像序列以及所述圖像序列關聯的相機位姿序列；基於所述圖像序列，跟蹤所述障礙物的指定特徵點，得到所述指定特徵點在所述圖像序列的每個圖像中的圖像位置；對各所述圖像位置進行深度估計，得到各所述圖像位置的深度值；基於各所述圖像位置、各所述深度值以及所述相機位姿序列，確定所述指定特徵點的實際位置；基於所述實際位置，控制機器人執行減速避障操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure pertains to the field of robotics and provides a robot control method, a robot, a controller, and a computer-readable storage medium. The method includes: acquiring an image sequence comprising an obstacle and a camera pose sequence associated with the image sequence; tracking a specified feature points of the obstacle based on the image sequence to obtain an image position of the specified feature point in each image of the image sequence; obtaining a depth value for each image position by performing depth estimation on the image positions; determining an actual position of the specified feature point based on the image positions, depth values, and the camera pose sequence; and controlling a robot to execute a deceleration obstacle avoidance operation based on the actual position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103、S104、S105:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2461" publication-number="202619381">
    <tif-files tif-type="multi-tif">
      <tif file="114140878.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用性報告裝置及方法</chinese-title>
        <english-title>METHODS AND APPARATUS FOR APPLICABILITY REPORTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120251201B">H04W24/10</main-classification>
        <further-classification edition="200601120251201B">H04L25/02</further-classification>
        <further-classification edition="202201120251201B">H04L41/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁淨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辜禹仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, YU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於多種基於人工智慧(artificial intelligence；AI)或機器學習(machine learning；ML)的通道狀態資訊(channel state information；CSI)預測的適用性報告解決方案。一設備可能從一網路節點接收一適用性報告配置。該適用性報告配置可能包括與基於AI或ML的CSI預測的一或多個功能相關的一或多個關聯身份(associated identity；ID)。該設備可能向該網路節點報告一或多組推論相關參數的適用功能資訊，該一或多組推論相關參數對應於該一或多個關聯ID。該設備可能從該網路節點接收與該適用功能資訊相關的推論報告配置。然後，該設備可能根據該推論報告配置執行基於AI或ML的CSI預測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various solutions for applicability reporting of artificial intelligence (AI) or machine learning (ML) based channel state information (CSI) prediction are described. An apparatus may receive an applicability reporting configuration from a network node. The applicability reporting configuration may include one or more associated identities (IDs) related to one or more functionalities for an AI-based or ML-based CSI prediction. The apparatus may report applicable functionality information of one or more sets of inference-related parameters corresponding to the one or more associated IDs to the network node. The apparatus may receive an inference report configuration associated with the applicable functionality information from the network node. Then, the apparatus may perform the AI-based or ML-based CSI prediction according to the inference report configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:場景</p>
        <p type="p">301、302、303、304、305、306:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2462" publication-number="202619387">
    <tif-files tif-type="multi-tif">
      <tif file="114140883.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理禁止的追蹤區域識別碼列表的方法和裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR HANDLING FORBIDDEN TAI LIST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W48/08</main-classification>
        <further-classification edition="200901120260102B">H04W48/02</further-classification>
        <further-classification edition="200901120260102B">H04W60/04</further-classification>
        <further-classification edition="200901120260102B">H04W8/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>無　邦尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, PUNEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納耶米　馬各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEMI, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了在移動通訊中，因網路提供的無線接入技術(RAT)限制指示而處理禁止的追蹤區域識別碼(TAI)列表的技術。一種裝置(例如，一用戶設備)接收來自一網路的帶有一拒絕原因的拒絕訊息。該裝置確定該拒絕原因之接收是為了提供當前RAT受限的資訊。響應於該確定，該裝置避免將當前的TAI儲存在禁止的TAI列表中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques pertaining to handling of a forbidden tracking area identity (TAI) list due to a radio access technology (RAT) restriction indication from a network in mobile communications are described.An apparatus (e.g., a UE) receives a reject message from a network with a reject cause.The apparatus determines that the reject cause is received for providing information that a current RAT is restricted.In response to the determining, the apparatus refrains from storing a current tracking area identity (TAI) in a forbidden TAI list.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法流程</p>
        <p type="p">310,320,330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2463" publication-number="202619388">
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      <tif file="114140888.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>定義衛星模式能力之方法與可在用戶設備中實施的裝置</chinese-title>
        <english-title>METHODS FOR DEFINING SATELLITE MODE CAPABILITY AFTER REGISTRATION AND APPARATUS IMPLEMENTED IN USER EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120251201B">H04W48/18</main-classification>
        <further-classification edition="200901120251201B">H04W36/04</further-classification>
        <further-classification edition="200901120251201B">H04W60/04</further-classification>
        <further-classification edition="200601120251201B">H04B7/185</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>無　邦尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, PUNEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納耶米　馬各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEMI, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述了在行動通信中註冊後定義衛星模式能力的技術。一種裝置（例如，一用戶設備(user equipment, UE)）嘗試與一衛星網路執行一程序（例如，註冊、附加或追蹤區域更新 (tracking area update, TAU)）。此裝置確定此嘗試使一嘗試計數器達到一預設數值。響應於嘗試計數器確定達到預設數值，此裝置執行一或多個操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques pertaining to defining satellite mode capability after registration in mobile communications are described. An apparatus (e.g., a UE) attempts to perform a procedure (e.g., registration or attach or tracking area update (TAU)) with a satellite network. The apparatus determines that an attempt counter reaches a predefined value as a result of the attempting. In response to the determining, the apparatus performs one or more operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:流程</p>
        <p type="p">310、320、330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2464" publication-number="202617204">
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      <tif file="114140904.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可控制粒徑的機芯及可控制粒徑的霧化裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251218B">A61M11/00</main-classification>
        <further-classification edition="200601120251218B">A61M15/00</further-classification>
        <further-classification edition="200601120251218B">B05B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>捷特醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JTM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許由忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅凱耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, KAI-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾信華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HSIN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於搭配霧化單元的可控制粒徑的機芯及可控制粒徑的霧化裝置，可控制粒徑的機芯包括包覆單元，用以包覆所述霧化單元所產生的氣霧，包覆單元界定內部的氣霧空間，以形成受控流動環境，其中，包覆單元具有至少一氣霧出口，至少一氣霧出口連通氣霧空間，並且至少一氣霧出口被構造成能將氣霧空間中的預設的粒徑範圍的氣霧導出包覆單元，以及包覆單元被構造成：使在氣霧空間中自氣霧凝結成液滴的流向不同於經由至少一氣霧出口而導出包覆單元的氣霧的流向。可控制粒徑的霧化裝置包括霧化單元及可控制粒徑的機芯。本發明的可控制粒徑的機芯及可控制粒徑的霧化裝置可以讓機芯內的氣霧形成預設的粒徑範圍後再流出，達成粒徑尺寸的控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:氣霧出口</p>
        <p type="p">15:安裝部</p>
        <p type="p">2:粒徑篩選結構</p>
        <p type="p">3:液體導流部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2465" publication-number="202617313">
    <tif-files tif-type="multi-tif">
      <tif file="114140910.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>實現多種加工圖案的雷射加工裝置及使用該裝置的雷射加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251210B">B23K26/062</main-classification>
        <further-classification edition="201401120251210B">B23K26/064</further-classification>
        <further-classification edition="200601120251210B">B23K26/067</further-classification>
        <further-classification edition="200601120251210B">G02B27/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商未來股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEERE COMPANY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浚政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JOON JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奉燉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BONG DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種雷射加工裝置，包括：光學單元及控制器。光學單元調節雷射光束並將調節後的雷射光束照射到被加工物表面；光學單元包括：包括複數個用以轉換雷射光束的形狀的第一繞射光學元件的第一光學組、包括複數個用以將雷射光束分支為多光束的第二繞射光學元件的第二光學組、從第一光學組和第二光學組中分別選擇繞射光學元件並將所選擇的繞射光學元件以雷射光束的光軸為基準進行串聯配置並組合的光學元件支架、將雷射光束聚焦到被加工物表面上的透鏡單元；控制器接收加工圖案資料並依據輸入的加工圖案資料確定加工參數並控制光學元件支架選擇與確定的加工參數對應的第一繞射光學元件和第二繞射光學元件的組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雷射加工裝置</p>
        <p type="p">110:雷射振盪器</p>
        <p type="p">115:雷射衰減器</p>
        <p type="p">120:光學單元</p>
        <p type="p">120m:光學鏡體</p>
        <p type="p">121:第一光學組</p>
        <p type="p">122:第二光學組</p>
        <p type="p">124:透鏡單元</p>
        <p type="p">124L:物鏡</p>
        <p type="p">125:光學元件支架</p>
        <p type="p">130:加工台</p>
        <p type="p">140:同軸光學系統</p>
        <p type="p">141:相機</p>
        <p type="p">141m:鏡體</p>
        <p type="p">142:同軸照明</p>
        <p type="p">142m:鏡體</p>
        <p type="p">150:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2466" publication-number="202618054">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>波紋管組件及半導體製程設備</chinese-title>
        <english-title>BELLOWS ASSEMBLY AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251126B">C23C16/455</main-classification>
        <further-classification edition="200601120251126B">C23C16/44</further-classification>
        <further-classification edition="200601120251126B">C23C16/52</further-classification>
        <further-classification edition="200601120251126B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李新龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LONG XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯棟方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, DONG FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種波紋管組件及半導體製程設備，其中，波紋管組件適用於包括腔室主體和提升機構的半導體製程設備，其包括波紋管本體和吹掃組件，波紋管本體包括第一連接端和第二連接端，第一連接端密封連接腔室主體，第二連接端密封連接於提升機構的升降台，以使波紋管本體能夠在提升機構的驅動下伸縮；吹掃組件與波紋管本體的內腔連通以向波紋管本體的內腔中吹氣，用於阻止反應腔中的製程顆粒進入波紋管本體的內腔；如此，基座的底部和波紋管本體的內壁將不會產生製程副產物的殘留和積累，進而無需在基座升降後，對製程腔室進行清潔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a bellows assembly and semiconductor process equipment. The bellows assembly is suitable for a semiconductor process equipment that includes a chamber body and a lifting mechanism. The bellows assembly includes a bellows body and a purge assembly, and the bellows body includes a first connecting end and a second connecting end. The first connecting end is sealingly connected to the chamber body, and the second connecting end is sealingly connected to the lifting platform of the lifting mechanism, so that the bellows body can be extended and retracted under the drive of the lifting mechanism. The purge assembly is connected to the inner cavity of the bellows body to blow gas into the inner cavity of the bellows body, which is used to prevent process particles in the reaction chamber from entering the inner cavity of the bellows body. In this way, the bottom of the base and the inner wall of the bellows body will not have residues or accumulation of process by-products, thereby eliminating the need to clean the process chamber after the base is raised or lowered.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:腔室主體</p>
        <p type="p">2:提升機構</p>
        <p type="p">3:基座</p>
        <p type="p">4:襯底</p>
        <p type="p">5:波紋管組件</p>
        <p type="p">6:升降台</p>
        <p type="p">301:支撐局部</p>
        <p type="p">302:承載局部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2467" publication-number="202617997">
    <tif-files tif-type="multi-tif">
      <tif file="114140925.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙鏈寡核苷酸、綴合物和組合物以及它們的用途</chinese-title>
        <english-title>DOUBLE-STRANDED OLIGONUCLEOTIDE, CONJUGATE, COMPOSITION, AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N15/113</main-classification>
        <further-classification edition="200601120260102B">A61K31/713</further-classification>
        <further-classification edition="201701120260102B">A61K47/54</further-classification>
        <further-classification edition="200601120260102B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京炫景瑞醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGERNA THERAPEUTICS (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HAITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃淵餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高永鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YONGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種雙鏈寡核苷酸、綴合物和組合物以及它們的用途，涉及核酸藥物技術領域。該雙鏈寡核苷酸包含正義鏈和反義鏈，正義鏈和反義鏈至少部分地反向互補形成具有16至21個鹼基對的雙鏈體區；雙鏈寡核苷酸中存在至少一個懸垂端，且懸垂端不位於反義鏈的5'末端，其中雙鏈體區含有至少一個[2'-R&lt;sub&gt;1&lt;/sub&gt;-2'-R&lt;sub&gt;2&lt;/sub&gt;]修飾的核苷酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a double-stranded oligonucleotide, a conjugate, a composition, and uses thereof, which pertains to the technical field of nucleic acid drugs. The double-stranded oligonucleotide comprises a sense strand and an antisense strand; the sense strand and the antisense strand are at least partially reverse-complementary to form a duplex region having 16 to 21 base pairs. The double-stranded oligonucleotide has at least one overhang, and the overhang is not located at the 5'-end of the antisense strand, wherein the duplex region contains at least one [2'-R1-2'-R2] modified nucleotide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2468" publication-number="202619332">
    <tif-files tif-type="multi-tif">
      <tif file="114140927.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140927</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非接入層協定標頭優化方法及可在用戶設備中實施的裝置</chinese-title>
        <english-title>METHODS FOR NAS PROTOCOL HEADER OPTIMIZATION AND APPARATUS IMPLEMENTED IN USER EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120251201B">H04L69/22</main-classification>
        <further-classification edition="200901120251201B">H04W28/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUNEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納耶米　馬各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEMI, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了在行動通訊中非接入層（Non-access stratum, NAS）協定標頭優化的技術。一種裝置（例如，一UE）與網路進行關於支持NAS或接入層（Access stratum, AS）訊息額外負擔減少信令功能的通信。該裝置與網路執行控制平面（control plane, CP）資料傳輸，並在NAS協定標頭中具有減少的額外負擔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques pertaining to non-access stratum (NAS) protocol header optimization in mobile communications are described. An apparatus (e.g., a UE) communicates with a network regarding support of a NAS or access stratum (AS) message overhead reduction signaling feature. The apparatus performs with the network a control plane (CP) data transport with a reduced overhead in a NAS protocol header.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:流程</p>
        <p type="p">310、320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2469" publication-number="202617603">
    <tif-files tif-type="multi-tif">
      <tif file="114140965.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋰離子二次電池用負極活性物質及其製造方法、以及鋰離子二次電池用負極電極</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">C01B33/32</main-classification>
        <further-classification edition="200601120260106B">C03C3/089</further-classification>
        <further-classification edition="200601120260106B">C01F11/18</further-classification>
        <further-classification edition="201001120260106B">H01M4/1395</further-classification>
        <further-classification edition="201001120260106B">H01M10/0525</further-classification>
        <further-classification edition="200601120260106B">C03B19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本重化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN METALS AND CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮脇稔勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAWAKI, TOSHIMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有賀悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARUGA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗田純志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大澤雅人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAWA, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種鋰離子二次電池用負極活性物質，其抑制伴隨於鋰之包藏、釋放之矽粒子之膨脹收縮所導致之矽粒子之崩解，從而即便反覆進行充放電，亦可抑制放電容量維持率（循環特性）之降低。本發明係一種鋰離子二次電池用負極活性物質，其矽粒子分散於矽酸鋰相，並且，上述矽酸鋰相為以含鋇玻璃材作為主相之複合體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2470" publication-number="202619205">
    <tif-files tif-type="multi-tif">
      <tif file="114140982.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>端子模組及具有端子模組的電連接器</chinese-title>
        <english-title>CONTACT ASSEMBLY AND ELECTRICAL CONNECTOR HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">H01R13/6586</main-classification>
        <further-classification edition="201101120260102B">H01R13/6589</further-classification>
        <further-classification edition="201101120260102B">H01R13/6471</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特倫斯　Ｆ　李托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERRANCE F, LITTLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種端子模組，其包括：具有多個接觸部和多個安裝部的一排信號端子；絕緣件，所述絕緣件固定所述一排信號端子；上遮罩片，所述上遮罩片位於所述一排信號端子的上側；及下遮罩片，所述下遮罩片位於所述一排信號端子的下側；其中，所述一排信號端子包括至少一對差分信號端子，所述上遮罩片和所述下遮罩片中的至少一個設有多個接地安裝部，所述接地安裝部與所述一排信號端子的所述多個安裝部對齊，所述端子模組進一步包括遮罩體，所述遮罩體至少部分位於所述一排信號端子的至少一對差分信號端子和相鄰的信號端子之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A contact assembly comprises: a row of signal contacts having plural contacting portions and plural mounting portions; an insulator secured to the row of signal contacts; and an upper ground plate and a lower ground plate surrounding the row of signal contacts; wherein, the row of signal contacts including at least one pair of differential signal contacts, at least one of the upper ground plate and the lower ground plate integrally has a plurality of ground mounting portions aligned with the plurality of mounting portions of the row of signal contacts; and a shield is located between at least one pair of differential signal contacts and an adjacent signal contact of the row of signal contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">802:一排端子</p>
        <p type="p">804:絕緣件</p>
        <p type="p">806:上遮罩片</p>
        <p type="p">808:下遮罩片8</p>
        <p type="p">810:導電件</p>
        <p type="p">860:遮罩體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2471" publication-number="202619196">
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      <tif file="114140983.zip" no="1">
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        <document-id>
          <doc-number>202619196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140983</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>端子模組及具有端子模組的電連接器</chinese-title>
        <english-title>CONTACT ASSEMBLY AND ELECTRICAL CONNECTOR HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">H01R13/6471</main-classification>
        <further-classification edition="201101120260102B">H01R13/6581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特倫斯　Ｆ　李托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERRANCE F, LITTLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞繆爾　鋒　黎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMUEL, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種端子模組，其用於電連接器，所述端子模組包括：一排端子，所述一排端子的每個端子均具有接觸部和安裝部；及絕緣件，所述絕緣件固定所述一排信號端子；其中，還包括設置在所述一排端子外側的外遮罩片和設置在所述一排端子內側的內遮罩片，及機械及電性連接所述外遮罩片和內遮罩片的導電件，所述外遮罩片和內遮罩片中的至少一個一體地形成有多個接地接觸部，所述多個接地接觸部與所述一排端子的所述接觸部對齊，所述內遮罩片和外遮罩片中的至少一個具有多個用於與所述內遮罩片和外遮罩片中的另一個接觸的接地安裝部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A contact assembly for an electrical connector comprises: a row of signal contacts having plural contacting portions and plural mounting portions; an insulator secured to the row of signal contacts; an outer ground plate and an inner ground plate surrounding the row of signal contacts, at least one of the outer ground plate and the inner ground plate integrally forming plural ground contacting portions aligned with the plural contacting portions of the row of signal contacts; and a conductive element electrically connecting the outer ground plate and the inner ground plate; wherein at least one of the outer ground plate and the inner ground plate integrally has a plurality of ground mounting portions contacting the other of the outer ground plate and the inner ground plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402:一排端子</p>
        <p type="p">404:絕緣件</p>
        <p type="p">406:外遮罩片</p>
        <p type="p">408:內遮罩片</p>
        <p type="p">410:導電件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2472" publication-number="202618695">
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      <tif file="114140988.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧影像分析與報告生成系統及其方法</chinese-title>
        <english-title>ARTIFICAL INTELLIGENCE IMAGE AND ANALYSIS AND REPORT GENERATION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120251201B">G06T7/00</main-classification>
        <further-classification edition="202201120251201B">G06V10/70</further-classification>
        <further-classification edition="201301120251201B">G10L15/00</further-classification>
        <further-classification edition="200601120251201B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳凱逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許維志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉王鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, WANG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的人工智慧影像分析與報告生成系統包括伺服器以及穿戴裝置。穿戴裝置包括通訊模組、取像模組、麥克風模組以及運算單元。運算單元透過該通訊模組傳送語音指令以及多個拍攝影像至伺服器。伺服器將語音指令以及多個拍攝影像輸入至人工智慧模組，以使人工智慧模組響應於語音指令所生成的報告編輯指令來比較多個拍攝影像之間的差異，以生成具有分析資訊的專案報告檔案。分析資訊對應多個拍攝影像之間的差異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An artificial intelligence image analysis and report generation system includes a server and a wearable device. The wearable device includes a communication module, an imaging module, a microphone module, and a computing unit. The computing unit transmits voice commands and a plurality of captured images to the server via the communication module. The server inputs the voice commands and the plurality of captured images into the artificial intelligence module. The artificial intelligence module generates report editing instructions in response to the voice commands, compares the differences between the plurality of captured images, and generates a project report file containing analysis information. The analysis information corresponds to the differences between the plurality of captured images.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:人工智慧影像分析與報告生成系統</p>
        <p type="p">110:穿戴裝置</p>
        <p type="p">111:運算單元</p>
        <p type="p">112:取像模組</p>
        <p type="p">113:麥克風模組</p>
        <p type="p">114:通訊模組</p>
        <p type="p">120:伺服器</p>
        <p type="p">121:人工智慧模組</p>
        <p type="p">130:終端裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2473" publication-number="202617386">
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          <doc-number>202617386</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J13/06</main-classification>
        <further-classification edition="200601120260102B">B25J13/00</further-classification>
        <further-classification edition="200601120260102B">H05K5/04</further-classification>
        <further-classification edition="200601120260102B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千葉哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIBA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉町悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMACHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種控制裝置，包括：箱狀之外殼，包括：水平配置的底面、以及設置於從該底面的周緣立起的複數側面中之一面的開口部；支撐部件，配置於底面且與開口部在深度方向上隔著預定距離，並包括與底面上方隔著平行間隔對向的向下支撐面；以及安裝部件，容納於外殼內，並固定於底面；其中，安裝部件包括與底面接觸之平板狀的腳部，且該腳部在深度方向的兩側，具有向該深度方向之外側延伸的翼狀；深度方向之一側的腳部，以嵌合的方式，插入底面與向下支撐面之間的間隙，另一側的腳部在開口部側固定於底面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控制裝置</p>
        <p type="p">20:外殼</p>
        <p type="p">21:本體</p>
        <p type="p">22:底面</p>
        <p type="p">23:側面</p>
        <p type="p">24:分割板</p>
        <p type="p">25:開口部</p>
        <p type="p">26:開口部</p>
        <p type="p">30:門部</p>
        <p type="p">40:變壓器</p>
        <p type="p">47b:安裝部</p>
        <p type="p">48b:安裝部</p>
        <p type="p">50:支撐部件</p>
        <p type="p">B:螺栓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2474" publication-number="202617387">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J13/06</main-classification>
        <further-classification edition="200601120260102B">B25J13/00</further-classification>
        <further-classification edition="200601120260102B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千葉哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIBA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松平哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDAIRA, TETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種控制裝置，包括：框體，呈箱狀且容納控制單元，該控制單元用以控制工業機械；複數腳部，從框體之底面向下方突出，並支撐框體；纜線體，將控制單元與工業機械或外部機器連接；以及纜線引導件，安裝於底面之寬方向之中間位置，將從框體之前表面被引出的纜線體的一部分引導通過比底面更下方的空間，再引導至框體之後方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控制裝置</p>
        <p type="p">20:框體</p>
        <p type="p">21:前表面</p>
        <p type="p">21a:連接器</p>
        <p type="p">21b:引出口</p>
        <p type="p">21c:傾斜面</p>
        <p type="p">22:底面</p>
        <p type="p">25:門</p>
        <p type="p">30:腳輪</p>
        <p type="p">40:纜線體</p>
        <p type="p">50:纜線引導件</p>
        <p type="p">60:貨叉引導件</p>
        <p type="p">s:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2475" publication-number="202617383">
    <tif-files tif-type="multi-tif">
      <tif file="114140995.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人系統以及教示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">B25J9/22</main-classification>
        <further-classification edition="200601120260119B">B25J13/08</further-classification>
        <further-classification edition="200601120260119B">G05B19/42</further-classification>
        <further-classification edition="200601120260119B">B65G47/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠山渉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOOYAMA, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機器人系統，包括一個以上的處理器，控制具有工具的機械臂；處理器可以進行動作設定，設定機械臂的以下至少一種動作：第一動作，為了對需要在貨櫃中移動之目標工件進行貨櫃內移動，將工具的部分配置於目標工件與貨櫃的圍壁之間，再使工具向遠離圍壁任意位置的方向移動；及第二動作，為了貨櫃內移動，使部分配置於貨櫃內的工具進行旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20A:座標系</p>
        <p type="p">40B:工具中心點</p>
        <p type="p">41:爪形部件</p>
        <p type="p">100:機器人系統</p>
        <p type="p">200:貨櫃</p>
        <p type="p">210:底面</p>
        <p type="p">220:圍壁</p>
        <p type="p">221:角落部</p>
        <p type="p">222:壁部件</p>
        <p type="p">A-2,A-3:箭頭</p>
        <p type="p">W:工件</p>
        <p type="p">WT:目標工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2476" publication-number="202617046">
    <tif-files tif-type="multi-tif">
      <tif file="114141018.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備控制方法、裝置、程式產品、儲存媒體及清潔設備</chinese-title>
        <english-title>METHOD OF CONTROLLING CLEANING APPARATUS, DEVICE, PROGRAM PRODUCT, MEDIUM AND CLEANING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A47L11/40</main-classification>
        <further-classification edition="200601120260127B">A47L11/24</further-classification>
        <further-classification edition="200601120260127B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種清潔設備控制方法、裝置、程式產品、儲存媒體及清潔設備。所述清潔設備包括機械臂，所述機械臂用於抓取物體以對物體進行搬運。所述控制方法包括：如果所述清潔設備在搬運目標物體的過程中遇到待越過的障礙物，則控制所述清潔設備將機械臂抓取的目標物體放置在地面；在所述清潔設備將機械臂抓取的目標物體放置在地面之後，控制所述清潔設備以空載狀態越過所述障礙物；在所述清潔設備越過所述障礙物之後，控制所述清潔設備藉由所述機械臂重新抓取所述目標物體，以繼續對所述目標物體進行搬運。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of controlling cleaning apparatus, a device, a program product, a medium and a cleaning apparatus. The cleaning apparatus includes a mechanical arm configured to grasp objects for transporting. The method includes: if the cleaning apparatus encounters an obstacle to be crossed during a process of transporting a target object, controlling the cleaning apparatus to place the target object grasped by the mechanical arm onto the ground; controlling the cleaning apparatus to cross the obstacle in an unloaded state after the cleaning apparatus places the target object grasped by the mechanical arm onto the ground; and controlling the cleaning apparatus to re-grasp the target object via the mechanical arm to continue transporting the target object after the cleaning apparatus crosses the obstacle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310、320、330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2477" publication-number="202619230">
    <tif-files tif-type="multi-tif">
      <tif file="114141020.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202619230</doc-number>
        </document-id>
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        <document-id>
          <doc-number>114141020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線電力系統及訓練機器學習模型的方法</chinese-title>
        <english-title>WIRELESS POWER SYSTEM AND METHOD FOR TRAINING A MACHINE LEARNING MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251201B">H02J50/90</main-classification>
        <further-classification edition="201901120251201B">G06N20/00</further-classification>
        <further-classification edition="201001120251201B">G01S5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰商泰達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩德林　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDERLIN, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒澤　里昂安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOESER, LEON ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種無線電力系統，包括第一單元及控制單元。第一單元包括板及無線通訊單元。板用以向或自第二單元無線發送或接收電力，無線通訊單元用以從第二單元接收通訊訊號。控制單元包括輸入單元，用以從無線通訊單元接收通訊訊號；檢測單元，用以檢測通訊訊號的至少一訊號強度值及/或至少一相位值；至少一經訓練的機器學習模型，程式化以至少基於作為輸入參數之檢測到的訊號強度值及/或相位值來確定第一單元及第二單元間的相對位置；及輸出單元，用以輸出相對位置。本發明還涉及一種電力傳輸系統及一種訓練機器學習模型的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns a wireless power system, comprising: a first unit including a pad and a wireless communication unit, wherein the pad is configured to wirelessly transmit or receive power to or from a second unit, and the wireless communication unit is configured to receive a communication signal from the second unit; and a control unit, wherein the control unit comprises: an input unit configured to receive the communication signal from the wireless communication unit; a detection unit configured to detect at least one signal strength value and/or at least one phase value of the communication signal; at least one trained machine learning model programmed to determine a relative position between the first unit and the second unit based at least on the detected signal strength value and/or phase value as input parameters; and an output unit configured to output the relative position. The invention also concerns a power transmission system and a method for training a machine learning model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無線電力系統</p>
        <p type="p">2:控制單元</p>
        <p type="p">10:初級單元(第二單元)</p>
        <p type="p">11:初級板</p>
        <p type="p">12:初級無線通訊單元</p>
        <p type="p">15:氣隙</p>
        <p type="p">20:次級單元(第一單元)</p>
        <p type="p">21:次級板</p>
        <p type="p">22:次級無線通訊單元</p>
        <p type="p">33:第一預定距離</p>
        <p type="p">34:第二預定距離</p>
        <p type="p">35:第三預定距離</p>
        <p type="p">36:第四預定距離</p>
        <p type="p">37:中心點</p>
        <p type="p">100:電力傳輸系統</p>
        <p type="p">X、Y、Z:空間維度、軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2478" publication-number="202617047">
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      <tif file="114141031.zip" no="1">
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        <document-id>
          <doc-number>114141031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔機器人的控制方法和裝置、清潔機器人、儲存媒體及電腦程式產品</chinese-title>
        <english-title>METHOD AND APPARATUS FOR CONTROLLING CLEANING ROBOT, CLEANING ROBOT, STORAGE MEDIUM AND COMPUTER PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">A47L11/40</main-classification>
        <further-classification edition="200601120260105B">B25J1/00</further-classification>
        <further-classification edition="202401120260105B">G05D1/246</further-classification>
        <further-classification edition="202401120260105B">G05D1/648</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種清潔機器人的控制方法和裝置、清潔機器人及儲存媒體，涉及智能清潔技術領域。該方法能夠在清潔機器人的底盤運動配合下，機械臂可以準確和高效地實現判斷疑似牆面是真實牆面，還是柔性障礙物，進而利用標記有柔性障礙物的區域的地圖進行地面清潔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method and device for controlling a cleaning robot, a cleaning robot, and a storage medium, which pertains to the field of intelligent cleaning technology. The method enables a robotic arm to accurately and efficiently determine, in conjunction with the movement of the cleaning robot's chassis, whether a suspected wall is a real wall or a flexible obstacle, thereby utilizing a map marked with areas of a flexible obstacle to perform floor cleaning.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2479" publication-number="202618754">
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      <tif file="114141046.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618754</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子紙顯示器裝置及驅動方法</chinese-title>
        <english-title>ELECTRONIC PAPER DISPLAY DEVICE AND DRVIVING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">G09G3/34</main-classification>
        <further-classification edition="201901120260105B">G02F1/167</further-classification>
        <further-classification edition="201901120260105B">G02F1/1675</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元太科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳紀良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳蔚宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子紙顯示器裝置及其驅動方法。電子紙顯示器裝置包括電子紙顯示面板及閘極陣列驅動器。電子紙顯示面板及閘極陣列驅動器設置在電子紙顯示器基板上，電子紙顯示面板包括N條掃描線。驅動方法包括：控制閘極陣列驅動器以掃描N條掃描線。掃描N條掃描線的步驟包括：在掃描電子紙顯示面板的一個畫面時，對N條掃描線中的第一組掃描線依序地掃描X次；以及，在對第一組掃描線依序地掃描X次之後，對N條掃描線中的第二組掃描線依序地掃描Y次。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic paper display (EPD) device and a driving method thereof are provided. The electronic paper display device comprises an electronic paper display panel and a gate driver on array, the EPD panel and the gate driver on array driver in the EPD device are disposed on an EPD substrate, and the EPD panel includes N scan lines. The driving method includes: controlling the gate driver to scan the N scan lines. The step of scanning the N scan lines includes following steps: during the scanning of one frame of the EPD panel, sequentially scan a first group of scan lines among the N scan lines for X times; and, sequentially scan a second group of scan lines among the N scan lines for Y times after sequentially scan the first group of scan lines for the X times.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S300~S320:電子紙顯示器裝置的驅動方法的各步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2480" publication-number="202618683">
    <tif-files tif-type="multi-tif">
      <tif file="114141056.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理裝置、影像處理方法及影像處理程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">G06T3/047</main-classification>
        <further-classification edition="200601120260102B">G06T1/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商維克圖邏輯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VECTOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠田義一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINODA, YOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種藉由減少對DRAM的存取並且進行每一塊的多並行處理，能夠以高畫質且低延遲進行影像的轉換處理的影像處理裝置、影像處理方法及影像處理程式。  &lt;br/&gt;　　包括：輸入圖像記憶單元，記憶輸入影像作為轉換前幀圖像；塊記憶單元，由記憶體構成，該記憶體記憶自該輸入圖像記憶單元讀取的預定範圍的轉換前幀圖像的像素資料，並且可隨機存取該像素資料；插值單元，藉由預定的插值運算自轉換前的像素資料算出轉換後的像素資料；輸出圖像記憶單元，記憶由轉換後的像素資料所構成的轉換後幀圖像；以及影像輸出單元，輸出轉換後幀圖像作為輸出影像；所述塊記憶單元參照藉由對將轉換後幀圖像分割為預定大小而成的單位塊的各像素進行反投影而算出的轉換前幀圖像中的像素並讀取其圖像資料，所述插值單元參照位於與轉換後的像素對應的轉換前的像素周邊之像素的像素資料而自所述塊記憶單元讀取，並且利用適當的插值運算方法算出轉換後的像素資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2481" publication-number="202619392">
    <tif-files tif-type="multi-tif">
      <tif file="114141060.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊設備通過通道進行通訊的方法及無線通訊設備</chinese-title>
        <english-title>A METHOD FOR PERFORMING COMMUNICATIONS VIA A CHANNEL BY A WIRELESS COMMUNICATION DEVICE AND A WIRELESS COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/04</main-classification>
        <further-classification edition="202301120260102B">H04W72/12</further-classification>
        <further-classification edition="202401120260102B">H04W74/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬家順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, CHIA-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝弘道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUNG-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通訊設備通過通道進行通訊的方法，包括：通過該通道執行包含在突發中的第一子突發的傳輸，其中，該第一子突發至少包括傳輸資料幀和接收塊確認（block acknowledgment，BA）幀的操作；確定該BA幀是否有指示高優先級流量需求，或者是否通過該通道在傳輸該資料幀和接收該BA幀的操作之間接收到指示該高優先級流量需求的中斷請求訊號（interrupt request signal，IRS），以生成確定結果；以及根據該確定結果確定是否在完成該第一子突發的傳輸後通過該通道傳輸高優先級觸發（high-priority trigger，HPT）幀，其中，該HPT幀用於指示該突發的傳輸是可中斷的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for performing communications via a channel by a wireless communication device includes: performing a transmission of a first sub-burst comprised in a burst via the channel, wherein the first sub-burst at least comprises operations of transmitting a data frame and receiving a block acknowledgment (BA) frame; determining whether the BA frame indicates a high-priority traffic requirement, or whether an interrupt request signal (IRS) indicating the high-priority traffic requirement is received via the channel between the operations of transmitting the data frame and receiving the BA frame, in order to generate a determination result; and determining whether to transmit a high-priority trigger (HPT) frame via the channel after the transmission of the first sub-burst is completed according to the determination result, wherein the HPT frame is utilized to indicate that a transmission of the burst is interruptible.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1000,S1002,S1004:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2482" publication-number="202619086">
    <tif-files tif-type="multi-tif">
      <tif file="114141066.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可施配液態金屬熱介面材料的蓋設計與程序</chinese-title>
        <english-title>LID DESIGN AND PROCESS FOR DISPENSABLE LIQUID METAL THERMAL INTERFACE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251202B">H01L23/367</main-classification>
        <further-classification edition="200601120251202B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳錫奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, SUK-KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任明鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIM, MYUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘地　薩姆亞　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANDHI, SAUMYA K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特　馬修　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HART, MATTHEW R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾智明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟　軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">描述了電子結構及組裝方法，其中具有袋狀側壁的一蓋安裝在一佈線基材上，使得該等袋狀側壁橫向圍繞一電子組件，並提供阻擋該熱介面層流出該等袋狀側壁外側的一障壁，且具體來說是包括液態金屬膜的熱介面層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Electronic structures and methods of assembly are described in which a lid with pocket sidewalls is mounted on a routing substrate such that the pocket sidewalls laterally surround an electronic component and provide a barrier to outflow of the thermal interface layer outside of the pocket sidewalls, and in particular a thermal interface layer including a liquid metal film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:蓋</p>
        <p type="p">102:頂板</p>
        <p type="p">103:凹面</p>
        <p type="p">104:袋狀側壁</p>
        <p type="p">105:接觸面</p>
        <p type="p">116:加強件結構</p>
        <p type="p">118:佈線基材</p>
        <p type="p">120:電子組件</p>
        <p type="p">121:組件</p>
        <p type="p">122:底部填充材料</p>
        <p type="p">123:焊料凸塊</p>
        <p type="p">124:側壁</p>
        <p type="p">128:頂部表面</p>
        <p type="p">130:接合層</p>
        <p type="p">132:頂部表面</p>
        <p type="p">134:聚合物密封材料</p>
        <p type="p">136:混合TIM層</p>
        <p type="p">138:金屬膜</p>
        <p type="p">140:周邊聚合物膜</p>
        <p type="p">150:電子結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2483" publication-number="202619273">
    <tif-files tif-type="multi-tif">
      <tif file="114141091.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>信號週期確定方法、裝置、設備、介質及程式產品</chinese-title>
        <english-title>SIGNAL PERIOD DETERMINATION METHODS, DEVICES, EQUIPMENT, MEDIA AND PROGRAM PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03B19/14</main-classification>
        <further-classification edition="200601120260102B">H03K21/00</further-classification>
        <further-classification edition="202301120260102B">H04N23/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海御微半導體技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI YUWEI SEMICONDUCTOR TECHNOLOGY CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田豐收</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, FENGSHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李新想</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINXIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余毛寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MAONING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聶秋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIE, QIUPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供了一種信號週期確定方法、裝置、設備、介質及程式產品。該方法包括：獲取待測信號、基礎時脈信號、頻增倍數和分相數；根據頻增倍數和分相數對基礎時脈信號進行倍頻和分相處理，得到分相數個的倍頻分相時脈信號；分別藉由基礎時脈信號和各倍頻分相時脈信號對待測信號進行至少兩個週期的採樣，確定各週期對應的計數結果；根據各計數結果確定待測信號的信號週期。由於採樣次數的大幅度增加，提升了針對待測信號的週期測量的精度和準確度，進以提升了依據待測信號進行觸發的工業相機的拍攝穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a method, apparatus, device, medium, and program product for determining the signal period. The method includes: acquiring a signal to be measured, a base clock signal, a frequency multiplication factor, and a number of phases; performing frequency multiplication and phase division processing on the base clock signal according to the frequency multiplication factor and the number of phases to obtain frequency-multiplied and phase-divided clock signals with a number of phases; sampling the signal to be measured using the base clock signal and each frequency-multiplied and phase-divided clock signal for at least two cycles, determining the counting result corresponding to each cycle; and determining the signal period of the signal to be measured based on the counting results. Due to the significant increase in the number of sampling times, the accuracy and precision of period measurement for the signal to be measured are improved, thereby enhancing the shooting stability of industrial cameras triggered by the signal to be measured.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2484" publication-number="202619009">
    <tif-files tif-type="multi-tif">
      <tif file="114141094.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於對準一環形體之系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">H01L21/68</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商菲斯特歐洲股份兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FESTO SE &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一用於將一環形體(2)相對於一需要加工的結構體(4)的結構體加工面(3)對準的系統(1)，包括：一氣動致動裝置(8)具有至少一致動器(7)，環形體(2)與之運動耦接或可運動耦接，及一壓力控制器裝置(15)與氣動致動裝置流體連接，其中壓力控制器裝置(15)對氣動致動裝置(8)進流及/或排流壓縮空氣一質流量，用以控制環形體(2)相對於結構體(4)的結構體加工面(3)的對準。本發明另外係關於一種對準一環形體(2)的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統</p>
        <p type="p">2:環形體</p>
        <p type="p">3:結構體加工面</p>
        <p type="p">4:結構體</p>
        <p type="p">5:結構體底側</p>
        <p type="p">6:加工底支托</p>
        <p type="p">7:致動器</p>
        <p type="p">8:致動裝置</p>
        <p type="p">9:致動構件</p>
        <p type="p">10:致動器殼體</p>
        <p type="p">11:活塞</p>
        <p type="p">12:活塞桿</p>
        <p type="p">13:接觸段</p>
        <p type="p">14:環形體底側</p>
        <p type="p">15:壓力控制器裝置</p>
        <p type="p">16:流體管線</p>
        <p type="p">17:閥模組</p>
        <p type="p">18:操控器</p>
        <p type="p">19:中軸線</p>
        <p type="p">20:感測器</p>
        <p type="p">21:信號導線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2485" publication-number="202618082">
    <tif-files tif-type="multi-tif">
      <tif file="114141103.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚丙烯腈原絲和聚丙烯腈碳纖維及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">D01F6/38</main-classification>
        <further-classification edition="200601120251201B">D01D5/06</further-classification>
        <further-classification edition="200601120251201B">D01D5/14</further-classification>
        <further-classification edition="200601120251201B">D01F9/22</further-classification>
        <further-classification edition="200601120251201B">C08K7/06</further-classification>
        <further-classification edition="200601120251201B">C08L63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, ZHIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王賀團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HETUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屠曉萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, XIAOPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及碳纖維技術領域，具體涉及一種聚丙烯腈原絲及其製備方法以及聚丙烯腈碳纖維及其製備方法。所述聚丙烯腈原絲的表面具有沿著纖維軸向平行排列的縱向溝槽，原絲的平均直徑為10-20 μm，斷裂強度為7-15 cN/dtex，初始模數為120-200 cN/dtex，斷裂伸長率為10-20%，和晶區取向度為75-99%。本發明的聚丙烯腈原絲直徑大、單絲斷裂強度高、初始模數高以及斷裂伸長率高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2486" publication-number="202617638">
    <tif-files tif-type="multi-tif">
      <tif file="114141123.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用化學遮蔽劑來形成薄膜的方法、半導體裝置、製備包括其之半導體裝置的方法</chinese-title>
        <english-title>METHOD OF FORMING THIN FILM USING CHEMICAL MASKING AGENT, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C11/107</main-classification>
        <further-classification edition="200601120260202B">C07C15/02</further-classification>
        <further-classification edition="200601120260202B">C07C15/44</further-classification>
        <further-classification edition="200601120260202B">C07C31/125</further-classification>
        <further-classification edition="200601120260202B">C23C16/04</further-classification>
        <further-classification edition="200601120260202B">C23C16/34</further-classification>
        <further-classification edition="200601120260202B">C23C16/455</further-classification>
        <further-classification edition="200601120260202B">G11C5/06</further-classification>
        <further-classification edition="200601120260202B">H01L21/285</further-classification>
        <further-classification edition="202501120260202B">H10D12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＥＧＴＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGTM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹圭鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KYU HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金才玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓智娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JI YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐德炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, DUCK HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭主煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JU HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韓彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAN BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白善永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAIK, SUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林太煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, TAE HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李洞均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG KYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李尚賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴昭英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SO YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一實施例，一種使用化學遮蔽劑來形成薄膜的方法，其包含：一化學遮蔽劑供應步驟，將一化學遮蔽劑供應至置放有一基體的一腔室中，以在該基體上吸附該化學遮蔽劑；一吹掃該腔室內部之步驟；一金屬前驅物供應步驟，將一金屬前驅物供應至該腔室中以在該基體上吸附該金屬前驅物，該金屬前驅物係包括一六價金屬之一化合物，且該六價金屬包括Mo；一吹掃該腔室內部之步驟；以及一薄膜形成步驟，將一反應材料供應至該腔室中以與該經吸附之金屬前驅物反應並形成一薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment of the present invention, a method of forming a thin film using a chemical masking agent, comprising: a chemical masking agent supply step of supplying a chemical masking agent into a chamber in which a substrate is placed to adsorb the chemical masking agent on the substrate; a step of purging an inside of the chamber; a metal precursor supply step of supplying a metal precursor, which is a compound including a hexavalent metal including Mo, into the chamber to adsorb the metal precursor on the substrate; a step of purging the inside of the chamber; and a thin film forming step of supplying a reaction material into the chamber to react with the adsorbed metal precursor and form a thin film.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2487" publication-number="202619231">
    <tif-files tif-type="multi-tif">
      <tif file="114141183.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線電力系統和電力傳輸系統</chinese-title>
        <english-title>WIRELESS POWER SYSTEM AND POWER TRANSMISSION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251201B">H02J50/90</main-classification>
        <further-classification edition="201601120251201B">H02J50/80</further-classification>
        <further-classification edition="201601120251201B">H02J50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰商泰達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒澤　里昂安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOESER, LEON ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩德林　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDERLIN, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案涉及一種無線電力系統，包括第一單元以及控制單元，第一單元包括被配置為無線發送或接收電力的墊和無線通信單元。其中墊被配置為向第二單元無線發送或從第二單元無線接收電力，無線通信單元被配置為從第二單元接收通信訊號，並且控制單元被配置為檢測通信訊號的至少一個相位值，並基於所檢測到的相位值確定無線通信單元與第二單元的相對位置。此外，本案還涉及一種包括無線電力系統和第二單元的電力傳輸系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns a wireless power system, comprising a first unit including a pad configured to wirelessly transmit or receive power and a wireless communication unit; and a control unit, wherein the pad is configured to wirelessly transmit or receive power to or from a second unit, and the wireless communication unit is configured to receive a communication signal from the second unit, and wherein the control unit is configured detect at least one phase value of the communication signal and to determine, based on the detected phase value, a relative position of the wireless communication unit and the second unit. Furthermore, the invention concerns a power transmission system comprising the wireless power system and the second unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無線電力系統</p>
        <p type="p">10:次級單元</p>
        <p type="p">11:初級墊</p>
        <p type="p">12:初級無線通信單元</p>
        <p type="p">15:氣隙</p>
        <p type="p">20:初級單元</p>
        <p type="p">21:次級墊</p>
        <p type="p">22:次級無線通信單元</p>
        <p type="p">2:控制單元</p>
        <p type="p">33:第一預定距離</p>
        <p type="p">34:第二預定距離</p>
        <p type="p">35:第三預定距離</p>
        <p type="p">36:第四預定距離</p>
        <p type="p">37:中心點</p>
        <p type="p">100:電力傳輸系統</p>
        <p type="p">x、y、z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2488" publication-number="202618619">
    <tif-files tif-type="multi-tif">
      <tif file="114141187.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子資訊系統</chinese-title>
        <english-title>QUANTUM INFORMATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">G06N10/40</main-classification>
        <further-classification edition="202201120260102B">G06N10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商牛津量子電路有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OXFORD QUANTUM CIRCUITS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡拉斯達奇斯　布萊恩麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VLASTAKIS, BRIAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>什泰納斯　鮑里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHTEYNAS, BORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯　詹姆士福克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLS, JAMES FOX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康薩尼　喬萊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONSANI, GIOELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種量子資訊元件，包括：第一元件和第二元件；所述第一元件包括設於兩個超導島之間的第一非線性超導電感器，所述第二元件包括設於兩個超導島之間的三波混頻元件，其中所述超導島中的一個為所述第一和第二元件兩者共用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quantum information element comprising:&lt;br/&gt; a first element and a second element;&lt;br/&gt; the first element comprising a first superconducting non-linear inductor provided between two superconducting islands; and&lt;br/&gt; the second element comprising a three-wave mixing element provided between two superconducting islands, wherein one of the superconducting islands is common to both the first and second elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:第一超導島</p>
        <p type="p">14:第二超導島</p>
        <p type="p">16:第三超導島</p>
        <p type="p">18:第一約瑟夫森結</p>
        <p type="p">20:三波混頻元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2489" publication-number="202617673">
    <tif-files tif-type="multi-tif">
      <tif file="114141192.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物、膜及光學感測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C205/56</main-classification>
        <further-classification edition="200601120260202B">C07C323/62</further-classification>
        <further-classification edition="200601120260202B">C07D209/88</further-classification>
        <further-classification edition="200601120260202B">C08F2/44</further-classification>
        <further-classification edition="200601120260202B">C08F2/50</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/027</further-classification>
        <further-classification edition="200601120260202B">G03F7/031</further-classification>
        <further-classification edition="200601120260202B">G03F7/038</further-classification>
        <further-classification edition="200601120260202B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田哲志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, TETSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野雅臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松村季彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMURA, TOKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八木一成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGI, KAZUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬化性組成物，其含有聚合性化合物、樹脂、光聚合起始劑及溶劑，其中，上述光聚合起始劑包含乙醛酸酯化合物，上述硬化性組成物的固體成分濃度為1～60質量%，將上述硬化性組成物塗布於支撐體上之後進行曝光，接著，在230℃下加熱15分鐘而形成膜時，上述膜在波長400～700nm下的最大透過率為80%以上。本發明亦提供一種使用了前述硬化性組成物之膜及光學感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2490" publication-number="202617936">
    <tif-files tif-type="multi-tif">
      <tif file="114141204.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141204</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶組合物、可切換顯示器和操作方法</chinese-title>
        <english-title>LIQUID CRYSTAL COMPOSITION, SWITCHABLE DISPLAY AND OPERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K19/02</main-classification>
        <further-classification edition="200601120260102B">C09K19/08</further-classification>
        <further-classification edition="200601120260102B">C09K19/12</further-classification>
        <further-classification edition="200601120260102B">C09K19/30</further-classification>
        <further-classification edition="200601120260102B">G02F1/29</further-classification>
        <further-classification edition="200601120260102B">G02F1/1335</further-classification>
        <further-classification edition="202001120260102B">G02B30/28</further-classification>
        <further-classification edition="201801120260102B">H04N13/00</further-classification>
        <further-classification edition="201801120260102B">H04N13/10</further-classification>
        <further-classification edition="201801120260102B">H04N13/305</further-classification>
        <further-classification edition="201801120260102B">H04N13/359</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷亞有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商鐳亞電子（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA ELECTRONICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>215500中國江蘇省蘇州市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱軍平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JUNPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種液晶組合物、可切換顯示器及其操作方法。根據本發明實施例的一種液晶組合物可用於二維（2D）/多視圖可切換顯示器，所述液晶組合物包括：所述液晶組合物在斷電狀態下具備第一折射率，所述第一折射率範圍在1.50+/-0.15；並且所述液晶組合物在通電狀態下具備第二折射率，所述第二折射率範圍在1.60+/-0.15。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a liquid crystal composition, a switchable display and an operation method thereof. The liquid crystal composition according to an embodiment of the present disclosure can be used in a two-dimensional (2D)/multi-view switchable display, the liquid crystal composition comprising: the liquid crystal composition has a first refractive index in a power-off state, the first refractive index is in a range of 1.50 +/-0.15; and the liquid crystal composition has a second refractive index in a power-on state, the second refractive index is in a range of 1.60 +/− 0.15.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">510:步驟</p>
        <p type="p">520:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2491" publication-number="202619198">
    <tif-files tif-type="multi-tif">
      <tif file="114141233.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01R13/648</main-classification>
        <further-classification edition="201101120260126B">H01R13/6581</further-classification>
        <further-classification edition="200601120260126B">H01R13/40</further-classification>
        <further-classification edition="200601120260126B">H01R13/514</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾晨輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瓊南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QIONGNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括導電殼體、第一端子模組以及第一絕緣固定塊。前述導電殼體設有收容插槽。前述導電殼體包括第一導電殼體，前述第一導電殼體設有第一填充槽。前述第一端子模組設有第一導電端子，前述第一導電端子不與前述第一導電殼體相接觸。前述第一絕緣固定塊固定在前述第一填充槽中，前述第一絕緣固定塊靠近前述收容插槽的前端。本發明實施方式採用導電殼體替換相關技術中的絕緣本體，從而改善了屏蔽效果。另，藉由設置前述第一絕緣固定塊且將前述第一絕緣固定塊固定在前述第一填充槽中，有利提高前述電連接器的結構可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a conductive housing, a first terminal module, and a first insulating fixing block. The conductive housing defines a receiving slot. The conductive housing includes a first conductive housing having a first filling slot. The first terminal module is provided with a first conductive terminal which does not contact the first conductive housing. The first insulating fixing block is fixed in the first filling slot, with its front end disposed close to the receiving slot. The present disclosure replaces an insulating body in related technologies with the conductive housing, thereby improving the shielding effect. Besides, by arranging the first insulating fixing block and fixing it in the first filling slot, the structural reliability of the electrical connector is enhanced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一導電殼體</p>
        <p type="p">11a:第一焊接槽</p>
        <p type="p">111:第一基部</p>
        <p type="p">1111:第一上表面</p>
        <p type="p">1113:減重槽</p>
        <p type="p">1114:第一定位穿孔</p>
        <p type="p">112:第一凸出部</p>
        <p type="p">1120:第一前端面</p>
        <p type="p">1121:第二上表面</p>
        <p type="p">1123:第一填充槽</p>
        <p type="p">11231:第一燕尾槽</p>
        <p type="p">1124:第一定位柱</p>
        <p type="p">21:第一絕緣固定塊</p>
        <p type="p">210:第一前表面</p>
        <p type="p">213:第一燕尾凸塊</p>
        <p type="p">31:第一導電端子</p>
        <p type="p">31a:第一端子模組</p>
        <p type="p">310:第一接觸臂</p>
        <p type="p">3101:第一接觸部</p>
        <p type="p">311:第一固定部</p>
        <p type="p">312:第二固定部</p>
        <p type="p">313:第一安裝腳</p>
        <p type="p">33:第一固持塊</p>
        <p type="p">331:第一固定塊</p>
        <p type="p">332:第二固定塊</p>
        <p type="p">333:第三固定塊</p>
        <p type="p">334:第四固定塊</p>
        <p type="p">41:第一接地片</p>
        <p type="p">411:第一安裝板</p>
        <p type="p">4111:第一安裝定位孔</p>
        <p type="p">412:第二安裝板</p>
        <p type="p">413:第一連接板</p>
        <p type="p">414:第一延伸板</p>
        <p type="p">4141:第一安裝孔</p>
        <p type="p">415:第一接地彈臂</p>
        <p type="p">A1-A1:第一方向</p>
        <p type="p">A2-A2:第二方向</p>
        <p type="p">A3-A3:第三方向</p>
        <p type="p">F:圖22中畫框部分</p>
        <p type="p">S2:第二訊號端子</p>
        <p type="p">S3:第三訊號端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2492" publication-number="202617065">
    <tif-files tif-type="multi-tif">
      <tif file="114141255.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
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          <doc-number>202617065</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>血壓量測方法與系統</chinese-title>
        <english-title>BLOOD PRESSURE MEASUREMENT METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251113B">A61B5/022</main-classification>
        <further-classification edition="200601120251113B">A61B5/0225</further-classification>
        <further-classification edition="200601120251113B">G01L1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商心環科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDIO RING TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭瀚德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, HAN-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施文彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之血壓量測方法包含：接收設置於皮膚表面的力感測器所提供的複數個力學訊號；根據所述複數個力學訊號量測主收縮脈衝、第一反射脈衝及第二反射脈衝；計算所述主收縮脈衝與所述第一反射脈衝之間的第一延遲時間；計算所述第一反射脈衝與所述第二反射脈衝之間的第二延遲時間；計算所述第一延遲時間與所述第二延遲時間的線性組合數值，其中所述第一延遲時間的第一預定係數小於所述第二延遲時間的第二預定係數；以及根據所述線性組合數值的計算結果計算血壓數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The blood pressure measurement method of the present invention includes: receiving a plurality of mechanical signals provided by a force sensor disposed on the surface of the skin; measuring, based on the plurality of mechanical signals, a primary systolic pulse, a first reflection pulse, and an second reflection pulse; calculating a first delay time between the primary systolic pulse and the first reflection pulse; calculating a second delay time between the first reflection pulse and the second reflection pulse; calculating a linear combination value of the first delay time and the second delay time, wherein a first predetermined coefficient of the first delay time is smaller than a second predetermined coefficient of the second delay time; and calculating a blood pressure value according to a calculation result of the linear combination value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:血壓量測方法</p>
        <p type="p">S1,S2,S3,S4,S5,S6:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2493" publication-number="202618302">
    <tif-files tif-type="multi-tif">
      <tif file="114141271.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彈簧接觸件</chinese-title>
        <english-title>SPRING CONTACT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251113B">G01R1/067</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商惠康有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HICON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHEE, SEUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種彈簧接觸件，其藉由不同形狀的接觸針隔著彈簧交叉結合而向按壓方向具有彈力，其包括當隔著彈簧交叉結合而向按壓方向進行壓縮時，藉由所述彈簧提供彈力的第一接觸針和第二接觸針，其中，所述第一接觸針和所述第二接觸針包括：本體部，形成規定的寬度和厚度；頭部，包括形成於所述本體部的一端，與半導體設備的端子或測試裝置的焊盤中的一種相接觸的接觸端；以及一對腿部，從所述本體部的另一端沿著所述本體部的長度方向向與所述頭部相互面對的方向延伸，分別設置於隔著規定的間隔相互面對的位置，在端部形成有與半導體設備的端子或測試裝置的焊盤中的一種相接觸的接觸端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:彈簧接觸件</p>
        <p type="p">11:第一接觸針(接觸針)</p>
        <p type="p">111:頭部</p>
        <p type="p">1110:第一頭部接觸端(頭部接觸端)</p>
        <p type="p">112:頸部</p>
        <p type="p">113:本體部</p>
        <p type="p">1130:引導部</p>
        <p type="p">115:肩部</p>
        <p type="p">13:第二接觸針(接觸針)</p>
        <p type="p">131:頭部</p>
        <p type="p">1310:第二頭部接觸端(頭部接觸端)</p>
        <p type="p">133:本體部</p>
        <p type="p">1330:引導部</p>
        <p type="p">135:肩部</p>
        <p type="p">15:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2494" publication-number="202619197">
    <tif-files tif-type="multi-tif">
      <tif file="114141300.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251209B">H01R13/6471</main-classification>
        <further-classification edition="200601120251209B">H01R13/648</further-classification>
        <further-classification edition="200601120251209B">H01R13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許碩修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHUO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種電連接器，包括絕緣本體、接地板、複數訊號端子、複數上接地端子及複數下接地端子；所述絕緣本體具有上表面及下表面，所述接地板固定在所述絕緣本體內；所述絕緣本體具有複數向上貫穿所述上表面的上端子槽和複數向下貫穿所述下表面的下端子槽，所述上接地端子自所述上表面安裝至所述上端子槽內並與所述接地板搭接，所述下接地端子自所述下表面安裝至所述下端子槽內並與所述接地板搭接。與先前技術相比，本發明的接地板可將原本低諧振頻率分解為兩疊加在一起的高諧振頻率，但保持連接器整體高度不變，提高連接器電氣性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes an insulating housing, a ground plane, plural signal terminals, plural upper ground terminals, and plural lower ground terminals. The insulating housing has an upper face and a lower face. The ground plane is insert-molded in the insulating housing. The insulating housing has plural upper passages opening upwards through the upper face and plural lower passages opening downwards through the lower face. The upper terminals are inserted into the upper passages from the upper face and connected with the ground plane, and the lower ground terminals are inserted into the lower passages from the lower face and connected with the ground plane. Compared with prior arts, the ground plane acts as an additional node in terms of ground resonance, and breaks an original low resonance frequency into two high resonance frequencies, the two high resonance frequency are stacked up but keep a same overall height of the connector, thereby improving the electronic performance of the connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:上表面</p>
        <p type="p">112:下表面</p>
        <p type="p">12:上端子槽</p>
        <p type="p">13:下端子槽</p>
        <p type="p">20:訊號端子</p>
        <p type="p">30:上接地端子</p>
        <p type="p">40:下接地端子</p>
        <p type="p">50:接地板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2495" publication-number="202619053">
    <tif-files tif-type="multi-tif">
      <tif file="114141305.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板及其製造方法</chinese-title>
        <english-title>SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">H01L23/15</main-classification>
        <further-classification edition="200601120251204B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　性振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鎭哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實例的基板包括具有上部面的玻璃芯。作為玻璃芯的上部面的最大高度粗糙度的Rmax值為3nm至7nm。玻璃芯的上部面的表面能為50mN/m至63mN/m。在這種情況下，可在玻璃芯上實現具有得到提高的耐剝離性的絕緣層，並可以進一步提高基板的電氣可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate according to the present disclosure comprises a glass core having an upper surface. A maximum height roughness (Rmax) value of the upper surface of the glass core is 3 nm to 7 nm. A surface energy of the upper surface of the glass core is 50 mN/m to 63 mN/m. In such a case, an insulating layer having improved peel resistance may be implemented on the glass core, and electrical reliability of the substrate may be further improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">10:玻璃芯</p>
        <p type="p">11:玻璃芯的上部面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2496" publication-number="202619049">
    <tif-files tif-type="multi-tif">
      <tif file="114141306.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141306</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基板及包括其的半導體封裝件</chinese-title>
        <english-title>PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251120B">H01L23/14</main-classification>
        <further-classification edition="200601120251120B">H01L23/29</further-classification>
        <further-classification edition="201401120251120B">G01N21/3554</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　性振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鎭哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實例的封裝基板包括芯層及配置於所述芯層上的絕緣層。所述絕緣層包含絕緣樹脂。所述絕緣層包括第一絕緣層及配置於所述第一絕緣層上的第二絕緣層。所述第二絕緣層的利用傅立葉轉換紅外光譜（FT-IR）來測定的羥基峰強度小於所述第一絕緣層的利用傅立葉轉換紅外光譜（FT-IR）來測定的羥基峰強度。在23℃及50RH%的氣氛中靜置7日後測定的封裝基板的吸水量為500ppm至1200ppm。在這種情況下，可以提供穩定維持長期耐久性及電氣可靠性的封裝基板等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A packaging substrate according to the present disclosure comprises a core layer and an insulating layer disposed on the core layer. The insulating layer comprises an insulating resin. The insulating layer comprises a first insulating layer and a second insulating layer disposed on the first insulating layer. A hydroxyl peak intensity of the second insulating layer measured by FT-IR is smaller than a hydroxyl peak intensity of the first insulating layer measured by FT-IR. A moisture absorption amount of the packaging substrate measured after being left to stand for 7 days under an atmosphere of 23 °C and 50 % RH is 500 ppm to 1200 ppm. In such a case, a packaging substrate and the like capable of stably maintaining long-term durability and electrical reliability may be provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝基板</p>
        <p type="p">10:芯層</p>
        <p type="p">20:絕緣層</p>
        <p type="p">21:第一絕緣層</p>
        <p type="p">22:第二絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2497" publication-number="202619054">
    <tif-files tif-type="multi-tif">
      <tif file="114141310.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基板</chinese-title>
        <english-title>PACKAGING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">H01L23/15</main-classification>
        <further-classification edition="200601120251124B">H01L21/48</further-classification>
        <further-classification edition="202101120251124B">G01N27/623</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　性振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鎭哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實例涉及封裝基板，封裝基板（100）包括：玻璃晶片（20）；多個過孔（25），配置於所述玻璃晶片（20）；銅電極（40），配置於所述過孔（25）或所述玻璃晶片（20）的表面；以及絕緣層（30），包繞所述過孔（25）或所述銅電極（40）。所述封裝基板（100）在洗脫雜質中包含P及Zn，所述洗脫雜質的含量為通過如下方法進行分析的分析值，即在所述封裝基板（100）中添加70摩爾%的硝酸，並在石墨塊中於200攝氏度溫度下進行16小時的預處理以準備分析溶液，並根據KS M 0025：2008測試法，利用ICP-MS設備（珀金埃爾默公司製造的Nexlon2000型號產品）來對所述分析溶液進行分析，所述P的含量（以質量為基準）為1500ppb以下，所述Zn的含量（以質量為基準）為500ppb以下。實例的封裝基板因洗脫雜質的含量低或這些雜質中的特定雜質的含量比率在規定範圍以內，因此，可以提供封裝基板的熱穩定性、電穩定性、導電性等得到改善的封裝基板等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiment relates to a packaging substrate comprising: a glass wafer 20; a plurality of vias 25 disposed in the glass wafer 20; copper electrodes 40 disposed on the vias 25 or on the surface of the glass wafer 20; and an insulating layer 30 surrounding the vias 25 or the copper electrodes 40. The packaging substrate 100 comprises P and Zn as eluted impurities, and the content of the eluted impurities is based on an analysis value obtained by preparing an analytical solution through pretreatment at 200°C for 16 hours in a graphite block after adding 70 mol% nitric acid to the packaging substrate 100, and analyzing the solution using an ICP-MS device (Nexlon2000 model manufactured by PerkinElmer) in accordance with KS M 0025:2008 test method. The content of P (by weight) is 1,500 ppb or less, and the content of Zn (by weight) is 500 ppb or less. The packaging substrate according to the embodiment comprises a low content of eluted impurities or maintains the ratio of specific impurities within a predetermined range, thereby providing a packaging substrate with improved thermal stability, electrical stability, and electrical conductivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:玻璃晶片</p>
        <p type="p">25:過孔</p>
        <p type="p">30:絕緣層</p>
        <p type="p">40:銅電極</p>
        <p type="p">60:覆蓋層</p>
        <p type="p">100:封裝基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2498" publication-number="202617999">
    <tif-files tif-type="multi-tif">
      <tif file="114141314.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去氧核糖核酸、表現載體、轉形體、抗壞血酸氧化酶、以及蛋白質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12N15/53</main-classification>
        <further-classification edition="200601120260102B">C12N1/19</further-classification>
        <further-classification edition="200601120260102B">C12N9/04</further-classification>
        <further-classification edition="200601120260102B">C12N15/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>獨立行政法人酒類總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL RESEARCH INSTITUTE OF BREWING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平彩乃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIRA, AYANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正木和夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASAKI, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家藤治幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IEFUJI, HARUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種抗壞血酸氧化酶之有效率的重組生產方法。本發明藉由一種DNA來解決該課題，該DNA係具有與序列編號1所示之鹼基序列有著90%以上之同一性的鹼基序列，並且編碼具有抗壞血酸氧化酶活性之蛋白質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2499" publication-number="202617466">
    <tif-files tif-type="multi-tif">
      <tif file="114141333.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扣具</chinese-title>
        <english-title>BUCKLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B60N2/08</main-classification>
        <further-classification edition="200601120251201B">B60N2/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮軍靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, JUNJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡軍杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JUNJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖克鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, KEFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種扣具。該扣具包括彼此對插配合的公扣和母扣，所述公扣具有被卡合部，所述母扣上能活動地設置有釋鎖件，所述釋鎖件上形成有卡合部。所述釋鎖件沿第一方向的運動引起所述卡合部與所述被卡合部沿所述第一方向鎖定或釋鎖。本申請提供的扣具結構簡單、操作便利、操作手感好且不易誤操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a buckle. The buckle comprises a male buckle and a female buckle mated with each other. The male buckle has an engaged portion, and the female buckle is movably provided with an unlocking member formed with an engaging portion. Movement of the release member in a first direction causes the engaging portion to lock or unlock with the engaged portion in the first direction. The buckle provided in the present application has a simple structure, is easy to operate, has a good operation feeling, and is not easy to operate incorrectly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扣具</p>
        <p type="p">10:母扣</p>
        <p type="p">111:胯帶固定孔</p>
        <p type="p">20:公扣</p>
        <p type="p">210:肩帶固定孔</p>
        <p type="p">220:肩帶固定部</p>
        <p type="p">230:腰帶固定孔</p>
        <p type="p">40:釋鎖件、按鈕</p>
        <p type="p">X:第二方向</p>
        <p type="p">Y:第一方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2500" publication-number="202618989">
    <tif-files tif-type="multi-tif">
      <tif file="114141341.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141341</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251212B">H01L21/67</main-classification>
        <further-classification edition="200601120251212B">G01L1/00</further-classification>
        <further-classification edition="201901120251212B">G01M13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島章宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福本将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明藉由使用壓力感測器對複數個壓力檢測點之檢測結果，精度良好地檢測軸之進退移動之異常。處理單元具備：噴嘴本體，其用於對基板進行規定表面處理；軸，其藉由馬達之驅動而於規定方向進退移動；壓力感測器，其於複數個壓力檢測點中，取得於馬達與噴嘴本體之間產生之壓力值；及異常檢測部，其基於複數個壓力檢測點所包含之至少2個壓力檢測點中之壓力值，檢測軸之進退移動之異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:噴嘴塊</p>
        <p type="p">51,51A:處理液噴出噴嘴部</p>
        <p type="p">52:噴嘴本體</p>
        <p type="p">52a:噴嘴頭部</p>
        <p type="p">52b:軸形狀部</p>
        <p type="p">53:噴嘴驅動部</p>
        <p type="p">54:支持基座</p>
        <p type="p">55:壓力感測器</p>
        <p type="p">55F:平面</p>
        <p type="p">521:噴出口</p>
        <p type="p">522:歧管部</p>
        <p type="p">523:軸孔</p>
        <p type="p">524:螺母</p>
        <p type="p">531:馬達</p>
        <p type="p">531A:旋轉軸部</p>
        <p type="p">531E:端部</p>
        <p type="p">532:軸</p>
        <p type="p">533:軸承</p>
        <p type="p">533A:套筒型軸承</p>
        <p type="p">533F:內周面</p>
        <p type="p">534:殼體</p>
        <p type="p">534a:槽</p>
        <p type="p">535:馬達固持器</p>
        <p type="p">536:密封環</p>
        <p type="p">537:按壓構件</p>
        <p type="p">542:耳部</p>
        <p type="p">543:螺釘</p>
        <p type="p">572:凸緣部位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2501" publication-number="202617470">
    <tif-files tif-type="multi-tif">
      <tif file="114141384.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>承載基座及嬰幼兒載具</chinese-title>
        <english-title>CARRYING BASE AND INFANT CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251109B">B60N2/26</main-classification>
        <further-classification edition="200601120251109B">F16H55/26</further-classification>
        <further-classification edition="200601120251109B">B60N2/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方淦清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, GANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種承載基座及嬰幼兒載具。該承載基座包括底座、轉盤和旋轉滑移機構。底座用於固定於汽車座椅。轉盤用於安裝乘坐艙，且活動設於底座。旋轉滑移機構設置於轉盤和底座之間。旋轉滑移機構包括傳動齒輪和齒條。傳動齒輪固定於轉盤。齒條固定於底座。其中，轉盤通過齒條與傳動齒輪的嚙合可相對底座旋轉及滑動。當底座安裝於汽車座椅，轉盤上安裝有乘坐艙時，可以使得轉盤相對底座旋轉滑動至靠近任一側車門的位置，如此可以方便將嬰幼兒抱出或放置於乘坐艙，大大提高嬰幼兒載具的使用體驗及滿意度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a carrying base and an infant carrier. The carrying base includes a base, a rotating device and a rotating and sliding mechanism. The base is configured to be fixed to a car seat. The rotating device is configured to mount a riding cabin and is movably disposed on the base. The rotating and sliding mechanism is arranged between the rotating device and the base. The rotating and sliding mechanism includes a transmission gear and a rack. The transmission gear is fixed to the rotating device. The rack is fixed to the base. The rotating device of the aforementioned carrying base is capable of rotating and sliding relative to the base via the engagement between the transmission gear and the rack of the rotating and sliding mechanism. When the base is mounted on the car seat and the riding cabin is mounted on the rotating device, the rotating device is capable of rotating and sliding relative to the base to a position close to a car door on either side, such that the infant can be conveniently taken out from or placed in the riding cabin, greatly improving the usage experience and satisfaction of the infant carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:嬰幼兒載具</p>
        <p type="p">100:承載基座</p>
        <p type="p">110:底座</p>
        <p type="p">120:轉盤</p>
        <p type="p">200:乘坐艙</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2502" publication-number="202618356">
    <tif-files tif-type="multi-tif">
      <tif file="114141390.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141390</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>板載光耦合裝置</chinese-title>
        <english-title>ON-BOARD OPTICAL COUPLING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251119B">G02B6/12</main-classification>
        <further-classification edition="200601120251119B">G02B6/126</further-classification>
        <further-classification edition="200601120251119B">G02B6/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星系科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種板載光耦合裝置，連接於兩個資料處理設備之間。板載光耦合裝置包括具有多個對準通道單元及多個波導通道的光波導。第一光子裝置包括多個第一返回通道及第一光通道。第二光子裝置包括多個第二返回通道及第二光通道。在一次性對準過程中，多個第一光通道及多個第二光通道與各自對應的波導通道光學對準，且同時第一返回通道、及第二返回通道與對準通道單元光學對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An on-board optical coupling apparatus, used between two data processing devices, includes an optical waveguide including a plurality of alignment path units and waveguide paths. A first photonic device includes a plurality of first return paths and first optical channels. A second photonic device includes a plurality of second return paths and second optical channels. The first optical channels and the second optical channels are optically aligned with respective waveguide paths simultaneously with optical alignment of the first return paths and the second return paths with the alignment path units in a one-time alignment process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:板載光耦合裝置</p>
        <p type="p">10:光波導</p>
        <p type="p">101:光輸入區域</p>
        <p type="p">102:光輸出區域</p>
        <p type="p">11:波導基板</p>
        <p type="p">111:第一側</p>
        <p type="p">112:第二側</p>
        <p type="p">113:第三側</p>
        <p type="p">114:第四側</p>
        <p type="p">12:波導通道</p>
        <p type="p">15:對準通道單元</p>
        <p type="p">151:第一對準通道</p>
        <p type="p">1511:光輸入端</p>
        <p type="p">1512:光輸出端</p>
        <p type="p">152:第二對準通道</p>
        <p type="p">1521:光輸入端</p>
        <p type="p">1522:光輸出端</p>
        <p type="p">153:第一返回通道</p>
        <p type="p">1531:彎曲段</p>
        <p type="p">154:第二返回通道</p>
        <p type="p">1541:彎曲段</p>
        <p type="p">20:第一光子裝置</p>
        <p type="p">21:第一耦合部</p>
        <p type="p">22:第一光通道</p>
        <p type="p">30:第二光子裝置</p>
        <p type="p">31:第二耦合部</p>
        <p type="p">32:第二光通道</p>
        <p type="p">40:支撐單元</p>
        <p type="p">41:主載板</p>
        <p type="p">42:第一載板</p>
        <p type="p">43:第二載板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2503" publication-number="202618496">
    <tif-files tif-type="multi-tif">
      <tif file="114141407.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141407</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔機器人及其控制方法及裝置</chinese-title>
        <english-title>CLEANING ROBOT AND CONTROLLING METHOD AND DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251128B">G05D1/648</main-classification>
        <further-classification edition="200601120251128B">A47L11/40</further-classification>
        <further-classification edition="200601120251128B">A47L11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蘭蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LANLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種清潔機器人的控制方法及裝置，以及清潔機器人；其中，在該方法中，在控制清潔機器人沿預定義的第一路徑進行沿邊清潔的過程中，對於清潔機器人無法進入的鏤空區域，通過改變第一清潔部件的清潔路徑，即控制第一清潔部件向該鏤空區域轉動，從而實現對鏤空區域的清潔，進而提升清潔機器人的清潔覆蓋率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a controlling method and a device for a cleaning robot, and a cleaning robot. In the method, during a process of controlling the cleaning robot to perform edge-following cleaning along a predefined first path, for a hollowed-out area that the cleaning robot cannot enter, a cleaning path of a first cleaning component is changed, specifically, the first cleaning component is controlled to rotate toward the hollowed-out area, so as to enable the cleaning of the hollowed-out area, thereby improving cleaning coverage rate of the cleaning robot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">501:步驟</p>
        <p type="p">502:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2504" publication-number="202618403">
    <tif-files tif-type="multi-tif">
      <tif file="114141441.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴裝置及其操作方法</chinese-title>
        <english-title>HEAD-MOUNTED DEVICE AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02B27/01</main-classification>
        <further-classification edition="201301120260102B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許維志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張劭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種頭戴裝置及其操作方法。頭戴裝置包括取像模組、雷射導引模組、麥克風模組以及處理模組。麥克風模組用以取得第一語音命令。處理模組透過人工智慧模型分析所述第語音命令，以取得第一指示框指令，並根據第一指示框指令驅動雷射導引模組投射第一指示框。處理模組透過取像模組取得第一畫面，並透過人工智慧模型分析第一畫面，以取得第二指示框指令。處理模組根據第一指示框指令驅動雷射導引模組投射第二指示框。第二指示框的指示框範圍小於第一指示框的指示框範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head-mounted device and an operation method thereof are provided. The head-mounted device includes a camera module, a laser guidance module, a microphone module, and a processing module. The microphone module is configured to receive a first voice command. The processing module analyzes the first voice command using an artificial intelligence model to obtain a first indicator frame instruction, and drives the laser guidance module to project a first indicator frame based on the first indicator frame instruction. The processing module captures a first image through the camera module and analyzes the first image using the artificial intelligence model to obtain a second indicator frame instruction. Based on the first indicator frame instruction, the processing module drives the laser guidance module to project a second indicator frame. An indicator frame area of the second indicator frame is smaller than an indicator frame area of the first indicator frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頭戴裝置</p>
        <p type="p">110:處理模組</p>
        <p type="p">120:取像模組</p>
        <p type="p">130:麥克風模組</p>
        <p type="p">140:雷射導引模組</p>
        <p type="p">150:儲存模組</p>
        <p type="p">160:喇叭模組</p>
        <p type="p">170:無線通訊模組</p>
        <p type="p">180:電池模組</p>
        <p type="p">200:雲端伺服器</p>
        <p type="p">210:人工智慧模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2505" publication-number="202617801">
    <tif-files tif-type="multi-tif">
      <tif file="114141494.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耐化學性優異的浸漬成型用乳膠組合物及由其製備的浸漬成型品</chinese-title>
        <english-title>COMPOSITION OF LATEX FOR DIP MOLDING WITH EXCELLENT CHEMICAL RESISTANCE AND DIP MOLDED ARTICLE PREPARED THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/06</main-classification>
        <further-classification edition="200601120260102B">C08F220/44</further-classification>
        <further-classification edition="200601120260102B">C08F236/06</further-classification>
        <further-classification edition="200601120260102B">C08F236/08</further-classification>
        <further-classification edition="200601120260102B">C08L47/00</further-classification>
        <further-classification edition="200601120260102B">C08J5/02</further-classification>
        <further-classification edition="200601120260102B">B29C41/00</further-classification>
        <further-classification edition="200601120260102B">B29C41/14</further-classification>
        <further-classification edition="200601120260102B">A41D19/00</further-classification>
        <further-classification edition="200601120260102B">A41D19/015</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商錦湖石油化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOREA KUMHO PETROCHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田鍾振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭成勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOUNG, SUNG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種耐化學性優異的浸漬成型用乳膠組合物及由其製備的浸漬成型品，根據本發明的實施例的浸漬成型用乳膠組合物，其包含由乙烯性不飽和腈單體、異戊二烯單體、丁二烯單體以及乙烯性不飽和酸單體聚合的共聚物乳膠，以100重量份的所述異戊二烯單體及所述丁二烯單體的總和爲基準，所述丁二烯單體的含量爲5~20重量份，所述共聚物乳膠的凝膠含量爲40~90%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">（無）</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2506" publication-number="202618294">
    <tif-files tif-type="multi-tif">
      <tif file="114141535.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針與電子連接裝置</chinese-title>
        <english-title>A PROBE AND A ELECTRONIC CONNECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">G01R1/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新特系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYNC-TECH SYSTEM CORP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李逸隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝翔昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIANG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種探針，其包含：第一接觸端、彈性變形部、擋止部以及第二接觸端。彈性變形部連接第一接觸端，具有第一斷面以及第二斷面，擋止部連接彈性變形部，第二接觸端連接擋止部，其中第一斷面的面積與第二斷面的面積不同，或第一斷面的形狀與第二斷面的形狀不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a probe, comprising: a first contact end, an elastic deformation section, a stopper and a second contact end. The elastic deformation section is coupled to the first contact end and has a first cross-section and a second cross-section, the stopper is coupled to the elastic deformation section, the second contact end is coupled to the stopper, wherein an area of the first cross-section is difference from an area of the second cross-section, or a shape of the first cross-section is difference from a shape of the second cross-section.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針</p>
        <p type="p">10:第一接觸端</p>
        <p type="p">20:彈性變形部</p>
        <p type="p">22:第一變形部</p>
        <p type="p">24:第二變形部</p>
        <p type="p">30:擋止部</p>
        <p type="p">40:第二接觸端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2507" publication-number="202618491">
    <tif-files tif-type="multi-tif">
      <tif file="114141581.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔機器人的控制方法和裝置、清潔機器人及儲存介質</chinese-title>
        <english-title>CONTROL METHOD AND DEVICE FOR CLEANING ROBOT, CLEANING ROBOT, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251201B">G05D1/43</main-classification>
        <further-classification edition="202401120251201B">G05D1/646</further-classification>
        <further-classification edition="202401120251201B">G05D1/648</further-classification>
        <further-classification edition="202401120251201B">G05D1/628</further-classification>
        <further-classification edition="202401120251201B">G05D1/644</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅龍躍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, LONGYUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔機器人的控制方法和裝置、清潔機器人及儲存介質，涉及智慧清潔技術領域。該方法檢測清潔機器人當前所在區域；若檢測到清潔機器人當前所在區域是預先標記區域，則控制清潔機器人的懸崖感測器按照預先標記區域對應的目標觸發閾值進行工作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a control method and device for cleaning robots, a cleaning robot, and a storage medium, related to the field of intelligent cleaning technology. The method detects the current area of the cleaning robot; if the current area of the cleaning robot is detected as a pre-marked area, the cleaning robot's cliff sensor is controlled to operate according to the target trigger threshold corresponding to the pre-marked area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2508" publication-number="202617447">
    <tif-files tif-type="multi-tif">
      <tif file="114141651.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有圖形的可撓性片材</chinese-title>
        <english-title>FLEXIBLE SHEET WITH GRAPHIC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B41M5/382</main-classification>
        <further-classification edition="200601120260202B">B41M5/40</further-classification>
        <further-classification edition="200601120260202B">B44C1/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勤倫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANCE LINE INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚明賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, MING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有圖形的可撓性片材，包含有：一可撓性的片狀材料與一圖形，該圖形為經切割出形狀的多層結構，包括：一第一黏著層； 一列印層，列印有圖案，該列印層與該第一黏著層結合；一覆膜，包括一透明或半透明的表面膜層及一第二黏著層，該表面膜層以該第二黏著層與該列印層結合，並覆蓋該列印的圖案；該圖形以該第一黏著層黏著於該片狀材料上，該圖形及其圖案可保持完整以及可耐水洗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flexible sheet with graphic, comprising: a flexible sheet material and a graphic, the graphic is a multi-layered structure cut into a shape, comprising: a first adhesive layer; a printing layer printed with a pattern, the printing layer is bonded with the first adhesive layer; and a covering film comprising a transparent or translucent surface film layer and a second adhesive layer, the surface film layer is bonded with the printing layer by the second adhesive layer and covers the printed pattern. The graphic is adhered onto the sheet material with the first adhesive layer, and the graphic and the pattern are capable of remaining intact and withstanding water washing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:印刷層</p>
        <p type="p">14:第一黏著層</p>
        <p type="p">20:覆膜</p>
        <p type="p">22:表面膜層</p>
        <p type="p">24:第二黏著層</p>
        <p type="p">32:圖案</p>
        <p type="p">45:圖形</p>
        <p type="p">55:片狀材料</p>
        <p type="p">80:可撓性片材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2509" publication-number="202617200">
    <tif-files tif-type="multi-tif">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於輸注泵的改進的管線中空氣檢測</chinese-title>
        <english-title>IMPROVED AIR-IN-LINE DETECTION FOR INFUSION PUMPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">A61M5/142</main-classification>
        <further-classification edition="200601120260130B">A61M5/168</further-classification>
        <further-classification edition="200601120260130B">A61M5/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊庫醫學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICU MEDICAL, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆魯格桑　加內桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURUGESAN, GANESAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲茨西蒙斯　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITZSIMMONS, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特羅斯　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DROST, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　杰克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANG, JACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎因　克里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUINN, CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">輸注泵的控制模組被構造成沿控制模組的配合側接收施用套件。控制模組在配合側包括排出器、上游閥、下游閥以及位於下游閥下游的管線中空氣檢測器。施用套件包括具有高容積蠕動管、第一主表面和縱軸的壓力板。壓力板還具有附接特徵件，其被構造成與控制模組的相應附接特徵件配合以使高容積蠕動管與縱軸對齊。當壓力板與控制模組配合時，排出器接合蠕動管的第一部分，並且管線中空氣檢測器接合蠕動管的第二部分。壓力板中的凸起特徵件起到將高容積蠕動管理想地定位在管線中空氣檢測器的檢測區域內的作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:泵系統</p>
        <p type="p">102:控制模組</p>
        <p type="p">104:遠端儲存器適配器(RRA)</p>
        <p type="p">105:顯示幕</p>
        <p type="p">106:控制板</p>
        <p type="p">108:電池門</p>
        <p type="p">109:旋鈕</p>
        <p type="p">112:電源開關</p>
        <p type="p">119:管</p>
        <p type="p">133:閂桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2510" publication-number="202618642">
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      <tif file="114141696.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置、資訊處理方法、及資訊處理程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">G06Q30/02</main-classification>
        <further-classification edition="202301120251201B">G06Q30/0241</further-classification>
        <further-classification edition="202301120251201B">G06N3/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡嘎拉瓦第　巴薩凡那　那維　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGALAVADI BASAVANNA,NAVEEN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉雲青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUN CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於高效率地選出所要廣告之商品。  &lt;br/&gt;本發明之資訊處理裝置：取得包含對於複數個商品各者之廣告頁在規定之期間內之曝光數與點擊數之第1資料；取得包含對於在該規定之期間內被點擊之廣告頁中廣告之商品之購買歷程之第2資料；使用該第1資料與該第2資料，算出表示在該規定之期間內對於該複數個商品各者之CVR(Conversion Rate，轉化率)與CTR(Click Through Rate，點擊通過率)之平衡度高低之商品品質得分；基於該商品品質得分，從該複數個商品中選擇廣告對象之規定數目之商品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">211:檢索網站頻道</p>
        <p type="p">212:電子郵件頻道</p>
        <p type="p">213:地圖網站頻道</p>
        <p type="p">S20,S21,S22:處理</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2511" publication-number="202619349">
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      <tif file="114141734.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141734</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱式子塊變換的視頻編解碼的方法與裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR IMPLICIT SUB-BLOCK TRANSFORM CODING IN VIDEO CODING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/60</main-classification>
        <further-classification edition="201401120260102B">H04N19/50</further-classification>
        <further-classification edition="201401120260102B">H04N19/176</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用子塊轉換（Subblock Transform，簡稱 SBT）模式的視頻編解碼方法和裝置被披露。根據一種方法，當前塊中具有非零殘差的子部分的最終位置是基於與當前塊相關的一個或多個梯度值隱式確定的，其中具有非零殘差的子部分的最終位置與目標 SBT 類型相關聯。根據目標 SBT，對當前塊中具有非零殘差的子部分應用推斷的轉換，以在編碼器端導出轉換後的殘差資料或在解碼器端重建殘差資料。根據另一種方法，當前塊中具有非零殘差的子部分的最終位置是通過將具有非零殘差的子部分的最終位置與去塊效應網格大小對齊來確定的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for video coding using SBT (Subblock Transform) mode are disclosed. According to one method, a final position of a sub-part with non-zero residuals in the current block is determined implicitly based on one or more gradient values associated with the current block, where the final position of the sub-part with the non-zero residuals is associated with a target SBT type. Inferred transforms are applied to the sub-part with the non-zero residuals in the current block according to the target SBT to derive the transformed residual data at the encoder side or reconstructed residual data at the decoder side. According to another method, the final position of a sub-part with non-zero residuals in the current block is determined by aligning the final position of the sub-part with the non-zero residuals with deblocking grid size.</p>
      </isu-abst>
      <representative-img>
        <p type="p">910-930:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2512" publication-number="202617634">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617634</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141759</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵氧體燒結體、鐵氧體磁芯及線圈部件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C04B35/26</main-classification>
        <further-classification edition="200601120260102B">H01F1/34</further-classification>
        <further-classification edition="200601120260102B">H01F27/24</further-classification>
        <further-classification edition="200601120260102B">H01F27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京瓷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOCERA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神戶聰一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBE, SOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豐田諭史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYODA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鐵氧體燒結體，其中，氧化鐵的含量以Fe&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;換算為45.0莫耳%～50.0莫耳%，氧化鋅的含量以ZnO換算為6.0莫耳%～20.0莫耳%，氧化銅的含量以CuO換算為0莫耳%～13.8莫耳%，氧化錳的含量以MnO&lt;sub&gt;2&lt;/sub&gt;換算為0.3莫耳%～6.0莫耳%，餘量含有氧化鎳，將氧化鐵、氧化鋅、氧化銅、氧化錳和氧化鎳的各自含量的合計含量作為100質量份時，氧化鐵、氧化鋅、氧化銅、氧化錳和氧化鎳以外的元素的氧化物換算的含量的總量為2質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鐵氧體磁芯</p>
        <p type="p">1a:繞組部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2513" publication-number="202618494">
    <tif-files tif-type="multi-tif">
      <tif file="114141790.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可移動設備的控制方法、控制裝置、可移動設備、儲存媒體和電腦程式產品</chinese-title>
        <english-title>CONTROL METHOD AND CONTROL APPARATUS FOR MOVABLE DEVICE, MOVABLE DEVICE, STORAGE MEDIUM, AND COMPUTER PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260114B">G05D1/622</main-classification>
        <further-classification edition="202401120260114B">G05D1/435</further-classification>
        <further-classification edition="200601120260114B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種可移動設備的控制方法、控制裝置、可移動設備、儲存媒體和電腦程式產品，關於智慧家居領域。該控制方法包括：在待搬運的目標物體上確定至少兩個夾取點；同步控制至少兩個可移動設備中每個可移動設備的機械臂，對應抓取一個夾取點，並在豎直方向將目標物體抬升；在將目標物體抬升到位後，同步控制每個可移動設備的底盤朝向目標位置移動，以將目標物體搬運至目標位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a control method and a control apparatus for a movable device, a movable device, a storage medium, and a computer program product, and relates to the field of smart home. The method includes: determining at least two gripping points on a target object to be moved; synchronously controlling a mechanical arm of each of at least two movable devices to grasp a corresponding gripping point and lift the target object in a vertical direction; after the target object is lifted into position, synchronously controlling the chassis of each movable device to move toward a target position, so as to transport the target object to the target position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:步驟</p>
        <p type="p">202:步驟</p>
        <p type="p">203:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2514" publication-number="202617282">
    <tif-files tif-type="multi-tif">
      <tif file="114141803.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">B08B3/02</main-classification>
        <further-classification edition="200601120251230B">B08B3/04</further-classification>
        <further-classification edition="200601120251230B">B08B3/12</further-classification>
        <further-classification edition="200601120251230B">H01L21/683</further-classification>
        <further-classification edition="200601120251230B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原遼太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係使於基板的表面所產生的洗淨不均勻降低並確切地洗淨基板的表面。基板處理裝置係用以一邊將基板浸漬於處理液中一邊對基板賦予超音波振動；基板處理裝置係將超音波反射板設置於貯留於處理槽的處理液的液面的附近，超音波反射板係形成有用以將從超音波振動賦予部所賦予的超音波振動朝向基板支撐部的上方位置擴散反射之凹凸形狀的反射面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理槽</p>
        <p type="p">11:開口部</p>
        <p type="p">12:開閉蓋</p>
        <p type="p">15:外槽</p>
        <p type="p">20:升降機(第一升降機構)</p>
        <p type="p">21:背板</p>
        <p type="p">22:基板支撐部</p>
        <p type="p">30:噴嘴</p>
        <p type="p">40:超音波振動賦予部</p>
        <p type="p">41:傳播槽</p>
        <p type="p">42:超音波振動件</p>
        <p type="p">43:振動產生面</p>
        <p type="p">50:超音波反射板</p>
        <p type="p">51:反射面</p>
        <p type="p">100:基板處理裝置</p>
        <p type="p">P1:關閉位置</p>
        <p type="p">P3:浸漬位置</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2515" publication-number="202617254">
    <tif-files tif-type="multi-tif">
      <tif file="114141820.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141820</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>採用固相萃取製程製備放射性藥物的方法及卡匣</chinese-title>
        <english-title>METHOD AND CASSETTE FOR PREPARATION OF RADIOPHARMACEUTICALS USING SOLID PHASE EXTRACTION PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D59/30</main-classification>
        <further-classification edition="200601120260102B">B01D15/22</further-classification>
        <further-classification edition="200601120260102B">B01D15/42</further-classification>
        <further-classification edition="200601120260102B">C07D451/02</further-classification>
        <further-classification edition="200601120260102B">A61K51/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人峨山社會福祉財團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE ASAN FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高娜麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, NARE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種製備放射性藥物的方法，其中純化藉由固相萃取（SPE）執行，以及配置為在自動化的合成模組中執行該方法的卡匣。根據本發明合成&lt;sup&gt;18&lt;/sup&gt;F-標記的放射性藥物的方法使用SPE過程來改善再現性並縮短合成時間，與傳統的高效液相層析（HPLC）過程比較，從而獲得具有高純度和高產率的&lt;sup&gt;18&lt;/sup&gt;F-標記的放射性藥物。此外，由於&lt;sup&gt;18&lt;/sup&gt;F-標記的放射性藥物可以使用配置為在自動化的合成模組中執行根據本發明的合成方法的卡匣便利地合成，預期該方法可以在&lt;sup&gt;18&lt;/sup&gt;F-標記的放射性藥物的生產中有效地使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of preparing a radiopharmaceutical in which purification is performed by solid phase extraction (SPE) and a cassette configured to perform the method in an automated synthesis module. The method of synthesizing an 18F-labeled radiopharmaceutical according to the present invention uses an SPE process to improve reproducibility and shorten the synthesis time compared to a conventional high-performance liquid chromatography (HPLC) process, thereby obtaining an 18F-labeled radiopharmaceutical with high purity and high yield. In addition, since 18F-labeled radiopharmaceuticals can be conveniently synthesized using the cassette configured to perform the synthesis method according to the present invention in an automated synthesis module, it is expected that the method can be effectively used in the production of 18F-labeled radiopharmaceuticals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2516" publication-number="202617301">
    <tif-files tif-type="multi-tif">
      <tif file="114141836.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅合金混合粉末及其評估方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120251128B">B22F1/05</main-classification>
        <further-classification edition="200601120251128B">C22C9/00</further-classification>
        <further-classification edition="200601120251128B">C22F1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福田金屬箔粉工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA METAL FOIL &amp; POWDER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乙部勝則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTOBE, KATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉谷雄史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGITANI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種銅合金混合粉末，用以提供控制Ag添加量、且具有高導電率的銅合金層積造形物，該銅合金混合粉末為在第一銅合金粉末中混合5.0～50.0質量%的第二銅合金粉末，其中，該第一銅合金粉末含有Cu為主成分，含有Cr，含有Cr、Zr總和為0.2～5.0質量%，該第二銅合金粉末含有Cu為主成分，含有0.1～2.0質量%的Ag，含有Ag、Cr、Zr總和為0.2～5.0質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2517" publication-number="202617415">
    <tif-files tif-type="multi-tif">
      <tif file="114141920.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性塑料複合結構</chinese-title>
        <english-title>THERMOPLAST COMPOSITE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">B29C70/28</main-classification>
        <further-classification edition="200601120260105B">B29C70/44</further-classification>
        <further-classification edition="200601120260105B">B29C70/46</further-classification>
        <further-classification edition="200601320260105B">B29L31/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商瑞恩肆德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REIN4CED NV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗赫伊曾　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERHUIZEN, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種中空複合結構，其包含：熱塑性強化材料之至少一個第一最終零件，該第一最終零件具有U形橫截面；該熱塑性強化材料之至少一個第二最終零件，該第二最終零件具有U形橫截面；其中該第一最終零件及該第二最終零件彼此熔合以形成中空零件；至少一個嵌體，其在該中空零件內部，其中該嵌體熔合至該第一最終零件之內表面及該第二最終零件之內表面，其中該嵌體能夠在熔合溫度下變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hollow composite structure comprising: at least one first final part of a thermoplastic reinforced material, the first final part having a U-shaped cross-section; at least one second final part of the thermoplastic reinforced material, the second final part having a U-shaped cross-section; wherein the first final part and the second final part are fused to each other to form a hollow part; at least one insert inside of the hollow part, wherein the insert is fused to an interior surface of the first final part and to an interior surface of the second final part, wherein the insert has is able to deform at the fusion temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合結構；最終複合結構；中空結構；中空零件；最終中空零件</p>
        <p type="p">2:壓力單元；氣囊</p>
        <p type="p">3:嵌體；可變形嵌體</p>
        <p type="p">4:角形區段</p>
        <p type="p">10:內部體積</p>
        <p type="p">11:內表面</p>
        <p type="p">100:結構</p>
        <p type="p">α:封閉角</p>
        <p type="p">r1:內半徑</p>
        <p type="p">P:壓力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2518" publication-number="202617305">
    <tif-files tif-type="multi-tif">
      <tif file="114141921.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>齒輪磨床及齒輪磨削方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">B23F9/02</main-classification>
        <further-classification edition="200601120251124B">B23Q15/013</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科機床股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC MACHINE TOOL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栁瀬吉言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANASE, YOSHIKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種齒輪磨床具備工件旋轉機構、磨石旋轉機構及移動機構。工件旋轉機構使外周面具有多個齒的工件以其中心軸線即工件軸線為中心旋轉。磨石旋轉機構使外周面具有螺旋狀的槽的磨石以其中心軸線即磨石軸線為中心旋轉。移動機構使磨石從齒寬方向上的工件的一端向另一端移動。齒輪磨床在工件與磨石嚙合的狀態下，使工件和磨石同步旋轉，透過移動機構使磨石移動從而對工件進行磨削。工件具有位於齒寬方向的中央部的第一區域和比第一區域更靠近齒寬方向的端部的第二區域。對第一區域磨削時的磨石的移動速度比對第二區域磨削時的磨石的移動速度慢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">9:工件</p>
        <p type="p">20:磨石</p>
        <p type="p">21:槽</p>
        <p type="p">91:齒</p>
        <p type="p">A1:第一區域</p>
        <p type="p">A2:第二區域</p>
        <p type="p">AF:齒寬方向上的移動速度</p>
        <p type="p">C:接觸部位</p>
        <p type="p">X1:工件軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2519" publication-number="202618466">
    <tif-files tif-type="multi-tif">
      <tif file="114141932.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141932</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組合物、硬化膜之製造方法及硬化浮凸圖案之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G03F7/38</main-classification>
        <further-classification edition="200601120260123B">C08G73/10</further-classification>
        <further-classification edition="200601120260123B">C07D227/093</further-classification>
        <further-classification edition="200601120260123B">C08F2/50</further-classification>
        <further-classification edition="200601120260123B">C08L39/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水建樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種即使為賦予高玻璃轉移溫度(Tg)之高吸光度之聚合物，解像度亦優異且與銅接觸時減輕了銅孔隙之感光性樹脂組合物；將該感光性樹脂組合物硬化所得之含有聚醯亞胺之硬化膜之製造方法及使用該感光性樹脂組合物製造硬化浮凸圖案之方法。  &lt;br/&gt;本發明之感光性樹脂組合物含有  &lt;br/&gt;(A)作為(A1)可溶性聚醯亞胺或(A2)聚醯亞胺前驅物之聚合物、  &lt;br/&gt;(B)光聚合起始劑、  &lt;br/&gt;N-乙基-2-吡咯啶酮、  &lt;br/&gt;(E)光聚合性不飽和單體、及  &lt;br/&gt;(X)選自由甲苯、二甲苯、四氫呋喃、γ-丁內酯及γ-戊內酯所組成之群中之至少一種，  &lt;br/&gt;上述(X)之含量相對於上述感光性樹脂組合物之總質量為1 ppm以上10000 ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2520" publication-number="202617327">
    <tif-files tif-type="multi-tif">
      <tif file="114141972.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具頭、機床、工具心軸及工具單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B23Q1/54</main-classification>
        <further-classification edition="200601120260102B">B23Q5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科機床股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC MACHINE TOOL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹井浩昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及工具頭、機床、工具心軸及工具單元。工具頭包括工具心軸、工具、第一主軸、第二主軸、第一平衡器以及第二平衡器。工具心軸、工具、第一主軸、第二主軸、第一平衡器和第二平衡器與旋轉軸線同軸地配置。第一平衡器的至少一部分在軸向上配置於工具與第一主軸之間。第二平衡器的至少一部分在軸向上配置於工具與第二主軸之間。第一平衡器的至少一部分配置於比工具的徑向內端靠徑向內方處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:工具頭</p>
        <p type="p">21:工具心軸</p>
        <p type="p">22:配對法蘭</p>
        <p type="p">23:第一主軸單元</p>
        <p type="p">24:第二主軸單元</p>
        <p type="p">25:第一平衡器</p>
        <p type="p">26:第二平衡器</p>
        <p type="p">27:第一匯集構件</p>
        <p type="p">28:第二匯集構件</p>
        <p type="p">50:工具</p>
        <p type="p">211:小徑筒狀部</p>
        <p type="p">211a:外周面</p>
        <p type="p">212:第一筒狀部</p>
        <p type="p">213:第一擴徑部</p>
        <p type="p">214:第一法蘭部</p>
        <p type="p">217:螺母</p>
        <p type="p">221:連接部</p>
        <p type="p">222:第二筒狀部</p>
        <p type="p">223:第二擴徑部</p>
        <p type="p">224:第二法蘭部</p>
        <p type="p">231:第一殼體</p>
        <p type="p">232:第一主軸</p>
        <p type="p">233:第一軸承</p>
        <p type="p">234:馬達</p>
        <p type="p">236:振動感測器</p>
        <p type="p">241:第二殼體</p>
        <p type="p">242:第二主軸</p>
        <p type="p">243:第二軸承</p>
        <p type="p">251:第一平衡器的實心軸</p>
        <p type="p">252:第一平衡器的配重</p>
        <p type="p">261:第二平衡器的實心軸</p>
        <p type="p">262:第二平衡器的配重</p>
        <p type="p">A:旋轉軸線</p>
        <p type="p">D:軸向</p>
        <p type="p">X2:工具軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2521" publication-number="202617351">
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      <tif file="114142028.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磨石及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251226B">B24D7/06</main-classification>
        <further-classification edition="200601120251226B">B24D3/00</further-classification>
        <further-classification edition="201201120251226B">B24B37/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納米科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANO TEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田篤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋恭介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田大和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, YAMATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之磨石包括排列於研磨或磨削晶圓之加工面，並在與加工面相交之方向延伸的複數個加工部。複數個加工部配置在加工面之周方向與徑方向的各個方向上相間隔之位置。複數個加工部各個位於加工面上之加工區域的面積設定成4mm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:加工面</p>
        <p type="p">11:加工部</p>
        <p type="p">14:梳齒加工片</p>
        <p type="p">19:保持部</p>
        <p type="p">θ:傾斜角度</p>
        <p type="p">C:周方向</p>
        <p type="p">R:徑方向</p>
        <p type="p">T:切線方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2522" publication-number="202619530">
    <tif-files tif-type="multi-tif">
      <tif file="114142095.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及電子設備</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND ELECTRONIC APPLIANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260107B">H10D30/60</main-classification>
        <further-classification edition="202501120260107B">H10D30/01</further-classification>
        <further-classification edition="200601120260107B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是實現使用氧化物半導體構成的電晶體的電特性的穩定化，而提高該電晶體的可靠性。在一個氧化物半導體膜中，分別形成結晶成分較多的部分和非晶成分較多的區域。以其用作通道形成區的方式構成結晶成分較多的區域，以包含較多的非晶成分的方式構成其他區域。較佳的是，自對準地形成混有結晶成分較多的區域和非晶成分較多的區域的氧化物半導體膜。為了在一個氧化物半導體膜中分別形成其結晶性彼此不同的區域，首先在形成包含較多的結晶成分的氧化物半導體膜之後，進行用來使該氧化物半導體膜的一部分非晶化的製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A region containing a high proportion of crystal components and a region containing a high proportion of amorphous components are formed separately in one oxide semiconductor film. The region containing a high proportion of crystal components is formed so as to serve as a channel formation region and the other region is formed so as to contain a high proportion of amorphous components. It is preferable that an oxide semiconductor film in which a region containing a high proportion ofcrystal components and a region containing a high proportion of amorphous components are mixed in a self-aligned manner be formed. To separately form the regions which differ in crystallinity in the oxide semiconductor film, first, an oxide semiconductor film containing a high proportion of crystal components is formed and then process for performing amorphization on part of the oxide semiconductor film is conducted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:閘極層</p>
        <p type="p">2:閘極絕緣層</p>
        <p type="p">3:氧化物半導體層</p>
        <p type="p">4:源極電極層</p>
        <p type="p">5:汲極電極層</p>
        <p type="p">6:蝕刻停止層</p>
        <p type="p">7:區域</p>
        <p type="p">8:區域</p>
        <p type="p">100:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2523" publication-number="202619341">
    <tif-files tif-type="multi-tif">
      <tif file="114142125.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視訊編碼方法和視訊解碼方法</chinese-title>
        <english-title>VIDEO ENCODING METHOD AND VIDEO DECODING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/13</main-classification>
        <further-classification edition="201401120260102B">H04N19/70</further-classification>
        <further-classification edition="201401120260102B">H04N19/176</further-classification>
        <further-classification edition="201401120260102B">H04N19/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向時達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIANG, SHIH-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種視訊編碼方法和視訊解碼方法。解析一個或多個高級語法元素，以指示是否啟用控制方案。響應於所述一個或多個高級語法元素指示該控制方案被啟用時：當與目標語法標誌相關的所選上下文變量的目標機率對應於指定的高/低機率範圍時，將與變換係數表示相關的目標語法標誌的值推斷為目標語法標誌的推斷值。根據另一種方法，解析一個或多個高級語法元素，以指示當前位元流是否透過無損壓縮方式表示編碼輸入視訊資料。根據又一種方法，確定無損壓縮方式的預定義參數設置，其中，所有導致編解碼偽影的編解碼工具被禁用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Video encoding method and video decoding method are disclosed. According to one method, one or more high-level syntax elements indicating whether to enable a controlling scheme are parsed. In response to said one or more high-level syntax elements indicating the controlling scheme being enabled: a value for a target syntax flag related to representation of the transform coefficients is inferred as an inferred value for the target syntax flag when a target probability for a selected context variable associated with the target syntax flag corresponds to a specified high/low probability range. According to another method, one or more high-level syntax elements indicating whether the current bitstream represents a coded input video data by lossless compression are parsed. According to yet another method, a pre-defined parameter setting for lossless compression is determined, wherein all coding tools that cause coding artefacts are disabled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">810:步驟</p>
        <p type="p">820:步驟</p>
        <p type="p">830:步驟</p>
        <p type="p">840:步驟</p>
        <p type="p">850:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2524" publication-number="202617412">
    <tif-files tif-type="multi-tif">
      <tif file="114142131.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性複合結構</chinese-title>
        <english-title>THERMOPLASTIC COMPOSITE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B29C65/02</main-classification>
        <further-classification edition="200601120260202B">B29C69/00</further-classification>
        <further-classification edition="200601320260202B">B29L22/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商瑞恩肆德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REIN4CED NV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗赫伊曾　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERHUIZEN, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於以一閉合壓製形式形成包含一熱塑性強化材料之一複合結構之製造方法，該方法包含：&lt;br/&gt;  形成具有一第一中間形狀之至少一個第一殼體部件；&lt;br/&gt;  形成具有一第二中間形狀之至少一個第二殼體部件；&lt;br/&gt;  藉由使用熱及壓力將該至少第一殼體部件及該至少第二殼體部件熔合在一起以形成具有一最終形狀之一中空部件；&lt;br/&gt;  其中該最終形狀不同於該等各別中間形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing for forming a composite structure comprising a thermoplastic reinforced material in a closed press form, the method comprising:&lt;br/&gt; forming at least one first shell part having a first intermediate shape;&lt;br/&gt; forming at least one second shell part having a second intermediate shape;&lt;br/&gt; fusing the at least first and second shell parts together by using heat and pressure to form a hollow part having a final shape;&lt;br/&gt; wherein the final shape is different from the respective intermediate shapes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:最終形狀；最終中空部件；中空結構；中空部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2525" publication-number="202618900">
    <tif-files tif-type="multi-tif">
      <tif file="114142133.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高壓基板處理裝置</chinese-title>
        <english-title>HIGH-PRESSURE SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/30</main-classification>
        <further-classification edition="200601120260109B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＰＳＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HPSP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹寭晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HYESEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SE CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種高壓基板處理裝置。該高壓基板處理裝置，可以包括反應腔室、流體供給模組及阻熱模組。該反應腔室，可以具備：處理室，用於容納包含氣態氧化氫且反應壓力高於大氣壓力的反應氣體；以及裝載臺，用於裝載待用該反應氣體處理的基板。該流體供給模組可以包括排出口，用於將該氣態氧化氫供給至該處理室。該阻熱模組可以佈置在該排出口和該裝載臺之間，用於阻擋從該排出口排出的該氣態氧化氫傳遞至該基板的熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a high-pressure substrate processing apparatus. The high-pressure substrate processing apparatus may include a reaction chamber, a fluid supply module and a heat-resistant module. The reaction chamber may include: a processing chamber for accommodating a reaction gas containing gaseous hydrogen oxide and having a reaction pressure higher than atmospheric pressure; and a loading platform for loading a substrate to be processed by the reaction gas. The fluid supply module may include an exhaust outlet for supplying the gaseous hydrogen oxide to the processing chamber. The heat-resistant module may be arranged between the exhaust outlet and the loading platform to prevent the heat of the gaseous hydrogen oxide discharged from the exhaust outlet from being transferred to the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板處理裝置</p>
        <p type="p">110:內部腔室</p>
        <p type="p">111:內殼</p>
        <p type="p">115:內門</p>
        <p type="p">119:裝載臺</p>
        <p type="p">130:流體供給模組</p>
        <p type="p">136:延伸管</p>
        <p type="p">137:排出口</p>
        <p type="p">139:加熱單元</p>
        <p type="p">190:阻熱模組</p>
        <p type="p">191:迂迴板</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2526" publication-number="202618404">
    <tif-files tif-type="multi-tif">
      <tif file="114142146.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學構件組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B27/01</main-classification>
        <further-classification edition="200601120260126B">G02B5/30</further-classification>
        <further-classification edition="200601120260126B">G02F1/13363</further-classification>
        <further-classification edition="201501120260126B">G02B1/11</further-classification>
        <further-classification edition="201901120260126B">B32B7/023</further-classification>
        <further-classification edition="200601120260126B">B32B27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤周作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, SHUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可實現VR護目鏡之輕量化、提升視辨性之光學積層體。本發明實施形態之光學積層體，具備：積層薄膜，其具有基材與表面處理層；及，相位差構件；前述積層薄膜之基材與前述相位差構件係配置成相鄰接；前述相位差構件依序包含第一相位差層、接著劑層及第二相位差層；前述接著劑層之厚度為0.5µm以上且1.3µm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:顯示系統</p>
        <p type="p">4:透鏡部</p>
        <p type="p">12:顯示元件</p>
        <p type="p">12a:顯示面</p>
        <p type="p">14:反射型偏光構件</p>
        <p type="p">16:第一透鏡部</p>
        <p type="p">18:半反射鏡</p>
        <p type="p">20:第一相位差構件</p>
        <p type="p">22:第二相位差構件</p>
        <p type="p">24:第二透鏡部</p>
        <p type="p">26:使用者之眼睛</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2527" publication-number="202618341">
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      <tif file="114142531.zip" no="1">
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          <doc-number>202618341</doc-number>
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        <document-id>
          <doc-number>114142531</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擴散片積層體、背光單元、液晶顯示裝置、資訊設備、以及背光單元之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B5/02</main-classification>
        <further-classification edition="200601120260126B">G02F1/13357</further-classification>
        <further-classification edition="200601120260126B">B32B3/30</further-classification>
        <further-classification edition="200601120260126B">F21V5/04</further-classification>
        <further-classification edition="200601120260126B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商惠和股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEIWA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENGHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於抑制背光單元中之亮度均勻性降低。本發明之光學片積層體100係被組裝在背光單元40中。光學片積層體100係具備：多個擴散片43，於第一面21a有大致倒四角錐狀的多個凹部22被排列成二維矩陣狀；一對稜鏡片44，稜鏡延伸方向彼此正交；以及稜鏡片45。多個擴散片43係包括凹部22的排列方向彼此不同之至少二個擴散片43。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">22:凹部</p>
        <p type="p">43:擴散片</p>
        <p type="p">111:稜線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2528" publication-number="202619342">
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        <document-id>
          <doc-number>114145716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>解碼器、編碼器、用以解碼之方法及相關電腦可讀媒體</chinese-title>
        <english-title>DECODER, ENCODER, METHOD FOR DECODING AND RELATED COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260116B">H04N19/169</main-classification>
        <further-classification edition="201401120260116B">H04N19/46</further-classification>
        <further-classification edition="201401120260116B">H04N19/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＧＥ影像壓縮有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE VIDEO COMPRESSION, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克曲后弗　辛納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRCHHOFFER, HEINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文肯　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINKEN, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希利　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLE, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬皮　迪特利夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARPE, DETLEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦茲　希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, HEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用次分割以編碼一空間取樣資訊信號之編碼結構以及編碼一次分割或一多樹型結構之編碼結構被說明，其中代表性實施例是有關圖像及/或視訊編碼應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Coding schemes for coding a spatially sampled information signal using sub-division and coding schemes for coding a sub-division or a multitree structure are described, wherein representative embodiments relate to picture and/or video coding applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:編碼器</p>
        <p type="p">12:預測器</p>
        <p type="p">14:殘差預編碼器</p>
        <p type="p">16:殘差重建器</p>
        <p type="p">18:資料流插入器</p>
        <p type="p">20:區塊分割器</p>
        <p type="p">22:資料流</p>
        <p type="p">24:圖像</p>
        <p type="p">26:子區</p>
        <p type="p">28:次分割器</p>
        <p type="p">30:合併器</p>
        <p type="p">32:輸入</p>
        <p type="p">34:減法器</p>
        <p type="p">36:加法器</p>
        <p type="p">38:濾波器</p>
        <p type="p">40:預測參數</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2529" publication-number="202618430">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影裝置及成像組件</chinese-title>
        <english-title>PROJECTION DEVICE AND IMAGING ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">G03B21/14</main-classification>
        <further-classification edition="200601120260120B">G02B27/18</further-classification>
        <further-classification edition="200601120260120B">G02B11/32</further-classification>
        <further-classification edition="200601120260120B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種投影裝置包含成像組件及導光件。成像組件包含顯示組件及透鏡組。顯示組件用以產生第一投影光束。透鏡組用以將第一投影光束轉換為第二投影光束。透鏡組朝向顯示組件的方向依序包含第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡及第六透鏡。導光件包含入光表面及出光表面。第二投影光束經由入光表面朝向出光表面照射。第一透鏡、第四透鏡、第五透鏡及第六透鏡分別具有正焦距，第二透鏡及第三透鏡分別具有負焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projection device includes an imaging assembly and a light guide element. The imaging element includes a display assembly and a lens assembly. The display assembly is configured to generate a first projection light beam. The lens assembly is configured to convert the first projection light beam into a second projection light beam. In a direction toward the display assembly, the lens assembly sequentially includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens. The light guide element includes an incident surface and an emitting surface. The second projection light beam enters through the incident surface and is directed toward the emitting surface. The first lens, the fourth lens, the fifth lens, and the sixth lens each have a positive focal length, while the second lens and the third lens each have a negative focal length.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:投影裝置</p>
        <p type="p">102:成像組件</p>
        <p type="p">104:導光件</p>
        <p type="p">106:顯示組件</p>
        <p type="p">107:成像面</p>
        <p type="p">108:透鏡組</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">112:第二透鏡</p>
        <p type="p">114:第三透鏡</p>
        <p type="p">116:第四透鏡</p>
        <p type="p">118:第五透鏡</p>
        <p type="p">120:第六透鏡</p>
        <p type="p">132:透反板</p>
        <p type="p">134:稜鏡</p>
        <p type="p">L1:第一投影光束</p>
        <p type="p">L2:第二投影光束</p>
        <p type="p">L4:環境光束</p>
        <p type="p">θ3:第三斜角</p>
      </representative-img>
    </description>
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          <doc-number>114146047</doc-number>
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      </application-reference>
      <invention-title>
        <chinese-title>標記量測方法、量測裝置、曝光裝置、演算裝置、程式及儲存媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G03F9/02</main-classification>
        <further-classification edition="200601120260126B">H01L21/66</further-classification>
        <further-classification edition="200601120260126B">G01B11/27</further-classification>
        <further-classification edition="200601120260126B">G03F7/20</further-classification>
        <further-classification edition="201701120260126B">G06T7/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石野平祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHINO, HEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之標記量測方法包括：獲取第一圖案與第二圖案疊加而形成之重疊標記之圖像，上述第一圖案由線與間隙於基板上之一層沿著既定方向以第一間距P1重複形成，上述第二圖案由線與間隙於與上述一層不同之其他層沿著上述既定方向以與上述第一間距P1不同之第二間距P2重複形成；自所獲取之上述重疊標記之圖像提取上述重疊標記於上述既定方向上之亮度訊號；及根據所提取之上述亮度訊號，對上述第一圖案及上述第二圖案之至少一者求出上述既定方向上之絕對位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">LS1:第一圖案</p>
        <p type="p">LS2:第二圖案</p>
        <p type="p">OM1、OM2:重疊標記</p>
        <p type="p">P1:第一間距</p>
        <p type="p">P2:第二間距</p>
        <p type="p">SP:座標原點</p>
        <p type="p">X1:第一波紋位置</p>
        <p type="p">X2:第二波紋位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2531" publication-number="202618431">
    <tif-files tif-type="multi-tif">
      <tif file="114146073.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投射裝置及其鏡頭結構</chinese-title>
        <english-title>PROJECTION DEVICE AND LENS STRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">G03B21/14</main-classification>
        <further-classification edition="200601120260120B">G02B27/18</further-classification>
        <further-classification edition="200601120260120B">G02B27/10</further-classification>
        <further-classification edition="200601120260120B">G02B27/30</further-classification>
        <further-classification edition="200601120260120B">G02B13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林修輊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種投射裝置及其鏡頭結構，其是關於具有平面光學元件以及擴展透鏡組的鏡頭結構。其中，平面光學元件用以對至少一投射光進行分光與準直。擴展透鏡組與平面光學元件從鏡頭結構的第一側到鏡頭結構的第二側依序配置。藉此，投射裝置或鏡頭結構不但能擴展視場，同時還修正了光透過結構式透鏡產生的光學畸變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projection device and lens structure thereof is related to a lens structure including a flat optical component and an expanding lens group. The flat optical component is used to separate and collimate at least one projected light beam. The expanding lens group and the flat optical component are sequentially arranged from a first side of the lens structure to a second side of the lens structure. Therefore, the projection device or the lens structure not only expands the field of view (FOV) but also corrects for optical distortion caused by light passing through the structural lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:投射裝置</p>
        <p type="p">12:鏡頭結構</p>
        <p type="p">12a:第一側</p>
        <p type="p">12b:第二側</p>
        <p type="p">121:平面光學元件</p>
        <p type="p">123:鏡頭</p>
        <p type="p">123a,123b,123c:透鏡</p>
        <p type="p">14:光源模組</p>
        <p type="p">X,Y,Z:方向</p>
        <p type="p">O1:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2532" publication-number="202617984">
    <tif-files tif-type="multi-tif">
      <tif file="114146258.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>DNA修飾酶及活性片段，及其變異體與使用方法</chinese-title>
        <english-title>DNA MODIFYING ENZYMES AND ACTIVE FRAGMENTS AND VARIANTS THEREOF AND METHODS OF USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C12N9/78</main-classification>
        <further-classification edition="200601120260123B">C12N9/22</further-classification>
        <further-classification edition="200601120260123B">C12N15/10</further-classification>
        <further-classification edition="200601120260123B">C12N9/80</further-classification>
        <further-classification edition="200601120260123B">C12N15/52</further-classification>
        <further-classification edition="200601120260123B">C12N15/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商生命編輯治療學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIFEEDIT THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯恩　泰森　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWEN, TYSON D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅雷　亞歷山卓　布萊勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAWLEY, ALEXANDRA BRINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾力奇　泰德　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELICH, TEDD D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了包括用於核酸之靶向編輯的新穎脫胺酶多肽的組成物及方法。組成物包括脫胺酶多肽。亦提供了包括DNA結合多肽及本發明之脫胺酶的融合蛋白。融合蛋白包含與脫胺酶融合（視情況於複合物中用導引RNA）的RNA導引之核酸酶。組成物亦包含編碼脫胺酶或融合蛋白的核酸分子。亦提供了包括編碼脫胺酶或融合蛋白的核酸分子的載體及宿主細胞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions and methods comprising novel deaminase polypeptides for targeted editing of nucleic acids are provided. Compositions comprise deaminase polypeptides. Also provided are fusion proteins comprising a DNA-binding polypeptide and a deaminase of the invention. The fusion proteins include RNA-guided nucleases fused to deaminases, optionally in complex with guide RNAs. Compositions also include nucleic acid molecules encoding the deaminases or the fusion proteins. Vectors and host cells comprising the nucleic acid molecules encoding the deaminases or the fusion proteins are also provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2533" publication-number="202618326">
    <tif-files tif-type="multi-tif">
      <tif file="114146290.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測模組、攝像模組及其透鏡調焦結構</chinese-title>
        <english-title>SENSOR MODULE, CAMERA MODULE, AND LENS FOCUSING STRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G01S7/481</main-classification>
        <further-classification edition="202301120260121B">H04N23/55</further-classification>
        <further-classification edition="202101120260121B">G02B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾正德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHENG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊勝傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感測模組包含基板、發光元件、感測元件以及二鏡頭組件。各鏡頭組件包含基座、鏡筒以及透鏡。基座設置於基板上並具有基座容置部及外螺紋。基座容置部具有基座開口。鏡筒設置於基座上並具有鏡筒容置部。鏡筒容置部具有內螺紋以及鏡筒開口。內螺紋適於匹配外螺紋。透鏡設置於鏡筒開口中。發光元件以及感測元件位於基板上並分別對應二鏡頭組件以及分別容置於對應的基座容置部中。一種攝像模組以及一種透鏡調焦結構亦被提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sensing module includes a substrate, a light-emitting element, a sensing element, and two lens assemblies. Each lens assembly includes a base, a lens barrel, and a lens. The base is arranged on the substrate and has a base accommodating portion and an outer thread. The base accommodating portion has a base opening. The lens barrel is arranged on the base and has a barrel accommodating portion. The barrel accommodating portion has an inner thread and a barrel opening. The inner thread is adapted to engage with the outer thread. The lens is arranged in the barrel opening. The light-emitting element and the sensing element are on the substrate and respectively correspond to the two lens assemblies and respectively accommodated in corresponding base accommodating portions. A camera module and a lens focusing structure are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:感測模組</p>
        <p type="p">110:基板</p>
        <p type="p">120:發光元件</p>
        <p type="p">140:感測元件</p>
        <p type="p">121:側面</p>
        <p type="p">130a,130b:鏡頭組件</p>
        <p type="p">200a,200b:基座</p>
        <p type="p">210a,210b:基座容置部</p>
        <p type="p">220a,220b:外螺紋</p>
        <p type="p">230a,230b:基座開口</p>
        <p type="p">240a,240b:側開口</p>
        <p type="p">241:外端面</p>
        <p type="p">300a,300b:鏡筒</p>
        <p type="p">310a,310b:鏡筒容置部</p>
        <p type="p">320a,320b:內螺紋</p>
        <p type="p">330a,330b:鏡筒開口</p>
        <p type="p">340a:夾持凹槽</p>
        <p type="p">400a,400b:透鏡</p>
        <p type="p">510:墊圈</p>
        <p type="p">520:濾光片</p>
        <p type="p">600:蓋體</p>
        <p type="p">610:蓋體容置部</p>
        <p type="p">620:蓋體開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2534" publication-number="202618536">
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      <tif file="114146364.zip" no="1">
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      <volno>24</volno>
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          <doc-number>202618536</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146364</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提供使用者介面(UI)之方法</chinese-title>
        <english-title>METHOD FOR PROVIDING USER INTERFACE (UI)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260122B">G06F3/0484</main-classification>
        <further-classification edition="201301120260122B">G06F3/048</further-classification>
        <further-classification edition="201901120260122B">G16C20/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商米瑟迪可麥德公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METHODICAL MIND, LLC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯塔德特　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOHLSTADTER, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西格爾　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGAL, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅克斯　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROQUES, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, LOUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐貝羅伊　潘卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBEROI, PANKAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG, KIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOCK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種在使用者介面上透過選單選擇的路徑以互動式導引使用者之方法，該方法可包括在使用者介面顯示的一第一部分上顯示目前選項選單。該使用者介面允許從目前選項選單來選擇一選單項目，並基於選擇先前選單選擇層中的選單項目以深入選單選擇層。該使用者介面顯示的一第二部分顯示該等深入層的過去選定和過去未選定選單項目。該等過去未選定選單項目顯示成可選選項。該使用者介面允許藉由選擇在該使用者介面顯示的該第二部分上顯示的先前導引選單層中的一過去未選定選單項目而跳到選單選項的不同路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of interactively navigating a user through a path of menu choices on a user interface may include displaying a current menu of choices on a first portion of a user interface display. The user interface allows for selecting of a menu item from the current menu of choices and to drill down through levels of menu choices based on selecting a menu item from a prior level of menu choices. A second portion of the user interface display presents past selected and past unselected menu items of the drilled-down levels. The past unselected menu items are displayed as selectable options. The user interface allows for jumping to a different path of menu choices by selecting a past unselected menu item from a previously navigated menu level displayed on the second portion of the user interface display.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2535" publication-number="202619463">
    <tif-files tif-type="multi-tif">
      <tif file="114146845.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146845</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於液浸冷卻的散熱器、散熱器佈置及模組</chinese-title>
        <english-title>HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H05K7/20</main-classification>
        <further-classification edition="200601120260126B">H01L23/473</further-classification>
        <further-classification edition="200601120260126B">H01L23/367</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商艾瑟歐托普集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICEOTOPE GROUP LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞摩斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMOS, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃德蒙茲　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDMUNDS, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊格　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUNG, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉德格爾　賈斯佩爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDGER, JASPER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆格赫斯特　南森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONGHURST, NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於浸入在液態冷卻液中的電子設備的散熱器及散熱器佈置。一種散熱器可包括：基部，用於安裝在該電子設備的導熱面的頂部上及從該導熱面導熱；及護壁，從該基部延伸且界定容積。一種散熱器可具有用來界定容積的壁佈置，該電子設備被安裝在該容積中。一種散熱器可用於電子設備，該電子設備要用與容器的底板實質垂直的定向安裝在該容器中的表面上。從該電子設備向容納在該散熱器容積中的液態冷卻液導熱。亦提供了一種包括散熱器的冷卻模組。一種噴嘴佈置可向散熱器的基部引導液態冷卻液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:推合式連接件</p>
        <p type="p">4:接陸點</p>
        <p type="p">5:管子</p>
        <p type="p">6:凸出物</p>
        <p type="p">7:護壁</p>
        <p type="p">13:固定螺釘</p>
        <p type="p">16:架座</p>
        <p type="p">17:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2536" publication-number="202617155">
    <tif-files tif-type="multi-tif">
      <tif file="114146892.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水性組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61K31/519</main-classification>
        <further-classification edition="200601120260123B">A61K47/04</further-classification>
        <further-classification edition="200601120260123B">A61K47/12</further-classification>
        <further-classification edition="200601120260123B">A61K9/08</further-classification>
        <further-classification edition="200601120260123B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂敦製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHTO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保大空</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, OZORA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林紗衣子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, SAEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喜多亜希子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種水性組成物，其含有（A）迪高替尼（Delgocitinib）或其鹽、及（B）選自由檸檬酸、磷酸、及其等之鹽所組成之群中之至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2537" publication-number="202618161">
    <tif-files tif-type="multi-tif">
      <tif file="114147055.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>允許管道元件縱軸旋轉之聯軸器</chinese-title>
        <english-title>COUPLING PERMITTING LONGITUDINAL AXIS ROTATION OF PIPE ELEMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">F16L21/06</main-classification>
        <further-classification edition="200601120260121B">F16L21/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商韋克陶立公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VICTAULIC COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬利森　艾瑞克　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINLAYSON, ERIC FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種允許管道元件圍繞其縱軸旋轉之聯軸器包含可附接至該等管道元件之一第一者之一第一環。該第一環具有自其向外突出且界定一低摩擦支承面之一第一套環。一外殼界定通過其之一孔，該孔環繞與該孔同軸配置之一縱軸。該外殼具有彼此對置安置之一第一端及一第二端。該第一端經調適以使該第一環同軸接收於該孔內。該外殼包括一第一肩部及一第一通道。當該第一環在該第一端處接收於該孔內時，該第一套環可定位於該第一肩部與該第一通道之間。該支承面可與該第一肩部接合。該支承面與該第一肩部之間的接合允許該第一環相對於該外殼旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coupling permitting rotation of pipe elements about their longitudinal axes includes a first ring attachable to a first of the pipe elements. The first ring has a first collar projecting outwardly therefrom and defining a low friction bearing surface. A housing defines a bore therethrough surrounding a longitudinal axis arranged coaxially with the bore. The housing has a first end and a second end oppositely disposed from one another. The first end is adapted to receive the first ring coaxially within the bore. The housing comprises a first shoulder and a first channel. When the first ring is received within the bore at the first end, the first collar is positionable between the first shoulder and the first channel. The bearing surface is engageable with the first shoulder. Engagement between the bearing surface and the first shoulder allows rotation of the first ring with respect to the housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:聯軸器</p>
        <p type="p">12:第一管道元件</p>
        <p type="p">14:第二管道元件</p>
        <p type="p">16:縱軸</p>
        <p type="p">18:第一環</p>
        <p type="p">20:第二環</p>
        <p type="p">36:第一區段</p>
        <p type="p">38:第二區段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2538" publication-number="202618761">
    <tif-files tif-type="multi-tif">
      <tif file="114147134.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對低延遲音訊編解碼器之參數之量化及熵編碼</chinese-title>
        <english-title>QUANTIZATION AND ENTROPY CODING OF PARAMETERS FOR A LOW LATENCY AUDIO CODEC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260122B">G10L19/04</main-classification>
        <further-classification edition="201301120260122B">G10L19/02</further-classification>
        <further-classification edition="201301120260122B">G10L19/008</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜拜研究特許公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥格拉斯　大衛　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGRATH, DAVID S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔吉　里沙普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYAGI, RISHABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯朗　史蒂芬妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, STEFANIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托瑞斯　瓊恩　菲立克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORRES, JUAN FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種用於一輸入信號之逐訊框編碼後設資料之方法，該後設資料包括可自該輸入信號計算之複數個至少部分相關之參數。該方法包括，對於各訊框：藉由使用一迴路程序迭代執行以下步驟：自複數個處理策略判定一處理策略用於計算及量化該等參數；基於該經判定之處理策略計算及量化該等參數以獲得經量化參數；及編碼該等經量化參數。特定言之，該複數個處理策略之各者包括指示與個別參數之該計算及量化相關之一排序之一各自第一指示；及該處理策略基於至少一個位元速率臨限值判定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described is a method of frame-wise encoding metadata for an input signal, the metadata comprising a plurality of at least partially interrelated parameters calculable from the input signal. The method comprises, for each frame: iteratively performing, by using a looping process, steps of: determining a processing strategy from a plurality of processing strategies for calculating and quantizing the parameters; calculating and quantizing the parameters based on the determined processing strategy to obtain quantized parameters; and encoding the quantized parameters. In particular, each of the plurality of processing strategies comprises a respective first indication indicative of an ordering related to the calculation and quantization of individual parameters; and the processing strategy is determined based on at least one bitrate threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2539" publication-number="202618854">
    <tif-files tif-type="multi-tif">
      <tif file="114147153.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線性加速器、離子束控制裝置及方法</chinese-title>
        <english-title>LINEAR ACCELERATOR, ION BEAM CONTROLLING APPARATUS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260117B">H01J37/317</main-classification>
        <further-classification edition="200601120260117B">H01J37/08</further-classification>
        <further-classification edition="200601120260117B">H05H7/02</further-classification>
        <further-classification edition="200601120260117B">H05H7/18</further-classification>
        <further-classification edition="200601120260117B">H05H5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡威爾　基斯　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOWAL, KEITH E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種線性加速器、離子束控制裝置及方法。一種裝置可包括全域控制模塊，所述全域控制模塊包括數字主時鐘產生器及主波形產生器。所述裝置還可包括耦合到全域控制模塊的多個共振器控制模塊。所述多個共振器控制模塊中的給定共振器控制模塊可包括同步模塊，所述同步模塊具有被耦合成從本地共振器接收共振器輸出電壓拾取信號的第一輸入、被耦合成從數字主時鐘產生器接收數字主時鐘信號的第二輸入以及被耦合成向主波形產生器發送延遲信號的第一輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A linear accelerator, an ion beam controlling apparatus and a method thereof are provided. An apparatus may include global control module, the global control module including a digital master clock generator and a master waveform generator. The apparatus may also include a plurality of resonator control modules, coupled to the global control module. A given resonator control module of the plurality of resonator control modules may include a synchronization module, having a first input coupled to receive a resonator output voltage pickup signal from a local resonator, a second input coupled to receive a digital master clock signal from the digital master clock generator, and a first output coupled to send a delay signal to the master waveform generator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:離子植入系統</p>
        <p type="p">102:離子源</p>
        <p type="p">104:外殼</p>
        <p type="p">106:離子束</p>
        <p type="p">107:氣體盒</p>
        <p type="p">110:分析器</p>
        <p type="p">115:高能量離子束</p>
        <p type="p">116:過濾磁體</p>
        <p type="p">118:掃描器</p>
        <p type="p">120:准直器</p>
        <p type="p">122:端站</p>
        <p type="p">124:基板</p>
        <p type="p">126:線性加速器</p>
        <p type="p">128:共振器</p>
        <p type="p">132:共振器控制模塊</p>
        <p type="p">134:全域控制模塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2540" publication-number="202619531">
    <tif-files tif-type="multi-tif">
      <tif file="114147674.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260123B">H10D30/60</main-classification>
        <further-classification edition="200601120260123B">H01L21/363</further-classification>
        <further-classification edition="202501120260123B">H10D62/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中哲弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TETSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一條充弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIJO, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤俊弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下村明久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOMURA, AKIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恵木勇司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手祐朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEZUKA, SACHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有穩定的電特性的電晶體。本發明的一個實施方式是一種半導體裝置，該半導體裝置包括形成在基板上的第一絕緣體、形成在第一絕緣體上的第二絕緣體、以與第二絕緣體的頂面的至少一部分接觸的方式形成的氧化物半導體、以與氧化物半導體的頂面的至少一部分接觸的方式形成的第三絕緣體、與氧化物半導體電連接的第一導電體及第二導電體、形成在第三絕緣體上的第四絕緣體、形成在第四絕緣體上且其至少一部分位於第一導電體與第二導電體之間的第三導電體、形成在第三導電體上的第五絕緣體，其中第一絕緣體包含鹵素元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transistor with stable electrical characteristics. A semiconductor device includes a first insulator over a substrate, a second insulator over the first insulator, an oxide semiconductor in contact with at least part of a top surface of the second insulator, a third insulator in contact with at least part of a top surface of the oxide semiconductor, a first conductor and a second conductor electrically connected to the oxide semiconductor, a fourth insulator over the third insulator, a third conductor which is over the fourth insulator and at least part of which is between the first conductor and the second conductor, and a fifth insulator over the third conductor. The first insulator contains a halogen element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電晶體</p>
        <p type="p">100:基板</p>
        <p type="p">101:絕緣體</p>
        <p type="p">102:導電體</p>
        <p type="p">103:絕緣體</p>
        <p type="p">104:絕緣體</p>
        <p type="p">105:絕緣體</p>
        <p type="p">106a:絕緣體</p>
        <p type="p">106b:半導體</p>
        <p type="p">106c:絕緣體</p>
        <p type="p">108a:導電體</p>
        <p type="p">108b:導電體</p>
        <p type="p">109a:低電阻區域</p>
        <p type="p">109b:低電阻區域</p>
        <p type="p">112:絕緣體</p>
        <p type="p">114:導電體</p>
        <p type="p">116:絕緣體</p>
        <p type="p">118:絕緣體</p>
        <p type="p">120a:導電體</p>
        <p type="p">120b:導電體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2541" publication-number="202618372">
    <tif-files tif-type="multi-tif">
      <tif file="114148082.zip" no="1">
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          <doc-number>202618372</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學投影系統</chinese-title>
        <english-title>OPTICAL PROJECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G02B9/60</main-classification>
        <further-classification edition="200601120260121B">G02B27/01</further-classification>
        <further-classification edition="200601120260121B">G03B21/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學投影系統，配置用以使來自顯示畫面的成像光線經過光學投影系統進入觀察者的眼睛以形成影像。其中朝向眼睛的一側為目側且朝向顯示畫面的一側為顯示側。光學投影系統從目側至顯示側沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、第四透鏡以及第五透鏡，第一透鏡至第五透鏡各自包括朝向目側且使成像光線通過的目側面及朝向顯示側且使成像光線通過的顯示側面，光學投影系統還包括光圈、稜鏡模組以及保護蓋板。其中，光學投影系統中具有屈光度的透鏡僅有上述五片透鏡，且滿足以下條件式：10度≦FOV/2≦20度，其中FOV為光學投影系統的視場角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical projection system is configured to cause imaging rays from a display screen to pass through the optical projection system and enter an observer's eye to form an image. The side facing the eye is defined as an eye-side, and the side facing the display screen is defined as a display-side. The optical projection system sequentially comprises, from the eye-side to the display-side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element, and a fifth lens element. Each of the first to fifth lens elements includes an eye-side surface facing the eye-side and a display-side surface facing the display-side, both of which allow the imaging rays to pass through. The optical projection system further includes an aperture stop, a prism module, and a protective cover plate. In the optical projection system, the only lens elements having refractive power are the aforementioned five lens elements, and the system satisfies the following condition: 10 degrees≦FOV/2≦20 degrees, where FOV is the field of view of the optical projection system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">0:光圈</p>
        <p type="p">1:第一透鏡</p>
        <p type="p">2:第二透鏡</p>
        <p type="p">3:第三透鏡</p>
        <p type="p">4:第四透鏡</p>
        <p type="p">5:第五透鏡</p>
        <p type="p">6:稜鏡模組</p>
        <p type="p">9:保護蓋板</p>
        <p type="p">10:光學投影系統</p>
        <p type="p">11,21,31,41,51,61,91:目側面</p>
        <p type="p">12,22,32,42,52,62,92:顯示側面</p>
        <p type="p">99:顯示畫面</p>
        <p type="p">A1:目側</p>
        <p type="p">A2:顯示側</p>
        <p type="p">L:成像光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2542" publication-number="202617221">
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      <tif file="114148084.zip" no="1">
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      <isuno>9</isuno>
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          <doc-number>202617221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滅火系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">A62C37/00</main-classification>
        <further-classification edition="200601120260122B">A62C31/00</further-classification>
        <further-classification edition="200601120260122B">A62C35/68</further-classification>
        <further-classification edition="200601120260122B">F16K17/00</further-classification>
        <further-classification edition="200601120260122B">G05D16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商能美防災股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOHMI BOSAI LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸賀沢舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOGASAWA, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本多賀路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TAKAMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡澤政志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAWA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井亮輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]讓現場控制盤的設置的自由度提升。  &lt;br/&gt;　　[解決手段]滅火系統(1)具備有：噴嘴單元(4)、現場控制盤(5)及可搬型的現場操作單元(6)。噴嘴單元(4)具備有放水部與感知部。現場控制盤(5)取得噴嘴單元(4)的狀態資訊的同時，依據從現場操作單元(6)所輸出的操作訊號控制噴嘴單元(4)。現場操作單元(6)，是具備有顯示部與操作部，且是與現場控制盤(5)可通訊地自由連接。該現場操作單元(6)，是從現場控制盤(5)取得狀態資訊，將其在顯示部作顯示，且當利用者操作操作部時，將顯示該操作的操作訊號輸出到現場控制盤(5)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:滅火系統</p>
        <p type="p">2:自動火災警報設備</p>
        <p type="p">3:中央操作盤</p>
        <p type="p">4:噴嘴單元</p>
        <p type="p">5:現場控制盤</p>
        <p type="p">6:現場操作單元</p>
        <p type="p">L1:訊號線</p>
        <p type="p">L2:環狀的配線</p>
        <p type="p">L3:環狀的配線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2543" publication-number="202617492">
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      <tif file="114148616.zip" no="1">
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      <volno>24</volno>
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      <publication-reference>
        <document-id>
          <doc-number>202617492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包覆物連接結構及載具</chinese-title>
        <english-title>COVER CONNECTION STRUCTURE AND CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B62B9/14</main-classification>
        <further-classification edition="200601120260126B">F16B21/09</further-classification>
        <further-classification edition="200601120260126B">F16B5/06</further-classification>
        <further-classification edition="200601120260126B">B62B9/10</further-classification>
        <further-classification edition="200601120260126B">B62B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳玉彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種包覆物連接結構及載具，載具包括車架、包覆物組件和包覆物連接結構。包覆物連接結構包括固定座和卡合件。固定座設置於車架上。卡合件設置於包覆物組件上。固定座與卡合件活動卡接，以使包覆物組件可拆卸地安裝於車架上。在上述包覆物連接結構中，車架上設置固定座，包覆物組件上設置卡合件，通過固定座和卡合件的活動卡接來實現包覆物組件在車架上的可拆卸安裝。包覆物連接結構的結構簡單，且方便拆卸和安裝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a cover connection structure and a carrier. The carrier includes a frame, a cover assembly, and the cover connection structure. The cover connection structure includes a fixing base and an engaging member. The fixing base is disposed on the frame. An engaging member is disposed on the cover assembly. The fixing base is movably engaged with the engaging member to allow the cover assembly to be detachably mounted onto the frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車架</p>
        <p type="p">110:車手件</p>
        <p type="p">150:腳踏板</p>
        <p type="p">160a:前腳支撐件</p>
        <p type="p">160b:後腳支撐件</p>
        <p type="p">170:前輪組件</p>
        <p type="p">180:後輪組件</p>
        <p type="p">200:包覆物組件</p>
        <p type="p">210:座部包覆部</p>
        <p type="p">220:背靠包覆部</p>
        <p type="p">230:第一包覆部</p>
        <p type="p">240:第二包覆部</p>
        <p type="p">410:座墊</p>
        <p type="p">420:背墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2544" publication-number="202618586">
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      <tif file="114148714.zip" no="1">
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      <volno>24</volno>
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          <doc-number>202618586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析系統校準系統及方法</chinese-title>
        <english-title>ASSAY SYSTEM CALIBRATION SYSTEMS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G06F17/11</main-classification>
        <further-classification edition="200601120260116B">G06F17/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商梅梭刻度技術公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MESO SCALE TECHNOLOGIES, LLC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬恩　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOERN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西格爾　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGAL, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於校準樣本分析之系統及方法。系統可包括用於進行校準及樣本分析之分析裝置及組件。系統可進一步包括經組態以用於接收校準資訊、判定校準模型及參數以及將校準參數應用至樣本資料之處理組件及儲存單元。系統可進一步包括用於在一網路化環境中操作之組件。方法可包括用於進行校準及樣本分析、判定校準模型及參數以及將校準參數應用至樣本資料之技術及過程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for calibrating sample assays are provided. Systems may include assay devices and components for carrying out calibration and sample assays. Systems may further include processing components and storage units configured for receiving calibration information, determining calibration models and parameters, and applying calibration parameters to sample data. Systems may further include components for operating in a networked environment. Methods may include techniques and processes for carrying out calibration and sample assays, determining calibration models and parameters, and applying calibration parameters to sample data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1600:過程</p>
        <p type="p">1602:操作</p>
        <p type="p">1604:操作</p>
        <p type="p">1606:操作</p>
        <p type="p">1608:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2545" publication-number="202618893">
    <tif-files tif-type="multi-tif">
      <tif file="114149112.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149112</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260117B">H01L21/203</main-classification>
        <further-classification edition="200601120260117B">H01L23/31</further-classification>
        <further-classification edition="200601120260117B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池翊粹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, IKSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓秀娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SOOYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將半導體基底分離為單獨的半導體裝置的方法，包括：提供具有正面和背面的半導體基底，其中半導體基底包括多個裝置區，所述多個裝置區通過分別的預定切割道互相分開；在所述半導體基底的所述正面上形成互連層；在所述預定切割道處蝕刻所述半導體基底的所述正面以形成分別的正面開口，所述正面開口具有第一深度，其中所述第一深度比所述半導體基底的厚度小；將半導體元件附接到每個裝置區中的所述半導體基底的所述正面上；以及在所述分別的預定切割道處蝕刻所述半導體基底的所述背面以形成分別的背面開口，所述背面開口具有第二深度，其中所述正面開口至少部分地與同一個切割道處的所述背面開口對齊以將所述半導體基底的多個裝置區分離為單獨的半導體裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for singulating a semiconductor substrate into individual semiconductor devices, comprising: providing a semiconductor substrate having a front surface and a back surface, wherein the semiconductor substrate comprises device regions that are separated from each other by respective predetermined saw streets; forming an interconnect layer on the front surface of the semiconductor substrate; etching the front surface of the semiconductor substrate at the predetermined saw streets to form respective frontside openings each having a first depth, wherein the first depth is smaller than a thickness of the semiconductor substrate; attaching a semiconductor element onto the front surface of the semiconductor substrate in each device region; and etching the back surface of the semiconductor substrate at the respective predetermined saw streets to form respective backside openings each having a second depth, wherein each frontside opening is at least partially aligned with the backside opening at the same saw street to singulate the device regions of the semiconductor substrate into individual semiconductor devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:半導體裝置</p>
        <p type="p">401:第一半導體元件</p>
        <p type="p">402a:第二半導體元件</p>
        <p type="p">402b:第三半導體元件</p>
        <p type="p">404:導電柱</p>
        <p type="p">405:基底</p>
        <p type="p">406:有源層</p>
        <p type="p">407:互連層</p>
        <p type="p">408:內部波導</p>
        <p type="p">411:輔助結構</p>
        <p type="p">412:黏合劑</p>
        <p type="p">413:外部波導</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2546" publication-number="202618428">
    <tif-files tif-type="multi-tif">
      <tif file="114149454.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>致動器裝置</chinese-title>
        <english-title>ACTUATOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260114B">G03B5/00</main-classification>
        <further-classification edition="202101120260114B">G03B13/36</further-classification>
        <further-classification edition="202101120260114B">G03B17/12</further-classification>
        <further-classification edition="200601120260114B">G02B27/40</further-classification>
        <further-classification edition="202301120260114B">H04N23/50</further-classification>
        <further-classification edition="202301120260114B">H04N23/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNG GUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李聖民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之第一實施例係關於一種致動器裝置，其包含：一外殼；一固持器，其安置於該外殼內部；一反射構件，其安置於該固持器上；一移動板，其安置於該外殼與該固持器之間；一剛性移動器，其耦接至該固持器；及一阻尼器，其耦接至該剛性移動器，其中該剛性移動器包含藉由該阻尼器耦接至該外殼之一突出部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first embodiment of the present invention relates to an actuator device comprising: a housing; a holder disposed inside the housing; a reflective member disposed on the holder; a moving plate disposed between the housing and the holder; a rigid mover coupled to the holder; and a damper coupled to the rigid mover, wherein the rigid mover comprises a protruding portion coupled to the housing by the damper.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1110:外殼</p>
        <p type="p">1112:第二部分</p>
        <p type="p">1118:突起</p>
        <p type="p">1119:凹槽</p>
        <p type="p">1210:固持器</p>
        <p type="p">1220:反射構件</p>
        <p type="p">1230:剛性移動器</p>
        <p type="p">1231:突出部分</p>
        <p type="p">1500:阻尼器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2547" publication-number="202617743">
    <tif-files tif-type="multi-tif">
      <tif file="114149561.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成圖案的方法</chinese-title>
        <english-title>METHOD OF FORMING PATTERNS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C07F7/22</main-classification>
        <further-classification edition="200601120260119B">G03F7/004</further-classification>
        <further-classification edition="200601120260119B">G03F7/16</further-classification>
        <further-classification edition="200601120260119B">G03F7/20</further-classification>
        <further-classification edition="200601120260119B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐也隱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YAEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金智敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旻映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜恩美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, EUNMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成太根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEONG, TAEGEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹昌秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, CHANGSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張水民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SUMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳釜根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, BUKEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李忠憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUNGHEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開一種形成圖案的方法，所述方法包括：在基板上塗覆含金屬的抗蝕劑組合物；進行包括乾燥和加熱的熱處理以在基板上形成含金屬的抗蝕劑層；使用經圖案化的遮罩對含金屬的抗蝕劑層進行曝光；以及進行包括塗覆顯影劑組合物以移除未曝光區的顯影從而形成抗蝕劑圖案，其中通過利用旋塗機以約100 rpm到約1,500 rpm的速度塗覆含金屬的抗蝕劑組合物達約60秒到約120秒來實行對含金屬的抗蝕劑組合物的塗覆，所述加熱在約90℃到約200℃的溫度下實行約30秒到約120秒，通過輻照極紫外光、波長為約5 nm到約50 nm的光、或所述極紫外光與所述光的組合來實行對含金屬的抗蝕劑層的曝光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of forming patterns including coating a metal-containing resist composition on a substrate; a heat treatment including drying and heating to form a metal-containing resist layer on the substrate; exposing a metal-containing resist layer using a patterned mask; and developing including coating a developer composition to remove unexposed regions to form a resist pattern, wherein the coating the metal-containing resist composition is performed by coating the metal-containing resist composition with a spin coater at a speed of about 100 to about 1,500 rpm for about 60 to about 120 seconds, the heating is performed at a temperature of about 90 to about 200° C for about 30 to about 120 seconds, the exposing the metal-containing resist layer is performed by irradiating extreme ultraviolet light, light having a wavelength of about 5 nm to about 50 nm, or a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板/半導體基板</p>
        <p type="p">108:光阻圖案</p>
        <p type="p">112:有機層圖案</p>
        <p type="p">114:薄膜圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2548" publication-number="202617297">
    <tif-files tif-type="multi-tif">
      <tif file="114149713.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電磁鋼板的鱗皮除去設備、電磁鋼板的製造設備、電磁鋼板的鱗皮除去方法、以及電磁鋼板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260117B">B21B45/06</main-classification>
        <further-classification edition="200601120260117B">B24C1/00</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>田中孝明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>大久保智幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUBO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
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              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
            </addressbook>
          </agent>
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                <last-name>劉亞君</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的鱗皮除去設備是將所搬送的鋼板的鱗皮除去的鋼板的鱗皮除去設備，其中，在鋼板的搬送方向上自上游側起依次配置有使用第一酸液對鋼板實施第一酸洗的第一酸洗裝置、機械性地破壞鱗皮的破壞裝置、以及使用第二酸液對鋼板實施第二酸洗的第二酸洗裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鋼帶</p>
        <p type="p">2:開卷機</p>
        <p type="p">3:焊接機</p>
        <p type="p">4:第一酸洗裝置</p>
        <p type="p">5:破壞裝置</p>
        <p type="p">6:第二酸洗裝置</p>
        <p type="p">7:張力捲取機</p>
        <p type="p">10:鱗皮除去設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2549" publication-number="202617781">
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        <document-id>
          <doc-number>114150211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＮＥＣＴＩＮ－４抗體及抗體藥物結合物</chinese-title>
        <english-title>NECTIN-4 ANTIBODIES AND ANTIBODY-DRUG CONJUGATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K16/28</main-classification>
        <further-classification edition="201701120260202B">A61K47/68</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
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              <chinese-name name-type="organization">
                <last-name>波伊爾　傑佛瑞　史翠曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYLES, JEFFREY STREETMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>德里斯蔻　凱拉　伊莉莎白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRISCOLL, KYLA ELIZABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜拉梅德　歐馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DURAMAD, OMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　乾旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, QIANXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍姆加德　瑞克　百克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLMGAARD, RIKKE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林奎斯特　凱文　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDQUIST, KEVIN CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　約書亞　英施克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOSHUA INSHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <inventor app-type="applicant" sequence="8">
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              <chinese-name name-type="organization">
                <last-name>莎格　狄維亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAGAR, DIVYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里尼瓦桑　摩漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVASAN, MOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦迪若　佩卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERDINO, PETRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周潔宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JIEYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供nectin-4抗體藥物結合物及其醫藥組合物，以及供治療癌症之使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides nectin-4 antibody drug conjugates and pharmaceutical compositions thereof, and methods of using for the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2550" publication-number="202618386">
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      <tif file="114150333.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G02B13/00</main-classification>
        <further-classification edition="200601120260121B">G02B9/60</further-classification>
        <further-classification edition="200601120260121B">G02B3/00</further-classification>
        <further-classification edition="200601120260121B">G02B13/02</further-classification>
        <further-classification edition="200601120260121B">G02B13/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康永錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, YOUNG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統，包括沿著光學成像系統的光軸自光學成像系統的物側朝向光學成像系統的成像平面以遞增數值次序依序安置的第一透鏡至第四透鏡。第一透鏡具有正折射能力，且其物側表面為凸面以及像側表面為凸面。第二透鏡具有負折射能力。第三透鏡具有正折射能力。第四透鏡具有折射能力，且其物側表面為凸面以及像側表面為凹面，其中滿足0.8≤TTL/f≤0.95以及0.4＜BFL/f＜0.7，其中TTL為沿著光軸自第一透鏡的物側表面至成像平面的距離，f為光學成像系統的總焦距，且BFL為沿著光軸自第四透鏡的像側表面至成像平面的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, and a fourth lens sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system. The first lens having positive refractive power, a convex object-side surface and a convex image-side surface. The second lens having negative refractive power. The third lens having positive refractive power. The fourth lens having refractive power, a convex object-side surface and a concave image-side surface, wherein 0.8≤TTL/f≤0.95 and 0.4＜BFL/f＜0.7 are satisfied, where TTL is a distance along the optical axis from the object-side surface of the first lens to the imaging plane, f is an overall focal length of the optical imaging system, and BFL is a distance along the optical axis from the image-side surface of the fourth lens to the imaging plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:濾光片</p>
        <p type="p">170:影像感測器</p>
        <p type="p">R:反射構件</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2551" publication-number="202618381">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統及攜帶型終端機</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM AND PORTABLE TERMINAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G02B11/34</main-classification>
        <further-classification edition="200601120260121B">G02B9/12</further-classification>
        <further-classification edition="202101120260121B">G02B7/04</further-classification>
        <further-classification edition="200601120260121B">G02B13/18</further-classification>
        <further-classification edition="200601120260121B">G02B13/00</further-classification>
        <further-classification edition="200601120260121B">G02B9/64</further-classification>
        <further-classification edition="200601120260121B">G02B15/14</further-classification>
        <further-classification edition="200601120260121B">G02B27/00</further-classification>
        <further-classification edition="202101120260121B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭弼鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, PHIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學成像系統，包含自物側依序配置的第一透鏡群組、第二透鏡群組以及第三透鏡群組，其中第一透鏡群組包含具有負折射能力及正折射能力的兩個透鏡，第二透鏡群組包含多個透鏡，且第三透鏡群組包含具有負折射能力及正折射能力的兩個透鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens group, a second lens group, and a third lens group, sequentially arranged from an object side, wherein the first lens group includestwo lenses having negative and positive refractive power,the second lens group includes a plurality of lenses, and the third lens group includes two lenses having negative and positive refractive power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">G1:第一透鏡群組</p>
        <p type="p">G2:第二透鏡群組</p>
        <p type="p">G3:第三透鏡群組</p>
        <p type="p">IF:濾光片</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">P:稜鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2552" publication-number="202618390">
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      <isuno>9</isuno>
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        <document-id>
          <doc-number>202618390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G02B15/14</main-classification>
        <further-classification edition="200601120260115B">G02B13/18</further-classification>
        <further-classification edition="200601120260115B">G02B11/06</further-classification>
        <further-classification edition="200601120260115B">G02B9/12</further-classification>
        <further-classification edition="202101120260115B">G02B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翰琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAN LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學成像系統，包括：第一透鏡，具有正屈光率；第二透鏡，具有負屈光率；第三透鏡，具有正屈光率，其中所述第一透鏡至所述第三透鏡從物側起依序排列，其中所述光學成像系統滿足以下條件：1.25＜f1＜1.35、-8.5＜f2＜-3.2且1.8＜f3＜2.7，其中f1為所述第一透鏡的焦距、f2為所述第二透鏡的焦距、f3為所述第三透鏡的焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optical imaging system including: a first lens having a positive refractive power; a second lens having a negative refractive power; and a third lens having a positive refractive power, wherein the first lens through third lens are arranged in order from the object side. The optical imaging system satisfies the following conditions: 1.25 ＜ f1 ＜ 1.35, -8.5 ＜ f2 ＜ -3.2, and 1.8 ＜ f3 ＜ 2.7, where f1 is the focal length of the first lens, f2 is the focal length of the second lens, and f3 is the focal length of the third lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學成像系統</p>
        <p type="p">100、130:光闌</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">111、121、141、151:物側表面</p>
        <p type="p">112、122、142、152:像側表面</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">140:第三透鏡</p>
        <p type="p">150:紅外截止濾光器</p>
        <p type="p">160:成像平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2553" publication-number="202618472">
    <tif-files tif-type="multi-tif">
      <tif file="114150427.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>匣盒及影像形成裝置</chinese-title>
        <english-title>CARTRIDGE AND IMAGE FORMING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">G03G21/18</main-classification>
        <further-classification edition="200601120260125B">G03G21/16</further-classification>
        <further-classification edition="200601120260125B">F16D1/10</further-classification>
        <further-classification edition="200601120260125B">G03G15/08</further-classification>
        <further-classification edition="200601120260125B">F16D1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMARU, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上竜太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIKAWA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原明裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平山明延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAYAMA, AKINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKIGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納庄宏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOSHO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野拓郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, TAKURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾崎剛史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, GOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河井太刀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, TACHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">匣盒具有感光鼓、和為了控制驅動傳達構材的傾斜角度而可相對於前述感光鼓移動的可動構材。可動構材可移動至供於使相對於感光鼓之驅動傳達構材的傾斜角度減小用的第1位置、和從第1位置退避的第2位置。藉此，可圓滑進行驅動連結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:桿體構材</p>
        <p type="p">12a:按壓部</p>
        <p type="p">64:耦接構材</p>
        <p type="p">71e:按壓部</p>
        <p type="p">73d,73f:定位部</p>
        <p type="p">82:接點構材</p>
        <p type="p">82a:接觸面</p>
        <p type="p">83:接點構材</p>
        <p type="p">83a:接觸面</p>
        <p type="p">B:匣盒</p>
        <p type="p">K:箭頭</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2554" publication-number="202618432">
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影機、投影機顯示系統、擴增實境或虛擬實境裝置、及產生影像之圖框之方法</chinese-title>
        <english-title>PROJECTOR, PROJECTOR DISPLAY SYSTEM, AUGMENTED REALITY OR VIRTUAL REALITY DEVICE, AND METHOD OF GENERATING FRAME OF IMAGE</english-title>
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      <classification-ipc>
        <main-classification edition="200601120260117B">G03B21/14</main-classification>
        <further-classification edition="200601120260117B">G02B26/00</further-classification>
        <further-classification edition="200601120260117B">G02B27/18</further-classification>
        <further-classification edition="200601120260117B">F21V8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商思娜公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNAP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍茲　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOODS, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭內爾　布倫南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENNELL, BRENNON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於產生一影像之一圖框之投影機。該投影機可用於一擴增實境或虛擬實境裝置中。該投影機包括：一元件陣列，其配置於一平面中，各元件包括具有不同各自色彩之至少三個LED；及一集光器結構陣列，各集光器結構經組態以在任何一個時間接收來自一單一LED的光且減小該LED發射光之角度。該投影機進一步包括一投影機單元，該投影機單元經組態以接收來自該集光器結構陣列的該光且準直該光使得一圖框經形成。該圖框係全色的且由組合複數個子圖框形成，該等子圖框透過該元件陣列相對於該集光器結構陣列之一空間移動，使得各集光器結構在各子圖框期間接收來自一不同LED的光，及/或自各LED發射之該光之一位移使得來自各LED之該光照明該圖框之多個像素形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is directed to a projector for generating a frame of an image. The projector may be for use in an augmented reality or virtual reality device. The projector comprises an array of elements arranged in a plane, each element comprising at least three LEDs which have different respective colours, and an array of collector structures, each collector structure configured to receive light from a single LED at any one time and reduce the angle over which the LED emits light. The projector further comprises a projector unit configured to receive the light from the array of collector structures and collimate the light such that a frame is formed. The frame is full colour and formed from combining a plurality of subframes, the subframes formed through a spatial movement of the array of elements with respect to the array of collector structures such that each collector structure receives light from a different LED during each subframe, and/or a displacement of the light emitted from each LED such that the light from each LED illuminates multiple pixels of the frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:陣列/LED面板</p>
        <p type="p">2a:綠色LED</p>
        <p type="p">2b:紅色LED</p>
        <p type="p">2c:藍色LED</p>
        <p type="p">6:集光器陣列/集光器</p>
        <p type="p">10:元件/虛線正方形</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2555" publication-number="202618469">
    <tif-files tif-type="multi-tif">
      <tif file="114150557.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測量裝置、標記位置測量方法、基板處理系統、及曝光方法</chinese-title>
        <english-title>MEASUREMENT DEVICE, MARK POSITION MEASUREMENT METHOD, SUBSTRATE PROCESSING SYSTEM AND EXPOSURE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G03F9/00</main-classification>
        <further-classification edition="200601120260126B">G01B21/30</further-classification>
        <further-classification edition="200601120260126B">H01L21/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一之瀬剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHINOSE, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎祐一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAZAKI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於微元件生產線之測量系統（500）具備：分別進行針對基板之測量處理之複數個測量裝置（100&lt;sub&gt;1&lt;/sub&gt;～100&lt;sub&gt;3&lt;/sub&gt;）、及可控制複數個測量裝置之控制裝置（530），上述複數個測量裝置（100&lt;sub&gt;1&lt;/sub&gt;～100&lt;sub&gt;3&lt;/sub&gt;）包含至少1個獲取基板上所形成之複數個標記之位置資訊之第1測量裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">100&lt;sub&gt;1&lt;/sub&gt;:測量裝置</p>
        <p type="p">100&lt;sub&gt;2&lt;/sub&gt;:測量裝置</p>
        <p type="p">100&lt;sub&gt;3&lt;/sub&gt;:測量裝置</p>
        <p type="p">200:曝光裝置</p>
        <p type="p">300:C/D</p>
        <p type="p">500:測量系統</p>
        <p type="p">1000:基板處理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2556" publication-number="202618990">
    <tif-files tif-type="multi-tif">
      <tif file="114150561.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板固持器及用於固定及接合基板之方法</chinese-title>
        <english-title>SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01L21/67</main-classification>
        <further-classification edition="200601120260119B">H01L21/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EV GROUP E. THALLNER GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉格　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLACH, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於安裝一基板(13)之基板固持器(1、1‘、1‘‘、1‘‘‘、1‘‘‘‘、1‘‘‘‘‘)及一種對應方法，該基板固持器(1、1‘、1‘‘、1‘‘‘、1‘‘‘‘、1‘‘‘‘‘)包括用於固定該基板(13)之固定元件(6、6‘、6‘‘)，其中該等固定元件(6、6‘、6‘‘)可分組成區域(7、7‘)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a substrate holder (1,1‘,1‘‘,1‘‘‘,1‘‘‘‘,1‘‘‘‘‘) for mounting a substrate (13), comprising fixing elements (6,6‘,6‘‘) for fixing the substrate (13), wherein the fixing elements (6,6‘,6‘‘) can be grouped into zones (7, 7‘), and a corresponding method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板固持器</p>
        <p type="p">2:基體</p>
        <p type="p">3:緊固件</p>
        <p type="p">4:切口</p>
        <p type="p">5:變形元件</p>
        <p type="p">6:固定元件</p>
        <p type="p">6‘:固定元件</p>
        <p type="p">7:區域</p>
        <p type="p">7‘:區域</p>
        <p type="p">8:感測器</p>
        <p type="p">11:凹入部</p>
        <p type="p">12:流體開口/流體出口，特定言之鑽孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2557" publication-number="202618096">
    <tif-files tif-type="multi-tif">
      <tif file="114150638.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水龍頭裝置</chinese-title>
        <english-title>FAUCET APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">E03C1/042</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島高志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田秀和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋良和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口夏樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案發明之水龍頭裝置中，有效地抑制「沿著軟管（6）之水進入至出水管（3）之基端側」的情況。水龍頭裝置具備：流出管（4），包含朝斜上方延伸的出水管（3）；支座（5），安裝於出水管（3）內；軟管（6），以可移動方式插入穿通於支座（5）；及出水頭（7），連接於軟管（6）。出水管（3）具有朝下方開放的排水孔（31）。支座（5）包含止水壁（58）。止水壁（58）中的朝向前端側之端面（585）包含「將沿著軟管（6）之水引導向排水孔（31）的引導面（587）」。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:支撐管</p>
        <p type="p">3:出水管</p>
        <p type="p">31:排水孔</p>
        <p type="p">32:輔助排水孔</p>
        <p type="p">34,35:壁部</p>
        <p type="p">4:流出管</p>
        <p type="p">5:支座</p>
        <p type="p">54:溝槽</p>
        <p type="p">551:肋條(第一肋條)</p>
        <p type="p">552:肋條(第二肋條)</p>
        <p type="p">553:肋條(第三肋條)</p>
        <p type="p">555:端面</p>
        <p type="p">557:引導面</p>
        <p type="p">56:開口部</p>
        <p type="p">561:端緣</p>
        <p type="p">57:鉤扣</p>
        <p type="p">571:支撐片</p>
        <p type="p">572:卡止片</p>
        <p type="p">58:止水壁</p>
        <p type="p">585:端面</p>
        <p type="p">587:引導面</p>
        <p type="p">59:輔助開口部</p>
        <p type="p">6:軟管</p>
        <p type="p">8:密封構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2558" publication-number="202619005">
    <tif-files tif-type="multi-tif">
      <tif file="114150667.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微小構造體移載用模板零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">H01L21/677</main-classification>
        <further-classification edition="200601120260116B">H01L25/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川秀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川敬典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小材利之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAI, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種微小構造體移載用模板零件，其特徵在於：在基板上形成有聚矽氧系橡膠膜，與前述基板為相反側之前述聚矽氧系橡膠膜表面具有一個以上的封閉凹部，該封閉凹部在表面開口部以外封閉。藉此，能夠提供一種微小構造體移載用模板零件，其能夠在短時間內將聚矽氧系橡膠膜模板表面的暫時黏接力最佳化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:聚矽氧系橡膠膜</p>
        <p type="p">2a:表面</p>
        <p type="p">3:封閉凹部</p>
        <p type="p">3a:表面開口部</p>
        <p type="p">100:微小構造體移載用模板零件</p>
        <p type="p">P-Q:剖面線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2559" publication-number="202617093">
    <tif-files tif-type="multi-tif">
      <tif file="114150849.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150849</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超聲波圖像處理裝置、圖像處理方法、系統及程式</chinese-title>
        <english-title>ULTRASONIC IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD THEREOF, SYSTEM AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">A61B8/08</main-classification>
        <further-classification edition="200601120260126B">A61N7/00</further-classification>
        <further-classification edition="201701120260126B">G06T7/11</further-classification>
        <further-classification edition="200601120260126B">G06T5/10</further-classification>
        <further-classification edition="201701120260126B">G06T7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商格迪優斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODIUS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成始容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEONG, SI YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賢淑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUN SOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃泰賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, TAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜棟丸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DONG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴賢燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYUN SUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種超聲波圖像處理裝置、圖像處理方法、系統及程式。本公開的超聲波圖像處理裝置，其特徵可在於，包括：通信部，與超聲波照射裝置、超聲波拍攝裝置以及顯示裝置執行通信；以及處理器，控制與超聲波圖像處理相關的操作，其中，所述處理器通過所述通信部從所述超聲波拍攝裝置接收超聲波圖像，並且從與所述超聲波照射裝置的超聲波照射信號相關聯的所述超聲波拍攝裝置的超聲波圖像提取關於感興趣區域（ROI）的照射部位圖像，並且基於所述照射部位圖像內所述超聲波照射信號的變化量，在所述超聲波照射裝置的超聲波聚焦狀態的情況下，校正所述照射部位圖像，並且控制所述顯示裝置以通過所述顯示裝置來顯示所述校正後的照射部位圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultrasonic image processing device, image processing method, system and program are disclosed. The ultrasonic image processing device includes a communication unit that communicates with an ultrasonic irradiation device, an ultrasonic photographing device, and a display device; and a processor that controls operations related to ultrasonic image processing. The processor receives an ultrasonic image from the ultrasonic imaging device through the communication unit, and extracts an irradiation portion image regarding a region of interest (ROI) from the ultrasonic image of the ultrasonic imaging device associated with an ultrasonic irradiation signal of the ultrasonic irradiation device. Based on the amount of change of the ultrasonic irradiation signal in the irradiation portion image, in the case of an ultrasonic focusing state of the ultrasonic irradiation device, the irradiation portion image is corrected, and the display device is controlled to display the corrected irradiation site image through the display device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:系統</p>
        <p type="p">100:超聲波圖像處理裝置</p>
        <p type="p">10:超聲波照射裝置</p>
        <p type="p">20:超聲波拍攝裝置</p>
        <p type="p">30:顯示裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2560" publication-number="202619184">
    <tif-files tif-type="multi-tif">
      <tif file="114150864.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙面電連接器</chinese-title>
        <english-title>DOUBLE-SIDED ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01R13/514</main-classification>
        <further-classification edition="201101120260113B">H01R12/71</further-classification>
        <further-classification edition="200601120260113B">H01R13/639</further-classification>
        <further-classification edition="200601120260113B">H01R13/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>捷利知產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIWI INTELLECTUAL ASSETS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡周賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHOU HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明系提供一種雙面電連接器，其適於正反雙面電連接一對接電連接器，其包括有：一對接構造，該對接構造設有一連接板，該連接板設有上下二板面，該上下二板面各設有一連接介面，該上下二板面之二連接介面各設有一排接點，該二排接點形成在二排端子；及其特徵在於，設有一定位構造，該定位構造整體為金屬材質，該定位構造之二側各設有一定位凹部，該定位構造之二定位凹部設於該連接板之左右二側邊且位於該上下二板面之間，該定位構造可與該對接電連接器相互卡定；及該二排接點係分別平貼於該上下二板面，且該上下二板面之二後段較該二排接點凸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a double-sided electrical connector, which is suitable for electrically connecting a docking electrical connector on both sides. The docking structure includes: a docking structure, the docking structure is provided with a connecting plate, the connecting plate is provided with an upper and lower plate surfaces, the upper and lower plate surfaces are each provided with a connecting interface, the two connection interfaces of the upper and lower plate surfaces are each provided with a row of contacts, and the two rows of contacts are formed in two rows of terminals; and it is characterized in that a positioning structure is provided, the positioning structure is made of metal as a whole, and a positioning recess is provided on each side of the positioning structure, the two positioning recesses of the positioning structure are provided on the left and right sides of the connecting plate and are located between the upper and lower plate surfaces, and the positioning structure can be mutually locked with the docking electrical connector; and the two rows of contacts are respectively flat on the upper and lower plate surfaces, and the two rear sections of the upper and lower plate surfaces are more protruding than the two rows of contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:外覆體</p>
        <p type="p">50:限位構造</p>
        <p type="p">55:連接板</p>
        <p type="p">60:第一端子</p>
        <p type="p">62:第一接點</p>
        <p type="p">46:蕭基二極體</p>
        <p type="p">59:補強板</p>
        <p type="p">551:高面</p>
        <p type="p">552:低面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2561" publication-number="202618709">
    <tif-files tif-type="multi-tif">
      <tif file="114150887.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去識別化攝像裝置及應用其之監視方法</chinese-title>
        <english-title>DE-IDENTIFICATION IMAGING DEVICE AND SURVEILLANCE METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260121B">G06V20/52</main-classification>
        <further-classification edition="202201120260121B">G06V10/82</further-classification>
        <further-classification edition="202201120260121B">G06V40/10</further-classification>
        <further-classification edition="201701120260121B">G06T7/00</further-classification>
        <further-classification edition="200601120260121B">G02B1/00</further-classification>
        <further-classification edition="200601120260121B">G02B5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉善豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種去識別化攝像裝置適於監視方法。攝像裝置包含鏡頭模組、影像擷取元件及處理器。鏡頭模組包含超透鏡並具有光軸及成像位置。影像擷取元件對應光軸並位於成像位置，影像擷取元件用以轉換通過超透鏡並照射於影像擷取元件之光線為原始影像。處理器用以依據原始影像而獲得並輸出骨架資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A de-identification imaging device is adapted to a surveillance method. The device includes a camera module, an imaging capturing element and a processor. The camera module includes a meta lens and has an optical axis and an imaging position. The image capturing element corresponds to the optical axis and is located at the imaging position. The image capturing element is configured to convert the light passing through the meta lens and projected onto the image capturing element into an original image. The processor is configured to obtain and output, according to the original image, a skeleton information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鏡頭模組</p>
        <p type="p">12:超透鏡</p>
        <p type="p">20:影像擷取元件</p>
        <p type="p">30:第一處理器</p>
        <p type="p">40:儲存裝置</p>
        <p type="p">50:第二處理器</p>
        <p type="p">60:介面裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2562" publication-number="202617824">
    <tif-files tif-type="multi-tif">
      <tif file="114150950.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環氧樹脂用硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08G59/50</main-classification>
        <further-classification edition="201801120260126B">C08K3/013</further-classification>
        <further-classification edition="200601120260126B">C08K5/18</further-classification>
        <further-classification edition="200601120260126B">C08K5/22</further-classification>
        <further-classification edition="200601120260126B">C08L63/00</further-classification>
        <further-classification edition="200601120260126B">C09J11/04</further-classification>
        <further-classification edition="200601120260126B">C09J11/06</further-classification>
        <further-classification edition="200601120260126B">C09J163/00</further-classification>
        <further-classification edition="200601120260126B">C09K3/10</further-classification>
        <further-classification edition="200601120260126B">H01L23/29</further-classification>
        <further-classification edition="200601120260126B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村直弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMURA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本凌輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之環氧樹脂用硬化劑包含：芳香族胺化合物，其係以式(1)、式(2)或式(3)表示；及芳香族胺加成物，其係芳香族胺化合物(A-1)與具有可與芳香族胺化合物反應之官能基之反應性化合物的反應產物。式(1)中之R&lt;sub&gt;α&lt;/sub&gt;及R&lt;sub&gt;β&lt;/sub&gt;&lt;sub&gt;2&lt;/sub&gt;、式(2)中之R&lt;sub&gt;γ&lt;/sub&gt;及R&lt;sub&gt;δ&lt;/sub&gt;、式(3)中之R&lt;sub&gt;ε&lt;/sub&gt;分別獨立地表示碳數1～20之一價有機基或鹵素，a及b分別獨立為0～4之整數，X表示具有1個以上芳香環之二價有機基或者-O-、-CO-、-C(=O)O-、-SO&lt;sub&gt;2&lt;/sub&gt;-、或-C(=O)NH-。c及d分別獨立為1～4之整數，Y表示二價有機基或單鍵。e為1～4之整數。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="421px" width="474px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2563" publication-number="202618197">
    <tif-files tif-type="multi-tif">
      <tif file="114150960.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱導管一體式液冷散熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">F28D15/00</main-classification>
        <further-classification edition="200601120260108B">F28F3/12</further-classification>
        <further-classification edition="200601120260108B">F28F3/02</further-classification>
        <further-classification edition="200601120260108B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡建全</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種熱導管一體式液冷散熱器， 其包括一液冷排、一液泵、一液冷頭及多數熱導管。液冷排具有兩液盒，及連通在兩液盒之間的第一散熱排管組與第二散熱排管組，用於對冷卻液進行散熱。液泵設置在液冷排中，用於驅使冷卻液在液冷排中循環流動。液冷頭位於液冷排其中一第二液盒的下方，液冷頭底面或側面設有延伸到兩邊的多道熱導管嵌槽。多數熱導管為金屬管，其兩端分別連接在第二液盒，其吸熱段分別嵌設在熱導管嵌槽中，熱導管的吸熱段並加工出一熱源接觸面。藉此，本發明能使冷卻液循環流動時流進熱導管，利用熱導管提升冷卻效率，同時改善習知技術冷卻及散熱效率的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液冷排</p>
        <p type="p">11:第一液盒</p>
        <p type="p">12:第二液盒</p>
        <p type="p">111、121:盒體</p>
        <p type="p">112、122:盒蓋</p>
        <p type="p">126:下盒壁</p>
        <p type="p">127:流通孔</p>
        <p type="p">13:散熱排管組</p>
        <p type="p">131:第一散熱排管組</p>
        <p type="p">132:第二散熱排管組</p>
        <p type="p">133:散熱管</p>
        <p type="p">134:散熱鰭片</p>
        <p type="p">30:液冷頭</p>
        <p type="p">31:熱導管嵌槽</p>
        <p type="p">40:熱導管</p>
        <p type="p">41:吸熱段</p>
        <p type="p">42:熱源接觸面</p>
        <p type="p">43:擋止凸環</p>
        <p type="p">44:插接段</p>
        <p type="p">F1:平面</p>
        <p type="p">A1:微突弧面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2564" publication-number="202618879">
    <tif-files tif-type="multi-tif">
      <tif file="114150967.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150967</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有減少的界面應變的氮化矽膜</chinese-title>
        <english-title>SILICON NITRIDE FILMS HAVING REDUCED INTERFACIAL STRAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01L21/02</main-classification>
        <further-classification edition="200601120260127B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商匹西量子公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSIQUANTUM, CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾尼丘克　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELNICHUK, ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些實施例中，方法包括將第一氮化矽層沉積在半導體晶圓的頂表面上，以及在第一氮化矽層中形成一個或更多個第一間隙。一個或更多個第一間隙能緩解在第一氮化矽層中所形成的應力。將第一填充材料沉積在第一氮化矽層上，並將第一氮化矽層平坦化。將第二氮化矽層橫跨第一氮化矽層沉積，以及在第二氮化矽層中形成一個或更多個第二間隙。一個或更多個第二間隙能緩解在第二氮化矽層中所形成的應力。將第二填充材料橫跨第二氮化矽層沉積，並將第二氮化矽層平坦化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments a method comprises depositing a first silicon nitride layer on a top surface of a semiconductor wafer and forming one or more first gaps in the first silicon nitride layer. The one or more first gaps can relieve stress formed in the first silicon nitride layer. A first fill material is deposited on the first silicon nitride layer and the first silicon nitride layer is planarized. A second silicon nitride layer is deposited across the first silicon nitride layer and one or more second gaps are formed in the second silicon nitride layer. The one or more second gaps can relieve stress formed in the second silicon nitride layer. A second fill material is deposited across the second silicon nitride layer and the second silicon nitride layer is planarized.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">205,210,215,220,225,235:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2565" publication-number="202619006">
    <tif-files tif-type="multi-tif">
      <tif file="114150992.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01L21/677</main-classification>
        <further-classification edition="200601120260119B">H01L21/673</further-classification>
        <further-classification edition="200601120260119B">H01L21/687</further-classification>
        <further-classification edition="200601120260119B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊剛史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土山正志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYAMA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯田成昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIDA, NARUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎木田卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOKIDA, SUGURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井手康盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDE, KOUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板處理裝置及基板處理方法，使基板處理裝置的處理量增高，並抑制專用地板面積。  &lt;br/&gt;本發明構成具備如下元件之裝置：載具區塊，具備包含基板搬出入用之載具載置部的複數載具載置部；處理區塊，相對於載具區塊設置於左右的一方；第1載具載置部與第2載具載置部，各自為載具載置部，且俯視下沿著前後方向並排設置，至少一方為基板搬出入用之載具載置部；複數基板載置部，設置成相對於形成在俯視下位於第1載具載置部與該第2載具載置部之間的基板之搬運區域，於左右的一方沿著縱向排列；第1基板搬運機構，設置於該搬運區域；以及第2基板搬運機構，在第1基板載置部、與包含於複數基板載置部且用於對處理區塊傳遞基板的第2基板載置部之間，傳遞基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to increase throughput in a substrate processing device while suppressing the occupied floor space. &lt;br/&gt;A device of the invention comprises a carrier block incorporating a plurality of carrier loading sections which include a carrier loading section for transporting substrates in and out, a processing block provided on either the left or right of the carrier block, a first carrier loading section and a second carrier loading section which each serve as a carrier loading section, are aligned front to back when viewed in plan view, and at least one of which is the carrier loading section for transporting substrates in and out, a plurality of substrate loading sections which are provided on either the left or right of the substrate transport region formed between the first carrier loading section and the second carrier loading section in plan view and are arranged vertically, a first substrate transport mechanism which is provided in the transport region, and a second substrate transport mechanism which delivers substrates between the first substrate loading section and the second substrate loading section which is included within the plurality of substrate loading sections and delivers substrates to the processing block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:外部傳遞用平台</p>
        <p type="p">12:移動平台</p>
        <p type="p">13:退避用平台</p>
        <p type="p">14:殼體</p>
        <p type="p">15:棚架</p>
        <p type="p">16:突壁部</p>
        <p type="p">22:門片</p>
        <p type="p">23:支持部</p>
        <p type="p">24:棚架</p>
        <p type="p">25:底台</p>
        <p type="p">C:載具</p>
        <p type="p">D1:載具區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2566" publication-number="202617201">
    <tif-files tif-type="multi-tif">
      <tif file="114150993.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動注射器</chinese-title>
        <english-title>AUTO-INJECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260117B">A61M5/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾畢格　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALBIG, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛蓋斯　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRYGUS, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍格利　崔維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANGLEY, TREVOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜蒙特　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUMONT, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博蓋斯　巴特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURGESS, BART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑斯里　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUSLEY, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯楊恩　羅斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENYON, ROSS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動注射器可包括：容器，能夠包含藥物；滑梭，耦接至容器，並在具有第一狀態及第二狀態的水平路徑上；能量源，建構為釋放能量以平移容器及平移滑梭，能量源較佳係來自罐體之加壓流體；阻障部，於啟動自動注射器之前防止滑梭的水平運動；及針頭，具有第一端部及第二端部，第一端部建構為伸出自動注射器，第二端部建構為伸人容器，其中針頭之第二端部及容器在啟動自動注射器之前未彼此流體連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An auto-injector may include a container capable of comprising a medicament; a shuttle coupled to the container and on a horizontal path with a first state and a second state; an energy source configured to release energy to translate the container and to translate the shuttle, preferably the energy source is pressurized fluid from a can; an impediment preventing horizontal movement of the shuttle before activation of the auto-injector; and a needle having a first end configured to extend out of the auto-injector, and a second end configured to extend into the container, wherein the second end of the needle and the container are not in fluid communication with one another before activation of the auto-injector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:縱向軸線</p>
        <p type="p">12:側向軸線</p>
        <p type="p">14:橫向軸線</p>
        <p type="p">100:自動注射器</p>
        <p type="p">110:底蓋</p>
        <p type="p">120:第一端部</p>
        <p type="p">130:第二端部</p>
        <p type="p">140:剝離凸片</p>
        <p type="p">142:第一端部</p>
        <p type="p">144:第二端部</p>
        <p type="p">146:凸片</p>
        <p type="p">148:扣子</p>
        <p type="p">200:針頭機構</p>
        <p type="p">210:載具</p>
        <p type="p">214:凸部</p>
        <p type="p">216:第二凸緣</p>
        <p type="p">230:罐體致動器</p>
        <p type="p">232:凸片</p>
        <p type="p">234A:第一支腳</p>
        <p type="p">250:按鈕</p>
        <p type="p">251:本體</p>
        <p type="p">256:第一支腳</p>
        <p type="p">260:滑梭致動器</p>
        <p type="p">261:突起部</p>
        <p type="p">262:第一端部</p>
        <p type="p">263:緊固機構</p>
        <p type="p">266B:第二平台</p>
        <p type="p">267:止動部</p>
        <p type="p">268A:第一軌道</p>
        <p type="p">268B:第二軌道</p>
        <p type="p">270:指示器滑塊</p>
        <p type="p">272:支腳</p>
        <p type="p">274:本體</p>
        <p type="p">280:流體導管</p>
        <p type="p">290:針頭固持件或無菌連接器</p>
        <p type="p">292:本體</p>
        <p type="p">294:座部</p>
        <p type="p">296:開口</p>
        <p type="p">300:閥門組件</p>
        <p type="p">310:低壓本體部分</p>
        <p type="p">330:高壓本體部分</p>
        <p type="p">350:流體源</p>
        <p type="p">370:容器</p>
        <p type="p">378:活塞</p>
        <p type="p">380:塞子</p>
        <p type="p">382:隔膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2567" publication-number="202618861">
    <tif-files tif-type="multi-tif">
      <tif file="114151112.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151112</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有聚焦環調整組件的電漿處理設備</chinese-title>
        <english-title>PLASMA PROCESSING APPARATUS HAVING A FOCUS RING ADJUSTMENT ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/32</main-classification>
        <further-classification edition="200601120260112B">H01L21/3065</further-classification>
        <further-classification edition="200601120260112B">H01L21/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商得昇科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATTSON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京屹唐半導體科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祖克　馬汀Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUCKER, MARTIN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷賓斯　彼得Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMBESIS, PETER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特維斯　泰德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEVIS, TED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕庫斯基　雷恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAKULSKI, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　紹銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, SHAWMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　麥克Ｘ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MICHAEL X.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪瑀心</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電漿處理設備。電漿處理設備包含界定有垂直方向及橫向方向的處理室。電漿處理設備包含設置在處理室內的基座。基座經配置以支承基板。電漿處理設備包含設置在基座內的射頻(RF)偏壓電極。RF偏壓電極界定在RF偏壓電極第一端及RF偏壓電極第二端之間延伸的RF區。電漿處理設備包含設置在處理室內的聚焦環。電漿處理設備更包含聚焦環調整組件。聚焦環調整組件包括位在RF區外部的升降銷。升降銷可在垂直方向上移動以調整垂直方向上基座及聚焦環之間的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plasma processing apparatus is provided. The plasma processing apparatus includes a processing chamber defining a vertical direction and a lateral direction. The plasma processing apparatus includes a pedestal disposed within the processing chamber. The pedestal is configured to support the substrate. The plasma processing apparatus includes a radio frequency (RF) disposed within the processing chamber. The RF bias electrode defines a RF zone extending between a first end of the RF bias electrode and a second end of the RF bias electrode along the lateral direction. The plasma processing apparatus includes a focus ring disposed within the processing chamber. The plasma processing apparatus further includes a focus ring adjustment assembly. The focus ring adjustment assembly includes a lift pin positioned outside of the RF zone. The lift pin is movable along the vertical direction to adjust a distance between the pedestal and the focus ring along the vertical direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:Workpiece processing system 工件處理系統</p>
        <p type="p">110:Workpiece column 工件欄</p>
        <p type="p">112:Front end portion 前端部</p>
        <p type="p">114:Loadlock chamber 裝載鎖定室</p>
        <p type="p">115:Transfer chamber 輸送室</p>
        <p type="p">118:Workpiece input device 工件輸入裝置</p>
        <p type="p">120:First process chamber 第一處理室</p>
        <p type="p">122:First processing station 第一處理站</p>
        <p type="p">124:Second processing station 第二處理站</p>
        <p type="p">130:Second process chamber 第二處理室</p>
        <p type="p">132:First processing station 第一處理站</p>
        <p type="p">134:Second processing station 第二處理站</p>
        <p type="p">150:First workpiece handling robot 第一工件處置機械臂</p>
        <p type="p">250:Storage chamber 儲存室</p>
        <p type="p">280:Robotic arm motion pattern 機械臂運動模式</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2568" publication-number="202617491">
    <tif-files tif-type="multi-tif">
      <tif file="114151131.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>刹車機構及包括該刹車機構的兒童車</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">B62B9/08</main-classification>
        <further-classification edition="200601120260122B">B62B7/04</further-classification>
        <further-classification edition="200601120260122B">B62L3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡守鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種刹車機構及包括該刹車機構的兒童車，該刹車機構包括：第一鎖定機構，用於鎖定第一車輪；其中，所述第一鎖定機構包括操作件和第一彈性件，通過所述操作件與所述第一彈性件之間的協同作用實現對所述第一車輪的鎖定和釋鎖，在所述第一鎖定機構的操作件進行鎖定操作時，所述第一彈性件提供沿鎖定方向的按壓力，在所述第一鎖定機構的操作件進行釋鎖操作時，所述第一彈性件提供沿釋鎖方向的釋放力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一鎖定機構</p>
        <p type="p">110:操作件</p>
        <p type="p">113:樞接部</p>
        <p type="p">114:操作部</p>
        <p type="p">115:第一卡接端</p>
        <p type="p">116:第一鎖合端</p>
        <p type="p">160:第一鎖定槽</p>
        <p type="p">300:牽引件</p>
        <p type="p">621:輪轂架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2569" publication-number="202618862">
    <tif-files tif-type="multi-tif">
      <tif file="114151504.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/32</main-classification>
        <further-classification edition="200601120260112B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇天芯微半導體設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU ALPHA-SEMICONDUCTOR EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電漿處理設備，包括：基座、腔體；氣體分配件設置於基座上；移動部沿著移動方向可移動地設置於腔體上方；被鎖定裝置設置於基座上；鎖定裝置設置於移動部，用於在第一維護狀態下，鎖定被鎖定裝置；或在第二維護狀態下，與被鎖定裝置解除鎖定；氣體輸送裝置包括輸氣管路和至少一個接頭模組，輸氣管路和接頭模組通過與氣體分配件連接，向氣體分配件輸送工藝氣體；其中，輸氣管路包括可移動管路和固定管路，可移動管路在第一維護狀態下或第二維護狀態下，隨著移動部移動，可移動管路和固定管路通過接頭模組連接。本發明解決了根據不同安裝和維護需求切換不同打開方式的問題，同時無需將輸氣管路拆下，實現管路的快速密封對接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:腔體</p>
        <p type="p">120:基座</p>
        <p type="p">121:氣體分配件</p>
        <p type="p">122:線圈</p>
        <p type="p">123:支架</p>
        <p type="p">131:移動部</p>
        <p type="p">132:控氣模組</p>
        <p type="p">133:射頻部</p>
        <p type="p">134:轉接部</p>
        <p type="p">210:被鎖定裝置</p>
        <p type="p">220:柱塞氣缸</p>
        <p type="p">310:輸氣前端</p>
        <p type="p">310’:輸氣前端</p>
        <p type="p">342:第一固定管路</p>
        <p type="p">344:第二固定管路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2570" publication-number="202617911">
    <tif-files tif-type="multi-tif">
      <tif file="114151529.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異向導電性膜、連接方法、連接構造體、及異向導電性膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C09J9/02</main-classification>
        <further-classification edition="200601120260122B">H01B5/16</further-classification>
        <further-classification edition="200601120260122B">H05K3/32</further-classification>
        <further-classification edition="200601120260122B">H01R11/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原誠一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, SEIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">異向導電性膜1A、1B含有絕緣接著劑層10、與格子狀地配置於該絕緣接著劑層10之導電粒子P。關於任意之導電粒子P&lt;sub&gt;0&lt;/sub&gt;與鄰接於該導電粒子P&lt;sub&gt;0&lt;/sub&gt;之導電粒子的中心距離，當將與導電粒子P&lt;sub&gt;0&lt;/sub&gt;的最短距離設為第1中心距離d1、將次短之距離設為第2中心距離d2時，該等之中心距離d1、d2分別為導電粒子之粒徑的1.5～5倍，關於由任意之導電粒子P&lt;sub&gt;0&lt;/sub&gt;、距該導電粒子P&lt;sub&gt;0&lt;/sub&gt;第1中心距離的導電粒子P&lt;sub&gt;1&lt;/sub&gt;、距該導電粒子P&lt;sub&gt;0&lt;/sub&gt;第1中心距離d1或第2中心距離的導電粒子P&lt;sub&gt;2&lt;/sub&gt;而形成的銳角三角形，垂直於通過導電粒子P&lt;sub&gt;0&lt;/sub&gt;、P&lt;sub&gt;1&lt;/sub&gt;之第1排列方向L1的直線L0與通過導電粒子P&lt;sub&gt;1&lt;/sub&gt;、P&lt;sub&gt;2&lt;/sub&gt;之第2排列方向L2所形成之銳角的角度α為18～35°。該異向導電性膜1A、1B於COG連接中亦具有穩定的連接可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:異向導電性膜</p>
        <p type="p">10:絕緣接著劑層</p>
        <p type="p">L0:與第1排列方向垂直之方向</p>
        <p type="p">L1:第1排列方向</p>
        <p type="p">L2:第2排列方向</p>
        <p type="p">L3:第3排列方向</p>
        <p type="p">d1:第1中心距離、間距</p>
        <p type="p">d2:第2中心距離、間距</p>
        <p type="p">D:導電粒子之粒徑</p>
        <p type="p">P、P&lt;sub&gt;0&lt;/sub&gt;、P&lt;sub&gt;1&lt;/sub&gt;、P&lt;sub&gt;2&lt;/sub&gt;:導電粒子</p>
        <p type="p">α:傾斜角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2571" publication-number="202618088">
    <tif-files tif-type="multi-tif">
      <tif file="114151748.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗衣機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260126B">D06F34/14</main-classification>
        <further-classification edition="200601120260126B">D06F39/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手島賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESHIMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外薗洸佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOKAZONO, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>糀幸久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJI, YOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川秀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施形態之洗衣機具備：外槽，於殼體內被彈性支撐；槽體(62)，收納對外槽供給之液劑；浮標(94)，設置成可繞位於槽體(62)之上部之旋轉軸(V2)旋轉；及感測器(90)。檢測被檢測部(99)。浮標(94)包含對液劑具有浮力之浮體部(98)、及被檢測部(99)。被檢測部(99)是配置在比將浮體部(98)與旋轉軸(V2)連結之假想線接近感測器(90)之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">62:槽體</p>
        <p type="p">68:止回閥</p>
        <p type="p">88,101:蓋</p>
        <p type="p">88A:小蓋</p>
        <p type="p">89:內面</p>
        <p type="p">90:感測器</p>
        <p type="p">91:前面</p>
        <p type="p">92:背面</p>
        <p type="p">94:浮標</p>
        <p type="p">95:第1臂</p>
        <p type="p">96:磁石收納部</p>
        <p type="p">97:第2臂</p>
        <p type="p">98:浮體部</p>
        <p type="p">99:磁石</p>
        <p type="p">100:凹部</p>
        <p type="p">102:突起</p>
        <p type="p">J:磁化方向</p>
        <p type="p">M:前後方向</p>
        <p type="p">M1:前側</p>
        <p type="p">M2:後側</p>
        <p type="p">P1:臂連接點</p>
        <p type="p">R1,R2:旋轉方向</p>
        <p type="p">S1:液面</p>
        <p type="p">V2:浮標旋轉軸</p>
        <p type="p">X1:旋轉半徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2572" publication-number="202618880">
    <tif-files tif-type="multi-tif">
      <tif file="114151769.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異質基板的直接結合</chinese-title>
        <english-title>DIRECT BONDING OF HETEROGENEOUS SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260117B">H01L21/02</main-classification>
        <further-classification edition="200601120260117B">H01L21/314</further-classification>
        <further-classification edition="200601120260117B">H01L21/324</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼達拉普　肯卓瑟卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDALAPU, CHANDRASEKHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥卡雷米　蘿拉　威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRKARIMI, LAURA WILLS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於在微電子中將不相似材料結合的技術。實例技術使用厚度在100至1000奈米之間的薄氧化物、碳化物、氮化物、碳氮化物或氮氧化物中間物在環境室溫下直接接合不相似材料。該中間物可包含矽。不相似材料可具有顯著不同的熱膨脹係數（CTE）及/或顯著不同的晶格單位晶胞幾何形狀或尺寸，此習知地導致應變過多而使得直接接合不可行。在不相似材料之該直接接合之後在環境室溫下之一固化時段允許直接接合加強超過200%。以每分鐘1℃或更小之溫度升高速率緩慢應用的相對較低溫度退火進一步加強及鞏固該等直接接合。在用於製造各種新穎光學及聲學裝置之製程中，該等實例技術可將鉭酸鋰LiTaO&lt;sub&gt;3&lt;/sub&gt;直接接合至各種習知基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques for joining dissimilar materials in microelectronics are provided. Example techniques direct-bond dissimilar materials at an ambient room temperature, using a thin oxide, carbide, nitride, carbonitride, or oxynitride intermediary with a thickness between 100-1000 nanometers. The intermediary may comprise silicon. The dissimilar materials may have significantly different coefficients of thermal expansion (CTEs) and/or significantly different crystal-lattice unit cell geometries or dimensions, conventionally resulting in too much strain to make direct-bonding feasible. A curing period at ambient room temperature after the direct bonding of dissimilar materials allows direct bonds to strengthen by over 200%. A relatively low temperature anneal applied slowly at a rate of 1℃ temperature increase per minute, or less, further strengthens and consolidates the direct bonds. The example techniques can direct-bond lithium tantalate LiTaO&lt;sub&gt;3&lt;/sub&gt; to various conventional substrates in a process for making various novel optical and acoustic devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一晶圓</p>
        <p type="p">102:第二晶圓</p>
        <p type="p">104:氧化物、碳化物、氮化物、碳氮化物、氮氧化物層</p>
        <p type="p">106:氧化物、碳化物、氮化物、碳氮化物、氮氧化物層</p>
        <p type="p">108:原生氧化物(或碳化物、氮化物、碳氮化物、氮氧化物等)膜</p>
        <p type="p">110:原生氧化物(或碳化物、氮化物、碳氮化物、氮氧化物等)膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2573" publication-number="202617445">
    <tif-files tif-type="multi-tif">
      <tif file="114151836.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617445</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳粉匣及畫像形成裝置</chinese-title>
        <english-title>TONER CARTRIDGE AND IMAGE FORMING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B41L27/04</main-classification>
        <further-classification edition="200601120260123B">G03G15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哉
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANUMA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浜田孝俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>人
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村知史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, TOMOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>厚祐輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATSU, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">碳粉匣，是具有：外殼、及搬運構件、及泵。外殼，是具有：收容碳粉的碳粉收容室、及具備將碳粉排出用的排出口的碳粉排出室、及將碳粉收容室及碳粉排出室連通的連通口。搬運構件的一部分是被配置於連通口的內部。有關與搬運構件的碳粉搬運方向垂直交叉的剖面，當將連通口的最小的剖面的面積設成Asmin的情況時，碳粉排出室，是具有剖面比面積Asmin更大的面積Bs，且，碳粉收容室，是具有剖面比面積Asmin更大的面積Cs。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:卡匣</p>
        <p type="p">48:連通路</p>
        <p type="p">49:碳粉收容室</p>
        <p type="p">50:補給框體</p>
        <p type="p">51:內部空間</p>
        <p type="p">52:排出口</p>
        <p type="p">53:攪拌構件</p>
        <p type="p">53a:旋轉軸</p>
        <p type="p">53b:補給攪拌薄片</p>
        <p type="p">54:搬運螺桿</p>
        <p type="p">55:分隔構件</p>
        <p type="p">57:碳粉排出室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2574" publication-number="202617199">
    <tif-files tif-type="multi-tif">
      <tif file="114151842.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提供閘道器以連接流體傳輸系統及外部系統之系統、方法及電腦程式產品</chinese-title>
        <english-title>SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR PROVIDING A GATEWAY TO CONNECT A FLUID DELIVERY SYSTEM AND EXTERNAL SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">A61M5/14</main-classification>
        <further-classification edition="201801120260125B">G16H40/20</further-classification>
        <further-classification edition="201801120260125B">G16H40/60</further-classification>
        <further-classification edition="201801120260125B">G16H30/40</further-classification>
        <further-classification edition="201801120260125B">G16H10/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商拜耳保健公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYER HEALTHCARE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧魯克　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OROURKE, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　智勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, JAMES HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬頓　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATON, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰希瑞　夏哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAHERI, SHAHAB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　成惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG HOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杰　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAY, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任　若蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, RUOLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坦迪什　雪倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STANDISH, SHARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯芬　強尼　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUFFIN, JOHNNIE, JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀恩　達爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUYNH, DARYL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於使一流體注入系統與複數個外部系統之至少一者之間能夠通信之系統。該系統包含一閘道器裝置且該閘道器裝置包含至少一個處理器，該處理器經程式化或組態以：在一醫院資訊系統與一流體注入系統之間提供一第一通信介面；在與該流體注入系統相關聯之一流體注入系統服務及控制系統與該流體注入系統之間提供一第二通信介面；及在一醫療成像系統與該流體注入系統之間提供一第三通信介面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a system for enabling communication between a fluid injection system and at least one of a plurality of external systems. The system includes a gateway device and the gateway device includes at least one processor programmed or configured to provide a first communication interface between a hospital information system and a fluid injection system, provide a second communication interface between a fluid injection system service and control system associated with the fluid injection system and the fluid injection system, and provide a third communication interface between a medical imaging system and the fluid injection system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:閘道器裝置</p>
        <p type="p">104:流體注入系統</p>
        <p type="p">106:醫院資訊系統</p>
        <p type="p">108:醫療成像系統</p>
        <p type="p">110:流體注入系統服務及控制系統</p>
        <p type="p">202-A:系統管理應用程式</p>
        <p type="p">202-B:資訊學應用程式</p>
        <p type="p">202-C:流體注入系統服務應用程式</p>
        <p type="p">202-D:資料管理應用程式</p>
        <p type="p">202-E:成像系統連接性應用程式</p>
        <p type="p">206-A:患者程序追蹤系統</p>
        <p type="p">206-B:流體注入器管理系統</p>
        <p type="p">206-C:影像存檔及通信系統</p>
        <p type="p">206-D:放射資訊系統</p>
        <p type="p">206-E:放射分析系統</p>
        <p type="p">300:系統</p>
        <p type="p">308:顯示單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2575" publication-number="202617274">
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      <tif file="114151877.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202617274</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B05D7/24</main-classification>
        <further-classification edition="200601120260123B">B05C17/005</further-classification>
        <further-classification edition="200601120260123B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五師源太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSHI, GENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供可以將超臨界狀態之處理流體長時間穩定性地封入至處理容器內的技術。  &lt;br/&gt;　　[解決手段]一種與超臨界狀態之處理流體接觸而對基板進行處理的基板處理裝置之基板處理方法，其中，基板處理裝置具備：處理容器，其係具有能夠收容基板的處理空間；主供給管線，其係具有第2開關閥，對處理空間供給處理流體；排出管線，其係具有第1開關閥，從處理空間排出處理流體；及旁通管線，其係從在主供給管線之較第2開關閥更上游側，在分歧點分歧，在排出管線之較第1開關閥更下游側的合流點合流，包含升壓工程和保持工程。升壓工程係在基板被收容在處理空間之狀態，藉由從主供給管線對處理空間供給處理流體，將處理空間之壓力升壓至臨界壓力以上。保持工程係於升壓工程之後，在關閉第2開關閥及第1開關閥之狀態，使處理流體流通至旁通管線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">17:基板處理單元</p>
        <p type="p">31:處理容器</p>
        <p type="p">50:主供給管線</p>
        <p type="p">50c:分歧部</p>
        <p type="p">50d:分歧部(分歧點之一例)</p>
        <p type="p">51:副供給管線</p>
        <p type="p">51a:分歧部</p>
        <p type="p">51b:分歧供給管線</p>
        <p type="p">51c:分歧供給管線</p>
        <p type="p">52:排出管線</p>
        <p type="p">52a:分歧排出管線</p>
        <p type="p">52b:分歧排出管線</p>
        <p type="p">52c:合流部</p>
        <p type="p">52d:合流部(合流點之一例)</p>
        <p type="p">53:旁通管線</p>
        <p type="p">53a:分歧部</p>
        <p type="p">54:分歧管線</p>
        <p type="p">100:流體供給源</p>
        <p type="p">101:閥體</p>
        <p type="p">106:閥體</p>
        <p type="p">109:閥體(第2開關閥之一例)</p>
        <p type="p">111:閥體</p>
        <p type="p">118:閥體(第1開關閥之一例)</p>
        <p type="p">119:壓力調整閥</p>
        <p type="p">122:閥體</p>
        <p type="p">124:閥體</p>
        <p type="p">125:閥體</p>
        <p type="p">EXH:排氣部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2576" publication-number="202619379">
    <tif-files tif-type="multi-tif">
      <tif file="114151884.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＡＩ　社群ＡＰＰ</chinese-title>
        <english-title>AI SOCIAL APP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260202B">H04W4/021</main-classification>
        <further-classification edition="200901120260202B">H04W64/00</further-classification>
        <further-classification edition="202201120260202B">H04L51/04</further-classification>
        <further-classification edition="202301120260202B">G06N5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美泰萬有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAONE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種生成式社群應用程式，存於使用者裝置，生成式社群應用程式包含: 生成式AI 模型，可對提問資訊提供生成資訊，提問資訊包含文字、語音、照片或圖像；隨之AI社群APP顯示生成資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A generative social application stored on a user device, which comprises a generative AI model to generate information based on questions that include text, voice, photos, or images; the generated information is subsequently displayed on the generative​​ social application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:使用者裝置</p>
        <p type="p">104:生成式AI機器人</p>
        <p type="p">106:生成式AI伺服器</p>
        <p type="p">102a:智能手機</p>
        <p type="p">102b:平板電腦</p>
        <p type="p">102c:交通載具上的運算裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2577" publication-number="202617183">
    <tif-files tif-type="multi-tif">
      <tif file="114151963.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療性抗體調配物</chinese-title>
        <english-title>THERAPEUTIC ANTIBODY FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61K39/395</main-classification>
        <further-classification edition="200601120260123B">A61K47/22</further-classification>
        <further-classification edition="200601120260123B">A61K47/02</further-classification>
        <further-classification edition="200601120260123B">A61K47/26</further-classification>
        <further-classification edition="200601120260123B">A61K9/00</further-classification>
        <further-classification edition="200601120260123B">A61P1/04</further-classification>
        <further-classification edition="200601120260123B">A61P17/06</further-classification>
        <further-classification edition="200601120260123B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克漢　亞倫　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARKHAM, AARON PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　蓋倫　槐秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, GALEN HUAIQIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯馬士　賈斯汀　寇迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, JUSTIN CODY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於治療性抗IL-23p19抗體之穩定醫藥調配物及使用此類穩定醫藥調配物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Stable pharmaceutical formulations for therapeutic anti-IL-23p19 antibodies and methods of using such stable pharmaceutical formulations.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2578" publication-number="202617149">
    <tif-files tif-type="multi-tif">
      <tif file="114151992.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有增強的ＳＮ－３８溶解度及經口吸收的調配物</chinese-title>
        <english-title>FORMULATIONS WITH ENHANCED SN-38 SOLUBILITY AND ORAL ABSORPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61K31/4745</main-classification>
        <further-classification edition="200601120260123B">A61K47/10</further-classification>
        <further-classification edition="200601120260123B">A61K47/22</further-classification>
        <further-classification edition="201701120260123B">A61K47/34</further-classification>
        <further-classification edition="200601120260123B">A61K47/38</further-classification>
        <further-classification edition="200601120260123B">A61K9/10</further-classification>
        <further-classification edition="200601120260123B">A61K9/48</further-classification>
        <further-classification edition="200601120260123B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台睿生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIRX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡督憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, DU-SHIENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱伊文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係具有增強的 SN-38 溶解度及經口吸收的調配物。一具體例中，係調配物或醫藥組成物包含(a) 7-乙基-10-羥基-喜樹鹼(SN-38)；以及(b) 醫藥上可接受的賦形劑混合物，包含 (i) N-甲基吡咯烷酮；及(ii) 維生素 E TPGS 或共聚物，該共聚物為 50/50 聚(乳酸-共-乙醇酸)或 75/25 聚(乳酸-共-乙醇酸)(PLGA)；限制條件為若VitE TPGS存在，則賦形劑的混合物進一步包含選自羥丙基纖維素、羥丙基甲基纖維素、VP/VAc共聚物60/40、泊洛沙姆407及月桂醯聚乙烯二醇-32甘油酯的聚合物； 其中醫藥組成物不含水，係呈液體或凝膠形式，以及該SN-38係溶於賦形劑混合物且無沉澱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Formulations with enhanced SN-38 solubility and oral absorption. In one embodiment, a formulation or a pharmaceutical composition comprises (a) 7-Ethyl-10-hydroxy-camptothecin (SN-38); and (b) a mixture of pharmaceutically acceptable excipients comprising (i) N-Methylpyrrolidone; and (ii) Vitamin E TPGS or a copolymer, the copolymer being 50/50 poly(lactic-co-glycolic acid), or 75/25 poly(lactic-co-glycolic acid) (PLGA); with the provision that if the VitE TPGS is present, the mixture of the excipients further comprises a polymer selected from the group consisting of Hydroxypropyl cellulose, Hydroxypropyl methylcellulose, VP/VAc copolymer 60/40, poloxamer 407, and Lauroyl 聚乙烯二醇-32 glycerides; wherein the pharmaceutical composition contains no water, is in a liquid or a gel form, and the SN-38 is dissolved in the mixture of the excipients without precipitation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2579" publication-number="202617617">
    <tif-files tif-type="multi-tif">
      <tif file="114152091.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學玻璃以及光學元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C03C3/068</main-classification>
        <further-classification edition="200601120260126B">C03C3/064</further-classification>
        <further-classification edition="200601120260126B">G02B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商小原股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHARA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種相對於折射率為低比重、但穩定性高的光學玻璃和光學元件。&lt;br/&gt;  一種光學玻璃，以氧化物基準的質量%計，Ln&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;成分為10.0%以下(Ln為選自由La、Y、Gd、Yb所組成之群中之1種以上)，質量比TiO&lt;sub&gt;2&lt;/sub&gt;/RO為0.5以上至1.5以下(R為選自由Mg、Ca、Sr、Ba所組成之群中之1種以上)，質量總和Nb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;+WO&lt;sub&gt;3&lt;/sub&gt;+Bi&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;為18.0%以下，質量比BaO/RO為0.30以上至0.95以下，將比重設為d、折射率設為n&lt;sub&gt;d&lt;/sub&gt;時，滿足d≤6.17×n&lt;sub&gt;d&lt;/sub&gt;-7.694的關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2580" publication-number="202617938">
    <tif-files tif-type="multi-tif">
      <tif file="114152152.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶介質及其製備方法和用途</chinese-title>
        <english-title>LIQUID CRYSTAL MEDIUM AND PREPARATION AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C09K19/30</main-classification>
        <further-classification edition="200601120260123B">C09K19/34</further-classification>
        <further-classification edition="200601120260123B">C09K19/42</further-classification>
        <further-classification edition="200601120260123B">C09K19/54</further-classification>
        <further-classification edition="200601120260123B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞特　史分　克里斯丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUT, SVEN CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀奇曼　哈拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRSCHMANN, HARALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞德史塔克　於爾根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADESTOCK, JUERGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種如技術方案1中所定義之液晶(LC)介質，其包含式I化合物  &lt;br/&gt;&lt;img align="absmiddle" height="114px" width="444px" file="ed10290.JPG" alt="ed10290.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;sub&gt;  &lt;/sub&gt;&lt;br/&gt;及  &lt;br/&gt;一或多種選自式IIA、IIB、IIC及IID之化合物之群的化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="423px" width="512px" file="ed10291.JPG" alt="ed10291.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;且係關於其用於光學、電光及電子目的，特定言之用於LC顯示器，尤其用於IPS、FFS、VA或PS-VA顯示器中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a liquid crystal (LC) medium comprising a compound of formula I &lt;br/&gt;&lt;img align="absmiddle" height="111px" width="422px" file="ed10292.JPG" alt="ed10292.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;and &lt;br/&gt;one or more compounds selected from the group of compounds of the formulae IIA, IIB, IIC and IID, &lt;br/&gt;&lt;img align="absmiddle" height="428px" width="491px" file="ed10293.JPG" alt="ed10293.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;as defined in claim 1, and to the use thereof for optical, electro-optical and electronic purposes, in particular in LC displays, especially in IPS, FFS, VA or PS-VA displays.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2581" publication-number="202618319">
    <tif-files tif-type="multi-tif">
      <tif file="114152183.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測試電子元件的處理機及其電子元件重新配置方法</chinese-title>
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS AND ELECTRONIC COMPONENT RELOCATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260116B">G01R31/28</main-classification>
        <further-classification edition="200601120260116B">G01N3/04</further-classification>
        <further-classification edition="200601120260116B">B25J13/08</further-classification>
        <further-classification edition="200601120260116B">B65G49/07</further-classification>
        <further-classification edition="200601120260116B">G06K19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商泰克元股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹相君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SANG GUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪炳敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, BYUNG DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於重新配置電子元件的技術。依據本發明，針對拍攝裝載於測試台的電子元件的識別標記後得到的圖像進行分析而計算電子元件的臨時區域後，計算用於重新配置電子元件的移動距離(包括旋轉移動或水平移動)。因此能精細地重新配置電子元件而提高電子元件與測試機之間的電氣連接的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無。</p>
      </isu-abst>
      <representative-img>
        <p type="p">D1:識別標記</p>
        <p type="p">D2:識別標記</p>
        <p type="p">ED1:第一電子元件</p>
        <p type="p">I2:圖像</p>
        <p type="p">I3:圖像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2582" publication-number="202617167">
    <tif-files tif-type="multi-tif">
      <tif file="114152290.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>心血管疾病之治療</chinese-title>
        <english-title>TREATMENT OF CARDIOVASCULAR DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260121B">A61K35/51</main-classification>
        <further-classification edition="200601120260121B">A61P9/00</further-classification>
        <further-classification edition="200601120260121B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商永生生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEMCYTE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　嘉宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林欣榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHINN-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓鴻志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARN, HORNG-JYH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及基於細胞的心血管疾病的治療。本發明還對心血管疾病患者以及遭受其他形式的神經壓力或損傷的患者提供治療以改善神經組織及改善行為及神經功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to cell-based treatment of cardiovascular disease. The invention also provides treatments to improve neural tissue and to improve behavior and neurological function in cardiovascular disease patients as well as patients suffering from other forms of neurological stress or damage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案圖式皆為實驗數據或流程。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2583" publication-number="202619078">
    <tif-files tif-type="multi-tif">
      <tif file="114152292.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體元件封裝及電子元件</chinese-title>
        <english-title>INTEGRATED DEVICE PACKAGES AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01L23/31</main-classification>
        <further-classification edition="200601120260119B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，公開了一種積體元件封裝體。積體元件封裝體可以包括載體和在載體的頂表面的一部分之上的模塑膠。積體元件封裝體可以包括安裝到載體並且至少部分地嵌入模塑膠中的積體元件晶片，積體元件晶片包括有源電路系統。積體元件封裝體可以包括安裝到載體並且至少部分地嵌入模塑膠中的應力補償元件，應力補償元件與積體元件晶片間隔開，應力補償元件包括沒有有源電路系統的虛設應力補償元件。應力補償元件和積體元件晶片中的至少一者可以在沒有粘合劑的情況下被直接鍵合到載體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one embodiment, an integrated device package is disclosed. The integrated device package can comprise a carrier an a molding compound over a portion of an upper surface of the carrier. The integrated device package can comprise an integrated device die mounted to the carrier and at least partially embedded in the molding compound, the integrated device die comprising active circuitry. The integrated device package can comprise a stress compensation element mounted to the carrier and at least partially embedded in the molding compound, the stress compensation element spaced apart from the integrated device die, the stress compensation element comprising a dummy stress compensation element devoid of active circuitry. At least one of the stress compensation element and the integrated device die can be directly bonded to the carrier without an adhesive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">82:封裝</p>
        <p type="p">102:晶片</p>
        <p type="p">103:載體</p>
        <p type="p">104a、104b:應力補償元件</p>
        <p type="p">105a:外側邊緣</p>
        <p type="p">106a:側邊緣</p>
        <p type="p">107:側邊緣</p>
        <p type="p">108:模塑膠</p>
        <p type="p">S:分割道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2584" publication-number="202619079">
    <tif-files tif-type="multi-tif">
      <tif file="114152293.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體元件封裝及電子元件</chinese-title>
        <english-title>INTEGRATED DEVICE PACKAGES AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H01L23/31</main-classification>
        <further-classification edition="200601120260119B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，公開了一種積體元件封裝體。積體元件封裝體可以包括載體和在載體的頂表面的一部分之上的模塑膠。積體元件封裝體可以包括安裝到載體並且至少部分地嵌入模塑膠中的積體元件晶片，積體元件晶片包括有源電路系統。積體元件封裝體可以包括安裝到載體並且至少部分地嵌入模塑膠中的應力補償元件，應力補償元件與積體元件晶片間隔開，應力補償元件包括沒有有源電路系統的虛設應力補償元件。應力補償元件和積體元件晶片中的至少一者可以在沒有粘合劑的情況下被直接鍵合到載體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one embodiment, an integrated device package is disclosed. The integrated device package can comprise a carrier an a molding compound over a portion of an upper surface of the carrier. The integrated device package can comprise an integrated device die mounted to the carrier and at least partially embedded in the molding compound, the integrated device die comprising active circuitry. The integrated device package can comprise a stress compensation element mounted to the carrier and at least partially embedded in the molding compound, the stress compensation element spaced apart from the integrated device die, the stress compensation element comprising a dummy stress compensation element devoid of active circuitry. At least one of the stress compensation element and the integrated device die can be directly bonded to the carrier without an adhesive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">82:封裝</p>
        <p type="p">102:晶片</p>
        <p type="p">103:載體</p>
        <p type="p">104a、104b:應力補償元件</p>
        <p type="p">105a:外側邊緣</p>
        <p type="p">106a:側邊緣</p>
        <p type="p">107:側邊緣</p>
        <p type="p">108:模塑膠</p>
        <p type="p">S:分割道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2585" publication-number="202618601">
    <tif-files tif-type="multi-tif">
      <tif file="114152326.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算定義於半導體設計中的線結構的寄生參數之方法、機器可讀取媒體、電子裝置、系統及電腦程式產品</chinese-title>
        <english-title>METHOD, MACHINE READABLE MEDIUM, ELECTRONIC DEVICE, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR CALCULATING PARASITIC PARAMETERS FOR WIRE STRUCTURES DEFINED IN A SEMICONDUCTOR DESIGN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260119B">G06F30/27</main-classification>
        <further-classification edition="201701120260119B">G06T7/557</further-classification>
        <further-classification edition="201101120260119B">G06T15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商Ｄ２Ｓ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D2S, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤村晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMURA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希拉利　納吉什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRALI, NAGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐里歐丹　唐納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIORDAN, DONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些實施例提供一種計算定義於半導體設計中的線結構的寄生參數之方法。方法包含對於半導體設計中的第一線結構產生第二線結構，第一線結構包含多個直線形狀，第二線結構包含多個曲線形狀；及利用第二線結構產生寄生參數組，寄生參數組關聯於由半導體設計中的第一線結構中的至少一導線所引起的寄生效應組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments provide a method for calculating parasitic parameters for wire structures defined in a semiconductor design. The method comprising: for a first wire structure in the semiconductor design and comprising a plurality of rectilinear shapes, generating a second wire structure comprising a plurality of curvilinear shapes; and using the second wire structure to generate a set of parasitic parameters related to a set of parasitic effects experienced by at least one wire within the first wire structures in the semiconductor design.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:非幾何方法</p>
        <p type="p">710:線結構</p>
        <p type="p">720:影像光柵化</p>
        <p type="p">730:多通道二維影像</p>
        <p type="p">740:神經網路</p>
        <p type="p">750:電容向量(電容向量值)</p>
        <p type="p">755:後處理器</p>
        <p type="p">760:電容係數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2586" publication-number="202617067">
    <tif-files tif-type="multi-tif">
      <tif file="115100145.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學偵測模組</chinese-title>
        <english-title>AN OPTICAL DETECTOR MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">A61B5/024</main-classification>
        <further-classification edition="200601120260122B">A61B5/02</further-classification>
        <further-classification edition="200601120260122B">G01N21/17</further-classification>
        <further-classification edition="200601120260122B">G01N21/62</further-classification>
        <further-classification edition="200601120260122B">H03F1/56</further-classification>
        <further-classification edition="200601120260122B">H03F3/08</further-classification>
        <further-classification edition="200601120260122B">H03G3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商光程研創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARTILUX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱凱偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, KAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供一種光學偵測模組，藉由偵測光學偵測模組外的環境光並根據第一偵測閾值，可以用於實現近接感測功能。光學偵測模組藉由發射一或多個光學訊號(例如：特定波長的光學脈衝)，以及藉由偵測關聯於第二及/或第三偵測閾值的反射光學訊號，可以進一步用於實現其它主動功能諸如材料偵測(例如：皮膚)或深度感測。本揭露內容提供光學偵測模組的主動監測偵測閾值的技術解法，以達成更好的電源管理。在本揭露內容一些實施例中，這些解法對於具有寬感測頻寬的光偵測器具有顯著的功效，諸如由鍺形成的光偵測器或是具有包含鍺的吸收區域的光偵測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical detector module can be used to implement proximity sensing function by detecting ambient light outside of the optical detector module in accordance with a first detection threshold. An optical detector module can be further used to implement other active functions such as material detection (e.g., skin) or depth-sensing by emitting one or more optical signals (e.g., light pulses at a specific wavelength) and detecting the reflected optical signals relative to a second and/or third detection threshold. The disclosure provides technical solutions for actively monitoring detection threshold(s) of an optical detector module to achieve better power management. In some embodiments, such solutions are useful for photodetectors having a wide sensing bandwidth, such as a photodetector formed in germanium or a photodetector comprising an absorption region comprising germanium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S27:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2587" publication-number="202617622">
    <tif-files tif-type="multi-tif">
      <tif file="115100216.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202617622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100216</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">C03C3/118</main-classification>
        <further-classification edition="200601120260119B">C03C3/091</further-classification>
        <further-classification edition="200601120260119B">C03C3/085</further-classification>
        <further-classification edition="200601120260119B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧田雅貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKITA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的玻璃基板中，作為玻璃組成，以莫耳%計而含有65.0%～80.0%的SiO&lt;sub&gt;2&lt;/sub&gt;、2.0%～15.0%的Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、0%～15.0%的B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、0.001%～未滿0.1%的Li&lt;sub&gt;2&lt;/sub&gt;O+Na&lt;sub&gt;2&lt;/sub&gt;O+K&lt;sub&gt;2&lt;/sub&gt;O、0%～15.0%的MgO、0%～15.0%的CaO、0%～15.0%的SrO、0%～15.0%的BaO、0.01%～1.0%的SnO&lt;sub&gt;2&lt;/sub&gt;、0%～未滿0.050%的As&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、0%～未滿0.050%的Sb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2588" publication-number="202618382">
    <tif-files tif-type="multi-tif">
      <tif file="115100222.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像透鏡系統</chinese-title>
        <english-title>IMAGING LENS SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B11/34</main-classification>
        <further-classification edition="202101120260126B">G02B7/02</further-classification>
        <further-classification edition="200601120260126B">G02B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張相鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SANG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴一容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, IL YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像透鏡系統包括：第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡及第八透鏡，自物體側依次設置，其中第一透鏡具有正的折射力，其中第四透鏡具有凹的影像側表面，其中第七透鏡具有正的折射力且具有凸的物體側表面，且其中成像透鏡系統滿足以下條件表達式：0.12 ＜ G12/G45 ＜ 0.52，其中G12是自第一透鏡的影像側表面至第二透鏡的物體側表面的距離，且G45是自第四透鏡的影像側表面至第五透鏡的物體側表面的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens disposed in order from an object side, wherein the first lens has positive refractive power, wherein the fourth lens has a concave image-side surface, wherein the seventh lens has positive refractive power and has a convex object-side surface, and wherein the imaging lens system satisfies a conditional expression as follows: 0.12 ＜ G12/G45 ＜ 0.52 where G12 is a distance from an image-side surface of the first lens to an object-side surface of the second lens, and G45 is a distance from an image-side surface of the fourth lens to an object-side surface of the fifth lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像透鏡系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">IF:濾光器</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2589" publication-number="202617707">
    <tif-files tif-type="multi-tif">
      <tif file="115100244.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種結晶型ＣＳＦ－１Ｒ抑制劑酸式鹽及其製備方法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C07D401/14</main-classification>
        <further-classification edition="200601120260123B">A61K31/444</further-classification>
        <further-classification edition="200601120260123B">A61P35/00</further-classification>
        <further-classification edition="200601120260123B">A61P37/00</further-classification>
        <further-classification edition="200601120260123B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海和譽生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喻　紅平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙保衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種結晶型CSF-1R抑制劑酸式鹽及其製備方法和應用，所述CSF-1R抑制劑為具有式(I)結構的化合物3,3-二甲基-N-(6-甲基-5-((2-(1-甲基-1H-吡唑-4-基)吡啶-4-基)氧基)吡啶-2-基)-2-氧代吡咯烷-1-甲醯胺，所述結晶型酸式鹽化合物可以大大改善游離態式(I)化合物的溶解性、吸濕性和化學穩定性等物化性能，符合工業生產要求，滿足臨床藥物製劑開發需要。本發明結晶型酸式鹽化合物可廣泛應用於製備治療癌症、腫瘤、自身免疫性疾病、代謝性疾病或轉移性疾病的藥物。&lt;br/&gt;&lt;img align="absmiddle" height="159px" width="346px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2590" publication-number="202618622">
    <tif-files tif-type="multi-tif">
      <tif file="115100289.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於裝置計量之複合資料</chinese-title>
        <english-title>COMPOSITE DATA FOR DEVICE METROLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260119B">G06N20/20</main-classification>
        <further-classification edition="202301120260119B">G06N3/045</further-classification>
        <further-classification edition="202301120260119B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商昂圖創新公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONTO INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱浩東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, HAODONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳琢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　威茗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEW, WEI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　景勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, JINGSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯利瓦絲塔瓦　沙山克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIVASTAVA, SHASHANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用複合計量資料的機器學習模型使用來自受測裝置的經測量計量資料來判定該裝置之至少一個參數。複合計量資料係藉由將來自參考裝置的經測量計量資料與自參考裝置之模型計算的合成計量資料合併而產生。複合計量資料可進一步基於自經修改參考裝置之模型計算的合成計量資料產生。經修改參考裝置可使用模型之至少一個參數的變化以擴展訓練範圍之參數空間而產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A machine learning model that uses composite metrology data determines at least one parameter of a device under test using measured metrology data from the device. The composite metrology data is generated by merging measured metrology data from a reference device with synthetic metrology data calculated from a model of the reference device. The composite metrology data may be generated further based on a synthetic metrology data calculated from a model for a modified reference device. The modified reference device may be generated using variations of at least one parameter of the model to expand the parameter space of the training range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:實例操作</p>
        <p type="p">1102:步驟</p>
        <p type="p">1104:步驟</p>
        <p type="p">1106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2591" publication-number="202618344">
    <tif-files tif-type="multi-tif">
      <tif file="115100328.zip" no="1">
      </tif>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濾光器、濾光器之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B5/22</main-classification>
        <further-classification edition="202301120260126B">H04N23/55</further-classification>
        <further-classification edition="202101120260126B">G03B11/00</further-classification>
        <further-classification edition="200601120260126B">G02B1/04</further-classification>
        <further-classification edition="200601120260126B">C09D5/32</further-classification>
        <further-classification edition="201801120260126B">C09D7/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本板硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHEET GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高柳良浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAYANAGI, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之光吸收性組成物含有：分子內具有羥基及羰基之紫外線吸收劑、及金屬成分。金屬成分之至少一部分與有機氧基鍵結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2592" publication-number="202617957">
    <tif-files tif-type="multi-tif">
      <tif file="115100372.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔用於錫化合物之裝置的方法及藉此所獲得之經清潔之裝置</chinese-title>
        <english-title>METHOD FOR CLEANING AN APPARATUS FOR A TIN COMPOUND AND THE CLEANED APPARATUS OBTAINED THEREBY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C11D7/06</main-classification>
        <further-classification edition="200601120260126B">C11D7/08</further-classification>
        <further-classification edition="200601120260126B">C11D7/26</further-classification>
        <further-classification edition="200601120260126B">C11D7/50</further-classification>
        <further-classification edition="200601120260126B">C07F7/22</further-classification>
        <further-classification edition="200601120260126B">B08B3/04</further-classification>
        <further-classification edition="200601120260126B">B08B3/08</further-classification>
        <further-classification edition="200601120260126B">B08B3/10</further-classification>
        <further-classification edition="200601120260126B">G03F7/00</further-classification>
        <further-classification edition="200601120260126B">G03F7/004</further-classification>
        <further-classification edition="200601120260126B">G03F7/16</further-classification>
        <further-classification edition="200601120260126B">G03F7/20</further-classification>
        <further-classification edition="200601120260126B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蓋列斯特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELEST, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井洸毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供有效及安全地清潔用於錫化合物之裝置之方法及高度經淨化之用於錫化合物的裝置。一種清潔與具有式(1)之錫化合物接觸之裝置之方法至少包含按此順序的步驟(A)至(C)：  &lt;br/&gt;(A)使用非質子溶劑清潔該裝置之步驟，  &lt;br/&gt;(B)使用酸性水溶液及/或鹼性水溶液清潔該裝置之步驟，及  &lt;br/&gt;(C)使用25℃下電阻率為17 MΩ·cm之超純水清潔該裝置之步驟。  &lt;br/&gt;R&lt;sub&gt;p&lt;/sub&gt;S&lt;sub&gt;n&lt;/sub&gt;X&lt;sub&gt;m&lt;/sub&gt; (1)  &lt;br/&gt;R係烴基，p係0至3之整數，X係可水解取代基，且m = 4-p。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for efficiently and safely cleaning an apparatus for a tin compound and a highly purified apparatus for a tin compound are provided. A method of cleaning an apparatus that has been in contact with a tin compound having formula (1) includes at least steps (A) to (C) in this order: &lt;br/&gt;(A) a step of cleaning the apparatus with a non-protonic solvent, &lt;br/&gt;(B) a step of cleaning the apparatus with an acidic aqueous solution and/or alkaline aqueous solution, and &lt;br/&gt;(C) a step of cleaning the apparatus with ultrapure water having a resistivity of 17 MΩ·cm at 25°C. &lt;br/&gt;R&lt;sub&gt;p&lt;/sub&gt;S&lt;sub&gt;n&lt;/sub&gt;X&lt;sub&gt;m&lt;/sub&gt; (1) &lt;br/&gt;R is a hydrocarbon group, p is an integer of 0 to 3, X is a hydrolyzable substituent, and m = 4-p.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2593" publication-number="202618213">
    <tif-files tif-type="multi-tif">
      <tif file="115100419.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100419</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可重新配置之光學感應裝置及其方法</chinese-title>
        <english-title>RECONFIGURABLE OPTICAL SENSING APPARATUS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260123B">G01B9/02</main-classification>
        <further-classification edition="201701120260123B">G06T7/11</further-classification>
        <further-classification edition="200601120260123B">G01S7/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商光程研創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARTILUX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳書履</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHU-LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供用於經改善之可重新配置之光學感測裝置及其方法。例如，一範例光學感應裝置可包括具有複數光檢測器之光檢測器陣列，且光學感應裝置可包括電路系統或一或多個處理元件。所述處理元件用以接收一或多個代表由一第一光檢測器子集所接收之光學訊號之電性訊號；基於一或多個電性訊號，判定在光檢測器陣列中用於光學測量之一偵測區域；並基於偵測區域，停用光檢測器陣列之第二光檢測器子集。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, apparatuses, and methods for improved reconfigurable optical sensing are provided. For instance, an example optical sensing apparatus can include a photodetector array including a plurality of photodetectors. The optical sensing apparatus can include circuitry or one or more processing devices configured to receive one or more electrical signals representing an optical signal received by a first subset of the plurality of photodetectors; determine, based on the one or more electrical signals, a region of interest in the photodetector array for optical measurements; and deactivate, based on the region of interest, a second subset of the plurality of photodetectors of the photodetector array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:偵測區域中心光檢測器</p>
        <p type="p">104:光檢測器陣列</p>
        <p type="p">1041:偵測區域</p>
        <p type="p">1042:停用區域</p>
        <p type="p">RXL:光學訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2594" publication-number="202617378">
    <tif-files tif-type="multi-tif">
      <tif file="115100427.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有關節彎折或可變長度上臂之機器人系統及用以控制其之方法與電腦程式產品</chinese-title>
        <english-title>ROBOT SYSTEM WITH ARTICULATED OR VARIABLE LENGTH UPPER ARM, AND METHOD AND COMPUTER PROGRAM TO CONTROL THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">B25J9/16</main-classification>
        <further-classification edition="200601120260122B">B25J9/08</further-classification>
        <further-classification edition="200601120260122B">B25J17/02</further-classification>
        <further-classification edition="200601120260122B">B25J18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商靈巧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXTERITY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍姆伯格　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLMBERG, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費雪　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　周文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, ZHOUWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅農　薩米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENON, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格拉瓦爾　維卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGRAWAL, VIKAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋爾瑪　阿維納什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERMA, AVINASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭詠翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機器人系統包含一機械臂，該機械臂包含將一第一節段連接至一第二節段之一第一關節，該第一節段在該第一節段之與該第一關節相對之一端處連接至該機械臂之一肩關節，且該第二節段在該第二節段之與該第一關節相對之一端處連接至該機械臂之一肘關節；及一處理器，其耦合至該機械臂且經組態以接收一末端執行器軌跡且判定將該末端執行器移動通過該末端執行器軌跡之一運動規劃，包含視需要藉由使用該第一關節來改變該肩關節與該肘關節之間的距離，以避免將該機械臂或其任何部分放置於與一奇異點相關聯之一位置中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robotic system includes a robotic arm that includes a first joint that connects a first segment to a second segment, the first segment being connected at an end of the first segment opposite the first joint to a shoulder joint of the robotic arm and the second segment being connected at an end of the second segment opposite the first joint to an elbow joint of the robotic arm; and a processor coupled to the robotic arm and configured to receive an end effector trajectory and determine a motion plan to move the end effector through the end effector trajectory, including by using the first joint to vary the distance between the shoulder joint and the elbow joint, as and if needed, to avoid placing the robotic arm or any portion thereof in a position associated with a singularity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:8自由度(DOF)機器人</p>
        <p type="p">102:固定底座</p>
        <p type="p">104:延伸器臂平台</p>
        <p type="p">106:肩部</p>
        <p type="p">108:中介連桿/節段</p>
        <p type="p">110:中介連桿/節段</p>
        <p type="p">112:肘部/關節/肘關節</p>
        <p type="p">114:肘部/前臂</p>
        <p type="p">116:中介連桿/前臂/肘部</p>
        <p type="p">118:腕部總成/腕部</p>
        <p type="p">J&lt;sub&gt;0&lt;/sub&gt;至J&lt;sub&gt;8&lt;/sub&gt;:關節</p>
        <p type="p">z3:旋轉軸</p>
        <p type="p">z4:旋轉軸</p>
        <p type="p">z5:旋轉軸</p>
        <p type="p">z6:縱軸</p>
        <p type="p">z7:彎曲</p>
        <p type="p">z8:旋轉</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2595" publication-number="202618760">
    <tif-files tif-type="multi-tif">
      <tif file="115100436.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100436</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改良連續性之音訊信號之適應性降混</chinese-title>
        <english-title>ADAPTIVE DOWNMIXING OF AUDIO SIGNALS WITH IMPROVED CONTINUITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260120B">G10L19/008</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜拜研究特許公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥格拉斯　大衛　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGRATH, DAVID S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於具有改良連續性之音訊信號之適應性降混之實施方案。一種音訊編碼方法包括：接收包括一主輸入音訊聲道及L個非主輸入音訊聲道之一輸入多聲道音訊信號；判定一組L個輸入增益，其中L係大於1之一正整數；針對該等L個非主輸入音訊聲道及L個輸入增益之各者，自根據該輸入增益按比例調整之該各自非主輸入音訊聲道形成一各自按比例調整之非主輸入音訊聲道；自該主輸入音訊聲道與該等按比例調整之非主輸入音訊聲道之和形成一主輸出音訊聲道；判定一組L個預測增益：針對該等L個預測增益之各者，形成來自根據該預測增益按比例調整之該主輸出音訊聲道之一預測聲道；自該各自非主輸入音訊聲道與該各自預測信號之差形成L個非主輸出音訊聲道；形成來自該主輸出音訊聲道及該等L個非主輸出音訊聲道之一輸出多聲道音訊信號；編碼該輸出多聲道音訊信號；及傳輸或儲存該編碼輸出多聲道音訊信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Implementations are disclosed for adaptive downmixing of audio signals with improved continuity. An audio encoding method comprises: receiving an input multi-channel audio signal comprising a primary input audio channel and L non-primary input audio channels; determining a set of L input gains, where L is a positive integer greater than one; for each of the L non-primary input audio channels and L input gains, forming a respective scaled non-primary input audio channel from the respective non-primary input audio channel scaled according to the input gain; forming a primary output audio channel from the sum of the primary input audio channel and the scaled non-primary input audio channels; determining a set of L prediction gains for each of the L prediction gains, forming a prediction channel from the primary output audio channel scaled according to the prediction gain; forming L non-primary output audio channels from the difference of the respective non-primary input audio channel and the respective prediction signal; forming an output multi-channel audio signal from the primary output audio channel and the L non-primary output audio channels; encoding the output multi-channel audio signal; and transmitting or storing the encoded output multi-channel audio signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:程序</p>
        <p type="p">701:步驟</p>
        <p type="p">702:步驟</p>
        <p type="p">703:步驟</p>
        <p type="p">704:步驟</p>
        <p type="p">705:步驟</p>
        <p type="p">706:步驟</p>
        <p type="p">707:步驟</p>
        <p type="p">708:步驟</p>
        <p type="p">709:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2596" publication-number="202618393">
    <tif-files tif-type="multi-tif">
      <tif file="115100484.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有矩形波導的光學孔徑倍增器的製造方法及光學結構</chinese-title>
        <english-title>METHODS OF FABRICATION OF OPTICAL APERTURE MULTIPLIERS HAVING RECTANGULAR WAVEGUIDE AND OPTICAL STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G02B27/00</main-classification>
        <further-classification edition="200601120260121B">G02B27/14</further-classification>
        <further-classification edition="200601120260121B">G02B6/24</further-classification>
        <further-classification edition="200601120260121B">G02B6/26</further-classification>
        <further-classification edition="200601120260121B">H05B6/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹齊格　尤奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANZIGER, YOCHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里德曼　埃德加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRIEDMANN, EDGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種製造光學孔徑倍增器的方法。獲得片和第一光學結構。該片具有包括一對平行面的外表面和傾斜於該對平行面的第一多個部分反射內表面。第一光學結構具有包括平面耦合表面的外表面和傾斜於耦合表面的第二多個部分反射內表面。該片與第一光學結構光學耦合，使得該對平行面中的一個面與耦合表面成面對關係，以形成第二光學結構。通過至少兩個垂直於耦合表面的切割平面切割第二光學結構，從第二光學結構切出至少一個光學孔徑倍增器。光學孔徑倍增器優選地是近眼顯示器增強現實系統的一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of fabricating an optical aperture multiplier is provided. A slice and a first optical structure are obtained. The slice has external faces including a pair of parallel faces, and a first plurality of partially reflective internal surfaces oblique to the pair of parallel faces. The first optical structure has external surfaces including a planar coupling surface, and a second plurality of partially reflective internal surfaces oblique to the coupling surface. The slice is optically coupled with the first optical structure such that one of the faces of the pair of parallel faces is in facing relation with the coupling surface to form a second optical structure. At least one optical aperture multiplier is sliced from the second optical structure by cutting the second optical structure through at least two cutting planes perpendicular to the coupling surface. The optical aperture multiplier is preferably part of a near eye display augmented reality system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學孔徑倍增器</p>
        <p type="p">10:第一光學波導</p>
        <p type="p">12a:面</p>
        <p type="p">12b,16a,16b:面</p>
        <p type="p">24a,24b,26a,26b:面</p>
        <p type="p">20:第二光學波導</p>
        <p type="p">30:圖像光</p>
        <p type="p">40:小平面/反射表面</p>
        <p type="p">45:小平面/反射表面/內表面</p>
        <p type="p">b1,b2:圖像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2597" publication-number="202617156">
    <tif-files tif-type="multi-tif">
      <tif file="115100569.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100569</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療進行性纖維化間質性肺病之新穎口服醫藥組合物及劑量療法</chinese-title>
        <english-title>NEW ORAL PHARMACEUTICAL COMPOSITION AND DOSE REGIMEN FOR THE THERAPY OF PROGRESSIVE FIBROSING INTERSTITIAL LUNG DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">A61K31/519</main-classification>
        <further-classification edition="200601120260202B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀斯林格　克里斯宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HESSLINGER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑爾　維瑞納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUER, VERENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博賽特　賽巴斯汀　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSSERT, SEBASTIAN MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼柯勞斯　彼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICKOLAUS, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫柏　蘇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBER, SUSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉藝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾　瑪莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNO, MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯　弗羅利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOSS, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種口服醫藥組合物，其基本上由以下組分組成：  &lt;br/&gt;式III之PDE4B抑制劑  &lt;br/&gt;&lt;img align="absmiddle" height="256px" width="307px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;劑量係18 mg或9 mg，及  &lt;br/&gt;視情況選用之一或多種醫藥學上可接受之載劑或賦形劑  &lt;br/&gt;其用於治療患有一或多種進行性纖維化間質性肺病(PF-ILD)的患者，其中此口服醫藥組合物係每天兩次投與該患者。  &lt;br/&gt;本發明進一步關於包含18 mg或9 mg劑量的該式III之PDE4B抑制劑及治療有效劑量之選自尼達尼布(nintedanib)或吡非尼酮(pirfenidone)的第二活性成分的口服醫藥組合物，其中此等口服醫藥組合物係每天兩次投與該患者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns an oral pharmaceutical composition consisting essentially of &lt;br/&gt;• the PDE4B-inhibitor of formula III &lt;br/&gt;&lt;img align="absmiddle" height="251px" width="336px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;in the dose of 18 mg or 9 mg and &lt;br/&gt;• optionally of one or more pharmaceutically acceptable carriers or excipients &lt;br/&gt;for use in the treatment of a patient suffering from one or more progressive fibrosing interstitial lung diseases (PF-ILD), wherein this oral pharmaceutical composition is to be administered to the patient twice daily. &lt;br/&gt;The invention further concerns oral pharmaceutical compositions comprising the PDE4B-inhibitor of formula III in the dose of 18 mg or 9 mg and a therapeutically effective dose of a second active ingredient selected from nintedanib or pirfenidone, wherein these oral pharmaceutical compositions are administered to the patient twice daily.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2598" publication-number="202618405">
    <tif-files tif-type="multi-tif">
      <tif file="115100574.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統及顯示系統</chinese-title>
        <english-title>OPTICAL SYSTEM AND DISPLAY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02B27/01</main-classification>
        <further-classification edition="200601120260123B">G02B27/10</further-classification>
        <further-classification edition="200601120260123B">G02B27/28</further-classification>
        <further-classification edition="200601120260123B">G02B27/44</further-classification>
        <further-classification edition="200601120260123B">G02B5/30</further-classification>
        <further-classification edition="200601120260123B">G02B6/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商思娜公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNAP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維斯瑪　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIERSMA, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅萊納　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELENA, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學顯示引擎對於包含發光二極體顯示器、微發光二極體顯示器及/或有機發光二極體顯示器的擴增實境近眼裝置具有縮小尺寸及/或增加效率。例舉光學系統對於偏振光(或單獨的無偏振光)提供不同的光路，並在使用偏振分光器、四分之一波片、半波片及例如曲面鏡或反射鏡的反射元件之密集系統中重新結合對應不同影像部分/通道的相對偏振光來造成高光功率。影像及/或其部分在多個觀察平面出現來投射更真實的合成影像，並能從單個高效率的小顯示器在不同的角解析度下創造具有高外顯解析度大型複合視場角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Optical display engines with reduced size and/or increased efficiency for Augmented Reality (AR) and near-eye devices that incorporate LED, microLED, and/or OLED displays. Example optical systems provide different light paths for polarized (or split unpolarized) light, with recombining oppositely polarized light corresponding to different image portions/channels, in a compact system using polarized beam splitters, quarter wave plates, half wave plates, and reflective elements such as curved mirrors or reflective lenses, resulting in high optical power. Images and/or portions thereof are presented at multiple observation planes to project a more realistic synthetic image, and at different angular resolutions to enable creation of a large composite field of view with high apparent resolution from a single small and efficient display.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學顯示引擎</p>
        <p type="p">101:偏振分光器</p>
        <p type="p">101a,101b:半波片</p>
        <p type="p">101c:介面</p>
        <p type="p">102:第一四分之一波片</p>
        <p type="p">104:第二四分之一波片</p>
        <p type="p">103:第一反射元件</p>
        <p type="p">105:第二反射元件</p>
        <p type="p">107:非偏振光束</p>
        <p type="p">108:第一光路</p>
        <p type="p">109:第二光路</p>
        <p type="p">110:顯示裝置</p>
        <p type="p">111:第一折射鏡片</p>
        <p type="p">112:第二折射鏡片</p>
        <p type="p">113:第三折射鏡片</p>
        <p type="p">114:第四折射鏡片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2599" publication-number="202618795">
    <tif-files tif-type="multi-tif">
      <tif file="115100618.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體和記憶體系統及記憶體和記憶體系統的操作方法</chinese-title>
        <english-title>MEMORY, MEMORY SYSTEM AND OPERATION METHOD OF MEMORY SYSTEM AND OPERATION METHOD OF MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">G11C29/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭喆文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, CHUL MOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金雄來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOONGRAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於記憶體和記憶體系統及其操作方法。一種用於操作記憶體系統的方法，包括：藉由記憶體控制器收集關於藉由記憶體控制器確定爲記憶體中的被行錘攻擊的行的資訊；藉由記憶體收集關於藉由記憶體確定爲被行錘攻擊的行的資訊；藉由記憶體確認藉由記憶體控制器收集的行與藉由記憶體收集的行相同；以及回應於確認，藉由記憶體重置關於與藉由記憶體控制器收集的行相同的藉由記憶體收集的行的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for operating a memory system includes: collecting, by a memory controller, information on rows that are determined as row-hammer-attacked in a memory by the memory controller; collecting, by the memory, information on rows that are determined as row-hammer-attacked by the memory; onfirming, by the memory, that the row collected by the memory controller is the same as the row collected by the memory; and resetting, by the memory, information on the row collected by the memory which is the same as the row collected by the memory controller in response to the confirmation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:記憶體系統</p>
        <p type="p">210:記憶體控制器</p>
        <p type="p">211:主機介面</p>
        <p type="p">213:調度器</p>
        <p type="p">215:命令產生器</p>
        <p type="p">217:行錘攻擊檢測電路</p>
        <p type="p">219:記憶體介面</p>
        <p type="p">250:記憶體</p>
        <p type="p">251:記憶體核心</p>
        <p type="p">253:控制電路</p>
        <p type="p">255:行錘攻擊檢測電路</p>
        <p type="p">257:比較電路</p>
        <p type="p">ALERT:警報訊號</p>
        <p type="p">CA:命令和位址</p>
        <p type="p">DATA:資料</p>
        <p type="p">HOST:主機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2600" publication-number="202617681">
    <tif-files tif-type="multi-tif">
      <tif file="115100620.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>９－胺基甲基美諾四環素化合物及其於治療社區肺炎（ＣＡＢＰ）之用途</chinese-title>
        <english-title>9-AMINOMETHYL MINOCYCLINE COMPOUNDS AND USE THEREOF IN TREATING COMMUNITY-ACQUIRED BACTERIAL PNEUMONIA (CABP)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260124B">C07C237/26</main-classification>
        <further-classification edition="200601120260124B">A61K31/65</further-classification>
        <further-classification edition="200601120260124B">A61P11/00</further-classification>
        <further-classification edition="200601120260124B">A61P31/04</further-classification>
        <further-classification edition="200601120260124B">A61K9/20</further-classification>
        <further-classification edition="200601120260124B">A61K9/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商派瑞泰ＳＰＶ２有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRTK SPV2 LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹尼斯　艾文吉羅斯Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZANIS, EVANGELOS L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥戈文　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGOVERN, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示之發明提供一種使用9-[(2,2-二甲基-丙基胺基)-甲基]-美諾四環素(minocycline)或其鹽，以口服或IV劑量或二者之組合治療社區肺炎(Community-Acquired Baxterial Pneumonia)(CABP)之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention disclosed herein provides a method for treating Community-Acquired Bacterial Pneumonia (CABP) using 9-[(2,2-dimethyl-propyl amino)-methyl]-minocycline or a salt thereof, in either oral or IV doses or a combination of both.</p>
      </isu-abst>
      <representative-img>
        <p type="p">由於本案的圖均為實驗數據，並非本案的代表圖。</p>
        <p type="p">故本案無指定代表圖。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2601" publication-number="202618863">
    <tif-files tif-type="multi-tif">
      <tif file="115100655.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線模組以及電漿產生系統</chinese-title>
        <english-title>ANTENNA MODULE AND PLASMA GENERATING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01J37/32</main-classification>
        <further-classification edition="200601120260120B">H03H7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商源多可股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EN2CORE TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴世勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UHM, SAE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李潤星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUN SEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫永勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOHN, YEONG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴世洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SE HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的一個實施例，可提供一種用於實行電漿放電的電漿產生裝置，電漿產生裝置具有包括第一模式及第二模式的多種操作模式，且包括：第一電源供應器，能夠改變第一頻率範圍內的頻率；第二電源供應器，能夠改變與第一頻率範圍至少部分不同的第二頻率範圍內的頻率；介電管；以及天線模組，包括在介電管周圍纏繞至少一次的第一單元線圈、在介電管周圍纏繞至少一次的第二單元線圈、以及串聯連接於第一單元線圈與第二單元線圈之間的第一電容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one embodiment of the present disclosure, there can be provided a plasma generating device for performing plasma discharge, the plasma generating device having multiple operation modes including a first mode and a second mode, and including: a first power supply capable of changing a frequency within a first frequency range; a second power supply capable of changing a frequency within a second frequency range that is at least partially different from the first frequency range; a dielectric tube; and an antenna module including a first unit coil wound around the dielectric tube at least one time, a second unit coil wound around the dielectric tube at least one time, and a first capacitor connected in series between the first unit coil and the second unit coil.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:RF電源/第一電源模組/DC電源供應器/DC電源/RF電源模組/電源模組</p>
        <p type="p">210:介電管</p>
        <p type="p">211:第一氣體管/氣體管</p>
        <p type="p">213:第二氣體管/氣體管</p>
        <p type="p">220:天線模組</p>
        <p type="p">250:輔燃氣體供應噴嘴</p>
        <p type="p">300:氣體供應單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2602" publication-number="202618864">
    <tif-files tif-type="multi-tif">
      <tif file="115100660.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生電漿的裝置</chinese-title>
        <english-title>APPARATUS FOR GENERATING PLASMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01J37/32</main-classification>
        <further-classification edition="200601120260120B">H05H1/24</further-classification>
        <further-classification edition="200601120260120B">H05H1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商源多可股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EN2CORE TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴世勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UHM, SAE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李潤星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUN SEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫永勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOHN, YEONG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴世洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SE HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本說明書的一個實施例，提供一種用於產生電漿的裝置，所述裝置包括：腔室，被配置成為電漿提供產生空間；天線模組，與腔室相鄰地放置且被配置成連接至第一電源並在腔室中產生感應電場；電極，與腔室相鄰地放置且被配置成連接至第二電源並輔助產生電漿；感測器，被配置成獲得與電漿的狀況相關的感測資訊；以及控制器，被配置成控制第一電源及第二電源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one embodiment of the present specification, there can be provided an apparatus for generating plasma, comprising: a chamber configured to provide a generating space for the plasma; an antenna module placed adjacent to the chamber and configured to be connected to a first power source and generate induced electric field in the chamber; an electrode placed adjacent to the chamber and configured to be connected to a second power source and assist in a generation of the plasma; a sensor configured to obtain sensing information related to a status of the plasma; and a controller configured to control the first power source and the second power source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:DC電源</p>
        <p type="p">120:RF電源</p>
        <p type="p">210:放電管</p>
        <p type="p">211:氣體管/第一氣體管</p>
        <p type="p">213:第二氣體管/氣體管</p>
        <p type="p">220:天線模組</p>
        <p type="p">230:電極</p>
        <p type="p">250:輔燃氣體供應噴嘴</p>
        <p type="p">300:氣體供應單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2603" publication-number="202619234">
    <tif-files tif-type="multi-tif">
      <tif file="115100693.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁浮裝置及離心泵</chinese-title>
        <english-title>A MAGNETIC LEVITATION DEVICE AND A CENTRIFUGAL PUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H02K5/16</main-classification>
        <further-classification edition="200601120260119B">F04D7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商力威磁浮技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVITRONIX GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史特勒　馬塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STETTLER, MARCEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施內伯格　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEEBERGER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾列塔　娜塔列</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARLETTA, NATALE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛尼　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINNI, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種磁浮裝置，其用於包括碟狀或環狀磁效核心(31)之轉子(3)之非接觸磁浮，其中，該磁浮裝置具有定子(2)，其包括複數個線圈核心(25)，每一線圈核心(25)包括在軸向方向(A)中從第一端(261)延伸至第二端(262)之縱向支腳(26)，及配置在該縱向支腳之該第二端(262)處且在垂直於該軸向方向(A)之徑向方向上延伸之橫向支腳(27)，其中，至少一集中繞組(61)設於每一縱向支腳(26)處，其環繞該各自縱向支腳(26)纏繞，其中，該定子(2)進一步具有可使該轉子(3)插入於其中之杯狀凹槽(211)，其中，該杯狀凹槽(211)配置在該定子(2)之軸向端，其中，該橫向支腳(27)圍繞該杯狀凹槽(211)配置，且其中，用於判定該轉子(3)之該位置之複數個磁場感應器(8)圍繞該杯狀凹槽(211)配置。提供環狀固持裝置(9)用於該磁場感應器(8)，其針對每一磁場感應器(8)具有空腔(95)，該空腔相對於該徑向方向由內側壁(951)及由外側壁(952)定界，其中，該磁場感應器(8)可被推入至該空腔(95)中，且其中，該空腔(95)的尺寸能使該內側壁(951)及該外側壁(952)抵住該磁場感應器(8)而平置。此外，提出具有此一磁浮裝置之離心泵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic levitation device is proposed for contactless magnetic levitation of a rotor (3) comprising a disk-shaped or ring-shaped magnetically effective core (31), wherein the magnetic levitation device has a stator (2) which comprises a plurality of coil cores (25), each of which comprises a longitudinal leg (26) extending from a first end (261) in an axial direction (A) to a second end (262), and a transverse leg (27) which is arranged at the second end (262) of the longitudinal leg and which extends in a radial direction perpendicular to the axial direction (A), wherein at least one concentrated winding (61) is provided at each longitudinal leg (26), which winding surrounds the respective longitudinal leg (26), wherein the stator (2) further has a cup-shaped recess (211) into which the rotor (3) can be inserted, wherein the cup-shaped recess (211) is arranged at an axial end of the stator (2), wherein the transverse legs (27) are arranged around the cup-shaped recess (211), and wherein a plurality of magnetic field sensors (8) for determining the position of the rotor (3) is arranged around the cup-shaped recess (211). A ring-shaped holding device (9) is provided for the magnetic field sensors (8), which has a cavity (95) for each magnetic field sensor (8), which cavity is delimited with respect to the radial direction by an inside wall (951) and by an outside wall (952), wherein the magnetic field sensor (8) can be pushed into the cavity (95), and wherein the cavity (95) is dimensioned such that the inside wall (951) and the outside wall (952) rest flat against the magnetic field sensor (8). Furthermore, a centrifugal pump with such a magnetic levitation device is proposed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:磁浮裝置</p>
        <p type="p">2:定子</p>
        <p type="p">3:轉子</p>
        <p type="p">7:電路板</p>
        <p type="p">9:固持裝置</p>
        <p type="p">10:外殼</p>
        <p type="p">11:外殼蓋</p>
        <p type="p">13:內杯件</p>
        <p type="p">14:凸緣狀突部</p>
        <p type="p">15:外壁</p>
        <p type="p">21:容納罐</p>
        <p type="p">22:護鐵</p>
        <p type="p">25:線圈核心</p>
        <p type="p">26:縱向支腳</p>
        <p type="p">27:橫向支腳</p>
        <p type="p">31:磁效核心</p>
        <p type="p">40:控制單元</p>
        <p type="p">41:電路板</p>
        <p type="p">42:電子組件</p>
        <p type="p">45:連接電纜</p>
        <p type="p">47:電纜襯套</p>
        <p type="p">61:集中繞組</p>
        <p type="p">92:軸向邊緣區域</p>
        <p type="p">101:定子外殼</p>
        <p type="p">102:控制外殼</p>
        <p type="p">105:密封元件</p>
        <p type="p">111:螺釘</p>
        <p type="p">201:彈性密封件</p>
        <p type="p">211:杯狀凹槽</p>
        <p type="p">212:徑向外邊緣</p>
        <p type="p">261:第一端</p>
        <p type="p">262:第二端</p>
        <p type="p">271:末端面</p>
        <p type="p">A:軸向方向</p>
        <p type="p">E:徑向平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2604" publication-number="202617611">
    <tif-files tif-type="multi-tif">
      <tif file="115100694.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水處理方法及水處理裝置，以及水處理裝置之設計方法</chinese-title>
        <english-title>WATER TREATMENT METHOD, WATER TREATMENT DEVICE, AND METHOD FOR DESIGNING WATER TREATMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260120B">C02F1/32</main-classification>
        <further-classification edition="202301120260120B">C02F1/42</further-classification>
        <further-classification edition="202301120260120B">C02F9/00</further-classification>
        <further-classification edition="200601320260120B">C02F101/30</further-classification>
        <further-classification edition="200601320260120B">C02F101/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋悠介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋一重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUSHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水處理方法，具有：從包含溶解氧與有機物之被處理水藉由第1除氧裝置33來去除溶解氧之步驟；對第1除氧裝置33之處理水藉由紫外線照射裝置34來照射紫外線之步驟；以及將紫外線照射裝置34之處理水通水於至少填充有陰離子交換體A之離子交換體填充裝置35之步驟。離子交換體填充裝置35係從紫外線照射裝置34之處理水去除因來自紫外線照射裝置34之紫外線的照射所產生的過氧化氫，紫外線照射裝置34之處理水係以低於160(／h)之空間速度來通水於離子交換體填充裝置35之陰離子交換體A。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water treatment method comprises a step of using a first deoxygenation device 33 to remove dissolved oxygen from a water to be treated containing dissolved oxygen and organic matter, a step of using an ultraviolet light irradiation device 34 to irradiate ultraviolet radiation onto the treated water from the first deoxygenation device 33, and a step of passing the treated water from the ultraviolet light irradiation device 34 through at least an ion exchanger-packed device 35 packed with an anion exchanger A. The ion exchanger-packed device 35 removes, from the treated water from the ultraviolet light irradiation device 34, the hydrogen peroxide produced by the irradiation of ultraviolet radiation from the ultraviolet light irradiation device 34, and the treated water from the ultraviolet light irradiation device 34 flows through the anion exchanger A of the ion exchanger-packed device 35 at a space velocity of less than 160 (/h).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水處理裝置</p>
        <p type="p">2:前處理裝置</p>
        <p type="p">3:純水製造裝置</p>
        <p type="p">21:過濾器</p>
        <p type="p">22:活性碳塔</p>
        <p type="p">31:離子去除裝置</p>
        <p type="p">32:逆滲透膜裝置</p>
        <p type="p">33:第1除氧裝置</p>
        <p type="p">34:紫外線照射裝置</p>
        <p type="p">35:離子交換體填充裝置</p>
        <p type="p">36:第2除氧裝置</p>
        <p type="p">A:陰離子交換體</p>
        <p type="p">K:陽離子交換體</p>
        <p type="p">L1:母管</p>
        <p type="p">D:流通方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2605" publication-number="202619573">
    <tif-files tif-type="multi-tif">
      <tif file="115100699.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100699</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用非揮發性記憶體單元之商業化標準現場可編程邏輯閘陣列（ＦＰＧＡ）積體電路晶片組成之邏輯運算驅動器</chinese-title>
        <english-title>LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS USING NON-VOLATILE MEMORY CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260120B">H10D89/00</main-classification>
        <further-classification edition="202301120260120B">H10B41/00</further-classification>
        <further-classification edition="202301120260120B">H10B61/00</further-classification>
        <further-classification edition="202301120260120B">H10B63/00</further-classification>
        <further-classification edition="202001120260120B">H03K19/177</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成真股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICOMETRUE COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李進源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林茂雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MOU-SHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一晶片封裝結構包括一中介載板、一FPGA IC晶片位在中介板上，其中FPGA IC晶片包括一可編程邏輯區塊用以將其輸入值執行一邏輯運算操作，其中可編程邏輯區塊包括一查找表(look-up table)用以提供該邏輯運算操作的複數結果值，該些結果值係分別與可編程邏輯區塊的輸入值的結合或組合相關，其中可編程邏輯區塊係根據其輸入值的組合(或結合)從該些結果值之中選擇其中之一將其輸出，以及複數非揮發性記憶體單元分別用以儲存該些結果值；複數的第一金屬凸塊位在中介載板與FPGA IC晶片之間，以及底部填充材料(underfill)位在中介載板與FPGA IC晶片之間，其中此底部填充材料將第一金屬凸塊包覆住。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip package comprises an interposer;an FPGA IC chip over the interposer, wherein the FPGA IC chip comprises a programmable logic block configured to perform a logic operation on its inputs, wherein the programmable logic block comprises a look-up table configured to be provided with multiple resulting values of the logic operation on multiple combinations of the inputs of the programmable logic block respectively, wherein the programmable logic block is configured to select, in accordance with one of the combinations of its inputs, one from the resulting values into its output, and multiple non-volatile memory cells configured to save the resulting values respectively; multiple first metal bumps between the interposer and the FPGA IC chip; and an underfill between the interposer and the FPGA IC chip, wherein the underfill encloses the first metal bumps.</p>
      </isu-abst>
      <representative-img>
        <p type="p">583:金屬/銲錫凸塊</p>
        <p type="p">77e:接墊</p>
        <p type="p">77:交互連接線金屬層</p>
        <p type="p">582:金屬栓塞</p>
        <p type="p">585:開口或孔洞</p>
        <p type="p">564:底部填充材料</p>
        <p type="p">563:接合連接點</p>
        <p type="p">551:中介載板</p>
        <p type="p">114:底部填充材料</p>
        <p type="p">565:聚合物層</p>
        <p type="p">100:半導體晶片</p>
        <p type="p">79:BISD</p>
        <p type="p">560:第一交互連接線結構</p>
        <p type="p">310:記憶體驅動器</p>
        <p type="p">300:邏輯驅動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2606" publication-number="202619389">
    <tif-files tif-type="multi-tif">
      <tif file="115100721.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低潛時應用的無線網路配置</chinese-title>
        <english-title>WIRELESS NETWORK CONFIGURATION FOR LOW-LATENCY APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260202B">H04W52/02</main-classification>
        <further-classification edition="202301120260202B">H04W72/04</further-classification>
        <further-classification edition="200901120260202B">H04W88/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡塔　史利尼威斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAR, SRINIVAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴文森　安德魯麥金隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIDSON, ANDREW MACKINNON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷馬查德利　山迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOMCHAUDHURI, SANDIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>努拉尼克里希南　內拉坎丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NURANI KRISHNAN, NEELAKANTAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊德　西蒙貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAND, SIMON JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案內容提供用於在無線網路中的低潛時通訊的系統、方法和裝置，包括在電腦儲存媒體上編碼的電腦程式。在一些實現方式中，無線站（STA）可以回應於啟動與潛時受限（LR）資料訊務相關聯的應用，向無線網路中的根存取點（AP）發送資料通信期請求。在一些態樣中，資料通信期請求可以指示用於攜帶LR資料訊務的一或多個優選通道。在一些其他態樣中，資料通信期請求可以指示用於交換LR資料訊務的一或多個優選時間。在一些實現方式中，根AP可以基於在資料通信期請求中指示的優選時間或頻率資源，與STA建立LR資料路徑。LR資料路徑可以包括被保留用於在根AP與STA之間的LR資料訊務的時間或頻率資源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for low-latency communications in wireless networks. In some implementations, a wireless station (STA) may transmit a data session request to a root access point (AP) in a wireless network responsive to activating an application associated with latency restricted (LR) data traffic. In some aspects, the data session request may indicate one or more preferred channels to carry the LR data traffic. In some other aspects, the data session request may indicate one or more preferred times to exchange the LR data traffic. In some implementations, the root AP may establish an LR data path with the STA based on the preferred time or frequency resources indicated in the data session request. The LR data path may include time or frequency resources that are reserved for LR data traffic between the root AP and the STA.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:序列圖</p>
        <p type="p">502:LR資料通信期請求</p>
        <p type="p">504:鏈路配置資訊</p>
        <p type="p">506:鏈路配置資訊</p>
        <p type="p">508:LR資料訊務</p>
        <p type="p">507:鏈路配置</p>
        <p type="p">510:根AP</p>
        <p type="p">520:中繼器</p>
        <p type="p">530:STA</p>
        <p type="p">540:客戶端設備</p>
        <p type="p">550:LR資料路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2607" publication-number="202617490">
    <tif-files tif-type="multi-tif">
      <tif file="115100785.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童推車</chinese-title>
        <english-title>STROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">B62B7/14</main-classification>
        <further-classification edition="200601120260122B">B62B9/10</further-classification>
        <further-classification edition="200601120260122B">B62B9/12</further-classification>
        <further-classification edition="200601120260122B">B62B7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何朋才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, PENGCAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪爾學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ERXUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兒童推車，包括車架、座椅組件、支撐桿組以及鎖定機構。座椅組件可活動地設於所述車架上，且用於承載兒童。支撐桿組分別與車架、座椅組件活動連接。支撐桿組用於調整座椅組件的高度。鎖定機構，可選擇地鎖定或釋鎖支撐桿組，以使得座椅組件固定於某一高度位置處或使得座椅組件的高度可調。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stroller including a frame, a seat assembly, a support rod group and a locking mechanism is provided. The seat assembly is movably arranged on the frame and adapted to carry a child. The support rod group is movably connected to the frame and seat assembly respectively. The support rod set is adapted to adjust the height of the seat assembly. The locking mechanism can selectively lock or unlock the support rod group so that the seat assembly is fixed at a certain height position or the height of the seat assembly is adjustable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車架</p>
        <p type="p">110:扶手組件</p>
        <p type="p">111:前扶手</p>
        <p type="p">112:側扶手</p>
        <p type="p">120:前輪架</p>
        <p type="p">130:後輪架</p>
        <p type="p">140:支撐桿</p>
        <p type="p">150:連接桿</p>
        <p type="p">200:座椅組件</p>
        <p type="p">210:座椅架</p>
        <p type="p">220:座桿</p>
        <p type="p">310:支撐桿組</p>
        <p type="p">320:滑動組件</p>
        <p type="p">400:鎖定機構</p>
        <p type="p">500:推手</p>
        <p type="p">510:推手本體</p>
        <p type="p">520:推手桿</p>
        <p type="p">600:前輪組件</p>
        <p type="p">700:後輪組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2608" publication-number="202617253">
    <tif-files tif-type="multi-tif">
      <tif file="115100792.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＨＦ蒸餾及熔融鹽電解以從氫與氦分離出氚與氘</chinese-title>
        <english-title>HF DISTILLATION AND MOLTEN SALT ELECTROLYSIS TO SEPARATE TRITIUM AND DEUTERIUM FROM HYDROGEN AND HELIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">B01D59/04</main-classification>
        <further-classification edition="200601120260126B">B01D59/40</further-classification>
        <further-classification edition="200601120260126B">B01D59/50</further-classification>
        <further-classification edition="200601120260126B">B01D3/14</further-classification>
        <further-classification edition="200601120260126B">C01B4/00</further-classification>
        <further-classification edition="200601120260126B">C01B7/19</further-classification>
        <further-classification edition="200601120260126B">G21C19/307</further-classification>
        <further-classification edition="200601120260126B">G21F9/04</further-classification>
        <further-classification edition="200601120260126B">G21F9/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西屋電器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉赫達　愛德華　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAHODA, EDWARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於分離基於氫同位素之化合物之方法。該方法包括製備供蒸餾方法之進料流，將該進料流進料至蒸餾單元之塔內，從該蒸餾單元回收第一餾分，及從該蒸餾單元回收第二餾分。該進料流包含氟化氫、氟化氘及氟化氚。該塔係經組態以在0.1大氣壓至2大氣壓範圍內之壓力下操作。該第一餾分係富含TF之餾分及該第二餾分係富含DF之餾分。本發明亦提供以該用於分離基於氫同位素之化合物之方法產生之核燃料組合物，一種用於從熔合反應器之產物流產生燃料之方法，以及本發明亦提供一種用於分餾進料流之氫同位素之氟化物之蒸餾單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for separating hydrogen isotope-based compounds is provided. The process comprises preparing a feed stream for a distillation process, feeding the feed stream into a column of a distillation unit, recovering a first fraction from the distillation unit, and recovering a second fraction from the distillation unit. The feed stream comprises hydrogen fluoride, deuterium fluoride, and tritium fluoride. The column is configured to operate at a pressure in a range of 0.1 atmospheres to 2 atmospheres. The first fraction is a TF-rich fraction and the second fraction is a DF-rich fraction. A nuclear fuel composition produced with the process for separating hydrogen isotope-based compounds, a process for producing a fuel from a product stream of a fusion reactor are also provided, and a distillation unit for fractionating fluorides of hydrogen isotopes of a feed stream are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">1100:製備</p>
        <p type="p">1200:蒸餾</p>
        <p type="p">1300:回收</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2609" publication-number="202619045">
    <tif-files tif-type="multi-tif">
      <tif file="115100796.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100796</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置和用於先進散熱的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR ADVANCED THERMAL DISSIPATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01L23/02</main-classification>
        <further-classification edition="200601120260120B">H01L23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喜秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置具有基板及安置在該基板上方之半導體晶粒。膠帶安置於該半導體晶粒上方。囊封體沈積於該基板、半導體晶粒及膠帶上方。該膠帶經移除以在該半導體晶粒上方之該囊封體中留下空腔。屏蔽層形成於該囊封體及半導體晶粒上方。熱散播器安置在該屏蔽層上方。該熱散播器包括延伸至該囊封體之該空腔中的突起部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has a substrate and a semiconductor die disposed over the substrate. A tape is disposed over the semiconductor die. An encapsulant is deposited over the substrate, semiconductor die, and tape. The tape is removed to leave a cavity in the encapsulant over the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. A heat spreader is disposed over the shielding layer. The heat spreader includes a protrusion extending into the cavity of the encapsulant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104a:半導體晶粒</p>
        <p type="p">104b:半導體晶粒</p>
        <p type="p">108:背部或非主動表面</p>
        <p type="p">150:系統級封裝裝置</p>
        <p type="p">152:基板</p>
        <p type="p">154:絕緣層</p>
        <p type="p">156:導電層</p>
        <p type="p">160:離散組件</p>
        <p type="p">162:板至板(B2B)連接器</p>
        <p type="p">176:囊封體或模製化合物</p>
        <p type="p">180:導電屏蔽層</p>
        <p type="p">182:熱界面材料(TIM)</p>
        <p type="p">190:階梯式熱散播器</p>
        <p type="p">192:突起部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2610" publication-number="202618387">
    <tif-files tif-type="multi-tif">
      <tif file="115100798.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機</chinese-title>
        <english-title>CAMERA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">G02B13/02</main-classification>
        <further-classification edition="202101120260122B">G02B7/02</further-classification>
        <further-classification edition="200601120260122B">G02B17/04</further-classification>
        <further-classification edition="200601120260122B">G02B13/18</further-classification>
        <further-classification edition="200601120260122B">G02B3/00</further-classification>
        <further-classification edition="200601120260122B">G02B9/64</further-classification>
        <further-classification edition="200601120260122B">G02B27/00</further-classification>
        <further-classification edition="202301120260122B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商核心光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COREPHOTONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博拉爾　伊塔馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORAL, ITAMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝梅什　齊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEMESH, ZIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩爾曼　阿薩夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PELLMAN, ASAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈登堡　以法莲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDENBERG, EPHRAIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種相機，其包含：一影像感測器，具有一感測器對角線SD；以及一鏡頭，具有N個透鏡元件L1-LN，其中N ≥ 6，該些透鏡元件從一第一透鏡元件L1開始，沿著一透鏡光軸OA，從一物體側朝向一影像側排列，並且該鏡頭具有一有效焦距EFL；其中該鏡頭具有一35毫米等效焦距35mm EqFL及一光圈值f/#，並且滿足30毫米(mm) ＜ 該35毫米等效焦距35mm EqFL ＜ 100毫米(mm)，該光圈值f/# ＜ 1.9；其中該相機整合在一移動裝置中並且配置成用以通過將一後焦距BFL收縮到一收縮後焦距c-BFL使一彈出狀態切換到一收縮狀態並且通過將該收縮後焦距c-BFL彈出到該後焦距BFL使該收縮狀態切換到該彈出狀態，該彈出狀態與一總軌道長度TTL相關，該收縮狀態與一收縮總軌道長度c-TTL，其中滿足該收縮總軌道長度c-TTL ＜ 該總軌道長度TTL且該收縮後焦距c-BFL ＜ 該後焦距BFL，其中該總軌道長度TTL/該感測器對角線SD ＜ 1.2，並且其中該收縮總軌道長度c-TTL/該感測器對角線SD ＜ 1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera, comprising: an image sensor having a full sensor diagonal (SD); and a lens with N≥6 lens elements L1-LN arranged from an object side towards an image side along a lens optical axis (OA) starting with a first lens element L1 and having an effective focal length (EFL), wherein the lens has a 35mm equivalent focal length (35mm EqFL) in the range of 30mm ＜ 35mm EqFL ＜ 100mm and a f number (f/#) ≤ 1.9, wherein the camera is integrated in a mobile device and configured to switch from a pop-out state associated with a total track length TTL to a collapsed state associated with a collapsed total track length (c-TTL) that fulfills c-TTL ＜ TTL and vice versa by collapsing a back focal length BFL to a collapsed BFL (c-BFL) ＜ BFL and vice versa, wherein TTL/SD ＜ 1.2, and wherein c-TTL/SD ＜ 1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:鏡頭系統</p>
        <p type="p">302:彈出式鏡頭</p>
        <p type="p">304:影像感測器</p>
        <p type="p">306:光學元件</p>
        <p type="p">308:透鏡光軸</p>
        <p type="p">BFL:後焦距</p>
        <p type="p">L1~L7:透鏡元件</p>
        <p type="p">S&lt;sub&gt;2&lt;/sub&gt;~S&lt;sub&gt;15&lt;/sub&gt;:表面</p>
        <p type="p">T&lt;sub&gt;Lens&lt;/sub&gt;:透鏡厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2611" publication-number="202616975">
    <tif-files tif-type="multi-tif">
      <tif file="115100803.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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        <document-id>
          <doc-number>202616975</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扣具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">A44B11/25</main-classification>
        <further-classification edition="200601120260121B">A44B15/00</further-classification>
        <further-classification edition="200601120260121B">A44B11/26</further-classification>
        <further-classification edition="200601120260121B">A44B11/20</further-classification>
        <further-classification edition="200601120260121B">A47D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程滿群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種扣具，其包含第一扣件、第二扣件及釋鎖操作件，第一扣件包含鎖定部，第二扣件包含對插配鎖部，第一扣件與第二扣件沿對插方向對插，以使鎖定部沿側面方向與對插配鎖部鎖合，釋鎖操作件內嵌於第一扣件並與鎖定部連動設置，釋鎖操作件還外露於第一扣件並可相對於第一扣件滑移，釋鎖操作件在相對於第一扣件滑移的過程中驅使鎖定部沿側面方向做遠離對插配鎖部的運動而與對插配鎖部釋鎖。本發明的扣具釋鎖操作省力並且釋鎖便捷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:扣具</p>
        <p type="p">3a:第一釋鎖操作件</p>
        <p type="p">3b:第二釋鎖操作件</p>
        <p type="p">5:對插配鎖部</p>
        <p type="p">6:彈性件</p>
        <p type="p">22:卡條</p>
        <p type="p">24:C型擋條</p>
        <p type="p">25:限位擋塊</p>
        <p type="p">31a:第一頂推部</p>
        <p type="p">31b:第二頂推部</p>
        <p type="p">33:限位凸起</p>
        <p type="p">41a:第一彈臂</p>
        <p type="p">41b:第二彈臂</p>
        <p type="p">43a:第一配頂部</p>
        <p type="p">43b:第二配頂部</p>
        <p type="p">221:上限位抵擋部</p>
        <p type="p">222:下限位抵擋部</p>
        <p type="p">441:階梯結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2612" publication-number="202617677">
    <tif-files tif-type="multi-tif">
      <tif file="115100844.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽化合物、聚合物、阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT COMPOUND, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07C211/63</main-classification>
        <further-classification edition="200601120260202B">C07C309/10</further-classification>
        <further-classification edition="200601120260202B">C07C309/12</further-classification>
        <further-classification edition="200601120260202B">C07C381/12</further-classification>
        <further-classification edition="200601120260202B">C07D333/76</further-classification>
        <further-classification edition="200601120260202B">C08F220/38</further-classification>
        <further-classification edition="200601120260202B">G03F7/004</further-classification>
        <further-classification edition="200601120260202B">G03F7/20</further-classification>
        <further-classification edition="200601120260202B">G03F7/32</further-classification>
        <further-classification edition="200601120260202B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊朝美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原敬之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口智成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, TOMONARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供不論是正型抑或是負型皆係高感度，且LWR及CDU經改善之阻劑組成物；及使用其之圖案形成方法。&lt;br/&gt;  解決手段為由具有聚合性不飽和鍵與經至少1個碘原子取代之芳香族基介隔碳數2以上之碳鏈鍵結之結構的磺酸根陰離子、以及鋶陽離子或錪陽離子所構成之鎓鹽化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt compound consisting of a sulfonate anion having the structure that a polymerizable unsaturated bond is linked to an iodized aromatic group via a carbon chain of two or more carbon atoms and a sulfonium or iodonium cation is provided. A resist composition comprising a polymer comprising repeat units derived from the onium salt has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2613" publication-number="202618737">
    <tif-files tif-type="multi-tif">
      <tif file="115100848.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膽固醇液晶顯示裝置及其驅動方法</chinese-title>
        <english-title>CHOLESTERIC LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">G09G3/20</main-classification>
        <further-classification edition="200601120260122B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慧誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種膽固醇液晶顯示裝置的驅動方法，其中膽固醇液晶顯示裝置包括顯示面板及驅動電路部，且顯示面板包括掃描電極及資料電極。該方法包括：利用驅動電路部以依序地啟動在顯示面板內的各掃描電極；在已啟動的掃描電極的脈衝寬度調變(PWM)掃描程序中的第一階段的期間，利用驅動電路部向已啟動的掃描電極上的像素電路施加第一交流電壓脈衝；在PWM掃描程序的第二階段的期間，利用驅動電路部施加第二交流電壓脈衝至已啟動的掃描電極上的像素電路。第一交流電壓脈衝的第一電壓振幅及第一頻率係分別不同於第二交流電壓脈衝的第二電壓振幅及第二頻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for driving a cholesteric liquid crystal display device is provided. The method includes the following steps: utilizing a driving circuit section to sequentially activate each scanning electrode within a display panel; utilizing the driving circuit section to apply first alternating-current (AC) voltage pulses to pixel circuits on an activated scanning electrode during a first stage within a pulse-width modulation (PWM) scanning procedure of an activated scanning electrode; and utilizing the driving circuit section to apply second AC voltage pulses to the pixel circuits on the activated scanning electrode during a second stage of the PWM scanning procedure. A first voltage amplitude and a first period of the first AC voltage pulses are different from a second voltage amplitude and a second period of the second AC voltage pulses, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:流程</p>
        <p type="p">1410,1420,1430:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2614" publication-number="202618738">
    <tif-files tif-type="multi-tif">
      <tif file="115100849.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100849</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膽固醇液晶顯示裝置及其驅動方法</chinese-title>
        <english-title>CHOLESTERIC LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G09G3/20</main-classification>
        <further-classification edition="200601120260126B">G02F1/137</further-classification>
        <further-classification edition="200601120260126B">G02F1/133</further-classification>
        <further-classification edition="200601120260126B">H03K7/08</further-classification>
        <further-classification edition="202101120260126B">G01K11/165</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慧誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種膽固醇液晶顯示裝置的驅動方法，其中膽固醇液晶顯示裝置包括顯示面板及驅動電路部，且顯示面板包括掃描電極及資料電極。該方法包括：利用驅動電路部以依序地啟動在顯示面板內的各掃描電極；在已啟動的掃描電極的脈衝寬度調變(PWM)掃描程序中的第一階段的期間，利用驅動電路部向已啟動的掃描電極上的像素電路施加第一交流電壓脈衝；在PWM掃描程序的第二階段的期間，利用驅動電路部施加第二交流電壓脈衝至已啟動的掃描電極上的像素電路。第一交流電壓脈衝的第一電壓振幅及第一頻率係分別不同於第二交流電壓脈衝的第二電壓振幅及第二頻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for driving a cholesteric liquid crystal display device is provided. The method includes the following steps: utilizing a driving circuit section to sequentially activate each scanning electrode within a display panel; utilizing the driving circuit section to apply first alternating-current (AC) voltage pulses to pixel circuits on an activated scanning electrode during a first stage within a pulse-width modulation (PWM) scanning procedure of an activated scanning electrode; and utilizing the driving circuit section to apply second AC voltage pulses to the pixel circuits on the activated scanning electrode during a second stage of the PWM scanning procedure. A first voltage amplitude and a first period of the first AC voltage pulses are different from a second voltage amplitude and a second period of the second AC voltage pulses, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:流程</p>
        <p type="p">1410,1420,1430:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2615" publication-number="202618436">
    <tif-files tif-type="multi-tif">
      <tif file="115100850.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光罩、及顯示裝置之製造方法</chinese-title>
        <english-title>PHOTOMASK, AND METHOD FOR MANUFACTURING A DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260123B">G03F1/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林周平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有優異轉印性能之光罩，藉由使用中紫外曝光光進行曝光而將微細之孔圖案轉印至被轉印體上。  &lt;br/&gt;本發明之光罩係用以使用中紫外曝光光於被轉印體上形成尺寸為Dp且Dp≦3 μm之孔圖案之顯示裝置製造用之光罩，透明基板上具有包含孔圖案之轉印用圖案，轉印用圖案中之孔圖案包含被半色調區域包圍之透光部，透光部與半色調區域相對於用以對光罩進行曝光之中紫外曝光光中包含之基準波長之光的相位差θ為約180度，並且半色調區域對基準波長之光之透過率T為10%≦T≦35%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a photomask having an excellent transfer performance, which is capable of transferring a fine hole pattern on a transfer object by exposure using middle ultraviolet exposure light. &lt;br/&gt; A photomask for use in manufacture of a display device is adapted to form a hole pattern, which has a size Dp where Dp ≤ 3μm, on a transfer object by using middle ultraviolet exposure light. The photomask has a transfer pattern formed on a transparent substrate and including the hole pattern. The hole pattern in the transfer pattern comprises a light transmitting portion surrounded by a halftone region. With respect to a reference wavelength included in the middle ultraviolet light for exposure of the photomask, a phase difference 0 is approximately equal to 180 degrees between the light transmitting portion and the halftone region. A transmittance T of the halftone region with respect to the reference wavelength satisfies 10% ≤T ≤ 35%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:半色調區域</p>
        <p type="p">12:透光部</p>
        <p type="p">13:區分壁</p>
        <p type="p">20:第2光罩</p>
        <p type="p">d:最短相隔距離</p>
        <p type="p">Dm:尺寸</p>
        <p type="p">Dp:尺寸</p>
        <p type="p">P:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2616" publication-number="202618330">
    <tif-files tif-type="multi-tif">
      <tif file="115100922.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>受光裝置及測距裝置</chinese-title>
        <english-title>LIGHT RECEIVING DEVICE AND DISTANCE MEASURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">G01S17/08</main-classification>
        <further-classification edition="202001120260120B">G01S7/491</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西野辰樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINO, TATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之受光裝置具備：受光元件，其相應於光子之受光產生信號；讀出電路，其讀出受光元件產生之信號；及保護電路，其設置於受光元件與讀出電路之間，保護讀出電路之電路元件免受過電壓之害。又，本揭示之測距裝置具有上述之構成之受光裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:測距裝置</p>
        <p type="p">10:被攝體</p>
        <p type="p">20:光源部</p>
        <p type="p">30:受光裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2617" publication-number="202619619">
    <tif-files tif-type="multi-tif">
      <tif file="115100973.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性儲存裝置</chinese-title>
        <english-title>MAGNETIC STORAGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260120B">H10N50/10</main-classification>
        <further-classification edition="202301120260120B">H10N50/85</further-classification>
        <further-classification edition="202301120260120B">H10B61/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小池剛央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIKE, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野本梨菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMOTO, RINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金谷宏行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAYA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山昌彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一個實施例，一種磁性儲存裝置包括第一及第二磁性層及非磁性層，其中非磁性層包括含有鎂及氧的第一氧化物層、含有鎂及氧的第二氧化物層、含有鋅及氧的第三氧化物層、含有第一預定元素及氧的第四氧化物層、以及含有第二預定元素及氧的第五氧化物層，且第一預定元素的氧化物的晶體結構及第二預定元素的氧化物的晶體結構各自為岩鹽結構。第一預定元素及第二預定元素各自具有較鋅的氧化物形成自由能大的氧化物形成自由能，且第一預定元素的氧化物及第二預定元素的氧化物各自具有較鎂的氧化物的帶隙窄的帶隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one embodiment, a magnetic storage device includes first and second magnetic layers and a non-magnetic layer, where the non-magnetic layer includes a first oxide layer containing magnesium and oxygen, a second oxide layer containing magnesium and oxygen, a third oxide layer containing zinc and oxygen, a fourth oxide layer containing a first predetermined element and oxygen, and a fifth oxide layer containing a second predetermined element and oxygen, and a crystal structure of an oxide of the first predetermined element and a crystal structure of an oxide of the second predetermined element are each a rock salt structure. The first predetermined element and the second predetermined element each have an oxide formation free energy greater than an oxide formation free energy of zinc, and the oxide of the first predetermined element and the oxide of the second predetermined element each have a bandgap narrower than a bandgap of an oxide of magnesium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲存層/FeCoB層</p>
        <p type="p">20:參考層/FeCoB層</p>
        <p type="p">30:隧道障壁層</p>
        <p type="p">31:氧化物層</p>
        <p type="p">32:氧化物層</p>
        <p type="p">33:氧化物層/ZnO層</p>
        <p type="p">34a:氧化物層</p>
        <p type="p">35a:氧化物層</p>
        <p type="p">100:磁阻效應元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2618" publication-number="202618032">
    <tif-files tif-type="multi-tif">
      <tif file="115101011.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磊晶生長摻硼矽鍺層之方法和系統及包括摻硼矽鍺層之場效電晶體</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR EPITAXIALLY GROWING BORON DOPED SILICON GERMANIUM LAYERS AND FIELD EFFECT TRANSISTORS INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C23C16/06</main-classification>
        <further-classification edition="200601120260123B">C23C16/30</further-classification>
        <further-classification edition="200601120260123B">C23C16/44</further-classification>
        <further-classification edition="200601120260123B">C23C16/455</further-classification>
        <further-classification edition="200601120260123B">C23C16/52</further-classification>
        <further-classification edition="200601120260123B">C30B25/02</further-classification>
        <further-classification edition="200601120260123B">C30B29/52</further-classification>
        <further-classification edition="202501120260123B">H10D84/03</further-classification>
        <further-classification edition="202501120260123B">H10D62/17</further-classification>
        <further-classification edition="202501120260123B">H10D64/66</further-classification>
        <further-classification edition="202501120260123B">H10D48/00</further-classification>
        <further-classification edition="202501120260123B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得森　巴柏沙　立馬　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERSEN BARBOSA LIMA, LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈莎卡　瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAZAKA, RAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於磊晶生長摻硼矽鍺層之方法和裝置。該等層可例如用作場效電晶體中的p型源極及/或汲極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and devices for epitaxially growing boron doped silicon germanium layers. The layers may be used, for example, as a p-type source and/or drain regions in field effect transistors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:基材提供步驟</p>
        <p type="p">104:沉積步驟</p>
        <p type="p">108:蝕刻步驟</p>
        <p type="p">110:循環迴路/重複沉積步驟104和蝕刻步驟108</p>
        <p type="p">112:方法結束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2619" publication-number="202617069">
    <tif-files tif-type="multi-tif">
      <tif file="115101016.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有降噪功能的偵測心衝擊波裝置及感測系統</chinese-title>
        <english-title>BALLISTOCARDIOGRAM DETECTION DEVICE WITH NOISE REDUCTION FUNCTION AND SENSING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">A61B5/11</main-classification>
        <further-classification edition="200601120260126B">A61B5/0255</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維思感創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMETRICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張儀中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI-CHUNG, CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有降噪功能的偵測心衝擊波裝置及感測系統。偵測心衝擊波裝置包括承壓裝置、力感測器、振動感測器以及訊號處理模組。承壓裝置直接或間接放置於一受測體的身體下方或背部。力感測器及振動感測器設置於承壓裝置上。振動感測器與力感測器之間的距離小於5公分。訊號處理模組電連接力感測器及振動感測器。訊號處理模組用於接收力感測器及振動感測器所輸出的訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ballistocardiogram detection device with noise reduction function and a system are provided. The ballistocardiogram detection device includes a pressure-bearing device, a force sensor, a vibration sensor and a signal processing module. The pressure-bearing device is placed directly or indirectly under a body or back of a subject. The force sensor and the vibration sensor are installed on the pressure-bearing device. A distance between the vibration sensor and the force sensor is less than 5 cm. The signal processing module is electrically connected to the force sensor and the vibration sensor. The signal processing module is used to receive signals output by the force sensor and the vibration sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承壓裝置</p>
        <p type="p">2:力感測器</p>
        <p type="p">3:振動感測器</p>
        <p type="p">4:訊號感測模組</p>
        <p type="p">U:受測體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2620" publication-number="202619502">
    <tif-files tif-type="multi-tif">
      <tif file="115101040.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260121B">H10B80/00</main-classification>
        <further-classification edition="200601120260121B">H01L23/00</further-classification>
        <further-classification edition="200601120260121B">H01L25/00</further-classification>
        <further-classification edition="202301120260121B">H01L25/065</further-classification>
        <further-classification edition="202301120260121B">H01L25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小池豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OIKE, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山部和治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMABE, KAZUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之實施形態，係有關於半導體記憶裝置。  &lt;br/&gt;　　半導體記憶裝置，係具備有第1胞晶片、和第2胞晶片。第1胞晶片，係具備有第1層積體、和作為第1源極線而被作使用之第1導電體層、和被與第1導電體層作電性連接之第2導電體層、以及複數之第1接合墊片。第2胞晶片，係具備有第2層積體、和作為第2源極線而被作使用之第3導電體層、和分別被與複數之第1接合墊片作接合之複數之第2接合墊片、和以將複數之第2接合墊片作連結的方式而被作設置並且被與第3導電體層作電性連接之第4導電體層。第2導電體層以及第4導電體層，係被作電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">C11:接觸插塞</p>
        <p type="p">C12:接觸插塞</p>
        <p type="p">C13:接觸插塞</p>
        <p type="p">C14:接觸插塞</p>
        <p type="p">C15:接觸插塞</p>
        <p type="p">C21:接觸插塞</p>
        <p type="p">C22:接觸插塞</p>
        <p type="p">C23:接觸插塞</p>
        <p type="p">C24:接觸插塞</p>
        <p type="p">C31:接觸插塞</p>
        <p type="p">C32:接觸插塞</p>
        <p type="p">C33:接觸插塞</p>
        <p type="p">C41:接觸插塞</p>
        <p type="p">C42:接觸插塞</p>
        <p type="p">D11:導電體層</p>
        <p type="p">D12:導電體層</p>
        <p type="p">D13:導電體層</p>
        <p type="p">D14:導電體層</p>
        <p type="p">D21:導電體層</p>
        <p type="p">D22:導電體層</p>
        <p type="p">D23:導電體層</p>
        <p type="p">D31:導電體層</p>
        <p type="p">D32:導電體層</p>
        <p type="p">PD:接合墊片</p>
        <p type="p">PD11:接合墊片</p>
        <p type="p">PD12:接合墊片</p>
        <p type="p">PD13:接合墊片</p>
        <p type="p">PD21:接合墊片</p>
        <p type="p">PD22:接合墊片</p>
        <p type="p">PD23:接合墊片</p>
        <p type="p">PD31:接合墊片</p>
        <p type="p">PD32:接合墊片</p>
        <p type="p">PD33:接合墊片</p>
        <p type="p">PD34:接合墊片</p>
        <p type="p">PD41:接合墊片</p>
        <p type="p">PD42:接合墊片</p>
        <p type="p">PD43:接合墊片</p>
        <p type="p">PD44:接合墊片</p>
        <p type="p">MS1:層積體</p>
        <p type="p">MS2:層積體</p>
        <p type="p">Tr11:電晶體</p>
        <p type="p">Tr12:電晶體</p>
        <p type="p">Tr13:電晶體</p>
        <p type="p">CH21:接觸插塞</p>
        <p type="p">CH31:接觸插塞</p>
        <p type="p">ILG2:金屬配線層群</p>
        <p type="p">ILG3:金屬配線層群</p>
        <p type="p">PRC:周邊電路</p>
        <p type="p">SB11:基板</p>
        <p type="p">1:半導體記憶裝置</p>
        <p type="p">11:記憶體胞陣列</p>
        <p type="p">30:周邊電路晶片</p>
        <p type="p">31:絕緣層</p>
        <p type="p">40:下部胞晶片</p>
        <p type="p">41:導電體層</p>
        <p type="p">42:導電體層</p>
        <p type="p">43:導電體層</p>
        <p type="p">44,50:上部胞晶片</p>
        <p type="p">51:導電體層</p>
        <p type="p">52:導電體層</p>
        <p type="p">53:導電體層</p>
        <p type="p">54:絕緣層</p>
        <p type="p">300:上面</p>
        <p type="p">400:上面</p>
        <p type="p">401:底面</p>
        <p type="p">500:上面</p>
        <p type="p">501:底面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2621" publication-number="202619080">
    <tif-files tif-type="multi-tif">
      <tif file="115101066.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有密碼電路之標準商業化ＦＰＧＡ　ＩＣ晶片的多晶片封裝結構</chinese-title>
        <english-title>MULTICHIP PACKAGE COMPRISING A STANDARD COMMODITY FPGA IC CHIP WITH CRYPTOGRAPHY CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L23/31</main-classification>
        <further-classification edition="200601120260122B">H01L23/48</further-classification>
        <further-classification edition="202501120260122B">H10H20/85</further-classification>
        <further-classification edition="200601120260122B">H01L23/528</further-classification>
        <further-classification edition="200601120260122B">H01L23/538</further-classification>
        <further-classification edition="201301120260122B">G06F21/76</further-classification>
        <further-classification edition="202001120260122B">G06F30/34</further-classification>
        <further-classification edition="201301120260122B">G06F21/44</further-classification>
        <further-classification edition="200601120260122B">G11C17/16</further-classification>
        <further-classification edition="200601120260122B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成真股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICOMETRUE COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李進源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林茂雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MOU-SHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一多晶片封裝結構，其包括一第一晶片封裝結構，該第一晶片封裝結構包括一第一半導體IC晶片，一聚合物層位在第一半導體IC晶片的側壁之外並從其延伸的空間中，一第一封裝穿孔連接線位在該第一聚合物層中，以及一第一交互連接線結構位在該第一半導體IC晶片、該第一聚合物層及該第一封裝穿孔連接線的下方，其中該第一半導體IC晶片包括複數揮發性記憶體單元及一選擇電路，該些揮發性記憶體單元用以儲存與用於一查找表(LUT)的複數結果值相關聯的第一資料，該選擇電路用以依據該第一輸入資料組從一第二輸入資料組中選擇一資料，以作為用於該邏輯操作的一輸出資料， 一第一金屬凸塊位在該第一晶片封裝結構下方，及一非揮發性記憶體IC晶片位在該第一晶片封裝結構上方，其中該非揮發性記憶體IC晶片包括複數第一非揮發性記憶體單元，用以儲存與該查找表(LUT)的該些結果值相關聯的一第二資料，其中該第一資料係與該第二資料相關聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multichip package comprising: a first chip package comprising a first semiconductor IC chip, a first polymer layer in a space beyond and extending from a sidewall of the first semiconductor IC chip, a first through package via in the first polymer layer, and a first interconnection scheme under the first semiconductor IC chip, first polymer layer and first through package via, wherein the first semiconductor IC chip comprises a plurality of volatile memory cells configured to store first data associated with a plurality of resulting values for a look-up table (LUT) and a selection circuit configured to select, in accordance with a first input data set thereof, a data from a second input data set thereof as an output data for the logic operation; a first metal bump under the first chip package; and a non-volatile memory IC chip over the first chip package, wherein the non-volatile memory IC chip comprises a plurality of first non-volatile memory cells configured to store second data associated with the plurality of resulting values for the look-up table (LUT), wherein the first data are associated with the second data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">250:非揮發性記憶體(NVM)IC晶片</p>
        <p type="p">479:I/O緩衝區塊</p>
        <p type="p">411:輔助IC晶片</p>
        <p type="p">517:密碼區塊</p>
        <p type="p">481:I/O緩衝區塊</p>
        <p type="p">469:I/O緩衝區塊</p>
        <p type="p">201:可編程邏輯區塊</p>
        <p type="p">490:記憶體單元</p>
        <p type="p">211:選擇電路</p>
        <p type="p">362:記憶體單元</p>
        <p type="p">379:可編程開關單元</p>
        <p type="p">475:外部電路</p>
        <p type="p">471:I/O緩衝區塊</p>
        <p type="p">200:FPGA IC晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2622" publication-number="202617905">
    <tif-files tif-type="multi-tif">
      <tif file="115101067.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨方法及研磨用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C09G1/02</main-classification>
        <further-classification edition="200601120260123B">C09K3/14</further-classification>
        <further-classification edition="200601120260123B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中貝雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>織田博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤康昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YASUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井出匠学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDE, SHOGAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高見信一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMI, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為提供一種適用在碳化矽的研磨，可抑制在研磨中之研磨用組成物的pH上昇及墊溫度的上昇之研磨方法及研磨用組成物。提供一種研磨具有藉由碳化矽所構成之表面的研磨對象物之方法。該方法包含：準備研磨用組成物之步驟、與將上述研磨用組成物供給至上述研磨對象物，研磨該研磨對象物之步驟。上述研磨用組成物包含過錳酸鹽、與金屬鹽A、與水。上述金屬鹽A為水合金屬離子之pKa較7.0更小之金屬陽離子、與陰離子之鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2623" publication-number="202619516">
    <tif-files tif-type="multi-tif">
      <tif file="115101092.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多垂直薄體的電晶體結構</chinese-title>
        <english-title>TRANSISTOR STRUCTURE WITH MULTIPLE VERTICAL THIN BODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260121B">H10D30/00</main-classification>
        <further-classification edition="202501120260121B">H10D64/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日日新半導體架構股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTION AND COLLABORATION LABORATORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧超群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電晶體結構包含一本體、一閘極結構、一源極區和一汲極區。該本體具有單凸結構，其中該單凸結構由一第一半導體材料製成，且在該單凸結構中形成一溝槽。該閘極結構具有一閘極導電層及一閘極介電層，其中該閘極導電層橫跨該單凸結構上方，且該閘極導電層的部分填入該溝槽內。該源極區與該單凸結構的第一端接觸。該汲極區與該單凸結構的第二端接觸。該電晶體結構的導通電流與關閉電流的比值不小於10&lt;sup&gt;6&lt;/sup&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transistor structure includes a body, a gate structure, a source region, and a drain region. The body has a single convex structure, wherein the convex structure is made of a first semiconductor material, and a trench is formed in the single convex structure. The gate structure has a gate conductive layer and a gate dielectric layer, wherein the gate conductive layer is across over the single convex structure, and a portion of the gate conductive layer is filled in the trench. The source region contacts with a first end of the single convex structure. The drain region contacts with a second end of the single convex structure. A ratio of ON current (Ion) to Off current (Ioff) of the transistor structure is not less than 10&lt;sup&gt;6&lt;/sup&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402:淺溝槽隔離區</p>
        <p type="p">2706:抗擊穿層</p>
        <p type="p">3502:高k介電層</p>
        <p type="p">3504:金屬極</p>
        <p type="p">3702:硬光罩氧化層</p>
        <p type="p">3704:襯墊</p>
        <p type="p">3706:鎢層</p>
        <p type="p">3708、3710:功函數金屬</p>
        <p type="p">G1~G3:垂直閘極導電部分</p>
        <p type="p">Sright、Sleft:垂直薄體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2624" publication-number="202617602">
    <tif-files tif-type="multi-tif">
      <tif file="115101107.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ｎ型碳化矽單結晶基板</chinese-title>
        <english-title>N-TYPE SIC SINGLE CRYSTAL SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260121B">C01B32/956</main-classification>
        <further-classification edition="200601120260121B">C30B11/12</further-classification>
        <further-classification edition="200601120260121B">C30B15/36</further-classification>
        <further-classification edition="200601120260121B">C30B29/36</further-classification>
        <further-classification edition="200601120260121B">C30B23/06</further-classification>
        <further-classification edition="200601120260121B">H01L21/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHONAI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題係8英吋的SiC單結晶基板中，可提供高摻雜物濃度且濃度分佈偏差被抑制的n型SiC單結晶基板。  &lt;br/&gt;　　作為解決手段，本發明的SiC單結晶基板(1)係8英吋之n型SiC單結晶基板，直徑為195~205mm的範圍，厚度為300~650μm的範圍，表背兩面的加工變質層的厚度為0.1nm以下，在距主面深度方向上相對於板厚為5%以內的面內的任意選擇的至少5點中，摻雜物濃度為2×10&lt;sup&gt;18&lt;/sup&gt;/cm&lt;sup&gt;3&lt;/sup&gt;以上、6×10&lt;sup&gt;19&lt;/sup&gt;/cm&lt;sup&gt;3&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An 8 inch n-type SiC single crystal substrate of an embodiment has a diameter in the range of 195 to 205mm, a thickness in the range of 300 μm to 650 μm, thicknesses of work-affected layers on both the front and back sides are 0.1 nm or less, and the dopant concentration is 2 x 10&lt;sup&gt;18&lt;/sup&gt;/cm&lt;sup&gt;3&lt;/sup&gt; or more and 6 x 10&lt;sup&gt;19&lt;/sup&gt;/cm&lt;sup&gt;3 &lt;/sup&gt;or less at least five arbitrarily selected points in the plane within 5% of the thickness of the substrate in the depth direction from the main surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:SiC單結晶基板</p>
        <p type="p">1A:面</p>
        <p type="p">1a:主面</p>
        <p type="p">1b:最外周</p>
        <p type="p">1bb:符號</p>
        <p type="p">O:中心點</p>
        <p type="p">p1,p2,p3,p4:點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2625" publication-number="202618941">
    <tif-files tif-type="multi-tif">
      <tif file="115101149.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝以及用於製備半導體封裝的方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">H01L21/56</main-classification>
        <further-classification edition="200601120260120B">H01L21/60</further-classification>
        <further-classification edition="200601120260120B">H01L23/28</further-classification>
        <further-classification edition="200601120260120B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創未來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRON FUTURE TECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡瀚文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁明維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製備半導體封裝的方法，其包含：將錫膏塗佈在基板上；將半導體裸晶上的多個錫凸塊與該基板上的該錫膏彼此接觸；對該錫膏進行回焊，以在該基板與該半導體裸晶之間形成多個焊點，其中回焊後生成的焊後殘留物係包覆每個焊點的下半部；以及在該基板與該半導體裸晶之間注入底部填充膠以包覆該焊點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for fabricating a semiconductor package includes applying solder paste onto a substrate; bringing a plurality of solder bumps on a semiconductor die into contact with the solder paste on the substrate; reflowing the solder paste to form a plurality of solder joints between the substrate and the semiconductor die, wherein a post-soldering residue is produced to encapsulate a lower portion of each solder joint; and applying an underfill between the substrate and the semiconductor die to encapsulate an upper portion of the solder joint.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202,204,206,208:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2626" publication-number="202619586">
    <tif-files tif-type="multi-tif">
      <tif file="115101182.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260121B">H10F39/18</main-classification>
        <further-classification edition="202501120260121B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學工業園區新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余治寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪豐基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, FENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊敦年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAUNG, DUN-NIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種圍繞隔離結構的p型摻雜區域在像素陣列的像素感測器之間提供額外的電性隔離。結果，減少了從一個像素感測器的浮動節點到另一個像素感測器的漏電流。因此，暗電流可被減少，並提高像素陣列的效能。另外，可以減少隔離結構中捕獲的電子引起的像素雜訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A p-type doping region around an isolation structure provides additional electrical isolation between pixel sensors of a pixel array. As a result, current leakage from a floating node of one pixel sensor into another is reduced. Therefore, dark current is reduced, and performance of the pixel array is improved. Additionally, pixel noise caused by electrons trapped in the isolation structure may be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:光電二極體</p>
        <p type="p">200:像素感測器</p>
        <p type="p">202:基板</p>
        <p type="p">204:p型井</p>
        <p type="p">206:n型摻雜區</p>
        <p type="p">208:汲極延伸區</p>
        <p type="p">210:傳輸閘</p>
        <p type="p">212:介電層</p>
        <p type="p">214、216:導電結構</p>
        <p type="p">218:閘極介電質</p>
        <p type="p">220:隔離結構</p>
        <p type="p">222a:第一介電材料</p>
        <p type="p">222b:第二介電材料</p>
        <p type="p">224:膜</p>
        <p type="p">226:p型摻雜區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2627" publication-number="202617621">
    <tif-files tif-type="multi-tif">
      <tif file="115101206.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617621</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高頻裝置用玻璃基板與高頻裝置用電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C03C3/091</main-classification>
        <further-classification edition="200601120260121B">C03C3/089</further-classification>
        <further-classification edition="200601120260121B">C03C3/06</further-classification>
        <further-classification edition="200601120260121B">C03C3/087</further-classification>
        <further-classification edition="200601120260121B">C03C4/16</further-classification>
        <further-classification edition="200601120260121B">C03B17/02</further-classification>
        <further-classification edition="200601120260121B">C03B17/06</further-classification>
        <further-classification edition="200601120260121B">C03B25/08</further-classification>
        <further-classification edition="200601120260121B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野和孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村周平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木寺信隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDERA, NOBUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下暢彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, NOBUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之玻璃基板2按氧化物基準之莫耳百分率計，於0.001～5%之範圍內含有鹼金屬氧化物並且鹼金屬氧化物中Na&lt;sub&gt;2&lt;/sub&gt;O/(Na&lt;sub&gt;2&lt;/sub&gt;O＋K&lt;sub&gt;2&lt;/sub&gt;O)所表示之莫耳比為0.01～0.99之範圍，且於合計含量1～40%之範圍內含有Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;及B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;並且Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;/(Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;＋B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)所表示之莫耳比為0～0.45之範圍，且以SiO&lt;sub&gt;2&lt;/sub&gt;為主成分。玻璃基板2之至少一個主表面之表面粗糙度以算術平均粗糙度Ra之值計為1.5 nm以下，且35 GHz下之介電損耗正切為0.007以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路基板</p>
        <p type="p">2:玻璃基板</p>
        <p type="p">2a、2b:主表面</p>
        <p type="p">3、4:配線層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2628" publication-number="202619126">
    <tif-files tif-type="multi-tif">
      <tif file="115101210.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101210</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝用基板及半導體封裝用基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">H01L23/538</main-classification>
        <further-classification edition="200601120260121B">H01L23/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>満倉一行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUKURA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥羽正也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江尻芳則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EJIRI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔵渕和彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAFUCHI, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可提高絕緣可靠性的有機中介層及其製造方法。有機中介層10具備含有多個有機絕緣層而成的有機絕緣積層體12、及排列於有機絕緣積層體12內的多條配線13，並且藉由阻障金屬膜14將配線13與有機絕緣層隔開。有機絕緣積層體12包含第一有機絕緣層21及第二有機絕緣層22，所述第一有機絕緣層21具有配置有配線13的多個凹槽部21a，所述第二有機絕緣層22以嵌埋配線13的方式積層於第一有機絕緣層21上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:有機中介層</p>
        <p type="p">11:基板</p>
        <p type="p">12:有機絕緣積層體</p>
        <p type="p">12a:開口部</p>
        <p type="p">13:配線</p>
        <p type="p">15a~15c:配線層</p>
        <p type="p">14:阻障金屬膜</p>
        <p type="p">15:貫通配線</p>
        <p type="p">16:表面配線</p>
        <p type="p">21:第一有機絕緣層</p>
        <p type="p">21a:凹槽部</p>
        <p type="p">22:第二有機絕緣層</p>
        <p type="p">23:第三有機絕緣層</p>
        <p type="p">24:第四有機絕緣層</p>
        <p type="p">31:第一阻障金屬膜</p>
        <p type="p">32:第二阻障金屬膜</p>
        <p type="p">L:線寬</p>
        <p type="p">S:間隙寬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2629" publication-number="202618865">
    <tif-files tif-type="multi-tif">
      <tif file="115101224.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理系統及環狀構件的安裝方法</chinese-title>
        <english-title>PLASMA PROCESSING SYSTEM AND METHOD OF MOUNTING ANNULAR MEMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">H01J37/32</main-classification>
        <further-classification edition="200601120260121B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電漿處理系統，在利用搬運裝置將環狀構件安裝於基板支持台上時，可使環狀構件對於基板支持台適當地定位。本發明之電漿處理系統具備電漿處理裝置、減壓搬運裝置、控制裝置。電漿處理裝置，具有具備支持部之基板支持台，支持部包含基板載置面、及環狀構件載置面；基板支持台於支持部設置複數貫穿孔；基板支持台具備：升降桿，以從環狀構件載置面突出之方式升降；升降機構，使升降桿升降；以及溫度調整機構，調整支持部之溫度。減壓搬運裝置，具備搬運基板之搬運機構。於環狀構件的底面，形成往上方凹入而容納升降桿之上端部的凹部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The plasma processing system of the present invention can properly position the annular member with respect to the substrate support when the annular member is mounted on the substrate support by the transfer mechanism. The plasma processing system of the present invention comprises a plasma processing apparatus, a decompression transfer device, and a control device. The plasma processing apparatus includes a substrate support that comprises a support unit. The support unit includes a substrate placing surface and an annular member placing surface. The substrate support further comprises a plurality of insertion holes extending through the support unit; lifters configured to elevate and lower so as to protrude from the annular member placing surface; a lifting mechanism to drive the lifters; and a temperature adjustment mechanism configured to adjust the temperature of the support unit. The decompression transfer device comprises a mechanism for transferring substrates. The annular member includes concave portions on its bottom surface that receive the upper ends of the lifters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2630" publication-number="202617143">
    <tif-files tif-type="multi-tif">
      <tif file="115101240.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療細胞介素相關之病症之ＪＡＫ１路徑抑制劑</chinese-title>
        <english-title>JAK1 PATHWAY INHIBITORS FOR THE TREATMENT OF CYTOKINE-RELATED DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A61K31/4155</main-classification>
        <further-classification edition="200601120260123B">A61P37/00</further-classification>
        <further-classification edition="200601120260123B">A61P19/02</further-classification>
        <further-classification edition="200601120260123B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英塞特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INCYTE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐尼爾　蒙哥莫瑞　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'NEILL MONTGOMERY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈姆　阿汗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIM, AHMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯納格瑞斯　蘇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNODGRASS, SUSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於JAK1路徑抑制劑及其治療細胞介素相關之疾病或病症，諸如細胞介素釋放症候群(CRS)、噬血細胞性淋巴組織細胞增生症(HLH)、巨噬細胞活化症候群(MAS)及CAR-T細胞相關之腦病症候群(CRES)的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to JAK1 pathway inhibitors and the use thereof in treating cytokine-related diseases or disorders such as cytokine release syndrome (CRS), hemophagocytic lymphohistiocytosis (HLH), macrophage activation syndrome (MAS), and CAR-T-cell-related encephalopathy syndrome (CRES).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2631" publication-number="202617002">
    <tif-files tif-type="multi-tif">
      <tif file="115101271.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支架連接結構</chinese-title>
        <english-title>BRACKET CONNECTING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">A47D7/01</main-classification>
        <further-classification edition="200601120260126B">A47D13/04</further-classification>
        <further-classification edition="200601120260126B">F16B7/04</further-classification>
        <further-classification edition="200601120260126B">F16B12/40</further-classification>
        <further-classification edition="200601120260126B">F16B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡軍杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JUNJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡問渠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WENQU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐頌雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種支架連接結構，包括支架連接組件，所述支架連接組件包括轉動連接組件，所述轉動連接組件包括：轉動座；至少一個第一轉動臂，所述至少一個第一轉動臂樞接於所述轉動座；和至少一個轉動鎖定件，所述至少一個轉動鎖定件可轉動地設置於所述轉動座，並且在轉動釋鎖位置和轉動鎖定位置之間可切換，其中當所述轉動鎖定件位於所述轉動釋鎖位置時，所述第一轉動臂能夠相對於所述轉動座轉動，當所述轉動鎖定件位於所述轉動鎖定位置時，所述第一轉動臂被阻止相對於所述轉動座轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bracket connecting structure includes a bracket connecting assembly, which includes a rotation connecting assembly, wherein the rotation connecting assembly includes: a rotation base; at least a first rotating arm pivotally connected to the rotation base; and at least a rotation lock rotatably disposed on the rotation base and switchable between a rotation unlocked position and a rotation locked position, wherein the first rotating arm can rotate relative to the rotation base when the rotation lock is in the rotation unlocked position and is prevented from rotating relative to the rotation base when the rotation lock is in the rotation locked position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支架連接結構</p>
        <p type="p">10:支架連接組件</p>
        <p type="p">101:連接座</p>
        <p type="p">103:鎖定件</p>
        <p type="p">11:移動連接組件</p>
        <p type="p">11a:第一移動組件</p>
        <p type="p">11b:第二移動組件</p>
        <p type="p">111:樞轉座</p>
        <p type="p">112:樞轉臂</p>
        <p type="p">112a:第一樞轉臂</p>
        <p type="p">112b:第二樞轉臂</p>
        <p type="p">113:移動鎖定件</p>
        <p type="p">114:移動復位件</p>
        <p type="p">115:連接件</p>
        <p type="p">115a:連接件</p>
        <p type="p">115b:連接件</p>
        <p type="p">20:連動件</p>
        <p type="p">MD1、MD2:移動方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2632" publication-number="202617718">
    <tif-files tif-type="multi-tif">
      <tif file="115101300.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖卡替尼及其半乙醇合物的製備方法</chinese-title>
        <english-title>PROCESS FOR PREPARING TUCATINIB AND ITS HEMIETHANOLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D471/04</main-classification>
        <further-classification edition="200601120260202B">A61K31/517</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣神隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCINOPHARM TAIWAN, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃靖凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JING-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施雯莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭俊徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JIUNN-CHEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡聰成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TSUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於製備圖卡替尼（tucatinib）、圖卡替尼中間物及其晶型的改良方法。具體而言，本發明揭示的一鍋化反應方法節省時間及資源。本發明改善了圖卡替尼的生產效率，且該製程可在綠色化學條件下進行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an improved process for the preparation of tucatinib, tucatinib intermediates, and the crystalline forms thereof. Specifically, the presently disclosed one-pot reaction processes save time and resources. The present invention improves the efficacy of producing Tucatinib, which can be performed under green chemistry.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2633" publication-number="202617831">
    <tif-files tif-type="multi-tif">
      <tif file="115101302.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含含有聚醯胺嵌段及聚醚嵌段的共聚物之組合物</chinese-title>
        <english-title>COMPOSITION COMPRISING A COPOLYMER CONTAINING POLYAMIDE BLOCKS AND POLYETHER BLOCKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">C08G69/48</main-classification>
        <further-classification edition="200601120260122B">C08G69/40</further-classification>
        <further-classification edition="200601120260122B">C08L77/00</further-classification>
        <further-classification edition="200601120260122B">C08J9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商阿科瑪法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARKEMA FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰斯德　布朗戴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESTUD, BLANDINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿貝格爾　弗羅倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABGRALL, FLORENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科逵特　可理歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COCQUET, CLIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮諾　昆廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PINEAU, QUENTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種包含含有聚醯胺嵌段及聚醚嵌段的共聚物之組合物，係關於該組合物之製備方法且亦係關於其用途，該共聚物包含已與一環氧官能基反應之至少一個羧酸鏈末端。本發明亦係關於一種由此組合物形成之發泡體，係關於該發泡體之製備方法且係關於其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition comprising a copolymer containing polyamide blocks and polyether blocks comprising at least one carboxylic acid chain end having reacted with an epoxide function, to the process for preparing same and also to the use thereof. The invention also relates to a foam formed from this composition, to the process for preparing same and to the use thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2634" publication-number="202618379">
    <tif-files tif-type="multi-tif">
      <tif file="115101352.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260120B">G02B11/32</main-classification>
        <further-classification edition="200601120260120B">G02B9/62</further-classification>
        <further-classification edition="200601120260120B">G02B13/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GUAN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統，包括：第一透鏡，具有正屈光力，所述第一透鏡的物側表面為凸面，且所述第一透鏡的像側表面為凹面；第二透鏡，具有正屈光力；第三透鏡，具有負屈光力；第四透鏡，具有負屈光力，所述第四透鏡的物側表面為凹面，且所述第四透鏡的像側表面為凸面；第五透鏡，具有正屈光力；第六透鏡，具有正屈光力，所述第一透鏡、所述第二透鏡、所述第三透鏡、所述第四透鏡、所述第五透鏡、所述第六透鏡自物側依序設置，其中所述第一透鏡至所述第六透鏡的每一者的物側表面與像側表面均為Q-type非球面表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes: a first lens having positive refractive power, wherein the object-side surface of the first lens is convex and the image-side surface of the first lens is concave; a second lens having positive refractive power; a third lens having negative refractive power; a fourth lens having negative refractive power, wherein the object-side surface of the fourth lens is concave and the image-side surface of the fourth lens is convex; a fifth lens having positive refractive power; and a sixth lens having positive refractive power, wherein the first lens, the second lens, the third lens, the fourth lens, the fifth lens, and the sixth lens are arranged sequentially from the object side, wherein the object-side surface and the image-side surface of each of the first lens to the sixth lens are Q-type aspherical surfaces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學成像系統</p>
        <p type="p">100、180:稜鏡</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">114:光圈</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:紅外光濾波片</p>
        <p type="p">190:影像感測器</p>
        <p type="p">191:成像平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2635" publication-number="202618881">
    <tif-files tif-type="multi-tif">
      <tif file="115101374.zip" no="1">
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        <document-id>
          <doc-number>202618881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板乾燥方法及基板乾燥裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">H01L21/02</main-classification>
        <further-classification edition="200601120260121B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五師源太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSHI, GENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 在使用超臨界狀態之處理流體來使基板乾燥時，可降低產生於基板上的微粒之量。  &lt;br/&gt;　　[解決手段] 基板處理方法，係具備有：升壓工程，在藉由基板保持部保持形成有液膜之基板且被收容於處理容器內的狀態下，將處理流體供給至處理容器內，藉此，使處理容器內之壓力上升至預先設定的處理壓力；及流通工程，在升壓工程後，一邊將處理容器內之壓力維持於處理壓力，一邊將處理流體從第2吐出部供給至處理容器內，並且從排出部排出處理容器內的處理流體。升壓工程，係具備有：第1升壓階段，將處理流體從第1吐出部供給至處理容器內，藉此，使處理容器內之壓力上升至預先設定的切換壓力；及第2升壓階段，在第1升壓階段後，將處理流體從第2吐出部供給至處理容器內，藉此，使處理容器內之壓力從切換壓力上升至處理壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理單元</p>
        <p type="p">12:處理容器</p>
        <p type="p">12A:上方空間</p>
        <p type="p">12B:下方空間</p>
        <p type="p">14:基板保持部(托盤)</p>
        <p type="p">16:蓋部</p>
        <p type="p">18:板體</p>
        <p type="p">21:第1吐出部</p>
        <p type="p">22:第2吐出部</p>
        <p type="p">24:流體排出部</p>
        <p type="p">32:主供給管線</p>
        <p type="p">30:超臨界流體供給裝置</p>
        <p type="p">33:分歧點(第1分歧點)</p>
        <p type="p">34:第1分歧供給管線</p>
        <p type="p">36:第2分歧供給管線</p>
        <p type="p">38:排出管線</p>
        <p type="p">40:壓力調整閥</p>
        <p type="p">42:分歧點</p>
        <p type="p">44:旁通管線</p>
        <p type="p">46:連接點</p>
        <p type="p">48:分歧點</p>
        <p type="p">50:分歧排出管線</p>
        <p type="p">52:分歧點</p>
        <p type="p">54:分歧排出管線</p>
        <p type="p">56:分歧排出管線</p>
        <p type="p">60:匯流點</p>
        <p type="p">62:沖洗氣體供給管線</p>
        <p type="p">64:分歧點(第2分歧點)</p>
        <p type="p">66:洩壓管線</p>
        <p type="p">100:控制部</p>
        <p type="p">101:運算部</p>
        <p type="p">102:記憶部</p>
        <p type="p">F(F1):過濾器</p>
        <p type="p">F(F2):過濾器</p>
        <p type="p">H:加熱器</p>
        <p type="p">T:溫度感測器</p>
        <p type="p">P:壓力感測器</p>
        <p type="p">W:基板</p>
        <p type="p">V1:開關閥</p>
        <p type="p">V2:開關閥</p>
        <p type="p">V3:開關閥</p>
        <p type="p">V4:開關閥</p>
        <p type="p">V5:開關閥</p>
        <p type="p">V6:開關閥</p>
        <p type="p">V7:開關閥</p>
        <p type="p">V8:開關閥</p>
        <p type="p">V9:開關閥</p>
        <p type="p">V10:開關閥</p>
        <p type="p">V11:開關閥</p>
        <p type="p">CV:單向閥(止回閥)</p>
        <p type="p">SV:安全閥(釋壓閥)</p>
        <p type="p">PS(PS 12):壓力感測器</p>
        <p type="p">OLF:孔口(固定節流)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2636" publication-number="202618335">
    <tif-files tif-type="multi-tif">
      <tif file="115101380.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202618335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有繞射防眩表面之顯示器製品及其製造方法</chinese-title>
        <english-title>DISPLAY ARTICLES WITH DIFFRACTIVE, ANTIGLARE SURFACES AND METHODS OF MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260128B">G02B1/11</main-classification>
        <further-classification edition="200601120260128B">G02B27/42</further-classification>
        <further-classification edition="200601120260128B">C03C15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　江蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, JIANGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特　尚登笛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HART, SHANDON DEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科赫三世　卡爾威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOCH III, KARL WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納爾遜　卡梅倫羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NELSON, CAMERON ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟那拉特涅　瓦吉夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENARATNE, WAGEESHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍德　威廉艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOOD, WILLIAM ALLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了一種顯示器製品，該顯示器製品包括：基板，該基板包含厚度及主表面；且該主表面上界定有繞射表面區域。該繞射表面區域包含複數個結構特徵，該複數個結構特徵包含呈多模式分佈的複數個不同高度。此外，該基板展現出如在與法線成0°的入射角下藉由像素功率偏差(PPD&lt;sub&gt;140&lt;/sub&gt;)測量的小於4%的閃爍、在與法線成20°的入射角下小於80%的影像清晰度(DOI)、及在與法線成0°的入射角下小於20%的透射率霧度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display article is described herein that includes: a substrate comprising a thickness and a primary surface; and the primary surface having defined thereon a diffractive surface region. The diffractive surface region comprises a plurality of structural features that comprises a plurality of different heights in a multimodal distribution. Further, the substrate exhibits a sparkle of less than 4%, as measured by pixel power deviation (PPD&lt;sub&gt;140&lt;/sub&gt;) at an incident angle of 0° from normal, a distinctness of image (DOI) of less than 80% at an incident angle of 20° from normal, and a transmittance haze of less than 20% from an incident angle of 0° from normal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">12,14:主表面</p>
        <p type="p">13:厚度</p>
        <p type="p">20:結構特徵</p>
        <p type="p">21a:第一平面區域</p>
        <p type="p">21b:第二平面區域</p>
        <p type="p">22a:第一部分結構特徵</p>
        <p type="p">22b:第二部分結構特徵</p>
        <p type="p">24a:第一平均高度/第一平均深度</p>
        <p type="p">24b:第二平均高度/第二平均深度</p>
        <p type="p">30a:繞射表面區域</p>
        <p type="p">32a:第一部分結構特徵之直徑</p>
        <p type="p">32b:第二部分結構特徵之直徑</p>
        <p type="p">42a:第一部分結構特徵之節距</p>
        <p type="p">42b:第二部分結構特徵之節距</p>
        <p type="p">47:週期</p>
        <p type="p">50:壓縮應力區域</p>
        <p type="p">52:深度</p>
        <p type="p">100:顯示器製品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2637" publication-number="202619532">
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      <tif file="115101410.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
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          <doc-number>202619532</doc-number>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造功率半導體元件的方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260122B">H10D30/60</main-classification>
        <further-classification edition="200601120260122B">C23C16/455</further-classification>
        <further-classification edition="200601120260122B">B08B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商周星工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃喆周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, CHUL-JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種製造功率半導體元件的方法，包含在碳化矽基板上形成活性層。主動層的形成包含在碳化矽基板上噴射源氣體、在停止源氣體的噴射後進行噴射清理氣體的初始清理，在停止初始清理後噴射反應氣體，以及在停止反應氣體的噴射後進行噴射清理氣體的二次清理。因此，根據示例性實施例，可在低溫下形成主動層。因此，可以防止基板或形成在基板上的薄膜被高溫熱加熱損壞。此外，可以節省加熱基板以形成主動層所需的功率或時間，並且可以縮短整體製程時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for manufacturing a power semiconductor device, which includes forming an active layer on an SiC substrate. The forming of the active layer includes injecting a source gas onto the SiC substrate, performing primary purging of injecting a purge gas after stopping the injecting of the source gas, injecting a reactant gas after stopping the primary purging, and performing secondary purging of injecting the purging gas after stopping the injecting of the reactant gas. Thus, in accordance with exemplary embodiments, the active layer may be formed at a low temperature. Therefore, a substrate or a thin film formed on the substrate may be prevented from being damaged by high-temperature heat. In addition, power or a time required for heating the substrate to form the active layer may be saved, and an overall process time may be shortened.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2638" publication-number="202617217">
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      <tif file="115101417.zip" no="1">
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        <document-id>
          <doc-number>202617217</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放射治療裝療器及用於輸送放射治療種子之系統</chinese-title>
        <english-title>RADIOTHERAPY APPLICATOR AND SYSTEM FOR DELIVERY OF RADIOTHERAPY SEEDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">A61N5/10</main-classification>
        <further-classification edition="200601120260121B">A61M25/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商阿爾法陶醫療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA TAU MEDICAL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爵　奧佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGEN, OFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇爾諾　歐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZELLNER, OR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪可斯基　史瑞雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKOVSKY, SRAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾森　伊茲哈可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELSON, ITZHAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於透過一細長針(104)將放射治療種子輸送至一患者之一腫瘤之裝療器(applicator)。該細長針包括一針手柄(204)及具有用於插入該患者體內一給定長度之一針管。該裝療器包括：一細長裝療器管(106)，其經設計以穿過該細長針，其中該細長裝療器管界定接收一或多個放射治療種子(110)之一內部通道；一裝療器手柄(210)，其經組態以附接至該針手柄(204)；及一通條(stylet)(108)，其在該細長裝療器管內。該細長裝療器管比該細長針長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An applicator for delivery of radiotherapy seeds to a tumor of a patient through an elongate needle (104). The elongate needle comprises a needle handle (204) and a needle tube having a given length for insertion into the patient. The applicator comprises an elongate applicator tube (106) designed to pass through the elongate needle, wherein the elongate applicator tube defines an internal channel which receives one or more radiotherapy seeds (110), an applicator handle (210) configured to be attached to the needle handle (204); and a stylet (108) within the elongate applicator tube. The elongate applicator tube is longer than the elongate needle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:內視鏡</p>
        <p type="p">104:細長針</p>
        <p type="p">106:裝療器</p>
        <p type="p">108:通條</p>
        <p type="p">110:放射治療種子</p>
        <p type="p">114:銳邊</p>
        <p type="p">118:鞘</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2639" publication-number="202617974">
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          <doc-number>202617974</doc-number>
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        <document-id>
          <doc-number>115101447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細胞片的評價方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260123B">C12N5/077</main-classification>
        <further-classification edition="200601120260123B">G01N33/53</further-classification>
        <further-classification edition="200601120260123B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商創革醫療科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELLSEED INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人東海大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKAI UNIVERSITY EDUCATIONAL SYSTEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤千香子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, CHIKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幸得友美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTOKU, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河毛知子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKE, TOMOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種細胞片的評價方法，所述評價方法為評價由軟骨組織衍生的細胞的培養物所形成的培養細胞片是否為適於向動物移植而用於軟骨修復的培養細胞片的方法，其中所述細胞片的評價方法在具有已固定化有溫度響應性聚合物的面的膜的所述面上，在哺乳類細胞的培養中可使用的培養基中，在35℃～40℃、2%～8%CO&lt;sub&gt;2&lt;/sub&gt;的培養器內以10天～20天培養多指症動物的軟骨組織衍生的細胞而獲得培養細胞片後，在所述培養細胞片在使用針對一型膠原蛋白的抗體的免疫染色中顯示陽性，且在使用針對二型膠原蛋白的抗體的免疫染色中顯示陰性時，且在如下的其中一者或兩者時，將所述培養細胞片評價為適於作為軟骨修復的細胞片：在使用針對聚集蛋白聚糖的抗體的免疫染色中顯示陽性時；或在對番紅O染色顯示陽性時。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2640" publication-number="202619131">
    <tif-files tif-type="multi-tif">
      <tif file="115101461.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260119B">H01L25/065</main-classification>
        <further-classification edition="202301120260119B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, ZHILIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍宗亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUO, ZONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示書內容涉及用於高頻寬記憶體（HBM）的方法、裝置、系統和技術。一種示例半導體裝置包括沿第一方向堆疊在一起的第一層、第二層、第一層與第二層之間的第一裸晶、以及第二裸晶。第一裸晶和第二裸晶中的每一個具有導電層。第一裸晶和第二裸晶通過第二層鍵合。該半導體裝置還包括耦合到第一裸晶的導電層的第一接點結構和耦合到第二裸晶的導電層的第二接點結構。第一接點結構沿第一方向延伸並且接觸第一裸晶的導電層，而不延伸穿過第二層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates methods, devices, systems, and techniques for high bandwidth memory (HBM). An example semiconductor device includes a first layer, a second layer, a first die between the first layer and the second layer, and a second die stacked together along a first direction. Each of the first die and the second die has a conductive layer. The first die and the second die are bonded through the second layer. The semiconductor device further includes a first contact structure coupled to the conductive layer of the first die and a second contact structure coupled to the conductive layer of the second die. The first contact structure extends along the first direction and contacts the conductive layer of the first die without extending through the second layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體裝置</p>
        <p type="p">202:堆疊體</p>
        <p type="p">204a、204b、204c、204d:記憶體裸晶</p>
        <p type="p">206:裝置區域</p>
        <p type="p">208:連接區域</p>
        <p type="p">210:接點結構</p>
        <p type="p">212:基礎裸晶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2641" publication-number="202618935">
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      <tif file="115101501.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有導電特徵的結構以及形成此結構的方法</chinese-title>
        <english-title>STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/48</main-classification>
        <further-classification edition="200601120260126B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏佐　賽普里恩　艾米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZOH, CYPRIAN EMEKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種元件被揭示。所述元件可包含非導電的結構，其具有：非導電的接合表面；凹處，其是從所述非導電的接合表面至少部分地延伸穿過所述非導電的結構的一厚度的一部分；以及導電墊，其被設置在所述凹處中。所述凹處具有底側及側壁。所述導電墊具有接合表面以及與所述接合表面相對的背面。在所述接合表面的結晶顆粒的平均尺寸是小於相鄰所述凹處的所述底側的結晶顆粒的平均尺寸。所述導電墊可包含具有沿著111晶面定向的結晶顆粒的晶體結構。所述元件可被接合至另一元件以形成接合的結構。所述元件以及所述另一元件可以在無中間黏著劑下直接接合至彼此。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An element is disclosed. The element can include a non-conductive structure having a non-conductive bonding surface, a cavity at least partially extending through a portion of a thickness of the non-conductive structure from the non-conductive bonding surface, and a conductive pad disposed in the cavity. The cavity has a bottom side and a sidewall. The conductive pad has a bonding surface and a back side opposite the bonding surface. An average size of the grains at the bonding surface is smaller than an average size of the grains adjacent the bottom side of the cavity. The conductive pad can include a crystal structure with grains oriented along a 111 crystal plane. The element can be bonded to another element to form a bonded structure. The element and the other element can be directly bonded to one another without an intervening adhesive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:元件</p>
        <p type="p">10:基板</p>
        <p type="p">12:介電層</p>
        <p type="p">12a:下方側</p>
        <p type="p">12b:上方側</p>
        <p type="p">14:導電墊</p>
        <p type="p">14a:下方側</p>
        <p type="p">14b:上方側</p>
        <p type="p">16:凹處</p>
        <p type="p">18:阻障層</p>
        <p type="p">20:底側</p>
        <p type="p">22:側壁</p>
        <p type="p">24:結晶顆粒</p>
        <p type="p">26:小結晶顆粒區域</p>
        <p type="p">28:大結晶顆粒區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2642" publication-number="202618915">
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          <doc-number>202618915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L21/304</main-classification>
        <further-classification edition="200601120260122B">B08B3/10</further-classification>
        <further-classification edition="200601120260122B">B05C11/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神谷将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出村健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMURA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村美波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MINAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理裝置，包括：載置部，能夠使所載置的基板旋轉；液體供給部，能夠向基板的與載置部側為相反側的第一面供給液體；以及用於洗淨基板的振動體，其中，振動體的與處於基板的表面的液體接觸的部分，具有：相對於振動體的與基板相向的端部傾斜的區域，於將傾斜的區域、與振動體的端部的延長線之間的角度設為θ的情況下，滿足以下式：20°≦θ≦87°。振動體自與基板的所述第一面交叉的方向，向處於基板的第一面的液體傳遞振動，振動體呈長方體狀，端部的長度方向配置成：與載置在載置部的基板的旋轉中心與周緣之間的區域相向，傾斜的區域為於振動體的端部開口的槽的側面，槽形成為沿著端部的長度方向而延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">91:振動體</p>
        <p type="p">91a:主體</p>
        <p type="p">91aa:端部</p>
        <p type="p">91a1:槽</p>
        <p type="p">91a1a:側面</p>
        <p type="p">91a1b:延長線</p>
        <p type="p">92a:振動</p>
        <p type="p">100:基板</p>
        <p type="p">100b:表面</p>
        <p type="p">101、102:液體</p>
        <p type="p">300:污染物</p>
        <p type="p">θ:角度</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2643" publication-number="202618931">
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          <doc-number>202618931</doc-number>
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      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉積氧化物於基板上之方法</chinese-title>
        <english-title>METHOD FOR DEPOSITING OXIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260125B">H01L21/316</main-classification>
        <further-classification edition="200601120260125B">C23C16/04</further-classification>
        <further-classification edition="200601120260125B">C23C16/455</further-classification>
        <further-classification edition="200601120260125B">C23C16/448</further-classification>
        <further-classification edition="200601120260125B">C23C16/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏瑪　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基佩　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIAPPE, DANIELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托伊斯　伊娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOIS, EVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪迪瓦拉　維拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADHIWALA, VIRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托米寧　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUOMINEN, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德茲拉　查理斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZELAH, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉芬斯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIVENS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布隆貝格　湯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOMBERG, TOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於在基板上沉積氧化矽之方法、形成半導體裝置之方法及形成結構之方法。此方法包含在反應室中提供基板；在反應室中提供矽前驅物，此矽前驅物包含連接至至少一氧原子的矽原子，此至少一氧原子連接至一碳原子；且提供包含氫原子之反應物於反應室中以在基板上形成氧化矽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The current disclosure relates to methods of depositing silicon oxide on a substrate, methods of forming a semiconductor device and a method of forming a structure. The method comprises providing a substrate in a reaction chamber, providing a silicon precursor in the reaction chamber, the silicon precursor comprising a silicon atom connected to at least one oxygen atom, the at least one oxygen atom being connected to a carbon atom, and providing a reactant comprising hydrogen atoms in the reaction chamber to form silicon oxide on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102,104,106,108:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2644" publication-number="202617818">
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      <tif file="115101575.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617818</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>奈米壓印用阻劑下層膜形成組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">C08G12/26</main-classification>
        <further-classification edition="200601120260126B">C08G8/10</further-classification>
        <further-classification edition="200601120260126B">C08G4/00</further-classification>
        <further-classification edition="200601120260126B">B29C59/02</further-classification>
        <further-classification edition="200601120260126B">G03F7/00</further-classification>
        <further-classification edition="200601120260126B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徳永光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUNAGA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供高溫燒成時亦顯示特別地高的疏水性、良好的平坦化性，可藉由變更分子骨架，調整為適應製程之光學常數或蝕刻速度的奈米壓印用阻劑下層膜形成組成物。一種奈米壓印用阻劑下層膜形成組成物，其含有具有下述式(1)：  &lt;br/&gt;&lt;img align="absmiddle" height="115px" width="525px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(1)中，基A表示具有芳香族環、縮合芳香族環，或縮合芳香族雜環之有機基，基B表示具有芳香族環，或縮合芳香族環之有機基，基E表示單鍵，或可經取代、亦可包含醚鍵及/或羰基之分支或直鏈的碳數1~10之伸烷基，基D表示以  &lt;br/&gt;&lt;img align="absmiddle" height="111px" width="325px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;係分別獨立地為氟原子，或直鏈、分支鏈或環狀之烷基，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;之任意2者亦可相互鍵結而形成環)表示之碳原子數1至15之有機基，n表示1-5之數]表示之重複單位構造的酚醛清漆樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
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  <tw-patent-application no="2645" publication-number="202618383">
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          <doc-number>202618383</doc-number>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02B11/34</main-classification>
        <further-classification edition="202101120260123B">G02B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴一容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, IL YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學成像系統，包含自物側按次序安置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡以及第八透鏡。第一透鏡具有正折射力，且第二透鏡具有負折射力。第一透鏡至第八透鏡中的至少三者各自具有1.61或大於1.61的折射率，且滿足（TTL/（2×IMG HT））×（TTL/f） ＜ 0.64，其中TTL為光軸上自第一透鏡的物側表面至成像平面的距離，IMG HT為成像平面的對角線長度的一半，且f為第一透鏡至第八透鏡的總焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens disposed in order from an object side. The first lens has positive refractive power, and the second lens has negative refractive power. At least three of the first to eighth lenses each has a refractive index of 1.61 or more, and （TTL/（2×IMG HT））×（TTL/f） ＜ 0.64 is satisfied, where TTL is a distance from an object-side surface of the first lens to an imaging plane on an optical axis, IMG HT is half a diagonal length of the imaging plane, and f is a total focal length of the first lens to the eighth lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">190:濾光片</p>
        <p type="p">191:成像平面</p>
        <p type="p">IS:影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2646" publication-number="202618406">
    <tif-files tif-type="multi-tif">
      <tif file="115101689.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學結構</chinese-title>
        <english-title>LIGHT STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">G02B27/14</main-classification>
        <further-classification edition="201501120260123B">G02B1/10</further-classification>
        <further-classification edition="200601120260123B">G02B27/01</further-classification>
        <further-classification edition="200601120260123B">G02B5/08</further-classification>
        <further-classification edition="200601120260123B">G02B5/28</further-classification>
        <further-classification edition="200601120260123B">B29D11/00</further-classification>
        <further-classification edition="200601120260123B">F21V8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙爾林　埃拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARLIN, ELAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾莫尼　德羅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMONI, DROR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種製造具有多個部分反射表面的光導光學元件的方法。該方法包括：提供多個透明板，每個板的兩個相反的表面被拋光，使得表面彼此平行；用第一塗層來塗覆板子集的表面中的第一表面；用第二塗層來塗覆板子集的表面中的第二表面；將多個透明板接合在一起以形成堆疊；以及沿與透明板的面成斜角的平行平面切割堆疊，以形成光學元件，其中，第一塗層是具有第一組機械性質的部分反射塗層，並且第二塗層選自包括以下的組：與第一塗層類似的塗層以及具有與第一組機械性質基本上類似的第二組機械性質的非反射塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:堆疊</p>
        <p type="p">10,10’:板</p>
        <p type="p">12:部分反射塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2647" publication-number="202619068">
    <tif-files tif-type="multi-tif">
      <tif file="115101721.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有邊緣側互連的半導體封裝</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE WITH EDGE SIDE INTERCONNECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01L23/28</main-classification>
        <further-classification edition="200601120260122B">H01L23/48</further-classification>
        <further-classification edition="200601120260122B">H01L21/56</further-classification>
        <further-classification edition="200601120260122B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銓心半導體異質整合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺創科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學園區新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, HO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧超群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體封裝包括：多個積體電路(IC)結構，其中每一IC結構包含：第一主體，具有主表面和副表面，該主表面的面積大於該副表面的面積；主RDL，設置在第一主體的主表面上，主RDL的一邊緣表面與第一主體的副表面大體上對齊；邊緣RDL，設置在第一主體的副表面及該主RDL的邊緣表面上。主RDL與邊緣RDL和第一主體電連接，且邊緣RDL透過主RDL與第一主體電連接。主RDL更包含透過主RDL的邊緣表面暴露的第一導電元件。邊緣RDL具有彼此相對的第一互連表面和第二互連表面，第一互連表面覆蓋主RDL的第一導電元件，且第一導電元件在第二互連表面上與多個第二導電元件電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory stack of a semiconductor package includes a first body, a primary redistribution layer (RDL) and an edge RDL. The first body has a primary surface and a secondary surface, wherein the primary surface is greater than the secondary surface in area. The primary RDL is disposed over the primary surface of the first body, with the primary RDL having an edge surface substantially aligned with the secondary surface of the first body. The edge RDL is disposed over the secondary surface of the first body and the edge surface of the primary RDL. The primary RDL is electrically connected to the edge RDL and the first body, and the edge RDL is electrically connected to the first body through the primary RDL. The primary RDL further includes a first conductive element exposed through the edge surface of the primary RDL. The edge RDL has a first interconnect surface and a second interconnect surface opposite to the first interconnect surface, wherein the first interconnect surface covers the first conductive element of the primary RDL, and the first conductive element is electrically connected to a plurality of second conductive elements at the second interconnect surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">108A:主RDL</p>
        <p type="p">108P1:主表面</p>
        <p type="p">108P2:主表面</p>
        <p type="p">108S1:側表面</p>
        <p type="p">108S2:側表面</p>
        <p type="p">108S3:側表面</p>
        <p type="p">108S4:側表面</p>
        <p type="p">212:導電墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2648" publication-number="202616946">
    <tif-files tif-type="multi-tif">
      <tif file="115101727.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>載具</chinese-title>
        <english-title>CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A01K1/02</main-classification>
        <further-classification edition="200601120260123B">A01K1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商居佳國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YINGZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘知仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, ZHIREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐頌雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種載具，包括至少一個帶引導機構，其中所述至少一個帶引導機構設置於所述載具的側部、底部和頂部中之至少一者，並配置為引導穿過其中的固定帶組件的帶體，使得所述固定帶組件在所述至少一個帶引導機構所在的位置處與所述載具結合，進而使所述載具能夠通過所述固定帶組件固定至車輛座椅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carrier includes at least one strap guiding mechanism, wherein the at least one strap guiding mechanism is disposed at at least one of a side, a bottom and a top of the carrier and is configured to guide a strap body of a fixing strap assembly that is passed therethrough, whereby the fixing strap assembly is attached the carrier at the location of the at least one strap guiding mechanism so that the carrier is capable of being secured to a vehicle seat via the fixing strap assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3110:箱體</p>
        <p type="p">3112:底部支撐件</p>
        <p type="p">31121:連接部</p>
        <p type="p">3115:提把</p>
        <p type="p">3300:固定帶組件</p>
        <p type="p">3310:約束帶組件</p>
        <p type="p">3311:約束帶</p>
        <p type="p">3312:第一連接端</p>
        <p type="p">3314:孔</p>
        <p type="p">3320:延長部件</p>
        <p type="p">3321:延長帶</p>
        <p type="p">3322:調節部</p>
        <p type="p">3323:第三連接端</p>
        <p type="p">3324:第四連接端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2649" publication-number="202618194">
    <tif-files tif-type="multi-tif">
      <tif file="115101762.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法</chinese-title>
        <english-title>VERTICAL BATCH FURNACE ASSEMBLY , AND METHOD FOR COOLING VERTICAL BATCH FURNACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">F27D9/00</main-classification>
        <further-classification edition="200601120260123B">F27B17/00</further-classification>
        <further-classification edition="200601120260123B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋爾巴斯　梅爾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERBAAS, MELVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　瑞達　克里斯提納斯　Ｇ　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE RIDDER, CHRISTIANUS G.M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種垂直批式熔爐總成，包含一核心管、一外殼、由外殼及核心管定界及圍封之一冷卻室、及在冷卻室中發出一冷卻氣體之至少一冷卻氣體供應。核心管具有在一縱向方向上延伸之一細長圓周壁，且配置以容納用於在垂直批式熔爐中處理之晶圓。外殼圍繞核心管延伸並包含一加熱元件，加熱元件用於施加一熱處理至容納於核心管中之晶圓。至少一冷卻氣體供應包含至少一冷卻氣體供應開口，經配置使得冷卻氣體以實質上正切圓周壁的一流動方向進入冷卻室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vertical batch furnace assembly, comprising a core tube, an outer casing, a cooling chamber bounded and enclosed by the outer casing and the core tube, and at least one cooling gas supply emanating in the cooling chamber. The core tube has an elongated circumferential wall extending in a longitudinal direction, and is configured to accommodate wafers for processing in the vertical batch furnace. The outer casing extends around the core tube and comprises a heating element for applying a thermal treatment to wafers accommodated in the core tube. The at least one cooling gas supply comprises at least one cooling gas supply opening which is arranged such that the cooling gas enters the cooling chamber with a flow direction which is substantially tangent to the circumferential wall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:垂直批式熔爐總成</p>
        <p type="p">12:核心管</p>
        <p type="p">14:圓周壁</p>
        <p type="p">16:外殼</p>
        <p type="p">18:加熱元件</p>
        <p type="p">20:冷卻室</p>
        <p type="p">22:冷卻氣體入口管</p>
        <p type="p">26:冷卻氣體供應開口</p>
        <p type="p">30:冷卻氣體排放</p>
        <p type="p">31:排放開口</p>
        <p type="p">32:(冷卻室之)第一縱向端</p>
        <p type="p">34:(冷卻室之)第二縱向端</p>
        <p type="p">36:冷卻氣體再循環通道</p>
        <p type="p">36a:壓力部件，供應部件</p>
        <p type="p">36b:抽吸部件</p>
        <p type="p">38:增壓裝置</p>
        <p type="p">40:熱交換器</p>
        <p type="p">42a:轉向器閥</p>
        <p type="p">42b:轉向器閥</p>
        <p type="p">52a:排放閥</p>
        <p type="p">52b:排放閥</p>
        <p type="p">F:箭頭</p>
        <p type="p">L:縱向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2650" publication-number="202617989">
    <tif-files tif-type="multi-tif">
      <tif file="115101787.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101787</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於ＮＴ－３基因療法之方法及材料</chinese-title>
        <english-title>METHODS AND MATERIALS FOR NT-3 GENE THERAPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C12N15/11</main-classification>
        <further-classification edition="200601120260123B">C12N15/86</further-classification>
        <further-classification edition="200601120260123B">A61K48/00</further-classification>
        <further-classification edition="200601120260123B">A61P21/00</further-classification>
        <further-classification edition="200601120260123B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國全美兒童醫院之研究學會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESEARCH INSTITUTE AT NATIONWIDE CHILDREN'S HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>撒漢克　札瑞芙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHENK, ZARIFE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於神經營養蛋白3(NT-3)多核苷酸之重組腺相關病毒(rAAV)遞送。本發明提供rAAV及使用所述rAAV進行NT-3基因療法以改善肌肉力量、刺激肌肉生長及治療肌肉消耗病症之方法，所述肌肉消耗病症諸如肌肉萎縮症及夏馬杜三氏神經病變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to recombinant adeno-associated virus (rAAV) delivery of a neurotrophin 3 (NT-3) polynucleotide. The disclosure provides rAAV and methods of using the rAAV for NT-3 gene therapy to improve muscle strength, stimulate muscle growth and to treat muscle wasting disorders, such as muscular dystrophy and Charcot-Marie-Tooth neuropathy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2651" publication-number="202617406">
    <tif-files tif-type="multi-tif">
      <tif file="115101791.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦程式產品、異常探測方法、異常探測裝置以及成形機系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B29C45/76</main-classification>
        <further-classification edition="201901120260127B">G01M13/00</further-classification>
        <further-classification edition="200601120260127B">G05B23/02</further-classification>
        <further-classification edition="201901120260127B">G06N20/00</further-classification>
        <further-classification edition="201701120260127B">G06T7/246</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大下武諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHSHITA, TAKEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>風呂川幹央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUROKAWA, MIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野峻之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可以將有關工業機械之可動部的物理量的時間序列資料變換為以影像表示的時間序列資料影像，基於該時間序列資料影像判定工業機械之異常的異常探測方法的異常探測裝置。  &lt;br/&gt;偵測具有可動部的工業機械之異常的異常探測方法，取得從偵測有關可動部之運動之物理量的感測器輸出的時間序列之物理量資料，將取得之時間序列之物理量資料變換為以影像表示的時間序列資料影像，藉由將變換之時間序列資料影像輸入已學習有關正常之可動部的時間序列資料影像的特徵的學習模型，算出時間序列資料影像之特徵量，基於算出之特徵量判定工業機械有無異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:二軸捏合擠壓機</p>
        <p type="p">2:位移感測器</p>
        <p type="p">3:異常探測裝置</p>
        <p type="p">10:汽缸</p>
        <p type="p">11:第1螺桿</p>
        <p type="p">11a:驅動軸</p>
        <p type="p">12:第二螺桿</p>
        <p type="p">12a:驅動軸</p>
        <p type="p">13:馬達</p>
        <p type="p">14:減速機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2652" publication-number="202619487">
    <tif-files tif-type="multi-tif">
      <tif file="115101834.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造電可抹除可程式化非揮發性記憶體單元之方法及記憶體單元結構</chinese-title>
        <english-title>METHOD OF MANUFACTURING ELECTRICALLY ERASABLE PROGRAMMABLE NONVOLATILE MEMORY CELL AND MEMORY CELL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H10B41/30</main-classification>
        <further-classification edition="202301120260123B">H10B43/30</further-classification>
        <further-classification edition="202501120260123B">H10D64/00</further-classification>
        <further-classification edition="202501120260123B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商綠芯智慧財產有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENLIANT IP, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　炳輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電可抹除可程式化非揮發性記憶體單元包括：一半導體基板，其具有一位元線區、在一側向方向上與該位元線區隔開之一表面區，及在該側向方向上與該表面區隔開之一溝槽區，該溝槽區包含鄰近於該半導體基板中之一溝槽的一底部部分及一側壁部分；一導電控制閘極；一導電字線；及一浮動閘極，其與該基板及該字線絕緣，且包含：一第一尖端，其與該基板之該溝槽區之該側壁部分大體上對準；及一第二尖端，其與該字線之距該控制閘極之第二部分最遠之一邊緣自對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrically erasable programmable nonvolatile memory cell includes a semiconductor substrate having a bit line region, a surface region apart from the bit line region in a lateral direction, and a trench region apart from the surface region in the lateral direction, the trench region comprising a bottom portion and a sidewall portion adjacent a trench in the semiconductor substrate; an electrically conductive control gate; an electrically conductive word line; and a floating gate insulated from the substrate and the word line and comprising: a first tip substantially aligned with the sidewall portion of the trench region of the substrate; and a second tip self-aligned with an edge of the word line that is farthest from the second portion of the control gate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:半導體基板</p>
        <p type="p">104:位元線區</p>
        <p type="p">105:LDD區</p>
        <p type="p">106:表面區/區/表面部分/部分</p>
        <p type="p">108a:底部部分</p>
        <p type="p">108b:側壁部分</p>
        <p type="p">109:溝槽</p>
        <p type="p">111:基板表面</p>
        <p type="p">120:控制/抹除閘極</p>
        <p type="p">122:控制/抹除閘極之第一部分</p>
        <p type="p">124:控制/抹除閘極之第二部分</p>
        <p type="p">130:字線</p>
        <p type="p">132:字線之邊緣</p>
        <p type="p">140:介電層</p>
        <p type="p">150:浮動閘極</p>
        <p type="p">152:浮動閘極之第一末端</p>
        <p type="p">154:浮動閘極之第二末端</p>
        <p type="p">160:絕緣材料</p>
        <p type="p">162:抹除閘極絕緣區</p>
        <p type="p">164:浮動閘極絕緣區</p>
        <p type="p">190:通道</p>
        <p type="p">1200:記憶體單元</p>
        <p type="p">1201:鏡像記憶體單元</p>
        <p type="p">1228:間隔物</p>
        <p type="p">1234:第一穿隧氧化物</p>
        <p type="p">1240:溝槽植入物</p>
        <p type="p">1242:第二穿隧氧化物</p>
        <p type="p">1260:深鹵基植入物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2653" publication-number="202619616">
    <tif-files tif-type="multi-tif">
      <tif file="115101835.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260123B">H10K59/80</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹榮顥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, YEONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴精敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JEONG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明一實施例的顯示裝置包含：包含顯示區、設置於顯示區中且包含通孔的光學區以及用以圍繞顯示區的非顯示區的基板、設置於基板上的多個絕緣層、設置於這些絕緣層上的至少一壩部，以及設置於這些絕緣層上且被設置為較至少一壩部更靠近通孔的至少一反連接部，其中第一溝槽設置於在光學區中重疊至少一反連接部的這些絕緣層中的若干者中。因此，可抑制因為光學區中的外部干擾而出現的裂縫傳播。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device according to an embodiment of the present specification includes a substrate including a display area, an optical area disposed in the display area and including a through-hole, and a non-display area configured to surround the display area, a plurality of insulation layers disposed on the substrate, at least one dam disposed on the plurality of insulation layers, and at least one anti-connection part disposed on the plurality of insulation layers and disposed to be closer to the through-hole than the at least one dam, in which first trenches are disposed in some of the plurality of insulation layers that overlaps the at least one anti-connection part in the optical area. Therefore, it is possible to inhibit cracks, which occur because of external interference in an optical area, from propagating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">110a:第一基板</p>
        <p type="p">110b:第二基板</p>
        <p type="p">110c:層間絕緣膜</p>
        <p type="p">111:第一緩衝層</p>
        <p type="p">111a:多重緩衝層</p>
        <p type="p">111b:主動緩衝層</p>
        <p type="p">112a:第一閘極絕緣層</p>
        <p type="p">112b:第二閘極絕緣層</p>
        <p type="p">113a:第一層間絕緣層</p>
        <p type="p">113b:第二層間絕緣層</p>
        <p type="p">114:第二緩衝層</p>
        <p type="p">115b:第二平坦化層</p>
        <p type="p">116a:堤部</p>
        <p type="p">116b:間隔件</p>
        <p type="p">117:封裝層</p>
        <p type="p">117a:第一封裝層</p>
        <p type="p">117b:第二封裝層</p>
        <p type="p">117c:第三封裝層</p>
        <p type="p">118a:觸控緩衝層</p>
        <p type="p">118b:觸控層間絕緣層</p>
        <p type="p">210:第一抑制部</p>
        <p type="p">211:第一結構</p>
        <p type="p">212:第二結構</p>
        <p type="p">213:第三結構</p>
        <p type="p">214:第四結構</p>
        <p type="p">220:第二抑制部</p>
        <p type="p">221:第五結構</p>
        <p type="p">222:第六結構</p>
        <p type="p">223:第七結構</p>
        <p type="p">224:第八結構</p>
        <p type="p">301:第一壩部</p>
        <p type="p">302:第二壩部</p>
        <p type="p">C:區域</p>
        <p type="p">GM:閘極金屬</p>
        <p type="p">V-V’:線</p>
        <p type="p">T1:第一溝槽</p>
        <p type="p">TS:觸控感測器金屬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2654" publication-number="202619304">
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      <tif file="115101858.zip" no="1">
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        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於混合電容器及電感器之數位隔離器架構</chinese-title>
        <english-title>DIGITAL ISOLATOR ARCHITECTURE FOR HYBRID CAPACITOR AND INDUCTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H04B3/54</main-classification>
        <further-classification edition="200601120260122B">H04B1/10</further-classification>
        <further-classification edition="200601120260122B">H04B1/16</further-classification>
        <further-classification edition="200601120260122B">H04B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商芯凱科技國際控股有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINETIC TECHNOLOGIES INTERNATIONAL HOLDINGS LP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾斯　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORTH, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜塔　悉達多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUTTA, SIDDHARTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">通常，所揭示之一個態樣可具一裝置之特徵，該裝置包括：一接收器，其包括一接收器電感器-電容器(LC)槽；一發射器，其包括一振盪器；及電耦合在該發射器之一輸出與該接收器之一輸入之間的一電容隔離障壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In general, one aspect disclosed features an apparatus comprising: a receiver comprising a receiver inductor-capacitor (LC) tank; a transmitter comprising an oscillator; and a capacitive isolation barrier electrically coupled between an output of the transmitter and an input of the receiver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:電路</p>
        <p type="p">402:電容隔離障壁</p>
        <p type="p">404:發射器</p>
        <p type="p">406:接收器</p>
        <p type="p">408:振盪器</p>
        <p type="p">410:發射(TX)驅動器</p>
        <p type="p">412:接收(RX)放大器</p>
        <p type="p">420:電感器-電容器(LC)槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2655" publication-number="202617641">
    <tif-files tif-type="multi-tif">
      <tif file="115101890.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617641</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含組成物的電子元件以及有機發光元件</chinese-title>
        <english-title>ELECTRONIC DEVICE AND ORGANIC LIGHT EMITTING DEVICE INLUDING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C07C15/28</main-classification>
        <further-classification edition="200601120260123B">C09B59/00</further-classification>
        <further-classification edition="202301120260123B">H10K50/12</further-classification>
        <further-classification edition="202301120260123B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, JAEHYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓秀姸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SU YOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李禹哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WOOCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐基晧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYOUNG HYOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書是有關於一種包含組成物的電子元件及有機發光元件。組成物包括由化學式1表示且具有不同的氘取代數的二或更多種化合物。在組成物中，具有不同的氘取代數的二或更多種化合物的具有最高的每質量數同位素含量的同位素的氘數為13或大於13。在組成物中，具有13或大於13的氘取代數的化合物的每質量數同位素含量之和為50%或大於50%以及90%或小於90%。在組成物中，具有最高的每質量數同位素含量的同位素的氘數相等或更高的化合物的以氘數計的取代比率之和為50%或大於50%且為80%或小於80%。以氘數計的取代比率是藉由方程式1而獲得的值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present specification relates to an electronic device and an organic light emitting device including the composition. The composition includes two or more compounds represented by Chemical Formula 1 and having a different number of deuterium substitution. In the composition, a number of deuterium of an isotope having a highest isotope content for each mass number of the two or more compounds having a different number of deuterium substitution is 13 or greater. In the composition, a sum of the isotope content for each mass number of the compounds having the number of deuterium substitution of 13 or greater is 50% or greater and 90% or less. In the composition, a sum of a substitution ratio by the number of deuterium of the compounds having an equal or higher number of deuterium of the isotope having a highest isotope content for each mass number is 50% or greater and 80% or less, the substitution ratio by the number of deuterium is a value obtained by the Equation 1</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2656" publication-number="202617912">
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          <doc-number>202617912</doc-number>
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        <document-id>
          <doc-number>115101910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含填料膜及其製造方法、膜貼合體、連接構造體及其製造方法</chinese-title>
        <english-title>FILM CONTAINING FILLER AND MANUFACTURING METHOD THEREOF, FILM BONDED BODY, CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">C09J9/02</main-classification>
        <further-classification edition="200601120260123B">C08J5/18</further-classification>
        <further-classification edition="201801120260123B">C08K3/00</further-classification>
        <further-classification edition="200601120260123B">B32B27/20</further-classification>
        <further-classification edition="200601120260123B">B32B27/30</further-classification>
        <further-classification edition="201801120260123B">C09J7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾怜司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAO, REIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慎一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原誠一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, SEIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中雄介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種含填料膜，其具有於黏合劑樹脂層中保持有填料之構造。填料之平均粒徑為1～50 μm，樹脂層之總厚度為填料之平均粒徑之0.5倍以上且2倍以下，且與含填料膜之長度方向之一端於膜長度方向上距離5 m以上之另一端中的最小填料間距離Lq相對於該一端中之最小填料間距離Lp的比Lq／Lp為1.2以下。較佳為將填料排列成格子狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:填料或導電粒子</p>
        <p type="p">2:黏合劑樹脂層或絕緣性樹脂層</p>
        <p type="p">2b:凹陷</p>
        <p type="p">3:填料分散層或導電粒子分散層</p>
        <p type="p">4:第2樹脂層</p>
        <p type="p">5:基材膜</p>
        <p type="p">10F:含填料膜或異向性導電膜</p>
        <p type="p">La:黏合劑樹脂層之層厚</p>
        <p type="p">Ld:第2樹脂層之層厚</p>
        <p type="p">Le:基材膜之厚度</p>
        <p type="p">Lt:樹脂層之總厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2657" publication-number="202618435">
    <tif-files tif-type="multi-tif">
      <tif file="115101987.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射型空白光罩及反射型光罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260128B">G03F1/24</main-classification>
        <further-classification edition="201201120260128B">G03F1/54</further-classification>
        <further-classification edition="200601120260128B">C23C14/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科盛德光罩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEKSCEND PHOTOMASK CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山形悠斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGATA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合田步美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODA, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野秀亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市川顯二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIKAWA, KENJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮脇大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAWAKI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種反射型空白光罩及反射型光罩，其抑制或減輕以極紫外區域之波長的光為光源之圖案化轉印用的反射型光罩之陰影效應，且具有氫自由基耐性。本實施形態的反射型空白光罩(10)依序具備基板(1)、反射部(5)、和低反射部(4)，低反射部(4)具備多層反射膜(2)和覆蓋層(3)，低反射部(4)包含高消光係數材料、Ta、和由Ti、Nb、W及Mo構成的材料群組之中的至少一種，且包含高於50at%的高消光係數材料，低反射部(4)中之由Ti、Nb、W及Mo構成的材料群組之中的至少一種之含有率為Ta的含有率以下，低反射部(4)的合計膜厚為45nm以下，低反射部(4)的OD值為1.0以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:多層反射膜</p>
        <p type="p">3:覆蓋層</p>
        <p type="p">4:低反射部</p>
        <p type="p">5:反射部</p>
        <p type="p">10:反射型空白光罩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2658" publication-number="202618891">
    <tif-files tif-type="multi-tif">
      <tif file="115102023.zip" no="1">
      </tif>
    </tif-files>
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102023</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有鉬之低電阻係數膜</chinese-title>
        <english-title>LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">H01L21/20</main-classification>
        <further-classification edition="200601120260126B">H01L21/324</further-classification>
        <further-classification edition="202501120260126B">H10D89/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯貝爾　思魯提　維克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMBARE, SHRUTI VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡瑪雲　拉許納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMAYUN, RAASHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹納克　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANEK, MICHAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　照健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIUKIN STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林斯　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLINS, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班諾爾克　漢娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMNOLKER, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘迺迪　格里芬　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENNEDY, GRIFFIN JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特爾　戈倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUTAIL, GORUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　克林帕　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN CLEEMPUT, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於邏輯和記憶體應用的低電阻係數金屬化堆疊結構及相關的製造方法。在一些實施方式中，該方法涉及在基板上提供含鎢（W）層；及在含W層上沉積含鉬（Mo）層。在一些實施方式中，該方法涉及將含Mo層直接沉積在介電質或氮化鈦（TiN）基板上而沒有中介的含W層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are low resistance metallization stack structures for logic and memory applications and related methods of fabrication. In some implementations, the methods involve providing a tungsten (W)-containing layer on a substrate; and depositing a molybdenum (Mo)-containing layer on the W-containing layer. In some implementations, the methods involve depositing a Mo-containing layer directly on a dielectric or titanium nitride (TiN) substrate without an intervening W-containing layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:保形阻障層</p>
        <p type="p">13:絕緣層</p>
        <p type="p">202:矽基板</p>
        <p type="p">208:埋入式字元線(bWL)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2659" publication-number="202618374">
    <tif-files tif-type="multi-tif">
      <tif file="115102043.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G02B11/20</main-classification>
        <further-classification edition="200601120260126B">G02B17/04</further-classification>
        <further-classification edition="202101120260126B">G02B7/02</further-classification>
        <further-classification edition="202101120260126B">G02B7/18</further-classification>
        <further-classification edition="200601120260126B">G02B13/18</further-classification>
        <further-classification edition="200601120260126B">G02B26/08</further-classification>
        <further-classification edition="200601120260126B">G02B9/34</further-classification>
        <further-classification edition="202001120260126B">G02B30/00</further-classification>
        <further-classification edition="202301120260126B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林采煐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHE YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括自物側依次設置的第一透鏡、第二透鏡、第三透鏡及第四透鏡。所述光學成像系統滿足4.0 ＜ f/IMG_HT ＜ 5.0，其中f是所述光學成像系統的焦距，且IMG_HT是成像平面的對角線長度的一半。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, and a fourth lens disposed in order from an object side. The optical imaging system satisfies 4.0 ＜ f/IMG_HT ＜ 5.0, where f is a focal length of the optical imaging system, and IMG_HT is one-half of a diagonal length of an imaging plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:濾波器</p>
        <p type="p">160:影像感測器</p>
        <p type="p">C1:第一光軸</p>
        <p type="p">C2:光軸中心/第二光軸</p>
        <p type="p">P:稜鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2660" publication-number="202617531">
    <tif-files tif-type="multi-tif">
      <tif file="115102062.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙重容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">B65D1/02</main-classification>
        <further-classification edition="200601120260123B">B65D77/04</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京洛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYORAKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>室屋洋輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUROYA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樽野真輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARUNO, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉橋雄飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAHASHI, YUHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤孝幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐野尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANO, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大村一平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMURA, IPPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新實譽也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIMI, TAKAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田攻一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, KOUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江口鐵明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGUCHI, TETSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可以很容易地從外殼拉出內袋的雙重容器。根據本發明提供一種雙重容器，具備容器本體和口部安裝部件，容器本體具備口部、軀幹部、以及底部，口部是具有開口端的筒狀部位，軀幹部在口部的遠離開口端的一側與口部鄰接配置，且外徑比口部的外徑大，底部構成為封閉軀幹部的下端，容器本體具備內袋和配置成覆蓋內袋的外殼，口部安裝部件構成為可安裝到口部上，且隨著口部安裝部件旋轉，內袋旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙重容器</p>
        <p type="p">2:容器本體</p>
        <p type="p">4c:突出部</p>
        <p type="p">5:口部</p>
        <p type="p">5a:卡合部</p>
        <p type="p">5b:凸緣</p>
        <p type="p">5c:開口端</p>
        <p type="p">6b:肩部</p>
        <p type="p">6c:軀幹部主體</p>
        <p type="p">6d:凹部</p>
        <p type="p">6e:槽</p>
        <p type="p">7:底部</p>
        <p type="p">8:口部安裝部件</p>
        <p type="p">16:外部氣體導入孔</p>
        <p type="p">22:資訊標識</p>
        <p type="p">22a:可回收標誌</p>
        <p type="p">22b:資訊</p>
        <p type="p">23:資訊標識</p>
        <p type="p">23a:可回收標誌</p>
        <p type="p">23b:資訊</p>
      </representative-img>
    </description>
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  <tw-patent-application no="2661" publication-number="202618410">
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      <tif file="115102066.zip" no="1">
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      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618410</doc-number>
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      </publication-reference>
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        <document-id>
          <doc-number>115102066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學膜以及使用光學膜的方法</chinese-title>
        <english-title>OPTICAL FILM AND METHOD OF USING OPTICAL FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G02C7/02</main-classification>
        <further-classification edition="200601120260130B">G02C9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商恩塔米克控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NTHALMIC HOLDING PTY LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芭卡羅朱　拉維　錢德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAKARAJU, RAVI CHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃爾曼　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EHRMANN, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法爾克　達林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALK, DARRIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及治療眼軸長度疾病（例如近視）的手段。 本發明包括用於處方，選擇，供應和裝配與標準單光眼鏡一起使用的永久性或非永久性光學膜的設備和方法，其中該設備和方法配置有非屈光不透明特徵，其中非屈光不透明特徵促進了佩戴者整個視網膜神經節細胞活動性的增加，這可以用作光學信號，以減慢，改善，控制，抑制或降低佩戴者的近視發展速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2662" publication-number="202618209">
    <tif-files tif-type="multi-tif">
      <tif file="115102108.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102108</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於傳導式電氣武器電極的矛組合件</chinese-title>
        <english-title>SPEAR ASSEMBLY FOR AN ELECTRODE OF A CONDUCTED ELECTRICAL WEAPON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">F41H13/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛克勝企業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXON ENTERPRISE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內提敘金　歐雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMTYSHKIN, OLEG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法莫　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARMER, DAVID S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯科爾　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRISCOLL, SAMUEL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛珀　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE SCHEPPER, PETER BRIAN AYRTON YSSEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">用於傳導式電氣武器的電極可以包括矛組合件。矛組合件可被組態為從第一位置平移到第二個位置。矛組合件可包括第一矛和第二矛。第二矛可被設置在第一矛內。因應於與目標的撞擊，第一矛可保持靜止，而第二矛在向前方向上平移到第二位置。第二矛可以用皮帶保持電氣耦接到第一矛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode for a conducted electrical weapon may comprise a spear assembly. The spear assembly may be configured to translate from a first position to a second position. The spear assembly may comprise a first spear and a second spear. The second spear may be disposed within the first spear. In response to impact with a target, the first spear may remain stationary while the second spear translates in a forward direction to the second position. The second spear may remain electrically coupled to the first spear with a leash.</p>
      </isu-abst>
      <representative-img>
        <p type="p">331:電極本體</p>
        <p type="p">332:第一端</p>
        <p type="p">333:第二端</p>
        <p type="p">339:第二細絲線端</p>
        <p type="p">340:頭部</p>
        <p type="p">341:本體</p>
        <p type="p">360:吸收器</p>
        <p type="p">361:吸收器本體</p>
        <p type="p">362:第一吸收器端</p>
        <p type="p">363:第二吸收器端</p>
        <p type="p">365:分散器</p>
        <p type="p">370:矛組合件</p>
        <p type="p">377:皮帶</p>
        <p type="p">380:第一矛</p>
        <p type="p">381:第一矛本體</p>
        <p type="p">382:第一端</p>
        <p type="p">385:通道</p>
        <p type="p">390:第二矛</p>
        <p type="p">391:第二矛本體</p>
        <p type="p">392:第一端</p>
        <p type="p">393:第二端</p>
        <p type="p">395:通道</p>
      </representative-img>
    </description>
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          <doc-number>115102124</doc-number>
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      <invention-title>
        <chinese-title>射頻－微機電（ＲＦ－ＭＥＭＳ）電容開關及用於製造其之方法</chinese-title>
        <english-title>RF-MEMS CAPACITIVE SWITCH AND METHOD FOR MANUFACTURING THE SAME</english-title>
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      <classification-ipc>
        <main-classification edition="200601120260202B">H01H1/00</main-classification>
        <further-classification edition="200601120260202B">H01H11/00</further-classification>
        <further-classification edition="200601120260202B">H03K17/975</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商奈努勝公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANUSENS SL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊　席維斯特　喬賽　蒙坦雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I SILVESTRE, JOSEP MONTANYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑪斯　摩洛提　馬可　安東尼歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LLAMAS MOROTE, MARCO ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種RF-MEMS電容開關，其包含一中心頂點及複數個單元。該複數個單元之至少兩者係耦合至該中心頂點之相對側，且該複數個單元之各者包含一轉子及一定子。至少一個曲折彈簧係耦合至該中心頂點之一端。該電容開關包含一頂部層及一底部層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A RF-MEMS capacitive switch including a central apex and a plurality of cells. At least two of the plurality of cells are coupled to opposing sides of the central apex and each of the plurality of cells includes a rotor and a stator. At least one meander spring is coupled to an end of the central apex. The capacitive switch includes a top layer and a bottom layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一射頻-微機電(RF-MEMS)電容開關</p>
        <p type="p">102:曲折彈簧</p>
        <p type="p">104:單位單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2664" publication-number="202619489">
    <tif-files tif-type="multi-tif">
      <tif file="115102162.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">H10B51/00</main-classification>
        <further-classification edition="202301120260202B">H10B61/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金谷宏行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAYA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山昌彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施方式提供一種能夠抑制非選擇單元之漏電流之半導體記憶裝置。  &lt;br/&gt;本實施方式之半導體記憶裝置具備於第1方向延伸之複數個第1配線、及在與第1方向交叉之第2方向延伸之複數個第2配線。複數個記憶胞連接於複數個第1配線與複數個第2配線之間，分別包含串聯連接於電阻變化元件之選擇器。選擇器具備根據第1配線與第2配線之電壓差來切換向電阻變化元件流通之電流之選擇器材料、以及於第1配線與電阻變化元件之間隔著選擇器材料之第1及第2電極。第1電極與選擇器材料之接觸面積小於自選擇器與電阻變化元件之積層方向觀察時之選擇器材料之面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BL:位元線</p>
        <p type="p">HL:貫通孔</p>
        <p type="p">ILD:層間絕緣膜</p>
        <p type="p">MC:記憶胞</p>
        <p type="p">MTJ:磁阻效應元件</p>
        <p type="p">SEL:選擇器</p>
        <p type="p">SELel_1:電極</p>
        <p type="p">SELel_2:電極</p>
        <p type="p">SELm:選擇器材料</p>
        <p type="p">WL:字元線</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2665" publication-number="202619383">
    <tif-files tif-type="multi-tif">
      <tif file="115102165.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在衛星切換期間使用小區切換輔助資訊進行ＳＳＢ搜尋之技術</chinese-title>
        <english-title>USE OF CELL SWITCH ASSISTANCE INFORMATION FOR SSB SEARCHING DURING SATELLITE SWITCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260202B">H04W36/08</main-classification>
        <further-classification edition="200601120260202B">H04B7/185</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷德里克森　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREDERIKSEN, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維加德　傑倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIGARD, JEROEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱安　恩里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUAN, ENRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坦扎克　傑德澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STANCZAK, JEDRZEJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一UE，其係使用由一第一衛星服務之一目前小區連接至一BS，從該BS接收資訊，該資訊包括用於從該目前小區到由一第二衛星服務之一小區的一小區切換之輔助資訊。該資訊係在指出該目前小區何時將停止服務該UE之一停止時間之前接收。該UE使用至少該輔助資訊進行從該目前小區到由該第二衛星服務之該小區的該小區切換，來為由該第二衛星服務之該者尋找(諸)小區同步化區塊。該BS從該BS發送該資訊，該資訊包括用於從該目前小區到由一第二衛星服務之一小區的一小區切換之該輔助資訊。該BS在一停止時間關掉該目前小區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A UE, connected using a current cell served by a first satellite to a BS, receives information from the BS including assistance information for a cell switch from the current cell to a cell served by a second satellite. The information is received before a stop time indicating when the current cell will stop serving the UE. The UE performs the cell switch from the current cell to the cell served by the second satellite using at least the assistance information to find cell synchronization block(s) for the served by the second satellite. The BS sends the information from the BS including the assistance information for a cell switch from the current cell to a cell served by a second satellite. The BS shuts down the current cell at a stop time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">203:程序塊</p>
        <p type="p">205:程序塊</p>
        <p type="p">210:程序塊</p>
        <p type="p">215:程序塊</p>
        <p type="p">216:程序塊</p>
        <p type="p">218:參考</p>
        <p type="p">220:程序塊</p>
        <p type="p">220-1:程序塊</p>
        <p type="p">220-2:程序塊</p>
        <p type="p">220-2i:程序塊</p>
        <p type="p">220-3:程序塊</p>
        <p type="p">220-4:程序塊</p>
        <p type="p">220-5:程序塊</p>
        <p type="p">225:程序塊</p>
        <p type="p">228:程序塊</p>
        <p type="p">230:軟小區切換輔助資訊</p>
        <p type="p">230-1:軟小區切換輔助資訊</p>
        <p type="p">230-2:軟小區切換輔助資訊</p>
        <p type="p">230-2i:軟小區切換輔助資訊</p>
        <p type="p">230-3:軟小區切換輔助資訊</p>
        <p type="p">230-4:軟小區切換輔助資訊</p>
        <p type="p">230-5:軟小區切換輔助資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2666" publication-number="202618464">
    <tif-files tif-type="multi-tif">
      <tif file="115102376.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102376</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板台、基板搬出方法、曝光裝置及物品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G03F7/20</main-classification>
        <further-classification edition="200601120260127B">H01L21/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井敬次郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, KEIJIROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長坂祥吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAKA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板台，具有搬出基板的搬出機構，前述搬出機構，具有：保持部，其將前述基板進行保持；驅動部，其驅動於第1方向及和該第1方向相反的第2方向，從而驅動前述保持部；第1導引件，其在使前述驅動部驅動於前述第1方向的情況下，以前述保持部驅動於前述第1方向及和前述第1方向不同的方向的方式進行導引；以及第2導引件，其在使前述驅動部驅動於前述第2方向的情況下，以前述保持部驅動於前述第2方向及和前述第2方向不同的方向的方式進行導引。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:基板台</p>
        <p type="p">20:搭載台</p>
        <p type="p">30:X驅動部</p>
        <p type="p">30a,50a:空氣軸承</p>
        <p type="p">50:Y驅動部</p>
        <p type="p">60:Y導引件</p>
        <p type="p">80:驅動控制部</p>
        <p type="p">90:X條狀反射鏡</p>
        <p type="p">201,202:支柱</p>
        <p type="p">401:Y導引件</p>
        <p type="p">402:Y驅動部(驅動部)</p>
        <p type="p">403:Z導引件</p>
        <p type="p">404:基底</p>
        <p type="p">405:Z驅動部</p>
        <p type="p">410a:第1導引件(導引機構)</p>
        <p type="p">410b:第2導引件(導引機構)</p>
        <p type="p">420a,420b:凸輪從動件(導引機構)</p>
        <p type="p">430a,430b:保持部</p>
        <p type="p">P:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2667" publication-number="202617424">
    <tif-files tif-type="multi-tif">
      <tif file="115102379.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體、光學構件及光學裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B32B5/18</main-classification>
        <further-classification edition="200601120260127B">B32B7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森島諒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHIMA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸敦史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉野晶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGINO, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種空隙層與黏接著層之積層體，其兼顧了黏著力或接著力、與黏著劑或接著劑不易滲透到空隙之特性。&lt;br/&gt;  為了達成前述目的，本發明之第1積層體之特徵在於：&lt;br/&gt;  其包含空隙層與黏接著層；&lt;br/&gt;  黏接著層係直接積層於空隙層之單面或雙面；&lt;br/&gt;  空隙層之空隙率為35體積%以上；且&lt;br/&gt;  於保持在溫度85℃且相對溼度85%下500h之加熱加濕耐久性試驗後，空隙層之空隙殘存率為前述加熱加濕耐久性試驗前的50體積%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基材(樹脂薄膜)</p>
        <p type="p">20:空隙層</p>
        <p type="p">20’:塗敷膜(乾燥後)</p>
        <p type="p">20”:溶膠粒子液</p>
        <p type="p">21:強度經提升之空隙層</p>
        <p type="p">22:中間層</p>
        <p type="p">30:黏接著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2668" publication-number="202618384">
    <tif-files tif-type="multi-tif">
      <tif file="115102422.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像透鏡系統</chinese-title>
        <english-title>IMAGING LENS SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G02B11/34</main-classification>
        <further-classification edition="202101120260127B">G02B7/02</further-classification>
        <further-classification edition="200601120260127B">G02B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李多睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DA YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像透鏡系統包括沿成像透鏡系統的光軸自成像透鏡系統的物體側朝向成像透鏡系統的成像平面以數值昇冪依序設置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡及第七透鏡。第二透鏡在其近軸區域中具有凹的物體側表面。成像透鏡系統滿足f5/f6 ＜ -1.0、f1/f4 ＜ -2.4及190° ≤ HFOV，其中f是成像透鏡系統的焦距，f1是第一透鏡的焦距，f4是第四透鏡的焦距，f5是第五透鏡的焦距，且HFOV是成像透鏡系統的水準視場。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis of the imaging lens system from an object side of the imaging lens system toward an imaging plane of the imaging lens system. The second lens has a concave object-side surface in a paraxial region thereof. The imaging lens system satisfies f5/f6 ＜ -1.0, f1/f4 ＜ -2.4, and 190° ≤ HFOV, where f is a focal length of the imaging lens system, f1 is a focal length of the first lens, f4 is a focal length of the fourth lens, f5 is a focal length of the fifth lens, and HFOV is a horizontal field of view of the imaging lens system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像透鏡系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">CG:蓋玻璃</p>
        <p type="p">IF:濾光器</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">ST:光闌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2669" publication-number="202617976">
    <tif-files tif-type="multi-tif">
      <tif file="115102448.zip" no="1">
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    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>哺乳動物細胞之保存液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260130B">C12N5/0775</main-classification>
        <further-classification edition="201001120260130B">C12N5/0783</further-classification>
        <further-classification edition="201001120260130B">C12N5/078</further-classification>
        <further-classification edition="200601120260130B">C12N1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美加細胞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGAKARYON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥工場股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富塚順子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIZUKA, JUNKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重盛智大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMORI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉奈月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹縄太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKENAWA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白川智景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAKAWA, CHIKAGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村益浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, MASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田泰毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤本修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAMOTO, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種用以於非冷凍狀態下長時間保存哺乳動物細胞之新穎保存液。藉由將抗壞血酸及/或菸酸添加至等張液中製備保存液，將該保存液與血小板混合並振盪保存，能在至少10天抑制血小板之功能或存活率降低。又，藉由將上述保存液與間葉系幹細胞、巨核細胞、或T細胞混合，並於非冷凍狀態下保存，能在至少數天～數十天抑制該等細胞之功能或存活率降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2670" publication-number="202619410">
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      <tif file="115102451.zip" no="1">
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H05H1/46</main-classification>
        <further-classification edition="200601120260202B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉虫元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAMUSHI, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輿水地塩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIMIZU, CHISHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上雅博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松山昇一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUYAMA, SHOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示之電漿處理裝置具備腔室、基板支持部、高頻電源、及偏壓電源控制部。高頻電源產生源高頻電力，以於腔室內生成電漿。偏壓電源對基板支持部之偏壓電極週期性地賦予具有波形週期之偏壓能量。高頻電源係根據源高頻電力之反射程度之變化而對複數個波形週期中第m個波形週期內之第n個相位期間的源高頻電力之源頻率進行調整。反射程度之變化係藉由在第m個波形週期之前之兩個以上之週期各自中之第n個相位期間使用互不相同之源頻率而特定出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通訊介面</p>
        <p type="p">10:電漿處理腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">11:基板支持部</p>
        <p type="p">13:簇射頭</p>
        <p type="p">13a:氣體供給口</p>
        <p type="p">13b:氣體擴散室</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">21:氣體源</p>
        <p type="p">22:流量控制器</p>
        <p type="p">30c:控制部</p>
        <p type="p">31:高頻電源</p>
        <p type="p">31a:放大器</p>
        <p type="p">31g:高頻信號產生器</p>
        <p type="p">31m:匹配器</p>
        <p type="p">31s:感測器</p>
        <p type="p">32:偏壓電源</p>
        <p type="p">32a:放大器</p>
        <p type="p">32g:高頻信號產生器</p>
        <p type="p">32m:匹配器</p>
        <p type="p">40:排氣系統</p>
        <p type="p">111:本體部</p>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">111c:靜電吸盤</p>
        <p type="p">111e:基台</p>
        <p type="p">112:環組件</p>
        <p type="p">BE:偏壓能量</p>
        <p type="p">RF:源高頻電力</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2671" publication-number="202619284">
    <tif-files tif-type="multi-tif">
      <tif file="115102501.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有凸起框架結構之體聲波裝置</chinese-title>
        <english-title>BULK ACOUSTIC WAVE DEVICE WITH RAISED FRAME STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H03H9/02</main-classification>
        <further-classification edition="200601120260202B">H03H9/05</further-classification>
        <further-classification edition="200601120260202B">H03H9/13</further-classification>
        <further-classification edition="200601120260202B">H03H9/17</further-classification>
        <further-classification edition="200601120260202B">H03H9/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商天工全球私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYWORKS GLOBAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張本鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, BENFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳建松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIANSONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿勃特　班傑明　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABBOTT, BENJAMIN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申光在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, KWANG JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯拉卡瓦　亞力山德雷　奧古斯圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAKAWA, ALEXANDRE AUGUSTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之態樣係關於一種具有一多梯度凸起框架之體聲波裝置。該體聲波裝置包含一第一電極、一第二電極、定位於該第一電極與該第二電極之間的一壓電層及一多梯度凸起框架結構，該多梯度凸起框架結構經組態以引起減少自該體聲波裝置之一主聲主動區域之橫向能量洩漏。該多梯度凸起框架結構在對置側上漸縮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of this disclosure relate to a bulk acoustic wave device with a multi-gradient raised frame. The bulk acoustic wave device includes a first electrode, a second electrode, a piezoelectric layer positioned between the first electrode and the second electrode, and a multi-gradient raised frame structure configured to cause lateral energy leakage from a main acoustically active region of the bulk acoustic wave device to be reduced. The multi-gradient raised frame structure is tapered on opposing sides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:體聲波(BAW)裝置</p>
        <p type="p">11:壓電層</p>
        <p type="p">12:第一電極/下電極</p>
        <p type="p">14:第二電極</p>
        <p type="p">15:第一凸起框架層</p>
        <p type="p">16:第二凸起框架層</p>
        <p type="p">17:支撐基板</p>
        <p type="p">18:空氣腔</p>
        <p type="p">19:鈍化層</p>
        <p type="p">RaF1:第一梯度區域</p>
        <p type="p">RaF2:非梯度區域</p>
        <p type="p">RaF3:第二梯度區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2672" publication-number="202619084">
    <tif-files tif-type="multi-tif">
      <tif file="115102605.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及製造其之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01L23/36</main-classification>
        <further-classification edition="200601120260202B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商安靠科技日本公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY JAPAN, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣部正雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROBE, MASAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">配置於半導體晶片及基板之散熱板因伴隨熱膨脹或熱收縮之應力，而有自散熱板及基板剝離之問題。本發明之其中一目的在於解決此問題而提供包括基板、半導體晶片及散熱板之半導體裝置。基板表面包含絕緣材料。半導體晶片以覆晶方式連接於基板上。散熱板經由熱界面材料黏著於半導體晶片，且於半導體晶片之外側固定至基板。散熱板具有突起部及應力吸收部。突起部位於散熱板黏著於半導體晶片之部分及固定於基板之部分之間，並朝向基板突出且藉由導電性樹脂黏著於基板。根據本發明能夠防止散熱板因伴隨熱膨脹或熱收縮之應力而自散熱板及基板剝離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">10:基板</p>
        <p type="p">20:散熱板</p>
        <p type="p">22:突起部</p>
        <p type="p">24:溝槽</p>
        <p type="p">26:應力吸收部</p>
        <p type="p">28:固定部</p>
        <p type="p">30:半導體晶片</p>
        <p type="p">41:黏著劑</p>
        <p type="p">43:導電性黏著劑</p>
        <p type="p">45:底膠</p>
        <p type="p">47:熱界面材料</p>
        <p type="p">49:凸塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2673" publication-number="202618784">
    <tif-files tif-type="multi-tif">
      <tif file="115102655.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G11C16/06</main-classification>
        <further-classification edition="202301120260202B">H10B41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原昭雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAHARA, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>半田貴也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANDA, TAKAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯村亮輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOMURA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上原一人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHARA, KAZUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅岡典央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAOKA, NORICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岡雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAOKA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布什納克沙納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUSHNAQ, SANAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAZAKI, YUZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊崎規泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAZAKI, NORIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田有里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之實施形態提高記憶體裝置之特性。  本發明之實施形態之記憶體裝置包含：記憶胞陣列；電壓產生電路，其產生供給至記憶胞陣列之電壓；輸入輸出電路，其接收表示記憶胞陣列內之區域之位址；及控制電路，其控制記憶胞陣列之動作；且電壓產生電路於接收位址之過程中產生電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:快閃記憶體</p>
        <p type="p">8:控制器</p>
        <p type="p">9:主機裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2674" publication-number="202617744">
    <tif-files tif-type="multi-tif">
      <tif file="115102676.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202617744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高純度組合物及其應用</chinese-title>
        <english-title>HIGH PURITY COMPOSITION AND USES OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">C07F7/22</main-classification>
        <further-classification edition="200601120260130B">G03F7/004</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英培雅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPRIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾德森　約瑟夫　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDSON, JOSEPH B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉姆金　托馬斯　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMKIN, THOMAS J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>厄爾雷　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EARLEY, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬巴赫　杜魯門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAMBACH, TRUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種純組合物，其包含由化學式RSn(OR’)&lt;sub&gt;3&lt;/sub&gt;所表示的單烷基錫三烷氧化物、或由化學式RSn(NR’&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;所表示的單烷基錫三胺化合物，以及基於錫總含量計，不大於4莫耳%的二烷基錫化合物， 其中R係具有1至31個碳原子的烴基，以及其中R’ 係具有1至10個碳原子的烴基。提供形成純組合物的方法。亦提供一種固體組合物，其包含由RSn-(NR'COR")&lt;sub&gt;3&lt;/sub&gt;所表示的單烷基三醯胺基錫化合物，其中R係具有1至31個碳原子的烴基，以及其中R’ 及R"係各自獨立為具有1至10個碳原子的烴基。該等組合物適合用於形成適用於EUV圖案化的光阻劑組合物，其中該等組合物具有高EUV吸收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pure composition comprises a monoalkyltin trialkoxide compound represented by the chemical formula RSn(OR’)&lt;sub&gt;3&lt;/sub&gt; or a monoalkyl tin triamide compound represented by the chemical formula RSn(NR’&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt; and no more than 4 mole% dialkyltin compounds relative to the total tin amount, where R is a hydrocarbyl group with 1-31 carbon atoms, and wherein R’ is a hydrocarbyl group with 1-10 carbon atoms. Methods are described for the formation of the pure compositions. A solid composition comprises a monoalkyl triamido tin compound represented by the chemical formula RSn-(NR'COR")&lt;sub&gt;3&lt;/sub&gt;, where R is a hydrocarbyl group with 1-31 carbon atoms, and where R’ and R" are independently a hydrocarbyl group with 1-10 carbon atoms. The compositions are suitable for the formation of resist compositions suitable for EUV patterning in which the compositions have a high EUV absorption.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2675" publication-number="202619157">
    <tif-files tif-type="multi-tif">
      <tif file="115102824.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻模組的選擇性遮蔽</chinese-title>
        <english-title>SELECTIVE SHIELDING OF RADIO FREQUENCY MODULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01Q1/22</main-classification>
        <further-classification edition="200601120260130B">H01Q1/52</further-classification>
        <further-classification edition="200601120260130B">H01L23/00</further-classification>
        <further-classification edition="200601120260130B">H01L23/552</further-classification>
        <further-classification edition="200601120260130B">H01L23/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商天工方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　紅孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, HOANG MONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛彼安可　安東尼　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOBIANCO, ANTHONY JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴布科克　喬治　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BABCOCK, GREGORY EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗奈特　戴倫　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRENETTE, DARREN ROGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇瑞　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHOURY, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德古茲　芮妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUEZ, RENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之態樣涉及經選擇性遮蔽之射頻模組。一種射頻模組可包括：一封裝基板；在該封裝基板上方延伸之一射頻遮蔽結構；位於該封裝基板上方且位於該射頻遮蔽結構之一內部中之一射頻組件；及在該射頻遮蔽結構外部位於該封裝基板上之一天線。該遮蔽結構可包括在該射頻組件上方提供一遮蔽物且使得該射頻模組在該天線上方未經遮蔽之一遮蔽層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency shielding structure extending above the package substrate, a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, and an antenna on the package substrate external to the radio frequency shielding structure. The shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:射頻模組</p>
        <p type="p">12:射頻組件</p>
        <p type="p">14:天線</p>
        <p type="p">16:封裝基板</p>
        <p type="p">18:線接合</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2676" publication-number="202618385">
    <tif-files tif-type="multi-tif">
      <tif file="115102989.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">G02B11/34</main-classification>
        <further-classification edition="202101120260131B">G02B7/02</further-classification>
        <further-classification edition="200601120260131B">G02B13/00</further-classification>
        <further-classification edition="200601120260131B">G02B3/00</further-classification>
        <further-classification edition="202301120260131B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董傳博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, CHUANBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, OU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬靜如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學成像鏡頭，從一物側至一像側沿一光軸依序包括一第一透鏡、一第二透鏡、一第三透鏡、一第四透鏡、一第五透鏡、一第六透鏡、一第七透鏡以及一第八透鏡，本發明透過控制透鏡表面的凹凸曲面排列，縮短光學成像鏡頭系統長度、增大光圈、擴大視場角、增加像高且維持良好的成像品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens may include a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, and a eighth lens element positioned in an order from an object side to an image side along an optical axis. Through designing concave and/or convex surface of the lens elements, the optical imaging lens may have improved imaging quality, reduced system length, enlarged aperture stop, broad field of view and increased image height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學成像鏡頭</p>
        <p type="p">STO:光圈</p>
        <p type="p">L1:第一透鏡</p>
        <p type="p">L2:第二透鏡</p>
        <p type="p">L3:第三透鏡</p>
        <p type="p">L4:第四透鏡</p>
        <p type="p">L5:第五透鏡</p>
        <p type="p">L6:第六透鏡</p>
        <p type="p">L7:第七透鏡</p>
        <p type="p">L8:第八透鏡</p>
        <p type="p">TF:濾光片</p>
        <p type="p">IMA:成像面</p>
        <p type="p">L1A1、L2A1、L3A1、L4A1、L5A1、L6A1、L7A1、L8A1、TFA1:物側面</p>
        <p type="p">L1A2、L2A2、L3A2、L4A2、L5A2、L6A2、L7A2、L8A2、TFA2:像側面</p>
        <p type="p">L1A1C、L1A2C、L2A1C、L2A2C、L3A1C、L3A2C、L4A1C、L4A2C、L5A1C、L5A2C、L6A1C、L6A2C、L7A1C、L7A2C、L8A1C、L8A2C:光軸區域</p>
        <p type="p">L1A1P、L1A2P、L2A1P、L2A2P、L3A1P、L3A2P、L4A1P、L4A2P、L5A1P、L5A2P、L6A1P、L6A2P、L7A1P、L7A2P、L8A1P、L8A2P:圓周區域</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2677" publication-number="202619512">
    <tif-files tif-type="multi-tif">
      <tif file="115103045.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202619512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260202B">H10D10/01</main-classification>
        <further-classification edition="202501120260202B">H10D84/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田信彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内海哲章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUMI, TETSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施方式係關於一種電晶體、半導體記憶裝置及電晶體之製造方法。  &lt;br/&gt;實施方式之電晶體具備：半導體層；凸狀之元件區域，其設置於半導體層，於沿著半導體層之面之第1方向上具有特定寬度，且於沿著半導體層之面並與第1方向交叉之第2方向上延伸；閘極電極，其配置於元件區域之上方；及襯層，其覆蓋閘極電極；且於元件區域之第1方向之兩側，元件分離部沿第2方向延伸，且襯層自閘極電極連續地延伸至元件分離部，於元件分離部潛伏於元件分離部之下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">PT:圖案</p>
        <p type="p">PTaa:元件區域圖案</p>
        <p type="p">PTgc:閘極電極圖案</p>
        <p type="p">SB:透明基板</p>
        <p type="p">SBt:轉印面</p>
        <p type="p">TM:模板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2678" publication-number="202618611">
    <tif-files tif-type="multi-tif">
      <tif file="115103108.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103108</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生及全域地調諧應用程式特定之機器學習加速器</chinese-title>
        <english-title>GENERATING AND GLOBALLY TUNING APPLICATION-SPECIFIC MACHINE LEARNING ACCELERATORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G06N3/02</main-classification>
        <further-classification edition="201901120260202B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>努納斯　柯厚　二世　克勞迪諾　荷西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUNES COELHO JUNIOR, CLAUDIONOR JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑟拉　亞齊　歐斯卡利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUUSELA, AKI OSKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述用於全域地調諧及產生ML硬體加速器之包含電腦可讀媒體之方法、系統及設備。一設計系統選擇表示一基線處理器組態之一架構。該系統之一ML成本模型至少藉由模型化該架構如何執行包含多個層之一神經網路之運算來產生關於該架構之效能資料。當該架構實施該神經網路且執行一目標應用之機器學習運算時，基於該效能資料動態地調諧該架構以滿足一效能目標。回應於動態地調諧該架構，該系統產生一ML加速器的一組態，該組態指定用於實施該神經網路之該多個層之各者之客製化硬體組態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and apparatus, including computer-readable media, are described for globally tuning and generating ML hardware accelerators. A design system selects an architecture representing a baseline processor configuration. An ML cost model of the system generates performance data about the architecture at least by modeling how the architecture executes computations of a neural network that includes multiple layers. Based on the performance data, the architecture is dynamically tuned to satisfy a performance objective when the architecture implements the neural network and executes machine-learning computations for a target application. In response to dynamically tuning the architecture, the system generates a configuration of an ML accelerator that specifies customized hardware configurations for implementing each of the multiple layers of the neural network.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:硬體加速器設計系統/系統</p>
        <p type="p">102:輸入目標/輸入物件/應用目標/應用級目標/目標/使用者指定目標</p>
        <p type="p">104:設計空間</p>
        <p type="p">106:架構儲存庫/儲存庫</p>
        <p type="p">108:網路圖模組/圖模組/神經網路圖模組/模組</p>
        <p type="p">110:硬體變數/硬體限制</p>
        <p type="p">112:最佳化及調諧模組/模組</p>
        <p type="p">114:架構感知成本模型/資料模型/成本模型/架構感知分析成本模型</p>
        <p type="p">116:調諧器</p>
        <p type="p">118:排程器/映射器</p>
        <p type="p">120:選用資料路徑</p>
        <p type="p">122:調諧迴路</p>
        <p type="p">130:輸出組態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2679" publication-number="202618949">
    <tif-files tif-type="multi-tif">
      <tif file="115103123.zip" no="1">
      </tif>
    </tif-files>
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>9</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202618949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成微電子總成之方法以及微電子總成</chinese-title>
        <english-title>METHODS OF FORMING A MICROELECTRONIC ASSEMBLY AND MICROELECTRONIC ASSEMBLIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01L21/60</main-classification>
        <further-classification edition="200601120260202B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　桂蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, GUILIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奉燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BONGSUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏佐　賽普里恩　艾米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZOH, CYPRIAN EMEKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥卡雷米　蘿拉　威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRKARIMI, LAURA WILLS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特卡　拉杰詡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATKAR, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">包括製程步驟之代表性技術及裝置可用於降低接合微電子基板歸因於接合界面處之金屬膨脹而脫層之可能性。例如，直通矽穿孔（TSV）可穿過該些微電子基板中之至少一者而安置。該TSV在該基板之該接合界面處經暴露且充當一接觸表面以供直接接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a through-silicon via (TSV) may be disposed through at least one of the microelectronic substrates. The TSV is exposed at the bonding interface of the substrate and functions as a contact surface for direct bonding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:晶粒/堆疊晶粒/第一晶粒</p>
        <p type="p">104:基底基板/基板</p>
        <p type="p">106:絕緣層/介電層</p>
        <p type="p">108:接合表面</p>
        <p type="p">110:導電特徵/接觸襯墊</p>
        <p type="p">112:跡線</p>
        <p type="p">114:直通矽穿孔/TSV</p>
      </representative-img>
    </description>
  </tw-patent-application>
</tw-patent-applications>